WO2023066192A1

WO2023066192A1 - Optical module heat dissipation device, and communication apparatus

Info

Publication number: WO2023066192A1
Application number: PCT/CN2022/125646
Authority: WO
Inventors: 张军; 严松林; 李晓东
Original assignee: 华为技术有限公司
Priority date: 2021-10-21
Filing date: 2022-10-17
Publication date: 2023-04-27
Also published as: CN116009155A

Abstract

An optical module heat dissipation device, and a communication apparatus (1200). The optical module heat dissipation device comprises a cage body (101) and a first thermally conductive component (102), wherein the cage body (101) comprises a first accommodating cavity and a second accommodating cavity that are distributed in parallel, the first accommodating cavity is configured for accommodating a first optical module (103), the second accommodating cavity is configured for accommodating a second optical module (104), a side wall of the first accommodating cavity is adjacent to a side wall of the second accommodating cavity and a gap is provided therebetween, the first thermally conductive component (102) is arranged in the gap, and the first thermally conductive component (102) is configured to be connected to a heat sink (105). In the optical module heat dissipation device and the communication apparatus (1200), the first thermally conductive component (102) is arranged between the two accommodating cavities, such that the heat dissipation efficiency of the optical modules can be improved, thus improving the reliability of the optical modules.

Description

Optical module cooling device and communication equipment

This application claims the priority of a Chinese patent application filed with the State Intellectual Property Office of China on October 21, 2021, with application number 202111228802.4, and the application name is "Optical Module Cooling Device and Communication Equipment", the entire content of which is incorporated by reference in this application middle.

technical field

The present application relates to the field of optical communication, in particular to an optical module cooling device and communication equipment.

Background technique

In the field of optical communication, an optical module is also called an optical transceiver module. Optical modules are key components in communication equipment. The communication equipment is connected to the optical fiber through the optical module to complete the data transmission. In order to accommodate the optical module, the communication device is provided with a cage body. The cage body forms an accommodating cavity. The optical module is accommodated in the accommodating cavity. When a communication device needs to connect multiple optical fibers, the communication device usually requires multiple optical modules. At this time, the cage body forms a plurality of accommodating cavities in parallel divisions. The multiple accommodating cavities are in one-to-one correspondence with the multiple optical modules.

In practical applications, as the number of optical modules increases, the heat dissipation efficiency of the optical modules will be reduced, thus affecting the reliability of the optical modules.

Contents of the invention

The present application provides a heat dissipation device for an optical module and a communication device. By adding a first heat-conducting component between two accommodating cavities, the heat dissipation efficiency of the optical module can be improved, thereby improving the reliability of the optical module.

The first aspect of the present application provides a heat dissipation device for an optical module. The heat dissipation device for the optical module includes a cage body and a first heat conducting component. The cage body includes a first accommodating cavity and a second accommodating cavity distributed in parallel. The first accommodating cavity is used for accommodating the first optical module. The second accommodating cavity is used for accommodating the second optical module. The side walls of the first accommodating chamber and the side walls of the second accommodating chamber are adjacent to each other and there is a gap. The first heat conducting member is disposed in the gap. The first heat conducting component is used for connecting with the radiator.

In the present application, by adding a first heat-conducting component between the two accommodating cavities, the heat dissipation efficiency of the optical module can be improved, thereby improving the reliability of the optical module.

In an optional manner of the first aspect, an elastic support layer is disposed in the side wall of the first accommodation cavity. Wherein, in order to facilitate plugging and unplugging of the optical module, the optical module and the accommodating cavity generally have a clearance fit. At this time, there may be a gap between the first optical module and the side wall of the first accommodating cavity. By increasing the elastic support layer, the gap can be reduced or eliminated, thereby improving the heat dissipation efficiency of the first optical module.

In an optional manner of the first aspect, the cage body further includes a third accommodating cavity for accommodating the third optical module. The third accommodating cavity is stacked on the first accommodating cavity. Wherein, when the third accommodating cavity exists, the first accommodating cavity cannot dissipate heat through the upper wall of the first accommodating cavity. Therefore, the heat dissipation efficiency of the first optical module can be improved by adding the first heat conducting component at the side wall of the first accommodating cavity.

In an optional manner of the first aspect, the heat dissipation device for the optical module further includes a second heat conducting component. The cage body also includes an interlayer. The interlayer is located between the first accommodating cavity and the third accommodating cavity. A built-in heat conduction component is arranged in the interlayer. The second heat conducting component is arranged outside the side wall of the interlayer. The second heat conducting component is used for connecting with the radiator. Wherein, by adding a built-in heat conduction component in the interlayer, the heat generated by the first optical module can be conducted to the radiator through the second heat conduction component, thereby further improving the heat dissipation efficiency of the first optical module.

In an optional manner of the first aspect, an elastic support layer is disposed in the lower wall of the first accommodating chamber, and/or an elastic support layer is disposed in the upper wall of the third accommodating chamber. Wherein, in order to facilitate plugging and unplugging of the optical module, the optical module and the accommodating cavity generally have a clearance fit. At this time, there may be a gap between the first optical module and the upper wall of the first accommodating cavity. There may be a gap between the third optical module and the lower wall of the third accommodating cavity. By increasing the elastic supporting layer, the gap can be reduced or eliminated, thereby improving the heat dissipation efficiency of the optical module.

In an optional manner of the first aspect, the second heat conduction component and the first heat conduction component are located on the same side of the first accommodating cavity. Wherein, the second heat conduction component and the first heat conduction component disposed on the same side can reduce the volume of the heat dissipation device of the optical module, thereby reducing the cost of the heat dissipation device of the optical module.

