WO2022158383A1 - Flame-retardant polyamide resin composition and molded article comprising same - Google Patents
Flame-retardant polyamide resin composition and molded article comprising same Download PDFInfo
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- WO2022158383A1 WO2022158383A1 PCT/JP2022/001087 JP2022001087W WO2022158383A1 WO 2022158383 A1 WO2022158383 A1 WO 2022158383A1 JP 2022001087 W JP2022001087 W JP 2022001087W WO 2022158383 A1 WO2022158383 A1 WO 2022158383A1
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- Prior art keywords
- mass
- polyamide resin
- polyamide
- parts
- flame
- Prior art date
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- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 50
- 239000003063 flame retardant Substances 0.000 title claims abstract description 24
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 239000011342 resin composition Substances 0.000 title claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920002292 Nylon 6 Polymers 0.000 claims abstract description 18
- 229920002302 Nylon 6,6 Polymers 0.000 claims abstract description 17
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 17
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 17
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 16
- 239000000194 fatty acid Substances 0.000 claims abstract description 16
- 229930195729 fatty acid Natural products 0.000 claims abstract description 16
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000314 lubricant Substances 0.000 claims abstract description 11
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 11
- 239000011574 phosphorus Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 150000003839 salts Chemical class 0.000 claims description 15
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 235000021355 Stearic acid Nutrition 0.000 claims description 5
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 5
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 5
- 239000008117 stearic acid Substances 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 238000009429 electrical wiring Methods 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 3
- 238000002845 discoloration Methods 0.000 abstract description 12
- 238000002156 mixing Methods 0.000 description 14
- -1 polymetaxylylene Polymers 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 8
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N Caprolactam Natural products O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 230000000740 bleeding effect Effects 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000004898 kneading Methods 0.000 description 5
- QQVIHTHCMHWDBS-UHFFFAOYSA-N perisophthalic acid Natural products OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- GXURZKWLMYOCDX-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.OCC(CO)(CO)CO GXURZKWLMYOCDX-UHFFFAOYSA-N 0.000 description 4
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 4
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 150000001340 alkali metals Chemical class 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 229920006020 amorphous polyamide Polymers 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N benzene-dicarboxylic acid Natural products OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000001488 sodium phosphate Substances 0.000 description 3
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- ZLFHNCHMEGLFKL-UHFFFAOYSA-N 3,3-bis(3-tert-butyl-4-hydroxyphenyl)butanoic acid Chemical compound C1=C(O)C(C(C)(C)C)=CC(C(C)(CC(O)=O)C=2C=C(C(O)=CC=2)C(C)(C)C)=C1 ZLFHNCHMEGLFKL-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- YLUZWKKWWSCRSR-UHFFFAOYSA-N 3,9-bis(8-methylnonoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCC(C)C)OCC21COP(OCCCCCCCC(C)C)OC2 YLUZWKKWWSCRSR-UHFFFAOYSA-N 0.000 description 1
- WPMYUUITDBHVQZ-UHFFFAOYSA-M 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=CC(CCC([O-])=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-M 0.000 description 1
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- XYZOAHOBGWZSEX-UHFFFAOYSA-N OP(O)OP(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C.P(O)(O)O Chemical class OP(O)OP(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C.P(O)(O)O XYZOAHOBGWZSEX-UHFFFAOYSA-N 0.000 description 1
- QAEPIAHUOVJOOM-UHFFFAOYSA-N OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC Chemical compound OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC QAEPIAHUOVJOOM-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920006100 Vydyne® Polymers 0.000 description 1
- BEIOEBMXPVYLRY-UHFFFAOYSA-N [4-[4-bis(2,4-ditert-butylphenoxy)phosphanylphenyl]phenyl]-bis(2,4-ditert-butylphenoxy)phosphane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(C=1C=CC(=CC=1)C=1C=CC(=CC=1)P(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C BEIOEBMXPVYLRY-UHFFFAOYSA-N 0.000 description 1
- HVYLDJKDVOOTHV-UHFFFAOYSA-N acetic acid;2-iminoethanethiol Chemical compound CC(O)=O.CC(O)=O.SCC=N HVYLDJKDVOOTHV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- ZEFSGHVBJCEKAZ-UHFFFAOYSA-N bis(2,4-ditert-butyl-6-methylphenyl) ethyl phosphite Chemical compound CC=1C=C(C(C)(C)C)C=C(C(C)(C)C)C=1OP(OCC)OC1=C(C)C=C(C(C)(C)C)C=C1C(C)(C)C ZEFSGHVBJCEKAZ-UHFFFAOYSA-N 0.000 description 1
- YTKWTCYBDMELQK-UHFFFAOYSA-N bis(2,4-ditert-butyl-6-methylphenyl)methyl dihydrogen phosphite Chemical compound CC1=CC(C(C)(C)C)=CC(C(C)(C)C)=C1C(OP(O)O)C1=C(C)C=C(C(C)(C)C)C=C1C(C)(C)C YTKWTCYBDMELQK-UHFFFAOYSA-N 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- FIASKJZPIYCESA-UHFFFAOYSA-L calcium;octacosanoate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O FIASKJZPIYCESA-UHFFFAOYSA-L 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229920006039 crystalline polyamide Polymers 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 229910000397 disodium phosphate Inorganic materials 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229910052816 inorganic phosphate Inorganic materials 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- GQYGRYMNLHLHNK-UHFFFAOYSA-N manganese(2+);diphosphite Chemical compound [Mn+2].[Mn+2].[Mn+2].[O-]P([O-])[O-].[O-]P([O-])[O-] GQYGRYMNLHLHNK-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 1
- 235000019799 monosodium phosphate Nutrition 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical class OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920006117 poly(hexamethylene terephthalamide)-co- polycaprolactam Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 1
- 229940080818 propionamide Drugs 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- XWKBMOUUGHARTI-UHFFFAOYSA-N tricalcium;diphosphite Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])[O-].[O-]P([O-])[O-] XWKBMOUUGHARTI-UHFFFAOYSA-N 0.000 description 1
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 description 1
- VMFOHNMEJNFJAE-UHFFFAOYSA-N trimagnesium;diphosphite Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])[O-].[O-]P([O-])[O-] VMFOHNMEJNFJAE-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- MGMXGCZJYUCMGY-UHFFFAOYSA-N tris(4-nonylphenyl) phosphite Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(OC=1C=CC(CCCCCCCCC)=CC=1)OC1=CC=C(CCCCCCCCC)C=C1 MGMXGCZJYUCMGY-UHFFFAOYSA-N 0.000 description 1
- QEDNBHNWMHJNAB-UHFFFAOYSA-N tris(8-methylnonyl) phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OCCCCCCCC(C)C QEDNBHNWMHJNAB-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
Definitions
- the present invention relates to a non-halogen flame-retardant polyamide resin composition. More specifically, it relates to a halogen-free, flame-retardant polyamide resin composition having high flame retardancy, good snap-fitting properties, and excellent resistance to heat discoloration.
