WO2023039804A1

WO2023039804A1 - Signal connection method, signal connection apparatus, and test system

Info

Publication number: WO2023039804A1
Application number: PCT/CN2021/118868
Authority: WO
Inventors: 杨宸; 周维; 杨辉明; 黄南阳
Original assignee: 华为技术有限公司
Priority date: 2021-09-16
Filing date: 2021-09-16
Publication date: 2023-03-23
Also published as: CN117043699A

Abstract

A signal connection method, a signal connection apparatus (201), and a test system (200). The method may comprise: configuring a first mapping relationship by means of a signal connection apparatus (201) (S301), wherein the first mapping relationship includes a signal connection relationship between a module to be tested (203) and a hardware-in-the-loop (HIL) device (202); determining a third mapping relationship according to the first mapping relationship (S302), wherein the third mapping relationship includes a signal mapping relationship between a first processor (2042) and the HIL device (202); and determining, according to the third mapping relationship, a connection relationship of an HIL test (S303). By means of the method, the connection configuration of a signal in an HIL test can be realized, thereby improving the efficiency of development and verification.

Description

Signal connection method, signal connection device and test system

technical field

The invention relates to the technical field of test equipment, in particular to a signal connection method, a signal connection device and a test system.

Background technique

The basic principle of hardware-in-the-loop (HIL) testing is to simulate the sensor signals and communication signals required by one or more controllers through HIL equipment, and simultaneously collect the control signals sent by one or more controllers. , one or more controllers and the simulation model running in the HIL device form a closed loop, thereby realizing hardware-in-the-loop testing of one or more controllers. Today, HIL testing has become a very important part of the electronic control unit (ECU) development process, which can reduce development time and cost.

In the HIL test, it is necessary to configure the port and make the wiring harness according to the hard wire port of the ECU and the I/O board port type of the HIL test system, so that the tested ECU can be connected to the HIL device, complete the construction of the test platform, and conduct subsequent tests . However, since there are more ECUs and more signals involved in the vehicle-level HIL test, it takes a lot of time to build the test platform. To solve this problem, related technologies mainly focus on reducing the workload of wiring harness customization, such as jumper adapter boards and custom wiring harnesses. However, the jumper adapter board and the customized wiring harness need to be connected manually, and there are problems such as the inability to realize automatic configuration.

Contents of the invention

Embodiments of the present application provide a signal connection method, a signal connection device, and a test system, which can realize full-link signal connection configuration in HIL testing, and improve the efficiency of development and verification.

In the first aspect, the embodiment of the present application provides a signal connection method, the method may include: configuring a first mapping relationship through a signal connection device, the first mapping relationship includes the signal connection between the module under test and the hardware-in-the-loop HIL device Relationship; determine the third mapping relationship according to the first mapping relationship, the third mapping relationship includes the signal mapping relationship between the first processor and the HIL device; wherein, the first processor is used to run the simulation model, and the simulation model is the module to be tested A model for function simulation; determine the connection relationship of the HIL test according to the third mapping relationship.

It can be seen that through the first aspect, the automatic derivation of the link signal between the module to be tested and the first processor in the HIL test can be realized, without artificially connecting and deriving the signal, which can shorten the preparation time for the HIL test. Improve the efficiency of development verification.

In a possible implementation manner of the first aspect, before determining the third mapping relationship between the first processor and the HIL device according to the first mapping relationship, it further includes: acquiring a second mapping relationship, where the second mapping relationship It includes the signal mapping relationship between the first processor and the module under test.

Through the above method, the signal mapping relationship between the first processor and the module under test can be directly obtained, because the simulation model runs in the first processor, and the signal mapping relationship between the simulation model and the module under test can also be obtained, without Manually writing signal connections can reduce the workload of global signal connections and improve the efficiency of signal configuration.

In a possible implementation manner of the first aspect, determining the third mapping relationship according to the first mapping relationship includes: determining a third mapping between the first processor and the HIL device according to the second mapping relationship and the first mapping relationship relation.

It can be seen that based on the second mapping relationship and the first mapping relationship, the mapping of the I/O resources between the first processor running the simulation model and the HIL device can be determined without manual association, which can reduce operational errors and improve configuration efficiency.

In a possible implementation manner of the first aspect, configuring the first mapping relationship through the signal connection device includes: setting the networking mode between multiple modules under test through the signal connection device; setting one or more modules through the signal connection device A first link between a module to be tested and the HIL device; determine the first mapping relationship based on the set networking mode and the first link, so as to configure the first mapping relationship through the signal connection device.

It can be seen that by setting the networking mode between different modules to be tested through the signal connection device, resource pooling of the modules to be tested can be realized. By controlling the conduction of the signal link between the module under test and the HIL device through the signal connection device, resource pooling of the HIL device can be realized.

In a possible implementation of the first aspect, the signal connection device includes multiple ports, and setting the networking mode between multiple modules under test through the signal connection device includes: setting the corresponding ports of multiple ports through the signal connection device Multiple port identifiers, for example, the first port identifier corresponding to the first port of the signal connection device, the second port identifier corresponding to the second port of the signal connection device, and the third port identifier corresponding to the third port of the signal connection device, etc. Different port identifiers can be the same or different. Set the networking mode between multiple modules under test based on the port identification.

It can be seen that the network mode between different modules to be tested can be set through the signal connection device, so that manual connection is not required to define the network topology, which reduces errors caused by manual operation and improves configuration efficiency.

In a possible implementation of the first aspect, multiple modules to be tested are respectively connected to the signal connection device through multiple ports, and setting the networking mode between the multiple modules to be tested based on the port identification includes: based on the port Identify and set the second link between the first module to be tested and the second module to be tested, wherein the plurality of modules to be tested include the first module to be tested and the second module to be tested, and the port is identified as the An identification corresponding to the port of the signal connection device; setting a networking mode among multiple modules to be tested based on the second link.

It can be seen that the port-based configuration can limit message broadcasting within the connection range and complete the exchange between ports. The networking between the modules under test is not sensitive to port configuration, so it will not affect the transmission of networking messages.

In a possible implementation manner of the first aspect, setting the second link between the first module under test and the second module under test based on the port identifier includes: In this case, determine the signal transmission between the first module under test and the second module under test, so as to realize setting the port identification between the first module under test and the second module under test The second link; wherein, the first port identification is the identification corresponding to the first port of the signal connection device, and the first port is the port connected to the first module under test; the second The port identifier is an identifier corresponding to a second port of the signal connection device, and the second port is a port connected to the second module under test. It can be seen that the port-based configuration (setting the port identifiers to be the same) can limit message broadcasting within the connection range and complete the exchange between ports. The networking between the modules under test is not sensitive to port configuration, so it will not affect the transmission of networking messages.

In a possible implementation manner of the first aspect, a port connection relationship is determined, the port connection relationship includes a first port identifier and a second port identifier, and the first port identifier is the first port of the signal connection device The corresponding identification, the first port is the port connected to the first module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, and the second port is the identification corresponding to the first module to be tested. A port connected to the second module under test; and a second link between the first module under test and the second module under test is set based on the port connection relationship.

It can be seen that the port-based configuration and the established forwarding relationship can limit the message broadcast within the connection range and complete the exchange between ports. The networking between the modules under test is not sensitive to port configuration, so it will not affect the transmission of networking messages.

In a possible implementation manner of the first aspect, the port of the signal connection device includes an Ethernet port or a control area network CAN port.

In a possible implementation manner of the first aspect, the above method may be applied to model testing and/or bench testing, where the bench testing includes physical components corresponding to the simulation model, and the physical components are connected to the signal connection device.

It can be seen that the signal link in the HIL simulation test and bench test can be configured through the embodiment of the present application, without manual configuration, and hybrid simulation can be realized. Therefore, the simulation results of the model can be compared with the simulation results of the physical components, and the efficiency of test verification can be improved.

In a possible implementation manner of the first aspect, after controlling the connection of all-link signals in the HIL simulation test according to the third mapping relationship, the method further includes: constructing a test instance according to a test request from the user equipment. The test instance is used for the user equipment to use the resource of the target module under test corresponding to the test request.

It can be seen that the embodiments of the present application can provide the user equipment with the resources required by the test instance according to the requirements of the user equipment, so as to meet the test needs of different scales and improve the utilization rate of HIL test resources.

In a possible implementation manner of the first aspect, constructing a test instance according to a test request from a user equipment includes: assigning a corresponding target module to be tested and an I/O port for the user equipment according to the test request, and the I/O port is Ports on the HIL device; build test instances based on the target module under test and I/O ports.

It can be seen that after the test is requested to start, the embodiment of the present application can allocate HIL test resources from the I/O resource pool and the module resource pool to be tested according to the test request, thereby meeting the HIL test requirements of different scales and improving the HIL test performance. Resource utilization According to the assigned I/O port mapping relationship and HIL configuration requirements, the mapping between model signals and I/O ports is automatically derived, and the full link signal connection is completed to build a test instance.

In a possible implementation of the first aspect, constructing a test instance according to the resources and I/O ports of the target module under test includes: determining a fourth mapping relationship according to the resources of the target module under test, and the fourth mapping relationship includes the target The signal connection relationship between the module to be tested and the first processor; the fifth mapping relationship is determined according to the I/O port, and the fifth mapping relationship includes the signal connection relationship between the target module to be tested and the HIL device; according to the fourth mapping relationship and the fifth mapping relationship determine a sixth mapping relationship between the first processor and the HIL device; construct a test instance based on the sixth mapping relationship.

It can be seen that the embodiment of the present application can automatically derive the mapping between model signals and HIL device I/O resources, which can reduce the time-consuming configuration of software and hardware, reduce the idle time of HIL device resources, and reduce the cost of use.

In the second aspect, the embodiment of the present application provides a signal connection device, the signal connection device is used to control the signal connection between the module under test and the HIL setting, the device includes a first configuration unit and a second configuration unit,

The first configuration unit is used to set the networking mode between multiple modules to be tested;

The second configuration unit is used to set the first link between one or more modules under test and the HIL device.

In a possible implementation manner of the second aspect, the first configuration unit includes a plurality of ports, and the first configuration unit is specifically configured to: set a plurality of port identifiers corresponding to the plurality of ports; The networking mode between the test modules.

In a possible implementation manner of the second aspect, a plurality of modules to be tested are respectively connected to the first configuration unit through ports, and the first configuration unit is specifically used to: set the first module to be tested and the second module to be tested based on the port identification The second link between the modules to be tested, wherein the plurality of modules to be tested includes a first module to be tested and a second module to be tested, and the port identification is the identification corresponding to the port of the signal connection device; based on the second link, multiple The networking mode between the modules under test.

