WO2023010667A1 - 可提升耳机输出性能的电子装置 - Google Patents

可提升耳机输出性能的电子装置 Download PDF

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Publication number
WO2023010667A1
WO2023010667A1 PCT/CN2021/119958 CN2021119958W WO2023010667A1 WO 2023010667 A1 WO2023010667 A1 WO 2023010667A1 CN 2021119958 W CN2021119958 W CN 2021119958W WO 2023010667 A1 WO2023010667 A1 WO 2023010667A1
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Prior art keywords
pin
earphone
microphone
chip
ground
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Ceased
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PCT/CN2021/119958
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English (en)
French (fr)
Inventor
周丽媛
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Spreadtrum Communications Shanghai Co Ltd
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Spreadtrum Communications Shanghai Co Ltd
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Application filed by Spreadtrum Communications Shanghai Co Ltd filed Critical Spreadtrum Communications Shanghai Co Ltd
Publication of WO2023010667A1 publication Critical patent/WO2023010667A1/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers
    • H04R3/02—Circuits for transducers for preventing acoustic reaction, i.e. acoustic oscillatory feedback
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083

Definitions

  • the present application relates to the field of audio technology, in particular to an electronic device capable of improving the output performance of earphones.
  • the purpose of the present application is to provide an electronic device capable of improving the output performance of earphones, which can eliminate electrical echo through hardware and effectively improve the output performance of earphones.
  • an electronic device capable of improving the output performance of earphones
  • the electronic device includes a codec chip and an earphone socket.
  • the codec chip includes chip ground pins; the earphone socket includes earphone socket ground pins, and the earphone socket ground pins are grounded, wherein the chip ground pins of the codec chip are connected to the earphone socket ground pins. The pin is connected, and the ground pin is grounded through the earphone socket.
  • the ground pin of the chip is not directly grounded at the chip end, but is connected to the ground pin of the earphone base, and then through the ground pin of the earphone base. Grounding can reduce the ground terminal resistance between the ground point of the chip ground pin and the ground point of the earphone socket ground pin to a very small value.
  • the ground terminal resistance is the main cause of electrical echo, and the greater the ground terminal resistance, the greater the electrical echo, therefore, in this application, after connecting the ground pin of the chip with the ground pin of the earphone socket , and then through the ground pin of the earphone base, the ground resistance between the ground point of the chip ground pin and the ground point of the earphone base pin can be reduced to a very small level, and the electrical echo can be reduced to a very small level. It is small, and even eliminates the electrical echo, effectively improving the headphone output performance.
  • FIG. 1 is an internal block diagram illustrating a partial structure of an electronic device in an embodiment of the present application.
  • FIG. 2 is a schematic diagram of an electronic device connected to an earphone through an earphone socket according to an embodiment of the present application.
  • FIG. 3 is a specific circuit diagram illustrating a partial structure of an electronic device in an embodiment of the present application.
  • Fig. 4 is a schematic diagram of the waveform of the electrical echo signal of the present application relative to the existing solution.
  • connection includes connection relationships such as “direct connection”, “indirect connection”, “electrical connection” and “structural connection”, and the “electrical connection” includes Electrical connection relationships such as “direct electrical connection” and “indirect electrical connection” are defined.
  • the electronic device capable of improving the output performance of earphones in this application can eliminate electrical echo through hardware and effectively improve the output performance of earphones.
  • FIG. 1 is an internal block diagram illustrating a partial structure of an electronic device 100 in an embodiment of the present application.
  • the electronic device 100 includes a codec chip 1 and an earphone socket 2, the codec chip 1 includes a chip ground pin GND1, the earphone socket includes an earphone socket ground pin GND2, and the earphone socket The ground pin GND2 is grounded, wherein the chip ground pin GND1 of the codec chip 1 is connected to the ground pin GND2 of the earphone base, and is grounded through the ground pin GND2 of the earphone base.
  • the ground pin GND1 of the chip is not directly grounded at the chip end, but after being connected to the ground pin GND2 of the earphone base, and then grounded through the ground pin GND2 of the earphone base, the The ground terminal resistance between the ground point of the chip ground pin GND1 and the ground point of the earphone socket ground pin GND2 is reduced to very small.
  • ground terminal resistance is the main cause of electrical echo, and the greater the ground terminal resistance, the greater the electrical echo, therefore, in this application, by connecting the ground pin GND1 of the chip with the ground pin GND2 of the earphone holder After the connection, grounding through the ground pin GND2 of the earphone socket can reduce the ground terminal resistance between the ground point of the chip ground pin GND1 and the ground point of the ground pin GND2 of the earphone socket to a very small value, and the The electrical echo is reduced to a very small level, or even eliminated, effectively improving the headphone output performance.
  • the chip ground pin GND1 of the codec chip 1 is directly electrically connected to the earphone socket ground pin GND2 through an electrical connector J1.
  • the electrical connector J1 includes at least one of a wire with good electrical conductivity, a flexible circuit board, and a circuit board trace.
  • the resistance of the electrical connector J1 is very small, therefore, the chip ground pin GND1 of the codec chip 1 and the earphone socket ground pin GND2 can be regarded as short-circuited. Therefore, in this application, after the ground pin GND1 of the chip is connected to the ground pin GND2 of the earphone socket, and then grounded through the ground pin GND2 of the earphone socket, the ground pin GND1 of the chip is connected to the ground pin GND2 of the earphone socket.
  • the ground pin GND2 can be considered to be grounded at almost the same ground point, therefore, the ground terminal resistance between the ground point of the chip ground pin GND1 and the ground point of the earphone socket ground pin GND2 is reduced to a small value, This reduces the electrical echo to a very small level, and even eliminates the electrical echo.
