WO2023070631A1 - 一种通信芯片、通信模块、通信系统和基站 - Google Patents

一种通信芯片、通信模块、通信系统和基站 Download PDF

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Publication number
WO2023070631A1
WO2023070631A1 PCT/CN2021/127779 CN2021127779W WO2023070631A1 WO 2023070631 A1 WO2023070631 A1 WO 2023070631A1 CN 2021127779 W CN2021127779 W CN 2021127779W WO 2023070631 A1 WO2023070631 A1 WO 2023070631A1
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WIPO (PCT)
Prior art keywords
interface
switch
module
signal
communication
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PCT/CN2021/127779
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English (en)
French (fr)
Inventor
丁文其
周骞
唐海正
崔昌云
梁乐
郑文泉
周小敏
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上海华为技术有限公司
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Priority to PCT/CN2021/127779 priority Critical patent/WO2023070631A1/zh
Priority to CN202180103540.0A priority patent/CN118202577A/zh
Publication of WO2023070631A1 publication Critical patent/WO2023070631A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/06—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station

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  • the embodiments of the present application relate to the communication field, and in particular, to a communication chip, a communication module, a communication system, and a base station.
  • the current 5th generation mobile communication technology (5G) millimeter-wave base station has a coverage bottleneck. How to increase the output power of the base station is an urgent need for the current high-frequency millimeter-wave system.
  • the AIP in the millimeter-wave system can be implemented using a beamforming chip (beamforming IC, BFIC), where An effective way to increase the equivalent isotropically radiated power (EIRP) is to increase the antenna array.
  • EIRP equivalent isotropically radiated power
  • Embodiments of the present application provide a communication chip, a communication module, a communication system, and a base station, which are used to obtain benefits brought about by the expansion of antenna arrays at low cost.
  • the first aspect of the present application provides a communication chip, including a mixer, a power dividing module, and a switch module, wherein the mixer is connected to the first interface, and the mixer is used to receive the first input signal or the second input signal received by the first interface.
  • the first output signal to be sent by an interface is subjected to frequency conversion processing;
  • the power dividing module is connected to the second interface, and the power dividing module is used to combine the second input signal received by the second interface or to process the first output signal to be sent by the second interface.
  • the switch module is connected to the third interface, the third interface is used to receive the third input signal or send the third output signal, and the switch module is used to control the second interface to pass through the power division module and the third interface path , or communicate with the first interface through the power dividing module and the mixer.
  • the mixer in this application is also called an up-down conversion chip, which can be an active or passive mixer structure, used for frequency shifting of signals, and supports 2/3/4 or N frequency backup functions.
  • the power splitting module can be an active power splitting network, including active power splitting functions with 2 equal splits and the number of power splitting paths N greater than 2.
  • the first interface, the second interface and the third interface may be pins.
  • the communication chip includes a mixer, a power division module and a switch module, wherein the mixer is connected to the first interface, the power division module is connected to the second interface, the switch module is connected to the third interface, and the switch module is connected to the second interface.
  • the communication chip can be used as a driver chip, or through the power dividing module and the mixer and the first interface, so that the communication chip can be used as a frequency mixing chip , that is, the communication chip can be compatible with the functions of the mixer chip and the driver chip, and can be used as the mixer chip and the driver chip in series at the same time to reduce the loss of the power divider, so as to obtain the benefits brought by the expansion of the antenna array at low cost.
  • the communication chip further includes a first signal switch and a second signal switch, the first signal switch is set between the mixer and the first interface, and the second signal switch is set between Between the mixer and the switch module, the first signal switch and the second signal switch are used to determine whether the first interface receives the first input signal or sends the first output signal.
  • a signal switch is set to determine whether the communication chip receives or sends a signal, which improves the feasibility of the solution.
  • the communication chip further includes a first amplifier, the first amplifier is arranged between the first signal switch and the first interface, and the first amplifier is used to amplify the first input signal or the second an output signal.
  • an amplifier is set in the communication chip to amplify the signal, which reduces signal loss.
  • the communication chip further includes a third signal switch, the third signal switch is arranged between the third interface and the switch module, and the third signal switch is used to determine that the third interface receives the first Three input signals or send a third output signal.
  • a signal switch is set to determine whether the communication chip receives or sends a signal, which improves the feasibility of the solution.
  • the communication chip further includes a fourth signal switch, the fourth signal switch is arranged between the second interface and the power dividing module, and the fourth signal switch is used to determine whether the second interface receives a second input signal or send a second output signal.
  • a signal switch is set to determine whether the communication chip receives or sends a signal, which improves the feasibility of the solution.
  • the communication chip further includes a second amplifier, the second amplifier is arranged between the fourth signal switch and the power dividing module, and the second amplifier is used to amplify the second input signal or the second Two output signals.
  • the communication chip further includes a third amplifier, which is arranged between the power dividing module and the switch module, and the third amplifier is used to amplify the first input signal, the first output signal, the second The second input signal, the second output signal, the third input signal or the third output signal.
  • an amplifier is set in the communication chip to amplify the signal, which reduces signal loss.
  • the communication chip further includes an attenuator disposed adjacent to the first amplifier, the second amplifier, or the third amplifier.
  • an attenuator is provided in the communication chip, which can adjust the magnitude of the signal in the circuit and improve impedance matching.
  • the switch module includes a first channel switch and a second channel switch, and the first channel switch and the second channel switch are used to control the passage between the second interface and the third interface through the power dividing module , or communicate with the first interface through the power dividing module and the mixer.
  • the function of the communication chip is specifically determined by setting the first channel switch and the second channel switch, which improves the feasibility of the solution.
  • the switch module or the third signal switch is a power divider.
  • the power divider can be used to realize the function of the switch module or the third signal switch, which improves the feasibility of the solution.
