WO2022170661A1 - Array substrate, and display panel and display apparatus thereof - Google Patents

Array substrate, and display panel and display apparatus thereof Download PDF

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Publication number
WO2022170661A1
WO2022170661A1 PCT/CN2021/081923 CN2021081923W WO2022170661A1 WO 2022170661 A1 WO2022170661 A1 WO 2022170661A1 CN 2021081923 W CN2021081923 W CN 2021081923W WO 2022170661 A1 WO2022170661 A1 WO 2022170661A1
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WO
WIPO (PCT)
Prior art keywords
transistor
light
reset
emitting
coupled
Prior art date
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PCT/CN2021/081923
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French (fr)
Chinese (zh)
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WO2022170661A9 (en
Inventor
刘利宾
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京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/639,312 priority Critical patent/US20230351958A1/en
Priority to EP21925317.6A priority patent/EP4113497A4/en
Priority to CN202211236443.1A priority patent/CN115497964A/en
Priority to KR1020237002887A priority patent/KR20230140545A/en
Priority to JP2022566225A priority patent/JP2024508575A/en
Priority to CN202180000505.6A priority patent/CN114175257B/en
Publication of WO2022170661A1 publication Critical patent/WO2022170661A1/en
Publication of WO2022170661A9 publication Critical patent/WO2022170661A9/en
Priority to US18/307,028 priority patent/US20230267888A1/en

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G09G3/3233Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element

Definitions

  • Embodiments of the present disclosure relate to the field of display technology, and in particular, to an array substrate, a display panel and a display device thereof.
  • OLED display panels have the advantages of self-luminescence, high efficiency, bright colors, light weight, power saving, rollability, and wide temperature range, and have been gradually applied to large-area displays, lighting, and automotive displays. and other fields.
  • Embodiments of the present disclosure provide array substrates and related display panels and display devices.
  • an array substrate including a substrate.
  • the array substrate further includes a plurality of sub-pixels arranged on the substrate and arranged in rows and columns. At least one of the plurality of subpixels includes a pixel circuit.
  • Each pixel circuit includes: a driving circuit, a voltage regulator circuit, a driving reset circuit and a light-emitting reset circuit.
  • the driving circuit includes a control terminal, a first terminal and a second terminal, and is configured to provide a driving current to the light emitting device.
  • the voltage stabilizing circuit is coupled to the control terminal of the driving circuit, the first node and the voltage stabilizing control signal input terminal, and is configured to enable the control of the driving circuit under the control of the voltage stabilizing control signal from the voltage stabilizing control signal input terminal terminal and the first node are turned on.
  • the driving reset circuit is coupled to the driving reset control signal input terminal, the first node and the driving reset voltage terminal, and is configured to convert the driving reset voltage terminal from the driving reset voltage terminal under the control of the driving reset control signal from the driving reset control signal input terminal.
  • the reset voltage is provided to the voltage regulator circuit to reset the control terminal of the drive circuit.
  • the light-emitting reset circuit is coupled to the light-emitting reset control signal input end, the light-emitting device and the light-emitting reset voltage end, and is configured to reset the light-emitting reset voltage from the light-emitting reset voltage end under the control of the light-emitting reset control signal from the light-emitting reset control signal input end
  • a voltage is supplied to the light emitting device to reset the light emitting device.
  • the array substrate further includes a driving reset voltage line and a light emitting reset voltage line.
  • the driving reset voltage line is coupled to the driving reset voltage terminal to provide the driving reset voltage.
  • the light-emitting reset voltage line is coupled to the light-emitting reset voltage terminal to provide the light-emitting reset voltage.
  • the driving circuit includes a driving transistor.
  • the voltage regulator circuit includes a voltage regulator transistor.
  • the drive reset circuit includes a drive reset transistor.
  • the light-emitting reset circuit includes a light-emitting reset transistor.
  • the first pole of the driving transistor is coupled to the first terminal of the driving circuit, the gate of the driving transistor is coupled to the control terminal of the driving circuit, and the second pole of the driving transistor is coupled to the second terminal of the driving circuit.
  • the first electrode of the voltage-stabilizing transistor is coupled to the control terminal of the driving circuit, the gate of the voltage-stabilizing transistor is coupled to the input terminal of the voltage-stabilizing control signal, and the second electrode of the voltage-stabilizing transistor is coupled to the first node.
  • the first electrode of the drive reset transistor is coupled to the drive reset voltage terminal, the gate of the drive reset transistor is coupled to the drive reset control signal input end, and the second electrode of the drive reset transistor is coupled to the first node.
  • the first electrode of the light-emitting reset transistor is coupled to the light-emitting reset voltage terminal, the gate of the light-emitting reset transistor is coupled to the light-emitting reset control signal input end, and the second electrode of the light-emitting reset transistor is coupled to the first end of the light-emitting device .
  • the active layer of the voltage regulator transistor includes an oxide semiconductor material.
  • the active layers of the drive transistor and the drive reset transistor include silicon semiconductor material.
  • the active layer of the light-emitting reset transistor includes an oxide semiconductor material.
  • the array substrate further includes: a first active semiconductor layer on the substrate, the first active semiconductor layer comprising a silicon semiconductor material; and the first active semiconductor layer facing away from the substrate A second active semiconductor layer on one side and insulated from the first active semiconductor layer, the second active semiconductor layer comprising an oxide semiconductor material.
  • the first active semiconductor layer includes an active layer of a driving transistor and an active layer of a driving reset transistor.
  • the second active semiconductor layer includes a first portion and a second portion arranged in a column direction.
  • the first portion of the second active semiconductor includes the active layer of the voltage regulator transistor.
  • the second portion of the second active semiconductor includes the active layer of the light emitting reset transistor.
  • the first portion of the second active semiconductor is aligned with the second portion of the second active semiconductor in the column direction.
  • the pixel circuit further includes a data writing circuit, a compensation circuit, a storage circuit, and a light emission control circuit.
  • the data writing circuit is coupled to the data signal input terminal, the scan signal input terminal and the first terminal of the driving circuit, and is configured to provide the data signal from the data signal input terminal under the control of the scan signal from the scan signal input terminal to the first terminal of the drive circuit.
  • the compensation circuit is coupled to the second end of the drive circuit, the first node and the compensation control signal input end, and is configured to perform threshold compensation on the drive circuit according to the compensation control signal from the compensation control signal input end.
  • the storage circuit is coupled to the first power supply voltage terminal and the control terminal of the driving circuit, and is configured to store a voltage difference between the first power supply voltage terminal and the control terminal of the driving circuit.
  • the lighting control circuit is coupled to the lighting control signal input terminal, the first power supply voltage terminal, the first terminal and the second terminal of the driving circuit, the lighting reset circuit and the lighting device, and is configured to be in the middle of the lighting control signal from the lighting control signal input terminal. Under control, the first power supply voltage from the first power supply voltage terminal is applied to the driving circuit, and the driving current generated by the driving circuit is applied to the light emitting device.
  • the data writing circuit includes a data writing transistor.
  • the compensation circuit includes a compensation transistor.
  • the storage circuit includes a storage capacitor.
  • the lighting control circuit includes a first lighting control transistor and a second lighting control transistor. The first pole of the data writing transistor is coupled to the data signal input terminal, the gate of the data writing transistor is coupled to the scan signal input terminal, and the second pole of the data writing transistor is coupled to the first terminal of the driving circuit catch.
  • the first electrode of the compensation transistor is coupled to the second end of the driving circuit, the gate of the compensation transistor is coupled to the compensation control signal input end, and the second electrode of the compensation transistor is coupled to the first node.
  • the first pole of the storage capacitor is coupled to the first power supply voltage terminal
  • the second pole of the storage capacitor is coupled to the control terminal of the driving circuit, and is configured to store the voltage between the first power supply voltage terminal and the control terminal of the driving circuit Difference.
  • the first electrode of the first light-emitting control transistor is coupled to the first power supply voltage terminal
  • the gate of the first light-emitting control transistor is coupled to the light-emitting control signal input end
  • the second electrode of the first light-emitting control transistor is coupled to the driving circuit. The first end is coupled.
  • the gate of the second light-emitting control transistor is coupled to the light-emitting control signal input end
  • the second electrode of the second light-emitting control transistor is coupled to the input end of the light-emitting control signal.
  • the first pole of the light emitting device is coupled.
  • the first active semiconductor layer includes an active layer of a data writing transistor, a compensation transistor, a first light emission control transistor, and a second light emission control transistor.
  • the light-emitting reset control signal and the light-emitting control signal are the same signal.
  • the scan signal and the compensation control signal are the same signal.
  • the array substrate further includes a spacer between the first active semiconductor layer and the second active semiconductor layer and insulated from the first active semiconductor layer and the second active semiconductor layer the first conductive layer.
  • the first conductive layer includes a drive reset control signal line, a scan signal line, a gate of a drive transistor, a first electrode of a storage capacitor, and a light emission control signal line, which are sequentially arranged along the column direction.
  • the drive reset control signal line is coupled to the drive reset control signal input terminal, and is configured to provide the drive reset control signal thereto.
  • the scan signal line is coupled to a scan signal input terminal and a compensation control signal input terminal, is configured to provide a scan signal to the scan signal input terminal, and is configured to provide a compensation control signal to the compensation control signal input terminal.
  • the first electrode of the storage capacitor and the gate of the driving transistor are integrally formed.
  • the light-emitting control signal line is coupled to the light-emitting control signal input terminal, and is configured to provide the light-emitting control signal thereto.
  • the overlapping portion of the orthographic projection of the driving reset control signal line on the substrate and the orthographic projection of the first active semiconductor layer on the substrate is the gate of the driving reset transistor.
  • the overlapping portion of the orthographic projection of the scanning signal line on the substrate and the orthographic projection of the first active semiconductor layer on the substrate is the gate of the compensation transistor and the gate of the data writing transistor.
  • the overlapping part of the orthographic projection of the light-emitting control signal line on the substrate and the orthographic projection of the first active semiconductor layer on the substrate is the gate of the first light-emitting control transistor and the gate of the second light-emitting control transistor.
  • the array substrate further includes a second conductive layer located between the first conductive layer and the second active semiconductor layer and insulated from the first conductive layer and the second active semiconductor layer .
  • the second conductive layer includes a voltage regulation control signal line arranged along the column direction, a second pole of the storage capacitor, a first power supply voltage line and a light-emitting reset control signal line.
  • the voltage stabilization control signal line is coupled to the voltage stabilization control signal input terminal, and is configured to provide the voltage stabilization control signal thereto.
  • the first power supply voltage line is coupled to the first power supply voltage terminal and is configured to provide the first power supply voltage thereto.
  • the second pole of the storage capacitor at least partially overlaps the orthographic projection of the first pole of the storage capacitor on the substrate.
  • the second pole of the storage capacitor is integrally formed with the first power supply voltage line.
  • the light-emitting reset control signal line is coupled to the light-emitting reset control signal input terminal, and is configured to provide the light-emitting reset control signal thereto.
  • the overlapping portion of the orthographic projection of the voltage-stabilizing control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the first gate of the voltage-stabilizing transistor.
  • the overlapping part of the orthographic projection of the light-emitting control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the first control electrode of the light-emitting reset transistor.
  • the array substrate further includes a third conductive layer located on a side of the second active semiconductor layer away from the substrate and insulated from the second active semiconductor layer.
  • the third conductive layer includes voltage regulation control signal lines, light emission reset control signal lines, and light emission reset voltage lines arranged along the column direction.
  • the overlapping portion of the orthographic projection of the voltage-stabilizing control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the second gate of the voltage-stabilizing transistor.
  • the overlapping portion of the orthographic projection of the light-emitting control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the second control electrode of the light-emitting reset transistor. and the light-emitting reset voltage line is coupled to the second active semiconductor layer through the via hole to form the first electrode of the light-emitting reset transistor.
  • the array substrate further includes a fourth conductive layer located on a side of the third conductive layer away from the substrate and insulated from the third conductive layer, the fourth conductive layer includes a first connection portion, A second connection portion, a third connection portion, a fourth connection portion, a fifth connection portion, a sixth connection portion, a seventh connection portion, and an eighth connection portion.
  • the first connection portion serves as a drive reset voltage line.
  • the first connection portion is coupled to the drain region of the driving reset transistor through a via hole, and forms a first electrode of the driving reset transistor.
  • the second connection portion is coupled to the light-emitting reset voltage line through the via hole.
  • the third connection portion is coupled to the drain region of the data writing transistor through the via hole, and forms the first electrode of the data writing transistor.
  • the fourth connection portion is coupled to the source region of the drive reset transistor and the source region of the compensation transistor through a via hole, and forms a second electrode of the drive reset transistor and a second electrode of the compensation transistor, respectively.
  • the fourth connection portion is coupled to the source region of the voltage-stabilizing transistor through a via hole to form a second electrode of the voltage-stabilizing transistor.
  • the fifth connection portion is coupled to the gate of the driving transistor and the first electrode of the storage capacitor through the via hole, and the fifth connection portion is coupled to the drain region of the voltage-stabilizing transistor through the via hole, forming the first electrode of the voltage-stabilizing transistor. one pole.
  • the sixth connection portion is coupled to the drain region of the first light-emitting control transistor through a via hole, and forms a first electrode of the first light-emitting control transistor.
  • the seventh connection portion is coupled to the source region of the second light-emitting control transistor through a via hole to form a second electrode of the second light-emitting control transistor, and the seventh connection portion is coupled to the source region of the light-emitting reset transistor via a via hole connected to form the second pole of the light-emitting reset transistor.
  • the eighth connection part is coupled with the source region of the light-emitting reset transistor through the via hole, and forms the first electrode of the light-emitting reset transistor.
  • the array substrate further includes a fifth conductive layer located on a side of the fourth conductive layer away from the substrate and insulated from the fourth conductive layer.
  • the fifth conductive layer includes data signal lines, first power supply voltage lines, and second power supply voltage lines arranged along the row direction.
  • the data signal line extends along the column direction and is coupled to the third connection portion of the fourth conductive layer through the via hole.
  • the first power supply voltage line extends along the column direction and is coupled to the third connection portion of the fourth conductive layer through the via hole. and the second power supply voltage line extends along the column direction and is coupled to the seventh connection portion of the fourth conductive layer through the via hole.
  • a display panel includes the array substrate according to any one of the first aspects.
  • a display device includes the display panel according to any one of the second aspects.
  • FIG. 1 shows a schematic block diagram of an array substrate according to the present disclosure
  • FIG. 2 shows a schematic block diagram of a sub-pixel according to an embodiment of the present disclosure
  • FIG. 3 shows a schematic diagram of the pixel circuit in FIG. 2 according to an embodiment of the present disclosure
  • FIG. 4 illustrates a timing diagram of signals driving the pixel circuit in FIG. 3 according to an embodiment of the present disclosure
  • FIG. 12 shows a schematic plan layout of a pixel circuit including a stacked active semiconductor layer, a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer;
  • FIG. 13 shows a schematic cross-sectional structure diagram of the array substrate taken along the line A1A2 in FIG. 12 according to an embodiment of the present disclosure
  • FIG. 14 shows a schematic cross-sectional structure diagram of the array substrate taken along the line A1A2 in FIG. 12 according to an embodiment of the present disclosure
  • FIG. 15 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure
  • FIG. 16 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure
  • FIG. 17 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure
  • FIG. 18 shows a schematic plan layout of a pixel circuit including a stacked blocking layer, an active semiconductor layer, a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer;
  • FIG. 19 shows a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
  • FIG. 20 shows a schematic structural diagram of a display device according to an embodiment of the present disclosure
  • FIG. 21 shows a schematic diagram of a pixel circuit according to an embodiment of the present disclosure
  • FIG. 22 shows a schematic diagram of a blocking layer of an embodiment of the present disclosure
  • FIG. 23 shows a plan layout of a pixel circuit of an embodiment of the present disclosure
  • FIG. 24 shows a plan layout of a pixel circuit of an embodiment of the present disclosure
  • FIG. 25 shows a plan layout of a pixel circuit of an embodiment of the present disclosure
  • FIG. 26 shows a schematic cross-sectional structure diagram of an array substrate according to an embodiment of the present disclosure
  • FIG. 27 is a schematic diagram of a circuit structure of a pixel driving circuit in an exemplary embodiment of the disclosed array substrate
  • FIG. 28 is a timing diagram of each node in a driving method of the pixel driving circuit of FIG. 27;
  • FIG. 29 is a structural layout of an exemplary embodiment of the disclosed array substrate.
  • Fig. 30 is the structural layout of the light shielding layer in Fig. 29;
  • Fig. 31 is the structural layout of the first active layer in Fig. 29;
  • FIG. 32 is a structural layout of the first gate layer in FIG. 29;
  • FIG. 33 is a structural layout of the second gate layer in FIG. 29;
  • Fig. 34 is the structural layout of the second active layer in Fig. 29;
  • FIG. 35 is a structural layout of the third gate layer in FIG. 29;
  • FIG. 36 is a structural layout of the first source-drain layer in FIG. 29;
  • Fig. 37 is the structural layout of the light shielding layer and the first active layer in Fig. 29;
  • FIG. 38 is a structural layout of the light shielding layer, the first active layer, and the first gate layer in FIG. 29;
  • FIG. 39 is a structural layout of the light-shielding layer, the first active layer, the first gate layer, and the second gate layer in FIG. 29;
  • FIG. 40 is a structural layout of the light shielding layer, the first active layer, the first gate layer, the second gate layer, and the second active layer in FIG. 29;
  • 41 is a structural layout of the light shielding layer, the first active layer, the first gate layer, the second gate layer, the second active layer, and the third gate layer in FIG. 29;
  • FIG. 42 is a structural layout of an exemplary embodiment of the disclosed array substrate
  • FIG. 43 is a structural layout of the second source-drain layer in FIG. 42;
  • FIG. 44 is a structural layout of an exemplary embodiment of the disclosed array substrate
  • FIG. 45 is a structural layout of the second source-drain layer in FIG. 44;
  • 46 is a schematic structural diagram of a second initial signal line in another exemplary embodiment of the disclosed array substrate.
  • 47 is a schematic structural diagram of a second initial signal line in another exemplary embodiment of the disclosed array substrate.
  • FIG. 48 is a partial cross-sectional view taken along the dotted line B in FIG. 42 .
  • a reset voltage is supplied from the same reset voltage line to reset the light-emitting device and the pixel circuit.
  • the value of the reset voltage is set in consideration of the power consumption level of the pixel circuit, the display effect after compensation, and keeping the reset light-emitting device in an unlit state. In this case, the power consumption of the pixel circuit, the display effect after compensation, and the charging time of the light-emitting device after reset cannot be in an optimal state at the same time, thereby affecting the power consumption, response speed, accuracy, and display of the pixel circuit. Effect.
  • At least some embodiments of the present disclosure provide an array substrate including two reset voltage lines, a driving reset voltage line and a light emitting reset voltage line.
  • the driving reset voltage line is coupled to the driving reset voltage terminal to provide the driving reset voltage.
  • the light-emitting reset voltage line is coupled to the light-emitting reset voltage terminal to provide the light-emitting reset voltage.
  • the driving reset voltage may be set in consideration of the power consumption level of the pixel circuit and the reset effect. In the case of relatively low power consumption levels, the pixel circuit is reset more thoroughly, thereby improving the display effect.
  • the light-emitting reset voltage line is coupled to the light-emitting reset voltage terminal to provide the light-emitting reset voltage.
  • the light-emitting reset voltage can be set just when the light-emitting device is just not lit, thereby reducing the charging time of the light-emitting device before emitting light, thereby improving the response speed of the pixel circuit to the light-emitting signal, shortening the response time, and increasing the probability Accuracy.
  • FIG. 1 shows a schematic diagram of an array substrate 10 according to the present disclosure.
  • the array substrate 10 includes a substrate 300 and a plurality of sub-pixels SPX arranged on the substrate 300 and arranged in multiple rows and columns.
  • the substrate may be a glass substrate, a plastic substrate, or the like.
  • the display area of the substrate 300 includes a plurality of pixel units PX, and each pixel unit may include a plurality of sub-pixels SPX, for example, three.
  • the sub-pixels SPX are arranged at intervals along the row direction X and the column direction Y.
  • the row direction X and the column direction Y are perpendicular to each other.
  • At least one of the sub-pixels SPX includes a pixel circuit.
  • the array substrate 10 further includes a driving reset voltage line and a light emitting reset voltage line.
  • the driving reset signal line is coupled to the driving reset voltage terminal, and is configured to provide the driving reset voltage thereto.
  • the light-emitting reset voltage line is coupled to the light-emitting reset voltage terminal and configured to provide the light-emitting reset voltage thereto.
  • each pixel circuit includes: a driving circuit, a voltage regulator circuit, a driving reset circuit, a lighting reset circuit, a data writing circuit, a compensation circuit, a storage circuit, and a lighting control circuit.
  • the pixel circuit will be described in detail below with reference to FIG. 2 .
  • FIG. 2 shows a schematic block diagram of a sub-pixel according to some embodiments of the present disclosure.
  • the sub-pixel SPX includes a pixel circuit 100 and a light emitting device 200 .
  • the pixel circuit 100 includes: a driving circuit 110 , a voltage regulator circuit 120 , a driving reset circuit 130 , a lighting reset circuit 140 , a data writing circuit 150 , a compensation circuit 160 , a storage circuit 170 and a lighting control circuit 180 .
  • the driving circuit 110 includes a control terminal G, a first terminal F and a second terminal S.
  • the driving circuit 110 is configured to provide a driving current to the light emitting device 200 under the control of a control signal from the control terminal G.
  • the voltage-stabilizing circuit 120 is coupled to the control terminal G of the driving circuit 110 , the first node N1 and the voltage-stabilizing control signal input terminal Stv.
  • the voltage-stabilizing circuit 120 is configured to conduct the control terminal G of the driving circuit 110 with the first node N1 under the control of the voltage-stabilizing control signal from the voltage-stabilizing control signal input terminal.
  • the driving reset circuit 130 is coupled to the driving reset control signal input terminal Rst1 , the first node N1 and the driving reset voltage terminal Vinit1 .
  • the driving reset circuit 130 is configured to provide the driving reset voltage from the driving reset voltage terminal Vinit1 to the voltage regulator circuit 120 under the control of the driving reset control signal from the driving reset control signal input terminal Rst1, so as to control the control terminal of the driving circuit 110. G to reset.
  • the light-emitting reset circuit 140 is coupled to the light-emitting reset control signal input terminal Rst2, the light-emitting device 200, and the light-emitting reset voltage terminal Vinit2. Further, the light-emitting reset circuit 140 is also coupled to the light-emitting control circuit 180 .
  • the light emitting reset circuit 140 is configured to supply the light emitting reset voltage from the light emitting reset voltage terminal Vinit2 to the light emitting device 200 under the control of the light emitting reset control signal from the light emitting reset control signal input terminal Rst2 to reset the anode of the light emitting device 200 .
  • the data writing circuit 150 is coupled to the data signal input terminal Data, the scan signal input terminal Gate and the first terminal F of the driving circuit 110 .
  • the data writing circuit 150 is configured to supply the data signal from the data signal input terminal Data to the first terminal F of the driving circuit 110 under the control of the scan signal from the scan signal input terminal Gate.
  • the compensation circuit 160 is coupled to the second end S of the driving circuit 110 , the first node N1 and the compensation control signal input end Com.
  • the compensation circuit 160 is configured to perform threshold compensation on the driving circuit 110 according to the compensation control signal from the compensation control signal input terminal Com.
  • the scan signal from the scan signal input terminal Gate and the compensation control signal from the compensation control signal input terminal Com may be the same signal.
  • the storage circuit 170 is coupled to the first power supply voltage terminal VDD and the control terminal G of the driving circuit 110 .
  • the storage circuit 170 is configured to store the voltage difference between the first power supply voltage terminal VDD and the control terminal G of the driving circuit 110 .
  • the lighting control circuit 180 is coupled to the lighting control signal input terminal EM, the first power supply voltage terminal VDD, the first terminal F and the second terminal S of the driving circuit 110 , the lighting reset circuit 140 , and the lighting device 200 .
  • the lighting control circuit 180 is configured to apply the first power supply voltage from the first power supply voltage terminal VDD to the driving circuit 110 under the control of the lighting control signal from the lighting control signal input terminal EM, and to apply the driving current generated by the driving circuit 110 applied to the light emitting device 200 .
  • the lighting reset control signal from the lighting reset control signal input terminal Rst2 and the lighting control signal from the lighting control signal input terminal EM may be the same signal.
  • the light emission reset control signal from the light emission reset control signal input terminal Rst2 and the scan signal from the scan signal input terminal Gate may be the same signal.
  • the light-emitting device 200 is coupled to the second power supply voltage terminal VSS, the light-emitting reset circuit 140 and the light-emitting control circuit 180 .
  • the light emitting device 200 is configured to emit light under the driving of the driving current generated by the driving circuit 110 .
  • the light emitting device 200 may be a light emitting diode or the like.
  • the light emitting diode may be an organic light emitting diode (OLED), a quantum dot light emitting diode (QLED), or the like.
  • the voltage regulation control signal, the scan signal, the drive reset control signal, the light emission reset control signal, the compensation control signal, the light emission control signal, and the compensation control signal may be square waves, and the value range of the high level may be It is 0 ⁇ 15V, and the value range of the low level is 0 ⁇ -15V.
  • the high level is 7V
  • the low level is -7V.
  • the value range of the data signal may be 0 to 8V, for example, 2 to 5V.
  • the value range of the first power supply voltage Vdd may be 3-6V.
  • the value range of the second power supply voltage Vss may be 0-6V.
  • FIG. 3 shows a schematic diagram of the pixel circuit 100 in FIG. 2 .
  • the driving circuit 110 includes a driving transistor T1
  • the voltage-stabilizing circuit 120 includes a voltage-stabilizing transistor T2
  • the driving reset circuit 130 includes a driving reset transistor T3
  • the light-emitting reset circuit 140 includes a light-emitting reset transistor T4
  • the data writing circuit 150 includes The data is written into the transistor T5, the compensation circuit 160 includes a compensation transistor T6, the storage circuit 170 includes a storage capacitor C, and the light emission control circuit 180 includes a first light emission control transistor T7 and a second light emission control transistor T8.
  • the first pole of the driving transistor T1 is coupled to the first terminal F of the driving circuit 110
  • the second pole of the driving transistor T1 is coupled to the second terminal S of the driving circuit 110
  • the gate of the driving transistor T1 is It is coupled to the control terminal G of the driving circuit 110 .
  • the first pole of the voltage-stabilizing transistor T2 is coupled to the control terminal G of the driving circuit 110 , the gate of the voltage-stabilizing transistor T2 is coupled to the voltage-stabilizing control signal input terminal Stv, and the second electrode of the voltage-stabilizing transistor T2 is connected to the first node N1 coupled.
  • the first pole of the drive reset transistor T3 is coupled to the drive reset voltage terminal Vinit1, the gate of the drive reset transistor T3 is coupled to the drive reset control signal input terminal Rst1, and the second pole of the drive reset transistor T3 is coupled to the first node N1 .
  • the first pole of the light emitting reset transistor T4 is coupled to the light emitting reset voltage terminal Vinit2
  • the gate of the light emitting reset transistor T4 is coupled to the light emitting reset control signal input terminal Rst2
  • the second pole of the light emitting reset transistor T4 is coupled to the anode of the light emitting device 200 catch.
  • the second pole of the light-emitting reset transistor T4 is also coupled to the second pole of the second light-emitting control transistor T8.
  • the first pole of the data writing transistor T5 is coupled to the data signal input terminal Data
  • the gate of the data writing transistor T5 is coupled to the scanning signal input terminal Gate
  • the second pole of the data writing transistor T5 is coupled to the first pole of the driving circuit 110 .
  • One end F is coupled.
  • the first electrode of the compensation transistor T6 is coupled to the second end S of the driving circuit 110, the gate of the compensation transistor T6 is coupled to the compensation control signal input end Com, and the second electrode of the compensation transistor T6 is coupled to the first node N1.
  • the first pole of the storage capacitor C is coupled to the first power supply voltage terminal VDD, and the second pole of the storage capacitor C is coupled to the control terminal G of the driving circuit 110 .
  • the storage capacitor is configured to store the voltage difference between the first power supply voltage terminal VDD and the control terminal G of the driving circuit 110 .
  • the first electrode of the first light-emitting control transistor T7 is coupled to the first power supply voltage terminal VDD, the gate of the first light-emitting control transistor T7 is coupled to the light-emitting control signal input end EM, and the second electrode of the first light-emitting control transistor T7 is coupled to the light-emitting control signal input end EM.
  • the first end F of the driving circuit 110 is coupled.
  • the first electrode of the second light-emitting control transistor T8 is coupled to the second end S of the driving circuit 110 , the gate of the second light-emitting control transistor T8 is coupled to the light-emitting control signal input end EM, and the second light-emitting control transistor T8 The pole is coupled to the anode of the light emitting device 200 .
  • the active layers of the voltage-stabilizing transistor T2 and the light-emitting reset transistor T4 may include oxide semiconductor materials, such as metal oxide semiconductor materials.
  • Active layers of the driving transistor T1, the driving reset transistor T3, the data writing transistor T5, the compensation transistor T6, the first light emission control transistor T7 and the second light emission control transistor T8 may include silicon semiconductor materials.
  • the light emission reset transistor T4 and the first light emission control transistor T7 and the second light emission control transistor T8 may be different types of transistors.
  • the light-emission reset transistor T4 may be an N-type transistor
  • the first light-emission control transistor T7 and the second light-emission control transistor T8 may be P-type transistors.
  • the stabilizing transistor T2 may be an N-type transistor.
  • the driving transistor T1, the driving reset transistor T3, the data writing transistor T5, and the compensation transistor T6 may be P-type transistors.
  • the light-emitting reset transistor T4 and the data writing transistor T5 are transistors of the same type.
  • the light-emitting reset transistor T4 and the data writing transistor T5 may be P-type transistors.
  • the stabilizing transistor T2 may be an N-type transistor.
  • the driving transistor T1, the driving reset transistor T3, the compensation transistor T6, the first light emission control transistor T7 and the second light emission control transistor T8 may be P-type transistors.
  • the transistors used in the embodiments of the present disclosure can all be P-type transistors or N-type transistors, and it is only necessary to refer to the respective poles of the transistors of the selected type with reference to the corresponding transistors in the embodiments of the present disclosure.
  • Each pole is connected correspondingly, and the corresponding high voltage or low voltage can be provided at the corresponding voltage terminal.
  • the level of the control signal at the control terminal is also different.
  • the oxide semiconductor may include, for example, Indium Gallium Zinc Oxide (IGZO).
  • the silicon semiconductor material may include low temperature polysilicon (LTPS) or amorphous silicon (eg hydrogenated amorphous silicon). Low temperature polysilicon generally refers to the case where the crystallization temperature of polysilicon obtained by crystallization of amorphous silicon is lower than 600 degrees Celsius.
  • the pixel circuit of the sub-pixel may include other numbers of transistors in addition to the 8T1C (ie, eight transistors and one capacitor) structure shown in FIG. 4 . , such as an 8T2C structure, a 7T1C structure, a 7T2C structure, a 6T1C structure, a 6T2C structure, or a 9T2C structure, which is not limited in this embodiment of the present disclosure.
  • FIG. 4 is a timing diagram of signals driving the pixel circuit of FIG. 3 .
  • the working process of the pixel circuit 100 includes three stages, namely a first stage P1 , a second stage P2 and a third stage P3 .
  • the light-emitting reset control signal and the light-emitting control signal are the same signal
  • the voltage-stabilizing control signal and the scanning signal are the same signal
  • the voltage-stabilizing transistor T2 and the light-emitting reset transistor T4 are N-type transistors
  • the driving transistor T1 the driving reset transistor T3
  • the data writing Taking the input transistor T5 , the compensation transistor T6 , the first light emission control transistor T7 and the second light emission control transistor T8 as P-type transistors as an example, the working process of the pixel circuit in FIG. 4 will be described with reference to FIG. 3 .
  • a low-level drive reset control signal RST As shown in FIG. 4, in the first stage P1, a low-level drive reset control signal RST, a high-level scan signal GA, a high-level light-emitting control signal EMS, a high-level voltage stabilization control signal STV and Low level data signal DA.
  • the rising edge of the lighting control signal EMS is earlier than the starting point of the first stage P1 , that is, earlier than the rising edge of the voltage regulation control signal STV.
  • the gate of the driving reset transistor T3 receives the low level driving reset control signal RST, and the driving reset transistor T3 is turned on, thereby applying the driving reset voltage VINT1 to the first node N1.
  • the gate of the voltage-stabilizing transistor T2 receives a high-level voltage-stabilizing control signal STV, and the voltage-stabilizing transistor T2 is turned on, thereby applying the driving reset voltage VINT1 at the first node N1 to the gate of the driving transistor T1 to The gate of the driving transistor T1 is reset, so that the driving transistor T1 is ready for the writing of the data of the second stage P2.
  • the value of the driving reset voltage VINT1 may be set to be lower, eg, the voltage opposite to the first power supply voltage Vdd is larger, so that the gate of the driving transistor T1 and the The difference between the voltages of the first poles is larger, thereby speeding up the process of data writing and compensation in the second stage. It should be noted that the influence of the driving reset voltage VINT1 on the driving transistor T1 tends to be saturated as the driving reset voltage VINT1 increases in the reverse direction. The process of data writing and compensation will be described in the second stage P2 below.
  • the voltage of one pole of the storage capacitor C is the first power supply voltage Vdd
  • the voltage of the other pole is the drive reset voltage VINT1
  • the storage capacitor C is charged.
  • the value range of the driving reset voltage VINT1 may be ⁇ 1 to -5V, for example, -3V. This can shorten the time required for data writing and compensation while keeping the power consumption of the circuit low, thereby improving the compensation effect during a fixed time period, such as the second stage P2, and thus improving the display effect.
  • the gate of the light-emitting reset transistor T4 receives a high-level light-emitting control signal EMS, and the light-emitting reset transistor T4 is turned on, so that the light-emitting reset voltage VINT2 is applied to the anode of the OLED to reset the anode of the OLED to So that the OLED does not emit light before the third stage P3.
  • the value of the light emission reset voltage VINT2 is set such that the OLED is in a state where it is just not emitting light, ie, the OLED is forward biased to a near-on state.
  • the value range of the light-emitting reset voltage VINT2 may be -2 to -6V, for example, equal to the second power supply voltage Vss, which is 0 to -6V .
  • This can reduce the charging time of the PN junction before the OLED is turned on, and reduce the response time of the OLED to the light-emitting signal.
  • the probability of OLED brightness differences is reduced. Therefore, the uniformity of brightness can be improved, and the low frequency Flicker and the low grayscale Mura can be reduced.
  • the gate of the data writing transistor T5 receives the high-level scan signal GA, and the data writing transistor T5 is turned off.
  • the gate of the compensation transistor T6 receives the high-level scan signal GA, and the compensation transistor T6 is turned off.
  • the gate of the first light-emitting control transistor T7 receives the high-level light-emitting control signal EMS, and the first light-emitting control transistor T7 is turned off.
  • the gate of the second light-emitting control transistor T8 receives the high-level light-emitting control signal EMS, and the second light-emitting control transistor T8 is turned off.
  • a high-level drive reset control signal RST a low-level scan signal GA, a high-level light-emitting control signal EMS, a high-level voltage regulation control signal STV and a high-level data signal are input.
  • DA a high-level drive reset control signal
  • the gate of the data writing transistor T5 receives the low-level scan signal GA, and the data writing transistor T5 is turned on, thereby writing the high-level data signal DA to the first pole of the driving transistor T1, That is, the first terminal F of the driving circuit 110 .
  • the gate of the compensation transistor T6 receives the low-level scan signal GA, and the compensation transistor T3 is turned on, thereby writing the high-level data signal DA of the first terminal F into the first node N1.
  • the gate of the voltage-stabilizing transistor T2 receives the high-level voltage-stabilizing control signal STV, and the voltage-stabilizing transistor T2 is turned on, thereby writing the high-level data signal DA of the first node N1 into the gate of the driving transistor T1, that is, the driving circuit The control terminal G of 110.
  • the data writing transistor T5, the driving transistor T1, the compensation transistor T6 and the voltage-stabilizing transistor T2 are all turned on, the data signal DA passes through the data-writing transistor T5, the driving transistor T1, the compensation transistor T6 and the voltage-stabilizing transistor T2 to the storage capacitor C Charging is performed again, that is, the gate of the driving transistor T1 is charged, that is, the control terminal G is charged, so the voltage of the gate of the driving transistor T1 is gradually increased.
  • Vda represents the voltage of the data signal DA
  • Vth represents the threshold voltage of the driving transistor T1. Since the driving transistor T1 is described by taking a P-type transistor as an example in this embodiment, the threshold voltage Vth here may be a negative value.
  • the voltage of the gate of the driving transistor T1 is Vda+Vth, that is to say, the voltage information of the data signal DA and the threshold voltage Vth is stored in the storage capacitor C for subsequent use in the third stage P3 , the threshold voltage of the driving transistor T1 is compensated.
  • the gate of the drive reset transistor T3 receives the drive reset control signal RST of a high level, and the drive reset transistor T3 is turned off.
  • the gate of the light-emitting reset transistor T4 receives a high-level light-emitting reset control signal EMS, and the light-emitting reset transistor T4 is turned off.
  • the gate of the first light-emitting control transistor T7 receives the high-level light-emitting control signal EMS, and the first light-emitting control transistor T7 is turned off; the gate of the second light-emitting control transistor T8 receives the high-level light-emitting control signal EMS, and the second light-emitting control transistor T8 receives the high-level light-emitting control signal EMS.
  • the light emission control transistor T8 is turned off.
  • a high-level drive reset control signal RST a high-level scan signal GA, a low-level light-emitting control signal EMS, a low-level voltage regulation control signal STV and a low-level data signal are input.
  • the low-level lighting control signal EMS may be a low-level active pulse width modulation signal.
  • the falling edge of the lighting control signal EMS is later than the end point of the second phase P1, that is, later than the falling edge of the voltage regulation control signal STV.
  • the gate of the first light-emitting control transistor T7 receives the light-emitting control signal EMS.
  • the lighting control signal EMS may be pulse width modulated.
  • the first light emission control transistor T7 is turned on, so that the first power supply voltage Vdd is applied to the first terminal F.
  • the gate of the second light emission control transistor T8 receives the light emission control signal EMS.
  • the second light emission control transistor T8 is turned on, thereby applying the driving current generated by the driving transistor T1 to the anode of the OLED.
  • the gate of the voltage-stabilizing transistor T2 receives the voltage-stabilizing control signal Stv of a low level, and the voltage-stabilizing transistor T2 is turned off.
  • the active layer of the voltage-stabilizing transistor T2 includes an oxide semiconductor material, and the leakage current thereof is 10-16 to 10-19A. Compared with the single-gate low-temperature polysilicon transistor and the double-gate low-temperature polysilicon transistor, the leakage current is smaller, so that the electrical leakage of the memory circuit can be further reduced to improve the uniformity of brightness.
  • the gate of the light-emitting reset transistor T4 receives the light-emitting control signal EMS.
  • the light emission control signal EMS is at a high level
  • the light emission reset transistor T4 is turned on.
  • a light emission reset voltage is supplied to the anode of the OLED to reset the anode of the OLED.
  • the light emission control signal EMS is a pulse width modulation signal
  • this can enable the anode of the OLED to be reset before each light emission of the OLED under the control of the light emission control signal EMS, thereby further improving the uniformity of brightness .
  • the gate of the drive reset transistor T3 receives the drive reset control signal RST of a high level, and the drive reset transistor T3 is turned off.
  • the gate of the data writing transistor T5 receives the high-level scan signal GA, and the data writing transistor T5 is turned off.
  • the gate of the compensation transistor T6 receives the high-level scan signal GA, and the compensation transistor T6 is turned off.
  • the anode and cathode of the OLED are respectively connected to the first power supply voltage Vdd (high voltage) and the second power supply voltage Vss (low voltage), so as to emit light driven by the driving current generated by the driving transistor T1.
  • the driving current ID for driving the OLED to emit light can be obtained according to the following formula:
  • Vth represents the threshold voltage of the driving transistor T1
  • VGS represents the voltage between the gate and the source of the driving transistor T1
  • K is a constant. It can be seen from the above formula that the driving current ID flowing through the OLED is no longer related to the threshold voltage Vth of the driving transistor T1, but is only related to the voltage Vda of the data signal DA, so that the threshold voltage Vth of the driving transistor T1 can be adjusted.
  • the compensation solves the problem of threshold voltage drift of the driving transistor T1 caused by the process and long-term operation, and eliminates its influence on the driving current ID, thereby improving the display effect.
  • K in the above formula can be expressed as:
  • n is the electron mobility of the driving transistor T1
  • Cox is the gate unit capacitance of the driving transistor T1
  • W is the channel width of the driving transistor T1
  • L is the channel length of the driving transistor T1.
  • the light emission reset control signal RST, the compensation control signal COM, and the scan signal GA may be the same signal.
  • the voltage-stabilizing transistor T2 may be an N-type transistor, while the driving transistor T1, the driving reset transistor T3, the light-emitting reset transistor T4, the data writing transistor T5, the compensation transistor T6, the first light-emitting control transistor T7 and the second light-emitting control transistor T8 are P type transistor.
  • the difference from the working process of the pixel circuit in the above-mentioned embodiment is that, in the first stage P1, the light-emitting reset transistor T4 receives the high-level scanning signal GA, and the light-emitting reset transistor T4 is turned off.
  • the light emission reset voltage VINT2 is not supplied to the anode of the light emitting device OLED, and thus the anode of the light emitting device OLED is not reset.
  • the light-emitting reset transistor T4 receives the low-level scan signal GA, and the light-emitting reset transistor T4 is turned on.
  • the light emission reset voltage VINT2 is supplied to the anode of the light emitting device OLED to reset the anode of the light emitting device OLED.
  • the rest of the operation process of the pixel circuit in the first period P1, the second period P2 and the third period P3 is similar to the above-mentioned embodiment, and details are not repeated here.
  • each stage is only illustrative.
  • the durations of the high level or the low level of the driving reset control signal RST, the scan signal GA, the light emission control signal EMS, the voltage regulation control signal STV, and the data signal DA are only illustrative.
  • each high level duration of the lighting control signal EMS may be the same.
  • FIG. 3 illustrate schematic plan views of layers in an array substrate according to embodiments of the present disclosure.
  • a pixel circuit as shown in FIG. 3 is taken as an example for description.
  • the light-emitting reset control signal RST and the light-emitting control signal EMS are the same signal
  • the voltage-stabilizing control signal COM and the scanning signal GA are the same signal
  • the voltage-stabilizing transistor T2 and the light-emitting reset transistor T4 are metal oxide transistors.
  • FIGS. 5 to 11 are drawing scales in order to more clearly represent the positions of various parts, and should not be regarded as true scales of components. Those skilled in the art can select the size of each component based on actual requirements, which is not specifically limited in the present disclosure.
  • the array substrate includes the first active semiconductor layer 310 on the substrate 300 .
  • FIG. 5 shows a schematic plan view of the first active semiconductor layer 310 in the array substrate according to an embodiment of the present disclosure.
  • the driving transistor T1, the driving reset transistor T3, the light-emitting reset transistor T4, the data writing transistor T5, the compensation transistor T6, the first light-emitting control transistor T7, and the second light-emitting control transistor in the pixel circuit T8 is a silicon transistor, such as a low temperature polysilicon transistor.
  • the first active semiconductor layer 310 may be used to form the above-mentioned driving transistor T1, driving reset transistor T3, light-emitting reset transistor T4, data writing transistor T5, compensation transistor T6, and first light-emitting control transistor Active regions of T7 and the second light emission control transistor T8.
  • the first active semiconductor layer 310 includes a channel region pattern and a doping region pattern of the transistor (ie, first and second source/drain regions of the transistor). In the embodiment of the present disclosure, the channel region pattern and the doped region pattern of each transistor are integrally provided.
  • a dotted frame is used to denote regions in the first active semiconductor layer 310 for source/drain regions and channel regions of respective transistors.
  • the first active semiconductor layer 310 sequentially includes a channel region T3-c of the driving reset transistor T3 and a channel region of the data writing transistor T5 along the Y direction (column direction) and the X direction (row direction) in sequence.
  • the first active semiconductor layer for the above-described transistor may include an integrally formed low temperature polysilicon layer.
  • the source region and the drain region of each transistor may be conductive by doping or the like to realize electrical connection of each structure. That is, the first active semiconductor layer of the transistor is an overall pattern formed of p-silicon or n-silicon, and each transistor in the same pixel circuit includes a pattern of doped regions (ie, source region s and drain region d). ) and channel region pattern.
  • the active layers of different transistors are separated by doping structures.
  • the first active semiconductor layer 310 further includes: a drain region T3-d of the driving reset transistor T3, a drain region T5-d of the data writing transistor T5, and a driving reset transistor along the Y direction and the X direction.