In an optional manner of the first aspect, the upper wall of the first accommodating cavity is provided with a first opening. The built-in heat conduction component extends to the inside of the first accommodating cavity through the first opening. And/or, the lower wall of the third accommodating cavity is provided with a second opening. The built-in heat conduction component extends to the inside of the second accommodating cavity through the second opening. Wherein, by adding the first opening, the built-in heat conduction component can directly contact the first optical module, thereby improving the heat dissipation efficiency of the first optical module. Similarly, by adding the second opening, the built-in heat conduction component can directly contact the third optical module, thereby improving the heat dissipation efficiency of the third optical module.

In an optional manner of the first aspect, the built-in heat conduction component includes a lower heat conduction boss, a lower heat conduction pad, and a built-in structural member. The lower heat conduction pad is between the lower heat conduction boss and the built-in structural member. The lower heat conduction boss is under the lower heat conduction pad. Wherein, by adding an elastic lower heat conduction pad, an interference fit can be achieved between the built-in heat conduction component and the interlayer, and the stability of the heat dissipation device of the optical module can be improved. In particular, when the upper wall of the first accommodating cavity is provided with the first opening, the lower heat conduction pad can reduce the gap between the lower heat conduction boss and the first optical module, thereby improving the heat dissipation efficiency of the first optical module.

In an optional manner of the first aspect, the built-in heat conduction component further includes an upper heat conduction boss and an upper heat conduction pad. The upper heat conduction boss and the lower heat conduction boss are arranged oppositely. The upper heat conduction pad and the lower heat conduction pad are arranged oppositely. Wherein, by adding an elastic upper heat conduction pad, an interference fit can be achieved between the built-in heat conduction component and the interlayer, and the stability of the heat dissipation device of the optical module can be improved. In particular, when the second opening is provided on the lower wall of the third accommodating cavity, the upper heat conduction pad can reduce the gap between the upper heat conduction boss and the third optical module, thereby improving the heat dissipation efficiency of the third optical module.

In an optional manner of the first aspect, the side wall of the interlayer is provided with a third opening. The built-in heat conducting component extends to the outside of the interlayer through the third opening. Wherein, by adding the third opening, the built-in heat conduction component can be directly contacted with the second heat conduction component, thereby improving the heat dissipation efficiency of the optical module.

In an optional manner of the first aspect, the second heat conduction component includes a groove. The grooves are used to accommodate built-in thermally conductive components that extend to the outside of the sandwich. Wherein, on the one hand, the stability of the heat dissipation device of the optical module can be improved by accommodating the built-in heat conducting component through the groove. On the other hand, by accommodating the built-in heat-conducting component through the groove, the contact area between the second heat-conducting component and the built-in heat-conducting component can be increased, thereby improving the heat dissipation efficiency of the optical module.

In an optional manner of the first aspect, the optical template cooling device further includes a third heat conducting component. The third heat conducting component is disposed outside the side wall of the third accommodating chamber. The third heat conducting component is used for connecting with the radiator. The heat dissipation efficiency of the third optical module can be improved by arranging the third heat conducting component outside the side wall of the third accommodating cavity.

In an optional manner of the first aspect, the third heat conduction component and the first heat conduction component are located on the same side of the first accommodating cavity. Wherein, the third heat-conducting component and the first heat-conducting component disposed on the same side can reduce the size of the heat dissipation device of the optical module, thereby reducing the cost of the heat dissipation device of the optical module.

In an optional manner of the first aspect, the heat dissipation device for the optical module further includes a thermally conductive connection block. The first heat conduction component is connected with the radiator through the heat conduction connection block. Wherein, on the one hand, by increasing the heat conduction connection block, the contact area between the heat sink and the heat conduction device can be increased, thereby improving the heat dissipation efficiency of the optical module. The heat conduction device includes a first heat conduction component and a heat conduction connection block. On the other hand, by adding heat-conducting connection blocks, the heat sink of the optical module can be adapted to different heat sinks, thereby improving adaptability in different scenarios.

In an optional manner of the first aspect, the radiator is located at the rear end of the cage body. Wherein, when the radiator is located at the rear end of the cage body, the cage body can still dissipate heat through the upper wall of the cage body. Therefore, the present application can improve the heat dissipation efficiency of the optical module.

In an optional manner of the first aspect, the side wall of the first accommodating cavity is provided with a fourth opening. The first heat conducting component extends to the inside of the first accommodating cavity through the fourth opening. Wherein, by setting the fourth opening, the first heat conduction component can be directly contacted with the first optical module, thereby improving the heat dissipation efficiency of the first optical module.

The second aspect of the present application provides a communication device. The communication device includes a circuit board, at least two optical modules, and the heat dissipation device for the optical module in the first aspect or any optional manner of the first aspect. At least two optical modules are placed in the optical module cooling device. At least two optical modules are connected to the circuit board through the interface in the optical module cooling device.

Description of drawings

Fig. 1 is the first structural schematic diagram of the optical module cooling device provided in the embodiment of the present application;

Fig. 2 is the first partial sectional view of the embodiment shown in Fig. 1;

Fig. 3 is the second partial sectional view of the embodiment shown in Fig. 1;

Fig. 4 is a second structural schematic diagram of the optical module cooling device provided in the embodiment of the present application;

Fig. 5 is the first partial sectional view of the embodiment shown in Fig. 4;

Fig. 6 is a schematic structural diagram of a built-in heat conduction component provided in an embodiment of the present application;

Fig. 7 is the second partial sectional view of the embodiment shown in Fig. 4;

Fig. 8 is the third partial sectional view of the embodiment shown in Fig. 4;

Fig. 9 is the fourth partial sectional view of the embodiment shown in Fig. 4;

Fig. 10 is the fifth partial sectional view of the embodiment shown in Fig. 4;

Fig. 11 is a third structural schematic diagram of the optical module cooling device provided in the embodiment of the present application;

Fig. 12 is a schematic structural diagram of a communication device provided in an embodiment of the present application.

