WO2022199536A1 - 铝合金和电子设备及铝合金的制备方法 - Google Patents

铝合金和电子设备及铝合金的制备方法 Download PDF

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Publication number
WO2022199536A1
WO2022199536A1 PCT/CN2022/082057 CN2022082057W WO2022199536A1 WO 2022199536 A1 WO2022199536 A1 WO 2022199536A1 CN 2022082057 W CN2022082057 W CN 2022082057W WO 2022199536 A1 WO2022199536 A1 WO 2022199536A1
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aluminum alloy
die
casting
aluminum
mass percentage
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PCT/CN2022/082057
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English (en)
French (fr)
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范理
王�华
胡邦红
庞礼
严寒
杨晓军
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华为技术有限公司
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Priority to EP22774195.6A priority Critical patent/EP4299778A1/en
Publication of WO2022199536A1 publication Critical patent/WO2022199536A1/zh
Priority to US18/471,511 priority patent/US20240011130A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D21/00Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
    • B22D21/02Casting exceedingly oxidisable non-ferrous metals, e.g. in inert atmosphere
    • B22D21/04Casting aluminium or magnesium
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C21/00Alloys based on aluminium
    • C22C21/02Alloys based on aluminium with silicon as the next major constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/02Making non-ferrous alloys by melting
    • C22C1/026Alloys based on aluminium
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/02Making non-ferrous alloys by melting
    • C22C1/03Making non-ferrous alloys by melting using master alloys
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/04Metal casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • the present application relates to the field of aluminum alloys, in particular to an aluminum alloy and electronic equipment and a method for preparing the aluminum alloy.
  • the die-casting material used to prepare the die-casting shell is required to have high thermal conductivity; on the other hand, the structure of the die-casting shell needs to be improved, such as designing a large number of complex thin-walled heat dissipation Teeth, high and low bosses and deep cavity structure, so that the die-casting shell has good thermal conductivity.
  • the die-casting shell needs to be made of various structures that are conducive to heat dissipation, and the die-casting shell needs to be integrally die-casted during preparation, the die-casting material needs to have good casting performance in addition to high thermal conductivity.
  • the commonly used die-casting materials for communication products are die-casting aluminum alloys, and the existing die-casting aluminum alloys are mainly eutectic or near-eutectic Al-Si series alloys. Strength requirements, but the thermal conductivity is indeed relatively low, and the thermal conductivity is generally between 90 and 150W/(m K).
  • Typical die-casting aluminum alloys include ADC12 alloy (Japanese grade, equivalent to domestic alloy YL113) and EU standard EN 43500 Alloys, where ADC stands for Aluminum-Alloy Die Castings.
  • ADC12 alloy has excellent formability and mechanical properties, but the thermal conductivity in the die-cast state is only 96W/(m ⁇ K), and the corrosion resistance is low, which can no longer meet the heat dissipation and environmental application requirements of current communication products.
  • the EN 43500 alloy has excellent formability, mechanical properties and corrosion resistance, but the thermal conductivity in the die-cast state is about 140W/(m ⁇ K), which requires heat treatment to meet the usage requirements of 160W/(m ⁇ K). The heat treatment will not only increase the manufacturing cost of the die-casting shell, but also reduce the hardness of the die-casting shell, which will lead to the phenomenon of thread slippage during the assembly process of the die-casting shell. Therefore, the development of aluminum alloys for die-casting shells with high thermal conductivity, good formability, and good corrosion resistance and mechanical properties has become an urgent problem to be solved.
  • the present application provides an aluminum alloy and electronic equipment and a preparation method of the aluminum alloy, so as to obtain an aluminum alloy with high thermal conductivity, good formability, and good corrosion resistance and mechanical properties without heat treatment. Performance die-cast aluminum alloy.
  • the present application provides an aluminum alloy, in terms of mass percentage, the aluminum alloy includes the following components: silicon 8.0%-10.0%, magnesium 0.001%-0.2%, manganese 0.001%-0.09%, iron 0.7%- 1.3%, strontium 0.001%-0.05%, the balance includes aluminum and inevitable impurities, wherein, the inevitable impurities ⁇ 0.15%.
  • the formability of the aluminum alloy is improved by adding 8.0% to 10.0% mass fraction of silicon, and at the same time, 0.001% to 0.05% mass fraction of strontium is added to control the microstructure of the aluminum alloy. size to improve the thermal conductivity of aluminum alloys.
  • 0.001%-0.2% mass fraction of magnesium, 0.001%-0.09% mass fraction of manganese and 0.7%-1.3% mass fraction of iron under the premise of meeting the requirements of die-casting formability, the lattice can be effectively reduced.
  • the aluminum alloy has certain mechanical properties (including properties such as hardness and strength) and corrosion resistance, so as to obtain an aluminum alloy with excellent comprehensive properties that can be used for die casting.
  • the thermal conductivity in the die-cast state can reach 160-170 W/(m ⁇ K)
  • the yield strength can reach 120-140 MPa
  • the hardness can reach more than 65 HBW.
  • the thermal conductivity has been able to reach the performance of the existing ADC12 alloy and EN 43500 alloy after heat treatment, and the comprehensive performance of the aluminum alloy has also exceeded ADC12 alloy and EN 43500 alloy. It can also meet the requirements of high thermal conductivity without heat treatment, and its mechanical properties can also effectively prevent the problem of slippage during the assembly process.
  • the aluminum alloy includes the following components by mass percentage: silicon 8.0%-9.5%, magnesium 0.05%-0.15%, manganese 0.001%-0.05%, iron 0.7%-1.0%, strontium 0.01% to 0.05%, the balance includes aluminum and inevitable impurities, wherein, inevitable impurities ⁇ 0.15%.
  • the aluminum alloy comprises the following components by mass percentage: silicon 8.2%-9.4%, magnesium 0.05%-0.09%, manganese 0.001%-0.02%, iron 0.72%-0.85%, Strontium is 0.02% to 0.05%, and the balance includes aluminum and inevitable impurities, wherein the inevitable impurities are less than or equal to 0.15%.
  • the aluminum alloy further includes not more than 0.1% of copper, preferably not more than 0.05%, further preferably not more than 0.02%.
  • the content of copper may be 0.001%-0.1%, preferably 0.001%-0.05%, and more preferably 0.001%-0.02% in terms of mass percentage.
  • the aluminum alloy further includes no more than 0.1% of zinc, preferably no more than 0.05%, further preferably no more than 0.02% by mass percentage.
  • the content of zinc may be 0.001%-0.1%, preferably 0.001%-0.05%, and more preferably 0.001%-0.02% in terms of mass percentage.
  • the aluminum alloy further includes, by mass percentage, the aluminum alloy further including no more than 0.1% of titanium, preferably no more than 0.05%, further preferably no more than 0.02%.
  • the content of titanium may be 0.001%-0.1%, preferably 0.001%-0.05%, and more preferably 0.001%-0.02% in terms of mass percentage.
  • the thermal conductivity is ⁇ 160W/(m ⁇ K)
  • the yield strength is ⁇ 120MPa
  • the tensile strength is ⁇ 200MPa
  • the elongation is ⁇ 2%
  • the Brinell is ⁇ 2%.
  • the hardness is 60HBW-80HBW
  • the corrosion rate is less than or equal to 4.5mg/(dm 2 ⁇ d).
  • the aluminum alloy in the die-cast state has a thermal conductivity of 160-170 W/(m ⁇ K), a yield strength of 120-140 MPa, a tensile strength of ⁇ 210 MPa, and an elongation of ⁇ 4%, hardness ⁇ 65HBW, corrosion rate ⁇ 4.5mg/(dm 2 ⁇ d).
  • the die-casting state of the aluminum alloy is the state of the aluminum alloy formed after the alloy melt is die-casted; in the die-casting state, the aluminum alloy is not heat-treated.
  • thermal conductivity ⁇ 180W/(m ⁇ K)
  • yield strength ⁇ 100MPa
  • tensile strength ⁇ 180MPa
  • elongation ⁇ 2%
  • Brinell hardness 60HBW-80HBW
  • corrosion rate ⁇ 4.5mg/(dm 2 ⁇ d).
  • the thermal conductivity is greater than or equal to 180W/(m ⁇ K)
  • the yield strength is 110-120MPa
  • the tensile strength is greater than or equal to 190MPa
  • the elongation is greater than or equal to 4%
  • the hardness is greater than or equal to 60HBW, corrosion rate ⁇ 4.5mg/(dm 2 ⁇ d).
  • the aluminum alloy of the embodiments of the present application also has good fluidity, so that the aluminum alloy has good formability and reduces forming defects. It can achieve better comprehensive performance to meet the requirements of preparing large-scale die-casting structural parts.
  • the present application provides a method for preparing the aluminum alloy of the first aspect of the present application, comprising: mixing and melting raw materials weighed according to the components of the aluminum alloy, and then performing die-casting.
  • the obtained aluminum alloy has a thermal conductivity of 160-170 W/(m ⁇ K), a yield strength of 120-140 MPa, and a tensile strength of ⁇ 210MPa, elongation ⁇ 4%, hardness ⁇ 65HBW, corrosion rate ⁇ 4.5mg/(dm 2 ⁇ d).
  • the thermal conductivity of the aluminum alloy is much higher than that of the existing ADC12 alloy, which is 96W/(m ⁇ K), and the corrosion rate is much lower than that of the ADC12 alloy, which is 34mg/(dm 2 ⁇ d).