  • the source region of T3 and the source region T3-s/T6-s of the compensation transistor T6, the source region T5-s of the data writing transistor T5, the source region of the driving transistor T1 and the source of the first light-emitting control transistor T7 The region T1-s/T7-s, the drain region of the compensation transistor T6 and the drain region of the driving transistor T1 and the drain region T6-d/T1-d/T8-d of the second light emission control transistor T8, the first light emission The drain region T7-d of the control transistor T7, and the source region T8-s of the second light-emitting control transistor T8.
  • the first active semiconductor layer 310 may be formed of a silicon semiconductor material such as amorphous silicon, polysilicon, or the like.
  • the above-mentioned source region and drain region may be regions doped with n-type impurities or p-type impurities.
  • the source and drain regions of the first light emission control transistor T7, the data writing transistor T5, the driving transistor T1, the compensation transistor T6, and the second light emission control transistor T8 are all regions doped with P-type impurities.
  • the array substrate further includes a first conductive layer 320 on a side of the first active semiconductor layer away from the substrate.
  • FIG. 6 is a schematic plan view of the first conductive layer 320 in the array substrate according to an embodiment of the present disclosure.
  • the first conductive layer 320 includes a drive reset control signal line RSTL1 , a scan signal line GAL, a first pole C1 of the capacitor C, and a light emission control signal line EML sequentially arranged along the Y direction.
  • the first conductive layer 320 further includes a drive reset control signal line RSTL1' for adjacent pixel circuits along the Y direction.
  • the function of the drive reset control signal line RSTL1' of the adjacent pixel circuit to the adjacent pixel circuit is the same as that of the drive reset control signal line RSTL1 to the pixel circuit, and the description thereof will not be repeated below.
  • the lighting control signal line EML and the lighting control signal input terminal EM are configured to provide the lighting control signal input terminal EM with the lighting control signal EMS.
  • the scan signal line GAL is coupled to the scan signal input terminal Gate and the compensation control signal input terminal Com, and is configured to provide the scan signal GA to the scan signal input terminal Gate, and is configured to provide the compensation control signal
  • the signal input terminal Com provides the compensation control signal COM.
  • the first electrode C1 of the capacitor C and the gate electrode T1-g of the driving transistor T1 have an integral structure.
  • the driving reset control signal line RSTL1 is coupled to the driving reset control signal input terminal Rst1 to provide the driving reset control signal RST to the driving reset control signal input terminal Rst1.
  • the orthographic projection of the reset control signal line RSTL1 on the substrate is driven to overlap the orthographic projection of the portion 311 of the first active semiconductor layer 310 on the substrate. It is the gate T3-g of the drive reset transistor T3 of the pixel circuit.
  • the part where the orthographic projection of the scanning signal line GAL on the substrate overlaps with the orthographic projection of the part 311 of the first active semiconductor layer 310 on the substrate is the gate T6-g of the compensation transistor T6 and the data write in the pixel circuit, respectively. into the gate T5-g of the transistor T5.
  • the part where the orthographic projection of the first electrode C1 of the capacitor C in the pixel circuit on the substrate overlaps with the orthographic projection of the part 311 of the first active semiconductor layer 310 on the substrate is the gate of the driving transistor T1 in the pixel circuit Pole T1-g.
  • the portion where the orthographic projection of the light-emitting control signal line EML on the substrate overlaps with the orthographic projection of the portion 311 of the first active semiconductor layer 310 on the substrate is the gate T7- of the first light-emitting control transistor T7 in the pixel circuit, respectively. g and the gate T8-g of the second light emission control transistor T8.
  • the gate T3-g of the reset transistor T3, the gate T6-g of the compensation transistor T6 and the gate T5-g of the data writing transistor T5 are driven g is located on the first side of the gate T1-g of the drive transistor T1.
  • the gate T7-g of the first light emission control transistor T7 and the gate T8-g of the first light emission control transistor T8 are located on the second side of the gate T1-g of the driving transistor T1.
  • first side and the second side of the gate T1-g of the driving transistor T1 are opposite sides of the gate T1-g of the driving transistor T1 in the Y direction.
  • first side of the gate T1-g of the driving transistor T1 may be the upper side of the gate T1-g of the driving transistor T1.
  • the second side of the gate T1-g of the driving transistor T1 may be the lower side of the gate T1-g of the driving transistor T1.
  • the "lower side” is, for example, the side of the array substrate for bonding ICs.
  • the lower side of the gate T1-g of the driving transistor T1 is the side of the gate T1-g of the driving transistor T1 close to the IC (not shown in the figure).
  • the upper side is the opposite side to the lower side, eg the side of the gate T1-g of the drive transistor T1 away from the IC.
  • the gate T3-g of the drive reset transistor T3 is located on the upper side of the gate T6-g of the compensation transistor T6 and the gate T5-g of the data writing transistor T5.
  • the gate T3-g of the drive reset transistor T3 is aligned with the gate T1-g of the drive transistor T1 in the Y direction.
  • the gate T5-g of the data writing transistor T5 and the gate T7-g of the first light emission control transistor T7 are located at the gate of the driving transistor T1 Third side of T1-g.
  • the gate T6-g of the compensation transistor T6 and the gate T8-g of the second light emission control transistor T8 are located on the fourth side of the gate T1-g of the driving transistor T1.
  • the third side and the fourth side of the gate T1-g of the driving transistor T1 are opposite sides of the gate T1-g of the driving transistor T1 in the X direction.
  • the third side of the gate T1-g of the driving transistor T1 may be the left side of the gate T1-g of the driving transistor T1.
  • the fourth side of the gate T1-g of the driving transistor T1 may be the right side of the gate T1-g of the driving transistor T1.
  • the gate T7-g of the first light emission control transistor T7 is on the left side of the gate T5-g of the data writing transistor T5.
  • the gate T8-g of the second light emission control transistor T8 is located to the right of the gate T6-g of the compensation transistor T6.
  • the active regions of the transistor shown in FIG. 6 correspond to respective regions where the first conductive layer 320 and the first active semiconductor layer 310 overlap.
  • the array substrate further includes a second conductive layer located on a side of the first conductive layer away from the substrate and insulated from the first conductive layer.
  • FIG. 7 shows a schematic plan view of the second conductive layer 330 in the array substrate according to an embodiment of the present disclosure.
  • the second conductive layer 330 includes a voltage regulation control signal line STVL, a second pole C2 of the capacitor, a first power supply voltage line VDL and a light emission reset control signal line RSTL2 arranged along the Y direction.
  • the second conductive layer 330 further includes a light emission reset control signal line RSTL2' of adjacent pixel circuits along the Y direction.
  • the function of the light emission reset control signal line RSTL2' of the adjacent pixel circuit to the adjacent pixel circuit is the same as that of the light emission reset control signal line RSTL2 to the pixel circuit, and the description thereof will not be repeated below.
  • the projections of the second pole C2 of the capacitor C and the first pole C1 of the capacitor C on the substrate at least partially overlap.
  • the first power supply voltage line VDL extends in the X direction and is integrally formed with the second pole C2 of the capacitor C.
  • the first power supply voltage line is coupled to the first power supply voltage terminal VDD, and is configured to provide the first power supply voltage Vdd thereto.
  • the voltage stabilization control signal line STVL is coupled to the voltage stabilization control signal input terminal Stv, and is configured to provide the voltage stabilization control signal STV thereto.
  • the light-emitting reset control signal line RSTL2 is coupled to the light-emitting reset control signal input terminal Rst2, and is configured to provide the light-emitting reset control signal thereto.
  • the light emission reset control signal and the scan signal EMS are the same signal.
  • the voltage regulation control signal line STVL is located on the first side of the second pole C2 of the capacitor.
  • the first power supply signal line VDL and the light emission reset control signal line RSTL2 are located on the second side of the second pole C2 of the capacitor. Similar to the description above with respect to the first and second sides of the gate T1-g of the drive transistor T1, the first and second sides of the second pole C2 of the capacitor are in the Y direction of the second pole C2 of the capacitor opposite sides.
  • the first side of the second pole C2 of the capacitor is the upper side of the second pole C2 of the capacitor in the Y direction
  • the second side of the second pole C2 of the capacitor is the lower side of the second pole C2 of the capacitor in the Y direction.
  • the voltage stabilization control signal line STVL is located on the upper side of the second pole C2 of the capacitor.
  • the first power supply signal line VDL and the light emission reset control signal line RSTL2 are located on the lower side of the second pole C2 of the capacitor.
  • the voltage stabilization control signal line STVL is provided with the first gate T2 - g1 of the voltage stabilization transistor T2 .
  • the light-emitting reset control signal line RSTL2 is provided with a first gate T4-g1 of the light-emitting reset transistor T4. The specific positions of the first gate T2-g1 of the voltage regulator transistor T2 and the first gate T4-g1 of the light-emitting reset transistor T4 will be described in detail below with reference to FIG. 8 .
  • the first gate T2-g1 of the voltage-stabilizing transistor T2 is on the first side of the first gate T4-g1 of the light-emitting reset transistor T4 in the Y direction. Similar to the above description of the first side of the gate T1-g of the driving transistor T1, the first side of the first gate T4-g1 of the light-emitting reset transistor T4 is the first side of the first gate T4-g1 of the light-emitting reset transistor T4. upper side. That is, the first gate T2-g1 of the voltage-stabilizing transistor T2 is on the upper side of the first gate T4-g1 of the light-emitting reset transistor T4. In the X direction, the first gate T2-g1 of the voltage-stabilizing transistor T2 is at the same position as the first gate T4-g1 of the light-emitting reset transistor T4.
  • the array substrate further includes a second active semiconductor layer located on a side of the second conductive layer away from the substrate and insulated from the second conductive layer.
  • FIG. 8 shows a schematic plan view of the second active semiconductor layer 340 in the array substrate according to an embodiment of the present disclosure.
  • the second active semiconductor layer 340 sequentially includes a first portion 341 and a second portion 342 in the Y direction, and the first portion 341 of the second active semiconductor layer 340 and the first portion 341 of the second active semiconductor layer 340 Two-part 342 alignment settings.
  • the second active semiconductor layer 340 may be used to form the active layers of the voltage-stabilizing transistor T2 and the light-emitting reset transistor T4 described above.
  • the first portion 341 of the second active semiconductor layer 340 may be used to form the active layer of the zener transistor T2.
  • the second portion 342 of the second semiconductor layer 340 may be used to form the active layer of the voltage regulator transistor T7.
  • the second active semiconductor layer 340 includes a channel pattern and a doping region pattern of the transistor (ie, the first source/drain regions and the doped region of the transistor). second source/drain region).
  • dotted boxes are used to illustrate regions in the second active semiconductor layer 340 for source/drain regions and channel regions of respective transistors.
  • the first part 341 of the second active semiconductor layer 340 sequentially includes the source region T2-s of the voltage-stabilizing transistor T2, the channel region T2-c of the voltage-stabilizing transistor T2 and the voltage-stabilizing transistor T2 along the Y direction. the drain region T2-d.
  • the second portion 342 of the second active semiconductor layer 340 sequentially includes a source region T4-s of the light-emitting reset transistor T4, a channel region T4-c of the light-emitting reset transistor T4, and a drain region T4 of the light-emitting reset transistor T4 in the Y direction -d.
  • the overlapping part of the orthographic projection of the voltage regulation control signal line STVL on the substrate and the orthographic projection of the second active semiconductor layer 340 on the substrate is the voltage regulation The first gate T2-g1 of the transistor T2.
  • the channel region T8-c of the voltage-stabilizing transistor T2 completely overlaps with the projection of the first gate T2-g1 of the voltage-stabilizing transistor T2 on the substrate.
  • the overlapping portion of the orthographic projection of the light emitting control signal line RSTL2 on the substrate and the orthographic projection of the second active semiconductor layer 340 on the substrate is the first gate T4 - g1 of the light emitting reset transistor T4 .
  • the channel region T4-c of the light-emitting reset transistor T4 completely overlaps with the projection of the first gate T4-g1 of the light-emitting reset transistor T4 on the substrate.
  • the second active semiconductor layer 340 may be formed of an oxide semiconductor material, eg, indium gallium zinc oxide IGZO.
  • the above-mentioned source region and drain region may be regions doped with n-type impurities or p-type impurities.
  • both the source region and the drain region of the voltage regulator transistor T2 and the light-emitting reset transistor T4 are regions doped with N-type impurities.
  • the array substrate further includes a third conductive layer located on a side of the second active semiconductor layer away from the substrate and insulated from the second active semiconductor layer.
  • FIG. 9 shows a schematic plan view of the third conductive layer 350 in the array substrate according to an embodiment of the present disclosure.
  • the third conductive layer 350 includes a voltage regulation control signal line STVL, a light emission reset control signal line RSTL2, and a light emission reset voltage line VINL2.
  • the third conductive layer 350 further includes a light-emitting reset control signal line RSTL2' and a light-emitting reset voltage line VINL2' of adjacent pixel circuits along the Y direction.
  • the light-emitting reset control signal line RSTL2' and the light-emitting reset voltage line VINL2' of the adjacent pixel circuit have the same effect on the adjacent pixel circuit as the light-emitting reset control signal line RSTL2 and the light-emitting reset voltage line VINL2 have the same effect on the pixel circuit, and will not be repeated below. Repeat it.
  • the voltage stabilization control signal line STVL, the light emission reset control signal line RSTL2, and the light emission reset voltage line VINL2 are sequentially arranged in the Y direction.
  • the voltage stabilization control signal line STVL is provided with the second gate T2 - g2 of the voltage stabilization transistor T2 .
  • the light-emitting reset control signal line RSTL2 is provided with a second gate T4-g2 of the light-emitting reset transistor T4.
  • the overlapping portion of the orthographic projection of the voltage stabilization control signal line STVL on the substrate and the orthographic projection of the second active semiconductor layer 340 on the substrate is the second gate T2-g2 of the voltage stabilization transistor T2.
  • the overlapping portion of the orthographic projection of the light-emitting reset control signal line RSTL2 on the substrate and the orthographic projection of the second active semiconductor layer 340 on the substrate is the second gate T4-g2 of the light-emitting reset transistor T4.
  • the second gate of the voltage-stabilizing transistor T2 in the Y direction is The gate T2-g2 is on the first side of the second gate T4-g2 of the light-emitting reset transistor T4.
  • the first side of the second gate T4-g2 of the light-emitting reset transistor T4 is the upper side of the second gate T4-g2 of the light-emitting reset transistor T4. That is, the second gate T2-g2 of the voltage-stabilizing transistor T2 is on the upper side of the second gate T4-g2 of the light-emitting reset transistor T4.
  • the second gate T2-g2 of the voltage-stabilizing transistor T2 is at the same position as the second gate T4-g2 of the light-emitting reset transistor T4.
  • the second gate T2-g2 of the voltage-stabilizing transistor T2, the channel region T2-c of the voltage-stabilizing transistor T2 and the first gate of the voltage-stabilizing transistor T2 The projection of the gate T2-g1 on the substrate completely overlaps.
  • the projections of the second gate T4-g2 of the light-emitting reset transistor T4, the channel region T4-c of the light-emitting reset transistor T4 and the first gate T4-g1 of the light-emitting reset transistor T4 on the substrate completely overlap.
  • an insulating layer or a dielectric layer is further provided between adjacent active semiconductor layers and conductive layers or between adjacent conductive layers. Specifically, between the first active semiconductor layer 310 and the first conductive layer 320 , between the first conductive layer 320 and the second conductive layer 330 , and between the second conductive layer 330 and the second active semiconductor layer 340 between the second active semiconductor layer 340 and the third conductive layer 350, between the third conductive layer 350 and the fourth conductive layer 360 (which will be described in detail below with reference to FIG. 12), and between the fourth conductive layer Between the layer 360 and the fifth conductive layer 370 (which will be described in detail below with reference to FIG. 11 ), an insulating layer or a dielectric layer (which will be described in detail below with reference to the cross-sectional view) is respectively provided.
  • the via holes described below are via holes simultaneously penetrating through insulating layers or dielectric layers provided between adjacent active semiconductor layers and conductive layers or between adjacent conductive layers. Specifically, the via holes penetrate simultaneously between the first active semiconductor layer 310 and the first conductive layer 320, between the first conductive layer 320 and the second conductive layer 330, and between the second conductive layer 330 and the second conductive layer 330. between the source semiconductor layer 340, between the second active semiconductor layer 340 and the third conductive layer 350, between the third conductive layer 350 and the fourth conductive layer 360, and between the fourth conductive layer 360 and the fifth conductive layer Vias of each insulating layer or dielectric layer between layers 370 .
  • the light-emitting reset voltage line VINL2 is coupled to the second active semiconductor layer 340 through the via hole 3501 to form the first electrode T4-1 of the light-emitting reset transistor T4.
  • the light emitting reset voltage line VINL2 in FIG. 9 overlaps with the projection on the substrate of the drain region T7 - d of the light emitting reset transistor T4 of the second portion 342 in FIG. 8 .
  • the light emitting reset voltage line VINL2 is coupled to the drain region T4 - d of the light emitting reset transistor T4 through the via hole 3501 .
  • the array substrate further includes a fourth conductive layer located on a side of the third conductive layer away from the substrate and insulated from the third conductive layer.
  • FIG. 10 shows a schematic plan view of the fourth conductive layer 360 in the array substrate according to an embodiment of the present disclosure.
  • the fourth conductive layer 360 includes a first connection part 361 , a second connection part 362 , a third connection part 363 , a fourth connection part 364 , a fifth connection part 365 , a sixth connection part 366 , and a seventh connection part 366 .
  • the connection part 367 and the eighth connection part 368 .
  • the fourth conductive layer 360 further includes a ninth connection portion 369 for adjacent pixel circuits along the Y direction.
  • the ninth connection part 369 and the via hole 3691 thereon may serve as the first connection part 361 of the adjacent pixel circuit and the via hole 3611 thereon.
  • connection manner and function thereof are similar to the first connection portion 361 in the pixel circuit and the via hole 3611 thereon, which will not be repeated below.
  • first connection parts 361 of adjacent pixel circuits and the via holes 3611 thereon are arranged as above.
  • the second connection part 362 , the third connection part 363 , the fourth connection part 364 , the fifth connection part 365 , the sixth connection part 366 , the seventh connection part 367 , and the eighth connection part 368 is provided on the second side of the first connection portion 361 . Similar to the second side of the gate T1 - g of the driving transistor T1 , in the XY coordinate system, the second side of the first connection portion 361 is the lower side of the first connection portion 361 .
  • the second connection part 362, the third connection part 363, the fourth connection part 364, the fifth connection part 365, the sixth connection part 366, the seventh connection part 367, and the eighth connection part 368 are provided at the first connection part the lower side of the portion 361 .
  • the third connection portion 363 and the sixth connection portion 366 are sequentially arranged along the Y direction.
  • the second connection portion 362 , the fourth connection portion 364 , the fifth connection portion 365 , the seventh connection portion 367 , and the eighth connection portion 368 are sequentially arranged along the Y direction.
  • the second connection part 362 , the fourth connection part 364 , the fifth connection part 365 , the seventh connection part 367 , and the eighth connection part 368 are on the third side of the third connection part 363 and the sixth connection part 366 . Similar to the third side of the gate T1-g of the above-mentioned driving transistor T1, in the XY plane, the third side of the third connection part 363 and the sixth connection part 366 is the third connection part 363 and the sixth connection part 366. Right. That is, the second connection part 362 , the fourth connection part 364 , the fifth connection part 365 , the seventh connection part 367 , and the eighth connection part 368 are on the right side of the third connection part 363 and the sixth connection part 366 .
  • the first connection portion 361 is coupled to the first active semiconductor layer 310 through the via hole 3611 . Specifically, the first connection portion 361 is coupled to the drain region T3-d of the driving reset transistor T3 via the via hole 3611, and forms the first electrode T3-1 of the driving reset transistor T3. The first connection portion 361 serves as the driving reset voltage line VINL1.
  • the second connection portion 362 is coupled to the third conductive layer 350 through the via hole 3621 . Specifically, the second connection portion 362 is coupled to the light-emitting reset voltage line VINL2 via the via hole 3621 .
  • the third connection portion 363 is coupled to the first active semiconductor layer 310 through the via hole 3631 . Specifically, the third connection portion 363 is coupled to the drain region T5-d of the data writing transistor T5 through the via hole 3631, forming the first electrode T5-1 of the data writing transistor T5.
  • the fourth connection portion 364 is coupled to the first active semiconductor layer 310 through the via hole 3641 . Specifically, the fourth connection portion 364 is coupled to the source region of the drive reset transistor T3 and the source region T3-s/T6-s of the compensation transistor T6 through the via hole 3641, forming the second electrode of the drive reset transistor T3 and the compensation The second pole T3-2/T6-2 of the transistor T6.
  • the fourth connection portion 364 is coupled to the second active semiconductor layer 340 through the via hole 3642 . Specifically, the fourth connection portion 364 is coupled to the source region T2-s of the voltage-stabilizing transistor T2 via the via hole 3642 to form the second electrode T2-2 of the voltage-stabilizing transistor T2.
  • the fifth connection portion 365 is coupled to the third conductive layer 330 through the via hole 3651 .
  • the fifth connection portion 365 is coupled to the second conductive layer 320 through the via hole 3652 .
  • the fifth connection portion 365 is coupled to the gate electrode T1 - g of the driving transistor T1 and the first electrode C1 of the capacitor C through the via hole 3652 .
  • the fifth connection portion 365 is coupled to the second active semiconductor layer 340 through the via hole 3653 .
  • the fifth connection portion 365 is coupled to the drain region T2-d of the voltage-stabilizing transistor T2 through the via hole 3653, and forms the first electrode T2-1 of the voltage-stabilizing transistor T2.
  • the sixth connection portion 366 is coupled to the first active semiconductor layer 310 through the via hole 3662 . Specifically, the sixth connection portion 366 is coupled to the drain region T7-d of the first light-emitting control transistor T7 via the via hole 3662, and forms the first electrode T7-1 of the first light-emitting control transistor T7.
  • the seventh connection portion 367 is coupled to the first active semiconductor layer 310 through the via hole 3671 . Specifically, the seventh connection portion 367 is coupled to the source region T8-s of the second light-emitting control transistor T8 through the via hole 3671, and forms the second electrode T8-2 of the second light-emitting control transistor T8.
  • the seventh connection portion 367 is coupled to the second active semiconductor layer 340 through the via hole 3672 . Specifically, the seventh connection portion 367 is coupled to the source region T4-s of the light-emitting reset transistor T4 through the via hole 3672, and forms the second electrode T4-2 of the light-emitting reset transistor T4.
  • the eighth connection portion 368 is coupled to the second active semiconductor layer 340 through the via hole 3681 .
  • the eighth connection portion 368 is coupled to the source region T4-d of the light-emitting reset transistor T4 through the via hole 3681, and forms the first electrode T4-1 of the light-emitting reset transistor T4.
  • the eighth connection portion 368 and the via hole 3682 thereon may serve as the second connection portion 362 and the via hole 3621 thereon of the adjacent pixel circuits along the Y direction.
  • the specific connection method and function thereof are similar to the second connection portion 362 in the pixel circuit and the via hole 3621 thereon, and are not repeated here.
  • the second connection parts 362 of adjacent pixel circuits and the via holes 3621 thereon are arranged as above.
  • the array substrate further includes a fifth conductive layer located on a side of the fourth conductive layer away from the substrate and insulated from the fourth conductive layer.
  • FIG. 11 shows a schematic plan view of the fifth conductive layer 370 in the array substrate according to an embodiment of the present disclosure.
  • the fifth conductive layer includes a data signal line DAL, a first power supply voltage line VDL, and a second power supply voltage line VSL arranged along the row direction X.
  • the data signal line DAL extends along the column direction Y, and is coupled to the third connection portion 363 of the fourth conductive layer 360 through the via hole 3711 .
  • the first power supply voltage line VDL extends along the column direction Y, and is coupled to the third connection portion 363 of the fourth conductive layer 360 through the via hole 3721 .
  • the second power supply voltage line VSL extends along the column direction Y, and is coupled to the seventh connection portion 367 of the fourth conductive layer 360 through the via hole 3731 .
  • the distance over which the second power supply voltage line VSL extends in the column direction Y is smaller than that of the data signal line DAL and the first power supply voltage line VDL.
  • the second power supply voltage line VSL may be used as a cathode of a light emitting device such as an OLED.
  • the first power supply voltage line VDL has a closed rectangular part 371 . 8 and 11 , the orthographic projection of the second side extending in the Y direction of the rectangular member 371 disposed along the row direction X on the substrate is the same as the orthographic projection on the substrate of the first portion 341 of the second active semiconductor layer 340 on the substrate. Projections overlap.
  • This arrangement can isolate the second active semiconductor layer 340 from the encapsulation layer on the side of the fifth conductive layer 370 away from the substrate and adjacent to the fifth conductive layer 370, thereby preventing the hydrogen element in the encapsulation layer from causing the first
  • the properties of oxide materials in the second active semiconductor layer 340, such as metal oxide materials, are unstable.
  • the orthographic projection of the second power supply voltage line VSL on the substrate overlaps the orthographic projection of the second portion 342 of the second active semiconductor layer 340 on the substrate.
  • This arrangement of the second power supply voltage line VSL has a similar effect to the arrangement of the first power supply voltage line VDL described above.
  • the conductive layer 370 is isolated from the encapsulation layer disposed adjacent to it, so as to prevent the hydrogen element in the encapsulation layer from destabilizing the performance of the oxide material in the second active semiconductor layer 340 .
  • FIG. 12 shows a pixel circuit including a stacked first active semiconductor layer, a first conductive layer, a second conductive layer, a second active semiconductor layer, a third conductive layer and a fourth conductive layer (thus an array substrate). ) schematic diagram of the floor plan.
  • the plan layout diagram 380 includes a first active semiconductor layer 310 , a first conductive layer 320 , a second conductive layer 330 , a second active semiconductor layer 340 , a third conductive layer 350 , and a fourth conductive layer 360 and the fifth conductive layer 370 .
  • FIG. 12 shows a pixel circuit including a stacked first active semiconductor layer, a first conductive layer, a second conductive layer, a second active semiconductor layer, a third conductive layer and a fourth conductive layer (thus an array substrate). ) schematic diagram of the floor plan.
  • the plan layout diagram 380 includes a first active semiconductor layer 310 , a first conductive layer 320 , a second conductive layer 330
  • FIG. 12 shows the gate T1-g of the driving transistor T1, the gate T2-g of the voltage-stabilizing transistor T2, the gate T3-g of the driving reset transistor T3, and the gate T4-g of the light-emitting reset transistor T4. g, the gate T5-g of the data writing transistor T5, the gate T6-g of the compensation transistor T6, the first plate C1 of the storage capacitor C, the gate T7-g of the first light emission control transistor T7 and the second light emission The gate T8-g of the control transistor T8.
  • FIG. 12 also shows a stub A1A2 passing through the array substrate where the via hole 3651, the gate T6-g of the compensation transistor T6 and the gate T2-g of the voltage regulator transistor T2 are located. A sectional view taken along the section line A1A2 will be described below with reference to FIG. 13 .
  • FIG. 13 shows a schematic cross-sectional structure diagram of the array substrate taken along the line A1A2 in FIG. 12 according to an embodiment of the present disclosure.
  • the array substrate 10 includes: a substrate 300 ; a first buffer layer 101 on the substrate 300 ; and a first active semiconductor layer 310 on the first buffer layer 101 .
  • the cross-sectional view shows the channel region T6 - c of the compensation transistor T6 included in the first active semiconductor layer 310 .
  • the array substrate 10 further includes: a first gate insulating layer 102 covering the first buffer layer 101 and the first active semiconductor layer 310 ; and a first gate insulating layer 102 located on the first gate insulating layer
  • the first conductive layer 320 on the side of the layer 102 remote from the substrate 300 .
  • the cross section shows the scan signal line GAL included in the first conductive layer 320 .
  • the orthographic projection of the scanning signal line GAL on the substrate 300 overlaps with the orthographic projection of the channel region T6 - c of the compensation transistor T6 included in the first active semiconductor layer 310 on the substrate 300 . is the gate T6-g of the compensation transistor T6.
  • the array substrate 10 further includes: a first interlayer insulating layer 103 located on the side of the first conductive layer 320 away from the substrate 300 ; the first interlayer insulating layer 103 The second conductive layer 330 on the side away from the substrate 300 .
  • the cross-sectional view shows the voltage regulation control signal line STVL and one connection part 331 included in the second conductive layer.
  • the voltage stabilization control signal line STVL includes the first gate T2-g1 of the voltage stabilization transistor T2.
  • the array substrate 10 further includes: a second interlayer insulating layer 104 located on the side of the second conductive layer 330 away from the substrate 300 ; covering the second interlayer insulating layer 104 the second buffer layer 105 ; and the second active semiconductor layer 340 located on the side of the second buffer layer 105 away from the substrate 300 .
  • the cross-sectional view shows the orthographic projection of the voltage-stabilizing transistor T2 on the substrate 300 overlapping the orthographic projection of the first gate T2-g1 of the voltage-stabilizing transistor T2 on the voltage-stabilizing control signal line STVL on the substrate 300 Channel region T2-c.
  • the array substrate 10 further includes: a second gate insulating layer 106 covering the second active semiconductor layer 340 and the second buffer layer 105 ;
  • the third conductive layer 350 on the side of 106 away from the substrate 300 .
  • the cross-sectional view shows that the third conductive layer 350 includes the voltage regulation control signal line STVL.
  • the orthographic projection of the voltage stabilization control signal line STVL on the substrate 300 is the same as the orthographic projection of the channel region T2-c of the voltage stabilization transistor T2 included in the second active semiconductor layer 320 on the substrate 300
  • the overlapping part is the second gate T2-g2 of the voltage regulator transistor T2.
  • the array substrate 10 further includes: a third interlayer insulating layer 107 covering the third conductive layer 350 and the second gate insulating layer 106 ;
  • the fourth conductive layer 360 on the side of the layer 107 remote from the substrate 300 .
  • the cross-sectional view shows the fifth connection portion 365 .
  • the fifth connection portion 365 is coupled to the connection portion 331 on the second conductive layer 330 through the via hole 3651 .
  • the array substrate 10 further includes: a first flat layer 108 covering the fourth conductive layer 360 and the third interlayer insulating layer 107 ; The fifth conductive layer 370 on one side of the bottom 300 .
  • the cross-sectional view shows the first power supply voltage line VDL.
  • the array substrate 10 further includes a second planarization layer 109 covering the fifth conductive layer 370 and the first planarization layer 108 .
  • FIG. 14 shows a schematic cross-sectional structure diagram of the array substrate taken along the line A1A2 in FIG. 12 according to an embodiment of the present disclosure.
  • the array substrate 10 further includes a blocking layer 400 located between the substrate 100 and the first buffer layer 101.
  • the blocking layer 400 is configured to at least partially block the light incident from the side of the substrate 300 on which the pixel circuit is not provided to the active semiconductor layer of the transistor of the pixel circuit, in order to prevent photodegradation of the transistor.
  • the blocking layer 400 is configured to block particles released from the substrate from entering the pixel circuit.
  • the released particles can also degrade transistor performance if they enter the active semiconductor layer.
  • the particles are charged particles, once embedded in the pixel circuit structure (eg, in the dielectric layer of the embedded circuit structure), it will also interfere with various signal voltages input to the pixel circuit, thereby affecting the display performance.
  • the substrate 300 is a polyimide substrate
  • the polyimide material always contains various impurity ions undesirably, during the thermal exposure process (eg, growth and During sputtering and evaporation of conductive layers such as metals), these impurity ions are released from the substrate 300 into the pixel circuit.
  • the blocking layer 400 may not be biased (ie, suspended).
  • a voltage bias can also be applied to the shielding layer 400 to further improve the shielding effect.
  • the voltage applied to the blocking layer may be a constant voltage.
  • the voltage applied to the blocking layer may be selected from one of the following voltages: a first power supply voltage Vdd (anode voltage of the light emitting device), a second power supply voltage Vss (a cathode voltage of the light emitting device), a driving reset voltage VINT1 or other voltages.
  • the range of the voltage applied to the blocking layer includes one selected from the following ranges: -10V to +10V, -5V to +5V, -3V to +3V, -1V to +1V, or -0.5V ⁇ +0.5V.
  • the voltage applied to the blocking layer may be selected from one of the following voltages: -0.3V, -0.2V, 0V, 0.1V, 0.2V, 0.3V, or 10.1V.
  • the voltage applied to the shielding layer may be greater than the second power supply voltage Vss and less than the first power supply voltage Vdd; or, the voltage applied to the shielding layer may be greater than the driving reset voltage VINT1 and less than the first power supply voltage Vdd.
  • FIG. 15 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure.
  • FIG. 15 shows a configuration of a shielding layer 400a.
  • the blocking layer 400a completely covers the substrate 300 on the region of the array substrate 10 having the pixel unit (ie, the display region).
  • the cross-sectional structure of FIG. 14 corresponds to this configuration.
  • the shielding layer can achieve the best protection effect.
  • FIG. 16 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure.
  • FIG. 16 shows another configuration of the shielding layer 400b, wherein the shielding layer 400b does not completely cover the substrate 300 on the area of the array substrate 10 having the pixel unit (ie, the display area).
  • the blocking layer 400b includes a first strip 401 extending in the row direction X and spaced apart from each other in the column direction Y and a second strip 402 extending in the column direction Y and spaced apart from each other in the row direction X.
  • the first strip 401 and the second strip 402 have the same width (ie, a dimension perpendicular to the extending direction of the strips).
  • the orthographic projection of the intersecting portion of the first strip 401 and the second strip 402 on the substrate 300 and the active region 3101 of the driving transistor T1 ie, the trench of the first active semiconductor layer 310 constituting the driving transistor T1
  • the orthographic projections of the channel regions T1-c, portions of the source regions T1-s and the drain regions T1-d) on the substrate 300 at least partially overlap.
  • FIG. 17 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure.
  • FIG. 17 shows another configuration of the shielding layer 400c, wherein, similar to the configuration of the shielding layer 400b of FIG. 16, the shielding layer 400c also does not completely cover the area (ie, the display area) of the array substrate 10 having the pixel unit.
  • the blocking layer 400b has a main body 410 in each subpixel, a first connection portion 420 for connecting the main body 410 in the row direction X, and a second connection portion 430 for connecting the main body 410 in the column direction Y.
  • the dimension Sc1 of the first connection portion 420 along the column direction is smaller than the dimension Sb1 of the main body 410 along the column direction
  • the dimension Sc2 of the second connection portion 430 along the row direction is smaller than the dimension Sb2 of the main body 410 along the row direction.
  • the term "dimension" is intended to mean the largest dimension of a component.
  • the dimension Sc1 of the first connection part 420 in the column direction may be the same as the dimension Sc2 of the second connection part 430 in the row direction.
  • the dimension Sc1 of the first connection part 420 in the column direction may be different from the dimension Sc2 of the second connection part 430 in the row direction.
  • the dimension Sc1 of the first connection part 420 in the column direction may be smaller than the dimension Sc2 of the second connection part 430 in the row direction.
  • the signal line RSTL1 the scanning signal line GAL, the light emission control signal line EML) and the like. Therefore, by appropriately reducing the dimension Sc1 of the first connection part 420 along the column direction and increasing the dimension Sc2 of the second connection part 430 along the row direction, the conductivity of the entire shielding layer can be ensured while reducing the influence of parasitic effects.
  • a voltage bias is applied to the barrier layer, it can be ensured that the bias voltage is uniform across the barrier layer.
  • the shielding layer 401c has the configuration shown in FIG. 17 .
  • the blocking layer 401c has a main body 411 in each sub-pixel, a first connection part 421 for connecting the main body 411 in the row direction, and a second connection part 431 for connecting the main body 410 in the column direction.
  • the dimension Sc1 of the first connecting portion 421 in the column direction is smaller than the dimension Sb1 of the main body 410 in the column direction
  • the dimension Sc2 of the second connecting portion 430 in the row direction is smaller than the dimension Sb2 of the main body 410 in the column direction.
  • the body 411 is shaped and sized to not only at least partially overlap the active region 3101 of the driving transistor T1 in a direction perpendicular to the substrate, but also at least partially overlap the fifth connection portion 365 of the fourth conductive layer 360 .
  • at least 10% of the area of the fifth connection portion overlaps with the main body 411 in a direction perpendicular to the substrate. For example, FIG.
  • the dimension (width) Sc2 in the row direction of the second connection parts 430 and 431 may vary in the column direction.
  • the width of a portion where the second connection portion overlaps the wiring extending in the row direction of the signal having a relatively high frequency may be larger than the width of the second connection portion and the signal having a relatively low frequency in the row direction
  • the wiring extending in the row direction of the signal having a relatively high frequency includes, for example, the light emission control signal line EML, the scanning signal line GAL, and the like. The higher the signal frequency, the more pronounced the parasitic effect.
  • the width of the portion where the first connection portion overlaps the wiring extending in the column direction of the signal having a relatively high frequency may be larger than the width of the portion where the first connection portion overlaps the wiring extending in the column direction of the signal having a relatively low frequency. section width.
  • the width of the portion where the second connection portion overlaps the wiring extending in the row direction having the constant signal may be greater than the width of the portion where the second connection portion overlaps the wiring extending in the row direction having no constant signal. section width.
  • the wiring extending in the row direction with a constant signal may include, for example, a light emitting reset voltage line VINL, a first power supply voltage line VDL, and the like.
  • the width of the portion where the first connection portion overlaps the wiring extending in the column direction having the constant signal may be greater than the width of the portion where the first connection portion overlaps the wiring extending in the column direction having no constant signal.
  • FIG. 19 shows a schematic structural diagram of a display panel according to an embodiment of the present disclosure. As shown in FIG. 19 , the display panel 700 may include the array substrate 20 according to any embodiment of the present disclosure or the array substrate including the pixel circuit 100 according to any embodiment of the present disclosure.
  • the display panel 700 may further include other components, such as a timing controller, a signal decoding circuit, a voltage conversion circuit, etc., for example, these components may use existing conventional components, which will not be described in detail here.
  • the display panel 700 may be a rectangular panel, a circular panel, an oval panel, a polygonal panel, or the like.
  • the display panel 700 can be not only a flat panel, but also a curved panel, or even a spherical panel.
  • the display panel 700 may also have a touch function, that is, the display panel 700 may be a touch display panel.
  • Embodiments of the present disclosure also provide a display device including the display panel according to any embodiment of the present disclosure.
  • FIG. 20 shows a schematic structural diagram of a display device according to an embodiment of the present disclosure.
  • the display device 800 may include the display panel 700 according to any embodiment of the present disclosure.
  • the display device 800 may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and the like.
  • FIG. 21 shows a pixel circuit, which is a 7T1C structure including 7 transistors and 1 capacitor.
  • the active layers of the transistors T1 and T2 include oxide semiconductor materials, and the transistors T1 and T2 may be N-type oxide transistors.
  • the active layers of transistors T3-T7 include silicon semiconductor material, such as low temperature polysilicon.
  • FIG. 22 shows a shielding layer for the circuit shown in FIG. 21 .
  • FIG. 26 shows the position of the shielding layer 0.
  • the shielding layer is located between the semiconductor layer of the active layer and the substrate and is at least insulated from the active semiconductor.
  • FIG. 23 shows the plan layout of each functional layer (semiconductor layer and conductive layer) of the pixel circuit including the light shielding layer.
  • the oxide semiconductors of T1 and T2 are mirrored designs; the shielding layer shields the silicon semiconductor material.
  • the overall plane layout of the pixel circuit including the light shielding layer is also a mirror design; in the embodiment of the present disclosure, the mirror design can also be, for example, the plane layout of the pixel circuit including the light shielding layer shown in FIG. 24 and FIG. 29 .
  • Da is the access point of the data signal terminal Data[m] in Figure 21
  • Vinit_OLED is the access point of the initial signal terminal Vinit_OLED in Figure 21
  • N1 is the potential point of the node N1 in Figure 21, wherein, N1 is located in the first source-drain layer.
  • N4 is the potential point of the node N4 in FIG. 21
  • ELVDD is the potential point of the power supply terminal ELVDD in FIG. 21
  • ELVDD is located in the first source-drain layer.
  • the occlusion layer meets at least one of the following conditions:
  • the main body of the shielding layer is covered with silicon semiconductor material, and the coverage area of the N1 node and the shielding layer is greater than 10%; to stabilize the N1 node;
  • the shielding layer does not overlap with the oxide channel, or the overlapping area is less than 90%, which alleviates the parasitic capacitance on the oxide layer;
  • the overlapping area between the shielding layer and the initialization signal line should be minimized to reduce the load on the initialization signal line.
  • the layout is designed to avoid the arc-shaped line at the T7 position and only overlap the horizontal line. For example, if As shown in FIG. 29, the conductive portion 47 is bent and extended on the orthographic projection of the base substrate to reduce the overlap between the light shielding layer and the second initial signal line Vinit2; and
  • the initialization signal line can be narrowed at the overlapping position with the blocking layer, and the blocking layer can also be narrowed.
  • FIG. 24 shows a plan layout of a pixel circuit of an embodiment of the present disclosure.
  • the connection lines of the shielding layer along the row and column directions should avoid scanning lines as much as possible to avoid parasitic effects.
  • N1 in FIG. 24 is the potential point of the node N1 in FIG. 21 , wherein N1 is located in the first source-drain layer.
  • the biasing of the blocking layer can be implemented in the following manner.
  • Embodiment 3 If a VDD or Vint signal is used, a hole can be connected at the overlapping position of the VDD line and the Vint line.
  • the SD1 and SD2 layers are source-drain electrode film layers, and the material may include metal materials, such as molybdenum, aluminum, copper, titanium, niobium, one of them or alloys, or molybdenum/titanium alloys or laminates, etc. , or can be a titanium/aluminum/titanium stack.
  • the gate1 and gate2 layers are gate electrode film layers, which can be made of the same material and/or the same layer as the gate of the oxide transistor, for example, the material can be molybdenum, aluminum, copper, titanium, niobium, one of which Or alloys, or molybdenum/titanium alloys or laminates, etc.
  • the potential loaded by the shielding layer can be the same potential loaded by the power supply line VDD (voltage source potential); it can also be the same potential loaded by the initialization signal line; it can also be the same potential loaded by the cathode (cathode potential VSS); it can also be other fixed potentials.
  • the range of the fixed potential is -10V ⁇ +10V, another example, the range of the fixed potential is -5V ⁇ +5V, another example, the range of the fixed potential is -3V ⁇ +3V, another example, the range of the fixed potential is -1V ⁇ +1V, another example, the range of the fixed potential is -0.5V ⁇ +0.5V, another example, the range of the fixed potential is 0V, another example, the range of the fixed potential is 0.1V, another example, the range of the fixed potential is The range is 10.1V, another example, the range of the fixed potential is 0.2V, another example, the range of the fixed potential is -0.2V, another example, the range of the fixed potential is 0.3V, another example, the range of the fixed potential is -0.3V .
  • the potential loaded by the light shielding layer may be greater than the potential loaded by the cathode (cathode potential VSS) and less than the potential loaded by the power supply line VDD; or, the potential loaded by the light shielding layer may be greater than the potential loaded by the initialization signal line, and less than the power supply line VDD. loaded potential.
  • the shielding layer may be an amorphous silicon material, or a metal material, or an oxide semiconductor material such as IGZO, or a polysilicon material, or a conductive semiconductor material.
  • the pixel driving circuit may include: a driving transistor T3, a first transistor T1, a second transistor T2, a third transistor T3, a fourth transistor T4, a fifth transistor T5, a sixth transistor T6, a seventh transistor T7, and a capacitor C.
  • the first pole of the fourth transistor T4 is connected to the data signal terminal Da, the second pole is connected to the first pole of the driving transistor T3, the gate is connected to the second gate driving signal terminal G2; the first pole of the fifth transistor T5 is connected to the first pole of the driving transistor T3.
  • a power supply terminal VDD the second pole is connected to the first pole of the driving transistor DT, the gate is connected to the enable signal terminal EM; the gate of the driving transistor T3 is connected to the node N; the first pole of the second transistor T2 is connected to the node N, and the second pole is connected to the node N.
  • the pole is connected to the second pole of the driving transistor T3, the gate is connected to the first gate driving signal terminal G1; the first pole of the sixth transistor T6 is connected to the second pole of the driving transistor T3, and the second pole is connected to the first pole of the seventh transistor T7 pole, the gate is connected to the enable signal terminal EM, the second pole of the seventh transistor T7 is connected to the second initial signal terminal Vinit2, the gate is connected to the second reset signal terminal Re2; the first pole of the first transistor T1 is connected to the node N, The diode is connected to the first initial signal terminal Vinit1, the gate is connected to the first reset signal terminal Re1, and the capacitor C is connected between the first power terminal VDD and the node N.
  • the pixel driving circuit may be connected to a light-emitting unit OLED for driving the light-emitting unit OLED to emit light, and the light-emitting unit OLED may be connected between the second pole of the sixth transistor T6 and the second power terminal VSS.
  • the first transistor T1 and the second transistor T2 can be N-type metal oxide transistors, and the N-type metal oxide transistor has a smaller leakage current, so that the light-emitting stage can be avoided, and the node N passes through the first transistor T1 and the second transistor. T2 leakage.