  • the second aspect of the present application provides a communication module, which includes at least two communication chips in the above-mentioned first aspect or any possible implementation of the first aspect, wherein the switch modules of the at least two communication chips control The paths of the second interface are different.
  • a filter is arranged between at least two communication chips.
  • a filter is set between the two communication chips, which can effectively filter out a frequency point of a specific frequency in the circuit or frequencies other than the frequency point to obtain a signal of a specific frequency.
  • the third aspect of the present application provides a communication system, which includes sequentially connected digital processing units, the communication module in the second aspect or any possible implementation of the second aspect, a multiplexer, a beamforming shaped chips and antenna arrays.
  • a filter is disposed between the communication module and the beamforming chip.
  • a filter is set between the communication module and the beamforming chip, which can effectively filter out a frequency point of a specific frequency in the circuit or frequencies other than the frequency point to obtain a signal of a specific frequency.
  • the communication system is an active antenna processing unit.
  • the communication system can be used as an active antenna processing unit, which improves the feasibility of the solution.
  • a fourth aspect of the present application provides a base station, where the base station includes the communication system in the foregoing third aspect or any possible implementation manner of the third aspect.
  • the communication chip includes a mixer, a power division module, and a switch module, wherein the mixer is connected to the first interface, the power division module is connected to the second interface, the switch module is connected to the third interface, and the switch module It is used to control the passage between the second interface and the third interface through the power division module, so that the communication chip can be used as a driver chip, or through the power division module and the mixer to communicate with the first interface, so that the communication chip can be used as a frequency mixing chip Use, that is, the communication chip is compatible with the functions of the mixer chip and the driver chip, and can be used as the mixer chip and the driver chip in series at the same time to reduce the loss of the power divider, so as to obtain the benefits brought by the expansion of the antenna array at low cost .
  • FIG. 1 is a schematic diagram of a frame of a base station
  • FIG. 2 is a schematic diagram of an embodiment of a communication chip provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of another embodiment of the communication chip provided by the embodiment of the present application.
  • FIG. 4 is a schematic diagram of another embodiment of the communication chip provided by the embodiment of the present application.
  • FIG. 5 is a schematic diagram of another embodiment of the communication chip provided by the embodiment of the present application.
  • FIG. 6 is a schematic diagram of an embodiment of a communication module provided in an embodiment of the present application.
  • FIG. 7 is a schematic diagram of an embodiment of a communication system provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of an embodiment of a base station provided in an embodiment of the present application.
  • Embodiments of the present application provide a communication chip, a communication module, a communication system, and a base station, which are used to obtain benefits brought about by the expansion of antenna arrays at low cost. Each will be described in detail below.
  • the base station 100 may include a baseband processing unit 101, an active antenna unit (active antenna unit, AAU) 102 and an antenna 103, and the baseband processing unit 101 usually uses an indoor baseband processing unit (building base band unite , BBU), the active antenna processing unit 102 is composed of a radio frequency unit and an antenna coupling.
  • a frequency mixing chip up-down convert, UDC
  • a driver chip drive IC, DRV
  • the communication chip 200 in the embodiment of the present application will be described below in conjunction with the above description of the base station. Please refer to FIG.
  • the mixer 201 is connected to the first interface 204, and the mixer 201 is used to perform frequency conversion processing on the first input signal received by the first interface 204 or the first output signal that the first interface 204 needs to send; the power dividing module 202 Connected with the second interface 205, the power dividing module 202 is used for combining the second input signal received by the second interface 205 or performing power dividing processing on the second output signal that the second interface 205 needs to send; the switch module 203 and The third interface 206 is connected, the third interface 206 is used to receive the third input signal or send the third output signal, the switch module 203 is used to control the second interface 205 to pass through the power dividing module
  • the module 202 and the mixer 201 communicate with the first interface 204 .
  • the mixer 201 is also called an up-down conversion chip, which may be an active or passive mixer structure, and is used for frequency shifting of signals, and supports 2/3/4 or N frequency backup functions.
  • the power dividing module 202 may be an active power dividing network, including an active power dividing function with 2 equal divisions and the number N of power dividing paths being greater than 2.
  • the first interface 204, the second interface 205, and the third interface 206 may be pins.
  • the communication chip 200 can be used as a frequency mixing chip or a driver chip, which will be described respectively below:
  • the communication chip 200 is used as a frequency mixing chip:
  • the switch module 203 controls the second interface 205 to communicate with the first interface 204 through the power dividing module 202 and the mixer 201, that is, the first interface 204, the mixer 201, the switch module 203, the power dividing module
  • the module 202 and the second interface 205 are connected, and the switch module 203 and the third interface 206 are disconnected.
  • the mixer 201 When the first interface 204 receives the first input signal, the mixer 201 performs frequency conversion processing on the first input signal received by the first interface 204. Specifically, the frequency of the intermediate frequency signal can be up-converted to microwave frequency to obtain the first input signal to be sent by the second interface 205.
  • the power division module 202 For the second output signal, the power division module 202 performs power division processing on the second output signal, and outputs it through the second interface 205, thereby realizing the function of the frequency mixing chip in the AAU when the base station transmits a signal.
  • the second input signal is input to the power splitter through the second interface 205, and the power splitter performs combination processing on the second input signal to obtain the first output signal that the first interface 204 needs to send.
  • the mixer 201 performs frequency conversion processing on the first output signal, specifically, the microwave signal can be down-converted to an intermediate frequency signal, and output through the first interface 204, thereby realizing the frequency mixing in the AAU when the base station receives the signal chip function.
  • the communication chip 200 is used as a driver chip:
  • the switch module 203 controls the second interface 205 to pass through the power dividing module 202 and the third interface 206, that is, the third interface 206, the switch module 203, the power dividing module 202 and the second interface 205 are connected to each other. path, the switch module 203 is disconnected from the mixer 201 and the first interface 204 .
