WO2022126655A1 - Data processing method and device, and data processing system of board card - Google Patents
Data processing method and device, and data processing system of board card Download PDFInfo
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- the present invention relates to the field of communication technologies, and in particular, to a data processing method and device, and a data processing system of a board card.
- a board is a common printed circuit board used to control the operation of hardware.
- communication links between boards and chips on boards are mainly established through interface chips such as 100M PHY (Physical Layer, port physical layer) to achieve interconnection, but interface chips such as PHY have certain requirements for data transmission speed and wiring resources. limitations.
- the LVDS (Low Voltage Differential Signaling, abbreviation for Low Voltage Differential Signaling) communication link is a data transmission technology based on low-swing differential signals, with low power consumption, low error
- the advantages of code rate, low crosstalk and low radiation can not only increase the data transmission rate, but also reduce the limitations brought by wiring resources and interface chips.
- the interconnection method established by the existing LVDS communication link will cause the phase shift between the boards, which in turn leads to unstable data transmission, which limits the application of the LVDS communication link in the interconnection between the boards.
- Embodiments of the present invention provide a data processing method and device, and a data processing system for a board card, so as to at least solve the technical problem of unstable data transmission when an LVDS communication link is used for communication between chips.
- a data processing method including: communicating between a first chip and a second chip through a low-voltage differential signal, and the data processing method includes: after the first chip is powered on, receiving The phase is locked to each first phase to be measured in the first group of phases to be measured; after the receiving phase is locked to a first phase to be measured each time, the first chip receives the test packet sent by the second chip and determines the receiving state to obtain the receiving state corresponding to each first phase to be measured; the first chip determines the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured; the first chip locks the receiving phase to the first target phase for the receive port of the first chip to communicate with the second chip at the first target phase.
- the first group of phases to be measured is obtained based on the clock cycle of the signal received by the first chip and the preset number of phases; or, the difference between two adjacent first phases to be measured in the first group of phases to be measured is the clock. Period divided by the preset number of phases.
- the first chip receives the test packet sent by the second chip, and determines the receiving state, and obtains the receiving state corresponding to each first phase to be measured, including: A chip receives multiple consecutive test packets sent by the second chip; if the first chip receives all the consecutive multiple test packets correctly, it is determined that the first chip is in the current receiving state of the first phase to be tested as the receiving state; if the first chip receives all the consecutive multiple test packets correctly; A chip receives errors or fails to receive any one or more test packets over time, and determines that the receiving state of the first chip in the current first phase to be tested is a receiving error state.
- determining the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured includes: determining that the first phase to be measured whose receiving state is a receiving correct state is the first target phase corresponding to the receiving phase.
- the receiving state is that the first phase to be measured in the receiving state is a plurality of consecutive phases
- it is determined that the first phase to be measured in the receiving state is the receiving correct state is the first target phase corresponding to the above-mentioned receiving phase, including: : Determine the phase in the center of the multiple consecutive phases as the first target phase corresponding to the receiving phase.
- the above method also includes: the first chip locks the transmission phase to each second phase to be measured in the second group of phases to be measured;
- the chip sends a test packet, wherein after the first chip sends the test packet to the second chip, the second chip returns the receiving state of the test packet to the first chip;
- the first chip receives the receiving state of the test packet, according to the receiving state of the test packet Determine the transmission state corresponding to each second phase to be measured; determine the second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured;
- the first chip locks the transmission phase to the second target phase, wherein, The transmit port of the first chip communicates with the second chip at the second target phase.
- the first chip receives the reception state of the test package, and determines the corresponding transmission state of each second phase to be tested according to the reception state of the test package, including: if the reception state of the test package is all received correctly, determine the second phase to be tested.
- the sending state corresponding to the phase is the correct sending state; if the receiving state of any one or more test packets is the receiving error or the timeout is not received, it is determined that the sending state corresponding to the second phase to be tested is the sending error state.
- determining the second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured includes: determining that the second phase to be measured whose transmission state is the correct transmission state is the second target phase corresponding to the transmission phase.
- the second phase to be measured whose transmission state is the correct transmission state is a plurality of continuous phases
- it is determined that the second phase to be measured whose transmission state is the correct transmission state is the second target phase corresponding to the transmission phase including: The middle phase among the multiple consecutive phases is determined as the first target phase corresponding to the transmission phase.
- the method further includes: the first chip sends a completion packet to the second chip; wherein, after receiving the test packet, the second chip determines whether the test packet is To complete the package, if the test package is a complete package, the second chip and the first chip enter the communication mode; if the test package is not a complete package, the second chip returns the receiving state of the test package to the first chip.
- the second group of phases to be measured is obtained based on the clock cycle of the signal sent by the first chip and the preset number of phases, or the difference between two adjacent first phases to be measured in the first group of phases to be measured is the first
- the clock period the chip sends the signal is divided by the preset number of phases.
- the number of the first chips is multiple, the multiple first chips are arranged on multiple different first boards, the second chips are arranged on the second boards, and the second boards are connected to the multiple first boards. Each board in the card communicates.
- first chip and the second chip are both FPGA chips, and the receiving phase is respectively locked to each first phase to be measured in the first group of phases to be measured by the clock manager in the first chip.
- the above method further includes: the first chip communicates with the second chip, and the step of the first chip communicating with the second chip includes: the first chip
- the data to be transmitted is encapsulated according to preset rules to obtain an encapsulated data packet; the first chip encodes the encapsulated data packet to obtain an encoding result; the first chip scrambles the encoding result to obtain a scrambled result; the first chip scrambles The result is subjected to parallel-to-serial conversion, and the data packet obtained after the parallel-to-serial conversion is sent to the second chip; wherein the second chip receives the data packet sent by the first chip, performs serial-to-parallel conversion on the received data packet, and performs serial-to-parallel conversion on the received data packet.
- the conversion result is descrambled, the descramble result is decoded, the encapsulation result of the data to be transmitted is obtained, and the verification is performed according to the encapsulation result, and if the verification is correct, the data to be transmitted is sent to the corresponding processing unit.
- a data processing method including: when the second chip on the second board detects an idle code sent by the first chip on the first board A chip sends a test packet; until the second chip detects the completion packet sent by the first chip, the second chip stops sending the test packet.
- the second chip communicates with a plurality of first chips through low-voltage differential signals
- the data processing method includes: a receiving port of the second chip collects a test packet sent by the first chip, wherein the first chip will send the phase Lock to each second phase to be tested in the second group of phases to be tested, and after the transmission phase is locked to a second phase to be tested each time, send a test packet to the second chip; the second chip judges whether the test packet is correct The second chip returns the receiving state of the test package to the first chip according to the judgment result; wherein, the first chip receives the receiving state of the test package, determines the corresponding transmission state of each second phase to be measured according to the receiving state of the test package, and The second target phase corresponding to the transmission phase is determined according to the transmission state corresponding to each second phase to be measured.
- the method further includes: the second chip judges whether the test package is a completed package, Wherein, after the first chip determines the second target phase of the sending port, it sends a completion packet to the second chip; if the test packet is a completion packet, the second chip and the first chip enter the communication mode; if the test packet is not a completion packet, enter the first chip
- the receiving port of the second chip collects the test packet sent by the first chip.
- a data processing apparatus in which the first chip and the second chip communicate through low-voltage differential signals, and the data processing apparatus includes: a phase locking module for After a chip is powered on, the receiving phase is locked to each first phase to be measured in the first group of phases to be measured; the phase test module is used to make the first phase to be measured after the receiving phase is locked to a first phase to be measured each time.
- a chip receives the test packet sent by the second chip, determines the receiving state, and obtains the receiving state corresponding to each first phase to be measured; the phase selection module is used for the first chip to obtain the receiving state corresponding to each first phase to be measured. Determine the first target phase corresponding to the receiving phase; the phase adjustment module is used to make the first chip lock the receiving phase to the first target phase, so that the receiving port of the first chip can perform the first target phase with the second chip under the first target phase. communication.
- a data processing apparatus is further provided, which is characterized by comprising: a sending module for detecting the first chip on the first board by the second chip on the second board When the idle code is sent, continue to send the test packet to the first chip; stop the sending module, which is used to stop sending the second chip until the second chip detects the completion packet sent by the first chip. test package.