Detailed ways

The present application provides a heat dissipation device for an optical module and a communication device. By adding a first heat-conducting component between two accommodating cavities, the heat dissipation efficiency of the optical module can be improved, thereby improving the reliability of the optical module. It should be understood that "first", "second" and the like used in the present application are only used for the purpose of distinguishing and describing, and cannot be interpreted as indicating or implying relative importance, nor can they be understood as indicating or implying order. In addition, reference numerals and/or letters are repeated in the various figures of this application for the sake of brevity and clarity. Repetition does not imply a strictly limited relationship between the various embodiments and/or configurations.

The optical module cooling device in this application can be applied in the field of optical communication. In the field of optical communications, when a communication device needs to connect multiple optical fibers, the communication device usually requires multiple optical modules. As the number of optical modules increases, the heat dissipation efficiency of the optical modules will be reduced, thereby affecting the reliability of the optical modules.

To this end, the present application provides a heat dissipation device for an optical module. The optical module cooling device is also called the optical module cage. FIG. 1 is a first structural schematic diagram of a heat dissipation device for an optical module provided in an embodiment of the present application. As shown in FIG. 1 , the optical module heat dissipation device includes a cage body 101 and a first heat conducting component 102 . The cage body 101 includes a first accommodating cavity and a second accommodating cavity distributed in parallel. The first accommodating cavity is used for accommodating the first optical module 103 . The first accommodating cavity includes an interface (not shown in the figure) for connecting the first optical module 103 . The second accommodating cavity is used for accommodating the second optical module 104 . The second accommodating cavity includes an interface (not shown) for connecting the second optical module 104 . The right wall of the first accommodating cavity is adjacent to the left wall of the second accommodating cavity with a gap. A first heat conducting component 102 is disposed in the gap. The first heat conducting component 102 is used to connect with the radiator 105 .

In this application, the heat generated by the first optical module 103 and the second optical module 104 is guided to the radiator 105 through the first heat conducting component 102 . Therefore, the present application can improve the heat dissipation efficiency of the optical module, and further improve the reliability of the optical module.

For convenience of description, the direction of the X-axis is also referred to as the width direction. The width direction includes a left direction (the opposite direction of the arrow on the X-axis) and a right direction (the direction of the arrow on the X-axis). The direction of the Y axis is also referred to as the length direction. The longitudinal direction includes a rear direction (opposite direction of the arrow of the Y axis) and a front direction (direction of the arrow of the Y axis). The direction of the Z axis is also referred to as the height direction. The height direction includes a downward direction (opposite direction of the arrow of the Z axis) and an upward direction (direction of the arrow of the Z axis). In Fig. 1, each accommodating cavity is composed of an upper wall, a lower wall, a left wall and a right wall. For example, the upper wall and the lower wall of the first accommodating cavity are perpendicular to the Z axis. The Z-axis coordinate value of the upper wall is greater than the Z-axis coordinate value of the lower wall. The left wall and the right wall of the first accommodating cavity are perpendicular to the X axis. The X-axis coordinate value of the right wall is greater than the X-axis coordinate value of the left wall. The lower wall of the first accommodating cavity is close to the circuit board connected to the first optical module 103 . For example, the lower wall of the first accommodating cavity is parallel to the circuit board. The lower wall of the first accommodating cavity is connected to the circuit board through pins. The first optical module 103 and the second optical module 104 can be inserted from the front end of the optical module heat sink.

It should be understood that FIG. 1 is only a schematic structural diagram of the heat dissipation device for the optical module provided in this application. In practical applications, those skilled in the art can make adaptive changes to the heat sink of the optical module according to requirements. For example, in FIG. 1 , the height of the first heat conducting component 102 is smaller than the height of the first accommodating cavity. In practical applications, the height of the first heat conducting component 102 may be equal to the height of the first accommodation cavity. For example, in FIG. 1 , the radiator 105 is located at the rear end of the cage body 101 . In practical applications, the radiator 105 may be located at the upper end of the cage body 101 . When the radiator 105 is located at the upper end of the cage body 101 , the cage body 101 can support the radiator 105 through the upper wall of the first accommodating cavity and the upper wall of the second accommodating cavity. At this time, in order to increase the contact area between the first heat conduction component 102 and the heat sink 105 , the upper plane of the first heat conduction component 102 may be in contact with the heat sink 105 . In practical applications, the radiator 105 may also be located at the left end of the cage body 101 . The radiator 105 is connected to the cage body 101 through the left wall of the first accommodation chamber. The first heat conducting part 102 extends leftward from the rear end of the cage body 101 . The first heat conducting component 102 extending leftward is connected to the radiator 105 .

In practical applications, the optical module and the accommodating cavity generally have a clearance fit. At this time, there may be a gap between the first optical module 103 and the sidewall of the first accommodating cavity. The gap will reduce the heat dissipation efficiency of the first optical module. For this purpose, an elastic supporting layer may be provided between the first optical module 103 and the sidewall of the first accommodating cavity. The elastic support layer is compressed by force in the width direction to realize the interference fit of the first optical module 103 .

