WO2022198519A1 - 半导体扩散设备 - Google Patents

半导体扩散设备 Download PDF

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Publication number
WO2022198519A1
WO2022198519A1 PCT/CN2021/082812 CN2021082812W WO2022198519A1 WO 2022198519 A1 WO2022198519 A1 WO 2022198519A1 CN 2021082812 W CN2021082812 W CN 2021082812W WO 2022198519 A1 WO2022198519 A1 WO 2022198519A1
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arc
guide
guide device
wafer boat
diffusion furnace
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PCT/CN2021/082812
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English (en)
French (fr)
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吉松超
任国威
王斌
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台湾积体电路制造股份有限公司
台积电(中国)有限公司
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Publication of WO2022198519A1 publication Critical patent/WO2022198519A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/38—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

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  • the present application relates to the field of semiconductor manufacturing equipment, in particular to a semiconductor diffusion equipment.
  • Semiconductor diffusion equipment is an important process equipment for integrated circuit manufacturing. It is an automatic control equipment that requires continuous work for a long time, excellent temperature control accuracy, good reliability and stability. It is suitable for various types of integrated circuit manufacturing processes. Processes such as oxidation, annealing and diffusion.
  • Various components are installed inside the semiconductor diffusion equipment, mainly including crystal boats, lifting mechanisms, and diffusion furnaces. Wafers are placed in the wafer boat into the inside of the diffusion furnace for high temperature diffusion.
  • the wafer boat is made of quartz material
  • the diffusion furnace is made of silicon carbide material. The hardness of the two is different. After friction, flying debris will be generated, which will become impurities into the semiconductor material during the diffusion process of the wafer, affecting the product quality.
  • the existing diffusion furnace is installed manually, the direction of the installation process cannot be effectively controlled, and the work efficiency is low.
  • the purpose of this application is to provide a semiconductor diffusion device, which can control the moving direction of the diffusion furnace, prevent friction between the diffusion furnace and the wafer boat, and improve the quality of wafer diffusion.
  • an embodiment of the present application proposes a semiconductor diffusion equipment, including: a positioning frame, which has a first fixing position and a second fixing position that are annular and nested with each other, and the first fixing position can fix the wafer boat , the second fixing position can fix the guiding device; the crystal boat is fixed at the first fixing position; the guiding device is set at the second fixing position, and the guiding device is a cylindrical shape with a guiding through hole a structure body, the cylindrical structure body is sleeved outside the wafer boat and maintains a preset gap;
  • a diffusion furnace the outer diameter of which matches the guide through hole, can be used to lead along the inner surface of the guide between the wafer boat and the guide.
  • the guide device includes a plurality of arc-shaped segments, and the multiple arc-shaped segments are arranged along a preset circumferential direction to form the guide device.
  • the side walls of the arc-shaped segment are provided with a plurality of through air passages at intervals.
  • the arc-shaped segment includes a plurality of arc-shaped pieces arranged at intervals, the gap between adjacent arc-shaped pieces forms an air flow channel, and the adjacent arc-shaped pieces are connected by support columns.
  • the guide device further includes a plurality of reinforcing ribs, the plurality of reinforcing ribs are arranged at intervals on the outer circumference of the arc-shaped segment and extend along the axial direction of the arc-shaped segment.
  • two adjacent arc-shaped segments are detachably connected.
  • two opposite end surfaces of adjacent arc-shaped segments are respectively provided with connecting portions that cooperate with each other, and two adjacent arc-shaped segments are detachably connected through the connecting portions.
  • the outer peripheries of adjacent arc-shaped segments are connected by a locking member.
  • the port of the guide device away from the positioning frame has a guide portion that expands outward.
  • the guide device is composed of a Teflon plate with a surface coefficient of 0.05-0.10.
  • a guiding through hole is provided in the guiding device that fits the shape of the outer wall of the diffusion furnace.
  • FIG. 1 is a schematic structural diagram of a semiconductor diffusion device provided according to an embodiment of the present application.
  • FIG. 2 is a schematic top-view structural diagram of a positioning frame of a semiconductor diffusion device provided according to an embodiment of the present application
  • FIG. 3 is a schematic three-dimensional structural diagram of a guiding device of a semiconductor diffusion device provided according to an embodiment of the present application
  • FIG. 4 is a schematic diagram of an exploded structure of a guide device of a semiconductor diffusion device provided according to an embodiment of the present application.
