WO2023015741A1

WO2023015741A1 - Atomized base material, slurry for manufacturing atomized base material, and method for manufacturing atomized base material

Info

Publication number: WO2023015741A1
Application number: PCT/CN2021/128190
Authority: WO
Inventors: 詹海林; 黎英岳; 黎长顺; 李亚勇
Original assignee: 安徽晶梦新材料技术有限公司
Priority date: 2021-08-13
Filing date: 2021-11-02
Publication date: 2023-02-16
Also published as: CN114674168A; CN113624048A; CN114234691A; CN114370783A; CN217275766U; CN217877261U; CN114674169A

Abstract

An atomized base material, comprising a loose layer and a compact layer, wherein a surface of the loose layer is a seepage surface, a surface of the compact layer is an atomized surface, a plurality of pore structures are formed in the loose layer and the compact layer, the pore diameter of the pore structures in the loose layer is larger than that of the pore structures in the compact layer, the thickness of the loose layer is larger than that of the compact layer, and an atomized liquid permeates the atomized base material from the seepage surface. Further disclosed in the present application are a slurry for manufacturing the atomized base material, and a method for manufacturing the atomized base material.

Description

Atomized substrate, slurry for manufacturing atomized substrate and method for manufacturing atomized substrate

technical field

The present application relates to the field of materials and electronic atomization, especially to an atomization base material, a slurry for manufacturing the atomization base material, and a manufacturing method of the atomization base material.

Background technique

Existing atomizers are widely used in smoking sets, medical atomization and other fields, and the key to atomization products is the use of atomizer cores. Existing atomizer cores generally include cotton cores and ceramic cores, and the cotton cores are made of organic cotton. It has the advantages of high product absorption and reduction, but it is easy to burn and other disadvantages; while the ceramic core has the advantages of easy assembly and stable performance, and the use of ceramic cores is more extensive. The use of cotton core and ceramic core has the problem of easy oil leakage. When the capillary pore size in the ceramic core is large, the penetration efficiency of e-liquid is high, but it is easy to leak oil. If the pore size is small, it will cause difficulty in the penetration of e-liquid. cause dry burn problems. Patent application No. 201910740263.9 of the People's Republic of China discloses a ceramic core that solves the above technical problems, which is manufactured by a casting process. Specifically, three different ceramic slurries are used to obtain green embryos by layered casting. Sintering molding, thereby obtaining three layered structures with different pore sizes, making the pore size of the liquid seepage surface larger for rapid infiltration of the atomized liquid, and making the pore size of the atomization surface smaller to prevent the passage of macromolecules and achieve liquid resistance The effect of preventing the leakage of atomized liquid.

However, the above-mentioned manufacturing method is complicated, requiring superposition of multiple tape casting processes, or adding a slurry coating process, and the uncontrollable factors of the process increase, resulting in a substantial increase in yield and cost.

Contents of the invention

In view of this, it is necessary to provide an atomized substrate with simple and controllable manufacturing process and satisfactory performance, a slurry for manufacturing the atomized substrate, and a method for manufacturing the atomized substrate.

In order to solve the above technical problems, the application provides an atomized base material, including a loose layer and a dense layer, the surface of the loose layer is a liquid seepage surface, the surface of the dense layer is an atomized surface, the loose layer and the dense layer A number of pore structures are formed inside the layer, the pore diameter of the pore structure in the loose layer is larger than that of the pore structure in the dense layer, the thickness of the loose layer is greater than the thickness of the dense layer, and the atomized liquid comes from the The liquid-permeable surface penetrates into the atomized substrate.

Preferably, the pore structure in the loose layer has a pore diameter between 30-120um, and the pore structure in the dense layer has a pore diameter between 10-45um.

Preferably, the pore structure in the loose layer has a pore diameter between 30-80um, and the pore structure in the dense layer has a pore diameter between 10-30um.