- a data processing system for board cards including a plurality of first board cards and a second board card, wherein the first board cards and the second board cards are both disposed on the backplane
- each first board communicates with the second board through low-voltage differential signals, and the second board is used to send a test packet to the first board
- the first board is used to The receiving phase is respectively locked to each first phase to be measured in the first group of phases to be measured, receives the test packet sent by the second board, and determines the receiving state, and obtains the receiving state corresponding to each first phase to be measured
- a board is further configured to determine the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured, so that the receiving port of the first board can perform the communication with the second board under the first target phase.
- the first board is also used to lock the transmission phase to each second phase to be measured in the second group of The card sends the test package;
- the second board is also used to judge whether the test package is correct, and returns the receiving state of the test package to the first board according to the judgment result;
- the first board is also used to receive the receiving state of the test package, according to the test
- the reception state of the packet determines the transmission state corresponding to each second phase to be measured, and determines the second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured.
- a data processing system for a board including a first board and a second board, both of which are arranged between the backplane On, the first board and the second board communicate through low-voltage differential signals, and the second board is used to send test packets to the first board;
- the first board is used to separate the receiving phases after power-on Lock to each first phase to be tested in the first group of phases to be tested, receive the test packet sent by the second board, and determine the receiving state to obtain the receiving state corresponding to each first phase to be tested;
- the first board It is also used to determine the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured, so that the receiving port of the first board card communicates with the second board card under the first target phase;
- the first board is also used to send the test package to the second board;
- the second board is also used to lock the receiving phase to each third phase to be measured in the third group of phases to be measured after power-on, respectively, to receive The test
- a storage medium including a stored program, wherein when the program is run, a device where the storage medium is located is controlled to execute the above data processing method.
- a processor is further provided for running a program, wherein the data processing method is executed when the program is running.
- the optimal phase is selected, and the receiving phase of the clock of the first chip is adjusted accordingly, so as to realize the first chip.
- the phase of the chip is consistent with the phase of the second chip, which avoids the phase shift between chips in the LVDS communication link, improves the data transmission stability and data transmission efficiency of the LVDS communication link, and solves the problem in the prior art.
- FIG. 1 is a flowchart of a data processing method according to an embodiment of the present invention.
- FIG. 2a is a flowchart of a data processing method according to an embodiment of the present invention.
- FIG. 2a is a flowchart of an optional data processing method according to an embodiment of the present invention.
- FIG. 3 is a flowchart of an optional data processing method according to an embodiment of the present invention.
- FIG. 5 is a schematic diagram of an optional LVDS communication module
- FIG. 6 is a schematic diagram of an optional data processing method according to an embodiment of the present invention.
- FIG. 7 is a schematic diagram of a data processing apparatus according to an embodiment of the present invention.
- FIG. 8 is a schematic diagram of another data processing apparatus according to an embodiment of the present invention.
- FIG. 9 is a schematic diagram of a data processing system for a board card according to an embodiment of the present invention.
- FIG. 10 is a schematic diagram of a data processing system of a board card according to an embodiment of the present invention.
- the data transmission or reception between the first board and the second board in the following implementation is actually the communication method between the chip on the first board and the chip on the second board (that is, the Inter-chip communication), the communication between the first chip and the second chip, including the communication between different chips on the same board and the chip communication between different boards.
- an embodiment of a data processing method for a board card is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, Also, although a logical order is shown in the flowcharts, in some cases the steps shown or described may be performed in an order different from that herein.
- FIG. 1 is a data processing method according to an embodiment of the present invention, which includes: a low-voltage differential signal communicates between a first chip and a second chip. As shown in FIG. 1 , the method includes the following steps:
- Step S101 after the first chip is powered on, the receiving phase is locked to each first phase to be measured in the first group of phases to be measured.
- the receiving phase locking of the above-mentioned first chip can be completed by MMCM (Mixed Mode Clock Manager, mode clock manager).
- MMCM ixed Mode Clock Manager, mode clock manager.
- the above-mentioned first group of phases to be measured includes a plurality of first phases to be measured, and it is necessary to lock each of the first phases to be measured, so as to realize the data transmission test under each of the first phases to be measured.
- the first group of phases to be measured includes at least 32 first phases to be measured.
- the MMCM can be automatically triggered to lock the receiving phase, or the MMCM can be controlled to achieve phase locking by manually sending an instruction.
- the above-mentioned first chip and second chip may be chips on the same board or chips on different boards.
- Step S102 after the receiving phase is locked to a first phase to be measured each time, the first chip receives the test packet sent by the second chip, and determines the receiving state to obtain the receiving state corresponding to each first phase to be measured.
- the above test packets include data sequences.
- the reception status includes correct reception (represented by 1) and reception error (represented by 0), wherein the reception correct status includes that the test packet data received by the first chip is correct, and the reception error status includes that the first chip receives the test packet data error Or the first chip times out and does not receive the test packet. If the receiving state is correct, it means that the receiving clock of the first chip is in the current phase, and the receiving port can receive data accurately.
- Each first phase to be measured in the first group of phases to be measured will have a definite receiving state. For example, if the first group of phases to be measured contains N first phases to be measured in total, then according to step S102, it will be obtained N receiving states corresponding to the first phase to be measured one-to-one, where N is an integer.
- Step S103 the first chip determines the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured;
- the above-mentioned first target phase can be understood as the best phase selected according to the receiving state of the first chip in the first group of phases to be measured, and the first target phase should be the first phase to be measured with the correct receiving state, so that the The data sequence received by the first chip in the first target phase is consistent with the data sequence sent by the second chip.
- N first phases to be measured in the first group of phases to be measured N corresponding receiving states are obtained respectively, and the first target phase can be screened and determined from the first phases to be measured whose receiving states are correct. .
- Step S104 the first chip locks the receiving phase to the first target phase, so that the receiving port of the first chip can communicate with the second chip under the first target phase.
- step S103 adjust the clock of the receiving port of the first chip to the first target phase, and complete the adjustment of the clock phase of the receiving port of the first chip, so that the receiving port of the first chip is optimal phase.
- the second chip is used as the data sending end
- the first chip is used as the data receiving end
- the phase of the receiving port of the first chip is adjusted to the first target phase. It can be considered that the above steps S101-S104 realize the downlink of the first chip. The taming process of the link, the downlink after taming is stable.
- the above-mentioned first chip may be any one of chip A and chip B.
- chip A is used as the first chip and chip B is used as the second chip to complete the downlink taming of chip A; then chip B is used as the first chip, and chip B is used as the first chip.
- Chip A is used as the second chip to complete the downlink taming of chip B.
- the optimal phase is screened out, and the receiving phase of the first chip clock is adjusted accordingly based on the optimal phase, thereby avoiding
- the phase offset between chips in the LVDS communication link improves the stability of data transmission and the efficiency of data transmission in the LVDS communication link, thereby solving the problem of inconsistency in data transmission when the LVDS communication link is used for communication between chips in the prior art. Stable technical issues.
- the first group of phases to be measured is obtained based on the clock period of the signal received by the first chip and the preset number of phases; or, the difference between two adjacent first phases to be measured in the first group of phases to be measured The difference is the clock period divided by the preset number of phases.
- the above-mentioned preset number of phases can be understood as the number of phases in the first group of phases to be measured. For example, if the clock cycle of the first chip receiving the signal is 50ns, and the preset number of phases can be selected as 32, then the number of phases to be measured in the first group of phases is 50ns. The difference between two adjacent first phases to be measured is 50ns/32. Set the initial value of the first phase to be measured, and increase or decrease the initial value in steps of 50ns/32. A plurality of first to-be-measured phases in a group of to-be-measured phases.
- the first chip receives the test packet sent by the second chip, determines the receiving state, and obtains the corresponding value of each first phase to be measured.
- the receiving state includes: the first chip receives multiple consecutive test packets sent by the second chip; if the first chip receives all the continuous multiple test packets correctly, it is determined that the receiving state of the first chip under the current first phase to be tested is: The receiving state is correct; if the first chip receives any one or more test packets incorrectly or fails to receive it over time, it is determined that the receiving state of the first chip in the current first phase to be tested is a receiving error state.