  • the driving transistor T3, the third transistor T3, the fourth transistor T4, the fifth transistor T5, the sixth transistor T6, and the seventh transistor T7 may be low temperature polysilicon transistors, and the low temperature polysilicon transistors have higher carrier mobility , which is conducive to realizing a display panel with high resolution, high response speed, high pixel density, and high aperture ratio.
  • the first initial signal terminal and the second initial signal terminal may output the same or different voltage signals according to actual conditions.
  • FIG. 28 it is a timing diagram of each node in a driving method of the pixel driving circuit of FIG. 27 .
  • G1 represents the timing of the first gate driving signal terminal G1
  • G2 represents the timing of the second gate driving signal terminal G2
  • Re1 represents the timing of the first reset signal terminal Re1
  • Re2 represents the timing of the second reset signal terminal Re2
  • EM represents the timing of the enable signal terminal EM
  • Da represents the timing of the data signal terminal Da.
  • the driving method of the pixel driving circuit may include a first reset stage t1, a compensation stage t2, a second reset stage T3, and a light-emitting stage t4.
  • the first reset stage t1 the first reset signal terminal Re1 outputs a high level signal, the first transistor T1 is turned on, and the first initial signal terminal Vinit1 inputs an initial signal to the node N.
  • the compensation stage t2 the first gate driving signal terminal G1 outputs a high-level signal, the second gate driving signal terminal G2 outputs a low-level signal, the fourth transistor T4, the second transistor T2, and the data signal terminal Da output driving The signal is to write the voltage Vdata+Vth to the node N, where Vdata is the voltage of the driving signal, and Vth is the threshold voltage of the driving transistor T3.
  • the second reset signal terminal Re2 outputs a low-level signal
  • the seventh The transistor T7 is turned on, and the second initial signal terminal Vinit2 inputs an initial signal to the second pole of the sixth transistor T6.
  • the driving transistor output current formula I ( ⁇ WCox/2L)(Vgs-Vth) 2 , where ⁇ is the carrier mobility; Cox is the gate capacitance per unit area, W is the channel width of the driving transistor, and L drives The length of the transistor channel, Vgs is the gate-source voltage difference of the driving transistor, and Vth is the threshold voltage of the driving transistor.
  • the output current I ( ⁇ WCox/2L)(Vdata+Vth ⁇ Vdd ⁇ Vth) 2 of the driving transistor in the pixel driving circuit of the present disclosure.
  • the pixel driving circuit can avoid the influence of the threshold value of the driving transistor on its output current.
  • the array substrate may include a base substrate, a light shielding layer, a first active layer, a first gate layer, a second gate layer, a second active layer, a third gate layer, and a first source-drain layer, which are stacked in sequence.
  • FIGS. 29-41 FIG. 29 is a structural layout of an exemplary embodiment of the disclosed array substrate
  • FIG. 30 is a structural layout of the light shielding layer in FIG. 29
  • FIG. 31 is a structural layout of the first active layer in FIG. 29 Layout
  • FIG. 32 is the structural layout of the first gate layer in FIG. 29
  • FIG. 33 is the structural layout of the second gate layer in FIG.
  • FIG. 34 is the structural layout of the second active layer in FIG. 29, and FIG.
  • FIG. 29 is the structural layout of the third gate layer
  • FIG. 36 is the structural layout of the first source and drain layer in FIG. 29
  • FIG. 37 is the structural layout of the light shielding layer and the first active layer in FIG. 29
  • FIG. 38 is the structural layout of FIG. 29
  • Fig. 39 is the structure layout of the light shielding layer, the first active layer, the first gate layer and the second gate layer in Fig. 29,
  • Fig. 40 is the structural layout of the light-shielding layer, the first active layer, the first gate layer, the second gate layer, and the second active layer in FIG. 29
  • FIG. 41 is the light-shielding layer, the first active layer, the second active layer in FIG. Structural layout of the first gate layer, the second gate layer, the second active layer, and the third gate layer.
  • the light shielding layer may include a plurality of repeating units 0 and connecting portions 02 connected between the repeating units 0 .
  • the repeating unit 0 may include two light-shielding parts 01 symmetrically arranged along the dotted line A, wherein the dotted line A extends along the second direction Y.
  • the light-shielding portion 01 may include a first light-shielding portion 011 , a second light-shielding portion 012 , a third light-shielding portion 013 , and a fourth light-shielding portion 014 .
  • the second light shielding portion 012 and the third light shielding portion 013 may extend along the second direction Y in the orthographic projection of the base substrate, and the fourth light shielding portion 014 may extend along the first direction X in the orthographic projection of the base substrate.
  • the second light-shielding portion 012 and the third light-shielding portion 013 may be connected to the two sides of the first light-shielding portion 011 in the second direction Y, respectively, and the second light-shielding portion 012 is orthographically projected on the base substrate and the third light-shielding portion 013 is on the backing
  • the orthographic projection of the base substrate on the first direction X may be spaced apart by a preset distance.
  • the fourth light shielding portion 014 may be located on one side of the first light shielding portion in the first direction X.
  • two first light-shielding portions 011 adjacent to each other in the first direction X are connected.
  • the two adjacent light-shielding portions 01 are connected by respective fourth light-shielding portions 014 .
  • two adjacent shading parts 01 can be connected by connecting parts 02, wherein the connecting parts 02 can respectively connect the second shading parts 012 and the third shading parts 013 of the two shading parts 01, and the connecting parts 02 are in the
  • the orthographic projection of the base substrate extends along the first direction X.
  • the first direction X and the second direction Y may intersect, for example, the first direction X may be a row direction, and the second direction may be a column direction.
  • the first active layer may include an active part 54 , an active part 53 , an active part 55 , and an active part 57 .
  • the active part 54 can be used to form the channel region of the fourth transistor T4, the active part 53 can be used to form the channel region of the driving transistor T3, and the active part 55 can be used to form the channel of the fifth transistor T5 region, the active part 57 may be used to form the channel region of the seventh transistor T7.
  • the first active layer may be formed of a polycrystalline silicon semiconductor material.
  • the first gate layer may include a second gate driving signal line G2 , an enable signal line EM, a second reset signal line Re2 , and a conductive portion 11 .
  • the orthographic projections of the second gate driving signal line G2, the enable signal line EM, and the second reset signal line Re2 on the base substrate may all extend along the first direction X.
  • the second gate driving signal line G2 can be used to provide the second gate driving signal terminal in FIG. 27
  • the enable signal line EM can be used to provide the enable signal terminal in FIG. 27
  • the second reset signal line Re2 Can be used to provide the second reset signal terminal in FIG. 27 .
  • the orthographic projection of the second gate driving signal line G2 on the base substrate may cover the orthographic projection of the active portion 54 on the base substrate, and the partial structure of the second gate driving signal line G2 may be used to form the gate of the fourth transistor T4 .
  • the orthographic projection of the enable signal line EM on the base substrate may cover the orthographic projection of the active portion 55 on the base substrate, and a part of the structure of the enable signal line EM may be used to form the gate of the fifth transistor T5.
  • the orthographic projection of the second reset signal line Re2 on the base substrate covers the orthographic projection of the active portion 57 on the base substrate, and a partial structure of the second reset signal line Re2 can be used to form the gate of the seventh transistor T7.
  • the orthographic projection of the conductive part 11 on the base substrate can cover the orthographic projection of the active part 53 on the base substrate, the conductive part 11 can be used to form the gate of the driving transistor T3, and at the same time, the conductive part 11 can also form a part of the capacitor C. electrode.
  • the first active layer can be doped by using the first gate layer as a mask, so that the first active layer covered by the first gate layer forms a semiconductor structure, and the first active layer not covered by the first gate layer forms a semiconductor structure. Parts form conductor structures.
  • the second gate layer may include a first initial signal line Vinit1 , a first reset signal line Re1 , a first gate driving signal line G1 , a conductive portion 21 , and a connecting portion twenty two.
  • the orthographic projections of the first initial signal line Vinit1, the first reset signal line Re1, and the first gate driving signal line G1 on the base substrate may all extend along the first direction.
  • the first initial signal line Vinit1 can be used to provide the first initial signal terminal in FIG. 27
  • the first reset signal line Re1 can be used to provide the first reset signal terminal in FIG. 27
  • the first gate driving signal line G1 Can be used to provide the first gate drive signal terminal in FIG. 27 .
  • the conductive portion 21 is used for the other electrode of the capacitor C. As shown in FIG.
  • the conductive parts 21 adjacent to each other in the first direction X may be connected to each other through the connecting parts 22 , and through holes 211 may be formed on the conductive parts 21 .
  • the second active layer may include an active portion 6 , and the active portion 6 may include an active portion 61 and an active portion 62 , wherein the active portion 61 may form the first active portion 61 .
  • the active portion 62 may form the channel region of the second transistor T2.
  • the active part 6 is located on the side of the active part 61 away from the active part 62 and can be connected to the first initial signal line Vinit1 through the via hole 71 to connect the second pole of the first transistor T1 and the first Initial signal line Vinit1.
  • the second active layer may be formed of a metal oxide semiconductor material, for example, indium gallium zinc oxide.
  • the third gate layer may include a gate line 3Re1 , a gate line 3G1 , and a gate line 3Re1 .
  • the orthographic projection of the grid line 3Re1 on the base substrate may extend along the first direction, and the orthographic projection of the grid line 3Re1 on the base substrate at least partially overlaps with the orthographic projection of the first reset signal line Re1 on the base substrate.
  • the gate line 3Re1 may be connected to the first reset signal line Re1 through at least one via hole, and the via hole may be located in a non-display area or a display area of the display panel.
  • the orthographic projection of the gate line 3G1 on the base substrate may extend along the first direction, and the orthographic projection of the gate line 3G1 on the base substrate may at least partially overlap with the orthographic projection of the first gate driving signal line G1 on the base substrate.
  • the gate line 3G1 may be connected to the first gate driving signal line G1 through at least one via hole, and the via hole may be located in a non-display area or a non-display area of the display panel.
  • the second active layer can be formed by conducting conductorization using the third gate layer as a mask, that is, the second active layer covered by the third gate layer forms a semiconductor structure, and the part not covered by the third gate layer forms a semiconductor structure A conductor structure is formed.
  • the first source-drain layer may include a conductive portion 41 , a conductive portion 42 , a conductive portion 43 , a conductive portion 44 , a conductive portion 45 , a conductive portion 46 , a conductive portion 47 , and a second initial signal line Vinit2 ,
  • the second initial signal line Vinit2 is connected to the conductive portion 47 for providing the second initial signal terminal in FIG. 27 .
  • the orthographic projection of the second initial signal line Vinit2 on the base substrate may at least partially overlap with the orthographic projection of the first reset signal line Re1 on the base substrate.
  • the conductive portion 41 can be connected to the active portion 6 through the via hole 72, and the first initial signal line Vinit1 can be connected to the via hole 73 to connect the second electrode of the first transistor T1 and the first initial signal line Vinit1.
  • the conductive portion 41 can be further The contact efficiency between the active part 6 and the first initial signal line Vinit1 is increased.
  • the conductive part 42 can be connected to the position of the active part 6 between the active part 61 and the active part 62 through the via hole 74 , and the conductive part 11 can be connected to the conductive part 11 through the via hole 75 to connect the first electrode of the first transistor T1 and the driving part. gate of transistor T3.
  • the via hole 75 may penetrate through the through hole 211 on the conductive portion 21 , and the conductor filled in the via hole 75 is not electrically connected to the conductive portion 21 .
  • the conductive part 43 can be connected to the connection part 22 through the via hole 76 , and the first active layer on the side of the active part 55 can be connected through the via hole 77 to connect the capacitor C and the first electrode of the fifth transistor T5 .
  • the conductive part 44 can be connected to the first active layer between the active part 57 and the active part 56 through the via hole 78 to connect the second electrode of the sixth transistor T6, wherein the conductive part 44 can be used to connect the light emitting unit the anode.
  • the conductive part 45 can be connected to the active part 6 on the side of the active part 62 away from the active part 61 through the via hole 710 , and the first active layer on the side of the active part 53 can be connected through the via hole 711 to connect the second transistor.
  • the conductive part 46 can be connected to the connection part 22 through the via hole 712 , and the conductive part 46 can also be connected to the power line for providing the first power signal terminal VDD in FIG. 27 .
  • the conductive part 47 may be connected to the first active layer on one side of the active part 57 through the via hole 79 to connect the second initial signal line Vinit2 and the second electrode of the seventh transistor T7.
  • the orthographic projection of the fourth light shielding portion 014 on the base substrate at least partially overlaps with the orthographic projection of the connecting portion 22 on the base substrate. This arrangement can minimize the shielding effect of the fourth light shielding portion 014 on light, and increase the light transmittance of the array substrate.
  • the orthographic projection of the connection portion 02 on the base substrate and the orthographic projection of the first reset signal line Re1 on the base substrate at least partially overlap. Similarly, this setting can be minimized as much as possible.
  • the shielding effect of the small connecting portion 02 on light increases the light transmittance of the array substrate.
  • the capacitive coupling effect of the connecting portion 02 on the first reset signal line Re1 is small. Compared with disposing the connecting portion 02 directly under the gate line in the first gate layer, this arrangement can reduce the capacitive coupling effect of the connecting portion 02 on the gate line.
  • the second gate layer may further include a raised portion 23 , the raised portion 23 is connected to the first initial signal line Vinit1 , the raised portion 23 includes a side 231 , and the first initial signal line Vinit1 includes a side edge 232 connected to the side edge 231 , and the included angle between the orthographic projection of the side edge 231 on the base substrate and the side edge 232 on the base substrate is less than 180°.
  • the orthographic projection of the protruding portion 23 on the base substrate and the orthographic projection of the second light shielding portion 012 on the base substrate at least partially overlap.
  • the raised portion 23 can reduce the resistance of the first initial signal line Vinit1.
  • the orthographic projection of the base substrate of the raised portion 23 and the orthographic projection of the second light shielding portion 012 on the base substrate at least partially overlap, so that the raised portion can be reduced as much as possible. 23.
  • the light-shielding layer may be a conductor structure, for example, the light-shielding layer may be located on a metal light-shielding layer, and the light-shielding layer may be connected to a stable voltage source, and the stable voltage source may be the first power signal terminal VDD, the first power supply signal terminal VDD in FIG. Any one of the power supply signal terminal VSS, the first initial signal terminal Vinit1, and the second initial signal terminal Vinti2.
  • the light shielding layer can be connected to the above-mentioned stable power supply in the non-display area or the display area of the array substrate.
  • the above-mentioned stable voltage source can also be provided by other power sources. As shown in FIG.
  • the orthographic projection of the conductive portion 42 on the base substrate and the orthographic projection of the third light-shielding portion 013 on the base substrate at least partially overlap. Since the third light-shielding portion 013 is connected to a stable power supply, the third light-shielding portion 013 is opposite to the conductive portion. 42 has a voltage stabilization effect. At the same time, since the conductive portion 42 is connected to the gate of the driving transistor T3 (the conductive portion 11 ), that is, the third light shielding portion 013 has a voltage-stabilizing effect on the gate of the driving transistor T3, this setting can reduce the voltage of the gate of the driving transistor T3 during the light-emitting stage. voltage fluctuations.
  • the orthographic projection of the first light-shielding portion 011 on the base substrate can cover the orthographic projection of the active portion 53 on the base substrate, and the first light-shielding portion 011 can shield the active portion 53 from light, thereby reducing the active portion 53 .
  • the section 53 changes the output characteristics of the drive transistor T3 due to illumination.
  • the orthographic projection of the first light shielding portion 011 on the base substrate can also cover the orthographic projection of the gate of the driving transistor T3 (conducting portion 11 ) on the base substrate, so that the first light shielding portion 011 can stabilize the gate of the driving transistor T3 Therefore, the voltage fluctuation of the gate of the driving transistor T3 in the light-emitting stage is reduced. As shown in FIG.
  • the orthographic projection of the first light-shielding portion 011 on the base substrate may at least partially overlap with the orthographic projection of the conductive portion 42 on the base substrate, so that the first light-shielding portion 011 can further stabilize the gate of the driving transistor T3 pressure.
  • the area of the driving transistor gate (conductive portion 11) and the conductive portion 42 covered by the light shielding layer may be greater than 50% of the total area of the conductive portion 42 of the conductive portion 11, for example, 60%-70%; 80%-90%, or between Value range, or cover all, etc.
  • the array substrate may further include a second source/drain layer and an anode layer, the second source/drain layer may be located on the side of the first source/drain layer away from the base substrate, and the anode layer may be located at the side of the second source/drain layer away from the base substrate side.
  • the second source-drain layer may include data signal lines for providing the data signal terminals in FIG. 27 and power lines for providing the first power signal terminals.
  • the orthographic projections of the data signal lines and the power lines on the base substrate may both extend along the second direction Y.
  • the anode layer may form the anode of the light emitting cell.
  • the array may basically further include a second source-drain layer, as shown in FIGS. 42 and 43 , FIG. 42 is a structural layout of an exemplary embodiment of an array substrate of the disclosure, and FIG. 43 is the The structural layout of the second source-drain layer.
  • the second source and drain layer may include a data line Da and a power supply line VDD, and the orthographic projection of the data line Da and the power supply line VDD on the base substrate may extend along the second direction Y.
  • the data line Da can be used to provide the data signal terminal in FIG. 27
  • the power line VDD can be used to provide the first power signal terminal in FIG. 27 .
  • FIG. 42 is a structural layout of an exemplary embodiment of an array substrate of the disclosure
  • FIG. 43 is the The structural layout of the second source-drain layer.
  • the second source and drain layer may include a data line Da and a power supply line VDD, and the orthographic projection of the data line Da and the power supply line VDD on the base substrate may extend along the second direction
  • the power line VDD can be connected to the connection part 22 through the via hole 713 to connect the first power signal terminal and the capacitor C.
  • the data line may be connected to the first active layer on one side of the active part 54 through the via hole 714 to connect the first electrode of the fourth transistor T4 and the data signal terminal.
  • the power supply line VDD may include an extension portion 91 and an extension portion 92 distributed along its extending direction, wherein the size of the extension portion 91 projected on the first direction X of the base substrate may be larger than that of the extension portion 92 on the normal projection of the base substrate. The dimension projected in the first direction X.
  • the extension portion 91 can cover the channel regions of the first transistor and the second transistor by orthographic projection on the base substrate. On the one hand, this arrangement can shield and shield the transistors through the power line VDD; on the other hand, this arrangement can reduce the resistance of the power line VDD.
  • FIG. 44 is a structural layout of an exemplary embodiment of the disclosed array substrate
  • FIG. 45 is a structural layout of the second source and drain layers in FIG. 44 .
  • the difference between the second source-drain layer shown in FIG. 45 and the second source-drain layer shown in FIG. 43 is that the extension part 91 not only covers the channel regions of the first transistor and the second transistor, but also covers the sixth transistor. T6 and the channel region of the drive transistor T3.
  • both are schematic structural diagrams of the second initial signal line in another exemplary embodiment of the array substrate of the present disclosure.
  • the second initial signal line Vinit2 may be a parallel grid line or a broken line, which may be designed according to the voltage drop of the initialization signal line.
  • the array substrate may further include a first insulating layer 82, a second insulating layer 83, a third insulating layer 84, a fourth insulating layer 85, a sixth insulating layer 86, a dielectric layer 87, a passivation layer 88, and a first planarization layer 89.
  • the base substrate 81, the light shielding layer, the first insulating layer 82, the first active layer, the second insulating layer 83, the first gate layer, the third insulating layer 84, the second gate layer, and the fourth insulating layer 85 are examples of the base substrate 81, the light shielding layer, the first insulating layer 82, the first active layer, the second insulating layer 83, the first gate layer, the third insulating layer 84, the second gate layer, and the fourth insulating layer 85.
  • the second active layer, the fifth insulating layer 86, the third gate layer, the dielectric layer 87, the first source and drain layers, the passivation layer 88, the first flat layer 89, and the second source and drain layers are stacked in sequence .
  • the first insulating layer 82 includes at least one of a silicon oxide layer and a silicon nitride layer, and the thickness of the first insulating layer 82 may be 2500-3500 angstroms.
  • the second insulating layer 83 may be a silicon oxide layer, and the thickness of the second insulating layer 83 may be 1000-2000 angstroms.
  • the third insulating layer 84 may be an interlayer insulating layer or an interlayer dielectric layer, the third insulating layer 84 may be a silicon nitride layer, and the thickness may be 1000-2000 angstroms.
  • the fourth insulating layer 85 may include a silicon oxide layer and a silicon nitride layer, wherein the thickness of the silicon oxide layer may be 3000-4000 angstroms, and the thickness of the silicon nitride may be 500-1000 angstroms.
  • the fifth insulating layer 86 may be a silicon oxide layer, and the thickness may be 1000-1700 angstroms.
  • the dielectric layer 87 may include a silicon oxide layer and a silicon nitride layer, the thickness of the silicon oxide layer may be 1500-2500 ⁇ , and the thickness of the silicon nitride layer may be 2500-3500 ⁇ .
  • the side of the second source-drain layer away from the base substrate can also be provided with a second flat layer, the anode layer is located on the side of the second flat layer away from the base substrate, and the side of the anode layer away from the base substrate can also be provided with a light-emitting layer
  • the unit layer, the light-emitting unit layer may include an electron injection layer, an organic light-emitting layer, a hole injection layer, and the like.
  • the display panels and display devices provided by the embodiments of the present disclosure have the same or similar beneficial effects as the array substrates provided by the foregoing embodiments of the present disclosure. Since the array substrates have been described in detail in the foregoing embodiments, they will not be repeated here.

Abstract

An array substrate (10), a related display panel (700), and a related display apparatus (800). The array substrate (10) comprises: a substrate (300); multiple subpixels (SPX) that are provided on the substrate (300) and arranged in multiple rows and multiple columns, at least one of the multiple subpixels (SPX) comprising a pixel circuit (100), and each pixel circuit (100) comprising a driving circuit (110), a voltage stabilizing circuit (120), a driving reset circuit (130), and a light-emitting reset circuit (140), wherein the driving circuit (110) is configured to provide a drive current for a light-emitting device (200), the voltage stabilizing circuit (120) is configured to enable a control terminal (G) of the driving circuit (110) to be connected to the driving reset circuit (130), the driving reset circuit (130) is configured to reset the control terminal (G) of the driving circuit (110), and the light-emitting reset circuit (140) is configured to reset the light-emitting device (200); a driving reset voltage line (VINL1) that is coupled to a driving reset voltage terminal (Vinit1) and configured to provide a driving reset voltage (VINT1) for the driving reset voltage terminal; and a light-emitting reset voltage line (VINL2) that is coupled to a light-emitting reset voltage terminal (Vinit2) and configured to provide a light-emitting reset voltage (VINT2) for the light-emitting reset voltage terminal.

Description

阵列基板及其显示面板和显示装置Array substrate, display panel and display device thereof
交叉引用cross reference
本公开要求于2021年2月10日提交的申请号为PCT/CN2021/076577,名称为“阵列基板及其显示面板和显示装置”的PCT国际申请的优先权,该PCT国际申请的全部内容通过引用全部并入本文。The present disclosure claims the priority of the PCT International Application No. PCT/CN2021/076577, filed on February 10, 2021, entitled "Array Substrate, Display Panel and Display Device", the entire content of which is through Reference is incorporated herein in its entirety.
技术领域technical field
本公开的实施例涉及显示技术领域,特别地,涉及一种阵列基板及其显示面板和显示装置。Embodiments of the present disclosure relate to the field of display technology, and in particular, to an array substrate, a display panel and a display device thereof.
背景技术Background technique
有机发光二极管(Organic Light-Emitting Diode,OLED)显示面板具有自发光、高效率、色彩鲜艳、轻薄省电、可卷曲以及使用温度范围宽等优点,已经逐步应用于大面积显示、照明以及车载显示等领域。Organic Light-Emitting Diode (OLED) display panels have the advantages of self-luminescence, high efficiency, bright colors, light weight, power saving, rollability, and wide temperature range, and have been gradually applied to large-area displays, lighting, and automotive displays. and other fields.
发明内容SUMMARY OF THE INVENTION
本公开的实施例提供了阵列基板及相关的显示面板和显示装置。Embodiments of the present disclosure provide array substrates and related display panels and display devices.
根据本公开的第一方面,提供了一种阵列基板,其包括衬底。该阵列基板还包括设置在衬底上的排布为多行多列的多个子像素。该多个子像素中的至少一个包括像素电路。每个像素电路包括:驱动电路、稳压电路、驱动复位电路和发光复位电路。该驱动电路包括控制端、第一端和第二端,并被配置为向发光器件提供驱动电流。该稳压电路与驱动电路的控制端、第一节点和稳压控制信号输入端耦接,并被配置为在来自所述稳压控制信号输入端的稳压控制信号的控制下使驱动电路的控制端和第一节点导通。该驱动复位电路耦接驱动复位控制信号输入端、所述第一节点和驱动复位电压端,并被配置为在来自驱动复位控制信号输入端的驱动复位控制信号的控制下将来自驱动复位电压端的驱动复位电压提供给稳压电路,以对驱动电路的控制端进行复位。该发光复位电路耦接发光复位控制信号输入端、发光器件和发光复位电压端,并被配置为在来自所述发光复位控制信号输入端的发光复位控制信号的控制下将来自发光复位电压端的发光复位电压提供给发光器件,以对发光器件进行复位。该阵列基板还包括驱动复位电压线和发光复位电压线。该驱动复位电压线耦接驱动复位电压端以提供驱动复位电压。该发光复位电压线耦接发光复位电压端以提供发光复位电压。According to a first aspect of the present disclosure, there is provided an array substrate including a substrate. The array substrate further includes a plurality of sub-pixels arranged on the substrate and arranged in rows and columns. At least one of the plurality of subpixels includes a pixel circuit. Each pixel circuit includes: a driving circuit, a voltage regulator circuit, a driving reset circuit and a light-emitting reset circuit. The driving circuit includes a control terminal, a first terminal and a second terminal, and is configured to provide a driving current to the light emitting device. The voltage stabilizing circuit is coupled to the control terminal of the driving circuit, the first node and the voltage stabilizing control signal input terminal, and is configured to enable the control of the driving circuit under the control of the voltage stabilizing control signal from the voltage stabilizing control signal input terminal terminal and the first node are turned on. The driving reset circuit is coupled to the driving reset control signal input terminal, the first node and the driving reset voltage terminal, and is configured to convert the driving reset voltage terminal from the driving reset voltage terminal under the control of the driving reset control signal from the driving reset control signal input terminal. The reset voltage is provided to the voltage regulator circuit to reset the control terminal of the drive circuit. The light-emitting reset circuit is coupled to the light-emitting reset control signal input end, the light-emitting device and the light-emitting reset voltage end, and is configured to reset the light-emitting reset voltage from the light-emitting reset voltage end under the control of the light-emitting reset control signal from the light-emitting reset control signal input end A voltage is supplied to the light emitting device to reset the light emitting device. The array substrate further includes a driving reset voltage line and a light emitting reset voltage line. The driving reset voltage line is coupled to the driving reset voltage terminal to provide the driving reset voltage. The light-emitting reset voltage line is coupled to the light-emitting reset voltage terminal to provide the light-emitting reset voltage.
在本公开的实施例中,驱动电路包括驱动晶体管。稳压电路包括稳压晶体管。驱动复位电路包括驱动复位晶体管。发光复位电路包括发光复位晶体管。该驱动晶体管的第一极与驱动电路的第一端耦接,该驱动晶体管的栅极与驱动电路的控制端耦接,该驱动晶体管的第二极与驱动电路的第二端耦接。该稳压晶体管的第一极与驱动电路的控制端耦接,该稳压晶体管的栅极与稳压控制信号输入端耦接,该稳压晶体管的第二极与第一节点耦接。该驱动复位晶体管的第一极与驱动复位电压端耦接,该驱动复位晶体管的栅极与驱动复位控制信号输入端耦接,该驱动复位晶体管的第二极与第一节点耦接。该发光复位晶体管的第一极与发光复位电压端耦接,该发光复位晶体管的栅极与发光复位控制信号输入端耦接,该发光复位晶体 管的第二极与发光器件的第一端耦接。该稳压晶体管的有源层包括氧化物半导体材料。该驱动晶体管和该驱动复位晶体管的有源层包括硅半导体材料。In an embodiment of the present disclosure, the driving circuit includes a driving transistor. The voltage regulator circuit includes a voltage regulator transistor. The drive reset circuit includes a drive reset transistor. The light-emitting reset circuit includes a light-emitting reset transistor. The first pole of the driving transistor is coupled to the first terminal of the driving circuit, the gate of the driving transistor is coupled to the control terminal of the driving circuit, and the second pole of the driving transistor is coupled to the second terminal of the driving circuit. The first electrode of the voltage-stabilizing transistor is coupled to the control terminal of the driving circuit, the gate of the voltage-stabilizing transistor is coupled to the input terminal of the voltage-stabilizing control signal, and the second electrode of the voltage-stabilizing transistor is coupled to the first node. The first electrode of the drive reset transistor is coupled to the drive reset voltage terminal, the gate of the drive reset transistor is coupled to the drive reset control signal input end, and the second electrode of the drive reset transistor is coupled to the first node. The first electrode of the light-emitting reset transistor is coupled to the light-emitting reset voltage terminal, the gate of the light-emitting reset transistor is coupled to the light-emitting reset control signal input end, and the second electrode of the light-emitting reset transistor is coupled to the first end of the light-emitting device . The active layer of the voltage regulator transistor includes an oxide semiconductor material. The active layers of the drive transistor and the drive reset transistor include silicon semiconductor material.
在本公开的实施例中,该发光复位晶体管的有源层包括氧化物半导体材料。In an embodiment of the present disclosure, the active layer of the light-emitting reset transistor includes an oxide semiconductor material.
在本公开的实施例中,该阵列基板进一步包括:位于衬底上的第一有源半导体层,第一有源半导体层该包括硅半导体材料;以及位于该第一有源半导体层背离衬底一侧的并与该第一有源半导体层绝缘隔离的第二有源半导体层,该第二有源半导体层包括氧化物半导体材料。In an embodiment of the present disclosure, the array substrate further includes: a first active semiconductor layer on the substrate, the first active semiconductor layer comprising a silicon semiconductor material; and the first active semiconductor layer facing away from the substrate A second active semiconductor layer on one side and insulated from the first active semiconductor layer, the second active semiconductor layer comprising an oxide semiconductor material.
在本公开的实施例中,第一有源半导体层包括驱动晶体管的有源层和驱动复位晶体管的有源层。第二有源半导体层包括沿列方向设置的第一部分和第二部分。该第二有源半导体的第一部分包括稳压晶体管的有源层。该第二有源半导体的第二部分包括发光复位晶体管的有源层。In an embodiment of the present disclosure, the first active semiconductor layer includes an active layer of a driving transistor and an active layer of a driving reset transistor. The second active semiconductor layer includes a first portion and a second portion arranged in a column direction. The first portion of the second active semiconductor includes the active layer of the voltage regulator transistor. The second portion of the second active semiconductor includes the active layer of the light emitting reset transistor.
在本公开的实施例中,第二有源半导体的第一部分与第二有源半导体的第二部分沿列方向对准。In an embodiment of the present disclosure, the first portion of the second active semiconductor is aligned with the second portion of the second active semiconductor in the column direction.
在本公开的实施例中,像素电路进一步包括数据写入电路、补偿电路、存储电路和发光控制电路。该数据写入电路耦接数据信号输入端、扫描信号输入端和驱动电路的第一端,并被配置为在来自该扫描信号输入端的扫描信号的控制下将来自该数据信号输入端的数据信号提供给驱动电路的第一端。该补偿电路耦接驱动电路的第二端、第一节点和补偿控制信号输入端,并被配置为根据来自补偿控制信号输入端的补偿控制信号,对驱动电路进行阈值补偿。该存储电路耦接第一电源电压端和驱动电路的控制端,并被配置为存储第一电源电压端与驱动电路的控制端之间的电压差。该发光控制电路耦接发光控制信号输入端、第一电源电压端、驱动电路的第一端及第二端、发光复位电路以及发光器件,被配置为在来自发光控制信号输入端的发光控制信号的控制下将来自所述第一电源电压端的第一电源电压施加至驱动电路,并将驱动电路产生的驱动电流施加至发光器件。In an embodiment of the present disclosure, the pixel circuit further includes a data writing circuit, a compensation circuit, a storage circuit, and a light emission control circuit. The data writing circuit is coupled to the data signal input terminal, the scan signal input terminal and the first terminal of the driving circuit, and is configured to provide the data signal from the data signal input terminal under the control of the scan signal from the scan signal input terminal to the first terminal of the drive circuit. The compensation circuit is coupled to the second end of the drive circuit, the first node and the compensation control signal input end, and is configured to perform threshold compensation on the drive circuit according to the compensation control signal from the compensation control signal input end. The storage circuit is coupled to the first power supply voltage terminal and the control terminal of the driving circuit, and is configured to store a voltage difference between the first power supply voltage terminal and the control terminal of the driving circuit. The lighting control circuit is coupled to the lighting control signal input terminal, the first power supply voltage terminal, the first terminal and the second terminal of the driving circuit, the lighting reset circuit and the lighting device, and is configured to be in the middle of the lighting control signal from the lighting control signal input terminal. Under control, the first power supply voltage from the first power supply voltage terminal is applied to the driving circuit, and the driving current generated by the driving circuit is applied to the light emitting device.
在本公开的实施例中,该数据写入电路包括数据写入晶体管。该补偿电路包括补偿晶体管。该存储电路包括存储电容。该发光控制电路包括第一发光控制晶体管和第二发光控制晶体管。该数据写入晶体管的第一极与数据信号输入端耦接,该数据写入晶体管的栅极与扫描信号输入端耦接,该数据写入晶体管的第二极与驱动电路的第一端耦接。该补偿晶体管的第一极与驱动电路的第二端耦接,该补偿晶体管的栅极与补偿控制信号输入端耦接,该补偿晶体管的第二极与第一节点耦接。该存储电容的第一极耦接第一电源电压端,该存储电容的第二极耦接驱动电路的控制端,并被配置为存储第一电源电压端与驱动电路的控制端之间的电压差。第一发光控制晶体管的第一极与第一电源电压端耦接,该第一发光控制晶体管的栅极与发光控制信号输入端耦接,该第一发光控制晶体管的第二极与驱动电路的第一端耦接。以及该第二发光控制晶体管的第一极与驱动电路的第二端耦接,该第二发光控制晶体管的栅极与发光控制信号输入端耦接,该第二发光控制晶体管的第二极与发光器件的第一极耦接。In an embodiment of the present disclosure, the data writing circuit includes a data writing transistor. The compensation circuit includes a compensation transistor. The storage circuit includes a storage capacitor. The lighting control circuit includes a first lighting control transistor and a second lighting control transistor. The first pole of the data writing transistor is coupled to the data signal input terminal, the gate of the data writing transistor is coupled to the scan signal input terminal, and the second pole of the data writing transistor is coupled to the first terminal of the driving circuit catch. The first electrode of the compensation transistor is coupled to the second end of the driving circuit, the gate of the compensation transistor is coupled to the compensation control signal input end, and the second electrode of the compensation transistor is coupled to the first node. The first pole of the storage capacitor is coupled to the first power supply voltage terminal, and the second pole of the storage capacitor is coupled to the control terminal of the driving circuit, and is configured to store the voltage between the first power supply voltage terminal and the control terminal of the driving circuit Difference. The first electrode of the first light-emitting control transistor is coupled to the first power supply voltage terminal, the gate of the first light-emitting control transistor is coupled to the light-emitting control signal input end, and the second electrode of the first light-emitting control transistor is coupled to the driving circuit. The first end is coupled. and the first electrode of the second light-emitting control transistor is coupled to the second end of the driving circuit, the gate of the second light-emitting control transistor is coupled to the light-emitting control signal input end, and the second electrode of the second light-emitting control transistor is coupled to the input end of the light-emitting control signal. The first pole of the light emitting device is coupled.
在本公开的实施例中,第一有源半导体层包括数据写入晶体管、补偿晶体管、第一发光控制晶体管和第二发光控制晶体管的有源层。In an embodiment of the present disclosure, the first active semiconductor layer includes an active layer of a data writing transistor, a compensation transistor, a first light emission control transistor, and a second light emission control transistor.
在本公开的实施例中,发光复位控制信号与发光控制信号是同一信号。In the embodiment of the present disclosure, the light-emitting reset control signal and the light-emitting control signal are the same signal.
在本公开的实施例中,扫描信号与补偿控制信号是同一信号。In the embodiment of the present disclosure, the scan signal and the compensation control signal are the same signal.
在本公开的实施例中,该阵列基板进一步包括位于第一有源半导体层与第二有源半导体层之间的并与该第一有源半导体层和该第二有源半导体层绝缘隔离的第一导电层。该第一导电层包括沿列方向依次设置的驱动复位控制信号线、扫描信号线、驱动晶体管的栅极、存储电容的第一极、以及发光控制信号线。该驱动复位控制信号线与驱动复位控制信号输入端耦接,并被配置为向其提供驱动复位控制信号。该扫描信号线与扫描信号输入端及补偿控制信号输入端耦接,被配置为向该扫描信号输入端提供扫描信号,并被配置为向该补偿控制信号输入端提供补偿控制信号。该存储电容的第一极与该驱动晶体管的栅极为一体结构。以及该发光控制信号线与发光控制信号输入端耦接,并被配置为向其提供发光控制信号。In an embodiment of the present disclosure, the array substrate further includes a spacer between the first active semiconductor layer and the second active semiconductor layer and insulated from the first active semiconductor layer and the second active semiconductor layer the first conductive layer. The first conductive layer includes a drive reset control signal line, a scan signal line, a gate of a drive transistor, a first electrode of a storage capacitor, and a light emission control signal line, which are sequentially arranged along the column direction. The drive reset control signal line is coupled to the drive reset control signal input terminal, and is configured to provide the drive reset control signal thereto. The scan signal line is coupled to a scan signal input terminal and a compensation control signal input terminal, is configured to provide a scan signal to the scan signal input terminal, and is configured to provide a compensation control signal to the compensation control signal input terminal. The first electrode of the storage capacitor and the gate of the driving transistor are integrally formed. And the light-emitting control signal line is coupled to the light-emitting control signal input terminal, and is configured to provide the light-emitting control signal thereto.
在本公开的实施例中,驱动复位控制信号线在衬底上的正投影与第一有源半导体层在衬底上的正投影的重叠的部分为驱动复位晶体管的栅极。扫描信号线在衬底上的正投影与第一有源半导体层在衬底上的正投影的重叠的部分为补偿晶体管的栅极和数据写入晶体管的栅极。以及发光控制信号线在衬底上的正投影与第一有源半导体层在衬底上的正投影的重叠的部分为第一发光控制晶体管的栅极和第二发光控制晶体管的栅极。In the embodiment of the present disclosure, the overlapping portion of the orthographic projection of the driving reset control signal line on the substrate and the orthographic projection of the first active semiconductor layer on the substrate is the gate of the driving reset transistor. The overlapping portion of the orthographic projection of the scanning signal line on the substrate and the orthographic projection of the first active semiconductor layer on the substrate is the gate of the compensation transistor and the gate of the data writing transistor. And the overlapping part of the orthographic projection of the light-emitting control signal line on the substrate and the orthographic projection of the first active semiconductor layer on the substrate is the gate of the first light-emitting control transistor and the gate of the second light-emitting control transistor.
在本公开的实施例中,该阵列基板进一步包括位于第一导电层与第二有源半导体层之间的并与该第一导电层和该第二有源半导体层绝缘隔离的第二导电层。该第二导电层包括沿列方向设置的稳压控制信号线、存储电容的第二极、第一电源电压线和发光复位控制信号线。该稳压控制信号线与稳压控制信号输入端耦接,并被配置为向其提供稳压控制信号。该第一电源电压线与第一电源电压端耦接,并被配置为向其提供第一电源电压。该存储电容的第二极与该存储电容的第一极在衬底上的正投影至少部分重叠。该存储电容的第二极与第一电源电压线一体形成。以及该发光复位控制信号线与所述发光复位控制信号输入端耦接,并被配置为向其提供发光复位控制信号。In an embodiment of the present disclosure, the array substrate further includes a second conductive layer located between the first conductive layer and the second active semiconductor layer and insulated from the first conductive layer and the second active semiconductor layer . The second conductive layer includes a voltage regulation control signal line arranged along the column direction, a second pole of the storage capacitor, a first power supply voltage line and a light-emitting reset control signal line. The voltage stabilization control signal line is coupled to the voltage stabilization control signal input terminal, and is configured to provide the voltage stabilization control signal thereto. The first power supply voltage line is coupled to the first power supply voltage terminal and is configured to provide the first power supply voltage thereto. The second pole of the storage capacitor at least partially overlaps the orthographic projection of the first pole of the storage capacitor on the substrate. The second pole of the storage capacitor is integrally formed with the first power supply voltage line. And the light-emitting reset control signal line is coupled to the light-emitting reset control signal input terminal, and is configured to provide the light-emitting reset control signal thereto.
在本公开的实施例中,稳压控制信号线在衬底上的正投影与第二有源半导体层在衬底上的正投影的重叠的部分为稳压晶体管的第一控制极。以及发光控制信号线在衬底上的正投影与第二有源半导体层在衬底上的正投影的重叠的部分为发光复位晶体管的第一控制极。In the embodiment of the present disclosure, the overlapping portion of the orthographic projection of the voltage-stabilizing control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the first gate of the voltage-stabilizing transistor. And the overlapping part of the orthographic projection of the light-emitting control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the first control electrode of the light-emitting reset transistor.
在本公开的实施例中,该阵列基板进一步包括位于第二有源半导体层背离衬底一侧的并与第二有源半导体层绝缘隔离的第三导电层。该第三导电层包括沿列方向设置的稳压控制信号线、发光复位控制信号线、以及发光复位电压线。In an embodiment of the present disclosure, the array substrate further includes a third conductive layer located on a side of the second active semiconductor layer away from the substrate and insulated from the second active semiconductor layer. The third conductive layer includes voltage regulation control signal lines, light emission reset control signal lines, and light emission reset voltage lines arranged along the column direction.
在本公开的实施例中,稳压控制信号线在衬底上的正投影与第二有源半导体层在衬底上的正投影的重叠的部分为稳压晶体管的第二控制极。发光控制信号线在衬底上的正投影与第二有源半导体层在衬底上的正投影的重叠的部分为发光复位晶体管的第二控制极。以及发光复位电压线经由过孔与第二有源半导体层耦接,以形成发光复位晶体管的第一极。In the embodiment of the present disclosure, the overlapping portion of the orthographic projection of the voltage-stabilizing control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the second gate of the voltage-stabilizing transistor. The overlapping portion of the orthographic projection of the light-emitting control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the second control electrode of the light-emitting reset transistor. and the light-emitting reset voltage line is coupled to the second active semiconductor layer through the via hole to form the first electrode of the light-emitting reset transistor.
在本公开的实施例中,该阵列基板进一步包括位于第三导电层背离衬底一侧的并与第三导电层绝缘隔离的第四导电层,所述第四导电层包括第一连接部、第二连接部、第三连接部、第四连接部、第五连接部、第六连接部、第七连接部、以及第八连接部。该第一连接部用作驱动复位电压线。该第一连接部经由过孔与驱动复位晶体管的漏极区域耦接,形成该驱动复位晶体管的第一极。该第二连接部经由过孔与发光复位电压线耦接。该第三连接部经由过孔与数据写入晶体管的漏极区域耦接,形成该数据写入晶体管的第一极。该第四连接部经由过孔与驱动复位晶体管的源极区域及补偿晶体管的源极区域耦接,分别形成该驱动复位晶体管的第二极及该补偿晶体管的第二极。该第四连接部经由过孔与稳压晶体管的源极区域耦接,形成该稳压晶体管的第二极。该第五连接部经由过孔与驱动晶体管的栅极及存储电容的第一极耦接,该第五连接部经由过孔与稳压晶体管的漏极区域耦接,形成该稳压晶体管的第一极。该第六连接部经由过孔与第一发光控制晶体管的漏极区域耦接,形成该第一发光控制晶体管的第一极。该第七连接部经由过孔与第二发光控制晶体管的源极区域耦接,形成该第二发光控制晶体管的第二极,该第七连接部经由过孔与发光复位晶体管的源极区域耦接,形成该发光复位晶体管的第二极。以及该第八连接部经由过孔与发光复位晶体管的源极区域耦接,形成该发光复位晶体管的第一极。In an embodiment of the present disclosure, the array substrate further includes a fourth conductive layer located on a side of the third conductive layer away from the substrate and insulated from the third conductive layer, the fourth conductive layer includes a first connection portion, A second connection portion, a third connection portion, a fourth connection portion, a fifth connection portion, a sixth connection portion, a seventh connection portion, and an eighth connection portion. The first connection portion serves as a drive reset voltage line. The first connection portion is coupled to the drain region of the driving reset transistor through a via hole, and forms a first electrode of the driving reset transistor. The second connection portion is coupled to the light-emitting reset voltage line through the via hole. The third connection portion is coupled to the drain region of the data writing transistor through the via hole, and forms the first electrode of the data writing transistor. The fourth connection portion is coupled to the source region of the drive reset transistor and the source region of the compensation transistor through a via hole, and forms a second electrode of the drive reset transistor and a second electrode of the compensation transistor, respectively. The fourth connection portion is coupled to the source region of the voltage-stabilizing transistor through a via hole to form a second electrode of the voltage-stabilizing transistor. The fifth connection portion is coupled to the gate of the driving transistor and the first electrode of the storage capacitor through the via hole, and the fifth connection portion is coupled to the drain region of the voltage-stabilizing transistor through the via hole, forming the first electrode of the voltage-stabilizing transistor. one pole. The sixth connection portion is coupled to the drain region of the first light-emitting control transistor through a via hole, and forms a first electrode of the first light-emitting control transistor. The seventh connection portion is coupled to the source region of the second light-emitting control transistor through a via hole to form a second electrode of the second light-emitting control transistor, and the seventh connection portion is coupled to the source region of the light-emitting reset transistor via a via hole connected to form the second pole of the light-emitting reset transistor. And the eighth connection part is coupled with the source region of the light-emitting reset transistor through the via hole, and forms the first electrode of the light-emitting reset transistor.
