WO2023020106A1 - Wearable electronic device and preparation method therefor - Google Patents

Abstract

A wearable electronic device (10) and a preparation method therefor. The housing (110) of the wearable electronic device (10) is provided with a heat-conducting electrode (111); a temperature sensor (120) is disposed on and connected to a bearing plate (130); a first heat insulation member (140) is arranged between the housing (110) and the bearing plate (130); the first heat insulation member (140) is provided with a first through-hole (141); and the temperature sensor (120) is disposed corresponding to the first through-hole (141).

Description

Wearable electronic device and manufacturing method thereof

This application requires submission of a Chinese patent application with the application number 202110943554.5 to the China Patent Office on August 17, 2021, and the title of the invention is "Wearable Electronic Devices and Its Preparation Method", and the application number is 202121936605.3, and the title of the invention is "Wearable The priority of the Chinese patent application for "electronic equipment", the entire content of which is incorporated in this application by reference.

technical field

The present application relates to the field of electronic technology, in particular to a wearable electronic device and a preparation method thereof.

Background technique

With the development of communication technology, wearable electronic devices such as smartphones and smart watches are becoming more and more popular. During the use of the smart watch, it is often necessary to obtain the user's temperature information through the detection device.

Contents of the invention

The present application provides a wearable electronic device and a preparation method thereof, in which the connection between the temperature detection device and the housing is stronger, and the temperature detection is more accurate.

In a first aspect, the present application provides a wearable electronic device, including:

a casing, on which a thermally conductive electrode is arranged, and the thermally conductive electrode is configured to be in contact with an external object;

a bearing plate arranged in the housing;

a first heat insulating element, located between the heat conducting electrode and the bearing plate, and a first through hole is provided on the first heat insulating element; and

A temperature sensor is arranged and connected to the carrier plate, the temperature sensor is arranged corresponding to the first through hole, and the temperature sensor is thermally connected to the heat conduction electrode to detect the temperature of the external object.

In a second aspect, the present application provides a method for preparing a wearable electronic device, including:

connecting the thermally conductive electrode to the housing to form a first unit;

connecting the first heat insulating element to the first whole, and opening a first through hole in the first heat insulating element;

connecting the temperature sensor to the carrier plate to form a second whole;

On the side of the first heat insulating member away from the heat conduction electrode, the second integral body is connected to the first integral body, and the temperature sensor is disposed corresponding to the first through hole.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative efforts.

FIG. 1 is a schematic diagram of a first structure of a wearable electronic device provided by an embodiment of the present application.

FIG. 2 is a schematic structural diagram of another viewing angle of the wearable electronic device provided by the embodiment of the present application.

FIG. 3 is a schematic diagram of an exploded structure of the wearable electronic device shown in FIG. 2 .

FIG. 4 is a schematic partial cross-sectional view of the wearable electronic device shown in FIG. 2 along the direction P1-P2.

FIG. 5 is a schematic structural view of the bearing plate shown in FIG. 3 .

FIG. 6 is a structural schematic view of another viewing angle of the bearing plate shown in FIG. 3 .

FIG. 7 is a schematic structural diagram of the main board shown in FIG. 3 .

FIG. 8 is a schematic diagram of a second structure of a wearable electronic device provided by an embodiment of the present application.

FIG. 9 is a schematic diagram of a third structure of a wearable electronic device provided by an embodiment of the present application.

FIG. 10 is a schematic diagram of a fourth structure of a wearable electronic device provided by an embodiment of the present application.

FIG. 11 is a schematic flow chart of the first method of manufacturing a wearable electronic device provided by the embodiment of the present application.

FIG. 12 is a schematic flow chart of the second method of manufacturing a wearable electronic device provided by the embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings 1 to 12 in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

Please refer to FIG. 1 to FIG. 4, FIG. 1 is a first structural schematic diagram of the wearable electronic device 10 provided by the embodiment of the present application, and FIG. 2 is a structural schematic diagram of another perspective of the wearable electronic device 10 provided by the embodiment of the present application. , FIG. 3 is a schematic exploded structure diagram of the wearable electronic device 10 shown in FIG. 2 , and FIG. 4 is a partial cross-sectional schematic diagram of the wearable electronic device 10 shown in FIG. 2 along the direction P1-P2. The wearable electronic device 10 may be, but not limited to, electronic devices such as wristbands, smart watches, and wireless earphones. The wearable electronic device 10 in the embodiment of the present application is described by taking a smart watch as an example.

As shown in FIG. 3 and FIG. 4 , the wearable electronic device 10 may include a casing 110 , a thermally conductive electrode 111 , a temperature sensor 120 , a carrier plate 130 and a first heat insulating member 140 . The housing 110 is provided with a heat-conducting electrode 111, which can be in contact with an external object. The bearing plate 130 is arranged in the housing 110. The temperature sensor 120 can be arranged on the bearing plate 130 and can be connected to the bearing plate 130. The temperature sensor 120 It can be thermally connected with the thermally conductive electrode 111 to detect the temperature of an external object. The first heat insulating member 140 is disposed between the thermally conductive electrode 111 and the bearing plate 130 , and the first heat insulating member 140 is provided with a first through hole 141 , and the temperature sensor 120 can be disposed corresponding to the first through hole 141 . The temperature sensor 120 can be thermally connected to the thermally conductive electrode 111 through the first through hole 141 without being blocked by the thermal insulation of the first thermal insulation member 140 .

Wherein, as shown in Figures 1 to 3, the housing 110 can form the main body of the wearable electronic device 10 and can accommodate some electronic components of the wearable electronic device 10. When the wearable electronic device 10 is a smart watch, the housing 110 It may be a dial of the wearable electronic device 10 . Wherein, the housing 110 can be a cuboid, then the wearable electronic device 10 is a square dial; the housing 110 can also be a cylinder, then the wearable electronic device 10 is a round dial; the housing 110 can also be an irregular polyhedron, then the wearable The electronic device 10 is an irregular dial. The embodiment of the present application does not limit the specific shape of the casing 110 .