  • the codec chip 1 also includes a chip channel pin 11 and a chip microphone pin 12
  • the earphone holder 2 also includes an earphone holder channel pin 21 and an earphone holder microphone pin 22, so
  • the chip audio channel pin 11 and the chip microphone pin 12 are electrically connected to the earphone socket audio channel pin 21 and the earphone socket microphone pin 22 respectively.
  • FIG. 2 is a schematic diagram of connecting the electronic device 100 to the earphone 200 through the earphone socket 2 .
  • the earphone 200 includes an earphone channel pin 210 , an earphone microphone pin 220 and an earphone ground pin GND3 .
  • the earphone base channel pin 21 when the earphone base 2 is connected with the earphone 200, the earphone base channel pin 21, the earphone base microphone pin 22 and the earphone base ground pin GND2 are respectively connected to the earphone channel pin 210 of the earphone 200, the earphone The microphone pin 220 and the earphone ground pin GND3 are connected.
  • the earphone base channel pin 21 and the earphone base microphone pin 22 are electrically connected to the earphone ground pin GND3 through the earphone channel pin 210, the earphone microphone pin 220 and the internal functional modules of the earphone 200, and
  • the ground pin GND3 of the earphone is electrically connected to the ground pin GND2 of the earphone base, and both are grounded through the ground pin GND2 of the earphone base, forming a channel current loop L1 and a microphone current loop L2 respectively.
  • the resistance value of the common segment line D1 connected to the ground of the channel current loop L1 and the microphone current loop L2 is mainly determined by the ground point of the chip ground pin GND1 and the ground point of the earphone socket ground pin GND2 Due to the low resistance of the ground terminal, the current of the channel current loop L1 will directly pass through the common segment line D1 to ground, and will not flow into the microphone current loop L2, therefore, it will not Form the electrical echo of the earphone.
  • the earphone channel pin 210, the earphone microphone pin 220, and the earphone ground pin GND3 are located on the earphone plug of the earphone 200, and the internal functional modules may be located at the earplug part and/or the earphone of the earphone 200. in line.
  • the internal functional modules of the earphone 200 may include a channel module 201 and a microphone module 202, the first end of the channel module 201 is connected to the earphone channel pin 210 of the earphone 200, the first end of the microphone module 202 The end is connected to the earphone microphone pin 220 of the earphone 200, the second end of the channel module 201 is connected to the second end of the microphone module 202, and then connected to the earphone ground pin GND3, and They are electrically connected through the ground pin GND2 of the earphone base, and are grounded through the ground pin GND2 of the earphone base.
  • the line from the connection point between the second end of the channel module 201 and the second end of the microphone module 202 to the ground is the aforementioned common segment line D1.
  • the resistance value of the common segment line D1 connected to the ground of the channel current loop L1 and the microphone current loop L2 is mainly determined by the ground point of the chip ground pin GND1 and the ground pin of the earphone socket.
  • the ground resistance between the ground points of GND2 is determined by the ground resistance. Since the ground resistance is very low, the current of the channel current loop L1 will be grounded directly through the common segment line D1 instead of flowing into the microphone current loop L2. It will not be detected by the microphone module 202, so no electrical echo will be generated.
  • the ground terminal resistance is Rgnd
  • the connection point between the second end of the sound channel module 201 and the second end of the microphone module 202 is connected to the ground pin GND2 of the earphone base
  • the resistance value of the electrical connector is very low. Therefore, in fact, the resistance value of the common segment line D1 connected to the ground of the channel current loop L1 and the microphone current loop L2 is mainly determined by the ground terminal resistance Rgnd.
  • the ground terminal resistance Rgnd is also reduced to a very small value, therefore, the current of the channel current loop L1 will be directly grounded through the common segment line D1, and will not flow to the microphone current loop In L2, it will not be detected by the microphone module 202 and no electrical echo will be generated.
  • the channel module refers to a module capable of implementing functions such as channel audio processing and output
  • the microphone module 202 refers to a module capable of implementing functions such as microphone voice input and processing.
  • said chip audio channel pin 11 includes chip left audio channel pin 111 and chip right channel pin 112
  • said earphone socket channel pin 21 includes earphone socket left audio channel pin 112.
  • channel pin 211 and the right channel pin 212 of the earphone base, the left channel pin 111 of the chip and the right channel pin 112 of the chip are respectively connected with the left channel pin 211 of the earphone base and the right channel pin 212 of the earphone base Connection;
  • the chip microphone pin 12 includes a microphone power supply pin 121, a microphone positive pin 122 and a microphone negative pin 123
  • the electronic device 100 also includes a differential filter circuit 3, the microphone power supply pin 121, the microphone positive pin Both the pin 122 and the negative microphone pin 123 are connected to the microphone pin 22 of the earphone socket through the differential filter circuit 3 .
  • the earphone channel pin 210 also further includes an earphone left channel pin 2101 and an earphone right channel pin 2102.
  • the seat right channel pin 212 is connected to the earphone left channel pin 2101 and the earphone right channel pin 2102 respectively.
  • the channel module 201 may specifically include a left channel module 2011 and a right channel module 2012, specifically, the first end of the left channel module 2011 is connected to the earphone of the earphone 200
  • the left channel pin 2101 , the first end of the right channel module 2012 is connected to the earphone right channel pin 2102 of the earphone 200 .
  • the first end of the microphone module 202 is connected to the earphone microphone pin 220 of the earphone 200 .
  • the second end of the left channel module 2011, the second end of the right channel module 2012 and the second end of the microphone module 202 are connected together, and then connected to the ground pin GND3 of the earphone, and passed through the earphone
  • the ground pin GND2 of the earphone base is electrically connected, and they are all grounded through the ground pin GND2 of the earphone base.
  • the aforementioned channel current loop L1 includes a left channel current loop and a right channel current loop. Because the resistance of the ground terminal is very low, the currents of the left channel current loop and the right channel current loop will be grounded directly through the common segment line D1, and will not flow into the microphone current loop L2, and will not be absorbed by the microphone module. 202 detected, so there is no electrical echo.
