WO2022260355A1 - Feuille d'isolation pour source de lumière d'affichage, et module de source de lumière d'isolation, unité de rétroéclairage d'isolation et dispositif d'affichage la comprenant - Google Patents

Feuille d'isolation pour source de lumière d'affichage, et module de source de lumière d'isolation, unité de rétroéclairage d'isolation et dispositif d'affichage la comprenant Download PDF

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Publication number
WO2022260355A1
WO2022260355A1 PCT/KR2022/007890 KR2022007890W WO2022260355A1 WO 2022260355 A1 WO2022260355 A1 WO 2022260355A1 KR 2022007890 W KR2022007890 W KR 2022007890W WO 2022260355 A1 WO2022260355 A1 WO 2022260355A1
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Prior art keywords
heat
light source
heat insulating
sheet
led elements
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PCT/KR2022/007890
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English (en)
Korean (ko)
Inventor
서인용
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주식회사 아모그린텍
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Publication of WO2022260355A1 publication Critical patent/WO2022260355A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133317—Intermediate frames, e.g. between backlight housing and front frame
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means

Definitions

  • the present invention relates to a heat insulating sheet, and more particularly, to a heat insulating sheet for a display light source, a heat insulating light source module including the same, a backlight unit, and a display device.
  • the heat generated by the electronic device should be emitted to the outside, but this causes a problem that a lot of heat is sensed in the vicinity of the electronic device's housing or electronic device.
  • a typical example of such an electronic device is a display device.
  • Display devices are still being mass-produced with low-cost models, but on the other hand, as large-sized and high-performance are promoted, they are designed to have more pixels in a limited area. The number of light sources used is increasing.
  • the problem of high heat transferred from the backlight unit to the housing due to the LED device is expected to be further intensified.
  • the present invention has been devised in view of the above points, and heat is transferred from a plurality of LED elements, which are heating elements, to lower the heat generation level of the LED elements while minimizing the transfer of the received heat in the vertical direction, so that the heat is transferred to the upper part of the sheet.
  • An object of the present invention is to provide a heat insulating sheet capable of minimizing or preventing conduction or radiation, and for example, to provide a heat insulating sheet suitable for application to a display light source.
  • a plurality of LED elements constituting a light source of a display are provided on the opposite surface of the mounting surface of the circuit board mounted at a predetermined interval, so that the plurality of LED elements
  • a heat insulating sheet for a display light source to block the transfer of generated heat in a direction perpendicular to the opposite surface, a member attached to the opposite surface of the circuit board mounting surface, and a hotspot having an area larger than the mounting area of each LED element
  • a heat spreading member including a substrate for forming a substrate and an adhesive layer disposed on both sides of the substrate; It is disposed on the heat spreading member, includes first and second surfaces facing each other in the thickness direction, and transfers heat toward the first surface adjacent to the heat spreading member from the first surface to the second surface.
  • a heat insulating member which is a graphite sheet having a thickness set in consideration of the distance between LED elements and the calorific value of the LED elements, in order to minimize overlap due to redundancy and to accumulate the heat received inside as much as possible in the thickness direction; And it provides a heat insulating sheet for a display light source comprising a protective member disposed on the second surface of the heat insulating member.
  • the heat insulating member may include at least one graphite sheet selected from natural graphite sheets and artificial graphite sheets.
  • the heat insulating member may have a thickness of 20 to 500 ⁇ m.
  • the heat insulating member may be natural graphite having a thickness of 90 to 300 ⁇ m.
  • the substrate may be metal foil or artificial graphite.
  • the plane-direction thermal conductivity of the substrate may be smaller than that of the graphite sheet.
  • each of the protection member and the heat spreading member are formed to be greater than the length and width of the heat insulating member so that four sides parallel to the thickness direction of the heat insulating member are sealed through the protection member and the heat spreading member.
  • a plurality of LED elements constituting a light source of the display are provided on the opposite side of the mounting surface of the circuit board mounted at a predetermined interval, so that the heat generated from the plurality of LED elements
  • a heat insulating sheet for a display light source to block transmission in a direction perpendicular to the opposite surface, as a member attached to the opposite surface of the circuit board mounting surface, to form a hot spot with an area larger than the mounting area of each LED element a heat spreading member including a substrate for use and a first adhesive layer disposed on both sides of the substrate; It is disposed on the heat spreading member, includes first and second surfaces facing each other in the thickness direction, and transfers heat toward the first surface adjacent to the heat spreading member from the first surface to the second surface.
  • the heat is preferentially moved in the surface direction rather than the thickness direction to minimize heat transfer from the second surface toward the direction perpendicular thereto, and to spread the heat transferred from the plurality of LED elements in the surface direction.
  • a heat insulating member which is a graphite sheet having a thickness set in consideration of the distance between LED elements and the calorific value of the LED elements, in order to minimize overlap due to redundancy and to accumulate the heat received inside as much as possible in the thickness direction; a member attached to the heat insulating member, including a metal substrate for spreading and internally accumulating heat transferred from the heat insulating member, and a second adhesive layer disposed on both sides of the metal substrate; and a protective member attached to one adhesive layer of the heat accumulating member.
  • the heat insulating member may include at least one graphite sheet selected from natural graphite sheets and artificial graphite sheets.
  • the heat insulating member may have a thickness of 20 to 500 ⁇ m.
  • the heat insulating member may be natural graphite having a thickness of 90 to 300 ⁇ m.
  • the substrate may be metal foil or artificial graphite.
  • the surface direction thermal conductivity of any one or both of the substrate and the metal substrate may be smaller than that of the graphite sheet.
