WO2022224377A1 - Component supply device and component mounting device - Google Patents

Component supply device and component mounting device Download PDF

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Publication number
WO2022224377A1
WO2022224377A1 PCT/JP2021/016181 JP2021016181W WO2022224377A1 WO 2022224377 A1 WO2022224377 A1 WO 2022224377A1 JP 2021016181 W JP2021016181 W JP 2021016181W WO 2022224377 A1 WO2022224377 A1 WO 2022224377A1
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WO
WIPO (PCT)
Prior art keywords
tape
component supply
component
unit
winding
Prior art date
Application number
PCT/JP2021/016181
Other languages
French (fr)
Japanese (ja)
Inventor
涼司 新井
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2021/016181 priority Critical patent/WO2022224377A1/en
Priority to JP2023515950A priority patent/JPWO2022224377A1/ja
Priority to CN202180096414.7A priority patent/CN117063624A/en
Publication of WO2022224377A1 publication Critical patent/WO2022224377A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components

Definitions

  • the present invention relates to a component supply device and a component mounting device, and more particularly to a component supply device and a component mounting device having a tape feeding section that feeds a component supply tape to a suction position where a nozzle picks up a component.
  • the above-mentioned JP-A-2012-18999 discloses an electronic component supply device (component supply device) provided with a transport mechanism (tape feeder) that feeds a component supply tape to a component supply position (sucking position) where an electronic component is sucked by a nozzle.
  • the transport mechanism is configured to transport the component supply tape to the component pickup position by accelerating and decelerating.
  • the component supply tape includes a carrier tape and a cover tape.
  • the carrier tape has a plurality of recesses for storing electronic components.
  • a cover tape covers the upward opening of each of the plurality of recesses.
  • the electronic component supply device of JP-A-2012-18999 further includes a peeling mechanism and a control unit.
  • the peeling mechanism is configured to peel the cover tape from the carrier tape at the peeling position.
  • the peeling position is arranged upstream of the component supply position in the transport direction.
  • the control unit is configured to perform control such that after the cover tape is peeled off at the peeling position by the peeling mechanism, the carrier tape is transported to the component supply position by the conveying mechanism.
  • the present invention has been made to solve the above-described problems, and one object of the present invention is to reduce the time required to mount a component on a board while suppressing the component from popping out (improve productivity). It is an object of the present invention to provide a component feeding device and a component mounting device capable of realizing (improvement of the above).
  • a component supply apparatus is a component supply tape having a carrier tape formed with a storage section containing components and a component supply tape having a cover tape covering an opening above the storage section.
  • a tape feeding unit that feeds the tape to the position, a tape winding unit that peels off the cover tape by winding it in order to attract the component by the nozzle, and a tape after the deceleration of the component supply tape fed by the tape feeding unit is started.
  • a feeder control unit configured to initiate control for exposing the component by winding the cover tape by the winding unit.
  • the tape winder winds up the cover tape to expose the components.
  • a feeder control is provided that is configured to initiate control to cause the
  • the cover tape can be wound by the tape winding section near the suction position, so that the attached state of the cover tape can be maintained up to the vicinity of the suction position. Therefore, it is possible to prevent the component from jumping out until the component reaches the pick-up position, so that the tape feeding speed of the component supply tape by the tape feeding section can be increased. As a result, it is possible to reduce the time required to mount the component on the board (improve productivity) while preventing the component from popping out.
  • the feeder control unit stops the components stored in the storage unit in accordance with the suction position after the component supply tape fed by the tape feed unit starts to decelerate. or after stopping the storage portion in accordance with the suction position, the control for exposing the component is started by winding the cover tape by the tape winding portion.
  • the winding of the cover tape can be started avoiding the time when the feeding speed of the component supply tape fed by the tape feeder is switched to deceleration, so the acceleration/deceleration by the tape feeder is stabilized. From this state, the cover tape can be wound by the tape winding section. As a result, it is possible to more reliably prevent the component from jumping out until the component reaches the pick-up position while improving the feeding speed of the component supply tape.
  • the feeder control section causes the tape feeding section to start decelerating the component supply tape fed by the tape feeding section and before stopping the components stored in the storage section in accordance with the suction position.
  • the tape winding unit is configured to wind up the cover tape to start control for exposing the components.
  • the tape supply unit preferably includes a feed motor, and the feeder control unit After the deceleration of the component supply tape fed by the tape feeding unit is started, before the components stored in the storage unit are stopped in accordance with the suction position, the feeding motor rotates at a predetermined rotation speed or less corresponding to the predetermined speed. is decelerated to , the control for exposing the component is started by winding the cover tape by the tape winding section.
  • the feeder control section controls the tape winding when the tape winding section winds the cover tape after deceleration of the component supply tape fed by the tape feeding section is started. It is configured to perform control so that the maximum speed of the cover tape wound by the take-up portion is higher than the maximum speed of the component supply tape fed by the tape feeding portion.
  • the feeder control section causes the tape winding section to wind up the cover tape before deceleration of the component supply tape fed by the tape feeding section is started. Part of the cover tape at the opening of the tape is peeled off, and after the deceleration of the component supply tape fed by the tape feeding unit is started, the tape winding unit further winds up the cover tape to expose the component.
  • the feeder control section causes the tape winding section to wind up the cover tape before deceleration of the component supply tape fed by the tape feeding section is started.
  • the tape winding unit further winds up the cover tape to expose the component.
  • the peeling amount for peeling off a part of the cover tape before deceleration of the component supply tape fed by the tape feeding unit is started is It is smaller than the peeling amount for peeling off the cover tape later by the tape winder.
  • the component supply device preferably further includes a tape holding portion that includes a tape supporting portion that is arranged in the vicinity of the pickup position on the upstream side in the tape feeding direction and that holds down the component feeding tape, wherein the tape feeding portion is: a sprocket that feeds in the tape feeding direction by engaging with the component supply tape, a feeding motor that drives the sprocket, and a driving force transmission mechanism that transmits the driving force of the feeding motor to the sprocket and has play inside.
  • the feeder control unit controls the force in the tape feed direction generated with the tape support unit as a fulcrum when the tape winding unit winds the cover tape in a state where the tape holding unit holds down the component supply tape.
  • the tape feeding section is configured to control feeding of the component supply tape to the pickup position.
  • the tape feeding section can feed the component to the pick-up position without positional deviation, so that the component can be more reliably fed to the position where it can be picked up in a more stable state.
  • the component supply apparatus preferably further includes a tape support section arranged in the vicinity of the pickup position on the upstream side in the tape feeding direction, and further comprising a tape holding section for holding down the component supply tape, and a feeder control section. is configured to perform control for exposing the component by winding the cover tape by the tape winding section on the suction position side of the tape supporting section.
  • the cover tape can be wound by the tape winding section at a position closer to the pick-up position, so that it is possible to more reliably prevent the part from jumping out until the part reaches the pick-up position. can.
  • a component mounting apparatus includes a head unit including a nozzle for picking up a component, a carrier tape formed with a storage section containing the component, and a cover tape covering an opening above the storage section.
  • a component supply device including a tape feeding unit that feeds a supply tape to a suction position where a component is sucked by a nozzle, and a tape winding unit that separates a cover tape by winding it so that the component is sucked by the nozzle.
  • the component supply device is configured to start control for exposing the components by winding the cover tape by the tape winding unit after deceleration of the component supply tape fed by the tape feeding unit is started. Further includes a control unit.
  • the component supply device causes the tape winding section to wind up the cover tape after the component supply tape fed by the tape feeding section starts to decelerate.
  • a feeder control configured to initiate control to expose the parts by
  • the cover tape can be wound by the tape winding section near the suction position, so that the attached state of the cover tape can be maintained up to the vicinity of the suction position. Therefore, it is possible to prevent the component from jumping out until the component reaches the pick-up position, so that the tape feeding speed of the component supply tape by the tape feeding section can be increased.
  • a component mounting apparatus capable of reducing the time required to mount a component on a board (improving productivity) while suppressing the component from popping out.
  • the component supply apparatus preferably includes a tape supporting section arranged in the vicinity of the pickup position on the upstream side in the tape feed direction, and further includes a tape holding section for holding down the component supply tape.
  • the tape feeding unit includes a sprocket that feeds the tape in the tape feeding direction by engaging the component supply tape, a feeding motor that drives the sprocket, and transmits the driving force of the feeding motor to the sprocket, and has play inside. and a driving force transmission mechanism, wherein the force in the tape feeding direction is generated with the tape supporting portion as a fulcrum when the cover tape is wound by the tape winding portion while the component supply tape is pressed by the tape pressing portion.
  • FIG. 1 is a plan view showing a component mounting apparatus according to a first embodiment;
  • FIG. It is a side view showing the component mounting apparatus of the first embodiment.
  • 3 is a block diagram showing the detailed configuration of a tape feeder in the component mounting apparatus of the first embodiment;
  • FIG. It is the figure which showed typically the tape feeder of the component mounting apparatus of 1st Embodiment.
  • It is a perspective view showing a component supply tape of the component mounting apparatus of the first embodiment.
  • 2 is a plan view showing the vicinity of a suction position of a tape feeder of the component mounting apparatus of the first embodiment;
  • FIG. 4 is a cross-sectional view showing a state in which a component supply tape is held down by a tape holding portion of the component mounting apparatus according to the first embodiment; 4 is a graph showing the relationship between the motor rotation speeds of the tape feeding section and the tape winding section of the component mounting apparatus of the first embodiment and time.
  • FIG. 9 is a diagram schematically showing the state of the component supply tape at time T1 in the graph of FIG. 8;
  • FIG. 9 is a diagram schematically showing the state of the component supply tape at time T2 in the graph of FIG. 8; It is the figure which showed typically the force of the tape feed direction which arises from the front-end
  • FIG. 9 is a block diagram showing the detailed configuration of a tape feeder in the component mounting apparatus of the second embodiment; It is the graph which showed the relationship between the motor rotation speed of the tape feeding part and the tape winding part of the component mounting apparatus of 2nd Embodiment, and time.
  • FIG. 15 is a diagram schematically showing the state of the component supply tape at time T1 in the graph of FIG. 14;
  • FIG. 15 is a diagram schematically showing the state of the component supply tape at time T2 in the graph of FIG.
  • FIG. 11 is a block diagram showing the detailed configuration of a tape feeder in the component mounting apparatus of the third embodiment; It is the graph which showed the relationship between the motor rotation speed of the tape feeding part and the tape winding part of the component mounting apparatus of 3rd Embodiment, and time.
  • 20 is a diagram schematically showing the state of the component supply tape at time T1 in the graph of FIG. 19;
  • FIG. FIG. 20 is a diagram schematically showing the state of the component supply tape at time T2 in the graph of FIG.
  • FIG. 5 is a schematic diagram showing a component mounting apparatus in a modified example of the first to third embodiments
  • FIG. 1 A configuration of a component mounting apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 11.
  • FIG. 1 A configuration of a component mounting apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 11.
  • FIG. 1 A configuration of a component mounting apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 11.
  • FIG. 1 A configuration of a component mounting apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 11.
  • the component mounting apparatus 100 is configured to mount electronic components E such as ICs, transistors, capacitors and resistors on a board B such as a printed board placed at a board working position W.
  • electronic components E such as ICs, transistors, capacitors and resistors
  • a board B such as a printed board placed at a board working position W.
  • the electronic component E is an example of the "component" in the scope of claims.
  • the direction in which the board B is transported is defined as the X1 direction
  • the direction opposite to the direction in which the board B is transported is defined as the X2 direction
  • the combined direction of the X1 direction and the X2 direction is defined as the X direction.
  • the direction orthogonal to the X direction is the Y direction
  • one of the Y directions is the Y1 direction
  • the other Y direction is the Y2 direction.
  • the vertical direction perpendicular to the X and Y directions is defined as the Z direction (vertical direction)
  • one of the Z directions is defined as the Z1 direction (upward)
  • the other Z direction is defined as the Z2 direction (downward).
  • the component mounting apparatus 100 includes a base 1 , a feeder placement section 2 , a board transfer section 3 , a support section 4 , a pair of rail sections 5 , a head unit 6 , a component recognition camera 7 and a board recognition camera 8 . and a body control unit 9 (see FIG. 3).
  • the base 1 is a base on which components are arranged in the component mounting apparatus 100 .
  • a board transfer section 3, a rail section 5, and a component recognition camera 7 are provided on the base 1 as constituent elements.
  • a body control unit 9 is provided inside the base 1 .
  • the base 1 is provided with feeder placement portions 2 on both sides in the Y direction (the Y1 direction side and the Y2 direction side) in which a plurality of tape feeders 2a can be arranged.
  • the tape feeder 2a is an example of a "parts supply device" in the claims.
  • the tape feeder 2a is a component supply device that supplies electronic components E to be mounted on the substrate B. As shown in FIG. The tape feeder 2a holds a reel (not shown) wound with a component supply tape 101 holding a plurality of electronic components E at predetermined intervals. A detailed structure of the tape feeder 2a will be described later.
  • the board transfer unit 3 is configured to load the board B from outside the component mounting apparatus 100 and transfer the board B in the transfer direction (X1 direction).
  • the substrate transfer section 3 includes a pair of conveyors 31 and a drive motor (not shown) for rotating the pair of conveyors 31 .
  • Each of the pair of conveyors 31 has a pulley (not shown) and a loop-shaped conveying belt that is looped around the pulley.
  • the body control unit 9 is configured to control the transport speed of the substrate B placed on the pair of conveyors 31 by controlling the drive motor.
  • the support portion 4 is configured to support the head unit 6 so as to be movable in the X direction.
  • the support portion 4 includes a ball screw shaft 41 extending in the X direction and an X-axis motor 42 that rotates the ball screw shaft 41 .
  • the head unit 6 is provided with a ball nut (not shown) that engages with the ball screw shaft 41 of the support portion 4 .
  • the head unit 6 is configured to be movable in the X direction together with a ball nut that engages with the ball screw shaft 41 when the ball screw shaft 41 is rotated by the X-axis motor 42 .
  • the pair of rail portions 5 are configured to support the support portion 4 so as to be movable in the Y direction.
  • the rail portion 5 includes a ball screw shaft 51 extending in the Y direction, a Y-axis motor 52 that rotates the ball screw shaft 51 , and guide rails 53 .
  • the support portion 4 is provided with a ball nut (not shown) that engages with the ball screw shaft 51 of the rail 54 .
  • the guide rail 53 extends in the Y direction.
  • the support portion 4 is configured to be movable in the Y direction along the guide rail 53 together with the ball nut that engages with the ball screw shaft 51 when the ball screw shaft 51 is rotated by the Y-axis motor 52 .
  • the head unit 6 is configured to be movable on the base 1 in the horizontal plane (in the X direction and the Y direction).
  • the head unit 6 is a head unit for mounting components, and moves in the Z1 direction (upward) of the board B and performs a predetermined work (mounting work) on the board B. is configured as That is, the head unit 6 is configured to mount the electronic component E on the board B fixed at the board working position W. As shown in FIG.
  • the head unit 6 includes a mounting head 61, a Z-axis motor 62, and an R-axis motor (not shown).
  • the mounting head 61 is configured to hold the electronic component E and mount the electronic component E at a target position on the board B (target mounting position).
  • a plurality of (four) mounting heads 61 are arranged in a row in the X direction.
  • Each of the plurality of mounting heads 61 is connected to a pressure generator (not shown), and the negative pressure generated by the pressure generator holds the electronic component E in the nozzle N attached (mounted) to the tip. (adsorption) is possible. Further, each of the plurality of mounting heads 61 is configured to be able to mount (mount) the electronic component E on the substrate B by switching the negative pressure generated by the pressure generator to positive pressure.
  • Each of the plurality of mounting heads 61 is configured to be movable in the Z direction (vertical direction) by a Z-axis motor 62 . Also, each of the plurality of mounting heads 61 is configured to be rotatable around the rotation axis by an R-axis motor.
  • the component recognition camera 7 is a camera for capturing an image of the electronic component E held (adsorbed) by the nozzle N prior to mounting the electronic component E on the substrate B, as shown in FIG.
  • the component recognition camera 7 is fixed on the base 1 and configured to capture an image of the electronic component E held (adsorbed) by the nozzle N from below the electronic component E (Z2 direction).
  • the board recognition camera 8 is attached to the head unit 6, and the FI mark (Fiducial Mark: not shown) put on the upper surface of the board B prior to mounting the electronic component E on the board B. It is a camera for capturing a mark.
  • the FI mark is a mark for confirming the position of the substrate B.
  • the body control unit 9 is configured to perform control for picking up the electronic component E from the tape feeder 2a by the nozzle N and mounting it on the substrate B.
  • the body control unit 9 is a control circuit that includes a CPU (Central Processing Unit) 91 and a storage unit 92 and controls the operation of the component mounting apparatus 100 .
  • the body control section 9 is electrically connected to the tape feeder 2a, the board transfer section 3, the support section 4, the rail section 5, the head unit 6, the component recognition camera 7, and the board recognition camera 8.
  • the storage unit 92 is a storage device having memories such as ROM (Read Only Memory) and RAM (Random Access Memory).
  • the storage unit 92 stores a component mounting program.
  • the component mounting program is a program for mounting the electronic component E mounted on the board B.
  • the tape feeder 2a is configured to rotate the reel by feeding the component supply tape 101 in accordance with the component holding operation for taking out the electronic component E by the head unit 6. ing.
  • the tape feeder 2a is configured to feed the electronic components E from the suction position 102 (the leading end on the board working position W side) by feeding out the component supply tape 101 .
  • the tape feeder 2 a includes a magnet 21 , a tape feeding section 22 , a tape winding section 23 , a tape holding section 24 and a feeder control section 25 .
  • the magnet 21 positions the electronic component E by attracting a magnetic component (such as a chip resistor) of the electronic component E at the attracting position 102 .
  • the magnet 21 is arranged at the attraction position 102 .
  • the component supply tape 101 includes a carrier tape 111 and a cover tape 112.
  • the carrier tape 111 has a component storage portion 111a for storing the electronic component E.
  • the component storage portion 111a has a concave shape corresponding to the shape of the electronic component E.
  • Engaging holes 111b for engaging with the sprockets 22a of the tape feeding portion 22 are formed in the carrier tape 111 at predetermined intervals along the direction in which the carrier tape 111 extends.
  • the cover tape 112 is configured to hold the electronic component E within the carrier tape 111 by covering the carrier tape 111 .
  • the cover tape 112 is configured such that the electronic component E is exposed to the outside when peeled off from the carrier tape 111 .
  • the tape feeding section 22 is configured to feed the component supply tape 101 in the tape path 26 to a pickup position 102 where the electronic component E is picked up by the nozzle N.
  • the tape feeding section 22 has a sprocket 22a, a feeding motor 22b, a driving force transmission mechanism 22c, and a feeding rotation angle sensor 22d.
  • the sprocket 22a is configured to pull out the component supply tape 101 from the reel and feed out the carrier tape 111.
  • the sprocket 22 a is provided with a plurality of pins Pn at predetermined intervals on the outer periphery, and is configured to engage with the engagement holes 111 b of the carrier tape 111 .
  • the feed motor 22b is a motor that generates driving force for driving the sprocket 22a.
  • the driving force transmission mechanism 22c transmits the driving force of the feed motor 22b to the sprocket 22a.
  • the driving force transmission mechanism 22 c has a plurality of intermediate gears 122 . Further, the driving force transmission mechanism 22c has play inside. Backlash is backlash set between the intermediate gears 122 .
  • the feed rotation angle sensor 22d is an encoder that measures the rotation angle of the feed motor 22b.
  • the tape take-up part 23 is configured to take up the cover tape 112 so that the electronic component E is sucked by the nozzle N so as to separate the cover tape 112 .
  • the tape winding section 23 has a feed roller 23a, a pressure roller 23b, a winding motor 23c, a driving force transmission mechanism 23d, and a winding rotation angle sensor 23e.
  • the feed roller 23a is arranged on the Z2 direction side of the pressing roller 23b.
  • the feed roller 23a is configured to be rotated by the driving force of the winding motor 23c while sandwiching the cover tape 112 together with the pressure roller 23b. As a result, the cover tape 112 is sent out to the tape housing portion 27 while being separated from the carrier tape 111 .
  • the winding motor 23c is a motor that generates driving force for driving the feed roller 23a.
  • the driving force transmission mechanism 23d transmits the driving force of the winding motor 23c to the feed roller 23a.
  • the driving force transmission mechanism 23 d has a plurality of intermediate gears 123 .
  • the winding rotation angle sensor 23e is an encoder that measures the rotation angle of the winding motor 23c.
  • the tape holding portion 24 is configured to hold down the component supply tape 101 .
  • the tape presser 24 presses the component supply tape 101 in the Z2 direction.
