WO2022206403A1 - 一种用于表面波抑制的电磁带隙结构和贴片天线 - Google Patents

一种用于表面波抑制的电磁带隙结构和贴片天线 Download PDF

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WO2022206403A1
WO2022206403A1 PCT/CN2022/081435 CN2022081435W WO2022206403A1 WO 2022206403 A1 WO2022206403 A1 WO 2022206403A1 CN 2022081435 W CN2022081435 W CN 2022081435W WO 2022206403 A1 WO2022206403 A1 WO 2022206403A1
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electromagnetic bandgap
unit
patch
electromagnetic
surface wave
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PCT/CN2022/081435
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English (en)
French (fr)
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姜山
尤肖虎
陈智慧
赵涤燹
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网络通信与安全紫金山实验室
成都天锐星通科技有限公司
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Publication of WO2022206403A1 publication Critical patent/WO2022206403A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0478—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with means for suppressing spurious modes, e.g. cross polarisation

Definitions

  • the present application relates to the technical field of electromagnetic radiation, and in particular, to an electromagnetic bandgap structure for surface wave suppression and an electromagnetic bandgap-loaded patch antenna.
  • the electromagnetic bandgap structure is a special kind of artificial periodic electromagnetic material. Specific electromagnetic effects are achieved with periodically arranged cells.
  • the EBG structure is mainly divided into two types.
  • the first type is Bragg scattering type. This type of band gap is caused by Bragg scattering.
  • the periodic arrangement of units causes the periodic distribution of the scattered wave phase, so that at a specific frequency and direction, each The unit scattered waves are superposed in antiphase and cancel each other to form a band gap.
  • the second type of local resonance type this type uses the resonance characteristics of the periodic unit itself to form a band gap.
  • the second type of EBG structure is more compact than the first type of EBG structure, so it has also received more extensive attention and research.
  • the early resonance-type electromagnetic bandgap structure is a mushroom-type structure proposed by D.F. Sievenpiper et al., but this structure has a through hole in the center of the cell, which increases the processing complexity and cost.
  • F.R. Yang et al. proposed a coplanar electromagnetic bandgap structure, which introduced periodic LC resonant units on a plane to form a bandgap, but the structure still has the problem of large size.
  • embodiments of the present application provide an electromagnetic bandgap structure for surface wave suppression and an electromagnetic bandgap loaded patch antenna.
  • Embodiments of the present application provide an electromagnetic bandgap structure for surface wave suppression, wherein,
  • the electromagnetic bandgap structure has a coplanar electromagnetic bandgap metal pattern, the unit structure of the coplanar electromagnetic bandgap metal pattern is a rectangle, and there are patch parasitic units at the unit corners of the unit structure; wherein, each patch The parasitic unit is rotationally symmetrical;
  • the four sides of the unit structure are metal finger-shaped structures, wherein the metal finger-shaped structures are located between the corners of the unit;
  • a rectangular patch is arranged in the center of the unit structure; the rectangular patch is a rectangular patch in the shape of an annular groove.
  • the metal interdigital structure is rotationally symmetrical.
  • the metal interdigitated fingers are located between square patch parasitic cells on four sides of the cell.
  • the electromagnetic bandgap structure is loaded on a grounded dielectric substrate for suppressing surface wave propagation.
  • the first devices are periodically arranged on the dielectric substrate according to the unit size.
  • the electromagnetic bandgap structures are periodically arranged above the grounded dielectric substrate according to the cell size.
  • the center of the unit structure is a rectangular patch with a square ring groove.
  • the center of the unit structure is a rectangular patch with a circular ring groove.
  • An embodiment of the present application provides a patch antenna loaded with an electromagnetic bandgap, wherein the electromagnetic bandgap structure is loaded in the middle of the patch antenna coupled with the E-plane.
  • An embodiment of the present application provides a patch antenna loaded with an electromagnetic bandgap, wherein the electromagnetic bandgap structure is periodically arranged among the elements of the array antenna according to the element size.
