WO2022204181A1

WO2022204181A1 - Additive manufacturing of thermal and rf elements

Info

Publication number: WO2022204181A1
Application number: PCT/US2022/021385
Authority: WO
Inventors: Jerrel Kent Antolik; Seyedalireza TORBATISARRAF
Original assignee: Lam Research Corporation
Priority date: 2021-03-26
Filing date: 2022-03-22
Publication date: 2022-09-29
Also published as: TW202306071A

Abstract

A component constructed by an additive manufacturing process includes an assembly body formed during the additive manufacturing process using a first type of powdered material. Hie component further includes a plurality of thermal management channels within the assembly body, lire plurality of thermal management channels may be constructed during the additive manufacturing process using a. second type of powdered material, the plurality of thermal management channels forming a thermal element.

Description

ADDITIVE MANUFACTURING OF THERMAL AND RF ELEMENTS CLAIM OF PRIORITY [0001] This application claims the benefit of priority to U.S. Provisional Patent Application Serial No. 63/166,834, filed on March 26, 2021, which is incorporated by reference herein in its entirety. TECHNICAL FIELD [0002] The subject matter disclosed herein generally relates to systems, methods, apparatuses, and machine-readable media storing computer programs for additive manufacturing, including additive manufacturing (such as laser stereolithography, vat photopolymerization, three-dimensional (3D) material jetting, powder bed fusion, etc.) of thermal and radio frequency (RF) elements (or components) of process hardware (e.g., semiconductor-processing chamber). BACKGROUND [0003] In semiconductor manufacturing equipment, some parts are subject to extreme conditions during the operation of the equipment. For example, some parts within the process zone in dielectric etch and conductor etch tools (or other process hardware) are subject to extreme conditions, such as high temperatures, rapid changes in temperature, high throughput of electric currents, and so forth. [0004] Wrought metal alloys (e.g., aluminum alloys) are widely used in aerospace, transportation, consumer electronics, semiconductor manufacturing, and general applications. The broad implementation of wrought metal alloys is due to their reproducibility and repeatability in production, heat treatability to gain high strength, formability up to thin foils, and acceptable corrosion performance. However, conventional manufacturing methods such as formative technologies with near-net shape (NNS) manufacturing accompanied by subtractive manufacturing and joining processes are inferior as they are unsuited to completely satisfy the ever-growing demands for the fabrication of complex designs efficiently and cost-effectively. Additionally, current thermal management in process-related hardware is often inefficient and non-uniform to address the broad temperature range of current and future substrate processing requirements. [0005] The background description provided herein is to generally present the context of the disclosure. It should be noted that the information described in this section is presented to provide the skilled artisan some context for the following disclosed subject matter and should not be considered as admitted prior art. More specifically, work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure. SUMMARY [0006] Components, apparatuses, and methods are presented for additive manufacturing (such as laser stereolithography, vat photopolymerization, powder bed fusion, etc.) of thermal and RF elements (or components) of process hardware. [0007] A general aspect includes a component constructed by an additive manufacturing process. The component includes an assembly body formed during the additive manufacturing process using a first type of powdered material. The component further includes a plurality of thermal management channels within the assembly body. The plurality of thermal management channels may be constructed during the additive manufacturing process using a second type of powdered material. The plurality of thermal management channels form a thermal element. [0008] Another general aspect includes a semiconductor substrate processing apparatus. The apparatus includes a vacuum chamber including a processing zone for processing a substrate using plasma, the plasma generated using process gasses. The apparatus further includes a gas injector configured to supply the process gasses into the vacuum chamber during the processing of the substrate. The apparatus further includes a component as defined hereinabove. The apparatus further includes a controller coupled to the vacuum chamber and the component. The controller is configured to adjust a temperature of the thermal element formed by the plurality of thermal management channels based on a temperature of the plasma within the processing zone. [0009] Another general aspect includes a semiconductor substrate processing apparatus. The apparatus includes a vacuum chamber including a processing zone for processing a substrate using plasma, the plasma generated using process gasses. The apparatus further includes a gas injector configured to supply the process gasses into the vacuum chamber during the processing of the substrate. The apparatus further includes a pinnacle assembly. The pinnacle assembly includes an assembly body formed using a first type of powdered material and a plurality of thermal management channels within the assembly body. The plurality of thermal management channels are constructed using a second type of powdered material. The plurality of thermal management channels form a thermal element. The apparatus further includes a controller coupled to the vacuum chamber and the pinnacle assembly. The controller is configured to adjust a temperature of the thermal element based on a temperature of the plasma within the processing zone. [0010] Yet another general aspect includes a component for a semiconductor-processing chamber. The component is fabricated by a process including printing, using an additive manufacturing process, a green part corresponding to the component. The green part includes a first binder with a first type of powdered material and a second binder with a second type of powdered material. The green part further includes a body formed by the first type of powdered material and a plurality of thermal management channels formed by the second type of powdered material. The plurality of thermal management channels are enclosed within the body of the green part. The process further includes debinding the green part to remove the first binder and the second binder. The process further includes sintering the first type of powdered material and the second type of powdered material of the green part after the debinding to form the component for the semiconductor-processing chamber. BRIEF DESCRIPTION OF THE DRAWINGS [0011] Various ones of the appended drawings merely illustrate example embodiments of the present disclosure and cannot be considered as limiting its scope. [0012] FIG. 1 illustrates the stages of additive manufacturing, according to some example embodiments. [0013] FIG. 2 shows laser stereolithography, according to some example embodiments. [0014] FIG. 3 shows vat photopolymerization, according to some example embodiments. [0015] FIG. 4 illustrates a laser powder bed fusion (L-PBF) apparatus, according to some example embodiments. [0016] FIG.5 illustrates a diagram of a powder bed formed by a powdered material and laser sintering (or melting) using the L-PBF apparatus of FIG. 4, according to some example embodiments. [0017] FIG. 6 illustrates a substrate-processing chamber, according to some example embodiments. [0018] FIG. 7 illustrates another view of a semiconductor-processing chamber with components that can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. [0019] FIG. 8A, FIG. 8B, and FIG. 8C illustrate different aspects of a pinnacle assembly with thermal management channels which can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. [0020] FIG.9A illustrates a chamber assembly with thermal management channels which can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. [0021] FIG. 9B and FIG. 9C illustrate different types of patterns of thermal management channels printed within the chamber assembly of FIG. 9A, according to some example embodiments. [0022] FIG. 10 and FIG. 11 illustrate different aspects of cooling plates which can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. [0023] FIG. 12 illustrates a semiconductor-processing chamber window assembly with thermal management channels which can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. [0024] FIG.13 illustrates a semiconductor-processing chamber edge ring with thermal management channels which can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. [0025] FIG.14 is a flowchart of a method for fabricating a component for a semiconductor-processing chamber using disclosed techniques for AM with dissimilar materials, according to some example embodiments. [0026] FIG.15 is a block diagram illustrating an example of a machine upon which one or more example method embodiments may be implemented, or by which one or more example embodiments may be controlled. DETAILED DESCRIPTION [0027] The description that follows includes systems, methods, techniques, instruction sequences, and computing machine program products (e.g., stored on machine-readable media) that embody illustrative embodiments of the present disclosure. In the following description, for purposes of explanation, numerous specific details are outlined to provide a thorough understanding of example embodiments directed to additive manufacturing (such as laser stereolithography, vat photopolymerization, and powder bed fusion) of thermal and RF elements of process hardware. It will be evident, however, to one skilled in the art, that the present embodiments may be practiced without these specific details. [0028] Additive manufacturing (AM) provides an opportunity to produce parts and components by incremental layer-by-layer printing of a desired design directly from a computer-aided design (CAD) or 3D object scanners. In this regard, AM provides capabilities to manufacture topologically-optimized components, custom-made for individual applications, without the need to use tooling, molds or dies while also limiting material waste. [0029] Recent developments in AM, particularly, selective laser melting (SLM) or selective laser sintering (SLS), which are also termed as laser powder bed fusion (L-PBF) techniques, have gained considerable attraction in the field of parts and assemblies made by aluminum (Al) alloys due to the ability to produce intricate geometries and very complex NNS components with desired repeatability and reproducibility. In SLM, the particles are fully melted, whereas in SLS the particles are only melted at their surface. In some embodiments, AM techniques discussed herein may be used to fabricate thermal and RF elements using dissimilar materials. For example, a body of a process hardware component may be printed using a first type of powdered material while a thermal element is printed within the body using a second type of powdered material. Examples of dissimilar materials that can be used for printing process hardware components using an AM process (e.g., one of the AM processes discussed in connection with FIGS. 1-5) can include ceramic and metal (e.g., tungsten), aluminum (or an aluminum-based alloy) and steel (e.g., stainless steel or another type of steel-based alloy), ceramic and steel (e.g., stainless steel or another type of steel-based alloy), copper (or copper-based alloy) and steel (e.g., stainless steel), or another type of combination of dissimilar materials. [0030] As used herein, the term !dissimilar