  • the microphone pin 22 of the earphone base is also connected to the earphone microphone pin 220 of the earphone 200 .
  • the microphone signal input by the microphone of the earphone 200 is input to the earphone base microphone pin 22 through the earphone microphone pin 220, and the differential filter circuit 3 is used to convert the microphone signal received by the earphone base microphone pin 22 into a positive signal including a microphone and the differential signal of the microphone negative signal, and are respectively transmitted to the microphone positive pin 122 and the microphone negative pin 123 of the codec chip 21 .
  • the microphone power supply pin 121 is used to provide an operating voltage for powering the microphone module 202 of the earphone 200
  • the differential filter circuit 3 is also used to pass the operating voltage provided by the microphone power supply pin 121 through the
  • the earphone base microphone pin 22 and the earphone microphone pin 220 are provided to the microphone module 202 of the earphone 200 , so that the microphone module 202 of the earphone 200 can be powered on and work. This will be described in further detail below.
  • FIG. 3 is a specific circuit diagram illustrating a partial structure of the electronic device 100 .
  • the differential filter circuit 3 includes a first RC filter circuit 31 , a second RC filter circuit 32 , a first resistor R1 and a second resistor R2 .
  • the first resistor R1 and the second resistor R2 are connected in series between the microphone power supply pin 121 and the microphone pin 22 of the headphone socket, and the first RC filter circuit 31 is connected to the first resistor R1 and the second resistor R2 is connected between node N1 and the positive pin 122 of the microphone.
  • the second RC filter circuit 32 is connected between the negative pin 123 of the microphone and the microphone pin 22 of the earphone socket, that is, the distance between the negative pin 123 of the microphone and the second resistor R2 is connected.
  • the first RC filter circuit 31, the second RC filter circuit 32 and the second resistor R2 form a false differential and DC filter circuit, since the microphone power supply pin 121 provides the microphone module 202 for the earphone 200
  • the operating voltage of the power supply is a DC signal
  • the microphone signal is an AC signal. Therefore, the cooperation between the first RC filter circuit 31 and the second RC filter circuit 32 and the second resistor R2 can prevent the microphone power supply pin 121 from working
  • the voltage is passed back to the microphone positive pin 122 and the microphone negative pin 123, and only the microphone signal received by the microphone pin 22 of the earphone socket is converted into a differential signal including the microphone positive signal and the microphone negative signal, and transmitted to the microphone pin 123 respectively.
  • the microphone positive pin 122 and the microphone negative pin 123 of the codec chip 21 are described above.
  • the operating voltage provided by the microphone power supply pin 121 can be transmitted to the earphone stand microphone pin 22 through the first resistor R1 and the second resistor R2 connected in series, and through the earphone stand microphone pin 22 and the
  • the earphone microphone pin 220 is provided to the microphone module 202 of the earphone 200 so that the microphone module 202 of the earphone 200 can be powered on to work.
  • the microphone power supply pin 121, the microphone positive pin 122 and the microphone negative pin 123 are all connected to the earphone stand microphone pin 22, and the earphone stand microphone
  • the pin 22 simultaneously implements power supply to the microphone module 202 of the earphone 200 and receives a microphone signal input by the earphone 200 .
  • the first RC filter circuit 31 includes a third resistor R1 and a first capacitor C1 connected in series
  • the second RC filter circuit 32 includes a third capacitor C1 connected in series.
  • At least one of the first RC filter circuit 31 and the second RC filter circuit 32 may also be a parallel RC filter circuit composed of parallel resistors and capacitors.
  • the first RC filter circuit 31 may be a series RC filter circuit
  • the second RC filter circuit 32 may be a parallel RC filter circuit.
  • the resistance value of the second resistor is greater than the resistance value of the first resistor, and the resistance values of the first resistor, the third resistor and the fourth resistor are the same.
  • the resistance value of the second resistor may be N times of the resistance values of the first resistor, the third resistor and the fourth resistor, and the N is a positive integer greater than 1.
  • the resistance value of the first resistor, the third resistor and the fourth resistor may be 1K (kilo) ohms, and the resistance value of the second resistor may be 2K ohms.
  • the RC filter circuit 3 further includes a third capacitor C3, the third capacitor C3 is connected to the connection node N1 of the first resistor R1 and the second resistor R2 and ground Between them, it is used to filter out the AC signal, so that the microphone signal received by the microphone pin 22 of the headphone socket can be filtered out, further preventing the microphone signal from interfering with the microphone power pin 121 .
  • the capacitance values of the first capacitor C1 and the second capacitor C2 may be 01 ⁇ F (microfarads), and the capacitance value of the third capacitor C3 may be 1 ⁇ F.
  • the RC filter circuit 3 further includes a fourth capacitor C4 and a fifth capacitor C5, and the fourth capacitor C4 is connected to the first RC filter circuit 31 and the first RC filter circuit 31. Between one terminal connected to the connection node N1 of the first resistor R1 and the second resistor R2 and the ground, that is, the fourth capacitor C4 is connected between the connection node N1 of the first resistor R1 and the second resistor R2 and the ground.
  • the fifth capacitor C5 is connected between an end of the second resistor R2 away from the first resistor R1 and ground.
  • the fourth capacitor C4 and the fifth capacitor C5 are used to filter out the noise of the microphone signal.
  • the capacitance values of the fourth capacitor C4 and the fifth capacitor C5 may be 47pF (picofarad).
  • a fifth resistor R5 is also connected between the left channel pin 111 of the chip and the left channel pin 211 of the earphone socket, and the right channel pin 112 of the chip is connected to the left channel pin 211 of the earphone holder.
  • a sixth resistor R6 is also connected between the right channel pins 212 of the earphone base.