在本公开的实施例中,该阵列基板进一步包括位于第四导电层背离衬底一侧的并与该第四导电层绝缘隔离的第五导电层。该第五导电层包括沿行方向设置的数据信号线、第一电源电压线、以及第二电源电压线。该数据信号线沿列方向延伸,并经由过孔与第四导电层的第三连接部耦接。In an embodiment of the present disclosure, the array substrate further includes a fifth conductive layer located on a side of the fourth conductive layer away from the substrate and insulated from the fourth conductive layer. The fifth conductive layer includes data signal lines, first power supply voltage lines, and second power supply voltage lines arranged along the row direction. The data signal line extends along the column direction and is coupled to the third connection portion of the fourth conductive layer through the via hole.
该第一电源电压线沿列方向延伸,并经由过孔与第四导电层的第三连接部耦接。以及第二电源电压线沿列方向延伸,并经由过孔与第四导电层的第七连接部耦接。The first power supply voltage line extends along the column direction and is coupled to the third connection portion of the fourth conductive layer through the via hole. and the second power supply voltage line extends along the column direction and is coupled to the seventh connection portion of the fourth conductive layer through the via hole.
根据本公开的第二方面,提供了一种显示面板。该显示面板包括根据第一方面中的任一 项的阵列基板。According to a second aspect of the present disclosure, a display panel is provided. The display panel includes the array substrate according to any one of the first aspects.
根据本公开的第三方面,提供了一种显示装置。该显示装置包括根据第二方面中的任一项的显示面板。According to a third aspect of the present disclosure, a display device is provided. The display device includes the display panel according to any one of the second aspects.
适应性的进一步的方面和范围从本文中提供的描述变得明显。应当理解,本申请的各个方面可以单独或者与一个或多个其他方面组合实施。还应当理解,本文中的描述和特定实施例旨在仅说明的目的并不旨在限制本申请的范围。Further aspects and scope of adaptability will become apparent from the description provided herein. It should be understood that various aspects of the present application may be implemented alone or in combination with one or more other aspects. It should also be understood that the description and specific examples herein are intended for purposes of illustration only and are not intended to limit the scope of the application.
附图说明Description of drawings
本文中描述的附图用于仅对所选择的实施例的说明的目的,并不是所有可能的实施方式,并且不旨在限制本申请的范围,其中:The drawings described herein are for illustrative purposes only of selected embodiments, and not all possible implementations, and are not intended to limit the scope of the application, wherein:
图1示出了根据本公开的阵列基板的示意性框图;FIG. 1 shows a schematic block diagram of an array substrate according to the present disclosure;
图2示出了根据本公开的实施例的子像素的示意性框图;FIG. 2 shows a schematic block diagram of a sub-pixel according to an embodiment of the present disclosure;
图3示出了根据本公开的实施例的图2中的像素电路的示意图;FIG. 3 shows a schematic diagram of the pixel circuit in FIG. 2 according to an embodiment of the present disclosure;
图4示出了根据本公开的实施例的驱动图3中的像素电路的信号的时序图;FIG. 4 illustrates a timing diagram of signals driving the pixel circuit in FIG. 3 according to an embodiment of the present disclosure;
图5-11示出了根据本公开的实施例的阵列基板中各层的平面示意图;5-11 illustrate schematic plan views of layers in an array substrate according to an embodiment of the present disclosure;
图12示出了包括堆叠的有源半导体层、第一导电层、第二导电层、第三导电层和第四导电层的像素电路的平面布局示意图;12 shows a schematic plan layout of a pixel circuit including a stacked active semiconductor layer, a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer;
图13示出了根据本公开的实施例的沿图12中的线A1A2截取的阵列基板的横截面结构示意图;FIG. 13 shows a schematic cross-sectional structure diagram of the array substrate taken along the line A1A2 in FIG. 12 according to an embodiment of the present disclosure;
图14示出了根据本公开的实施例的沿图12中的线A1A2截取的阵列基板的横截面结构示意图;FIG. 14 shows a schematic cross-sectional structure diagram of the array substrate taken along the line A1A2 in FIG. 12 according to an embodiment of the present disclosure;
图15示出了根据本公开的实施例的阵列基板的示意性框图;15 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure;
图16示出了根据本公开的实施例的阵列基板的示意性框图;16 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure;
图17示出了根据本公开的实施例的阵列基板的示意性框图;17 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure;
图18示出了包括堆叠的遮挡层、有源半导体层、第一导电层、第二导电层、第三导电层和第四导电层的像素电路的平面布局示意图;18 shows a schematic plan layout of a pixel circuit including a stacked blocking layer, an active semiconductor layer, a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer;
图19示出了根据本公开的实施例的显示面板的结构示意图;FIG. 19 shows a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
图20示出了根据本公开的实施例的显示装置的结构示意图;FIG. 20 shows a schematic structural diagram of a display device according to an embodiment of the present disclosure;
图21示出了根据本公开的实施例的像素电路的示意图;21 shows a schematic diagram of a pixel circuit according to an embodiment of the present disclosure;
图22示出了本公开的实施例的遮挡层的示意图;22 shows a schematic diagram of a blocking layer of an embodiment of the present disclosure;
图23示出了本公开的实施例的像素电路的平面布局;FIG. 23 shows a plan layout of a pixel circuit of an embodiment of the present disclosure;
图24示出了本公开的实施例的像素电路的平面布局;FIG. 24 shows a plan layout of a pixel circuit of an embodiment of the present disclosure;
图25示出了本公开的实施例的像素电路的平面布局;FIG. 25 shows a plan layout of a pixel circuit of an embodiment of the present disclosure;
图26示出了根据本公开的实施例的阵列基板的横截面结构示意图;FIG. 26 shows a schematic cross-sectional structure diagram of an array substrate according to an embodiment of the present disclosure;
图27为本公开阵列基板一种示例性实施例中像素驱动电路的电路结构示意图;27 is a schematic diagram of a circuit structure of a pixel driving circuit in an exemplary embodiment of the disclosed array substrate;
图28为图27像素驱动电路一种驱动方法中各节点的时序图;FIG. 28 is a timing diagram of each node in a driving method of the pixel driving circuit of FIG. 27;
图29为本公开阵列基板一种示例性实施例的结构版图;FIG. 29 is a structural layout of an exemplary embodiment of the disclosed array substrate;
图30为图29中遮光层的结构版图;Fig. 30 is the structural layout of the light shielding layer in Fig. 29;
图31为图29中第一有源层的结构版图;Fig. 31 is the structural layout of the first active layer in Fig. 29;
图32为图29中第一栅极层的结构版图;FIG. 32 is a structural layout of the first gate layer in FIG. 29;
图33为图29中第二栅极层的结构版图;FIG. 33 is a structural layout of the second gate layer in FIG. 29;
图34为图29中第二有源层的结构版图;Fig. 34 is the structural layout of the second active layer in Fig. 29;
图35为图29中第三栅极层的结构版图;FIG. 35 is a structural layout of the third gate layer in FIG. 29;
图36为图29中第一源漏层的结构版图;FIG. 36 is a structural layout of the first source-drain layer in FIG. 29;
图37为图29中遮光层、第一有源层的结构版图;Fig. 37 is the structural layout of the light shielding layer and the first active layer in Fig. 29;
图38为图29中遮光层、第一有源层、第一栅极层的结构版图;FIG. 38 is a structural layout of the light shielding layer, the first active layer, and the first gate layer in FIG. 29;
图39为图29中遮光层、第一有源层、第一栅极层、第二栅极层的结构版图;FIG. 39 is a structural layout of the light-shielding layer, the first active layer, the first gate layer, and the second gate layer in FIG. 29;
图40为图29中遮光层、第一有源层、第一栅极层、第二栅极层、第二有源层的结构版图;40 is a structural layout of the light shielding layer, the first active layer, the first gate layer, the second gate layer, and the second active layer in FIG. 29;
图41为图29中遮光层、第一有源层、第一栅极层、第二栅极层、第二有源层、第三栅极层的结构版图;41 is a structural layout of the light shielding layer, the first active layer, the first gate layer, the second gate layer, the second active layer, and the third gate layer in FIG. 29;
图42为本公开阵列基板一种示例性实施例的结构版图;FIG. 42 is a structural layout of an exemplary embodiment of the disclosed array substrate;
图43为图42中的第二源漏层的结构版图;FIG. 43 is a structural layout of the second source-drain layer in FIG. 42;
图44为本公开阵列基板一种示例性实施例的结构版图;FIG. 44 is a structural layout of an exemplary embodiment of the disclosed array substrate;
图45为图44中的第二源漏层的结构版图;FIG. 45 is a structural layout of the second source-drain layer in FIG. 44;
图46为本公开阵列基板另一种示例性实施例中第二初始信号线的结构示意图;46 is a schematic structural diagram of a second initial signal line in another exemplary embodiment of the disclosed array substrate;
图47为本公开阵列基板另一种示例性实施例中第二初始信号线的结构示意图;47 is a schematic structural diagram of a second initial signal line in another exemplary embodiment of the disclosed array substrate;
图48为图42中沿虚线B的部分剖视图。FIG. 48 is a partial cross-sectional view taken along the dotted line B in FIG. 42 .
贯穿这些附图的各个视图,相应的参考编号指示相应的部件或特征。Corresponding reference numerals indicate corresponding parts or features throughout the various views of the drawings.
具体实施方式Detailed ways
首先,需要说明的是,除非上下文中另外明确地指出,否则在本文和所附权利要求中所使用的词语的单数形式包括复数,反之亦然。因而,当提及单数时,通常包括相应术语的复数。相似地,措辞“包含”和“包括”将解释为包含在内而不是独占性地。同样地,术语“包括”和“或”应当解释为包括在内的,除非本文中另有说明。在本文中使用术语“实例”之处,特别是当其位于一组术语之后时,所述“实例”仅仅是示例性的和阐述性的,且不应当被认为是独占性的或广泛性的。First, it should be noted that unless the context clearly dictates otherwise, the singular forms of words used herein and in the appended claims include the plural and vice versa. Thus, when referring to the singular, the plural of the corresponding term is generally included. Similarly, the words "comprising" and "including" are to be construed as inclusive rather than exclusive. Likewise, the terms "including" and "or" should be construed as inclusive unless otherwise indicated herein. Where the term "instance" is used herein, particularly when it follows a group of terms, the "instance" is merely exemplary and illustrative and should not be considered exclusive or broad .
另外,还需要说明的是,当介绍本申请的元素及其实施例时,冠词“一”、“一个”、“该”和“所述”旨在表示存在一个或者多个要素;除非另有说明,“多个”的含义是两个或两个以上;用语“包含”、“包括”、“含有”和“具有”旨在包括性的并且表示可以存在除所列要素之外的另外的要素;术语“第一”、“第二”、“第三”等仅用于描述的目的,而不能理解为指示或暗示相对重要性及形成顺序。In addition, it should also be noted that when introducing elements of the present application and embodiments thereof, the articles "a," "an," "the," and "said" are intended to mean that there are one or more of the elements; unless otherwise Where stated, "plurality" means two or more; the terms "comprising", "including", "containing" and "having" are intended to be inclusive and mean that there may be additional elements other than the listed elements elements; the terms "first", "second", "third", etc. are used for descriptive purposes only and should not be construed to indicate or imply relative importance and formation order.
此外,在附图中,为了清楚起见夸大了各层的厚度及区域。应当理解的是,当提到层、区域、或组件在别的部分“上”时,指其直接位于别的部分上,或者也可能有别的组件介于其间。相反,当某个组件被提到“直接”位于别的组件上时,指并无别的组件介于其间。Further, in the drawings, the thicknesses and regions of various layers are exaggerated for clarity. It will be understood that when a layer, region, or component is referred to as being "on" another part, it means that it is directly on the other part, or other components may also be intervening. Conversely, when a component is referred to as being "directly" on top of another component, it means that no other component is in between.
在通常的阵列基板中,由同一复位电压线提供复位电压,对发光器件和像素电路进行复位。考虑像素电路的能耗水平、补偿后的显示效果,并在保持复位后的发光器件处于未点亮的状态的情况下,来设置复位电压的值。在这种情况下,像素电路的能耗和补偿后的显示效果以及复位后的发光器件的充电时间不能同时处于最优的状态,进而影响像素电路的能耗、响应速度、准确性、以及显示效果。In a general array substrate, a reset voltage is supplied from the same reset voltage line to reset the light-emitting device and the pixel circuit. The value of the reset voltage is set in consideration of the power consumption level of the pixel circuit, the display effect after compensation, and keeping the reset light-emitting device in an unlit state. In this case, the power consumption of the pixel circuit, the display effect after compensation, and the charging time of the light-emitting device after reset cannot be in an optimal state at the same time, thereby affecting the power consumption, response speed, accuracy, and display of the pixel circuit. Effect.
本公开的至少一些实施例提供一种阵列基板,该阵列基板包括两条复位电压线,驱动复位电压线和发光复位电压线。驱动复位电压线耦接驱动复位电压端以提供驱动复位电压。该发光复位电压线耦接发光复位电压端以提供发光复位电压。驱动复位电压可以考虑像素电路的能耗水平和复位效果而设置。在能耗水平相对低的情况下,对像素电路进行更彻底地复位,进而提高显示效果。发光复位电压线耦接发光复位电压端以提供发光复位电压。发光复位电压可以在刚好保持发光器件恰好不被点亮的情况下而设置,从而减少发光器件在发光之前的充电时间,进而提高像素电路对发光信号的响应速度,缩短响应时间,在概率上提高准确率。At least some embodiments of the present disclosure provide an array substrate including two reset voltage lines, a driving reset voltage line and a light emitting reset voltage line. The driving reset voltage line is coupled to the driving reset voltage terminal to provide the driving reset voltage. The light-emitting reset voltage line is coupled to the light-emitting reset voltage terminal to provide the light-emitting reset voltage. The driving reset voltage may be set in consideration of the power consumption level of the pixel circuit and the reset effect. In the case of relatively low power consumption levels, the pixel circuit is reset more thoroughly, thereby improving the display effect. The light-emitting reset voltage line is coupled to the light-emitting reset voltage terminal to provide the light-emitting reset voltage. The light-emitting reset voltage can be set just when the light-emitting device is just not lit, thereby reducing the charging time of the light-emitting device before emitting light, thereby improving the response speed of the pixel circuit to the light-emitting signal, shortening the response time, and increasing the probability Accuracy.
下面结合附图对本公开的实施例提供的阵列基板进行非限制性的说明,如下面所描述的,在不相互抵触的情况下这些具体实施例中的不同特征可以相互组合,从而得到新的实施例,这些新的实施例也都属于本公开保护的范围。The array substrate provided by the embodiments of the present disclosure is described below in a non-limiting manner with reference to the accompanying drawings. As described below, different features in these specific embodiments can be combined with each other without conflicting with each other to obtain new embodiments. For example, these new embodiments also belong to the protection scope of the present disclosure.
图1示出了根据本公开的阵列基板10的示意图。如图1所示,该阵列基板10包括衬底300以及设置在衬底300上的排布为多行多列的多个子像素SPX。该衬底可以为玻璃基板、塑料基板等。衬底300的显示区包括多个像素单元PX,每个像素单元可以包括包括多个子像素SPX,例如三个。子像素SPX被沿行方向X和列方向Y间隔设置。行方向X与列方向Y互相垂直。该子像素SPX中的至少一个包括像素电路。阵列基板10还包括驱动复位电压线和发光复位电压线。驱动复位信号线耦接驱动复位电压端,并被配置为向其提供驱动复位电压。发光复位电压线耦接发光复位电压端,并被配置为向其提供发光复位电压。将在下面参照电路图5-11对驱动复位信号线和发光复位控制信号线电压的设置和位置的布局进行详细的描述。FIG. 1 shows a schematic diagram of an array substrate 10 according to the present disclosure. As shown in FIG. 1 , the array substrate 10 includes a substrate 300 and a plurality of sub-pixels SPX arranged on the substrate 300 and arranged in multiple rows and columns. The substrate may be a glass substrate, a plastic substrate, or the like. The display area of the substrate 300 includes a plurality of pixel units PX, and each pixel unit may include a plurality of sub-pixels SPX, for example, three. The sub-pixels SPX are arranged at intervals along the row direction X and the column direction Y. The row direction X and the column direction Y are perpendicular to each other. At least one of the sub-pixels SPX includes a pixel circuit. The array substrate 10 further includes a driving reset voltage line and a light emitting reset voltage line. The driving reset signal line is coupled to the driving reset voltage terminal, and is configured to provide the driving reset voltage thereto. The light-emitting reset voltage line is coupled to the light-emitting reset voltage terminal and configured to provide the light-emitting reset voltage thereto. The layout of the settings and positions of the voltages of the drive reset signal lines and the light emission reset control signal lines will be described in detail below with reference to circuit diagrams 5-11.
在本公开的实施例中,每个像素电路包括:驱动电路、稳压电路、驱动复位电路、发光复位电路、数据写入电路、补偿电路、存储电路和发光控制电路。下面参照图2来对像素电路进行详细的描述。In the embodiment of the present disclosure, each pixel circuit includes: a driving circuit, a voltage regulator circuit, a driving reset circuit, a lighting reset circuit, a data writing circuit, a compensation circuit, a storage circuit, and a lighting control circuit. The pixel circuit will be described in detail below with reference to FIG. 2 .
图2示出了根据本公开的一些实施例的子像素的示意性框图。如图2所示,子像素SPX包括像素电路100和发光器件200。像素电路100包括:驱动电路110、稳压电路120、驱动复位电路130和发光复位电路140、数据写入电路150、补偿电路160、存储电路170和发光控制电路180。FIG. 2 shows a schematic block diagram of a sub-pixel according to some embodiments of the present disclosure. As shown in FIG. 2 , the sub-pixel SPX includes a pixel circuit 100 and a light emitting device 200 . The pixel circuit 100 includes: a driving circuit 110 , a voltage regulator circuit 120 , a driving reset circuit 130 , a lighting reset circuit 140 , a data writing circuit 150 , a compensation circuit 160 , a storage circuit 170 and a lighting control circuit 180 .
如图2所示,驱动电路110包括控制端G、第一端F和第二端S。驱动电路110被配置为在来自控制端G的控制信号的控制下,向发光器件200提供驱动电流。As shown in FIG. 2 , the driving circuit 110 includes a control terminal G, a first terminal F and a second terminal S. The driving circuit 110 is configured to provide a driving current to the light emitting device 200 under the control of a control signal from the control terminal G.
稳压电路120与驱动电路110的控制端G、第一节点N1和稳压控制信号输入端Stv耦接。稳压电路120被配置为在来自稳压控制信号输入端的稳压控制信号的控制下使驱动电路110的控制端G与第一节点N1导通。The voltage-stabilizing circuit 120 is coupled to the control terminal G of the driving circuit 110 , the first node N1 and the voltage-stabilizing control signal input terminal Stv. The voltage-stabilizing circuit 120 is configured to conduct the control terminal G of the driving circuit 110 with the first node N1 under the control of the voltage-stabilizing control signal from the voltage-stabilizing control signal input terminal.
驱动复位电路130耦接驱动复位控制信号输入端Rst1、第一节点N1和驱动复位电压端Vinit1。驱动复位电路130被配置为在来自驱动复位控制信号输入端Rst1的驱动复位控制信号的控制下将来自驱动复位电压端Vinit1的驱动复位电压提供给稳压电路120,以对驱动电路110的控制端G进行复位。The driving reset circuit 130 is coupled to the driving reset control signal input terminal Rst1 , the first node N1 and the driving reset voltage terminal Vinit1 . The driving reset circuit 130 is configured to provide the driving reset voltage from the driving reset voltage terminal Vinit1 to the voltage regulator circuit 120 under the control of the driving reset control signal from the driving reset control signal input terminal Rst1, so as to control the control terminal of the driving circuit 110. G to reset.
发光复位电路140耦接发光复位控制信号输入端Rst2、发光器件200、发光复位电压端Vinit2。进一步地,发光复位电路140还与发光控制电路180耦接。发光复位电路140被配置为在来自发光复位控制信号输入端Rst2的发光复位控制信号的控制下将来自发光复位电压端Vinit2的发光复位电压提供给发光器件200,以对发光器件200的阳极进行复位。The light-emitting reset circuit 140 is coupled to the light-emitting reset control signal input terminal Rst2, the light-emitting device 200, and the light-emitting reset voltage terminal Vinit2. Further, the light-emitting reset circuit 140 is also coupled to the light-emitting control circuit 180 . The light emitting reset circuit 140 is configured to supply the light emitting reset voltage from the light emitting reset voltage terminal Vinit2 to the light emitting device 200 under the control of the light emitting reset control signal from the light emitting reset control signal input terminal Rst2 to reset the anode of the light emitting device 200 .
数据写入电路150耦接数据信号输入端Data、扫描信号输入端Gate和驱动电路110的第一端F。数据写入电路150被配置为在来自扫描信号输入端Gate的扫描信号的控制下将来自数据信号输入端Data的数据信号提供给驱动电路110的第一端F。The data writing circuit 150 is coupled to the data signal input terminal Data, the scan signal input terminal Gate and the first terminal F of the driving circuit 110 . The data writing circuit 150 is configured to supply the data signal from the data signal input terminal Data to the first terminal F of the driving circuit 110 under the control of the scan signal from the scan signal input terminal Gate.
补偿电路160耦接驱动电路110的第二端S、第一节点N1和补偿控制信号输入端Com。补偿电路160被配置为根据来自补偿控制信号输入端Com的补偿控制信号,对驱动电路110进行阈值补偿。The compensation circuit 160 is coupled to the second end S of the driving circuit 110 , the first node N1 and the compensation control signal input end Com. The compensation circuit 160 is configured to perform threshold compensation on the driving circuit 110 according to the compensation control signal from the compensation control signal input terminal Com.
在本公开的实施例中,来自扫描信号输入端Gate的扫描信号与来自补偿控制信号输入端Com的补偿控制信号可以是同一信号。In the embodiment of the present disclosure, the scan signal from the scan signal input terminal Gate and the compensation control signal from the compensation control signal input terminal Com may be the same signal.
存储电路170耦接第一电源电压端VDD和驱动电路110的控制端G。存储电路170被配置为存储第一电源电压端VDD与驱动电路110的控制端G之间的电压差。The storage circuit 170 is coupled to the first power supply voltage terminal VDD and the control terminal G of the driving circuit 110 . The storage circuit 170 is configured to store the voltage difference between the first power supply voltage terminal VDD and the control terminal G of the driving circuit 110 .
发光控制电路180耦接发光控制信号输入端EM、第一电源电压端VDD、驱动电路110的第一端F及第二端S、发光复位电路140、以及发光器件200。发光控制电路180被配置为在来自发光控制信号输入端EM的发光控制信号的控制下将来自第一电源电压端VDD的第一电源电压施加至驱动电路110,并将驱动电路110产生的驱动电流施加至发光器件200。The lighting control circuit 180 is coupled to the lighting control signal input terminal EM, the first power supply voltage terminal VDD, the first terminal F and the second terminal S of the driving circuit 110 , the lighting reset circuit 140 , and the lighting device 200 . The lighting control circuit 180 is configured to apply the first power supply voltage from the first power supply voltage terminal VDD to the driving circuit 110 under the control of the lighting control signal from the lighting control signal input terminal EM, and to apply the driving current generated by the driving circuit 110 applied to the light emitting device 200 .
在本公开的一些实施例中,来自发光复位控制信号输入端Rst2的发光复位控制信号与来自发光控制信号输入端EM的发光控制信号可以是同一信号。In some embodiments of the present disclosure, the lighting reset control signal from the lighting reset control signal input terminal Rst2 and the lighting control signal from the lighting control signal input terminal EM may be the same signal.
附加地或替换地,在本公开的一些实施例中,来自发光复位控制信号输入端Rst2的发光复位控制信号与来自扫描信号输入端Gate的扫描信号可以是同一信号。Additionally or alternatively, in some embodiments of the present disclosure, the light emission reset control signal from the light emission reset control signal input terminal Rst2 and the scan signal from the scan signal input terminal Gate may be the same signal.
发光器件200与第二电源电压端VSS、发光复位电路140、发光控制电路180耦接。发光器件200被配置为在驱动电路110产生的驱动电流的驱动下发光。例如,发光器件200可以为发光二极管等。发光二极管可以为有机发光二极管(OLED)或量子点发光二极管(QLED)等。The light-emitting device 200 is coupled to the second power supply voltage terminal VSS, the light-emitting reset circuit 140 and the light-emitting control circuit 180 . The light emitting device 200 is configured to emit light under the driving of the driving current generated by the driving circuit 110 . For example, the light emitting device 200 may be a light emitting diode or the like. The light emitting diode may be an organic light emitting diode (OLED), a quantum dot light emitting diode (QLED), or the like.
在本公开的实施例中,稳压控制信号、扫描信号、驱动复位控制信号、发光复位控制信号、补偿控制信号、发光控制信号、补偿控制信号可以是方波,高电平的取值范围可以为0~15V,低电平的取值范围为0~-15V,例如,高电平是7V,低电平是-7V。数据信号的取值范围可以为0~8V,例如2~5V。第一电源电压Vdd的取值范围可以为3~6V。第二电源电压Vss的取值范围可以为0~-6V。In the embodiment of the present disclosure, the voltage regulation control signal, the scan signal, the drive reset control signal, the light emission reset control signal, the compensation control signal, the light emission control signal, and the compensation control signal may be square waves, and the value range of the high level may be It is 0~15V, and the value range of the low level is 0~-15V. For example, the high level is 7V, and the low level is -7V. The value range of the data signal may be 0 to 8V, for example, 2 to 5V. The value range of the first power supply voltage Vdd may be 3-6V. The value range of the second power supply voltage Vss may be 0-6V.
图3示出了图2中的像素电路100的示意图。如图3所示,驱动电路110包括驱动晶体管T1,稳压电路120包括稳压晶体管T2,驱动复位电路130包括驱动复位晶体管T3,发光复位电路140包括发光复位晶体管T4,数据写入电路150包括数据写入晶体管T5,补偿电路160包括补偿晶体管T6,存储电路170包括存储电容C,发光控制电路180包括第一发光控制晶体管T7和第二发光控制晶体管T8。FIG. 3 shows a schematic diagram of the pixel circuit 100 in FIG. 2 . As shown in FIG. 3 , the driving circuit 110 includes a driving transistor T1, the voltage-stabilizing circuit 120 includes a voltage-stabilizing transistor T2, the driving reset circuit 130 includes a driving reset transistor T3, the light-emitting reset circuit 140 includes a light-emitting reset transistor T4, and the data writing circuit 150 includes The data is written into the transistor T5, the compensation circuit 160 includes a compensation transistor T6, the storage circuit 170 includes a storage capacitor C, and the light emission control circuit 180 includes a first light emission control transistor T7 and a second light emission control transistor T8.
如图3所示,驱动晶体管T1的第一极与驱动电路110的第一端F耦接,驱动晶体管T1的第二极与驱动电路110的第二端S耦接,驱动晶体管T1的栅极与驱动电路110的控制端G耦接。As shown in FIG. 3 , the first pole of the driving transistor T1 is coupled to the first terminal F of the driving circuit 110 , the second pole of the driving transistor T1 is coupled to the second terminal S of the driving circuit 110 , and the gate of the driving transistor T1 is It is coupled to the control terminal G of the driving circuit 110 .
稳压晶体管T2的第一极与驱动电路110的控制端G耦接,稳压晶体管T2的栅极与稳压控制信号输入端Stv耦接,稳压晶体管T2的第二极与第一节点N1耦接。The first pole of the voltage-stabilizing transistor T2 is coupled to the control terminal G of the driving circuit 110 , the gate of the voltage-stabilizing transistor T2 is coupled to the voltage-stabilizing control signal input terminal Stv, and the second electrode of the voltage-stabilizing transistor T2 is connected to the first node N1 coupled.
驱动复位晶体管T3的第一极与驱动复位电压端Vinit1耦接,驱动复位晶体管T3的栅极与驱动复位控制信号输入端Rst1耦接,驱动复位晶体管T3的第二极与第一节点耦接N1。The first pole of the drive reset transistor T3 is coupled to the drive reset voltage terminal Vinit1, the gate of the drive reset transistor T3 is coupled to the drive reset control signal input terminal Rst1, and the second pole of the drive reset transistor T3 is coupled to the first node N1 .
发光复位晶体管T4的第一极与发光复位电压端Vinit2耦接,发光复位晶体管T4的栅极与发光复位控制信号输入端Rst2耦接,发光复位晶体管T4的第二极与发光器件200的阳极耦接。进一步地,发光复位晶体管T4的第二极还与第二发光控制晶体管T8的第二极耦接。The first pole of the light emitting reset transistor T4 is coupled to the light emitting reset voltage terminal Vinit2, the gate of the light emitting reset transistor T4 is coupled to the light emitting reset control signal input terminal Rst2, and the second pole of the light emitting reset transistor T4 is coupled to the anode of the light emitting device 200 catch. Further, the second pole of the light-emitting reset transistor T4 is also coupled to the second pole of the second light-emitting control transistor T8.
数据写入晶体管T5的第一极与数据信号输入端Data耦接,数据写入晶体管T5的栅极与扫描信号输入端Gate耦接,数据写入晶体管T5的第二极与驱动电路110的第一端F耦接。The first pole of the data writing transistor T5 is coupled to the data signal input terminal Data, the gate of the data writing transistor T5 is coupled to the scanning signal input terminal Gate, and the second pole of the data writing transistor T5 is coupled to the first pole of the driving circuit 110 . One end F is coupled.
补偿晶体管T6的第一极与驱动电路110的第二端S耦接,补偿晶体管T6的栅极与补偿控制信号输入端Com耦接,补偿晶体管T6的第二极与第一节点N1耦接。The first electrode of the compensation transistor T6 is coupled to the second end S of the driving circuit 110, the gate of the compensation transistor T6 is coupled to the compensation control signal input end Com, and the second electrode of the compensation transistor T6 is coupled to the first node N1.
存储电容C的第一极耦接第一电源电压端VDD,存储电容C的第二极耦接驱动电路110的控制端G。该存储电容被配置为存储第一电源电压端VDD与驱动电路110的控制端G之间的电压差。The first pole of the storage capacitor C is coupled to the first power supply voltage terminal VDD, and the second pole of the storage capacitor C is coupled to the control terminal G of the driving circuit 110 . The storage capacitor is configured to store the voltage difference between the first power supply voltage terminal VDD and the control terminal G of the driving circuit 110 .
第一发光控制晶体管T7的第一极与第一电源电压端VDD耦接,第一发光控制晶体管T7的栅极与发光控制信号输入端EM耦接,第一发光控制晶体管T7的第二极与驱动电路110的第一端F耦接。The first electrode of the first light-emitting control transistor T7 is coupled to the first power supply voltage terminal VDD, the gate of the first light-emitting control transistor T7 is coupled to the light-emitting control signal input end EM, and the second electrode of the first light-emitting control transistor T7 is coupled to the light-emitting control signal input end EM. The first end F of the driving circuit 110 is coupled.
第二发光控制晶体管T8的第一极与驱动电路110的第二端S耦接,第二发光控制晶体管T8的栅极与发光控制信号输入端EM耦接,第二发光控制晶体管T8的第二极与发光器件200的阳极耦接。The first electrode of the second light-emitting control transistor T8 is coupled to the second end S of the driving circuit 110 , the gate of the second light-emitting control transistor T8 is coupled to the light-emitting control signal input end EM, and the second light-emitting control transistor T8 The pole is coupled to the anode of the light emitting device 200 .
在本公开的实施例中,稳压晶体管T2和发光复位晶体管T4的有源层可以包括氧化物半导体材料,例如金属氧化物半导体材料。驱动晶体管T1、驱动复位晶体管T3、数据写入晶体管T5、补偿晶体管T6、第一发光控制晶体管T7和第二发光控制晶体管T8的有源层可以包括硅半导体材料。In an embodiment of the present disclosure, the active layers of the voltage-stabilizing transistor T2 and the light-emitting reset transistor T4 may include oxide semiconductor materials, such as metal oxide semiconductor materials. Active layers of the driving transistor T1, the driving reset transistor T3, the data writing transistor T5, the compensation transistor T6, the first light emission control transistor T7 and the second light emission control transistor T8 may include silicon semiconductor materials.
在本公开的实施例中,在发光复位控制信号与发光控制信号可以是同一信号的情况下,发光复位晶体管T4与第一发光控制晶体管T7和第二发光控制晶体管T8可以是不同类型的晶体管。例如,发光复位晶体管T4可以是N型晶体管,而第一发光控制晶体管T7和第二发光控制晶体管T8可以是P型晶体管。稳压晶体管T2可以是N型晶体管。驱动晶体管T1、驱动复位晶体管T3、数据写入晶体管T5、补偿晶体管T6可以是P型晶体管。In the embodiment of the present disclosure, in the case that the light emission reset control signal and the light emission control signal may be the same signal, the light emission reset transistor T4 and the first light emission control transistor T7 and the second light emission control transistor T8 may be different types of transistors. For example, the light-emission reset transistor T4 may be an N-type transistor, and the first light-emission control transistor T7 and the second light-emission control transistor T8 may be P-type transistors. The stabilizing transistor T2 may be an N-type transistor. The driving transistor T1, the driving reset transistor T3, the data writing transistor T5, and the compensation transistor T6 may be P-type transistors.
在本公开的实施例中,在发光复位控制信号与发光控制信号可以是同一信号的情况下,发光复位晶体管T4与数据写入晶体管T5是相同类型的晶体管。例如,发光复位晶体管T4和数据写入晶体管T5可以是P型晶体管。稳压晶体管T2可以是N型晶体管。驱动晶体管T1、驱动复位晶体管T3、补偿晶体管T6、第一发光控制晶体管T7和第二发光控制晶体管T8可以是P型晶体管。In the embodiment of the present disclosure, in the case where the light-emitting reset control signal and the light-emitting control signal may be the same signal, the light-emitting reset transistor T4 and the data writing transistor T5 are transistors of the same type. For example, the light-emitting reset transistor T4 and the data writing transistor T5 may be P-type transistors. The stabilizing transistor T2 may be an N-type transistor. The driving transistor T1, the driving reset transistor T3, the compensation transistor T6, the first light emission control transistor T7 and the second light emission control transistor T8 may be P-type transistors.
此外,需要说明的是,在本公开的实施例中采用的晶体管均可以为P型晶体管或N型晶体管,只需将选定类型的晶体管的各极参照本公开的实施例中的相应晶体管的各极相应连接,并且使相应的电压端提供对应的高电压或低电压即可。例如,对于N型晶体管,其输入端为漏极而输出端为源极,其控制端为栅极;对于P型晶体管,其输入端为源极而输出端为漏极,其控制端为栅极。对于不同类型的晶体管,其控制端的控制信号的电平也不相同。例如,对于N型晶体管,在控制信号为高电平时,该N型晶体管处于导通状态;而在控制信号为低电平时,N型晶体管处于截止状态。对于P型晶体管时,在控制信号为低电平时,该P型晶体管处于导通状态;而在控制信号为高电平时,P型晶体管处于截止状态。氧化物半导体可以包括例如氧化铟镓锌(Indium Gallium Zinc Oxide,IGZO)。硅半导体材料可以包括低温多晶硅(Low Temperature Poly Silicon,LTPS)或非晶硅(例如氢化非晶硅)。低温多晶硅通常指由非晶硅结晶得到多晶硅的结晶温度低于600摄氏度的情形。In addition, it should be noted that the transistors used in the embodiments of the present disclosure can all be P-type transistors or N-type transistors, and it is only necessary to refer to the respective poles of the transistors of the selected type with reference to the corresponding transistors in the embodiments of the present disclosure. Each pole is connected correspondingly, and the corresponding high voltage or low voltage can be provided at the corresponding voltage terminal. For example, for an N-type transistor, its input is the drain and the output is the source, and its control is the gate; for a P-type transistor, its input is the source and the output is the drain, and its control is the gate pole. For different types of transistors, the level of the control signal at the control terminal is also different. For example, for an N-type transistor, when the control signal is at a high level, the N-type transistor is in an on state; and when the control signal is at a low level, the N-type transistor is in an off state. For a P-type transistor, when the control signal is at a low level, the P-type transistor is in an on state; and when the control signal is at a high level, the P-type transistor is in an off state. The oxide semiconductor may include, for example, Indium Gallium Zinc Oxide (IGZO). The silicon semiconductor material may include low temperature polysilicon (LTPS) or amorphous silicon (eg hydrogenated amorphous silicon). Low temperature polysilicon generally refers to the case where the crystallization temperature of polysilicon obtained by crystallization of amorphous silicon is lower than 600 degrees Celsius.
另外,需要说明的是,在本公开的实施例中,子像素的像素电路除了可以为图4所示的8T1C(即八个晶体管和一个电容)结构之外,还可以为包括其他数量的晶体管的结构,如8T2C结构、7T1C结构、7T2C结构、6T1C结构、6T2C结构或者9T2C结构,本公开实施例对此不作限定。In addition, it should be noted that, in the embodiments of the present disclosure, the pixel circuit of the sub-pixel may include other numbers of transistors in addition to the 8T1C (ie, eight transistors and one capacitor) structure shown in FIG. 4 . , such as an 8T2C structure, a 7T1C structure, a 7T2C structure, a 6T1C structure, a 6T2C structure, or a 9T2C structure, which is not limited in this embodiment of the present disclosure.
图4为驱动图3中的像素电路的信号的时序图。如图3所示,像素电路100的工作过程包括三个阶段,分别为第一阶段P1、第二阶段P2以及第三阶段P3。FIG. 4 is a timing diagram of signals driving the pixel circuit of FIG. 3 . As shown in FIG. 3 , the working process of the pixel circuit 100 includes three stages, namely a first stage P1 , a second stage P2 and a third stage P3 .
下面以发光复位控制信号与发光控制信号是同一信号,稳压控制信号与扫描信号是同一信号,稳压晶体管T2和发光复位晶体管T4是N型晶体管,驱动晶体管T1、驱动复位晶体管T3、数据写入晶体管T5、补偿晶体管T6、第一发光控制晶体管T7和第二发光控制晶体管T8是P型晶体管为例,结合图3对图4中的像素电路的工作过程进行说明。The light-emitting reset control signal and the light-emitting control signal are the same signal, the voltage-stabilizing control signal and the scanning signal are the same signal, the voltage-stabilizing transistor T2 and the light-emitting reset transistor T4 are N-type transistors, the driving transistor T1, the driving reset transistor T3, the data writing Taking the input transistor T5 , the compensation transistor T6 , the first light emission control transistor T7 and the second light emission control transistor T8 as P-type transistors as an example, the working process of the pixel circuit in FIG. 4 will be described with reference to FIG. 3 .
如图4所示,在第一阶段P1,输入低电平的驱动复位控制信号RST、高电平的扫描信号GA、高电平的发光控制信号EMS、高电平的稳压控制信号STV和低电平的数据信号DA。如图4所示,发光控制信号EMS的上升沿要早于第一阶段P1的起始点,即早于稳压控制信号STV的上升沿。As shown in FIG. 4, in the first stage P1, a low-level drive reset control signal RST, a high-level scan signal GA, a high-level light-emitting control signal EMS, a high-level voltage stabilization control signal STV and Low level data signal DA. As shown in FIG. 4 , the rising edge of the lighting control signal EMS is earlier than the starting point of the first stage P1 , that is, earlier than the rising edge of the voltage regulation control signal STV.
在第一阶段P1,驱动复位晶体管T3的栅极接收到低电平的驱动复位控制信号RST,驱动复位晶体管T3导通,从而将驱动复位电压VINT1施加至第一节点N1。稳压晶体管的T2的栅极接收到高电平的稳压控制信号STV,稳压晶体管T2导通,从而将第一节点N1处的驱动复位电压VINT1施加至驱动晶体管T1的栅极,以对驱动晶体管T1的栅极进行复位,从而使驱动晶体管T1为第二阶段P2数据的写入做好准备。在本公开的实施例中,驱动复位电压VINT1的值可以被设置为更低,例如,与第一电源电压Vdd反向的电压更大,以使在第二阶段中驱动晶体管T1的栅极与第一极的电压的差值更大,从而加快在第二阶段的数据写入和补偿的过程。需要注意的是,驱动复位电压VINT1对驱动晶体管T1的影响,随着驱动复位电压VINT1的反向增大,效果趋于饱和。数据写入和补偿的过程将在下面第二阶段P2中进行描述。另外,在第一阶段P1,存储电容C的一极的电压为第一电源电压Vdd,另一极的电压为驱动复位电 压VINT1,存储电容C被充电。在本公开的实施例中,考虑到驱动复位电压VINT1对数据写入和补偿及关于存储电容C的充电的电路能耗的影响以及电源的硬件限制,驱动复位电压VINT1的取值范围可以是-1~-5V,例如,-3V。这可以在保持电路的能耗较低的情况下,缩短数据写入和补偿所需的时间,从而改善在固定时间段,例如第二阶段P2,期间的补偿效果,进而提高显示效果。In the first phase P1, the gate of the driving reset transistor T3 receives the low level driving reset control signal RST, and the driving reset transistor T3 is turned on, thereby applying the driving reset voltage VINT1 to the first node N1. The gate of the voltage-stabilizing transistor T2 receives a high-level voltage-stabilizing control signal STV, and the voltage-stabilizing transistor T2 is turned on, thereby applying the driving reset voltage VINT1 at the first node N1 to the gate of the driving transistor T1 to The gate of the driving transistor T1 is reset, so that the driving transistor T1 is ready for the writing of the data of the second stage P2. In the embodiment of the present disclosure, the value of the driving reset voltage VINT1 may be set to be lower, eg, the voltage opposite to the first power supply voltage Vdd is larger, so that the gate of the driving transistor T1 and the The difference between the voltages of the first poles is larger, thereby speeding up the process of data writing and compensation in the second stage. It should be noted that the influence of the driving reset voltage VINT1 on the driving transistor T1 tends to be saturated as the driving reset voltage VINT1 increases in the reverse direction. The process of data writing and compensation will be described in the second stage P2 below. In addition, in the first stage P1, the voltage of one pole of the storage capacitor C is the first power supply voltage Vdd, and the voltage of the other pole is the drive reset voltage VINT1, and the storage capacitor C is charged. In the embodiment of the present disclosure, considering the influence of the driving reset voltage VINT1 on data writing and compensation and circuit energy consumption related to the charging of the storage capacitor C and the hardware limitation of the power supply, the value range of the driving reset voltage VINT1 may be − 1 to -5V, for example, -3V. This can shorten the time required for data writing and compensation while keeping the power consumption of the circuit low, thereby improving the compensation effect during a fixed time period, such as the second stage P2, and thus improving the display effect.
在第一阶段P1,发光复位晶体管T4的栅极接收高电平的发光控制信号EMS,发光复位晶体管T4导通,从而将发光复位电压VINT2施加至OLED的阳极以对OLED的阳极进行复位,以使得OLED在第三阶段P3之前不发光。在本公开的实施例中,发光复位电压VINT2的值被设置为使OLED处于恰好不发光的状态,即,OLED被正向偏置到接近开启的状态。具体地,在第二电源电压Vss的范围为0~-6V的情况下,发光复位电压VINT2的取值范围可以是-2~-6V,例如,等于第二电源电压Vss,为0~-6V。这可以降低OLED在开启前的PN结充电时间,降低OLED对发光信号的响应时间。在所需亮度一致的情况下,减少OLED亮度出现差别的概率。因此,可以提高亮度均一性,降低低频的Flicker和低灰阶的Mura。In the first stage P1, the gate of the light-emitting reset transistor T4 receives a high-level light-emitting control signal EMS, and the light-emitting reset transistor T4 is turned on, so that the light-emitting reset voltage VINT2 is applied to the anode of the OLED to reset the anode of the OLED to So that the OLED does not emit light before the third stage P3. In an embodiment of the present disclosure, the value of the light emission reset voltage VINT2 is set such that the OLED is in a state where it is just not emitting light, ie, the OLED is forward biased to a near-on state. Specifically, when the range of the second power supply voltage Vss is 0 to -6V, the value range of the light-emitting reset voltage VINT2 may be -2 to -6V, for example, equal to the second power supply voltage Vss, which is 0 to -6V . This can reduce the charging time of the PN junction before the OLED is turned on, and reduce the response time of the OLED to the light-emitting signal. When the required brightness is consistent, the probability of OLED brightness differences is reduced. Therefore, the uniformity of brightness can be improved, and the low frequency Flicker and the low grayscale Mura can be reduced.