materials" indicates a combination of different materials which can be bonded to form a component using an AM process. Dissimilar materials can include a combination of two or more powdered or non-powdered materials including ceramic, copper, copper- based alloy, aluminum, aluminum-based alloy, steel, steel-based alloy, or other types of metallic or non-metallic types of materials that can be printed using an AM process. In some embodiments, the dissimilar materials are selected based on having a similar coefficient of thermal expansion (CTE) and similar melting temperatures to facilitate the AM process and improve final product characteristics (e.g., avoid cracking due to different CTEs). Specific examples of dissimilar materials selected based on similar CTEs and melting temperatures are provided in connection with FIG.2 and FIG.4. [0031] Example process hardware components that can be printed using dissimilar materials include a chamber assembly with thermal management channels (e.g., as illustrated in FIGS.9A-9C), semiconductor-processing chamber cooling plates (e.g., as illustrated in FIGS. 10-11), a semiconductor-processing chamber pinnacle assembly (e.g., as illustrated in FIGS. 8A-8C), a semiconductor-processing chamber window assembly (e.g., as illustrated in FIG. 12), and a semiconductor-processing chamber electrostatic chuck (ESC) (e.g., as illustrated in FIG. 13). Even though the disclosure relates to the manufacturing of specific process hardware components (e.g., as illustrated in FIGS. 8A-13) using AM processes with dissimilar materials, the disclosure is not limited in this regard and other components may also be manufactured using the disclosed techniques for printing dissimilar materials in AM processes. [0032] FIG. 1 illustrates a diagram 100 of stages of additive manufacturing, according to some example embodiments. Referring to FIG. 1, laser signal source 118 generates a laser signal which can be used in connection with metal deposition techniques based on, e.g., solid-state sintering, liquid phase sintering and partial melting, and full melting. Example liquid phase sintering and partial melting techniques include using a different binder and structural materials (e.g., in connection with selective laser sintering) or using no distinct binder and structural materials (e.g., in connection with direct metal laser sintering, such as used by L-PBF techniques). [0033] At stage 112 of the additive manufacturing illustrated in diagram 100, the second layer 104 material is bonded on top of a first layer 102 material. At stage 114, the second layer 104 is further modified and a third layer 106 is bonded on top of the second layer 104. At stage 116, a final fourth layer 108 is bonded on top of the third layer 106 resulting in a completed product 110. [0034] In some embodiments, the structural materials may include dissimilar materials, such as two or more different types of powdered (or non- powdered) materials which can be printed using an AM process. In some aspects, each of the layers 104-108 may include a single type of material, while in other aspects a single layer may include two or more types of material. In this regard, a second laser signal source 120 may be used together with the laser signal source 118 so that both laser signal sources 118 and 120 may simultaneously process dissimilar materials in the same layer (e.g., each of the laser signal sources may be configured differently based on the type of material that the laser source is associated with). [0035] The layer-wise and fast cooling rate nature of the AM process provides opportunities for fabricating unique components with a tailorable microstructure. Additionally, the use of dissimilar materials during the AM process allows for the manufacturing of thermal and RF elements within at least one cavity of process hardware components (e.g., components of semiconductor- processing chamber as illustrated in connection with FIG.8A # FIG.13). [0036] FIG. 2 shows laser stereolithography (SLA), according to some example embodiments. Although some elements are shown in FIG.2, additional elements may be present in other embodiments. The apparatus 200 uses an SLA- based AM process that employs a rastering laser 210. More specifically, as shown in FIG. 2, apparatus 200 includes a laser 210 positioned over a bed (or vat) 214 filled with liquid resin photopolymer (also referred to as SLA binder). The laser 210 may typically emit higher-energy photons, and thus emit ultraviolet (UV) radiation. The UV radiation may be guided by mirrors 212 in a single (X or Y) direction or around a plane (X and Y directions). In some embodiments, the UV laser 210 may be mechanically movable instead of, or in addition to, being moved by the mirrors 212. The movement of the mirrors 212 and/or UV laser 210 may be controlled electronically based on the instructions to create the object 222. The vat 214 may be movable in a direction perpendicular to the plane (i.e., as shown, the Z direction). Although not shown in FIG. 2, in some embodiments, optics (e.g., lens) may be disposed between UV laser 210 and the mirrors 212 and/or between the mirrors 212 and the vat 214. [0037] The liquid resin photopolymer may include a first type of powdered material. The radiation from the UV laser 210 is directed towards the working surface 216 of the vat 214 to form individual resin layers of an object (or green part) 222 from the photopolymer in the vat 214 as the radiation from the UV laser 210 moves around the working surface 216. In particular, a blade 220 may be used to introduce or spread a fine layer of the photopolymer across the working surface 216. The fine layer of photopolymer in the vat 214 is cured into a layer that includes the first type of powdered material using photopolymerization of the photopolymer on the working surface 216 based on the instructions. The fine layer of the photopolymer may thus be provided after the last layer has been hardened by the application of the radiation from the UV laser 210. The photopolymer in the vat 214 is supplied from a paste tank 218 via blade 220. [0038] In some embodiments, apparatus 200 includes a nozzle 224, which is used to introduce a binder with a second type of powdered material during the SLA-based AM process. In one aspect, the nozzle 224 may be an inkjet nozzle configured to introduce liquid ink (as a binder) mixed with the second type of powdered material. In another aspect, the nozzle 224 may be a fused deposition modeling (FDM) nozzle configured to deposit filament (e.g., an FDM binder with the second type of powdered material) on the working surface 216 when forming the green part 222. After the green part 222 is formed during the SLA-based AM process, debinding and sintering are performed (e.g., as discussed in connection with FIG. 14) to remove the binder and sinter the first and second type of powdered materials to form a component. [0039] In some embodiments, the first and second types of powdered materials are selected based on having similar CTEs and melting temperatures (e.g., ceramic and tungsten). For example, the first type of powdered material may be ceramic powder mixed with the SLA binder and placed in vat 214. Nozzle 224 may be an FDM nozzle configured to deposit filament with an FDM binder that includes the second type of powdered material (e.g., tungsten). Additionally, since the green part 222 may include both the SLA binder with the first type of powdered material (e.g., ceramic) and the FDM binder with the second type of powdered material (e.g., tungsten), both the SLA binder and the FDM binder may be selected based on common CTE and melting point characteristics to facilitate the debinding process. [0040] The technique shown in FIG.2 may be used for printing the object from the bottom up. Although only one laser 210 and one nozzle 224 are shown, in other embodiments, multiple lasers (similar to laser 210) and multiple nozzles (similar to nozzle 224) may be used to create objects using dissimilar materials more rapidly, using a larger vat 214 than that able to be provided for an embodiment in which a single laser 210 is used. A multi-laser embodiment may also permit larger objects to be created with high precision or reduce costs by nesting multiple objects. In some embodiments, multiple paste tanks and multiple nozzles may be used so that object 222 may be printed using different types of materials (e.g., dissimilar materials) which may be cured (using one or more lasers) to form object 222. [0041] FIG. 3 shows vat photopolymerization, according to some example embodiments. As in FIG.2, although some elements are shown in FIG. 3, additional elements may be present in other embodiments. The apparatus 300 is based on digital light processing (DLP) techniques using a light projector 310 to cure the photopolymer rather than using a rastering laser 210. That is, rather than sweeping the laser beam, digital light processing is used to create the object. More specifically, as shown in FIG. 3, light (e.g., UV radiation) from the light projector 310 impinges on a digital micromirror device (DMD) 320 or a dynamic mask. The DMD 320 is adjusted based on the instructions for the particular layer being formed to reflect specific portions of the UV radiation toward the photopolymer in the vat 340. [0042] Unlike the technique shown in FIG.2, in FIG.3 the UV radiation impinges on the vat 340 from the bottom. Thus, the object may be printed layer by layer from the bottom (i.e., upside down). As shown, optics 330 may be disposed between the DMD 320 and the vat 340 so that the UV radiation impinging on the vat 340 passes through the optics 330. Similar to the above embodiment, a blade 350 may be used to sweep additional photopolymer over the completed layer within the vat 340 or to level the material present. The portion of the vat 340 in which the object is being created may be illuminated by a low power backlight 360 disposed on a building platform 370 on a load cell 380. The manufactured object 390 may be removed once the AM instructions (e.g., printing instructions associated with a CAD design of the object) are completed. [0043] The technique shown in FIG. 3 thus may permit a higher throughput, although more support structure may be used than in the embodiment shown in FIG.2. This may permit smaller objects to be created with reduced cost and higher precision. Similar to apparatus 200, in some embodiments, apparatus 300 may use different types of materials (e.g., as deposited via one or more extra nozzles such as nozzle 224 in FIG.2) so that the object 390 may be printed using different types of materials (e.g., dissimilar materials such as ceramic and tungsten) that are cured using DLP techniques to form the object 390. [0044] FIG. 4 illustrates a laser powder bed fusion (L-PBF) apparatus 400, according to some example embodiments. Referring to FIG. 4, the L-PBF apparatus 400 includes a laser source 402, a scanner system 404, a controller 426, a powder deliver system 406A, and a fabrication system 408. [0045] The powder delivery system 406A includes a supply chamber 428A holding powdered material 412A, a powder delivery piston 410A, and a powder spreading device (e.g., a roller assembly) 414A. The fabrication system 408 includes a build chamber 430 and a fabrication piston 418. [0046] The laser beam source 402 comprises suitable circuitry, logic, interfaces, and/or code and is configured to generate a laser beam 424. The scanner system 404 comprises suitable circuitry, logic, interfaces, and/or code and is configured to receive and direct the laser beam 424 into the build chamber 430 according to a predetermined path. [0047] In some aspects, controller 426 comprises suitable circuitry, logic, interfaces, and/or code and is configured to manage the operation of the laser source 402, the scanner system 404, the