  • the tape holding portion 24 has a tape support portion 24a.
  • the tape support portion 24a is arranged in the vicinity of the suction position 102 on the upstream side in the tape feeding direction D.
  • the tape support portion 24a is arranged in an opening 28 for sucking the electronic component E by the nozzle N.
  • the tape support portion 24 a is a fulcrum that supports the cover tape 112 wound by the tape winding portion 23 .
  • the feeder control unit 25 controls the feeding of the component supply tape 101 toward the suction position 102 by the tape feeding unit 22, and causes the tape winding unit 23 to peel off the cover tape 112. configured to control.
  • the feeder control section 25 is a control circuit that includes a CPU, a storage section, and the like, and controls the operation of the tape feeder 2a.
  • the feeder control section 25 is electrically connected to the feeding motor 22b and the winding motor 23c.
  • the storage unit is a storage device having memories such as ROM and RAM.
  • a component supply program is stored in the storage unit.
  • the component supply program is a program for performing the electronic component E supply process.
  • the feeder control section 25 is configured to perform control to feed the electronic component E in the component supply tape 101 to the pickup position 102 by the tape feeding section 22 .
  • the feeder control unit 25 is configured to perform control to accelerate the feed speed of the component supply tape 101 from the feed start time of the tape feed unit 22 to time Ta.
  • the feeder control unit 25 is configured to perform control to keep the feeding speed of the component supply tape 101 constant from time Ta to time Tb.
  • the feeder control unit 25 is configured to reduce the feed speed of the component supply tape 101 from time Tb to time Tc.
  • the feeder control unit 25 is configured to perform control to stop the component supply tape 101 at time Tc.
  • the rotational speed of the feeding motor 22b of the tape feeding section 22 is indicated by a solid line.
  • the feeder control unit 25 of the first embodiment starts decelerating the component supply tape 101 fed by the tape feeding unit 22 (for example, time T1 in FIG. 7).
  • the control for exposing the electronic component E is started by winding the cover tape 112 by the tape winding section 23 . That is, the feeder control unit 25 starts the control of exposing the electronic component E by winding the cover tape 112 with the tape winding unit 23 at a position in the vicinity of the suction position 102 on the upstream side in the tape feeding direction D.
  • the rotational speed of the winding motor 23c of the tape winding section 23 is indicated by a dotted line.
  • the feeder control unit 25 is configured to perform control to expose the electronic component E by winding the cover tape 112 by the tape winding unit 23 on the suction position 102 side of the tape support unit 24a.
  • the feeder control unit 25 before stopping the electronic component E stored in the component storage unit 111a in accordance with the suction position 102, The control for exposing the electronic component E is started by winding the cover tape 112 by the tape winding section 23 .
  • the feeder control unit 25 feeds the tape before stopping the electronic components E stored in the component storage unit 111a in accordance with the suction position 102.
  • the tape winding unit 23 winds up the cover tape 112 to start the control of exposing the electronic component E.
  • the feeder control unit 25 causes the component supply tape 101 fed by the tape feeding unit 22 to be stored in the component storage unit 111a in accordance with the suction position 102 after the deceleration of the component supply tape 101 is started.
  • the cover tape 112 is wound up by the tape winding unit 23 based on the fact that the feeding motor 22b is decelerated to a predetermined rotation speed Rt or less corresponding to the predetermined speed. It is configured to initiate control to expose E.
  • the rotation speed of the feed motor 22b is calculated by differentiating the rotation angle of the feed motor 22b measured by the feed rotation angle sensor 22d in the feeder control section 25.
  • the feeder control unit 25 causes the tape winding unit 23 to wind the cover tape 112 at once after the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started. configured to control.
  • the feeder control unit 25 causes the tape winding unit 23 to wind the cover tape 112 when the tape winding unit 23 winds the cover tape 112 after deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started. It is configured to perform control so that the maximum speed of the cover tape 112 is higher than the maximum speed of the component supply tape 101 fed by the tape feeder 22 . Specifically, the feeder control unit 25 causes the tape winding unit 23 to take up The tape feeding unit 22 controls the maximum rotational speed Mv1 of the winding motor 23c for winding the component supply tape 101 to be higher than the maximum rotational speed Mv2 of the feeding motor 22b for feeding the component supply tape 101.
  • the gear ratio of the driving force transmission mechanism 23d of the tape winding section 23 and the gear ratio of the driving force transmission mechanism 22c of the tape feeding section 22 are such that the maximum rotational speed Mv1 of the winding motor 23c is equal to that of the feeding motor 22b. so that the maximum speed of the cover tape 112 wound by the tape winder 23 is greater than the maximum speed of the component supply tape 101 fed by the tape feeder 22, adjusted.
  • the feeder control unit 25 causes the winding amount D2 of the cover tape 112 by the tape winding unit 23 to follow the feeding amount D1 of the component supply tape 101 of the tape feeding unit 22.
  • the feeder control unit 25 is configured to end control for exposing the electronic component E when the feeding amount D1 and the winding amount D2 substantially match.
  • the control for exposing the electronic component E is completed at time T2 after the time Tc at which the electronic component E is sent to the pickup position 102 by the tape feeding section 22 .
  • stop position 103 may be located on the tape feeding direction D side from the suction position 102 . That is, in a state where the component supply tape 101 is held down by the tape holding portion 24, the force Rf for winding the cover tape 112 by the tape winding portion 23 causes the tape feeding direction generated with the tape supporting portion 24a of the tape holding portion 24 as a fulcrum. Due to the force Sf of D, the carrier tape 111 moves by the backlash.
  • the winding amount D2 of the cover tape 112 is set larger than the pitch between the plurality of component storage portions 111a.
  • the feeder control unit 25 causes the tape holding unit 24 to hold down the component supply tape 101 while the tape winding unit 23 winds up the cover tape 112 .
  • the component is moved to the suction position 102 by the tape feeding portion 22. It is configured to control feeding of the supply tape 101 .
  • the feeder control unit 25 is configured to perform control to preliminarily add the same offset value to the rotation control amount set for each of the plurality of pins Pn of the sprocket 22a.
  • the cover tape winding process by the feeder control unit 25 will be described below with reference to FIG. 12 .
  • the cover tape winding process is a process of winding the cover tape 112 just before the suction position 102 .
  • step S1 the feeding of the component supply tape 101 by the tape feeding section 22 is started by the feeder control section 25.
  • step S2 the feeder control section 25 determines whether or not the rotation speed of the feeding motor 22b of the tape feeding section 22 has become equal to or less than a predetermined rotation speed Rt. If the rotation speed of the feed motor 22b is equal to or less than the predetermined rotation speed Rt, the process proceeds to step S3, and if the rotation speed of the feed motor 22b exceeds the predetermined rotation speed Rt, step S2 is repeated.
  • step S3 the feeder control unit 25 causes the tape winding unit 23 to start winding the cover tape 112.
  • step S4 the feeder control section 25 determines whether or not the feeding amount D1 by the tape feeding section 22 and the winding amount D2 by the tape winding section 23 substantially match. If the feeding amount D1 and the winding amount D2 substantially match, the cover tape winding process is terminated. If the feeding amount D1 and the winding amount D2 do not substantially match, step S4 is repeated.
  • the tape feeder 2a winds the cover tape 112 by the tape winder 23 after the deceleration of the component supply tape 101 fed by the tape feeder 22 is started. It includes a feeder control 25 configured to initiate controls for exposing part E.
  • the cover tape 112 can be wound by the tape winding unit 23 near the suction position 102 , so that the attached state of the cover tape 112 can be maintained up to the vicinity of the suction position 102 . Therefore, it is possible to prevent the electronic component E from jumping out until the electronic component E reaches the suction position 102, so that the tape feeding speed of the component supply tape 101 by the tape feeding section 22 can be increased.
  • the feeder control unit 25 accommodates the component supply tape 101 in the component storage unit 111a in accordance with the suction position 102.
  • the tape winder 23 winds up the cover tape 112 to start the control of exposing the electronic component E.
  • the winding of the cover tape 112 can be started by avoiding the point in time when the feeding speed of the component supply tape 101 fed by the tape feeder 22 is switched to deceleration, so that the acceleration/deceleration by the tape feeder 22 is stabilized. From this state, the cover tape 112 can be wound by the tape winding section 23 .
  • the feeder control unit 25 accommodates the component supply tape 101 in the component storage unit 111a in accordance with the suction position 102.
  • the tape winder 23 winds up the cover tape 112. It is configured to initiate control for exposing the electronic component E.
  • the winding of the cover tape 112 can be started avoiding the time when the feeding speed of the component supply tape 101 fed by the tape feeder 22 is switched to deceleration, so that the acceleration/deceleration by the tape feeder 22 is ensured.
  • the cover tape 112 can be wound by the tape winding section 23 in a calm state. As a result, it is possible to more reliably prevent the electronic component E from jumping out until the electronic component E reaches the pickup position 102 .
  • the tape feeding section 22 includes the feeding motor 22b.
  • the feeder control unit 25 controls the feed control unit 25 before stopping the electronic component E stored in the component storage unit 111 a in accordance with the suction position 102 .
  • the motor 22b is decelerated to a predetermined rotation speed Rt or less corresponding to the predetermined speed
  • the tape winder 23 winds up the cover tape 112 to start the control of exposing the electronic component E. ing.
  • the timing at which the acceleration/deceleration by the tape feeding section 22 has stabilized can be obtained accurately. Therefore, the winding control of the cover tape 112 can be started at an appropriate timing.
  • the feeder control unit 25 causes the tape winding unit 23 to wind the cover tape 112 after deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started. At this time, control is performed so that the maximum speed of the cover tape 112 wound by the tape winder 23 is higher than the maximum speed of the component supply tape 101 fed by the tape feeder 22 .
  • the feed amount D1 of the component supply tape 101 by the feed motor 22b and the winding amount D2 of the cover tape 112 by the winding motor 23c can be brought into agreement at an early stage.
  • the tape support portion 24a of the tape feeder 2a is arranged in the vicinity of the suction position 102 on the upstream side in the tape feeding direction D, and the tape holding portion for holding down the component supply tape 101 is provided.
  • a portion 24 is provided.
  • the tape feeder 22 engages with the component supply tape 101 to feed the sprocket 22a in the tape feeding direction D, a feed motor 22b that drives the sprocket 22a, and transmits the driving force of the feed motor 22b to the sprocket 22a. and a driving force transmission mechanism 22c having backlash inside.
  • the feeder control unit 25 controls the tape holding unit 24 to hold down the component supply tape 101 and the tape winding unit 23 to wind the cover tape 112.
  • the feeder control unit 25 controls the tape support unit 24a of the tape holding unit 24 as a fulcrum. Based on the suction position 102 set in advance by adding the movement of the carrier tape 111 by the force in the feeding direction D, the tape feeding unit 22 controls the feeding of the component supply tape 101 to the suction position 102. It is configured. As a result, the tape feeder 22 can feed the electronic component E to the pickup position 102 without positional deviation, so that the electronic component E can be more reliably fed to a position where it can be picked up in a more stable state.
  • the tape support portion 24a of the tape feeder 2a is arranged in the vicinity of the suction position 102 on the upstream side in the tape feeding direction D, and the tape holding portion for holding down the component supply tape 101 is provided.
  • a portion 24 is provided.
  • the feeder control unit 25 is configured to perform control for exposing the electronic component E by winding the cover tape 112 by the tape winding unit 23 on the suction position 102 side of the tape supporting unit 24a of the tape pressing unit 24.
  • the cover tape 112 can be wound by the tape winding unit 23 at a position closer to the suction position 102, so that the electronic component E can be more reliably protruded until the electronic component E reaches the suction position 102. can be suppressed.
  • the component mounting apparatus 100 includes the head unit 6 including the nozzle N for sucking the electronic component E, and the carrier tape in which the component storage section 111a storing the electronic component E is formed.
  • 111 and a component supply tape 101 having a cover tape 112 covering the upper opening of the component storage section 111a, and a tape feeding section 22 that feeds the component supply tape 101 to a suction position 102 where the electronic component E is sucked by the nozzle N;
  • a tape feeder 2a including a tape winding section 23 for peeling off the cover tape 112 by winding it is provided for adsorption.
  • the tape winder 23 winds up the cover tape 112 so that the electronic components E are exposed. It includes a configured feeder control 25 . As a result, it is possible to obtain a component mounting apparatus capable of reducing the time required to mount the electronic component E on the board B (improving productivity) while suppressing the electronic component E from popping out.
  • FIG. 13 to 16 The configuration of a component mounting apparatus 200 according to the second embodiment will be described with reference to FIGS. 13 to 16.
  • FIG. 13 to 16 unlike the first embodiment, the cover tape 112 is wound after the component supply tape 101 stops at the suction position 102 .
  • detailed description of the same configuration as in the first embodiment is omitted.
  • the component mounting apparatus 200 of the second embodiment includes a base 1, a feeder placement section 2, a substrate transfer section 3, a support section 4, a pair of rail sections 5, a head unit 6, and a , a component recognition camera 7 , a board recognition camera 8 , and a main body control section 9 .
  • the base 1 is provided with feeder placement portions 2 on both sides in the Y direction (Y1 direction side and Y2 direction side) in which a plurality of tape feeders 202a can be arranged.
  • the tape feeder 202a is an example of a "parts supply device" in the claims.
  • the tape feeder 202a is configured to rotate the reel by feeding the component supply tape 101 in accordance with the component holding operation for taking out the electronic component E by the head unit 6 .
  • the tape feeder 202a is configured to feed the electronic components E from the suction position 102 (the leading end on the board working position W side) by feeding out the component supply tape 101 .
  • the tape feeder 202 a includes a magnet 21 , a tape feeding section 22 , a tape winding section 23 , a tape pressing section 24 and a feeder control section 225 .
  • the feeder control unit 225 is configured to control feeding of the component supply tape 101 toward the suction position 102 by the tape feeding unit 22 and to peel off the cover tape 112 by the tape winding unit 23 .
  • the feeder control unit 225 of the second embodiment performs tape winding after the component supply tape 101 fed by the tape feeding unit 22 stops (for example, time T1 in FIG. 14).
  • the control for exposing the electronic component E is started. That is, the feeder control unit 225 starts control to expose the electronic component E by winding the cover tape 112 with the tape winding unit 23 at a position near the suction position 102 on the downstream side in the tape feeding direction D. is configured to
  • the feeder control unit 225 stops the component storage unit 111a in accordance with the suction position 102 after the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started, and then the tape winding unit 23 is configured to start control for exposing the electronic component E by winding the cover tape 112 .
  • the feeder control unit 225 causes the winding amount D2 of the cover tape 112 by the tape winding unit 23 to follow the feeding amount D1 of the component supply tape 101 of the tape feeding unit 22. is configured to perform control for exposing the electronic component E.
  • the feeder control section 225 is configured to perform control such that the feeding amount D1 and the winding amount D2 are substantially matched.
  • the feeder control unit 225 is configured to end control for exposing the electronic component E (for example, at time T2 in FIG. 14) when the feeding amount D1 and the winding amount D2 substantially match.
  • the cover tape winding process by the feeder control unit 225 will be described below with reference to FIG. 17 .
  • the cover tape winding process is a process of winding the cover tape 112 after the electronic component E stops at the suction position 102 .
  • Steps S1, S3, and S4 are the same as steps S1, S3, and S4 in the first embodiment, respectively, so descriptions thereof will be omitted.
  • the feeder control section 225 determines whether or not the feeding of the component supply tape 101 by the tape feeding section 22 has been stopped. If the feed of the component supply tape 101 by the feed motor 22b is stopped, the process proceeds to step S3, and if the feed of the component supply tape 101 by the feed motor 22b is not stopped, step S202 is repeated.
  • the tape feeder 202a winds the cover tape 112 by the tape winder 23 after the deceleration of the component supply tape 101 fed by the tape feeder 22 is started. It includes a feeder control 225 configured to initiate control to expose electronic component E by picking it up. As a result, it is possible to shorten the time until the electronic component E is mounted on the board B (improve productivity) while suppressing the electronic component E from popping out.
  • the feeder control unit 225 accommodates the component supply tape 101 in the component storage unit 111a in accordance with the suction position 102.
  • the tape winding unit 23 winds the cover tape 112 to expose the electronic component E. configured to start.
  • the cover tape 112 can be wound by the tape winder 23 in a state where the acceleration/deceleration by the tape feeder 22 has stabilized. It is possible to more reliably suppress the electronic component E from protruding inside.
  • Other effects of the second embodiment are the same as those of the first embodiment.
  • FIG. 3 unlike the first embodiment, the cover tape 112 is separated in multiple times.
  • the description of the same configuration as that of the first embodiment is omitted.
  • a component mounting apparatus 300 of the third embodiment includes a base 1, a feeder placement section 2, a substrate transfer section 3, a support section 4, a pair of rail sections 5, a head unit 6, and a , a component recognition camera 7 , a board recognition camera 8 , and a main body control section 9 .
  • the base 1 is provided with feeder placement portions 2 on both sides in the Y direction (the Y1 direction side and the Y2 direction side) in which a plurality of tape feeders 302a can be arranged.
  • the tape feeder 302a is an example of a "parts supply device" in the claims.
  • the tape feeder 302a is configured to rotate the reel by feeding the component supply tape 101 in accordance with the component holding operation for taking out the electronic component E by the head unit 6 .
  • the tape feeder 302a is configured to feed the electronic components E from the suction position 102 (the leading end on the board working position W side) by feeding out the component supply tape 101 .
  • the tape feeder 302 a includes a magnet 21 , a tape feeding section 22 , a tape winding section 23 , a tape pressing section 24 and a feeder control section 325 .
  • the feeder control unit 325 is configured to control feeding of the component supply tape 101 toward the suction position 102 by the tape feeding unit 22 and to peel off the cover tape 112 by the tape winding unit 23 .
  • the feeder control unit 325 of the third embodiment causes the tape winding unit 23 to feed the cover tape 112 before deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started. is wound up to peel off a portion of the cover tape 112 in the upper opening portion (for example, at time T1 in FIG. 19).
  • the peeling amount D21 for peeling off a part of the cover tape 112 before the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started is It is smaller than the peeling amount D22 for peeling the cover tape 112 by the tape winding unit 23 after the start.
  • the peeling amount D21 is preferably an amount by which the cover tape 112 is peeled off to a position where the end portion of the electronic component E in the component storage portion 111a in the tape feeding direction can be visually recognized.
  • the feeder control section 325 is configured to control the speed of the winding motor 23c of the tape winding section 23 based on the peeling amount D21 set in advance.
  • the feeder control unit 325 causes the tape winding unit 23 to further wind the cover tape 112 after the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started (for example, time T2 in FIG. 19). is configured to start control for exposing the electronic component E by . That is, the feeder control unit 325 is configured to perform control to substantially match the feeding amount D1 and the distance obtained by adding the winding amount D2 before the start of deceleration to the winding amount D2 after the start of deceleration.
  • the feeder control unit 325 performs control for exposing the electronic component E based on the fact that the feeding amount D1 and the distance obtained by adding the winding amount D2 before the start of deceleration to the winding amount D2 after the start of deceleration are substantially matched. is configured to end the
  • the cover tape winding process by the feeder control unit 325 will be described below with reference to FIG. 22 .
  • the cover tape winding process is a process of peeling off the cover tape 112 in a plurality of times.
  • step S1 the feeder control unit 325 starts feeding the component supply tape 101.
  • step S ⁇ b>302 the feeder control unit 325 starts peeling the cover tape 112 .
  • step S303 the feeder control unit 325 determines whether or not the cover tape 112 has been wound up by a predetermined winding amount or more. When the cover tape 112 has been wound up by the predetermined winding amount or more, the process proceeds to step S304, and when the cover tape 112 has not been wound up by the predetermined winding amount or more, step S303 is repeated.
  • step S304 the winding of the cover tape 112 is stopped by the feeder control unit 325.
  • step S305 the feeder control unit 325 determines whether or not the feed speed of the component supply tape 101 is equal to or lower than a predetermined speed. If the feed speed is equal to or less than the predetermined speed, the process proceeds to step S306, and if the feed speed is not equal to or less than the predetermined speed, step S305 is repeated.
  • step S ⁇ b>306 the feeder control unit 325 starts winding the cover tape 112 .
  • step S307 it is determined whether or not the feed amount D1 and the distance obtained by adding the winding amount D2 before deceleration start to the winding amount D2 after deceleration start substantially match. If they substantially match, the cover tape winding process is terminated, and if they do not substantially match, step S307 is repeated.
  • the tape feeder 302a winds the cover tape 112 by the tape winder 23 after the deceleration of the component supply tape 101 fed by the tape feeder 22 is started. It includes a feeder control 325 configured to initiate control to expose electronic component E by picking it up. As a result, it is possible to shorten the time until the electronic component E is mounted on the board B (improve productivity) while suppressing the electronic component E from popping out.