FIG. 2 is a first partial sectional view of the embodiment shown in FIG. 1 . As shown in FIG. 2 , the first accommodating cavity formed by the cage body 101 is used for accommodating the first optical module 103 , the elastic supporting layer 201 and the elastic supporting layer 202 . The elastic supporting layer 201 is between the left wall of the first accommodating cavity and the first optical module 103 . The elastic supporting layer 202 is between the right wall of the first accommodating cavity and the first optical module 103 . The first heat conducting component 102 is outside the right wall of the first accommodating cavity. The first heat conducting component 102 is used for connecting with a heat sink (not shown in the figure). At this time, the heat generated by the first optical module 103 can be conducted to the heat sink through the elastic supporting layer 202 , the right wall of the first accommodating cavity and the first heat conducting component 102 .

FIG. 3 is a second partial cross-sectional view of the embodiment shown in FIG. 1 . As shown in FIG. 3 , the first accommodating cavity formed by the cage body 101 is used for accommodating the first optical module 103 and the elastic supporting layer 301 . The elastic supporting layer 301 is between the left wall of the first accommodating cavity and the first optical module 103 . The first heat conducting component 102 is outside the right wall of the first accommodating chamber. The first heat conducting component 102 is used for connecting with a heat sink (not shown in the figure). At this time, the heat generated by the first optical module 103 can be conducted to the heat sink through the right wall of the first accommodating cavity and the first heat conducting component 102 .

In practical applications, in order to reduce the width of the optical module heat sink, multiple optical modules can be stacked. For example, FIG. 4 is a second structural schematic diagram of an optical module heat dissipation device provided in an embodiment of the present application. As shown in FIG. 4 , the optical module heat dissipation device includes a cage body 101 and a first heat dissipation component 102 . The cage body 101 includes a first accommodating cavity and a second accommodating cavity distributed in parallel. The first accommodating cavity is used for accommodating the first optical module 103 . The second accommodating cavity is used for accommodating the second optical module 104 . The cage body 101 also includes a third accommodating cavity and a fourth accommodating cavity. The third accommodating cavity is stacked on the first accommodating cavity. The fourth accommodating cavity is stacked on the second accommodating cavity. The third accommodating cavity is used for accommodating the third optical module 407 . The third accommodating cavity includes an interface (not shown in the figure) for connecting the third optical module 407 . The fourth accommodating cavity is used for accommodating the fourth optical module 406 . The fourth accommodating cavity includes an interface (not shown in the figure) for connecting the fourth optical module 406 .

The heat dissipation device for the optical module may further include a third heat conducting component 411 to improve heat dissipation efficiency of the third optical module. The third heat conducting component 411 is disposed between the right wall of the third accommodating cavity and the left wall of the fourth accommodating cavity. At this time, the heat generated by the third optical module 407 can be conducted to the heat sink 105 through the right wall of the third accommodating cavity and the third heat conducting component 411 . Similarly, the heat generated by the fourth optical module 406 can be conducted to the heat sink 105 through the left wall of the fourth accommodating cavity and the third heat conducting component 411 .

In order to improve the heat dissipation efficiency of the optical module, the heat dissipation device for the optical module may further include a heat conducting connection block 412 . The first heat conducting component 102 is connected to the heat sink 105 through the heat conducting connection block 412 . By increasing the heat conduction connecting block 412, the contact area between the heat sink 105 and the heat conduction device can be increased, thereby improving the heat dissipation efficiency of the optical module. The heat conduction device includes a first heat conduction component 102 and a heat conduction connection block 412 . Moreover, by adding the heat-conducting connection block 412, the heat sink of the optical module can be adapted to different heat sinks, thereby improving the adaptability in different scenarios. For example, in FIG. 4 , the width of the heat sink 105 is the same as that of the thermally conductive connection block 412 . In practical applications, the width of the heat sink 105 can be reduced to adapt to scenes with less space.

In order to improve the heat dissipation efficiency of the first optical module, an interlayer 1 may be disposed between the third accommodating cavity and the first accommodating cavity. A built-in heat conduction component 409 is disposed in the interlayer 1 . The heat dissipation device for the optical module may further include a second heat conducting component 410 . The second heat conducting component 410 is between the right wall of the interlayer 1 and the left wall of the second accommodating cavity. For the description of the interlayer or the upper wall, lower wall, left wall and right wall of the second accommodating chamber, reference may be made to the foregoing description of the first accommodating chamber. The second heat conducting component 410 is connected to the heat sink 105 . At this time, the heat generated by the first optical module 103 can be conducted to the heat sink 105 through the upper wall of the first accommodating cavity, the built-in heat conducting component 409 , the right wall of the interlayer 1 and the second heat conducting component 410 . The heat generated by the third optical module 407 can be conducted to the heat sink 105 through the lower wall of the third accommodating cavity, the built-in heat conducting component 409 , the right wall of the interlayer 1 and the second heat conducting component 410 .

Similarly, in order to improve the heat dissipation efficiency of the second optical module, an interlayer 2 may be disposed between the fourth accommodating cavity and the second accommodating cavity. A built-in heat conduction component 408 is disposed in the interlayer 2 . At this time, the heat generated by the second optical module 104 can be conducted to the radiator 105 through the upper wall of the second accommodating cavity, the built-in heat conducting component 408 , the left wall of the interlayer 2 and the second heat conducting component 410 . The heat generated by the fourth optical module 406 can be conducted to the heat sink 105 through the lower wall of the fourth accommodating cavity, the built-in heat conducting component 408 , the left wall of the interlayer 2 and the second heat conducting component 410 .