  • the third interface 206 receives the third input signal, and then performs power division processing on the third input signal through the power dividing module 202 to obtain the second input signal, and transmits the second input signal through the second interface 205 Output, so that the driving function in the AAU can be realized when the base station sends a signal.
  • the power dividing module 202 When the second interface 205 receives the second input signal, the power dividing module 202 performs combination processing on the second input signal to obtain the third output signal that the third interface 206 needs to send, and then outputs it through the third interface 206, thus realizing Driver function in AAU when base station receives signal.
  • the communication chip includes a mixer, a power division module, and a switch module, wherein the mixer is connected to the first interface, the power division module is connected to the second interface, the switch module is connected to the third interface, and the switch module It is used to control the passage between the second interface and the third interface through the power division module, so that the communication chip can be used as a driver chip, or through the power division module and the mixer to communicate with the first interface, so that the communication chip can be used as a frequency mixing chip Use, that is, the communication chip is compatible with the functions of the mixer chip and the driver chip, and can be used as the mixer chip and the driver chip in series at the same time to reduce the loss of the power divider, so as to obtain the benefits brought by the expansion of the antenna array at low cost .
  • another embodiment of the communication chip in the embodiment of the present application includes a mixer 301, a power dividing module 302, a switch module 303, a first interface 304, a second interface 305, a third interface 306, and a first signal switch 307 , a second signal switch 308 , a first amplifier 309 , a third signal switch 310 , a fourth signal switch 311 , a second amplifier 312 , a third amplifier 313 , and an attenuator 314 .
  • the first signal switch 307 is arranged between the mixer 301 and the first interface 304
  • the second signal switch 308 is arranged between the mixer 301 and the switch module 303
  • the first signal switch 307 and the second signal switch 308 It is used to determine that the first interface 304 receives the first input signal or sends the first output signal.
  • the first amplifier 309 is disposed between the first signal switch 307 and the first interface 304, and the first amplifier 309 is used to amplify the first input signal or the first output signal.
  • the third signal switch 310 is disposed between the third interface 306 and the switch module 303, and the third signal switch 310 is used to determine whether the third interface 306 receives a third input signal or sends a third output signal.
  • the fourth signal switch 311 is disposed between the second interface 305 and the power dividing module 302, and the fourth signal switch 311 is used to determine whether the second interface 305 receives the second input signal or sends the second output signal.
  • the second amplifier 312 is arranged between the fourth signal switch 311 and the power dividing module 302, and the second amplifier 312 is used for amplifying the second input signal or the second output signal.
  • the third amplifier 313 is arranged between the power dividing module 302 and the switch module 303, and the third amplifier 313 is used to amplify the first input signal, the first output signal, the second input signal, the second output signal, the third input signal or the first Three output signals.
  • the attenuator 314 is arranged adjacent to the first amplifier 309 , the second amplifier 312 or the third amplifier 313 .
  • the switch module 303 includes a first channel switch 3031 and a second channel switch 3032, and the first channel switch 3031 and the second channel switch 3032 are used to control the passage between the second interface 305 and the third interface 306 through the power dividing module 302, or It communicates with the first interface 304 through the power dividing module 302 and the mixer 301 .
  • the first amplifier 309 and the third amplifier 313 can be typical amplifiers
  • the attenuator 314 is an adjustable attenuator structure, specifically can be a digital step attenuator (digital step attenuator, DSA)
  • the second amplifier 312 includes a power amplifier and a low noise amplifier.
  • the communication chip may also include a local oscillator network input pin 315 .
  • the communication chip may also be provided with a plurality of amplifiers and attenuators 314, which have the same function, which is not limited in this embodiment of the present application.
  • the communication chip can be used as a frequency mixing chip or a driver chip, which are described below:
  • the communication chip is used as a frequency mixing chip:
  • the switch module 303 controls the second interface 305 to communicate with the first interface 304 through the power dividing module 302 and the mixer 301, the first channel switch 3031 is turned off, and the second channel switch 3032 is closed, that is, the second channel switch 3032 is closed.
  • There is a path between the first interface 304 , the mixer 301 , the switch module 303 , the power dividing module 302 and the second interface 305 , and the switch module 303 and the third interface 306 are disconnected.
  • the mixer 301 Perform frequency conversion processing on the amplified first input signal.
  • the intermediate frequency signal can be up-converted to microwave frequency to obtain the second output signal to be sent by the second interface 305.
  • the power division module 302 performs power division processing on the second output signal, and outputs it through the second interface 305 after being amplified by the second amplifier 312.
  • the second amplifier 312 can be a power amplifier, so that the power in the AAU when the base station transmits a signal can be realized. Mixer chip function.
  • the first signal switch 307, the second signal switch 308, and the fourth signal switch 311 are all downward paths, and after the second input signal is input through the second interface 305, it passes through the second The second amplifier 312, the attenuator 314 and the third amplifier 313 are then input to the power divider.
  • the second amplifier 312 can be a low noise amplifier, and the power divider performs combination processing on the second input signal to obtain the first interface 304 to send The first output signal of the first output signal, and then the mixer 301 performs frequency conversion processing on the first output signal.
  • the microwave signal can be down-converted to an intermediate frequency signal, and then output through the first interface 304 after passing through the first amplifier 309, thereby realizing the base station The function of the mixer chip in the AAU when receiving the signal.
  • the communication chip is used as a driver chip:
  • the switch module 303 controls the second interface 305 to communicate with the third interface 306 through the power dividing module 302, the first channel switch 3031 is closed, and the second channel switch 3032 is disconnected, that is, the third interface 306, the switch There is a path between the module 303 , the power dividing module 302 and the second interface 305 , and the switch module 303 is disconnected from the mixer 301 and the first interface 304 .