  • the feeder control unit 325 causes the tape winding unit 23 to wind the cover tape 112 before deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started.
  • the cover tape 112 By removing the cover tape 112 from the upper opening portion, part of the cover tape 112 is peeled off. It is configured to start control for exposing the electronic component E by winding it.
  • the winding amount D2 of the cover tape 112 by the winding motor 23c near the suction position 102 can be reduced. It is possible to suppress the delay in the component supply work caused by this.
  • the peeling amount D21 for peeling off a part of the cover tape 112 before the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started is set by the tape feeding unit 22 is less than the peeling amount D22 for peeling off the cover tape 112 by the tape winder 23 after the deceleration of the component supply tape 101 fed by is started.
  • the peeling amount D21 for peeling off a part of the cover tape 112 before the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started is set by the tape feeding unit 22 is less than the peeling amount D22 for peeling off the cover tape 112 by the tape winder 23 after the deceleration of the component supply tape 101 fed by is started.
  • the feeder control unit 25 controls the tape feeding unit based on the adsorption position 102 preset by adding the movement of the backlash of the carrier tape 111.
  • 22 is configured to control feeding of the component supply tape 101 to the pickup position 102, but the present invention is not limited to this.
  • the body control unit 9 presses the component supply tape 101 with the tape holding unit 24, and when the tape winding unit 23 winds up the cover tape 112, the tape supporting unit 24a is pressed.
  • the nozzle N may be moved based on the preset target position of the nozzle N by adding the movement of the backlash of the carrier tape 111 caused by the force Sf in the tape feed direction D generated with .
  • the electronic component E can be picked up by the nozzle N without positional deviation, so that the electronic component E can be picked up in a more stable state.
  • the feeder control section 25 (225, 325) is configured to perform control to preliminarily add one offset value to each of the plurality of pins Pn of the sprocket 22a.
  • the feeder control unit adjusts the offset value based on the eccentricity correction table in which individual offset values are set for each of the plurality of pins of the sprocket when performing control to change the winding timing of the cover tape. It may be configured to perform pre-addition control.
  • the feeder control unit 225 sets the maximum rotation speed Mv1 of the winding motor 23c for winding the component supply tape 101 by the tape winding unit 23 to
  • the feeder control section makes the maximum rotational speed of the winding motor for winding the component supply tape by the tape winding section lower than the maximum rotational speed of the feeding motor for feeding the component supply tape by the tape feeding section. good too.
  • the feeder control unit 25 (225, 325) causes the component supply tape 101 fed by the tape feeding unit 22 to start decelerating, and then adjusts the component supply tape 101 to the pickup position 102 to store the component.
  • the tape winder 23 rolls the cover tape.
  • the feeder control section controls the tape winding section to wind up the cover tape to expose the components when a predetermined time elapses after the deceleration of the component supply tape fed by the tape feeding section is started. may be configured to initiate
  • the present invention is not limited to this.
  • the peeling amount before the start of deceleration and the peeling amount after the start of deceleration may be substantially the same.
  • the feeder control unit 25 (225, 325) sucks the tape feed unit 22 based on the suction position 102 preset by adding the movement of the backlash of the carrier tape 111.
  • the feeder control section may be configured to perform control so that the tape feeding section returns the component supply tape by the amount of play without adding the movement of the carrier tape by the amount of play to the pickup position.
  • the feeder control section 25 (225, 325) causes the tape winding section 23 to start decelerating the component supply tape 101 fed by the tape feeding section 22, and then the cover tape. 112, the maximum rotational speed Mv1 of the winding motor 23c for winding the cover tape 112 by the tape winding section 23 is calculated from the maximum rotational speed Mv2 of the feeding motor 22b for feeding the component supply tape 101 by the tape feeding section 22.
  • the present invention is not limited to this.
  • the gear ratio of the driving force transmission mechanism of the tape winding section and the gear of the driving force transmission mechanism of the tape feeding section By adjusting the ratio, the maximum speed of the cover tape wound by the tape winder should be higher than the maximum speed of the component supply tape fed by the tape feeder.
  • control processing of the feeder control unit 25 has been explained using a flow-driven flowchart in which processing is performed in order along the processing flow.
  • the control processing of the feeder control section may be performed by event-driven processing that executes processing on an event-by-event basis. In this case, it may be completely event-driven, or a combination of event-driven and flow-driven.

Abstract

This component supply device (2a) is provided with: a tape feed unit (22); a tape winding unit (23); and, a feeder control unit (25) configured so as to start control for exposing a component (E) by winding a cover tape (112) using the tape winding unit (23) after deceleration of a component supply tape (101) fed by the tape feed unit (22) is started.

Description

部品供給装置および部品実装装置Component feeder and component mounter
 この発明は、部品供給装置および部品実装装置に関し、特に、ノズルにより部品を吸着する吸着位置に部品供給テープを送るテープ送り部を備える部品供給装置および部品実装装置に関する。 The present invention relates to a component supply device and a component mounting device, and more particularly to a component supply device and a component mounting device having a tape feeding section that feeds a component supply tape to a suction position where a nozzle picks up a component.
 従来、ノズルにより部品を吸着する吸着位置に部品供給テープを送るテープ送り部を備える部品供給装置が知られている。このような部品供給装置は、たとえば、特開2012-18999号公報に開示されている。 Conventionally, there has been known a component supply device equipped with a tape feeding section that feeds a component supply tape to a pickup position where a nozzle picks up a component. Such a component supply device is disclosed in Japanese Unexamined Patent Application Publication No. 2012-18999, for example.
 上記特開2012-18999号公報には、ノズルにより電子部品を吸着する部品供給位置(吸着位置)に部品供給テープを送る搬送機構(テープ送り部)を備える電子部品供給装置(部品供給装置)が開示されている。搬送機構は、加減速を行うことにより、部品供給テープを部品吸着位置に送るように構成されている。ここで、部品供給テープは、キャリアテープと、カバーテープとを含んでいる。キャリアテープは、電子部品を格納する複数の凹部を有している。カバーテープは、複数の凹部の各々の上方への開口を覆っている。 The above-mentioned JP-A-2012-18999 discloses an electronic component supply device (component supply device) provided with a transport mechanism (tape feeder) that feeds a component supply tape to a component supply position (sucking position) where an electronic component is sucked by a nozzle. disclosed. The transport mechanism is configured to transport the component supply tape to the component pickup position by accelerating and decelerating. Here, the component supply tape includes a carrier tape and a cover tape. The carrier tape has a plurality of recesses for storing electronic components. A cover tape covers the upward opening of each of the plurality of recesses.
 上記特開2012-18999号公報の電子部品供給装置は、さらに、剥離機構と、制御部とを備えている。剥離機構は、剥離位置においてキャリアテープからカバーテープを剥離させるように構成されている。剥離位置は、部品供給位置よりも搬送方向の上流側に配置されている。制御部は、剥離機構により剥離位置においてカバーテープを剥離させた後、搬送機構によりキャリアテープを部品供給位置まで搬送させる制御を行うように構成されている。 The electronic component supply device of JP-A-2012-18999 further includes a peeling mechanism and a control unit. The peeling mechanism is configured to peel the cover tape from the carrier tape at the peeling position. The peeling position is arranged upstream of the component supply position in the transport direction. The control unit is configured to perform control such that after the cover tape is peeled off at the peeling position by the peeling mechanism, the carrier tape is transported to the component supply position by the conveying mechanism.
特開2012-18999号公報JP 2012-18999 A
 しかしながら、上記特開2012-18999号公報の電子部品供給装置では、剥離機構により剥離位置においてカバーテープを剥離させた後、搬送機構により加減速を行うことにより、キャリアテープを部品供給位置まで搬送させるので、キャリアテープの凹部内の電子部品が搬送機構による加減速に起因して凹部から飛び出す場合がある。したがって、上記特開2012-18999号公報の電子部品供給装置では、上記電子部品の飛び出しを抑制するために、搬送機構による部品供給テープの搬送速度を上げることが困難である。ここで、搬送機構による部品供給テープの搬送速度を上げることが困難であると、基板に部品を実装するまでの時間の短縮を実現することが困難になる。このため、従来では、電子部品(部品)の飛び出しを抑制しながら、基板に電子部品(部品)を実装するまでの時間の短縮(生産性の向上)を実現することが望まれている。 However, in the electronic component supply device disclosed in JP-A-2012-18999, after the cover tape is peeled off at the peeling position by the peeling mechanism, the carrier tape is transported to the component supply position by accelerating and decelerating the transport mechanism. Therefore, the electronic component in the concave portion of the carrier tape may jump out of the concave portion due to the acceleration/deceleration of the conveying mechanism. Therefore, in the electronic component supply device disclosed in Japanese Patent Application Laid-Open No. 2012-18999, it is difficult to increase the transport speed of the component supply tape by the transport mechanism in order to prevent the electronic components from popping out. Here, if it is difficult to increase the transport speed of the component supply tape by the transport mechanism, it becomes difficult to shorten the time until the components are mounted on the board. For this reason, conventionally, it has been desired to reduce the time required to mount an electronic component (component) on a substrate (improve productivity) while preventing the electronic component (component) from popping out.
 この発明は、上記のような課題を解決するためになされたものであり、この発明の1つの目的は、部品の飛び出しを抑制しながら、基板に部品を実装するまでの時間の短縮(生産性の向上)を実現することが可能な部品供給装置および部品実装装置を提供することである。 SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and one object of the present invention is to reduce the time required to mount a component on a board while suppressing the component from popping out (improve productivity). It is an object of the present invention to provide a component feeding device and a component mounting device capable of realizing (improvement of the above).
 この発明の第1の局面による部品供給装置は、部品を収納した収納部が形成されたキャリアテープおよび収納部の上方の開口を覆うカバーテープを有する部品供給テープを、ノズルにより部品を吸着する吸着位置に送るテープ送り部と、ノズルにより部品を吸着させるために、カバーテープを巻き取ることにより剥離するテープ巻取部と、テープ送り部により送られる部品供給テープの減速が開始された後に、テープ巻取部によりカバーテープを巻き取ることによって部品を露出させる制御を開始するように構成されているフィーダ制御部とを備える。 A component supply apparatus according to a first aspect of the present invention is a component supply tape having a carrier tape formed with a storage section containing components and a component supply tape having a cover tape covering an opening above the storage section. a tape feeding unit that feeds the tape to the position, a tape winding unit that peels off the cover tape by winding it in order to attract the component by the nozzle, and a tape after the deceleration of the component supply tape fed by the tape feeding unit is started. a feeder control unit configured to initiate control for exposing the component by winding the cover tape by the winding unit.
 この発明の第1の局面による部品供給装置では、上記のように、テープ送り部により送られる部品供給テープの減速が開始された後に、テープ巻取部によりカバーテープを巻き取ることによって部品を露出させる制御を開始するように構成されているフィーダ制御部を設ける。これにより、テープ巻取部によるカバーテープの巻き取りを吸着位置付近で行うことができるので、カバーテープが取り付けられた状態を吸着位置付近まで維持することができる。したがって、部品が吸着位置に到達するまでにおける部品の飛び出しを抑制することができるので、テープ送り部による部品供給テープのテープ送り速度を上げることができる。その結果、部品の飛び出しを抑制しながら、基板に部品を実装するまでの時間の短縮(生産性の向上)を実現することができる。 In the component supply device according to the first aspect of the present invention, as described above, after the component supply tape fed by the tape feeder starts to decelerate, the tape winder winds up the cover tape to expose the components. A feeder control is provided that is configured to initiate control to cause the As a result, the cover tape can be wound by the tape winding section near the suction position, so that the attached state of the cover tape can be maintained up to the vicinity of the suction position. Therefore, it is possible to prevent the component from jumping out until the component reaches the pick-up position, so that the tape feeding speed of the component supply tape by the tape feeding section can be increased. As a result, it is possible to reduce the time required to mount the component on the board (improve productivity) while preventing the component from popping out.
 上記第1の局面による部品供給装置において、好ましくは、フィーダ制御部は、テープ送り部により送られる部品供給テープの減速が開始された後、吸着位置に合わせて収納部に収納された部品を停止させる前、または、吸着位置に合わせて収納部を停止させた後に、テープ巻取部によりカバーテープを巻き取ることによって部品を露出させる制御を開始するように構成されている。このように構成すれば、テープ送り部により送られる部品供給テープの送り速度が減速に切り替わった時点を避けてカバーテープの巻き取りを開始することができるので、テープ送り部による加減速が落ち着いた状態からテープ巻取部によるカバーテープの巻き取りを行うことができる。その結果、部品供給テープの送り速度を向上させながら、部品が吸着位置に到達するまでにおける部品の飛び出しをより確実に抑制することができる。 In the component supply device according to the first aspect, preferably, the feeder control unit stops the components stored in the storage unit in accordance with the suction position after the component supply tape fed by the tape feed unit starts to decelerate. or after stopping the storage portion in accordance with the suction position, the control for exposing the component is started by winding the cover tape by the tape winding portion. With this configuration, the winding of the cover tape can be started avoiding the time when the feeding speed of the component supply tape fed by the tape feeder is switched to deceleration, so the acceleration/deceleration by the tape feeder is stabilized. From this state, the cover tape can be wound by the tape winding section. As a result, it is possible to more reliably prevent the component from jumping out until the component reaches the pick-up position while improving the feeding speed of the component supply tape.
 この場合、好ましくは、フィーダ制御部は、テープ送り部により送られる部品供給テープの減速が開始された後、吸着位置に合わせて収納部に収納された部品を停止させる前において、テープ送り部により送られる部品供給テープの送り速度が所定速度以下に減速された場合に、テープ巻取部によりカバーテープを巻き取ることによって部品を露出させる制御を開始するように構成されている。このように構成すれば、テープ送り部により送られる部品供給テープの送り速度が減速に切り替わった時点を避けてカバーテープの巻き取りを開始することができるので、テープ送り部による加減速が確実に落ち着いた状態からテープ巻取部によるカバーテープの巻き取りを行うことができる。その結果、部品が吸着位置に到達するまでにおける部品の飛び出しをより一層確実に抑制することができる。 In this case, preferably, the feeder control section causes the tape feeding section to start decelerating the component supply tape fed by the tape feeding section and before stopping the components stored in the storage section in accordance with the suction position. When the feed speed of the fed component supply tape is decelerated to a predetermined speed or less, the tape winding unit is configured to wind up the cover tape to start control for exposing the components. With this configuration, the winding of the cover tape can be started avoiding the time when the feeding speed of the component supply tape fed by the tape feeder is switched to deceleration, so that the acceleration/deceleration by the tape feeder can be ensured. The cover tape can be wound by the tape winding unit in a calm state. As a result, it is possible to more reliably prevent the component from jumping out until the component reaches the pick-up position.
 上記部品供給テープの送り速度が所定速度以下に減速された場合に、テープ巻取部によりカバーテープを巻き取る部品供給装置において、好ましくは、テープ送り部は、送り用モータを含み、フィーダ制御部は、テープ送り部により送られる部品供給テープの減速が開始された後、吸着位置に合わせて収納部に収納された部品を停止させる前において、送り用モータが所定速度に対応する所定回転速度以下に減速されたことに基づいて、テープ巻取部によりカバーテープを巻き取ることによって部品を露出させる制御を開始するように構成されている。このように構成すれば、送り用モータの回転速度を直接的に用いてテープ巻取部によるカバーテープの巻き取り制御を開始させることにより、テープ送り部による加減速が落ち着いたタイミングを正確に取得することができるので、カバーテープの巻き取り制御を適切なタイミングで開始することができる。 In the component supply device for winding the cover tape by the tape winding unit when the supply speed of the component supply tape is reduced to a predetermined speed or less, the tape supply unit preferably includes a feed motor, and the feeder control unit After the deceleration of the component supply tape fed by the tape feeding unit is started, before the components stored in the storage unit are stopped in accordance with the suction position, the feeding motor rotates at a predetermined rotation speed or less corresponding to the predetermined speed. is decelerated to , the control for exposing the component is started by winding the cover tape by the tape winding section. With this configuration, by directly using the rotation speed of the feeding motor to start the control of winding the cover tape by the tape winding section, the timing at which the acceleration/deceleration by the tape feeding section has stabilized can be obtained accurately. Therefore, the cover tape take-up control can be started at an appropriate timing.
 上記第1の局面による部品供給装置において、好ましくは、フィーダ制御部は、テープ送り部により送られる部品供給テープの減速が開始された後、テープ巻取部によりカバーテープを巻き取る際、テープ巻取部により巻き取られるカバーテープの最高速度をテープ送り部により送られる部品供給テープの最高速度よりも大きくする制御を行うように構成されている。このように構成すれば、送り用モータによる部品供給テープの送り量と、巻取用モータによるカバーテープの巻取量とを早期に一致させることができるので、部品供給テープの送りを行った後にカバーテープの巻き取り作業の少なくとも一部を行った場合にも、吸着位置付近でのテープ巻取部によるカバーテープの巻き取りに起因する部品供給作業の遅れを抑制することができる。 In the component supply device according to the first aspect, preferably, the feeder control section controls the tape winding when the tape winding section winds the cover tape after deceleration of the component supply tape fed by the tape feeding section is started. It is configured to perform control so that the maximum speed of the cover tape wound by the take-up portion is higher than the maximum speed of the component supply tape fed by the tape feeding portion. With this configuration, the feeding amount of the component supply tape by the feeding motor and the winding amount of the cover tape by the winding motor can be made to coincide at an early stage. Even when at least part of the cover tape winding operation is performed, it is possible to suppress a delay in the component supply operation due to the winding of the cover tape by the tape winding unit near the suction position.
 上記第1の局面による部品供給装置において、好ましくは、フィーダ制御部は、テープ送り部により送られる部品供給テープの減速が開始される前に、テープ巻取部によりカバーテープを巻き取ることによって上方の開口の部分のカバーテープの一部を剥離させるとともに、テープ送り部により送られる部品供給テープの減速が開始された後に、テープ巻取部によりカバーテープをさらに巻き取ることによって部品を露出させる制御を開始するように構成されている。このように構成すれば、吸着位置付近での巻取用モータによるカバーテープの巻取量を小さくすることができるので、吸着位置付近でのテープ巻取部によるカバーテープの巻き取りに起因する部品供給作業の遅れを抑制することができる。 In the component supply device according to the first aspect, preferably, the feeder control section causes the tape winding section to wind up the cover tape before deceleration of the component supply tape fed by the tape feeding section is started. Part of the cover tape at the opening of the tape is peeled off, and after the deceleration of the component supply tape fed by the tape feeding unit is started, the tape winding unit further winds up the cover tape to expose the component. is configured to start With this configuration, it is possible to reduce the amount of cover tape wound by the winding motor near the suction position. Delays in supply work can be suppressed.
 この場合、好ましくは、テープ送り部により送られる部品供給テープの減速が開始される前にカバーテープの一部を剥離させる剥離量は、テープ送り部により送られる部品供給テープの減速が開始された後にテープ巻取部によりカバーテープを剥離させる剥離量よりも小さい。このように構成すれば、部品供給テープの減速が開始される前における部品の飛び出しが生じないようにすることができるので、吸着位置付近での巻取用モータによるカバーテープの巻取量を小さくしつつ、部品が吸着位置に到達するまでに部品の飛び出しがより確実に生じないようにすることができる。 In this case, preferably, the peeling amount for peeling off a part of the cover tape before deceleration of the component supply tape fed by the tape feeding unit is started is It is smaller than the peeling amount for peeling off the cover tape later by the tape winder. With this configuration, it is possible to prevent the component from jumping out before the deceleration of the component supply tape is started. In addition, it is possible to more reliably prevent the component from popping out before the component reaches the pickup position.
 上記第1の局面による部品供給装置において、好ましくは、吸着位置のテープ送り方向の上流側の近傍に配置されテープ支持部を含み、部品供給テープを押さえるテープ押さえ部をさらに備え、テープ送り部は、部品供給テープに係合することによりテープ送り方向に送るスプロケットと、スプロケットを駆動させる送り用モータと、送り用モータの駆動力をスプロケットに伝達するとともに、内部にガタを有する駆動力伝達機構とを含み、フィーダ制御部は、テープ押さえ部により部品供給テープを押さえた状態で、テープ巻取部によりカバーテープを巻き取る際にテープ支持部を支点にして生じるテープ送り方向の力によるキャリアテープのガタ分の移動を加算することによって予め設定された吸着位置に基づいて、テープ送り部により吸着位置に部品供給テープを送る制御を行うように構成されている。このように構成すれば、テープ送り部により部品を吸着位置に位置ずれなく送ることができるので、より安定した状態で吸着可能な位置に部品をより確実に送ることができる。 The component supply device according to the first aspect preferably further includes a tape holding portion that includes a tape supporting portion that is arranged in the vicinity of the pickup position on the upstream side in the tape feeding direction and that holds down the component feeding tape, wherein the tape feeding portion is: a sprocket that feeds in the tape feeding direction by engaging with the component supply tape, a feeding motor that drives the sprocket, and a driving force transmission mechanism that transmits the driving force of the feeding motor to the sprocket and has play inside. The feeder control unit controls the force in the tape feed direction generated with the tape support unit as a fulcrum when the tape winding unit winds the cover tape in a state where the tape holding unit holds down the component supply tape. Based on the pickup position set in advance by adding the movement for the backlash, the tape feeding section is configured to control feeding of the component supply tape to the pickup position. With this configuration, the tape feeding section can feed the component to the pick-up position without positional deviation, so that the component can be more reliably fed to the position where it can be picked up in a more stable state.
