WO2022145356A1 - Resin composition, cured product, laminate, cured product manufacturing method and semiconductor device - Google Patents
Resin composition, cured product, laminate, cured product manufacturing method and semiconductor device Download PDFInfo
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- WO2022145356A1 WO2022145356A1 PCT/JP2021/048099 JP2021048099W WO2022145356A1 WO 2022145356 A1 WO2022145356 A1 WO 2022145356A1 JP 2021048099 W JP2021048099 W JP 2021048099W WO 2022145356 A1 WO2022145356 A1 WO 2022145356A1
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- resin
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- 239000011342 resin composition Substances 0.000 title claims abstract description 207
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 289
- 239000011347 resin Substances 0.000 claims abstract description 289
- 239000002243 precursor Substances 0.000 claims abstract description 145
- 125000005647 linker group Chemical group 0.000 claims abstract description 48
- 239000004202 carbamide Substances 0.000 claims abstract description 46
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 43
- 150000001875 compounds Chemical class 0.000 claims description 289
- 239000004642 Polyimide Substances 0.000 claims description 151
- 229920001721 polyimide Polymers 0.000 claims description 151
- 239000010410 layer Substances 0.000 claims description 128
- 239000002253 acid Substances 0.000 claims description 92
- 125000000962 organic group Chemical group 0.000 claims description 88
- 238000010438 heat treatment Methods 0.000 claims description 82
- 239000004962 Polyamide-imide Substances 0.000 claims description 80
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 80
- 229920002312 polyamide-imide Polymers 0.000 claims description 80
- 229910052751 metal Inorganic materials 0.000 claims description 68
- 239000002184 metal Substances 0.000 claims description 68
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 50
- 229920002577 polybenzoxazole Polymers 0.000 claims description 49
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 40
- 125000004122 cyclic group Chemical group 0.000 claims description 33
- ORMSTDJYMPIZAO-UHFFFAOYSA-N 1,1,2-trichloro-2-fluoroethane Chemical compound FC(Cl)C(Cl)Cl ORMSTDJYMPIZAO-UHFFFAOYSA-N 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 24
- 239000011229 interlayer Substances 0.000 claims description 8
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 description 273
- -1 vinylphenyl group Chemical group 0.000 description 228
- 239000010408 film Substances 0.000 description 131
- 238000000034 method Methods 0.000 description 124
- 239000000047 product Substances 0.000 description 116
- 125000002947 alkylene group Chemical group 0.000 description 92
- 125000001931 aliphatic group Chemical group 0.000 description 85
- 125000003118 aryl group Chemical group 0.000 description 81
- 125000000217 alkyl group Chemical group 0.000 description 77
- 239000003431 cross linking reagent Substances 0.000 description 70
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 53
- 239000000203 mixture Substances 0.000 description 51
- 239000000126 substance Substances 0.000 description 51
- 238000011161 development Methods 0.000 description 50
- 235000013877 carbamide Nutrition 0.000 description 46
- 239000000463 material Substances 0.000 description 46
- 150000003254 radicals Chemical class 0.000 description 46
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 45
- 229910052731 fluorine Inorganic materials 0.000 description 44
- 239000000243 solution Substances 0.000 description 40
- 239000002904 solvent Substances 0.000 description 37
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 34
- 150000004985 diamines Chemical class 0.000 description 34
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 33
- 230000015572 biosynthetic process Effects 0.000 description 33
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 32
- 125000001424 substituent group Chemical group 0.000 description 32
- 125000001153 fluoro group Chemical group F* 0.000 description 31
- 229920000642 polymer Polymers 0.000 description 31
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 30
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 30
- 239000003960 organic solvent Substances 0.000 description 30
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 29
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 29
- 239000007788 liquid Substances 0.000 description 29
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 28
- 238000003786 synthesis reaction Methods 0.000 description 28
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 27
- 239000003999 initiator Substances 0.000 description 27
- 229910052757 nitrogen Inorganic materials 0.000 description 27
- 239000007787 solid Substances 0.000 description 27
- 239000003795 chemical substances by application Substances 0.000 description 26
- 239000004094 surface-active agent Substances 0.000 description 26
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 25
- 230000008569 process Effects 0.000 description 25
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 24
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 24
- 235000019441 ethanol Nutrition 0.000 description 24
- 125000005843 halogen group Chemical group 0.000 description 23
- 238000006243 chemical reaction Methods 0.000 description 21
- 238000000576 coating method Methods 0.000 description 21
- 238000006116 polymerization reaction Methods 0.000 description 21
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 20
- 239000003963 antioxidant agent Substances 0.000 description 20
- 235000006708 antioxidants Nutrition 0.000 description 20
- 150000002334 glycols Chemical class 0.000 description 20
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 19
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 19
- 125000003545 alkoxy group Chemical group 0.000 description 19
- 125000004849 alkoxymethyl group Chemical group 0.000 description 19
- 238000001723 curing Methods 0.000 description 19
- 239000003112 inhibitor Substances 0.000 description 19
- 125000004433 nitrogen atom Chemical group N* 0.000 description 19
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 18
- 125000003342 alkenyl group Chemical group 0.000 description 18
- 125000006165 cyclic alkyl group Chemical group 0.000 description 18
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 18
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 18
- 229910052719 titanium Inorganic materials 0.000 description 18
- DQYSALLXMHVJAV-UHFFFAOYSA-M 3-heptyl-2-[(3-heptyl-4-methyl-1,3-thiazol-3-ium-2-yl)methylidene]-4-methyl-1,3-thiazole;iodide Chemical compound [I-].CCCCCCCN1C(C)=CS\C1=C\C1=[N+](CCCCCCC)C(C)=CS1 DQYSALLXMHVJAV-UHFFFAOYSA-M 0.000 description 17
- 125000004429 atom Chemical group 0.000 description 17
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 17
- 238000001035 drying Methods 0.000 description 17
- 125000000623 heterocyclic group Chemical group 0.000 description 17
- 230000001976 improved effect Effects 0.000 description 17
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 17
- 239000010936 titanium Substances 0.000 description 17
- 125000003277 amino group Chemical group 0.000 description 16
- 230000003078 antioxidant effect Effects 0.000 description 16
- 229910052799 carbon Inorganic materials 0.000 description 16
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 16
- 239000011737 fluorine Substances 0.000 description 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 230000004913 activation Effects 0.000 description 15
- 125000003710 aryl alkyl group Chemical group 0.000 description 15
- 239000006185 dispersion Substances 0.000 description 15
- 238000001914 filtration Methods 0.000 description 15
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 14
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 14
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 14
- 230000009471 action Effects 0.000 description 14
- 125000005042 acyloxymethyl group Chemical group 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 150000002989 phenols Chemical class 0.000 description 14
- 125000000732 arylene group Chemical group 0.000 description 13
- 125000000753 cycloalkyl group Chemical group 0.000 description 13
- 229920001296 polysiloxane Polymers 0.000 description 13
- 238000003860 storage Methods 0.000 description 13
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- 238000002156 mixing Methods 0.000 description 12
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 11
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 11
- 125000005529 alkyleneoxy group Chemical group 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- NQPJDJVGBDHCAD-UHFFFAOYSA-N 1,3-diazinan-2-one Chemical class OC1=NCCCN1 NQPJDJVGBDHCAD-UHFFFAOYSA-N 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 10
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 10
- 150000008065 acid anhydrides Chemical class 0.000 description 10
- 150000001408 amides Chemical group 0.000 description 10
- 239000007864 aqueous solution Substances 0.000 description 10
- 229910052801 chlorine Inorganic materials 0.000 description 10
- 125000001309 chloro group Chemical group Cl* 0.000 description 10
- 239000008393 encapsulating agent Substances 0.000 description 10
- 125000003700 epoxy group Chemical group 0.000 description 10
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 10
- 230000005012 migration Effects 0.000 description 10
- 238000013508 migration Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 10
- 238000007363 ring formation reaction Methods 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 9
- 102000012335 Plasminogen Activator Inhibitor 1 Human genes 0.000 description 9
- 108010022233 Plasminogen Activator Inhibitor 1 Proteins 0.000 description 9
- 239000002202 Polyethylene glycol Substances 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical group CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 150000002148 esters Chemical group 0.000 description 9
- 238000005755 formation reaction Methods 0.000 description 9
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical class O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 description 9
- 238000010030 laminating Methods 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 229920001223 polyethylene glycol Polymers 0.000 description 9
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 9
- 239000007870 radical polymerization initiator Substances 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 8
- 125000005907 alkyl ester group Chemical group 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 8
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 8
- 235000014113 dietary fatty acids Nutrition 0.000 description 8
- 229930195729 fatty acid Natural products 0.000 description 8
- 239000000194 fatty acid Substances 0.000 description 8
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 8
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 8
- 125000006239 protecting group Chemical group 0.000 description 8
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 8
- 238000006798 ring closing metathesis reaction Methods 0.000 description 8
- 239000007921 spray Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 238000012719 thermal polymerization Methods 0.000 description 8
- 150000003609 titanium compounds Chemical class 0.000 description 8
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 8
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 7
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 7
- 125000002252 acyl group Chemical group 0.000 description 7
- 230000001588 bifunctional effect Effects 0.000 description 7
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 7
- 150000001721 carbon Chemical group 0.000 description 7
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 7
- 239000012986 chain transfer agent Substances 0.000 description 7
- 239000007795 chemical reaction product Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 150000004665 fatty acids Chemical class 0.000 description 7
- 150000003949 imides Chemical group 0.000 description 7
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine powder Natural products NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 7
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 7
- 125000003396 thiol group Chemical class [H]S* 0.000 description 7
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 6
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 6
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 6
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 6
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 6
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 6
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- 239000004215 Carbon black (E152) Substances 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000003463 adsorbent Substances 0.000 description 6
- 150000001298 alcohols Chemical group 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 6
- 230000002744 anti-aggregatory effect Effects 0.000 description 6
- 150000004945 aromatic hydrocarbons Chemical group 0.000 description 6
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 150000002170 ethers Chemical class 0.000 description 6
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 6
- 125000005842 heteroatom Chemical group 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 6
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 6
- 125000002950 monocyclic group Chemical group 0.000 description 6
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 6
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 6
- 229920001281 polyalkylene Polymers 0.000 description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 6
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 5
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 125000004450 alkenylene group Chemical group 0.000 description 5
- 125000002521 alkyl halide group Chemical group 0.000 description 5
- 125000004104 aryloxy group Chemical group 0.000 description 5
- 150000007514 bases Chemical class 0.000 description 5
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 5
- 239000012965 benzophenone Substances 0.000 description 5
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 5
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 5
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 5
- 125000004093 cyano group Chemical group *C#N 0.000 description 5
- IOJUPLGTWVMSFF-UHFFFAOYSA-N cyclobenzothiazole Natural products C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 5
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 5
- 125000004386 diacrylate group Chemical group 0.000 description 5
- 125000004427 diamine group Chemical group 0.000 description 5
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 5
- 150000005690 diesters Chemical class 0.000 description 5
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 229940116333 ethyl lactate Drugs 0.000 description 5
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 239000010954 inorganic particle Substances 0.000 description 5
- 229910052740 iodine Inorganic materials 0.000 description 5
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 5
- 150000002576 ketones Chemical class 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- 125000003566 oxetanyl group Chemical group 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 125000003386 piperidinyl group Chemical group 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- 229930195734 saturated hydrocarbon Natural products 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 150000003462 sulfoxides Chemical class 0.000 description 5
- 150000000000 tetracarboxylic acids Chemical group 0.000 description 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 4
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 4
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 4
- ICPWFHKNYYRBSZ-UHFFFAOYSA-M 2-methoxypropanoate Chemical compound COC(C)C([O-])=O ICPWFHKNYYRBSZ-UHFFFAOYSA-M 0.000 description 4
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 4
- GPXCORHXFPYJEH-UHFFFAOYSA-N 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)O[Si](C)(C)CCCN GPXCORHXFPYJEH-UHFFFAOYSA-N 0.000 description 4
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 4
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 4
- SGPJBCCVSFQQED-UHFFFAOYSA-N 4-[(4-aminophenyl)-[[dimethyl(trimethylsilyloxy)silyl]oxy-dimethylsilyl]oxy-methylsilyl]oxysilylaniline Chemical compound C=1C=C(N)C=CC=1[Si](C)(O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C)O[SiH2]C1=CC=C(N)C=C1 SGPJBCCVSFQQED-UHFFFAOYSA-N 0.000 description 4
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 4
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- QCNWZROVPSVEJA-UHFFFAOYSA-N Heptadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCC(O)=O QCNWZROVPSVEJA-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical group C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 4
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 238000000862 absorption spectrum Methods 0.000 description 4
- 125000004423 acyloxy group Chemical group 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000004414 alkyl thio group Chemical group 0.000 description 4
- 150000001412 amines Chemical group 0.000 description 4
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 125000005163 aryl sulfanyl group Chemical group 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 4
- DGXRZJSPDXZJFG-UHFFFAOYSA-N docosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCC(O)=O DGXRZJSPDXZJFG-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- QQHJDPROMQRDLA-UHFFFAOYSA-N hexadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCC(O)=O QQHJDPROMQRDLA-UHFFFAOYSA-N 0.000 description 4
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 4
- 238000009832 plasma treatment Methods 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 150000003512 tertiary amines Chemical class 0.000 description 4
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 4
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- QJXPRGZXRIIGOP-UHFFFAOYSA-N tricosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCCC(O)=O QJXPRGZXRIIGOP-UHFFFAOYSA-N 0.000 description 4
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 4
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 3
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 3
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 3
- PCAXITAPTVOLGL-UHFFFAOYSA-N 2,3-diaminophenol Chemical class NC1=CC=CC(O)=C1N PCAXITAPTVOLGL-UHFFFAOYSA-N 0.000 description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 3
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 3
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 3
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical compound NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 3
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 3
- ZDRNVPNSQJRIRN-UHFFFAOYSA-N 2-amino-5-[2-(4-amino-3-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C(O)=C1 ZDRNVPNSQJRIRN-UHFFFAOYSA-N 0.000 description 3
- JDFAWEKPFLGRAK-UHFFFAOYSA-N 2-amino-5-[2-(4-amino-3-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(N)C(O)=CC=1C(C)(C)C1=CC=C(N)C(O)=C1 JDFAWEKPFLGRAK-UHFFFAOYSA-N 0.000 description 3
- VRVRGVPWCUEOGV-UHFFFAOYSA-N 2-aminothiophenol Chemical compound NC1=CC=CC=C1S VRVRGVPWCUEOGV-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 3
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- DIQMPQMYFZXDAX-UHFFFAOYSA-N Pentyl formate Chemical compound CCCCCOC=O DIQMPQMYFZXDAX-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical group C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 125000002729 alkyl fluoride group Chemical group 0.000 description 3
- 125000004644 alkyl sulfinyl group Chemical group 0.000 description 3
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 3
- 150000008064 anhydrides Chemical group 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 125000005135 aryl sulfinyl group Chemical group 0.000 description 3
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N benzo-alpha-pyrone Natural products C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 3
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 3
- 150000001733 carboxylic acid esters Chemical class 0.000 description 3
- 239000013522 chelant Substances 0.000 description 3
- 150000001805 chlorine compounds Chemical class 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 3
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 3
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 3
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 3
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 3
- 239000000706 filtrate Substances 0.000 description 3
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- VPVSTMAPERLKKM-UHFFFAOYSA-N glycoluril Chemical compound N1C(=O)NC2NC(=O)NC21 VPVSTMAPERLKKM-UHFFFAOYSA-N 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 230000002140 halogenating effect Effects 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 3
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 3
- 229940117955 isoamyl acetate Drugs 0.000 description 3
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 3
- 235000001510 limonene Nutrition 0.000 description 3
- 229940087305 limonene Drugs 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 3
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 3
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 3
- AKWHOGIYEOZALP-UHFFFAOYSA-N methyl 2-methoxy-2-methylpropanoate Chemical compound COC(=O)C(C)(C)OC AKWHOGIYEOZALP-UHFFFAOYSA-N 0.000 description 3
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 3
- 229940057867 methyl lactate Drugs 0.000 description 3
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 3
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 150000002923 oximes Chemical class 0.000 description 3
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 3
- VHDHONCVIHDOAO-UHFFFAOYSA-N pentacosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCCCCC(O)=O VHDHONCVIHDOAO-UHFFFAOYSA-N 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- CYIRLFJPTCUCJB-UHFFFAOYSA-N propyl 2-methoxypropanoate Chemical compound CCCOC(=O)C(C)OC CYIRLFJPTCUCJB-UHFFFAOYSA-N 0.000 description 3
- ILPVOWZUBFRIAX-UHFFFAOYSA-N propyl 2-oxopropanoate Chemical compound CCCOC(=O)C(C)=O ILPVOWZUBFRIAX-UHFFFAOYSA-N 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 239000012487 rinsing solution Substances 0.000 description 3
- 229960001860 salicylate Drugs 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 235000017557 sodium bicarbonate Nutrition 0.000 description 3
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea group Chemical group NC(=S)N UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 3
- WHIRALQRTSITMI-UJURSFKZSA-N (1s,5r)-6,8-dioxabicyclo[3.2.1]octan-4-one Chemical compound O1[C@@]2([H])OC[C@]1([H])CCC2=O WHIRALQRTSITMI-UJURSFKZSA-N 0.000 description 2
- QYGBYAQGBVHMDD-XQRVVYSFSA-N (z)-2-cyano-3-thiophen-2-ylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C/C1=CC=CS1 QYGBYAQGBVHMDD-XQRVVYSFSA-N 0.000 description 2
- 125000002030 1,2-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([*:2])C([H])=C1[H] 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 2
- WVUYYXUATWMVIT-UHFFFAOYSA-N 1-bromo-4-ethoxybenzene Chemical compound CCOC1=CC=C(Br)C=C1 WVUYYXUATWMVIT-UHFFFAOYSA-N 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 2
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 2
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 2
- KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Chemical compound C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 description 2
- CCUWGJDGLACFQT-UHFFFAOYSA-N 2,2,3,3,4,4-hexafluoropentanedioic acid Chemical compound OC(=O)C(F)(F)C(F)(F)C(F)(F)C(O)=O CCUWGJDGLACFQT-UHFFFAOYSA-N 0.000 description 2
- YUDUFRYTKFGQCL-UHFFFAOYSA-N 2,2,3,3-tetrafluorobutanedioic acid Chemical compound OC(=O)C(F)(F)C(F)(F)C(O)=O YUDUFRYTKFGQCL-UHFFFAOYSA-N 0.000 description 2
- KJDGGLOKWHMBOX-UHFFFAOYSA-N 2,2,3-trimethylbutanedioic acid Chemical compound OC(=O)C(C)C(C)(C)C(O)=O KJDGGLOKWHMBOX-UHFFFAOYSA-N 0.000 description 2
- WUHHVDQBQZVSJV-UHFFFAOYSA-N 2,2-dibutylpropanedioic acid Chemical compound CCCCC(C(O)=O)(C(O)=O)CCCC WUHHVDQBQZVSJV-UHFFFAOYSA-N 0.000 description 2
- BTUDGPVTCYNYLK-UHFFFAOYSA-N 2,2-dimethylglutaric acid Chemical compound OC(=O)C(C)(C)CCC(O)=O BTUDGPVTCYNYLK-UHFFFAOYSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- KLZYRCVPDWTZLH-UHFFFAOYSA-N 2,3-dimethylsuccinic acid Chemical compound OC(=O)C(C)C(C)C(O)=O KLZYRCVPDWTZLH-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- QXHDYMUPPXAMPQ-UHFFFAOYSA-N 2-(4-aminophenyl)ethanol Chemical compound NC1=CC=C(CCO)C=C1 QXHDYMUPPXAMPQ-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- KECOIASOKMSRFT-UHFFFAOYSA-N 2-amino-4-(3-amino-4-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(O)C(N)=CC(S(=O)(=O)C=2C=C(N)C(O)=CC=2)=C1 KECOIASOKMSRFT-UHFFFAOYSA-N 0.000 description 2
- UHIDYCYNRPVZCK-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(N)=CC=1C(C)(C)C1=CC=C(O)C(N)=C1 UHIDYCYNRPVZCK-UHFFFAOYSA-N 0.000 description 2
- UZSDRHVOBLQYCX-UHFFFAOYSA-N 2-amino-6-hydroxybenzoic acid Chemical compound NC1=CC=CC(O)=C1C(O)=O UZSDRHVOBLQYCX-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- ZCGZOPIPEZCKKQ-UHFFFAOYSA-N 2-ethoxy-2-methylpropanoic acid Chemical compound CCOC(C)(C)C(O)=O ZCGZOPIPEZCKKQ-UHFFFAOYSA-N 0.000 description 2
- XBHQOMRKOUANQQ-UHFFFAOYSA-N 2-ethoxypropanoic acid Chemical compound CCOC(C)C(O)=O XBHQOMRKOUANQQ-UHFFFAOYSA-N 0.000 description 2
- ALQPJHSFIXARGX-UHFFFAOYSA-N 2-ethynylaniline Chemical compound NC1=CC=CC=C1C#C ALQPJHSFIXARGX-UHFFFAOYSA-N 0.000 description 2
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 2
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 2
- DQEUFPARIOFOAI-UHFFFAOYSA-N 2-propan-2-ylpropanedioic acid Chemical compound CC(C)C(C(O)=O)C(O)=O DQEUFPARIOFOAI-UHFFFAOYSA-N 0.000 description 2
- MGADZUXDNSDTHW-UHFFFAOYSA-N 2H-pyran Chemical group C1OC=CC=C1 MGADZUXDNSDTHW-UHFFFAOYSA-N 0.000 description 2
- AJHPGXZOIAYYDW-UHFFFAOYSA-N 3-(2-cyanophenyl)-2-[(2-methylpropan-2-yl)oxycarbonylamino]propanoic acid Chemical compound CC(C)(C)OC(=O)NC(C(O)=O)CC1=CC=CC=C1C#N AJHPGXZOIAYYDW-UHFFFAOYSA-N 0.000 description 2
- GIMFLOOKFCUUOQ-UHFFFAOYSA-N 3-amino-4-hydroxy-1,2-dihydropyrimidin-6-one Chemical compound NN1CN=C(O)C=C1O GIMFLOOKFCUUOQ-UHFFFAOYSA-N 0.000 description 2
- ZAJAQTYSTDTMCU-UHFFFAOYSA-N 3-aminobenzenesulfonic acid Chemical compound NC1=CC=CC(S(O)(=O)=O)=C1 ZAJAQTYSTDTMCU-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- 229940018563 3-aminophenol Drugs 0.000 description 2
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 2
- XAWFHZMTJUGGEE-UHFFFAOYSA-N 3-ethyl-3-methylpentanedioic acid Chemical compound OC(=O)CC(C)(CC)CC(O)=O XAWFHZMTJUGGEE-UHFFFAOYSA-N 0.000 description 2
- NNKQLUVBPJEUOR-UHFFFAOYSA-N 3-ethynylaniline Chemical compound NC1=CC=CC(C#C)=C1 NNKQLUVBPJEUOR-UHFFFAOYSA-N 0.000 description 2
- UJBOOUHRTQVGRU-UHFFFAOYSA-N 3-methylcyclohexan-1-one Chemical compound CC1CCCC(=O)C1 UJBOOUHRTQVGRU-UHFFFAOYSA-N 0.000 description 2
- FWOLORXQTIGHFX-UHFFFAOYSA-N 4-(4-amino-2,3,5,6-tetrafluorophenyl)-2,3,5,6-tetrafluoroaniline Chemical group FC1=C(F)C(N)=C(F)C(F)=C1C1=C(F)C(F)=C(N)C(F)=C1F FWOLORXQTIGHFX-UHFFFAOYSA-N 0.000 description 2
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 2
- LFEWXDOYPCWFHR-UHFFFAOYSA-N 4-(4-carboxybenzoyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C=C1 LFEWXDOYPCWFHR-UHFFFAOYSA-N 0.000 description 2
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-PZFLKRBQSA-N 4-amino-3,5-ditritiobenzoic acid Chemical compound [3H]c1cc(cc([3H])c1N)C(O)=O ALYNCZNDIQEVRV-PZFLKRBQSA-N 0.000 description 2
- HVBSAKJJOYLTQU-UHFFFAOYSA-N 4-aminobenzenesulfonic acid Chemical compound NC1=CC=C(S(O)(=O)=O)C=C1 HVBSAKJJOYLTQU-UHFFFAOYSA-N 0.000 description 2
- WCDSVWRUXWCYFN-UHFFFAOYSA-N 4-aminobenzenethiol Chemical compound NC1=CC=C(S)C=C1 WCDSVWRUXWCYFN-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- ABJQKDJOYSQVFX-UHFFFAOYSA-N 4-aminonaphthalen-1-ol Chemical compound C1=CC=C2C(N)=CC=C(O)C2=C1 ABJQKDJOYSQVFX-UHFFFAOYSA-N 0.000 description 2
- WUBBRNOQWQTFEX-UHFFFAOYSA-N 4-aminosalicylic acid Chemical compound NC1=CC=C(C(O)=O)C(O)=C1 WUBBRNOQWQTFEX-UHFFFAOYSA-N 0.000 description 2
- JXYITCJMBRETQX-UHFFFAOYSA-N 4-ethynylaniline Chemical compound NC1=CC=C(C#C)C=C1 JXYITCJMBRETQX-UHFFFAOYSA-N 0.000 description 2
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 description 2
- NNJMFJSKMRYHSR-UHFFFAOYSA-N 4-phenylbenzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=CC=C1 NNJMFJSKMRYHSR-UHFFFAOYSA-N 0.000 description 2
- ZBIBQNVRTVLOHQ-UHFFFAOYSA-N 5-aminonaphthalen-1-ol Chemical compound C1=CC=C2C(N)=CC=CC2=C1O ZBIBQNVRTVLOHQ-UHFFFAOYSA-N 0.000 description 2
- FSBRKZMSECKELY-UHFFFAOYSA-N 5-aminonaphthalen-2-ol Chemical compound OC1=CC=C2C(N)=CC=CC2=C1 FSBRKZMSECKELY-UHFFFAOYSA-N 0.000 description 2
- FPKNJPIDCMAIDW-UHFFFAOYSA-N 5-aminonaphthalene-1-carboxylic acid Chemical compound C1=CC=C2C(N)=CC=CC2=C1C(O)=O FPKNJPIDCMAIDW-UHFFFAOYSA-N 0.000 description 2
- XVOBQVZYYPJXCK-UHFFFAOYSA-N 5-aminonaphthalene-2-carboxylic acid Chemical compound OC(=O)C1=CC=C2C(N)=CC=CC2=C1 XVOBQVZYYPJXCK-UHFFFAOYSA-N 0.000 description 2
- YDEUKNRKEYICTH-UHFFFAOYSA-N 5-aminoquinolin-8-ol Chemical compound C1=CC=C2C(N)=CC=C(O)C2=N1 YDEUKNRKEYICTH-UHFFFAOYSA-N 0.000 description 2
- GAYWCADKXYCKCG-UHFFFAOYSA-N 5-pyridin-3-yl-1,2-dihydro-1,2,4-triazole-3-thione Chemical compound N1NC(=S)N=C1C1=CC=CN=C1 GAYWCADKXYCKCG-UHFFFAOYSA-N 0.000 description 2
- SERBLGFKBWPCJD-UHFFFAOYSA-N 6-aminonaphthalen-2-ol Chemical compound C1=C(O)C=CC2=CC(N)=CC=C21 SERBLGFKBWPCJD-UHFFFAOYSA-N 0.000 description 2
- CKSZZOAKPXZMAT-UHFFFAOYSA-N 6-aminonaphthalene-1-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC(N)=CC=C21 CKSZZOAKPXZMAT-UHFFFAOYSA-N 0.000 description 2
- NZTPZUIIYNYZKT-UHFFFAOYSA-N 6-aminonaphthalene-2-carboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(N)=CC=C21 NZTPZUIIYNYZKT-UHFFFAOYSA-N 0.000 description 2
- WSUYONLKFXZZRV-UHFFFAOYSA-N 7-aminonaphthalen-2-ol Chemical compound C1=CC(O)=CC2=CC(N)=CC=C21 WSUYONLKFXZZRV-UHFFFAOYSA-N 0.000 description 2
- BFBAHPDPLUEECU-UHFFFAOYSA-N 7-aminonaphthalene-1-carboxylic acid Chemical compound C1=CC=C(C(O)=O)C2=CC(N)=CC=C21 BFBAHPDPLUEECU-UHFFFAOYSA-N 0.000 description 2
- NBPYPKQPLKDTKB-UHFFFAOYSA-N 7-aminonaphthalene-2-carboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(N)=CC=C21 NBPYPKQPLKDTKB-UHFFFAOYSA-N 0.000 description 2
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- DQFBYFPFKXHELB-UHFFFAOYSA-N Chalcone Natural products C=1C=CC=CC=1C(=O)C=CC1=CC=CC=C1 DQFBYFPFKXHELB-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- VSNHCAURESNICA-UHFFFAOYSA-N Hydroxyurea Chemical class NC(=O)NO VSNHCAURESNICA-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-Diisopropylethylamine (DIPEA) Chemical compound CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- IFAWYXIHOVRGHQ-UHFFFAOYSA-N Nonadecandioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCC(O)=O IFAWYXIHOVRGHQ-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920002582 Polyethylene Glycol 600 Polymers 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- 125000004036 acetal group Chemical group 0.000 description 2
- 150000008360 acrylonitriles Chemical class 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 125000005370 alkoxysilyl group Chemical group 0.000 description 2
- 125000005011 alkyl ether group Chemical group 0.000 description 2
- 239000002168 alkylating agent Substances 0.000 description 2
- 229940100198 alkylating agent Drugs 0.000 description 2
- 229960004909 aminosalicylic acid Drugs 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 125000005018 aryl alkenyl group Chemical group 0.000 description 2
- 125000002102 aryl alkyloxo group Chemical group 0.000 description 2
- 125000004391 aryl sulfonyl group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229960002255 azelaic acid Drugs 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- GCAIEATUVJFSMC-UHFFFAOYSA-N benzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1C(O)=O GCAIEATUVJFSMC-UHFFFAOYSA-N 0.000 description 2
- 150000008366 benzophenones Chemical class 0.000 description 2
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- SYEOWUNSTUDKGM-UHFFFAOYSA-N beta-methyladipic acid Natural products OC(=O)CC(C)CCC(O)=O SYEOWUNSTUDKGM-UHFFFAOYSA-N 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 2
- IWPATTDMSUYMJV-UHFFFAOYSA-N butyl 2-methoxyacetate Chemical compound CCCCOC(=O)COC IWPATTDMSUYMJV-UHFFFAOYSA-N 0.000 description 2
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 235000005513 chalcones Nutrition 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 229960000956 coumarin Drugs 0.000 description 2
- 235000001671 coumarin Nutrition 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 150000004292 cyclic ethers Chemical group 0.000 description 2
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- OREAFAJWWJHCOT-UHFFFAOYSA-N dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000010494 dissociation reaction Methods 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 125000006575 electron-withdrawing group Chemical group 0.000 description 2
- 239000003480 eluent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 2
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 2
- SHZIWNPUGXLXDT-UHFFFAOYSA-N ethyl hexanoate Chemical compound CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 229940117360 ethyl pyruvate Drugs 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- UKFXDFUAPNAMPJ-UHFFFAOYSA-N ethylmalonic acid Chemical compound CCC(C(O)=O)C(O)=O UKFXDFUAPNAMPJ-UHFFFAOYSA-N 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 2
- LHGVFZTZFXWLCP-UHFFFAOYSA-N guaiacol Chemical compound COC1=CC=CC=C1O LHGVFZTZFXWLCP-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- JJWZFUFNJNGKAF-UHFFFAOYSA-N hexacosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCCCCCC(O)=O JJWZFUFNJNGKAF-UHFFFAOYSA-N 0.000 description 2
- QNVRIHYSUZMSGM-UHFFFAOYSA-N hexan-2-ol Chemical compound CCCCC(C)O QNVRIHYSUZMSGM-UHFFFAOYSA-N 0.000 description 2
- AOGQPLXWSUTHQB-UHFFFAOYSA-N hexyl acetate Chemical compound CCCCCCOC(C)=O AOGQPLXWSUTHQB-UHFFFAOYSA-N 0.000 description 2
- ZTVZLYBCZNMWCF-UHFFFAOYSA-N homocystine Chemical compound [O-]C(=O)C([NH3+])CCSSCCC([NH3+])C([O-])=O ZTVZLYBCZNMWCF-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 125000002883 imidazolyl group Chemical group 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 2
- HITOXZPZGPXYHY-UJURSFKZSA-N levoglucosenone Chemical compound O=C1C=C[C@H]2CO[C@@H]1O2 HITOXZPZGPXYHY-UJURSFKZSA-N 0.000 description 2
- HITOXZPZGPXYHY-UHFFFAOYSA-N levoglucosenone Natural products O=C1C=CC2COC1O2 HITOXZPZGPXYHY-UHFFFAOYSA-N 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- KBOPZPXVLCULAV-UHFFFAOYSA-N mesalamine Chemical compound NC1=CC=C(O)C(C(O)=O)=C1 KBOPZPXVLCULAV-UHFFFAOYSA-N 0.000 description 2
- 229960004963 mesalazine Drugs 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 2
- LCEDQNDDFOCWGG-UHFFFAOYSA-N morpholine-4-carbaldehyde Chemical compound O=CN1CCOCC1 LCEDQNDDFOCWGG-UHFFFAOYSA-N 0.000 description 2
- 125000004957 naphthylene group Chemical group 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- CTSLXHKWHWQRSH-UHFFFAOYSA-N oxalyl chloride Chemical compound ClC(=O)C(Cl)=O CTSLXHKWHWQRSH-UHFFFAOYSA-N 0.000 description 2
- 125000002971 oxazolyl group Chemical group 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 229950000688 phenothiazine Drugs 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical compound C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 125000004193 piperazinyl group Chemical group 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 125000003226 pyrazolyl group Chemical group 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 125000001422 pyrrolinyl group Chemical group 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 2
- 230000002000 scavenging effect Effects 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical class O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229950000244 sulfanilic acid Drugs 0.000 description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- 125000001412 tetrahydropyranyl group Chemical group 0.000 description 2
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- DQFBYFPFKXHELB-VAWYXSNFSA-N trans-chalcone Chemical compound C=1C=CC=CC=1C(=O)\C=C\C1=CC=CC=C1 DQFBYFPFKXHELB-VAWYXSNFSA-N 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- KQTIIICEAUMSDG-UHFFFAOYSA-N tricarballylic acid Chemical compound OC(=O)CC(C(O)=O)CC(O)=O KQTIIICEAUMSDG-UHFFFAOYSA-N 0.000 description 2
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- PYOKUURKVVELLB-UHFFFAOYSA-N trimethyl orthoformate Chemical compound COC(OC)OC PYOKUURKVVELLB-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 2
- 150000003672 ureas Chemical class 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- ZODNDDPVCIAZIQ-UHFFFAOYSA-N (2-hydroxy-3-prop-2-enoyloxypropyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)COC(=O)C=C ZODNDDPVCIAZIQ-UHFFFAOYSA-N 0.000 description 1
- CSUUDNFYSFENAE-UHFFFAOYSA-N (2-methoxyphenyl)-phenylmethanone Chemical compound COC1=CC=CC=C1C(=O)C1=CC=CC=C1 CSUUDNFYSFENAE-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- IQGIEMYBDGDBMR-UHFFFAOYSA-N (3-methyl-5-prop-2-enoyloxypentyl) prop-2-enoate Chemical compound C=CC(=O)OCCC(C)CCOC(=O)C=C IQGIEMYBDGDBMR-UHFFFAOYSA-N 0.000 description 1
- PGSHZSDDBWTHDU-UHFFFAOYSA-N (3-oxobutan-2-ylideneamino) 4-methylbenzenesulfonate Chemical compound CC(=O)C(C)=NOS(=O)(=O)C1=CC=C(C)C=C1 PGSHZSDDBWTHDU-UHFFFAOYSA-N 0.000 description 1
- MRUDPRFGMHTPFJ-UHFFFAOYSA-N (3-oxobutan-2-ylideneamino) acetate Chemical compound CC(=O)ON=C(C)C(C)=O MRUDPRFGMHTPFJ-UHFFFAOYSA-N 0.000 description 1
- SKCKRZWCOYHBEC-UHFFFAOYSA-N (3-oxobutan-2-ylideneamino) benzoate Chemical compound CC(=O)C(C)=NOC(=O)C1=CC=CC=C1 SKCKRZWCOYHBEC-UHFFFAOYSA-N 0.000 description 1
- HQLZSJJJXHJANW-UHFFFAOYSA-N (3-oxopentan-2-ylideneamino) acetate Chemical compound CCC(=O)C(C)=NOC(C)=O HQLZSJJJXHJANW-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- CGCQHMFVCNWSOV-UHFFFAOYSA-N (4-morpholin-4-ylphenyl)-phenylmethanone Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C1=CC=CC=C1 CGCQHMFVCNWSOV-UHFFFAOYSA-N 0.000 description 1
- VNFXPOAMRORRJJ-UHFFFAOYSA-N (4-octylphenyl) 2-hydroxybenzoate Chemical compound C1=CC(CCCCCCCC)=CC=C1OC(=O)C1=CC=CC=C1O VNFXPOAMRORRJJ-UHFFFAOYSA-N 0.000 description 1
- WOGITNXCNOTRLK-VOTSOKGWSA-N (e)-3-phenylprop-2-enoyl chloride Chemical compound ClC(=O)\C=C\C1=CC=CC=C1 WOGITNXCNOTRLK-VOTSOKGWSA-N 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- TYKCBTYOMAUNLH-MTOQALJVSA-J (z)-4-oxopent-2-en-2-olate;titanium(4+) Chemical compound [Ti+4].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O TYKCBTYOMAUNLH-MTOQALJVSA-J 0.000 description 1
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- BWKAYBPLDRWMCJ-UHFFFAOYSA-N 1,1-diethoxy-n,n-dimethylmethanamine Chemical compound CCOC(N(C)C)OCC BWKAYBPLDRWMCJ-UHFFFAOYSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- VRKVWGGGHMMERE-UHFFFAOYSA-N 1,2-bis(methoxymethyl)benzene Chemical compound COCC1=CC=CC=C1COC VRKVWGGGHMMERE-UHFFFAOYSA-N 0.000 description 1
- VBYLUPVOJYUVQF-UHFFFAOYSA-N 1,2-dimethoxy-3,4-bis(methoxymethyl)benzene Chemical compound COCc1ccc(OC)c(OC)c1COC VBYLUPVOJYUVQF-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- 125000000355 1,3-benzoxazolyl group Chemical group O1C(=NC2=C1C=CC=C2)* 0.000 description 1
- CNZVQCYTFMIBMO-UHFFFAOYSA-N 1,3-bis(methoxymethyl)imidazolidin-2-one Chemical compound COCN1CCN(COC)C1=O CNZVQCYTFMIBMO-UHFFFAOYSA-N 0.000 description 1
- XKALZGSIEJZJCZ-UHFFFAOYSA-N 1,3-bis(methoxymethyl)urea Chemical compound COCNC(=O)NCOC XKALZGSIEJZJCZ-UHFFFAOYSA-N 0.000 description 1
- OQZAQBGJENJMHT-UHFFFAOYSA-N 1,3-dibromo-5-methoxybenzene Chemical compound COC1=CC(Br)=CC(Br)=C1 OQZAQBGJENJMHT-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- BDNKZNFMNDZQMI-UHFFFAOYSA-N 1,3-diisopropylcarbodiimide Chemical compound CC(C)N=C=NC(C)C BDNKZNFMNDZQMI-UHFFFAOYSA-N 0.000 description 1
- CUJPFPXNDSIBPG-UHFFFAOYSA-N 1,3-propanediyl Chemical group [CH2]C[CH2] CUJPFPXNDSIBPG-UHFFFAOYSA-N 0.000 description 1
- 229940005561 1,4-benzoquinone Drugs 0.000 description 1
- FBMQNRKSAWNXBT-UHFFFAOYSA-N 1,4-diaminoanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C(N)=CC=C2N FBMQNRKSAWNXBT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- ZNNRTWIXUUGIFI-UHFFFAOYSA-N 1,5-bis[4-(diethylamino)phenyl]penta-1,4-dien-3-one Chemical compound C1=CC(N(CC)CC)=CC=C1C=CC(=O)C=CC1=CC=C(N(CC)CC)C=C1 ZNNRTWIXUUGIFI-UHFFFAOYSA-N 0.000 description 1
- JWTSVUUPJIIXTO-UHFFFAOYSA-N 1,5-bis[4-(dimethylamino)phenyl]penta-1,4-dien-3-one Chemical compound C1=CC(N(C)C)=CC=C1C=CC(=O)C=CC1=CC=C(N(C)C)C=C1 JWTSVUUPJIIXTO-UHFFFAOYSA-N 0.000 description 1
- VWBVCOPVKXNMMZ-UHFFFAOYSA-N 1,5-diaminoanthracene-9,10-dione Chemical compound O=C1C2=C(N)C=CC=C2C(=O)C2=C1C=CC=C2N VWBVCOPVKXNMMZ-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- HIYIGPNHCGAADM-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]-2,3-dimethylbenzene Chemical group CC=1C(=C(C=CC=1COC)C1=CC=C(C=C1)COC)C HIYIGPNHCGAADM-UHFFFAOYSA-N 0.000 description 1
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 1
- LMDZBCPBFSXMTL-UHFFFAOYSA-N 1-Ethyl-3-(3-dimethylaminopropyl)carbodiimide Substances CCN=C=NCCCN(C)C LMDZBCPBFSXMTL-UHFFFAOYSA-N 0.000 description 1
- ASOKPJOREAFHNY-UHFFFAOYSA-N 1-Hydroxybenzotriazole Chemical compound C1=CC=C2N(O)N=NC2=C1 ASOKPJOREAFHNY-UHFFFAOYSA-N 0.000 description 1
- GGZHVNZHFYCSEV-UHFFFAOYSA-N 1-Phenyl-5-mercaptotetrazole Chemical compound SC1=NN=NN1C1=CC=CC=C1 GGZHVNZHFYCSEV-UHFFFAOYSA-N 0.000 description 1
- HYLLZXPMJRMUHH-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOC HYLLZXPMJRMUHH-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical group C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- KYWXRBNOYGGPIZ-UHFFFAOYSA-N 1-morpholin-4-ylethanone Chemical compound CC(=O)N1CCOCC1 KYWXRBNOYGGPIZ-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- YXAOOTNFFAQIPZ-UHFFFAOYSA-N 1-nitrosonaphthalen-2-ol Chemical compound C1=CC=CC2=C(N=O)C(O)=CC=C21 YXAOOTNFFAQIPZ-UHFFFAOYSA-N 0.000 description 1
- WAPNOHKVXSQRPX-UHFFFAOYSA-N 1-phenylethanol Chemical compound CC(O)C1=CC=CC=C1 WAPNOHKVXSQRPX-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- TZMSYXZUNZXBOL-UHFFFAOYSA-N 10H-phenoxazine Chemical compound C1=CC=C2NC3=CC=CC=C3OC2=C1 TZMSYXZUNZXBOL-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 1
- NOGFHTGYPKWWRX-UHFFFAOYSA-N 2,2,6,6-tetramethyloxan-4-one Chemical compound CC1(C)CC(=O)CC(C)(C)O1 NOGFHTGYPKWWRX-UHFFFAOYSA-N 0.000 description 1
- LTMRRSWNXVJMBA-UHFFFAOYSA-L 2,2-diethylpropanedioate Chemical compound CCC(CC)(C([O-])=O)C([O-])=O LTMRRSWNXVJMBA-UHFFFAOYSA-L 0.000 description 1
- JVSFQJZRHXAUGT-UHFFFAOYSA-N 2,2-dimethylpropanoyl chloride Chemical compound CC(C)(C)C(Cl)=O JVSFQJZRHXAUGT-UHFFFAOYSA-N 0.000 description 1
- GOHPTLYPQCTZSE-UHFFFAOYSA-N 2,2-dimethylsuccinic acid Chemical compound OC(=O)C(C)(C)CC(O)=O GOHPTLYPQCTZSE-UHFFFAOYSA-N 0.000 description 1
- WCZNKVPCIFMXEQ-UHFFFAOYSA-N 2,3,5,6-tetramethylbenzene-1,4-diamine Chemical compound CC1=C(C)C(N)=C(C)C(C)=C1N WCZNKVPCIFMXEQ-UHFFFAOYSA-N 0.000 description 1
- YDYSEBSNAKCEQU-UHFFFAOYSA-N 2,3-diamino-n-phenylbenzamide Chemical compound NC1=CC=CC(C(=O)NC=2C=CC=CC=2)=C1N YDYSEBSNAKCEQU-UHFFFAOYSA-N 0.000 description 1
- KKTUQAYCCLMNOA-UHFFFAOYSA-N 2,3-diaminobenzoic acid Chemical compound NC1=CC=CC(C(O)=O)=C1N KKTUQAYCCLMNOA-UHFFFAOYSA-N 0.000 description 1
- YMRIDJQAEZFTSC-UHFFFAOYSA-N 2,3-dihydro-1h-tetrazole Chemical compound N1NC=NN1 YMRIDJQAEZFTSC-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- RWAOPZVGICHCOI-UHFFFAOYSA-N 2,4-diaminobenzene-1,3-diol Chemical compound NC1=CC=C(O)C(N)=C1O RWAOPZVGICHCOI-UHFFFAOYSA-N 0.000 description 1
- RLXBOUUYEFOFSW-UHFFFAOYSA-N 2,5-diaminobenzene-1,4-diol Chemical compound NC1=CC(O)=C(N)C=C1O RLXBOUUYEFOFSW-UHFFFAOYSA-N 0.000 description 1
- BWAPJIHJXDYDPW-UHFFFAOYSA-N 2,5-dimethyl-p-phenylenediamine Chemical compound CC1=CC(N)=C(C)C=C1N BWAPJIHJXDYDPW-UHFFFAOYSA-N 0.000 description 1
- QYXHDJJYVDLECA-UHFFFAOYSA-N 2,5-diphenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=C(C=2C=CC=CC=2)C(=O)C=C1C1=CC=CC=C1 QYXHDJJYVDLECA-UHFFFAOYSA-N 0.000 description 1
- KUMMBDBTERQYCG-UHFFFAOYSA-N 2,6-bis(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CO)=C1 KUMMBDBTERQYCG-UHFFFAOYSA-N 0.000 description 1
- DWKBMLWYFNGDCN-UHFFFAOYSA-N 2,6-bis(methoxymethyl)phenol Chemical compound COCC1=CC=CC(COC)=C1O DWKBMLWYFNGDCN-UHFFFAOYSA-N 0.000 description 1
- SFXPLYOSNTZJFW-UHFFFAOYSA-N 2,6-bis[[4-(diethylamino)phenyl]methylidene]-4-methylcyclohexan-1-one Chemical compound C1=CC(N(CC)CC)=CC=C1C=C(CC(C)C1)C(=O)C1=CC1=CC=C(N(CC)CC)C=C1 SFXPLYOSNTZJFW-UHFFFAOYSA-N 0.000 description 1
- DKCPKDPYUFEZCP-UHFFFAOYSA-N 2,6-di-tert-butylphenol Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=C1O DKCPKDPYUFEZCP-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- FXYQVUGCQHGGEX-UHFFFAOYSA-N 2-(5-chlorobenzotriazol-2-yl)-4-methyl-6-(2-methylpropyl)phenol Chemical compound CC(C)CC1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O FXYQVUGCQHGGEX-UHFFFAOYSA-N 0.000 description 1
- PXMKSNKSDOKQGZ-UHFFFAOYSA-N 2-(5-chlorobenzotriazol-2-yl)-6-(2-methylbutan-2-yl)-4-(2-methylpropyl)phenol Chemical compound CCC(C)(C)C1=CC(CC(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O PXMKSNKSDOKQGZ-UHFFFAOYSA-N 0.000 description 1
- ADFWZEGSIXNYRT-UHFFFAOYSA-N 2-(5-chlorobenzotriazol-2-yl)-6-(2-methylpropyl)-4-propylphenol Chemical compound CCCC1=CC(CC(C)C)=C(O)C(N2N=C3C=C(Cl)C=CC3=N2)=C1 ADFWZEGSIXNYRT-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- RHDAAWLTXPGJDZ-UHFFFAOYSA-N 2-(ethoxymethyl)butanoic acid Chemical compound CCOCC(CC)C(O)=O RHDAAWLTXPGJDZ-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- WPMUMRCRKFBYIH-UHFFFAOYSA-N 2-[4,6-bis(2-hydroxy-4-octoxyphenyl)-1,3,5-triazin-2-yl]-5-octoxyphenol Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C1=NC(C=2C(=CC(OCCCCCCCC)=CC=2)O)=NC(C=2C(=CC(OCCCCCCCC)=CC=2)O)=N1 WPMUMRCRKFBYIH-UHFFFAOYSA-N 0.000 description 1
- KPXQQALZZHREIU-UHFFFAOYSA-N 2-[4,6-bis(2-hydroxyphenyl)triazin-5-yl]phenol Chemical class OC1=CC=CC=C1C1=NN=NC(C=2C(=CC=CC=2)O)=C1C1=CC=CC=C1O KPXQQALZZHREIU-UHFFFAOYSA-N 0.000 description 1
- PIGBIZGGEUNVCV-UHFFFAOYSA-N 2-[4,6-bis[4-(3-butoxy-2-hydroxypropoxy)-2-hydroxyphenyl]-1,3,5-triazin-2-yl]-5-(3-butoxy-2-hydroxypropoxy)phenol Chemical compound OC1=CC(OCC(O)COCCCC)=CC=C1C1=NC(C=2C(=CC(OCC(O)COCCCC)=CC=2)O)=NC(C=2C(=CC(OCC(O)COCCCC)=CC=2)O)=N1 PIGBIZGGEUNVCV-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- YUZSJKBFHATJHV-UHFFFAOYSA-N 2-[4-[2-[4-(2-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound NC1=CC=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C(=CC=CC=3)N)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 YUZSJKBFHATJHV-UHFFFAOYSA-N 0.000 description 1
- FJYCAYKHNVQCJW-UHFFFAOYSA-N 2-[4-[4-(2-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C(=CC=CC=3)N)=CC=2)C=C1 FJYCAYKHNVQCJW-UHFFFAOYSA-N 0.000 description 1
- MSHXOTKVSBHKBZ-UHFFFAOYSA-N 2-[6-(2-hydroxyphenyl)triazin-4-yl]phenol Chemical class OC1=C(C=CC=C1)C1=CC(=NN=N1)C1=C(C=CC=C1)O MSHXOTKVSBHKBZ-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- BXVXPASMKWYBFD-UHFFFAOYSA-N 2-[[2-hydroxy-3-(hydroxymethyl)-5-methylphenyl]methyl]-6-(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CC=2C(=C(CO)C=C(C)C=2)O)=C1 BXVXPASMKWYBFD-UHFFFAOYSA-N 0.000 description 1
- YCKZAOPKIOWTEH-UHFFFAOYSA-N 2-[[4-(dimethylamino)phenyl]methylidene]-3h-inden-1-one Chemical compound C1=CC(N(C)C)=CC=C1C=C1C(=O)C2=CC=CC=C2C1 YCKZAOPKIOWTEH-UHFFFAOYSA-N 0.000 description 1
- ZGYHBLSTEXSDOB-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;titanium Chemical compound [Ti].OCCN(CCO)CCO.OCCN(CCO)CCO ZGYHBLSTEXSDOB-UHFFFAOYSA-N 0.000 description 1
- OJPDDQSCZGTACX-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)anilino]ethanol Chemical compound OCCN(CCO)C1=CC=CC=C1 OJPDDQSCZGTACX-UHFFFAOYSA-N 0.000 description 1
- KZLDGFZCFRXUIB-UHFFFAOYSA-N 2-amino-4-(3-amino-4-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC(C=2C=C(N)C(O)=CC=2)=C1 KZLDGFZCFRXUIB-UHFFFAOYSA-N 0.000 description 1
- KCFVSHSJPIVGCG-UHFFFAOYSA-N 2-amino-4-[(3-amino-4-hydroxyphenyl)methyl]phenol Chemical compound C1=C(O)C(N)=CC(CC=2C=C(N)C(O)=CC=2)=C1 KCFVSHSJPIVGCG-UHFFFAOYSA-N 0.000 description 1
- NPUFCLGAODQFLG-UHFFFAOYSA-N 2-amino-5-(4-aminophenyl)cyclohexa-2,4-diene-1,1-diol Chemical group C1C(O)(O)C(N)=CC=C1C1=CC=C(N)C=C1 NPUFCLGAODQFLG-UHFFFAOYSA-N 0.000 description 1
- RCYNJDVUURMJOZ-UHFFFAOYSA-N 2-amino-5-[(4-amino-3-hydroxyphenyl)methyl]phenol Chemical compound C1=C(O)C(N)=CC=C1CC1=CC=C(N)C(O)=C1 RCYNJDVUURMJOZ-UHFFFAOYSA-N 0.000 description 1
- ZMCHBSMFKQYNKA-UHFFFAOYSA-N 2-aminobenzenesulfonic acid Chemical compound NC1=CC=CC=C1S(O)(=O)=O ZMCHBSMFKQYNKA-UHFFFAOYSA-N 0.000 description 1
- MWGATWIBSKHFMR-UHFFFAOYSA-N 2-anilinoethanol Chemical compound OCCNC1=CC=CC=C1 MWGATWIBSKHFMR-UHFFFAOYSA-N 0.000 description 1
- ZVUNTIMPQCQCAQ-UHFFFAOYSA-N 2-dodecanoyloxyethyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCC ZVUNTIMPQCQCAQ-UHFFFAOYSA-N 0.000 description 1
- KKOHCQAVIJDYAF-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O KKOHCQAVIJDYAF-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- WFSGQBNCVASPMW-UHFFFAOYSA-N 2-ethylhexanoyl chloride Chemical compound CCCCC(CC)C(Cl)=O WFSGQBNCVASPMW-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- SSONCJTVDRSLNK-UHFFFAOYSA-N 2-methylprop-2-enoic acid;hydrochloride Chemical compound Cl.CC(=C)C(O)=O SSONCJTVDRSLNK-UHFFFAOYSA-N 0.000 description 1
- SNOJPWLNAMAYSX-UHFFFAOYSA-N 2-methylpropan-1-ol;titanium Chemical compound [Ti].CC(C)CO.CC(C)CO.CC(C)CO.CC(C)CO SNOJPWLNAMAYSX-UHFFFAOYSA-N 0.000 description 1
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 1
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 1
- SYUYTOYKQOAVDW-UHFFFAOYSA-N 2-nitrosonaphthalen-1-ol Chemical compound C1=CC=C2C(O)=C(N=O)C=CC2=C1 SYUYTOYKQOAVDW-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 1
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 description 1
- WNYJRJRHKRZXEO-UHFFFAOYSA-N 2-propan-2-ylbenzene-1,4-diamine Chemical compound CC(C)C1=CC(N)=CC=C1N WNYJRJRHKRZXEO-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- XBNVWXKPFORCRI-UHFFFAOYSA-N 2h-naphtho[2,3-f]quinolin-1-one Chemical compound C1=CC=CC2=CC3=C4C(=O)CC=NC4=CC=C3C=C21 XBNVWXKPFORCRI-UHFFFAOYSA-N 0.000 description 1
- GSSXLFACIJSBOM-UHFFFAOYSA-N 2h-pyran-2-ol Chemical compound OC1OC=CC=C1 GSSXLFACIJSBOM-UHFFFAOYSA-N 0.000 description 1
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 description 1
- UAIUNKRWKOVEES-UHFFFAOYSA-N 3,3',5,5'-tetramethylbenzidine Chemical group CC1=C(N)C(C)=CC(C=2C=C(C)C(N)=C(C)C=2)=C1 UAIUNKRWKOVEES-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical group C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- HSTOKWSFWGCZMH-UHFFFAOYSA-N 3,3'-diaminobenzidine Chemical group C1=C(N)C(N)=CC=C1C1=CC=C(N)C(N)=C1 HSTOKWSFWGCZMH-UHFFFAOYSA-N 0.000 description 1
- NNOHXABAQAGKRZ-UHFFFAOYSA-N 3,5-dinitrobenzoyl chloride Chemical compound [O-][N+](=O)C1=CC(C(Cl)=O)=CC([N+]([O-])=O)=C1 NNOHXABAQAGKRZ-UHFFFAOYSA-N 0.000 description 1
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 1
- NDXGRHCEHPFUSU-UHFFFAOYSA-N 3-(3-aminophenyl)aniline Chemical group NC1=CC=CC(C=2C=C(N)C=CC=2)=C1 NDXGRHCEHPFUSU-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- KEPGNQLKWDULGD-UHFFFAOYSA-N 3-(3-prop-2-enoyloxypropoxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCCCOCCCOC(=O)C=C KEPGNQLKWDULGD-UHFFFAOYSA-N 0.000 description 1
- ZADOWCXTUZWAKL-UHFFFAOYSA-N 3-(3-trimethoxysilylpropyl)oxolane-2,5-dione Chemical compound CO[Si](OC)(OC)CCCC1CC(=O)OC1=O ZADOWCXTUZWAKL-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- WWJCRUKUIQRCGP-UHFFFAOYSA-N 3-(dimethylamino)propyl 2-methylprop-2-enoate Chemical compound CN(C)CCCOC(=O)C(C)=C WWJCRUKUIQRCGP-UHFFFAOYSA-N 0.000 description 1
- FPQQSJJWHUJYPU-UHFFFAOYSA-N 3-(dimethylamino)propyliminomethylidene-ethylazanium;chloride Chemical compound Cl.CCN=C=NCCCN(C)C FPQQSJJWHUJYPU-UHFFFAOYSA-N 0.000 description 1
- PQFRTJPVZSPBFI-UHFFFAOYSA-N 3-(trifluoromethyl)benzene-1,2-diamine Chemical compound NC1=CC=CC(C(F)(F)F)=C1N PQFRTJPVZSPBFI-UHFFFAOYSA-N 0.000 description 1
- ZZYZUFNSKAIYCJ-UHFFFAOYSA-N 3-[(3-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1C(N)CCCC1CC1CC(N)CCC1 ZZYZUFNSKAIYCJ-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- UCFMKTNJZCYBBJ-UHFFFAOYSA-N 3-[1-(2,3-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)C1=CC=CC(C(O)=O)=C1C(O)=O UCFMKTNJZCYBBJ-UHFFFAOYSA-N 0.000 description 1
- PAHZZOIHRHCHTH-UHFFFAOYSA-N 3-[2-(2,3-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)(C)C1=CC=CC(C(O)=O)=C1C(O)=O PAHZZOIHRHCHTH-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- MFTFTIALAXXIMU-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MFTFTIALAXXIMU-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- MYKMRINTJPZLQB-UHFFFAOYSA-N 3-acetyl-7-(dimethylamino)chromen-2-one Chemical compound C1=C(C(C)=O)C(=O)OC2=CC(N(C)C)=CC=C21 MYKMRINTJPZLQB-UHFFFAOYSA-N 0.000 description 1
- KFFUEVDMVNIOHA-UHFFFAOYSA-N 3-aminobenzenethiol Chemical compound NC1=CC=CC(S)=C1 KFFUEVDMVNIOHA-UHFFFAOYSA-N 0.000 description 1
- LVYXPOCADCXMLP-UHFFFAOYSA-N 3-butoxy-n,n-dimethylpropanamide Chemical compound CCCCOCCC(=O)N(C)C LVYXPOCADCXMLP-UHFFFAOYSA-N 0.000 description 1
- ZBIAIQCCZGYWSP-UHFFFAOYSA-N 3-ethoxy-2-methylpropanoic acid Chemical compound CCOCC(C)C(O)=O ZBIAIQCCZGYWSP-UHFFFAOYSA-N 0.000 description 1
- KNWLMUXHNAQOJM-UHFFFAOYSA-N 3-ethyl-3-(3-ethylheptyl)oxetane Chemical compound CCCCC(CC)CCC1(CC)COC1 KNWLMUXHNAQOJM-UHFFFAOYSA-N 0.000 description 1
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- JIRULJUIQOAJPM-UHFFFAOYSA-N 3-methoxy-2-methylpropanoic acid Chemical compound COCC(C)C(O)=O JIRULJUIQOAJPM-UHFFFAOYSA-N 0.000 description 1
- LBVMWHCOFMFPEG-UHFFFAOYSA-N 3-methoxy-n,n-dimethylpropanamide Chemical compound COCCC(=O)N(C)C LBVMWHCOFMFPEG-UHFFFAOYSA-N 0.000 description 1
- HTNUUDFQRYBJPH-UHFFFAOYSA-N 3-methoxypropanehydrazide Chemical compound COCCC(=O)NN HTNUUDFQRYBJPH-UHFFFAOYSA-N 0.000 description 1
- HAHWYTLUKCIGPH-UHFFFAOYSA-N 3-methylbutyl 2-(diethylamino)benzoate Chemical compound CCN(CC)C1=CC=CC=C1C(=O)OCCC(C)C HAHWYTLUKCIGPH-UHFFFAOYSA-N 0.000 description 1
- ARXVXVOLXMVYIT-UHFFFAOYSA-N 3-methylbutyl 2-(dimethylamino)benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1N(C)C ARXVXVOLXMVYIT-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- HRMCXDSWURAYFR-UHFFFAOYSA-N 3-phenoxyphthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C=CC=CC=2)=C1C(O)=O HRMCXDSWURAYFR-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- TXFPEBPIARQUIG-UHFFFAOYSA-N 4'-hydroxyacetophenone Chemical compound CC(=O)C1=CC=C(O)C=C1 TXFPEBPIARQUIG-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- LATROIIBXZFCTH-UHFFFAOYSA-N 4,5-dihydroxy-1,3-bis(methoxymethyl)imidazolidin-2-one Chemical compound COCN1C(O)C(O)N(COC)C1=O LATROIIBXZFCTH-UHFFFAOYSA-N 0.000 description 1
- ZSSJQYMNCUJSBR-UHFFFAOYSA-N 4,5-dimethoxy-1,3-bis(methoxymethyl)imidazolidin-2-one Chemical compound COCN1C(OC)C(OC)N(COC)C1=O ZSSJQYMNCUJSBR-UHFFFAOYSA-N 0.000 description 1
- DPYROBMRMXHROQ-UHFFFAOYSA-N 4,6-diaminobenzene-1,3-diol Chemical compound NC1=CC(N)=C(O)C=C1O DPYROBMRMXHROQ-UHFFFAOYSA-N 0.000 description 1
- ODPLCKKBVAJQEP-UHFFFAOYSA-N 4-(2-benzo[e][1,3]benzothiazol-2-ylethenyl)-n,n-dimethylaniline Chemical compound C1=CC(N(C)C)=CC=C1C=CC(S1)=NC2=C1C=CC1=CC=CC=C21 ODPLCKKBVAJQEP-UHFFFAOYSA-N 0.000 description 1
- RQBIGPMJQUKYAH-UHFFFAOYSA-N 4-(3,4-diaminophenoxy)benzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1OC1=CC=C(N)C(N)=C1 RQBIGPMJQUKYAH-UHFFFAOYSA-N 0.000 description 1
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- QQWWWAQUMVHHQN-UHFFFAOYSA-N 4-(4-amino-4-phenylcyclohexa-1,5-dien-1-yl)aniline Chemical group C1=CC(N)=CC=C1C1=CCC(N)(C=2C=CC=CC=2)C=C1 QQWWWAQUMVHHQN-UHFFFAOYSA-N 0.000 description 1
- QNJWXYRVQVNUQC-UHFFFAOYSA-N 4-(4-aminophenyl)-3-(2-phenylphenyl)aniline Chemical group C1(=C(C=CC=C1)C1=C(C=CC(=C1)N)C1=CC=C(N)C=C1)C1=CC=CC=C1 QNJWXYRVQVNUQC-UHFFFAOYSA-N 0.000 description 1
- XERAWPSPVRYXCU-UHFFFAOYSA-N 4-(4-aminophenyl)-3-fluoroaniline Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1F XERAWPSPVRYXCU-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- BGQWVIOOEFRPOV-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-[4-hydroxy-3,5-bis(hydroxymethyl)phenyl]propan-2-yl]-2,6-bis(hydroxymethyl)phenol Chemical compound OCC1=C(O)C(CO)=CC(C(C=2C=C(CO)C(O)=C(CO)C=2)(C(F)(F)F)C(F)(F)F)=C1 BGQWVIOOEFRPOV-UHFFFAOYSA-N 0.000 description 1
- IJJNNSUCZDJDLP-UHFFFAOYSA-N 4-[1-(3,4-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 IJJNNSUCZDJDLP-UHFFFAOYSA-N 0.000 description 1
- ASNOFHCTUSIHOM-UHFFFAOYSA-N 4-[10-(4-aminophenyl)anthracen-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C(C1=CC=CC=C11)=C(C=CC=C2)C2=C1C1=CC=C(N)C=C1 ASNOFHCTUSIHOM-UHFFFAOYSA-N 0.000 description 1
- DQOPDYYQICTYEY-UHFFFAOYSA-N 4-[2-(1,3-benzoxazol-2-yl)ethenyl]-n,n-dimethylaniline Chemical compound C1=CC(N(C)C)=CC=C1C=CC1=NC2=CC=CC=C2O1 DQOPDYYQICTYEY-UHFFFAOYSA-N 0.000 description 1
- APXJLYIVOFARRM-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(C(O)=O)C(C(O)=O)=C1 APXJLYIVOFARRM-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- UHNUHZHQLCGZDA-UHFFFAOYSA-N 4-[2-(4-aminophenyl)ethyl]aniline Chemical compound C1=CC(N)=CC=C1CCC1=CC=C(N)C=C1 UHNUHZHQLCGZDA-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- LTKJRDQWPMBSFN-UHFFFAOYSA-N 4-[3-(4-aminophenyl)-1,1,2,2,3,3-hexafluoropropyl]aniline Chemical compound C1=CC(N)=CC=C1C(F)(F)C(F)(F)C(F)(F)C1=CC=C(N)C=C1 LTKJRDQWPMBSFN-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- GACNZKUFHGKSEX-UHFFFAOYSA-N 4-[4-(4-aminophenyl)-1,1,2,2,3,3,4,4-octafluorobutyl]aniline Chemical compound C1=CC(N)=CC=C1C(F)(F)C(F)(F)C(F)(F)C(F)(F)C1=CC=C(N)C=C1 GACNZKUFHGKSEX-UHFFFAOYSA-N 0.000 description 1
- HBLYIUPUXAWDMA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3,5-bis(trifluoromethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-2,6-bis(trifluoromethyl)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=C(C(F)(F)F)C=C(C(C=2C=C(C(OC=3C=CC(N)=CC=3)=C(C=2)C(F)(F)F)C(F)(F)F)(C(F)(F)F)C(F)(F)F)C=C1C(F)(F)F HBLYIUPUXAWDMA-UHFFFAOYSA-N 0.000 description 1
- VCFYKCXKADGLPS-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3,5-dimethylphenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-2,6-dimethylphenoxy]aniline Chemical compound CC1=CC(C(C=2C=C(C)C(OC=3C=CC(N)=CC=3)=C(C)C=2)(C(F)(F)F)C(F)(F)F)=CC(C)=C1OC1=CC=C(N)C=C1 VCFYKCXKADGLPS-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- PDYQWKUIJVOAON-UHFFFAOYSA-N 4-[4-[2-[4-[4-amino-3-(trifluoromethyl)phenoxy]phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]-2-(trifluoromethyl)aniline Chemical compound C1=C(C(F)(F)F)C(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=C(C(N)=CC=3)C(F)(F)F)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 PDYQWKUIJVOAON-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- DPCDFSDBIWVMJC-UHFFFAOYSA-N 4-[4-[4-[4-amino-3-(trifluoromethyl)phenoxy]phenyl]phenoxy]-2-(trifluoromethyl)aniline Chemical group C1=C(C(F)(F)F)C(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=C(C(N)=CC=3)C(F)(F)F)=CC=2)C=C1 DPCDFSDBIWVMJC-UHFFFAOYSA-N 0.000 description 1
- FPAKXKXRPMFMLR-UHFFFAOYSA-N 4-[5-(4-aminophenyl)-1,1,2,2,3,3,4,4,5,5-decafluoropentyl]aniline Chemical compound C1=CC(N)=CC=C1C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C1=CC=C(N)C=C1 FPAKXKXRPMFMLR-UHFFFAOYSA-N 0.000 description 1
- BOTFKTVSBXEXKF-UHFFFAOYSA-N 4-[7-(4-aminophenyl)-1,1,2,2,3,3,4,4,5,5,6,6,7,7-tetradecafluoroheptyl]aniline Chemical compound C1=CC(N)=CC=C1C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C1=CC=C(N)C=C1 BOTFKTVSBXEXKF-UHFFFAOYSA-N 0.000 description 1
- XUWFAPDKIXEUPR-UHFFFAOYSA-N 4-[[3-[[4-(diethylamino)phenyl]methylidene]cyclopentylidene]methyl]-n,n-diethylaniline Chemical compound C1=CC(N(CC)CC)=CC=C1C=C(CC1)CC1=CC1=CC=C(N(CC)CC)C=C1 XUWFAPDKIXEUPR-UHFFFAOYSA-N 0.000 description 1
- ACQVEWFMUBXEMR-UHFFFAOYSA-N 4-bromo-2-fluoro-6-nitrophenol Chemical compound OC1=C(F)C=C(Br)C=C1[N+]([O-])=O ACQVEWFMUBXEMR-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- XESZUVZBAMCAEJ-UHFFFAOYSA-N 4-tert-butylcatechol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1 XESZUVZBAMCAEJ-UHFFFAOYSA-N 0.000 description 1
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
- SGNZYJXNUURYCH-UHFFFAOYSA-N 5,6-dihydroxyindole Chemical compound C1=C(O)C(O)=CC2=C1NC=C2 SGNZYJXNUURYCH-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- RZWRYPGAUIOOMK-UHFFFAOYSA-N 5-nitroso-8-quinolinol Chemical compound C1=CN=C2C(O)=CC=C(N=O)C2=C1 RZWRYPGAUIOOMK-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- QYFYIOWLBSPSDM-UHFFFAOYSA-N 6-aminonaphthalen-1-ol Chemical compound OC1=CC=CC2=CC(N)=CC=C21 QYFYIOWLBSPSDM-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- QXAMGWKESXGGNV-UHFFFAOYSA-N 7-(diethylamino)-1-benzopyran-2-one Chemical compound C1=CC(=O)OC2=CC(N(CC)CC)=CC=C21 QXAMGWKESXGGNV-UHFFFAOYSA-N 0.000 description 1
- SANIRTQDABNCHF-UHFFFAOYSA-N 7-(diethylamino)-3-[7-(diethylamino)-2-oxochromene-3-carbonyl]chromen-2-one Chemical compound C1=C(N(CC)CC)C=C2OC(=O)C(C(=O)C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=CC2=C1 SANIRTQDABNCHF-UHFFFAOYSA-N 0.000 description 1
- ZYSOYLBBCYWEMB-UHFFFAOYSA-N 7-aminonaphthalen-1-ol Chemical compound C1=CC=C(O)C2=CC(N)=CC=C21 ZYSOYLBBCYWEMB-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- SNCJAJRILVFXAE-UHFFFAOYSA-N 9h-fluorene-2,7-diamine Chemical compound NC1=CC=C2C3=CC=C(N)C=C3CC2=C1 SNCJAJRILVFXAE-UHFFFAOYSA-N 0.000 description 1
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical class CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- KYNSBQPICQTCGU-UHFFFAOYSA-N Benzopyrane Chemical compound C1=CC=C2C=CCOC2=C1 KYNSBQPICQTCGU-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- VXOUILHMFVRYJI-UHFFFAOYSA-N CCCCOC(OCCCC)(OCCCC)CC(OCCCC)C(OCCCC)(OCCCC)NC1=NC(N)=NC(N)=N1 Chemical compound CCCCOC(OCCCC)(OCCCC)CC(OCCCC)C(OCCCC)(OCCCC)NC1=NC(N)=NC(N)=N1 VXOUILHMFVRYJI-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 150000000703 Cerium Chemical class 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- FCKYPQBAHLOOJQ-UHFFFAOYSA-N Cyclohexane-1,2-diaminetetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)C1CCCCC1N(CC(O)=O)CC(O)=O FCKYPQBAHLOOJQ-UHFFFAOYSA-N 0.000 description 1
- 239000009261 D 400 Substances 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- GKQLYSROISKDLL-UHFFFAOYSA-N EEDQ Chemical compound C1=CC=C2N(C(=O)OCC)C(OCC)C=CC2=C1 GKQLYSROISKDLL-UHFFFAOYSA-N 0.000 description 1
- 239000004129 EU approved improving agent Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- FPVVYTCTZKCSOJ-UHFFFAOYSA-N Ethylene glycol distearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCCCCCC FPVVYTCTZKCSOJ-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- ILKOAJGHVUCDIV-UHFFFAOYSA-N FC1=CC=C(N2C=CC=C2)C(F)=C1[Ti]C(C=1F)=C(F)C=CC=1N1C=CC=C1 Chemical compound FC1=CC=C(N2C=CC=C2)C(F)=C1[Ti]C(C=1F)=C(F)C=CC=1N1C=CC=C1 ILKOAJGHVUCDIV-UHFFFAOYSA-N 0.000 description 1
- FCTYHYDLMFYYLG-UHFFFAOYSA-N Fc1cccc(F)c1[Ti]c1c(F)cccc1F Chemical compound Fc1cccc(F)c1[Ti]c1c(F)cccc1F FCTYHYDLMFYYLG-UHFFFAOYSA-N 0.000 description 1
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WRYCSMQKUKOKBP-UHFFFAOYSA-N Imidazolidine Chemical group C1CNCN1 WRYCSMQKUKOKBP-UHFFFAOYSA-N 0.000 description 1
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- ZSXGLVDWWRXATF-UHFFFAOYSA-N N,N-dimethylformamide dimethyl acetal Chemical compound COC(OC)N(C)C ZSXGLVDWWRXATF-UHFFFAOYSA-N 0.000 description 1
- UBUCNCOMADRQHX-UHFFFAOYSA-N N-Nitrosodiphenylamine Chemical compound C=1C=CC=CC=1N(N=O)C1=CC=CC=C1 UBUCNCOMADRQHX-UHFFFAOYSA-N 0.000 description 1
- XQVWYOYUZDUNRW-UHFFFAOYSA-N N-Phenyl-1-naphthylamine Chemical compound C=1C=CC2=CC=CC=C2C=1NC1=CC=CC=C1 XQVWYOYUZDUNRW-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- HZYYJGBYLVDXGY-UHFFFAOYSA-N OC(COC1=CC(=C(C=C1)N1NC(=C(C(=N1)C1=C(C=C(C=C1)C)C)C1=C(C=CC=C1)O)C1=C(C=C(C=C1)C)C)O)COCCCCCCCCCCCCC Chemical class OC(COC1=CC(=C(C=C1)N1NC(=C(C(=N1)C1=C(C=C(C=C1)C)C)C1=C(C=CC=C1)O)C1=C(C=C(C=C1)C)C)O)COCCCCCCCCCCCCC HZYYJGBYLVDXGY-UHFFFAOYSA-N 0.000 description 1
- MAOLXURNLQQKOZ-UHFFFAOYSA-N OC1=C(C=CC(=C1)OCCC)C1=NC(=NC(=N1)C1=C(C=C(C=C1)OCCC)O)C1=C(C=C(C=C1)C)C.OC1=C(C=CC(=C1)O)C1=NC(=NC(=N1)C1=C(C=C(C=C1)C)C)C1=C(C=C(C=C1)C)C Chemical compound OC1=C(C=CC(=C1)OCCC)C1=NC(=NC(=N1)C1=C(C=C(C=C1)OCCC)O)C1=C(C=C(C=C1)C)C.OC1=C(C=CC(=C1)O)C1=NC(=NC(=N1)C1=C(C=C(C=C1)C)C)C1=C(C=C(C=C1)C)C MAOLXURNLQQKOZ-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920000604 Polyethylene Glycol 200 Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 239000005700 Putrescine Substances 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical group C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- LCTONWCANYUPML-UHFFFAOYSA-M Pyruvate Chemical compound CC(=O)C([O-])=O LCTONWCANYUPML-UHFFFAOYSA-M 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- QYTDEUPAUMOIOP-UHFFFAOYSA-N TEMPO Chemical compound CC1(C)CCCC(C)(C)N1[O] QYTDEUPAUMOIOP-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical group C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- 229920002359 Tetronic® Polymers 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical group C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- DPQRMIPRAHPPNE-UHFFFAOYSA-N [(1-oxo-1-phenylpropan-2-ylidene)amino] acetate Chemical compound CC(=O)ON=C(C)C(=O)C1=CC=CC=C1 DPQRMIPRAHPPNE-UHFFFAOYSA-N 0.000 description 1
- ZNZDJSGUWLGTLA-UHFFFAOYSA-N [(1-oxo-1-phenylpropan-2-ylidene)amino] benzoate Chemical compound C=1C=CC=CC=1C(=O)C(C)=NOC(=O)C1=CC=CC=C1 ZNZDJSGUWLGTLA-UHFFFAOYSA-N 0.000 description 1
- FLRQOWAOMJMSTP-JJTRIOAGSA-N [(2s)-2-[(2r)-3,4-dihydroxy-5-oxo-2h-furan-2-yl]-2-hydroxyethyl] (6z,9z,12z)-octadeca-6,9,12-trienoate Chemical compound CCCCC\C=C/C\C=C/C\C=C/CCCCC(=O)OC[C@H](O)[C@H]1OC(=O)C(O)=C1O FLRQOWAOMJMSTP-JJTRIOAGSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- PICGUDVETMNGMN-UHFFFAOYSA-N [2,3-bis(hydroxymethyl)phenyl]-phenylmethanone Chemical compound OCc1cccc(C(=O)c2ccccc2)c1CO PICGUDVETMNGMN-UHFFFAOYSA-N 0.000 description 1
- WIMRPMLPJZLCAM-UHFFFAOYSA-N [2,3-bis(methoxymethyl)phenyl]-phenylmethanone Chemical compound COCc1cccc(C(=O)c2ccccc2)c1COC WIMRPMLPJZLCAM-UHFFFAOYSA-N 0.000 description 1
- RYSWVYFTSSTNMY-UHFFFAOYSA-N [2-(hydroxymethyl)-3,4-dimethoxyphenyl]methanol Chemical compound COC1=CC=C(CO)C(CO)=C1OC RYSWVYFTSSTNMY-UHFFFAOYSA-N 0.000 description 1
- UAGDZLRBMHVJNS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl] 2-(hydroxymethyl)benzoate Chemical compound OCc1ccccc1OC(=O)c1ccccc1CO UAGDZLRBMHVJNS-UHFFFAOYSA-N 0.000 description 1
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 1
- ZCWHTBJAXKQNAO-UHFFFAOYSA-N [2-(methoxymethyl)phenyl] 2-(methoxymethyl)benzoate Chemical compound COCc1ccccc1OC(=O)c1ccccc1COC ZCWHTBJAXKQNAO-UHFFFAOYSA-N 0.000 description 1
- YPCHGLDQZXOZFW-UHFFFAOYSA-N [2-[[4-methyl-3-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]carbonylamino]phenyl]carbamoyloxymethyl]-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound CC1=CC=C(NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C)C=C1NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C YPCHGLDQZXOZFW-UHFFFAOYSA-N 0.000 description 1
- HIVQCJOGAHNXBO-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] propanoate Chemical compound CCC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C HIVQCJOGAHNXBO-UHFFFAOYSA-N 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- KGUYZCLKIAMWTP-UHFFFAOYSA-N [4-(dimethylamino)phenyl]-(2-ethenylphenyl)methanone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=CC=C1C=C KGUYZCLKIAMWTP-UHFFFAOYSA-N 0.000 description 1
- CNFQQUXCFJEREO-UHFFFAOYSA-N [4-[4-(hydroxymethyl)-2,3-dimethylphenyl]phenyl]methanol Chemical group CC=1C(=C(C=CC=1CO)C1=CC=C(C=C1)CO)C CNFQQUXCFJEREO-UHFFFAOYSA-N 0.000 description 1
- SFHGONLFTNHXDX-UHFFFAOYSA-N [4-[4-(hydroxymethyl)phenyl]phenyl]methanol Chemical group C1=CC(CO)=CC=C1C1=CC=C(CO)C=C1 SFHGONLFTNHXDX-UHFFFAOYSA-N 0.000 description 1
- XQAXKRLKNVVHSS-UHFFFAOYSA-J [Ti+4].Cc1cc([O-])c(C)c(C)c1C.Cc1cc([O-])c(C)c(C)c1C.Cc1cc([O-])c(C)c(C)c1C.Cc1cc([O-])c(C)c(C)c1C Chemical compound [Ti+4].Cc1cc([O-])c(C)c(C)c1C.Cc1cc([O-])c(C)c(C)c1C.Cc1cc([O-])c(C)c(C)c1C.Cc1cc([O-])c(C)c(C)c1C XQAXKRLKNVVHSS-UHFFFAOYSA-J 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- OHBRHBQMHLEELN-UHFFFAOYSA-N acetic acid;1-butoxybutane Chemical compound CC(O)=O.CCCCOCCCC OHBRHBQMHLEELN-UHFFFAOYSA-N 0.000 description 1
- IPSOQTFPIWIGJT-UHFFFAOYSA-N acetic acid;1-propoxypropane Chemical compound CC(O)=O.CCCOCCC IPSOQTFPIWIGJT-UHFFFAOYSA-N 0.000 description 1
- NJYZCEFQAIUHSD-UHFFFAOYSA-N acetoguanamine Chemical compound CC1=NC(N)=NC(N)=N1 NJYZCEFQAIUHSD-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- WETWJCDKMRHUPV-UHFFFAOYSA-N acetyl chloride Chemical compound CC(Cl)=O WETWJCDKMRHUPV-UHFFFAOYSA-N 0.000 description 1
- 239000012346 acetyl chloride Substances 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- HFBMWMNUJJDEQZ-UHFFFAOYSA-N acryloyl chloride Chemical compound ClC(=O)C=C HFBMWMNUJJDEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- MIBQYWIOHFTKHD-UHFFFAOYSA-N adamantane-1-carbonyl chloride Chemical compound C1C(C2)CC3CC2CC1(C(=O)Cl)C3 MIBQYWIOHFTKHD-UHFFFAOYSA-N 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 125000005103 alkyl silyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XPNGNIFUDRPBFJ-UHFFFAOYSA-N alpha-methylbenzylalcohol Natural products CC1=CC=CC=C1CO XPNGNIFUDRPBFJ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- MKSISPKJEMTIGI-LWTKGLMZSA-K aluminum (Z)-oxido-oxidoimino-phenylazanium Chemical compound [Al+3].[O-]\N=[N+](/[O-])c1ccccc1.[O-]\N=[N+](/[O-])c1ccccc1.[O-]\N=[N+](/[O-])c1ccccc1 MKSISPKJEMTIGI-LWTKGLMZSA-K 0.000 description 1
- MQPPCKJJFDNPHJ-UHFFFAOYSA-K aluminum;3-oxohexanoate Chemical compound [Al+3].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O MQPPCKJJFDNPHJ-UHFFFAOYSA-K 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 229960004050 aminobenzoic acid Drugs 0.000 description 1
- 125000004397 aminosulfonyl group Chemical group NS(=O)(=O)* 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
- 235000019257 ammonium acetate Nutrition 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000003146 anticoagulant agent Substances 0.000 description 1
- 229940053200 antiepileptics fatty acid derivative Drugs 0.000 description 1
- 125000005013 aryl ether group Chemical group 0.000 description 1
- PAQKRBLMHQTWAS-UHFFFAOYSA-N azane;n-hydroxy-n-naphthalen-1-ylnitrous amide Chemical compound N.C1=CC=C2C(N(N=O)O)=CC=CC2=C1 PAQKRBLMHQTWAS-UHFFFAOYSA-N 0.000 description 1
- NJVHCUNZAMFQNA-UHFFFAOYSA-N azane;n-hydroxy-n-phenylnitrous amide Chemical compound N.O=NN(O)C1=CC=CC=C1 NJVHCUNZAMFQNA-UHFFFAOYSA-N 0.000 description 1
- 125000000852 azido group Chemical group *N=[N+]=[N-] 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- ZVSKZLHKADLHSD-UHFFFAOYSA-N benzanilide Chemical compound C=1C=CC=CC=1C(=O)NC1=CC=CC=C1 ZVSKZLHKADLHSD-UHFFFAOYSA-N 0.000 description 1
- CJPIDIRJSIUWRJ-UHFFFAOYSA-N benzene-1,2,4-tricarbonyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C(C(Cl)=O)=C1 CJPIDIRJSIUWRJ-UHFFFAOYSA-N 0.000 description 1
- JGFLAAWSLCPCDY-UHFFFAOYSA-N benzene;cyclopenta-1,3-diene;iron Chemical compound [Fe].C1C=CC=C1.C1=CC=CC=C1 JGFLAAWSLCPCDY-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 125000004541 benzoxazolyl group Chemical group O1C(=NC2=C1C=CC=C2)* 0.000 description 1
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 description 1
- NEQRECSQVSRXLZ-UHFFFAOYSA-N benzyl 7-(dimethylamino)-2-oxochromene-3-carboxylate Chemical compound O=C1OC2=CC(N(C)C)=CC=C2C=C1C(=O)OCC1=CC=CC=C1 NEQRECSQVSRXLZ-UHFFFAOYSA-N 0.000 description 1
- JERAEGPJHSIFOW-UHFFFAOYSA-N benzyl(nitro)carbamic acid Chemical class OC(=O)N([N+]([O-])=O)CC1=CC=CC=C1 JERAEGPJHSIFOW-UHFFFAOYSA-N 0.000 description 1
- FKPSBYZGRQJIMO-UHFFFAOYSA-M benzyl(triethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC1=CC=CC=C1 FKPSBYZGRQJIMO-UHFFFAOYSA-M 0.000 description 1
- RRIWSQXXBIFKQM-UHFFFAOYSA-N benzylcarbamic acid Chemical class OC(=O)NCC1=CC=CC=C1 RRIWSQXXBIFKQM-UHFFFAOYSA-N 0.000 description 1
- 125000000649 benzylidene group Chemical group [H]C(=[*])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- SODJJEXAWOSSON-UHFFFAOYSA-N bis(2-hydroxy-4-methoxyphenyl)methanone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=C(OC)C=C1O SODJJEXAWOSSON-UHFFFAOYSA-N 0.000 description 1
- RKTGAWJWCNLSFX-UHFFFAOYSA-M bis(2-hydroxyethyl)-dimethylazanium;hydroxide Chemical compound [OH-].OCC[N+](C)(C)CCO RKTGAWJWCNLSFX-UHFFFAOYSA-M 0.000 description 1
- AEWGGPYHSLODJJ-UHFFFAOYSA-N bis(3-amino-4-hydroxyphenyl)methanone Chemical compound C1=C(O)C(N)=CC(C(=O)C=2C=C(N)C(O)=CC=2)=C1 AEWGGPYHSLODJJ-UHFFFAOYSA-N 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- HEYYMASVKJXRDV-UHFFFAOYSA-N bis[(3-ethyloxetan-3-yl)methyl] benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OCC2(CC)COC2)C=CC=1C(=O)OCC1(CC)COC1 HEYYMASVKJXRDV-UHFFFAOYSA-N 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- MTKOCRSQUPLVTD-UHFFFAOYSA-N butan-1-olate;titanium(2+) Chemical compound CCCCO[Ti]OCCCC MTKOCRSQUPLVTD-UHFFFAOYSA-N 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- IJRVQAXSAHHCNH-UHFFFAOYSA-M butyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CCCC[N+](C)(C)C IJRVQAXSAHHCNH-UHFFFAOYSA-M 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 150000004657 carbamic acid derivatives Chemical class 0.000 description 1
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical compound NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 description 1
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910000175 cerite Inorganic materials 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000009918 complex formation Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- RVOJTCZRIKWHDX-UHFFFAOYSA-N cyclohexanecarbonyl chloride Chemical compound ClC(=O)C1CCCCC1 RVOJTCZRIKWHDX-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical class [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- ZQWRZCZEOLZBQF-UHFFFAOYSA-N cyclopentane-1,3-diamine Chemical compound NC1CCC(N)C1 ZQWRZCZEOLZBQF-UHFFFAOYSA-N 0.000 description 1
- XCIXKGXIYUWCLL-UHFFFAOYSA-N cyclopentanol Chemical compound OC1CCCC1 XCIXKGXIYUWCLL-UHFFFAOYSA-N 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- VILAVOFMIJHSJA-UHFFFAOYSA-N dicarbon monoxide Chemical compound [C]=C=O VILAVOFMIJHSJA-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 125000001664 diethylamino group Chemical group [H]C([H])([H])C([H])([H])N(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- BGRWYRAHAFMIBJ-UHFFFAOYSA-N diisopropylcarbodiimide Natural products CC(C)NC(=O)NC(C)C BGRWYRAHAFMIBJ-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- BEPAFCGSDWSTEL-UHFFFAOYSA-N dimethyl malonate Chemical compound COC(=O)CC(=O)OC BEPAFCGSDWSTEL-UHFFFAOYSA-N 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 208000018459 dissociative disease Diseases 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000012990 dithiocarbamate Substances 0.000 description 1
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical compound CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- IAJNXBNRYMEYAZ-UHFFFAOYSA-N ethyl 2-cyano-3,3-diphenylprop-2-enoate Chemical compound C=1C=CC=CC=1C(=C(C#N)C(=O)OCC)C1=CC=CC=C1 IAJNXBNRYMEYAZ-UHFFFAOYSA-N 0.000 description 1
- WNIHNYUROPJCLW-UHFFFAOYSA-N ethyl 2-ethoxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)OCC WNIHNYUROPJCLW-UHFFFAOYSA-N 0.000 description 1
- FJAKCEHATXBFJT-UHFFFAOYSA-N ethyl 2-oxobutanoate Chemical compound CCOC(=O)C(=O)CC FJAKCEHATXBFJT-UHFFFAOYSA-N 0.000 description 1
- AYCOCJMEYVYNPM-UHFFFAOYSA-N ethyl 7-(dimethylamino)-2-oxochromene-3-carboxylate Chemical compound C1=C(N(C)C)C=C2OC(=O)C(C(=O)OCC)=CC2=C1 AYCOCJMEYVYNPM-UHFFFAOYSA-N 0.000 description 1
- YDMWUMUNUXUYKT-UHFFFAOYSA-N ethyl [(1-oxo-1-phenylpropan-2-ylidene)amino] carbonate Chemical compound CCOC(=O)ON=C(C)C(=O)C1=CC=CC=C1 YDMWUMUNUXUYKT-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- TVQGDYNRXLTQAP-UHFFFAOYSA-N ethyl heptanoate Chemical compound CCCCCCC(=O)OCC TVQGDYNRXLTQAP-UHFFFAOYSA-N 0.000 description 1
- KVFVBPYVNUCWJX-UHFFFAOYSA-M ethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)C KVFVBPYVNUCWJX-UHFFFAOYSA-M 0.000 description 1
- DEFVIWRASFVYLL-UHFFFAOYSA-N ethylene glycol bis(2-aminoethyl)tetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)CCOCCOCCN(CC(O)=O)CC(O)=O DEFVIWRASFVYLL-UHFFFAOYSA-N 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 150000003948 formamides Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229940100608 glycol distearate Drugs 0.000 description 1
- 125000003827 glycol group Chemical group 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- PKWIYNIDEDLDCJ-UHFFFAOYSA-N guanazole Chemical compound NC1=NNC(N)=N1 PKWIYNIDEDLDCJ-UHFFFAOYSA-N 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- LWGMOHWJLCZCLJ-UHFFFAOYSA-N hentriacontanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O LWGMOHWJLCZCLJ-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000007975 iminium salts Chemical class 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000003402 intramolecular cyclocondensation reaction Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 238000005040 ion trap Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- BHIWKHZACMWKOJ-UHFFFAOYSA-N isobutyric acid methyl ester Natural products COC(=O)C(C)C BHIWKHZACMWKOJ-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- ZLTPDFXIESTBQG-UHFFFAOYSA-N isothiazole Chemical group C=1C=NSC=1 ZLTPDFXIESTBQG-UHFFFAOYSA-N 0.000 description 1
- CTAPFRYPJLPFDF-UHFFFAOYSA-N isoxazole Chemical group C=1C=NOC=1 CTAPFRYPJLPFDF-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- 125000005394 methallyl group Chemical group 0.000 description 1
- ITNVWQNWHXEMNS-UHFFFAOYSA-N methanolate;titanium(4+) Chemical compound [Ti+4].[O-]C.[O-]C.[O-]C.[O-]C ITNVWQNWHXEMNS-UHFFFAOYSA-N 0.000 description 1
- RMIODHQZRUFFFF-UHFFFAOYSA-N methoxyacetic acid Chemical compound COCC(O)=O RMIODHQZRUFFFF-UHFFFAOYSA-N 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- XPIWVCAMONZQCP-UHFFFAOYSA-N methyl 2-oxobutanoate Chemical compound CCC(=O)C(=O)OC XPIWVCAMONZQCP-UHFFFAOYSA-N 0.000 description 1
- LXEXJHKRLWTKGZ-UHFFFAOYSA-N methyl 7-(diethylamino)-2-oxochromene-3-carboxylate Chemical compound C1=C(C(=O)OC)C(=O)OC2=CC(N(CC)CC)=CC=C21 LXEXJHKRLWTKGZ-UHFFFAOYSA-N 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- WJSJNBGIABLEGX-UHFFFAOYSA-M methyl(tripentyl)azanium;hydroxide Chemical compound [OH-].CCCCC[N+](C)(CCCCC)CCCCC WJSJNBGIABLEGX-UHFFFAOYSA-M 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- GXMIHVHJTLPVKL-UHFFFAOYSA-N n,n,2-trimethylpropanamide Chemical compound CC(C)C(=O)N(C)C GXMIHVHJTLPVKL-UHFFFAOYSA-N 0.000 description 1
- DKLYDESVXZKCFI-UHFFFAOYSA-N n,n-diphenylacetamide Chemical compound C=1C=CC=CC=1N(C(=O)C)C1=CC=CC=C1 DKLYDESVXZKCFI-UHFFFAOYSA-N 0.000 description 1
- YALAVAYMNJCEBU-UHFFFAOYSA-N n-(2-chloro-3-formylpyridin-4-yl)-2,2-dimethylpropanamide Chemical compound CC(C)(C)C(=O)NC1=CC=NC(Cl)=C1C=O YALAVAYMNJCEBU-UHFFFAOYSA-N 0.000 description 1
- UAOIEEWQVAXCFY-UHFFFAOYSA-N n-(3,4-dimethylphenyl)acetamide Chemical compound CC(=O)NC1=CC=C(C)C(C)=C1 UAOIEEWQVAXCFY-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- YUOMCRCBTBNCCS-JUKUECOXSA-N n-[(2s)-1-[[(5s)-5-[(4-aminophenyl)sulfonyl-(2-methylpropyl)amino]-6-hydroxyhexyl]amino]-1-oxo-3,3-diphenylpropan-2-yl]-6-methylpyridine-3-carboxamide Chemical compound N([C@H](C(=O)NCCCC[C@@H](CO)N(CC(C)C)S(=O)(=O)C=1C=CC(N)=CC=1)C(C=1C=CC=CC=1)C=1C=CC=CC=1)C(=O)C1=CC=C(C)N=C1 YUOMCRCBTBNCCS-JUKUECOXSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- PZYDAVFRVJXFHS-UHFFFAOYSA-N n-cyclohexyl-2-pyrrolidone Chemical compound O=C1CCCN1C1CCCCC1 PZYDAVFRVJXFHS-UHFFFAOYSA-N 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- DAHPIMYBWVSMKQ-UHFFFAOYSA-N n-hydroxy-n-phenylnitrous amide Chemical compound O=NN(O)C1=CC=CC=C1 DAHPIMYBWVSMKQ-UHFFFAOYSA-N 0.000 description 1
- LMTGCJANOQOGPI-UHFFFAOYSA-N n-methyl-n-phenylacetamide Chemical compound CC(=O)N(C)C1=CC=CC=C1 LMTGCJANOQOGPI-UHFFFAOYSA-N 0.000 description 1
- HDLRSIQOZFLEPK-UHFFFAOYSA-N naphthalene-1,2,5,8-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C2=C(C(O)=O)C(C(=O)O)=CC=C21 HDLRSIQOZFLEPK-UHFFFAOYSA-N 0.000 description 1
- DSCIZKMHZPGBNI-UHFFFAOYSA-N naphthalene-1,3,5,8-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C2=CC(C(=O)O)=CC(C(O)=O)=C21 DSCIZKMHZPGBNI-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- BTHGHFBUGBTINV-UHFFFAOYSA-N naphthalene-2,3,6-tricarboxylic acid Chemical compound C1=C(C(O)=O)C(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 BTHGHFBUGBTINV-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- 229940038384 octadecane Drugs 0.000 description 1
- NGBBFNQEPSYETA-UHFFFAOYSA-N octadecanoic acid;hydrochloride Chemical compound Cl.CCCCCCCCCCCCCCCCCC(O)=O NGBBFNQEPSYETA-UHFFFAOYSA-N 0.000 description 1
- FMJSMJQBSVNSBF-UHFFFAOYSA-N octocrylene Chemical compound C=1C=CC=CC=1C(=C(C#N)C(=O)OCC(CC)CCCC)C1=CC=CC=C1 FMJSMJQBSVNSBF-UHFFFAOYSA-N 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical group C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
- PFPYHYZFFJJQFD-UHFFFAOYSA-N oxalic anhydride Chemical compound O=C1OC1=O PFPYHYZFFJJQFD-UHFFFAOYSA-N 0.000 description 1
- 150000004893 oxazines Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- ROTJZTYLACIJIG-UHFFFAOYSA-N pentane-1,3,5-tricarboxylic acid Chemical compound OC(=O)CCC(C(O)=O)CCC(O)=O ROTJZTYLACIJIG-UHFFFAOYSA-N 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- JGGWKXMPICYBKC-UHFFFAOYSA-N phenanthrene-1,8,9,10-tetracarboxylic acid Chemical compound C1=CC=C(C(O)=O)C2=C(C(O)=O)C(C(O)=O)=C3C(C(=O)O)=CC=CC3=C21 JGGWKXMPICYBKC-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 150000008301 phosphite esters Chemical group 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001983 poloxamer Polymers 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 150000003138 primary alcohols Chemical class 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- RZWZRACFZGVKFM-UHFFFAOYSA-N propanoyl chloride Chemical compound CCC(Cl)=O RZWZRACFZGVKFM-UHFFFAOYSA-N 0.000 description 1
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 125000004309 pyranyl group Chemical group O1C(C=CC=C1)* 0.000 description 1
- 125000003373 pyrazinyl group Chemical group 0.000 description 1
- 125000003072 pyrazolidinyl group Chemical group 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical group C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- MIROPXUFDXCYLG-UHFFFAOYSA-N pyridine-2,5-diamine Chemical compound NC1=CC=C(N)N=C1 MIROPXUFDXCYLG-UHFFFAOYSA-N 0.000 description 1
- 125000000714 pyrimidinyl group Chemical group 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- GZTPJDLYPMPRDF-UHFFFAOYSA-N pyrrolo[3,2-c]pyrazole Chemical compound N1=NC2=CC=NC2=C1 GZTPJDLYPMPRDF-UHFFFAOYSA-N 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 150000003872 salicylic acid derivatives Chemical class 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- NMWCVZCSJHJYFW-UHFFFAOYSA-M sodium;3,5-dichloro-2-hydroxybenzenesulfonate Chemical compound [Na+].OC1=C(Cl)C=C(Cl)C=C1S([O-])(=O)=O NMWCVZCSJHJYFW-UHFFFAOYSA-M 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 125000000565 sulfonamide group Chemical group 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 125000003718 tetrahydrofuranyl group Chemical group 0.000 description 1
- RAOIDOHSFRTOEL-UHFFFAOYSA-N tetrahydrothiophene Chemical group C1CCSC1 RAOIDOHSFRTOEL-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- DCFYRBLFVWYBIJ-UHFFFAOYSA-M tetraoctylazanium;hydroxide Chemical compound [OH-].CCCCCCCC[N+](CCCCCCCC)(CCCCCCCC)CCCCCCCC DCFYRBLFVWYBIJ-UHFFFAOYSA-M 0.000 description 1
- JVOPCCBEQRRLOJ-UHFFFAOYSA-M tetrapentylazanium;hydroxide Chemical compound [OH-].CCCCC[N+](CCCCC)(CCCCC)CCCCC JVOPCCBEQRRLOJ-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 150000003536 tetrazoles Chemical group 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 125000005000 thioaryl group Chemical group 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 1
- 125000005424 tosyloxy group Chemical group S(=O)(=O)(C1=CC=C(C)C=C1)O* 0.000 description 1
- HTSABYAWKQAHBT-UHFFFAOYSA-N trans 3-methylcyclohexanol Natural products CC1CCCC(O)C1 HTSABYAWKQAHBT-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- GKASDNZWUGIAMG-UHFFFAOYSA-N triethyl orthoformate Chemical compound CCOC(OCC)OCC GKASDNZWUGIAMG-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 125000004953 trihalomethyl group Chemical group 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- HADKRTWCOYPCPH-UHFFFAOYSA-M trimethylphenylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C1=CC=CC=C1 HADKRTWCOYPCPH-UHFFFAOYSA-M 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- HIZCIEIDIFGZSS-UHFFFAOYSA-L trithiocarbonate Chemical compound [S-]C([S-])=S HIZCIEIDIFGZSS-UHFFFAOYSA-L 0.000 description 1
- 239000012989 trithiocarbonate Substances 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical class OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/145—Polyamides; Polyesteramides; Polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/22—Polybenzoxazoles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Definitions
- the present invention relates to a resin composition, a cured product, a laminate, a method for producing a cured product, and a semiconductor device.
