WO2023049082A1 - Unité radio distante à volume réduit et à efficacité thermique accrue - Google Patents

Unité radio distante à volume réduit et à efficacité thermique accrue Download PDF

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Publication number
WO2023049082A1
WO2023049082A1 PCT/US2022/044037 US2022044037W WO2023049082A1 WO 2023049082 A1 WO2023049082 A1 WO 2023049082A1 US 2022044037 W US2022044037 W US 2022044037W WO 2023049082 A1 WO2023049082 A1 WO 2023049082A1
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WO
WIPO (PCT)
Prior art keywords
component
filter
chassis
thermal management
rru
Prior art date
Application number
PCT/US2022/044037
Other languages
English (en)
Inventor
Kodanda Ram Reddy ENGALA
Granthana Kattehalli Rangaswamy
Imad Shehab
Srishti Saraswat
Farbod Tabatabai
Joseph David VOLZ
Eric Udell
Original Assignee
Meta Platforms, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/673,261 external-priority patent/US20230096962A1/en
Application filed by Meta Platforms, Inc. filed Critical Meta Platforms, Inc.
Publication of WO2023049082A1 publication Critical patent/WO2023049082A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/06—Receivers
    • H04B1/08—Constructional details, e.g. cabinet

Definitions

  • the present disclosure is generally directed to a novel mechanical solution for an RRU design that may improve the thermal performance of the RRU while maximizing the use of the fins and reducing the volume of the RRU unit.
  • RRU remote radio units
  • An RRU may include various baseband components, processors, field-programmable gate arrays ("FPGA”) and/or dedicated application-specific integrated circuits (“ASIC”) that may perform high computational transactions and signal processing.
  • These baseband components may be connected to radio frequency (“RF") components along with power supplies to power up the entire RRU. Under increased loading conditions, these baseband components and power supplies may experience increased temperatures that may require proper thermal management solutions to dissipate heat and cool down the components.
  • RF radio frequency
  • PAM power amplifiers modules
  • PAM power amplifiers modules
  • RRUs may be mounted outdoors, including on roof tops and/or on antenna towers, and may be subjected to different environmental conditions, such as increased seasonal temperatures and solar loading conditions that may further heat up the RRUs.
  • RRUs may also have to be Ingress Protection ("IP”) rated to protect the components from moisture and/or dirt.
  • IP Ingress Protection
  • Additional design challenges may include the different implementations of the RRU in a dual-band (e.g., two different frequencies), tri-band (e.g., three different frequencies), and Multiple-Input and Multiple-Output (“MIMO") RRU configurations that may drive additional PAM modules and increase computational complexity and power supply sizing. These additional considerations may increase (e.g., linearly increase) the thermal envelope of the RRU. Network operators who maintain these RRUs may desire a lightweight, low-volume passive thermal solution. Original Equipment Manufacturers (“OEM”) may therefore rely on passive techniques to cool down the RRUs using, for example, heat spreaders, thermal interface materials and/or vapor chambers, and die-cast aluminum fins.
  • OEM Original Equipment Manufacturers
  • a device comprising: a radio frequency (RF) component; a thermal management component establishing a thermal path with the RF component; an RF filter electrically coupled to the RF component and arranged away from the thermal path; and a chassis for housing the RF component, wherein the thermal management component and the RF filter are positioned near an exterior of the chassis.
  • RF radio frequency
  • the RF filter is removable from the chassis.
  • the RF component comprises a planar surface and the RF filter is oriented perpendicular to the planar surface.
  • the device further comprises an interconnect for coupling the RF component to the perpendicularly oriented RF filter.
  • the interconnect comprises one or more vertical connectors extending along the planar surface.
  • the interconnect allows direct coupling between the RF component and the RF filter.
  • the thermal management component is arranged parallel to the planar surface.
  • the device further comprises a power amplifier electrically coupled to the RF component and the RF filter.
  • the device further comprises a shield component arranged between the RF component and the power amplifier.
  • the thermal management component comprises a passive thermal management component.
  • the RF filter comprises a duplexer.
  • an apparatus comprising: a radio frequency (RF) device comprising: an RF component; a thermal management component establishing a thermal path with the RF component; and a chassis for housingthe RF component, wherein the thermal management component and the RF filter are positioned near an exterior of the chassis; and an RF filter electrically coupled to the RF component, arranged away from the thermal path, and mounted near an exterior of the chassis.
  • RF radio frequency
  • the RF filter is removable from the chassis.
  • the RF component comprises a planar surface and the RF filter is oriented perpendicular to the planar surface.
  • the apparatus further comprises an interconnect for coupling the RF component to the perpendicularly oriented RF filter, wherein the interconnect comprises one or more vertical connectors extending along the planar surface and the interconnect allows direct coupling between the RF component and the RF filter.
  • the thermal management component is arranged parallel to the planar surface.
  • the apparatus further comprises: a power amplifier electrically coupled to the RF component and the RF filter; and a shield component arranged between the RF component and the power amplifier.
  • a system comprising: an antenna; a remote radio unit (RRU) coupled to the antenna and comprising: a radio frequency (RF) component; a thermal management component establishing a thermal path with the RF component; and a chassis for housing the RF component, wherein the thermal management component is positioned near an exterior of the chassis; and an RF filter electrically coupled to the RF component, arranged away from the thermal path, and mounted near an exterior of the chassis.