  • the strength and hardness are comparable to the corresponding parameters of ADC12 alloy.
  • the thermal conductivity of the aluminum alloy is also higher than that of the EN 43500 alloy by 140 W/(m ⁇ K), and its mechanical properties are comparable to the corresponding parameters of the EN 43500 alloy. Therefore, even if the aluminum alloy of the present application is not subjected to heat treatment, only the thermal conductivity and mechanical properties in the die-cast state can meet the requirements of the die-cast aluminum alloy, which can effectively save costs and avoid the reduction of hardness.
  • the method further includes the step of heat treatment.
  • the aluminum alloy after die-casting can be heat-treated to further improve the thermal conductivity of the aluminum alloy.
  • the temperature of the heat treatment is 180-350°C, preferably 200-320°C, more preferably 240-280°C; the heat-treatment time is 0.5-6h, preferably 1-4h, and further It is preferably 2 to 3 hours.
  • the heat treatment process can also maintain a high hardness of the aluminum alloy, so as to meet the assembly requirements of die castings and prevent the problem of thread slippage.
  • the present application provides a die casting, which is prepared by using the aluminum alloy of the first aspect of the present application or prepared by using the method of the second aspect of the present application.
  • the aluminum alloy of the present application can be used to prepare various types of die-casting parts, such as die-casting shells, die-casting bases, die-casting auto parts, die-casting air-conditioning parts, die-casting building parts, and the like.
  • die-casting parts such as die-casting shells, die-casting bases, die-casting auto parts, die-casting air-conditioning parts, die-casting building parts, and the like.
  • the specific selection can be made according to the actual application, and the specific type of the die casting is not limited here.
  • the die-casting casing formed by using the aluminum alloy of the first aspect of the present application can be used as an encapsulation shell of the communication device, and it is also convenient to conduct the internal heat of the communication device while playing the role of encapsulation.
  • the present application provides an electronic device including a casing, wherein the casing includes the die casting of the third aspect of the present application.
  • the die-cast part is, for example, a die-cast housing.
  • the electronic equipment may be, for example, communication equipment.
  • the box body of the large-scale input and output system, the box body of the radio frequency remote unit and the box body of the active antenna processing unit can be composed of the die-casting shell of the present application.
  • the electronic equipment in the embodiments of the present application may include electronic computers, numerical control equipment, program-controlled equipment, air conditioners, refrigerators, microwave ovens and other equipment in addition to communication equipment. Formed as a die-cast housing.
  • Fig. 1 is the preparation process schematic diagram of the aluminum alloy of an embodiment of the application
  • FIG. 2 is a schematic structural diagram of a die-casting shell provided by an embodiment of the present application.
  • references in this specification to "one embodiment” or “some embodiments” and the like mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
  • appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in other embodiments,” etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless specifically emphasized otherwise.
  • the terms “including”, “including”, “having” and their variants mean “including but not limited to” unless specifically emphasized otherwise.
  • the heat dissipation requirements of the packaging shell of such electronic equipment are also constantly increasing.
  • the commonly used die-casting aluminum alloys for communication products are ADC12 alloy and EN 43500 alloy.
  • the die-cast thermal conductivity of ADC12 alloy is only 96W/(m ⁇ K)
  • the die-cast thermal conductivity of EN 43500 alloy is about 140W/(m ⁇ K)
  • the thermal conductivity of EN 43500 alloy is higher than that of ADC12 alloy. It has been greatly improved, but the EN 43500 alloy is still difficult to meet the requirements of communication products for the use of large die castings.
  • an aluminum alloy which in terms of mass percentage, includes the following components: 8.0%-10.0% of silicon, 0.001%-0.2% of magnesium, 0.001%-0.09% of manganese, Iron 0.7% to 1.3%, strontium 0.001% to 0.05%, and the balance includes aluminum and inevitable impurities, wherein the inevitable impurities ⁇ 0.15%.
  • the base material is aluminum, and the sum of the mass percentages of the components is 100% by mass percentage.
  • the inevitable impurities can include impurities introduced by the raw materials of each component and impurities introduced by various production equipment and tooling during the preparation process, such as but not limited to chromium, nickel, beryllium, calcium, cadmium, cobalt, One or a combination of at least two of lithium, zirconium, vanadium, boron, tin, lead, phosphorus, molybdenum, or sodium.
  • the content of unavoidable impurities should be controlled below 0.15%.
  • the content of impurities finally introduced can be controlled by controlling the purity of raw materials and the cleanliness of equipment during the preparation process.
  • the content of silicon is controlled at 8.0%-10.0%, so as to improve the thermal conductivity of the aluminum alloy and ensure the formability of the aluminum alloy;
  • Aluminum alloy has certain mechanical properties and corrosion resistance; then by adding appropriate strontium element, the size of eutectic silicon in aluminum alloy is controlled, thereby improving thermal conductivity.
  • the thermal conductivity is ⁇ 160W/(m ⁇ K)
  • the yield strength is ⁇ 120MPa
  • the tensile strength is ⁇ 200MPa
  • the elongation is ⁇ 2%
  • the Brinell hardness is 60HBW -80HBW
  • corrosion rate ⁇ 4.5mg/(dm 2 ⁇ d).
  • the thermal conductivity can be 160-170 W/(m ⁇ K)
  • the yield strength is 120-140 MPa
  • the tensile strength is ⁇ 210 MPa
  • the elongation is ⁇ 4 %
  • hardness ⁇ 65HBW
  • corrosion rate ⁇ 4.5mg/(dm 2 ⁇ d).
  • the thermal conductivity is greater than or equal to 180W/(m ⁇ K)
  • the yield strength is greater than or equal to 100MPa
  • the tensile strength is greater than or equal to 180MPa
  • the elongation is greater than or equal to 2%
  • the Brinell hardness is 60HBW-80HBW
  • the corrosion rate ⁇ 4.5mg/(dm 2 ⁇ d).
  • the aluminum alloy of the embodiment of the present application after heat treatment, has a thermal conductivity of ⁇ 180 W/(m ⁇ K), a yield strength of 110-120 MPa, a tensile strength of ⁇ 190 MPa, and an elongation of ⁇ 4%, hardness ⁇ 60HBW, corrosion rate ⁇ 4.5mg/(dm 2 ⁇ d).
  • the aluminum alloys in the embodiments of the present application can meet the requirements for product use with thermal conductivity ⁇ 160W/(m ⁇ K) without heat treatment, and for electronic equipment with high thermal conductivity requirements, it can be shortened.
  • the production process of the die-casting shell saves the manufacturing cost of the die-casting shell.
  • the aluminum alloys of the embodiments of the present application can be heat-treated to further meet the requirements of electronic devices that require higher thermal conductivity.
  • adding silicon can effectively improve the fluidity of the aluminum alloy, but with the increase of the silicon element, the thermal conductivity of the aluminum alloy will decrease.
  • the content of silicon is controlled at 8.0%-10.0%, which can improve the fluidity of the aluminum alloy and at the same time can effectively reduce the formation of primary silicon phase and eutectic silicon phase in the aluminum alloy, so as to improve the aluminum alloy. thermal conductivity. Therefore, the content of silicon in the embodiments of the present application can make the aluminum alloy have better fluidity to meet the requirements of the aluminum alloy formability, and at the same time make the aluminum alloy have higher thermal conductivity.
  • the content of silicon is 8.0% to 9.5%, in a further preferred embodiment, the content of silicon is 8.2% to 9.4%, and in a further preferred embodiment, the content of silicon is 8.7% ⁇ 9.4%.
  • the mass proportion of silicon in the aluminum alloy is typically but not limited to 8.0%, 8.1%, 8.2%, 8.3%, 8.4%, 8.5%, 8.6%, 8.7%, 8.8%, 8.9% %, 9.0%, 9.1%, 9.2%, 9.3%, 9.4%, 9.5%, 9.6%, 9.7%, 9.8%, 9.9% or 10.0%.
  • Magnesium will be solid-dissolved in the aluminum matrix in the die-cast state, which can effectively improve the strength of the aluminum alloy.
  • magnesium and silicon can form a dispersed Mg 2 Si precipitation phase, which can hinder the movement of dislocations, thereby improving the mechanical properties of the material.
  • the mass proportion of magnesium in the aluminum alloy is typically but not limited to 0.001%, 0.002%, 0.005%, 0.008%, 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, 0.06% %, 0.07%, 0.08%, 0.09%, 0.10%, 0.11%, 0.12%, 0.13%, 0.14%, 0.15%, 0.16%, 0.17%, 0.18%, 0.19% or 0.2%.
  • the addition of manganese can effectively change the morphology of the iron-containing phase in the microstructure of the aluminum alloy and improve the mechanical properties of the aluminum alloy.
  • the addition amount of manganese element in the range of 0.001-0.09%, the mechanical properties of the aluminum alloy can be improved without reducing the thermal conductivity of the aluminum alloy.
  • the manganese content is controlled within the range of 0.001% to 0.05%, and when it is further controlled within the range of 0.001% to 0.02%, the overall effect obtained is better.