Preferably, the pore structure in the loose layer has a pore diameter between 40-50um, and the pore structure in the dense layer has a pore diameter between 12-30um.

Preferably, the atomized substrate further includes a transition layer located between the loose layer and the dense layer, and the pore structure in the transition layer has a pore size between 10-80um.

Preferably, the atomized substrate has a thickness of 1-3mm, a porosity of 44%-74%, and the dense layer has a thickness of 0.02-0.3um.

Preferably, the porosity of the atomized substrate is 53%-60%.

Preferably, the porosity of the atomized substrate is 60%-65%.

Preferably, the thickness of the atomized substrate is 2mm.

In order to solve the above technical problems, the application also provides a slurry for manufacturing atomized substrates, including the following components: 2-9wt% binder, 1-4wt% dispersant, 20-30wt% ceramic Powder, 15-26wt% pore forming agent and 41-47wt% organic solvent.

Preferably, the organic solvent is pure NMP (N-methylpyrrolidone) or NMP containing a small amount of non-solvent water (1-10vt%); the dispersant is PVP (polyvinylpyrrolidone), DSP (disodium hydrogen phosphate ), TEOA (triethanolamine) or one or more; the pore-forming agent includes one or more of starch, graphite, wood chips, sucrose; the binder is PESF (polyphenylene ether sulfone), PES One or more of (polyethersulfone), PVB (polyvinyl butyral), PMMA (polymethyl methacrylate).

Preferably, the components of the slurry include 2-4wt% binder, 1-3wt% dispersant, 23-26wt% ceramic powder, 20-25wt% pore-forming agent and 43-47wt% of organic solvents.

Preferably, the slurry includes 2.9-3.1wt% polyethersulfone, 1.4-1.6wt% polyvinylpyrrolidone, 25-26wt% ceramic powder, 23-24wt% graphite powder and 45-47wt% N-methylpyrrolidone.

Preferably, the slurry includes 6-9wt% of binder, 1-2wt% of dispersant, 27-29wt% of ceramic powder, 15-19wt% of pore forming agent and 43-45wt% of organic solvent.

Preferably, the slurry includes 7-8wt% polyethersulfone, 1.5-1.8wt% polyvinylpyrrolidone, 28-29wt% ceramic powder, 17-18wt% graphite powder and 44-45wt% N - Methylpyrrolidone.

Preferably, the graphite powder is 200-250 mesh graphite powder or 250-300 mesh graphite powder.

In order to solve the above technical problems, the application also provides a method for preparing an atomized substrate, comprising the following steps:

S10, preparing slurry: mixing 2-9wt% binder, 1-4wt% dispersant, 20-30wt% ceramic powder, 15-26wt% pore-forming agent and 41-47wt% organic solvent Obtain the slurry after ball milling for more than 5 hours;

S20, tape casting: tape casting the slurry on the one carrier plate;

S30. Phase inversion: Put the carrier board and the tape-cast slurry on it into the water together, and the slurry solidifies instantly after entering the water and forms the dense layer on the surface where the slurry contacts with water; the carrier board and the slurry on it The slurry is soaked in water for not less than 12 hours, during which the organic solvent is replaced by water to form several gaps and obtain a green body;

S40. Sintering molding: put the cured green body into a special sintering furnace, first keep it warm at a temperature of 550-700°C for 3-6 hours, and then heat it up to 1300-1550°C for 2.5-5 hours to obtain a fog During the sintering process, the pore-forming agent is incinerated and removed to form a porous atomized substrate with a loose layer and a dense layer.

Preferably, the slurry includes 2.9-3.1wt% polyethersulfone, 1.4-1.6wt% polyvinylpyrrolidone, 25-26wt% ceramic powder, 23-24wt% graphite powder and 45-47wt% N-methylpyrrolidone, the graphite powder is 200-250 mesh or 250-300 mesh graphite powder.

