WO2023064129A1 - Fluides de travail diélectriques à refroidissement par immersion - Google Patents

Fluides de travail diélectriques à refroidissement par immersion Download PDF

Info

Publication number
WO2023064129A1
WO2023064129A1 PCT/US2022/045508 US2022045508W WO2023064129A1 WO 2023064129 A1 WO2023064129 A1 WO 2023064129A1 US 2022045508 W US2022045508 W US 2022045508W WO 2023064129 A1 WO2023064129 A1 WO 2023064129A1
Authority
WO
WIPO (PCT)
Prior art keywords
working fluid
immersion cooling
dielectric
fluid
cooling unit
Prior art date
Application number
PCT/US2022/045508
Other languages
English (en)
Inventor
Jason R. Juhasz
Drew Richard BRANDT
Luke David SIMONI
Jonathan P STEHMAN
Viacheslav A. Petrov
Gustavo Pottker
Original Assignee
The Chemours Company Fc, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Chemours Company Fc, Llc filed Critical The Chemours Company Fc, Llc
Priority to CN202280068851.2A priority Critical patent/CN118104408A/zh
Publication of WO2023064129A1 publication Critical patent/WO2023064129A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion

Definitions

  • the present invention is directed to particular perfluoroolefins useful as dielectric working fluids for immersion cooling.
  • an immersion cooling unit including an immersion cell, defining an internal cavity.
  • An electronic or electrical component is positioned in the internal cavity.
  • a dielectric working fluid partially fills the internal cavity and at least partially immerses the electronic component.
  • a condensing coil is positioned inside the cavity above the dielectric working fluid.
  • the condensing coil is placed outside the cavity and the dielectric fluid circulates out of the cavity through pipe connections to a condenser, then through a pump, to an optional liquid receiver before returning to the cavity to complete the loop.
  • the dielectric working fluid includes at least one of perfluorohept-2-ene, (PFO-161-14myy), perfluorohept-3-ene, (PFO-161-14mcyy), perfluoropent-2-ene (PFO-141- 10myy, or perfluorohex-2-ene (PFO-151-12mcy).
  • a method for cooling an electronic component includes at least partially immersing an electrical component in a working fluid; and transferring heat from the electrical component using the working fluid; wherein the working fluid comprises at least one of perfluorohept-2-ene, (PFO-161-14myy), perfluorohept-3-ene, (PFO- 161-14mcyy), perfluoropent-2-ene (PFO-141-10myy, or perfluorohex-2-ene (PFO-151-12mcy).
  • a method of replacing a high GWP working fluid with a working fluid which comprises at least one of perfluorohept-2-ene, (PFO-161-14myy), perfluorohept-3-ene, (PFO-161-14mcyy), perfluoropent-2- ene (PFO-141-10myy, or perfluorohex-2-ene (PFO-151-12mcy) is provided.
  • FIG. 1 is a perspective view of an immersion unit, according to an embodiment.
  • FIG. 2 is a perspective view of an immersion unit, according to an embodiment.
  • FIG. 3 is a pool boiling curve.
  • Two-phase immersion cooling is an emerging cooling technology for the high performance cooling market as applied to high performance server systems. It relies on the heat absorbed in the process of vaporizing a liquid immersion cooler fluid to a gas.
  • the fluids used in this application must meet certain requirements to be viable in use.
  • the boiling temperature of the fluid should be in the range between 30-75°C. Generally, this range accommodates maintaining the server components at a sufficiently cool temperature while allowing generated heat to be dissipated sufficiently to an external heat sink.
  • the operating temperature of the server, and the immersion cooling system could be raised or lowered, by using an enclosed system and raising or lowering the pressure within the system to raise or lower the boiling point of a given fluid.
  • Single phase immersion cooling has a long history in computer server cooling. There is no phase change in single phase immersion cooling. Instead, the liquid warms as it circulates through the computer server and or heat exchanger, and then is circulated with a pump to a heat exchanger for cooling prior to returning to the server, thus transferring heat away from the computer server. Fluids used for single phase immersion cooling typically have the same requirements as those for two-phase immersion cooling, except that the boiling temperatures are typically higher than 30-75°C, to reduce loss by evaporation.
  • an immersion cooler having an operating temperature range near ambient temperatures.
  • Embodiments of the present disclosure for example, in comparison to concepts failing to include one or more of the features disclosed herein, provide an immersion cooler having fluids for thermal management which are environmentally friendly (i.e., have a low global warming potential (GWP) and low ozone depletion potential (ODP)).