  • An embodiment of the present application provides a semiconductor diffusion device, which can control the moving direction of the diffusion furnace, prevent friction between the diffusion furnace and the wafer boat, and improve the quality of wafer diffusion.
  • an embodiment of the present application provides a semiconductor diffusion equipment, including: a wafer boat 1 , a guide device 2 , a positioning frame 3 and a diffusion furnace 4 .
  • the wafer boat 1 is used for accommodating wafers.
  • the guide device 2 is a cylindrical structure having a guide through hole 3 .
  • the cylindrical structure is sleeved on the outside of the wafer boat 1 .
  • the positioning frame 3 can provide installation and support foundation for other components.
  • the guiding device 2 in this application is used for guiding the diffusion furnace 4 down to the outside of the wafer boat 1 .
  • the diffusion furnace 4 is matched with the wafer boat 1.
  • the wafer boat 1 is used for accommodating the wafer.
  • the diffusion furnace 4 wraps and heats the wafer.
  • air doped with microalloy particles is input into the furnace to diffuse the particles into the wafer.
  • the outer diameter of wafer boat 1 is 205mm
  • the inner diameter of diffusion furnace 4 is 209mm
  • the installation gap is only 2mm, which is easy to generate friction during installation. The friction between the diffusion furnace 4 and the wafer boat 1 can be avoided only when the process of descending the diffusion furnace 4 keeps moving linearly along the axial direction.
  • the positioning frame 3 has a first fixing position 6 and a second fixing position 7 which are annular and sleeved with each other.
  • the first fixing position 6 can fix the wafer boat 1
  • the second fixing position 7 can fix the guiding device 2 .
  • the first fixing position 6 can be a fixing ring or a fixing groove
  • one end of the wafer boat 1 is an annular protruding structure, which can be connected and fixed with the fixing ring or the fixing groove.
  • the second fixing position 7 can also be a fixing ring or a fixing groove
  • one end of the guiding device 2 is an annular structure, which can be connected and fixed with the fixing ring or the fixing operation.
  • An annular existing space is formed between the guide device 2 and the wafer boat 1 for the diffusion furnace 4 to move.
  • the outer diameter of the diffusion furnace 4 is matched with the guide through hole 5 , and is used for being guided between the wafer boat 1 and the guide device 2 along the inner surface of the guide device 2 .
  • a guide through hole 5 is provided in the guide device 2 that fits with the shape of the outer wall of the diffusion furnace 4.
  • the moving direction of the diffusion furnace 4 is restricted by the guide device 2 during the moving and sleeved process, and it moves linearly along the axial direction to prevent friction with the wafer boat 1, avoid the generation of flying debris after friction, and improve the diffusion furnace 4.
  • the purity of the atmosphere can be improved, the yield rate can be improved, and the production efficiency of crystalline silicon wafers can be improved.
  • FIG. 3 and FIG. 4 are respectively the three-dimensional structure of the guiding device 2 of the semiconductor diffusion device in the embodiment of the present application and the explosion of the guiding device 2 of the semiconductor diffusion device in the embodiment of the present application.
  • the guide device 2 includes a plurality of arc-shaped segments 8 , and the plurality of arc-shaped segments 8 are arranged along a predetermined circumferential direction to form the guide device 2 .
  • dividing the guiding device 2 into a plurality of arc-shaped segments 8 can separate the guiding device 2 from the wafer boat 1 or the diffusion furnace 4 from the side, which facilitates the installation and disassembly of the guiding device 2 and avoids the guiding device 2 .
  • friction occurs with the wafer boat 1 or the diffusion furnace 4.
  • the sidewalls of the arc-shaped segment 8 are provided with a plurality of through air passages 9 at intervals.
  • the airflow channel 9 By providing the airflow channel 9 , when the diffusion furnace 4 moves in the space between the guide device 2 and the wafer boat 1 , the gas therein is exhausted, and the smooth movement of the diffusion furnace 4 is promoted.
  • the shape and structure of the airflow channel 9 are not limited, and can be arranged axially along the arc-shaped segment or along the circumferential direction of the arc-shaped segment or randomly distributed without a fixed arrangement. The above technical effect can be achieved as long as the air between the guide device 2 and the wafer boat 1 can be exhausted.
