WO2022248526A1 - A coated cutting tool - Google Patents

A coated cutting tool Download PDF

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Publication number
WO2022248526A1
WO2022248526A1 PCT/EP2022/064146 EP2022064146W WO2022248526A1 WO 2022248526 A1 WO2022248526 A1 WO 2022248526A1 EP 2022064146 W EP2022064146 W EP 2022064146W WO 2022248526 A1 WO2022248526 A1 WO 2022248526A1
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WIPO (PCT)
Prior art keywords
layer
hkl
cutting tool
grain size
tool according
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PCT/EP2022/064146
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English (en)
French (fr)
Inventor
Linus VON FIEANDT
Raluca MORJAN BRENNING
Jan Engqvist
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Sandvik Coromant AB
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Sandvik Coromant AB
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Priority to KR1020237040131A priority Critical patent/KR20240013113A/ko
Priority to JP2023572083A priority patent/JP2024519534A/ja
Priority to US18/563,474 priority patent/US12599971B2/en
Priority to BR112023024763A priority patent/BR112023024763A2/pt
Priority to EP22730474.8A priority patent/EP4347916A1/en
Priority to CN202280036932.4A priority patent/CN117460861A/zh
Publication of WO2022248526A1 publication Critical patent/WO2022248526A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B27/00Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14Cutting tools of which the bits or tips or cutting inserts are of special material
    • B23B27/148Composition of the cutting inserts
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/042Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02Pretreatment of the material to be coated
    • C23C16/0272Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/308Oxynitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34Nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/36Carbonitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/403Oxides of aluminium, magnesium or beryllium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/044Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B2228/00Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
    • B23B2228/10Coatings
    • B23B2228/105Coatings with specified thickness

Definitions

  • the present invention relates to a coated cutting tool comprising a substrate and a coating, wherein the coating is deposited by CVD and comprises a Ti(C,N) layer and an a-A ⁇ Ot layer.
  • CVD coated cutting tools are well known in the art.
  • CVD coated cutting tools and PVD coated cutting tools are the two most dominating types of coated cutting tools. Advantages with these coatings are high resistance to chemical and abrasive wear which are important to achieve long tool life of the coated cutting tool.
  • CVD coatings comprising a layer of Ti(C,N) together with a layer of alumina are known to perform well in for example turning or milling in steel.
  • EP2791387A1 discloses a coated cutting tool provided with a fine-grained titanium carbonitride layer.
  • the coating is advantageous in showing high resistance to flaking in turning of nodular cast iron and in high speed cutting.
  • a columnar CVD TiCN layer is described with an average grain width of 0.05-0.4 pm.
  • the present invention relates to a cutting tool comprising a substrate at least partially coated with a coating, said coating comprising a layer of Ti(C,N), a layer of AI 2 O 3 and there between a bonding layer, wherein said Ti(C,N) layer with a thickness of 3-25 pm is composed of columnar grains, wherein an average grain size D422 of the Ti(C,N) layer is 25-50 nm, as measured with X-ray diffraction with CuKa radiation, the grain size D422 is calculated from the full width at half maximum (FWHM) of the (422) peak according to Schemer ' s equation:
  • D422 is the average grain size of the Ti(C,N)
  • K is the shape factor here set at 0.9
  • l is the wave length for the CuKa radiation here set at 1.5405 A
  • B422 is the FWHM value for the (422) reflection
  • Q is the Bragg angle
  • the Ti(C,N) layer comprises a portion B1 that is adjacent to the bonding layer
  • an average grain size of the Ti(C,N) grains in portion B1 is larger than the average grain size D422 over the whole thickness of the Ti(C,N) layer
  • the Ti(C,N) grains has an average grain size of 140-300 nm as measured in the portion B1 of the Ti(C,N) layer, within 0.5 pm from the bonding layer, as measured by counting the number of grains along a line in a SEM micrograph at a 15.000x magnification, wherein said line is parallel with the substrate surface.
  • the present invention provides an increased adhesion between a very fine grained Ti(C,N) layer and a a-AhC layer.
  • This increased adhesion is achieved by at the end of the Ti(C,N) deposition change the deposition process conditions so that some of the fine Ti(C,N) grains widens and a more coarse grained Ti(C,N) portion is formed. Thereafter the process conditions are changed again, this time to provide an optimal outer surface of the Ti(C,N) grains. In this way an outermost surface of the Ti(C,N) is formed that is similar to the outermost surface of the coarse grained Ti(C,N) that is known to show high adhesion via the bonding layer to the a-AI 2 C>3 layer. If the average grain size in portion B1 is too small the adhesion to the subsequently deposited a-AI 2 C>3 layer is not increased.