此外,在第一阶段P1,数据写入晶体管T5的栅极接收到高电平的扫描信号GA,数据写入晶体管T5截止。补偿晶体管T6的栅极接收到高电平的扫描信号GA,补偿晶体管T6截止。第一发光控制晶体管T7的栅极接收到高电平的发光控制信号EMS,第一发光控制晶体管T7截止。第二发光控制晶体管T8的栅极接收到高电平的发光控制信号EMS,第二发光控制晶体管T8截止。In addition, in the first stage P1, the gate of the data writing transistor T5 receives the high-level scan signal GA, and the data writing transistor T5 is turned off. The gate of the compensation transistor T6 receives the high-level scan signal GA, and the compensation transistor T6 is turned off. The gate of the first light-emitting control transistor T7 receives the high-level light-emitting control signal EMS, and the first light-emitting control transistor T7 is turned off. The gate of the second light-emitting control transistor T8 receives the high-level light-emitting control signal EMS, and the second light-emitting control transistor T8 is turned off.
在第二阶段P2,输入高电平的驱动复位控制信号RST,低电平的扫描信号GA、高电平的发光控制信号EMS、高电平的稳压控制信号STV和高电平的数据信号DA。In the second stage P2, a high-level drive reset control signal RST, a low-level scan signal GA, a high-level light-emitting control signal EMS, a high-level voltage regulation control signal STV and a high-level data signal are input. DA.
在第二阶段P2,数据写入晶体管T5的栅极接收到低电平的扫描信号GA,数据写入晶体管T5导通,从而将高电平数据信号DA写入驱动晶体管T1的第一极,即驱动电路110的第一端F。补偿晶体管T6的栅极接收到低电平的扫描信号GA,补偿晶体管T3导通,从而将第一端F的高电平数据信号DA写入第一节点N1。稳压晶体管T2的栅极接收高电平的稳压控制信号STV,稳压晶体管T2导通,从而将第一节点N1的高电平数据信号DA写入驱动晶体管T1的栅极,即驱动电路110的控制端G。由于数据写入晶体管T5、驱动晶体管T1、补偿晶体管T6和稳压晶体管T2均导通,所以数据信号DA经过数据写入晶体管T5、驱动晶体管T1、补偿晶体管T6和稳压晶体管T2对存储电容C再次进行充电,也就是对驱动晶体管T1的栅极进行充电,即控制端G进行充电,因此驱动晶体管T1的栅极的电压逐渐升高。In the second stage P2, the gate of the data writing transistor T5 receives the low-level scan signal GA, and the data writing transistor T5 is turned on, thereby writing the high-level data signal DA to the first pole of the driving transistor T1, That is, the first terminal F of the driving circuit 110 . The gate of the compensation transistor T6 receives the low-level scan signal GA, and the compensation transistor T3 is turned on, thereby writing the high-level data signal DA of the first terminal F into the first node N1. The gate of the voltage-stabilizing transistor T2 receives the high-level voltage-stabilizing control signal STV, and the voltage-stabilizing transistor T2 is turned on, thereby writing the high-level data signal DA of the first node N1 into the gate of the driving transistor T1, that is, the driving circuit The control terminal G of 110. Since the data writing transistor T5, the driving transistor T1, the compensation transistor T6 and the voltage-stabilizing transistor T2 are all turned on, the data signal DA passes through the data-writing transistor T5, the driving transistor T1, the compensation transistor T6 and the voltage-stabilizing transistor T2 to the storage capacitor C Charging is performed again, that is, the gate of the driving transistor T1 is charged, that is, the control terminal G is charged, so the voltage of the gate of the driving transistor T1 is gradually increased.
可以理解,在第二阶段P2,由于数据写入晶体管T5导通,第一端F的电压保持为Vda。同时,根据驱动晶体管T1自身的特性,当控制端G的电压升高至Vda+Vth时,驱动晶体管T1截止,充电过程结束。这里,Vda表示数据信号DA的电压,Vth表示驱动晶体管T1的阈值电压。由于在本实施例中驱动晶体管T1是以P型晶体管为例进行说明的,所以此处阈值电压Vth可以是负值。It can be understood that, in the second stage P2, since the data writing transistor T5 is turned on, the voltage of the first terminal F remains at Vda. Meanwhile, according to the characteristics of the driving transistor T1, when the voltage of the control terminal G rises to Vda+Vth, the driving transistor T1 is turned off, and the charging process ends. Here, Vda represents the voltage of the data signal DA, and Vth represents the threshold voltage of the driving transistor T1. Since the driving transistor T1 is described by taking a P-type transistor as an example in this embodiment, the threshold voltage Vth here may be a negative value.
经过第二阶段P2后,驱动晶体管T1的栅极的电压为Vda+Vth,也就是说数据信号DA和阈值电压Vth的电压信息被存储在存储电容C中,以用于后续在第三阶段P3时,对驱动晶体管T1的阈值电压进行补偿。After the second stage P2, the voltage of the gate of the driving transistor T1 is Vda+Vth, that is to say, the voltage information of the data signal DA and the threshold voltage Vth is stored in the storage capacitor C for subsequent use in the third stage P3 , the threshold voltage of the driving transistor T1 is compensated.
此外,在第二阶段P2,驱动复位晶体管T3的栅极接收到高电平的驱动复位控制信号RST,驱动复位晶体管T3截止。发光复位晶体管T4的栅极接收到高电平的发光复位控制信号EMS,发光复位晶体管T4截止。第一发光控制晶体管T7的栅极接收到高电平的发光控制信号EMS,第一发光控制晶体管T7截止;第二发光控制晶体管T8的栅极接收到高电平的发光控制信号EMS,第二发光控制晶体管T8截止。In addition, in the second phase P2, the gate of the drive reset transistor T3 receives the drive reset control signal RST of a high level, and the drive reset transistor T3 is turned off. The gate of the light-emitting reset transistor T4 receives a high-level light-emitting reset control signal EMS, and the light-emitting reset transistor T4 is turned off. The gate of the first light-emitting control transistor T7 receives the high-level light-emitting control signal EMS, and the first light-emitting control transistor T7 is turned off; the gate of the second light-emitting control transistor T8 receives the high-level light-emitting control signal EMS, and the second light-emitting control transistor T8 receives the high-level light-emitting control signal EMS. The light emission control transistor T8 is turned off.
在第三阶段P3,输入高电平的驱动复位控制信号RST,高电平的扫描信号GA、低电平的发光控制信号EMS、低电平的稳压控制信号STV和低电平的数据信号DA。如图4所示,在本公开的实施例中,低电平的发光控制信号EMS可以是低电平有效的脉宽调制信号。如图4所 示,发光控制信号EMS的下降沿要晚于第二阶段P1的结束点,即晚于稳压控制信号STV的下降沿。In the third stage P3, a high-level drive reset control signal RST, a high-level scan signal GA, a low-level light-emitting control signal EMS, a low-level voltage regulation control signal STV and a low-level data signal are input. DA. As shown in FIG. 4 , in an embodiment of the present disclosure, the low-level lighting control signal EMS may be a low-level active pulse width modulation signal. As shown in Figure 4, the falling edge of the lighting control signal EMS is later than the end point of the second phase P1, that is, later than the falling edge of the voltage regulation control signal STV.
在第三阶段P3,第一发光控制晶体管T7的栅极接收到发光控制信号EMS。根据本公开的实施例,该发光控制信号EMS可是脉宽调制的。在发光控制信号EMS为低电平时,第一发光控制晶体管T7导通,从而将第一电源电压Vdd施加至第一端F。第二发光控制晶体管T8的栅极接收到发光控制信号EMS。在发光控制信号EMS为低电平时,第二发光控制晶体管T8导通,从而将驱动晶体管T1产生的驱动电流施加至OLED的阳极。In the third stage P3, the gate of the first light-emitting control transistor T7 receives the light-emitting control signal EMS. According to an embodiment of the present disclosure, the lighting control signal EMS may be pulse width modulated. When the light emission control signal EMS is at a low level, the first light emission control transistor T7 is turned on, so that the first power supply voltage Vdd is applied to the first terminal F. As shown in FIG. The gate of the second light emission control transistor T8 receives the light emission control signal EMS. When the light emission control signal EMS is at a low level, the second light emission control transistor T8 is turned on, thereby applying the driving current generated by the driving transistor T1 to the anode of the OLED.
此外,在第三阶段P3,稳压晶体管T2的栅极接收到低电平的稳压控制信号Stv,稳压晶体管T2截止。如上所述,稳压晶体管T2的有源层包括氧化物半导体材料,其漏电流为10-16到10-19A。与单栅的低温多晶硅晶体管和双栅的低温多晶硅晶体管相比,漏电流较小,从而可以进一步减少存储电路的电泄漏以提高亮度的均一性。In addition, in the third stage P3, the gate of the voltage-stabilizing transistor T2 receives the voltage-stabilizing control signal Stv of a low level, and the voltage-stabilizing transistor T2 is turned off. As described above, the active layer of the voltage-stabilizing transistor T2 includes an oxide semiconductor material, and the leakage current thereof is 10-16 to 10-19A. Compared with the single-gate low-temperature polysilicon transistor and the double-gate low-temperature polysilicon transistor, the leakage current is smaller, so that the electrical leakage of the memory circuit can be further reduced to improve the uniformity of brightness.
此外,在第三阶段P3,发光复位晶体管T4的栅极接收到发光控制信号EMS。在发光控制信号EMS为高电平时,发光复位晶体管T4导通。将发光复位电压提供给OLED的阳极,以对OLED的阳极进行复位。在发光控制信号EMS为脉宽调制信号的情况下,这可以使得在OLED在发光控制信号EMS的控制下的每次发光之前,都能够对OLED的阳极进行复位,从而可以进一步提高亮度的均一性。In addition, in the third stage P3, the gate of the light-emitting reset transistor T4 receives the light-emitting control signal EMS. When the light emission control signal EMS is at a high level, the light emission reset transistor T4 is turned on. A light emission reset voltage is supplied to the anode of the OLED to reset the anode of the OLED. In the case where the light emission control signal EMS is a pulse width modulation signal, this can enable the anode of the OLED to be reset before each light emission of the OLED under the control of the light emission control signal EMS, thereby further improving the uniformity of brightness .
另外,驱动复位晶体管T3的栅极接收到高电平的驱动复位控制信号RST,驱动复位晶体管T3截止。数据写入晶体管T5的栅极接收到高电平的扫描信号GA,数据写入晶体管T5截止。补偿晶体管T6的栅极接收到高电平的扫描信号GA,补偿晶体管T6截止。In addition, the gate of the drive reset transistor T3 receives the drive reset control signal RST of a high level, and the drive reset transistor T3 is turned off. The gate of the data writing transistor T5 receives the high-level scan signal GA, and the data writing transistor T5 is turned off. The gate of the compensation transistor T6 receives the high-level scan signal GA, and the compensation transistor T6 is turned off.
容易理解,在第三阶段P3,由于第一发光控制晶体管T7导通,第一端F的电压为第一电源电压Vdd,而控制端G的电压为Vda+Vth,所以驱动晶体管T1也导通。It is easy to understand that in the third stage P3, since the first light-emitting control transistor T7 is turned on, the voltage of the first terminal F is the first power supply voltage Vdd, and the voltage of the control terminal G is Vda+Vth, so the driving transistor T1 is also turned on. .
在第三阶段P3,OLED的阳极和阴极分别接入了第一电源电压Vdd(高电压)和第二电源电压Vss(低电压),从而在驱动晶体管T1产生的驱动电流的驱动下发光。In the third stage P3, the anode and cathode of the OLED are respectively connected to the first power supply voltage Vdd (high voltage) and the second power supply voltage Vss (low voltage), so as to emit light driven by the driving current generated by the driving transistor T1.
基于驱动晶体管T1的饱和电流公式,驱动OLED发光的驱动电流ID可以根据下式得出:Based on the saturation current formula of the driving transistor T1, the driving current ID for driving the OLED to emit light can be obtained according to the following formula:
ID=K(VGS-Vth) 2 ID=K(VGS-Vth) 2
=K[(Vda+Vth-Vdd)-Vth] 2 =K[(Vda+Vth-Vdd)-Vth] 2
=K(Vda-Vdd) 2 =K(Vda-Vdd) 2
在上述公式中,Vth表示驱动晶体管T1的阈值电压,VGS表示驱动晶体管T1的栅极和源极之间的电压,K为常数。从上式可以看出,流经OLED的驱动电流ID不再与驱动晶体管T1的阈值电压Vth有关,而只与数据信号DA的电压Vda有关,由此可以实现对驱动晶体管T1的阈值电压Vth的补偿,解决了驱动晶体管T1由于工艺制程及长时间的操作造成阈值电压漂移的问题,消除其对驱动电流ID的影响,从而可以改善显示效果。In the above formula, Vth represents the threshold voltage of the driving transistor T1, VGS represents the voltage between the gate and the source of the driving transistor T1, and K is a constant. It can be seen from the above formula that the driving current ID flowing through the OLED is no longer related to the threshold voltage Vth of the driving transistor T1, but is only related to the voltage Vda of the data signal DA, so that the threshold voltage Vth of the driving transistor T1 can be adjusted. The compensation solves the problem of threshold voltage drift of the driving transistor T1 caused by the process and long-term operation, and eliminates its influence on the driving current ID, thereby improving the display effect.
例如,上述公式中K可以表示为:For example, K in the above formula can be expressed as:
K=0.5nCox(W/L),K=0.5nCox(W/L),
其中,n为驱动晶体管T1的电子迁移率,Cox为驱动晶体管T1的栅极单位电容量,W为驱动晶体管T1的沟道宽,L为驱动晶体管T1的沟道长。Wherein, n is the electron mobility of the driving transistor T1, Cox is the gate unit capacitance of the driving transistor T1, W is the channel width of the driving transistor T1, and L is the channel length of the driving transistor T1.
替换地,在本公开的一些实施例中,发光复位控制信号RST、补偿控制信号COM和扫描信号GA可以是同一信号。稳压晶体管T2可以是N型晶体管,而驱动晶体管T1、驱动复位晶体管T3、发光复位晶体管T4、数据写入晶体管T5、补偿晶体管T6、第一发光控制晶体管T7和第二发光控制晶体管T8是P型晶体管。与上述实施例中的像素电路的工作过程的区别在于,在第一阶段P1,发光复位晶体管T4接收到高电平的扫描信号GA,发光复位晶体管T4截止。发光复位电压VINT2未被提供给发光器件OLED的阳极,因此发光器件OLED的阳极未被复位。在第二阶段P2,发光复位晶体管T4接收到低电平的扫描信号GA,发光复位晶体管T4导通。发光复位电压VINT2被提供给发光器件OLED的阳极,对发光器件OLED的阳极进行复位。像素电路在第一时段P1、第二时段P2及第三时段P3的其余的工作过程与上述实施例类似,在 此不再赘述。Alternatively, in some embodiments of the present disclosure, the light emission reset control signal RST, the compensation control signal COM, and the scan signal GA may be the same signal. The voltage-stabilizing transistor T2 may be an N-type transistor, while the driving transistor T1, the driving reset transistor T3, the light-emitting reset transistor T4, the data writing transistor T5, the compensation transistor T6, the first light-emitting control transistor T7 and the second light-emitting control transistor T8 are P type transistor. The difference from the working process of the pixel circuit in the above-mentioned embodiment is that, in the first stage P1, the light-emitting reset transistor T4 receives the high-level scanning signal GA, and the light-emitting reset transistor T4 is turned off. The light emission reset voltage VINT2 is not supplied to the anode of the light emitting device OLED, and thus the anode of the light emitting device OLED is not reset. In the second stage P2, the light-emitting reset transistor T4 receives the low-level scan signal GA, and the light-emitting reset transistor T4 is turned on. The light emission reset voltage VINT2 is supplied to the anode of the light emitting device OLED to reset the anode of the light emitting device OLED. The rest of the operation process of the pixel circuit in the first period P1, the second period P2 and the third period P3 is similar to the above-mentioned embodiment, and details are not repeated here.
此外,需要注意的是,驱动复位控制信号RST、扫描信号GA、发光控制信号EMS、稳压控制信号STV、以及数据信号DA与各个阶段的关系仅为示意性的。驱动复位控制信号RST、扫描信号GA、发光控制信号EMS、稳压控制信号STV、以及数据信号DA的高电平或低电平的持续时间仅是示意性的。例如,发光控制信号EMS的每个高电平持续时间可以是相同的。In addition, it should be noted that the relationship between the drive reset control signal RST, the scan signal GA, the light emission control signal EMS, the voltage regulation control signal STV, and the data signal DA and each stage is only illustrative. The durations of the high level or the low level of the driving reset control signal RST, the scan signal GA, the light emission control signal EMS, the voltage regulation control signal STV, and the data signal DA are only illustrative. For example, each high level duration of the lighting control signal EMS may be the same.
图5-11示出了根据本公开的实施例的阵列基板中各层的平面示意图。以一个如图3所示的像素电路为例进行说明。在该像素电路中,发光复位控制信号RST与发光控制信号EMS是同一信号,稳压控制信号COM与扫描信号GA是同一信号,稳压晶体管T2和发光复位晶体管T4为金属氧化物晶体管。5-11 illustrate schematic plan views of layers in an array substrate according to embodiments of the present disclosure. A pixel circuit as shown in FIG. 3 is taken as an example for description. In the pixel circuit, the light-emitting reset control signal RST and the light-emitting control signal EMS are the same signal, the voltage-stabilizing control signal COM and the scanning signal GA are the same signal, and the voltage-stabilizing transistor T2 and the light-emitting reset transistor T4 are metal oxide transistors.
下面结合附图5至11描述像素电路中的各个电路在衬底上的位置关系。本领域的技术人员将理解,附图5至11中的比例为绘制比例,以便于更清楚地表示各部分的位置,其不可视为部件的真实比例。本领域技术人员可基于实际需求来选择各部件的尺寸,本公开对此不作具体限定。The following describes the positional relationship of each circuit in the pixel circuit on the substrate with reference to FIGS. 5 to 11 . Those skilled in the art will understand that the scales in FIGS. 5 to 11 are drawing scales in order to more clearly represent the positions of various parts, and should not be regarded as true scales of components. Those skilled in the art can select the size of each component based on actual requirements, which is not specifically limited in the present disclosure.
在本公开的实施例中,阵列基板包括位于衬底300上的第一有源半导体层310。In an embodiment of the present disclosure, the array substrate includes the first active semiconductor layer 310 on the substrate 300 .
图5示出了根据本公开的实施例的阵列基板中的第一有源半导体层310的平面示意图。在本公开的示例性实施例中,像素电路中的驱动晶体管T1、驱动复位晶体管T3、发光复位晶体管T4、数据写入晶体管T5、补偿晶体管T6、第一发光控制晶体管T7和第二发光控制晶体管T8是硅晶体管,例如低温多晶硅晶体管。在本公开的示例性实施例中,第一有源半导体层310可用于形成上述驱动晶体管T1、驱动复位晶体管T3、发光复位晶体管T4、数据写入晶体管T5、补偿晶体管T6、第一发光控制晶体管T7和第二发光控制晶体管T8的有源区。在本公开的示例性实施例中,第一有源半导体层310包括晶体管的沟道区图案和掺杂区图案(即,晶体管的第一源/漏区和第二源/漏区)。在本公开的实施例中,各晶体管的沟道区图案和掺杂区图案一体设置。FIG. 5 shows a schematic plan view of the first active semiconductor layer 310 in the array substrate according to an embodiment of the present disclosure. In the exemplary embodiment of the present disclosure, the driving transistor T1, the driving reset transistor T3, the light-emitting reset transistor T4, the data writing transistor T5, the compensation transistor T6, the first light-emitting control transistor T7, and the second light-emitting control transistor in the pixel circuit T8 is a silicon transistor, such as a low temperature polysilicon transistor. In an exemplary embodiment of the present disclosure, the first active semiconductor layer 310 may be used to form the above-mentioned driving transistor T1, driving reset transistor T3, light-emitting reset transistor T4, data writing transistor T5, compensation transistor T6, and first light-emitting control transistor Active regions of T7 and the second light emission control transistor T8. In an exemplary embodiment of the present disclosure, the first active semiconductor layer 310 includes a channel region pattern and a doping region pattern of the transistor (ie, first and second source/drain regions of the transistor). In the embodiment of the present disclosure, the channel region pattern and the doped region pattern of each transistor are integrally provided.
需要说明的是,在图5中,虚线框被用于标示第一有源半导体层310中的用于各个晶体管的源/漏区和沟道区的区域。It should be noted that, in FIG. 5 , a dotted frame is used to denote regions in the first active semiconductor layer 310 for source/drain regions and channel regions of respective transistors.
如图5所示,第一有源半导体层310沿Y方向(列方向)和X方向(行方向)依次包括驱动复位晶体管T3的沟道区T3-c、数据写入晶体管T5的沟道区T5-c、补偿晶体管T6的沟道区T6-c、驱动晶体管T1的沟道区T1-c、第一发光控制晶体管T7的沟道区T7-c、以及第二发光控制晶体管T8的沟道区T8-c。As shown in FIG. 5 , the first active semiconductor layer 310 sequentially includes a channel region T3-c of the driving reset transistor T3 and a channel region of the data writing transistor T5 along the Y direction (column direction) and the X direction (row direction) in sequence. T5-c, the channel region T6-c of the compensation transistor T6, the channel region T1-c of the driving transistor T1, the channel region T7-c of the first light emission control transistor T7, and the channel of the second light emission control transistor T8 District T8-c.
在本公开的示例性实施例中,用于上述晶体管的第一有源半导体层可以包括一体形成的低温多晶硅层。各晶体管的源极区域和漏极区域可以通过掺杂等进行导体化以实现各结构的电连接。也就是,晶体管的第一有源半导体层为由p-硅或n-硅形成的整体图案,且同一像素电路中的各晶体管包括掺杂区图案(即,源极区域s和漏极区域d)和沟道区图案。不同晶体管的有源层之间由掺杂结构隔开。In an exemplary embodiment of the present disclosure, the first active semiconductor layer for the above-described transistor may include an integrally formed low temperature polysilicon layer. The source region and the drain region of each transistor may be conductive by doping or the like to realize electrical connection of each structure. That is, the first active semiconductor layer of the transistor is an overall pattern formed of p-silicon or n-silicon, and each transistor in the same pixel circuit includes a pattern of doped regions (ie, source region s and drain region d). ) and channel region pattern. The active layers of different transistors are separated by doping structures.
如图5所示,第一有源半导体层310沿Y方向和X方向进一步包括:驱动复位晶体管T3的漏极区域T3-d、数据写入晶体管T5的漏极区域T5-d、驱动复位晶体管T3的源极区域及补偿晶体管T6的源极区域T3-s/T6-s、数据写入晶体管T5的源极区域T5-s、驱动晶体管T1的源极区域及第一发光控制晶体管T7源极区域T1-s/T7-s、补偿晶体管T6的漏极区域及驱动晶体管T1的漏极区域及第二发光控制晶体管T8的漏极区域T6-d/T1-d/T8-d、第一发光控制晶体管T7漏极区域T7-d、以及第二发光控制晶体管T8源极区域T8-s。As shown in FIG. 5 , the first active semiconductor layer 310 further includes: a drain region T3-d of the driving reset transistor T3, a drain region T5-d of the data writing transistor T5, and a driving reset transistor along the Y direction and the X direction. The source region of T3 and the source region T3-s/T6-s of the compensation transistor T6, the source region T5-s of the data writing transistor T5, the source region of the driving transistor T1 and the source of the first light-emitting control transistor T7 The region T1-s/T7-s, the drain region of the compensation transistor T6 and the drain region of the driving transistor T1 and the drain region T6-d/T1-d/T8-d of the second light emission control transistor T8, the first light emission The drain region T7-d of the control transistor T7, and the source region T8-s of the second light-emitting control transistor T8.
在本公开的示例性实施例中,第一有源半导体层310可以由非晶硅、多晶硅等硅半导体材料形成。上述源极区域和漏极区域可为掺杂有n型杂质或p型杂质的区域。例如,上述第一发光控制晶体管T7、数据写入晶体管T5、驱动晶体管T1、补偿晶体管T6、以及第二发光控制晶体管T8的源极区域和漏极区域均是掺杂有P型杂质的区域。In an exemplary embodiment of the present disclosure, the first active semiconductor layer 310 may be formed of a silicon semiconductor material such as amorphous silicon, polysilicon, or the like. The above-mentioned source region and drain region may be regions doped with n-type impurities or p-type impurities. For example, the source and drain regions of the first light emission control transistor T7, the data writing transistor T5, the driving transistor T1, the compensation transistor T6, and the second light emission control transistor T8 are all regions doped with P-type impurities.
在本公开的实施例中,阵列基板还包括位于第一有源半导体层的背离衬底的一侧的第一 导电层320。In an embodiment of the present disclosure, the array substrate further includes a first conductive layer 320 on a side of the first active semiconductor layer away from the substrate.
图6了根据本公开的实施例的阵列基板中的第一导电层320的平面示意图。如图6示,第一导电层320包括沿Y方向依次设置的驱动复位控制信号线RSTL1、扫描信号线GAL、电容器C的第一极C1以及发光控制信号线EML。此外,第一导电层320还包括用于沿Y方向的相邻像素电路的驱动复位控制信号线RSTL1’。相邻像素电路的驱动复位控制信号线RSTL1’对该相邻像素电路的作用与驱动复位控制信号线RSTL1对本像素电路的作用相同,以下不再对其进行重复说明。FIG. 6 is a schematic plan view of the first conductive layer 320 in the array substrate according to an embodiment of the present disclosure. As shown in FIG. 6 , the first conductive layer 320 includes a drive reset control signal line RSTL1 , a scan signal line GAL, a first pole C1 of the capacitor C, and a light emission control signal line EML sequentially arranged along the Y direction. In addition, the first conductive layer 320 further includes a drive reset control signal line RSTL1' for adjacent pixel circuits along the Y direction. The function of the drive reset control signal line RSTL1' of the adjacent pixel circuit to the adjacent pixel circuit is the same as that of the drive reset control signal line RSTL1 to the pixel circuit, and the description thereof will not be repeated below.
在本公开实施例中,发光控制信号线EML与发光控制信号输入端EM,被配置为向发光控制信号输入端EM提供发光控制信号EMS。In the embodiment of the present disclosure, the lighting control signal line EML and the lighting control signal input terminal EM are configured to provide the lighting control signal input terminal EM with the lighting control signal EMS.
在本公开的实施例中,扫描信号线GAL与扫描信号输入端Gate及补偿控制信号输入端Com耦接,并被配置为向扫描信号输入端Gate提供扫描信号GA,并被配置为向补偿控制信号输入端Com提供补偿控制信号COM。In the embodiment of the present disclosure, the scan signal line GAL is coupled to the scan signal input terminal Gate and the compensation control signal input terminal Com, and is configured to provide the scan signal GA to the scan signal input terminal Gate, and is configured to provide the compensation control signal The signal input terminal Com provides the compensation control signal COM.
在本公开的实施例中,电容器C的第一极C1与驱动晶体管T1的栅极T1-g为一体结构。In the embodiment of the present disclosure, the first electrode C1 of the capacitor C and the gate electrode T1-g of the driving transistor T1 have an integral structure.
在本公开的实施例中,驱动复位控制信号线RSTL1与驱动复位控制信号输入端Rst1耦接,以向驱动复位控制信号输入端Rst1提供驱动复位控制信号RST。In the embodiment of the present disclosure, the driving reset control signal line RSTL1 is coupled to the driving reset control signal input terminal Rst1 to provide the driving reset control signal RST to the driving reset control signal input terminal Rst1.
在本公开的实施例中,参考图5和图6,驱动复位控制信号线RSTL1的在衬底上的正投影与第一有源半导体层310的部分311在衬底上的正投影重叠的部分为像素电路的驱动复位晶体管T3的栅极T3-g。扫描信号线GAL在衬底上的正投影与第一有源半导体层310的部分311在衬底上的正投影重叠的部分分别为像素电路中的补偿晶体管T6的栅极T6-g和数据写入晶体管T5的栅极T5-g。像素电路中的电容器C的第一极C1的在衬底上的正投影与第一有源半导体层310的部分311在衬底上的正投影重叠的部分为像素电路中的驱动晶体管T1的栅极T1-g。发光控制信号线EML在衬底上的正投影与第一有源半导体层310的部分311在衬底上的正投影重叠的部分分别为像素电路中的第一发光控制晶体管T7的栅极T7-g和第二发光控制晶体管T8的栅极T8-g。In an embodiment of the present disclosure, referring to FIGS. 5 and 6 , the orthographic projection of the reset control signal line RSTL1 on the substrate is driven to overlap the orthographic projection of the portion 311 of the first active semiconductor layer 310 on the substrate. It is the gate T3-g of the drive reset transistor T3 of the pixel circuit. The part where the orthographic projection of the scanning signal line GAL on the substrate overlaps with the orthographic projection of the part 311 of the first active semiconductor layer 310 on the substrate is the gate T6-g of the compensation transistor T6 and the data write in the pixel circuit, respectively. into the gate T5-g of the transistor T5. The part where the orthographic projection of the first electrode C1 of the capacitor C in the pixel circuit on the substrate overlaps with the orthographic projection of the part 311 of the first active semiconductor layer 310 on the substrate is the gate of the driving transistor T1 in the pixel circuit Pole T1-g. The portion where the orthographic projection of the light-emitting control signal line EML on the substrate overlaps with the orthographic projection of the portion 311 of the first active semiconductor layer 310 on the substrate is the gate T7- of the first light-emitting control transistor T7 in the pixel circuit, respectively. g and the gate T8-g of the second light emission control transistor T8.
在本公开的实施例中,如图6所示,在Y方向上,驱动复位晶体管T3的栅极T3-g、补偿晶体管T6的栅极T6-g和数据写入晶体管T5的栅极T5-g位于驱动晶体管T1的栅极T1-g的第一侧。第一发光控制晶体管T7的栅极T7-g和第一发光控制晶体管T8的栅极T8-g位于驱动晶体管T1的栅极T1-g的第二侧。In the embodiment of the present disclosure, as shown in FIG. 6 , in the Y direction, the gate T3-g of the reset transistor T3, the gate T6-g of the compensation transistor T6 and the gate T5-g of the data writing transistor T5 are driven g is located on the first side of the gate T1-g of the drive transistor T1. The gate T7-g of the first light emission control transistor T7 and the gate T8-g of the first light emission control transistor T8 are located on the second side of the gate T1-g of the driving transistor T1.
需要说明的是,驱动晶体管T1的栅极T1-g的第一侧和第二侧为驱动晶体管T1的栅极T1-g的在Y方向上的相对两侧。例如,如图6所示,在XY面内,驱动晶体管T1的栅极T1-g的第一侧可以为驱动晶体管T1的栅极T1-g的上侧。驱动晶体管T1的栅极T1-g的第二侧可以为驱动晶体管T1的栅极T1-g的下侧。在本公开的描述中,“下侧”例如为阵列基板的用于接合IC的一侧。例如,驱动晶体管T1的栅极T1-g的下侧为驱动晶体管T1的栅极T1-g的靠近IC(图中未示出)的一侧。上侧为下侧的相对侧,例如为驱动晶体管T1的栅极T1-g的远离IC的一侧。It should be noted that the first side and the second side of the gate T1-g of the driving transistor T1 are opposite sides of the gate T1-g of the driving transistor T1 in the Y direction. For example, as shown in FIG. 6, in the XY plane, the first side of the gate T1-g of the driving transistor T1 may be the upper side of the gate T1-g of the driving transistor T1. The second side of the gate T1-g of the driving transistor T1 may be the lower side of the gate T1-g of the driving transistor T1. In the description of the present disclosure, the "lower side" is, for example, the side of the array substrate for bonding ICs. For example, the lower side of the gate T1-g of the driving transistor T1 is the side of the gate T1-g of the driving transistor T1 close to the IC (not shown in the figure). The upper side is the opposite side to the lower side, eg the side of the gate T1-g of the drive transistor T1 away from the IC.
更具体地,驱动复位晶体管T3的栅极T3-g位于补偿晶体管T6的栅极T6-g和数据写入晶体管T5的栅极T5-g的上侧。驱动复位晶体管T3的栅极T3-g与驱动晶体管T1的栅极T1-g在Y方向上对齐设置。More specifically, the gate T3-g of the drive reset transistor T3 is located on the upper side of the gate T6-g of the compensation transistor T6 and the gate T5-g of the data writing transistor T5. The gate T3-g of the drive reset transistor T3 is aligned with the gate T1-g of the drive transistor T1 in the Y direction.
在本公开的实施例中,在X方向上,如图6所示,数据写入晶体管T5的栅极T5-g和第一发光控制晶体管T7的栅极T7-g位于驱动晶体管T1的栅极T1-g的第三侧。补偿晶体管T6的栅极T6-g和第二发光控制晶体管T8的栅极T8-g位于驱动晶体管T1的栅极T1-g的第四侧。In the embodiment of the present disclosure, in the X direction, as shown in FIG. 6 , the gate T5-g of the data writing transistor T5 and the gate T7-g of the first light emission control transistor T7 are located at the gate of the driving transistor T1 Third side of T1-g. The gate T6-g of the compensation transistor T6 and the gate T8-g of the second light emission control transistor T8 are located on the fourth side of the gate T1-g of the driving transistor T1.
需要说明的是,驱动晶体管T1的栅极T1-g的第三侧和第四侧为驱动晶体管T1的栅极T1-g的在X方向上的相对两侧。例如,如图6所示,在XY面内,驱动晶体管T1的栅极T1-g的第三侧可以为驱动晶体管T1的栅极T1-g的左侧。驱动晶体管T1的栅极T1-g的第四侧可以为驱动晶体管T1的栅极T1-g的右侧。It should be noted that the third side and the fourth side of the gate T1-g of the driving transistor T1 are opposite sides of the gate T1-g of the driving transistor T1 in the X direction. For example, as shown in FIG. 6, in the XY plane, the third side of the gate T1-g of the driving transistor T1 may be the left side of the gate T1-g of the driving transistor T1. The fourth side of the gate T1-g of the driving transistor T1 may be the right side of the gate T1-g of the driving transistor T1.
更具体地,第一发光控制晶体管T7的栅极T7-g在数据写入晶体管T5的栅极T5-g的左侧。第二发光控制晶体管T8的栅极T8-g位于补偿晶体管T6的栅极T6-g的右侧。More specifically, the gate T7-g of the first light emission control transistor T7 is on the left side of the gate T5-g of the data writing transistor T5. The gate T8-g of the second light emission control transistor T8 is located to the right of the gate T6-g of the compensation transistor T6.
应注意,图6示出的晶体管的有源区对应于第一导电层320与第一有源半导体层310交叠的各个区域。It should be noted that the active regions of the transistor shown in FIG. 6 correspond to respective regions where the first conductive layer 320 and the first active semiconductor layer 310 overlap.
在本公开的实施例中,阵列基板还包括位于第一导电层的背离衬底一侧的并与第一导电层绝缘隔离的第二导电层。In an embodiment of the present disclosure, the array substrate further includes a second conductive layer located on a side of the first conductive layer away from the substrate and insulated from the first conductive layer.
图7示出了根据本公开的实施例的阵列基板中的第二导电层330的平面示意图。如图7所示第二导电层330包括沿Y方向设置的稳压控制信号线STVL、电容器的第二极C2、第一电源电压线VDL和发光复位控制信号线RSTL2。另外,第二导电层330还包括沿Y方向的相邻像素电路的发光复位控制信号线RSTL2’。相邻像素电路的发光复位控制信号线RSTL2’对该相邻像素电路的作用与发光复位控制信号线RSTL2对本像素电路的作用相同,以下不再对其进行重复说明。FIG. 7 shows a schematic plan view of the second conductive layer 330 in the array substrate according to an embodiment of the present disclosure. As shown in FIG. 7 , the second conductive layer 330 includes a voltage regulation control signal line STVL, a second pole C2 of the capacitor, a first power supply voltage line VDL and a light emission reset control signal line RSTL2 arranged along the Y direction. In addition, the second conductive layer 330 further includes a light emission reset control signal line RSTL2' of adjacent pixel circuits along the Y direction. The function of the light emission reset control signal line RSTL2' of the adjacent pixel circuit to the adjacent pixel circuit is the same as that of the light emission reset control signal line RSTL2 to the pixel circuit, and the description thereof will not be repeated below.
在本公开的实施例中,参考图6和图7,电容器C的第二极C2和电容器C的第一极C1在衬底上的投影至少部分重叠。In an embodiment of the present disclosure, referring to FIGS. 6 and 7 , the projections of the second pole C2 of the capacitor C and the first pole C1 of the capacitor C on the substrate at least partially overlap.
在本公开的实施例中,如图7所示,第一电源电压线VDL沿X方向延伸并与电容器C的第二极C2一体形成。第一电源电压线与第一电源电压端VDD耦接,并被配置为向其提供第一电源电压Vdd。稳压控制信号线STVL与稳压控制信号输入端Stv耦接,并被配置为向其提供稳压控制信号STV。发光复位控制信号线RSTL2与发光复位控制信号输入端Rst2耦接,并被配置为向其提供发光复位控制信号。在本公开的实施例中,发光复位控制信号与扫描信号EMS是同一信号。In the embodiment of the present disclosure, as shown in FIG. 7 , the first power supply voltage line VDL extends in the X direction and is integrally formed with the second pole C2 of the capacitor C. As shown in FIG. The first power supply voltage line is coupled to the first power supply voltage terminal VDD, and is configured to provide the first power supply voltage Vdd thereto. The voltage stabilization control signal line STVL is coupled to the voltage stabilization control signal input terminal Stv, and is configured to provide the voltage stabilization control signal STV thereto. The light-emitting reset control signal line RSTL2 is coupled to the light-emitting reset control signal input terminal Rst2, and is configured to provide the light-emitting reset control signal thereto. In the embodiment of the present disclosure, the light emission reset control signal and the scan signal EMS are the same signal.
在本公开的实施例中,如图7所示,在Y方向上,稳压控制信号线STVL位于电容器的第二极C2的第一侧。第一电源信号线VDL和发光复位控制信号线RSTL2位于电容器的第二极C2的第二侧。与上述关于驱动晶体管T1的栅极T1-g的第一侧和第二侧的描述类似,电容器的第二极C2的第一侧和第二侧为电容器的第二极C2的在Y方向上的相对两侧。电容器的第二极C2的第一侧为在Y方向电容器的第二极C2的上侧,电容器的第二极C2的第二侧为在Y方向电容器的第二极C2的下侧。In the embodiment of the present disclosure, as shown in FIG. 7 , in the Y direction, the voltage regulation control signal line STVL is located on the first side of the second pole C2 of the capacitor. The first power supply signal line VDL and the light emission reset control signal line RSTL2 are located on the second side of the second pole C2 of the capacitor. Similar to the description above with respect to the first and second sides of the gate T1-g of the drive transistor T1, the first and second sides of the second pole C2 of the capacitor are in the Y direction of the second pole C2 of the capacitor opposite sides. The first side of the second pole C2 of the capacitor is the upper side of the second pole C2 of the capacitor in the Y direction, and the second side of the second pole C2 of the capacitor is the lower side of the second pole C2 of the capacitor in the Y direction.
具体地,在Y方向上,稳压控制信号线STVL位于电容器的第二极C2的上侧。第一电源信号线VDL和发光复位控制信号线RSTL2位于电容器的第二极C2的下侧。Specifically, in the Y direction, the voltage stabilization control signal line STVL is located on the upper side of the second pole C2 of the capacitor. The first power supply signal line VDL and the light emission reset control signal line RSTL2 are located on the lower side of the second pole C2 of the capacitor.
在本公开的实施例中,如图7所示,稳压控制信号线STVL上设置有稳压晶体管T2的第一栅极T2-g1。发光复位控制信号线RSTL2上设置有发光复位晶体管T4的第一栅极T4-g1。稳压晶体管T2的第一栅极T2-g1与发光复位晶体管T4的第一栅极T4-g1的具体位置,将在下面参照图8进行详细说明。In the embodiment of the present disclosure, as shown in FIG. 7 , the voltage stabilization control signal line STVL is provided with the first gate T2 - g1 of the voltage stabilization transistor T2 . The light-emitting reset control signal line RSTL2 is provided with a first gate T4-g1 of the light-emitting reset transistor T4. The specific positions of the first gate T2-g1 of the voltage regulator transistor T2 and the first gate T4-g1 of the light-emitting reset transistor T4 will be described in detail below with reference to FIG. 8 .
具体地,如图7所示,在Y方向上稳压晶体管T2的第一栅极T2-g1在发光复位晶体管T4的第一栅极T4-g1的第一侧。与上述对驱动晶体管T1的栅极T1-g的第一侧的描述类似,发光复位晶体管T4的第一栅极T4-g1的第一侧为发光复位晶体管T4的第一栅极T4-g1的上侧。也就是,稳压晶体管T2的第一栅极T2-g1在发光复位晶体管T4的第一栅极T4-g1的上侧。在X方向上,稳压晶体管T2的第一栅极T2-g1与发光复位晶体管T4的第一栅极T4-g1在同一位置处。Specifically, as shown in FIG. 7 , the first gate T2-g1 of the voltage-stabilizing transistor T2 is on the first side of the first gate T4-g1 of the light-emitting reset transistor T4 in the Y direction. Similar to the above description of the first side of the gate T1-g of the driving transistor T1, the first side of the first gate T4-g1 of the light-emitting reset transistor T4 is the first side of the first gate T4-g1 of the light-emitting reset transistor T4. upper side. That is, the first gate T2-g1 of the voltage-stabilizing transistor T2 is on the upper side of the first gate T4-g1 of the light-emitting reset transistor T4. In the X direction, the first gate T2-g1 of the voltage-stabilizing transistor T2 is at the same position as the first gate T4-g1 of the light-emitting reset transistor T4.
在本公开的实施例中,阵列基板还包括位于第二导电层的背离衬底一侧的并与该第二导电层绝缘隔离的第二有源半导体层。In an embodiment of the present disclosure, the array substrate further includes a second active semiconductor layer located on a side of the second conductive layer away from the substrate and insulated from the second conductive layer.
图8示出了根据本公开的实施例的阵列基板中的第二有源半导体层340的平面示意图。如图8所示,第二有源半导体层340在Y方向上依次包括第一部分341和第二部分342,且第二有源半导体层340的第一部分341与第二有源半导体层340的第二部分342对齐设置。在本公开的示例性实施例中,第二有源半导体层340可用于形成上述稳压晶体管T2和发光复位晶体管T4的有源层。具体地,第二有源半导体层340的第一部分341可用于形成稳压晶体 管T2的有源层。第二半导体层340的第二部分342可用于形成稳压晶体管T7的有源层。在本公开的示例性实施例中,与第一有源半导体层310类似,第二有源半导体层340包括晶体管的沟道图案和掺杂区图案(即,晶体管的第一源/漏区和第二源/漏区)。FIG. 8 shows a schematic plan view of the second active semiconductor layer 340 in the array substrate according to an embodiment of the present disclosure. As shown in FIG. 8 , the second active semiconductor layer 340 sequentially includes a first portion 341 and a second portion 342 in the Y direction, and the first portion 341 of the second active semiconductor layer 340 and the first portion 341 of the second active semiconductor layer 340 Two-part 342 alignment settings. In an exemplary embodiment of the present disclosure, the second active semiconductor layer 340 may be used to form the active layers of the voltage-stabilizing transistor T2 and the light-emitting reset transistor T4 described above. Specifically, the first portion 341 of the second active semiconductor layer 340 may be used to form the active layer of the zener transistor T2. The second portion 342 of the second semiconductor layer 340 may be used to form the active layer of the voltage regulator transistor T7. In an exemplary embodiment of the present disclosure, similar to the first active semiconductor layer 310 , the second active semiconductor layer 340 includes a channel pattern and a doping region pattern of the transistor (ie, the first source/drain regions and the doped region of the transistor). second source/drain region).
在图8中,虚线框用于示出第二有源半导体层340中的用于各个晶体管的源/漏区和沟道区的区域。In FIG. 8 , dotted boxes are used to illustrate regions in the second active semiconductor layer 340 for source/drain regions and channel regions of respective transistors.