  • RRU remote radio unit
  • RF radio frequency
  • the RF filter is removable from the chassis.
  • the RF component comprises a planar surface; the RF filter is oriented perpendicular to the planar surface; the RRU further comprises an interconnect for coupling the RF component to the perpendicularly oriented RF filter; the interconnect comprises one or more vertical connectors extending along the planar surface; and the interconnect allows direct coupling between the RF component and the RF filter.
  • FIG. 1 is a block diagram showing components of an exemplary remote radio unit.
  • FIG. 2 is an illustration showing an external view of an exemplary remote radio unit.
  • FIG. 3 is an exploded view of an exemplary remote radio unit.
  • FIGS. 4A-D are various views of an exemplary remote radio unit.
  • RRU remote radio units
  • An RRU may include various baseband components, processors, field-programmable gate arrays ("FPGA”) and/or dedicated application-specific integrated circuits (“ASIC”) that may perform high computational transactions and signal processing.
  • These baseband components may be connected to radio frequency (“RF") components along with power supplies to power up the entire RRU. Under increased loading conditions, these baseband components and power supplies may experience increased temperatures that may require proper thermal management solutions to dissipate heat and cool down the components.
  • RF radio frequency
  • PAM power amplifiers modules
  • PAM power amplifiers modules
  • RRUs may be mounted outdoors, including on roof tops and/or on antenna towers, and may be subjected to different environmental conditions, such as increased seasonal temperatures and solar loading conditions that may further heat up the RRUs.
  • RRUs may also have to be Ingress Protection ("IP”) rated to protect the components from moisture and/or dirt.
  • IP Ingress Protection
  • Additional design challenges may include the different implementations of the RRU in a dual-band (e.g., two different frequencies), tri-band (e.g., three different frequencies), and Multiple-Input and Multiple-Output (“MIMO") RRU configurations that may drive additional PAM modules and increase computational complexity and power supply sizing. These additional considerations may increase (e.g., linearly increase) the thermal envelope of the RRU. Network operators who maintain these RRUs may desire a lightweight, low-volume passive thermal solution. Original Equipment Manufacturers (“OEM”) may therefore rely on passive techniques to cool down the RRUs using, for example, heat spreaders, thermal interface materials and/or vapor chambers, and die-cast aluminum fins.
  • OEM Original Equipment Manufacturers
  • the present disclosure is generally directed to a novel mechanical solution for an RRU design that may improve the thermal performance of the RRU while maximizing the use of the fins and reducing the volume of the RRU unit.
  • a thermal management component may establish a thermal path with an RF component.
  • An RF filter may be electrically coupled to the RF component and arranged away from the thermal path.
  • This design may advantageously improve thermal performance, for instance by reducing components in the thermal path, and further, more efficiently utilize volume for arranging components, for instance by arranging the RF filter near an exterior of the RRU chassis, and further provide modularity, for instance by allowing the RF filter to be removable without having to open the RRU chassis and without having to disconnect other RF components within the RRU chassis.
  • the present disclosure provides a modular architecture, as compared to other RRU architectures.
  • many RRUs may require rebanding (e.g., changing of its frequency of operation), which may require rebuilding the RRU with different components and in some cases a redesign of the RRU.
  • the modular architecture described herein may further allow swapping components (e.g., filters, PAMs, duplexers, etc.) with other elements without requiring major rebuilding and/or redesigning of the modular RRU, which may further reduce time to market as well as reduce development costs for rebanding the product for multiple mobile network operators ("MNO").
  • MNO mobile network operators
  • FIGS. 1-4D detailed descriptions of an improved design for RRUs and/or similar devices. Detailed descriptions of an RRU are provided with FIG. 1. Detailed descriptions of an example design for an RRU are provided with FIG. 2. Further description of an example design, including internal arrangements, are provided with FIG 3. FIGS. 4A-D present various views of additional embodiments.
  • FIG. 1 illustrates exemplary components of an RRU.
  • FIG. 1 shows an RRU 100 that may include one or more RF filters 110, power amplifiers ("PA”) 120, RF component 130, and a power supply unit (“PSU") 140.
  • RF filter 110 may correspond to any component and/or circuit that may block undesired RF signals and allow desired RF signals and may include, for example, a duplexer, a diplexer, a triplexer, a quadplexer, and/or other discrete filters. As illustrated in FIG. 1, RF filter 110 may be coupled to an antenna for outputting signals.
  • RF component 130 may correspond to any electrical component and/or circuit in RRU 100. Although not illustrated in FIG. 1, RF component 130 may include various components, for example one or more processors, FPGAs, ASICs, and/or other RF components such as low power RF components. In addition, RF component 130 may include and/or otherwise be a part of one or more RF circuits.
  • Certain components such as RF component 130 and/or PA 120, may generate more heat than other components, such as RF filter 110, or may otherwise have a higher priority in thermal management.
  • mechanical design considerations and electronic packaging architectures may need to be considered for such improvements.