- the receiving correct state is only that the data of the multiple test packets are all correct. If the data of a certain test packet or some fields of the data in a certain test packet are wrong or lost in multiple test packets, it belongs to the receiving error state.
- determining the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured includes: determining that the first phase to be measured whose receiving state is the correct receiving state is corresponding to the receiving phase the first target phase.
- the data of the test packet received by the first chip is consistent with the data of the test packet sent by the second chip, that is, the receiving port of the first chip has an optimal phase, which can be used as the clock phase of the receiving end during normal data transmission. , so that the first chip is in a stable state when receiving data.
- the method for determining the first target phase is clarified, and the problem of how to determine the first target phase of the first chip is solved.
- the first target phase includes: determining the middle phase among the multiple continuous phases as the first target phase corresponding to the receiving phase.
- the receiving states corresponding to the plurality of first phases to be measured include a receiving correct state 1 and a receiving error state 0.
- the first phase to be measured with the received correct state 1 is a continuous phase. If the phase with the receiving correct state 1 is an even number of consecutive phases, select any one of the two phases in the center position as the first target phase, for example, the first group of phases to be measured includes 7 first phases to be measured , the corresponding receiving state is 0011110 in sequence, from which it can be obtained that the phases with the receiving order of the third, fourth, fifth and sixth have the correct receiving state, then it is determined that the first target phase can be the fourth position.
- the phase of the bit may be the phase of the fifth bit. If the first phase to be measured with the receiving correct state 1 is an odd number of consecutive phases, the phase in the middle of the bits is selected as the first target phase corresponding to the receiving phase. For example, the first group of phases to be measured includes 6 first phase to be measured. The corresponding receiving states are 001110 in turn. From this, it can be obtained that the phases whose receiving order is the 3rd, 4th, and 5th digit have the correct receiving state. Among them, the phase whose position is the 4th digit is in the middle position, then The phase whose position is determined to be the 4th bit is the first target phase.
- a unique first target phase is determined from a plurality of first phases to be measured that have a receiving correct state, and the method for determining the first target phase is further clarified.
- the above-mentioned embodiment proposes the taming process of the chip for the downlink.
- the two chips can tame their respective downlinks and then communicate with each other, so that the communication between the two chips is relatively stable.
- the second chip communicates with multiple first chips, in this case, if the second chip does its own downlink tame, the operation of the second chip will be very complicated, so In this case, the taming of the uplink is performed by the first chip.
- the manner in which the first chip performs uplink taming will be described below.
- the above data processing method further includes the following steps:
- Step S105 the first chip locks the transmission phase to each second phase to be measured in the second group of phases to be measured;
- the above-mentioned transmission phase locking of the first chip can be completed by the MMCM, so as to realize the data transmission test under each second phase to be tested.
- the second group of phases to be measured includes a plurality of second phases to be measured.
- the second group of phases to be measured includes 32 second phases to be measured.
- Step S106 after the transmission phase is locked to a second phase to be tested each time, a test packet is sent to the second chip, wherein after the first chip sends the test packet to the second chip, the second chip returns the test to the first chip The reception status of the packet.
- the reception status includes correct reception (represented by 1) and reception error (represented by 0).
- the receiving correct state includes that the data of the test packet received by the second chip is correct (that is, the data in the test packet received by the second chip is the same as the data in the test packet sent by the first chip), and the receiving error state includes the second chip receiving The data to the test packet was wrong or the test packet was not received.
- the second chip For each second phase to be tested, the second chip will generate a receiving status for determining the test packet, and return the receiving status to the first chip. Optionally, for receiving the correct test packet, the second chip will return the test packet to the first chip.
- Step S107 the first chip receives the reception status of the test packet, and determines the transmission status corresponding to each second phase to be tested according to the reception status of the test packet.
- the receiving state of the test package by the second chip should be consistent with the sending state of the test package by the first chip. If the receiving state of the second chip is correct, the sending state of the first chip corresponding to the second phase to be tested can be determined. If the receiving state of the second chip is a receiving error, it can be determined that the sending state of the first chip corresponding to the second phase to be measured is a sending error. For example, for the five locked second phases to be measured, the receiving status returned by the second chip is 00110 in sequence, and the sending status of the first chip corresponding to the group of second phases to be measured is 00110.
- the second chip communicates with multiple first chips, if the second chip judges the receiving state of the test packets sent by each first chip, the calculation process is complicated and requires a long working time .
- the first chip receives data in a test packet with the same content sent by the first chip, it is determined that the sending state of the first chip in the second phase to be tested is sending. correct state.
- the second chip does not return the direct receiving status to the first chip, but the data of the test packet, and the first chip judges that it has received the test packet by Whether the data packets sent by it are the same to determine the sending state corresponding to the phase.
- the calculation amount of the second chip in the process of judging the receiving state can be reduced.
- Step S108 Determine a second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured.
- the above-mentioned second target phase can be understood as the best phase selected according to the transmission state of the first chip in the second group of phases to be measured, and the second target phase should be the phase with the correct transmission state, so that the first chip is in the first phase.
- the data sent in the two target phases is consistent with the data received by the second chip.
- Step S109 the first chip locks the transmit phase to the second target phase, wherein the transmit port of the first chip communicates with the second chip under the second target phase
- the clock of the transmission port of the first chip is adjusted to the second target phase, and the adjustment of the clock phase of the transmission port of the first chip is completed, that is, the taming of the uplink is completed.
- the second chip is used as the test packet data receiving terminal, and the first chip is used as the test packet data transmission terminal.
- the above steps S105-S109 realize the taming of the data uplink between chips.
- the bidirectional adjustment of the clocks of the transmitting port and the receiving port of the first chip is completed, solving the problem of It solves the problem of phase deviation in the communication between chips based on LVDS communication link, and solves the problem of unstable data transmission when the communication between chips adopts LVDS communication link.
- a stable and reliable LVDS communication link is established, which improves the data transmission efficiency.
- the first chip receives the reception status of the test packet, and determines the transmission status corresponding to each second phase to be tested according to the reception status of the test packet, including: if the reception status of the test packet is all received correctly , determine that the sending state corresponding to the second phase to be tested is the correct sending state; if the receiving state of any one or more test packets is a receiving error or the timeout is not received, determine that the sending state corresponding to the second phase to be tested is a sending error state .
- each second phase to be tested corresponds to multiple test packets
- the receiving state of the second chip is correct, which means that the data of the multiple test packets are all correct, that is, the data of each test packet in the multiple test packets is correct.
- the reception should be consistent with the data of each test packet sent by the first chip; the reception status of any one or more test packets is reception error or timeout not received, which is understood as the timing error of different test packets or the error in each timing packet. Data errors are all cases where the reception status is an error.
- the receiving state of the second chip to the test packet is consistent with the sending state of the first chip to the test packet, the receiving state of the second chip is correct or incorrect, and it can be determined that the transmitting state corresponding to the second phase to be tested is correct or incorrect state.
- the sending state of the first chip is determined according to the receiving state of the second chip.
- determining the second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured includes: determining that the second phase to be measured whose transmission state is the correct transmission state is corresponding to the transmission phase the second target phase.
- the data of the test packet sent by the first chip is consistent with the data of the test packet received by the second chip, that is, the sending port of the first chip has the best phase, which can be used as the clock of the sending end during normal data transmission. phase.
- the first target phase and the second target phase may be the same or different.
- the second phase to be measured whose transmission state is the correct transmission state is a plurality of consecutive phases
- it is determined that the second phase to be measured whose transmission state is the correct transmission state is the first phase corresponding to the transmission phase.
- Two target phases including: determining a middle phase among the multiple continuous phases as the first target phase corresponding to the transmission phase.
- the transmission states corresponding to the plurality of phases to be measured include a transmission correct state 1 and a transmission error state 0.
- the second phase to be measured with the transmission correct state 1 is a continuous phase. If the phase with the correct state 1 is an even number of consecutive phases, select any one of the two phases in the center position as the second target phase, for example, the second group of phases to be measured contains 7 phases to be measured. , the corresponding sending status is 0011110 in turn, from this, it can be obtained that the phases whose sending order is the 3rd, 4th, 5th and 6th have the correct sending status, then it is determined that the second target phase can be the 4th position.
