WO2022233145A1 - Quantum dot electroluminescent device - Google Patents

Quantum dot electroluminescent device Download PDF

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Publication number
WO2022233145A1
WO2022233145A1 PCT/CN2021/142090 CN2021142090W WO2022233145A1 WO 2022233145 A1 WO2022233145 A1 WO 2022233145A1 CN 2021142090 W CN2021142090 W CN 2021142090W WO 2022233145 A1 WO2022233145 A1 WO 2022233145A1
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quantum dot
transport layer
layer
light
thickness
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PCT/CN2021/142090
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French (fr)
Chinese (zh)
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侯文军
严依然
徐威
杨一行
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Tcl科技集团股份有限公司
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/115OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots

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  • the present disclosure relates to the technical field of quantum dot electroluminescence devices, and in particular, to a quantum dot electroluminescence device.
  • QLEDs quantum dot-based electroluminescent diodes
  • quantum dot materials have been developed by leaps and bounds, and the external quantum efficiency of red, green and blue QLED devices has been greatly improved, especially in CdSe-based devices.
  • the improved efficiency of QLED devices highlights its future prospects. So far, there have been many studies on structure and material optimization for QLED devices, including the selection of core-shell quantum dot materials and the alloying of core-shell interfaces to reduce surface defects and suppress Auger processes, and the selection of surface ligands for core-shell quantum dots. Design and optimize the design of charge transport layers, etc., to improve their external quantum efficiency and prolong their lifetime.
  • the research on QLED devices all use quantum dots with core-shell structure, which have been shown to have excellent performance.
  • the shell layer can well protect the quantum dots, reduce surface defects and improve the quantum yield, and effectively suppress nonradiative transitions; the shell layer has also been shown to reduce the Foster energy transfer process in quantum dot films by increasing the thickness of the shell layer. dipole resonance, thereby improving the quantum yield of quantum dot films.
  • the QLED device needs to inject electrons and holes when it works.
  • the simplest QLED device consists of a cathode, an electron transport layer, a quantum dot light-emitting layer, a hole transport layer and an anode.
  • the quantum dot film is sandwiched between the charge transport layer.
  • a forward bias voltage is applied to both ends of the QLED device, electrons and holes enter the quantum dot light-emitting layer through the electron transport layer and the hole transport layer, respectively, and enter the quantum dot light-emitting layer through the electron transport layer and the hole transport layer, respectively.
  • the quantum dot light-emitting layer performs compound light emission.
  • the charge transport layer not only affects the charge injection efficiency, but also imposes requirements on the QLED process and affects the external quantum efficiency.
  • the electron-hole injection imbalance not only reduces the ability of the injected charge to convert into excitons, but also causes the charge to accumulate in the QLED device, increasing the non-radiative transition of charged excitons, resulting in lower efficiency and reduced lifetime.
  • Efficient exciton formation in QLEDs requires charge transport layers with good blocking properties for efficient charge confinement within the QD layer and reasonable modulation of electron and hole injection for charge balance.
  • quantum efficiencies of quantum dot devices with three primary colors of red, green and blue are all greater than 20%, and the efficiency of quantum dot devices has reached the level of commercial application.
  • the present disclosure proposes a quantum dot electroluminescence device, aiming at solving the problem of low lifetime of the existing quantum dot electroluminescence device.
  • a quantum dot electroluminescence device wherein the pure electronic device corresponding to the quantum dot electroluminescence device is denoted as an EOD device, and the pure hole device corresponding to the quantum dot electroluminescence device is denoted as a HOD device;
  • V EOD the voltage corresponding to the EOD device
  • V HOD the voltage corresponding to the HOD device
  • the hole functional layer and the electron functional layer of the quantum dot electroluminescent device are configured to be 0.5V ⁇ V HOD -V EOD ⁇ 10V.
  • the current density is 5-50 mA/cm 2 .
  • the current density is 5-10 mA/cm 2 .
  • the lifetime T95 of the quantum dot electroluminescent device is greater than or equal to 10000h@1000nits.
  • the hole functional layer includes a hole transport layer, and the electron functional layer is an electron transport layer;
  • the hole transport layer material is TFB, the hole transport layer thickness is 15-25nm, the electron transport layer material is metal oxide Zn x Mg y O, wherein x is 0.90-0.97, y is 0.03-0.1 , the thickness of the electron transport layer is 20-50 nm;
  • the material of the hole transport layer is PVK
  • the thickness of the hole transport layer is 15-25 nm
  • the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.90-0.97 and y is 0.03 ⁇ 0.1, and the thickness of the electron transport layer is 20 to 50 nm;
  • the material of the hole transport layer is TFB
  • the thickness of the hole transport layer is 15-25 nm
  • the material of the electron transport layer is metal oxide ZnO
  • the thickness of the electron transport layer is 20-50 nm.
  • the hole functional layer includes a hole transport layer, and the electron functional layer is an electron transport layer;
  • the material of the hole transport layer is TFB, the thickness of the hole transport layer is 20-23 nm, the material of the electron transport layer is Zn x Mg y O, wherein x is 0.92-0.97, y is 0.03-0.08, and the The thickness of the electron transport layer is 25 to 35 nm.
  • the quantum dot electroluminescent device includes an anode, a hole injection layer, a hole transport layer, a quantum dot light-emitting layer, an electron transport layer and a cathode that are stacked in sequence.
  • the quantum dot electroluminescent device further comprises a light extraction layer
  • the light extraction layer is located on the surface of the cathode on the side away from the anode;
  • the light extraction layer is located on the surface of the anode on the side away from the cathode.
  • the material of the quantum dot light-emitting layer is red light quantum dots, and the light emission wavelength of the red light quantum dots is 610-625 nm;
  • the material of the quantum dot light-emitting layer is green quantum dots, and the emission wavelength of the green quantum dots is 525-550 nm.
  • the present disclosure provides a long-life quantum dot device structure.
  • the quantum dot electroluminescence device has a long lifetime.
  • FIG. 1 is a schematic structural diagram of a quantum dot electroluminescence device according to an embodiment of the present disclosure.
  • FIG. 2 is an EOD device corresponding to the quantum dot electroluminescent device shown in FIG. 1 .
  • FIG. 3 is a HOD device corresponding to the quantum dot electroluminescent device shown in FIG. 1 .
  • FIG. 4 is a schematic flowchart of a method for preparing a quantum dot electroluminescent device according to an embodiment of the present disclosure.
  • Example 5 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 1.
  • Example 6 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 2.
  • FIG. 7 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 3.
  • FIG. 7 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 3.
  • FIG. 8 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 4.
  • FIG. 8 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 4.
  • FIG. 9 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 5.
  • FIG. 10 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 6.
  • FIG. 10 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 6.
  • the present disclosure provides a quantum dot electroluminescence device.
  • the present disclosure will be described in further detail below. It should be understood that the specific embodiments described herein are only used to explain the present disclosure, but not to limit the present disclosure.
  • Embodiments of the present disclosure provide a quantum dot electroluminescence device, wherein a pure electronic device corresponding to the quantum dot electroluminescence device is denoted as an EOD device, and a pure hole device corresponding to the quantum dot electroluminescence device is denoted as an EOD device HOD device;
  • V EOD the voltage corresponding to the EOD device
  • V HOD the voltage corresponding to the HOD device
  • the hole functional layer and the electron functional layer of the quantum dot electroluminescent device are configured to be 0.5V ⁇ V HOD -V EOD ⁇ 10V.
  • the inventors have found through research and testing that at a current density of more than 5 mA/cm 2 , the hole functional layer and electron functional layer of the quantum dot electroluminescent device are configured to be 0.5V ⁇ V HOD -V EOD ⁇ 10V , the quantum dot electroluminescent device has a long lifetime. This is because the voltage difference between the HOD device and the EOD device is within this range, and more electrons are injected and transported in the quantum dot electroluminescence device.
  • the accumulation of the point light-emitting layer while promoting the injection of holes into the quantum point light-emitting layer, prolongs the delayed fluorescence lifetime of the excitons and reduces the non-radiative transition of the excitons, so that the quantum dot electroluminescent device has a long lifetime.
  • V HOD -V EOD 0.5V
  • the carrier of the device itself is in a relatively balanced state.
  • the quantum dot will appear in the state of two electrons or two holes in the same quantum dot, which is easy to cause Auger recombination, resulting in
  • the brightness decays quickly, which affects the lifespan; when V HOD -V EOD >10V, too many electrons accumulate in the quantum dots, which affects the stability of the quantum dots, especially their surface ligands, thereby affecting the lifespan.
  • the above current density is approximately in the range of 5-50 mA/cm 2 . That is, in the range of 5-50 mA/cm 2 , when 0.5V ⁇ V HOD ⁇ V EOD ⁇ 10V, the quantum dot electroluminescence device has a long life. In one embodiment, the current density is approximately in the range of 5-10 mA/cm 2 .
  • the pure electronic device ie, EOD device
  • the quantum dot electroluminescence device refers to: the others are basically the same as the target quantum dot electroluminescence device, and the difference is that the target quantum dot electroluminescence device is electrically
  • the hole functional layer between the anode and the quantum dot light-emitting layer in the electroluminescent device is replaced with a hole blocking layer, such as an electron transport layer used as the hole blocking layer, because the valence band of the inorganic electron transport layer is related to the work of the anode.
  • the functions do not match, so that there is basically no hole injection and transport.
  • the charge in this device is caused by the injection and transport of electrons at the cathode terminal, and has nothing to do with holes. That is to say, in the EOD device, only electrons are injected and transported, and holes cannot be injected and transported.
  • the EOD device is used to evaluate the electron injection and transport capability in the device.
  • the pure hole device (ie, HOD device) corresponding to the quantum dot electroluminescence device refers to: the others are basically the same as the target quantum dot electroluminescence device, and the difference is that the target quantum dot electroluminescence device is placed in the target quantum dot electroluminescence device.
  • the electron functional layer between the cathode and the quantum dot light-emitting layer is replaced with an electron blocking layer, such as a hole transport layer used as the electron blocking layer, because the LUMO energy level of the organic hole transport layer does not match the work function of the cathode, As a result, there is basically no electron injection and transport. Therefore, the charge in this device is caused by the injection and transport of holes at the anode end, and has nothing to do with electrons. That is to say, in the HOD device, only holes are injected and transported, and electrons cannot be injected and transported. The HOD device was used to evaluate the hole injection and transport capabilities.
  • the quantum dot electroluminescence device has various forms, and the quantum dot electroluminescence device is divided into a positive type structure and an inverse type structure.
  • the quantum dot electroluminescence device is a positive type structure;
  • the quantum dot electroluminescent device has an inversion structure. This embodiment will mainly take the structure shown in FIG. 1 as an example for detailed description.
  • an embodiment of the present disclosure provides a quantum dot electroluminescence device, including an anode, a hole injection layer, a hole transport layer, a quantum dot light-emitting layer, an electron transport layer, a cathode, and a light extraction layer that are stacked in sequence. ;
  • V EOD the voltage corresponding to the EOD device
  • V HOD the voltage corresponding to the HOD device
  • the hole functional layer (hole injection layer and hole transport layer) and electron functional layer (electron transport layer) of the quantum dot electroluminescent device are configured to be 0.5 V ⁇ V HOD -V EOD ⁇ 10V .