  • the electromagnetic bandgap structure for surface wave suppression and the patch antenna loaded by the electromagnetic bandgap include: the electromagnetic bandgap structure has a coplanar electromagnetic band A gap metal pattern, the unit structure of the coplanar electromagnetic band gap metal pattern is a rectangle, and there are patch parasitic units at the unit corners of the unit structure; wherein, each patch parasitic unit is rotationally symmetrical; the unit structure has four sides It is a metal finger-shaped structure, wherein the metal finger-shaped structure is located between the corners of the unit; the center of the unit structure is provided with a rectangular patch; the rectangular patch is a rectangular patch with an annular groove shape.
  • the electromagnetic band gap structure provided by the embodiments of the present application avoids the metallized through holes used in the existing electromagnetic band gap, realizes a coplanar design, and reduces the difficulty of processing and production.
  • FIG. 1 is a schematic structural diagram of an electromagnetic bandgap structure provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of an electromagnetic bandgap structure provided by another embodiment of the present application.
  • FIG. 3 is a schematic diagram of a reflection phase curve of an electromagnetic bandgap structure provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a dispersion curve of an electromagnetic bandgap structure provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a surface wave above a grounded dielectric plate according to an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a transmission coefficient curve of a grounded dielectric plate loaded with no electromagnetic bandgap structure according to an embodiment of the present application
  • FIG. 7 is a schematic diagram of a grounded dielectric plate periodically loaded with an electromagnetic bandgap structure according to an embodiment of the present application
  • FIG. 8 is a schematic diagram of a transmission coefficient curve of a grounded dielectric plate loaded by an electromagnetic bandgap structure according to an embodiment of the present application
  • FIG. 9 is a schematic diagram of a 1*2 microstrip patch array provided by an embodiment of the present application.
  • FIG. 10 is a schematic diagram of an S-parameter curve of a 1*2 microstrip patch array provided by an embodiment of the application;
  • FIG. 11 is a schematic diagram of a 1*2 microstrip patch array loaded with an electromagnetic bandgap structure according to an embodiment of the application;
  • FIG. 12 is a schematic diagram of an S-parameter curve of a 1*2 microstrip patch array loaded with an electromagnetic bandgap structure according to an embodiment of the application;
  • FIG. 1 is a schematic structural diagram of an electromagnetic bandgap structure provided by an embodiment of the application; as shown in FIG. 1 , the electromagnetic bandgap structure includes:
  • the electromagnetic bandgap structure has a coplanar electromagnetic bandgap metal pattern, the unit structure of the coplanar electromagnetic bandgap metal pattern is a rectangle, and there are patch parasitic units at the unit corners of the unit structure; wherein, each patch The parasitic unit is rotationally symmetrical;
  • the four sides of the unit structure are metal finger-shaped structures, wherein the metal finger-shaped structures are located between the corners of the unit;
  • a rectangular patch is arranged in the center of the unit structure; the rectangular patch is a rectangular patch in the shape of an annular groove.
  • the electromagnetic bandgap structure (Uniplanar Compact EBG, UC-EBG) provided in the embodiment of the present application is provided with a coplanar metal pattern, such as a coplanar electromagnetic bandgap metal pattern, and the unit structure of the coplanar electromagnetic bandgap metal pattern
  • the unit structure of the coplanar electromagnetic bandgap metal pattern is a rectangle or a square, and there are several patch parasitic units at the corners of the unit structure, such as four square patch parasitic units at the corners of the unit; Among them, each patch parasitic unit is rotationally symmetrical, that is, by rotating any one of the square patches by 90 degrees, 180 degrees and 270 degrees, the other three square patch units can be obtained; the metal finger-shaped structure is located between the corners of the unit.
  • the metal finger-shaped structure is located between the parasitic units of the square patch on the four sides of the unit; the center of the unit structure is provided with a rectangular patch; the rectangular patch is a rectangular patch with an annular groove shape (that is, a closed shape). piece.
  • a special resonant circuit is formed by etching gaps at multiple locations on the metal patch, so as to realize the miniaturized design of the electromagnetic bandgap structure.
  • Periodically loading the proposed electromagnetic bandgap structure on the grounded dielectric plate can significantly suppress the surface waves propagating on the grounded dielectric plate. Because the electromagnetic bandgap structure has the characteristics of wide frequency band, miniaturization and coplanarity, it can be used in various application scenarios such as wide frequency bandwidth angle scanning phased array decoupling, suppressing surface wave loss, and improving transmission line efficiency at a lower cost.