  • the substrate and the metal substrate each independently include at least one of an aluminum foil and a copper foil
  • the graphite sheet may be a natural graphite sheet.
  • the substrate and the metal substrate may each independently have a thickness of 7 to 75 ⁇ m
  • the first adhesive layer and the second adhesive layer may each independently have a thickness of 7 to 55 ⁇ m.
  • each of the protection member, the heat accumulation member, and the heat spreading member are determined so that the four sides parallel to the thickness direction of the heat insulating member are sealed through the protection member, the heat accumulation member, and the heat spreading member. It can be formed larger than the length and width of.
  • the graphite sheet is to minimize overlapping with each other after heat transferred from one LED element and another LED element disposed adjacent to it is transferred in the plane direction, respectively
  • a ratio (a/b) of thermal conductivity (a) in the plane direction to thermal conductivity (b) in the thickness direction may be 100 or less.
  • the protective member is a protective film containing at least one selected from the group consisting of polyimide, polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and an adhesive layer for fixing to the heat insulating member is provided on one surface of the protective film.
  • P PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • an adhesive layer for fixing to the heat insulating member is provided on one surface of the protective film. can include more.
  • the protective member may have a thickness of 50 to 200 ⁇ m.
  • the heat spreading member may further include a release film on a surface opposite to one surface in contact with the heat insulating member.
  • the present invention relates to a circuit board, a plurality of LED elements mounted on one surface of the circuit board at a predetermined interval from each other, and a heat spreading member disposed on the opposite surface of the circuit board to the present invention.
  • a heat insulating light source module including a heat insulating sheet for a display light source according to the present invention.
  • the plurality of LED devices may be mini LED devices or micro LED devices.
  • one sheet or several sheets of the heat insulating sheet for the display light source may be disposed to cover the opposite surface corresponding to the positions of the plurality of LED elements.
  • the present invention provides an adiabatic light source module according to the present invention and an adiabatic backlight unit including a plurality of optical sheets disposed on a light exit surface of the light source module.
  • a lower case accommodating part or all of the side surface of the heat insulating light source module and one surface of the heat insulating sheet in the heat insulating light source module, wherein an air layer is formed between the heat insulating sheet and the lower case. may be spaced apart.
  • the present invention provides a liquid crystal display device having a heat insulating backlight unit according to the present invention and a liquid crystal display panel disposed on a light exit surface of the heat insulating backlight unit.
  • the present invention provides a light emitting display device including the adiabatic light source module according to the present invention.
  • the LED element included in the adiabatic light source module is an LED element emitting white, UV, or blue light, and further includes a color conversion unit disposed on a path of light emitted from the adiabatic light source module. can do.
  • the plurality of LED elements included in the adiabatic light source module may include LED elements emitting red, green, and blue light.
  • the heat insulating sheet according to the present invention can receive heat generated from a plurality of LED elements used as display light sources and reduce the heat generation level of the LED elements while minimizing the transfer of the received heat in the vertical direction, so that it can be directed in an unwanted direction and/or Alternatively, as it is advantageous to minimize or prevent the transfer of heat in an amount, it is very suitable for blocking heat generated from a plurality of LED elements from being transferred to the housing.
  • the heat insulating sheet according to an embodiment of the present invention can prevent dust that may occur due to damage or destruction of the inner layer of the heat insulating sheet from scattering, thereby preventing malfunction or damage to the display device due to dust. It can be widely applied to all kinds of display devices.
  • FIG. 1 to 3b are schematic cross-sectional views of various embodiments of a heat insulating sheet according to a first embodiment of the present invention
  • FIGS. 4 and 5 are cross-sectional schematic views of various embodiments of a heat insulating sheet according to a second embodiment of the present invention.
  • FIG. 6 is a perspective view of a heat insulating light source module employing a heat insulating sheet according to an embodiment of the present invention
  • FIG. 7 and 8 are cross-sectional schematic diagrams showing the movement path of heat transferred from a plurality of LED elements, which are heating elements, in a cross section along the XX' boundary line and the Y-Y' boundary line of FIG. 6;
  • FIGS. 9 and 10 are exploded perspective views of a heat insulating light source module according to various embodiments of the present invention, and are views showing that the heat insulating sheet is provided by being divided into a plurality of sheets;
  • FIG. 11 is an exploded perspective view of an adiabatic backlight unit according to an embodiment of the present invention.
  • FIG. 12 is an exploded perspective view of a liquid crystal display device according to an embodiment of the present invention.
  • FIG. 13 is a photograph of a circuit board on which a micro LED used in an experimental example of the present invention is mounted.
  • Insulation sheet according to the present invention is provided on the opposite surface of a mounting surface of a circuit board on which a plurality of LED elements constituting a light source of a display are mounted at predetermined intervals, so that heat generated from the plurality of LED elements is perpendicular to the opposite surface. It is a heat insulation sheet for display light sources to block transmission in one direction.
  • the heat insulating sheet 101 includes a heat insulating member 110 including a first surface and a second surface facing each other in the thickness direction, the heat insulating member (110) a protective member 130 provided on the second surface and a heat spreading member 120 provided on the first surface of the heat insulating member 110.
  • the heat insulating member 110 moves the heat transferred toward the first surface through the heat spreading member 120 adjacent to the LED element in the thickness direction toward the second surface from the first surface and in the surface direction perpendicular to the thickness direction.
  • the heat insulating member 110 is implemented as a graphite sheet.