- Cyclic resin such as polyimide is applied to various applications because it has excellent heat resistance and insulating properties.
- the application is not particularly limited, and examples thereof include a semiconductor device for mounting as a material for an insulating film or a sealing material, or a protective film. It is also used as a base film and coverlay for flexible substrates.
- the cyclized resin such as polyimide is used in the form of a cyclized resin such as polyimide and a resin composition containing at least one of the precursors of the cyclized resin.
- a resin composition is applied to a base material by, for example, coating to form a photosensitive film, and then exposed, developed, heated or the like, if necessary, to form a cured product on the base material.
- the precursor of the cyclized resin such as the polyimide precursor is cyclized by heating, for example, and becomes a cyclized resin such as polyimide in the cured product.
- the resin composition can be applied by a known coating method or the like, for example, there is a high degree of freedom in designing the shape, size, application position, etc. of the applied resin composition at the time of application. It can be said that it is excellent in sex.
- the above-mentioned resin compositions are expected to be increasingly applied in industry from the viewpoint of excellent manufacturing adaptability.
- Patent Document 1 describes (a) a polymer (A) containing a specific structural unit as a main component, (b) a compound (B) represented by a specific general formula, and (c) a photoinitiator and a photoinitiator. Described are photosensitive polyimide precursor compositions comprising / or a sensitizer and / or a photoreactive monomer.
- Patent Document 2 describes an oxygen scavenging polymer comprising a main polymer having a backbone and an unsaturated side chain bonded to the backbone, wherein the side chain is at least one aliphatic carbon-carbon double bond or. A composition comprising an oxygen scavenging polymer comprising two or more carbon-carbon double bonds and a catalyst has been described.
- a resin composition containing at least one of a cyclized resin such as polyimide and a precursor of the cyclized resin it is required to have excellent chemical resistance of the obtained cured product.
- the present invention relates to a resin composition for obtaining a cured product having excellent chemical resistance, a cured product obtained by curing the resin composition, a laminate containing the cured product, a method for producing the cured product, and the curing. It is an object of the present invention to provide a semiconductor device including a thing or the above-mentioned laminate.
- the resin has a side chain containing a polymerizable group and has a side chain.
- the main chain of the resin and the polymerizable group are bonded via a linking group.
- the linking group contains a urea bond, Resin composition.
- R p1 represents a group containing at least one polymerizable group
- RN independently represents a hydrogen atom or a hydrocarbon group
- L 1 represents a divalent linking group.
- the structure in which the resin has a polymerizable group includes a structure represented by the following formula (1-2).
- R p2 represents a group containing at least one polymerizable group
- RN independently represents a hydrogen atom or a hydrocarbon group
- L 2 represents a divalent linking group
- the resin is a polyimide precursor containing a repeating unit represented by the following formula (2), a polyimide containing a repeating unit represented by the following formula (4), and a repeating unit represented by the following formula (3).
- Polybenzoxazole precursor containing, a polybenzoxazole containing a repeating unit represented by the following formula (x), a polyamide-imide precursor represented by the following formula (PAI-2), and a formula (PAI-3).
- the resin composition according to ⁇ 3> which is at least one resin selected from the group consisting of polyamide-imide containing a repeating unit represented.
- a 1 and A 2 independently represent an oxygen atom or -NH-
- R 111 represents a divalent organic group
- R 115 represents a tetravalent organic group
- R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group
- the formula (1-2) is given to at least one selected from the group consisting of R 111 , R 113 , R 114 and R 115 .
- R 131 represents a divalent organic group
- R 132 represents a tetravalent organic group
- at least one of R 132 and R 131 is represented by the above formula (1-2).
- R 121 represents a divalent organic group
- R 122 represents a tetravalent organic group
- R 123 and R 124 each independently represent a hydrogen atom or a monovalent organic group.
- at least one selected from the group consisting of R 121 , R 122 , R 123 and R 124 includes the structure represented by the above formula (1-2);
- R 133 represents a divalent organic group
- R 134 represents a tetravalent organic group
- at least one of R 134 and R 133 is represented by the above formula (1-2).
- R 117 represents a trivalent organic group
- R 111 represents a divalent organic group
- a 2 represents an oxygen atom or -NH-
- R 113 represents a hydrogen atom or monovalent.
- At least one selected from the group consisting of R 111 , R 113 and R 117 contains the structure represented by the above formula (1-2);
- R 117 represents a trivalent organic group
- R 111 represents a divalent organic group
- at least one of R 111 and R 117 is represented by the above formula (1-2).
- the resin is at least one resin selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, and polyamideimide precursor.
- ⁇ 7> The resin composition according to any one of ⁇ 1> to ⁇ 6>, wherein the acid value of the resin is 0 mmol / g to 1.2 mmol / g.
- ⁇ 8> The resin composition according to any one of ⁇ 1> to ⁇ 7>, further comprising a polymerizable compound.
- ⁇ 9> The resin composition according to any one of ⁇ 1> to ⁇ 8>, further comprising a base generator.
- ⁇ 10> The resin composition according to any one of ⁇ 1> to ⁇ 9>, which is used for forming an interlayer insulating film for a rewiring layer.
- ⁇ 11> A cured product obtained by curing the resin composition according to any one of ⁇ 1> to ⁇ 10>.
- ⁇ 12> A laminated body containing two or more layers made of the cured product according to ⁇ 11> and containing a metal layer between any of the layers made of the cured product.
- ⁇ 13> A method for producing a cured product, which comprises a film forming step of applying the resin composition according to any one of ⁇ 1> to ⁇ 10> onto a substrate to form a film.
- ⁇ 14> The method for producing a cured product according to ⁇ 13>, which comprises an exposure step of selectively exposing the film and a developing step of developing the film with a developer to form a pattern.
- a semiconductor device comprising the cured product according to ⁇ 11> or the laminate according to ⁇ 12>.
- a resin composition for obtaining a cured product having excellent chemical resistance, a cured product obtained by curing the resin composition, a laminate containing the cured product, a method for producing the cured product, and a method for producing the cured product is provided.
- the present invention is not limited to the specified embodiments.
- the numerical range represented by the symbol "-" means a range including the numerical values before and after "-" as the lower limit value and the upper limit value, respectively.
- the term "process” means not only an independent process but also a process that cannot be clearly distinguished from other processes as long as the intended action of the process can be achieved.
- the notation not describing substitution and non-substitution includes a group having a substituent (atomic group) as well as a group having no substituent (atomic group).
- the "alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
- exposure includes not only exposure using light but also exposure using particle beams such as electron beams and ion beams, unless otherwise specified. Examples of the light used for exposure include the emission line spectrum of a mercury lamp, far ultraviolet rays typified by an excimer laser, extreme ultraviolet rays (EUV light), X-rays, active rays such as electron beams, or radiation.
- (meth) acrylate means both “acrylate” and “methacrylate”, or either
- (meth) acrylic means both “acrylic” and “methacrylic", or.
- Any, and “(meth) acryloyl” means both “acryloyl” and “methacrylic”, or either.
- Me in the structural formula represents a methyl group
- Et represents an ethyl group
- Bu represents a butyl group
- Ph represents a phenyl group.
- the total solid content means the total mass of all the components of the composition excluding the solvent.
- the solid content concentration is the mass percentage of other components excluding the solvent with respect to the total mass of the composition.
- the weight average molecular weight (Mw) and the number average molecular weight (Mn) are values measured by gel permeation chromatography (GPC) method and are defined as polystyrene-equivalent values unless otherwise specified.
- GPC gel permeation chromatography
- the weight average molecular weight (Mw) and the number average molecular weight (Mn) for example, HLC-8220GPC (manufactured by Tosoh Corporation) is used, and guard columns HZ-L, TSKgel Super HZM-M, and TSKgel are used as columns. It can be obtained by connecting and using Super HZ4000, TSKgel Super HZ3000, and TSKgel Super HZ2000 (all manufactured by Tosoh Corporation) in series.
- the molecular weights shall be measured using THF (tetrahydrofuran) as an eluent.
- NMP N-methyl-2-pyrrolidone
- the detection in the GPC measurement shall be performed by using a detector having a wavelength of 254 nm of UV rays (ultraviolet rays).
- UV rays ultraviolet rays
- a third layer or element may be further interposed between the reference layer and the other layer, and the reference layer and the other layer need not be in contact with each other.
- the direction in which the layers are stacked on the base material is referred to as "upper", or if there is a resin composition layer, the direction from the base material to the resin composition layer is referred to as "upper”. And the opposite direction is called "down". It should be noted that such a vertical setting is for convenience in the present specification, and in an actual embodiment, the "up" direction in the present specification may be different from the vertical upward direction.
- the composition may contain, as each component contained in the composition, two or more kinds of compounds corresponding to the component.
- the content of each component in the composition means the total content of all the compounds corresponding to the component.
- the temperature is 23 ° C.
- the atmospheric pressure is 101,325 Pa (1 atmospheric pressure)
- the relative humidity is 50% RH.
- a combination of preferred embodiments is a more preferred embodiment.
- first aspect of the resin composition contains a cyclization resin or a resin which is a precursor thereof, and a polymerization initiator, and the above-mentioned resin is used. It has a side chain containing a polymerizable group, the main chain of the resin and the polymerizable group are bonded via a linking group, and the linking group contains a urea bond.
- second aspect of the resin composition includes a cyclized resin or a resin which is a precursor thereof, and a polymerization initiator, and is described above.
- the structure in which the resin has a polymerizable group includes a structure represented by the following formula (1-2).
- R p2 represents a group containing at least one polymerizable group
- RN independently represents a hydrogen atom or a hydrocarbon group
- L 2 represents a divalent linking group. Represents a binding site with another structure.
- the resin composition of the present invention is preferably used for forming a photosensitive film to be subjected to exposure and development, and may be used for exposure and formation of a film to be subjected to development using a developing solution containing an organic solvent.
- the resin composition of the present invention can be used, for example, for forming an insulating film for a semiconductor device, an interlayer insulating film for a rewiring layer, a stress buffer film, and the like, and can be used for forming an interlayer insulating film for a rewiring layer.
- the resin composition of the present invention is preferably used for forming a photosensitive film to be subjected to negative type development.
- negative-type development refers to development in which a non-exposed portion is removed by development in exposure and development
- positive-type development refers to development in which an exposed portion is removed by development.
- the exposure method, the developer, and the developing method include, for example, the exposure method described in the exposure step in the description of the method for producing a cured product described later, the developer and the developing method described in the developing step. Is used.
- the cyclized resin or the resin which is a precursor thereof used in the first aspect of the resin composition has a side chain containing a polymerizable group, and the main chain of the resin and the polymerizable group are interposed via a linking group.
- the linking group contains a urea bond.
- the cyclized resin or the resin which is a precursor thereof used in the second aspect of the resin composition includes a structure represented by the formula (1-2) as a structure having a polymerizable group.
- the cured product In the cured product, an interaction such as formation of a hydrogen bond between the urea bond and the cyclized resin obtained from the cyclized resin or the precursor occurs, and the urea bond is ringed by the polymerization of the polymerizable group. It is considered to be incorporated into a chemical resin or another resin formed by polymerization. Therefore, it is considered that the cyclized resin or other resin is prevented from being dissolved and dispersed in the chemicals such as the organic solvent, and the chemical resistance is improved. Since the cured product has excellent chemical resistance, for example, when a resin composition containing a solvent is further applied and cured on the cured product made of the resin composition of the present invention, the cured product is produced.
- a polar solvent such as dimethyl sulfoxide (DMSO) or N-methylpyrrolidone (NMP)
- an alkaline aqueous solution such as a tetramethylammonium hydroxide (TMAH) aqueous solution
- TMAH tetramethylammonium hydroxide
- the compound portion having the urea bond (for example, the desorbed side chain) is less likely to volatilize by heating during curing, and thus the cured product. It is considered that the contraction of urea is also suppressed.
- the cyclized resin used in the present invention or a resin which is a precursor thereof includes a side chain containing a urea bond as a linking group or a structure represented by the formula (1-2). This side chain or the structure represented by the formula (1-2) has a larger formula amount than the structure such as a methacrylate ethyl group generally used when introducing a polymerizable group into a resin.
- the resin composition of the present invention is also excellent in filterability, for example, the filtration time in filter filtration can be shortened. Further, since the resin used in the present invention contains the above-mentioned side chain or the structure represented by the formula (1-2), the molecular weight of the resin is higher than that of the conventional resin having a structure such as a methacrylate ethyl group. It is considered that the proportion of polymerizable groups is low.
- Patent Documents 1 and 2 do not describe either the resin used in the first aspect of the resin composition or the resin used in the second aspect of the resin composition.
- the resin composition of the present invention contains a resin (also referred to as "specific resin") that satisfies at least one of the following (A) or (B).
- a resin also referred to as "specific resin”
- a cyclized resin and a resin as a precursor thereof wherein the resin has a side chain containing a polymerizable group, and the main chain of the resin and the polymerizable group are bonded via a linking group.
- the linking group contains a urea bond.
- the resin satisfying the above (A) is also referred to as a "first specific resin” when it is desired to describe only the resin containing the above-mentioned resin composition in the first aspect (hereinafter, only the resin satisfying the above (A)). .).
- the resin satisfying the above (B) is a resin contained in the second aspect of the above resin composition (hereinafter, when only the resin satisfying the above (B) is desired to be described, it is also referred to as a “second specific resin”). Is.
- the resin composition of the present invention may satisfy both the above (A) and (B). Further, in the present invention, the main chain represents a relatively longest bound chain in the resin molecule, and the side chain represents a bound chain other than the main chain contained in the resin molecule.
- the cyclized resin is preferably a resin containing an imide ring structure or an oxazole ring structure in the main chain structure.
- the cyclization resin include polyimide, polybenzoxazole, and polyamideimide.
- the precursor of the cyclized resin refers to a resin that changes its chemical structure due to an external stimulus and becomes a cyclized resin, and a resin that changes its chemical structure due to heat and becomes a cyclized resin is preferable, and a ring closure reaction occurs due to heat. A resin that becomes a cyclized resin by forming a ring structure is more preferable.
- the precursor of the cyclization resin include a polyimide precursor, a polybenzoxazole precursor, a polyamide-imide precursor and the like.
- the resin composition of the present invention is at least one selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, and polyamideimide precursor as the specific resin. It is preferable to contain a resin (specific resin).
- the resin composition of the present invention preferably contains polyimide or a polyimide precursor as the specific resin.
- RN independently represents a hydrogen atom or a hydrocarbon group, and a hydrogen atom, an alkyl group or an aryl group is more preferable, a hydrogen atom or an alkyl group is further preferable, and a hydrogen atom is particularly preferable.
- the side chain in the first specific resin may contain two or more urea bonds, but an embodiment in which the side chain contains only one urea bond is also one of the preferred embodiments of the present invention.
- Polymerizable group contained in the specific resin (in the case of the first specific resin, the polymerizable group contained in the side chain, in the case of the second specific resin, the polymerizable group contained in the above formula (1-2)).
- Examples thereof include known polymerizable groups such as a radically polymerizable group, an epoxy group, an oxetanyl group, a methylol group, and an alkoxymethyl group, and a radically polymerizable group is preferable.
- a group having an ethylenically unsaturated bond is preferable.
- Examples of the group having an ethylenically unsaturated bond include a group having a vinyl group which may be substituted and directly bonded to an aromatic ring such as a vinyl group, an allyl group and a vinylphenyl group, a (meth) acrylamide group and a (meth) group. Examples thereof include an acryloyloxy group, and a (meth) acryloyloxy group is preferable.
- the specific resin preferably contains a radically polymerizable group.
- the resin composition preferably contains a photoradical polymerization initiator described below as a photopolymerization initiator, and also contains a photoradical polymerization initiator described below as a photopolymerization initiator. It is more preferable to include the radical cross-linking agent described below, and it is further preferable to contain the photo-radical polymerization initiator described below as the photopolymerization initiator, the radical cross-linking agent described below, and the sensitizer described below. From such a resin composition, for example, a negative photosensitive layer is formed.
- the number of atoms (linking chain length) between the urea bond and the polymerizable group is not particularly limited, but is preferably 30 or less, more preferably 2 to 20, and further preferably 2 to 10. preferable.
- the side chain contains 2 or more urea bonds, 2 or more polymerizable groups, or 2 or more urea bonds and 2 or more polymerizable groups, the atom between the urea bond and the polymerizable group
- the smallest number (linkage chain length) may be within the above range.
- the number of atoms (linking chain length) between a urea bond and a polymerizable group refers to the atomic chains on the path connecting between two atoms or a group of atoms to be linked.
- the one that connects the objects to be connected in the shortest time minimum number of atoms.
- the number of atoms (linkage chain length) between the urea bond and the polymerizable group (methacryloyloxy group) is 2.
- the acid value of the specific resin is preferably 0 mmol / g to 1.2 mmol / g, more preferably 0 mmol / g to 0.8 mmol / g, and 0 mmol / g to 0 mmol / g. It is more preferably 0.6 mmol / g.
- the acid value of the specific resin is measured by the following method. Dissolve 0.3 g of the specific resin in 80 mL of N-methylpyrrolidone (NMP) and add 5 mL of water to prepare a solution of the specific resin.
- the first specific resin has a side chain containing a polymerizable group, the main chain of the resin and the polymerizable group are bonded via a linking group, and the linking group contains a urea bond.
- the number of polymerizable groups contained in one side chain is not particularly limited, but is preferably 1 to 10, more preferably 1 to 4, and 1 or 2. Is more preferable.
- the structure is a combination of at least two selected from the group consisting of 2- and -NR N- .
- RN is as described above.
- the hydrocarbon group a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a group represented by a combination thereof is preferable.
- the saturated aliphatic hydrocarbon group a saturated aliphatic hydrocarbon group having 1 to 30 carbon atoms is preferable, a saturated aliphatic hydrocarbon group having 1 to 20 carbon atoms is more preferable, and a saturated aliphatic hydrocarbon group having 1 to 10 carbon atoms is more preferable. Hydrocarbon groups are more preferred.
- an aromatic hydrocarbon group having 6 to 30 carbon atoms is preferable, an aromatic hydrocarbon group having 6 to 20 carbon atoms is more preferable, and two or more hydrogen atoms are removed from the benzene ring structure.
- Groups are more preferred.
- both ends of the urea bond are preferably bonded to a carbon atom, both ends of the urea bond are more preferably bonded to a hydrocarbon group, and one of the ends of the urea bond is bonded to an aromatic hydrocarbon group.
- the other is bonded to a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a group represented by a combination thereof.
- the preferred carbon number of the saturated aliphatic hydrocarbon group or the aromatic hydrocarbon group is as described above.
- the side chain of the first specific resin preferably has a structure represented by the following formula (1-1).
- R p1 represents a group containing at least one polymerizable group
- RN independently represents a hydrogen atom or a hydrocarbon group
- L 1 represents a divalent linking group. * Represents the binding site with the main chain.
- the preferred embodiment of RN is as described above.
- R p1 the number of polymerizable groups in R p1 is preferably 1 to 10, more preferably 1 to 4, and even more preferably 1 or 2.
- the preferred embodiment of the polymerizable group in R p1 is the same as the preferred embodiment of the polymerizable group in the above-mentioned specific resin.
- R p1 is a group represented by the following formula (RP-1).
- L RP1 represents a single bond or m + 1 valent linking group
- X RP1 represents a polymerizable group
- m represents an integer of 1 or more
- * represents an integer of 1 or more
- * represents an integer of 1 or more.
- a group to which at least one group selected from the group is bonded is more preferable.
- RN is as described above.
- the structure adjacent to * which is a binding site with a urea bond, is preferably a hydrocarbon group.
- a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a group represented by a combination thereof is preferable, and a saturated aliphatic hydrocarbon group having 1 to 30 carbon atoms and carbon are preferable.
- An aromatic hydrocarbon group having 6 to 30 or a group represented by a combination thereof is more preferable, a saturated aliphatic hydrocarbon group having 1 to 10 carbon atoms, and a group obtained by removing 2 or more hydrogen atoms from the benzene ring. , Or a group represented by these bonds is more preferable.
- the alkylene group preferably has 2 to 20 carbon atoms, more preferably 2 to 10 carbon atoms.
- the carbon number of each of the two alkylene groups contained in the alkyleneoxyalkylene group is preferably 2 to 20, more preferably 2 to 10, respectively.
- alkylene group in the polyalkyleneoxy group an alkylene group having 2 to 10 carbon atoms is preferable, an alkylene group having 2 to 4 carbon atoms is more preferable, and an ethylene group or a propylene group is more preferable.
- the alkylene groups in the polyalkylene oxy group may be the same or different.
- the number of repetitions of the polyalkyleneoxy group is preferably 2 to 30, more preferably 2 to 10.
- the group containing the polyalkyleneoxyalkylene group is preferably a polyalkyleneoxyalkylene group.
- the preferred embodiment of the alkylene group bonded to the polyalkyleneoxy group is the same as the preferred embodiment of the alkylene group contained in the above-mentioned alkyleneoxyalkylene group.
- the polyalkylene ester structure is not particularly limited, and examples thereof include a polyalkylene ester structure.
- the preferred embodiment of the alkylene group contained in the polyalkylene ester structure is the same as the preferred embodiment of the alkylene group contained in the above-mentioned alkyleneoxyalkylene group.
- X RP1 is the same as the preferred embodiment of the polymerizable group in the above-mentioned specific resin.
- m is preferably an integer of 1 to 10, more preferably an integer of 1 to 4, further preferably 1 or 2, and particularly preferably 1. ..
- a group to which at least one group selected from the group is bonded is more preferable.
- RN is as described above.
- the hydrocarbon group in L1 a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a group represented by a combination thereof is preferable, and a saturated aliphatic hydrocarbon group having 1 to 30 carbon atoms and carbon are preferable.
- An aromatic hydrocarbon group having 6 to 30 or a group represented by a combination thereof is more preferable, a saturated aliphatic hydrocarbon group having 1 to 10 carbon atoms, and a group obtained by removing 2 or more hydrogen atoms from the benzene ring.
- the group is represented by these bonds.
- the bonding site with the urea bond in L1 is preferably a hydrocarbon group, which is aromatic.
- the first specific resin preferably contains 1 to 100 side chains per molecule of the resin, more preferably 1 to 50, and further contains 1 to 30 side chains. Is even more preferable.
- the second specific resin contains a structure represented by the following formula (1-2) as a structure having a polymerizable group.
- R p2 represents a group containing at least one polymerizable group
- RN independently represents a hydrogen atom or a hydrocarbon group
- L 2 represents a divalent linking group, *. Represents a binding site with another structure.
- the preferred embodiment of RN is as described above.
- R p2 and L 2 in the formula (1-2) are the same as the preferred embodiments of R p1 and L 1 in the formula (1-1), respectively.
- the description "* represents a binding site with the main chain” and "* represents a binding site with another structure.” It shall be read as ".
- the specific example of the structure represented by the equation (1-2) is the same as the specific example of the structure represented by the equation (1-1).
- the description "* represents a binding site with the main chain” is "* represents a binding site with another structure.” It shall be read as.
- the second specific resin preferably contains 1 to 100 structures represented by the formula (1-2) per molecule of the resin, and preferably contains 1 to 50. It is more preferable to contain 1 to 30 pieces. Further, from the viewpoint of chemical resistance, an embodiment including three or more structures represented by the formula (1-2) is also one of the preferred embodiments of the present invention.
- the polyimide precursor used in the present invention is not particularly specified, such as its type, but preferably contains a repeating unit represented by the following formula (2).
- a 1 and A 2 independently represent an oxygen atom or -NH-
- R 111 represents a divalent organic group
- R 115 represents a tetravalent organic group
- R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group.
- the polyimide precursor used in the present invention is represented by the side chain in the first specific resin or the formula (1-2) in the second specific resin in the repeating unit represented by the above formula (2). It is preferable to include a structure such as That is, the second specific resin is at least one selected from the group consisting of R 111 , R 113 , R 114 and R 115 in the repeating unit represented by the formula (2), according to the formula (1-2). It is preferable to include the structure represented by. Specifically, it is preferable to satisfy at least one of the following (1A) to (1C), more preferably to satisfy at least one of (1A) and (1B), and further to satisfy at least (1A). preferable.
- At least one of the structure containing R 113 and the structure containing R 114 in the above formula (2) is a side chain in the first specific resin, or the formula (1-2) in the second specific resin. It is a structure represented by.
- R 111 contains a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin
- R 115 contains a side chain in the first specific resin. Or, the structure represented by the formula (1-2) in the second specific resin is included.
- a 1 and A 2 in the formula (2) independently represent an oxygen atom or —NH—, and an oxygen atom is preferable.
- R 111 in the formula (2) represents a divalent organic group.
- the divalent organic group include a linear or branched aliphatic group, a cyclic aliphatic group and a group containing an aromatic group, and a linear or branched aliphatic group having 2 to 20 carbon atoms and a carbon number of carbon atoms are exemplified.
- a cyclic aliphatic group having 3 to 20, an aromatic group having 3 to 20 carbon atoms, or a group consisting of a combination thereof is preferable, and a group containing an aromatic group having 6 to 20 carbon atoms is more preferable.
- the hydrocarbon group in the chain may be substituted with a group containing a hetero atom, and in the cyclic aliphatic group and the aromatic group, the hydrocarbon group of the ring member is a hetero atom. It may be substituted with a group containing.
- Preferred embodiments of the present invention are exemplified by the groups represented by -Ar- and -Ar-L-Ar-, and particularly preferably the groups represented by -Ar-L-Ar-.
- Ar is an aromatic group independently
- L is an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be replaced with a single bond or a fluorine atom, —O—, —CO. -, -S-, -SO 2- or -NHCO-, or a group consisting of a combination of two or more of the above.
- R 111 is preferably derived from diamine.
- the diamine used for producing the polyimide precursor include linear or branched aliphatic, cyclic aliphatic or aromatic diamines. Only one kind of diamine may be used, or two or more kinds of diamines may be used. Specifically, a linear or branched aliphatic group having 2 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 3 to 20 carbon atoms, or a group consisting of a combination thereof. It is preferably a diamine containing, and more preferably a diamine containing an aromatic group having 6 to 20 carbon atoms.
- the hydrocarbon group in the chain may be substituted with a group containing a hetero atom, and in the cyclic aliphatic group and the aromatic group, the hydrocarbon group of the ring member is a hetero atom. It may be substituted with a containing group.
- groups containing aromatic groups include:
- * represents a binding site with another structure.
- diamine examples include 1,2-diaminoethane, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane or 1,6-diaminohexane; 1,2- or 1 , 3-Diaminocyclopentane, 1,2-, 1,3- or 1,4-diaminocyclohexane, 1,2-,1,3- or 1,4-bis (aminomethyl) cyclohexane, bis- (4-) Aminocyclohexyl) methane, bis- (3-aminocyclohexyl) methane, 4,4'-diamino-3,3'-dimethylcyclohexylmethane or isophoronediamine; m- or p-phenylenediamine, diaminotoluene, 4,4'- Or 3,3'-diaminobiphenyl, 4,4'-diaminodiphenyl;
- diamines (DA-1) to (DA-18) described in paragraphs 0030 to 0031 of International Publication No. 2017/038598 are also preferable.
- a diamine having two or more alkylene glycol units in the main chain described in paragraphs 0032 to 0034 of International Publication No. 2017/038598 is also preferably used.
- R 111 is preferably represented by ⁇ Ar—L—Ar— from the viewpoint of the flexibility of the obtained organic film.
- Ar is an aromatic group independently
- L is an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, —O—, —CO—, —S—. , -SO 2- or -NHCO-, or a group consisting of a combination of two or more of the above.
- Ar is preferably a phenylene group
- L is preferably an aliphatic hydrocarbon group having 1 or 2 carbon atoms which may be substituted with a fluorine atom, —O—, —CO—, —S— or —SO2- . ..
- the aliphatic hydrocarbon group here is preferably an alkylene group.
- R 111 is preferably a divalent organic group represented by the following formula (51) or formula (61).
- a divalent organic group represented by the formula (61) is more preferable.
- Equation (51) In formula (51), R 50 to R 57 are each independently a hydrogen atom, a fluorine atom or a monovalent organic group, and at least one of R 50 to R 57 is a fluorine atom, a methyl group or a trifluoro. It is a methyl group, and each of * independently represents a bonding site with a nitrogen atom in the formula (2).
- the monovalent organic group of R 50 to R 57 includes an unsubstituted alkyl group having 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms) and 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms). Examples thereof include an alkyl fluoride group.
- R 58 and R 59 are each independently a fluorine atom, a methyl group, or a trifluoromethyl group, and * is an independent binding site with a nitrogen atom in formula (2). show.
- Examples of the diamine giving the structure of the formula (51) or (61) include 2,2'-dimethylbenzidine, 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl, and 2,2'-bis. (Fluoro) -4,4'-diaminobiphenyl, 4,4'-diaminooctafluorobiphenyl and the like can be mentioned. These may be used alone or in combination of two or more.
- R 111 may have a structure including the above-mentioned side chain or the above-mentioned structure represented by the formula (1-2).
- the preferred embodiment of the side chain or the structure represented by the above formula (1-2) is as described above.
- R 111 may have a structure derived from the above-mentioned side chain or a diamine compound having a structure represented by the above-mentioned formula (1-2).
- R 111 contains the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2)
- R 111 contains an aromatic hydrocarbon group and the above-mentioned side chain or the above-mentioned formula (1). It is preferable to include a structure directly connected to the structure represented by -2).
- the aromatic hydrocarbon group is not particularly limited, but a benzene ring structure is preferable.
- R 111 when R 111 includes the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2), it is preferable that R 111 has a structure represented by the following formula (LD-1).
- LD-1 Y D1 represents an n + divalent organic group
- P D1 represents the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2)
- n is 1 or more.
- * represents the binding site with the nitrogen atom to which R 111 in Eq. (2) is bonded.
- Y D1 is preferably an n + divalent organic group, and more preferably an n + divalent organic group containing an aromatic hydrocarbon group.
- the aromatic hydrocarbon group in Y D1 is preferably an aromatic hydrocarbon group having 6 to 30 carbon atoms, more preferably an aromatic hydrocarbon group having 6 to 20 carbon atoms, and 2 or more from the benzene ring. It is more preferable that the group has the hydrogen atom removed from the group, and it is particularly preferable that the group has 3 or more hydrogen atoms removed from the benzene ring.
- the one directly bonded to the binding site with * which is the two binding sites described in the formula (LD-1) in Y D1 , may be an aromatic hydrocarbon group. preferable. That is, it is preferable that the two * described in the formula (LD- 1 ) are directly bonded to the aromatic hydrocarbon ring structure contained in Y1. Further, in the formula (LD-1), it is preferable that the binding site with P D1 in Y D1 is an aromatic hydrocarbon group. That is, it is preferable that P D1 is directly bonded to the aromatic hydrocarbon ring structure contained in Y D1 .
- Y D1 contains at least one structure selected from the group consisting of the structures represented by the following formulas (A2-1) to (A2-5), and the above-mentioned formulas (A2-1) to (A2-1) to It is more preferable that the structure is at least one selected from the group consisting of the structures represented by the formula (A2-5).
- RA211 to RA214 , RA221 to RA224 , RA231 to RA238 , RA241 to RA248 and RA251 to RA258 are independently hydrogen atoms.
- One, at least one of RA231 to RA238 , at least one of RA241 to RA248 , and at least one of RA251 to RA258 are the above-mentioned side chains or the above-mentioned formula (1-).
- the structure may be represented by 2), and * represents a bonding site with another structure independently.
- Y 1 preferably contains a structure represented by any of the formulas (A2-1) to (A2-4), and is preferably the formula (A2-1) or the formula (A2-1). It is more preferable to include the structure represented by any one of A2-4).
- RA211 to RA214 are not the bonding sites with PD1, RA211 to RA214 are independently hydrogen atoms, alkyl groups having 1 to 6 carbon atoms, and carbon atoms 3 to 12 respectively.
- a cyclic alkyl group an alkoxy group having 1 to 6 carbon atoms, a hydroxy group, a cyano group, an alkyl halide group having 1 to 3 carbon atoms, or a halogen atom.
- Atoms, alkyl groups having 1 to 6 carbon atoms, alkoxy groups having 1 to 6 carbon atoms, and alkyl halide groups having 1 to 3 carbon atoms are more preferable, and hydrogen atoms or alkyl groups having 1 to 6 carbon atoms are more preferable.
- halogen atom in the halogenated alkyl group in RA211 to RA214 or the halogen atom examples include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a chlorine atom or a bromine atom is preferable.
- RA221 to RA224 have the same meaning as RA211 to RA214 in the formula (A2-1), and the preferred embodiments are also the same.
- RA231 to RA238 are independently hydrogen atoms, an alkyl group having 1 to 6 carbon atoms, a cyclic alkyl group having 3 to 12 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, and hydroxy. It is preferable to represent a group, a cyano group, an alkyl halide group having 1 to 3 carbon atoms, or a halogen atom, and from the viewpoint of solvent solubility, a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and 1 to 1 carbon atom.
- An alkoxy group of 6 or an alkyl halide group having 1 to 3 carbon atoms is more preferable, and a hydrogen atom or an alkyl group having 1 to 6 carbon atoms is more preferable.
- Examples of the halogen atom in the halogenated alkyl group in RA231 to RA238 or the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a chlorine atom or a bromine atom is preferable.
- LA231 is a single bond, a divalent saturated hydrocarbon group having 1 to 6 carbon atoms, a divalent unsaturated hydrocarbon group having 5 to 24 carbon atoms, —O—, —S. -, -NR N- , a heterocyclic group, or a halogenated alkylene group having 1 to 6 carbon atoms is preferable, and a single bond, a saturated hydrocarbon group having 1 to 6 carbon atoms, -O- or a heterocyclic group. Is preferable, and it is more preferable to represent a single bond or —O—.
- the RN represents a hydrogen atom or a hydrocarbon group, and a hydrogen atom, an alkyl group or an aryl group is more preferable, a hydrogen atom or an alkyl group is further preferable, and a hydrogen atom is particularly preferable.
- the divalent unsaturated hydrocarbon group may be a divalent aliphatic unsaturated hydrocarbon group or a divalent aromatic hydrocarbon group, but may be a divalent aromatic hydrocarbon. It is preferably a group.
- heterocyclic group for example, a group obtained by removing two hydrogen atoms from an aliphatic or aromatic heterocycle is preferable, a group obtained by removing two hydrogen atoms from an aliphatic or aromatic heterocycle is preferable, and a pyrrolidine ring, More preferably, a group obtained by removing two hydrogen atoms from a ring structure such as a tetrahydrofuran ring, a tetrahydrothiophene ring, a pyrrole ring, a furan ring, a thiophene ring, a piperidine ring, a tetrahydropyran ring, a pyridine ring or a morpholine ring is preferable.
- a ring structure such as a tetrahydrofuran ring, a tetrahydrothiophene ring, a pyrrole ring, a furan ring, a thiophene ring, a pipe
- heterocycles may further form a fused ring with another heterocycle or a hydrocarbon ring.
- the number of ring members of the heterocycle is preferably 5 to 10, and more preferably 5 or 6.
- the heteroatom in the heterocyclic group is preferably an oxygen atom, a nitrogen atom, or a sulfur atom.
- Examples of the halogen atom in the halogenated alkylene group include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a chlorine atom or a bromine atom is preferable.
- RA241 to RA248 and LA241 have the same meanings as RA231 to RA238 and LA231 in the formula (A2-3), and the preferred embodiments are also the same.
- RA251 to RA258 have the same meaning as RA211 to RA214 in the formula (A2-1), and the preferred embodiments are also the same.
- At least one of RA211 to RA214 is a binding site with PD1 in the formula (LD-1), and one of RA211 to RA214 is the above P. It is more preferable that it is a binding site with D1 , and it is preferable that RA213 is a binding site with PD1 .
- at least one of RA221 to RA224 is a binding site with PD1 in the formula (LD-1), and one of RA221 to RA224 is the above P. It is more preferable that it is a binding site with D1 , and it is preferable that RA223 is a binding site with PD1 .
- RA231 to RA238 is a binding site with PD1 in the formula (LD-1), and two of RA231 to RA238 are described above. It is more preferable that it is a binding site with P D1 , and it is further preferable that a total of two of RA231 to RA234 and one of RA235 to RA238 are binding sites for PD1 . It is particularly preferable that two of A231 and RA238 are the binding sites for PD1 .
- RA241 to RA248 is a binding site for PD1 in the formula (LD-1), and two of RA241 to RA248 are described above. It is more preferable that it is a binding site with P D1 , and it is further preferable that a total of two of RA241 to RA244 and one of RA245 to RA248 are binding sites for P D1 . It is particularly preferable that two of A241 and RA248 are the binding sites for P D1 .
- RA251 to RA258 is a binding site for PD1 in formula (LD-1), and two of RA251 to RA258 are described above. It is more preferable that it is a binding site with P D1 , and it is further preferable that a total of two of RA251 to RA254 and one of RA255 to RA258 are binding sites for P D1 . It is particularly preferable that two of A253 and RA257 are the binding sites for PD1 .
- the two * are the * in the formula (LD-1), respectively. That is, it is preferable that the two nitrogen atoms to which R 111 in the formula (2) is bonded are directly bonded to the positions represented by the two * in the formulas (A2-1) to (A2-5).
- Y D1 is preferably a group represented by the following formula (Y-1) or (Y-2).
- RY11 , RY12 , and RY13 are synonymous with RA211 , RA212 , and RA214 in the formula (A2-1), respectively, and the preferred embodiments are also the same.
- RY21 to RY26 are synonymous with RA242 to RA247 in the formula (A2-4), respectively, and the preferred embodiments are also the same.
- * is the binding site with the two nitrogen atoms to which R 111 in the formula (2) is bonded
- # is the formula (LD-1), respectively. The binding sites with PD1 in the inside are shown respectively.
- PD1 represents the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2).
- the preferred embodiment of the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2) is the above-mentioned side chain, or the preferred embodiment of the structure represented by the above-mentioned formula (1-2) is the above-mentioned. It's a street.
- n represents an integer of 1 or more, preferably 1 to 10, more preferably 1 to 4, further preferably 1 or 2, and particularly preferably 1.
- LD-1 The structure represented by the above formula (LD-1) can be obtained, for example, as a structure derived from a diamine represented by the following formula (LDA-1).
- LDA-1 a structure derived from a diamine represented by the following formula (LDA-1).
- Y D1 , P D1 , and n are synonymous with Y D1 , P D1 , and n in the above formula (LD-1), respectively, and the preferred embodiments are also the same.
- R 115 in the formula (2) represents a tetravalent organic group.
- a tetravalent organic group containing an aromatic ring is preferable, and a group represented by the following formula (5) or formula (6) is more preferable.
- * independently represents a binding site with another structure.
- R 112 is a single-bonded or divalent linking group, which may be substituted with a single-bonded or fluorine atom, an aliphatic hydrocarbon group having 1 to 10 carbon atoms, —O—, -CO-, -S-, -SO 2- , and -NHCO-, and a group selected from a combination thereof are preferable, and a single bond may be substituted with a fluorine atom having 1 to 1 to carbon atoms.
- it is a group selected from 3 alkylene groups, -O-, -CO-, -S- and -SO 2- , and -CH 2- , -C (CF 3 ) 2- , -C ( CH 3 ) It is more preferably a divalent group selected from the group consisting of 2-, -O-, -CO-, -S- and -SO 2- .
- R 115 include tetracarboxylic acid residues remaining after removal of the anhydride group from the tetracarboxylic acid dianhydride.
- the polyimide precursor may contain only one type of tetracarboxylic acid dianhydride residue or two or more types as a structure corresponding to R 115 .
- the tetracarboxylic acid dianhydride is preferably represented by the following formula (O).
- R 115 represents a tetravalent organic group.
- the preferred range of R 115 is synonymous with R 115 in the formula (2), and the preferred range is also the same.
- tetracarboxylic acid dianhydride examples include pyromellitic acid dianhydride (PMDA), 3,3', 4,4'-biphenyltetracarboxylic acid dianhydride, 3,3', 4,4'-.
- PMDA pyromellitic acid dianhydride
- 3,3', 4,4'-biphenyltetracarboxylic acid dianhydride 3,3', 4,4'-.
- tetracarboxylic acid dianhydrides (DAA-1) to (DAA-5) described in paragraph 0038 of International Publication No. 2017/038598 are also mentioned as preferable examples.
- R 115 contains the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2), it is preferable that R 115 contains the above-mentioned structure represented by the above-mentioned formula (LD-1). ..
- the preferred embodiment of the structure represented by the formula (LD-1) is as described above.
- R 111 and R 115 has an OH group. More specifically, as R 111 , a residue of a bisaminophenol derivative can be mentioned.
- R 113 and R 114 in the formula (2) independently represent a hydrogen atom or a monovalent organic group, respectively.
- the monovalent organic group preferably contains a linear or branched alkyl group, a cyclic alkyl group, an aromatic group, or a polyalkyleneoxy group.
- at least one of R 113 and R 114 contains a polymerizable group, and it is more preferable that both contain a polymerizable group.
- at least one of R 113 and R 114 contains two or more polymerizable groups.
- the polymerizable group a radically polymerizable group is preferable because it is a group capable of undergoing a cross-linking reaction by the action of heat, radicals and the like.
- the polymerizable group examples include a group having an ethylenically unsaturated bond, an alkoxymethyl group, a hydroxymethyl group, an acyloxymethyl group, an epoxy group, an oxetanyl group, a benzoxazolyl group, a blocked isocyanate group and an amino group. Be done.
- a group having an ethylenically unsaturated bond is preferable.
- Examples of the group having an ethylenically unsaturated bond include a vinyl group, an allyl group, an isoallyl group, a 2-methylallyl group, a group having an aromatic ring directly bonded to the vinyl group (for example, a vinylphenyl group), and a (meth) acrylamide group.
- R200 represents a hydrogen atom, a methyl group, an ethyl group or a methylol group, and a hydrogen atom or a methyl group is preferable.
- * represents a binding site with another structure.
- R 201 represents an alkylene group having 2 to 12 carbon atoms, —CH 2 CH (OH) CH 2- , a cycloalkylene group or a polyalkyleneoxy group.
- R 201 examples include alkylene groups such as ethylene group, propylene group, trimethylene group, tetramethylene group, pentamethylene group, hexamethylene group, octamethylene group and dodecamethylene group, 1,2-butanjiyl group, 1, 3-Butanjiyl group, -CH 2 CH (OH) CH 2- , polyalkyleneoxy group, alkylene group such as ethylene group, propylene group, -CH 2 CH (OH) CH 2- , cyclohexyl group, polyalkylene An oxy group is more preferable, and an alkylene group such as an ethylene group and a propylene group, or a polyalkylene oxy group is further preferable.
- alkylene groups such as ethylene group, propylene group, trimethylene group, tetramethylene group, pentamethylene group, hexamethylene group, octamethylene group and dodecamethylene group, 1,2-butanjiyl group, 1, 3-Butanjiyl group,
- the polyalkyleneoxy group refers to a group to which two or more alkyleneoxy groups are directly bonded.
- the alkylene group in the plurality of alkyleneoxy groups contained in the polyalkyleneoxy group may be the same or different.
- the sequence of the alkyleneoxy groups in the polyalkyleneoxy group may be a random sequence or a sequence having a block. It may be an array having a pattern such as alternating.
- the carbon number of the alkylene group (including the carbon number of the substituent when the alkylene group has a substituent) is preferably 2 or more, more preferably 2 to 10, and 2 to 6.
- the alkylene group may have a substituent.
- Preferred substituents include alkyl groups, aryl groups, halogen atoms and the like.
- the number of alkyleneoxy groups contained in the polyalkyleneoxy group is preferably 2 to 20, more preferably 2 to 10, and even more preferably 2 to 6.
- the polyalkyleneoxy group includes a polyethyleneoxy group, a polypropyleneoxy group, a polytrimethylethyleneoxy group, a polytetramethyleneoxy group, or a plurality of ethyleneoxy groups and a plurality of propylenes from the viewpoint of solvent solubility and solvent resistance.
- a group bonded to an oxy group is preferable, a polyethyleneoxy group or a polypropyleneoxy group is more preferable, and a polyethyleneoxy group is further preferable.
- the ethyleneoxy groups and the propyleneoxy groups may be randomly arranged or may be arranged by forming a block. , Alternate or the like may be arranged in a pattern. The preferred embodiment of the number of repetitions of the ethyleneoxy group and the like in these groups is as described above.
- R 113 is a hydrogen atom or R 114 is a hydrogen atom
- R 113 is a hydrogen atom
- R 114 is a hydrogen atom
- the polyimide precursor forms a salt with a tertiary amine compound having an ethylenically unsaturated bond.
- the tertiary amine compound having such an ethylenically unsaturated bond include N, N-dimethylaminopropyl methacrylate.
- the polyimide precursor has a fluorine atom in its structure.
- the fluorine atom content in the polyimide precursor is preferably 10% by mass or more, and preferably 20% by mass or less.
- the polyimide precursor may be copolymerized with an aliphatic group having a siloxane structure.
- the diamine an embodiment using bis (3-aminopropyl) tetramethyldisiloxane, bis (p-aminophenyl) octamethylpentasiloxane, or the like can be mentioned.
- the repeating unit represented by the formula (2) is preferably a repeating unit represented by the formula (2-A). That is, it is preferable that at least one of the polyimide precursors used in the present invention is a precursor having a repeating unit represented by the formula (2-A). By including the repeating unit represented by the formula (2-A) in the polyimide precursor, it becomes possible to further widen the width of the exposure latitude. Equation (2-A) In formula (2-A), A 1 and A 2 represent oxygen atoms, R 111 and R 112 each independently represent a divalent organic group, and R 113 and R 114 each independently. Representing a hydrogen atom or a monovalent organic group, at least one of R 113 and R 114 is a group containing a polymerizable group, and it is preferable that both are groups containing a polymerizable group.
- a 1 , A 2 , R 111 , R 113 , and R 114 are independently synonymous with A 1 , A 2 , R 111 , R 113 , and R 114 in the formula (2), and the preferred ranges are also the same. .. R 112 has the same meaning as R 112 in the formula (5), and the preferred range is also the same.
- the polyimide precursor may contain one kind of repeating unit represented by the formula (2), but may contain two or more kinds. Further, it may contain a structural isomer of a repeating unit represented by the formula (2). Needless to say, the polyimide precursor may contain other types of repeating units in addition to the repeating units of the above formula (2).
- the content of the repeating unit represented by the formula (2) is 50 mol% or more of all the repeating units.
- the total content is more preferably 70 mol% or more, further preferably 90 mol% or more, and particularly preferably more than 90 mol%.
- the upper limit of the total content is not particularly limited, and all the repeating units in the polyimide precursor except the terminal may be the repeating unit represented by the formula (2).
- the weight average molecular weight (Mw) of the polyimide precursor is preferably 5,000 to 100,000, more preferably 10,000 to 50,000, and even more preferably 15,000 to 40,000.
- the number average molecular weight (Mn) is preferably 2,000 to 40,000, more preferably 3,000 to 30,000, and even more preferably 4,000 to 20,000.
- the degree of dispersion of the molecular weight of the polyimide precursor is preferably 1.5 or more, more preferably 1.8 or more, and further preferably 2.0 or more.
- the upper limit of the dispersity of the molecular weight of the polyimide precursor is not particularly determined, but for example, it is preferably 7.0 or less, more preferably 6.5 or less, still more preferably 6.0 or less.
- the degree of molecular weight dispersion is a value calculated by weight average molecular weight / number average molecular weight.
- the resin composition contains a plurality of types of polyimide precursors as the specific resin, it is preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion of at least one type of polyimide precursor are in the above range. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of types of polyimide precursors as one resin are within the above ranges.
- the polyimide used in the present invention may be an alkali-soluble polyimide or a polyimide that is soluble in a developing solution containing an organic solvent as a main component.
- the alkali-soluble polyimide means a polyimide that dissolves 0.1 g or more at 23 ° C. in 100 g of a 2.38 mass% tetramethylammonium aqueous solution, and 0.5 g or more from the viewpoint of pattern formability.
- a polyimide that dissolves is preferable, and a polyimide that dissolves 1.0 g or more is more preferable.
- the upper limit of the dissolution amount is not particularly limited, but is preferably 100 g or less.
- the polyimide is preferably a polyimide having a plurality of imide structures in the main chain from the viewpoint of the film strength and the insulating property of the obtained organic film.
- the polyimide has a fluorine atom.
- the fluorine atom is preferably contained in, for example, R 132 in the repeating unit represented by the formula (4) described later, or R 131 in the repeating unit represented by the formula (4) described later, and is preferably contained in the formula (4) described later. It is more preferable that it is contained as an alkyl fluoride group in R 132 in the repeating unit represented by 4) or in R 131 in the repeating unit represented by the formula (4) described later.
- the amount of fluorine atoms with respect to the total mass of the polyimide is preferably 5% by mass or more, and preferably 20% by mass or less.
- the polyimide has a silicon atom.
- the silicon atom is preferably contained in R 131 in the repeating unit represented by the formula (4) described later, and is organically modified (poly) in R 131 in the repeating unit represented by the formula (4) described later. ) It is more preferable that it is contained as a siloxane structure. Further, the silicon atom or the organically modified (poly) siloxane structure may be contained in the side chain of the polyimide, but is preferably contained in the main chain of the polyimide.
- the amount of silicon atoms with respect to the total mass of the polyimide is preferably 1% by mass or more, more preferably 20% by mass or less.
- the polyimide preferably has an ethylenically unsaturated bond.
- the polyimide may have an ethylenically unsaturated bond at the end of the main chain or at the side chain, but it is preferable to have it at the side chain.
- the ethylenically unsaturated bond is preferably radically polymerizable.
- the ethylenically unsaturated bond is preferably contained in R 132 in the repeating unit represented by the formula (4) described later or R 131 in the repeating unit represented by the formula (4) described later, and is preferably contained in the formula described later.
- R 132 in the repeating unit represented by (4) or R 131 in the repeating unit represented by the formula (4) described later is contained as a group having an ethylenically unsaturated bond.
- the ethylenically unsaturated bond is preferably contained in R 131 in the repeating unit represented by the formula (4) described later, and ethylene is contained in R 131 in the repeating unit represented by the formula (4) described later. It is more preferably contained as a group having a sex unsaturated bond.
- Examples of the group having an ethylenically unsaturated bond include a group having a vinyl group which may be substituted and directly bonded to an aromatic ring such as a vinyl group, an allyl group and a vinylphenyl group, a (meth) acrylamide group and a (meth) group. Examples thereof include an acryloyloxy group and a group represented by the following formula (IV).
- R20 represents a hydrogen atom, a methyl group, an ethyl group or a methylol group, and a hydrogen atom or a methyl group is preferable.
- (Poly) alkyleneoxy group having 2 to 30 carbon atoms the alkylene group preferably has 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, particularly preferably 2 or 3; the number of repetitions is preferably 1 to 12 and 1). ⁇ 6 is more preferable, and 1 to 3 are particularly preferable), or a group in which two or more of these are combined is represented.
- the alkylene group having 2 to 12 carbon atoms may be a linear group, a branched chain, a cyclic group, or an alkylene group represented by a combination thereof.
- an alkylene group having 2 to 12 carbon atoms an alkylene group having 2 to 8 carbon atoms is preferable, and an alkylene group having 2 to 4 carbon atoms is more preferable.
- R 21 is preferably a group represented by any of the following formulas (R1) to (R3), and more preferably a group represented by the formula (R1).
- L represents a single bond, an alkylene group having 2 to 12 carbon atoms, a (poly) alkyleneoxy group having 2 to 30 carbon atoms, or a group in which two or more of these are bonded
- X Indicates an oxygen atom or a sulfur atom
- * represents a bond site with another structure
- ⁇ represents a bond site with an oxygen atom to which R 21 in the formula (IV) is bonded.
- a preferred embodiment of the alkylene group having 2 to 12 carbon atoms in L or the (poly) alkyleneoxy group having 2 to 30 carbon atoms is the above-mentioned R 21 having 2 to 12 carbon atoms. This is the same as the preferred embodiment of the alkylene group of 12 or the (poly) alkyleneoxy group having 2 to 30 carbon atoms.
- X is preferably an oxygen atom.
- * is synonymous with * in the formula (IV), and the preferred embodiment is also the same.
- the structure represented by the formula (R1) comprises, for example, a polyimide having a hydroxy group such as a phenolic hydroxy group and a compound having an isocyanato group and an ethylenically unsaturated bond (for example, 2-isocyanatoethyl methacrylate). Obtained by reacting.
- the structure represented by the formula (R2) is obtained, for example, by reacting a polyimide having a carboxy group with a compound having a hydroxy group and an ethylenically unsaturated bond (for example, 2-hydroxyethyl methacrylate, etc.).
- the structure represented by the formula (R3) is formed by reacting, for example, a polyimide having a hydroxy group such as a phenolic hydroxy group with a compound having a glycidyl group and an ethylenically unsaturated bond (for example, glycidyl methacrylate). can get.
- * represents a binding site with another structure, and is preferably a binding site with the main chain of polyimide.
- the amount of the ethylenically unsaturated bond with respect to the total mass of the polyimide is preferably 0.0001 to 0.1 mol / g, more preferably 0.0005 to 0.05 mol / g.
- the polyimide may have a polymerizable group other than the group having an ethylenically unsaturated bond.
- examples of the polymerizable group other than the group having an ethylenically unsaturated bond include a cyclic ether group such as an epoxy group and an oxetanyl group, an alkoxymethyl group such as a methoxymethyl group, and a methylol group. It is preferable that the polymerizable group other than the group having an ethylenically unsaturated bond is contained in R 131 in the repeating unit represented by the formula (4) described later, for example.
- the amount of the polymerizable group other than the group having an ethylenically unsaturated bond with respect to the total mass of the polyimide is preferably 0.0001 to 0.1 mol / g, and preferably 0.001 to 0.05 mol / g. More preferred.
- the acid value of the polyimide is preferably 30 mgKOH / g or more, more preferably 50 mgKOH / g or more, and 70 mgKOH / g or more from the viewpoint of improving developability. Is more preferable.
- the acid value is preferably 500 mgKOH / g or less, more preferably 400 mgKOH / g or less, and even more preferably 200 mgKOH / g or less.
- the acid value of the polyimide is preferably 1 to 35 mgKOH / g, and 2 to 30 mgKOH. / G is more preferable, and 5 to 20 mgKOH / g is even more preferable.
- the acid value of the polyimide is preferably 0 mmol / g to 1.2 mmol / g, more preferably 0 mmol / g to 0.8 mmol / g, and 0 mmol / g to 0. It is more preferably 0.6 mmol / g.
- an acid group having a pKa of 0 to 10 is preferable, and an acid group having a pKa of 3 to 8 is more preferable, from the viewpoint of achieving both storage stability and developability.
- the pKa is a dissociation reaction in which hydrogen ions are released from an acid, and its equilibrium constant Ka is expressed by its negative common logarithm pKa.
- pKa is a value calculated by ACD / ChemSketch (registered trademark) unless otherwise specified.
- the values published in "Revised 5th Edition Chemistry Handbook Basics" edited by the Chemical Society of Japan may be referred to.
- the acid group is a polyvalent acid such as phosphoric acid
- the above pKa is the first dissociation constant.
- the polyimide preferably contains at least one selected from the group consisting of a carboxy group and a phenolic hydroxy group, and more preferably contains a phenolic hydroxy group.
- the polyimide preferably has a phenolic hydroxy group.
- the polyimide may have a phenolic hydroxy group at the end of the main chain or at the side chain.
- the phenolic hydroxy group is preferably contained in, for example, R 132 in the repeating unit represented by the formula (4) described later or R 131 in the repeating unit represented by the formula (4) described later.
- the amount of the phenolic hydroxy group with respect to the total mass of the polyimide is preferably 0.1 to 30 mol / g, and more preferably 1 to 20 mol / g.
- the polyimide used in the present invention is not particularly limited as long as it is a polymer compound having an imide structure, but preferably contains a repeating unit represented by the following formula (4).
- R 131 represents a divalent organic group and R 132 represents a tetravalent organic group.
- the polyimide used in the present invention has a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin in the repeating unit represented by the above formula (4).
- at least one of R 132 and R 131 in the above formula (4) has a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin. It is more preferable that R 131 contains a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin.
- the polymerizable group is selected. It may be located at at least one of R 131 and R 132 , or may be located at the end of the polyimide as shown in the following formula (4-1) or formula (4-2). Equation (4-1) In formula (4-1), R 133 is a polymerizable group, and the other groups are synonymous with formula (4). Equation (4-2) At least one of R 134 and R 135 is a polymerizable group, when it is not a polymerizable group, it is an organic group, and the other group is synonymous with the formula (4).
- Examples of the polymerizable group include a group containing the above-mentioned ethylenically unsaturated bond and a crosslinkable group other than the above-mentioned group having an ethylenically unsaturated bond.
- R 131 represents a divalent organic group.
- the divalent organic group the same group as R 111 in the formula (2) is exemplified, and the preferable range is also the same.
- examples of R 131 include diamine residues remaining after removal of the amino group of diamine.
- Examples of the diamine include aliphatic, cyclic aliphatic or aromatic diamines. Specific examples include the example of R 111 in the formula (2) of the polyimide precursor.
- R 131 is a diamine residue having at least two alkylene glycol units in the main chain from the viewpoint of more effectively suppressing the generation of warpage during firing. More preferably, it is a diamine residue containing two or more of one or both of an ethylene glycol chain and a propylene glycol chain in one molecule, and more preferably, the above diamine, which does not contain an aromatic ring. Is.
- Diamines containing two or more ethylene glycol chains, propylene glycol chains, or both in one molecule include Jeffamine® KH-511, ED-600, ED-900, ED-2003, and EDR. -148, EDR-176, D-200, D-400, D-2000, D-4000 (trade name, manufactured by HUNTSMAN Co., Ltd.), 1- (2- (2- (2-aminopropoxy) ethoxy) Examples thereof include, but are not limited to, propoxy) propane-2-amine and 1- (1- (1- (2-aminopropoxy) propan-2-yl) oxy) propane-2-amine.
- R 132 represents a tetravalent organic group.
- the tetravalent organic group the same group as R 115 in the formula (2) is exemplified, and the preferable range is also the same.
- examples of R 132 include tetracarboxylic acid residues remaining after removal of the anhydride group from the tetracarboxylic acid dianhydride. Specific examples include the example of R 115 in the formula (2) of the polyimide precursor. From the viewpoint of the strength of the organic film, R 132 is preferably an aromatic diamine residue having 1 to 4 aromatic rings.
- R 131 and R 132 It is also preferable to have an OH group in at least one of R 131 and R 132 . More specifically, as R 131 , 2,2-bis (3-hydroxy-4-aminophenyl) propane, 2,2-bis (3-hydroxy-4-aminophenyl) hexafluoropropane, 2,2- Bis (3-amino-4-hydroxyphenyl) propane, 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, and the above (DA-1) to (DA-18) are preferred examples. As R 132 , the above-mentioned (DAA-1) to (DAA-5) are more preferable examples.
- the polyimide has a fluorine atom in its structure.
- the content of fluorine atoms in the polyimide is preferably 10% by mass or more, and more preferably 20% by mass or less.
- the polyimide may be copolymerized with an aliphatic group having a siloxane structure.
- the diamine component include bis (3-aminopropyl) tetramethyldisiloxane and bis (p-aminophenyl) octamethylpentasiloxane.
- the main chain end of the polyimide is sealed with an end-sealing agent such as monoamine, acid anhydride, monocarboxylic acid, monoacid chloride compound, and monoactive ester compound. It is preferable to have. Of these, it is more preferable to use monoamine, and preferred compounds of monoamine include aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 5-amino-8-hydroxyquinoline, and 1-hydroxy-7.
- an end-sealing agent such as monoamine, acid anhydride, monocarboxylic acid, monoacid chloride compound, and monoactive ester compound. It is preferable to have. Of these, it is more preferable to use monoamine, and preferred compounds of monoamine include aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 5-amino-8-hydroxyquinoline, and 1-hydroxy-7.
- the imidization rate (also referred to as "ring closure rate") of the polyimide is preferably 70% or more, more preferably 80% or more, from the viewpoint of the film strength, the insulating property, etc. of the obtained organic film. More preferably, it is 90% or more.
- the upper limit of the imidization rate is not particularly limited and may be 100% or less.
- the imidization rate is measured, for example, by the following method. The infrared absorption spectrum of the polyimide is measured to determine the peak intensity P1 near 1377 cm -1 , which is the absorption peak derived from the imide structure. Next, the polyimide is heat-treated at 350 ° C.
- the polyimide may contain a repeating unit represented by the above formula (4), all containing one type of R 131 or R 132 , and the above formula including two or more different types of R 131 or R 132 . It may include the repeat unit represented by 4). Further, the polyimide may contain other types of repeating units in addition to the repeating unit represented by the above formula (4). Examples of the other type of repeating unit include the repeating unit represented by the above-mentioned equation (2).
- the polyimide is, for example, a method of reacting a tetracarboxylic acid dianhydride with a diamine (partially replaced with a terminal encapsulant which is a monoamine) at a low temperature, or a tetracarboxylic acid dianhydride (partly an acid anhydride) at a low temperature.
- a method such as a method of reacting with a terminal encapsulant) is used to obtain a polyimide precursor, which is completely imidized using a known imidization reaction method, or an imidization reaction in the middle. It can be synthesized by using the method of introducing a partially imidized structure, and further, by blending the completely imidized polymer with the polyimide precursor thereof, the method of introducing a partially imidized structure is used. .. Further, other known polyimide synthesis methods can also be applied.
- the weight average molecular weight (Mw) of the polyimide is preferably 5,000 to 100,000, more preferably 10,000 to 50,000, and even more preferably 15,000 to 40,000. By setting the weight average molecular weight to 5,000 or more, the breakage resistance of the film after curing can be improved. In order to obtain an organic film having excellent mechanical properties (for example, elongation at break), the weight average molecular weight is particularly preferably 15,000 or more.
- the number average molecular weight (Mn) of the polyimide is preferably 2,000 to 40,000, more preferably 3,000 to 30,000, and further preferably 4,000 to 20,000.
- the degree of dispersion of the molecular weight of the polyimide is preferably 1.5 or more, more preferably 1.8 or more, and further preferably 2.0 or more.
- the upper limit of the dispersity of the molecular weight of the polyimide is not particularly determined, but for example, it is preferably 7.0 or less, more preferably 6.5 or less, still more preferably 6.0 or less.
- the weight average molecular weight, the number average molecular weight, and the degree of dispersion of at least one type of polyimide are in the above range. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of types of polyimides as one resin are each within the above ranges.
- the polybenzoxazole precursor used in the present invention is not particularly defined for its structure and the like, but preferably contains a repeating unit represented by the following formula (3).
- R 121 represents a divalent organic group
- R 122 represents a tetravalent organic group
- R 123 and R 124 each independently represent a hydrogen atom or a monovalent organic group. show.
- the polybenzoxazole precursor used in the present invention has a side chain in the first specific resin or a formula (1-2) in the second specific resin in the repeating unit represented by the above formula (3). It preferably contains the structure represented.
- the second specific resin is added to at least one selected from the group consisting of R 121 , R 122 , R 123 and R 124 in the repeating unit represented by the formula (3) in the formula (1-2). It is preferable to include the structure represented by. Specifically, it is preferable to satisfy at least one of the following (2A) to (2C), more preferably to satisfy at least one of (2A) and (2B), and further to satisfy at least (2A). preferable.
- (2A) At least one of the structure containing R 123 and the structure containing R 124 in the above formula (3) is a side chain in the first specific resin, or the formula (1-2) in the second specific resin. It is a structure represented by.
- R 121 contains a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin (2C)
- R 122 contains a side chain in the first specific resin.
- the structure represented by the formula (1-2) in the second specific resin is included.
- R 123 and R 124 are synonymous with R 113 in the formula (2), respectively, and the preferable range is also the same.
- at least one of —OR 123 and —OR 124 in the formula (3) is a side chain in the first specific resin or a second specific resin. It is preferable that the structure is represented by the formula (1-2) in.
- R 121 represents a divalent organic group.
- the divalent organic group a group containing at least one of an aliphatic group and an aromatic group is preferable.
- the aliphatic group a linear aliphatic group is preferable.
- R 121 is preferably a dicarboxylic acid residue. Only one type of dicarboxylic acid residue may be used, or two or more types may be used.
- a dicarboxylic acid residue a dicarboxylic acid containing an aliphatic group and a dicarboxylic acid residue containing an aromatic group are preferable, and a dicarboxylic acid residue containing an aromatic group is more preferable.
- a dicarboxylic acid containing an aliphatic group a dicarboxylic acid containing a linear or branched (preferably straight chain) aliphatic group is preferable, and a linear or branched (preferably straight chain) aliphatic group and two -COOH are preferable.
- a dicarboxylic acid consisting of is more preferable.
- the number of carbon atoms of the linear or branched (preferably linear) aliphatic group is preferably 2 to 30, more preferably 2 to 25, still more preferably 3 to 20, and 4 to 20. It is more preferably 15, and particularly preferably 5 to 10.
- the linear aliphatic group is preferably an alkylene group.
- dicarboxylic acid containing a linear aliphatic group examples include malonic acid, dimethylmalonic acid, ethylmalonic acid, isopropylmalonic acid, di-n-butylmalonic acid, succinic acid, tetrafluorosuccinic acid, methylsuccinic acid, 2, 2-dimethylsuccinic acid, 2,3-dimethylsuccinic acid, dimethylmethylsuccinic acid, glutaric acid, hexafluoroglutaric acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylglutaric acid, 3,3-Didimethylglutaric acid, 3-ethyl-3-methylglutaric acid, adipic acid, octafluoroadipic acid, 3-methyladipic acid, pimelic acid, 2,2,6,6-tetramethylpimeric acid, sverin Acid, dodecafluorosveric acid, azelaic acid, sebacic acid, s
- Z is a hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 1 to 6).
- dicarboxylic acid containing an aromatic group a dicarboxylic acid having the following aromatic groups is preferable, and a dicarboxylic acid consisting of only a group having the following aromatic groups and two -COOH is more preferable.
- A is -CH 2- , -O-, -S-, -SO 2- , -CO-, -NHCO-, -C (CF 3 ) 2- , and -C (CH 3 ) 2- It represents a divalent group selected from the group consisting of, and * represents a binding site with another structure independently.
- dicarboxylic acid containing an aromatic group examples include 4,4'-carbonyldibenzoic acid, 4,4'-dicarboxydiphenyl ether, and terephthalic acid.
- R 121 may have a structure including the above-mentioned side chain or the above-mentioned structure represented by the formula (1-2).
- the preferred embodiment of the side chain or the structure represented by the above formula (1-2) is as described above.
- R 121 may have a structure derived from the above-mentioned side chain or a dicarboxylic acid compound having a structure represented by the above-mentioned formula (1-2).
- R 121 contains the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2)
- R 121 comprises an aromatic hydrocarbon group and the above-mentioned side chain or the above-mentioned formula (1). It is preferable to include a structure directly connected to the structure represented by -2).
- R 121 contains the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2), it is preferable that R 121 has the above-mentioned structure represented by the above-mentioned formula (LD-1). ..
- LD-1 the description that "* represents the binding site with the nitrogen atom to which R 11 binds in the formula (2), respectively.” Is described as "* represents the binding site, respectively.” 3) Represents the binding site with the carbonyl group to which R 121 is bound.
- R 122 represents a tetravalent organic group.
- the tetravalent organic group has the same meaning as R 115 in the above formula (2), and the preferable range is also the same.
- R 122 is also preferably a group derived from a bisaminophenol derivative, and examples of the group derived from a bisaminophenol derivative include, for example, 3,3'-diamino-4,4'-dihydroxybiphenyl, 4,4'.
- bisaminophenol derivatives having the following aromatic groups are preferable.
- X 1 represents -O-, -S-, -C (CF 3 ) 2- , -CH 2- , -SO 2- , -NHCO-, and * and # represent other structures, respectively.
- R represents a hydrogen atom or a monovalent substituent, preferably a hydrogen atom or a hydrocarbon group, and more preferably a hydrogen atom or an alkyl group. Further, it is also preferable that R 122 has a structure represented by the above formula.
- any two of the four * and # in total are the bonding sites with the nitrogen atom to which R 122 in the formula (3) is bonded, and The other two are preferably the bonding sites with the oxygen atom to which R 122 in the formula (3) is bonded, and the two * are the bonding sites with the oxygen atom to which the R 122 in the formula (3) is bonded.
- two # are the bonding sites with the nitrogen atom to which R 122 in the formula (3) is bonded, or two * are the bonding sites with the nitrogen atom to which R 122 in the formula (3) is bonded.
- the site is a site and the two #s are the bonding sites with the oxygen atom to which the R 122 in the formula (3) is bonded, and the two * are the oxygen to which the R 122 in the formula (3) is bonded. It is more preferable that it is a bond site with an atom and the two #s are bond sites with a nitrogen atom to which R 122 in the formula (3) is bonded.
- the bisaminophenol derivative is also preferably a compound represented by the formula (As).
- R 1 is a hydrogen atom, an alkylene, a substituted alkylene, -O-, -S-, -SO 2- , -CO-, -NHCO-, a single bond, or the following formula (A-). It is an organic group selected from the group of sc).
- R 2 is any one of a hydrogen atom, an alkyl group, an alkoxy group, an acyloxy group, and a cyclic alkyl group, and may be the same or different.
- R 3 is any of a hydrogen atom, a linear or branched alkyl group, an alkoxy group, an acyloxy group, and a cyclic alkyl group, and may be the same or different.
- R3 having a substituent at the ortho position of the phenolic hydroxy group , that is, R3 is considered to bring the distance between the carbonyl carbon of the amide bond and the hydroxy group closer, and at a low temperature. It is particularly preferable in that the effect of increasing the cyclization rate when cured is further enhanced.
- R 2 is an alkyl group and R 3 is an alkyl group has high transparency to i-rays and a high cyclization rate when cured at a low temperature. The effect can be maintained, which is preferable.
- R 1 is an alkylene or a substituted alkylene.
- the alkylene and the substituted alkylene according to R 1 include linear or branched alkyl groups having 1 to 8 carbon atoms, among which -CH 2- and -CH (CH 3 ).
- -, -C (CH 3 ) 2 has sufficient solubility in a solvent while maintaining the effects of high transparency to i-rays and high cyclization rate when cured at low temperature. It is more preferable in that an excellent polybenzoxazole precursor can be obtained.
- the polybenzoxazole precursor may contain other types of repeating units in addition to the repeating units of the above formula (3).
- the polybenzoxazole precursor preferably contains a diamine residue represented by the following formula (SL) as another type of repeating unit in that the generation of warpage associated with ring closure can be suppressed.
- Z has an a structure and a b structure
- R 1s is a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms
- R 2s is a hydrocarbon group having 1 to 10 carbon atoms.
- at least one of R 3s , R 4s , R 5s , and R 6s is an aromatic group
- the rest are hydrogen atoms or organic groups having 1 to 30 carbon atoms, which may be the same or different.
- the polymerization of the a structure and the b structure may be block polymerization or random polymerization.
- the mol% of the Z portion is 5 to 95 mol% for the a structure, 95 to 5 mol% for the b structure, and 100 mol% for a + b.
- preferred Z includes those in which R 5s and R 6s in the b structure are phenyl groups.
- the molecular weight of the structure represented by the formula (SL) is preferably 400 to 4,000, more preferably 500 to 3,000.
- the tetracarboxylic acid residue remaining after removal of the anhydride group from the tetracarboxylic acid dianhydride is further contained as the repeating unit.
- the repeating unit Is also preferable.
- examples of such a tetracarboxylic acid residue include the example of R 115 in the formula (2).
- the weight average molecular weight (Mw) of the polybenzoxazole precursor is, for example, preferably 18,000 to 30,000, more preferably 20,000 to 29,000, still more preferably 22,000 to 28, It is 000.
- the number average molecular weight (Mn) is preferably 7,200 to 14,000, more preferably 8,000 to 12,000, and even more preferably 9,200 to 11,200.
- the degree of dispersion of the molecular weight of the polybenzoxazole precursor is preferably 1.4 or more, more preferably 1.5 or more, still more preferably 1.6 or more.
- the upper limit of the dispersity of the molecular weight of the polybenzoxazole precursor is not particularly determined, but for example, 2.6 or less is preferable, 2.5 or less is more preferable, 2.4 or less is further preferable, and 2.3 or less. Is more preferable, and 2.2 or less is even more preferable.
- the weight average molecular weight, number average molecular weight, and dispersity of at least one type of polybenzoxazole precursor may be within the above ranges. preferable. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of types of polybenzoxazole precursors as one resin are within the above ranges.
- the polybenzoxazole is not particularly limited as long as it is a polymer compound having a benzoxazole ring, but is preferably a compound represented by the following formula (X), and a compound represented by the following formula (X). It is more preferable that the compound has a polymerizable group. As the polymerizable group, a radically polymerizable group is preferable.
- R 133 represents a divalent organic group and R 134 represents a tetravalent organic group.
- the polymerizable group When having a polymerizable group, the polymerizable group may be located at at least one of R 133 and R 134 , and may be polybenzoxazole as shown in the following formula (X-1) or formula (X-2). It may be located at the end of. Equation (X-1) In the formula (X-1), at least one of R 135 and R 136 is a polymerizable group, and if it is not a polymerizable group, it is an organic group, and the other group is synonymous with the formula (X). Equation (X-2) In formula (X-2), R 137 is a polymerizable group, the other is a substituent, and the other group is synonymous with formula (X).
- the polymerizable group is synonymous with the polymerizable group described in the above-mentioned polymerizable group possessed by the polyimide precursor.
- the polybenzoxazole used in the present invention is represented by the side chain in the first specific resin or the formula (1-2) in the second specific resin in the repeating unit represented by the above formula (X). It is preferable that at least one of R 134 and R 133 in the above formula (X) is represented by the side chain in the first specific resin or the formula (1-2) in the second specific resin. It is more preferable that R 133 contains a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin.
- R 133 represents a divalent organic group.
- the divalent organic group include an aliphatic group and an aromatic group.
- Specific examples include the example of R 121 in the formula (3) of the polybenzoxazole precursor. A preferred example thereof is the same as that of R 121 .
- R 134 represents a tetravalent organic group.
- the tetravalent organic group include R 122 in the formula (3) of the polybenzoxazole precursor. A preferred example thereof is the same as that of R 122 .
- four conjugates of a tetravalent organic group exemplified as R 122 combine with a nitrogen atom and an oxygen atom in the above formula (X) to form a fused ring.
- R 134 when R 134 is the following organic group, it forms the following structure.
- * represents a binding site with a nitrogen atom or an oxygen atom in the formula (X), respectively.
- the oxazole formation rate of polybenzoxazole is preferably 85% or more, more preferably 90% or more.
- the upper limit is not particularly limited and may be 100%.
- the oxazole formation rate is measured, for example, by the following method.
- the infrared absorption spectrum of polybenzoxazole is measured to determine the peak intensity Q1 near 1650 cm -1 , which is the absorption peak derived from the amide structure of the precursor. Next, normalize by the absorption intensity of the aromatic ring found near 1490 cm -1 .