 上記第1の局面による部品供給装置において、好ましくは、吸着位置のテープ送り方向の上流側の近傍に配置されたテープ支持部を含み、部品供給テープを押さえるテープ押さえ部をさらに備え、フィーダ制御部は、テープ支持部よりも吸着位置側でテープ巻取部によりカバーテープを巻き取ることによって部品を露出させる制御を行うように構成されている。このように構成すれば、テープ巻取部によるカバーテープの巻き取りを吸着位置より近い位置で行うことができるので、部品が吸着位置に到達するまでにおける部品の飛び出しをより確実に抑制することができる。 The component supply apparatus according to the first aspect preferably further includes a tape support section arranged in the vicinity of the pickup position on the upstream side in the tape feeding direction, and further comprising a tape holding section for holding down the component supply tape, and a feeder control section. is configured to perform control for exposing the component by winding the cover tape by the tape winding section on the suction position side of the tape supporting section. With this configuration, the cover tape can be wound by the tape winding section at a position closer to the pick-up position, so that it is possible to more reliably prevent the part from jumping out until the part reaches the pick-up position. can.
 この発明の第2の局面による部品実装装置は、部品を吸着するノズルを含むヘッドユニットと、部品を収納した収納部が形成されたキャリアテープおよび収納部の上方の開口を覆うカバーテープを有する部品供給テープを、ノズルにより部品を吸着する吸着位置に送るテープ送り部と、ノズルにより部品を吸着させるために、カバーテープを巻き取ることにより剥離するテープ巻取部とを含む部品供給装置とを備え、部品供給装置は、テープ送り部により送られる部品供給テープの減速が開始された後に、テープ巻取部によりカバーテープを巻き取ることによって部品を露出させる制御を開始するように構成されているフィーダ制御部をさらに含む。 A component mounting apparatus according to a second aspect of the present invention includes a head unit including a nozzle for picking up a component, a carrier tape formed with a storage section containing the component, and a cover tape covering an opening above the storage section. A component supply device including a tape feeding unit that feeds a supply tape to a suction position where a component is sucked by a nozzle, and a tape winding unit that separates a cover tape by winding it so that the component is sucked by the nozzle. , the component supply device is configured to start control for exposing the components by winding the cover tape by the tape winding unit after deceleration of the component supply tape fed by the tape feeding unit is started. Further includes a control unit.
 この発明の第2の局面による部品実装装置では、上記のように、部品供給装置は、テープ送り部により送られる部品供給テープの減速が開始された後に、テープ巻取部によりカバーテープを巻き取ることによって部品を露出させる制御を開始するように構成されているフィーダ制御部を含む。これにより、テープ巻取部によるカバーテープの巻き取りを吸着位置付近で行うことができるので、カバーテープが取り付けられた状態を吸着位置付近まで維持することができる。したがって、部品が吸着位置に到達するまでにおける部品の飛び出しを抑制することができるので、テープ送り部による部品供給テープのテープ送り速度を上げることができる。その結果、部品の飛び出しを抑制しながら、基板に部品を実装するまでの時間の短縮(生産性の向上)を実現することが可能な部品実装装置を得ることができる。 In the component mounting apparatus according to the second aspect of the present invention, as described above, the component supply device causes the tape winding section to wind up the cover tape after the component supply tape fed by the tape feeding section starts to decelerate. a feeder control configured to initiate control to expose the parts by As a result, the cover tape can be wound by the tape winding section near the suction position, so that the attached state of the cover tape can be maintained up to the vicinity of the suction position. Therefore, it is possible to prevent the component from jumping out until the component reaches the pick-up position, so that the tape feeding speed of the component supply tape by the tape feeding section can be increased. As a result, it is possible to obtain a component mounting apparatus capable of reducing the time required to mount a component on a board (improving productivity) while suppressing the component from popping out.
 上記第2の局面による部品実装装置において、好ましくは、部品供給装置は、吸着位置のテープ送り方向の上流側の近傍に配置されたテープ支持部を含み、部品供給テープを押さえるテープ押さえ部をさらに含み、テープ送り部は、部品供給テープに係合することによりテープ送り方向に送るスプロケットと、スプロケットを駆動させる送り用モータと、送り用モータの駆動力をスプロケットに伝達するとともに、内部にガタを有する駆動力伝達機構とを有し、テープ押さえ部により部品供給テープを押さえた状態で、テープ巻取部によりカバーテープを巻き取る際にテープ支持部を支点にして生じるテープ送り方向の力によるキャリアテープのガタ分の移動を加算することによって予め設定されたノズルの目標位置に基づいて、ノズルを移動させる本体制御部をさらに備える。このように構成すれば、ノズルにより部品を位置ずれなく吸着することができるので、部品をより安定した状態で吸着することができる。 In the component mounting apparatus according to the second aspect, the component supply apparatus preferably includes a tape supporting section arranged in the vicinity of the pickup position on the upstream side in the tape feed direction, and further includes a tape holding section for holding down the component supply tape. The tape feeding unit includes a sprocket that feeds the tape in the tape feeding direction by engaging the component supply tape, a feeding motor that drives the sprocket, and transmits the driving force of the feeding motor to the sprocket, and has play inside. and a driving force transmission mechanism, wherein the force in the tape feeding direction is generated with the tape supporting portion as a fulcrum when the cover tape is wound by the tape winding portion while the component supply tape is pressed by the tape pressing portion. It further comprises a body controller for moving the nozzle based on a target position of the nozzle set in advance by adding the movement of the backlash of the tape. With this configuration, the component can be picked up by the nozzle without positional deviation, so that the component can be picked up in a more stable state.
 本発明によれば、上記のように、部品の飛び出しを抑制しながら、基板に部品を実装するまでの時間の短縮(生産性の向上)を実現することができる。 According to the present invention, as described above, it is possible to shorten the time (improve productivity) until the component is mounted on the substrate while suppressing the component from popping out.
第1実施形態の部品実装装置を示した平面図である。1 is a plan view showing a component mounting apparatus according to a first embodiment; FIG. 第1実施形態の部品実装装置を示した側面図である。It is a side view showing the component mounting apparatus of the first embodiment. 第1実施形態の部品実装装置におけるテープフィーダの詳細な構成を示したブロック図である。3 is a block diagram showing the detailed configuration of a tape feeder in the component mounting apparatus of the first embodiment; FIG. 第1実施形態の部品実装装置のテープフィーダを模式的に示した図である。It is the figure which showed typically the tape feeder of the component mounting apparatus of 1st Embodiment. 第1実施形態の部品実装装置の部品供給テープを示した斜視図である。It is a perspective view showing a component supply tape of the component mounting apparatus of the first embodiment. 第1実施形態の部品実装装置のテープフィーダの吸着位置付近を示した平面図である。2 is a plan view showing the vicinity of a suction position of a tape feeder of the component mounting apparatus of the first embodiment; FIG. 第1実施形態の部品実装装置のテープ押さえ部により部品供給テープを押さえた状態を示した断面図である。FIG. 4 is a cross-sectional view showing a state in which a component supply tape is held down by a tape holding portion of the component mounting apparatus according to the first embodiment; 第1実施形態の部品実装装置のテープ送り部およびテープ巻取部のモータ回転速度と時間との関係を示したグラフである。4 is a graph showing the relationship between the motor rotation speeds of the tape feeding section and the tape winding section of the component mounting apparatus of the first embodiment and time. 図8のグラフの時点T1の部品供給テープの状態を模式的に示した図である。FIG. 9 is a diagram schematically showing the state of the component supply tape at time T1 in the graph of FIG. 8; 図8のグラフの時点T2の部品供給テープの状態を模式的に示した図である。FIG. 9 is a diagram schematically showing the state of the component supply tape at time T2 in the graph of FIG. 8; 第1実施形態の部品供給装置においてテープ押さえ部の先端部を支点にして生じるテープ送り方向の力を模式的に示した図である。It is the figure which showed typically the force of the tape feed direction which arises from the front-end|tip part of a tape pressing part in the component supply apparatus of 1st Embodiment as a fulcrum. 第1実施形態の部品供給装置のフィーダ制御部によるカバーテープ巻取処理を示したフローチャートである。It is the flowchart which showed the cover tape winding-up process by the feeder control part of the component supply apparatus of 1st Embodiment. 第2実施形態の部品実装装置におけるテープフィーダの詳細な構成を示したブロック図である。FIG. 9 is a block diagram showing the detailed configuration of a tape feeder in the component mounting apparatus of the second embodiment; 第2実施形態の部品実装装置のテープ送り部およびテープ巻取部のモータ回転速度と時間との関係を示したグラフである。It is the graph which showed the relationship between the motor rotation speed of the tape feeding part and the tape winding part of the component mounting apparatus of 2nd Embodiment, and time. 図14のグラフの時点T1の部品供給テープの状態を模式的に示した図である。FIG. 15 is a diagram schematically showing the state of the component supply tape at time T1 in the graph of FIG. 14; 図14のグラフの時点T2の部品供給テープの状態を模式的に示した図である。FIG. 15 is a diagram schematically showing the state of the component supply tape at time T2 in the graph of FIG. 14; 第2実施形態の部品供給装置のフィーダ制御部によるカバーテープ巻取処理を示したフローチャートである。It is the flowchart which showed the cover tape winding-up process by the feeder control part of the component supply apparatus of 2nd Embodiment. 第3実施形態の部品実装装置におけるテープフィーダの詳細な構成を示したブロック図である。FIG. 11 is a block diagram showing the detailed configuration of a tape feeder in the component mounting apparatus of the third embodiment; 第3実施形態の部品実装装置のテープ送り部およびテープ巻取部のモータ回転速度と時間との関係を示したグラフである。It is the graph which showed the relationship between the motor rotation speed of the tape feeding part and the tape winding part of the component mounting apparatus of 3rd Embodiment, and time. 図19のグラフの時点T1の部品供給テープの状態を模式的に示した図である。20 is a diagram schematically showing the state of the component supply tape at time T1 in the graph of FIG. 19; FIG. 図19のグラフの時点T2の部品供給テープの状態を模式的に示した図である。FIG. 20 is a diagram schematically showing the state of the component supply tape at time T2 in the graph of FIG. 19; 第3実施形態の部品供給装置のフィーダ制御部によるカバーテープ巻取処理を示したフローチャートである。It is the flowchart which showed the cover tape winding-up process by the feeder control part of the component supply apparatus of 3rd Embodiment. 第1~第3実施形態の変形例における部品実装装置を示した模式的な図である。FIG. 5 is a schematic diagram showing a component mounting apparatus in a modified example of the first to third embodiments;
 以下、本発明を具体化した実施形態を図面に基づいて説明する。 An embodiment embodying the present invention will be described below based on the drawings.
[第1実施形態]
 図1~図11を参照して、本発明の第1実施形態による部品実装装置100の構成について説明する。
[First embodiment]
A configuration of a component mounting apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 11. FIG.
 図1に示すように、部品実装装置100は、IC、トランジスタ、コンデンサおよび抵抗などの電子部品Eを基板作業位置Wに配置されたプリント基板などの基板Bに実装するように構成されている。なお、電子部品Eは、請求の範囲の「部品」の一例である。 As shown in FIG. 1, the component mounting apparatus 100 is configured to mount electronic components E such as ICs, transistors, capacitors and resistors on a board B such as a printed board placed at a board working position W. Note that the electronic component E is an example of the "component" in the scope of claims.
 ここで、部品実装装置100において、基板Bを搬送する搬送方向をX1方向とし、基板Bを搬送する搬送方向の逆方向をX2方向とし、X1方向およびX2方向を合わせた方向をX方向とする。また、水平方向のうちのX方向に直交する方向をY方向とし、Y方向の一方をY1方向とし、Y方向の他方をY2方向とする。また、X方向およびY方向に直交する上下方向をZ方向(上下方向)とし、Z方向の一方をZ1方向(上方向)とし、Z方向の他方をZ2方向(下方向)とする。 Here, in the component mounting apparatus 100, the direction in which the board B is transported is defined as the X1 direction, the direction opposite to the direction in which the board B is transported is defined as the X2 direction, and the combined direction of the X1 direction and the X2 direction is defined as the X direction. . Also, of the horizontal directions, the direction orthogonal to the X direction is the Y direction, one of the Y directions is the Y1 direction, and the other Y direction is the Y2 direction. The vertical direction perpendicular to the X and Y directions is defined as the Z direction (vertical direction), one of the Z directions is defined as the Z1 direction (upward), and the other Z direction is defined as the Z2 direction (downward).
 部品実装装置100は、基台1と、フィーダ配置部2と、基板搬送部3と、支持部4と、一対のレール部5と、ヘッドユニット6と、部品認識カメラ7と、基板認識カメラ8と、本体制御部9(図3参照)とを備えている。 The component mounting apparatus 100 includes a base 1 , a feeder placement section 2 , a board transfer section 3 , a support section 4 , a pair of rail sections 5 , a head unit 6 , a component recognition camera 7 and a board recognition camera 8 . and a body control unit 9 (see FIG. 3).
(基台)
 基台1は、部品実装装置100において各構成要素を配置する基礎となる台である。基台1上には、構成要素として、基板搬送部3、レール部5、および、部品認識カメラ7が設けられている。また、基台1内には、本体制御部9が設けられている。また、基台1には、Y方向の両側(Y1方向側およびY2方向側)に、複数のテープフィーダ2aを配置可能なフィーダ配置部2が設けられている。なお、テープフィーダ2aは、請求の範囲の「部品供給装置」の一例である。
(base)
The base 1 is a base on which components are arranged in the component mounting apparatus 100 . A board transfer section 3, a rail section 5, and a component recognition camera 7 are provided on the base 1 as constituent elements. Further, a body control unit 9 is provided inside the base 1 . Further, the base 1 is provided with feeder placement portions 2 on both sides in the Y direction (the Y1 direction side and the Y2 direction side) in which a plurality of tape feeders 2a can be arranged. Note that the tape feeder 2a is an example of a "parts supply device" in the claims.
(テープフィーダ)
 テープフィーダ2aは、基板Bに実装される電子部品Eを供給する部品供給装置である。テープフィーダ2aは、複数の電子部品Eを所定の間隔を隔てて保持した部品供給テープ101を巻き回したリール(図示せず)を保持している。なお、テープフィーダ2aの詳細な構造については後に説明する。
(tape feeder)
The tape feeder 2a is a component supply device that supplies electronic components E to be mounted on the substrate B. As shown in FIG. The tape feeder 2a holds a reel (not shown) wound with a component supply tape 101 holding a plurality of electronic components E at predetermined intervals. A detailed structure of the tape feeder 2a will be described later.
(基板搬送部)
 基板搬送部3は、部品実装装置100の外部から基板Bを搬入し、基板Bを搬送方向(X1方向)に搬送するように構成されている。基板搬送部3は、一対のコンベア31と、一対のコンベア31を回転駆動させるための駆動モータ(図示せず)とを含んでいる。一対のコンベア31の各々は、プーリ(図示せず)と、プーリに掛け回された輪状の搬送ベルトとを有している。本体制御部9は、駆動モータを制御することにより、一対のコンベア31上に載置された基板Bの搬送速度を制御するように構成されている。
(substrate transfer section)
The board transfer unit 3 is configured to load the board B from outside the component mounting apparatus 100 and transfer the board B in the transfer direction (X1 direction). The substrate transfer section 3 includes a pair of conveyors 31 and a drive motor (not shown) for rotating the pair of conveyors 31 . Each of the pair of conveyors 31 has a pulley (not shown) and a loop-shaped conveying belt that is looped around the pulley. The body control unit 9 is configured to control the transport speed of the substrate B placed on the pair of conveyors 31 by controlling the drive motor.
(支持部)
 支持部4は、ヘッドユニット6をX方向に移動可能に支持するように構成されている。具体的には、支持部4は、X方向に延びるボールねじ軸41と、ボールねじ軸41を回転させるX軸モータ42とを含んでいる。ヘッドユニット6には、支持部4のボールねじ軸41と係合するボールナット(図示せず)が設けられている。ヘッドユニット6は、X軸モータ42によりボールねじ軸41が回転されることにより、ボールねじ軸41と係合するボールナットとともに、X方向に移動可能に構成されている。
(support part)
The support portion 4 is configured to support the head unit 6 so as to be movable in the X direction. Specifically, the support portion 4 includes a ball screw shaft 41 extending in the X direction and an X-axis motor 42 that rotates the ball screw shaft 41 . The head unit 6 is provided with a ball nut (not shown) that engages with the ball screw shaft 41 of the support portion 4 . The head unit 6 is configured to be movable in the X direction together with a ball nut that engages with the ball screw shaft 41 when the ball screw shaft 41 is rotated by the X-axis motor 42 .
(レール部)
 一対のレール部5は、支持部4をY方向に移動可能に支持するように構成されている。具体的には、レール部5は、Y方向に延びるボールねじ軸51と、ボールねじ軸51を回転させるY軸モータ52と、ガイドレール53とを含んでいる。支持部4には、レール54のボールねじ軸51と係合するボールナット(図示せず)が設けられている。ガイドレール53は、Y方向に延びている。支持部4は、Y軸モータ52によりボールねじ軸51が回転されることにより、ボールねじ軸51と係合するボールナットとともに、ガイドレール53に沿ってY方向に移動可能に構成されている。
(Rail part)
The pair of rail portions 5 are configured to support the support portion 4 so as to be movable in the Y direction. Specifically, the rail portion 5 includes a ball screw shaft 51 extending in the Y direction, a Y-axis motor 52 that rotates the ball screw shaft 51 , and guide rails 53 . The support portion 4 is provided with a ball nut (not shown) that engages with the ball screw shaft 51 of the rail 54 . The guide rail 53 extends in the Y direction. The support portion 4 is configured to be movable in the Y direction along the guide rail 53 together with the ball nut that engages with the ball screw shaft 51 when the ball screw shaft 51 is rotated by the Y-axis motor 52 .
 このような構成により、ヘッドユニット6は、基台1上を水平面内で(X方向およびY方向に)移動可能に構成されている。 With such a configuration, the head unit 6 is configured to be movable on the base 1 in the horizontal plane (in the X direction and the Y direction).
(ヘッドユニット)
 図1および図2に示すように、ヘッドユニット6は、部品実装用のヘッドユニットであり、基板BのZ1方向(上方)を移動するとともに基板Bに対して所定の作業(実装作業)を行うように構成されている。つまり、ヘッドユニット6は、基板作業位置Wにおいて固定された基板Bに電子部品Eを実装するように構成されている。
(head unit)
As shown in FIGS. 1 and 2, the head unit 6 is a head unit for mounting components, and moves in the Z1 direction (upward) of the board B and performs a predetermined work (mounting work) on the board B. is configured as That is, the head unit 6 is configured to mount the electronic component E on the board B fixed at the board working position W. As shown in FIG.
 具体的には、ヘッドユニット6は、実装ヘッド61と、Z軸モータ62と、R軸モータ(図示せず)とを含んでいる。実装ヘッド61は、電子部品Eを保持するとともに、基板B上の目標位置(目標搭載位置)に電子部品Eを搭載するように構成されている。実装ヘッド61は、X方向に一列に複数(4個)並んで配置されている。 Specifically, the head unit 6 includes a mounting head 61, a Z-axis motor 62, and an R-axis motor (not shown). The mounting head 61 is configured to hold the electronic component E and mount the electronic component E at a target position on the board B (target mounting position). A plurality of (four) mounting heads 61 are arranged in a row in the X direction.
