WO2022258253A1 - Ensemble optique et système de lithographie à refroidissement par rayonnement - Google Patents

Ensemble optique et système de lithographie à refroidissement par rayonnement Download PDF

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Publication number
WO2022258253A1
WO2022258253A1 PCT/EP2022/061067 EP2022061067W WO2022258253A1 WO 2022258253 A1 WO2022258253 A1 WO 2022258253A1 EP 2022061067 W EP2022061067 W EP 2022061067W WO 2022258253 A1 WO2022258253 A1 WO 2022258253A1
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WO
WIPO (PCT)
Prior art keywords
peltier
cooling
peltier element
mirror
heat sink
Prior art date
Application number
PCT/EP2022/061067
Other languages
German (de)
English (en)
Inventor
Florian Hoefler
Original Assignee
Carl Zeiss Smt Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Smt Gmbh filed Critical Carl Zeiss Smt Gmbh
Publication of WO2022258253A1 publication Critical patent/WO2022258253A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems

Definitions

  • the invention relates to an optical arrangement for a lithography system, in particular for an EUV lithography system, comprising: a reflective optical element, at least one Peltier element for tempering, in particular for cooling, the reflective optical element, the at least one Peltier element on the reflective optical element is attached, and a cooling system for heat dissipation from the at least one Peltier element.
  • the invention also relates to a lithography system, in particular an EUV lithography system, with at least one such optical arrangement.
  • the lithography system can be a lithography system for exposing a wafer or another optical system for microlithography, for example an inspection system, eg a system for measuring or inspecting masks, wafers or the like used in lithography.
  • the lithography system can in particular be an EUV lithography system.
  • EUV stands for "extreme ultraviolet” and refers to a wavelength of useful radiation between 0.1 nm and 30 nm.
  • reflective optical elements in the form of mirrors in particular in the form of mirrors of projection optics, are exposed to a high radiation power.
  • the average power radiated onto the mirror is 50 W or more, of which a third to half is absorbed in the layer system of a reflective coating of the mirror and leads to extensive and local heating of the mirror or surface of the mirror substrate.
  • Active cooling is typically required to dissipate the heat load from such a reflective optical element. Such active cooling can take place within the optical element (ie directly). Due to the vacuum environment in which an EUV mirror typically operates, the heat load can also be dissipated by radiative cooling or thermal radiation emanating from the mirror.
  • US 2007/0091485 A1 describes a mirror that is directly cooled with the aid of a fluid.
  • the directly cooled mirror has an optical surface that absorbs light and at least one microchannel is formed below the optical surface through which the fluid flows in a laminar manner. The fluid absorbs heat caused by the light absorbed at the optical surface.
  • US 2007/0091485 A1 also describes that a condenser mirror can be cooled with the aid of radiation cooling: Radiation cooling is sufficient for the heat load on such a mirror and is generally less complex and expensive than direct cooling.
  • WO 2012/069351 A1 describes an external heating and/or cooling device for a mirror, which is intended to compensate for imaging errors in the mirror.
  • the heating and / or cooling device has a matrix-like arrangement of Peltier elements, for example, on a water-cooled base plate are arranged, which is spaced from the mirror.
  • the base plate serves to accommodate the narrow range of temperatures over which the Peltier elements can set or maintain temperature. A suitable offset for this temperature range can be set with the help of the cooled base plate.
  • Suitable cooling or heating holes can be installed on the back of the mirror in order to avoid unwanted “crosstalk” between the Peltier elements.
  • a temperature sensor can be used to determine the temperature which the respective Peltier element transmits to the mirror, and the temperature of the mirror can be regulated.
  • DE 102020204722 A1 describes an optical system for a lithography system, comprising: an optical element, multiple temperature sensors for detecting a respective temperature of a region of the optical element, multiple Peltier elements that are arranged on the optical element, around the optical element to heat and/or cool locally, and a heat/cooling system for dissipating heat to the Peltier elements and/or dissipating heat from the Peltier elements.
  • the Peltier elements can be attached to a rear side of the optical element and/or embedded in the rear side of the optical element.
  • a particularly water-cooled cooling line can run along a rear side of the Peltier elements.