  • the mechanical design disclosed herein provides the aforementioned improvements that considers mechanical and architectural constraints by arranging certain components, (e.g., components that may not be as heat generative as other components in the RRU) out of a thermal path between components and thermal management components (which may be passive, such as a heat sink).
  • RF filters e.g., duplexers
  • RF filters may be placed on the sides of the RRU for increasing the number of available heat sinking surfaces (e.g., of the thermal management component) to provide a more direct thermal path between heat generating components and the mechanical enclosure fins of the thermal management component.
  • FIG. 2 illustrates an external view of an RRU 200 that may correspond to an embodiment of an RRU design as described herein.
  • RRU 200 may include a chassis 260, a thermal management component 250, and an RF filter 210.
  • Chassis 260 may house components of RRU 200 (which may include components as illustrated in FIG. 1), and may be made of a suitable rigid material.
  • Thermal management component 250 may be a passive thermal management component such as a heat sink, although in other embodiments may comprise any suitable thermal management system. In some embodiments, such as illustrated in FIG. 2, thermal management component 250 may be attached to or otherwise integrated with chassis 260.
  • RF filter 210 may be located to the sides of RRU 200 and may otherwise not be located between internal components of RRU 200 and thermal management component 250. By arranging RF filter 210 outside of or away from (e.g., lateral to) a direct thermal path for thermal management component 250 (e.g., the thermal path between the internal components of RRU 200 and thermal management component 250), thermal management component 250 may be able to provide more efficient heat dissipation to the internal components of RRU 200.
  • RF filter 210 may be removable from RRU 200. For instance, RF filter 210 may be removed from chassis 260 without having to open or otherwise disassemble chassis 260.
  • RRU 200 may include two RF filters 210 (e.g., a dual-band configuration), in other embodiments, RRU 200 may include a single RF filter 210 (e.g., a single-band configuration).
  • FIG. 3 presents another embodiment of an RRU design.
  • FIG. 3 illustrates an exploded view of an RRU 300, which may correspond to RRU 200 and may have a similar layout as RRU 200.
  • RRU 300 may include an RF filter 310, a PA 320, an RF component 330, an interconnect 332, a thermal management component 350, a chassis 360, and a shield component 370.
  • FIG. 3 further illustrates a reference plane 335 and a thermal path 355.
  • RF filter 310 may correspond to RF filter 110 and may comprise, for example, a duplexer or other signal filtering device that may be housed in its own chassis separate from chassis 360.
  • PA 320 may correspond to PA 120.
  • RF component 330 may correspond to RF component 130 and may further comprise additional components illustrated in FIG. 3.
  • the RRU design described herein may more efficiently utilize passive thermal management.
  • the arrangement of RF filter 310 may allow for a more direct thermal path 355 between various components of RRU 300 (e.g., RF component 330 and/or PA 320) and thermal management component 350.
  • RF filter 310 may not significantly impede the thermal management provided by thermal management component 350.
  • Reference plane 335 may correspond to a planar surface of RF component 330.
  • thermal management component 350 may be parallel to reference plane 335 (e.g., having a major planar surface parallel to the planar surface of RF component 330, and having fins extending therefrom). Because RF filter 310 is not located between RF component 330 and thermal management component 350, additional surface area of thermal management component 350 may be in thermal path 355 such that the additional surface area may be utilized for heat dissipation.
  • the increased surface area of thermal management component 350 may include covering an increased area of chassis 360, allowing for additional fins that may increase fin surface area for heat dissipation.
  • RRU 300 further includes shield component 370 to provide electromagnetic shielding for RF component 330 and PA 320. Because RF filter 310 is not located between RF component 330 and PA 320, shield component 370 may be used to shield components on either side of shield component 370, rather than requiring individual shield components for each of RF component 330 and PA 320. Shield component 370 may not generate heat and in some embodiments may conduct heat such that shield component 370 may not impede thermal path 355.
  • RF filter 310 may be away from thermal path 355.
  • RF filter 310 may be arranged perpendicular to the planar surface of RF component 330 (e.g., a planar surface of RF filter 310 may be perpendicular to reference plane 335).
  • RF filter 310 may therefore be positioned generally near the exterior of chassis 360. This arrangement may facilitate removal of RF filter 310 from RRU 300 such that RRU 300 may be modular.
  • RRU 300 may be re-banded by swapping RF filter 310 for a different RF filter 310 corresponding to a desired RF frequency range.
  • Chassis 360 may include mounting locations for RF filter 310.
  • RRU 300 may include at least one interconnect 332 for coupling RF filter 310 to RF component 330.
  • Interconnect 332 along with the mounting location, may provide a single interface for connecting and/or removing RF filter 310.
  • Interconnect 332 may allow direct coupling between RF component 330 and RF filter 310 without requiring an interface card, such as a riser card.
  • interconnect 332 may be a vertical connector that may be oriented perpendicular to reference plane 335 (e.g., 90 degrees from the planar surface of RF component 330).
  • FIGS. 4A-D illustrate various views of RRUs as described herein, including an RRU 400, an RRU 401, an RRU 402, and an RRU 403, which may each correspond to RRU 300.
  • RF filter 410 may be located laterally to reduce components between RF component 430, PA 420, and thermal management component 450.