powder deliver system 406A, and the fabrication system 408. The controller 426 is configured to manage the scanning of the laser beam based on predetermined paths for each layer of the AM process for generating a product by the fabrication system 408. [0048] During an example AM process, the powder delivery piston 410A pushes the powdered material upwards so that the powder spreading device 414A moves a portion 416A of the powdered material 412A into the build chamber 430, spreading the portion 416A as a top layer (or powder bed) of powdered material within the build chamber 430. The laser beam 424 scans across the powder bed within the build chamber 430 according to a predetermined path, creating melting sites at points of contact with the powdered material and fusing a portion of the powdered material at the melting sites. The predetermined path is configured for each layer of product 422 by controller 426. As the laser beam 424 scans across the powder bed within the build chamber 430, a layer of sintered (or melted) powdered material that forms product 422 is generated. Unsintered powdered material 420 remains within the build chamber 430 as the fabrication piston moves downwards to enable a new layer of powdered material to be moved from the supply chamber 428A into the build chamber 430 to continue building of each layer of product 422 until the product is completed. [0049] In some aspects, the L-PBF apparatus 400 includes a second powder delivery system 406B which can be used in connection with AM processes using dissimilar materials. The powder delivery system 406B includes a supply chamber 428B holding powdered material 412B (which is dissimilar from powdered material 412B), a powder delivery piston 410B, and a powder spreading device (e.g., a roller assembly) 414B. [0050] During an example AM process using dissimilar materials, powdered materials 412A and 412B are selected with similar CTEs and melting points. In an example embodiment, the first powdered material may be stainless steel or aluminum and the second powdered material may be copper. In other embodiments, different powdered materials with similar melting points and CTE ranges may be used as well. Additionally, even though FIG. 4 illustrates the L- PBF apparatus 400 using a single laser beam 424, the disclosure is not limited in this regard and additional laser beam sources generating laser beams associated with different temperatures may be used as well. [0051] The powder delivery pistons 410A and 410B push the dissimilar powdered materials upwards so that the powder spreading devices 414A and 414B move portions 416A (of the powdered material 412A) and 416B (of powdered material 412B) into the build chamber 430, spreading the portions 416A and 416B as a top layer (or powder bed) of powdered material within the build chamber 430. In some aspects, controller 426 controls the spreading of portions 416A and 416B so that structures formed by the dissimilar powdered materials (e.g., thermal management channels) form a pre-defined pattern (e.g., based on a CAD design) within the top layer. In another aspect, each powdered material 412A and 412B is spread in a separate layer without intermixing between the powdered materials in the same layer. In some embodiments, the size, shape, pattern, and density of the thermal management channels may be pre-configured based on thermal modeling or other design considerations. [0052] The laser beam 424 scans across the powder bed within the build chamber 430 according to a predetermined path, creating melting sites at points of contact with the powdered material and fusing a portion of the powdered material at the melting sites. The predetermined path is configured for each layer of product 422 and each of the dissimilar powdered materials 412A and 412B by controller 426. As the laser beam 424 scans across the powder bed within the build chamber 430, a layer of sintered (or melted) powdered material(s) (e.g., the layer including one or both of the powdered materials 412A and 412B) that forms product 422 is generated. Unsintered powdered material 420 remains within the build chamber 430 as the fabrication piston 418 moves downwards to enable a new layer of powdered material to be moved from the supply chambers 428A and 428B (by corresponding powder delivery pistons 410A and 410B) into the build chamber 430 to continue building of each layer of product 422 using dissimilar materials until the product is completed. [0053] In an example embodiment, when the first powdered material and the second powdered material are not associated with the same (or substantially similar) CTE range, a thermal medium may be introduced (e.g., via a separate nozzle used by the L-PBF apparatus) between the first powdered material and the second powdered material. In some aspects, the thermal medium may include thermal silicone doped with graphite to increase flexibility and improve adherence to the first powdered material and the second powdered material. [0054] FIG. 5 illustrates diagram 500 of a powder bed formed by a powdered material and laser sintering (or melting) using the L-PBF apparatus 400 of FIG. 4, according to some embodiments. Referring to FIG. 5, the laser beam 502 (which can be the same as laser beam 424 in FIG.4) scans (or moves) across the surface of the powder bed 512 according to a predetermined path 504. The laser beam 502 creates a melting site (sintering site) 506 at a point of contact with the powdered (and unsintered) material 508 within the powder bed 512. Powdered material that has been previously in a melting site is fused and is illustrated as sintered powdered material 510 within the powder bed 512. [0055] As illustrated in FIG.5, product 422 that is being manufactured by the L-PBF apparatus 400 is formed by the sintered powdered material in layers 514, 516, 518, 520, and 522. Unsintered powdered material 524 remains in the build chamber 430. In aspects when product 422 includes internal channels (e.g., made of a first powdered material that is different from a second powdered material used for a remaining portion of product 422), any unsintered powder material within an internal channel may be removed by compressed fluid (e.g., compressed air introduced within the channel via a channel opening). [0056] In an example embodiment, when the L-PBF apparatus 400 is used for an AM process with dissimilar materials present in a single layer, the melting site 506 may include the powdered materials 412A and 412B from both supply chambers 428A and 428B. In other aspects, when the L-PBF apparatus 400 is used for an AM process with dissimilar materials present in different layers, the melting site 406 may include one of the powdered materials 412A and 412B. [0057] FIG. 6 illustrates a substrate-processing chamber 600 (e.g., an etching chamber or another type of vacuum chamber), according to some example embodiments. Exciting an electric field between two electrodes is one of the methods to obtain RF gas discharge in a vacuum chamber. When an oscillating voltage is applied between the electrodes, the discharge obtained is referred to as a capacitively-coupled plasma (CCP) discharge. [0058] Plasma 602 may be created within processing zone 630 utilizing stable feedstock gases to obtain a wide variety of chemically reactive by-products created by the dissociation of the various molecules caused by electron-neutral collisions. The chemical aspect of etching involves the reaction of the neutral gas molecules and their dissociated by-products with the molecules of the to-be- etched surface and producing volatile molecules, which can be pumped away. When a plasma is created, the positive ions are accelerated from the plasma across a space-charge sheath separating the plasma from chamber walls to strike the wafer surface with enough energy to remove material from the wafer surface. This is known as ion bombardment or ion sputtering. Some industrial plasmas, however, do not produce ions with enough energy to efficiently etch a surface by purely physical means. [0059] A controller 616 manages the operation of the vacuum chamber 600 by controlling the different elements in the chamber, such as RF generator 618, gas sources 622, and gas pump 620. In one embodiment, fluorocarbon gases, such as CF4 and C4F8, are used in a dielectric etch process for their anisotropic and selective etching capabilities, but the principles described herein can be applied to other plasma-creating gases. The fluorocarbon gases are readily dissociated into chemically reactive by-products that include smaller molecular and atomic radicals. These chemically reactive by-products etch away the dielectric material. [0060] The vacuum chamber 600 illustrates a processing chamber with a top electrode 604 and a bottom electrode 608. The top electrode 604 may be grounded or coupled to an RF generator (not shown), and the bottom electrode 608 is coupled to the RF generator 618 via a matching network 614. The RF generator 618 provides RF power in one or multiple (e.g., two or three) different RF frequencies to generate RF electric field in the processing zone 630. According to the desired configuration of the vacuum chamber 600 for a particular operation, at least one of the three RF frequencies may be turned on or off. In the embodiment shown in FIG.6, the RF generator 618 is configured to provide, e.g., 2 MHz, 27 MHz, and 60 MHz frequencies, but other frequencies are also possible. [0061] The vacuum chamber 600 includes a gas showerhead on the top electrode 604 to input process gas into the vacuum chamber 600 provided by the gas source(s) 622, and a perforated confinement ring 612 that allows the gas to be pumped out of the vacuum chamber 600 by gas pump 620. In some example embodiments, the gas pump 620 is a turbomolecular pump, but other types of gas pumps may be utilized. [0062] When substrate 606 is present in the vacuum chamber 600, the substrate is supported by an electrostatic chuck (ESC) 628. Silicon focus ring (or edge ring) 610, which may be part of the ESC 628, is situated next to the substrate 606 such that there is a uniform RF field at the bottom surface of the plasma 602 for uniform etching on the surface of the substrate 606. The embodiment of FIG. 6 shows a triode reactor configuration where the top electrode 604 is surrounded by a symmetric RF ground electrode 624. Insulator 626 is a dielectric that isolates the ground electrode 624 from the top electrode 604. Other implementations of the vacuum chamber 600 are also possible without changing the scope of the disclosed embodiments. [0063] The substrate 606 can include, for example, wafers (e.g., having a diameter of 100 mm, 150 mm, 200 mm, 300 mm, 450 mm, or larger) and comprising, for example, elemental-semiconductor materials (e.g., silicon (Si) or germanium (Ge)) or compound-semiconductor materials (e.g., silicon germanium (SiGe) or gallium arsenide (GaAs)). Additionally, other substrates include, for example, dielectric materials such as quartz or sapphire (onto which semiconductor materials may be applied). [0064] Each frequency generated by the RF generator 618 may be selected for a specific purpose in the substrate manufacturing process. In the example of FIG. 6, with RF powers provided at 2 MHz, 27 MHz, and 60 MHz, the 2 MHz RF power provides ion energy control, and the 27 MHz and 60 MHz powers provide control of the plasma density and the dissociation patterns of the chemistry. This configuration, where each RF power may be turned on or off, enables certain processes that use ultra-low ion energy on the substrates or wafers, and certain processes (e.g., soft etch for low-k materials) where the ion energy has to be low (e.g., under 700 or 200 eV). [0065] In another embodiment, a 60 MHz RF power is used on the top electrode 604 to obtain ultra-low energies and very high density. This configuration