  • the average grain size in portion B1 is suitably smaller than 300 nm since this is advantageous for the wear resistance.
  • the thickness of the portion B1 of the Ti(C,N) layer as measured in the growth direction of the coating is 0.5-1.5 pm, preferably 0.6-0.9 pm, most preferably 0.6-0.8 pm.
  • Fine grained Ti(C,N) is advantageous as a wear resistant layer, which could be due to its high amount of grain boundaries or due to a more smooth or even thickness of the layer.
  • the portion of the TiCN layer that is fine grained should therefore be relatively thick.
  • the coarse-grained portion that is to contribute with an increased adhesion is to be relatively limited, preferably 0.5-1.5 pm, more preferably 0.6-0.9 pm, most preferably 0.6-0.8 pm, in thickness of the portion B1. If the portion B1 is too thin the adhesion will not be enhanced.
  • the bonding layer comprises at least one compound selected from the group of titanium carboxide, titanium oxynitride and titanium carboxynitride.
  • a bonding layer of titanium carboxide, titanium oxynitride or titanium carboxynitride is advantageous in that it can provide an epitaxial relation between the Ti(C,N) layer and the a-A Os layer.
  • the grain size D422 of Ti(C,N) is 25-40 nm, preferably 25-35 nm.
  • the present invention with increasing the adhesion between a fine grained Ti(C,N) and an a-A Os layer is especially advantageous for Ti(C,N) layers with very fine grains such as when grain size D422 of Ti(C,N) is 25-40 nm, or even 25-35 nm.
  • the Ti(C,N) layer exhibits an X-ray diffraction pattern, as measured using CuKa radiation and Q-2Q scan, wherein the TC(hkl) is defined according to Harris formula:
  • Ip(hkl) n l where l(hkl) is the measured intensity (integrated area) of the (hkl) reflection, I0(hkl) is the standard intensity according to ICDD ' s PDF-card No. 42-1489, n is the number of reflections, reflections used in the calculation are (1 1 1), (2 0 0), (2 2 0), (3 1 1), (3 3 1), (4 2 0) and (42 2), wherein TC(422) 5s3, preferably 5s4.
  • the AI 2 O 3 layer is a a-AhC layer, preferably with an average thickness of the a-AhC layer is 1 pm - 15 pm, preferably 3-10 pm.
  • n is the number of reflections used in the calculation, and where the (hkl) reflections used are (1 0 4), (1 1 0), (1 1 3), (0 2 4), (1 1 6), (2 1 4), (3 0 0) and (0 0 12) characterized in that TC(0 0 12) 37.5, preferably 3 7.7, more preferably 37.8.
  • the layer, wherein said a-AhC layer exhibits a TC(110) £ 0.2, preferably £ 0.1.
  • the Ti(C,N) grains in the portion B1 of Ti(C,N) layer has an average grain size of 140 nm - 175 nm. If the average grain size in portion B1 is too large the adhesion is still high, but it was found that the highest orientation of the subsequently deposited a-AhC layer could not be reached.
  • an average thickness of the Ti(C,N) layer is 4- 20 pm, preferably 5-15 pm.
  • an average thickness of the bonding layer is 0.25 - 2.5 pm, preferably 0.5 - 2.0 pm.
  • an average thickness of the coating is 5.0 pm - 30.0 pm, preferably 10-20 pm.
  • said substrate is of cemented carbide, cermet or ceramic.
  • the atomic ratio of carbon to the sum of carbon and nitrogen (C/(C+N)) contained in the Ti(C,N) layer of the present invention is preferably 0.50-0.65, more preferably 0.55-0.62 as measured by electron microprobe analysis. Still other objects and features of the present invention will become apparent from the following definitions and examples considered in conjunction with the accompanying drawings.
  • cutting tool is herein intended to denote cutting tools suitable for metal cutting applications such as inserts, end mills or drills.
  • the application areas can for example be turning, milling or drilling in metals such as steel.
  • Average grain size of Ti(C,N) layer In order to investigate the average grain size of the Ti(C,N) grains in the Ti(C,N) layer, X- ray diffraction (XRD) was conducted on the flank face using a PANalytical CubiX3 diffractometer equipped with a PIXcel detector. The coated cutting tool was mounted in sample holder to ensure that the flank face of the samples was parallel to the reference surface of the sample holder and also that the flank face was at appropriate height. Cu-Ka radiation was used for the measurements, with a voltage of 45 kV and a current of 40 mA. Anti-scatter slit of 1 ⁇ 2 degree and divergence slit of 1 ⁇ 4 degree were used.