  • the mass proportion of manganese in the aluminum alloy is typically but not limited to 0.001%, 0.002%, 0.005%, 0.008%, 0.01%, 0.015%, 0.02%, 0.025%, 0.03%, 0.035 %, 0.04%, 0.045%, 0.05%, 0.055%, 0.06%, 0.065%, 0.07%, 0.075%, 0.08%, 0.085% or 0.09%.
  • the addition of iron can improve the demoulding ability of the aluminum alloy after die-casting.
  • the die-casting of the aluminum alloy can be easily demolded, and the aluminum alloy can be kept relatively high. High mechanical properties.
  • the iron content is controlled within the range of 0.7% to 1.0%, and further controlled within the range of 0.72% to 0.85%, the brittle needle-like phase containing iron in the microstructure of the aluminum alloy can be effectively reduced, thereby It also helps to improve the mechanical properties of aluminum alloys.
  • the mass proportion of iron in the aluminum alloy is typically but not limited to 0.7%, 0.72%, 0.74%, 0.76%, 0.78%, 0.8%, 0.82%, 0.85%, 0.87%, 0.9% , 0.92%, 0.95%, 0.98%, 1.0%, 1.05%, 1.1%, 1.12%, 1.15%, 1.17%, 1.2%, 1.22%, 1.25%, 1.28% or 1.3%.
  • strontium element can effectively control the size of the eutectic silicon phase and reduce the hindrance of the eutectic silicon relative to the movement of free electrons, thereby achieving the purpose of improving the thermal conductivity of the aluminum alloy.
  • strontium content is controlled within the range of 0.01% to 0.05%, and further controlled within the range of 0.02% to 0.05%, an aluminum alloy with better thermal conductivity can be obtained.
  • the mass proportion of strontium in the aluminum alloy is typically but not limited to 0.001%, 0.002%, 0.005%, 0.008%, 0.01%, 0.015%, 0.02%, 0.025%, 0.03%, 0.035 %, 0.04%, 0.045% or 0.05%.
  • the aluminum alloy further includes not more than 0.1% copper, preferably not more than 0.05%, and more preferably not more than 0.02% by mass percentage.
  • the content of copper may be 0.001%-0.1%, preferably 0.001%-0.05%, more preferably 0.001%-0.02% in terms of mass percentage. Adding copper element can effectively improve the mechanical properties of the aluminum alloy. By controlling the amount of copper added within the above range, the aluminum alloy can maintain a high thermal conductivity on the basis of obtaining excellent mechanical properties. and corrosion resistance.
  • the mass proportion of copper in the aluminum alloy is typically but not limited to 0.001%, 0.002%, 0.005%, 0.008%, 0.01%, 0.015%, 0.02%, 0.025%, 0.03%, 0.035 %, 0.04%, 0.045%, 0.05%, 0.055%, 0.06%, 0.065%, 0.07%, 0.075%, 0.08%, 0.085%, 0.09%, 0.095%, or 0.1%.
  • the aluminum alloy further includes no more than 0.1% of zinc, preferably no more than 0.05%, and more preferably no more than 0.02% by mass percentage.
  • the content of zinc may be 0.001% to 0.1%, preferably 0.001% to 0.05%, more preferably 0.001% to 0.02% by mass percentage. The addition of zinc can improve the strength of the alloy through solid solution strengthening.
  • the mass proportion of zinc in the aluminum alloy is typically but not limited to 0.001%, 0.002%, 0.005%, 0.008%, 0.01%, 0.015%, 0.02%, 0.025%, 0.03%, 0.035 %, 0.04%, 0.045%, 0.05%, 0.055%, 0.06%, 0.065%, 0.07%, 0.075%, 0.08%, 0.085%, 0.09%, 0.095%, or 0.1%.
  • the aluminum alloy further includes no more than 0.1% of titanium, preferably no more than 0.05%, and more preferably no more than 0.02% by mass percentage.
  • the content of titanium may be 0.001%-0.1% by mass percentage, preferably 0.001%-0.05%, and more preferably 0.001%-0.02%.
  • the addition of titanium element can generate Al 3 Ti phase in the aluminum alloy casting process to refine the grains and improve the strength and plasticity of the alloy.
  • the mass proportion of titanium in the aluminum alloy is typically but not limited to 0.001%, 0.002%, 0.005%, 0.008%, 0.01%, 0.015%, 0.02%, 0.025%, 0.03%, 0.035 %, 0.04%, 0.045%, 0.05%, 0.055%, 0.06%, 0.065%, 0.07%, 0.075%, 0.08%, 0.085%, 0.09%, 0.095%, or 0.1%.
  • the formed microstructure may include the following phase structures: hypoeutectic ⁇ -Al phase, eutectic ⁇ -Al phase, eutectic Si phase and intermetallic phase compound.
  • the phase in the organizational structure refers to the components with the same chemical composition, the same atomic aggregation state and uniform and continuous properties, and the interfaces are separated between different phases.
  • Intermetallic compounds refer to compounds formed by metals and metals, and metals and metalloids.
  • the intermetallic compounds mainly include Mg 2 Si phase, Al 3 Fe phase, Al-Si-Fe, Al-Si-Fe-Mn phase; when the composition of the aluminum alloy also includes In the case of Cu element, the intermetallic compound also includes Al 2 Cu and Al-Cu-Fe ternary compound phase structure and the like.
  • iron, copper, magnesium, manganese, zinc, and titanium can be partially dissolved in the hypoeutectic ⁇ -Al phase and the eutectic ⁇ -Al phase in the form of atoms, the Mg 2 Si phase is dispersed uniformly, and the intermetallic compounds can be distributed At the interface of several phase structures or within the hypoeutectic ⁇ -Al phase and the eutectic ⁇ -Al phase.
  • various alloying elements are usually added to pure metal aluminum to achieve specific performance requirements, but the addition of alloying elements may reduce the orderly arrangement of the material lattice, and some will The lattice distortion and the periodic movement of electrons are limited, thereby reducing the thermal conductivity of the material.
  • the combination of alloying elements is balanced in the composition design.
  • the aluminum alloy can meet the high heat loss density of complex structures and the forming and heat dissipation requirements of high-power communication products. , which can solve the problem that the existing die-casting aluminum alloy must increase the heat treatment process to make the thermal conductivity meet the requirements of use.
  • the aluminum alloys of the embodiments of the present application through rational design of the composition of the aluminum alloys, greatly improve the thermal conductivity of the aluminum alloys in the die-cast state, and realize the heat treatment-free process without reducing the thermal conductivity target of the product. Therefore, the purpose of effectively simplifying the processing technology and saving production costs can be achieved.
  • the embodiments of the present application also provide a method for preparing the aluminum alloys of the above-mentioned embodiments of the present application.
  • the method includes: mixing and melting raw materials weighed according to the components of the above-mentioned aluminum alloys of the above-mentioned embodiments of the present application, and then performing a die-casting forming process.
  • the raw materials are weighed according to the components of the aluminum alloys in the above-mentioned embodiments of the present application, and each raw material is mixed and melted and then subjected to die-casting treatment to obtain thermal conductivity ⁇ 160 W/(m ⁇ K), yield strength ⁇ 120 MPa, and tensile strength ⁇ 200MPa, elongation ⁇ 2%, Brinell hardness 60HBW-80HBW, corrosion rate ⁇ 4.5mg/(dm 2 ⁇ d).
  • the aluminum alloy obtained after die-casting treatment has the advantages of high thermal conductivity and high mechanical properties even without heat treatment, and can be applied to die-cast housings in electronic equipment. At the same time, the aluminum alloy of this composition has good formability and can be used for die-casting complex thin-walled shells.
  • FIG. 1 is a schematic diagram of the preparation process flow of an aluminum alloy according to an embodiment of the present application.
  • the components of the aluminum alloy according to the above-mentioned embodiments of the present application will be weighed.
  • a die-casting process is performed, which may specifically include the following steps:
  • Step S11 after batching according to the composition of the aluminum alloy in the embodiment of the present application, the raw material is melted in a melting furnace, and an alloy melt is obtained after refining by introducing an inert gas such as nitrogen or argon during the melting process;
  • Step S12 casting the alloy melt into an ingot to form an alloy ingot
  • step S13 the alloy ingot is melted, and die-casting is performed by liquid die-casting, semi-solid die-casting, vacuum die-casting or squeeze-casting to form an aluminum alloy.
  • the process parameters of liquid die casting, semi-solid die casting, vacuum die casting, and squeeze casting are not specifically limited, and can be selected and set according to the selected raw materials and actual equipment parameters.
  • the method further includes:
  • step S14 heat treatment is performed on the aluminum alloy formed after die casting.
  • Aluminum alloys with higher thermal conductivity can be obtained through heat treatment to meet the needs of electronic products with higher requirements for guiding performance.
  • the temperature of heat treatment is 180-350°C, preferably 200-320°C, more preferably 260-320°C; the time of heat treatment is 0.5-6h, preferably 1-4h, more preferably 2-3h.
  • the concentration of vacancies and other point defects in the alloy can be significantly reduced, the lattice distortion of the alloy can be reduced, and the thermal conductivity of the alloy can be further improved.
  • Embodiments 1-8 are respectively a die-casting aluminum alloy, and the composition ratio of the aluminum alloys of each embodiment is listed in Table 1.