  • GWP global warming potential
  • ODP ozone depletion potential
  • the device is a heat generating component, comprising at least partially immersing the heat generating component into the immersion cooling fluid in a liquid state, and transferring heat from the heat generating component using the immersion cooling fluid.
  • Such devices include electrical components, mechanical components and optical components.
  • Examples of devices of the present disclosure include, but are not limited to, microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, electrical distribution switch gear, power transformers, circuit boards, multi-chip modules, packaged and unpackaged semiconductor devices, laser, fuel cells, electrochemical cells and high capacity energy storage devices such as batteries.
  • the device can include a chiller, a heater, or a combination thereof.
  • the devices can include electronic devices, such as processors, including microprocessors. Microprocessors typically have maximum operating temperatures of about 85°C, so effective heat transfer is required in conditions of high processing power, i.e. high heat rejection rates.
  • the devices may include energy storage systems, such as batteries. When rapidly charged or discharged, batteries can reject a significant amount of heat that needs to be effectively removed to avoid overheating, internal damage, thermal runaway to adjacent batteries and potentially fire. As these electronic and electric devices become denser, and more powerful, the amount heat generated per unit of time and volume increases. Therefore, the mechanism of heat transfer plays an important role in their performance.
  • the heat transfer fluid typically has good heat transfer performance, good electrical compatibility (even if used in “indirect contact” applications such as those employing cold plates), as well as low toxicity, low or nonflammability and low environmental impact.
  • Good electrical compatibility suggests that the heat-transfer fluid candidate exhibit high dielectric strength, high volume resistivity, low dissipation factor, low dielectric constant and poor solvency for polar materials. Additionally, the heat-transfer fluid should exhibit good material compatibility, that is, it should not affect typical materials of construction in an adverse manner.
  • perfluorinated liquids such as Fluorinert FC-72 and FC-3284 may exhibit excellent dielectric properties such as dielectric constants of 2.0 or less, high volume resistivity on the order of 10 15 ohm-cm and high dielectric strength.
  • these fluids are also generally associated with a high GWP, well outside the current requirements for many industrial applications.
  • the GWP of Fluorinert FC-72 is reported to be > 9000.
  • Hydrofluoroethers have lower GWP’s but are still not satisfactory.
  • Novec 7100 for example has a GWP of 297.
  • the GWP of a working fluid is less than 100.
  • the compositions disclosed have a Global Warming Potential (GWP) of not greater than 50.
  • GWP is measured relative to that of carbon dioxide and over a 100-year time horizon, as defined in “The Scientific Assessment of Ozone Depletion, 2002, a report of the World Meteorological Association’s Global Ozone Research and Monitoring Project,” .
  • T able 1 Suitable compounds and compositions useful alone or in combination as dielectric working fluids are shown in T able 1 .
  • the working fluid may be selected from the group of perfluorinated olefin compounds listed in table 1 and mixtures thereof.
  • FIG. 1 An embodiment of an immersion cooling unit 100 is shown in FIG. 1.
  • the immersion cooling system 100 includes an immersion cell 110 defining an internal cavity 120.
  • An electronic or electrical component 130, to be cooled, may be placed in the internal cavity 120.
  • a dielectric working fluid 140 partially fills the internal cavity 120.
  • the dielectric working fluid 140 at least partially immerses the electronic component 130.
  • the dielectric working fluid 140 substantially immerses the electronic component 130.
  • the dielectric working fluid 140 completely immerses the electronic component 130.
  • a condensing coil 150 is additionally present in the internal cavity 120.
  • the condensing coil 150 may be spatially located above at least a portion of the dielectric working fluid 140.
  • heat generated by the electrical component 130 heats the dielectric working fluid 140 causing a portion of the dielectric working fluid 140 to vaporize.
  • the dielectric working fluid 140 vapors contact the condensing coil 150 above the dielectric working fluid 140 and transfer thermal energy to the condensing coil 150 allowing the condensate dielectric working fluid 140 to precipitate back into the liquid dielectric working fluid 140 below.