  • the electromagnetic band gap structure is provided with a coplanar electromagnetic band gap metal pattern, and the unit structure of the coplanar electromagnetic band gap metal pattern is a rectangle, and the There are several patch parasitic units at the unit corners of the unit structure; wherein, each patch parasitic unit is rotationally symmetrically arranged; the four sides of the unit structure are metal finger-shaped structures, wherein the metal finger-shaped structures are located on the side of the unit between the corners; a rectangular patch is arranged in the center of the unit structure; the rectangular patch is a rectangular patch with an annular groove shape.
  • the electromagnetic bandgap structure provided by the embodiments of the present application avoids the metallized through holes used in the existing electromagnetic bandgap, realizes a coplanar design, reduces the difficulty of processing and production, and can be used to suppress surface waves transmitted on a grounded dielectric plate.
  • the metal interposition finger structure is rotationally symmetrical.
  • the metal interdigital structure is rotationally symmetrical. For example, by rotating any one of the metal interdigital structures by 90 degrees, 180 degrees, and 270 degrees, the other three metal interdigital structures can be obtained. shape structure.
  • the metal interdigitated finger structure is located between the square patch parasitic units on the four sides of the unit.
  • the cell structure is a square, and there is a square patch parasitic cell at each corner of the cell, so that the metal finger-shaped structure is placed in the middle of the four sides of the unit, that is, the metal finger
  • the shape structure is located between the square patch parasitic cells on the four sides of the cell.
  • the electromagnetic bandgap structure includes an upper metal pattern and a lower ground dielectric substrate.
  • the method further includes: loading the electromagnetic bandgap structure on a grounded dielectric substrate for suppressing the propagation of surface waves.
  • the method further includes: periodically arranging the electromagnetic bandgap structures above the grounded dielectric substrate according to the unit size.
  • the electromagnetic bandgap structures are periodically arranged above the dielectric substrate according to the unit size, which can significantly suppress the propagation of surface waves.
  • the center of the unit structure is a rectangular patch with a square ring groove.
  • the center of the unit structure is a rectangular patch with a square ring groove.
  • the resonant frequency is reduced, and the miniaturization is further achieved.
  • the center of the unit structure is a rectangular patch with a circular ring groove.
  • the key to realizing the broadband miniaturized coplanar design of the electromagnetic bandgap structure provided by the embodiment of the present application lies in the design of the electromagnetic bandgap metal pattern, the unit structure of which is a square, and there are four square patch parasitic units at the corners of the unit;
  • the parasitic unit is rotationally symmetrical, that is, by rotating any one of the square patches by 90 degrees, 180 degrees, and 270 degrees, the other three square patch units can be obtained;
  • the middle of the four sides of the unit is a metal finger-shaped structure; the above-mentioned metal finger-shaped
  • the structure is rotationally symmetrical, that is, by rotating any one of the metal finger-shaped structures by 90 degrees, 180 degrees and 270 degrees, the other three metal finger-shaped structures can be obtained;
  • the center of the unit is a rectangular patch with a square ring groove.
  • the dielectric substrate used in the examples of this application is Rogers 4350B, and the unit period is 2.5 mm.
  • the proposed electromagnetic bandgap structure is periodically arranged above the dielectric substrate according to the unit size, which can significantly suppress the propagation of surface waves.
  • the designed electromagnetic bandgap unit is placed within the periodic boundary, and the Floquet port is used for excitation, and the curve of its reflection phase with frequency is obtained by simulation.
  • the frequency range of the reflection phase between ⁇ 90 degrees is 6.45GHz-11.21GHz, this frequency range can approximately characterize the frequency range of the electromagnetic bandgap structure.
  • the eigenmode simulation of the electromagnetic bandgap structure is further carried out to obtain the dispersion curves of its TM mode (mode 1) and TE mode (mode 2), and there is an obvious band gap between the two dispersion curves. , in this frequency range, both surface wave modes are cut off and cannot propagate.
  • Figure 5 shows the propagation of surface waves on a grounded dielectric plate.
  • 7 is the Rogers 4350B dielectric board
  • 8 is the ground plane
  • 9 and 10 are two wave ports, which are used to excite surface waves.
  • Significant surface wave propagation can be observed on the center plane 11 perpendicular to the dielectric plate.
  • Surface waves are confined to the surface of the medium to propagate, and surface waves are usually undesirable because such waves usually cause problems such as transmission loss, parasitic radiation, and isolation degradation, which seriously degrade system performance.
