WO2023021749A1 - Lighting device for inspection - Google Patents

Lighting device for inspection Download PDF

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Publication number
WO2023021749A1
WO2023021749A1 PCT/JP2022/009782 JP2022009782W WO2023021749A1 WO 2023021749 A1 WO2023021749 A1 WO 2023021749A1 JP 2022009782 W JP2022009782 W JP 2022009782W WO 2023021749 A1 WO2023021749 A1 WO 2023021749A1
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WIPO (PCT)
Prior art keywords
rigid substrate
inspection
light
soldered
lighting device
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PCT/JP2022/009782
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French (fr)
Japanese (ja)
Inventor
直人 松本
大祐 杉原
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株式会社 レイマック
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Priority to JP2023542201A priority Critical patent/JPWO2023021749A1/ja
Publication of WO2023021749A1 publication Critical patent/WO2023021749A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10—Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an inspection illumination device for irradiating an article with light from a plurality of LEDs in order to inspect the article.
  • inspection An inspection apparatus has been used to perform visual inspection for defects, scratches, stains, foreign matter, etc.).
  • Various inspection lighting devices are used depending on the article to be inspected. There are also those that irradiate the article from a direction close to the horizontal direction.
  • FIG. 3 of Patent Document 1 discloses an inspection lighting device in which a plurality of bullet-shaped LEDs (light-emitting elements) are arranged inwardly in an annular manner and slightly inclined toward the article side.
  • This inspection lighting device has a light reflecting surface inside the LED and on the side of the camera (illumination detection device). Irradiate the article.
  • FIG. 4 discloses an inspection illumination device in which a plurality of bullet-shaped LEDs are circularly arranged inward without being inclined toward the article.
  • This inspection illuminator has no light-reflecting surface and has a diffuser with a particularly high diffusing power inside the LEDs, which illuminates the article with light from the LEDs through this diffuser towards the article.
  • the inspection illumination device disclosed in FIGS. 3 and 4 illuminates a component attached to a substantially flat surface as an inspection object from a nearly horizontal direction.
  • the LEDs are slightly tilted toward the article side, and a diffuser having a particularly high diffusion capability is arranged.
  • the configuration is not simple, and the range of the distance between the inspection illumination device and the article, which can inspect the article, is limited.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide an inspection lighting device capable of widening the distance between an inspection lighting device capable of inspecting an article and an article with a simple configuration. It is to provide a device.
  • an inspection illumination device comprises a housing having an article-side light passage portion and a camera-side light passage portion; a long rigid substrate arranged in the length direction and soldered to the surface and bent into an annular shape so that the surface faces inward; An anode-side soldering portion to which the anode-side terminals of each of the plurality of chip LEDs are soldered, and cathode-side terminals of each of the plurality of chip LEDs are soldered to the surface of the rigid substrate.
  • the respective anode side soldering section and the respective cathode side soldering section extend parallel to each other in the longitudinal direction of the rigid substrate.
  • the light reflecting layer can be white or specular.
  • the rigid substrate may be a glass epoxy substrate or a glass composite substrate on which a conductor pattern is formed.
  • the inspection illumination device may further include a heat radiation sheet that is bent into a ring shape and is in contact with the rigid substrate.
  • the inspection lighting device of the present invention it is possible to widen the distance between the inspection lighting device capable of inspecting the article and the article with a simple configuration.
  • FIG. 1B is a cross-sectional view (a cross-sectional view taken along the line AA in FIG. 1B) showing the inspection illumination device according to the embodiment of the present invention; It is a bottom view which shows the lighting apparatus for an inspection same as the above, and is in the state which removed the housing bottom plate part.
  • FIG. 4 is a circuit diagram showing an example of a circuit realized by a rigid board of the inspection lighting device;
  • FIG. 3 is an external view showing the surface of the rigid substrate before the chip LED of the inspection lighting device is soldered;
  • FIG. 10 is an explanatory diagram for explaining the state of light in the inspection lighting device same as the above in a cross-sectional view, in the case where the distance between the inspection lighting device and the article is narrow.
  • FIG. 10 is an explanatory diagram for explaining the state of light in the same inspection illumination device with a cross-sectional view, in the case where the distance between the inspection illumination device and the article is wide.
  • An inspection illumination device 1 includes a housing 2 and a rigid board 3, as shown in FIGS. 1A and 1B.
  • the inspection illumination device 1 can be used with the article M to be inspected positioned below and the camera C for photographing the article M positioned above (see FIGS. 4 and 5 described later).
  • the inspection illumination device 1 has a cable 1a, and is used by connecting a connector 1b of the cable 1a to a light control device or the like (not shown).
  • the housing 2 supports the rigid board 3.
  • the housing 2 has an article-side light passage portion 2a through which light passes on the article M side, and a camera-side light passage portion 2b through which light passes on the camera C side.
  • the housing 2 can be configured by a housing body portion 2c and a housing bottom plate portion 2d below it.
  • the article-side light passage portion 2a is formed in the housing bottom plate portion 2d.
  • the housing 2 can be generally cylindrical with a low height.