  • the object of the invention is to provide an optical arrangement and a lithography system, in particular an EUV lithography system, which enable effective cooling of a reflecting optical element.
  • the cooling system has (at least) one heat sink spaced apart from the at least one Peltier element - and thus also from the reflecting optical element - for dissipating heat from the Peltier element by radiation cooling having.
  • the heat sink in the optical arrangement according to the invention is spaced apart from the optical element. Since the heat sink is not in contact with the reflective optical element, the problem of flow-induced vibrations can be avoided if liquid cooling is integrated into the heat sink (see below).
  • the inventor has also recognized that the liquid or water-cooled base plate, which is described in WO 2012/069351 A1, cannot be cooled to any desired degree.
  • the temperature difference between the base plate and the back of the reflective optical element is therefore comparative low and is typically of the order of a few Kelvin.
  • such a low temperature on a surface of the Peltier element is generally undesirable since it can have an unfavorable effect on the lithography system in which the optical arrangement is installed.
  • components of the residual gas atmosphere can freeze out undesirably on the surface of the Peltier element.
  • the service life of the Peltier element may also decrease if it is permanently cooled to such a low temperature.
  • the at least one Peltier element is attached to the reflecting optical element and the cold side of the Peltier element is in direct contact with the reflecting optical element.
  • the side of the Peltier element facing the (vacuum) environment is heated in this case, so that the problems described above when cooling the reflecting optical element can be avoided.
  • the heat sink has at least one cooling channel for a fluid (a liquid or a gas) to flow through, in particular for cooling water to flow through.
  • a fluid a liquid or a gas
  • the thermal output emitted by the Peltier element or elements can be dissipated by convection.
  • the heatsink may have a surface facing the reflective optical element to absorb the heat generated by the Peltier Elements radiated thermal radiation absorb.
  • the at least one cooling channel can run below the surface of the heat sink.
  • the heat sink can be a metal component, for example, into which the at least one cooling channel can be introduced in a simple manner.
  • the heat sink can be designed to effect the dissipation of the thermal radiation emitted by the Peltier elements in a manner other than that described here.
  • the cooling system can form an open or a closed cooling circuit for the cooling fluid, for example the cooling water, or have such a cooling circuit.
  • the cooling system also typically has a pump and a cooling unit in order to cool the heated cooling fluid after it has passed through the cooling channel.
  • the heat sink forms a support frame for the reflective optical element.
  • the reflective optical element and, as a rule, other optical elements are usually held by a support frame.
  • the respective reflecting optical elements can typically be moved relative to such a support frame with the aid of actuators.
  • the support frame In order to use the support frame as a cooling duct, at least one cooling duct is typically introduced into it, as is described further above.
  • the support frame has at least one surface that faces the reflective optical element.
  • the support frame is usually formed from a metallic material, into which the cooling channel(s) can be introduced in a simpler manner than into the substrate of the reflective optical element.
  • the optical assembly includes at least one other Peltier element attached to the heat sink.
  • the at least one further Peltier element has, in operation, a cold surface which faces the reflective optical element and is typically (at least) one Peltier element which is attached to the optical Element is attached, opposite (and not laterally offset to this) arranged.
  • the further Peltier element has a cold side which faces the reflective optical element and whose temperature is lower than the temperature of the surface of the heat sink. The temperature difference between the side giving off radiant heat and the side of the radiant cooling absorbing radiant heat is thus increased by the additional Peltier element.
  • the cold surface or side of the further Peltier element can have a higher temperature than would be the case without the presence of the opposite Peltier element, ie the cold one
  • the side of the additional Peltier element has a temperature that is generally significantly greater than -40°C to -60°C.
  • the side that emits radiant heat and the side that absorbs radiant heat can be adjusted or regulated independently.
  • the provision of the additional Peltier elements is particularly favorable when the temperature difference between the reflecting optical element and the heat sink is small without the use of the additional Peltier elements.
  • the at least one Peltier element is attached to a rear side of the reflective optical element and/or embedded (in whole or in part) in the rear side of the reflective optical element and/or the at least one further Peltier element is attached to one of the reflective optical elements Element facing surface of the heatsink attached and / or embedded in the surface of the heatsink (in whole or in part).
  • the Peltier elements or the additional Peltier elements can be attached to the respective surface by a material connection, for example by gluing.