  • Figure 6 shows the transmission characteristic curve of the surface wave when the electromagnetic bandgap structure is not loaded. It can be seen that the surface wave can propagate almost losslessly in the grounded dielectric plate at this time. If it is not suppressed, it will greatly interfere. system performance.
  • the proposed electromagnetic bandgap structure 12 is periodically loaded on the grounded dielectric plate, and 5*6 electromagnetic bandgap units are loaded in this embodiment.
  • Surface wave propagation can be greatly suppressed without changing other structural parameters and without additional drilling.
  • the surface wave propagation after periodically loading the proposed electromagnetic bandgap structure on the grounded dielectric plate is greatly suppressed, up to close to 30 dB, and simultaneously covers a bandwidth of about 8 GHz.
  • the broadband miniaturized coplanar electromagnetic bandgap structure proposed in the embodiments of the present application can suppress the propagation of surface waves, thereby improving the antenna isolation.
  • loading the broadband miniaturized coplanar electromagnetic bandgap structure proposed in the embodiments of the present application between two microstrip antenna units can significantly improve the isolation by about 10 dB.
  • Mode1 represents the surface wave TM mode
  • Mode2 represents the surface wave TE mode
  • S11 represents the 1-port reflection coefficient
  • S12 represents the isolation degree between 12 ports
  • S21 represents the isolation degree between 21 ports
  • S22 represents the reflection coefficient of 2 ports.
  • This embodiment presents the proof of the application for suppressing surface waves.
  • the application has the advantages of wide frequency band, coplanarity, and miniaturization, and can be widely used in applications such as planar microstrip phased array decoupling, efficiency improvement, and noise suppression.
  • the electromagnetic bandgap structure described in the embodiments of the present application has a center frequency reduced by 45% compared with the classical mushroom-type electromagnetic bandgap structure under the same conditions, that is, miniaturization is realized.