In a possible implementation manner of the second aspect, the first configuration unit is specifically configured to: determine that the first module under test and the second Signal transmission between the modules under test, so as to realize setting the second link between the first module under test and the second module under test through the port identification; wherein, the first port identification is the The identification corresponding to the first port of the signal connection device, the first port is the port connected to the first module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, The second port is a port connected to the second module under test.

In a possible implementation manner of the second aspect, the first configuration unit is specifically configured to: determine a port connection relationship, where the port connection relationship includes a first port identifier and a second port identifier, and the first port identifier is The identification corresponding to the first port of the signal connection device, the first port is the port connected to the first module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device , the second port is a port connected to the second module under test; setting a second link between the first module under test and the second module under test based on the port connection relationship.

In a possible implementation manner of the second aspect, the port includes an Ethernet port or a control area network CAN port.

In a third aspect, an embodiment of the present application provides a test system, which may include the signal connection device in any implementation of the second aspect above; hardware-in-the-loop HIL test equipment connected to the signal connection device; the module to be tested, Connect with the signal connection device.

In a possible implementation manner of the third aspect, the test system also includes a first processor, the first processor is used to run a simulation model, and the simulation model is a model for simulating the function of the module to be tested; the test system also includes a first The signal mapping relationship between the processor and the module under test.

In a possible implementation manner of the third aspect, the test system runs on at least one of the following devices: a public cloud device, a private cloud device, or a local device.

In the fourth aspect, the embodiment of the present application provides a signal connection device, the device can control the unit, and is used to configure the first mapping relationship through the signal connection device, the first mapping relationship includes the module under test and the hardware-in-the-loop HIL device The signal connection relationship; the processing unit is used to determine the third mapping relationship according to the first mapping relationship, and the third mapping relationship includes the signal mapping relationship between the first processor and the HIL device, wherein the first processor is used to run the simulation model , the simulation model is a model for simulating the function of the module to be tested; the connection unit is used to determine the connection relationship of the HIL test according to the third mapping relationship.

In a possible implementation manner of the fourth aspect, the device further includes: an acquiring unit, configured to acquire a second mapping relationship, where the second mapping relationship includes a signal mapping relationship between the first processor and the module under test.

In a possible implementation manner of the fourth aspect, the processing unit is specifically configured to determine the third mapping relationship according to the second mapping relationship and the first mapping relationship.

In a possible implementation manner of the fourth aspect, the control unit is specifically used to: set the networking mode between multiple modules under test through the signal connection device; set one or more modules under test and the The first link between the HIL devices: determining the first mapping relationship based on the set networking mode and the first link, so as to configure the first mapping relationship through the signal connection device.

In a possible implementation manner of the fourth aspect, the device includes multiple ports, and the control unit is specifically configured to: set multiple port identifiers corresponding to the multiple ports through the signal connection device; set multiple modules under test based on the port identifiers Between networking modes. For example, the first port identifier corresponding to the first port of the signal connection device, the second port identifier corresponding to the second port of the signal connection device, the third port identifier corresponding to the third port of the signal connection device, and so on. Different port identifiers can be the same or different.

In a possible implementation manner of the fourth aspect, multiple modules to be tested are respectively connected to the device through multiple ports, and the control unit is specifically configured to: set the first module to be tested and the second module to be tested based on port identifiers The second link between, wherein, a plurality of modules to be tested includes a first module to be tested and a second module to be tested, and the port identification is the identification corresponding to the port of the signal connection device; a plurality of modules to be tested are set based on the second link The networking mode between modules.

In a possible implementation manner of the fourth aspect, the control unit is specifically configured to: determine that the first module under test and the second module under test Signal transmission between modules, so as to realize setting the second link between the first module under test and the second module under test through the port identification; wherein, the first port identification is the signal The identification corresponding to the first port of the connection device, the first port is the port connected to the first module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, the The second port is a port connected to the second module under test.

In a possible implementation manner of the fourth aspect, the control unit is specifically configured to: determine a port connection relationship, where the port connection relationship includes a first port identifier and a second port identifier, and the first port identifier is the The identification corresponding to the first port of the signal connection device, the first port is the port connected to the first module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, so The second port is a port connected to the second module under test; a second link between the first module under test and the second module under test is set based on the port connection relationship.

In a possible implementation manner of the fourth aspect, the port includes an Ethernet port or a control area network (CAN) port.

In a possible implementation manner of the fourth aspect, the device is used for model testing and bench testing, and the bench testing includes a signal connection device of a physical component corresponding to a simulation model.

In a possible implementation manner of the fourth aspect, the connection unit is configured to construct a test instance according to the test request from the user equipment, and the test instance is used for the user equipment to use resources of the target module under test corresponding to the test request.

In a possible implementation manner of the fourth aspect, the processing unit is configured to assign a corresponding target module to be tested and an I/O port to the user equipment according to the test request, and the I/O port is a port in the HIL device; the connection unit, It is used to build a test instance according to the target module under test and I/O port.

In the fifth aspect, the embodiment of the present application provides a computer-readable storage medium, and instructions are stored in the computer-readable storage medium, and when the instructions are run on at least one processor, the method described in any one of the aforementioned first aspects is implemented .

In a sixth aspect, the present application provides a computer program product, the computer program product includes computer instructions, and when the instructions are run on at least one processor, the method described in any one of the foregoing first aspects is implemented. The computer program product may be a software installation package, and the computer program product may be downloaded and executed on a computing device if the foregoing method needs to be used.

For the beneficial effects of the technical methods provided in aspects 2 to 6 of the present application, reference may be made to the beneficial effects of the technical solution in the first aspect, which will not be repeated here.

Description of drawings

FIG. 1 is a schematic diagram of a central computing architecture provided by an embodiment of the present application;

Fig. 2A is a schematic diagram of a test system provided by an embodiment of the present application;

Fig. 2B is a schematic diagram of a physical component software assembly package provided by the embodiment of the present application;

FIG. 3A is a schematic diagram of signal connections in a HIL simulation test provided by an embodiment of the present application;

FIG. 3B is a schematic flowchart of a signal connection method provided by an embodiment of the present application;

Fig. 4 is a schematic diagram of a signal connection device provided by an embodiment of the present application;

FIG. 5A is a schematic diagram of a networking mode between modules to be tested provided in an embodiment of the present application;

Fig. 5B is a schematic diagram of another networking mode between the modules to be tested provided by the embodiment of the present application;

FIG. 6 is a schematic diagram of a hybrid simulation test provided by an embodiment of the present application;

FIG. 7 is a schematic diagram of a simulation test based on a cloud computing service provided by an embodiment of the present application;

FIG. 8 is a schematic diagram of resource allocation provided by an embodiment of the present application;

FIG. 9 is a schematic structural diagram of a signal connection device provided by an embodiment of the present application;

FIG. 10 is a schematic structural diagram of a computing device provided by an embodiment of the present application.

Detailed ways

Embodiments of the present invention will be described below with reference to the drawings in the embodiments of the present invention.

In the development process of some electronic control equipment such as automobiles and aerospace, hardware-in-loop (Hardware-In-Loop, HIL) testing has become a very important part of the electronic control unit (Electronic Control Unit, ECU) development process. This shortens development time and reduces verification costs, while ensuring the software quality of the ECU.

Taking a car as an example, please refer to FIG. 1 , which is a schematic diagram of a central computing architecture (Central Computing Architecture, CCA) 100 provided by an embodiment of the present application. It should be noted that the cars mentioned in the embodiments of this application include but are not limited to smart cars, new energy cars, or traditional cars. Among them, smart cars can include smart driving cars, unmanned cars, etc. New energy vehicles include pure electric vehicles, enhanced electric vehicles, hybrid vehicles, fuel cell electric vehicles, hydrogen engine vehicles, and other new energy vehicles. Traditional vehicles include gasoline vehicles, diesel vehicles, etc., which are not limited in this embodiment of the present application.

The central computing architecture 100 may include distributed gateways (such as one or more I/O gateways) and data centers (xData Center), xDC (such as smart cockpit CDC, vehicle control VDC and smart driving MDC). Smart cockpit CDC is used for smart cockpit control; vehicle control VDC is used for vehicle power control; smart driving MDC is used for smart driving control.

The distributed gateway can provide access to devices, while connecting to xDC, connecting to vehicle parts, and also connecting to the car box (Telematics BOX, T-box). Therefore, the distributed gateway can be the core component in the vehicle central computing architecture and the data exchange hub of the vehicle network. Distributed gateways and xDCs can run incorporated controller logic. T-box is mainly used to communicate with the exterior of the car, background systems and mobile phone applications.

Vehicle components, including actuators, which are used to achieve specific functions. Wherein, the actuator may be, for example, an actuator or a sensor in the vehicle. Vehicle components may also include ECUs. Among them, the vehicle parts may include one or more of the following: vehicle parts with partial or complete electronic control functions, and vehicle parts without electronic control functions.

Among them, the car parts that realize the automatic driving function include monocular cameras, binocular cameras, millimeter-wave radars, lidars, ultrasonic radars, etc.

The vehicle components that realize the smart cockpit include head-up display, instrument display, radio, navigation, camera, etc.

The vehicle parts that realize the control of the whole vehicle include vehicle parts used in the body domain and vehicle parts in the chassis domain. The vehicle parts in the body domain include door and window lift controllers, electric rearview mirrors, air conditioners, central door locks, etc. Vehicle components in the chassis domain include vehicle components in the braking system, vehicle components in the steering system, and vehicle components in the acceleration system, such as the accelerator.

ECU is located in the interior of auto parts and is composed of one or more of large-scale integrated circuits such as processors, memories, input/output (I/O) interfaces, analog-to-digital converters (A/D), and shaping and driving. With electronic control function, it can complete various functions. For example, the auto parts can be controlled based on the control information, and for example, data processing can be performed on the data to be transmitted in the auto parts.

It should be noted that the above-mentioned electronic control functions mainly include logic control functions and data processing functions. The logic control function includes controlling vehicle components to perform certain operations based on the obtained control information, for example, controlling the action of the wiper based on the control information; another example, controlling the switch state of the door lock based on the control information, etc. The data processing function includes processing the data to be processed in the vehicle components, for example, processing the rain information collected by the sensitive elements of the wiper to determine the working status of the wiper, where the working status includes the working frequency of the wiper or switch status. For another example, data processing is performed on the fingerprint information obtained by the sensitive element of the door lock on the car door to determine the opening and closing status information of the car door.