  • the housing 2 is made of a metal material such as aluminum or copper, a resin material, or the like.
  • the housing 2 has a light reflecting layer 21 between the peripheral edge of the camera-side light passing portion 2b and the rigid substrate 3.
  • the light reflecting layer 21 reflects light and is white or specular, for example.
  • the light reflecting layer 21 may be a separate member from the rest of the housing 2 and attached, or may be coated on the housing 2 .
  • the rigid board 3 is arranged inside the housing 2 .
  • the rigid board 3 is a long one in which a plurality of chip LEDs 30 are arranged in the longitudinal direction and soldered to the surface, and is bent into an annular shape so that the surface faces inward (see FIG. 1B).
  • the rigid substrate 3 is thin enough to be bent into a circular shape.
  • a circularly bent heat dissipation sheet 4 can be provided around the rigid substrate 3, as shown in FIGS. 1A and 1B.
  • the heat dissipation sheet 4 can be in contact with the rigid board 3 .
  • the reference numeral 30 of the LED 30 is attached only to the central LED 30 in FIG. 1A and the left and right cross-sectional LEDs.
  • the side surfaces (surfaces in the thickness direction) of the LEDs 30 gradually become visible as they are arranged leftward or rightward from the center.
  • FIG. 2 shows a specific circuit example of the rigid substrate 3.
  • the number of chip LEDs 30 soldered to the rigid substrate 3 is 36, and 12 of the three chip LEDs 30 connected in series are connected in parallel.
  • a resistor 31 is also connected in series to each of the three chip LEDs 30 connected in series.
  • Each of the series-connected three chip LEDs 30 and the resistor 31 is connected to the plus side power supply wiring cord 1aa (more specifically, the conductor therein) and the minus side power supply wiring cord 1ab (more specifically, the conductor in it) included in the cable 1a. conductors) are connected to power wiring cord connection portions 32 and 33 connected by soldering or the like.
  • Reference numerals 34 and 35 respectively denote an anode-side soldering portion to which the anode-side terminal of the chip LED 30 is soldered, and a cathode-side soldering portion to which the cathode-side terminal of the chip LED 30 is soldered.
  • 37 designates the resistor soldering points to which the two terminals of the resistor 31 are soldered.
  • the rigid board 3 a long board such as a glass epoxy board or a glass composite board is used, in which conductor patterns are formed on the front and back surfaces of the board body.
  • the portions to be soldered (soldered portions) in the conductor pattern are exposed, and the portions other than the soldered portions are covered with a solder resist or the like.
  • FIG. 3 corresponds to FIG. 2 and shows an example of a specific appearance of the surface of the rigid substrate 3 before the chip LED 30 is soldered.
  • the conductor pattern on the surface is indicated by dashed lines, and the soldered portion is indicated by solid lines.
  • anode-side soldering portions 34 to which the anode-side terminals of the chip LEDs 30 are soldered, and cathode-side soldering portions 35 to which the cathode-side terminals of the chip LEDs 30 are soldered are respectively arranged according to the number of the chip LEDs 30 ( For example, 36) are provided.
  • each anode-side soldering portion 34 and each cathode-side soldering portion 35 extend parallel to each other in the longitudinal direction of the rigid substrate 3 (the direction in which the long rigid substrate 3 extends).
  • the anode-side soldering portion 34 and the cathode-side soldering portion 35 have different widths (dimensions in the direction perpendicular to the length direction), but they may be the same.
  • the resistor 31 can be soldered to the resistor soldering portions 36 and 37 provided on the back surface of the rigid substrate 3 .
  • the power wiring cord connection portions 32 and 33 can be provided on the back surface of the rigid substrate 3 .
  • the resistor 31 is omitted in FIGS. 1A and 1B.
  • the rigid substrate 3 is bent in the length direction after soldering the chip LED 30 and the like. At this time, the rigid substrate 3 is bent with a considerably large curvature, but each of the chip LEDs 30 is soldered at the anode side soldering portion 34 and the cathode side soldering portion 35 extending in the longitudinal direction of the rigid substrate 3. Therefore, stress due to bending can be alleviated, and as a result, cracking can be prevented.
  • the rigid board 3 is formed into a ring shape and placed in the housing 2 with both ends 3a and 3b coupled (see FIG. 1B). Before and after that, the positive side power supply wiring cord 1aa (more specifically, the conductor therein) and the negative side power supply wiring cord 1ab (more specifically, the conductor therein) included in the cable 1a are connected to the power supply wiring cord connection portion 32, 33 by soldering or the like.
  • the positions of the connecting portions 3a and 3b of the rigid board 3 and the positions of the power wiring cord connecting portions 32 and 33 in the housing 2 are not limited to the positions shown in FIG. 1B.
  • the inspection lighting device 1 when voltage and current are supplied through the cable 1a (the positive side power wiring cord 1aa and the negative side power wiring cord 1ab), the current flows through each of the chip LEDs 30, as shown in FIGS.
  • light (schematically indicated by dashed lines with arrows in FIGS. 4 and 5) is emitted from the plurality of LEDs 30 on the rigid substrate 3 at a predetermined directivity angle (angle at which the light spreads) centering on the horizontal direction. be radiated.
