WO2022267805A1 - Module optique - Google Patents

Module optique Download PDF

Info

Publication number
WO2022267805A1
WO2022267805A1 PCT/CN2022/095067 CN2022095067W WO2022267805A1 WO 2022267805 A1 WO2022267805 A1 WO 2022267805A1 CN 2022095067 W CN2022095067 W CN 2022095067W WO 2022267805 A1 WO2022267805 A1 WO 2022267805A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
lens
circuit board
groove
chip
Prior art date
Application number
PCT/CN2022/095067
Other languages
English (en)
Chinese (zh)
Inventor
刘旭霞
�田�浩
王凤来
何鹏
杨思更
马晓磊
岳春云
丁翔宇
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202121393055.5U external-priority patent/CN214795316U/zh
Priority claimed from CN202110710346.0A external-priority patent/CN113484960A/zh
Priority claimed from CN202220297277.5U external-priority patent/CN216526414U/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Priority to CN202280007791.3A priority Critical patent/CN116897308A/zh
Publication of WO2022267805A1 publication Critical patent/WO2022267805A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the technical field of optical communication, in particular to an optical module.
  • optical communication technology is becoming more and more important.
  • the optical module is a tool to realize the conversion between optical signals and electrical signals, and is one of the key components in optical communication equipment.
  • an optical module in one aspect, includes a housing, a circuit board, an optical chip and a lens assembly.
  • the circuit board is arranged in the casing.
  • the optical chip is arranged on the circuit board.
  • the optical chip includes at least one of a light emitting chip and a light receiving chip.
  • the light emitting chip is configured to send out light signals
  • the light receiving chip is configured to receive light signals from outside the light module.
  • the lens assembly is arranged on the circuit board.
  • An accommodating cavity covering the optical chip is formed between the lens assembly and the circuit board, and the lens assembly is configured to change a propagation direction of an optical signal incident on the lens assembly.
  • the lens assembly includes a connection part and a lens body.
  • the connection part is disposed on one side of the lens body, and the lens body is configured to change the propagation direction of the optical signal incident to the lens assembly.
  • the lens assembly includes a stabilization assembly configured to stabilize transmission of the optical signal incident on the lens assembly.
  • Fig. 1 is a connection diagram of an optical communication system according to some embodiments
  • Fig. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • Fig. 3 is a structural diagram of an optical module according to some embodiments.
  • Fig. 4 is an exploded structure diagram of an optical module according to some embodiments.
  • Fig. 5 is a structural diagram of the optical module according to some embodiments after removing the upper case, the lower case and the unlocking part;
  • Fig. 6 is an exploded structure diagram of a lens assembly, an optical chip and a circuit board in an optical module according to some embodiments;
  • Fig. 7A is a structural diagram of a lens assembly according to some embodiments.
  • FIG. 7B is a cross-sectional view of a lens assembly in FIG. 7A;
  • FIG. 7C is a structural diagram of another angle of a lens assembly according to some embodiments.
  • Fig. 8A is an exploded structure diagram of a lens assembly and an optical filter according to some embodiments.
  • Fig. 8B is an assembly diagram of a lens assembly and a filter according to some embodiments.
  • FIG. 8C is a cross-sectional view of a lens assembly and a filter in FIG. 8B;
  • Fig. 9A is an optical path diagram of a lens assembly and an optical chip according to some embodiments.
  • Fig. 9B is an optical path diagram of a lens assembly and another optical chip according to some embodiments.
  • Fig. 9C is an optical path diagram of a lens assembly and another optical chip according to some embodiments.
  • Figure 10A is a block diagram of another lens assembly according to some embodiments.
  • FIG. 10B is a structural diagram of another lens assembly from another angle according to some embodiments.
  • Figure 10C is a cross-sectional view of another lens assembly in Figure 10B;
  • Fig. 10D is a structural diagram of another lens assembly without the optical sheet according to some embodiments.
  • Figure 11 is an optical path diagram of another lens assembly according to some embodiments.
  • Figure 12A is an optical path diagram of yet another lens assembly according to some embodiments.
  • Figure 12B is an optical path diagram of yet another lens assembly according to some embodiments.
  • Figure 13A is an optical path diagram of yet another lens assembly according to some embodiments.
  • Figure 13B is an optical path diagram of yet another lens assembly according to some embodiments.
  • Figure 14A is a structural diagram of yet another lens assembly according to some embodiments.
  • Fig. 14B is a structural view of another lens assembly according to some embodiments.
  • Fig. 14C is a cross-sectional view of another lens assembly in Fig. 14A;
  • Fig. 15 is an optical path diagram of another lens assembly according to some embodiments.
  • Fig. 16 is a structural diagram of a ferrule according to some embodiments.
  • Figure 17A is a top view of yet another lens assembly according to some embodiments.
  • Fig. 17B is a cross-sectional view of another lens assembly in Fig. 17A;
  • Figure 17C is a partially enlarged view of yet another lens assembly according to some embodiments.
  • Fig. 18 is an optical diagram of yet another lens assembly according to some embodiments.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality” means two or more.
  • the expressions “coupled” and “connected” and their derivatives may be used.
  • the term “connected” may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other.
  • the term “coupled” may be used when describing some embodiments to indicate that two or more elements are in direct physical or electrical contact.
  • the terms “coupled” or “communicatively coupled” may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other.
  • the embodiments disclosed herein are not necessarily limited by the context herein.
  • At least one of A, B and C has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, A and B A combination of A and C, a combination of B and C, and a combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • the term “if” is optionally interpreted to mean “when” or “at” or “in response to determining” or “in response to detecting,” depending on the context.
  • the phrases “if it is determined that " or “if [the stated condition or event] is detected” are optionally construed to mean “when determining ! or “in response to determining ! depending on the context Or “upon detection of [stated condition or event]” or “in response to detection of [stated condition or event]”.
  • parallel As used herein, “parallel”, “perpendicular”, and “equal” include the stated situation and the situation similar to the stated situation, the range of the similar situation is within the acceptable deviation range, wherein the The acceptable deviation ranges are as determined by one of ordinary skill in the art taking into account the measurement in question and errors associated with measurement of the particular quantity (ie, limitations of the measurement system).
  • “parallel” includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; Deviation within 5°.
  • “Equal” includes absolute equality and approximate equality, where the difference between the two that may be equal is less than or equal to 5% of either within acceptable tolerances for approximate equality, for example.
  • optical signals are used to carry information to be transmitted, and the optical signals carrying information are transmitted to information processing equipment such as computers through optical fibers or optical waveguides and other information transmission equipment to complete information transmission. Due to the passive transmission characteristics of optical signals when they are transmitted through optical fibers or optical waveguides, low-cost, low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. To establish an information connection between devices, it is necessary to realize the mutual conversion between electrical signals and optical signals.
  • Common information processing equipment includes routers, switches, and electronic computers.
  • the optical module realizes the mutual conversion function of the above-mentioned optical signal and electrical signal in the technical field of optical fiber communication.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fiber or optical waveguide through the optical port, and realizes the electrical connection with the optical network terminal (such as an optical modem) through the electrical port.
  • I2C Inter-Integrated Circuit
  • Wi-Fi wireless fidelity technology
  • Fig. 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system includes a remote server 1000 , a local information processing device 2000 , an optical network terminal 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .
  • optical fiber 101 One end of the optical fiber 101 is connected to the remote server 1000 , and the other end is connected to the optical network terminal 100 through the optical module 200 .
  • Optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if repeaters are used, theoretically unlimited distance transmission can be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach thousands of kilometers, tens of kilometers or hundreds of kilometers.
  • the local information processing device 2000 may be any one or more of the following devices: routers, switches, computers, mobile phones, tablet computers, televisions, and so on.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103 ; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100 .
  • the optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 disposed on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 A two-way electrical signal connection is established.
  • a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the electrical signal from the network cable 103 to the optical module 200, so the optical network terminal 100, as the host computer of the optical module 200, can monitor the optical module 200 jobs.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT) and the like.
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to access the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; electrical signal connection.
  • the optical module 200 implements mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101 . Since the optical module 200 is a tool for realizing mutual conversion of photoelectric signals and does not have the function of processing data, the information does not change during the above photoelectric conversion process.
  • the remote server 1000 establishes a two-way signal transmission channel with the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • the optical network terminal 100 also includes a circuit board 105 arranged in the casing, a cage 106 arranged on the surface of the circuit board 105, a radiator 107 arranged on the cage 106, and an electrical connection arranged in the cage 106 device.
  • the electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as a fin that increases the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100 , and the optical module 200 is fixed by the cage 106 .