 複数の実装ヘッド61の各々は、圧力発生装置(図示せず)に接続されており、圧力発生装置により生じる負圧によって、先端に取り付けられた(装着された)ノズルNに電子部品Eを保持(吸着)可能に構成されている。また、複数の実装ヘッド61の各々は、圧力発生装置による負圧を正圧に切り換えることによって、電子部品Eを基板Bに実装(搭載)可能に構成されている。 Each of the plurality of mounting heads 61 is connected to a pressure generator (not shown), and the negative pressure generated by the pressure generator holds the electronic component E in the nozzle N attached (mounted) to the tip. (adsorption) is possible. Further, each of the plurality of mounting heads 61 is configured to be able to mount (mount) the electronic component E on the substrate B by switching the negative pressure generated by the pressure generator to positive pressure.
 複数の実装ヘッド61の各々は、Z軸モータ62によりZ方向(上下方向)に移動可能に構成されている。また、複数の実装ヘッド61の各々は、R軸モータにより回転軸回りに回転可能に構成されている。 Each of the plurality of mounting heads 61 is configured to be movable in the Z direction (vertical direction) by a Z-axis motor 62 . Also, each of the plurality of mounting heads 61 is configured to be rotatable around the rotation axis by an R-axis motor.
(部品認識カメラ)
 部品認識カメラ7は、図2に示すように、基板Bへの電子部品Eの実装に先立ってノズルNに保持(吸着)された電子部品Eを撮像する部品撮像用のカメラである。部品認識カメラ7は、基台1上に固定されており、電子部品Eの下方(Z2方向)から、ノズルNに保持(吸着)された電子部品Eを撮像するように構成されている。
(Component recognition camera)
The component recognition camera 7 is a camera for capturing an image of the electronic component E held (adsorbed) by the nozzle N prior to mounting the electronic component E on the substrate B, as shown in FIG. The component recognition camera 7 is fixed on the base 1 and configured to capture an image of the electronic component E held (adsorbed) by the nozzle N from below the electronic component E (Z2 direction).
(基板認識カメラ)
 基板認識カメラ8は、ヘッドユニット6に取り付けられ、基板Bへの電子部品Eの実装に先立って、基板Bの上面に付されたFIマーク(Fiducial Mark(フィデューシャルマーク):図示せず)を撮像するマーク撮像用のカメラである。FIマークは、基板Bの位置を確認するためのマークである。
(PCB recognition camera)
The board recognition camera 8 is attached to the head unit 6, and the FI mark (Fiducial Mark: not shown) put on the upper surface of the board B prior to mounting the electronic component E on the board B. It is a camera for capturing a mark. The FI mark is a mark for confirming the position of the substrate B. FIG.
(本体制御部)
 図3に示すように、本体制御部9は、ノズルNによりテープフィーダ2aから電子部品Eを吸着して基板Bに実装する制御を行うように構成されている。具体的には、本体制御部9は、CPU(Central Processing Unit)91および記憶部92などを含み、部品実装装置100の動作を制御する制御回路である。本体制御部9は、テープフィーダ2a、基板搬送部3、支持部4、レール部5、ヘッドユニット6、部品認識カメラ7および基板認識カメラ8に電気的に接続されている。
(main body control unit)
As shown in FIG. 3, the body control unit 9 is configured to perform control for picking up the electronic component E from the tape feeder 2a by the nozzle N and mounting it on the substrate B. As shown in FIG. Specifically, the body control unit 9 is a control circuit that includes a CPU (Central Processing Unit) 91 and a storage unit 92 and controls the operation of the component mounting apparatus 100 . The body control section 9 is electrically connected to the tape feeder 2a, the board transfer section 3, the support section 4, the rail section 5, the head unit 6, the component recognition camera 7, and the board recognition camera 8. FIG.
 記憶部92は、ROM(Read Only Memory)およびRAM(Random Access Memory)などのメモリを有する記憶装置である。記憶部92には、部品実装プログラムが記憶されている。部品実装プログラムは、基板B上に実装される電子部品Eの実装処理を行うためのプログラムである。 The storage unit 92 is a storage device having memories such as ROM (Read Only Memory) and RAM (Random Access Memory). The storage unit 92 stores a component mounting program. The component mounting program is a program for mounting the electronic component E mounted on the board B. FIG.
(テープフィーダの詳細な構造)
 図3および図4に示すように、テープフィーダ2aは、ヘッドユニット6による電子部品Eの取り出しのための部品保持動作に応じて、部品供給テープ101を送り出すことによりリールを回転させるように構成されている。テープフィーダ2aは、部品供給テープ101を送り出すことにより、吸着位置102(基板作業位置W側の先端部)から電子部品Eを供給するように構成されている。
(Detailed structure of tape feeder)
As shown in FIGS. 3 and 4, the tape feeder 2a is configured to rotate the reel by feeding the component supply tape 101 in accordance with the component holding operation for taking out the electronic component E by the head unit 6. ing. The tape feeder 2a is configured to feed the electronic components E from the suction position 102 (the leading end on the board working position W side) by feeding out the component supply tape 101 .
 具体的には、テープフィーダ2aは、磁石21と、テープ送り部22と、テープ巻取部23と、テープ押さえ部24と、フィーダ制御部25とを含んでいる。磁石21は、吸着位置102において電子部品Eのうち磁性部品(チップ抵抗など)を吸着することにより、電子部品Eを位置決めする。磁石21は、吸着位置102に配置されている。 Specifically, the tape feeder 2 a includes a magnet 21 , a tape feeding section 22 , a tape winding section 23 , a tape holding section 24 and a feeder control section 25 . The magnet 21 positions the electronic component E by attracting a magnetic component (such as a chip resistor) of the electronic component E at the attracting position 102 . The magnet 21 is arranged at the attraction position 102 .
 図4および図5に示すように、部品供給テープ101は、キャリアテープ111と、カバーテープ112とを含んでいる。キャリアテープ111は、電子部品Eを収納する部品収納部111aを有している。部品収納部111aは、電子部品Eの形状に応じた凹形状を有している。キャリアテープ111には、テープ送り部22のスプロケット22aと係合するための係合孔111bがキャリアテープ111の延びる方向に沿って所定の間隔で形成されている。カバーテープ112は、キャリアテープ111を被覆することにより電子部品Eをキャリアテープ111内に保持するように構成されている。カバーテープ112は、キャリアテープ111から剥離されることにより、電子部品Eが外部に露出するように構成されている。 As shown in FIGS. 4 and 5, the component supply tape 101 includes a carrier tape 111 and a cover tape 112. The carrier tape 111 has a component storage portion 111a for storing the electronic component E. As shown in FIG. The component storage portion 111a has a concave shape corresponding to the shape of the electronic component E. As shown in FIG. Engaging holes 111b for engaging with the sprockets 22a of the tape feeding portion 22 are formed in the carrier tape 111 at predetermined intervals along the direction in which the carrier tape 111 extends. The cover tape 112 is configured to hold the electronic component E within the carrier tape 111 by covering the carrier tape 111 . The cover tape 112 is configured such that the electronic component E is exposed to the outside when peeled off from the carrier tape 111 .
〈テープ送り部〉
 図4に示すように、テープ送り部22は、テープ通路26内の部品供給テープ101をノズルNにより電子部品Eを吸着する吸着位置102まで送り出すように構成されている。具体的には、テープ送り部22は、スプロケット22aと、送り用モータ22bと、駆動力伝達機構22cと、送り用回転角度センサ22dとを有している。
<Tape feeder>
As shown in FIG. 4, the tape feeding section 22 is configured to feed the component supply tape 101 in the tape path 26 to a pickup position 102 where the electronic component E is picked up by the nozzle N. As shown in FIG. Specifically, the tape feeding section 22 has a sprocket 22a, a feeding motor 22b, a driving force transmission mechanism 22c, and a feeding rotation angle sensor 22d.
 スプロケット22aは、部品供給テープ101をリールから引き出すとともにキャリアテープ111を送り出すように構成されている。スプロケット22aには、外周部に所定の間隔で複数のピンPnが設けられており、キャリアテープ111の係合孔111bと係合するように構成されている。送り用モータ22bは、スプロケット22aを駆動させるための駆動力を発生させるモータである。駆動力伝達機構22cは、送り用モータ22bの駆動力をスプロケット22aに伝達する。駆動力伝達機構22cは、複数の中間ギヤ122を有している。また、駆動力伝達機構22cは、内部にガタを有している。ガタは、複数の中間ギヤ122同士の間に設定されたバックラッシュである。送り用回転角度センサ22dは、送り用モータ22bの回転角度を計測するエンコーダである。 The sprocket 22a is configured to pull out the component supply tape 101 from the reel and feed out the carrier tape 111. The sprocket 22 a is provided with a plurality of pins Pn at predetermined intervals on the outer periphery, and is configured to engage with the engagement holes 111 b of the carrier tape 111 . The feed motor 22b is a motor that generates driving force for driving the sprocket 22a. The driving force transmission mechanism 22c transmits the driving force of the feed motor 22b to the sprocket 22a. The driving force transmission mechanism 22 c has a plurality of intermediate gears 122 . Further, the driving force transmission mechanism 22c has play inside. Backlash is backlash set between the intermediate gears 122 . The feed rotation angle sensor 22d is an encoder that measures the rotation angle of the feed motor 22b.
〈テープ巻取部〉
 テープ巻取部23は、ノズルNにより電子部品Eを吸着させるために、カバーテープ112を巻き取ることにより剥離するように構成されている。具体的には、テープ巻取部23は、送りローラ23aと、押圧ローラ23bと、巻取用モータ23cと、駆動力伝達機構23dと、巻取用回転角度センサ23eとを有している。
<Tape winder>
The tape take-up part 23 is configured to take up the cover tape 112 so that the electronic component E is sucked by the nozzle N so as to separate the cover tape 112 . Specifically, the tape winding section 23 has a feed roller 23a, a pressure roller 23b, a winding motor 23c, a driving force transmission mechanism 23d, and a winding rotation angle sensor 23e.
 送りローラ23aは、押圧ローラ23bのZ2方向側に配置されている。送りローラ23aは、押圧ローラ23bとともにカバーテープ112を挟み込んだ状態で、巻取用モータ23cの駆動力により回転するように構成されている。これにより、カバーテープ112が、キャリアテープ111から剥離されながらテープ収納部27に送り出される。巻取用モータ23cは、送りローラ23aを駆動させるための駆動力を発生させるモータである。駆動力伝達機構23dは、巻取用モータ23cの駆動力を送りローラ23aに伝達する。駆動力伝達機構23dは、複数の中間ギヤ123を有している。巻取用回転角度センサ23eは、巻取用モータ23cの回転角度を計測するエンコーダである。 The feed roller 23a is arranged on the Z2 direction side of the pressing roller 23b. The feed roller 23a is configured to be rotated by the driving force of the winding motor 23c while sandwiching the cover tape 112 together with the pressure roller 23b. As a result, the cover tape 112 is sent out to the tape housing portion 27 while being separated from the carrier tape 111 . The winding motor 23c is a motor that generates driving force for driving the feed roller 23a. The driving force transmission mechanism 23d transmits the driving force of the winding motor 23c to the feed roller 23a. The driving force transmission mechanism 23 d has a plurality of intermediate gears 123 . The winding rotation angle sensor 23e is an encoder that measures the rotation angle of the winding motor 23c.
〈テープ押さえ部〉
 図6および図7に示すように、テープ押さえ部24は、部品供給テープ101を押さえるように構成されている。テープ押さえ部24は、部品供給テープ101をZ2方向側に押圧している。テープ押さえ部24は、テープ支持部24aを有している。テープ支持部24aは、吸着位置102のテープ送り方向Dの上流側の近傍に配置されている。テープ支持部24aは、ノズルNにより電子部品Eを吸着するための開口28内に配置されている。テープ支持部24aは、テープ巻取部23により巻き取られるカバーテープ112を支持する支点である。
<Tape holder>
As shown in FIGS. 6 and 7 , the tape holding portion 24 is configured to hold down the component supply tape 101 . The tape presser 24 presses the component supply tape 101 in the Z2 direction. The tape holding portion 24 has a tape support portion 24a. The tape support portion 24a is arranged in the vicinity of the suction position 102 on the upstream side in the tape feeding direction D. As shown in FIG. The tape support portion 24a is arranged in an opening 28 for sucking the electronic component E by the nozzle N. As shown in FIG. The tape support portion 24 a is a fulcrum that supports the cover tape 112 wound by the tape winding portion 23 .
〈フィーダ制御部〉
 図3および図7に示すように、フィーダ制御部25は、テープ送り部22により吸着位置102に向かって部品供給テープ101を送る制御を行うとともに、テープ巻取部23によりカバーテープ112を剥離させる制御を行うように構成されている。具体的には、フィーダ制御部25は、CPUおよび記憶部などを含み、テープフィーダ2aの動作を制御する制御回路である。フィーダ制御部25は、送り用モータ22bおよび巻取用モータ23cに電気的に接続されている。
<Feeder controller>
As shown in FIGS. 3 and 7, the feeder control unit 25 controls the feeding of the component supply tape 101 toward the suction position 102 by the tape feeding unit 22, and causes the tape winding unit 23 to peel off the cover tape 112. configured to control. Specifically, the feeder control section 25 is a control circuit that includes a CPU, a storage section, and the like, and controls the operation of the tape feeder 2a. The feeder control section 25 is electrically connected to the feeding motor 22b and the winding motor 23c.
 記憶部は、ROMおよびRAMなどのメモリを有する記憶装置である。記憶部には、部品供給プログラムが記憶されている。部品供給プログラムは、電子部品Eの供給処理を行うためのプログラムである。 The storage unit is a storage device having memories such as ROM and RAM. A component supply program is stored in the storage unit. The component supply program is a program for performing the electronic component E supply process.
 図7および図8に示すように、フィーダ制御部25は、テープ送り部22により部品供給テープ101内の電子部品Eを吸着位置102に送る制御を行うように構成されている。フィーダ制御部25は、テープ送り部22の送り開始時点から時点Taまで部品供給テープ101の送り速度を加速させる制御を行うように構成されている。フィーダ制御部25は、時点Taから時点Tbまで部品供給テープ101の送り速度を一定速度に維持する制御を行うように構成されている。フィーダ制御部25は、時点Tbから時点Tcまで部品供給テープ101の送り速度を減速させる制御を行うように構成されている。フィーダ制御部25は、時点Tcにおいて部品供給テープ101を停止させる制御を行うように構成されている。ここで、図8において、テープ送り部22の送り用モータ22bの回転速度を実線により示す。 As shown in FIGS. 7 and 8, the feeder control section 25 is configured to perform control to feed the electronic component E in the component supply tape 101 to the pickup position 102 by the tape feeding section 22 . The feeder control unit 25 is configured to perform control to accelerate the feed speed of the component supply tape 101 from the feed start time of the tape feed unit 22 to time Ta. The feeder control unit 25 is configured to perform control to keep the feeding speed of the component supply tape 101 constant from time Ta to time Tb. The feeder control unit 25 is configured to reduce the feed speed of the component supply tape 101 from time Tb to time Tc. The feeder control unit 25 is configured to perform control to stop the component supply tape 101 at time Tc. Here, in FIG. 8, the rotational speed of the feeding motor 22b of the tape feeding section 22 is indicated by a solid line.
 図7および図8に示すように、第1実施形態のフィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後(たとえば、図7の時点T1)に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。すなわち、フィーダ制御部25は、吸着位置102よりもテープ送り方向Dの上流側の近傍位置において、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。ここで、図8において、テープ巻取部23の巻取用モータ23cの回転速度を点線により示す。 As shown in FIGS. 7 and 8, the feeder control unit 25 of the first embodiment starts decelerating the component supply tape 101 fed by the tape feeding unit 22 (for example, time T1 in FIG. 7). The control for exposing the electronic component E is started by winding the cover tape 112 by the tape winding section 23 . That is, the feeder control unit 25 starts the control of exposing the electronic component E by winding the cover tape 112 with the tape winding unit 23 at a position in the vicinity of the suction position 102 on the upstream side in the tape feeding direction D. is configured to Here, in FIG. 8, the rotational speed of the winding motor 23c of the tape winding section 23 is indicated by a dotted line.
 具体的には、フィーダ制御部25は、テープ支持部24aよりも吸着位置102側でテープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を行うように構成されている。 Specifically, the feeder control unit 25 is configured to perform control to expose the electronic component E by winding the cover tape 112 by the tape winding unit 23 on the suction position 102 side of the tape support unit 24a. there is
 また、フィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、吸着位置102に合わせて部品収納部111aに収納された電子部品Eを停止させる前に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。 Further, after the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started, the feeder control unit 25, before stopping the electronic component E stored in the component storage unit 111a in accordance with the suction position 102, The control for exposing the electronic component E is started by winding the cover tape 112 by the tape winding section 23 .
 フィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、吸着位置102に合わせて部品収納部111aに収納された電子部品Eを停止させる前において、テープ送り部22により送られる部品供給テープ101の送り速度が所定速度以下に減速された場合に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。 After the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started, the feeder control unit 25 feeds the tape before stopping the electronic components E stored in the component storage unit 111a in accordance with the suction position 102. When the feeding speed of the component supply tape 101 fed by the unit 22 is reduced to a predetermined speed or less, the tape winding unit 23 winds up the cover tape 112 to start the control of exposing the electronic component E. It is
 具体的には、図8に示すように、フィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、吸着位置102に合わせて部品収納部111aに収納された電子部品Eを停止させる前において、送り用モータ22bが所定速度に対応する所定回転速度Rt以下に減速されたことに基づいて、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。ここで、送り用モータ22bの回転速度は、送り用回転角度センサ22dにより計測された送り用モータ22bの回転角度を、フィーダ制御部25において微分することにより算出される。 Specifically, as shown in FIG. 8, the feeder control unit 25 causes the component supply tape 101 fed by the tape feeding unit 22 to be stored in the component storage unit 111a in accordance with the suction position 102 after the deceleration of the component supply tape 101 is started. Before stopping the electronic component E, the cover tape 112 is wound up by the tape winding unit 23 based on the fact that the feeding motor 22b is decelerated to a predetermined rotation speed Rt or less corresponding to the predetermined speed. It is configured to initiate control to expose E. Here, the rotation speed of the feed motor 22b is calculated by differentiating the rotation angle of the feed motor 22b measured by the feed rotation angle sensor 22d in the feeder control section 25. FIG.
 また、図8および図9に示すように、フィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、テープ巻取部23によりカバーテープ112を一気に巻き取る制御を行うように構成されている。 8 and 9, the feeder control unit 25 causes the tape winding unit 23 to wind the cover tape 112 at once after the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started. configured to control.
 すなわち、フィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、テープ巻取部23によりカバーテープ112を巻き取る際、テープ巻取部23により巻き取られるカバーテープ112の最高速度をテープ送り部22により送られる部品供給テープ101の最高速度よりも大きくする制御を行うように構成されている。具体的には、フィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、テープ巻取部23によりカバーテープ112を巻き取る際、テープ巻取部23により部品供給テープ101を巻き取る巻取用モータ23cの最高回転速度Mv1をテープ送り部22により部品供給テープ101を送る送り用モータ22bの最高回転速度Mv2よりも大きくする制御を行うように構成されている。 That is, the feeder control unit 25 causes the tape winding unit 23 to wind the cover tape 112 when the tape winding unit 23 winds the cover tape 112 after deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started. It is configured to perform control so that the maximum speed of the cover tape 112 is higher than the maximum speed of the component supply tape 101 fed by the tape feeder 22 . Specifically, the feeder control unit 25 causes the tape winding unit 23 to take up The tape feeding unit 22 controls the maximum rotational speed Mv1 of the winding motor 23c for winding the component supply tape 101 to be higher than the maximum rotational speed Mv2 of the feeding motor 22b for feeding the component supply tape 101. there is
 ここで、テープ巻取部23の駆動力伝達機構23dのギヤ比と、テープ送り部22の駆動力伝達機構22cのギヤ比とは、巻取用モータ23cの最高回転速度Mv1が送り用モータ22bの最高回転速度Mv2よりも大きい場合には、テープ巻取部23により巻き取られるカバーテープ112の最高速度が、テープ送り部22により送られる部品供給テープ101の最高速度よりも大きくなるように、調整されている。 Here, the gear ratio of the driving force transmission mechanism 23d of the tape winding section 23 and the gear ratio of the driving force transmission mechanism 22c of the tape feeding section 22 are such that the maximum rotational speed Mv1 of the winding motor 23c is equal to that of the feeding motor 22b. so that the maximum speed of the cover tape 112 wound by the tape winder 23 is greater than the maximum speed of the component supply tape 101 fed by the tape feeder 22, adjusted.