- the polybenzoxazole may contain a repeating unit of the above formula (X), all comprising one R 131 or R 132 , and the above formula (X) comprising two or more different types of R 131 or R 132 . ) May be included. Further, the polybenzoxazole may contain other types of repeating units in addition to the repeating units of the above formula (X).
- the polybenzoxazole is obtained by reacting, for example, a bisaminophenol derivative with a dicarboxylic acid containing R133 or a compound selected from the dicarboxylic acid dichloride and the dicarboxylic acid derivative of the above dicarboxylic acid to obtain a polybenzoxazole precursor.
- This can be obtained by oxazole using a known oxazole reaction method.
- an active ester-type dicarboxylic acid derivative that has been previously reacted with 1-hydroxy-1,2,3-benzotriazole or the like may be used in order to increase the reaction yield or the like.
- the weight average molecular weight (Mw) of polybenzoxazole is preferably 5,000 to 70,000, more preferably 8,000 to 50,000, still more preferably 10,000 to 30,000. By setting the weight average molecular weight to 5,000 or more, the breakage resistance of the film after curing can be improved. In order to obtain an organic film having excellent mechanical properties, the weight average molecular weight is particularly preferably 20,000 or more. When two or more kinds of polybenzoxazole are contained, it is preferable that the weight average molecular weight of at least one kind of polybenzoxazole is in the above range.
- the number average molecular weight (Mn) of polybenzoxazole is preferably 7,200 to 14,000, more preferably 8,000 to 12,000, and even more preferably 9,200 to 11,200. be.
- the degree of dispersion of the molecular weight of the polybenzoxazole is preferably 1.4 or more, more preferably 1.5 or more, and further preferably 1.6 or more.
- the upper limit of the dispersity of the molecular weight of polybenzoxazole is not particularly defined, but for example, 2.6 or less is preferable, 2.5 or less is more preferable, 2.4 or less is further preferable, and 2.3 or less is further preferable. Preferably, 2.2 or less is even more preferable.
- the weight average molecular weight, the number average molecular weight, and the dispersity of at least one type of polybenzoxazole are in the above range. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of types of polybenzoxazole as one resin are each within the above ranges.
- the polyamide-imide precursor preferably contains a repeating unit represented by the following formula (PAI-2).
- R 117 represents a trivalent organic group
- R 111 represents a divalent organic group
- a 2 represents an oxygen atom or -NH-
- R 113 represents a hydrogen atom or monovalent. Represents an organic group of.
- the polyamide-imide precursor used in the present invention is a side chain in the first specific resin or the formula (1-2) in the second specific resin in the repeating unit represented by the above formula (PAI-2). It is preferable to include the structure represented by.
- the second specific resin is represented by the formula (1-2) in at least one selected from the group consisting of R 111 , R 113 and R 117 in the repeating unit represented by the formula (2). It is preferable to include a structure. Specifically, it is preferable to satisfy at least one of the following (3A) to (3C), more preferably to satisfy at least one of (3A) and (3B), and further to satisfy at least (3A). preferable. (3A)
- the structure containing R 113 in the above formula (PAI-2) is a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin.
- R 111 contains a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin (3C)
- R 117 contains a side chain in the first specific resin.
- the structure represented by the formula (1-2) in the second specific resin is included.
- R 117 is composed of a linear or branched aliphatic group, a cyclic aliphatic group, and an aromatic group, a heteroarophatic group, or a single bond or a linking group.
- Examples of the above-mentioned linked groups are a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, and a cyclic aliphatic group having 6 to 20 carbon atoms.
- the aromatic group of the above, or a group in which two or more of these are combined by a single bond or a linking group is preferable, and an aromatic group having 6 to 20 carbon atoms or an aromatic group having 6 to 20 carbon atoms by a single bond or a linking group is preferable.
- a group in which two or more of the above are combined is more preferable.
- a group is preferable, and an —O—, —S—, an alkylene group, a halogenated alkylene group, an arylene group, or a linking group in which two or more of these are bonded is more preferable.
- an alkylene group having 1 to 20 carbon atoms is preferable, an alkylene group having 1 to 10 carbon atoms is more preferable, and an alkylene group having 1 to 4 carbon atoms is further preferable.
- halogenated alkylene group a halogenated alkylene group having 1 to 20 carbon atoms is preferable, a halogenated alkylene group having 1 to 10 carbon atoms is more preferable, and a halogenated alkylene group having 1 to 4 carbon atoms is more preferable.
- the halogen atom in the halogenated alkylene group include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a fluorine atom is preferable.
- the halogenated alkylene group may have a hydrogen atom or all of the hydrogen atoms may be substituted with a halogen atom, but it is preferable that all of the hydrogen atoms are substituted with a halogen atom.
- preferred halogenated alkylene groups include (ditrifluoromethyl) methylene groups and the like.
- arylene group a phenylene group or a naphthylene group is preferable, a phenylene group is more preferable, and a 1,3-phenylene group or a 1,4-phenylene group is further preferable.
- R 117 is preferably derived from a tricarboxylic acid compound in which at least one carboxy group may be halogenated. Chlorination is preferable as the halogenation.
- a compound having three carboxy groups is referred to as a tricarboxylic acid compound. Of the three carboxy groups of the tricarboxylic acid compound, two carboxy groups may be acid anhydrideized.
- the halogenated tricarboxylic acid compound used in the production of the polyamide-imide precursor include branched chain aliphatic, cyclic aliphatic or aromatic tricarboxylic acid compounds. Only one kind of these tricarboxylic acid compounds may be used, or two or more kinds may be used.
- the tricarboxylic acid compound includes a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, and a carbon number of carbon atoms.
- a tricarboxylic acid compound containing 6 to 20 aromatic groups or a group in which two or more of these are combined by a single bond or a linking group is preferable, and an aromatic group having 6 to 20 carbon atoms or carbon by a single bond or a linking group is preferable.
- a tricarboxylic acid compound containing a group in which two or more aromatic groups of the number 6 to 20 are combined is more preferable.
- the tricarboxylic acid compound examples include 1,2,3-propanetricarboxylic acid, 1,3,5-pentanetricarboxylic acid, citric acid, trimellitic acid, 2,3,6-naphthalenetricarboxylic acid, and phthalic acid.
- (Or phthalic acid anhydride) and benzoic acid are single-bonded, -O-, -CH 2- , -C (CH 3 ) 2- , -C (CF 3 ) 2- , -SO 2- or a phenylene group. Examples thereof include linked compounds. These compounds may be compounds in which two carboxy groups are anhydrated (eg, trimellitic acid anhydride) or compounds in which at least one carboxy group is halogenated (eg, trimellitic acid anhydride). There may be.
- R 111 , A 2 , and R 113 are synonymous with R 111 , A 2 , and R 113 in the above formula (2), respectively, and the preferred embodiments are also the same.
- the polyamide-imide precursor may further contain other repeating units.
- the other repeating unit include a repeating unit represented by the above formula (2), a repeating unit represented by the following formula (PAI-1), and the like.
- R 116 represents a divalent organic group and R 111 represents a divalent organic group.
- R 116 is a linear or branched aliphatic group, a cyclic aliphatic group, and an aromatic group, a heteroarophatic group, or a single bond or a linking group. Examples of the above-mentioned linked groups are a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, and a cyclic aliphatic group having 6 to 20 carbon atoms.
- the aromatic group of the above, or a group in which two or more of these are combined by a single bond or a linking group is preferable, and an aromatic group having 6 to 20 carbon atoms or an aromatic group having 6 to 20 carbon atoms by a single bond or a linking group is preferable.
- a group in which two or more of the above are combined is more preferable.
- a group is preferable, and an —O—, —S—, an alkylene group, a halogenated alkylene group, an arylene group, or a linking group in which two or more of these are bonded is more preferable.
- an alkylene group having 1 to 20 carbon atoms is preferable, an alkylene group having 1 to 10 carbon atoms is more preferable, and an alkylene group having 1 to 4 carbon atoms is further preferable.
- halogenated alkylene group a halogenated alkylene group having 1 to 20 carbon atoms is preferable, a halogenated alkylene group having 1 to 10 carbon atoms is more preferable, and a halogenated alkylene group having 1 to 4 carbon atoms is more preferable.
- the halogen atom in the halogenated alkylene group include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a fluorine atom is preferable.
- the halogenated alkylene group may have a hydrogen atom or all of the hydrogen atoms may be substituted with a halogen atom, but it is preferable that all of the hydrogen atoms are substituted with a halogen atom.
- preferred halogenated alkylene groups include (ditrifluoromethyl) methylene groups and the like.
- arylene group a phenylene group or a naphthylene group is preferable, a phenylene group is more preferable, and a 1,3-phenylene group or a 1,4-phenylene group is further preferable.
- R 116 is preferably derived from a dicarboxylic acid compound or a dicarboxylic acid dihalide compound.
- a compound having two carboxy groups is referred to as a dicarboxylic acid compound
- a compound having two halogenated carboxy groups is referred to as a dicarboxylic acid dihalide compound.
- the carboxy group in the dicarboxylic acid dihalide compound may be halogenated, but is preferably chlorinated, for example. That is, the dicarboxylic acid dihalide compound is preferably a dicarboxylic acid dichloride compound.
- Examples of the halogenated dicarboxylic acid compound or dicarboxylic acid dihalide compound used in the production of the polyamideimide precursor include linear or branched aliphatic, cyclic aliphatic or aromatic dicarboxylic acid compounds or dicarboxylic acids. Examples include aciddihalide compounds. Only one kind or two or more kinds of these dicarboxylic acid compounds or dicarboxylic acid dihalide compounds may be used.
- the dicarboxylic acid compound or the dicarboxylic acid dihalide compound includes a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, and a cyclic fat having 3 to 20 carbon atoms.
- a dicarboxylic acid compound or a dicarboxylic acid dihalide compound containing a group group, an aromatic group having 6 to 20 carbon atoms, or a group in which two or more of these are combined by a single bond or a linking group is preferable, and an aromatic group having 6 to 20 carbon atoms is preferable.
- a dicarboxylic acid compound or a dicarboxylic acid dihalide compound containing a group in which two or more aromatic groups having 6 to 20 carbon atoms are combined by a single bond or a linking group is more preferable.
- dicarboxylic acid compound examples include malonic acid, dimethylmalonic acid, ethylmalonic acid, isopropylmalonic acid, di-n-butylmalonic acid, succinic acid, tetrafluorosuccinic acid, and methylsuccinic acid, 2,2-.
- R 111 has the same meaning as R 111 in the above formula (2), and the preferred embodiment is also the same.
- the polyamide-imide precursor has a fluorine atom in its structure.
- the fluorine atom content in the polyamide-imide precursor is preferably 10% by mass or more, and preferably 20% by mass or less.
- the polyamide-imide precursor may be copolymerized with an aliphatic group having a siloxane structure.
- the diamine component an embodiment using bis (3-aminopropyl) tetramethyldisiloxane, bis (p-aminophenyl) octamethylpentasiloxane, or the like can be mentioned.
- a repeating unit represented by the formula (PAI-2), a repeating unit represented by the formula (PAI-1), and a repeating unit represented by the formula (2) As one embodiment of the polyamide-imide precursor in the present invention, a repeating unit represented by the formula (PAI-2), a repeating unit represented by the formula (PAI-1), and a repeating unit represented by the formula (2).
- An embodiment in which the total content of the units is 50 mol% or more of all the repeating units can be mentioned.
- the total content is more preferably 70 mol% or more, further preferably 90 mol% or more, and particularly preferably more than 90 mol%.
- the upper limit of the total content is not particularly limited, and all the repeating units in the polyamide-imide precursor except the terminal are represented by the repeating unit represented by the formula (PAI-2) and the formula (PAI-1). It may be either a repeating unit or a repeating unit represented by the formula (2).
- the total content of the repeating unit represented by the formula (PAI-2) and the repeating unit represented by the formula (PAI-1) is.
- An embodiment of 50 mol% or more of all repetition units can be mentioned.
- the total content is more preferably 70 mol% or more, further preferably 90 mol% or more, and particularly preferably more than 90 mol%.
- the upper limit of the total content is not particularly limited, and all the repeating units in the polyamide-imide precursor except the terminal are represented by the repeating unit represented by the formula (PAI-2) or the formula (PAI-1). It may be any of the repeating units to be used.
- the weight average molecular weight (Mw) of the polyamide-imide precursor is preferably 2,000 to 500,000, more preferably 5,000 to 100,000, still more preferably 10,000 to 50,000. ..
- the number average molecular weight (Mn) is preferably 800 to 250,000, more preferably 2,000 to 50,000, and even more preferably 4,000 to 25,000.
- the degree of dispersion of the molecular weight of the polyamide-imide precursor is preferably 1.5 or more, more preferably 1.8 or more, and even more preferably 2.0 or more.
- the upper limit of the dispersity of the molecular weight of the polyamide-imide precursor is not particularly determined, but is preferably 7.0 or less, more preferably 6.5 or less, still more preferably 6.0 or less, for example.
- the weight average molecular weight, number average molecular weight, and dispersity of at least one type of polyamide-imide precursors are preferably in the above range. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of types of polyamide-imide precursors as one resin are within the above ranges.
- the polyamide-imide used in the present invention may be an alkali-soluble polyamide-imide or may be a polyamide-imide soluble in a developer containing an organic solvent as a main component.
- the alkali-soluble polyamide-imide means a polyamide-imide that dissolves 0.1 g or more at 23 ° C. in 100 g of a 2.38 mass% tetramethylammonium aqueous solution, and is 0. It is preferably a polyamide-imide that dissolves 5 g or more, and more preferably a polyamide-imide that dissolves 1.0 g or more.
- the upper limit of the dissolution amount is not particularly limited, but is preferably 100 g or less.
- the polyamide-imide is preferably a polyamide-imide having a plurality of amide bonds and a plurality of imide structures in the main chain from the viewpoint of film strength and insulating property of the obtained organic film.
- the polyamide-imide preferably has a fluorine atom.
- the fluorine atom is preferably contained in, for example, R 117 or R 111 in the repeating unit represented by the formula (PAI-3) described later, and in the repeating unit represented by the formula (PAI-3) described later. It is more preferable that it is contained in R 117 or R 111 as an alkyl fluoride group.
- the amount of fluorine atoms with respect to the total mass of the polyamide-imide is preferably 5% by mass or more, and more preferably 20% by mass or less.
- the polyamide-imide may have an ethylenically unsaturated bond.
- the polyamide-imide may have an ethylenically unsaturated bond at the end of the main chain or at the side chain, but it is preferable to have it at the side chain.
- the ethylenically unsaturated bond is preferably radically polymerizable.
- the ethylenically unsaturated bond is preferably contained in R 117 or R 111 in the repeating unit represented by the formula (PAI-3) described later, and the repeating unit represented by the formula (PAI-3) described later.
- R 117 or R 111 it is more preferable that it is contained as a group having an ethylenically unsaturated bond in R 117 or R 111 in the above.
- the preferred embodiment of the group having an ethylenically unsaturated bond is the same as the preferred embodiment of the group having an ethylenically unsaturated bond in the above-mentioned polyimide.
- the amount of the ethylenically unsaturated bond with respect to the total mass of the polyamide-imide is preferably 0.0001 to 0.1 mol / g, more preferably 0.001 to 0.05 mol / g.
- the polyamide-imide may have a polymerizable group other than the ethylenically unsaturated bond.
- Examples of the polymerizable group other than the ethylenically unsaturated bond in the polyamide-imide include the same groups as the polymerizable group other than the ethylenically unsaturated bond in the above-mentioned polyimide. It is preferable that the polymerizable group other than the ethylenically unsaturated bond is contained in R 111 in the repeating unit represented by the formula (PAI-3) described later, for example.
- the amount of the polymerizable group other than the ethylenically unsaturated bond with respect to the total mass of the polyamide-imide is preferably 0.05 to 10 mol / g, more preferably 0.1 to 5 mol / g.
- the acid value of the polyamide-imide is preferably 30 mgKOH / g or more, more preferably 50 mgKOH / g or more, and 70 mgKOH / g or more, from the viewpoint of improving the developability. It is more preferably g or more.
- the acid value is preferably 500 mgKOH / g or less, more preferably 400 mgKOH / g or less, and even more preferably 200 mgKOH / g or less.
- the acid value of the polyamide-imide is preferably 2 to 35 mgKOH / g. ⁇ 30 mgKOH / g is more preferable, and 5 to 20 mgKOH / g is even more preferable.
- the acid value of the polyamide-imide is preferably 0 mmol / g to 1.2 mmol / g, more preferably 0 mmol / g to 0.8 mmol / g, and 0 mmol / g to 0 mmol / g.
- the acid value is measured by a known method, for example, by the method described in JIS K 0070: 1992. Further, as the acid group contained in the polyamide-imide, the same group as the acid group in the above-mentioned polyimide can be mentioned, and the preferred embodiment is also the same.
- the polyamide-imide preferably has a phenolic hydroxy group.
- the polyamide-imide may have a phenolic hydroxy group at the end of the main chain or at the side chain.
- the phenolic hydroxy group is preferably contained in, for example, R 117 or R 111 in the repeating unit represented by the formula (PAI-3) described later.
- the amount of the phenolic hydroxy group with respect to the total mass of the polyamide-imide is preferably 0.1 to 30 mol / g, more preferably 1 to 20 mol / g.
- the polyamide-imide used in the present invention is not particularly limited as long as it is a polymer compound having an imide structure and an amide bond, but preferably contains a repeating unit represented by the following formula (PAI-3).
- R 111 and R 117 are synonymous with R 111 and R 117 in formula (PAI-2), respectively, and so are preferred embodiments.
- the polyamide-imide used in the present invention is represented by the side chain in the first specific resin or the formula (1-2) in the second specific resin in the repeating unit represented by the above formula (PAI-3). It is preferable that at least one of R 111 and R 117 in the above formula (PAI-3) contains a side chain in the first specific resin or the formula (1-2) in the second specific resin.
- the polymerizable group is selected. It may be located at at least one of R 111 and R 117 , or may be located at the end of the polyamide-imide.
- the main chain end of polyamide-imide is sealed with an end sealant such as monoamine, acid anhydride, monocarboxylic acid, monoacid chloride compound or monoactive ester compound.
- an end sealant such as monoamine, acid anhydride, monocarboxylic acid, monoacid chloride compound or monoactive ester compound.
- the preferred embodiment of the terminal encapsulant is the same as the preferred embodiment of the terminal encapsulant in the above-mentioned polyimide.
- the imidization rate (also referred to as "ring closure rate") of the polyamide-imide is preferably 70% or more, more preferably 80% or more, from the viewpoint of the film strength, the insulating property, etc. of the obtained organic film. , 90% or more is more preferable.
- the upper limit of the imidization rate is not particularly limited and may be 100% or less.
- the imidization rate is measured by the same method as the ring closure rate of the polyimide described above.
- the polyamide-imide may include a repeating unit represented by the above formula (PAI-3), all comprising one R 111 or R 117 , and the above formula comprising two or more different types of R 131 or R 132. It may contain a repeating unit represented by (PAI-3). Further, the polyamide-imide may contain other types of repeating units in addition to the repeating units represented by the above formula (PAI-3). Examples of the other type of repeating unit include the repeating unit represented by the above-mentioned formula (PAI-1) or formula (PAI-2).
- a polyamide-imide precursor is obtained by a known method, and the polyamide-imide precursor is completely imidized by using a known imidization reaction method, or the imidization reaction is stopped in the middle and a partial imide structure is obtained.
- the completely imidized polymer By blending the completely imidized polymer with the polyamide-imide precursor thereof, it can be synthesized by utilizing the method of introducing a partially imidized structure.
- the weight average molecular weight (Mw) of the polyamide-imide is preferably 5,000 to 70,000, more preferably 8,000 to 50,000, still more preferably 10,000 to 30,000. By setting the weight average molecular weight to 5,000 or more, the breakage resistance of the film after curing can be improved. In order to obtain an organic film having excellent mechanical properties, the weight average molecular weight is particularly preferably 20,000 or more.
- the number average molecular weight (Mn) of the polyamide-imide is preferably 800 to 250,000, more preferably 2,000 to 50,000, and even more preferably 4,000 to 25,000. ..
- the dispersity of the molecular weight of the polyamide-imide is preferably 1.5 or more, more preferably 1.8 or more, and even more preferably 2.0 or more.
- the upper limit of the dispersity of the molecular weight of the polyamide-imide is not particularly determined, but for example, it is preferably 7.0 or less, more preferably 6.5 or less, still more preferably 6.0 or less.
- the resin composition contains a plurality of types of polyamide-imides as the specific resin, it is preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion of at least one type of polyamide-imide are in the above ranges. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of kinds of polyamide-imides as one resin are within the above ranges.
- the polyimide precursor and the like can be, for example, a method of reacting a tetracarboxylic acid dianhydride with a diamine at a low temperature, or reacting a tetracarboxylic acid dianhydride with a diamine at a low temperature to obtain a polyamic acid, and a condensing agent or an alkylating agent.
- the remaining dicarboxylic acid can be obtained by acid-halogenizing it with a halogenating agent and reacting it with a diamine.
- a method in which a diester is obtained from tetracarboxylic acid dianhydride and an alcohol, and then the remaining dicarboxylic acid is acid-halogenated with a halogenating agent and reacted with diamine is more preferable.
- Examples of the condensing agent include dicyclohexylcarbodiimide, diisopropylcarbodiimide, 1-ethoxycarbonyl-2-ethoxy-1,2-dihydroquinoline, 1,1-carbonyldioxy-di-1,2,3-benzotriazole, N, Examples thereof include N'-disuccinimidyl carbonate and trifluoroacetic anhydride.
- Examples of the alkylating agent include N, N-dimethylformamide dimethylacetal, N, N-dimethylformamide diethyl acetal, N, N-dialkylformamide dialkyl acetal, trimethyl orthoformate, triethyl orthoformate and the like.
- halogenating agent examples include thionyl chloride, oxalyl chloride, phosphorus oxychloride and the like.
- an organic solvent in the reaction.
- the organic solvent may be one kind or two or more kinds.
- the organic solvent can be appropriately determined depending on the raw material, but is pyridine, diethylene glycol dimethyl ether (diglyme), N-methylpyrrolidone, N-ethylpyrrolidone, ethyl propionate, dimethylacetamide, dimethylformamide, tetrahydrofuran, ⁇ -butyrolactone and the like. Is exemplified.
- the basic compound may be one kind or two or more kinds.
- the basic compound can be appropriately determined depending on the raw material, but triethylamine, diisopropylethylamine, pyridine, 1,8-diazabicyclo [5.4.0] undec-7-ene, N, N-dimethyl-4-amino. Examples thereof include pyridine and the like.
- -End sealant- In the method for producing a polyimide precursor or the like, it is preferable to seal the carboxylic acid anhydride, the acid anhydride derivative, or the amino group remaining at the resin terminal of the polyimide precursor or the like in order to further improve the storage stability.
- examples of the terminal encapsulant include monoalcohol, phenol, thiol, thiophenol, monoamine, etc., and are reactive and stable in the film. From the viewpoint of sex, it is more preferable to use monoalcohol, phenols and monoamine.
- Preferred compounds of monoalcohols include primary alcohols such as methanol, ethanol, propanol, butanol, hexanol, octanol, dodecinol, benzyl alcohol, 2-phenylethanol, 2-methoxyethanol, 2-chloromethanol and flufuryl alcohol, and isopropanol.
- Preferred compounds of phenols include phenols such as phenol, methoxyphenol, methylphenol, naphthalene-1-ol, naphthalene-2-ol and hydroxystyrene.
- Preferred compounds of monoamine include aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 5-amino-8-hydroxyquinoline, 1-hydroxy-7-aminonaphthalene and 1-hydroxy-6-.
- Aminonaphthalene 1-hydroxy-5-aminonaphthalene, 1-hydroxy-4-aminonaphthalene, 2-hydroxy-7-aminonaphthalene, 2-hydroxy-6-aminonaphthalene, 2-hydroxy-5-aminonaphthalene, 1- Carboxy-7-aminonaphthalene, 1-carboxy-6-aminonaphthalene, 1-carboxy-5-aminonaphthalene, 2-carboxy-7-aminonaphthalene, 2-carboxy-6-aminonaphthalene, 2-carboxy-5-amino Naphthalene, 2-aminobenzoic acid, 3-aminobenzoic acid, 4-aminobenzoic acid, 4-aminosalicylic acid, 5-aminosalicylic acid, 6-aminosalicylic acid, 2-aminobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 4 -Aminobenzene sulfonic acid, 3-amino-4,6-di
- encapsulants for amino groups are carboxylic acid anhydrides, carboxylic acid chlorides, carboxylic acid bromides, sulfonic acid chlorides, anhydrous sulfonic acids, sulfonic acid carboxylic acid anhydrides and the like, with carboxylic acid anhydrides and carboxylic acid chlorides being more preferred. preferable.
- Preferred compounds for carboxylic acid anhydrides include acetic anhydride, propionic anhydride, oxalic anhydride, succinic anhydride, maleic anhydride, phthalic anhydride, benzoic anhydride, 5-norbornen-2,3-dicarboxylic acid anhydride and the like.
- Preferred compounds for the carboxylic acid chloride include acetyl chloride, acrylic acid chloride, propionyl chloride, methacrylate chloride, pivaloyl chloride, cyclohexanecarbonyl chloride, 2-ethylhexanoyl chloride, cinnamoyl chloride, 1-adamantancarbonyl chloride. , Heptafluorobutyryl chloride, stearate chloride, benzoyl chloride, and the like.
- a step of precipitating a solid may be included in the production of a polyimide precursor or the like. Specifically, the water-absorbing by-product of the dehydration condensing agent coexisting in the reaction solution was filtered off as necessary, and then obtained in a poor solvent such as water, an aliphatic lower alcohol, or a mixed solution thereof. By adding the polymer component and precipitating the polymer component, it is precipitated as a solid, and by drying, a polyimide precursor or the like can be obtained. In order to improve the degree of purification, operations such as redissolution, reprecipitation and drying of the polyimide precursor may be repeated. Further, a step of removing ionic impurities using an ion exchange resin may be included.
- the content of the specific resin in the resin composition of the present invention is preferably 20% by mass or more, more preferably 30% by mass or more, and more preferably 40% by mass or more, based on the total solid content of the resin composition. More preferably, it is more preferably 50% by mass or more. Further, the content of the resin in the resin composition of the present invention is preferably 99.5% by mass or less, more preferably 99% by mass or less, and 98% by mass, based on the total solid content of the resin composition. % Or less, more preferably 97% by mass or less, and even more preferably 95% by mass or less.
- the resin composition of the present invention may contain only one type of specific resin, or may contain two or more types. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- the specific resin include, but are not limited to, SA-1 to SA-12, PI-1 and the like in the examples described later. Further, it is also preferable that the resin composition of the present invention contains at least two kinds of resins. Specifically, the resin composition of the present invention may contain two or more kinds of the specific resin and another resin described later in total, or may contain two or more kinds of the specific resin, but the specific resin may be contained. It is preferable to include two or more kinds. When the resin composition of the present invention contains two or more kinds of specific resins, for example, two or more kinds of polyimides which are polyimide precursors and have different structures derived from dianhydride (R 115 in the above formula (2)). It is preferable to include a precursor.
- the resin composition of the present invention contains two or more kinds of specific resins, for example, two or more kinds of polyimides which are polyimide precursors and have different structures derived from dianhydride (R 115 in the above formula (2)). It is preferable to include a precursor.
- the resin composition of the present invention may contain the above-mentioned specific resin and another resin different from the specific resin (hereinafter, also simply referred to as “other resin”).
- Other resins include polyimide precursors that do not correspond to specific resins, polyimides that do not correspond to specific resins, polybenzoxazole precursors that do not correspond to specific resins, polybenzoxazoles that do not correspond to specific resins, and polyamideimide precursors that do not correspond to specific resins.
- Body polyamideimide, phenol resin, polyamide, epoxy resin, polysiloxane, resin containing siloxane structure, (meth) acrylic resin, (meth) acrylamide resin, urethane resin, butyral resin, styryl resin, polyether, which do not correspond to specific resins
- acrylic resin acrylic resin
- methacrylamide resin urethane resin
- butyral resin styryl resin
- polyether which do not correspond to specific resins
- resin and polyester resin examples thereof include resin and polyester resin.
- a resin composition having excellent coatability can be obtained, and a pattern (cured product) having excellent solvent resistance can be obtained.
- the weight average molecular weight is 20,000 or less and the polymerizable base value is high (for example, the molar amount of the polymerizable group contained in 1 g of the resin). (1 ⁇ 10 -3 mol / g or more)
- the coatability of the resin composition, the solvent resistance of the pattern (cured product), etc. can be improved. can.
- the content of the other resin is preferably 0.01% by mass or more, preferably 0.05% by mass or more, based on the total solid content of the resin composition. It is more preferably 1% by mass or more, further preferably 2% by mass or more, further preferably 5% by mass or more, and further preferably 10% by mass or more. More preferred. Further, the content of other resins in the resin composition of the present invention is preferably 80% by mass or less, more preferably 75% by mass or less, and more preferably 70% by mass, based on the total solid content of the resin composition. It is more preferably 0% by mass or less, further preferably 60% by mass or less, and even more preferably 50% by mass or less.
- the content of the other resin may be low.
- the content of the other resin is preferably 20% by mass or less, more preferably 15% by mass or less, and 10% by mass or less with respect to the total solid content of the resin composition. Is more preferable, 5% by mass or less is further preferable, and 1% by mass or less is even more preferable.
- the lower limit of the content is not particularly limited, and may be 0% by mass or more.
- the resin composition of the present invention may contain only one type of other resin, or may contain two or more types. When two or more kinds are contained, it is preferable that the total amount is within the above range.
- the resin composition of the present invention preferably contains a polymerizable compound.
- the polymerizable compound include radical cross-linking agents and other cross-linking agents.
- the resin composition of the present invention preferably contains a radical cross-linking agent.
- the radical cross-linking agent is a compound having a radically polymerizable group.
- a group containing an ethylenically unsaturated bond is preferable.
- Examples of the group containing an ethylenically unsaturated bond include a group having an ethylenically unsaturated bond such as a vinyl group, an allyl group, a vinylphenyl group, a (meth) acryloyl group, a maleimide group, and a (meth) acrylamide group.
- a (meth) acryloyl group As the group containing an ethylenically unsaturated bond, a (meth) acryloyl group, a (meth) acrylamide group and a vinylphenyl group are preferable, and from the viewpoint of reactivity, a (meth) acryloyl group is more preferable.
- the radical cross-linking agent is preferably a compound having one or more ethylenically unsaturated bonds, but more preferably a compound having two or more ethylenically unsaturated bonds.
- the radical cross-linking agent may have three or more ethylenically unsaturated bonds.
- As the compound having two or more ethylenically unsaturated bonds a compound having 2 to 15 ethylenically unsaturated bonds is preferable, and a compound having 2 to 10 ethylenically unsaturated bonds is more preferable. The compound having is more preferable.
- the resin composition of the present invention comprises a compound having two ethylenically unsaturated bonds and a compound having three or more ethylenically unsaturated bonds. It is also preferable to include.
- the molecular weight of the radical cross-linking agent is preferably 2,000 or less, more preferably 1,500 or less, and even more preferably 900 or less.
- the lower limit of the molecular weight of the radical cross-linking agent is preferably 100 or more.
- radical cross-linking agent examples include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.), esters thereof, and amides, and are preferable.
- an addition reaction product of an unsaturated carboxylic acid ester or amide having a nucleophilic substituent such as a hydroxy group, an amino group or a sulfanyl group with a monofunctional or polyfunctional isocyanate group or an epoxy group, or a monofunctional or polyfunctional group.
- a dehydration condensation reaction product with a functional carboxylic acid is also preferably used.
- an addition reaction product of an unsaturated carboxylic acid ester or amide having a polyelectron substituent such as an isocyanate group or an epoxy group with monofunctional or polyfunctional alcohols, amines and thiols, and a halogeno group.
- Substitution reaction products of unsaturated carboxylic acid esters or amides having a desorbing substituent such as or tosyloxy group with monofunctional or polyfunctional alcohols, amines and thiols are also suitable.
- radical cross-linking agent a compound having a boiling point of 100 ° C. or higher under normal pressure is also preferable.
- examples are polyethylene glycol di (meth) acrylate, trimethyl ethanetri (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol.
- Examples thereof include polyfunctional acrylates and methacrylates such as epoxy acrylates which are reaction products with acrylic acid, and mixtures thereof.
- the compounds described in paragraphs 0254 to 0257 of JP-A-2008-292970 are also suitable.
- a polyfunctional (meth) acrylate obtained by reacting a polyfunctional carboxylic acid with a cyclic ether group such as glycidyl (meth) acrylate and a compound having an ethylenically unsaturated bond can also be mentioned.
- a preferable radical cross-linking agent other than the above it has a fluorene ring and has an ethylenically unsaturated bond, which is described in JP-A-2010-160418, JP-A-2010-129825, Patent No. 4364216 and the like.
- Compounds having two or more groups and cardo resins can also be used.
- the compound described in JP-A No. 10-062986 together with specific examples as the formulas (1) and (2), which is obtained by adding ethylene oxide or propylene oxide to a polyfunctional alcohol and then (meth) acrylated, is also available. It can be used as a radical cross-linking agent.
- dipentaerythritol triacrylate commercially available KAYARAD D-330 (manufactured by Nippon Kayaku Co., Ltd.)
- dipentaerythritol tetraacrylate commercially available KAYARAD D-320 (Nihonka) (Manufactured by Shin Nakamura Chemical Industry Co., Ltd.)
- Dipentaerythritol penta (meth) acrylate commercially available KAYARAD D-310 (manufactured by Nippon Kayaku Co., Ltd.)
- Dipenta Elythritol hexa (meth) acrylate commercially available KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.), A-DPH (manufactured by Shin Nakamura Chemical Industry Co., Ltd.)
- these (meth) acryloyl groups are ethylene glycol residues or A structure bonded via
- SR-494 which is a tetrafunctional acrylate having four ethyleneoxy chains manufactured by Sartmer
- SR-209 manufactured by Sartmer which is a bifunctional methacrylate having four ethyleneoxy chains.
- DPCA-60 a hexafunctional acrylate having 6 pentyleneoxy chains manufactured by Nippon Kayaku Co., Ltd.
- TPA-330 a trifunctional acrylate having 3 isobutyleneoxy chains
- urethane oligomer UAS-10 are examples of the radical cross-linking agent.
- UAB-140 (manufactured by Nippon Paper Co., Ltd.), NK Ester M-40G, NK Ester 4G, NK Ester M-9300, NK Ester A-9300, UA-7200 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), DPHA-40H (Japan) Chemicals (manufactured by Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600 (manufactured by Kyoeisha Chemical Co., Ltd.), Blemmer PME400 (manufactured by Nichiyu Co., Ltd.), etc. Can be mentioned.
- radical cross-linking agent examples include urethane acrylates as described in Japanese Patent Publication No. 48-041708, Japanese Patent Application Laid-Open No. 51-037193, Japanese Patent Laid-Open No. 02-0322293, and Japanese Patent Laid-Open No. 02-016765.
- Urethane compounds having an ethylene oxide-based skeleton described in Japanese Patent Publication No. 58-049860, Japanese Patent Publication No. 56-017654, Japanese Patent Publication No. 62-039417, and Japanese Patent Publication No. 62-039418 are also suitable.
- radical cross-linking agent compounds having an amino structure or a sulfide structure in the molecule, which are described in JP-A-63-277653, JP-A-63-260909, and JP-A-01-105238, are used. You can also do it.
- the radical cross-linking agent may be a radical cross-linking agent having an acid group such as a carboxy group or a phosphoric acid group.
- the radical cross-linking agent having an acid group is preferably an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid, and an acid group is obtained by reacting an unreacted hydroxy group of the aliphatic polyhydroxy compound with a non-aromatic carboxylic acid anhydride.
- the radical cross-linking agent provided with the above is more preferable.
- the aliphatic polyhydroxy compound is pentaerythritol or dipentaerythritol. Is a compound.
- examples of commercially available products include M-510 and M-520 as polybasic acid-modified acrylic oligomers manufactured by Toagosei Co., Ltd.
- the acid value of the radical cross-linking agent having an acid group is preferably 0.1 to 300 mgKOH / g, and particularly preferably 1 to 100 mgKOH / g.
- the acid value of the radical cross-linking agent is within the above range, it is excellent in manufacturable handling and further excellent in developability. Moreover, the polymerizability is good.
- the acid value is measured according to the description of JIS K 0070: 1992.
- the resin composition it is preferable to use bifunctional methacrylate or acrylate from the viewpoint of pattern resolution and film elasticity.
- Specific compounds include triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, tetraethylene glycol diacrylate, PEG (polyethylene glycol) 200 diacrylate, PEG200 dimethacrylate, PEG600 diacrylate, PEG600 dimethacrylate.
- the PEG200 diacrylate is a polyethylene glycol diacrylate having a polyethylene glycol chain formula of about 200.
- a monofunctional radical cross-linking agent can be preferably used as the radical cross-linking agent from the viewpoint of suppressing warpage associated with the control of the elastic modulus of the pattern (cured product).
- Examples of the monofunctional radical cross-linking agent include n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, carbitol (meth) acrylate, and cyclohexyl (meth). ) Acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, N-methylol (meth) acrylamide, glycidyl (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, etc.
- N-vinyl compounds such as N-vinylpyrrolidone and N-vinylcaprolactam, allylglycidyl ether and the like are preferably used.
- the monofunctional radical cross-linking agent a compound having a boiling point of 100 ° C. or higher under normal pressure is also preferable in order to suppress volatilization before exposure.
- the bifunctional or higher functional radical cross-linking agent include allyl compounds such as diallyl phthalate and triallyl trimellitate.
- a radical cross-linking agent containing a urea bond may be used.
- a compound having no axis of symmetry is preferable from the viewpoint of developability, elongation at break or chemical resistance, and the agent does not have an axis of symmetry and has at least condition 1 or condition 2 below.
- a compound satisfying one of them is preferable.
- Condition 1 The compound has two or more radically polymerizable groups;
- Condition 2 The compound has at least one of a hydroxy group and an alkyleneoxy group. Examples of such a compound include, but are not limited to, the following compounds.
- the content thereof is preferably more than 0% by mass and 60% by mass or less with respect to the total solid content of the resin composition of the present invention.
- the lower limit is more preferably 5% by mass or more.
- the upper limit is more preferably 50% by mass or less, and further preferably 30% by mass or less.
- the radical cross-linking agent may be used alone or in combination of two or more. When two or more kinds are used in combination, the total amount is preferably in the above range.
- the resin composition of the present invention contains another cross-linking agent different from the above-mentioned radical cross-linking agent.
- the other cross-linking agent refers to a cross-linking agent other than the above-mentioned radical cross-linking agent, and a covalent bond is formed with another compound in the composition or a reaction product thereof by exposure to a photobase generator.
- a compound having a plurality of groups in the molecule that promotes the formation reaction is preferable, and a reaction that forms a covalent bond with another compound in the composition or a reaction product thereof is an action of an acid or a base.
- a compound having a plurality of groups promoted by the above in the molecule is preferable.
- the acid or base is preferably a base generated from a photobase generator in the exposure step.
- a compound having at least one group selected from the group consisting of an acyloxymethyl group, a methylol group and an alkoxymethyl group is preferable, and the compound is selected from the group consisting of an acyloxymethyl group, a methylol group and an alkoxymethyl group.
- a compound having a structure in which at least one of the above groups is directly bonded to a nitrogen atom is more preferable.
- an amino group-containing compound such as melamine, glycoluril, urea, alkylene urea, or benzoguanamine is reacted with formaldehyde or formaldehyde and alcohol, and the hydrogen atom of the amino group is changed to an acyloxymethyl group, a methylol group, or a methylol group.
- examples thereof include compounds having a structure substituted with an alkoxymethyl group.
- the method for producing these compounds is not particularly limited, and any compound having the same structure as the compound produced by the above method may be used. Further, it may be an oligomer formed by self-condensing the methylol groups of these compounds.
- a melamine-based cross-linking agent is used as a melamine-based cross-linking agent
- a glycol-uryl, urea or alkylene urea-based cross-linking agent is used as a urea-based cross-linking agent
- an alkylene urea-based cross-linking agent is used as an alkylene urea-based cross-linking agent.
- a cross-linking agent using an agent or benzoguanamine is called a benzoguanamine-based cross-linking agent.
- the resin composition of the present invention preferably contains at least one compound selected from the group consisting of a urea-based cross-linking agent and a melamine-based cross-linking agent, and is preferably a glycoluril-based cross-linking agent and a melamine-based cross-linking agent described later. It is more preferred to include at least one compound selected from the group consisting of agents.
- the alkoxymethyl group or the acyloxymethyl group is directly substituted on the aromatic group or the nitrogen atom of the following urea structure, or on triazine.
- the alkoxymethyl group or acyloxymethyl group contained in the above compound preferably has 2 to 5 carbon atoms, preferably 2 or 3 carbon atoms, and more preferably 2 carbon atoms.
- the total number of alkoxymethyl groups and acyloxymethyl groups contained in the above compound is preferably 1 to 10, more preferably 2 to 8, and particularly preferably 3 to 6.
- the molecular weight of the compound is preferably 1500 or less, preferably 180 to 1200.
- R 100 represents an alkyl group or an acyl group.
- R 101 and R 102 each independently represent a monovalent organic group and may be bonded to each other to form a ring.
- Examples of the compound in which the alkoxymethyl group or the acyloxymethyl group is directly substituted with the aromatic group include compounds as shown in the following general formula.
- X represents a single-bonded or divalent organic group
- each R 104 independently represents an alkyl group or an acyl group
- R 103 is a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or an aralkyl group.
- R 103 is a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or an aralkyl group.
- R 103 is a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or an aralkyl group.
- R 103 is a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or an aralkyl group.
- R 4 represents a group that decomposes by the action of an acid to produce an alkali-soluble group
- It represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms
- R5 represents a group desorbed by the action
- R 105 independently represents an alkyl group or an alkenyl group, a, b and c are independently 1 to 3, d is 0 to 4, e is 0 to 3, and f is 0 to 3. A + d is 5 or less, b + e is 4 or less, and c + f is 4 or less.
- R 5 in a group that decomposes by the action of an acid to produce an alkali-soluble group a group that is eliminated by the action of an acid, and a group represented by -C (R 4 ) 2 COOR 5 , for example, -C (R 36 ).
- R 36 to R 39 each independently represent an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group.
- R 36 and R 37 may be coupled to each other to form a ring.
- an alkyl group having 1 to 10 carbon atoms is preferable, and an alkyl group having 1 to 5 carbon atoms is more preferable.
- the alkyl group may be linear or branched.
- cycloalkyl group a cycloalkyl group having 3 to 12 carbon atoms is preferable, and a cycloalkyl group having 3 to 8 carbon atoms is more preferable.
- the cycloalkyl group may have a monocyclic structure or a polycyclic structure such as a fused ring.
- the aryl group is preferably an aromatic hydrocarbon group having 6 to 30 carbon atoms, and more preferably a phenyl group.
- aralkyl group an aralkyl group having 7 to 20 carbon atoms is preferable, and an aralkyl group having 7 to 16 carbon atoms is more preferable.
- the above-mentioned aralkyl group is intended to be an aryl group substituted with an alkyl group, and preferred embodiments of these alkyl and aryl groups are the same as those of the above-mentioned preferred embodiments of alkyl and aryl groups.
- the alkenyl group is preferably an alkenyl group having 3 to 20 carbon atoms, and more preferably an alkenyl group having 3 to 16 carbon atoms. Further, these groups may further have a known substituent as long as the effect of the present invention can be obtained.
- R 01 and R 02 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group.
- the group that decomposes by the action of an acid to produce an alkali-soluble group, or the group that is desorbed by the action of an acid is preferably a tertiary alkyl ester group, an acetal group, a cumyl ester group, an enol ester group, or the like. More preferably, it is a tertiary alkyl ester group or an acetal group.
- Examples of the compound having an alkoxymethyl group include the following structures.
- Examples of the compound having an acyloxymethyl group include compounds in which the alkoxymethyl group of the following compound is changed to an acyloxymethyl group.
- Examples of the compound having an alkoxymethyl group or acyloxymethyl in the molecule include, but are not limited to, the following compounds.
- the compound containing at least one of an alkoxymethyl group and an acyloxymethyl group a commercially available compound may be used, or a compound synthesized by a known method may be used. From the viewpoint of heat resistance, a compound in which an alkoxymethyl group or an acyloxymethyl group is directly substituted on an aromatic ring or a triazine ring is preferable.
- melamine-based cross-linking agent examples include hexamethoxymethylmelamine, hexaethoxymethylmelamine, hexapropoxymethylmelamine, hexabutoxybutylmelamine and the like.
- urea-based cross-linking agent examples include monohydroxymethylated glycol uryl, dihydroxymethylated glycol uryl, trihydroxymethylated glycol uryl, tetrahydroxymethylated glycol uryl, monomethoxymethylated glycol uryl, and dimethoxymethylated glycol.
- Uril trimethoxymethylated glycol uryl, tetramethoxymethylated glycol uryl, monoethoxymethylated glycol uryl, diethoxymethylated glycol uryl, triethoxymethylated glycol uryl, tetraethoxymethylated glycol uryl, monopropoxymethylated glycol uryl , Dipropoxymethylated glycol uryl, tripropoxymethylated glycol uryl, tetrapropoxymethylated glycol uryl, monobutoxymethylated glycol uryl, dibutoxymethylated glycol uryl, tributoxymethylated glycol uryl, or tetrabutoxymethylated glycol
- Glycoluril-based cross-linking agents such as uryl; Urea-based cross-linking agents such as bismethoxymethylurea, bisethoxymethylurea, bispropoxymethylurea, and bisbutoxymethylurea, Monohydroxymethylated ethylene urea or dihydroxymethylated ethylene urea,
- benzoguanamine-based cross-linking agent examples include monohydroxymethylated benzoguanamine, dihydroxymethylated benzoguanamine, trihydroxymethylated benzoguanamine, tetrahydroxymethylated benzoguanamine, monomethoxymethylated benzoguanamine, dimethoxymethylated benzoguanamine, and trimethoxymethylated benzoguanamine.
- Tetramethoxymethylated benzoguanamine Tetramethoxymethylated benzoguanamine, monoethoxymethylated benzoguanamine, diethoxymethylated benzoguanamine, triethoxymethylated benzoguanamine, tetraethoxymethylated benzoguanamine, monopropoxymethylated benzoguanamine, dipropoxymethylated benzoguanamine, tripropoxymethylated benzoguanamine, tetra Examples thereof include propoxymethylated benzoguanamine, monobutoxymethylated benzoguanamine, dibutoxymethylated benzoguanamine, tributoxymethylated benzoguanamine, tetrabutoxymethylated benzoguanamine and the like.
- a compound having at least one group selected from the group consisting of a methylol group and an alkoxymethyl group at least one selected from the group consisting of a methylol group and an alkoxymethyl group on an aromatic ring (preferably a benzene ring).
- Compounds to which the group of the species is directly bonded are also preferably used. Specific examples of such compounds include benzenedimethanol, bis (hydroxymethyl) cresol, bis (hydroxymethyl) dimethoxybenzene, bis (hydroxymethyl) diphenyl ether, bis (hydroxymethyl) benzophenone, and hydroxymethylphenyl hydroxymethylbenzoate.
- suitable commercially available products include 46DMOC, 46DMOEP (all manufactured by Asahi Organic Materials Industry Co., Ltd.), DML-PC, DML-PEP, DML-OC, and DML-OEP.
- the resin composition of the present invention contains at least one compound selected from the group consisting of an epoxy compound, an oxetane compound, and a benzoxazine compound as another cross-linking agent.
- the epoxy compound is preferably a compound having two or more epoxy groups in one molecule.
- the epoxy group undergoes a cross-linking reaction at 200 ° C. or lower, and the dehydration reaction derived from the cross-linking does not occur, so that film shrinkage is unlikely to occur. Therefore, the inclusion of the epoxy compound is effective in suppressing low temperature curing and warpage of the resin composition of the present invention.
- the epoxy compound preferably contains a polyethylene oxide group.
- the polyethylene oxide group means that the number of repeating units of ethylene oxide is 2 or more, and the number of repeating units is preferably 2 to 15.
- epoxy compounds include bisphenol A type epoxy resin; bisphenol F type epoxy resin; propylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, butylene glycol diglycidyl ether, hexamethylene glycol diglycidyl ether.
- Examples include, but are not limited to, contained silicones.
- n is an integer of 1 to 5
- m is an integer of 1 to 20.
- n is preferably 1 to 2 and m is preferably 3 to 7 from the viewpoint of achieving both heat resistance and improvement in elongation.
- oxetane compound compound having an oxetanyl group
- the oxetane compound include compounds having two or more oxetane rings in one molecule, 3-ethyl-3-hydroxymethyloxetane, 1,4-bis ⁇ [(3-ethyl-3-oxetanyl) methoxy] methyl ⁇ benzene, and the like.
- examples thereof include 3-ethyl-3- (2-ethylhexylmethyl) oxetane, 1,4-benzenedicarboxylic acid-bis [(3-ethyl-3-oxetanyl) methyl] ester and the like.
- Aron Oxetane series (for example, OXT-121, OXT-221) manufactured by Toagosei Co., Ltd. can be preferably used, and these can be used alone or in combination of two or more. good.
- benzoxazine compound examples include Pd-type benzoxazine, Fa-type benzoxazine (trade name, manufactured by Shikoku Kasei Kogyo Co., Ltd.), a benzoxazine adduct of a polyhydroxystyrene resin, and a phenol novolac-type dihydrobenzo.
- examples include oxazine compounds. These may be used alone or in combination of two or more.
- the content of the other cross-linking agent is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, and 0. It is more preferably 5 to 15% by mass, and particularly preferably 1.0 to 10% by mass.
- the other cross-linking agent may be contained in only one kind, or may be contained in two or more kinds. When two or more other cross-linking agents are contained, the total is preferably in the above range.
- the resin composition of the present invention contains a polymerization initiator that can initiate polymerization by light and / or heat.
- a photopolymerization initiator is preferably a photoradical polymerization initiator.
- the photoradical polymerization initiator is not particularly limited and may be appropriately selected from known photoradical polymerization initiators.
- a photoradical polymerization initiator having photosensitivity to light rays in the ultraviolet region to the visible region is preferable.
- it may be an active agent that causes some action with a photoexcited sensitizer and generates an active radical.
- the photoradical polymerization initiator contains at least one compound having a molar extinction coefficient of at least about 50 L ⁇ mol -1 ⁇ cm -1 within a wavelength range of about 240 to 800 nm (preferably 330 to 500 nm). Is preferable.
- the molar extinction coefficient of a compound can be measured using a known method. For example, it is preferable to measure at a concentration of 0.01 g / L using an ethyl acetate solvent with an ultraviolet-visible spectrophotometer (Cary-5 spectrophotometer manufactured by Varian).
- a known compound can be arbitrarily used.
- halogenated hydrocarbon derivatives for example, compounds having a triazine skeleton, compounds having an oxadiazole skeleton, compounds having a trihalomethyl group, etc.
- acylphosphine compounds such as acylphosphine oxide, hexaarylbiimidazoles, oxime derivatives and the like.
- a metallocene compound an organic boron compound
- paragraphs 0138 to 0151 of International Publication No. 2015/199219 can be referred to, and the contents thereof are incorporated in the present specification.
- ketone compound for example, the compound described in paragraph 0087 of JP-A-2015-087611 is exemplified, and the content thereof is incorporated in the present specification.
- Kayacure-DETX-S manufactured by Nippon Kayaku Co., Ltd.
- Nippon Kayaku Co., Ltd. is also preferably used.
- a hydroxyacetophenone compound, an aminoacetophenone compound, and an acylphosphine compound can be preferably used as the photoradical polymerization initiator. More specifically, for example, the aminoacetophenone-based initiator described in JP-A No. 10-291969 and the acylphosphine oxide-based initiator described in Japanese Patent No. 4225898 can be used, and the contents thereof are described in the present specification. Be incorporated.
- Examples of the ⁇ -hydroxyketone initiator include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (all manufactured by IGM Resins BV), IRGACURE 184 (IRGACURE is a registered trademark), DAROCUR 1173, and DAROCUR 1173.
- Omnirad 184 Omnirad 1173
- Omnirad 2959 Omnirad 127
- IRGACURE 184 IRGACURE is a registered trademark
- DAROCUR 1173 DAROCUR 1173
- DAROCUR 1173 DAROCUR 1173.
- -2959, IRGACURE 127 (trade name: both manufactured by BASF) can be used.
- Omnirad 907 As the ⁇ -aminoketone-based initiators, Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (all manufactured by IGM Resins BV), IRGACURE 907, IRGACURE 369, and IRGACURE 369, all of which are IRGACURE 37. (Manufactured by the company) can be used.
- the aminoacetophenone-based initiator the compound described in JP-A-2009-191179, in which the maximum absorption wavelength is matched with a wavelength light source such as 365 nm or 405 nm, can also be used, and the contents thereof are incorporated in the present specification.
- acylphosphine oxide-based initiator examples include 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide.
- Omnirad 819, Omnirad TPO (all manufactured by IGM Resins BV), IRGACURE-819 and IRGACURE-TPO (trade name: all manufactured by BASF) can be used.
- metallocene compound examples include IRGACURE-784, IRGACURE-784EG (all manufactured by BASF), Keycure VIS 813 (manufactured by King Brother Chem), and the like.
- the photoradical polymerization initiator is more preferably an oxime compound.
- the oxime compound By using the oxime compound, it becomes possible to improve the exposure latitude more effectively.
- the oxime compound is particularly preferable because it has a wide exposure latitude (exposure margin) and also acts as a photocuring accelerator.
- oxime compound examples include the compound described in JP-A-2001-233842, the compound described in JP-A-2000-080068, the compound described in JP-A-2006-342166, and J. Am. C. S. The compound according to Perkin II (1979, pp. 1653-1660), J. Mol. C. S. The compound described in Perkin II (1979, pp. 156-162), the compound described in Journal of Photopolisr Science and Technology (1995, pp. 202-232), the compound described in JP-A-2000-066385, the compound described in JP-A-2000-066385. Compounds described in JP-A-2004-534797, compounds described in JP-A-2017-109766, compounds described in Japanese Patent No.
- Preferred oxime compounds include, for example, compounds having the following structures, 3- (benzoyloxy (imino)) butane-2-one, 3- (acetoxy (imino)) butane-2-one, 3- (propionyloxy (propionyloxy).
- IRGACURE OXE 01 IRGACURE OXE 02, IRGACURE OXE 03, IRGACURE OXE 04 (above, manufactured by BASF), ADEKA PTOMER N-1919 (manufactured by ADEKA Corporation, JP-A-2012-014052).
- a radical polymerization initiator 2) is also preferably used.
- TR-PBG-304, TR-PBG-305 (manufactured by Changzhou Powerful Electronics New Materials Co., Ltd.), ADEKA ARCLUDS NCI-730, NCI-831 and ADEKA ARCULDS NCI-930 (manufactured by ADEKA Corporation) are also used. be able to.
- DFI-091 manufactured by Daito Chemix Co., Ltd.
- SpeedCure PDO manufactured by SARTOMER ARCEMA
- an oxime compound having the following structure can also be used.
- an oxime compound having a fluorene ring can also be used.
- Specific examples of the oxime compound having a fluorene ring include the compound described in JP-A-2014-137466 and the compound described in Japanese Patent No. 06636081, and the contents thereof are incorporated in the present specification.
- an oxime compound having a skeleton in which at least one benzene ring of the carbazole ring is a naphthalene ring can also be used.
- Specific examples of such oxime compounds include the compounds described in WO 2013/083505, the contents of which are incorporated herein.
- an oxime compound having a fluorine atom It is also possible to use an oxime compound having a fluorine atom.
- an oxime compound include the compounds described in JP-A-2010-262028, the compounds 24, 36-40 described in paragraph 0345 of JP-A-2014-500852, and JP-A-2013.
- the compound (C-3) and the like described in paragraph 0101 of the publication No. 164471 are mentioned, and the contents thereof are incorporated in the present specification.
- an oxime compound having a nitro group can be used as the photopolymerization initiator.
- the oxime compound having a nitro group is also preferably a dimer.
- Specific examples of the oxime compound having a nitro group include the compounds described in paragraphs 0031 to 0047 of JP2013-114249A and paragraphs 0008-0012 and 0070-0079 of JP-A-2014-137466. Examples of the compounds described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071 are incorporated herein by reference. Further, examples of the oxime compound having a nitro group include ADEKA ARKULS NCI-831 (manufactured by ADEKA Corporation).
- an oxime compound having a benzofuran skeleton can also be used.
- Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.
- an oxime compound in which a substituent having a hydroxy group is bonded to the carbazole skeleton can also be used.
- Examples of such a photopolymerization initiator include the compounds described in International Publication No. 2019/088055, and the contents thereof are incorporated in the present specification.
- an oxime compound having an aromatic ring group Ar OX1 having an electron-attracting group introduced into the aromatic ring (hereinafter, also referred to as oxime compound OX) can also be used.
- the electron-attracting group of the aromatic ring group Ar OX1 include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group and a cyano group.
- the benzoyl group may have a substituent.
- the substituent include a halogen atom, a cyano group, a nitro group, a hydroxy group, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic oxy group, an alkenyl group, an alkylsulfanyl group and an arylsulfanyl group.
- an acyl group or an amino group more preferably an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic oxy group, an alkylsulfanyl group, an arylsulfanyl group or an amino group, and more preferably an alkoxy group or an alkyl group. It is more preferably a sulfanyl group or an amino group.
- the oxime compound OX is preferably at least one selected from the compound represented by the formula (OX1) and the compound represented by the formula (OX2), and more preferably the compound represented by the formula (OX2). preferable.
- RX1 is an alkyl group, an alkenyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic oxy group, an alkylsulfanyl group, an arylsulfanyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group.
- RX2 contains an alkyl group, an alkenyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic oxy group, an alkylsulfanyl group, an arylsulfanyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group and an aryl.
- RX3 to RX14 independently represent a hydrogen atom or a substituent. However, at least one of RX10 to RX14 is an electron-withdrawing group.
- RX12 is an electron-withdrawing group and RX10 , RX11 , RX13 , and RX14 are hydrogen atoms.
- oxime compound OX examples include the compounds described in paragraphs 0083 to 0105 of Japanese Patent No. 4600600, the contents of which are incorporated in the present specification.
- the most preferable oxime compound includes an oxime compound having a specific substituent shown in JP-A-2007-269779 and an oxime compound having a thioaryl group shown in JP-A-2009-191061. Incorporated herein.
- the photoradical polymerization initiator is a trihalomethyltriazine compound, a benzyldimethylketal compound, an ⁇ -hydroxyketone compound, an ⁇ -aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, or a triaryl.
- Compounds are preferred.
- More preferable photoradical polymerization initiators are trihalomethyltriazine compounds, ⁇ -aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, triarylimidazole dimers, onium salt compounds, benzophenone compounds and acetophenone compounds.
- At least one compound selected from the group consisting of trihalomethyltriazine compounds, ⁇ -aminoketone compounds, metallocene compounds, oxime compounds, triarylimidazole dimers, and benzophenone compounds is more preferable, and metallocene compounds or oxime compounds are even more preferable. ..
- the photoradical polymerization initiator is N, N'-tetraalkyl-4,4'-diaminobenzophenone, 2-benzyl such as benzophenone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler ketone).
- 2-benzyl such as benzophenone
- -2-Dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-methyl-1- [4- (methylthio) phenyl] -2-aromatic ketones such as morpholino-propanone-1, alkylanthraquinone, etc.
- benzoin ether compounds such as benzoin alkyl ether
- benzoin compounds such as benzoin and alkyl benzoin
- benzyl derivatives such as benzyl dimethyl ketal.
- a compound represented by the following formula (I) can also be used.
- R I00 is an alkyl group having 1 to 20 carbon atoms, an alkyl group having 2 to 20 carbon atoms interrupted by one or more oxygen atoms, an alkoxy group having 1 to 12 carbon atoms, a phenyl group, and the like.
- RI01 is a group represented by the formula (II). It is the same group as RI00 , and RI02 to RI04 are independently alkyl groups having 1 to 12 carbon atoms, alkoxy groups having 1 to 12 carbon atoms, or halogen atoms.
- R I05 to R I07 are the same as R I 02 to R I 04 of the above formula (I).
- the photoradical polymerization initiator the compounds described in paragraphs 0048 to 0055 of International Publication No. 2015/125469 can also be used, and the contents thereof are incorporated in the present specification.
- a bifunctional or trifunctional or higher photoradical polymerization initiator may be used as the photoradical polymerization initiator.
- two or more radicals are generated from one molecule of the photoradical polymerization initiator, so that good sensitivity can be obtained.
- the crystallinity is lowered, the solubility in a solvent or the like is improved, the precipitation is less likely to occur with time, and the stability of the resin composition with time can be improved.
- Specific examples of the bifunctional or trifunctional or higher functional photo-radical polymerization initiators include Japanese Patent Publication No. 2010-527339, Japanese Patent Publication No.
- the content thereof is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, based on the total solid content of the resin composition of the present invention. It is more preferably 0.5 to 15% by mass, and even more preferably 1.0 to 10% by mass. Only one type of photopolymerization initiator may be contained, or two or more types may be contained. When two or more kinds of photopolymerization initiators are contained, the total amount is preferably in the above range. Since the photopolymerization initiator may also function as a thermal polymerization initiator, cross-linking with the photopolymerization initiator may be further promoted by heating an oven, a hot plate, or the like.
- the resin composition may contain a sensitizer.
- the sensitizer absorbs specific active radiation and becomes an electronically excited state.
- the sensitizer in the electron-excited state comes into contact with the thermal radical polymerization initiator, the photoradical polymerization initiator, and the like, and acts such as electron transfer, energy transfer, and heat generation occur.
- the thermal radical polymerization initiator and the photoradical polymerization initiator undergo a chemical change and decompose to generate a radical, an acid or a base.
- Pyridone azo, cyanine, phenothiazine, pyrrolopyrazole azomethine, xanthene, phthalocyanine, benzopyran, indigo and the like can be used.
- sensitizer examples include Michler's ketone, 4,4'-bis (diethylamino) benzophenone, 2,5-bis (4'-diethylaminobenzal) cyclopentane, and 2,6-bis (4'-diethylaminobenzal).
- the content of the sensitizer is preferably 0.01 to 20% by mass, preferably 0.1 to 15% by mass, based on the total solid content of the resin composition. It is more preferably present, and even more preferably 0.5 to 10% by mass.
- the sensitizer may be used alone or in combination of two or more.
- the resin composition of the present invention may contain a chain transfer agent.
- Chain transfer agents are defined, for example, in the Polymer Dictionary, Third Edition (edited by the Society of Polymer Science, 2005), pp. 683-684.
- Examples of the chain transfer agent include RAFT (Reversible Addition Fragmentation chain Transfer), which is a group of compounds having -S-S-, -SO2 -S-, -NO-, SH, PH, SiH, and GeH in the molecule.
- Dithiobenzoate, trithiocarbonate, dithiocarbamate, xantate compound and the like having a thiocarbonylthio group used for polymerization are used. They can donate hydrogen to low-activity radicals to generate radicals, or they can be oxidized and then deprotonated to generate radicals.
- thiol compounds can be preferably used.
- the content of the chain transfer agent is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the total solid content of the resin composition of the present invention. 1 to 10 parts by mass is more preferable, and 0.5 to 5 parts by mass is further preferable.
- the chain transfer agent may be only one kind or two or more kinds. When there are two or more types of chain transfer agents, the total is preferably in the above range.
- the resin composition of the present invention preferably further contains a base generator.
- the base generator is a compound capable of generating a base by a physical or chemical action.
- Preferred base generators for the resin composition of the present invention include thermal base generators and photobase generators.
- the resin composition contains a precursor of a cyclized resin, it is preferable that the resin composition contains a base generator.
- the resin composition contains a thermal base generator, for example, the cyclization reaction of the precursor can be promoted by heating, and the mechanical properties and chemical resistance of the cured product become good. The performance as an interlayer insulating film for a wiring layer is improved.
- the base generator may be an ionic base generator or a nonionic base generator.
- Examples of the base generated from the base generator include secondary amines and tertiary amines.
- the base generator according to the present invention is not particularly limited, and a known base generator can be used.
- Known base generators include, for example, carbamoyloxime compounds, carbamoylhydroxylamine compounds, carbamic acid compounds, formamide compounds, acetoamide compounds, carbamates compounds, benzylcarbamate compounds, nitrobenzylcarbamate compounds, sulfonamide compounds, imidazole derivative compounds, amineimides.
- Compounds, pyridine derivative compounds, ⁇ -aminoacetophenone derivative compounds, quaternary ammonium salt derivative compounds, pyridinium salts, ⁇ -lactone ring derivative compounds, amineimide compounds, phthalimide derivative compounds, acyloxyimino compounds and the like can be used.
- Specific examples of the compound of the nonionic base generator include a compound represented by the formula (B1), the formula (B2), or the formula (B3).
- Rb 1 , Rb 2 and Rb 3 are independently organic groups, halogen atoms or hydrogen atoms having no tertiary amine structure. However, Rb 1 and Rb 2 do not become hydrogen atoms at the same time. Further, none of Rb 1 , Rb 2 and Rb 3 has a carboxy group.
- the tertiary amine structure refers to a structure in which all three bonds of a trivalent nitrogen atom are covalently bonded to a hydrocarbon-based carbon atom. Therefore, this does not apply when the bonded carbon atom is a carbon atom forming a carbonyl group, that is, when an amide group is formed together with a nitrogen atom.
- Rb 1 , Rb 2 and Rb 3 contains a cyclic structure, and it is more preferable that at least two of them contain a cyclic structure.
- the cyclic structure may be either a monocyclic ring or a condensed ring, and a monocyclic ring or a condensed ring in which two monocyclic rings are condensed is preferable.
- the single ring is preferably a 5-membered ring or a 6-membered ring, and more preferably a 6-membered ring.
- a cyclohexane ring and a benzene ring are preferable, and a cyclohexane ring is more preferable.
- Rb 1 and Rb 2 are hydrogen atoms, alkyl groups (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms), and alkenyl groups (preferably 2 to 24 carbon atoms). , 2-18 is more preferred, 3-12 is more preferred), aryl groups (6-22 carbons are preferred, 6-18 are more preferred, 6-10 are more preferred), or arylalkyl groups (7 carbons). ⁇ 25 is preferable, 7 to 19 is more preferable, and 7 to 12 is even more preferable). These groups may have a substituent as long as the effect of the present invention is exhibited. Rb 1 and Rb 2 may be bonded to each other to form a ring.
- Rb 1 and Rb 2 are particularly linear, branched, or cyclic alkyl groups which may have substituents (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms). It is more preferably a cycloalkyl group which may have a substituent (preferably 3 to 24 carbon atoms, more preferably 3 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms) and having a substituent.
- substituents preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms.
- It is more preferably a cycloalkyl group which may have a substituent (preferably 3 to 24 carbon atoms, more preferably 3 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms) and having a substituent.
- cyclohexyl groups are more preferred.
- an alkyl group preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, further preferably 3 to 12 carbon atoms
- an aryl group preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, 6 to 6.
- alkenyl groups preferably 2 to 24 carbon atoms, more preferably 2 to 12
- arylalkyl groups preferably 7 to 23 carbon atoms, 7 to 19 are more preferred.
- 7 to 12 is more preferable), an arylalkenyl group (preferably 8 to 24 carbon atoms, more preferably 8 to 20 carbon atoms, still more preferably 8 to 16 carbon atoms), and an alkoxyl group (preferably 1 to 24 carbon atoms, 2 to 2 to 24).
- 18 is more preferred, 3 to 12 are more preferred), aryloxy groups (6 to 22 carbons are preferred, 6 to 18 are more preferred, 6 to 12 are even more preferred), or arylalkyloxy groups (7 to 12 carbons).
- 23 is preferable, 7 to 19 is more preferable, and 7 to 12 is even more preferable).
- a cycloalkyl group (preferably 3 to 24 carbon atoms, more preferably 3 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms), an arylalkenyl group, and an arylalkyloxy group are preferable.
- Rb 3 may further have a substituent as long as the effect of the present invention is exhibited.
- the compound represented by the formula (B1) is preferably a compound represented by the following formula (B1-1) or the following formula (B1-2).
- Rb 11 and Rb 12 , and Rb 31 and Rb 32 are the same as Rb 1 and Rb 2 in the formula (B1), respectively.
- Rb 13 has an alkyl group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, further preferably 3 to 12 carbon atoms) and an alkenyl group (preferably 2 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, 3 to 12 carbon atoms). Is more preferable), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, further preferably 6 to 12 carbon atoms), an arylalkyl group (preferably 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms). 7 to 12 is more preferable), and a substituent may be provided as long as the effect of the present invention is exhibited.
- Rb 13 is preferably an arylalkyl group.
- Rb 33 and Rb 34 independently have a hydrogen atom, an alkyl group (preferably 1 to 12 carbon atoms, more preferably 1 to 8 carbon atoms, still more preferably 1 to 3 carbon atoms), and an alkenyl group (preferably 2 to 12 carbon atoms).
- Rb 33 and Rb 34 independently have a hydrogen atom, an alkyl group (preferably 1 to 12 carbon atoms, more preferably 1 to 8 carbon atoms, still more preferably 1 to 3 carbon atoms), and an alkenyl group (preferably 2 to 12 carbon atoms).
- 2 to 8 are more preferable, 2 to 3 are more preferable
- aryl groups (6 to 22 carbon atoms are preferable, 6 to 18 are more preferable, 6 to 10 are more preferable
- 23 is preferable, 7 to 19 is more preferable, and 7 to 11 is even more preferable), and a hydrogen atom is preferable.
- Rb 35 has an alkyl group (preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, further preferably 3 to 8 carbon atoms) and an alkenyl group (preferably 2 to 12 carbon atoms, more preferably 2 to 10 carbon atoms, 3 to 10 carbon atoms). 8 is more preferable), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, still more preferably 6 to 12), an arylalkyl group (preferably 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms). , 7-12 is more preferable), and an aryl group is preferable.
- the compound represented by the formula (B1-1) is also preferable.
- Rb 11 and Rb 12 are synonymous with Rb 11 and Rb 12 in the formula (B1-1).
- Rb 15 and Rb 16 are a hydrogen atom, an alkyl group (preferably 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, still more preferably 1 to 3 carbon atoms), and an alkenyl group (preferably 2 to 12 carbon atoms, 2 to 6 carbon atoms). More preferably, 2 to 3 are more preferable), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, still more preferably 6 to 10), an arylalkyl group (preferably 7 to 23 carbon atoms, 7).
- Rb 17 has an alkyl group (preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, further preferably 3 to 8 carbon atoms) and an alkenyl group (preferably 2 to 12 carbon atoms, more preferably 2 to 10 carbon atoms, 3 to 8 carbon atoms). Is more preferable), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, further preferably 6 to 12 carbon atoms), and an arylalkyl group (preferably 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms). 7 to 12 is more preferable), and an aryl group is particularly preferable.
- L is a divalent hydrocarbon group having a saturated hydrocarbon group on the path of the connecting chain connecting the adjacent oxygen atom and the carbon atom, and the number of atoms on the path of the connecting chain is Represents a hydrocarbon group of 3 or more.
- RN1 and RN2 each independently represent a monovalent organic group.
- linking chain refers to an atomic chain on a path connecting two atoms or a group of atoms to be linked, which is connected at the shortest (minimum number of atoms).
- L is composed of a phenylene ethylene group, has an ethylene group as a saturated hydrocarbon group, and the linking chain is composed of four carbon atoms, and is on the path of the linking chain. (That is, the number of atoms constituting the connecting chain, hereinafter also referred to as "linking chain length" or "connecting chain length”) is 4.
- the number of carbon atoms in L in the formula (B3) is preferably 3 to 24.
- the upper limit is more preferably 12 or less, further preferably 10 or less, and particularly preferably 8 or less.
- the lower limit is more preferably 4 or more.
- the upper limit of the linking chain length of L is preferably 12 or less, more preferably 8 or less, still more preferably 6 or less, and 5 The following is particularly preferable.
- the chain length of L is preferably 4 or 5, and most preferably 4.
- Specific preferred compounds of the base generator include, for example, the compounds described in paragraphs 0102 to 0168 of International Publication No. 2020/06614 and the compounds described in paragraph numbers 0143 to 0177 of International Publication No. 2018/038002. Can be mentioned.
- the base generator contains a compound represented by the following formula (N1).
- RN1 and RN2 each independently represent a monovalent organic group
- RC1 represents a hydrogen atom or a protecting group
- L represents a divalent linking group
- L is a divalent linking group, preferably a divalent organic group.
- the linking chain length of the linking group is preferably 1 or more, and more preferably 2 or more.
- the upper limit is preferably 12 or less, more preferably 8 or less, and even more preferably 5 or less.
- the linking chain length is the number of atoms present in the atomic arrangement that is the shortest route between the two carbonyl groups in the equation.
- RN1 and RN2 each independently represent a monovalent organic group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms), and a hydrocarbon group (preferably 3 to 12 carbon atoms). It is preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, still more preferably 1 to 10 carbon atoms), and specifically, an aliphatic hydrocarbon group (preferably 1 to 12 carbon atoms). Is more preferable) or an aromatic hydrocarbon group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, still more preferably 6 to 10 carbon atoms), and an aliphatic hydrocarbon can be mentioned. Groups are preferred.
- an aliphatic hydrocarbon group may have a substituent, and the aliphatic hydrocarbon group and the aromatic hydrocarbon group are contained in the aliphatic hydrocarbon chain or the aromatic ring. It may have an oxygen atom in the substituent.
- an embodiment in which the aliphatic hydrocarbon group has an oxygen atom in the hydrocarbon chain is exemplified.
- a linear or branched chain alkyl group, a cyclic alkyl group, a group related to a combination of a chain alkyl group and a cyclic alkyl group, and an oxygen atom are contained in the chain.
- Examples thereof include alkyl groups having.
- the linear or branched chain alkyl group preferably has 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, and even more preferably 3 to 12 carbon atoms.
- the linear or branched chain alkyl group is, for example, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an undecyl group, a dodecyl group, or an isopropyl group.
- Examples thereof include a group, an isobutyl group, a secondary butyl group, a tertiary butyl group, an isopentyl group, a neopentyl group, a tertiary pentyl group, and an isohexyl group.
- the cyclic alkyl group preferably has 3 to 12 carbon atoms, and more preferably 3 to 6 carbon atoms. Examples of the cyclic alkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cyclooctyl group and the like.
- the group related to the combination of the chain alkyl group and the cyclic alkyl group preferably has 4 to 24 carbon atoms, more preferably 4 to 18 carbon atoms, and even more preferably 4 to 12 carbon atoms.
- Examples of the group related to the combination of the chain alkyl group and the cyclic alkyl group include a cyclohexylmethyl group, a cyclohexylethyl group, a cyclohexylpropyl group, a methylcyclohexylmethyl group, an ethylcyclohexylethyl group and the like.
- the alkyl group having an oxygen atom in the chain is preferably 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, still more preferably 2 to 4 carbon atoms.
- the alkyl group having an oxygen atom in the chain may be chain-like or cyclic, and may be linear or branched. Among them, alkyl groups having 5 to 12 carbon atoms are preferable for RN1 and RN2 from the viewpoint of increasing the boiling point of the decomposition-generated base described later.
- a group having a cyclic alkyl group or an alkyl group having 1 to 8 carbon atoms is preferable.
- RN1 and RN2 may be connected to each other to form an annular structure.
- oxygen atoms or the like may be contained in the chain.
- the cyclic structure formed by RN1 and RN2 may be a monocyclic ring or a condensed ring, but a monocyclic ring is preferable.
- a 5-membered ring or a 6-membered ring containing a nitrogen atom in the formula (N1) is preferable, and for example, a pyrrol ring, an imidazole ring, a pyrazole ring, a pyrroline ring, a pyrrolidine ring, an imidazolidine ring, and the like.
- Pyrazolidine ring, piperidine ring, piperazine ring, morpholine ring and the like are mentioned, and pyrroline ring, pyrrolidine ring, piperidine ring, piperazine ring, morpholine ring and the like are preferable.
- RC1 represents a hydrogen atom or a protecting group, and a hydrogen atom is preferable.
- the protecting group a protecting group that decomposes by the action of an acid or a base is preferable, and a protecting group that decomposes by an acid is preferable.
- the protecting group include a chain or cyclic alkyl group or a chain or cyclic alkyl group having an oxygen atom in the chain.
- the chain or cyclic alkyl group include a methyl group, an ethyl group, an isopropyl group, a tert-butyl group, a cyclohexyl group and the like.
- Specific examples of the chain-like alkyl group having an oxygen atom in the chain include an alkyloxyalkyl group, and more specifically, a methyloxymethyl (MOM) group, an ethyloxyethyl (EE) group and the like. Can be mentioned.
- Examples of the cyclic alkyl group having an oxygen atom in the chain include an epoxy group, a glycidyl group, an oxetanyl group, a tetrahydrofuranyl group, a tetrahydropyranyl (THP) group and the like.
- the divalent linking group constituting L is not particularly specified, but a hydrocarbon group is preferable, and an aliphatic hydrocarbon group is more preferable.
- the hydrocarbon group may have a substituent, or may have an atom of a type other than a carbon atom in the hydrocarbon chain. More specifically, it is preferably a divalent hydrocarbon linking group which may have an oxygen atom in the chain, and a divalent aliphatic hydrocarbon which may have an oxygen atom in the chain. More preferably, a divalent aromatic hydrocarbon group or a group relating to a combination of a divalent aliphatic hydrocarbon group which may have an oxygen atom in the chain and a divalent aromatic hydrocarbon group is preferable.
- a divalent aliphatic hydrocarbon group which may have an oxygen atom in the chain is more preferable. It is preferable that these groups do not have an oxygen atom.
- the divalent hydrocarbon linking group preferably has 1 to 24 carbon atoms, more preferably 2 to 12 carbon atoms, and even more preferably 2 to 6 carbon atoms.
- the divalent aliphatic hydrocarbon group preferably has 1 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 4 carbon atoms.
- the divalent aromatic hydrocarbon group preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and even more preferably 6 to 10 carbon atoms.
- the group (for example, an arylene alkyl group) relating to the combination of the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group preferably has 7 to 22 carbon atoms, more preferably 7 to 18 carbon atoms, and 7 to 18 carbon atoms. 10 is more preferable.
- linking group L examples include a linear or branched chain alkylene group, a cyclic alkylene group, a group related to a combination of a chain alkylene group and a cyclic alkylene group, and an alkylene group having an oxygen atom in the chain.
- a linear or branched chain alkaneylene group, a cyclic alkaneylene group, an arylene group, or an arylene alkylene group is preferable.
- the linear or branched chain alkylene group preferably has 1 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 4 carbon atoms.
- the cyclic alkylene group preferably has 3 to 12 carbon atoms, and more preferably 3 to 6 carbon atoms.
- the group related to the combination of the chain alkylene group and the cyclic alkylene group preferably has 4 to 24 carbon atoms, more preferably 4 to 12 carbon atoms, and even more preferably 4 to 6 carbon atoms.
- the alkylene group having an oxygen atom in the chain may be chain-like or cyclic, and may be linear or branched.
- the alkylene group having an oxygen atom in the chain is preferably 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, still more preferably 1 to 3 carbon atoms.
- the linear or branched chain-like alkenylene group preferably has 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 3 carbon atoms.
- the cyclic alkenylene group preferably has 3 to 12 carbon atoms, and more preferably 3 to 6 carbon atoms.
- the arylene group preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and even more preferably 6 to 10 carbon atoms.
- the arylene alkylene group preferably has 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms, and even more preferably 7 to 11 carbon atoms.
- a chain alkylene group, a cyclic alkylene group, an alkylene group having an oxygen atom in the chain, a chain alkenylene group, an arylene group and an arylene alkylene group are preferable, and a 1,2-ethylene group and a propandiyl group (particularly 1, 3-Propanediyl group), cyclohexanediyl group (especially 1,2-cyclohexanediyl group), vinylene group (especially cisvinylene group), phenylene group (1,2-phenylene group), phenylene methylene group (especially 1,2-phenylene) Methylene group) and ethyleneoxyethylene group (particularly 1,2-ethyleneoxy-1,2-ethylene group) are more preferable.
- Examples of the base generator include the following, but the present invention is not construed as being limited thereto.
- the molecular weight of the non-ionic base generator is preferably 800 or less, more preferably 600 or less, and even more preferably 500 or less.
- the lower limit is preferably 100 or more, more preferably 200 or more, and even more preferably 300 or more.
- Specific preferable compounds of the ionic base generator include, for example, the compounds described in paragraphs 0148 to 0163 of International Publication No. 2018/038002.
- ammonium salt examples include, but are not limited to, the following compounds.
- iminium salt examples include, but are not limited to, the following compounds.
- the content of the base generator is preferably 0.1 to 50 parts by mass with respect to 100 parts by mass of the resin in the resin composition of the present invention.
- the lower limit is more preferably 0.3 parts by mass or more, and further preferably 0.5 parts by mass or more.
- the upper limit is more preferably 30 parts by mass or less, further preferably 20 parts by mass or less, further preferably 10 parts by mass or less, 5 parts by mass or less, or 4 parts by mass or less.
- the base generator one kind or two or more kinds can be used. When two or more kinds are used, the total amount is preferably in the above range.
- the resin composition of the present invention preferably contains a solvent.
- a solvent a known solvent can be arbitrarily used.
- the solvent is preferably an organic solvent.
- the organic solvent include compounds such as esters, ethers, ketones, cyclic hydrocarbons, sulfoxides, amides, ureas and alcohols.
- esters include ethyl acetate, -n-butyl acetate, isobutyl acetate, hexyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, and ⁇ -butyrolactone.
- alkylalkyloxyacetate eg, methyl alkyloxyacetate, ethyl alkyloxyacetate, butyl alkyloxyacetate (eg, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, etc.) (Ethyl ethoxyacetate, etc.)
- 3-alkyloxypropionic acid alkyl esters eg, methyl 3-alkyloxypropionic acid, ethyl 3-alkyloxypropionic acid, etc.) (eg, methyl 3-methoxypropionic acid, 3-methoxypropionic acid, etc.) (Ethyl, methyl 3-ethoxypropionic acid, ethyl 3-ethoxypropionic acid, etc.)
- 2-alkyloxypropionic acid alkyl esters eg, methyl 2-alkyloxypropionic acid alkyl esters
- Suitable examples include ethyl acid, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, ethyl hexanoate, ethyl heptanate, dimethyl malonate, diethyl malonate and the like. ..
- ethers include ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol butyl methyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, and ethylene glycol monoethyl ether.
- ketones for example, methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, 3-methylcyclohexanone, levoglucosenone, dihydrolevoglucosenone and the like are preferable.
- cyclic hydrocarbons for example, aromatic hydrocarbons such as toluene, xylene and anisole, and cyclic terpenes such as limonene are preferable.
- sulfoxides for example, dimethyl sulfoxide is preferable.
- N, N, N', N'-tetramethylurea, 1,3-dimethyl-2-imidazolidinone and the like are preferable.
- Alcohols include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 1-pentanol, 1-hexanol, benzyl alcohol, ethylene glycol monomethyl ether, 1-methoxy-2-propanol, 2-ethoxyethanol, Diethylene glycol monoethyl ether, diethylene glycol monohexyl ether, triethylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether, polyethylene glycol monomethyl ether, polypropylene glycol, tetraethylene glycol, ethylene glycol monobutyl ether, ethylene glycol monobenzyl ether, Examples thereof include ethylene glycol monophenyl ether, methylphenyl carbinol, n-amyl alcohol, methyl amyl alcohol, and diacetone alcohol.
- the solvent is preferably a mixture of two or more types from the viewpoint of improving the properties of the coated surface.
- the solvent content is preferably such that the total solid content concentration of the resin composition of the present invention is 5 to 80% by mass, and is preferably 5 to 75% by mass. It is more preferably 10 to 70% by mass, and even more preferably 20 to 70% by mass.
- the solvent content may be adjusted according to the desired thickness of the coating film and the coating method.
- the resin composition of the present invention may contain only one type of solvent, or may contain two or more types of solvent. When two or more kinds of solvents are contained, the total is preferably in the above range.
- the resin composition of the present invention preferably contains a metal adhesiveness improving agent for improving the adhesiveness with a metal material used for electrodes, wiring and the like.
- a metal adhesiveness improving agent for improving the adhesiveness with a metal material used for electrodes, wiring and the like.
- the metal adhesion improver include a silane coupling agent having an alkoxysilyl group, an aluminum-based adhesive aid, a titanium-based adhesive aid, a compound having a sulfonamide structure and a compound having a thiourea structure, a phosphoric acid derivative compound, and a ⁇ -ketoester. Examples thereof include compounds and amino compounds.
- silane coupling agent examples include the compound described in paragraph 0167 of International Publication No. 2015/199219, the compound described in paragraphs 0062 to 0073 of JP-A-2014-191002, paragraph of International Publication No. 2011/080992.
- examples thereof include the compounds described in paragraph 0055 and the compounds described in paragraphs 0067 to 0078 of JP-A-2018-173573, the contents of which are incorporated herein by reference.
- silane coupling agents examples include vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 3-glyceride.
- Aluminum-based adhesive aid examples include aluminum tris (ethyl acetoacetate), aluminum tris (acetyl acetonate), ethyl acetoacetate aluminum diisopropylate, and the like.
- the content of the metal adhesive improving agent is preferably in the range of 0.01 to 30 parts by mass, more preferably in the range of 0.01 to 10 parts by mass, and further preferably 0. It is in the range of 5 to 5 parts by mass.
- the metal adhesiveness improving agent may be only one kind or two or more kinds. When two or more kinds are used, it is preferable that the total is in the above range.
- the resin composition of the present invention preferably further contains a migration inhibitor.
- a migration inhibitor By including the migration inhibitor, it is possible to effectively suppress the movement of metal ions derived from the metal layer (metal wiring) into the membrane.
- the migration inhibitor is not particularly limited, but has a heterocyclic ring (pyran ring, furan ring, thiophene ring, imidazole ring, oxazole ring, thiazole ring, pyrazole ring, isooxazole ring, isothiazole ring, tetrazole ring, pyridine ring, etc.
- triazole compounds such as 1,2,4-triazole, benzotriazole, 3-amino-1,2,4-triazole, 3,5-diamino-1,2,4-triazole, 1H-tetrazole, 5- Tetrazole-based compounds such as phenyltetrazole and 5-amino-1H-tetrazole can be preferably used.
- an ion trap agent that traps anions such as halogen ions can also be used.
- Examples of other migration inhibitors include the rust preventive agent described in paragraph 0094 of JP2013-015701, the compound described in paragraphs 0073 to 0076 of JP2009-283711, and JP-A-2011-059656.
- the compounds described in paragraph 0052, the compounds described in paragraphs 0114, 0116 and 0118 of JP2012-194520A, the compounds described in paragraph 0166 of International Publication No. 2015/199219, and the like can be used. The content is incorporated herein.
- the migration inhibitor include the following compounds.
- the content of the migration inhibitor is preferably 0.01 to 5.0% by mass with respect to the total solid content of the resin composition of the present invention. , 0.05 to 2.0% by mass, more preferably 0.1 to 1.0% by mass.
- the migration inhibitor may be only one kind or two or more kinds. When there are two or more types of migration inhibitors, the total is preferably in the above range.
- the resin composition of the present invention preferably contains a polymerization inhibitor.
- the polymerization inhibitor include phenol-based compounds, quinone-based compounds, amino-based compounds, N-oxyl-free radical compound-based compounds, nitro-based compounds, nitroso-based compounds, heteroaromatic ring-based compounds, and metal compounds.
- Specific compounds of the polymerization inhibitor include p-hydroquinone, o-hydroquinone, o-methoxyphenol, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, p-tert-butylcatechol, 1, 4-benzoquinone, diphenyl-p-benzoquinone, 4,4'-thiobis (3-methyl-6-tert-butylphenol), 2,2'-methylenebis (4-methyl-6-tert-butylphenol), N-nitrosophenyl Hydroxyamine primary cerium salt, N-nitroso-N-phenylhydroxyamine aluminum salt, N-nitrosodiphenylamine, N-phenylnaphthylamine, ethylenediamine tetraacetic acid, 1,2-cyclohexanediamine tetraacetic acid, glycol etherdiamine tetraacetic acid, 2, 6-Di-tert-butyl-4-methylphenol
- polymerization inhibitor described in paragraph 0060 of JP-A-2015-127817 and the compound described in paragraphs 0031 to 0046 of International Publication No. 2015/125469 can also be used, and the contents thereof are described in the present specification. Be incorporated.