  • the light from the chip LED 30 that passes through the article-side light passage portion 2a and travels directly toward the article M and the light reflected by the light reflecting layer 21 pass through the article-side light passage portion 2a.
  • the article M is illuminated by light directed towards it. Reflected light from the article M (schematically indicated by the dashed-dotted lines with arrows in FIGS. 4 and 5) passes through the article-side light passage portion 2a and the camera-side light passage portion 2b and is arranged upward. incident on camera C. Thus, the article M is photographed by the camera C and inspected.
  • the inspection illumination device 1 can be easily made to have high brightness by using the chip LEDs 30 .
  • the inspection illumination device 1 generally has a large directivity angle of the chip LED 30, it is possible to inspect the article M by using the light that is directed directly toward the article M and the light that is reflected by the light reflecting layer 21 and then directed toward the article M.
  • the distance G (see FIGS. 4 and 5) between the inspection illumination device 1 and the article M can be widened. It is possible to make the amount of light that directly passes through (leaks from) the camera-side light passage portion 2b among the light emitted from the chip LED 30 extremely small.
  • the inspection illumination device 1 can widen the distance G between the inspection illumination device 1 capable of inspecting the article M and the article M with a simple configuration.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
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  • Life Sciences & Earth Sciences (AREA)
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Abstract

Provided is a lighting device for inspection with which it is possible, using a simple configuration, to broaden the range of distances between an object and the lighting device for inspection at which inspection of the object is possible. This lighting device 1 for inspection comprises: a housing 2 which has an object-side light-transmitting portion 2a and a camera-side light-transmitting portion 2b; and an elongate rigid substrate 3 which is disposed in the housing 2, has a plurality of chip LEDs 30 arranged in a line in the lengthwise direction and soldered to a surface thereof, and is bent into a ring such that said surface is on the inner side. The housing 2 has a light-reflecting layer 21 between the edge of the camera-side light-transmitting portion 2b and the rigid substrate 3. Anode-side soldered portions 34 having respective anode-side terminals of the plurality of chip LEDs 30 soldered thereto and cathode-side soldered portions 35 having respective cathode-side terminals of the plurality of chip LEDs 30 soldered thereto are provided on the surface of the rigid substrate 3. The anode-side soldered portions 34 and the cathode-side soldered portions 35 extend parallel with each other in the lengthwise direction of the of the rigid substrate 3.

Description

検査用照明装置Inspection lighting system
  本発明は、物品を検査するために物品に複数個のＬＥＤからの光を照射する検査用照明装置に関するものである。 TECHNICAL FIELD The present invention relates to an inspection illumination device for irradiating an article with light from a plurality of LEDs in order to inspect the article.
　従来より、工場で生産された物品（製品）について、ベルトコンベア等で搬送されて来る物品に複数個のＬＥＤを有する検査用照明装置からの光を照射しそれをカメラで撮影することにより検査（欠陥、キズ、汚れ、異物などの外観検査）を行う検査装置が用いられてきた。検査用照明装置には、検査する物品に応じて様々なものが用いられるが、その中には、検査用照明装置と物品の間の間隔（上下方向の間隔）を比較的小さくして、光を水平方向に近い方向から物品に照射するものも有る。 Conventionally, for articles (products) produced in a factory, inspection ( An inspection apparatus has been used to perform visual inspection for defects, scratches, stains, foreign matter, etc.). Various inspection lighting devices are used depending on the article to be inspected. There are also those that irradiate the article from a direction close to the horizontal direction.
　例えば、特許文献１の図３には、複数個の砲弾型のＬＥＤ（発光素子）を内向きに環状に物品側に少し傾けて配置した検査用照明装置が開示されている。この検査用照明装置は、ＬＥＤの内側でかつカメラ（照明検知装置）側に光反射面を有しており、ＬＥＤから直接物品に向かう光と光反射面で反射してから物品に向かう光により物品を照射する。また、同図４には、物品側に傾けないで複数個の砲弾型のＬＥＤを内向きに環状に配置した検査用照明装置が開示されている。この検査用照明装置は、光反射面がなく、ＬＥＤの内側に特別に高い拡散能力を有する拡散器を配置しており、ＬＥＤからこの拡散器を通して物品に向かう光により物品を照射する。このような同図３及び図４に開示されている検査用照明装置は、ほぼ平坦な表面に取り付けられた部品を検査の物品とし、それに水平方向に近い方向から光を照射するものである。 For example, FIG. 3 of Patent Document 1 discloses an inspection lighting device in which a plurality of bullet-shaped LEDs (light-emitting elements) are arranged inwardly in an annular manner and slightly inclined toward the article side. This inspection lighting device has a light reflecting surface inside the LED and on the side of the camera (illumination detection device). Irradiate the article. Further, FIG. 4 discloses an inspection illumination device in which a plurality of bullet-shaped LEDs are circularly arranged inward without being inclined toward the article. This inspection illuminator has no light-reflecting surface and has a diffuser with a particularly high diffusing power inside the LEDs, which illuminates the article with light from the LEDs through this diffuser towards the article. The inspection illumination device disclosed in FIGS. 3 and 4 illuminates a component attached to a substantially flat surface as an inspection object from a nearly horizontal direction.