 図8および図10に示すように、フィーダ制御部25は、テープ送り部22の部品供給テープ101の送り量D1に基づいて、テープ巻取部23によるカバーテープ112の巻取量D2を追従させて電子部品Eを露出させる制御を行うように構成されている。すなわち、フィーダ制御部25は、送り量D1と巻取量D2とを略一致させる制御を行う世に構成されている。フィーダ制御部25は、送り量D1と巻取量D2とが略一致したことに基づいて、電子部品Eを露出させる制御を終了するように構成されている。ここで、電子部品Eを露出させる制御は、テープ送り部22により電子部品Eが吸着位置102に送られた時点Tcよりも後の時点T2において完了する。 As shown in FIGS. 8 and 10, the feeder control unit 25 causes the winding amount D2 of the cover tape 112 by the tape winding unit 23 to follow the feeding amount D1 of the component supply tape 101 of the tape feeding unit 22. is configured to perform control for exposing the electronic component E. That is, the feeder control section 25 is configured to perform control so that the feed amount D1 and the take-up amount D2 are approximately matched. The feeder control unit 25 is configured to end control for exposing the electronic component E when the feeding amount D1 and the winding amount D2 substantially match. Here, the control for exposing the electronic component E is completed at time T2 after the time Tc at which the electronic component E is sent to the pickup position 102 by the tape feeding section 22 .
 図11に示すように、部品実装装置10では、テープ送り部22による部品供給テープ101の減速中に一気にカバーテープ112が巻き取られる際、駆動力伝達機構22cの内部にガタ分だけ電子部品Eの停止位置103が吸着位置102よりもテープ送り方向D側に位置してしまう場合がある。すなわち、テープ押さえ部24により部品供給テープ101を押さえた状態で、テープ巻取部23によりカバーテープ112を巻き取る力Rfにより、テープ押さえ部24のテープ支持部24aを支点にして生じるテープ送り方向Dの力Sfに起因してキャリアテープ111のガタ分の移動が生じる。ここで、カバーテープ112の巻取量D2は、複数の部品収納部111a同士のピッチよりも大きく設定されている。 As shown in FIG. 11, in the component mounting apparatus 10, when the cover tape 112 is taken up at once while the component supply tape 101 is being decelerated by the tape feeder 22, the electronic component E is placed inside the driving force transmission mechanism 22c by the backlash. stop position 103 may be located on the tape feeding direction D side from the suction position 102 . That is, in a state where the component supply tape 101 is held down by the tape holding portion 24, the force Rf for winding the cover tape 112 by the tape winding portion 23 causes the tape feeding direction generated with the tape supporting portion 24a of the tape holding portion 24 as a fulcrum. Due to the force Sf of D, the carrier tape 111 moves by the backlash. Here, the winding amount D2 of the cover tape 112 is set larger than the pitch between the plurality of component storage portions 111a.
 ガタに起因するズレをなくすため、フィーダ制御部25は、テープ押さえ部24により部品供給テープ101を押さえた状態で、テープ巻取部23によりカバーテープ112を巻き取る際にテープ押さえ部24のテープ支持部24aを支点にして生じるテープ送り方向Dの力Sfによるキャリアテープ111のガタ分の移動を加算することによって予め設定された吸着位置102に基づいて、テープ送り部22により吸着位置102に部品供給テープ101を送る制御を行うように構成されている。具体的には、フィーダ制御部25は、スプロケット22aの複数のピンPnの各々に対して設定された回転制御量に同じオフセット値を予め加算する制御を行うように構成されている。 In order to eliminate the deviation caused by backlash, the feeder control unit 25 causes the tape holding unit 24 to hold down the component supply tape 101 while the tape winding unit 23 winds up the cover tape 112 . Based on the suction position 102 preset by adding the movement of the backlash of the carrier tape 111 due to the force Sf in the tape feeding direction D generated with the support portion 24a as a fulcrum, the component is moved to the suction position 102 by the tape feeding portion 22. It is configured to control feeding of the supply tape 101 . Specifically, the feeder control unit 25 is configured to perform control to preliminarily add the same offset value to the rotation control amount set for each of the plurality of pins Pn of the sprocket 22a.
(カバーテープ巻取処理のフローチャート)
 以下に、図12を参照して、フィーダ制御部25によるカバーテープ巻取処理について説明する。カバーテープ巻取処理は、吸着位置102の直前でカバーテープ112を巻き取る処理である。
(Flowchart of cover tape winding process)
The cover tape winding process by the feeder control unit 25 will be described below with reference to FIG. 12 . The cover tape winding process is a process of winding the cover tape 112 just before the suction position 102 .
 ステップS1において、フィーダ制御部25により、テープ送り部22による部品供給テープ101の送りが開始される。ステップS2において、フィーダ制御部25により、テープ送り部22の送り用モータ22bの回転速度が所定回転速度Rt以下になったか否かが判断される。送り用モータ22bの回転速度が所定回転速度Rt以下であるならばステップS3に進み、送り用モータ22bの回転速度が所定回転速度Rtを超えているのであればステップS2を繰り返す。 In step S1, the feeding of the component supply tape 101 by the tape feeding section 22 is started by the feeder control section 25. In step S2, the feeder control section 25 determines whether or not the rotation speed of the feeding motor 22b of the tape feeding section 22 has become equal to or less than a predetermined rotation speed Rt. If the rotation speed of the feed motor 22b is equal to or less than the predetermined rotation speed Rt, the process proceeds to step S3, and if the rotation speed of the feed motor 22b exceeds the predetermined rotation speed Rt, step S2 is repeated.
 ステップS3において、フィーダ制御部25により、テープ巻取部23によるカバーテープ112の巻き取りが開始される。ステップS4において、フィーダ制御部25により、テープ送り部22による送り量D1とテープ巻取部23による巻取量D2とが略一致している否かが判断される。送り量D1と巻取量D2とが略一致しているのであればカバーテープ巻取処理を終了し、送り量D1と巻取量D2とが略一致していないのであればステップS4を繰り返す。 In step S3, the feeder control unit 25 causes the tape winding unit 23 to start winding the cover tape 112. In step S4, the feeder control section 25 determines whether or not the feeding amount D1 by the tape feeding section 22 and the winding amount D2 by the tape winding section 23 substantially match. If the feeding amount D1 and the winding amount D2 substantially match, the cover tape winding process is terminated. If the feeding amount D1 and the winding amount D2 do not substantially match, step S4 is repeated.
(第1実施形態の効果)
 第1実施形態では、以下のような効果を得ることができる。
(Effect of the first embodiment)
The following effects can be obtained in the first embodiment.
 第1実施形態では、上記のように、テープフィーダ2aは、テープ送り部22により送られる部品供給テープ101の減速が開始された後に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されているフィーダ制御部25を含んでいる。これにより、テープ巻取部23によるカバーテープ112の巻き取りを吸着位置102付近で行うことができるので、カバーテープ112が取り付けられた状態を吸着位置102付近まで維持することができる。したがって、電子部品Eが吸着位置102に到達するまでにおける電子部品Eの飛び出しを抑制することができるので、テープ送り部22による部品供給テープ101のテープ送り速度を上げることができる。この結果、電子部品Eの飛び出しを抑制しながら、基板Bに電子部品Eを実装するまでの時間の短縮(生産性の向上)を実現することができる。また、磁石21により飛び出しを抑制可能なチップ抵抗などの磁性部品だけでなく、磁石21により飛び出しを抑制できない非磁性部品に対しても飛び出しを抑制することができる。この結果、磁性部品および非磁性部品の両方のテープ送り速度を上げることができる。また、磁性部品および非磁性部品の両方の飛び出しを抑制することができるので、磁石21をテープフィーダ2aから無くすことができる。 In the first embodiment, as described above, the tape feeder 2a winds the cover tape 112 by the tape winder 23 after the deceleration of the component supply tape 101 fed by the tape feeder 22 is started. It includes a feeder control 25 configured to initiate controls for exposing part E. As a result, the cover tape 112 can be wound by the tape winding unit 23 near the suction position 102 , so that the attached state of the cover tape 112 can be maintained up to the vicinity of the suction position 102 . Therefore, it is possible to prevent the electronic component E from jumping out until the electronic component E reaches the suction position 102, so that the tape feeding speed of the component supply tape 101 by the tape feeding section 22 can be increased. As a result, it is possible to shorten the time until the electronic component E is mounted on the board B (improve productivity) while suppressing the electronic component E from popping out. Moreover, not only magnetic components such as chip resistors whose protrusion can be suppressed by the magnet 21 but also non-magnetic components whose protrusion cannot be suppressed by the magnet 21 can be suppressed. As a result, tape feed speeds for both magnetic and non-magnetic components can be increased. Moreover, since it is possible to prevent both the magnetic parts and the non-magnetic parts from jumping out, the magnet 21 can be eliminated from the tape feeder 2a.
 また、第1実施形態では、上記のように、フィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、吸着位置102に合わせて部品収納部111aに収納された電子部品Eを停止させる前に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。これにより、テープ送り部22により送られる部品供給テープ101の送り速度が減速に切り替わった時点を避けてカバーテープ112の巻き取りを開始することができるので、テープ送り部22による加減速が落ち着いた状態からテープ巻取部23によるカバーテープ112の巻き取りを行うことができる。この結果、部品供給テープ101の送り速度を向上させながら、電子部品Eが吸着位置102に到達するまでにおける電子部品Eの飛び出しをより確実に抑制することができる。 Further, in the first embodiment, as described above, after the component supply tape 101 fed by the tape feeding unit 22 starts decelerating, the feeder control unit 25 accommodates the component supply tape 101 in the component storage unit 111a in accordance with the suction position 102. Before the electronic component E is stopped, the tape winder 23 winds up the cover tape 112 to start the control of exposing the electronic component E. As a result, the winding of the cover tape 112 can be started by avoiding the point in time when the feeding speed of the component supply tape 101 fed by the tape feeder 22 is switched to deceleration, so that the acceleration/deceleration by the tape feeder 22 is stabilized. From this state, the cover tape 112 can be wound by the tape winding section 23 . As a result, it is possible to more reliably prevent the electronic component E from jumping out until the electronic component E reaches the pickup position 102 while increasing the feeding speed of the component supply tape 101 .
 また、第1実施形態では、上記のように、フィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、吸着位置102に合わせて部品収納部111aに収納された電子部品Eを停止させる前において、テープ送り部22により送られる部品供給テープ101の送り速度が所定速度以下に減速された場合に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。これにより、テープ送り部22により送られる部品供給テープ101の送り速度が減速に切り替わった時点を避けてカバーテープ112の巻き取りを開始することができるので、テープ送り部22による加減速が確実に落ち着いた状態からテープ巻取部23によるカバーテープ112の巻き取りを行うことができる。この結果、電子部品Eが吸着位置102に到達するまでにおける電子部品Eの飛び出しをより一層確実に抑制することができる。 Further, in the first embodiment, as described above, after the component supply tape 101 fed by the tape feeding unit 22 starts decelerating, the feeder control unit 25 accommodates the component supply tape 101 in the component storage unit 111a in accordance with the suction position 102. When the feeding speed of the component supply tape 101 fed by the tape feeder 22 is reduced to a predetermined speed or less before stopping the electronic component E, the tape winder 23 winds up the cover tape 112. It is configured to initiate control for exposing the electronic component E. As a result, the winding of the cover tape 112 can be started avoiding the time when the feeding speed of the component supply tape 101 fed by the tape feeder 22 is switched to deceleration, so that the acceleration/deceleration by the tape feeder 22 is ensured. The cover tape 112 can be wound by the tape winding section 23 in a calm state. As a result, it is possible to more reliably prevent the electronic component E from jumping out until the electronic component E reaches the pickup position 102 .
 また、第1実施形態では、上記のように、テープ送り部22は、送り用モータ22bを含んでいる。フィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、吸着位置102に合わせて部品収納部111aに収納された電子部品Eを停止させる前において、送り用モータ22bが所定速度に対応する所定回転速度Rt以下に減速されたことに基づいて、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。これにより、送り用モータ22bの回転速度を直接的に用いてテープ巻取部23によるカバーテープ112の巻き取り制御を開始させることにより、テープ送り部22による加減速が落ち着いたタイミングを正確に取得することができるので、カバーテープ112の巻き取り制御を適切なタイミングで開始することができる。 Further, in the first embodiment, as described above, the tape feeding section 22 includes the feeding motor 22b. After the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started, the feeder control unit 25 controls the feed control unit 25 before stopping the electronic component E stored in the component storage unit 111 a in accordance with the suction position 102 . When the motor 22b is decelerated to a predetermined rotation speed Rt or less corresponding to the predetermined speed, the tape winder 23 winds up the cover tape 112 to start the control of exposing the electronic component E. ing. Thus, by directly using the rotation speed of the feeding motor 22b to start the control of winding the cover tape 112 by the tape winding section 23, the timing at which the acceleration/deceleration by the tape feeding section 22 has stabilized can be obtained accurately. Therefore, the winding control of the cover tape 112 can be started at an appropriate timing.
 また、第1実施形態では、上記のように、フィーダ制御部25は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、テープ巻取部23によりカバーテープ112を巻き取る際、テープ巻取部23により巻き取られるカバーテープ112の最高速度をテープ送り部22により送られる部品供給テープ101の最高速度よりも大きくする制御を行うように構成されている。これにより、送り用モータ22bによる部品供給テープ101の送り量D1と、巻取用モータ23cによるカバーテープ112の巻取量D2とを早期に一致させることができるので、部品供給テープ101の送りを行った後にカバーテープ112の巻き取り作業の少なくとも一部を行った場合にも、吸着位置102付近でのテープ巻取部23によるカバーテープ112の巻き取りに起因する部品供給作業の遅れを抑制することができる。 Further, in the first embodiment, as described above, the feeder control unit 25 causes the tape winding unit 23 to wind the cover tape 112 after deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started. At this time, control is performed so that the maximum speed of the cover tape 112 wound by the tape winder 23 is higher than the maximum speed of the component supply tape 101 fed by the tape feeder 22 . As a result, the feed amount D1 of the component supply tape 101 by the feed motor 22b and the winding amount D2 of the cover tape 112 by the winding motor 23c can be brought into agreement at an early stage. Even when at least a part of the work of winding the cover tape 112 is performed after the work has been done, the delay in the work of supplying the parts due to the winding of the cover tape 112 by the tape winding part 23 near the suction position 102 is suppressed. be able to.
 また、第1実施形態では、上記のように、テープフィーダ2aは、テープ支持部24aが吸着位置102のテープ送り方向Dの上流側の近傍に配置されており、部品供給テープ101を押さえるテープ押さえ部24を備えている。テープ送り部22は、部品供給テープ101に係合することによりテープ送り方向Dに送るスプロケット22aと、スプロケット22aを駆動させる送り用モータ22bと、送り用モータ22bの駆動力をスプロケット22aに伝達するとともに、内部にガタを有する駆動力伝達機構22cとを含んでいる。フィーダ制御部25は、テープ押さえ部24により部品供給テープ101を押さえた状態で、テープ巻取部23によりカバーテープ112を巻き取る際にテープ押さえ部24のテープ支持部24aを支点にして生じるテープ送り方向Dの力によるキャリアテープ111のガタ分の移動を加算することによって予め設定された吸着位置102に基づいて、テープ送り部22により吸着位置102に部品供給テープ101を送る制御を行うように構成されている。これにより、テープ送り部22により電子部品Eを吸着位置102に位置ずれなく送ることができるので、より安定した状態で吸着可能な位置に電子部品Eをより確実に送ることができる。 Further, in the first embodiment, as described above, the tape support portion 24a of the tape feeder 2a is arranged in the vicinity of the suction position 102 on the upstream side in the tape feeding direction D, and the tape holding portion for holding down the component supply tape 101 is provided. A portion 24 is provided. The tape feeder 22 engages with the component supply tape 101 to feed the sprocket 22a in the tape feeding direction D, a feed motor 22b that drives the sprocket 22a, and transmits the driving force of the feed motor 22b to the sprocket 22a. and a driving force transmission mechanism 22c having backlash inside. The feeder control unit 25 controls the tape holding unit 24 to hold down the component supply tape 101 and the tape winding unit 23 to wind the cover tape 112. The feeder control unit 25 controls the tape support unit 24a of the tape holding unit 24 as a fulcrum. Based on the suction position 102 set in advance by adding the movement of the carrier tape 111 by the force in the feeding direction D, the tape feeding unit 22 controls the feeding of the component supply tape 101 to the suction position 102. It is configured. As a result, the tape feeder 22 can feed the electronic component E to the pickup position 102 without positional deviation, so that the electronic component E can be more reliably fed to a position where it can be picked up in a more stable state.
 また、第1実施形態では、上記のように、テープフィーダ2aは、テープ支持部24aが吸着位置102のテープ送り方向Dの上流側の近傍に配置されており、部品供給テープ101を押さえるテープ押さえ部24を備えている。フィーダ制御部25は、テープ押さえ部24のテープ支持部24aよりも吸着位置102側でテープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を行うように構成されている。これにより、テープ巻取部23によるカバーテープ112の巻き取りを吸着位置102より近い位置で行うことができるので、電子部品Eが吸着位置102に到達するまでにおける電子部品Eの飛び出しをより確実に抑制することができる。 Further, in the first embodiment, as described above, the tape support portion 24a of the tape feeder 2a is arranged in the vicinity of the suction position 102 on the upstream side in the tape feeding direction D, and the tape holding portion for holding down the component supply tape 101 is provided. A portion 24 is provided. The feeder control unit 25 is configured to perform control for exposing the electronic component E by winding the cover tape 112 by the tape winding unit 23 on the suction position 102 side of the tape supporting unit 24a of the tape pressing unit 24. there is As a result, the cover tape 112 can be wound by the tape winding unit 23 at a position closer to the suction position 102, so that the electronic component E can be more reliably protruded until the electronic component E reaches the suction position 102. can be suppressed.
 また、第1実施形態では、上記のように、部品実装装置100は、電子部品Eを吸着するノズルNを含むヘッドユニット6と、電子部品Eを収納した部品収納部111aが形成されたキャリアテープ111および部品収納部111aの上方の開口を覆うカバーテープ112を有する部品供給テープ101を、ノズルNにより電子部品Eを吸着する吸着位置102に送るテープ送り部22と、ノズルNにより電子部品Eを吸着させるために、カバーテープ112を巻き取ることにより剥離するテープ巻取部23とを含むテープフィーダ2aとを備えている。テープフィーダ2aは、テープ送り部22により送られる部品供給テープ101の減速が開始された後に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されているフィーダ制御部25を含んでいる。これにより、電子部品Eの飛び出しを抑制しながら、基板Bに電子部品Eを実装するまでの時間の短縮(生産性の向上)を実現することが可能な部品実装装置を得ることができる。 Further, in the first embodiment, as described above, the component mounting apparatus 100 includes the head unit 6 including the nozzle N for sucking the electronic component E, and the carrier tape in which the component storage section 111a storing the electronic component E is formed. 111 and a component supply tape 101 having a cover tape 112 covering the upper opening of the component storage section 111a, and a tape feeding section 22 that feeds the component supply tape 101 to a suction position 102 where the electronic component E is sucked by the nozzle N; A tape feeder 2a including a tape winding section 23 for peeling off the cover tape 112 by winding it is provided for adsorption. After the tape feeder 22 starts decelerating the component supply tape 101 fed by the tape feeder 22, the tape winder 23 winds up the cover tape 112 so that the electronic components E are exposed. It includes a configured feeder control 25 . As a result, it is possible to obtain a component mounting apparatus capable of reducing the time required to mount the electronic component E on the board B (improving productivity) while suppressing the electronic component E from popping out.
[第2実施形態]
 図13~図16を参照して、第2実施形態による部品実装装置200の構成について説明する。第2実施形態では、第1実施形態とは異なり、部品供給テープ101が吸着位置102に停止した後にカバーテープ112が巻き取られる。なお、第2実施形態では、第1実施形態の同じ構成については、詳細な説明を省略する。
[Second embodiment]
The configuration of a component mounting apparatus 200 according to the second embodiment will be described with reference to FIGS. 13 to 16. FIG. In the second embodiment, unlike the first embodiment, the cover tape 112 is wound after the component supply tape 101 stops at the suction position 102 . In addition, in the second embodiment, detailed description of the same configuration as in the first embodiment is omitted.
 図13に示すように、第2実施形態の部品実装装置200は、基台1と、フィーダ配置部2と、基板搬送部3と、支持部4と、一対のレール部5と、ヘッドユニット6と、部品認識カメラ7と、基板認識カメラ8と、本体制御部9とを備えている。また、基台1には、Y方向の両側(Y1方向側およびY2方向側)に、複数のテープフィーダ202aを配置可能なフィーダ配置部2が設けられている。なお、テープフィーダ202aは、請求の範囲の「部品供給装置」の一例である。 As shown in FIG. 13, the component mounting apparatus 200 of the second embodiment includes a base 1, a feeder placement section 2, a substrate transfer section 3, a support section 4, a pair of rail sections 5, a head unit 6, and a , a component recognition camera 7 , a board recognition camera 8 , and a main body control section 9 . In addition, the base 1 is provided with feeder placement portions 2 on both sides in the Y direction (Y1 direction side and Y2 direction side) in which a plurality of tape feeders 202a can be arranged. Note that the tape feeder 202a is an example of a "parts supply device" in the claims.