  • the Peltier elements are up typically in direct contact with the surface of the optical element or the surface of the heat sink.
  • Suitable recesses or bores can be provided in the reflecting optical element or in the heat sink for the complete or partial embedding of the Peltier element(s) or the further Peltier elements in the respective surface.
  • the completely or partially embedded Peltier elements can be integrated into the optical element or into the heat sink, for example by gluing or in some other way.
  • the surfaces of the Peltier elements that are completely embedded in the surface can in particular end flush with the respective surface of the reflecting optical element or with the surface of the heat sink.
  • the rear side of the reflective optical element refers to the side or surface of the reflective optical element opposite the reflective optical surface.
  • the at least one Peltier element and/or the at least one further Peltier element are composed of at least two stacked Peltier modules.
  • two or more Peltier elements can be stacked on top of each other.
  • a separating layer can be provided for the mechanical connection of the Peltier elements connected in series, but the provision of such a separating layer is not absolutely necessary.
  • the at least one Peltier element has a housing that shields the at least one Peltier element from an area surrounding the reflective optical element and/or the at least one further Peltier element has a housing that protects the at least one further Peltier -Element shields from an environment of the heat sink.
  • the housing is designed to prevent outgassing of contaminants from the Peltier element.
  • the housing is typically made of a material which itself does not outgas any contaminating substances.
  • the enclosure can optionally be in the form of a coating, but it can also be an enclosure in the form of a housing.
  • the housing can be designed in the manner of a shielding plate Which covers a respective partial area of the surface with the embedded Peltier element or the further embedded Peltier element and seals it against the (vacuum) environment.
  • a shielding plate which covers a respective partial area of the surface with the embedded Peltier element or the further embedded Peltier element and seals it against the (vacuum) environment.
  • Such a plate-shaped housing should also be made of a material with good thermal conductivity.
  • a plurality of Peltier elements are attached to the reflecting optical element, preferably in a regular arrangement, and/or a plurality of further Peltier elements are attached to the heat sink, preferably in a regular arrangement.
  • a regular or irregular arrangement of a plurality of Peltier elements on the back of the optical element can result in locally different cooling of the optical element, more precisely the substrate of the optical element.
  • the Peltier elements individually be controlled (see below). In this way, a desired temperature profile can be set on the optical element.
  • the other Peltier elements if present, which are attached to the heat sink in a regular or possibly an irregular arrangement.
  • Peltier elements on the back of the reflective optical element and further Peltier elements on the surface of the heat sink facing the reflective optical element are arranged in pairs opposite one another , ie when a respective pair of Peltier elements are not laterally offset from one another.
  • the Peltier elements are typically used to cool the reflecting optical element, and the desired, for example homogeneous, temperature distribution is generated by suitably setting the cooling capacity of the Peltier elements and, if necessary, the additional Peltier elements.
  • the optical arrangement has a control device for controlling the at least one Peltier element and/or the at least one further Peltier element for temperature control, in particular for cooling, of the reflecting optical element.
  • the Peltier elements and possibly the further Peltier elements are generally used during operation of the lithography system exclusively for cooling the reflecting optical element.
  • temperature sensors can be provided which detect the local temperature of the reflecting optical element and the Peltier elements and the other Peltier elements can be controlled or regulated depending on the temperatures detected by the temperature sensors will.
  • Such a control can possibly also be carried out without the temperature sensors with the aid of calibrated and thus known voltage-heat flow characteristics or voltage-temperature characteristics of the Peltier elements and possibly the further Peltier elements.
  • a further aspect of the invention relates to a lithography system, in particular an EUV lithography system, comprising: at least one optical arrangement as described further above.
  • the EUV lithography system can be an EUV lithography system for exposing a wafer or another optical arrangement that uses EUV radiation, for example an EUV inspection system, e.g. for inspecting masks used in EUV lithography, wafers or the like.
  • the optical arrangement described further above can also be used in optical systems other than in (EUV) lithography systems.
  • radiation cooling or radiation as a heat transport mechanism in optical systems that are not operated under vacuum conditions, this is generally not the case expedient since in optical systems of this type temperature control or cooling of optical elements can be carried out with the aid of a convective heat transport mechanism, eg with the aid of a gas flow, which is not possible when the reflective optical element is operated in a vacuum environment.