  • the arc-shaped segment 8 includes a plurality of arc-shaped members 10 arranged at intervals, the gaps between adjacent arc-shaped members 10 form airflow channels 9 , and the adjacent arc-shaped members 10 are connected by support columns 11 .
  • the arc-shaped segment 8 formed by the arc-shaped member 10 and the support column 11 can simplify the structure of the arc-shaped segment 8 and facilitate production and installation.
  • the guide device 2 further includes a plurality of reinforcing ribs 12 , and the plurality of reinforcing ribs 12 are arranged at intervals on the outer circumference of the arc-shaped segment 8 and extend along the axial direction of the arc-shaped segment 8 .
  • the reinforcing rib 12 is used to further strengthen and fix the structure of the guide device 2 to prevent the guide device 2 from being deflected, thereby ensuring the stability of the diffusion furnace 4 during the moving process.
  • two adjacent arc segments 8 are detachably connected. According to the above-mentioned embodiment, the detachable connection of the arc-shaped segments 8 can improve the installation efficiency of the guide device 2 .
  • two opposite end surfaces of adjacent arc-shaped segments 8 are respectively provided with connecting portions that cooperate with each other.
  • the connecting portion may be a protrusion of a preset shape provided on the end face of the first arc-shaped segment and a projection provided on the end surface of the arc-shaped segment opposite to the first arc-shaped segment and the protrusion form-fitting grooves.
  • the outer peripheries of adjacent arc-shaped segments 8 are connected by locking members. According to the above-mentioned embodiment, by arranging the locking member on the outer periphery of the arc-shaped segment 8, the installation of the arc-shaped segment 8 can not only be facilitated, but also the two adjacent arc-shaped segments 8 can be locked and fastened, and the lifting The overall structural stability of the guide device 2 .
  • the port of the guide device 2 away from the positioning frame 3 has a guide portion 13 that expands outward.