  • the preparation methods of the aluminum alloys of Examples 1-8 are as follows: According to the composition of the die-casting aluminum alloys of each embodiment in Table 1, the raw materials are weighed, pure aluminum A00 aluminum ingots (purity 99.7%), pure magnesium ingots, and Al-50Si master alloys. , Al-75Fe master alloy, Al-10Sr master alloy, aluminum-manganese master alloy, and optional master alloys such as copper, zinc, and titanium are batched, smelted into alloy liquid, and then cast to form alloy ingots, and then the alloy ingots are melted, using Die casting aluminum alloy is formed by die casting method.
  • the raw materials of the above-mentioned components are only examples, but are not limited to the above-mentioned raw materials, and those skilled in the art can select the required raw materials according to the specific components.
  • the comparative example is a commercial ADC12 alloy, which mainly includes the following components: silicon 9.6% ⁇ 12.0%, magnesium ⁇ 0.3%, manganese ⁇ 0.5%, iron ⁇ 1.0%, strontium 0%, copper 1.5% ⁇ 3.5%, Zinc ⁇ 1%, titanium 0%, the balance is aluminum.
  • the comparative example is a commercially available EN 43500 alloy, which includes the following components: silicon 9.5% to 11.5%, magnesium 0.1% to 0.5%, manganese 0.5% to 0.8%, iron ⁇ 0.15%, strontium 0%, copper ⁇ 0.1%, the balance is aluminum.
  • Comparative Examples 3-8 are respectively a die-casting aluminum alloy, and the composition ratio of the aluminum alloys of each embodiment is listed in Table 2.
  • Thermal conductivity test The laser scintillation method (ASTM E 1461-01) is used for testing, and the sample size is ⁇ 12.7mm ⁇ 3mm; the specific heat refers to ISO11357 and ASTM E1269; the density refers to ISO 1183-1:2004.
  • the hardness test samples are cut from the die-casting aluminum alloys of each embodiment and the comparative example.
  • the sample surface is a smooth surface, and there should be no oxides and contaminants. During the preparation of the sample, the influence of heat or cold working on the surface hardness of the sample should be avoided.
  • Corrosion resistance test The corrosion resistance is expressed by the corrosion rate.
  • the test method of the corrosion rate follows the standard GB/T19292.4 and the standard GB/T 16545.
  • the size of the sample is 120 ⁇ 100 ⁇ 5mm.
  • the surrounding edges of the corrosion rate test specimens were wrapped with tape paper.
  • the average corrosion rate was calculated by the weight change before and after the salt spray.
  • Examples 1-8 and Comparative Examples 1 and 2 It can be seen from the comparison data of Examples 1-8 and Comparative Examples 1 and 2 that the corresponding thermal conductivity of the die-casting aluminum alloys provided in Examples 1-8 of the present application are all the same without heat treatment. Higher than the unheated ADC12 alloy and EN 43500 alloy, the thermal conductivity of the unheated ADC12 alloy is only 96W/(m ⁇ K), while the The thermal conductivity can reach 160W/(m ⁇ K). In addition, the yield strength, tensile strength, elongation and hardness of Examples 1-8 of the present application can all meet the requirements of the current communication equipment die-casting shell.
  • Comparative Example 6 the elongation of Comparative Example 6 is lower. It can be proved from the relevant tests of Example 5 and Comparative Examples 3-6 that the comprehensive performance of the die-casting aluminum alloy of the present application is not the result of the action of a single component, but the various components in the die-casting aluminum alloy of the present application. combined results.
  • the die-casting housing of the radio frequency remote unit in the communication equipment is formed by die-casting the aluminum alloys of the corresponding components in Examples 1-8 and Comparative Examples 1-6 respectively.
  • the structure of the die-casting housing 1 includes thin Wall fins 11 .
  • the number of samples corresponding to each example and comparative example is 30 pieces, and the material shortage characteristics on the thin-walled radiating teeth 11 of each sample are counted, and the three-dimensional maximum size of each material shortage opening is measured to evaluate the formability of the aluminum alloy.
  • the three-dimensional maximum dimension (R) is described in three categories: 0.5mm ⁇ R ⁇ 1.0mm; 1.0mm ⁇ R ⁇ 3mm; R>3mm. Among them, 0.5mm ⁇ R ⁇ 1.0mm represents the best formability, 1.0mm ⁇ R ⁇ 3mm takes the second place, and R>3mm represents the worst formability.
  • the statistical results are listed in Table 4. Inside the die-cast housing is the main body of the remote radio unit, and the main body may include components such as a processing unit (for example, a processor) or a power module.
  • the total number of defects and the number of defects of each size in the aluminum alloys of Examples 1-8 of the present application are basically the same as those of Comparative Example 1 and Comparative Example 2, which means that the aluminum alloys of Examples 1 to 8 of the present application have the composition distribution ratio of the examples of the present application.
  • the formability of the aluminum alloy can reach the level of the existing ADC12 alloy and EN43500 alloy.
  • the aluminum alloys corresponding to Comparative Examples 5 to 8, especially the aluminum alloys corresponding to Comparative Examples 5, 7 and 8 have significantly more defects. Basically, the formability of the resulting aluminum alloy will be affected when the component content is changed.
  • the thermal conductivity of the aluminum alloys of Examples 1-8 of the present application in the die-cast state can exceed the thermal conductivity of the existing ADC12 alloy and EN 43500 alloy , reaching 160W/(m ⁇ K), and the formability of the aluminum alloys of Examples 1-8 can basically reach the forming level of the ADC12 alloy and the EN43500 alloy. Therefore, the aluminum alloys of the embodiments of the present application can realize the preparation of large, complex and thin aluminum alloys. At the same time, the obtained die-casting aluminum alloy can have higher thermal conductivity.
  • Example 2 180°C/2h ⁇ 3h
  • Example 3 260°C/2h ⁇ 3h
  • Example 4 320°C/2h ⁇ 3h
  • Example 5 320°C/2h ⁇ 3h
  • Example 6 260°C/2h ⁇ 3h
  • Example 7 260°C/2h ⁇ 3h
  • Example 8 180°C/2h ⁇ 3h Comparative Example 1 320°C/2h ⁇ 3h Comparative Example 2 320°C/2h ⁇ 3h Comparative Example 3 320°C/2h ⁇ 3h Comparative Example 4 320°C/2h ⁇ 3h Comparative Example 5 320°C/2h ⁇ 3h Comparative Example 6 320°C/2h ⁇ 3h Comparative Example 7 320°C/2h ⁇ 3h Comparative Example 8 320°C/2h ⁇ 3h
  • the die-casting aluminum alloys of the embodiments of the present application have both high thermal conductivity, excellent formability, high corrosion resistance and certain mechanical properties through rational design of components. It is suitable for the preparation of communication product parts with complex structures, and can solve the problem that in the prior art, the die-casting aluminum alloy must increase the heat treatment process to improve the thermal conductivity.
  • the numerical range "a-b” represents an abbreviated representation of any combination of real numbers between a and b, and includes a and b, where both a and b are real numbers.
  • the numerical range "6-22" indicates that all real numbers between “6-22” have been listed in the text, and "6-22" is just an abbreviated representation of the combination of these numerical values.
  • the disclosure of a “range” herein, in the form of a lower limit and an upper limit may be one or more lower limits, and one or more upper limits, respectively.
  • each reaction or operation step can be carried out sequentially or in sequence. Preferably, the reaction methods herein are performed sequentially.

