WO2022260325A1 - Primer composition, laminated film, and display device - Google Patents

Primer composition, laminated film, and display device Download PDF

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WO2022260325A1
WO2022260325A1 PCT/KR2022/007602 KR2022007602W WO2022260325A1 WO 2022260325 A1 WO2022260325 A1 WO 2022260325A1 KR 2022007602 W KR2022007602 W KR 2022007602W WO 2022260325 A1 WO2022260325 A1 WO 2022260325A1
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compound
formula
based compound
hard coating
acrylate
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PCT/KR2022/007602
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French (fr)
Korean (ko)
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박준기
우석종
조형우
편승용
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에스케이씨하이테크앤마케팅(주)
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Publication of WO2022260325A1 publication Critical patent/WO2022260325A1/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/002Priming paints
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/042Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/043Improving the adhesiveness of the coatings per se, e.g. forming primers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/046Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04Homopolymers or copolymers of esters
    • C09D133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • C09D175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/16Antifouling paints; Underwater paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/16Antifouling paints; Underwater paints
    • C09D5/1656Antifouling paints; Underwater paints characterised by the film-forming substance
    • C09D5/1662Synthetic film-forming substance
    • C09D5/1668Vinyl-type polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/63Additives non-macromolecular organic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays

Definitions

  • Embodiments relate to primer compositions, laminated films, and display devices.
  • Polyimide-based resins such as polyamide-imide (PAI) have excellent friction, heat and chemical resistance, and are used as primary electrical insulation, coatings, adhesives, resins for extrusion, heat-resistant paints, heat-resistant plates, and heat-resistant materials. It is applied to adhesives, heat-resistant fibers, and heat-resistant films.
  • PAI polyamide-imide
  • polyimide-based resins are utilized in various fields.
  • polyimide-based resin is made in the form of a powder and used as a coating agent for metal or magnet wire, etc., and is mixed with other additives depending on the use.
  • polyimide-based resin is used as a paint for decoration and anti-corrosion along with fluoropolymer, and serves to adhere the fluoropolymer to a metal substrate.
  • polyimide-based resin is used to coat kitchen utensils, and is used as a membrane used for gas separation due to its heat resistance and chemical resistance, and filters contaminants such as carbon dioxide, hydrogen sulfide and impurities in natural gas oil wells. Also used for devices.
  • One embodiment provides a primer composition having excellent optical properties, mechanical properties and bonding properties.
  • One embodiment provides a laminated film having excellent optical and mechanical properties.
  • One embodiment provides a display device having excellent optical and mechanical properties.
  • a primer composition according to embodiments may include an acrylic binder resin; trifunctional or more polyvalent aziridine-based compounds; and a solvent.
  • a laminated film according to embodiments may include a substrate; a primer layer formed from a primer composition including an acrylic binder resin, a trifunctional or higher polyvalent aziridine-based compound, and a solvent on the substrate; and a hard coating layer formed on the primer layer.
  • a display device includes a display panel; and a cover window disposed on a viewing surface of the display panel, wherein the cover window includes a primer layer formed from a primer composition including a base material, an acrylic binder resin, a trifunctional or higher polyvalent aziridine compound, and a solvent on the base material; and and a hard coating layer formed on the primer layer.
  • the primer composition according to the embodiment may include a trifunctional or higher polyvalent aziridine-based compound to improve bonding strength between the substrate and the hard coating layer and improve durability of the laminated film.
  • the polymer resin base film and the hard coating layer having antifouling and antistatic properties can be strongly bonded.
  • the hard coating layer is strongly bonded to the substrate and cannot be easily separated by external stimuli, for example, even if applied to a flexible device and repeatedly deformed Bonding between the hard coat layer and the substrate can be effectively maintained.
  • FIG. 1 is a schematic exploded view of a display device according to an exemplary embodiment.
  • FIG. 2 is a schematic perspective view of a display device according to an exemplary embodiment.
  • FIG 3 is a schematic cross-sectional view of a display device according to an exemplary embodiment.
  • one component is formed above/under another component or is connected or coupled to each other includes all forms, connections, or couplings between these components directly or indirectly through another component. .
  • the criterion for the top/bottom of each component may vary according to the direction in which the object is observed.
  • substituted means deuterium, -F, -Cl, -Br, -I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amido group, a hydrazine group, a hydrazone group, an ester group, unless otherwise specified.
  • ketone group carboxyl group, substituted or unsubstituted C 1 -C 30 alkyl group, substituted or unsubstituted C 2 -C 30 alkenyl group, substituted or unsubstituted C 2 -C 30 alkynyl group, substituted or unsubstituted C 1 -C 30 alkoxy group, substituted or unsubstituted C 6 -C 30 alicyclic organic group, substituted or unsubstituted C 4 -C 30 heterocyclic group, substituted or unsubstituted C 6 -C 30 aryl group and substituted Alternatively, it means one substituted with one or more substituents selected from the group consisting of an unsubstituted C 4 -C 30 heteroaryl group, and two adjacent substituents may be linked to form a ring.
  • the molecular weight of the compound or polymer described herein is a relative mass based on carbon-12 and does not describe the unit, but, if necessary, the same numerical molar mass (g/mol).
  • Primer compositions according to embodiments include a binder resin, a trifunctional or higher polyvalent aziridine-based compound, and a solvent.
  • the binder resin may include an acrylic resin.
  • the acrylic resin is an oligomer or polymer having a repeating unit derived from a (meth)acrylic acid-based compound, and may be formed by polymerization of the (meth)acrylic acid-based compound.
  • the (meth)acrylic acid-based compound may include (meth)acrylic acid and derivatives thereof.
  • the (meth)acrylic acid derivative may include, for example, a (meth)acrylic acid ester-based compound.
  • “(meth)acrylic acid” includes acrylic acid and methacrylic acid.
  • the (meth)acrylic acid-based compound may include an ester compound in which (meth)acrylic acid is substituted with an alkyl group having 1 to 12 carbon atoms.
  • the (meth)acrylic acid ester compound is a (meth)acrylic acid ester substituted with an alkyl group having 1 to 12 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, and an octyl group. It may include, preferably, the number of carbon atoms of the alkyl group substituted in the ester compound may be 1 to 8.
  • the (meth) acrylic acid compound is ethyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, (meth) acrylic acid, methyl (meth) acrylate, ethyl methacrylate, n-propyl (meth) )Acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate
  • the acrylic resin may include a polymer of the (meth)acrylic acid-based compound and a comonomer.
  • the comonomer may include an acrylic compound or a vinyl compound other than the (meth)acrylic acid compound.
  • the acrylic compound may include an ester compound (acrylic ester compound) of carboxylic acid having 4 to 12 carbon atoms and carbon number 2 and carbon number 3 connected by a double bond.
  • the acrylic ester compound is an alkyl ester of crotonic acid, an alkyl ester of isocrotonic acid, an alkyl 2-petenoate, an alkyl 2-hexenoate ( alkyl 2-hexanoate) and the like.
  • the number of carbon atoms of the carboxylic acid may be preferably 4 to 8 or 4 to 6.
  • the alkyl group of the acrylic ester compound may be linear, branched or cyclic, and may have 1 to 12 carbon atoms, preferably 1 to 8 carbon atoms.
  • vinyl compound examples include acrylamide, N,N-dimethyl(meth)acrylamide, (meth)acrylonitrile, 3-(meth)acryloylpropyltrimethoxysilane, styrene, and ⁇ -methylstyrene. , p-methylstyrene, p-methoxystyrene, and the like, which may be used alone or in combination of two or more.
  • the acrylic resin may include 50 wt% to 97 wt% of the (meth)acrylic acid-based compound and 3 wt% to 50 wt% of the comonomer, based on the total weight of the monomers.
  • the (meth)acrylic acid compound may be included in 60% to 97% by weight, 70% to 97% by weight, 80% to 97% by weight, or 90% to 97% by weight, and the comonomer is 3% by weight % to 40% by weight, 3% to 30% by weight, 3% to 20% by weight or 3% to 10% by weight.
  • the weight average molecular weight (Mw) of the acrylic resin may be 15,000 to 150,000.
  • the weight average molecular weight (MW) of the acrylic resin is 20,000 to 150,000, 30,000 to 150,000, 40,000 to 150,000, 15,000 to 100,000, 20,000 to 100,000, 30,000 to 100,000, 40,000 to 100,000, 15,000 to 80,000, 20,000 to 80,000, 30,000 to 80,000, 40,000 to 80,000, 15,000 to 60,000, 20,000 to 60,000, 30,000 to 60,000 or 40,000 to 60,000.
  • the glass transition temperature (Tg) of the acrylic resin is 50 °C to 150 °C, 60 °C to 150 °C, 70 °C to 150 °C, 80 °C to 150 °C, 50 °C to 120 °C, 60 °C to 120°C, 70°C to 120°C, 80°C to 120°C, 50°C to 100°C, 60°C to 100°C, 70°C to 100°C, 80°C to 100°C, 50°C to 90°C, 60°C to 90°C °C, 70 °C to 90 °C or 80 °C to 90 °C.
  • the acrylic resin may be formed from the (meth)acrylic acid-based compound and the acrylic ester compound, and may not include an acrylic double bond and other functional groups other than an ester group.
  • compatibility between the acrylic resin and the polyvalent aziridine-based compound to be described later may be improved, and bonding properties of the primer composition may be improved.
  • the acrylic resin may be formed from a C 1 to C 4 alkyl crotonate and a C 1 to C 8 alkyl (meth)acrylate.
  • the acrylic resin may be formed from methyl crotonate, methyl (meth)acrylate, butyl (meth)acrylate, octyl methacrylate and 2-ethylhexyl methacrylate.
  • the polyvalent aziridine-based compound may serve as a curing agent and/or a crosslinking agent of the primer composition.
  • the polyvalent aziridine-based compound may include three or more aziridinyl groups (-N(CH 2 )(CH 2 )) at the terminal of the molecular structure.
  • the aziridinyl group may improve bonding strength between the substrate and the hard coating layer by cross-linking the binder resin of the primer layer with the polymer component of the substrate and the polymer component of the hard coating layer.
  • the polyvalent aziridine-based compound may include a compound in which an aziridinylalkanoate-based moiety and a polyol-based moiety are ester-bonded.
  • the aziridinyl alkanoate-based residue may be obtained by substituting an aziridinyl group for an alkyl group of the alkanoate-based residue.
  • the diziridinyl group may be substituted on a terminal carbon atom of the alkanoate-based residue.
  • the polyol-based residue may include 2 to 10 hydroxyl groups, preferably 4 to 6 hydroxyl groups. All of the hydroxyl groups of the polyol-based residue may be ester-bonded with the aziridinylalkanoate-based residue, and in some embodiments, some of the hydroxyl groups of the polyol-based residue may remain without esterification. Preferably, when a part of the hydroxyl group remains, the hydroxyl group may be provided as a reaction site to an aziridinyl group of another polyvalent aziridine-based compound. Accordingly, the crosslinking reaction may be promoted, and bonding strength between the layers of the laminated film may be improved.
  • the polyvalent aziridine-based compound may include a compound represented by Formula I below.
  • A is a tetravalent carbon atom or a residue represented by Formula Ia
  • n, m and l are each independently an integer of 1 to 6
  • y is an integer of 3 or more
  • x+y is A It may be 4 in the case of a carbon atom and 6 in the case of a residue of the following formula (Ia).
  • n, m and l may be 1 to 4.
  • n and m can be the same. l may be greater than n and m, in which case the aziridinyl group of the compound of formula (I) may be relatively free from steric hindrance effects. Accordingly, the crosslinking ability of the compound of formula (I) can be improved.
  • k may be an integer of 1 to 6, preferably, an integer of 1 to 4.
  • the acrylic binder resin may be included in an amount of 0.1% to 20% by weight based on the total weight of the composition.
  • a primer film can be formed with a uniform thickness and strong adhesion can be realized.
  • the acrylic binder resin is 0.1% to 10% by weight, 0.1% to 5% by weight, 0.1% to 3% by weight, 0.1% to 2% by weight, 0.5% by weight based on the total weight of the composition. to 20% by weight, 0.5% to 10% by weight, 0.5% to 5% by weight, 0.5% to 3% by weight, or 0.5% to 2% by weight.
  • the polyvalent aziridine-based compound may be included in an amount of 0.01% by weight or more and less than 3% by weight based on the total weight of the composition. It is possible to improve the bonding strength between the substrate and the hard coating layer in the above content range.
  • the polyhydric aziridine-based compound may be included in an amount of 0.01 wt% to 2.5 wt%, 0.01 wt% to 2 wt%, 0.03 wt% to 2.5 wt%, or 0.03 wt% to 2 wt% based on the total weight of the composition. .
  • the polyvalent aziridine-based compound in the primer composition may be included in a smaller amount than the acrylic binder resin. In this case, bonding strength between the substrate and the hard coating layer may be improved.
  • the solvent may be included in the remaining amount of the primer composition.
  • the solvent may include an aprotic polar solvent of at least one of an ether-based compound, a ketone-based compound, and an ester-based compound, or a non-polar solvent including an aromatic hydrocarbon-based compound.
  • the ether-based compound may include an ether compound of a polyol compound, and may include, for example, propylene glycol n-propyl ether (PNP).
  • the ketone-based compound may include methyl isobutyl ketone and the like.
  • the ester-based compound may include an acetate-based compound, for example, n-butyl acetate and the like.
  • the hydrocarbon-based compound may include an aromatic hydrocarbon-based compound, and may include, for example, benzene, toluene, xylene, and the like. Two or more of the exemplified solvents may be used in combination.
  • FIGS. 1 to 3 are schematic exploded views, perspective views, and cross-sectional views of a display device according to an embodiment, respectively.
  • FIG. 3 is a cross-sectional view taken along the A-A′ direction of FIG. 2 .
  • a display device according to embodiments may include a laminated film 100 and a display panel.
  • the laminated film 100 may include a substrate 130 , a primer layer 120 formed on the substrate 130 , and a hard coating layer 110 formed on the primer layer 120 .
  • the primer layer 120 may be formed from the above-described primer composition.
  • the primer layer 120 may be directly formed on the substrate 130
  • the hard coating layer 110 may be directly formed on the primer layer 120 .
  • the substrate 130 may include a polymer film.
  • the substrate 130 may be a polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; cellulosic resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate-based resin; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrenic resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin-based resins such as polyethylene, polypropylene, polyolefins having a cyclo-based or norbornene structure, and ethylene-propylene copolymers; vinyl chloride-based resins; amide resins such as nylon and aromatic polyamide; imide-based resins; polyamideimide-based resins; polyethersulfone-based resins; polyurea poly
  • the polyimide-based resin may be formed by simultaneously or sequentially reacting reactants including a diamine compound and a dianhydride compound.
  • the polyimide-based resin may include a polyimide-based polymer formed by polymerization of a diamine compound and a dianhydride compound.
  • the polyimide-based resin may include an imide repeating unit derived from polymerization of a diamine compound and a dianhydride compound.
  • the polyimide-based resin may be polymerized by further including a dicarbonyl compound, and may include a polyamide-imide polymer including an amide repeating unit derived from polymerization of the diamine compound and the dicarbonyl compound.
  • the diamine compound is not particularly limited, but may be, for example, an aromatic diamine compound containing an aromatic structure.
  • the diamine compound may be a compound represented by Formula 1 below.
  • e is selected from an integer of 1 to 5, and when e is 2 or more, E may be the same as or different from each other.
  • (E) e of Formula 1 may be selected from the groups represented by Formulas 1-1a to 1-14a, but is not limited thereto.
  • (E) e of Formula 1 may be selected from the groups represented by Formulas 1-1b to 1-13b below, but is not limited thereto:
  • (E) e in Chemical Formula 1 may be a group represented by Chemical Formula 1-6b.
  • the diamine compound may include a compound having a fluorine-containing substituent.
  • the diamine compound may be composed of a compound having a fluorine-containing substituent.
  • the fluorine-containing substituent may be a fluorinated hydrocarbon group, specifically a trifluoromethyl group, but is not limited thereto.
  • the diamine compound may use one type of diamine compound. That is, the diamine compound may be composed of a single component.
  • the diamine compound is 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl (2,2'-bis (trifluoromethyl) -4,4 having the following structure) '-diaminobiphenyl, TFDB), but is not limited thereto.
  • the dianhydride compound Since the dianhydride compound has a low birefringence value, it may contribute to improving optical properties such as transmittance of the film including the polyimide-based resin.
  • the dianhydride compound is not particularly limited, but may be an aromatic dianhydride compound having an aromatic structure.
  • the aromatic dianhydride compound may be a compound represented by Formula 2 below.
  • G is a substituted or unsubstituted tetravalent C 6 -C 30 aliphatic ring group, a substituted or unsubstituted tetravalent C 4 -C 30 heteroaliphatic ring group, or a substituted or unsubstituted tetravalent C 6 -C 30
  • An aromatic ring group, a substituted or unsubstituted tetravalent C 4 -C 30 heteroaromatic ring group, and the aliphatic ring group, the heteroaliphatic ring group, the aromatic ring group, or the heteroaromatic ring group exists alone or , bonded to each other to form a condensed ring, a substituted or unsubstituted C 1 -C 30 alkylene group, a substituted or unsubstituted C 2 -C 30 alkenylene group, or a substituted or unsubstituted C 2 -C 30 alkynylene group , -O-,
  • G in Formula 2 may be selected from groups represented by Formulas 2-1a to 2-9a, but is not limited thereto.
  • G in Chemical Formula 2 may be a group represented by Chemical Formula 2-8a.
  • the dianhydride compound may include a compound having a fluorine-containing substituent.
  • the dianhydride compound may be composed of a compound having a fluorine-containing substituent.
  • the fluorine-containing substituent may be a fluorinated hydrocarbon group, specifically a trifluoromethyl group, but is not limited thereto.
  • the dianhydride compound may consist of one single component or two mixed components.
  • the dianhydride compound is 2,2'-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride having the following structure (2,2'-bis- (3,4 -dicarboxyphenyl) hexafluoropropane dianhydride, 6-FDA), but is not limited thereto.
  • Polyamic acid may be produced by polymerization of the diamine compound and the dianhydride compound.
  • the polyamic acid may be converted into polyimide through a dehydration reaction.
  • the polyimide may include a repeating unit represented by Formula A below.
  • the polyimide may include a repeating unit represented by Formula A-1 below, but is not limited thereto.
  • n may be an integer from 1 to 400.
  • the dicarbonyl compound is not particularly limited, but may be, for example, a compound represented by Formula 3 below.
  • j is selected from an integer of 1 to 5, and when j is 2 or more, J may be the same as or different from each other.
  • X is a halogen atom. Specifically, X may be F, Cl, Br, I or the like. More specifically, X may be Cl, but is not limited thereto.
  • (J) j in Chemical Formula 3 may be selected from the groups represented by Chemical Formulas 3-1a to 3-14a, but is not limited thereto.
  • (J) j in Chemical Formula 3 may be selected from the groups represented by Chemical Formulas 3-1b to 3-8b, but is not limited thereto:
  • (J) j in Chemical Formula 3 may be a group represented by Chemical Formula 3-1b, a group represented by Chemical Formula 3-2b, or a group represented by 3-3b.
  • At least two dicarbonyl compounds that are different from each other may be mixed and used as the dicarbonyl compound.
  • two or more dicarbonyl compounds are used, two or more dicarbonyl compounds selected from the groups in which (J) j in Formula 3 are represented by Formulas 3-1b to 3-8b may be used. have.
  • the dicarbonyl compound may be an aromatic dicarbonyl compound including an aromatic structure.
  • the dicarbonyl compound may include a first dicarbonyl compound and/or a second dicarbonyl compound different from the first dicarbonyl compound.
  • the first dicarbonyl compound and the second dicarbonyl compound may each be an aromatic dicarbonyl compound.
  • the first dicarbonyl compound and the second dicarbonyl compound may be different aromatic dicarbonyl compounds, but are not limited thereto.
  • first dicarbonyl compound and the second dicarbonyl compound are aromatic dicarbonyl compounds, respectively, since they contain a benzene ring, surface hardness and tensile strength of the film containing the prepared polyamide-imide resin It can contribute to improving mechanical properties such as
  • the dicarbonyl compound has the following structures: terephthaloyl chloride (TPC), isophthaloyl chloride (IPC), 1'-biphenyl-4,4'-dicarbonyldichloride ( 1,1'-biphenyl-4,4'-dicarbonyl dichloride (BPDC) or a combination thereof, but is not limited thereto.
  • TPC terephthaloyl chloride
  • IPC isophthaloyl chloride
  • 1'-biphenyl-4,4'-dicarbonyldichloride 1,1'-biphenyl-4,4'-dicarbonyl dichloride (BPDC) or a combination thereof, but is not limited thereto.
  • the first dicarbonyl compound may include BPDC
  • the second dicarbonyl compound may include TPC, but are not limited thereto.
