WO2022258326A1 - Ensemble - Google Patents

Ensemble Download PDF

Info

Publication number
WO2022258326A1
WO2022258326A1 PCT/EP2022/063413 EP2022063413W WO2022258326A1 WO 2022258326 A1 WO2022258326 A1 WO 2022258326A1 EP 2022063413 W EP2022063413 W EP 2022063413W WO 2022258326 A1 WO2022258326 A1 WO 2022258326A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
cooling channel
electrical
electronic component
cooling
Prior art date
Application number
PCT/EP2022/063413
Other languages
German (de)
English (en)
Inventor
Michael Baeuerle
Klaus Ries-Mueller
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2022258326A1 publication Critical patent/WO2022258326A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change

Definitions

  • the present invention relates to an assembly.
  • Power semiconductors in power electronics usually carry high currents, which can lead to high heat losses. Such power semiconductors often need to be cooled, for example to prevent damage from overheating.
  • a cooling device designed as a pulsating heat pipe includes a cooling channel in the cooling device, which is designed in a meandering shape, for example, and is filled with a working medium that is present in the cooling channel in gaseous and liquid form at the same time.
  • heat is transferred to the cooling channel in a base region, so that the working medium in the cooling channel locally evaporates. This creates pressure gradients that transport the working medium through the cooling channel.
  • the vapor bubbles also migrate into a condenser part of the cooling channel and condense there.
  • a cooling device designed as a pulsating heat pipe thus serves as a heat-spreading design element.
  • an assembly in particular a power assembly
  • the assembly includes an electrical and/or electronic component, in particular a power component, a housing with a housing wall, the electrical and/or electronic component being arranged in the housing.
  • at least one cooling duct is formed in the housing wall, with the cooling duct being filled with a working medium which is present in the cooling duct in gaseous and liquid form at the same time.
  • the assembly with the features of the independent claim has the advantage that the cooling of the electrical and/or electronic component is advantageously improved by the assembly.
  • the housing advantageously dissipates the heat well from the electrical and/or electronic component through the cooling channel and the working medium in the cooling channel. Due to the working medium in the cooling channel, the cooling channel in the housing can advantageously be operated well as a pulsating heat pipe. In this way, the heat generated by the electrical and/or electronic component can advantageously be well distributed over the housing and emitted by it to the environment. It can thus be achieved that the electrical and/or electronic component can always be operated at maximum power, even under difficult conditions.
  • the cooling of the electrical and/or electronic component improved by the assembly also leads to a more uniform thermal load in the electrical and/or electronic component, for example in the power semiconductor or module, and thus to lower thermal stress and a longer service life of the electrical and/or electronic component .
  • heat dissipation and heat radiation advantageously improved inside and outside the housing. Because a cooling channel with working fluid, which is then operated as a pulsating heat pipe, is used to cool the housing, the supply lines and heat exchangers that are otherwise required, for example for water cooling, can advantageously be saved. This results in a comparatively inexpensive and easy-to-manufacture assembly with comparatively simple packaging.
  • the cooling channel runs around the electrical and/or electronic component in the housing.
  • the heat that is transferred from the electrical and/or electronic component to the housing at one point on the housing can advantageously be distributed well and quickly over the entire housing by the working medium in the cooling channel and then advantageously dissipated well from the housing to the environment will.
  • cooling structures are formed on an outside of the housing.
  • the cooling structures on the outside of the housing advantageously increase the surface area on the outside of the housing that is in contact with the surroundings of the housing.
  • the heat from the electrical and/or electronic component, which is distributed via the working medium in the cooling channel and thus via the housing using the principle of the pulsating heat pipe, can be given off particularly well to the surroundings of the housing on the outside of the housing.
  • the cooling structures are designed as cooling ribs.
  • a heat-conducting element is arranged in the housing, which is thermally connected to the electrical and/or electronic component and to an inside of the housing.
  • a further path is thus formed, via which heat can be dissipated from the electrical and/or electronic component to the housing.
  • the electrical and/or electronic component can rest directly or indirectly on an underside of the electrical and/or electronic component on the inside of the housing. This contact of the electrical and/or electronic component can establish a first thermal path from the electrical and/or electronic component to the housing.
  • the heat-conducting element can, for example, be thermally connected to an upper side of the electrical and/or electronic component, for example directly or indirectly resting against the upper side of the electrical and/or electronic component and thus provide a second path for heat conduction from the electrical and/or electronic component to the form housing.
  • a further cooling channel is formed in the heat-conducting element, with the further cooling channel being filled with a working medium which is present in the further cooling channel in liquid and gaseous form at the same time.
  • the further cooling channel with the working medium functions as a pulsating heat pipe, so that the heat is advantageously dissipated from the electrical and/or electronic component to the housing.
  • a cable connection is routed into the housing, with the cable connection having a cable shield that is thermally connected to the housing.
  • the cable shielding can for example directly or indirectly applied to the housing, so that a thermal contact between the cable shielding and the housing. The heat dissipated from the electrical and/or electronic component to the housing can thus be dissipated from the housing via the cable connection via the cable shielding of the cable connection.
  • the cable shielding is designed as a metallic cable shielding and rests against the housing in the area in which the cable connection is routed into the housing. In this way, the cable shielding is thermally connected to the housing in a simple manner and the heat can be dissipated from the housing via the cable shielding.
  • the housing is made of aluminum.
  • a housing made of aluminum has an advantageously high thermal conductivity. Heat from the housing is thus advantageously given off well to the environment.
