WO2022189430A3 - Composite material - Google Patents

Composite material Download PDF

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Publication number
WO2022189430A3
WO2022189430A3 PCT/EP2022/055889 EP2022055889W WO2022189430A3 WO 2022189430 A3 WO2022189430 A3 WO 2022189430A3 EP 2022055889 W EP2022055889 W EP 2022055889W WO 2022189430 A3 WO2022189430 A3 WO 2022189430A3
Authority
WO
WIPO (PCT)
Prior art keywords
weight
material fraction
composite material
hybrid polymer
preferably above
Prior art date
Application number
PCT/EP2022/055889
Other languages
French (fr)
Other versions
WO2022189430A2 (en
Inventor
Joerg Schuhmacher
Stephanie Mangold
Sabine Pichler-Wilhelm
Jonas Dimroth
Original Assignee
Schott Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott Ag filed Critical Schott Ag
Publication of WO2022189430A2 publication Critical patent/WO2022189430A2/en
Publication of WO2022189430A3 publication Critical patent/WO2022189430A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/02—Polysilicates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/02—Polysilicates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes

Abstract

The present invention relates to a composite material for protecting electronic components, comprising at least a first material fraction and a second material fraction, wherein said first material fraction comprising at least one hybrid polymer, wherein said at least one hybrid polymer comprising at least one of - sol-Gel compound having a total organic carbon, TOC, content below 75 weight-% and above 0,01 weight-%, preferably above 10 weight-%, preferably above 20 weight-%, - Silicone resin and/or - Polysilsesquioxane, and/or combinations thereof, and said second material fraction comprising a particle filler.
PCT/EP2022/055889 2021-03-08 2022-03-08 Composite material WO2022189430A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021202222.7 2021-03-08
DE102021202222.7A DE102021202222A1 (en) 2021-03-08 2021-03-08 composite material

Publications (2)

Publication Number Publication Date
WO2022189430A2 WO2022189430A2 (en) 2022-09-15
WO2022189430A3 true WO2022189430A3 (en) 2022-10-13

Family

ID=81073993

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2022/055889 WO2022189430A2 (en) 2021-03-08 2022-03-08 Composite material

Country Status (2)

Country Link
DE (1) DE102021202222A1 (en)
WO (1) WO2022189430A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040214377A1 (en) * 2003-04-28 2004-10-28 Starkovich John A. Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
EP2294583A1 (en) * 2008-06-10 2011-03-16 University of Teesside Electrically insulating coating and method of formation thereof
JP2017186544A (en) * 2016-03-31 2017-10-12 Koa株式会社 Thermosetting silicone resin paste composition and use of the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6319757B1 (en) 1998-07-08 2001-11-20 Caldus Semiconductor, Inc. Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
US9045585B2 (en) 2009-11-23 2015-06-02 Dow Global Technologies Llc Toughened epoxy resin formulations
DE102010031866A1 (en) 2010-07-21 2012-01-26 Schott Ag Silicone coating as a sealing layer for a decorative coating
JP6333237B2 (en) 2012-04-20 2018-05-30 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ Method for applying a decorative coating to a glass substrate or glass ceramic substrate and a countertop comprising a coated glass substrate or glass ceramic substrate
DE102012111836A1 (en) 2012-12-05 2014-06-05 Schott Ag Coating material and substrate with a semi-transparent coating
KR102520360B1 (en) 2014-11-18 2023-04-11 가부시끼가이샤 레조낙 Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layer
DE102016106137B4 (en) 2016-04-04 2023-12-28 Infineon Technologies Ag Electronic device housing comprising a dielectric layer and an encapsulating material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040214377A1 (en) * 2003-04-28 2004-10-28 Starkovich John A. Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
EP2294583A1 (en) * 2008-06-10 2011-03-16 University of Teesside Electrically insulating coating and method of formation thereof
JP2017186544A (en) * 2016-03-31 2017-10-12 Koa株式会社 Thermosetting silicone resin paste composition and use of the same

Also Published As

Publication number Publication date
WO2022189430A2 (en) 2022-09-15
DE102021202222A1 (en) 2022-09-08

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