Preferably, the pore size of the pore structure in the loose layer of the atomized base material is between 40-59um, the pore size of the pore structure in the dense layer is between 12-36um, and the thickness of the atomized base material is 1 -3mm, the thickness of the dense layer is 0.02-0.3um, and the porosity of the atomized substrate is 60-65%.

Preferably, the slurry includes 7-8wt% polyethersulfone, 1.5-1.8wt% polyvinylpyrrolidone, 28-29wt% ceramic powder, 17-18wt% graphite powder and 44-45wt% N -Methylpyrrolidone, the graphite powder is 200-250 mesh or 250-300 mesh graphite powder.

Preferably, the pore size of the pore structure in the loose layer of the atomized base material is between 40-59um, the pore size of the pore structure in the dense layer is between 12-36um, and the thickness of the atomized base material is 1 -3mm, the thickness of the dense layer is 0.02-0.3um, and the porosity of the atomized substrate is 53-57%.

Preferably, the surface of the loose layer of the atomized substrate is a liquid-permeable surface, the surface of the dense layer is an atomized surface, and the surface of the loose layer is attached to the carrier plate at the moment of phase transformation into water and will not be in contact with water. resulting in a dense layer.

Preferably, during the sintering process in step S40, the organic solvent is replaced by water to form a gap that shrinks and interacts with the space after the pore-forming agent is burned to form a pore structure in the atomized substrate.

Preferably, in step S20, the casting speed is 10-45 cm/min, the molding thickness is 2 mm, and the carrier plate is a glass plate.

In this application, through the slurry formulation and the concept of phase inversion casting in the manufacturing method, only one casting molding is required to produce an atomized substrate with a dense layer and a loose layer. Compared with the prior art, it is greatly improved The manufacturing process is simplified, the cost is reduced, and the controllability of the process is improved.

Description of drawings

The drawings described here are used to provide a further understanding of the application and constitute a part of the application. The schematic embodiments and descriptions of the application are used to explain the application and do not constitute an improper limitation to the application. In the attached picture:

Fig. 1 is a layered schematic diagram of the atomized substrate of the present application;

Fig. 2 is the scanning electron microscope figure of the section of atomized substrate of the present application;

Fig. 3 is the effect diagram of the light transmission experiment on the first side of the atomized substrate of the present application;

Fig. 4 is the effect diagram of the light transmission experiment on the second side of the atomized substrate of the present application;

Fig. 5 is the scanning electron micrograph of the dense layer surface of the atomized substrate of the present application;

Fig. 6 is the scanning electron micrograph of the loose layer surface of the atomized substrate of the present application;

Fig. 7 is an enlarged cross-sectional view of the green body of the atomized base material of the present application.

Detailed ways

In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments.

Please refer to FIG. 1 , which is a schematic cross-sectional view of the atomized substrate of the present application. The atomized substrate of the present application includes a loose layer 11 , a dense layer 12 and a transition layer 13 between the loose layer 11 and the dense layer 12 . The outer surface of the loose layer 11 is used as a liquid-permeable surface, and the outer surface of the dense layer 12 is used as an atomizing surface. There are several directly or indirectly connected pore structures inside the atomizing substrate, and the atomized liquid can penetrate downward from the liquid-seeping surface through the pore structures to the side of the atomizing surface. The thickness of the atomized base material is 1-4mm, the thickness of the dense layer 12 is 0.02-0.3um, the thickness of the transition layer 13 cannot be accurately defined, and the thickness of the dense layer 12 is different from that of the atomized base material. There is no direct relationship between the overall thickness of the material, that is, the thickness of the dense layer 12 will not change with the thickness of the atomized substrate. The pore diameter of the loose layer 11 is between 30-120um, the pore diameter of the dense layer 12 is between 10-45um, and the pore diameter of the transition layer 13 is between 10-80um; it should be noted that, The pore diameter in the atomized substrate is irregular. The pore size of the same pore structure is different at different positions. The pore extension direction has a straight up and down or a zigzag extension state. The zigzag extension means that the same pore structure has both vertical extension and horizontal extension. Extended situations exist. The overall porosity of the atomized substrate of the present application is between 44% and 74%. The porosity of the loose layer 11 is greater than that of the dense layer 12 .

