WO2023069031A1 - A shungite based thin film polymer for electromagnetic field protection and its production method - Google Patents
A shungite based thin film polymer for electromagnetic field protection and its production method Download PDFInfo
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- WO2023069031A1 WO2023069031A1 PCT/TR2021/051082 TR2021051082W WO2023069031A1 WO 2023069031 A1 WO2023069031 A1 WO 2023069031A1 TR 2021051082 W TR2021051082 W TR 2021051082W WO 2023069031 A1 WO2023069031 A1 WO 2023069031A1
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- shungite
- electromagnetic field
- thin film
- based thin
- polymer
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- 229920000642 polymer Polymers 0.000 title claims abstract description 27
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 230000005672 electromagnetic field Effects 0.000 title claims abstract description 20
- 239000010409 thin film Substances 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 16
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 16
- 229920001610 polycaprolactone Polymers 0.000 claims abstract description 12
- 239000004632 polycaprolactone Substances 0.000 claims abstract description 12
- ZMKVBUOZONDYBW-UHFFFAOYSA-N 1,6-dioxecane-2,5-dione Chemical compound O=C1CCC(=O)OCCCCO1 ZMKVBUOZONDYBW-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920002643 polyglutamic acid Polymers 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims description 4
- 229920002988 biodegradable polymer Polymers 0.000 claims description 3
- 239000010408 film Substances 0.000 claims description 3
- 238000009501 film coating Methods 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 239000007888 film coating Substances 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 229920005570 flexible polymer Polymers 0.000 claims 2
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 description 13
- 238000010521 absorption reaction Methods 0.000 description 10
- 230000009975 flexible effect Effects 0.000 description 4
- -1 polyparaphenylene Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 231100000252 nontoxic Toxicity 0.000 description 3
- 230000003000 nontoxic effect Effects 0.000 description 3
- 229910001868 water Inorganic materials 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 230000007123 defense Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
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- 238000000034 method Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 2
- 229920001197 polyacetylene Polymers 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 229920000414 polyfuran Polymers 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 229920000123 polythiophene Polymers 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 208000003174 Brain Neoplasms Diseases 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006820 DNA synthesis Effects 0.000 description 1
- 206010013496 Disturbance in attention Diseases 0.000 description 1
- 208000012902 Nervous system disease Diseases 0.000 description 1
- 208000025966 Neurological disease Diseases 0.000 description 1
- 230000006819 RNA synthesis Effects 0.000 description 1
- 239000002042 Silver nanowire Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000370 acceptor Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000004621 biodegradable polymer Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 208000002173 dizziness Diseases 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- 201000006417 multiple sclerosis Diseases 0.000 description 1
- 238000003012 network analysis Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 231100001223 noncarcinogenic Toxicity 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 230000014616 translation Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/205—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
- C08J3/21—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase
- C08J3/212—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase and solid additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2329/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Derivatives of such polymer
- C08J2329/02—Homopolymers or copolymers of unsaturated alcohols
- C08J2329/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/04—Polyesters derived from hydroxy carboxylic acids, e.g. lactones
Definitions
- the invention relates to shungite included thin films comprising at least one of the polyglycolide (PGA), polylactide-co-glycolide (PLGA), polycaprolactone (PCL) and poly (butylene succinate) (PBS) and polyvinyl alcohol (PVA) which are environmentally friendly, biodegradable and non-toxic polymer support materials and its production method for coating the surfaces of electrical appliances that emit electromagnetic field.
- PGA polyglycolide
- PLGA polylactide-co-glycolide
- PCL polycaprolactone
- PBS poly (butylene succinate)
- PVA polyvinyl alcohol
- EM waves emitted from cell phones, microwave ovens, computers, radars, base stations, business machines, electronic devices in hospitals, military defense and attack systems are just some of the examples of resulting to electrosmog.
- metals such as copper, brass, nickel, silver, steel, or tin are the most common materials for EMF shielding.
- metal-based composites for EMF shielding
- polymer materials have been developed due to their flexibility, easy to process, low weight and tunable mechanical properties.
- polymer composites including conductive fillers such as metal powders or carbon fibers have an excellent EMF shielding efficiency via reflection process.
- silver nanowires (AgNW) integrated polystyrene (PS) matrix and multiwalled carbon nanotube incorporated PS composites have been synthesized for EMF shielding with a high efficiency.
- the surface area and particles size of the conductive fillers may affect the shielding performance.
- carbon black, carbon fiber or carbon nanotubes may easily generate a conductive network within the polymer matrices due to their high surface area.