  • the heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the radiator 107 .
  • the electrical port of the optical module 200 is connected to the electrical connector in the cage 106 , so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100 .
  • the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101 .
  • Fig. 3 is a structural diagram of an optical module according to some embodiments
  • Fig. 4 is an exploded structural diagram of an optical module according to some embodiments.
  • the optical module 200 includes a shell, a circuit board 300 disposed in the shell, an optical fiber adapter 600 and a lens assembly 400 .
  • the casing includes an upper casing 201 and a lower casing 202, and the upper casing 201 is covered on the lower casing 202 to form the above casing with two openings.
  • the outer contour of the casing generally presents a square shape.
  • the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper case 201 includes a cover plate 2011, and the cover plate 2011 covers the lower case 202 on the two lower side panels 2022 to form the above-mentioned housing.
  • the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021;
  • the two upper side plates 2012 perpendicular to the cover plate 2011 are combined with the two lower side plates 2022 so as to cover the upper case 201 on the lower case 202 .
  • the direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may not be consistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end in FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end in FIG. 3 ).
  • the opening 204 is located at the end of the optical module 200
  • the opening 205 is located at the side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden finger 301 of the circuit board 300 extends from the electrical port 204, and is inserted into the upper computer (for example, the optical network terminal 100); the opening 205 is an optical port, which is configured to be connected to an external optical fiber 101 to The optical fiber 101 is connected to the lens assembly 400 in the optical module 200 .
  • the combination of the upper housing 201 and the lower housing 202 is used to facilitate the installation of components such as the circuit board 300, the lens assembly 400, and the optical fiber adapter 600 into the housing, and these components are formed by the upper housing 201 and the lower housing 202. Encapsulation protection. In addition, when assembling components such as the circuit board 300 , the lens assembly 400 , and the fiber optic adapter 600 , it facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components of these components, and facilitates automatic production.
  • the upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realize electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking component 203 located on the outer wall of its housing.
  • the unlocking component 203 is configured to realize the fixed connection between the optical module 200 and the upper computer, or release the fixed connection between the optical module 200 and the upper computer.
  • the unlocking part 203 is located on the outer side of the two lower side plates 2022 of the lower casing 202, and has an engaging part matching with the cage 106 of the upper computer.
  • the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging part of the unlocking part 203; when the unlocking part 203 is pulled, the engaging part of the unlocking part 203 moves accordingly, thereby changing the locking part
  • the connection relationship with the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage 106 .
  • the circuit board 300 includes circuit traces, electronic components and chips, etc.
  • the electronic components and chips are connected together according to the circuit design through the circuit traces, so as to realize functions such as power supply, electrical signal transmission and grounding.
  • the electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET).
  • the chip can include, for example, a Microcontroller Unit (MCU), a laser driver chip, a limiting amplifier (Limiting Amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a digital signal processing (Digital Signal Processing , DSP) chip.
  • MCU Microcontroller Unit
  • DSP digital signal processing
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function, such as the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the cage 106 of the host computer in the electrical connector.
  • the circuit board 300 also includes golden fingers 301 formed on the end surface thereof.
  • the golden finger 301 is composed of multiple independent pins.
  • the circuit board 300 is inserted into the cage 106 , and is conductively connected with the electrical connector in the cage 106 by the gold finger 301 .
  • Gold fingers 301 can be set on only one side of the circuit board 300 (such as the upper surface shown in FIG. 4 ), or can be set on the upper and lower sides of the circuit board 300, so as to meet the occasions where the number of pins is large.
  • the golden finger 301 is configured to establish an electrical connection with a host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, and the like.
  • flexible circuit boards can also be used in some optical modules.
  • Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • the optical module 200 further includes an optical chip 500 disposed on the circuit board 300 .
  • the optical chip 500 is electrically connected to the circuit board 300 .
  • the optical chip 500 includes at least one of a light emitting chip 501 and a light receiving chip 502 (as shown in FIG. 9A ).
  • the light emitting chip 501 and the light receiving chip 502 are directly mounted on the circuit board 300 of the optical module 200 , and the light emitting direction of the light emitting chip 501 is perpendicular to the surface of the circuit board 300 .
  • the optical chip 500 may also include chips related to photoelectric conversion functions, such as a driver chip, a transimpedance amplifier chip, a limiter amplifier chip, and an optical monitoring chip.
  • the driving chip can cooperate with the light emitting chip 501 to drive the light emitting chip 501 to send out light signals.
  • the transimpedance amplifier chip can cooperate with the light receiving chip 502 to cooperate with the light receiving chip 502 to receive light signals.
  • the light monitoring chip can receive light signals.
  • the optical chip 500 may only include the light emitting chip 501 and the driving chip 507 (as shown in FIG. 15 ), or may only include the light receiving chip 502 and the transimpedance amplifier chip.
  • Fiber optic adapter 600 is configured to transmit optical signals.
  • the optical signal emitted by the optical transmitting chip 501 enters the optical fiber adapter 600 after passing through the lens assembly 400 , and is transmitted to the external optical fiber 101 through the optical fiber adapter 600 , so as to output the optical signal to the outside of the optical module 200 .
  • the optical signal transmitted by the external optical fiber 101 is transmitted into the lens assembly 400 through the optical fiber adapter 600 , and enters the light receiving chip 502 after passing through the lens assembly 400 , so as to receive the optical signal from the outside of the optical module 200 .
  • the optical fiber adapter 600 is located at the optical port formed by the upper housing 201 and the lower housing 202 (such as the opening 205 in FIG. 3 ), and is a connector for connecting the optical module 200 to the external optical fiber 101 .
  • the fiber optic adapter 600 generally has a standard shape and size to facilitate insertion of an external fiber optic connector/plug.
  • the optical fiber adapter 600 has multiple optical fiber interfaces, such as an interface for outgoing optical signals and an interface for incoming optical signals.
  • the optical fiber adapter 600 is inserted into the optical module 200 through an optical fiber connector (such as a mechanical transfer (Mechanical Transfer, MT) optical fiber connector (such as a multi-fiber push-in (Multi-fiber Push On, MPO) optical fiber jumper connector), so that the optical fiber
  • an optical fiber connector such as a mechanical transfer (Mechanical Transfer, MT) optical fiber connector (such as a multi-fiber push-in (Multi-fiber Push On, MPO) optical fiber jumper connector
  • MT mechanical transfer
  • MPO multi-fiber push-in optical fiber jumper connector
  • the optical module 200 further includes an internal optical fiber 603 disposed between the lens assembly 400 and the optical fiber adapter 600 .
  • One end of the internal optical fiber 603 is connected to the lens assembly 400
  • the other end of the internal optical fiber 603 is connected to the optical fiber adapter 600 , thereby realizing the optical connection between the lens assembly 400 and the optical fiber adapter 600 .
  • the optical module 200 further includes an optical fiber connector 604 .
  • the optical fiber connector 604 is disposed at the end of the inner optical fiber 603 close to the lens assembly 400 , so that the inner optical fiber 603 is connected to the lens assembly 400 through the optical fiber connector 604 .
  • the optical connection between the lens assembly 400 and the optical fiber adapter 600 can also be realized through the optical fiber array connection pipeline.
  • the optical module 200 includes two fiber optic adapters 600 (ie, a first fiber optic adapter 601 and a second fiber optic adapter 602 ).
  • Each of the two optical fiber adapters 600 can transmit optical signals to the outside, and can also transmit optical signals to the inside.
  • one of the two optical fiber adapters 600 transmits optical signals to the outside, and the other transmits optical signals to the inside.
  • the optical signal emitted by the optical transmitting chip 501 is transmitted to the first optical fiber adapter 601 after passing through a lens assembly 400 , and then transmitted to the external optical fiber 101 through the first optical fiber adapter 601 , so as to output the optical signal to the outside of the optical module 200 .
  • the optical signal from the external optical fiber 101 is transmitted to another lens assembly 400 through the second optical fiber adapter 602 , and then transmitted to the light receiving chip 502 through the lens assembly 400 , so as to receive the optical signal from the outside of the optical module 200 .
  • the lens assembly 400 is disposed on the circuit board 300 and includes a lens body 415 and a connecting portion 412 .
  • connection part 412 is disposed on a side of the lens body 415 close to the fiber optic adapter 600 and is configured to be connected to the fiber optic connector 604 .
  • the lens assembly 400 includes a connecting hole 480 , and the connecting hole 480 is disposed in the connecting portion 412 .
  • a central axis of the connection hole 480 is parallel to the circuit board 300 , and a side of the connection hole 480 away from the lens body 415 is opened to form an opening.
  • the inner optical fiber 603 can be inserted into the connection hole 480 through the opening.
  • the optical signal transmitted by the lens assembly 400 can be incident into the connecting hole 480 .
  • the lens assembly 400 includes a mounting hole 450 , and the mounting hole 450 is disposed on the lens body 415 and communicates with the connection hole 480 .
  • the central axis of the mounting hole 450 coincides with the central axis of the connection hole 480 .