It should be noted that, unless otherwise specified, the ECU in the embodiments of the present application refers to the electronic control components located in the vehicle components, which is different from the engine control unit (Engine Control Unit) in the prior art. The engine control unit is located outside the multiple vehicle components in the engine system and is used to control multiple vehicle components in the engine system, which can be regarded as an independent centralized controller. However, the electronic control unit in the embodiment of the present application, that is, ECU refers to an electronic control unit located inside a vehicle component, for example, it may be an electronic control unit inside a plurality of vehicle components in an engine system.

It should be noted that the above-mentioned communication connection can be understood as a wireless connection or a wired connection for information transmission, which is not limited in the embodiment of the present application, wherein the wireless connection can be understood as the communication between xDC and other units in the vehicle without going through the bus. For the communication connection, for example, Bluetooth communication or Wi-Fi communication can be used. Wired connection can be understood as the communication connection between DC and other units in the vehicle based on bus or Ethernet connection, for example, Controller Area Network (CAN) bus, Local Interconnect Network (LIN) bus can be used , high-speed serial computer expansion bus standard (peripheral component interconnect express, PCI-e), or Ethernet (ethernet) communication technology.

In the HIL test, it is necessary to configure the interface and make the wiring harness according to the hard wire interface of the ECU and the I/O board interface type of the HIL test system, so that the tested ECU can be connected to the HIL equipment, complete the construction of the test platform, and carry out subsequent tests . It can be seen from Figure 1 that a large number of ECUs are involved in the vehicle, so more ECUs are involved in the vehicle-level HIL test, and the number of signals is also larger, which makes the test platform construction process take up a lot of time. In order to solve this problem, in the related art, a signal transfer device such as a signal configuration box (Break-Out-Box, BOB, or signal transfer box, etc.) is connected in series between the I/O board and the ECU to realize hardware-in-the-loop Test the connection between the system and the ECU.

The signal conversion device provided in the related art includes a first connector and a second connector, the first connector is connected to the hardware-in-the-loop test system, and the second connector is connected to the ECU. Some technical solutions are to customize the wiring harness, that is, according to the interface characteristics of the ECU to be tested and the interface characteristics of the hardware-in-the-loop test signal, the first connector, the second connector, and the first connector and the second connection of the signal connection device Make specific settings for the connection mapping relationship between ECUs to meet the connection requirements between the ECU and the hardware-in-the-loop test system. However, customizing the wiring harness requires a certain amount of time and cost, and it still needs to be done manually when replacing the wiring harness. There is also a technical solution that is a jumper adapter board, that is, the connection between the first connector and the second connector in the signal adapter device is connected through an on-off switch plug-in strip. When a custom configuration interface is required, the user can Turn the switch on or off, then use a hardwire to manually connect the pins (PINs) of the connectors at both ends. However, the jumper adapter board also needs to be manually connected and cannot be automated.

When the HIL test of a single ECU tends to the HIL test of the whole vehicle level, the signal that needs to be connected to the HIL test system has increased by nearly a hundred times. In related technologies, the manual link may bring the probability of operational errors, and the customization link may increase time and cost, affecting the efficiency of development and verification.

In order to solve the above technical problem, first, an embodiment of the present application provides a system. Please refer to FIG. 2A . FIG. 2A is a schematic diagram of a testing system 200 provided by an embodiment of the present application. As shown in FIG. 2A , the hardware part of the test system 200 may include a signal connection device 201 , a hardware-in-the-loop (HIL) test device 202 and a module to be tested 203 . Wherein, the hardware-in-the-loop test equipment 202 and the module to be tested 203 are respectively connected to the signal connection device 201 , and information exchange can be performed through the signal connection device 201 .

The HIL device 202 includes a first processor capable of running a simulation model, an I/O board suitable for HIL testing, and a power supply module.

When the quantity of the module under test 203 is multiple, the signal connecting device 201 is used to set the networking mode between a plurality of modules under test, and is used to control the low-speed I between one or more modules under test and the HIL equipment. /O selective conduction.

The module under test 203 includes at least one I/O gateway and one or more components.

Wherein, according to the quantity of the modules 203 to be tested, the hardware part of the test system 200 can form different product forms. For example, the hardware part of the test system 200 may be in the form of multiple cabinets, that is, the HIL device 202 , the signal connection device 201 and the module to be tested 203 are independent devices. Alternatively, the hardware part of the test system 200 may also be in the form of a highly integrated single cabinet, that is, the HIL device 202, the signal connection device 201 and the module to be tested 203 are integrated in the same device. Alternatively, the hardware part of the test system 200 may also be in the form of a partially integrated multi-cabinet, for example, the HIL device 202 and the signal connection device 201 are integrated into one device, and the module to be tested 203 is an independent device.

As shown in FIG. 2A , the software part of the test system 200 may include a physical component software package 204 , a simulation model management 205 , a signal connection management 206 , an I/O gateway configuration 207 and a service orchestration 208 . in,

Please refer to FIG. 2B. FIG. 2B is a schematic diagram of a physical component software assembly package 204 provided in the embodiment of the present application. As can be seen from FIG. 2B, the physical component software assembly package 204 includes a simulation model 2041, a module to be tested 203 and The second mapping relationship 2043 .

The first processor 2042 is used to run the simulation model 2041 and information processing. The simulation model 2041 specifically includes one or more of the road environment model, ECU model, mechanical model and electrical model, as well as the conversion of physical quantities and interactive signals, which can be used for real Simulate the working characteristics of the components and their sensors and actuators. Taking a car as an example, the simulation model 2041 may include a vehicle dynamics model and a controlled object model. The vehicle dynamics model is used to simulate vehicle operation scenarios, and the controlled object model includes at least And battery engine model, power coupling mechanism model, motor model and battery model.

The module to be tested 203 may include real components and their sensors, actuator application product models, names, port settings and I/O resources such as signal conversion, and so on. It can be understood that the module to be tested 203 may be an application program for implementing functional logic. It should be noted that the number of modules to be tested 203 may be one or more, which is not limited in this embodiment of the present application.

The second mapping relationship 2043 includes the signal mapping relationship between the first processor 2042 and the module under test 203, wherein the second mapping relationship 2043 may specifically be between the simulation model 2041 in the first processor 2042 and the module under test 203 The signal mapping relationship, for example, the mapping between the ports on the module under test 203 and the ports on the simulation model 2041 . It can be understood that, because the simulation model is a model of a virtual form designed according to the physical component, the ports on the simulation model correspond to the ports on the physical component, so the second mapping relationship 2043 can also be the physical component and the module to be tested 203 The signal mapping relationship between them.

It can be seen from FIG. 2A that the simulation model management 205 is used to manage the simulation model 2041 in the physical component software package 204 . Wherein, the simulation model 2041 is a model deployed on the hardware-in-the-loop testing device 202 to test the function of the module to be tested 203 .

The signal connection management 206 is used to control the signal connection between the signal connection device 201 and the HIL test equipment 202 and the module under test 203 .

The I/O gateway configuration 207 is used to configure the I/O interface of the underlying software (such as the corresponding software of the module to be tested 203), that is, to calibrate the physical meaning and engineering unit of the I/O port data, and to set the analog signal and The conversion relationship between actual physical values.

The service orchestration 208 is used for arranging the service components corresponding to the module under test 203 according to actual needs to obtain new services that meet its own actual needs. The module under test 203 can be deployed on the service orchestration 208 .

It should be noted that the test system shown in FIG. 2A can run on a cloud (such as a public cloud or a private cloud), and can also run on a local device. Further, the high-performance computer running the simulation model in the test system can run on the cloud, and other parts (such as signal connection devices, modules to be tested, etc.) can run locally.

It can be understood that the basic principle of HIL testing is to simulate the sensing signals and communication signals required by one or more controllers through HIL equipment, and simultaneously collect the control signals sent by one or more controllers, one or more controllers It forms a closed loop with the simulation model running in the HIL device. Please refer to FIG. 3A . FIG. 3A is a schematic diagram of signal connections in an HIL simulation test provided by an embodiment of the present application.

In related technologies, supplier A generally provides the simulation model 2041 , supplier B provides the module under test 203 , and the integrator writes the signal connection document between the simulation model 2041 and the module under test 203 . Therefore, the second mapping relationship between the simulation model 2041 and the module under test 203 can only be obtained by manually associating documents in the HIL test of the related art. In the embodiment of the present application, the physical component software assembly package 204 shown in FIG. 2A or FIG. 2B contains the mapping relationship between the simulation model 2041 in the first processor 2042 and the module to be tested 203. Therefore, the electronic device passes through the physical The component software package 204 can obtain the second mapping relationship.

In the related technology, the connection between the HIL device 202 and the module under test 203 needs to be realized through a customized wiring harness or a jumper board. In the embodiment of the present application, the electronic device can configure the first mapping relationship between the HIL device 202 and the module under test 203 through the signal connection device 201 . Further, the electronic device can set the networking mode between multiple modules under test 203 through the first configuration unit 2011, and then the electronic device can control the connection between one or more modules under test 203 and the HIL device 202 through the second configuration unit 2012. The conduction of the signal link between.

In related technologies, the I/O mapping relationship between the simulation model 2041 and the HIL device 202 requires manual association. In this embodiment of the present application, the electronic device may determine a third mapping relationship between the simulation model 2041 in the first processor 2042 and the HIL device 202 based on the second mapping relationship and the first mapping relationship. Finally, the electronic device can form a closed loop with the module under test 203 and the simulation model 2041 running in the first processor 2042 .

Please refer to Figure 3B, Figure 3B is a schematic flowchart of a signal connection method provided by the embodiment of this application, this method can be applied to the system shown in Figure 2A, and the signal shown in Figure 3A can be realized through the method shown in Figure 3B connect. The signal connection method shown in Figure 3B includes but is not limited to the following steps:

Step S301: Configuring a first mapping relationship through a signal connection device.

Specifically, in the HIL test, port configuration between the module to be tested and the HIL device is a necessary part of the HIL test. Generally, a signal connection device can be connected in series between the module to be tested and the HIL device, and the electronic device can be configured through the signal connection device. The signal mapping between the module and the HIL device, that is, the first mapping relationship. Further, the HIL device may include a device installed with an I/O board. Therefore, the first mapping relationship may be a signal mapping between the module under test and the I/O board of the HIL device.

