WO2022144598A1 - Système et procédé d'évaluation d'un dispositif électronique - Google Patents

Système et procédé d'évaluation d'un dispositif électronique Download PDF

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Publication number
WO2022144598A1
WO2022144598A1 PCT/IB2021/051118 IB2021051118W WO2022144598A1 WO 2022144598 A1 WO2022144598 A1 WO 2022144598A1 IB 2021051118 W IB2021051118 W IB 2021051118W WO 2022144598 A1 WO2022144598 A1 WO 2022144598A1
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WIPO (PCT)
Prior art keywords
electronic device
cosmetic
evaluator
damages
processing subsystem
Prior art date
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PCT/IB2021/051118
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English (en)
Inventor
Anish AGARWAL
Original Assignee
Agarwal Anish
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of WO2022144598A1 publication Critical patent/WO2022144598A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]

Definitions

  • Embodiments of the present disclosure relate to a recycling device and more particularly to a system and method for evaluation of an electronic device.
  • Consumer electronic devices such as mobile phones, laptop computers, notebooks, tablets, and the like are ubiquitous. Such consumer electronic devices are tremendously utilized all over the world and the number of these devices available are more than there are people on the planet. Part of the reason for the rapid growth in the number of the consumer electronic devices such as mobile phones is the rapid pace at which these devices are evolving with one or more latest features and the increased demand of such devices for handling one or more applications. As a result of the rapid pace of development, a relatively high percentage of mobile phones are replaced every year as consumers continually upgrade their electronic devices to obtain the latest features or a better operating plan. Generally, for replacement of mobile phones, many electronic device retailers and cell carrier stores offer mobile phone trade-in or buyback programs. Also, before replacement, value analysis of the electronic devices is done by the electronic device retailers so that the electronic devices do not end up in landfills or are improperly disassembled or disposed of in one or more areas.
  • systems available for valuation of the electronic devices include collecting several electronic devices in a device collection centre and analysing each of the components of the electronic devices individually.
  • a conventional system focuses mainly on one or more software problems of the electronic devices such as software upgradation problem, software version problem, software activation problem and the like.
  • a conventional system evaluates one or more hardware problems associated with the electronic device such as network connectivity, one or more physical damages and the like through manual intervention.
  • the manual intervention of evaluation of the electronic device is a complete subjective process which discourages trade-in vendors to take risk of over stating the price of the electronic devices.
  • such a conventional system due to involvement of the manual intervention, creates confusion between customers as the customers always get different quotes for their old electronic devices every time, they go to the trade-in vendor.
  • a system for evaluation of electronic device includes a modular apparatus.
  • the modular apparatus includes a top surface assembled with a plurality of walls.
  • the top surface includes an evaluator device locator to hold an evaluator device at a predefined orientation, wherein the evaluator device locator slides in a vertical direction to adjust and align position of an image capturing unit of the evaluator device with an opening on the top surface.
  • the top surface also includes a stopper located at a predetermined distance from the evaluator device locator. The stopper is configured to lock the evaluator device disposed at the predefined orientation using a screwing mechanism.
  • the modular apparatus also includes an electronic device placement platform located inside the apparatus.
  • the electronic device placement platform is adapted to receive an electronic device at a predetermined angle for inspection.
  • the modular apparatus also includes a retractable door provided at one side of at least one wall among the plurality of walls. The retractable door enables access of the electronic device placed on the electronic device placement platform.
  • the system also includes a processing subsystem hosted on a remote server and communicatively coupled to the modular apparatus.
  • the processing subsystem includes an image receiving module configured to receive one or more images of the electronic device captured by the image capturing unit of the evaluator device via a communication network.
  • the processing subsystem also includes an image analysis module operatively coupled to the image receiving module.
  • the image analysis module is configured to identify one or more cosmetic damages of the electronic device based on the one or more images of the electronic device received using a learning-based damage identification technique.
  • the image analysis module is also configured to determine at least one visualization parameter associated with the one or more cosmetic damages identified of the electronic device.
  • the processing subsystem also includes a cosmetic damage evaluation module operatively coupled to the image analysis module.
  • the cosmetic damage evaluation module is configured to map the at least one visualization parameter determined of the one or more cosmetic damages with a corresponding industrial cosmetic grading standard matrix.
