Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
  • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
  • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
  • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/26—Processing photosensitive materials; Apparatus therefor
  • G03F7/30—Imagewise removal using liquid means
  • G03F7/32—Liquid compositions therefor, e.g. developers
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/26—Processing photosensitive materials; Apparatus therefor
  • G03F7/30—Imagewise removal using liquid means
  • G03F7/32—Liquid compositions therefor, e.g. developers
  • G03F7/325—Non-aqueous compositions
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/26—Processing photosensitive materials; Apparatus therefor
  • G03F7/40—Treatment after imagewise removal, e.g. baking
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/26—Processing photosensitive materials; Apparatus therefor
  • G03F7/42—Stripping or agents therefor
  • G03F7/422—Stripping or agents therefor using liquids only
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Definitions

• CMOS complementary metal-oxide-semiconductor
• IC Integrated Circuit, integrated circuit
• LSI Large Scale Integrated circuit, large-scale integrated circuit
• photolithography process after forming a coating film from a photoresist composition (also called an actinic ray-sensitive or radiation-sensitive resin composition, or a chemically amplified resist composition), the resulting coating film is After exposure, development is performed with a developer to obtain a patterned cured film, and the cured film after development is washed with a rinse.
• a photoresist composition also called an actinic ray-sensitive or radiation-sensitive resin composition, or a chemically amplified resist composition
• the acid component comprises acetic acid, The processing liquid according to any one of [1] to [3], wherein the acetic acid content is 5 to 50 ppm by mass relative to the total mass of the processing liquid.
• a processing liquid container comprising: a container; and the processing liquid according to any one of [1] to [17] contained in the container.
• the content of the aliphatic hydrocarbon-based solvent is preferably 1% by mass or more and less than 100% by mass, and 2 to 70% by mass, based on the total mass of the present processing liquid, in terms of better functions as a developer and a rinse liquid. %, more preferably 5 to 30% by mass.
• the content of the aliphatic hydrocarbon-based solvent is 2% by mass or more, the resolution of the resist pattern is further improved. If the content of the aliphatic hydrocarbon-based solvent is 70% by mass or less, it is possible to further suppress the collapse of the resist pattern.
• a method for adjusting the content of the specific acid component for example, a method of selecting a raw material with a low content of the specific acid component as a raw material constituting various components, a method of lining the inside of the device with Teflon (registered trademark), etc. to prevent contamination. and a method of adding a specific acid component.
• the content of the sulfur-containing compound is preferably 0.01 to 23 ppm by mass, more preferably 0.01 to 10 ppm by mass, and even more preferably 0.01 to 9 ppm by mass, relative to the total mass of the treatment liquid. 0.03 to 0.1 mass ppm is particularly preferred. If the content of the sulfur-containing compound is within the above range, the occurrence of defects can be further suppressed even when the present treatment liquid is used after heating.
• the type and content of sulfur-containing compounds in the treatment liquid can be measured using GCMS (gas chromatography mass spectrometry).
• the content of aromatic hydrocarbons is preferably 1 to 3,500 ppm by mass, more preferably 1 to 2,000 ppm by mass, still more preferably 10 to 1,200 ppm by mass, and 60 to 360 ppm by mass, relative to the total mass of the treatment liquid. is particularly preferred. If the content of the aromatic hydrocarbon is within the above range, the effects of the present invention are more excellent.
• Alcohols are the group consisting of ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, tert-butanol, 1-pentanol, 2-pentanol, 3-pentanol and 2-methyl-1-butanol It preferably contains at least one selected from, more preferably 1-butanol, 2-butanol, tert-butanol, and still more preferably 1-butanol. Alcohol may be used individually by 1 type, and may use 2 or more types together.
• nylon (among them, 6,6-nylon is preferable) and polyolefin (among them, polyethylene is preferable) in that they have better solvent resistance and the resulting treatment liquid has more excellent defect suppression performance.
• poly(meth)acrylates and polyfluorocarbons (preferably polytetrafluoroethylene (PTFE) and perfluoroalkoxyalkane (PFA)). These polymers can be used individually or in combination of 2 or more types. In addition to resin, diatomaceous earth, glass, and the like may also be used.
• a polymer nylon-grafted UPE, etc. obtained by graft-copolymerizing a polyolefin (UPE, etc. described later) with a polyamide (eg, nylon such as nylon-6 or nylon-6,6) may be used as the filter material.
• the filter may be a surface-treated filter.
• the surface treatment method is not particularly limited, and known methods can be used. Examples of surface treatment methods include chemical modification treatment, plasma treatment, hydrophilic/hydrophobic treatment, coating, gas treatment, and sintering.
• a method of introducing an ion exchange group into the base material is preferable. That is, as the filter, a filter obtained by introducing an ion-exchange group into the base material of each of the above-mentioned materials is preferable. Filters comprising a layer comprising a substrate containing ion-exchange groups on the surface of the substrate are typically preferred.
• the surface-modified substrate is not particularly limited, and a filter obtained by introducing an ion-exchange group into the above polymer is preferable because it is easier to manufacture.
• the filtration step may be a multistage filtration step in which the substance to be purified is passed through two or more filters in which at least one selected from the group consisting of filter materials, pore sizes, and pore structures is different. Moreover, the substance to be purified may be passed through the same filter a plurality of times, or may be passed through a plurality of filters of the same type.