(テープフィーダの詳細な構造)
 テープフィーダ202aは、ヘッドユニット6による電子部品Eの取り出しのための部品保持動作に応じて、部品供給テープ101を送り出すことによりリールを回転させるように構成されている。テープフィーダ202aは、部品供給テープ101を送り出すことにより、吸着位置102(基板作業位置W側の先端部)から電子部品Eを供給するように構成されている。
(Detailed structure of tape feeder)
The tape feeder 202a is configured to rotate the reel by feeding the component supply tape 101 in accordance with the component holding operation for taking out the electronic component E by the head unit 6 . The tape feeder 202a is configured to feed the electronic components E from the suction position 102 (the leading end on the board working position W side) by feeding out the component supply tape 101 .
 具体的には、テープフィーダ202aは、磁石21と、テープ送り部22と、テープ巻取部23と、テープ押さえ部24と、フィーダ制御部225とを含んでいる。 Specifically, the tape feeder 202 a includes a magnet 21 , a tape feeding section 22 , a tape winding section 23 , a tape pressing section 24 and a feeder control section 225 .
〈フィーダ制御部〉
 フィーダ制御部225は、テープ送り部22により吸着位置102に向かって部品供給テープ101を送る制御を行うとともに、テープ巻取部23によりカバーテープ112を剥離させる制御を行うように構成されている。
<Feeder controller>
The feeder control unit 225 is configured to control feeding of the component supply tape 101 toward the suction position 102 by the tape feeding unit 22 and to peel off the cover tape 112 by the tape winding unit 23 .
 図14および図15に示すように、第2実施形態のフィーダ制御部225は、テープ送り部22により送られる部品供給テープ101が停止した後(たとえば、図14の時点T1)に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。すなわち、フィーダ制御部225は、吸着位置102よりもテープ送り方向Dの下流側の近傍位置において、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。 As shown in FIGS. 14 and 15, the feeder control unit 225 of the second embodiment performs tape winding after the component supply tape 101 fed by the tape feeding unit 22 stops (for example, time T1 in FIG. 14). By winding up the cover tape 112 by the unit 23, the control for exposing the electronic component E is started. That is, the feeder control unit 225 starts control to expose the electronic component E by winding the cover tape 112 with the tape winding unit 23 at a position near the suction position 102 on the downstream side in the tape feeding direction D. is configured to
 具体的には、フィーダ制御部225は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、吸着位置102に合わせて部品収納部111aを停止させた後に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。 Specifically, the feeder control unit 225 stops the component storage unit 111a in accordance with the suction position 102 after the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started, and then the tape winding unit 23 is configured to start control for exposing the electronic component E by winding the cover tape 112 .
 図14および図16に示すように、フィーダ制御部225は、テープ送り部22の部品供給テープ101の送り量D1に基づいて、テープ巻取部23によるカバーテープ112の巻取量D2を追従させて電子部品Eを露出させる制御を行うように構成されている。すなわち、フィーダ制御部225は、送り量D1と巻取量D2とを略一致させる制御を行うように構成されている。フィーダ制御部225は、送り量D1と巻取量D2とが略一致したことに基づいて、電子部品Eを露出させる制御を終了(たとえば、図14の時点T2)するように構成されている。 As shown in FIGS. 14 and 16, the feeder control unit 225 causes the winding amount D2 of the cover tape 112 by the tape winding unit 23 to follow the feeding amount D1 of the component supply tape 101 of the tape feeding unit 22. is configured to perform control for exposing the electronic component E. In other words, the feeder control section 225 is configured to perform control such that the feeding amount D1 and the winding amount D2 are substantially matched. The feeder control unit 225 is configured to end control for exposing the electronic component E (for example, at time T2 in FIG. 14) when the feeding amount D1 and the winding amount D2 substantially match.
(カバーテープ巻取処理のフローチャート)
 以下に、図17を参照して、フィーダ制御部225によるカバーテープ巻取処理について説明する。カバーテープ巻取処理は、吸着位置102に電子部品Eが停止した後にカバーテープ112を巻き取る処理である。
(Flowchart of cover tape winding process)
The cover tape winding process by the feeder control unit 225 will be described below with reference to FIG. 17 . The cover tape winding process is a process of winding the cover tape 112 after the electronic component E stops at the suction position 102 .
 ステップS1、ステップS3およびステップS4は、それぞれ、第1実施形態のステップS1、ステップS3およびステップS4と同じであるので、説明を省略する。ステップS202において、フィーダ制御部225により、テープ送り部22による部品供給テープ101の送りが停止されたか否かが判断される。送り用モータ22bによる部品供給テープ101の送りが停止したならばステップS3に進み、送り用モータ22bによる部品供給テープ101の送りが停止していないならばステップS202を繰り返す。 Steps S1, S3, and S4 are the same as steps S1, S3, and S4 in the first embodiment, respectively, so descriptions thereof will be omitted. In step S202, the feeder control section 225 determines whether or not the feeding of the component supply tape 101 by the tape feeding section 22 has been stopped. If the feed of the component supply tape 101 by the feed motor 22b is stopped, the process proceeds to step S3, and if the feed of the component supply tape 101 by the feed motor 22b is not stopped, step S202 is repeated.
(第2実施形態の効果)
 第2実施形態では、上記第1実施形態と同様に、テープフィーダ202aは、テープ送り部22により送られる部品供給テープ101の減速が開始された後に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されているフィーダ制御部225を含んでいる。これにより、電子部品Eの飛び出しを抑制しながら、基板Bに電子部品Eを実装するまでの時間の短縮(生産性の向上)を実現することができる。
(Effect of Second Embodiment)
In the second embodiment, as in the first embodiment, the tape feeder 202a winds the cover tape 112 by the tape winder 23 after the deceleration of the component supply tape 101 fed by the tape feeder 22 is started. It includes a feeder control 225 configured to initiate control to expose electronic component E by picking it up. As a result, it is possible to shorten the time until the electronic component E is mounted on the board B (improve productivity) while suppressing the electronic component E from popping out.
 また、第2実施形態では、上記のように、フィーダ制御部225は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、吸着位置102に合わせて部品収納部111aに収納された電子部品Eを停止させる前、または、吸着位置102に合わせて部品収納部111aを停止させた後に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。これにより、テープ送り部22による加減速が落ち着いた状態からテープ巻取部23によるカバーテープ112の巻き取りを行うことができるので、電子部品Eが吸着位置102に到達するまでにおける部品収納部111a内での電子部品Eの飛び出しをより確実に抑制することができる。なお、第2実施形態のその他の効果は、上記第1実施形態の効果と同様である。 Further, in the second embodiment, as described above, after the component supply tape 101 fed by the tape feeding unit 22 starts to decelerate, the feeder control unit 225 accommodates the component supply tape 101 in the component storage unit 111a in accordance with the suction position 102. Before stopping the electronic component E, or after stopping the component storage unit 111a in accordance with the suction position 102, the tape winding unit 23 winds the cover tape 112 to expose the electronic component E. configured to start. As a result, the cover tape 112 can be wound by the tape winder 23 in a state where the acceleration/deceleration by the tape feeder 22 has stabilized. It is possible to more reliably suppress the electronic component E from protruding inside. Other effects of the second embodiment are the same as those of the first embodiment.
[第3実施形態]
 図18~図21を参照して、第3実施形態による部品実装装置300の構成について説明する。第3実施形態では、第1実施形態とは異なり、複数回に分けてカバーテープ112が剥離される。なお、第3実施形態では、第1実施形態の構成と同じ構成については、説明を省略する。
[Third Embodiment]
The configuration of a component mounting apparatus 300 according to the third embodiment will be described with reference to FIGS. 18 to 21. FIG. In the third embodiment, unlike the first embodiment, the cover tape 112 is separated in multiple times. In addition, in the third embodiment, the description of the same configuration as that of the first embodiment is omitted.
 図17に示すように、第3実施形態の部品実装装置300は、基台1と、フィーダ配置部2と、基板搬送部3と、支持部4と、一対のレール部5と、ヘッドユニット6と、部品認識カメラ7と、基板認識カメラ8と、本体制御部9とを備えている。また、基台1には、Y方向の両側(Y1方向側およびY2方向側)に、複数のテープフィーダ302aを配置可能なフィーダ配置部2が設けられている。なお、テープフィーダ302aは、請求の範囲の「部品供給装置」の一例である。 As shown in FIG. 17, a component mounting apparatus 300 of the third embodiment includes a base 1, a feeder placement section 2, a substrate transfer section 3, a support section 4, a pair of rail sections 5, a head unit 6, and a , a component recognition camera 7 , a board recognition camera 8 , and a main body control section 9 . Further, the base 1 is provided with feeder placement portions 2 on both sides in the Y direction (the Y1 direction side and the Y2 direction side) in which a plurality of tape feeders 302a can be arranged. It should be noted that the tape feeder 302a is an example of a "parts supply device" in the claims.
(テープフィーダの詳細な構造)
 テープフィーダ302aは、ヘッドユニット6による電子部品Eの取り出しのための部品保持動作に応じて、部品供給テープ101を送り出すことによりリールを回転させるように構成されている。テープフィーダ302aは、部品供給テープ101を送り出すことにより、吸着位置102(基板作業位置W側の先端部)から電子部品Eを供給するように構成されている。
(Detailed structure of tape feeder)
The tape feeder 302a is configured to rotate the reel by feeding the component supply tape 101 in accordance with the component holding operation for taking out the electronic component E by the head unit 6 . The tape feeder 302a is configured to feed the electronic components E from the suction position 102 (the leading end on the board working position W side) by feeding out the component supply tape 101 .
 具体的には、テープフィーダ302aは、磁石21と、テープ送り部22と、テープ巻取部23と、テープ押さえ部24と、フィーダ制御部325とを含んでいる。 Specifically, the tape feeder 302 a includes a magnet 21 , a tape feeding section 22 , a tape winding section 23 , a tape pressing section 24 and a feeder control section 325 .
〈フィーダ制御部〉
 フィーダ制御部325は、テープ送り部22により吸着位置102に向かって部品供給テープ101を送る制御を行うとともに、テープ巻取部23によりカバーテープ112を剥離させる制御を行うように構成されている。
<Feeder controller>
The feeder control unit 325 is configured to control feeding of the component supply tape 101 toward the suction position 102 by the tape feeding unit 22 and to peel off the cover tape 112 by the tape winding unit 23 .
 図19および図20に示すように、第3実施形態のフィーダ制御部325は、テープ送り部22により送られる部品供給テープ101の減速が開始される前に、テープ巻取部23によりカバーテープ112を巻き取ることによって上方の開口の部分のカバーテープ112の一部を剥離(たとえば、図19の時点T1)させるように構成されている。ここで、テープ送り部22により送られる部品供給テープ101の減速が開始される前にカバーテープ112の一部を剥離させる剥離量D21は、テープ送り部22により送られる部品供給テープ101の減速が開始された後にテープ巻取部23によりカバーテープ112を剥離させる剥離量D22よりも小さい。なお、剥離量D21は、部品収納部111a内の電子部品Eのテープ送り方向側の端部が視認可能な位置までカバーテープ112を剥離させる量であることが好ましい。フィーダ制御部325は、予め設定された剥離量D21に基づいて、テープ巻取部23の巻取用モータ23cの速度を制御するように構成されている。 As shown in FIGS. 19 and 20, the feeder control unit 325 of the third embodiment causes the tape winding unit 23 to feed the cover tape 112 before deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started. is wound up to peel off a portion of the cover tape 112 in the upper opening portion (for example, at time T1 in FIG. 19). Here, the peeling amount D21 for peeling off a part of the cover tape 112 before the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started is It is smaller than the peeling amount D22 for peeling the cover tape 112 by the tape winding unit 23 after the start. The peeling amount D21 is preferably an amount by which the cover tape 112 is peeled off to a position where the end portion of the electronic component E in the component storage portion 111a in the tape feeding direction can be visually recognized. The feeder control section 325 is configured to control the speed of the winding motor 23c of the tape winding section 23 based on the peeling amount D21 set in advance.
 また、フィーダ制御部325は、テープ送り部22により送られる部品供給テープ101の減速が開始された後に、テープ巻取部23によりカバーテープ112をさらに巻き取る(たとえば、図19の時点T2)ことによって電子部品Eを露出させる制御を開始するように構成されている。すなわち、フィーダ制御部325は、送り量D1と、減速開始後の巻取量D2に減速開始前の巻取量D2を加算した距離とを略一致させる制御を行うように構成されている。フィーダ制御部325は、送り量D1と、減速開始後の巻取量D2に減速開始前の巻取量D2を加算した距離とを略一致させたことに基づいて、電子部品Eを露出させる制御を終了するように構成されている。 Further, the feeder control unit 325 causes the tape winding unit 23 to further wind the cover tape 112 after the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started (for example, time T2 in FIG. 19). is configured to start control for exposing the electronic component E by . That is, the feeder control unit 325 is configured to perform control to substantially match the feeding amount D1 and the distance obtained by adding the winding amount D2 before the start of deceleration to the winding amount D2 after the start of deceleration. The feeder control unit 325 performs control for exposing the electronic component E based on the fact that the feeding amount D1 and the distance obtained by adding the winding amount D2 before the start of deceleration to the winding amount D2 after the start of deceleration are substantially matched. is configured to end the
(カバーテープ巻取処理のフローチャート)
 以下に、図22を参照して、フィーダ制御部325によるカバーテープ巻取処理について説明する。カバーテープ巻取処理は、複数回に分けてカバーテープ112を剥離する処理である。
(Flowchart of cover tape winding process)
The cover tape winding process by the feeder control unit 325 will be described below with reference to FIG. 22 . The cover tape winding process is a process of peeling off the cover tape 112 in a plurality of times.
 ステップS1において、フィーダ制御部325により、部品供給テープ101の送りが開始される。ステップS302において、フィーダ制御部325により、カバーテープ112の剥離が開始される。ステップS303において、フィーダ制御部325により、カバーテープ112が所定巻取量以上巻き取られた否かが判断される。カバーテープ112が所定巻取量以上巻き取られた場合にはステップS304に進み、カバーテープ112が所定巻取量以上巻き取られていない場合にはステップS303を繰り返す。 In step S1, the feeder control unit 325 starts feeding the component supply tape 101. In step S<b>302 , the feeder control unit 325 starts peeling the cover tape 112 . In step S303, the feeder control unit 325 determines whether or not the cover tape 112 has been wound up by a predetermined winding amount or more. When the cover tape 112 has been wound up by the predetermined winding amount or more, the process proceeds to step S304, and when the cover tape 112 has not been wound up by the predetermined winding amount or more, step S303 is repeated.
 ステップS304において、フィーダ制御部325により、カバーテープ112の巻き取りが停止される。ステップS305において、フィーダ制御部325により、部品供給テープ101の送り速度が所定速度以下か否かが判断される。送り速度が所定速度以下の場合はステップS306に進み、送り速度が所定速度以下でない場合はステップS305を繰り返す。ステップS306において、フィーダ制御部325により、カバーテープ112の巻き取りが開始される。ステップS307において、送り量D1と、減速開始後の巻取量D2に減速開始前の巻取量D2を加算した距離とが略一致したか否かが判断される。略一致した場合にはカバーテープ巻取処理を終了し、略一致していない場合にはステップS307を繰り返す。 In step S304, the winding of the cover tape 112 is stopped by the feeder control unit 325. In step S305, the feeder control unit 325 determines whether or not the feed speed of the component supply tape 101 is equal to or lower than a predetermined speed. If the feed speed is equal to or less than the predetermined speed, the process proceeds to step S306, and if the feed speed is not equal to or less than the predetermined speed, step S305 is repeated. In step S<b>306 , the feeder control unit 325 starts winding the cover tape 112 . In step S307, it is determined whether or not the feed amount D1 and the distance obtained by adding the winding amount D2 before deceleration start to the winding amount D2 after deceleration start substantially match. If they substantially match, the cover tape winding process is terminated, and if they do not substantially match, step S307 is repeated.
(第3実施形態の効果)
 第3実施形態では、以下のような効果を得ることができる。
(Effect of the third embodiment)
The following effects can be obtained in the third embodiment.
 第3実施形態では、上記第1実施形態と同様に、テープフィーダ302aは、テープ送り部22により送られる部品供給テープ101の減速が開始された後に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されているフィーダ制御部325を含んでいる。これにより、電子部品Eの飛び出しを抑制しながら、基板Bに電子部品Eを実装するまでの時間の短縮(生産性の向上)を実現することができる。 In the third embodiment, as in the first embodiment, the tape feeder 302a winds the cover tape 112 by the tape winder 23 after the deceleration of the component supply tape 101 fed by the tape feeder 22 is started. It includes a feeder control 325 configured to initiate control to expose electronic component E by picking it up. As a result, it is possible to shorten the time until the electronic component E is mounted on the board B (improve productivity) while suppressing the electronic component E from popping out.
 また、第3実施形態では、上記のように、フィーダ制御部325は、テープ送り部22により送られる部品供給テープ101の減速が開始される前に、テープ巻取部23によりカバーテープ112を巻き取ることによって上方の開口の部分のカバーテープ112の一部を剥離させるとともに、テープ送り部22により送られる部品供給テープ101の減速が開始された後に、テープ巻取部23によりカバーテープ112をさらに巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている。これにより、吸着位置102付近での巻取用モータ23cによるカバーテープ112の巻取量D2を小さくすることができるので、吸着位置102付近でのテープ巻取部23によるカバーテープ112の巻き取りに起因する部品供給作業の遅れを抑制することができる。 Further, in the third embodiment, as described above, the feeder control unit 325 causes the tape winding unit 23 to wind the cover tape 112 before deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started. By removing the cover tape 112 from the upper opening portion, part of the cover tape 112 is peeled off. It is configured to start control for exposing the electronic component E by winding it. As a result, the winding amount D2 of the cover tape 112 by the winding motor 23c near the suction position 102 can be reduced. It is possible to suppress the delay in the component supply work caused by this.
 また、第3実施形態では、上記のように、テープ送り部22により送られる部品供給テープ101の減速が開始される前にカバーテープ112の一部を剥離させる剥離量D21は、テープ送り部22により送られる部品供給テープ101の減速が開始された後にテープ巻取部23によりカバーテープ112を剥離させる剥離量D22よりも小さい。これにより、部品供給テープ101の減速が開始される前における電子部品Eの飛び出しが生じないようにすることができるので、吸着位置102付近での巻取用モータ23cによるカバーテープ112の巻取量D2を小さくしつつ、電子部品Eが吸着位置102に到達するまでに電子部品Eの飛び出しがより確実に生じないようにすることができる。なお、第3実施形態のその他の効果は、上記第1実施形態の効果と同様である。 Further, in the third embodiment, as described above, the peeling amount D21 for peeling off a part of the cover tape 112 before the deceleration of the component supply tape 101 fed by the tape feeding unit 22 is started is set by the tape feeding unit 22 is less than the peeling amount D22 for peeling off the cover tape 112 by the tape winder 23 after the deceleration of the component supply tape 101 fed by is started. As a result, it is possible to prevent the electronic component E from jumping out before deceleration of the component supply tape 101 is started. While reducing D2, it is possible to more reliably prevent the electronic component E from popping out before the electronic component E reaches the pickup position 102 . Other effects of the third embodiment are the same as those of the first embodiment.
[変形例]
 なお、今回開示された実施形態は、すべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した実施形態の説明ではなく請求の範囲によって示され、さらに請求の範囲と均等の意味および範囲内でのすべての変更(変形例)が含まれる。
[Modification]
It should be noted that the embodiments disclosed this time should be considered as examples and not restrictive in all respects. The scope of the present invention is indicated by the scope of the claims rather than the above description of the embodiments, and includes all modifications (modifications) within the scope and meaning equivalent to the scope of the claims.