Wherein, the thermally conductive electrode 111 may be disposed on the housing 110 , and the thermally conductive electrode 111 may be disposed on the outer surface of the housing 110 . The outer surface is the side of the housing 110 that can be in contact with external objects, and is also the side that is visible to the user. The thermally conductive electrode 111 can be in contact with an external object to sense the heat of the external object and transfer the heat to the temperature sensor 120 . For example, after the user wears the wearable electronic device 10, the thermally conductive electrode 111 may directly contact with the user's hand.

It can be understood that the thermally conductive electrode 111 may be a thermally conductive electrode 111 made of glass, such as a thermally conductive electrode 111 made of sapphire glass. Of course, the thermally conductive electrode 111 may also be a thermally conductive electrode made of metal. The embodiment of the present application does not limit the specific material of the thermally conductive electrode 111 , and any thermally conductive electrode 111 that can sense and transfer heat is within the scope of protection of the embodiment of the present application.

Wherein, as shown in FIG. 3 and FIG. 4 , the temperature sensor 120 can use the heat induced by the thermally conductive electrode 111 to detect the temperature of an external object, and the carrier board 130 can be used as a carrier of the temperature sensor 120 to carry the temperature sensor 120 .

It can be understood that the carrying board 130 can be a structure such as a flexible circuit board, a main board 180, a circuit board, a small board, a bracket, etc. in the wearable electronic device 10, and any structure that can carry the temperature sensor 120 is described in the embodiment of the present application. Within the scope of protection, the embodiment of the present application does not limit the specific structure of the bearing plate 130 .

Wherein, the first heat insulating member 140 may be connected to the inner surface of the housing 110 or the thermally conductive electrode 111 . When the thermally conductive electrode 111 has a larger area on the outer surface of the housing 110, the first heat insulator 140 can be connected to the inner surface of the thermally conductive electrode 111; when the thermally conductive electrode 111 has a smaller area on the outer surface of the housing 110, The first heat insulator 140 may be connected to the inner surface of the case 110 . The first through hole 141 on the first heat insulator 140 can face all or part of the heat conduction electrode 111 , so that all or part of the heat induced by the heat conduction electrode 111 can conduct heat transfer through the first through hole 141 .

It can be understood that the first heat insulating member 140 can be in an annular structure, so that the first through hole 141 can be set corresponding to the projected position of the temperature sensor 120 on the casing 110 or the heat conduction electrode 111 , except for the first heat insulating member 140 Other parts outside the first through hole 141 can be set corresponding to other parts on the housing 110 or the thermally conductive electrode 111, the heat transferred by the thermally conductive electrode 111 can pass through the first through hole 141 and be conducted to the temperature sensor 120, and the temperature sensor 120 can be normal Work. At the same time, other parts of the first heat insulating member 140 except the first through hole 141 can isolate the temperature transfer of the area on the casing 110 other than the area corresponding to the temperature sensor 120, so that the temperature sensor 120 can detect the temperature of the external object more effectively. accurate.

It can be understood that the shape of the first heat insulator 140 can be adapted to the shape of the housing 110, for example, the housing 110 has a circular structure, and the first heat insulator 140 can be a ring structure; 110 is a square structure, and the first heat insulating member 140 may be a square ring structure. The embodiment of the present application does not limit the shape of the first heat insulating member 140 .

It can be understood that the first heat insulating member 140 may be, but not limited to, a heat insulating film, heat insulating glue, heat insulating coating and other structures. The embodiment of the present application does not limit the material of the first heat insulating member 140 either.

In the wearable electronic device 10 of the embodiment of the present application, the heat conduction electrode 111 is arranged on the housing 110, the temperature sensor 120 is arranged and connected to the carrier board 130, and the first heat insulating member 140 is arranged between the housing 110 and the carrier board 130, A first through hole 141 is disposed on the first heat insulating member 140 , and the temperature sensor 120 is disposed corresponding to the first through hole 141 . Based on this, the carrying plate 130 can be used as a carrier of the temperature sensor 120 to carry and fix the temperature sensor 120. The temperature sensor 120 is not easy to fall off from the carrying plate 130 when it is impacted or dropped, and the heat conduction connection between the temperature sensor 120 and the thermally conductive electrode 111 is stronger. , more stable; and, the temperature sensor 120 is arranged corresponding to the first through hole 141 of the first heat insulating member 140, and the first heat insulating member 140 can isolate the temperature conduction of other areas on the casing 110 other than the area corresponding to the temperature sensor 120 Therefore, the first heat insulating member 140 can avoid the influence of errors caused by the temperature of other regions on the temperature sensor 120, so that the temperature sensor 120 can detect the temperature of the external object with higher accuracy.

Wherein, please refer to FIG. 1 to FIG. 3 again, the wearable electronic device 10 may further include a wearing part 150 and a display screen 160 .

The wearing part 150 can be connected with the housing 110 to connect the housing 110 with an external object, and the wearing part 150 can be connected with two ends of the housing 110 for connecting the wearable electronic device 10 with an external object. It can be understood that the external object may be the user's wrist, ankle or neck, and of course, other parts where the wearable electronic device 10 may be worn.

It can be understood that the wearing part 150 can be rotatably connected to the two ends of the casing 110 through a rotating shaft, and the wearing part 150 can also be fixedly connected to the two ends of the casing 110 through integral molding. The material of the wearing part 150 may be metal, or non-metal such as plastic or nylon. The material of the wearing part 150 can be set according to actual needs, which is not limited in this embodiment of the present application.

The display screen 160 can be installed on the housing 110 to form the display surface of the wearable electronic device 10, for the wearable electronic device 10 to display information such as images and texts, or to simultaneously display images and texts and provide The user performs human-computer interaction, for example, the user may perform touch operations on the wearable electronic device 10 through the display screen 160 . The display screen 160 may be a liquid crystal display (Liquid Crystal Display, LCD) or an organic light-emitting diode display (Organic Light-Emitting Diode, OLED).