  • the thermal energy transferred to the condensing coil 150 is transported external to the immersion cell 110 and released into the environment or to a chiller via a heat exchanger 160.
  • the thermal energy released can also be recovered and used for heating applications or for energy generation such as Rankine cycles.
  • the dielectric working fluids of the immersion cooler 100 are selected to undergo a phase transition from the liquid to the gaseous state over the operational temperature range of the immersion cooler 100.
  • the composition of the dielectric working fluids 140 includes one or more fluorinated compounds.
  • the dielectric working fluids 140 include one or more compounds including both fluorine and chlorine.
  • the operational temperature is at least 25°C, at least 30°C, at least 40°C, at least 50°C, at least 60°C, less than 100°C, less than 90°C, less than 80°C, less than 70°C, less than 60°C, and combinations thereof.
  • the normal boiling point of the new low-GWP dielectric fluid may be within at least 10°C of the fluid being replaced. In another embodiment the normal boiling point of the new low-GWP dielectric fluid may be within 8°C. In yet another embodiment, the normal boiling point of the new low-GWP dielectric fluid may be within 5°C
  • the dielectric working fluids 140 may also be selected to exhibit a dielectric constant, volume resistivity, dielectric strength and loss tangent (dissipation factor) suitable for direct contact with electrical and electronic components.
  • materials exhibiting a low dielectric constant, low loss tangent or dissipation factor, high volume resistivity and large dielectric strength provide increased electrical insulation of the electrical components, 130, immersed therein as well as reduced signal loss.
  • the dielectric constant of the dielectric working fluids 140 is less than about 8 over the operational frequency range (which can go as high as 100 GHz).
  • Suitable dielectric working fluids include compounds and mixtures having a dielectric constant over the operational frequency range (up to about 100 GHz) of less than 7.3, or less than 5.5, or less than 5.0, or less than 4.0, or less than 3.5, or less than 2.7, or less than 2.5, or less than 2.0, or less than 1 .9, or less than 1.8, or less than 1.5.
  • Other embodiments include compounds and mixtures having a dielectric constant greater than 1.0 and less than 8.0 or greater than 2.0 and less than 7.3 or greater than 2.5 and less than 5.5 or greater than 3.5 and less than 5.0.
  • the dielectric constant of the new low GWP fluid is no more than 10% higher than that of the existing high-GWP fluid. In another embodiment, the dielectric constant of the new low GWP fluid is no more than 20% higher than that of the existing high-GWP fluid. In yet another embodiment, the dielectric constant of the new low GWP fluid is no more than 50% higher than that of the existing high-GWP fluid, even at high frequencies up to about 60GHz or as high as 100GHz.
  • volume resistivity is an intrinsic property which measures how strongly a material resists electric current per unit length of a unit cross section, typically expressed in units of ohm-cm ohm-m.
  • a higher volume resistivity means the material is a better electrical insulator.
  • the electrical resistance of material can be calculated by multiplying volume resistivity by the length and dividing by the cross-sectional area of the material.
  • a higher volume resistivity dielectric fluid is desirable as it leads to a higher electrical resistance and, consequently, a lower current leakage.
  • Current leakage for instance, can lead to self-discharge of energy storage devices such as batteries. It also means electrical components with different voltage can be placed doser (smaller “L”) for a given minimum resistance requirement, potentially leading to more compact assemblies.
  • effective working fluids have a volume resistivity, measured at 25 °C of at least 1 x 10 10 ohm-cm. In another embodiment, an effective working fluid has a volume resistivity of at least 1 x 10 12 ohm-cm.
  • an effective working fluid has a volume resistivity of at least 1 x 1 O 14 ohm-cm. Water is known for having much lower volume resistivity. Thus, fluids with high volume resistivity are also desirable as, in case of the presence of water in the fluid, they would still maintain adequate levels of actual volume resistivity.
  • the volume resistivity of the new low-GWP fluid must be higher than about 1.0x10 11 .
  • the volume resistivity is no more than about one order of magnitude lower than the high- GWP fluid being replaced.
  • the volume resistivity is no more than about two orders of magnitude.