  • FIG. 1 shows a schematic meridional section of a projection exposure system for EUV projection lithography
  • Fig. 2 shows schematically an optical arrangement for the
  • Projection exposure system of Fig. 1 with a mirror to which a plurality of Peltier elements is attached and with a cooling system for dissipating heat from the Peltier elements or from the mirror by means of radiation cooling,
  • 3a, b shows a schematic representation of an optical arrangement with a mirror with a plurality of Peltier elements and a detail of a Peltier element that has three Peltier modules stacked on top of one another
  • 4 shows a schematic representation of an optical arrangement analogous to FIG. 2, in which a plurality of further Peltier elements are attached to a heat sink
  • 5a, b shows a schematic representation of a Peltier element from FIG
  • projection exposure system 1 has illumination optics 4 for illuminating an object field 5 in an object plane 6.
  • the light source 3 can also be provided as a separate module from the rest of the illumination system. In this case the lighting system does not include the light source 3 .
  • a reticle 7 arranged in the object field 5 is illuminated.
  • the reticle 7 is held by a reticle holder 8 .
  • the reticle holder 8 can be displaced in particular in a scanning direction via a reticle displacement drive 9 .
  • FIG. 1 A Cartesian xyz coordinate system is shown in FIG. 1 for explanation.
  • the x-direction runs perpendicular to the plane of the drawing.
  • the y-direction is horizontal and the z-direction is vertical.
  • the scanning direction runs along the y-direction.
  • the z-direction runs perpendicular to the object plane 6.
  • the projection exposure system 1 comprises a projection system 10.
  • the projection system 10 is used to image the object field 5 in an image field 11 in an image plane 12.
  • a structure on the reticle 7 is imaged on a light-sensitive layer of a wafer arranged in the region of the image field 11 in the image plane 12 13.
  • the wafer 13 is held by a wafer holder 14.
  • the wafer holder 14 can be displaced in particular along the y-direction via a wafer displacement drive 15 .
  • the displacement of the reticle 7 via the reticle displacement drive 9 on the one hand and the wafer 13 on the other hand via the wafer displacement drive 15 can be synchronized with one another.
  • the radiation source 3 is an EUV radiation source.
  • the radiation source 3 emits in particular EUV radiation 16, which is also referred to below as useful radiation, illumination radiation or illumination light.
  • the useful radiation has a wavelength in the range between 5 nm and 30 nm.
  • the radiation source 3 can be a plasma source, for example an LPP source (laser produced plasma, plasma generated with the aid of a laser) or a DPP Source (Gas Discharged Produced Plasma). It can also be synchrotron-based act as a source of radiation.
  • the radiation source 3 can be a free-electron laser (free-electron laser, FEL).
  • the illumination radiation 16 emanating from the radiation source 3 is bundled by a collector mirror 17 .
  • the collector mirror 17 can be a collector mirror with one or more ellipsoidal and/or hyperboloidal reflection surfaces.
  • the at least one reflection surface of the collector mirror 17 can be exposed to the illumination radiation 16 in grazing incidence (Grazing Incidence, Gl), i.e. with angles of incidence greater than 45°, or in normal incidence (Normal Incidence, NI), i.e. with angles of incidence less than 45° will.
  • Gl grazing Incidence
  • NI normal incidence
  • the collector mirror 17 can be structured and/or coated on the one hand to optimize its reflectivity for the useful radiation and on the other hand to suppress stray light.
  • the intermediate focus plane 18 can represent a separation between a radiation source module, comprising the radiation source 3 and the collector mirror 17, and the illumination optics 4.
  • the illumination optics 4 comprises a deflection mirror 19 and a first facet mirror 20 downstream of this in the beam path.
  • the deflection mirror 19 can be a plane deflection mirror or alternatively a mirror with an effect that influences the bundle beyond the pure deflection effect. Alternatively or additionally, the deflection mirror 19 can be designed as a spectral filter, which separates a useful light wavelength of the illumination radiation 16 from stray light of a different wavelength.
  • the first facet mirror 20 includes a multiplicity of individual first facets 21, which are also referred to below as field facets. Of these facets 21 are in the Fig. 1 only a few shown as an example.