- Polyamide resins are used in various fields such as electric/electronic parts and automobile parts, taking advantage of their excellent mechanical properties, electrical properties, chemical resistance, and the like.
- melamine cyanurate is used as a flame retardant when non-reinforced and non-halogen flame retardants are required to impart flame retardancy (for example, Patent Documents 1 and 2).
- melamine cyanurate has poor dispersibility in polyamide resins, and when the amount is increased, the mechanical properties of polyamide resins are reduced, bleeding occurs, and thermal decomposition causes melamine and cyanuric acid to decompose and sublimate easily.
- the melamine and cyanuric acid have drawbacks, such as generation of silver on the surface of the molded product during molding and contamination of the mold surface.
- the present invention is a flame-retardant polyamide resin that has UL94V-0 level flame retardancy over a wide range of thicknesses, less bleeding of flame retardants, excellent heat discoloration resistance, moldability, and snap-fitting of parts.
- a composition is provided.
- the present inventors have completed the present invention as a result of intensive research to solve the above problems.
- the present invention has the following configurations. - Contains polyamide resin (A) and melamine cyanurate (B), and 90 to 98 parts by mass of polyamide resin (A) and melamine cyanurate ( B) contained at a rate of 2 to 10 parts by mass, phosphorus antioxidant (C) 0.01 to 1 part by mass, hindered phenol antioxidant (D) 0.01 to 1 part by mass, and carbon number 22 or less fatty acid metal salt-based lubricant (E) in a proportion of 0.1 to 1 part by mass, the polyamide resin (A) is 55 to 85 mass% of polyamide 66 resin (A1), polyamide 6 resin (A2) A flame-retardant polyamide resin composition containing 15 to 45% by mass.
- the flame-retardant polyamide resin composition of the present invention not only has excellent heat discoloration resistance and moldability, but also does not significantly impair breaking strength and toughness, and has UL94V-0 level flame retardancy over a wide range of thickness. .
- Polyamide resin (A) The polyamide resin (A) in the present invention is not particularly limited as long as it is a polymer having an amide bond (--NHCO--) in its main chain.
- Polyamide resin (A) is preferably crystalline, for example, polyamide 6 (PA6), polyamide 66 (PA66), polyamide 46 (PA46), polyamide 11 (PA11), polyamide 12 (PA12), polyamide 610 (PA610 ), polyamide 612 (PA612), polymetaxylylene adipamide (PAMXD6), hexamethylenediamine-terephthalic acid polymer (PA6T), hexamethylenediamine-terephthalic acid and adipic acid polymer (PA6T/66), hexamethylenediamine - terephthalic acid and ⁇ -caprolactam copolymer (PA6T/6), trimethylhexamethylenediamine-terephthalic acid polymer (PATMD-T), meta
- the blending amount (content) of the polyamide resin (A) is 90 to 98 parts by mass when the total of the polyamide resin (A) and melamine cyanurate (B) is 100 parts by mass.
- the blending amount (content) of the polyamide resin (A) is preferably 92 to 96 parts by mass, more preferably 93 to 95 parts by mass.
- the blending amount of each component becomes the content as it is.
- the polyamide resin (A) in the present invention is preferably a mixture of polyamide 66 resin (A1) and polyamide 6 resin (A2) in terms of excellent moldability, melt fluidity and flame retardancy.
- Examples of the polyamide 66 resin (A1) in the present invention include polyamide 66 resins obtained by polycondensation of adipic acid and hexamethylenediamine as raw materials.
- the relative viscosity of the polyamide 66 resin (A-1) is preferably 2.2 to 3.5 as measured according to JIS K6810 at a concentration of 1% in 98% sulfuric acid at a temperature of 25°C. If the relative viscosity is less than 2.2, the mechanical properties tend to deteriorate, and if it exceeds 3.5, the melt fluidity tends to be insufficient.
- the relative viscosity of the polyamide 66 resin (A1) is more preferably 2.3-3.0.
- Polyamide 66 resin (A1) may be adjusted to a preferable relative viscosity range by mixing polyamide 66 resins having different relative viscosities.
- the terminal amino group concentration of the polyamide 66 resin (A1) is not particularly limited, it is preferably 50 to 90 eq/ton, more preferably 60 to 80 eq/ton in terms of heat discoloration resistance.
- the blending amount of the polyamide 66 resin (A1) is preferably 55 to 85 parts by mass based on 100 parts by mass of the polyamide resin (A). When the amount of the polyamide 66 resin (A1) exceeds 85 parts by mass, the hinge property (snap-fitting property) is deteriorated.
- the blending amount of the polyamide 66 resin (A1) is more preferably 60 to 80 parts by mass from the viewpoint of the balance between the snap fit property and the moldability.
- the polyamide 6 resin (A2) in the present invention is a polyamide 6 resin obtained by polycondensation using ⁇ -caprolactam as a raw material.
- the relative viscosity of the polyamide 6 resin (A2) is preferably 1.5 to 4.0 as measured according to JIS K6810 at a concentration of 1% in 98% sulfuric acid at a temperature of 25°C. If the relative viscosity is less than 1.5, the mechanical properties tend to deteriorate, and if it exceeds 3.6, flame retardancy and fluidity tend to be impaired.
- the relative viscosity of the polyamide 6 resin (A2) is more preferably 1.8-3.6.
- the polyamide 6 resin (A-2) may be adjusted to a preferable relative viscosity range by mixing polyamide 6 resins having different relative viscosities.
- the terminal amino group concentration of the polyamide 6 resin (A2) is not particularly limited, it is preferably 50 to 90 eq/ton, more preferably 60 to 80 eq/ton in terms of heat discoloration resistance.
- the blending amount of the polyamide 6 resin (A2) is preferably 15 to 45 parts by mass based on 100 parts by mass of the polyamide resin (A). If the amount of the polyamide 6 resin (A2) is less than 15 parts by mass, the hinge properties (snap fit properties) tend to deteriorate, and if it exceeds 45 parts by mass, the moldability tends to deteriorate.