特表２００２－５１３４７０号公報Japanese translation of PCT publication No. 2002-513470
　しかしながら、特許文献１の図３及び図４に開示されているような検査用照明装置は、ＬＥＤが物品側に少し傾けてられていたり特別に高い拡散能力を有する拡散器が配置されていたりして構成が簡易とは言えず、また、物品の検査が可能な検査用照明装置と物品の間の間隔の範囲も限られる。 However, in the inspection lighting device disclosed in FIGS. 3 and 4 of Patent Document 1, the LEDs are slightly tilted toward the article side, and a diffuser having a particularly high diffusion capability is arranged. However, the configuration is not simple, and the range of the distance between the inspection illumination device and the article, which can inspect the article, is limited.
　本発明は、係る事由に鑑みてなされたものであり、その目的は、簡易な構成で、物品の検査が可能な検査用照明装置と物品の間の間隔を広範囲にすることができる検査用照明装置を提供することにある。 SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an inspection lighting device capable of widening the distance between an inspection lighting device capable of inspecting an article and an article with a simple configuration. It is to provide a device.
　上記目的を達成するために、本発明の実施形態に係る検査用照明装置は、物品側光通過部とカメラ側光通過部を有するハウジングと、該ハウジング内に配置され、複数個のチップＬＥＤが長さ方向に並べて表面にはんだ付けされ該表面が内側になるように環状に曲げられた長尺のリジッド基板と、を備え、前記ハウジングは、前記カメラ側光通過部の周縁と前記リジッド基板の間に光反射層を有し、前記リジッド基板の前記表面には、前記複数個のチップＬＥＤの各々のアノード側端子がはんだ付けされるアノード側はんだ付け部と各々のカソード側端子がはんだ付けされるカソード側はんだ付け部が設けられており、該各々のアノード側はんだ付け部と該各々のカソード側はんだ付け部は、互いに平行に前記リジッド基板の長さ方向に延びている。 To achieve the above object, an inspection illumination device according to an embodiment of the present invention comprises a housing having an article-side light passage portion and a camera-side light passage portion; a long rigid substrate arranged in the length direction and soldered to the surface and bent into an annular shape so that the surface faces inward; An anode-side soldering portion to which the anode-side terminals of each of the plurality of chip LEDs are soldered, and cathode-side terminals of each of the plurality of chip LEDs are soldered to the surface of the rigid substrate. The respective anode side soldering section and the respective cathode side soldering section extend parallel to each other in the longitudinal direction of the rigid substrate.
　前記光反射層は、白色又は鏡面であるようにすることができる。 The light reflecting layer can be white or specular.
　前記リジッド基板は、ガラスエポキシ基板又はガラスコンポジット基板に導体パターンが形成されているようにすることができる。 The rigid substrate may be a glass epoxy substrate or a glass composite substrate on which a conductor pattern is formed.
　前記検査用照明装置は、環状に曲げられ前記リジッド基板に接する放熱シートを更に備えるようにすることができる。 The inspection illumination device may further include a heat radiation sheet that is bent into a ring shape and is in contact with the rigid substrate.
　本発明の検査用照明装置によれば、簡易な構成で、物品の検査が可能な検査用照明装置と物品の間の間隔を広範囲にすることができる。 According to the inspection lighting device of the present invention, it is possible to widen the distance between the inspection lighting device capable of inspecting the article and the article with a simple configuration.
本発明の実施形態に係る検査用照明装置を示す断面図（図１ＢのＡ－Ａ線で示す位置での断面図）である。FIG. 1B is a cross-sectional view (a cross-sectional view taken along the line AA in FIG. 1B) showing the inspection illumination device according to the embodiment of the present invention; 同上の検査用照明装置を示すものであってハウジング底板部を取り外した状態の底面図である。It is a bottom view which shows the lighting apparatus for an inspection same as the above, and is in the state which removed the housing bottom plate part. 同上の検査用照明装置のリジッド基板が実現する回路例を示す回路図である。FIG. 4 is a circuit diagram showing an example of a circuit realized by a rigid board of the inspection lighting device; 同上の検査用照明装置のチップＬＥＤがはんだ付けされる前のリジッド基板の表面を示す外観図である。FIG. 3 is an external view showing the surface of the rigid substrate before the chip LED of the inspection lighting device is soldered; 同上の検査用照明装置における光の様子を断面図で説明する説明図であって、検査用照明装置と物品の間の間隔が狭い場合のものである。FIG. 10 is an explanatory diagram for explaining the state of light in the inspection lighting device same as the above in a cross-sectional view, in the case where the distance between the inspection lighting device and the article is narrow. 同上の検査用照明装置における光の様子を断面図で説明する説明図であって、検査用照明装置と物品の間の間隔が広い場合のものである。FIG. 10 is an explanatory diagram for explaining the state of light in the same inspection illumination device with a cross-sectional view, in the case where the distance between the inspection illumination device and the article is wide.