It should be understood that FIG. 4 is only a schematic structural diagram of the heat dissipation device for the optical module provided in this application. In practical applications, those skilled in the art may need to make adaptive changes to the heat sink of the optical module. For example, in practical applications, the cage body of the optical module heat sink may include more than three layers of accommodating areas. Taking the third floor as an example, the cage body also includes a fifth accommodation area. The fifth accommodating area is stacked on the third accommodating area. The fifth accommodating area is used for accommodating the fifth optical module. For example, in FIG. 4 , the radiator 105 is located at the rear end of the cage body 101 . In practical applications, the radiator 105 may be located at the upper end of the cage body 101 . For example, in FIG. 4 , the third heat conduction component 411 , the second heat conduction component 410 and the first heat conduction component 102 are independent heat conduction components. In practical applications, the third heat conduction component 411 , the second heat conduction component 410 and the first heat conduction component 102 may be different parts of the same heat conduction component. For example, in FIG. 4, the cage body is the upper end without the radiator. In practical applications, the upper end of the cage body may also include a radiator.

According to the previous description of FIG. 4 , the heat generated by the first optical module 103 can be conducted to the heat sink 105 through the upper wall of the first accommodating cavity, the built-in heat conducting component 409 , the right wall of the interlayer 1 and the second heat conducting component 410 . In practical applications, in order to improve the heat dissipation efficiency of the first optical module 103 , a first opening may be provided on the upper wall of the first accommodating cavity. The built-in heat conducting component 409 extends to the inside of the first accommodating cavity through the first opening.

For example, FIG. 5 is a first partial cross-sectional view of the embodiment shown in FIG. 4 . As shown in FIG. 5 , the optical module heat dissipation device includes a cage body 101 and a second heat conducting component 410 . The cage body 101 includes a first accommodating cavity and a third accommodating cavity. The third accommodating cavity is stacked on the first accommodating cavity. The first accommodating cavity is used for accommodating the first optical module 103 . The third accommodating cavity is used for accommodating the third optical module 407 . An interlayer 1 is included between the first accommodating cavity and the third accommodating cavity. A built-in heat conduction component 409 is disposed in the interlayer 1 . The second heat conducting component 410 is disposed outside the sidewall of the interlayer 1 . Wherein, the upper wall of the first accommodating cavity is provided with a first opening. The built-in heat conduction component 409 extends to the inside of the first accommodating cavity through the first opening and directly contacts with the first optical module 103 . At this time, the heat generated by the first optical module 103 can be conducted to the radiator 105 through the built-in heat conducting component 409 , the right wall of the interlayer 1 and the second heat conducting component 410 . Similarly, the lower wall of the second accommodating cavity may be provided with a second opening. The built-in heat conducting component 409 extends to the inside of the third accommodating cavity through the second opening and directly contacts the third optical module 407 . At this time, the heat generated by the third optical module 407 can be conducted to the radiator 105 through the built-in heat conducting component 409 , the right wall of the interlayer 1 and the second heat conducting component 410 .

In practical applications, there may be a gap between the built-in heat conduction component 409 and the lower wall of the interlayer 1 . The gap will reduce the heat dissipation efficiency of the first optical module. To this end, the built-in heat conduction component 409 may include a lower heat conduction boss, a lower heat conduction pad, and a built-in structural member. The lower thermal pad is elastic. The lower heat conduction pad can be compressed by force in the height direction, thereby reducing or eliminating the gap between the built-in heat conduction component 409 and the lower wall of the interlayer 1 . For example, FIG. 6 is a schematic structural diagram of a built-in heat conduction component provided in an embodiment of the present application. As shown in FIG. 6 , the built-in heat conduction component includes a lower heat conduction boss 601 , a lower heat conduction pad 602 and a built-in structural member 603 . At this time, the heat generated by the first optical module 103 is conducted to the Radiator 105.

For convenience, the built-in heat conduction component is put into the interlayer 1 . The lower heat conduction boss 601 may include a first lower heat conduction boss 6011 and a second lower heat conduction boss 6012 . The projection of the first lower heat conduction boss 6011 on the X plane is a ladder structure. The X plane is a plane perpendicular to the X axis. When the upper wall of the first accommodation cavity is provided with the first opening, part of the structure of the built-in heat conduction component is located inside the first accommodation cavity, and another part of the structure of the built-in heat conduction component is located outside the first accommodation cavity.

The first lower heat conducting boss 6011 extends to the inside of the first accommodating cavity through the first opening. The lower heat conduction pad 602 , the built-in structure 603 and the second lower heat conduction boss 6012 are located outside the first accommodating cavity. At this time, the width of the first lower heat conducting boss 6011 is smaller than the width of the first opening. The length of the first lower heat conducting boss 6011 is less than the length of the first opening. The width of the second lower heat conduction boss 6012 is greater than the width of the first opening, and/or the length of the second lower heat conduction boss 6012 is greater than the length of the first opening.

The first lower heat conduction boss 6011 , the second lower heat conduction boss 6012 and the lower heat conduction pad 602 extend to the inside of the first accommodating cavity through the first opening. The built-in structural component 603 is located outside the first accommodating cavity. At this time, the widths of the first lower heat conduction boss 6011 , the second lower heat conduction boss 6012 and the lower heat conduction pad 602 are smaller than the width of the first opening. The lengths of the first lower heat conduction boss 6011 , the second lower heat conduction boss 6012 and the lower heat conduction pad 602 are smaller than the length of the first opening. The width of the built-in structure 603 is greater than the width of the first opening, and/or the length of the built-in structure 603 is greater than the length of the first opening.