  • the electromagnetic bandgap structure described in the embodiment of the present application does not need metal through holes, and can realize a coplanar design, which reduces the difficulty of processing and production.
  • the electromagnetic bandgap structure described in the embodiments of the present application can significantly suppress surface waves in the frequency band of 7.5-15 GHz, and the bandwidth far exceeds that of the classical mushroom-shaped electromagnetic bandgap structure.
  • An embodiment of the present application provides a patch antenna loaded with an electromagnetic bandgap, which includes: loading the above-mentioned electromagnetic bandgap structure in the middle of the patch antenna coupled with the E-plane.
  • An embodiment of the present application provides a patch antenna loaded with an electromagnetic bandgap, including: periodically arranging the electromagnetic bandgap structure in the middle of the elements of the array antenna according to the element size.
  • relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence between these entities or operations any such actual relationship or sequence.
  • the terms “comprising”, “comprising” or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device that includes a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus.
  • an element qualified by the phrase “comprising a" does not preclude the presence of additional identical elements in the process, method, article, or device that includes the element.

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Abstract

本申请实施例提供了一种用于表面波抑制的电磁带隙结构和电磁带隙加载的贴片天线，该电磁带隙结构包括：共面电磁带隙金属图案，所述共面电磁带隙金属图案的单元结构为矩形，所述单元结构的单元边角处有贴片寄生单元；其中，各贴片寄生单元旋转对称设置；所述单元结构四边为金属插指形结构，其中，所述金属插指形结构位于单元边角之间；所述单元结构中心设置有矩形贴片；所述矩形贴片为开有环形槽形状的矩形贴片。本申请实施例提供的电磁带隙结构避免现有电磁带隙中使用的金属化通孔，实现共面化设计，降低了加工生产难度，与现有方案相比还实现了宽带和小型化设计。

Description

一种用于表面波抑制的电磁带隙结构和贴片天线
相关申请的交叉引用
本申请要求于2021年3月30日提交的申请号为202110337199.7，名称为“一种用于表面波抑制的电磁带隙结构和贴片天线”的中国专利申请的优先权，其通过引用方式全部并入本文。
技术领域
本申请涉及电磁辐射技术领域，尤其涉及一种用于表面波抑制的电磁带隙结构和电磁带隙加载的贴片天线。
背景技术
TM，TE等模式的表面波广泛存在于多种类型的传输线中，如微带线，槽线，共面波导传输线等等，表面波的广泛存在降低了传输线的性能，增加了传输线的损耗，增加了线线间的耦合，也会带来寄生辐射等等问题。因此，抑制或者利用表面波的电磁结构得到了广泛的关注和研究。