  • XRD X- ray diffraction
  • the diffracted intensity from the coated cutting tool was measured in the 2Q range 20° to 140°, i.e. over an incident angle Q range from 10 to 70°.
  • the data analysis including background fitting, Cu-Ko2 stripping and profile fitting of the data, was done using PANalytical’s X’Pert HighScore Plus software.
  • the average grain size D422 is calculated from the full width at half maximum (FWHM) of the (422) peak according to Schemer ' s equation: wherein D422 is the mean grain size of the Ti(C,N), K is the shape factor here set at 0.9, l is the wave length for the CuKcn radiation here set at 1.5405 A, B422 is the FWHM value for the (422) reflection and Q is the Bragg angle i.e the incident angle.
  • the obtained FWHM from the measurement contains both broadening from the instrument and broadening caused by the small grain size. To compensate for this a gaussian approximation was used (Birkholz, 2006).
  • B422 is the line broadening (in radians) at FWHM after subtracting the instrumental broadening (0,00174533 radians) and is defined in equation (2):
  • B422 V((FWHMobs) 2 -(FWHMins) 2 ) (2) where B422 is the broadening (in radians) used for the grain size calculation, FWHMo b s is the measured broadening (in radians), FWHMi ns is the instrumental broadening (in radians).
  • a further layer, above the Ti(C,N)-single-layer can be removed by a method that does not substantially influence the XRD measurement results, e.g. chemical etching.
  • region B1 located closest to the bonding layer that is to bond the AI2O3 layer to the Ti(C,N) layer, the grains of the Ti(C,N) are enlarged to improve the adhesion.
  • the average grain size of the Ti(C,N) grains in this area is analysed by identifying grain boundaries and counting grains along a line in a cross-sectional SEM micrograph and dividing the length of the line with the number of grains.
  • the as coated inserts were mounted in a black conductive phenolic resin from AKASEL which were afterwards ground down 1 mm and then polished in two steps: rough polishing (9pm) and fine polishing (1 pm) using a diamond slurry solution. To observe layers microstructure the samples were further polished using a colloidal silica suspension (MasterPolish 2). The polishing was performed until a scratch free cross section was acquired. The samples were afterwards cleaned with deionized water and detergent to remove residual polishing suspension and dried with clean air spray.
  • the SEM used for the grain size study was a Carl Zeiss AG- Supra 40 type operated at 3kV acceleration voltage using a 30 pm aperture.
  • the SEM images were acquired at 15.000x magnification and between about 5 and 10 mm working distance.
  • a horizontal line of at least 7.5 pm intersecting the Ti(C,N) grains in the upper part of portion B1 right below the bonding layer was drawn on the SEM image as is shown in Fig 1.
  • the grains crossing the horizontal line were counted and the average grain size was calculated by dividing the number of grains with the length of the line and are given in table 5. To obtain a better statistics, the grains crossing the horizontal line were counted for two different randomly chosen regions for each sample.
  • X-ray diffraction was conducted on the flank face of cutting tool inserts using a PANalytical CubiX3 diffractometer equipped with a PIXcel detector.
  • the coated cutting tool insert was mounted in a sample holder to ensure that the flank face of the cutting tool insert was parallel to the reference surface of the sample holder and also that the flank face was at appropriate height.
  • Cu-Ka radiation was used for the measurements, with a voltage of 45 kV and a current of 40 mA.
  • Anti-scatter slit of 1 ⁇ 2 degree and divergence slit of 1 ⁇ 4 degree were used.
  • the diffracted intensity from the coated cutting tool was measured in the range 20° to 140° 2Q, i.e. over an incident angle Q range from 10 to 70°.
  • the data analysis including background subtraction, Cu-K Q 2 stripping and profile fitting of the data, was done using PANalytical’s X’Pert HighScore Plus software. A general description of the fitting is made in the following.
  • the output (integrated peak areas for the profile fitted curve) from this program was then used to calculate the texture coefficients of the layer by comparing the ratio of the measured intensity data to the standard intensity data according to a PDF-card of the specific layer (such as a layer of Ti(C,N) or a-A ⁇ O , using the Harris formula (3) as disclosed below. Since the layer is finitely thick the relative intensities of a pair of peaks at different 2Q angles are different than they are for bulk samples, due to the differences in path length through the layer.
  • thin film correction was applied to the extracted integrated peak area intensities for the profile fitted curve, taken into account also the linear absorption coefficient of layer, when calculating the TC values. Since possible further layers above for example the a-AhCh layer will affect the X-ray intensities entering the a-AI 2 C>3 layer and exiting the whole coating, corrections need to be made for these as well, taken into account the linear absorption coefficient for the respective compound in a layer. The same applies for X-ray diffraction measurements of a Ti(C, N) layer if the Ti(C, N) layer is located below for example an a-AI 2 C>3 layer.