  • the guide portion 13 is used to guide the moving direction of the diffusion furnace 4 entering the port of the guide device 2 , which can facilitate the diffusion furnace 4 to smoothly enter the guide through hole 5 and guide the diffusion furnace 4 to move in a coaxial direction with the wafer boat 1 . .
  • the guides are constructed of Teflon plates with a surface coefficient of 0.05-0.10.
  • the Teflon material has a low surface friction coefficient and strong corrosion resistance, which can avoid damage to the outer wall of the diffusion furnace 4 or the crystal boat 1 caused by friction during use.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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Abstract

本申请涉及一种半导体扩散设备，包括：定位架，具有环状且相互套设的第一固定位和第二固定位，第一固定位能够固定晶舟，第二固定位能够固定导向装置；晶舟，固定于第一固定位；导向装置，设于第二固定位，导向装置为具有导向通孔的筒状结构体，筒状结构体套设于晶舟外并保持预设间隙；扩散炉，扩散炉的外径与导向通孔匹配，扩散炉能够用于沿导向装置的内表面导入至晶舟和导向装置之间。在导向装置中设置与扩散炉的外壁形状贴合的导向通孔，将导向装置固定于定位架并与晶舟保持预设距离设置，扩散炉移动套设过程中方向受到导向装置的限制，沿着轴向直线移动防止与晶舟发生摩擦，避免产生摩擦后的飞屑，提高了扩散炉中的气氛的纯度，提高良品率。

Description

半导体扩散设备
相关申请的交叉引用
本申请要求享有于2021年03月22日提交的名称为“半导体扩散设备”的中国专利申请202120575072.4的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请涉及半导体制造设备领域，具体涉及一种半导体扩散设备。
背景技术
半导体扩散设备是集成电路制造的重要工艺设备，是一种要求能长时间连续工作，具有优异的控温精度及良好的可靠性、稳定性的自动控制设备，适用于集成电路制造过程中各种氧化、退火和扩散等工艺。
在半导体扩散设备内部安装有各种零部件，主要有晶舟、升降机构、扩散炉等。晶舟中乘放晶圆片进入扩散炉内部，进行高温的扩散。而实际生产中，对半导体扩散设备整体尺寸有具体要求，其内部空间尺寸有限。晶舟由石英材质制成，扩散炉为碳化硅材料制成，两者硬度不同，摩擦后会产生飞屑，在晶圆片的扩散过程中成为杂质进入半导体材料中，影响产品品质。
现有的扩散炉安装为人工操作，安装过程的方向无法有效控制，工作效率低。
发明内容
本申请的目的是提供一种半导体扩散设备，能够控制扩散炉移动方向，防止扩散炉与晶舟发生摩擦，提升晶圆扩散的质量。
一方面，本申请实施例提出了一种半导体扩散设备，包括：定位架， 具有环状且相互套设的第一固定位和第二固定位，所述第一固定位能够固定所述晶舟，所述第二固定位能够固定所述导向装置；晶舟，固定于所述第一固定位；导向装置，设于所述第二固定位，所述导向装置为具有导向通孔的筒状结构体，所述筒状结构体套设于所述晶舟外并保持预设间隙；
扩散炉，所述扩散炉的外径与所述导向通孔匹配，所述扩散炉能够用于沿导向装置的内表面导入至所述晶舟和所述导向装置之间。
根据本申请实施例的一个方面，导向装置包括多个弧形分片，多个弧形分片沿预设的周向排布形成导向装置。
根据本申请实施例的一个方面，弧形分片的侧壁间隔设有多条贯通的气流通道。
根据本申请实施例的一个方面，弧形分片包括多个间隔设置的弧形件，相邻弧形件之间的间隙形成气流通道，相邻弧形件之间通过支撑柱连接。
根据本申请实施例的一个方面，导向装置还包括多个加强筋，多个加强筋间隔设于弧形分片的外周，并沿弧形分片的轴向延伸。
根据本申请实施例的一个方面，相邻两个弧形分片可拆卸连接。
根据本申请实施例的一个方面，相邻的弧形分片的相对的两个端面上分别设有相互配合的连接部，相邻两个弧形分片通过连接部可拆卸连接。
根据本申请实施例的一个方面，相邻的弧形分片的外周通过锁紧件连接。
根据本申请实施例的一个方面，导向装置远离定位架的端口具有外扩的导向部。
根据本申请实施例的一个方面，导向装置由表面系数为0.05-0.10的特氟龙板构成。
本申请实施例提供的半导体扩散设备，在导向装置中设置一个与扩散炉的外壁形状贴合的导向通孔，通过将导向装置固定于定位架上，并且与晶舟保持间隔距离设置，扩散炉移动套设过程中其移动方向受到导向装置的限制，沿着轴向直线移动防止与晶舟发生摩擦，避免产生摩擦后的飞屑，提高了扩散炉中的气氛的纯度，提高良品率，提升晶片的生产效率。