  • the cooling channel runs in a meandering manner in the housing wall, at least in sections.
  • a meandering course of the cooling channel enables an advantageously efficient operation of the heat sink as a pulsating heat pipe and thus efficient heat dissipation from the component to be cooled via the cooling device.
  • FIG. 1 shows a schematic representation of a first exemplary embodiment of the assembly according to the invention
  • Fig. 2 is a schematic representation of a second
  • Embodiment of the assembly according to the invention Embodiments of the invention
  • the assembly 1 shows a schematic representation of a first exemplary embodiment of an assembly 1.
  • the assembly 1 comprises an electrical and/or electronic component 5 and a housing 10.
  • the electrical and/or electronic component 5 is arranged in the housing 10.
  • the housing 10 thus serves, for example, as protection for the electrical and/or electronic component 5.
  • Further components, not shown in the figures, can also be arranged in the housing 10.
  • the housing 10 surrounds the electrical and/or electronic component 5, for example on all sides.
  • the electrical and/or electronic component 5 can be a power component, for example.
  • the electrical and/or electronic component 5 can include, for example, a power substrate and power switches and other components arranged on the power substrate.
  • the electrical and/or electronic component 5 can be embodied as a power module, for example.
  • the electrical and/or electronic component 5 generates a power loss of 100-200 watts, for example, which has to be dissipated via the housing 10 .
  • the electrical and/or electronic component 5 can be embodied, for example, as a DCDC converter, for example as a 12V DCDC converter or 48V DCDC converter.
  • the electrical and/or electronic component 5 can be embodied as an engine management control unit for high-end applications, such as piezo direct injection or other motor vehicle applications.
  • the electrical and/or electronic component 5 can, for example, also be designed as an inverter, for example as a 48V inverter for a boost recovery system.
  • the housing 10 can be made, for example, from a material with good thermal conductivity, for example a metal, for example aluminum.
  • the housing 10 can be manufactured, for example, by means of die-cast aluminum.
  • the housing 10 includes housing walls 15 which together form the housing 10 .
  • the electrical and/or electronic component 5 is surrounded by housing walls 15 on all sides, for example.
  • the housing 10 is designed to cool the electrical and/or electronic component 5 .
  • the electrical and/or electronic component 5 rests, for example, directly or indirectly on an inner side 18 of the housing 10 .
  • a power substrate of the electrical and/or electronic component 5 can lie flat on a flat bearing surface on the inside 18 of the housing 10 .
  • a cooling channel 11 filled with a working medium 6 is formed.
  • the cooling channel 11 is formed in the housing walls 15 .
  • the cooling channel 11 forms a pulsating heat pipe together with the working medium 6 .
  • the pulsating heat pipe is thus formed in the housing walls 15 of the housing 10 .
  • the pulsating heat pipe is integrated into the housing wall 15 or the housing walls 15 of the housing 10 .
  • the cooling channel 11 is designed as a cavity inside the housing wall 15 or the housing walls 15 .
  • the cooling channel 11 can run through the housing wall 15 in a tubular manner, for example.
  • the cooling channel 11 can have a circular, rectangular or oval cross-section, for example.
  • the cooling channel 11 can encircle the electrical and/or electronic component 5 .
  • the cooling channel 11 can also be formed in the housing walls 15 only in one or more sides of the housing 10 .
  • the cooling channel 11 can run in the housing wall 15 or in a plurality of housing walls 15, for example in a meandering manner.
  • a shape is considered to be meandering if it has a plurality of changes in direction, preferably in one plane.
  • meandering can also be referred to as serpentine.
  • a plurality of cooling channels 11 which are fluidically connected to one another and/or are fluidically separated from one another and which are filled with a working medium 6 can also be formed.
  • the cooling channels 11 can, for example, run parallel to one another.
  • cooling structures 17 can be formed on the outside 16 of the housing 10 .
  • the cooling structures 17 on the outside 16 of the housing 10 increase the contact surface of the housing 10 with the surroundings of the housing 10 on the outside 16.
  • the cooling structures 17 can be designed, for example, as cooling ribs or cooling pins.
  • a further pulsating heat pipe is routed from the electrical and/or electronic component 5 to the inside 18 of the housing 10 .
  • the further pulsating heat pipe is formed in a heat-conducting element 20 as a further cooling channel 21 which is formed in the heat-conducting element 20 and is filled with working medium 6 .
  • the cooling channel 11,21 is filled with a working medium 6.
  • the working medium 6 is simultaneously gaseous and liquid in the cooling channel 11,21.
  • the working medium 6 is present in the cooling channel 11, 21 in both gaseous and liquid form, in other words partly gaseous and partly liquid. This means that the working medium 6 is in two phases in the cooling channel 11,21.
  • gas bubbles and liquid columns are simultaneously present within the cooling channel 11 , 21 .
  • the gas bubbles and the liquid columns preferably occupy a similarly large volume.
  • the gaseous portion of the working medium 6 particularly preferably occupies 30% to 70% of an internal volume of the cooling channel 11 , 21 at the nominal temperature, with the remaining internal volume being occupied by the liquid portion of the working medium 6 .
  • the volume ratio changes as a result of evaporation or condensation of the working medium 6.
  • the cooling channel 11, 21 in the housing 10 or in the heat-conducting element 20 can be operated as a pulsating heat pipe.
  • the working medium 6 particularly preferably has a critical temperature that is greater than a maximum operating temperature.
  • the working medium 6 preferably has a critical temperature of at least 233 K, preferably at least 273 K, particularly preferably at least 373 K, and in particular at most 533 K.
  • a temperature of a substance at the critical point is regarded as the critical temperature.
  • the working medium 6 is preferably an organic refrigerant, which is used for example in vehicle air conditioning systems, such as in particular 2, 3,3,3-
  • Tetrafluoropropene also referred to as R1234yf, R1233zd(E), etc.
  • the working medium 6 particularly preferably has a melting point which is at most 273K, preferably at most 233K, particularly preferably at most 213K
  • the housing 10 is connected to a cable connection 30 in a heat-conducting manner.
  • the cable connection 30 includes a cable shield 31.
  • the cable shield 31 is formed from a metal, for example.
  • the cable connection 30 is thermally conductively connected to the housing 10 via the cable shielding 31 . That's what the