  • the EOD device corresponding to the quantum dot electroluminescent device shown in FIG. 1 can be shown in FIG. 2
  • the HOD device corresponding to the quantum dot electroluminescent device shown in FIG. 1 can be shown in FIG. 3 .
  • the anode is a total reflection electrode
  • the cathode is a transmission electrode
  • the light emitted by the quantum dot electroluminescent device is emitted from the cathode
  • a light extraction layer is arranged on the cathode, which can increase the light extraction efficiency, thereby improving the device's performance.
  • Luminous efficiency can also be a transmissive electrode
  • the cathode can be a total reflection electrode.
  • the light emitted by the quantum dot electroluminescent device is emitted from the anode.
  • the light extraction layer is arranged on the anode to increase the light extraction efficiency, thereby improving the efficiency of light extraction. The luminous efficiency of the device.
  • the material of the light extraction layer can be the same as the material of the hole transport layer, such as CBP, etc.; it can also be the same as the material of the electron transport layer, such as LiF, etc.; it can also be o-phenanthroline and its derivatives, etc.
  • the thickness of the light extraction layer is about 30nm-150nm.
  • the emission wavelength of the red quantum dot is 610-635 nm.
  • the emission wavelength of the green quantum dots is 525-555 nm.
  • the light-emitting wavelength of the blue-light quantum dots is 450-480 nm.
  • the quantum dot light-emitting layer has a thickness of 5 nm-50 nm.
  • the red light quantum dots, green light quantum dots and blue light quantum dots can be independently selected from one or more of binary phase, ternary phase, quaternary phase quantum dots, etc.; wherein binary phase Phase quantum dots include one or more of CdS, CdSe, CdTe, InP, AgS, PbS, PbSe, HgS, etc., and ternary quantum dots include one or more of ZnCdS, CuInS, ZnCdSe, ZnSeS, ZnCdTe, PbSeS, etc.
  • the quaternary phase quantum dots include one or more of ZnCdS/ZnSe, CuInS/ZnS, ZnCdSe/ZnS, CuInSeS, ZnCdTe/ZnS, PbSeS/ZnS and the like.
  • the quantum dots can be cadmium-containing or cadmium-free.
  • the quantum dot light-emitting layer of the material has the characteristics of wide excitation spectrum and continuous distribution, and high stability of emission spectrum.
  • the anode is a total reflection electrode
  • the material of the total reflection electrode may be selected from one of metals such as Al, Ag, Mo, and their alloy materials, but is not limited thereto.
  • ITO electrodes transparent electrodes
  • the thickness of the total reflection electrode is greater than or equal to 80 nm, such as 80 nm-120 nm. In one embodiment, the thickness of the ITO electrode is 10 nm-30 nm.
  • the cathode is a transmission electrode
  • the material of the transmission electrode can be selected from one of Ag electrode and Ag:Mg alloy electrode, etc., and can also be selected from one of ITO, IZO, AZO, etc. kind.
  • the thickness of the cathode is about 5 nm-40 nm.
  • the anode is a transmissive electrode, and the material of the transmissive electrode can be selected from one of ITO, IZO, AZO, and the like.
  • the cathode is a total reflection electrode, and the material of the total reflection electrode may be selected from one of metals such as Al, Ag, Mo, and their alloy materials, but is not limited thereto.
  • the material of the hole injection layer may be selected from, but not limited to, poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid) (PEDOT:PSS), CuPc , P3HT, transition metal oxide, transition metal chalcogenide one or two or more.
  • the transition metal oxide includes one or two or more of NiO x , MoO x , WO x , CrO x , and CuO.
  • the metal chalcogenide compound includes one or two or more of MoS x , MoSex , WS x , WSex , and CuS.
  • the hole injection layer has a thickness of about 10 nm to 40 nm.
  • the material of the hole transport layer can be selected from materials with good hole transport properties, such as but not limited to poly(9,9-dioctylfluorene-CO-N-(4) -butylphenyl)diphenylamine)(TFB), polyvinylcarbazole (PVK), poly(N,N'bis(4-butylphenyl)-N,N'-bis(phenyl)benzidine) (Poly-TPD), 4,4',4"-tris(carbazol-9-yl)triphenylamine (TCTA), 4,4'-bis(9-carbazole)biphenyl (CBP), NPB, NiO One or more of , MoO 3 , etc.
  • the thickness of the hole transport layer is about 10 nm-40 nm.
  • the material of the electron transport layer can be conventional electron transport materials in the art, including but not limited to ZnO, MZO (magnesium zinc oxide), AMO (aluminum zinc oxide), MLZO (magnesium lithium zinc oxide) ), TiO 2 , CsF, LiF, CsCO 3 and Alq 3 or a mixture of any combination thereof.
  • the electron transport layer has a thickness of about 20nm-50nm.
  • the hole functional layer includes a hole transport layer, and the electron functional layer is an electron transport layer;
  • the hole transport layer material is TFB, the hole transport layer thickness is 15-25nm, the electron transport layer material is metal oxide Zn x Mg y O, wherein x is 0.90-0.97, y is 0.03-0.1 , the thickness of the electron transport layer is 20-50 nm;
  • the material of the hole transport layer is PVK
  • the thickness of the hole transport layer is 15-25 nm
  • the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.90-0.97 and y is 0.03 ⁇ 0.1, and the thickness of the electron transport layer is 20 to 50 nm;
  • the material of the hole transport layer is TFB
  • the thickness of the hole transport layer is 15-25 nm
  • the material of the electron transport layer is metal oxide ZnO
  • the thickness of the electron transport layer is 20-50 nm.
  • the hole functional layer and the electron functional layer of the quantum dot electroluminescence device are configured to be 0.5V ⁇ V HOD -V EOD ⁇ 10V, and the quantum dot electroluminescence device has a long lifetime.
  • the hole functional layer includes a hole transport layer, and the electron functional layer is an electron transport layer;
  • the material of the hole transport layer is TFB, the thickness of the hole transport layer is 20-23 nm, the material of the electron transport layer is Zn x Mg y O, wherein x is 0.92-0.97, y is 0.03-0.08, and the The thickness of the electron transport layer is 25 to 35 nm.
  • the hole functional layer and the electron functional layer of the quantum dot electroluminescence device are configured to be 3V ⁇ V HOD -V EOD ⁇ 5V, and the quantum dot electroluminescence device has a longer lifetime.
  • An embodiment of the present disclosure provides a method for preparing a quantum dot electroluminescent device, as shown in FIG. 4 , including the steps:
  • the above-mentioned methods for preparing the layers may be chemical methods or physical methods, wherein chemical methods include but are not limited to chemical vapor deposition methods, continuous ion layer adsorption and reaction methods, anodic oxidation methods, electrolytic deposition methods, and co-precipitation methods.
  • One or more of; physical methods include but are not limited to solution methods (such as spin coating, printing, blade coating, dip-pulling, immersion, spraying, roll coating, casting, slot coating method or strip coating method, etc.), evaporation method (such as thermal evaporation method, electron beam evaporation method, magnetron sputtering method or multi-arc ion coating method, etc.), deposition method (such as physical vapor deposition method) , element layer deposition method, pulsed laser deposition method, etc.) one or more.
  • solution methods such as spin coating, printing, blade coating, dip-pulling, immersion, spraying, roll coating, casting, slot coating method or strip coating method, etc.
  • evaporation method such as thermal evaporation method, electron beam evaporation method, magnetron sputtering method or multi-arc ion coating method, etc.
  • deposition method such as physical vapor deposition method) , element layer deposition method, pulsed laser deposition method, etc.
  • the preparation method of the quantum dot electroluminescence device of Embodiment 1 includes the following steps:
  • a layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
  • the hole injection layer material is polythiophene, and the thickness is 20 nm;
  • the hole transport layer material is TFB, and the thickness is 25nm;
  • the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 625nm, and the thickness is 25nm;
  • An electron transport layer is prepared on the quantum dot light-emitting layer, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.95, y is 0.05, and the thickness is 30 nm;
  • the cathode is a Mg:Ag electrode with a thickness of 25nm;
  • the preparation method of the quantum dot electroluminescence device of Embodiment 2 includes the following steps:
  • a layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
  • the hole injection layer material is polythiophene, and the thickness is 20 nm;
  • the hole transport layer material is PVK, and the thickness is 25nm;
  • the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 625nm, and the thickness is 25nm;
  • An electron transport layer is prepared on the quantum dot light-emitting layer, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.90, y is 0.1, and the thickness is 20 nm;
  • the cathode is a Mg:Ag electrode with a thickness of 25nm;
  • the preparation method of the quantum dot electroluminescence device of Embodiment 3 includes the following steps:
  • a layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
  • the material of the hole injection layer is polythiophene, and the thickness is 30 nm;
  • the hole transport layer material is TFB, and the thickness is 15nm;
  • the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 625nm, and the thickness is 10nm;
  • the electron transport layer material is metal oxide ZnO, and the thickness is 50nm;
  • the cathode is a Mg:Ag electrode with a thickness of 25nm;
  • the preparation method of the quantum dot electroluminescent device of Embodiment 4 includes the following steps:
  • a layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
  • the hole injection layer material is polythiophene, and the thickness is 20 nm;
  • the hole transport layer material is TFB, and the thickness is 23 nm;
  • the light-emitting layer material is a red light quantum dot material, and the light emission wavelength of the red light quantum dot material is 620nm, and the thickness is 25nm;
  • An electron transport layer is prepared on the quantum dot light-emitting layer, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.95, y is 0.05, and the thickness is 30 nm;
  • the cathode is a Mg:Ag electrode with a thickness of 25nm;
  • FIG. 8 The EOD device and the HOD device corresponding to the top-emitting quantum dot electroluminescence device in this embodiment are shown in FIG. 8 .
  • curve a is the current-voltage curve of the EOD device
  • curve b is the current-voltage curve of the HOD device.
  • Curve, under the current density of 5mA/cm 2 , V HOD -V EOD 4.3V, the lifetime T95 of the red quantum dot electroluminescent device is >15000h@1000nits.
  • the preparation method of the quantum dot electroluminescence device of Embodiment 5 includes the following steps:
  • a layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
  • the hole injection layer material is polythiophene, and the thickness is 20 nm;
  • the hole transport layer material is TFB, and the thickness is 23 nm;
  • the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 620nm, and the thickness is 15nm;
  • An electron transport layer is prepared on the quantum dot light-emitting layer, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.92, y is 0.08, and the thickness is 25 nm;
  • the cathode is a Mg:Ag electrode with a thickness of 25nm;
  • the preparation method of the quantum dot electroluminescence device of Embodiment 6 includes the following steps:
  • a layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
  • the hole injection layer material is polythiophene, and the thickness is 20 nm;
  • the hole transport layer material is TFB, and the thickness is 20nm;
  • the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 620nm, and the thickness is 12nm;
  • the cathode is a Mg:Ag electrode with a thickness of 25nm;
  • the EOD device and the HOD device corresponding to the top-emitting quantum dot electroluminescent device in this embodiment are shown in FIG. 10 .
  • curve a is the current-voltage curve of the EOD device
  • curve b is the current-voltage curve of the HOD device.
  • Curve, under the current density of 5mA/cm 2 , V HOD -V EOD 5V, the lifetime T95 of the red quantum dot electroluminescent device is >12000h@1000nits.