Further preferably, the pore diameter of the loose layer 11 is between 40-80um, and the pore diameter of the dense layer 12 is between 12-36um. The size of the pore size needs to meet the penetration of the atomized liquid and ensure that the section will not leak easily after being wrapped. The size of the pore size is related to the formula of the atomized substrate and the relevant parameters of the manufacturing process. The details will be explained in detail later in this article.

Further preferably, the pore diameter of the loose layer 11 is between 40-50um, and the pore diameter of the dense layer 12 is between 12-32um.

In this application, the atomizing base material is generally provided with a heating element 14 on the surface of the dense layer 12, and the heating element 14 heats up the atomizing liquid in the atomizing base material to be heated and atomized to generate aerosol. The heating element 14 can be fixed on the surface of the dense layer 12 by silk screen printing, or it can be bought into the atomized substrate and manufactured.

Fig. 2 is a 30 times magnified electron micrograph of the cross-section of the atomized substrate of the present application. It can be seen that the dense layer 12 on the lower side of the cross-section, the loose layer 11 and the transition layer 13 on the upper side. However, the dividing line of each layer is not precisely distinguished.

Fig. 3, Fig. 4 are the light transmission experiments of the atomized base material of the present application, and Fig. 3 is that the dense layer 12 of the atomized base material is directly facing the light, and observes the effect figure seen on the side of the loose layer 11; Fig. 4 is the atomized base material The loose layer 11 of the material is facing the light, and the effect diagram seen on the side of the dense layer 12 is observed. From the above two renderings, it can be clearly distinguished that the light spots shown in Figure 3 present several light spots, that is, the light penetrates through the hole structure on one side of the loose layer 11 and forms several light spots, while the light spots in Figure 4 appear blurred The uniformity of light, that is, there is no obvious light spot when the light passes through the dense layer 12, that is, the dense layer 12 has no holes or the holes are too thin, and there will be no obvious difference after the light passes through. The experimental environments of the light transmission experiments shown in Fig. 3 and Fig. 4 are all the same. The strong light source can be a certain distance away from the atomized substrate, and it is preferable to attach the strong light source directly to the surface of the atomized substrate.

Figure 5 and Figure 6 are electron microscope scanning images of the surface of the dense layer 12 and the loose layer 11 of the atomized substrate of the present application respectively, the dense layer 12 is magnified 600 times, and the rendering effect diagram of the loose layer 11 is magnified 400 times. Most of the pore structure roughly conforms to the range described above, because the manufacturing process determines that all pore sizes cannot be guaranteed to be within the predetermined range, and there are very few small differences.

When the atomization base material of this application is applied to atomization products, such as when Patent No. 202110430799.8 of the People's Republic of China is applied to the field of electronic cigarettes, the pore structure in the loose layer of the atomization base material has a larger pore size, which is beneficial to the atomization liquid. Penetrate downward from the loose layer 11 to the interior of the atomized substrate; while the pore structure in the dense layer has a smaller pore size, which can prevent the atomized liquid from penetrating downwards, thereby avoiding oil leakage. However, the pore size of the loose layer will not cause the atomized liquid to leak from the section after the section is wrapped with the sealing silica gel.

The manufacture method of the atomized base material of the present application comprises the steps:

S10, prepare slurry;

In this step, the slurry includes the following components by mass: 2-9wt% binder, 1-4wt% dispersant, 20-30wt% ceramic powder, 15-26wt% pore-forming agent And 41-47wt% organic solvent.