  • the cosmetic damage evaluation module is also configured to assign a cosmetic grade corresponding to the at least one visualization parameter of the one or more cosmetic damages of the electronic device upon mapping.
  • the cosmetic damage evaluation module is also configured to evaluate a value of the electronic device based on the cosmetic grade assigned.
  • a method for evaluation of an electronic device includes constructing a modular apparatus comprising a top surface, wherein the top surface is assembled with a plurality of walls, wherein the top surface comprises an evaluator device locator to hold an evaluator device at a predefined orientation, wherein the evaluator device locator slides in a vertical direction to adjust and align position of an image capturing unit of the evaluator device with an opening on the top surface.
  • the method also includes locating a stopper at a predetermined distance from the evaluator device locator, wherein the stopper is configured to lock the evaluator device disposed at the predefined orientation using a screwing mechanism.
  • the method also includes placing an electronic device placement platform inside the apparatus, wherein the electronic device placement platform is adapted to receive an electronic device at a predetermined angle for inspection.
  • the method also includes providing a retractable door at one side of at least one wall among the plurality of walls, wherein the retractable door enables access of the electronic device placed on the electronic device placement platform.
  • the method also includes receiving, by an image receiving module of a processing subsystem hosted on a remote server, one or more images of the electronic device captured by the image capturing unit of the evaluator device via a communication network.
  • the method also includes identifying, by an image analysis module of the processing subsystem, one or more cosmetic damages of the electronic device based on the one or more images of the electronic device received using a learning-based damage identification technique.
  • the method also includes determining, by the image analysis module of the processing subsystem, at least one visualization parameter associated with the one or more cosmetic damages identified of the electronic device.
  • the method also includes mapping, by a cosmetic damage evaluation module of the processing subsystem, the at least one visualization parameter determined of the one or more cosmetic damages with a corresponding industrial cosmetic grading standard matrix.
  • the method also includes assigning, by the cosmetic damage evaluation module of the processing subsystem, a cosmetic grade corresponding to the at least one visualization parameter of the one or more cosmetic damages of the electronic device upon mapping.
  • the method also includes evaluating, by the cosmetic damage evaluation module of the processing subsystem, a value of the electronic device based on the cosmetic grade assigned.
  • FIG. 1 is a block diagram of a system for evaluation of an electronic device in accordance with an embodiment of the present disclosure
  • FIG. 2 represents a schematic representation of an embodiment for evaluation of an electronic device of a system of FIG.l in accordance with an embodiment of the present disclosure
  • FIG. 3 illustrates a schematic representation of an exemplary embodiment of a system for evaluation of an electronic device of FIG.l in accordance with an embodiment of the present disclosure
  • FIG. 4 is a block diagram of a computer or a server in accordance with an embodiment of the present disclosure.
  • FIG. 5 (a) and FIG. 5 (b) is a flow chart representing the steps involved in a method for evaluation of an electronic device in accordance with the embodiment of the present disclosure.
  • Embodiments of the present disclosure relate to a system and a method for evaluation of an electronic device.
  • the system includes a modular apparatus.
  • the modular apparatus includes a top surface assembled with a plurality of walls.
  • the top surface includes an evaluator device locator to hold an evaluator device at a predefined orientation, wherein the evaluator device locator slides in a vertical direction to adjust and align position of an image capturing unit of the evaluator device with an opening on the top surface.
  • the top surface also includes a stopper located at a predetermined distance from the evaluator device locator. The stopper is configured to lock the evaluator device disposed at the predefined orientation using a screwing mechanism.
  • the modular apparatus also includes an electronic device placement platform located inside the apparatus.
  • the electronic device placement platform is adapted to receive an electronic device at a predetermined angle for inspection.
  • the modular apparatus also includes a retractable door provided at one side of at least one wall among the plurality of walls. The retractable door enables access of the electronic device placed on the electronic device placement platform.
  • the system also includes a processing subsystem hosted on a remote server and communicatively coupled to the modular apparatus.
  • the processing subsystem includes an image receiving module configured to receive one or more images of the electronic device captured by the image capturing unit of the evaluator device via a communication network.
  • the processing subsystem also includes an image analysis module operatively coupled to the image receiving module.