  • the prepared film including the polyamide-imide resin may have high oxidation resistance. have.
  • the first dicarbonyl compound may include isophthaloyl chloride (IPC), and the second dicarbonyl compound may include TPC, but is not limited thereto.
  • IPC isophthaloyl chloride
  • the prepared film including the polyamide-imide resin may have high oxidation resistance. And the manufacturing cost can be reduced.
  • the diamine compound and the dicarbonyl compound may be polymerized to form a repeating unit represented by Chemical Formula B below.
  • the diamine compound and the dicarbonyl compound may be polymerized to form amide repeating units represented by Chemical Formulas B-1 and B-2.
  • x is an integer from 1 to 400.
  • y is an integer from 1 to 400.
  • the polyimide-based film may include a filler.
  • the filler may be at least one selected from the group consisting of barium sulfate, silica and calcium carbonate.
  • the polyimide-based film can improve roughness and winding properties, as well as improve running properties and scratch improvement effects during film production.
  • the particle diameter of the filler may be greater than or equal to 0.01 ⁇ m and less than 1.0 ⁇ m.
  • the particle size of the filler may be 0.05 ⁇ m to 0.9 ⁇ m or 0.1 ⁇ m to 0.8 ⁇ m, but is not limited thereto.
  • the polyimide-based film may include the filler in an amount of 0.01 wt % to 3 wt % based on the total weight of the polyimide-based film.
  • the polyimide-based film may contain the filler in an amount of 0.05 wt% to 2.5 wt%, 0.1 wt% to 2 wt%, or 0.2 wt% to 1.7 wt% based on the total weight of the polyimide-based film. It may include, but is not limited thereto.
  • the haze of the polyimide-based film may be 3% or less.
  • the haze may be 2% or less, 1.5% or less, or 1% or less, but is not limited thereto.
  • the yellow index (YI) of the polyimide-based film may be 5 or less.
  • the yellowness may be 4 or less, 3.8 or less, 2.8 or less, 2.5 or less, 2.3 or less, or 2.1 or less, but is not limited thereto.
  • the modulus of the polyimide-based film may be 5 GPa or more.
  • the modulus may be 5.2 GPa or more, 5.5 GPa or more, 6.0 GPa or more, 10 GPa or less, 5 GPa to 10 GPa, or 7 GPa to 10 GPa, but is not limited thereto.
  • transmittance of the polyimide-based film may be 80% or more.
  • the transmittance may be 85% or more, 88% or more, 89% or more, 80% to 99%, 80% to 99%, or 85% to 99%, but is not limited thereto.
  • the compressive strength of the polyimide-based film may be 0.4 kgf/ ⁇ m or more. Specifically, the compressive strength may be 0.45 kgf/ ⁇ m or more or 0.46 kgf/ ⁇ m or more, but is not limited thereto.
  • the surface hardness of the polyimide-based film may be greater than or equal to HB. Specifically, the surface hardness may be H or more or 2H or more, but is not limited thereto.
  • the polyimide-based film may have a tensile strength of 15 kgf/mm 2 or more. Specifically, the tensile strength may be 18 kgf/mm 2 or more, 20 kgf/mm 2 or more, 21 kgf/mm 2 or more, or 22 kgf/mm 2 or more, but is not limited thereto.
  • the polyimide-based film may have an elongation of 15% or more. Specifically, the elongation may be 16% or more, 17% or more, or 17.5% or more, but is not limited thereto.
  • the substrate 130 may have high oxidation resistance and secure excellent optical properties such as high light transmittance, low haze, and low yellowness (YI). Furthermore, it may have excellent modulus, elongation, tensile properties, and elastic restoring force.
  • the primer composition may be coated, dried, and cured on the substrate 130 to form the primer layer 120 .
  • the coating may be performed through a method commonly used in the art, such as die coating.
  • the drying and curing may be performed by heat treatment at a temperature of 80° C. to 160° C. for 1 minute to 20 minutes.
  • the primer layer 120 capable of strongly bonding the substrate 130 and the hard coating layer 110 can be formed.
  • the temperature condition may be 100° C. to 140° C.
  • the heat treatment time may be 3 minutes to 12 minutes.
  • the thickness of the primer layer 120 can be between 20 nm and 200 nm.
  • the thickness is 20 nm to 190 nm, 20 nm to 180 nm, 20 nm to 160 nm, 20 nm to 130 nm, 20 nm to 120 nm, 20 nm to 110 nm, 20 nm to 80 nm, 30 nm nm to 200 nm, 30 nm to 190 nm, 30 nm to 180 nm, 30 nm to 160 nm, 30 nm to 130 nm, 30 nm to 120 nm, 30 nm to 110 nm, 30 nm to 100 nm or 30 nm to may be 80 nm.
  • the primer layer 120 includes a first surface 122 and a second surface 124 .
  • the first surface 122 is a surface opposite to the hard coating layer 110 and may be provided as an interface between the primer layer 120 and the hard coating layer 110 .
  • the second surface 124 is a surface facing the base material 130 , and the second surface 124 may be positioned opposite to a surface where the primer layer 120 and the hard coating layer 110 come into contact.
  • the second surface 124 may serve as an interface between the primer layer 120 and the substrate 130 .
  • the hard coating layer 110 may be formed by being coated on the primer layer 120 .
  • the hard coating layer 110 may be bonded on the primer layer 120 .
  • the hard coating layer 110 may include a curable resin. Specifically, the hard coating layer 110 may be a curable coating layer.
  • the hard coating layer 110 may improve mechanical properties and/or optical properties of the laminated film 100 .
  • the hard coating layer 110 may include functions such as antiglare, antifouling, and antistatic.
  • the hard coating layer 110 may include an organic resin and/or an additive.
  • the organic resin may be a curable resin.
  • the organic resin may be a binder resin.
  • the organic resin may include at least one selected from the group consisting of a urethane acrylate-based compound, an acrylic ester-based compound, and an epoxy acrylate-based compound.
  • the organic resin may include a urethane acrylate-based compound and an acrylic ester-based compound.
  • the acrylic ester compound may be at least one selected from the group consisting of substituted or unsubstituted acrylates and substituted or unsubstituted methacrylates.
  • the acrylic ester-based compound may include 1 to 10 functional groups.
  • the urethane acrylate-based compound may include 2 to 15 functional groups.
  • the epoxy acrylate-based compound may include 1 to 10 functional groups.
  • acrylic ester compound examples include trimethylolpropane triacrylate (TMPTA), trimethylolpropaneethoxy triacrylate (TMPEOTA), glycerin propoxylated triacrylate (GPTA), pentaerythritol tetraacrylate (PETA), Or dipentaerythritol hexaacrylate (DPHA) and the like, but are not limited thereto.
  • TMPTA trimethylolpropane triacrylate
  • TMPEOTA trimethylolpropaneethoxy triacrylate
  • GPTA glycerin propoxylated triacrylate
  • PETA pentaerythritol tetraacrylate
  • DPHA dipentaerythritol hexaacrylate
  • the urethane acrylate-based compound includes a urethane bond as a repeating unit and may have a plurality of functional groups.
  • the urethane acrylate-based compound may be one in which a terminal of a urethane compound formed by reacting a diisocyanate compound with a polyol is substituted with an acrylate group.
  • the diisocyanate compound may include at least one of a straight-chain, branched or cyclic aliphatic diisocyanate compound having 4 to 12 carbon atoms and an aromatic diisocyanate compound having 6 to 20 carbon atoms.
  • the polyol includes 2 to 4 hydroxyl groups (-OH) and may be a straight-chain, branched or cyclic aliphatic polyol compound having 4 to 12 carbon atoms or an aromatic polyol compound having 6 to 20 carbon atoms.
  • Terminal substitution with the acrylate group may be performed by an acrylate compound having a functional group capable of reacting with an isocyanate group (-NCO).
  • an acrylate compound having a hydroxyl group or an amine group may be used, and a hydroxyalkyl acrylate compound or an aminoalkyl acrylate compound having 2 to 10 carbon atoms may be used.
  • urethane acrylate-based compound examples include a bifunctional urethane acrylate oligomer having a weight average molecular weight of 1400 to 25000, a trifunctional urethane acrylate oligomer having a weight average molecular weight of 1700 to 16000, a tetrafunctional urethane acrylate oligomer having a weight average molecular weight of 500 to 2000, 15 of hexafunctional urethane acrylate oligomers having a weight average molecular weight of 818 to 2600, 9 functional urethane acrylate oligomers having a weight average molecular weight of 2500 to 5500, 10 functional urethane acrylate oligomers having a weight average molecular weight of 3200 to 3900 or weight average molecular weights of 2300 to 20000 functional urethane acrylate oligomers and the like, but are not limited thereto.
  • the glass transition temperature (Tg) of the urethane acrylate compound is -80 ° C to 100 ° C, -80 ° C to 90 ° C, -80 ° C to 80 ° C, -80 ° C to 70 ° C, -80 °C to 60 °C, -70 °C to 100 °C, -70 °C to 90 °C, -70 °C to 80 °C, -70 °C to 70 °C, -70 °C to 60 °C, -60 °C to 100 °C, -60 °C to 90°C, -60°C to 80°C, -60°C to 70°C, -60°C to 60°C, -50°C to 100°C, -50°C to 90°C, -50°C to 80°C, -50°C to 70°C or -50°C to 60°C.
  • Examples of the epoxy acrylate-based compound include a monofunctional epoxy acrylate oligomer having a weight average molecular weight of 100 to 300, a bifunctional epoxy acrylate oligomer having a weight average molecular weight of 250 to 2000, a tetrafunctional epoxy acrylate oligomer having a weight average molecular weight of 1000 to 3000, and the like. It may include, but is not limited thereto.
  • the weight average molecular weight (Mw) of the acrylic ester compound is about 500 to about 6,000, about 500 to about 5,000, about 500 to about 4,000, 1000 to about 6,000, about 1000 to about 5,000, about 1000 to about 4,000, 1500 to about 6,000, about 1500 to about 5,000 or about 1500 to about 4,000.
  • the acrylate equivalent weight of the acrylic ester compound is about 50 g/eq to about 300 g/eq, about 50 g/eq to about 200 g/eq, or about 50 g/eq to about 150 g/eq. may be in the range of
  • the epoxy equivalent weight of the epoxy acrylate-based compound is about 50 g/eq to about 300 g/eq, about 50 g/eq to about 200 g/eq, or about 50 g/eq to about 150 g/eq. may be in the range of
  • the content of the organic resin may be 30 wt% to 100 wt% based on the total weight of the hard coating layer 110 . Specifically, the content of the organic resin may be 40% to 90% by weight or 50% to 80% by weight based on the total weight of the hard coating layer 110 .
  • the hard coating layer 110 may optionally include a filler.
  • the filler include silica, barium sulfate, zinc oxide or alumina.
  • the particle diameter of the filler may be 1 nm to 100 nm. Specifically, the particle diameter of the filler may be 5 nm to 50 nm or 10 nm to 30 nm.
  • the filler may include inorganic fillers having different particle diameter distributions.
  • the filler may include a first inorganic filler having a d50 of 20 nm to 35 nm and a second inorganic filler having a d50 of 40 nm to 130 nm.
  • the content of the filler may be about 25% by weight or more, about 30% by weight or more, or about 35% by weight or more based on the total weight of the functional layer. In addition, the content of the filler may be about 50 wt% or less, about 45 wt% or less, or about 40 wt% or less based on the total weight of the functional layer.
  • the hard coating layer 110 may not include an inorganic filler such as silica.
  • an inorganic filler such as silica.
  • bonding strength between the base layer and the hard coating layer having the above composition may be improved.
  • the hard coating layer 110 may further include a photoinitiator.
  • photoinitiator examples include 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy ) Phenyl] -2-methyl-1-propanone, methylbenzoyl formate, ⁇ , ⁇ -dimethoxy- ⁇ -phenylacetophenone, 2-benzoyl-2- (dimethylamino) -1- [4- (4- Morpholinyl) phenyl] -1-butanone, 2-methyl-1- [4- (methylthio) phenyl] -2- (4-morpholinyl) -1-propanone diphenyl (2,4, 6-trimethylbenzoyl)-phosphine oxide, or bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and the like, but are not limited thereto.
  • commercial products include Irgacure 184, Irgacure 500, Irgacure 651, Irgacure 369, Irgacure 907, Darocur 1173, Darocur MBF, Irgacure 819, Darocur TPO, Irgacure 907, Esacure KIP 100F, and the like.
  • the photoinitiator may be used alone or in combination of two or more different types.
  • the hard coating layer 110 may include at least one of an antifouling additive and an antistatic agent.
  • the antifouling additive may include a fluorine-substituted acrylate-based compound.
  • the antifouling additive may include an acrylate-based compound including a perfluoroalkyl group such as (perfluorohexyl)ethyl acrylate.
  • the antistatic agent may include an ionic surfactant.
  • the ionic surfactant may include an ammonium salt or a quaternary alkylammonium salt, and the ammonium salt and quaternary alkylammonium salt may include a halide such as chloride or bromide.
  • the hard coating layer having antifouling and antistatic properties provided by the antifouling additive and the antistatic agent has adhesive strength with a substrate (in particular, a polyimide-based film). This may be low, and thus, when the laminated film is deformed or subjected to an external stimulus, the hard coat layer can be easily separated from the substrate.
  • the hard coating layer 110 may include other additives such as a surfactant, a UV absorber, a UV stabilizer, an anti-yellowing agent, a leveling agent, or a dye for improving a color value.
  • the content of the additive may be variously adjusted within a range that does not degrade the physical properties of the hard coating layer 110.
  • the content of the additive may be included in about 0.01 wt% to about 10 wt% based on the hard coating layer 110, but is not limited thereto.
  • the surfactant may be a mono- or bifunctional fluorine-based acrylate, a fluorine-based surfactant, or a silicone-based surfactant.
  • the surfactant may be included in a dispersed or cross-linked form in the hard coating layer 110 .
  • UV absorber examples include benzophenone-based compounds, benzotriazole-based compounds, and triazine-based compounds
  • UV stabilizer examples include tetramethyl piperidine.
  • the hard coating layer 110 may be formed by applying a hard coating composition on the primer layer 120, drying, and curing.
  • the hard coating composition may include the aforementioned organic resin, photoinitiator, antifouling additive, antistatic agent, other additives and/or solvent.
  • organic solvent examples include alcohol-based solvents such as methanol, ethanol, isopropyl alcohol, and butanol; alkoxy alcohol solvents such as 2-methoxyethanol, 2-ethoxyethanol, and 1-methoxy-2-propanol; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl propyl ketone, and cyclohexanone; Propylene glycol monopropyl ether, propylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethyl glycol monoethyl ether, diethyl glycol monopropyl ether ether solvents such as diethyl glycol monobutyl ether and diethylene glycol-2-ethylhexyl ether; aromatic solvents such as benzene, tol
  • the content of the organic solvent is not particularly limited as it can be variously adjusted within a range that does not degrade the physical properties of the coating composition, but with respect to the solid content among the components included in the hard coating composition, the solid content: organic solvent weight ratio is about 30:70 to about 99:1. When the organic solvent is within the above range, appropriate fluidity and coating properties may be obtained.
  • the hard coating composition may include 10% to 30% by weight of an organic resin, 0.1% to 5% by weight of a photoinitiator, 0.01% to 2% by weight of an antifouling additive, and 0.1% to 10% by weight of an antistatic agent.
  • an organic resin 0.1% to 5% by weight of a photoinitiator
  • an antifouling additive 0.1% to 10% by weight of an antistatic agent.
  • the hard coating composition is a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, a micro gravure coating method, a comma coating method, a slot die coating method, a lip coating method, or a solution casting method It may be applied on the primer layer 120 through the like.
  • the organic solvent included in the hard coating composition may be removed through a drying process.
  • the drying process may be performed at a temperature of 40°C to 100°C, preferably 40°C to 80°C, 50°C to 100°C, or 50°C to 80°C, for about 1 minute to 20 minutes, preferably 1 minutes to 10 minutes or 1 to 5 minutes.
  • the hard coating composition layer may be cured by light and/or heat.
  • the cured hard coating layer 110 has a thickness of about 2 ⁇ m or more, or about 3 ⁇ m or more, for example, about 2 ⁇ m to about 20 ⁇ m, about 2 ⁇ m to about 15 ⁇ m, about 2 ⁇ m to about 10 ⁇ m, or about 3 ⁇ m to about 3 ⁇ m. It may have a thickness of about 10 ⁇ m.
  • the laminated film may have a cross hatch adhesion test result value measured according to JIS K 5600 of 50/100 or more, 70/100 or more, 80/100 or more, 90/100 or more, or 95/100 or more. have.
  • a display device may include a laminated film 100 and a display panel 200 .
  • the laminated film 100 may be provided as a cover window of a display device.
  • the laminated film (cover window: 100) may be disposed on the viewer side with respect to the display panel 200 to protect the display panel 200.
  • the display device when the antifouling additive and the antistatic agent are included in the hard coating layer 110, the display device may have antifouling and antistatic properties, and the above-described primer layer 120 is the hard coating layer 110 When formed between the substrate 130 and the antifouling/antistatic hard coating layer and the substrate are strongly bonded, a display device having durability even when repeatedly deformed can be provided.
  • the display panel 200 is a device capable of displaying an image and may have a flexible characteristic.
  • the display panel 200 may be, for example, a liquid crystal display panel or an organic light emitting display panel.
  • the organic light emitting display panel may include a front polarizer and an organic EL panel, but is not limited thereto.
  • the front polarizing plate may be disposed on the front surface of the organic EL panel. Specifically, the front polarizing plate may be attached to a surface of the organic EL panel on which an image is displayed.
  • the organic EL panel displays an image by self-emission in pixel units.
  • the organic EL panel may include an organic EL substrate and a driving substrate.
  • the organic EL substrate may include a plurality of organic electroluminescent units each corresponding to a pixel. Specifically, each may include a cathode, an electron transport layer, a light emitting layer, a hole transport layer, and an anode.
  • the driving substrate may be drivingly coupled to the organic EL substrate. That is, the driving substrate is coupled to apply a driving signal such as a driving current to the organic EL substrate, so that the organic EL substrate can be driven by applying a current to each of the organic electroluminescent units.
  • an adhesive layer may be included between the display panel 200 and the laminated film 100 .
  • the adhesive layer may be an optically transparent adhesive layer, and is not particularly limited.
  • a primer composition was prepared by mixing each component according to the composition shown in Table 1 below.
  • a primer composition was prepared in the same manner as in Preparation Example 1, except that the content of pentaerythritol tris(3-aziridin-1-ylpropionate) in the primer composition was adjusted as shown in Table 2 below.
  • the content of the solvent was decreased by the increase in the content of pentaerythritol tris(3-aziridin-1-ylpropionate) in the composition.
  • a hard coating composition was prepared by mixing each component in the composition shown in Table 3 below.
  • a hard coating composition was prepared in the same manner as in Preparation Example 7, except that urethane acrylate and acrylic ester were respectively changed to the compounds shown in Table 4 below.
  • Preparation Example 7 Preparation Example 8
  • Preparation Example 9 Preparation Example 10
  • Urethane Acrylate Miramer MU9800 Miramer PU340 (Miwon Specialty Chemical) Miramer PU320 (Miwon Specialty Chemical) Miramer SC2152 (Miwon Specialty Chemical) acrylic ester Miramer PS3010 Photocryl DP344 (Miwon Specialty Chemical) Miramer P261 (Miwon Specialty Chemical) Miramer PS3010 (Miwon Specialty Chemical)
  • the primer compositions of Preparation Examples 1 to 6 were applied on one surface of a transparent polyimide film (manufactured by SKC) having a thickness of about 30 to 80 ⁇ m by a die coating method. Heat treatment was performed at about 120° C. for about 6 minutes to dry the solvent and curing was performed to form a primer layer having a thickness of about 70 to 90 nm.
  • the hard coating compositions of Preparation Examples 7 to 10 were applied on the primer layer by a die coating method.
  • the applied composition was dried at about 120° C. for about 6 minutes and cured by applying a total energy of about 1 J/cm 2 through UV with a wavelength of 375 nm to form a hard coating layer having a thickness of about 5 ⁇ m.
  • a laminated film was prepared in the same manner as in Example 1, except that the thickness of the primer layer was changed as shown in Table 5 below.
  • Example 7 Example 8
  • Example 9 Example 10 coating thickness 73 nm 36 nm 120 nm 156 nm 182 nm
  • Laminated films were prepared in the same manner as in Examples 1 to 4, except that a polyethylene terephthalate film (TU94, 50 ⁇ m thick; manufactured by SKC) having a thickness of about 40 ⁇ m was used as the primer composition instead of the polyimide film.
  • a polyethylene terephthalate film (TU94, 50 ⁇ m thick; manufactured by SKC) having a thickness of about 40 ⁇ m was used as the primer composition instead of the polyimide film.
  • the hard coating composition of Preparation Example 7 was directly applied on one surface of a ⁇ m transparent polyimide film by a die coating method, and the coated composition was dried at about 120 ° C. for about 6 minutes, and a total of about 1
  • a laminated film in which a hard coating layer was laminated was prepared by curing by applying energy of J/cm 2 .
  • Adhesion tests were conducted on the laminated films of Examples and Comparative Examples according to JIS K 5600 using a cross hatch adhesion tester (Elcometer, 107-1542).
  • sheaths were formed in two directions orthogonal to each other on the surface of the sample on which the hard coating layer was formed using a cross hatch cutter to form 10 x 10 cutting units.
  • An adhesive tape (Nitto, 31B) was attached so as to cover all of the cutting units, and the tape was peeled off at a speed of about 2500 mm/min or more in the 90 ° direction.
  • the number of cut units remaining without being peeled off by the tape among the total cut units was evaluated as a ratio and shown in Table 6 below.
  • the thickness of the primer layer was 200 nm or less, it was confirmed to have excellent adhesive strength, and when the content of the trifunctional or higher polyvalent aziridine-based compound in the primer composition was less than 3% by weight, it was confirmed that the adhesive strength was improved.