Component Example 1. Preferably, the mass components of the slurry include the following components: 2-4wt% binder, 1-3wt% dispersant, 23-26wt% ceramic powder, 20-25wt% % pore-forming agent and 43-47wt% organic solvent; further preferably, the slurry includes 3wt% binder, 1.5wt% dispersant, 25.7wt% ceramic powder, 23.5wt% pore-forming agent and 46.3wt% organic solvent. The porosity of the atomized substrate manufactured by this embodiment is greater than 60%, preferably 60-65%.

Component Example 2. Preferably, the slurry includes 6-9wt% of binder, 1-2wt% of dispersant, 27-29wt% of ceramic powder, 15-19wt% of pore-forming agent and 43 -45wt% organic solvent; more preferably, the slurry includes 7.5wt% binder, 1.7wt% dispersant, 28.7wt% ceramic powder, 17.3wt% pore-forming agent and 44.8wt% Organic solvents. The porosity of the atomized substrate manufactured by this embodiment is less than 60%, preferably 53-57%.

Wherein the ceramic powder includes one or more of alumina, silicon oxide, titanium oxide, kaolin, calcium carbonate, silicon carbide, talc, feldspar, cordierite, diatomaceous earth; the organic solvent is pure NMP (N-methylpyrrolidone) or NMP containing a small amount of non-solvent water (1-10vt%); the dispersant is one of PVP (polyvinylpyrrolidone), DSP (disodium hydrogen phosphate), TEOA (triethanolamine) or several; the pore-forming agent includes one or more of starch, graphite, wood chips, sucrose; the binder is PESF (polyphenylene ether sulfone), PES (polyether sulfone), PVB (polyethylene Alcohol butyral), PMMA (polymethyl methacrylate) or one or more.

In this step, the binder, ceramic powder, pore forming agent, dispersant and organic solvent are mixed according to a predetermined ratio, and then ball milled to obtain the slurry. The ball milling time is longer than 5 hours. The binder can be added before or after ball milling.

S20, tape casting;

In this step, the prepared slurry is tape-casted on the first carrier plate, the casting speed is 10-45 cm/min, and the molding thickness is preferably 1-3 mm. The carrier plate is a glass plate or other smooth-surfaced plates.

S30, phase inversion;

The slurry casted on the carrier plate enters the water together with the carrier plate, and the slurry solidifies instantly after entering the water and forms the dense layer 12 on the surface of the slurry in contact with the water. The dense layer 12 can be It is understood as a layer of film coating; the slurry is soaked in water for not less than 12 hours. During the soaking process, the organic solvent is replaced by water to obtain a green body, and several gaps are formed in the cured slurry ( The cross-sectional view of the real object is shown in Figure 7). A dense layer will not be formed on the surface of the green embryo contacting the side of the carrier plate.

S40, slice demoulding;

In this step, the obtained green body is cut according to the set size, and the green body of the specified size is obtained after being demoulded by the demoulding table. This step is not necessary.

S50, sintering molding;

Put the cured ceramic green body into a special sintering furnace, first keep it warm at a temperature of 550-700°C for 3-6 hours, and then heat it up to 1300-1550°C for 2.5-5 hours of high-temperature sintering to obtain the atomization of this application Substrate. During the sintering process, the pore-forming agent is incinerated and removed, the gap shrinks, and the aforementioned porous body structure is finally formed. The pore size in the dense layer 12 (ie the film coat) will be smaller than the pore size in the loose layer 11 .

The atomized base material, the method for manufacturing the atomized base material, and the atomized device of the present application can respectively form a dense layer 12 and a loose layer 11 on both vertical sides of the atomized base material through one tape casting molding. Using different formulations for multiple casting to prepare atomized substrates with different pore sizes, the process of this application is simpler and more practical, the manufacturing cycle is shorter, the manufacturing cost is lower, and the product process is more controllable.

The present invention will be described in further detail below through specific examples.