　以下、本発明を実施するための形態を説明する。本発明の実施形態に係る検査用照明装置１は、図１Ａ及び図１Ｂに示すように、ハウジング２とリジッド基板３を備える。検査用照明装置１は、検査する物品Ｍを下方に位置させ、その物品Ｍを撮影するカメラＣを上方に位置させて用いることができる（後述する図４及び図５参照）。検査用照明装置１は、ケーブル１ａを有しており、ケーブル１ａのコネクタ１ｂが調光装置等（図示せず）に接続されて使用される。 A mode for carrying out the present invention will be described below. An inspection illumination device 1 according to an embodiment of the present invention includes a housing 2 and a rigid board 3, as shown in FIGS. 1A and 1B. The inspection illumination device 1 can be used with the article M to be inspected positioned below and the camera C for photographing the article M positioned above (see FIGS. 4 and 5 described later). The inspection illumination device 1 has a cable 1a, and is used by connecting a connector 1b of the cable 1a to a light control device or the like (not shown).
　ハウジング２は、リジッド基板３を支持するものである。ハウジング２は、物品Ｍ側に光が通過する物品側光通過部２ａを有し、カメラＣ側に光が通過するカメラ側光通過部２ｂを有する。ハウジング２は、具体的には、ハウジング本体部２ｃとその下側のハウジング底板部２ｄで構成するようにすることができる。物品側光通過部２ａは、ハウジング底板部２ｄに形成されている。ハウジング２は、高さの低い大略円筒状のものとすることができる。ハウジング２は、アルミニウムや銅などの金属材又は樹脂材などが用いられる。 The housing 2 supports the rigid board 3. The housing 2 has an article-side light passage portion 2a through which light passes on the article M side, and a camera-side light passage portion 2b through which light passes on the camera C side. Specifically, the housing 2 can be configured by a housing body portion 2c and a housing bottom plate portion 2d below it. The article-side light passage portion 2a is formed in the housing bottom plate portion 2d. The housing 2 can be generally cylindrical with a low height. The housing 2 is made of a metal material such as aluminum or copper, a resin material, or the like.
　ハウジング２は、カメラ側光通過部２ｂの周縁とリジッド基板３の間に光反射層２１を有する。光反射層２１は、光を反射し、例えば白色又は鏡面である。光反射層２１は、ハウジング２の他の部分と別部材にして貼り付けたものであってもよいし、ハウジング２に塗装したものであってもよい。 The housing 2 has a light reflecting layer 21 between the peripheral edge of the camera-side light passing portion 2b and the rigid substrate 3. The light reflecting layer 21 reflects light and is white or specular, for example. The light reflecting layer 21 may be a separate member from the rest of the housing 2 and attached, or may be coated on the housing 2 .
　リジッド基板３は、ハウジング２内に配置されている。リジッド基板３は、複数個のチップＬＥＤ３０が長さ方向に並べて表面にはんだ付けされ、その表面が内側になるように環状に曲げられた長尺のものである（図１Ｂ参照）。リジッド基板３は、環状に曲げられ得る程度に薄い。リジッド基板３の周囲には、図１Ａ及び図１Ｂに示すように、環状に曲げられた放熱シート４が設けられるようにすることができる。放熱シート４は、リジッド基板３に接するようにすることができる。なお、図１Ａ及び図１Ｂにおいては、ＬＥＤ３０の符号３０は、図１Ａにおける中央のものと断面となっている左右のものしか付していない。図１Ａにおいては、ＬＥＤ３０は、中央から左側又は右側の配置になるにつれて段々と側面（厚さ方向の面）が見えて来ている。 The rigid board 3 is arranged inside the housing 2 . The rigid board 3 is a long one in which a plurality of chip LEDs 30 are arranged in the longitudinal direction and soldered to the surface, and is bent into an annular shape so that the surface faces inward (see FIG. 1B). The rigid substrate 3 is thin enough to be bent into a circular shape. Around the rigid substrate 3, as shown in FIGS. 1A and 1B, a circularly bent heat dissipation sheet 4 can be provided. The heat dissipation sheet 4 can be in contact with the rigid board 3 . In addition, in FIGS. 1A and 1B, the reference numeral 30 of the LED 30 is attached only to the central LED 30 in FIG. 1A and the left and right cross-sectional LEDs. In FIG. 1A, the side surfaces (surfaces in the thickness direction) of the LEDs 30 gradually become visible as they are arranged leftward or rightward from the center.