电磁带隙结构是一种特殊的人工周期电磁材料。利用周期排布的单元实现特定的电磁效应。EBG结构主要分为两种类型，第一类为Bragg散射型，此种类型的带隙是由Bragg散射引起的，单元周期排列引起散射波相位周期性分布，使得在特定频率和方向上，各个单元散射波反相叠加，互相抵消，形成带隙。第二类局域谐振型，这种类型利用周期单元自身的谐振特性形成带隙。通常第二种类型的EBG结构比第一种类型的EBG结构更加紧凑，因此也得到了更广泛的关注和研究。
早期的谐振型电磁带隙结构是由D.F.Sievenpiper等人提出的蘑菇型结构，但是该结构在单元中心处有通孔，提高了加工复杂度和成本。后来，F.R.Yang等人提出了一种共面的电磁带隙结构，在一个平面上引入周期性的LC谐振单元形成带隙，但是该结构依然存在尺寸较大的问题。在很多应用中，如大角度扫描相控阵列，高密度PCB板等，没有足够空间容纳大尺寸的EBG结构；局域谐振型电磁带隙结构本质上通常是LC谐振电路，其带宽往往较窄，无法适应宽频带需求。
发明内容
针对现有技术中存在的问题，本申请实施例提供用于表面波抑制的电磁带隙结构和电磁带隙加载的贴片天线。
具体地，本申请实施例提供了以下方案：
本申请实施例提供一种用于表面波抑制的电磁带隙结构，其中，
所述电磁带隙结构有共面电磁带隙金属图案，所述共面电磁带隙金属图案的单元结构为矩形，所述单元结构的单元边角处有贴片寄生单元；其中，各贴片寄生单元旋转对称设置；
所述单元结构四边为金属插指形结构，其中，所述金属插指形结构位于单元边角之间；
所述单元结构中心设置有矩形贴片；所述矩形贴片为开有环形槽形状的矩形贴片。
在一个实施例中，所述单元结构的单元边角处有四个正方形贴片寄生单元。
在一个实施例中，所述金属插指形结构旋转对称设置。
在一个实施例中，所述金属插指形结构位于单元四边的正方形贴片寄生单元之间。
在一个实施例中，将所述电磁带隙结构加载在接地介质基板用于抑制表面波传播。
在一个实施例中，将所述第一器件按照单元尺寸周期性地排列在所述介质基板上方。
在一个实施例中，将所述电磁带隙结构按照单元尺寸周期性地排列在所述接地介质基板上方。
在一个实施例中，所述单元结构中心为开有方形环槽的矩形贴片。
在一个实施例中，所述单元结构中心为开有圆形环槽的矩形贴片。
本申请实施例提供一种电磁带隙加载的贴片天线，其中，上述电磁带隙结构加载在E面耦合的贴片天线中间。
本申请实施例提供一种电磁带隙加载的贴片天线，其中，上述电磁带隙结构按照单元尺寸周期性地排列在阵列天线的单元中间。
由上述技术方案可知，本申请实施例提供的用于表面波抑制的电磁带隙 结构和电磁带隙加载的贴片天线，该电磁带隙结构包括：所述电磁带隙结构有共面电磁带隙金属图案，所述共面电磁带隙金属图案的单元结构为矩形，所述单元结构的单元边角处有贴片寄生单元；其中，各贴片寄生单元旋转对称设置；所述单元结构四边为金属插指形结构，其中，所述金属插指形结构位于单元边角之间；所述单元结构中心设置有矩形贴片；所述矩形贴片为开有环形槽形状的矩形贴片。本申请实施例提供的电磁带隙结构避免现有电磁带隙中使用的金属化通孔，实现共面化设计，降低了加工生产难度。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请一实施例提供的电磁带隙结构的结构示意图；
图2为本申请另一实施例提供的电磁带隙结构示意图；
图3为本申请一实施例提供的电磁带隙结构的反射相位曲线示意图；
图4为本申请一实施例提供的电磁带隙结构的色散曲线示意图；
图5为本申请一实施例提供的接地介质板上方的表面波示意图；
图6为本申请一实施例提供的无电磁带隙结构加载的接地介质板传输系数曲线示意图；
图7为本申请一实施例提供的周期性加载电磁带隙结构的接地介质板示意图；
图8为本申请一实施例提供的电磁带隙结构加载的接地介质板传输系数曲线示意图；
图9为本申请一实施例提供的1*2微带贴片阵列示意图；
图10为本申请一实施例提供的1*2微带贴片阵列的S参数曲线示意图；
图11为本申请一实施例提供的加载了电磁带隙结构的1*2微带贴片阵列示意图；
图12为本申请一实施例提供的加载了电磁带隙结构的1*2微带贴片阵列的S参数曲线示意图；
上面各图中标号的含义分别为：
1表示金属接地板；2表示介质基板；3表示共面电磁带隙金属图案；4表示贴片寄生单元；5表示金属插指形结构；6表示矩形贴片；7表示介质板；8表示地平面；9和10表示两个波端口；11表示介质板的中心面；12表示电磁带隙结构。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
图1为本申请一实施例提供的电磁带隙结构的结构示意图；如图1所示，该电磁带隙结构包括：
所述电磁带隙结构有共面电磁带隙金属图案，所述共面电磁带隙金属图案的单元结构为矩形，所述单元结构的单元边角处有贴片寄生单元；其中，各贴片寄生单元旋转对称设置；
所述单元结构四边为金属插指形结构，其中，所述金属插指形结构位于单元边角之间；
所述单元结构中心设置有矩形贴片；所述矩形贴片为开有环形槽形状的矩形贴片。
下面对本实施例提供的电磁带隙结构的工作原理和具体工作流程进行说明。