  • a second facet mirror 22 is arranged downstream of the first facet mirror 20 in the beam path of the illumination optics 4.
  • the second facet mirror 22 comprises a plurality of second facets 23.
  • the illumination optics 4 thus forms a double-faceted system.
  • This basic principle is also known as a honeycomb condenser (Fly's Eye Integrator).
  • the individual first facets 21 are imaged in the object field 5 with the aid of the second facet mirror 22 .
  • the second facet mirror 22 is the last beam-forming mirror or actually the last mirror for the illumination radiation 16 in the beam path in front of the object field 5.
  • the projection system 10 includes a plurality of mirrors Mi, which are numbered consecutively according to their arrangement in the beam path of the projection exposure system 1 .
  • the projection system 10 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve or another number of mirrors Mi are also possible.
  • the penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16.
  • the projection system 10 involves doubly obscured optics.
  • the projection optics 10 has an image-side numerical aperture which is greater than 0.4 or 0.5 and which can also be greater than 0.6 and which can be 0.7 or 0.75, for example.
  • the mirrors Mi can have a highly reflective coating for the illumination radiation 16.
  • Fig. 2 shows an optical arrangement 25 of the EUV lithography system in the form of the projection exposure system 1 of Fig. 1, which has a reflecting optical element in the form of the first mirror M1 of the projection optics 10 includes.
  • the reflecting optical element can also be another mirror M2 to M6 of the projection optics 10 or a mirror of the illumination optics 4 .
  • the mirror M1 has a front side 26a with an optical surface onto which illumination radiation 16 is incident when the EUV lithography system 1 is in operation.
  • the mirror M1 has a highly reflective coating, which is not shown pictorially in FIG. 2, for reflecting the illumination radiation 16.
  • FIG. 1 shows an optical arrangement 25 of the EUV lithography system in the form of the projection exposure system 1 of Fig. 1, which has a reflecting optical element in the form of the first mirror M1 of the projection optics 10 includes.
  • the reflecting optical element can also be another mirror M2 to M6 of the projection optics 10 or a mirror of the illumination optics 4 .
  • the mirror M1 has
  • a plurality of Peltier elements 28 are attached to a rear side 26b of the mirror M1, to be more precise a mirror substrate, which is remote from the front side 26a, of which three Peltier elements 28 are shown in FIG. 2 by way of example.
  • the Peltier elements 28 are arranged in a regular arrangement (a 2-dimensional grid, e.g. a Cartesian grid). Adjacent Peltier elements 28 are equidistant from one another, and the Peltier elements 28 are evenly distributed over the planar surface on the rear face 26b of mirror M1.
  • the Peltier elements 28 are used to control the temperature of the mirror M1 and can in principle be used both for heating and for cooling the mirror M1. During exposure operation of the projection exposure system 1, the Peltier elements 28 are typically used to cool the mirror M1. In this case, a first side 28a of the Peltier elements 28 that is in contact with the rear side 26b of the mirror M1 has a first, lower temperature TK and a second side 28b of the Peltier elements 28 that faces away from the rear side 26b of the mirror M1 has a second, higher temperature Tw, i.e. the following applies: TK ⁇ Tw.
  • the optical arrangement 25 has a cooling system 29 which forms a closed cooling circuit in the example shown.
  • the cooling system 29 comprises a heat sink 30 formed by the mirror M1 and by the Peltier elements 28 is spaced apart.
  • the heat sink 30 is a metal support frame for the mirror M1 and for other components of the projection optics 10 that are not illustrated.
  • the heat sink 10 can, however, also be a component other than a support frame of the projection exposure system 1 .
  • the heat sink 30 is convectively cooled.
  • the heat sink 30 in the form of the support frame has a cooling channel 31 for a fluid to flow through, more precisely a liquid.
  • the fluid is cooling water, which is supplied to the cooling body 30 by a pump 32 of the cooling system 29 via a cooling line.
  • the heated cooling water is discharged from the cooling body 30 via a further cooling line and cooled with the aid of a cooling unit (not illustrated) and then fed back to the cooling body 30 by means of the pump 32 .
  • the cooling channel 31 can, for example, run in a meandering or serpentine manner, etc., in order to enable planar cooling of a planar surface 33 of the heat sink 30 in the example shown, which faces the rear side 26b of the mirror M1.