Abstract

本申请提供一种铝合金和电子设备及铝合金的制备方法。该铝合金,按质量百分比计包括以下组分:硅8.0%~10.0%,镁0.001%~0.2%,锰0.001%~0.09%,铁0.7%~1.3%,锶0.001%~0.05%,余量包括铝以及不可避免的杂质,其中,不可避免的杂质≤0.15%。该铝合金在不需热处理的条件下即具有热导率高、成型性能好,兼具良好的耐蚀性能和力学性能的特点。

Description

铝合金和电子设备及铝合金的制备方法
相关申请的交叉引用
本申请要求在2021年03月22日提交中国专利局、申请号为202110304145.0、申请名称为“铝合金、压铸件和电子设备及铝合金的制备方法”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及铝合金领域,具体涉及一种铝合金和电子设备及铝合金的制备方法。
背景技术
随着通信技术的发展和5G网络的逐渐普及,通信产品向大功率、小型化、轻量化方向不断发展,从而对通信产品等电子设备的压铸壳体的散热能力提出了更高的要求。为提高压铸壳体的散热能力,一方面要求用于制备压铸壳体的压铸材料需具备高热导率,另一方面,还需对压铸壳体的结构做改进,如设计大量的复杂薄壁散热齿、高低凸台和深腔结构,以使压铸壳体具有良好的导热性能。由于压铸壳体需做各种有利于散热的结构,并且制备时压铸壳体需一体压铸成型,因此压铸材料除需具备高热导率外,还需具备良好的铸造成型性能。
目前,常用的通信产品用压铸材料为压铸铝合金,而现有的压铸铝合金主要为共晶型或近共晶型Al-Si系列合金,有的铝合金虽力学性能较好,满足装配的强度要求,但是热导率确比较低,热导率普遍在90~150W/(m·K)之间,典型压铸铝合金有ADC12合金(日本牌号,相当于国产合金YL113)和欧盟标准EN 43500合金,其中ADC表示Aluminum-Alloy Die Castings。ADC12合金成型性能和力学性能优异,但压铸态下的热导率仅为96W/(m·K),且耐蚀性能偏低,已不能满足现阶段通讯产品的散热和环境应用需求。EN 43500合金的成型性能、力学性能和耐蚀性能优异,但压铸态下的热导率约为140W/(m·K),需要热处理才能达到160W/(m·K)的使用要求。而热处理除了会增加压铸壳体的制备成本外,还会降低压铸壳体的硬度,进而会导致压铸壳体在装配过程中容易出现螺纹滑牙现象。因此,研发具有热导率高、成型性能好,兼具良好的耐蚀性能和力学性能的压铸壳体用铝合金成为亟待解决的问题。
发明内容
本申请提供了一种铝合金和电子设备及铝合金的制备方法,以在不需热处理的条件下即可获得一种具有热导率高、成型性能好,兼具良好的耐蚀性能和力学性能的压铸铝合金。
第一方面,本申请提供一种铝合金,按质量百分比计,该铝合金包括以下组分:硅8.0%~10.0%,镁0.001%~0.2%,锰0.001%~0.09%,铁0.7%~1.3%,锶0.001%~0.05%,余量包括铝以及不可避免的杂质,其中,不可避免的杂质≤0.15%。
本申请提供的铝合金,通过添加8.0%~10.0%质量分数的硅,以提高铝合金的成型性能,同时配合添加0.001%~0.05%质量分数的锶,以控制铝合金组织结构中共晶硅的尺寸, 以提高铝合金的热导率。同时,通过配合添加0.001%~0.2%质量分数的镁、0.001%~0.09%质量分数的锰和0.7%~1.3%质量分数的铁,在满足压铸成型性能要求的前提下,能够有效减少晶格畸变,减少位错,在提高热导率的同时,使铝合金具有一定的力学性能(包括硬度和强度等性能)和耐蚀性,从而获得综合性能优良的可用于压铸成型的铝合金。本申请的铝合金在未进行热处理之前,其在压铸态时的热导率可达到160~170W/(m·K),屈服强度可达到120~140MPa,硬度可达到65HBW以上,该铝合金的热导率已经能够达到现有的经热处理后的ADC12合金和EN 43500合金的性能,并且该铝合金的综合性能也已超过ADC12合金和EN 43500合金,由此,本申请的铝合金,即使在不进行热处理的条件下也能够达到高导热的要求,同时其力学性能也能够有效防止装配过程中出现滑牙问题。
在本申请一种优选实施方式中,该铝合金包括以下质量百分比的组分:硅8.0%~9.5%,镁0.05%~0.15%,锰0.001%~0.05%,铁0.7%~1.0%,锶0.01%~0.05%,余量包括铝以及不可避免的杂质,其中,不可避免的杂质≤0.15%。在本申请一种进一步优选实施方式中,该铝合金包括以下质量百分比的组分:硅8.2%~9.4%,镁0.05%~0.09%,锰0.001%~0.02%,铁0.72%~0.85%,锶0.02%~0.05%,余量包括铝以及不可避免的杂质,其中,不可避免的杂质≤0.15%。通过优化铝合金的组分,可进一步提高铝合金的热导率和成型性能,同时使力学性能满足使用要求。
在本申请一种可选的实现方式中,按质量百分比,铝合金还包括不超过0.1%的铜,优选不超过0.05%,进一步优选不超过0.02%。在进一步优选的实现方式中,按质量百分比计,铜的含量可为0.001%~0.1%,优选为0.001%~0.05%,进一步优选为0.001%~0.02%。通过添加特定含量的铜,可与硅、镁同时作用,以进一步提高铝合金的导热性和力学性能,同时使铝合金的耐蚀性满足要求。在本申请各个实现方式中提到的“不超过”相当于“小于或等于”。
在本申请一种可选的实现方式中,按质量百分比,铝合金还包括不超过0.1%的锌,优选不超过0.05%,进一步优选不超过0.02%。在进一步优选的实现方式中,按质量百分比计,锌的含量可为0.001%~0.1%,优选为0.001%~0.05%,进一步优选为0.001%~0.02%。通过添加特定含量的锌,以提高合金元素的固溶强化作用和弥散强化作用,以进一步提高铝合金的力学性能。
在本申请一种可选的实现方式中,按质量百分比,铝合金还包括按质量百分比,铝合金还包括不超过0.1%的钛,优选不超过0.05%,进一步优选不超过0.02%。在进一步优选的实现方式中,按质量百分比计,钛的含量可为0.001%~0.1%,优选为0.001%~0.05%,进一步优选为0.001%~0.02%。通过添加特定含量的钛,可细化晶粒,以进一步提高铝合金的力学性能。
在本申请一种可选的实现方式中,铝合金在压铸态时,热导率≥160W/(m·K),屈服强度≥120MPa,抗拉强度≥200MPa,延伸率≥2%,布氏硬度为60HBW-80HBW,腐蚀速率≤4.5mg/(dm 2·d)。具体的,在本申请一种可能的实现方式中,铝合金在压铸态下,热导率为160~170W/(m·K),屈服强度120~140MPa,抗拉强度≥210MPa,延伸率≥4%,硬度≥65HBW,腐蚀速率≤4.5mg/(dm 2·d)。其中,需要说明的是,本申请中,铝合金的压铸态为合金熔体经压铸成型后形成的铝合金所处于的状态;压铸态下,铝合金并未进行热处理。
铝合金在热处理后,热导率≥180W/(m·K),屈服强度≥100MPa,抗拉强度≥180MPa,延伸率≥2%,布氏硬度60HBW-80HBW,腐蚀速率≤4.5mg/(dm 2·d)。在本申请一种可选的实现方式中,铝合金在热处理后,热导率≥180W/(m·K),屈服强度110~120MPa,抗拉强度≥190MPa,延伸率≥4%,硬度≥60HBW,腐蚀速率≤4.5mg/(dm 2·d)。
本申请实施方式的铝合金在具有高热导率、高力学性能和高硬度的基础上,还具有较好的流动性,使铝合金具有良好的成型性能,减少成型缺陷,由此,该铝合金能够达到较好的综合性能,以满足制备大型压铸结构件的要求。
第二方面,本申请提供了一种制备本申请第一方面铝合金的方法,包括:将按照铝合金的组分称取的原料混合熔融后,进行压铸成型。
按照本申请第一方面的铝合金的组分选取原料并混合熔融、压铸成型后,所得铝合金的热导率为160~170W/(m·K),屈服强度120~140MPa,抗拉强度≥210MPa,延伸率≥4%,硬度≥65HBW,腐蚀速率≤4.5mg/(dm 2·d)。该铝合金的热导率远高于现有ADC12合金的热导率96W/(m·K),腐蚀速率远低于ADC12合金的腐蚀速率34mg/(dm 2·d),屈服强度、抗拉强度和硬度与ADC12合金的相应参数相当。另外,与EN 43500合金相比,该铝合金也高于EN 43500合金的热导率140W/(m·K),其力学性能与EN 43500合金的相应参数相当。因此,本申请的铝合金即使不经过热处理,仅在压铸态下的导热性和力学性能,就能够满足压铸铝合金的需求,可有效节约成本,并避免硬度的降低。
在本申请一种可能的实现方式中,在压铸成型后,方法还包括热处理的步骤。当对压铸铝合金的导热性有更高要求时,可对压铸成型后的铝合金进行热处理,以进一步提高铝合金的热导率。
在本申请一种可能的实现方式中,热处理的温度为180~350℃,优选为200~320℃,进一步优选为240~280℃;热处理的时间为0.5~6h,优选为1~4h,进一步优选为2~3h。通过限定热处理的温度和时间,可消除铝合金内部缺陷,进一步提高其热导率。同时,该热处理工艺还可使铝合金保持较高的硬度,以满足压铸件的装配要求,防止螺纹出现滑牙的问题。
第三方面,本申请提供了一种压铸件,该压铸件利用本申请第一方面的铝合金制备得到或利用本申请第二方面的方法制备得到。
利用本申请的铝合金可用于制备各种类型的压铸件,例如压铸壳体、压铸底座、压铸汽车配件、压铸空调配件、压铸建筑配件等。具体可根据实际应用进行选择,在此不对压铸件的具体类型做出限定。