  • the image analysis module is configured to identify one or more cosmetic damages of the electronic device based on the one or more images of the electronic device received using a learning-based damage identification technique.
  • the image analysis module is also configured to determine at least one visualization parameter associated with the one or more cosmetic damages identified of the electronic device.
  • the processing subsystem also includes a cosmetic damage evaluation module operatively coupled to the image analysis module.
  • the cosmetic damage evaluation module is configured to map the at least one visualization parameter determined of the one or more cosmetic damages with a corresponding industrial cosmetic grading standard matrix.
  • the cosmetic damage evaluation module is also configured to assign a cosmetic grade corresponding to the at least one visualization parameter of the one or more cosmetic damages of the electronic device upon mapping.
  • the cosmetic damage evaluation module is also configured to evaluate a value of the electronic device based on the cosmetic grade assigned.
  • FIG. 1 is a block diagram of a system (100) for evaluation of an electronic device in accordance with an embodiment of the present disclosure.
  • the system (100) includes a modular apparatus (105).
  • the term ‘modular apparatus’ is defined as a compact grading box designed with inbuilt system and technology for evaluation of an electronic device.
  • the modular apparatus (105) includes a top surface (108) assembled with a plurality of walls (109).
  • the modular apparatus (105) may include an enclosed box.
  • the plurality of walls of the modular apparatus is joined at one or more predetermined points to form an enclosed structure.
  • the modular apparatus is manufactured from three-dimensional plastic material, aluminium material, steel material, cardboard material and the like.
  • the top surface (108) includes an evaluator device locator (110) to hold an evaluator device at a predefined orientation, wherein the evaluator device locator (110) slides in a vertical direction to adjust and align position of an image capturing unit of the evaluator device with an opening on the top surface.
  • the top surface (108) of the modular apparatus (105) is slanted over the plurality of walls so that the evaluator device is disposed at the predefined orientation for capturing one or more images of an electronic device placed inside the modular apparatus.
  • the term ‘evaluator device’ is defined as an agent mobile phone available with a seller or an inspection agent for evaluation of a customer’s used electronic device.
  • the evaluator device (111) may include a mobile phone associated with a retailer.
  • the top surface (108) also includes a stopper (112) located at a predetermined distance from the evaluator device locator. The stopper is configured to lock the evaluator device (111) disposed at the predefined orientation using a screwing mechanism.
  • the stopper (112) and the evaluator device locator (110) are aligned and adjusted corresponding to a predetermined model of the evaluator device placed on the top surface.
  • the modular apparatus is foldable and portable.
  • the modular apparatus (105) also includes an electronic device placement platform (not shown in FIG. 1) located inside the apparatus.
  • the electronic device placement platform is adapted to receive an electronic device at a predetermined angle for inspection.
  • the term ‘electronic device’ is defined as a hand-held mobile phone which is used by a customer for communication purpose.
  • the electronic device may include, but not limited to a smart phone, a mobile phone, a tablet and the like.
  • the electronic device platform is adjusted at the predetermined angle using the screwing mechanism based on a corresponding dimension of the electronic device placed for the inspection.
  • the electronic device platform is also kept at a slanted position in order to receive optimized amount of light from the image capturing unit of the evaluator electronic device at the predetermined angle for capturing of one or more high quality images.
  • the modular apparatus (105) also includes a retractable door (114) provided at one side of at least one wall (109) among the plurality of walls.
  • the retractable door (114) enables access of the electronic device placed on the electronic device placement platform.
  • the modular apparatus may include a lid located at the top surface. The lid at the top surface is opened and closed for accessing the electronic device placed at an internal area of the modular apparatus.
  • the modular apparatus (105) also includes a plurality of illumination means configured to illuminate an internal surface of the modular apparatus to facilitate capturing of the one or more images of the electronic device.
  • the plurality of illumination means may include a plurality of light emitting diodes (LEDs).
  • the system (100) also includes a processing subsystem (115) hosted on a remote server (118) and communicatively coupled to the modular apparatus (105).
  • the processing subsystem (115) includes an image receiving module (120) configured to receive one or more images of the electronic device captured by the image capturing unit of the evaluator device via a communication network.
  • the communication network may include a wired communication network.
  • the wired communication network may include, but not limited to, an ethernet cable, a fibre optic communication and the like.
  • the communication network may include a wireless communication network.