• the filtration route is not particularly limited, and one-pass filtration may be used, or a circulation route may be formed for circulation filtration.
• the stainless steel is not particularly limited, and known stainless steel can be used. Among them, an alloy containing 8% by mass or more of nickel is preferable, and an austenitic stainless steel containing 8% by mass or more of nickel is more preferable.
• austenitic stainless steel include SUS (Steel Use Stainless) 304 (Ni content 8% by mass, Cr content 18% by mass), SUS304L (Ni content 9% by mass, Cr content 18% by mass), SUS316 ( Ni content of 10% by mass, Cr content of 16% by mass), SUS316L (Ni content of 12% by mass, Cr content of 16% by mass), and the like.
• the method for producing the treatment liquid may further include steps other than the filtration step.
• Processes other than the filtration process include, for example, a distillation process, a reaction process, and a static elimination process.
• the reaction step is a step of reacting raw materials to produce a product to be purified containing an organic solvent as a reactant.
• the method for producing the substance to be purified is not particularly limited, and known methods can be used. Typically, there is a method of arranging a reaction tank on the primary side of a manufacturing tank (or distillation column) of a refiner subjected to a filtration step and introducing a reactant into the manufacturing tank (or distillation column). At this time, the wetted portion of the production tank is not particularly limited, but is preferably made of the corrosion-resistant material already described.
• the clean room is preferably a class 4 or higher clean room defined by the international standard ISO14644-1:2015 defined by the International Organization for Standardization. Specifically, it preferably satisfies any of ISO Class 1, ISO Class 2, ISO Class 3, and ISO Class 4, more preferably satisfies ISO Class 1 or ISO Class 2, and satisfies ISO Class 1. is particularly preferred.
• Example 12 As filters used for filter filtration, a 7 nm PTFE filter manufactured by Nippon Entegris, a 10 nm PE (polyethylene) filter manufactured by Nippon Entegris, and a 5 nm nylon filter manufactured by Nippon Pall were used alone or in combination.
• the organic solvent used in Example 12 was subjected to concentration pretreatment by low-temperature heating, and the measurement was performed so that the content of the specific metal contained in the original solvent could be detected to the order of 0.01 mass ppt. gone. Teflon (registered trademark) or glass was used for the liquid-contacting part of the device for pre-concentration treatment, and was thoroughly co-washed with the treatment liquid of Example 12 before use for pre-concentration treatment.
• ⁇ water ⁇ ⁇ Ultrapure water Water sampled from an ultrapure water system manufactured by Nomura Microscience Co., Ltd.
• a photomask having a line size of 22 nm and a line:space ratio of 1:1 was used as a reticle. Then, after baking (PEB) at 100° C. for 60 seconds, development was performed by puddling with the processing solutions (developers) of Examples and Comparative Examples for 30 seconds, and the wafer was rotated at a rotation speed of 4000 rpm for 30 seconds to obtain a pitch. A line-and-space pattern of 28-50 nm was obtained. Defects on the obtained pattern were detected on the substrate using Uvision 8+ (manufactured by AMAT), and the number of defects was evaluated. Evaluation criteria are as follows. ⁇ Evaluation criteria A: 50 or less B: More than 50 and 200 or less C: More than 200 and 1,000 or less D: More than 1,000 and 10,000 or less E: More than 10,000
• a silicon wafer having a resist film was prepared using an underlayer film ARC29SR (manufactured by Nissan Chemical Industries, Ltd.) and the following resist composition R-3. This was subjected to pattern irradiation by an ArF excimer laser immersion scanner (XT1700i manufactured by ASML, NA 1.20, Dipole, outer sigma 0.900, inner sigma 0.700, Y deflection). As a reticle, a pattern with a line width of 50 nm was formed using a 6% halftone mask having a line width of 50 nm on the wafer and a line:space ratio of 1:1.
• ARC29SR manufactured by Nissan Chemical Industries, Ltd.
• Polymer 3 was a polymer having the following three repeating units, and had a weight average molecular weight of 7800 and a polydispersity (Mw/Mn) of 1.51. The molar ratio of each repeating unit was 3:1:6 from left to right.
• a silicon wafer having a resist film was prepared using an underlayer film DUV44 (manufactured by Brewer Science) and the following resist composition R-4. This was subjected to pattern irradiation by an electron beam exposure apparatus (EBM-9000 manufactured by NuFlare Technology Co., Ltd., acceleration voltage of 50 kV). A pattern with a line width of 75 nm and a line:space ratio of 1:1 was formed on the wafer. Otherwise, evaluation of the processing solutions (developers) of Examples and Comparative Examples was performed in the same manner as ⁇ Formation of resist film, pattern formation (development)>. As a result, the same result as the above ⁇ Formation of resist film, pattern formation (development)> was obtained.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Spectroscopy & Molecular Physics (AREA)
• Photosensitive Polymer And Photoresist Processing (AREA)
• Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

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• 2022
  • 2022-08-22 JP JP2023548375A patent/JPWO2023042607A1/ja active Pending
  • 2022-08-22 KR KR1020247005889A patent/KR102886989B1/ko active Active
  • 2022-08-22 KR KR1020257037738A patent/KR20250164870A/ko active Pending
  • 2022-08-22 WO PCT/JP2022/031471 patent/WO2023042607A1/ja not_active Ceased
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