  • dielectric strength is defined as the maximum electric field or voltage, per unit of length, a material can resist without undergoing electrical breakdown and becoming electrically conductive. It is typically measured in units of kV/mm or kV/0.1” gap. For a given distance or “gap”, the voltage at which a material becomes electrically conductive is called the breakdown voltage.
  • a higher dielectric strength material is advantageous since it allows a higher voltage between two conductors or it allows two conductors to be placed closer, leading to potentially more compact assemblies.
  • the dielectric strength is greater than about 10 kV/0.1” gap. In another embodiment, the dielectric strength is greater than about 20 kV/0.1” gap. In yet another embodiment, the dielectric strength is greater than about 30 kV/0.1” gap. In yet another embodiment, the dielectric strength is greater than about 35 kV/0.1” gap.
  • the dielectric strength of the new low-GWP fluid must be no more than about 10% lower than that of the high-GWP being replaced. In another embodiment, the dielectric strength of the new low-GWP fluid is no more than about 20% lower than that of the high GWP fluid.
  • Dielectric loss tangent sometimes called a dissipation factor, is another critical dielectric property particularly in high frequencies due to its impact on signal attenuation or signal loss. It is defined with the tan( ⁇ 5), which is the ratio of the imaginary component to the relative real component of the permittivity. It is also a measure of the rate at which energy carried by the electromagnetic field (RF) traveling through a dielectric is absorbed by that dielectric, i.e. it quantifies the dissipation of electromagnetic energy in the form of heat. Furthermore, the loss tangent is typically highly dependent on frequency and can increase particularly from above frequencies of 1 GHz up which can be found in applications such as data center, 5G and Wi-fi technology.
  • the signal loss or attenuation per unit length is proportional to the loss tangent.
  • the higher the loss tangent of the fluid the higher the signal loss per unit length and consequently the shorter the distance it can travel.
  • dielectric fluids have low loss tangent values in frequencies above 1 GHz to up to about 100 GHz.
  • the fluids discovered by the inventors have shown very favorable values of loss tangent at high frequencies.
  • the new proposed low- GWP fluids have equivalent and sometimes lower values of loss tangent compared to higher GWP fluids being replaced, particularly in high frequency.
  • an immersion cooling fluid relates its ability of not significantly damaging, or not significantly react with, IT and computer parts such as cables, wires, seals, metals, among other parts, as well as constructions materials of the tank which are exposed to the dielectric fluid.
  • Contaminant control measures such as filter system, may be used to remove solid or liquid residues that may be generated as a result of reactivity with materials of construction. Contamination control measures can also be used to maintain low enough acid and water levels.
  • Typical non-condensable gases such nitrogen and oxygen, can also be present in the dielectric fluid and can be detrimental to boiling and condensation heat transfer.
  • systems with dielectric two-phase fluids may be equipped with a supplemental device that at least partially removes or controls the level of non-condensable levels in the dielectric fluid.
  • the ability of the working fluid 140 to transport heat is related to the heat of vaporization of the dielectric working fluid 140.
  • the greater the heat of vaporization of the dielectric working fluids 140 the greater amount of energy that the working fluid 140 will absorb during vaporization and transport to the condensing coil 150 to be released during condensation. It is also desirable that these fluids are non-flammable or present no flash point. Standards such as ASTM D56, D1310, and E681 can be used to assess flammability.
  • Free convection happens at small values of “wall superheat” or “excess temperature” - the difference between saturation temperature of the fluid and the wall or surface temperature 2)
  • Nucleate boiling occurs when there is high enough superheat for bubbles to form and separate from the surface, significantly improving heat transfer coefficient and heat flux. This mode is typically the preferred regime of boiling operation for heat removal.
  • the nucleation boiling region is limited by the Critical Heat Flux (CHF) with units of kW/m 2 .
  • CHF Critical Heat Flux
  • Heat transfer devices are usually designed to operate at heat fluxes lower than the CHF.