  • the second signal switch 308, the third signal switch 310 and the fourth signal switch 311 are all upward paths, and the third interface 306 receives the third input signal, passes through the attenuator 314 and After the third amplifier 313, the power division module 302 performs power division processing on the third input signal to obtain the second input signal, which is amplified by the second amplifier 312 and then output through the second interface 305, so that the AAU in the base station can be realized when the signal is sent. drive function.
  • the second interface 305 When the second interface 305 receives the second input signal, the second signal switch 308, the third signal switch 310 and the fourth signal switch 311 are all downward paths, and after the second input signal is amplified by the second amplifier 312, the power dividing module 302 performs combined processing on the second input signal to obtain the third output signal to be sent by the third interface 306, and the third output signal passes through the attenuator 314 and the third amplifier 313 and then is output through the third interface 306, thereby enabling the base station to receive Driver function in AAU at signal time.
  • the switch module or the third signal switch can be implemented with a power divider, as shown in Figure 4, in another embodiment of the communication chip provided in the embodiment of the present application, the power divider can realize the functions and effects of the switch module 303 , as shown in FIG. 5 , in another embodiment of the communication chip provided by the embodiment of the present application, the power divider can realize the functions and effects of the third signal switch 310 .
  • an embodiment of the communication module 600 provided by the embodiment of the present application includes at least two communication chips in the above-mentioned embodiments, such as a first communication chip 601 and a second communication chip 602, wherein at least two communication chips
  • the path of the second interface controlled by the switch module is different, that is, one first communication chip 601 is used as a frequency mixing chip, and the other second communication chip 602 is used as a driver chip.
  • more communication chips can be set as a frequency mixing chip. chips or driver chips.
  • a filter 603 is provided between at least two communication chips, that is, a filter may be provided between the frequency mixing chip and the driver chip.
  • an embodiment of a communication system 700 provided by an embodiment of the present application includes a digital processing unit 701 connected in sequence, a communication module 702 in the above embodiment, a multiplexer 703, a beamforming chip 704 and an antenna Array 705 .
  • the communication system 700 is an active antenna processing unit.
  • the communication module 702 includes a first communication chip 7021 and a second communication chip 7022, a filter 7023 is arranged between the first communication chip 7021 and the second communication chip 7022, and the first communication chip 7021 is specifically composed of