allows chamber cleaning with high-density plasma when the substrate 606 is not in the vacuum chamber 600 while minimizing sputtering on the surface of the ESC 628. The ESC surface is exposed when substrate 606 is not present, and any ion energy on the surface should be avoided, which is why the bottom 2 MHz and 27 MHz power supplies may be off during cleaning. [0066] In some aspects, the vacuum chamber 600 includes RF and thermal elements which may be implemented as part of process hardware components. Example RF elements include RF coils which may be used to control the RF electric field in the processing zone 630 and the resulting plasma density of plasma 602. Thermal elements (e.g., heating elements) may include thermal management channels which may be used (e.g., by controller 616) for cooling or heating areas of the processing zone 630 or certain components of the vacuum chamber 600. In some embodiments, the thermal management channels may be formed within the RF and thermal elements (e.g., as illustrated in FIGS.8A-8C, 12, and 13) or may be formed separately from the RF and thermal elements. The disclosed RF elements and thermal elements may be formed using disclosed AM processing techniques based on two or more dissimilar materials (e.g., as described in connection with FIGS.1-5). A different view of a substrate-processing chamber illustrating process hardware which may be printed using the disclosed AM processing techniques is provided in FIG. 7. More detailed views of different process hardware components with RF and thermal elements which may be printed using the disclosed AM processing techniques are provided in connection with FIGS.8A-13. [0067] FIG. 7 illustrates another view of a semiconductor-processing chamber 700 with components that can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. Referring to FIG. 7, the semiconductor-processing chamber 700 includes a gas injector 702 for introducing process gasses into the chamber, an RF coil assembly 704, a plenum cooling assembly 706, a window assembly 708, a pinnacle assembly 710, a liner assembly 712 with tuning gas ports, a liner door assembly 714, an ESC 718 with a tunable edge ring 716, a lower bias housing 720, and a chamber assembly 722. An example pinnacle assembly with thermal elements is illustrated in FIGS. 8A-8C. An example chamber assembly with thermal elements is illustrated in FIGS. 9A-9C. Example cooling plates with thermal elements which can be used for cooling chamber 700 are illustrated in FIGS. 10-11. An example window assembly with RF and thermal elements is illustrated in FIG.12. An example ESC edge ring with RF and thermal elements is illustrated in FIG.13. In some embodiments, RF power applied to the disclosed RF elements as well as cooling or heating generated by the thermal elements may be controlled by a vacuum chamber controller (e.g., controller 616 of FIG. 6) based on sensor data (e.g., based on detected temperature or RF field within the chamber processing zone). [0068] FIG. 8A, FIG. 8B, and FIG. 8C illustrate different aspects of a pinnacle assembly with thermal management channels which can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. [0069] As used herein, the term !thermal management channel" may include a channel formed by massive metal (e.g., formed using one or more of the disclosed techniques without any hollow portions inside the channel, such as illustrated in FIG.8A) or a channel that includes one or more hollow tubes (e.g., hollow tubes configured to carry cooling/heating and coupling fluids, such as illustrated in FIG.8B). [0070] Referring to FIG.8A, the pinnacle assembly 800A may be printed from a first type of powdered material (e.g., aluminum) using an AM process with dissimilar materials based on the disclosed AM techniques. The pinnacle assembly includes a plurality of thermal management channels 802A, which may be printed from a second type of powdered material (e.g., copper or a copper- based alloy) during the AM process and forming massive metal structure (e.g., a massive metal coil formed with a solid cross-section and without any hollow structures). In some aspects, a ceramic-based coating (e.g., yttria coating) may be applied to one or more surfaces of the pinnacle assembly 800A to improve thermal qualities and durability. In some embodiments, the plurality of thermal management channels 802A forms a thermal control coil within an assembly body 804A of the pinnacle assembly 800A. [0071] Referring to FIG. 8B, the pinnacle assembly 800B may also be printed from a first type of powdered material (e.g., aluminum) using an AM process with dissimilar materials based on the disclosed AM techniques. The pinnacle assembly 800B includes a plurality of thermal management channels 802B, which may be printed from a second type of powdered material (e.g., copper, steel, or a steel-based alloy) during the AM process. In some aspects, a ceramic-based coating (e.g., yttria coating) may be applied to one or more surfaces of the pinnacle assembly 800B to improve thermal qualities and durability. In some embodiments, the plurality of thermal management channels 802B forms an RF coil within an assembly body 806B of the pinnacle assembly 800B. [0072] A cross-sectional view of the RF coil formed by the thermal management channels 802B is illustrated in FIG.8C. In some embodiments, the thermal management channels 802B forming the RF coil include a first hollow tube with a wall 804C and a second hollow tube (disposed within the first hollow tube) with a wall 802C. Both tubes of the thermal management channels 802B may be formed during the AM process using dissimilar materials. Wall 802C is decoupled from wall 804C, forming an inner space 806C between the two walls. For example, the hollow tubes may be printed using the AM-based techniques discussed in connection with, e.g., FIG.2 and FIG.4 (using aluminum as the first powdered material for the assembly body 806B of the pinnacle assembly 800B, and copper as the second powdered material for the hollow tubes of the thermal management channels 802B). As mentioned hereinabove, any remaining powdered material after the component is printed (e.g., powdered material remaining within the inner space 806C or the passageway 808C) may be removed by introducing compressed fluid into the hollow tubes via the injector 804B or an opening of the passageway 808C. [0073] As illustrated in FIG. 8C, wall 802C encloses passageway 808C within the RF coil formed by the thermal management channels 802B. In an example embodiment, an RF generator (e.g., RF generator 618 in FIG.6) provides RF current on wall 804C of the RF coil to heat the thermal management channels 802B in the processing zone of the vacuum chamber. The passageway 808C is configured to receive thermal coupling fluid (e.g., process cooling water, chiller fluid, or another type of thermal coupling fluid). The inner space 806C is configured to receive thermal coupling gas (e.g., helium or another type of thermal coupling gas that thermally couples the fluid within the passageway 908C to wall 804C) via the injector 804B. In some aspects, the injector 804B may also be printed during the AM process using one of the dissimilar materials used for printing the pinnacle assembly and the thermal management channels 802B. In some embodiments, the wall thickness of walls 802C and 804C may be from 0.5 millimeters m to 3 millimeters. [0074] Even though FIG. 8B and FIG. 8C illustrate the thermal management channels 802B forming the RF coil to include decoupled walls 802C and 804C, the disclosure is not limited in this regard. In some aspects, thermal management channels may be printed so that the RF coil is separate from the passageway with thermal coupling fluid (e.g., two separate coils may be formed # one is printed with a solid cross-section for use as a heating source, and another coil is printed to include the passageway with thermal coupling fluid (or another type of cooling or heating fluid). [0075] FIG. 9A illustrates a chamber assembly 902 with thermal management channels 906 which can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. Referring to FIG. 9A, the chamber assembly 902 includes a chamber body 904, which can be printed during an AM process using a first type of powdered material, such as aluminum or aluminum-based alloy. The chamber assembly 902 further includes a plurality of thermal management channels 908 printed within the chamber body 904 using a second type of powdered material (e.g., steel or steel-based alloy), which may be used to provide thermal management functions (e.g., heating or cooling) instead of (or in addition to) heating elements (also referred to as heating rods) 914. In some aspects, the thermal management channels 908 include cooling channels 910 (e.g., for housing cooling fluid) and heating channels 912 (e.g., for housing heating fluid). FIG. 9A illustrates a portion of a cooling channel 906 within the chamber body 904. [0076] In some embodiments, the thermal management channels 908 may form a pattern within the chamber body 904 (e.g., as illustrated in FIG. 9B and FIG.9C). [0077] FIG. 9B and FIG. 9C illustrate different types of patterns of thermal management channels printed within the chamber assembly of FIG. 9A, according to some example embodiments. Referring to FIG. 9B, the thermal management channels 908 form a pattern 900B including bifilar helix-style structures oriented approximately vertically (e.g., being approximately parallel to a sidewall surface of the chamber assembly 902). [0078] Referring to FIG.9C, the thermal management channels 908 form a pattern 900C including bifilar helix-style structures oriented approximately horizontally (e.g., being approximately parallel to a top or bottom surface of the chamber assembly 902). [0079] In some aspects, the thermal management channels may be printed during the AM process to form a different pattern, such as a body-centered cubic (BCC) lattice structure, a diamond-centered cubic (DCC) lattice structure (e.g., as illustrated in FIG.10), or another type of pattern. [0080] FIG. 10 and FIG. 11 illustrate different aspects of cooling plates which can be manufactured to include thermal management channels using disclosed techniques for AM with dissimilar materials, according to some example embodiments. The cooling plates may be mounted, for example, within the chamber assembly 902. FIG. 10 illustrates an example BCC lattice structure 1000A and an example DCC lattice structure 1000B that can be printed using the disclosed techniques for AM with dissimilar materials. [0081] Referring to FIG. 11, there are illustrated a cross-sectional view 1100A and a perspective view 1100B of a cooling plate 1100 with thermal management channels that can be printed using the disclosed techniques for AM with dissimilar materials. In some aspects, the thermal management channels of cooling plate 1100 may form a pattern based on the BCC lattice structure 1000A or the DCC lattice structure 1000B. In some embodiments, the BCC lattice structure 1000A and the DCC lattice structure 1000B may be used in connection with patterns formed by printed thermal management channels (e.g., using the disclosed techniques) in other process hardware which is not illustrated in FIGS. 8A-13 but is associated with a substrate manufacturing process. [0082] FIG. 12 illustrates a semiconductor-processing chamber window assembly with thermal management channels which can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. More specifically, FIG. 12 illustrates a cross-sectional view 1200 and a perspective view 1208 of the window assembly 1202. Referring to FIG.12, the window assembly 1202 may be printed from a first type of powdered material (e.g., ceramic) using an AM process with dissimilar materials based on the disclosed AM techniques. The window assembly 1202 