  • the heat reaching the first surface of the heat insulating member 110 from the plurality of LED elements, which are hot spots, through the heat spreading member 120 is perpendicular to the thickness direction. Due to the thermal conductivity of the heat insulating member 110 that is predominantly expressed in the surface direction, more heat is moved in the surface direction than in the thickness direction until the heat capacity of the heat insulating member 110 is saturated. This heat conduction tendency minimizes or prevents heat transfer from the second surface of the heat insulating sheet 100 toward the direction perpendicular thereto by minimizing heat movement from the first surface of the heat insulating member 110 in the thickness direction toward the second surface. It exhibits a heat dissipation effect that reduces the temperature of the LED element for the LED element, which is a heating element, while expressing an insulation effect that
  • the heat insulating member 110 minimizes overlap due to surface-direction spreading of heat transferred from a plurality of LED elements, which are hot spots, and transfers the heat received as much as possible in the thickness direction to accumulate in the heat insulating member. It has a thickness set in consideration of the calorific value of the LED element, and through this, the heat insulating sheet can achieve a minimum increase in thickness for improving the heat insulating effect, and the use of an excessively thick graphite sheet is prevented, so a backlight unit equipped with a heat insulating sheet It is advantageous to create a spaced space in which an air layer is formed between the heat insulating sheet and the lower case, and as the heat insulation effect due to the air layer increases, transfer of heat from the backlight unit to the lower case can be minimized.
  • the heat superposition according to the surface-direction spreading of the heat transferred from the plurality of LED elements will be described in detail, the first LED element 221, the second LED element 222, and the third LED element 223
  • the heat generated from ) reaches the heat spreading member 232 via the circuit board 210, and the heat transferred from the substrate 232a within the heat spreading member 232 is primarily spread in the plane direction. This forms a hot spot with an area larger than the mounting area of the LED element, and a portion of the heat is spread in the plane direction while the remaining heat is transmitted in the vertical direction to reach the first surface of the heat insulating member 231.
  • the heat reaching the heat insulating member 231 spreads more rapidly in the surface direction than in the thickness direction due to heat conduction characteristics that are superior to the surface direction than the thickness direction of the heat insulating member 231 .
  • the ratio of the thermal conductivity in the surface direction to the thermal conductivity in the thickness direction is smaller than that of the artificial graphite sheet.
  • the remaining heat is spread in the plane direction, resulting in a plane-direction spreading (H xy1 ) of the heat derived from the first LED element 221 and the plane of the heat derived from the second LED element 222.
  • the overlap (A) between directional spreading (H xy2 ) may be minimized.
  • the heat insulating member 231 may have an appropriate thickness to have a sufficient heat capacity in consideration of the distance between LED elements and the amount of heat generated by the LED elements, and the substrate 232a also has an appropriate thickness so that the heat insulating member 231 It can help keep the insulation effect and exert the heat dissipation effect.
  • the thickness of the heat insulating member (110,231) may be set in the range of 20 to 500 ⁇ m, for example, if the thickness is less than 20 ⁇ m, the time to express the heat insulation effect for a lot of heat generated from a plurality of LED elements is shortened enough It may be difficult to express the insulation effect.
  • the thickness exceeds 500 ⁇ m, the thermal capacity increases, which is advantageous in improving the heat dissipation effect of the LED device and the insulation effect due to the insulation sheet, but in the case of an artificial graphite sheet, it is not easy to manufacture with such a thickness.
  • the thermal conductivity in the thickness direction can be significantly reduced.
  • the heat conduction in the plane direction is relatively more dominant, and the heat derived from each adjacent LED element is transferred to the plane direction, resulting in more overlapping. It occurs quickly, and as the overlapped heat is not properly transferred from the first surface to the second surface of the heat insulating member 110, the heat generated from the LED element is not smoothly moved and the heat dissipation performance of the LED element may be reduced. .
  • damage such as cracks may occur in the heat insulating member when applied to a surface having a curvature or step, and the damage may reduce heat radiation and/or heat insulation effect.
  • due to scattering of dust generated by the damage there is a risk of causing electrical shorts to nearby electric and electronic components.
  • peeling and lifting may occur at interfaces between various members constituting the insulating sheet.
  • the heat insulating member 110 or 231 is implemented as a graphite sheet, and may be a single graphite sheet or a plurality of graphite sheets stacked. In this case, when the heat insulating member 110 or 231 is made of a single graphite sheet, the thermal conductivity of the heat insulating member 110 or 231 may be that of a single graphite sheet. However, when the heat insulating members 110 and 231 are in the form of stacking several graphite sheets or include other layers such as adhesive layers in addition to the graphite sheets, the heat conduction characteristics of the heat insulating members 110 and 231 described above are satisfied as the entire heat insulating member combined. it's free if you do
  • the graphite sheet which is the heat insulating member 110, has a thickness to minimize overlapping with each other after heat transferred from one LED element and each of the other LED elements disposed adjacent to it is transferred in the plane direction, respectively.
  • the ratio (a/b) of the thermal conductivity (a) in the plane direction to the directional thermal conductivity (b) is 100 or less, in another example, 90 or less, 80 or less, 70 or less, 60 or less, 50 or less, or 40 or less.
  • the ratio (a/b) of the thermal conductivity (a) in the plane direction to the thermal conductivity (b) in the thickness direction may be 20 or more, in another example, 30 or more.
  • the graphite sheet may specifically include a natural graphite sheet, an artificial graphite sheet, and/or a multilayer graphene sheet.
  • a graphite sheet In order to conduct or radiate heat from the second surface of the heat insulating member to the upper direction perpendicular to the surface while receiving the heat generated from the plurality of LED elements rapidly and moving in the thickness direction at an appropriate speed and in an appropriate amount, a graphite sheet The graphite sheet needs to be thicker than a predetermined thickness while the ratio between the thermal conductivity in the thickness direction and the thermal conductivity in the plane direction is appropriate.