In a possible implementation, one or more modules to be tested can be connected to the signal connection device. When multiple modules to be tested are connected to the signal connection device, the electronic equipment can set multiple The networking mode between the test modules. For example, the module to be tested A, the module to be tested B, the module to be tested C and the module to be tested D are respectively connected to the signal connecting device. The electronic equipment can set the communication link between the module A to be tested and the module B to be tested, the communication link between the module B to be tested and the module C to be tested, and the communication link between the module C to be tested and the module D to be tested through the signal connection device. The link between, the communication link between the module D under test and the module C under test. Therefore, the module to be tested A, the module to be tested B, the module to be tested C and the module to be tested D can form a ring networking mode.

Further, the signal connection device includes a plurality of ports, wherein the ports may include Ethernet ports or control area network (CAN) ports. The electronic device can set multiple port identifiers corresponding to each port through the signal connection device, and then the electronic device can set a networking mode among multiple modules under test based on the port identifiers. Furthermore, multiple modules to be tested are connected to the signal connection device through multiple ports, for example, module A to be tested is connected to the signal connection device through the first port, and module B to be tested is connected to the signal connection device through the second port. On the device, the module C to be tested is connected to the signal connection device through the third port, and the module D to be tested is connected to the signal connection device through the fourth port.

Furthermore, when it is necessary to configure the networking mode between multiple modules to be tested, the electronic device can obtain configuration information about the networking mode, for example, the configuration information can include the required To establish a communication link, a communication link needs to be established between the module B to be tested and the module C to be tested, and a connection needs to be established between the module C to be tested and the module A to be tested. Therefore, after the electronic device acquires the configuration information about the networking mode, it can configure the networking mode among multiple modules under test based on the configuration information. That is, the electronic device may set the second link between the first module under test and the second module under test based on the port identifier, and then set the networking mode among the multiple modules under test based on the second link. Among them, the first module to be tested and the second module to be tested belong to the above-mentioned multiple modules to be tested, the port identification is the identification corresponding to the port of the signal connection device, the first module to be tested and the second module to be tested are the configuration information that needs to be established Modules for communication links.

In a possible implementation manner, after the electronic device obtains the configuration information about the networking mode, the electronic device may set the identifier of the second port based on the identifier of the first port. Set the first port identification and the second port identification to be the same, the first port identification is the identification corresponding to the first port of the signal connection device, and the first port is the port on which the first module to be tested is connected to the information connection device; The two-port identification is the identification corresponding to the second port of the signal connection device, and the second port is the port through which the second module to be tested is connected to the signal connection device. Then, under the situation that the first port identifier is the same as the second port identifier, the electronic device can forward the first Ethernet message to the second module under test through the second port according to the identifier of the first port, so as to realize setting the first Ethernet packet through the port identifier. A second link between a module under test and a second module under test. That is, after receiving the first Ethernet packet of the first module-under-test through the first port, the electronic device adds the identifier of the first port to the first Ethernet packet. Furthermore, the electronic device may transmit the first Ethernet packet to the second port that has the same identifier as the first port according to the identifier of the first port. Since the second port is the port through which the second module under test is connected to the signal connection device, the first Ethernet packet from the first module under test can be transmitted to the second module under test. When the first Ethernet message is forwarded from the first module under test to the second module under test, the second link between the first module under test and the second module under test can be determined. Therefore, the electronic device can set the second link between the first module under test and the second module under test based on the port identifier.

In a possible implementation, after the electronic device obtains the configuration information about the networking mode, the electronic device can configure the port connection relationship through the signal connection device. The port connection relationship represents the connection relationship between ports, including the port identification . For example, the port connection relationship includes: a connection between a first port identifier and a second port identifier, a connection between a third port identifier and a fourth port identifier, and the like. After receiving the Ethernet message from the first module under test through the first port, the electronic device may add the first port identifier to the Ethernet message from the first module under test. Wherein, the first port identifier is an identifier corresponding to the first port of the signal connection device. When the port forwarding relationship is a connection between the first port identifier and the second port identifier, the electronic device may forward the second Ethernet packet added with the first port identifier to the second port where the second port identifier is located according to the port connection relationship. Because the second port is the port through which the second module under test is connected to the signal connection device, the electronic device can forward the Ethernet message to the second module under test through the second port. When the first Ethernet message is forwarded from the first module under test to the second module under test, the second link between the first module under test and the second module under test can be determined. Therefore, the electronic device sets the second link between the first module under test and the second module under test based on the port identifier.

Finally, the electronic device can set a networking mode among multiple modules under test based on the second link, and then can realize networking configuration of different modules under test, and realize resource pooling of the modules under test. For example, for module A to be tested, module B to be tested, and module to be tested C, the second link may include a communication link between module A to be tested and module B to be tested, and module B to be tested and module to be tested A communication link between C, and a communication link between the module under test C and the module under test A, therefore, the electronic device can set the module under test A, the module under test B and the module under test C based on the second link The networking mode among them is, for example, ring networking. It is understandable that in the development process of some functions such as automobiles and aerospace, a new function can only be verified by the cooperation of multiple modules. Network mode to realize the verification of a certain function.

For example, the configuration information about the networking mode obtained by the electronic device is that the module A to be tested, the module B to be tested, and the module C to be tested form a ring networking mode. The electronic device can forward the first Ethernet packet from the module under test A to the second port (the module B under test is connected to the signal connection device) based on the port identification of the first port (the module A under test is connected to the signal connection device). port on the device), and then the first message can be forwarded to the module B to be tested. Therefore, the electronic device can set the second link between the module under test A and the module under test B based on the port identification of the first port. The electronic device can also forward the second message from the module under test B to the third port based on the second port identification (the identification of the port on which the module under test B is connected to the signal connection device) (the module under test C is connected to the signal connection device) port on the device), and then the second message can be forwarded to the module C to be tested. Therefore, the electronic device can set the second link between the module under test B and the module under test C based on the port identifier of the second port. Similarly, the electronic device can set the second link between the module C under test and the module A under test. Therefore, the electronic device can set the ring networking mode among the module under test A, the module B under test and the module C under test based on the second link.

After the electronic equipment sets the networking mode between multiple modules to be tested through the signal connection device, one or more modules to be tested can output control signals, and the electronic device can output the output signal from one or more modules to be tested through the signal connection device. The control signal is transmitted to the HIL device. Further, the electronic device can also control the conduction of the signal link between one or more modules under test and the HIL device through the signal connection device, thereby setting the first link between one or more modules under test and the HIL device. road. Based on the set networking mode and the first link, the electronic device can obtain the first mapping relationship, that is, the mapping relationship between the port of the module under test in the networking mode and the I/O port set by the HIL. For example, the module A to be tested, the module B to be tested, and the module C to be tested are in a ring networking mode, and the electronic equipment sets the first link between the module A to be tested and the HIL device through the signal connection device, Therefore, the first mapping relationship determined by the electronic device based on the set ring networking mode and the first link between the module under test A and the HIL device may include: port mapping between the module under test A and the module under test B , the port mapping between the module under test B and the module C under test, the port mapping between the module C under test and the module A under test, and the port mapping between the module A under test and the I/O port of the HIL device.

It can be understood that the port resources (such as I/O resources) at the HIL device are limited, and the electronic device can flexibly configure the port resources (such as I/O resources) of the HIL device through the signal connection device. For example, for a module to be tested that requires a functional test, the electronic device can conduct the signal link between the module to be tested and the HIL device through a signal connection device; for a module to be tested that does not need to perform a functional test, the electronic device can Close the signal link between the module under test and the HIL equipment through the signal connection device.

Step S302: Determine a third mapping relationship according to the first mapping relationship.

Specifically, the first processor is used to run the simulation model, the simulation model is a virtual model for simulating the function of the module to be tested, and the port of the module to be tested is a real electrical port, which cannot be directly connected with the virtual one in the first processor. Model connection. The HIL device can provide an I/O board, so the first processor can use the I/O board to obtain a real electrical port for the simulation model to connect with the module to be tested. Therefore, the first mapping relationship can be the mapping relationship between the port of the module to be tested and the I/O board port of the HIL device, so the electronic device can determine the simulation model in the first processor and the HIL based on the first mapping relationship. The signal mapping relationship between the I/O board ports of the device.

In a possible implementation manner, the electronic device may also acquire a second mapping relationship, where the second mapping relationship includes a signal mapping relationship between the first processor and the module under test. Then the electronic device configures the first mapping relationship according to the signal connection device, and finally, the electronic device can derive the first mapping relationship according to the signal mapping relationship between the first processor and the module under test, and the signal mapping relationship between the module under test and the HIL device. A signal mapping relationship between a processor and an HIL device.

Further, the electronic device may obtain a software assembly package of the physical component, and the software assembly package of the physical component includes a simulation model, a module to be tested, and a second mapping relationship. Therefore, the electronic device can obtain the signal mapping relationship between the simulation model in the first processor and the module to be tested from the physical component software package. According to the mapping relationship between the simulation model in the first processor and the module to be tested, and the signal mapping relationship between the module to be tested and the HIL device, the electronic device can derive the I/O resources of the first processor and the HIL device The mapping table, that is, the third mapping relationship.

Step S303: Control the connection relationship of the HIL test according to the third mapping relationship.

Specifically, after the electronic device obtains the third mapping relationship, it can connect the simulation module running in the first processor with the signal of the module under test according to the first mapping relationship, the second mapping relationship and the third mapping relationship. In this way, the simulation model and the module under test can communicate with each other, realizing the connection of the whole link signal in the HIL test. Therefore, the HIL device can issue instructions to the module under test, and the module under test can generate control signals according to the instructions. The HIL device can receive the control signal sent by the module under test, and control the simulation model to perform corresponding actions according to the control signal.

It should be noted that the electronic device mentioned in the embodiment of the present application may have a data processing capability and a data sending and receiving capability.

Please refer to FIG. 4 , which is a schematic diagram of a signal connection device 201 provided by an embodiment of the present application. Wherein, the signal connection device 201 is used for controlling the signal connection between the model under test and the HIL device in the signal connection method shown in FIG. 3B . It can be seen from FIG. 4 that the signal connection device 201 may include a first configuration unit 401 and a second configuration unit 402 . The module to be tested can be plugged into the first configuration unit 401 of the signal connection device 201 through the first Ethernet port provided by the PHY chip, and the HIL device can be plugged into the signal connection device 201 through the second Ethernet port provided by the switch. The first configuration unit 401 . The module to be tested can also be plugged into the second configuration unit 402 of the signal connection device 201 through the first low-speed communication port, and the HIL device can also be plugged into the second configuration unit 402 of the signal connection device 201 through the second low-speed communication port. It should be noted that the low-speed communication port is a port with a lower transmission rate than the Ethernet port. Wherein, the Ethernet can be a vehicle Ethernet or a standard Ethernet, the vehicle Ethernet is connected to the module to be tested, and the standard Ethernet is connected to the HIL device. Low-speed communication includes but not limited to Controller Area Network (CAN), Local Interconnect Network (LIN), digital signal (DI/DO), analog signal (AD/DA), transmission pulse width modulation (Pulse Width Modulation, PWM) signal, and so on.