- the blending amount of the polyamide 6 resin (A2) is more preferably 20 to 40 parts by mass from the viewpoint of the balance between snap-fitting properties and moldability.
- An amorphous polyamide resin (A3) can also be blended in order to improve the appearance of the molded product.
- Amorphous polyamide resins include 4,4'-diamino-3,3'-dimethyldicyclohexylmethane (CA), 4,4'-diaminodicyclohexylmethane (PACM), metaxylylenediamine (MXD), trimethylhexamethylene.
- Diamines such as diamine (TMD), isophoronediamine (IA), 4,4'-diaminodicyclohexylpropane (PACP), hexamethylenediamine, and dicarboxylic acids such as terphthalic acid, isophthalic acid, adipic acid, sebacic acid and dodecanedicarboxylic acid
- dicarboxylic acids such as terphthalic acid, isophthalic acid, adipic acid, sebacic acid and dodecanedicarboxylic acid
- Polymers, copolymers or blends obtained by polycondensation from acids and lactams such as caprolactam and lauryllactam can be exemplified.
- the amount of the amorphous polyamide resin (A3) to be blended is more preferably 0 to 15 parts by mass from the viewpoint of the balance between snap-fitting properties and moldability.
- Melamine cyanurate (B) in the present invention is preferably an equimolar reaction product of cyanuric acid and melamine. Moreover, some of the amino groups or hydroxyl groups in the melamine cyanurate may be substituted with other substituents.
- Melamine cyanurate can be obtained, for example, by mixing an aqueous solution of cyanuric acid and an aqueous solution of melamine, reacting the mixture with stirring at 90 to 100° C., and filtering the resulting precipitate. Although the obtained solid can be used as it is, it is preferable to use it after pulverizing it, if necessary.
- the particle size is not particularly limited, the average particle size is preferably 0.5 to 20 ⁇ m, more preferably 1 to 15 ⁇ m, from the viewpoint of flame retardancy and toughness.
- the blending amount (content) of melamine cyanurate (B) is 2 to 10 parts by mass when the total of polyamide resin (A) and melamine cyanurate (B) is 100 parts by mass. It is 2 parts by mass or more from the viewpoint of flame retardancy, and 10 parts by mass or less from the viewpoint of snap fit and bleeding. It is more preferably 3 to 9 parts by mass, still more preferably 4 to 8 parts by mass.
- the phosphorus-based antioxidant (C) in the present invention may be either an inorganic compound or an organic compound, and is not particularly limited.
- Preferred phosphorus compounds include inorganic phosphates such as monosodium phosphate, disodium phosphate, trisodium phosphate, sodium phosphite, calcium phosphite, magnesium phosphite, manganese phosphite, triphenylphosphite, Phyte, Trioctadecylphosphite, Tridecylphosphite, Triisodecylphosphite, Trinonylphenylphosphite, Diphenylisodecylphosphite, Diphenylalkylphosphite, Phenyldialkylphosphite, Tris(nonylphenyl)phosphite, Trilauryl Phosphite,
- a phosphite compound is preferable as the phosphorus-based antioxidant (C).
- the phosphite compounds compounds having a pentaerythritol diphosphite skeleton are preferred.
- compounds having a pentaerythritol diphosphite skeleton are preferred.
- bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite (“ADEKASTAB PEP-36”, molecular weight 633)
- bis(2,4-di-tert-butyl phenyl) pentaerythritol diphosphite (“ADEKASTAB PEP-24G”, molecular weight 604)
- distearylpentaerythritol diphosphite (“ADEKASTAB PEP-8”, molecular weight 733)
- bis(nonylphenyl) pentaerythritol diphosphite (“ Adekastab
- the amount (content) of the phosphorus-based antioxidant (C) is 0.01 to 1 part by mass when the total of the polyamide resin (A) and melamine cyanurate (B) is 100 parts by mass.
- the content of the phosphorus antioxidant (C) is preferably 0.1 to 0.5 parts by mass.
- the hindered phenol-based antioxidant (D) in the present invention includes N,N'-hexamethylene-bis-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide, bis(3 , 3-bis-(4′-hydroxy-3′-tert-butylphenyl)butanoic acid) glycol ester, 2,1′-thioethylbis(3-(3,5-di-tert-butyl-4-hydroxyphenyl) Propionate, 4,4'-butylidene-bis(3-methyl-6-tert-butylphenol), triethylene glycol-3-(3-tert-butyl-4-hydroxy-5-methylphenyl) propionate "SONGNOX2450", molecular weight 633), etc., and mixtures of two or more of these can also be used.
- the amount (content) of the hindered phenol-based antioxidant (D) is 0.01 to 1 part by mass when the total of the polyamide resin (A) and melamine cyanurate (B) is 100 parts by mass.
- the content of the hindered phenol-based antioxidant (D) is preferably 0.1 to 0.5 parts by mass.
- fatty acid metal salt-based lubricant having 22 or less carbon atoms examples include metal salts of fatty acids such as stearic acid, palmitic acid and behenic acid.
- a fatty acid metal salt-based lubricant with a carbon number of 22 or less not only is the releasability improved, but the temperature at which fatty acid-derived combustion gas starts to be generated during combustion and the generation of non-combustible gas generated by the decomposition of melamine cyanurate. Since the temperatures are close to each other, ignition of combustible gas can be prevented, so flame retardancy tends to be exhibited even better.
- a metal salt of an aliphatic carboxylic acid having 18 or less carbon atoms is more preferable, and an alkali metal or alkaline earth metal salt such as stearic acid or palmitic acid is more preferable from the viewpoint of achieving both releasability and flame retardancy.
- Alkali metals or alkaline earth metals include, for example, lithium, sodium, magnesium, calcium salts and the like.
- the alkali metal or alkaline earth metal salt of stearic acid has the same starting temperature for generating combustible gas derived from fatty acid by decomposition of fatty acid metal salt and non-combustible gas generated by decomposition of melamine cyanurate during combustion, so it is flame retardant by addition. It is optimal because it can improve the releasability without causing a decrease in the
- the blending amount (content) of the fatty acid metal salt-based lubricant (E) is 0.1 to 1 part by mass when the total of the polyamide resin (A) and melamine cyanurate (B) is 100 parts by mass. If the amount exceeds 1 part by mass, the flame retardancy may deteriorate.
- the amount of the fatty acid metal salt-based lubricant (E) to be blended is preferably 0.2 to 0.8 parts by mass.