- carbon based fillers may also mix to conductive polymers such as polypyrrole (PPy), polythiophene (PTH), polyfuran (PF), polyaniline (PANI), polyacetylene (PA), polyparaphenylene (PPP), poly(p-phenylene vinylene) (PPV), and poly(3,4-ethylenedioxythiophene) (PEDOT).
- Py polypyrrole
- PTH polythiophene
- PF polyfuran
- PANI polyaniline
- PA polyacetylene
- PPP polyparaphenylene
- PPP poly(p-phenylene vinylene)
- PEDOT poly(3,4-ethylenedioxythiophene)
- shungite is the most promising filler in composite shielding materials. It is a Precambrian rock with a high carbon content (90-95 %) which is extracted from Karelia in Russia.
- the shungite based composite materials used in the art comprises plastic based polymers.
- the drawbacks of the plastics are their accumulation in the environment every year and can remain unchanged over a period between 100 and 500 years since their degradation is very slow and their degraded fragments contaminate with water or soil that impacts directly to the environment and health.
- the invention relates to shungite included thin films comprising at least one of the polyglycolide (PGA), polylactide-co-glycolide (PLGA), polycaprolactone (PCL) and poly (butylene succinate) (PBS) and polyvinyl alcohol (PVA) polymer support materials and its production method for coating the surfaces of electrical appliances that emit electromagnetic field.
- PGA polyglycolide
- PLGA polylactide-co-glycolide
- PCL polycaprolactone
- PBS poly (butylene succinate)
- PVA polyvinyl alcohol
- the aim of our invention is to reduce the damages caused by the electromagnetic field with the production of Shungite I polymer support material thin films which are cost-effective, flexible and light materials that can be easily apply to any electronic devices as a thin film coating material.
- the reason of choosing at least one of the polymer support materials listed above as a polymer in the composite is that they are biocompatible, non-toxic and non-carcinogenic and gains a flexible property to the material as well. Therefore, one of these environmentally friendly and biodegradable polymer support materials has been used to prepare the shungite based material. As a result, the content of the prepared compound consists of all natural components which have no toxicity on the water or soil.
- Invention comprises at least one of the polyglycolide (PGA), polylactide-co- glycolide (PLGA), polycaprolactone (PCL) and poly (butylene succinate) (PBS) and polyvinyl alcohol (PVA) polymer support materials to produce shungite based polymer composites for EMF shielding. These materials are chosen because of being biodegradable and non-toxic.
- Absorption power (A) and absorption efficiency (AE%) reveals the attenuation contribution in EM absorption when EM waves pass through the composite.
- a and AE% factors was calculated from Equations-2 and 3, respectively.
Abstract
The invention relates to shungite thin films comprising at least one of the polyglycolide (PGA), polylactide-co-glycolide (PLGA), polycaprolactone (PCL) and poly (butylene succinate) (PBS) and polyvinyl alcohol (PVA) polymer support materials and its production method for coating the surfaces of electrical appliances that emit electromagnetic field.
Description
A SHUNGITE BASED THIN FILM POLYMER FOR ELECTROMAGNETIC FIELD PROTECTION AND ITS PRODUCTION METHOD
TECHNICAL FIELD
The invention relates to shungite included thin films comprising at least one of the polyglycolide (PGA), polylactide-co-glycolide (PLGA), polycaprolactone (PCL) and poly (butylene succinate) (PBS) and polyvinyl alcohol (PVA) which are environmentally friendly, biodegradable and non-toxic polymer support materials and its production method for coating the surfaces of electrical appliances that emit electromagnetic field.
BACKGROUND
Today, electrical and electronic devices are present in all areas of our lives. With the development of technology, although the use of these devices makes our lives easier, it causes a serious environmental pollution caused by electromagnetic (EM) waves, and this type of environmental pollution is known as "electrosmog". EM waves emitted from cell phones, microwave ovens, computers, radars, base stations, business machines, electronic devices in hospitals, military defense and attack systems are just some of the examples of resulting to electrosmog.