It can be understood that the display screen 160 may include a display area and a non-display area. Among them, the display area performs the display function of the display screen 160, and is used for displaying information such as images and texts by the wearable electronic device 10, and the non-display area does not display information, and is used for setting functional components such as cameras and display screen touch electrodes. The display screen 160 can also be a full screen. In this case, the display screen 160 can display information in a full screen, so that the wearable electronic device 10 has a larger screen-to-body ratio. The display screen 160 only includes a display area and does not include a non-display area, or the area of the non-display area is relatively small for the user. At this time, functional components such as a camera and a proximity sensor in the wearable electronic device 10 may be hidden under the display screen 160 .

Wherein, please refer to FIG. 5 and FIG. 6 in conjunction with FIG. 3 and FIG. 4 . FIG. 5 is a schematic structural view of the bearing plate 130 shown in FIG. 3 , and FIG. 6 is another perspective view of the bearing plate 130 shown in FIG. 3 Schematic diagram of the structure. The carrying plate 130 may include a main body part 133 and a carrying part 134 .

The bearing plate 130 is provided with a slot such as a first slot 138, the first slot 138 can be extended from the edge of the bearing plate 130 toward the middle of the bearing plate 130, and the bearing portion 134 can be connected to a part of the first slot 138 On the inner wall, except for the edge connected with the part of the inner wall of the first slot 138 on the bearing part 134, there may be gaps between other edges of the bearing part 134 and other inner walls of the first slot 138, such as the first gap 131 and the second gap 131. The gap 132 , and thus, the bearing portion 134 may be independent of the main body portion 133 .

As shown in Figure 5 and Figure 6, the first gap 131 and the second gap 132 can be arranged at intervals, the first gap 131 and the second gap 132 can be extended from the edge of the carrier plate 130 toward the middle of the carrier plate 130, the first The gap 131 may be located between one inner wall of the first slot 138 and the bearing part 134 , and the second gap 132 may be located between the other inner wall of the first slot 138 and the bearing part 134 . The bearing portion 134 may be formed between the first gap 131 and the second gap 132, the main body portion 133 may be formed outside the first gap 131 and the second gap 132, the first gap 131 and the second gap 132 make the bearing portion 134 One side can be connected with the main body part 133 , and the other side of the bearing part 134 can be separated from the main body part 133 , and the bearing part 134 can be independent of the main body part 133 .

The temperature sensor 120 can be disposed on the bearing part 134 . For example, the temperature sensor 120 can be fixed on one surface of the bearing part 134 through a soldering process. Certainly, the temperature sensor 120 may also be arranged and fixed on the carrier board 130 in other ways, which is not limited in this embodiment of the present application.

In the carrying plate 130 of the embodiment of the present application, the carrying plate 130 is connected to a part of the inner wall of the first slot 138 so that the carrying portion 134 is independent from the main body portion 133. On the one hand, when the wearable electronic device 10 is impacted or dropped, the carrying portion 134 can drive the temperature sensor 120 to move up and down in a small range relative to the main body 133, so as to avoid the inconsistency between the inertial force of the bearing plate 130 and the inertial force of the temperature sensor 120 during the collision, resulting in the separation of the temperature sensor 120 from the bearing plate 130; On the other hand, when the temperature sensor 120 is fixed on the bearing part 134, the bearing part 134 can move up and down in a small range relative to the main body part 133. This small movement can absorb the manufacturing tolerance when the temperature sensor 120 and the bearing part 134 are fixed, so that the temperature sensor 120 and the bearing part 134 can be fixed together. The bearing part 134 is fixed more firmly and more stably.

Wherein, please refer to FIG. 4 to FIG. 6 again, the wearable electronic device 10 may further include a reinforcing member 170 , and the reinforcing member 170 may be disposed on two opposite sides of the carrying portion 134 respectively with the temperature sensor 120 .

The reinforcing piece 170 can be used to enhance the rigidity of the bearing part 134 . The bearing part 134 may include a first surface 1341 and a second surface 1342 that are oppositely disposed. The first surface 1341 may be disposed toward the housing 110 , the thermally conductive electrode 111 and the first heat insulator 140 . The second surface 1342 may be located on the first surface 1341 On the side away from the housing 110 , the thermally conductive electrode 111 and the first heat insulator 140 , the reinforcing member 170 and the temperature sensor 120 can be respectively arranged on the first surface 1341 and the second surface 1342 , and the reinforcing member 170 can strengthen the bearing part 134 Rigidity, so as to facilitate the fixed connection of the temperature sensor 120 and the bearing part 134 .

It can be understood that the temperature sensor 120 can be connected to the first surface 1341 and the reinforcing member 170 is connected to the second surface 1342. On the side of the carrying portion 134 away from the thermally conductive electrode 111 . Since the temperature sensing pins of the temperature sensor 120 are arranged inside the package of the temperature sensor 120, at this time, the heat induced by the thermally conductive electrode 111 can be transferred to the package structure around the temperature sensor 120, and then transferred to the pins of the temperature sensor 120 , the heat transfer path is longer.

It can be understood that, as shown in FIG. 4 to FIG. 6 , the temperature sensor 120 can also be connected to the second surface 1342 and the reinforcing member 170 can be connected to the first surface 1341, and the reinforcing member 170 is arranged on the carrying portion 134 and the thermally conductive electrode 111 Between them, the temperature sensor 120 may be disposed on a side of the carrying portion 134 away from the thermally conductive electrode 111 . Since the temperature sensing pins of the temperature sensor 120 are set on the bearing part 134, when the reinforcing member 170 is set on the first surface 1341 and the temperature sensor 120 is set on the second surface 1342, the pins of the temperature sensor 120 can be directly connected to the reinforcing element. The strong part 170 is connected, and the heat induced by the thermally conductive electrode 111 can be transferred to the reinforcing part 170 and directly to the pin of the temperature sensor 120 , and the heat transfer path is relatively short.