  • the fifth resistor R5 and the sixth resistor R6 are used to reduce the signal levels of the left channel audio signal and the right channel audio signal output by the left channel pin 111 of the chip and the right channel pin 112 of the chip. pressure. That is, the signal levels output from the chip left channel pin 111 and the chip right channel pin 112 of the codec chip 1 are relatively large, almost 8 or 9 hundred millivolts, and the level that normal earphones 200 can generally withstand to 400 mV or less.
  • the sixth resistor R6 connected between the pins 212 can divide a part of the voltage, so that the level of the audio signal output to the left channel pin 211 of the earphone base and the right channel pin 212 of the earphone base is reduced to a reasonable level. scope.
  • the codec chip 1 further includes an operational amplifier 13 , and the operational amplifier 13 is packaged inside the codec chip 1 .
  • the operational amplifier 13 includes a non-inverting input terminal Vin+, an inverting input terminal Vin-, a first output terminal Vo1, a second output terminal Vo2, a power supply terminal Vcc, and a ground terminal Vg.
  • the non-inverting input terminal Vin+ and the inverting input terminal Vin- of the operational amplifier 13 are respectively connected to the microphone positive pin 122 and the microphone negative pin 123 of the codec chip 1, and the operational amplifier 13 is used to connect the The microphone positive signal and the microphone negative signal respectively received by the microphone positive pin 122 and the microphone negative pin 123 of the codec chip 1 are amplified, and then output to the encoder through the first output terminal Vo1 and the second output terminal Vo2 respectively.
  • the follow-up circuit in decoding chip 1 realizes the voice input function of the microphone.
  • the power supply terminal Vcc is used to receive an operating voltage, so that the operational amplifier 13 can be powered on to work.
  • the ground terminal Vg is directly connected to the ground pin GND1 of the chip, and grounded through the ground pin GND2 of the earphone holder.
  • the aforementioned ground terminal resistance between the ground point of the chip ground pin GND1 and the ground point of the earphone socket ground pin GND2 refers more specifically to the ground terminal Vg of the operational amplifier 13 and the The resistance between the ground points of the ground pin GND2 of the earphone base.
  • the operational amplifier 13 is not directly grounded in the codec chip 1 , but is connected to the ground pin GND2 of the earphone base, and then grounded through the ground pin GND2 of the earphone base. Therefore, the ground terminal resistance can be effectively reduced, and electrical echo can be effectively suppressed or even eliminated.
  • FIG. 4 is a schematic waveform diagram of the electrical echo signal of the present application relative to the existing solution.
  • the upper part in Fig. 4, that is, the "L” part is the waveform of the electrical echo signal of the existing scheme
  • the lower half in Fig. 4, that is, the "R” part is the electrical echo signal after the application scheme waveform.
  • the amplitude of the electrical echo signal in the solution of the present application is obviously smaller than that of the waveform of the electrical echo signal in the existing solution, thus, the electrical echo is effectively suppressed by the solution of the present application.
  • the earphone holder 2 is a wired earphone holder, and specifically, it is a 3.5mm standard earphone holder, and specifically, it may be a 3.5mm earphone socket or the like.
  • the earphone socket 2 can also be an earphone socket of USB interface type.
  • the electronic device 100 can be an intelligent terminal such as a mobile phone, a tablet computer, a notebook computer, etc. that has an earphone holder/earphone interface.
  • FIG. 3 also schematically shows other electronic devices such as resistors and capacitors, which are not described again because they are irrelevant to the main improvement of the present invention.
  • the ground pin GND1 of the chip is not directly grounded at the chip end, but is grounded through the ground pin GND2 of the earphone base after being connected to the ground pin GND2 of the earphone base, which can The ground terminal resistance between the ground point of the chip ground pin GND1 and the ground point of the earphone socket ground pin GND2 is reduced to very small.
  • ground terminal resistance is the main cause of electrical echo, and the greater the ground terminal resistance, the greater the electrical echo, therefore, in this application, by connecting the ground pin GND1 of the chip with the ground pin GND2 of the earphone holder After the connection, grounding through the ground pin GND2 of the earphone socket can reduce the ground terminal resistance between the ground point of the chip ground pin GND1 and the ground point of the ground pin GND2 of the earphone socket to a very small value, and the The electrical echo is reduced to a very small level, or even eliminated, effectively improving the headphone output performance.