includes a plurality of thermal management channels 1204, which may be printed from a second type of powdered material (e.g., tungsten or another metal powder) during the AM process. In some aspects, a ceramic-based coating (e.g., yttria coating) may be applied to one or more surfaces of the window assembly 1202 to improve thermal qualities and durability. In some embodiments, the plurality of thermal management channels 1204 forms an RF coil within an assembly body of the window assembly 1202 (e.g., as seen in the cross-sectional view 1200). [0083] In some embodiments and as seen at cross-sectional view 1200, the thermal management channels 1204 forming the RF coil include an outer wall 1210 and an inner wall 1212 which may be formed during the AM process using dissimilar materials. The inner wall 1212 is decoupled from the outer wall 1210, forming an inner space 1214 between the two walls. Additionally, the inner wall 1212 encloses a passageway 1216 within the RF coil formed by the thermal management channels 1204. In an example embodiment, an RF generator (e.g., RF generator 618 in FIG.6) provides RF current on the outer wall 1210 of the RF coil to generate an RF electric field in the processing zone of the vacuum chamber. The passageway 1216 is configured to receive thermal coupling fluid (e.g., process cooling water, chiller fluid, or another type of thermal coupling fluid) via injectors (or ports) 1206. The inner space 1214 is configured to receive thermal coupling gas (e.g., helium or another type of thermal coupling gas) that thermally couples the fluid within the passageway 1216 to the outer wall 1210. [0084] In an example embodiment, when the first powdered material (used for printing the window assembly 1202) and the second powdered material (used for printing the thermal management channels 1204) are not associated with the same (or substantially similar) CTE range and melting point, a thermal medium may be introduced (e.g., via a separate nozzle used by an L-PBF apparatus) between the outer wall 1210 (printed using the second powdered material) and a remaining portion of the window assembly 1202 (printed using the first powdered material). In some aspects, the thermal medium may include thermal silicone doped with graphite to increase flexibility and improve adherence to the first powdered material and the second powdered material. [0085] Even though FIG.12 illustrates the thermal management channels 1204 forming the RF coil to include decoupled inner and outer walls, the disclosure is not limited in this regard. In some aspects, the thermal management channels 1204 may be printed so that the RF coil is separate from the passageway with thermal coupling fluid (e.g., two separate coils may be formed # one is printed with a solid cross-section for generating the RF field, and another coil is printed to include the passageway with thermal coupling fluid (or another type of cooling or heating fluid)). In another embodiment, only one coil may be printed (either the RF coil or the coil with thermal coupling fluid for cooling or heating the window assembly 1202). [0086] FIG.13 illustrates a semiconductor-processing chamber edge ring with thermal management channels which can be manufactured using disclosed techniques for AM with dissimilar materials, according to some example embodiments. Referring to FIG. 13, there is illustrated an ESC 1302 supporting a substrate 1304 within a substrate-processing apparatus (e.g., a vacuum chamber such as vacuum chambers 600 and 700 in FIG. 6 and FIG. 7 respectively). The ESC 1302 may include an edge ring 1306 which may be used to provide a uniform RF field at the bottom surface of the plasma (within a processing zone of the chamber) for uniform etching on the surface of the substrate 1304. [0087] The edge ring 1306 may be printed from a first type of powdered material (e.g., ceramic) using an AM process with dissimilar materials based on the disclosed AM techniques. The edge ring 1306 may include a plurality of thermal management channels 1308, which may be printed from a second type of powdered material (e.g., tungsten) during the AM process. In some embodiments, the plurality of thermal management channels 1308 forms an RF coil within a body of the edge ring 1306 (e.g., as seen in FIG.13). In some aspects, the plurality of thermal management channels 1308 may form an RF coil with decoupled wall surfaces to improve cooling or heating characteristics (e.g., similar to the thermal management channels 802B of FIG.8B). In other aspects, the plurality of thermal management channels 1308 may be similar to the plurality of thermal management channels 802A of FIG. 8A, forming a thermal element (e.g., a coil). In yet other aspects, the plurality of thermal management channels 1308 may form one or more passageways for circulating cooling/heating fluid used for thermal management of a separate RF coil within the edge ring (not illustrated in FIG.13). [0088] FIG. 14 is a flowchart of a method 1400 for fabricating a component for a semiconductor-processing chamber using disclosed techniques for AM with dissimilar materials, according to some example embodiments. Method 1400 includes operations 1402, 1404, and 1406, which may be performed by control logic, such as an AM process controller (e.g., controller 426 of FIG.4) or process hardware controller (e.g., processing chamber controller 616 of FIG. 6). [0089] The method 1600 may be used in any of the embodiments described above and may have additional operations and/or some of the operations described may be eliminated. Example additional operations include the following. At an example initial operation, the composition of the powdered materials used for an AM process with dissimilar materials to manufacture a process hardware component may be formulated. In some embodiments, the disclosed process hardware components may be formed from a ceramic, such as one or more of alumina, yttria-stabilized zirconia (YSZ), yttria, and single-phase yttrium-aluminum-garnet (YAG). In some embodiments, the ceramic may be YSZ, which is 3% Y2O3 stabilized ZrO2. In addition to the formation of process hardware components using ceramic (or ceramic-based) powder, the disclosed AM techniques may be used to form other process hardware components (e.g., one or more of the components discussed in connection with FIG.6 and FIG.7). Once the particular powders (e.g., powders used in an AM process with dissimilar materials) are formulated for the process hardware component, the powders may be used to print the component. [0090] At a subsequent operation, the composition of one or more precursors (e.g., a ceramic precursor) and curable resin to create an AM layer of the component may be selected. One or more precursors may be selected, for example, based on the environment in which the ceramic component is used. The precursors may contain, for example, a powder and/or liquid preceramic inorganic polymer such as polysilazanes, polycarbosilanes, polysilanes, polysiloxanes, polycarbosiloxanes, polyaluminosilazanes, polyaluminocarbosilanes, boropolycarbosiloxanes. The precursors may also contain a binder such as that described below. For example, the precursor may include a majority (e.g., about 75% - about 90%, such as about 85%) of the intended ceramic and a minority of a UV/Photoreactive (e.g., about 10% - about 25%, such as about 15%) bonding material of the total blend. A majority of the shrinkage in the structure after processing is a result of removing the, say about 15%, bonding material. [0091] Regardless of the AM technique used, after determining the component to be created by the disclosed AM techniques using dissimilar materials, the design of the process hardware component may be created using CAD software. The design may then be translated for, and sent to, the AM apparatus (e.g., one of the example AM apparatuses discussed in connection with FIGS. 1-5). In some embodiments, the instructions for the AM process may be transmitted to the AM apparatus wirelessly, using WiFi or another wireless protocol. In other embodiments, the AM apparatus may be attached to the design device. After transmitting the instructions, the AM device may directly fuse the different types of powdered material using laser or electron beam techniques as discussed above. Alternatively, the particles of the powder may be initially stuck together to create the desired geometry before performing a secondary heat treatment process to fuse the particles stuck together. As described above, vat photopolymerization may be used, in which a mixture of ceramic grains and photosensitive binder provided from a reservoir is exposed to a laser or other light source to build a layer, which may subsequently be coated with more of the mixture from the reservoir before the next layer is built. In other embodiments, an inkjet-style head may selectively deposit a binder, such as an organic liquid binder (e.g., a butyral, polymeric or polyvinyl resin) or wax (e.g., paraffin, carnauba, or polyethylene), to temporarily glue the particles together. The binder may then be partially cured using heat or UV light, followed by deposition of the next layer of powder. Independent of the specific AM process used, the process may be repeated until the component shape has been created at operation 1702. [0092] The intermediate component created is referred to as a green part, which is relatively fragile; the particles are bound together sufficiently to be able to retain the component shape, but this shape can be easily broken apart because the individual particles are not physically fused. [0093] Referring again to FIG. 14, at operation 1402, a green part corresponding to the component is printed using an AM process. The green part may include a first type of powdered material, a second type of powdered material, and one or more binders. In some aspects, the green part includes a first binder with a first type of powdered material (e.g., an SLA binder with ceramic powder) and a second binder with a second type of powdered material (e.g., an FDM binder or ink with a metallic powder such as tungsten). In an example embodiment, the green part may include a body formed by the first type of powdered material, and a plurality of thermal management channels formed by the second type of powdered material. The thermal management channels are enclosed within the body of the green part. In some embodiments, a 3D printer (or another AM apparatus) with multiple nozzles may be used in which one nozzle is used to deposit one type of powdered material (e.g., ceramic) and another deposits the binder. Optionally, during operation 1402, the non-bound (non-sintered) powder of the first or second powdered material is removed (e.g., by applying a compressed fluid such as compressed air). [0094] At operation 1404, the green part may be cleaned of excess uncured powder or other impurities, and debinding is used on the green part to remove the binder (e.g., the first binder and the second binder if multiple binders are used for printing dissimilar materials). For example, the binder is removed by placing the green part in a curing oven for secondary curing, after which the green part may be removed from the powder bed. If an organic binder is used, such binders typically burn off at 200-300°C. In aspects when the green part includes internal channels (e.g., made of a first powdered material that is different from a second powdered material used for a remaining portion of the green part), any uncured powder material within an internal channel may be removed by compressed fluid (e.g., compressed air introduced within the channel via a channel opening). [0095] After debinding the green part, at operation 1406, the green part may be sintered. More specifically, sintering the first type of powdered material and the second type of powdered