It can be understood that the reinforcing member 170 can be arranged facing the temperature sensor 120 , and the projection of the reinforcing member 170 on the carrying portion 134 can cover the projection of the temperature sensor 120 on the carrying portion 134 to further enhance the rigidity of the carrying plate 130 .

It can be understood that the reinforcing piece 170 can be a conductive structure such as a reinforcing steel sheet, so that the reinforcing piece 170 can not only strengthen the structural strength of the bearing part 134 , but also transfer the heat of the thermally conductive electrode 111 .

In the wearable electronic device 10 of the embodiment of the present application, the reinforcing member 170 is disposed between the carrying portion 134 and the thermally conductive electrode 111 and connected to the first surface 1341 of the carrying portion 134, and the temperature sensor 120 is connected to the second surface of the carrying portion 134 1342, on the one hand, the reinforcing piece 170 can enhance the structural strength of the bearing part 134, facilitating the fixed connection between the temperature sensor 120 and the bearing part 134; on the other hand, the heat induced by the thermally conductive electrode 111 can be directly transferred to the temperature On the pins of the sensor 120 , the heat transfer path is shorter, and the detection of the temperature sensor 120 is more accurate.

Among them, please refer to FIG. 3 and FIG. 4 again. The wearable electronic device 10 may also include a main board 180 .

The main board 180 can be arranged on the side of the carrier plate 130 away from the thermally conductive electrode 111. At this time, the thermally conductive electrode 111, the first heat insulating member 140, the reinforcing member 170, the carrier board 130, the temperature sensor 120 and the main board 180 can be stacked in sequence. The carrying board 130 can be connected with the main board 180 , and the main board 180 can carry the carrying board 130 and the temperature sensor 120 .

Please refer to FIG. 4 and FIG. 5 , the carrying plate 130 can also include a fixing portion 135, which can be connected to the main body portion 133, and the fixing portion 135 can be arranged opposite to the carrying portion 134, for example, the carrying portion 134 is arranged on On the right edge, the fixing portion 135 can be disposed on the left edge so as to be away from the carrying portion 134 .

The main board 180 may include a third surface 181 and a fourth surface 182 that are oppositely disposed. The third surface 181 may be disposed toward the temperature sensor 120, the carrier board 130 and the thermally conductive electrode 111, and the fourth surface 182 may be disposed away from the third surface 181. On one side of the temperature sensor 120 , the carrying plate 130 and the thermally conductive electrode 111 , the third surface 181 may be located between the carrying plate 130 and the fourth surface 182 . The fixed part 135 can be bent toward the direction where the fourth surface 182 is located on the side where the third surface 181 of the main board 180 is located and extends to the fourth surface 182, and the fixed part 135 can be on the fourth surface 182 of the main board 180 and the main board 180 connect. For example, the fixing part 135 can be welded and fixed to the main board 180 on the fourth surface 182 .

In the wearable electronic device 10 of the embodiment of the present application, the main board 180 can carry the carrier board 130 and the temperature sensor 120 , and the main board 180 can further improve the connection stability and firmness of the temperature sensor 120 . In addition, the fixed part 135 of the carrier board 130 is bent and extended to the fourth surface 182 to connect with the main board 180. The fixed part 135 can cover a part of the main board 180 and then be connected with the main board 180. The connection stability of the sensor 120 is better.

Wherein, please continue to refer to FIG. 3 and FIG. 4 and please refer to FIG. 7 . FIG. 7 is a schematic structural diagram of the main board 180 shown in FIG. 3 . The temperature sensor 120 may be located between the main board 180 and the carrier board 130 , and the wearable electronic device 10 may further include a second thermal insulation 190 , at least part of the second thermal insulation 190 may be located between the main board 180 and the temperature sensor 120 .

As shown in Figure 7, a groove 183 can be provided on the main board 180, and the groove 183 can be set corresponding to the bearing part 134 and the temperature sensor 120. When the main board 180, the bearing board 130 and the temperature sensor 120 are assembled, all or part of the temperature sensor 120 can be accommodated in the groove 183, and at least part of the second heat insulating member 190 can also be arranged in the groove 183, and the second heat insulating member 190 can prevent the temperature generated by other components on the motherboard 180 from affecting the temperature sensor 120 .

It can be understood that the groove 183 may be a through groove structure, that is, the groove 183 may pass through the thickness direction of the main board 180 . When the temperature sensor 120 , the carrier board 130 and the main board 180 are assembled, glue can be dispensed in the space of the groove 183 on the fourth surface 182 of the main board 180 to form the second heat insulating member 190 . Certainly, the groove 183 may also have a bottom wall, and in this case, the second heat insulating member 190 may be formed on the bottom surface of the temperature sensor 120 first, and then the temperature sensor 120 is assembled on the main board 180 .

It can be understood that the length and width of the groove 183 can be greater than the length and width of the temperature sensor 120, when the temperature sensor 120 is arranged in the groove 183, the temperature sensor 120 and the surrounding side walls of the groove 183 can be There is a gap, when the temperature sensor 120 is dispensing, the second thermal insulation 190 can be formed on the surrounding and bottom surface of the temperature sensor 120, and the second thermal insulation 190 can surround the temperature sensor 120 to further reduce the thickness of the main board 180. The influence of the heating of the upper device on the temperature sensor 120.

It can be understood that the above is only an exemplary formation method of the second heat insulating member 190 , and the second heat insulating member 190 may also be, but not limited to, structures such as heat insulating film, heat insulating glue, heat insulating coating, and the like. The embodiment of the present application does not limit the material of the second heat insulating member 190 .

Wherein, please refer to FIG. 7 again, a notch 184 may be provided on the edge of the main board 180 , and the notch 184 may be sunken from the edge of the main board 180 toward the middle of the main board 180 . The notch 184 can be set corresponding to the fixing part 135 of the carrier board 130. When the fixing part 135 is bent from the third surface 181 and extends to the fourth surface 182 to connect with the main board 180, the fixing part 135 can be accommodated in the notch 184 to reduce the fixing. Section 135 occupies the space.