  • the preparation method of the quantum dot electroluminescence device of the comparative example 1 includes the following steps:
  • a layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
  • the hole injection layer material is polythiophene, and the thickness is 20 nm;
  • the hole transport layer material is Poly-TPD, and the thickness is 20nm;
  • the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 625 nm;
  • the material of the electron transport layer is metal oxide ZnO, and the thickness is 40nm;
  • the cathode material is Mg:Ag alloy, and the thickness is 25nm;
  • Fig. 11 The EOD device and HOD device corresponding to the top-emitting quantum dot electroluminescence device of this comparative example are shown in Fig. 11 .
  • curve a is the current-voltage curve of the EOD device
  • curve b is the current-voltage curve of the HOD device.
  • Curve, under the current density of 10mA/cm 2 , V HOD -V EOD 0.2V, the lifetime T95 of the red quantum dot electroluminescent device is 1000h@1000nits.

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Abstract

Disclosed in the present invention is a quantum dot electroluminescent device. The pure electronic device corresponding to the quantum dot electroluminescent device is denoted as an EOD device, and the pure hole device corresponding to the quantum dot electroluminescent device is denoted as an HOD device; at the same current density, a voltage corresponding to the EOD device is denoted as VEOD, and a voltage corresponding to the HOD device is denoted as VHOD, wherein at the current density of 5 mA/cm 2 or more, a hole function layer and an electron functional layer of the quantum dot electroluminescent device are configured to be 0.5 V≤VHOD-VEOD≤10 V. It is found through researches and tests that when the hole function layer and the electron function layer of the quantum dot electroluminescent device are configured to be 0.5 V≤VHOD-VEOD≤10 V at the same current density, the quantum dot electroluminescent device has a long service life.

Description

一种量子点电致发光器件A quantum dot electroluminescent device
优先权priority
本公开要求于申请日为2021年5月7日提交中国专利局、申请号为“202110498771.8”、申请名称为“一种量子点电致发光器件”的中国专利申请的优先权,其全部内容通过引用结合在本公开中。This disclosure claims the priority of the Chinese patent application with the application date of May 7, 2021, the application number is "202110498771.8", and the application name is "a quantum dot electroluminescent device", the entire content of which is approved by References are incorporated in this disclosure.
技术领域technical field
本公开涉及量子点电致发光器件技术领域,尤其涉及一种量子点电致发光器件。The present disclosure relates to the technical field of quantum dot electroluminescence devices, and in particular, to a quantum dot electroluminescence device.
背景技术Background technique
由于量子点独特的光电性质,例如发光波长随尺寸和成分连续可调、发光光谱窄、荧光效率高、稳定性好等,基于量子点的电致发光二极管(QLED)在显示领域得到广泛的关注和研究。此外,QLED显示还具有可视角大、对比度高、响应速度快、可柔性等诸多LCD所无法实现的优势,因而有望成为下一代的显示技术。Due to the unique optoelectronic properties of quantum dots, such as continuous tunability of emission wavelength with size and composition, narrow emission spectrum, high fluorescence efficiency, and good stability, quantum dot-based electroluminescent diodes (QLEDs) have received extensive attention in the display field. and research. In addition, QLED display also has many advantages that cannot be achieved by LCD, such as large viewing angle, high contrast ratio, fast response speed, and flexibility, so it is expected to become the next-generation display technology.
经过二十多年的发展,量子点材料得到了飞跃发展,红绿蓝QLED器件的外量子效率得到了巨大提升,尤其在以CdSe为主的器件。QLED器件效率的提升突出了其未来的前景。到目前为止,已经有很多研究针对QLED器件进行结构和材料优化,包括核壳量子点材料的选择和核壳界面的合金化以减少表面缺陷和抑制俄歇过程、核壳量子点表面配体的设计和优化电荷传输层的设计等,以提高其外量子效率并延长寿命。After more than 20 years of development, quantum dot materials have been developed by leaps and bounds, and the external quantum efficiency of red, green and blue QLED devices has been greatly improved, especially in CdSe-based devices. The improved efficiency of QLED devices highlights its future prospects. So far, there have been many studies on structure and material optimization for QLED devices, including the selection of core-shell quantum dot materials and the alloying of core-shell interfaces to reduce surface defects and suppress Auger processes, and the selection of surface ligands for core-shell quantum dots. Design and optimize the design of charge transport layers, etc., to improve their external quantum efficiency and prolong their lifetime.
QLED器件的研究都使用的是核壳结构的量子点,其被证明具有优异的性能。壳层能够很好地保护量子点,减少表面缺陷并提高量子产率,有效地抑制非辐射跃迁;壳层也被证明能够减少在量子点薄膜中的Foster能量转移过程,通过增加壳层厚度减少了偶极共振,从而提高了量子点薄膜的量子产率。The research on QLED devices all use quantum dots with core-shell structure, which have been shown to have excellent performance. The shell layer can well protect the quantum dots, reduce surface defects and improve the quantum yield, and effectively suppress nonradiative transitions; the shell layer has also been shown to reduce the Foster energy transfer process in quantum dot films by increasing the thickness of the shell layer. dipole resonance, thereby improving the quantum yield of quantum dot films.
QLED器件工作时需要注入电子和空穴,最简单的QLED器件由阴极、电子传 输层、量子点发光层、空穴传输层和阳极组成。在QLED器件中,量子点薄膜夹在电荷传输层中间,当正向偏压加到QLED器件两端时,电子和空穴分别通过电子传输层和空穴传输层进入量子点发光层,并在量子点发光层进行复合发光。电荷传输层不仅影响了电荷注入效率,同时也对QLED的工艺提出了要求,影响了外部量子效率。电子-空穴的注入不平衡不仅仅会减少注入的电荷转化为激子的能力,也会使得电荷在QLED器件内累积,增加了带电激子的非辐射跃迁,使得效率降低和使用寿命衰减。QLED中有效的激子形成需要具有良好阻挡性能的电荷传输层,以实现QD层内的有效电荷限制以及对电子注入和空穴注入的合理调制以实现电荷平衡。The QLED device needs to inject electrons and holes when it works. The simplest QLED device consists of a cathode, an electron transport layer, a quantum dot light-emitting layer, a hole transport layer and an anode. In the QLED device, the quantum dot film is sandwiched between the charge transport layer. When a forward bias voltage is applied to both ends of the QLED device, electrons and holes enter the quantum dot light-emitting layer through the electron transport layer and the hole transport layer, respectively, and enter the quantum dot light-emitting layer through the electron transport layer and the hole transport layer, respectively. The quantum dot light-emitting layer performs compound light emission. The charge transport layer not only affects the charge injection efficiency, but also imposes requirements on the QLED process and affects the external quantum efficiency. The electron-hole injection imbalance not only reduces the ability of the injected charge to convert into excitons, but also causes the charge to accumulate in the QLED device, increasing the non-radiative transition of charged excitons, resulting in lower efficiency and reduced lifetime. Efficient exciton formation in QLEDs requires charge transport layers with good blocking properties for efficient charge confinement within the QD layer and reasonable modulation of electron and hole injection for charge balance.
目前红绿蓝三基色的量子点器件量子效率均大于20%,量子点器件效率已经达到商业化应用的水平。但是,对应的器件寿命与OLED相比,还有一定的差距,尤其是蓝色量子点器件。At present, the quantum efficiencies of quantum dot devices with three primary colors of red, green and blue are all greater than 20%, and the efficiency of quantum dot devices has reached the level of commercial application. However, there is still a certain gap between the corresponding device lifetime and OLED, especially for blue quantum dot devices.
因此,现有技术还有待于改进和发展。Therefore, the existing technology still needs to be improved and developed.
发明内容SUMMARY OF THE INVENTION
鉴于上述现有技术的不足,本公开提出了一种量子点电致发光器件,旨在解决现有量子点电致发光器件的寿命低的问题。In view of the above-mentioned deficiencies of the prior art, the present disclosure proposes a quantum dot electroluminescence device, aiming at solving the problem of low lifetime of the existing quantum dot electroluminescence device.
本公开的技术方案如下:The technical solutions of the present disclosure are as follows:
一种量子点电致发光器件,其中,所述量子点电致发光器件对应的纯电子器件记为EOD器件,所述量子点电致发光器件对应的纯空穴器件记为HOD器件;A quantum dot electroluminescence device, wherein the pure electronic device corresponding to the quantum dot electroluminescence device is denoted as an EOD device, and the pure hole device corresponding to the quantum dot electroluminescence device is denoted as a HOD device;
在相同电流密度下,所述EOD器件对应的电压记为V EOD,所述HOD器件对应的电压记为V HODUnder the same current density, the voltage corresponding to the EOD device is denoted as V EOD , and the voltage corresponding to the HOD device is denoted as V HOD ;
其中,在5mA/cm 2以上的电流密度下,所述量子点电致发光器件的空穴功能层和电子功能层被配置为0.5V≤V HOD-V EOD≤10V。 Wherein, under the current density of 5 mA/cm 2 or more, the hole functional layer and the electron functional layer of the quantum dot electroluminescent device are configured to be 0.5V≤V HOD -V EOD ≤10V.
可选地,所述电流密度为5-50mA/cm 2Optionally, the current density is 5-50 mA/cm 2 .
可选地,所述电流密度为5-10mA/cm 2Optionally, the current density is 5-10 mA/cm 2 .
可选地,3V≤V HOD-V EOD≤5V。 Optionally, 3V≦V HOD −V EOD ≦5V.
可选地,所述量子点电致发光器件的寿命T95≥10000h@1000nits。Optionally, the lifetime T95 of the quantum dot electroluminescent device is greater than or equal to 10000h@1000nits.
可选地,所述空穴功能层包括空穴传输层,所述电子功能层为电子传输层;Optionally, the hole functional layer includes a hole transport layer, and the electron functional layer is an electron transport layer;
其中,in,
所述空穴传输层材料为TFB,所述空穴传输层厚度为15~25nm,所述电子传输层材料为金属氧化物Zn xMg yO,其中x为0.90~0.97,y为0.03~0.1,所述电子传输层厚度为20~50nm; The hole transport layer material is TFB, the hole transport layer thickness is 15-25nm, the electron transport layer material is metal oxide Zn x Mg y O, wherein x is 0.90-0.97, y is 0.03-0.1 , the thickness of the electron transport layer is 20-50 nm;
或者,所述空穴传输层材料为PVK,所述空穴传输层厚度为15~25nm,所述电子传输层材料为金属氧化物Zn xMg yO,其中x为0.90~0.97,y为0.03~0.1,所述电子传输层材厚度为20~50nm; Alternatively, the material of the hole transport layer is PVK, the thickness of the hole transport layer is 15-25 nm, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.90-0.97 and y is 0.03 ~0.1, and the thickness of the electron transport layer is 20 to 50 nm;
或者,所述空穴传输层材料为TFB,所述空穴传输层厚度为15~25nm,所述电子传输层材料为金属氧化物ZnO,所述电子传输层厚度为20~50nm。Alternatively, the material of the hole transport layer is TFB, the thickness of the hole transport layer is 15-25 nm, the material of the electron transport layer is metal oxide ZnO, and the thickness of the electron transport layer is 20-50 nm.