  • the critical heat flux is particular to each fluid and depends on several thermophysical properties. It can be experimentally measured or estimated through semi-empirical models such as the one by Zuber (1959). Fluids with higher CHFs are desirable because they can remove more heat per unit of area, for a given wall superheat.
  • Transition boiling a vapor film begins to form in the surface and there is an oscillation between nucleate and film boiling. The regime is unstable and not desirable to operate.
  • Atmospheric pressures 101 .325 kPa
  • Table 2 shows that the PFOs proposed have comparable and sometimes higher CHFs than legacy fluids.
  • the CHFs were obtained using Zuber (1958) correlation at sea level atmospheric pressure (101.325 kPa) while thermophysical properties were determined through REFPROP 10.
  • Another aspect of boiling heat transfer is the heat transfer coefficient in the nucleate boiling region. It is measured in terms of heat removed (in units of “Watts” for instance), per unit of area (in units of “m 2 ” for instance), per unit of temperature difference between the surface and the bulk fluid (in units of “Kelvin” for instance).
  • the new low GWP fluids provide an equivalent or higher critical heat flux than the higher GWP fluids they are replacing.
  • the new low GWP fluids should provide a critical heat flux of no less than 90%.
  • the new low GWP fluid should provide a critical heat flux of no less than 80% of that of high GWP fluids so that there are no significant changes to the maximum heat flux dissipation in an existing immersion cooling system or major design changes to immersion cooling systems designed for higher GWP fluids.
  • a higher boiling heat transfer coefficient is desirable as it leads to a lower overall thermal resistance, or a lower temperature of the electrical component being cooled.
  • the boiling heat transfer coefficient and the electrical component-to-fluid thermal resistance can be improved with the use of surface enhancements which increase the number of nucleation sites.
  • the electrical component-to-fluid thermal resistance can be determined by the inverse of the product between boiling heat transfer coefficient and the heat transfer area of the electronic/electrical component.
  • the electrical component-to-fluid thermal resistance of the new fluids must be lower or equivalent compared to the existing high GWP fluid. In another embodiment, the electrical component-to- fluid thermal resistance of the new fluids must be no more than 10% higher than that of the existing high GWP fluid than that of the existing high GWP fluid. In yet another embodiment, the electrical component-to-fluid thermal resistance of the new fluids must be no more than 20% higher than that of the existing high GWP fluid, so there is no significant increase in temperature of an existing electronic device or no significant mechanical changes have to be implemented in a system design for a high GWP fluid.
  • condensation heat transfer coefficient Another important aspect of fluids used in two-phase immersion cooling systems is its condensation heat transfer coefficient. Higher condensation heat transfer coefficients are desirable as they lead to reduced thermal resistance or lower temperature difference between the condensing vapor and the coolant that removes the heat. Condensation heat transfer can also be improved with surface enhancements.
  • the vapor-to-condenser surface thermal resistance can be determined by the inverse of the product between condensation heat transfer coefficient and the heat transfer area of the condenser.
  • the vapor-to-condenser thermal resistance of the new fluids must be lower or equivalent compared to the existing high GWP fluid. In another embodiment, the vapor-to-condenser thermal resistance of the new fluids must be no more than 10% higher compared to the existing high GWP fluid. In yet another embodiment, the vapor-to-condenser thermal resistance of the new fluids must be no more than 20% higher compared to the existing high GWP fluid, so there is no significant drop in condenser performance or no significant mechanical changes, for instance an increase in heat transfer area, have to be implemented in the condenser designed for a high GWP fluid.
  • Heat transfer coefficients can be experimentally measured or calculated using experimentally determined heat transfer correlations combined with experimentally determined thermophysical properties.
  • the Electronic Surface-to-Fluid Thermal Resistance was determined by the inverse of the product between the pool boiling heat transfer coefficient and an electronic surface heat transfer area of 4cm 2 .
  • the pool boiling heat transfer coefficient was obtained using Cooper (1984) correlation for nucleate boiling at sea level atmospheric pressures, with roughness of 1 micro-meter and a heat flux of 100kW/m 2 .