Among them, the signal connection device 201 can complete the connection of two types of signals, one is low-speed I/O signals transmitted through low-speed communication ports, such as analog signals, logic signals, low-speed transmission signals, and signals sensitive to electrical characteristics. The other is a high-speed signal transmitted through the vehicle Ethernet. The number of modules to be tested plugged into the first configuration unit 401 is multiple, and the first configuration unit 401 can set a networking mode between a plurality of modules to be tested, that is, a vehicle-mounted Ethernet network, to realize the module to be tested. resource pooling. The second configuration unit 402 can control the conduction of the signal link (for example, a low-speed signal link) between the module under test and the HIL device in the networking mode, so as to realize I/O resource pooling of the HIL device.

As can be seen from FIG. 4, the first configuration unit 401 may include a switch, one or more port physical layer (Port Physical Layer, PHY) chips, and one or more micro control units (Micro Control Unit, MCU). Wherein, one or more PHY chips can be integrated with the switch on the same chip. Among them, the module to be tested can be plugged into the vehicle Ethernet PHY chip through the vehicle Ethernet (Automotive Ethernet) port, and the vehicle Ethernet message from the vehicle vehicle PHY chip can be converted into a standard general Ethernet message, and then The standard general Ethernet packet is transmitted to the switch, and the switch may specifically be a virtual local area network (Virtual Local Area Network, VLAN) switch. The first configuration unit 401 can use the VLAN mode to set the networking mode between multiple modules under test through the switch, that is, the vehicle Ethernet port of the module under test that needs to be turned on is connected to the Ethernet port of the VLAN switch through the PHY chip Configure the Ethernet port of the VLAN switch connected to the vehicle-mounted Ethernet port with the same port identifier (such as VLAN ID) or establish a forwarding relationship to limit the broadcast of Ethernet packets within the connection range, and then complete the virtual circuit switching between Ethernet ports . It can be understood that the networking protocol required for the networking between the modules under test, such as rapid spanning tree protocol (rapid spanning tree protocol, RSTP), is not sensitive to VLAN configuration, so it will not affect the networking message transmission.

For example, the first configuration unit can set port identifiers of multiple Ethernet ports on the VLAN switch, and set a networking mode among multiple modules to be tested based on the port identifiers. Further, the first configuration unit can set the second link between the first module under test and the second module under test based on the port identification, and then set the networking mode among multiple modules under test based on the second link . That is to say, the electronic device can transmit the Ethernet message from the first module under test to the second module under test based on the first port identifier, so as to set the second link between the first module under test and the second module under test. road. The first port identifier is an identifier corresponding to the first port of the first module to be tested, and the first port is a port connected to the first module to be tested and the first configuration unit, that is, a port connected to the VLAN switch. The first configuration unit may obtain a networking mode between the modules under test based on at least one transmission path formed between the modules under test.

Please refer to FIG. 5A . FIG. 5A is a schematic diagram of a networking mode among modules to be tested provided by an embodiment of the present application. As shown in (a) of FIG. 5A , the module to be tested A, the module to be tested B, the module to be tested C, the module to be tested D and the module to be tested F are plugged into ports of the switch through the PHY chip. Therefore, there are fixed connections between the module to be tested A, the module to be tested B, the module to be tested C, the module to be tested D and the module to be tested F and the switch. Configuration information about the networking mode can be received in the first configuration unit 401, for example, the configuration information can be that the networking mode between the module to be tested A, the module to be tested B, the module to be tested C and the module to be tested D is a ring In networking, there is a point-to-point connection between the module D to be tested and the module F to be tested.

In the case that the module under test A and the module under test B are connected to the switch, for the connection between the module under test A and the module under test B, the first configuration unit can be based on the first port identification (that is, the module under test A The identification of the first port connected to the switch) sets the second port identification (that is, the identification of the second port of the module B to be tested connected to the switch), and the second port identification is set to be the same as the first port identification. After the module A to be tested sends the first Ethernet message without the VLAN tag, when the Ethernet message without the VLAN tag enters the switch port, the first configuration unit 401 adds the first port identifier to the port from the port to be tested according to the VLAN configuration of the first port. in the first Ethernet packet of module A. In this way, the first configuration unit 401 may broadcast the first Ethernet packet to which the identifier of the first port is added to the second port according to the identifier of the first port. After the second port receives the Ethernet message added with the identification of the first port, the first configuration unit 401 can remove the identification of the first port according to the VLAN configuration of the port, and pass the first Ethernet message without the VLAN tag through the second port. The text is sent to the module B under test. In this way, the first configuration unit 401 can obtain the second link between the module A under test and the module B under test. In the same way, for the connection between the module under test B and the module under test C, the connection between the module C under test and the module D under test, the connection between the module D under test and the module A under test, and the Connection between module D and module F under test. The first configuration unit 401 can obtain the above-mentioned transmission path between the modules to be tested through VLAN configuration of the switch.

In a possible implementation, for the connection between the module under test A and the module under test B, the first configuration unit 401 can configure the Ethernet packet forwarding relationship between the Ethernet ports of the switch, for example, the first port ( That is, the Ethernet packet received by the module A to be tested (connected to the first port on the switch) is forwarded to the second port (ie, the second port of the module B to be tested connected to the switch). In this way, after the module A to be tested sends the second Ethernet packet without the VLAN tag, when the second Ethernet packet without the VLAN tag enters the switch port, the first configuration unit 401 configures the VLAN configuration of the first port according to the VLAN configuration of the first port. The identifier is added to the Ethernet message from module A under test. In this way, the first configuration unit 401 can broadcast the second Ethernet packet added with the first port identifier to the second port according to the Ethernet packet forwarding relationship configured by the switch. After the second port receives the second Ethernet message added with the identification of the first port, the first configuration unit 401 can remove the identification of the first port according to the VLAN configuration of the port, and pass the Ethernet message without the VLAN tag through the second port. The text is sent to the module B under test. In this way, the first configuration unit 401 can obtain the second link between the module A under test and the module B under test. For the connection between the module under test B and the module C under test, the connection between the module C under test and the module D under test, the connection between the module D under test and the module A under test, and the connection between the module D under test and the module under test Connections between modules F. The first configuration unit 401 can obtain the above-mentioned transmission path between the modules to be tested through VLAN configuration of the switch.

Therefore, the first configuration unit 401 can obtain the networking mode shown in (b) of FIG. 5A based on the transmission path between the above-mentioned modules to be tested.

Further, the first configuration unit 401 can change the VLAN configuration to realize different networking modes among the modules to be tested. For example, when the first configuration unit 401 sets the networking mode between the module under test A, the module under test B, the module under test C, the module under test D and the module under test E according to the received configuration information, as shown in Figure 5A After that shown in (b), the first configuration unit 401 receives the configuration information again, and the first configuration unit 401 can change the configuration of the switch to implement a new networking mode.

Please refer to FIG. 5B . FIG. 5B is a schematic diagram of another networking mode between the modules to be tested provided by the embodiment of the present application. As shown in (a) of Figure 5B, the configuration information received by the first configuration unit 401 includes: the module to be tested A, the module to be tested D and the module to be tested are ring networking, the module to be tested B and the module to be tested There is a point-to-point connection between the modules C, and a point-to-point connection between the module D to be tested and the module C to be tested.

The first configuration unit 401 can delete the originally set second port identifier (that is, the second port on which the module under test B is connected to the switch), and based on the first port identifier (that is, the first port on which the module under test A is connected to the switch) Port identification) resets the third port (that is, the identification of the third port where the module F to be tested is connected to the switch), and the third port identification is set to be the same as the first port identification. In this way, after the module A to be tested sends the Ethernet message without the VLAN tag, when the Ethernet message without the VLAN tag enters the switch port, the first configuration unit 401 adds the first port identifier to the port from the port to be tested according to the VLAN configuration of the first port. In the Ethernet packet of the test module A. In this way, the first configuration unit 401 may broadcast the Ethernet packet added with the first port identifier to the third port according to the first port identifier. After the third port receives the Ethernet message added with the first port ID, the first configuration unit 401 can remove the ID of the first port according to the VLAN configuration of the port, and send the Ethernet message without the VLAN tag to the waiting port through the third port. The test module F sends. In this way, the first configuration unit 401 can obtain the link between the module A under test and the module F under test.

In a possible implementation, the first configuration unit 401 can reconfigure the Ethernet packet forwarding relationship between the Ethernet ports of the switch, for example, the first port (that is, the first port where the module A to be tested is connected to the switch) ) forwards the received Ethernet message to the third port (that is, the third port where the module F to be tested is connected to the switch). In this way, after the module A to be tested sends the Ethernet message without the VLAN tag, when the Ethernet message without the VLAN tag enters the switch port, the first configuration unit 401 adds the first port identifier to the port from the port to be tested according to the VLAN configuration of the first port. In the Ethernet packet of the test module A. In this way, the first configuration unit 401 can broadcast the Ethernet packet added with the first port identifier to the third port according to the Ethernet packet forwarding relationship configured by the switch, and the third port receives the Ethernet packet added with the identifier of the first port Afterwards, the first configuration unit 401 may remove the identifier of the first port according to the VLAN configuration of the port, and send the Ethernet packet without the VLAN tag to the module F to be tested through the third port. In this way, the first configuration unit 401 can obtain the link between the module A under test and the module F under test.

Therefore, the first configuration unit 401 can change the networking mode shown in (b) of FIG. 5A to the networking mode shown in (b) of FIG. 5B by changing the VLAN configuration.