- the phase of the bit may be the phase of the fifth bit. If the second phase to be measured with the correct transmission state 1 is an odd number of consecutive phases, the phase in the middle of the bits is selected as the second target phase corresponding to the transmitted phase. For example, the second group of phases to be measured contains 6 If the phase is measured, the corresponding transmission state is 001110 in turn. From this, it can be obtained that the phases whose transmission order is the 3rd, the 4th, and the 5th have the correct transmission state. Among them, the phase whose position is the 4th is in the middle position, then The phase whose position is determined to be the 4th bit is the second target phase.
- the above method further includes: the first chip sends a completion packet to the second chip; wherein the second chip receives the test packet after receiving the test packet. After that, it is judged whether the test packet is a complete packet, if the test packet is a complete packet, the second chip and the first chip enter the communication mode; if the test packet is not a complete packet, enter the receiving state where the second chip returns the test packet to the first chip A step of.
- the first chip locks the transmission phase to the second target phase
- the first chip has completed the two-way taming of the uplink and the downlink
- the above completion package indicates that the first chip has completed the two-way taming and can enter the Normal communication mode.
- the first chip is the chip on the AUX (Auxiliary, auxiliary output or auxiliary output interface) card
- the second chip is the chip on the daughter card.
- the chip sends the completion packet, and the chip of the AUX card feeds back the completion packet to the sub-card after receiving the completion packet, and the chip of the AUX card and the chip of the sub-card enter the communication mode.
- the second group of phases to be measured is obtained based on the clock cycle of the signal sent by the first chip and the preset number of phases, or between two adjacent first phases to be measured in the first group of phases to be measured The difference is the clock period of the signal sent by the first chip divided by the preset number of phases.
- the above-mentioned preset number of phases can be understood as the number of phases in the first group of phases to be measured. For example, if the clock cycle of the first chip receiving the signal is 50ns, and the preset number of phases can be selected as 32, then the number of phases to be measured in the first group of phases is 50ns. The difference between two adjacent first phases to be measured is 50ns/32. Set the initial value of the first phase to be measured, and increase or decrease the initial value in steps of 50ns/32. A plurality of first to-be-measured phases in a group of to-be-measured phases.
- the number of the first chips is multiple, the multiple first chips are deployed on multiple different first boards, the second chips are deployed on the second boards, and the second boards Communicate with each of the plurality of first boards.
- the above-mentioned multiple first boards are all daughter cards, and the second board is an AUX card.
- the daughter card dominates the taming process of the entire communication link. Card) to tame, based on the downlink tame result, and then tame the uplink (daughter card to AUX), and enter the normal communication process after the tame is completed.
- the first chip and the second chip are both FPGA chips, and the receiving phase is respectively locked to each of the first to-be-measured phases in the first group of phases to be measured by the clock manager in the first chip. phase.
- the above method further includes: the first chip communicates with the second chip, and the first chip communicates with the second chip include:
- Step S109 the first chip encapsulates the data to be transmitted according to a preset rule to obtain an encapsulated data packet.
- the following table 1 is an optional format of encapsulating data packets. After the first chip receives a complete packet of data to be transmitted, it encapsulates the data to be transmitted according to the rules of Table 1, including preamble, Length, TYPE, Reserve in turn. , HEAD_CHK, Payload and CRC8.
- the preamble is 8 bytes (ie 55555555555555D5), Length is 2 bytes, Payload is the field length of the data to be transmitted, TYPE is 1 byte, Reserve is 2 bytes, HEAD_CHK is 1 byte, and HEAD_CHK is the check digit of the Length, TYPE, Reserve fields, and CRC is the check digit of the packet header and end.
- Step S110 the first chip encodes the encapsulated data packet to obtain an encoding result.
- the encoding module is an 8B10B encoding module, and K28.1 is selected as the idle time encoding, K28.5 is used as the start of the encapsulated data packet, and K28.7 is used as the end of the encapsulated data packet to obtain the encoding result.
- Step S111 the first chip scrambles the encoding result to obtain a scrambled result
- the coding result can be scrambled by a 10-bit parallel scrambling module, and the data to be transmitted is coded and scrambled close to white noise, which ensures the DC balance in the data communication process.
- Step S112 the first chip performs parallel-serial conversion on the scrambling result, and sends the data packet obtained after the parallel-serial conversion to the second chip;
- the scrambled result that has been scrambled enters the dual-clock fifo, crosses the 250M clock domain, enters the PISO module and completes the parallel-serial conversion and sends it to the second chip.
- the second chip receives the data packet sent by the first chip, performs serial-to-parallel conversion on the received data packet, descrambles the serial-to-parallel conversion result, decodes the descramble result, and obtains the encapsulation result of the data to be transmitted,
- the verification is performed according to the encapsulation result, and if the verification is correct, the data to be transmitted is sent to the corresponding processing unit.
- the serial-to-parallel conversion can be completed by the SIPO module, and the data packets obtained after the serial-to-parallel conversion are written into the dual-clock FIFO to complete the conversion of the 250M to 25M clock domain.
- the Descrambler module performs the conversion. In the descrambling operation, the descrambling completed data enters the 8B10B decoding module to complete the 8B10B decoding, and completes the byte alignment operation.
- the normal communication of data under the LVDS communication link is realized.
- the data signal to be transmitted is made close to white noise, which ensures the DC balance of the LVDS communication link and can be more effective. to improve the reliability and stability of data transmission.
- the data transmission steps of the above steps S109-S112 are implemented by the LVDS sending module (ie the lvds_send module) and the LVDS receiving module (ie the lvds_rec module), which respectively implement the sending and receiving of the data to be transmitted.
- Figure 5 is a schematic diagram of an optional LVDS communication module. The LVDS sending module and LVDS receiving module between chips of different boards can be interconnected with external logic by using an 8-bit serial interface. ) completes data exchange with the LVDS interface.
- Figure 6 is a schematic diagram of an optional data processing, including the data transmission path in the LVDS communication link, Table 2 is the description of the external interface of the LVDS sending module, and Table 3 is the description of the external interface of the LVDS receiving module:
- PORT NAME port name WIDTH width Direction points to DescriptionDescription sys_rst 1 input local reset signal sys_clk 1 input System working clock send_data 8 input send data send_data_en 1 input Send data valid signal send_data_length 16 input Current sent packet length send_data_pkg_valid 1 input Send packet completion signal send_data_type 8 input packet type fifo_ready 1 output Indicates whether new packets can be received lvds_out_clk 1 input Sending side MMCM output clock 250M lvds_data_out 1 output lvds interface to send data lvds_25M_clk 1 input Sending side MMCM synchronous clock 25M
- the lvds_send module receives the data to be transmitted and stores it in the fifo module, and feeds back the signal to the preceding logic through the fifo_ready terminal to indicate whether new data can be received at present.
- the state machine After receiving one complete data packet, the state machine is started, the data is read out from the fifo, and the data is encapsulated according to step S109 to obtain an encapsulated data packet.
- the encapsulated data packet is sent to the 8B10B encoding module for encoding, and the 10bit parallel scrambling module (scrambler_10) for scramble. After scrambled, the data enters the dual-clock fifo, crosses the 250M clock domain, and enters the PISO module to complete the parallel-to-serial conversion. Sent to the external interface of the lvds_rec module.
- the lvds_rec module After the lvds_rec module receives the data, it enters the SIPO module to complete the serial-to-parallel conversion, and writes the dual clock FIFO to complete the conversion of the 250M to 25M clock domain. After the conversion is completed, it enters the Descrambler module for descrambling operation, and the descrambling completed data enters the 8B10B decoding module to complete 8B10B decoding, and complete the byte alignment operation. After decoding the data, CRC 8-bit verification is performed on the data to be transmitted according to the internal process of step S112, and the rec_data_pkg_valid signal is output according to the correct verification result and fed back to the external logic for subsequent processing.
- the first board is a daughter card
- the second board is an AUX card
- the first chip is a chip on the daughter card
- the second chip is an AUX card chip.
- the MMCM locks the receiving phase of the daughter card.
- the AUX card sends a test packet to the daughter card.
- the daughter card receives the test packet and determines the receiving state, and then enters the next clock sequence, repeating the above AUX
- the card sends the test package to the daughter card, and the daughter card receives and determines the steps of receiving status.