material of the green part is performed after the debinding to form the component for the semiconductor-processing chamber. In some aspects, sintering may occur at a much higher temperature than curing (e.g., at temperatures greater than 1000°C). The particles may be sintered in an inert environment (e.g., in an N2 environment) or vacuum. During sintering, the individual powder particles of the powder materials form bonds to create a continuous single structure. As a result of the removal of the binder and bonding of the particles associated with the bond formation, shrinkage may occur due to the removal of space between the particles. This shrinkage may be considered in the initial CAD design of the injector. [0096] After sintering, the process hardware component (or components) may again be cleaned. This cleaning may be used, for example, to remove the binder remaining after the debinding, which may be carbonized due to the sintering process. Such cleaning may include rinsing the component with deionized water and/or isopropyl alcohol, among others. [0097] FIG. 15 is a block diagram illustrating an example of a machine 1500 upon which one or more example method embodiments may be implemented, or by which one or more example embodiments may be controlled. In alternative embodiments, the machine 1500 may operate as a standalone device or may be connected (e.g., networked) to other machines. In a networked deployment, the machine 1500 may operate in the capacity of a server machine, a client machine, or both in server-client network environments. In an example, the machine 1500 may act as a peer machine in a peer-to-peer (P2P) (or other distributed) network environment. Further, while only a single machine 1500 is illustrated, the term !machine" shall also be taken to include any collection of machines that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein, such as via cloud computing, software as a service (SaaS), or other computer cluster configurations. [0098] Examples, as described herein, may include, or may operate by, logic, several components, or mechanisms. Circuitry is a collection of circuits implemented in tangible entities that include hardware (e.g., simple circuits, gates, logic). Circuitry membership may be flexible over time and underlying hardware variability. Circuitries include members that may, alone or in combination, perform specified operations when operating. In an example, the hardware of the circuitry may be immutably designed to carry out a specific operation (e.g., hardwired). In an example, the hardware of the circuitry may include variably connected physical components (e.g., execution units, transistors, simple circuits) including a computer-readable medium physically modified (e.g., magnetically, electrically, by the moveable placement of invariant massed particles) to encode instructions of the specific operation. In connecting the physical components, the underlying electrical properties of a hardware constituent are changed (for example, from an insulator to a conductor or vice versa). The instructions enable embedded hardware (e.g., the execution units or a loading mechanism) to create members of the circuitry in hardware via the variable connections to carry out portions of the specific operation when in operation. Accordingly, the computer- readable medium is communicatively coupled to the other components of the circuitry when the device is operating. In some aspects, any of the physical components may be used in more than one member of more than one circuitry. For example, under operation, execution units may be used in a first circuit of a first circuitry at one point in time and reused by a second circuit in the first circuitry, or by a third circuit in a second circuitry, at a different time. [0099] The machine (e.g., computer system) 1500 may include a hardware processor 1502 (e.g., a central processing unit (CPU), a hardware processor core, a graphics processing unit (GPU), or any combination thereof), a main memory 1504, and a static memory 1506, some or all of which may communicate with each other via an interlink (e.g., bus) 1508. The machine 1500 may further include a display device 1510, an alphanumeric input device 1512 (e.g., a keyboard), and a user interface (UI) navigation device 1514 (e.g., a mouse). In an example embodiment, the display device 1510, alphanumeric input device 1512, and UI navigation device 1514 may be a touch screen display. The machine 1500 may additionally include a mass storage device (e.g., drive unit) 1516, a signal generation device 1518 (e.g., a speaker), a network interface device 1520, and one or more sensors 1521, such as a Global Positioning System (GPS) sensor, compass, accelerometer, or another sensor. The machine 1500 may include an output controller 1528, such as a serial (e.g., universal serial bus (USB)), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC)) connection to communicate with or control one or more peripheral devices (e.g., a printer, card reader). [0100] In an example embodiment, the hardware processor 1502 may perform the functionalities of controller 426 of FIG. 4 or process hardware controllers such as processing chamber controller 616 of FIG. 6, or any control logic discussed hereinabove to configure and control additive manufacturing functionalities associated with printing dissimilar materials (e.g., as discussed in connection with at least FIG.1 ! FIG.14). [0101] The mass storage device 1516 may include a machine-readable medium 1522 on which is stored one or more sets of data structures or instructions 1524 (e.g., software) embodying or utilized by any one or more of the techniques or functions described herein. The instructions 1524 may also reside, completely or at least partially, within the main memory 1504, within the static memory 1506, or within the hardware processor 1502 during execution thereof by the machine 1500. In an example, one or any combination of the hardware processor 1502, the main memory 1504, the static memory 1506, or the mass storage device 1516 may constitute machine-readable media. [0102] While the machine-readable medium 1522 is illustrated as a single medium, the term !machine-readable medium" may include a single medium or multiple media, (e.g., a centralized or distributed database, and/or associated caches and servers) configured to store the one or more instructions 1524. [0103] The term !machine-readable medium" may include any medium that is capable of storing, encoding, or carrying instructions 1524 for execution by the machine 1500 and that cause the machine 1500 to perform any one or more of the techniques of the present disclosure, or that is capable of storing, encoding, or carrying data structures used by or associated with such instructions 1524. Non- limiting machine-readable medium examples may include solid-state memories and optical and magnetic media. In an example, a massed machine-readable medium comprises a machine-readable medium 1522 with a plurality of particles having invariant (e.g., rest) mass. Accordingly, massed machine-readable media are not transitory propagating signals. Specific examples of massed machine- readable media may include non-volatile memory, such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks. [0104] The instructions 1524 may further be transmitted or received over a communications network 1526 using a transmission medium via the network interface device 1520. [0105] Techniques discussed herein may be applied in connection with both SLS and SLM as applied to metals (e.g., aluminum) or non-metals (e.g., ceramics and silicon). In some aspects, SLM may be preferred for metals, while SLS may be preferred for ceramics and bare silicon. [0106] Implementation of the preceding techniques may be accomplished through any number of specifications, configurations, or example deployments of hardware and software. It should be understood that the functional units or capabilities described in this specification may have been referred to or labeled as components or modules, to more particularly emphasize their implementation independence. Such components may be embodied by any number of software or hardware forms. For example, a component or module may be implemented as a hardware circuit comprising custom very-large-scale integration (VLSI) circuits or gate arrays, off-the-shelf semiconductors such as logic chips, transistors, or other discrete components. A component or module may also be implemented in programmable hardware devices such as field-programmable gate arrays, programmable array logic, programmable logic devices, or the like. Components or modules may also be implemented in software for execution by various types of processors. An identified component or module of executable code may, for instance, comprise one or more physical or logical blocks of computer instructions, which may, for instance, be organized as an object, procedure, or function. Nevertheless, the executables of an identified component or module need not be physically located together but may comprise disparate instructions stored in different locations which, when joined logically together, comprise the component or module and achieve the stated purpose for the component or module. [0107] Indeed, a component or module of executable code may be a single instruction, or many instructions, and may even be distributed over several different code segments, among different programs, and across several memory devices or processing systems. In particular, some aspects of the described process (such as code rewriting and code analysis) may take place on a different processing system (e.g., in a computer in a data center), than that in which the code is deployed (e.g., in a computer embedded in a sensor or robot). Similarly, operational data may be identified and illustrated herein within components or modules and may be embodied in any suitable form and organized within any suitable type of data structure. The operational data may be collected as a single data set or may be distributed over different locations including over different storage devices, and may exist, at least partially, merely as electronic signals on a system or network. The components or modules may be passive or active, including agents operable to perform desired functions. [0108] Additional Notes and Examples [0109] Example 1 is a component constructed by an additive manufacturing process, the component comprising: an assembly body formed during the additive manufacturing process using a first type of powdered material; and a plurality of thermal management channels within the assembly body, the plurality of thermal management channels constructed during the additive manufacturing process using a second type of powdered material, the plurality of thermal management channels forming a thermal element. [0110] In Example 2, the subject matter of Example 1 includes, wherein the component is a pinnacle assembly and the plurality of thermal management channels form a thermal control coil within the assembly body of the pinnacle assembly. [0111] In Example 3, the subject matter of Example 2 includes, wherein the thermal control coil is constructed during the additive manufacturing process with a solid cross-section. [0112] In Example 4, the subject matter of Examples 1#3 includes, wherein the component is a pinnacle assembly and the plurality of thermal management channels form a radio frequency (RF) coil within the assembly body of the pinnacle assembly. [0113] In Example 5, the subject matter of Example 4 includes, wherein the RF coil is constructed during the additive manufacturing process with a solid cross-section, the RF coil including one or more hollow tubes. [0114] In Example 6, the subject matter of Example 5 includes, wherein the one or more hollow tubes include a first hollow tube