All electrical appliances that have become a part of our lives emit electromagnetic waves. These EM emissions disrupt DNA and RNA synthesis and protein formation by damaging the human body at a molecular and cellular level. As a result, it may cause neurological diseases such as brain tumors, Alzheimer's, Parkinson’s, and MS (Multiple Sclerosis) as we are exposed to those harmful waves for a longer period of time. The symptoms as dizziness, depression, attention deficit, and concentration impairment were found in people living close to base stations and high-voltage lines. The development of technology does not only affect the lives of individuals, but also uses EM shielding technology in the field of military defense and attack which creates very large electromagnetic fields in the explosion of nuclear weapons. This EM field generates short duration high pulse voltages of thousands of volts. The possible effects of such cases on humans can lead to unpredictable negative consequences. For this reason, the production of materials with electromagnetic wave absorption (EMA) or in other words electromagnetic field (EMF) shielding feature has
gained importance in recent years in order to protect against the harmful effects of EM radiation with increasing health and environmental awareness.
In principle, metals such as copper, brass, nickel, silver, steel, or tin are the most common materials for EMF shielding. However, they have a limited applications in modem devices due to their propensity to corrosion, low flexibility, and high weights. Instead of utilizing metal-based composites for EMF shielding, polymer materials have been developed due to their flexibility, easy to process, low weight and tunable mechanical properties. Generally, polymer composites including conductive fillers such as metal powders or carbon fibers have an excellent EMF shielding efficiency via reflection process. For instance, silver nanowires (AgNW) integrated polystyrene (PS) matrix and multiwalled carbon nanotube incorporated PS composites have been synthesized for EMF shielding with a high efficiency. On the other hand, the surface area and particles size of the conductive fillers may affect the shielding performance. For instance, carbon black, carbon fiber or carbon nanotubes may easily generate a conductive network within the polymer matrices due to their high surface area. Furthermore, carbon based fillers may also mix to conductive polymers such as polypyrrole (PPy), polythiophene (PTH), polyfuran (PF), polyaniline (PANI), polyacetylene (PA), polyparaphenylene (PPP), poly(p-phenylene vinylene) (PPV), and poly(3,4-ethylenedioxythiophene) (PEDOT). The advantages of these composite polymers are that they may easily apply to flexible television screens or acceptors in polymeric solar cells.
In addition to the carbon-based fillers mentioned above, shungite is the most promising filler in composite shielding materials. It is a Precambrian rock with a high carbon content (90-95 %) which is extracted from Karelia in Russia. The shungite based composite materials used in the art comprises plastic based polymers. The drawbacks of the plastics are their accumulation in the environment every year and can remain unchanged over a period between 100 and 500 years since their degradation is very slow and their degraded fragments contaminate with water or soil that impacts directly to the environment and health.
DETAILED DESCRIPTION OF THE INVENTION
The invention relates to shungite included thin films comprising at least one of the polyglycolide (PGA), polylactide-co-glycolide (PLGA), polycaprolactone (PCL) and poly (butylene succinate) (PBS) and polyvinyl alcohol (PVA) polymer support materials
and its production method for coating the surfaces of electrical appliances that emit electromagnetic field. In order to test the EMF shielding properties of these materials, firstly their composites have been prepared by mechanically stirring of Shungite:polymer support material, 40:60 % (w/w) in deionized water. If the mass ratio of the shungite was increased, the EMF absorption was enhanced. However, the composite material lost its flexibility and became easily fragile. In case of increasing the mass ratio of the polymer support material in the composite resulted to a good flexibility, but decreased the EMF absorption. Once their composites were prepared, their wet thin films were produced by a coating device. The resultant films were flexible and easily attach to any surfaces. Their EM shielding properties have been measured by a vector network analysis (VNA) at 8-12 GHz and yielded that nearly 76.7 % of the EM wave has been absorbed by shungite/PVA (used as polymer support material) material thin film with a 30 pm thickness.
The aim of our invention is to reduce the damages caused by the electromagnetic field with the production of Shungite I polymer support material thin films which are cost-effective, flexible and light materials that can be easily apply to any electronic devices as a thin film coating material. The reason of choosing at least one of the polymer support materials listed above as a polymer in the composite is that they are biocompatible, non-toxic and non-carcinogenic and gains a flexible property to the material as well. Therefore, one of these environmentally friendly and biodegradable polymer support materials has been used to prepare the shungite based material. As a result, the content of the prepared compound consists of all natural components which have no toxicity on the water or soil.
Invention comprises at least one of the polyglycolide (PGA), polylactide-co- glycolide (PLGA), polycaprolactone (PCL) and poly (butylene succinate) (PBS) and polyvinyl alcohol (PVA) polymer support materials to produce shungite based polymer composites for EMF shielding. These materials are chosen because of being biodegradable and non-toxic.