- FIG. 3 provides a flowchart of an optional data processing method between the daughter card and the AUX card (ie, between the chip of the daughter card and the chip of the AUX card). As shown in Figure 3, the method includes the following steps:
- Step S301 the main control card sends whether the sub-card is online; after the system is powered on, the main control card cyclically detects whether the sub-card is powered on, once it is detected that the sub-card is powered on, the main control card sends a taming instruction to the AUX card (taming is understandable In order to adjust the phase of the MMCM transceiver bidirectional clock), make the AUX card enter the tamed state, and enter step S302;
- Step S302 the AUX card sends the downlink taming sequence, so that the daughter card enters the taming state, and then goes to step S303;
- Step S303 the AUX card detects whether it receives the uplink taming sequence (that is, the test packet) or the completion sequence sent by the subcard; In the step of port phase adjustment, the AUX card receives the uplink taming sequence sent by the daughter card, and judges the receiving state of the current test packet. If the receiving state is correct, then enter step S304; if the receiving state is error or timeout, then Returning to step S302, the downlink taming sequence is periodically sent to the daughter card until the daughter card enters the taming state; the above-mentioned completion sequence is understood as the above-mentioned second target phase;
- Step S304 loop back the current test packet data to the daughter card, and determine whether the test packet with the correct receiving state is a complete packet (that is, a test packet with a completed sequence), if the current test packet is a complete packet, then enter step S305; If the test package is not a complete package, then return to step S303, and the AUX card continues to receive the uplink taming sequence sent by the sub-card until the completion sequence is selected;
- Step S305 the taming is completed, the AUX card exits the taming state, and enters the normal data receiving state, and feeds back the taming completion state to the main control card at the same time.
- the transmission phase of the sub-card is adjusted to the optimum phase, so as to realize the consistency adjustment of the reception phase between the AUX card and the sub-card, and complete the uplink taming between the AUX card and the sub-card (that is, the data uplink). phase adjustment).
- the link for receiving data and the link for sending data in two chips may be independent links, so for the first chip, it can perform downlink taming and uplink at the same time The tameness of the road.
- FIG. 2a is a flowchart of a data processing method according to an embodiment of the present invention. As shown in FIG. 2a, the above data processing method includes:
- Step S209 when the second chip on the second board detects the idle code sent by the first chip on the first board, it continues to send a test packet to the first chip.
- Step S210 until the second chip detects the completion packet sent by the first chip, the second chip stops sending the test packet.
- the above-mentioned idle code is a trigger mechanism for the second chip on the second board to send the test packet to the first chip on the first board
- the above-mentioned completion packet is the stop of sending the second chip on the second board. Triggering mechanism for the test package.
- the first chip starts to send the idle code
- the second chip of the second board is used as the sender for detection.
- the test packet starts to be sent.
- the chip actively sends an idle code when detecting that the board is inserted into the backplane.
- the second chip detects the completion packet sent by the first chip, it feeds back the completion packet to the first chip.
- the first chip has completed its uplink and downlink tame, and the second chip and the first chip enter the communication mode.
- the second chip communicates with a plurality of first chips through low-voltage differential signals. As shown in FIG. 2b, the above method further includes the following steps:
- Step S201 the receiving port of the second chip collects the test packet sent by the first chip, wherein the first chip locks the transmission phase to each second phase to be measured in the second group of phases to be measured, and the transmission phase is After locking to a second phase to be tested, send a test packet to the second chip;
- Step S202 the second chip determines whether the test package is correct
- the data in the test packet received by the second chip is the same as the data in the test packet sent by the first chip, then the second chip judges that the test packet is correct, if the data in the test packet received by the second chip is the same as the data in the test packet sent by the first chip If the data in the sent test packet is different or the second chip does not receive the test packet, the second chip determines that the test packet is an error. Optionally, if the judgment result is correct, it is represented by 1; if the judgment result is wrong, it is represented by 0.
- Step S203 the second chip returns the receiving state of the test packet to the first chip according to the judgment result
- the second chip When the judgment result is correct, the second chip sends a receiving correct status to the first chip, and when the judgment result is incorrect, the second chip sends a receiving error status to the first chip.
- the second chip sends 1 to the first chip, and when the judgment result is wrong, the second chip sends 0 to the first chip.
- Step S204 the first chip receives the receiving state of the test packet, determines the transmission state corresponding to each second phase to be measured according to the receiving state of the test packet, and determines the corresponding transmission state according to the transmission state corresponding to each second phase to be measured. Second target phase.
- the receiving state of the test package by the second chip should be consistent with the sending state of the test package by the first chip. If the receiving state of the second chip is correct, the sending state of the first chip corresponding to the second phase to be tested can be determined. If the receiving state of the second chip is a receiving error, it can be determined that the sending state of the first chip corresponding to the second phase to be measured is a sending error. For example, for the five locked second phases to be measured, the receiving status returned by the second chip is 00110 in sequence, and the sending status of the first chip corresponding to the group of second phases to be measured is 00110.
- the second chip communicates with multiple first chips, if the second chip judges the receiving state of the test packets sent by each first chip, the calculation process is complicated and requires a long working time .
- the first chip receives data in a test packet with the same content sent by the first chip, it is determined that the sending state of the first chip in the second phase to be tested is sending. correct state.
- the second chip does not return the direct receiving status to the first chip, but the data of the test packet, and the first chip judges that it has received the test packet by Whether the data packets sent by it are the same to determine the sending state corresponding to the phase.
- the calculation amount of the second chip in the process of judging the receiving state can be reduced.
- the second chip directly feeds back the receiving state to the first chip, so that the first chip determines the corresponding sending state of each second phase to be measured according to the receiving state, and finds the second target phase. Therefore, a method for determining the optimal phase of the transmitting port of the first chip when the second chip communicates with the plurality of first chips in the LVDS communication link is provided.
- the above method further includes: the second chip judges the test Whether the package is a completion package, wherein after the first chip determines the second target phase of the sending port, it sends the completion package to the second chip; if the test package is a completion package, the second chip and the first chip enter the communication mode; if the test package does not In order to complete the packet, the step of entering the receiving port of the second chip to collect the test packet sent by the first chip.
- the above-mentioned completion packet is a test packet including a completed data sequence
- the completed data sequence is a test packet corresponding to the second target phase.
- the first chip and the second chip are chips of different sub-cards.
- FIG. 4 provides a flowchart of an optional data processing method between the sub-card and the chips of the sub-card. As shown in Figure 4, the method includes the following steps:
- Step S401 the sub-card is powered on reset or soft reset
- Step S402 adjust the phase of the clock on the receiving side of the MMCM, and the MMCM completes the phase locking
- Step S403 the daughter card receives the downlink taming sequence, and records the current phase receiving state; if the taming code is received correctly or the taming code is not received over time, the receiving state of the current phase (correctly received or incorrectly received) is recorded;
- Step S404 the loop counter is incremented by 1, and it is judged whether the loop counter is greater than or equal to 32; in the current downlink taming process, there are 32 phases to be tested, and the 32 phases to be tested need to be recorded one by one for the receiving state of the test packet; If it reaches 32, then go back to step S402, lock the phase to be measured, and execute the steps of judging and recording the phase receiving state in step S403; if the counter reaches 32, then enter step S405;
- step S403 If the taming code is not received over time, adjust the phase of the lvds_in_clk output by the MMCM, reset the timeout counter after the clock is locked, and go to step S403 to restart receiving the taming code.
- Step S405 according to the recorded receiving states of the 32 phases, determine whether there is an optimal phase on the input side, if so, go to step S406; but if there is no optimal phase, go to step S417 to feed back the daughter card MCU (controller), and the output is wrong ;
- Step S406 the optimal phase is fed back to the daughter card MCU, and the input side clock (ie lvds_in_clk) is adjusted to the optimal phase;
- Step S407 the downlink taming of the sub-card is completed, and the current state is fed back to the sub-card MCU;
- Step S408 start the uplink taming process of the daughter card, and adjust the clock phase on the sending side of the MMCM;
- Step S409 the daughter card sends the uplink taming sequence
- Step S410 the daughter card receives the uplink taming sequence, and records the current phase receiving state
- Step S411 the loop counter is incremented by 1, and it is judged whether the loop counter is greater than or equal to 32; in the current uplink taming process, there are 32 phases to be tested, and the 32 phases to be tested need to be recorded one by one test packet transmission state; When the count reaches 32, go to step S412;
- Step S412 according to the recorded transmission states of the 32 phases, comprehensively judge whether there is an optimal phase on the output side;
- step S413 the optimal phase in step S412 is fed back to the sub-card MCU, and the clock on the output side is adjusted to the optimal phase;
- Step S414 the uplink taming of the sub-card is completed, and the current state is fed back to the sub-card MCU;
- Step S415 the sub-card sends the taming completion sequence to the AUX card, and waits for a confirmation;
- Step S416 the taming is completed, and the normal communication mode is entered.