 たとえば、上記第1~第3実施形態では、フィーダ制御部25(225、325)は、キャリアテープ111のガタ分の移動を加算することによって予め設定された吸着位置102に基づいて、テープ送り部22により吸着位置102に部品供給テープ101を送る制御を行うように構成されている例を示したが、本発明はこれに限られない。本発明では、図23に示すように、本体制御部9が、テープ押さえ部24により部品供給テープ101を押さえた状態で、テープ巻取部23によりカバーテープ112を巻き取る際にテープ支持部24aを支点にして生じるテープ送り方向Dの力Sfによるキャリアテープ111のガタ分の移動を加算することによって予め設定されたノズルNの目標位置に基づいて、ノズルNを移動させてもよい。これにより、ノズルNにより電子部品Eを位置ずれなく吸着することができるので、電子部品Eをより安定した状態で吸着することができる。 For example, in the above-described first to third embodiments, the feeder control unit 25 (225, 325) controls the tape feeding unit based on the adsorption position 102 preset by adding the movement of the backlash of the carrier tape 111. 22 is configured to control feeding of the component supply tape 101 to the pickup position 102, but the present invention is not limited to this. In the present invention, as shown in FIG. 23, the body control unit 9 presses the component supply tape 101 with the tape holding unit 24, and when the tape winding unit 23 winds up the cover tape 112, the tape supporting unit 24a is pressed. The nozzle N may be moved based on the preset target position of the nozzle N by adding the movement of the backlash of the carrier tape 111 caused by the force Sf in the tape feed direction D generated with . As a result, the electronic component E can be picked up by the nozzle N without positional deviation, so that the electronic component E can be picked up in a more stable state.
 また、上記第1~第3実施形態では、フィーダ制御部25(225、325)は、スプロケット22aの複数のピンPnの各々に対して1つのオフセット値を予め加算する制御を行うように構成されている例を示したが、本発明はこれに限られない。本発明では、フィーダ制御部は、カバーテープの巻き取りタイミングを変更する制御を行う場合のスプロケットの複数のピンの各々に対して個別のオフセット値を設定した偏心補正テーブルに基づいて、オフセット値を予め加算する制御を行うように構成されていてもよい。 Further, in the first to third embodiments, the feeder control section 25 (225, 325) is configured to perform control to preliminarily add one offset value to each of the plurality of pins Pn of the sprocket 22a. Although an example is shown, the present invention is not limited to this. According to the present invention, the feeder control unit adjusts the offset value based on the eccentricity correction table in which individual offset values are set for each of the plurality of pins of the sprocket when performing control to change the winding timing of the cover tape. It may be configured to perform pre-addition control.
 また、第2実施形態では、フィーダ制御部225は、テープ巻取部23により部品供給テープ101を巻き取る巻取用モータ23cの最高回転速度Mv1をテープ送り部22により部品供給テープ101を送る送り用モータ22bの最高回転速度Mv2よりも大きくする制御を行うように構成されている例を示したが、本発明はこれに限られない。本発明では、フィーダ制御部は、テープ巻取部により部品供給テープを巻き取る巻取用モータの最高回転速度をテープ送り部により部品供給テープを送る送り用モータの最高回転速度よりも小さくしてもよい。 Further, in the second embodiment, the feeder control unit 225 sets the maximum rotation speed Mv1 of the winding motor 23c for winding the component supply tape 101 by the tape winding unit 23 to Although an example is shown in which control is performed to increase the rotational speed Mv2 of the motor 22b, the present invention is not limited to this. In the present invention, the feeder control section makes the maximum rotational speed of the winding motor for winding the component supply tape by the tape winding section lower than the maximum rotational speed of the feeding motor for feeding the component supply tape by the tape feeding section. good too.
 また、上記第1~第3実施形態では、フィーダ制御部25(225、325)は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、吸着位置102に合わせて部品収納部111aに収納された電子部品Eを停止させる前において、テープ送り部22により送られる部品供給テープ101の送り速度が所定回転速度Rt以下に減速された場合に、テープ巻取部23によりカバーテープ112を巻き取ることによって電子部品Eを露出させる制御を開始するように構成されている例を示したが、本発明はこれに限られない。本発明では、フィーダ制御部は、テープ送り部により送られる部品供給テープの減速が開始された後、所定時間経過した場合に、テープ巻取部によりカバーテープを巻き取ることによって部品を露出させる制御を開始するように構成されていてもよい。 In addition, in the above-described first to third embodiments, the feeder control unit 25 (225, 325) causes the component supply tape 101 fed by the tape feeding unit 22 to start decelerating, and then adjusts the component supply tape 101 to the pickup position 102 to store the component. When the feeding speed of the component supply tape 101 fed by the tape feeder 22 is reduced to a predetermined rotational speed Rt or less before the electronic components E housed in the portion 111a are stopped, the tape winder 23 rolls the cover tape. Although an example is shown in which control for exposing the electronic component E is started by winding up the wire 112, the present invention is not limited to this. In the present invention, the feeder control section controls the tape winding section to wind up the cover tape to expose the components when a predetermined time elapses after the deceleration of the component supply tape fed by the tape feeding section is started. may be configured to initiate
 また、上記第3実施形態では、減速開始前の剥離量D21は、減速開始後の剥離量D22よりも小さい例を示したが、本発明はこれに限られない。本発明では、減速開始前の剥離量と、減速開始後の剥離量とは略同じであってもよい。 Further, in the above-described third embodiment, an example is shown in which the amount of peeling D21 before the start of deceleration is smaller than the amount of peeling D22 after the start of deceleration, but the present invention is not limited to this. In the present invention, the peeling amount before the start of deceleration and the peeling amount after the start of deceleration may be substantially the same.
 第1~第3実施形態では、フィーダ制御部25(225、325)は、キャリアテープ111のガタ分の移動を加算することによって予め設定された吸着位置102に基づいて、テープ送り部22により吸着位置102に部品供給テープ101を送る制御を行うように構成されている例を示したが、本発明はこれに限られない。本発明では、フィーダ制御部は、キャリアテープのガタ分の移動を吸着位置に加算することなく、テープ送り部により部品供給テープをガタ分だけ戻す制御を行うように構成されていてもよい。 In the first to third embodiments, the feeder control unit 25 (225, 325) sucks the tape feed unit 22 based on the suction position 102 preset by adding the movement of the backlash of the carrier tape 111. Although an example configured to control feeding of the component supply tape 101 to the position 102 has been shown, the present invention is not limited to this. In the present invention, the feeder control section may be configured to perform control so that the tape feeding section returns the component supply tape by the amount of play without adding the movement of the carrier tape by the amount of play to the pickup position.
 また、上記第1~第3実施形態では、フィーダ制御部25(225、325)は、テープ送り部22により送られる部品供給テープ101の減速が開始された後、テープ巻取部23によりカバーテープ112を巻き取る際、テープ巻取部23によりカバーテープ112を巻き取る巻取用モータ23cの最高回転速度Mv1をテープ送り部22により部品供給テープ101を送る送り用モータ22bの最高回転速度Mv2よりも大きくする制御を行うように構成されている例を示したが、本発明はこれに限られない。本発明では、巻取用モータの最高回転速度が送り用モータの最高回転速度よりも小さい場合でも、テープ巻取部の駆動力伝達機構のギヤ比と、テープ送り部の駆動力伝達機構のギヤ比とを調整することにより、テープ巻取部により巻き取られるカバーテープの最高速度が、テープ送り部により送られる部品供給テープの最高速度よりも大きくなればよい。 In addition, in the above-described first to third embodiments, the feeder control section 25 (225, 325) causes the tape winding section 23 to start decelerating the component supply tape 101 fed by the tape feeding section 22, and then the cover tape. 112, the maximum rotational speed Mv1 of the winding motor 23c for winding the cover tape 112 by the tape winding section 23 is calculated from the maximum rotational speed Mv2 of the feeding motor 22b for feeding the component supply tape 101 by the tape feeding section 22. Although an example is shown in which control is performed so as to increase , the present invention is not limited to this. In the present invention, even if the maximum rotation speed of the winding motor is lower than the maximum rotation speed of the feeding motor, the gear ratio of the driving force transmission mechanism of the tape winding section and the gear of the driving force transmission mechanism of the tape feeding section By adjusting the ratio, the maximum speed of the cover tape wound by the tape winder should be higher than the maximum speed of the component supply tape fed by the tape feeder.
 また、上記第1~第3実施形態では、説明の便宜上、フィーダ制御部25(225、325)の制御処理を、処理フローに沿って順番に処理を行うフロー駆動型のフローチャートを用いて説明した例について示したが、本発明はこれに限られない。本発明では、フィーダ制御部の制御処理を、イベント単位で処理を実行するイベント駆動型(イベントドリブン型)の処理により行ってもよい。この場合、完全なイベント駆動型で行ってもよいし、イベント駆動およびフロー駆動を組み合わせて行ってもよい。 Further, in the above-described first to third embodiments, for convenience of explanation, the control processing of the feeder control unit 25 (225, 325) has been explained using a flow-driven flowchart in which processing is performed in order along the processing flow. Although provided by way of example, the invention is not so limited. In the present invention, the control processing of the feeder control section may be performed by event-driven processing that executes processing on an event-by-event basis. In this case, it may be completely event-driven, or a combination of event-driven and flow-driven.
 2a、202a、302a テープフィーダ
 6 ヘッドユニット
 9 本体制御部
 22 テープ送り部
 22a スプロケット
 22b 送り用モータ
 22c 駆動力伝達機構
 23 テープ巻取部
 23c 巻取用モータ
 24 テープ押さえ部
 24a 先端部
 25、225、325 フィーダ制御部
 100、200、300 部品実装装置
 101 部品供給テープ
 102 吸着位置
 111 キャリアテープ
 111a 部品収納部(収納部)
 112 カバーテープ
 E 電子部品(部品)
 D21、D22 剥離量
 N ノズル
 Rt 所定回転速度
2a, 202a, 302a tape feeder 6 head unit 9 body control section 22 tape feeding section 22a sprocket 22b feeding motor 22c driving force transmission mechanism 23 tape winding section 23c winding motor 24 tape pressing section 24a tip section 25, 225, 325 feeder control unit 100, 200, 300 component mounter 101 component supply tape 102 suction position 111 carrier tape 111a component storage unit (storage unit)
112 Cover tape E Electronic parts (parts)
D21, D22 Peeling amount N Nozzle Rt Predetermined rotational speed

Claims (11)

  1.  部品を収納した収納部が形成されたキャリアテープおよび前記収納部の上方の開口を覆うカバーテープを有する部品供給テープを、ノズルにより前記部品を吸着する吸着位置に送るテープ送り部と、
     前記ノズルにより前記部品を吸着させるために、前記カバーテープを巻き取ることにより剥離するテープ巻取部と、
     前記テープ送り部により送られる前記部品供給テープの減速が開始された後に、前記テープ巻取部により前記カバーテープを巻き取ることによって前記部品を露出させる制御を開始するように構成されているフィーダ制御部とを備える、部品供給装置。
    a tape feeding unit that feeds a component supply tape having a carrier tape in which a storage section containing a component is formed and a cover tape that covers an opening above the storage section to a suction position where the component is suctioned by a nozzle;
    a tape winding unit that peels off the cover tape by winding it so that the component is sucked by the nozzle;
    A feeder control configured to start control for exposing the component by winding the cover tape by the tape winder after the deceleration of the component supply tape fed by the tape feeding unit is started. A component supply device, comprising:
  2.  前記フィーダ制御部は、前記テープ送り部により送られる前記部品供給テープの減速が開始された後、前記吸着位置に合わせて前記収納部に収納された前記部品を停止させる前、または、前記吸着位置に合わせて前記収納部を停止させた後に、前記テープ巻取部により前記カバーテープを巻き取ることによって前記部品を露出させる制御を開始するように構成されている、請求項1に記載の部品供給装置。 The feeder control unit is configured to operate after the deceleration of the component supply tape fed by the tape feeding unit is started, before stopping the components stored in the storage unit in accordance with the suction position, or at the suction position. 2. The component supply according to claim 1, wherein the control for exposing the component is started by winding the cover tape by the tape winding unit after stopping the storage unit in accordance with Device.
  3.  前記フィーダ制御部は、前記テープ送り部により送られる前記部品供給テープの減速が開始された後、前記吸着位置に合わせて前記収納部に収納された前記部品を停止させる前において、前記テープ送り部により送られる前記部品供給テープの送り速度が所定速度以下に減速された場合に、前記テープ巻取部により前記カバーテープを巻き取ることによって前記部品を露出させる制御を開始するように構成されている、請求項2に記載の部品供給装置。 The feeder control section controls the tape feeding section after the deceleration of the component supply tape fed by the tape feeding section is started and before stopping the components stored in the storage section in accordance with the suction position. When the feed speed of the component supply tape fed by the tape winding unit is decelerated to a predetermined speed or less, the tape winding unit winds up the cover tape to start control for exposing the components. 3. The component supply device according to claim 2.
  4.  前記テープ送り部は、送り用モータを含み、
     前記フィーダ制御部は、前記テープ送り部により送られる前記部品供給テープの減速が開始された後、前記吸着位置に合わせて前記収納部に収納された前記部品を停止させる前において、前記送り用モータが前記所定速度に対応する所定回転速度以下に減速されたことに基づいて、前記テープ巻取部により前記カバーテープを巻き取ることによって前記部品を露出させる制御を開始するように構成されている、請求項3に記載の部品供給装置。
    The tape feeding unit includes a feeding motor,
    The feeder control unit controls the feed motor to stop the components stored in the storage unit in accordance with the suction position after deceleration of the component supply tape fed by the tape feed unit is started. is decelerated to a predetermined rotation speed or less corresponding to the predetermined speed, the tape winding unit winds up the cover tape to start control to expose the component. The component supply device according to claim 3.
  5.  前記フィーダ制御部は、前記テープ送り部により送られる前記部品供給テープの減速が開始された後、前記テープ巻取部により前記カバーテープを巻き取る際、前記テープ巻取部により巻き取られる前記カバーテープの最高速度を前記テープ送り部により送られる前記部品供給テープの最高速度よりも大きくする制御を行うように構成されている、請求項1~4のいずれか1項に記載の部品供給装置。 The feeder control section controls the cover to be wound by the tape winding section when the cover tape is wound by the tape winding section after deceleration of the component supply tape fed by the tape feeding section is started. 5. The component supply device according to claim 1, wherein control is performed so that the maximum speed of the tape is higher than the maximum speed of the component supply tape fed by the tape feeder.
  6.  前記フィーダ制御部は、前記テープ送り部により送られる前記部品供給テープの減速が開始される前に、前記テープ巻取部により前記カバーテープを巻き取ることによって前記上方の開口の部分の前記カバーテープの一部を剥離させるとともに、前記テープ送り部により送られる前記部品供給テープの減速が開始された後に、前記テープ巻取部により前記カバーテープをさらに巻き取ることによって前記部品を露出させる制御を開始するように構成されている、請求項1~5のいずれか1項に記載の部品供給装置。 The feeder control section causes the tape winding section to wind up the cover tape before the deceleration of the component supply tape fed by the tape feeding section is started, so that the cover tape is removed from the upper opening portion. and after the deceleration of the component supply tape fed by the tape feeding unit is started, the tape winding unit further winds up the cover tape, thereby starting control to expose the component. 6. The component supply device according to any one of claims 1 to 5, which is configured to
  7.  前記テープ送り部により送られる前記部品供給テープの減速が開始される前に前記カバーテープの一部を剥離させる剥離量は、前記テープ送り部により送られる前記部品供給テープの減速が開始された後に前記テープ巻取部により前記カバーテープを剥離させる剥離量よりも小さい、請求項6に記載の部品供給装置。 The peeling amount for peeling off a part of the cover tape before deceleration of the component supply tape fed by the tape feeding unit is started is 7. The component supply device according to claim 6, wherein said tape take-up unit is smaller than the amount of peeling of said cover tape.
  8.  前記吸着位置のテープ送り方向の上流側の近傍に配置されたテープ支持部を含み、前記部品供給テープを押さえるテープ押さえ部をさらに備え、
     前記テープ送り部は、
     前記部品供給テープに係合することによりテープ送り方向に送るスプロケットと、
     前記スプロケットを駆動させる送り用モータと、
     前記送り用モータの駆動力を前記スプロケットに伝達するとともに、内部にガタを有する駆動力伝達機構とを含み、
     前記フィーダ制御部は、前記テープ押さえ部により前記部品供給テープを押さえた状態で、前記テープ巻取部により前記カバーテープを巻き取る際に前記テープ支持部を支点にして生じるテープ送り方向の力による前記キャリアテープの前記ガタ分の移動を加算することによって予め設定された前記吸着位置に基づいて、前記テープ送り部により前記吸着位置に前記部品供給テープを送る制御を行うように構成されている、請求項1~7のいずれか1項に記載の部品供給装置。
    further comprising a tape holding portion that holds down the component supply tape, the tape holding portion including a tape supporting portion arranged in the vicinity of the upstream side of the suction position in the tape feeding direction;
    The tape feeding unit
    a sprocket that feeds in the tape feed direction by engaging with the component supply tape;
    a feed motor for driving the sprocket;
    a driving force transmission mechanism that transmits the driving force of the feed motor to the sprocket and has a backlash inside;
    The feeder control unit controls the force generated in the tape feed direction with the tape support unit as a fulcrum when the cover tape is wound by the tape winding unit while the component supply tape is held down by the tape holding unit. Based on the suction position set in advance by adding the movement of the carrier tape for the looseness, the tape feeding unit is configured to control sending the component supply tape to the suction position. The component supply device according to any one of claims 1 to 7.
  9.  前記吸着位置のテープ送り方向の上流側の近傍に配置されたテープ支持部を含み、前記部品供給テープを押さえるテープ押さえ部をさらに備え、
     前記フィーダ制御部は、前記テープ支持部よりも前記吸着位置側で前記テープ巻取部により前記カバーテープを巻き取ることによって前記部品を露出させる制御を行うように構成されている、請求項1~8のいずれか1項に記載の部品供給装置。
    further comprising a tape holding portion that holds down the component supply tape, the tape holding portion including a tape supporting portion arranged in the vicinity of the upstream side of the suction position in the tape feeding direction;
    The feeder control unit is configured to perform control for exposing the component by winding the cover tape by the tape winding unit on the suction position side of the tape support unit. 9. The component supply device according to any one of 8.
  10.  部品を吸着するノズルを含むヘッドユニットと、
     前記部品を収納した収納部が形成されたキャリアテープおよび前記収納部の上方の開口を覆うカバーテープを有する部品供給テープを、前記ノズルにより前記部品を吸着する吸着位置に送るテープ送り部と、前記ノズルにより前記部品を吸着させるために、前記カバーテープを巻き取ることにより剥離するテープ巻取部とを含む部品供給装置とを備え、
     前記部品供給装置は、前記テープ送り部により送られる前記部品供給テープの減速が開始された後に、前記テープ巻取部により前記カバーテープを巻き取ることによって前記部品を露出させる制御を開始するように構成されているフィーダ制御部をさらに含む、部品実装装置。
    a head unit including a nozzle for picking up a component;
    a tape feeding unit that feeds a component supply tape having a carrier tape formed with a storage section containing the component and a cover tape covering an opening above the storage section to a suction position where the component is suctioned by the nozzle; a component supply device including a tape winding unit that separates the cover tape by winding it so that the component is sucked by the nozzle;
    The component supply device starts control for exposing the component by winding the cover tape by the tape winding unit after the component supply tape fed by the tape feeding unit starts to decelerate. A component mounting apparatus, further comprising a configured feeder control.
  11.  前記部品供給装置は、前記吸着位置のテープ送り方向の上流側の近傍に配置されたテープ支持部を含み、前記部品供給テープを押さえるテープ押さえ部をさらに含み、
     前記テープ送り部は、
     前記部品供給テープに係合することによりテープ送り方向に送るスプロケットと、
     前記スプロケットを駆動させる送り用モータと、
     前記送り用モータの駆動力を前記スプロケットに伝達するとともに、内部にガタを有する駆動力伝達機構とを有し、
     前記テープ押さえ部により前記部品供給テープを押さえた状態で、前記テープ巻取部により前記カバーテープを巻き取る際に前記テープ支持部を支点にして生じるテープ送り方向の力による前記キャリアテープの前記ガタ分の移動を加算することによって予め設定された前記ノズルの目標位置に基づいて、前記ノズルを移動させる本体制御部をさらに備える、請求項10に記載の部品実装装置。
    The component supply device includes a tape support section arranged near the upstream side of the pickup position in the tape feeding direction, and further includes a tape holding section that holds down the component supply tape,
    The tape feeding unit
    a sprocket that feeds in the tape feed direction by engaging with the component supply tape;
    a feed motor for driving the sprocket;
    a driving force transmission mechanism that transmits the driving force of the feed motor to the sprocket and has a backlash inside;
    The backlash of the carrier tape caused by a force in the tape feeding direction generated with the tape supporting portion as a fulcrum when the cover tape is wound by the tape winding portion while the component supply tape is pressed by the tape pressing portion. 11. The component mounting apparatus according to claim 10, further comprising a main body control unit that moves said nozzle based on a target position of said nozzle that is preset by adding minutes of movement.
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JP2012018999A (en) * 2010-07-07 2012-01-26 Juki Corp Electronic component supply apparatus
JP2020017767A (en) * 2015-03-18 2020-01-30 株式会社Fuji Feeder device

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