  • Other embodiments may include, for example, a cover 465 as illustrated in FIGS. 4C and 4D.
  • the present disclosure describes arranging an RF filter away from the thermal path and near a chassis exterior, in other embodiments other components may be arranged as such to facilitate modular components.
  • the modular components may include a chassis designed as needed, for instance having a heatsink or other chassis features.
  • a modular RRU may include a removable component, such as an RF filter.
  • the modular RRU may be designed and manufactured without being limited to a particular RF filter such that the modular RRU may be re-banded to a different RF band by swapping the RF filter.
  • heat generated by the RF components may more effectively be managed via passive thermal management.
  • the modular RRU may exhibit improved thermal performance while meeting volume and other design considerations.
  • Example 1 A device comprising: a radio frequency (RF) component; a thermal management component establishing a thermal path with the RF component; an RF filter electrically coupled to the RF component and arranged away from the thermal path; and a chassis for housing the RF component, wherein the thermal management component and the RF filter are positioned near an exterior of the chassis.
  • RF radio frequency
  • Example 2 The device of Example 1, wherein the RF filter is removable from the chassis.
  • Example 3 The device of Example 1 or 2, wherein the RF component comprises a planar surface and the RF filter is oriented perpendicular to the planar surface.
  • Example 4 The device of Example 3, further comprising an interconnect for coupling the RF component to the perpendicularly oriented RF filter.
  • Example 5 The device of Example 3 or 4, wherein the interconnect comprises one or more vertical connectors extending along the planar surface.
  • Example 6 The device of Example 3, 4, or 5, wherein the interconnect allows direct coupling between the RF component and the RF filter.
  • Example 7 The device of any of Examples 3-6, wherein the thermal management component is arranged parallel to the planar surface.
  • Example 8 The device of any of Examples 1-7, further comprising a power amplifier electrically coupled to the RF component and the RF filter.
  • Example 9 The device of Example 8, further comprising a shield component arranged between the RF component and the power amplifier.
  • Example 10 The device of any of Examples 1-9, wherein the thermal management component comprises a passive thermal management component.
  • Example 11 The device of any of Examples 1-10, wherein the RF filter comprises a duplexer.
  • Example 12 An apparatus comprising: a radio frequency (RF) device comprising: an RF component; a thermal management component establishing a thermal path with the RF component; and a chassis for housing the RF component, wherein the thermal management component and the RF filter are positioned near an exterior of the chassis; and an RF filter electrically coupled to the RF component, arranged away from the thermal path, and mounted near an exterior of the chassis.
  • RF radio frequency
  • Example 13 The apparatus of Example 12, wherein the RF filter is removable from the chassis.
  • Example 14 The apparatus of Example 12 or 13, wherein the RF component comprises a planar surface and the RF filter is oriented perpendicular to the planar surface.
  • Example 15 The apparatus of Example 14, further comprising an interconnect for coupling the RF component to the perpendicularly oriented RF filter, wherein the interconnect comprises one or more vertical connectors extending along the planar surface and the interconnect allows direct coupling between the RF component and the RF filter.
  • Example 16 The apparatus of Example 14 or 15, wherein the thermal management component is arranged parallel to the planar surface.
  • Example 17 The apparatus of any of Examples 12-16, further comprising: a power amplifier electrically coupled to the RF component and the RF filter; and a shield component arranged between the RF component and the power amplifier.
  • Example 18 A system comprising: an antenna; a remote radio unit (RRU) coupled to the antenna and comprising: a radio frequency (RF) component; a thermal management component establishing a thermal path with the RF component; and a chassis for housing the RF component, wherein the thermal management component is positioned near an exterior of the chassis; and an RF filter electrically coupled to the RF component, arranged away from the thermal path, and mounted near an exterior of the chassis.
  • RRU remote radio unit
  • RF radio frequency
  • Example 19 The system of Example 18, wherein the RF filter is removable from the chassis.
  • Example 20 The system of Example 18 or 19, wherein: the RF component comprises a planar surface; the RF filter is oriented perpendicular to the planar surface; the RRU further comprises an interconnect for coupling the RF component to the perpendicularly oriented RF filter; the interconnect comprises one or more vertical connectors extending along the planar surface; and the interconnect allows direct coupling between the RF component and the RF filter.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Le dispositif divulgué peut comprendre un composant à radiofréquence (RF) et un composant de gestion thermique établissant un chemin thermique avec le composant RF. Le dispositif peut également comprendre un filtre RF qui est couplé électriquement au composant RF et disposé à l'écart du chemin thermique. Le dispositif peut également comprendre un châssis destiné à loger le composant RF. Le composant de gestion thermique et le filtre RF peuvent être positionnés près d'un extérieur du châssis. Divers autres dispositifs, appareils et systèmes sont également concernés.
PCT/US2022/044037 2021-09-24 2022-09-19 Unité radio distante à volume réduit et à efficacité thermique accrue WO2023049082A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163248296P 2021-09-24 2021-09-24
US63/248,296 2021-09-24
US17/673,261 US20230096962A1 (en) 2021-09-24 2022-02-16 Remote radio unit with reduced volume and increased thermal efficiency
US17/673,261 2022-02-16