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  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Headphones And Earphones (AREA)

Abstract

本申请提供一种可提升耳机输出性能的电子装置，所述电子装置包括编解码芯片以及耳机座。所述编解码芯片包括芯片地引脚；所述耳机座包括耳机座地引脚，所述耳机座地引脚接地，其中，所述编解码芯片的芯片地引脚与所述耳机座地引脚连接，而通过所述耳机座地引脚接地。本申请中，通过将所述芯片地引脚与所述耳机座地引脚连接后，再通过所述耳机座地引脚接地，能够将芯片地引脚的接地点与所述耳机座地引脚的接地点之间的地端电阻降低到很小，而将电学回声降低到很小，甚至消除电学回声，有效提升了耳机输出性能。

Description

可提升耳机输出性能的电子装置 技术领域
本申请涉及音频技术领域，特别涉及一种可提升耳机输出性能的电子装置。
背景技术
目前，手机、平板电脑等电子装置应用越来越广泛，人们也经常使用电子装置进行音视频播放、音视频聊天，而为了不打扰他人，或者为了方便聊天，在进行视频播放、音视频聊天时，通过耳机进行音频输出，往往是一种常用的选择。因此，耳机也成为了目前的电子装置必不可少的配件。然而，现在的电子装置在连接耳机后，往往会或多或少产生一定的电学回声，对耳机音质造成了影响。目前的一种方式是通过回声算法处理等软件算法的方式滤除回声，然而，该回声算法处理不可避免的在一定程度上对语音质量有损伤，降低语音清晰度。
发明内容
本申请的目的在于提供一种可提升耳机输出性能的电子装置，能够通过硬件的方式消除电学回声，有效提升耳机输出性能。
为了解决上述技术问题，提供一种可提升耳机输出性能的电子装置，所述电子装置包括编解码芯片以及耳机座。所述编解码芯片包括芯片地引脚；所述耳机座包括耳机座地引脚，所述耳机座地引脚接地，其中，所述编解码芯片的芯片地引脚与所述耳机座地引脚连接，而通过所述耳机座地引脚接地。
本申请提供的可提升耳机输出性能的电子装置，所述芯片地引脚并不直接在芯片端接地，而是通过与所述耳机座地引脚连接后，再通过所述耳机座地引脚接地，能够将芯片地引脚的接地点与所述耳机座地引脚的接地点之间的地端电阻降低到很小。而由于该地端电阻是造成电学回声的主要原因，且地端电阻越大，电学回声越大，因此，本申请中，通过将所述芯片地引脚与所述耳机座地引脚连接后，再通过所述耳机座地引脚接地，能够将芯片地引脚的接地点与 所述耳机座地引脚的接地点之间的地端电阻降低到很小，而将电学回声降低到很小，甚至消除电学回声，有效提升了耳机输出性能。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请一实施例中的电子装置的示意出部分结构的内部框图。
图2为本申请一实施例中的电子装置通过耳机座与耳机连接的示意图。
图3为本申请一实施例中的电子装置的示意出部分结构的具体电路图。
图4为本申请相对于现有方案的电学回声信号的波形示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例的描述中，需要理解的是，术语“连接”包括了“直接连接”、“间接连接”、“电性连接”、“结构连接”等连接关系，所述“电连接”包括了“直接电连接”、“间接电连接”等电性连接关系。
本申请中的可提升耳机输出性能的电子装置，能够通过硬件的方式消除电学回声，有效提升耳机输出性能。
请参阅图1，为本申请一实施例中的电子装置100的示意出部分结构的内部框图。如图1所示，所述电子装置100包括编解码芯片1以及耳机座2，所述编解码芯片1包括芯片地引脚GND1，所述耳机座包括耳机座地引脚GND2，所述耳机座地引脚GND2接地，其中，所述编解码芯片1的芯片地引脚GND1与所述耳机座地引脚GND2连接，而通过所述耳机座地引脚GND2接地。
从而，本申请中，所述芯片地引脚GND1并不直接在芯片端接地，而是 通过与所述耳机座地引脚GND2连接后，再通过所述耳机座地引脚GND2接地，能够将芯片地引脚GND1的接地点与所述耳机座地引脚GND2的接地点之间的地端电阻降低到很小。而由于该地端电阻是造成电学回声的主要原因，且地端电阻越大，电学回声越大，因此，本申请中，通过将所述芯片地引脚GND1与所述耳机座地引脚GND2连接后，再通过所述耳机座地引脚GND2接地，能够将芯片地引脚GND1的接地点与所述耳机座地引脚GND2的接地点之间的地端电阻降低到很小，而将电学回声降低到很小，甚至消除电学回声，有效提升了耳机输出性能。
其中，所述编解码芯片1的芯片地引脚GND1通过电连接件J1与所述耳机座地引脚GND2直接电连接。
其中，所述电连接件J1包括导电性能良好的导线、柔性电路板、电路板走线中的至少一种。其中，所述电连接件J1的电阻很小，因此，所述编解码芯片1的芯片地引脚GND1与所述耳机座地引脚GND2可视为短接。从而，本申请中，通过所述芯片地引脚GND1与所述耳机座地引脚GND2连接后，再通过所述耳机座地引脚GND2接地，所述芯片地引脚GND1与所述耳机座地引脚GND2可以认为几乎是在同一接地点接地，因此，所述芯片地引脚GND1的接地点与所述耳机座地引脚GND2的接地点之间的地端电阻被降低到很小，而使得电学回声降低到很小，甚至消除电学回声。
如图1所示，所述编解码芯片1还包括芯片声道引脚11以及芯片麦克风引脚12，所述耳机座2还包括耳机座声道引脚21以及耳机座麦克风引脚22，所述芯片声道引脚11、芯片麦克风引脚12与所述耳机座声道引脚21、耳机座麦克风引脚22分别电连接。