具体的，本申请实施例提供的电磁带隙结构(Uniplanar Compact EBG,UC-EBG)设置有共面金属图案，如共面电磁带隙金属图案，所述共面电磁带隙金属图案的单元结构为矩形，如共面电磁带隙金属图案其单元结构为长方形或正方形，所述单元结构的单元边角处有若干个贴片寄生单元，如单元边角处有四个正方形贴片寄生单元；其中，各贴片寄生单元旋转对称设置，即将其中任意一个正方形贴片旋转90度，180度，270度即可以得到其他三个正方形贴片单元；所述金属插指形结构位于单元边角之间，如金属插指形结构位于单元四边的正方形贴片寄生单元之间；所述单元结构中心设置有矩形贴片；所述矩形贴片为开有环形槽形状(即闭合形状)的矩形贴片。本申 请实施例通过在金属贴片多处刻蚀缝隙，组成特殊的谐振电路，用以实现电磁带隙结构的小型化设计。规避常见电磁带隙结构中使用的金属化通孔，实现共面化设计，可以降低生产加工成本；通过观察该电磁带隙结构的反射相位和布里渊曲线得知该结构具有较宽的传输禁带。在接地介质板上周期性加载所提出的电磁带隙结构可以显著抑制接地介质板上传输的表面波。由于该电磁带隙结构具有宽频带，小型化，共面等特征可以以较低成本用于宽频带宽角角度扫描相控阵列去耦，抑制表面波损耗，提高传输线效率等等多种应用场景。
由上述技术方案可知，本申请实施例提供的电磁带隙结构，所述电磁带隙结构设置有共面电磁带隙金属图案，所述共面电磁带隙金属图案的单元结构为矩形，所述单元结构的单元边角处有若干个贴片寄生单元；其中，各贴片寄生单元旋转对称设置；所述单元结构四边为金属插指形结构，其中，所述金属插指形结构位于单元边角之间；所述单元结构中心设置有矩形贴片；所述矩形贴片为开有环形槽形状的矩形贴片。本申请实施例提供的电磁带隙结构避免现有电磁带隙中使用的金属化通孔，实现共面化设计，降低了加工生产难度，可用于抑制接地介质板上传输的表面波。
在上述实施例的基础上，在本实施例中，所述单元结构的单元边角处有四个正方形贴片寄生单元。
在上述实施例的基础上，在本实施例中，所述金属插指形结构旋转对称设置。
在本实施例中，可以理解的是，金属插指形结构旋转对称，举例来说，即将其中任意一个金属插指形结构旋转90度，180度，270度即可以得到其他三个金属插指形结构。
在上述实施例的基础上，在本实施例中，所述金属插指形结构位于单元四边的正方形贴片寄生单元之间。
在本实施例中，参见图1，单元结构为正方形，单元边角处各有一个正方形贴片寄生单元，从而将所述金属插指形结构置于单元四边的中间，即所述金属插指形结构位于单元四边的正方形贴片寄生单元之间。
在本实施例中，参见图2，所述电磁带隙结构包括上方的金属图案和下方的接地介质基板。
在上述实施例的基础上，在本实施例中，还包括：将所述电磁带隙结构加载在接地介质基板用于抑制表面波传播。
在上述实施例的基础上，在本实施例中，还包括：将所述电磁带隙结构按照单元尺寸周期性地排列在所述接地介质基板上方。
在本实施例中，参见图7，所述电磁带隙结构按照单元尺寸周期性地排列在所述介质基板上方，可以显著抑制表面波传播。
在上述实施例的基础上，在本实施例中，所述单元结构中心为开有方形环槽的矩形贴片。
在本实施例中，参见图2，所述单元结构中心为开有方形环槽的矩形贴片。
在本实施例中，通过设置开有方形环槽的矩形贴片，使得谐振频率降低，进一步实现小型化。
在上述实施例的基础上，在本实施例中，所述单元结构中心为开有圆形环槽的矩形贴片。
为了更好的理解本申请，下面结合实施例进一步阐述本申请的内容，但本申请不仅仅局限于下面的实施例。
本申请实施例提供的电磁带隙结构实现宽带小型化共面设计的关键在于电磁带隙金属图案的设计，其单元结构为正方形，单元边角处有四个正方形贴片寄生单元；上述正方形贴片寄生单元旋转对称，即将其中任意一个正方形贴片旋转90度，180度，270度即可以得到其他三个正方形贴片单元；其中单元四边的中间为金属插指形结构；上述金属插指形结构旋转对称，即将其中任意一个金属插指形结构旋转90度，180度，270度即可以得到其他三个金属插指形结构；单元中心为开有方形环槽的矩形贴片。
进一步地，本申请实例中采用的介质基板为Rogers 4350B，单元周期为2.5mm，将所提出的电磁带隙结构按照单元尺寸周期性地排列在介质基板上方，可以显著抑制表面波传播。
进一步地，如图3所示，将所设计的电磁带隙单元至于周期边界内，采用Floquet端口进行激励，仿真得到其反射相位随频率变化曲线，反射相位在±90度之间的频率范围为6.45GHz-11.21GHz，这个频率范围可以近似表征电磁带隙结构的频率范围。
进一步地，如图4所示，进一步对该电磁带隙结构进行本征模仿真得到其TM模式(mode 1)和TE模式(mode 2)的色散曲线，两条色散曲线间有明显的带隙，在这一段频率范围内，两个表面波模式均截止，无法传播。
进一步地，图5展示了表面波在接地介质板上的传播情况。图中7为Rogers 4350B介质板，8为地平面，9，10分别为两个波端口，用以激励表面波。在垂直于介质板的中心面11上可以观察到明显的表面波传播。表面波被束缚在介质表面传播，表面波通常是不希望得到的，因为这种波通常会带来传输损耗，寄生辐射，隔离恶化等等问题，严重降低系统性能。