其中,利用本申请第一方面的铝合金形成的压铸壳体可作为通讯设备的封装外壳,在起到封装作用的同时,还便于将通讯设备的内部热量导出。
第四方面,本申请提供一种电子设备,该电子设备包括外壳,其中,该外壳包括本申请第三方面的压铸件。压铸件例如为压铸壳体。
其中,电子设备例如可为通讯设备,通讯设备中,大规模输入输出系统的箱体、射频拉远单元的箱体和有源天线处理单元的箱体均可利用本申请的压铸壳体组成。其中,本申请实施例的电子设备除包括通讯设备外,还可以包括电子计算机、数控设备、程控设备、空调、冰箱、微波炉等设备,上述所列电子设备的外壳均可由本申请的压铸件,如压铸壳体形成。
附图说明
图1为本申请一种实施例的铝合金的制备工艺流程示意图;
图2为本申请实施例提供的一种压铸壳体的结构示意图。
附图标记:1-压铸壳体;11-薄壁散热齿。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚,下面将结合附图对本申请作进一步地详细描述。
以下实施例中所使用的术语只是为了描述特定实施例的目的,而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样,单数表达形式“一个”、“一种”、“所述”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式,除非其上下文中明确地有相反指示。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此,在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例,而是意味着“一个或多个但不是所有的实施例”,除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”,除非是以其他方式另外特别强调。
由于通讯产品等电子设备不断向大功率、小型化和轻量化方向发展,对该类电子设备的封装壳体散热要求也不断提高。目前通信产品常用的压铸铝合金为ADC12合金和EN 43500合金。其中,ADC12合金的压铸态热导率仅为96W/(m·K),EN 43500合金的压铸态热导率约为140W/(m·K),虽然EN 43500合金的热导率较ADC12合金已有大幅提升,但EN 43500合金仍难以满足通讯产品对大型压铸件的使用要求。对EN 43500合金进行热处理后,可使其热导率提升至160W/(m·K),但是不可避免地会降低材料的力学性能,在装配过程中容易造成螺纹滑牙风险。另外,热处理工序会增加制造成本,热处理过程中的材料变形、气泡等缺陷也会影响良品率。因此,目前主流的压铸铝合金还不能同时满足通讯产品对导热性、成型性能、耐蚀性和力学性能的综合要求。
为解决上述技术问题,本申请实施例提供一种铝合金,按质量百分比计,该铝合金包括以下组分:硅8.0%~10.0%,镁0.001%~0.2%,锰0.001%~0.09%,铁0.7%~1.3%,锶0.001%~0.05%,余量包括铝以及不可避免的杂质,其中,不可避免的杂质≤0.15%。
需要说明的是,本申请实施例的铝合金,其基体材料为铝,按质量百分比,各组成成分的质量百分比之和为100%。其中,不可避免的杂质可包括由各组分原料引入的杂质和制备工艺过程中由各种生产设备以及工装具引入的杂质,例如包括但不限于铬、镍、铍、钙、镉、钴、锂、锆、钒、硼、锡、铅、磷、钼或钠中的一种或至少两种的组合。为不影响铝合金的最终性能,不可避免的杂质的含量需控制在0.15%以下,例如可通过控制原料的纯度、制备工艺过程中设备的洁净度对最终引入的杂质的含量进行控制。
本申请实施例的铝合金,通过将硅的含量控制在8.0%-10.0%,以提高铝合金热导率,并保证铝合金的成型性能;同时通过合理控制镁、锰、铁元素的含量使得铝合金具有一定力学性能和耐蚀性能;再通过添加适当的锶元素,来控制铝合金中共晶硅的尺寸,从而提 升热导率。
在本申请一种实施例中,铝合金在压铸态时,热导率≥160W/(m·K),屈服强度≥120MPa,抗拉强度≥200MPa,延伸率≥2%,布氏硬度为60HBW-80HBW,腐蚀速率≤4.5mg/(dm 2·d)。具体地,在本申请一种实施例中,铝合金在压铸态时,热导率可为160~170W/(m·K),屈服强度120~140MPa,抗拉强度≥210MPa,延伸率≥4%,硬度≥65HBW,腐蚀速率≤4.5mg/(dm 2·d)。
在本申请一种实施例中,铝合金在热处理后,热导率≥180W/(m·K),屈服强度≥100MPa,抗拉强度≥180MPa,延伸率≥2%,布氏硬度60HBW-80HBW,腐蚀速率≤4.5mg/(dm 2·d)。具体地,在本申请一种实施例中,本申请实施例的铝合金在热处理后,热导率≥180W/(m·K),屈服强度110~120MPa,抗拉强度≥190MPa,延伸率≥4%,硬度≥60HBW,腐蚀速率≤4.5mg/(dm 2·d)。
由此,本申请实施例的铝合金在未经热处理的条件下,即可满足热导率≥160W/(m·K)的产品使用要求,对于热导率要求较高的电子设备,可缩短压铸壳体的生产工艺,节约压铸壳体的制造成本。另外,本申请实施例的铝合金可通过热处理,以进一步满足对于热导率要求更高的电子设备的需求。
本申请实施例中,添加硅可以有效提高铝合金的流动性,但随着硅元素的增加,铝合金的热导率会降低。本申请实施例中,将硅的含量控制在8.0%-10.0%,可在提高铝合金流动性的同时,还可有效降低铝合金内初生硅相和共晶硅相的生成,以提高铝合金的热导率。由此,本申请实施例含量的硅可使铝合金具有较好的流动性以满足铝合金成型性能的要求,同时使铝合金具有较高的热导率。在本申请一种优选实施例中,硅的含量为8.0%~9.5%,在进一步优选的实施例中,硅的含量为8.2%~9.4%,进一步优选实施例中,硅的含量为8.7%~9.4%。通过优化硅在铝合金中的占比,可进一步提高硅的作用效果,提高铝合金成型性能的同时,使铝合金保持较高的热导率。
其中,按质量百分比计,铝合金中硅的质量占比典型但非限制性地为8.0%、8.1%、8.2%、8.3%、8.4%、8.5%、8.6%、8.7%、8.8%、8.9%、9.0%、9.1%、9.2%、9.3%、9.4%、9.5%、9.6%、9.7%、9.8%、9.9%或10.0%。
镁元素在压铸态时会固溶在铝基体中,可有效提高铝合金的强度。热处理后,镁与硅能够形成弥散分布的Mg 2Si沉淀相,该沉淀相会阻碍位错运动,从而提高材料的力学性能。通过将镁的含量控制0.001%~0.2%范围内,进一步控制在0.05%~0.15%范围内,进一步控制在0.05%~0.09%范围内,可在提高铝合金强度和力学性能的同时,还可减少晶格畸变,防止热导率降低。
其中,按质量百分比计,铝合金中镁的质量占比典型但非限制性地为0.001%、0.002%、0.005%、0.008%、0.01%、0.02%、0.03%、0.04%、0.05%、0.06%、0.07%、0.08%、0.09%、0.10%、0.11%、0.12%、0.13%、0.14%、0.15%、0.16%、0.17%、0.18%、0.19%或0.2%。
锰元素的加入可以有效改变铝合金组织结构中含铁相的形态,提升铝合金的力学性能。通过控制锰元素的添加量在0.001-0.09%范围内,可在不降低铝合金的热导率的情况下,提升其力学性能。在本申请一种优选实施例中,锰含量控制在0.001%~0.05%范围内,进一步控制在0.001%~0.02%内时,所获得综合效果更优。
其中,按质量百分比计,铝合金中锰的质量占比典型但非限制性地为0.001%、0.002%、0.005%、0.008%、0.01%、0.015%、0.02%、0.025%、0.03%、0.035%、0.04%、0.045%、 0.05%、0.055%、0.06%、0.065%、0.07%、0.075%、0.08%、0.085%或0.09%。
铁元素的加入可提高铝合金压铸成型后的脱模能力,通过将铁的添加量控制在0.7%~1.3%范围内,既可以使铝合金压铸成型后便于脱模,也可以铝合金保持较高的力学性能。在本申请一种优选实施例中,铁含量控制在0.7%~1.0%,进一步控制在0.72%~0.85%范围内时,可有效降低铝合金组织结构中的含铁的脆性针状相,从而更有助于提升铝合金的力学性能。
其中,按质量百分比计,铝合金中铁的质量占比典型但非限制性地为0.7%、0.72%、0.74%、0.76%、0.78%、0.8%、0.82%、0.85%、0.87%、0.9%、0.92%、0.95%、0.98%、1.0%、1.05%、1.1%、1.12%、1.15%、1.17%、1.2%、1.22%、1.25%、1.28%或1.3%。
锶元素的添加,可有效控制共晶硅相的尺寸,降低共晶硅相对自由电子运动的阻碍,从而达到提高铝合金热导率的目的。在本申请一种优选实施例中,锶含量控制在0.01%~0.05%,进一步控制在0.02%~0.05%范围内时,可以得到导热性更好的铝合金。
其中,按质量百分比计,铝合金中锶的质量占比典型但非限制性地为0.001%、0.002%、0.005%、0.008%、0.01%、0.015%、0.02%、0.025%、0.03%、0.035%、0.04%、0.045%或0.05%。