请一并参阅图2，为电子装置100通过耳机座2与耳机200连接的示意图。如图2所示，所述耳机200包括耳机声道引脚210、耳机麦克风引脚220以及耳机地引脚GND3。其中，当耳机座2连接有耳机200时，所述耳机座声道引脚21、耳机座麦克风引脚22以及耳机座地引脚GND2分别与所述耳机200的耳机声道引脚210、耳机麦克风引脚220以及耳机地引脚GND3脚连接。所述耳机座声道引脚21、耳机座麦克风引脚22通过所述耳机声道引脚210、耳机麦克风引脚220以及所述耳机200的内部功能模块与耳机地引脚GND3电连 接，并通过所述耳机地引脚GND3与所述耳机座地引脚GND2电连接，而均通过该耳机座地引脚GND2接地，分别形成声道电流回路L1以及麦克风电流回路L2。
其中，所述声道电流回路L1以及麦克风电流回路L2的连接到地的公共段线路D1的电阻值主要由所述芯片地引脚GND1的接地点与所述耳机座地引脚GND2的接地点之间的地端电阻决定，由于该地端电阻很低，因此，声道电流回路L1的电流将直接通过该公共段线路D1接地，而不会流至麦克风电流回路L2中，因此，不会形成耳机电学回声。
其中，所述耳机声道引脚210、耳机麦克风引脚220以及耳机地引脚GND3位于所述耳机200的耳机插头上，所述内部功能模块可位于所述耳机200的耳塞部和/或耳机线中。
所述耳机200的内部功能模块可包括声道模块201以及麦克风模块202，所述声道模块201的第一端连接所述耳机200的耳机声道引脚210，所述麦克风模块202的第一端连接所述耳机200的耳机麦克风引脚220，所述声道模块201的第二端与所述麦克风模块202的第二端连接在一起，然后再连接至所述耳机地引脚GND3，并通过所述耳机座地引脚GND2电连接，而均通过该耳机座地引脚GND2接地。其中，所述声道模块201的第二端与所述麦克风模块202的第二端的连接点到地的线路即为前述的公共段线路D1。如前所述的，所述声道电流回路L1以及麦克风电流回路L2的连接到地的公共段线路D1的电阻值主要由所述芯片地引脚GND1的接地点与所述耳机座地引脚GND2的接地点之间的地端电阻决定，由于该地端电阻很低，因此，声道电流回路L1的电流将直接通过该公共段线路D1接地，而不会流至麦克风电流回路L2中，不会被麦克风模块202侦测到，因此不会产生电学回声。
例如，如图2所示，设该地端电阻为Rgnd，由于所述声道模块201的第二端与所述麦克风模块202的第二端的连接点连接至所述耳机座地引脚GND2的电连接件的电阻值非常低，因此，实际上所述声道电流回路L1以及麦克风电流回路L2的连接到地的公共段线路D1的电阻值主要由所述地端电阻Rgnd决定。由于通过本申请的上述结构改进，该地端电阻Rgnd也被降低到很小的值，因此，声道电流回路L1的电流将直接通过该公共段线路D1接地，而不 会流至麦克风电流回路L2中，而不会被麦克风模块202侦测到，不会产生电学回声。
其中，所述声道模块指能够实现声道音频处理和输出等功能的模块，所述麦克风模块202指能够实现麦克风语音输入和处理等功能的模块。
其中，如图1-图2所示，所述芯片声道引脚11包括芯片左声道引脚111以及芯片右声道引脚112，所述耳机座声道引脚21包括耳机座左声道引脚211以及耳机座右声道引脚212，所述芯片左声道引脚111以及芯片右声道引脚112分别与所述耳机座左声道引脚211以及耳机座右声道引脚212连接；所述芯片麦克风引脚12包括麦克风电源引脚121、麦克风正引脚122以及麦克风负引脚123，所述电子装置100还包括差分滤波电路3，所述麦克风电源引脚121、麦克风正引脚122以及麦克风负引脚123通过所述差分滤波电路3均与所述耳机座麦克风引脚22连接。
其中，所述耳机声道引脚210也进一步包括耳机左声道引脚2101以及耳机右声道引脚2102，耳机座2连接有耳机200时，所述耳机座左声道引脚211以及耳机座右声道引脚212分别与所述耳机左声道引脚2101以及耳机右声道引脚2102连接。
其中，如图2所示，所述声道模块201具体可包括左声道模块2011以及右声道模块2012，具体的，所述左声道模块2011的第一端连接所述耳机200的耳机左声道引脚2101，所述右声道模块2012的第一端连接所述耳机200的耳机右声道引脚2102。如前所述的，所述麦克风模块202的第一端连接所述耳机200的耳机麦克风引脚220。所述左声道模块2011、所述右声道模块2012的第二端与所述麦克风模块202的第二端连接在一起，然后再连接至所述耳机地引脚GND3，并通过所述耳机座地引脚GND2电连接，而均通过该耳机座地引脚GND2接地。其中，前述的声道电流回路L1包括了左声道电流回路以及右声道电流回路。由于该地端电阻很低，因此，左声道电流回路以及右声道电流回路的电流都将直接通过该公共段线路D1接地，而不会流至麦克风电流回路L2中，不会被麦克风模块202侦测到，因此不会产生电学回声。
其中，当耳机座2连接有耳机200时，如前所述的，所述耳机座麦克风引脚22还与所述耳机200的耳机麦克风引脚220连接。耳机200的麦克风输入 的麦克风信号通过耳机麦克风引脚220输入至所述耳机座麦克风引脚22，所述差分滤波电路3用于将耳机座麦克风引脚22接收的麦克风信号转换为包括麦克风正信号以及麦克风负信号的差分信号，并分别传输至所述编解码芯片21的麦克风正引脚122以及麦克风负引脚123。其中，所述麦克风电源引脚121用于提供用于为耳机200的麦克风模块202供电的工作电压，所述差分滤波电路3还用于将所述麦克风电源引脚121提供的工作电压通过所述耳机座麦克风引脚22以及耳机麦克风引脚220提供给所述耳机200的麦克风模块202，而使得所述耳机200的麦克风模块202可上电工作。以下将进一步详细介绍。