Publications (1)

Publication Number Publication Date
WO2023049082A1 true WO2023049082A1 (fr) 2023-03-30

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PCT/US2022/044037 WO2023049082A1 (fr) 2021-09-24 2022-09-19 Unité radio distante à volume réduit et à efficacité thermique accrue

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6212404B1 (en) * 1997-08-01 2001-04-03 K&L Microwave Inc. Cryogenic filters
US6480706B1 (en) * 1998-12-17 2002-11-12 Ntt Mobile Communications Network, Inc. High sensitivity radio receiver
US20120044840A1 (en) * 2009-03-13 2012-02-23 Huawei Technologies Co., Ltd. Radio frequency unit and intergrated antenna
US20210126351A1 (en) * 2019-10-23 2021-04-29 Commscope Technologies Llc Integrated active antennas suitable for massive mimo operation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6212404B1 (en) * 1997-08-01 2001-04-03 K&L Microwave Inc. Cryogenic filters
US6480706B1 (en) * 1998-12-17 2002-11-12 Ntt Mobile Communications Network, Inc. High sensitivity radio receiver
US20120044840A1 (en) * 2009-03-13 2012-02-23 Huawei Technologies Co., Ltd. Radio frequency unit and intergrated antenna
US20210126351A1 (en) * 2019-10-23 2021-04-29 Commscope Technologies Llc Integrated active antennas suitable for massive mimo operation

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