  • the vapor-to-condenser surface thermal resistance was determined by the inverse of the product of the condensation heat transfer coefficient and a condenser surface area of 0.2m 2 .
  • the condensation heat transfer coefficient was obtained using Dhir and Lienhard (1971 ) correlation for external condensation on tube bundles at sea level atmospheric pressures and a temperature difference between the bulk fluid and the condenser surface of 8 K.
  • T able 2 shows that the dielectric fluids claimed have equivalent heat transfer coefficients and temperature differences than legacy high-GWP fluids.
  • the power usage or efficiency of data centers can be quantified in terms of PUE - Power Utilization Effectiveness.
  • immersion tanks with dielectric fluids lead to operate at PUE values close to 1.0.
  • the PUE of an immersion cooling tank can be obtained by measuring the overall energy dissipated by the immersed electronic equipment and the energy consumed by the tank. Due to equivalent dielectric, thermodynamic and heat transfer properties, the fluids proposed can also be used to replace the legacy high-GWP fluids in existing equipment in a practice often called “retrofit”. The retrofit could be partial when only a percentage of the existing fluid is replaced or full, when the entire fluid is replaced with a new low GWP fluid.
  • FIG. 2 An embodiment of an immersion cooling unit 200 is shown in FIG. 2.
  • the immersion cooling system 200 includes an immersion cell 210 defining an internal cavity 220.
  • An electronic component 230 to be cooled, may be placed in the internal cavity 220.
  • a dielectric working fluid 240 partially fills the internal cavity 220.
  • the dielectric working fluid 240 at least partially immerses the electronic component 230.
  • the dielectric working fluid 240 substantially immerses the electronic component 230.
  • the dielectric working fluid 240 completely immerses the electronic component 230.
  • a cooling unit 250 is positioned externally to the immersion cell 210.
  • the cooling unit 250 is fluidly connected to the immersion cell 210.
  • the cooling unit 250 is configured to fluidly receive at least a portion of the dielectric working fluid 240 from the immersion cell 210.
  • the cooling unit 250 is further configured to extract heat from the dielectric working fluid 240, thereby reducing the temperature of the dielectric working fluid 240.
  • the cooling unit 250 includes a heat exchanger.
  • the heat transferred to the cooling unit 250 is released into the environment.
  • the cooling unit 250 is further configured to return the cooled dielectric working fluid 240 to the immersion cooling cell 210.
  • a motive force may be provided to the dielectric working fluid 240.
  • the motive force may be provided by one or more circulation pumps 260.
  • the motive force may be provided by convective flow.
  • the dielectric working fluids of the immersion cooler 200 are selected to be in the liquid state over the operational temperature range of the immersion cooler 200.
  • the composition of the dielectric working fluids 240 includes one or more fluorinated compounds.
  • the dielectric working fluids 240 include one or more compounds including both fluorine and chlorine.
  • the operational temperature is at least 25°C, at least 30°C, at least 40°C, at least 50°C, at least 60°C, less than 140°C, less than 130°C, less than 120°C, less than 110°C, less than 100°C, less than 90°C, less than 80°C, less than 70°C, and combinations thereof.
  • the fluids proposed can also be used to replace the legacy high- GWP fluids in existing equipment in a practice often called “retrofit”.
  • Additional additives may be added to the dielectric working fluid 140.
  • Suitable additives include linear hydrocarbons, linear halocarbons, cyclic hydrocarbons, cyclic halocarbons, a hydrofluoroolefin, a hydrofluorocarbon, heptafluorocyclopentane, , 1 ,1 ,1 ,2,3,4,4,5,5,5-decafluoropentane, ethyl 3- ethoxypropionate, alcohols (e.g., methanol, ethanol, isopropanol), ethers, halogenated ethers, carbonates, ketones, and halogenated ketones.
  • alcohols e.g., methanol, ethanol, isopropanol
  • ethers e.g., methanol, ethanol, isopropanol
  • ethers e.g., methanol, ethanol, isopropanol
  • ethers e.g.,
  • suitable additives include pentane, hexane, heptane, octane, cyclopentane, cyclohexane, cycloheptane, methyl cyclobutane, methylcyclopentane, diethyl ether, diisopropyl ether, C4F9OCH3, C4F9OCH2CH3; i-C 4 F9OCH 2 CH 3 ; (CF3)2CFCF(OCH 3 )CF 2 CF3 (73DE), C3F7OCH3, (CF 3 ) 2 CFCF(OCH 2 CH3)CF 2 CF 2 CF3 (HFE 7500,), 1 ,1 , 1 ,2, 3, 3- hexafluoro-4-(1 ,1 ,2,3,3,3-hexafluoropropoxy)pentane (HFE 7600), Furan, 2,3,3,4,4-pentafluorotetrahydro-5-methoxy-2,5-bis