  • the second communication chip 7022 is composed of two communication chips in the above-mentioned embodiments, and the two antenna modules are both used as a driver chip.
  • a filter may also be provided between the communication module 702 and the beamforming chip 704 .
  • the digital processing unit 701 may specifically be an ADDA digital processing unit
  • the beamforming chip 704 may specifically be a beamforming chip (beamforming IC, BFIC) used for millimeter waves.
  • the communication chip in the communication module is compatible with frequency conversion and driving functions, which can solve the problem of increased passive power division loss caused by the expansion of the array of the current millimeter wave system, and reduce the design complexity of the current millimeter wave system , the millimeter-wave system designed by using this communication chip can simplify the system-level board-level design, the granularity is small, and no additional local oscillator network is required.
  • an embodiment of a base station 800 provided in an embodiment of the present application includes a baseband processing unit 801 and a communication system 802 in the foregoing embodiments.
  • modules, systems, chips, etc. can be implemented in other ways.
  • the module embodiments described above are only illustrative.
  • the division of the modules is only a logical function division. There may be other division methods in actual implementation, for example, multiple modules or interfaces can be combined or May be integrated into another system, or some features may be ignored, or not implemented.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of modules or systems may be in electrical, mechanical or other forms.
  • the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple system modules. Part or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

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Abstract

本申请实施例公开了一种通信芯片、通信模块、通信系统和基站，该通信芯片具体包括混频器、功分模块和开关模块，其中，混频器与第一接口连接，混频器用于对第一接口接收的第一输入信号或第一接口需要发送的第一输出信号进行变频处理；功分模块与第二接口连接，功分模块用于对第二接口接收的第二输入信号进行合路处理或对第二接口需要发送的第二输出信号进行功分处理；开关模块与第三接口连接，第三接口用于接收第三输入信号或发送第三输出信号，开关模块用于控制第二接口通过功分模块与第三接口通路，或通过功分模块和混频器与第一接口通路，使得该通信芯片可以作为驱动芯片或混频芯片同时串联使用，从而实现低成本减小功分器的损耗。

Description

一种通信芯片、通信模块、通信系统和基站 技术领域
本申请实施例涉及通信领域，尤其涉及一种通信芯片、通信模块、通信系统和基站。
背景技术
当前第五代移动通信技术(5th generation mobile communication technology，5G)毫米波基站存在覆盖瓶颈，如何提高基站输出功率是当前高频毫米波系统的迫切需求。
而在毫米波模拟波束赋形(analog beamforming，ABF)以及集成在板天线(antena in PCB，AIP)系统中，毫米波系统中的AIP可以使用波束赋型芯片(beamforming IC,BFIC)实现,其中提升等效全向辐射功率(equivalent isotropically radiated power，EIRP)的有效方式是增大天线阵面。随着天线阵面的增大，意味着前端的BFIC芯片的增多，为了使得BFIC芯片内功放(power amplifier，PA)功率的输出功率保持一定以完全获取阵面扩大带来的收益，则其与混频芯片(up-down convert，UDC)间的无源功分带来的损耗将不断提高，UDC输出功率将随着功分器的损耗变大而变大，导致的直接后果是其线性受限，系统功率需要回退，无法获取天线阵面扩大带来的收益。在UDC与BFIC之间加入一颗驱动芯片(drive IC，DRV)可以解决上述问题，DRV可以减小功分器的损耗。
但是目前的UDC两端的频率不相等，无法直接串联使用，导致其不具备自身级联能力，DRV需要根据不同的UDC来重新定制，定制成本较高，从而使得获取天线阵面扩大带来的收益成为困难。
发明内容
本申请实施例提供一种通信芯片、通信模块、通信系统和基站，用于低成本获取天线阵面扩大带来的收益。
本申请第一方面提供一种通信芯片，包括混频器、功分模块和开关模块，其中，混频器与第一接口连接，混频器用于对第一接口接收的第一输入信号或第一接口需要发送的第一输出信号进行变频处理；功分模块与第二接口连接，功分模块用于对第二接口接收的第二输入信号进行合路处理或对第二接口需要发送的第二输出信号进行功分处理；开关模块与第三接口连接，第三接口用于接收第三输入信号或发送第三输出信号，开关模块用于控制第二接口通过功分模块与第三接口通路，或通过功分模块和混频器与第一接口通路。
本申请中的混频器又称上下变频芯片，可以是有源或无源混频器结构，用于对信号进行频率搬移，支持2/3/4或N备频功能。功分模块具体可以为有源功分网络，包括2等分及功分路数N大于2的有源功分功能。第一接口、第二接口和第三接口具体可以为管脚。