可选地,所述空穴功能层包括空穴传输层,所述电子功能层为电子传输层;Optionally, the hole functional layer includes a hole transport layer, and the electron functional layer is an electron transport layer;
所述空穴传输层材料为TFB,所述空穴传输层厚度为20~23nm,所述电子传输层材料为Zn xMg yO,其中x为0.92~0.97,y为0.03~0.08,所述电子传输层厚度为25~35nm。 The material of the hole transport layer is TFB, the thickness of the hole transport layer is 20-23 nm, the material of the electron transport layer is Zn x Mg y O, wherein x is 0.92-0.97, y is 0.03-0.08, and the The thickness of the electron transport layer is 25 to 35 nm.
可选地,所述量子点电致发光器件包括依次层叠设置的阳极、空穴注入层、空穴传输层、量子点发光层、电子传输层和阴极。Optionally, the quantum dot electroluminescent device includes an anode, a hole injection layer, a hole transport layer, a quantum dot light-emitting layer, an electron transport layer and a cathode that are stacked in sequence.
可选地,所述量子点电致发光器件还包括光取出层,Optionally, the quantum dot electroluminescent device further comprises a light extraction layer,
当所述阴极为透射电极时,所述光取出层位于所述阴极远离所述阳极一侧的表面;When the cathode is a transmission electrode, the light extraction layer is located on the surface of the cathode on the side away from the anode;
或者,当所述阴极为全反射电极时,所述光取出层位于所述阳极远离所述阴极一侧的表面。Alternatively, when the cathode is a total reflection electrode, the light extraction layer is located on the surface of the anode on the side away from the cathode.
可选地,所述量子点发光层的材料为红光量子点,所述红光量子点的发光波长为610-625nm;Optionally, the material of the quantum dot light-emitting layer is red light quantum dots, and the light emission wavelength of the red light quantum dots is 610-625 nm;
或者,所述量子点发光层的材料为绿光量子点,所述绿光量子点的发光波长为525-550nm。Alternatively, the material of the quantum dot light-emitting layer is green quantum dots, and the emission wavelength of the green quantum dots is 525-550 nm.
有益效果:本公开提供了一种长寿命的量子点器件结构。本公开中,在相同电流密度下,0.5V≤V HOD-V EOD≤10V时,该量子点电致发光器件具有长的寿命。 Beneficial effects: The present disclosure provides a long-life quantum dot device structure. In the present disclosure, under the same current density, when 0.5V≤V HOD -V EOD ≤10V, the quantum dot electroluminescence device has a long lifetime.
附图说明Description of drawings
图1为本公开实施例提供的一种量子点电致发光器件的结构示意图。FIG. 1 is a schematic structural diagram of a quantum dot electroluminescence device according to an embodiment of the present disclosure.
图2为图1所示量子点电致发光器件对应的EOD器件。FIG. 2 is an EOD device corresponding to the quantum dot electroluminescent device shown in FIG. 1 .
图3为图1所示量子点电致发光器件对应的HOD器件。FIG. 3 is a HOD device corresponding to the quantum dot electroluminescent device shown in FIG. 1 .
图4为本公开实施例提供的一种量子点电致发光器件的制备方法的流程示意图。FIG. 4 is a schematic flowchart of a method for preparing a quantum dot electroluminescent device according to an embodiment of the present disclosure.
图5为实施例1中量子点电致发光器件对应的EOD器件和HOD器件的电流-电压曲线。5 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 1.
图6为实施例2中量子点电致发光器件对应的EOD器件和HOD器件的电流-电压曲线。6 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 2.
图7为实施例3中量子点电致发光器件对应的EOD器件和HOD器件的电流-电压曲线。FIG. 7 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 3. FIG.
图8为实施例4中量子点电致发光器件对应的EOD器件和HOD器件的电流-电压曲线。FIG. 8 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 4. FIG.
图9为实施例5中量子点电致发光器件对应的EOD器件和HOD器件的电流-电压曲线。FIG. 9 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 5. FIG.
图10为实施例6中量子点电致发光器件对应的EOD器件和HOD器件的电流-电压曲线。FIG. 10 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Example 6. FIG.
图11为对比例1中量子点电致发光器件对应的EOD器件和HOD器件的电流-电压曲线。11 is the current-voltage curve of the EOD device and the HOD device corresponding to the quantum dot electroluminescent device in Comparative Example 1.
具体实施方式Detailed ways
本公开提供一种量子点电致发光器件,为使本公开的目的、技术方案及效果更加清楚、明确,以下对本公开进一步详细说明。应当理解,此处所描述的具体实施 例仅仅用以解释本公开,并不用于限定本公开。The present disclosure provides a quantum dot electroluminescence device. In order to make the purpose, technical solutions and effects of the present disclosure clearer and clearer, the present disclosure will be described in further detail below. It should be understood that the specific embodiments described herein are only used to explain the present disclosure, but not to limit the present disclosure.
本公开实施例提供一种量子点电致发光器件,其中,所述量子点电致发光器件对应的纯电子器件记为EOD器件,所述量子点电致发光器件对应的纯空穴器件记为HOD器件;Embodiments of the present disclosure provide a quantum dot electroluminescence device, wherein a pure electronic device corresponding to the quantum dot electroluminescence device is denoted as an EOD device, and a pure hole device corresponding to the quantum dot electroluminescence device is denoted as an EOD device HOD device;
在相同电流密度下,所述EOD器件对应的电压记为V EOD,所述HOD器件对应的电压记为V HODUnder the same current density, the voltage corresponding to the EOD device is denoted as V EOD , and the voltage corresponding to the HOD device is denoted as V HOD ;
其中,在5mA/cm 2以上的电流密度下,所述量子点电致发光器件的空穴功能层和电子功能层被配置为0.5V≤V HOD-V EOD≤10V。 Wherein, under the current density of 5 mA/cm 2 or more, the hole functional layer and the electron functional layer of the quantum dot electroluminescent device are configured to be 0.5V≤V HOD -V EOD ≤10V.
发明人经研究和测试发现,在5mA/cm 2以上的电流密度下,所述量子点电致发光器件的空穴功能层和电子功能层被配置为0.5V≤V HOD-V EOD≤10V时,该量子点电致发光器件具有长的寿命。这是因为HOD器件与EOD器件电压差在该范围内,量子点电致发光器件中具有更多电子的注入与传输,量子点电致发光器件在多电子的状态下,更多电子会在量子点发光层积累,在促进空穴向量子点发光层中注入的同时,延长激子的延迟荧光寿命,减少激子的非辐射跃迁,从而使得量子点电致发光器件具有长的寿命。V HOD-V EOD<0.5V时,器件本身载流子处于相对平衡状态,此时量子点会出现同一量子点中同时存在两个电子或者两个空穴的状态,容易引起俄歇复合,导致亮度衰减较快,影响寿命;V HOD-V EOD>10V时,过多电子在量子点中积累,影响量子点尤其是其表面配体的稳定性,从而影响寿命。 The inventors have found through research and testing that at a current density of more than 5 mA/cm 2 , the hole functional layer and electron functional layer of the quantum dot electroluminescent device are configured to be 0.5V≤V HOD -V EOD ≤ 10V , the quantum dot electroluminescent device has a long lifetime. This is because the voltage difference between the HOD device and the EOD device is within this range, and more electrons are injected and transported in the quantum dot electroluminescence device. The accumulation of the point light-emitting layer, while promoting the injection of holes into the quantum point light-emitting layer, prolongs the delayed fluorescence lifetime of the excitons and reduces the non-radiative transition of the excitons, so that the quantum dot electroluminescent device has a long lifetime. When V HOD -V EOD <0.5V, the carrier of the device itself is in a relatively balanced state. At this time, the quantum dot will appear in the state of two electrons or two holes in the same quantum dot, which is easy to cause Auger recombination, resulting in The brightness decays quickly, which affects the lifespan; when V HOD -V EOD >10V, too many electrons accumulate in the quantum dots, which affects the stability of the quantum dots, especially their surface ligands, thereby affecting the lifespan.
需说明的是,上述电流密度大约在5-50mA/cm 2范围内。即在5-50mA/cm 2范围内,0.5V≤V HOD-V EOD≤10V时,该量子点电致发光器件具有长寿命。在一种实施方式中,电流密度大约在5-10mA/cm 2范围内。 It should be noted that the above current density is approximately in the range of 5-50 mA/cm 2 . That is, in the range of 5-50 mA/cm 2 , when 0.5V≦V HOD −V EOD ≦10V, the quantum dot electroluminescence device has a long life. In one embodiment, the current density is approximately in the range of 5-10 mA/cm 2 .
在一种实施方式中,在5mA/cm 2以上的电流密度下,3V≤V HOD-V EOD≤5V,以进一步提高量子点电致发光器件的寿命。 In one embodiment, at a current density of 5 mA/cm 2 or more, 3V≦V HOD −V EOD ≦5V, so as to further improve the lifetime of the quantum dot electroluminescent device.
需说明的是,所述量子点电致发光器件对应的纯电子器件(即EOD器件)指的是:其它与目标量子点电致发光器件基本一致,不同的是,将所述目标量子点电致发光器件中的阳极与量子点发光层之间的空穴功能层替换为空穴阻挡层,如电子传 输层用作所述空穴阻挡层,因为无机电子传输层的价带与阳极的功函数不匹配,使得基本没有空穴注入与传输,因此,此器件中电荷是由阴极端电子的注入与传输引起的,与空穴无关。也就是说,所述EOD器件中只有电子的注入与传输,空穴无法注入与传输。所述EOD器件,用来评价器件中电子的注入与传输能力。It should be noted that the pure electronic device (ie, EOD device) corresponding to the quantum dot electroluminescence device refers to: the others are basically the same as the target quantum dot electroluminescence device, and the difference is that the target quantum dot electroluminescence device is electrically The hole functional layer between the anode and the quantum dot light-emitting layer in the electroluminescent device is replaced with a hole blocking layer, such as an electron transport layer used as the hole blocking layer, because the valence band of the inorganic electron transport layer is related to the work of the anode. The functions do not match, so that there is basically no hole injection and transport. Therefore, the charge in this device is caused by the injection and transport of electrons at the cathode terminal, and has nothing to do with holes. That is to say, in the EOD device, only electrons are injected and transported, and holes cannot be injected and transported. The EOD device is used to evaluate the electron injection and transport capability in the device.
所述量子点电致发光器件对应的纯空穴器件(即HOD器件)指的是:其它与目标量子点电致发光器件基本一致,不同的是,将所述目标量子点电致发光器件中的阴极与量子点发光层之间的电子功能层替换为电子阻挡层,如空穴传输层用作所述电子阻挡层,因为有机空穴传输层的LUMO能级与阴极的功函数不匹配,使得基本没有电子注入与传输,因此,此器件中电荷是由阳极端空穴的注入与传输引起的,与电子无关。也就是说,所述HOD器件中只有空穴的注入与传输,电子无法注入与传输。所述HOD器件用来评价空穴的注入与传输能力。The pure hole device (ie, HOD device) corresponding to the quantum dot electroluminescence device refers to: the others are basically the same as the target quantum dot electroluminescence device, and the difference is that the target quantum dot electroluminescence device is placed in the target quantum dot electroluminescence device. The electron functional layer between the cathode and the quantum dot light-emitting layer is replaced with an electron blocking layer, such as a hole transport layer used as the electron blocking layer, because the LUMO energy level of the organic hole transport layer does not match the work function of the cathode, As a result, there is basically no electron injection and transport. Therefore, the charge in this device is caused by the injection and transport of holes at the anode end, and has nothing to do with electrons. That is to say, in the HOD device, only holes are injected and transported, and electrons cannot be injected and transported. The HOD device was used to evaluate the hole injection and transport capabilities.