Abstract

A primer composition, according to an embodiment, comprises: an acrylic binder resin; a trifunctional or more polyvalent aziridine-based compound; and a solvent, thereby making it possible to strongly bond a substrate and a hard coating layer.

Description

프라이머 조성물, 적층 필름 및 디스플레이 장치Primer composition, laminated film and display device
구현예는 프라이머 조성물, 적층 필름 및 디스플레이 장치에 관한 것이다.Embodiments relate to primer compositions, laminated films, and display devices.
폴리아마이드-이미드(polyamide-imide, PAI)와 같은 폴리이미드계 수지는 마찰, 열 및 화학적인 저항력이 뛰어나, 1차 전기 절연제, 코팅제, 접착제, 압출용 수지, 내열도료, 내열판, 내열접착제, 내열섬유, 및 내열필름 등에 응용된다.Polyimide-based resins such as polyamide-imide (PAI) have excellent friction, heat and chemical resistance, and are used as primary electrical insulation, coatings, adhesives, resins for extrusion, heat-resistant paints, heat-resistant plates, and heat-resistant materials. It is applied to adhesives, heat-resistant fibers, and heat-resistant films.
이러한 폴리이미드계 수지는 다양한 분야에서 활용되고 있다. 예를 들어, 폴리이미드계 수지는 분말 형태로 만들어져 금속 또는 자석 와이어 등의 코팅제로 사용되며 용도에 따라 다른 첨가제와 혼합하여 사용된다. 또한 폴리이미드계 수지는 불소중합체와 함께 장식과 부식 방지를 도료로 사용되며, 불소중합체를 금속 기판에 접착시키는 역할을 한다. 또한 폴리이미드계 수지는 주방 조리기구에 코팅을 하는 데에도 사용되고, 내열성과 내화학성의 특징이 있어 가스 분리에 사용하는 멤브레인으로도 사용되며, 천연가스 유정에서 이산화탄소, 황화수소 및 불순물과 같은 오염물을 여과 장치에도 사용된다.Such polyimide-based resins are utilized in various fields. For example, polyimide-based resin is made in the form of a powder and used as a coating agent for metal or magnet wire, etc., and is mixed with other additives depending on the use. In addition, polyimide-based resin is used as a paint for decoration and anti-corrosion along with fluoropolymer, and serves to adhere the fluoropolymer to a metal substrate. In addition, polyimide-based resin is used to coat kitchen utensils, and is used as a membrane used for gas separation due to its heat resistance and chemical resistance, and filters contaminants such as carbon dioxide, hydrogen sulfide and impurities in natural gas oil wells. Also used for devices.
최근에는 폴리이미드계 수지를 필름화함으로써, 보다 저렴하면서도 광학적, 기계적 및 열적 특성이 우수한 폴리이미드계 필름이 개발되고 있다.Recently, a polyimide-based film having excellent optical, mechanical, and thermal properties at a lower cost has been developed by forming a polyimide-based resin into a film.
일 구현예는 우수한 광학적 특성, 기계적 특성 및 접합 특성을 갖는 프라이머 조성물을 제공한다.One embodiment provides a primer composition having excellent optical properties, mechanical properties and bonding properties.
일 구현예는 우수한 광학적 특성 및 기계적 특성을 갖는 적층 필름을 제공한다.One embodiment provides a laminated film having excellent optical and mechanical properties.
일 구현예는 우수한 광학적 특성 및 기계적 특성을 갖는 디스플레이 장치를 제공한다.One embodiment provides a display device having excellent optical and mechanical properties.
구현예들에 따른 프라이머 조성물은 아크릴계 바인더 수지; 3관능 이상의 다가 아지리딘계 화합물; 및 용매를 포함한다.A primer composition according to embodiments may include an acrylic binder resin; trifunctional or more polyvalent aziridine-based compounds; and a solvent.
구현예들에 따른 적층 필름은 기재; 상기 기재 상에 아크릴계 바인더 수지, 3관능 이상의 다가 아지리딘계 화합물 및 용매를 포함하는 프라이머 조성물로부터 형성된 프라이머층; 및 상기 프라이머층 상에 형성된 하드코팅층을 포함한다.A laminated film according to embodiments may include a substrate; a primer layer formed from a primer composition including an acrylic binder resin, a trifunctional or higher polyvalent aziridine-based compound, and a solvent on the substrate; and a hard coating layer formed on the primer layer.
구현예들에 따른 디스플레이 장치는 디스플레이 패널; 및 상기 디스플레이 패널의 시인면 상에 배치된 커버 윈도우를 포함하며, 상기 커버 윈도우는 기재, 상기 기재 상에 아크릴계 바인더 수지, 3관능 이상의 다가 아지리딘계 화합물 및 용매를 포함하는 프라이머 조성물로부터 형성된 프라이머층 및 상기 프라이머층 상에 형성된 하드코팅층을 포함한다.A display device according to embodiments includes a display panel; and a cover window disposed on a viewing surface of the display panel, wherein the cover window includes a primer layer formed from a primer composition including a base material, an acrylic binder resin, a trifunctional or higher polyvalent aziridine compound, and a solvent on the base material; and and a hard coating layer formed on the primer layer.
구현예에 따른 프라이머 조성물은 3관능 이상의 다가 아지리딘계 화합물을 포함하여, 기재와 하드코팅층 사이의 접합력을 향상시키고, 적층 필름의 내구성을 향상시킬 수 있다.The primer composition according to the embodiment may include a trifunctional or higher polyvalent aziridine-based compound to improve bonding strength between the substrate and the hard coating layer and improve durability of the laminated film.
상기 3관능 이상의 다가 아지리딘계 화합물은 아크릴계 수지와 함께 사용됨으로써, 고분자 수지 기재 필름과 방오 및 대전방지 특성을 갖는 하드코팅층을 강하게 접합시킬 수 있다.By using the trifunctional or higher polyvalent aziridine-based compound together with an acrylic resin, the polymer resin base film and the hard coating layer having antifouling and antistatic properties can be strongly bonded.
따라서, 상기 프라이머 조성물로부터 형성된 프라이머층을 포함하는 적층 필름 및 디스플레이 장치는 하드코팅층이 기재와 강하게 접합되어 외부 자극에 의해 쉽게 분리되지 않을 수 있으며, 예를 들면, 플렉서블 장치에 적용되어 반복하여 변형되더라도 하드코팅층과 기재의 접합이 효과적으로 유지될 수 있다.Therefore, in the laminated film and display device including the primer layer formed from the primer composition, the hard coating layer is strongly bonded to the substrate and cannot be easily separated by external stimuli, for example, even if applied to a flexible device and repeatedly deformed Bonding between the hard coat layer and the substrate can be effectively maintained.
도 1은 일 구현예에 따른 디스플레이 장치의 개략적인 분해도이다.1 is a schematic exploded view of a display device according to an exemplary embodiment.
도 2는 일 구현예에 따른 디스플레이 장치의 개략적인 사시도이다.2 is a schematic perspective view of a display device according to an exemplary embodiment.
도 3은 일 구현예에 따른 디스플레이 장치의 개략적인 단면도이다.3 is a schematic cross-sectional view of a display device according to an exemplary embodiment.
<부호의 설명><Description of codes>
100: 적층 필름, 110: 하드코팅층, 120: 프라이머층, 122: 제1 면, 124: 제2 면, 130: 기재, 200: 디스플레이 패널100: laminated film, 110: hard coating layer, 120: primer layer, 122: first surface, 124: second surface, 130: substrate, 200: display panel
이하 다양한 구현예와 실시예를 도면을 참고로 하여 구체적으로 설명한다. Hereinafter, various implementations and embodiments will be described in detail with reference to the drawings.
이하의 구현예들을 설명함에 있어서 관련된 공지 구성 또는 기능에 대한 구체적인 설명이 요지를 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략한다. 또한 도면에서의 각 구성요소들의 크기는 설명을 위하여 과장되거나 생략될 수 있으며, 실제로 적용되는 크기와 다를 수 있다.In describing the following embodiments, if it is determined that a detailed description of a related known configuration or function may obscure the subject matter, the detailed description will be omitted. In addition, the size of each component in the drawings may be exaggerated or omitted for description, and may differ from the actually applied size.
본 명세서에서 하나의 구성요소가 다른 구성요소의 상/하에 형성되거나 서로 연결 또는 결합된다는 기재는, 이들 구성요소 간에 직접 또는 또 다른 구성요소를 개재하여 간접적으로 형성, 연결 또는 결합되는 것을 모두 포함한다. 또한 각 구성요소의 상/하에 대한 기준은 대상을 관찰하는 방향에 따라 달라질 수 있는 것으로 이해하여야 한다. In this specification, the description that one component is formed above/under another component or is connected or coupled to each other includes all forms, connections, or couplings between these components directly or indirectly through another component. . In addition, it should be understood that the criterion for the top/bottom of each component may vary according to the direction in which the object is observed.
본 명세서에서 각 구성요소를 지칭하는 용어는 다른 구성요소들과 구별하기 위해 사용되는 것이며, 구현예의 범위를 한정하려는 의도로 사용되는 것은 아니다. 또한 본 명세서에서 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한 복수의 표현을 포함한다.Terms referring to each component in this specification are used to distinguish them from other components, and are not intended to limit the scope of the implementation. Also, in this specification, singular expressions include plural expressions unless the context clearly indicates otherwise.
본 명세서에서 "포함"한다는 기재는 특정 특성, 영역, 단계, 공정, 요소 및/또는 성분을 구체화하기 위한 것이며, 특별히 반대되는 기재가 없는 한, 그 외 다른 특성, 영역, 단계, 공정, 요소 및/또는 성분의 존재나 부가를 제외시키는 것은 아니다.The term "comprising" in this specification is intended to specify specific properties, regions, steps, processes, elements and/or components, and unless otherwise stated, other characteristics, regions, steps, processes, elements and/or components. / or the presence or addition of ingredients is not excluded.
본 명세서에서 제 1, 제 2 등의 용어는 다양한 구성 요소를 설명하기 위해 사용되는 것이고, 상기 구성 요소들은 상기 용어에 의해 한정되어서는 안 된다. 상기 용어들은 하나의 구성 요소를 다른 구성 요소로 구별하는 목적으로 사용된다.In this specification, terms such as first and second are used to describe various components, and the components should not be limited by the terms. The above terms are used for the purpose of distinguishing one component from another.
본 명세서에서 "치환된"이라는 것은 특별한 기재가 없는 한, 중수소, -F, -Cl, -Br, -I, 히드록시기, 시아노기, 니트로기, 아미노기, 아미도기, 히드라진기, 히드라존기, 에스테르기, 케톤기, 카르복실기, 치환 또는 비치환된 C1-C30 알킬기, 치환 또는 비치환된 C2-C30 알케닐기, 치환 또는 비치환된 C2-C30 알키닐기, 치환 또는 비치환된 C1-C30 알콕시기, 치환 또는 비치환된 C6-C30 지환족 유기기, 치환 또는 비치환된 C4-C30 헤테로고리기, 치환 또는 비치환된 C6-C30 아릴기 및 치환 또는 비치환된 C4-C30 헤테로아릴기로 이루어진 군에서 선택된 1 종 이상의 치환기로 치환된 것을 의미하고, 서로 인접한 두 치환기는 연결되어 고리를 형성할 수도 있다.In the present specification, "substituted" means deuterium, -F, -Cl, -Br, -I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amido group, a hydrazine group, a hydrazone group, an ester group, unless otherwise specified. , ketone group, carboxyl group, substituted or unsubstituted C 1 -C 30 alkyl group, substituted or unsubstituted C 2 -C 30 alkenyl group, substituted or unsubstituted C 2 -C 30 alkynyl group, substituted or unsubstituted C 1 -C 30 alkoxy group, substituted or unsubstituted C 6 -C 30 alicyclic organic group, substituted or unsubstituted C 4 -C 30 heterocyclic group, substituted or unsubstituted C 6 -C 30 aryl group and substituted Alternatively, it means one substituted with one or more substituents selected from the group consisting of an unsubstituted C 4 -C 30 heteroaryl group, and two adjacent substituents may be linked to form a ring.
본 명세서에 기재되는 화합물 또는 고분자의 분자량, 예를 들어 수평균분자량 또는 중량평균분자량은 잘 알려진 바와 같이 탄소-12를 기준으로 한 상대적 질량으로서 단위를 기재하지 않으나, 필요에 따라 동일한 수치의 몰 질량(g/mol)인 것으로 이해하여도 무방하다.As is well known, the molecular weight of the compound or polymer described herein, such as number average molecular weight or weight average molecular weight, is a relative mass based on carbon-12 and does not describe the unit, but, if necessary, the same numerical molar mass (g/mol).
프라이머 조성물primer composition
구현예들에 따른 프라이머 조성물은 바인더 수지, 3관능 이상의 다가 아지리딘계 화합물 및 용매를 포함한다.Primer compositions according to embodiments include a binder resin, a trifunctional or higher polyvalent aziridine-based compound, and a solvent.
일부 구현예들에 있어서, 상기 바인더 수지는 아크릴계 수지를 포함할 수 있다.In some embodiments, the binder resin may include an acrylic resin.
상기 아크릴계 수지는 (메트)아크릴산계 화합물로부터 유래된 반복 단위를 갖는 올리고머 또는 폴리머로서, 상기 (메트)아크릴산계 화합물이 중합되어 형성될 수 있다. 상기 (메트)아크릴산계 화합물은 (메트)아크릴산 및 이의 유도체를 포함할 수 있다. 상기 (메트)아크릴산의 유도체는 예를 들면, (메트)아크릴산 에스테르계 화합물을 포함할 수 있다. 본 명세서에서 "(메트)아크릴산"은 아크릴산 및 메타크릴산을 포함한다.The acrylic resin is an oligomer or polymer having a repeating unit derived from a (meth)acrylic acid-based compound, and may be formed by polymerization of the (meth)acrylic acid-based compound. The (meth)acrylic acid-based compound may include (meth)acrylic acid and derivatives thereof. The (meth)acrylic acid derivative may include, for example, a (meth)acrylic acid ester-based compound. In this specification, "(meth)acrylic acid" includes acrylic acid and methacrylic acid.
예를 들면, 상기 (메트)아크릴산계 화합물은 (메트)아크릴산에 탄소수 1 내지 12의 알킬기가 치환된 에스테르 화합물을 포함할 수 있다. 예를 들면, 상기 (메트)아크릴산 에스테르계 화합물은 메틸기, 에틸기, 프로필기, 부틸기, 펜틸기, 헥실기, 헵틸기, 옥틸기 등의 탄소수 1 내지 12의 알킬기로 치환된 (메트)아크릴산 에스테르를 포함할 수 있으며, 바람직하게는, 상기 에스테르 화합물에 치환된 알킬기의 탄소수는 1 내지 8개일 수 있다.For example, the (meth)acrylic acid-based compound may include an ester compound in which (meth)acrylic acid is substituted with an alkyl group having 1 to 12 carbon atoms. For example, the (meth)acrylic acid ester compound is a (meth)acrylic acid ester substituted with an alkyl group having 1 to 12 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, and an octyl group. It may include, preferably, the number of carbon atoms of the alkyl group substituted in the ester compound may be 1 to 8.
예를 들면 상기 (메트)아크릴산계 화합물은 에틸아크릴레이트, n-부틸아크릴레이트, 2-에틸헥실아크릴레이트, (메트)아크릴산, 메틸(메트)아크릴레이트, 에틸메타크릴레이트, n-프로필(메트)아크릴레이트, 이소프로필(메트)아크릴레이트, n-부틸(메트)아크릴레이트, 이소부틸(메트)아크릴레이트, t-부틸(메트)아크릴레이트, n-펜틸(메트)아크릴레이트, n-헥실(메트)아크릴레이트, n-헵틸(메트)아크릴레이트, n-옥틸(메트)아크릴레이트, 2-에틸헥실(메트)아크릴레이트, 노닐(메트)아크릴레이트, 데실(메트)아크릴레이트, 도데실(메트)아크릴레이트, 트리데실(메트)아크릴레이트, 세틸(메트)아크릴레이트, 스테아릴(메트)아크릴레이트, 베헤닐(메트)아크릴레이트, 시클로헥실(메트)아크릴레이트, 4-tert-부틸시클로헥실(메트)아크릴레이트, 이소보르닐(메트)아크릴레이트, 디시클로펜타닐(메트)아크릴레이트, 벤질(메트)아크릴레이트, N,N-디메틸아미노에틸(메트)아크릴레이트, 글리시딜(메트)아크릴레이트, 2-히드록시에틸(메트)아크릴레이트,3-히드록시프로필(메트)아크릴레이트, 4-히드록시-n-부틸(메트)아크릴레이트, 2-히드록시프로필(메트)아크릴레이트, 2-히드록시-n-부틸(메트)아크릴레이트, 3-히드록시-n-부틸(메트)아크릴레이트, 1,4-시클로헥산디메탄올모노(메트)아크릴레이트, 글리세린모노(메트)아크릴레이트, 폴리에틸렌글리콜모노(메트)아크릴레이트, 폴리프로필렌글리콜모노(메트)아크릴레이트, 2-히드록시-3-페녹시프로필(메트)아크릴레이트, 2-(메트)아크릴로일옥시에틸-2-히드록시에틸프탈레이트, 말단에 수산기를 갖는 락톤 변성 (메트)아크릴레이트 등을 포함할 수 있으며, 이들은 단독으로 사용되거나 2 이상이 조합되어 사용될 수 있다.For example, the (meth) acrylic acid compound is ethyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, (meth) acrylic acid, methyl (meth) acrylate, ethyl methacrylate, n-propyl (meth) )Acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, cetyl (meth)acrylate, stearyl (meth)acrylate, behenyl (meth)acrylate, cyclohexyl (meth)acrylate, 4-tert-butyl Cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, benzyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, glycidyl ( meth)acrylate, 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxy-n-butyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate lactate, 2-hydroxy-n-butyl (meth)acrylate, 3-hydroxy-n-butyl (meth)acrylate, 1,4-cyclohexanedimethanol mono(meth)acrylate, glycerin mono(meth)acrylate Acrylates, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-(meth)acryloyloxyethyl-2 -Hydroxyethyl phthalate, lactone-modified (meth)acrylate having a hydroxyl group at the terminal, and the like may be included, and these may be used alone or in combination of two or more.
상기 아크릴계 수지는 상기 (메트)아크릴산계 화합물과 공단량체의 중합물을 포함할 수 있다. 상기 공단량체는 상기 (메트)아크릴산계 화합물을 제외한 아크릴계 화합물 또는 비닐계 화합물을 포함할 수 있다. 상기 아크릴계 화합물은 4 내지 12개의 탄소를 가지고 2번 탄소와 3번 탄소가 이중 결합으로 연결된 카르복실산의 에스테르 화합물(아크릴계 에스테르 화합물)을 포함할 수 있다. 예를 들면, 상기 아크릴계 에스테르 화합물은 크로톤산(crotonic acid)의 알킬 에스테르, 이소크로톤산(isocrotonic acid)의 알킬 에스테르, 알킬 2-펜테노에이트(alky 2-petenoate), 알킬 2-헥세노에이트(alkyl 2-hexanoate) 등을 포함할 수 있다. 상기 카르복실산의 탄소수는 바람직하게는 4 내지 8개 또는 4 내지 6개일 수 있다. 상기 아크릴계 에스테르 화합물의 알킬기는 직선형, 분지형 또는 고리형일 수 있으며, 탄소수가 1 내지 12개, 바람직하게는 1 내지 8개일 수 있다.The acrylic resin may include a polymer of the (meth)acrylic acid-based compound and a comonomer. The comonomer may include an acrylic compound or a vinyl compound other than the (meth)acrylic acid compound. The acrylic compound may include an ester compound (acrylic ester compound) of carboxylic acid having 4 to 12 carbon atoms and carbon number 2 and carbon number 3 connected by a double bond. For example, the acrylic ester compound is an alkyl ester of crotonic acid, an alkyl ester of isocrotonic acid, an alkyl 2-petenoate, an alkyl 2-hexenoate ( alkyl 2-hexanoate) and the like. The number of carbon atoms of the carboxylic acid may be preferably 4 to 8 or 4 to 6. The alkyl group of the acrylic ester compound may be linear, branched or cyclic, and may have 1 to 12 carbon atoms, preferably 1 to 8 carbon atoms.
상기 비닐계 화합물은 예를 들면, 아크릴아미드, N,N-디메틸(메트)아크릴아미드, (메트)아크릴로니트릴, 3-(메트)아크릴로일프로필트리메톡시실란, 스티렌, α-메틸스티렌, p-메틸스티렌, p-메톡시스티렌 등을 포함할 수 있으며, 이들은 단독으로 사용되거나 2 이상이 조합되어 사용될 수 있다.Examples of the vinyl compound include acrylamide, N,N-dimethyl(meth)acrylamide, (meth)acrylonitrile, 3-(meth)acryloylpropyltrimethoxysilane, styrene, and α-methylstyrene. , p-methylstyrene, p-methoxystyrene, and the like, which may be used alone or in combination of two or more.
예를 들면, 상기 아크릴계 수지는 단량체 총 중량을 기준으로, 상기 (메트)아크릴산계 화합물을 50 중량% 내지 97 중량% 및 상기 공단량체 3 중량% 내지 50 중량%를 포함할 수 있다. 상기 (메트)아크릴산계 화합물은 60 중량% 내지 97 중량%, 70 중량% 내지 97 중량%, 80 중량% 내지 97 중량% 또는 90 중량% 내지 97 중량%로 포함될 수 있으며, 상기 공단량체는 3 중량% 내지 40 중량%, 3 중량% 내지 30 중량%, 3 중량% 내지 20 중량% 또는 3 중량% 내지 10 중량%로 포함될 수 있다.For example, the acrylic resin may include 50 wt% to 97 wt% of the (meth)acrylic acid-based compound and 3 wt% to 50 wt% of the comonomer, based on the total weight of the monomers. The (meth)acrylic acid compound may be included in 60% to 97% by weight, 70% to 97% by weight, 80% to 97% by weight, or 90% to 97% by weight, and the comonomer is 3% by weight % to 40% by weight, 3% to 30% by weight, 3% to 20% by weight or 3% to 10% by weight.
예를 들면, 상기 아크릴계 수지의 중량평균분자량(Mw)은 15,000 내지 150,000일 수 있다. 구체적으로, 상기 아크릴계 수지의 중량평균분자량(Mw)은 20,000 내지 150,000, 30,000 내지 150,000, 40,000 내지 150,000, 15,000 내지 100,000, 20,000 내지 100,000, 30,000 내지 100,000, 40,000 내지 100,000, 15,000 내지 80,000, 20,000 내지 80,000, 30,000 내지 80,000, 40,000 내지 80,000, 15,000 내지 60,000, 20,000 내지 60,000, 30,000 내지 60,000 또는 40,000 내지 60,000일 수 있다.For example, the weight average molecular weight (Mw) of the acrylic resin may be 15,000 to 150,000. Specifically, the weight average molecular weight (MW) of the acrylic resin is 20,000 to 150,000, 30,000 to 150,000, 40,000 to 150,000, 15,000 to 100,000, 20,000 to 100,000, 30,000 to 100,000, 40,000 to 100,000, 15,000 to 80,000, 20,000 to 80,000, 30,000 to 80,000, 40,000 to 80,000, 15,000 to 60,000, 20,000 to 60,000, 30,000 to 60,000 or 40,000 to 60,000.