该第一方面，通信芯片包括混频器、功分模块和开关模块，其中，混频器与第一接口连接，功分模块与第二接口连接，开关模块与第三接口连接，开关模块用于控制第二接口通过功分模块与第三接口通路，使得该通信芯片可以作为驱动芯片使用，或通过功分模块和混频器与第一接口通路，使得该通信芯片可以作为混频芯片使用，即该通信芯片可以兼容混频芯片和驱动芯片的功能，可以分别作为混频芯片和驱动芯片同时串联使用来减小功分器的损耗，从而低成本获取天线阵面扩大带来的收益。
在第一方面的一种可能的实现方式中，该通信芯片还包括第一信号开关和第二信号开关，第一信号开关设置在混频器与第一接口之间，第二信号开关设置在混频器与开关模块之间，第一信号开关和第二信号开关用于确定第一接口接收第一输入信号或发送第一输出信号。
该种可能的实现方式中，通过设置信号开关来确定通信芯片接收或发送信号，提升了方案的可实现性。
在第一方面的一种可能的实现方式中，该通信芯片还包括第一放大器，第一放大器设置在第一信号开关与第一接口之间，第一放大器用于放大第一输入信号或第一输出信号。
该种可能的实现方式中，在通信芯片中设置放大器来放大信号，减小了信号损耗。
在第一方面的一种可能的实现方式中，该通信芯片还包括第三信号开关，第三信号开关设置在第三接口与开关模块之间，第三信号开关用于确定第三接口接收第三输入信号或发送第三输出信号。
该种可能的实现方式中，通过设置信号开关来确定通信芯片接收或发送信号，提升了方案的可实现性。
在第一方面的一种可能的实现方式中，该通信芯片还包括第四信号开关，第四信号开关设置在第二接口与功分模块之间，第四信号开关用于确定第二接口接收第二输入信号或发送第二输出信号。
该种可能的实现方式中，通过设置信号开关来确定通信芯片接收或发送信号，提升了方案的可实现性。
在第一方面的一种可能的实现方式中，该通信芯片还包括第二放大器，第二放大器设置在第四信号开关与功分模块之间，第二放大器用于放大第二输入信号或第二输出信号。
该种可能的实现方式中，
在第一方面的一种可能的实现方式中，该通信芯片还包括第三放大器，设置在功分模块和开关模块之间，第三放大器用于放大第一输入信号、第一输出信号、第二输入信号、第二输出信号、第三输入信号或第三输出信号。
该种可能的实现方式中，在通信芯片中设置放大器来放大信号，减小了信号损耗。
在第一方面的一种可能的实现方式中，该通信芯片还包括衰减器，与第一放大器、第二放大器或第三放大器相邻设置。
该种可能的实现方式中，在通信芯片中设置衰减器，可以调整电路中信号的大小，并改善阻抗匹配。
在第一方面的一种可能的实现方式中，开关模块包括第一通道开关和第二通道开关，第一通道开关和第二通道开关用于控制第二接口通过功分模块与第三接口通路，或通过功分模块和混频器与第一接口通路。
该种可能的实现方式中，通过设置第一通道开关和第二通道开关来具体确定该通信芯片的作用，提升了方案的可实现性。
在第一方面的一种可能的实现方式中，开关模块或第三信号开关为功分器。
该种可能的实现方式中，可以用功分器来实现开关模块或第三信号开关的功能，提升 了方案的可实现性。
本申请第二方面提供了一种通信模块，该通信模块包括至少两个上述第一方面或第一方面的任意可能的实现方式中的通信芯片，其中，至少两个通信芯片的开关模块控制的第二接口的通路不相同。
在第二方面的一种可能的实现方式中，至少两个通信芯片之间设置有滤波器。
该种可能的实现方式中，在两个通信芯片之间设置滤波器，可以对电路中特定频率的频点或该频点以外的频率进行有效滤除，得到一个特定频率的信号。
本申请第三方面提供了一种通信系统，该通信系统包括依次连接的数字处理单元、上述第二方面或第二方面的任意可能的实现方式中的通信模块、多路功分器、波束赋形芯片和天线阵列。
在第三方面的一种可能的实现方式中，通信模块和波束赋形芯片之间设置有滤波器。
该种可能的实现方式中，在通信模块和波束赋形芯片之间设置滤波器，可以对电路中特定频率的频点或该频点以外的频率进行有效滤除，得到一个特定频率的信号。
在第三方面的一种可能的实现方式中，通信系统为有源天线处理单元。
该种可能的实现方式中，该通信系统可以作为有源天线处理单元使用，提升了方案的可实现性。
本申请第四方面提供了一种基站，该基站包括上述第三方面或第三方面的任意可能的实现方式中的通信系统。
本申请实施例中，通信芯片包括混频器、功分模块和开关模块，其中，混频器与第一接口连接，功分模块与第二接口连接，开关模块与第三接口连接，开关模块用于控制第二接口通过功分模块与第三接口通路，使得该通信芯片可以作为驱动芯片使用，或通过功分模块和混频器与第一接口通路，使得该通信芯片可以作为混频芯片使用，即该通信芯片可以兼容混频芯片和驱动芯片的功能，可以分别作为混频芯片和驱动芯片同时串联使用来减小功分器的损耗，从而低成本获取天线阵面扩大带来的收益。
附图说明
图1为基站的框架示意图；
图2为本申请实施例提供的通信芯片的一实施例示意图；
图3为本申请实施例提供的通信芯片的另一实施例示意图；
图4为本申请实施例提供的通信芯片的另一实施例示意图；
图5为本申请实施例提供的通信芯片的另一实施例示意图；
图6为本申请实施例提供的通信模块的一实施例示意图；
图7为本申请实施例提供的通信系统的一实施例示意图；
图8为本申请实施例提供的基站的一实施例示意图。
具体实施方式
下面结合附图，对本申请的实施例进行描述，显然，所描述的实施例仅仅是本申请一部分的实施例，而不是全部的实施例。本领域普通技术人员可知，随着技术的发展和新场景的出现，本申请实施例提供的技术方案对于类似的技术问题，同样适用。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的实施例能够以除了在这里图示或描述的内容以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
本申请实施例提供一种通信芯片、通信模块、通信系统和基站，用于低成本获取天线阵面扩大带来的收益。以下分别进行详细说明。
在移动通信系统中，例如在第五代移动通信技术(5th generation mobile communication technology，5G)的移动通信系统中，通常由基站和用户设备组成。在基站侧，请参阅图1，基站100可以包括基带处理单元101、有源天线处理单元(active antenna unit，AAU)102和天线103，基带处理单元101通常使用室内基带处理单元(building base band unite，BBU)，有源天线处理单元102为射频单元和天线耦合组成的。其中，在有源天线处理单元102里可以设置混频芯片(up-down convert，UDC)和驱动芯片(drive IC，DRV)。
下面结合上述对基站的描述本申请实施例中的通信芯片200进行描述，请参阅图2，本申请实施例中通信芯片200一个实施例包括混频器201、功分模块202和开关模块203。
其中，混频器201与第一接口204连接，混频器201用于对第一接口204接收的第一输入信号或第一接口204需要发送的第一输出信号进行变频处理；功分模块202与第二接口205连接，功分模块202用于对第二接口205接收的第二输入信号进行合路处理或对第二接口205需要发送的第二输出信号进行功分处理；开关模块203与第三接口206连接，第三接口206用于接收第三输入信号或发送第三输出信号，开关模块203用于控制第二接口205通过功分模块202与第三接口206通路，或通过功分模块202和混频器201与第一接口204通路。