After the first configuration unit 401 sets the networking mode between the modules under test, the second configuration unit 402 can set the first link between one or more modules under test and the HIL device. It can be understood that the module to be tested needs to output the low-speed I/O signal to the HIL device through the signal connection device 201, and the HIL device outputs the low-speed I/O signal to the first processor, and the simulation model running in the first processor uses It is used to simulate the operating state based on the low-speed I/O signal, which is an electrical signal generated by the module under test. Because the relay has little influence on the electrical properties, and the upper limit of the power carried is high, it is suitable for the switching of low-speed I/O and power output lines. Therefore, it can be seen from FIG. 4 that the second configuration unit includes one or more control switches, which may specifically be relays, and one or more micro control units MCU. One or more control switches are located on the signal link between the first low-speed port where the module to be tested is plugged into the second configuration unit 402 and the second low-speed port where the HIL device is plugged into the second configuration unit 402. The configuration unit 402 can control the conduction of the signal link between the one or more modules under test and the HIL device through a relay, so as to set the first link between the one or more modules under test and the HIL device. For example, if the module A to be tested is required to output low-speed I/O signals to the HIL device, the electronic device can open the control switch on the signal link between the module A to be tested and the HIL device, so that the signal link is in the conducting state. pass status.

It should be noted that the number of relays can be determined according to the utilization rate of I/O resources and computing resources of the HIL device. If the resource utilization rate of the HIL device is relatively low, it is suitable to configure a higher number of relays to improve the resource utilization rate of the HIL device. . The second configuration unit 402 can control the selective conduction of the relay through the micro control unit MCU, that is, different relays are turned on, and different signal links are turned on. Therefore, only when the relay is turned on, can the module under test be connected to the HIL device through the signal connection device 201 to obtain the I/O resources provided by the HIL device. Therefore, the second configuration unit 402 can allocate the I/O resources on the HIL device to different modes to be tested according to actual needs, and can realize I/O resource pooling of the HIL device.

Please refer to FIG. 6 , which is a schematic diagram of an HIL test provided in an embodiment of the present application. The method shown in Figure 3B can be applied to model testing and bench testing, wherein, in model testing, the module to be tested and the simulation model in the first processor form a closed-loop link, and in bench testing, the module to be tested and the physical component Form a closed loop link. That is, after the electronic device implements the full-link signal connection between the battery management system in the module-to-be-tested module 203 and the battery model running in the first processor 2042 in the model test through the signal connection device 201 according to the signal connection method shown in FIG. The electronic device can also switch the model test to the bench test through the signal connection device 201, wherein the bench test includes physical components in the form of objects of the simulation model. For example, the solid component may include a solid motor in the form of an object corresponding to the motor model.

Further, the electronic device can close the signal link between the part of the simulation model running in the first processor 2042 and the part of the model to be tested in the model test through the signal connection device 201 . For example, the electronic device can close the signal connection between the motor model and the motor controller through the signal connection device 201 . Still further, the electronic device can close the signal connection between the motor model and the motor controller through the relay in the signal connection device 201 . Wherein, the relay is located on the signal link between the motor model and the motor controller, and when the relay is turned off, the signal link between the motor model and the motor controller is also turned off.

One or more physical components can be plugged into the signal connection device 201 , or one or more physical components can be plugged into the signal connection device 201 through the HIL device. Therefore, after the electronic device closes the signal link between the part of the simulation model 2041 run by the first processor and the part of the model to be tested in the model test, the platform can be turned on through the signal connection device 201 based on the signal connection method shown in FIG. 3B The signal link between some physical components and some equipment under test in the rack test. It can be understood that the physical component that turns on the signal link is the physical component of the simulation model 2041 that turns off the signal link. It can be seen from FIG. 6 that the electronic device can conduct the signal connection between the physical motor and the motor controller through the signal connection device 201 . Still further, the electronic device can conduct the signal connection between the physical motor and the motor controller through the relay in the signal connection device 201 . Wherein, the relay is located on the signal link between the physical motor and the motor controller, and when the relay is turned on, the signal link between the physical motor and the motor controller is also turned on.

It can be understood that when both the physical component and the simulation model 2041 are plugged into the signal connection device 201, the electronic device can switch between the HIL test and the bench test through the signal connection device 201, so as to realize hybrid simulation and HIL test and bench test. Comparing the simulation results.

Please refer to FIG. 7 . FIG. 7 is a schematic diagram of implementing an HIL test based on cloud computing services provided by an embodiment of the present application. The cloud computing service 700 includes the first processor 2042 deployed on the cloud server, the HIL device 202, the signal connection device 201, and one or more modules 203 to be tested. The cloud computing service 700 may also include a Electronics 704. Wherein, the simulation model can be deployed in the first processor 2042, and one or more modules to be tested 203 are connected to the I/O boards in the HIL device 202 through the signal connection device 201. Therefore, the first processor running the simulation model The processor 2042 can perform simulation model and signal processing on the module under test 203 . A real-time operating system is installed on the first processor 2042 to ensure the real-time performance of the simulation.

When one or more user equipments located locally (only three are shown in FIG. 7, for example, the first user equipment 7051, the second user equipment 7052, and the third user equipment 7053) have HIL test requirements, the first user equipment 7051, the second user equipment 7052, and the third user equipment 7053 may respectively send respective test requests to the electronic device 704 located in the cloud computing service 700. It can be understood that the user equipment side may display multiple components of the module to be tested, and each component corresponds to a resource of the module to be tested on the cloud computing service 700 . Wherein, the user equipment may display a user interface, and a commonly used form of the user interface is a graphical user interface (graphic user interface, GUI), which refers to a user interface related to computer operations displayed in a graphical manner. It may be an icon, window, control and other component elements displayed on the display screen of the user equipment. Wherein, the control may include visual component elements such as icons, buttons, menus, tabs, text boxes, dialog boxes, status bars, and navigation bars. Users can visually organize these components through user equipment to obtain target components (or test instances) that meet their own needs, and then send a test request for the components containing the target module to be tested to the electronic device 704 located in the cloud computing service 700 . After receiving the test request from the user equipment, the electronic device 704 may construct a test instance according to the test request. Wherein, the test instance is used for the resource of the target module under test corresponding to the test request to be used by the user equipment. It can be understood that the resources of the module to be tested may be the functional resources of the module to be tested deployed on the cloud computing service, such as components, sensors, actuators, or functions that can be realized by an application program, or used for Resources to verify the functionality of the module under test, such as simulation models, I/O ports of HIL devices, and so on.

Further, after receiving the test request from the user equipment, the electronic device 704 can determine the target module to be tested and the I/O port according to the test request, wherein the I/O port is a port on the HIL device, so that the target module to be tested and The first processor can communicate. The electronic device 704 can assign corresponding target modules to be tested to the user equipment according to the test request, for example, which modules to be tested specifically correspond to the test request, the networking mode between the modules to be tested, and which module or modules to be tested Communicate with the first processor.

Then, the electronic device 704 can determine the number of I/O ports required by the target component according to the target module under test, for example, which or which modules under test in the target component need to communicate with the first processor, the electronic device 704 Allocate the I/O port on the I/O board to the target component through HIL board resource management. Therefore, the electronic device 704 can target the resources and I/O ports of the module under test to build a test instance, and the module under test corresponding to the target component can perform data interaction with the simulation model running in the first processor, so as to realize the user equipment. Test request.

Please refer to FIG. 8 . FIG. 8 is a schematic diagram of resource allocation provided by an embodiment of the present application. It can be seen from Fig. 8 that the first user equipment 7051 can provide the components of the module under test including 300 ports, and the user can arrange the components of the module under test including 150 ports according to the components of the module under test provided by the first user equipment 7051. Test request for module instance 1. After the number of ports determined by the electronic device 704 according to the components of the target module under test (that is, the module under test instance 1) contained in the test request received from the first user device 7051 is 150, the electronic device 704 can be the first user device The 7051 allocates 150 ports on the signal connection device 201 . The second user equipment 7052 can provide the components of the module under test including 150 ports, and the user can arrange the test request of the module under test instance 2 including 50 ports according to the components of the module under test provided by the second user equipment 7052 . After the number of ports determined by the electronic device 704 according to the components of the target module under test (that is, the module under test instance 2) contained in the test request received from the second user device 7052 is 50, the electronic device 704 can be the second user device The 7052 allocates 50 ports on the signal connection device 201 . The third user equipment 7053 can provide the components of the module under test including 225 ports, and the user can arrange the test request of the module under test instance 3 including 100 ports according to the components of the module under test provided by the third user equipment 7053 . After the number of ports determined by the electronic device 704 according to the components of the target module under test (that is, the module under test instance 3) contained in the test request received from the third user device 7053 is 100, the electronic device 704 can be the third user device The 7053 allocates 100 ports on the signal connection device 201 . The I/O resource mapping relationship between the I/O board and the signal connection device 201 is stored in the HIL board resource management, therefore, for the module instance 1 to be tested, the electronic device 704 can be obtained from the HIL board resource management Get 150 I/O ports on the I/O board that can communicate with HIL devices. For the example 2 of the module to be tested, the electronic device 704 can obtain 50 I/O ports on the I/O board that can communicate with the HIL device from the resource management of the HIL board. For the example 3 of the module under test, the electronic device 704 can obtain 100 I/O ports on the I/O board that can communicate with the HIL device from the resource management of the HIL board.

Therefore, the electronic device 704 can allocate the resources required by the HIL test instance from the I/O resource pool and the module resource pool to be tested according to the needs of the user equipment, thereby meeting different and expensive HIL test requirements and improving the utilization rate of HIL test resources .

In addition, the signal mapping relationship between the module to be tested 203 and its corresponding simulation model running on the first processor is stored in the cloud computing service 700 . Therefore, the electronic device 704 can determine the fourth mapping relationship between the target module under test and the target simulation model running in the first processor according to the resources of the target module under test, where the target simulation model is the running The model in the first processor 2042.

Further, after the electronic device 704 can determine the target module under test according to the target component in the test request, it can set the networking mode between the target modules under test through the signal connection device 201, and then control the networking mode through the signal connection device 201 The conduction of the signal link between the target module under test and the HIL device 202 is based on the set networking mode and the conducted signal link to obtain the signal connection relationship between the target module under test and the HIL device. It can be understood that, because the port of the target module under test on the signal connection device 201 is determined, the electronic device 704 can obtain the connection between the signal connection device 201 and the I/O board in the HIL device 202 from the HIL board resource management. The I/O resource mapping relationship among them can determine the I/O port through which the target module under test communicates with the I/O board on the HIL device 202 . Therefore, the electronic device 704 can determine the signal mapping relationship (ie, the fifth mapping relationship) between the target module under test and the I/O board in the HIL device 202 according to the I/O port.

Finally, the electronic device 704 may determine a sixth mapping relationship between the first processor and the I/O board of the HIL device according to the fourth mapping relationship and the fifth mapping relationship. Therefore, the electronic device 704 can construct the connection relationship in the test instance based on the sixth mapping relationship, and the target simulation model running in the first processor and the target module to be tested can communicate with each other, realizing the connection of the full link signal in the HIL test, The electronic device 704 may send the HIL simulation test result to the user equipment.