- the total of the components (A), (B), (C), (D), and (E) described above preferably accounts for 80% by mass or more, More preferably, it accounts for 90% by mass or more, and even more preferably 95% by mass or more.
- Suitable molded parts obtained using the flame-retardant polyamide resin composition of the present invention specifically include connectors, coil bobbins, breakers, electromagnetic switches and holders used in fields such as electric/electronic parts and automobile parts. Molded parts such as plugs, sockets, switches, cases, covers, etc. More specifically, parts that require heat discoloration resistance and snap fit properties such as ferrite core covers, ESC locks, cable ties, and electrical wiring protection members. is.
- the method for producing the flame-retardant polyamide resin composition of the present invention is not particularly limited, and a general single-screw extruder, twin-screw extruder, pressure kneader, or the like can be used as a kneading device.
- a twin-screw extruder is particularly preferred.
- the above (A), (B), (C), (D), and (E) and, depending on the application, pigments and the like are mixed and fed into a twin-screw extruder.
- a polyamide-based resin composition having excellent toughness and flame retardancy can be produced by uniformly kneading with a twin-screw extruder.
- the kneading temperature of the twin-screw extruder is preferably 220 to 300° C., and the kneading time is preferably about 2 to 15 minutes.
- A2-2: Polyamide 6 (RV 3.6) ZISAMIDE TP6603 (manufactured by Shusei), melting point 225°C
- B melamine cyanurate (B); B: MC6000 (manufactured by Nissan Chemical Co., Ltd.)
- C ADEKA STAB PEP-36 (manufactured by ADEKA Corporation)
- E fatty acid metal salt-based lubricant
- E1 Magnesium stearate NP-1500S (manufactured by Tannan Chemical Industry Co., Ltd.) other release agents
- E2 Calcium montanate CS-8-CP (manufactured by Nitto Kasei Kogyo Co., Ltd.)
- E3 Fatty acid ester Recolb WE-40 (manufactured by Clariant Japan Co., Ltd.)
- each raw material was weighed in the blending ratio of the polyamide resin composition shown in Table 1, mixed in a tumbler, and charged into a twin-screw extruder.
- the set temperature of the twin-screw extruder was 250° C. to 300° C., and the kneading time was 5 to 10 minutes.
- the obtained pellets were molded into various evaluation samples using an injection molding machine.
- the cylinder temperature of the injection molding machine was 250°C to 280°C, and the mold temperature was 80°C.
- Table 1 shows the evaluation results.
- Relative viscosity of polyamide resin [RV] (98% sulfuric acid solution method) Using an Ubbelohde viscometer, measurement was performed at 25° C. with a 98 mass % sulfuric acid solution and a polyamide resin concentration of 1 g/dl.
- Melting Point of Polyamide Resin Measurement was performed using a differential scanning calorimeter EXSTAR 6000 (Seiko Instruments Inc.) at a heating rate of 20° C./min, and the peak top temperature of the endothermic peak was determined as the melting point. 3.
- Snap fit property (tensile strength, tensile elongation): Measured according to ISO527 to determine tensile strength (tensile strength) and tensile elongation (tensile breaking strain). 4. Flammability: Measured according to UL94, Vertical Burning Test. V-0 represents the highest flame retardancy. 5. Bleeding property: A molded product of 100 mm x 100 mm with a thickness of 2 mm was left at rest for 96 hours in a constant temperature and humidity bath set at 80 ° C. and 95% RH at least twice, and then returned to room temperature and precipitates were present on the surface. It was confirmed visually with a stereoscopic microscope. 6.
- Thermal discoloration The color difference ( ⁇ E) between the pellets after being left in the oven for 8 hours at a temperature of 120° C. and the pellets before treatment was calculated. 7. Moldability: Using a mold equipped with a mold release force measuring device, molding was performed under the above molding temperature conditions, and the mold release force was measured from the 31st shot to the 35th shot to obtain the mold release resistance value.
- the tensile strength is equivalent to that of general polyamide 6, 66 resin, the tensile elongation is 5% or more, there is no breakage even after the tensile yield point is exceeded, and there is no significant embrittlement. It is expected that a good snap-fit property will be obtained.
- Examples 1 to 12 achieved UL94 V-0 evaluation, demonstrating high flame retardancy over a wide range of thicknesses. It can be seen that it has In terms of heat discoloration, Examples 1 to 12 had ⁇ E of 20 or less after 8 hours at 120° C., indicating that discoloration in a heat environment is suppressed.
- the molded article has a resistance value of 1 MPa or less when released from the mold, and the composition has an extremely low possibility of deformation and adhesion of the molded article during release even if continuously molded.
- Comparative Examples 1 to 7 partially satisfy the characteristics, Comparative Example 1 was evaluated as UL94 V-2 in terms of flame retardancy at thicknesses of 0.4, 0.8, 1.6, and 3.0 mm. It is not preferable because the flame retardancy is greatly lowered. Comparative Example 2 has a tensile elongation of 3%, and embrittlement cannot be suppressed, which is not preferable. In Comparative Example 3, the flame retardancy at thicknesses of 0.4, 0.8, 1.6, and 3.0 mm was rated V-2, and the tensile elongation was 3%, which was sufficient. It is difficult to say that both the flame retardancy and the snap-fit property are compatible, which is not preferable.
- Comparative Examples 4, 5, and 7 are evaluated as UL94 V-2 in terms of flame retardancy at thicknesses of 0.8, 1.6, and 3.0 mm, and it cannot be said that flame retardancy is high in a wide range of thicknesses. I don't like it because it's too hot.
- the mold release resistance which is an index of moldability, exceeded 1 MPa, and it cannot be said that the moldability is good (good mold release), which is also undesirable in this respect.
- Comparative Example 6 in addition to the UL94 V-2 evaluation for flame retardancy at thicknesses of 0.8, 1.6, and 3.0 mm, the tensile elongation is 3%, which is sufficient. It is difficult to say that both flame retardancy and snap-fitting are achieved, which is undesirable.
- the flame-retardant polyamide resin composition of the present invention has a wide range of product thicknesses and is suitable for molded products that have a hinge portion. and excellent snap-fitting properties, it can be suitably used for electric/electronic parts, automobile parts, etc. where both high flame retardancy and snap-fitting properties are desired.