It can be understood that the size of the notch 184 can be adapted to the size of the fixing part 135, and the shape of the notch 184 can also be adapted to the bending arc of the fixing part 135, so that the fixing part 135 can be as close as possible to the notch during the bending process. 184 edge fit. The embodiment of the present application does not limit the specific structure of the notch 184 .

Wherein, please refer to FIG. 7 again, the main board 180 may be provided with a light-emitting device 185 , the light-emitting device 185 may be provided on the third surface 181 , and the light-emitting device 185 may be provided on the side of the carrier board 130 away from the heat-conducting electrode 111 . The light emitting device 185 can emit light toward the direction where the thermally conductive electrode 111 is located.

It can be understood that the light emitting device 185 may include a light emitter 1851 and a light receiver 1852, the light emitted by the light emitter 1851 can propagate toward the direction where the thermally conductive electrode 111 is located and can be reflected and received by light after encountering an obstacle Device 1852 receives.

It can be understood that a plurality of light emitters 1851 and a plurality of light receivers 1852 can be arranged on the main board 180, the plurality of light emitters 1851 can emit light of at least two colors, and each light receiver 1852 can receive light of one color light, and the light receivers 1852 receiving the same color are arranged at intervals, so as to prevent the phenomenon of light crossing caused by light of different colors.

It can be understood that the light emitted by the light emitting device 185 can pass through the gap between the inner wall of the slot on the carrier board 130 and the carrier part 134 . For example, the light emitted by the light emitting device 185 can pass through the first gap 131 and the second gap 132 and transmit toward the direction where the thermally conductive electrode 111 is located.

Since the carrier board 130 is disposed between the main board 180 and the thermally conductive electrode 111, part of the light transmitted by the light emitting device 185 may contact the carrier board 130 and be directly received by the light receiver 1852, thereby causing light crossing. The first slot 138 provided on the bearing plate 130 of the embodiment of the present application forms a first gap 131 and a second gap 132 between the inner wall of the first slot 138 and the bearing part 134, and the first gap 131 and the second gap 132 can reduce the probability of light contacting the carrier board 130, thereby reducing the occurrence of light crossing phenomenon.

It can be understood that, please refer to FIG. 5 and FIG. 6 again, in addition to the first gap 131 and the second gap 132, one or more second slots 136 can also be set on the carrier plate 130, the second slot 136 It can be disposed on the main body portion 133 of the carrying plate 130 to further reduce the phenomenon of crossing light.

It can be understood that, referring to FIG. 5 and FIG. 7 , one or more third through holes 137 may also be provided on the carrier board 130 , and one or more third through holes 137 may correspond to multiple light emitters of the light emitting device 185 1851 and a plurality of light receivers 1852 are arranged, so that one third through hole 137 can be set corresponding to one light emitter 1851 or one light receiver 1852 . The light emitting device 185 on the main board 180 can pass through the third through hole 137 to transmit light to the direction where the casing 110 is located, and the carrying board 130 will not block the light emitting device 185 from transmitting light.

It can be understood that, in the above embodiments, the carrying board 130 may be a flexible board, for example, the carrying board 130 may be a flexible circuit board (FPC). The bearing board 130 can also have the function of detecting whether the wearable electronic device 10 is worn on the human body, and the bearing board 130 can be a flexible circuit board with a capacitive proximity sensor (CAPsensor for short) function.

The carrier board 130 in the embodiment of the present application can be used as the carrier of the temperature sensor 120, and can also be used as a device for detecting whether the wearable electronic device 10 is worn on the human body. The carrier board 130 realizes multiplexing, which can reduce the structural stacking of the wearable electronic device 10 .

Wherein, please refer to FIG. 8 , which is a second structural schematic diagram of the wearable electronic device 10 provided by the embodiment of the present application. The carrying board 130 may be the main board 180 of the wearable electronic device 10 . At this time, the casing 110 or the thermally conductive electrode 111, the first heat insulating element 140, the temperature sensor 120, the second heat insulating element 190 and the main board 180 (carrier plate 130) can be stacked in sequence, and at least part of the second heat insulating element 190 can be Located between the main board 180 and the temperature sensor 120 .

It can be understood that, when the main board 180 is a rigid board, the wearable electronic device 10 may not be disposed on the reinforcing member 170 because the rigid board has a certain structural strength. When the main board 180 is a flexible board, a reinforcement 170 can also be provided at this time. The reinforcement 170 can be arranged on opposite sides of the main board 180 with the temperature sensor 120. The projection of the reinforcement 170 on the main board 180 can cover the temperature sensor. 120 is projected on the main board 180 to strengthen the structure of the main board 180 .

It can be understood that the main board 180 may be a circuit board of the wearable electronic device 10 , and a control module may be arranged on the main board 180 to realize various controls of the wearable electronic device 10 . Certainly, the main board 180 may also be a structure such as a small board or a bracket in the wearable electronic device 10 , and the embodiment of the present application does not limit the specific structure of the main board 180 .

In the wearable electronic device 10 of the embodiment of the present application, the carrier board 130 is the main board 180 of the wearable electronic device 10 , which can reduce the structural stacking of the wearable electronic device 10 and realize thinning of the wearable electronic device 10 .

Wherein, please refer to FIG. 9 , which is a schematic diagram of a third structure of the wearable electronic device 10 provided by the embodiment of the present application. When the heat conduction electrode 111 is a non-metal heat conduction electrode 1111 , the wearable electronic device 10 may further include a heat conduction element 200 .

The heat conduction element 200 may be disposed between the non-metal heat conduction electrode 1111 and the carrier plate 130 . The heat conduction element 200 can be connected with the non-metallic heat conduction electrode 1111 and connected with the temperature sensor 120 by heat conduction, for example, the heat conduction element 200 can be connected with the reinforcing element 170 arranged on the carrier board 130 and be connected with the temperature sensor 120 through the force conduction element 170 .