- the downlink (AUX to the sub-card) is tamed.
- the uplink (daughter card to AUX) is tamed, and the normal communication process is entered after the taming is completed.
- FIG. 7 is a schematic diagram of a data processing apparatus according to an embodiment of the present invention.
- the above-mentioned data processing device includes: a phase locking module 71 for locking the receiving phase to each first phase to be measured in the first group of phases to be measured after the first chip is powered on; the phase The test module 72 is configured to enable the first chip to receive the test packet sent by the second chip after the receiving phase is locked to a first phase to be measured each time, and to determine the receiving state, and to obtain the reception corresponding to each first phase to be measured.
- the phase selection module 73 is used for the first chip to determine the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured; the phase adjustment module 74 is used to make the first chip lock the receiving phase to A first target phase for the receive port of the first chip to communicate with the second chip at the first target phase.
- the above-mentioned apparatus further includes modules for executing other method steps in Embodiment 1, which will not be repeated here.
- the optimal phase is selected, and the receiving phase of the clock of the first chip is adjusted accordingly based on the optimal phase, so as to avoid
- the phase offset between the chips in the LVDS communication link is improved, the stability of the data transmission of the LVDS communication link and the efficiency of the data transmission are improved, and the data transmission when the LVDS communication link is used for communication between the chips in the prior art is solved.
- FIG. 8 is a schematic diagram of another data processing apparatus according to an embodiment of the present invention. As shown in FIG. 8 , the apparatus includes:
- the sending module 80 is used for continuously sending a test packet to the first chip when the second chip on the second board detects the idle code sent by the first chip on the first board;
- the stop sending module 82 is configured to stop sending the test packet by the second chip until the second chip detects the completion packet sent by the first chip.
- the above-mentioned apparatus further includes modules for executing other method steps in Embodiment 2, and details are not described herein again.
- FIG. 9 is a schematic diagram of a data processing system for a board card according to an embodiment of the present invention.
- the data processing system includes a plurality of A first board and a second board, the first board and the second board are both arranged on the backplane, and each first board and the second board communicate through low-voltage differential signals, and the second board
- the board is used to send the test package to the first board; the first board is used to lock the receiving phase to each first phase to be tested in the first group of phases to be tested after power-on, and receive the second board
- the first board card is also used to determine the first corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured.
- the target phase is used for the receiving port of the first board to communicate with the second board under the first target phase; the first board is also used to lock the transmit phase to each of the second sets of phases to be tested. Two phases to be tested, and after the sending phase is locked to a second phase to be tested each time, a test package is sent to the second board; the second board is also used to judge whether the test package is correct, and send the test package to the first board according to the judgment result.
- the board returns the receiving state of the test package; the first board is also used to receive the receiving state of the test package, determine the sending state corresponding to each second phase to be tested according to the receiving state of the test package, and according to the receiving state of each second test package
- the transmission state corresponding to the phase determines the second target phase corresponding to the transmission phase.
- the above-mentioned multiple first boards are all daughter cards, and the second board is an AUX card.
- the daughter card dominates the taming process of the entire communication link. Card) to tame, based on the downlink tame result, and then tame the uplink (daughter card to AUX), and enter the normal communication process after the tame is completed.
- the MMCM locks the receiving phase of the sub-card.
- the AUX card sends a test packet to the sub-card, and the sub-card receives the test packet and determines the receiving state, and then enters the next clock sequence.
- the AUX card sends the test package to the daughter card, and the daughter card receives and determines the receiving status.
- select an optimal phase among the receiving phases with the correct receiving state and adjust the receiving phase of the daughter card to the optimal phase, so that the receiving phases of the AUX card and the daughter card are consistent. performance adjustment to complete the downlink tame between the AUX card and the daughter card (ie, the phase adjustment of the data downlink).
- the main control card After completing the downlink taming, the main control card cyclically detects whether the daughter card is powered on. Once it detects that the daughter card is powered on, the main control card sends a taming command to the AUX card (taming can be understood as sending and receiving the phase of the two-way clock through the MMCM make adjustments), make the AUX card enter the taming state, the AUX card sends the downlink taming sequence to make the daughter card enter the taming state, and the AUX card detects whether it receives the uplink taming sequence (ie test packet) sent by the daughter card or completes the sequence ; If the AUX card receives the uplink taming sequence sent by the daughter card, it means that it has entered the step of adjusting the phase of the sending port of the daughter card.
- taming can be understood as sending and receiving the phase of the two-way clock through the MMCM make adjustments
- the status is judged. If the receiving status is correct, loop back the current test package data to the daughter card. If the current test package is a complete package and the taming is completed, the AUX card exits the taming status and enters the normal data receiving status. At the same time, the taming completion status is fed back. to the main control card. According to the above steps, the transmission phase of the sub-card is adjusted to the optimal phase, so as to realize the consistency adjustment of the receiving phase between the AUX card and the sub-card, and complete the uplink taming between the AUX card and the sub-card (that is, the phase adjustment of the data uplink). ).
- the second board communicates with multiple first boards, if the second board tames its own downlink, the operation of the second board will be very complicated. Therefore, the operation of the second board will be very complicated. In this case, the taming of the uplink is performed by the first board.
- the second board serves as both the sending end and the receiving end, sending test packets to multiple first boards and receiving test packets sent by multiple first boards, so that each of the multiple first boards Each board determines the optimal phase of its receive phase and transmit phase.
- the phase of the MMCM sending and receiving two-way (including data uplink and data downlink) clocks By adjusting the phase of the MMCM sending and receiving two-way (including data uplink and data downlink) clocks, the two-way adjustment of the clocks of the sending port and the receiving port of the first board is completed, which solves the problem of LVDS-based communication links.
- FIG. 10 is a schematic diagram of a data processing system for a board card according to an embodiment of the present invention.
- the data processing system includes a first A board and a second board, the first board and the second board are both arranged on the backplane, the first board and the second board communicate through low-voltage differential signals, and the second board uses It is used to send the test package to the first board; the first board is used to lock the receiving phase to each first phase to be measured in the first group of phases to be measured after power-on, and receive the test packets, and determine the receiving state, and obtain the receiving state corresponding to each first phase to be tested; the first board is also used to determine the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured, The receiving port for the first board is used to communicate with the second board in the first target phase; the first board is also used to send a test package to the
- the above-mentioned first board may be any one of board A and board B.
- first board A is used as the above-mentioned first board
- board B is used as the above-mentioned second board to complete the taming of the downlink of board A; then board B is used as the above-mentioned second board.
- the board A is used as the above-mentioned second board, so as to complete the taming of the downlink of the board B.
- the first board is a sub-card A
- the second board is a sub-card B
- the sub-card A and the sub-card B are in one-to-one correspondence.
- the MMCM locks the receiving phase of the subcard A.
- the subcard B sends a test packet to the subcard A
- the subcard A receives the test packet and determines the receiving state, and then enters the next clock sequence, repeating the above steps of subcard B sending a test packet to subcard A, and subcard A receiving and determining the receiving state.
- an optimal phase is selected, and the receiving phase of sub-card A is adjusted to the optimal phase, so as to realize the communication between sub-card B and sub-card A.
- Receive phase consistency adjustment to complete downlink taming of daughter card A ie, data downlink phase adjustment).
- the MMCM locks the receiving phase of the subcard B.
- the subcard A sends a test packet to the subcard B, and the subcard B receives the test packet and determines the receiving state. , and then enter the next clock sequence, and repeat the above steps of subcard A sending a test packet to subcard B, and subcard B receiving and determining the receiving state.