일부 구현예들에 있어서, 상기 아크릴계 수지의 유리 전이 온도(Tg)는 50℃ 내지 150℃, 60℃ 내지 150℃, 70℃ 내지 150℃, 80℃ 내지 150℃, 50℃ 내지 120℃, 60℃ 내지 120℃, 70℃ 내지 120℃, 80℃ 내지 120℃, 50℃ 내지 100℃, 60℃ 내지 100℃, 70℃ 내지 100℃, 80℃ 내지 100℃, 50℃ 내지 90℃, 60℃ 내지 90℃, 70℃ 내지 90℃ 또는 80℃ 내지 90℃일 수 있다.In some embodiments, the glass transition temperature (Tg) of the acrylic resin is 50 ℃ to 150 ℃, 60 ℃ to 150 ℃, 70 ℃ to 150 ℃, 80 ℃ to 150 ℃, 50 ℃ to 120 ℃, 60 ℃ to 120°C, 70°C to 120°C, 80°C to 120°C, 50°C to 100°C, 60°C to 100°C, 70°C to 100°C, 80°C to 100°C, 50°C to 90°C, 60°C to 90°C °C, 70 °C to 90 °C or 80 °C to 90 °C.
일부 구현예들에 있어서, 상기 아크릴계 수지는 상기 (메트)아크릴산계 화합물 및 상기 아크릴계 에스테르 화합물로부터 형성될 수 있으며, 아크릴 이중 결합 및 에스테르기를 제외한 다른 작용기를 포함하지 않을 수 있다. 이 경우, 상기 아크릴계 수지와 후술할 다가 아지리딘계 화합물의 상용성이 향상될 수 있으며, 프라이머 조성물의 접합 특성이 향상될 수 있다.In some embodiments, the acrylic resin may be formed from the (meth)acrylic acid-based compound and the acrylic ester compound, and may not include an acrylic double bond and other functional groups other than an ester group. In this case, compatibility between the acrylic resin and the polyvalent aziridine-based compound to be described later may be improved, and bonding properties of the primer composition may be improved.
일부 구현예들에 있어서, 상기 아크릴계 수지는 C1 내지 C4의 알킬 크로토네이트 및 C1 내지 C8의 알킬 (메트)아크릴레이트로부터 형성될 수 있다. 바람직하게는, 상기 아크릴계 수지는 메틸 크로토네이트, 메틸 (메트)아크릴레이트, 부틸 (메트)아크릴레이트, 옥틸 메타크릴레이트 및 2-에틸헥실 메타크릴레이트로부터 형성될 수 있다.In some embodiments, the acrylic resin may be formed from a C 1 to C 4 alkyl crotonate and a C 1 to C 8 alkyl (meth)acrylate. Preferably, the acrylic resin may be formed from methyl crotonate, methyl (meth)acrylate, butyl (meth)acrylate, octyl methacrylate and 2-ethylhexyl methacrylate.
상기 다가 아지리딘계 화합물은 프라이머 조성물의 경화제 및/또는 가교제로 제공될 수 있다.The polyvalent aziridine-based compound may serve as a curing agent and/or a crosslinking agent of the primer composition.
일부 구현예들에 있어서, 상기 다가 아지리딘계 화합물은 분자 구조의 말단에 3개 이상의 아지리디닐기(aziridinyl group; -N(CH2)(CH2))를 포함할 수 있다. 예를 들면, 상기 아지리디닐기는 프라이머층의 바인더 수지와 기재의 고분자 성분 및 하드코팅층의 고분자 성분을 가교시킴으로써, 기재와 하드코팅층 사이의 접합력을 향상시킬 수 있다.In some embodiments, the polyvalent aziridine-based compound may include three or more aziridinyl groups (-N(CH 2 )(CH 2 )) at the terminal of the molecular structure. For example, the aziridinyl group may improve bonding strength between the substrate and the hard coating layer by cross-linking the binder resin of the primer layer with the polymer component of the substrate and the polymer component of the hard coating layer.
일부 구현예들에 있어서, 상기 다가 아지리딘계 화합물은 아지리디닐알카노에이트계 잔기(arizidinylalkanoate-based moiety)와 폴리올계 잔기(polyol-based moiety)가 에스테르 결합된 화합물을 포함할 수 있다.In some embodiments, the polyvalent aziridine-based compound may include a compound in which an aziridinylalkanoate-based moiety and a polyol-based moiety are ester-bonded.
상기 아지리디닐알카노에이트계 잔기는 알카노에이트계 잔기의 알킬기에 아지리디닐기가 치환된 것일 수 있다. 바람직하게는, 상기 이지리디닐기는 상기 알카노에이트계 잔기 중 말단 탄소 원자에 치환될 수 있다.The aziridinyl alkanoate-based residue may be obtained by substituting an aziridinyl group for an alkyl group of the alkanoate-based residue. Preferably, the diziridinyl group may be substituted on a terminal carbon atom of the alkanoate-based residue.
상기 폴리올계 잔기는 2 내지 10개의 히드록시기(hydroxyl group)를 포함할 수 있으며, 바람직하게는 4 내지 6개의 히드록시기를 포함할 수 있다. 상기 폴리올계 잔기의 히드록시기는 전부가 상기 아지리디닐알카노에이트계 잔기와 에스테르 결합할 수 있으며, 일부 구현예들에 있어서, 상기 폴리올계 잔기의 히드록시기의 일부가 에스테르 결합을 하지 않고 잔류할 수도 있다. 바람직하게는, 히드록시기의 일부가 남아있을 경우, 상기 히드록시기가 다른 다가 아지리딘계 화합물의 아지리디닐기에 반응 사이트로 제공될 수 있다. 따라서, 가교 반응이 촉진되어 적층 필름의 각 층 간의 접합력이 향상될 수 있다.The polyol-based residue may include 2 to 10 hydroxyl groups, preferably 4 to 6 hydroxyl groups. All of the hydroxyl groups of the polyol-based residue may be ester-bonded with the aziridinylalkanoate-based residue, and in some embodiments, some of the hydroxyl groups of the polyol-based residue may remain without esterification. Preferably, when a part of the hydroxyl group remains, the hydroxyl group may be provided as a reaction site to an aziridinyl group of another polyvalent aziridine-based compound. Accordingly, the crosslinking reaction may be promoted, and bonding strength between the layers of the laminated film may be improved.
상기 다가 아지리딘계 화합물은 하기 화학식 I로 표시되는 화합물을 포함할 수 있다.The polyvalent aziridine-based compound may include a compound represented by Formula I below.
[화학식 I][Formula I]
Figure PCTKR2022007602-appb-I000001
Figure PCTKR2022007602-appb-I000001
상기 화학식 I에서, A는 4가 탄소 원자 또는 하기 화학식 Ia로 표시되는 잔기이고, n, m 및 l은 각각 독립적으로 1 내지 6의 정수이고, y는 3 이상의 정수이고, x+y는 A가 탄소 원자일 경우 4이고, 하기 화학식 Ia의 잔기일 경우 6일 수 있다. 바람직하게는, n, m 및 l은 1 내지 4일 수 있다.In Formula I, A is a tetravalent carbon atom or a residue represented by Formula Ia, n, m and l are each independently an integer of 1 to 6, y is an integer of 3 or more, and x+y is A It may be 4 in the case of a carbon atom and 6 in the case of a residue of the following formula (Ia). Preferably, n, m and l may be 1 to 4.
일부 구현예들에 있어서, n 및 m은 동일할 수 있다. l은 n 및 m 보다 클 수 있으며, 이 경우, 상기 화학식 I의 화합물의 아지리디닐기가 입체 장애 효과로부터 상대적으로 자유로울 수 있다. 따라서, 화학식 I의 화합물의 가교 능력이 향상될 수 있다.In some implementations, n and m can be the same. l may be greater than n and m, in which case the aziridinyl group of the compound of formula (I) may be relatively free from steric hindrance effects. Accordingly, the crosslinking ability of the compound of formula (I) can be improved.
[화학식 Ia][Formula Ia]
Figure PCTKR2022007602-appb-I000002
Figure PCTKR2022007602-appb-I000002
상기 화학식 Ia에서, k는 1 내지 6의 정수일 수 있으며, 바람직하게는, 1 내지 4의 정수일 수 있다.In Formula Ia, k may be an integer of 1 to 6, preferably, an integer of 1 to 4.
일부 구현예들에 있어서, 상기 아크릴계 바인더 수지는 조성물 총 중량을 기준으로 0.1 중량% 내지 20 중량%로 포함될 수 있다. 상기 함량 범위 내에서 프라이머 피막을 균일한 두께로 형성할 수 있으며, 강한 접착력을 구현할 수 있다. 바람직하게는, 상기 아크릴계 바인더 수지는 조성물 총 중량을 기준으로 0.1 중량% 내지 10 중량%, 0.1 중량% 내지 5 중량%, 0.1 중량% 내지 3 중량%, 0.1 중량% 내지 2 중량%, 0.5 중량% 내지 20 중량%, 0.5 중량% 내지 10 중량%, 0.5 중량% 내지 5 중량%, 0.5 중량% 내지 3 중량% 또는 0.5 중량% 내지 2 중량%로 포함될 수 있다.In some embodiments, the acrylic binder resin may be included in an amount of 0.1% to 20% by weight based on the total weight of the composition. Within the above content range, a primer film can be formed with a uniform thickness and strong adhesion can be realized. Preferably, the acrylic binder resin is 0.1% to 10% by weight, 0.1% to 5% by weight, 0.1% to 3% by weight, 0.1% to 2% by weight, 0.5% by weight based on the total weight of the composition. to 20% by weight, 0.5% to 10% by weight, 0.5% to 5% by weight, 0.5% to 3% by weight, or 0.5% to 2% by weight.
일부 구현예들에 있어서, 상기 다가 아지리딘계 화합물은 조성물 총 중량에 대하여 0.01 중량% 이상 및 3 중량% 미만으로 포함될 수 있다. 상기 함량 범위에서 기재와 하드코팅층의 접합력을 향상시킬 수 있다. 바람직하게는, 상기 다가 아지리딘계 화합물은 조성물 총 중량에 대하여 0.01 중량% 내지 2.5 중량%, 0.01 중량% 내지 2 중량%, 0.03 중량% 내지 2.5 중량% 또는 0.03 중량% 내지 2 중량%로 포함될 수 있다.In some embodiments, the polyvalent aziridine-based compound may be included in an amount of 0.01% by weight or more and less than 3% by weight based on the total weight of the composition. It is possible to improve the bonding strength between the substrate and the hard coating layer in the above content range. Preferably, the polyhydric aziridine-based compound may be included in an amount of 0.01 wt% to 2.5 wt%, 0.01 wt% to 2 wt%, 0.03 wt% to 2.5 wt%, or 0.03 wt% to 2 wt% based on the total weight of the composition. .
일부 구현예들에 있어서, 상기 프라이머 조성물 중 상기 다가 아지리딘계 화합물은 상기 아크릴계 바인더 수지보다 적은 양으로 포함될 수 있다. 이 경우, 기재와 하드코팅층 간의 접합력을 향상시킬 수 있다.In some embodiments, the polyvalent aziridine-based compound in the primer composition may be included in a smaller amount than the acrylic binder resin. In this case, bonding strength between the substrate and the hard coating layer may be improved.
일부 구현예들에 있어서, 상기 용매는 상기 프라이머 조성물의 잔량으로 포함될 수 있다.In some embodiments, the solvent may be included in the remaining amount of the primer composition.
상기 용매는 에테르계 화합물, 케톤계 화합물 및 에스테르계 화합물 중 적어도 하나의 비양자성 극성 용매 또는 방향족 탄화수소계 화합물을 포함하는 비극성 용매를 포함할 수 있다. 상기 에테르계 화합물은 폴리올 화합물의 에테르 화합물을 포함할 수 있으며, 예를 들면, 프로필렌 글리콜 n-프로필 에테르(PNP) 등을 포함할 수 있다. 상기 케톤계 화합물은 메틸 이소부틸 케톤 등을 포함할 수 있다. 상기 에스테르계 화합물은 아세테이트계 화합물을 포함할 수 있으며, 예를 들면, n-부틸 아세테이트 등을 포함할 수 있다. 상기 탄화수소계 화합물은 방향족 탄화수소계 화합물을 포함할 수 있으며, 예를 들면, 벤젠, 톨루엔, 자일렌 등을 포함할 수 있다. 예시된 용매들은 2종 이상이 혼합되어 사용될 수 있다.The solvent may include an aprotic polar solvent of at least one of an ether-based compound, a ketone-based compound, and an ester-based compound, or a non-polar solvent including an aromatic hydrocarbon-based compound. The ether-based compound may include an ether compound of a polyol compound, and may include, for example, propylene glycol n-propyl ether (PNP). The ketone-based compound may include methyl isobutyl ketone and the like. The ester-based compound may include an acetate-based compound, for example, n-butyl acetate and the like. The hydrocarbon-based compound may include an aromatic hydrocarbon-based compound, and may include, for example, benzene, toluene, xylene, and the like. Two or more of the exemplified solvents may be used in combination.
적층 필름laminated film
도 1 내지 3은 각각 일 구현예에 따른 디스플레이 장치의 개략적인 분해도, 사시도 및 단면도들이다. 도 3은 도 2의 A-A' 방향을 따라 절단된 단면도이다. 도 1 내지 도 3을 참조하면, 구현예들에 따른 디스플레이 장치는 적층 필름(100) 및 디스플레이 패널을 포함할 수 있다.1 to 3 are schematic exploded views, perspective views, and cross-sectional views of a display device according to an embodiment, respectively. FIG. 3 is a cross-sectional view taken along the A-A′ direction of FIG. 2 . Referring to FIGS. 1 to 3 , a display device according to embodiments may include a laminated film 100 and a display panel.
적층 필름(100)은 기재(130), 기재(130) 상에 형성된 프라이머층(120) 및 프라이머층(120) 상에 형성된 하드코팅층(110)을 포함할 수 있다. 프라이머층(120)은 상술한 프라이머 조성물로부터 형성될 수 있다. 프라이머층(120)은 기재(130) 상에 직접 형성되고, 하드코팅층(110)은 프라이머층(120) 상에 직접 형성될 수 있다.The laminated film 100 may include a substrate 130 , a primer layer 120 formed on the substrate 130 , and a hard coating layer 110 formed on the primer layer 120 . The primer layer 120 may be formed from the above-described primer composition. The primer layer 120 may be directly formed on the substrate 130 , and the hard coating layer 110 may be directly formed on the primer layer 120 .
기재(130)는 고분자 필름을 포함할 수 있다. 일부 구현예들에 있어서, 기재(130)는 폴리에틸렌테레프탈레이트, 폴리에틸렌이소프탈레이트, 폴리에틸렌나프탈레이트, 폴리부틸렌테레프탈레이트 등의 폴리에스테르계 수지; 디아세틸셀룰로오스, 트리아세틸셀룰로오스 등의 셀룰로오스계 수지; 폴리카보네이트계 수지; 폴리메틸(메타)아크릴레이트, 폴리에틸(메타)아크릴레이트 등의 아크릴계 수지; 폴리스티렌, 아크릴로니트릴-스티렌 공중합체 등의 스티렌계 수지; 폴리에틸렌, 폴리프로필렌, 시클로계 또는 노보넨 구조를 갖는 폴리올레핀, 에틸렌-프로필렌 공중합체 등의 폴리올레핀계 수지; 염화비닐계 수지; 나일론, 방향족 폴리아미드 등의 아미드계 수지; 이미드계 수지; 폴리아마이드이미드계 수지; 폴리에테르술폰계 수지; 폴리우레탄계 수지; 술폰계 수지; 폴리에테르에테르케톤계 수지; 황화 폴리페닐렌계 수지; 비닐알코올계 수지; 염화비닐리덴계 수지; 비닐부티랄계 수지; 알릴레이트계 수지; 폴리옥시메틸렌계 수지; 에폭시계 수지 등을 포함할 수 있다. 이들은 단독으로 혹은 2 이상이 조합되어 사용될 수 있다.The substrate 130 may include a polymer film. In some embodiments, the substrate 130 may be a polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; cellulosic resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate-based resin; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrenic resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin-based resins such as polyethylene, polypropylene, polyolefins having a cyclo-based or norbornene structure, and ethylene-propylene copolymers; vinyl chloride-based resins; amide resins such as nylon and aromatic polyamide; imide-based resins; polyamideimide-based resins; polyethersulfone-based resins; polyurethane-based resin; sulfone-based resins; polyether ether ketone-based resins; sulfurized polyphenylene-based resins; vinyl alcohol-based resin; vinylidene chloride-based resins; vinyl butyral-based resins; allylate-based resins; polyoxymethylene-based resin; Epoxy-based resins and the like may be included. These may be used alone or in combination of two or more.
상기 폴리이미드계 수지는 디아민 화합물 및 디안하이드라이드 화합물을 포함하는 반응물들이 동시 또는 순차적으로 반응하여 형성될 수 있다. 구체적으로, 상기 폴리이미드계 수지는 디아민 화합물 및 디안하이드라이드 화합물이 중합하여 형성된 폴리이미드계 중합체를 포함할 수 있다. 상기 폴리이미드계 수지는 디아민 화합물과 디안하이드라이드 화합물의 중합으로부터 유래하는 이미드(imide) 반복단위를 포함할 수 있다.The polyimide-based resin may be formed by simultaneously or sequentially reacting reactants including a diamine compound and a dianhydride compound. Specifically, the polyimide-based resin may include a polyimide-based polymer formed by polymerization of a diamine compound and a dianhydride compound. The polyimide-based resin may include an imide repeating unit derived from polymerization of a diamine compound and a dianhydride compound.
상기 폴리이미드계 수지는 디카르보닐 화합물을 더 포함하여 중합될 수 있으며, 상기 디아민 화합물과 디카르보닐 화합물의 중합으로부터 유래하는 아마이드(amide) 반복단위를 포함하는 폴리아마이드-이미드 중합체를 포함할 수 있다. The polyimide-based resin may be polymerized by further including a dicarbonyl compound, and may include a polyamide-imide polymer including an amide repeating unit derived from polymerization of the diamine compound and the dicarbonyl compound. can
상기 디아민 화합물은 특별히 제한되지 아니하나, 예를 들어, 방향족 구조를 포함하는 방향족 디아민 화합물일 수 있다. 예를 들어, 상기 디아민 화합물은 하기 화학식 1의 화합물일 수 있다. The diamine compound is not particularly limited, but may be, for example, an aromatic diamine compound containing an aromatic structure. For example, the diamine compound may be a compound represented by Formula 1 below.
<화학식 1><Formula 1>
Figure PCTKR2022007602-appb-I000003
Figure PCTKR2022007602-appb-I000003
상기 화학식 1 에 있어서, In Formula 1,
E는 치환 또는 비치환된 2가의 C6-C30 지방족 고리기, 치환 또는 비치환된 2가의 C4-C30 헤테로 지방족 고리기, 치환 또는 비치환된 2가의 C6-C30 방향족 고리기, 치환 또는 비치환된 2가의 C4-C30 헤테로 방향족 고리기, 치환 또는 비치환된 C1-C30 알킬렌기, 치환 또는 비치환된 C2-C30 알케닐렌기, 치환 또는 비치환된 C2-C30 알키닐렌기, -O-, -S-, -C(=O)-, -CH(OH)-, -S(=O)2-, -Si(CH3)2-, -C(CH3)2- 및 -C(CF3)2- 중에서 선택될 수 있다.E is a substituted or unsubstituted divalent C 6 -C 30 aliphatic ring group, a substituted or unsubstituted divalent C 4 -C 30 heteroaliphatic ring group, or a substituted or unsubstituted divalent C 6 -C 30 aromatic ring group , substituted or unsubstituted divalent C 4 -C 30 heteroaromatic ring group, substituted or unsubstituted C 1 -C 30 alkylene group, substituted or unsubstituted C 2 -C 30 alkenylene group, substituted or unsubstituted C 2 -C 30 Alkynylene group, -O-, -S-, -C(=O)-, -CH(OH)-, -S(=O) 2 -, -Si(CH 3 ) 2 -, It may be selected from -C(CH 3 ) 2 - and -C(CF 3 ) 2 -.
e는 1 내지 5의 정수 중에서 선택되고, e가 2 이상일 경우 E는 서로 동일하거나 상이할 수 있다.e is selected from an integer of 1 to 5, and when e is 2 or more, E may be the same as or different from each other.
상기 화학식 1의 (E)e는 하기 화학식 1-1a 내지 1-14a로 표시되는 그룹 중에서 선택될 수 있으나, 이에 한정되는 것은 아니다.(E) e of Formula 1 may be selected from the groups represented by Formulas 1-1a to 1-14a, but is not limited thereto.
Figure PCTKR2022007602-appb-I000004
Figure PCTKR2022007602-appb-I000004
구체적으로, 상기 화학식 1의 (E)e는 하기 화학식 1-1b 내지 1-13b로 표시되는 그룹 중에서 선택될 수 있으나, 이에 한정되는 것은 아니다:Specifically, (E) e of Formula 1 may be selected from the groups represented by Formulas 1-1b to 1-13b below, but is not limited thereto:
Figure PCTKR2022007602-appb-I000005
Figure PCTKR2022007602-appb-I000005
더욱 구체적으로, 상기 화학식 1의 (E)e는 상기 화학식 1-6b로 표시되는 그룹일 수 있다.More specifically, (E) e in Chemical Formula 1 may be a group represented by Chemical Formula 1-6b.
일 구현예에서, 상기 디아민 화합물은 불소함유 치환기를 갖는 화합물을 포함할 수 있다. 또는, 상기 디아민 화합물은 불소함유 치환기를 갖는 화합물로 이루어질 수 있다. 이 때, 상기 불소함유 치환기는 불소화 탄화수소기일 수 있고, 구체적으로는 트리플루오로메틸기일 수 있으나, 이에 한정되는 것은 아니다.In one embodiment, the diamine compound may include a compound having a fluorine-containing substituent. Alternatively, the diamine compound may be composed of a compound having a fluorine-containing substituent. In this case, the fluorine-containing substituent may be a fluorinated hydrocarbon group, specifically a trifluoromethyl group, but is not limited thereto.
일 구현예에서, 상기 디아민 화합물은 1 종의 디아민 화합물을 사용할 수 있다. 즉, 상기 디아민 화합물은 단일 성분으로 이루어질 수 있다.In one embodiment, the diamine compound may use one type of diamine compound. That is, the diamine compound may be composed of a single component.
예를 들어, 상기 디아민 화합물은 하기와 같은 구조를 갖는 2,2'-비스(트리플루오로메틸)-4,4'-디아미노바이페닐(2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, TFDB)을 포함할 수 있으나, 이에 한정되는 것은 아니다.For example, the diamine compound is 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl (2,2'-bis (trifluoromethyl) -4,4 having the following structure) '-diaminobiphenyl, TFDB), but is not limited thereto.
Figure PCTKR2022007602-appb-I000006
Figure PCTKR2022007602-appb-I000006
상기 디안하이드라이드 화합물은 복굴절값이 낮기 때문에 상기 폴리이미드계 수지를 포함하는 필름의 투과도와 같은 광학 물성의 향상에 기여할 수 있다.Since the dianhydride compound has a low birefringence value, it may contribute to improving optical properties such as transmittance of the film including the polyimide-based resin.
상기 디안하이드라이드 화합물은 특별히 제한되지 아니하나, 방향족 구조를 포함하는 방향족 디안하이드라이드 화합물일 수 있다. 예를 들어, 상기 방향족 디안하이드라이드 화합물은 하기 화학식 2의 화합물일 수 있다. The dianhydride compound is not particularly limited, but may be an aromatic dianhydride compound having an aromatic structure. For example, the aromatic dianhydride compound may be a compound represented by Formula 2 below.
<화학식 2><Formula 2>
Figure PCTKR2022007602-appb-I000007
Figure PCTKR2022007602-appb-I000007