  • the thermal conductivity in the plane direction is too large compared to the thermal conductivity in the thickness direction, so the heat received from the plurality of LEDs spreads in the plane direction and quickly reaches thermal overlap, whereas, for example, a certain thickness
  • a thickness exceed 50 ⁇ m, or 60 ⁇ m, 70 ⁇ m or 80 ⁇ m, and even if it can be manufactured, the unit price is very high and it is difficult to use it. Can be difficult to hold.
  • the heat insulating member 231 When the overlap of heat in the surface direction within the heat insulating member 231 increases, the heat insulating member 231 is difficult to accept heat from the heat spreading member 232 any longer, whereas the amount of heat moving in the thickness direction is small, so that the LED elements 221,222,223 It may be difficult to continuously receive the generated heat, so that it may be difficult to achieve a desired level of heat dissipation effect.
  • the graphite sheet may include a natural graphite sheet.
  • natural graphite commercially available graphite or graphite referred to as natural graphite may be used without limitation, and thus a detailed description thereof is omitted in the present invention.
  • the thickness of the heat insulating member is preferably 90 ⁇ m or more, for example, 300 ⁇ m or less. When the thickness exceeds 300 ⁇ m, the heat dissipation effect may deteriorate.
  • the heat spreading members 120 and 232 are members attached to the surface opposite to the mounting surface of the circuit board, and include the substrates 122 and 232a and the substrates 122 and 232a for forming a hotspot with an area larger than the mounting area of each LED device. It is a double-sided adhesive member including first adhesive layers 121 and 123 on both sides.
  • the heat spreading members 120 and 232 are important members in terms of heat dissipation/insulation performance and reliability of the insulation sheet.
  • the heat spreading members 120 and 232 are members located closest to the hot spot among the members in the insulation sheets 101 and 230, and the insulation sheet must be stably attached to one surface of the circuit board in a high-temperature attachment environment, It is necessary to maintain a stable attachment state even on an attachment surface with a curvature or step difference.
  • the base material 122, 232a is provided, the attachment state is stably maintained against a high temperature and uneven attachment surface in preparation for a case consisting only of an adhesive layer. advantageous to do
  • the heat insulating sheets 101 and 230 include a graphite sheet having excellent electrical conductivity as the heat insulating member 110 and 231 , and scattering of dust from the graphite sheet prevents the device from being dispersed in the electrical and electronic devices provided with the heat insulating sheets 110 and 230 .
  • Electrical reliability that does not affect the device is important because it may cause malfunction or failure.
  • it is preferable that the four sides of the heat insulating members 110 and 231 are sealed so as to be surrounded, as shown in FIGS. 2 to 3B.
  • heat (H) of the LED element 224 which is a hot spot due to the thermal conductivity of the substrate 232a, is primarily transferred to the heat spreading member 232 before being transferred to the heat insulating member 231. It may be moved in a surface direction perpendicular to the thickness direction of the inner substrate 232a.
  • the area of the hot spot formed on the substrate 232a based on the heat insulating member 231 (S 2 ) is larger than the mounting area (S 1 ) of the LED element, and thereby the heat insulating member ( 231)
  • the heat reaching the first surface can be transferred faster and more in the direction perpendicular to the thickness direction of the heat insulating member 231, and is relatively transferred in the thickness direction from the first surface to the second surface. Calories may be further reduced.
  • heat can be transferred more quickly and more from the LED element 224, so that the heat dissipation effect is improved, while the heat transferred from the second surface of the insulating sheet 230 toward the direction perpendicular to the second surface is further reduced. Therefore, an improved insulation effect can be expressed.
  • the substrates 122 and 232a may be made of a material having excellent thermal conductivity in the plane direction.
  • a conductive polymer film, a metal foil, an artificial graphite sheet, etc. may be used.
  • a polymer film such as a conductive polymer film is used, many Wrinkles are generated on the substrate by the high heat transmitted from the two LED elements, which causes lifting or peeling at the interface between the adhered surface and the heat spreading member 120, and between the heat spreading member 120 and the heat insulating member 110. There is a concern that high temperature reliability may be lowered.
  • metal foil or an artificial graphite sheet may be used as the substrates 122 and 232a.
  • metal foil what is commonly referred to as metal foil in the art may be used without limitation, and may be, for example, rolled foil, artificial foil, or electrolytic foil.
  • material of the metal foil is any one of copper foil, aluminum foil, silver foil, nickel foil and gold foil, or an alloy containing two or more of these, two or more of these are mixed or two of them are laminated in separate layers It may be a metal foil.
  • the graphite sheet when it is a natural graphite sheet, it may include at least one of a copper foil and an aluminum foil, and more preferably, considering the thermal conductivity of the graphite sheet in the plane direction in terms of the heat dissipation / insulation effect of the insulation sheet, the surface direction It may be advantageous to select a metal foil with low thermal conductivity. Specifically, the thermal conductivity of copper foil is greater than that of aluminum foil. If the thermal conductivity of the graphite sheet in the plane direction is smaller than that of the copper foil but greater than the thermal conductivity of the aluminum foil, aluminum foil is used rather than copper foil as the metal foil. The use case may be superior in heat dissipation and insulation effect, and through these results, it can be seen that the substrate in the heat spreading member does not achieve greater heat dissipation and insulation effect simply because the thermal conductivity is excellent.