  • the diameter of the mounting hole 450 is smaller than the diameter of the connecting hole 480 .
  • a stepped surface is formed at the junction of the mounting hole 450 and the connecting hole 480 , and the stepped surface is the limiting surface 460 .
  • the lens assembly 400 further includes a ferrule 800 disposed in the connecting hole 480 .
  • the end surface of the ferrule 800 close to the lens main body 415 is in contact with the limit surface 460, and the end surface of the ferrule 800 away from the lens main body 415 is in contact with a part of the end surface of the internal optical fiber 603 close to the ferrule 800, so that the ferrule 800 is in contact with the internal Optical signals can be transmitted between the optical fibers 603 .
  • the ferrule 800 includes connecting optical fibers 801 .
  • the connecting optical fiber 801 is disposed in the ferrule 800 , and the central axis of the connecting optical fiber 801 is substantially coincident with the central axis of the ferrule 800 . In this way, the optical signal from the lens body 415 can be incident into the connecting optical fiber 801 .
  • the ferrule 800 is inserted into the connection hole 480 through the opening of the connection hole 480 , and moves toward the lens body 415 along the connection hole 480 until the end surface of the ferrule 800 close to the lens body 415 contacts the limiting surface 460 .
  • the ferrule 800 can be in close contact with a part of the end surface of the inner optical fiber 603 close to the ferrule 800 , so as to realize the connection between the connecting optical fiber 801 in the ferrule 800 and the inner optical fiber 603 .
  • the optical signal from the lens body 415 can be incident into the connecting optical fiber 801 of the ferrule 800 , and then transmitted to the internal optical fiber 603 via the connecting optical fiber 801 , thereby realizing the transmission of the optical signal.
  • connection hole 480 By inserting the internal optical fiber 603 into the connection hole 480 and making the internal optical fiber 603 closely contact with the connecting optical fiber 801 , there is no need to process the end face of the internal optical fiber 603 close to the ferrule 800 , and it is convenient to connect the optical module 200 and the optical fiber adapter 600 .
  • the ferrule 800 is made of ceramic material
  • the connecting optical fiber 801 can be fixed by the ceramic ferrule
  • the ferrule 800 can be fixed in the connection hole 480 .
  • the ferrule 800 made of ceramics has higher processing precision. Therefore, when the ferrule 800 is fixed in the connection hole 480 by glue, the ferrule 800 is not easy to move, thereby improving the stability of connecting the optical fiber 801 .
  • the optical signal from the lens body 415 can be accurately incident into the connecting optical fiber 801, which improves the convergence accuracy of the optical signal.
  • lens assembly 400 includes second lens 413 as shown in FIG. 7B .
  • the second lens 413 is disposed on the surface of the lens body 415 close to the connection hole 480 and located in the installation hole 450 .
  • the second lens 413 protrudes toward the ferrule 800 , and the central axis of the second lens 413 coincides with the central axis of the connecting hole 480 .
  • the second lens 413 is configured to converge or collimate the optical signal, so as to improve the coupling efficiency of the optical signal between the lens assembly 400 and the internal optical fiber 603 .
  • the lens body 415 is configured to change the propagation direction of the optical signal.
  • the lens assembly 400 includes a first groove 401 and a second groove 410 , and the first groove 401 and the second groove 410 are disposed opposite to each other.
  • the first groove 401 is disposed on the surface of the lens body 415 away from the circuit board 300 , and is recessed toward the inside of the lens body 415 .
  • the second groove 410 is disposed on the surface of the lens body 415 close to the circuit board 300 , and is recessed into the lens body 415 .
  • the second groove 410 is configured to avoid the optical chip 500 disposed on the side of the circuit board 300 close to the lens assembly 400 .
  • the lens assembly 400 When the lens assembly 400 is arranged on the circuit board 300 (for example, the lens body 415 is pasted on the surface of the circuit board 300), an accommodating cavity is defined between the second groove 410 of the lens assembly 400 and the circuit board 300, so that the light
  • the chip 500 is disposed in the cavity.
  • the lens assembly 400 covers the optical chip 500 through the second groove 410 to cover the optical chip 500 .
  • the light-emitting chip 501 and the driving chip 507 are both arranged in the accommodating cavity, which shortens the connecting wire between the two chips and reduces the signal loss caused by the connecting wire.
  • both the light-receiving chip 502 and the transimpedance amplifier chip are disposed in the accommodating cavity, which also has the above-mentioned technical effect.
  • the lens assembly 400 and the circuit board 300 form a structure for encapsulating the optical chip 500 , the lens assembly 400 has a function of sealing the optical chip 500 .
  • light module 200 includes only one lens assembly 400 .
  • the lens assembly 400 is placed above the light emitting chip 501 and the light receiving chip 502, so that the transmission of optical signals between the light emitting chip 501 and the internal optical fiber 603 and the transmission of optical signals between the light receiving chip 502 and the internal optical fiber 603 can be realized through the lens assembly 400. transmission of optical signals.
  • the optical module 200 may include only one optical fiber adapter 600 .
  • the light module 200 may include two lens assemblies 400 .
  • Each lens assembly 400 is connected to a corresponding fiber optic adapter 600 via a corresponding internal fiber 603 , and then optically connected to the external optical fiber 101 through the optical fiber adapter 600 , thereby realizing optical signal transmission between the lens assembly 400 and the external optical fiber 101 .
  • the optical module 200 includes two lens assemblies 400 , and the two lens assemblies 400 are arranged side by side along the width direction of the circuit board 300 (direction JK in FIG. 5 ).
  • Each of the two lens assemblies 400 can transmit an optical signal of one wavelength emitted by the light emitting chip 501 and receive an optical signal of another wavelength transmitted by the external optical fiber 101, or the two lens assemblies 400 can One of them can transmit an optical signal of one wavelength emitted by the optical transmitting chip 501 to the outside, and the other can receive an optical signal of another wavelength transmitted by the external optical fiber 101, so as to realize the emission and processing of optical signals of two different wavelengths. take over.
  • the optical module 200 may include two optical fiber adapters 600 .
  • Each fiber optic adapter 600 is connected to a corresponding lens assembly 400 .
  • the two lens assemblies 400 may be separate parts or integral parts.
  • the optical module 200 may also include three, four or more lens assemblies 400, which is not limited in the present disclosure.
  • the lens assembly 400 can be integrally formed by using polymer material through injection molding process.
  • the lens assembly 400 is made of polyetherimide (Polyetherimide, PEI) and other materials with good light transmittance. Since all optical signal transmission elements in the lens assembly 400 are integrally molded with the same polymer material, the number of molds can be reduced, and the manufacturing cost and manufacturing complexity can be reduced. Moreover, with the above-mentioned structure of the lens assembly 400, the installation can be completed only by adjusting the incident optical signal and the position of the corresponding optical fiber, and the installation and debugging are simple.
  • the lens assembly 400 further includes an adjustment cavity 414 disposed in the second groove 410 .
  • the adjustment cavity 414 is configured to equalize the wall thickness of the lens assembly 400 , so as to avoid the problem of uneven shrinkage of the lens assembly 400 during the cooling process caused by the excessive wall thickness difference of the lens assembly 400 , which is beneficial to improve the quality of the lens assembly 400 .
  • the lens assembly 400 includes a first lens 411 configured to converge or collimate an optical signal.
  • the first lens 411 is disposed at the bottom of the second groove 410 , and the orthographic projection of the first lens 411 on the circuit board 300 overlaps with the orthographic projection of the optical chip 500 on the circuit board 300 .
  • the first lens 411 is configured to collimate the light signal emitted by the light emitting chip 501, and the light signal collimated by the first lens 411 is perpendicular to the circuit board 300 .
  • the first lens 411 is configured to converge the optical signal from the outside to the light receiving chip 502 .
  • the lens assembly 400 may also include two or more first lenses 411 .
  • the number of first lenses 411 can be selected according to the number of light emitting chips 501 and light receiving chips 502 covered by the lens assembly 400 .
  • the lens assembly 400 when the lens assembly 400 is provided with one light emitting chip 501 and one light receiving chip 502 , the lens assembly 400 includes two first lenses 411 .
  • the orthographic projection of a first lens 411 on the circuit board 300 overlaps with the orthographic projection of the light emitting chip 501 on the circuit board 300 , and the first lens 411 can collimate the light signal emitted by the light emitting chip 501 .
  • the orthographic projection of another first lens 411 on the circuit board 300 overlaps with the orthographic projection of the light receiving chip 502 on the circuit board 300 , and the first lens 411 can converge the light signal from the outside to the light receiving chip 502 .
  • the first lens 411 may be formed by protruding a portion of the bottom of the second groove 410 toward the circuit board 300 , and the focus of the first lens 411 is located on the corresponding optical chip 500 .
  • the lens assembly 400 includes an optical filter 700 configured to reflect and/or transmit an optical signal according to the wavelength of the optical signal.
  • the filter 700 is obliquely disposed in the first groove 401 .
  • the optical filter 700 is inclined toward a direction close to the connecting portion 412 .
  • the horizontal distance between the optical filter 700 and the connecting portion 412 decreases gradually.
  • the cooperation of the optical filter 700 and the lens assembly 400 can change the transmission direction of the optical signal, thereby realizing the transmission of the optical signal between the optical chip 500 and the internal optical fiber 603 .
  • the lens assembly 400 is assembled with the filter 700 through the first groove 401 , so as to protect the filter 700 .
  • the included angle between the optical filter 700 and the circuit board 300 is any value between 39°-51°.
  • the included angle may be 39°, 42°, 45°, 48° or 51°, etc.
  • the orthographic projection of the filter 700 on the circuit board 300 overlaps with the orthographic projection of the first lens 411 on the circuit board 300 .