  • the wireless communication network may include, but not limited to, wifi, Bluetooth, Zigbee, near field communication (NFC), infra-red communication (RFID) and the like.
  • the one or more images of the electronic device may include at least one of a front side image of the electronic device, a rear side image of the electronic device, a left side view image of the electronic device, a right-side view of the electronic device or a combination thereof.
  • the processing subsystem (115) also includes an image analysis module (130) operatively coupled to the image receiving module (120).
  • the image analysis module (130) is configured to identify one or more cosmetic damages of the electronic device based on the one or more images of the electronic device received using a learningbased damage identification technique.
  • the one or more cosmetic damages may include at least one of one or more scratches, one or more cracks, one or more bends, one or more dents, colour damages or a combination thereof.
  • the learning-based damage identification technique may include identifying the one or more cosmetic damages using a convolutional neural network and a support vector machine (SVM). The learning -based damage identification technique is provided to generate a trained model which automatically identifies the one or more cosmetic damages of the electronic device.
  • SVM support vector machine
  • the trained model generated using the learning-based damage identification technique compares the one or more images of the electronic device received with one or more prestored images of the electronic device available in a database. Based on comparison of the one or more images of the electronic device received with the one or mor prestored images, the one or more cosmetic damages are identified by the trained model.
  • the image analysis module (130) is also configured to determine at least one visualization parameter associated with the one or more cosmetic damages identified of the electronic device.
  • the at least one visualization parameter may include at least one of a number of the one or more cosmetic damages, a size of the one or more cosmetic damages, a length of the one or more cosmetic damages or a combination thereof.
  • the length of the one or more cosmetic damages may include a length of less than equal to 5 millimetres (mm) for a line scratch.
  • the line scratch may have a width of less than equal to 0.2 mm.
  • the processing subsystem (115) also includes a cosmetic damage evaluation module (140) operatively coupled to the image analysis module (130).
  • the cosmetic damage evaluation module (140) is configured to map the at least one visualization parameter determined of the one or more cosmetic damages with a corresponding industrial cosmetic grading standard matrix.
  • industrial cosmetic grading standard matrix is defined as a chart prepared according to a country’s industrial standard for representing a relationship between a cosmetic grade corresponding to the one or more cosmetic damages of the electronic device.
  • the cosmetic damage evaluation module (140) is also configured to assign a cosmetic grade corresponding to the at least one visualization parameter of the one or more cosmetic damages of the electronic device upon mapping.
  • the cosmetic damage evaluation module (140) is also configured to evaluate a value of the electronic device based on the cosmetic grade assigned.
  • the cosmetic grade may include, but not limited to a first grade, a second grade, a third grade, a fourth grade, a fifth grade and the like.
  • the first grade may represent a good condition of the electronic device indicating an unused condition.
  • the second grade may represent no noticeable cosmetic damage condition or presence of one or more tiny scratches on a frame of the electronic device.
  • the third grade may represent one or more small scratches present on a screen of the electronic device.
  • the fourth grade may represent visible damage condition such as presence of one or more multiple scratches visible on several parts of the electronic device.
  • the fifth grade may represent a severely damaged condition of the electronic device with one or broken parts.
  • FIG. 2 represents a schematic representation of an embodiment for evaluation of an electronic device of a system (100) of FIG.1 in accordance with an embodiment of the present disclosure.
  • the system includes a modular apparatus (105) which includes a top surface (108).
  • the top surface (108) includes an evaluator device locator (110) and a stopper (112).
  • the modular apparatus (105) also includes an electronic device placement platform (not shown in FIG. 2), a retractable door (114).
  • the system (100) includes a processing subsystem (115) which includes an image receiving module (120), an image analysis module (130), and a cosmetic damage evaluation module (140).
  • the processing subsystem (115) also includes a functionality feature evaluation module (150).
  • the functionality feature evaluation module (150) is configured to enable pairing of the evaluator device with the electronic device via a scanning mechanism.
  • the scanning mechanism may include, but not limited to, a quick response code (QR) scanning mechanism, a barcode scanning mechanism, an alphanumeric code scanning mechanism and the like.
  • QR quick response code
  • the evaluator device is paired with the electronic device placed inside the modular apparatus upon scanning.