  • a temperature To on the surface 33 of the heat sink 30 can be specified or set within certain limits.
  • the optical arrangement 25 has a control device 34.
  • the control device 34 makes it possible to specify or set the temperature of the cooling water that flows through the cooling channel 31 of the heat sink 30 .
  • the temperature of the cooling water in the cooling channel 31 can, for example, be of the order of between 10°C and 15°C.
  • the Temperature To at the surface 33 of the cooling body 30 is typically higher than the temperature of the cooling water and can be of the order of between 15°C and 20°C, for example.
  • the Peltier elements 28 are controlled with the aid of the control device 34, with the first temperature TK and the second temperature Tw being specified individually for each individual Peltier element 28.
  • the control or the energization of the Peltier elements 28 can take place via electrical lines, but it is also possible to transmit the current for the control of the Peltier elements 28 without contact, for example inductively.
  • the temperature of the mirror M1 can be set or specified locally by the Peltier elements 28 being supplied with an electric current in a suitable manner.
  • the heat output that has to be dissipated by the Peltier elements 28 in order to specify a desired temperature distribution in the mirror M1 is usually very high due to the high thermal load that acts on the mirror M1 when the illumination radiation 16 is irradiated .
  • the Peltier elements 28 are radiantly cooled with the aid of the heat sink 30.
  • the temperature To on the surface 33 of the heat sink 30 is lower than the temperature Tw of the warm side 28b of a respective Peltier element 28, so that the thermal load of the Peltier elements 28 can be transferred to the heat sink 30 by radiation cooling and can be dissipated from the heat sink 30 with the aid of convective cooling.
  • the temperature difference Tw ⁇ TK between the cold side 28a of the Peltier elements 28 and the warm side 28b of the Peltier elements 28 can be on the order of about 60-80 K in conventional Peltier elements 28.
  • Peltier elements 28′ can be used which are designed as shown in FIGS. 3a, b.
  • the Peltier elements 28' shown in FIGS. 3a, b have a plurality (three in the example shown) of Peltier modules 35a-c, which are stacked one on top of the other.
  • the three Peltier modules 28a-c are connected in series and are controlled together using the control device 34. Due to the series connection, the temperature difference between the cold side and warm side of a respective Peltier module 28a-c, which is required to generate the temperature difference of approx. 60K-80K by means of the Peltier element 28, is typically in the order of approx. 20K -25K.
  • the heat flow pumped by the Peltier elements 28' can be increased. As can be seen in FIG.
  • separating layer 36 which consists of a material with good thermal conductivity.
  • the provision of the separating layer 36 is not absolutely necessary.
  • the individual Peltier modules 28a-c can basically be designed like the Peltier elements 28 shown in FIG electric current through the control device 34.
  • FIG. 4 shows an optical arrangement 25 which also makes it possible to dissipate a high thermal load from the mirror M1.
  • the optical arrangement 25 corresponds in its structure to the optical arrangement 25 shown in FIG. 2, but additionally has a plurality of further Peltier elements 37, attached to the surface 33 of the heat sink 30 which faces the rear side 26b of the mirror M1.
  • the other Peltier elements 37 have a cold side 38a (with temperature Tk′), which faces away from the surface 33 of the heat sink 30, and a warm side 38b (with temperature Tw′), which the surface 33 of the heat sink 30 is in direct contact.
  • the other Peltier elements 37 are also controlled with the aid of the control device 34 in order to set the temperature difference Tw′ ⁇ Tk′ between the cold side 38a and the warm side 38b and thus the heat output pumped out.
  • the control device 34 is designed or set up to also control the further Peltier elements 37 individually in order to set the temperature of the mirror M1 locally.
  • the respective temperatures can be controlled and optionally regulated both on the side emitting radiant heat (ie the mirror M1) and on the side receiving radiant heat (ie the heat sink 30).
  • the optical arrangement 25 can have a plurality of temperature sensors.
  • the temperature of the mirror M1 can also be regulated without the provision of temperature sensors using calibrated and thus known voltage-heat flow characteristics or voltage-temperature characteristics of the Peltier elements 28 and the further Peltier elements 37 .