  • the filter 700 includes a filter body 71 and a first optical film 72 and a second optical film 72 disposed opposite to the filter body 71 along the thickness direction of the filter 700 .
  • the first optical film 72 is the transflective surface 701 of the optical filter 700
  • the second optical film 73 is the transmissive surface 702 of the optical filter 700 .
  • the transflective surface 701 is located on a side of the filter body 71 close to the connecting portion 412 and is configured to transmit and/or reflect optical signals.
  • the transmission surface 702 is located on a side of the filter body 71 away from the connecting portion 412 and is configured to transmit optical signals.
  • the filter 700 can be bonded in the first groove 401 of the lens assembly 400 .
  • the lens assembly 400 includes a first optical surface 402 and a second optical surface 403 .
  • the first optical surface 402 is at least a part of the sidewall of the first groove 401 close to the connecting portion 412 .
  • the second optical surface 403 is a part of the groove bottom of the first groove 401 and is connected with the first optical surface 402 .
  • the second optical surface 403 is located on the side of the optical filter 700 close to the circuit board 300 (as shown below the optical filter 700 in FIG. The orthographic projections on the circuit board 300 are overlaid.
  • the first optical surface 402 and the second optical surface 403 are configured to transmit optical signals.
  • the optical signal from the internal optical fiber 603 can be transmitted to the optical filter 700 through the first optical surface 402, and part of the optical signal is reflected by the optical filter 700 to the second optical surface 403, and then reflected by the second optical surface 403 to the light receiving chip 502.
  • the optical signal emitted by the light emitting chip 501 in the optical chip 500 can be transmitted to the optical filter 700 through the second optical surface 403, transmitted to the first optical surface 402 after being reflected by the optical filter 700, and then transmitted through the first optical surface 402.
  • the optical face 402 transmits to the inner optical fiber 603 .
  • the first optical surface 402 is arranged obliquely toward the direction close to the connecting portion 412 relative to the vertical surface perpendicular to the circuit board 300 .
  • the horizontal distance between the first optical surface 402 and the connecting portion 412 decreases gradually.
  • the angle ⁇ between the first optical surface 402 and the vertical surface perpendicular to the circuit board 300 is any value between 3° and 8°.
  • the included angle ⁇ is 3°, 4°, 6° or 8°, etc.
  • the second optical surface 403 is disposed obliquely toward the connecting portion 412 relative to the horizontal plane where the circuit board 300 is located. For example, in the direction away from the circuit board 300 , the horizontal distance between the second optical surface 403 and the connecting portion 412 decreases gradually.
  • the angle ⁇ between the second optical surface 403 and the horizontal plane where the circuit board 300 is located is any value between 3° and 8°. For example, the included angle ⁇ is 3°, 4°, 6° or 8°, etc.
  • the first optical surface 402 is not perpendicular to the central axis h of the second lens 413
  • the second optical surface 403 is not parallel to the central axis h of the second lens 413 . In this way, it is beneficial to prevent the optical signal reflected by the optical filter 700 from returning along the original path.
  • the lens assembly 400 further includes a third optical surface 404 and a fourth optical surface 405 .
  • the third optical surface 404 and the fourth optical surface 405 are respectively part of the bottom of the first groove 401 .
  • the third optical surface 404 is disposed on a side of the second optical surface 403 away from the first optical surface 402 and is configured to transmit optical signals.
  • the third optical surface 404 is disposed obliquely in a direction away from the connecting portion 412 relative to the horizontal plane where the circuit board 300 is located. For example, in the direction away from the circuit board 300 , the horizontal distance between the third optical surface 404 and the connecting portion 412 increases gradually.
  • the fourth optical surface 405 is connected to the side of the third optical surface 404 away from the second optical surface 403, and the orthographic projection of the fourth optical surface 405 on the circuit board 300 is the same as the orthographic projection of the first lens 411 on the circuit board 300 overlapping.
  • the fourth optical surface 405 is configured to reflect an optical signal.
  • the fourth optical surface 405 is disposed obliquely toward the connecting portion 412 relative to the horizontal plane where the circuit board 300 is located. For example, in the direction away from the circuit board 300 , the horizontal distance between the fourth optical surface 405 and the connecting portion 412 decreases gradually.
  • the third optical surface 404 is also configured to adjust the transmission direction of the optical signal through refraction, which is beneficial for the fourth optical surface 405 to reflect the optical signal; or, as shown in FIG. 9B , the third optical surface 404 The optical surface 404 is also configured to adjust the transmission direction of the optical signal reflected by the fourth optical surface 405 .
  • part of the optical signal can be transmitted through the optical filter 700 to the third optical surface 404, and transmitted through the third optical surface 404 to the fourth optical surface 405 .
  • the optical signal transmitted to the fourth optical surface 405 can be reflected by the fourth optical surface 405 to the light receiving chip 502 in the optical chip 500 .
  • the optical signal emitted by the light emitting chip 501 in the optical chip 500 can be reflected by the fourth optical surface 405 to the third optical surface 404 , and then transmitted to the optical filter 700 through the third optical surface 404 .
  • the optical signal transmitted to the optical filter 700 can be transmitted to the first optical surface 402 through the optical filter 700 , and then transmitted to the internal optical fiber 603 through the first optical surface 402 .
  • the lens assembly 400 further includes a first mounting platform 406 and a second mounting platform 407, and the first mounting platform 406 and the second mounting platform 407 are both arranged on Inside the first groove 401.
  • the first installation platform 406 and the second installation platform 407 are respectively arranged on two sides of the second optical surface 403 , and the first installation platform 406 and the second installation platform 407 can be used to fix the optical filter 700 .
  • Surfaces of the first installation platform 406 and the second installation platform 407 close to the optical filter 700 are in the same plane.
  • Surfaces of the first installation platform 406 and the second installation platform 407 close to the optical filter 700 are respectively connected to a part of the transflective surface 701 of the optical filter 700 .
  • the surface of the first installation platform 406 or the second installation platform 407 close to the optical filter 700 is inclined towards the connection portion 412 relative to the horizontal plane where the circuit board 300 is located. In this way, it is convenient to place the filter 700 obliquely in the first groove 401 .
  • the horizontal distance between the surface of the first installation platform 406 or the second installation platform 407 close to the optical filter 700 and the connecting portion 412 gradually decreases.
  • the included angles between the surfaces of the first installation platform 406 and the second installation platform 407 near the optical filter 700 and the circuit board 300 are any value between 39°-51°.
  • the included angle between the surfaces of the first installation platform 406 and the second installation platform 407 near the optical filter 700 and the circuit board 300 may be 39°, 42°, 45°, 48° or 51°.
  • the optical filter 700 is fixedly connected to at least one of the first installation platform 406 or the second installation platform 407 by dispensing glue.
  • the lens assembly 400 further includes a supporting platform 408 disposed in the first groove 401 .
  • the supporting platform 408 is disposed on the end of the second optical surface 403 close to the third optical surface 404 and extends along the width direction of the lens assembly 400 (eg JK direction in FIG. 8A ).
  • the support table 408 is configured to support the sides of the optical filter 700 .
  • the side surface of the optical filter 700 is supported by the supporting table 408, so that the optical filter 700 can be fixed reliably.
  • the support platform 408 includes a support platform body 4082 and a support surface 4081 .
  • the support surface 4081 is located on a side of the support body 4082 close to the filter 700 to support the side of the filter 700 .
  • the support surface 4081 is perpendicular to the surfaces of the first mounting platform 406 and the second mounting platform 407 close to the optical filter 700, so that the sides of the optical filter 700 are all connected to the support contact with the surface 4081, thereby ensuring the installation reliability of the optical filter 700.
  • the end of the support platform 408 close to the circuit board 300 (the bottom of the support platform 408 as shown in FIG. 7B ) is connected to the third optical surface 404, so that The filter 700 does not need to be directly supported by the third optical surface 404 , which reduces constraints on the third optical surface 404 and facilitates the installation and use of the third optical surface 404 .
  • the lens assembly 400 further includes a third groove 409 .
  • the third groove 409 is arranged on at least one end of the first mounting platform 406 and the second mounting platform 407 close to the circuit board 300 (that is, the bottom end of at least one of the first mounting platform 406 and the second mounting platform 407), and The third groove 409 is located at both ends of the supporting platform 408 .
  • the third groove 409 is configured to store the glue overflowing from the first installation platform 406 and the second installation platform 407, so as to avoid contamination of the optical filter 700 or the second optical surface by the overflowing glue when the optical filter 700 is fixed by glue 403.
  • the size of the support platform 408 in the width direction of the lens assembly 400 is smaller than the size of the first groove 401 in the width direction of the lens assembly 400, so that the support platform 408 and the first A third groove 409 is formed between sidewalls of the groove 401 .
  • one end of the support platform 408 extends to the bottom end of the first installation platform 406
  • the other end of the support platform 408 extends to the bottom end of the second installation platform 407 .
  • there is a certain distance between both ends of the supporting platform 408 and the sidewall of the first groove 401 so that a third groove 409 is formed between the supporting platform 408 and the sidewall of the first groove 401 .
  • the glue overflowing from the first installation platform 406 and the second installation platform 407 can flow into the corresponding third groove 409 along the inclined direction of the surfaces of the first installation platform 406 and the second installation platform 407 close to the optical filter 700 , It is convenient to improve the yield and stability when the filter 700 is fixed.