- an optimal phase is selected, and the receiving phase of sub-card B is adjusted to the optimal phase, so as to realize the communication between sub-card B and sub-card A.
- Receive phase consistency adjustment to complete downlink taming of daughter card B that is, phase adjustment of data downlink).
- the optimal phase is screened out, and based on the optimal phase, the receiving phase of the clock of the first board is calculated accordingly. Adjust, correspondingly, determine the optimal phase of the receiving phase of the clock of the second board and adjust accordingly, avoid the phase offset between different boards in the LVDS communication link, and improve the data of the LVDS communication link.
- the stability of transmission and the efficiency of data transmission further solve the technical problem of unstable data transmission in the prior art when LVDS communication links are used to communicate between different boards in one-to-one correspondence.
- an embodiment of a storage medium wherein the storage medium includes a stored program, wherein when the program runs, a device where the storage medium is located is controlled to execute the data processing method.
- an embodiment of a processor is provided, and the processor is used for running a program, wherein the data processing method is executed when the program is running.
- the disclosed technical content can be implemented in other ways.
- the device embodiments described above are only illustrative.
- the division of the units may be a logical function division.
- multiple units or components may be combined or may be Integration into another system, or some features can be ignored, or not implemented.
- the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of units or modules, and may be in electrical or other forms.
- the units described as separate components may or may not be physically separated, and components shown as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
- each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
- the above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.
- the integrated unit if implemented in the form of a software functional unit and sold or used as an independent product, may be stored in a computer-readable storage medium.
- the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention.
- the aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program codes .
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Abstract
Disclosed in the present invention are a data processing method and device, and a data processing system of a board card. A first chip communicates with a second chip by means of low voltage differential signaling. The data processing method comprises: after a first chip is powered on, locking a receiving phase to each first phase to be tested in a first set of phases to be tested; each time after the receiving phase is locked to one first phase to be tested, the first chip receiving a test package sent by a second chip, and determining a receiving state so as to obtain a receiving state corresponding to each first phase to be tested; the first chip determining, according to the receiving state corresponding to each first phase to be tested, a first target phase corresponding to the receiving phase; and the first chip locking the receiving phase to the first target phase so as to enable a receiving port of the first chip to communicate with the second chip under the first target phase. By means of the present invention, the technical problem in the prior art of data transmission being unstable when an LVDS communication link is used for communication between chips is solved.
Description
本发明涉及通信技术领域,具体而言,涉及一种数据处理方法及装置、板卡的数据处理系统。The present invention relates to the field of communication technologies, and in particular, to a data processing method and device, and a data processing system of a board card.
板卡为一种常用的印制电路板,用于控制硬件的运行。目前板卡之间以及板卡上的芯片之间主要通过百兆PHY(Physical Layer,端口物理层)等接口芯片建立通信链路实现互联,但是PHY等接口芯片对数据传输速度和布线资源具有一定的局限性。相比PHY接口芯片建立的通信链路,LVDS(低电压差分信号,Low Voltage Differential Signaling的缩写)通信链路是一种基于低摆幅的差分信号的数据传输技术,具有低功耗、低误码率、低串扰和低辐射的优势,不但可以提高数据传输速率,而且可以降低布线资源和接口芯片带来的局限性。但是,现有的LVDS通信链路建立的互联方法会导致板卡间相位偏移,进而导致数据传输不稳定,限制了LVDS通信链路在板卡间互联的应用。A board is a common printed circuit board used to control the operation of hardware. At present, communication links between boards and chips on boards are mainly established through interface chips such as 100M PHY (Physical Layer, port physical layer) to achieve interconnection, but interface chips such as PHY have certain requirements for data transmission speed and wiring resources. limitations. Compared with the communication link established by the PHY interface chip, the LVDS (Low Voltage Differential Signaling, abbreviation for Low Voltage Differential Signaling) communication link is a data transmission technology based on low-swing differential signals, with low power consumption, low error The advantages of code rate, low crosstalk and low radiation can not only increase the data transmission rate, but also reduce the limitations brought by wiring resources and interface chips. However, the interconnection method established by the existing LVDS communication link will cause the phase shift between the boards, which in turn leads to unstable data transmission, which limits the application of the LVDS communication link in the interconnection between the boards.
针对上述现有技术中芯片间采用LVDS通信链路通信时数据传输不稳定的技术问题,目前尚未提出有效的解决方案。Aiming at the technical problem of unstable data transmission in the above-mentioned prior art when the LVDS communication link is used for communication between chips, an effective solution has not yet been proposed.
发明内容SUMMARY OF THE INVENTION
本发明实施例提供了一种数据处理方法及装置、板卡的数据处理系统,以至少解决芯片间采用LVDS通信链路通信时数据传输不稳定的技术问题。Embodiments of the present invention provide a data processing method and device, and a data processing system for a board card, so as to at least solve the technical problem of unstable data transmission when an LVDS communication link is used for communication between chips.
根据本发明实施例的一个方面,提供了一种数据处理方法,包括:第一芯片和第二芯片之间通过低电压差分信号通信,上述数据处理方法包括:第一芯片上电之后,将接收相位锁定至第一组待测相位中的每个第一待测相位;在接收相位每次锁定至一个第一待测相位之后,第一芯片接收第二芯片发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态;第一芯片根据每个第一待测相位对应的接收状态确定接收相位对应的第一目标相位;第一芯片将接收相位锁定至第一目标相位,以用于第一芯片的接收端口在第一目标相位下与第二芯片进行通信。According to an aspect of the embodiments of the present invention, a data processing method is provided, including: communicating between a first chip and a second chip through a low-voltage differential signal, and the data processing method includes: after the first chip is powered on, receiving The phase is locked to each first phase to be measured in the first group of phases to be measured; after the receiving phase is locked to a first phase to be measured each time, the first chip receives the test packet sent by the second chip and determines the receiving state to obtain the receiving state corresponding to each first phase to be measured; the first chip determines the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured; the first chip locks the receiving phase to the first target phase for the receive port of the first chip to communicate with the second chip at the first target phase.
进一步地,第一组待测相位基于第一芯片接收信号的时钟周期以及预设相位数量得到;或者,第一组待测相位中相邻两个第一待测相位之间的差值为时钟周期除以预设相位数量。Further, the first group of phases to be measured is obtained based on the clock cycle of the signal received by the first chip and the preset number of phases; or, the difference between two adjacent first phases to be measured in the first group of phases to be measured is the clock. Period divided by the preset number of phases.
进一步地,在接收相位每次锁定至第一待测相位之后,第一芯片接收第二芯片发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态,包括:第一芯片接收第二芯片发送的连续多个测试包;如果第一芯片对连续多个测试包全部接收正确,确定第一芯片在当前的第一待测相位下接收状态为接收正确状态;如果第一芯片对任意一个或多个测试包接收错误或超时未接收到,确定第一芯片在当前的第一待测相位下接收状态为接收错误状态。Further, after the receiving phase is locked to the first phase to be measured each time, the first chip receives the test packet sent by the second chip, and determines the receiving state, and obtains the receiving state corresponding to each first phase to be measured, including: A chip receives multiple consecutive test packets sent by the second chip; if the first chip receives all the consecutive multiple test packets correctly, it is determined that the first chip is in the current receiving state of the first phase to be tested as the receiving state; if the first chip receives all the consecutive multiple test packets correctly; A chip receives errors or fails to receive any one or more test packets over time, and determines that the receiving state of the first chip in the current first phase to be tested is a receiving error state.
进一步地,根据每个第一待测相位对应的接收状态确定接收相位对应的第一目标相位,包括:确定接收状态为接收正确状态的第一待测相位为接收相位对应的第一目标相位。Further, determining the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured includes: determining that the first phase to be measured whose receiving state is a receiving correct state is the first target phase corresponding to the receiving phase.
进一步地,在接收状态为接收正确状态的第一待测相位为多个连续相位的情况下,确定接收状态为接收正确状态的第一待测相位为上述接收相位对应的第一目标相位,包括:确定多个连续相位中居中的相位为接收相位对应的第一目标相位。Further, when the receiving state is that the first phase to be measured in the receiving state is a plurality of consecutive phases, it is determined that the first phase to be measured in the receiving state is the receiving correct state is the first target phase corresponding to the above-mentioned receiving phase, including: : Determine the phase in the center of the multiple consecutive phases as the first target phase corresponding to the receiving phase.