- the content of the polymerization inhibitor is preferably 0.01 to 20% by mass, preferably 0 to 20% by mass, based on the total solid content of the resin composition of the present invention. It is more preferably 0.02 to 15% by mass, and even more preferably 0.05 to 10% by mass.
- the polymerization inhibitor may be only one kind or two or more kinds. When there are two or more types of polymerization inhibitors, the total is preferably in the above range.
- the resin composition of the present invention comprises various additives such as a surfactant, a higher fatty acid derivative, a thermal polymerization initiator, an inorganic particle, and an ultraviolet absorber, if necessary, as long as the effects of the present invention can be obtained.
- Organic titanium compounds, antioxidants, antiaggregating agents, phenolic compounds, other polymer compounds, plasticizers and other auxiliaries eg, antifoaming agents, flame retardant agents, etc.
- properties such as film physical characteristics can be adjusted.
- the total blending amount is preferably 3% by mass or less of the solid content of the resin composition of the present invention.
- surfactant various surfactants such as a fluorine-based surfactant, a silicone-based surfactant, and a hydrocarbon-based surfactant can be used.
- the surfactant may be a nonionic surfactant, a cationic surfactant, or an anionic surfactant.
- the liquid characteristics (particularly, fluidity) when prepared as a coating liquid are further improved, and the uniformity of the coating thickness and the liquid saving property are further improved.
- the interfacial tension between the surface to be coated and the coating liquid is reduced, and the wettability to the surface to be coated is improved.
- the applicability to the surface to be coated is improved. Therefore, it is possible to more preferably form a film having a uniform thickness with small thickness unevenness.
- fluorine-based surfactant examples include Megafuck F171, F172, F173, F176, F177, F141, F142, F143, F144, R30, F437, F475, and F479.
- F482, F554, F780, RS-72-K above, manufactured by DIC Co., Ltd.
- Florard FC430, FC431, FC171, Novek FC4430, FC4432 aboveve, manufactured by 3M Japan Ltd.
- the compounds described in paragraphs 0015 to 0158 of JP-A-2015-117327 and the compounds described in paragraphs 0117 to 0132 of JP-A-2011-132503 can also be used. Incorporated herein.
- a block polymer can also be used as the fluorine-based surfactant, and specific examples thereof include compounds described in JP-A-2011-89090, the contents of which are incorporated in the present specification.
- the fluorine-based surfactant has a repeating unit derived from a (meth) acrylate compound having a fluorine atom and 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy groups and propyleneoxy groups) (meth).
- a fluorine-containing polymer compound containing a repeating unit derived from an acrylate compound can also be preferably used, and the following compounds are also exemplified as the fluorine-based surfactant used in the present invention.
- the weight average molecular weight of the above compounds is preferably 3,000 to 50,000, more preferably 5,000 to 30,000.
- a fluorine-based surfactant a fluorine-containing polymer having an ethylenically unsaturated group in the side chain can also be used as the fluorine-based surfactant. Specific examples thereof include the compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of JP2010-164965, the contents of which are incorporated in the present specification. Examples of commercially available products include Megafuck RS-101, RS-102, and RS-718K manufactured by DIC Corporation.
- the fluorine content in the fluorine-based surfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass.
- a fluorine-based surfactant having a fluorine content within this range is effective in terms of uniformity in the thickness of the coating film and liquid saving, and has good solubility in the composition.
- silicone-based surfactant examples include Torre Silicone DC3PA, Torre Silicone SH7PA, Torre Silicone DC11PA, Torre Silicone SH21PA, Torre Silicone SH28PA, Torre Silicone SH29PA, Torre Silicone SH30PA, Torre Silicone SH8400 (all, Toray Dow Corning Co., Ltd.). ), TSF-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), KP-341, KF6001, KF6002 (all manufactured by Shinetsu Silicone Co., Ltd.) ), BYK307, BYK323, BYK330 (all manufactured by Big Chemie Co., Ltd.) and the like.
- hydrocarbon-based surfactant examples include Pionin A-76, New Calgen FS-3PG, Pionin B-709, Pionin B-811-N, Pionin D-1004, Pionin D-3104, Pionin D-3605, and Pionin.
- Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and their ethoxylates and propoxylates (eg, glycerol propoxylates, glycerol ethoxylates, etc.), polyoxyethylene lauryl ethers, polyoxyethylene stearyl ethers, etc. Examples thereof include polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, and sorbitan fatty acid ester.
- organosiloxane polymer KP341 manufactured by Shin-Etsu Chemical Co., Ltd.
- (meth) acrylic acid-based (co) polymer Polyflow No. 75, No. 77, No. 90, No. Examples include 95 (manufactured by Kyoeisha Chemical Co., Ltd.) and W001 (manufactured by Yusho Co., Ltd.).
- anion-type surfactant examples include W004, W005, W017 (manufactured by Yusho Co., Ltd.), Sandet BL (manufactured by Sanyo Chemical Industries, Ltd.) and the like.
- the content of the surfactant is preferably 0.001 to 2.0% by mass, more preferably 0.005 to 1.0% by mass, based on the total solid content of the composition.
- the resin composition of the present invention is added with a higher fatty acid derivative such as behenic acid or behenic acid amide, and the resin composition of the present invention is dried in the process of drying after application. It may be unevenly distributed on the surface of.
- the content of the higher fatty acid derivative is preferably 0.1 to 10% by mass with respect to the total solid content of the resin composition of the present invention.
- the higher fatty acid derivative may be only one kind or two or more kinds. When there are two or more higher fatty acid derivatives, the total is preferably in the above range.
- the resin composition of the present invention may contain a thermal polymerization initiator, and may particularly contain a thermal radical polymerization initiator.
- the thermal radical polymerization initiator is a compound that generates radicals by heat energy to initiate or accelerate the polymerization reaction of a polymerizable compound. Since the polymerization reaction of the resin and the polymerizable compound can be promoted by adding the thermal radical polymerization initiator, the solvent resistance can be further improved. Further, the above-mentioned photopolymerization initiator may also have a function of initiating polymerization by heat, and may be added as a thermal polymerization initiator.
- thermal radical polymerization initiator examples include the compounds described in paragraphs 0074 to 0118 of JP-A-2008-063554, the contents of which are incorporated in the present specification.
- the content thereof is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, based on the total solid content of the resin composition of the present invention. , More preferably 0.5 to 15% by mass. Only one type of thermal polymerization initiator may be contained, or two or more types may be contained. When two or more kinds of thermal polymerization initiators are contained, the total amount is preferably in the above range.
- the resin composition of the present invention may contain inorganic particles.
- specific examples of the inorganic particles include calcium carbonate, calcium phosphate, silica, kaolin, talc, titanium dioxide, alumina, barium sulfate, calcium fluoride, lithium fluoride, zeolite, molybdenum sulfide, and glass.
- the average particle size of the inorganic particles is preferably 0.01 to 2.0 ⁇ m, more preferably 0.02 to 1.5 ⁇ m, further preferably 0.03 to 1.0 ⁇ m, and 0.04 to 0.5 ⁇ m. Especially preferable.
- the average particle size of the fine particles is the primary particle size and the volume average particle size.
- the volume average particle size can be measured by a dynamic light scattering method using Nanotrac WAVE II EX-150 (manufactured by Nikkiso Co., Ltd.). If the above measurement is difficult, it can be measured by a centrifugal sedimentation light transmission method, an X-ray transmission method, or a laser diffraction / scattering method.
- the composition of the present invention may contain an ultraviolet absorber.
- an ultraviolet absorber such as salicylate-based, benzophenone-based, benzotriazole-based, substituted acrylonitrile-based, or triazine-based can be used.
- salicylate-based UV absorbers include phenyl salicylate, p-octylphenyl salicylate, pt-butylphenyl salicylate and the like, and examples of benzophenone-based UV absorbers include 2,2'-dihydroxy-4-.
- Methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2', 4,4'-tetrahydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2,4-dihydroxybenzophenone, 2- Hydroxyl-4-octoxybenzophenone and the like can be mentioned.
- benzotriazole-based ultraviolet absorbers include 2- (2'-hydroxy-3', 5'-di-tert-butylphenyl) -5-chlorobenzotriazole and 2- (2'-hydroxy-3).
- Examples of the substituted acrylonitrile-based ultraviolet absorber include ethyl 2-cyano-3,3-diphenylacrylate, 2-ethylhexyl 2-cyano-3,3-diphenylacrylate, and the like.
- the triazine-based ultraviolet absorber 2- [4-[(2-hydroxy-3-dodecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) )-1,3,5-Triazine, 2- [4-[(2-Hydroxy-3-tridecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) Mono (hydroxyphenyl) triazine compounds such as -1,3,5-triazine, 2- (2,4-dihydroxyphenyl) -4,6-bis (2,4-dimethylphenyl) -1,3,5-triazin
- the above-mentioned various ultraviolet absorbers may be used alone or in combination of two or more.
- the composition of the present invention may or may not contain an ultraviolet absorber, but when it is contained, the content of the ultraviolet absorber is 0.001% by mass with respect to the total solid content mass of the composition of the present invention. It is preferably 1% by mass or less, and more preferably 0.01% by mass or more and 0.1% by mass or less.
- the resin composition of the present embodiment may contain an organic titanium compound. Since the resin composition contains an organic titanium compound, a resin layer having excellent chemical resistance can be formed even when cured at a low temperature.
- Examples of the organic titanium compound that can be used include those in which an organic group is bonded to a titanium atom via a covalent bond or an ionic bond.
- Specific examples of the organic titanium compound are shown in I) to VII) below:
- I) Titanium chelate compound Among them, a titanium chelate compound having two or more alkoxy groups is more preferable because the resin composition has good storage stability and a good curing pattern can be obtained.
- Specific examples are titanium bis (triethanolamine) diisopropoxiside, titanium di (n-butoxide) bis (2,4-pentanegenate, titanium diisopropoxiside bis (2,4-pentanegeonate)).
- Titanium Alkoxy Titanium Compounds For example, Titanium Tetra (n-Butoxide), Titanium Tetraethoxide, Titanium Tetra (2-ethylhexoxyside), Titanium Tetraisobutoxide, Titanium Tetraisopropoxyside, Titanium Tetramethoxide , Titanium Tetramethoxypropoxyside, Titanium Tetramethylphenoxide, Titanium Tetra (n-Noniloxide), Titanium Tetra (n-Propoxide), Titanium Tetrasteeryloxyside, Titanium Tetrakiss [Bis ⁇ 2,2- (Aryloxymethyl) Butokiside ⁇ ] etc.
- Titanocene compounds for example, pentamethylcyclopentadienyl titanium trimethoxide, bis ( ⁇ 5-2,4-cyclopentadiene-1-yl) bis (2,6-difluorophenyl) titanium, bis ( ⁇ 5-2, 2). 4-Cyclopentadiene-1-yl) bis (2,6-difluoro-3- (1H-pyrrole-1-yl) phenyl) titanium and the like.
- Monoalkoxytitanium compound For example, titaniumtris (dioctylphosphate) isopropoxyside, titaniumtris (dodecylbenzenesulfonate) isopropoxyside and the like.
- Titanium oxide compound For example, titanium oxide bis (pentanionate), titanium oxide bis (tetramethylheptandionate), phthalocyanine titanium oxide and the like.
- the organic titanium compound at least one compound selected from the group consisting of the above-mentioned I) titanium chelate compound, II) tetraalkoxytitanium compound, and III) titanocene compound has better chemical resistance. It is preferable from the viewpoint of playing.
- -Pyrrole-1-yl) phenyl) titanium is preferred.
- the blending amount is preferably 0.05 to 10 parts by mass, more preferably 0.1 to 2 parts by mass with respect to 100 parts by mass of the specific resin.
- the blending amount is 0.05 parts by mass or more, good heat resistance and chemical resistance are more effectively exhibited in the obtained curing pattern, while when it is 10 parts by mass or less, the storage stability of the composition Excellent.
- the composition of the present invention may contain an antioxidant.
- an antioxidant By containing an antioxidant as an additive, it is possible to improve the elongation characteristics of the film after curing and the adhesion with a metal material.
- the antioxidant include phenol compounds, phosphite ester compounds, thioether compounds and the like.
- the phenol compound any phenol compound known as a phenolic antioxidant can be used.
- Preferred phenolic compounds include hindered phenolic compounds.
- a compound having a substituent at a site (ortho position) adjacent to the phenolic hydroxy group is preferable.
- a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferable.
- a compound having a phenol group and a phosphite ester group in the same molecule is also preferable.
- a phosphorus-based antioxidant can also be preferably used.
- antioxidants include, for example, Adekastab AO-20, Adekastab AO-30, Adekastab AO-40, Adekastab AO-50, Adekastab AO-50F, Adekastab AO-60, Adekastab AO-60G, and Adekastab AO-80. , ADEKA STAB AO-330 (above, manufactured by ADEKA Corporation) and the like.
- the antioxidant the compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967 can also be used, and the contents thereof are incorporated in the present specification.
- the composition of the present invention may contain a latent antioxidant, if necessary.
- the latent antioxidant is a compound in which the site that functions as an antioxidant is protected by a protecting group, and is heated at 100 to 250 ° C. or at 80 to 200 ° C. in the presence of an acid / base catalyst. This includes compounds in which the protecting group is desorbed and functions as an antioxidant.
- Examples of the latent antioxidant include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219, the contents of which are incorporated in the present specification.
- Examples of commercially available products of latent antioxidants include ADEKA ARKULS GPA-5001 (manufactured by ADEKA Corporation).
- preferred antioxidants include 2,2-thiobis (4-methyl-6-t-butylphenol), 2,6-di-t-butylphenol and compounds of formula (3).
- R 5 represents a hydrogen atom or an alkyl group having 2 or more carbon atoms (preferably 2 to 10 carbon atoms), and R 6 represents an alkylene having 2 or more carbon atoms (preferably 2 to 10 carbon atoms). Represents a group.
- R 7 represents a 1- to tetravalent organic group containing at least one of an alkylene group having 2 or more carbon atoms (preferably 2 to 10 carbon atoms), an oxygen atom, and a nitrogen atom.
- k represents an integer of 1 to 4.
- the compound represented by the formula (3) suppresses the oxidative deterioration of the aliphatic group and the phenolic hydroxyl group of the resin.
- metal oxidation can be suppressed by the rust preventive action on the metal material.
- k is more preferably an integer of 2 to 4.
- R7 include an alkyl group, a cycloalkyl group, an alkoxy group, an alkyl ether group, an alkylsilyl group, an alkoxysilyl group, an aryl group, an arylether group, a carboxyl group, a carbonyl group, an allyl group, a vinyl group, a heterocyclic group, and-.
- R7 include an alkyl group, a cycloalkyl group, an alkoxy group, an alkyl ether group, an alkylsilyl group, an alkoxysilyl group, an aryl group, an arylether group, a carboxyl group, a carbonyl group, an allyl group, a vinyl group, a heterocyclic group, and-.
- Examples thereof include O-, -NH-, -NHNH-, and combinations thereof, and may further have a substituent.
- alkyl ether group and -NH- from the viewpoint of solubility in a developing solution and metal adhesion
- -NH- is preferable from the viewpoint of interaction with a resin and metal adhesion due to metal complex formation. More preferred.
- Examples of the compound represented by the general formula (3) include the following, but the compound is not limited to the following structure.
- the amount of the antioxidant added is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass with respect to the resin.
- the addition amount is 0.1 part by mass or more, the effect of improving the elongation property and the adhesion to the metal material can be easily obtained even in a high temperature and high humidity environment, and when the addition amount is 10 parts by mass or less, for example, the emulsion is exposed.
- the interaction with the agent improves the sensitivity of the resin composition.
- Only one kind of antioxidant may be used, or two or more kinds may be used. When two or more kinds are used, it is preferable that the total amount thereof is within the above range.
- the resin composition of the present embodiment may contain an anti-aggregation agent, if necessary.
- the anti-aggregation agent include sodium polyacrylate and the like.
- one type of anti-aggregation agent may be used alone, or two or more types may be used in combination.
- the composition of the present invention may or may not contain an anti-aggregation agent, but when it is contained, the content of the anti-aggregation agent is 0.01% by mass with respect to the total solid content mass of the composition of the present invention. It is preferably 10% by mass or less, and more preferably 0.02% by mass or more and 5% by mass or less.
- the resin composition of the present embodiment may contain a phenolic compound, if necessary.
- phenolic compound include Bis-Z, BisP-EZ, TekP-4HBPA, TrisP-HAP, TrisP-PA, BisOCHP-Z, BisP-MZ, BisP-PZ, BisP-IPZ, BisOCP-IPZ, and BisP-CP.
- one type of phenolic compound may be used alone, or two or more types may be used in combination.
- the composition of the present invention may or may not contain a phenolic compound, but when it is contained, the content of the phenolic compound is 0.01% by mass with respect to the total solid content mass of the composition of the present invention. It is preferably 30% by mass or more, and more preferably 0.02% by mass or more and 20% by mass or less.
- Examples of other polymer compounds include siloxane resins, (meth) acrylic polymers copolymerized with (meth) acrylic acids, novolak resins, resole resins, polyhydroxystyrene resins and copolymers thereof.
- the other polymer compound may be a modified product into which a cross-linking group such as a methylol group, an alkoxymethyl group, or an epoxy group is introduced.
- one type of other polymer compound may be used alone, or two or more types may be used in combination.
- the composition of the present invention may or may not contain other polymer compounds, but when it is contained, the content of the other polymer compounds is 0 with respect to the total solid content mass of the composition of the present invention. It is preferably 0.01% by mass or more and 30% by mass or less, and more preferably 0.02% by mass or more and 20% by mass or less.
- the viscosity of the resin composition of the present invention can be adjusted by adjusting the solid content concentration of the resin composition. From the viewpoint of the coating film thickness, 1,000 mm 2 / s to 12,000 mm 2 / s is preferable, 2,000 mm 2 / s to 10,000 mm 2 / s is more preferable, and 2,500 mm 2 / s to 8,000 mm. 2 / s is more preferable. Within the above range, it becomes easy to obtain a highly uniform coating film.
- the water content of the resin composition of the present invention is preferably less than 2.0% by mass, more preferably less than 1.5% by mass, and even more preferably less than 1.0% by mass. If it is less than 2.0%, the storage stability of the resin composition is improved. Examples of the method for maintaining the water content include adjusting the humidity under storage conditions and reducing the porosity of the storage container during storage.
- the metal content of the resin composition of the present invention is preferably less than 5 parts by mass (parts per million), more preferably less than 1 part by mass, still more preferably less than 0.5 parts by mass, from the viewpoint of insulating properties.
- the metal include sodium, potassium, magnesium, calcium, iron, copper, chromium, nickel and the like, but metals contained as a complex of an organic compound and a metal are excluded. When a plurality of metals are contained, it is preferable that the total of these metals is in the above range.
- the resin composition of the present invention selects a raw material having a low metal content as the raw material constituting the resin composition of the present invention.
- examples thereof include a method of filtering the raw materials constituting the product by a filter, a method of lining the inside of the device with polytetrafluoroethylene or the like, and performing distillation under conditions in which contamination is suppressed as much as possible.
- the resin composition of the present invention preferably has a halogen atom content of less than 500 mass ppm, more preferably less than 300 mass ppm, and less than 200 mass ppm from the viewpoint of wiring corrosiveness. Is more preferable. Among them, those existing in the state of halogen ions are preferably less than 5 mass ppm, more preferably less than 1 mass ppm, and even more preferably less than 0.5 mass ppm.
- the halogen atom include a chlorine atom and a bromine atom. It is preferable that the total amount of chlorine atom and bromine atom, or chlorine ion and bromine ion is in the above range, respectively.
- ion exchange treatment and the like are preferably mentioned.
- a conventionally known storage container can be used as the storage container for the resin composition of the present invention.
- a multi-layer bottle having a container inner wall made of 6 types and 6 layers of resin and 6 types of resin can be used. It is also preferable to use a bottle having a 7-layer structure. Examples of such a container include the container described in Japanese Patent Application Laid-Open No. 2015-123351.
- the cured product of the present invention is a cured product obtained by curing the resin composition of the present invention.
- the curing of the resin composition is preferably by heating, more preferably the heating temperature is in the range of 120 ° C to 400 ° C, further preferably in the range of 140 ° C to 380 ° C, and 170 ° C. It is particularly preferable that the temperature is in the range of about 350 ° C.
- the form of the cured product of the resin composition is not particularly limited, and can be selected according to the intended use, such as a film shape, a rod shape, a spherical shape, and a pellet shape.
- the cured product is preferably in the form of a film.
- this cured product can be used for forming a protective film on the wall surface, forming via holes for conduction, adjusting impedance, capacitance or internal stress, and imparting a heat dissipation function. You can also choose the shape.
- the film thickness of this cured product (film made of the cured product) is preferably 0.5 ⁇ m or more and 150 ⁇ m or less.
- the shrinkage rate of the resin composition of the present invention when cured is preferably 50% or less, more preferably 45% or less, still more preferably 40% or less.
- the imidization reaction rate of the cured product of the resin composition of the present invention is preferably 70% or more, more preferably 80% or more, still more preferably 90% or more. If it is 70% or more, it may be a cured product having excellent mechanical properties.
- the elongation at break of the cured product of the resin composition of the present invention is preferably 30% or more, more preferably 40% or more, still more preferably 50% or more.
- the glass transition temperature (Tg) of the cured product of the resin composition of the present invention is preferably 180 ° C. or higher, more preferably 210 ° C. or higher, and even more preferably 230 ° C. or higher.
- the resin composition of the present invention can be prepared by mixing each of the above components.
- the mixing method is not particularly limited, and a conventionally known method can be used. For mixing, mixing with a stirring blade, mixing with a ball mill, mixing by rotating the tank itself, or the like can be adopted.
- the temperature during mixing is preferably 10 to 30 ° C, more preferably 15 to 25 ° C.
- the filter hole diameter may be, for example, 5 ⁇ m or less, preferably 1 ⁇ m or less, more preferably 0.5 ⁇ m or less, still more preferably 0.1 ⁇ m or less.
- the filter material is preferably polytetrafluoroethylene, polyethylene or nylon. When the material of the filter is polyethylene, it is more preferable to use HDPE (high density polyethylene).
- the filter may be one that has been pre-cleaned with an organic solvent. In the filter filtration step, a plurality of types of filters may be connected in series or in parallel for use.
- filters having different pore diameters or materials may be used in combination.
- the connection mode include a mode in which an HDPE filter having a hole diameter of 1 ⁇ m is connected in series as the first stage and an HDPE filter having a hole diameter of 0.2 ⁇ m is connected in series as the second stage.
- various materials may be filtered a plurality of times. When filtering multiple times, circulation filtration may be used. Moreover, you may pressurize and perform filtration.
- the pressure to be pressurized is, for example, 0.01 MPa or more and 1.0 MPa or less, preferably 0.03 MPa or more and 0.9 MPa or less, and more preferably 0.05 MPa or more and 0.7 MPa or less. , 0.05 MPa or more and 0.5 MPa or less is more preferable.
- impurities may be removed using an adsorbent. Filter filtration and impurity removal treatment using an adsorbent may be combined.
- the adsorbent a known adsorbent can be used. Examples thereof include inorganic adsorbents such as silica gel and zeolite, and organic adsorbents such as activated carbon.
- the resin composition filled in the bottle may be placed under reduced pressure to perform a step of degassing.
- the method for producing a cured product of the present invention preferably includes a film forming step of applying a resin composition onto a substrate to form a film. Further, in the method for producing a cured product of the present invention, the film forming step, the exposure step of selectively exposing the film formed by the film forming step, and the film exposed by the exposure step are developed using a developing solution. It is more preferable to include a developing step of forming a pattern.
- the method for producing a cured product of the present invention includes the film forming step, the exposure step, the developing step, and the heating step for heating the pattern obtained by the developing step and the post-development for exposing the pattern obtained by the developing step.
- the production method of the present invention includes the above-mentioned film forming step and the above-mentioned step of heating the film.
- the production method of the present invention includes the above-mentioned film forming step and the above-mentioned step of heating the film.
- the resin composition of the present invention can be applied to a substrate to form a film and can be used in a film forming step.
- the method for producing a cured product of the present invention preferably includes a film forming step of applying a resin composition onto a substrate to form a film.
- the type of the base material can be appropriately determined depending on the application, but semiconductor-made base materials such as silicon, silicon nitride, polysilicon, silicon oxide, and amorphous silicon, quartz, glass, optical film, ceramic material, vapor-deposited film, etc.
- semiconductor-made base materials such as silicon, silicon nitride, polysilicon, silicon oxide, and amorphous silicon, quartz, glass, optical film, ceramic material, vapor-deposited film, etc.
- a magnetic film, a reflective film, a metal substrate such as Ni, Cu, Cr, or Fe for example, a substrate formed of metal, or a substrate in which a metal layer is formed by, for example, plating or vapor deposition, etc.
- SOG Spin On Glass
- TFT thin film array base material
- mold base material mold base material
- electrode plate of plasma display panel (PDP) and the like, and are not particularly limited.
- a semiconductor-made base material is particularly preferable, and a silicon base material, a Cu base material, and a molded base material are more preferable. Further, these substrates may be provided with a layer such as an adhesion layer or an oxide layer made of hexamethyldisilazane (HMDS) or the like on the surface thereof.
- the shape of the base material is not particularly limited, and may be circular or rectangular. The size of the base material is, for example, 100 to 450 mm in diameter, preferably 200 to 450 mm in a circular shape. If it is rectangular, for example, the length of the short side is 100 to 1000 mm, preferably 200 to 700 mm.
- a plate-shaped base material (substrate), preferably a panel-shaped base material (board) is used as the base material.
- a resin composition when a resin composition is applied to the surface of a resin layer (for example, a layer made of a cured product) or the surface of a metal layer to form a film, the resin layer or the metal layer becomes a base material.
- Coating is preferable as a means for applying the resin composition of the present invention on a substrate.
- the means to be applied include a dip coating method, an air knife coating method, a curtain coating method, a wire bar coating method, a gravure coating method, an extrusion coating method, a spray coating method, a spin coating method, and a slit coating method.
- An inkjet method and the like are exemplified. From the viewpoint of film thickness uniformity, a spin coating method, a slit coating method, a spray coating method, or an inkjet method is more preferable, and spin coating is performed from the viewpoint of film thickness uniformity and productivity.
- the method and the slit coating method are preferable. By adjusting the solid content concentration and the coating conditions of the resin composition according to the method, a film having a desired thickness can be obtained.
- the coating method can be appropriately selected depending on the shape of the substrate.
- a spin coating method, a spray coating method, an inkjet method, etc. are preferable, and for a rectangular substrate, a slit coating method or a spray coating method is preferable.
- the method, the inkjet method and the like are preferable.
- the spin coating method for example, it can be applied at a rotation speed of 500 to 3,500 rpm for about 10 seconds to 3 minutes. Further, it is also possible to apply a method of transferring a coating film previously applied onto a temporary support by the above-mentioned application method onto a substrate.
- the production method described in paragraphs 0023 and 0036 to 0051 of JP-A-2006-023696 and paragraphs 0090 to 0108 of JP-A-2006-047592 can be suitably used in the present invention.
- a step of removing the excess film at the end of the base material may be performed. Examples of such a process include edge bead rinse (EBR), back rinse and the like.
- EBR edge bead rinse
- a pre-wet step of applying various solvents to the base material before applying the resin composition to the base material to improve the wettability of the base material and then applying the resin composition may be adopted.
- the film may be subjected to a step (drying step) of drying the film (layer) formed to remove the solvent after the film forming step (layer forming step). That is, the method for producing a cured product of the present invention may include a drying step of drying the film formed by the film forming step. Further, it is preferable that the drying step is performed after the film forming step and before the exposure step.
- the drying temperature of the film in the drying step is preferably 50 to 150 ° C, more preferably 70 ° C to 130 ° C, still more preferably 90 ° C to 110 ° C. Further, drying may be performed by reducing the pressure.
- the drying time is exemplified by 30 seconds to 20 minutes, preferably 1 minute to 10 minutes, more preferably 2 minutes to 7 minutes.
- the film may be subjected to an exposure step of selectively exposing the film. That is, the method for producing a cured product of the present invention may include an exposure step of selectively exposing the film formed by the film forming step. Selective exposure means exposing a part of the film. Further, by selectively exposing the film, an exposed region (exposed portion) and an unexposed region (non-exposed portion) are formed on the film.
- the exposure amount is not particularly determined as long as the resin composition of the present invention can be cured, but for example, it is preferably 50 to 10,000 mJ / cm 2 in terms of exposure energy at a wavelength of 365 nm, and 200 to 8,000 mJ / cm 2 . Is more preferable.
- the exposure wavelength can be appropriately set in the range of 190 to 1,000 nm, preferably 240 to 550 nm.
- the exposure wavelengths are as follows: (1) semiconductor laser (wavelength 830 nm, 532 nm, 488 nm, 405 nm, 375 nm, 355 nm etc.), (2) metal halide lamp, (3) high-pressure mercury lamp, g-ray (wavelength). 436 nm), h-ray (wavelength 405 nm), i-line (wavelength 365 nm), broad (three wavelengths of g, h, i-line), (4) excimer laser, KrF excimer laser (wavelength 248 nm), ArF excimer laser (wavelength 193 nm).
- the resin composition of the present invention is particularly preferably exposed to a high-pressure mercury lamp, and above all, to be exposed to i-rays. As a result, particularly high exposure sensitivity can be obtained.
- the exposure method is not particularly limited as long as it is a method in which at least a part of the film made of the resin composition of the present invention is exposed, but exposure using a photomask, exposure by a laser direct imaging method, or the like is possible. Can be mentioned.
- the film may be subjected to a step of heating after exposure (post-exposure heating step). That is, the method for producing a cured product of the present invention may include a post-exposure heating step of heating the film exposed by the exposure step.
- the post-exposure heating step can be performed after the exposure step and before the developing step.
- the heating temperature in the post-exposure heating step is preferably 50 ° C to 140 ° C, more preferably 60 ° C to 120 ° C.
- the heating time in the post-exposure heating step is preferably 30 seconds to 300 minutes, more preferably 1 minute to 10 minutes.
- the heating rate in the post-exposure heating step is preferably 1 to 12 ° C./min, more preferably 2 to 10 ° C./min, and even more preferably 3 to 10 ° C./min from the temperature at the start of heating to the maximum heating temperature. Further, the heating rate may be appropriately changed during heating.
- the heating means in the post-exposure heating step is not particularly limited, and a known hot plate, oven, infrared heater, or the like can be used. Further, it is also preferable to carry out the heating in an atmosphere having a low oxygen concentration by flowing an inert gas such as nitrogen, helium or argon.
- the film after exposure may be subjected to a developing step of developing with a developing solution to form a pattern.
- the method for producing a cured product of the present invention may include a developing step of developing a film exposed by the exposure step with a developing solution to form a pattern.
- a developing step of developing a film exposed by the exposure step with a developing solution to form a pattern By performing the development, one of the exposed portion and the non-exposed portion of the film is removed, and a pattern is formed.
- the development in which the non-exposed portion of the film is removed by the developing process is referred to as negative type development
- the development in which the exposed portion of the film is removed by the developing process is referred to as positive type development.
- Examples of the developing solution used in the developing step include an alkaline aqueous solution or a developing solution containing an organic solvent.
- the developing solution is an alkaline aqueous solution
- examples of the basic compound that the alkaline aqueous solution can contain include inorganic alkalis, primary amines, secondary amines, tertiary amines, and quaternary ammonium salts.
- TMAH Tetramethylammonium Hydroxide
- potassium hydroxide sodium carbonate, sodium hydroxide, sodium silicate, sodium metasilicate, ammonia, ethylamine, n-propylamine, diethylamine, di-n-butylamine, triethylamine, methyldiethylamine , Dimethylethanolamine, Triethanolamine, Tetraethylammonium Hydroxide, Tetrapropylammonium Hydroxide, Tetrabutylammonium Hydroxide, Tetrapentyl Ammonium Hydroxide, Tetrahexyl Ammonium Hydroxide, Tetraoctyl Ammonium Hydroxide, Ethyltrimethylammonium Hydroxide , Butyltrimethylammonium Hydroxide, Methyltriamylammonium Hydroxide, Dibutyldipentylammonium Hydroxide, dimethylbis (2-Hydroxyethyl) Ammonium Hydroxide, tri
- the organic solvent may be, for example, ethyl acetate, -n-butyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, etc.
- alkyl alkyloxyacetate eg, methyl alkyloxyacetate, ethyl alkyloxyacetate, butyl alkyloxyacetate (eg, methyl methoxyacetate, ethyl methoxy
- Ethyl, etc. methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutate, ethyl 2-oxobutate, etc., and as ethers, for example, diethylene glycol dimethyl ether, tetrahydrofuran, etc.
- Ethylene glycol monomethyl ether ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), propylene Glycol monoethyl ether acetate, propylene Glycolmonopropyl ether acetate and the like, and as ketones, for example, methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, N-methyl-2-pyrrolidone, etc., and as cyclic hydrocarbons, for example, for example.
- ketones for example, methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-h
- Aromatic hydrocarbons such as toluene, xylene, and anisole, cyclic terpenes such as limonene, dimethylsulfoxide as sulfoxides, and methanol, ethanol, propanol, isopropanol, butanol, pentanol, octanol, and diethylene glycol as alcohols.
- Preferable examples thereof include propylene glycol, methylisobutylcarbinol, triethyleneglycol and the like
- examples of the amides include N-methylpyrrolidone, N-ethylpyrrolidone and dimethylformamide.
- the developer contains an organic solvent
- one type or a mixture of two or more types of organic solvent can be used.
- a developer containing at least one selected from the group consisting of cyclopentanone, ⁇ -butyrolactone, dimethyl sulfoxide, N-methyl-2-pyrrolidone, and cyclohexanone is particularly preferable, and cyclopentanone and ⁇ -butyrolactone are preferable.
- a developer containing at least one selected from the group consisting of dimethyl sulfoxide and dimethyl sulfoxide is more preferable, and a developer containing cyclopentanone is most preferable.
- the content of the organic solvent with respect to the total mass of the developer is preferably 50% by mass or more, more preferably 70% by mass or more, and more preferably 80% by mass or more. Is more preferable, and 90% by mass or more is particularly preferable. Further, the content may be 100% by mass.
- the developer may further contain other components.
- other components include known surfactants and known defoaming agents.
- the method of supplying the developing solution is not particularly limited as long as a desired pattern can be formed, and the method of immersing the base material on which the film is formed in the developing solution and the method of supplying the developing solution to the film formed on the base material using a nozzle.
- the type of nozzle is not particularly limited, and examples thereof include a straight nozzle, a shower nozzle, and a spray nozzle.
- the method of supplying the developing solution with a straight nozzle or the method of continuously supplying the developing solution with a spray nozzle is preferable. From the viewpoint of permeability, the method of supplying with a spray nozzle is more preferable. Further, after the developer is continuously supplied by the straight nozzle, the base material is spun to remove the developer from the base material, and after spin drying, the developer is continuously supplied by the straight nozzle again, and then the base material is spun to use the developer as the base material. A step of removing from the top may be adopted, or this step may be repeated a plurality of times.
- a process in which the developer is continuously supplied to the substrate a process in which the developer is kept in a substantially stationary state on the substrate, and a process in which the developer is superposed on the substrate.
- a process of vibrating with a sound wave or the like and a process of combining them can be adopted.
- the development time is preferably 10 seconds to 10 minutes, more preferably 20 seconds to 5 minutes.
- the temperature of the developing solution at the time of development is not particularly determined, but is preferably 10 to 45 ° C, more preferably 18 ° C to 30 ° C.
- the pattern may be further washed (rinsed) with the rinsing solution. Further, a method such as supplying a rinse liquid before the developer in contact with the pattern is completely dried may be adopted.
- the developing solution is an alkaline aqueous solution
- water can be used as the rinsing solution.
- the developer is a developer containing an organic solvent, for example, a solvent different from the solvent contained in the developer (for example, water or an organic solvent different from the organic solvent contained in the developer) is used as the rinse solution. be able to.
- the ethers include, for example, ethyl acetate, -n-butyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate.
- alkyl alkyloxyacetate eg, methyl alkyloxyacetate, ethyl alkyloxyacetate, butyl alkyloxyacetate (eg, methyl methoxyacetate, methoxyacetic acid) Eth
- 2-alkyloxypropionate alkyl esters eg, methyl 2-alkyl
- Ethylene glycol monomethyl ether Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), Propylene glycol monoethyl ether acetate, propionate Lopyrene glycol monopropyl ether acetate and the like, and as ketones, for example, methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, N-methyl-2-pyrrolidone and the like, and as cyclic hydrocarbons, for example.
- ketones for example, methyl ethyl ketone, cyclohexanone,
- the rinsing liquid contains an organic solvent
- one type or a mixture of two or more types of organic solvent can be used.
- cyclopentanone, ⁇ -butyrolactone, dimethyl sulfoxide, N-methylpyrrolidone, cyclohexanone, PGMEA, PGME are particularly preferable, cyclopentanone, ⁇ -butyrolactone, dimethyl sulfoxide, PGMEA, PGME are more preferable, and cyclohexanone and PGMEA are preferable. More preferred.
- the rinsing liquid contains an organic solvent
- 50% by mass or more of the rinsing liquid is preferably an organic solvent, 70% by mass or more is more preferably an organic solvent, and 90% by mass or more is an organic solvent. Is more preferable.
- the rinse liquid may be 100% by mass of an organic solvent.
- the rinse solution may further contain other components.
- other components include known surfactants and known defoaming agents.
- the method of supplying the rinsing liquid is not particularly limited as long as a desired pattern can be formed, and the method of immersing the base material in the rinsing liquid, the method of supplying the rinsing liquid to the base material by filling, and the method of supplying the rinsing liquid to the base material by a shower.
- the method of supplying the rinse liquid with a shower nozzle, a straight nozzle, a spray nozzle, etc. there is a method of supplying the rinse liquid with a spray nozzle is preferable. From the viewpoint of the permeability of the rinse liquid into the image portion, the method of supplying with a spray nozzle is more preferable.
- the type of nozzle is not particularly limited, and examples thereof include a straight nozzle, a shower nozzle, and a spray nozzle.
- the rinsing step is preferably a step of supplying the rinsing liquid to the exposed film by a straight nozzle or continuously, and more preferably a step of supplying the rinsing liquid by a spray nozzle.
- a method of supplying the rinse liquid in the rinsing step a step of continuously supplying the rinse liquid to the base material, a step of keeping the rinse liquid in a substantially stationary state on the base material, and a step of superimposing the rinse liquid on the base material.
- a process of vibrating with a sound wave or the like and a process of combining them can be adopted.
- the rinsing time is preferably 10 seconds to 10 minutes, more preferably 20 seconds to 5 minutes.
- the temperature of the rinsing liquid at the time of rinsing is not particularly determined, but is preferably 10 to 45 ° C, more preferably 18 ° C to 30 ° C.
- the pattern obtained by the developing step (in the case of performing the rinsing step, the pattern after rinsing) may be subjected to a heating step of heating the pattern obtained by the above-mentioned development. That is, the method for producing a cured product of the present invention may include a heating step of heating the pattern obtained by the developing step. Further, the method for producing a cured product of the present invention may include a pattern obtained by another method without performing a developing step, or a heating step of heating the film obtained by the film forming step. In the heating step, the resin such as the polyimide precursor is cyclized to become the resin such as polyimide.
- the heating temperature (maximum heating temperature) in the heating step is preferably 50 to 450 ° C, more preferably 150 to 350 ° C, further preferably 150 to 250 ° C, further preferably 160 to 250 ° C, and particularly preferably 160 to 230 ° C. preferable.
- the heating step is preferably a step of promoting the cyclization reaction of the polyimide precursor in the pattern by the action of the base or the like generated from the base generator by heating.
- the heating in the heating step is preferably performed at a heating rate of 1 to 12 ° C./min from the temperature at the start of heating to the maximum heating temperature.
- the temperature rising rate is more preferably 2 to 10 ° C./min, even more preferably 3 to 10 ° C./min.
- the temperature at the start of heating it is preferable to carry out from the temperature at the start of heating to the maximum heating temperature at a heating rate of 1 to 8 ° C./sec, more preferably 2 to 7 ° C./sec, and 3 to 6 ° C. °C / sec is more preferable.
- the temperature at the start of heating is preferably 20 ° C to 150 ° C, more preferably 20 ° C to 130 ° C, and even more preferably 25 ° C to 120 ° C.
- the temperature at the start of heating refers to the temperature at which the process of heating to the maximum heating temperature is started.
- the resin composition of the present invention when applied onto a substrate and then dried, it is the temperature of the film (layer) after drying, for example, from the boiling point of the solvent contained in the resin composition of the present invention.
- the heating time (heating time at the maximum heating temperature) is preferably 5 to 360 minutes, more preferably 10 to 300 minutes, and even more preferably 15 to 240 minutes.
- the heating temperature is preferably 30 ° C. or higher, more preferably 80 ° C. or higher, still more preferably 100 ° C. or higher, from the viewpoint of adhesion between layers. It is particularly preferable that the temperature is 120 ° C. or higher.
- the upper limit of the heating temperature is preferably 350 ° C. or lower, more preferably 250 ° C. or lower, and even more preferably 240 ° C. or lower.
- Heating may be performed in stages. As an example, the temperature is raised from 25 ° C. to 120 ° C. at 3 ° C./min and held at 120 ° C. for 60 minutes, the temperature is raised from 120 ° C. to 180 ° C. at 2 ° C./min, and the temperature is kept at 180 ° C. for 120 minutes. , And so on. Further, it is also preferable to perform the treatment while irradiating with ultraviolet rays as described in US Pat. No. 9,159,547. It is possible to improve the characteristics of the film by such a pretreatment step.
- the pretreatment step may be performed in a short time of about 10 seconds to 2 hours, more preferably 15 seconds to 30 minutes.
- the pretreatment may be performed in two or more steps, for example, the first pretreatment step may be performed in the range of 100 to 150 ° C., and then the second pretreatment step may be performed in the range of 150 to 200 ° C. good. Further, cooling may be performed after heating, and the cooling rate in this case is preferably 1 to 5 ° C./min.
- the heating step is preferably carried out in an atmosphere having a low oxygen concentration by flowing an inert gas such as nitrogen, helium or argon or under reduced pressure in order to prevent decomposition of the specific resin.
- the oxygen concentration is preferably 50 ppm (volume ratio) or less, and more preferably 20 ppm (volume ratio) or less.
- the heating means in the heating step is not particularly limited, and examples thereof include a hot plate, an infrared furnace, an electric heating oven, a hot air oven, and an infrared oven.
- the method for producing a cured product of the present invention may include a post-development exposure step for exposing the pattern obtained by the developing step.
- the method for producing a cured product of the present invention may include a heating step and a post-development exposure step, or may include only one of a heating step and a post-development exposure step.
- the post-development exposure step for example, it is possible to promote a reaction in which the cyclization of the polyimide precursor or the like proceeds by exposure to a photobase generator.
- the post-development exposure step at least a part of the pattern obtained in the development step may be exposed, but it is preferable that all of the above patterns are exposed.
- the exposure amount in the post-development exposure step is preferably 50 to 20,000 mJ / cm 2 and more preferably 100 to 15,000 mJ / cm 2 in terms of exposure energy at a wavelength at which the photosensitive compound has sensitivity. preferable.
- the post-development exposure step can be performed using, for example, the light source in the above-mentioned exposure step, and it is preferable to use broadband light.
- the pattern obtained by the developing step may be subjected to the metal layer forming step of forming the metal layer on the pattern.
- the method for producing a cured product of the present invention includes a metal layer forming step of forming a metal layer on a pattern obtained by a developing step (preferably one provided in at least one of a heating step and a post-development exposure step). Is preferable.
- metal layer existing metal species can be used without particular limitation, and examples thereof include copper, aluminum, nickel, vanadium, titanium, chromium, cobalt, gold, tungsten, tin, silver, and alloys containing these metals. Copper and aluminum are more preferred, and copper is even more preferred.
- the method for forming the metal layer is not particularly limited, and an existing method can be applied.
- the methods described in JP-A-2007-157879, JP-A-2001-521288, JP-A-2004-214501, JP-A-2004-101850, US Pat. No. 7,788,181B2, US Pat. No. 9,177,926B2 are used. can do.
- photolithography, PVD (physical vapor deposition), CVD (chemical vapor deposition), lift-off, electrolytic plating, electroless plating, etching, printing, and a combination of these can be considered.
- a patterning method combining sputtering, photolithography and etching, and a patterning method combining photolithography and electrolytic plating can be mentioned.
- Preferred embodiments of plating include electrolytic plating using a copper sulfate or copper cyanide plating solution.
- the thickness of the metal layer is preferably 0.01 to 50 ⁇ m, more preferably 1 to 10 ⁇ m in the thickest portion.
- Examples of the method for producing a cured product of the present invention or the applicable field of the cured product of the present invention include an insulating film for a semiconductor device, an interlayer insulating film for a rewiring layer, a stress buffer film, and the like.
- Other examples include forming a pattern of a sealing film, a substrate material (base film or coverlay of a flexible printed circuit board, an interlayer insulating film), or an insulating film for mounting purposes as described above by etching. For these applications, for example, Science & Technology Co., Ltd.
- the method for producing a cured product of the present invention, or the cured product of the present invention is used for manufacturing a plate surface such as an offset plate surface or a screen plate surface, using it for etching molded parts, and protective lacquer and dielectric in electronics, especially microelectronics. It can also be used for layer production and the like.
- the laminated body of the present invention refers to a structure having a plurality of layers made of the cured product of the present invention.
- the laminated body of the present invention is a laminated body containing two or more layers made of a cured product, and may be a laminated body in which three or more layers are laminated.
- the two or more layers made of the cured product contained in the laminated body at least one is a layer made of the cured product of the present invention, which causes shrinkage of the cured product or deformation of the cured product due to the shrinkage. From the viewpoint of suppressing, it is also preferable that the layer made of all the cured products contained in the laminated body is the layer made of the cured product of the present invention.
- the method for producing a laminated body of the present invention preferably includes the method for producing a cured product of the present invention, and more preferably includes repeating the method for producing a cured product of the present invention a plurality of times.
- the laminated body of the present invention contains two or more layers made of a cured product and contains a metal layer between any of the layers made of the cured product.
- the metal layer is preferably formed by the metal layer forming step. That is, it is preferable that the method for producing a laminated body of the present invention further includes a metal layer forming step of forming a metal layer on a layer made of the cured product between the methods for producing a cured product which is performed a plurality of times.
- the preferred embodiment of the metal layer forming step is as described above.
- a laminate including at least a layer structure in which three layers of a layer made of a first cured product, a metal layer, and a layer made of a second cured product are laminated in this order is preferable. Be done. It is preferable that the layer made of the first cured product and the layer made of the second cured product are both layers made of the cured product of the present invention.
- the resin composition of the present invention used for forming the layer composed of the first cured product and the resin composition of the present invention used for forming the layer composed of the second cured product have the same composition. It may be a product or a composition having a different composition.
- the metal layer in the laminate of the present invention is preferably used as metal wiring such as a rewiring layer.
- the method for producing a laminated body of the present invention preferably includes a laminating step.
- the laminating step means that (a) a film forming step (layer forming step), (b) an exposure step, (c) a developing step, (d) a heating step and development are performed again on the surface of a pattern (resin layer) or a metal layer. It is a series of steps including performing at least one of the post-exposure steps in this order. However, it may be an embodiment in which at least one of the film forming step (a), the heating step and the post-development exposure step (d) is repeated. Further, (e) a metal layer forming step may be included after at least one of the (d) heating step and the post-development exposure step. Needless to say, the laminating step may further include the above-mentioned drying step and the like as appropriate.
- the surface activation treatment step may be further performed after the exposure step, the heating step, or the metal layer forming step.
- Plasma treatment is exemplified as the surface activation treatment. Details of the surface activation treatment will be described later.
- the laminating step is preferably performed 2 to 20 times, more preferably 2 to 9 times.
- a structure having two or more and 20 or less resin layers such as a resin layer / metal layer / resin layer / metal layer / resin layer / metal layer, is preferable, and a structure having two or more and 9 or less layers is more preferable. ..
- the composition, shape, film thickness, etc. of each of the above layers may be the same or different.
- a cured product (resin layer) of the resin composition of the present invention so as to further cover the metal layer after the metal layer is provided.
- a film forming step an exposure step, (c) a developing step, (d) at least one of a heating step and a post-development exposure step (e) a metal layer forming step is repeated in this order.
- a film forming step an exposure step
- a developing step a developing step
- a metal layer forming step is repeated in this order.
- a film forming step, (d) at least one of a heating step and a post-development exposure step, and (e) a metal layer forming step are repeated in this order.
- the method for producing a laminate of the present invention preferably includes a surface activation treatment step of surface activating at least a part of the metal layer and the resin composition layer.
- the surface activation treatment step is usually performed after the metal layer forming step, but after the development step (preferably after at least one of the heating step and the post-development exposure step), the surface activation treatment of the resin composition layer is performed.
- the metal layer forming step may be performed.
- the surface activation treatment may be performed on at least a part of the metal layer, on at least a part of the exposed resin composition layer, or on the metal layer and the exposed resin composition layer. For both, you may go to at least part of each.
- the surface activation treatment is preferably performed on at least a part of the metal layer, and it is preferable to perform the surface activation treatment on a part or all of the region of the metal layer that forms the resin composition layer on the surface.
- the surface activation treatment is performed on a part or all of the resin composition layer (resin layer) after exposure. As described above, by performing the surface activation treatment on the surface of the resin composition layer, it is possible to improve the adhesion to the metal layer or the resin layer provided on the surface of the surface activation treatment.
- the resin composition layer when the resin composition layer is cured, such as when negative type development is performed, it is less likely to be damaged by the surface treatment and the adhesion is likely to be improved.
- Specific examples of the surface activation treatment include plasma treatment of various raw material gases (oxygen, hydrogen, argon, nitrogen, nitrogen / hydrogen mixed gas, argon / oxygen mixed gas, etc.), corona discharge treatment, and CF 4 / O 2 .
- the energy is preferably 500 to 200,000 J / m 2 , more preferably 1000 to 100,000 J / m 2 , and most preferably 10,000 to 50,000 J / m 2 .
- the present invention also discloses a semiconductor device containing the cured product of the present invention or the laminate of the present invention.
- the present invention also discloses a method for producing a cured product of the present invention, or a method for producing a semiconductor device including a method for producing a laminate of the present invention.
- the semiconductor device in which the resin composition of the present invention is used to form the interlayer insulating film for the rewiring layer the description in paragraphs 0213 to 0218 and FIG. 1 of JP-A-2016-0273557 can be referred to. These contents are incorporated in the present specification.
- M-2 to M-5 were synthesized by the same method as the above-mentioned synthesis of M-1.
- the structures of the obtained M-2 to M-5 are shown in the following formulas (M-2) to (M-5).
- M-7 to M-9 were synthesized by the same method as M-6.
- the structures of the obtained M-7 to M-9 are shown in the following formulas (M-7) to (M-9).
- the polyimide precursor resin was then precipitated in 4 liters of water and the water-polyimide precursor resin mixture was stirred at a rate of 500 rpm (revolutions per minutes) for 15 minutes.
- the polyimide precursor resin was obtained by filtration, stirred again in 4 liters of water for 30 minutes, and filtered again. Then, the obtained polyimide precursor resin was dried under reduced pressure at 45 ° C. for 2 days to obtain a polyimide precursor (SA-1).
- the weight average molecular weight (Mw) of the obtained polyimide precursor SA-1 was 21,100, and the number average molecular weight (Mn) was 9,800.
- the polyimide precursor SA-1 is presumed to be a resin containing a repeating unit represented by the following formula (SA-1).
- polyimide precursor SA-10- SA-10 was synthesized by the same method as that for SA-1 except that the raw materials were appropriately changed.
- the Mw of SA-10 was 23,500 and the Mn was 10,600. It is presumed that the polyimide precursor SA-10 is a resin containing a repeating unit represented by the following formula (SA-10).
- SA-11 Synthesis of Polyamide-imide Precursor SA-11
- SA-11 was synthesized by the same method as that for the synthesis of SA-1, except that the raw materials were appropriately changed.
- the Mw of SA-10 was 28,400 and the Mn was 12,300. It is presumed that the polyimide precursor SA-11 is a resin containing a repeating unit represented by the following formula (SA-11).
- Examples and comparative examples> In each example, the components listed in the table below were mixed to obtain each resin composition. Further, in each comparative example, the components listed in the following table were mixed to obtain each comparative composition. Specifically, the content of each component described in the table is the amount (parts by mass) described in the column of "addition amount" in each column of the table. The obtained resin composition and comparative composition were pressure-filtered using a filter made of polytetrafluoroethylene having a pore width of 0.5 ⁇ m. Further, in the table, the description of "-" indicates that the composition does not contain the corresponding component.
- the obtained crude polymer solution was added dropwise to 8470.26 g of water to precipitate a polymer, and the obtained precipitate was filtered off and then vacuum dried to obtain a powdery resin A-1.
- the molecular weight of the resin A-1 was measured by gel permeation chromatography (standard polystyrene conversion)
- the weight average molecular weight of A-1 was 20,500 and the number average molecular weight was 9,100.
- ODPA 4,4'-oxydiphthalic acid dianhydride
- Tokyo Chemical Industry Tokyo Chemical Industry
- A-2 was obtained by the same method as in the synthesis of A-1, except that it was changed to (manufactured by Co., Ltd.).
- the weight average molecular weight of A-2 was 28,000, and the number average molecular weight was 12,600.
- Synthesis of P-1 In the above-mentioned synthesis of polyimide PI-1, P-1 was obtained by the same method as in the synthesis of PI-1, except that AA-1 was changed to an equimolar amount of 1,3-phenylenediamine.
- [Base generator] -D-1 to D-2 Compounds with the following structure-D-3: WPBG-027 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
- G-1 1,4-benzoquinone
- G-2 4-methoxyphenol
- G-3 1,4-dihydroxybenzene
- G-4 a compound having the following structure
- DMSO / GBL dimethyl sulfoxide-GBL: ⁇ -butyrolactone-NMP: N-methylpyrrolidone
- Each resin composition or comparative composition prepared in each Example and Comparative Example was applied onto a silicon wafer by a spin coating method to form a resin composition layer.
- the silicon wafer to which the obtained resin composition layer was applied was dried on a hot plate at 100 ° C. for 5 minutes to form a resin composition layer having a uniform thickness of 15 ⁇ m on the silicon wafer.
- the resin composition layer on the silicon wafer was completely exposed to the entire surface with an exposure energy of 500 mJ / cm 2 using a stepper (Nikon NSR 2005 i9C), and the exposed resin composition layer (resin layer) was subjected to a nitrogen atmosphere.
- the temperature was raised at a heating rate of 10 ° C./min and heated at the temperature described in the "Temperature” column of “Curing Conditions” in the table for 180 minutes to obtain a cured layer (resin layer) of the resin composition layer. ..
- the obtained resin layer was immersed in the following chemical solution under the following conditions, and the dissolution rate was calculated.
- Chemical solution Mixture of dimethylsulfoxide (DMSO) and 25% by mass tetramethylammonium hydroxide (TMAH) aqueous solution at 90:10 (mass ratio)
- Evaluation conditions Immerse the resin layer in the chemical solution at 75 ° C. for 15 minutes. The dissolution rate (nm / min) was calculated by comparing the film thicknesses before and after.
- the film thickness was measured at 10 points on the coated surface with an ellipsometer (KT-22 manufactured by Foothill), and the film thickness was determined as the arithmetic mean value.
- the evaluation was performed according to the following evaluation criteria, and the evaluation results are described in the "Chemical resistance" column of the table. It can be said that the smaller the dissolution rate, the better the chemical resistance.
- C The dissolution rate was 300 nm / min or more and less than 400 nm / min.
- D The dissolution rate was 400 nm / min or more.
- a resin composition or a comparative composition was applied onto a silicon wafer by a spin coating method to form a resin composition layer.
- the silicon wafer to which the obtained resin composition layer was applied was dried on a hot plate at 100 ° C. for 5 minutes to obtain a uniform curable resin composition layer having a thickness of about 15 ⁇ m on the silicon wafer.
- the film thickness was measured using a reflection spectroscopic film thickness meter (manufactured by FE-3000 Otsuka Electronics Co., Ltd.) of the curable resin composition layer, and this value was defined as "film thickness A".
- the entire surface of the obtained curable resin composition layer was exposed to i-line with an exposure energy of 500 mJ / cm 2 using a stepper (Nikon NSR 2005 i9C).
- the curable resin composition layer (resin layer) after the exposure was heated at a heating rate of 10 ° C./min under a nitrogen atmosphere to the temperature described in the "curing temperature (° C.)" column of the table. After reaching, it was heated for 3 hours and cooled to 25 ° C.
- the film thickness was measured using a reflection spectroscopic film thickness meter (manufactured by FE-3000 Otsuka Electronics Co., Ltd.) of the composition layer, and this value was defined as "film thickness B".
- Measuring equipment Digital force gauge (manufactured by Imada Co., Ltd.), Measuring stand (manufactured by Imada Co., Ltd.) 3 mL of the resist solution was measured in a syringe equipped with a 0.5 ⁇ m filter and set on the above measuring stand. The syringe was pushed in at a speed of 3 mL / 1 minute with a digital force gauge, and the force required for pushing at that time was measured. The evaluation was performed according to the following evaluation criteria, and the evaluation results are described in the "filterability" column of the table. It can be said that the smaller the force (N) required for pushing is, the better the filterability is. -Evaluation criteria- A: The force required for pushing was less than 0 to 50 N (Newton). B: The force required for pushing was 50 N or more and less than 100 N. C: The force required for pushing was 100 N or more.
- the cured product made of the resin composition according to the present invention has excellent chemical resistance.
- the resin used in the comparative compositions according to Comparative Examples 1 to 3 does not contain a structure in which the main chain of the resin and the polymerizable group are bonded by a linking group containing a urea bond. Further, the resin used in the comparative compositions according to Comparative Examples 1 to 3 does not contain a molecular chain having a urea bond and a polymerizable group. It can be seen that the cured product made of such a comparative composition is inferior in chemical resistance.
- Example 101 The resin composition used in Example 1 was applied in a layered manner on the surface of the copper thin layer of the resin base material having the copper thin layer formed on the surface by a spin coating method, dried at 100 ° C. for 4 minutes, and subjected to a film thickness. After forming a 20 ⁇ m resin composition layer, exposure was performed using a stepper (NSR1505 i6, manufactured by Nikon Corporation). Exposure was performed via a mask (a binary mask with a pattern of 1: 1 line and space and a line width of 10 ⁇ m) at a wavelength of 365 nm. After the exposure, it was heated at 100 ° C. for 4 minutes.
- the temperature was raised at a heating rate of 10 ° C./min under a nitrogen atmosphere, and after reaching 230 ° C., the temperature was maintained at 230 ° C. for 3 hours to form an interlayer insulating film for the rewiring layer.
- the interlayer insulating film for the rewiring layer was excellent in insulating property. Moreover, when a semiconductor device was manufactured using these interlayer insulating films for the rewiring layer, it was confirmed that the semiconductor device operated without any problem.
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Abstract
Description
このような樹脂組成物を、例えば塗布等により基材に適用して感光膜を形成し、その後、必要に応じて露光、現像、加熱等を行うことにより、硬化物を基材上に形成することができる。
ポリイミド前駆体等の上記環化樹脂の前駆体は、例えば加熱により環化され、硬化物中でポリイミド等の環化樹脂となる。
樹脂組成物は、公知の塗布方法等により適用可能であるため、例えば、適用される樹脂組成物の適用時の形状、大きさ、適用位置等の設計の自由度が高いなど、製造上の適応性に優れるといえる。ポリイミド等の環化樹脂が有する高い性能に加え、このような製造上の適応性に優れる観点から、上述の樹脂組成物の産業上の応用展開がますます期待されている。 For example, in the above-mentioned applications, the cyclized resin such as polyimide is used in the form of a cyclized resin such as polyimide and a resin composition containing at least one of the precursors of the cyclized resin.
Such a resin composition is applied to a base material by, for example, coating to form a photosensitive film, and then exposed, developed, heated or the like, if necessary, to form a cured product on the base material. be able to.
The precursor of the cyclized resin such as the polyimide precursor is cyclized by heating, for example, and becomes a cyclized resin such as polyimide in the cured product.
Since the resin composition can be applied by a known coating method or the like, for example, there is a high degree of freedom in designing the shape, size, application position, etc. of the applied resin composition at the time of application. It can be said that it is excellent in sex. In addition to the high performance of cyclized resins such as polyimide, the above-mentioned resin compositions are expected to be increasingly applied in industry from the viewpoint of excellent manufacturing adaptability.
特許文献2には、バックボーンを有する主ポリマーと、上記バックボーンに結合された不飽和側鎖と、を含む酸素消去ポリマーであって、上記側鎖は少なくとも1つの脂肪族炭素-炭素二重結合又は2つ以上の炭素-炭素二重結合を含む、酸素消去ポリマーと、触媒と、を含む、組成物が記載されている。 For example, Patent Document 1 describes (a) a polymer (A) containing a specific structural unit as a main component, (b) a compound (B) represented by a specific general formula, and (c) a photoinitiator and a photoinitiator. Described are photosensitive polyimide precursor compositions comprising / or a sensitizer and / or a photoreactive monomer.
Patent Document 2 describes an oxygen scavenging polymer comprising a main polymer having a backbone and an unsaturated side chain bonded to the backbone, wherein the side chain is at least one aliphatic carbon-carbon double bond or. A composition comprising an oxygen scavenging polymer comprising two or more carbon-carbon double bonds and a catalyst has been described.
<1> 環化樹脂又はその前駆体である樹脂、及び、
重合開始剤を含み、
上記樹脂が重合性基を含む側鎖を有し、
上記樹脂の主鎖と上記重合性基が連結基を介して結合しており、
上記連結基がウレア結合を含む、
樹脂組成物。
<2> 上記側鎖が、下記式(1-1)で表される構造である、<1>に記載の樹脂組成物。
式(1-1)中、Rp1は少なくとも1つの重合性基を含む基を表し、RNはそれぞれ独立に、水素原子又は炭化水素基を表し、L1は2価の連結基を表し、*は主鎖との結合部位を表す。
<3> 環化樹脂又はその前駆体である樹脂、及び、
重合開始剤を含み、
上記樹脂が重合性基を有する構造として、下記式(1-2)で表される構造を含む、
樹脂組成物。
式(1-2)中、Rp2は少なくとも1つの重合性基を含む基を表し、RNはそれぞれ独立に、水素原子又は炭化水素基を表しL2は2価の連結基を表し、*は他の構造との結合部位を表す。
<4> 上記樹脂が、下記式(2)で表される繰返し単位を含むポリイミド前駆体、下記式(4)で表される繰返し単位を含むポリイミド、下記式(3)で表される繰返し単位を含むポリベンゾオキサゾール前駆体、下記式(x)で表される繰返し単位を含むポリベンゾオキサゾール、下記式(PAI-2)で表されるポリアミドイミド前駆体、及び、式(PAI-3)で表される繰返し単位を含むポリアミドイミドよりなる群から選ばれた少なくとも1種の樹脂である、<3>に記載の樹脂組成物。
式(2)中、A1及びA2は、それぞれ独立に、酸素原子又は-NH-を表し、R111は、2価の有機基を表し、R115は、4価の有機基を表し、R113及びR114は、それぞれ独立に、水素原子又は1価の有機基を表し、R111、R113、R114及びR115よりなる群から選ばれた少なくとも1つに、式(1-2)で表される構造を含む;
式(4)中、R131は、2価の有機基を表し、R132は、4価の有機基を表し、R132及びR131の少なくとも一方に上記式(1-2)で表される構造を含む;
式(3)中、R121は、2価の有機基を表し、R122は、4価の有機基を表し、R123及びR124は、それぞれ独立に、水素原子又は1価の有機基を表し、R121、R122、R123及びR124よりなる群から選ばれた少なくとも1つに、上記式(1-2)で表される構造を含む;
式(X)中、R133は、2価の有機基を表し、R134は、4価の有機基を表し、R134及びR133の少なくとも一方に上記式(1-2)で表される構造を含む;
式(PAI-2)中、R117は3価の有機基を表し、R111は2価の有機基を表し、A2は酸素原子又は-NH-を表し、R113は水素原子又は1価の有機基を表し、R111、R113及びR117よりなる群から選ばれた少なくとも1つに、上記式(1-2)で表される構造を含む;
式(PAI-2)中、R117は3価の有機基を表し、R111は2価の有機基を表し、R111及びR117の少なくとも一方に上記式(1-2)で表される構造を含む。
<5> 上記樹脂における上記重合性基が、ラジカル重合性基である、<1>~<4>のいずれか1つに記載の樹脂組成物。
<6> 上記樹脂が、ポリイミド、ポリイミド前駆体、ポリベンゾオキサゾール、ポリベンゾオキサゾール前駆体、ポリアミドイミド、及び、ポリアミドイミド前駆体よりなる群から選ばれた少なくとも1種の樹脂である、<1>~<5>のいずれか1つに記載の樹脂組成物。
<7> 上記樹脂の酸価が、0mmol/g~1.2mmol/gである、<1>~<6>のいずれか1つに記載の樹脂組成物。
<8> 重合性化合物を更に含む、<1>~<7>のいずれか1つに記載の樹脂組成物。
<9> 塩基発生剤を更に含む、<1>~<8>のいずれか1つに記載の樹脂組成物。
<10> 再配線層用層間絶縁膜の形成に用いられる、<1>~<9>のいずれか1つに記載の樹脂組成物。
<11> <1>~<10>のいずれか1つに記載の樹脂組成物を硬化してなる硬化物。
<12> <11>に記載の硬化物からなる層を2層以上含み、上記硬化物からなる層同士のいずれかの間に金属層を含む積層体。
<13> <1>~<10>のいずれか1つに記載の樹脂組成物を基材上に適用して膜を形成する膜形成工程を含む、硬化物の製造方法。
<14> 上記膜を選択的に露光する露光工程及び上記膜を現像液を用いて現像してパターンを形成する現像工程を含む、<13>に記載の硬化物の製造方法。
<15> 上記膜を50~450℃で加熱する加熱工程を含む、<13>又は<14>に記載の硬化物の製造方法。
<16> <11>に記載の硬化物又は<12>に記載の積層体を含む、半導体デバイス。 Examples of typical embodiments of the present invention are shown below.
<1> A cyclized resin or a resin that is a precursor thereof, and
Contains a polymerization initiator,
The resin has a side chain containing a polymerizable group and has a side chain.
The main chain of the resin and the polymerizable group are bonded via a linking group.
The linking group contains a urea bond,
Resin composition.
<2> The resin composition according to <1>, wherein the side chain has a structure represented by the following formula (1-1).
In formula (1-1), R p1 represents a group containing at least one polymerizable group, RN independently represents a hydrogen atom or a hydrocarbon group, and L 1 represents a divalent linking group. * Represents the binding site with the main chain.
<3> A cyclized resin or a resin that is a precursor thereof, and
Contains a polymerization initiator,
The structure in which the resin has a polymerizable group includes a structure represented by the following formula (1-2).
Resin composition.
In formula (1-2), R p2 represents a group containing at least one polymerizable group, RN independently represents a hydrogen atom or a hydrocarbon group, and L 2 represents a divalent linking group, *. Represents a binding site with another structure.
<4> The resin is a polyimide precursor containing a repeating unit represented by the following formula (2), a polyimide containing a repeating unit represented by the following formula (4), and a repeating unit represented by the following formula (3). Polybenzoxazole precursor containing, a polybenzoxazole containing a repeating unit represented by the following formula (x), a polyamide-imide precursor represented by the following formula (PAI-2), and a formula (PAI-3). The resin composition according to <3>, which is at least one resin selected from the group consisting of polyamide-imide containing a repeating unit represented.
In formula (2), A 1 and A 2 independently represent an oxygen atom or -NH-, R 111 represents a divalent organic group, and R 115 represents a tetravalent organic group. R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group, and the formula (1-2) is given to at least one selected from the group consisting of R 111 , R 113 , R 114 and R 115 . ) Includes the structure represented by;
In the formula (4), R 131 represents a divalent organic group, R 132 represents a tetravalent organic group, and at least one of R 132 and R 131 is represented by the above formula (1-2). Including structure;
In formula (3), R 121 represents a divalent organic group, R 122 represents a tetravalent organic group, and R 123 and R 124 each independently represent a hydrogen atom or a monovalent organic group. Represented, at least one selected from the group consisting of R 121 , R 122 , R 123 and R 124 includes the structure represented by the above formula (1-2);
In the formula (X), R 133 represents a divalent organic group, R 134 represents a tetravalent organic group, and at least one of R 134 and R 133 is represented by the above formula (1-2). Including structure;
In formula (PAI-2), R 117 represents a trivalent organic group, R 111 represents a divalent organic group, A 2 represents an oxygen atom or -NH-, and R 113 represents a hydrogen atom or monovalent. At least one selected from the group consisting of R 111 , R 113 and R 117 contains the structure represented by the above formula (1-2);
In the formula (PAI-2), R 117 represents a trivalent organic group, R 111 represents a divalent organic group, and at least one of R 111 and R 117 is represented by the above formula (1-2). Includes structure.
<5> The resin composition according to any one of <1> to <4>, wherein the polymerizable group in the resin is a radically polymerizable group.
<6> The resin is at least one resin selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, and polyamideimide precursor. <1> The resin composition according to any one of <5>.
<7> The resin composition according to any one of <1> to <6>, wherein the acid value of the resin is 0 mmol / g to 1.2 mmol / g.
<8> The resin composition according to any one of <1> to <7>, further comprising a polymerizable compound.
<9> The resin composition according to any one of <1> to <8>, further comprising a base generator.
<10> The resin composition according to any one of <1> to <9>, which is used for forming an interlayer insulating film for a rewiring layer.
<11> A cured product obtained by curing the resin composition according to any one of <1> to <10>.
<12> A laminated body containing two or more layers made of the cured product according to <11> and containing a metal layer between any of the layers made of the cured product.
<13> A method for producing a cured product, which comprises a film forming step of applying the resin composition according to any one of <1> to <10> onto a substrate to form a film.
<14> The method for producing a cured product according to <13>, which comprises an exposure step of selectively exposing the film and a developing step of developing the film with a developer to form a pattern.
<15> The method for producing a cured product according to <13> or <14>, which comprises a heating step of heating the film at 50 to 450 ° C.
<16> A semiconductor device comprising the cured product according to <11> or the laminate according to <12>.
本明細書において「~」という記号を用いて表される数値範囲は、「~」の前後に記載される数値をそれぞれ下限値及び上限値として含む範囲を意味する。
本明細書において「工程」との語は、独立した工程だけではなく、その工程の所期の作用が達成できる限りにおいて、他の工程と明確に区別できない工程も含む意味である。
本明細書における基(原子団)の表記において、置換及び無置換を記していない表記は、置換基を有しない基(原子団)と共に置換基を有する基(原子団)をも包含する。例えば、「アルキル基」とは、置換基を有しないアルキル基(無置換アルキル基)のみならず、置換基を有するアルキル基(置換アルキル基)をも包含する。
本明細書において「露光」とは、特に断らない限り、光を用いた露光のみならず、電子線、イオンビーム等の粒子線を用いた露光も含む。また、露光に用いられる光としては、水銀灯の輝線スペクトル、エキシマレーザーに代表される遠紫外線、極紫外線(EUV光)、X線、電子線等の活性光線又は放射線が挙げられる。
本明細書において、「(メタ)アクリレート」は、「アクリレート」及び「メタクリレート」の両方、又は、いずれかを意味し、「(メタ)アクリル」は、「アクリル」及び「メタクリル」の両方、又は、いずれかを意味し、「(メタ)アクリロイル」は、「アクリロイル」及び「メタクリロイル」の両方、又は、いずれかを意味する。
本明細書において、構造式中のMeはメチル基を表し、Etはエチル基を表し、Buはブチル基を表し、Phはフェニル基を表す。
本明細書において、全固形分とは、組成物の全成分から溶剤を除いた成分の総質量をいう。また本明細書において、固形分濃度とは、組成物の総質量に対する、溶剤を除く他の成分の質量百分率である。
本明細書において、重量平均分子量(Mw)及び数平均分子量(Mn)は、特に述べない限り、ゲル浸透クロマトグラフィ(GPC)法を用いて測定した値であり、ポリスチレン換算値として定義される。本明細書において、重量平均分子量(Mw)及び数平均分子量(Mn)は、例えば、HLC-8220GPC(東ソー(株)製)を用い、カラムとしてガードカラムHZ-L、TSKgel Super HZM-M、TSKgel Super HZ4000、TSKgel Super HZ3000、及び、TSKgel Super HZ2000(以上、東ソー(株)製)を直列に連結して用いることによって求めることができる。それらの分子量は特に述べない限り、溶離液としてTHF(テトラヒドロフラン)を用いて測定したものとする。ただし、溶解性が低い場合など、溶離液としてTHFが適していない場合にはNMP(N-メチル-2-ピロリドン)を用いることもできる。また、GPC測定における検出は特に述べない限り、UV線(紫外線)の波長254nm検出器を使用したものとする。
本明細書において、積層体を構成する各層の位置関係について、「上」又は「下」と記載したときには、注目している複数の層のうち基準となる層の上側又は下側に他の層があればよい。すなわち、基準となる層と上記他の層の間に、更に第3の層や要素が介在していてもよく、基準となる層と上記他の層は接している必要はない。また、特に断らない限り、基材に対し層が積み重なっていく方向を「上」と称し、又は、樹脂組成物層がある場合には、基材から樹脂組成物層へ向かう方向を「上」と称し、その反対方向を「下」と称する。なお、このような上下方向の設定は、本明細書中における便宜のためであり、実際の態様においては、本明細書における「上」方向は、鉛直上向きと異なることもありうる。
本明細書において、特段の記載がない限り、組成物は、組成物に含まれる各成分として、その成分に該当する2種以上の化合物を含んでもよい。また、特段の記載がない限り、組成物における各成分の含有量とは、その成分に該当する全ての化合物の合計含有量を意味する。
本明細書において、特に述べない限り、温度は23℃、気圧は101,325Pa(1気圧)、相対湿度は50%RHである。
本明細書において、好ましい態様の組み合わせは、より好ましい態様である。 Hereinafter, the main embodiments of the present invention will be described. However, the present invention is not limited to the specified embodiments.
In the present specification, the numerical range represented by the symbol "-" means a range including the numerical values before and after "-" as the lower limit value and the upper limit value, respectively.
As used herein, the term "process" means not only an independent process but also a process that cannot be clearly distinguished from other processes as long as the intended action of the process can be achieved.
In the notation of a group (atomic group) in the present specification, the notation not describing substitution and non-substitution includes a group having a substituent (atomic group) as well as a group having no substituent (atomic group). For example, the "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
As used herein, the term "exposure" includes not only exposure using light but also exposure using particle beams such as electron beams and ion beams, unless otherwise specified. Examples of the light used for exposure include the emission line spectrum of a mercury lamp, far ultraviolet rays typified by an excimer laser, extreme ultraviolet rays (EUV light), X-rays, active rays such as electron beams, or radiation.
As used herein, "(meth) acrylate" means both "acrylate" and "methacrylate", or either, and "(meth) acrylic" means both "acrylic" and "methacrylic", or. , Any, and "(meth) acryloyl" means both "acryloyl" and "methacrylic", or either.
In the present specification, Me in the structural formula represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group.
As used herein, the total solid content means the total mass of all the components of the composition excluding the solvent. Further, in the present specification, the solid content concentration is the mass percentage of other components excluding the solvent with respect to the total mass of the composition.
In the present specification, the weight average molecular weight (Mw) and the number average molecular weight (Mn) are values measured by gel permeation chromatography (GPC) method and are defined as polystyrene-equivalent values unless otherwise specified. In the present specification, for the weight average molecular weight (Mw) and the number average molecular weight (Mn), for example, HLC-8220GPC (manufactured by Tosoh Corporation) is used, and guard columns HZ-L, TSKgel Super HZM-M, and TSKgel are used as columns. It can be obtained by connecting and using Super HZ4000, TSKgel Super HZ3000, and TSKgel Super HZ2000 (all manufactured by Tosoh Corporation) in series. Unless otherwise specified, their molecular weights shall be measured using THF (tetrahydrofuran) as an eluent. However, NMP (N-methyl-2-pyrrolidone) can also be used when THF is not suitable as the eluent, such as when the solubility is low. Further, unless otherwise specified, the detection in the GPC measurement shall be performed by using a detector having a wavelength of 254 nm of UV rays (ultraviolet rays).
In the present specification, when the positional relationship of each layer constituting the laminated body is described as "upper" or "lower", the other layer is on the upper side or the lower side of the reference layer among the plurality of layers of interest. All you need is. That is, a third layer or element may be further interposed between the reference layer and the other layer, and the reference layer and the other layer need not be in contact with each other. Unless otherwise specified, the direction in which the layers are stacked on the base material is referred to as "upper", or if there is a resin composition layer, the direction from the base material to the resin composition layer is referred to as "upper". And the opposite direction is called "down". It should be noted that such a vertical setting is for convenience in the present specification, and in an actual embodiment, the "up" direction in the present specification may be different from the vertical upward direction.
Unless otherwise specified in the present specification, the composition may contain, as each component contained in the composition, two or more kinds of compounds corresponding to the component. Further, unless otherwise specified, the content of each component in the composition means the total content of all the compounds corresponding to the component.
In the present specification, unless otherwise specified, the temperature is 23 ° C., the atmospheric pressure is 101,325 Pa (1 atmospheric pressure), and the relative humidity is 50% RH.
As used herein, a combination of preferred embodiments is a more preferred embodiment.
本発明の樹脂組成物の一態様(以下、「樹脂組成物の第1の態様」ともいう。)は、環化樹脂又はその前駆体である樹脂、及び、重合開始剤を含み、上記樹脂が重合性基を含む側鎖を有し、上記樹脂の主鎖と上記重合性基が連結基を介して結合しており、上記連結基がウレア結合を含む。
本発明の樹脂組成物の別の一態様(以下、「樹脂組成物の第2の態様」ともいう。)は、環化樹脂又はその前駆体である樹脂、及び、重合開始剤を含み、上記樹脂が重合性基を有する構造として、下記式(1-2)で表される構造を含む。
式(1-2)中、Rp2は少なくとも1つの重合性基を含む基を表し、RNはそれぞれ独立に、水素原子又は炭化水素基を表しL2は2価の連結基を表し、*は他の構造との結合部位を表す。 (Resin composition)
One aspect of the resin composition of the present invention (hereinafter, also referred to as “first aspect of the resin composition”) contains a cyclization resin or a resin which is a precursor thereof, and a polymerization initiator, and the above-mentioned resin is used. It has a side chain containing a polymerizable group, the main chain of the resin and the polymerizable group are bonded via a linking group, and the linking group contains a urea bond.
Another aspect of the resin composition of the present invention (hereinafter, also referred to as "second aspect of the resin composition") includes a cyclized resin or a resin which is a precursor thereof, and a polymerization initiator, and is described above. The structure in which the resin has a polymerizable group includes a structure represented by the following formula (1-2).
In formula (1-2), R p2 represents a group containing at least one polymerizable group, RN independently represents a hydrogen atom or a hydrocarbon group, and L 2 represents a divalent linking group. Represents a binding site with another structure.
本発明の樹脂組成物は、例えば、半導体デバイスの絶縁膜、再配線層用層間絶縁膜、ストレスバッファ膜等の形成に用いることができ、再配線層用層間絶縁膜の形成に用いられることが好ましい。
また、本発明の樹脂組成物は、ネガ型現像に供される感光膜の形成に用いられることが好ましい。
本発明において、ネガ型現像とは、露光及び現像において、現像により非露光部が除去される現像をいい、ポジ型現像とは、現像により露光部が除去される現像をいう。
上記露光の方法、上記現像液、及び、上記現像の方法としては、例えば、後述する硬化物の製造方法の説明における露光工程において説明された露光方法、現像工程において説明された現像液及び現像方法が使用される。 The resin composition of the present invention is preferably used for forming a photosensitive film to be subjected to exposure and development, and may be used for exposure and formation of a film to be subjected to development using a developing solution containing an organic solvent. preferable.
The resin composition of the present invention can be used, for example, for forming an insulating film for a semiconductor device, an interlayer insulating film for a rewiring layer, a stress buffer film, and the like, and can be used for forming an interlayer insulating film for a rewiring layer. preferable.
Further, the resin composition of the present invention is preferably used for forming a photosensitive film to be subjected to negative type development.
In the present invention, negative-type development refers to development in which a non-exposed portion is removed by development in exposure and development, and positive-type development refers to development in which an exposed portion is removed by development.
The exposure method, the developer, and the developing method include, for example, the exposure method described in the exposure step in the description of the method for producing a cured product described later, the developer and the developing method described in the developing step. Is used.
上記効果が得られるメカニズムは不明であるが、下記のように推測される。 According to the resin composition of the present invention, a cured product having excellent chemical resistance can be obtained.
The mechanism by which the above effect is obtained is unknown, but it is presumed as follows.
樹脂組成物の第2の態様において用いられる、環化樹脂又はその前駆体である樹脂は、重合性基を有する構造として、式(1-2)で表される構造を含む。
本発明者らは、鋭意検討した結果、樹脂組成物の第1の態様又は第2の態様において用いられる特定の構造を有する樹脂を用いることにより、得られる硬化物の耐薬品性が向上することが分かった。
上記効果が得られるメカニズムは不明であるが、以下のように推測される。
硬化物中では、ウレア結合と、環化樹脂又は前駆体から得られる環化樹脂との間で水素結合が形成される等の相互作用が起こり、また、ウレア結合は重合性基の重合により環化樹脂、又は、重合により形成される他の樹脂に組み込まれると考えられる。このため、有機溶剤等の薬品に環化樹脂又は他の樹脂が溶解、分散してしまうことが抑制され、耐薬品性が向上すると考えられる。
硬化物が耐薬品性に優れることにより、例えば、本発明の樹脂組成物からなる硬化物上に、溶剤を含む樹脂組成物を更に適用、硬化して積層体を作製する場合等に、硬化物が現像液又は樹脂組成物に接したとしても、硬化物の溶解が抑制されると考えられる。
本発明によれば、例えば、ジメチルスルホキシド(DMSO)、N-メチルピロリドン(NMP)等の極性溶剤、テトラメチルアンモニウムヒドロキシド(TMAH)水溶液等のアルカリ水溶液、又は、上記極性溶剤と上記アルカリ水溶液との混合液に対する溶解性が抑制された、耐薬品性に優れた硬化物が得られると考えられる。 The cyclized resin or the resin which is a precursor thereof used in the first aspect of the resin composition has a side chain containing a polymerizable group, and the main chain of the resin and the polymerizable group are interposed via a linking group. The linking group contains a urea bond.
The cyclized resin or the resin which is a precursor thereof used in the second aspect of the resin composition includes a structure represented by the formula (1-2) as a structure having a polymerizable group.
As a result of diligent studies, the present inventors have found that the chemical resistance of the obtained cured product is improved by using the resin having a specific structure used in the first aspect or the second aspect of the resin composition. I understood.
The mechanism by which the above effect is obtained is unknown, but it is presumed as follows.
In the cured product, an interaction such as formation of a hydrogen bond between the urea bond and the cyclized resin obtained from the cyclized resin or the precursor occurs, and the urea bond is ringed by the polymerization of the polymerizable group. It is considered to be incorporated into a chemical resin or another resin formed by polymerization. Therefore, it is considered that the cyclized resin or other resin is prevented from being dissolved and dispersed in the chemicals such as the organic solvent, and the chemical resistance is improved.
Since the cured product has excellent chemical resistance, for example, when a resin composition containing a solvent is further applied and cured on the cured product made of the resin composition of the present invention, the cured product is produced. Is considered to suppress the dissolution of the cured product even if it comes into contact with the developing solution or the resin composition.
According to the present invention, for example, a polar solvent such as dimethyl sulfoxide (DMSO) or N-methylpyrrolidone (NMP), an alkaline aqueous solution such as a tetramethylammonium hydroxide (TMAH) aqueous solution, or the polar solvent and the alkaline aqueous solution. It is considered that a cured product having excellent chemical resistance and having suppressed solubility in the mixed solution of Sulfoxide can be obtained.
更に、本発明で用いられる環化樹脂又はその前駆体である樹脂は、ウレア結合を連結基として含む側鎖、又は、式(1-2)で表される構造を含む。この側鎖又は式(1-2)で表される構造は、樹脂に重合性基を導入する際に一般的に使用されるメタクリロキシエチル基等の構造等と比較して式量が大きい。そのため、樹脂の固有粘度が低下すると考えられる。そのため、本発明の樹脂組成物は、例えば、フィルターろ過におけるろ過時間が短縮できるなど、ろ過性にも優れると推測される。また、本発明において用いられる樹脂は上述の側鎖又は式(1-2)で表される構造を含むため、従来のメタクリロキシエチル基等の構造を有する樹脂と比較して、樹脂の分子量に対する重合性基の割合が低くなると考えられる。そのため、樹脂の合成における乾燥時等に、樹脂間又は樹脂内で重合性基の重合により架橋構造が形成されてしまうことが抑制され、組成物の調製時のフィルターの目詰まりが抑制され、ろ過性に優れると推測される。 Further, since the interaction between the urea bond and the resin exists as described above, the compound portion having the urea bond (for example, the desorbed side chain) is less likely to volatilize by heating during curing, and thus the cured product. It is considered that the contraction of urea is also suppressed.
Further, the cyclized resin used in the present invention or a resin which is a precursor thereof includes a side chain containing a urea bond as a linking group or a structure represented by the formula (1-2). This side chain or the structure represented by the formula (1-2) has a larger formula amount than the structure such as a methacrylate ethyl group generally used when introducing a polymerizable group into a resin. Therefore, it is considered that the intrinsic viscosity of the resin decreases. Therefore, it is presumed that the resin composition of the present invention is also excellent in filterability, for example, the filtration time in filter filtration can be shortened. Further, since the resin used in the present invention contains the above-mentioned side chain or the structure represented by the formula (1-2), the molecular weight of the resin is higher than that of the conventional resin having a structure such as a methacrylate ethyl group. It is considered that the proportion of polymerizable groups is low. Therefore, it is possible to prevent the formation of a crosslinked structure due to the polymerization of the polymerizable group between the resins or in the resin during drying in the synthesis of the resin, and the clogging of the filter during the preparation of the composition is suppressed, and the filtration is performed. It is presumed to be excellent in sex.
本発明の樹脂組成物は、下記(A)又は(B)の少なくとも一方を満たす樹脂(「特定樹脂」ともいう。)を含む。
(A)環化樹脂及びその前駆体である樹脂であって、上記樹脂が重合性基を含む側鎖を有し、上記樹脂の主鎖と上記重合性基が連結基を介して結合しており、上記連結基がウレア結合を含む。
(B)環化樹脂又はその前駆体である樹脂であって、上記樹脂が重合性基を有する構造として、式(1-2)で表される構造を含む。
上記(A)を満たす樹脂は、上述の樹脂組成物の第1の態様に含まれる樹脂(以下、上記(A)を満たす樹脂についてのみ記載したい場合、これを「第1の特定樹脂」ともいう。)である。
上記(B)を満たす樹脂は、上述の樹脂組成物の第2の態様に含まれる樹脂(以下、上記(B)を満たす樹脂についてのみ記載したい場合、「第2の特定樹脂」ともいう。)である。
本発明の樹脂組成物は、上記(A)及び(B)の両方を満たしてもよい。
また、本発明において、主鎖とは、樹脂分子中で相対的に最も長い結合鎖を表し、側鎖とは、樹脂分子に含まれる主鎖以外の結合鎖を表す。 <Specific resin>
The resin composition of the present invention contains a resin (also referred to as "specific resin") that satisfies at least one of the following (A) or (B).
(A) A cyclized resin and a resin as a precursor thereof, wherein the resin has a side chain containing a polymerizable group, and the main chain of the resin and the polymerizable group are bonded via a linking group. The linking group contains a urea bond.
(B) A cyclized resin or a resin which is a precursor thereof, and includes a structure represented by the formula (1-2) as a structure in which the resin has a polymerizable group.
The resin satisfying the above (A) is also referred to as a "first specific resin" when it is desired to describe only the resin containing the above-mentioned resin composition in the first aspect (hereinafter, only the resin satisfying the above (A)). .).
The resin satisfying the above (B) is a resin contained in the second aspect of the above resin composition (hereinafter, when only the resin satisfying the above (B) is desired to be described, it is also referred to as a “second specific resin”). Is.