  • 9A to 9C show optical signal transmission paths between the lens assembly 400 and different optical chips 500 .
  • the optical chip 500 when the optical chip 500 includes a light emitting chip 501 and a light receiving chip 502 , both the light emitting chip 501 and the light receiving chip 502 are disposed on the circuit board 300 .
  • the light emitting chip 501 is disposed on one side of the light receiving chip 502 and is located below the second optical surface 403 .
  • the light receiving chip 502 is located below the fourth optical surface 405 .
  • the lens assembly 400 includes two first lenses 411 corresponding to the light emitting chip 501 and the light receiving chip 502 respectively.
  • One first lens 411 is arranged under the second optical surface 403
  • the other first lens 411 is arranged under the fourth optical surface 405 .
  • the light emitting chip 501 emits an optical signal with a first wavelength, and the optical signal is transmitted to the first lens 411 under the second optical surface 403 , and transmitted to the second optical surface 403 after being collimated by the first lens 411 .
  • the optical signal transmitted to the second optical surface 403 passes through the second optical surface 403 and is transmitted to the transflective surface 701 of the optical filter 700 . Then, the optical signal transmitted to the transflective surface 701 is reflected by the transflective surface 701 to the first optical surface 402 , and transmitted to the second lens 413 through the first optical surface 402 .
  • the optical signal transmitted to the second lens 413 is focused by the second lens 413 and then transmitted to the connection part 412 and enters the internal optical fiber 603 , thereby realizing the optical signal transmission between the light emitting chip 501 and the internal optical fiber 603 .
  • the optical signal of the second wavelength is transmitted to the second lens 413 through the internal optical fiber 603 , and transmitted to the first optical surface 402 after being collimated by the second lens 413 .
  • the optical signal transmitted to the first optical surface 402 is transmitted to the transflective surface 701 of the filter 700 after passing through the first optical surface 402 , and transmitted to the transmissive surface 702 through the transflective surface 701 .
  • the optical signal transmitted to the transmission surface 702 is transmitted to the third optical surface 404 after passing through the transmission surface 702 , and transmitted to the fourth optical surface 405 through the third optical surface 404 .
  • the optical signal transmitted to the fourth optical surface 405 is reflected by the fourth optical surface 405 to the first lens 411 below the fourth optical surface 405, and is transmitted to the light receiving chip 502 after being focused by the first lens 411, thereby The optical signal transmission between the optical receiving chip 502 and the internal optical fiber 603 is realized.
  • the single-fiber bidirectional transmission function of the optical module 200 is realized.
  • the optical chip 500 includes two light-emitting chips 501 (namely, the first light-emitting chip 503 and the second light-emitting chip 504)
  • the first light-emitting chip 503 and the second light-emitting chip 504 are all arranged on the circuit board 300 .
  • the first light-emitting chip 503 is disposed on one side of the second light-emitting chip 504 and is located below the second optical surface 403 .
  • the second light emitting chip 504 is located below the fourth optical surface 405 .
  • the lens assembly 400 includes two first lenses 411 corresponding to the two light emitting chips 501 respectively.
  • One first lens 411 is arranged under the second optical surface 403
  • the other first lens 411 is arranged under the fourth optical surface 405 .
  • the first light-emitting chip 503 sends out an optical signal of the first wavelength, and the transmission path of the light signal can refer to the transmission path of the light signal of the first wavelength sent by the light-emitting chip 501 in FIG. 9A .
  • the second light-emitting chip 504 emits an optical signal of the second wavelength, and the optical signal is transmitted to the first lens 411 under the fourth optical surface 405 , and transmitted to the fourth optical surface 405 after being collimated by the first lens 411 .
  • the optical signal transmitted to the fourth optical surface 405 is reflected by the fourth optical surface 405 to the third optical surface 404 , and transmitted to the filter 700 through the third optical surface 404 .
  • the optical signal transmitted to the optical filter 700 is transmitted to the first optical surface 402 after passing through the transmissive surface 702 and the transflective surface 701 in sequence.
  • the optical signal transmitted to the first optical surface 402 is transmitted to the second lens 413 after passing through the first optical surface 402 .
  • the optical signal transmitted to the second lens 413 is transmitted to the internal optical fiber 603 in the connection part 412 after being focused by the second lens 413 .
  • the optical filter 700 can multiplex the optical signal sent by the first light emitting chip 503 and the optical signal sent by the second light emitting chip 504 .
  • the optical chip 500 includes two light receiving chips 502 (i.e. the first light receiving chip 505 and the second light receiving chip 506)
  • the first light receiving chip 505 and the second light receiving chip 506 are all arranged on the circuit board 300 .
  • the first light receiving chip 505 is disposed on one side of the second light receiving chip 506 and is located below the second optical surface 403 .
  • the second light receiving chip 506 is located below the fourth optical surface 405 .
  • the lens assembly 400 includes two first lenses 411 corresponding to the two light receiving chips 502 respectively.
  • One first lens 411 is arranged under the second optical surface 403
  • the other first lens 411 is arranged under the fourth optical surface 405 .
  • the optical signal of the first wavelength is transmitted to the second lens 413 through the internal optical fiber 603 , and transmitted to the first optical surface 402 after being collimated by the second lens 413 .
  • the optical signal transmitted to the first optical surface 402 is transmitted to the transflective surface 701 of the optical filter 700 after passing through the first optical surface 402 , and is reflected to the second optical surface 403 by the transflective surface 701 .
  • the optical signal transmitted to the second optical surface 403 passes through the second optical surface 403 to the first lens 411 below the second optical surface 403, and is transmitted to the first light receiving chip 505 after being focused by the first lens 411 , so as to realize the transmission of optical signals between the first light receiving chip 505 and the internal optical fiber 603 .
  • the optical signal of the second wavelength is sequentially transmitted to the lens assembly 400 and the second optical receiving chip 506 through the internal optical fiber 603 , the transmission path of the optical signal of the second wavelength can refer to the transmission path of the optical signal received by the optical receiving chip 502 in FIG. 9A .
  • the optical filter 700 can split the incoming optical signal from the internal optical fiber 603 , so that the first light receiving chip 505 and the second light receiving chip 506 respectively receive optical signals of different wavelengths.
  • the above-described embodiment provides a corresponding installation structure (that is, the first installation platform 406, the second installation platform 407 and the support platform 408) for the optical filter 700 to ensure the stability of the optical filter 700 when it is fixed, thereby improving the optical efficiency.
  • the stability of the module 200 transmission But the present disclosure is not limited thereto.
  • the lens assembly 400 includes a connecting portion 412, a lens body 415, a first groove 401, a second groove 410, a second lens 413, a connecting hole 480, a mounting hole 450 and Outside the ferrule 800 , the two first lenses 411 included in the lens assembly 400 are respectively a first sub-lens 4111 and a second sub-lens 4112 .
  • the first sub-lens 4111 is disposed directly above the light emitting chip 501 and configured to collimate the light signal emitted by the light emitting chip 501 .
  • the second sub-lens 4112 is located on a side of the first sub-lens 4111 away from the connecting portion 412 , and the second sub-lens 4112 is disposed directly above the light receiving chip 502 .
  • the second sub-lens 4112 is configured to converge the light signal from the outside to the light receiving chip 502.
  • the lens assembly 400 includes an optical sheet 490 .
  • the optical sheet 490 is configured to reflect the light signal collimated by the first sub-lens 4111 to the second lens 413 to realize the transmission of the light signal.
  • the optical signal reflected by the optical sheet 490 is parallel to the circuit board 300 .
  • the optical sheet 490 is obliquely disposed in the first groove 401 , and the optical sheet 490 is disposed on a side of the first sub-lens 4111 away from the circuit board 300 (above the first sub-lens 4111 as shown in FIG. 10C ).
  • the optical sheet 490 In a direction away from the circuit board 300 , the optical sheet 490 is inclined toward a direction close to the connection portion 412 .
  • the horizontal distance between the optical sheet 490 and the connecting portion 412 decreases gradually.
  • the angle between the optical sheet 490 and the circuit board 300 is any value between 39° and 51°.
  • the included angle between the optical sheet 490 and the circuit board 300 may be 39°, 42°, 45°, 48° or 51° and so on.
  • the lens assembly 400 includes a third mount 418 disposed in the first groove 401 .
  • the third mount 418 is configured to fix the optical sheet 490 .
  • the surface of the third installation platform 418 close to the optical sheet 490 is inclined relative to the horizontal plane where the circuit board 300 is located, so as to install the optical sheet 490 obliquely in the first groove 401 .
  • the angle between the surface of the third mounting platform 418 close to the optical sheet 490 and the circuit board 300 is any value between 39° and 51°.
  • the included angle between the surface of the third mounting platform 418 close to the optical sheet 490 and the circuit board 300 may be 39°, 42°, 45°, 48° or 51°.
  • the optical sheet 490 only reflects the optical signal collimated by the first sub-lens 4111 .
  • the optical sheet 490 can be the above-mentioned optical filter 700, so that the optical sheet 490 can not only reflect The optical signal collimated by the lens 4111 can also transmit the optical signal from the outside.
  • the lens assembly 400 when the optical sheet 490 is a filter 700 , the lens assembly 400 further includes a fourth groove 420 and a fifth optical surface 419 .
  • the fourth groove 420 is disposed on a side of the first groove 401 away from the connecting portion 412 , and is recessed toward the inside of the lens assembly 400 .