附图说明
从下面结合附图对本申请的具体实施方式的描述中可以更好地理解本申请，其中，通过阅读以下参照附图对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显，相同或相似的附图标记表示相同或相似的特征。
图1为根据本申请一个实施例提供的半导体扩散设备的结构示意图；
图2为根据本申请一个实施例提供的半导体扩散设备的定位架的俯视结构示意图；
图3为根据本申请一个实施例提供的半导体扩散设备的导向装置的立体结构示意图；
图4为根据本申请一个实施例提供的半导体扩散设备的导向装置的爆炸结构示意图。
附图标记说明：
1-晶舟；2-导向装置；3-定位架；4-扩散炉；5-导向通孔；6-第一固定位；7-第二固定位；8-弧形分片；9-气流通道；10-弧形件；11-支撑柱；12-加强筋；13-导向部。
具体实施方式
下面将详细描述本申请的各个方面的特征和示例性实施例。下面的详细描述中公开了许多具体细节，以便全面理解本申请。但是，对于本领域技术人员来说，很明显的是，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请的更好的理解。本申请决不限于下面所提出的任何具体配置和算法，而是在不脱离本申请的精神的前提下覆盖了元素、部件和算法的任何修改、替换和改进。在附图和下面的描述中，没有示出公知的结构和技术，以便避免对本申请造成不必要的模糊。
为了更好地理解本申请，下面结合图1至图4对本申请实施例提供的半导体扩散设备进行详细描述。
请一并参阅图1至图2，本申请实施例提供一种半导体扩散设备，能够控制扩散炉移动方向，防止扩散炉与晶舟发生摩擦，提升晶片扩散的质量。
第一方面，本申请实施例提供一种半导体扩散设备，包括：晶舟1，导向装置2，定位架3以及扩散炉4。晶舟1用于容置晶圆。导向装置2为具有导向通孔3的筒状结构体。该筒状结构体套设于晶舟1外部。定位架3可以为其他部件提供安装和支撑基础。本申请中的导向装置2，用于将扩散炉4下放至晶舟1外的导向。
扩散炉4与晶舟1配套，晶舟1用于容置晶圆，扩散炉4将其包裹并加热，同时向炉内输入掺杂有微合金粒子的空气，将粒子扩散入晶片中。例如，晶舟1外径205mm，扩散炉4内径209mm，安装间隙仅2mm，易在安装过程中产生摩擦。只有当扩散炉4下降的过程保持沿着轴向直线移动才能避免扩散炉4与晶舟1之间产生摩擦。
定位架3为具有环状且相互套设的第一固定位6和第二固定位7，第一固定位6能够固定晶舟1，第二固定位7能够固定导向装置2。第一固定位6可以是固定环或固定槽，晶舟1的一端为环状凸出结构，其可以与固定环或者固定槽连接固定。第二固定位7也可以是固定环或固定槽，导向装置2的一端为环状结构，可以与固定环或者固定操连接固定。导向装置2与晶舟1之间形成了环形的现为空间，供扩散炉4移动。扩散炉4的外径与导向通孔5匹配，用于沿导向装置2的内表面导入至晶舟1和导向装置2之间。
根据本申请实施例的半导体扩散设备，在导向装置2中设置一个与扩散炉4的外壁形状贴合的导向通孔5，通过将导向装置2固定于第二固定位7，并且与晶舟1同轴设置，扩散炉4移动套设过程中其移动方向受到导向装置2的限制，沿着轴向直线移动防止与晶舟1发生摩擦，避免产生摩擦后的飞屑，提高了扩散炉4中的气氛的纯度，提高良品率，提升晶硅片的生产效率。
在一些实施例中，请结合参考图3以及图4，分别为本申请实施例中的半导体扩散设备的导向装置2的立体结构体以及本申请实施例中的半导 体扩散设备的导向装置2的爆炸图。导向装置2包括多个弧形分片8，多个弧形分片8沿预设的周向排布形成导向装置2。通过上述的技术方案，将导向装置2分成多个弧形分片8能够从侧面将导向装置2与晶舟1或者扩散炉4分离，便于导向装置2的安装与分拆，并且避免导向装置2的安装的过程中与晶舟1或者扩散炉4发生摩擦。
在一些实施例中，弧形分片8的侧壁间隔设有多条贯通的气流通道9。通过设置气流通道9，当扩散炉4在导向装置2以及晶舟1之间的空间移动时排出其中的气体，促进扩散炉4的顺利移动。可以理解的是，气流通道9的形状和结构没有限制，可以是沿着弧形分片轴向设置或者沿着弧形分片的周向设置或者不按照固定的排列方式进行随机分布，可以根据生产的便利或者美观等要求进行选择，只要能够将导向装置2与晶舟1之间的空气排出即可达到上述的技术效果。
在一些实施例中，弧形分片8包括多个间隔设置的弧形件10，相邻弧形件10之间的间隙形成气流通道9，相邻弧形件10之间通过支撑柱11连接。根据上述的实施例，通过弧形件10以及支撑柱11组成弧形分片8能够简化弧形分片8的结构，便于生产和安装。
在一些实施例中，导向装置2还包括多个加强筋12，多个加强筋12间隔设于弧形分片8的外周，并沿弧形分片8的轴向延伸。根据上述的实施例，加强筋12用于对导向装置2的结构进行进一步的加强与固定，防止导向装置2发生偏斜，能够保证扩散炉4在移动的过程中的稳定性。
在一些实施例中，相邻两弧形分片8可拆卸连接。根据上述的实施例，弧形分片8可拆卸连接能够提升导向装置2的安装效率。
在一些实施例中，相邻的弧形分片8的相对的两个端面上分别设有相互配合的连接部。根据上述的实施例，连接部可以是设于第一个弧形分片端面上的预设形状的凸起以及设于与第一个弧形分片相对的弧形分片端面上与该凸起的形状配合的凹槽。在安装时，将凸起对准相应的凹槽进行扣合，即可将相邻的两弧形分片8连接，操作简便，同时能够提升导向装置2的安装效率以及安装的精准度。
在一些实施例中，相邻的弧形分片8的外周通过锁紧件连接。根据上 述的实施例，通过在弧形分片8的外周设置锁紧件不仅能够便于弧形分片8的安装，而且能够将相邻的两个弧形分片8进行锁紧紧固，提升导向装置2整体的结构稳定性。
在一些实施例中，导向装置2远离定位架3的端口具有外扩的导向部13。导向部13用于引导进入导向装置2端口的扩散炉4的运动方向，能够便于扩散炉4顺利的进入导向通孔5中，且将扩散炉4引导至与晶舟1同轴的方向进行移动。
在一些实施例中，导向装置采用表面系数为0.05-0.10的特氟龙板构成。特氟龙材质表面摩擦系数低,耐腐蚀能力强,能够避免在使用过程中对扩散炉4或者晶舟1外壁摩擦造成损伤。
本领域技术人员应能理解，上述实施例均是示例性而非限制性的。在不同实施例中出现的不同技术特征可以进行组合，以取得有益效果。本领域技术人员在研究附图、说明书及权利要求书的基础上，应能理解并实现所揭示的实施例的其他变化的实施例。在权利要求书中，术语“包括”并不排除其他装置或步骤；物品没有使用数量词修饰时旨在包括一个/种或多个/种物品，并可以与“一个/种或多个/种物品”互换使用”；术语“第一”、“第二”用于标示名称而非用于表示任何特定的顺序。权利要求中的任何附图标记均不应被理解为对保护范围的限制。权利要求中出现的多个部分的功能可以由一个单独的硬件或软件模块来实现。某些技术特征出现在不同的从属权利要求中并不意味着不能将这些技术特征进行组合以取得有益效果。

Claims (10)

  1. 一种半导体扩散设备，包括：
    定位架，具有环状且相互套设的第一固定位和第二固定位；
    晶舟，固定于所述第一固定位；
    导向装置，设于所述第二固定位，所述导向装置为具有导向通孔的筒状结构体，所述筒状结构体套设于所述晶舟外并保持预设间隙；
    扩散炉，所述扩散炉的外径与所述导向通孔匹配，所述扩散炉能够沿导向装置的内表面导入至所述晶舟和所述导向装置之间。
  2. 根据权利要求1所述的半导体扩散设备，其中，所述导向装置包括多个弧形分片，多个所述弧形分片沿预设的周向排布形成所述导向装置。
  3. 根据权利要求2所述的半导体扩散设备，其中，所述弧形分片的侧壁间隔设有多条贯通的气流通道。
  4. 根据权利要求3所述的半导体扩散设备，其中，所述弧形分片包括多个间隔设置的弧形件，相邻所述弧形件之间的间隙形成所述气流通道，相邻所述弧形件之间通过支撑柱连接。
  5. 根据权利要求2所述的半导体扩散设备，其中，所述导向装置还包括多个加强筋，多个所述加强筋间隔设于所述弧形分片的外周，并沿所述弧形分片的轴向延伸。
  6. 根据权利要求2-5中任一项所述的半导体扩散设备，相邻两个所述弧形分片可拆卸连接。
  7. 根据权利要求6所述的半导体扩散设备，其中，相邻的所述弧形分片的相对的两个端面上分别设有相互配合的连接部，相邻两个所述弧形分片通过所述连接部可拆卸连接。
  8. 根据权利要求6所述的半导体扩散设备，其中，相邻的所述弧形分片的外周通过锁紧件连接。
  9. 根据权利要求1-5中任一项所述的半导体扩散设备，其中，导向装置远离所述定位架的端口具有外扩的导向部。
  10. 根据权利要求1-5中任一项所述的半导体扩散设备，其中，所述导向装置由表面系数为0.05-0.10的特氟龙板构成。
PCT/CN2021/082812 2021-03-22 2021-03-24 半导体扩散设备 WO2022198519A1 (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250571A (ja) * 1995-03-14 1996-09-27 Fujitsu Ltd ウェーハの搬送方法
CN1565050A (zh) * 2001-08-08 2005-01-12 东京毅力科创株式会社 热处理方法及热处理装置
US20070144435A1 (en) * 2005-12-28 2007-06-28 Macronix International Co., Ltd. Adjusting mechanism and adjusting method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250571A (ja) * 1995-03-14 1996-09-27 Fujitsu Ltd ウェーハの搬送方法
CN1565050A (zh) * 2001-08-08 2005-01-12 东京毅力科创株式会社 热处理方法及热处理装置
US20070144435A1 (en) * 2005-12-28 2007-06-28 Macronix International Co., Ltd. Adjusting mechanism and adjusting method thereof

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