Example 1

Utilize this embodiment to prepare the atomized substrate;

S1. Preparation of slurry: mix 6-9wt% polyethersulfone, 1-2wt% polyvinylpyrrolidone, 27-29wt% ceramic powder, 15-19wt% graphite powder and 43-45wt% N-formaldehyde After the base pyrrolidone is mixed, the slurry is prepared by ball milling (the preferred components are 7.5wt% polyethersulfone, 1.7wt% polyvinylpyrrolidone, 28.7wt% ceramic powder, 17.3wt% graphite powder and 44.8wt% N -Methylpyrrolidone is mixed and ball milled to prepare slurry.

S2. Tape-casting: The slurry is tape-casted on a glass plate at a casting speed of 15 cm/min and a molding thickness of 2 mm.

S3. Phase inversion: the slurry formed by tape casting on the carrier plate is watered and solidified together with the carrier plate to form a green body.

S4. Sintering molding: Put the cured green body into a special sintering furnace, first keep it warm at 550°C for 3 hours, then raise the temperature to 1300-1550°C for 2.5 hours, and finally form it to obtain the atomization of this application Substrate.

The porosity of the atomized base material manufactured in Example 1 is less than 60%, preferably 53-57%. In this embodiment 1, the electron microscope scanning data of the atomized substrate obtained under different sizes of graphite powder and different sintering temperatures are shown in the following table:

Table 1

In this example 1, the atomization test was carried out based on the obtained atomization substrate, and the 200-250 mesh graphite sub-plan and the 250-300 mesh graphite powder plan were extracted. The test data results are shown in Table 2 below, where TPM represents each mouthful The specific gravity of the amount of smoke.

Table 2

From the test results, the test effect of using 250-300 mesh graphite powder is better, which is the preferred solution. In addition to dry burning related to the heating element 14, there are very few problems with TPM and the number of ports, which can be solved as the process continues to mature and be controlled.

Example 2

Utilize this embodiment to prepare the atomized substrate;

S1. Preparation of slurry: mix 2-4wt% polyethersulfone, 1-3wt% polyvinylpyrrolidone, 23-26wt% ceramic powder, 20-25wt% graphite powder and 43-47wt% N-formaldehyde The base pyrrolidone is mixed and prepared by ball milling to obtain a slurry (the preferred components are 3wt% polyethersulfone, 1.5wt% polyvinylpyrrolidone, 25.7wt% ceramic powder, 23.5wt% graphite powder and 46.3wt% N- The slurry is prepared by ball milling after mixing the methylpyrrolidones. The graphite powder is selected from 100-150 mesh graphite powder.

The atomized base material manufactured by this embodiment is analyzed by scanning electron microscopy. Under the same environment, that is, under the same pore-forming agent and sintering temperature, the pore diameter of the loose layer 11 is basically the same as that of the dense layer 12, but the porosity is less than 60%. The components of the embodiment are formulas for reducing porosity, and reducing the porosity can better improve the strength and hardness of the atomized substrate. The porosity is preferably 53-57%.

The present application also includes an atomizing device, the atomizing base material is applied in the atomizing device, and the atomizing device includes a power supply system connected to the heating element 14, a liquid storage chamber and a closed The atomized base material of the liquid storage chamber. The dense layer of the atomized base material 12 is provided with the heating element 14, and the atomized liquid in the liquid storage chamber penetrates into the described atomized base material from the surface of the loose layer, and the dense layer 12 will prevent the mist The atomizing liquid continues to permeate downward, and the heating element 14 generates heat to heat the atomizing substrate and atomize the atomizing liquid in the atomizing substrate to generate an aerosol.

The atomized base material and the manufacturing method of the present application can manufacture the atomized base material with the dense layer 12 and the loose layer 11 through one-time tape casting. Compared with the prior art, the manufacturing process is greatly simplified, the cost is reduced, and the process controllability.

The technical features of the above embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be It is considered to be within the range described in this specification.