  • the fifth optical surface 419 is at least a part of the sidewall of the fourth groove 420 close to the first groove 401 .
  • the fifth optical surface 419 is inclined toward the connecting portion 412 relative to the horizontal plane where the circuit board 300 is located, and is located on the side of the second sub-lens 4112 away from the circuit board 300 (as shown in FIG. 10C , the second sub-lens 4112 above). For example, in the direction away from the circuit board 300 , the horizontal distance between the fifth optical surface 419 and the connecting portion 412 decreases gradually.
  • the fifth optical surface 419 is configured to reflect the optical signal from the outside and transmitted through the optical sheet 490 to the second sub-lens 4112 .
  • an external optical signal parallel to the circuit board 300 passes through the optical sheet 490 and enters the fifth optical surface 419 , and is reflected by the fifth optical surface 419 as an optical signal perpendicular to the circuit board 300 . Then, the light signal reflected by the fifth optical surface 419 is converged to the light receiving chip 502 through the second sub-lens 4112 , so as to realize the reception of the light signal.
  • the second lens 413 is disposed on the side of the optical sheet 490 close to the connecting portion 412, so as to converge the optical signal reflected by the optical sheet 490 to the connecting optical fiber 801 of the ferrule 800, or to converge the optical signal from the
  • the optical signal of the inner fiber 603 is collimated and transmitted to the optical sheet 490 .
  • the light-emitting chip 501 emits an optical signal of a first wavelength, and the optical signal is perpendicular to the surface of the circuit board 300 .
  • the optical signal is collimated by the first sub-lens 4111 and then enters the optical sheet 490 .
  • the optical signal is reflected by the optical sheet 490 as an optical signal parallel to the circuit board 300 , and enters the second lens 413 .
  • the optical signal incident on the second lens 413 is condensed by the second lens 413, then incident on the connecting optical fiber 801, and transmitted to the internal optical fiber 603 through the connecting optical fiber 801, so as to realize the emission of the optical signal.
  • the external optical signal with the second wavelength is transmitted to the connecting fiber 801 wrapped by the ferrule 800 through the internal fiber 603 , and then transmitted to the second lens 413 through the connecting fiber 801 .
  • the optical signal transmitted to the second lens 413 is collimated by the second lens 413 and then directly passes through the optical filter 700 (ie, the optical sheet 490 ).
  • the optical signal passing through the optical filter 700 is reflected at the fifth optical surface 419 , so that the optical signal parallel to the circuit board 300 is reflected as an optical signal perpendicular to the circuit board 300 .
  • the light signal reflected by the fifth optical surface 419 is incident to the light receiving chip 502 after being converged by the second sub-lens 4112 , thereby realizing the reception of the light signal.
  • Lens assembly 400 includes a media interface 417 .
  • the medium interface 417 is a part of the groove bottom of the first groove 401 and is configured to transmit and reflect the optical signal emitted by the first sub-lens 4111 .
  • the medium interface 417 is closer to the circuit board 300 .
  • the medium interface 417 is located between the first sub-lens 4111 and the optical sheet 490, and there is a first gap 91 between the medium interface 417 and the optical sheet 490 (as shown in the dotted line box in FIG. 10C ), the first gap 91 There is air inside. Therefore, the media on both sides of the media interface 417 are different.
  • the optical signal collimated by the first sub-lens 4111 is incident on the medium interface 417, since the light is reflected at the interface of different media, the transmission and reflection phenomenon occurs when the optical signal passes through the medium interface 417, that is, the The optical signal is divided into optical signals of different directions. A part of the optical signal directly passes through the medium interface 417 and enters the optical sheet 490 , while another part of the optical signal is reflected at the medium interface 417 , and the reflected optical signal is incident on the optical monitoring chip 508 on the circuit board 300 .
  • the optical monitoring chip 508 can convert the received optical signal into an electrical signal, and send the electrical signal to a control module (eg, a microprocessor).
  • the control module can calculate the optical power of the received optical signal, and then calculate the optical power of the optical signal sent by the light emitting chip 501 according to the preset light splitting ratio, so as to realize the monitoring function of the optical signal.
  • the first angle B between the medium interface 417 and the circuit board 300 and the second angle C between the optical sheet 490 and the circuit board 300 are different, that is, the medium interface The interface 417 and the optical sheet 490 are set at a certain angle.
  • the first angle B between the medium interface 417 and the circuit board 300 is smaller than the second angle C between the optical sheet 490 and the circuit board 300 .
  • the reflected optical signal may be transmitted toward the circuit board 300 and incident on the optical monitoring chip 508 on the circuit board 300 .
  • the direction of the optical signal reflected by the medium interface 417 is different from the direction of the optical signal reflected by the optical sheet 490 , and the direction of the optical signal reflected by the medium interface 417 is not parallel to the circuit board 300 .
  • the optical monitoring chip 508 can convert the received optical signal into an electrical signal, and send the electrical signal to the control module, and the control module can calculate the received
  • the optical power of the optical signal is then calculated according to a preset splitting ratio to obtain the optical power of the optical signal sent by the light emitting chip 501 , so as to monitor the light emitting chip 501 .
  • the first angle B between the medium interface 417 and the circuit board 300 is the first angle
  • the distance between the medium interface 417 and the first sub-lens 4111 is the first distance
  • the light reflected by the medium interface 417 The signal is converged to the light monitoring chip 508 through the first sub-lens 4111 .
  • the second angle of the optical signal emitted by the sub-lens 4111 to the medium interface 417 is relatively small, and the reflection angle of the optical signal reflected by the medium interface 417 is also relatively small.
  • the angle between the optical signal reflected by the medium interface 417 and the optical signal emitted by the first sub-lens 4111 is small, and the distance between the optical signal reflected by the medium interface 417 and the first sub-lens 4111 is Also smaller.
  • the light signal reflected by the medium interface 417 is close to the first sub-lens 4111, so that the light signal reflected by the medium interface 417 can pass through the first sub-lens 4111 again, and after being converged by the first sub-lens 4111, enter the light monitoring Chip 508.
  • the first angle B between the medium interface 417 and the circuit board 300 is the second angle
  • the distance between the medium interface 417 and the first sub-lens 4111 is the second distance
  • the light reflected by the medium interface 417 The signal is directly incident to the light monitoring chip 508 .
  • the second angle is greater than the first angle
  • the second distance is greater than the first distance.
  • the second angle of the optical signal emitted by a sub-lens 4111 to the medium interface 417 is relatively large, and the reflection angle of the optical signal reflected by the medium interface 417 is also relatively large.
  • the angle between the optical signal reflected by the medium interface 417 and the optical signal emitted by the first sub-lens 4111 is relatively large, and the distance between the optical signal reflected by the medium interface 417 and the first sub-lens 4111 is Also larger.
  • the optical signal reflected by the medium interface 417 is far away from the first sub-lens 4111, so that the optical signal reflected by the medium interface 417 can be far away from the first sub-lens 4111, and the optical signal can directly enter the Light monitoring chip 508 .
  • the lens assembly 400 further includes a sixth optical surface 421 .
  • the sixth optical surface 421 is a part of the groove bottom of the second groove 410 and is configured to refract the optical signal reflected by the medium interface 417 to the optical monitoring chip 508 so as to improve the accuracy of spectroscopic monitoring.
  • the sixth optical surface 421 is located on the side of the first sub-lens 4111 close to the connecting portion 412, and is located on the side of the light monitoring chip 508 away from the circuit board 300 (the light monitoring chip shown in FIG. 13A 508).
  • the optical signal reflected by the medium interface 417 is incident on the sixth optical surface 421
  • the optical signal reflected by the medium interface 417 is refracted at the sixth optical surface 421, and is incident on the optical monitor in the state of parallel light. Chip 508.
  • the optical signal emitted by the first sub-lens 4111 is split at the medium interface 417, a part of the optical signal passes through the medium interface 417 and enters the optical sheet 490, while the other part of the optical signal passes through the medium interface 417 and enters the optical sheet 490. Reflection occurs at interface 417 .
  • the optical signal reflected by the medium interface 417 is transmitted to the sixth optical surface 421 , and is incident on the light monitoring chip 508 after being refracted at the sixth optical surface 421 .
  • the angle between the sixth optical surface 421 and the circuit board 300 can be adjusted according to the angle between the medium interface 417 and the circuit board 300 , so that the medium interface 417
  • the reflected optical signal can be vertically incident to the sixth optical surface 421 .
  • the optical signal reflected by the medium interface 417 can directly transmit through the sixth optical surface 421 and enter the optical monitoring chip 508 .
  • the optical signal reflected by the medium interface 417 may also be incident on the sixth optical surface 421 at a certain angle. At this time, the optical signal reflected by the medium interface 417 is slightly refracted on the sixth optical surface 421 and enters the optical monitoring chip 508 .
  • the included angle between the sixth optical surface 421 and the circuit board 300 is not fixed, as long as the optical signal reflected by the medium interface 417 does not undergo total reflection at the sixth optical surface 421 .
  • the lens assembly 400 includes a dispensing slot 470 .
  • the glue dispensing groove 470 is disposed on the connecting portion 412 , and the glue dispensing groove 470 communicates with the connecting hole 480 . In this way, it is convenient to inject glue into the connection hole 480 through the glue dispensing groove 470 , so that the ferrule 800 is fixed in the connection hole 480 .