　図２は、リジッド基板３の具体的な回路例を示すものである。図２の例では、リジッド基板３にはんだ付けされたチップＬＥＤ３０の数は、３６個であり、直列接続された３個のチップＬＥＤ３０が１２個並列に接続されている。各々の直列接続された３個のチップＬＥＤ３０には、更に抵抗３１が直列接続されている。各々の直列接続された３個のチップＬＥＤ３０及び抵抗３１は、ケーブル１ａに含まれるプラス側電源配線コード１ａａ（より詳しくはその中の導体）とマイナス側電源配線コード１ａｂ（より詳しくはその中の導体）がそれぞれはんだ付け等で接続された電源配線コード接続部３２、３３に接続されている。なお、符号３４、３５はそれぞれ、チップＬＥＤ３０のアノード側端子がはんだ付けされるアノード側はんだ付け部、チップＬＥＤ３０のカソード側端子がはんだ付けされるカソード側はんだ付け部を示しており、符号３６、３７は、抵抗３１の２個の端子がはんだ付けされる抵抗はんだ付け部を示している。 FIG. 2 shows a specific circuit example of the rigid substrate 3. As shown in FIG. In the example of FIG. 2, the number of chip LEDs 30 soldered to the rigid substrate 3 is 36, and 12 of the three chip LEDs 30 connected in series are connected in parallel. A resistor 31 is also connected in series to each of the three chip LEDs 30 connected in series. Each of the series-connected three chip LEDs 30 and the resistor 31 is connected to the plus side power supply wiring cord 1aa (more specifically, the conductor therein) and the minus side power supply wiring cord 1ab (more specifically, the conductor in it) included in the cable 1a. conductors) are connected to power wiring cord connection portions 32 and 33 connected by soldering or the like. Reference numerals 34 and 35 respectively denote an anode-side soldering portion to which the anode-side terminal of the chip LED 30 is soldered, and a cathode-side soldering portion to which the cathode-side terminal of the chip LED 30 is soldered. 37 designates the resistor soldering points to which the two terminals of the resistor 31 are soldered.
　リジッド基板３は、例えばガラスエポキシ基板やガラスコンポジット基板などの基板本体の表面や裏面などに導体パターンが形成された長尺のものが用いられる。リジッド基板３では、導体パターン中のはんだ付けされる部分（はんだ付け部）は露出しており、はんだ付け部以外はソルダーレジスト等で覆われている。 As the rigid board 3, a long board such as a glass epoxy board or a glass composite board is used, in which conductor patterns are formed on the front and back surfaces of the board body. In the rigid board 3, the portions to be soldered (soldered portions) in the conductor pattern are exposed, and the portions other than the soldered portions are covered with a solder resist or the like.
　図３は、図２に対応するものであって、チップＬＥＤ３０がはんだ付けされる前のリジッド基板３の表面の具体的な外観の例を示すものである。図３の例では、表面の導体パターンは破線で示しており、はんだ付け部は実線で示している。 FIG. 3 corresponds to FIG. 2 and shows an example of a specific appearance of the surface of the rigid substrate 3 before the chip LED 30 is soldered. In the example of FIG. 3, the conductor pattern on the surface is indicated by dashed lines, and the soldered portion is indicated by solid lines.
　リジッド基板３の表面には、チップＬＥＤ３０のアノード側端子がはんだ付けされるアノード側はんだ付け部３４とチップＬＥＤ３０のカソード側端子がはんだ付けされるカソード側はんだ付け部３５がそれぞれチップＬＥＤ３０の数（例えば、３６個）だけ設けられている。各々のアノード側はんだ付け部３４とカソード側はんだ付け部３５は、図３に示すように、互いに平行にリジッド基板３の長さ方向（長尺のリジッド基板３の延びる方向）に延びている。図３の例では、アノード側はんだ付け部３４とカソード側はんだ付け部３５は、幅（長さ方向に垂直な方向の寸法）が互いに異なっているが、同じにしてもよい。 On the surface of the rigid substrate 3, anode-side soldering portions 34 to which the anode-side terminals of the chip LEDs 30 are soldered, and cathode-side soldering portions 35 to which the cathode-side terminals of the chip LEDs 30 are soldered are respectively arranged according to the number of the chip LEDs 30 ( For example, 36) are provided. As shown in FIG. 3, each anode-side soldering portion 34 and each cathode-side soldering portion 35 extend parallel to each other in the longitudinal direction of the rigid substrate 3 (the direction in which the long rigid substrate 3 extends). In the example of FIG. 3, the anode-side soldering portion 34 and the cathode-side soldering portion 35 have different widths (dimensions in the direction perpendicular to the length direction), but they may be the same.
　なお、抵抗３１は、リジッド基板３の裏面に設けられた抵抗はんだ付け部３６、３７にはんだ付けされるようにすることができる。また、電源配線コード接続部３２、３３は、リジッド基板３の裏面に設けることができる。また、図１Ａ及び図１Ｂにおいては、抵抗３１は省略している。 Note that the resistor 31 can be soldered to the resistor soldering portions 36 and 37 provided on the back surface of the rigid substrate 3 . Also, the power wiring cord connection portions 32 and 33 can be provided on the back surface of the rigid substrate 3 . Also, the resistor 31 is omitted in FIGS. 1A and 1B.
　リジッド基板３は、チップＬＥＤ３０等のはんだ付け後、長さ方向が曲げられる。このとき、リジッド基板３はかなり大きな曲率で曲げられるが、チップＬＥＤ３０の各々は、リジッド基板３の長さ方向に延びているアノード側はんだ付け部３４とカソード側はんだ付け部３５においてはんだ付けされているので、曲げによるストレスが緩和されるようにすることができ、その結果、割れないようにすることができる。 The rigid substrate 3 is bent in the length direction after soldering the chip LED 30 and the like. At this time, the rigid substrate 3 is bent with a considerably large curvature, but each of the chip LEDs 30 is soldered at the anode side soldering portion 34 and the cathode side soldering portion 35 extending in the longitudinal direction of the rigid substrate 3. Therefore, stress due to bending can be alleviated, and as a result, cracking can be prevented.