  • the thermal conductivity in the plane direction of the substrates 122 and 232a may be smaller than the thermal conductivity in the plane direction of the graphite sheet serving as the heat insulating member 110 and 231.
  • the substrates 122 and 232a must have a predetermined thermal conductivity in the plane direction in order to form a hotspot with an area larger than the mounting area of the LED device, for example, 100 W/m K or more, preferably may be greater than or equal to 200 W/m ⁇ K.
  • the substrates 122 and 232a minimize overlapping due to surface-direction spreading of heat transferred from a plurality of LED devices and accumulate the heat transferred as much as possible in the thickness direction, the distance between LED devices, the amount of heat generated by the LED devices, and the heat insulation. It may have a thickness set in consideration of the thickness of the member. For example, the substrates 122 and 232a may have a thickness of 7 to 75 ⁇ m, preferably 10 to 70 ⁇ m.
  • the thickness of the substrate (122,232a) is less than 7 ⁇ m, the desired level of heat dissipation characteristics cannot be expressed and tearing may occur, and if the thickness exceeds 75 ⁇ m, it is difficult to thin the insulation sheet and the flexibility is lowered Depending on the bending, interlayer lifting and peeling may occur, which may reduce reliability.
  • the substrates 122 and 232a may have a predetermined surface roughness by forming irregularities on the surface in order to improve adhesion characteristics with the adhesive layer disposed on both surfaces, but is not limited thereto.
  • first adhesive layers 121 and 123 for attaching the heat insulating sheet to the adhered surface and fixing the heat insulating members 110 and 231 are provided.
  • any adhesive layer commonly used in the art may be used without limitation, and preferably, acrylic resin, urethane resin, epoxy resin, silicone rubber, acrylic rubber, carboxyl nitrile elastomer, phenoxy and It may be formed of an adhesive layer forming composition including an adhesive component having at least one selected from the group consisting of polyimide resin, more preferably an acrylic resin, and even more preferably an acrylic resin having heat resistance.
  • the adhesive layer forming composition may further include a curing agent when the adhesive component is a curable resin, and may further include additives such as a curing accelerator depending on the purpose.
  • the curing agent can be used without limitation as long as it is a curing agent commonly used in the art, preferably an epoxy-based curing agent, a diisocyanate-based curing agent, a secondary amine-based curing agent, a tertiary amine-based curing agent, a melamine-based curing agent, an isocyanate-based curing agent It may include at least one selected from the group consisting of a curing agent and a phenol-based curing agent, more preferably an epoxy-based curing agent.
  • the first adhesive layer may further include a known heat radiation filler.
  • the first adhesive layer may have a thickness of 7 to 55 ⁇ m, preferably 10 to 50 ⁇ m. If the thickness of the first adhesive layer is less than 7 ⁇ m, interlayer adhesion may be reduced, and if the thickness exceeds 55 ⁇ m, it is not preferable in terms of thinning, and considering the limited thickness of the insulation sheet 101, the heat insulation member (110,231) ) and/or as the thickness of the substrates 122 and 232a becomes relatively thin, heat dissipation and/or insulation properties may deteriorate.
  • a protective member 130 is provided on the opposite surface of the heat spreading members 120 and 232 disposed on the heat insulating members 110 and 231 .
  • the protective member 130 serves to physically and chemically protect the insulating sheet 100 .
  • the protective member 130 may be employed without limitation in the case of the protective member 130 of a conventional sheet.
  • the protective member 130 includes a protective layer 131, and the protective layer 131 may be an inorganic film, a nanofiber web, or a laminated inorganic film on a nanofiber web.
  • an inorganic porous film is provided as the protective layer 131.
  • a nanofiber web is provided as a protective member, a plurality of nanofiber webs are provided with a protective function. It has the advantage of being able to express the thermal insulation effect in the vertical direction through the pores of the
  • the inorganic porous film may be a film containing at least one selected from the group consisting of polyimide, polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).
  • the nanofiber web may be a nanofiber web formed of a known material such as urethane-based, fluorine-based, or polyacrylonitrile.
  • the nanofiber web may have a diameter of 1 ⁇ m or less, but is not limited thereto.
  • the protective layer 131 may have a thickness of 10 to 60 ⁇ m, preferably 13 to 45 ⁇ m, and more specifically, 20 to 30 ⁇ m. If the thickness is less than 10 ⁇ m, protective performance such as abrasion resistance may be deteriorated, and if the thickness exceeds 60 ⁇ m, it is undesirable in terms of thinning and flexibility may be deteriorated, which may cause delamination.
  • the protective member 130 may further include an adhesive layer 132 to be fixed on the heat insulating member 110 .
  • the adhesive layer 132 provided on the protective member 130 is the same as the description of the adhesive layer provided on the heat spreading members 120 and 232 described above, so a detailed description thereof will be omitted. It may be configured the same as or different from the adhesive layer.
  • the heat insulating sheet 102 includes a protective member 130 and a heat spreading member so that four sides parallel to the thickness direction of the heat insulating member 110 can be sealed through the protective member 130 and the heat spreading member 120.
  • Each length and width may be larger than each length and width of the heat insulating member 110 by a predetermined size (a).
  • each of the heat insulating member 110, the protective member 130, and the heat spreading member 120 may be appropriately changed in consideration of the size of the LED device, the area of the backlight unit, and the desired heat insulating performance.
  • the offset structure shown in FIG. 3B may be more excellent in reliability compared to the offset structure shown in FIG. 3A.
  • the heat insulating sheets 103 and 104 according to the second embodiment of the present invention will be described with reference to FIGS. 4 and 5 .