如图8所示,第二有源半导体层340的第一部分341沿Y方向依次包括稳压晶体管T2的源极区域T2-s、稳压晶体管T2的沟道区T2-c和稳压晶体管T2的漏极区域T2-d。第二有源半导体层340的第二部分342沿Y方向依次包括发光复位晶体管T4的源极区域T4-s、发光复位晶体管T4的沟道区T4-c和发光复位晶体管T4的漏极区域T4-d。As shown in FIG. 8 , the first part 341 of the second active semiconductor layer 340 sequentially includes the source region T2-s of the voltage-stabilizing transistor T2, the channel region T2-c of the voltage-stabilizing transistor T2 and the voltage-stabilizing transistor T2 along the Y direction. the drain region T2-d. The second portion 342 of the second active semiconductor layer 340 sequentially includes a source region T4-s of the light-emitting reset transistor T4, a channel region T4-c of the light-emitting reset transistor T4, and a drain region T4 of the light-emitting reset transistor T4 in the Y direction -d.
在本公开的实施例中,参考图7和图8,稳压控制信号线STVL在衬底上的正投影与第二有源半导体层340在衬底上的正投影的重叠的部分为稳压晶体管T2的第一栅极T2-g1。稳压晶体管T2的沟道区T8-c与稳压晶体管T2的第一栅极T2-g1在衬底上的投影完全重叠。发光控制信号线RSTL2在衬底上的正投影与第二有源半导体层340在衬底上的正投影的重叠的部分为发光复位晶体管T4的第一栅极T4-g1。发光复位晶体管T4的沟道区T4-c与发光复位晶体管T4的第一栅极T4-g1在衬底上的投影完全重叠。In the embodiment of the present disclosure, referring to FIG. 7 and FIG. 8 , the overlapping part of the orthographic projection of the voltage regulation control signal line STVL on the substrate and the orthographic projection of the second active semiconductor layer 340 on the substrate is the voltage regulation The first gate T2-g1 of the transistor T2. The channel region T8-c of the voltage-stabilizing transistor T2 completely overlaps with the projection of the first gate T2-g1 of the voltage-stabilizing transistor T2 on the substrate. The overlapping portion of the orthographic projection of the light emitting control signal line RSTL2 on the substrate and the orthographic projection of the second active semiconductor layer 340 on the substrate is the first gate T4 - g1 of the light emitting reset transistor T4 . The channel region T4-c of the light-emitting reset transistor T4 completely overlaps with the projection of the first gate T4-g1 of the light-emitting reset transistor T4 on the substrate.
在本公开的示例性实施例中,第二有源半导体层340可以由氧化物半导体材料形成,例如,铟镓锌氧IGZO。上述源极区域和漏极区域可为掺杂有n型杂质或p型杂质的区域。例如,稳压晶体管T2和发光复位晶体管T4源极区域和漏极区域均是掺杂有N型杂质的区域。In an exemplary embodiment of the present disclosure, the second active semiconductor layer 340 may be formed of an oxide semiconductor material, eg, indium gallium zinc oxide IGZO. The above-mentioned source region and drain region may be regions doped with n-type impurities or p-type impurities. For example, both the source region and the drain region of the voltage regulator transistor T2 and the light-emitting reset transistor T4 are regions doped with N-type impurities.
在本公开的实施例中,阵列基板还包括位于第二有源半导体层的背离衬底一侧的并与该第二有源半导体层绝缘隔离的第三导电层。In an embodiment of the present disclosure, the array substrate further includes a third conductive layer located on a side of the second active semiconductor layer away from the substrate and insulated from the second active semiconductor layer.
图9示出了根据本公开的实施例的阵列基板中的第三导电层350的平面示意图。如图9所示,第三导电层350包括稳压控制信号线STVL、发光复位控制信号线RSTL2、以及发光复位电压线VINL2。另外,第三导电层350还包括沿Y方向的相邻像素电路的发光复位控制信号线RSTL2’和发光复位电压线VINL2’。相邻像素电路的发光复位控制信号线RSTL2’和发光复位电压线VINL2’对该相邻像素电路的作用与发光复位控制信号线RSTL2和发光复位电压线VINL2对本像素电路的作用相同,以下不再对其进行重复说明。FIG. 9 shows a schematic plan view of the third conductive layer 350 in the array substrate according to an embodiment of the present disclosure. As shown in FIG. 9 , the third conductive layer 350 includes a voltage regulation control signal line STVL, a light emission reset control signal line RSTL2, and a light emission reset voltage line VINL2. In addition, the third conductive layer 350 further includes a light-emitting reset control signal line RSTL2' and a light-emitting reset voltage line VINL2' of adjacent pixel circuits along the Y direction. The light-emitting reset control signal line RSTL2' and the light-emitting reset voltage line VINL2' of the adjacent pixel circuit have the same effect on the adjacent pixel circuit as the light-emitting reset control signal line RSTL2 and the light-emitting reset voltage line VINL2 have the same effect on the pixel circuit, and will not be repeated below. Repeat it.
具体地,如图9所示,稳压控制信号线STVL、发光复位控制信号线RSTL2、以及发光复位电压线VINL2在Y方向上依次设置。Specifically, as shown in FIG. 9 , the voltage stabilization control signal line STVL, the light emission reset control signal line RSTL2, and the light emission reset voltage line VINL2 are sequentially arranged in the Y direction.
在本公开的实施例中,如图9所示,稳压控制信号线STVL上设置有稳压晶体管T2的第二栅极T2-g2。发光复位控制信号线RSTL2上设置有发光复位晶体管T4的第二栅极T4-g2。具体地,稳压控制信号线STVL在衬底上的正投影与第二有源半导体层340在衬底上的正投影的重叠的部分为稳压晶体管T2的第二栅极T2-g2。发光复位控制信号线RSTL2在衬底上的正投影与第二有源半导体层340在衬底上的正投影的重叠的部分为发光复位晶体管T4的第二栅极T4-g2。In the embodiment of the present disclosure, as shown in FIG. 9 , the voltage stabilization control signal line STVL is provided with the second gate T2 - g2 of the voltage stabilization transistor T2 . The light-emitting reset control signal line RSTL2 is provided with a second gate T4-g2 of the light-emitting reset transistor T4. Specifically, the overlapping portion of the orthographic projection of the voltage stabilization control signal line STVL on the substrate and the orthographic projection of the second active semiconductor layer 340 on the substrate is the second gate T2-g2 of the voltage stabilization transistor T2. The overlapping portion of the orthographic projection of the light-emitting reset control signal line RSTL2 on the substrate and the orthographic projection of the second active semiconductor layer 340 on the substrate is the second gate T4-g2 of the light-emitting reset transistor T4.
与图7所示的稳压晶体管T2的第一栅极T2-g1和发光复位晶体管T4的第一栅极T4-g1类似,如图9所示,在Y方向上稳压晶体管T2的第二栅极T2-g2在发光复位晶体管T4的第二栅极T4-g2的第一侧。发光复位晶体管T4的第二栅极T4-g2的第一侧为发光复位晶体管T4的第二栅极T4-g2的上侧。也就是,稳压晶体管T2的第二栅极T2-g2在发光复位晶体管T4的第二栅极T4-g2的上侧。在X方向上,稳压晶体管T2的第二栅极T2-g2与发光复位晶体管T4的第二栅极T4-g2在同一位置处。Similar to the first gate T2-g1 of the voltage-stabilizing transistor T2 and the first gate T4-g1 of the light-emitting reset transistor T4 shown in FIG. 7, as shown in FIG. 9, the second gate of the voltage-stabilizing transistor T2 in the Y direction is The gate T2-g2 is on the first side of the second gate T4-g2 of the light-emitting reset transistor T4. The first side of the second gate T4-g2 of the light-emitting reset transistor T4 is the upper side of the second gate T4-g2 of the light-emitting reset transistor T4. That is, the second gate T2-g2 of the voltage-stabilizing transistor T2 is on the upper side of the second gate T4-g2 of the light-emitting reset transistor T4. In the X direction, the second gate T2-g2 of the voltage-stabilizing transistor T2 is at the same position as the second gate T4-g2 of the light-emitting reset transistor T4.
在本公开的实施例中,参考图7、图8和图9,稳压晶体管T2的第二栅极T2-g2、稳压晶体管T2的沟道区T2-c与稳压晶体管T2的第一栅极T2-g1在衬底上的投影完全重叠。发光复位晶体管T4的第二栅极T4-g2、发光复位晶体管T4的沟道区T4-c和发光复位晶体管T4的第一栅极T4-g1在衬底上的投影完全重叠。In the embodiment of the present disclosure, referring to FIGS. 7 , 8 and 9 , the second gate T2-g2 of the voltage-stabilizing transistor T2, the channel region T2-c of the voltage-stabilizing transistor T2 and the first gate of the voltage-stabilizing transistor T2 The projection of the gate T2-g1 on the substrate completely overlaps. The projections of the second gate T4-g2 of the light-emitting reset transistor T4, the channel region T4-c of the light-emitting reset transistor T4 and the first gate T4-g1 of the light-emitting reset transistor T4 on the substrate completely overlap.
需要说明的是,在本公开的实施例中,在相邻的有源半导体层与导电层之间或在相邻的 导电层之间还分别设置有绝缘层或介质层。具体地,在第一有源半导体层310与第一导电层320之间、在第一导电层320与第二导电层330之间、在第二导电层330与第二有源半导体层340之间、在第二有源半导体层340与第三导电层350之间、在第三导电层350与第四导电层360(其在下文参照图12进行具体描述)之间、以及在第四导电层360与第五导电层370之间(其在下文参照图11进行具体描述)还分别设置有绝缘层或介质层(其在下文参照截面图进行具体描述)。It should be noted that, in the embodiments of the present disclosure, an insulating layer or a dielectric layer is further provided between adjacent active semiconductor layers and conductive layers or between adjacent conductive layers. Specifically, between the first active semiconductor layer 310 and the first conductive layer 320 , between the first conductive layer 320 and the second conductive layer 330 , and between the second conductive layer 330 and the second active semiconductor layer 340 between the second active semiconductor layer 340 and the third conductive layer 350, between the third conductive layer 350 and the fourth conductive layer 360 (which will be described in detail below with reference to FIG. 12), and between the fourth conductive layer Between the layer 360 and the fifth conductive layer 370 (which will be described in detail below with reference to FIG. 11 ), an insulating layer or a dielectric layer (which will be described in detail below with reference to the cross-sectional view) is respectively provided.
应注意,以下描述的过孔为同时贯穿在相邻的有源半导体层与导电层之间或在相邻的导电层之间设置的绝缘层或介质层的过孔。具体地,过孔为同时贯穿在第一有源半导体层310与第一导电层320之间、在第一导电层320与第二导电层330之间、在第二导电层330与第二有源半导体层340之间、在第二有源半导体层340与第三导电层350之间、在第三导电层350与第四导电层360之间、以及在第四导电层360与第五导电层370之间的各绝缘层或介质层的过孔。It should be noted that the via holes described below are via holes simultaneously penetrating through insulating layers or dielectric layers provided between adjacent active semiconductor layers and conductive layers or between adjacent conductive layers. Specifically, the via holes penetrate simultaneously between the first active semiconductor layer 310 and the first conductive layer 320, between the first conductive layer 320 and the second conductive layer 330, and between the second conductive layer 330 and the second conductive layer 330. between the source semiconductor layer 340, between the second active semiconductor layer 340 and the third conductive layer 350, between the third conductive layer 350 and the fourth conductive layer 360, and between the fourth conductive layer 360 and the fifth conductive layer Vias of each insulating layer or dielectric layer between layers 370 .
在本公开的附图中,白色圆圈用于表示与过孔有对应的区域。参考图9,发光复位电压线VINL2经由过孔3501与第二有源半导体层340耦接,以形成发光复位晶体管T4的第一极T4-1。具体地,参考图8和图9,图9中的发光复位电压线VINL2与图8中的第二部分342的发光复位晶体管T4的漏极区域T7-d在衬底上的投影有重叠。发光复位电压线VINL2经由过孔3501与发光复位晶体管T4的漏极区域T4-d耦接。In the drawings of the present disclosure, white circles are used to indicate regions corresponding to vias. Referring to FIG. 9 , the light-emitting reset voltage line VINL2 is coupled to the second active semiconductor layer 340 through the via hole 3501 to form the first electrode T4-1 of the light-emitting reset transistor T4. Specifically, referring to FIGS. 8 and 9 , the light emitting reset voltage line VINL2 in FIG. 9 overlaps with the projection on the substrate of the drain region T7 - d of the light emitting reset transistor T4 of the second portion 342 in FIG. 8 . The light emitting reset voltage line VINL2 is coupled to the drain region T4 - d of the light emitting reset transistor T4 through the via hole 3501 .
在本公开的实施例中,阵列基板还包括位于第三导电层的背离衬底一侧的并与该第三导电层绝缘隔离的第四导电层。In an embodiment of the present disclosure, the array substrate further includes a fourth conductive layer located on a side of the third conductive layer away from the substrate and insulated from the third conductive layer.
图10示出了根据本公开的实施例的阵列基板中的第四导电层360的平面示意图。如图10所示,第四导电层360包括第一连接部361、第二连接部362、第三连接部363、第四连接部364、第五连接部365、第六连接部366、第七连接部367、以及第八连接部368。另外,第四导电层360还包括用于沿Y方向的相邻像素电路的第九连接部369。第九连接部369及其上的过孔3691可以作为相邻像素电路的第一连接部361及其上的过孔3611。其具体的连接方式及作用与该像素电路中的第一连接部361及其上的过孔3611类似,以下不再进行重复说明。为了构图需要,相邻像素电路的第一连接部361及其上的过孔3611被如上设置。FIG. 10 shows a schematic plan view of the fourth conductive layer 360 in the array substrate according to an embodiment of the present disclosure. As shown in FIG. 10 , the fourth conductive layer 360 includes a first connection part 361 , a second connection part 362 , a third connection part 363 , a fourth connection part 364 , a fifth connection part 365 , a sixth connection part 366 , and a seventh connection part 366 . The connection part 367 and the eighth connection part 368 . In addition, the fourth conductive layer 360 further includes a ninth connection portion 369 for adjacent pixel circuits along the Y direction. The ninth connection part 369 and the via hole 3691 thereon may serve as the first connection part 361 of the adjacent pixel circuit and the via hole 3611 thereon. The specific connection manner and function thereof are similar to the first connection portion 361 in the pixel circuit and the via hole 3611 thereon, which will not be repeated below. For patterning needs, the first connection parts 361 of adjacent pixel circuits and the via holes 3611 thereon are arranged as above.
在本公开的实施例中,第二连接部362、第三连接部363、第四连接部364、第五连接部365、第六连接部366、第七连接部367、以及第八连接部368被设置在第一连接部361的第二侧。与驱动晶体管T1的栅极T1-g的第二侧类似,在XY坐标系中,第一连接部361的第二侧为第一连接部361的下侧。也就是第二连接部362、第三连接部363、第四连接部364、第五连接部365、第六连接部366、第七连接部367、以及第八连接部368被设置在第一连接部361的下侧。第三连接部363与第六连接部366沿Y方向依次设置。第二连接部362、第四连接部364、第五连接部365、第七连接部367、以及第八连接部368沿Y方向依次设置。第二连接部362、第四连接部364、第五连接部365、第七连接部367、以及第八连接部368在第三连接部363与第六连接部366的第三侧。与上述驱动晶体管T1的栅极T1-g的第三侧类似,在XY平面内,第三连接部363与第六连接部366的第三侧为第三连接部363与第六连接部366的右侧。也就是,第二连接部362、第四连接部364、第五连接部365、第七连接部367、以及第八连接部368在第三连接部363与第六连接部366的右侧。In the embodiment of the present disclosure, the second connection part 362 , the third connection part 363 , the fourth connection part 364 , the fifth connection part 365 , the sixth connection part 366 , the seventh connection part 367 , and the eighth connection part 368 is provided on the second side of the first connection portion 361 . Similar to the second side of the gate T1 - g of the driving transistor T1 , in the XY coordinate system, the second side of the first connection portion 361 is the lower side of the first connection portion 361 . That is, the second connection part 362, the third connection part 363, the fourth connection part 364, the fifth connection part 365, the sixth connection part 366, the seventh connection part 367, and the eighth connection part 368 are provided at the first connection part the lower side of the portion 361 . The third connection portion 363 and the sixth connection portion 366 are sequentially arranged along the Y direction. The second connection portion 362 , the fourth connection portion 364 , the fifth connection portion 365 , the seventh connection portion 367 , and the eighth connection portion 368 are sequentially arranged along the Y direction. The second connection part 362 , the fourth connection part 364 , the fifth connection part 365 , the seventh connection part 367 , and the eighth connection part 368 are on the third side of the third connection part 363 and the sixth connection part 366 . Similar to the third side of the gate T1-g of the above-mentioned driving transistor T1, in the XY plane, the third side of the third connection part 363 and the sixth connection part 366 is the third connection part 363 and the sixth connection part 366. Right. That is, the second connection part 362 , the fourth connection part 364 , the fifth connection part 365 , the seventh connection part 367 , and the eighth connection part 368 are on the right side of the third connection part 363 and the sixth connection part 366 .
第一连接部361经由过孔3611与第一有源半导体层310耦接。具体地,第一连接部361经由过孔3611与驱动复位晶体管T3的漏极区域T3-d耦接,形成驱动复位晶体管T3的第一极T3-1。第一连接部361用作驱动复位电压线VINL1。The first connection portion 361 is coupled to the first active semiconductor layer 310 through the via hole 3611 . Specifically, the first connection portion 361 is coupled to the drain region T3-d of the driving reset transistor T3 via the via hole 3611, and forms the first electrode T3-1 of the driving reset transistor T3. The first connection portion 361 serves as the driving reset voltage line VINL1.
第二连接部362经由过孔3621与第三导电层350耦接。具体地,第二连接部362经由过孔3621与发光复位电压线VINL2耦接。The second connection portion 362 is coupled to the third conductive layer 350 through the via hole 3621 . Specifically, the second connection portion 362 is coupled to the light-emitting reset voltage line VINL2 via the via hole 3621 .
第三连接部363经由过孔3631与第一有源半导体层310耦接。具体地,第三连接部363经由过孔3631与数据写入晶体管T5的漏极区域T5-d耦接,形成数据写入晶体管T5的第一 极T5-1。The third connection portion 363 is coupled to the first active semiconductor layer 310 through the via hole 3631 . Specifically, the third connection portion 363 is coupled to the drain region T5-d of the data writing transistor T5 through the via hole 3631, forming the first electrode T5-1 of the data writing transistor T5.
第四连接部364经由过孔3641与第一有源半导体层310耦接。具体地,第四连接部364经由过孔3641与驱动复位晶体管T3的源极区域及补偿晶体管T6的源极区域T3-s/T6-s耦接,形成驱动复位晶体管T3的第二极及补偿晶体管T6的第二极T3-2/T6-2。第四连接部364经由过孔3642与第二有源半导体层340耦接。具体地,第四连接部364经由过孔3642与稳压晶体管T2的源极区域T2-s耦接,形成稳压晶体管T2的第二极T2-2。The fourth connection portion 364 is coupled to the first active semiconductor layer 310 through the via hole 3641 . Specifically, the fourth connection portion 364 is coupled to the source region of the drive reset transistor T3 and the source region T3-s/T6-s of the compensation transistor T6 through the via hole 3641, forming the second electrode of the drive reset transistor T3 and the compensation The second pole T3-2/T6-2 of the transistor T6. The fourth connection portion 364 is coupled to the second active semiconductor layer 340 through the via hole 3642 . Specifically, the fourth connection portion 364 is coupled to the source region T2-s of the voltage-stabilizing transistor T2 via the via hole 3642 to form the second electrode T2-2 of the voltage-stabilizing transistor T2.
第五连接部365经由过孔3651与第三导电层330耦接。第五连接部365经由过孔3652与第二导电层320耦接。具体地,第五连接部365经由过孔3652与驱动晶体管T1的栅极T1-g及电容器C的第一极C1耦接。第五连接部365经由过孔3653与第二有源半导体层340耦接。具体地,第五连接部365经由过孔3653与稳压晶体管T2的漏极区域T2-d耦接,形成稳压晶体管T2的第一极T2-1。The fifth connection portion 365 is coupled to the third conductive layer 330 through the via hole 3651 . The fifth connection portion 365 is coupled to the second conductive layer 320 through the via hole 3652 . Specifically, the fifth connection portion 365 is coupled to the gate electrode T1 - g of the driving transistor T1 and the first electrode C1 of the capacitor C through the via hole 3652 . The fifth connection portion 365 is coupled to the second active semiconductor layer 340 through the via hole 3653 . Specifically, the fifth connection portion 365 is coupled to the drain region T2-d of the voltage-stabilizing transistor T2 through the via hole 3653, and forms the first electrode T2-1 of the voltage-stabilizing transistor T2.
第六连接部366经由过孔3662与第一有源半导体层310耦接。具体地,第六连接部366经由过孔3662与第一发光控制晶体管T7的漏极区域T7-d耦接,形成第一发光控制晶体管T7的第一极T7-1。The sixth connection portion 366 is coupled to the first active semiconductor layer 310 through the via hole 3662 . Specifically, the sixth connection portion 366 is coupled to the drain region T7-d of the first light-emitting control transistor T7 via the via hole 3662, and forms the first electrode T7-1 of the first light-emitting control transistor T7.
第七连接部367经由过孔3671与第一有源半导体层310耦接。具体地,第七连接部367经由过孔3671与第二发光控制晶体管T8的源极区域T8-s耦接,形成第二发光控制晶体管T8的第二极T8-2。第七连接部367经由过孔3672与第二有源半导体层340耦接。具体地,第七连接部367经由过孔3672与发光复位晶体管T4源极区域T4-s耦接,形成发光复位晶体管T4的第二极T4-2。The seventh connection portion 367 is coupled to the first active semiconductor layer 310 through the via hole 3671 . Specifically, the seventh connection portion 367 is coupled to the source region T8-s of the second light-emitting control transistor T8 through the via hole 3671, and forms the second electrode T8-2 of the second light-emitting control transistor T8. The seventh connection portion 367 is coupled to the second active semiconductor layer 340 through the via hole 3672 . Specifically, the seventh connection portion 367 is coupled to the source region T4-s of the light-emitting reset transistor T4 through the via hole 3672, and forms the second electrode T4-2 of the light-emitting reset transistor T4.
第八连接部368经由过孔3681与第二有源半导体层340耦接。具体地,第八连接部368经由过孔3681与发光复位晶体管T4的源极区域T4-d耦接,形成发光复位晶体管T4的第一极T4-1。另外,第八连接部368及其上的过孔3682可以作为沿Y方向的相邻像素电路的第二连接部362及其上的过孔3621。其具体的连接方式及作用与该像素电路中的第二连接部362及其上的过孔3621类似,在此不再赘述。为了构图需要,相邻像素电路的第二连接部362及其上的过孔3621被如上设置。The eighth connection portion 368 is coupled to the second active semiconductor layer 340 through the via hole 3681 . Specifically, the eighth connection portion 368 is coupled to the source region T4-d of the light-emitting reset transistor T4 through the via hole 3681, and forms the first electrode T4-1 of the light-emitting reset transistor T4. In addition, the eighth connection portion 368 and the via hole 3682 thereon may serve as the second connection portion 362 and the via hole 3621 thereon of the adjacent pixel circuits along the Y direction. The specific connection method and function thereof are similar to the second connection portion 362 in the pixel circuit and the via hole 3621 thereon, and are not repeated here. For patterning needs, the second connection parts 362 of adjacent pixel circuits and the via holes 3621 thereon are arranged as above.
在本公开的实施例中,阵列基板还包括位于第四导电层的背离衬底一侧的并与该第四导电层绝缘隔离的第五导电层。In an embodiment of the present disclosure, the array substrate further includes a fifth conductive layer located on a side of the fourth conductive layer away from the substrate and insulated from the fourth conductive layer.
图11示出了根据本公开的实施例的阵列基板中的第五导电层370的平面示意图。如图11所示,第五导电层包括沿行方向X设置的数据信号线DAL、第一电源电压线VDL、以及第二电源电压线VSL。数据信号线DAL沿列方向Y延伸,并经由过孔3711与第四导电层360的所述第三连接部363耦接。第一电源电压线VDL沿列方向Y延伸,并经由过孔3721与第四导电层360的第三连接部363耦接。第二电源电压线VSL沿列方向Y延伸,并经由过孔3731与第四导电层360的第七连接部367耦接。在本公开的实施例中,第二电源电压线VSL沿列方向Y延伸的距离小于数据信号线DAL和第一电源电压线VDL。第二电源电压线VSL可以用作发光器件,例如OLED,的阴极。FIG. 11 shows a schematic plan view of the fifth conductive layer 370 in the array substrate according to an embodiment of the present disclosure. As shown in FIG. 11 , the fifth conductive layer includes a data signal line DAL, a first power supply voltage line VDL, and a second power supply voltage line VSL arranged along the row direction X. The data signal line DAL extends along the column direction Y, and is coupled to the third connection portion 363 of the fourth conductive layer 360 through the via hole 3711 . The first power supply voltage line VDL extends along the column direction Y, and is coupled to the third connection portion 363 of the fourth conductive layer 360 through the via hole 3721 . The second power supply voltage line VSL extends along the column direction Y, and is coupled to the seventh connection portion 367 of the fourth conductive layer 360 through the via hole 3731 . In an embodiment of the present disclosure, the distance over which the second power supply voltage line VSL extends in the column direction Y is smaller than that of the data signal line DAL and the first power supply voltage line VDL. The second power supply voltage line VSL may be used as a cathode of a light emitting device such as an OLED.
在本公开的实施例中,第一电源电压线VDL具有一个闭合的矩形部件371。参考图8和11,该矩形部件371沿行方向X设置的第二条沿Y方向延伸的边在衬底上的正投影与第二有源半导体层340的第一部分341在衬底上的正投影重叠。这种布置可以使第二有源半导体层340与在第五导电层370背离衬底一侧的、并与第五导电层370邻近设置的封装层隔离,从而避免封装层中的氢元素使第二有源半导体层340中的氧化物材料,例如金属氧化物材料,的性能不稳定。In the embodiment of the present disclosure, the first power supply voltage line VDL has a closed rectangular part 371 . 8 and 11 , the orthographic projection of the second side extending in the Y direction of the rectangular member 371 disposed along the row direction X on the substrate is the same as the orthographic projection on the substrate of the first portion 341 of the second active semiconductor layer 340 on the substrate. Projections overlap. This arrangement can isolate the second active semiconductor layer 340 from the encapsulation layer on the side of the fifth conductive layer 370 away from the substrate and adjacent to the fifth conductive layer 370, thereby preventing the hydrogen element in the encapsulation layer from causing the first The properties of oxide materials in the second active semiconductor layer 340, such as metal oxide materials, are unstable.
在本公开的实施例中,第二电源电压线VSL在衬底上的正投影与第二有源半导体层340的第二部分342在衬底上的正投影重叠。第二电源电压线VSL这种布置与上述第一电源电压线VDL的设置的作用类似,可以使第二有源半导体层340与在第五导电层370背离衬底一侧的、并与第五导电层370邻近设置的封装层隔离,从而避免封装层中的氢元素使第二有源半 导体层340中的氧化物材料的性能不稳定。In an embodiment of the present disclosure, the orthographic projection of the second power supply voltage line VSL on the substrate overlaps the orthographic projection of the second portion 342 of the second active semiconductor layer 340 on the substrate. This arrangement of the second power supply voltage line VSL has a similar effect to the arrangement of the first power supply voltage line VDL described above. The conductive layer 370 is isolated from the encapsulation layer disposed adjacent to it, so as to prevent the hydrogen element in the encapsulation layer from destabilizing the performance of the oxide material in the second active semiconductor layer 340 .
图12示出了包括堆叠的第一有源半导体层、第一导电层、第二导电层、第二有源半导体层、第三导电层和第四导电层的像素电路(由此的阵列基板)的平面布局示意图。如图12所示,平面布局图380包括第一有源半导体层310、第一导电层320、第二导电层330、第二有源半导体层340、第三导电层350、第四导电层360和第五导电层370。为了便于查看,图12示出了驱动晶体管T1的栅极T1-g、稳压晶体管T2的栅极T2-g、驱动复位晶体管T3的栅极T3-g、发光复位晶体管T4的栅极T4-g、数据写入晶体管T5的栅极T5-g、补偿晶体管T6的栅极T6-g、存储电容C的第一极板C1、第一发光控制晶体管T7的栅极T7-g和第二发光控制晶体管T8的栅极T8-g。图12还示出了一条通过过孔3651、补偿晶体管T6的栅极T6-g和稳压晶体管T2的栅极T2-g的所在的阵列基板的截线A1A2。下面参照图13来对沿截线A1A2截取的截面图进行说明。FIG. 12 shows a pixel circuit including a stacked first active semiconductor layer, a first conductive layer, a second conductive layer, a second active semiconductor layer, a third conductive layer and a fourth conductive layer (thus an array substrate). ) schematic diagram of the floor plan. As shown in FIG. 12 , the plan layout diagram 380 includes a first active semiconductor layer 310 , a first conductive layer 320 , a second conductive layer 330 , a second active semiconductor layer 340 , a third conductive layer 350 , and a fourth conductive layer 360 and the fifth conductive layer 370 . For ease of viewing, FIG. 12 shows the gate T1-g of the driving transistor T1, the gate T2-g of the voltage-stabilizing transistor T2, the gate T3-g of the driving reset transistor T3, and the gate T4-g of the light-emitting reset transistor T4. g, the gate T5-g of the data writing transistor T5, the gate T6-g of the compensation transistor T6, the first plate C1 of the storage capacitor C, the gate T7-g of the first light emission control transistor T7 and the second light emission The gate T8-g of the control transistor T8. FIG. 12 also shows a stub A1A2 passing through the array substrate where the via hole 3651, the gate T6-g of the compensation transistor T6 and the gate T2-g of the voltage regulator transistor T2 are located. A sectional view taken along the section line A1A2 will be described below with reference to FIG. 13 .
图13示出了根据本公开的实施例的沿图12中的线A1A2截取的阵列基板的横截面结构示意图。如图13所示,并参考图5至12,阵列基板10包括:衬底300;位于衬底300上的第一缓冲层101;以及位于第一缓冲层101上的第一有源半导体层310。该截面图示出了第一有源半导体层310包括的补偿晶体管T6的沟道区T6-c。FIG. 13 shows a schematic cross-sectional structure diagram of the array substrate taken along the line A1A2 in FIG. 12 according to an embodiment of the present disclosure. As shown in FIG. 13 , and referring to FIGS. 5 to 12 , the array substrate 10 includes: a substrate 300 ; a first buffer layer 101 on the substrate 300 ; and a first active semiconductor layer 310 on the first buffer layer 101 . The cross-sectional view shows the channel region T6 - c of the compensation transistor T6 included in the first active semiconductor layer 310 .
在本公开的实施例中,如图13所示,阵列基板10还包括:覆盖第一缓冲层101和第一有源半导体层310的第一栅极绝缘层102;以及位于第一栅极绝缘层102远离衬底300一侧的第一导电层320。该截面示出了第一导电层320包括的扫描信号线GAL。如图13所示,扫描信号线GAL在衬底300上的正投影与第一有源半导体层310包括的补偿晶体管T6的沟道区T6-c在衬底300上的正投影的重叠的部分为补偿晶体管T6的栅极T6-g。In an embodiment of the present disclosure, as shown in FIG. 13 , the array substrate 10 further includes: a first gate insulating layer 102 covering the first buffer layer 101 and the first active semiconductor layer 310 ; and a first gate insulating layer 102 located on the first gate insulating layer The first conductive layer 320 on the side of the layer 102 remote from the substrate 300 . The cross section shows the scan signal line GAL included in the first conductive layer 320 . As shown in FIG. 13 , the orthographic projection of the scanning signal line GAL on the substrate 300 overlaps with the orthographic projection of the channel region T6 - c of the compensation transistor T6 included in the first active semiconductor layer 310 on the substrate 300 . is the gate T6-g of the compensation transistor T6.
在本公开的实施例中,如图13所示,阵列基板10还包括:位于第一导电层320的远离衬底300一侧的第一层间绝缘层103;位于第一层间绝缘层103远离衬底300一侧的第二导电层330。该截面图示出了第二导电层包括的稳压控制信号线STVL和一个连接部331。稳压控制信号线STVL包括稳压晶体管T2的第一栅极T2-g1。In an embodiment of the present disclosure, as shown in FIG. 13 , the array substrate 10 further includes: a first interlayer insulating layer 103 located on the side of the first conductive layer 320 away from the substrate 300 ; the first interlayer insulating layer 103 The second conductive layer 330 on the side away from the substrate 300 . The cross-sectional view shows the voltage regulation control signal line STVL and one connection part 331 included in the second conductive layer. The voltage stabilization control signal line STVL includes the first gate T2-g1 of the voltage stabilization transistor T2.
在本公开的实施例中,如图13所示,阵列基板10还包括:位于第二导电层330的远离衬底300一侧的第二层间绝缘层104;覆盖第二层间绝缘层104的第二缓冲层105;以及位于第二缓冲层105的远离衬底300一侧的第二有源半导体层340。该截面图示出了在衬底300上的正投影与稳压控制信号线STVL上的稳压晶体管T2的第一栅极T2-g1在衬底300上的正投影重叠的稳压晶体管T2的沟道区T2-c。In an embodiment of the present disclosure, as shown in FIG. 13 , the array substrate 10 further includes: a second interlayer insulating layer 104 located on the side of the second conductive layer 330 away from the substrate 300 ; covering the second interlayer insulating layer 104 the second buffer layer 105 ; and the second active semiconductor layer 340 located on the side of the second buffer layer 105 away from the substrate 300 . The cross-sectional view shows the orthographic projection of the voltage-stabilizing transistor T2 on the substrate 300 overlapping the orthographic projection of the first gate T2-g1 of the voltage-stabilizing transistor T2 on the voltage-stabilizing control signal line STVL on the substrate 300 Channel region T2-c.
在本公开的实施例中,如图13所示,阵列基板10还包括:覆盖第二有源半导体层340和第二缓冲层105的第二栅极绝缘层106;位于第二栅极绝缘层106的远离衬底300一侧的第三导电层350。该截面图示出了第三导电层350包括稳压控制信号线STVL。如图13所示,稳压控制信号线STVL在衬底300上的正投影与第二有源半导体层320包括的稳压晶体管T2的沟道区T2-c在衬底300上的正投影的重叠的部分为稳压晶体管T2的第二栅极T2-g2。In an embodiment of the present disclosure, as shown in FIG. 13 , the array substrate 10 further includes: a second gate insulating layer 106 covering the second active semiconductor layer 340 and the second buffer layer 105 ; The third conductive layer 350 on the side of 106 away from the substrate 300 . The cross-sectional view shows that the third conductive layer 350 includes the voltage regulation control signal line STVL. As shown in FIG. 13 , the orthographic projection of the voltage stabilization control signal line STVL on the substrate 300 is the same as the orthographic projection of the channel region T2-c of the voltage stabilization transistor T2 included in the second active semiconductor layer 320 on the substrate 300 The overlapping part is the second gate T2-g2 of the voltage regulator transistor T2.
在本公开的实施例中,如图13所示,阵列基板10还包括:覆盖第三导电层350和第二栅极绝缘层106的第三层间绝缘层107;以及位于第三层间绝缘层107远离衬底300一侧的第四导电层360。参考图10,该截面图示出了第五连接部365。第五连接部365通过过孔3651与第二导电层330上的连接部331耦接。In an embodiment of the present disclosure, as shown in FIG. 13 , the array substrate 10 further includes: a third interlayer insulating layer 107 covering the third conductive layer 350 and the second gate insulating layer 106 ; The fourth conductive layer 360 on the side of the layer 107 remote from the substrate 300 . Referring to FIG. 10 , the cross-sectional view shows the fifth connection portion 365 . The fifth connection portion 365 is coupled to the connection portion 331 on the second conductive layer 330 through the via hole 3651 .
在本公开的实施例中,如图13所示,阵列基板10还包括:覆盖第四导电层360和第三层间绝缘层107的第一平坦层108;以及在第一平坦层108远离衬底300一侧的第五导电层370。该截面图示出了第一电源电压线VDL。In an embodiment of the present disclosure, as shown in FIG. 13 , the array substrate 10 further includes: a first flat layer 108 covering the fourth conductive layer 360 and the third interlayer insulating layer 107 ; The fifth conductive layer 370 on one side of the bottom 300 . The cross-sectional view shows the first power supply voltage line VDL.
在本公开的实施例中,如图13所示,阵列基板10还包括覆盖第五导电层370和第一平坦层108的第二平坦层109。In an embodiment of the present disclosure, as shown in FIG. 13 , the array substrate 10 further includes a second planarization layer 109 covering the fifth conductive layer 370 and the first planarization layer 108 .
图14示出了根据本公开的实施例的沿图12中的线A1A2截取的阵列基板的横截面结构示意图。在本公开的实施例中,如图14所示,该阵列基板10还包括位于衬底100与第一缓冲 层101之间遮挡层400。一方面,当衬底300是透光衬底时,遮挡层400被配置为至少部分遮挡从衬底300的未设置有像素电路的一侧的光入射到像素电路的晶体管的有源半导体层,以便防止晶体管的光劣化。另一方面,遮挡层400被配置为阻挡从衬底释放的粒子进入到像素电路。释放的粒子如果进入到有源半导体层中,同样会劣化晶体管的性能。此外,在粒子是带电粒子的情况下,一旦嵌入到像素电路结构中(例如,嵌入电路结构的介质层中)还会对输入到像素电路的各种信号电压产生干扰,从而影响显示性能。例如,在衬底300为聚酰亚胺衬底时,由于聚酰亚胺材料总是不希望地包含各种杂质离子,在制造阵列基板的热暴露工艺(例如,有源半导体层的生长和诸如金属的导电层的溅射和蒸发)中,这些杂质离子便会从衬底300释放出来进入到像素电路中。FIG. 14 shows a schematic cross-sectional structure diagram of the array substrate taken along the line A1A2 in FIG. 12 according to an embodiment of the present disclosure. In the embodiment of the present disclosure, as shown in FIG. 14 , the array substrate 10 further includes a blocking layer 400 located between the substrate 100 and the first buffer layer 101. On the one hand, when the substrate 300 is a light-transmitting substrate, the blocking layer 400 is configured to at least partially block the light incident from the side of the substrate 300 on which the pixel circuit is not provided to the active semiconductor layer of the transistor of the pixel circuit, in order to prevent photodegradation of the transistor. On the other hand, the blocking layer 400 is configured to block particles released from the substrate from entering the pixel circuit. The released particles can also degrade transistor performance if they enter the active semiconductor layer. In addition, in the case where the particles are charged particles, once embedded in the pixel circuit structure (eg, in the dielectric layer of the embedded circuit structure), it will also interfere with various signal voltages input to the pixel circuit, thereby affecting the display performance. For example, when the substrate 300 is a polyimide substrate, since the polyimide material always contains various impurity ions undesirably, during the thermal exposure process (eg, growth and During sputtering and evaporation of conductive layers such as metals), these impurity ions are released from the substrate 300 into the pixel circuit.
在本公开的实施例中,遮挡层400可不被偏置(即,悬置)。此外,还可以对遮挡层400施加电压偏置以进一步改善屏蔽效果。根据本公开的实施例,施加到遮挡层的电压可为恒定电压。施加到遮挡层的电压可选自下列电压中的一者:第一电源电压Vdd(发光器件的阳极电压)、第二电源电压Vss(发光器件的阴极电压)、驱动复位电压VINT1或其他电压。根据本公开的实施例,施加到遮挡层的电压的范围包括选自下列范围中的一者:-10V~+10V、-5V~+5V、-3V~+3V、-1V~+1V、或-0.5V~+0.5V。根据本公开的实施例,施加到遮挡层的电压可可选自下列电压中的一者:-0.3V、-0.2V、0V、0.1V、0.2V、0.3V或10.1V。根据本公开的实施例,施加到遮挡层的电压可大于第二电源电压Vss小于第一电源电压Vdd;或者,施加到遮挡层的电压可大于驱动复位电压VINT1且小于第一电源电压Vdd。In embodiments of the present disclosure, the blocking layer 400 may not be biased (ie, suspended). In addition, a voltage bias can also be applied to the shielding layer 400 to further improve the shielding effect. According to an embodiment of the present disclosure, the voltage applied to the blocking layer may be a constant voltage. The voltage applied to the blocking layer may be selected from one of the following voltages: a first power supply voltage Vdd (anode voltage of the light emitting device), a second power supply voltage Vss (a cathode voltage of the light emitting device), a driving reset voltage VINT1 or other voltages. According to an embodiment of the present disclosure, the range of the voltage applied to the blocking layer includes one selected from the following ranges: -10V to +10V, -5V to +5V, -3V to +3V, -1V to +1V, or -0.5V~+0.5V. According to an embodiment of the present disclosure, the voltage applied to the blocking layer may be selected from one of the following voltages: -0.3V, -0.2V, 0V, 0.1V, 0.2V, 0.3V, or 10.1V. According to an embodiment of the present disclosure, the voltage applied to the shielding layer may be greater than the second power supply voltage Vss and less than the first power supply voltage Vdd; or, the voltage applied to the shielding layer may be greater than the driving reset voltage VINT1 and less than the first power supply voltage Vdd.
图15示出了根据本公开的实施例的阵列基板的示意性框图。图15示出了一种遮挡层400a的配置。在该配置中,遮挡层400a在阵列基板10的具有像素单元的区域(即,显示区域))上完全覆盖衬底300。图14的横截面结构对应于该配置。通过完全阵列基板的显示区域,遮挡层能够实现最佳的防护效果。FIG. 15 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure. FIG. 15 shows a configuration of a shielding layer 400a. In this configuration, the blocking layer 400a completely covers the substrate 300 on the region of the array substrate 10 having the pixel unit (ie, the display region). The cross-sectional structure of FIG. 14 corresponds to this configuration. Through the display area of the complete array substrate, the shielding layer can achieve the best protection effect.
图16示出了根据本公开的实施例的阵列基板的示意性框图。图16示出了另一遮挡层400b的配置,其中遮挡层400b并没有在阵列基板10的具有像素单元的区域(即,显示区域)上完全覆盖衬底300。在该配置中,遮挡层400b包括具有沿行方向X延伸且沿列方向Y彼此间隔的第一条带401和沿列方向Y延伸且沿行方向X彼此间隔的第二条带402。第一条带401和第二条带402具有相同的宽度(即,与条带的延伸方向垂直的尺寸)。此外,第一条带401和第二条带402的相交部分在衬底300上的正投影和驱动晶体管T1的有源区3101(即,第一有源半导体层310的构成驱动晶体管T1的沟道区T1-c、源极区T1-s和漏极区T1-d的部分)在衬底300上的正投影至少部分重叠。通过该配置,不仅能够充分保护作为像素电路的关键部件的驱动晶体管T1的有源区,而且能够在保证整个遮挡层400b连续的情况下减少遮挡层400b与阵列基板10上的布线之间不希望的重叠,由此减少诸如寄生电容等的不希望的寄生效应。16 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure. FIG. 16 shows another configuration of the shielding layer 400b, wherein the shielding layer 400b does not completely cover the substrate 300 on the area of the array substrate 10 having the pixel unit (ie, the display area). In this configuration, the blocking layer 400b includes a first strip 401 extending in the row direction X and spaced apart from each other in the column direction Y and a second strip 402 extending in the column direction Y and spaced apart from each other in the row direction X. The first strip 401 and the second strip 402 have the same width (ie, a dimension perpendicular to the extending direction of the strips). In addition, the orthographic projection of the intersecting portion of the first strip 401 and the second strip 402 on the substrate 300 and the active region 3101 of the driving transistor T1 (ie, the trench of the first active semiconductor layer 310 constituting the driving transistor T1 The orthographic projections of the channel regions T1-c, portions of the source regions T1-s and the drain regions T1-d) on the substrate 300 at least partially overlap. Through this configuration, not only can the active region of the driving transistor T1, which is a key component of the pixel circuit, be fully protected, but also the undesired connection between the shielding layer 400b and the wiring on the array substrate 10 can be reduced while ensuring the continuity of the entire shielding layer 400b. overlap, thereby reducing unwanted parasitic effects such as parasitic capacitance.
图17示出了根据本公开的实施例的阵列基板的示意性框图。图17示出了另一遮挡层400c的配置,其中与图16的遮挡层400b的配置相似,遮挡层400c同样没有在阵列基板10的具有像素单元的区域(即,显示区域))上完全覆盖衬底300。在该配置中,遮挡层400b具有位于每个子像素中的主体410、用于沿行方向X连接主体410的第一连接部420和用于沿列方向Y连接主体410的第二连接部430。该第一连接部420沿列方向的尺寸Sc1小于主体410沿列方向的尺寸Sb1,该第二连接部430沿行方向的尺寸Sc2小于主体410沿行方向的尺寸Sb2。应理解,在本公开中,术语“尺寸”旨在表示部件的最大尺寸。通过,该配置,能够进一步减小遮挡层与阵列基板中的布线之间的不希望的重叠,从而为了抑制潜在的寄生效应。17 shows a schematic block diagram of an array substrate according to an embodiment of the present disclosure. FIG. 17 shows another configuration of the shielding layer 400c, wherein, similar to the configuration of the shielding layer 400b of FIG. 16, the shielding layer 400c also does not completely cover the area (ie, the display area) of the array substrate 10 having the pixel unit. Substrate 300. In this configuration, the blocking layer 400b has a main body 410 in each subpixel, a first connection portion 420 for connecting the main body 410 in the row direction X, and a second connection portion 430 for connecting the main body 410 in the column direction Y. The dimension Sc1 of the first connection portion 420 along the column direction is smaller than the dimension Sb1 of the main body 410 along the column direction, and the dimension Sc2 of the second connection portion 430 along the row direction is smaller than the dimension Sb2 of the main body 410 along the row direction. It should be understood that in this disclosure, the term "dimension" is intended to mean the largest dimension of a component. With this configuration, undesired overlap between the shielding layer and the wiring in the array substrate can be further reduced, thereby suppressing potential parasitic effects.