It can be understood that the non-metallic heat-conducting electrode 1111 can be a non-metallic heat-conducting electrode 1111 made of glass, the heat-conducting member 200 can be bonded on the inner surface of the non-metallic heat-conducting electrode 1111, and the heat-conducting member 200 can be connected with the reinforcing member 170 to The heat is transferred to the reinforcing member 170 .

It can be understood that, as shown in conjunction with FIG. 2 and FIG. 9, when the thermally conductive electrode 111 is a non-metallic thermally conductive electrode 1111, the nonmetallic thermally conductive electrode 1111 can form most of the rear shell of the wearable electronic device 10, and the housing 110 A small portion of the rear case of the wearable electronic device 10 may be formed. The casing 110 can surround the periphery of the non-metallic heat-conducting electrode 1111, and the casing 110 can be a plastic frame surrounding the non-metallic heat-conducting electrode 1111. At this time, from the appearance of the wearable electronic device 10, the non-metallic heat-conducting electrode 1111 The area on the outer surface of the wearable electronic device 10 is large, and there is no obvious gap in the appearance of the wearable electronic device 10 , and the appearance integrity is high.

It can be understood that, when the thermally conductive electrode 111 is a non-metallic thermally conductive electrode 1111 , an electroplating coating process may be performed on the nonmetallic thermally conductive electrode 1111 to realize an electrocardiogram (ECG) detection function. For its specific implementation, reference may be made to related technologies, which will not be described in detail here.

Wherein, please refer to FIG. 10 , which is a schematic diagram of a fourth structure of the wearable electronic device 10 provided by the embodiment of the present application. When the heat conduction electrode 111 is a metal heat conduction electrode 1112, a second through hole 112 can be opened on the casing 110, and the metal heat conduction electrode 1112 can be arranged in the second through hole 112 and directly opposite to the temperature sensor 120. The projection on the carrier board 130 may cover the projection of the temperature sensor 120 on the carrier board 130 . At this time, the metal heat-conducting electrode 1112 can be directly connected to the reinforcing member 170 , and the metal heat-conducting electrode 1112 can directly transfer heat to the reinforcing member 170 and then to the temperature sensor 120 .

It can be understood that, due to the better thermal conductivity of metal materials, the rear shell of the wearable electronic device 10 may not be provided with the heat conduction member 200 , which can reduce the structural stacking of the wearable electronic device 10 and save production costs.

Based on the above-mentioned wearable electronic device 10, the embodiment of the present application also provides a manufacturing method of the wearable electronic device 10, which can be applied to the wearable electronic device 10 in any of the above-mentioned embodiments. Please refer to FIG. 11 . FIG. 11 is a schematic flowchart of the first method of manufacturing the wearable electronic device 10 provided by the embodiment of the present application. The wearable electronic device 10 includes a housing 110 , a load plate 130 , a first heat insulator 140 and a temperature sensor 120 . The housing 110 is provided with a thermally conductive electrode 111 configured to be in contact with an external object. The preparation method of wearable electronic device 10 comprises:

In 101, the thermally conductive electrode 111 is connected to the casing 110 to form a first whole;

An appropriate heat-conducting electrode 111 can be selected according to requirements, and then the heat-conducting electrode 111 is connected to the casing 110 to form a first whole.

It can be understood that, when the thermally conductive electrode 111 is a non-metallic thermally conductive electrode 1111 , the shell 110 can be arranged around the periphery of the thermally conductive electrode 111 and connected to the thermally conductive electrode 111 . The housing 110 can be fixed to the heat-conducting electrode 111 by, but not limited to, bonding glue, a clamping structure, a welding structure, a riveting structure, and the like.

It can be understood that, when the heat-conducting electrode 111 is a metal heat-conducting electrode 1112, a second through hole 112 can be opened on the housing 110, and then the metal heat-conducting electrode 1112 can be placed in the second through hole 112 and fixedly connected to the housing 110 .

In 102, connect the first heat insulating element 140 to the first whole, and open a first through hole 141 on the first heat insulating element 140;

After the casing 110 is connected and fixed with the thermally conductive electrode 111 to form a first whole, the first heat insulating member 140 can be connected to the first whole.

It can be understood that, the first heat insulating member 140 can be connected to the first whole by but not limited to bonding, welding, clipping, riveting and the like. For example, the first heat insulating element 140 may be bonded to the first body through a first adhesive layer.

It can be understood that, when the thermally conductive electrode 111 has a larger area on the outer surface of the wearable electronic device 10, the first heat insulating member 140 can be connected to the inner surface of the thermally conductive electrode 111; When the area on the outer surface of the housing 10 is small, the first heat insulating member 140 may be connected to the inner surface of the casing 110 .

In 103, the temperature sensor 120 is connected to the carrier board 130 to form a second whole;

The temperature sensor 120 can be attached to the carrier board 130 by but not limited to soldering process, and the temperature sensor 120 can be fixedly connected with the carrier board 130 to form a second integral body.

It can be understood that the carrying portion 134 and the main body portion 133 can be pre-formed on the carrying plate 130, and the reinforcing member 170 can be pre-set on the first surface 1341 of the carrying portion 134, and the reinforcing member 170 can be, but not limited to, bonded, It is welded on the first surface 1341 of the bearing part 134 , and then the temperature sensor 120 can be connected to the second surface 1342 of the bearing plate 130 .

In step 103 , on the side of the first heat insulating member 140 away from the heat conducting electrode 111 , connect the second body to the first body, and make the temperature sensor 120 correspond to the first through hole 141 .

After the temperature sensor 120 and the bearing plate 130 are fixedly connected, the fixedly connected temperature sensor 120 and the bearing plate 130 can be assembled on the housing 110, and in this process, it can be ensured that the temperature sensor 120 is set corresponding to the first through hole 141, so that Heat can be transferred to the temperature sensor 120 through the first through hole 141 .