本实施例中,量子点电致发光器件有多种形式,且量子点电致发光器件分正型结构和反型结构,当阳极位于基板上时,量子点电致发光器件为正型结构;当阴极位于基板上时,量子点电致发光器件为反型结构,本实施例将主要以如图1所示的结构为例进行详细介绍。In this embodiment, the quantum dot electroluminescence device has various forms, and the quantum dot electroluminescence device is divided into a positive type structure and an inverse type structure. When the anode is located on the substrate, the quantum dot electroluminescence device is a positive type structure; When the cathode is located on the substrate, the quantum dot electroluminescent device has an inversion structure. This embodiment will mainly take the structure shown in FIG. 1 as an example for detailed description.
如图1所示,本公开实施例提供一种量子点电致发光器件,包括依次层叠设置的阳极、空穴注入层、空穴传输层、量子点发光层、电子传输层、阴极和光取出层;As shown in FIG. 1 , an embodiment of the present disclosure provides a quantum dot electroluminescence device, including an anode, a hole injection layer, a hole transport layer, a quantum dot light-emitting layer, an electron transport layer, a cathode, and a light extraction layer that are stacked in sequence. ;
在相同电流密度下,所述EOD器件对应的电压记为V EOD,所述HOD器件对应的电压记为V HODUnder the same current density, the voltage corresponding to the EOD device is denoted as V EOD , and the voltage corresponding to the HOD device is denoted as V HOD ;
其中,在5mA/cm 2以上的电流密度下,所述量子点电致发光器件的空穴功能层(空穴注入层和空穴传输层)和电子功能层(电子传输层)被配置为0.5V≤V HOD-V EOD≤10V。 Wherein, under the current density above 5mA/cm 2 , the hole functional layer (hole injection layer and hole transport layer) and electron functional layer (electron transport layer) of the quantum dot electroluminescent device are configured to be 0.5 V≤V HOD -V EOD≤10V .
其中,图1所示量子点电致发光器件对应的EOD器件可以见图2所示,图1所示量子点电致发光器件对应的HOD器件可以见图3所示。The EOD device corresponding to the quantum dot electroluminescent device shown in FIG. 1 can be shown in FIG. 2 , and the HOD device corresponding to the quantum dot electroluminescent device shown in FIG. 1 can be shown in FIG. 3 .
本实施例中,阳极为全反射电极,阴极为透射电极,量子点电致发光器件发出的光从阴极射出,在所述阴极上设置光取出层,可以增加光取出效率,从而提高了 器件的发光效率。当然所述阳极也可以为透射电极,阴极为全反射电极,量子点电致发光器件发出的光从阳极射出,在所述阳极上设置所述光取出层,可以增加光取出效率,从而提高了器件的发光效率。In this embodiment, the anode is a total reflection electrode, the cathode is a transmission electrode, the light emitted by the quantum dot electroluminescent device is emitted from the cathode, and a light extraction layer is arranged on the cathode, which can increase the light extraction efficiency, thereby improving the device's performance. Luminous efficiency. Of course, the anode can also be a transmissive electrode, and the cathode can be a total reflection electrode. The light emitted by the quantum dot electroluminescent device is emitted from the anode. The light extraction layer is arranged on the anode to increase the light extraction efficiency, thereby improving the efficiency of light extraction. The luminous efficiency of the device.
在一种实施方式中,所述光取出层的材料可以与空穴传输层的材料相同,如CBP等;也可以与电子传输层的材料相同,如LiF等;还可以为邻菲啰啉及其衍生物等。在一种实施方式中,所述光取出层的厚度约为30nm-150nm。In one embodiment, the material of the light extraction layer can be the same as the material of the hole transport layer, such as CBP, etc.; it can also be the same as the material of the electron transport layer, such as LiF, etc.; it can also be o-phenanthroline and its derivatives, etc. In one embodiment, the thickness of the light extraction layer is about 30nm-150nm.
在一种实施方式中,当量子点发光层发红光时,红光量子点的发光波长为610-635nm。In one embodiment, when the quantum dot light-emitting layer emits red light, the emission wavelength of the red quantum dot is 610-635 nm.
在一种实施方式中,当量子点发光层发绿光时,绿光量子点的发光波长为525-555nm。In one embodiment, when the quantum dot light-emitting layer emits green light, the emission wavelength of the green quantum dots is 525-555 nm.
在一种实施方式中,当量子点发光层发蓝光时,蓝光量子点的发光波长为450-480nm。In one embodiment, when the quantum dot light-emitting layer emits blue light, the light-emitting wavelength of the blue-light quantum dots is 450-480 nm.
在一种实施方式中,所述量子点发光层的厚度为5nm-50nm。In one embodiment, the quantum dot light-emitting layer has a thickness of 5 nm-50 nm.
在一种实施方式中,所述红光量子点、绿光量子点和蓝光量子点可以独立地选自二元相、三元相、四元相量子点等中的一种或多种;其中二元相量子点包括CdS、CdSe、CdTe、InP、AgS、PbS、PbSe、HgS等中的一种或多种,三元相量子点包括ZnCdS、CuInS、ZnCdSe、ZnSeS、ZnCdTe、PbSeS等中的一种或多种,四元相量子点包括ZnCdS/ZnSe、CuInS/ZnS、ZnCdSe/ZnS、CuInSeS、ZnCdTe/ZnS、PbSeS/ZnS等中的一种或多种。该量子点可以为含镉或者不含镉。该材料的量子点发光层具有激发光谱宽并且连续分布,发射光谱稳定性高等特点。In one embodiment, the red light quantum dots, green light quantum dots and blue light quantum dots can be independently selected from one or more of binary phase, ternary phase, quaternary phase quantum dots, etc.; wherein binary phase Phase quantum dots include one or more of CdS, CdSe, CdTe, InP, AgS, PbS, PbSe, HgS, etc., and ternary quantum dots include one or more of ZnCdS, CuInS, ZnCdSe, ZnSeS, ZnCdTe, PbSeS, etc. Or more, the quaternary phase quantum dots include one or more of ZnCdS/ZnSe, CuInS/ZnS, ZnCdSe/ZnS, CuInSeS, ZnCdTe/ZnS, PbSeS/ZnS and the like. The quantum dots can be cadmium-containing or cadmium-free. The quantum dot light-emitting layer of the material has the characteristics of wide excitation spectrum and continuous distribution, and high stability of emission spectrum.
在一种实施方式中,所述阳极为全反射电极,所述全反射电极的材料可以选自Al、Ag、Mo等金属及其合金材料中的一种,但不限于此。需说明的是,本公开实施例中,所述全反射电极两侧还可以设置ITO电极(透明电极),如ITO/Ag/ITO,以降低电极的功函数,利于电荷注入。在一种实施方式中,所述全反射电极的厚度大于等于80nm,如80nm-120nm。在一种实施方式中,所述ITO电极的厚度为10nm-30nm。在一种实施方式中,所述阴极为透射电极,所述透射电极的材料可以选自Ag 电极和Ag:Mg合金电极等中的一种,还可以选自ITO、IZO和AZO等中的一种。在一种实施方式中,所述阴极的厚度约为5nm-40nm。In one embodiment, the anode is a total reflection electrode, and the material of the total reflection electrode may be selected from one of metals such as Al, Ag, Mo, and their alloy materials, but is not limited thereto. It should be noted that, in the embodiment of the present disclosure, ITO electrodes (transparent electrodes), such as ITO/Ag/ITO, may be arranged on both sides of the total reflection electrode to reduce the work function of the electrodes and facilitate charge injection. In one embodiment, the thickness of the total reflection electrode is greater than or equal to 80 nm, such as 80 nm-120 nm. In one embodiment, the thickness of the ITO electrode is 10 nm-30 nm. In one embodiment, the cathode is a transmission electrode, and the material of the transmission electrode can be selected from one of Ag electrode and Ag:Mg alloy electrode, etc., and can also be selected from one of ITO, IZO, AZO, etc. kind. In one embodiment, the thickness of the cathode is about 5 nm-40 nm.
在一种实施方式中,所述阳极为透射电极,所述透射电极的材料可以选自ITO、IZO和AZO等中的一种。在一种实施方式中,所述阴极为全反射电极,所述全反射电极的材料可以选自Al、Ag、Mo等金属及其合金材料中的一种,但不限于此。In one embodiment, the anode is a transmissive electrode, and the material of the transmissive electrode can be selected from one of ITO, IZO, AZO, and the like. In one embodiment, the cathode is a total reflection electrode, and the material of the total reflection electrode may be selected from one of metals such as Al, Ag, Mo, and their alloy materials, but is not limited thereto.
在一种实施方式中,所述空穴注入层的材料可以选自但不限于:聚(3,4-亚乙二氧基噻吩)-聚(苯乙烯磺酸)(PEDOT:PSS)、CuPc、P3HT、过渡金属氧化物、过渡金属硫系化合物中的一种或两种或多种。其中,所述过渡金属氧化物包括NiO x、MoO x、WO x、CrO x、CuO中的一种或两种或多种。所述金属硫系化合物包括MoS x、MoSe x、WS x、WSe x、CuS中的一种或两种或多种。在一种实施方式中,所述空穴注入层的厚度约为10nm-40nm。 In one embodiment, the material of the hole injection layer may be selected from, but not limited to, poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid) (PEDOT:PSS), CuPc , P3HT, transition metal oxide, transition metal chalcogenide one or two or more. Wherein, the transition metal oxide includes one or two or more of NiO x , MoO x , WO x , CrO x , and CuO. The metal chalcogenide compound includes one or two or more of MoS x , MoSex , WS x , WSex , and CuS. In one embodiment, the hole injection layer has a thickness of about 10 nm to 40 nm.
在一种实施方式中,所述空穴传输层的材料可以选自具有良好空穴传输性能的材料,例如可以包括但不限于聚(9,9-二辛基芴-CO-N-(4-丁基苯基)二苯胺)(TFB)、聚乙烯咔唑(PVK)、聚(N,N'双(4-丁基苯基)-N,N'-双(苯基)联苯胺)(Poly-TPD)、4,4’,4”-三(咔唑-9-基)三苯胺(TCTA)、4,4'-二(9-咔唑)联苯(CBP)、NPB、NiO、MoO 3等中的一种或多种。在一种实施方式中,所述空穴传输层的厚度约为10nm-40nm。 In one embodiment, the material of the hole transport layer can be selected from materials with good hole transport properties, such as but not limited to poly(9,9-dioctylfluorene-CO-N-(4) -butylphenyl)diphenylamine)(TFB), polyvinylcarbazole (PVK), poly(N,N'bis(4-butylphenyl)-N,N'-bis(phenyl)benzidine) (Poly-TPD), 4,4',4"-tris(carbazol-9-yl)triphenylamine (TCTA), 4,4'-bis(9-carbazole)biphenyl (CBP), NPB, NiO One or more of , MoO 3 , etc. In one embodiment, the thickness of the hole transport layer is about 10 nm-40 nm.