在本公开的实施例中,第一连接部420沿列方向的尺寸Sc1可以与第二连接部430沿行方向的尺寸Sc2相同。此外,第一连接部420沿列方向的尺寸Sc1可以与第二连接部430沿行方向的尺寸Sc2不同。第一连接部420沿列方向的尺寸Sc1可小于第二连接部430沿行方向的尺寸Sc2。发明人发现,沿列方向Y延伸的像素单元的数据线DAL(如图11所示)对于 寄生干扰的敏感度要高于沿行方向X延伸的像素电路中的栅极信号线(驱动复位控制信号线RSTL1、扫描信号线GAL、发光控制信号线EML)等。因此,通过适当减小第一连接部420沿列方向的尺寸Sc1并增加第二连接部430沿行方向的尺寸Sc2,可以在减小寄生效应影响的同时确保整个遮挡层的导电性,这样在向阻挡层施加电压偏置时,可以保证偏置电压跨遮挡层是均匀的。In an embodiment of the present disclosure, the dimension Sc1 of the first connection part 420 in the column direction may be the same as the dimension Sc2 of the second connection part 430 in the row direction. In addition, the dimension Sc1 of the first connection part 420 in the column direction may be different from the dimension Sc2 of the second connection part 430 in the row direction. The dimension Sc1 of the first connection part 420 in the column direction may be smaller than the dimension Sc2 of the second connection part 430 in the row direction. The inventor found that the data line DAL of the pixel unit extending along the column direction Y (as shown in FIG. 11 ) is more sensitive to parasitic interference than the gate signal line (driving reset control) in the pixel circuit extending along the row direction X. The signal line RSTL1, the scanning signal line GAL, the light emission control signal line EML) and the like. Therefore, by appropriately reducing the dimension Sc1 of the first connection part 420 along the column direction and increasing the dimension Sc2 of the second connection part 430 along the row direction, the conductivity of the entire shielding layer can be ensured while reducing the influence of parasitic effects. When a voltage bias is applied to the barrier layer, it can be ensured that the bias voltage is uniform across the barrier layer.
图18示出了包括堆叠的遮挡层、有源半导体层、第一导电层、第二导电层、第三导电层和第四导电层的像素电路的平面布局示意图。在图18所示平面布局381中,遮挡层401c具有图17所示的配置。遮挡层401c具有位于每个子像素中的主体411、用于沿行方向连接主体411的第一连接部421和用于沿列方向连接主体410的第二连接部431。该第一连接部421沿列方向的尺寸Sc1小于主体410沿列方向的尺寸Sb1,该第二连接部430沿行方向的尺寸Sc2小于主体410沿列方向的尺寸Sb2。在配置中,主体411形状和尺寸被配置为不仅在垂直衬底的方向上与驱动晶体管T1的有源区3101至少部分重叠,而且还与第四导电层360的第五连接部365至少部分重叠。在本公开的实施例中,第五连接部的至少10%的面积与主体411在垂直衬底的方向重叠。出于实例,图18仅示出了主体411与驱动晶体管T1的有源区3101和第四导电层360的第五连接部365完全重叠的情况,这并不至少限制本公开的范围。由于第五连接部365连接到驱动晶体管T1的栅极,通过遮挡第五连接部365能够有效防止带电粒子对驱动晶体管栅极电压的影响,保证图像的正常显示。18 shows a schematic plan layout of a pixel circuit including a stacked blocking layer, an active semiconductor layer, a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer. In the plan layout 381 shown in FIG. 18 , the shielding layer 401c has the configuration shown in FIG. 17 . The blocking layer 401c has a main body 411 in each sub-pixel, a first connection part 421 for connecting the main body 411 in the row direction, and a second connection part 431 for connecting the main body 410 in the column direction. The dimension Sc1 of the first connecting portion 421 in the column direction is smaller than the dimension Sb1 of the main body 410 in the column direction, and the dimension Sc2 of the second connecting portion 430 in the row direction is smaller than the dimension Sb2 of the main body 410 in the column direction. In the configuration, the body 411 is shaped and sized to not only at least partially overlap the active region 3101 of the driving transistor T1 in a direction perpendicular to the substrate, but also at least partially overlap the fifth connection portion 365 of the fourth conductive layer 360 . In an embodiment of the present disclosure, at least 10% of the area of the fifth connection portion overlaps with the main body 411 in a direction perpendicular to the substrate. For example, FIG. 18 only shows the case where the body 411 completely overlaps the active region 3101 of the driving transistor T1 and the fifth connection 365 of the fourth conductive layer 360 , which does not at least limit the scope of the present disclosure. Since the fifth connection portion 365 is connected to the gate of the driving transistor T1 , blocking the fifth connection portion 365 can effectively prevent the impact of charged particles on the gate voltage of the driving transistor, and ensure normal display of images.
此外,对于图17和图18所示的遮挡层的配置,第二连接部430和431的沿行方向的尺寸(宽度)Sc2可以沿列方向是变化的。在本公开的实施例中,第二连接部与具有相对高的频率的信号的沿行方向延伸的布线重叠的部分的宽度可以大于第二连接部与具有相对低的频率的信号的沿行方向延伸的布线重叠的部分的宽度。该具有相对高的频率的信号的沿行方向延伸的布线例如包括发光控制信号线EML和扫描信号线GAL等。信号频率越高,寄生效应越显著。因此,通过该配置,可以有效减少遮挡层对高频信号的限制干扰。相似地,第一连接部与具有相对高的频率的信号的沿列方向延伸的布线重叠的部分的宽度可以大于第一连接部与具有相对低的频率的信号的沿列方向延伸的布线重叠的部分的宽度。Furthermore, with the configuration of the shielding layer shown in FIGS. 17 and 18 , the dimension (width) Sc2 in the row direction of the second connection parts 430 and 431 may vary in the column direction. In an embodiment of the present disclosure, the width of a portion where the second connection portion overlaps the wiring extending in the row direction of the signal having a relatively high frequency may be larger than the width of the second connection portion and the signal having a relatively low frequency in the row direction The width of the portion where the extended wiring overlaps. The wiring extending in the row direction of the signal having a relatively high frequency includes, for example, the light emission control signal line EML, the scanning signal line GAL, and the like. The higher the signal frequency, the more pronounced the parasitic effect. Therefore, with this configuration, the limiting interference of the shielding layer to the high-frequency signal can be effectively reduced. Similarly, the width of the portion where the first connection portion overlaps the wiring extending in the column direction of the signal having a relatively high frequency may be larger than the width of the portion where the first connection portion overlaps the wiring extending in the column direction of the signal having a relatively low frequency. section width.
此外,在本公开的实施例中,第二连接部与具有恒定信号的沿行方向延伸的布线重叠的部分的宽度可以大于第二连接部与不具有恒定信号的沿行方向延伸的布线重叠的部分的宽度。该与具有恒定信号的沿行方向延伸的布线可包括例如发光复位电压线VINL和第一电源电压线VDL等。相似地,第一连接部与具有恒定信号的沿列方向延伸的布线重叠的部分的宽度可以大于第一连接部与不具有恒定信号的沿列方向延伸的布线重叠的部分的宽度。图19示出了根据本公开实施例的显示面板的结构示意图。如图19所示,显示面板700可以包括根据本公开任一实施例所述的阵列基板20或包括根据本公开的任一实施例所述的像素电路100的阵列基板。Furthermore, in an embodiment of the present disclosure, the width of the portion where the second connection portion overlaps the wiring extending in the row direction having the constant signal may be greater than the width of the portion where the second connection portion overlaps the wiring extending in the row direction having no constant signal. section width. The wiring extending in the row direction with a constant signal may include, for example, a light emitting reset voltage line VINL, a first power supply voltage line VDL, and the like. Similarly, the width of the portion where the first connection portion overlaps the wiring extending in the column direction having the constant signal may be greater than the width of the portion where the first connection portion overlaps the wiring extending in the column direction having no constant signal. FIG. 19 shows a schematic structural diagram of a display panel according to an embodiment of the present disclosure. As shown in FIG. 19 , the display panel 700 may include the array substrate 20 according to any embodiment of the present disclosure or the array substrate including the pixel circuit 100 according to any embodiment of the present disclosure.
例如,显示面板700还可以包括其他部件,例如时序控制器、信号解码电路、电压转换电路等,这些部件例如可以采用已有的常规部件,这里不再详述。For example, the display panel 700 may further include other components, such as a timing controller, a signal decoding circuit, a voltage conversion circuit, etc., for example, these components may use existing conventional components, which will not be described in detail here.
例如,显示面板700可以为矩形面板、圆形面板、椭圆形面板或多边形面板等。另外,显示面板700不仅可以为平面面板,也可以为曲面面板,甚至球面面板。例如,显示面板700还可以具备触控功能,即显示面板700可以为触控显示面板。For example, the display panel 700 may be a rectangular panel, a circular panel, an oval panel, a polygonal panel, or the like. In addition, the display panel 700 can be not only a flat panel, but also a curved panel, or even a spherical panel. For example, the display panel 700 may also have a touch function, that is, the display panel 700 may be a touch display panel.
本公开的实施例还提供一种显示装置,该显示装置包括根据本公开任一实施例所述的显示面板。Embodiments of the present disclosure also provide a display device including the display panel according to any embodiment of the present disclosure.
图20示出了根据本公开的实施例的显示装置的结构示意图。如图20所示,显示装置800可以包括根据本公开任一实施例所述的显示面板700。FIG. 20 shows a schematic structural diagram of a display device according to an embodiment of the present disclosure. As shown in FIG. 20 , the display device 800 may include the display panel 700 according to any embodiment of the present disclosure.
显示装置800可以是于手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。The display device 800 may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and the like.
图21示出了一种像素电路,该像素电路为包括7个晶体管和1个电容的7T1C结构。在 像素电路中,晶体管T1和T2的有源层包括氧化物半导体材料,晶体管T1和T2可以为N型氧化物晶体管。晶体管T3-T7的有源层包括硅半导体材料,例如低温多晶硅。FIG. 21 shows a pixel circuit, which is a 7T1C structure including 7 transistors and 1 capacitor. In the pixel circuit, the active layers of the transistors T1 and T2 include oxide semiconductor materials, and the transistors T1 and T2 may be N-type oxide transistors. The active layers of transistors T3-T7 include silicon semiconductor material, such as low temperature polysilicon.
图22示出用于图21示出的电路的遮挡层。图26示出了该遮挡层0的位置,该实施例中,遮挡层位于有源层半导体层与衬底之间且至少与有源半导体绝缘隔离。FIG. 22 shows a shielding layer for the circuit shown in FIG. 21 . FIG. 26 shows the position of the shielding layer 0. In this embodiment, the shielding layer is located between the semiconductor layer of the active layer and the substrate and is at least insulated from the active semiconductor.
图23示出包括遮光层的像素电路的各功能层(半导体层和导电层)平面布局。T1和T2的氧化物半导体为镜像设计;遮挡层遮挡硅半导体材料。如图23所示,包括遮光层的像素电路的平面布局整体也为镜像设计;本公开实施例中,镜像设计还可以例如图24,图29所示的包括遮光层的像素电路的平面布局。其中,如图23所示,Da为图21中数据信号端Data[m]接入点,Vinit_OLED为图21中初始信号端Vinit_OLED接入点,N1为图21中节点N1的电位点,其中,N1位于第一源漏层。N4为图21中节点N4的电位点,ELVDD为图21中电源端ELVDD电位点,ELVDD位于第一源漏层。遮挡层符合下列条件中的至少一者:FIG. 23 shows the plan layout of each functional layer (semiconductor layer and conductive layer) of the pixel circuit including the light shielding layer. The oxide semiconductors of T1 and T2 are mirrored designs; the shielding layer shields the silicon semiconductor material. As shown in FIG. 23 , the overall plane layout of the pixel circuit including the light shielding layer is also a mirror design; in the embodiment of the present disclosure, the mirror design can also be, for example, the plane layout of the pixel circuit including the light shielding layer shown in FIG. 24 and FIG. 29 . Among them, as shown in Figure 23, Da is the access point of the data signal terminal Data[m] in Figure 21, Vinit_OLED is the access point of the initial signal terminal Vinit_OLED in Figure 21, N1 is the potential point of the node N1 in Figure 21, wherein, N1 is located in the first source-drain layer. N4 is the potential point of the node N4 in FIG. 21 , ELVDD is the potential point of the power supply terminal ELVDD in FIG. 21 , and ELVDD is located in the first source-drain layer. The occlusion layer meets at least one of the following conditions:
1.遮挡层主体部覆盖硅半导体材料,N1节点与遮挡层覆盖面积大于10%;以稳定N1节点;1. The main body of the shielding layer is covered with silicon semiconductor material, and the coverage area of the N1 node and the shielding layer is greater than 10%; to stabilize the N1 node;
2.遮挡层与氧化物沟道不重叠,或者重叠面积小于90%,缓解氧化物层上的寄生电容;2. The shielding layer does not overlap with the oxide channel, or the overlapping area is less than 90%, which alleviates the parasitic capacitance on the oxide layer;
3.遮挡层与初始化信号线交叠面积尽量减小,以减小初始化信号线上负载,在这布局设计为避开T7位置弧状的走线,只与横向上走线交叠,例如,如图29所示,导电部47在衬底基板正投影弯折延伸,以减小遮光层与第二初始信号线Vinit2的交叠;以及3. The overlapping area between the shielding layer and the initialization signal line should be minimized to reduce the load on the initialization signal line. The layout is designed to avoid the arc-shaped line at the T7 position and only overlap the horizontal line. For example, if As shown in FIG. 29, the conductive portion 47 is bent and extended on the orthographic projection of the base substrate to reduce the overlap between the light shielding layer and the second initial signal line Vinit2; and
4.初始化信号线可以在与遮挡层交叠位置做缩窄,同样遮挡层也可以做缩窄。4. The initialization signal line can be narrowed at the overlapping position with the blocking layer, and the blocking layer can also be narrowed.
图24示出了本公开的实施例的像素电路的平面布局。遮挡层沿行和列方向的连接线尽量避开扫描线等,避免寄生效应。图24中N1为图21中节点N1的电位点,其中,N1位于第一源漏层。FIG. 24 shows a plan layout of a pixel circuit of an embodiment of the present disclosure. The connection lines of the shielding layer along the row and column directions should avoid scanning lines as much as possible to avoid parasitic effects. N1 in FIG. 24 is the potential point of the node N1 in FIG. 21 , wherein N1 is located in the first source-drain layer.
根据本公开的实施例,可通过以下方式实现对遮挡层的偏置。According to an embodiment of the present disclosure, the biasing of the blocking layer can be implemented in the following manner.
1、延伸至周边进行恒定电位连接,可以通过外围一圈信号线电连,也可以不是一圈,可实现信号接入即可,可以使用gate1,gate2,SD1,SD2,ITO层中一层或者多层实现搭接。该方式如图25所示;1. Extend to the periphery for constant potential connection. It can be electrically connected through a circle of signal lines in the periphery, or it may not be a circle. Signal access can be achieved. You can use gate1, gate2, SD1, SD2, one of the ITO layers or Multi-layered to achieve overlapping. This method is shown in Figure 25;
2、AA区中实现电连,但需要避开其他信号连接孔;2. The electrical connection is realized in the AA area, but other signal connection holes need to be avoided;
实施例三:采用VDD,或者Vint信号的话,可以在VDD线、Vint线交叠位置进行打孔连接。Embodiment 3: If a VDD or Vint signal is used, a hole can be connected at the overlapping position of the VDD line and the Vint line.
具体实施时,SD1,SD2层为源漏电极膜层,材料可以可以包括金属材料,例如可以是钼,铝,铜,钛,铌,其中之一或者合金,或者钼/钛合金或者叠层等,或者可以是钛/铝/钛叠层。In specific implementation, the SD1 and SD2 layers are source-drain electrode film layers, and the material may include metal materials, such as molybdenum, aluminum, copper, titanium, niobium, one of them or alloys, or molybdenum/titanium alloys or laminates, etc. , or can be a titanium/aluminum/titanium stack.
具体实施时,gate1,gate2层为栅电极膜层,可以与氧化物晶体管的栅极采用相同材料,和/或同层制作,例如材料可以是钼,铝,铜,钛,铌,其中之一或者合金,或者钼/钛合金或者叠层等。遮挡层加载的电位可以是电源线VDD(电压源电位)加载的电位相同;也可以是初始化信号线加载的电位相同;也可以是阴极(阴极电位VSS)加载的电位相同;也可以是其它固定电位,例如,固定电位的范围为-10V~+10V,又例如,固定电位的范围为-5V~+5V,又例如,固定电位的范围为-3V~+3V,又例如,固定电位的范围为-1V~+1V,又例如,固定电位的范围为-0.5V~+0.5V,又例如,固定电位的范围为0V,又例如,固定电位的范围为0.1V,又例如,固定电位的范围为10.1V,又例如,固定电位的范围为0.2V,又例如,固定电位的范围为-0.2V,又例如,固定电位的范围为0.3V,又例如,固定电位的范围为-0.3V。In specific implementation, the gate1 and gate2 layers are gate electrode film layers, which can be made of the same material and/or the same layer as the gate of the oxide transistor, for example, the material can be molybdenum, aluminum, copper, titanium, niobium, one of which Or alloys, or molybdenum/titanium alloys or laminates, etc. The potential loaded by the shielding layer can be the same potential loaded by the power supply line VDD (voltage source potential); it can also be the same potential loaded by the initialization signal line; it can also be the same potential loaded by the cathode (cathode potential VSS); it can also be other fixed potentials. Potential, for example, the range of the fixed potential is -10V ~ +10V, another example, the range of the fixed potential is -5V ~ +5V, another example, the range of the fixed potential is -3V ~ +3V, another example, the range of the fixed potential is -1V~+1V, another example, the range of the fixed potential is -0.5V~+0.5V, another example, the range of the fixed potential is 0V, another example, the range of the fixed potential is 0.1V, another example, the range of the fixed potential is The range is 10.1V, another example, the range of the fixed potential is 0.2V, another example, the range of the fixed potential is -0.2V, another example, the range of the fixed potential is 0.3V, another example, the range of the fixed potential is -0.3V .
具体的,遮光层加载的电位可以大于阴极(阴极电位VSS)加载的电位,且小于电源线VDD加载的电位;或者,遮光层加载的电位可以大于初始化信号线加载的电位,且小于电源线VDD加载的电位。Specifically, the potential loaded by the light shielding layer may be greater than the potential loaded by the cathode (cathode potential VSS) and less than the potential loaded by the power supply line VDD; or, the potential loaded by the light shielding layer may be greater than the potential loaded by the initialization signal line, and less than the power supply line VDD. loaded potential.
具体实施时,遮挡层可以是非晶硅材料,或者金属材料,或者为氧化物半导体材料如IGZO,或者多晶硅材料,以及导体化后的半导体材料等。In specific implementation, the shielding layer may be an amorphous silicon material, or a metal material, or an oxide semiconductor material such as IGZO, or a polysilicon material, or a conductive semiconductor material.
如图27所示,为本公开阵列基板一种示例性实施例中像素驱动电路的电路结构示意图。 该像素驱动电路可以包括:驱动晶体管T3、第一晶体管T1、第二晶体管T2、第三晶体管T3、第四晶体管T4、第五晶体管T5、第六晶体管T6、第七晶体管T7、电容C。其中,第四晶体管T4的第一极连接数据信号端Da、第二极连接驱动晶体管T3的第一极,栅极连接第二栅极驱动信号端G2;第五晶体管T5的第一极连接第一电源端VDD,第二极连接驱动晶体管DT的第一极,栅极连接使能信号端EM;驱动晶体管T3的栅极连接节点N;第二晶体管T2的第一极连接节点N,第二极连接驱动晶体管T3的第二极,栅极连接第一栅极驱动信号端G1;第六晶体管T6的第一极连接驱动晶体管T3的第二极,第二极连接第七晶体管T7的第一极,栅极连接使能信号端EM,第七晶体管T7的第二极连接第二初始信号端Vinit2,栅极连接第二复位信号端Re2;第一晶体管T1的第一极连接节点N,第二极连接第一初始信号端Vinit1,栅极连接第一复位信号端Re1,电容C连接于第一电源端VDD和节点N之间。该像素驱动电路可以连接一发光单元OLED,用于驱动该发光单元OLED发光,发光单元OLED可以连接于第六晶体管T6的第二极和第二电源端VSS之间。其中,第一晶体管T1和第二晶体管T2可以为N型金属氧化物晶体管,N型金属氧化物晶体管具有较小的漏电流,从而可以避免发光阶段,节点N通过第一晶体管T1和第二晶体管T2漏电。同时,驱动晶体管T3、第三晶体管T3、第四晶体管T4、第五晶体管T5、第六晶体管T6、第七晶体管T7可以为低温多晶体硅晶体管,低温多晶硅晶体管具有较高的载流子迁移率,从而有利于实现高分辨率、高反应速度、高像素密度、高开口率的显示面板。第一初始信号端和第二初始信号端可以根据实际情况输出相同或不同电压信号。As shown in FIG. 27 , it is a schematic diagram of a circuit structure of a pixel driving circuit in an exemplary embodiment of the array substrate of the present disclosure. The pixel driving circuit may include: a driving transistor T3, a first transistor T1, a second transistor T2, a third transistor T3, a fourth transistor T4, a fifth transistor T5, a sixth transistor T6, a seventh transistor T7, and a capacitor C. The first pole of the fourth transistor T4 is connected to the data signal terminal Da, the second pole is connected to the first pole of the driving transistor T3, the gate is connected to the second gate driving signal terminal G2; the first pole of the fifth transistor T5 is connected to the first pole of the driving transistor T3. A power supply terminal VDD, the second pole is connected to the first pole of the driving transistor DT, the gate is connected to the enable signal terminal EM; the gate of the driving transistor T3 is connected to the node N; the first pole of the second transistor T2 is connected to the node N, and the second pole is connected to the node N. The pole is connected to the second pole of the driving transistor T3, the gate is connected to the first gate driving signal terminal G1; the first pole of the sixth transistor T6 is connected to the second pole of the driving transistor T3, and the second pole is connected to the first pole of the seventh transistor T7 pole, the gate is connected to the enable signal terminal EM, the second pole of the seventh transistor T7 is connected to the second initial signal terminal Vinit2, the gate is connected to the second reset signal terminal Re2; the first pole of the first transistor T1 is connected to the node N, The diode is connected to the first initial signal terminal Vinit1, the gate is connected to the first reset signal terminal Re1, and the capacitor C is connected between the first power terminal VDD and the node N. The pixel driving circuit may be connected to a light-emitting unit OLED for driving the light-emitting unit OLED to emit light, and the light-emitting unit OLED may be connected between the second pole of the sixth transistor T6 and the second power terminal VSS. The first transistor T1 and the second transistor T2 can be N-type metal oxide transistors, and the N-type metal oxide transistor has a smaller leakage current, so that the light-emitting stage can be avoided, and the node N passes through the first transistor T1 and the second transistor. T2 leakage. Meanwhile, the driving transistor T3, the third transistor T3, the fourth transistor T4, the fifth transistor T5, the sixth transistor T6, and the seventh transistor T7 may be low temperature polysilicon transistors, and the low temperature polysilicon transistors have higher carrier mobility , which is conducive to realizing a display panel with high resolution, high response speed, high pixel density, and high aperture ratio. The first initial signal terminal and the second initial signal terminal may output the same or different voltage signals according to actual conditions.
如图28所示,为图27像素驱动电路一种驱动方法中各节点的时序图。其中,G1表示第一栅极驱动信号端G1的时序,G2表示第二栅极驱动信号端G2的时序,Re1表示第一复位信号端Re1的时序,Re2表示第二复位信号端Re2的时序,EM表示使能信号端EM的时序,Da表示数据信号端Da的时序。该像素驱动电路的驱动方法可以包括第一复位阶段t1、补偿阶段t2,第二复位阶段T3、发光阶段t4。在第一复位阶段t1:第一复位信号端Re1输出高电平信号,第一晶体管T1导通,第一初始信号端Vinit1向节点N输入初始信号。在补偿阶段t2:第一栅极驱动信号端G1输出高电平信号,第二栅极驱动信号端G2输出低电平信号,第四晶体管T4、第二晶体管T2,同时数据信号端Da输出驱动信号以向节点N写入电压Vdata+Vth,其中Vdata为驱动信号的电压,Vth为驱动晶体管T3的阈值电压,在第二复位阶段t3,第二复位信号端Re2输出低电平信号,第七晶体管T7导通,第二初始信号端Vinit2向第六晶体管T6的第二极输入初始信号。发光阶段t4:使能信号端EM输出低电平信号,第六晶体管T6、第五晶体管T5导通,驱动晶体管T3在电容C存储的电压Vdata+Vth作用下发光。根据驱动晶体管输出电流公式I=(μWCox/2L)(Vgs-Vth) 2,其中,μ为载流子迁移率;Cox为单位面积栅极电容量,W为驱动晶体管沟道的宽度,L驱动晶体管沟道的长度,Vgs为驱动晶体管栅源电压差,Vth为驱动晶体管阈值电压。本公开像素驱动电路中驱动晶体管的输出电流I=(μWCox/2L)(Vdata+Vth-Vdd-Vth) 2。该像素驱动电路能够避免驱动晶体管阈值对其输出电流的影响。 As shown in FIG. 28 , it is a timing diagram of each node in a driving method of the pixel driving circuit of FIG. 27 . Among them, G1 represents the timing of the first gate driving signal terminal G1, G2 represents the timing of the second gate driving signal terminal G2, Re1 represents the timing of the first reset signal terminal Re1, Re2 represents the timing of the second reset signal terminal Re2, EM represents the timing of the enable signal terminal EM, and Da represents the timing of the data signal terminal Da. The driving method of the pixel driving circuit may include a first reset stage t1, a compensation stage t2, a second reset stage T3, and a light-emitting stage t4. In the first reset stage t1 : the first reset signal terminal Re1 outputs a high level signal, the first transistor T1 is turned on, and the first initial signal terminal Vinit1 inputs an initial signal to the node N. In the compensation stage t2: the first gate driving signal terminal G1 outputs a high-level signal, the second gate driving signal terminal G2 outputs a low-level signal, the fourth transistor T4, the second transistor T2, and the data signal terminal Da output driving The signal is to write the voltage Vdata+Vth to the node N, where Vdata is the voltage of the driving signal, and Vth is the threshold voltage of the driving transistor T3. In the second reset stage t3, the second reset signal terminal Re2 outputs a low-level signal, and the seventh The transistor T7 is turned on, and the second initial signal terminal Vinit2 inputs an initial signal to the second pole of the sixth transistor T6. Light-emitting stage t4: the enable signal terminal EM outputs a low-level signal, the sixth transistor T6 and the fifth transistor T5 are turned on, and the driving transistor T3 emits light under the action of the voltage Vdata+Vth stored in the capacitor C. According to the driving transistor output current formula I=(μWCox/2L)(Vgs-Vth) 2 , where μ is the carrier mobility; Cox is the gate capacitance per unit area, W is the channel width of the driving transistor, and L drives The length of the transistor channel, Vgs is the gate-source voltage difference of the driving transistor, and Vth is the threshold voltage of the driving transistor. The output current I=(μWCox/2L)(Vdata+Vth−Vdd−Vth) 2 of the driving transistor in the pixel driving circuit of the present disclosure. The pixel driving circuit can avoid the influence of the threshold value of the driving transistor on its output current.
该阵列基板可以包括依次层叠设置的衬底基板、遮光层、第一有源层、第一栅极层、第二栅极层、第二有源层、第三栅极层、第一源漏层。如图29-41所示,图29为本公开阵列基板一种示例性实施例的结构版图,图30为图29中遮光层的结构版图,图31为图29中第一有源层的结构版图,图32为图29中第一栅极层的结构版图,图33为图29中第二栅极层的结构版图,图34为图29中第二有源层的结构版图,图35为图29中第三栅极层的结构版图,图36为图29中第一源漏层的结构版图,图37为图29中遮光层、第一有源层的结构版图,图38为图29中遮光层、第一有源层、第一栅极层的结构版图,图39为图29中遮光层、第一有源层、第一栅极层、第二栅极层的结构版图,图40为图29中遮光层、第一有源层、第一栅极层、第二栅极层、第二有源层的结构版图,图41为图29中遮光层、第一有源层、第一栅极层、第二栅极层、第二有源层、第三栅极层的结构版图。The array substrate may include a base substrate, a light shielding layer, a first active layer, a first gate layer, a second gate layer, a second active layer, a third gate layer, and a first source-drain layer, which are stacked in sequence. Floor. As shown in FIGS. 29-41 , FIG. 29 is a structural layout of an exemplary embodiment of the disclosed array substrate, FIG. 30 is a structural layout of the light shielding layer in FIG. 29 , and FIG. 31 is a structural layout of the first active layer in FIG. 29 Layout, FIG. 32 is the structural layout of the first gate layer in FIG. 29, FIG. 33 is the structural layout of the second gate layer in FIG. 29, FIG. 34 is the structural layout of the second active layer in FIG. 29, and FIG. 35 is the layout. FIG. 29 is the structural layout of the third gate layer, FIG. 36 is the structural layout of the first source and drain layer in FIG. 29 , FIG. 37 is the structural layout of the light shielding layer and the first active layer in FIG. 29 , and FIG. 38 is the structural layout of FIG. 29 The structure layout of the middle light shielding layer, the first active layer and the first gate layer, Fig. 39 is the structure layout of the light shielding layer, the first active layer, the first gate layer and the second gate layer in Fig. 29, Fig. 40 is the structural layout of the light-shielding layer, the first active layer, the first gate layer, the second gate layer, and the second active layer in FIG. 29 , and FIG. 41 is the light-shielding layer, the first active layer, the second active layer in FIG. Structural layout of the first gate layer, the second gate layer, the second active layer, and the third gate layer.
如图29、30、37、38、39、40、41所示,遮光层可以包括多个重复单元0以及连接于重复单元0之间的连接部02。其中,重复单元0可以包括两个沿虚线A对称设置的遮光部01,其中,虚线A沿第二方向Y延伸。如图30所示,遮光部01可以包括第一遮光部011、第二遮光部012、第三遮光部013、第四遮光部014。其中,第二遮光部012和第三遮光部013在衬底基板正投影可以沿第二方向Y延伸,第四遮光部014在衬底基板正投影可以沿第一方向X延伸。第二遮光部012和第三遮光部013可以分别连接于第一遮光部011在第二方向Y上的两侧,且第二遮光部012在衬底基板正投影和第三遮光部013在衬底基板正投影在第一方向X上可以间隔预设距离。第四遮光部014可以位于第一遮光部在第一方向X上的一侧。在同一重复单元0中,在第一方向X上相邻的两个第一遮光部011相连接。在第一方向X上相邻的两个重复单元0中,相邻的两个遮光部01通过各自的第四遮光部014连接。在第二方向Y上相邻两遮光部01可以通过连接部02连接,其中,连接部02可以分别连接两个遮光部01中的第二遮光部012和第三遮光部013,连接部02在衬底基板正投影沿第一方向X延伸。第一方向X和第二方向Y可以相交,例如,第一方向X可以为行方向,第二方向可以为列方向。As shown in FIGS. 29 , 30 , 37 , 38 , 39 , 40 and 41 , the light shielding layer may include a plurality of repeating units 0 and connecting portions 02 connected between the repeating units 0 . Wherein, the repeating unit 0 may include two light-shielding parts 01 symmetrically arranged along the dotted line A, wherein the dotted line A extends along the second direction Y. As shown in FIG. 30 , the light-shielding portion 01 may include a first light-shielding portion 011 , a second light-shielding portion 012 , a third light-shielding portion 013 , and a fourth light-shielding portion 014 . The second light shielding portion 012 and the third light shielding portion 013 may extend along the second direction Y in the orthographic projection of the base substrate, and the fourth light shielding portion 014 may extend along the first direction X in the orthographic projection of the base substrate. The second light-shielding portion 012 and the third light-shielding portion 013 may be connected to the two sides of the first light-shielding portion 011 in the second direction Y, respectively, and the second light-shielding portion 012 is orthographically projected on the base substrate and the third light-shielding portion 013 is on the backing The orthographic projection of the base substrate on the first direction X may be spaced apart by a preset distance. The fourth light shielding portion 014 may be located on one side of the first light shielding portion in the first direction X. In the same repeating unit 0, two first light-shielding portions 011 adjacent to each other in the first direction X are connected. In the two adjacent repeating units 0 in the first direction X, the two adjacent light-shielding portions 01 are connected by respective fourth light-shielding portions 014 . In the second direction Y, two adjacent shading parts 01 can be connected by connecting parts 02, wherein the connecting parts 02 can respectively connect the second shading parts 012 and the third shading parts 013 of the two shading parts 01, and the connecting parts 02 are in the The orthographic projection of the base substrate extends along the first direction X. The first direction X and the second direction Y may intersect, for example, the first direction X may be a row direction, and the second direction may be a column direction.
如图29、31、37、38、39、40、41所示,第一有源层可以包括有源部54、有源部53、有源部55、有源部57。其中,有源部54可以用于形成第四晶体管T4的沟道区,有源部53可以用于形成驱动晶体管T3的沟道区,有源部55可以用于形成第五晶体管T5的沟道区,有源部57可以用于形成第七晶体管T7的沟道区。第一有源层可以由多晶体硅半导体材料形成。As shown in FIGS. 29 , 31 , 37 , 38 , 39 , 40 and 41 , the first active layer may include an active part 54 , an active part 53 , an active part 55 , and an active part 57 . The active part 54 can be used to form the channel region of the fourth transistor T4, the active part 53 can be used to form the channel region of the driving transistor T3, and the active part 55 can be used to form the channel of the fifth transistor T5 region, the active part 57 may be used to form the channel region of the seventh transistor T7. The first active layer may be formed of a polycrystalline silicon semiconductor material.
如图29、32、38、39、40、41所示,第一栅极层可以包括第二栅极驱动信号线G2、使能信号线EM、第二复位信号线Re2,导电部11。第二栅极驱动信号线G2、使能信号线EM、第二复位信号线Re2在衬底基板的正投影均可以沿第一方向X延伸。其中,第二栅极驱动信号线G2可以用于提供图27中的第二栅极驱动信号端,使能信号线EM可以用于提供图27中的使能信号端,第二复位信号线Re2可以用于提供图27中的第二复位信号端。第二栅极驱动信号线G2在衬底基板正投影可以覆盖有源部54在衬底基板的正投影,第二栅极驱动信号线G2的部分结构可以用于形成第四晶体管T4的栅极。使能信号线EM在衬底基板正投影可以覆盖有源部55在衬底基板的正投影,使能信号线EM的部分结构可以用于形成第五晶体管T5的栅极。第二复位信号线Re2在衬底基板正投影覆盖有源部57在衬底基板正投影,第二复位信号线Re2的部分结构可以用于形成第七晶体管T7的栅极。导电部11在衬底基板的正投影可以覆盖有源部53在衬底基板的正投影,导电部11可以用于形成驱动晶体管T3的栅极,同时,导电部11还可以形成电容C的一电极。其中,第一有源层可以通过第一栅极层为掩膜进行掺杂处理,以使被第一栅极层覆盖的第一有源层形成半导体结构,未被第一栅极层覆盖的部分形成导体结构。As shown in FIGS. 29 , 32 , 38 , 39 , 40 and 41 , the first gate layer may include a second gate driving signal line G2 , an enable signal line EM, a second reset signal line Re2 , and a conductive portion 11 . The orthographic projections of the second gate driving signal line G2, the enable signal line EM, and the second reset signal line Re2 on the base substrate may all extend along the first direction X. The second gate driving signal line G2 can be used to provide the second gate driving signal terminal in FIG. 27 , the enable signal line EM can be used to provide the enable signal terminal in FIG. 27 , and the second reset signal line Re2 Can be used to provide the second reset signal terminal in FIG. 27 . The orthographic projection of the second gate driving signal line G2 on the base substrate may cover the orthographic projection of the active portion 54 on the base substrate, and the partial structure of the second gate driving signal line G2 may be used to form the gate of the fourth transistor T4 . The orthographic projection of the enable signal line EM on the base substrate may cover the orthographic projection of the active portion 55 on the base substrate, and a part of the structure of the enable signal line EM may be used to form the gate of the fifth transistor T5. The orthographic projection of the second reset signal line Re2 on the base substrate covers the orthographic projection of the active portion 57 on the base substrate, and a partial structure of the second reset signal line Re2 can be used to form the gate of the seventh transistor T7. The orthographic projection of the conductive part 11 on the base substrate can cover the orthographic projection of the active part 53 on the base substrate, the conductive part 11 can be used to form the gate of the driving transistor T3, and at the same time, the conductive part 11 can also form a part of the capacitor C. electrode. Wherein, the first active layer can be doped by using the first gate layer as a mask, so that the first active layer covered by the first gate layer forms a semiconductor structure, and the first active layer not covered by the first gate layer forms a semiconductor structure. Parts form conductor structures.
如图29、33、39、40、41所示,第二栅极层可以包括第一初始信号线Vinit1、第一复位信号线Re1、第一栅极驱动信号线G1、导电部21、连接部22。第一初始信号线Vinit1、第一复位信号线Re1、第一栅极驱动信号线G1在衬底基板的正投影均可以沿第一方向延伸。其中,第一初始信号线Vinit1可以用于提供图27中的第一初始信号端,第一复位信号线Re1可以用于提供图27中的第一复位信号端,第一栅极驱动信号线G1可以用于提供图27中的第一栅极驱动信号端。导电部21用于电容C的另一电极。其中,在第一方向X上相邻的导电部21可以通过连接部22相互连接,导电部21上可以形成有通孔211。As shown in FIGS. 29 , 33 , 39 , 40 and 41 , the second gate layer may include a first initial signal line Vinit1 , a first reset signal line Re1 , a first gate driving signal line G1 , a conductive portion 21 , and a connecting portion twenty two. The orthographic projections of the first initial signal line Vinit1, the first reset signal line Re1, and the first gate driving signal line G1 on the base substrate may all extend along the first direction. The first initial signal line Vinit1 can be used to provide the first initial signal terminal in FIG. 27 , the first reset signal line Re1 can be used to provide the first reset signal terminal in FIG. 27 , and the first gate driving signal line G1 Can be used to provide the first gate drive signal terminal in FIG. 27 . The conductive portion 21 is used for the other electrode of the capacitor C. As shown in FIG. The conductive parts 21 adjacent to each other in the first direction X may be connected to each other through the connecting parts 22 , and through holes 211 may be formed on the conductive parts 21 .
如图29、34、40、41所示,第二有源层可以包括有源部6,有源部6可以包括有源部61和有源部62,其中,有源部61可以形成第一晶体管T1的沟道区,有源部62可以形成第二晶体管T2的沟道区。其中,如图40所示,有源部6位于有源部61远离有源部62的一侧可以通过过孔71连接第一初始信号线Vinit1,以连接第一晶体管T1第二极和第一初始信号线Vinit1。其中,第二有源层可以由金属氧化物半导体材料形成,例如,氧化铟镓锌。As shown in FIGS. 29 , 34 , 40 and 41 , the second active layer may include an active portion 6 , and the active portion 6 may include an active portion 61 and an active portion 62 , wherein the active portion 61 may form the first active portion 61 . In the channel region of the transistor T1, the active portion 62 may form the channel region of the second transistor T2. As shown in FIG. 40 , the active part 6 is located on the side of the active part 61 away from the active part 62 and can be connected to the first initial signal line Vinit1 through the via hole 71 to connect the second pole of the first transistor T1 and the first Initial signal line Vinit1. Wherein, the second active layer may be formed of a metal oxide semiconductor material, for example, indium gallium zinc oxide.
如图29、35、41所示,第三栅极层可以包括栅线3Re1,栅线3G1、栅线3Re1。其中,栅线3Re1在衬底基板正投影可以沿第一方向延伸,且栅线3Re1在衬底基板正投影与第一复 位信号线Re1在衬底基板正投影至少部分重合。栅线3Re1可以与第一复位信号线Re1通过至少一个过孔连接,该过孔可以位于显示面板的非显示区或显示区。栅线3G1在衬底基板正投影可以沿第一方向延伸,且栅线3G1在衬底基板正投影可以与第一栅极驱动信号线G1在衬底基板正投影至少部分重合。栅线3G1可以与第一栅极驱动信号线G1通过至少一个过孔连接,该过孔可以位于显示面板的非显示区或非显示区。第二有源层可以以第三栅极层为掩膜版进行导体化形成,即被第三栅极层覆盖部分的第二有源层形成半导体结构,未被第三栅极层覆盖的部分形成导体结构。As shown in FIGS. 29 , 35 and 41 , the third gate layer may include a gate line 3Re1 , a gate line 3G1 , and a gate line 3Re1 . The orthographic projection of the grid line 3Re1 on the base substrate may extend along the first direction, and the orthographic projection of the grid line 3Re1 on the base substrate at least partially overlaps with the orthographic projection of the first reset signal line Re1 on the base substrate. The gate line 3Re1 may be connected to the first reset signal line Re1 through at least one via hole, and the via hole may be located in a non-display area or a display area of the display panel. The orthographic projection of the gate line 3G1 on the base substrate may extend along the first direction, and the orthographic projection of the gate line 3G1 on the base substrate may at least partially overlap with the orthographic projection of the first gate driving signal line G1 on the base substrate. The gate line 3G1 may be connected to the first gate driving signal line G1 through at least one via hole, and the via hole may be located in a non-display area or a non-display area of the display panel. The second active layer can be formed by conducting conductorization using the third gate layer as a mask, that is, the second active layer covered by the third gate layer forms a semiconductor structure, and the part not covered by the third gate layer forms a semiconductor structure A conductor structure is formed.
如图29、36所示,第一源漏层可以包括导电部41、导电部42、导电部43、导电部44、导电部45、导电部46、导电部47、第二初始信号线Vinit2,第二初始信号线Vinit2连接导电部47,用于提供图27中的第二初始信号端。其中,第二初始信号线Vinit2在衬底基板正投影可以与第一复位信号线Re1在衬底基板正投影至少部分重合。其中,导电部41可以通过过孔72连接有源部6,通过过孔73连接第一初始信号线Vinit1,以连接第一晶体管T1第二极和第一初始信号线Vinit1,导电部41可以进一步增加有源部6和第一初始信号线Vinit1的接触效率。导电部42可以通过过孔74连接有源部6位于有源部61和有源部62之间的位置,同时通过过孔75连接导电部11,以连接第一晶体管T1的第一极和驱动晶体管T3的栅极。其中,过孔75可以贯穿于导电部21上的通孔211内,且过孔75内填充的导电体不与导电部21电连接。导电部43可以通过过孔76连接连接部22,同时通过过孔77连接有源部55一侧的第一有源层,以连接电容C和第五晶体管T5的第一极。导电部44可以通过过孔78连接位于有源部57和有源部56之间的第一有源层,以连接第六晶体管T6的第二极,其中,导电部44可以用于连接发光单元的阳极。导电部45可以通过过孔710连接有源部6位于有源部62远离有源部61的一侧,通过过孔711连接有源部53一侧的第一有源层,以连接第二晶体管T2第二极和驱动晶体管T3的第二极。导电部46可以通过过孔712连接连接部22,导电部46还可以连接用于提供图27中第一电源信号端VDD的电源线。导电部47可以通过过孔79连接有源部57一侧的第一有源层,以连接第二初始信号线Vinit2和第七晶体管T7的第二极。As shown in FIGS. 29 and 36 , the first source-drain layer may include a conductive portion 41 , a conductive portion 42 , a conductive portion 43 , a conductive portion 44 , a conductive portion 45 , a conductive portion 46 , a conductive portion 47 , and a second initial signal line Vinit2 , The second initial signal line Vinit2 is connected to the conductive portion 47 for providing the second initial signal terminal in FIG. 27 . The orthographic projection of the second initial signal line Vinit2 on the base substrate may at least partially overlap with the orthographic projection of the first reset signal line Re1 on the base substrate. The conductive portion 41 can be connected to the active portion 6 through the via hole 72, and the first initial signal line Vinit1 can be connected to the via hole 73 to connect the second electrode of the first transistor T1 and the first initial signal line Vinit1. The conductive portion 41 can be further The contact efficiency between the active part 6 and the first initial signal line Vinit1 is increased. The conductive part 42 can be connected to the position of the active part 6 between the active part 61 and the active part 62 through the via hole 74 , and the conductive part 11 can be connected to the conductive part 11 through the via hole 75 to connect the first electrode of the first transistor T1 and the driving part. gate of transistor T3. The via hole 75 may penetrate through the through hole 211 on the conductive portion 21 , and the conductor filled in the via hole 75 is not electrically connected to the conductive portion 21 . The conductive part 43 can be connected to the connection part 22 through the via hole 76 , and the first active layer on the side of the active part 55 can be connected through the via hole 77 to connect the capacitor C and the first electrode of the fifth transistor T5 . The conductive part 44 can be connected to the first active layer between the active part 57 and the active part 56 through the via hole 78 to connect the second electrode of the sixth transistor T6, wherein the conductive part 44 can be used to connect the light emitting unit the anode. The conductive part 45 can be connected to the active part 6 on the side of the active part 62 away from the active part 61 through the via hole 710 , and the first active layer on the side of the active part 53 can be connected through the via hole 711 to connect the second transistor. The second pole of T2 and the second pole of the driving transistor T3. The conductive part 46 can be connected to the connection part 22 through the via hole 712 , and the conductive part 46 can also be connected to the power line for providing the first power signal terminal VDD in FIG. 27 . The conductive part 47 may be connected to the first active layer on one side of the active part 57 through the via hole 79 to connect the second initial signal line Vinit2 and the second electrode of the seventh transistor T7.