具体的，混频器201又称上下变频芯片，可以是有源或无源混频器结构，用于对信号进行频率搬移，支持2/3/4或N备频功能。功分模块202具体可以为有源功分网络，包括2等分及功分路数N大于2的有源功分功能。第一接口204、第二接口205和第三接口206具体可以为管脚。
该通信芯片200可以作为混频芯片或驱动芯片使用，以下分别进行说明：
一、该通信芯片200作为混频芯片使用：
此时该通信芯片200中，开关模块203控制第二接口205通过功分模块202和混频器201与第一接口204通路，即第一接口204、混频器201、开关模块203、功分模块202和第二接口205之间为通路，开关模块203与第三接口206为断路。
当第一接口204接收第一输入信号时，混频器201对第一接口204接收的第一输入信号进行变频处理，具体可以使中频信号向上变频至微波频率得到第二接口205需要发送的第二输出信号，功分模块202对第二输出信号进行功分处理，并通过第二接口205输出， 由此可以实现基站发射信号时AAU中的混频芯片功能。
当第一接口204需要发送第一输出信号时，第二输入信号通过第二接口205输入至功分器，功分器对第二输入信号进行合路处理得到第一接口204需要发送的第一输出信号，然后混频器201对第一输出信号进行变频处理，具体可以使微波信号向下变频至中频信号，并通过第一接口204输出，由此可以实现基站接收信号时AAU中的混频芯片功能。
二、该通信芯片200作为驱动芯片使用：
此时该通信芯片200中，开关模块203控制第二接口205通过功分模块202与第三接口206通路，即第三接口206、开关模块203、功分模块202和第二接口205之间为通路，开关模块203与混频器201和第一接口204为断路。
当第二接口205需要发送第二输入信号时，第三接口206接收第三输入信号，然后通过功分模块202对第三输入信号进行功分处理得到第二输入信号，并通过第二接口205输出，由此可以实现基站发送信号时AAU中的驱动功能。
当第二接口205接收第二输入信号时，功分模块202对第二输入信号进行合路处理得到第三接口206需要发送的第三输出信号，然后通过第三接口206输出，由此可以实现基站接收信号时AAU中的驱动功能。
本申请实施例中，通信芯片包括混频器、功分模块和开关模块，其中，混频器与第一接口连接，功分模块与第二接口连接，开关模块与第三接口连接，开关模块用于控制第二接口通过功分模块与第三接口通路，使得该通信芯片可以作为驱动芯片使用，或通过功分模块和混频器与第一接口通路，使得该通信芯片可以作为混频芯片使用，即该通信芯片可以兼容混频芯片和驱动芯片的功能，可以分别作为混频芯片和驱动芯片同时串联使用来减小功分器的损耗，从而低成本获取天线阵面扩大带来的收益。
请参阅图3，本申请实施例中通信芯片另一个实施例包括混频器301、功分模块302、开关模块303、第一接口304、第二接口305、第三接口306、第一信号开关307、第二信号开关308、第一放大器309、第三信号开关310、第四信号开关311、第二放大器312、第三放大器313、衰减器314。
其中，第一信号开关307设置在混频器301与第一接口304之间，第二信号开关308设置在混频器301与开关模块303之间，第一信号开关307和第二信号开关308用于确定第一接口304接收第一输入信号或发送第一输出信号。第一放大器309设置在第一信号开关307与第一接口304之间，第一放大器309用于放大第一输入信号或第一输出信号。第三信号开关310设置在第三接口306与开关模块303之间，第三信号开关310用于确定第三接口306接收第三输入信号或发送第三输出信号。第四信号开关311设置在第二接口305与功分模块302之间，第四信号开关311用于确定第二接口305接收第二输入信号或发送第二输出信号。第二放大器312设置在第四信号开关311与功分模块302之间，第二放大器312用于放大第二输入信号或第二输出信号。第三放大器313设置在功分模块302和开关模块303之间，第三放大器313用于放大第一输入信号、第一输出信号、第二输入信号、第二输出信号、第三输入信号或第三输出信号。衰减器314与第一放大器309、第二放大器312或第三放大器313相邻设置。
具体的，开关模块303包括第一通道开关3031和第二通道开关3032，第一通道开关3031和第二通道开关3032用于控制第二接口305通过功分模块302与第三接口306通路，或通过功分模块302和混频器301与第一接口304通路。第一放大器309和第三放大器313可以为典型放大器，衰减器314为可调衰减器结构，具体可以为数字步进衰减器(digital step attenuator，DSA)，第二放大器312包括功率放大器和低噪声放大器。该通信芯片还可以包括本振网络输入管脚315。该通信芯片还可以在设置多个放大器和衰减器314，其功能相同，本申请实施例对此不作限制。
该通信芯片可以作为混频芯片或驱动芯片使用，以下分别进行说明：
一、该通信芯片作为混频芯片使用：
此时该通信芯片中，开关模块303控制第二接口305通过功分模块302和混频器301与第一接口304通路，第一通道开关3031为断开，第二通道开关3032闭合，即第一接口304、混频器301、开关模块303、功分模块302和第二接口305之间为通路，开关模块303与第三接口306为断路。
当第一接口304接收第一输入信号时，第一信号开关307、第二信号开关308和第四信号开关311都为向上通路，第一输入信号经过第一放大器309放大后，混频器301对放大后的第一输入信号进行变频处理，具体可以使中频信号向上变频至微波频率得到第二接口305需要发送的第二输出信号，第二输出信号经过衰减器314和第三放大器313后，功分模块302对第二输出信号进行功分处理，经过第二放大器312放大后通过第二接口305输出，此时第二放大器312可以为功率放大器，由此可以实现基站发射信号时AAU中的混频芯片功能。
当第一接口304需要发送第一输出信号时，第一信号开关307、第二信号开关308和第四信号开关311都为向下通路，第二输入信号通过第二接口305输入后，经过第二放大器312、衰减器314和第三放大器313后输入至功分器，此时第二放大器312可以为低噪声放大器，功分器对第二输入信号进行合路处理得到第一接口304需要发送的第一输出信号，然后混频器301对第一输出信号进行变频处理，具体可以使微波信号向下变频至中频信号，经过第一放大器309后通过第一接口304输出，由此可以实现基站接收信号时AAU中的混频芯片功能。
二、该通信芯片作为驱动芯片使用：
此时该通信芯片中，开关模块303控制第二接口305通过功分模块302与第三接口306通路，第一通道开关3031为闭合，第二通道开关3032断开，即第三接口306、开关模块303、功分模块302和第二接口305之间为通路，开关模块303与混频器301和第一接口304为断路。
当第二接口305需要发送第二输入信号时，第二信号开关308、第三信号开关310和第四信号开关311都为向上通路，第三接口306接收第三输入信号，经过衰减器314和第三放大器313后，通过功分模块302对第三输入信号进行功分处理得到第二输入信号，经过第二放大器312放大后通过第二接口305输出，由此可以实现基站发送信号时AAU中的驱动功能。
当第二接口305接收第二输入信号时，第二信号开关308、第三信号开关310和第四信号开关311都为向下通路，第二输入信号经过第二放大器312放大后，功分模块302对第二输入信号进行合路处理得到第三接口306需要发送的第三输出信号，第三输出信号经过衰减器314和第三放大器313后通过第三接口306输出，由此可以实现基站接收信号时AAU中的驱动功能。