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un ensemble, en particulier un ensemble de puissance, comprenant un composant électrique et/ou électronique (5), en particulier un composant de puissance, un boîtier (10) présentant une paroi de boîtier (15), le composant électrique et/ou électronique (5) étant disposé dans le boîtier (10). Selon l'invention, au moins un canal de refroidissement (11) est formé dans la paroi de boîtier (15), le canal de refroidissement (11) étant rempli d'un fluide de travail (6) qui est présent dans le canal de refroidissement (11) simultanément dans un état gazeux et liquide.
PCT/EP2022/063413 2021-06-08 2022-05-18 Ensemble WO2022258326A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021205749.7A DE102021205749A1 (de) 2021-06-08 2021-06-08 Baugruppe
DE102021205749.7 2021-06-08

Publications (1)

Publication Number Publication Date
WO2022258326A1 true WO2022258326A1 (fr) 2022-12-15

Family

ID=82067804

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2022/063413 WO2022258326A1 (fr) 2021-06-08 2022-05-18 Ensemble

Country Status (2)

Country Link
DE (1) DE102021205749A1 (fr)
WO (1) WO2022258326A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170208706A1 (en) * 2016-01-20 2017-07-20 Raytheon Company Multi-level oscillating heat pipe implementation in an electronic circuit card module
CN111741646A (zh) * 2020-05-26 2020-10-02 吴德坚 一种新型一体式相变超导热传超效散热结构兼产品壳体
DE102019115267A1 (de) * 2019-06-06 2020-12-10 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung für eine elektrische Antriebseinheit, elektrische Antriebseinheit sowie Kraftfahrzeug
US20210055770A1 (en) * 2019-08-22 2021-02-25 Abaco Systems, Inc. Electronics chassis with oscillating heat pipe (ohp)
US20210159007A1 (en) * 2019-11-22 2021-05-27 Toyota Motor Engineering & Manufacturing North America, Inc. Double-sided cooling package of inductor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170208706A1 (en) * 2016-01-20 2017-07-20 Raytheon Company Multi-level oscillating heat pipe implementation in an electronic circuit card module
DE102019115267A1 (de) * 2019-06-06 2020-12-10 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung für eine elektrische Antriebseinheit, elektrische Antriebseinheit sowie Kraftfahrzeug
US20210055770A1 (en) * 2019-08-22 2021-02-25 Abaco Systems, Inc. Electronics chassis with oscillating heat pipe (ohp)
US20210159007A1 (en) * 2019-11-22 2021-05-27 Toyota Motor Engineering & Manufacturing North America, Inc. Double-sided cooling package of inductor
CN111741646A (zh) * 2020-05-26 2020-10-02 吴德坚 一种新型一体式相变超导热传超效散热结构兼产品壳体

Also Published As

Publication number Publication date
DE102021205749A1 (de) 2022-12-08

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