  • the functional feature evaluation module is also configured to determine one or more functional defects associated with the electronic device through a diagnostic test run on the electronic device upon pairing of the evaluator device with the electronic device.
  • the one or more functional defects may include at least one of a software problem, a Wi-Fi chipset problem, a volume problem of the electronic device, a Bluetooth TM connectivity problem, an operating system issue of the electronic device or a combination thereof.
  • the functionality feature evaluation module is also configured to assign a functionality grade for functional status evaluation of the electronic device based on the one or more functional defects determined.
  • the system evaluates the electronic device in an overall manner by capturing image of the customer’s electronic device using the evaluator device.
  • the functionality feature evaluation module assesses an internal condition of hardware components of the electronic device.
  • both cosmetic evaluation result as well as functional evaluation result are combined to provide a device grade/valuation, which is presented on the customer’s electronic device.
  • the customer’ s electronic device is evaluated only based on the cosmetic evaluation result.
  • FIG. 3 illustrates a schematic representation of an exemplary embodiment of a system (100) for evaluation of an electronic device of FIG.l in accordance with an embodiment of the present disclosure.
  • the system (100) is utilized by a retailer for managing trade-in process of an electronic device.
  • the system (100) automates evaluation of the electronic device’s cosmetics as well as functionality checks with high speed and accuracy.
  • the system (100) promotes trade- in process and often tends to encourage customers by offering fair trade-in prices mostly to protect their own risk of getting penalized by one or more mobile carriers.
  • the system (100) includes a modular apparatus (105).
  • the modular apparatus is an enclosed box like structure which includes a top surface assembled with a plurality of walls.
  • the plurality of walls of the modular apparatus (105) is joined at one or more predetermined points to form an enclosed structure.
  • the modular apparatus is manufactured from three-dimensional plastic material.
  • the top surface (108) includes an evaluator device locator (110) to hold an evaluator device (111) at a predefined orientation, wherein the evaluator device locator (110) slides in a vertical direction to adjust and align position of an image capturing unit of the evaluator device with an opening on the top surface.
  • the top surface (108) of the modular apparatus is slanted over the plurality of walls so that the evaluator device (110) is disposed at the predefined orientation for capturing one or more images of an electronic device placed inside the modular apparatus.
  • the modular apparatus (105) also includes an electronic device placement platform located inside the modular apparatus.
  • the electronic device placement platform is adapted to receive an electronic device at a predetermined angle for inspection.
  • the modular apparatus also includes a retractable door provided at one side of at least one wall among the plurality of walls. The retractable door enables access of the electronic device placed on the electronic device placement platform.
  • the retailer or a mobile inspection agent places the electronic device of the customer at the electronic device placement platform by opening the retractable door of the modular apparatus.
  • the retailer may adjust the height of the electronic device placement platform based on a predefined requirement.
  • the electronic device placement platform is generally adjusted in a slanted position so that ample amount of light falls on the electronic device at an optimal angle from a plurality of illumination means coupled at an internal surface of the modular apparatus.
  • the one or more images are transmitted to the image receiving module (120) via a wireless communication network (125).
  • an image analysis module (130) of the processing subsystem (115) identifies one or more cosmetic damages of the electronic device (117) based on the one or more images received of the electronic device using a learning-based damage identification technique.
  • the one or more cosmetic damages may include at least one of one or more scratches, one or more cracks, one or more bends, one or more dents, colour damages or a combination thereof.
  • the learning-based damage identification technique may include identifying the one or more cosmetic damages using a convolutional neural network and a support vector machine (SVM).
  • SVM support vector machine
  • the learning-based damage identification technique is provided to generate a trained model which automatically identifies the one or more cosmetic damages of the electronic device.
  • the trained model generated using the learning-based damage identification technique compares the one or more images of the electronic device received with one or more prestored images of the electronic device available in a database. Based on comparison of the one or more images of the electronic device received with the one or mor prestored images, the one or more cosmetic damages are identified by the trained model.
  • the image analysis module (130) determines at least one visualization parameter associated with the one or more cosmetic damages identified of the electronic device.
  • the at least one visualization parameter may include at least one of a number of the one or more cosmetic damages, a size of the one or more cosmetic damages, a length of the one or more cosmetic damages or a combination thereof.