进一步地，图6展示的是未加载电磁带隙结构时，表面波的传输特性曲线，可以看到此时表面波可以在接地介质板中几乎无损的传播，若不加以抑制，将极大地干扰系统性能。
进一步地，如图7所示，在接地介质板上周期性地加载所提出的电磁带隙结构12，本实施例中加载了5*6个电磁带隙单元。在无需改变其他结构参数，也无需额外打孔的情况下即可以大幅度抑制表面波传播。
进一步地，如图8所示，在接地介质板上周期性地加载所提出的电磁带隙结构后的表面波传播被大幅度抑制，最高接近30dB，并同时覆盖约8GHz的带宽。
进一步地，由于介质介质板中存在表面波，尤其式TM模式的表面波截止频率为0，因此广泛存在。在微带阵列天线中，表面波的存在会增大相邻耦合，单元间耦合会使得阵列匹配和辐射性能发生恶化。由此可见，本申请实施例提出的宽带小型化的共面电磁带隙结构可以抑制表面波传播，从而可以提高天线隔离度。
进一步地，如图9所示，1个1*2的微带天线阵列，两天线单元间有较高的耦合如图10所示。
进一步地，如图11和图12所示，将本申请实施例提出的宽带小型化的共面电磁带隙结构加载在两个微带天线单元中间可以显著提高约10dB的隔离度。
在本实施例中，针对各附图中出现的Mode1、Mode2、S11、S12、S21、S22进行解释说明，其中Mode1表示表面波TM模式，Mode2表示表面波TE模式，S11表示1端口反射系数，S12表示12端口间隔离度，S21表示21端 口间隔离度，S22表示2端口反射系数。
本实施例给出了本申请抑制表面波的实证，本申请具有宽频带，共面，小型化等优势可以广泛应用于平面微带相控阵去耦，效率提升，噪声抑制等应用中。
在本实施例中，需要说明的是，上述实施例和说明书中描述的只是本申请的原理和基本结构，在不脱离本申请精神和范围的前提下本申请还会有各种变化和改进，如增加或减少单元周期，在不改变电磁带隙结构图案的情况下改变某些尺寸参数，这些变化和改进都落入要求保护的本申请的范围内。
综上所述，本申请实施例至少具有如下优势：
1、本申请实施例所述的电磁带隙结构比经典的蘑菇型电磁带隙结构在同等条件下，中心频率降低45％，即实现了小型化。
2、本申请实施例所述的电磁带隙结构，相较于经典的蘑菇型电磁带隙结构，无需金属通孔，可以实现共面设计，降低了加工生产难度。
3、本申请实施例所述的电磁带隙结构在7.5-15GHz的频带内均可以对表面波有显著的抑制作用，带宽远超经典的蘑菇型电磁带隙结构。
本申请实施例提供一种电磁带隙加载的贴片天线，包括：将上述的电磁带隙结构加载在E面耦合的贴片天线中间。
本申请实施例提供一种电磁带隙加载的贴片天线，包括：将上述的电磁带隙结构按照单元尺寸周期性地排列在阵列天线的单元中间。
此外，在本申请中，诸如“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
此外，在本申请中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要 素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括要素的过程、方法、物品或者设备中还存在另外的相同要素。
此外，在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (10)

  1. 一种用于表面波抑制的电磁带隙结构，其特征在于，
    所述电磁带隙结构有共面电磁带隙金属图案，所述共面电磁带隙金属图案的单元结构为矩形，所述单元结构的单元边角处有贴片寄生单元；其中，各贴片寄生单元旋转对称设置；
    所述单元结构四边为金属插指形结构，其中，所述金属插指形结构位于单元边角之间；
    所述单元结构中心设置有矩形贴片；所述矩形贴片为开有环形槽形状的矩形贴片。
  2. 根据权利要求1所述的用于表面波抑制的电磁带隙结构，其特征在于，所述单元结构的单元边角处有四个正方形贴片寄生单元。
  3. 根据权利要求2所述的用于表面波抑制的电磁带隙结构，其特征在于，所述金属插指形结构旋转对称设置。
  4. 根据权利要求3所述的用于表面波抑制的电磁带隙结构，其特征在于，所述金属插指形结构位于单元四边的正方形贴片寄生单元之间。
  5. 根据权利要求1所述的用于表面波抑制的电磁带隙结构，其特征在于，所述电磁带隙结构加载在接地介质基板用于抑制表面波传播。
  6. 根据权利要求5所述的用于表面波抑制的电磁带隙结构，其特征在于，所述电磁带隙结构按照单元尺寸周期性地排列在所述接地介质基板上方。
  7. 根据权利要求1所述的用于表面波抑制的电磁带隙结构，其特征在于，所述单元结构中心为开有方形环槽的矩形贴片。
  8. 根据权利要求1所述的用于表面波抑制的电磁带隙结构，其特征在于，所述单元结构中心为开有圆形环槽的矩形贴片。
  9. 一种电磁带隙加载的贴片天线，其特征在于，权利要求1-8任一项所述的电磁带隙结构加载在E面耦合的贴片天线中间。
  10. 一种电磁带隙加载的贴片天线，其特征在于，权利要求1-8任一项所述电磁带隙结构按照单元尺寸周期性地排列在阵列天线的单元中间。
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