  • the Peltier elements 28 and the further Peltier elements 37 are arranged in pairs opposite one another.
  • the temperature at a location of the mirror M1 can be adjusted by means of a respective pair of opposing Peltier element 28 and further Peltier element 37 without causing significant crosstalk in temperature control, as would be the case , if the Peltier elements 28 and the other Peltier elements 37 would have a lateral offset to one another.
  • FIG. 5a shows one of the Peltier elements 28 which, as shown in FIG. 4, is applied or fastened to the rear side 36b of the mirror M1.
  • FIG. 5b shows one of the Peltier elements 28 which, unlike that shown in FIG. 4, is embedded or embedded in the rear side 26b of the mirror M1, more precisely in a recess or bore provided there.
  • the embedding shown in Figure 5b is complete, i.e. the Peltier element 28 does not protrude beyond the rear face 26b of the mirror M1.
  • FIG. 5a shows one of the Peltier elements 28 which, as shown in FIG. 4, is applied or fastened to the rear side 36b of the mirror M1.
  • FIG. 5b shows one of the Peltier elements 28 which, unlike that shown in FIG. 4, is embedded or embedded in the rear side 26b of the mirror M1, more precisely in a recess or bore provided there.
  • the embedding shown in Figure 5b is complete, i.e. the Peltier element 28 does not protrude beyond the rear face 26b of the mirror
  • the Peltier element 28 ends flush with the rear side 26b of the mirror M1. It goes without saying, however, that partial embedding or partial embedding in the mirror M1 is also possible, in which case the Peltier element 28 partially protrudes beyond the rear side 26b of the mirror M1.
  • the connection of the respective Peltier elements 28 to the mirror M1 or to its mirror substrate is produced by an adhesive connection in the example shown.
  • the Peltier elements 28 shown in FIGS. 5a, b can also be attached to the mirror M1 in the manner shown in FIGS. 5a, b .
  • the additional Peltier elements 37 can also be attached to the surface 33, e.g. by gluing be attached or embedded in the surface 33 of the heat sink 30 in whole or in part.
  • Fig. 6a-c show three Peltier elements 28, of which the first, shown in Fig. 6a Peltier element 28 as in Fig. 5a on the back 26b of the mirror M1 is attached.
  • the Peltier element 28 shown in FIG. 6a is completely surrounded by a housing 39 in a gas-tight manner.
  • the housing 39 prevents contaminating substances that may be contained in the Peltier element 28 from escaping into the vacuum environment 40 (cf. FIG. 4) in which the mirror M1 is arranged.
  • FIG. 6b shows the case where the Peltier element 28 with the complete gas-tight housing 39 is embedded in the rear side 26b of the mirror M1.
  • FIG. 6a-c show three Peltier elements 28, of which the first, shown in Fig. 6a Peltier element 28 as in Fig. 5a on the back 26b of the mirror M1 is attached.
  • the Peltier element 28 shown in FIG. 6a is completely surrounded by a housing 39 in a gas-tight manner.
  • the housing 39 prevents contamin
  • the Peltier element 28 is also completely embedded in the rear side 26b of the mirror M1 and the housing 39 is in the form of a cover plate which is applied to a partial area on the rear side 26b of the mirror M1.
  • the plate-shaped housing 39 covers the surface of the Peltier element 28 embedded in the surface 26b and separates it from the vacuum environment 40.
  • the housing 39 is formed from a material that does not itself outgas contaminants.
  • the housing 39 is preferably formed from a material with good thermal conductivity. If necessary, the housing 39 can be in the form of a coating that is applied to the Peltier element 28 . As a rule, however, the housing 39 is a dimensionally stable component in the manner of a housing. It goes without saying that a housing 39 can also be attached to the other Peltier elements 37 in order to separate them in a gas-tight manner from the vacuum environment 40 in which the heat sink 30 is arranged in order to prevent contaminating substances from escaping into the vacuum Environment 40 to prevent.
  • the projection exposure system 1 from FIG. 1 can also have two or more optical arrangements 25 which are designed as described above in order to cool a respective mirror M1 to M6 of the projection optics 10 or a respective mirror of the illumination optics 4 .