  • the length of the one or more cosmetic damages may include a length of less than equal to 5 millimetres (mm) for a line scratch.
  • the line scratch may have a width of less than equal to 0.2 mm.
  • a cosmetic damage evaluation module (140) maps the at least one visualization parameter of the one or more cosmetic damages with a corresponding industrial cosmetic grading standard matrix.
  • the cosmetic damage evaluation module (140) is also configured to assign a cosmetic grade corresponding to the at least one visualization parameter of the one or more cosmetic damages of the electronic device upon mapping. Also, the cosmetic damage evaluation module evaluates a value of the electronic device based on the cosmetic grade assigned. In the example used herein, suppose the evaluator device recognizes one or more small scratches present on a screen of the electronic device as well as one several other parts of the electronic device, then the cosmetic damage evaluation module assigns a fourth grade.
  • a functionality feature evaluation module (150) enables pairing of the evaluator device with the electronic device via a scanning mechanism.
  • the scanning mechanism may include, but not limited to, a quick response code (QR) scanning mechanism, a barcode scanning mechanism, an alphanumeric code scanning mechanism and the like.
  • QR quick response code
  • the functionality feature evaluation module (150) is also configured to determine one or more functional defects associated with the electronic device through a diagnostic test run on the electronic device.
  • the one or more functional defects may include at least one of a software problem, a Wi-Fi chipset problem, a volume problem of the electronic device, a Bluetooth TM connectivity problem, an operating system issue of the electronic device or a combination thereof.
  • the functionality feature evaluation module (150) is also configured to assign a functionality grade for functional status evaluation of the electronic device based on the one or more functional defects determined.
  • the system (100) evaluates the electronic device in an overall manner by capturing image of the customer’s electronic device using the evaluator device.
  • the functionality feature evaluation module also assesses an internal condition of hardware components of the electronic device.
  • FIG. 4 is a block diagram of a computer or a server (200) in accordance with an embodiment of the present disclosure.
  • the server (200) includes processor(s) (230), and memory (210) operatively coupled to the bus (220).
  • the processor(s) (230), as used herein, means any type of computational circuit, such as, but not limited to, a microprocessor, a microcontroller, a complex instruction set computing microprocessor, a reduced instruction set computing microprocessor, a very long instruction word microprocessor, an explicitly parallel instruction computing microprocessor, a digital signal processor, or any other type of processing circuit, or a combination thereof.
  • the memory (210) includes several subsystems stored in the form of executable program which instructs the processor (230) to perform the method steps illustrated in FIG. 1.
  • the memory 210 is substantially similar to a system (100) of FIG.l.
  • the memory (210) has following elements: a processing subsystem (115) which includes an image receiving module (110), an image analysis module (120), a cosmetic damage evaluation module (130) and a functional feature evaluation module (140).
  • the processing subsystem (115) includes an image receiving module (120) configured to receive one or more images of the electronic device captured by the image capturing unit of the evaluator device via a communication network.
  • the processing subsystem (115) also includes an image analysis module (130) configured to identify one or more cosmetic damages of the electronic device based on the one or more images of the electronic device received using a learning-based damage identification technique.
  • the image analysis module (130) is also configured to determine at least one visualization parameter associated with the one or more cosmetic damages identified of the electronic device.
  • the processing subsystem (115) also includes a cosmetic damage evaluation module (140) configured to map the at least one visualization parameter determined of the one or more cosmetic damages with a corresponding industrial cosmetic grading standard matrix.
  • the cosmetic damage evaluation module (140) is also configured to assign a cosmetic grade corresponding to the at least one visualization parameter of the one or more cosmetic damages of the electronic device upon mapping.
  • the cosmetic damage evaluation module (140) is also configured to evaluate a value of the electronic device based on the cosmetic grade assigned.
  • the processing subsystem (115) also includes a functional feature evaluation module (150) configured to enable pairing of the evaluator device with the electronic device via a scanning mechanism.
  • the functional feature evaluation module (150) is also configured to determine one or more functional defects associated with the electronic device through a diagnostic test run on the electronic device upon pairing of the evaluator device with the electronic device, the functional feature evaluation module (150) is also configured to assign a functionality grade for functional status evaluation of the electronic device based on the one or more functional defects determined.
  • the bus (220) as used herein refers to be internal memory channels or computer network that is used to connect computer components and transfer data between them.