请一并参阅图3，图3为电子装置100的示意出部分结构的具体电路图。其中，所述差分滤波电路3包括第一RC滤波电路31、第二RC滤波电路32、第一电阻R1以及第二电阻R2。所述第一电阻R1以及第二电阻R2串联于所述麦克风电源引脚121与耳机座麦克风引脚22之间，所述第一RC滤波电路31连接于所述第一电阻R1和第二电阻R2的连接节点N1与所述麦克风正引脚122之间。所述第二RC滤波电路32连接于所述麦克风负引脚123与所述耳机座麦克风引脚22之间，即连接于所述麦克风负引脚123与所述第二电阻R2的的远离所述第一电阻R1的一端。
其中，所述第一RC滤波电路31、第二RC滤波电路32与所述第二电阻R2构成一个假差分及直流滤波电路，由于麦克风电源引脚121提供的用于为耳机200的麦克风模块202供电的工作电压为直流信号，而麦克风信号为交流信号，因此，所述第一RC滤波电路31、第二RC滤波电路32与所述第二电阻R2配合可以阻止麦克风电源引脚121提供的工作电压回传至所述麦克风正引脚122以及麦克风负引脚123，而仅仅将耳机座麦克风引脚22接收的麦克风信号转换为包括麦克风正信号以及麦克风负信号的差分信号，并分别传输至所述编解码芯片21的麦克风正引脚122以及麦克风负引脚123。而所述麦克风电源引脚121提供的工作电压可通过串联的第一电阻R1和第二电阻R2传输至所述耳机座麦克风引脚22，并通过所述耳机座麦克风引脚22及与其连接的耳机麦克风引脚220提供给所述耳机200的麦克风模块202，而使得所述耳机200的麦克风模块202可上电工作。从而，通过所述差分滤波电路3，能够使得所述麦克风电源引脚121、麦克风正引脚122以及麦克风负引脚123均与 所述耳机座麦克风引脚22连接，并通过所述耳机座麦克风引脚22同时实现对耳机200的麦克风模块202的供电，以及接收所述耳机200输入的麦克风信号。
在一些实施例中，如图1-图3所示，所述第一RC滤波电路31包括串联连接的第三电阻R1和第一电容C1，所述第二RC滤波电路32包括串联连接的第四电阻R4和第二电容C2。即，在一些实施例中，所述第一RC滤波电路31以及所述第二RC滤波电路32均为串联的电阻和电容构成的串联型RC滤波电路。
显然，在其他实施例中，所述第一RC滤波电路31以及所述第二RC滤波电路32中的至少一个还可为由并联的电阻和电容构成的并联型RC滤波电路。例如，所述第一RC滤波电路31可为串联型RC滤波电路，所述第二RC滤波电路32可为并联型RC滤波电路。
在一些实施例中，所述第二电阻的电阻值大于所述第一电阻的电阻值，所述第一电阻、第三电阻以及第四电阻的电阻值相同。其中，所述第二电阻的电阻值可为第一电阻、第三电阻以及第四电阻的电阻值的N倍，所述N为大于1的正整数。例如，所述第一电阻、第三电阻以及第四电阻的电阻值可为1K(千)欧姆，所述第二电阻的电阻值可为2K欧姆。
如图3所示，在一些实施例中，所述RC滤波电路3还包括第三电容C3，所述第三电容C3连接于所述第一电阻R1和第二电阻R2的连接节点N1和地之间，用于滤除交流信号，从而，可滤除耳机座麦克风引脚22接收的麦克风信号，进一步避免麦克风信号对麦克风电源引脚121造成干扰。
其中，所述第一电容C1、第二电容C2的电容值可为01μF(微法)，所述第三电容C3的电容值可为1μF。
如图3所示，在一些实施例中，所述RC滤波电路3还包括第四电容C4以及第五电容C5，所述第四电容C4连接于所述第一RC滤波电路31与所述第一电阻R1和第二电阻R2的连接节点N1连接的一端与地之间，即，第四电容C4连接于所述第一电阻R1和第二电阻R2的连接节点N1以及地之间。所述第五电容C5连接于所述第二电阻R2的的远离所述第一电阻R1的一端以及地之间。
其中，所述第四电容C4以及所述第五电容C5用于滤除麦克风信号的杂 音。其中，所述第四电容C4以及所述第五电容C5的电容值可为47pF(皮法)。
如图1-图3所示，所述芯片左声道引脚111与所述耳机座左声道引脚211之间还连接有第五电阻R5，所述芯片右声道引脚112与所述耳机座右声道引脚212之间还连接有第六电阻R6。
所述第五电阻R5和所述第六电阻R6用于对芯片左声道引脚111以及芯片右声道引脚112输出的左声道音频信号以及右声道音频信号的信号电平进行降压。即，从编解码芯片1的芯片左声道引脚111以及芯片右声道引脚112输出的信号电平比较大，差不多8、9百毫伏，而正常的耳机200一般能够承受的电平为400毫伏以下。因此，通过在所述芯片左声道引脚111与所述耳机座左声道引脚211之间连接的第五电阻R5，在所述芯片右声道引脚112与所述耳机座右声道引脚212之间连接的第六电阻R6，可分一部分电压，而使得输出至所述耳机座左声道引脚211以及所述耳机座右声道引脚212的音频信号的电平下降至合理范围。
其中，请再次参阅图3，具体的，所述编解码芯片1还包括运算放大器13，所述运算放大器13封装于所述编解码芯片1的内部。所述运算放大器13包括正相输入端Vin+、反相输入端Vin-、第一输出端Vo1、第二输出端Vo2、电源端Vcc以及接地端Vg。
所述运算放大器13的正相输入端Vin+、反相输入端Vin-分别与所述编解码芯片1的麦克风正引脚122以及麦克风负引脚123连接，所述运算放大器13用于将所述编解码芯片1的麦克风正引脚122以及麦克风负引脚123分别接收的麦克风正信号以及麦克风负信号进行放大，然后分别通过所述第一输出端Vo1、第二输出端Vo2输出至所述编解码芯片1中的后续电路，实现麦克风语音输入功能。
其中，所述电源端Vcc用于接收工作电压，而使得所述运算放大器13可上电工作。
其中，本申请中，所述接地端Vg与所述芯片地引脚GND1直接连接，并通过所述耳机座地引脚GND2接地。
其中，前述的所述芯片地引脚GND1的接地点与所述耳机座地引脚GND2的接地点之间的地端电阻，更具体的指的是所述运算放大器13的接地端Vg 与所述耳机座地引脚GND2的接地点之间的电阻。
从而，本申请中，所述运算放大器13并不是在编解码芯片1中直接接地，而是连接至所述耳机座地引脚GND2，通过所述耳机座地引脚GND2再接地。因此，可以有效减少所述地端电阻，有效抑制甚至消除电学回声。