  • the heat insulating sheets 103 and 104 according to the second embodiment have a heat accumulating member 140 between the heat insulating member 110 and the protective member 130'.
  • the description of the heat spreading member 120, the heat insulating member 110, and the protective member 130' provided in the heat insulating sheets 103 and 104 is the heat insulating sheet according to the first embodiment ( 101,102) is the same as the description.
  • the thickness of the heat insulating member 110 and the base material 122 is set in consideration of the distance between the LED elements and the amount of heat generated by the LED elements, but in the second embodiment, the heat insulating member 110 in the heat insulating sheets 103 and 104, heat spreading Thicknesses of the substrate 122 in the member 120 and the metal substrate 142 in the heat accumulating member 140 may be set.
  • the heat accumulating member 140 since the heat accumulating member 140 is disposed on the heat insulating member 110, the heat accumulating member 140 receives the heat reaching the second surface of the heat insulating member 110 and accumulates the heat therein, thereby improving heat dissipation. And it is possible to achieve an insulation effect.
  • the heat accumulation member 140 includes a metal substrate 142 for spreading and internally accumulating heat transferred from the heat insulating member 110 and second adhesive layers 141 and 143 disposed on both sides of the metal substrate 142.
  • the heat transferred from the heat insulating member 110 is spread in the direction of the surface of the metal substrate 142 of the heat accumulating member 140, transferred in the thickness direction, and accumulated inside, thereby further improving the heat insulating performance and uniformity regardless of the point. It can be advantageous to achieve an insulating performance.
  • the metal substrate 142 may be used without limitation in the case of a substrate made of a known metal material, and may be, for example, rolled foil, artificial foil, or electrolytic foil.
  • the material of the metal substrate 142 is any one of copper foil, aluminum foil, silver foil, nickel foil, and gold foil, or an alloy containing two or more of these, two or more of these are mixed, or two or more are each layer It may be made of laminated metal foil.
  • the metal substrate may include at least one of copper foil and aluminum foil. It may be advantageous to select a metal substrate having a smaller plane direction thermal conductivity. Specifically, the thermal conductivity of the copper foil is greater than that of the aluminum foil. If the thermal conductivity of the selected graphite sheet in the plane direction is smaller than that of the copper foil but greater than the thermal conductivity of the aluminum foil, aluminum rather than using copper foil as a metal substrate The case of using foil may be superior in heat dissipation and insulation effect, and through these results, it can be seen that a greater insulation effect cannot be achieved simply because the metal substrate has excellent thermal conductivity.
  • the substrate and the metal substrate having a smaller thermal conductivity in the plane direction than the thermal conductivity in the plane direction of the graphite sheet.
  • any adhesive layer commonly used in the art may be used without limitation, and preferably, acrylic resin, urethane resin, epoxy resin, silicone rubber, acrylic rubber, carboxyl nitrile elastomer, phenoxy and It may be formed of an adhesive layer forming composition including an adhesive component having at least one selected from the group consisting of polyimide resin, more preferably an acrylic resin, and even more preferably an acrylic resin having heat resistance.
  • the adhesive layer forming composition may further include a curing agent when the adhesive component is a curable resin, and may further include additives such as a curing accelerator depending on the purpose.
  • the curing agent can be used without limitation as long as it is a curing agent commonly used in the art, preferably an epoxy-based curing agent, a diisocyanate-based curing agent, a secondary amine-based curing agent, a tertiary amine-based curing agent, a melamine-based curing agent, an isocyanate-based curing agent It may include at least one selected from the group consisting of a curing agent and a phenol-based curing agent, more preferably an epoxy-based curing agent.
  • the second adhesive layers 141 and 143 may further include a known heat radiation filler.
  • the second adhesive layers 141 and 143 may have a thickness of 7 to 55 ⁇ m, preferably 10 to 50 ⁇ m. If the thickness of the second adhesive layer is less than 7 ⁇ m, the interlayer adhesive strength may decrease, and if the thickness exceeds 55 ⁇ m, it is not preferable in terms of thinning, and considering the limited thickness of the heat insulating sheets 103 and 104, the heat insulating member 110 As the thickness of other members such as ) becomes relatively thin, heat dissipation and/or insulation properties may deteriorate.
  • the above-described heat insulation sheets 101, 102, 102', 103, and 104 may be implemented as an insulation light source module for a display.
  • the adiabatic light source module 200 includes a circuit board 210, a plurality of LED elements 220 mounted on one surface of the circuit board 210 at predetermined intervals from each other, and It is implemented by including the above-described heat insulating sheet 230 for a display light source disposed so that an adhesive member is positioned on the opposite side of one side of the circuit board.
  • the plurality of LED elements 220 may be arranged in a checkered pattern to implement a direct type light source.
  • the plurality of LED devices 220 may be mini LED devices or micro LED devices.
  • the mini LED device may have a length of each side exceeding 100 ⁇ m to 500 ⁇ m.
  • the micro LED device may be implemented with a length of each side of 100 ⁇ m or less.
  • the LED elements 211 , 212 , 213 , and 214 may be known LED materials and structures.
  • the LED elements 211, 212, 213, and 214 may be implemented with materials such as InGaN and GaN, for example, and may include an n-type semiconductor layer, a photoactive layer, and a p-type semiconductor layer, and may further include an electrode layer and the like.
  • the plurality of LED elements 220 may emit any one color in the visible light region, for example, blue or UV.
  • local dimming is a technology for controlling the brightness of an LED used as a backlight based on a configuration or characteristics of a screen, and is a technology that can dramatically improve a contrast ratio and reduce power consumption.