and a second hollow tube, the first hollow tube configured to receive thermal coupling fluid, and the second hollow tube configured to receive a thermal coupling gas. [0115] In Example 7, the subject matter of Example 6 includes, wherein a wall of the second hollow tube is separated from the assembly body by a thermal medium. [0116] In Example 8, the subject matter of Examples 1#7 includes, wherein the component is a chamber assembly of a vacuum chamber and the plurality of thermal management channels form a pattern within the assembly body of the chamber assembly. [0117] In Example 9, the subject matter of Example 8 includes, wherein the pattern includes one of: a bifilar helix-style structure; a body-centered cubic (BCC) lattice structure; and a diamond-centered cubic (DCC) lattice structure. [0118] In Example 10, the subject matter of Examples 1#9 includes, wherein the component is a window assembly of a vacuum chamber and the plurality of thermal management channels form a radio frequency (RF) coil within the assembly body of the window assembly. [0119] Example 11 is a semiconductor substrate processing apparatus, the apparatus comprising: a vacuum chamber including a processing zone for processing a substrate using plasma, the plasma generated using process gasses; a gas injector configured to supply the process gasses into the vacuum chamber during the processing of the substrate; a component as defined in Example 1; and a controller coupled to the vacuum chamber and the component, the controller configured to adjust a temperature of the thermal element formed by the plurality of thermal management channels based on a temperature of the plasma within the processing zone. [0120] Example 12 is a semiconductor substrate processing apparatus, the apparatus comprising: a vacuum chamber including a processing zone for processing a substrate using plasma, the plasma generated using process gasses; a gas injector configured to supply the process gasses into the vacuum chamber during the processing of the substrate; a pinnacle assembly, the pinnacle assembly comprising: an assembly body formed using a first type of powdered material; and a plurality of thermal management channels within the assembly body, the plurality of thermal management channels constructed using a second type of powdered material, the plurality of thermal management channels forming a thermal element; and a controller coupled to the vacuum chamber and the pinnacle assembly, the controller configured to adjust a temperature of the thermal element based on a temperature of the plasma within the processing zone. [0121] In Example 13, the subject matter of Example 12 includes, wherein the thermal element is a coil formed by the plurality of thermal management channels within the assembly body. [0122] In Example 14, the subject matter of Example 13 includes, wherein the first type of powdered material is aluminum and the second type of powdered material used for constructing the coil is one of copper powder or copper alloy powder. [0123] In Example 15, the subject matter of Examples 13#14 includes, wherein the coil comprises an outer wall and an inner wall, the inner wall being decoupled from the outer wall, the inner wall enclosing a passageway within the coil, and forming an inner space between the outer wall and the inner wall. [0124] In Example 16, the subject matter of Example 15 includes, a radio frequency (RF) generator, the RF generator configured to provide RF current on the outer wall of the coil, the RF current generating an RF electric field in the processing zone of the vacuum chamber. [0125] In Example 17, the subject matter of Example 16 includes, wherein the passageway is configured to receive thermal coupling fluid, and the inner space is configured to receive thermal coupling gas, the thermal coupling gas coupling the thermal coupling fluid to the outer wall of the coil. [0126] In Example 18, the subject matter of Examples 12#17 includes, wherein the vacuum chamber comprises an electrostatic chuck (ESC) supporting the substrate, the ESC comprising a ceramic edge ring, the ceramic edge ring including a second plurality of thermal management constructed using copper- based powder or steel-based powder, wherein the second plurality of thermal management channels form a pattern within the ceramic edge ring and are configured to receive a cooling fluid. [0127] Example 19 is a component for a semiconductor-processing chamber, the component fabricated by a process comprising: printing, using an additive manufacturing process, a green part corresponding to the component, the green part comprising a first binder with a first type of powdered material and a second binder with a second type of powdered material, the green part further comprising: a body formed by the first type of powdered material; and a plurality of thermal management channels formed by the second type of powdered material, the plurality of thermal management channels enclosed within the body of the green part; debinding the green part to remove the first binder and the second binder; and sintering the first type of powdered material and the second type of powdered material of the green part after the debinding to form the component for the semiconductor-processing chamber. [0128] In Example 20, the subject matter of Example 19 includes, wherein printing the green part further comprises: printing, using the additive manufacturing process, the plurality of thermal management channels to form a coil within the body. [0129] In Example 21, the subject matter of Examples 19#20 includes, wherein the thermal management channels are configured to receive thermal coupling fluid for managing surface temperature of at least one surface of the semiconductor processing chamber. [0130] In Example 22, the subject matter of Examples 19#21 includes, wherein the component is a pinnacle assembly of the semiconductor-processing chamber, the first type of powdered material is aluminum powder, and the second type of powdered material is copper powder or copper alloy powder. [0131] In Example 23, the subject matter of Example 22 includes, wherein the plurality of thermal management channels form a coil within the body, and wherein printing the green part further comprises: printing, using the additive manufacturing process, an outer wall and an inner wall of the coil, the inner wall being decoupled from the outer wall, forming an inner space of the coil between the outer wall and the inner wall. [0132] In Example 24, the subject matter of Example 23 includes, wherein printing the green part further comprises: printing, using the additive manufacturing process, an inlet portion coupled to the outer wall, the inlet portion including a channel extending into the inner space configured to receive thermal coupling gas. [0133] In Example 25, the subject matter of Examples 19#24 includes, wherein the component is a chamber assembly of the semiconductor-processing chamber, the first type of powdered material is an aluminum-based powder, and the second type of powdered material is steel-based powder. [0134] In Example 26, the subject matter of Example 25 includes, wherein printing the green part comprises: printing the plurality of thermal management channels to form a pattern within the body of the green part. [0135] In Example 27, the subject matter of Example 26 includes, wherein the plurality of thermal management channels includes a first set of thermal management channels configured to receive a heating fluid and a second set of thermal management channels configured to receive a cooling fluid. [0136] In Example 28, the subject matter of Example 27 includes, wherein the pattern is one of: a bifilar helix-style structure including the first and second set of thermal management channels; a body-centered cubic (BCC) lattice structure; and a diamond-centered cubic (DCC) lattice structure. [0137] Example 29 is a non-transitory machine-readable storage medium including instructions for fabricating a component for a semiconductor-processing chamber, wherein when the instructions are executed by a machine, cause the machine to perform operations comprising: printing, using an additive manufacturing process, a green part corresponding to the component, the green part comprising a first binder with a first type of powdered material and a second binder with a second type of powdered material, the green part further comprising: a body formed by the first type of powdered material; and a plurality of thermal management channels formed by the second type of powdered material, the plurality of thermal management channels enclosed within the body of the green part; debinding the green part to remove the first binder and the second binder; and sintering the first type of powdered material and the second type of powdered material of the green part after the debinding to form the component for the semiconductor-processing chamber. [0138] Example 30 is at least one machine-readable medium including instructions that, when executed by processing circuitry, cause the processing circuitry to perform operations to implement of any of Examples 1#29. [0139] Example 31 is an apparatus comprising means to implement of any of Examples 1#29. [0140] Example 32 is a system to implement of any of Examples 1#29. [0141] Example 33 is a method to implement of any of Examples 1#29. [0142] Throughout this specification, plural instances may implement components, operations, or structures described as a single instance. Although individual operations of one or more methods are illustrated and described as separate operations, one or more of the individual operations may be performed concurrently, and nothing requires that the operations be performed in the order illustrated. Structures and functionality presented as separate components for example configurations may be implemented as a combined structure or component. Similarly, structures and functionality presented as a single component may be implemented as separate components. These and other variations, modifications, additions, and improvements fall within the scope of the subject matter herein. [0143] The embodiments illustrated herein are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed. Other embodiments may be used and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure. The Detailed Description, therefore, is not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled. [0144] The claims may not set forth every feature disclosed herein as embodiments may feature a subset of said features. Further, embodiments may include fewer features than those disclosed in a particular example. Thus, the following claims are hereby incorporated into the Detailed Description, with a claim standing on its own as a separate embodiment. [0145] As used herein, the term !or" may be construed in either an inclusive or exclusive sense. Moreover, plural instances may be provided for resources, operations, or structures described herein as a single instance. Additionally, boundaries between various resources, operations, modules, engines, and data stores are somewhat arbitrary, and particular operations are illustrated in a context of specific illustrative configurations. Other allocations of functionality are envisioned and may fall within the scope of various embodiments of the present disclosure. In general, structures and functionality presented as separate resources in the example configurations may be implemented as a combined structure or resource. Similarly, structures and functionality presented as a single resource may be implemented as separate resources. These and other variations, modifications, additions, and improvements fall within a scope of embodiments of the present disclosure as represented by the appended claims. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.