It can be seen from Figure 8 that the model instance 1 to be tested is a test instance programmed by the user through the first user device 7051, and the vehicle model instance 1 that can perform functional tests on the module instance 1 to be tested runs in the first processor, based on cloud The calculation service 700 may complete the test of the model instance 1 to be tested to obtain a test result, and send the test result to the first user equipment 7051 .

The model instance 2 to be tested is a test instance arranged by the user through the second user equipment 7052. The vehicle model instance 2 that can perform functional tests on the module instance 2 to be tested runs in the first processor, and the cloud computing service 700 can complete the test instance. The test of model instance 2 obtains test results, and sends the test results to the second user equipment 7052 .

The model instance 3 to be tested is a test instance arranged by the user through the third user device 7053. The vehicle model instance 3 that can perform functional tests on the module instance 3 to be tested runs in the first processor, and the cloud computing service 700 can complete the test instance. The test of model instance 3 obtains the test result, and sends the test result to the third user equipment 7053 .

It should be noted that the 300 ports of the signal connection device shown in FIG. 8 are used as an example, and the embodiment of the present application does not impose any limitation on the ports of the signal connection device, and the number of ports can be determined according to actual conditions. The first user equipment 7051, the second user equipment 7052 and the third user equipment 7053 may be devices deployed in different geographical locations.

Please refer to FIG. 9. FIG. 9 is a schematic structural diagram of a signal connection device 900 provided by an embodiment of the present application. The signal connection device may be an electronic device, or a device in the electronic device, such as a chip, a software module, an integrated Electronic control, etc., the signal connection device 900 is used to implement the aforementioned signal connection method, such as the signal connection method in the embodiment shown in FIG. 3B . The signal connection device 900 includes a control unit 901 , a processing unit 902 and a connection unit 903 .

The control unit 901 is configured to configure the first mapping relationship through the signal connection device, the first mapping relationship includes the signal connection relationship between the module to be tested and the hardware-in-the-loop HIL device, and the HIL device is used to run the function of the module to be tested for testing. simulation model;

The processing unit 902 is configured to determine a third mapping relationship according to the first mapping relationship, where the third mapping relationship includes a signal mapping relationship between the first processor and the HIL device;

The connection unit 903 is configured to control the connection relationship of the HIL test according to the third mapping relationship.

In a possible implementation manner, the signal connection device 900 belongs to a test system, such as the system shown in FIG. 2A .

In a possible implementation manner, the signal connection device 900 further includes an acquiring unit 904, configured to acquire a second mapping relationship, where the second mapping relationship includes a signal mapping relationship between the first processor and the module under test.

In a possible implementation manner, the processing unit 902 is specifically configured to determine a third mapping relationship between the first processor and the HIL device according to the second mapping relationship and the first mapping relationship.

In a possible implementation manner, the control unit 901 is specifically configured to:

Setting the networking mode between multiple modules to be tested through the signal connection device;

Setting the first link between one or multi-core modules under test and the HIL equipment through the signal connection device;

The first mapping relationship is determined based on the set networking mode and the first link, so as to configure the first mapping relationship through the signal connection device.

In a possible implementation manner, the signal connection device 900 includes multiple ports, and the control unit 901 is specifically used for:

Setting a plurality of port identifications corresponding to the plurality of ports through the signal connection device;

Set the networking mode between multiple modules under test based on the port identification.

Set the second link between the first module to be tested and the second module to be tested based on the port identifier, wherein the module to be tested includes the first module to be tested and the second module to be tested, and the port identifier is The identification corresponding to the port of the signal connection device;

A networking mode among multiple modules to be tested is set based on the second link.

In the case that the first port identifier is the same as the second port identifier, determine the signal transmission between the first module under test and the second module under test, so as to realize setting the first module under test through the port identifier The second link between the module under test and the second module under test; wherein, the first port identification is the identification corresponding to the first port of the signal connection device, and the first port is the identification corresponding to the first port A port connected to a module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, and the second port is a port connected to the second module to be tested.

Determine the port connection relationship, the port connection relationship includes a first port identifier and a second port identifier, the first port identifier is the identifier corresponding to the first port of the signal connection device, and the first port is the identifier corresponding to the first port of the signal connection device. The port connected to the first module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, and the second port is a port connected to the second module to be tested;

Setting a second link between the first module under test and the second module under test based on the port connection relationship.

In a possible implementation manner, the port includes an Ethernet port or a control area network (CAN) port.

In a possible implementation manner, the signal connecting device is used for model testing and bench testing, and the bench testing includes a signal connecting device for physical components corresponding to the simulation model.

In a possible implementation manner, the connecting unit 903 is configured to construct a test instance according to the test request from the user equipment, and the test instance is used for the user equipment to use resources of the target module under test corresponding to the test request.

In a possible implementation manner, the processing unit 902 is configured to assign a corresponding target module to be tested and an I/O port to the user equipment according to the test request, and the I/O port is a port in the HIL device;

The connection unit 903 is configured to construct a test instance according to the target module to be tested and the I/O port.

It should be understood that for related descriptions, reference may also be made to the descriptions in the embodiment shown in FIG. 3B , and details are not repeated here.

Please refer to FIG. 10. FIG. 10 is a schematic structural diagram of a computing device 100 provided by an embodiment of the present application. The computing device 100 may be an independent device (such as one or more of a server, or a user device, etc.), or may be It is an internal component of an independent device (such as a chip, a software module or a hardware module, etc.). The computing device 100 may include at least one processor 1001 . Optionally, at least one memory 1003 may also be included. Further optionally, the computing device 100 may further include a communication interface 1002 . Further optionally, a bus 1004 may also be included, wherein the processor 1001 , the communication interface 1002 and the memory 1003 are connected through the bus 1004 .

Wherein, the processor 1001 is a module for performing arithmetic operations and/or logic operations, specifically, a central processing unit (central processing unit, CPU), a picture processing unit (graphics processing unit, GPU), a microprocessor (microprocessor unit, MPU) ), Application Specific Integrated Circuit (ASIC), Field Programmable Logic Gate Array (Field Programmable Gate Array, FPGA), Complex Programmable Logic Device (Complex programmable logic device, CPLD), coprocessor (assisting central processing One or more combinations of processing modules such as processors to complete corresponding processing and applications), Microcontroller Unit (MCU) and other processing modules.

Communication interface 1002 may be used to provide information input or output to at least one processor. And/or, the communication interface 1002 can be used to receive data sent from the outside and/or send data to the outside, and can be a wired link interface such as an Ethernet cable, or a wireless link (Wi-Fi, Bluetooth, General wireless transmission, vehicle short-range communication technology and other short-range wireless communication technologies, etc.) interface. Optionally, the communication interface 1002 may further include a transmitter (such as a radio frequency transmitter, an antenna, etc.) or a receiver coupled with the interface.

The memory 1003 is used to provide a storage space, in which data such as operating systems and computer programs can be stored. Memory 1003 can be random access memory (random access memory, RAM), read-only memory (read-only memory, ROM), erasable programmable read-only memory (erasable programmable read only memory, EPROM), or portable read-only memory One or more combinations of memory (compact disc read-only memory, CD-ROM), etc.

At least one processor 1001 in the computing device 100 is configured to execute the aforementioned signal connection method, such as the version management method described in the embodiment shown in FIG. 3B .

In a possible implementation manner, at least one processor 1001 in the computing device 100 is configured to execute calling computer instructions to perform the following operations:

Configuring the first mapping relationship through the signal connection device, the first mapping relationship includes the signal connection relationship between the module to be tested and the hardware-in-the-loop HIL device;

Determine a third mapping relationship according to the first mapping relationship, the third mapping relationship includes a third mapping relationship between the first processor and the HIL device, the first processor is used to run a simulation model, and the simulation model is for the described A model for simulating the function of the module under test;

The connection relationship of the HIL test is determined according to the third mapping relationship.

In yet another possible implementation manner, the processor 1001 is further configured to:

The second mapping relationship is obtained through the communication interface 1002, wherein the second mapping relationship includes a signal mapping relationship between the first processor and the module under test.

A third mapping relationship is determined according to the second mapping relationship and the first mapping relationship.

Configuring the first link between one or more modules to be tested and the HIL device through the signal connection device;

The first mapping relationship is obtained based on the set networking mode and the first link, so as to configure the first mapping relationship through the signal connection device.

Setting multiple port identifiers corresponding to multiple ports through the signal connection device;

Setting the second link between the first module under test and the second module under test based on the port identifier through the communication interface 1002, wherein the plurality of modules under test include the first module under test and the second module under test 2. The module to be tested, the port identification is the identification corresponding to the port of the signal connection device;

In yet another possible implementation manner, the above port includes an Ethernet port or a control area network (CAN) port.

In yet another possible implementation manner, the computing device may be used for model testing and bench testing, and the bench testing includes physical components corresponding to the simulation model.

In yet another possible implementation manner, the processor 1001 is further configured to: construct a test instance according to the test request from the user equipment, and the test instance is used for the user equipment to use resources of the target module under test corresponding to the test request.

In yet another possible implementation manner, the processor 1001 is also configured to: assign a corresponding target module to be tested and an I/O port to the user according to the test request; construct a test instance according to the target module to be tested and the I/O port .

The present application also provides a computer-readable storage medium, where instructions are stored in the computer-readable storage medium, and when the instructions are run on at least one processor, the aforementioned version management method is implemented, such as shown in FIG. 3B The signal connection method shown.

The present application also provides a computer program product, which includes computer instructions, and when executed by a computing device, realizes the aforementioned version management method, such as the signal connection method shown in FIG. 3B .

In the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations or descriptions. Any embodiment or design described herein as "exemplary" or "for example" is not to be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete manner.

The "at least one" mentioned in the embodiments of the present application refers to one or more, and the "multiple" refers to two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c may represent: a, b, c, (a and b), (a and c), (b and c), or (a and b and c), where a, b, c can be single or multiple. "And/or" describes the association relationship of associated objects, indicating that there may be three types of relationships, for example, A and/or B, which may indicate: A exists alone, A and B exist simultaneously, and B exists alone, among which A and B may be singular or plural. The character "/" generally indicates that the contextual objects are an "or" relationship.

And, unless otherwise stated, the embodiments of the present application use ordinal numerals such as "first" and "second" to distinguish multiple objects, and are not used to limit the order, timing, priority or importance of multiple objects degree. For example, the first user equipment and the second user equipment are only for the convenience of description, and do not represent the differences in structure, importance, etc. between the first user equipment and the second user equipment. In some embodiments, the first user equipment The device and the second user device may also be the same device.