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
しかしながら、メラミンシアヌレートは、ポリアミド樹脂に対する分散性が悪く、配合量が多くなるとポリアミド樹脂の機械的特性が低下する、ブリードする、熱分解によりメラミンとシアヌル酸とに分解し昇華しやすく、昇華したメラミン及びシアヌル酸の影響で成形加工時に成形品表面にシルバーの発生や、金型表面を汚染しやすい、などの欠点を有している。 Polyamide resins are used in various fields such as electric/electronic parts and automobile parts, taking advantage of their excellent mechanical properties, electrical properties, chemical resistance, and the like. In these fields, melamine cyanurate is used as a flame retardant when non-reinforced and non-halogen flame retardants are required to impart flame retardancy (for example, Patent Documents 1 and 2).
However, melamine cyanurate has poor dispersibility in polyamide resins, and when the amount is increased, the mechanical properties of polyamide resins are reduced, bleeding occurs, and thermal decomposition causes melamine and cyanuric acid to decompose and sublimate easily. The melamine and cyanuric acid have drawbacks, such as generation of silver on the surface of the molded product during molding and contamination of the mold surface.
・ ポリアミド樹脂(A)及びメラミンシアヌレート(B)を含有し、前記成分(A)及び(B)の合計100質量部に対して、ポリアミド樹脂(A)90~98質量部及びメラミンシアヌレート(B)2~10質量部の割合で含有し、リン系酸化防止剤(C)0.01~1質量部、ヒンダードフェノール系酸化防止剤(D)0.01~1質量部、及び炭素数22以下の脂肪酸金属塩系潤滑剤(E)0.1~1質量部の割合で含有し、前記ポリアミド樹脂(A)はポリアミド66樹脂(A1)55~85質量%、ポリアミド6樹脂(A2)15~45質量%を含有する難燃性ポリアミド樹脂組成物。
[2] 前記脂肪酸金属塩系潤滑剤(E)が、ステアリン酸の金属塩である[1]に記載の難燃性ポリアミド樹脂組成物。
[3] [1]~[2]のいずれかに記載の難燃性ポリアミド樹脂組成物からなる成形品。
[4] 前記成形品が、フェライトコアカバー、エスシーロック、結束バンド、電気配線保護部材のいずれかである[3]に記載の成形品。 That is, the present invention has the following configurations.
- Contains polyamide resin (A) and melamine cyanurate (B), and 90 to 98 parts by mass of polyamide resin (A) and melamine cyanurate ( B) contained at a rate of 2 to 10 parts by mass, phosphorus antioxidant (C) 0.01 to 1 part by mass, hindered phenol antioxidant (D) 0.01 to 1 part by mass, and carbon number 22 or less fatty acid metal salt-based lubricant (E) in a proportion of 0.1 to 1 part by mass, the polyamide resin (A) is 55 to 85 mass% of polyamide 66 resin (A1), polyamide 6 resin (A2) A flame-retardant polyamide resin composition containing 15 to 45% by mass.
[2] The flame-retardant polyamide resin composition according to [1], wherein the fatty acid metal salt-based lubricant (E) is a metal salt of stearic acid.
[3] A molded article made of the flame-retardant polyamide resin composition according to any one of [1] to [2].
[4] The molded article according to [3], which is any one of a ferrite core cover, an ESC lock, a binding band, and an electrical wiring protection member.
[ポリアミド樹脂(A)]
本発明におけるポリアミド樹脂(A)としては、主鎖中にアミド結合(-NHCO-)を有する重合体であれば特に限定されない。ポリアミド樹脂(A)は、結晶性であることが好ましく、例えばポリアミド6(PA6)、ポリアミド66(PA66)、ポリアミド46(PA46)、ポリアミド11(PA11)、ポリアミド12(PA12)、ポリアミド610(PA610)、ポリアミド612(PA612)、ポリメタキシリレンアジパミド(PAMXD6)、ヘキサメチレンジアミン-テレフタル酸重合体(PA6T)、ヘキサメチレンジアミン-テレフタル酸およびアジピン酸重合体(PA6T/66)、ヘキサメチレンジアミン-テレフタル酸およびεカプロラクタム共重合体(PA6T/6)、トリメチルヘキサメチレンジアミン-テレフタル酸重合体(PATMD-T)、メタキシリレンジアミンとアジピン酸およびイソフタル酸共重合体(PAMXD6/MXDI)、トリヘキサメチレンジアミンとテレフタル酸およびε-カプロラクタム共重合体(PATMDT/6)、ジアミノジシクロヘキシレンメタンとイソフタル酸およびラウリルラクタム共重合体等の結晶性ポリアミド樹脂、もしくはこれらのブレンド物等を例示することが出来るが、これらに限定されるものではない。 The present invention will be specifically described below.
[Polyamide resin (A)]
The polyamide resin (A) in the present invention is not particularly limited as long as it is a polymer having an amide bond (--NHCO--) in its main chain. Polyamide resin (A) is preferably crystalline, for example, polyamide 6 (PA6), polyamide 66 (PA66), polyamide 46 (PA46), polyamide 11 (PA11), polyamide 12 (PA12), polyamide 610 (PA610 ), polyamide 612 (PA612), polymetaxylylene adipamide (PAMXD6), hexamethylenediamine-terephthalic acid polymer (PA6T), hexamethylenediamine-terephthalic acid and adipic acid polymer (PA6T/66), hexamethylenediamine - terephthalic acid and ε-caprolactam copolymer (PA6T/6), trimethylhexamethylenediamine-terephthalic acid polymer (PATMD-T), meta-xylylenediamine and adipic and isophthalic acid copolymer (PAMXD6/MXDI), tri Examples include crystalline polyamide resins such as hexamethylenediamine, terephthalic acid and ε-caprolactam copolymer (PATMDT/6), diaminodicyclohexylenemethane, isophthalic acid and lauryllactam copolymer, or blends thereof. are possible, but not limited to these.
非晶性ポリアミド樹脂としては、4,4'-ジアミノ-3,3'-ジメチルジシクロヘキシルメタン(CA)、4,4’-ジアミノジシクロヘキシルメタン(PACM)、メタキシリレンジアミン(MXD)、トリメチルヘキサメチレンジアミン(TMD)、イソフォロンジアミン(IA)、4,4’-ジアミノジシクロヘキシルプロパン(PACP)、ヘキサメチレンジアミン等のジアミンと、テルフタル酸、イソフタル酸、アジピン酸、セバシン酸、ドデカンジカルボン酸等のジカルボン酸およびカプロラクタム、ラウリルラクタム等のラクタム類から重縮合して得られる重合体または共重合体もしくはブレンド物等を例示することができる。非晶性ポリアミド樹脂(A3)の配合量は、スナップフィット性と成形加工性のバランスの点より、0~15質量部がより好ましい。 An amorphous polyamide resin (A3) can also be blended in order to improve the appearance of the molded product.