  • a further layer, such as TiN, above an alumina layer can be removed by a method that does not substantially influence the XRD measurement results, e.g. chemical etching.
  • a further layer, such as TiN above an alumina layer can be removed by a method that does not substantially influence the XRD measurement results, e.g. chemical etching.
  • l(hkl) measured (integrated area) intensity of the (hkl) reflection
  • lo(hkl) standard intensity according to ICDD’s PDF-card no 00-010-0173
  • n number of reflections to be used in the calculation.
  • the (hkl) reflections used are: (1 04), (1 1 0), (1 1 3), (02 4), (1 1 6), (2 1 4), (300) and (00 12).
  • the measured integrated peak area is thin film corrected and corrected for any further layers above (i.e. on top of) the a-AbC layer before said ratio is calculated.
  • the texture coefficients TC (hkl) for different growth directions of the columnar grains of the Ti(C,N) layer were calculated according to Harris formula (3) as disclosed earlier, where l(hkl) is the measured (integrated area) intensity of the (hkl) reflection, lo(hkl) is the standard intensity according to ICDD’s PDF-card no 42-1489, n is the number of reflections to be used in the calculation.
  • the (hkl) reflections used are (1 1 1), (2 0 0), (2 2 0), (3 1 1), (3 3 1), (42 0) and (42 2).
  • peak overlap is a phenomenon that can occur in X-ray diffraction analysis of coatings comprising for example several crystalline layers and/or that are deposited on a substrate comprising crystalline phases, and this has to be considered and compensated for.
  • An overlap of peaks from the a-AbC layer with peaks from the Ti(C,N) layer might influence measurement and needs to be considered.
  • WC in the substrate can have diffraction peaks close to the relevant peaks of the present invention.
  • Figure 1 shows a Scanning Electron Microscope (SEM) image of a cross section of an example of the inventive coating, Sample D, where the measurement of the amount of Ti(C,N) grains crossing the line parallel to the substrate is illustrated in the portion B1.
  • Figure 2 shows a Scanning Electron Microscope (SEM) image of a cross section of an example of the inventive coating, Sample D, where the portion B1 of the Ti(C,N) layer (1), the bonding layer (2) and the a-AI 2 C layer (3) are indicated,
  • Figure 3 shows a Scanning Electron Microscope (SEM) image of a cross section of an example of a reference coating, Sample A, where the uppermost Ti(C,N) (1), the bonding layer (2) and the lowermost a-AI 2 C (3) is visible,
  • Figure 4 shows a Scanning Electron Microscope (SEM) image of a cross section of an example of the inventive coating, Sample G, where the portion B1 of the Ti(C,N) layer (1), the bonding layer (2) and the a-AI 2 C layer (3) are indicated
  • Figure 5 shows a Scanning Electron Microscope (SEM) image of a cross section of an example of a reference coating, Sample B, where the uppermost Ti(C,N) (1), the bonding layer (2) and the lowermost a-AI 2 C (3) is visible,
  • Figure 6 shows a Scanning Electron Microscope (SEM) image of a top surface of portion B1 of a sample provided with a Ti(C,N) layer corresponding to the Ti(C,N) in sample D where the morphology of the outermost surface of the portion B1 is visible,
  • SEM Scanning Electron Microscope
  • Figure 7 shows a Scanning Electron Microscope (SEM) image of a top surface of the Ti(C,N) layer of a sample provided with a Ti(C,N) layer corresponding to the Ti(C,N) in sample B where the morphology of the outermost surface of the very fine grained Ti(C,N) is visible,
  • SEM Scanning Electron Microscope
  • Figure 8 shows a Scanning Electron Microscope (SEM) image of a top surface of the Ti(C,N) layer of a sample provided with a Ti(C,N) layer corresponding to the Ti(C,N) in the reference sample A where the morphology of the outermost surface of the coarse grained Ti(C,N) is visible, and
  • Figure 9 is a schematic overview showing the position of the layers and portions of the present invention, the Ti(C,N) layer (1), the portion B1 of the Ti(C,N) layer (1), the bonding layer (2), the a-AI 2 C layer (3) and the substrate (4).
  • Coated cutting tools were manufactured, analysed and tested in cutting tests.
  • Cemented carbide substrates were manufactured utilizing conventional processes including milling, mixing, spray drying, pressing and sintering.
  • the ISO-type geometry of the cemented carbide substrates (inserts) was CNMG-120408-PM.