  • the brightness of the mini LED or micro LED corresponding to a dark screen is adjusted relatively dark to express dark colors, and the brightness of the mini LED or micro LED corresponding to a bright screen is relatively bright to obtain vivid colors.
  • mini LED devices may be provided on the circuit board, and for another example, 20,000 or more mini LED devices may be provided on the circuit board.
  • circuit board 210 may be a known circuit board used in a display light source module, and the present invention is not particularly limited thereto.
  • the heat insulation sheet 230 for a light source is disposed so as to be positioned on the opposite side of the surface on which the above-described plurality of LED elements 220 are mounted on the circuit board 210.
  • the heat insulating sheet 230 for the light source is disposed so as to cover the opposite surface corresponding to the position of the plurality of LED elements, or several sheets as shown in FIGS. 9 and 10 It is arranged to cover the surface to implement the light source module (200', 200").
  • several sheets of heat insulating sheet 230 for light source are arranged to cover the entire surface of the graphite sheet, which is the heat insulating member 110. Accordingly, in the case of a display device having a large area, it may be difficult to cover all of the opposite surface with a single insulating sheet, and accordingly, it may be designed to cover the opposite surface with several sheets of insulating sheet. can
  • the present invention includes the adiabatic backlight unit 300 and the liquid crystal display device 1000 having the aforementioned adiabatic light source modules 200, 200', and 200".
  • the adiabatic backlight unit 300 includes an adiabatic light source module 200 and several optical sheets 240 disposed on the emission surface of the adiabatic light source module 200. is implemented by In addition, an intermediate molding material 250 supporting and fixing the adiabatic light source module 200 and the optical sheet 240 and a lower case 260 accommodating the adiabatic light source module may be further provided.
  • the optical sheet 240 is for improving the intensity and direction of light supplied to the liquid crystal display panel 400 through the light source modules 200, 200', and 200", and is limited to known optical sheets used in display backlight units.
  • the optical sheet 240 may include a diffusion sheet 241, a prism sheet 242, and a reflective polarization sheet 243, each of which is an optical sheet commonly used in the art.
  • the optical sheet 240 may further include sheets performing other functions in addition to the diffusion sheet 241, the prism sheet 242, and the reflective polarizing sheet 243, or at least one of these sheets.
  • the optical sheet since the optical sheet may include a plurality of sheets of a specific type, and the stacking order of each sheet may vary according to the purpose, the present invention is not particularly limited thereto.
  • an air layer may be spaced between the insulating sheet 230 and the lower case 260 positioned on the opposite side of the light exit surface of the insulating backlight unit 300, and through this, the heat generated in the backlight unit A large amount of heat can be minimized from moving to the lower case side.
  • liquid crystal display panel 400 may be disposed on the light exit surface of the adiabatic backlight unit 300 described above to implement the liquid crystal display device 1000 .
  • the liquid crystal display device may further include an upper case 500 supporting a front edge of the liquid crystal display panel 400 .
  • the liquid crystal display panel 400 includes a color conversion film layer 410, a liquid crystal layer 430, and the liquid crystal layer 430, which convert light emitted from the adiabatic backlight unit 300 into a desired color, at upper and lower portions. It may include a lower substrate 420 and an upper substrate 440 supported by.
  • the color conversion film layer 410 may be used without limitation in the case of a color conversion film layer 410 employed in a known liquid crystal display device, and may be, for example, a fluorescence conversion film or a quantum dot conversion film.
  • the liquid crystal layer 430 may be a liquid crystal layer employed in a liquid crystal display device, and the present invention is not particularly limited thereto.
  • the color conversion film layer 410 has been described as one component of the liquid crystal display panel 400, it is not limited thereto, and the color conversion film layer 410 is an independent component of the liquid crystal display panel 400 and displays a liquid crystal display. Note that it can be provided on the panel.
  • the lower substrate 420 may include a plurality of pixel electrodes (not shown) and a plurality of thin film transistors (not shown) electrically connected to the pixel electrodes in a one-to-one correspondence. Each thin film transistor switches a driving signal provided to a corresponding pixel electrode.
  • the upper substrate 440 may include a common electrode (not shown) forming an electric field for controlling the alignment of the liquid crystal together with the pixel electrodes.
  • the adiabatic light source module of the present invention may also be implemented as a light-emitting display device.
  • the LED element included in the adiabatic light source module is an LED element emitting white, UV, or blue light, and further includes a color conversion unit disposed on a path of light emitted from the adiabatic light source module. Thus, a desired color may be displayed.
  • the plurality of LED elements included in the adiabatic light source module may include LED elements emitting red, green, and blue light.
  • a heat-resistant acrylic adhesive layer having a thickness of 10 ⁇ m and 30 ⁇ m was formed on both sides of a 25 ⁇ m thick aluminum foil substrate.
  • an artificial graphite sheet having a thickness of 25 ⁇ m (density of 2.1 g/cm 3 , surface direction thermal conductivity of 1400 to 1600 W/m ⁇ K, thickness direction thermal conductivity of 15 W/m ⁇ K) was prepared.
  • a black-coated PI film having a thickness of 40 ⁇ m having a heat-resistant acrylic adhesive layer having a thickness of 10 ⁇ m formed on one surface was prepared as a protective member.
  • a protective member and a heat spreading member were attached to both surfaces of the heat insulating member, and in the case of the heat spreading member, a thick adhesive layer was placed in contact with the heat insulating member to prepare a heat insulating sheet.
  • a heat insulating sheet was manufactured in the same manner as in Example 2, except that a heat accumulating member was disposed on the heat insulating member and a protective member was disposed on the heat accumulating member.