상기 화학식 2에 있어서, G는 치환 또는 비치환된 4가의 C6-C30 지방족 고리기, 치환 또는 비치환된 4가의 C4-C30 헤테로 지방족 고리기, 치환 또는 비치환된 4가의 C6-C30 방향족 고리기, 치환 또는 비치환된 4가의 C4-C30 헤테로 방향족 고리기이고, 상기 지방족 고리기, 상기 헤테로 지방족 고리기, 상기 방향족 고리기 또는 상기 헤테로 방향족 고리기가 단독으로 존재하거나, 서로 접합되어 축합고리를 형성하거나, 치환 또는 비치환된 C1-C30 알킬렌기, 치환 또는 비치환된 C2-C30 알케닐렌기, 치환 또는 비치환된 C2-C30 알키닐렌기, -O-, -S-, -C(=O)-, -CH(OH)-, -S(=O)2-, -Si(CH3)2-, -C(CH3)2- 및 -C(CF3)2- 중에서 선택된 연결기에 의해 연결되어 있다.In Formula 2, G is a substituted or unsubstituted tetravalent C 6 -C 30 aliphatic ring group, a substituted or unsubstituted tetravalent C 4 -C 30 heteroaliphatic ring group, or a substituted or unsubstituted tetravalent C 6 -C 30 An aromatic ring group, a substituted or unsubstituted tetravalent C 4 -C 30 heteroaromatic ring group, and the aliphatic ring group, the heteroaliphatic ring group, the aromatic ring group, or the heteroaromatic ring group exists alone or , bonded to each other to form a condensed ring, a substituted or unsubstituted C 1 -C 30 alkylene group, a substituted or unsubstituted C 2 -C 30 alkenylene group, or a substituted or unsubstituted C 2 -C 30 alkynylene group , -O-, -S-, -C(=O)-, -CH(OH)-, -S(=O) 2 -, -Si(CH 3 ) 2 -, -C(CH 3 ) 2 - and -C(CF 3 ) 2 -.
상기 화학식 2의 G는 하기 화학식 2-1a 내지 2-9a로 표시되는 그룹 중에서 선택될 수 있으나, 이에 한정되는 것은 아니다.G in Formula 2 may be selected from groups represented by Formulas 2-1a to 2-9a, but is not limited thereto.
Figure PCTKR2022007602-appb-I000008
Figure PCTKR2022007602-appb-I000008
예를 들어, 상기 화학식 2의 G는 상기 화학식 2-8a로 표시되는 그룹일 수 있다.For example, G in Chemical Formula 2 may be a group represented by Chemical Formula 2-8a.
일 구현예에서, 상기 디안하이드라이드 화합물은 불소함유 치환기를 갖는 화합물을 포함할 수 있다. 또는, 상기 디안하이드라이드 화합물은 불소함유 치환기를 갖는 화합물로 이루어질 수 있다. 이 때, 상기 불소함유 치환기는 불소화 탄화수소기일 수 있고, 구체적으로는 트리플루오로메틸기일 수 있으나, 이에 한정되는 것은 아니다.In one embodiment, the dianhydride compound may include a compound having a fluorine-containing substituent. Alternatively, the dianhydride compound may be composed of a compound having a fluorine-containing substituent. In this case, the fluorine-containing substituent may be a fluorinated hydrocarbon group, specifically a trifluoromethyl group, but is not limited thereto.
다른 구현예에서, 상기 디안하이드라이드 화합물은 1종의 단일 성분 또는 2종의 혼합 성분으로 이루어질 수 있다.In another embodiment, the dianhydride compound may consist of one single component or two mixed components.
예를 들어, 상기 디안하이드라이드 화합물은 하기와 같은 구조를 갖는 2,2'-비스(3,4-디카복시페닐)헥사플루오로프로판 디안하이드라이드(2,2'-bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, 6-FDA)를 포함할 수 있으나, 이에 한정되는 것은 아니다.For example, the dianhydride compound is 2,2'-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride having the following structure (2,2'-bis- (3,4 -dicarboxyphenyl) hexafluoropropane dianhydride, 6-FDA), but is not limited thereto.
Figure PCTKR2022007602-appb-I000009
Figure PCTKR2022007602-appb-I000009
상기 디아민 화합물 및 상기 디안하이드라이드 화합물이 중합하여 폴리아믹산을 생성할 수 있다.Polyamic acid may be produced by polymerization of the diamine compound and the dianhydride compound.
이어서, 상기 폴리아믹산은 탈수 반응을 통하여 폴리이미드로 전환될 수 있다.Subsequently, the polyamic acid may be converted into polyimide through a dehydration reaction.
상기 폴리이미드는 하기 화학식 A로 표시되는 반복단위를 포함할 수 있다.The polyimide may include a repeating unit represented by Formula A below.
<화학식 A><Formula A>
Figure PCTKR2022007602-appb-I000010
Figure PCTKR2022007602-appb-I000010
상기 화학식 A에 있어서, E, G 및 e에 대한 설명은 전술한 바와 같다.In Formula A, descriptions of E, G and e are as described above.
예를 들어, 상기 폴리이미드는 하기 화학식 A-1로 표시되는 반복단위를 포함할 수 있으나, 이에 한정되는 것은 아니다.For example, the polyimide may include a repeating unit represented by Formula A-1 below, but is not limited thereto.
<화학식 A-1><Formula A-1>
Figure PCTKR2022007602-appb-I000011
Figure PCTKR2022007602-appb-I000011
상기 화학식 A-1의 n은 1 내지 400의 정수일 수 있다.In Formula A-1, n may be an integer from 1 to 400.
상기 디카르보닐 화합물은 특별히 제한되지 아니하나, 예를 들어, 하기 화학식 3의 화합물일 수 있다.The dicarbonyl compound is not particularly limited, but may be, for example, a compound represented by Formula 3 below.
<화학식 3><Formula 3>
Figure PCTKR2022007602-appb-I000012
Figure PCTKR2022007602-appb-I000012
상기 화학식 3에 있어서, In Formula 3,
J는 치환 또는 비치환된 2가의 C6-C30 지방족 고리기, 치환 또는 비치환된 2가의 C4-C30 헤테로 지방족 고리기, 치환 또는 비치환된 2가의 C6-C30 방향족 고리기, 치환 또는 비치환된 2가의 C4-C30 헤테로 방향족 고리기, 치환 또는 비치환된 C1-C30 알킬렌기, 치환 또는 비치환된 C2-C30 알케닐렌기, 치환 또는 비치환된 C2-C30 알키닐렌기, -O-, -S-, -C(=O)-, -CH(OH)-, -S(=O)2-, -Si(CH3)2-, -C(CH3)2- 및 -C(CF3)2- 중에서 선택될 수 있다.J is a substituted or unsubstituted divalent C 6 -C 30 aliphatic ring group, a substituted or unsubstituted divalent C 4 -C 30 heteroaliphatic ring group, or a substituted or unsubstituted divalent C 6 -C 30 aromatic ring group , substituted or unsubstituted divalent C 4 -C 30 heteroaromatic ring group, substituted or unsubstituted C 1 -C 30 alkylene group, substituted or unsubstituted C 2 -C 30 alkenylene group, substituted or unsubstituted C 2 -C 30 Alkynylene group, -O-, -S-, -C(=O)-, -CH(OH)-, -S(=O) 2 -, -Si(CH 3 ) 2 -, It may be selected from -C(CH 3 ) 2 - and -C(CF 3 ) 2 -.
j는 1 내지 5의 정수 중에서 선택되고, j가 2 이상일 경우 J는 서로 동일하거나 상이할 수 있다.j is selected from an integer of 1 to 5, and when j is 2 or more, J may be the same as or different from each other.
X는 할로겐 원자이다. 구체적으로, X는 F, Cl, Br, I 등일 수 있다. 더욱 구체적으로, X는 Cl일 수 있으나, 이에 한정되는 것은 아니다.X is a halogen atom. Specifically, X may be F, Cl, Br, I or the like. More specifically, X may be Cl, but is not limited thereto.
상기 화학식 3의 (J)j는 하기 화학식 3-1a 내지 3-14a로 표시되는 그룹 중에서 선택될 수 있으나, 이에 한정되는 것은 아니다.(J) j in Chemical Formula 3 may be selected from the groups represented by Chemical Formulas 3-1a to 3-14a, but is not limited thereto.
Figure PCTKR2022007602-appb-I000013
Figure PCTKR2022007602-appb-I000013
구체적으로, 상기 화학식 3의 (J)j는 하기 화학식 3-1b 내지 3-8b로 표시되는 그룹 중에서 선택될 수 있으나, 이에 한정되는 것은 아니다:Specifically, (J) j in Chemical Formula 3 may be selected from the groups represented by Chemical Formulas 3-1b to 3-8b, but is not limited thereto:
Figure PCTKR2022007602-appb-I000014
Figure PCTKR2022007602-appb-I000014
더욱 구체적으로, 상기 화학식 3의 (J)j는 상기 화학식 3-1b로 표시되는 그룹, 상기 화학식 3-2b로 표시되는 그룹 또는 3-3b로 표시되는 그룹일 수 있다.More specifically, (J) j in Chemical Formula 3 may be a group represented by Chemical Formula 3-1b, a group represented by Chemical Formula 3-2b, or a group represented by 3-3b.
일 구현예에서, 상기 디카르보닐 화합물은 서로 상이한 적어도 2 종의 디카르보닐 화합물을 혼합 사용할 수 있다. 상기 디카르보닐 화합물이 2 종 이상 사용되는 경우, 상기 디카르보닐 화합물은 상기 화학식 3에서 (J)j가 상기 화학식 3-1b 내지 3-8b로 표시되는 그룹 중에서 선택되는 2종 이상이 사용될 수 있다.In one embodiment, at least two dicarbonyl compounds that are different from each other may be mixed and used as the dicarbonyl compound. When two or more dicarbonyl compounds are used, two or more dicarbonyl compounds selected from the groups in which (J) j in Formula 3 are represented by Formulas 3-1b to 3-8b may be used. have.
다른 구현예에서, 상기 디카르보닐 화합물은 방향족 구조를 포함하는 방향족 디카르보닐 화합물일 수 있다.In another embodiment, the dicarbonyl compound may be an aromatic dicarbonyl compound including an aromatic structure.
예를 들어, 상기 디카르보닐 화합물은 제1 디카르보닐 화합물 및/또는 상기 제1 디카르보닐 화합물과 상이한 제2 디카르보닐 화합물을 포함할 수 있다.For example, the dicarbonyl compound may include a first dicarbonyl compound and/or a second dicarbonyl compound different from the first dicarbonyl compound.
상기 제1 디카르보닐 화합물 및 상기 제2 디카르보닐 화합물은 각각 방향족 디카르보닐 화합물(aromatic dicarbonyl compound)일 수 있다.The first dicarbonyl compound and the second dicarbonyl compound may each be an aromatic dicarbonyl compound.
상기 제1 디카르보닐 화합물 및 상기 제2 디카르보닐 화합물이 서로 상이한 방향족 디카르보닐 화합물일 수 있으나, 이에 한정되는 것이 아니다.The first dicarbonyl compound and the second dicarbonyl compound may be different aromatic dicarbonyl compounds, but are not limited thereto.
상기 제1 디카르보닐 화합물 및 상기 제2 디카르보닐 화합물이 각각 방향족 디카르보닐 화합물인 경우, 벤젠 고리를 포함하고 있으므로, 제조된 폴리아마이드-이미드 수지를 포함하는 필름의 표면 경도 및 인장 강도와 같은 기계적 물성을 향상시키는데 기여할 수 있다.When the first dicarbonyl compound and the second dicarbonyl compound are aromatic dicarbonyl compounds, respectively, since they contain a benzene ring, surface hardness and tensile strength of the film containing the prepared polyamide-imide resin It can contribute to improving mechanical properties such as
상기 디카르보닐 화합물은 하기와 같은 구조를 갖는 테레프탈로일클로라이드(terephthaloyl chloride, TPC), 이소프탈로일클로라이드(isophthaloyl chloride, IPC), 1'-비페닐-4,4'-디카르보닐디클로라이드(1,1'-biphenyl-4,4'-dicarbonyl dichloride, BPDC) 또는 이의 조합을 포함할 수 있으나, 이에 한정되는 것은 아니다.The dicarbonyl compound has the following structures: terephthaloyl chloride (TPC), isophthaloyl chloride (IPC), 1'-biphenyl-4,4'-dicarbonyldichloride ( 1,1'-biphenyl-4,4'-dicarbonyl dichloride (BPDC) or a combination thereof, but is not limited thereto.
Figure PCTKR2022007602-appb-I000015
Figure PCTKR2022007602-appb-I000015
예를 들어, 상기 제1 디카르보닐 화합물은 BPDC를 포함할 수 있고, 상기 제2 디카르보닐 화합물은 TPC를 포함할 수 있으나, 이에 한정되는 것은 아니다.For example, the first dicarbonyl compound may include BPDC, and the second dicarbonyl compound may include TPC, but are not limited thereto.
구체적으로, 상기 제1 디카르보닐 화합물로서 BPDC, 상기 제2 디카르보닐 화합물로서 TPC를 적절하게 조합하여 사용하는 경우, 제조된 폴리아마이드-이미드 수지를 포함하는 필름은 높은 내산화성을 가질 수 있다.Specifically, when BPDC as the first dicarbonyl compound and TPC as the second dicarbonyl compound are appropriately used in combination, the prepared film including the polyamide-imide resin may have high oxidation resistance. have.
또는 상기 제1 디카르보닐 화합물은 IPC(isophthaloyl chloride)를 포함할 수 있고, 상기 제2 디카르보닐 화합물은 TPC를 포함할 수 있으나, 이에 한정되는 것은 아니다.Alternatively, the first dicarbonyl compound may include isophthaloyl chloride (IPC), and the second dicarbonyl compound may include TPC, but is not limited thereto.
구체적으로, 상기 제1 디카르보닐 화합물로서 IPC, 상기 제2 디카르보닐 화합물로서 TPC를 적절하게 조합하여 사용하는 경우, 제조된 폴리아마이드-이미드 수지를 포함하는 필름이 높은 내산화성을 가질 수 있으며, 제조 비용이 절감될 수 있다. Specifically, when IPC as the first dicarbonyl compound and TPC as the second dicarbonyl compound are appropriately used in combination, the prepared film including the polyamide-imide resin may have high oxidation resistance. And the manufacturing cost can be reduced.
상기 디아민 화합물 및 상기 디카르보닐 화합물이 중합하여 하기 화학식 B로 표시되는 반복단위를 형성할 수 있다.The diamine compound and the dicarbonyl compound may be polymerized to form a repeating unit represented by Chemical Formula B below.
<화학식 B><Formula B>
Figure PCTKR2022007602-appb-I000016
Figure PCTKR2022007602-appb-I000016
상기 화학식 B에 있어서, E, J, e 및 j에 대한 설명은 전술한 바와 같다.In Formula B, descriptions of E, J, e and j are as described above.
예를 들면, 상기 디아민 화합물 및 상기 디카르보닐 화합물이 중합하여 화학식 B-1 및 B-2로 표시되는 아마이드(amide) 반복단위를 형성할 수 있다.For example, the diamine compound and the dicarbonyl compound may be polymerized to form amide repeating units represented by Chemical Formulas B-1 and B-2.
<화학식 B-1><Formula B-1>
Figure PCTKR2022007602-appb-I000017
Figure PCTKR2022007602-appb-I000017
상기 화학식 B-1의 x는 1 내지 400의 정수이다.In Formula B-1, x is an integer from 1 to 400.
<화학식 B-2><Formula B-2>
Figure PCTKR2022007602-appb-I000018
Figure PCTKR2022007602-appb-I000018
상기 화학식 B-2의 y는 1 내지 400의 정수이다.In Formula B-2, y is an integer from 1 to 400.
상기 폴리이미드계 필름은 필러를 포함할 수 있다.The polyimide-based film may include a filler.
상기 필러는 황산바륨, 실리카 및 탄산칼슘으로 이루어진 군으로부터 선택된 1종 이상일 수 있다. 상기 폴리이미드계 필름은 상기 필러를 포함함으로써, 조도 및 권취성을 향상시킬 수 있음은 물론, 필름 제작 시 주행성 및 스크래치 개선 효과를 향상시킬 수 있다.The filler may be at least one selected from the group consisting of barium sulfate, silica and calcium carbonate. By including the filler, the polyimide-based film can improve roughness and winding properties, as well as improve running properties and scratch improvement effects during film production.
상기 필러의 입경은 0.01㎛ 이상 내지 1.0㎛ 미만일 수 있다. 예를 들어, 상기 필러의 입경은 0.05㎛ 내지 0.9㎛ 또는 0.1㎛ 내지 0.8㎛일 수 있으나, 이에 한정되는 것은 아니다.The particle diameter of the filler may be greater than or equal to 0.01 μm and less than 1.0 μm. For example, the particle size of the filler may be 0.05 μm to 0.9 μm or 0.1 μm to 0.8 μm, but is not limited thereto.
상기 폴리이미드계 필름은 상기 폴리이미드계 필름의 총 중량을 기준으로, 상기 필러를 0.01 중량% 내지 3 중량%의 양으로 포함할 수 있다. 예를 들어, 상기 폴리이미드계 필름은 상기 폴리이미드계 필름의 총 중량을 기준으로, 상기 필러를 0.05 중량% 내지 2.5 중량%, 0.1 중량% 내지 2 중량% 또는 0.2 중량% 내지 1.7 중량%의 양으로 포함할 수 있으나, 이에 한정되는 것은 아니다.The polyimide-based film may include the filler in an amount of 0.01 wt % to 3 wt % based on the total weight of the polyimide-based film. For example, the polyimide-based film may contain the filler in an amount of 0.05 wt% to 2.5 wt%, 0.1 wt% to 2 wt%, or 0.2 wt% to 1.7 wt% based on the total weight of the polyimide-based film. It may include, but is not limited thereto.
일 구현예에 따르면, 상기 폴리이미드계 필름의 헤이즈는 3% 이하일 수 있다. 예를 들어, 상기 헤이즈는 2% 이하, 1.5% 이하 또는 1% 이하일 수 있으나, 이에 한정되는 것은 아니다.According to one embodiment, the haze of the polyimide-based film may be 3% or less. For example, the haze may be 2% or less, 1.5% or less, or 1% or less, but is not limited thereto.
일 구현예에 따르면, 상기 폴리이미드계 필름의 황색도(yellow index, YI)는 5 이하일 수 있다. 예를 들어, 상기 황색도가 4 이하, 3.8 이하, 2.8 이하, 2.5 이하, 2.3 이하 또는 2.1 이하일 수 있으나, 이에 한정되는 것은 아니다. According to one embodiment, the yellow index (YI) of the polyimide-based film may be 5 or less. For example, the yellowness may be 4 or less, 3.8 or less, 2.8 or less, 2.5 or less, 2.3 or less, or 2.1 or less, but is not limited thereto.
일 구현예에 따르면, 상기 폴리이미드계 필름의 모듈러스는 5 GPa 이상일 수 있다. 예를 들어, 상기 모듈러스는 5.2 GPa 이상, 5.5 GPa 이상, 6.0 GPa 이상, 10 GPa 이하, 5 GPa 내지 10 GPa 또는 7 GPa 내지 10 GPa일 수 있으나, 이에 한정되는 것은 아니다.According to one embodiment, the modulus of the polyimide-based film may be 5 GPa or more. For example, the modulus may be 5.2 GPa or more, 5.5 GPa or more, 6.0 GPa or more, 10 GPa or less, 5 GPa to 10 GPa, or 7 GPa to 10 GPa, but is not limited thereto.
일 구현예에 따르면, 상기 폴리이미드계 필름의 투과도는 80% 이상일 수 있다. 예를 들어, 상기 투과도는 85% 이상, 88% 이상, 89% 이상, 80% 내지 99%, 80% 내지 99% 또는 85% 내지 99%일 수 있으나, 이에 한정되는 것은 아니다.According to one embodiment, transmittance of the polyimide-based film may be 80% or more. For example, the transmittance may be 85% or more, 88% or more, 89% or more, 80% to 99%, 80% to 99%, or 85% to 99%, but is not limited thereto.
상기 폴리이미드계 필름의 압축 강도는 0.4 kgf/㎛ 이상일 수 있다. 구체적으로, 상기 압축 강도는 0.45 kgf/㎛ 이상 또는 0.46 kgf/㎛ 이상일 수 있으나, 이에 한정되는 것은 아니다.The compressive strength of the polyimide-based film may be 0.4 kgf/㎛ or more. Specifically, the compressive strength may be 0.45 kgf/μm or more or 0.46 kgf/μm or more, but is not limited thereto.
상기 폴리이미드계 필름은 표면 경도는 HB 이상일 수 있다. 구체적으로 상기 표면 경도가 H 이상 또는 2H 이상일 수 있으나, 이에 한정되는 것은 아니다.The surface hardness of the polyimide-based film may be greater than or equal to HB. Specifically, the surface hardness may be H or more or 2H or more, but is not limited thereto.
상기 폴리이미드계 필름은 인장 강도가 15 kgf/mm2 이상일 수 있다. 구체적으로, 상기 인장 강도가 18 kgf/mm2 이상, 20 kgf/mm2 이상, 21 kgf/mm2 이상 또는 22 kgf/mm2 이상일 수 있으나, 이에 한정되는 것은 아니다.The polyimide-based film may have a tensile strength of 15 kgf/mm 2 or more. Specifically, the tensile strength may be 18 kgf/mm 2 or more, 20 kgf/mm 2 or more, 21 kgf/mm 2 or more, or 22 kgf/mm 2 or more, but is not limited thereto.
상기 폴리이미드계 필름은 신도가 15% 이상일 수 있다. 구체적으로, 상기 신도가 16% 이상, 17% 이상 또는 17.5% 이상일 수 있으나, 이에 한정되는 것은 아니다.The polyimide-based film may have an elongation of 15% or more. Specifically, the elongation may be 16% or more, 17% or more, or 17.5% or more, but is not limited thereto.
일 구현예에 따른 기재(130)는, 높은 내산화성을 가지며, 높은 광투과율, 낮은 헤이즈 및 낮은 황색도(YI) 등의 우수한 광학 물성을 확보할 수 있다. 나아가, 우수한 모듈러스, 신율, 인장특성 및 탄성 복원력을 가질 수 있다.The substrate 130 according to one embodiment may have high oxidation resistance and secure excellent optical properties such as high light transmittance, low haze, and low yellowness (YI). Furthermore, it may have excellent modulus, elongation, tensile properties, and elastic restoring force.
기재(130) 상에 상기 프라이머 조성물이 코팅, 건조 및 경화되어 프라이머층(120)을 형성할 수 있다.The primer composition may be coated, dried, and cured on the substrate 130 to form the primer layer 120 .
상기 코팅은 다이코팅 등의 당분야에서 통상적으로 사용되는 방법을 통해 수행될 수 있다.The coating may be performed through a method commonly used in the art, such as die coating.
상기 건조 및 경화는 80℃ 내지 160℃ 온도 조건에서, 1분 내지 20분간 열처리하여 수행될 수 있다, 이 경우, 기재(130)와 하드코팅층(110)을 강하게 결합시킬 수 있는 프라이머층(120)이 형성될 수 있다. 바람직하게는, 상기 온도 조건은 100℃ 내지 140℃일 수 있으며, 열처리 시간은 3분 내지 12분일 수 있다.The drying and curing may be performed by heat treatment at a temperature of 80° C. to 160° C. for 1 minute to 20 minutes. In this case, the primer layer 120 capable of strongly bonding the substrate 130 and the hard coating layer 110 can be formed. Preferably, the temperature condition may be 100° C. to 140° C., and the heat treatment time may be 3 minutes to 12 minutes.
일부 구현예들에 있어서, 프라이머층(120)의 두께는 20 nm 내지 200 nm일 수 있다. 프라이머층(120)이 상기 두께를 가질 경우, 기재(130), 프라이머층(120) 및 하드코팅층(110) 사이의 결합력이 증가할 수 있다. 바람직하게는, 상기 두께는 20 nm 내지 190 nm, 20 nm 내지 180 nm, 20 nm 내지 160 nm, 20 nm 내지 130 nm, 20 nm 내지 120 nm, 20 nm 내지 110 nm, 20 nm 내지 80 nm, 30 nm 내지 200 nm, 30 nm 내지 190 nm, 30 nm 내지 180 nm, 30 nm 내지 160 nm, 30 nm 내지 130 nm, 30 nm 내지 120 nm, 30 nm 내지 110 nm, 30 nm 내지 100 nm 또는 30 nm 내지 80 nm일 수 있다.In some implementations, the thickness of the primer layer 120 can be between 20 nm and 200 nm. When the primer layer 120 has the above thickness, bonding strength between the substrate 130 , the primer layer 120 and the hard coating layer 110 may increase. Preferably, the thickness is 20 nm to 190 nm, 20 nm to 180 nm, 20 nm to 160 nm, 20 nm to 130 nm, 20 nm to 120 nm, 20 nm to 110 nm, 20 nm to 80 nm, 30 nm nm to 200 nm, 30 nm to 190 nm, 30 nm to 180 nm, 30 nm to 160 nm, 30 nm to 130 nm, 30 nm to 120 nm, 30 nm to 110 nm, 30 nm to 100 nm or 30 nm to may be 80 nm.