　リジッド基板３は、環状にされ、両端部３ａ、３ｂが結合されてハウジング２内に配置される（図１Ｂ参照）。また、その前後に、ケーブル１ａに含まれるプラス側電源配線コード１ａａ（より詳しくはその中の導体）とマイナス側電源配線コード１ａｂ（より詳しくはその中の導体）が電源配線コード接続部３２、３３にはんだ付け等で接続される。なお、ハウジング２内におけるリジッド基板３の両端部３ａ、３ｂの結合の位置及び電源配線コード接続部３２、３３の位置は、図１Ｂで示す位置に限定されるものではない。 The rigid board 3 is formed into a ring shape and placed in the housing 2 with both ends 3a and 3b coupled (see FIG. 1B). Before and after that, the positive side power supply wiring cord 1aa (more specifically, the conductor therein) and the negative side power supply wiring cord 1ab (more specifically, the conductor therein) included in the cable 1a are connected to the power supply wiring cord connection portion 32, 33 by soldering or the like. In addition, the positions of the connecting portions 3a and 3b of the rigid board 3 and the positions of the power wiring cord connecting portions 32 and 33 in the housing 2 are not limited to the positions shown in FIG. 1B.
　検査用照明装置１では、ケーブル１ａ（プラス側電源配線コード１ａａとマイナス側電源配線コード１ａｂ）を通って電圧及び電流が供給されると、各々のチップＬＥＤ３０に電流が流れ、図４及び図５に示すように、リジッド基板３の複数個のＬＥＤ３０から水平方向を中心として所定の指向角（光が広がる角度）で光（図４及び図５中で、矢印付き破線で模式的に示す）が放射される。下方に位置する物品Ｍは、その光のうち、チップＬＥＤ３０から物品側光通過部２ａを通って直接物品Ｍに向かう光と光反射層２１で反射してから物品側光通過部２ａを通って物品Ｍに向かう光により照射される。そして、その物品Ｍからの反射光（図４及び図５中で、矢印付き一点鎖線で模式的に示す）は、物品側光通過部２ａとカメラ側光通過部２ｂを通って上方に配置されたカメラＣに入射する。こうして、カメラＣにより物品Ｍは撮影され検査される。 In the inspection lighting device 1, when voltage and current are supplied through the cable 1a (the positive side power wiring cord 1aa and the negative side power wiring cord 1ab), the current flows through each of the chip LEDs 30, as shown in FIGS. As shown in , light (schematically indicated by dashed lines with arrows in FIGS. 4 and 5) is emitted from the plurality of LEDs 30 on the rigid substrate 3 at a predetermined directivity angle (angle at which the light spreads) centering on the horizontal direction. be radiated. Of the light from the article M located below, the light from the chip LED 30 that passes through the article-side light passage portion 2a and travels directly toward the article M and the light reflected by the light reflecting layer 21 pass through the article-side light passage portion 2a. The article M is illuminated by light directed towards it. Reflected light from the article M (schematically indicated by the dashed-dotted lines with arrows in FIGS. 4 and 5) passes through the article-side light passage portion 2a and the camera-side light passage portion 2b and is arranged upward. incident on camera C. Thus, the article M is photographed by the camera C and inspected.
　ここで、検査用照明装置１は、チップＬＥＤ３０により容易に高輝度とすることができる。また、検査用照明装置１は、チップＬＥＤ３０の指向角が一般的に大きいので、直接物品Ｍに向かう光と光反射層２１で反射してから物品Ｍに向かう光により、物品Ｍの検査が可能な検査用照明装置１と物品Ｍの間の間隔Ｇ（図４及び図５参照）を広範囲にすることができる。なお、チップＬＥＤ３０から放射される光のうちカメラ側光通過部２ｂを直接通過する（そこから漏れる）光の量は、極めて少ないものとすることが可能である。 Here, the inspection illumination device 1 can be easily made to have high brightness by using the chip LEDs 30 . In addition, since the inspection illumination device 1 generally has a large directivity angle of the chip LED 30, it is possible to inspect the article M by using the light that is directed directly toward the article M and the light that is reflected by the light reflecting layer 21 and then directed toward the article M. The distance G (see FIGS. 4 and 5) between the inspection illumination device 1 and the article M can be widened. It is possible to make the amount of light that directly passes through (leaks from) the camera-side light passage portion 2b among the light emitted from the chip LED 30 extremely small.
　このように、検査用照明装置１は、簡易な構成で、物品Ｍの検査が可能な検査用照明装置１と物品Ｍの間の間隔Ｇを広範囲にすることができる。 In this way, the inspection illumination device 1 can widen the distance G between the inspection illumination device 1 capable of inspecting the article M and the article M with a simple configuration.