请一并参阅图4，为本申请相对于现有方案的电学回声信号的波形示意图。其中，图4中的上半部分，也即“L”部分为现有方案的电学回声信号的波形，图4中的下半部分，也即“R”部分为本申请方案后的电学回声信号的波形。由图4可以看出，本申请的方案中的电学回声信号的幅值明显小于现有方案的电学回声信号的波形的幅值，从而，经过本申请的方案，该电学回声得到了有效抑制。
其中，本申请中，所述耳机座2为有线耳机座，且具体的，为3.5mm标准的耳机座，具体的，可为3.5mm耳机插口座等。显然，在其他实施例中，所述耳机座2也可为USB接口类型的耳机座。
其中，所述电子装置100可为手机、平板电脑、笔记本电脑等具有耳机座/耳机接口的智能终端。
其中，图3中还示意出了其他电阻、电容等电子器件，由于与本发明的主要改进无关，故不再进行描述。
本申请提供的电子装置，所述芯片地引脚GND1并不直接在芯片端接地，而是通过与所述耳机座地引脚GND2连接后，再通过所述耳机座地引脚GND2接地，能够将芯片地引脚GND1的接地点与所述耳机座地引脚GND2的接地点之间的地端电阻降低到很小。而由于该地端电阻是造成电学回声的主要原因，且地端电阻越大，电学回声越大，因此，本申请中，通过将所述芯片地引脚GND1与所述耳机座地引脚GND2连接后，再通过所述耳机座地引脚GND2接地，能够将芯片地引脚GND1的接地点与所述耳机座地引脚GND2的接地点之间的地端电阻降低到很小，而将电学回声降低到很小，甚至消除电学回声，有效提升了耳机输出性能。
以上是本申请实施例的实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请实施例原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本申请的保护范围。

Claims (11)

  1. 一种可提升耳机输出性能的电子装置，其特征在于，所述电子装置包括：
    编解码芯片，包括芯片地引脚；
    耳机座，包括耳机座地引脚，所述耳机座地引脚接地，其中，所述编解码芯片的芯片地引脚与所述耳机座地引脚连接，而通过所述耳机座地引脚接地。
  2. 根据权利要求1所述的电子装置，其特征在于，所述编解码芯片的芯片地引脚通过电连接件与所述耳机座地引脚直接电连接。
  3. 根据权利要求2所述的电子装置，其特征在于，所述电连接件包括导线、柔性电路板、电路板走线中的至少一种。
  4. 根据权利要求2所述的电子装置，其特征在于，所述编解码芯片还包括芯片声道引脚以及芯片麦克风引脚，所述耳机座还包括耳机座声道引脚以及耳机座麦克风引脚，所述芯片声道引脚、芯片麦克风引脚与所述耳机座声道引脚、耳机座麦克风引脚分别电连接。
  5. 根据权利要求4所述的电子装置，其特征在于，当耳机座连接有耳机时，所述耳机座声道引脚、耳机座麦克风引脚以及耳机座地引脚分别与通过所述耳机的声道引脚、耳机麦克风引脚以及耳机地引脚连接，所述耳机座声道引脚、耳机座麦克风引脚通过所述耳机的声道引脚、耳机麦克风引脚以及所述耳机的内部功能模块与耳机地引脚电连接，并通过所述耳机地引脚与所述耳机座地引脚电连接，而均通过该耳机座地引脚接地，分别形成声道电流回路以及麦克风电流回路。
  6. 根据权利要求4所述的电子装置，其特征在于，所述芯片声道引脚包括芯片左声道引脚以及芯片右声道引脚，所述耳机座声道引脚包括耳机座左声道引脚以及耳机座右声道引脚，所述芯片左声道引脚以及芯片右声道引脚分别与所述耳机座左声道引脚以及耳机座右声道引脚连接；所述芯片麦克风引脚包括麦克风电源引脚、麦克风正引脚以及麦克风负引脚，所述电子装置还包括差分滤波电路，所述麦克风电源引脚、麦克风正引脚以及麦克风负引脚通过所述差分滤波电路均与所述耳机座麦克风引脚连接，其中，所述差分滤波电路用于 将耳机座麦克风引脚接收的麦克风信号转换为包括麦克风正信号以及麦克风负信号的差分信号，并分别传输至所述编解码芯片的麦克风正引脚以及麦克风负引脚；其中，所述麦克风电源引脚用于提供用于为耳机的麦克风模块供电的工作电压，所述差分滤波电路还用于将所述麦克风电源引脚提供的工作电压通过所述耳机座麦克风引脚以及耳机麦克风引脚提供给所述耳机的麦克风模块，以使得所述耳机的麦克风模块可上电工作。
  7. 根据权利要求6所述的电子装置，其特征在于，所述差分滤波电路包括第一RC滤波电路、第二RC滤波电路、第一电阻以及第二电阻，所述第一电阻以及第二电阻串联于所述麦克风电源引脚与耳机座麦克风引脚之间，所述第一RC滤波电路连接于所述第一电阻和第二电阻的连接节点与所述麦克风正引脚之间，所述第二RC滤波电路连接于所述麦克风负引脚与所述耳机座麦克风引脚之间。
  8. 根据权利要求7所述的电子装置，其特征在于，所述第一RC滤波电路包括串联连接的第三电阻和第一电容，所述第二RC滤波电路包括串联连接的第四电阻和第二电容。
  9. 根据权利要求8所述的电子装置，其特征在于，所述第二电阻的电阻值大于所述第一电阻的电阻值，所述第一电阻、第三电阻以及第四电阻的电阻值相同。
  10. 根据权利要求6所述的电子装置，其特征在于，所述芯片左声道引脚与所述耳机座左声道引脚之间还连接有第五电阻，所述芯片右声道引脚与所述耳机座右声道引脚之间还连接有第六电阻，所述第五电阻和所述第六电阻用于对所述芯片左声道引脚及所述芯片右声道引脚输出的音频信号进行降压。
  11. 根据权利要求1所述的电子装置，其特征在于，所述耳机座为3.5mm标准的耳机座。
PCT/CN2021/119958 2021-07-31 2021-09-23 可提升耳机输出性能的电子装置 Ceased WO2023010667A1 (zh)

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