도 3을 참조하면, 프라이머층(120)은 제1 면(122) 및 제2 면(124)을 포함한다. 제1 면(122)은 하드코팅층(110)에 대향되는 면으로, 프라이머층(120)과 하드코팅층(110)의 계면으로 제공될 수 있다.Referring to FIG. 3 , the primer layer 120 includes a first surface 122 and a second surface 124 . The first surface 122 is a surface opposite to the hard coating layer 110 and may be provided as an interface between the primer layer 120 and the hard coating layer 110 .
제2 면(124)은 기재(130)에 대향되는 면으로, 제2 면(124)은 프라이머층(120)과 하드코팅층(110)이 접하는 면의 반대에 위치할 수 있다. 제2 면(124)은 프라이머층(120)과 기재(130)의 계면으로 제공될 수 있다.The second surface 124 is a surface facing the base material 130 , and the second surface 124 may be positioned opposite to a surface where the primer layer 120 and the hard coating layer 110 come into contact. The second surface 124 may serve as an interface between the primer layer 120 and the substrate 130 .
하드코팅층(110)은 프라이머층(120) 상에 코팅되어 형성될 수 있다. 하드코팅층(110)은 프라이머층(120) 상에 접합될 수 있다.The hard coating layer 110 may be formed by being coated on the primer layer 120 . The hard coating layer 110 may be bonded on the primer layer 120 .
하드코팅층(110)은 경화성 수지를 포함할 수 있다. 구체적으로, 하드코팅층(110)은 경화성 코팅층일 수 있다. The hard coating layer 110 may include a curable resin. Specifically, the hard coating layer 110 may be a curable coating layer.
하드코팅층(110)은 적층 필름(100)의 기계적 물성 및/또는 광학적 물성을 향상시킬 수 있다. 하드코팅층(110)은 방현, 방오, 대전방지 등의 기능을 포함할 수 있다.The hard coating layer 110 may improve mechanical properties and/or optical properties of the laminated film 100 . The hard coating layer 110 may include functions such as antiglare, antifouling, and antistatic.
하드코팅층(110)은 유기 수지 및/또는 첨가제를 포함할 수 있다. The hard coating layer 110 may include an organic resin and/or an additive.
상기 유기 수지는 경화성 수지일 수 있다. 상기 유기 수지는 바인더 수지일 수 있다. 상기 유기 수지는 우레탄 아크릴레이트계 화합물, 아크릴 에스테르계 화합물 및 에폭시 아크릴레이트계 화합물로 이루어진 그룹으로부터 선택된 1종 이상을 포함할 수 있다. 바람직하게는, 상기 유기 수지는 우레탄 아크릴레이트계 화합물 및 아크릴 에스테르계 화합물을 포함할 수 있다.The organic resin may be a curable resin. The organic resin may be a binder resin. The organic resin may include at least one selected from the group consisting of a urethane acrylate-based compound, an acrylic ester-based compound, and an epoxy acrylate-based compound. Preferably, the organic resin may include a urethane acrylate-based compound and an acrylic ester-based compound.
상기 아크릴 에스테르계 화합물은 치환 또는 비치환된 아크릴레이트 및 치환 또는 비치환된 메타크릴레이트로 이루어진 그룹으로부터 선택된 1종 이상일 수 있다.The acrylic ester compound may be at least one selected from the group consisting of substituted or unsubstituted acrylates and substituted or unsubstituted methacrylates.
상기 아크릴 에스테르계 화합물은 1 내지 10개의 관능기를 포함할 수 있다. 상기 우레탄 아크릴레이트계 화합물은 2 내지 15개의 관능기를 포함할 수 있다. 상기 에폭시 아크릴레이트계 화합물은 1 내지 10개의 관능기를 포함할 수 있다.The acrylic ester-based compound may include 1 to 10 functional groups. The urethane acrylate-based compound may include 2 to 15 functional groups. The epoxy acrylate-based compound may include 1 to 10 functional groups.
상기 아크릴 에스테르계 화합물의 예로서는 트리메틸올프로판 트리아크릴레이트(TMPTA), 트리메틸올프로판에톡시 트리아크릴레이트(TMPEOTA), 글리세린 프로폭실화 트리아크릴레이트(GPTA), 펜타에리트리톨 테트라아크릴레이트(PETA), 또는 디펜타에리트리톨 헥사아크릴레이트(DPHA) 등을 들 수 있으나, 이에 제한되지 않는다.Examples of the acrylic ester compound include trimethylolpropane triacrylate (TMPTA), trimethylolpropaneethoxy triacrylate (TMPEOTA), glycerin propoxylated triacrylate (GPTA), pentaerythritol tetraacrylate (PETA), Or dipentaerythritol hexaacrylate (DPHA) and the like, but are not limited thereto.
상기 우레탄 아크릴레이트계 화합물은 우레탄 결합을 반복 단위로 포함하며, 복수 개의 관능기를 가질 수 있다. 상기 우레탄 아크릴레이트계 화합물은 디이소시아네이트 화합물과 폴리올이 반응하여 형성된 우레탄 화합물의 말단이 아크릴레이트기로 치환된 것일 수 있다.The urethane acrylate-based compound includes a urethane bond as a repeating unit and may have a plurality of functional groups. The urethane acrylate-based compound may be one in which a terminal of a urethane compound formed by reacting a diisocyanate compound with a polyol is substituted with an acrylate group.
예를 들면, 상기 디이소시아네이트 화합물은 탄소수 4 내지 12의 직쇄형, 분지형 또는 고리형 지방족 디이소시아네이트 화합물 및 탄소수 6 내지 20의 방향족 디이소시아네이트 화합물 중 적어도 하나를 포함할 수 있다. 상기 폴리올은 2 내지 4개의 하이드록시기(-OH)를 포함하며, 탄소수가 4 내지 12인 직쇄형, 분지형 또는 고리형 지방족 폴리올 화합물 또는 탄소수가 6 내지 20인 방향족 폴리올 화합물일 수 있다.For example, the diisocyanate compound may include at least one of a straight-chain, branched or cyclic aliphatic diisocyanate compound having 4 to 12 carbon atoms and an aromatic diisocyanate compound having 6 to 20 carbon atoms. The polyol includes 2 to 4 hydroxyl groups (-OH) and may be a straight-chain, branched or cyclic aliphatic polyol compound having 4 to 12 carbon atoms or an aromatic polyol compound having 6 to 20 carbon atoms.
상기 아크릴레이트기로의 말단 치환은 이소시아네이트기(-NCO)와 반응할 수 있는 관능기를 갖는 아크릴레이트 화합물에 의해 수행될 수 있다. 예를 들면, 히드록시기, 아민기 등을 갖는 아크릴레이트 화합물이 사용될 수 있으며, 탄소수 2 내지 10의 히드록시알킬 아크릴레이트 화합물 또는 아미노알킬 아크릴레이트 화합물이 사용될 수 있다.Terminal substitution with the acrylate group may be performed by an acrylate compound having a functional group capable of reacting with an isocyanate group (-NCO). For example, an acrylate compound having a hydroxyl group or an amine group may be used, and a hydroxyalkyl acrylate compound or an aminoalkyl acrylate compound having 2 to 10 carbon atoms may be used.
상기 우레탄 아크릴레이트계 화합물의 예로서는 중량평균분자량 1400 내지 25000의 2관능 우레탄 아크릴레이트 올리고머, 중량평균분자량 1700 내지 16000의 3관능 우레탄 아크릴레이트 올리고머, 중량평균분자량 500 내지 2000의 4관능 우레탄 아크릴레이트 올리고머, 중량평균분자량 818 내지 2600의 6관능 우레탄 아크릴레이트 올리고머, 중량평균분자량 2500 내지 5500의 9관능 우레탄 아크릴레이트 올리고머, 중량평균분자량 3200 내지 3900의 10관능 우레탄 아크릴레이트 올리고머 또는 중량평균분자량 2300 내지 20000의 15관능 우레탄 아크릴레이트 올리고머 등을 들 수 있으나, 이에 제한되지 않는다.Examples of the urethane acrylate-based compound include a bifunctional urethane acrylate oligomer having a weight average molecular weight of 1400 to 25000, a trifunctional urethane acrylate oligomer having a weight average molecular weight of 1700 to 16000, a tetrafunctional urethane acrylate oligomer having a weight average molecular weight of 500 to 2000, 15 of hexafunctional urethane acrylate oligomers having a weight average molecular weight of 818 to 2600, 9 functional urethane acrylate oligomers having a weight average molecular weight of 2500 to 5500, 10 functional urethane acrylate oligomers having a weight average molecular weight of 3200 to 3900 or weight average molecular weights of 2300 to 20000 functional urethane acrylate oligomers and the like, but are not limited thereto.
일부 구현예들에 있어서, 상기 우레탄 아크릴레이트 화합물의 유리 전이 온도(Tg)는 -80℃ 내지 100℃, -80℃ 내지 90℃, -80℃ 내지 80℃, -80℃ 내지 70℃, -80℃ 내지 60℃, -70℃ 내지 100℃, -70℃ 내지 90℃, -70℃ 내지 80℃, -70℃ 내지 70℃, -70℃ 내지 60℃, -60℃ 내지 100℃, -60℃ 내지 90℃, -60℃ 내지 80℃, -60℃ 내지 70℃, -60℃ 내지 60℃, -50℃ 내지 100℃, -50℃ 내지 90℃, -50℃ 내지 80℃, -50℃ 내지 70℃ 또는 -50℃ 내지 60℃일 수 있다.In some embodiments, the glass transition temperature (Tg) of the urethane acrylate compound is -80 ° C to 100 ° C, -80 ° C to 90 ° C, -80 ° C to 80 ° C, -80 ° C to 70 ° C, -80 ℃ to 60 ℃, -70 ℃ to 100 ℃, -70 ℃ to 90 ℃, -70 ℃ to 80 ℃, -70 ℃ to 70 ℃, -70 ℃ to 60 ℃, -60 ℃ to 100 ℃, -60 ℃ to 90℃, -60℃ to 80℃, -60℃ to 70℃, -60℃ to 60℃, -50℃ to 100℃, -50℃ to 90℃, -50℃ to 80℃, -50℃ to 70°C or -50°C to 60°C.
상기 에폭시 아크릴레이트계 화합물의 예로서는 중량평균분자량 100 내지 300의 1관능 에폭시 아크릴레이트 올리고머, 중량평균분자량 250 내지 2000의 2관능 에폭시 아크릴레이트 올리고머 또는 중량평균분자량 1000 내지 3000의 4관능 에폭시 아크릴레이트 올리고머 등을 들 수 있으나, 이에 제한되지 않는다.Examples of the epoxy acrylate-based compound include a monofunctional epoxy acrylate oligomer having a weight average molecular weight of 100 to 300, a bifunctional epoxy acrylate oligomer having a weight average molecular weight of 250 to 2000, a tetrafunctional epoxy acrylate oligomer having a weight average molecular weight of 1000 to 3000, and the like. It may include, but is not limited thereto.
상기 아크릴 에스테르계 화합물의 중량 평균 분자량(Mw)은 약 500 내지 약 6,000, 약 500 내지 약 5,000, 약 500 내지 약 4,000, 1000 내지 약 6,000, 약 1000 내지 약 5,000, 약 1000 내지 약 4,000, 1500 내지 약 6,000, 약 1500 내지 약 5,000 또는 약 1500 내지 약 4,000 의 범위일 수 있다.The weight average molecular weight (Mw) of the acrylic ester compound is about 500 to about 6,000, about 500 to about 5,000, about 500 to about 4,000, 1000 to about 6,000, about 1000 to about 5,000, about 1000 to about 4,000, 1500 to about 6,000, about 1500 to about 5,000 or about 1500 to about 4,000.
상기 아크릴 에스테르계 화합물의 아크릴레이트 당량(equivalent weight)은 약 50 g/eq 내지 약 300 g/eq, 약 50 g/eq 내지 약 200 g/eq, 또는 약 50 g/eq 내지 약 150 g/eq 의 범위일 수 있다.The acrylate equivalent weight of the acrylic ester compound is about 50 g/eq to about 300 g/eq, about 50 g/eq to about 200 g/eq, or about 50 g/eq to about 150 g/eq. may be in the range of
상기 에폭시 아크릴레이트계 화합물의 에폭시 당량(equivalent weight)은 약 50 g/eq 내지 약 300 g/eq, 약 50 g/eq 내지 약 200 g/eq, 또는 약 50 g/eq 내지 약 150 g/eq 의 범위일 수 있다.The epoxy equivalent weight of the epoxy acrylate-based compound is about 50 g/eq to about 300 g/eq, about 50 g/eq to about 200 g/eq, or about 50 g/eq to about 150 g/eq. may be in the range of
상기 유기 수지의 함량은 하드코팅층(110)의 총 중량을 기준으로 30 wt% 내지 100 wt%일 수 있다. 구체적으로, 상기 유기 수지의 함량은 하드코팅층(110)의 총 중량을 기준으로 40 중량% 내지 90 중량% 또는 50 중량% 내지 80 중량%일 수 있다.The content of the organic resin may be 30 wt% to 100 wt% based on the total weight of the hard coating layer 110 . Specifically, the content of the organic resin may be 40% to 90% by weight or 50% to 80% by weight based on the total weight of the hard coating layer 110 .
하드코팅층(110)은 선택적으로 필러를 포함할 수 있다. 상기 필러의 예로서는 실리카, 황산 바륨, 징크 옥사이드 또는 알루미나 등을 들 수 있다. 상기 필러의 입자 직경은 1 nm 내지 100 nm일 수 있다. 구체적으로, 상기 필러의 입자 직경은 5 nm 내지 50 nm 또는 10 nm 내지 30 nm 일 수 있다.The hard coating layer 110 may optionally include a filler. Examples of the filler include silica, barium sulfate, zinc oxide or alumina. The particle diameter of the filler may be 1 nm to 100 nm. Specifically, the particle diameter of the filler may be 5 nm to 50 nm or 10 nm to 30 nm.
상기 필러는 서로 다른 입경 분포를 가지는 무기 필러를 포함할 수 있다. 예를 들어, 상기 필러는 d50이 20 nm 내지 35 nm인 제 1 무기 필러 및 d50이 40 nm 내지 130 nm인 제 2 무기 필러를 포함할 수 있다.The filler may include inorganic fillers having different particle diameter distributions. For example, the filler may include a first inorganic filler having a d50 of 20 nm to 35 nm and a second inorganic filler having a d50 of 40 nm to 130 nm.
상기 필러의 함량은 상기 기능층의 총 중량을 기준으로, 약 25 중량% 이상, 약 30 중량% 이상, 또는 약 35 중량% 이상일 수 있다. 또한, 상기 필러의 함량은 상기 기능층의 총 중량을 기준으로, 약 50 wt% 이하, 약 45 wt% 이하, 또는 약 40 wt% 이하일 수 있다.The content of the filler may be about 25% by weight or more, about 30% by weight or more, or about 35% by weight or more based on the total weight of the functional layer. In addition, the content of the filler may be about 50 wt% or less, about 45 wt% or less, or about 40 wt% or less based on the total weight of the functional layer.
바람직하게는, 하드코팅층(110)은 실리카 등의 무기 필러를 포함하지 않을 수 있다. 이 경우, 예를 들면, 기재층과 상술한 조성의 하드코팅층 간의 접합력이 향상될 수 있다.Preferably, the hard coating layer 110 may not include an inorganic filler such as silica. In this case, for example, bonding strength between the base layer and the hard coating layer having the above composition may be improved.
하드코팅층(110)은 광개시제를 더 포함할 수 있다.The hard coating layer 110 may further include a photoinitiator.
상기 광개시제의 예로서는 1-히드록시-시클로헥실-페닐 케톤, 2-하이드록시-2-메틸-1-페닐-1-프로판온, 2-하이드록시-1-[4-(2-하이드록시에톡시)페닐]-2-메틸-1-프로판온, 메틸벤조일포르메이트, α,α-디메톡시-α-페닐아세토페논, 2-벤조일-2-(디메틸아미노)-1-[4-(4-모폴린일)페닐]-1-부타논, 2-메틸-1-[4-(메틸씨오)페닐]-2-(4-모폴린일)-1-프로판온 디페닐(2,4,6-트리메틸벤조일)-포스핀옥사이드, 또는 비스(2,4,6-트리메틸벤조일)-페닐포스핀옥사이드 등을 들 수 있으나, 이에 한정되는 것은 아니다. 또한, 상용 제품으로는 Irgacure 184, Irgacure 500, Irgacure 651, Irgacure 369, Irgacure 907, Darocur 1173, Darocur MBF, Irgacure 819, Darocur TPO, Irgacure 907, Esacure KIP 100F 등을 들 수 있다. 상기 광개시제는 단독으로 또는 서로 다른 2 종 이상을 혼합하여 사용할 수 있다.Examples of the photoinitiator include 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy ) Phenyl] -2-methyl-1-propanone, methylbenzoyl formate, α, α-dimethoxy-α-phenylacetophenone, 2-benzoyl-2- (dimethylamino) -1- [4- (4- Morpholinyl) phenyl] -1-butanone, 2-methyl-1- [4- (methylthio) phenyl] -2- (4-morpholinyl) -1-propanone diphenyl (2,4, 6-trimethylbenzoyl)-phosphine oxide, or bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and the like, but are not limited thereto. In addition, commercial products include Irgacure 184, Irgacure 500, Irgacure 651, Irgacure 369, Irgacure 907, Darocur 1173, Darocur MBF, Irgacure 819, Darocur TPO, Irgacure 907, Esacure KIP 100F, and the like. The photoinitiator may be used alone or in combination of two or more different types.
일부 구현예들에 있어서, 하드코팅층(110)은 방오 첨가제 및 대전방지제 중 적어도 하나를 포함할 수 있다.In some embodiments, the hard coating layer 110 may include at least one of an antifouling additive and an antistatic agent.
상기 방오 첨가제는 불소 치환된 아크릴레이트계 화합물을 포함할 수 있다. 예들 들면, 상기 방오 첨가제는 (퍼플로로헥실)에틸 아크릴레이트 등의 과불화알킬기를 포함하는 아크릴레이트계 화합물을 포함할 수 있다.The antifouling additive may include a fluorine-substituted acrylate-based compound. For example, the antifouling additive may include an acrylate-based compound including a perfluoroalkyl group such as (perfluorohexyl)ethyl acrylate.
상기 대전방지제는 이온계 계면활성제를 포함할 수 있다. 예를 들면, 상기 이온계 계면 활성제는 암모늄 염 또는 4급 알킬암모늄 염 등을 포함할 수 있으며, 상기 암모늄 염 및 4급 알킬암모늄 염은 염화물, 브롬화물 등의 할로겐화물을 포함할 수 있다.The antistatic agent may include an ionic surfactant. For example, the ionic surfactant may include an ammonium salt or a quaternary alkylammonium salt, and the ammonium salt and quaternary alkylammonium salt may include a halide such as chloride or bromide.
비교예에 있어서, 구현예들에 따른 프라이머층을 포함하지 않을 경우, 상기 방오 첨가제와 상기 대전방지제에 의해 방오 및 대전방지 특성이 부여된 하드코팅층은 기재(특히, 폴리이미드계 필름)과의 접합력이 낮을 수 있으며, 이에 따라, 적층 필름이 변형되거나 외부 자극을 받을 때, 하드코팅층이 기재로부터 쉽게 분리될 수 있다.In Comparative Example, when the primer layer according to the embodiments is not included, the hard coating layer having antifouling and antistatic properties provided by the antifouling additive and the antistatic agent has adhesive strength with a substrate (in particular, a polyimide-based film). This may be low, and thus, when the laminated film is deformed or subjected to an external stimulus, the hard coat layer can be easily separated from the substrate.
구현예들에 따른 적층 필름(100)의 경우, 상술한 프라이머층(120)을 포함함에 따라, 기재 필름과 방오 및 대전방지 특성을 갖는 하드코팅층 사이의 접합력이 향상될 수 있다.In the case of the laminated film 100 according to embodiments, as the above-described primer layer 120 is included, bonding strength between the base film and the hard coating layer having antifouling and antistatic properties may be improved.
하드코팅층(110)은 계면활성제, UV 흡수제, UV 안정제, 황변 방지제, 레벨링제 또는 색상값 개선을 위한 염료 등의 기타 첨가제를 포함할 수 있다. 또한, 상기 첨가제의 함량은 하드코팅층(110)의 물성을 저하 시키지 않는 범위 내에서 다양하게 조절될 수 있다. 예를 들어, 상기 첨가제의 함량은 하드코팅층(110)을 기준으로, 약 0.01 wt% 내지 약 10 wt%로 포함될 수 있으나, 이에 한정되는 것은 아니다.The hard coating layer 110 may include other additives such as a surfactant, a UV absorber, a UV stabilizer, an anti-yellowing agent, a leveling agent, or a dye for improving a color value. In addition, the content of the additive may be variously adjusted within a range that does not degrade the physical properties of the hard coating layer 110. For example, the content of the additive may be included in about 0.01 wt% to about 10 wt% based on the hard coating layer 110, but is not limited thereto.
상기 계면 활성제는 1 내지 2 관능성의 불소계 아크릴레이트, 불소계 계면 활성제 또는 실리콘계 계면 활성제일 수 있다. 상기 계면활성제는 하드코팅층(110) 내에 분산 또는 가교되어 있는 형태로 포함될 수 있다.The surfactant may be a mono- or bifunctional fluorine-based acrylate, a fluorine-based surfactant, or a silicone-based surfactant. The surfactant may be included in a dispersed or cross-linked form in the hard coating layer 110 .
상기 UV 흡수제로는 벤조페논계 화합물, 벤조트리아졸계 화합물 또는 트리아진계 화합물 등을 들 수 있고, 상기 UV 안정제로는 테트라메틸 피페리딘(tetramethyl piperidine) 등을 들 수 있다.Examples of the UV absorber include benzophenone-based compounds, benzotriazole-based compounds, and triazine-based compounds, and examples of the UV stabilizer include tetramethyl piperidine.
하드코팅층(110)은 하드코팅 조성물이 프라이머층(120) 상에 도포되고 건조 및 경화되어 형성될 수 있다.The hard coating layer 110 may be formed by applying a hard coating composition on the primer layer 120, drying, and curing.
하드코팅 조성물은 상술한 유기 수지, 광개시제, 방오 첨가제, 대전 방지제, 기타 첨가제 및/또는 용매를 포함할 수 있다.The hard coating composition may include the aforementioned organic resin, photoinitiator, antifouling additive, antistatic agent, other additives and/or solvent.
상기 유기 용매로는 메탄올, 에탄올, 이소프로필알코올, 부탄올과 같은 알코올계 용매; 2-메톡시에탄올, 2-에톡시에탄올, 1-메톡시-2-프로판올과 같은 알콕시 알코올계 용매; 아세톤, 메틸에틸케톤, 메틸이소부틸케톤, 메틸 프로필케톤, 사이클로헥사논과 같은 케톤계 용매; 프로필렌글리콜모노프로필에테르, 프로필렌글리콜모노메틸에테르, 에틸렌글리콜모노에틸에테르, 에틸렌글리콜모노프로필에테르, 에틸렌글리콜모노부틸에테르, 디에틸렌글리콜모노메틸에테르, 디에틸글리콜모노에틸에테르, 디에틸글리콜모노프로필에테르, 디에틸글리콜모노부틸에테르, 디에틸렌글리콜-2-에틸헥실에테르와 같은 에테르계 용매; 벤젠, 톨루엔, 자일렌과 같은 방향족 용매; 등을 단독으로 또는 혼합하여 사용할 수 있다.Examples of the organic solvent include alcohol-based solvents such as methanol, ethanol, isopropyl alcohol, and butanol; alkoxy alcohol solvents such as 2-methoxyethanol, 2-ethoxyethanol, and 1-methoxy-2-propanol; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl propyl ketone, and cyclohexanone; Propylene glycol monopropyl ether, propylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethyl glycol monoethyl ether, diethyl glycol monopropyl ether ether solvents such as diethyl glycol monobutyl ether and diethylene glycol-2-ethylhexyl ether; aromatic solvents such as benzene, toluene, and xylene; etc. can be used individually or in mixture.
