WO2023022667A3 - Method of in-line manufacturing semiconductor devices and semiconductor devices thereof - Google Patents
Method of in-line manufacturing semiconductor devices and semiconductor devices thereof Download PDFInfo
- Publication number
- WO2023022667A3 WO2023022667A3 PCT/SG2022/050596 SG2022050596W WO2023022667A3 WO 2023022667 A3 WO2023022667 A3 WO 2023022667A3 SG 2022050596 W SG2022050596 W SG 2022050596W WO 2023022667 A3 WO2023022667 A3 WO 2023022667A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- semiconductor devices
- line manufacturing
- depositing
- organic halide
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- 150000004820 halides Chemical class 0.000 abstract 2
- 239000006096 absorbing agent Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000002243 precursor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
- H01L21/02288—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/50—Organic perovskites; Hybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/40—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Photovoltaic Devices (AREA)
Abstract
5 The present disclosure concerns a method of manufacturing a semiconductor device, comprising depositing a first layer comprising metal based inorganic precursor on a substrate; depositing a second layer comprising organic halide on the first layer; and heating both the first and second layers simultaneously in order to interdiffuse the second layer with the first layer to form an intermediate layer and to crystallise the 10 intermediate layer to form a perovskite absorber. The second layer of organic halide is deposited on the first layer using an in-line process.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG10202109092W | 2021-08-19 | ||
SG10202109092W | 2021-08-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2023022667A2 WO2023022667A2 (en) | 2023-02-23 |
WO2023022667A3 true WO2023022667A3 (en) | 2023-05-11 |
Family
ID=85241168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SG2022/050596 WO2023022667A2 (en) | 2021-08-19 | 2022-08-19 | Method of in-line manufacturing semiconductor devices and semiconductor devices thereof |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2023022667A2 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108258128A (en) * | 2018-01-17 | 2018-07-06 | 杭州纤纳光电科技有限公司 | A kind of perovskite solar cell with interface-modifying layer and preparation method thereof |
US20180208611A1 (en) * | 2014-08-05 | 2018-07-26 | Korea Research Institute Of Chemical Technology | Method for preparing inorganic/organic hybrid perovskite compound film |
CN108987586A (en) * | 2017-06-02 | 2018-12-11 | 颜步 | A kind of perovskite solar cell module and preparation method thereof |
CN110112296A (en) * | 2019-03-26 | 2019-08-09 | 北京宏泰创新科技有限公司 | A kind of preparation method of large area perovskite solar battery |
CN112952001A (en) * | 2019-12-10 | 2021-06-11 | 中国科学院大连化学物理研究所 | Perovskite solar cell and preparation method thereof |
-
2022
- 2022-08-19 WO PCT/SG2022/050596 patent/WO2023022667A2/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180208611A1 (en) * | 2014-08-05 | 2018-07-26 | Korea Research Institute Of Chemical Technology | Method for preparing inorganic/organic hybrid perovskite compound film |
CN108987586A (en) * | 2017-06-02 | 2018-12-11 | 颜步 | A kind of perovskite solar cell module and preparation method thereof |
CN108258128A (en) * | 2018-01-17 | 2018-07-06 | 杭州纤纳光电科技有限公司 | A kind of perovskite solar cell with interface-modifying layer and preparation method thereof |
CN110112296A (en) * | 2019-03-26 | 2019-08-09 | 北京宏泰创新科技有限公司 | A kind of preparation method of large area perovskite solar battery |
CN112952001A (en) * | 2019-12-10 | 2021-06-11 | 中国科学院大连化学物理研究所 | Perovskite solar cell and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
WO2023022667A2 (en) | 2023-02-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200605395A (en) | Method of fabricating an optoelectronic device having a bulk heterojunction | |
TW200629408A (en) | Atomic layer deposited titanium aluminum oxide films | |
WO2005101524A3 (en) | Method of fabricating an optoelectronic device having a bulk heterojunction | |
WO2006036366A3 (en) | Method of forming a solution processed device | |
WO2006107532A3 (en) | Single wafer thermal cvd processes for hemispherical grained silicon and nano-crystalline grain-sized polysilicon | |
WO2008123441A1 (en) | Polycrystalline thin film and method for producing the same and oxide superconductor | |
US20160315197A1 (en) | Thin-film transistor, preparation method thereof, array substrate and display device | |
CN107623087A (en) | Flexible OLED display panel and preparation method thereof | |
US20150171209A1 (en) | Thin film layer and manufacturing method thereof, substrate for display and liquid crystal display | |
WO2018196069A1 (en) | Manufacturing method for inorganic thin film transistor, and flexible display device | |
WO2019127689A1 (en) | Array substrate and manufacturing method therefor, and flexible oled display device | |
WO2013106166A1 (en) | Thin film semiconductors made through low temperature process | |
TW200500437A (en) | Method for producing smooth indium-tin-oxide layers on substrates and a substrate coating of indium-tin-oxide | |
TW200744162A (en) | Method for fabricating semiconductor device having capacitor | |
JP2010141306A5 (en) | ||
WO2012170166A3 (en) | Method and system for inline chemical vapor deposition | |
WO2019153430A1 (en) | Tft substrate and manufacturing method therefor, and oled substrate | |
WO2018133344A1 (en) | Thin-film transistor and preparation method therefor, display panel and display device | |
WO2023022667A3 (en) | Method of in-line manufacturing semiconductor devices and semiconductor devices thereof | |
WO2007017689A3 (en) | Nanorod thin-film transistors | |
CN101807667A (en) | Encapsulating device of organic photoelectronic device and encapsulating method thereof | |
WO2019085096A1 (en) | Method for manufacturing flexible oled display panel, and flexible oled display panel | |
WO2023022666A3 (en) | Semiconductor devices and methods of batch manufacturing thereof | |
WO2012018783A3 (en) | System and method for fabricating thin-film photovoltaic devices | |
WO2014173146A1 (en) | Thin film transistor, method of fabricating same, array substrate, and display apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NENP | Non-entry into the national phase |
Ref country code: DE |