The above examples only express the preferred implementation of the utility model, and the description thereof is more specific and detailed, but it should not be interpreted as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims

An atomized substrate, characterized in that it includes a loose layer and a dense layer, the surface of the loose layer is a liquid seepage surface, the surface of the dense layer is an atomized surface, and a number of holes are formed inside the loose layer and the dense layer structure, the aperture of the pore structure in the loose layer is greater than the aperture of the pore structure in the dense layer, the thickness of the loose layer is greater than the thickness of the dense layer, and the atomized liquid penetrates into the Atomize the inside of the substrate.
Atomized substrate as claimed in claim 1, characterized in that, the aperture of the pore structure in the loose layer is between 30-120um, and the aperture of the pore structure in the dense layer is between 10-45um between.
The atomized substrate according to claim 2, wherein the aperture of the pore structure in the loose layer is between 30-80um, and the aperture of the pore structure in the dense layer is between 10-30um between.
The atomized substrate according to claim 3, wherein the aperture of the pore structure in the loose layer is between 40-50um, and the aperture of the pore structure in the dense layer is between 12-30um between.
Atomized base material as claimed in claim 4, it is characterized in that, described atomized base material also comprises the transition layer between described loose layer and dense layer, and the aperture of the pore structure in described transition layer is between Between 10-80um.
The atomized substrate according to claim 1, characterized in that, the thickness of the atomized substrate is 1-3mm, the porosity is 44%-74%, and the thickness of the dense layer is between 0.02-0.3um .
The atomized substrate according to claim 6, characterized in that the porosity of the atomized substrate is 53%-60%.
The atomized substrate according to claim 6, characterized in that the porosity of the atomized substrate is 60%-65%.
The atomized substrate according to claim 6, wherein the thickness of the atomized substrate is 2 mm.
The atomized base material according to any one of claims 1-9, characterized in that the loose layer and the dense layer of the atomized base material are formed by one-time tape casting, replaced by water, and then sintered.
A slurry for producing an atomized substrate, characterized in that it includes the following components: 2-9wt% binder, 1-4wt% dispersant, 20-30wt% ceramic powder, 15-26wt% pore forming agent and 41-47wt% organic solvent.
The slurry for manufacturing atomized base material as claimed in claim 11, is characterized in that, described organic solvent is pure NMP (N-methylpyrrolidone) or the NMP that contains a small amount of non-solvent water (1-10vt%); The dispersant is one or more of PVP (polyvinylpyrrolidone), DSP (disodium hydrogen phosphate), TEOA (triethanolamine); the pore-forming agent includes one or more of starch, graphite, wood chips, sucrose The binder is one or more of PESF (polyphenylene ether sulfone), PES (polyether sulfone), PVB (polyvinyl butyral), PMMA (polymethyl methacrylate).
The slurry for manufacturing atomized substrates according to claim 12, wherein the components of the slurry include 2-4wt% binder, 1-3wt% dispersant, 23-26wt% Ceramic powder, 20-25wt% pore forming agent and 43-47wt% organic solvent.
The slurry for manufacturing atomized substrates according to claim 13, wherein the slurry comprises 2.9-3.1wt% polyethersulfone, 1.4-1.6wt% polyvinylpyrrolidone, 25-26wt% Ceramic powder, 23-24wt% of graphite powder and 45-47wt% of N-methylpyrrolidone.
The slurry for manufacturing the atomized base material according to claim 12, wherein the slurry comprises 6-9wt% binder, 1-2wt% dispersant, 27-29wt% ceramic powder Body, 15-19wt% pore-forming agent and 43-45wt% organic solvent.
The slurry for manufacturing the atomized substrate according to claim 15, wherein the slurry comprises 7-8wt% polyethersulfone, 1.5-1.8wt% polyvinylpyrrolidone, 28-29wt% ceramic Powder, 17-18wt% of graphite powder and 44-45wt% of N-methylpyrrolidone.
The slurry for manufacturing the atomized substrate according to claim 14 or 16, wherein the graphite powder is 200-250 mesh graphite powder or 250-300 mesh graphite powder.
A method for preparing an atomized base material, comprising the steps of:

S10, preparing slurry: mixing 2-9wt% binder, 1-4wt% dispersant, 20-30wt% ceramic powder, 15-26wt% pore-forming agent and 41-47wt% organic solvent Obtain the slurry after ball milling for more than 5 hours;

S20, tape casting: tape casting the slurry on the one carrier plate;

S30. Phase inversion: Put the carrier board and the slurry cast on it into water together, and the slurry solidifies instantly after entering the water and forms a dense layer on the surface where the slurry contacts with water; the carrier board and the slurry on it Soaking in water for not less than 12 hours, during which, the organic solvent is replaced by water to form several gaps and obtain a green body;

S40. Sintering molding: put the cured green body into a special sintering furnace, first keep it warm at a temperature of 550-700°C for 3-6 hours, and then heat it up to 1300-1550°C for 2.5-5 hours to obtain a fog During the sintering process, the pore-forming agent is incinerated and removed to form a porous atomized substrate with a loose layer and a dense layer.
The manufacture method of atomized substrate as claimed in claim 18, is characterized in that, described organic solvent is pure NMP (N-methylpyrrolidone) or the NMP that contains a small amount of non-solvent water (1-10vt%); The dispersant is one or more of PVP (polyvinylpyrrolidone), DSP (disodium hydrogen phosphate), TEOA (triethanolamine); the pore-forming agent includes one or more of starch, graphite, wood chips, and sucrose ; The binder is one or more of PESF (polyphenylene ether sulfone), PES (polyether sulfone), PVB (polyvinyl butyral), PMMA (polymethyl methacrylate).
The manufacturing method of the atomized substrate according to claim 19, wherein the slurry comprises 2.9-3.1wt% polyethersulfone, 1.4-1.6wt% polyvinylpyrrolidone, 25-26wt% ceramic Powder, 23-24wt% graphite powder and 45-47wt% N-methylpyrrolidone, the graphite powder is 200-250 mesh or 250-300 mesh graphite powder.
The manufacture method of atomized base material as claimed in claim 20, is characterized in that, the aperture of the pore structure in the loose layer of described atomized base material is between 40-59um, the aperture of the pore structure in the described dense layer Between 12-36um, the thickness of the atomized substrate is 1-3mm, the thickness of the dense layer is 0.02-0.3um, and the porosity of the atomized substrate is 60-65%.
The manufacturing method of the atomized substrate according to claim 19, wherein the slurry comprises 7-8wt% polyethersulfone, 1.5-1.8wt% polyvinylpyrrolidone, 28-29wt% ceramic powder Body, 17-18wt% graphite powder and 44-45wt% N-methylpyrrolidone, the graphite powder is 200-250 mesh or 250-300 mesh graphite powder.
The manufacture method of atomized base material as claimed in claim 22, is characterized in that, the aperture of the pore structure in the loose layer of described atomized base material is between 40-59um, the aperture of the pore structure in the described dense layer Between 12-36um, the thickness of the atomized substrate is 1-3mm, the thickness of the dense layer is 0.02-0.3um, and the porosity of the atomized substrate is 53-57%.
The method for producing an atomized substrate according to claim 21 or 23, wherein the surface of the loose layer of the atomized substrate is a liquid-permeable surface, the surface of the dense layer is an atomized surface, and the porous The surface of the layer adheres to the carrier plate at the moment of phase transformation into water and is not in contact with water.
The method for manufacturing an atomized base material as claimed in claim 18, 21 or 23, characterized in that, during the sintering process in step S40, the organic solvent is replaced by water to form gaps that shrink and burn off with the pore-forming agent The steric interaction forms the pore structure in the atomized substrate.
The manufacturing method of the atomized substrate according to claim 18, characterized in that, in step S20, the casting speed is 10-45 cm/min, the molding thickness is 2 mm, and the carrier plate is a glass plate.