在本申请一种实施例中,按质量百分比,铝合金还包括不超过0.1%的铜,优选不超过0.05%,进一步优选不超过0.02%。在本申请一种实施例中,按质量百分比计,铜的含量可为0.001%~0.1%,优选为0.001%~0.05%,进一步优选为0.001%~0.02%。加入铜元素可以有效提高铝合金的力学性能,通过将铜的添加量控制在上述范围内,可使铝合金在获得优异的力学性能的基础上,还可使铝合金保持较高的热导率和耐蚀性。其中,按质量百分比计,铝合金中铜的质量占比典型但非限制性地为0.001%、0.002%、0.005%、0.008%、0.01%、0.015%、0.02%、0.025%、0.03%、0.035%、0.04%、0.045%、0.05%、0.055%、0.06%、0.065%、0.07%、0.075%、0.08%、0.085%、0.09%、0.095%或0.1%。
在本申请一种实施例中,按质量百分比,铝合金还包括不超过0.1%的锌,优选不超过0.05%,进一步优选不超过0.02%。在本申请一种实施例中,按质量百分比计,锌的含量可为0.001%~0.1%,优选为0.001%~0.05%,进一步优选为0.001%~0.02%。加入锌元素,可通过固溶强化来提高合金的强度。
其中,按质量百分比计,铝合金中锌的质量占比典型但非限制性地为0.001%、0.002%、0.005%、0.008%、0.01%、0.015%、0.02%、0.025%、0.03%、0.035%、0.04%、0.045%、0.05%、0.055%、0.06%、0.065%、0.07%、0.075%、0.08%、0.085%、0.09%、0.095%或0.1%。
在本申请一种实施例中,按质量百分比,铝合金还包括不超过0.1%的钛,优选不超过0.05%,进一步优选不超过0.02%。在本申请一种实施例中,按质量百分比计,钛的含量可为0.001%~0.1%,优选为0.001%~0.05%,进一步优选为0.001%~0.02%。加入钛元素,可在铝合金铸造过程中生成Al 3Ti相,以细化晶粒,提高合金的强度和塑性。
其中,按质量百分比计,铝合金中钛的质量占比典型但非限制性地为0.001%、0.002%、0.005%、0.008%、0.01%、0.015%、0.02%、0.025%、0.03%、0.035%、0.04%、0.045%、0.05%、0.055%、0.06%、0.065%、0.07%、0.075%、0.08%、0.085%、0.09%、0.095%或0.1%。
当本申请实施例的铝合金包含上述组分时,其形成的组织结构中可包括以下几种相结 构:亚共晶α-Al相、共晶α-Al相、共晶Si相和金属间化合物。其中,组织结构中的相是指具有同一化学成分、同一原子聚集状态以及性质均匀连续的组成部分,不同相之间有界面分开。金属间化合物是指金属与金属、金属与准金属形成的化合物。本申请实施例铝合金的组织结构中,金属间化合物主要包括Mg 2Si相、Al 3Fe相和Al-Si-Fe、Al-Si-Fe-Mn相;当铝合金组分构成中还包括Cu元素时,金属间化合物还包括Al 2Cu和Al-Cu-Fe三元化合物相结构等。其中,铁、铜、镁、锰、锌、钛,部分可以原子形式固溶在亚共晶α-Al相和共晶α-Al相内部,Mg 2Si相弥散均匀分布,金属间化合物可分布在几种相结构的界面处或亚共晶α-Al相、共晶α-Al相内部。
在制备铝合金的过程中,通常在纯金属铝中加入各种合金化元素来实现特定的性能要求,但合金化元素的加入有的会降低材料晶格的有序排列,有的会导致晶格畸变、电子周期性运动受限,从而降低材料的导热性能。本申请实施例提供的铝合金,经过充分考虑各合金化元素对材料综合性能的影响,包括导热性、流动性、耐蚀性、硬度性能、强度性能等,在成分设计中均衡合金元素的联合作用,才能得到一种兼具高导热性能、优良的成型性能、高耐蚀性能和一定的力学性能的铝合金,该铝合金满足复杂结构的高热耗密度、大功率通信产品的成型和散热需求,可解决现有压铸铝合金必须要增加热处理工序才能使热导率满足使用要求的问题。综上,本申请实施例的铝合金,通过对铝合金的组成成分进行合理设计,大幅提升了铝合金的压铸态热导率,在不降低产品热导率目标的前提下,实现免热处理工艺的效果,从而可达到有效简化加工工艺,节约生产成本的目的。
本申请实施例还提供一种制备本申请上述实施例铝合金的方法,该方法包括:将按照本申请上述实施例铝合金的组分称取的原料混合熔融后,进行压铸成型处理的步骤。
按照本申请上述实施例铝合金的组分称取原料,将各个原料混合熔融后进行压铸成型处理,即可得到热导率≥160W/(m·K)、屈服强度≥120MPa、抗拉强度≥200MPa、延伸率≥2%、布氏硬度为60HBW-80HBW、腐蚀速率≤4.5mg/(dm 2·d)的铝合金。经压铸成型处理后的得到的铝合金,即使不经过热处理,也具有高导热和高力学性能的优点,可应用于电子设备中压铸壳体。同时该成分的铝合金具有较好的成型性能,可用于压铸复杂的薄壁壳体。
其中,图1为本申请一种实施例的铝合金的制备工艺流程示意图,如图1所示,在本申请一种实施例中,将按照本申请上述实施例铝合金的组分称取的原料混合熔融后,进行压铸成型处理,具体可包括以下步骤:
步骤S11、按照本申请实施例的铝合金的组成成分进行配料后,利用熔炼炉熔化原料,熔化过程中通入氮气或氩气等惰性气体精炼后,得到合金熔液;
步骤S12、将合金熔液浇铸至铸锭,形成合金锭;
步骤S13、将合金锭熔化,采用液态压铸、半固态压铸、真空压铸或挤压铸造的压力铸造方式进行压铸,形成铝合金。
其中,液态压铸、半固态压铸、真空压铸、挤压铸造的工艺参数不作具体特殊限定,根据所选原料以及实际设备参数进行选择设定即可。
继续参照图1,在本申请一种实施例中,在压铸成型后,该方法还包括:
步骤S14、对压铸后形成的铝合金进行热处理。通过热处理可获得热导率更高的铝合金,以满足对导向性能要求更高的电子产品的需求。
其中,热处理的温度为180~350℃,优选为200~320℃,进一步优选为260-320℃; 热处理的时间为0.5~6h,优选为1~4h,进一步优选为2~3h。经过180℃~350℃,尤其是260-320℃的低温热处理后,可以显著降低合金的空位等点缺陷浓度,降低合金的晶格畸变,进一步提高合金的热导率。
下面将结合具体实施例和对比例对本申请铝合金做进一步详细说明。
实施例1-8
实施例1-8分别为一种压铸铝合金,各实施例的铝合金的组分配比列于表1。
实施例1-8铝合金的制备方法如下:按照表1中各实施例压铸铝合金的组分构成称取原材料,纯铝A00铝锭(纯度99.7%)、纯镁锭、Al-50Si中间合金、Al-75Fe中间合金、Al-10Sr中间合金、铝锰中间合金以及可选的铜、锌、钛等中间合金进行配料,熔炼成合金液,随后浇铸形成合金锭,再将合金锭熔化,采用压力铸造方式形成压铸铝合金。
其中,上述组分的原料仅为举例说明,但并不局限于上述原料,本领域技术人员可根据具体的组分选择所需原料。
对比例1
该对比例为市售ADC12合金,该合金主要包括以下组分:硅9.6%~12.0%,镁≤0.3%,锰≤0.5%,铁≤1.0%,锶0%,铜1.5%~3.5%,锌≤1%,钛0%,余量为铝。
对比例2
该对比例为市售EN 43500合金,该合金的包括以下组分:硅9.5%~11.5%,镁0.1%~0.5%,锰0.5%~0.8%,铁≤0.15%,锶0%,铜≤0.1%,余量为铝。
对比例3-8
对比例3-8分别为一种压铸铝合金,各实施例的铝合金的组分配比列于表2。
对比例3-8的铝合金的制备方法参照实施例1-8。
表1
Figure PCTCN2022082057-appb-000001
表2
Figure PCTCN2022082057-appb-000002
备注:表1和表2中各实施例和对比例的铝合金,除表1和表2所列组分外,余量为铝以及不可避免的杂质,杂质的含量≤0.15%。
分别测试实施例1-8以及对比例1-8中的压铸铝合金的热导率、力学性能(屈服强度、抗拉强度、延伸率)、硬度和耐蚀性,测试结果列于表3。
其中,各项参数的具体测试过程如下:
热导率测试:采用激光闪烁法(ASTM E 1461-01)进行测试,样品尺寸为Φ12.7mm×3mm;比热参照ISO11357及ASTM E1269;密度参照ISO 1183-1:2004。
力学性能测试:按照GB/T 228的要求从各实施例和对比例的压铸铝合金上切取标准拉伸力学试片,在拉伸试验机上测试力学性能。
布氏硬度测试:按照GB/T 231的要求从各实施例和对比例的压铸铝合金上切取硬度测试样品,样品面为光滑表面,不应有氧化物和污染物。试样制备过程中,应避免受热或冷加工对试样表面硬度的影响。
耐蚀性测试:耐蚀性用腐蚀速率进行表示,腐蚀速率的测试方法遵从标准GB/T19292.4和标准GB/T 16545,试样尺寸为120×100×5mm。为消除边缘效应的影响,腐蚀速率测试试样的四周边缘用胶带纸包边。中性盐雾测试300h后,通过盐雾前后重量的变化计算平均腐蚀速率。
表3
Figure PCTCN2022082057-appb-000003
Figure PCTCN2022082057-appb-000004
从表3中的数据可以看出,本申请实施例1-8所对应的压铸铝合金的综合性能高于对比例1-8。
由实施例1-8与对比例1和对比例2的对比数据可以看出,本申请实施例1-8所提供的压铸铝合金,在未经过热处理的情况下,其对应的热导率均高于未经热处理的ADC12合金和EN 43500合金,其中,未经热处理的ADC12合金的热导率仅为96W/(m·K),而本申请实施例1-8所对应的压铸铝合金的热导率均可达到160W/(m·K)。另外,本申请实施例1-8的屈服强度、抗拉强度、延伸率和硬度均可以满足目前通讯设备压铸壳体的要求。