在一种实施方式中,所述电子传输层的材料可采用本领域常规的电子传输材料,包括但不限于ZnO、MZO(镁锌氧)、AMO(铝锌氧)、MLZO(镁锂锌氧)、TiO 2、CsF、LiF、CsCO 3和Alq3中的一种或者为其任意组合的混合物。在一种实施方式中,所述电子传输层的厚度约为20nm-50nm。 In one embodiment, the material of the electron transport layer can be conventional electron transport materials in the art, including but not limited to ZnO, MZO (magnesium zinc oxide), AMO (aluminum zinc oxide), MLZO (magnesium lithium zinc oxide) ), TiO 2 , CsF, LiF, CsCO 3 and Alq 3 or a mixture of any combination thereof. In one embodiment, the electron transport layer has a thickness of about 20nm-50nm.
在一种实施方式中,所述空穴功能层包括空穴传输层,所述电子功能层为电子传输层;In one embodiment, the hole functional layer includes a hole transport layer, and the electron functional layer is an electron transport layer;
其中,in,
所述空穴传输层材料为TFB,所述空穴传输层厚度为15~25nm,所述电子传输层材料为金属氧化物Zn xMg yO,其中x为0.90~0.97,y为0.03~0.1,所述电子传输层厚度为20~50nm; The hole transport layer material is TFB, the hole transport layer thickness is 15-25nm, the electron transport layer material is metal oxide Zn x Mg y O, wherein x is 0.90-0.97, y is 0.03-0.1 , the thickness of the electron transport layer is 20-50 nm;
或者,所述空穴传输层材料为PVK,所述空穴传输层厚度为15~25nm,所述电子传输层材料为金属氧化物Zn xMg yO,其中x为0.90~0.97,y为0.03~0.1,所述电子传输层材厚度为20~50nm; Alternatively, the material of the hole transport layer is PVK, the thickness of the hole transport layer is 15-25 nm, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.90-0.97 and y is 0.03 ~0.1, and the thickness of the electron transport layer is 20 to 50 nm;
或者,所述空穴传输层材料为TFB,所述空穴传输层厚度为15~25nm,所述电子传输层材料为金属氧化物ZnO,所述电子传输层厚度为20~50nm。Alternatively, the material of the hole transport layer is TFB, the thickness of the hole transport layer is 15-25 nm, the material of the electron transport layer is metal oxide ZnO, and the thickness of the electron transport layer is 20-50 nm.
在上述条件下,量子点电致发光器件的空穴功能层和电子功能层被配置为0.5V≤V HOD-V EOD≤10V,该量子点电致发光器件具有长的寿命。 Under the above conditions, the hole functional layer and the electron functional layer of the quantum dot electroluminescence device are configured to be 0.5V≤V HOD -V EOD ≤10V, and the quantum dot electroluminescence device has a long lifetime.
在一种实施方式中,所述空穴功能层包括空穴传输层,所述电子功能层为电子传输层;In one embodiment, the hole functional layer includes a hole transport layer, and the electron functional layer is an electron transport layer;
所述空穴传输层材料为TFB,所述空穴传输层厚度为20~23nm,所述电子传输层材料为Zn xMg yO,其中x为0.92~0.97,y为0.03~0.08,所述电子传输层厚度为25~35nm。 The material of the hole transport layer is TFB, the thickness of the hole transport layer is 20-23 nm, the material of the electron transport layer is Zn x Mg y O, wherein x is 0.92-0.97, y is 0.03-0.08, and the The thickness of the electron transport layer is 25 to 35 nm.
在上述条件下,量子点电致发光器件的空穴功能层和电子功能层被配置为3V≤V HOD-V EOD≤5V,该量子点电致发光器件具有更长的寿命。 Under the above conditions, the hole functional layer and the electron functional layer of the quantum dot electroluminescence device are configured to be 3V≤V HOD -V EOD ≤5V, and the quantum dot electroluminescence device has a longer lifetime.
以图1所示结构为例,对该量子点电致发光器件的制备方法做介绍。本公开实施例提供一种量子点电致发光器件的制备方法,如图4所示,包括步骤:Taking the structure shown in FIG. 1 as an example, the preparation method of the quantum dot electroluminescent device is introduced. An embodiment of the present disclosure provides a method for preparing a quantum dot electroluminescent device, as shown in FIG. 4 , including the steps:
S10、在阳极上形成空穴注入层;S10, forming a hole injection layer on the anode;
S11、在所述空穴注入层上形成空穴传输层;S11, forming a hole transport layer on the hole injection layer;
S12、在所述空穴传输层上形成量子点发光层;S12, forming a quantum dot light-emitting layer on the hole transport layer;
S13、在所述量子点发光层上形成电子传输层;S13, forming an electron transport layer on the quantum dot light-emitting layer;
S14、在所述电子传输层上形成阴极;S14, forming a cathode on the electron transport layer;
S15、在所述阴极上形成光取出层,得到量子点电致发光器件。S15, forming a light extraction layer on the cathode to obtain a quantum dot electroluminescence device.
本公开实施例中,上述各层制备方法可以是化学法或物理法,其中化学法包括但不限于化学气相沉积法、连续离子层吸附与反应法、阳极氧化法、电解沉积法、共沉淀法中的一种或多种;物理法包括但不限于溶液法(如旋涂法、印刷法、刮涂法、浸渍提拉法、浸泡法、喷涂法、滚涂法、浇铸法、狭缝式涂布法或条状涂布法 等)、蒸镀法(如热蒸镀法、电子束蒸镀法、磁控溅射法或多弧离子镀膜法等)、沉积法(如物理气相沉积法、元素层沉积法、脉冲激光沉积法等)中的一种或多种。In the embodiments of the present disclosure, the above-mentioned methods for preparing the layers may be chemical methods or physical methods, wherein chemical methods include but are not limited to chemical vapor deposition methods, continuous ion layer adsorption and reaction methods, anodic oxidation methods, electrolytic deposition methods, and co-precipitation methods. One or more of; physical methods include but are not limited to solution methods (such as spin coating, printing, blade coating, dip-pulling, immersion, spraying, roll coating, casting, slot coating method or strip coating method, etc.), evaporation method (such as thermal evaporation method, electron beam evaporation method, magnetron sputtering method or multi-arc ion coating method, etc.), deposition method (such as physical vapor deposition method) , element layer deposition method, pulsed laser deposition method, etc.) one or more.
下面通过具体的实施例对本公开作进一步地说明。The present disclosure will be further described below through specific embodiments.
在本公开的一实施例中,实施例1的量子点电致发光器件的制备方法,包括以下步骤:In an embodiment of the present disclosure, the preparation method of the quantum dot electroluminescence device of Embodiment 1 includes the following steps:
1)在基板上沉积一层ITO/金属发射电极/ITO做第一电极,其中第一层ITO的厚度为20nm,金属发射电极的材料为Ag,厚度为100nm,第二层ITO的厚度为25nm;1) A layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
2)在第一电极上制备空穴注入层,空穴注入层材料为聚噻吩,厚度为20nm;2) preparing a hole injection layer on the first electrode, the hole injection layer material is polythiophene, and the thickness is 20 nm;
3)在空穴注入层上制备空穴传输层,空穴传输层材料为TFB,厚度为25nm;3) prepare a hole transport layer on the hole injection layer, the hole transport layer material is TFB, and the thickness is 25nm;
4)在空穴传输层上制备量子点发光层,发光层材料为红光量子点材料,红光量子点材料的发光波长为625nm,厚度为25nm;4) preparing a quantum dot light-emitting layer on the hole transport layer, the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 625nm, and the thickness is 25nm;
5)在量子点发光层上制备电子传输层,电子传输层材料为金属氧化物Zn xMg yO,其中x为0.95,y为0.05,厚度为30nm; 5) An electron transport layer is prepared on the quantum dot light-emitting layer, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.95, y is 0.05, and the thickness is 30 nm;
6)在电子传输层上蒸镀阴极,阴极为Mg:Ag电极,厚度为25nm;6) Evaporating a cathode on the electron transport layer, the cathode is a Mg:Ag electrode with a thickness of 25nm;
7)在阴极上蒸镀NPB有机光取出材料,厚度为60nm。7) Evaporating NPB organic light-extracting material on the cathode with a thickness of 60 nm.
本实施例的顶发射的量子点电致发光器件对应的EOD器件和HOD器件,如图5所示,图5中曲线a为EOD器件的电流-电压曲线,曲线b为HOD器件的电流-电压曲线,在10mA/cm 2的电流密度下,V HOD-V EOD=2.5V,红色量子点电致发光器件的寿命T95为>10000h@1000nits。 The EOD device and the HOD device corresponding to the top-emitting quantum dot electroluminescence device in this embodiment are shown in FIG. 5 , in FIG. 5 , curve a is the current-voltage curve of the EOD device, and curve b is the current-voltage curve of the HOD device Curve, under the current density of 10mA/cm 2 , V HOD -V EOD =2.5V, the lifetime T95 of the red quantum dot electroluminescent device is >10000h@1000nits.
在本公开的另一实施例中,实施例2的量子点电致发光器件的制备方法,包括以下步骤:In another embodiment of the present disclosure, the preparation method of the quantum dot electroluminescence device of Embodiment 2 includes the following steps:
1)在基板上沉积一层ITO/金属发射电极/ITO做第一电极,其中第一层ITO的厚度为20nm,金属发射电极的材料为Ag,厚度为100nm,第二层ITO的厚度为25nm;1) A layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
2)在第一电极上制备空穴注入层,空穴注入层材料为聚噻吩,厚度为20nm;2) preparing a hole injection layer on the first electrode, the hole injection layer material is polythiophene, and the thickness is 20 nm;
3)在空穴注入层上制备空穴传输层,空穴传输层材料为PVK,厚度为25nm;3) preparing a hole transport layer on the hole injection layer, the hole transport layer material is PVK, and the thickness is 25nm;
4)在空穴传输层上制备量子点发光层,发光层材料为红光量子点材料,红光量 子点材料的发光波长为625nm,厚度为25nm;4) prepare a quantum dot light-emitting layer on the hole transport layer, the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 625nm, and the thickness is 25nm;
5)在量子点发光层上制备电子传输层,电子传输层材料为金属氧化物Zn xMg yO,其中x为0.90,y为0.1,厚度为20nm; 5) An electron transport layer is prepared on the quantum dot light-emitting layer, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.90, y is 0.1, and the thickness is 20 nm;
6)在电子传输层上蒸镀阴极,阴极为Mg:Ag电极,厚度为25nm;6) Evaporating a cathode on the electron transport layer, the cathode is a Mg:Ag electrode with a thickness of 25nm;
7)在阴极上蒸镀NPB有机光取出材料,厚度为60nm。7) Evaporating NPB organic light-extracting material on the cathode with a thickness of 60 nm.
本实施例的顶发射的量子点电致发光器件对应的EOD器件和HOD器件,如图6所示,图6中曲线a为EOD器件的电流-电压曲线,曲线b为HOD器件的电流-电压曲线,在5mA/cm 2的电流密度下,V HOD-V EOD=0.5V,红色量子点电致发光器件的寿命T95约为7000h@1000nits。 The EOD device and the HOD device corresponding to the top-emitting quantum dot electroluminescent device in this embodiment are shown in FIG. 6 , in FIG. 6 , curve a is the current-voltage curve of the EOD device, and curve b is the current-voltage curve of the HOD device Curve, under the current density of 5mA/cm 2 , V HOD -V EOD =0.5V, the lifetime T95 of the red quantum dot electroluminescent device is about 7000h@1000nits.