  • the Peltier elements 28, 28′ or the further Peltier elements 37 can, if necessary, also be used for a short period of time of a respective mirror can be used to its working temperature by reversing the polarity of the voltage applied to it.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention concerne un ensemble optique (25) pour un système de lithographie, en particulier pour un système de lithographie EUV, comprenant : un élément optique réfléchissant (M1), au moins un élément Peltier (28) servant à réguler la température, en particulier le refroidissement, de l'élément optique réfléchissant (M1), le ou les éléments Peltier (28) étant fixés à l'élément optique réfléchissant (M1), et un système de refroidissement (29) servant à dissiper la chaleur provenant du ou des éléments Peltier (28). Le système de refroidissement (29) présente un corps de refroidissement (30) qui est disposé à une certaine distance du ou des éléments Peltier (28) de façon à dissiper la chaleur du ou des éléments Peltier (28) par refroidissement par rayonnement. L'invention concerne également un système de lithographie EUV comprenant au moins un ensemble optique (25) de ce type.
PCT/EP2022/061067 2021-06-10 2022-04-26 Ensemble optique et système de lithographie à refroidissement par rayonnement WO2022258253A1 (fr)

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DE102021205908.2 2021-06-10
DE102021205908.2A DE102021205908A1 (de) 2021-06-10 2021-06-10 Optische Anordnung und Lithographiesystem mit Strahlungskühlung

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040051984A1 (en) * 2002-06-25 2004-03-18 Nikon Corporation Devices and methods for cooling optical elements in optical systems, including optical systems used in vacuum environments
US20070091485A1 (en) 2005-10-13 2007-04-26 Nikon Corporation Liquid Cooled Mirror for Use in Extreme Ultraviolet Lithography
US20100261120A1 (en) * 2009-04-09 2010-10-14 Carl Zeiss Smt Ag Mirror for guiding a radiation bundle
WO2012069351A1 (fr) 2010-11-25 2012-05-31 Carl Zeiss Smt Gmbh Procédé et agencement permettant de déterminer l'état de chauffage d'un miroir dans un système optique
US20130063833A1 (en) * 2009-12-30 2013-03-14 Martinus Henricus Johannes Lemmen Shape stabilized mirror module and method to stabilize a reflective element
US20160010901A1 (en) * 2013-03-15 2016-01-14 Asml Netherlands B.V. Lithographic Apparatus and to a Reflector Apparatus
DE102020204722A1 (de) 2020-04-15 2020-11-12 Carl Zeiss Smt Gmbh Optisches system, lithographieanlage und verfahren zum betreiben eines optischen systems

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1387054B1 (fr) 2002-07-31 2012-07-25 Canon Kabushiki Kaisha Dispositif de refroidissement pour un membre optique, appareil d'exposition comprenant ledit dispositif de refroidissement, et méthode de fabrication d'un article
JP2005109158A (ja) 2003-09-30 2005-04-21 Canon Inc 冷却装置及び方法、それを有する露光装置、デバイスの製造方法
JPWO2007122856A1 (ja) 2006-04-24 2009-09-03 株式会社ニコン 光学素子冷却装置および露光装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040051984A1 (en) * 2002-06-25 2004-03-18 Nikon Corporation Devices and methods for cooling optical elements in optical systems, including optical systems used in vacuum environments
US20070091485A1 (en) 2005-10-13 2007-04-26 Nikon Corporation Liquid Cooled Mirror for Use in Extreme Ultraviolet Lithography
US20100261120A1 (en) * 2009-04-09 2010-10-14 Carl Zeiss Smt Ag Mirror for guiding a radiation bundle
US20130063833A1 (en) * 2009-12-30 2013-03-14 Martinus Henricus Johannes Lemmen Shape stabilized mirror module and method to stabilize a reflective element
WO2012069351A1 (fr) 2010-11-25 2012-05-31 Carl Zeiss Smt Gmbh Procédé et agencement permettant de déterminer l'état de chauffage d'un miroir dans un système optique
US20160010901A1 (en) * 2013-03-15 2016-01-14 Asml Netherlands B.V. Lithographic Apparatus and to a Reflector Apparatus
DE102020204722A1 (de) 2020-04-15 2020-11-12 Carl Zeiss Smt Gmbh Optisches system, lithographieanlage und verfahren zum betreiben eines optischen systems

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