The resin composition of the present invention may satisfy both the above (A) and (B).
Further, in the present invention, the main chain represents a relatively longest bound chain in the resin molecule, and the side chain represents a bound chain other than the main chain contained in the resin molecule.
環化樹脂としては、ポリイミド、ポリベンゾオキサゾール、ポリアミドイミド等が挙げられる。
環化樹脂の前駆体とは、外部刺激により化学構造の変化を生じて環化樹脂となる樹脂をいい、熱により化学構造の変化を生じて環化樹脂となる樹脂が好ましく、熱により閉環反応を生じて環構造が形成されることにより環化樹脂となる樹脂がより好ましい。
環化樹脂の前駆体としては、ポリイミド前駆体、ポリベンゾオキサゾール前駆体、ポリアミドイミド前駆体等が挙げられる。
すなわち、本発明の樹脂組成物は、特定樹脂として、ポリイミド、ポリイミド前駆体、ポリベンゾオキサゾール、ポリベンゾオキサゾール前駆体、ポリアミドイミド、及び、ポリアミドイミド前駆体よりなる群から選ばれた少なくとも1種の樹脂(特定樹脂)を含むことが好ましい。
本発明の樹脂組成物は、特定樹脂として、ポリイミド又はポリイミド前駆体を含むことが好ましい。 The cyclized resin is preferably a resin containing an imide ring structure or an oxazole ring structure in the main chain structure.
Examples of the cyclization resin include polyimide, polybenzoxazole, and polyamideimide.
The precursor of the cyclized resin refers to a resin that changes its chemical structure due to an external stimulus and becomes a cyclized resin, and a resin that changes its chemical structure due to heat and becomes a cyclized resin is preferable, and a ring closure reaction occurs due to heat. A resin that becomes a cyclized resin by forming a ring structure is more preferable.
Examples of the precursor of the cyclization resin include a polyimide precursor, a polybenzoxazole precursor, a polyamide-imide precursor and the like.
That is, the resin composition of the present invention is at least one selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, and polyamideimide precursor as the specific resin. It is preferable to contain a resin (specific resin).
The resin composition of the present invention preferably contains polyimide or a polyimide precursor as the specific resin.
特定樹脂に含まれるウレア結合(第1の特定樹脂であれば、上記側鎖に含まれるウレア結合、第2の特定樹脂であれば、上記式(1-2)に含まれるウレア結合)とは、-NRN-C(=O)-NRN-により表される結合をいう。RNはそれぞれ独立に、水素原子又は炭化水素基を表し、水素原子、アルキル基又はアリール基がより好ましく、水素原子又はアルキル基が更に好ましく、水素原子が特に好ましい。
第1の特定樹脂における側鎖は、ウレア結合を2以上含んでいてもよいが、上記側鎖がウレア結合を1つのみ含む態様も、本発明の好ましい態様の1つである。 [Urea bond]
What is the urea bond contained in the specific resin (in the case of the first specific resin, the urea bond contained in the side chain, and in the case of the second specific resin, the urea bond contained in the above formula (1-2)). , -NR N -C (= O) -NR N -refers to the bond represented by. RN independently represents a hydrogen atom or a hydrocarbon group, and a hydrogen atom, an alkyl group or an aryl group is more preferable, a hydrogen atom or an alkyl group is further preferable, and a hydrogen atom is particularly preferable.
The side chain in the first specific resin may contain two or more urea bonds, but an embodiment in which the side chain contains only one urea bond is also one of the preferred embodiments of the present invention.
特定樹脂に含まれる重合性基(第1の特定樹脂であれば、上記側鎖に含まれる重合性基、第2の特定樹脂であれば、上記式(1-2)に含まれる重合性基)としては、ラジカル重合性基、エポキシ基、オキセタニル基、メチロール基、アルコキシメチル基等の公知の重合性基が挙げられ、ラジカル重合性基が好ましい。
上記ラジカル重合性基としては、エチレン性不飽和結合を有する基が好ましい。
エチレン性不飽和結合を有する基としては、ビニル基、アリル基、ビニルフェニル基等の芳香環に直接結合した、置換されていてもよいビニル基を有する基、(メタ)アクリルアミド基、(メタ)アクリロイルオキシ基等が挙げられ、(メタ)アクリロイルオキシ基が好ましい。 [Polymerizable group]
Polymerizable group contained in the specific resin (in the case of the first specific resin, the polymerizable group contained in the side chain, in the case of the second specific resin, the polymerizable group contained in the above formula (1-2)). ) Examples thereof include known polymerizable groups such as a radically polymerizable group, an epoxy group, an oxetanyl group, a methylol group, and an alkoxymethyl group, and a radically polymerizable group is preferable.
As the radically polymerizable group, a group having an ethylenically unsaturated bond is preferable.
Examples of the group having an ethylenically unsaturated bond include a group having a vinyl group which may be substituted and directly bonded to an aromatic ring such as a vinyl group, an allyl group and a vinylphenyl group, a (meth) acrylamide group and a (meth) group. Examples thereof include an acryloyloxy group, and a (meth) acryloyloxy group is preferable.
特定樹脂がラジカル重合性基を有する場合、樹脂組成物は、光重合開始剤として後述の光ラジカル重合開始剤を含むことが好ましく、光重合開始剤として後述の光ラジカル重合開始剤を含み、かつ、後述のラジカル架橋剤を含むことがより好ましく、光重合開始剤として後述の光ラジカル重合開始剤を含み、後述のラジカル架橋剤を含み、かつ、後述の増感剤を含むことが更に好ましい。このような樹脂組成物からは、例えば、ネガ型感光層が形成される。 Among these, the specific resin preferably contains a radically polymerizable group.
When the specific resin has a radically polymerizable group, the resin composition preferably contains a photoradical polymerization initiator described below as a photopolymerization initiator, and also contains a photoradical polymerization initiator described below as a photopolymerization initiator. It is more preferable to include the radical cross-linking agent described below, and it is further preferable to contain the photo-radical polymerization initiator described below as the photopolymerization initiator, the radical cross-linking agent described below, and the sensitizer described below. From such a resin composition, for example, a negative photosensitive layer is formed.
ウレア結合と重合性基との間の原子数(連結鎖長)は、特に限定されないが、30以下であることが好ましく、2~20であることがより好ましく、2~10であることが更に好ましい。
側鎖がウレア結合を2以上含む場合、重合性基を2以上含む場合、又は、ウレア結合を2以上含み、かつ、重合性基を2以上含む場合、ウレア結合と重合性基の間の原子数(連結鎖長)のうち、最小のものが上記範囲内であればよい。
本明細書において、「ウレア結合と重合性基との間の原子数(連結鎖長)」とは、連結対象の2つの原子または原子群の間を結ぶ経路上の原子鎖のうち、これらの連結対象を最短(最小原子数)で結ぶものをいう。例えば、下記式で表される構造において、ウレア結合と重合性基(メタクリロイルオキシ基)との間の原子数(連結鎖長)は2である。
The number of atoms (linking chain length) between the urea bond and the polymerizable group is not particularly limited, but is preferably 30 or less, more preferably 2 to 20, and further preferably 2 to 10. preferable.
When the side chain contains 2 or more urea bonds, 2 or more polymerizable groups, or 2 or more urea bonds and 2 or more polymerizable groups, the atom between the urea bond and the polymerizable group The smallest number (linkage chain length) may be within the above range.
In the present specification, "the number of atoms (linking chain length) between a urea bond and a polymerizable group" refers to the atomic chains on the path connecting between two atoms or a group of atoms to be linked. The one that connects the objects to be connected in the shortest time (minimum number of atoms). For example, in the structure represented by the following formula, the number of atoms (linkage chain length) between the urea bond and the polymerizable group (methacryloyloxy group) is 2.
特定樹脂の酸価は、以下の方法により測定される。
特定樹脂0.3gをN-メチルピロリドン(NMP)80mLに溶解し、水5mLを加え、特定樹脂の溶液を作成する。上記特定樹脂の溶液に、0.01mmol/L(0.01N)の水酸化ナトリウムを滴下し、当量点(中和量)を求める。特定樹脂の秤量値を中和に要した水酸化ナトリウム量で割った値を酸価とすることにより求めることができる。 From the viewpoint of chemical resistance, the acid value of the specific resin is preferably 0 mmol / g to 1.2 mmol / g, more preferably 0 mmol / g to 0.8 mmol / g, and 0 mmol / g to 0 mmol / g. It is more preferably 0.6 mmol / g.
The acid value of the specific resin is measured by the following method.
Dissolve 0.3 g of the specific resin in 80 mL of N-methylpyrrolidone (NMP) and add 5 mL of water to prepare a solution of the specific resin. 0.01 mmol / L (0.01N) of sodium hydroxide is added dropwise to the solution of the specific resin, and an equivalence point (neutralization amount) is determined. It can be obtained by dividing the weighed value of the specific resin by the amount of sodium hydroxide required for neutralization as the acid value.
第1の特定樹脂は、重合性基を含む側鎖を有し、上記樹脂の主鎖と上記重合性基が連結基を介して結合しており、上記連結基がウレア結合を含む。
第1の特定樹脂において、1つの側鎖に含まれる重合性基の数は、特に限定されないが、1~10であることが好ましく、1~4であることが更に好ましく、1又は2であることがより好ましい。
第1の特定樹脂における連結基は、ウレア結合を含むものであればよいが、ウレア結合と、炭化水素基、-O-、-C(=O)-、-S-、-S(=O)2-、-NRN-よりなる群から選ばれた少なくとも2つが結合した構造であることが好ましい。RNは上述の通りである。
上記炭化水素基としては、飽和脂肪族炭化水素基、芳香族炭化水素基、又は、これらの組み合わせにより表される基が好ましい。
上記飽和脂肪族炭化水素基としては、炭素数1~30の飽和脂肪族炭化水素基が好ましく、炭素数1~20の飽和脂肪族炭化水素基がより好ましく、炭素数1~10の飽和脂肪族炭化水素基が更に好ましい。
上記芳香族炭化水素基としては、炭素数6~30の芳香族炭化水素基が好ましく、炭素数6~20の芳香族炭化水素基がより好ましく、ベンゼン環構造から2以上の水素原子を除いた基が更に好ましい。
これらの中でも、ウレア結合の両端は炭素原子と結合することが好ましく、ウレア結合の両端は炭化水素基と結合することがより好ましく、ウレア結合の両端のうち、一方が芳香族炭化水素基と結合し、他方が飽和脂肪族炭化水素基、芳香族炭化水素基、又は、これらの組み合わせにより表される基と結合することがより好ましい。飽和脂肪族炭化水素基、又は、芳香族炭化水素基の好ましい炭素数は上述の通りである。 [First specific resin]
The first specific resin has a side chain containing a polymerizable group, the main chain of the resin and the polymerizable group are bonded via a linking group, and the linking group contains a urea bond.
In the first specific resin, the number of polymerizable groups contained in one side chain is not particularly limited, but is preferably 1 to 10, more preferably 1 to 4, and 1 or 2. Is more preferable.
The linking group in the first specific resin may be any one containing a urea bond, but the urea bond and the hydrocarbon group, -O-, -C (= O)-, -S-, -S (= O). ) It is preferable that the structure is a combination of at least two selected from the group consisting of 2- and -NR N- . RN is as described above.
As the hydrocarbon group, a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a group represented by a combination thereof is preferable.
As the saturated aliphatic hydrocarbon group, a saturated aliphatic hydrocarbon group having 1 to 30 carbon atoms is preferable, a saturated aliphatic hydrocarbon group having 1 to 20 carbon atoms is more preferable, and a saturated aliphatic hydrocarbon group having 1 to 10 carbon atoms is more preferable. Hydrocarbon groups are more preferred.
As the aromatic hydrocarbon group, an aromatic hydrocarbon group having 6 to 30 carbon atoms is preferable, an aromatic hydrocarbon group having 6 to 20 carbon atoms is more preferable, and two or more hydrogen atoms are removed from the benzene ring structure. Groups are more preferred.
Among these, both ends of the urea bond are preferably bonded to a carbon atom, both ends of the urea bond are more preferably bonded to a hydrocarbon group, and one of the ends of the urea bond is bonded to an aromatic hydrocarbon group. It is more preferable that the other is bonded to a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a group represented by a combination thereof. The preferred carbon number of the saturated aliphatic hydrocarbon group or the aromatic hydrocarbon group is as described above.
第1の特定樹脂における上記側鎖は、下記式(1-1)で表される構造であることが好ましい。
式(1-1)中、Rp1は少なくとも1つの重合性基を含む基を表し、RNはそれぞれ独立に、水素原子又は炭化水素基を表し、L1は2価の連結基を表し、*は主鎖との結合部位を表す。RNの好ましい態様は上述の通りである。 -Equation (1-1)-
The side chain of the first specific resin preferably has a structure represented by the following formula (1-1).
In formula (1-1), R p1 represents a group containing at least one polymerizable group, RN independently represents a hydrogen atom or a hydrocarbon group, and L 1 represents a divalent linking group. * Represents the binding site with the main chain. The preferred embodiment of RN is as described above.
式(1-1)中、Rp1における重合性基の数は、1~10であることが好ましく、1~4であることが更に好ましく、1又は2であることがより好ましい。
Rp1における重合性基の好ましい態様は、上述の特定樹脂における重合性基の好ましい態様と同様である。 << R p1 >>
In the formula (1-1), the number of polymerizable groups in R p1 is preferably 1 to 10, more preferably 1 to 4, and even more preferably 1 or 2.
The preferred embodiment of the polymerizable group in R p1 is the same as the preferred embodiment of the polymerizable group in the above-mentioned specific resin.
式(RP-1)中、LRP1は単結合又はm+1価の連結基を表し、XRP1は重合性基を表し、mは1以上の整数を表し、*は式(1-1)中のウレア結合との結合部位を表す。 It is also preferable that R p1 is a group represented by the following formula (RP-1).
In formula (RP-1), L RP1 represents a single bond or m + 1 valent linking group, X RP1 represents a polymerizable group, m represents an integer of 1 or more, and * represents an integer of 1 or more, and * represents an integer of 1 or more. Represents a binding site with a urea bond.
また、LRP1においてウレア結合との結合部位である*に隣接する構造は、炭化水素基であることが好ましい。
上記LRP1における炭化水素基としては、飽和脂肪族炭化水素基、芳香族炭化水素基、又は、これらの組み合わせにより表される基が好ましく、炭素数1~30の飽和脂肪族炭化水素基、炭素数6~30の芳香族炭化水素基、又は、これらの組み合わせにより表される基がより好ましく、炭素数1~10の飽和脂肪族炭化水素基、ベンゼン環から2以上の水素原子を除いた基、又は、これらの結合により表される基であることが更に好ましい。
これらの中でも、LRP1が2価の連結基である(m=1である)場合、LRP1はアルキレン基、又は、アルキレンオキシアルキレン基、ポリアルキレンオキシ基を含む基、又は、ポリエステル構造を含む基が好ましい。上記アルキレン基の炭素数は2~20が好ましく、2~10がより好ましい。上記アルキレンオキシアルキレン基に含まれる2つのアルキレン基の炭素数は、それぞれ、2~20が好ましく、2~10がより好ましい。
上記ポリアルキレンオキシ基におけるアルキレン基は、炭素数2~10のアルキレン基が好ましく、2~4のアルキレン基がより好ましく、エチレン基又はプロピレン基がより好ましい。また、上記ポリアルキレンオキシ基におけるアルキレン基は、それぞれ同一であってもよいし、異なっていてもよい。上記ポリアルキレンオキシ基の繰返し数は、2~30であることが好ましく、2~10であることがより好ましい。
また、上記ポリアルキレンオキシ基を含む基は、ポリアルキレンオキシアルキレン基であることが好ましい。上記ポリアルキレンオキシ基に結合するアルキレン基の好ましい態様は、上述のアルキレンオキシアルキレン基に含まれるアルキレン基の好ましい態様と同様である。
上記ポリアルキレンエステル構造としては、特に限定されないが、例えば、ポリアルキレンエステル構造等が挙げられる。上記ポリアルキレンエステル構造に含まれるアルキレン基の好ましい態様は、上述のアルキレンオキシアルキレン基に含まれるアルキレン基の好ましい態様と同様である。 In formula (RP-1), L RP1 is a hydrocarbon group, -O-, -C (= O)-, -S-, -S (= O) 2- , -NR N- , or these are 2. The group bonded above is preferable, and the hydrocarbon group or the hydrocarbon group is more than -O-, -C (= O)-, -S-, -S (= O) 2- , and -NR N- . A group to which at least one group selected from the group is bonded is more preferable. RN is as described above.
Further, in L RP1 , the structure adjacent to *, which is a binding site with a urea bond, is preferably a hydrocarbon group.
As the hydrocarbon group in L RP1 , a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a group represented by a combination thereof is preferable, and a saturated aliphatic hydrocarbon group having 1 to 30 carbon atoms and carbon are preferable. An aromatic hydrocarbon group having 6 to 30 or a group represented by a combination thereof is more preferable, a saturated aliphatic hydrocarbon group having 1 to 10 carbon atoms, and a group obtained by removing 2 or more hydrogen atoms from the benzene ring. , Or a group represented by these bonds is more preferable.
Among these, when L RP1 is a divalent linking group (m = 1), L RP1 contains an alkylene group, a group containing an alkyleneoxyalkylene group, a polyalkyleneoxy group, or a polyester structure. Groups are preferred. The alkylene group preferably has 2 to 20 carbon atoms, more preferably 2 to 10 carbon atoms. The carbon number of each of the two alkylene groups contained in the alkyleneoxyalkylene group is preferably 2 to 20, more preferably 2 to 10, respectively.
As the alkylene group in the polyalkyleneoxy group, an alkylene group having 2 to 10 carbon atoms is preferable, an alkylene group having 2 to 4 carbon atoms is more preferable, and an ethylene group or a propylene group is more preferable. Further, the alkylene groups in the polyalkylene oxy group may be the same or different. The number of repetitions of the polyalkyleneoxy group is preferably 2 to 30, more preferably 2 to 10.
Further, the group containing the polyalkyleneoxyalkylene group is preferably a polyalkyleneoxyalkylene group. The preferred embodiment of the alkylene group bonded to the polyalkyleneoxy group is the same as the preferred embodiment of the alkylene group contained in the above-mentioned alkyleneoxyalkylene group.
The polyalkylene ester structure is not particularly limited, and examples thereof include a polyalkylene ester structure. The preferred embodiment of the alkylene group contained in the polyalkylene ester structure is the same as the preferred embodiment of the alkylene group contained in the above-mentioned alkyleneoxyalkylene group.
L1は2価の連結基を表し、炭化水素基、-O-、-C(=O)-、-S-、-S(=O)2-、-NRN-、若しくは、これらが2以上結合した基が好ましく、炭化水素基、又は、炭化水素基と、-O-、-C(=O)-、-S-、-S(=O)2-、及び、-NRN-よりなる群から選ばれた少なくとも1種の基とが結合した基がより好ましい。RNは上述の通りである。
上記L1における炭化水素基としては、飽和脂肪族炭化水素基、芳香族炭化水素基、又は、これらの組み合わせにより表される基が好ましく、炭素数1~30の飽和脂肪族炭化水素基、炭素数6~30の芳香族炭化水素基、又は、これらの組み合わせにより表される基がより好ましく、炭素数1~10の飽和脂肪族炭化水素基、ベンゼン環から2以上の水素原子を除いた基、又は、これらの結合により表される基であることが更に好ましい
これらの中でも、耐薬品性の観点からは、L1におけるウレア結合との結合部位は、炭化水素基であることが好ましく、芳香族炭化水素基であることが好ましく、ベンゼン環から2以上の水素原子を除いた基であることがより好ましい。
また、耐薬品性の観点からは、L1における*と隣接する構造は、-O-又は-C(=O)-であることが好ましく、-O-、-C(=O)O-又は-C(=O)NRN-であることがより好ましい。上記-C(=O)O-又は-C(=O)NRN-の向きは特に限定されないが、例えば、-C(=O)O-又は-C(=O)NRN-に含まれる-C(=O)-が*と隣接する構造であることが好ましい。 << L 1 >>
L 1 represents a divalent linking group, a hydrocarbon group, -O-, -C (= O)-, -S-, -S (= O) 2- , -NR N- , or these are 2. The above-bonded group is preferable, and the hydrocarbon group or the hydrocarbon group is more than -O-, -C (= O)-, -S-, -S (= O) 2- , and -NR N- . A group to which at least one group selected from the group is bonded is more preferable. RN is as described above.
As the hydrocarbon group in L1, a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a group represented by a combination thereof is preferable, and a saturated aliphatic hydrocarbon group having 1 to 30 carbon atoms and carbon are preferable. An aromatic hydrocarbon group having 6 to 30 or a group represented by a combination thereof is more preferable, a saturated aliphatic hydrocarbon group having 1 to 10 carbon atoms, and a group obtained by removing 2 or more hydrogen atoms from the benzene ring. Or, it is more preferable that the group is represented by these bonds. Among these, from the viewpoint of chemical resistance, the bonding site with the urea bond in L1 is preferably a hydrocarbon group, which is aromatic. It is preferably a group hydrocarbon group, and more preferably a group obtained by removing two or more hydrogen atoms from the benzene ring.
From the viewpoint of chemical resistance, the structure adjacent to * in L1 is preferably -O- or -C (= O)-, and -O-, -C (= O) O- or -C (= O) NR N -is more preferable. The direction of the above-C (= O) O- or -C (= O) NR N- is not particularly limited, but is included in, for example, -C (= O) O- or -C (= O) NR N- . It is preferable that −C (= O) − has a structure adjacent to *.
耐薬品性の観点からは、第1の特定樹脂は、上記側鎖を、樹脂1分子に対して1~100個含むことが好ましく、1~50個含むことがより好ましく、1~30個含むことが更に好ましい。 -Side chain content-
From the viewpoint of chemical resistance, the first specific resin preferably contains 1 to 100 side chains per molecule of the resin, more preferably 1 to 50, and further contains 1 to 30 side chains. Is even more preferable.
式(1-1)で表される構造の具体例を以下に示すが、本発明はこれに限定されるものではない。下記具体例中、Lは-O-、-C(=O)O-又は-C(=O)NRN-であり、*は主鎖との結合部位を表す。
Specific examples of the structure represented by the formula (1-1) are shown below, but the present invention is not limited thereto. In the following specific examples, L is -O-, -C (= O) O- or -C (= O) NR N- , and * represents a binding site with the main chain.
-式(1-2)-
第2の特定樹脂は、重合性基を有する構造として、下記式(1-2)で表される構造を含む。
式(1-2)中、Rp2は少なくとも1つの重合性基を含む基を表し、RNはそれぞれ独立に、水素原子又は炭化水素基を表しL2は2価の連結基を表し、*は他の構造との結合部位を表す。RNの好ましい態様は上述の通りである。 [Second specific resin]
-Equation (1-2)-
The second specific resin contains a structure represented by the following formula (1-2) as a structure having a polymerizable group.
In formula (1-2), R p2 represents a group containing at least one polymerizable group, RN independently represents a hydrogen atom or a hydrocarbon group, and L 2 represents a divalent linking group, *. Represents a binding site with another structure. The preferred embodiment of RN is as described above.
また、式(1-2)で表される構造の具体例は、式(1-1)で表される構造の具体例と同様である。ただし、式(1-1)で表される構造の具体例における、「*は主鎖との結合部位を表す。」との記載は「*は他の構造との結合部位を表す。」と読み替えるものとする。 The preferred embodiments of R p2 and L 2 in the formula (1-2) are the same as the preferred embodiments of R p1 and L 1 in the formula (1-1), respectively. However, in the preferred embodiment of R p1 and L1 in the formula ( 1-1 ), the description "* represents a binding site with the main chain" and "* represents a binding site with another structure." It shall be read as ".
Further, the specific example of the structure represented by the equation (1-2) is the same as the specific example of the structure represented by the equation (1-1). However, in the specific example of the structure represented by the formula (1-1), the description "* represents a binding site with the main chain" is "* represents a binding site with another structure." It shall be read as.
耐薬品性の観点からは、第2の特定樹脂は、式(1-2)で表される構造を、樹脂1分子に対して1~100個含むことが好ましく、1~50個含むことがより好ましく、1~30個含むことが更に好ましい。また、耐薬品性の観点からは、式(1-2)で表される構造を3つ以上含む態様も、本発明の好ましい態様の1つである -Contents of the structure represented by the formula (1-2)-
From the viewpoint of chemical resistance, the second specific resin preferably contains 1 to 100 structures represented by the formula (1-2) per molecule of the resin, and preferably contains 1 to 50. It is more preferable to contain 1 to 30 pieces. Further, from the viewpoint of chemical resistance, an embodiment including three or more structures represented by the formula (1-2) is also one of the preferred embodiments of the present invention.
本発明で用いるポリイミド前駆体は、その種類等特に定めるものではないが、下記式(2)で表される繰返し単位を含むことが好ましい。
式(2)中、A1及びA2は、それぞれ独立に、酸素原子又は-NH-を表し、R111は、2価の有機基を表し、R115は、4価の有機基を表し、R113及びR114は、それぞれ独立に、水素原子又は1価の有機基を表す。 [Polyimide precursor]
The polyimide precursor used in the present invention is not particularly specified, such as its type, but preferably contains a repeating unit represented by the following formula (2).
In formula (2), A 1 and A 2 independently represent an oxygen atom or -NH-, R 111 represents a divalent organic group, and R 115 represents a tetravalent organic group. R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group.
具体的には、下記(1A)~(1C)の少なくとも1つを満たすことが好ましく、(1A)及び(1B)の少なくとも1つを満たすことがより好ましく、少なくとも(1A)を満たすことが更に好ましい。
(1A)上記式(2)中のR113を含む構造、及び、R114を含む構造の少なくとも一方が第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造である。
(1B)R111に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含む
(1C)R115に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含む Further, the polyimide precursor used in the present invention is represented by the side chain in the first specific resin or the formula (1-2) in the second specific resin in the repeating unit represented by the above formula (2). It is preferable to include a structure such as That is, the second specific resin is at least one selected from the group consisting of R 111 , R 113 , R 114 and R 115 in the repeating unit represented by the formula (2), according to the formula (1-2). It is preferable to include the structure represented by.
Specifically, it is preferable to satisfy at least one of the following (1A) to (1C), more preferably to satisfy at least one of (1A) and (1B), and further to satisfy at least (1A). preferable.
(1A) At least one of the structure containing R 113 and the structure containing R 114 in the above formula (2) is a side chain in the first specific resin, or the formula (1-2) in the second specific resin. It is a structure represented by.
(1B) R 111 contains a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin (1C) R 115 contains a side chain in the first specific resin. Or, the structure represented by the formula (1-2) in the second specific resin is included.
式(2)におけるR111は、2価の有機基を表す。2価の有機基としては、直鎖又は分岐の脂肪族基、環状の脂肪族基及び芳香族基を含む基が例示され、炭素数2~20の直鎖又は分岐の脂肪族基、炭素数3~20の環状の脂肪族基、炭素数3~20の芳香族基、又は、これらの組み合わせからなる基が好ましく、炭素数6~20の芳香族基を含む基がより好ましい。上記直鎖又は分岐の脂肪族基は鎖中の炭化水素基がヘテロ原子を含む基で置換されていてもよく、上記環状の脂肪族基および芳香族基は環員の炭化水素基がヘテロ原子を含む基で置換されていてもよい。本発明の好ましい実施形態として、-Ar-および-Ar-L-Ar-で表される基であることが例示され、特に好ましくは-Ar-L-Ar-で表される基である。但し、Arは、それぞれ独立に、芳香族基であり、Lは、単結合、又は、フッ素原子で置換されていてもよい炭素数1~10の脂肪族炭化水素基、-O-、-CO-、-S-、-SO2-若しくは-NHCO-、あるいは、上記の2つ以上の組み合わせからなる基である。これらの好ましい範囲は、上述のとおりである。 A 1 and A 2 in the formula (2) independently represent an oxygen atom or —NH—, and an oxygen atom is preferable.
R 111 in the formula (2) represents a divalent organic group. Examples of the divalent organic group include a linear or branched aliphatic group, a cyclic aliphatic group and a group containing an aromatic group, and a linear or branched aliphatic group having 2 to 20 carbon atoms and a carbon number of carbon atoms are exemplified. A cyclic aliphatic group having 3 to 20, an aromatic group having 3 to 20 carbon atoms, or a group consisting of a combination thereof is preferable, and a group containing an aromatic group having 6 to 20 carbon atoms is more preferable. In the linear or branched aliphatic group, the hydrocarbon group in the chain may be substituted with a group containing a hetero atom, and in the cyclic aliphatic group and the aromatic group, the hydrocarbon group of the ring member is a hetero atom. It may be substituted with a group containing. Preferred embodiments of the present invention are exemplified by the groups represented by -Ar- and -Ar-L-Ar-, and particularly preferably the groups represented by -Ar-L-Ar-. However, Ar is an aromatic group independently, and L is an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be replaced with a single bond or a fluorine atom, —O—, —CO. -, -S-, -SO 2- or -NHCO-, or a group consisting of a combination of two or more of the above. These preferred ranges are as described above.
具体的には、炭素数2~20の直鎖又は分岐の脂肪族基、炭素数3~20の環状の脂肪族基、炭素数3~20の芳香族基、又は、これらの組み合わせからなる基を含むジアミンであることが好ましく、炭素数6~20の芳香族基を含むジアミンであることがより好ましい。上記直鎖又は分岐の脂肪族基は鎖中の炭化水素基がヘテロ原子を含む基で置換されていてもよく上記環状の脂肪族基および芳香族基は環員の炭化水素基がヘテロ原子を含む基で置換されていてもよい。芳香族基を含む基の例としては、下記が挙げられる。 R 111 is preferably derived from diamine. Examples of the diamine used for producing the polyimide precursor include linear or branched aliphatic, cyclic aliphatic or aromatic diamines. Only one kind of diamine may be used, or two or more kinds of diamines may be used.
Specifically, a linear or branched aliphatic group having 2 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 3 to 20 carbon atoms, or a group consisting of a combination thereof. It is preferably a diamine containing, and more preferably a diamine containing an aromatic group having 6 to 20 carbon atoms. In the linear or branched aliphatic group, the hydrocarbon group in the chain may be substituted with a group containing a hetero atom, and in the cyclic aliphatic group and the aromatic group, the hydrocarbon group of the ring member is a hetero atom. It may be substituted with a containing group. Examples of groups containing aromatic groups include:
式中、Aは単結合又は2価の連結基を表し、単結合、又は、フッ素原子で置換されていてもよい炭素数1~10の脂肪族炭化水素基、-O-、-C(=O)-、-S-、-SO2-、-NHCO-、又は、これらの組み合わせから選択される基であることが好ましく、単結合、又は、フッ素原子で置換されていてもよい炭素数1~3のアルキレン基、-O-、-C(=O)-、-S-、若しくは、-SO2-から選択される基であることがより好ましく、-CH2-、-O-、-S-、-SO2-、-C(CF3)2-、又は、-C(CH3)2-であることが更に好ましい。
式中、*は他の構造との結合部位を表す。
In the formula, A represents a single bond or a divalent linking group, and is a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, —O—, —C (=). O)-, -S-, -SO 2- , -NHCO-, or a group selected from a combination thereof is preferable, and the number of carbon atoms may be 1 which may be single-bonded or substituted with a fluorine atom. More preferably, it is a group selected from the alkylene groups of -3, -O-, -C (= O)-, -S-, or -SO 2- , and -CH 2- , -O-,-. It is more preferably S-, -SO 2- , -C (CF 3 ) 2- , or -C (CH 3 ) 2- .
In the formula, * represents a binding site with another structure.
式(51)
式(51)中、R50~R57は、それぞれ独立に、水素原子、フッ素原子又は1価の有機基であり、R50~R57の少なくとも1つは、フッ素原子、メチル基又はトリフルオロメチル基であり、*はそれぞれ独立に、式(2)中の窒素原子との結合部位を表す。
R50~R57の1価の有機基としては、炭素数1~10(好ましくは炭素数1~6)の無置換のアルキル基、炭素数1~10(好ましくは炭素数1~6)のフッ化アルキル基等が挙げられる。
式(61)中、R58及びR59は、それぞれ独立に、フッ素原子、メチル基、又はトリフルオロメチル基であり、*はそれぞれ独立に、式(2)中の窒素原子との結合部位を表す。
式(51)又は(61)の構造を与えるジアミンとしては、2,2’-ジメチルベンジジン、2,2’-ビス(トリフルオロメチル)-4,4’-ジアミノビフェニル、2,2’-ビス(フルオロ)-4,4’-ジアミノビフェニル、4,4’-ジアミノオクタフルオロビフェニル等が挙げられる。これらは1種で又は2種以上を組み合わせて用いてもよい。 Further, from the viewpoint of i-ray transmittance, R 111 is preferably a divalent organic group represented by the following formula (51) or formula (61). In particular, from the viewpoint of i-ray transmittance and availability, a divalent organic group represented by the formula (61) is more preferable.
Equation (51)
In formula (51), R 50 to R 57 are each independently a hydrogen atom, a fluorine atom or a monovalent organic group, and at least one of R 50 to R 57 is a fluorine atom, a methyl group or a trifluoro. It is a methyl group, and each of * independently represents a bonding site with a nitrogen atom in the formula (2).
The monovalent organic group of R 50 to R 57 includes an unsubstituted alkyl group having 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms) and 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms). Examples thereof include an alkyl fluoride group.
In formula (61), R 58 and R 59 are each independently a fluorine atom, a methyl group, or a trifluoromethyl group, and * is an independent binding site with a nitrogen atom in formula (2). show.
Examples of the diamine giving the structure of the formula (51) or (61) include 2,2'-dimethylbenzidine, 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl, and 2,2'-bis. (Fluoro) -4,4'-diaminobiphenyl, 4,4'-diaminooctafluorobiphenyl and the like can be mentioned. These may be used alone or in combination of two or more.
例えば、R111は上述の側鎖、又は、上述の式(1-2)で表される構造を有するジアミン化合物に由来する構造とすることもできる。
R111が上述の側鎖、又は、上述の式(1-2)で表される構造を含む場合、R111は、芳香族炭化水素基と、上述の側鎖、又は、上述の式(1-2)で表される構造とが直結した構造とを含むことが好ましい。
上記芳香族炭化水素基としては、特に限定されないが、ベンゼン環構造が好ましい。 Further, R 111 may have a structure including the above-mentioned side chain or the above-mentioned structure represented by the formula (1-2). The preferred embodiment of the side chain or the structure represented by the above formula (1-2) is as described above.
For example, R 111 may have a structure derived from the above-mentioned side chain or a diamine compound having a structure represented by the above-mentioned formula (1-2).
When R 111 contains the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2), R 111 contains an aromatic hydrocarbon group and the above-mentioned side chain or the above-mentioned formula (1). It is preferable to include a structure directly connected to the structure represented by -2).
The aromatic hydrocarbon group is not particularly limited, but a benzene ring structure is preferable.
式(LD-1)中、YD1は、n+2価の有機基を表し、PD1は上述の側鎖、又は、上述の式(1-2)で表される構造を表し、nは1以上の整数を表し、*はそれぞれ、式(2)中のR111が結合する窒素原子との結合部位を表す。 Further, when R 111 includes the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2), it is preferable that R 111 has a structure represented by the following formula (LD-1).
In the formula (LD-1), Y D1 represents an n + divalent organic group, P D1 represents the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2), and n is 1 or more. Represents an integer of, and * represents the binding site with the nitrogen atom to which R 111 in Eq. (2) is bonded.
式(LD-1)中、YD1はn+2価の有機基が好ましく、芳香族炭化水素基を含むn+2価の有機基がより好ましい。
YD1における芳香族炭化水素基は、炭素数6~30の芳香族炭化水素基であることが好ましく、炭素数6~20の芳香族炭化水素基であることがより好ましく、ベンゼン環から2以上の水素原子を除いた基であることが更に好ましく、ベンゼン環から3以上の水素原子を除いた基であることが特に好ましい。
式(LD-1)中、YD1における、式(LD-1)に記載の2つの結合部位である*との結合部位に直接結合するものは、いずれも芳香族炭化水素基であることが好ましい。すなわち、式(LD-1)に記載の2つの*は、Y1に含まれる芳香族炭化水素環構造と、直接結合することが好ましい。
また、式(LD-1)中、YD1における、PD1との結合部位は、いずれも芳香族炭化水素基であることが好ましい。すなわち、PD1は、YD1に含まれる芳香族炭化水素環構造と、直接結合することが好ましい。 -Y D1-
In the formula (LD-1), Y D1 is preferably an n + divalent organic group, and more preferably an n + divalent organic group containing an aromatic hydrocarbon group.
The aromatic hydrocarbon group in Y D1 is preferably an aromatic hydrocarbon group having 6 to 30 carbon atoms, more preferably an aromatic hydrocarbon group having 6 to 20 carbon atoms, and 2 or more from the benzene ring. It is more preferable that the group has the hydrogen atom removed from the group, and it is particularly preferable that the group has 3 or more hydrogen atoms removed from the benzene ring.
In the formula (LD-1), the one directly bonded to the binding site with *, which is the two binding sites described in the formula (LD-1) in Y D1 , may be an aromatic hydrocarbon group. preferable. That is, it is preferable that the two * described in the formula (LD- 1 ) are directly bonded to the aromatic hydrocarbon ring structure contained in Y1.
Further, in the formula (LD-1), it is preferable that the binding site with P D1 in Y D1 is an aromatic hydrocarbon group. That is, it is preferable that P D1 is directly bonded to the aromatic hydrocarbon ring structure contained in Y D1 .
式(A2-1)中、RA211~RA214がPD1との結合部位でない場合、RA211~RA214はそれぞれ独立に、水素原子、炭素数1~6のアルキル基、炭素数3~12の環状アルキル基、炭素数1~6のアルコキシ基、ヒドロキシ基、シアノ基、炭素数1~3のハロゲン化アルキル基、又は、ハロゲン原子を表すことが好ましく、溶剤溶解性の観点からは、水素原子、炭素数1~6のアルキル基、炭素数1~6のアルコキシ基、炭素数1~3のハロゲン化アルキル基がより好ましく、水素原子又は炭素数1~6のアルキル基がより好ましい。
上記RA211~RA214における上記ハロゲン化アルキル基におけるハロゲン原子、又は、上記ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子等が挙げられ、塩素原子又は臭素原子が好ましい。
式(A2-2)中、RA221~RA224は式(A2-1)におけるRA211~RA214とそれぞれ同義であり、好ましい態様も同様である。
式(A2-3)中、RA231~RA238はそれぞれ独立に、水素原子、炭素数1~6のアルキル基、炭素数3~12の環状アルキル基、炭素数1~6のアルコキシ基、ヒドロキシ基、シアノ基、炭素数1~3のハロゲン化アルキル基、又は、ハロゲン原子を表すことが好ましく、溶剤溶解性の観点からは、水素原子、炭素数1~6のアルキル基、炭素数1~6のアルコキシ基、又は、炭素数1~3のハロゲン化アルキル基がより好ましく、水素原子又は炭素数1~6のアルキル基がより好ましい。
上記RA231~RA238における上記ハロゲン化アルキル基におけるハロゲン原子、又は、上記ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子等が挙げられ、塩素原子又は臭素原子が好ましい。
式(A2-3)中、LA231は、単結合、炭素数1~6の2価の飽和炭化水素基、炭素数5~24の2価の不飽和炭化水素基、-O-、-S-、-NRN-、ヘテロ環基、又は、炭素数1~6のハロゲン化アルキレン基を表すことが好ましく、単結合、炭素数1~6の飽和炭化水素基、-O-又はヘテロ環基を表すことが好ましく、単結合又は-O-を表すことが更に好ましい。
上記RNは水素原子又は炭化水素基を表し、水素原子、アルキル基又はアリール基がより好ましく、水素原子又はアルキル基が更に好ましく、水素原子が特に好ましい。
上記2価の不飽和炭化水素基は、2価の脂肪族不飽和炭化水素基であってもよいし、2価の芳香族炭化水素基であってもよいが、2価の芳香族炭化水素基であることが好ましい。
上記ヘテロ環基としては、例えば、脂肪族又は芳香族ヘテロ環から2つの水素原子を除いた基が好ましく、脂肪族又は芳香族ヘテロ環から2つの水素原子を除いた基が好ましく、ピロリジン環、テトラヒドロフラン環、テトラヒドロチオフェン環、ピロール環、フラン環、チオフェン環、ピペリジン環、テトラヒドロピラン環、ピリジン環、モルホリン環等の環構造から2つの水素原子を除いた基がより好ましい。これらのヘテロ環は、更に他のヘテロ環又は炭化水素環と縮合環を形成していてもよい。
上記ヘテロ環の環員数は、5~10であることが好ましく、5又は6であることがより好ましい。
また、上記ヘテロ環基におけるヘテロ原子としては、酸素原子、窒素原子、又は、硫黄原子であることが好ましい。
上記ハロゲン化アルキレン基におけるハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子等が挙げられ、塩素原子又は臭素原子が好ましい。
式(A2-4)中、RA241~RA248、LA241は式(A2-3)におけるRA231~RA238、LA231とそれぞれ同義であり、好ましい態様も同様である。
式(A2-5)中、RA251~RA258は式(A2-1)におけるRA211~RA214とそれぞれ同義であり、好ましい態様も同様である。 At least one of RA211 to RA214 , at least one of RA221 to RA224, at least one of RA231 to RA238, at least one of RA241 to RA248 , and RA251 to R. It is preferable that at least one of A258 is a binding site with PD1 in the above formula (LD- 1 ).
In the formula (A2-1), when RA211 to RA214 are not the bonding sites with PD1, RA211 to RA214 are independently hydrogen atoms, alkyl groups having 1 to 6 carbon atoms, and carbon atoms 3 to 12 respectively. It is preferable to represent a cyclic alkyl group, an alkoxy group having 1 to 6 carbon atoms, a hydroxy group, a cyano group, an alkyl halide group having 1 to 3 carbon atoms, or a halogen atom. Atoms, alkyl groups having 1 to 6 carbon atoms, alkoxy groups having 1 to 6 carbon atoms, and alkyl halide groups having 1 to 3 carbon atoms are more preferable, and hydrogen atoms or alkyl groups having 1 to 6 carbon atoms are more preferable.
Examples of the halogen atom in the halogenated alkyl group in RA211 to RA214 or the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a chlorine atom or a bromine atom is preferable.
In the formula (A2-2), RA221 to RA224 have the same meaning as RA211 to RA214 in the formula (A2-1), and the preferred embodiments are also the same.
In the formula (A2-3), RA231 to RA238 are independently hydrogen atoms, an alkyl group having 1 to 6 carbon atoms, a cyclic alkyl group having 3 to 12 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, and hydroxy. It is preferable to represent a group, a cyano group, an alkyl halide group having 1 to 3 carbon atoms, or a halogen atom, and from the viewpoint of solvent solubility, a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and 1 to 1 carbon atom. An alkoxy group of 6 or an alkyl halide group having 1 to 3 carbon atoms is more preferable, and a hydrogen atom or an alkyl group having 1 to 6 carbon atoms is more preferable.
Examples of the halogen atom in the halogenated alkyl group in RA231 to RA238 or the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a chlorine atom or a bromine atom is preferable.
In the formula (A2-3), LA231 is a single bond, a divalent saturated hydrocarbon group having 1 to 6 carbon atoms, a divalent unsaturated hydrocarbon group having 5 to 24 carbon atoms, —O—, —S. -, -NR N- , a heterocyclic group, or a halogenated alkylene group having 1 to 6 carbon atoms is preferable, and a single bond, a saturated hydrocarbon group having 1 to 6 carbon atoms, -O- or a heterocyclic group. Is preferable, and it is more preferable to represent a single bond or —O—.
The RN represents a hydrogen atom or a hydrocarbon group, and a hydrogen atom, an alkyl group or an aryl group is more preferable, a hydrogen atom or an alkyl group is further preferable, and a hydrogen atom is particularly preferable.
The divalent unsaturated hydrocarbon group may be a divalent aliphatic unsaturated hydrocarbon group or a divalent aromatic hydrocarbon group, but may be a divalent aromatic hydrocarbon. It is preferably a group.
As the heterocyclic group, for example, a group obtained by removing two hydrogen atoms from an aliphatic or aromatic heterocycle is preferable, a group obtained by removing two hydrogen atoms from an aliphatic or aromatic heterocycle is preferable, and a pyrrolidine ring, More preferably, a group obtained by removing two hydrogen atoms from a ring structure such as a tetrahydrofuran ring, a tetrahydrothiophene ring, a pyrrole ring, a furan ring, a thiophene ring, a piperidine ring, a tetrahydropyran ring, a pyridine ring or a morpholine ring is preferable. These heterocycles may further form a fused ring with another heterocycle or a hydrocarbon ring.
The number of ring members of the heterocycle is preferably 5 to 10, and more preferably 5 or 6.
The heteroatom in the heterocyclic group is preferably an oxygen atom, a nitrogen atom, or a sulfur atom.
Examples of the halogen atom in the halogenated alkylene group include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a chlorine atom or a bromine atom is preferable.
In the formula (A2-4), RA241 to RA248 and LA241 have the same meanings as RA231 to RA238 and LA231 in the formula (A2-3), and the preferred embodiments are also the same.
In the formula (A2-5), RA251 to RA258 have the same meaning as RA211 to RA214 in the formula (A2-1), and the preferred embodiments are also the same.
式(A2-2)中、RA221~RA224のうち少なくとも1つが、式(LD-1)中のPD1との結合部位であることが好ましく、RA221~RA224のうち1つが上記PD1との結合部位であることがより好ましく、RA223が上記PD1との結合部位であることが好ましい。
式(A2-3)中、RA231~RA238のうち少なくとも1つが、式(LD-1)中のPD1との結合部位であることが好ましく、RA231~RA238のうち2つが、上記PD1との結合部位であることがより好ましく、RA231~RA234のうち1つと、RA235~RA238のうち1つの計2つが上記PD1との結合部位であることが更に好ましく、RA231及びRA238の2つが、上記PD1との結合部位であることが特に好ましい。
式(A2-4)中、RA241~RA248のうち少なくとも1つが、式(LD-1)中のPD1との結合部位であることが好ましく、RA241~RA248のうち2つが、上記PD1との結合部位であることがより好ましく、RA241~RA244のうち1つと、RA245~RA248のうち1つの計2つが上記PD1との結合部位であることが更に好ましく、RA241及びRA248の2つが、上記PD1との結合部位であることが特に好ましい。
式(A2-5)中、RA251~RA258のうち少なくとも1つが、式(LD-1)中のPD1との結合部位であることが好ましく、RA251~RA258のうち2つが、上記PD1との結合部位であることがより好ましく、RA251~RA254のうち1つと、RA255~RA258のうち1つの計2つが上記PD1との結合部位であることが更に好ましく、RA253及びRA257の2つが、上記PD1との結合部位であることが特に好ましい。 In the formula (A2-1), it is preferable that at least one of RA211 to RA214 is a binding site with PD1 in the formula (LD-1), and one of RA211 to RA214 is the above P. It is more preferable that it is a binding site with D1 , and it is preferable that RA213 is a binding site with PD1 .
In the formula (A2-2), it is preferable that at least one of RA221 to RA224 is a binding site with PD1 in the formula (LD-1), and one of RA221 to RA224 is the above P. It is more preferable that it is a binding site with D1 , and it is preferable that RA223 is a binding site with PD1 .
In the formula ( A2-3 ), it is preferable that at least one of RA231 to RA238 is a binding site with PD1 in the formula (LD-1), and two of RA231 to RA238 are described above. It is more preferable that it is a binding site with P D1 , and it is further preferable that a total of two of RA231 to RA234 and one of RA235 to RA238 are binding sites for PD1 . It is particularly preferable that two of A231 and RA238 are the binding sites for PD1 .
In the formula (A2-4), it is preferable that at least one of RA241 to RA248 is a binding site for PD1 in the formula (LD-1), and two of RA241 to RA248 are described above. It is more preferable that it is a binding site with P D1 , and it is further preferable that a total of two of RA241 to RA244 and one of RA245 to RA248 are binding sites for P D1 . It is particularly preferable that two of A241 and RA248 are the binding sites for P D1 .
In formula (A2-5), it is preferable that at least one of RA251 to RA258 is a binding site for PD1 in formula (LD-1), and two of RA251 to RA258 are described above. It is more preferable that it is a binding site with P D1 , and it is further preferable that a total of two of RA251 to RA254 and one of RA255 to RA258 are binding sites for P D1 . It is particularly preferable that two of A253 and RA257 are the binding sites for PD1 .
式(Y-1)中、RY11、RY12、RY13はそれぞれ、式(A2-1)におけるRA211、RA212及びRA214と同義であり、好ましい態様も同様である。
式(Y-2)中、RY21~RY26はそれぞれ、式(A2-4)におけるRA242~RA247と同義であり、好ましい態様も同様である。
式(Y-1)又は式(Y-2)中、*はそれぞれ、式(2)中のR111が結合する2つの窒素原子との結合部位を、#はそれぞれ、式(LD-1)中のPD1との結合部位を、それぞれ示している。 Among these, Y D1 is preferably a group represented by the following formula (Y-1) or (Y-2).
In the formula (Y-1), RY11 , RY12 , and RY13 are synonymous with RA211 , RA212 , and RA214 in the formula (A2-1), respectively, and the preferred embodiments are also the same.
In the formula (Y-2), RY21 to RY26 are synonymous with RA242 to RA247 in the formula (A2-4), respectively, and the preferred embodiments are also the same.
In the formula (Y-1) or the formula (Y-2), * is the binding site with the two nitrogen atoms to which R 111 in the formula (2) is bonded, and # is the formula (LD-1), respectively. The binding sites with PD1 in the inside are shown respectively.
式(LD―1)中、PD1は上述の側鎖、又は、上述の式(1-2)で表される構造を表す。上述の側鎖、又は、上述の式(1-2)で表される構造の好ましい態様は、上記側鎖、又は、上記式(1-2)で表される構造の好ましい態様は、上述の通りである。 -PD1-
In the formula (LD-1), PD1 represents the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2). The preferred embodiment of the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2) is the above-mentioned side chain, or the preferred embodiment of the structure represented by the above-mentioned formula (1-2) is the above-mentioned. It's a street.
式(LD-1)中、nは1以上の整数を表し、1~10であることが好ましく、1~4がより好ましく、1又は2が更に好ましく、1が特に好ましい。 -N-
In the formula (LD-1), n represents an integer of 1 or more, preferably 1 to 10, more preferably 1 to 4, further preferably 1 or 2, and particularly preferably 1.
上記式(LD-1)で表される構造は、例えば、下記式(LDA-1)により表されるジアミンに由来する構造として得られる。
上記式(LDA-1)中、YD1、PD1、nはそれぞれ、上述の式(LD-1)中のYD1、PD1、nと同義であり、好ましい態様も同様である。 -Synthesis method-
The structure represented by the above formula (LD-1) can be obtained, for example, as a structure derived from a diamine represented by the following formula (LDA-1).
In the above formula (LDA-1), Y D1 , P D1 , and n are synonymous with Y D1 , P D1 , and n in the above formula (LD-1), respectively, and the preferred embodiments are also the same.
式(5)又は式(6)中、*はそれぞれ独立に、他の構造との結合部位を表す。
式(5)中、R112は単結合又は2価の連結基であり、単結合、又は、フッ素原子で置換されていてもよい炭素数1~10の脂肪族炭化水素基、-O-、-CO-、-S-、-SO2-、及び-NHCO-、ならびに、これらの組み合わせから選択される基であることが好ましく、単結合、フッ素原子で置換されていてもよい炭素数1~3のアルキレン基、-O-、-CO-、-S-及び-SO2-から選択される基であることがより好ましく、-CH2-、-C(CF3)2-、-C(CH3)2-、-O-、-CO-、-S-及び-SO2-からなる群から選択される2価の基であることが更に好ましい。 R 115 in the formula (2) represents a tetravalent organic group. As the tetravalent organic group, a tetravalent organic group containing an aromatic ring is preferable, and a group represented by the following formula (5) or formula (6) is more preferable.
In formula (5) or formula (6), * independently represents a binding site with another structure.
In formula (5), R 112 is a single-bonded or divalent linking group, which may be substituted with a single-bonded or fluorine atom, an aliphatic hydrocarbon group having 1 to 10 carbon atoms, —O—, -CO-, -S-, -SO 2- , and -NHCO-, and a group selected from a combination thereof are preferable, and a single bond may be substituted with a fluorine atom having 1 to 1 to carbon atoms. More preferably, it is a group selected from 3 alkylene groups, -O-, -CO-, -S- and -SO 2- , and -CH 2- , -C (CF 3 ) 2- , -C ( CH 3 ) It is more preferably a divalent group selected from the group consisting of 2-, -O-, -CO-, -S- and -SO 2- .
テトラカルボン酸二無水物は、下記式(O)で表されることが好ましい。
式(O)中、R115は、4価の有機基を表す。R115の好ましい範囲は式(2)におけるR115と同義であり、好ましい範囲も同様である。 Specific examples of R 115 include tetracarboxylic acid residues remaining after removal of the anhydride group from the tetracarboxylic acid dianhydride. The polyimide precursor may contain only one type of tetracarboxylic acid dianhydride residue or two or more types as a structure corresponding to R 115 .
The tetracarboxylic acid dianhydride is preferably represented by the following formula (O).
In formula (O), R 115 represents a tetravalent organic group. The preferred range of R 115 is synonymous with R 115 in the formula (2), and the preferred range is also the same.
エチレン性不飽和結合を有する基としては、ビニル基、アリル基、イソアリル基、2-メチルアリル基、ビニル基と直接結合した芳香環を有する基(例えば、ビニルフェニル基など)、(メタ)アクリルアミド基、(メタ)アクリロイルオキシ基、下記式(III)で表される基などが挙げられ、下記式(III)で表される基が好ましい。 R 113 and R 114 in the formula (2) independently represent a hydrogen atom or a monovalent organic group, respectively. The monovalent organic group preferably contains a linear or branched alkyl group, a cyclic alkyl group, an aromatic group, or a polyalkyleneoxy group. Further, it is preferable that at least one of R 113 and R 114 contains a polymerizable group, and it is more preferable that both contain a polymerizable group. It is also preferred that at least one of R 113 and R 114 contains two or more polymerizable groups. As the polymerizable group, a radically polymerizable group is preferable because it is a group capable of undergoing a cross-linking reaction by the action of heat, radicals and the like. Specific examples of the polymerizable group include a group having an ethylenically unsaturated bond, an alkoxymethyl group, a hydroxymethyl group, an acyloxymethyl group, an epoxy group, an oxetanyl group, a benzoxazolyl group, a blocked isocyanate group and an amino group. Be done. As the radically polymerizable group of the polyimide precursor, a group having an ethylenically unsaturated bond is preferable.
Examples of the group having an ethylenically unsaturated bond include a vinyl group, an allyl group, an isoallyl group, a 2-methylallyl group, a group having an aromatic ring directly bonded to the vinyl group (for example, a vinylphenyl group), and a (meth) acrylamide group. , (Meta) acryloyloxy group, a group represented by the following formula (III) and the like, and a group represented by the following formula (III) is preferable.
式(III)において、*は他の構造との結合部位を表す。
式(III)において、R201は、炭素数2~12のアルキレン基、-CH2CH(OH)CH2-、シクロアルキレン基又はポリアルキレンオキシ基を表す。
好適なR201の例は、エチレン基、プロピレン基、トリメチレン基、テトラメチレン基、ペンタメチレン基、ヘキサメチレン基、オクタメチレン基、ドデカメチレン基等のアルキレン基、1,2-ブタンジイル基、1,3-ブタンジイル基、-CH2CH(OH)CH2-、ポリアルキレンオキシ基が挙げられ、エチレン基、プロピレン基等のアルキレン基、-CH2CH(OH)CH2-、シクロヘキシル基、ポリアルキレンオキシ基がより好ましく、エチレン基、プロピレン基等のアルキレン基、又はポリアルキレンオキシ基が更に好ましい。
本発明において、ポリアルキレンオキシ基とは、アルキレンオキシ基が2以上直接結合した基をいう。ポリアルキレンオキシ基に含まれる複数のアルキレンオキシ基におけるアルキレン基は、それぞれ同一であっても異なっていてもよい。
ポリアルキレンオキシ基が、アルキレン基が異なる複数種のアルキレンオキシ基を含む場合、ポリアルキレンオキシ基におけるアルキレンオキシ基の配列は、ランダムな配列であってもよいし、ブロックを有する配列であってもよいし、交互等のパターンを有する配列であってもよい。
上記アルキレン基の炭素数(アルキレン基が置換基を有する場合、置換基の炭素数を含む)は、2以上であることが好ましく、2~10であることがより好ましく、2~6であることがより好ましく、2~5であることが更に好ましく、2~4であることが一層好ましく、2又は3であることが特に好ましく、2であることが最も好ましい。
また、上記アルキレン基は、置換基を有していてもよい。好ましい置換基としては、アルキル基、アリール基、ハロゲン原子等が挙げられる。
また、ポリアルキレンオキシ基に含まれるアルキレンオキシ基の数(ポリアルキレンオキシ基の繰返し数)は、2~20が好ましく、2~10がより好ましく、2~6が更に好ましい。
ポリアルキレンオキシ基としては、溶剤溶解性及び耐溶剤性の観点からは、ポリエチレンオキシ基、ポリプロピレンオキシ基、ポリトリメチレンオキシ基、ポリテトラメチレンオキシ基、又は、複数のエチレンオキシ基と複数のプロピレンオキシ基とが結合した基が好ましく、ポリエチレンオキシ基又はポリプロピレンオキシ基がより好ましく、ポリエチレンオキシ基が更に好ましい。上記複数のエチレンオキシ基と複数のプロピレンオキシ基とが結合した基において、エチレンオキシ基とプロピレンオキシ基とはランダムに配列していてもよいし、ブロックを形成して配列していてもよいし、交互等のパターン状に配列していてもよい。これらの基におけるエチレンオキシ基等の繰返し数の好ましい態様は上述の通りである。 In formula (III), R200 represents a hydrogen atom, a methyl group, an ethyl group or a methylol group, and a hydrogen atom or a methyl group is preferable.
In formula (III), * represents a binding site with another structure.
In formula (III), R 201 represents an alkylene group having 2 to 12 carbon atoms, —CH 2 CH (OH) CH 2- , a cycloalkylene group or a polyalkyleneoxy group.
Examples of suitable R 201 include alkylene groups such as ethylene group, propylene group, trimethylene group, tetramethylene group, pentamethylene group, hexamethylene group, octamethylene group and dodecamethylene group, 1,2-butanjiyl group, 1, 3-Butanjiyl group, -CH 2 CH (OH) CH 2- , polyalkyleneoxy group, alkylene group such as ethylene group, propylene group, -CH 2 CH (OH) CH 2- , cyclohexyl group, polyalkylene An oxy group is more preferable, and an alkylene group such as an ethylene group and a propylene group, or a polyalkylene oxy group is further preferable.
In the present invention, the polyalkyleneoxy group refers to a group to which two or more alkyleneoxy groups are directly bonded. The alkylene group in the plurality of alkyleneoxy groups contained in the polyalkyleneoxy group may be the same or different.
When the polyalkyleneoxy group contains a plurality of types of alkyleneoxy groups having different alkylene groups, the sequence of the alkyleneoxy groups in the polyalkyleneoxy group may be a random sequence or a sequence having a block. It may be an array having a pattern such as alternating.
The carbon number of the alkylene group (including the carbon number of the substituent when the alkylene group has a substituent) is preferably 2 or more, more preferably 2 to 10, and 2 to 6. Is more preferable, 2 to 5 is more preferable, 2 to 4 is more preferable, 2 or 3 is particularly preferable, and 2 is most preferable.
Further, the alkylene group may have a substituent. Preferred substituents include alkyl groups, aryl groups, halogen atoms and the like.
The number of alkyleneoxy groups contained in the polyalkyleneoxy group (the number of repetitions of the polyalkyleneoxy group) is preferably 2 to 20, more preferably 2 to 10, and even more preferably 2 to 6.
The polyalkyleneoxy group includes a polyethyleneoxy group, a polypropyleneoxy group, a polytrimethylethyleneoxy group, a polytetramethyleneoxy group, or a plurality of ethyleneoxy groups and a plurality of propylenes from the viewpoint of solvent solubility and solvent resistance. A group bonded to an oxy group is preferable, a polyethyleneoxy group or a polypropyleneoxy group is more preferable, and a polyethyleneoxy group is further preferable. In the group in which the plurality of ethyleneoxy groups and the plurality of propyleneoxy groups are bonded, the ethyleneoxy groups and the propyleneoxy groups may be randomly arranged or may be arranged by forming a block. , Alternate or the like may be arranged in a pattern. The preferred embodiment of the number of repetitions of the ethyleneoxy group and the like in these groups is as described above.
また、R113を含む構造、及び、R114を含む構造のうち少なくとも一方が、上述の式(1-2)で表される構造を含んでもよい。
具体的には、式(2)中の-C(=O)A2-R113、及び、-C(=O)A1-R114、のうち少なくとも一方が、上述の側鎖に含まれる構造であってもよい。また、式(2)中の-C(=O)A2-R113、及び、-C(=O)A1-R114、のうち少なくとも一方が、上述の式(1-2)で表される構造に含まれる構造であってもよい。
上記側鎖、又は、上記式(1-2)で表される構造の好ましい態様は、上述の通りである。 Further, in the formula (2), at least one of the structure containing R 113 and the structure containing R 114 may be a structure contained in the above-mentioned side chain, and the structure including R 113 and R. At least one of the structures including 114 may be included in the structure represented by the above formula (1-2).
Further, at least one of the structure containing R 113 and the structure containing R 114 may include a structure represented by the above formula (1-2).
Specifically, at least one of -C (= O) A 2 -R 113 and -C (= O) A 1 -R 114 in the formula (2) is included in the above-mentioned side chain. It may be a structure. Further, at least one of -C (= O) A 2 -R 113 and -C (= O) A 1-1 -R 114 in the formula (2) is represented by the above formula (1-2). It may be a structure included in the structure to be used.
The preferred embodiment of the side chain or the structure represented by the above formula (1-2) is as described above.
式(2-A)
式(2-A)中、A1及びA2は、酸素原子を表し、R111及びR112は、それぞれ独立に、2価の有機基を表し、R113及びR114は、それぞれ独立に、水素原子又は1価の有機基を表し、R113及びR114の少なくとも一方は、重合性基を含む基であり、両方が重合性基を含む基であることが好ましい。 The repeating unit represented by the formula (2) is preferably a repeating unit represented by the formula (2-A). That is, it is preferable that at least one of the polyimide precursors used in the present invention is a precursor having a repeating unit represented by the formula (2-A). By including the repeating unit represented by the formula (2-A) in the polyimide precursor, it becomes possible to further widen the width of the exposure latitude.
Equation (2-A)
In formula (2-A), A 1 and A 2 represent oxygen atoms, R 111 and R 112 each independently represent a divalent organic group, and R 113 and R 114 each independently. Representing a hydrogen atom or a monovalent organic group, at least one of R 113 and R 114 is a group containing a polymerizable group, and it is preferable that both are groups containing a polymerizable group.
R112は、式(5)におけるR112と同義であり、好ましい範囲も同様である。 A 1 , A 2 , R 111 , R 113 , and R 114 are independently synonymous with A 1 , A 2 , R 111 , R 113 , and R 114 in the formula (2), and the preferred ranges are also the same. ..
R 112 has the same meaning as R 112 in the formula (5), and the preferred range is also the same.
上記ポリイミド前駆体の分子量の分散度は、1.5以上が好ましく、1.8以上がより好ましく、2.0以上であることが更に好ましい。ポリイミド前駆体の分子量の分散度の上限値は特に定めるものではないが、例えば、7.0以下が好ましく、6.5以下がより好ましく、6.0以下が更に好ましい。
本明細書において、分子量の分散度とは、重量平均分子量/数平均分子量により算出される値である。
また、樹脂組成物が特定樹脂として複数種のポリイミド前駆体を含む場合、少なくとも1種のポリイミド前駆体の重量平均分子量、数平均分子量、及び、分散度が上記範囲であることが好ましい。また、上記複数種のポリイミド前駆体を1つの樹脂として算出した重量平均分子量、数平均分子量、及び、分散度が、それぞれ、上記範囲内であることも好ましい。 The weight average molecular weight (Mw) of the polyimide precursor is preferably 5,000 to 100,000, more preferably 10,000 to 50,000, and even more preferably 15,000 to 40,000. The number average molecular weight (Mn) is preferably 2,000 to 40,000, more preferably 3,000 to 30,000, and even more preferably 4,000 to 20,000.
The degree of dispersion of the molecular weight of the polyimide precursor is preferably 1.5 or more, more preferably 1.8 or more, and further preferably 2.0 or more. The upper limit of the dispersity of the molecular weight of the polyimide precursor is not particularly determined, but for example, it is preferably 7.0 or less, more preferably 6.5 or less, still more preferably 6.0 or less.
In the present specification, the degree of molecular weight dispersion is a value calculated by weight average molecular weight / number average molecular weight.
When the resin composition contains a plurality of types of polyimide precursors as the specific resin, it is preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion of at least one type of polyimide precursor are in the above range. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of types of polyimide precursors as one resin are within the above ranges.
本発明に用いられるポリイミドは、アルカリ可溶性ポリイミドであってもよく、有機溶剤を主成分とする現像液に対して可溶なポリイミドであってもよい。
本明細書において、アルカリ可溶性ポリイミドとは、100gの2.38質量%テトラメチルアンモニウム水溶液に対し、23℃で0.1g以上溶解するポリイミドをいい、パターン形成性の観点からは、0.5g以上溶解するポリイミドであることが好ましく、1.0g以上溶解するポリイミドであることが更に好ましい。上記溶解量の上限は特に限定されないが、100g以下であることが好ましい。
また、ポリイミドは、得られる有機膜の膜強度及び絶縁性の観点からは、複数個のイミド構造を主鎖に有するポリイミドであることが好ましい。 [Polyimide]
The polyimide used in the present invention may be an alkali-soluble polyimide or a polyimide that is soluble in a developing solution containing an organic solvent as a main component.
In the present specification, the alkali-soluble polyimide means a polyimide that dissolves 0.1 g or more at 23 ° C. in 100 g of a 2.38 mass% tetramethylammonium aqueous solution, and 0.5 g or more from the viewpoint of pattern formability. A polyimide that dissolves is preferable, and a polyimide that dissolves 1.0 g or more is more preferable. The upper limit of the dissolution amount is not particularly limited, but is preferably 100 g or less.
Further, the polyimide is preferably a polyimide having a plurality of imide structures in the main chain from the viewpoint of the film strength and the insulating property of the obtained organic film.
得られる有機膜の膜強度の観点からは、ポリイミドは、フッ素原子を有することも好ましい。
フッ素原子は、例えば、後述する式(4)で表される繰返し単位におけるR132、又は、後述する式(4)で表される繰返し単位におけるR131に含まれることが好ましく、後述する式(4)で表される繰返し単位におけるR132、又は、後述する式(4)で表される繰返し単位におけるR131にフッ化アルキル基として含まれることがより好ましい。
ポリイミドの全質量に対するフッ素原子の量は、5質量%以上が好ましく、また、20質量%以下が好ましい。 -Fluorine atom-
From the viewpoint of the film strength of the obtained organic film, it is also preferable that the polyimide has a fluorine atom.
The fluorine atom is preferably contained in, for example, R 132 in the repeating unit represented by the formula (4) described later, or R 131 in the repeating unit represented by the formula (4) described later, and is preferably contained in the formula (4) described later. It is more preferable that it is contained as an alkyl fluoride group in R 132 in the repeating unit represented by 4) or in R 131 in the repeating unit represented by the formula (4) described later.
The amount of fluorine atoms with respect to the total mass of the polyimide is preferably 5% by mass or more, and preferably 20% by mass or less.
得られる有機膜の膜強度の観点からは、ポリイミドは、ケイ素原子を有することも好ましい。
ケイ素原子は、例えば、後述する式(4)で表される繰返し単位におけるR131に含まれることが好ましく、後述する式(4)で表される繰返し単位におけるR131に後述する有機変性(ポリ)シロキサン構造として含まれることがより好ましい。
また、上記ケイ素原子又は上記有機変性(ポリ)シロキサン構造はポリイミドの側鎖に含まれていてもよいが、ポリイミドの主鎖に含まれることが好ましい。
ポリイミドの全質量に対するケイ素原子の量は、1質量%以上が好ましく、20質量%以下がより好ましい。 -Silicon atom-
From the viewpoint of the film strength of the obtained organic film, it is also preferable that the polyimide has a silicon atom.
The silicon atom is preferably contained in R 131 in the repeating unit represented by the formula (4) described later, and is organically modified (poly) in R 131 in the repeating unit represented by the formula (4) described later. ) It is more preferable that it is contained as a siloxane structure.
Further, the silicon atom or the organically modified (poly) siloxane structure may be contained in the side chain of the polyimide, but is preferably contained in the main chain of the polyimide.
The amount of silicon atoms with respect to the total mass of the polyimide is preferably 1% by mass or more, more preferably 20% by mass or less.
得られる有機膜の膜強度の観点からは、ポリイミドは、エチレン性不飽和結合を有することが好ましい。
ポリイミドは、エチレン性不飽和結合を主鎖末端に有していてもよいし、側鎖に有していてもよいが、側鎖に有することが好ましい。
上記エチレン性不飽和結合は、ラジカル重合性を有することが好ましい。
エチレン性不飽和結合は、後述する式(4)で表される繰返し単位におけるR132、又は、後述する式(4)で表される繰返し単位におけるR131に含まれることが好ましく、後述する式(4)で表される繰返し単位におけるR132、又は、後述する式(4)で表される繰返し単位におけるR131にエチレン性不飽和結合を有する基として含まれることがより好ましい。
これらの中でも、エチレン性不飽和結合は、後述する式(4)で表される繰返し単位におけるR131に含まれることが好ましく、後述する式(4)で表される繰返し単位におけるR131にエチレン性不飽和結合を有する基として含まれることがより好ましい。
エチレン性不飽和結合を有する基としては、ビニル基、アリル基、ビニルフェニル基等の芳香環に直接結合した、置換されていてもよいビニル基を有する基、(メタ)アクリルアミド基、(メタ)アクリロイルオキシ基、下記式(IV)で表される基などが挙げられる。 -Ethylene unsaturated bond-
From the viewpoint of the film strength of the obtained organic film, the polyimide preferably has an ethylenically unsaturated bond.
The polyimide may have an ethylenically unsaturated bond at the end of the main chain or at the side chain, but it is preferable to have it at the side chain.
The ethylenically unsaturated bond is preferably radically polymerizable.
The ethylenically unsaturated bond is preferably contained in R 132 in the repeating unit represented by the formula (4) described later or R 131 in the repeating unit represented by the formula (4) described later, and is preferably contained in the formula described later. It is more preferable that R 132 in the repeating unit represented by (4) or R 131 in the repeating unit represented by the formula (4) described later is contained as a group having an ethylenically unsaturated bond.
Among these, the ethylenically unsaturated bond is preferably contained in R 131 in the repeating unit represented by the formula (4) described later, and ethylene is contained in R 131 in the repeating unit represented by the formula (4) described later. It is more preferably contained as a group having a sex unsaturated bond.
Examples of the group having an ethylenically unsaturated bond include a group having a vinyl group which may be substituted and directly bonded to an aromatic ring such as a vinyl group, an allyl group and a vinylphenyl group, a (meth) acrylamide group and a (meth) group. Examples thereof include an acryloyloxy group and a group represented by the following formula (IV).
また、上記炭素数2~12のアルキレン基としては、直鎖状、分岐鎖状、環状又はこれらの組み合わせにより表されるアルキレン基のいずれであってもよい。
上記炭素数2~12のアルキレン基としては、炭素数2~8のアルキレン基が好ましく、炭素数2~4のアルキレン基がより好ましい。 In formula (IV), R 21 is an alkylene group having 2 to 12 carbon atoms, —O—CH 2 CH (OH) CH 2- , −C (= O) O−, —O (C = O) NH−. , (Poly) alkyleneoxy group having 2 to 30 carbon atoms (the alkylene group preferably has 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, particularly preferably 2 or 3; the number of repetitions is preferably 1 to 12 and 1). ~ 6 is more preferable, and 1 to 3 are particularly preferable), or a group in which two or more of these are combined is represented.
The alkylene group having 2 to 12 carbon atoms may be a linear group, a branched chain, a cyclic group, or an alkylene group represented by a combination thereof.
As the alkylene group having 2 to 12 carbon atoms, an alkylene group having 2 to 8 carbon atoms is preferable, and an alkylene group having 2 to 4 carbon atoms is more preferable.
式(R1)~(R3)中、Lは単結合、又は、炭素数2~12のアルキレン基、炭素数2~30の(ポリ)アルキレンオキシ基若しくはこれらを2以上結合した基を表し、Xは酸素原子又は硫黄原子を表し、*は他の構造との結合部位を表し、●は式(IV)中のR21が結合する酸素原子との結合部位を表す。
式(R1)~(R3)中、Lにおける炭素数2~12のアルキレン基、又は、炭素数2~30の(ポリ)アルキレンオキシ基の好ましい態様は、上述のR21における、炭素数2~12のアルキレン基、又は、炭素数2~30の(ポリ)アルキレンオキシ基の好ましい態様と同様である。
式(R1)中、Xは酸素原子であることが好ましい。
式(R1)~(R3)中、*は式(IV)中の*と同義であり、好ましい態様も同様である。
式(R1)で表される構造は、例えば、フェノール性ヒドロキシ基等のヒドロキシ基を有するポリイミドと、イソシアナト基及びエチレン性不飽和結合を有する化合物(例えば、2-イソシアナトエチルメタクリレート等)とを反応することにより得られる。
式(R2)で表される構造は、例えば、カルボキシ基を有するポリイミドと、ヒドロキシ基及びエチレン性不飽和結合を有する化合物(例えば、2-ヒドロキシエチルメタクリレート等)とを反応することにより得られる。
式(R3)で表される構造は、例えば、フェノール性ヒドロキシ基等のヒドロキシ基を有するポリイミドと、グリシジル基及びエチレン性不飽和結合を有する化合物(例えば、グリシジルメタクリレート等)とを反応することにより得られる。 Among these, R 21 is preferably a group represented by any of the following formulas (R1) to (R3), and more preferably a group represented by the formula (R1).
In the formulas (R1) to (R3), L represents a single bond, an alkylene group having 2 to 12 carbon atoms, a (poly) alkyleneoxy group having 2 to 30 carbon atoms, or a group in which two or more of these are bonded, and X. Indicates an oxygen atom or a sulfur atom, * represents a bond site with another structure, and ● represents a bond site with an oxygen atom to which R 21 in the formula (IV) is bonded.
In the formulas (R1) to (R3), a preferred embodiment of the alkylene group having 2 to 12 carbon atoms in L or the (poly) alkyleneoxy group having 2 to 30 carbon atoms is the above-mentioned R 21 having 2 to 12 carbon atoms. This is the same as the preferred embodiment of the alkylene group of 12 or the (poly) alkyleneoxy group having 2 to 30 carbon atoms.
In formula (R1), X is preferably an oxygen atom.
In the formulas (R1) to (R3), * is synonymous with * in the formula (IV), and the preferred embodiment is also the same.
The structure represented by the formula (R1) comprises, for example, a polyimide having a hydroxy group such as a phenolic hydroxy group and a compound having an isocyanato group and an ethylenically unsaturated bond (for example, 2-isocyanatoethyl methacrylate). Obtained by reacting.
The structure represented by the formula (R2) is obtained, for example, by reacting a polyimide having a carboxy group with a compound having a hydroxy group and an ethylenically unsaturated bond (for example, 2-hydroxyethyl methacrylate, etc.).
The structure represented by the formula (R3) is formed by reacting, for example, a polyimide having a hydroxy group such as a phenolic hydroxy group with a compound having a glycidyl group and an ethylenically unsaturated bond (for example, glycidyl methacrylate). can get.
ポリイミドは、エチレン性不飽和結合を有する基以外の重合性基を有していてもよい。
エチレン性不飽和結合を有する基以外の重合性基としては、エポキシ基、オキセタニル基等の環状エーテル基、メトキシメチル基等のアルコキシメチル基、メチロール基等が挙げられる。
エチレン性不飽和結合を有する基以外の重合性基は、例えば、後述する式(4)で表される繰返し単位におけるR131に含まれることが好ましい。
ポリイミドの全質量に対するエチレン性不飽和結合を有する基以外の重合性基の量は、0.0001~0.1mol/gであることが好ましく、0.001~0.05mol/gであることがより好ましい。 -Polymerizable groups other than groups with ethylenically unsaturated bonds-
The polyimide may have a polymerizable group other than the group having an ethylenically unsaturated bond.
Examples of the polymerizable group other than the group having an ethylenically unsaturated bond include a cyclic ether group such as an epoxy group and an oxetanyl group, an alkoxymethyl group such as a methoxymethyl group, and a methylol group.
It is preferable that the polymerizable group other than the group having an ethylenically unsaturated bond is contained in R 131 in the repeating unit represented by the formula (4) described later, for example.
The amount of the polymerizable group other than the group having an ethylenically unsaturated bond with respect to the total mass of the polyimide is preferably 0.0001 to 0.1 mol / g, and preferably 0.001 to 0.05 mol / g. More preferred.
ポリイミドがアルカリ現像に供される場合、現像性を向上する観点からは、ポリイミドの酸価は、30mgKOH/g以上であることが好ましく、50mgKOH/g以上であることがより好ましく、70mgKOH/g以上であることが更に好ましい。
また、上記酸価は500mgKOH/g以下であることが好ましく、400mgKOH/g以下であることがより好ましく、200mgKOH/g以下であることが更に好ましい。
また、ポリイミドが有機溶剤を主成分とする現像液を用いた現像(例えば、後述する「溶剤現像」)に供される場合、ポリイミドの酸価は、1~35mgKOH/gが好ましく、2~30mgKOH/gがより好ましく、5~20mgKOH/gが更に好ましい。
耐薬品性の観点からは、ポリイミドの酸価は、0mmol/g~1.2mmol/gであることが好ましく、0mmol/g~0.8mmol/gであることがより好ましく、0mmol/g~0.6mmol/gであることが更に好ましい。
また、ポリイミドに含まれる酸基としては、保存安定性及び現像性の両立の観点から、pKaが0~10である酸基が好ましく、3~8である酸基がより好ましい。
pKaとは、酸から水素イオンが放出される解離反応を考え、その平衡定数Kaをその負の常用対数pKaによって表したものである。本明細書において、pKaは、特に断らない限り、ACD/ChemSketch(登録商標)による計算値とする。又は、日本化学会編「改定5版 化学便覧 基礎編」に掲載の値を参照してもよい。
また、酸基が例えばリン酸等の多価の酸である場合、上記pKaは第一解離定数である。
このような酸基として、ポリイミドは、カルボキシ基、及び、フェノール性ヒドロキシ基よりなる群から選ばれた少なくとも1種を含むことが好ましく、フェノール性ヒドロキシ基を含むことがより好ましい。 -Acid value-
When the polyimide is subjected to alkaline development, the acid value of the polyimide is preferably 30 mgKOH / g or more, more preferably 50 mgKOH / g or more, and 70 mgKOH / g or more from the viewpoint of improving developability. Is more preferable.
The acid value is preferably 500 mgKOH / g or less, more preferably 400 mgKOH / g or less, and even more preferably 200 mgKOH / g or less.
When the polyimide is subjected to development using a developing solution containing an organic solvent as a main component (for example, "solvent development" described later), the acid value of the polyimide is preferably 1 to 35 mgKOH / g, and 2 to 30 mgKOH. / G is more preferable, and 5 to 20 mgKOH / g is even more preferable.
From the viewpoint of chemical resistance, the acid value of the polyimide is preferably 0 mmol / g to 1.2 mmol / g, more preferably 0 mmol / g to 0.8 mmol / g, and 0 mmol / g to 0. It is more preferably 0.6 mmol / g.
Further, as the acid group contained in the polyimide, an acid group having a pKa of 0 to 10 is preferable, and an acid group having a pKa of 3 to 8 is more preferable, from the viewpoint of achieving both storage stability and developability.
The pKa is a dissociation reaction in which hydrogen ions are released from an acid, and its equilibrium constant Ka is expressed by its negative common logarithm pKa. In the present specification, pKa is a value calculated by ACD / ChemSketch (registered trademark) unless otherwise specified. Alternatively, the values published in "Revised 5th Edition Chemistry Handbook Basics" edited by the Chemical Society of Japan may be referred to.
Further, when the acid group is a polyvalent acid such as phosphoric acid, the above pKa is the first dissociation constant.
As such an acid group, the polyimide preferably contains at least one selected from the group consisting of a carboxy group and a phenolic hydroxy group, and more preferably contains a phenolic hydroxy group.
アルカリ現像液による現像速度を適切なものとする観点からは、ポリイミドは、フェノール性ヒドロキシ基を有することが好ましい。
ポリイミドは、フェノール性ヒドロキシ基を主鎖末端に有してもよいし、側鎖に有してもよい。
フェノール性ヒドロキシ基は、例えば、後述する式(4)で表される繰返し単位におけるR132、又は、後述する式(4)で表される繰返し単位におけるR131に含まれることが好ましい。
ポリイミドの全質量に対するフェノール性ヒドロキシ基の量は、0.1~30mol/gであることが好ましく、1~20mol/gであることがより好ましい。 -Phenolic hydroxy group-
From the viewpoint of making the development speed with an alkaline developer appropriate, the polyimide preferably has a phenolic hydroxy group.
The polyimide may have a phenolic hydroxy group at the end of the main chain or at the side chain.
The phenolic hydroxy group is preferably contained in, for example, R 132 in the repeating unit represented by the formula (4) described later or R 131 in the repeating unit represented by the formula (4) described later.
The amount of the phenolic hydroxy group with respect to the total mass of the polyimide is preferably 0.1 to 30 mol / g, and more preferably 1 to 20 mol / g.
式(4)中、R131は、2価の有機基を表し、R132は、4価の有機基を表す。
また、本発明で用いるポリイミドは、上記式(4)で表される繰り返し単位中に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含むことが好ましく、上記式(4)中のR132及びR131の少なくとも一方に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含むことがより好ましく、R131に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含むことが更に好ましい。 The polyimide used in the present invention is not particularly limited as long as it is a polymer compound having an imide structure, but preferably contains a repeating unit represented by the following formula (4).
In formula (4), R 131 represents a divalent organic group and R 132 represents a tetravalent organic group.
Further, the polyimide used in the present invention has a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin in the repeating unit represented by the above formula (4). Is preferable, and at least one of R 132 and R 131 in the above formula (4) has a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin. It is more preferable that R 131 contains a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin.
式(4-1)
式(4-1)中、R133は重合性基であり、他の基は式(4)と同義である。
式(4-2)
R134及びR135の少なくとも一方は重合性基であり、重合性基でない場合は有機基であり、他の基は式(4)と同義である。 Further, when it has a polymerizable group other than the side chain in the first specific resin or the polymerizable group contained in the structure represented by the formula (1-2) in the second specific resin, the polymerizable group is selected. It may be located at at least one of R 131 and R 132 , or may be located at the end of the polyimide as shown in the following formula (4-1) or formula (4-2).
Equation (4-1)
In formula (4-1), R 133 is a polymerizable group, and the other groups are synonymous with formula (4).
Equation (4-2)
At least one of R 134 and R 135 is a polymerizable group, when it is not a polymerizable group, it is an organic group, and the other group is synonymous with the formula (4).
R131は、2価の有機基を表す。2価の有機基としては、式(2)におけるR111と同様のものが例示され、好ましい範囲も同様である。
また、R131としては、ジアミンのアミノ基の除去後に残存するジアミン残基が挙げられる。ジアミンとしては、脂肪族、環式脂肪族又は芳香族ジアミンなどが挙げられる。具体的な例としては、ポリイミド前駆体の式(2)中のR111の例が挙げられる。 Examples of the polymerizable group include a group containing the above-mentioned ethylenically unsaturated bond and a crosslinkable group other than the above-mentioned group having an ethylenically unsaturated bond. R 131 represents a divalent organic group. As the divalent organic group, the same group as R 111 in the formula (2) is exemplified, and the preferable range is also the same.
In addition, examples of R 131 include diamine residues remaining after removal of the amino group of diamine. Examples of the diamine include aliphatic, cyclic aliphatic or aromatic diamines. Specific examples include the example of R 111 in the formula (2) of the polyimide precursor.
例えば、R115として例示される4価の有機基の4つの結合子が、上記式(4)中の4つの-C(=O)-の部分と結合して縮合環を形成する。 R 132 represents a tetravalent organic group. As the tetravalent organic group, the same group as R 115 in the formula (2) is exemplified, and the preferable range is also the same.
For example, four conjugates of a tetravalent organic group exemplified as R 115 combine with four —C (= O) − moieties in the above formula (4) to form a fused ring.
ポリイミドのイミド化率(「閉環率」ともいう)は、得られる有機膜の膜強度、絶縁性等の観点からは、70%以上であることが好ましく、80%以上であることがより好ましく、90%以上であることがより好ましい。
上記イミド化率の上限は特に限定されず、100%以下であればよい。
上記イミド化率は、例えば下記方法により測定される。
ポリイミドの赤外吸収スペクトルを測定し、イミド構造由来の吸収ピークである1377cm-1付近のピーク強度P1を求める。次に、そのポリイミドを350℃で1時間熱処理した後、再度、赤外吸収スペクトルを測定し、1377cm-1付近のピーク強度P2を求める。得られたピーク強度P1、P2を用い、下記式に基づいて、ポリイミドのイミド化率を求めることができる。
イミド化率(%)=(ピーク強度P1/ピーク強度P2)×100 -Imidization rate (ring closure rate)-
The imidization rate (also referred to as "ring closure rate") of the polyimide is preferably 70% or more, more preferably 80% or more, from the viewpoint of the film strength, the insulating property, etc. of the obtained organic film. More preferably, it is 90% or more.
The upper limit of the imidization rate is not particularly limited and may be 100% or less.
The imidization rate is measured, for example, by the following method.
The infrared absorption spectrum of the polyimide is measured to determine the peak intensity P1 near 1377 cm -1 , which is the absorption peak derived from the imide structure. Next, the polyimide is heat-treated at 350 ° C. for 1 hour, and then the infrared absorption spectrum is measured again to obtain the peak intensity P2 in the vicinity of 1377 cm -1 . Using the obtained peak intensities P1 and P2, the imidization rate of polyimide can be determined based on the following formula.
Imidization rate (%) = (peak intensity P1 / peak intensity P2) × 100
また、ポリイミドの数平均分子量(Mn)は、好ましくは2,000~40,000であり、より好ましくは3,000~30,000であり、更に好ましくは4,000~20,000である。
上記ポリイミドの分子量の分散度は、1.5以上が好ましく、1.8以上がより好ましく、2.0以上であることが更に好ましい。ポリイミドの分子量の分散度の上限値は特に定めるものではないが、例えば、7.0以下が好ましく、6.5以下がより好ましく、6.0以下が更に好ましい。
また、樹脂組成物が特定樹脂として複数種のポリイミドを含む場合、少なくとも1種のポリイミドの重量平均分子量、数平均分子量、及び、分散度が上記範囲であることが好ましい。また、上記複数種のポリイミドを1つの樹脂として算出した重量平均分子量、数平均分子量、及び、分散度が、それぞれ、上記範囲内であることも好ましい。 The weight average molecular weight (Mw) of the polyimide is preferably 5,000 to 100,000, more preferably 10,000 to 50,000, and even more preferably 15,000 to 40,000. By setting the weight average molecular weight to 5,000 or more, the breakage resistance of the film after curing can be improved. In order to obtain an organic film having excellent mechanical properties (for example, elongation at break), the weight average molecular weight is particularly preferably 15,000 or more.
The number average molecular weight (Mn) of the polyimide is preferably 2,000 to 40,000, more preferably 3,000 to 30,000, and further preferably 4,000 to 20,000.
The degree of dispersion of the molecular weight of the polyimide is preferably 1.5 or more, more preferably 1.8 or more, and further preferably 2.0 or more. The upper limit of the dispersity of the molecular weight of the polyimide is not particularly determined, but for example, it is preferably 7.0 or less, more preferably 6.5 or less, still more preferably 6.0 or less.
When the resin composition contains a plurality of types of polyimide as the specific resin, it is preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion of at least one type of polyimide are in the above range. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of types of polyimides as one resin are each within the above ranges.