在本公开的又一实施例中,实施例3的量子点电致发光器件的制备方法,包括以下步骤:In yet another embodiment of the present disclosure, the preparation method of the quantum dot electroluminescence device of Embodiment 3 includes the following steps:
1)在基板上沉积一层ITO/金属发射电极/ITO做第一电极,其中第一层ITO的厚度为20nm,金属发射电极的材料为Ag,厚度为100nm,第二层ITO的厚度为25nm;1) A layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
2)在第一电极上制备空穴注入层,空穴注入层材料为聚噻吩,厚度为30nm;2) preparing a hole injection layer on the first electrode, the material of the hole injection layer is polythiophene, and the thickness is 30 nm;
3)在空穴注入层上制备空穴传输层,空穴传输层材料为TFB,厚度为15nm;3) preparing a hole transport layer on the hole injection layer, the hole transport layer material is TFB, and the thickness is 15nm;
4)在空穴传输层上制备量子点发光层,发光层材料为红光量子点材料,红光量子点材料的发光波长为625nm,厚度为10nm;4) preparing a quantum dot light-emitting layer on the hole transport layer, the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 625nm, and the thickness is 10nm;
5)在量子点发光层上制备电子传输层,电子传输层材料为金属氧化物ZnO,厚度为50nm;5) preparing an electron transport layer on the quantum dot light-emitting layer, the electron transport layer material is metal oxide ZnO, and the thickness is 50nm;
6)在电子传输层上蒸镀阴极,阴极为Mg:Ag电极,厚度为25nm;6) Evaporating a cathode on the electron transport layer, the cathode is a Mg:Ag electrode with a thickness of 25nm;
7)在阴极上蒸镀NPB有机光取出材料,厚度为60nm。7) Evaporating NPB organic light-extracting material on the cathode with a thickness of 60 nm.
本实施例的顶发射的量子点电致发光器件对应的EOD器件和HOD器件,如图7所示,图7中曲线a为EOD器件的电流-电压曲线,曲线b为HOD器件的电流-电压曲线,在20mA/cm 2的电流密度下,V HOD-V EOD=10V,红色量子点电致发光器件的寿命T95为>10000h@1000nits。 The EOD device and the HOD device corresponding to the top-emitting quantum dot electroluminescence device of this embodiment are shown in FIG. 7 , in FIG. 7 , curve a is the current-voltage curve of the EOD device, and curve b is the current-voltage curve of the HOD device Curve, under the current density of 20mA/cm 2 , V HOD -V EOD =10V, the lifetime T95 of the red quantum dot electroluminescent device is >10000h@1000nits.
在本公开的再一实施例中,实施例4的量子点电致发光器件的制备方法,包括 以下步骤:In yet another embodiment of the present disclosure, the preparation method of the quantum dot electroluminescent device of Embodiment 4 includes the following steps:
1)在基板上沉积一层ITO/金属发射电极/ITO做第一电极,其中第一层ITO的厚度为20nm,金属发射电极的材料为Ag,厚度为100nm,第二层ITO的厚度为25nm;1) A layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
2)在第一电极上制备空穴注入层,空穴注入层材料为聚噻吩,厚度为20nm;2) preparing a hole injection layer on the first electrode, the hole injection layer material is polythiophene, and the thickness is 20 nm;
3)在空穴注入层上制备空穴传输层,空穴传输层材料为TFB,厚度为23nm;3) Prepare a hole transport layer on the hole injection layer, the hole transport layer material is TFB, and the thickness is 23 nm;
4)在空穴传输层上制备量子点发光层,发光层材料为红光量子点材料,红光量子点材料的发光波长为620nm,厚度为25nm;4) preparing a quantum dot light-emitting layer on the hole transport layer, the light-emitting layer material is a red light quantum dot material, and the light emission wavelength of the red light quantum dot material is 620nm, and the thickness is 25nm;
5)在量子点发光层上制备电子传输层,电子传输层材料为金属氧化物Zn xMg yO,其中x为0.95,y为0.05,厚度为30nm; 5) An electron transport layer is prepared on the quantum dot light-emitting layer, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.95, y is 0.05, and the thickness is 30 nm;
6)在电子传输层上蒸镀阴极,阴极为Mg:Ag电极,厚度为25nm;6) Evaporating a cathode on the electron transport layer, the cathode is a Mg:Ag electrode with a thickness of 25nm;
7)在阴极上蒸镀NPB有机光取出材料,厚度为60nm。7) Evaporating NPB organic light-extracting material on the cathode with a thickness of 60 nm.
本实施例的顶发射的量子点电致发光器件对应的EOD器件和HOD器件,如图8所示,图8中曲线a为EOD器件的电流-电压曲线,曲线b为HOD器件的电流-电压曲线,在5mA/cm 2的电流密度下,V HOD-V EOD=4.3V,红色量子点电致发光器件的寿命T95为>15000h@1000nits。 The EOD device and the HOD device corresponding to the top-emitting quantum dot electroluminescence device in this embodiment are shown in FIG. 8 . In FIG. 8 , curve a is the current-voltage curve of the EOD device, and curve b is the current-voltage curve of the HOD device. Curve, under the current density of 5mA/cm 2 , V HOD -V EOD =4.3V, the lifetime T95 of the red quantum dot electroluminescent device is >15000h@1000nits.
在本公开的又一实施例中,实施例5的量子点电致发光器件的制备方法,包括以下步骤:In yet another embodiment of the present disclosure, the preparation method of the quantum dot electroluminescence device of Embodiment 5 includes the following steps:
1)在基板上沉积一层ITO/金属发射电极/ITO做第一电极,其中第一层ITO的厚度为20nm,金属发射电极的材料为Ag,厚度为100nm,第二层ITO的厚度为25nm;1) A layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
2)在第一电极上制备空穴注入层,空穴注入层材料为聚噻吩,厚度为20nm;2) preparing a hole injection layer on the first electrode, the hole injection layer material is polythiophene, and the thickness is 20 nm;
3)在空穴注入层上制备空穴传输层,空穴传输层材料为TFB,厚度为23nm;3) Prepare a hole transport layer on the hole injection layer, the hole transport layer material is TFB, and the thickness is 23 nm;
4)在空穴传输层上制备量子点发光层,发光层材料为红光量子点材料,红光量子点材料的发光波长为620nm,厚度为15nm;4) preparing a quantum dot light-emitting layer on the hole transport layer, the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 620nm, and the thickness is 15nm;
5)在量子点发光层上制备电子传输层,电子传输层材料为金属氧化物Zn xMg yO,其中x为0.92,y为0.08,厚度为25nm; 5) An electron transport layer is prepared on the quantum dot light-emitting layer, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.92, y is 0.08, and the thickness is 25 nm;
6)在电子传输层上蒸镀阴极,阴极为Mg:Ag电极,厚度为25nm;6) Evaporating a cathode on the electron transport layer, the cathode is a Mg:Ag electrode with a thickness of 25nm;
7)在阴极上蒸镀NPB有机光取出材料,厚度为60nm。7) Evaporating NPB organic light-extracting material on the cathode with a thickness of 60 nm.
本实施例的顶发射的量子点电致发光器件对应的EOD器件和HOD器件,如图9所示,图9中曲线a为EOD器件的电流-电压曲线,曲线b为HOD器件的电流-电压曲线,在5mA/cm 2的电流密度下,V HOD-V EOD=3V,红色量子点电致发光器件的寿命T95为>12000h@1000nits。 The EOD device and the HOD device corresponding to the top-emitting quantum dot electroluminescent device of this embodiment are shown in FIG. 9 , in FIG. 9, curve a is the current-voltage curve of the EOD device, and curve b is the current-voltage curve of the HOD device Curve, under the current density of 5mA/cm 2 , V HOD -V EOD =3V, the lifetime T95 of the red quantum dot electroluminescent device is >12000h@1000nits.
在本公开的再一实施例中,实施例6的量子点电致发光器件的制备方法,包括以下步骤:In yet another embodiment of the present disclosure, the preparation method of the quantum dot electroluminescence device of Embodiment 6 includes the following steps:
1)在基板上沉积一层ITO/金属发射电极/ITO做第一电极,其中第一层ITO的厚度为20nm,金属发射电极的材料为Ag,厚度为100nm,第二层ITO的厚度为25nm;1) A layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
2)在第一电极上制备空穴注入层,空穴注入层材料为聚噻吩,厚度为20nm;2) preparing a hole injection layer on the first electrode, the hole injection layer material is polythiophene, and the thickness is 20 nm;
3)在空穴注入层上制备空穴传输层,空穴传输层材料为TFB,厚度为20nm;3) preparing a hole transport layer on the hole injection layer, the hole transport layer material is TFB, and the thickness is 20nm;
4)在空穴传输层上制备量子点发光层,发光层材料为红光量子点材料,红光量子点材料的发光波长为620nm,厚度为12nm;4) preparing a quantum dot light-emitting layer on the hole transport layer, the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 620nm, and the thickness is 12nm;
5)在量子点发光层上制备电子传输层,电子传输层材料为金属氧化物Zn xMg yO,其中x为0.97,y为0.03,厚度为35nm; 5) preparing an electron transport layer on the quantum dot light-emitting layer, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.97, y is 0.03, and the thickness is 35 nm;
6)在电子传输层上蒸镀阴极,阴极为Mg:Ag电极,厚度为25nm;6) Evaporating a cathode on the electron transport layer, the cathode is a Mg:Ag electrode with a thickness of 25nm;
7)在阴极上蒸镀NPB有机光取出材料,厚度为60nm。7) Evaporating NPB organic light-extracting material on the cathode with a thickness of 60 nm.
本实施例的顶发射的量子点电致发光器件对应的EOD器件和HOD器件,如图10所示,图10中曲线a为EOD器件的电流-电压曲线,曲线b为HOD器件的电流-电压曲线,在5mA/cm 2的电流密度下,V HOD-V EOD=5V,红色量子点电致发光器件的寿命T95为>12000h@1000nits。 The EOD device and the HOD device corresponding to the top-emitting quantum dot electroluminescent device in this embodiment are shown in FIG. 10 . In FIG. 10 , curve a is the current-voltage curve of the EOD device, and curve b is the current-voltage curve of the HOD device. Curve, under the current density of 5mA/cm 2 , V HOD -V EOD =5V, the lifetime T95 of the red quantum dot electroluminescent device is >12000h@1000nits.