Similarly, the built-in heat conduction component 409 may also include an upper heat conduction boss and an upper heat conduction pad. The upper heat conduction boss and the lower heat conduction boss are arranged oppositely. The upper heat conduction pad and the lower heat conduction pad are arranged oppositely. Specifically, the upper heat conduction boss and the lower heat conduction boss are arranged symmetrically with respect to the built-in structure. The upper heat conduction pad and the lower heat conduction pad are arranged symmetrically with respect to the built-in structure. The upper thermal pad is elastic. The upper thermal pad can be compressed under force in the height direction. At this time, the heat generated by the third optical module 407 can be conducted to the radiator through the lower wall of the third accommodating cavity, the upper heat conduction boss, the upper heat conduction pad, the built-in structural member, the right wall of the interlayer 1 and the second heat conduction member 410 105. When the second opening is provided on the lower wall of the third storage cavity, part of the structure of the built-in heat conduction component is located inside the third storage cavity, and another part of the structure of the built-in heat conduction component is located outside the third storage cavity. At this time, the upper heat conduction boss is in direct contact with the third optical module 407 . The heat generated by the third optical module 407 can be conducted to the radiator 105 through the upper heat conduction boss, the upper heat conduction pad, the built-in structural member, the right wall of the interlayer 1 and the second heat conduction component 410 .

According to the foregoing description, the heat generated by the first optical module 103 can be conducted to the heat sink 105 through the upper wall of the first accommodating cavity, the built-in heat conducting component 409 , the right wall of the interlayer 1 and the second heat conducting component 410 . In practical applications, in order to improve the heat dissipation efficiency of the first optical module, the right wall of the interlayer may be provided with a third opening. The built-in heat conduction component 409 extends to the outside of the interlayer 1 through the third opening. The built-in heat conduction component 409 extending to the outside of the interlayer 1 is in direct contact with the second heat conduction component 410 . At this time, the heat generated by the first optical module 103 can be conducted to the heat sink 105 through the upper wall of the first accommodating cavity, the built-in heat conducting component 409 and the second heat conducting component 410 .

FIG. 7 is a second partial cross-sectional view of the embodiment shown in FIG. 4 . As shown in FIG. 7 , the optical module heat dissipation device includes a cage body, a built-in heat conduction component 409 and a second heat conduction component 410 . The cage body comprises the right wall 701 of the mezzanine 1 . A third opening is provided on the right wall 701 of the interlayer 1 . The built-in heat conduction component 409 extends to the outside of the interlayer 1 through the third opening. Grooves are disposed in the second heat conducting component 410 . The groove is used to accommodate the built-in heat conduction component 409 extending to the outside of the interlayer 1 .

According to the foregoing description, when the upper wall of the first accommodating cavity is provided with the first opening, the built-in heat conduction component 409 can be in direct contact with the first optical module 103 . At this time, the heat generated by the first optical module 103 can be conducted to the radiator through the built-in heat conducting component 409 , the right wall of the interlayer 1 and the first heat conducting component 102 . When the upper wall of the first accommodating cavity is provided with a first opening and the right wall of the interlayer 1 is provided with a third opening, the built-in heat conduction component 409 can be in direct contact with the first optical module 103 and the second heat conduction component 410 . At this time, the heat generated by the first optical module 103 can be conducted to the radiator through the built-in heat conducting component 409 and the second heat conducting component 410 .

In practical applications, there is generally a clearance fit between the optical module and the accommodating cavity. At this time, there may be a gap between the first optical module 103 and the upper wall or the lower wall of the first accommodating cavity. The gap will reduce the heat dissipation efficiency of the first optical module 103 . For this purpose, an elastic supporting layer may be disposed between the first optical module 103 and the upper wall and/or the lower wall of the first accommodating cavity. The elastic supporting layer is compressed by force in the height direction to realize the interference fit of the first optical module 103 .

FIG. 8 is a third partial cross-sectional view of the embodiment shown in FIG. 4 . As shown in FIG. 8 , the optical module heat dissipation device includes a cage body 101 and a second heat conducting component 410 . The cage body 101 includes a first accommodating cavity and a third accommodating cavity stacked on the first accommodating cavity. The first accommodating cavity is used for accommodating the first optical module 103 . The third accommodating cavity is used for accommodating the third optical module 407 . An interlayer 1 is included between the first accommodating cavity and the third accommodating cavity. A built-in heat conduction component 409 is disposed in the interlayer 1 . The first accommodating cavity is used for accommodating the first optical module 103 , the elastic supporting layer 801 and the elastic supporting layer 802 . The elastic supporting layer 801 is between the upper wall of the first accommodating cavity and the first optical module 103 . The elastic supporting layer 802 is between the lower wall of the first accommodating cavity and the first optical module 103 . The second heat conducting component 410 is disposed outside the sidewall of the interlayer 1 . The second heat conducting component 410 is used for connecting with a radiator (not shown in the figure). At this time, the heat generated by the first optical module 103 can be conducted to the heat sink through the elastic supporting layer 801 , the upper wall of the first accommodating cavity, the built-in heat conducting component 409 , the right wall of the interlayer 1 and the second heat conducting component 410 .