本発明で用いるポリベンゾオキサゾール前駆体は、その構造等について特に定めるものではないが、好ましくは下記式(3)で表される繰返し単位を含む。
式(3)中、R121は、2価の有機基を表し、R122は、4価の有機基を表し、R123及びR124は、それぞれ独立に、水素原子又は1価の有機基を表す。
また、本発明で用いるポリベンゾオキサゾール前駆体は、上記式(3)で表される繰り返し単位中に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含むことが好ましい。
すなわち、第2の特定樹脂は、式(3)で表される繰返し単位において、R121、R122、R123及びR124よりなる群から選ばれた少なくとも1つに、式(1-2)で表される構造を含むことが好ましい。 具体的には、下記(2A)~(2C)の少なくとも1つを満たすことが好ましく、(2A)及び(2B)の少なくとも1つを満たすことがより好ましく、少なくとも(2A)を満たすことが更に好ましい。
(2A)上記式(3)中のR123を含む構造、及び、R124を含む構造の少なくとも一方が第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造である。
(2B)R121に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含む
(2C)R122に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含む [Polybenzoxazole precursor]
The polybenzoxazole precursor used in the present invention is not particularly defined for its structure and the like, but preferably contains a repeating unit represented by the following formula (3).
In formula (3), R 121 represents a divalent organic group, R 122 represents a tetravalent organic group, and R 123 and R 124 each independently represent a hydrogen atom or a monovalent organic group. show.
Further, the polybenzoxazole precursor used in the present invention has a side chain in the first specific resin or a formula (1-2) in the second specific resin in the repeating unit represented by the above formula (3). It preferably contains the structure represented.
That is, the second specific resin is added to at least one selected from the group consisting of R 121 , R 122 , R 123 and R 124 in the repeating unit represented by the formula (3) in the formula (1-2). It is preferable to include the structure represented by. Specifically, it is preferable to satisfy at least one of the following (2A) to (2C), more preferably to satisfy at least one of (2A) and (2B), and further to satisfy at least (2A). preferable.
(2A) At least one of the structure containing R 123 and the structure containing R 124 in the above formula (3) is a side chain in the first specific resin, or the formula (1-2) in the second specific resin. It is a structure represented by.
(2B) R 121 contains a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin (2C) R 122 contains a side chain in the first specific resin. Or, the structure represented by the formula (1-2) in the second specific resin is included.
式(3)において、R121は、2価の有機基を表す。2価の有機基としては、脂肪族基及び芳香族基の少なくとも一方を含む基が好ましい。脂肪族基としては、直鎖の脂肪族基が好ましい。R121は、ジカルボン酸残基が好ましい。ジカルボン酸残基は、1種のみ用いてもよいし、2種以上用いてもよい。 In the formula (3), R 123 and R 124 are synonymous with R 113 in the formula (2), respectively, and the preferable range is also the same. Here, in the formula (3), at least one of —OR 123 and —OR 124 in the formula (3) is a side chain in the first specific resin or a second specific resin. It is preferable that the structure is represented by the formula (1-2) in.
In formula (3), R 121 represents a divalent organic group. As the divalent organic group, a group containing at least one of an aliphatic group and an aromatic group is preferable. As the aliphatic group, a linear aliphatic group is preferable. R 121 is preferably a dicarboxylic acid residue. Only one type of dicarboxylic acid residue may be used, or two or more types may be used.
脂肪族基を含むジカルボン酸としては、直鎖又は分岐(好ましくは直鎖)の脂肪族基を含むジカルボン酸が好ましく、直鎖又は分岐(好ましくは直鎖)の脂肪族基と2つの-COOHからなるジカルボン酸がより好ましい。直鎖又は分岐(好ましくは直鎖)の脂肪族基の炭素数は、2~30であることが好ましく、2~25であることがより好ましく、3~20であることが更に好ましく、4~15であることが一層好ましく、5~10であることが特に好ましい。直鎖の脂肪族基はアルキレン基であることが好ましい。
直鎖の脂肪族基を含むジカルボン酸としては、マロン酸、ジメチルマロン酸、エチルマロン酸、イソプロピルマロン酸、ジ-n-ブチルマロン酸、スクシン酸、テトラフルオロスクシン酸、メチルスクシン酸、2,2-ジメチルスクシン酸、2,3-ジメチルスクシン酸、ジメチルメチルスクシン酸、グルタル酸、ヘキサフルオログルタル酸、2-メチルグルタル酸、3-メチルグルタル酸、2,2-ジメチルグルタル酸、3,3-ジメチルグルタル酸、3-エチル-3-メチルグルタル酸、アジピン酸、オクタフルオロアジピン酸、3-メチルアジピン酸、ピメリン酸、2,2,6,6-テトラメチルピメリン酸、スベリン酸、ドデカフルオロスベリン酸、アゼライン酸、セバシン酸、ヘキサデカフルオロセバシン酸、1,9-ノナン二酸、ドデカン二酸、トリデカン二酸、テトラデカン二酸、ペンタデカン二酸、ヘキサデカン二酸、ヘプタデカン二酸、オクタデカン二酸、ノナデカン二酸、エイコサン二酸、ヘンエイコサン二酸、ドコサン二酸、トリコサン二酸、テトラコサン二酸、ペンタコサン二酸、ヘキサコサン二酸、ヘプタコサン二酸、オクタコサン二酸、ノナコサン二酸、トリアコンタン二酸、ヘントリアコンタン二酸、ドトリアコンタン二酸、ジグリコール酸、更に下記式で表されるジカルボン酸等が挙げられる。 As the dicarboxylic acid residue, a dicarboxylic acid containing an aliphatic group and a dicarboxylic acid residue containing an aromatic group are preferable, and a dicarboxylic acid residue containing an aromatic group is more preferable.
As the dicarboxylic acid containing an aliphatic group, a dicarboxylic acid containing a linear or branched (preferably straight chain) aliphatic group is preferable, and a linear or branched (preferably straight chain) aliphatic group and two -COOH are preferable. A dicarboxylic acid consisting of is more preferable. The number of carbon atoms of the linear or branched (preferably linear) aliphatic group is preferably 2 to 30, more preferably 2 to 25, still more preferably 3 to 20, and 4 to 20. It is more preferably 15, and particularly preferably 5 to 10. The linear aliphatic group is preferably an alkylene group.
Examples of the dicarboxylic acid containing a linear aliphatic group include malonic acid, dimethylmalonic acid, ethylmalonic acid, isopropylmalonic acid, di-n-butylmalonic acid, succinic acid, tetrafluorosuccinic acid, methylsuccinic acid, 2, 2-dimethylsuccinic acid, 2,3-dimethylsuccinic acid, dimethylmethylsuccinic acid, glutaric acid, hexafluoroglutaric acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylglutaric acid, 3,3-Didimethylglutaric acid, 3-ethyl-3-methylglutaric acid, adipic acid, octafluoroadipic acid, 3-methyladipic acid, pimelic acid, 2,2,6,6-tetramethylpimeric acid, sverin Acid, dodecafluorosveric acid, azelaic acid, sebacic acid, hexadecafluorosevacinic acid, 1,9-nonanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, heptadecanedioic acid , Octadecandioic acid, Nonadecandioic acid, Eikosandioic acid, Heneikosandioic acid, Docosandioic acid, Tricosanedioic acid, Tetracosandioic acid, Pentacosandioic acid, Hexacosandioic acid, Heptakosandioic acid, Octakosandioic acid, Nonakosandioic acid, Tria Examples thereof include contandioic acid, hentoria-contandioic acid, dotoria-contanedioic acid, diglycolic acid, and dicarboxylic acid represented by the following formula.
(式中、Zは炭素数1~6の炭化水素基であり、nは1~6の整数である。)
(In the formula, Z is a hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 1 to 6).
式中、Aは-CH2-、-O-、-S-、-SO2-、-CO-、-NHCO-、-C(CF3)2-、及び、-C(CH3)2-からなる群から選択される2価の基を表し、*はそれぞれ独立に、他の構造との結合部位を表す。
In the formula, A is -CH 2- , -O-, -S-, -SO 2- , -CO-, -NHCO-, -C (CF 3 ) 2- , and -C (CH 3 ) 2- It represents a divalent group selected from the group consisting of, and * represents a binding site with another structure independently.
例えば、R121は上述の側鎖、又は、上述の式(1-2)で表される構造を有するジカルボン酸化合物に由来する構造とすることもできる。
R121が上述の側鎖、又は、上述の式(1-2)で表される構造を含む場合、R121は、芳香族炭化水素基と、上述の側鎖、又は、上述の式(1-2)で表される構造とが直結した構造とを含むことが好ましい。
また、R121が上述の側鎖、又は、上述の式(1-2)で表される構造を含む場合、R121は上述の式(LD-1)で表される構造であることが好ましい。ただし、上述の式(LD-1)において、「*はそれぞれ、式(2)中のR11が結合する窒素原子との結合部位を表す。」との記載は、「*はそれぞれ、式(3)中のR121が結合するカルボニル基との結合部位を表す。」と読み替えるものとする。 Further, R 121 may have a structure including the above-mentioned side chain or the above-mentioned structure represented by the formula (1-2). The preferred embodiment of the side chain or the structure represented by the above formula (1-2) is as described above.
For example, R 121 may have a structure derived from the above-mentioned side chain or a dicarboxylic acid compound having a structure represented by the above-mentioned formula (1-2).
When R 121 contains the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2), R 121 comprises an aromatic hydrocarbon group and the above-mentioned side chain or the above-mentioned formula (1). It is preferable to include a structure directly connected to the structure represented by -2).
Further, when R 121 contains the above-mentioned side chain or the structure represented by the above-mentioned formula (1-2), it is preferable that R 121 has the above-mentioned structure represented by the above-mentioned formula (LD-1). .. However, in the above formula (LD-1), the description that "* represents the binding site with the nitrogen atom to which R 11 binds in the formula (2), respectively." Is described as "* represents the binding site, respectively." 3) Represents the binding site with the carbonyl group to which R 121 is bound. "
R122は、また、ビスアミノフェノール誘導体由来の基であることが好ましく、ビスアミノフェノール誘導体由来の基としては、例えば、3,3’-ジアミノ-4,4’-ジヒドロキシビフェニル、4,4’-ジアミノ-3,3’-ジヒドロキシビフェニル、3,3’-ジアミノ-4,4’-ジヒドロキシジフェニルスルホン、4,4’-ジアミノ-3,3’-ジヒドロキシジフェニルスルホン、ビス-(3-アミノ-4-ヒドロキシフェニル)メタン、2,2-ビス(3-アミノ-4-ヒドロキシフェニル)プロパン、2,2-ビス-(3-アミノ-4-ヒドロキシフェニル)ヘキサフルオロプロパン、2,2-ビス-(4-アミノ-3-ヒドロキシフェニル)ヘキサフルオロプロパン、ビス-(4-アミノ-3-ヒドロキシフェニル)メタン、2,2-ビス-(4-アミノ-3-ヒドロキシフェニル)プロパン、4,4’-ジアミノ-3,3’-ジヒドロキシベンゾフェノン、3,3’-ジアミノ-4,4’-ジヒドロキシベンゾフェノン、4,4’-ジアミノ-3,3’-ジヒドロキシジフェニルエーテル、3,3’-ジアミノ-4,4’-ジヒドロキシジフェニルエーテル、1,4-ジアミノ-2,5-ジヒドロキシベンゼン、1,3-ジアミノ-2,4-ジヒドロキシベンゼン、1,3-ジアミノ-4,6-ジヒドロキシベンゼンなどが挙げられる。これらのビスアミノフェノールは、単独にて、あるいは混合して使用してもよい。 In formula (3), R 122 represents a tetravalent organic group. The tetravalent organic group has the same meaning as R 115 in the above formula (2), and the preferable range is also the same.
R 122 is also preferably a group derived from a bisaminophenol derivative, and examples of the group derived from a bisaminophenol derivative include, for example, 3,3'-diamino-4,4'-dihydroxybiphenyl, 4,4'. -Diamino-3,3'-dihydroxybiphenyl, 3,3'-diamino-4,4'-dihydroxydiphenylsulfone, 4,4'-diamino-3,3'-dihydroxydiphenylsulfone, bis- (3-amino- 4-Hydroxyphenyl) methane, 2,2-bis (3-amino-4-hydroxyphenyl) propane, 2,2-bis- (3-amino-4-hydroxyphenyl) hexafluoropropane, 2,2-bis- (4-Amino-3-hydroxyphenyl) hexafluoropropane, bis- (4-amino-3-hydroxyphenyl) methane, 2,2-bis- (4-amino-3-hydroxyphenyl) propane, 4,4'-Diamino-3,3'-dihydroxybenzophenone,3,3'-diamino-4,4'-dihydroxybenzophenone,4,4'-diamino-3,3'-dihydroxydiphenyl ether, 3,3'-diamino-4, Examples thereof include 4'-dihydroxydiphenyl ether, 1,4-diamino-2,5-dihydroxybenzene, 1,3-diamino-2,4-dihydroxybenzene and 1,3-diamino-4,6-dihydroxybenzene. These bis-aminophenols may be used alone or in combination.
式中、X1は、-O-、-S-、-C(CF3)2-、-CH2-、-SO2-、-NHCO-を表し、*及び#はそれぞれ、他の構造との結合部位を表す。Rは水素原子又は1価の置換基を表し、水素原子又は炭化水素基が好ましく、水素原子又はアルキル基がより好ましい。また、R122は、上記式により表される構造であることも好ましい。R122が、上記式により表される構造である場合、計4つの*及び#のうち、いずれか2つが式(3)中のR122が結合する窒素原子との結合部位であり、かつ、別の2つが式(3)中のR122が結合する酸素原子との結合部位であることが好ましく、2つの*が式(3)中のR122が結合する酸素原子との結合部位であり、かつ、2つの#が式(3)中のR122が結合する窒素原子との結合部位であるか、又は、2つの*が式(3)中のR122が結合する窒素原子との結合部位であり、かつ、2つの#が式(3)中のR122が結合する酸素原子との結合部位であることがより好ましく、2つの*が式(3)中のR122が結合する酸素原子との結合部位であり、かつ、2つの#が式(3)中のR122が結合する窒素原子との結合部位であることが更に好ましい。
In the formula, X 1 represents -O-, -S-, -C (CF 3 ) 2- , -CH 2- , -SO 2- , -NHCO-, and * and # represent other structures, respectively. Represents the binding site of. R represents a hydrogen atom or a monovalent substituent, preferably a hydrogen atom or a hydrocarbon group, and more preferably a hydrogen atom or an alkyl group. Further, it is also preferable that R 122 has a structure represented by the above formula. When R 122 has a structure represented by the above formula, any two of the four * and # in total are the bonding sites with the nitrogen atom to which R 122 in the formula (3) is bonded, and The other two are preferably the bonding sites with the oxygen atom to which R 122 in the formula (3) is bonded, and the two * are the bonding sites with the oxygen atom to which the R 122 in the formula (3) is bonded. , And two # are the bonding sites with the nitrogen atom to which R 122 in the formula (3) is bonded, or two * are the bonding sites with the nitrogen atom to which R 122 in the formula (3) is bonded. It is more preferable that the site is a site and the two #s are the bonding sites with the oxygen atom to which the R 122 in the formula (3) is bonded, and the two * are the oxygen to which the R 122 in the formula (3) is bonded. It is more preferable that it is a bond site with an atom and the two #s are bond sites with a nitrogen atom to which R 122 in the formula (3) is bonded.
ポリベンゾオキサゾール前駆体は、閉環に伴う反りの発生を抑制できる点で、下記式(SL)で表されるジアミン残基を他の種類の繰返し単位として含むことが好ましい。 The polybenzoxazole precursor may contain other types of repeating units in addition to the repeating units of the above formula (3).
The polybenzoxazole precursor preferably contains a diamine residue represented by the following formula (SL) as another type of repeating unit in that the generation of warpage associated with ring closure can be suppressed.
式(SL)中、Zは、a構造とb構造を有し、R1sは、水素原子又は炭素数1~10の炭化水素基であり、R2sは炭素数1~10の炭化水素基であり、R3s、R4s、R5s、R6sのうち少なくとも1つは芳香族基で、残りは水素原子又は炭素数1~30の有機基で、それぞれ同一でも異なっていてもよい。a構造及びb構造の重合は、ブロック重合でもランダム重合でもよい。Z部分のモル%は、a構造は5~95モル%、b構造は95~5モル%であり、a+bは100モル%である。
In formula (SL), Z has an a structure and a b structure, R 1s is a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, and R 2s is a hydrocarbon group having 1 to 10 carbon atoms. Yes, at least one of R 3s , R 4s , R 5s , and R 6s is an aromatic group, and the rest are hydrogen atoms or organic groups having 1 to 30 carbon atoms, which may be the same or different. The polymerization of the a structure and the b structure may be block polymerization or random polymerization. The mol% of the Z portion is 5 to 95 mol% for the a structure, 95 to 5 mol% for the b structure, and 100 mol% for a + b.
上記ポリベンゾオキサゾール前駆体の分子量の分散度は、1.4以上であることが好ましく、1.5以上がより好ましく、1.6以上であることが更に好ましい。ポリベンゾオキサゾール前駆体の分子量の分散度の上限値は特に定めるものではないが、例えば、2.6以下が好ましく、2.5以下がより好ましく、2.4以下が更に好ましく、2.3以下が一層好ましく、2.2以下がより一層好ましい。
また、樹脂組成物が特定樹脂として複数種のポリベンゾオキサゾール前駆体を含む場合、少なくとも1種のポリベンゾオキサゾール前駆体の重量平均分子量、数平均分子量、及び、分散度が上記範囲であることが好ましい。また、上記複数種のポリベンゾオキサゾール前駆体を1つの樹脂として算出した重量平均分子量、数平均分子量、及び、分散度が、それぞれ、上記範囲内であることも好ましい。 The weight average molecular weight (Mw) of the polybenzoxazole precursor is, for example, preferably 18,000 to 30,000, more preferably 20,000 to 29,000, still more preferably 22,000 to 28, It is 000. The number average molecular weight (Mn) is preferably 7,200 to 14,000, more preferably 8,000 to 12,000, and even more preferably 9,200 to 11,200.
The degree of dispersion of the molecular weight of the polybenzoxazole precursor is preferably 1.4 or more, more preferably 1.5 or more, still more preferably 1.6 or more. The upper limit of the dispersity of the molecular weight of the polybenzoxazole precursor is not particularly determined, but for example, 2.6 or less is preferable, 2.5 or less is more preferable, 2.4 or less is further preferable, and 2.3 or less. Is more preferable, and 2.2 or less is even more preferable.
When the resin composition contains a plurality of types of polybenzoxazole precursors as the specific resin, the weight average molecular weight, number average molecular weight, and dispersity of at least one type of polybenzoxazole precursor may be within the above ranges. preferable. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of types of polybenzoxazole precursors as one resin are within the above ranges.
ポリベンゾオキサゾールとしては、ベンゾオキサゾール環を有する高分子化合物であれば、特に限定はないが、下記式(X)で表される化合物であることが好ましく、下記式(X)で表される化合物であって、重合性基を有する化合物であることがより好ましい。上記重合性基としては、ラジカル重合性基が好ましい。
式(X)中、R133は、2価の有機基を表し、R134は、4価の有機基を表す。
重合性基を有する場合、重合性基は、R133及びR134の少なくとも一方に位置していてもよいし、下記式(X-1)又は式(X-2)に示すようにポリベンゾオキサゾールの末端に位置していてもよい。
式(X-1)
式(X-1)中、R135及びR136の少なくとも一方は、重合性基であり、重合性基でない場合は有機基であり、他の基は式(X)と同義である。
式(X-2)
式(X-2)中、R137は重合性基であり、他は置換基であり、他の基は式(X)と同義である。 [Polybenzoxazole]
The polybenzoxazole is not particularly limited as long as it is a polymer compound having a benzoxazole ring, but is preferably a compound represented by the following formula (X), and a compound represented by the following formula (X). It is more preferable that the compound has a polymerizable group. As the polymerizable group, a radically polymerizable group is preferable.
In formula (X), R 133 represents a divalent organic group and R 134 represents a tetravalent organic group.
When having a polymerizable group, the polymerizable group may be located at at least one of R 133 and R 134 , and may be polybenzoxazole as shown in the following formula (X-1) or formula (X-2). It may be located at the end of.
Equation (X-1)
In the formula (X-1), at least one of R 135 and R 136 is a polymerizable group, and if it is not a polymerizable group, it is an organic group, and the other group is synonymous with the formula (X).
Equation (X-2)
In formula (X-2), R 137 is a polymerizable group, the other is a substituent, and the other group is synonymous with formula (X).
例えば、R122として例示される4価の有機基の4つの結合子が、上記式(X)中の窒素原子、酸素原子と結合して縮合環を形成する。例えば、R134が、下記有機基である場合、下記構造を形成する。下記構造中、*はそれぞれ、式(X)中の窒素原子又は酸素原子との結合部位を表す。
For example, four conjugates of a tetravalent organic group exemplified as R 122 combine with a nitrogen atom and an oxygen atom in the above formula (X) to form a fused ring. For example, when R 134 is the following organic group, it forms the following structure. In the following structure, * represents a binding site with a nitrogen atom or an oxygen atom in the formula (X), respectively.
上記オキサゾール化率は、例えば下記方法により測定される。
ポリベンゾオキサゾールの赤外吸収スペクトルを測定し、前駆体のアミド構造に由来する吸収ピークである1650cm-1付近のピーク強度Q1を求める。次に、1490cm-1付近に見られる芳香環の吸収強度で規格化する。そのポリベンゾオキサゾールを350℃で1時間熱処理した後、再度、赤外吸収スペクトルを測定し、1650cm-1付近のピーク強度Q2を求め、1490cm-1付近に見られる芳香環の吸収強度で規格化する。得られたピーク強度Q1、Q2の規格値を用い、下記式に基づいて、ポリベンゾオキサゾールのオキサゾール化率を求めることができる。
オキサゾール化率(%)=(ピーク強度Q1の規格値/ピーク強度Q2の規格値)×100 The oxazole formation rate of polybenzoxazole is preferably 85% or more, more preferably 90% or more. The upper limit is not particularly limited and may be 100%. When the oxazole formation rate is 85% or more, the membrane shrinkage due to ring closure that occurs when oxazoled by heating is reduced, and the occurrence of warpage can be suppressed more effectively.
The oxazole formation rate is measured, for example, by the following method.
The infrared absorption spectrum of polybenzoxazole is measured to determine the peak intensity Q1 near 1650 cm -1 , which is the absorption peak derived from the amide structure of the precursor. Next, normalize by the absorption intensity of the aromatic ring found near 1490 cm -1 . After heat-treating the polybenzoxazole at 350 ° C. for 1 hour, the infrared absorption spectrum was measured again to obtain the peak intensity Q2 near 1650 cm -1 , and standardized by the absorption intensity of the aromatic ring found near 1490 cm -1 . do. Using the obtained standard values of peak intensities Q1 and Q2, the oxazole conversion rate of polybenzoxazole can be determined based on the following formula.
Oxazole formation rate (%) = (standard value of peak intensity Q1 / standard value of peak intensity Q2) × 100
なお、ジカルボン酸の場合には反応収率等を高めるため、1-ヒドロキシ-1,2,3-ベンゾトリアゾール等を予め反応させた活性エステル型のジカルボン酸誘導体を用いてもよい。 The polybenzoxazole is obtained by reacting, for example, a bisaminophenol derivative with a dicarboxylic acid containing R133 or a compound selected from the dicarboxylic acid dichloride and the dicarboxylic acid derivative of the above dicarboxylic acid to obtain a polybenzoxazole precursor. , This can be obtained by oxazole using a known oxazole reaction method.
In the case of a dicarboxylic acid, an active ester-type dicarboxylic acid derivative that has been previously reacted with 1-hydroxy-1,2,3-benzotriazole or the like may be used in order to increase the reaction yield or the like.
また、ポリベンゾオキサゾールの数平均分子量(Mn)は、好ましくは7,200~14,000であり、より好ましくは8,000~12,000であり、更に好ましくは9,200~11,200である。
上記ポリベンゾオキサゾールの分子量の分散度は、1.4以上であることが好ましく、1.5以上がより好ましく、1.6以上であることが更に好ましい。ポリベンゾオキサゾールの分子量の分散度の上限値は特に定めるものではないが、例えば、2.6以下が好ましく、2.5以下がより好ましく、2.4以下が更に好ましく、2.3以下が一層好ましく、2.2以下がより一層好ましい。
また、樹脂組成物が特定樹脂として複数種のポリベンゾオキサゾールを含む場合、少なくとも1種のポリベンゾオキサゾールの重量平均分子量、数平均分子量、及び、分散度が上記範囲であることが好ましい。また、上記複数種のポリベンゾオキサゾールを1つの樹脂として算出した重量平均分子量、数平均分子量、及び、分散度が、それぞれ、上記範囲内であることも好ましい。 The weight average molecular weight (Mw) of polybenzoxazole is preferably 5,000 to 70,000, more preferably 8,000 to 50,000, still more preferably 10,000 to 30,000. By setting the weight average molecular weight to 5,000 or more, the breakage resistance of the film after curing can be improved. In order to obtain an organic film having excellent mechanical properties, the weight average molecular weight is particularly preferably 20,000 or more. When two or more kinds of polybenzoxazole are contained, it is preferable that the weight average molecular weight of at least one kind of polybenzoxazole is in the above range.
The number average molecular weight (Mn) of polybenzoxazole is preferably 7,200 to 14,000, more preferably 8,000 to 12,000, and even more preferably 9,200 to 11,200. be.
The degree of dispersion of the molecular weight of the polybenzoxazole is preferably 1.4 or more, more preferably 1.5 or more, and further preferably 1.6 or more. The upper limit of the dispersity of the molecular weight of polybenzoxazole is not particularly defined, but for example, 2.6 or less is preferable, 2.5 or less is more preferable, 2.4 or less is further preferable, and 2.3 or less is further preferable. Preferably, 2.2 or less is even more preferable.
When the resin composition contains a plurality of types of polybenzoxazole as the specific resin, it is preferable that the weight average molecular weight, the number average molecular weight, and the dispersity of at least one type of polybenzoxazole are in the above range. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of types of polybenzoxazole as one resin are each within the above ranges.
ポリアミドイミド前駆体は、下記式(PAI-2)で表される繰返し単位を含むことが好ましい。
式(PAI-2)中、R117は3価の有機基を表し、R111は2価の有機基を表し、A2は酸素原子又は-NH-を表し、R113は水素原子又は1価の有機基を表す。
また、本発明で用いるポリアミドイミド前駆体は、上記式(PAI-2)で表される繰り返し単位中に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含むことが好ましい。
すなわち、第2の特定樹脂は、式(2)で表される繰返し単位において、R111、R113及びR117よりなる群から選ばれた少なくとも1つに、式(1-2)で表される構造を含むことが好ましい。
具体的には、下記(3A)~(3C)の少なくとも1つを満たすことが好ましく、(3A)及び(3B)の少なくとも1つを満たすことがより好ましく、少なくとも(3A)を満たすことが更に好ましい。
(3A)上記式(PAI-2)中のR113を含む構造が第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造である。
(3B)R111に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含む
(3C)R117に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含む [Polyamide-imide precursor]
The polyamide-imide precursor preferably contains a repeating unit represented by the following formula (PAI-2).
In formula (PAI-2), R 117 represents a trivalent organic group, R 111 represents a divalent organic group, A 2 represents an oxygen atom or -NH-, and R 113 represents a hydrogen atom or monovalent. Represents an organic group of.
Further, the polyamide-imide precursor used in the present invention is a side chain in the first specific resin or the formula (1-2) in the second specific resin in the repeating unit represented by the above formula (PAI-2). It is preferable to include the structure represented by.
That is, the second specific resin is represented by the formula (1-2) in at least one selected from the group consisting of R 111 , R 113 and R 117 in the repeating unit represented by the formula (2). It is preferable to include a structure.
Specifically, it is preferable to satisfy at least one of the following (3A) to (3C), more preferably to satisfy at least one of (3A) and (3B), and further to satisfy at least (3A). preferable.
(3A) The structure containing R 113 in the above formula (PAI-2) is a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin.
(3B) R 111 contains a side chain in the first specific resin or a structure represented by the formula (1-2) in the second specific resin (3C) R 117 contains a side chain in the first specific resin. Or, the structure represented by the formula (1-2) in the second specific resin is included.
上記連結基としては、-O-、-S-、-C(=O)-、-S(=O)2-、アルキレン基、ハロゲン化アルキレン基、アリーレン基、又はこれらを2以上結合した連結基が好ましく、-O-、-S-、アルキレン基、ハロゲン化アルキレン基、アリーレン基、又はこれらを2以上結合した連結基がより好ましい。
上記アルキレン基としては、炭素数1~20のアルキレン基が好ましく、炭素数1~10のアルキレン基がより好ましく、炭素数1~4のアルキレン基が更に好ましい。
上記ハロゲン化アルキレン基としては、炭素数1~20のハロゲン化アルキレン基が好ましく、炭素数1~10のハロゲン化アルキレン基がより好ましく、炭素数1~4のハロゲン化アルキレン基がより好ましい。また、上記ハロゲン化アルキレン基におけるハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子等が挙げられ、フッ素原子が好ましい。上記ハロゲン化アルキレン基は、水素原子を有していても、水素原子の全てがハロゲン原子で置換されていてもよいが、水素原子の全てがハロゲン原子で置換されていることが好ましい。好ましいハロゲン化アルキレン基の例としては、(ジトリフルオロメチル)メチレン基等が挙げられる。
上記アリーレン基としては、フェニレン基又はナフチレン基が好ましく、フェニレン基がより好ましく、1,3-フェニレン基又は1,4-フェニレン基が更に好ましい。 In formula (PAI-2), R 117 is composed of a linear or branched aliphatic group, a cyclic aliphatic group, and an aromatic group, a heteroarophatic group, or a single bond or a linking group. Examples of the above-mentioned linked groups are a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, and a cyclic aliphatic group having 6 to 20 carbon atoms. The aromatic group of the above, or a group in which two or more of these are combined by a single bond or a linking group is preferable, and an aromatic group having 6 to 20 carbon atoms or an aromatic group having 6 to 20 carbon atoms by a single bond or a linking group is preferable. A group in which two or more of the above are combined is more preferable.
The linking group includes -O-, -S-, -C (= O)-, -S (= O) 2- , an alkylene group, a halogenated alkylene group, an arylene group, or a link in which two or more of these are bonded. A group is preferable, and an —O—, —S—, an alkylene group, a halogenated alkylene group, an arylene group, or a linking group in which two or more of these are bonded is more preferable.
As the alkylene group, an alkylene group having 1 to 20 carbon atoms is preferable, an alkylene group having 1 to 10 carbon atoms is more preferable, and an alkylene group having 1 to 4 carbon atoms is further preferable.
As the halogenated alkylene group, a halogenated alkylene group having 1 to 20 carbon atoms is preferable, a halogenated alkylene group having 1 to 10 carbon atoms is more preferable, and a halogenated alkylene group having 1 to 4 carbon atoms is more preferable. Examples of the halogen atom in the halogenated alkylene group include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a fluorine atom is preferable. The halogenated alkylene group may have a hydrogen atom or all of the hydrogen atoms may be substituted with a halogen atom, but it is preferable that all of the hydrogen atoms are substituted with a halogen atom. Examples of preferred halogenated alkylene groups include (ditrifluoromethyl) methylene groups and the like.
As the arylene group, a phenylene group or a naphthylene group is preferable, a phenylene group is more preferable, and a 1,3-phenylene group or a 1,4-phenylene group is further preferable.
本発明において、カルボキシ基を3つ有する化合物をトリカルボン酸化合物という。
上記トリカルボン酸化合物の3つのカルボキシ基のうち2つのカルボキシ基は酸無水物化されていてもよい。
ポリアミドイミド前駆体の製造に用いられるハロゲン化されていてもよいトリカルボン酸化合物としては、分岐鎖状の脂肪族、環状の脂肪族又は芳香族のトリカルボン酸化合物などが挙げられる。
これらのトリカルボン酸化合物は、1種のみ用いてもよいし、2種以上用いてもよい。 Further, R 117 is preferably derived from a tricarboxylic acid compound in which at least one carboxy group may be halogenated. Chlorination is preferable as the halogenation.
In the present invention, a compound having three carboxy groups is referred to as a tricarboxylic acid compound.
Of the three carboxy groups of the tricarboxylic acid compound, two carboxy groups may be acid anhydrideized.
Examples of the halogenated tricarboxylic acid compound used in the production of the polyamide-imide precursor include branched chain aliphatic, cyclic aliphatic or aromatic tricarboxylic acid compounds.
Only one kind of these tricarboxylic acid compounds may be used, or two or more kinds may be used.
これらの化合物は、2つのカルボキシ基が無水物化した化合物(例えば、トリメリット酸無水物)であってもよいし、少なくとも1つのカルボキシ基がハロゲン化した化合物(例えば、無水トリメリット酸クロリド)であってもよい。 Specific examples of the tricarboxylic acid compound include 1,2,3-propanetricarboxylic acid, 1,3,5-pentanetricarboxylic acid, citric acid, trimellitic acid, 2,3,6-naphthalenetricarboxylic acid, and phthalic acid. (Or phthalic acid anhydride) and benzoic acid are single-bonded, -O-, -CH 2- , -C (CH 3 ) 2- , -C (CF 3 ) 2- , -SO 2- or a phenylene group. Examples thereof include linked compounds.
These compounds may be compounds in which two carboxy groups are anhydrated (eg, trimellitic acid anhydride) or compounds in which at least one carboxy group is halogenated (eg, trimellitic acid anhydride). There may be.
他の繰返し単位としては、上述の式(2)で表される繰返し単位、下記式(PAI-1)で表される繰返し単位等が挙げられる。
Examples of the other repeating unit include a repeating unit represented by the above formula (2), a repeating unit represented by the following formula (PAI-1), and the like.
式(PAI-1)中、R116は、直鎖状又は分岐鎖状の脂肪族基、環状の脂肪族基、及び芳香族基、複素芳香族基、又は単結合若しくは連結基によりこれらを2以上連結した基が例示され、炭素数2~20の直鎖の脂肪族基、炭素数3~20の分岐の脂肪族基、炭素数3~20の環状の脂肪族基、炭素数6~20の芳香族基、又は、単結合若しくは連結基によりこれらを2以上組み合わせた基が好ましく、炭素数6~20の芳香族基、又は、単結合若しくは連結基により炭素数6~20の芳香族基を2以上組み合わせた基がより好ましい。
上記連結基としては、-O-、-S-、-C(=O)-、-S(=O)2-、アルキレン基、ハロゲン化アルキレン基、アリーレン基、又はこれらを2以上結合した連結基が好ましく、-O-、-S-、アルキレン基、ハロゲン化アルキレン基、アリーレン基、又はこれらを2以上結合した連結基がより好ましい。
上記アルキレン基としては、炭素数1~20のアルキレン基が好ましく、炭素数1~10のアルキレン基がより好ましく、炭素数1~4のアルキレン基が更に好ましい。
上記ハロゲン化アルキレン基としては、炭素数1~20のハロゲン化アルキレン基が好ましく、炭素数1~10のハロゲン化アルキレン基がより好ましく、炭素数1~4のハロゲン化アルキレン基がより好ましい。また、上記ハロゲン化アルキレン基におけるハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子等が挙げられ、フッ素原子が好ましい。上記ハロゲン化アルキレン基は、水素原子を有していても、水素原子の全てがハロゲン原子で置換されていてもよいが、水素原子の全てがハロゲン原子で置換されていることが好ましい。好ましいハロゲン化アルキレン基の例としては、(ジトリフルオロメチル)メチレン基等が挙げられる。
上記アリーレン基としては、フェニレン基又はナフチレン基が好ましく、フェニレン基がより好ましく、1,3-フェニレン基又は1,4-フェニレン基が更に好ましい。 In formula (PAI-1), R 116 represents a divalent organic group and R 111 represents a divalent organic group.
In formula (PAI-1), R 116 is a linear or branched aliphatic group, a cyclic aliphatic group, and an aromatic group, a heteroarophatic group, or a single bond or a linking group. Examples of the above-mentioned linked groups are a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, and a cyclic aliphatic group having 6 to 20 carbon atoms. The aromatic group of the above, or a group in which two or more of these are combined by a single bond or a linking group is preferable, and an aromatic group having 6 to 20 carbon atoms or an aromatic group having 6 to 20 carbon atoms by a single bond or a linking group is preferable. A group in which two or more of the above are combined is more preferable.
The linking group includes -O-, -S-, -C (= O)-, -S (= O) 2- , an alkylene group, a halogenated alkylene group, an arylene group, or a link in which two or more of these are bonded. A group is preferable, and an —O—, —S—, an alkylene group, a halogenated alkylene group, an arylene group, or a linking group in which two or more of these are bonded is more preferable.
As the alkylene group, an alkylene group having 1 to 20 carbon atoms is preferable, an alkylene group having 1 to 10 carbon atoms is more preferable, and an alkylene group having 1 to 4 carbon atoms is further preferable.
As the halogenated alkylene group, a halogenated alkylene group having 1 to 20 carbon atoms is preferable, a halogenated alkylene group having 1 to 10 carbon atoms is more preferable, and a halogenated alkylene group having 1 to 4 carbon atoms is more preferable. Examples of the halogen atom in the halogenated alkylene group include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like, and a fluorine atom is preferable. The halogenated alkylene group may have a hydrogen atom or all of the hydrogen atoms may be substituted with a halogen atom, but it is preferable that all of the hydrogen atoms are substituted with a halogen atom. Examples of preferred halogenated alkylene groups include (ditrifluoromethyl) methylene groups and the like.
As the arylene group, a phenylene group or a naphthylene group is preferable, a phenylene group is more preferable, and a 1,3-phenylene group or a 1,4-phenylene group is further preferable.
本発明において、カルボキシ基を2つ有する化合物をジカルボン酸化合物、ハロゲン化されたカルボキシ基を2つ有する化合物をジカルボン酸ジハライド化合物という。
ジカルボン酸ジハライド化合物におけるカルボキシ基は、ハロゲン化されていればよいが、例えば、塩素化されていることが好ましい。すなわち、ジカルボン酸ジハライド化合物は、ジカルボン酸ジクロリド化合物であることが好ましい。
ポリアミドイミド前駆体の製造に用いられるハロゲン化されていてもよいジカルボン酸化合物又はジカルボン酸ジハライド化合物としては、直鎖状又は分岐鎖状の脂肪族、環状の脂肪族又は芳香族ジカルボン酸化合物又はジカルボン酸ジハライド化合物などが挙げられる。
これらのジカルボン酸化合物又はジカルボン酸ジハライド化合物は、1種のみ用いてもよいし、2種以上用いてもよい。 Further, R 116 is preferably derived from a dicarboxylic acid compound or a dicarboxylic acid dihalide compound.
In the present invention, a compound having two carboxy groups is referred to as a dicarboxylic acid compound, and a compound having two halogenated carboxy groups is referred to as a dicarboxylic acid dihalide compound.
The carboxy group in the dicarboxylic acid dihalide compound may be halogenated, but is preferably chlorinated, for example. That is, the dicarboxylic acid dihalide compound is preferably a dicarboxylic acid dichloride compound.
Examples of the halogenated dicarboxylic acid compound or dicarboxylic acid dihalide compound used in the production of the polyamideimide precursor include linear or branched aliphatic, cyclic aliphatic or aromatic dicarboxylic acid compounds or dicarboxylic acids. Examples include aciddihalide compounds.
Only one kind or two or more kinds of these dicarboxylic acid compounds or dicarboxylic acid dihalide compounds may be used.
ジカルボン酸ジハライド化合物の具体例としては、上記ジカルボン酸化合物の具体例における2つのカルボキシ基をハロゲン化した構造の化合物が挙げられる。 Specific examples of the dicarboxylic acid compound include malonic acid, dimethylmalonic acid, ethylmalonic acid, isopropylmalonic acid, di-n-butylmalonic acid, succinic acid, tetrafluorosuccinic acid, and methylsuccinic acid, 2,2-. Didimethyl succinic acid, 2,3-dimethylsuccinic acid, dimethylmethylsuccinic acid, glutaric acid, hexafluoroglutaric acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylglutaric acid, 3, 3-Didimethylglutaric acid, 3-ethyl-3-methylglutaric acid, adipic acid, octafluoroadipic acid, 3-methyladipic acid, pimelic acid, 2,2,6,6-tetramethylpimeric acid, suberic acid, Dodecafluorosveric acid, azelaic acid, sebacic acid, hexadecafluorosevacinic acid, 1,9-nonanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, heptadecanedioic acid, octadecane Diacid, Nonadecandioic acid, Eikosandioic acid, Heneikosandioic acid, Docosandioic acid, Tricosanedioic acid, Tetracosandioic acid, Pentacosanedioic acid, Hexacosandioic acid, Heptakosandioic acid, Octakosandioic acid, Nonakosandioic acid, Triacanthani Acid, Hentria Contanedioic Acid, Dotoria Contanedioic Acid, Diglycolic Acid, phthalic Acid, Isophthalic Acid, Telephthalic Acid, 4,4'-biphenylcarboxylic Acid, 4,4'-biphenylcarboxylic Acid, 4,4'- Examples thereof include dicarboxydiphenyl ether and benzophenone-4,4'-dicarboxylic acid.
Specific examples of the dicarboxylic acid dihalide compound include compounds having a structure in which two carboxy groups are halogenated in the above-mentioned specific examples of the dicarboxylic acid compound.
また、本発明におけるポリアミドイミド前駆体の別の一実施形態として、式(PAI-2)で表される繰返し単位、及び、式(PAI-1)で表される繰返し単位の合計含有量が、全繰返し単位の50モル%以上である態様が挙げられる。上記合計含有量は、70モル%以上であることがより好ましく、90モル%以上であることが更に好ましく、90モル%超であることが特に好ましい。上記合計含有量の上限は、特に限定されず、末端を除くポリアミドイミド前駆体における全ての繰返し単位が、式(PAI-2)で表される繰返し単位、又は、式(PAI-1)で表される繰返し単位のいずれかであってもよい。 As one embodiment of the polyamide-imide precursor in the present invention, a repeating unit represented by the formula (PAI-2), a repeating unit represented by the formula (PAI-1), and a repeating unit represented by the formula (2). An embodiment in which the total content of the units is 50 mol% or more of all the repeating units can be mentioned. The total content is more preferably 70 mol% or more, further preferably 90 mol% or more, and particularly preferably more than 90 mol%. The upper limit of the total content is not particularly limited, and all the repeating units in the polyamide-imide precursor except the terminal are represented by the repeating unit represented by the formula (PAI-2) and the formula (PAI-1). It may be either a repeating unit or a repeating unit represented by the formula (2).
Further, as another embodiment of the polyamide-imide precursor in the present invention, the total content of the repeating unit represented by the formula (PAI-2) and the repeating unit represented by the formula (PAI-1) is. An embodiment of 50 mol% or more of all repetition units can be mentioned. The total content is more preferably 70 mol% or more, further preferably 90 mol% or more, and particularly preferably more than 90 mol%. The upper limit of the total content is not particularly limited, and all the repeating units in the polyamide-imide precursor except the terminal are represented by the repeating unit represented by the formula (PAI-2) or the formula (PAI-1). It may be any of the repeating units to be used.
ポリアミドイミド前駆体の分子量の分散度は、1.5以上が好ましく、1.8以上がより好ましく、2.0以上であることが更に好ましい。ポリアミドイミド前駆体の分子量の分散度の上限値は特に定めるものではないが、例えば、7.0以下が好ましく、6.5以下がより好ましく、6.0以下が更に好ましい。 また、樹脂組成物が特定樹脂として複数種のポリアミドイミド前駆体を含む場合、少なくとも1種のポリアミドイミド前駆体の重量平均分子量、数平均分子量、及び、分散度が上記範囲であることが好ましい。また、上記複数種のポリアミドイミド前駆体を1つの樹脂として算出した重量平均分子量、数平均分子量、及び、分散度が、それぞれ、上記範囲内であることも好ましい。 The weight average molecular weight (Mw) of the polyamide-imide precursor is preferably 2,000 to 500,000, more preferably 5,000 to 100,000, still more preferably 10,000 to 50,000. .. The number average molecular weight (Mn) is preferably 800 to 250,000, more preferably 2,000 to 50,000, and even more preferably 4,000 to 25,000.
The degree of dispersion of the molecular weight of the polyamide-imide precursor is preferably 1.5 or more, more preferably 1.8 or more, and even more preferably 2.0 or more. The upper limit of the dispersity of the molecular weight of the polyamide-imide precursor is not particularly determined, but is preferably 7.0 or less, more preferably 6.5 or less, still more preferably 6.0 or less, for example. When the resin composition contains a plurality of types of polyamide-imide precursors as the specific resin, the weight average molecular weight, number average molecular weight, and dispersity of at least one type of polyamide-imide precursors are preferably in the above range. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of types of polyamide-imide precursors as one resin are within the above ranges.
本発明に用いられるポリアミドイミドは、アルカリ可溶性ポリアミドイミドであってもよく、有機溶剤を主成分とする現像液に対して可溶なポリアミドイミドであってもよい。
本明細書において、アルカリ可溶性ポリアミドイミドとは、100gの2.38質量%テトラメチルアンモニウム水溶液に対し、23℃で0.1g以上溶解するポリアミドイミドをいい、パターン形成性の観点からは、0.5g以上溶解するポリアミドイミドであることが好ましく、1.0g以上溶解するポリアミドイミドであることが更に好ましい。上記溶解量の上限は特に限定されないが、100g以下であることが好ましい。
また、ポリアミドイミドは、得られる有機膜の膜強度及び絶縁性の観点からは、複数個のアミド結合及び複数個のイミド構造を主鎖に有するポリアミドイミドであることが好ましい。 [Polyamide-imide]
The polyamide-imide used in the present invention may be an alkali-soluble polyamide-imide or may be a polyamide-imide soluble in a developer containing an organic solvent as a main component.
In the present specification, the alkali-soluble polyamide-imide means a polyamide-imide that dissolves 0.1 g or more at 23 ° C. in 100 g of a 2.38 mass% tetramethylammonium aqueous solution, and is 0. It is preferably a polyamide-imide that dissolves 5 g or more, and more preferably a polyamide-imide that dissolves 1.0 g or more. The upper limit of the dissolution amount is not particularly limited, but is preferably 100 g or less.
Further, the polyamide-imide is preferably a polyamide-imide having a plurality of amide bonds and a plurality of imide structures in the main chain from the viewpoint of film strength and insulating property of the obtained organic film.
得られる有機膜の膜強度の観点からは、ポリアミドイミドは、フッ素原子を有することが好ましい。
フッ素原子は、例えば、後述する式(PAI-3)で表される繰返し単位におけるR117、又は、R111に含まれることが好ましく、後述する式(PAI-3)で表される繰返し単位におけるR117、又は、R111にフッ化アルキル基として含まれることがより好ましい。
ポリアミドイミドの全質量に対するフッ素原子の量は、5質量%以上が好ましく、また、20質量%以下が好ましい。 -Fluorine atom-
From the viewpoint of the film strength of the obtained organic film, the polyamide-imide preferably has a fluorine atom.
The fluorine atom is preferably contained in, for example, R 117 or R 111 in the repeating unit represented by the formula (PAI-3) described later, and in the repeating unit represented by the formula (PAI-3) described later. It is more preferable that it is contained in R 117 or R 111 as an alkyl fluoride group.
The amount of fluorine atoms with respect to the total mass of the polyamide-imide is preferably 5% by mass or more, and more preferably 20% by mass or less.
得られる有機膜の膜強度の観点からは、ポリアミドイミドは、エチレン性不飽和結合を有してもよい。
ポリアミドイミドは、エチレン性不飽和結合を主鎖末端に有していてもよいし、側鎖に有していてもよいが、側鎖に有することが好ましい。
上記エチレン性不飽和結合は、ラジカル重合性を有することが好ましい。
エチレン性不飽和結合は、後述する式(PAI-3)で表される繰返し単位におけるR117、又は、R111に含まれることが好ましく、後述する式(PAI-3)で表される繰返し単位におけるR117、又は、R111にエチレン性不飽和結合を有する基として含まれることがより好ましい。
エチレン性不飽和結合を有する基の好ましい態様は、上述のポリイミドにおけるエチレン性不飽和結合を有する基の好ましい態様と同様である。 -Ethylene unsaturated bond-
From the viewpoint of the film strength of the obtained organic film, the polyamide-imide may have an ethylenically unsaturated bond.
The polyamide-imide may have an ethylenically unsaturated bond at the end of the main chain or at the side chain, but it is preferable to have it at the side chain.
The ethylenically unsaturated bond is preferably radically polymerizable.
The ethylenically unsaturated bond is preferably contained in R 117 or R 111 in the repeating unit represented by the formula (PAI-3) described later, and the repeating unit represented by the formula (PAI-3) described later. It is more preferable that it is contained as a group having an ethylenically unsaturated bond in R 117 or R 111 in the above.
The preferred embodiment of the group having an ethylenically unsaturated bond is the same as the preferred embodiment of the group having an ethylenically unsaturated bond in the above-mentioned polyimide.
ポリアミドイミドは、エチレン性不飽和結合以外の重合性基を有していてもよい。
ポリアミドイミドにおけるエチレン性不飽和結合以外の重合性基としては、上述のポリイミドにおけるエチレン性不飽和結合以外の重合性基と同様の基が挙げられる。
エチレン性不飽和結合以外の重合性基は、例えば、後述する式(PAI-3)で表される繰返し単位におけるR111に含まれることが好ましい。
ポリアミドイミドの全質量に対するエチレン性不飽和結合以外の重合性基の量は、0.05~10mol/gであることが好ましく、0.1~5mol/gであることがより好ましい。 -Polymerizable groups other than ethylenically unsaturated bonds-
The polyamide-imide may have a polymerizable group other than the ethylenically unsaturated bond.
Examples of the polymerizable group other than the ethylenically unsaturated bond in the polyamide-imide include the same groups as the polymerizable group other than the ethylenically unsaturated bond in the above-mentioned polyimide.
It is preferable that the polymerizable group other than the ethylenically unsaturated bond is contained in R 111 in the repeating unit represented by the formula (PAI-3) described later, for example.
The amount of the polymerizable group other than the ethylenically unsaturated bond with respect to the total mass of the polyamide-imide is preferably 0.05 to 10 mol / g, more preferably 0.1 to 5 mol / g.
ポリアミドイミドがアルカリ現像に供される場合、現像性を向上する観点からは、ポリアミドイミドの酸価は、30mgKOH/g以上であることが好ましく、50mgKOH/g以上であることがより好ましく、70mgKOH/g以上であることが更に好ましい。
また、上記酸価は500mgKOH/g以下であることが好ましく、400mgKOH/g以下であることがより好ましく、200mgKOH/g以下であることが更に好ましい。
また、ポリアミドイミドが有機溶剤を主成分とする現像液を用いた現像(例えば、後述する「溶剤現像」)に供される場合、ポリアミドイミドの酸価は、2~35mgKOH/gが好ましく、3~30mgKOH/gがより好ましく、5~20mgKOH/gが更に好ましい。
耐薬品性の観点からは、ポリアミドイミドの酸価は、0mmol/g~1.2mmol/gであることが好ましく、0mmol/g~0.8mmol/gであることがより好ましく、0mmol/g~0.6mmol/gであることが更に好ましい。
上記酸価は、公知の方法により測定され、例えば、JIS K 0070:1992に記載の方法により測定される。
また、ポリアミドイミドに含まれる酸基としては、上述のポリイミドにおける酸基と同様の基が挙げられ、好ましい態様も同様である。 -Acid value-
When the polyamide-imide is subjected to alkaline development, the acid value of the polyamide-imide is preferably 30 mgKOH / g or more, more preferably 50 mgKOH / g or more, and 70 mgKOH / g or more, from the viewpoint of improving the developability. It is more preferably g or more.
The acid value is preferably 500 mgKOH / g or less, more preferably 400 mgKOH / g or less, and even more preferably 200 mgKOH / g or less.
When the polyamide-imide is subjected to development using a developing solution containing an organic solvent as a main component (for example, "solvent development" described later), the acid value of the polyamide-imide is preferably 2 to 35 mgKOH / g. ~ 30 mgKOH / g is more preferable, and 5 to 20 mgKOH / g is even more preferable.
From the viewpoint of chemical resistance, the acid value of the polyamide-imide is preferably 0 mmol / g to 1.2 mmol / g, more preferably 0 mmol / g to 0.8 mmol / g, and 0 mmol / g to 0 mmol / g. It is more preferably 0.6 mmol / g.
The acid value is measured by a known method, for example, by the method described in JIS K 0070: 1992.
Further, as the acid group contained in the polyamide-imide, the same group as the acid group in the above-mentioned polyimide can be mentioned, and the preferred embodiment is also the same.
アルカリ現像液による現像速度を適切なものとする観点からは、ポリアミドイミドは、フェノール性ヒドロキシ基を有することが好ましい。
ポリアミドイミドは、フェノール性ヒドロキシ基を主鎖末端に有してもよいし、側鎖に有してもよい。
フェノール性ヒドロキシ基は、例えば、後述する式(PAI-3)で表される繰返し単位におけるR117、又は、R111に含まれることが好ましい。
ポリアミドイミドの全質量に対するフェノール性ヒドロキシ基の量は、0.1~30mol/gであることが好ましく、1~20mol/gであることがより好ましい。 -Phenolic hydroxy group-
From the viewpoint of making the development speed with an alkaline developer appropriate, the polyamide-imide preferably has a phenolic hydroxy group.
The polyamide-imide may have a phenolic hydroxy group at the end of the main chain or at the side chain.
The phenolic hydroxy group is preferably contained in, for example, R 117 or R 111 in the repeating unit represented by the formula (PAI-3) described later.
The amount of the phenolic hydroxy group with respect to the total mass of the polyamide-imide is preferably 0.1 to 30 mol / g, more preferably 1 to 20 mol / g.
式(PAI-3)中、R111及びR117はそれぞれ、式(PAI-2)中のR111及びR117と同義であり、好ましい態様も同様である。
また、本発明で用いるポリアミドイミドは、上記式(PAI-3)で表される繰り返し単位中に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含むことが好ましく、上記式(PAI-3)中のR111及びR117の少なくとも一方に第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造を含むことがより好ましい。
また、第1の特定樹脂における側鎖、又は、第2の特定樹脂における式(1-2)で表される構造に含まれる重合性基以外の重合性基を有する場合、重合性基は、R111及びR117の少なくとも一方に位置していてもよいし、ポリアミドイミドの末端に位置していてもよい。 The polyamide-imide used in the present invention is not particularly limited as long as it is a polymer compound having an imide structure and an amide bond, but preferably contains a repeating unit represented by the following formula (PAI-3).
In formula (PAI-3), R 111 and R 117 are synonymous with R 111 and R 117 in formula (PAI-2), respectively, and so are preferred embodiments.
Further, the polyamide-imide used in the present invention is represented by the side chain in the first specific resin or the formula (1-2) in the second specific resin in the repeating unit represented by the above formula (PAI-3). It is preferable that at least one of R 111 and R 117 in the above formula (PAI-3) contains a side chain in the first specific resin or the formula (1-2) in the second specific resin. It is more preferable to include the structure represented by.
Further, when it has a polymerizable group other than the side chain in the first specific resin or the polymerizable group contained in the structure represented by the formula (1-2) in the second specific resin, the polymerizable group is selected. It may be located at at least one of R 111 and R 117 , or may be located at the end of the polyamide-imide.
ポリアミドイミドのイミド化率(「閉環率」ともいう)は、得られる有機膜の膜強度、絶縁性等の観点からは、70%以上であることが好ましく、80%以上であることがより好ましく、90%以上であることがより好ましい。
上記イミド化率の上限は特に限定されず、100%以下であればよい。
上記イミド化率は、上述のポリイミドの閉環率と同様の方法により測定される。 -Imidization rate (ring closure rate)-
The imidization rate (also referred to as "ring closure rate") of the polyamide-imide is preferably 70% or more, more preferably 80% or more, from the viewpoint of the film strength, the insulating property, etc. of the obtained organic film. , 90% or more is more preferable.
The upper limit of the imidization rate is not particularly limited and may be 100% or less.
The imidization rate is measured by the same method as the ring closure rate of the polyimide described above.
また、ポリアミドイミドの数平均分子量(Mn)は、好ましくは800~250,000であり、より好ましくは、2,000~50,000であり、更に好ましくは、4,000~25,000である。
ポリアミドイミドの分子量の分散度は、1.5以上が好ましく、1.8以上がより好ましく、2.0以上であることが更に好ましい。ポリアミドイミドの分子量の分散度の上限値は特に定めるものではないが、例えば、7.0以下が好ましく、6.5以下がより好ましく、6.0以下が更に好ましい。
また、樹脂組成物が特定樹脂として複数種のポリアミドイミドを含む場合、少なくとも1種のポリアミドイミドの重量平均分子量、数平均分子量、及び、分散度が上記範囲であることが好ましい。また、上記複数種のポリアミドイミドを1つの樹脂として算出した重量平均分子量、数平均分子量、及び、分散度が、それぞれ、上記範囲内であることも好ましい。 The weight average molecular weight (Mw) of the polyamide-imide is preferably 5,000 to 70,000, more preferably 8,000 to 50,000, still more preferably 10,000 to 30,000. By setting the weight average molecular weight to 5,000 or more, the breakage resistance of the film after curing can be improved. In order to obtain an organic film having excellent mechanical properties, the weight average molecular weight is particularly preferably 20,000 or more.
The number average molecular weight (Mn) of the polyamide-imide is preferably 800 to 250,000, more preferably 2,000 to 50,000, and even more preferably 4,000 to 25,000. ..
The dispersity of the molecular weight of the polyamide-imide is preferably 1.5 or more, more preferably 1.8 or more, and even more preferably 2.0 or more. The upper limit of the dispersity of the molecular weight of the polyamide-imide is not particularly determined, but for example, it is preferably 7.0 or less, more preferably 6.5 or less, still more preferably 6.0 or less.
When the resin composition contains a plurality of types of polyamide-imides as the specific resin, it is preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion of at least one type of polyamide-imide are in the above ranges. Further, it is also preferable that the weight average molecular weight, the number average molecular weight, and the degree of dispersion calculated by using the plurality of kinds of polyamide-imides as one resin are within the above ranges.
ポリイミド前駆体等は、例えば、低温中でテトラカルボン酸二無水物とジアミンを反応させる方法、低温中でテトラカルボン酸二無水物とジアミンを反応させてポリアミック酸を得、縮合剤又はアルキル化剤を用いてエステル化する方法、テトラカルボン酸二無水物とアルコールとによりジエステルを得て、その後ジアミンと縮合剤の存在下で反応させる方法、テトラカルボン酸二無水物とアルコールとによりジエステルを得、その後残りのジカルボン酸をハロゲン化剤を用いて酸ハロゲン化し、ジアミンと反応させる方法、などの方法を利用して得ることができる。上記製造方法のうち、テトラカルボン酸二無水物とアルコールとによりジエステルを得、その後残りのジカルボン酸をハロゲン化剤を用いて酸ハロゲン化し、ジアミンと反応させる方法がより好ましい。
上記縮合剤としては、例えばジシクロヘキシルカルボジイミド、ジイソプロピルカルボジイミド、1-エトキシカルボニル-2-エトキシ-1,2-ジヒドロキノリン、1,1-カルボニルジオキシ-ジ-1,2,3-ベンゾトリアゾール、N,N’-ジスクシンイミジルカーボネート、無水トリフルオロ酢酸等が挙げられる。
上記アルキル化剤としては、N,N-ジメチルホルムアミドジメチルアセタール、N,N-ジメチルホルムアミドジエチルアセタール、N,N-ジアルキルホルムアミドジアルキルアセタール、オルトギ酸トリメチル、オルトギ酸トリエチル等が挙げられる。
上記ハロゲン化剤としては、塩化チオニル、塩化オキサリル、オキシ塩化リン等が挙げられる。
ポリイミド前駆体等の製造方法では、反応に際し、有機溶剤を用いることが好ましい。有機溶剤は1種でもよいし、2種以上でもよい。
有機溶剤としては、原料に応じて適宜定めることができるが、ピリジン、ジエチレングリコールジメチルエーテル(ジグリム)、N-メチルピロリドン、N-エチルピロリドン、プロピオン酸エチル、ジメチルアセトアミド、ジメチルホルムアミド、テトラヒドロフラン、γ-ブチロラクトン等が例示される。
ポリイミド前駆体等の製造方法では、反応に際し、塩基性化合物を添加することが好ましい。塩基性化合物は1種でもよいし、2種以上でもよい。
塩基性化合物は、原料に応じて適宜定めることができるが、トリエチルアミン、ジイソプロピルエチルアミン、ピリジン、1,8-ジアザビシクロ[5.4.0]ウンデカ-7-エン、N,N-ジメチル-4-アミノピリジン等が例示される。 [Manufacturing method of polyimide precursor, etc.]
The polyimide precursor and the like can be, for example, a method of reacting a tetracarboxylic acid dianhydride with a diamine at a low temperature, or reacting a tetracarboxylic acid dianhydride with a diamine at a low temperature to obtain a polyamic acid, and a condensing agent or an alkylating agent. A method of esterifying with tetracarboxylic acid dianhydride and alcohol to obtain a diester, and then reacting with diamine in the presence of a condensing agent, a method of obtaining a diester with tetracarboxylic acid dianhydride and alcohol. After that, the remaining dicarboxylic acid can be obtained by acid-halogenizing it with a halogenating agent and reacting it with a diamine. Among the above-mentioned production methods, a method in which a diester is obtained from tetracarboxylic acid dianhydride and an alcohol, and then the remaining dicarboxylic acid is acid-halogenated with a halogenating agent and reacted with diamine is more preferable.
Examples of the condensing agent include dicyclohexylcarbodiimide, diisopropylcarbodiimide, 1-ethoxycarbonyl-2-ethoxy-1,2-dihydroquinoline, 1,1-carbonyldioxy-di-1,2,3-benzotriazole, N, Examples thereof include N'-disuccinimidyl carbonate and trifluoroacetic anhydride.
Examples of the alkylating agent include N, N-dimethylformamide dimethylacetal, N, N-dimethylformamide diethyl acetal, N, N-dialkylformamide dialkyl acetal, trimethyl orthoformate, triethyl orthoformate and the like.
Examples of the halogenating agent include thionyl chloride, oxalyl chloride, phosphorus oxychloride and the like.
In the method for producing a polyimide precursor or the like, it is preferable to use an organic solvent in the reaction. The organic solvent may be one kind or two or more kinds.
The organic solvent can be appropriately determined depending on the raw material, but is pyridine, diethylene glycol dimethyl ether (diglyme), N-methylpyrrolidone, N-ethylpyrrolidone, ethyl propionate, dimethylacetamide, dimethylformamide, tetrahydrofuran, γ-butyrolactone and the like. Is exemplified.
In the method for producing a polyimide precursor or the like, it is preferable to add a basic compound during the reaction. The basic compound may be one kind or two or more kinds.
The basic compound can be appropriately determined depending on the raw material, but triethylamine, diisopropylethylamine, pyridine, 1,8-diazabicyclo [5.4.0] undec-7-ene, N, N-dimethyl-4-amino. Examples thereof include pyridine and the like.
ポリイミド前駆体等の製造方法に際し、保存安定性をより向上させるため、ポリイミド前駆体等の樹脂末端に残存するカルボン酸無水物、酸無水物誘導体、或いは、アミノ基を封止することが好ましい。樹脂末端に残存するカルボン酸無水物、及び酸無水物誘導体を封止する際、末端封止剤としては、モノアルコール、フェノール、チオール、チオフェノール、モノアミン等が挙げられ、反応性、膜の安定性から、モノアルコール、フェノール類やモノアミンを用いることがより好ましい。モノアルコールの好ましい化合物としては、メタノール、エタノール、プロパノール、ブタノール、ヘキサノール、オクタノール、ドデシノール、ベンジルアルコール、2-フェニルエタノール、2-メトキシエタノール、2-クロロメタノール、フルフリルアルコール等の1級アルコール、イソプロパノール、2-ブタノール、シクロヘキシルアルコール、シクロペンタノール、1-メトキシ-2-プロパノール等の2級アルコール、t-ブチルアルコール、アダマンタンアルコール等の3級アルコールが挙げられる。フェノール類の好ましい化合物としては、フェノール、メトキシフェノール、メチルフェノール、ナフタレン-1-オール、ナフタレン-2-オール、ヒドロキシスチレン等のフェノール類などが挙げられる。また、モノアミンの好ましい化合物としては、アニリン、2-エチニルアニリン、3-エチニルアニリン、4-エチニルアニリン、5-アミノ-8-ヒドロキシキノリン、1-ヒドロキシ-7-アミノナフタレン、1-ヒドロキシ-6-アミノナフタレン、1-ヒドロキシ-5-アミノナフタレン、1-ヒドロキシ-4-アミノナフタレン、2-ヒドロキシ-7-アミノナフタレン、2-ヒドロキシ-6-アミノナフタレン、2-ヒドロキシ-5-アミノナフタレン、1-カルボキシ-7-アミノナフタレン、1-カルボキシ-6-アミノナフタレン、1-カルボキシ-5-アミノナフタレン、2-カルボキシ-7-アミノナフタレン、2-カルボキシ-6-アミノナフタレン、2-カルボキシ-5-アミノナフタレン、2-アミノ安息香酸、3-アミノ安息香酸、4-アミノ安息香酸、4-アミノサリチル酸、5-アミノサリチル酸、6-アミノサリチル酸、2-アミノベンゼンスルホン酸、3-アミノベンゼンスルホン酸、4-アミノベンゼンスルホン酸、3-アミノ-4,6-ジヒドロキシピリミジン、2-アミノフェノール、3-アミノフェノール、4-アミノフェノール、2-アミノチオフェノール、3-アミノチオフェノール、4-アミノチオフェノールなどが挙げられる。これらを2種以上用いてもよく、複数の末端封止剤を反応させることにより、複数の異なる末端基を導入してもよい。
また、樹脂末端のアミノ基を封止する際、アミノ基と反応可能な官能基を有する化合物で封止することが可能である。アミノ基に対する好ましい封止剤は、カルボン酸無水物、カルボン酸クロリド、カルボン酸ブロミド、スルホン酸クロリド、無水スルホン酸、スルホン酸カルボン酸無水物などが好ましく、カルボン酸無水物、カルボン酸クロリドがより好ましい。カルボン酸無水物の好ましい化合物としては、無水酢酸、無水プロピオン酸、無水シュウ酸、無水コハク酸、無水マレイン酸、無水フタル酸、無水安息香酸、5-ノルボルネン-2,3-ジカルボン酸無水物などが挙げられる。また、カルボン酸クロリドの好ましい化合物としては、塩化アセチル、アクリル酸クロリド、プロピオニルクロリド、メタクリル酸クロリド、ピバロイルクロリド、シクロヘキサンカルボニルクロリド、2-エチルヘキサノイルクロリド、シンナモイルクロリド、1-アダマンタンカルボニルクロリド、ヘプタフルオロブチリルクロリド、ステアリン酸クロリド、ベンゾイルクロリド、などが挙げられる。 -End sealant-
In the method for producing a polyimide precursor or the like, it is preferable to seal the carboxylic acid anhydride, the acid anhydride derivative, or the amino group remaining at the resin terminal of the polyimide precursor or the like in order to further improve the storage stability. When encapsulating the carboxylic acid anhydride and the acid anhydride derivative remaining at the resin terminal, examples of the terminal encapsulant include monoalcohol, phenol, thiol, thiophenol, monoamine, etc., and are reactive and stable in the film. From the viewpoint of sex, it is more preferable to use monoalcohol, phenols and monoamine. Preferred compounds of monoalcohols include primary alcohols such as methanol, ethanol, propanol, butanol, hexanol, octanol, dodecinol, benzyl alcohol, 2-phenylethanol, 2-methoxyethanol, 2-chloromethanol and flufuryl alcohol, and isopropanol. , 2-Butanol, cyclohexyl alcohol, cyclopentanol, 1-methoxy-2-propanol and other secondary alcohols, t-butyl alcohol, adamantan alcohol and other tertiary alcohols. Preferred compounds of phenols include phenols such as phenol, methoxyphenol, methylphenol, naphthalene-1-ol, naphthalene-2-ol and hydroxystyrene. Preferred compounds of monoamine include aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 5-amino-8-hydroxyquinoline, 1-hydroxy-7-aminonaphthalene and 1-hydroxy-6-. Aminonaphthalene, 1-hydroxy-5-aminonaphthalene, 1-hydroxy-4-aminonaphthalene, 2-hydroxy-7-aminonaphthalene, 2-hydroxy-6-aminonaphthalene, 2-hydroxy-5-aminonaphthalene, 1- Carboxy-7-aminonaphthalene, 1-carboxy-6-aminonaphthalene, 1-carboxy-5-aminonaphthalene, 2-carboxy-7-aminonaphthalene, 2-carboxy-6-aminonaphthalene, 2-carboxy-5-amino Naphthalene, 2-aminobenzoic acid, 3-aminobenzoic acid, 4-aminobenzoic acid, 4-aminosalicylic acid, 5-aminosalicylic acid, 6-aminosalicylic acid, 2-aminobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 4 -Aminobenzene sulfonic acid, 3-amino-4,6-dihydroxypyrimidine, 2-aminophenol, 3-aminophenol, 4-aminophenol, 2-aminothiophenol, 3-aminothiophenol, 4-aminothiophenol, etc. Can be mentioned. Two or more of these may be used, or a plurality of different end groups may be introduced by reacting a plurality of terminal encapsulants.
Further, when sealing the amino group at the end of the resin, it is possible to seal with a compound having a functional group capable of reacting with the amino group. Preferred encapsulants for amino groups are carboxylic acid anhydrides, carboxylic acid chlorides, carboxylic acid bromides, sulfonic acid chlorides, anhydrous sulfonic acids, sulfonic acid carboxylic acid anhydrides and the like, with carboxylic acid anhydrides and carboxylic acid chlorides being more preferred. preferable. Preferred compounds for carboxylic acid anhydrides include acetic anhydride, propionic anhydride, oxalic anhydride, succinic anhydride, maleic anhydride, phthalic anhydride, benzoic anhydride, 5-norbornen-2,3-dicarboxylic acid anhydride and the like. Can be mentioned. Preferred compounds for the carboxylic acid chloride include acetyl chloride, acrylic acid chloride, propionyl chloride, methacrylate chloride, pivaloyl chloride, cyclohexanecarbonyl chloride, 2-ethylhexanoyl chloride, cinnamoyl chloride, 1-adamantancarbonyl chloride. , Heptafluorobutyryl chloride, stearate chloride, benzoyl chloride, and the like.
ポリイミド前駆体等の製造に際し、固体を析出する工程を含んでいてもよい。具体的には、反応液中に共存している脱水縮合剤の吸水副生物を必要に応じて濾別した後、水、脂肪族低級アルコール、又はその混合液等の貧溶媒に、得られた重合体成分を投入し、重合体成分を析出させることで、固体として析出させ、乾燥させることでポリイミド前駆体等を得ることができる。精製度を向上させるために、ポリイミド前駆体等を再溶解、再沈析出、乾燥等の操作を繰返してもよい。さらに、イオン交換樹脂を用いてイオン性不純物を除去する工程を含んでいてもよい。 -Solid precipitation-
A step of precipitating a solid may be included in the production of a polyimide precursor or the like. Specifically, the water-absorbing by-product of the dehydration condensing agent coexisting in the reaction solution was filtered off as necessary, and then obtained in a poor solvent such as water, an aliphatic lower alcohol, or a mixed solution thereof. By adding the polymer component and precipitating the polymer component, it is precipitated as a solid, and by drying, a polyimide precursor or the like can be obtained. In order to improve the degree of purification, operations such as redissolution, reprecipitation and drying of the polyimide precursor may be repeated. Further, a step of removing ionic impurities using an ion exchange resin may be included.
本発明の樹脂組成物における特定樹脂の含有量は、樹脂組成物の全固形分に対し20質量%以上であることが好ましく、30質量%以上であることがより好ましく、40質量%以上であることが更に好ましく、50質量%以上であることが一層好ましい。また、本発明の樹脂組成物における樹脂の含有量は、樹脂組成物の全固形分に対し、99.5質量%以下であることが好ましく、99質量%以下であることがより好ましく、98質量%以下であることが更に好ましく、97質量%以下であることが一層好ましく、95質量%以下であることがより一層好ましい。
本発明の樹脂組成物は、特定樹脂を1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。 〔Content〕
The content of the specific resin in the resin composition of the present invention is preferably 20% by mass or more, more preferably 30% by mass or more, and more preferably 40% by mass or more, based on the total solid content of the resin composition. More preferably, it is more preferably 50% by mass or more. Further, the content of the resin in the resin composition of the present invention is preferably 99.5% by mass or less, more preferably 99% by mass or less, and 98% by mass, based on the total solid content of the resin composition. % Or less, more preferably 97% by mass or less, and even more preferably 95% by mass or less.
The resin composition of the present invention may contain only one type of specific resin, or may contain two or more types. When two or more kinds are contained, it is preferable that the total amount is within the above range.
また、本発明の樹脂組成物は、少なくとも2種の樹脂を含むことも好ましい。
具体的には、本発明の樹脂組成物は、特定樹脂と、後述する他の樹脂とを合計で2種以上含んでもよいし、特定樹脂を2種以上含んでいてもよいが、特定樹脂を2種以上含むことが好ましい。
本発明の樹脂組成物が特定樹脂を2種以上含む場合、例えば、ポリイミド前駆体であって、二無水物由来の構造(上述の式(2)でいうR115)が異なる2種以上のポリイミド前駆体を含むことが好ましい。 Specific examples of the specific resin include, but are not limited to, SA-1 to SA-12, PI-1 and the like in the examples described later.
Further, it is also preferable that the resin composition of the present invention contains at least two kinds of resins.
Specifically, the resin composition of the present invention may contain two or more kinds of the specific resin and another resin described later in total, or may contain two or more kinds of the specific resin, but the specific resin may be contained. It is preferable to include two or more kinds.
When the resin composition of the present invention contains two or more kinds of specific resins, for example, two or more kinds of polyimides which are polyimide precursors and have different structures derived from dianhydride (R 115 in the above formula (2)). It is preferable to include a precursor.
本発明の樹脂組成物は、上述した特定樹脂と、特定樹脂とは異なる他の樹脂(以下、単に「他の樹脂」ともいう)とを含んでもよい。
他の樹脂としては、特定樹脂に該当しないポリイミド前駆体、特定樹脂に該当しないポリイミド、特定樹脂に該当しないポリベンゾオキサゾール前駆体、特定樹脂に該当しないポリベンゾオキサゾール、特定樹脂に該当しないポリアミドイミド前駆体、特定樹脂に該当しないポリアミドイミド、フェノール樹脂、ポリアミド、エポキシ樹脂、ポリシロキサン、シロキサン構造を含む樹脂、(メタ)アクリル樹脂、(メタ)アクリルアミド樹脂、ウレタン樹脂、ブチラール樹脂、スチリル樹脂、ポリエーテル樹脂、ポリエステル樹脂等が挙げられる。
例えば、(メタ)アクリル樹脂を更に加えることにより、塗布性に優れた樹脂組成物が得られ、また、耐溶剤性に優れたパターン(硬化物)が得られる。
例えば、後述する重合性化合物に代えて、又は、後述する重合性化合物に加えて、重量平均分子量が20,000以下の重合性基価の高い(例えば、樹脂1gにおける重合性基の含有モル量が1×10-3モル/g以上である)(メタ)アクリル樹脂を樹脂組成物に添加することにより、樹脂組成物の塗布性、パターン(硬化物)の耐溶剤性等を向上させることができる。 <Other resins>
The resin composition of the present invention may contain the above-mentioned specific resin and another resin different from the specific resin (hereinafter, also simply referred to as “other resin”).
Other resins include polyimide precursors that do not correspond to specific resins, polyimides that do not correspond to specific resins, polybenzoxazole precursors that do not correspond to specific resins, polybenzoxazoles that do not correspond to specific resins, and polyamideimide precursors that do not correspond to specific resins. Body, polyamideimide, phenol resin, polyamide, epoxy resin, polysiloxane, resin containing siloxane structure, (meth) acrylic resin, (meth) acrylamide resin, urethane resin, butyral resin, styryl resin, polyether, which do not correspond to specific resins Examples thereof include resin and polyester resin.
For example, by further adding a (meth) acrylic resin, a resin composition having excellent coatability can be obtained, and a pattern (cured product) having excellent solvent resistance can be obtained.
For example, instead of the polymerizable compound described later, or in addition to the polymerizable compound described later, the weight average molecular weight is 20,000 or less and the polymerizable base value is high (for example, the molar amount of the polymerizable group contained in 1 g of the resin). (1 × 10 -3 mol / g or more) By adding (meth) acrylic resin to the resin composition, the coatability of the resin composition, the solvent resistance of the pattern (cured product), etc. can be improved. can.
また、本発明の樹脂組成物における、他の樹脂の含有量は、樹脂組成物の全固形分に対し、80質量%以下であることが好ましく、75質量%以下であることがより好ましく、70質量%以下であることが更に好ましく、60質量%以下であることが一層好ましく、50質量%以下であることがより一層好ましい。
また、本発明の樹脂組成物の好ましい一態様として、他の樹脂の含有量が低含有量である態様とすることもできる。上記態様において、他の樹脂の含有量は、樹脂組成物の全固形分に対し、20質量%以下であることが好ましく、15質量%以下であることがより好ましく、10質量%以下であることが更に好ましく、5質量%以下であることが一層好ましく、1質量%以下であることがより一層好ましい。上記含有量の下限は特に限定されず、0質量%以上であればよい。
本発明の樹脂組成物は、他の樹脂を1種のみ含んでいてもよいし、2種以上含んでいてもよい。2種以上含む場合、合計量が上記範囲となることが好ましい。 When the resin composition of the present invention contains another resin, the content of the other resin is preferably 0.01% by mass or more, preferably 0.05% by mass or more, based on the total solid content of the resin composition. It is more preferably 1% by mass or more, further preferably 2% by mass or more, further preferably 5% by mass or more, and further preferably 10% by mass or more. More preferred.
Further, the content of other resins in the resin composition of the present invention is preferably 80% by mass or less, more preferably 75% by mass or less, and more preferably 70% by mass, based on the total solid content of the resin composition. It is more preferably 0% by mass or less, further preferably 60% by mass or less, and even more preferably 50% by mass or less.
Further, as a preferred embodiment of the resin composition of the present invention, the content of the other resin may be low. In the above embodiment, the content of the other resin is preferably 20% by mass or less, more preferably 15% by mass or less, and 10% by mass or less with respect to the total solid content of the resin composition. Is more preferable, 5% by mass or less is further preferable, and 1% by mass or less is even more preferable. The lower limit of the content is not particularly limited, and may be 0% by mass or more.
The resin composition of the present invention may contain only one type of other resin, or may contain two or more types. When two or more kinds are contained, it is preferable that the total amount is within the above range.
本発明の樹脂組成物は、重合性化合物を含むことが好ましい。
重合性化合物としては、ラジカル架橋剤、又は、他の架橋剤が挙げられる。 <Polymerizable compound>
The resin composition of the present invention preferably contains a polymerizable compound.
Examples of the polymerizable compound include radical cross-linking agents and other cross-linking agents.
本発明の樹脂組成物は、ラジカル架橋剤を含むことが好ましい。
ラジカル架橋剤は、ラジカル重合性基を有する化合物である。ラジカル重合性基としては、エチレン性不飽和結合を含む基が好ましい。上記エチレン性不飽和結合を含む基としては、ビニル基、アリル基、ビニルフェニル基、(メタ)アクリロイル基、マレイミド基、(メタ)アクリルアミド基などのエチレン性不飽和結合を有する基が挙げられる。
これらの中でも、上記エチレン性不飽和結合を含む基としては、(メタ)アクリロイル基、(メタ)アクリルアミド基、ビニルフェニル基が好ましく、反応性の観点からは、(メタ)アクリロイル基がより好ましい。 [Radical cross-linking agent]
The resin composition of the present invention preferably contains a radical cross-linking agent.
The radical cross-linking agent is a compound having a radically polymerizable group. As the radically polymerizable group, a group containing an ethylenically unsaturated bond is preferable. Examples of the group containing an ethylenically unsaturated bond include a group having an ethylenically unsaturated bond such as a vinyl group, an allyl group, a vinylphenyl group, a (meth) acryloyl group, a maleimide group, and a (meth) acrylamide group.
Among these, as the group containing an ethylenically unsaturated bond, a (meth) acryloyl group, a (meth) acrylamide group and a vinylphenyl group are preferable, and from the viewpoint of reactivity, a (meth) acryloyl group is more preferable.
上記エチレン性不飽和結合を2個以上有する化合物としては、エチレン性不飽和結合を2~15個有する化合物が好ましく、エチレン性不飽和結合を2~10個有する化合物がより好ましく、2~6個有する化合物が更に好ましい。
また、得られるパターン(硬化物)の膜強度の観点からは、本発明の樹脂組成物は、エチレン性不飽和結合を2個有する化合物と、上記エチレン性不飽和結合を3個以上有する化合物とを含むことも好ましい。 The radical cross-linking agent is preferably a compound having one or more ethylenically unsaturated bonds, but more preferably a compound having two or more ethylenically unsaturated bonds. The radical cross-linking agent may have three or more ethylenically unsaturated bonds.
As the compound having two or more ethylenically unsaturated bonds, a compound having 2 to 15 ethylenically unsaturated bonds is preferable, and a compound having 2 to 10 ethylenically unsaturated bonds is more preferable. The compound having is more preferable.
Further, from the viewpoint of the film strength of the obtained pattern (cured product), the resin composition of the present invention comprises a compound having two ethylenically unsaturated bonds and a compound having three or more ethylenically unsaturated bonds. It is also preferable to include.
具体的な化合物としては、トリエチレングリコールジアクリレート、トリエチレングリコールジメタクリレート、テトラエチレングリコールジメタクリレート、テトラエチレングリコールジアクリレート、PEG(ポリエチレングリコール)200ジアクリレート、PEG200ジメタクリレート、PEG600ジアクリレート、PEG600ジメタクリレート、ポリテトラエチレングリコールジアクリレート、ポリテトラエチレングリコールジメタクリレート、ネオペンチルグリコールジアクリレート、ネオペンチルグリコールジメタクリレート、3-メチル-1,5-ペンタンジオールジアクリレート、1,6-ヘキサンジオールジアクリレート、1,6ヘキサンジオールジメタクリレート、ジメチロール-トリシクロデカンジアクリレート、ジメチロール-トリシクロデカンジメタクリレート、ビスフェノールAのEO(エチレンオキシド)付加物ジアクリレート、ビスフェノールAのEO付加物ジメタクリレート、ビスフェノールAのPO(プロピレンオキシド)付加物ジアクリレート、ビスフェノールAのPO付加物ジメタクリレート、2-ヒドロキシー3-アクリロイロキシプロピルメタクリレート、イソシアヌル酸EO変性ジアクリレート、イソシアヌル酸変性ジメタクリレート、その他ウレタン結合を有する2官能アクリレート、ウレタン結合を有する2官能メタクリレートを使用することができる。これらは必要に応じ、2種以上を混合し使用することができる。
なお、例えばPEG200ジアクリレートとは、ポリエチレングリコールジアクリレートであって、ポリエチレングリコール鎖の式量が200程度のものをいう。
本発明の樹脂組成物は、パターン(硬化物)の弾性率制御に伴う反り抑制の観点から、ラジカル架橋剤として、単官能ラジカル架橋剤を好ましく用いることができる。単官能ラジカル架橋剤としては、n-ブチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、ブトキシエチル(メタ)アクリレート、カルビトール(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、ベンジル(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、N-メチロール(メタ)アクリルアミド、グリシジル(メタ)アクリレート、ポリエチレングリコールモノ(メタ)アクリレート、ポリプロピレングリコールモノ(メタ)アクリレート等の(メタ)アクリル酸誘導体、N-ビニルピロリドン、N-ビニルカプロラクタム等のN-ビニル化合物類、アリルグリシジルエーテル等が好ましく用いられる。単官能ラジカル架橋剤としては、露光前の揮発を抑制するため、常圧下で100℃以上の沸点を持つ化合物も好ましい。
その他、2官能以上のラジカル架橋剤としては、ジアリルフタレート、トリアリルトリメリテート等のアリル化合物類が挙げられる。 As the resin composition, it is preferable to use bifunctional methacrylate or acrylate from the viewpoint of pattern resolution and film elasticity.
Specific compounds include triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, tetraethylene glycol diacrylate, PEG (polyethylene glycol) 200 diacrylate, PEG200 dimethacrylate, PEG600 diacrylate, PEG600 dimethacrylate. Meacrylate, Polytetraethylene glycol dimethacrylate, Polytetraethylene glycol dimethacrylate, Neopentyl glycol diacrylate, Neopentyl glycol dimethacrylate, 3-Methyl-1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,6 hexanediol dimethacrylate, dimethyrol-tricyclodecanediacrylate, dimethyrol-tricyclodecanedimethacrylate, EO (ethylene oxide) adacrylate diacrylate of bisphenol A, EO adacrylate dimethacrylate of bisphenol A, PO of bisphenol A ( (Propropylene oxide) Additive Diacrylate, PO Additive Dimethacrylate of Bisphenol A, 2-Hydroxy-3-acryloyloxypropyl methacrylate, isocyanuric acid EO modified diacrylate, isocyanuric acid modified dimethacrylate, and other bifunctional acrylates having a urethane bond, Bifunctional methacrylate having a urethane bond can be used. If necessary, two or more of these can be mixed and used.
For example, the PEG200 diacrylate is a polyethylene glycol diacrylate having a polyethylene glycol chain formula of about 200.
In the resin composition of the present invention, a monofunctional radical cross-linking agent can be preferably used as the radical cross-linking agent from the viewpoint of suppressing warpage associated with the control of the elastic modulus of the pattern (cured product). Examples of the monofunctional radical cross-linking agent include n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, carbitol (meth) acrylate, and cyclohexyl (meth). ) Acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, N-methylol (meth) acrylamide, glycidyl (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, etc. (meth) Acrylic acid derivatives, N-vinyl compounds such as N-vinylpyrrolidone and N-vinylcaprolactam, allylglycidyl ether and the like are preferably used. As the monofunctional radical cross-linking agent, a compound having a boiling point of 100 ° C. or higher under normal pressure is also preferable in order to suppress volatilization before exposure.
Other examples of the bifunctional or higher functional radical cross-linking agent include allyl compounds such as diallyl phthalate and triallyl trimellitate.
ウレア結合を含むラジカル架橋剤としては、現像性、破断伸び又は耐薬品性の観点からは、対称軸を有しない化合物が好ましく、対称軸を有さず、かつ、下記条件1又は条件2の少なくとも一方を満たす化合物が好ましい。
条件1:化合物がラジカル重合性基を2以上有する;
条件2:化合物がヒドロキシ基及びアルキレンオキシ基の少なくとも一方を有する。
このような化合物としては、例えば、下記化合物が挙げられるが、これに限定されるものではない。
As the radical cross-linking agent containing a urea bond, a compound having no axis of symmetry is preferable from the viewpoint of developability, elongation at break or chemical resistance, and the agent does not have an axis of symmetry and has at least condition 1 or condition 2 below. A compound satisfying one of them is preferable.
Condition 1: The compound has two or more radically polymerizable groups;
Condition 2: The compound has at least one of a hydroxy group and an alkyleneoxy group.
Examples of such a compound include, but are not limited to, the following compounds.