It can be understood that when the heat-conducting electrode 111 is a metal heat-conducting electrode 1112, the metal heat-conducting electrode 1112 and the reinforcement member 170 can be directly welded together by a laser welding process. At this time, the connection between the housing 110 and the temperature sensor 120 is firm and reliable. , which can meet the stability and reliability test of falling and not falling off.

In the wearable electronic device 10 of the embodiment of the present application, the heat-conducting electrode 111 is connected and fixed with the housing 110 to form a first whole, and the carrying plate 130 is connected and fixed with the temperature sensor 120 to form a second whole, and the second whole is connected to the first whole. Compared with the solution in which the temperature sensor 120 is connected to the housing 110 through heat-conducting silica gel, the carrier plate 130 of the embodiment of the present application can be used as the carrier of the temperature sensor 120 to carry the fixed temperature sensor 120, and the temperature sensor 120 is impacted or dropped. It is not easy to fall off from the bearing plate 130, and the heat conduction connection between the temperature sensor 120 and the heat conduction electrode 111 is firmer and more stable.

Wherein, please refer to FIG. 12 . FIG. 12 is a schematic flowchart of a second manufacturing method of the wearable electronic device 10 provided by the embodiment of the present application. The preparation method of wearable electronic device 10 comprises:

In 101, the thermally conductive electrode 111 is connected to the casing 110 to form a first whole;

In 102, connect the first heat insulating element 140 to the first whole, and open a first through hole 141 on the first heat insulating element 140;

In 103, the temperature sensor 120 is connected to the carrier board 130 to form a second whole;

In step 104 , on the side of the first heat insulating member 140 away from the heat-conducting electrode 111 , the second integral body is connected to the first integral body, and the temperature sensor 120 is disposed corresponding to the first through hole 141 .

Before assembling the first heat insulator 140 and the casing 110 , you can firstly select a suitable thermally conductive electrode 111 according to requirements, and then connect the thermally conductive electrode 111 with the casing 110 to form the first whole. Then, the first thermal insulation member 140 may be connected to the first body. Next, the temperature sensor 120 can be fixedly connected to the bearing plate 130 to form a second integral body, and then the fixedly connected temperature sensor 120 and the bearing plate 130 can be assembled to the first integral body. In this process, it can be ensured that the temperature sensor 120 corresponds to The first through hole 141 is configured so that heat can pass through the first through hole 141 and be transferred to the temperature sensor 120 .

In 105, heat insulating glue is applied to the area between the temperature sensor 120 and the main board 180 to form a second heat insulating member 190;

At 106 , the second unit is connected to the motherboard 180 .

A groove 183 can be provided on the main board 180, at least part of the temperature sensor 120 can be arranged in the groove 183, and heat insulating glue can be applied in the groove 183 to form a second heat insulating member 190, the second heat insulating member 190 is at least It can be arranged between the temperature sensor 120 and the main board 180 to isolate the influence of the heat generated on the main board 180 on the temperature sensor 120 .

It can be understood that the carrying board 130 may include a fixing portion 135, and the fixing portion 135 may be bent and extended from the direction where the third surface 181 of the carrying board 130 is located toward the direction where the fourth surface 182 is located to the fourth surface 182 and connected to the main board 180. For connection, the fixing part 135 may be connected with the main board 180 by, but not limited to, soldering and other processes. This embodiment of the present application does not limit it.

It can be understood that the wearable electronic device 10 further includes a second heat insulating member 190 and a main board 180 , the carrier board 130 may be the main board 180 , and at least part of the second heat insulating member 190 is located between the main board 180 and the temperature sensor 120 .

It can be understood that, the bearing plate 130 is provided with a slot such as a first slot 138, and the slot such as the first slot 138 extends from the edge of the bearing plate 130 toward the middle of the bearing plate 130; the bearing plate 130 includes a bearing portion 134 , the bearing part 134 is connected to a part of the inner wall of the slot such as the first slot 138 , and the temperature sensor 120 is disposed on the bearing part 134 .

It can be understood that the carrying portion 134 includes a first surface 1341 and a second surface 1342 oppositely disposed, the first surface 1341 is disposed toward the thermally conductive electrode 111 , and the second surface 1342 is located on a side of the first surface 1341 away from the thermally conductive electrode 111 . The wearable electronic device 10 further includes a reinforcement 170 connected to the first surface 1341 , and the temperature sensor 120 is connected to the second surface 1342 .

It can be understood that the thermally conductive electrode 111 is a non-metallic thermally conductive electrode 1111; the wearable electronic device 10 also includes a thermally conductive member 200, which is arranged between the nonmetallic thermally conductive electrode 1111 and the carrier plate 130, and the thermally conductive member 200 is connected to the nonmetallic thermally conductive Electrode 1111 is connected and thermally conductively connected to temperature sensor 120 .

It can be understood that the thermally conductive electrode 111 is a metal thermally conductive electrode 1112 , and the housing 110 is provided with a second through hole 112 .

In the wearable electronic device 10 of the embodiment of the present application, the main board 180 can carry the carrier board 130 and the temperature sensor 120 , and the main board 180 can further improve the connection stability and firmness of the temperature sensor 120 . In addition, the fixed part 135 of the carrier board 130 is bent and extended to the fourth surface 182 to connect with the main board 180. The fixed part 135 can cover a part of the main board 180 and then be connected with the main board 180. The connection stability of the sensor 120 is better. In addition, the fixing part 135 of the carrier board 130 can cover a part of the main board 180 and then be connected with the main board 180 , the connection between the main board 180 and the carrier board 130 is stronger, and the connection stability of the temperature sensor 120 is better.

It should be noted that in the description of the present application, the terms "first" and "second" are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.

The above disclosure provides many different implementations or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described above. Of course, they are examples only and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or reference letters in various instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

The wearable electronic device provided in the embodiments of the present application and the manufacturing method thereof are described in detail above. In this paper, specific examples are used to illustrate the principles and implementation methods of the present application, and the descriptions of the above embodiments are only used to help understand the present application. At the same time, for those skilled in the art, based on the idea of this application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as limiting the application.