由实施例5与对比例3的对比数据可以看出,在对比例2的基础上添加特定含量的锶,所得压铸铝合金的综合性能也远低于本申请实施例的压铸铝合金。另外,由实施例5与对比例4的对比数据可以看出,在本申请实施例5的基础上,去掉组分锶后,所得压铸铝合金的性能有较大幅度的降低。由实施例5与对比例5-6的对比数据可以看出,当改变压铸铝合金的铁含量时,压铸铝合金的热导率有较大幅度的降低,且对比例5的成型性能较差,对比例6的延伸率较低。由实施例5与对比例3-6的相关试验能够证明,本申请压铸铝合金的综合性能的取得,并非是某一单一组分的作用结果,而是本申请压铸铝合金中各种组分的综合作用结果。
由实施例1-8与对比例7和8的相关数据可以看出,当铝合金中的镁、锰、铁的含量在不在本申请的范围内时,虽然可显著提高铝合金的力学性能,但是其导热性能会显著降低。
成型性能对比
分别利用实施例1-8和对比例1-6中对应组分的铝合金压铸形成通讯设备中射频拉远单元的压铸壳体,如图2所示,该压铸壳体1的结构中包括薄壁散热齿11。当铝合金的成型性能不佳时,薄壁散热齿11容易出现缺料缺陷。每个实施例和对比例对应的样品数量为30件,统计每个样品的薄壁散热齿11上的缺料特征,测量每个缺料口的三维最大尺寸对铝合金的成型性能进行评价。将三维最大尺寸(R)分三类进行描述:0.5mm≤R≤1.0mm;1.0mm<R≤3mm;R>3mm。其中,0.5mm≤R≤1.0mm代表成型性能最优,1.0mm<R≤3mm次之,R>3mm代表成型性能最差。统计结果列于表4。压铸壳体内为射频拉远单元的主体,主体可包括处理单元(例如处理器)或电源模块等组件。
表4
Figure PCTCN2022082057-appb-000005
从表4的数据可以看出,本申请实施例1-8的铝合金的缺陷总数以及各个尺寸的缺陷数量与对比例1和对比例2基本相同,这说明,具有本申请实施例组分配比的铝合金的成型性能可达到现有ADC12合金和EN43500合金的水平。而对比例5至对比例8所对应的铝合金,尤其是对比例5、对比例7和对比例8所对应的铝合金,其缺陷数量明显增多,这也从说明,在本申请实施例的基础上,当改变其中的组分含量时,所得铝合金的成型性能将受到影响。
综上,由表3和表4的测试数据可以看出,本申请实施例1-8铝合金,在压铸态时所对应的热导率可超过现有ADC12合金和EN 43500合金的热导率,达到160W/(m·K),并且实施例1-8铝合金的成型性能可基本达到ADC12合金和EN43500合金的成型水平,由此,本申请实施例的铝合金在可实现制备大型复杂薄壁壳体的同时,还能使获得的压铸铝合金具有较高的热导率。
热处理的影响
分别测试实施例1-8以及对比例1-8所对应的压铸铝合金经热处理后的热导率、力学性能(屈服强度、抗拉强度、延伸率)、硬度和耐蚀性,其中,各个实施例和对比例的压铸铝合金所使用的具体的热处理工艺列于表5,测试结果列于表6。 表5
序号 热处理温度/时间
实施例1 180℃/2h~3h
实施例2 260℃/2h~3h
实施例3 260℃/2h~3h
实施例4 320℃/2h~3h
实施例5 320℃/2h~3h
实施例6 260℃/2h~3h
实施例7 260℃/2h~3h
实施例8 180℃/2h~3h
对比例1 320℃/2h~3h
对比例2 320℃/2h~3h
对比例3 320℃/2h~3h
对比例4 320℃/2h~3h
对比例5 320℃/2h~3h
对比例6 320℃/2h~3h
对比例7 320℃/2h~3h
对比例8 320℃/2h~3h
表6
Figure PCTCN2022082057-appb-000006
Figure PCTCN2022082057-appb-000007
由表6中的数据可以看出,本申请实施例1-8提供的压铸铝合金经热处理后,其热导率可达到180W/(m·K),远高于对比例1至对比例8的压铸铝合金。
通过上述分析可知,本申请实施例的压铸铝合金,通过各组成成分的合理设计,使所得到的压铸铝合金兼具高导热性能、优良的成型性能,高耐蚀性能和一定的力学性能,适用于制备复杂结构的通信产品零部件,可解决现有技术中压铸铝合金必须要增加热处理工序提升热导率的问题。
需要说明的是:本申请中,如果没有特别的说明,本文所提到的所有实施方式以及优选实施方法可以相互组合形成新的技术方案。本申请中,如果没有特别的说明,本文所提到的所有技术特征以及优选特征可以相互组合形成新的技术方案。本申请中,如果没有特别的说明,百分数(%)或者份指的是相对于组合物的重量百分数或重量份。本申请中,如果没有特别的说明,所涉及的各组分或其优选组分可以相互组合形成新的技术方案。本申请中,除非有其他说明,数值范围“a~b”表示a到b之间的任意实数组合的缩略表示,且包括a和b,其中a和b都是实数。例如数值范围“6~22”表示本文中已经全部列出了“6~22”之间的全部实数,“6~22”只是这些数值组合的缩略表示。本申请所公开的“范围”以下限和上限的形式,可以分别为一个或多个下限,和一个或多个上限。本申请中,除非另有说明,各个反应或操作步骤可以顺序进行,也可以按照顺序进行。优选地,本文中的反应方法是顺序进行的。
以上,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以权利要求的保护范围为准。

Claims (21)

  1. 一种铝合金,其特征在于,按质量百分比计,包括:
    硅8.0%~10.0%,镁0.001%~0.2%,锰0.001%~0.09%,铁0.7%~1.3%,锶0.001%~0.05%,余量包括铝以及不可避免的杂质,其中,不可避免的杂质≤0.15%。
  2. 根据权利要求1所述的铝合金,其特征在于,按质量百分比计,包括:硅8.0%~9.5%,镁0.05%~0.15%,锰0.001%~0.05%,铁0.7%~1.0%,锶0.01%~0.05%,余量包括铝以及不可避免的杂质,其中,不可避免的杂质≤0.15%。
  3. 根据权利要求1所述的铝合金,其特征在于,按质量百分比计,包括:硅8.2%~9.4%,镁0.05%~0.09%,锰0.001%~0.02%,铁0.72%~0.85%,锶0.02%~0.05%,余量包括铝以及不可避免的杂质,其中,不可避免的杂质≤0.15%。
  4. 根据权利要求1-3任一项所述的铝合金,其特征在于,按质量百分比,所述铝合金还包括小于或等于0.1%的铜。
  5. 根据权利要求4所述的铝合金,其特征在于,按质量百分比,所述铝合金中所述铜的含量小于或等于0.05%。
  6. 根据权利要求4所述的铝合金,其特征在于,按质量百分比,所述铝合金中所述铜的含量小于或等于0.02%。
  7. 根据权利要求1-6任一项所述的铝合金,其特征在于,按质量百分比,所述铝合金还包括小于或等于0.1%的锌。
  8. 根据权利要求7所述的铝合金,其特征在于,按质量百分比,所述铝合金中所述锌的含量小于或等于0.05%。
  9. 根据权利要求7所述的铝合金,其特征在于,按质量百分比,所述铝合金中所述锌的含量小于或等于0.02%。
  10. 根据权利要求1-9任一项所述的铝合金,其特征在于,按质量百分比,所述铝合金还包括小于或等于0.1%的钛。
  11. 根据权利要求10所述的铝合金,其特征在于,按质量百分比,所述铝合金中所述钛的含量小于或等于0.05%。
  12. 根据权利要求10所述的铝合金,其特征在于,按质量百分比,所述铝合金中所述钛的含量小于或等于0.02%。
  13. 根据权利要求1-12任一项所述的铝合金,其特征在于,所述铝合金在压铸态时,热导率≥160W/(m·K),屈服强度≥120MPa,抗拉强度≥200MPa,延伸率≥2%,布氏硬度60HBW-80HBW,腐蚀速率≤4.5mg/(dm 2·d)。
  14. 根据权利要求1-13任一项所述的铝合金,其特征在于,所述铝合金在热处理后,热导率≥180W/(m·K),屈服强度≥100MPa,抗拉强度≥180MPa,延伸率≥2%,布氏硬度60HBW-80HBW,腐蚀速率≤4.5mg/(dm 2·d)。
  15. 一种制备如权利要求1-14任一项所述的铝合金的方法,其特征在于,包括:
    将按照所述铝合金的组分称取的原料混合熔融得到合金溶液;
    将合金溶液浇铸得到合金锭;
    对所述合金锭进行压铸成型得到所述铝合金。
  16. 根据权利要求15所述的方法,其特征在于,在所述压铸成型后,所述方法还包括 对所述铝合金进行热处理。
  17. 根据权利要求16所述的方法,其特征在于,所述热处理的温度为180~350℃。
  18. 根据权利要求17所述的方法,其特征在于,所述热处理的温度为200~320℃或260-320℃。
  19. 根据权利要求17或18所述的方法,其特征在于,所述热处理的时间为0.5~6h。
  20. 根据权利要求17或18所述的方法,其特征在于,所述热处理的时间为1~4h或2~3h。
  21. 一种电子设备,其特征在于,包括外壳和位于外壳内的主体,所述主体包括所述电子设备的处理单元;所述外壳的部分或全部为如权利要求1-14任一项所述的铝合金,或,所述外壳的部分或全部为利用如权利要求15-20任一项所述的方法制备的铝合金。
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