本発明の樹脂組成物は、上述したラジカル架橋剤とは異なる、他の架橋剤を含むことも好ましい。
本発明において、他の架橋剤とは、上述したラジカル架橋剤以外の架橋剤をいい、光塩基発生剤の感光により、組成物中の他の化合物又はその反応生成物との間で共有結合を形成する反応が促進される基を分子内に複数個有する化合物であることが好ましく、組成物中の他の化合物又はその反応生成物との間で共有結合を形成する反応が酸又は塩基の作用によって促進される基を分子内に複数個有する化合物が好ましい。
上記酸又は塩基は、露光工程において、光塩基発生剤から発生する塩基であることが好ましい。
他の架橋剤としては、アシルオキシメチル基、メチロール基及びアルコキシメチル基よりなる群から選ばれた少なくとも1種の基を有する化合物が好ましく、アシルオキシメチル基、メチロール基及びアルコキシメチル基よりなる群から選ばれた少なくとも1種の基が窒素原子に直接結合した構造を有する化合物がより好ましい。
他の架橋剤としては、例えば、メラミン、グリコールウリル、尿素、アルキレン尿素、ベンゾグアナミンなどのアミノ基含有化合物にホルムアルデヒド又はホルムアルデヒドとアルコールを反応させ、上記アミノ基の水素原子をアシルオキシメチル基、メチロール基又はアルコキシメチル基で置換した構造を有する化合物が挙げられる。これらの化合物の製造方法は特に限定されず、上記方法により製造された化合物と同様の構造を有する化合物であればよい。また、これらの化合物のメチロール基同士が自己縮合してなるオリゴマーであってもよい。
上記のアミノ基含有化合物として、メラミンを用いた架橋剤をメラミン系架橋剤、グリコールウリル、尿素又はアルキレン尿素を用いた架橋剤を尿素系架橋剤、アルキレン尿素を用いた架橋剤をアルキレン尿素系架橋剤、ベンゾグアナミンを用いた架橋剤をベンゾグアナミン系架橋剤という。
これらの中でも、本発明の樹脂組成物は、尿素系架橋剤及びメラミン系架橋剤よりなる群から選ばれた少なくとも1種の化合物を含むことが好ましく、後述するグリコールウリル系架橋剤及びメラミン系架橋剤よりなる群から選ばれた少なくとも1種の化合物を含むことがより好ましい。 [Other cross-linking agents]
It is also preferable that the resin composition of the present invention contains another cross-linking agent different from the above-mentioned radical cross-linking agent.
In the present invention, the other cross-linking agent refers to a cross-linking agent other than the above-mentioned radical cross-linking agent, and a covalent bond is formed with another compound in the composition or a reaction product thereof by exposure to a photobase generator. A compound having a plurality of groups in the molecule that promotes the formation reaction is preferable, and a reaction that forms a covalent bond with another compound in the composition or a reaction product thereof is an action of an acid or a base. A compound having a plurality of groups promoted by the above in the molecule is preferable.
The acid or base is preferably a base generated from a photobase generator in the exposure step.
As the other cross-linking agent, a compound having at least one group selected from the group consisting of an acyloxymethyl group, a methylol group and an alkoxymethyl group is preferable, and the compound is selected from the group consisting of an acyloxymethyl group, a methylol group and an alkoxymethyl group. A compound having a structure in which at least one of the above groups is directly bonded to a nitrogen atom is more preferable.
As another cross-linking agent, for example, an amino group-containing compound such as melamine, glycoluril, urea, alkylene urea, or benzoguanamine is reacted with formaldehyde or formaldehyde and alcohol, and the hydrogen atom of the amino group is changed to an acyloxymethyl group, a methylol group, or a methylol group. Examples thereof include compounds having a structure substituted with an alkoxymethyl group. The method for producing these compounds is not particularly limited, and any compound having the same structure as the compound produced by the above method may be used. Further, it may be an oligomer formed by self-condensing the methylol groups of these compounds.
As the above amino group-containing compound, a melamine-based cross-linking agent is used as a melamine-based cross-linking agent, a glycol-uryl, urea or alkylene urea-based cross-linking agent is used as a urea-based cross-linking agent, and an alkylene urea-based cross-linking agent is used as an alkylene urea-based cross-linking agent. A cross-linking agent using an agent or benzoguanamine is called a benzoguanamine-based cross-linking agent.
Among these, the resin composition of the present invention preferably contains at least one compound selected from the group consisting of a urea-based cross-linking agent and a melamine-based cross-linking agent, and is preferably a glycoluril-based cross-linking agent and a melamine-based cross-linking agent described later. It is more preferred to include at least one compound selected from the group consisting of agents.
上記化合物が有するアルコキシメチル基又はアシルオキシメチル基は、炭素数2~5が好ましく、炭素数2又は3が好ましく、炭素数2がより好ましい。
上記化合物が有するアルコキシメチル基及びアシルオキシメチル基の総数は1~10が好ましく、より好ましくは2~8、特に好ましくは3~6である。
上記化合物の分子量は好ましくは1500以下であり、180~1200が好ましい。 As the compound containing at least one of the alkoxymethyl group and the acyloxymethyl group in the present invention, the alkoxymethyl group or the acyloxymethyl group is directly substituted on the aromatic group or the nitrogen atom of the following urea structure, or on triazine. Can be mentioned as a structural example.
The alkoxymethyl group or acyloxymethyl group contained in the above compound preferably has 2 to 5 carbon atoms, preferably 2 or 3 carbon atoms, and more preferably 2 carbon atoms.
The total number of alkoxymethyl groups and acyloxymethyl groups contained in the above compound is preferably 1 to 10, more preferably 2 to 8, and particularly preferably 3 to 6.
The molecular weight of the compound is preferably 1500 or less, preferably 180 to 1200.
R101及びR102は、それぞれ独立に、一価の有機基を表し、互いに結合して環を形成してもよい。 R 100 represents an alkyl group or an acyl group.
R 101 and R 102 each independently represent a monovalent organic group and may be bonded to each other to form a ring.
R105は各々独立にアルキル基又はアルケニル基を示し、a、b及びcは各々独立に1~3であり、dは0~4であり、eは0~3であり、fは0~3であり、a+dは5以下であり、b+eは4以下であり、c+fは4以下である。
酸の作用により分解し、アルカリ可溶性基を生じる基、酸の作用により脱離する基、-C(R4)2COOR5で表される基におけるR5については、例えば、-C(R36)(R37)(R38)、-C(R36)(R37)(OR39)、-C(R01)(R02)(OR39)等を挙げることができる。
式中、R36~R39は、各々独立に、アルキル基、シクロアルキル基、アリール基、アラルキル基又はアルケニル基を表す。R36とR37とは、互いに結合して環を形成してもよい。
上記アルキル基としては、炭素数1~10のアルキル基が好ましく、炭素数1~5のアルキル基がより好ましい。
上記アルキル基は、直鎖状、分岐鎖状のいずれであってもよい。
上記シクロアルキル基としては、炭素数3~12のシクロアルキル基が好ましく、炭素数3~8のシクロアルキル基がより好ましい。
上記シクロアルキル基は単環構造であってもよいし、縮合環等の多環構造であってもよい。
上記アリール基は炭素数6~30の芳香族炭化水素基であることが好ましく、フェニル基であることがより好ましい。
上記アラルキル基としては、炭素数7~20のアラルキル基が好ましく、炭素数7~16のアラルキル基がより好ましい。
上記アラルキル基はアルキル基により置換されたアリール基を意図しており、これらのアルキル基及びアリール基の好ましい態様は、上述のアルキル基及びアリール基の好ましい態様と同様である。
上記アルケニル基は炭素数3~20のアルケニル基が好ましく、炭素数3~16のアルケニル基がより好ましい。
また、これらの基は本発明の効果が得られる範囲内で、公知の置換基を更に有していてもよい。 In the formula, X represents a single-bonded or divalent organic group, each R 104 independently represents an alkyl group or an acyl group, and R 103 is a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or an aralkyl group. , Or a group that decomposes by the action of an acid to produce an alkali-soluble group (for example, a group that is desorbed by the action of an acid, a group represented by -C (R 4 ) 2 COOR 5 (R 4 is independent of each other). It represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R5 represents a group desorbed by the action of an acid.)).
R 105 independently represents an alkyl group or an alkenyl group, a, b and c are independently 1 to 3, d is 0 to 4, e is 0 to 3, and f is 0 to 3. A + d is 5 or less, b + e is 4 or less, and c + f is 4 or less.
For R 5 in a group that decomposes by the action of an acid to produce an alkali-soluble group, a group that is eliminated by the action of an acid, and a group represented by -C (R 4 ) 2 COOR 5 , for example, -C (R 36 ). ) (R 37 ) (R 38 ), -C (R 36 ) (R 37 ) (OR 39 ), -C (R 01 ) (R 02 ) (OR 39 ) and the like.
In the formula, R 36 to R 39 each independently represent an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group. R 36 and R 37 may be coupled to each other to form a ring.
As the alkyl group, an alkyl group having 1 to 10 carbon atoms is preferable, and an alkyl group having 1 to 5 carbon atoms is more preferable.
The alkyl group may be linear or branched.
As the cycloalkyl group, a cycloalkyl group having 3 to 12 carbon atoms is preferable, and a cycloalkyl group having 3 to 8 carbon atoms is more preferable.
The cycloalkyl group may have a monocyclic structure or a polycyclic structure such as a fused ring.
The aryl group is preferably an aromatic hydrocarbon group having 6 to 30 carbon atoms, and more preferably a phenyl group.
As the aralkyl group, an aralkyl group having 7 to 20 carbon atoms is preferable, and an aralkyl group having 7 to 16 carbon atoms is more preferable.
The above-mentioned aralkyl group is intended to be an aryl group substituted with an alkyl group, and preferred embodiments of these alkyl and aryl groups are the same as those of the above-mentioned preferred embodiments of alkyl and aryl groups.
The alkenyl group is preferably an alkenyl group having 3 to 20 carbon atoms, and more preferably an alkenyl group having 3 to 16 carbon atoms.
Further, these groups may further have a known substituent as long as the effect of the present invention can be obtained.
耐熱性の観点で、アルコキシメチル基又はアシルオキシメチル基が、直接芳香環やトリアジン環上に置換した化合物が好ましい。 As the compound containing at least one of an alkoxymethyl group and an acyloxymethyl group, a commercially available compound may be used, or a compound synthesized by a known method may be used.
From the viewpoint of heat resistance, a compound in which an alkoxymethyl group or an acyloxymethyl group is directly substituted on an aromatic ring or a triazine ring is preferable.
ビスメトキシメチル尿素、ビスエトキシメチル尿素、ビスプロポキシメチル尿素、ビスブトキシメチル尿素等の尿素系架橋剤、
モノヒドロキシメチル化エチレン尿素又はジヒドロキシメチル化エチレン尿素、モノメトキシメチル化エチレン尿素、ジメトキシメチル化エチレン尿素、モノエトキシメチル化エチレン尿素、ジエトキシメチル化エチレン尿素、モノプロポキシメチル化エチレン尿素、ジプロポキシメチル化エチレン尿素、モノブトキシメチル化エチレン尿素、又は、ジブトキシメチル化エチレン尿素などのエチレン尿素系架橋剤、
モノヒドロキシメチル化プロピレン尿素、ジヒドロキシメチル化プロピレン尿素、モノメトキシメチル化プロピレン尿素、ジメトキシメチル化プロピレン尿素、モノエトキシメチル化プロピレン尿素、ジエトキシメチル化プロピレン尿素、モノプロポキシメチル化プロピレン尿素、ジプロポキシメチル化プロピレン尿素、モノブトキシメチル化プロピレン尿素、又は、ジブトキシメチル化プロピレン尿素などのプロピレン尿素系架橋剤、
1,3-ジ(メトキシメチル)4,5-ジヒドロキシ-2-イミダゾリジノン、1,3-ジ(メトキシメチル)-4,5-ジメトキシ-2-イミダゾリジノンなどが挙げられる。 Specific examples of the urea-based cross-linking agent include monohydroxymethylated glycol uryl, dihydroxymethylated glycol uryl, trihydroxymethylated glycol uryl, tetrahydroxymethylated glycol uryl, monomethoxymethylated glycol uryl, and dimethoxymethylated glycol. Uril, trimethoxymethylated glycol uryl, tetramethoxymethylated glycol uryl, monoethoxymethylated glycol uryl, diethoxymethylated glycol uryl, triethoxymethylated glycol uryl, tetraethoxymethylated glycol uryl, monopropoxymethylated glycol uryl , Dipropoxymethylated glycol uryl, tripropoxymethylated glycol uryl, tetrapropoxymethylated glycol uryl, monobutoxymethylated glycol uryl, dibutoxymethylated glycol uryl, tributoxymethylated glycol uryl, or tetrabutoxymethylated glycol Glycoluril-based cross-linking agents such as uryl;
Urea-based cross-linking agents such as bismethoxymethylurea, bisethoxymethylurea, bispropoxymethylurea, and bisbutoxymethylurea,
Monohydroxymethylated ethylene urea or dihydroxymethylated ethylene urea, monomethoxymethylated ethylene urea, dimethoxymethylated ethylene urea, monoethoxymethylated ethylene urea, diethoxymethylated ethylene urea, monopropoxymethylated ethylene urea, dipropoxymethyl Ethyleneurea-based cross-linking agents such as ethyleneurea, monobutoxymethylated, or dibutoxymethylated ethyleneurea,
Monohydroxymethylated propylene urea, dihydroxymethylated propylene urea, monomethoxymethylated propylene urea, dimethoxymethylated propylene urea, monoethoxymethylated propylene urea, diethoxymethylated propylene urea, monopropoxymethylated propylene urea, dipropoxymethyl A propylene urea-based cross-linking agent such as propylene dioxide, monobutoxymethylated propylene urea, or dibutoxymethylated propylene urea,
Examples thereof include 1,3-di (methoxymethyl) 4,5-dihydroxy-2-imidazolidinone and 1,3-di (methoxymethyl) -4,5-dimethoxy-2-imidazolidinone.
このような化合物の具体例としては、ベンゼンジメタノール、ビス(ヒドロキシメチル)クレゾール、ビス(ヒドロキシメチル)ジメトキシベンゼン、ビス(ヒドロキシメチル)ジフェニルエーテル、ビス(ヒドロキシメチル)ベンゾフェノン、ヒドロキシメチル安息香酸ヒドロキシメチルフェニル、ビス(ヒドロキシメチル)ビフェニル、ジメチルビス(ヒドロキシメチル)ビフェニル、ビス(メトキシメチル)ベンゼン、ビス(メトキシメチル)クレゾール、ビス(メトキシメチル)ジメトキシベンゼン、ビス(メトキシメチル)ジフェニルエーテル、ビス(メトキシメチル)ベンゾフェノン、メトキシメチル安息香酸メトキシメチルフェニル、ビス(メトキシメチル)ビフェニル、ジメチルビス(メトキシメチル)ビフェニル、4,4’,4’’-エチリデントリス[2,6-ビス(メトキシメチル)フェノール]、5,5’-[2,2,2‐トリフルオロ‐1‐(トリフルオロメチル)エチリデン]ビス[2‐ヒドロキシ‐1,3‐ベンゼンジメタノール]、3,3’,5,5’-テトラキス(メトキシメチル)-1,1’-ビフェニル-4,4’-ジオール等が挙げられる。 In addition, as a compound having at least one group selected from the group consisting of a methylol group and an alkoxymethyl group, at least one selected from the group consisting of a methylol group and an alkoxymethyl group on an aromatic ring (preferably a benzene ring). Compounds to which the group of the species is directly bonded are also preferably used.
Specific examples of such compounds include benzenedimethanol, bis (hydroxymethyl) cresol, bis (hydroxymethyl) dimethoxybenzene, bis (hydroxymethyl) diphenyl ether, bis (hydroxymethyl) benzophenone, and hydroxymethylphenyl hydroxymethylbenzoate. , Bis (hydroxymethyl) biphenyl, dimethylbis (hydroxymethyl) biphenyl, bis (methoxymethyl) benzene, bis (methoxymethyl) cresol, bis (methoxymethyl) dimethoxybenzene, bis (methoxymethyl) diphenyl ether, bis (methoxymethyl) Benzenephenone, methoxymethylphenyl methoxymethylbenzoate, bis (methoxymethyl) biphenyl, dimethylbis (methoxymethyl) biphenyl, 4,4', 4''-ethylidentris [2,6-bis (methoxymethyl) phenol], 5 , 5'-[2,2,2-trifluoro-1- (trifluoromethyl) ethylidene] bis [2-hydroxy-1,3-benzenedimethanol], 3,3', 5,5'-tetrakis ( Examples thereof include methoxymethyl) -1,1'-biphenyl-4,4'-diol and the like.
エポキシ化合物としては、一分子中にエポキシ基を2以上有する化合物であることが好ましい。エポキシ基は、200℃以下で架橋反応し、かつ、架橋に由来する脱水反応が起こらないため膜収縮が起きにくい。このため、エポキシ化合物を含有することは、本発明の樹脂組成物の低温硬化及び反りの抑制に効果的である。 -Epoxy compound (compound having an epoxy group)-
The epoxy compound is preferably a compound having two or more epoxy groups in one molecule. The epoxy group undergoes a cross-linking reaction at 200 ° C. or lower, and the dehydration reaction derived from the cross-linking does not occur, so that film shrinkage is unlikely to occur. Therefore, the inclusion of the epoxy compound is effective in suppressing low temperature curing and warpage of the resin composition of the present invention.
オキセタン化合物としては、一分子中にオキセタン環を2つ以上有する化合物、3-エチル-3-ヒドロキシメチルオキセタン、1,4-ビス{[(3-エチル-3-オキセタニル)メトキシ]メチル}ベンゼン、3-エチル-3-(2-エチルヘキシルメチル)オキセタン、1,4-ベンゼンジカルボン酸-ビス[(3-エチル-3-オキセタニル)メチル]エステル等を挙げることができる。具体的な例としては、東亞合成(株)製のアロンオキセタンシリーズ(例えば、OXT-121、OXT-221)が好適に使用することができ、これらは単独で、又は2種以上混合してもよい。 -Oxetane compound (compound having an oxetanyl group)-
Examples of the oxetane compound include compounds having two or more oxetane rings in one molecule, 3-ethyl-3-hydroxymethyloxetane, 1,4-bis {[(3-ethyl-3-oxetanyl) methoxy] methyl} benzene, and the like. Examples thereof include 3-ethyl-3- (2-ethylhexylmethyl) oxetane, 1,4-benzenedicarboxylic acid-bis [(3-ethyl-3-oxetanyl) methyl] ester and the like. As a specific example, Aron Oxetane series (for example, OXT-121, OXT-221) manufactured by Toagosei Co., Ltd. can be preferably used, and these can be used alone or in combination of two or more. good.
ベンゾオキサジン化合物は、開環付加反応に由来する架橋反応のため、硬化時に脱ガスが発生せず、更に熱収縮を小さくして反りの発生が抑えられることから好ましい。 -Benzoxazine compound (compound having a benzoxazolyl group)-
Since the benzoxazine compound is a cross-linking reaction derived from the ring-opening addition reaction, degassing does not occur during curing, and heat shrinkage is further reduced to suppress the occurrence of warpage, which is preferable.
本発明の樹脂組成物は、光及び/又は熱により重合を開始させることができる重合開始剤を含む。特に光重合開始剤を含むことが好ましい。
光重合開始剤は、光ラジカル重合開始剤であることが好ましい。光ラジカル重合開始剤としては、特に制限はなく、公知の光ラジカル重合開始剤の中から適宜選択することができる。例えば、紫外線領域から可視領域の光線に対して感光性を有する光ラジカル重合開始剤が好ましい。また、光励起された増感剤と何らかの作用を生じ、活性ラジカルを生成する活性剤であってもよい。 [Polymer initiator]
The resin composition of the present invention contains a polymerization initiator that can initiate polymerization by light and / or heat. In particular, it is preferable to include a photopolymerization initiator.
The photopolymerization initiator is preferably a photoradical polymerization initiator. The photoradical polymerization initiator is not particularly limited and may be appropriately selected from known photoradical polymerization initiators. For example, a photoradical polymerization initiator having photosensitivity to light rays in the ultraviolet region to the visible region is preferable. Further, it may be an active agent that causes some action with a photoexcited sensitizer and generates an active radical.
式中、RX1は、アルキル基、アルケニル基、アルコキシ基、アリール基、アリールオキシ基、複素環基、複素環オキシ基、アルキルスルファニル基、アリールスルファニル基、アルキルスルフィニル基、アリールスルフィニル基、アルキルスルホニル基、アリールスルホニル基、アシル基、アシルオキシ基、アミノ基、ホスフィノイル基、カルバモイル基またはスルファモイル基を表し、
RX2は、アルキル基、アルケニル基、アルコキシ基、アリール基、アリールオキシ基、複素環基、複素環オキシ基、アルキルスルファニル基、アリールスルファニル基、アルキルスルフィニル基、アリールスルフィニル基、アルキルスルホニル基、アリールスルホニル基、アシルオキシ基またはアミノ基を表し、
RX3~RX14は、それぞれ独立して水素原子または置換基を表す。
ただし、RX10~RX14のうち少なくとも一つは、電子求引性基である。 The oxime compound OX is preferably at least one selected from the compound represented by the formula (OX1) and the compound represented by the formula (OX2), and more preferably the compound represented by the formula (OX2). preferable.
In the formula, RX1 is an alkyl group, an alkenyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic oxy group, an alkylsulfanyl group, an arylsulfanyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group. Represents a group, arylsulfonyl group, acyl group, acyloxy group, amino group, phosphinoyl group, carbamoyl group or sulfamoyl group.
RX2 contains an alkyl group, an alkenyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic oxy group, an alkylsulfanyl group, an arylsulfanyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group and an aryl. Represents a sulfonyl group, an acyloxy group or an amino group
RX3 to RX14 independently represent a hydrogen atom or a substituent.
However, at least one of RX10 to RX14 is an electron-withdrawing group.
なお、光重合開始剤は熱重合開始剤としても機能する場合があるため、オーブンやホットプレート等の加熱によって光重合開始剤による架橋を更に進行させられる場合がある。 When the photopolymerization initiator is contained, the content thereof is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, based on the total solid content of the resin composition of the present invention. It is more preferably 0.5 to 15% by mass, and even more preferably 1.0 to 10% by mass. Only one type of photopolymerization initiator may be contained, or two or more types may be contained. When two or more kinds of photopolymerization initiators are contained, the total amount is preferably in the above range.
Since the photopolymerization initiator may also function as a thermal polymerization initiator, cross-linking with the photopolymerization initiator may be further promoted by heating an oven, a hot plate, or the like.
樹脂組成物は、増感剤を含んでいてもよい。増感剤は、特定の活性放射線を吸収して電子励起状態となる。電子励起状態となった増感剤は、熱ラジカル重合開始剤、光ラジカル重合開始剤などと接触して、電子移動、エネルギー移動、発熱などの作用が生じる。これにより、熱ラジカル重合開始剤、光ラジカル重合開始剤は化学変化を起こして分解し、ラジカル、酸又は塩基を生成する。
使用可能な増感剤として、ベンゾフェノン系、ミヒラーズケトン系、クマリン系、ピラゾールアゾ系、アニリノアゾ系、トリフェニルメタン系、アントラキノン系、アントラセン系、アントラピリドン系、ベンジリデン系、オキソノール系、ピラゾロトリアゾールアゾ系、ピリドンアゾ系、シアニン系、フェノチアジン系、ピロロピラゾールアゾメチン系、キサンテン系、フタロシアニン系、ベンゾピラン系、インジゴ系等の化合物を使用することができる。
増感剤としては、例えば、ミヒラーズケトン、4,4’-ビス(ジエチルアミノ)ベンゾフェノン、2,5-ビス(4’-ジエチルアミノベンザル)シクロペンタン、2,6-ビス(4’-ジエチルアミノベンザル)シクロヘキサノン、2,6-ビス(4’-ジエチルアミノベンザル)-4-メチルシクロヘキサノン、4,4’-ビス(ジメチルアミノ)カルコン、4,4’-ビス(ジエチルアミノ)カルコン、p-ジメチルアミノシンナミリデンインダノン、p-ジメチルアミノベンジリデンインダノン、2-(p-ジメチルアミノフェニルビフェニレン)-ベンゾチアゾール、2-(p-ジメチルアミノフェニルビニレン)ベンゾチアゾール、2-(p-ジメチルアミノフェニルビニレン)イソナフトチアゾール、1,3-ビス(4’-ジメチルアミノベンザル)アセトン、1,3-ビス(4’-ジエチルアミノベンザル)アセトン、3,3’-カルボニル-ビス(7-ジエチルアミノクマリン)、3-アセチル-7-ジメチルアミノクマリン、3-エトキシカルボニル-7-ジメチルアミノクマリン、3-ベンジロキシカルボニル-7-ジメチルアミノクマリン、3-メトキシカルボニル-7-ジエチルアミノクマリン、3-エトキシカルボニル-7-ジエチルアミノクマリン(7-(ジエチルアミノ)クマリン-3-カルボン酸エチル)、N-フェニル-N’-エチルエタノールアミン、N-フェニルジエタノールアミン、N-p-トリルジエタノールアミン、N-フェニルエタノールアミン、4-モルホリノベンゾフェノン、ジメチルアミノ安息香酸イソアミル、ジエチルアミノ安息香酸イソアミル、2-メルカプトベンズイミダゾール、1-フェニル-5-メルカプトテトラゾール、2-メルカプトベンゾチアゾール、2-(p-ジメチルアミノスチリル)ベンズオキサゾール、2-(p-ジメチルアミノスチリル)ベンゾチアゾール、2-(p-ジメチルアミノスチリル)ナフト(1,2-d)チアゾール、2-(p-ジメチルアミノベンゾイル)スチレン、ジフェニルアセトアミド、ベンズアニリド、N-メチルアセトアニリド、3‘,4’-ジメチルアセトアニリド等が挙げられる。
また、他の増感色素を用いてもよい。
増感色素の詳細については、特開2016-027357号公報の段落0161~0163の記載を参酌でき、この内容は本明細書に組み込まれる。 [Sensitizer]
The resin composition may contain a sensitizer. The sensitizer absorbs specific active radiation and becomes an electronically excited state. The sensitizer in the electron-excited state comes into contact with the thermal radical polymerization initiator, the photoradical polymerization initiator, and the like, and acts such as electron transfer, energy transfer, and heat generation occur. As a result, the thermal radical polymerization initiator and the photoradical polymerization initiator undergo a chemical change and decompose to generate a radical, an acid or a base.
Benzophenone-based, Michiller's ketone-based, coumarin-based, pyrazole-azo-based, anilino-azo-based, triphenylmethane-based, anthracinone-based, anthracene-based, anthrapyridone-based, benzylidene-based, xanthol-based, pyrazole triazole-azo-based as sensitizers that can be used. , Pyridone azo, cyanine, phenothiazine, pyrrolopyrazole azomethine, xanthene, phthalocyanine, benzopyran, indigo and the like can be used.
Examples of the sensitizer include Michler's ketone, 4,4'-bis (diethylamino) benzophenone, 2,5-bis (4'-diethylaminobenzal) cyclopentane, and 2,6-bis (4'-diethylaminobenzal). Cyclohexanone, 2,6-bis (4'-diethylaminobenzal) -4-methylcyclohexanone, 4,4'-bis (dimethylamino) chalcone, 4,4'-bis (diethylamino) chalcone, p-dimethylaminocinnamyl Denindanone, p-dimethylaminobenzylideneindanone, 2- (p-dimethylaminophenylbiphenylene) -benzothiazole, 2- (p-dimethylaminophenylbinylene) benzothiazole, 2- (p-dimethylaminophenylbinylene) iso Naftthiazole, 1,3-bis (4'-dimethylaminobenzal) acetone, 1,3-bis (4'-diethylaminobenzal) acetone, 3,3'-carbonyl-bis (7-diethylaminocoumarin), 3 -Acetyl-7-dimethylaminocoumarin, 3-ethoxycarbonyl-7-dimethylaminocoumarin, 3-benzyloxycarbonyl-7-dimethylaminocoumarin, 3-methoxycarbonyl-7-diethylaminocoumarin, 3-ethoxycarbonyl-7-diethylamino Kumarin (7- (diethylamino) coumarin-3-carboxylate ethyl), N-phenyl-N'-ethylethanolamine, N-phenyldiethanolamine, Np-tolyldiethanolamine, N-phenylethanolamine, 4-morpholinobenzophenone, Isoamyl dimethylaminobenzoate, isoamyl diethylaminobenzoate, 2-mercaptobenzimidazole, 1-phenyl-5-mercaptotetrazole, 2-mercaptobenzothiazole, 2- (p-dimethylaminostyryl) benzoxazole, 2- (p-dimethyl) Aminostyryl) benzothiazole, 2- (p-dimethylaminostyryl) naphtho (1,2-d) thiazole, 2- (p-dimethylaminobenzoyl) styrene, diphenylacetamide, benzanilide, N-methylacetanilide, 3', 4 '-Dimethylacetanilide and the like can be mentioned.
Moreover, you may use other sensitizing dyes.
For details of the sensitizing dye, the description in paragraphs 0161 to 0163 of JP-A-2016-027355 can be referred to, and the content thereof is incorporated in the present specification.
本発明の樹脂組成物は、連鎖移動剤を含有してもよい。連鎖移動剤は、例えば高分子辞典第三版(高分子学会編、2005年)683-684頁に定義されている。連鎖移動剤としては、例えば、分子内に-S-S-、-SO2-S-、-N-O-、SH、PH、SiH、及びGeHを有する化合物群、RAFT(Reversible Addition Fragmentation chain Transfer)重合に用いられるチオカルボニルチオ基を有するジチオベンゾアート、トリチオカルボナート、ジチオカルバマート、キサンタート化合物等が用いられる。これらは、低活性のラジカルに水素を供与して、ラジカルを生成するか、若しくは、酸化された後、脱プロトンすることによりラジカルを生成しうる。特に、チオール化合物を好ましく用いることができる。 [Chain transfer agent]
The resin composition of the present invention may contain a chain transfer agent. Chain transfer agents are defined, for example, in the Polymer Dictionary, Third Edition (edited by the Society of Polymer Science, 2005), pp. 683-684. Examples of the chain transfer agent include RAFT (Reversible Addition Fragmentation chain Transfer), which is a group of compounds having -S-S-, -SO2 -S-, -NO-, SH, PH, SiH, and GeH in the molecule. ) Dithiobenzoate, trithiocarbonate, dithiocarbamate, xantate compound and the like having a thiocarbonylthio group used for polymerization are used. They can donate hydrogen to low-activity radicals to generate radicals, or they can be oxidized and then deprotonated to generate radicals. In particular, thiol compounds can be preferably used.
本発明の樹脂組成物は、塩基発生剤を更に含むことが好ましい。ここで、塩基発生剤とは、物理的または化学的な作用によって塩基を発生することができる化合物である。本発明の樹脂組成物にとって好ましい塩基発生剤としては、熱塩基発生剤および光塩基発生剤が挙げられる。
特に、樹脂組成物が環化樹脂の前駆体を含む場合、樹脂組成物は塩基発生剤を含むことが好ましい。樹脂組成物が熱塩基発生剤を含有することによって、例えば加熱により前駆体の環化反応を促進でき、硬化物の機械特性や耐薬品性が良好なものとなり、例えば半導体パッケージ中に含まれる再配線層用層間絶縁膜としての性能が良好となる。
塩基発生剤としては、イオン型塩基発生剤でもよく、非イオン型塩基発生剤でもよい。塩基発生剤から発生する塩基としては、例えば、2級アミン、3級アミンが挙げられる。
本発明に係る塩基発生剤について特に制限はなく、公知の塩基発生剤を用いることができる。公知の塩基発生剤としては、例えば、カルバモイルオキシム化合物、カルバモイルヒドロキシルアミン化合物、カルバミン酸化合物、ホルムアミド化合物、アセトアミド化合物、カルバメート化合物、ベンジルカルバメート化合物、ニトロベンジルカルバメート化合物、スルホンアミド化合物、イミダゾール誘導体化合物、アミンイミド化合物、ピリジン誘導体化合物、α-アミノアセトフェノン誘導体化合物、4級アンモニウム塩誘導体化合物、ピリジニウム塩、α-ラクトン環誘導体化合物、アミンイミド化合物、フタルイミド誘導体化合物、アシルオキシイミノ化合物、などを用いることができる。
非イオン型塩基発生剤の具体的な化合物としては、式(B1)、式(B2)、又は式(B3)で表される化合物が挙げられる。
The resin composition of the present invention preferably further contains a base generator. Here, the base generator is a compound capable of generating a base by a physical or chemical action. Preferred base generators for the resin composition of the present invention include thermal base generators and photobase generators.
In particular, when the resin composition contains a precursor of a cyclized resin, it is preferable that the resin composition contains a base generator. When the resin composition contains a thermal base generator, for example, the cyclization reaction of the precursor can be promoted by heating, and the mechanical properties and chemical resistance of the cured product become good. The performance as an interlayer insulating film for a wiring layer is improved.
The base generator may be an ionic base generator or a nonionic base generator. Examples of the base generated from the base generator include secondary amines and tertiary amines.
The base generator according to the present invention is not particularly limited, and a known base generator can be used. Known base generators include, for example, carbamoyloxime compounds, carbamoylhydroxylamine compounds, carbamic acid compounds, formamide compounds, acetoamide compounds, carbamates compounds, benzylcarbamate compounds, nitrobenzylcarbamate compounds, sulfonamide compounds, imidazole derivative compounds, amineimides. Compounds, pyridine derivative compounds, α-aminoacetophenone derivative compounds, quaternary ammonium salt derivative compounds, pyridinium salts, α-lactone ring derivative compounds, amineimide compounds, phthalimide derivative compounds, acyloxyimino compounds and the like can be used.
Specific examples of the compound of the nonionic base generator include a compound represented by the formula (B1), the formula (B2), or the formula (B3).
Rb13はアルキル基(炭素数1~24が好ましく、2~18がより好ましく、3~12が更に好ましい)、アルケニル基(炭素数2~24が好ましく、2~18がより好ましく、3~12が更に好ましい)、アリール基(炭素数6~22が好ましく、6~18がより好ましく、6~12が更に好ましい)、アリールアルキル基(炭素数7~23が好ましく、7~19がより好ましく、7~12が更に好ましい)であり、本発明の効果を奏する範囲で置換基を有していてもよい。中でも、Rb13はアリールアルキル基が好ましい。 In the formula, Rb 11 and Rb 12 , and Rb 31 and Rb 32 are the same as Rb 1 and Rb 2 in the formula (B1), respectively.
Rb 13 has an alkyl group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, further preferably 3 to 12 carbon atoms) and an alkenyl group (preferably 2 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, 3 to 12 carbon atoms). Is more preferable), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, further preferably 6 to 12 carbon atoms), an arylalkyl group (preferably 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms). 7 to 12 is more preferable), and a substituent may be provided as long as the effect of the present invention is exhibited. Among them, Rb 13 is preferably an arylalkyl group.
Rb15及びRb16は水素原子、アルキル基(炭素数1~12が好ましく、1~6がより好ましく、1~3が更に好ましい)、アルケニル基(炭素数2~12が好ましく、2~6がより好ましく、2~3が更に好ましい)、アリール基(炭素数6~22が好ましく、6~18がより好ましく、6~10が更に好ましい)、アリールアルキル基(炭素数7~23が好ましく、7~19がより好ましく、7~11が更に好ましい)であり、水素原子又はメチル基が好ましい。
Rb17はアルキル基(炭素数1~24が好ましく、1~12がより好ましく、3~8が更に好ましい)、アルケニル基(炭素数2~12が好ましく、2~10がより好ましく、3~8が更に好ましい)、アリール基(炭素数6~22が好ましく、6~18がより好ましく、6~12が更に好ましい)、アリールアルキル基(炭素数7~23が好ましく、7~19がより好ましく、7~12が更に好ましい)であり、中でもアリール基が好ましい。 Rb 11 and Rb 12 are synonymous with Rb 11 and Rb 12 in the formula (B1-1).
Rb 15 and Rb 16 are a hydrogen atom, an alkyl group (preferably 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, still more preferably 1 to 3 carbon atoms), and an alkenyl group (preferably 2 to 12 carbon atoms, 2 to 6 carbon atoms). More preferably, 2 to 3 are more preferable), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, still more preferably 6 to 10), an arylalkyl group (preferably 7 to 23 carbon atoms, 7). ~ 19 is more preferable, and 7 to 11 are more preferable), and a hydrogen atom or a methyl group is preferable.
Rb 17 has an alkyl group (preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, further preferably 3 to 8 carbon atoms) and an alkenyl group (preferably 2 to 12 carbon atoms, more preferably 2 to 10 carbon atoms, 3 to 8 carbon atoms). Is more preferable), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, further preferably 6 to 12 carbon atoms), and an arylalkyl group (preferably 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms). 7 to 12 is more preferable), and an aryl group is particularly preferable.
環状アルキル基は、炭素数3~12のものが好ましく、3~6がより好ましい。環状アルキル基は、例えば、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、シクロオクチル基等が挙げられる。
鎖状アルキル基と環状アルキル基の組合せに係る基は、炭素数4~24のものが好ましく、4~18がより好ましく、4~12がさらに好ましい。鎖状アルキル基と環状アルキル基の組合せに係る基は、例えば、シクロヘキシルメチル基、シクロヘキシルエチル基、シクロヘキシルプロピル基、メチルシクロヘキシルメチル基、エチルシクロヘキシルエチル基等が挙げられる。
酸素原子を鎖中に有するアルキル基は、炭素数2~12のものが好ましく、2~6がより好ましく、2~4がさらに好ましい。酸素原子を鎖中に有するアルキル基は、鎖状でも環状でもよく、直鎖でも分岐でもよい。
なかでも、後述する分解生成塩基の沸点を高める観点で、RN1およびRN2は炭素数5~12のアルキル基が好ましい。ただし、金属(例えば銅)の層と積層する際の密着性を重視する処方においては、環状のアルキル基を有する基や炭素数1~8のアルキル基であることが好ましい。 As the aliphatic hydrocarbon group constituting RN1 and RN2 , a linear or branched chain alkyl group, a cyclic alkyl group, a group related to a combination of a chain alkyl group and a cyclic alkyl group, and an oxygen atom are contained in the chain. Examples thereof include alkyl groups having. The linear or branched chain alkyl group preferably has 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, and even more preferably 3 to 12 carbon atoms. The linear or branched chain alkyl group is, for example, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an undecyl group, a dodecyl group, or an isopropyl group. Examples thereof include a group, an isobutyl group, a secondary butyl group, a tertiary butyl group, an isopentyl group, a neopentyl group, a tertiary pentyl group, and an isohexyl group.
The cyclic alkyl group preferably has 3 to 12 carbon atoms, and more preferably 3 to 6 carbon atoms. Examples of the cyclic alkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cyclooctyl group and the like.
The group related to the combination of the chain alkyl group and the cyclic alkyl group preferably has 4 to 24 carbon atoms, more preferably 4 to 18 carbon atoms, and even more preferably 4 to 12 carbon atoms. Examples of the group related to the combination of the chain alkyl group and the cyclic alkyl group include a cyclohexylmethyl group, a cyclohexylethyl group, a cyclohexylpropyl group, a methylcyclohexylmethyl group, an ethylcyclohexylethyl group and the like.
The alkyl group having an oxygen atom in the chain is preferably 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, still more preferably 2 to 4 carbon atoms. The alkyl group having an oxygen atom in the chain may be chain-like or cyclic, and may be linear or branched.
Among them, alkyl groups having 5 to 12 carbon atoms are preferable for RN1 and RN2 from the viewpoint of increasing the boiling point of the decomposition-generated base described later. However, in a formulation that emphasizes adhesion when laminated with a metal (for example, copper) layer, a group having a cyclic alkyl group or an alkyl group having 1 to 8 carbon atoms is preferable.
2価の炭化水素連結基は、炭素数1~24のものが好ましく、2~12がより好ましく、2~6がさらに好ましい。2価の脂肪族炭化水素基は、炭素数1~12のものが好ましく、2~6がより好ましく、2~4がさらに好ましい。2価の芳香族炭化水素基は、炭素数6~22のものが好ましく、6~18がより好ましく、6~10がさらに好ましい。2価の脂肪族炭化水素基と2価の芳香族炭化水素基の組み合わせに係る基(例えば、アリーレンアルキル基)は、炭素数7~22のものが好ましく、7~18がより好ましく、7~10がさらに好ましい。 The divalent linking group constituting L is not particularly specified, but a hydrocarbon group is preferable, and an aliphatic hydrocarbon group is more preferable. The hydrocarbon group may have a substituent, or may have an atom of a type other than a carbon atom in the hydrocarbon chain. More specifically, it is preferably a divalent hydrocarbon linking group which may have an oxygen atom in the chain, and a divalent aliphatic hydrocarbon which may have an oxygen atom in the chain. More preferably, a divalent aromatic hydrocarbon group or a group relating to a combination of a divalent aliphatic hydrocarbon group which may have an oxygen atom in the chain and a divalent aromatic hydrocarbon group is preferable. A divalent aliphatic hydrocarbon group which may have an oxygen atom in the chain is more preferable. It is preferable that these groups do not have an oxygen atom.
The divalent hydrocarbon linking group preferably has 1 to 24 carbon atoms, more preferably 2 to 12 carbon atoms, and even more preferably 2 to 6 carbon atoms. The divalent aliphatic hydrocarbon group preferably has 1 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 4 carbon atoms. The divalent aromatic hydrocarbon group preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and even more preferably 6 to 10 carbon atoms. The group (for example, an arylene alkyl group) relating to the combination of the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group preferably has 7 to 22 carbon atoms, more preferably 7 to 18 carbon atoms, and 7 to 18 carbon atoms. 10 is more preferable.
直鎖または分岐の鎖状アルキレン基は、炭素数1~12のものが好ましく、2~6がより好ましく、2~4がさらに好ましい。
環状アルキレン基は、炭素数3~12のものが好ましく、3~6がより好ましい。
鎖状アルキレン基と環状アルキレン基の組み合わせに係る基は、炭素数4~24のものが好ましく、4~12がより好ましく、4~6がさらに好ましい。
酸素原子を鎖中に有するアルキレン基は、鎖状でも環状でもよく、直鎖でも分岐でもよい。酸素原子を鎖中に有するアルキレン基は、炭素数1~12のものが好ましく、1~6がより好ましく、1~3がさらに好ましい。 Specific examples of the linking group L include a linear or branched chain alkylene group, a cyclic alkylene group, a group related to a combination of a chain alkylene group and a cyclic alkylene group, and an alkylene group having an oxygen atom in the chain. , A linear or branched chain alkaneylene group, a cyclic alkaneylene group, an arylene group, or an arylene alkylene group is preferable.
The linear or branched chain alkylene group preferably has 1 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 4 carbon atoms.
The cyclic alkylene group preferably has 3 to 12 carbon atoms, and more preferably 3 to 6 carbon atoms.
The group related to the combination of the chain alkylene group and the cyclic alkylene group preferably has 4 to 24 carbon atoms, more preferably 4 to 12 carbon atoms, and even more preferably 4 to 6 carbon atoms.
The alkylene group having an oxygen atom in the chain may be chain-like or cyclic, and may be linear or branched. The alkylene group having an oxygen atom in the chain is preferably 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, still more preferably 1 to 3 carbon atoms.
環状のアルケニレン基は、炭素数3~12のものが好ましく、3~6がより好ましい。環状のアルケニレン基は、C=C結合の数は1~6が好ましく、1~4がより好ましく、1~2がさらに好ましい。
アリーレン基は、炭素数6~22のものが好ましく、6~18がより好ましく、6~10がさらに好ましい。
アリーレンアルキレン基は、炭素数7~23のものが好ましく、7~19がより好ましく、7~11がさらに好ましい。
中でも、鎖状アルキレン基、環状アルキレン基、酸素原子を鎖中に有するアルキレン基、鎖状のアルケニレン基、アリーレン基、アリーレンアルキレン基が好ましく、1,2-エチレン基、プロパンジイル基(特に1,3-プロパンジイル基)、シクロヘキサンジイル基(特に1,2-シクロヘキサンジイル基)、ビニレン基(特にシスビニレン基)、フェニレン基(1,2-フェニレン基)、フェニレンメチレン基(特に1,2-フェニレンメチレン基)、エチレンオキシエチレン基(特に1,2-エチレンオキシ-1,2-エチレン基)がより好ましい。 The linear or branched chain-like alkenylene group preferably has 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 3 carbon atoms. The linear or branched chain-like alkenylene group preferably has 1 to 10 C = C bonds, more preferably 1 to 6, and even more preferably 1 to 3.
The cyclic alkenylene group preferably has 3 to 12 carbon atoms, and more preferably 3 to 6 carbon atoms. For the cyclic alkenylene group, the number of C = C bonds is preferably 1 to 6, more preferably 1 to 4, and even more preferably 1 to 2.
The arylene group preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and even more preferably 6 to 10 carbon atoms.
The arylene alkylene group preferably has 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms, and even more preferably 7 to 11 carbon atoms.
Of these, a chain alkylene group, a cyclic alkylene group, an alkylene group having an oxygen atom in the chain, a chain alkenylene group, an arylene group and an arylene alkylene group are preferable, and a 1,2-ethylene group and a propandiyl group (particularly 1, 3-Propanediyl group), cyclohexanediyl group (especially 1,2-cyclohexanediyl group), vinylene group (especially cisvinylene group), phenylene group (1,2-phenylene group), phenylene methylene group (especially 1,2-phenylene) Methylene group) and ethyleneoxyethylene group (particularly 1,2-ethyleneoxy-1,2-ethylene group) are more preferable.
塩基発生剤は、1種又は2種以上を用いることができる。2種以上を用いる場合は、合計量が上記範囲であることが好ましい。 When the resin composition of the present invention contains a base generator, the content of the base generator is preferably 0.1 to 50 parts by mass with respect to 100 parts by mass of the resin in the resin composition of the present invention. The lower limit is more preferably 0.3 parts by mass or more, and further preferably 0.5 parts by mass or more. The upper limit is more preferably 30 parts by mass or less, further preferably 20 parts by mass or less, further preferably 10 parts by mass or less, 5 parts by mass or less, or 4 parts by mass or less.
As the base generator, one kind or two or more kinds can be used. When two or more kinds are used, the total amount is preferably in the above range.
本発明の樹脂組成物は、溶剤を含むことが好ましい。
溶剤は、公知の溶剤を任意に使用できる。溶剤は有機溶剤が好ましい。有機溶剤としては、エステル類、エーテル類、ケトン類、環状炭化水素類、スルホキシド類、アミド類、ウレア類、アルコール類などの化合物が挙げられる。 <Solvent>
The resin composition of the present invention preferably contains a solvent.
As the solvent, a known solvent can be arbitrarily used. The solvent is preferably an organic solvent. Examples of the organic solvent include compounds such as esters, ethers, ketones, cyclic hydrocarbons, sulfoxides, amides, ureas and alcohols.
本発明の樹脂組成物は、電極や配線などに用いられる金属材料との接着性を向上させるための金属接着性改良剤を含んでいることが好ましい。金属接着性改良剤としては、アルコキシシリル基を有するシランカップリング剤、アルミニウム系接着助剤、チタン系接着助剤、スルホンアミド構造を有する化合物及びチオウレア構造を有する化合物、リン酸誘導体化合物、βケトエステル化合物、アミノ化合物等が挙げられる。 <Metal adhesion improver>
The resin composition of the present invention preferably contains a metal adhesiveness improving agent for improving the adhesiveness with a metal material used for electrodes, wiring and the like. Examples of the metal adhesion improver include a silane coupling agent having an alkoxysilyl group, an aluminum-based adhesive aid, a titanium-based adhesive aid, a compound having a sulfonamide structure and a compound having a thiourea structure, a phosphoric acid derivative compound, and a β-ketoester. Examples thereof include compounds and amino compounds.
シランカップリング剤としては、例えば、国際公開第2015/199219号の段落0167に記載の化合物、特開2014-191002号公報の段落0062~0073に記載の化合物、国際公開第2011/080992号の段落0063~0071に記載の化合物、特開2014-191252号公報の段落0060~0061に記載の化合物、特開2014-041264号公報の段落0045~0052に記載の化合物、国際公開第2014/097594号の段落0055に記載の化合物、特開2018-173573の段落0067~0078に記載の化合物が挙げられ、これらの内容は本明細書に組み込まれる。また、特開2011-128358号公報の段落0050~0058に記載のように異なる2種以上のシランカップリング剤を用いることも好ましい。また、シランカップリング剤は、下記化合物を用いることも好ましい。以下の式中、Meはメチル基を、Etはエチル基を表す。 〔Silane coupling agent〕
Examples of the silane coupling agent include the compound described in paragraph 0167 of International Publication No. 2015/199219, the compound described in paragraphs 0062 to 0073 of JP-A-2014-191002, paragraph of International Publication No. 2011/080992. The compounds described in 0063 to 0071, the compounds described in paragraphs 0060 to 0061 of JP-A-2014-191252, the compounds described in paragraphs 0045-0052 of JP-A-2014-041264, International Publication No. 2014/097594. Examples thereof include the compounds described in paragraph 0055 and the compounds described in paragraphs 0067 to 0078 of JP-A-2018-173573, the contents of which are incorporated herein by reference. Further, it is also preferable to use two or more different silane coupling agents as described in paragraphs 0050 to 0058 of JP-A-2011-128358. Further, it is also preferable to use the following compounds as the silane coupling agent. In the following formula, Me represents a methyl group and Et represents an ethyl group.
アルミニウム系接着助剤としては、例えば、アルミニウムトリス(エチルアセトアセテート)、アルミニウムトリス(アセチルアセトネート)、エチルアセトアセテートアルミニウムジイソプロピレート等を挙げることができる。 [Aluminum-based adhesive aid]
Examples of the aluminum-based adhesive aid include aluminum tris (ethyl acetoacetate), aluminum tris (acetyl acetonate), ethyl acetoacetate aluminum diisopropylate, and the like.
本発明の樹脂組成物は、マイグレーション抑制剤を更に含むことが好ましい。
マイグレーション抑制剤を含むことにより、金属層(金属配線)由来の金属イオンが膜内へ移動することを効果的に抑制可能となる。 <Migration inhibitor>
The resin composition of the present invention preferably further contains a migration inhibitor.
By including the migration inhibitor, it is possible to effectively suppress the movement of metal ions derived from the metal layer (metal wiring) into the membrane.
本発明の樹脂組成物は、重合禁止剤を含むことが好ましい。重合禁止剤としてはフェノール系化合物、キノン系化合物、アミノ系化合物、N-オキシルフリーラジカル化合物系化合物、ニトロ系化合物、ニトロソ系化合物、ヘテロ芳香環系化合物、金属化合物などが挙げられる。 <Polymerization inhibitor>
The resin composition of the present invention preferably contains a polymerization inhibitor. Examples of the polymerization inhibitor include phenol-based compounds, quinone-based compounds, amino-based compounds, N-oxyl-free radical compound-based compounds, nitro-based compounds, nitroso-based compounds, heteroaromatic ring-based compounds, and metal compounds.
本発明の樹脂組成物は、本発明の効果が得られる範囲で、必要に応じて、各種の添加物、例えば、界面活性剤、高級脂肪酸誘導体、熱重合開始剤、無機粒子、紫外線吸収剤、有機チタン化合物、酸化防止剤、凝集防止剤、フェノール系化合物、他の高分子化合物、可塑剤及びその他の助剤類(例えば、消泡剤、難燃剤など)等を配合することができる。これらの成分を適宜含有させることにより、膜物性などの性質を調整することができる。これらの成分は、例えば、特開2012-003225号公報の段落番号0183以降(対応する米国特許出願公開第2013/0034812号明細書の段落番号0237)の記載、特開2008-250074号公報の段落番号0101~0104、0107~0109等の記載を参酌でき、これらの内容は本明細書に組み込まれる。これらの添加剤を配合する場合、その合計配合量は本発明の樹脂組成物の固形分の3質量%以下とすることが好ましい。 <Other additives>
The resin composition of the present invention comprises various additives such as a surfactant, a higher fatty acid derivative, a thermal polymerization initiator, an inorganic particle, and an ultraviolet absorber, if necessary, as long as the effects of the present invention can be obtained. Organic titanium compounds, antioxidants, antiaggregating agents, phenolic compounds, other polymer compounds, plasticizers and other auxiliaries (eg, antifoaming agents, flame retardant agents, etc.) can be blended. By appropriately containing these components, properties such as film physical characteristics can be adjusted. These components are described in, for example, paragraph No. 0183 or later of JP2012-003225A (paragraph number 0237 of the corresponding US Patent Application Publication No. 2013/0034812), paragraph 2008-250074. The description of numbers 0101 to 0104, 0107 to 0109, etc. can be taken into consideration, and these contents are incorporated in the present specification. When these additives are blended, the total blending amount is preferably 3% by mass or less of the solid content of the resin composition of the present invention.
界面活性剤としては、フッ素系界面活性剤、シリコーン系界面活性剤、炭化水素系界面活性剤などの各種界面活性剤を使用できる。界面活性剤はノニオン型界面活性剤であってもよく、カチオン型界面活性剤であってもよく、アニオン型界面活性剤であってもよい。 [Surfactant]
As the surfactant, various surfactants such as a fluorine-based surfactant, a silicone-based surfactant, and a hydrocarbon-based surfactant can be used. The surfactant may be a nonionic surfactant, a cationic surfactant, or an anionic surfactant.
フッ素系界面活性剤は、フッ素原子を有する(メタ)アクリレート化合物に由来する繰り返し単位と、アルキレンオキシ基(好ましくはエチレンオキシ基、プロピレンオキシ基)を2以上(好ましくは5以上)有する(メタ)アクリレート化合物に由来する繰り返し単位と、を含む含フッ素高分子化合物も好ましく用いることができ、下記化合物も本発明で用いられるフッ素系界面活性剤として例示される。
The fluorine-based surfactant has a repeating unit derived from a (meth) acrylate compound having a fluorine atom and 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy groups and propyleneoxy groups) (meth). A fluorine-containing polymer compound containing a repeating unit derived from an acrylate compound can also be preferably used, and the following compounds are also exemplified as the fluorine-based surfactant used in the present invention.
フッ素系界面活性剤は、エチレン性不飽和基を側鎖に有する含フッ素重合体をフッ素系界面活性剤として用いることもできる。具体例としては、特開2010-164965号公報の段落0050~0090および段落0289~0295に記載された化合物が挙げられ、この内容は本明細書に組み込まれる。また、市販品としては、例えばDIC(株)製のメガファックRS-101、RS-102、RS-718K等が挙げられる。 The weight average molecular weight of the above compounds is preferably 3,000 to 50,000, more preferably 5,000 to 30,000.
As the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated group in the side chain can also be used as the fluorine-based surfactant. Specific examples thereof include the compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of JP2010-164965, the contents of which are incorporated in the present specification. Examples of commercially available products include Megafuck RS-101, RS-102, and RS-718K manufactured by DIC Corporation.
界面活性剤の含有量は、組成物の全固形分に対して、0.001~2.0質量%が好ましく、0.005~1.0質量%がより好ましい。 Only one type of surfactant may be used, or two or more types may be combined.
The content of the surfactant is preferably 0.001 to 2.0% by mass, more preferably 0.005 to 1.0% by mass, based on the total solid content of the composition.
本発明の樹脂組成物は、酸素に起因する重合阻害を防止するために、ベヘン酸やベヘン酸アミドのような高級脂肪酸誘導体を添加して、塗布後の乾燥の過程で本発明の樹脂組成物の表面に偏在させてもよい。 [Higher fatty acid derivative]
In order to prevent polymerization inhibition caused by oxygen, the resin composition of the present invention is added with a higher fatty acid derivative such as behenic acid or behenic acid amide, and the resin composition of the present invention is dried in the process of drying after application. It may be unevenly distributed on the surface of.
本発明の樹脂組成物は、熱重合開始剤を含んでもよく、特に熱ラジカル重合開始剤を含んでもよい。熱ラジカル重合開始剤は、熱のエネルギーによってラジカルを発生し、重合性を有する化合物の重合反応を開始又は促進させる化合物である。熱ラジカル重合開始剤を添加することによって樹脂及び重合性化合物の重合反応を進行させることもできるので、より耐溶剤性を向上できる。また、上述した光重合開始剤も熱により重合を開始する機能を有する場合があり、熱重合開始剤として添加することができる場合がある。 [Thermal polymerization initiator]
The resin composition of the present invention may contain a thermal polymerization initiator, and may particularly contain a thermal radical polymerization initiator. The thermal radical polymerization initiator is a compound that generates radicals by heat energy to initiate or accelerate the polymerization reaction of a polymerizable compound. Since the polymerization reaction of the resin and the polymerizable compound can be promoted by adding the thermal radical polymerization initiator, the solvent resistance can be further improved. Further, the above-mentioned photopolymerization initiator may also have a function of initiating polymerization by heat, and may be added as a thermal polymerization initiator.
本発明の樹脂組成物は、無機粒子を含んでもよい。無機粒子として、具体的には、炭酸カルシウム、リン酸カルシウム、シリカ、カオリン、タルク、二酸化チタン、アルミナ、硫酸バリウム、フッ化カルシウム、フッ化リチウム、ゼオライト、硫化モリブデン、ガラス等を含むことができる。 [Inorganic particles]
The resin composition of the present invention may contain inorganic particles. Specific examples of the inorganic particles include calcium carbonate, calcium phosphate, silica, kaolin, talc, titanium dioxide, alumina, barium sulfate, calcium fluoride, lithium fluoride, zeolite, molybdenum sulfide, and glass.
微粒子の上記平均粒子径は、一次粒子径であり、また体積平均粒子径である。体積平均粒子径は、Nanotrac WAVE II EX-150(日機装社製)による動的光散乱法で測定できる。
上記測定が困難である場合は、遠心沈降光透過法、X線透過法、レーザー回折・散乱法で測定することもできる。 The average particle size of the inorganic particles is preferably 0.01 to 2.0 μm, more preferably 0.02 to 1.5 μm, further preferably 0.03 to 1.0 μm, and 0.04 to 0.5 μm. Especially preferable.
The average particle size of the fine particles is the primary particle size and the volume average particle size. The volume average particle size can be measured by a dynamic light scattering method using Nanotrac WAVE II EX-150 (manufactured by Nikkiso Co., Ltd.).
If the above measurement is difficult, it can be measured by a centrifugal sedimentation light transmission method, an X-ray transmission method, or a laser diffraction / scattering method.
本発明の組成物は、紫外線吸収剤を含んでいてもよい。紫外線吸収剤としては、サリシレート系、ベンゾフェノン系、ベンゾトリアゾール系、置換アクリロニトリル系、トリアジン系などの紫外線吸収剤を使用することができる。
サリシレート系紫外線吸収剤の例としては、フェニルサリシレート、p-オクチルフェニルサリシレート、p-t-ブチルフェニルサリシレートなどが挙げられ、ベンゾフェノン系紫外線吸収剤の例としては、2,2’-ジヒドロキシ-4-メトキシベンゾフェノン、2,2’-ジヒドロキシ-4,4’-ジメトキシベンゾフェノン、2,2’,4,4’-テトラヒドロキシベンゾフェノン、2-ヒドロキシ-4-メトキシベンゾフェノン、2,4-ジヒドロキシベンゾフェノン、2-ヒドロキシ-4-オクトキシベンゾフェノンなどが挙げられる。また、ベンゾトリアゾール系紫外線吸収剤の例としては、2-(2’-ヒドロキシ-3’,5’-ジ-tert-ブチルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’-tert-ブチル-5’-メチルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’-tert-アミル-5’-イソブチルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’-イソブチル-5’-メチルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’-イソブチル-5’-プロピルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’,5’-ジ-tert-ブチルフェニル)ベンゾトリアゾール、2-(2’-ヒドロキシ-5’-メチルフェニル)ベンゾトリアゾール、2-[2’-ヒドロキシ-5’-(1,1,3,3-テトラメチル)フェニル]ベンゾトリアゾールなどが挙げられる。 [UV absorber]
The composition of the present invention may contain an ultraviolet absorber. As the ultraviolet absorber, an ultraviolet absorber such as salicylate-based, benzophenone-based, benzotriazole-based, substituted acrylonitrile-based, or triazine-based can be used.
Examples of salicylate-based UV absorbers include phenyl salicylate, p-octylphenyl salicylate, pt-butylphenyl salicylate and the like, and examples of benzophenone-based UV absorbers include 2,2'-dihydroxy-4-. Methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2', 4,4'-tetrahydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2,4-dihydroxybenzophenone, 2- Hydroxyl-4-octoxybenzophenone and the like can be mentioned. Examples of benzotriazole-based ultraviolet absorbers include 2- (2'-hydroxy-3', 5'-di-tert-butylphenyl) -5-chlorobenzotriazole and 2- (2'-hydroxy-3). '-Tert-Butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3'-tert-amyl-5'-isobutylphenyl) -5-chlorobenzotriazole, 2-( 2'-Hydroxy-3'-isobutyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3'-isobutyl-5'-propylphenyl) -5-chlorobenzotriazole, 2 -(2'-Hydroxy-3', 5'-di-tert-butylphenyl) benzotriazole, 2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- [2'-hydroxy-5' -(1,1,3,3-tetramethyl) phenyl] benzotriazole and the like can be mentioned.
本発明の組成物は、紫外線吸収剤を含んでも含まなくてもよいが、含む場合、紫外線吸収剤の含有量は、本発明の組成物の全固形分質量に対して、0.001質量%以上1質量%以下であることが好ましく、0.01質量%以上0.1質量%以下であることがより好ましい。 In the present invention, the above-mentioned various ultraviolet absorbers may be used alone or in combination of two or more.
The composition of the present invention may or may not contain an ultraviolet absorber, but when it is contained, the content of the ultraviolet absorber is 0.001% by mass with respect to the total solid content mass of the composition of the present invention. It is preferably 1% by mass or less, and more preferably 0.01% by mass or more and 0.1% by mass or less.
本実施形態の樹脂組成物は、有機チタン化合物を含有してもよい。樹脂組成物が有機チタン化合物を含有することにより、低温で硬化した場合であっても耐薬品性に優れる樹脂層を形成できる。 [Organic titanium compound]
The resin composition of the present embodiment may contain an organic titanium compound. Since the resin composition contains an organic titanium compound, a resin layer having excellent chemical resistance can be formed even when cured at a low temperature.
有機チタン化合物の具体例を、以下のI)~VII)に示す:
I)チタンキレート化合物:中でも、樹脂組成物の保存安定性がよく、良好な硬化パターンが得られることから、アルコキシ基を2個以上有するチタンキレート化合物がより好ましい。具体的な例は、チタニウムビス(トリエタノールアミン)ジイソプロポキサイド、チタニウムジ(n-ブトキサイド)ビス(2,4-ペンタンジオネート、チタニウムジイソプロポキサイドビス(2,4-ペンタンジオネート)、チタニウムジイソプロポキサイドビス(テトラメチルヘプタンジオネート)、チタニウムジイソプロポキサイドビス(エチルアセトアセテート)等である。
II)テトラアルコキシチタン化合物:例えば、チタニウムテトラ(n-ブトキサイド)、チタニウムテトラエトキサイド、チタニウムテトラ(2-エチルヘキソキサイド)、チタニウムテトライソブトキサイド、チタニウムテトライソプロポキサイド、チタニウムテトラメトキサイド、チタニウムテトラメトキシプロポキサイド、チタニウムテトラメチルフェノキサイド、チタニウムテトラ(n-ノニロキサイド)、チタニウムテトラ(n-プロポキサイド)、チタニウムテトラステアリロキサイド、チタニウムテトラキス[ビス{2,2-(アリロキシメチル)ブトキサイド}]等である。
III)チタノセン化合物:例えば、ペンタメチルシクロペンタジエニルチタニウムトリメトキサイド、ビス(η5-2,4-シクロペンタジエン-1-イル)ビス(2,6-ジフルオロフェニル)チタニウム、ビス(η5-2,4-シクロペンタジエン-1-イル)ビス(2,6-ジフルオロ-3-(1H-ピロール-1-イル)フェニル)チタニウム等である。
IV)モノアルコキシチタン化合物:例えば、チタニウムトリス(ジオクチルホスフェート)イソプロポキサイド、チタニウムトリス(ドデシルベンゼンスルホネート)イソプロポキサイド等である。
V)チタニウムオキサイド化合物:例えば、チタニウムオキサイドビス(ペンタンジオネート)、チタニウムオキサイドビス(テトラメチルヘプタンジオネート)、フタロシアニンチタニウムオキサイド等である。
VI)チタニウムテトラアセチルアセトネート化合物:例えば、チタニウムテトラアセチルアセトネート等である。
VII)チタネートカップリング剤:例えば、イソプロピルトリドデシルベンゼンスルホニルチタネート等である。 Examples of the organic titanium compound that can be used include those in which an organic group is bonded to a titanium atom via a covalent bond or an ionic bond.
Specific examples of the organic titanium compound are shown in I) to VII) below:
I) Titanium chelate compound: Among them, a titanium chelate compound having two or more alkoxy groups is more preferable because the resin composition has good storage stability and a good curing pattern can be obtained. Specific examples are titanium bis (triethanolamine) diisopropoxiside, titanium di (n-butoxide) bis (2,4-pentanegenate, titanium diisopropoxiside bis (2,4-pentanegeonate)). , Titanium diisopropoxyside bis (tetramethylheptandionate), titanium diisopropoxyside bis (ethylacetacetate) and the like.
II) Titanium Alkoxy Titanium Compounds: For example, Titanium Tetra (n-Butoxide), Titanium Tetraethoxide, Titanium Tetra (2-ethylhexoxyside), Titanium Tetraisobutoxide, Titanium Tetraisopropoxyside, Titanium Tetramethoxide , Titanium Tetramethoxypropoxyside, Titanium Tetramethylphenoxide, Titanium Tetra (n-Noniloxide), Titanium Tetra (n-Propoxide), Titanium Tetrasteeryloxyside, Titanium Tetrakiss [Bis {2,2- (Aryloxymethyl) Butokiside}] etc.
III) Titanocene compounds: for example, pentamethylcyclopentadienyl titanium trimethoxide, bis (η5-2,4-cyclopentadiene-1-yl) bis (2,6-difluorophenyl) titanium, bis (η5-2, 2). 4-Cyclopentadiene-1-yl) bis (2,6-difluoro-3- (1H-pyrrole-1-yl) phenyl) titanium and the like.
IV) Monoalkoxytitanium compound: For example, titaniumtris (dioctylphosphate) isopropoxyside, titaniumtris (dodecylbenzenesulfonate) isopropoxyside and the like.
V) Titanium oxide compound: For example, titanium oxide bis (pentanionate), titanium oxide bis (tetramethylheptandionate), phthalocyanine titanium oxide and the like.
VI) Titanium tetraacetylacetonate compound: For example, titanium tetraacetylacetonate and the like.
VII) Titanate Coupling Agent: For example, isopropyltridodecylbenzenesulfonyl titanate and the like.
本発明の組成物は、酸化防止剤を含んでいてもよい。添加剤として酸化防止剤を含有することで、硬化後の膜の伸度特性や、金属材料との密着性を向上させることができる。酸化防止剤としては、フェノール化合物、亜リン酸エステル化合物、チオエーテル化合物などが挙げられる。フェノール化合物としては、フェノール系酸化防止剤として知られる任意のフェノール化合物を使用することができる。好ましいフェノール化合物としては、ヒンダードフェノール化合物が挙げられる。フェノール性ヒドロキシ基に隣接する部位(オルト位)に置換基を有する化合物が好ましい。上述の置換基としては炭素数1~22の置換又は無置換のアルキル基が好ましい。また、酸化防止剤は、同一分子内にフェノール基と亜リン酸エステル基を有する化合物も好ましい。また、酸化防止剤は、リン系酸化防止剤も好適に使用することができる。リン系酸化防止剤としてはトリス[2-[[2,4,8,10-テトラキス(1,1-ジメチルエチル)ジベンゾ[d,f][1,3,2]ジオキサホスフェピン-6-イル]オキシ]エチル]アミン、トリス[2-[(4,6,9,11-テトラ-tert-ブチルジベンゾ[d,f][1,3,2]ジオキサホスフェピン-2-イル)オキシ]エチル]アミン、亜リン酸エチルビス(2,4-ジ-tert-ブチル-6-メチルフェニル)などが挙げられる。酸化防止剤の市販品としては、例えば、アデカスタブ AO-20、アデカスタブ AO-30、アデカスタブ AO-40、アデカスタブ AO-50、アデカスタブ AO-50F、アデカスタブ AO-60、アデカスタブ AO-60G、アデカスタブ AO-80、アデカスタブ AO-330(以上、(株)ADEKA製)などが挙げられる。また、酸化防止剤は、特許第6268967号公報の段落番号0023~0048に記載された化合物を使用することもでき、この内容は本明細書に組み込まれる。また、本発明の組成物は、必要に応じて、潜在酸化防止剤を含有してもよい。潜在酸化防止剤としては、酸化防止剤として機能する部位が保護基で保護された化合物であって、100~250℃で加熱するか、又は酸/塩基触媒存在下で80~200℃で加熱することにより保護基が脱離して酸化防止剤として機能する化合物が挙げられる。潜在酸化防止剤としては、国際公開第2014/021023号、国際公開第2017/030005号、特開2017-008219号公報に記載された化合物が挙げられ、この内容は本明細書に組み込まれる。潜在酸化防止剤の市販品としては、アデカアークルズGPA-5001((株)ADEKA製)等が挙げられる。
好ましい酸化防止剤の例としては、2,2-チオビス(4-メチル-6-t-ブチルフェノール)、2,6-ジ-t-ブチルフェノールおよび式(3)で表される化合物が挙げられる。 〔Antioxidant〕
The composition of the present invention may contain an antioxidant. By containing an antioxidant as an additive, it is possible to improve the elongation characteristics of the film after curing and the adhesion with a metal material. Examples of the antioxidant include phenol compounds, phosphite ester compounds, thioether compounds and the like. As the phenol compound, any phenol compound known as a phenolic antioxidant can be used. Preferred phenolic compounds include hindered phenolic compounds. A compound having a substituent at a site (ortho position) adjacent to the phenolic hydroxy group is preferable. As the above-mentioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferable. Further, as the antioxidant, a compound having a phenol group and a phosphite ester group in the same molecule is also preferable. Further, as the antioxidant, a phosphorus-based antioxidant can also be preferably used. As a phosphorus-based antioxidant, Tris [2-[[2,4,8,10-tetrakis (1,1-dimethylethyl) dibenzo [d, f] [1,3,2] dioxaphosphepine-6] -Il] Oxy] Ethyl] amine, Tris [2-[(4,6,9,11-tetra-tert-butyldibenzo [d, f] [1,3,2] dioxaphosphepin-2-yl] ) Oxy] ethyl] amine, ethylbis phosphite (2,4-di-tert-butyl-6-methylphenyl) and the like. Commercially available products of antioxidants include, for example, Adekastab AO-20, Adekastab AO-30, Adekastab AO-40, Adekastab AO-50, Adekastab AO-50F, Adekastab AO-60, Adekastab AO-60G, and Adekastab AO-80. , ADEKA STAB AO-330 (above, manufactured by ADEKA Corporation) and the like. Further, as the antioxidant, the compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967 can also be used, and the contents thereof are incorporated in the present specification. In addition, the composition of the present invention may contain a latent antioxidant, if necessary. The latent antioxidant is a compound in which the site that functions as an antioxidant is protected by a protecting group, and is heated at 100 to 250 ° C. or at 80 to 200 ° C. in the presence of an acid / base catalyst. This includes compounds in which the protecting group is desorbed and functions as an antioxidant. Examples of the latent antioxidant include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219, the contents of which are incorporated in the present specification. Examples of commercially available products of latent antioxidants include ADEKA ARKULS GPA-5001 (manufactured by ADEKA Corporation).
Examples of preferred antioxidants include 2,2-thiobis (4-methyl-6-t-butylphenol), 2,6-di-t-butylphenol and compounds of formula (3).
本実施形態の樹脂組成物は、必要に応じて凝集防止剤を含有してもよい。凝集防止剤としては、ポリアクリル酸ナトリウム等が挙げられる。 [Anti-coagulation agent]
The resin composition of the present embodiment may contain an anti-aggregation agent, if necessary. Examples of the anti-aggregation agent include sodium polyacrylate and the like.
本発明の組成物は、凝集防止剤を含んでも含まなくてもよいが、含む場合、凝集防止剤の含有量は、本発明の組成物の全固形分質量に対して、0.01質量%以上10質量%以下であることが好ましく、0.02質量%以上5質量%以下であることがより好ましい。 In the present invention, one type of anti-aggregation agent may be used alone, or two or more types may be used in combination.
The composition of the present invention may or may not contain an anti-aggregation agent, but when it is contained, the content of the anti-aggregation agent is 0.01% by mass with respect to the total solid content mass of the composition of the present invention. It is preferably 10% by mass or less, and more preferably 0.02% by mass or more and 5% by mass or less.
本実施形態の樹脂組成物は、必要に応じてフェノール系化合物を含有してもよい。フェノール系化合物としては、Bis-Z、BisP-EZ、TekP-4HBPA、TrisP-HAP、TrisP-PA、BisOCHP-Z、BisP-MZ、BisP-PZ、BisP-IPZ、BisOCP-IPZ、BisP-CP、BisRS-2P、BisRS-3P、BisP-OCHP、メチレントリス-FR-CR、BisRS-26X(以上、商品名、本州化学工業(株)製)、BIP-PC、BIR-PC、BIR-PTBP、BIR-BIPC-F(以上、商品名、旭有機材工業(株)製)等が挙げられる。 [Phenolic compounds]
The resin composition of the present embodiment may contain a phenolic compound, if necessary. Examples of the phenolic compound include Bis-Z, BisP-EZ, TekP-4HBPA, TrisP-HAP, TrisP-PA, BisOCHP-Z, BisP-MZ, BisP-PZ, BisP-IPZ, BisOCP-IPZ, and BisP-CP. BisRS-2P, BisRS-3P, BisP-OCHP, Methylenetris-FR-CR, BisRS-26X (trade name, manufactured by Honshu Chemical Industry Co., Ltd.), BIP-PC, BIR-PC, BIR-PTBP, BIR -BIPC-F (above, trade name, manufactured by Asahi Organic Materials Industry Co., Ltd.) and the like can be mentioned.
本発明の組成物は、フェノール系化合物を含んでも含まなくてもよいが、含む場合、フェノール系化合物の含有量は、本発明の組成物の全固形分質量に対して、0.01質量%以上30質量%以下であることが好ましく、0.02質量%以上20質量%以下であることがより好ましい。 In the present invention, one type of phenolic compound may be used alone, or two or more types may be used in combination.
The composition of the present invention may or may not contain a phenolic compound, but when it is contained, the content of the phenolic compound is 0.01% by mass with respect to the total solid content mass of the composition of the present invention. It is preferably 30% by mass or more, and more preferably 0.02% by mass or more and 20% by mass or less.
他の高分子化合物としては、シロキサン樹脂、(メタ)アクリル酸を共重合した(メタ)アクリルポリマー、ノボラック樹脂、レゾール樹脂、ポリヒドロキシスチレン樹脂およびそれらの共重合体などが挙げられる。他の高分子化合物はメチロール基、アルコキシメチル基、エポキシ基などの架橋基が導入された変性体であってもよい。 [Other polymer compounds]
Examples of other polymer compounds include siloxane resins, (meth) acrylic polymers copolymerized with (meth) acrylic acids, novolak resins, resole resins, polyhydroxystyrene resins and copolymers thereof. The other polymer compound may be a modified product into which a cross-linking group such as a methylol group, an alkoxymethyl group, or an epoxy group is introduced.
本発明の組成物は、他の高分子化合物を含んでも含まなくてもよいが、含む場合、他の高分子化合物の含有量は、本発明の組成物の全固形分質量に対して、0.01質量%以上30質量%以下であることが好ましく、0.02質量%以上20質量%以下であることがより好ましい。 In the present invention, one type of other polymer compound may be used alone, or two or more types may be used in combination.
The composition of the present invention may or may not contain other polymer compounds, but when it is contained, the content of the other polymer compounds is 0 with respect to the total solid content mass of the composition of the present invention. It is preferably 0.01% by mass or more and 30% by mass or less, and more preferably 0.02% by mass or more and 20% by mass or less.
本発明の樹脂組成物の粘度は、樹脂組成物の固形分濃度により調整できる。塗布膜厚の観点から、1,000mm2/s~12,000mm2/sが好ましく、2,000mm2/s~10,000mm2/sがより好ましく、2,500mm2/s~8,000mm2/sが更に好ましい。上記範囲であれば、均一性の高い塗布膜を得ることが容易になる。1,000mm2/s以上であれば、例えば再配線用絶縁膜として必要とされる膜厚で塗布することが容易であり、12,000mm2/s以下であれば、塗布面状に優れた塗膜が得られる。 <Characteristics of resin composition>
The viscosity of the resin composition of the present invention can be adjusted by adjusting the solid content concentration of the resin composition. From the viewpoint of the coating film thickness, 1,000 mm 2 / s to 12,000 mm 2 / s is preferable, 2,000 mm 2 / s to 10,000 mm 2 / s is more preferable, and 2,500 mm 2 / s to 8,000 mm. 2 / s is more preferable. Within the above range, it becomes easy to obtain a highly uniform coating film. If it is 1,000 mm 2 / s or more, it is easy to apply it with a film thickness required as an insulating film for rewiring, for example, and if it is 12,000 mm 2 / s or less, the coating surface is excellent. A coating film is obtained.
本発明の樹脂組成物の含水率は、2.0質量%未満であることが好ましく、1.5質量%未満であることがより好ましく、1.0質量%未満であることが更に好ましい。2.0%未満であれば、樹脂組成物の保存安定性が向上する。
水分の含有量を維持する方法としては、保管条件における湿度の調整、保管時の収容容器の空隙率低減などが挙げられる。 <Restrictions on substances contained in the resin composition>
The water content of the resin composition of the present invention is preferably less than 2.0% by mass, more preferably less than 1.5% by mass, and even more preferably less than 1.0% by mass. If it is less than 2.0%, the storage stability of the resin composition is improved.
Examples of the method for maintaining the water content include adjusting the humidity under storage conditions and reducing the porosity of the storage container during storage.
ハロゲン原子の含有量を調節する方法としては、イオン交換処理などが好ましく挙げられる。 Considering the use as a semiconductor material, the resin composition of the present invention preferably has a halogen atom content of less than 500 mass ppm, more preferably less than 300 mass ppm, and less than 200 mass ppm from the viewpoint of wiring corrosiveness. Is more preferable. Among them, those existing in the state of halogen ions are preferably less than 5 mass ppm, more preferably less than 1 mass ppm, and even more preferably less than 0.5 mass ppm. Examples of the halogen atom include a chlorine atom and a bromine atom. It is preferable that the total amount of chlorine atom and bromine atom, or chlorine ion and bromine ion is in the above range, respectively.
As a method for adjusting the content of halogen atoms, ion exchange treatment and the like are preferably mentioned.
本発明の樹脂組成物を硬化することにより、この樹脂組成物の硬化物を得ることができる。
本発明の硬化物は、本発明の樹脂組成物を硬化してなる硬化物である。
樹脂組成物の硬化は加熱によるものであることが好ましく、加熱温度が120℃~400℃の範囲内であることがより好ましく、140℃~380℃の範囲内にあることが更に好ましく、170℃~350℃の範囲内にあることが特に好ましい。樹脂組成物の硬化物の形態は、特に限定されず、フィルム状、棒状、球状、ペレット状など、用途に合わせて選択することができる。本発明において、この硬化物は、フィルム状であることが好ましい。また、樹脂組成物のパターン加工によって、壁面への保護膜の形成、導通のためのビアホール形成、インピーダンスや静電容量あるいは内部応力の調整、放熱機能付与など、用途にあわせて、この硬化物の形状を選択することもできる。この硬化物(硬化物からなる膜)の膜厚は、0.5μm以上150μm以下であることが好ましい。
本発明の樹脂組成物を硬化した際の収縮率は、50%以下が好ましく、45%以下がより好ましく、40%以下が更に好ましい。ここで、収縮率は、樹脂組成物の硬化前後の体積変化の百分率を指し、下記の式より算出することができる。
収縮率[%]=100-(硬化後の体積÷硬化前の体積)×100 <Cured product of resin composition>
By curing the resin composition of the present invention, a cured product of this resin composition can be obtained.
The cured product of the present invention is a cured product obtained by curing the resin composition of the present invention.
The curing of the resin composition is preferably by heating, more preferably the heating temperature is in the range of 120 ° C to 400 ° C, further preferably in the range of 140 ° C to 380 ° C, and 170 ° C. It is particularly preferable that the temperature is in the range of about 350 ° C. The form of the cured product of the resin composition is not particularly limited, and can be selected according to the intended use, such as a film shape, a rod shape, a spherical shape, and a pellet shape. In the present invention, the cured product is preferably in the form of a film. In addition, by pattern processing of the resin composition, this cured product can be used for forming a protective film on the wall surface, forming via holes for conduction, adjusting impedance, capacitance or internal stress, and imparting a heat dissipation function. You can also choose the shape. The film thickness of this cured product (film made of the cured product) is preferably 0.5 μm or more and 150 μm or less.
The shrinkage rate of the resin composition of the present invention when cured is preferably 50% or less, more preferably 45% or less, still more preferably 40% or less. Here, the shrinkage ratio refers to the percentage of the volume change of the resin composition before and after curing, and can be calculated from the following formula.
Shrinkage rate [%] = 100- (volume after curing ÷ volume before curing) x 100
本発明の樹脂組成物の硬化物のイミド化反応率は、70%以上が好ましく、80%以上がより好ましく、90%以上が更に好ましい。70%以上であれば、機械特性に優れた硬化物となる場合がある。
本発明の樹脂組成物の硬化物の破断伸びは、30%以上が好ましく、40%以上がより好ましく、50%以上が更に好ましい。
本発明の樹脂組成物の硬化物のガラス転移温度(Tg)は、180℃以上であることが好ましく、210℃以上であることがより好ましく、230℃以上であることがさらに好ましい。 <Characteristics of cured product of resin composition>
The imidization reaction rate of the cured product of the resin composition of the present invention is preferably 70% or more, more preferably 80% or more, still more preferably 90% or more. If it is 70% or more, it may be a cured product having excellent mechanical properties.
The elongation at break of the cured product of the resin composition of the present invention is preferably 30% or more, more preferably 40% or more, still more preferably 50% or more.
The glass transition temperature (Tg) of the cured product of the resin composition of the present invention is preferably 180 ° C. or higher, more preferably 210 ° C. or higher, and even more preferably 230 ° C. or higher.
本発明の樹脂組成物は、上記各成分を混合して調製することができる。混合方法は特に限定はなく、従来公知の方法で行うことができる。
混合は撹拌羽による混合、ボールミルによる混合、タンク自身を回転させる混合などを採用することができる。
混合中の温度は10~30℃が好ましく、15~25℃がより好ましい。 <Preparation of resin composition>
The resin composition of the present invention can be prepared by mixing each of the above components. The mixing method is not particularly limited, and a conventionally known method can be used.
For mixing, mixing with a stirring blade, mixing with a ball mill, mixing by rotating the tank itself, or the like can be adopted.
The temperature during mixing is preferably 10 to 30 ° C, more preferably 15 to 25 ° C.
フィルターを用いたろ過の他、吸着材を用いた不純物の除去処理を行ってもよい。フィルターろ過と吸着材を用いた不純物除去処理とを組み合わせてもよい。吸着材としては、公知の吸着材を用いることができる。例えば、シリカゲル、ゼオライトなどの無機系吸着材、活性炭などの有機系吸着材が挙げられる。
更にフィルターを用いたろ過後、ボトルに充填した樹脂組成物を減圧下に置き、脱気する工程を施しても良い。 Further, it is preferable to perform filtration using a filter for the purpose of removing foreign substances such as dust and fine particles in the resin composition of the present invention. The filter hole diameter may be, for example, 5 μm or less, preferably 1 μm or less, more preferably 0.5 μm or less, still more preferably 0.1 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene or nylon. When the material of the filter is polyethylene, it is more preferable to use HDPE (high density polyethylene). The filter may be one that has been pre-cleaned with an organic solvent. In the filter filtration step, a plurality of types of filters may be connected in series or in parallel for use. When using a plurality of types of filters, filters having different pore diameters or materials may be used in combination. Examples of the connection mode include a mode in which an HDPE filter having a hole diameter of 1 μm is connected in series as the first stage and an HDPE filter having a hole diameter of 0.2 μm is connected in series as the second stage. In addition, various materials may be filtered a plurality of times. When filtering multiple times, circulation filtration may be used. Moreover, you may pressurize and perform filtration. When pressurizing and filtering, the pressure to be pressurized is, for example, 0.01 MPa or more and 1.0 MPa or less, preferably 0.03 MPa or more and 0.9 MPa or less, and more preferably 0.05 MPa or more and 0.7 MPa or less. , 0.05 MPa or more and 0.5 MPa or less is more preferable.
In addition to filtration using a filter, impurities may be removed using an adsorbent. Filter filtration and impurity removal treatment using an adsorbent may be combined. As the adsorbent, a known adsorbent can be used. Examples thereof include inorganic adsorbents such as silica gel and zeolite, and organic adsorbents such as activated carbon.
Further, after filtration using a filter, the resin composition filled in the bottle may be placed under reduced pressure to perform a step of degassing.
本発明の硬化物の製造方法は、樹脂組成物を基材上に適用して膜を形成する膜形成工程を含むことが好ましい。
また、本発明の硬化物の製造方法は、上記膜形成工程、膜形成工程により形成された膜を選択的に露光する露光工程、及び、露光工程により露光された膜を現像液を用いて現像してパターンを形成する現像工程を含むことがより好ましい。
本発明の硬化物の製造方法は、上記膜形成工程、上記露光工程、上記現像工程、並びに、現像工程により得られたパターンを加熱する加熱工程及び現像工程により得られたパターンを露光する現像後露光工程の少なくとも一方を含むことが特に好ましい。
また、本発明の製造方法は、上記膜形成工程、及び、上記膜を加熱する工程を含むことも好ましい。
以下、各工程の詳細について説明する。 (Manufacturing method of cured product)
The method for producing a cured product of the present invention preferably includes a film forming step of applying a resin composition onto a substrate to form a film.
Further, in the method for producing a cured product of the present invention, the film forming step, the exposure step of selectively exposing the film formed by the film forming step, and the film exposed by the exposure step are developed using a developing solution. It is more preferable to include a developing step of forming a pattern.
The method for producing a cured product of the present invention includes the film forming step, the exposure step, the developing step, and the heating step for heating the pattern obtained by the developing step and the post-development for exposing the pattern obtained by the developing step. It is particularly preferred to include at least one of the exposure steps.
Moreover, it is also preferable that the production method of the present invention includes the above-mentioned film forming step and the above-mentioned step of heating the film.
Hereinafter, details of each step will be described.
本発明の樹脂組成物は、基材上に適用して膜を形成する膜形成工程に用いることができる。
本発明の硬化物の製造方法は、樹脂組成物を基材上に適用して膜を形成する膜形成工程を含むことが好ましい。 <Membrane formation process>
The resin composition of the present invention can be applied to a substrate to form a film and can be used in a film forming step.
The method for producing a cured product of the present invention preferably includes a film forming step of applying a resin composition onto a substrate to form a film.
基材の種類は、用途に応じて適宜定めることができるが、シリコン、窒化シリコン、ポリシリコン、酸化シリコン、アモルファスシリコンなどの半導体作製基材、石英、ガラス、光学フィルム、セラミック材料、蒸着膜、磁性膜、反射膜、Ni、Cu、Cr、Feなどの金属基材(例えば、金属から形成された基材、及び、金属層が例えばめっきや蒸着等により形成された基材のいずれであってもよい)、紙、SOG(Spin On Glass)、TFT(薄膜トランジスタ)アレイ基材、モールド基材、プラズマディスプレイパネル(PDP)の電極板などが挙げられ、特に制約されない。本発明では、特に、半導体作製基材が好ましく、シリコン基材、Cu基材およびモールド基材がより好ましい。
また、これらの基材にはヘキサメチルジシラザン(HMDS)等による密着層や酸化層などの層が表面に設けられていてもよい。
また、基材の形状は特に限定されず、円形状であってもよく、矩形状であってもよい。
基材のサイズとしては、円形状であれば、例えば直径が100~450mmであり、好ましくは200~450mmである。矩形状であれば、例えば短辺の長さが100~1000mmであり、好ましくは200~700mmである。
また、基材としては、例えば板状、好ましくはパネル状の基材(基板)が用いられる。 〔Base material〕
The type of the base material can be appropriately determined depending on the application, but semiconductor-made base materials such as silicon, silicon nitride, polysilicon, silicon oxide, and amorphous silicon, quartz, glass, optical film, ceramic material, vapor-deposited film, etc. Either a magnetic film, a reflective film, a metal substrate such as Ni, Cu, Cr, or Fe (for example, a substrate formed of metal, or a substrate in which a metal layer is formed by, for example, plating or vapor deposition, etc.). (May be good), paper, SOG (Spin On Glass), TFT (thin film) array base material, mold base material, electrode plate of plasma display panel (PDP), and the like, and are not particularly limited. In the present invention, a semiconductor-made base material is particularly preferable, and a silicon base material, a Cu base material, and a molded base material are more preferable.
Further, these substrates may be provided with a layer such as an adhesion layer or an oxide layer made of hexamethyldisilazane (HMDS) or the like on the surface thereof.
Further, the shape of the base material is not particularly limited, and may be circular or rectangular.