상기 유기 용매의 함량은 코팅 조성물의 물성을 저하시키지 않는 범위 내에서 다양하게 조절할 수 있으므로 특별히 제한되지는 않으나, 상기 하드코팅 조성물에 포함되는 성분들 중 고형분에 대하여, 고형분:유기 용매의 중량비가 약 30:70 내지 약 99:1가 되도록 포함될 수 있다. 상기 유기 용매가 상기 범위에 있을 때 적절한 유동성 및 도포성을 가질 수 있다.The content of the organic solvent is not particularly limited as it can be variously adjusted within a range that does not degrade the physical properties of the coating composition, but with respect to the solid content among the components included in the hard coating composition, the solid content: organic solvent weight ratio is about 30:70 to about 99:1. When the organic solvent is within the above range, appropriate fluidity and coating properties may be obtained.
상기 하드코팅 조성물은 10 중량% 내지 30 중량%의 유기 수지, 0.1 중량% 내지 5 중량%의 광개시제, 0.01 중량% 내지 2 중량%의 방오 첨가제 및 0.1 중량% 내지 10 중량%의 대전방지제를 포함할 수 있다. 상기 조성에 따를 경우 하드코팅층(110)의 기계적 특성 및 방오, 대전방지 특성이 함께 향상될 수 있다.The hard coating composition may include 10% to 30% by weight of an organic resin, 0.1% to 5% by weight of a photoinitiator, 0.01% to 2% by weight of an antifouling additive, and 0.1% to 10% by weight of an antistatic agent. can According to the above composition, the mechanical properties and antifouling and antistatic properties of the hard coating layer 110 can be improved together.
상기 하드코팅 조성물은 바코팅 방식, 나이프 코팅방식, 롤 코팅방식, 블레이드 코팅방식, 다이 코팅방식, 마이크로 그라비아 코팅방식, 콤마코팅 방식, 슬롯다이 코팅방식, 립 코팅방식 또는 솔루션 캐스팅(solution casting)방식 등을 통해 프라이머층(120) 상에 도포될 수 있다.The hard coating composition is a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, a micro gravure coating method, a comma coating method, a slot die coating method, a lip coating method, or a solution casting method It may be applied on the primer layer 120 through the like.
이후, 건조 공정을 통해 상기 하드코팅 조성물에 포함된 유기 용매가 제거될 수 있다. 상기 건조 공정은 40℃ 내지 100℃, 바람직하게는, 40℃ 내지 80℃, 50℃ 내지 100℃ 또는 50℃ 내지 80℃ 온도 조건에서 수행될 수 있으며, 약 1분 내지 20분, 바람직하게는 1분 내지 10분 또는 1분 내지 5분 동안 수행될 수 있다.Thereafter, the organic solvent included in the hard coating composition may be removed through a drying process. The drying process may be performed at a temperature of 40°C to 100°C, preferably 40°C to 80°C, 50°C to 100°C, or 50°C to 80°C, for about 1 minute to 20 minutes, preferably 1 minutes to 10 minutes or 1 to 5 minutes.
이후, 상기 하드코팅 조성물층은 광 및/또는 열에 의해서 경화될 수 있다.Then, the hard coating composition layer may be cured by light and/or heat.
경화된 하드코팅층(110)은 약 2㎛ 이상, 또는 약 3㎛ 이상, 예를 들어 약 2㎛ 내지 약 20㎛, 약 2㎛ 내지 약 15㎛, 약 2㎛ 내지 약 10㎛ 또는 약 3㎛ 내지 약 10㎛의 두께를 가질 수 있다.The cured hard coating layer 110 has a thickness of about 2 μm or more, or about 3 μm or more, for example, about 2 μm to about 20 μm, about 2 μm to about 15 μm, about 2 μm to about 10 μm, or about 3 μm to about 3 μm. It may have a thickness of about 10 μm.
일부 구현예들에 있어서, 상기 적층 필름은 JIS K 5600에 따라 측정된 크로스 해치 접착력 테스트 결과 값이 50/100 이상, 70/100 이상, 80/100 이상, 90/100 이상 또는 95/100 이상일 수 있다.In some embodiments, the laminated film may have a cross hatch adhesion test result value measured according to JIS K 5600 of 50/100 or more, 70/100 or more, 80/100 or more, 90/100 or more, or 95/100 or more. have.
디스플레이 장치display device
도 1 내지 3은 각각 일 구현예에 따른 디스플레이 장치의 개략적인 분해도, 사시도 및 단면도들이다. 도 1 내지 도 3을 참조하면, 구현예들에 따른 디스플레이 장치는 적층 필름(100) 및 디스플레이 패널(200)을 포함할 수 있다. 적층 필름(100)은 디스플레이 장치의 커버 윈도우로 제공될 수 있다. 적층 필름(커버 윈도우: 100)은 디스플레이 패널(200)을 기준으로 시인측에 배치되어 디스플레이 패널(200)을 보호할 수 있다.1 to 3 are schematic exploded views, perspective views, and cross-sectional views of a display device according to an embodiment, respectively. Referring to FIGS. 1 to 3 , a display device according to embodiments may include a laminated film 100 and a display panel 200 . The laminated film 100 may be provided as a cover window of a display device. The laminated film (cover window: 100) may be disposed on the viewer side with respect to the display panel 200 to protect the display panel 200.
일부 구현예들에 있어서, 하드코팅층(110)에 상기 방오 첨가제 및 상기 대전방지제가 포함될 경우, 디스플레이 장치가 방오 및 대전방지 특성을 가질 수 있으며, 상술한 프라이머층(120)이 하드코팅층(110)과 기재(130) 사이에 형성될 경우, 방오/대전방지 하드코팅층과 기재가 강하게 접합되어 반복 변형에도 내구성이 확보된 디스플레이 장치가 제공될 수 있다.In some embodiments, when the antifouling additive and the antistatic agent are included in the hard coating layer 110, the display device may have antifouling and antistatic properties, and the above-described primer layer 120 is the hard coating layer 110 When formed between the substrate 130 and the antifouling/antistatic hard coating layer and the substrate are strongly bonded, a display device having durability even when repeatedly deformed can be provided.
디스플레이 패널(200)은 영상이 표시될 수 있는 소자로서, 플렉서블(flexible)한 특성을 가질 수 있다.The display panel 200 is a device capable of displaying an image and may have a flexible characteristic.
디스플레이 패널(200)은 예를 들어, 액정표시패널 또는 유기전계발광 표시패널일 수 있다. 구체적으로, 상기 유기전계발광 표시패널은 전면 편광판 및 유기 EL 패널을 포함할 수 있으나, 이에 한정되는 것은 아니다.The display panel 200 may be, for example, a liquid crystal display panel or an organic light emitting display panel. Specifically, the organic light emitting display panel may include a front polarizer and an organic EL panel, but is not limited thereto.
상기 전면 편광판은 상기 유기 EL 패널의 전면 상에 배치될 수 있다. 구체적으로, 상기 전면 편광판은 상기 유기 EL 패널에서, 영상이 표시되는 면에 접착될 수 있다.The front polarizing plate may be disposed on the front surface of the organic EL panel. Specifically, the front polarizing plate may be attached to a surface of the organic EL panel on which an image is displayed.
상기 유기 EL 패널은 픽셀 단위의 자체 발광에 의해서, 영상을 표시한다. 상기 유기 EL 패널은 유기 EL 기판 및 구동기판을 포함할 수 있다. 상기 유기 EL 기판은 픽셀에 각각 대응되는 복수의 유기 전계 발광 유닛들을 포함할 수 있다. 구체적으로, 각각 음극, 전자 수송층, 발광층, 정공 수송층 및 양극을 포함할 수 있다. 상기 구동기판은 상기 유기 EL 기판에 구동적으로 결합될 수 있다. 즉, 상기 구동 기판은 상기 유기 EL 기판에 구동 전류 등과 같은 구동 신호를 인가할 수 있도록 결합됨으로써, 상기 유기 전계 발광 유닛들에 각각 전류를 인가하여, 상기 유기 EL 기판을 구동할 수 있다.The organic EL panel displays an image by self-emission in pixel units. The organic EL panel may include an organic EL substrate and a driving substrate. The organic EL substrate may include a plurality of organic electroluminescent units each corresponding to a pixel. Specifically, each may include a cathode, an electron transport layer, a light emitting layer, a hole transport layer, and an anode. The driving substrate may be drivingly coupled to the organic EL substrate. That is, the driving substrate is coupled to apply a driving signal such as a driving current to the organic EL substrate, so that the organic EL substrate can be driven by applying a current to each of the organic electroluminescent units.
일 구현예에 따르면, 디스플레이 패널(200) 및 적층 필름(100) 사이에 접착층이 포함될 수 있다. 상기 접착층은 광학적으로 투명한 접착층일 수 있으며, 특별히 한정되지 않는다. According to one embodiment, an adhesive layer may be included between the display panel 200 and the laminated film 100 . The adhesive layer may be an optically transparent adhesive layer, and is not particularly limited.
상기 내용을 하기 실시예에 의하여 더욱 상세하게 설명한다. 단, 하기 실시예는 발명을 예시하기 위한 것일 뿐, 실시예의 범위가 이들만으로 한정되는 것은 아니다.The above will be described in more detail by the following examples. However, the following examples are only for illustrating the invention, and the scope of the examples is not limited only to these.
제조예 1: 프라이머 조성물의 제조Preparation Example 1: Preparation of Primer Composition
아래 표 1에 기재된 조성으로 각 성분들을 혼합하여 프라이머 조성물을 준비하였다.A primer composition was prepared by mixing each component according to the composition shown in Table 1 below.
구분division 성분ingredient 중량%weight%
용매menstruum 프로필렌 글리콜 n-프로필 에테르(PNP)Propylene glycol n-propyl ether (PNP) 66.05%66.05%
메틸 이소부틸 케톤(Methyl isobutyl ketone)Methyl isobutyl ketone 28.31%28.31%
자일렌(Xylene)Xylene 1.01%1.01%
n-부틸 아세테이트(n-Butyl acetate)n-Butyl acetate 2.63%2.63%
바인더bookbinder 아크릴계 수지acrylic resin 1.96%1.96%
다가 아지리딘계 화합물Polyvalent aziridine-based compound 펜타에리트리톨 트리스(3-아지리딘-1-일프로피오네이트) [Pentaerythritol tris(3-aziridin-1-ylpropionate)]Pentaerythritol tris(3-aziridin-1-ylpropionate) [Pentaerythritol tris(3-aziridin-1-ylpropionate)] 0.04%0.04%
아크릴계 수지: 메틸 크로토네이트/메틸 메타크릴레이트/부틸 아크릴레이트/옥틸 메타크릴레이트/2-에틸헥실 메타크릴레이트의 공중합체, Mw: 약 50,000, Tg: 85℃Acrylic resin: copolymer of methyl crotonate/methyl methacrylate/butyl acrylate/octyl methacrylate/2-ethylhexyl methacrylate, Mw: about 50,000, Tg: 85°C
제조예 2 내지 6Preparation Examples 2 to 6
프라이머 조성물 중 펜타에리트리톨 트리스(3-아지리딘-1-일프로피오네이트)의 함량을 하기 표 2에 기재된 바와 같이 조절한 것을 제외하고는 제조예 1과 동일한 방법으로 프라이머 조성물을 준비하였다. 조성물 중 펜타에리트리톨 트리스(3-아지리딘-1-일프로피오네이트)의 함량 증가분만큼 용매의 함량이 감소되었다.A primer composition was prepared in the same manner as in Preparation Example 1, except that the content of pentaerythritol tris(3-aziridin-1-ylpropionate) in the primer composition was adjusted as shown in Table 2 below. The content of the solvent was decreased by the increase in the content of pentaerythritol tris(3-aziridin-1-ylpropionate) in the composition.
구 분division 제조예 2Preparation Example 2 제조예 3Preparation Example 3 제조예 4Production Example 4 제조예 5Preparation Example 5 제조예 6Preparation Example 6
펜타에리트리톨 트리스(3-아지리딘-1-일프로피오네이트)의 함량(중량%)Content of pentaerythritol tris(3-aziridin-1-ylpropionate) (% by weight) 1.5%1.5% 2.0%2.0% 2.5%2.5% 3.0%3.0% 3.5%3.5%
제조예 7: 하드코팅 조성물의 제조Preparation Example 7: Preparation of hard coating composition
아래 표 3에 기재된 조성으로 각 성분들을 혼합하여 하드코팅 조성물을 준비하였다.A hard coating composition was prepared by mixing each component in the composition shown in Table 3 below.
구 분division 성분ingredient 중량%weight%
용매menstruum 이소프로필 알코올(Isopropyl alcohol)Isopropyl alcohol 5.00%5.00%
에탄올(Ethanol)Ethanol 32.50%32.50%
메틸 이소부틸 케톤(Methyl isobutyl ketone)Methyl isobutyl ketone 25.00%25.00%
프로필렌글리콜 메틸 에테르(Propylene glycol methyl ether)Propylene glycol methyl ether 12.50%12.50%
유기 수지organic resin 우레탄 아크릴레이트 Urethane Acrylate 13.50%13.50%
아크릴 에스테르acrylic ester 9.12%9.12%
광개시제photoinitiator 1-하이드록시사이클로헥실 페닐 케톤(1-Hydroxycyclohexyl phenyl ketone)1-Hydroxycyclohexyl phenyl ketone 1.13%1.13%
방오 첨가제antifouling additives (퍼플로로헥실)에틸 아크릴레이트[(Perfluorohexyl)ethyl acrylate](Perfluorohexyl)ethyl acrylate [(Perfluorohexyl)ethyl acrylate] 0.11%0.11%
대전방지제antistatic agent 4급 암모늄 염화물quaternary ammonium chloride 1.13%1.13%
우레탄 아크릴레이트: Miramer MU9800(미원 스페셜티 케미칼)아크릴 에스테르: Miramer PS3010(미원 스페셜티 케미칼)Urethane Acrylate: Miramer MU9800 (Miwon Specialty Chemical) Acrylic Ester: Miramer PS3010 (Miwon Specialty Chemical)
제조예 8 내지 10Preparation Examples 8 to 10
우레탄 아크릴레이트 및 아크릴 에스테르를 각각 아래 표 4에 기재된 화합물으로 변경한 것을 제외하고는, 제조예 7과 동일한 방법으로 하드코팅 조성물을 준비하였다.A hard coating composition was prepared in the same manner as in Preparation Example 7, except that urethane acrylate and acrylic ester were respectively changed to the compounds shown in Table 4 below.
제조예 7Preparation Example 7 제조예 8Preparation Example 8 제조예 9Preparation Example 9 제조예 10Preparation Example 10
우레탄 아크릴레이트Urethane Acrylate Miramer MU9800Miramer MU9800 Miramer PU340(미원 스페셜티 케미칼)Miramer PU340 (Miwon Specialty Chemical) Miramer PU320(미원 스페셜티 케미칼)Miramer PU320 (Miwon Specialty Chemical) Miramer SC2152(미원 스페셜티 케미칼)Miramer SC2152 (Miwon Specialty Chemical)
아크릴 에스테르acrylic ester Miramer PS3010Miramer PS3010 Photocryl DP344(미원 스페셜티 케미칼)Photocryl DP344 (Miwon Specialty Chemical) Miramer P261(미원 스페셜티 케미칼)Miramer P261 (Miwon Specialty Chemical) Miramer PS3010(미원 스페셜티 케미칼)Miramer PS3010 (Miwon Specialty Chemical)
실시예 1 내지 9: 적층 필름의 제조Examples 1 to 9: Preparation of laminated films
두께 약 30~80 ㎛의 투명 폴리이미드 필름(SKC 제조)의 일 면 상에 각각 제조예 1 내지 6의 프라이머 조성물을 다이코팅법으로 도포하였다. 약 120℃에서 약 6분간 열처리하여 용매를 건조시키고 경화를 수행하여 약 70~90 nm 두께의 프라이머층을 형성하였다.The primer compositions of Preparation Examples 1 to 6 were applied on one surface of a transparent polyimide film (manufactured by SKC) having a thickness of about 30 to 80 μm by a die coating method. Heat treatment was performed at about 120° C. for about 6 minutes to dry the solvent and curing was performed to form a primer layer having a thickness of about 70 to 90 nm.
상기 프라이머층 상에 제조예 7 내지 10의 하드코팅 조성물을 다이코팅법으로 도포하였다. 도포된 조성물을 약 120℃에서 약 6분간 건조시키고 파장 375 nm의 UV를 통해 총 약 1 J/cm2의 에너지를 가하여 경화시킴으로써, 약 5 ㎛ 두께의 하드코팅층을 형성하였다.The hard coating compositions of Preparation Examples 7 to 10 were applied on the primer layer by a die coating method. The applied composition was dried at about 120° C. for about 6 minutes and cured by applying a total energy of about 1 J/cm 2 through UV with a wavelength of 375 nm to form a hard coating layer having a thickness of about 5 μm.
실시예 10 내지 13Examples 10 to 13
프라이머 층의 두께를 하기 표 5에 기재된 바와 같이 변경한 것을 제외하고는 실시예 1과 동일한 방법으로 적층 필름을 제조하였다.A laminated film was prepared in the same manner as in Example 1, except that the thickness of the primer layer was changed as shown in Table 5 below.
구분division 실시예 1Example 1 실시예 7Example 7 실시예 8Example 8 실시예 9Example 9 실시예 10Example 10
코팅 두께coating thickness 73 nm73 nm 36 nm36 nm 120 nm120 nm 156 nm156 nm 182 nm182 nm
실시예 14 내지 17Examples 14 to 17
프라이머 조성물을 폴리이미드 필름 대신 두께 약 40 ㎛의 폴리에틸렌 테레프탈레이트 필름(TU94, 두께 50 ㎛; SKC 제조)을 사용한 것을 제외하고는 실시예 1 내지 4과 동일한 방법으로 적층 필름을 제조하였다.Laminated films were prepared in the same manner as in Examples 1 to 4, except that a polyethylene terephthalate film (TU94, 50 μm thick; manufactured by SKC) having a thickness of about 40 μm was used as the primer composition instead of the polyimide film.
비교예comparative example
두께 73 ㎛의 투명 폴리이미드 필름의 일면 상에 상기 제조예 7의 하드코팅 조성물을 다이코팅법으로 직접 도포하였으며, 도포된 조성물을 약 120℃에서 약 6분간 건조시키고 파장 375 nm의 UV를 통해 총 약 1 J/cm2의 에너지를 가하여 경화시킴으로써 하드코팅층이 적층된 적층 필름을 제조하였다.thickness 73 The hard coating composition of Preparation Example 7 was directly applied on one surface of a ㎛ transparent polyimide film by a die coating method, and the coated composition was dried at about 120 ° C. for about 6 minutes, and a total of about 1 A laminated film in which a hard coating layer was laminated was prepared by curing by applying energy of J/cm 2 .
실험예: 크로스 해치 접착력 테스트Experimental Example: Cross Hatch Adhesion Test
크로스 해치 접착력 시험기(Elcometer, 107-1542)를 이용하여, JIS K 5600에 따라 실시예 및 비교예의 적층 필름에 대한 접착력 테스트를 실시하였다.Adhesion tests were conducted on the laminated films of Examples and Comparative Examples according to JIS K 5600 using a cross hatch adhesion tester (Elcometer, 107-1542).
구체적으로, 크로스 해치 커터를 이용하여 시료의 하드코팅층이 형성된 면에 서로 직교하는 두 방향으로 칼집을 형성하여 10 x 10개의 절단 단위를 형성하였다. 상기 절단 단위들을 모두 덮도록 접착 테이프(Nitto, 31B)를 부착시키고, 테이프를 90o 방향으로 약 2500 mm/min 이상의 속도 떼어내었다. 전체 절단 단위 중 테이프에 의해 박리되지 않고 남아있는 절단 단위의 개수를 비율로서 평가하여 아래 표 6에 기재하였다.Specifically, sheaths were formed in two directions orthogonal to each other on the surface of the sample on which the hard coating layer was formed using a cross hatch cutter to form 10 x 10 cutting units. An adhesive tape (Nitto, 31B) was attached so as to cover all of the cutting units, and the tape was peeled off at a speed of about 2500 mm/min or more in the 90 ° direction. The number of cut units remaining without being peeled off by the tape among the total cut units was evaluated as a ratio and shown in Table 6 below.
구분division 기재write 프라이머층의 조성Composition of the primer layer 프라이머층의 두께(nm)Thickness of primer layer (nm) 하드코팅층 조성Composition of hard coat layer 크로스 해치 접착력cross hatch adhesion
실시예 1Example 1 PIPI 제조예 1Preparation Example 1 7373 제조예 7Preparation Example 7 100/100100/100
실시예 2Example 2 PIPI 제조예 2Preparation Example 2 7373 제조예 7Preparation Example 7 100/100100/100
실시예 3Example 3 PIPI 제조예 3Preparation Example 3 7373 제조예 7Preparation Example 7 100/100100/100
실시예 4Example 4 PIPI 제조예 4Production Example 4 7373 제조예 7Preparation Example 7 100/100100/100
실시예 5Example 5 PIPI 제조예 5Preparation Example 5 7373 제조예 7Preparation Example 7 80/10080/100
실시예 6Example 6 PIPI 제조예 6Preparation Example 6 7373 제조예 7Preparation Example 7 50/10050/100
실시예 7Example 7 PIPI 제조예 1Preparation Example 1 7373 제조예 8Preparation Example 8 100/100100/100
실시예 8Example 8 PIPI 제조예 1Preparation Example 1 7373 제조예 9Preparation Example 9 100/100100/100
실시예 9Example 9 PIPI 제조예 1Preparation Example 1 7373 제조예 10Preparation Example 10 100/100100/100
실시예 10Example 10 PIPI 제조예 1Preparation Example 1 3636 제조예 7Preparation Example 7 100/100100/100
실시예 11Example 11 PIPI 제조예 1Preparation Example 1 120120 제조예 7Preparation Example 7 95/10095/100
실시예 12Example 12 PIPI 제조예 1Preparation Example 1 156156 제조예 7Preparation Example 7 80/10080/100
실시예 13Example 13 PIPI 제조예 1Preparation Example 1 182182 제조예 7Preparation Example 7 70/10070/100
실시예 14Example 14 PETPET 제조예 1Preparation Example 1 7373 제조예 7Preparation Example 7 100/100100/100
실시예 15Example 15 PETPET 제조예 2Preparation Example 2 7373 제조예 7Preparation Example 7 100/100100/100
실시예 16Example 16 PETPET 제조예 3Preparation Example 3 7373 제조예 7Preparation Example 7 100/100100/100
실시예 17Example 17 PETPET 제조예 4Production Example 4 7373 제조예 7Preparation Example 7 100/100100/100
비교예comparative example PIPI -- -- 제조예 7Preparation Example 7 0/1000/100
표 6을 참조하면, 3관능 이상의 다가 아지리딘계 화합물을 포함하여 제조된 프라이머층을 포함하는 실시예들의 적층 필름의 경우, 폴리아마이드계 기재 필름과 방오 및 대전방지 성능을 갖는 하드코팅층이 강하게 접착되어 있는 것이 확인되었다.Referring to Table 6, in the case of laminated films of Examples including a primer layer prepared by including a trifunctional or higher polyvalent aziridine-based compound, the polyamide-based base film and the hard coating layer having antifouling and antistatic performance are strongly adhered. It was confirmed that there is
구체적으로, 프라이머 층의 두께가 200 nm 이하일 경우 우수한 접착력을 갖는 것이 확인되었으며, 프라이머 조성물 중 3관능 이상의 다가 아지리딘계 화합물의 함량이 3 중량% 미만일 때, 접착력이 향상된 것이 확인되었다.Specifically, when the thickness of the primer layer was 200 nm or less, it was confirmed to have excellent adhesive strength, and when the content of the trifunctional or higher polyvalent aziridine-based compound in the primer composition was less than 3% by weight, it was confirmed that the adhesive strength was improved.