Two different solutions comprising at least one of the polyglycolide (PGA), polylactide-co-glycolide (PLGA), polycaprolactone (PCL) and poly (butylene succinate) (PBS) and polyvinyl alcohol (PVA) polymer support materials were prepared in 10 mL of deionized H2O at 60°C. Shungite was added to the prepared solutions, at a ratio of 40:60% (w/w) shungite: polymer support material, respectively. The mixture was stirred at 45 °C for half an hour, then poured onto a double-sided adhesive tape. With a film
coating apparatus, 30 pm thickness films have been obtained. The higher molecular weight of polymer support material has been resulted to a higher flexibility thin film compared to the low molecular weight. The prepared sticker can be affixed to the devices on which electromagnetic waves are emitted.
Graphic 1 . Absorption efficiency of Sungite/PVA (40:60%) at 8.0-12.5 GHz
Above given graphic shows the absorption efficiency (AE %) of the Sunghite/ PVA (used as polymer support material) support material. To calculate the AE (%), firstly the effect of total shielding on absorption and reflection effect was calculated from Equation-1.
(Equation-1 )
Absorption power (A) and absorption efficiency (AE%) reveals the attenuation contribution in EM absorption when EM waves pass through the composite. A and AE% factors was calculated from Equations-2 and 3, respectively.
A = 1 - (Tr + Re) (Equation-2)
AE (%) = [T1/(1 -Re)] x 100 (Equation-3)
In the represented graph, The AE (%) of Shungite/PVA (40:60 %) was plotted to the applied GHz and the highest absorption (76.7%) has been observed at 11 ,9 GHz.
Claims
1. A shungite based thin film polymer for electromagnetic field protection characterized by comprising shungite and a biodegradable and flexible polymer support material at a ratio of 40:60% (w/w) respectively.
2. A shungite based thin film polymer for electromagnetic field protection of Claim 1 characterized by wherein the polymer support material is at least one of the polyglycolide (PGA), polylactide-co-glycolide (PLGA), polycaprolactone (PCL) and poly (butylene succinate) (PBS) and polyvinyl alcohol (PVA) polymers.
3. A method for producing a shungite based thin film polymer for electromagnetic field protection mentioned in the any claims above characterized by comprising the steps below.
- Preparing a solution comprising a biodegradable and flexible polymer support material in 10 mL of deionized H2O at 60°C,
- Adding shungite to the prepared solutions at a ratio of 40:60% (w/w) shungite:polymer support material respectively,
- Stirring the mixture at 45 °C for half an hour,
- Pouring the mixture onto a double-sided adhesive tape,
- Obtaining a film with a 30 pm thickness via film coating apparatus.
5
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/TR2021/051082 WO2023069031A1 (en) | 2021-10-21 | 2021-10-21 | A shungite based thin film polymer for electromagnetic field protection and its production method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/TR2021/051082 WO2023069031A1 (en) | 2021-10-21 | 2021-10-21 | A shungite based thin film polymer for electromagnetic field protection and its production method |
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|---|---|---|---|---|
| US20030155143A1 (en) * | 2002-02-15 | 2003-08-21 | Tadashi Fujieda | Electromagnetic wave absorption material and an associated device |
| KR20130109382A (en) * | 2012-03-27 | 2013-10-08 | 현대자동차주식회사 | Biodegradable composites for shielding of electromagnetic wave containing carbon nanomaterials and biodegradable polymer and a fabrication process thereof |
| KR20170045007A (en) * | 2015-10-16 | 2017-04-26 | 송남강 | Products comprising shungite and method for manufacturing the same |
| KR101968316B1 (en) * | 2017-10-25 | 2019-04-22 | 주식회사 더네이처코리아 | Medical container containing biodegradable polymer plastics |
-
2021
- 2021-10-21 WO PCT/TR2021/051082 patent/WO2023069031A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030155143A1 (en) * | 2002-02-15 | 2003-08-21 | Tadashi Fujieda | Electromagnetic wave absorption material and an associated device |
| KR20130109382A (en) * | 2012-03-27 | 2013-10-08 | 현대자동차주식회사 | Biodegradable composites for shielding of electromagnetic wave containing carbon nanomaterials and biodegradable polymer and a fabrication process thereof |
| KR20170045007A (en) * | 2015-10-16 | 2017-04-26 | 송남강 | Products comprising shungite and method for manufacturing the same |
| KR101968316B1 (en) * | 2017-10-25 | 2019-04-22 | 주식회사 더네이처코리아 | Medical container containing biodegradable polymer plastics |
Non-Patent Citations (2)
| Title |
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