Amorphous polyamide resins include 4,4'-diamino-3,3'-dimethyldicyclohexylmethane (CA), 4,4'-diaminodicyclohexylmethane (PACM), metaxylylenediamine (MXD), trimethylhexamethylene. Diamines such as diamine (TMD), isophoronediamine (IA), 4,4'-diaminodicyclohexylpropane (PACP), hexamethylenediamine, and dicarboxylic acids such as terphthalic acid, isophthalic acid, adipic acid, sebacic acid and dodecanedicarboxylic acid Polymers, copolymers or blends obtained by polycondensation from acids and lactams such as caprolactam and lauryllactam can be exemplified. The amount of the amorphous polyamide resin (A3) to be blended is more preferably 0 to 15 parts by mass from the viewpoint of the balance between snap-fitting properties and moldability.
本発明におけるメラミンシアヌレート(B)としては、シアヌル酸とメラミンとの等モル反応物が好ましく挙げられる。また、メラミンシアヌレート中のアミノ基又は水酸基の一部が、他の置換基で置換されていても良い。メラミンシアヌレートは、例えば、シアヌル酸の水溶液とメラミンの水溶液とを混合し、90~100℃の撹拌下で反応させて、生成した沈殿をろ過することによって得ることができる。得られた固体はそのままでも使用できるが、必要に応じて粉砕して使用することが好ましい。粒子径として特に制限はないが、難燃性と靱性の観点から、好ましくは平均粒子径が0.5~20μmであり、より好ましくは1~15μmである。 [Melamine cyanurate (B)]
Melamine cyanurate (B) in the present invention is preferably an equimolar reaction product of cyanuric acid and melamine. Moreover, some of the amino groups or hydroxyl groups in the melamine cyanurate may be substituted with other substituents. Melamine cyanurate can be obtained, for example, by mixing an aqueous solution of cyanuric acid and an aqueous solution of melamine, reacting the mixture with stirring at 90 to 100° C., and filtering the resulting precipitate. Although the obtained solid can be used as it is, it is preferable to use it after pulverizing it, if necessary. Although the particle size is not particularly limited, the average particle size is preferably 0.5 to 20 μm, more preferably 1 to 15 μm, from the viewpoint of flame retardancy and toughness.
本発明におけるリン系酸化防止剤(C)としては、無機化合物でも有機化合物でもよく、特に制限はない。好ましいリン系化合物としては、リン酸一ナトリウム、リン酸二ナトリウム、リン酸三ナトリウム、亜リン酸ナトリウム、亜リン酸カルシウム、亜リン酸マグネシウム、亜リン酸マンガン、などの無機リン酸塩、トリフェニルホスファイト、トリオクタデシルホスファイト、トリデシルホスファイト、トリイソデシルホスファイト、トリノニルフェニルホスファイト、ジフェニルイソデシルホスファイト、ジフェニルアルキルホスファイト、フェニルジアルキルホスファイト、トリス(ノニルフェニル)ホスファイト、トリラウリルホスファイト、ジステアリルペンタエリスリトールジホスファイト、トリス(2,4-ジ-tert-ブチルフェニル)ホスファイト、ジイソデシルペンタエリスリトールジホスファイト、ビス(2,4-ジ-tert-ブチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,6-ジ-tert-ブチル-4-メチルフェニル)ペンタエリスリトールジホスファイト、ジイソデシルオキシペンタエリスリトールジホスファイト、ビス(2,4-ジ-tert-ブチル-6-メチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,4,6-トリス(tert-ブチルフェニル))ペンタエリスリトールジホスファイト、トリステアリルソルビトールトリホスファイト、テトラキス(2,4-ジ-tert-ブチルフェニル)-4,4’-ビフェニレンジホスホナイト、6-イソオクチルオキシ-2,4,8,10-テトラ-tert-ブチル-12H-ジベンゾ[d,g]-1,3,2-ジオキサホスホシン、6-フルオロ-2,4,8,10-テトラ-tert-ブチル-12-メチル-ジベンゾ[d,g]-1,3,2-ジオキサホスホシン、ビス(2,4-ジ-tert-ブチル-6-メチルフェニル)メチルホスファイト及びビス(2,4-ジ-tert-ブチル-6-メチルフェニル)エチルホスファイトなどが挙げられ、耐熱変色性を高めるために配合される。 [Phosphorus-based antioxidant (C)]
The phosphorus-based antioxidant (C) in the present invention may be either an inorganic compound or an organic compound, and is not particularly limited. Preferred phosphorus compounds include inorganic phosphates such as monosodium phosphate, disodium phosphate, trisodium phosphate, sodium phosphite, calcium phosphite, magnesium phosphite, manganese phosphite, triphenylphosphite, Phyte, Trioctadecylphosphite, Tridecylphosphite, Triisodecylphosphite, Trinonylphenylphosphite, Diphenylisodecylphosphite, Diphenylalkylphosphite, Phenyldialkylphosphite, Tris(nonylphenyl)phosphite, Trilauryl Phosphite, distearylpentaerythritol diphosphite, tris(2,4-di-tert-butylphenyl)phosphite, diisodecylpentaerythritol diphosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite Phosphites, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, diisodecyloxypentaerythritol diphosphite, bis(2,4-di-tert-butyl-6-methylphenyl) ) pentaerythritol diphosphite, bis(2,4,6-tris(tert-butylphenyl))pentaerythritol diphosphite, tristearylsorbitol triphosphite, tetrakis(2,4-di-tert-butylphenyl)-4 ,4′-biphenylenediphosphonite, 6-isooctyloxy-2,4,8,10-tetra-tert-butyl-12H-dibenzo[d,g]-1,3,2-dioxaphosphosine, 6 -fluoro-2,4,8,10-tetra-tert-butyl-12-methyl-dibenzo[d,g]-1,3,2-dioxaphosphosine, bis(2,4-di-tert-butyl -6-methylphenyl)methyl phosphite and bis(2,4-di-tert-butyl-6-methylphenyl)ethyl phosphite and the like, which are blended to enhance resistance to heat discoloration.