FIG. 9 is a fourth partial cross-sectional view of the embodiment shown in FIG. 4 . The optical module heat dissipation device includes a cage body 101 and a second heat conducting component 410. The first accommodating cavity formed by the cage body 101 is used for accommodating the first optical module 103 and the elastic supporting layer 901 . The elastic support layer 901 is between the lower wall of the first accommodating cavity and the first optical module 103 . The second heat conducting component 410 is used for connecting with a radiator (not shown in the figure). At this time, the heat generated by the first optical module 103 can be conducted to the radiator through the upper wall of the first accommodating cavity, the built-in heat conducting component 409 , the right wall of the interlayer 1 and the second heat conducting component 410 .

In the description of FIGS. 2-3 , an elastic supporting layer may be disposed between the first optical module and the left wall and/or the right wall of the first accommodating cavity. In the description of FIGS. 8-9 , an elastic supporting layer may be disposed between the first optical module and the lower wall and/or the upper wall of the first accommodating cavity. It should be understood that, in practical applications, an elastic supporting layer may be disposed between the first optical module and the left wall and/or the right wall of the first accommodating cavity. An elastic supporting layer may also be provided between the first optical module and the upper wall and/or the lower wall of the first accommodating cavity.

Similarly, in practical applications, an elastic supporting layer may also be disposed between the third optical module and the upper wall and/or lower wall of the third accommodating cavity. For the description about the third accommodating cavity, reference may be made to the related description of the first accommodating cavity.

According to the description of FIG. 1 , the heat generated by the first optical module 103 can be conducted to the heat sink 105 through the right wall of the first accommodating cavity and the first heat conducting component 102 . In practical application, in order to improve the heat dissipation efficiency of the first optical module, the right wall of the first accommodating cavity may be provided with a fourth opening. For example, FIG. 10 is a fifth partial cross-sectional view of the embodiment shown in FIG. 4 . For the description of FIG. 10 , reference may be made to the relevant descriptions in the aforementioned FIGS. 1 to 9 . As shown in FIG. 10 , the optical module heat dissipation device includes a cage body and a first heat conducting component 102 . The cage body includes a right wall 1001 of the first accommodating chamber. A fourth opening is disposed on the right wall 1001 of the first accommodating chamber. The first heat conducting component 102 extends to the inside of the first accommodating cavity through the fourth opening. The first heat conducting component 102 extending to the inside of the first accommodating cavity is in direct contact with the first optical module 103 . At this time, the heat generated by the first optical module 103 can be conducted to the radiator 105 through the first heat conducting component 102 .

When the right wall of the first accommodating cavity is provided with a fourth opening, in order to avoid interference between the elastic support layer and the first heat conducting member 102 extending into the first accommodating cavity, the first optical module 103 and the first accommodating cavity An elastic supporting layer may not be provided between the right walls of the wall. At this time, in order to reduce the gap between the first heat conducting component 102 and the first optical module 103 , an elastic supporting layer may be disposed between the first optical module 103 and the left wall of the first accommodating cavity.

Similarly, when the upper wall of the first accommodating cavity is provided with a first opening, in order to avoid interference between the elastic support layer and the built-in heat conduction member 409 extending into the first accommodating cavity, the first optical module 103 and the first accommodating cavity An elastic support layer may not be provided between the upper walls of the cavity. At this time, in order to reduce the gap between the built-in heat conducting component 409 and the first optical module 103 , an elastic support layer may be disposed between the first optical module 103 and the lower wall of the first accommodating cavity.

It should be understood that, in FIG. 1 and FIG. 4 , the present application uses the heat dissipation device of the optical module in two columns of accommodation areas as an example for description. In practical applications, the heat dissipation device for the optical module may include more columns of accommodating areas. For example, FIG. 11 is a third structural schematic diagram of the heat dissipation device for the optical module provided in the embodiment of the present application. As shown in FIG. 11 , the optical module heat dissipation device includes a cage body 101 , a first heat conduction module 102 , an elastic support layer 201 , a heat sink 105 and an interface 1101 . The cage body 101 forms an accommodating area with two layers and four columns. For convenience of presentation, the accommodation area of the upper layer is not shown in the figure. In the lower floor, four accommodation areas are divided side by side. A first heat conduction module 102 is included between adjacent accommodating areas. In addition, a first heat conduction module 102 is also included outside the right wall of the rightmost accommodating area. Elastic supporting layers 201 are provided in the side walls of the four accommodation areas. Each containing area includes an interface 1101 . The interface 1101 is used for connecting an optical module (not shown in the figure). The cage body 101 also includes pins 1102 . Pins 1102 are also known as fisheyes or prongs. The cage body 101 can be connected to the circuit board through pins 1102 .

In FIG. 11 , the number of first heat conduction modules 102 is the same as the number of columns in the accommodating area. In practical applications, in order to balance the heat dissipation efficiency of different optical modules, the number of the first heat conduction modules 102 may be equal to N minus 1. N is the number of columns in the containment area. At this time, a first heat conduction module 102 is included between adjacent accommodating areas.

The optical module cooling device in this application is described above, and the communication device in this application is described below. The communication equipment in this application can be a router, a base station, or a switch, etc. Fig. 12 is a schematic structural diagram of a communication device provided in an embodiment of the present application. As shown in FIG. 12 , a communication device 1200 includes a circuit board 1202 , at least two optical modules 1203 and an optical module heat sink 1201 . For the description of the heat dissipation device 1201 of the optical module, reference may be made to the description of the heat dissipation device of the optical module in FIGS. 1-11 above. At least two optical modules 1203 are placed in the optical module cooling device 1201 . At least two optical modules 1203 are connected to the circuit board 1202 through interfaces in the optical module cooling device 1201 . At least two optical modules 1203 are used to receive optical signals from optical fibers, convert optical signals into electrical signals, and transmit electrical signals to the circuit board 1202 . The at least two optical modules 1203 can also be used to receive electrical signals from the circuit board 1202, convert electrical signals into optical signals, and transmit optical signals to optical fibers.