  • connection hole 480 After the ferrule 800 is inserted into the connection hole 480 , it moves toward the lens body 415 along the connection hole 480 . After the end face of the ferrule 800 close to the lens main body 415 is in contact with the limiting surface 460, glue can be injected into the connection hole 480 through the glue dispensing groove 470, so that the glue is coated on the outer surface of the ferrule 800, so that the insert can be fixed by the glue. The outer surface of the core 800 is fixed on the inner side of the connection hole 480 , thereby fixing the ferrule 800 in the connection hole 480 .
  • the glue dispensing slot 470 includes a first glue dispensing slot 4701 and a second glue dispensing slot 4702 oppositely disposed along a direction perpendicular to the circuit board 300 .
  • the opening of the first glue dispensing groove 4701 faces upward, and the opening of the second glue dispensing groove 4702 faces downward.
  • the optical signal collimated by the first sub-lens 4111 can be divided into optical signals in different directions.
  • a part of the optical signal passes through the medium interface 417 and is transmitted to the optical sheet 490 .
  • Another part of the optical signal is reflected at the medium interface 417 , and the reflected optical signal is transmitted to the optical monitoring chip 508 , so as to realize the spectroscopic monitoring of the optical signal. Therefore, some embodiments of the present disclosure realize light splitting through the medium interface 417 in the lens assembly 400, and complete the split monitoring and transmission of dual-wavelength optical signals in a single channel without adding an additional splitting device, thereby improving the optical module. 200 stability.
  • the lens assembly 400 includes the above-mentioned lens body 415 , connecting portion 412 , first groove 401 , second groove 410 , first lens 411 , second lens 413 , In addition to the connection hole 480 , the installation hole 450 , the ferrule 800 , the connection fiber 801 and the glue slot 470 , the lens assembly 400 further includes a reflector 430 .
  • the mirror 430 is disposed at the bottom of the first groove 401 , and the mirror 430 is disposed above the first lens 411 .
  • the orthographic projection of the mirror 430 on the circuit board 300 overlaps with the orthographic projection of the first lens 411 on the circuit board 300 .
  • the mirror 430 is configured to reflect the optical signal collimated by the first lens 411 to the second lens 413 or reflect the optical signal collimated by the second lens 413 to the first lens 411 .
  • the optical chip 500 corresponding to the first lens 411 is a light emitting chip 501
  • the optical signal emitted by the light emitting chip 501 is collimated by the first lens 411 and then enters the reflector 430, and It is reflected by the mirror 430 to the second lens 413 .
  • the optical signal reflected by the mirror 430 is parallel to the circuit board 300 .
  • the optical chip 500 corresponding to the first lens 411 is the light receiving chip 502
  • the optical signal from the outside is collimated by the second lens 413 and then enters the reflector 430, and is reflected by the reflector 430 to the first lens 411. Then, the light signal reflected by the mirror 430 is converged to the light receiving chip 502 through the first lens 411 .
  • the lens assembly 400 further includes a fifth groove 4101 .
  • the fifth groove 4101 is disposed in the second groove 410
  • the first lens 411 is disposed in the fifth groove 4101 .
  • the connecting optical fiber 801 includes a first optical fiber surface 8011 and a second optical fiber surface 8012 .
  • the first fiber surface 8011 and the second fiber surface 8012 are arranged opposite to each other along the central axis of the ferrule 800 .
  • the first fiber surface 8011 is close to the lens body 415 , and the angle between the first fiber surface 8011 and the second fiber surface 8012 is a predetermined angle A.
  • the second fiber plane 8012 is perpendicular to the circuit board 300 .
  • the preset angle A is any value between 3° and 13°.
  • the preset angle A is 3°, 5°, 8°, 11° or 13° and so on.
  • the light emitting chip 501 emits a light signal perpendicular to the circuit board 300 .
  • the optical signal is collimated by the first lens 411 and then enters the mirror 430 .
  • the optical signal incident on the mirror 430 is reflected by the mirror 430 to the second lens 413 , and after being converged by the second lens 413 , it is transmitted to the first fiber surface 8011 of the connecting fiber 801 .
  • the media on both sides of the first fiber surface 8011 are different.
  • a part of the optical signal is reflected at the first optical fiber surface 8011 , and the optical signal reflected by the first optical fiber surface 8011 is reflected to other places except the light emitting chip 501 according to the inclination angle of the first optical fiber surface 8011 .
  • Another part of the optical signal enters the inner optical fiber 603 through the first optical fiber surface 8011 , and finally transmits to the outer optical fiber 101 through the inner optical fiber 603 , thereby realizing the emission of the optical signal.
  • the connecting fiber 801 in the ferrule 800 may also be part of the inner fiber 603 .
  • the inner optical fiber 603 is inserted into the ferrule 800 , and the end surface of the inner optical fiber 603 close to the second lens 413 coincides with the end surface of the ferrule 800 close to the second lens 413 . Then, the ferrule 800 wrapping the inner optical fiber 603 is installed in the connection hole 480 , so that the end face of the ferrule 800 close to the second lens 413 contacts the limiting surface 460 . Finally, inject glue into the connection hole 480 to fix the ferrule 800 and the internal optical fiber 603 in the connection hole 480 .
  • the end surface of the ferrule 800 close to the limiting surface 460 is parallel to the first fiber surface 8011 .
  • the end surface of the ferrule 800 close to the limiting surface 460 and the first optical fiber surface 8011 can be cut into oblique surfaces, which is convenient for processing.
  • the end surface of the ferrule 800 close to the limiting surface 460 may be perpendicular to the plane of the circuit board 300 , so that the end surface is in contact with the limiting surface 460 .
  • the first optical fiber surface 8011 connecting the optical fiber 801 is still an inclined plane.
  • the ferrule 800 is pre-set in the connection hole 480, and the first fiber surface 8011 of the connection fiber 801 is set as an inclined plane. Therefore, when the optical signal converged by the second lens 413 is incident on the first optical fiber surface 8011, the optical signal reflected by the first optical fiber surface 8011 due to the change of the medium may be incident on other places except the light emitting chip 501, It is avoided that the optical signal reflected by the first optical fiber surface 8011 returns to the light emitting chip 501 along the original path and interferes with it, thereby reducing the influence of the reflected optical signal on the light emitting chip 501 .
  • the problem of reflection interference between the first optical fiber surface 8011 and the second lens 413 in the connection hole 480 is solved by setting the first optical fiber surface 8011 as an inclined surface when docking with the client.
  • the present disclosure is not limited thereto.
  • the lens assembly 400 may not include the second lens 413 .
  • the lens assembly 400 includes a first reflective mirror 4310 , a second reflective mirror 4320 and a reflective converging lens 4330 .
  • the first reflecting mirror 4310 , the second reflecting mirror 4320 and the reflecting and converging lens 4330 are all disposed at the bottom of the first groove 401 .
  • the first mirror 4310 is disposed above the first lens 411 and configured to reflect the optical signal collimated by the first lens 411 as an optical signal parallel to the circuit board 300 .
  • the second reflective mirror 4320 is disposed on a side of the first reflective mirror 4310 close to the connection hole 480 , and is located on an optical path between the first reflective mirror 4310 and the reflecting and converging lens 4330 .
  • the second mirror 4320 is configured to reflect the optical signal from the first mirror 4310 to the reflective converging lens 4330 .
  • the reflecting and converging lens 4330 is disposed on the optical path between the second reflecting mirror 4320 and the connecting hole 480 , and the central axis of the reflecting and converging lens 4330 coincides with the central axis of the connecting hole 480 .
  • the reflective converging lens 4330 is configured to reflect the optical signal from the second reflective mirror 4320 and converge the optical signal to the connecting optical fiber 801 .
  • a third gap 93 (a dotted line frame as shown in FIG. 18 ) between the first fiber surface 8011 of the connecting optical fiber 801 and the reflection converging lens 4330 close to the reflection converging lens 4330, and the third gap 93 is filled with optical glue. .
  • the refractive index of the optical glue is approximately the same as that of the connecting optical fiber 801
  • the optical signal converged by the reflective converging lens 4330 passes through the optical glue and enters the connecting optical fiber 801
  • there is no medium change the optical signal does not reflect at the first optical fiber surface 8011 , thereby preventing the optical signal from being reflected back to the light emitting chip 501 and causing interference to it.
  • the first fiber surface 8011 can be set as an inclined plane relative to the second fiber surface 8012, or the first fiber surface 8011 can also be The plane perpendicular to the circuit board 300 is not limited in the present disclosure.
  • optical glue is filled between the first fiber surface 8011 and the second lens 413 of the connecting fiber 801, so that there is no medium change between the first fiber surface 8011 and the second lens 413, so that The optical signal converged by the reflective converging lens 4330 does not reflect when incident on the first optical fiber surface 8011 , which prevents the optical signal reflected by the first optical fiber surface 8011 from returning to the light emitting chip 501 and causing interference to it.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un module optique (200), comprenant un boîtier, une carte de circuit imprimé (300), une puce optique (500) et un ensemble lentille (400). La carte de circuit imprimé (300) est disposée dans le boîtier. La puce optique (500) est disposée sur la carte de circuit imprimé (300). La puce optique (500) comprend au moins une puce électroluminescente (501) et une puce de réception de lumière (502). L'ensemble lentille (400) est disposé sur la carte de circuit imprimé (300). Une cavité de réception recouvrant la puce optique (500) est formée entre l'ensemble lentille (400) et la carte de circuit imprimé (300), et l'ensemble lentille (400) est conçu pour modifier une direction de propagation d'un signal optique incident à l'ensemble lentille (400). L'ensemble lentille (400) comprend une partie de liaison (412) et un corps de lentille (415). L'ensemble lentille (400) comprend un ensemble de stabilisation, l'ensemble de stabilisation étant configuré pour stabiliser la transmission du signal optique incident à l'ensemble lentille.
PCT/CN2022/095067 2021-06-22 2022-05-25 Module optique WO2022267805A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202280007791.3A CN116897308A (zh) 2021-06-25 2022-05-25 光模块