本発明におけるヒンダードフェノール系酸化防止剤(D)としては、N,N’-ヘキサメチレン-ビス-3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオンアミド、ビス(3,3-ビス-(4’-ヒドロキシ-3’-tert-ブチルフェニル)ブタン酸)グリコールエステル、2,1’-チオエチルビス(3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオネート、4,4’-ブチリデン-ビス(3-メチル-6-tert-ブチルフェノール)、トリエチレングリコール-3-(3-tert-ブチル-4-ヒドロキシ-5-メチルフェニル)プロピオネート「SONGNOX2450」、分子量633)などが挙げられ、これらの二つ以上の混合物も用いることができる。 [Hindered phenolic antioxidant (D)]
The hindered phenol-based antioxidant (D) in the present invention includes N,N'-hexamethylene-bis-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide, bis(3 , 3-bis-(4′-hydroxy-3′-tert-butylphenyl)butanoic acid) glycol ester, 2,1′-thioethylbis(3-(3,5-di-tert-butyl-4-hydroxyphenyl) Propionate, 4,4'-butylidene-bis(3-methyl-6-tert-butylphenol), triethylene glycol-3-(3-tert-butyl-4-hydroxy-5-methylphenyl) propionate "SONGNOX2450", molecular weight 633), etc., and mixtures of two or more of these can also be used.
本発明における炭素数22以下の脂肪酸金属塩系潤滑剤(E)としては、ステアリン酸、パルミチン酸、ベヘン酸等の脂肪酸の金属塩が挙げられる。炭素数22以下の脂肪酸金属塩系潤滑剤を用いることで、離形性を向上させるだけでなく、燃焼時に脂肪酸由来の燃焼ガスの発生開始温度とメラミンシアヌレートの分解で生じる不燃ガスの発生開始温度が近いため、可燃ガスへの引火を妨げることができるため、難燃性をさらに良好に発揮できる傾向にある。 [Fatty acid metal salt-based lubricant having 22 or less carbon atoms (E)]
Examples of the fatty acid metal salt-based lubricant (E) having 22 or less carbon atoms in the present invention include metal salts of fatty acids such as stearic acid, palmitic acid and behenic acid. By using a fatty acid metal salt-based lubricant with a carbon number of 22 or less, not only is the releasability improved, but the temperature at which fatty acid-derived combustion gas starts to be generated during combustion and the generation of non-combustible gas generated by the decomposition of melamine cyanurate. Since the temperatures are close to each other, ignition of combustible gas can be prevented, so flame retardancy tends to be exhibited even better.
本発明の難燃性ポリアミド樹脂組成物には、本発明の目的を損なわない範囲で、上述した(A)、(B)、(C)、(D)、(E)の他に、他の成分、例えば顔料、染料等の着色剤や、熱安定剤、耐候性改良剤、核剤、可塑剤、離型剤、帯電防止剤等の添加剤、他の樹脂ポリマー等を添加することができる。本発明の難燃性ポリアミド樹脂組成物には、上述した(A)、(B)、(C)、(D)、及び(E)成分の合計で、80質量%以上を占めることが好ましく、90質量%以上を占めることがより好ましく、95質量%以上を占めることが更に好ましい。 [Other ingredients]
In addition to (A), (B), (C), (D) and (E) described above, other Components such as colorants such as pigments and dyes, additives such as heat stabilizers, weather resistance improvers, nucleating agents, plasticizers, release agents and antistatic agents, and other resin polymers can be added. . In the flame-retardant polyamide resin composition of the present invention, the total of the components (A), (B), (C), (D), and (E) described above preferably accounts for 80% by mass or more, More preferably, it accounts for 90% by mass or more, and even more preferably 95% by mass or more.
ポリアミド樹脂(A);
A1-1:ポリアミド66(RV=2.8) Vydyne 21Z(Ascend社製)、融点265℃
A1-2:ポリアミド66(RV=2.4) EPR24 (上海神馬塑料科技術有限公司製)、融点265℃
A2-1:ポリアミド6(RV=2.0) M2000(MEIDA社製)、融点225℃
A2-2:ポリアミド6(RV=3.6) ZISAMIDE TP6603(集盛社製)、融点225℃ The following components were used for each component.
polyamide resin (A);
A1-1: Polyamide 66 (RV = 2.8) Vydyne 21Z (manufactured by Ascend), melting point 265°C
A1-2: Polyamide 66 (RV = 2.4) EPR24 (manufactured by Shanghai Jinma Plastic Technology Co., Ltd.), melting point 265°C
A2-1: Polyamide 6 (RV = 2.0) M2000 (manufactured by MEIDA), melting point 225 ° C.
A2-2: Polyamide 6 (RV = 3.6) ZISAMIDE TP6603 (manufactured by Shusei), melting point 225°C
B:MC6000(日産化学株式会社製) melamine cyanurate (B);
B: MC6000 (manufactured by Nissan Chemical Co., Ltd.)
C:アデカスタブPEP-36(ADEKA株式会社製) phosphorus antioxidant (C);
C: ADEKA STAB PEP-36 (manufactured by ADEKA Corporation)
D:SONGNOX2450(ソンウォンインターナショナルジャパン社製) Hindered phenolic antioxidant (D);
D: SONGNOX2450 (manufactured by Songwon International Japan)
E1:ステアリン酸マグネシウム N.P.-1500S(淡南化学工業株式会社製)
その他の離型剤;
E2:モンタン酸カルシウム CS-8-CP(日東化成工業株式会社製)
E3:脂肪酸エステル リコルブ WE-40(クラリアントジャパン株式会社製) fatty acid metal salt-based lubricant (E);
E1: Magnesium stearate NP-1500S (manufactured by Tannan Chemical Industry Co., Ltd.)
other release agents;
E2: Calcium montanate CS-8-CP (manufactured by Nitto Kasei Kogyo Co., Ltd.)
E3: Fatty acid ester Recolb WE-40 (manufactured by Clariant Japan Co., Ltd.)
評価サンプルの製造は、表1に示したポリアミド樹脂組成物の配合割合に各原料を計量し、タンブラーで混合した後、二軸押出機に投入した。二軸押出機の設定温度は250℃~300℃、混錬時間は5~10分とした。得られたペレットは、射出成形機で各種の評価サンプルを成形した。射出成形機のシリンダー温度は、250℃~280℃、金型温度は80℃とした。 [Examples 1 to 12, Comparative Examples 1 to 7]
In the production of the evaluation samples, each raw material was weighed in the blending ratio of the polyamide resin composition shown in Table 1, mixed in a tumbler, and charged into a twin-screw extruder. The set temperature of the twin-screw extruder was 250° C. to 300° C., and the kneading time was 5 to 10 minutes. The obtained pellets were molded into various evaluation samples using an injection molding machine. The cylinder temperature of the injection molding machine was 250°C to 280°C, and the mold temperature was 80°C.