  • the bus (220) includes a serial bus or a parallel bus, wherein the serial bus transmits data in bit-serial format and the parallel bus transmits data across multiple wires.
  • the bus (220) as used herein may include but not limited to, a system bus, an internal bus, an external bus, an expansion bus, a frontside bus, a backside bus and the like.
  • FIG. 5 (a) and FIG. 5 (b) is a flow chart representing the steps involved in a method (300) for evaluation of an electronic device in accordance with the embodiment of the present disclosure.
  • the method (300) includes constructing a modular apparatus comprising a top surface, wherein the top surface is assembled with a plurality of walls in step 310.
  • the top surface includes an evaluator device locator to hold an evaluator device at a predefined orientation, wherein the evaluator device locator slides in a vertical direction to adjust and align position of an image capturing unit of the evaluator device with an opening on the top surface.
  • the constructing the modular apparatus may include constructing the modular apparatus manufactured from three-dimensional plastic material, aluminium material, steel material, cardboard material and the like.
  • constructing the modular apparatus may include constructing an enclosed box like structure with the plurality of walls.
  • the method (300) also includes locating a stopper at a predetermined distance from the evaluator device locator, wherein the stopper is configured to lock the evaluator device disposed at the predefined orientation using a screwing mechanism in step 320.
  • locating the stopper at the predetermined distance from the evaluator device locator may include locating the stopper to hold the evaluator device such as a mobile phone associated with a retailer. The stopper and the evaluator device locator are aligned and adjusted corresponding to a predetermined model of the evaluator device placed on the top surface.
  • the method (300) also includes placing an electronic device placement platform inside the modular apparatus, wherein the electronic device placement platform is adapted to receive an electronic device at a predetermined angle for inspection in step 330.
  • placing the electronic device placement platform inside the modular apparatus may include placing the electronic device placement platform for receiving the electronic device which may include, but not limited to a smart phone, a mobile phone, a tablet and the like.
  • the method (300) also includes providing a retractable door at one side of at least one wall among the plurality of walls, wherein the retractable door enables access of the electronic device placed on the electronic device placement platform in step 340.
  • the method (300) also includes receiving, by an image receiving module of a processing subsystem hosted on a remote server, one or more images of the electronic device captured by the image capturing unit of the evaluator device via a communication network in step 350.
  • receiving the one or more images of the electronic device may include receiving at least one of a front side image of the electronic device, a rear side image of the electronic device, a left side view image of the electronic device, a right-side view of the electronic device or a combination thereof.
  • receiving the one or more images of the electronic device may include receiving the one or more images via a wireless communication network.
  • the wireless communication network may include, but not limited to, wi-fi, Bluetooth, Zigbee, near field communication (NFC), infra-red communication (RFID) and the like.
  • the method (300) also includes identifying, by an image analysis module of the processing subsystem, one or more cosmetic damages of the electronic device based on the one or more images of the electronic device received using a learning-based damage identification technique in step 360.
  • identifying the one or more cosmetic damages of the electronic device may include identifying at least one of one or more scratches, one or more cracks, one or more bends, one or more dents, colour damages or a combination thereof.
  • the learningbased damage identification technique may include identifying the one or more cosmetic damages using a convolutional neural network and a support vector machine (SVM).
  • SVM support vector machine
  • the method (300) also includes determining, by the image analysis module of the processing subsystem, at least one visualization parameter associated with the one or more cosmetic damages identified of the electronic device in step 370.
  • determining the at least one visualization parameter associated with the one or more cosmetic damages may include determining at least one of a number of the one or more cosmetic damages, a size of the one or more cosmetic damages, a length of the one or more cosmetic damages or a combination thereof.
  • the length of the one or more cosmetic damages may include a length of less than equal to 5 millimetres (mm) for a line scratch.
  • the line scratch may have a width of less than equal to 0.2 mm.
  • the method (300) also includes mapping, by a cosmetic damage evaluation module of the processing subsystem, the at least one visualization parameter determined of the one or more cosmetic damages with a corresponding industrial cosmetic grading standard matrix in step 380.
  • the method (300) also includes assigning, by the cosmetic damage evaluation module of the processing subsystem, a cosmetic grade corresponding to the at least one visualization parameter of the one or more cosmetic damages of the electronic device upon mapping in step 390.