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Transformer Cooling (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne une unité de refroidissement par immersion comprenant une cellule d'immersion définissant une cavité interne. Un composant électronique est positionné dans la cavité interne. Un fluide de travail diélectrique remplit partiellement la cavité interne et immerge au moins partiellement le composant électronique. Une bobine de condensation est positionnée au-dessus du fluide de travail diélectrique. Le fluide de travail diélectrique comprend au moins l'un parmi le perfluorohept-2-ène, (PFO-161-14 myy), Le perfluorohept-3-ène, (PFO-161-14 mcyy).
PCT/US2022/045508 2021-10-12 2022-10-03 Fluides de travail diélectriques à refroidissement par immersion WO2023064129A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202280068851.2A CN118104408A (zh) 2021-10-12 2022-10-03 浸没冷却介电工作流体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163254856P 2021-10-12 2021-10-12
US63/254,856 2021-10-12

Publications (1)

Publication Number Publication Date
WO2023064129A1 true WO2023064129A1 (fr) 2023-04-20

Family

ID=84537297

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2022/045508 WO2023064129A1 (fr) 2021-10-12 2022-10-03 Fluides de travail diélectriques à refroidissement par immersion

Country Status (3)

Country Link
CN (1) CN118104408A (fr)
TW (1) TW202315853A (fr)
WO (1) WO2023064129A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5162594A (en) 1990-10-11 1992-11-10 E. I. Du Pont De Nemours And Company Process for production of polyfluoroolefins
WO2020214912A1 (fr) * 2019-04-18 2020-10-22 The Chemours Company Fc, Llc Systèmes d'alcènes fluorés
WO2021119078A1 (fr) * 2019-12-09 2021-06-17 The Chemours Company Fc, Llc Synthèse catalysée d'alcènes fluorés et compositions d'alcène fluoré

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5162594A (en) 1990-10-11 1992-11-10 E. I. Du Pont De Nemours And Company Process for production of polyfluoroolefins
WO2020214912A1 (fr) * 2019-04-18 2020-10-22 The Chemours Company Fc, Llc Systèmes d'alcènes fluorés
WO2021119078A1 (fr) * 2019-12-09 2021-06-17 The Chemours Company Fc, Llc Synthèse catalysée d'alcènes fluorés et compositions d'alcène fluoré

Also Published As

Publication number Publication date
CN118104408A (zh) 2024-05-28
TW202315853A (zh) 2023-04-16

Similar Documents

Publication Publication Date Title
US20210292628A1 (en) Dielectric Thermal Management Fluids and Methods for Using Them
US20220228047A1 (en) Dielectric Thermal Management Fluids and Methods for Using Them
US20220159875A1 (en) Pressure control for thermal management system
JP2005126480A (ja) フッ化ケトンを含む熱伝達作動液
WO2023064129A1 (fr) Fluides de travail diélectriques à refroidissement par immersion
US11765859B2 (en) Methods of immersion cooling with low-GWP fluids in immersion cooling systems
CN113773812B (zh) 一种包含杂环促进剂的组合物、及其用于液冷剂的用途以及浸没式液冷系统
KR20240074858A (ko) 침지 냉각 시스템에서 저 gwp 유체를 사용한 침지 냉각 방법
KR20230127264A (ko) 불소 치환된 비대칭 에테르, 및 이를 포함하는 조성물, 방법 및 용도
CN116323853A (zh) 组合物
CN117946621A (zh) 三元共沸组合物和类共沸物组合物以及它们的用途
WO2022030464A1 (fr) Dispositif de refroidissement par immersion, caloduc et plaque froide
TW202022549A (zh) 從兩相熱傳熱管理系統選擇性移除流體
US20240130086A1 (en) Multimode immersion cooling
CN115260019B (zh) 一种高支化全氟酮及其在热传导工作中的应用
CN116731689B (zh) 电子元器件的基于硅油的浸没式冷却液
TW202305543A (zh) 流體浸沒式冷卻系統及冷卻電子系統的方法
WO2023096900A1 (fr) Compositions azéotropiques et de type azéotrope de perfluoroheptène et de fluoroéthers et leurs utilisations
CN117222190A (zh) 十氟己烯在两相浸没式冷却系统中的应用
EP4204512A1 (fr) Procédé d'échange de chaleur utilisant des éthers vinyliques fluorés ayant un faible gwp

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22826239

Country of ref document: EP

Kind code of ref document: A1