　以上、本発明の実施形態に係る検査用照明装置について説明したが、本発明は、実施形態に記載したものに限られることなく、請求の範囲に記載した事項の範囲内でのさまざまな設計変更が可能である。 Although the inspection illumination device according to the embodiment of the present invention has been described above, the present invention is not limited to the one described in the embodiment, and various design changes can be made within the scope of the matters described in the claims. is possible.
　１　　検査用照明装置
　１ａ　ケーブル
　１ａａ　プラス側電源配線コード
　１ａｂ　マイナス側電源配線コード
　１ｂ　コネクタ
　２　　ハウジング
　２ａ　物品側光通過部
　２ｂ　カメラ側光通過部
　２ｃ　ハウジング本体部
　２ｄ　ハウジング底板部
　２１　光反射層
　３　　リジッド基板
　３０　チップＬＥＤ
　３１　抵抗
　３２、３３　電源配線コード接続部
　３４　アノード側はんだ付け部
　３５　カソード側はんだ付け部
　３６、３７　抵抗はんだ付け部
　３ａ、３ｂ　リジッド基板の端部
　４　　放熱シート
　Ｃ　　カメラ
　Ｇ　　検査用照明装置と物品の間の間隔
　Ｍ　　物品 Reference Signs List 1 inspection lighting device 1a cable 1aa plus side power wiring cord 1ab minus side power wiring cord 1b connector 2 housing 2a article side light passage portion 2b camera side light passage portion 2c housing body portion 2d housing bottom plate portion 21 light reflection layer 3 rigid substrate 30 chip LEDs
31 Resistor 32, 33 Power supply wiring cord connection 34 Soldering part on anode side 35 Soldering part on cathode side 36, 37 Resistor soldering part 3a, 3b Edge of rigid substrate 4 Heat dissipation sheet C Camera G Inspection lighting device and article Spacing between M articles

Claims (4)

  1. 　物品側光通過部とカメラ側光通過部を有するハウジングと、
    　該ハウジング内に配置され、複数個のチップＬＥＤが長さ方向に並べて表面にはんだ付けされ該表面が内側になるように環状に曲げられた長尺のリジッド基板と、
    を備え、
    　前記ハウジングは、前記カメラ側光通過部の周縁と前記リジッド基板の間に光反射層を有し、
    　前記リジッド基板の前記表面には、前記複数個のチップＬＥＤの各々のアノード側端子がはんだ付けされるアノード側はんだ付け部と各々のカソード側端子がはんだ付けされるカソード側はんだ付け部が設けられており、該各々のアノード側はんだ付け部と該各々のカソード側はんだ付け部は、互いに平行に前記リジッド基板の長さ方向に延びている検査用照明装置。     a housing having an article-side light-passing portion and a camera-side light-passing portion;
    a long rigid substrate arranged in the housing, having a plurality of chip LEDs arranged in the longitudinal direction and soldered to the surface thereof and bent into an annular shape so that the surface faces inward;
    with
    the housing has a light reflection layer between the peripheral edge of the camera-side light passage portion and the rigid substrate;
    The surface of the rigid substrate is provided with an anode-side soldering section to which the anode-side terminals of the plurality of chip LEDs are soldered and a cathode-side soldering section to which the cathode-side terminals are soldered. wherein the respective anode side soldering portions and the respective cathode side soldering portions extend parallel to each other in the longitudinal direction of the rigid substrate.
  2. 　請求項１に記載の検査用照明装置において、
    　前記光反射層は、白色又は鏡面である検査用照明装置。     The inspection lighting device according to claim 1,
    The inspection lighting device, wherein the light reflecting layer is white or has a mirror surface.
  3. 　請求項１又は２に記載の検査用照明装置において、
    　前記リジッド基板は、ガラスエポキシ基板又はガラスコンポジット基板に導体パターンが形成されている検査用照明装置。     In the inspection lighting device according to claim 1 or 2,
    The rigid substrate is a glass epoxy substrate or a glass composite substrate in which a conductor pattern is formed.
  4. 　請求項１～３のいずれか１項に記載の検査用照明装置において、
    　環状に曲げられ前記リジッド基板に接する放熱シートを更に備える検査用照明装置。     In the inspection lighting device according to any one of claims 1 to 3,
    An inspection illumination device further comprising a heat radiation sheet bent into a ring shape and in contact with the rigid substrate.
PCT/JP2022/009782 2021-08-17 2022-03-07 Lighting device for inspection WO2023021749A1 (en)

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JP2017147180A (en) * 2016-02-19 2017-08-24 ローム株式会社 LED lighting device and inspection device
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Publication number Priority date Publication date Assignee Title
JP2003031005A (en) * 2001-07-18 2003-01-31 Rabo Sufia Kk Light-emitting diode illumination device
JP2005122918A (en) * 2003-10-14 2005-05-12 Kyoto Denkiki Kk Lighting system and its manufacturing method
WO2009125618A1 (en) * 2008-04-11 2009-10-15 ハリソン東芝ライティング株式会社 Light emitting device
DE102012109146A1 (en) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Ring light module and method for producing a ring light module
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