Claims (14)

  1. 아크릴계 바인더 수지;acrylic binder resin;
    3관능 이상의 다가 아지리딘계 화합물; 및trifunctional or more polyvalent aziridine-based compounds; and
    용매를 포함하는, 프라이머 조성물.A primer composition comprising a solvent.
     
  2. 제 1 항에 있어서, According to claim 1,
    상기 다가 아지리딘계 화합물은 분자 구조의 말단에 3개 이상의 아지리디닐기를 포함하는, 프라이머 조성물.The polyvalent aziridine-based compound comprises three or more aziridinyl groups at the terminal of the molecular structure, the primer composition.
     
  3. 제 1 항에 있어서, According to claim 1,
    상기 다가 아지리딘계 화합물은 아지리디닐알카노에이트계 잔기와 폴리올계 잔기가 에스테르 결합된 화합물을 포함하는, 프라이머 조성물.The polyvalent aziridine-based compound includes a compound in which an aziridinyl alkanoate-based residue and a polyol-based residue are ester-bonded, the primer composition.
     
  4. 제 1 항에 있어서,According to claim 1,
    상기 다가 아지리딘계 화합물은 하기 화학식 I로 표시되는 화합물을 포함하는, 프라이머 조성물:The polyvalent aziridine-based compound comprises a compound represented by Formula I below, a primer composition:
    [화학식 I][Formula I]
    Figure PCTKR2022007602-appb-I000019
    Figure PCTKR2022007602-appb-I000019
    상기 화학식 I에서, A는 4가 탄소 원자 또는 하기 화학식 Ia로 표시되는 잔기이고, n, m 및 l은 각각 독립적으로 1 내지 6의 정수이고, y는 3 이상의 정수이고, x+y는 A가 탄소 원자일 경우 4이고, 화학식 Ia의 잔기일 경우 6이며,In Formula I, A is a tetravalent carbon atom or a residue represented by Formula Ia, n, m and l are each independently an integer of 1 to 6, y is an integer of 3 or more, and x+y is A 4 for a carbon atom and 6 for a moiety of formula Ia;
    [화학식 Ia][Formula Ia]
    Figure PCTKR2022007602-appb-I000020
    Figure PCTKR2022007602-appb-I000020
    상기 화학식 Ia에서, k는 1 내지 6의 정수이다.In the above formula (Ia), k is an integer from 1 to 6.
     
  5. 제 1 항에 있어서, According to claim 1,
    조성물 총 중량을 기준으로, 상기 아크릴계 바인더 수지 0.1 중량% 내지 20 중량% 및 상기 다가 아지리딘계 화합물을 0.01 중량% 이상 및 3 중량% 미만으로 포함하는, 프라이머 조성물.A primer composition comprising 0.1% to 20% by weight of the acrylic binder resin and 0.01% by weight or more and less than 3% by weight of the polyvalent aziridine-based compound based on the total weight of the composition.
     
  6. 제 1 항에 있어서,According to claim 1,
    상기 용매는 에테르계 화합물, 케톤계 화합물 및 에스테르계 화합물 중 적어도 하나의 비양자성 극성 용매 또는 방향족 탄화수소계 화합물을 포함하는 비극성 용매를 포함하는, 프라이머 조성물.Wherein the solvent comprises a non-polar solvent containing at least one aprotic polar solvent or an aromatic hydrocarbon-based compound selected from among ether-based compounds, ketone-based compounds and ester-based compounds.
     
  7. 기재;write;
    상기 기재 상에 아크릴계 바인더 수지, 3관능 이상의 다가 아지리딘계 화합물 및 용매를 포함하는 프라이머 조성물로부터 형성된 프라이머층; 및a primer layer formed from a primer composition including an acrylic binder resin, a trifunctional or higher polyvalent aziridine-based compound, and a solvent on the substrate; and
    상기 프라이머층 상에 형성된 하드코팅층을 포함하는, 적층 필름.A laminated film comprising a hard coating layer formed on the primer layer.
     
  8. 제 7 항에 있어서,According to claim 7,
    상기 하드코팅층은 우레탄 아크릴레이트계 화합물 및 아크릴 에스테르계 화합물 중 적어도 하나를 포함하는, 적층 필름.The hard coating layer comprises at least one of a urethane acrylate-based compound and an acrylic ester-based compound, the laminated film.
     
  9. 제 7 항에 있어서,According to claim 7,
    상기 하드코팅층은 방오 첨가제 및 대전방지제 중 적어도 하나를 포함하는, 적층 필름.Wherein the hard coating layer includes at least one of an antifouling additive and an antistatic agent.
     
  10. 제 9 항에 있어서,According to claim 9,
    상기 방오 첨가제는 불소 치환된 아크릴레이트계 화합물을 포함하는, 적층 필름.The antifouling additive comprises a fluorine-substituted acrylate-based compound, the laminated film.
     
  11. 제 9 항에 있어서,According to claim 9,
    상기 대전방지제는 이온계 계면활성제를 포함하는, 적층 필름.Wherein the antistatic agent comprises an ionic surfactant.
     
  12. 제 9 항에 있어서,According to claim 9,
    상기 프라이머층의 두께는 20 nm 내지 200 nm인, 적층 필름.The thickness of the primer layer is 20 nm to 200 nm, the laminated film.
     
  13. 제 9 항에 있어서,According to claim 9,
    JIS K 5600에 따라 측정된 크로스 해치 접착력 테스트 결과 값이 50/100 이상인, 적층 필름.A laminated film having a cross hatch adhesion test result value of 50/100 or more measured according to JIS K 5600.
     
  14. 디스플레이 패널; 및display panel; and
    상기 디스플레이 패널의 시인면 상에 배치된 커버 윈도우를 포함하며,A cover window disposed on the viewing surface of the display panel;
    상기 커버 윈도우는 기재, 상기 기재 상에 아크릴계 바인더 수지, 3관능 이상의 다가 아지리딘계 화합물 및 용매를 포함하는 프라이머 조성물로부터 형성된 프라이머층 및 상기 프라이머층 상에 형성된 하드코팅층을 포함하는, 디스플레이 장치.The cover window includes a substrate, a primer layer formed from a primer composition containing an acrylic binder resin, a trifunctional or more polyvalent aziridine-based compound and a solvent on the substrate, and a hard coating layer formed on the primer layer. Display device.
PCT/KR2022/007602 2021-06-08 2022-05-27 Primer composition, laminated film, and display device WO2022260325A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100096138A (en) * 2007-11-30 2010-09-01 시카 테크놀러지 아게 Film primer having improved adhesion
KR20110130142A (en) * 2010-05-27 2011-12-05 주식회사 대하맨텍 Ultraviolet-curable functional hard coating material
WO2015069502A1 (en) * 2013-11-07 2015-05-14 3M Innovative Properties Company Fluoropolymer coatings comprising aziridine compounds and non-fluorinated polymer
JP2015142999A (en) * 2013-12-25 2015-08-06 東レフィルム加工株式会社 antistatic release film
KR20210031671A (en) * 2019-09-05 2021-03-22 에스케이씨 주식회사 Polyester protective film for flexible display device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100096138A (en) * 2007-11-30 2010-09-01 시카 테크놀러지 아게 Film primer having improved adhesion
KR20110130142A (en) * 2010-05-27 2011-12-05 주식회사 대하맨텍 Ultraviolet-curable functional hard coating material
WO2015069502A1 (en) * 2013-11-07 2015-05-14 3M Innovative Properties Company Fluoropolymer coatings comprising aziridine compounds and non-fluorinated polymer
JP2015142999A (en) * 2013-12-25 2015-08-06 東レフィルム加工株式会社 antistatic release film
KR20210031671A (en) * 2019-09-05 2021-03-22 에스케이씨 주식회사 Polyester protective film for flexible display device

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