As used in the above embodiments, depending on the context, the term "when" may be interpreted to mean "if..." or "after" or "in response to determining..." or "in response to detecting... ". The above are only optional embodiments of the application, and are not intended to limit the application. Any modifications, equivalent replacements, improvements, etc. made within the concept and principles of the application shall be included in the protection of the application. within range.

Those of ordinary skill in the art can understand that all or part of the steps for implementing the above embodiments can be completed by hardware, and can also be completed by instructing related hardware through a program. The program can be stored in a computer-readable storage medium. The above-mentioned The storage medium mentioned may be a read-only memory, a magnetic disk or an optical disk, and the like.

Claims

A signal connection method, characterized in that the method comprises:

Configuring the first mapping relationship through the signal connection device, the first mapping relationship includes the signal mapping relationship between the module to be tested and the hardware-in-the-loop HIL device;

Determine a third mapping relationship according to the first mapping relationship, the third mapping relationship includes a signal mapping relationship between the first processor and the HIL device; wherein the first processor is used to run a simulation model, the The simulation model is a model for simulating the function of the module to be tested;

Determine the connection relationship of the HIL test according to the third mapping relationship.
The method according to claim 1, wherein before determining the third mapping relationship according to the first mapping relationship, further comprising:

Acquiring a second mapping relationship, wherein the second mapping relationship includes a signal mapping relationship between the first processor and the module under test.
The method according to claim 1 or 2, wherein said determining a third mapping relationship according to said first mapping relationship comprises:

Determine the third mapping relationship according to the second mapping relationship and the first mapping relationship.
The method according to any one of claims 1 to 3, wherein configuring the first mapping relationship through the signal connection device includes:

Setting a networking mode between a plurality of modules under test through the signal connection device;

setting a first link between one or more modules under test and the HIL device through the signal connection device;

The first mapping relationship is determined based on the set networking mode and the first link, so as to configure the first mapping relationship through the signal connection device.
The method according to claim 4, wherein the signal connection device includes a plurality of ports, and setting a plurality of networking modes between the modules under test through the signal connection device includes:

Setting multiple port identifiers corresponding to the multiple ports through the signal connection device;

A networking mode among multiple modules under test is set based on the port identification.
The method according to claim 5, wherein the plurality of modules to be tested are respectively connected to the signal connection device through the plurality of ports, and the plurality of modules to be tested are set based on the port identification Networking mode between modules, including:

Setting a second link between the first module under test and the second module under test based on the port identifier, wherein the plurality of modules under test include the first module under test and the second module under test , the port identification is the identification corresponding to the port of the signal connection device;

A networking mode among multiple modules to be tested is set based on the second link.
The method according to claim 6, wherein said setting the second link between the first module under test and the second module under test based on the port identifier comprises:

In the case that the first port identifier is the same as the second port identifier, determine the signal transmission between the first module under test and the second module under test, so as to realize setting the first module under test through the port identifier The second link between the module under test and the second module under test; wherein, the first port identification is the identification corresponding to the first port of the signal connection device, and the first port is the identification corresponding to the first port A port connected to a module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, and the second port is a port connected to the second module to be tested.
The method according to claim 6, wherein said setting the second link between the first module under test and the second module under test based on the port identifier comprises:

Determine the port connection relationship, the port connection relationship includes a first port identifier and a second port identifier, the first port identifier is the identifier corresponding to the first port of the signal connection device, and the first port is the identifier corresponding to the first port of the signal connection device. The port connected to the first module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, and the second port is a port connected to the second module to be tested;

Setting a second link between the first module under test and the second module under test based on the port connection relationship.
The method according to any one of claims 5 to 8, characterized in that the port of the signal connection device includes an Ethernet port or a control area network (CAN) port.
The method according to any one of claims 1 to 9, wherein the method is applied to model testing and/or bench testing, and the bench testing includes physical components corresponding to the simulation model, and the physical A component is connected to the signal connection.
The method according to any one of claims 1 to 10, wherein after determining the connection relationship in the HIL test according to the third mapping relationship, further comprising:

Build test instances based on test requests from user devices.
The method according to claim 11, wherein said constructing a test instance according to a test request from a user equipment comprises:

Allocating a target module to be tested and an I/O port for the user equipment according to the test request, the I/O port being a port on the HIL device;

Constructing the test instance according to the target module to be tested and the I/O port.
A signal connection device, characterized in that the signal connection device is used to configure the connection between the module to be tested and the HIL setting, and the device includes a first configuration unit and a second configuration unit,

The first configuration unit is configured to set a networking mode between a plurality of modules to be tested;

The second configuration unit is configured to set one or more first links between the modules under test and the HIL device.
The device according to claim 13, wherein the first configuration unit includes a plurality of ports, and the first configuration unit is specifically used for:

Setting multiple port identifiers corresponding to the multiple ports;

A networking mode among multiple modules under test is set based on the port identification.
The device according to claim 14, wherein the plurality of modules to be tested are respectively connected to the first configuration unit through the plurality of ports, and the first configuration unit is specifically used for:

Setting a second link between the first module under test and the second module under test based on the port identifier, wherein the plurality of modules under test include the first module under test and the second module under test testing module, the port identification is the identification corresponding to the port of the signal connection device;

A networking mode among multiple modules to be tested is set based on the second link.
The device according to claim 15, wherein the first configuration unit is specifically used for:

In the case that the first port identifier is the same as the second port identifier, determine the signal transmission between the first module under test and the second module under test, so as to realize setting the first module under test through the port identifier The second link between the module under test and the second module under test; wherein, the first port identification is the identification corresponding to the first port of the signal connection device, and the first port is the identification corresponding to the first port A port connected to a module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, and the second port is a port connected to the second module to be tested.
The device according to claim 15, wherein the first configuration unit is specifically used for:

Determine the port connection relationship, the port connection relationship includes a first port identifier and a second port identifier, the first port identifier is the identifier corresponding to the first port of the signal connection device, and the first port is the identifier corresponding to the first port of the signal connection device. The port connected to the first module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, and the second port is a port connected to the second module to be tested;

Setting a second link between the first module under test and the second module under test based on the port connection relationship.
A test system, characterized in that the system comprises:

The signal connection device according to any one of claims 13 to 17;

Hardware-in-the-loop HIL test equipment, connected to the signal connection device;

The module to be tested is connected with the signal connection device.
The system according to claim 18, wherein the test system further comprises a first processor, the first processor is used to run a simulation model, and the simulation model is to simulate the function of the module to be tested the model;

The test system also includes a signal mapping relationship between the first processor and the module under test.
The system according to claim 18 or 19, wherein the test system runs on at least one of the following devices: public cloud devices, private cloud devices, or local devices.
A signal connection device, characterized in that the device includes:

The control unit is configured to configure a first mapping relationship through the signal connection device, and the first mapping relationship includes a signal connection relationship between the module to be tested and the hardware-in-the-loop HIL device;

a processing unit, configured to determine a third mapping relationship according to the first mapping relationship, where the third mapping relationship includes a signal mapping relationship between the first processor and the HIL device, wherein the first processor is used to Running the simulation model, the simulation model is a model for simulating the function of the module to be tested;

A connection unit, configured to determine a connection relationship of the HIL test according to the third mapping relationship.
The device of claim 21, further comprising:

An acquiring unit, configured to acquire a second mapping relationship, wherein the second mapping relationship includes a signal mapping relationship between the first processor and the module under test.
Apparatus according to claim 21 or 22, characterized in that,

The processing unit is specifically configured to determine the third mapping relationship according to the second mapping relationship and the first mapping relationship.
The device according to any one of claims 21 to 23, wherein the control unit is specifically used for:

Setting a networking mode between a plurality of modules under test through the signal connection device;

setting a first link between one or more modules under test and the HIL device through the signal connection device;

The first mapping relationship is determined based on the set networking mode and the first link, so as to configure the first mapping relationship through the signal connection device.
The device according to claim 24, wherein the device comprises a plurality of ports, and the control unit is specifically used for:

Setting multiple port identifiers corresponding to the multiple ports through the signal connection device;

A networking mode among multiple modules under test is set based on the port identification.
The device according to claim 25, wherein the plurality of modules to be tested are respectively connected to the device through the plurality of ports, and the control unit is specifically used for:

Setting a second link between the first module under test and the second module under test based on the port identifier, wherein the plurality of modules under test include the first module under test and the second module under test testing module, the port identification is the identification corresponding to the port of the signal connection device;

A networking mode among multiple modules to be tested is set based on the second link.
The device according to claim 26, wherein the control unit is specifically used for:

In the case that the first port identifier is the same as the second port identifier, determine the signal transmission between the first module under test and the second module under test, so as to realize setting the first module under test through the port identifier The second link between the module under test and the second module under test; wherein, the first port identification is the identification corresponding to the first port of the signal connection device, and the first port is the identification corresponding to the first port A port connected to a module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, and the second port is a port connected to the second module to be tested.
The device according to claim 26, wherein the control unit is specifically used for:

Determine the port connection relationship, the port connection relationship includes a first port identifier and a second port identifier, the first port identifier is the identifier corresponding to the first port of the signal connection device, and the first port is the identifier corresponding to the first port of the signal connection device. The port connected to the first module to be tested; the second port identification is the identification corresponding to the second port of the signal connection device, and the second port is a port connected to the second module to be tested;

Setting a second link between the first module under test and the second module under test based on the port connection relationship.
The device according to any one of claims 25 to 28, wherein the port comprises an Ethernet port or a control area network (CAN) port.
The device according to any one of claims 21 to 29, characterized in that, the device is used for model testing and/or bench testing, and the bench testing includes the physical component signal connection device signal corresponding to the simulation model Connect the device.
Apparatus according to any one of claims 21 to 30, characterized in that

The connection unit is configured to construct a test instance according to a test request from the user equipment.
Apparatus according to claim 31, characterized in that,

The processing unit is configured to allocate a corresponding target module to be tested and an I/O port for the user equipment according to the test request, and the I/O port is a port in the HIL device;

The connection unit is configured to construct a test instance according to the target module to be tested and the I/O port.
A computing device, characterized in that the computing device includes a second processor and a memory;

A computer program is stored in the memory;

When the second processor executes the computer program, the computing device performs the method of any one of the preceding claims 1 to 12.
A computer-readable storage medium, characterized in that instructions are stored in the computer-readable storage medium, and when the instructions are run on at least one processor, the method according to any one of claims 1 to 12 is realized. method.