Claims (20)

1. A wearable electronic device, comprising:

   a casing, on which a thermally conductive electrode is arranged, and the thermally conductive electrode is configured to be in contact with an external object;

   a bearing plate arranged in the housing;

   a first heat insulating element, located between the heat conducting electrode and the bearing plate, and a first through hole is provided on the first heat insulating element; and

   A temperature sensor is arranged and connected to the carrier plate, the temperature sensor is arranged corresponding to the first through hole, and the temperature sensor is thermally connected to the heat conduction electrode to detect the temperature of the external object.
2. The wearable electronic device according to claim 1, wherein a slot is provided on the bearing plate, and the slot extends from the edge of the bearing plate toward the middle of the bearing plate; the bearing plate A bearing part is included, the bearing part is connected to a part of the inner wall of the groove, and the temperature sensor is arranged on the bearing part.
3. The wearable electronic device according to claim 2, wherein the bearing part includes a first surface and a second surface oppositely arranged, the first surface is arranged facing the thermally conductive electrode, and the second surface is located on the The first surface is away from the side of the heat-conducting electrode; the wearable electronic device further includes a reinforcement, the reinforcement is connected to the first surface, and the temperature sensor is connected to the second surface.
4. The wearable electronic device according to claim 2, further comprising:

   The light emitting device is arranged on the side of the bearing plate away from the thermally conductive electrode, and the light emitted by the light emitting device passes through the gap between the bearing part and the inner wall of the slot.
5. The wearable electronic device according to claim 1, further comprising:

   A main board, the main board is arranged on a side of the carrying plate away from the thermally conductive electrode, and the carrying plate is connected to the main board.
6. The wearable electronic device according to claim 5, wherein the motherboard includes a third surface and a fourth surface oppositely disposed, and the third surface is located between the carrier board and the fourth surface; The carrier board includes:

   A fixing part, the fixing part bends from the third surface toward the direction where the fourth surface is located and extends to the fourth surface, and the fixing part is connected to the fourth surface.
7. The wearable electronic device according to claim 5, wherein the temperature sensor is located between the main board and the carrier plate; the wearable electronic device further comprises:

   The second heat insulating element, at least part of the second heat insulating element is located between the main board and the temperature sensor.
8. The wearable electronic device according to claim 7, wherein a groove is formed on the main board, and at least part of the second heat insulating member is disposed in the groove.
9. The wearable electronic device according to claim 5, wherein the carrying board is a flexible board.
10. The wearable electronic device according to claim 1, wherein the wearable electronic device comprises a main board, and the carrying board is the main board.
11. The wearable electronic device according to claim 10, wherein the wearable electronic device further comprises:

    The second heat insulating element, at least part of the second heat insulating element is located between the main board and the temperature sensor.
12. The wearable electronic device according to claim 1, wherein the thermally conductive electrode is a non-metallic thermally conductive electrode, and the wearable electronic device further comprises:

    A heat conduction element is arranged between the non-metal heat conduction electrode and the bearing plate, and the heat conduction element is connected to the non-metal heat conduction electrode and is thermally conductively connected to the temperature sensor.
13. The wearable electronic device according to claim 1, wherein the heat-conducting electrode is a metal heat-conducting electrode, and a second through hole is opened on the housing, and the metal heat-conducting electrode is arranged in the second through hole and connected to the second through hole. The temperature sensor is arranged directly opposite.
14. A method for preparing a wearable electronic device. The wearable electronic device includes a casing, a bearing plate, a first heat insulating member, and a temperature sensor. The casing is provided with a thermally conductive electrode, and the thermally conductive electrode is configured to communicate with an external object contact; the preparation method comprises:

    connecting the thermally conductive electrode to the housing to form a first unit;

    connecting the first heat insulating element to the first whole, and opening a first through hole in the first heat insulating element;

    connecting the temperature sensor to the carrier plate to form a second unit;

    On the side of the first heat insulating member away from the heat conduction electrode, the second integral body is connected to the first integral body, and the temperature sensor is disposed corresponding to the first through hole.
15. The manufacturing method of a wearable electronic device according to claim 14, wherein the wearable electronic device further comprises a second heat insulating member and a main board, and the temperature sensor is located between the main board and the carrier board; Said preparation method also includes:

    Putting heat insulating glue on the area between the temperature sensor and the main board to form the second heat insulating member;

    The second whole is connected to the main board.
16. The method for preparing a wearable electronic device according to claim 14, wherein the wearable electronic device further comprises a second heat insulating member and a main board, the carrying board is the main board, and at least part of the second heat insulating The component is located between the main board and the temperature sensor.
17. The manufacturing method of a wearable electronic device according to claim 14, wherein a slot is provided on the bearing plate, and the slot extends from the edge of the bearing plate toward the middle of the bearing plate; The bearing plate includes a bearing part, the bearing part is connected to part of the inner wall of the groove, and the temperature sensor is arranged on the bearing part.
18. The method for manufacturing a wearable electronic device according to claim 17, wherein the carrying portion includes a first surface and a second surface oppositely disposed, the first surface is disposed facing the thermally conductive electrode, and the second surface Located on the side of the first surface away from the thermally conductive electrode; the wearable electronic device further includes a reinforcement, the reinforcement is connected to the first surface, and the temperature sensor is connected to the second noodle.
19. The method for preparing a wearable electronic device according to claim 14, wherein the thermally conductive electrode is a non-metallic thermally conductive electrode; the wearable electronic device further comprises:

    A heat conduction element is arranged between the non-metal heat conduction electrode and the bearing plate, and the heat conduction element is connected to the non-metal heat conduction electrode and is thermally conductively connected to the temperature sensor.
20. The method for manufacturing a wearable electronic device according to claim 14, wherein the heat-conducting electrode is a metal heat-conducting electrode, a second through hole is opened on the housing, and the metal heat-conducting electrode is arranged on the second through-hole. The hole is set directly opposite to the temperature sensor.

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