  • the composition of the cemented carbide was 7.2 wt% Co, 2.9 wt% TaC, 0.5 wt% NbC, 1.9 wt%TiC, 0.4 wt% TiN and the rest WC.
  • the substrates were exposed to a mild blasting treatment to remove any residuals on the substrate surfaces from the sintering process.
  • the sintered substrates were CVD coated in a radial CVD reactor of lonbond Type size 530 capable of housing 10.000 half inch size cutting inserts.
  • the samples to be tested and analysed further were selected from the middle of the chamber and at a position along half the radius of the plate between the center and the periphery of the plate. Mass flow controllers were chosen so that the high flow of for example CH 3 CN could be set.
  • a first innermost coating of about 0.2 pm TiN was deposited on all substrates in a process at 400 mbar and 885 °C.
  • a gas mixture of 48.8 vol% H2, 48.8 vol% N2 and 2.4 vol% TiCU was used.
  • the reference sample A was deposited with the process steps V and W as shown in Table 1.
  • the temperature adjustment from 885°C to 870°C before starting with process step X for the samples B-G was made in 50 vol% H2 and 50 vol% N2 at 80 mbar.
  • the Ti(C,N) layer of reference sample B was deposited with the process step X as shown in Table 1.
  • the Ti(C,N) layers were deposited with the process steps X, Y and Z using the deposition times as indicated in Tables 1 and 2. The process times were adjusted to reach about the same total Ti(C,N) layer thickness for all the samples.
  • a 0.7-0.9 pm thick bonding layer was deposited at 1000°C on top of the Ti(C,N) layer by a process consisting of four separate reaction steps. First a 8 minutes HTCVD Ti(C,N) step using TiCU, CFU, N2, HCI and H2 at 400 mbar, then a second step (Ti(C,N,0)-1) using TiCU, CH3CN, CO, N2 and H2 at 70 mbar for 7 minutes, then a third step (Ti(C,N,0)-2) using TiCU, CH3CN, CO, N2 and H2 at 70 mbar for 5 minutes and finally a fourth step (TiN) using TiCU, N2 and H2 at 70 mbar for 6 minutes.
  • the CO gas flow was continuously linearly increased from a start value to a stop value as shown in Table 3. All other gas flows were kept constant, but since the overall gas flow is increased, the concentration of all gases were somewhat influenced due to this.
  • the bonding layer was oxidized for 4 minutes in a mixture of C0 2 , CO, N 2 and H 2 .
  • the layer thicknesses were measured on the rake face of the cutting tool samples using a Scanning Electron Microscope.
  • the layer thicknesses of the coating the samples A-G are shown in Table 4.
  • the tool life criterion was considered reached when the primary or secondary flank wear was >0.3 mm or when the crater area (exposed substrate) was > 0.2 mm 2 . As soon as any of these criteria were met the lifetime of the sample was considered reached.
  • the result of the cutting test is presented in Table 8 and 9.
  • the cutting tools were also evaluated by being exposed to an abrasive wet blasting.
  • the blasting was performed on the rake faces of the cutting tools.
  • the blaster slurry consisted of 20 vol-% alumina in water and an angle of 90° between the rake face of the cutting insert and the direction of the blaster slurry.
  • the distance between the gun nozzle and the surface of the insert was about 145 mm.
  • the pressure of the slurry to the gun was 1.8 bar for all samples, while the pressure of air to the gun was 2.2 bar.
  • the alumina grits were F230 mesh (FEPA 42-2:2006).
  • the average time for blasting per area unit was 4.4 seconds. Samples B and C could not withstand the wet blasting, the coating of sample B showed severe flaking, the sample C showed spot wise flaking. All the other samples did withstand the wet blasting without destroying the coatings.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
PCT/EP2022/064146 2021-05-27 2022-05-25 A coated cutting tool Ceased WO2022248526A1 (en)

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US18/563,474 US12599971B2 (en) 2021-05-27 2022-05-25 Coated cutting tool
BR112023024763A BR112023024763A2 (pt) 2021-05-27 2022-05-25 Uma ferramenta de corte revestida
EP22730474.8A EP4347916A1 (en) 2021-05-27 2022-05-25 A coated cutting tool
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JP5884138B2 (ja) * 2011-04-21 2016-03-15 住友電工ハードメタル株式会社 表面被覆切削工具およびその製造方法
US20130216777A1 (en) 2012-02-21 2013-08-22 Wenping Jiang Nanostructured Multi-Layer Coating on Carbides
JP6024981B2 (ja) * 2012-03-09 2016-11-16 三菱マテリアル株式会社 高速断続切削加工で硬質被覆層がすぐれた耐チッピング性を発揮する表面被覆切削工具
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