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN202121393055.5 2021-06-22
CN202121393055.5U CN214795316U (zh) 2021-06-22 2021-06-22 一种光模块
CN202110710346.0A CN113484960A (zh) 2021-06-25 2021-06-25 一种光模块
CN202110710346.0 2021-06-25
CN202220297277.5U CN216526414U (zh) 2022-02-14 2022-02-14 一种光模块
CN202220297277.5 2022-02-14

Publications (1)

Publication Number Publication Date
WO2022267805A1 true WO2022267805A1 (fr) 2022-12-29

Family

ID=84544093

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/095067 WO2022267805A1 (fr) 2021-06-22 2022-05-25 Module optique

Country Status (1)

Country Link
WO (1) WO2022267805A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116755199A (zh) * 2023-06-19 2023-09-15 长芯盛（武汉）科技有限公司 一种光组件、光电模组及安装方法、插头和有源线缆

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1761900A (zh) * 2003-03-14 2006-04-19 安捷伦科技有限公司 具有基于全内反射光学转向的集成双光路的小型全聚合物光学设备
US20150071593A1 (en) * 2012-03-28 2015-03-12 Enplas Corporation Optical receptacle and optical module comprising same
CN106597616A (zh) * 2017-02-23 2017-04-26 青岛海信宽带多媒体技术有限公司 一种光模块
CN110456467A (zh) * 2019-09-11 2019-11-15 青岛海信宽带多媒体技术有限公司 一种光模块
CN110651212A (zh) * 2019-08-13 2020-01-03 索尔思光电（成都）有限公司 一种多通道并行双向器件耦合装置
CN111694107A (zh) * 2019-03-13 2020-09-22 青岛海信宽带多媒体技术有限公司 一种光模块
CN112904493A (zh) * 2019-12-03 2021-06-04 青岛海信宽带多媒体技术有限公司 一种光模块
CN113484960A (zh) * 2021-06-25 2021-10-08 青岛海信宽带多媒体技术有限公司 一种光模块
CN214795316U (zh) * 2021-06-22 2021-11-19 青岛海信宽带多媒体技术有限公司 一种光模块
CN216526414U (zh) * 2022-02-14 2022-05-13 青岛海信宽带多媒体技术有限公司 一种光模块

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1761900A (zh) * 2003-03-14 2006-04-19 安捷伦科技有限公司 具有基于全内反射光学转向的集成双光路的小型全聚合物光学设备
US20150071593A1 (en) * 2012-03-28 2015-03-12 Enplas Corporation Optical receptacle and optical module comprising same
CN106597616A (zh) * 2017-02-23 2017-04-26 青岛海信宽带多媒体技术有限公司 一种光模块
CN111694107A (zh) * 2019-03-13 2020-09-22 青岛海信宽带多媒体技术有限公司 一种光模块
CN110651212A (zh) * 2019-08-13 2020-01-03 索尔思光电（成都）有限公司 一种多通道并行双向器件耦合装置
CN110456467A (zh) * 2019-09-11 2019-11-15 青岛海信宽带多媒体技术有限公司 一种光模块
CN112904493A (zh) * 2019-12-03 2021-06-04 青岛海信宽带多媒体技术有限公司 一种光模块
CN214795316U (zh) * 2021-06-22 2021-11-19 青岛海信宽带多媒体技术有限公司 一种光模块
CN113484960A (zh) * 2021-06-25 2021-10-08 青岛海信宽带多媒体技术有限公司 一种光模块
CN216526414U (zh) * 2022-02-14 2022-05-13 青岛海信宽带多媒体技术有限公司 一种光模块

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116755199A (zh) * 2023-06-19 2023-09-15 长芯盛（武汉）科技有限公司 一种光组件、光电模组及安装方法、插头和有源线缆

Similar Documents

Publication Publication Date Title
US7539367B2 (en) Optical system connection structure, optical component, and optical communication module
US9377594B2 (en) Two-dimensional, high-density optical connector
CN116897308A (zh) 光模块
JP2010122311A (ja) レンズブロック及びそれを用いた光モジュール
WO2022267805A1 (fr) Module optique
US11841539B2 (en) Optical module
CN115097579A (zh) 光模块
WO2023035711A1 (fr) Module optique
CN216526414U (zh) 一种光模块
US20230418006A1 (en) Optical module
CN217606135U (zh) 光模块
US20230421262A1 (en) Optical module
CN217606136U (zh) 光模块
CN217521402U (zh) 光模块
CN214795316U (zh) 一种光模块
CN114895411A (zh) 光模块
WO2021232862A1 (fr) Module optique
WO2024098945A1 (fr) Module optique
WO2024093070A1 (fr) Module optique
WO2023240890A1 (fr) Module optique
WO2024066202A1 (fr) Module optique
WO2023184922A1 (fr) Module optique
WO2022193933A1 (fr) Module optique
WO2022183800A1 (fr) Module optique
WO2024066093A1 (fr) Module optique

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22827302

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 202280007791.3

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE