WO2022188772A1 - 天线耦合结构和电子设备 - Google Patents

天线耦合结构和电子设备 Download PDF

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Publication number
WO2022188772A1
WO2022188772A1 PCT/CN2022/079716 CN2022079716W WO2022188772A1 WO 2022188772 A1 WO2022188772 A1 WO 2022188772A1 CN 2022079716 W CN2022079716 W CN 2022079716W WO 2022188772 A1 WO2022188772 A1 WO 2022188772A1
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Prior art keywords
metal layer
coupling
capacitor
metal
metal body
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PCT/CN2022/079716
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English (en)
French (fr)
Inventor
侯梓鹏
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Publication of WO2022188772A1 publication Critical patent/WO2022188772A1/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors

Definitions

  • the present application belongs to the technical field of terminals, and in particular relates to an antenna coupling structure and an electronic device.
  • antenna design such as location, size, space, and performance.
  • antenna coupling structure After the antenna coupling structure is fed, it needs to be electrically connected through an elastic body, which is not conducive to the return of high-frequency signals to the ground.
  • the structure is relatively complex, and there is a problem of poor process reliability.
  • the elastic body is deformed by impact; The connections take up space, increase the coupling capacitance between the antenna and the ground resulting in reduced performance or increase the complexity of the electrical connection design.
  • the purpose of the embodiments of the present application is to provide an antenna coupling structure and an electronic device, so as to solve the problem that the antenna coupling structure needs to be electrically connected through an elastic body after feeding, which is not conducive to the return of high-frequency signals to the ground, and the elastic body is easily deformed and failed by impact. question.
  • an embodiment of the present application provides an antenna coupling structure, including:
  • a circuit board has a metal layer on the side close to the metal body, the metal layer is spaced apart from the metal body, and the surface of the metal layer on the side close to the metal body has a first a coupling surface, the surface of the metal body on the side close to the metal layer has a second coupling surface, the first coupling surface is parallel to the second coupling surface, and the first coupling surface is in the second coupling surface
  • the orthographic projection on the plane where the coupling surface is located is at least partially located on the second coupling surface, and the metal layer and the metal body form a coupling capacitance;
  • a matching circuit is electrically connected to the metal layer.
  • one end of the matching circuit is electrically connected to the metal layer, and the other end of the matching circuit is connected to the ground terminal.
  • the matching circuit also includes:
  • one end of the matching circuit is electrically connected to the metal layer
  • one end of the feeding structure is electrically connected to the other end of the matching circuit
  • the other end of the feeding structure is connected to the ground terminal.
  • the metal body acts as a radiator
  • the antenna coupling structure further includes: a radiator connected to the metal body.
  • an insulating layer is provided between the metal layer and the metal body.
  • the separation distance between the first coupling surface and the second coupling surface is 0.02mm-0.06mm.
  • the side of the circuit board close to the metal body has an insulating area, and the metal layer is disposed on the insulating area.
  • the matching circuit includes:
  • At least one capacitor one end of the capacitor is electrically connected to the metal layer, and the other end of the capacitor is connected to the ground terminal.
  • the matching circuit includes:
  • a first capacitor and a second capacitor one end of the first capacitor is electrically connected to the metal layer, the other end of the first capacitor is electrically connected to one end of the second capacitor, and the other end of the second capacitor is electrically connected connected to the ground terminal.
  • the side of the circuit board close to the metal body is provided with a groove, and the metal layer is arranged in the groove.
  • embodiments of the present application provide an electronic device, including the antenna coupling structure described in the foregoing embodiments.
  • the electronic device further includes:
  • the metal body acts as a radiator, and the metal body constitutes at least part of the frame;
  • the antenna coupling structure includes: a metal body; The surface of the layer on the side close to the metal body has a first coupling surface, the surface of the metal body on the side close to the metal layer has a second coupling surface, and the first coupling surface is connected to the second coupling surface.
  • the coupling surfaces are parallel, the orthographic projection of the first coupling surface on the plane where the second coupling surface is located is at least partially located on the second coupling surface, the metal layer and the metal body form a coupling capacitor; the matching circuit, The matching circuit is electrically connected to the metal layer.
  • the metal layer and the metal body form a coupling capacitor.
  • one end of the matching circuit may be electrically connected to the metal layer, and the other end of the matching circuit may be Connected to the ground terminal, the return path length of the metal structure to the reference ground of the terminal through the coupling capacitor structure is less than the return path length of the metal structure to the reference ground of the terminal through the elastic body, and the connection through the coupling capacitor structure can remove the physical loop length of the elastic body.
  • the inductance of the antenna is good for high frequency return to the ground. After the antenna coupling structure is fed, it does not need to be electrically connected through an elastic body.
  • the coupling capacitor structure is connected to reduce the complexity of the electrical connection, reduce the occupied space, and avoid the terminal assembly process.
  • the elastic body connection has the problem of failure due to impact deformation.
  • FIG. 1 is a schematic structural diagram of an antenna coupling structure in an embodiment of the present application
  • Fig. 2 is a structural schematic diagram of the coordination between the metal layer and the metal body
  • FIG. 3 is another schematic structural diagram of an antenna coupling structure in an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of the cooperative arrangement of the metal layer and the metal body
  • Fig. 5 is another structural schematic diagram in which the metal layer and the metal body are cooperatively arranged
  • FIG. 6 is a schematic diagram of a structure when an insulating layer is arranged between the metal layer and the metal body.
  • circuit board 20 metal layer 21; insulating layer 22;
  • Feed structure 40 is provided.
  • the antenna coupling structure provided by the embodiments of the present application will be described in detail below with reference to FIGS. 1 to 6 , through specific embodiments and application scenarios.
  • the antenna coupling structure in the embodiment of the present application includes a metal body 10 , a circuit board 20 and a matching circuit 30 , wherein the side of the circuit board 20 close to the metal body 10 has a metal layer 21 ,
  • the metal layer 21 can be a copper layer, the metal layer 21 and the metal body 10 are arranged at intervals, an insulating medium layer or air can be filled between the metal layer 21 and the metal body 10, and the specific interval between the metal layer 21 and the metal body 10 can be selected as required,
  • the relative position between the metal layer 21 and the metal body 10 may be fixed.
  • the surface of the metal layer 21 on the side close to the metal body 10 has a first coupling surface
  • the surface of the metal body 10 on the side close to the metal layer 21 has a second coupling surface
  • the first coupling surface is parallel to the second coupling surface, there are Conducive to the formation of lumped parameter capacitors.
  • the metal layer 21 is distributed on the circuit board 20, and the metal layer 21 may be insulated from the main ground of the circuit board 20 or the reference ground of the terminal. The insulation means that the direct current is not conductive.
  • the orthographic projection of the first coupling surface on the plane where the second coupling surface is located is at least partially located on the second coupling surface, for example, the orthographic projection of the first coupling surface on the plane where the second coupling surface is located may lie mostly on the second coupling surface , the metal layer 21 and the metal body 10 form a coupling capacitor, and the capacitance value of the coupling capacitor formed by the metal layer 21 and the metal body 10 below it can be several pF.
  • This coupling capacitor can be used to facilitate the passage of high-frequency signals.
  • the metal layer 21 and the metal body 10 form a coupling capacitor
  • one end of the matching circuit 30 can be electrically connected to the metal layer 21, and the other end of the matching circuit 30 can be connected to the ground terminal.
  • Returning to the ground through the coupling capacitor structure is more conducive to the return of high-frequency signals to the ground.
  • the connection through the coupling capacitor structure can remove the inductance reflected by the physical loop length of the elastic body. The occupied space is reduced, and the problem of failure due to impact deformation due to the elastic body connection in the terminal assembly process is avoided.
  • Capacitance is conducive to the passage of high-frequency signals, while inductance is not conducive to the passage of high-frequency signals.
  • the length of the return path from the metal structure to the terminal reference ground through the coupling capacitor structure is smaller than the return path length of the metal structure to the terminal reference ground through the elastic body.
  • the electrical connection is actually an inductive electrical connection, and it is more beneficial for the high-frequency signal to return to the ground through the coupling capacitor structure.
  • This coupling structure can be applied to various antennas, and can greatly remove the elastic electrical connection in the antenna system of the mobile terminal.
  • the medium and high frequencies can be: 1.71GHz-2.69GHz; the intermediate frequency can be: 1.71GHz-2.17GHz; the high frequency can be: 2.3GHz- 2.69GHz.
  • one end of the matching circuit 30 can be electrically connected to the metal layer 21 , the other end of the matching circuit 30 can be connected to the ground terminal, and a tuning signal can be performed through the matching circuit 30 .
  • the return path length of the metal structure to the terminal reference ground through the coupling capacitor is smaller than the return path length of the metal structure to the terminal reference ground through the elastic body.
  • the coupling capacitor can be used as a part of the matching capacitor required by the antenna, and the coupling capacitor and the matching circuit 30 can form a tuning circuit of the antenna.
  • the matching circuit 30 may include lumped parameter inductance, capacitance, or a combination of inductance and capacitance, as well as a switch-controlled inductance, capacitance, or combination of inductance and capacitance, which may be selected according to actual conditions.
  • the antenna coupling structure may further include: a feed structure 40 , one end of the matching circuit 30 is electrically connected to the metal layer 21 , the feed structure 40 may include a feed source, and the One end is electrically connected to the other end of the matching circuit 30 , and the other end of the feeding structure 40 is connected to the ground. Signals can be fed through the feeding structure 40 , and the fed signals can be radiated after being tuned by the matching circuit 30 .
  • the metal body 10 may be a part of the frame of the electronic device, and the frame may be used as a radiator to enhance radiation performance.
  • the metal body 10 can be connected to the antenna branch, the antenna branch can be formed by metal slits, and the antenna branch can have a radiation effect.
  • the metal body 10 can be used as a radiator or connected with the radiator.
  • the incoming signal is radiated by the radiator.
  • the coupling section has resonance and obvious radiation effect, and the control of the feed source to the radiator is realized through the principle of distributed capacitance.
  • the feed source in this application can be directly coupled to the radiator. Capacitance, with the radiator removed, can degrade the resonance characteristics.
  • the metal body 10 can be used as a radiator; or, the antenna coupling structure can further include a radiator, the radiator is connected to the metal body 10 , and the feeding structure 40 can feed a signal, and the fed signal passes through the matching circuit 30 After the tuning of the antenna, it can be radiated through the radiator, and the antenna coupling structure does not need to realize electrical connection through the elastic body after feeding, so as to reduce the occupied space and improve the performance of the antenna.
  • an insulating layer 22 may be provided between the metal layer 21 and the metal body 10 , and the insulating layer 22 may be an insulating resin, for example, the insulating layer 22 may be a polyester resin (Polyethylene Terephthalate, PET), the insulating layer 22 can be filled between the metal layer 21 and the metal body 10 to produce a supporting effect, so that the distance between the metal layer 21 and the metal body 10 is kept stable.
  • the insulating layer 22 may be a polyester resin (Polyethylene Terephthalate, PET), the insulating layer 22 can be filled between the metal layer 21 and the metal body 10 to produce a supporting effect, so that the distance between the metal layer 21 and the metal body 10 is kept stable.
  • the surface of the metal layer 21 on the side close to the metal body 10 has the first coupling surface, for example, the surface of the metal layer 21 on the side close to the metal body 10 is all the first coupling surface, and the metal body
  • the surface of 10 on the side close to the metal layer 21 has a second coupling surface, the first coupling surface and the second coupling surface are parallel and spaced apart, and the orthographic projection of the first coupling surface on the plane where the second coupling surface is located At least part of it is located on the second coupling surface, so that the metal layer 21 and the metal body 10 can form a coupling capacitor, and can form a parallel plate structure capacitor.
  • the separation distance between the first coupling surface and the second coupling surface may be 0.02mm-0.06mm, for example, the separation distance between the first coupling surface and the second coupling surface may be 0.04mm, so that Appropriate coupling capacitance values can be obtained when the coupling area is small, which is beneficial to form a lumped parameter capacitance and is beneficial to the layout of components on the circuit board 20 .
  • the side of the circuit board 20 close to the metal body 10 has an insulating area, and the metal layer 21 is disposed on the insulating area.
  • a copper-free area on the circuit board 20 may be set around the metal layer 21 , and the metal layer 21 may be connected to the matching circuit of the antenna through traces.
  • the matching circuit 30 may include at least one capacitor, one end of the capacitor is electrically connected to the metal layer 21, and the other end of the capacitor is connected to the ground. to tune.
  • the matching circuit 30 may include a capacitor, one end of the capacitor may be electrically connected to the metal layer 21, and the other end may be connected to the ground terminal, and a tuning circuit can be formed through the cooperation of the capacitor and the coupling capacitor to tune the signal.
  • the matching circuit 30 can include a plurality of capacitors, and the plurality of capacitors can be connected in series to form a series capacitor. One end of the series capacitor is electrically connected to the metal layer 21, and the other end of the series capacitor is connected to the ground terminal. Through the cooperation of the series capacitor and the coupling capacitor, a tuning can be formed. circuit to tune the signal.
  • the matching circuit 30 may include a first capacitor and a second capacitor, one end of the first capacitor is electrically connected to the metal layer 21 , the other end of the first capacitor is electrically connected to one end of the second capacitor, and the second capacitor is electrically connected to one end of the second capacitor. The other end is connected to the ground terminal.
  • the capacitance value of the first capacitor and the second capacitor may be 3.5pF, and the first capacitor and the second capacitor may cooperate with the coupling capacitor to tune the signal by setting the first capacitor and the second capacitor.
  • the side of the circuit board 20 close to the metal body 10 may be provided with a groove, and the metal layer 21 may be provided in the groove. Occupied, and at the same time, the wear of the metal layer 21 can be reduced, and the interference between the metal layer 21 and other components or wirings can be reduced.
  • the antenna resonator arm structure with appropriate physical size can be designed, so that the low frequency band of the antenna covering the frequency range needs to be matched with a series capacitor, which is a conventional inverted-F antenna, and the coupling capacitor is a part of the matching capacitor required by the antenna. Because the capacitance is high-pass, the relatively high-frequency part in the frequency range covered by the antenna can also pass through this coupling structure.
  • the elastic body will produce sliding deformation during the micro-vibration process of the terminal, and its force will cause the metal surface to wear, and the non-wearable adhesive metal surface is not suitable for the design of electrical connection with the elastic body, which can be solved by the antenna coupling structure in this application.
  • the space required for the electrical connection structure of the elastomer is larger than the space required for the capacitance of the coupling structure, which can reduce the design space of the antenna.
  • the electric constant ⁇ r can also affect the size of the coupling capacitance, C is proportional to the product of S, ⁇ r ; C and d are inversely proportional.
  • the capacitance of the coupling capacitor can be controlled by adjusting the coupling area, coupling spacing and changing the filling medium.
  • the coupling surface of the metal body 10 under the metal layer 21 is generally realized by machining, and the coupling surface is selected as the reference datum surface for machining, which can eliminate the cumulative tolerance caused by the non-datum surface.
  • the metal layer 21 is arranged on the surface of the circuit board.
  • the surface of the metal layer 21 can be covered with a green oil layer to achieve insulation, or it can be designed to open a window with green oil. Because the machining tolerance is generally 0.1mm, considering the accuracy of the coupling capacitance, if the coupling distance If the coupling area is large, a larger coupling area is required, which is not conducive to the layout of electronic components on the circuit board.
  • the capacitance value of the coupling capacitor can reach 2pF.
  • the thickness of the green oil layer is 0.015mm ⁇ 0.01mm, and the thickness tolerance can reach 33%-66%, so the capacitance value of the coupling capacitor may also fluctuate.
  • Mass production of antennas The performance will also have a large fluctuation range. In this case, it is not necessary to increase the coupling capacitor. The larger the capacitance value, the weaker the impedance matching effect. Control, the fluctuation can be controlled within 10% or even smaller fluctuation range.
  • the equivalent calculation of the series capacitance it can be seen that two 3.3pF (industry manufacturing accuracy is ⁇ 0.1pF) capacitors can be connected in series after the coupling capacitor.
  • the calculation of the combined capacitance accuracy shows that the lower limit fluctuation ratio of the capacitance value is 11.4%, and the upper limit value fluctuation ratio of the capacitance value is 9.2%, which basically achieves the 1pF lumped parameter capacitor matching accuracy.
  • Embodiments of the present application provide an electronic device, including the antenna coupling structure described in the foregoing embodiments.
  • the electronic device with the antenna coupling structure in the above embodiment does not need to be electrically connected through an elastic body after the antenna coupling structure is fed, which reduces the complexity of the electrical connection, reduces the occupied space, and improves the antenna performance.
  • the electronic device further includes: a frame body, the metal body 10 can be used as a radiator, and the metal body 10 constitutes at least part of the frame body; or, the metal body 10 is connected to the frame body, and the frame body can be For the radiator, using the frame as the metal body 10 can facilitate radiation and improve the performance of the antenna.

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Abstract

一种天线耦合结构和电子设备，涉及终端领域，天线耦合结构包括：金属体；电路板，电路板上靠近金属体的一侧具有金属层，金属层与金属体间隔设置，金属层与金属体相对的表面具有平行的耦合面，金属层与金属体构成耦合电容，匹配电路与金属层电连接。

Description

天线耦合结构和电子设备
相关申请的交叉引用
本申请主张在2021年3月12日在中国提交的中国专利申请号No.202110269325.X的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于终端技术领域，具体涉及一种天线耦合结构和电子设备。
背景技术
移动终端快速更新换代，天线工作频段越来越多，对天线设计提出更多的需求，比如：位置、尺寸、空间、性能等。天线耦合结构馈电后需要通过弹性体实现电连接，不利于高频信号回地，结构比较复杂，存在制程的可靠性较差的问题，例如，弹性体受到撞击变形失效；另外，弹性体电连接占用空间，增加天线和地之间的耦合电容导致性能降低或增加电连接设计复杂度。
发明内容
本申请实施例的目的是提供一种天线耦合结构和电子设备，用以解决天线耦合结构馈电后需要通过弹性体实现电连接，不利于高频信号回地，弹性体受到撞击容易变形失效的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供了一种天线耦合结构，包括：
金属体；
电路板，所述电路板上靠近所述金属体的一侧具有金属层，所述金属层与所述金属体间隔设置，所述金属层的靠近所述金属体的一侧的表面具有第一耦合面，所述金属体的靠近所述金属层的一侧的表面具有第二耦合面，所述第一耦合面与所述第二耦合面平行，所述第一耦合面在所述第二耦合面所在平面上的正投影至少部分位于所述第二耦合面上，所述金属层与所述金属体构成耦合电容；
匹配电路，所述匹配电路与所述金属层电连接。
其中，所述匹配电路的一端与所述金属层电连接，所述匹配电路的另一端与接地端连接。其中，还包括：
馈电结构，所述匹配电路的一端与所述金属层电连接，所述馈电结构的一端与所述匹配电路的另一端电连接，所述馈电结构的另一端与接地端连接。
其中，所述金属体作为辐射体；或者
所述天线耦合结构还包括：辐射体，所述辐射体与所述金属体连接。
其中，所述金属层与所述金属体之间设有绝缘层。
其中，所述第一耦合面与所述第二耦合面之间的间隔距离为0.02mm-0.06mm。
其中，所述电路板上靠近所述金属体的一侧具有绝缘区域，所述金属层设置于所述绝缘区域。
其中，所述匹配电路包括：
至少一个电容，所述电容的一端与所述金属层电连接，所述电容的另一端与所述接地端连接。
其中，所述匹配电路包括：
第一电容与第二电容，所述第一电容的一端与所述金属层电连接，所述第一电容的另一端与所述第二电容的一端电连接，所述第二电容的另一端与所述接地端连接。
其中，所述电路板上靠近所述金属体的一侧设有凹槽，所述金属层设置在所述凹槽中。
第二方面，本申请实施例提供了一种电子设备，包括上述实施例中所述的天线耦合结构。
其中，所述电子设备还包括：
框体，所述金属体作为辐射体，所述金属体构成所述框体的至少部分；或者
框体，所述金属体与所述框体连接，所述框体作为辐射体。根据本申请实施例的天线耦合结构，包括：金属体；电路板，所述电路板上靠近所述金属体的一侧具有金属层，所述金属层与所述金属体间隔设置，所述金属层的 靠近所述金属体的一侧的表面具有第一耦合面，所述金属体的靠近所述金属层的一侧的表面具有第二耦合面，所述第一耦合面与所述第二耦合面平行，所述第一耦合面在所述第二耦合面所在平面上的正投影至少部分位于所述第二耦合面上，所述金属层与所述金属体构成耦合电容；匹配电路，所述匹配电路与所述金属层电连接。在本申请的天线耦合结构中，所述金属层与所述金属体构成耦合电容，在应用过程中，所述匹配电路的一端可以与所述金属层电连接，所述匹配电路的另一端可以与接地端连接，金属结构通过耦合电容结构到终端参考地的回地路径长度小于金属结构通过弹性体到终端参考地的回地路径长度，通过耦合电容结构连接能除去弹性体物理回路长度映入的电感量，有利于高频回地，天线耦合结构馈电后不需要通过弹性体实现电连接，通过耦合电容结构连接，降低电连接复杂度，减小占用空间，避免在终端装配过程中由于弹性体连接存在受撞击变形失效的问题。
附图说明
图1为本申请实施例中天线耦合结构的一个结构示意图；
图2为金属层与金属体配合的一个结构示意图；
图3为本申请实施例中天线耦合结构的另一个结构示意图；
图4为金属层与金属体配合设置的一个结构示意图；
图5为金属层与金属体配合设置的另一个结构示意图；
图6为金属层与金属体之间设置绝缘层时的一个结构示意图。
附图标记
金属体10；
电路板20；金属层21；绝缘层22；
匹配电路30；
馈电结构40。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行 清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图1至图6，通过具体的实施例及其应用场景对本申请实施例提供的天线耦合结构进行详细地说明。
如图1至图6所示，本申请实施例中的天线耦合结构，包括金属体10、电路板20和匹配电路30，其中，电路板20上靠近金属体10的一侧具有金属层21，金属层21可以为铜层，金属层21与金属体10间隔设置，金属层21与金属体10之间可以填充绝缘介质层或空气，金属层21与金属体10的具体间隔可以根据需要选择，金属层21与金属体10之间的相对位置可以固定。金属层21的靠近金属体10的一侧的表面具有第一耦合面，金属体10的靠近金属层21的一侧的表面具有第二耦合面，第一耦合面与第二耦合面平行，有利于形成集中参数电容。其中，金属层21分布在电路板20上，金属层21可以与电路板20的主地或终端的参考地之间绝缘，绝缘是指直流不导通。第一耦合面在第二耦合面所在平面上的正投影至少部分位于第二耦合面上，比如，第一耦合面在第二耦合面所在平面上的正投影可以大部分位于第二耦合面上，金属层21与金属体10构成耦合电容，金属层21与其下方的金属体10构成的耦合电容的电容值可以为数个pF，因为电容为高通特性，在天线覆盖频段范围内相对高频部分也能通过此耦合电容，通过耦合电容有利于高频信号的通过。
在本申请的天线耦合结构中，在应用过程中，金属层21与金属体10构成耦合电容，匹配电路30的一端可以与金属层21电连接，匹配电路30的另一端可以与接地端连接，通过耦合电容结构回地更有利于高频率信号回地。 天线耦合结构馈电后不需要通过弹性体实现电连接，通过耦合电容结构连接能除去弹性体物理回路长度映入的电感量，有利于高频回地，降低电连接复杂度，加工成本低，减小占用空间，避免在终端装配过程中由于弹性体连接存在受撞击变形失效的问题。电容有利于高频信号通过，电感不利于高频信号通过，金属结构通过耦合电容结构到终端参考地的回地路径长度小于金属结构通过弹性体到终端参考地的回地路径长度，由于弹性体电连接实际是电感性电连接，通过耦合电容结构回地更有利于高频率信号回地。此耦合结构可以应用于各种天线，能大幅度去除移动终端天线系统内的弹性电连接，例如，此天线耦合结构可以应用于中高频天线、电磁波能量吸收比率传感器-天线(Specific Absorption Rate Sensor-Antenna，SAR sensor-ANT)兼容设计、低中高频天线等各种天线，其中，中高频可以为：1.71GHz-2.69GHz；中频可以为：1.71GHz-2.17GHz；高频可以为：2.3GHz-2.69GHz。
如图1所示，在应用过程中，匹配电路30的一端可以与金属层21电连接，匹配电路30的另一端可以与接地端连接，通过匹配电路30可以进行调谐信号。金属结构通过耦合电容到终端参考地的回地路径长度小于金属结构通过弹性体到终端参考地的回地路径长度，通过耦合电容结构回地更有利于高频率信号回地。耦合电容可以作为天线所需匹配电容的一部分，耦合电容可以与匹配电路30构成天线的调谐电路。其中，匹配电路30可以包括集中参数电感、电容或电感与电容的组合以及受开关控制的电感、电容或电感与电容的组合，具体可以根据实际情况选择。
在一些实施例中，如图3所示，天线耦合结构还可以包括：馈电结构40，匹配电路30的一端与金属层21电连接，馈电结构40可以包括馈源，馈电结构40的一端与匹配电路30的另一端电连接，馈电结构40的另一端与接地端连接，通过馈电结构40可以馈入信号，馈入的信号经过匹配电路30的调谐后可以辐射。金属体10可以为电子设备的框体的一部分，框体可以作为辐射体，增强辐射性能。金属体10可以连接于天线分支，天线分支可以由金属开缝形成，天线分支可以具有辐射作用。在天线应用中，金属体10可以作为辐射体或者金属体10与辐射体连接，馈入的信号经过辐射体辐射，天线耦合结构馈电后不需要通过弹性体实现电连接，降低电连接复杂度，减小占用空间， 避免在终端装配过程中由于弹性体连接存在受撞击变形失效的问题，提高天线性能。传统的耦合方式中，耦合分部具有谐振和明显的辐射作用，通过分布式电容的原理实现馈源到辐射体的控制，本申请中的馈源可以直接耦合辐射体，使用的原理是集中参数电容，在辐射体去除的情况下，可以降低谐振特性。
在一些实施例中，金属体10可以作为辐射体；或者，天线耦合结构还可以包括辐射体，辐射体与金属体10连接，馈电结构40可以馈入信号，馈入的信号经过匹配电路30的调谐后可以通过辐射体进行辐射，天线耦合结构馈电后不需要通过弹性体实现电连接，减小占用空间，提高天线性能。
在另一些实施例中，如图6所示，金属层21与金属体10之间可以设有绝缘层22，绝缘层22可以为绝缘树脂，比如，绝缘层22可以为涤纶树脂(Polyethylene Terephthalate，PET)，绝缘层22可以填充在金属层21与金属体10之间以产生支撑作用，使得金属层21与金属体10之间的间距保持稳定。
在本申请的实施例中，金属层21的靠近金属体10的一侧的表面具有第一耦合面，比如金属层21的靠近金属体10的一侧的表面全部为第一耦合面，金属体10的靠近金属层21的一侧的表面具有第二耦合面，所述第一耦合面与所述第二耦合面平行且间隔开，第一耦合面在第二耦合面所在平面上的正投影至少部分位于第二耦合面上，以使得金属层21与金属体10可以构成耦合电容，可以形成平行板结构电容。
其中，所述第一耦合面与所述第二耦合面之间的间隔距离可以为0.02mm-0.06mm，比如，第一耦合面与第二耦合面之间的间隔距离可以为0.04mm，这样可以在耦合面积较小时获得合适的耦合电容值，有利于形成集中参数电容，有利电路板20上元器件的布局。
在一些实施例中，电路板20上靠近金属体10的一侧具有绝缘区域，金属层21设置于绝缘区域。比如，金属层21周边可以设置电路板20禁止铺铜区，金属层21可以通过走线与天线的匹配电路相连接。
在本申请的实施例中，匹配电路30可以包括至少一个电容，电容的一端与金属层21电连接，电容的另一端与接地端连接，通过电容与耦合电容的配合可以构成调谐电路以对天线进行调谐。匹配电路30可以包括一个电容，一 个电容的一端可以与金属层21电连接，另一端可以与接地端连接，通过该电容与耦合电容的配合可以构成调谐电路以对信号进行调谐。匹配电路30可以包括多个电容，多个电容可以串联构成串联电容，串联电容的一端与金属层21电连接，串联电容的另一端与接地端连接，通过串联电容与耦合电容的配合可以构成调谐电路以对信号进行调谐。
在一些实施例中，匹配电路30可以包括第一电容与第二电容，第一电容的一端与金属层21电连接，第一电容的另一端与第二电容的一端电连接，第二电容的另一端与所述接地端连接，比如，第一电容与第二电容的电容值可以为3.5pF，通过设置第一电容与第二电容可以与耦合电容配合以对信号进行调谐。
在本申请的实施例中，电路板20上靠近金属体10的一侧可以设有凹槽，金属层21可以设置在凹槽中，比如金属层21可以全部置于凹槽中，减少空间的占用，同时又可以减少金属层21的磨损，减少金属层21与其他元器件或走线之间的干涉。
在应用过程中，可以设计适当物理尺寸的天线谐振臂结构，使其天线覆盖频段范围的低频段所需匹配为串联电容，既常规倒F型天线，耦合电容既天线所需匹配电容的一部分，因为电容为高通特性，在天线覆盖频段范围内相对高频部分也能通过此耦合结构。弹性体在终端微振动过程中会产滑动形变，其作用力会造成金属表面磨损，不耐磨的附着性金属表面不适合用弹性体设计电连接，通过本申请中的天线耦合结构既可解决不耐磨金属面的馈电问题，避免金属表面的磨损。弹性体电连接结构需求空间大于耦合结构电容所需空间，可以降低天线的设计空间。
耦合电容的电容量大小可以根据平行板电容计算公式C＝ξ r*S/(4*л*K*d)设计，其中，K为玻尔兹曼常数，ξ r为填充介质的介电常数，л为圆周率常数，d为平面耦合间距，S为耦合面积，由此可见，通过耦合面积与耦合间距的比值可以影响耦合电容的大小；金属层21与金属体10之间的填充介质的介电常数ξ r也可影响耦合电容的大小，C正比于S、ξ r的乘积；C与d成反比例关系。可以根据调节耦合面积、耦合间距与改变填充介质来控制耦合电容的电容量。
在实际应用中，金属层21下方的金属体10耦合面一般用机械加工实现，耦合面选择为机械加工参考基准面，可以消除非基准面带来的累计公差。金属层21布置在电路板的表面，金属层21表面可以覆盖绿油层来实现绝缘，也可以设计为绿油开窗，因机械加工公差一般在0.1mm，考虑耦合电容的精度影响，如果耦合间距大则需要更大的耦合面积，不利于电路板上电子元器件的布局，所以设计上可以设置一个较小的耦合间距，在耦合面积很小的时候也能达到pF级耦合电容，例如：d＝0.05mm，S＝3.2mm2，ξ r＝3.5，耦合电容的电容值可以达到2pF。因电路板的制程工艺在叠成分布上也存在公差，绿油层的厚度为0.015mm±0.01mm，厚度公差可达到33％-66％，因此耦合电容的电容值也可能产生波动，批量生产天线性能也会存在较大的波动范围，这种情况下不需要将耦合电容增大，电容值越大其阻抗匹配作用也微弱，天线上的主匹配电容可以由耦合电容之后连接的串联集中参数电容控制，波动可以控制在10％以内甚至更小的波动范围。
在制造过程中，可以通过设计降低公差，比如：d＝0.04mm，S＝4.5mm 2，ξ r＝3.5，耦合电容计值为3.5pF，绿油层厚度公差为0.01mm，耦合电容可控公差即为1/4＝25％，设定目标匹配电容为1.1pF，根据串联电容等效计算可知，在耦合电容之后串联两个3.3pF(行业制造精度为±0.1pF)电容既能实现。其组合电容精度计算可知，电容值下限波动比例为11.4％，电容上限值波动比例为9.2％，基本上达到了1pF集中参数电容匹配精度。
本申请实施例提供一种电子设备，包括上述实施例中所述的天线耦合结构。
具有上述实施例中天线耦合结构的电子设备，天线耦合结构馈电后不需要通过弹性体实现电连接，降低电连接复杂度，减小占用空间，提高天线性能。
在本申请的实施例中，所述电子设备还包括：框体，金属体10可以作为辐射体，金属体10构成框体的至少部分；或者，金属体10与框体连接，框体可以为辐射体，将框体作为金属体10能够有利于辐射，提高天线的性能。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的， 本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (12)

  1. 一种天线耦合结构，包括：
    金属体；
    电路板，所述电路板上靠近所述金属体的一侧具有金属层，所述金属层与所述金属体间隔设置，所述金属层的靠近所述金属体的一侧的表面具有第一耦合面，所述金属体的靠近所述金属层的一侧的表面具有第二耦合面，所述第一耦合面与所述第二耦合面平行，所述第一耦合面在所述第二耦合面所在平面上的正投影至少部分位于所述第二耦合面上，所述金属层与所述金属体构成耦合电容；
    匹配电路，所述匹配电路与所述金属层电连接。
  2. 根据权利要求1所述的天线耦合结构，其中，所述匹配电路的一端与所述金属层电连接，所述匹配电路的另一端与接地端连接。
  3. 根据权利要求1所述的天线耦合结构，其中，还包括：
    馈电结构，所述匹配电路的一端与所述金属层电连接，所述馈电结构的一端与所述匹配电路的另一端电连接，所述馈电结构的另一端与接地端连接。
  4. 根据权利要求3所述的天线耦合结构，其中，所述金属体作为辐射体；或者
    所述天线耦合结构还包括：
    辐射体，所述辐射体与所述金属体连接。
  5. 根据权利要求1所述的天线耦合结构，其中，所述金属层与所述金属体之间设有绝缘层。
  6. 根据权利要求1所述的天线耦合结构，其中，所述第一耦合面与所述第二耦合面之间的间隔距离为0.02mm-0.06mm。
  7. 根据权利要求1所述的天线耦合结构，其中，所述电路板上靠近所述金属体的一侧具有绝缘区域，所述金属层设置于所述绝缘区域。
  8. 根据权利要求1或3所述的天线耦合结构，其中，所述匹配电路包括：
    至少一个电容，所述电容的一端与所述金属层电连接，所述电容的另一端与接地端连接。
  9. 根据权利要求8所述的天线耦合结构，其中，所述匹配电路包括：
    第一电容与第二电容，所述第一电容的一端与所述金属层电连接，所述第一电容的另一端与所述第二电容的一端电连接，所述第二电容的另一端与所述接地端连接。
  10. 根据权利要求1所述的天线耦合结构，其中，所述电路板上靠近所述金属体的一侧设有凹槽，所述金属层设置在所述凹槽中。
  11. 一种电子设备，其中，包括如权利要求1-10中任一项所述的天线耦合结构。
  12. 根据权利要求11所述的电子设备，其中，所述电子设备还包括：
    框体，所述金属体作为辐射体，所述金属体构成所述框体的至少部分；或者
    框体，所述金属体与所述框体连接，所述框体作为辐射体。
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