本示例性实施例中,如图29、39所示,第四遮光部014在衬底基板正投影与连接部22在衬底基板正投影至少部分重合。该设置可以尽量减小第四遮光部014对光线的遮挡作用,增加阵列基板的透光率。In this exemplary embodiment, as shown in FIGS. 29 and 39 , the orthographic projection of the fourth light shielding portion 014 on the base substrate at least partially overlaps with the orthographic projection of the connecting portion 22 on the base substrate. This arrangement can minimize the shielding effect of the fourth light shielding portion 014 on light, and increase the light transmittance of the array substrate.
本示例性实施例中,如图29、39所示,连接部02在衬底基板的正投影和第一复位信号线Re1在衬底基板正投影至少部分重合,同样的,该设置可以尽量减小连接部02对光线的遮挡作用,增加阵列基板的透光率。此外,由于第一复位信号线Re1位于第二栅极层,第一复位信号线Re1与遮光层具有较大的距离,连接部02对第一复位信号线Re1的电容耦合作用较小。相较于将连接部02设置于位于第一栅极层中栅线的正下方,该设置可以减小连接部02对栅线的电容耦合作用。In this exemplary embodiment, as shown in FIGS. 29 and 39 , the orthographic projection of the connection portion 02 on the base substrate and the orthographic projection of the first reset signal line Re1 on the base substrate at least partially overlap. Similarly, this setting can be minimized as much as possible. The shielding effect of the small connecting portion 02 on light increases the light transmittance of the array substrate. In addition, since the first reset signal line Re1 is located in the second gate layer, and the first reset signal line Re1 has a large distance from the light shielding layer, the capacitive coupling effect of the connecting portion 02 on the first reset signal line Re1 is small. Compared with disposing the connecting portion 02 directly under the gate line in the first gate layer, this arrangement can reduce the capacitive coupling effect of the connecting portion 02 on the gate line.
如图29、33、39所示,第二栅极层还可以包括凸起部23,凸起部23连接于第一初始信号线Vinit1,凸起部23包括侧边231,第一初始信号线Vinit1包括与侧边231连接的侧边232,侧边231在衬底基板正投影与侧边232在衬底基板的夹角小于180°。凸起部23衬底基板正投影和第二遮光部012在衬底基板正投影至少部分重合。凸起部23可以降低第一初始信号线Vinit1的电阻,此外,凸起部23衬底基板正投影和第二遮光部012在衬底基板正投影至少部分重合,从而可以尽量减小凸起部23对阵列基板的遮光作用。应该理解的是,在其他示例性实施例中,也可以在其他行向延伸的栅极上设置类似结构的凸起部,该凸起部在不会影响阵列基板透光率的基础上,可以降低栅线的电阻。As shown in FIGS. 29 , 33 and 39 , the second gate layer may further include a raised portion 23 , the raised portion 23 is connected to the first initial signal line Vinit1 , the raised portion 23 includes a side 231 , and the first initial signal line Vinit1 includes a side edge 232 connected to the side edge 231 , and the included angle between the orthographic projection of the side edge 231 on the base substrate and the side edge 232 on the base substrate is less than 180°. The orthographic projection of the protruding portion 23 on the base substrate and the orthographic projection of the second light shielding portion 012 on the base substrate at least partially overlap. The raised portion 23 can reduce the resistance of the first initial signal line Vinit1. In addition, the orthographic projection of the base substrate of the raised portion 23 and the orthographic projection of the second light shielding portion 012 on the base substrate at least partially overlap, so that the raised portion can be reduced as much as possible. 23. The shading effect on the array substrate. It should be understood that, in other exemplary embodiments, protruding portions with similar structures may also be provided on gates extending in other row directions. On the basis of not affecting the transmittance of the array substrate, the protruding portions may Reduce the resistance of the gate lines.
本示例性实施例中,遮光层可以为导体结构,例如遮光层可以位于金属遮光层,遮光层可以连接一稳定电压源,该稳定电压源可以为图27中的第一电源信号端VDD、第二电源信号端VSS、第一初始信号端Vinit1、第二初始信号端Vinti2中的任意一个。其中,遮光层可以 在阵列基板的非显示区或显示区与上述稳定电源连接。此外,上述稳定电压源还可以通过其他电源提供。如图29所示,导电部42在衬底基板正投影和第三遮光部013在衬底基板正投影至少部分重合,由于第三遮光部013连接稳定电源,因此第三遮光部013对导电部42具有稳压作用。同时由于导电部42连接驱动晶体管T3的栅极(导电部11),即第三遮光部013对驱动晶体管T3的栅极具有稳压作用,该设置可以降低驱动晶体管T3的栅极在发光阶段的电压波动。In this exemplary embodiment, the light-shielding layer may be a conductor structure, for example, the light-shielding layer may be located on a metal light-shielding layer, and the light-shielding layer may be connected to a stable voltage source, and the stable voltage source may be the first power signal terminal VDD, the first power supply signal terminal VDD in FIG. Any one of the power supply signal terminal VSS, the first initial signal terminal Vinit1, and the second initial signal terminal Vinti2. Wherein, the light shielding layer can be connected to the above-mentioned stable power supply in the non-display area or the display area of the array substrate. In addition, the above-mentioned stable voltage source can also be provided by other power sources. As shown in FIG. 29 , the orthographic projection of the conductive portion 42 on the base substrate and the orthographic projection of the third light-shielding portion 013 on the base substrate at least partially overlap. Since the third light-shielding portion 013 is connected to a stable power supply, the third light-shielding portion 013 is opposite to the conductive portion. 42 has a voltage stabilization effect. At the same time, since the conductive portion 42 is connected to the gate of the driving transistor T3 (the conductive portion 11 ), that is, the third light shielding portion 013 has a voltage-stabilizing effect on the gate of the driving transistor T3, this setting can reduce the voltage of the gate of the driving transistor T3 during the light-emitting stage. voltage fluctuations.
如图29所示,第一遮光部011在衬底基板正投影可以覆盖有源部53在衬底基板正投影,第一遮光部011可以对有源部53起到遮光作用,从而降低有源部53由于光照造成的驱动晶体管T3输出特性变化。此外,第一遮光部011在衬底基板正投影还可以覆盖驱动晶体管T3栅极(导电部11)在衬底基板正投影,从而第一遮光部011可以对驱动晶体管T3栅极起到稳压作用,从而降低驱动晶体管T3的栅极在发光阶段的电压波动。如图29所示,第一遮光部011在衬底基板正投影还可以与导电部42在衬底基板正投影至少部分重合,从而第一遮光部011可以进一步对驱动晶体管T3栅极起到稳压作用。驱动晶体管栅极(导电部11)和导电部42被遮光层覆盖的面积可以大于导电部11导电部42总面积的50%,例如60%-70%;80%-90%,或者之间的数值范围,或者全部覆盖等。As shown in FIG. 29 , the orthographic projection of the first light-shielding portion 011 on the base substrate can cover the orthographic projection of the active portion 53 on the base substrate, and the first light-shielding portion 011 can shield the active portion 53 from light, thereby reducing the active portion 53 . The section 53 changes the output characteristics of the drive transistor T3 due to illumination. In addition, the orthographic projection of the first light shielding portion 011 on the base substrate can also cover the orthographic projection of the gate of the driving transistor T3 (conducting portion 11 ) on the base substrate, so that the first light shielding portion 011 can stabilize the gate of the driving transistor T3 Therefore, the voltage fluctuation of the gate of the driving transistor T3 in the light-emitting stage is reduced. As shown in FIG. 29 , the orthographic projection of the first light-shielding portion 011 on the base substrate may at least partially overlap with the orthographic projection of the conductive portion 42 on the base substrate, so that the first light-shielding portion 011 can further stabilize the gate of the driving transistor T3 pressure. The area of the driving transistor gate (conductive portion 11) and the conductive portion 42 covered by the light shielding layer may be greater than 50% of the total area of the conductive portion 42 of the conductive portion 11, for example, 60%-70%; 80%-90%, or between Value range, or cover all, etc.
此外,该阵列基板还可以包括第二源漏层、阳极层,第二源漏层可以位于第一源漏层背离衬底基板的一侧,阳极层可以位于第二源漏层背离衬底基板的一侧。第二源漏层可以包括用于提供图27中数据信号端的数据信号线、用于提供第一电源信号端的电源线。数据信号线和电源线在衬底基板的正投影均可以沿第二方向Y延伸。阳极层可以形成发光单元的阳极。In addition, the array substrate may further include a second source/drain layer and an anode layer, the second source/drain layer may be located on the side of the first source/drain layer away from the base substrate, and the anode layer may be located at the side of the second source/drain layer away from the base substrate side. The second source-drain layer may include data signal lines for providing the data signal terminals in FIG. 27 and power lines for providing the first power signal terminals. The orthographic projections of the data signal lines and the power lines on the base substrate may both extend along the second direction Y. The anode layer may form the anode of the light emitting cell.
本示例性实施例中,该阵列基本还可以包括第二源漏层,如图42、43所示,图42为本公开阵列基板一种示例性实施例的结构版图,图43为图42中的第二源漏层的结构版图。第二源漏层可以包括数据线Da和电源线VDD,数据线Da和电源线VDD在衬底基板的正投影可以沿第二方向Y延伸。数据线Da可以用于提供图27中的数据信号端,电源线VDD可以用于提供图27中的第一电源信号端。如图42所示,电源线VDD可以通过过孔713连接连接部22,以连接第一电源信号端和电容C。数据线可以通过过孔714连接有源部54一侧的第一有源层,以连接第四晶体管T4的第一极和数据信号端。其中,电源线VDD可以包括沿其延伸方向分布的延伸部91和延伸部92,其中,延伸部91在衬底基板正投影在第一方向X上的尺寸可以大于延伸部92在衬底基板正投影在第一方向X上的尺寸。延伸部91在衬底基板正投影可以覆盖第一晶体管和第二晶体管的沟道区。一方面,该设置可以通过电源线VDD对晶体管进行屏蔽和遮光;另一方面,该设置可以减小电源线VDD的电阻。In this exemplary embodiment, the array may basically further include a second source-drain layer, as shown in FIGS. 42 and 43 , FIG. 42 is a structural layout of an exemplary embodiment of an array substrate of the disclosure, and FIG. 43 is the The structural layout of the second source-drain layer. The second source and drain layer may include a data line Da and a power supply line VDD, and the orthographic projection of the data line Da and the power supply line VDD on the base substrate may extend along the second direction Y. The data line Da can be used to provide the data signal terminal in FIG. 27 , and the power line VDD can be used to provide the first power signal terminal in FIG. 27 . As shown in FIG. 42 , the power line VDD can be connected to the connection part 22 through the via hole 713 to connect the first power signal terminal and the capacitor C. As shown in FIG. The data line may be connected to the first active layer on one side of the active part 54 through the via hole 714 to connect the first electrode of the fourth transistor T4 and the data signal terminal. Wherein, the power supply line VDD may include an extension portion 91 and an extension portion 92 distributed along its extending direction, wherein the size of the extension portion 91 projected on the first direction X of the base substrate may be larger than that of the extension portion 92 on the normal projection of the base substrate. The dimension projected in the first direction X. The extension portion 91 can cover the channel regions of the first transistor and the second transistor by orthographic projection on the base substrate. On the one hand, this arrangement can shield and shield the transistors through the power line VDD; on the other hand, this arrangement can reduce the resistance of the power line VDD.
如图44、45所示,图44为本公开阵列基板一种示例性实施例的结构版图,图45为图44中的第二源漏层的结构版图。其中,图45所示第二源漏层和图43所示第二源漏层不同的是,延伸部91不仅覆盖第一晶体管和第二晶体管的沟道区,延伸部91还覆盖第六晶体管T6和驱动晶体管T3的沟道区。As shown in FIGS. 44 and 45 , FIG. 44 is a structural layout of an exemplary embodiment of the disclosed array substrate, and FIG. 45 is a structural layout of the second source and drain layers in FIG. 44 . The difference between the second source-drain layer shown in FIG. 45 and the second source-drain layer shown in FIG. 43 is that the extension part 91 not only covers the channel regions of the first transistor and the second transistor, but also covers the sixth transistor. T6 and the channel region of the drive transistor T3.
如图46、47所示,均为本公开阵列基板另一种示例性实施例中第二初始信号线的结构示意图。在其他示例性实施例中,第二初始信号线Vinit2可以是平行的网格线,也可以是折线,可以根据初始化信号线压降考虑进行设计。As shown in FIGS. 46 and 47 , both are schematic structural diagrams of the second initial signal line in another exemplary embodiment of the array substrate of the present disclosure. In other exemplary embodiments, the second initial signal line Vinit2 may be a parallel grid line or a broken line, which may be designed according to the voltage drop of the initialization signal line.
如图48所示,为图42中沿虚线B的部分剖视图。该阵列基板还可以包括第一绝缘层82、第二绝缘层83、第三绝缘层84、第四绝缘层85、第六绝缘层86、介电层87、钝化层88、第一平坦层89。其中,衬底基板81、遮光层、第一绝缘层82、第一有源层、第二绝缘层83、第一栅极层、第三绝缘层84、第二栅极层、第四绝缘层85、第二有源层、第五绝缘层86、第三栅极层、介电层87、第一源漏层、钝化层88、第一平坦层89、第二源漏层依次层叠设置。其中,第一绝缘层82包括氧化硅层、氮化硅层中的至少一层,第一绝缘层82的厚度可以为2500-3500埃。第二绝缘层83可以为氧化硅层,第二绝缘层83的厚度可以为1000-2000埃。第三绝缘层84可以为层间绝缘层或层间介电层,第三绝缘层84可以为氮化硅层,厚度 可以为1000-2000埃。第四绝缘层85可以包括氧化硅层和氮化硅层,其中,氧化硅层的厚度可以为3000-4000埃,氮化硅的厚度可以为500-1000埃。第五绝缘层86可以为氧化硅层,厚度可以1000-1700埃。介电层87可以包括氧化硅层和氮化硅层,氧化硅层的厚度可以为1500-2500,氮化硅层的厚度可以为2500-3500。第二源漏层背离衬底基板的一侧还可以设置有第二平坦层,阳极层位于第二平坦层背离衬底基板的一侧,阳极层背离衬底基板的一侧还可以设置有发光单元层,发光单元层可以包括电子注入层、有机发光层、空穴注入层等。As shown in FIG. 48 , it is a partial cross-sectional view taken along the dotted line B in FIG. 42 . The array substrate may further include a first insulating layer 82, a second insulating layer 83, a third insulating layer 84, a fourth insulating layer 85, a sixth insulating layer 86, a dielectric layer 87, a passivation layer 88, and a first planarization layer 89. Among them, the base substrate 81, the light shielding layer, the first insulating layer 82, the first active layer, the second insulating layer 83, the first gate layer, the third insulating layer 84, the second gate layer, and the fourth insulating layer 85. The second active layer, the fifth insulating layer 86, the third gate layer, the dielectric layer 87, the first source and drain layers, the passivation layer 88, the first flat layer 89, and the second source and drain layers are stacked in sequence . The first insulating layer 82 includes at least one of a silicon oxide layer and a silicon nitride layer, and the thickness of the first insulating layer 82 may be 2500-3500 angstroms. The second insulating layer 83 may be a silicon oxide layer, and the thickness of the second insulating layer 83 may be 1000-2000 angstroms. The third insulating layer 84 may be an interlayer insulating layer or an interlayer dielectric layer, the third insulating layer 84 may be a silicon nitride layer, and the thickness may be 1000-2000 angstroms. The fourth insulating layer 85 may include a silicon oxide layer and a silicon nitride layer, wherein the thickness of the silicon oxide layer may be 3000-4000 angstroms, and the thickness of the silicon nitride may be 500-1000 angstroms. The fifth insulating layer 86 may be a silicon oxide layer, and the thickness may be 1000-1700 angstroms. The dielectric layer 87 may include a silicon oxide layer and a silicon nitride layer, the thickness of the silicon oxide layer may be 1500-2500 Å, and the thickness of the silicon nitride layer may be 2500-3500 Å. The side of the second source-drain layer away from the base substrate can also be provided with a second flat layer, the anode layer is located on the side of the second flat layer away from the base substrate, and the side of the anode layer away from the base substrate can also be provided with a light-emitting layer The unit layer, the light-emitting unit layer may include an electron injection layer, an organic light-emitting layer, a hole injection layer, and the like.
本公开实施例提供的显示面板和显示装置具有与本公开前述实施例提供的阵列基板相同或相似的有益效果,由于阵列基板在前述实施例中已经进行了详细说明,此处不再赘述。The display panels and display devices provided by the embodiments of the present disclosure have the same or similar beneficial effects as the array substrates provided by the foregoing embodiments of the present disclosure. Since the array substrates have been described in detail in the foregoing embodiments, they will not be repeated here.
以上为了说明和描述的目的提供了实施例的前述描述。其并不旨在是穷举的或者限制本申请。特定实施例的各个元件或特征通常不限于特定的实施例,但是,在合适的情况下,这些元件和特征是可互换的并且可用在所选择的实施例中,即使没有具体示出或描述。同样也可以以许多方式来改变。这种改变不能被认为脱离了本申请,并且所有这些修改都包含在本申请的范围内。The foregoing description of the embodiments has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit this application. Individual elements or features of a particular embodiment are generally not limited to the particular embodiment, but, where appropriate, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described . The same can also be changed in many ways. Such changes are not to be considered a departure from this application, and all such modifications are included within the scope of this application.

Claims (21)

  1. 一种阵列基板,包括:An array substrate, comprising:
    衬底;substrate;
    设置在所述衬底上的排布为多行多列的多个子像素,所述多个子像素中的至少一个包括像素电路,每个所述像素电路包括:驱动电路、稳压电路、驱动复位电路和发光复位电路,其中,A plurality of sub-pixels arranged on the substrate and arranged in multiple rows and columns, at least one of the plurality of sub-pixels includes a pixel circuit, and each of the pixel circuits includes: a driving circuit, a voltage regulator circuit, a driving reset circuit and light-emitting reset circuit, wherein,
    所述驱动电路包括控制端、第一端和第二端,并被配置为向发光器件提供驱动电流,The driving circuit includes a control terminal, a first terminal and a second terminal, and is configured to provide a driving current to the light emitting device,
    所述稳压电路与所述驱动电路的所述控制端、第一节点和稳压控制信号输入端耦接,并被配置为在来自所述稳压控制信号输入端的稳压控制信号的控制下使所述驱动电路的所述控制端与所述第一节点导通,The voltage-stabilizing circuit is coupled to the control terminal, the first node and the voltage-stabilizing control signal input terminal of the driving circuit, and is configured to be under the control of the voltage-stabilizing control signal from the voltage-stabilizing control signal input terminal turning on the control terminal of the driving circuit with the first node,
    所述驱动复位电路耦接驱动复位控制信号输入端、所述第一节点和驱动复位电压端,并被配置为在来自所述驱动复位控制信号输入端的驱动复位控制信号的控制下将来自驱动复位电压端的所述驱动复位电压提供给所述稳压电路,以对所述驱动电路的所述控制端进行复位,以及The drive reset circuit is coupled to the drive reset control signal input terminal, the first node and the drive reset voltage terminal, and is configured to reset the circuit from the drive reset under the control of the drive reset control signal from the drive reset control signal input terminal the driving reset voltage of the voltage terminal is provided to the voltage regulator circuit to reset the control terminal of the driving circuit, and
    所述发光复位电路耦接发光复位控制信号输入端、发光器件和发光复位电压端,并被配置为在来自所述发光复位控制信号输入端的发光复位控制信号的控制下将来自所述发光复位电压端的发光复位电压提供给所述发光器件,以对所述发光器件进行复位;The light-emitting reset circuit is coupled to the light-emitting reset control signal input terminal, the light-emitting device and the light-emitting reset voltage terminal, and is configured to convert the light-emitting reset voltage from the light-emitting reset voltage under the control of the light-emitting reset control signal from the light-emitting reset control signal input terminal The light-emitting reset voltage of the terminal is provided to the light-emitting device to reset the light-emitting device;
    驱动复位电压线,其耦接所述驱动复位电压端,并被配置为向其提供所述驱动复位电压;以及a drive reset voltage line coupled to the drive reset voltage terminal and configured to provide the drive reset voltage thereto; and
    发光复位电压线,其耦接所述发光复位电压端,并被配置为向其提供所述发光复位电压。A light-emitting reset voltage line is coupled to the light-emitting reset voltage terminal and configured to provide the light-emitting reset voltage thereto.
  2. 根据权利要求1所述的阵列基板,所述驱动电路包括驱动晶体管,所述稳压电路包括稳压晶体管,所述驱动复位电路包括驱动复位晶体管,所述发光复位电路包括发光复位晶体管,The array substrate according to claim 1, wherein the driving circuit comprises a driving transistor, the voltage regulator circuit comprises a voltage regulator transistor, the driving reset circuit comprises a driving reset transistor, the light emitting reset circuit comprises a light emitting reset transistor,
    其中,所述驱动晶体管的第一极与所述驱动电路的所述第一端耦接,所述驱动晶体管的栅极与所述驱动电路的所述控制端耦接,所述驱动晶体管的第二极与所述驱动电路的所述第一端耦接;Wherein, the first pole of the driving transistor is coupled to the first terminal of the driving circuit, the gate of the driving transistor is coupled to the control terminal of the driving circuit, and the first terminal of the driving transistor is coupled to the control terminal of the driving circuit. A diode is coupled to the first end of the driving circuit;
    其中,所述稳压晶体管的第一极与所述驱动电路的所述控制端耦接,所述稳压晶体管的第二极与所述第一节点耦接,所述稳压晶体管的栅极与所述稳压控制信号输入端耦接;The first electrode of the voltage stabilizer transistor is coupled to the control terminal of the driving circuit, the second electrode of the voltage stabilizer transistor is coupled to the first node, and the gate of the voltage stabilizer transistor is coupled to the first node. coupled with the voltage stabilization control signal input end;
    其中,所述驱动复位晶体管的第一极与所述驱动复位电压端耦接,所述驱动复位晶体管的栅极与所述驱动复位控制信号输入端耦接,所述驱动复位晶体管的第二极与所述第一节点耦接;Wherein, the first pole of the drive reset transistor is coupled to the drive reset voltage terminal, the gate of the drive reset transistor is coupled to the drive reset control signal input terminal, and the second pole of the drive reset transistor coupled to the first node;
    其中,所述发光复位晶体管的第一极与所述发光复位电压端耦接,所述发光复位晶体管的栅极与所述发光复位控制信号输入端耦接,所述发光复位晶体管的第二极与所述发光器件的第一端耦接;The first pole of the light-emitting reset transistor is coupled to the light-emitting reset voltage terminal, the gate of the light-emitting reset transistor is coupled to the light-emitting reset control signal input terminal, and the second pole of the light-emitting reset transistor is coupled to the light-emitting reset control signal input terminal. coupled to the first end of the light emitting device;
    其中,所述稳压晶体管的有源层包括氧化物半导体材料,所述驱动晶体管和所述驱动复位晶体管的有源层包括硅半导体材料。Wherein, the active layer of the voltage stabilizing transistor includes oxide semiconductor material, and the active layers of the driving transistor and the driving reset transistor include silicon semiconductor material.
  3. 根据权利要求2所述的阵列基板,其中,所述发光复位晶体管的有源层包括所述氧化物半导体材料。The array substrate of claim 2, wherein the active layer of the light emitting reset transistor comprises the oxide semiconductor material.
  4. 根据权利要求3所述的阵列基板,进一步包括:The array substrate according to claim 3, further comprising:
    位于所述衬底上的第一有源半导体层,包括所述硅半导体材料;以及a first active semiconductor layer on the substrate, comprising the silicon semiconductor material; and
    位于所述第一有源半导体层背离所述衬底一侧的并与所述第一有源半导体层绝缘隔离的第二有源半导体层,包括所述氧化物半导体材料。A second active semiconductor layer located on the side of the first active semiconductor layer away from the substrate and insulated from the first active semiconductor layer includes the oxide semiconductor material.
  5. 根据权利要求4所述的阵列基板,The array substrate according to claim 4,
    其中,所述第一有源半导体层包括所述驱动晶体管的有源层和所述驱动复位晶体管的有源层,Wherein, the first active semiconductor layer includes the active layer of the driving transistor and the active layer of the driving reset transistor,
    其中,所述第二有源半导体层包括沿列方向设置的第一部分和第二部分,所述第二有源半导体的所述第一部分包括所述稳压晶体管的有源层,所述第二有源半导体的所述第二部分包括所述发光复位晶体管的有源层。Wherein, the second active semiconductor layer includes a first part and a second part arranged along the column direction, the first part of the second active semiconductor includes the active layer of the voltage regulator transistor, the second The second portion of the active semiconductor includes an active layer of the light emitting reset transistor.
  6. 根据权利要求5所述的阵列基板,其中,所述第二有源半导体的所述第一部分与所述第二有源半导体的所述第二部分沿列方向对准。6. The array substrate of claim 5, wherein the first portion of the second active semiconductor and the second portion of the second active semiconductor are aligned in a column direction.
  7. 根据权利要求6所述的阵列基板,所述像素电路进一步包括数据写入电路、补偿电路、存储电路和发光控制电路,其中,The array substrate according to claim 6, wherein the pixel circuit further comprises a data writing circuit, a compensation circuit, a storage circuit and a light emission control circuit, wherein,
    所述数据写入电路耦接数据信号输入端、扫描信号输入端和所述驱动电路的所述第一端,并被配置为在来自所述扫描信号输入端的扫描信号的控制下将来自所述数据信号输入端的数据信号提供给所述驱动电路的所述第一端;The data writing circuit is coupled to a data signal input terminal, a scan signal input terminal, and the first terminal of the driving circuit, and is configured to write data from the scan signal input terminal under the control of the scan signal from the scan signal input terminal. The data signal of the data signal input terminal is provided to the first terminal of the driving circuit;
    所述补偿电路耦接所述驱动电路的所述第二端、所述第一节点和补偿控制信号输入端,并被配置为根据来自所述补偿控制信号输入端的补偿控制信号,对所述驱动电路进行阈值补偿;The compensation circuit is coupled to the second terminal of the driving circuit, the first node and the compensation control signal input terminal, and is configured to control the driving circuit according to the compensation control signal from the compensation control signal input terminal The circuit performs threshold compensation;
    所述存储电路耦接第一电源电压端和所述驱动电路的所述控制端,并被配置为存储所述第一电源电压端与所述驱动电路的所述控制端之间的电压差;以及the storage circuit is coupled to a first power supply voltage terminal and the control terminal of the driving circuit, and is configured to store a voltage difference between the first power supply voltage terminal and the control terminal of the driving circuit; as well as
    所述发光控制电路耦接发光控制信号输入端、所述第一电源电压端、所述驱动电路的所述第一端及所述第二端、发光复位电路、以及所述发光器件,并被配置为在来自所述发光控制信号输入端的发光控制信号的控制下将来自所述第一电源电压端的第一电源电压施加至所述驱动电路,并将所述驱动电路产生的驱动电流施加至所述发光器件。The lighting control circuit is coupled to the lighting control signal input terminal, the first power supply voltage terminal, the first terminal and the second terminal of the driving circuit, the lighting reset circuit, and the lighting device, and is is configured to apply a first power supply voltage from the first power supply voltage terminal to the driving circuit under the control of a lighting control signal from the lighting control signal input terminal, and apply a driving current generated by the driving circuit to the driving circuit the light-emitting device.
  8. 根据权利要求7所述的阵列基板,其中,所述数据写入电路包括数据写入晶体管,所述补偿电路包括补偿晶体管,所述存储电路包括存储电容,所述发光控制电路包括第一发光控制晶体管和第二发光控制晶体管,The array substrate according to claim 7, wherein the data writing circuit comprises a data writing transistor, the compensation circuit comprises a compensation transistor, the storage circuit comprises a storage capacitor, and the light emission control circuit comprises a first light emission control circuit transistor and a second light emission control transistor,
    其中,所述数据写入晶体管的第一极与所述数据信号输入端耦接,所述数据写入晶体管的栅极与所述扫描信号输入端耦接,所述数据写入晶体管的第二极与所述驱动电路的所述第一端耦接;The first pole of the data writing transistor is coupled to the data signal input terminal, the gate of the data writing transistor is coupled to the scan signal input terminal, and the second pole of the data writing transistor is coupled to the scan signal input terminal. the pole is coupled to the first end of the drive circuit;
    其中,所述补偿晶体管的第一极与所述驱动电路的所述第二端耦接,所述补偿晶体管的栅极与所述补偿控制信号输入端耦接,所述补偿晶体管的第二极与所述第一节点耦接;The first electrode of the compensation transistor is coupled to the second end of the driving circuit, the gate of the compensation transistor is coupled to the compensation control signal input end, and the second electrode of the compensation transistor is coupled to the input end of the compensation control signal. coupled to the first node;
    其中,所述存储电容的第一极耦接所述第一电源电压端,所述存储电容的第二极耦接所述驱动电路的所述控制端,并被配置为存储所述第一电源电压端与所述驱动电路的所述控制端之间的电压差;Wherein, the first pole of the storage capacitor is coupled to the first power supply voltage terminal, the second pole of the storage capacitor is coupled to the control terminal of the driving circuit, and is configured to store the first power supply the voltage difference between the voltage terminal and the control terminal of the drive circuit;
    其中,所述第一发光控制晶体管的第一极与所述第一电源电压端耦接,所述第一发光控制晶体管的栅极与所述发光控制信号输入端耦接,所述第一发光控制晶体管的第二极与所述驱动电路的所述第一端耦接;以及The first electrode of the first light-emitting control transistor is coupled to the first power supply voltage terminal, the gate of the first light-emitting control transistor is coupled to the light-emitting control signal input end, and the first light-emitting control transistor is the second electrode of the control transistor is coupled to the first end of the driving circuit; and
    其中,所述第二发光控制晶体管的第一极与所述驱动电路的所述第二端耦接,所述第二发光控制晶体管的栅极与所述发光控制信号输入端耦接,所述第二发光控制晶体管的第二极与所述发光器件的第一极耦接。The first electrode of the second light-emitting control transistor is coupled to the second end of the driving circuit, the gate of the second light-emitting control transistor is coupled to the light-emitting control signal input end, and the The second electrode of the second light-emitting control transistor is coupled to the first electrode of the light-emitting device.
  9. 根据权利要求8所述的阵列基板,其中,所述第一有源半导体层包括所述数据写入晶体管、所述补偿晶体管、所述第一发光控制晶体管和所述第二发光控制晶体管的有源层。9. The array substrate of claim 8, wherein the first active semiconductor layer comprises a combination of the data writing transistor, the compensation transistor, the first light emission control transistor and the second light emission control transistor source layer.
  10. 根据权利要求9所述的阵列基板,其中,所述发光复位控制信号与所述发光控制信号是同一信号。9. The array substrate of claim 9, wherein the light emission reset control signal and the light emission control signal are the same signal.
  11. 根据权利要求9所述的阵列基板,其中,所述扫描信号与所述补偿控制信号是同一信号。The array substrate of claim 9, wherein the scan signal and the compensation control signal are the same signal.
  12. 根据权利要求11所述的阵列基板,进一步包括位于所述第一有源半导体层与所述第二有源半导体层之间的并与所述第一有源半导体层和所述第二有源半导体层绝缘隔离的第一导电层,所述第一导电层包括沿列方向依次设置的驱动复位控制信号线、扫描信号线、所述 驱动晶体管的栅极、所述存储电容的第一极、以及发光控制信号线,11. The array substrate of claim 11, further comprising between the first active semiconductor layer and the second active semiconductor layer and connected to the first active semiconductor layer and the second active semiconductor layer A first conductive layer insulated and isolated by the semiconductor layer, the first conductive layer includes a drive reset control signal line, a scan signal line, a gate electrode of the drive transistor, a first electrode of the storage capacitor, And the light-emitting control signal line,
    其中,所述驱动复位控制信号线与所述驱动复位控制信号输入端耦接,并被配置为向其提供所述驱动复位控制信号;Wherein, the drive reset control signal line is coupled to the drive reset control signal input terminal, and is configured to provide the drive reset control signal to it;
    其中,所述扫描信号线与所述扫描信号输入端及所述补偿控制信号输入端耦接,被配置为向所述扫描信号输入端提供所述扫描信号,并被配置为向所述补偿控制信号输入端提供所述补偿控制信号;The scan signal line is coupled to the scan signal input terminal and the compensation control signal input terminal, is configured to provide the scan signal to the scan signal input terminal, and is configured to provide the compensation control signal to the scan signal input terminal. The signal input terminal provides the compensation control signal;
    其中,所述存储电容的第一极与所述驱动晶体管的栅极为一体结构;以及Wherein, the first pole of the storage capacitor and the gate of the driving transistor are integral structures; and
    其中,所述发光控制信号线与所述发光控制信号输入端,并被配置为向所述发光控制信号输入端提供所述发光控制信号。Wherein, the light-emitting control signal line and the light-emitting control signal input end are configured to provide the light-emitting control signal to the light-emitting control signal input end.
  13. 根据权利要求12所述的阵列基板,The array substrate according to claim 12,
    其中,所述驱动复位控制信号线在所述衬底上的正投影与所述第一有源半导体层在所述衬底上的正投影的重叠的部分为所述驱动复位晶体管的栅极;Wherein, the overlapping portion of the orthographic projection of the driving reset control signal line on the substrate and the orthographic projection of the first active semiconductor layer on the substrate is the gate of the driving reset transistor;
    其中,所述扫描信号线在所述衬底上的正投影与所述第一有源半导体层在所述衬底上的正投影的重叠的部分为所述补偿晶体管的栅极和所述数据写入晶体管的栅极;以及Wherein, the overlapping part of the orthographic projection of the scanning signal line on the substrate and the orthographic projection of the first active semiconductor layer on the substrate is the gate of the compensation transistor and the data the gate of the write transistor; and
    其中,所述发光控制信号线在所述衬底上的正投影与所述第一有源半导体层在所述衬底上的正投影的重叠的部分为所述第一发光控制晶体管的栅极和所述第二发光控制晶体管的栅极。Wherein, the overlapping part of the orthographic projection of the light-emitting control signal line on the substrate and the orthographic projection of the first active semiconductor layer on the substrate is the gate of the first light-emitting control transistor and the gate of the second light emission control transistor.
  14. 根据权利要求13所述的阵列基板,进一步包括位于所述第一导电层与所述第二有源半导体层之间的并与所述第一导电层和所述第二有源半导体层绝缘隔离的第二导电层,所述第二导电层包括沿列方向设置的稳压控制信号线、所述存储电容的第二极、第一电源电压线和发光复位控制信号线,14. The array substrate of claim 13, further comprising between the first conductive layer and the second active semiconductor layer and insulated from the first conductive layer and the second active semiconductor layer The second conductive layer includes a voltage regulation control signal line arranged along the column direction, a second pole of the storage capacitor, a first power supply voltage line and a light-emitting reset control signal line,
    其中,所述稳压控制信号线与所述稳压控制信号输入端耦接,并被配置为向其提供所述稳压控制信号;Wherein, the voltage stabilization control signal line is coupled to the voltage stabilization control signal input terminal, and is configured to provide the voltage stabilization control signal to it;
    其中,所述第一电源电压线与所述第一电源电压端耦接,并被配置为向其提供所述第一电源电压;wherein, the first power supply voltage line is coupled to the first power supply voltage terminal, and is configured to provide the first power supply voltage thereto;
    其中,所述存储电容的第二极与所述存储电容的第一极在所述衬底上的正投影至少部分重叠;Wherein, the second pole of the storage capacitor and the orthographic projection of the first pole of the storage capacitor on the substrate at least partially overlap;
    其中,所述存储电容的第二极与所述第一电源电压线一体形成;以及wherein, the second pole of the storage capacitor is integrally formed with the first power supply voltage line; and
    其中,所述发光复位控制信号线与所述发光复位控制信号输入端耦接,并被配置为向其提供所述发光复位控制信号。Wherein, the light-emitting reset control signal line is coupled to the light-emitting reset control signal input terminal, and is configured to provide the light-emitting reset control signal thereto.
  15. 根据权利要求14所述的阵列基板,The array substrate according to claim 14,
    其中,所述稳压控制信号线在所述衬底上的正投影与所述第二有源半导体层在所述衬底上的正投影的重叠的部分为所述稳压晶体管的第一栅极;以及Wherein, the overlapping part of the orthographic projection of the voltage-stabilizing control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the first gate of the voltage-stabilizing transistor extremely; and
    其中,所述发光控制信号线在所述衬底上的正投影与所述第二有源半导体层在所述衬底上的正投影的重叠的部分为所述发光复位晶体管的第一栅极。Wherein, the overlapping part of the orthographic projection of the light-emitting control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the first gate of the light-emitting reset transistor .
  16. 根据权利要求15所述的阵列基板,进一步包括位于所述第二有源半导体层背离所述衬底一侧的并与所述第二有源半导体层绝缘隔离的第三导电层,所述第三导电层包括沿列方向设置的所述稳压控制信号线、所述发光复位控制信号线、以及发光复位电压线。16. The array substrate according to claim 15, further comprising a third conductive layer on a side of the second active semiconductor layer away from the substrate and insulated from the second active semiconductor layer, the first conductive layer The three conductive layers include the voltage regulation control signal line, the light emission reset control signal line, and the light emission reset voltage line arranged along the column direction.
  17. 根据权利要求16所述的阵列基板,The array substrate according to claim 16,
    其中,所述稳压控制信号线在所述衬底上的正投影与所述第二有源半导体层在所述衬底上的正投影的重叠的部分为所述稳压晶体管的第二栅极;Wherein, the overlapping portion of the orthographic projection of the voltage-stabilizing control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the second gate of the voltage-stabilizing transistor pole;
    其中,所述发光复位控制信号线在所述衬底上的正投影与所述第二有源半导体层在所述衬底上的正投影的重叠的部分为所述发光复位晶体管的第二栅极;以及Wherein, the overlapping part of the orthographic projection of the light-emitting reset control signal line on the substrate and the orthographic projection of the second active semiconductor layer on the substrate is the second gate of the light-emitting reset transistor extremely; and
    其中,所述发光复位电压线经由过孔与所述第二有源半导体层耦接,以形成所述发光复位晶体管的第一极。Wherein, the light-emitting reset voltage line is coupled to the second active semiconductor layer through a via hole to form a first electrode of the light-emitting reset transistor.
  18. 根据权利要求17所述的阵列基板,进一步包括位于所述第三导电层背离所述衬底一侧的并与所述第三导电层绝缘隔离的第四导电层,所述第四导电层包括第一连接部、第二连接部、第三连接部、第四连接部、第五连接部、第六连接部、第七连接部、以及第八连接部,The array substrate according to claim 17, further comprising a fourth conductive layer located on a side of the third conductive layer away from the substrate and insulated from the third conductive layer, the fourth conductive layer comprising: a first connection part, a second connection part, a third connection part, a fourth connection part, a fifth connection part, a sixth connection part, a seventh connection part, and an eighth connection part,
    其中,所述第一连接部用作所述驱动复位电压线;Wherein, the first connection part is used as the driving reset voltage line;
    其中,所述第一连接部经由过孔与所述驱动复位晶体管的漏极区域耦接,形成所述驱动复位晶体管的第一极;Wherein, the first connection portion is coupled to the drain region of the drive reset transistor through a via hole, forming a first pole of the drive reset transistor;
    其中,所述第二连接部经由过孔与所述发光复位电压线耦接;wherein, the second connection portion is coupled to the light-emitting reset voltage line through a via hole;
    其中,所述第三连接部经由过孔与所述数据写入晶体管的漏极区域耦接,形成所述数据写入晶体管的第一极;Wherein, the third connection portion is coupled to the drain region of the data writing transistor through a via hole to form a first electrode of the data writing transistor;
    其中,所述第四连接部经由过孔与所述驱动复位晶体管的源极区域及所述补偿晶体管的源极区域耦接,分别形成所述驱动复位晶体管的第二极及所述补偿晶体管的第二极,所述第四连接部经由过孔与所述稳压晶体管的源极区域耦接,形成所述稳压晶体管的第二极;Wherein, the fourth connection part is coupled to the source region of the driving reset transistor and the source region of the compensation transistor through a via hole, and forms the second electrode of the driving reset transistor and the source region of the compensation transistor, respectively. the second pole, the fourth connection part is coupled to the source region of the voltage regulator transistor through the via hole, and forms the second pole of the voltage regulator transistor;
    其中,所述第五连接部经由过孔与所述驱动晶体管的栅极及所述存储电容的第一极耦接,所述第五连接部经由过孔与所述稳压晶体管的漏极区域耦接,形成所述稳压晶体管的第一极;Wherein, the fifth connection part is coupled to the gate of the driving transistor and the first electrode of the storage capacitor through a via hole, and the fifth connection part is connected to the drain region of the voltage regulator transistor via a via hole coupled to form the first pole of the voltage regulator transistor;
    其中,所述第六连接部经由过孔与所述第一发光控制晶体管的漏极区域耦接,形成所述第一发光控制晶体管的第一极;Wherein, the sixth connection portion is coupled to the drain region of the first light-emitting control transistor through a via hole, forming a first electrode of the first light-emitting control transistor;
    其中,所述第七连接部经由过孔与所述第二发光控制晶体管的源极区域耦接,形成所述第二发光控制晶体管的第二极,所述第七连接部经由过孔与所述发光复位晶体管的源极区域耦接,形成所述发光复位晶体管的第二极;以及Wherein, the seventh connection part is coupled to the source region of the second light-emitting control transistor through a via hole to form a second electrode of the second light-emitting control transistor, and the seventh connection part is connected to the source region of the second light-emitting control transistor via a via hole. the source region of the light-emitting reset transistor is coupled to form the second electrode of the light-emitting reset transistor; and
    其中,所述第八连接部经由过孔与所述发光复位晶体管的源极区域耦接,形成所述发光复位晶体管的第一极。Wherein, the eighth connection part is coupled to the source region of the light-emitting reset transistor through a via hole, and forms a first electrode of the light-emitting reset transistor.
  19. 根据权利要求18所述的阵列基板,进一步包括位于所述第四导电层背离所述衬底一侧的并与所述第四导电层绝缘隔离的第五导电层,所述第五导电层包括沿行方向设置的数据信号线、所述第一电源电压线、以及第二电源电压线,The array substrate according to claim 18, further comprising a fifth conductive layer located on a side of the fourth conductive layer away from the substrate and insulated from the fourth conductive layer, the fifth conductive layer comprising data signal lines, the first power supply voltage lines, and the second power supply voltage lines arranged in the row direction,
    其中,所述数据信号线沿列方向延伸,并经由过孔与所述第四导电层的所述第三连接部耦接;Wherein, the data signal line extends along the column direction, and is coupled with the third connection portion of the fourth conductive layer through a via hole;
    其中,所述第一电源电压线沿列方向延伸,并经由过孔与所述第四导电层的所述第三连接部耦接;以及wherein, the first power supply voltage line extends along the column direction and is coupled to the third connection portion of the fourth conductive layer through a via hole; and
    其中,所述第二电源电压线沿列方向延伸,并经由过孔与所述第四导电层的所述第七连接部耦接。Wherein, the second power supply voltage line extends along the column direction, and is coupled to the seventh connection portion of the fourth conductive layer through a via hole.
  20. 一种显示面板,其包括根据权利要求1至19中任一项所述的阵列基板。A display panel comprising the array substrate according to any one of claims 1 to 19.
  21. 一种显示装置,其包括根据权利要求20所述的显示面板。A display device comprising the display panel of claim 20.
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* Cited by examiner, † Cited by third party
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CN115472137A (en) * 2022-09-16 2022-12-13 北京京东方显示技术有限公司 Pixel circuit, driving method thereof, display panel and display device
CN115472137B (en) * 2022-09-16 2023-11-03 北京京东方显示技术有限公司 Pixel circuit, driving method thereof, display panel and display device

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