  • a heat-resistant acrylic adhesive layer having a thickness of 10 ⁇ m and 30 ⁇ m was formed on both sides of a 50 ⁇ m-thick aluminum foil substrate, and the thin adhesive layer was attached to the heat insulating member.
  • a heat insulating sheet was manufactured in the same manner as in Example 1, except that the heat spreading member was removed.
  • a heat insulating sheet was manufactured in the same manner as in Example 2, except that the heat spreading member was removed.
  • Insulation sheets according to Examples 1 to 3 and Comparative Examples 1 and 2 were placed on the opposite surface of the mounting surface of a circuit board having a plurality of micro LEDs mounted on one surface as shown in FIG. An insulation sheet was attached on the area where the micro LEDs were mounted in an array of .
  • the width and length of the micro LEDs were 3.5 mm ⁇ 2.8 mm, the distance between LEDs was 1 cm, and the width and length of the heat insulating sheet were 8.3 cm ⁇ 3 cm.
  • the circuit board was placed in a thermo-hygrostat, power was applied to the circuit board, and the temperature of the top of the insulation sheet was measured through a thermal imaging camera after 15 minutes. At this time, the measurement points were the center of the specimen (Spot 1) and points near the four corners of the insulation sheet (Spots 2 to 4), and each Example and Comparative Example were measured at the same point.
  • the temperature was measured at the same point without the thermal insulation sheet and set as a default value.
  • Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 default heat spreading absence Equipment type/ Thickness ( ⁇ m) Al/25 Al/50 Al/50 - - - insulation member Type/Thickness ( ⁇ m) Artificial G/25 Natural G/200 Natural G/200 Artificial G/25 Natural G/200 - heat accumulation member Metal Substrate Type/Thickness ( ⁇ m) - - Al/50 - - - measurement temperature (°C) spot 1 135 133 125 140 136 197 spot 2 123 129 127 127 129 171 spot 3 129 129 129 134 172 spot 4 133 133 126 137 137 187 spot 5 127 127 125 132 133 169 Spot 1 temperature reduction rate (%) compared to default -31.47% -32.48 -37.05 -28.93 -30.96 0
  • natural G and artificial G refer to natural graphite sheets and artificial graphite sheets, respectively.
  • Example 3 equipped with a heat accumulating member, the insulation performance was further improved compared to Example 2, and the temperature deviation between Spot 1 in the center and Spots 2 to 4 near the remaining corners became more uniform, resulting in uniform insulation performance. expression can be seen.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention concerne une feuille d'isolation pour une source de lumière d'affichage. La feuille d'isolation pour une source de lumière d'affichage selon un mode de réalisation de la présente invention est une feuille d'isolation pour une source de lumière d'affichage qui est disposée sur la surface opposée à une surface de montage de carte de circuit sur laquelle une pluralité d'éléments de DEL constituant une source de lumière d'un dispositif d'affichage sont montés, espacés à des intervalles prédéterminés, pour bloquer la chaleur générée à partir de la pluralité d'éléments de DEL d'être transférée dans la direction perpendiculaire à la surface opposée. En conséquence, la feuille d'isolation peut réduire au minimum le transfert de chaleur reçue dans la direction perpendiculaire tout en réduisant le niveau de chaleur dans la pluralité d'éléments de DEL, et est ainsi avantageuse dans la réduction ou la prévention du transfert de chaleur dans une direction indésirable et/ou d'une quantité indésirable.
PCT/KR2022/007890 2021-06-09 2022-06-03 Feuille d'isolation pour source de lumière d'affichage, et module de source de lumière d'isolation, unité de rétroéclairage d'isolation et dispositif d'affichage la comprenant WO2022260355A1 (fr)

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KR1020210074611A KR102634412B1 (ko) 2021-06-09 2021-06-09 디스플레이 광원용 단열시트, 이를 포함하는 단열 광원모듈, 단열 백라이트 유닛 및 디스플레이 장치
KR10-2021-0074611 2021-06-09

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Citations (5)

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KR20080012699A (ko) * 2006-08-04 2008-02-12 삼성전자주식회사 백라이트 어셈블리 및 이를 포함하는 액정 표시 장치
US8324641B2 (en) * 2007-06-29 2012-12-04 Ledengin, Inc. Matrix material including an embedded dispersion of beads for a light-emitting device
KR20160131520A (ko) * 2015-05-07 2016-11-16 삼성전자주식회사 디스플레이장치
KR20170082562A (ko) * 2014-11-05 2017-07-14 제이엔씨 주식회사 열전도 시트 및 전자 기기
KR101968119B1 (ko) * 2012-12-07 2019-04-11 엘지디스플레이 주식회사 유기전계발광표시장치

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KR102059126B1 (ko) 2018-06-15 2019-12-24 (주)코아시아 미니 led를 이용한 백라이트 유닛 제조 방법

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Publication number Priority date Publication date Assignee Title
KR20080012699A (ko) * 2006-08-04 2008-02-12 삼성전자주식회사 백라이트 어셈블리 및 이를 포함하는 액정 표시 장치
US8324641B2 (en) * 2007-06-29 2012-12-04 Ledengin, Inc. Matrix material including an embedded dispersion of beads for a light-emitting device
KR101968119B1 (ko) * 2012-12-07 2019-04-11 엘지디스플레이 주식회사 유기전계발광표시장치
KR20170082562A (ko) * 2014-11-05 2017-07-14 제이엔씨 주식회사 열전도 시트 및 전자 기기
KR20160131520A (ko) * 2015-05-07 2016-11-16 삼성전자주식회사 디스플레이장치

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