Claims

CLAIMS What is claimed is: 1. A component constructed by an additive manufacturing process, the component comprising: an assembly body formed during the additive manufacturing process using a first type of powdered material; and a plurality of thermal management channels within the assembly body, the plurality of thermal management channels constructed during the additive manufacturing process using a second type of powdered material, the plurality of thermal management channels forming a thermal element.

2. The component of claim 1, wherein the component is a pinnacle assembly and the plurality of thermal management channels form a thermal control coil within the assembly body of the pinnacle assembly.

3. The component of claim 2, wherein the thermal control coil is constructed during the additive manufacturing process with a solid cross-section.

4. The component of claim 1, wherein the component is a pinnacle assembly and the plurality of thermal management channels form a radio frequency (RF) coil within the assembly body of the pinnacle assembly.

5. The component of claim 4, wherein the RF coil is constructed during the additive manufacturing process with a solid cross-section, the RF coil including one or more hollow tubes.

6. The component of claim 5, wherein the one or more hollow tubes include a first hollow tube and a second hollow tube, the first hollow tube configured to receive thermal coupling fluid, and the second hollow tube configured to receive a thermal coupling gas.

7. The component of claim 6, wherein a wall of the second hollow tube is separated from the assembly body by a thermal medium.

8. The component of claim 1, wherein the component is a chamber assembly of a vacuum chamber and the plurality of thermal management channels form a pattern within the assembly body of the chamber assembly.

9. The component of claim 8, wherein the pattern includes one of: a bifilar helix-style structure; a body-centered cubic (BCC) lattice structure; and a diamond-centered cubic (DCC) lattice structure.

10. The component of claim 1, wherein the component is a window assembly of a vacuum chamber and the plurality of thermal management channels form a radio frequency (RF) coil within the assembly body of the window assembly.

11. A semiconductor substrate processing apparatus, the apparatus comprising: a vacuum chamber including a processing zone for processing a substrate using plasma, the plasma generated using process gasses; a gas injector configured to supply the process gasses into the vacuum chamber during the processing of the substrate; a component as defined in claim 1; and a controller coupled to the vacuum chamber and the component, the controller configured to adjust a temperature of the thermal element formed by the plurality of thermal management channels based on a temperature of the plasma within the processing zone.

12. A semiconductor substrate processing apparatus, the apparatus comprising: a vacuum chamber including a processing zone for processing a substrate using plasma, the plasma generated using process gasses; a gas injector configured to supply the process gasses into the vacuum chamber during the processing of the substrate; a pinnacle assembly, the pinnacle assembly comprising: an assembly body formed using a first type of powdered material; and a plurality of thermal management channels within the assembly body, the plurality of thermal management channels constructed using a second type of powdered material, the plurality of thermal management channels forming a thermal element; and a controller coupled to the vacuum chamber and the pinnacle assembly, the controller configured to adjust a temperature of the thermal element based on a temperature of the plasma within the processing zone.

13. The apparatus of claim 12, wherein the thermal element is a coil formed by the plurality of thermal management channels within the assembly body.

14. The apparatus of claim 13, wherein the first type of powdered material is aluminum and the second type of powdered material used for constructing the coil is one of copper powder or copper alloy powder.

15. The apparatus of claim 13, wherein the coil comprises an outer wall and an inner wall, the inner wall being decoupled from the outer wall, the inner wall enclosing a passageway within the coil, and forming an inner space between the outer wall and the inner wall.

16. The apparatus of claim 15, further comprising a radio frequency (RF) generator, the RF generator configured to provide RF current on the outer wall of the coil, the RF current generating an RF electric field in the processing zone of the vacuum chamber.

17. The apparatus of claim 16, wherein the passageway is configured to receive thermal coupling fluid, and the inner space is configured to receive thermal coupling gas, the thermal coupling gas coupling the thermal coupling fluid to the outer wall of the coil.

18. The apparatus of claim 12, wherein the vacuum chamber comprises an electrostatic chuck (ESC) supporting the substrate, the ESC comprising a ceramic edge ring, the ceramic edge ring including a second plurality of thermal management constructed using copper-based powder or steel-based powder, wherein the second plurality of thermal management channels form a pattern within the ceramic edge ring and are configured to receive a cooling fluid.

19. A component for a semiconductor-processing chamber, the component fabricated by a process comprising: printing, using an additive manufacturing process, a green part corresponding to the component, the green part comprising a first binder with a first type of powdered material and a second binder with a second type of powdered material, the green part further comprising: a body formed by the first type of powdered material; and a plurality of thermal management channels formed by the second type of powdered material, the plurality of thermal management channels enclosed within the body of the green part; debinding the green part to remove the first binder and the second binder; and sintering the first type of powdered material and the second type of powdered material of the green part after the debinding to form the component for the semiconductor-processing chamber.

20. The component of claim 19, wherein printing the green part further comprises: printing, using the additive manufacturing process, the plurality of thermal management channels to form a coil within the body.

21. The component of claim 19, wherein the thermal management channels are configured to receive thermal coupling fluid for managing surface temperature of at least one surface of the semiconductor processing chamber.

22. The component of claim 19, wherein the component is a pinnacle assembly of the semiconductor-processing chamber, the first type of powdered material is aluminum powder, and the second type of powdered material is copper powder or copper alloy powder.

23. The component of claim 22, wherein the plurality of thermal management channels form a coil within the body, and wherein printing the green part further comprises: printing, using the additive manufacturing process, an outer wall and an inner wall of the coil, the inner wall being decoupled from the outer wall, forming an inner space of the coil between the outer wall and the inner wall.

24. The component of claim 23, wherein printing the green part further comprises: printing, using the additive manufacturing process, an inlet portion coupled to the outer wall, the inlet portion including a channel extending into the inner space configured to receive thermal coupling gas.

25. The component of claim 19, wherein the component is a chamber assembly of the semiconductor-processing chamber, the first type of powdered material is an aluminum-based powder, and the second type of powdered material is steel-based powder.

26. The component of claim 25, wherein printing the green part comprises: printing the plurality of thermal management channels to form a pattern within the body of the green part.

27. The component of claim 26, wherein the plurality of thermal management channels includes a first set of thermal management channels configured to receive a heating fluid and a second set of thermal management channels configured to receive a cooling fluid.

28. The component of claim 27, wherein the pattern is one of: a bifilar helix-style structure including the first and second set of thermal management channels; a body-centered cubic (BCC) lattice structure; and a diamond-centered cubic (DCC) lattice structure.