在本公开的一对比例中,对比例1的量子点电致发光器件的制备方法,包括以下步骤:In a pair of examples of the present disclosure, the preparation method of the quantum dot electroluminescence device of the comparative example 1 includes the following steps:
1)在基板上沉积一层ITO/金属发射电极/ITO做第一电极,其中第一层ITO的厚度为20nm,金属发射电极的材料为Ag,厚度为100nm,第二层ITO的厚度为25nm;1) A layer of ITO/metal emitter electrode/ITO is deposited on the substrate as the first electrode, wherein the thickness of the first layer of ITO is 20nm, the material of the metal emitter electrode is Ag, the thickness is 100nm, and the thickness of the second layer of ITO is 25nm ;
2)在第一电极上制备空穴注入层,空穴注入层材料为聚噻吩,厚度为20nm;2) preparing a hole injection layer on the first electrode, the hole injection layer material is polythiophene, and the thickness is 20 nm;
3)在空穴注入层上制备空穴传输层,空穴传输层材料为Poly-TPD,厚度为20nm;3) Prepare a hole transport layer on the hole injection layer, the hole transport layer material is Poly-TPD, and the thickness is 20nm;
4)在空穴传输层上制备量子点发光层,发光层材料为红光量子点材料,红光量子点材料的发光波长为625nm;4) preparing a quantum dot light-emitting layer on the hole transport layer, the light-emitting layer material is a red light quantum dot material, and the light-emitting wavelength of the red light quantum dot material is 625 nm;
5)在量子点发光层上制备电子传输层,电子传输层材料为金属氧化物ZnO,厚度为40nm;5) preparing an electron transport layer on the quantum dot light-emitting layer, the material of the electron transport layer is metal oxide ZnO, and the thickness is 40nm;
6)在电子传输层上蒸镀阴极材料,阴极材料为Mg:Ag合金,厚度为25nm;6) Evaporating cathode material on the electron transport layer, the cathode material is Mg:Ag alloy, and the thickness is 25nm;
7)在阴极上蒸镀有机光取出材料,厚度为60nm。7) Evaporate an organic light extraction material on the cathode with a thickness of 60 nm.
本对比例的顶发射的量子点电致发光器件对应的EOD器件和HOD器件,如图11所示,图11中曲线a为EOD器件的电流-电压曲线,曲线b为HOD器件的电流-电压曲线,在10mA/cm 2的电流密度下,V HOD-V EOD=0.2V,红色量子点电致发光器件的寿命T95为1000h@1000nits。 The EOD device and HOD device corresponding to the top-emitting quantum dot electroluminescence device of this comparative example are shown in Fig. 11 . In Fig. 11, curve a is the current-voltage curve of the EOD device, and curve b is the current-voltage curve of the HOD device. Curve, under the current density of 10mA/cm 2 , V HOD -V EOD =0.2V, the lifetime T95 of the red quantum dot electroluminescent device is 1000h@1000nits.
应当理解的是,本公开的应用不限于上述的举例,对本领域普通技术人员来说,可以根据上述说明加以改进或变换,所有这些改进和变换都应属于本公开所附权利要求的保护范围。It should be understood that the application of the present disclosure is not limited to the above examples, and those of ordinary skill in the art can make improvements or transformations according to the above descriptions, and all such improvements and transformations should fall within the protection scope of the appended claims of the present disclosure.

Claims (16)

  1. 一种量子点电致发光器件,其中,所述量子点电致发光器件对应的纯电子器件记为EOD器件,所述量子点电致发光器件对应的纯空穴器件记为HOD器件;A quantum dot electroluminescence device, wherein the pure electronic device corresponding to the quantum dot electroluminescence device is denoted as an EOD device, and the pure hole device corresponding to the quantum dot electroluminescence device is denoted as a HOD device;
    在相同电流密度下,所述EOD器件对应的电压记为V EOD,所述HOD器件对应的电压记为V HODUnder the same current density, the voltage corresponding to the EOD device is denoted as V EOD , and the voltage corresponding to the HOD device is denoted as V HOD ;
    其中,在5mA/cm 2以上的电流密度下,所述量子点电致发光器件的空穴功能层和电子功能层被配置为0.5V≤V HOD-V EOD≤10V。 Wherein, under the current density of 5 mA/cm 2 or more, the hole functional layer and the electron functional layer of the quantum dot electroluminescent device are configured to be 0.5V≤V HOD -V EOD ≤10V.
  2. 根据权利要求1所述的量子点电致发光器件,其中,所述电流密度为5-50mA/cm 2The quantum dot electroluminescent device of claim 1, wherein the current density is 5-50 mA/cm 2 .
  3. 根据权利要求2所述的量子点电致发光器件,其中,所述电流密度为5-10mA/cm 2The quantum dot electroluminescent device of claim 2, wherein the current density is 5-10 mA/cm 2 .
  4. 根据权利要求1所述的量子点电致发光器件,其中,3V≤V HOD-V EOD≤5V。 The quantum dot electroluminescent device according to claim 1, wherein 3V≤V HOD -V EOD≤5V .
  5. 根据权利要求1所述的量子点电致发光器件,其中,所述量子点电致发光器件的寿命T95≥10000h@1000nits。The quantum dot electroluminescence device according to claim 1, wherein the quantum dot electroluminescence device has a lifetime T95≥10000h@1000nits.
  6. 根据权利要求1所述的量子点电致发光器件,其中,所述空穴功能层包括空穴传输层,所述电子功能层为电子传输层;The quantum dot electroluminescence device according to claim 1, wherein the hole functional layer comprises a hole transport layer, and the electron functional layer is an electron transport layer;
    其中,in,
    所述空穴传输层材料为TFB,所述空穴传输层厚度为15~25nm,所述电子传输层材料为金属氧化物Zn xMg yO,其中x为0.90~0.97,y为0.03~0.1,所述电子传输层厚度为20~50nm; The hole transport layer material is TFB, the hole transport layer thickness is 15-25nm, the electron transport layer material is metal oxide Zn x Mg y O, wherein x is 0.90-0.97, y is 0.03-0.1 , the thickness of the electron transport layer is 20-50 nm;
    或者,所述空穴传输层材料为PVK,所述空穴传输层厚度为15~25nm,所述电子传输层材料为金属氧化物Zn xMg yO,其中x为0.90~0.97,y为0.03~0.1,所述电子传输层材厚度为20~50nm; Alternatively, the material of the hole transport layer is PVK, the thickness of the hole transport layer is 15-25 nm, and the material of the electron transport layer is metal oxide Zn x Mg y O, wherein x is 0.90-0.97 and y is 0.03 ~0.1, and the thickness of the electron transport layer is 20 to 50 nm;
    或者,所述空穴传输层材料为TFB,所述空穴传输层厚度为15~25nm,所述电子传输层材料为金属氧化物ZnO,所述电子传输层厚度为20~50nm。Alternatively, the material of the hole transport layer is TFB, the thickness of the hole transport layer is 15-25 nm, the material of the electron transport layer is metal oxide ZnO, and the thickness of the electron transport layer is 20-50 nm.
  7. 根据权利要求4所述的量子点电致发光器件,其中,所述空穴功能层包括空穴传输层,所述电子功能层为电子传输层;The quantum dot electroluminescence device according to claim 4, wherein the hole functional layer comprises a hole transport layer, and the electron functional layer is an electron transport layer;
    所述空穴传输层材料为TFB,所述空穴传输层厚度为20~23nm,所述电子传输层材料为Zn xMg yO,其中x为0.92~0.97,y为0.03~0.08,所述电子传输层厚度为25~35nm。 The material of the hole transport layer is TFB, the thickness of the hole transport layer is 20-23 nm, the material of the electron transport layer is Zn x Mg y O, wherein x is 0.92-0.97, y is 0.03-0.08, and the The thickness of the electron transport layer is 25 to 35 nm.
  8. 根据权利要求1所述的量子点电致发光器件,其中,所述量子点电致发光器件包括依次层叠设置的阳极、空穴注入层、空穴传输层、量子点发光层、电子传输层和阴极。The quantum dot electroluminescence device according to claim 1, wherein the quantum dot electroluminescence device comprises an anode, a hole injection layer, a hole transport layer, a quantum dot light emitting layer, an electron transport layer and cathode.
  9. 根据权利要求8所述的量子点电致发光器件,其中,所述量子点电致发光器件还包括光取出层,The quantum dot electroluminescent device according to claim 8, wherein the quantum dot electroluminescent device further comprises a light extraction layer,
    当所述阴极为透射电极时,所述光取出层位于所述阴极远离所述阳极一侧的表面;When the cathode is a transmission electrode, the light extraction layer is located on the surface of the cathode on the side away from the anode;
    或者,当所述阴极为全反射电极时,所述光取出层位于所述阳极远离所述阴极一侧的表面。Alternatively, when the cathode is a total reflection electrode, the light extraction layer is located on the surface of the anode on the side away from the cathode.
  10. 根据权利要求9所述的量子点电致发光器件,其中,所述光取出层的厚度为30nm-150nm。The quantum dot electroluminescent device according to claim 9, wherein the thickness of the light extraction layer is 30nm-150nm.
  11. 根据权利要求8所述的量子点电致发光器件,其中,所述量子点发光层的材料为红光量子点,所述红光量子点的发光波长为610-625nm;The quantum dot electroluminescence device according to claim 8, wherein the material of the quantum dot light-emitting layer is red light quantum dots, and the light emission wavelength of the red light quantum dots is 610-625 nm;
    或者,所述量子点发光层的材料为绿光量子点,所述绿光量子点的发光波长为525-550nm;Alternatively, the material of the quantum dot light-emitting layer is green light quantum dots, and the light emission wavelength of the green light quantum dots is 525-550 nm;
    或者,所述量子点发光层的材料为蓝光量子点,所述蓝光量子点的发光波长为450-480nm。Alternatively, the material of the quantum dot light-emitting layer is blue-light quantum dots, and the light-emitting wavelength of the blue-light quantum dots is 450-480 nm.
  12. 根据权利要求11所述的量子点电致发光器件,其中,所述红光量子点、绿光量子点和蓝光量子点独立地选自二元相、三元相、四元相量子点等中的一种或多种。The quantum dot electroluminescence device according to claim 11, wherein the red light quantum dots, green light quantum dots and blue light quantum dots are independently selected from one of binary phase, ternary phase, quaternary phase quantum dots, etc. one or more.
  13. 根据权利要求12所述的量子点电致发光器件,其中,所述二元相量子点包括CdS、CdSe、CdTe、InP、AgS、PbS、PbSe、HgS等中的一种或多种。The quantum dot electroluminescence device according to claim 12, wherein the binary phase quantum dots comprise one or more of CdS, CdSe, CdTe, InP, AgS, PbS, PbSe, HgS and the like.
  14. 根据权利要求12所述的量子点电致发光器件,其中,所述三元相量子点包 括ZnCdS、CuInS、ZnCdSe、ZnSeS、ZnCdTe、PbSeS等中的一种或多种。The quantum dot electroluminescent device according to claim 12, wherein the ternary phase quantum dots comprise one or more of ZnCdS, CuInS, ZnCdSe, ZnSeS, ZnCdTe, PbSeS and the like.
  15. 根据权利要求12所述的量子点电致发光器件,其中,四元相量子点包括ZnCdS/ZnSe、CuInS/ZnS、ZnCdSe/ZnS、CuInSeS、ZnCdTe/ZnS、PbSeS/ZnS等中的一种或多种。The quantum dot electroluminescence device according to claim 12, wherein the quaternary phase quantum dots comprise one or more of ZnCdS/ZnSe, CuInS/ZnS, ZnCdSe/ZnS, CuInSeS, ZnCdTe/ZnS, PbSeS/ZnS, etc. kind.
  16. 根据权利要求11所述的量子点电致发光器件,其中,所述量子点发光层的厚度为5nm-50nm。The quantum dot electroluminescent device according to claim 11, wherein the quantum dot light-emitting layer has a thickness of 5 nm-50 nm.
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