可选的，开关模块或第三信号开关可以用功分器实现，如图4所示，本申请实施例提供的通信芯片的另一实施例中，功分器可以实现开关模块303的作用和效果，如图5所示，本申请实施例提供的通信芯片的另一实施例中，功分器可以实现第三信号开关310的作用和效果。
请参阅图6，本申请实施例提供的通信模块600的一实施例包括至少两个上述实施例中的通信芯片，例如第一通信芯片601和第二通信芯片602，其中，至少两个通信芯片的开关模块控制的第二接口的通路不相同，即一个第一通信芯片601作为混频芯片使用，另一个第二通信芯片602作为驱动芯片使用，此外还可以设置更多的通信芯片作为混频芯片或驱动芯片。可选的，至少两个通信芯片之间设置有滤波器603，即混频芯片和驱动芯片之间可以设置滤波器。
请参阅图7，本申请实施例提供的通信系统700的一实施例包括依次连接的数字处理单元701、上述实施例中的通信模块702、多路功分器703、波束赋形芯片704和天线阵列705。该通信系统700为有源天线处理单元。其中，通信模块702包括第一通信芯片7021和第二通信芯片7022，第一通信芯片7021和第二通信芯片7022之间设置有滤波器7023，第一通信芯片7021具体由两个上述实施例中的通信芯片组成，且该两个天线模块都作为混频芯片使用，第二通信芯片7022具体由两个上述实施例中的通信芯片组成，且该两个天线模块都作为驱动芯片使用。可选的，通信模块702和波束赋形芯片704之间还可以设置有滤波器。其中，数字处理单元701具体可以为ADDA数字处理单元，波束赋形芯片704具体可以为毫米波所用的波束赋型芯片(beamforming IC，BFIC)。
本申请实施例中，通信模块中的通信芯片兼容变频与驱动作用，可以解决当前毫米波系统阵面扩大后带来的无源功分损耗增大的问题，以及降低当前毫米波系统设计复杂度，利用该通信芯片设计的毫米波系统可简化系统级板级设计，颗粒度小，不需要额外本振网络，通过提高该通信芯片的颗粒度，通信芯片可以使用的更多，来提高输出端口数量，降低了对外部功分器的约束，假设现有需要使用1分N的无源功分网络，使用该通信模块后，功分器可减少至1分N/M，其中M取决于通信芯片的集成度，M可为1、2或4等等，简化功分网络的设计，帮助协同获取更强的EIRP能力。
请参阅图8，本申请实施例提供的基站800的一实施例包括基带处理单元801和上述实施例中通信系统802。
所属领域的技术人员可以清楚地了解到，在本申请所提供的几个实施例中，应该理解到，所揭露的模块，系统和芯片等，可以通过其它的方式实现。例如，以上所描述的模块实施例仅仅是示意性的，例如，所述模块的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个模块或接口可以结合或者可以集成到另一个系统，或一 些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，模块或系统的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的模块可以是或者也可以不是物理上分开的，作为模块显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个系统模块上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。

Claims (16)

  1. 一种通信芯片，其特征在于，包括混频器、功分模块和开关模块，其中，
    所述混频器与第一接口连接，所述混频器用于对所述第一接口接收的第一输入信号或所述第一接口需要发送的第一输出信号进行变频处理；
    所述功分模块与第二接口连接，所述功分模块用于对所述第二接口接收的第二输入信号进行合路处理或对所述第二接口需要发送的第二输出信号进行功分处理；
    所述开关模块与第三接口连接，所述第三接口用于接收第三输入信号或发送第三输出信号，所述开关模块用于控制所述第二接口通过所述功分模块与所述第三接口通路，或通过所述功分模块和所述混频器与所述第一接口通路。
  2. 根据权利要求1所述的通信芯片，其特征在于，还包括：
    第一信号开关，所述第一信号开关设置在所述混频器与所述第一接口之间；
    第二信号开关，所述第二信号开关设置在所述混频器与所述开关模块之间，所述第一信号开关和所述第二信号开关用于确定所述第一接口接收所述第一输入信号或发送所述第一输出信号。
  3. 根据权利要求2所述的通信芯片，其特征在于，还包括：
    第一放大器，所述第一放大器设置在所述第一信号开关与所述第一接口之间，所述第一放大器用于放大所述第一输入信号或所述第一输出信号。
  4. 根据权利要求1-3中任一项所述的通信芯片，其特征在于，还包括：
    第三信号开关，所述第三信号开关设置在所述第三接口与所述开关模块之间，所述第三信号开关用于确定所述第三接口接收所述第三输入信号或发送所述第三输出信号。
  5. 根据权利要求1-4中任一项所述的通信芯片，其特征在于，还包括：
    第四信号开关，所述第四信号开关设置在所述第二接口与所述功分模块之间，所述第四信号开关用于确定所述第二接口接收所述第二输入信号或发送所述第二输出信号。
  6. 根据权利要求5所述的通信芯片，其特征在于，还包括：
    第二放大器，所述第二放大器设置在所述第四信号开关与所述功分模块之间，所述第二放大器用于放大所述第二输入信号或所述第二输出信号。
  7. 根据权利要求1-6中任一项所述的通信芯片，其特征在于，还包括：
    第三放大器，设置在所述功分模块和所述开关模块之间，所述第三放大器用于放大所述第一输入信号、所述第一输出信号、所述第二输入信号、所述第二输出信号、所述第三输入信号或所述第三输出信号。
  8. 根据权利要求7所述的通信芯片，其特征在于，还包括：
    衰减器，与所述第一放大器、所述第二放大器或所述第三放大器相邻设置。
  9. 根据权利要求1-8中任一项所述的通信芯片，其特征在于，所述开关模块包括第一通道开关和第二通道开关，所述第一通道开关和所述第二通道开关用于控制所述第二接口通过所述功分模块与所述第三接口通路，或通过所述功分模块和所述混频器与所述第一接口通路。
  10. 根据权利要求4所述的通信芯片，其特征在于，所述开关模块或所述第三信号开关 为功分器。
  11. 一种通信模块，其特征在于，包括至少两个如权利要求1-10中任一项所述的通信芯片，其中，所述至少两个通信芯片的所述开关模块控制的所述第二接口的通路不相同。
  12. 根据权利要求11所述的通信模块，其特征在于，所述至少两个通信芯片之间设置有滤波器。
  13. 一种通信系统，其特征在于，包括依次连接的数字处理单元、如权利要求11或12所述的通信模块、多路功分器、波束赋形芯片和天线阵列。
  14. 根据权利要求13所述的通信系统，其特征在于，所述通信模块和所述波束赋形芯片之间设置有滤波器。
  15. 根据权利要求13或14所述的通信系统，其特征在于，所述通信系统为有源天线处理单元。
  16. 一种基站，其特征在于，包括如权利要求13至15中任一项所述的通信系统。
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CN107615585A (zh) * 2015-05-19 2018-01-19 华为技术有限公司 一种相控阵芯片、相控阵波束扫描方法和装置

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