The size of the base material is, for example, 100 to 450 mm in diameter, preferably 200 to 450 mm in a circular shape. If it is rectangular, for example, the length of the short side is 100 to 1000 mm, preferably 200 to 700 mm.
Further, as the base material, for example, a plate-shaped base material (substrate), preferably a panel-shaped base material (board) is used.
また、あらかじめ仮支持体上に上記付与方法によって付与して形成した塗膜を、基材上に転写する方法を適用することもできる。
転写方法に関しては特開2006-023696号公報の段落0023、0036~0051や、特開2006-047592号公報の段落0096~0108に記載の作製方法を本発明においても好適に用いることができる。
また、基材の端部において余分な膜の除去を行なう工程を行なってもよい。このような工程の例には、エッジビードリンス(EBR)、バックリンスなどが挙げられる。
また樹脂組成物を基材に塗布する前に基材を種々の溶剤を塗布し、基材の濡れ性を向上させた後に樹脂組成物を塗布するプリウェット工程を採用しても良い。 Specifically, the means to be applied include a dip coating method, an air knife coating method, a curtain coating method, a wire bar coating method, a gravure coating method, an extrusion coating method, a spray coating method, a spin coating method, and a slit coating method. An inkjet method and the like are exemplified. From the viewpoint of film thickness uniformity, a spin coating method, a slit coating method, a spray coating method, or an inkjet method is more preferable, and spin coating is performed from the viewpoint of film thickness uniformity and productivity. The method and the slit coating method are preferable. By adjusting the solid content concentration and the coating conditions of the resin composition according to the method, a film having a desired thickness can be obtained. Further, the coating method can be appropriately selected depending on the shape of the substrate. For a circular substrate such as a wafer, a spin coating method, a spray coating method, an inkjet method, etc. are preferable, and for a rectangular substrate, a slit coating method or a spray coating method is preferable. The method, the inkjet method and the like are preferable. In the case of the spin coating method, for example, it can be applied at a rotation speed of 500 to 3,500 rpm for about 10 seconds to 3 minutes.
Further, it is also possible to apply a method of transferring a coating film previously applied onto a temporary support by the above-mentioned application method onto a substrate.
Regarding the transfer method, the production method described in paragraphs 0023 and 0036 to 0051 of JP-A-2006-023696 and paragraphs 0090 to 0108 of JP-A-2006-047592 can be suitably used in the present invention.
Further, a step of removing the excess film at the end of the base material may be performed. Examples of such a process include edge bead rinse (EBR), back rinse and the like.
Further, a pre-wet step of applying various solvents to the base material before applying the resin composition to the base material to improve the wettability of the base material and then applying the resin composition may be adopted.
上記膜は、膜形成工程(層形成工程)の後に、溶剤を除去するために形成された膜(層)を乾燥する工程(乾燥工程)に供されてもよい。
すなわち、本発明の硬化物の製造方法は、膜形成工程により形成された膜を乾燥する乾燥工程を含んでもよい。
また、上記乾燥工程は膜形成工程の後、露光工程の前に行われることが好ましい。
乾燥工程における膜の乾燥温度は50~150℃であることが好ましく、70℃~130℃がより好ましく、90℃~110℃が更に好ましい。また、減圧により乾燥を行っても良い。乾燥時間としては、30秒~20分が例示され、1分~10分が好ましく、2分~7分がより好ましい。 <Drying process>
The film may be subjected to a step (drying step) of drying the film (layer) formed to remove the solvent after the film forming step (layer forming step).
That is, the method for producing a cured product of the present invention may include a drying step of drying the film formed by the film forming step.
Further, it is preferable that the drying step is performed after the film forming step and before the exposure step.
The drying temperature of the film in the drying step is preferably 50 to 150 ° C, more preferably 70 ° C to 130 ° C, still more preferably 90 ° C to 110 ° C. Further, drying may be performed by reducing the pressure. The drying time is exemplified by 30 seconds to 20 minutes, preferably 1 minute to 10 minutes, more preferably 2 minutes to 7 minutes.
上記膜は、膜を選択的に露光する露光工程に供されてもよい。
すなわち、本発明の硬化物の製造方法は、膜形成工程により形成された膜を選択的に露光する露光工程を含んでもよい。
選択的に露光するとは、膜の一部を露光することを意味している。また、選択的に露光することにより、膜には露光された領域(露光部)と露光されていない領域(非露光部)が形成される。
露光量は、本発明の樹脂組成物を硬化できる限り特に定めるものではないが、例えば、波長365nmでの露光エネルギー換算で50~10,000mJ/cm2が好ましく、200~8,000mJ/cm2がより好ましい。 <Exposure process>
The film may be subjected to an exposure step of selectively exposing the film.
That is, the method for producing a cured product of the present invention may include an exposure step of selectively exposing the film formed by the film forming step.
Selective exposure means exposing a part of the film. Further, by selectively exposing the film, an exposed region (exposed portion) and an unexposed region (non-exposed portion) are formed on the film.
The exposure amount is not particularly determined as long as the resin composition of the present invention can be cured, but for example, it is preferably 50 to 10,000 mJ / cm 2 in terms of exposure energy at a wavelength of 365 nm, and 200 to 8,000 mJ / cm 2 . Is more preferable.
また、露光の方式は特に限定されず、本発明の樹脂組成物からなる膜の少なくとも一部が露光される方式であればよいが、フォトマスクを使用した露光、レーザーダイレクトイメージング法による露光等が挙げられる。 The exposure wavelengths are as follows: (1) semiconductor laser (wavelength 830 nm, 532 nm, 488 nm, 405 nm, 375 nm, 355 nm etc.), (2) metal halide lamp, (3) high-pressure mercury lamp, g-ray (wavelength). 436 nm), h-ray (wavelength 405 nm), i-line (wavelength 365 nm), broad (three wavelengths of g, h, i-line), (4) excimer laser, KrF excimer laser (wavelength 248 nm), ArF excimer laser (wavelength 193 nm). ), F2 excimer laser ( wavelength 157 nm), (5) extreme ultraviolet rays; EUV (wavelength 13.6 nm), (6) electron beam, (7) YAG laser second harmonic 532 nm, third harmonic 355 nm, etc. Can be mentioned. The resin composition of the present invention is particularly preferably exposed to a high-pressure mercury lamp, and above all, to be exposed to i-rays. As a result, particularly high exposure sensitivity can be obtained.
The exposure method is not particularly limited as long as it is a method in which at least a part of the film made of the resin composition of the present invention is exposed, but exposure using a photomask, exposure by a laser direct imaging method, or the like is possible. Can be mentioned.
上記膜は、露光後に加熱する工程(露光後加熱工程)に供されてもよい。
すなわち、本発明の硬化物の製造方法は、露光工程により露光された膜を加熱する露光後加熱工程を含んでもよい。
露光後加熱工程は、露光工程後、現像工程前に行うことができる。
露光後加熱工程における加熱温度は、50℃~140℃であることが好ましく、60℃~120℃であることがより好ましい。
露光後加熱工程における加熱時間は、30秒間~300分間が好ましく、1分間~10分間がより好ましい。
露光後加熱工程における昇温速度は、加熱開始時の温度から最高加熱温度まで1~12℃/分が好ましく、2~10℃/分がより好ましく、3~10℃/分が更に好ましい。
また、昇温速度は加熱途中で適宜変更してもよい。
露光後加熱工程における加熱手段としては、特に限定されず、公知のホットプレート、オーブン、赤外線ヒーター等を用いることができる。
また、加熱に際し、窒素、ヘリウム、アルゴンなどの不活性ガスを流す等により、低酸素濃度の雰囲気で行うことも好ましい。 <Heating process after exposure>
The film may be subjected to a step of heating after exposure (post-exposure heating step).
That is, the method for producing a cured product of the present invention may include a post-exposure heating step of heating the film exposed by the exposure step.
The post-exposure heating step can be performed after the exposure step and before the developing step.
The heating temperature in the post-exposure heating step is preferably 50 ° C to 140 ° C, more preferably 60 ° C to 120 ° C.
The heating time in the post-exposure heating step is preferably 30 seconds to 300 minutes, more preferably 1 minute to 10 minutes.
The heating rate in the post-exposure heating step is preferably 1 to 12 ° C./min, more preferably 2 to 10 ° C./min, and even more preferably 3 to 10 ° C./min from the temperature at the start of heating to the maximum heating temperature.
Further, the heating rate may be appropriately changed during heating.
The heating means in the post-exposure heating step is not particularly limited, and a known hot plate, oven, infrared heater, or the like can be used.
Further, it is also preferable to carry out the heating in an atmosphere having a low oxygen concentration by flowing an inert gas such as nitrogen, helium or argon.
露光後の上記膜は、現像液を用いて現像してパターンを形成する現像工程に供されてもよい。
すなわち、本発明の硬化物の製造方法は、露光工程により露光された膜を現像液を用いて現像してパターンを形成する現像工程を含んでもよい。 現像を行うことにより、膜の露光部及び非露光部のうち一方が除去され、パターンが形成される。
ここで、膜の非露光部が現像工程により除去される現像をネガ型現像といい、膜の露光部が現像工程により除去される現像をポジ型現像という。 <Development process>
The film after exposure may be subjected to a developing step of developing with a developing solution to form a pattern.
That is, the method for producing a cured product of the present invention may include a developing step of developing a film exposed by the exposure step with a developing solution to form a pattern. By performing the development, one of the exposed portion and the non-exposed portion of the film is removed, and a pattern is formed.
Here, the development in which the non-exposed portion of the film is removed by the developing process is referred to as negative type development, and the development in which the exposed portion of the film is removed by the developing process is referred to as positive type development.
現像工程において用いられる現像液としては、アルカリ水溶液、又は、有機溶剤を含む現像液が挙げられる。 [Developer]
Examples of the developing solution used in the developing step include an alkaline aqueous solution or a developing solution containing an organic solvent.
他の成分としては、例えば、公知の界面活性剤や公知の消泡剤等が挙げられる。 The developer may further contain other components.
Examples of other components include known surfactants and known defoaming agents.
現像液の供給方法は、所望のパターンを形成できれば特に制限は無く、膜が形成された基材を現像液に浸漬する方法、基材上に形成された膜にノズルを用いて現像液を供給するパドル現像、または、現像液を連続供給する方法がある。ノズルの種類は特に制限は無く、ストレートノズル、シャワーノズル、スプレーノズル等が挙げられる。
現像液の浸透性、非画像部の除去性、製造上の効率の観点から、現像液をストレートノズルで供給する方法、又はスプレーノズルにて連続供給する方法が好ましく、画像部への現像液の浸透性の観点からは、スプレーノズルで供給する方法がより好ましい。
また、現像液をストレートノズルにて連続供給後、基材をスピンし現像液を基材上から除去し、スピン乾燥後に再度ストレートノズルにて連続供給後、基材をスピンし現像液を基材上から除去する工程を採用してもよく、この工程を複数回繰り返しても良い。
また現像工程における現像液の供給方法としては、現像液が連続的に基材に供給され続ける工程、基材上で現像液が略静止状態で保たれる工程、基材上で現像液を超音波等で振動させる工程及びそれらを組み合わせた工程などが採用可能である。 [Method of supplying developer]
The method of supplying the developing solution is not particularly limited as long as a desired pattern can be formed, and the method of immersing the base material on which the film is formed in the developing solution and the method of supplying the developing solution to the film formed on the base material using a nozzle. There is a method of paddle development or a method of continuously supplying a developer. The type of nozzle is not particularly limited, and examples thereof include a straight nozzle, a shower nozzle, and a spray nozzle.
From the viewpoint of the permeability of the developing solution, the removability of the non-image area, and the manufacturing efficiency, the method of supplying the developing solution with a straight nozzle or the method of continuously supplying the developing solution with a spray nozzle is preferable. From the viewpoint of permeability, the method of supplying with a spray nozzle is more preferable.
Further, after the developer is continuously supplied by the straight nozzle, the base material is spun to remove the developer from the base material, and after spin drying, the developer is continuously supplied by the straight nozzle again, and then the base material is spun to use the developer as the base material. A step of removing from the top may be adopted, or this step may be repeated a plurality of times.
In addition, as a method of supplying the developer in the developing process, a process in which the developer is continuously supplied to the substrate, a process in which the developer is kept in a substantially stationary state on the substrate, and a process in which the developer is superposed on the substrate. A process of vibrating with a sound wave or the like and a process of combining them can be adopted.
現像液がアルカリ水溶液である場合、リンス液としては、例えば水を用いることができる。現像液が有機溶剤を含む現像液である場合、リンス液としては、例えば、現像液に含まれる溶剤とは異なる溶剤(例えば、水、現像液に含まれる有機溶剤とは異なる有機溶剤)を用いることができる。 [Rinse liquid]
When the developing solution is an alkaline aqueous solution, for example, water can be used as the rinsing solution. When the developer is a developer containing an organic solvent, for example, a solvent different from the solvent contained in the developer (for example, water or an organic solvent different from the organic solvent contained in the developer) is used as the rinse solution. be able to.
他の成分としては、例えば、公知の界面活性剤や公知の消泡剤等が挙げられる。 The rinse solution may further contain other components.
Examples of other components include known surfactants and known defoaming agents.
リンス液の供給方法は、所望のパターンを形成できれば特に制限は無く、基材をリンス液に浸漬する方法、基材に液盛りによりリンス液を供給する方法、基材にリンス液をシャワーで供給する方法、基材上にストレートノズル等の手段によりリンス液を連続供給する方法がある。
リンス液の浸透性、非画像部の除去性、製造上の効率の観点から、リンス液をシャワーノズル、ストレートノズル、スプレーノズルなどで供給する方法があり、スプレーノズルにて連続供給する方法が好ましく、画像部へのリンス液の浸透性の観点からは、スプレーノズルで供給する方法がより好ましい。ノズルの種類は特に制限は無く、ストレートノズル、シャワーノズル、スプレーノズル等が挙げられる。
すなわち、リンス工程は、リンス液を上記露光後の膜に対してストレートノズルにより供給、又は、連続供給する工程であることが好ましく、リンス液をスプレーノズルにより供給する工程であることがより好ましい。
またリンス工程におけるリンス液の供給方法としては、リンス液が連続的に基材に供給され続ける工程、基材上でリンス液が略静止状態で保たれる工程、基材上でリンス液を超音波等で振動させる工程及びそれらを組み合わせた工程などが採用可能である。 [Supplying method of rinse liquid]
The method of supplying the rinsing liquid is not particularly limited as long as a desired pattern can be formed, and the method of immersing the base material in the rinsing liquid, the method of supplying the rinsing liquid to the base material by filling, and the method of supplying the rinsing liquid to the base material by a shower. There is a method of continuously supplying the rinse liquid onto the base material by means such as a straight nozzle.
From the viewpoint of the permeability of the rinse liquid, the removability of non-image areas, and the efficiency of manufacturing, there is a method of supplying the rinse liquid with a shower nozzle, a straight nozzle, a spray nozzle, etc., and a method of continuously supplying the rinse liquid with a spray nozzle is preferable. From the viewpoint of the permeability of the rinse liquid into the image portion, the method of supplying with a spray nozzle is more preferable. The type of nozzle is not particularly limited, and examples thereof include a straight nozzle, a shower nozzle, and a spray nozzle.
That is, the rinsing step is preferably a step of supplying the rinsing liquid to the exposed film by a straight nozzle or continuously, and more preferably a step of supplying the rinsing liquid by a spray nozzle.
Further, as a method of supplying the rinse liquid in the rinsing step, a step of continuously supplying the rinse liquid to the base material, a step of keeping the rinse liquid in a substantially stationary state on the base material, and a step of superimposing the rinse liquid on the base material. A process of vibrating with a sound wave or the like and a process of combining them can be adopted.
現像工程により得られたパターン(リンス工程を行う場合は、リンス後のパターン)は、上記現像により得られたパターンを加熱する加熱工程に供されてもよい。
すなわち、本発明の硬化物の製造方法は、現像工程により得られたパターンを加熱する加熱工程を含んでもよい。
また、本発明の硬化物の製造方法は、現像工程を行わずに他の方法で得られたパターン、又は、膜形成工程により得られた膜を加熱する加熱工程を含んでもよい。
加熱工程において、ポリイミド前駆体等の樹脂は環化してポリイミド等の樹脂となる。
また、特定樹脂、又は特定樹脂以外の架橋剤における未反応の架橋性基の架橋なども進行する。
加熱工程における加熱温度(最高加熱温度)としては、50~450℃が好ましく、150~350℃がより好ましく、150~250℃が更に好ましく、160~250℃が一層好ましく、160~230℃が特に好ましい。 <Heating process>
The pattern obtained by the developing step (in the case of performing the rinsing step, the pattern after rinsing) may be subjected to a heating step of heating the pattern obtained by the above-mentioned development.
That is, the method for producing a cured product of the present invention may include a heating step of heating the pattern obtained by the developing step.
Further, the method for producing a cured product of the present invention may include a pattern obtained by another method without performing a developing step, or a heating step of heating the film obtained by the film forming step.
In the heating step, the resin such as the polyimide precursor is cyclized to become the resin such as polyimide.
In addition, cross-linking of unreacted cross-linking groups with a specific resin or a cross-linking agent other than the specific resin also proceeds.
The heating temperature (maximum heating temperature) in the heating step is preferably 50 to 450 ° C, more preferably 150 to 350 ° C, further preferably 150 to 250 ° C, further preferably 160 to 250 ° C, and particularly preferably 160 to 230 ° C. preferable.
加えて、急速加熱可能なオーブンの場合、加熱開始時の温度から最高加熱温度まで1~8℃/秒の昇温速度で行うことが好ましく、2~7℃/秒がより好ましく、3~6℃/秒が更に好ましい。 The heating in the heating step is preferably performed at a heating rate of 1 to 12 ° C./min from the temperature at the start of heating to the maximum heating temperature. The temperature rising rate is more preferably 2 to 10 ° C./min, even more preferably 3 to 10 ° C./min. By setting the temperature rise rate to 1 ° C./min or more, it is possible to prevent excessive volatilization of the acid or solvent while ensuring productivity, and by setting the temperature rise rate to 12 ° C./min or less, curing is possible. The residual stress of the object can be relaxed.
In addition, in the case of an oven capable of rapid heating, it is preferable to carry out from the temperature at the start of heating to the maximum heating temperature at a heating rate of 1 to 8 ° C./sec, more preferably 2 to 7 ° C./sec, and 3 to 6 ° C. ℃ / sec is more preferable.
上記加熱温度の上限は、350℃以下であることが好ましく、250℃以下であることがより好ましく、240℃以下であることが更に好ましい。 In particular, when forming a multi-layered laminate, the heating temperature is preferably 30 ° C. or higher, more preferably 80 ° C. or higher, still more preferably 100 ° C. or higher, from the viewpoint of adhesion between layers. It is particularly preferable that the temperature is 120 ° C. or higher.
The upper limit of the heating temperature is preferably 350 ° C. or lower, more preferably 250 ° C. or lower, and even more preferably 240 ° C. or lower.
更に、加熱後冷却してもよく、この場合の冷却速度としては、1~5℃/分であることが好ましい。 Heating may be performed in stages. As an example, the temperature is raised from 25 ° C. to 120 ° C. at 3 ° C./min and held at 120 ° C. for 60 minutes, the temperature is raised from 120 ° C. to 180 ° C. at 2 ° C./min, and the temperature is kept at 180 ° C. for 120 minutes. , And so on. Further, it is also preferable to perform the treatment while irradiating with ultraviolet rays as described in US Pat. No. 9,159,547. It is possible to improve the characteristics of the film by such a pretreatment step. The pretreatment step may be performed in a short time of about 10 seconds to 2 hours, more preferably 15 seconds to 30 minutes. The pretreatment may be performed in two or more steps, for example, the first pretreatment step may be performed in the range of 100 to 150 ° C., and then the second pretreatment step may be performed in the range of 150 to 200 ° C. good.
Further, cooling may be performed after heating, and the cooling rate in this case is preferably 1 to 5 ° C./min.
加熱工程における加熱手段としては、特に限定されないが、例えばホットプレート、赤外炉、電熱式オーブン、熱風式オーブン、赤外線オーブンなどが挙げられる。 The heating step is preferably carried out in an atmosphere having a low oxygen concentration by flowing an inert gas such as nitrogen, helium or argon or under reduced pressure in order to prevent decomposition of the specific resin. The oxygen concentration is preferably 50 ppm (volume ratio) or less, and more preferably 20 ppm (volume ratio) or less.
The heating means in the heating step is not particularly limited, and examples thereof include a hot plate, an infrared furnace, an electric heating oven, a hot air oven, and an infrared oven.
現像工程により得られた(リンス工程を行う場合は、リンス後のパターン)は、上記加熱工程に代えて、又は、上記加熱工程に加えて、現像工程後のパターンを露光する現像後露光工程に供されてもよい。
すなわち、本発明の硬化物の製造方法は、現像工程により得られたパターンを露光する現像後露光工程を含んでもよい。本発明の硬化物の製造方法は、加熱工程及び現像後露光工程を含んでもよいし、加熱工程及び現像後露光工程の一方のみを含んでもよい。
現像後露光工程においては、例えば、光塩基発生剤の感光によってポリイミド前駆体等の環化が進行する反応やなどを促進することができる。
現像後露光工程においては、現像工程において得られたパターンの少なくとも一部が露光されればよいが、上記パターンの全部が露光されることが好ましい。
現像後露光工程における露光量は、感光性化合物が感度を有する波長における露光エネルギー換算で、50~20,000mJ/cm2であることが好ましく、100~15,000mJ/cm2であることがより好ましい。
現像後露光工程は、例えば、上述の露光工程における光源を用いて行うことができ、ブロードバンド光を用いることが好ましい。 <Exposure process after development>
The obtained by the developing step (in the case of performing the rinsing step, the pattern after rinsing) is used in the post-development exposure step of exposing the pattern after the developing step in place of the above heating step or in addition to the above heating step. It may be offered.
That is, the method for producing a cured product of the present invention may include a post-development exposure step for exposing the pattern obtained by the developing step. The method for producing a cured product of the present invention may include a heating step and a post-development exposure step, or may include only one of a heating step and a post-development exposure step.
In the post-development exposure step, for example, it is possible to promote a reaction in which the cyclization of the polyimide precursor or the like proceeds by exposure to a photobase generator.
In the post-development exposure step, at least a part of the pattern obtained in the development step may be exposed, but it is preferable that all of the above patterns are exposed.
The exposure amount in the post-development exposure step is preferably 50 to 20,000 mJ / cm 2 and more preferably 100 to 15,000 mJ / cm 2 in terms of exposure energy at a wavelength at which the photosensitive compound has sensitivity. preferable.
The post-development exposure step can be performed using, for example, the light source in the above-mentioned exposure step, and it is preferable to use broadband light.
現像工程により得られたパターン(加熱工程及び現像後露光工程の少なくとも一方に供されたものが好ましい)は、パターン上に金属層を形成する金属層形成工程に供されてもよい。
すなわち、本発明の硬化物の製造方法は、現像工程により得られたパターン(加熱工程及び現像後露光工程少なくとも一方に供されたものが好ましい)上に金属層を形成する金属層形成工程を含むことが好ましい。 <Metal layer forming process>
The pattern obtained by the developing step (preferably those subjected to at least one of the heating step and the post-development exposure step) may be subjected to the metal layer forming step of forming the metal layer on the pattern.
That is, the method for producing a cured product of the present invention includes a metal layer forming step of forming a metal layer on a pattern obtained by a developing step (preferably one provided in at least one of a heating step and a post-development exposure step). Is preferable.
本発明の硬化物の製造方法、又は、本発明の硬化物の適用可能な分野としては、半導体デバイスの絶縁膜、再配線層用層間絶縁膜、ストレスバッファ膜などが挙げられる。そのほか、封止フィルム、基板材料(フレキシブルプリント基板のベースフィルムやカバーレイ、層間絶縁膜)、又は上記のような実装用途の絶縁膜をエッチングでパターン形成することなどが挙げられる。これらの用途については、例えば、サイエンス&テクノロジー(株)「ポリイミドの高機能化と応用技術」2008年4月、柿本雅明/監修、CMCテクニカルライブラリー「ポリイミド材料の基礎と開発」2011年11月発行、日本ポリイミド・芳香族系高分子研究会/編「最新ポリイミド 基礎と応用」エヌ・ティー・エス,2010年8月等を参照することができる。 <Use>
Examples of the method for producing a cured product of the present invention or the applicable field of the cured product of the present invention include an insulating film for a semiconductor device, an interlayer insulating film for a rewiring layer, a stress buffer film, and the like. Other examples include forming a pattern of a sealing film, a substrate material (base film or coverlay of a flexible printed circuit board, an interlayer insulating film), or an insulating film for mounting purposes as described above by etching. For these applications, for example, Science & Technology Co., Ltd. "High-performance and applied technology of polyimide" April 2008, Masaaki Kakimoto / supervision, CMC technical library "Basics and development of polyimide materials" November 2011 You can refer to "Latest Polyimide Basics and Applications", NTS, August 2010, etc., published by Japan Polyimide / Aromatic Polymer Research Association / ed.
本発明の積層体とは、本発明の硬化物からなる層を複数層有する構造体をいう。
本発明の積層体は、硬化物からなる層を2層以上含む積層体であり、3層以上積層した積層体としてもよい。
上記積層体に含まれる2層以上の上記硬化物からなる層のうち、少なくとも1つが本発明の硬化物からなる層であり、硬化物の収縮、又は、上記収縮に伴う硬化物の変形等を抑制する観点からは、上記積層体に含まれる全ての硬化物からなる層が本発明の硬化物からなる層であることも好ましい。 (Laminated body and method for manufacturing the laminated body)
The laminated body of the present invention refers to a structure having a plurality of layers made of the cured product of the present invention.
The laminated body of the present invention is a laminated body containing two or more layers made of a cured product, and may be a laminated body in which three or more layers are laminated.
Of the two or more layers made of the cured product contained in the laminated body, at least one is a layer made of the cured product of the present invention, which causes shrinkage of the cured product or deformation of the cured product due to the shrinkage. From the viewpoint of suppressing, it is also preferable that the layer made of all the cured products contained in the laminated body is the layer made of the cured product of the present invention.
すなわち、本発明の積層体の製造方法は、複数回行われる硬化物の製造方法の間に、硬化物からなる層上に金属層を形成する金属層形成工程を更に含むことが好ましい。金属層形成工程の好ましい態様は上述の通りである。
上記積層体としては、例えば、第一の硬化物からなる層、金属層、第二の硬化物からなる層の3つの層がこの順に積層された層構造を少なくとも含む積層体が好ましいものとして挙げられる。
上記第一の硬化物からなる層及び上記第二の硬化物からなる層は、いずれも本発明の硬化物からなる層であることが好ましい。上記第一の硬化物からなる層の形成に用いられる本発明の樹脂組成物と、上記第二の硬化物からなる層の形成に用いられる本発明の樹脂組成物とは、組成が同一の組成物であってもよいし、組成が異なる組成物であってもよい。本発明の積層体における金属層は、再配線層などの金属配線として好ましく用いられる。 It is preferable that the laminated body of the present invention contains two or more layers made of a cured product and contains a metal layer between any of the layers made of the cured product. The metal layer is preferably formed by the metal layer forming step.
That is, it is preferable that the method for producing a laminated body of the present invention further includes a metal layer forming step of forming a metal layer on a layer made of the cured product between the methods for producing a cured product which is performed a plurality of times. The preferred embodiment of the metal layer forming step is as described above.
As the above-mentioned laminate, for example, a laminate including at least a layer structure in which three layers of a layer made of a first cured product, a metal layer, and a layer made of a second cured product are laminated in this order is preferable. Be done.
It is preferable that the layer made of the first cured product and the layer made of the second cured product are both layers made of the cured product of the present invention. The resin composition of the present invention used for forming the layer composed of the first cured product and the resin composition of the present invention used for forming the layer composed of the second cured product have the same composition. It may be a product or a composition having a different composition. The metal layer in the laminate of the present invention is preferably used as metal wiring such as a rewiring layer.
本発明の積層体の製造方法は、積層工程を含むことが好ましい。
積層工程とは、パターン(樹脂層)又は金属層の表面に、再度、(a)膜形成工程(層形成工程)、(b)露光工程、(c)現像工程、(d)加熱工程及び現像後露光工程の少なくとも一方を、この順に行うことを含む一連の工程である。ただし、(a)の膜形成工程および(d)加熱工程及び現像後露光工程の少なくとも一方を繰り返す態様であってもよい。また、(d)加熱工程及び現像後露光工程の少なくとも一方の後には(e)金属層形成工程を含んでもよい。積層工程には、更に、上記乾燥工程等を適宜含んでいてもよいことは言うまでもない。 <Laminating process>
The method for producing a laminated body of the present invention preferably includes a laminating step.
The laminating step means that (a) a film forming step (layer forming step), (b) an exposure step, (c) a developing step, (d) a heating step and development are performed again on the surface of a pattern (resin layer) or a metal layer. It is a series of steps including performing at least one of the post-exposure steps in this order. However, it may be an embodiment in which at least one of the film forming step (a), the heating step and the post-development exposure step (d) is repeated. Further, (e) a metal layer forming step may be included after at least one of the (d) heating step and the post-development exposure step. Needless to say, the laminating step may further include the above-mentioned drying step and the like as appropriate.
例えば、樹脂層/金属層/樹脂層/金属層/樹脂層/金属層のように、樹脂層を2層以上20層以下とする構成が好ましく、2層以上9層以下とする構成が更に好ましい。
上記各層はそれぞれ、組成、形状、膜厚等が同一であってもよいし、異なっていてもよい。 The laminating step is preferably performed 2 to 20 times, more preferably 2 to 9 times.
For example, a structure having two or more and 20 or less resin layers, such as a resin layer / metal layer / resin layer / metal layer / resin layer / metal layer, is preferable, and a structure having two or more and 9 or less layers is more preferable. ..
The composition, shape, film thickness, etc. of each of the above layers may be the same or different.
本発明の積層体の製造方法は、上記金属層および樹脂組成物層の少なくとも一部を表面活性化処理する、表面活性化処理工程を含むことが好ましい。
表面活性化処理工程は、通常、金属層形成工程の後に行うが、上記現像工程の後(好ましくは、加熱工程及び現像後露光工程の少なくとも一方の後)、樹脂組成物層に表面活性化処理工程を行ってから、金属層形成工程を行ってもよい。
表面活性化処理は、金属層の少なくとも一部のみに行ってもよいし、露光後の樹脂組成物層の少なくとも一部のみに行ってもよいし、金属層および露光後の樹脂組成物層の両方について、それぞれ、少なくとも一部に行ってもよい。表面活性化処理は、金属層の少なくとも一部について行うことが好ましく、金属層のうち、表面に樹脂組成物層を形成する領域の一部または全部に表面活性化処理を行うことが好ましい。このように、金属層の表面に表面活性化処理を行うことにより、その表面に設けられる樹脂組成物層(膜)との密着性を向上させることができる。
また、表面活性化処理は、露光後の樹脂組成物層(樹脂層)の一部または全部についても行うことが好ましい。このように、樹脂組成物層の表面に表面活性化処理を行うことにより、表面活性化処理した表面に設けられる金属層や樹脂層との密着性を向上させることができる。特にネガ型現像を行う場合など、樹脂組成物層が硬化されている場合には、表面処理によるダメージを受けにくく、密着性が向上しやすい。
表面活性化処理としては、具体的には、各種原料ガス(酸素、水素、アルゴン、窒素、窒素/水素混合ガス、アルゴン/酸素混合ガスなど)のプラズマ処理、コロナ放電処理、CF4/O2、NF3/O2、SF6、NF3、NF3/O2によるエッチング処理、紫外線(UV)オゾン法による表面処理、塩酸水溶液に浸漬して酸化皮膜を除去した後にアミノ基とチオール基を少なくとも一種有する化合物を含む有機表面処理剤への浸漬処理、ブラシを用いた機械的な粗面化処理から選択され、プラズマ処理が好ましく、特に原料ガスに酸素を用いた酸素プラズマ処理が好ましい。コロナ放電処理の場合、エネルギーは、500~200,000J/m2が好ましく、1000~100,000J/m2がより好ましく、10,000~50,000J/m2が最も好ましい (Surface activation treatment process)
The method for producing a laminate of the present invention preferably includes a surface activation treatment step of surface activating at least a part of the metal layer and the resin composition layer.
The surface activation treatment step is usually performed after the metal layer forming step, but after the development step (preferably after at least one of the heating step and the post-development exposure step), the surface activation treatment of the resin composition layer is performed. After performing the step, the metal layer forming step may be performed.
The surface activation treatment may be performed on at least a part of the metal layer, on at least a part of the exposed resin composition layer, or on the metal layer and the exposed resin composition layer. For both, you may go to at least part of each. The surface activation treatment is preferably performed on at least a part of the metal layer, and it is preferable to perform the surface activation treatment on a part or all of the region of the metal layer that forms the resin composition layer on the surface. By performing the surface activation treatment on the surface of the metal layer in this way, the adhesion to the resin composition layer (film) provided on the surface can be improved.
Further, it is preferable that the surface activation treatment is performed on a part or all of the resin composition layer (resin layer) after exposure. As described above, by performing the surface activation treatment on the surface of the resin composition layer, it is possible to improve the adhesion to the metal layer or the resin layer provided on the surface of the surface activation treatment. In particular, when the resin composition layer is cured, such as when negative type development is performed, it is less likely to be damaged by the surface treatment and the adhesion is likely to be improved.
Specific examples of the surface activation treatment include plasma treatment of various raw material gases (oxygen, hydrogen, argon, nitrogen, nitrogen / hydrogen mixed gas, argon / oxygen mixed gas, etc.), corona discharge treatment, and CF 4 / O 2 . , NF 3 / O 2 , SF 6 , NF 3 , NF 3 / O 2 , etching treatment, surface treatment by ultraviolet (UV) ozone method, immersion in hydrochloric acid aqueous solution to remove oxide film, then amino group and thiol group It is selected from a dipping treatment in an organic surface treatment agent containing at least one compound and a mechanical roughening treatment using a brush, and a plasma treatment is preferable, and an oxygen plasma treatment using oxygen as a raw material gas is particularly preferable. In the case of the corona discharge treatment, the energy is preferably 500 to 200,000 J / m 2 , more preferably 1000 to 100,000 J / m 2 , and most preferably 10,000 to 50,000 J / m 2 .
本発明は、本発明の硬化物、又は、本発明の積層体を含む半導体デバイスも開示する。
また、本発明は、本発明の硬化物の製造方法、又は、本発明の積層体の製造方法を含む半導体デバイスの製造方法も開示する。本発明の樹脂組成物を再配線層用層間絶縁膜の形成に用いた半導体デバイスの具体例としては、特開2016-027357号公報の段落0213~0218の記載及び図1の記載を参酌でき、これらの内容は本明細書に組み込まれる。 (Semiconductor device and its manufacturing method)
The present invention also discloses a semiconductor device containing the cured product of the present invention or the laminate of the present invention.
The present invention also discloses a method for producing a cured product of the present invention, or a method for producing a semiconductor device including a method for producing a laminate of the present invention. As specific examples of the semiconductor device in which the resin composition of the present invention is used to form the interlayer insulating film for the rewiring layer, the description in paragraphs 0213 to 0218 and FIG. 1 of JP-A-2016-0273557 can be referred to. These contents are incorporated in the present specification.
〔M-1の合成〕
撹拌機、コンデンサーを取りつけたフラスコ内で、2-(4-アミノフェニル)エチルアルコール(東京化成工業(株)製)27.44g(200ミリモル)、p-メトキシフェノール(東京化成工業(株)製)0.03gをテトラヒドロフラン250mLに溶解し、0℃に冷却した。次いで、カレンズMOI(昭和電工(株)製)29.48g(190ミリモル)を1時間かけて滴下し、0℃~10℃で1時間撹拌した後、25℃に昇温し、2時間撹拌した。続いて、これを酢酸エチル800mL/ヘキサン200mLの溶液に晶析し、ろ過した。続いてろ物を酢酸エチル500mLで1時間撹拌し、ろ過した。これを45℃で24時間乾燥し、M-1を45g得た。M-1である事は1H-NMRスペクトルから確認した。得られたM-1の構造を下記式(M-1)に示す。
[Synthesis of M-1]
In a flask equipped with a stirrer and a condenser, 2- (4-aminophenyl) ethyl alcohol (manufactured by Tokyo Chemical Industry Co., Ltd.) 27.44 g (200 mmol), p-methoxyphenol (manufactured by Tokyo Chemical Industry Co., Ltd.) ) 0.03 g was dissolved in 250 mL of tetrahydrofuran and cooled to 0 ° C. Next, 29.48 g (190 mmol) of Karenz MOI (manufactured by Showa Denko KK) was added dropwise over 1 hour, stirred at 0 ° C to 10 ° C for 1 hour, then heated to 25 ° C and stirred for 2 hours. .. Subsequently, this was crystallized into a solution of 800 mL of ethyl acetate / 200 mL of hexane and filtered. Subsequently, the filtrate was stirred with 500 mL of ethyl acetate for 1 hour and filtered. This was dried at 45 ° C. for 24 hours to obtain 45 g of M-1. It was confirmed from 1 H-NMR spectrum that it was M-1. The structure of the obtained M-1 is shown in the following formula (M-1).
上記M-1の合成と同様の方法により、M-2~M-5を合成した。得られたM-2~M-5の構造を下記式(M-2)~式(M-5)に示す。
M-2 to M-5 were synthesized by the same method as the above-mentioned synthesis of M-1. The structures of the obtained M-2 to M-5 are shown in the following formulas (M-2) to (M-5).
撹拌機、コンデンサーを取りつけたフラスコ内で、4-アミノ安息香酸(東京化成工業(株)製)27.4g(200ミリモル)、p-メトキシフェノール(東京化成工業(株)製)0.03gをテトラヒドロフラン250mLに溶解し、0℃に冷却した。次いで、カレンズMOI(昭和電工(株)製)29.48g(190ミリモル)を1時間かけて滴下し、0℃~10℃で1時間撹拌した後、25℃に昇温し、2時間撹拌した。続いて、これを酢酸エチル800mL/ヘキサン200mLの溶液に晶析し、ろ過した。続いてろ過物を酢酸エチル500mLで1時間撹拌し、ろ過した。これを撹拌機、コンデンサーを取りつけたフラスコに移し、2-(4-アミノフェニル)エチルアルコール(東京化成工業(株)製)23.3g(170ミリモル)を添加し、テトラヒドロフラン250mLに溶解し、0℃に冷却した。次いで、1-エチル-3-(3-ジメチルアミノプロピル)カルボジイミド塩酸塩(東京化成工業(株)製)34.5g(180ミリモル)を添加し、0℃~10℃で2時間撹拌し、25℃で2時間撹拌した。これを、1Lの水に晶析し、ろ過し、酢酸エチル500mLでリスラリーし、ろ過した。これを45℃で24時間乾燥し、M-6を61g得た。M-6である事は1H-NMRスペクトルから確認した。得られたM-6の構造を下記式(M-6)に示す。
In a flask equipped with a stirrer and a condenser, 27.4 g (200 mmol) of 4-aminobenzoic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) and 0.03 g of p-methoxyphenol (manufactured by Tokyo Chemical Industry Co., Ltd.) are added. It was dissolved in 250 mL of tetrahydrofuran and cooled to 0 ° C. Next, 29.48 g (190 mmol) of Karenz MOI (manufactured by Showa Denko KK) was added dropwise over 1 hour, stirred at 0 ° C to 10 ° C for 1 hour, then heated to 25 ° C and stirred for 2 hours. .. Subsequently, this was crystallized into a solution of 800 mL of ethyl acetate / 200 mL of hexane and filtered. Subsequently, the filtrate was stirred with 500 mL of ethyl acetate for 1 hour and filtered. Transfer this to a flask equipped with a stirrer and a condenser, add 23.3 g (170 mmol) of 2- (4-aminophenyl) ethyl alcohol (manufactured by Tokyo Chemical Industry Co., Ltd.), dissolve in 250 mL of tetrahydrofuran, and 0. Cooled to ° C. Next, 34.5 g (180 mmol) of 1-ethyl-3- (3-dimethylaminopropyl) carbodiimide hydrochloride (manufactured by Tokyo Chemical Industry Co., Ltd.) was added, and the mixture was stirred at 0 ° C to 10 ° C for 2 hours, and 25. The mixture was stirred at ° C for 2 hours. This was crystallized in 1 L of water, filtered, reslurried with 500 mL of ethyl acetate, and filtered. This was dried at 45 ° C. for 24 hours to obtain 61 g of M-6. It was confirmed from 1 H-NMR spectrum that it was M-6. The structure of the obtained M-6 is shown in the following formula (M-6).
M-6と同様の方法により、M-7~M-9を合成した。得られたM-7~M-9の構造を下記式(M-7)~式(M-9)に示す。
M-7 to M-9 were synthesized by the same method as M-6. The structures of the obtained M-7 to M-9 are shown in the following formulas (M-7) to (M-9).
撹拌機、コンデンサーを取りつけたフラスコ内で、4,4’-(4,4’-イソプロピリデンジフェノキシ)ジフタル酸無水物(東京化成工業(株)製)19.19g(36.7ミリモル)、4-メトキシフェノール(東京化成工業(株)製)0.01g、M-1(上記合成品)21.98g(75ミリモル)、ピリジン12.92g(163ミリモル)、ジエチレングリコールジメチルエーテル(東京化成工業(株)製)40.0gとを混合し、60℃の温度で6時間撹拌した。次いで、混合物を-20℃まで冷却した後、塩化チオニル 9.19g(76.3ミリモル)を90分かけて滴下し、2時間撹拌した。次いで、N-メチルピロリドン(NMP) 25mLを添加し、4,4’-ジアミノジフェニルエーテル 6.11g(30.5ミリモル)をNMP 100mL中に溶解させたものを、2時間かけて滴下により添加した。次いで、エタノール 16.9g(367ミリモル)を加え、混合物を2時間撹拌した。次いで、4リットルの水の中でポリイミド前駆体樹脂を沈殿させ、水-ポリイミド前駆体樹脂混合物を500rpm(revolutions per minutes)の速度で15分間撹拌した。ポリイミド前駆体樹脂を濾過して取得し、4リットルの水の中で再度30分間撹拌し再び濾過した。次いで、得られたポリイミド前駆体樹脂を減圧下、45℃で2日間乾燥しポリイミド前駆体(SA-1)を得た。得られたポリイミド前駆体SA-1の重量平均分子量(Mw)は21,100、数平均分子量(Mn)は9,800であった。ポリイミド前駆体SA-1は、下記式(SA-1)で表される繰返し単位を含む樹脂であると推測される。
In a flask equipped with a stirrer and a condenser, 4,4'-(4,4'-isopropyridendiphenoxy) diphthalic acid anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) 19.19 g (36.7 mmol), 4-methoxyphenol (manufactured by Tokyo Chemical Industry Co., Ltd.) 0.01 g, M-1 (the above synthetic product) 21.98 g (75 mmol), pyridine 12.92 g (163 mmol), diethylene glycol dimethyl ether (Tokyo Chemical Industry Co., Ltd.) ) Was mixed with 40.0 g and stirred at a temperature of 60 ° C. for 6 hours. The mixture was then cooled to −20 ° C., then 9.19 g (76.3 mmol) of thionyl chloride was added dropwise over 90 minutes and stirred for 2 hours. Then, 25 mL of N-methylpyrrolidone (NMP) was added, and 6.11 g (30.5 mmol) of 4,4'-diaminodiphenyl ether was dissolved in 100 mL of NMP and added dropwise over 2 hours. Then 16.9 g (367 mmol) of ethanol was added and the mixture was stirred for 2 hours. The polyimide precursor resin was then precipitated in 4 liters of water and the water-polyimide precursor resin mixture was stirred at a rate of 500 rpm (revolutions per minutes) for 15 minutes. The polyimide precursor resin was obtained by filtration, stirred again in 4 liters of water for 30 minutes, and filtered again. Then, the obtained polyimide precursor resin was dried under reduced pressure at 45 ° C. for 2 days to obtain a polyimide precursor (SA-1). The weight average molecular weight (Mw) of the obtained polyimide precursor SA-1 was 21,100, and the number average molecular weight (Mn) was 9,800. The polyimide precursor SA-1 is presumed to be a resin containing a repeating unit represented by the following formula (SA-1).
使用する酸無水物及びジアミンを下記表に記載の化合物にそれぞれ変更し、M-1を下記表の「エステル化モノマー」の欄に記載の化合物にそれぞれ変更した以外は、SA-1の合成と同様の方法によりポリイミド前駆体SA-2~SA-9を合成した。ポリイミド前駆体SA-2~SA-9は、下記式(SA-2)~(SA-9)で表される繰返し単位を含む樹脂であると推測される。 [Synthesis of polyimide precursors SA-2 to SA-9]
With the synthesis of SA-1, except that the acid anhydrides and diamines used were changed to the compounds listed in the table below, and M-1 was changed to the compounds listed in the "esterified monomer" column of the table below. Polyimide precursors SA-2 to SA-9 were synthesized by the same method. It is presumed that the polyimide precursors SA-2 to SA-9 are resins containing repeating units represented by the following formulas (SA-2) to (SA-9).
-無水物-
IPDPA:4,4’-(4,4’-イソプロピリデンジフェノキシ)ジフタル酸無水物
BPA:4,4’-ビフタル酸無水物
ODPA:4,4’-オキシジフタル酸無水物
-ジアミン-
ODA:4,4’-ジアミノフェニルエーテル
BTFD:4,4’-ジアミノ-2,2’-ビス(トリフルオロメチル)ビフェニル
-エステル化モノマー-
M-2~M-9:上記合成品
-Anhydride-
IPDPA: 4,4'-(4,4'-isopropylidenediphenoxy) diphthalic acid anhydride BPA: 4,4'-biphthalic acid anhydride ODPA: 4,4'-oxydiphthalic acid anhydride-diamine-
ODA: 4,4'-diaminophenyl ether BTFD: 4,4'-diamino-2,2'-bis (trifluoromethyl) biphenyl-esterified monomer-
M-2 to M-9: The above synthetic product
-ジアミンAA-1の合成-
フラスコに、M-1(上記合成品)14.6g(50ミリモル)、ピリジン4.75g(60ミリモル)、テトラヒドロフラン100gを秤り取り、0℃以下で撹拌した。次いで、3,5-ジニトロベンゾイルクロリド(東京化成工業(株)製)12.7g(55ミリモル)をテトラヒドロフラン30gに溶解し、1時間かけて滴下した。滴下後、25℃で、3時間撹拌し、500mLの酢酸エチルを加え、分液ロートに移した。この溶液を水、飽和重曹水、希塩酸、飽和食塩水の順で洗浄し、エバポレーターで溶媒を除去し、中間体(PA-1)を21g得た。
フラスコに、PA-1を19.6g(40ミリモル)、酢酸2.43g(40ミリモル)、酢酸アンモニウム4.71g(88ミリモル)、イソプロパノール120mL、水30mL、還元鉄22.3g(400ミリモル)を加え、水冷しながら、1時間撹拌した。次に、バス温度を85℃に昇温し、3時間撹拌し、セライトを用いてろ過した。ろ液を1Lの酢酸エチルで希釈し、水、飽和重曹水、飽和食塩水の順で洗浄し、エバポレーターで溶媒を除去し、AA-1を16g得た。
-Synthesis of diamine AA-1-
14.6 g (50 mmol) of M-1 (the above synthetic product), 4.75 g (60 mmol) of pyridine, and 100 g of tetrahydrofuran were weighed into a flask and stirred at 0 ° C. or lower. Then, 12.7 g (55 mmol) of 3,5-dinitrobenzoyl chloride (manufactured by Tokyo Chemical Industry Co., Ltd.) was dissolved in 30 g of tetrahydrofuran and added dropwise over 1 hour. After the dropping, the mixture was stirred at 25 ° C. for 3 hours, 500 mL of ethyl acetate was added, and the mixture was transferred to a separating funnel. This solution was washed with water, saturated aqueous sodium hydrogen carbonate, dilute hydrochloric acid, and saturated brine in this order, and the solvent was removed by an evaporator to obtain 21 g of an intermediate (PA-1).
In a flask, add 19.6 g (40 mmol) of PA-1, 2.43 g (40 mmol) of acetic acid, 4.71 g (88 mmol) of ammonium acetate, 120 mL of isopropanol, 30 mL of water, and 22.3 g (400 mmol) of reduced iron. In addition, the mixture was stirred for 1 hour while cooling with water. Next, the bath temperature was raised to 85 ° C., the mixture was stirred for 3 hours, and filtered using cerite. The filtrate was diluted with 1 L of ethyl acetate, washed with water, saturated aqueous sodium hydrogen carbonate and saturated brine in this order, and the solvent was removed with an evaporator to obtain 16 g of AA-1.
原料を適宜変更した以外は、SA-1の合成と同様の方法により、SA-10を合成した。SA-10のMwは23,500、Mnは10,600であった。
ポリイミド前駆体SA-10は、下記式(SA-10)で表される繰返し単位を含む樹脂であると推測される。
SA-10 was synthesized by the same method as that for SA-1 except that the raw materials were appropriately changed. The Mw of SA-10 was 23,500 and the Mn was 10,600.
It is presumed that the polyimide precursor SA-10 is a resin containing a repeating unit represented by the following formula (SA-10).
コンデンサー及び撹拌機を取り付けたフラスコ中で、無水トリメリット酸クロリド(東京化成工業(株)製)21.0g(0.1モル)を酢酸エチル180gに溶解し、-10℃以下に冷却した。次いで、ジアミン(AA-1)19.2g(45ミリモル)、ピリジン7.9g(100ミリモル)を酢酸エチル80gに溶解し、これを1時間かけて滴下した。滴下後、-10℃以下で1時間、25℃で1時間撹拌した。次いで、酢酸エチル800mL、水300mLを添加し、10分撹拌した後、これを分液ロートに移し、300mLの水で洗浄し、200mLの飽和重曹水溶液で2回洗浄し、200mLの希塩酸水溶液、飽和食塩水で洗浄した。これを硫酸マグネシウムで乾燥し、エバポレーターで濃縮後、酢酸エチル溶液をヘキサンに晶析した。これをろ過、真空乾燥し、無水物(AH-1)31gを得た。
In a flask equipped with a condenser and a stirrer, 21.0 g (0.1 mol) of trimellitic acid chloride (manufactured by Tokyo Chemical Industry Co., Ltd.) was dissolved in 180 g of ethyl acetate and cooled to −10 ° C. or lower. Then, 19.2 g (45 mmol) of diamine (AA-1) and 7.9 g (100 mmol) of pyridine were dissolved in 80 g of ethyl acetate, and this was added dropwise over 1 hour. After the dropping, the mixture was stirred at −10 ° C. or lower for 1 hour and at 25 ° C. for 1 hour. Then, 800 mL of ethyl acetate and 300 mL of water were added, and after stirring for 10 minutes, this was transferred to a separating funnel, washed with 300 mL of water, washed twice with 200 mL of saturated aqueous sodium bicarbonate solution, and saturated with 200 mL of dilute aqueous hydrochloric acid solution. It was washed with saline solution. This was dried over magnesium sulfate, concentrated on an evaporator, and then the ethyl acetate solution was crystallized into hexane. This was filtered and vacuum dried to obtain 31 g of anhydrate (AH-1).
原料を適宜変更した以外は、SA-1の合成と同様の方法により、SA-11を合成した。SA-10のMwは28,400、Mnは12,300であった。
ポリイミド前駆体SA-11は、下記式(SA-11)で表される繰返し単位を含む樹脂であると推測される。
SA-11 was synthesized by the same method as that for the synthesis of SA-1, except that the raw materials were appropriately changed. The Mw of SA-10 was 28,400 and the Mn was 12,300.
It is presumed that the polyimide precursor SA-11 is a resin containing a repeating unit represented by the following formula (SA-11).
SA-1の合成において、M-1(上記合成品)21.98g(75ミリモル)を、M-1(上記合成品)48.75ミリモル及びヒドロキシプロピルメタクリレート26.25ミリモルに変更した以外は、SA-1の合成方法と同様の方法により、SA-12を得た。
In the synthesis of SA-1, except that 21.98 g (75 mmol) of M-1 (the synthetic product) was changed to 48.75 mmol of M-1 (the synthetic product) and 26.25 mmol of hydroxypropyl methacrylate. SA-12 was obtained by the same method as the method for synthesizing SA-1.
フラスコに、4,4’-(ヘキサフルオロイソプロピリデン)ジフタル酸無水物22.2g(50ミリモル)、N-メチルピロリドン70gを秤取り、10℃~20℃で撹拌し、溶解した。次いで、AA-1(上記合成品)を18.8g(44ミリモル)をN-メチルピロリドン30gに溶解し、1時間かけて滴下した。
これを25℃で、2時間撹拌したあと、無水酢酸20.4g(200ミリモル)、ピリジン9.98g(125ミリモル)、N-メチルピロリドン30gを加え、80℃に昇温し、3時間撹拌した。この反応液をメタノール1Lにあけ、析出した樹脂をろ過し、ろ取した樹脂をメタノール1Lで撹拌洗浄し、ろ過し、乾燥した。
PI-1のMwは22,500、Mnは9,900であった。
ポリイミドPI-1は、下記式(PI-1)で表される繰返し単位を含む樹脂であると推測される。
In a flask, 22.2 g (50 mmol) of 4,4'-(hexafluoroisopropyridene) diphthalic acid anhydride and 70 g of N-methylpyrrolidone were weighed and stirred at 10 ° C to 20 ° C to dissolve. Then, 18.8 g (44 mmol) of AA-1 (the above synthetic product) was dissolved in 30 g of N-methylpyrrolidone, and the mixture was added dropwise over 1 hour.
After stirring this at 25 ° C. for 2 hours, 20.4 g (200 mmol) of acetic anhydride, 9.98 g (125 mmol) of pyridine and 30 g of N-methylpyrrolidone were added, the temperature was raised to 80 ° C., and the mixture was stirred for 3 hours. .. This reaction solution was poured into 1 L of methanol, the precipitated resin was filtered, and the collected resin was stirred and washed with 1 L of methanol, filtered, and dried.
The Mw of PI-1 was 22,500 and the Mn was 9,900.
Polyimide PI-1 is presumed to be a resin containing a repeating unit represented by the following formula (PI-1).
各実施例において、それぞれ、下記表に記載の成分を混合し、各樹脂組成物を得た。また、各比較例において、それぞれ、下記表に記載の成分を混合し、各比較用組成物を得た。
具体的には、表に記載の各成分の含有量は、表の各欄の「添加量」の欄に記載の量(質量部)とした。
得られた樹脂組成物及び比較用組成物を、細孔の幅が0.5μmのポリテトラフルオロエチレン製フィルターを用いて加圧ろ過した。
また、表中、「-」の記載は該当する成分を組成物が含有していないことを示している。 <Examples and comparative examples>
In each example, the components listed in the table below were mixed to obtain each resin composition. Further, in each comparative example, the components listed in the following table were mixed to obtain each comparative composition.
Specifically, the content of each component described in the table is the amount (parts by mass) described in the column of "addition amount" in each column of the table.
The obtained resin composition and comparative composition were pressure-filtered using a filter made of polytetrafluoroethylene having a pore width of 0.5 μm.
Further, in the table, the description of "-" indicates that the composition does not contain the corresponding component.
・SA-1~SA-11、PI-1:上記合成例により得られたSA-1~SA-11、PI-1
・A-1:下記式(A-1)で表される構造の繰返し単位を含む樹脂、下記合成品
・A-2:下記式(A-2)で表される構造の繰返し単位を含む樹脂、下記合成品
・P-1:下記式(P-1)で表される構造の繰返し単位を含む樹脂、下記合成品
〔A-1の合成〕
4,4’-オキシジフタル酸二無水物(ODPA)46.96gをセパラブルフラスコに入れ、2-ヒドロキシエチルメタクリレート(HEMA)39.69gとテトラヒドロフラン136.83gを入れて室温(25℃)下で撹拌し、撹拌しながらピリジン24.66gを加えて反応混合物を得た。反応による発熱の終了後に室温まで放冷し、16時間放置した。
次に、氷冷下において、ジシクロヘキシルカルボジイミド(DCC)62.46gをテトラヒドロフラン61.57gに溶解した溶液を撹拌しながら40分かけて反応混合物に加え、続いて4,4’-ジアミノジフェニルエーテル(DADPE)27.42gをテトラヒドロフラン119.73gに懸濁したものを撹拌しながら60分かけて加えた。更に室温で2時間撹拌した後、エチルアルコール7.17gを加えて1時間撹拌し、次に、テトラヒドロフラン136.83gを加えた。反応混合物に生じた沈殿物をろ過により取り除き、反応液を得た。
得られた反応液を716.21gのエチルアルコールに加えて粗ポリマーから成る沈殿物を生成した。生成した粗ポリマーを濾別し、テトラヒドロフラン403.49gに溶解して粗ポリマー溶液を得た。得られた粗ポリマー溶液を8470.26gの水に滴下してポリマーを沈殿させ、得られた沈殿物を濾別した後、真空乾燥して粉末状の樹脂A-1を得た。樹脂A-1の分子量をゲルパーミエーションクロマトグラフィー(標準ポリスチレン換算)で測定したところ、A-1の重量平均分子量は20,500、数平均分子量は9,100であった。
〔A-2の合成〕
A-1の合成において、4,4’-オキシジフタル酸二無水物(ODPA)を等モル量の4,4’-(4,4’-イソプロピリデンジフェノキシ)ジフタル酸無水物(東京化成工業(株)製)に変更した以外は、A-1の合成と同様の方法によりA-2を得た。A-2の重量平均分子量は28,000、数平均分子量は12,600であった。
〔P-1の合成〕
上述のポリイミドPI-1の合成において、AA-1を等モル量の1,3-フェニレンジアミンに変更した以外は、PI-1の合成と同様の方法によりP-1を得た。P-1の分子量は、Mw=24,000、Mn=10,400であった。 [Resin (cyclized resin or its precursor)]
SA-1 to SA-11, PI-1: SA-1 to SA-11, PI-1 obtained by the above synthetic example.
-A-1: Resin containing a repeating unit of a structure represented by the following formula (A-1), the following synthetic product-A-2: A resin containing a repeating unit of a structure represented by the following formula (A-2) , The following synthetic product ・ P-1: Resin containing a repeating unit of the structure represented by the following formula (P-1), the following synthetic product
[Synthesis of A-1]
Put 46.96 g of 4,4'-oxydiphthalic acid dianhydride (ODPA) in a separable flask, put 39.69 g of 2-hydroxyethyl methacrylate (HEMA) and 136.83 g of tetrahydrofuran, and stir at room temperature (25 ° C). Then, 24.66 g of pyridine was added with stirring to obtain a reaction mixture. After the heat generated by the reaction was completed, the mixture was allowed to cool to room temperature and left for 16 hours.
Next, under ice-cooling, a solution of 62.46 g of dicyclohexylcarbodiimide (DCC) in 61.57 g of tetrahydrofuran was added to the reaction mixture over 40 minutes with stirring, followed by 4,4'-diaminodiphenyl ether (DADPE). A suspension of 27.42 g in THF 119.73 g was added over 60 minutes with stirring. After further stirring at room temperature for 2 hours, 7.17 g of ethyl alcohol was added and the mixture was stirred for 1 hour, and then 136.83 g of tetrahydrofuran was added. The precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution.
The obtained reaction solution was added to 716.21 g of ethyl alcohol to form a precipitate composed of a crude polymer. The produced crude polymer was filtered off and dissolved in 403.49 g of tetrahydrofuran to obtain a crude polymer solution. The obtained crude polymer solution was added dropwise to 8470.26 g of water to precipitate a polymer, and the obtained precipitate was filtered off and then vacuum dried to obtain a powdery resin A-1. When the molecular weight of the resin A-1 was measured by gel permeation chromatography (standard polystyrene conversion), the weight average molecular weight of A-1 was 20,500 and the number average molecular weight was 9,100.
[Synthesis of A-2]
In the synthesis of A-1, an equimolar amount of 4,4'-oxydiphthalic acid dianhydride (ODPA) was added to 4,4'-(4,4'-isopropyridendiphenoxy) diphthalic acid anhydride (Tokyo Chemical Industry (Tokyo Chemical Industry). A-2 was obtained by the same method as in the synthesis of A-1, except that it was changed to (manufactured by Co., Ltd.). The weight average molecular weight of A-2 was 28,000, and the number average molecular weight was 12,600.
[Synthesis of P-1]
In the above-mentioned synthesis of polyimide PI-1, P-1 was obtained by the same method as in the synthesis of PI-1, except that AA-1 was changed to an equimolar amount of 1,3-phenylenediamine. The molecular weight of P-1 was Mw = 24,000 and Mn = 10,400.
・SR-209:SR-209(サートマー社製)
・SR-231:SR-231(サートマー社製)
・ADPH:ジペンタエリスリトールヘキサアクリレート(新中村化学)
・CS-1:下記構造の化合物
〔CS-1の合成〕
撹拌機、コンデンサーを取りつけたフラスコに、上記で合成したCS-1を14.6g(50ミリモル)、p-メトキシフェノール(東京化成工業(株)製)0.005g、ピリジン(東京化成工業(株)製)4.75gをテトラヒドロフラン(東京化成工業(株)製)80mLに溶解し、0℃に冷却した。次いで、メタクリル酸クロリド(東京化成工業(株)製)5.75g(55ミリモル)を1時間かけて滴下し、0℃~10℃で1時間攪拌した後、25℃に昇温し、2時間攪拌した。続いて、これを酢酸エチル800mLに溶解し、分液ロートに移した。これを水300mL、希塩酸300mL、飽和重曹水300mL、飽和食塩水で洗浄し、硫酸マグネシウムで乾燥し、ろ過した後、エバポレーターで溶媒を除去し、45℃で24時間乾燥し、CS-1を15g得た。CS-1である事は1H-NMRスペクトルから確認した。 [Polymerizable compound]
-SR-209: SR-209 (manufactured by Sartmer)
-SR-231: SR-231 (manufactured by Sartmer)
・ ADPH: Dipentaerythritol hexaacrylate (Shin-Nakamura Chemical)
-CS-1: A compound having the following structure
[Synthesis of CS-1]
14.6 g (50 mmol) of CS-1 synthesized above, 0.005 g of p-methoxyphenol (manufactured by Tokyo Chemical Industry Co., Ltd.), and pyridine (Tokyo Chemical Industry Co., Ltd.) in a flask equipped with a stirrer and a condenser. )) 4.75 g was dissolved in 80 mL of tetrahydrofuran (manufactured by Tokyo Chemical Industry Co., Ltd.) and cooled to 0 ° C. Next, 5.75 g (55 mmol) of methacrylic acid chloride (manufactured by Tokyo Chemical Industry Co., Ltd.) was added dropwise over 1 hour, stirred at 0 ° C to 10 ° C for 1 hour, then heated to 25 ° C for 2 hours. Stirred. Subsequently, this was dissolved in 800 mL of ethyl acetate and transferred to a separating funnel. This was washed with 300 mL of water, 300 mL of dilute hydrochloric acid, 300 mL of saturated brine, saturated brine, dried over magnesium sulfate, filtered, the solvent was removed with an evaporator, dried at 45 ° C. for 24 hours, and 15 g of CS-1 was added. Obtained. It was confirmed from 1 H-NMR spectrum that it was CS-1.
・OXE-01:IRGACURE OXE 01(BASF社製)
・OXE-02:IRGACURE OXE 02(BASF社製) [Polymer initiator (both trade names)]
・ OXE-01: IRGACURE OXE 01 (manufactured by BASF)
OXE-02: IRGACURE OXE 02 (manufactured by BASF)
・D-1~D-2:下記構造の化合物
・D-3:WPBG-027(富士フイルム和光純薬(株)製)
-D-1 to D-2: Compounds with the following structure-D-3: WPBG-027 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
・E-1~E-6:下記構造の化合物
E-1 to E-6: Compounds with the following structure
・F-1~F-3:下記構造の化合物
-F-1 to F-3: Compounds with the following structure
・G-1:1,4-ベンゾキノン
・G-2:4-メトキシフェノール
・G-3:1,4-ジヒドロキシベンゼン
・G-4:下記構造の化合物
G-1: 1,4-benzoquinone, G-2: 4-methoxyphenol, G-3: 1,4-dihydroxybenzene, G-4: a compound having the following structure
・H-1:N-フェニルジエタノールアミン(東京化成工業(株)製) [Other additives]
・ H-1: N-Phenyldiethanolamine (manufactured by Tokyo Chemical Industry Co., Ltd.)
・DMSO:ジメチルスルホキシド
・GBL:γ-ブチロラクトン
・NMP:N-メチルピロリドン
表中、「DMSO/GBL」の記載はDMSOとGBLをDMSO:GBL=80:20の混合比(質量比)で混合したものを用いたことを示している。 〔solvent〕
-DMSO: dimethyl sulfoxide-GBL: γ-butyrolactone-NMP: N-methylpyrrolidone In the table, the description of "DMSO / GBL" is that DMSO and GBL were mixed at a mixing ratio (mass ratio) of DMSO: GBL = 80: 20. It shows that the thing was used.
〔耐薬品性の評価〕
各実施例及び比較例において調製した各樹脂組成物又は比較用組成物を、それぞれ、シリコンウエハ上にスピンコート法により適用し、樹脂組成物層を形成した。得られた樹脂組成物層を適用したシリコンウエハをホットプレート上で、100℃で5分間乾燥し、シリコンウエハ上に15μmの均一な厚さの樹脂組成物層を形成した。シリコンウェハ上の樹脂組成物層を、ステッパー(Nikon NSR 2005 i9C)を用いて、500mJ/cm2の露光エネルギーで全面露光し、露光した樹脂組成物層(樹脂層)を、窒素雰囲気下で、10℃/分の昇温速度で昇温し、表の「硬化条件」の「温度」の欄に記載の温度で180分間加熱して、樹脂組成物層の硬化層(樹脂層)を得た。
得られた樹脂層について下記の薬液に下記の条件で浸漬し、溶解速度を算定した。
薬液:ジメチルスルホキシド(DMSO)と25質量%のテトラメチルアンモニウムヒドロキシド(TMAH)水溶液の90:10(質量比)の混合物
評価条件:薬液中でに樹脂層を75℃で15分間浸漬して浸漬前後の膜厚を比較し、溶解速度(nm/分)を算出した。膜厚は、エリプソメーター(Foothill社製KT-22)で塗布面10点において膜厚測定を実施し、その算術平均値として求めた。
評価は下記評価基準に従って行い、評価結果は表の「耐薬品性」の欄に記載した。溶解速度が小さいほど、耐薬品性に優れるといえる。
-評価基準-
A:溶解速度が200nm/分未満であった。
B:溶解速度が200nm/分以上300nm/分未満であった。
C:溶解速度が300nm/分以上400nm/分未満であった。
D:溶解速度が400nm/分以上であった。 <Evaluation>
[Evaluation of chemical resistance]
Each resin composition or comparative composition prepared in each Example and Comparative Example was applied onto a silicon wafer by a spin coating method to form a resin composition layer. The silicon wafer to which the obtained resin composition layer was applied was dried on a hot plate at 100 ° C. for 5 minutes to form a resin composition layer having a uniform thickness of 15 μm on the silicon wafer. The resin composition layer on the silicon wafer was completely exposed to the entire surface with an exposure energy of 500 mJ / cm 2 using a stepper (Nikon NSR 2005 i9C), and the exposed resin composition layer (resin layer) was subjected to a nitrogen atmosphere. The temperature was raised at a heating rate of 10 ° C./min and heated at the temperature described in the "Temperature" column of "Curing Conditions" in the table for 180 minutes to obtain a cured layer (resin layer) of the resin composition layer. ..
The obtained resin layer was immersed in the following chemical solution under the following conditions, and the dissolution rate was calculated.
Chemical solution: Mixture of dimethylsulfoxide (DMSO) and 25% by mass tetramethylammonium hydroxide (TMAH) aqueous solution at 90:10 (mass ratio) Evaluation conditions: Immerse the resin layer in the chemical solution at 75 ° C. for 15 minutes. The dissolution rate (nm / min) was calculated by comparing the film thicknesses before and after. The film thickness was measured at 10 points on the coated surface with an ellipsometer (KT-22 manufactured by Foothill), and the film thickness was determined as the arithmetic mean value.
The evaluation was performed according to the following evaluation criteria, and the evaluation results are described in the "Chemical resistance" column of the table. It can be said that the smaller the dissolution rate, the better the chemical resistance.
-Evaluation criteria-
A: The dissolution rate was less than 200 nm / min.
B: The dissolution rate was 200 nm / min or more and less than 300 nm / min.
C: The dissolution rate was 300 nm / min or more and less than 400 nm / min.
D: The dissolution rate was 400 nm / min or more.
各実施例及び比較例において、それぞれ、樹脂組成物又は比較用組成物をスピンコート法でシリコンウェハ上に適用して樹脂組成物層を形成した。得られた樹脂組成物層を適用したシリコンウェハをホットプレート上で、100℃で5分間乾燥し、シリコンウェハ上に約15μmの厚さの均一な硬化性樹脂組成物層を得た。上記硬化性樹脂組成物層の反射分光膜厚計(FE-3000大塚電子製)を用いて、膜厚を測定し、この値を「膜厚A」とした。
続いて、得られた硬化性樹脂組成物層の全面に対して、ステッパー(Nikon NSR 2005 i9C)を用いて、500mJ/cm2の露光エネルギーでi線露光した。
上記露光後の硬化性樹脂組成物層(樹脂層)を、窒素雰囲気下で、10℃/分の昇温速度で昇温し、表の「硬化温度(℃)」の欄に記載の温度に達した後、3時間加熱し、25℃まで冷却した。
上記組成物層の反射分光膜厚計(FE-3000大塚電子製)を用いて、膜厚を測定し、この値を「膜厚B」とした。
下記計算式から、膜の収縮率を算出した。
計算式: 収縮率(%)=100-(膜厚B÷膜厚A×100)
下記評価基準に従って評価を行い、評価結果は表の「硬化収縮性」の欄に記載した。上記収縮率の値が小さいほど、得られる硬化収縮性に優れるといえる。
(評価基準)
A:膜の収縮率が20%未満であった。
B:膜の収縮率が20%以上25%未満であった。
C:膜の収縮率が25%以上30%未満であった。
D:膜の収縮率が30%以上であった。 [Evaluation of curing shrinkage]
In each Example and Comparative Example, a resin composition or a comparative composition was applied onto a silicon wafer by a spin coating method to form a resin composition layer. The silicon wafer to which the obtained resin composition layer was applied was dried on a hot plate at 100 ° C. for 5 minutes to obtain a uniform curable resin composition layer having a thickness of about 15 μm on the silicon wafer. The film thickness was measured using a reflection spectroscopic film thickness meter (manufactured by FE-3000 Otsuka Electronics Co., Ltd.) of the curable resin composition layer, and this value was defined as "film thickness A".
Subsequently, the entire surface of the obtained curable resin composition layer was exposed to i-line with an exposure energy of 500 mJ / cm 2 using a stepper (Nikon NSR 2005 i9C).
The curable resin composition layer (resin layer) after the exposure was heated at a heating rate of 10 ° C./min under a nitrogen atmosphere to the temperature described in the "curing temperature (° C.)" column of the table. After reaching, it was heated for 3 hours and cooled to 25 ° C.
The film thickness was measured using a reflection spectroscopic film thickness meter (manufactured by FE-3000 Otsuka Electronics Co., Ltd.) of the composition layer, and this value was defined as "film thickness B".
The shrinkage rate of the membrane was calculated from the following formula.
Calculation formula: Shrinkage rate (%) = 100- (film thickness B ÷ film thickness A × 100)
The evaluation was performed according to the following evaluation criteria, and the evaluation results are described in the "curing shrinkage" column of the table. It can be said that the smaller the value of the shrinkage rate, the better the obtained curing shrinkage.
(Evaluation criteria)
A: The shrinkage rate of the membrane was less than 20%.
B: The shrinkage rate of the membrane was 20% or more and less than 25%.
C: The shrinkage rate of the membrane was 25% or more and less than 30%.
D: The shrinkage rate of the membrane was 30% or more.
各実施例及び比較例において、それぞれ、硬化性樹脂組成物5.0g又は比較用組成物5.0gに、DMSO(ジメチルスルホキシド)/γ-BL(γ-ブチロラクトン)=50/50(質量%)溶液を2.5g添加し、溶解させ、レジスト溶液を得た。
上記で得られたレジスト溶液について下記の条件でろ過時の圧力を測定した。
測定機器:デジタルフォースゲージ(株式会社イマダ製)、測定スタンド(株式会社イマダ製)
レジスト溶液を0.5μmのフィルターを取り付けたシリンジに3mL測り取り、上記測定スタンドにセットした。
これをデジタルフォースゲージで3mL/1分の速度でシリンジを押し込み、その時の押し込む際に要した力を測定した。
評価は下記評価基準に従って行い、評価結果は表の「ろ過性」の欄に記載した。押し込む際に要した力(N)が小さいほど、ろ過性に優れるといえる。
-評価基準-
A: 押し込む際に要した力が0~50N(ニュートン)未満であった。
B: 押し込む際に要した力が50N以上~100N未満であった。
C: 押し込む際に要した力が100N以上であった。 [Evaluation of filterability]
In each Example and Comparative Example, DMSO (dimethyl sulfoxide) / γ-BL (γ-butyrolactone) = 50/50 (mass%) was added to 5.0 g of the curable resin composition or 5.0 g of the comparative composition, respectively. 2.5 g of the solution was added and dissolved to obtain a resist solution.
The pressure of the resist solution obtained above during filtration was measured under the following conditions.
Measuring equipment: Digital force gauge (manufactured by Imada Co., Ltd.), Measuring stand (manufactured by Imada Co., Ltd.)
3 mL of the resist solution was measured in a syringe equipped with a 0.5 μm filter and set on the above measuring stand.
The syringe was pushed in at a speed of 3 mL / 1 minute with a digital force gauge, and the force required for pushing at that time was measured.
The evaluation was performed according to the following evaluation criteria, and the evaluation results are described in the "filterability" column of the table. It can be said that the smaller the force (N) required for pushing is, the better the filterability is.
-Evaluation criteria-
A: The force required for pushing was less than 0 to 50 N (Newton).
B: The force required for pushing was 50 N or more and less than 100 N.
C: The force required for pushing was 100 N or more.
比較例1~3に係る比較用組成物において用いられた樹脂は、樹脂の主鎖と重合性基とがウレア結合を含む連結基により結合する構造を含まない。
また、比較例1~3に係る比較用組成物において用いられた樹脂は、ウレア結合及び重合性基を有する分子鎖を含まない。
このような比較用組成物からなる硬化物は、耐薬品性に劣ることがわかる。 From the above results, it can be seen that the cured product made of the resin composition according to the present invention has excellent chemical resistance.
The resin used in the comparative compositions according to Comparative Examples 1 to 3 does not contain a structure in which the main chain of the resin and the polymerizable group are bonded by a linking group containing a urea bond.
Further, the resin used in the comparative compositions according to Comparative Examples 1 to 3 does not contain a molecular chain having a urea bond and a polymerizable group.
It can be seen that the cured product made of such a comparative composition is inferior in chemical resistance.
実施例1において使用した樹脂組成物を、表面に銅薄層が形成された樹脂基材の銅薄層の表面にスピンコート法により層状に適用して、100℃で4分間乾燥し、膜厚20μmの樹脂組成物層を形成した後、ステッパー((株)ニコン製、NSR1505 i6)を用いて露光した。露光はマスク(パターンが1:1ラインアンドスペースであり、線幅が10μmであるバイナリマスク)を介して、波長365nmで行った。露光後、100℃で4分間加熱した。上記加熱後、シクロヘキサノンで2分間現像し、PGMEAで30秒間リンスし、層のパターンを得た。
次いで、窒素雰囲気下で、10℃/分の昇温速度で昇温し、230℃に達した後、230℃で3時間維持して、再配線層用層間絶縁膜を形成した。この再配線層用層間絶縁膜は、絶縁性に優れていた。
また、これらの再配線層用層間絶縁膜を使用して半導体デバイスを製造したところ、問題なく動作することを確認した。 <Example 101>
The resin composition used in Example 1 was applied in a layered manner on the surface of the copper thin layer of the resin base material having the copper thin layer formed on the surface by a spin coating method, dried at 100 ° C. for 4 minutes, and subjected to a film thickness. After forming a 20 μm resin composition layer, exposure was performed using a stepper (NSR1505 i6, manufactured by Nikon Corporation). Exposure was performed via a mask (a binary mask with a pattern of 1: 1 line and space and a line width of 10 μm) at a wavelength of 365 nm. After the exposure, it was heated at 100 ° C. for 4 minutes. After the above heating, it was developed with cyclohexanone for 2 minutes and rinsed with PGMEA for 30 seconds to obtain a layer pattern.
Next, the temperature was raised at a heating rate of 10 ° C./min under a nitrogen atmosphere, and after reaching 230 ° C., the temperature was maintained at 230 ° C. for 3 hours to form an interlayer insulating film for the rewiring layer. The interlayer insulating film for the rewiring layer was excellent in insulating property.
Moreover, when a semiconductor device was manufactured using these interlayer insulating films for the rewiring layer, it was confirmed that the semiconductor device operated without any problem.
Claims (16)
- 環化樹脂又はその前駆体である樹脂、及び、
重合開始剤を含み、
前記樹脂が重合性基を含む側鎖を有し、
前記樹脂の主鎖と前記重合性基が連結基を介して結合しており、
前記連結基がウレア結合を含む、
樹脂組成物。 Cyclic resin or its precursor resin, and
Contains a polymerization initiator,
The resin has a side chain containing a polymerizable group and has a side chain.
The main chain of the resin and the polymerizable group are bonded via a linking group.
The linking group comprises a urea bond,
Resin composition. - 前記側鎖が、下記式(1-1)で表される構造である、請求項1に記載の樹脂組成物。
式(1-1)中、Rp1は少なくとも1つの重合性基を含む基を表し、RNはそれぞれ独立に、水素原子又は炭化水素基を表し、L1は2価の連結基を表し、*は主鎖との結合部位を表す。 The resin composition according to claim 1, wherein the side chain has a structure represented by the following formula (1-1).
In formula (1-1), R p1 represents a group containing at least one polymerizable group, RN independently represents a hydrogen atom or a hydrocarbon group, and L 1 represents a divalent linking group. * Represents the binding site with the main chain. - 環化樹脂又はその前駆体である樹脂、及び、
重合開始剤を含み、
前記樹脂が重合性基を有する構造として、下記式(1-2)で表される構造を含む、
樹脂組成物。
式(1-2)中、Rp2は少なくとも1つの重合性基を含む基を表し、RNはそれぞれ独立に、水素原子又は炭化水素基を表しL2は2価の連結基を表し、*は他の構造との結合部位を表す。 Cyclic resin or its precursor resin, and
Contains a polymerization initiator,
As a structure in which the resin has a polymerizable group, a structure represented by the following formula (1-2) is included.
Resin composition.
In formula (1-2), R p2 represents a group containing at least one polymerizable group, RN independently represents a hydrogen atom or a hydrocarbon group, and L 2 represents a divalent linking group, *. Represents a binding site with another structure. - 前記樹脂が、下記式(2)で表される繰返し単位を含むポリイミド前駆体、下記式(4)で表される繰返し単位を含むポリイミド、下記式(3)で表される繰返し単位を含むポリベンゾオキサゾール前駆体、下記式(x)で表される繰返し単位を含むポリベンゾオキサゾール、下記式(PAI-2)で表されるポリアミドイミド前駆体、及び、式(PAI-3)で表される繰返し単位を含むポリアミドイミドよりなる群から選ばれた少なくとも1種の樹脂である、請求項3に記載の樹脂組成物。
式(2)中、A1及びA2は、それぞれ独立に、酸素原子又は-NH-を表し、R111は、2価の有機基を表し、R115は、4価の有機基を表し、R113及びR114は、それぞれ独立に、水素原子又は1価の有機基を表し、R111、R113、R114及びR115よりなる群から選ばれた少なくとも1つに、式(1-2)で表される構造を含む;
式(4)中、R131は、2価の有機基を表し、R132は、4価の有機基を表し、R132及びR131の少なくとも一方に前記式(1-2)で表される構造を含む;
式(3)中、R121は、2価の有機基を表し、R122は、4価の有機基を表し、R123及びR124は、それぞれ独立に、水素原子又は1価の有機基を表し、R121、R122、R123及びR124よりなる群から選ばれた少なくとも1つに、前記式(1-2)で表される構造を含む;
式(X)中、R133は、2価の有機基を表し、R134は、4価の有機基を表し、R134及びR133の少なくとも一方に前記式(1-2)で表される構造を含む;
式(PAI-2)中、R117は3価の有機基を表し、R111は2価の有機基を表し、A2は酸素原子又は-NH-を表し、R113は水素原子又は1価の有機基を表し、R111、R113及びR117よりなる群から選ばれた少なくとも1つに、前記式(1-2)で表される構造を含む;
式(PAI-2)中、R117は3価の有機基を表し、R111は2価の有機基を表し、R111及びR117の少なくとも一方に前記式(1-2)で表される構造を含む。 The resin contains a polyimide precursor containing a repeating unit represented by the following formula (2), a polyimide containing a repeating unit represented by the following formula (4), and a poly containing a repeating unit represented by the following formula (3). A benzoxazole precursor, a polybenzoxazole containing a repeating unit represented by the following formula (x), a polyamide-imide precursor represented by the following formula (PAI-2), and a formula (PAI-3). The resin composition according to claim 3, which is at least one resin selected from the group consisting of polyamide-imide containing a repeating unit.
In formula (2), A 1 and A 2 independently represent an oxygen atom or -NH-, R 111 represents a divalent organic group, and R 115 represents a tetravalent organic group. R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group, and the formula (1-2) is given to at least one selected from the group consisting of R 111 , R 113 , R 114 and R 115 . ) Includes the structure represented by;
In the formula (4), R 131 represents a divalent organic group, R 132 represents a tetravalent organic group, and at least one of R 132 and R 131 is represented by the above formula (1-2). Including structure;
In formula (3), R 121 represents a divalent organic group, R 122 represents a tetravalent organic group, and R 123 and R 124 each independently represent a hydrogen atom or a monovalent organic group. Represented, at least one selected from the group consisting of R 121 , R 122 , R 123 and R 124 includes the structure represented by the above formula (1-2);
In the formula (X), R 133 represents a divalent organic group, R 134 represents a tetravalent organic group, and at least one of R 134 and R 133 is represented by the above formula (1-2). Including structure;
In formula (PAI-2), R 117 represents a trivalent organic group, R 111 represents a divalent organic group, A 2 represents an oxygen atom or -NH-, and R 113 represents a hydrogen atom or monovalent. At least one selected from the group consisting of R 111 , R 113 and R 117 contains the structure represented by the above formula (1-2);
In the formula (PAI-2), R 117 represents a trivalent organic group, R 111 represents a divalent organic group, and at least one of R 111 and R 117 is represented by the above formula (1-2). Includes structure. - 前記樹脂における前記重合性基が、ラジカル重合性基である、請求項1~4のいずれか1項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 4, wherein the polymerizable group in the resin is a radically polymerizable group.
- 前記樹脂が、ポリイミド、ポリイミド前駆体、ポリベンゾオキサゾール、ポリベンゾオキサゾール前駆体、ポリアミドイミド、及び、ポリアミドイミド前駆体よりなる群から選ばれた少なくとも1種の樹脂である、請求項1~5のいずれか1項に記載の樹脂組成物。 The resin according to claim 1 to 5, wherein the resin is at least one resin selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, and polyamideimide precursor. The resin composition according to any one item.
- 前記樹脂の酸価が、0mmol/g~1.2mmol/gである、請求項1~6のいずれか1項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 6, wherein the acid value of the resin is 0 mmol / g to 1.2 mmol / g.
- 重合性化合物を更に含む、請求項1~7のいずれか1項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 7, further comprising a polymerizable compound.
- 塩基発生剤を更に含む、請求項1~8のいずれか1項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 8, further comprising a base generator.
- 再配線層用層間絶縁膜の形成に用いられる、請求項1~9のいずれか1項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 9, which is used for forming an interlayer insulating film for a rewiring layer.
- 請求項1~10のいずれか1項に記載の樹脂組成物を硬化してなる硬化物。 A cured product obtained by curing the resin composition according to any one of claims 1 to 10.
- 請求項11に記載の硬化物からなる層を2層以上含み、前記硬化物からなる層同士のいずれかの間に金属層を含む積層体。 A laminated body containing two or more layers made of the cured product according to claim 11, and containing a metal layer between any of the layers made of the cured product.
- 請求項1~10のいずれか1項に記載の樹脂組成物を基材上に適用して膜を形成する膜形成工程を含む、硬化物の製造方法。 A method for producing a cured product, which comprises a film forming step of applying the resin composition according to any one of claims 1 to 10 onto a substrate to form a film.
- 前記膜を選択的に露光する露光工程及び前記膜を現像液を用いて現像してパターンを形成する現像工程を含む、請求項13に記載の硬化物の製造方法。 The method for producing a cured product according to claim 13, further comprising an exposure step of selectively exposing the film and a developing step of developing the film with a developer to form a pattern.
- 前記膜を50~450℃で加熱する加熱工程を含む、請求項13又は14に記載の硬化物の製造方法。 The method for producing a cured product according to claim 13, which comprises a heating step of heating the film at 50 to 450 ° C.
- 請求項11に記載の硬化物又は請求項12に記載の積層体を含む、半導体デバイス。 A semiconductor device comprising the cured product according to claim 11 or the laminate according to claim 12.
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KR1020237021127A KR20230110590A (en) | 2020-12-28 | 2021-12-24 | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device |
CN202180087350.4A CN116724071A (en) | 2020-12-28 | 2021-12-24 | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device |
JP2022573051A JPWO2022145356A1 (en) | 2020-12-28 | 2021-12-24 |
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KR (1) | KR20230110590A (en) |
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WO2024024833A1 (en) * | 2022-07-28 | 2024-02-01 | 富士フイルム株式会社 | Resin composition, cured product, laminate, cured product manufacturing method, laminate manufacturing method, semiconductor device manufacturing method, semiconductor device, resin film, and compound |
WO2024048603A1 (en) * | 2022-08-31 | 2024-03-07 | 富士フイルム株式会社 | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device |
WO2024063025A1 (en) * | 2022-09-21 | 2024-03-28 | 富士フイルム株式会社 | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device |
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JPH05301959A (en) * | 1992-01-20 | 1993-11-16 | Hitachi Chem Co Ltd | New diamino compound, polyamic acid resin, polyamic acid ester resin, polyimide resin, production thereof, photosensitive resin composition containing the same resin, polyimidazopyrrolone resin and polyimidazopyrrolone imide resin |
JPH07196917A (en) * | 1993-12-28 | 1995-08-01 | Shin Etsu Chem Co Ltd | Photosensitive resin composition and formation of patterned polyimide film by using the same |
WO2006008991A1 (en) * | 2004-07-16 | 2006-01-26 | Asahi Kasei Emd Corporation | Polyamide |
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JP3289399B2 (en) | 1993-05-19 | 2002-06-04 | 東レ株式会社 | Photosensitive polyimide precursor composition |
US20100247821A1 (en) | 2007-08-27 | 2010-09-30 | Valspar Sourcing, Inc. | Oxygen Scavenging Composition |
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2021
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- 2021-12-24 WO PCT/JP2021/048099 patent/WO2022145356A1/en active Application Filing
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Patent Citations (3)
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JPH05301959A (en) * | 1992-01-20 | 1993-11-16 | Hitachi Chem Co Ltd | New diamino compound, polyamic acid resin, polyamic acid ester resin, polyimide resin, production thereof, photosensitive resin composition containing the same resin, polyimidazopyrrolone resin and polyimidazopyrrolone imide resin |
JPH07196917A (en) * | 1993-12-28 | 1995-08-01 | Shin Etsu Chem Co Ltd | Photosensitive resin composition and formation of patterned polyimide film by using the same |
WO2006008991A1 (en) * | 2004-07-16 | 2006-01-26 | Asahi Kasei Emd Corporation | Polyamide |
Cited By (3)
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WO2024024833A1 (en) * | 2022-07-28 | 2024-02-01 | 富士フイルム株式会社 | Resin composition, cured product, laminate, cured product manufacturing method, laminate manufacturing method, semiconductor device manufacturing method, semiconductor device, resin film, and compound |
WO2024048603A1 (en) * | 2022-08-31 | 2024-03-07 | 富士フイルム株式会社 | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device |
WO2024063025A1 (en) * | 2022-09-21 | 2024-03-28 | 富士フイルム株式会社 | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device |
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