  • assigning the cosmetic grade corresponding to the at least one visualization parameter of the one or more cosmetic damages of the electronic device may include assigning the cosmetic grade which may include, but not limited to a first grade, a second grade, a third grade, a fourth grade, a fifth grade and the like.
  • the first grade may represent a good condition of the electronic device indicating an unused condition.
  • the second grade may represent no noticeable cosmetic damage condition or presence of one or more tiny scratches on a frame of the electronic device.
  • the third grade may represent one or more small scratches present on a screen of the electronic device.
  • the fourth grade may represent visible damage condition such as presence of one or more multiple scratches visible on several parts of the electronic device.
  • the fifth grade may represent a severely damaged condition of the electronic device with one or broken parts.
  • the method (300) also includes evaluating, by the cosmetic damage evaluation module of the processing subsystem, a value of the electronic device based on the cosmetic grade assigned in step 400.
  • Various embodiments of the present disclosure provide a highly efficient and an accurate system for evaluation of electronic device in order to promote trade-in process thus tending to encourage the customers by offering fair trade-in prices mostly to hedge their own risk of getting penalized by carriers.
  • the present disclosed system analyses the one or more cosmetic damages of the electronic device which are generally overlooked by other existing systems as a result creates confusion between customers as the customers always get different quotes for their old electronic devices every time, they go to the trade-in vendor.
  • the present disclosed system for evaluation of the electronic device is less time consuming, involves a simple trade- in process and thereby enables the retailer shops to consistently offer fair value of the electronic devices at the time of trade-in process.

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  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Abstract

Est divulgué un système d'évaluation d'un dispositif électronique. Le système comprend un appareil modulaire comprenant un localisateur de dispositif évaluateur permettant de maintenir un dispositif évaluateur, un bouchon situé de façon à verrouiller le dispositif évaluateur disposé; une plateforme de placement de dispositif électronique permettant de recevoir un dispositif électronique à un angle prédéterminé; une porte rétractable permettant l'accès au dispositif électronique placé sur la plateforme de placement de dispositif électronique. Un sous-système de traitement comprenant un module d'analyse d'image identifie fonctionnellement un ou plusieurs endommagements cosmétiques du dispositif électronique, détermine au moins un paramètre de visualisation associé auxdits endommagements cosmétiques; un module d'évaluation d'endommagement cosmétique met en correspondance l'au moins un paramètre de visualisation desdits endommagements cosmétiques avec une matrice standard de notation cosmétique industrielle correspondante, attribue une note cosmétique correspondant à l'au moins un paramètre de visualisation desdits endommagements cosmétiques, et évalue une valeur du dispositif électronique.
PCT/IB2021/051118 2020-12-29 2021-02-11 Système et procédé d'évaluation d'un dispositif électronique WO2022144598A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8195511B2 (en) * 2008-10-02 2012-06-05 ecoATM, Inc. Secondary market and vending system for devices
US20160307309A1 (en) * 2014-04-25 2016-10-20 Gdt, Inc. Cosmetic Evaluation Box for Used Electronics
US20180232875A1 (en) * 2017-02-13 2018-08-16 Pervacio Inc Cosmetic defect evaluation
US20200265487A1 (en) * 2019-02-18 2020-08-20 Ecoatm, Llc Neural network based physical condition evaluation of electronic devices, and associated systems and methods
US10753882B1 (en) * 2019-04-10 2020-08-25 Griffyn Robotech Private Ltd. Inspection and cosmetic grading through image processing system and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8195511B2 (en) * 2008-10-02 2012-06-05 ecoATM, Inc. Secondary market and vending system for devices
US20160307309A1 (en) * 2014-04-25 2016-10-20 Gdt, Inc. Cosmetic Evaluation Box for Used Electronics
US20180232875A1 (en) * 2017-02-13 2018-08-16 Pervacio Inc Cosmetic defect evaluation
US20200265487A1 (en) * 2019-02-18 2020-08-20 Ecoatm, Llc Neural network based physical condition evaluation of electronic devices, and associated systems and methods
US10753882B1 (en) * 2019-04-10 2020-08-25 Griffyn Robotech Private Ltd. Inspection and cosmetic grading through image processing system and method

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