In other embodiments, the optical module cooling device may further include a processor. The processor may be a central processing unit (central processing unit, CPU), a network processor (network processor, NP), or a combination of CPU and NP. Processors may further include hardware chips or other general-purpose processors. The aforementioned hardware chip may be an application specific integrated circuit (ASIC), a programmable logic device (PLD) or a combination thereof. The processor can be used to receive electrical signals from the circuit board 1202 and perform data processing on the electrical signals. The processor may also be used to transmit electrical signals to the circuit board 1202 .

In other embodiments, the optical module cooling device may further include a memory. The memory can be volatile memory or nonvolatile memory, or both volatile and nonvolatile memory. Wherein, the non-volatile memory may be a read-only memory (read-only memory, ROM), a programmable read-only memory (programmable ROM, PROM), or an erasable programmable read-only memory (erasable PROM, EPROM). The volatile memory may be random access memory (RAM). The memory may be used to receive electrical signals from the circuit board 1202 and store the electrical signals.

The above is only the specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application, and should cover Within the protection scope of this application.

Claims

A heat dissipation device for an optical module, characterized in that it includes a cage body and a first heat-conducting component, wherein:

The cage body includes a first accommodating cavity and a second accommodating cavity distributed in parallel, the first accommodating cavity is used for accommodating the first optical module, and the second accommodating cavity is used for accommodating the second optical module In the module, the side walls of the first accommodating cavity and the side walls of the second accommodating cavity are adjacent and there is a gap;

The first heat conduction component is arranged in the gap, and the first heat conduction component is used for connecting with the radiator.
The heat dissipation device for optical modules according to claim 1, wherein an elastic supporting layer is disposed in the sidewall of the first accommodating cavity.
The optical module cooling device according to claim 1 or 2, wherein the cage body further includes a third accommodating cavity for accommodating a third optical module, and the third accommodating cavity is stacked on the above the first storage chamber.
The optical module heat dissipation device according to claim 3, wherein the optical module heat dissipation device further comprises a second heat-conducting component, and the cage body further comprises an interlayer, and the interlayer is located between the first accommodating cavity and the Between the third accommodating cavity;

A built-in heat conduction component is arranged in the interlayer, the second heat conduction component is arranged outside the side wall of the interlayer, and the second heat conduction component is used for connecting with the heat sink.
The heat dissipation device for optical modules according to claim 4, wherein an elastic support layer is provided in the lower wall of the first accommodating cavity, and/or an elastic support layer is provided in the upper wall of the third accommodating cavity. support layer.
The optical module heat dissipation device according to claim 4 or 5, wherein the second heat-conducting component and the first heat-conducting component are located on the same side of the first accommodating cavity.
The optical module cooling device according to any one of claims 4 to 6, characterized in that,

The upper wall of the first accommodating chamber is provided with a first opening, and the built-in heat conduction component extends to the inside of the first accommodating chamber through the first opening; and/or, the third accommodating chamber The lower wall is provided with a second opening, and the built-in heat conduction component extends to the inside of the second accommodating cavity through the second opening.
The optical module heat dissipation device according to claims 4 to 7, wherein the built-in heat conduction component comprises a lower heat conduction boss, a lower heat conduction pad and a built-in structural member, and the lower heat conduction pad is located between the lower heat conduction boss and the lower heat conduction boss. Between the built-in structural components, the lower heat conduction boss is under the lower heat conduction pad.
The optical module heat dissipation device according to claim 8, wherein the built-in heat conduction component further comprises an upper heat conduction boss and an upper heat conduction pad, the upper heat conduction boss and the lower heat conduction boss are arranged oppositely, and the The upper thermal pad is opposite to the lower thermal pad.
The optical module heat sink according to any one of claims 4 to 9, wherein a third opening is provided on the side wall of the interlayer;

The built-in heat conduction component extends to the outside of the interlayer through the third opening.
The heat dissipation device for an optical module according to claim 10, wherein the second heat-conducting component comprises a groove, and the groove is used for accommodating the built-in heat-conducting component extending to the outside of the interlayer.
The optical module heat dissipation device according to any one of claims 1 to 11, wherein the optical module heat dissipation device further comprises a third heat conduction component, and the third heat conduction component is arranged in the third accommodating cavity Outside the side wall, the third heat conducting component is used to connect with the heat sink.
The heat dissipation device for optical modules according to claim 12, wherein the third heat conducting component and the first heat conducting component are located on the same side of the first accommodating cavity.
The optical module heat dissipation device according to any one of claims 1 to 13, wherein the optical module heat dissipation device further comprises a heat-conducting connection block, and the first heat-conducting component passes through the heat-conducting connection block and the heat dissipation device. connected to the device.
The optical module heat sink according to any one of claims 1 to 14, wherein the heat sink is located at the rear end of the cage body.
The heat dissipation device for optical modules according to any one of claims 1 to 15, wherein a fourth opening is provided on the side wall of the first accommodation cavity, and the first heat conducting member passes through the fourth opening extending to the inside of the first accommodating cavity.
A communication device, characterized by comprising: a circuit board, at least two optical modules, and the optical module cooling device according to any one of claims 1 to 16, wherein:

The at least two optical modules are placed in the optical module cooling device, and the at least two optical modules are connected to the circuit board through an interface in the optical module cooling device.