1.ポリアミド樹脂の相対粘度[RV](98%硫酸溶液法)
ウベローデ粘度管を用い、25℃において98質量%硫酸溶液で、ポリアミド樹脂濃度1g/dlで測定した。
2.ポリアミド樹脂の融点
示差走査熱量計 セイコーインスツルメンツ株式会社 EXSTAR 6000を用いて、昇温速度20℃/分で測定し、吸熱ピークのピークトップ温度を融点として求めた。
3.スナップフィット性(引張強度、引張伸度):ISO527に準じて測定し、引張強度(引張強さ)および引張伸度(引張破壊ひずみ)を求めた。
4.燃焼性:UL94、垂直燃焼試験に準じて測定した。V-0が、最も難燃性が高いことを表す。
5.ブリード性:厚み2mmの100mm×100mmの成形品を温度80℃、95%RHに設定した恒温恒湿槽に96時間静置を少なくとも2回以上繰り返し、その後室温に戻して表面に析出物が存在するか、実体顕微鏡にて目視で確認した。
6.熱変色性:温度120℃、オーブン内放置時間8hr後のペレットと処理前ペレットとの色差(ΔE)を算出した。
7.成形性:離型力測定装置を取り付けた金型を用いて上記成形温度条件で成形を行い、31ショット目から35ショットまでの離型力を測定して離型抵抗値を求めた。 Various evaluation methods are as follows. Table 1 shows the evaluation results.
1. Relative viscosity of polyamide resin [RV] (98% sulfuric acid solution method)
Using an Ubbelohde viscometer, measurement was performed at 25° C. with a 98 mass % sulfuric acid solution and a polyamide resin concentration of 1 g/dl.
2. Melting Point of Polyamide Resin Measurement was performed using a differential scanning calorimeter EXSTAR 6000 (Seiko Instruments Inc.) at a heating rate of 20° C./min, and the peak top temperature of the endothermic peak was determined as the melting point.
3. Snap fit property (tensile strength, tensile elongation): Measured according to ISO527 to determine tensile strength (tensile strength) and tensile elongation (tensile breaking strain).
4. Flammability: Measured according to UL94, Vertical Burning Test. V-0 represents the highest flame retardancy.
5. Bleeding property: A molded product of 100 mm x 100 mm with a thickness of 2 mm was left at rest for 96 hours in a constant temperature and humidity bath set at 80 ° C. and 95% RH at least twice, and then returned to room temperature and precipitates were present on the surface. It was confirmed visually with a stereoscopic microscope.
6. Thermal discoloration: The color difference (ΔE) between the pellets after being left in the oven for 8 hours at a temperature of 120° C. and the pellets before treatment was calculated.
7. Moldability: Using a mold equipped with a mold release force measuring device, molding was performed under the above molding temperature conditions, and the mold release force was measured from the 31st shot to the 35th shot to obtain the mold release resistance value.
Claims (4)
- ポリアミド樹脂(A)及びメラミンシアヌレート(B)を含有し、前記成分(A)及び(B)の合計100質量部に対して、ポリアミド樹脂(A)90~98質量部、メラミンシアヌレート(B)2~10質量部、リン系酸化防止剤(C)0.01~1質量部、ヒンダードフェノール系酸化防止剤(D)0.01~1質量部、及び炭素数22以下の脂肪酸金属塩系潤滑剤(E)0.1~1質量部の割合で含有し、前記ポリアミド樹脂(A)はポリアミド66樹脂(A1)55~85質量%、ポリアミド6樹脂(A2)15~45質量%を含有する難燃性ポリアミド樹脂組成物。 Polyamide resin (A) and melamine cyanurate (B) are contained, and 90 to 98 parts by mass of polyamide resin (A) and melamine cyanurate (B ) 2 to 10 parts by mass, phosphorus antioxidant (C) 0.01 to 1 part by mass, hindered phenol antioxidant (D) 0.01 to 1 part by mass, and fatty acid metal salt having 22 or less carbon atoms System lubricant (E) is contained in a proportion of 0.1 to 1 part by mass, and the polyamide resin (A) contains 55 to 85% by mass of polyamide 66 resin (A1) and 15 to 45% by mass of polyamide 6 resin (A2). flame-retardant polyamide resin composition containing;
- 前記脂肪酸金属塩系潤滑剤(E)が、ステアリン酸の金属塩である請求項1に記載の難燃性ポリアミド樹脂組成物。 The flame-retardant polyamide resin composition according to claim 1, wherein the fatty acid metal salt-based lubricant (E) is a metal salt of stearic acid.
- 請求項1~2のいずれかに記載の難燃性ポリアミド樹脂組成物からなる成形品。 A molded article made of the flame-retardant polyamide resin composition according to any one of claims 1 and 2.
- 前記成形品が、フェライトコアカバー、エスシーロック、結束バンド、電気配線保護部材のいずれかである請求項3に記載の成形品。 The molded article according to claim 3, wherein the molded article is any one of a ferrite core cover, an ESC lock, a binding band, and an electrical wiring protection member.
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JPS62195043A (en) * | 1986-02-21 | 1987-08-27 | Mitsubishi Chem Ind Ltd | Flame-retardant polyamide resin composition |
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- 2022-01-14 CN CN202280009842.6A patent/CN116724079A/en active Pending
- 2022-01-14 WO PCT/JP2022/001087 patent/WO2022158383A1/en active Application Filing
- 2022-01-17 TW TW111101800A patent/TW202237744A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62195043A (en) * | 1986-02-21 | 1987-08-27 | Mitsubishi Chem Ind Ltd | Flame-retardant polyamide resin composition |
CN108795037A (en) * | 2018-06-21 | 2018-11-13 | 广东聚石化学股份有限公司 | A kind of uvioresistant halogen-free reinforced nylon composition and preparation method thereof for fastener |
WO2021044880A1 (en) * | 2019-09-02 | 2021-03-11 | 東洋紡株式会社 | Flame-retardant polyamide resin composition and molded article comprising same |
Also Published As
Publication number | Publication date |
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JPWO2022158383A1 (en) | 2022-07-28 |
CN116724079A (en) | 2023-09-08 |
TW202237744A (en) | 2022-10-01 |
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