进一步地,上述方法还包括:第一芯片将发送相位锁定至第二组待测相位中的每个第二待测相位;在发送相位每次锁定至一个第二待测相位之后,向第二芯片发送测试包,其中,在第一芯片向第二芯片发送测试包之后,第二芯片向第一芯片返回测试包的接收状态;第一芯片接收测试包的接收状态,根据测试包的接收状态确定每个第二待测相位对应的发送状态;根据每个第二待测相位对应的发送状态确定发送相位对应的第二目标相位;第一芯片将发送相位锁定 至第二目标相位,其中,第一芯片的发送端口在第二目标相位下与第二芯片进行通信。Further, the above method also includes: the first chip locks the transmission phase to each second phase to be measured in the second group of phases to be measured; The chip sends a test packet, wherein after the first chip sends the test packet to the second chip, the second chip returns the receiving state of the test packet to the first chip; the first chip receives the receiving state of the test packet, according to the receiving state of the test packet Determine the transmission state corresponding to each second phase to be measured; determine the second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured; the first chip locks the transmission phase to the second target phase, wherein, The transmit port of the first chip communicates with the second chip at the second target phase.
进一步地,第一芯片接收测试包的接收状态,根据测试包的接收状态确定每个第二待测相位对应的发送状态,包括:如果测试包的接收状态为全部接收正确,确定第二待测相位对应的发送状态为发送正确状态;如果任意一个或多个测试包的接收状态为接收错误或超时未接收到,确定第二待测相位对应的发送状态为发送错误状态。Further, the first chip receives the reception state of the test package, and determines the corresponding transmission state of each second phase to be tested according to the reception state of the test package, including: if the reception state of the test package is all received correctly, determine the second phase to be tested. The sending state corresponding to the phase is the correct sending state; if the receiving state of any one or more test packets is the receiving error or the timeout is not received, it is determined that the sending state corresponding to the second phase to be tested is the sending error state.
进一步地,根据每个第二待测相位对应的发送状态确定发送相位对应的第二目标相位,包括:确定发送状态为发送正确状态的第二待测相位为发送相位对应的第二目标相位。Further, determining the second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured includes: determining that the second phase to be measured whose transmission state is the correct transmission state is the second target phase corresponding to the transmission phase.
进一步地,在发送状态为发送正确状态的第二待测相位为多个连续相位的情况下,确定发送状态为发送正确状态的第二待测相位为发送相位对应的第二目标相位,包括:确定多个连续相位中居中的相位为发送相位对应的第一目标相位。Further, in the case where the second phase to be measured whose transmission state is the correct transmission state is a plurality of continuous phases, it is determined that the second phase to be measured whose transmission state is the correct transmission state is the second target phase corresponding to the transmission phase, including: The middle phase among the multiple consecutive phases is determined as the first target phase corresponding to the transmission phase.
进一步地,在第一芯片将发送相位锁定至第二目标相位之后,上述方法还包括:第一芯片向第二芯片发送完成包;其中,第二芯片在接收到测试包后,判断测试包是否为完成包,如果测试包为完成包,第二芯片与第一芯片进入通信模式;如果测试包不为完成包,进入第二芯片向第一芯片返回测试包的接收状态的步骤。Further, after the first chip locks the transmission phase to the second target phase, the method further includes: the first chip sends a completion packet to the second chip; wherein, after receiving the test packet, the second chip determines whether the test packet is To complete the package, if the test package is a complete package, the second chip and the first chip enter the communication mode; if the test package is not a complete package, the second chip returns the receiving state of the test package to the first chip.
进一步地,第二组待测相位基于第一芯片发送信号的时钟周期以及预设相位数量得到,或第一组待测相位中相邻两个第一待测相位之间的差值为第一芯片发送信号的时钟周期除以预设相位数量。Further, the second group of phases to be measured is obtained based on the clock cycle of the signal sent by the first chip and the preset number of phases, or the difference between two adjacent first phases to be measured in the first group of phases to be measured is the first The clock period the chip sends the signal is divided by the preset number of phases.
进一步地,第一芯片的数量为多个,多个第一芯片部署在多个不同的第一板卡上,第二芯片部署在第二板卡上,第二板卡与多个第一板卡中的每个板卡进行通信。Further, the number of the first chips is multiple, the multiple first chips are arranged on multiple different first boards, the second chips are arranged on the second boards, and the second boards are connected to the multiple first boards. Each board in the card communicates.
进一步地,第一芯片和第二芯片均为FPGA芯片,通过第一芯片中的时钟管理器将接收相位分别锁定至第一组待测相位中的每个第一待测相位。Further, the first chip and the second chip are both FPGA chips, and the receiving phase is respectively locked to each first phase to be measured in the first group of phases to be measured by the clock manager in the first chip.
进一步地,在第一芯片将发送相位锁定至第二目标相位之后,上述方法还包括:第一芯片与第二芯片进行通信,第一芯片与第二芯片进行通信的步骤包括:第一芯片将待传输数据按照预设规则进行封装,得到封装数据包;第一芯片对封装数据包进行编码,得到编码结果;第一芯片对编码结果进行加扰,得到加扰结果;第一芯片对加扰结果进行并串转换,并将并串转换后得到的数据包发送至第二芯片;其中,第二芯片通过接收第一芯片发送的数据包,对接收到的数据包进行串并转换,对串并转换结果进行解扰,对解扰结果进行解码,得到待传输数据的封装结果,并根据封装结果进行校验,在校验正确的情况下将待传输数据发送至对应的处理单元。Further, after the first chip locks the transmission phase to the second target phase, the above method further includes: the first chip communicates with the second chip, and the step of the first chip communicating with the second chip includes: the first chip The data to be transmitted is encapsulated according to preset rules to obtain an encapsulated data packet; the first chip encodes the encapsulated data packet to obtain an encoding result; the first chip scrambles the encoding result to obtain a scrambled result; the first chip scrambles The result is subjected to parallel-to-serial conversion, and the data packet obtained after the parallel-to-serial conversion is sent to the second chip; wherein the second chip receives the data packet sent by the first chip, performs serial-to-parallel conversion on the received data packet, and performs serial-to-parallel conversion on the received data packet. And the conversion result is descrambled, the descramble result is decoded, the encapsulation result of the data to be transmitted is obtained, and the verification is performed according to the encapsulation result, and if the verification is correct, the data to be transmitted is sent to the corresponding processing unit.
根据本发明实施例的另一方面,还提供了一种数据处理方法,包括:第二板卡上的第二芯片检测到第一板卡上的第一芯片发送的空闲码时,持续向第一芯片发送测试包;直至第二芯片检测到第一芯片发送的完成包,第二芯片停止发送测试包。According to another aspect of the embodiments of the present invention, a data processing method is further provided, including: when the second chip on the second board detects an idle code sent by the first chip on the first board A chip sends a test packet; until the second chip detects the completion packet sent by the first chip, the second chip stops sending the test packet.
进一步地,第二芯片与多个第一芯片之间通过低电压差分信号通信,上述数据处理方法包括:第二芯片的接收端口采集第一芯片发送的测试包,其中,第一芯片将发送相位锁定至第二组待测相位中的每个第二待测相位,并在发送相位每次锁定至一个第二待测相位之后,向第二芯片发送测试包;第二芯片判断测试包是否正确;第二芯片根据判断结果向第一芯片返回测试包的接收状态;其中,第一芯片接收测试包的接收状态,根据测试包的接收状态确定每个第二待测相位对应的发送状态,并根据每个第二待测相位对应的发送状态确定发送相位对应的第二目标相位。Further, the second chip communicates with a plurality of first chips through low-voltage differential signals, and the data processing method includes: a receiving port of the second chip collects a test packet sent by the first chip, wherein the first chip will send the phase Lock to each second phase to be tested in the second group of phases to be tested, and after the transmission phase is locked to a second phase to be tested each time, send a test packet to the second chip; the second chip judges whether the test packet is correct The second chip returns the receiving state of the test package to the first chip according to the judgment result; wherein, the first chip receives the receiving state of the test package, determines the corresponding transmission state of each second phase to be measured according to the receiving state of the test package, and The second target phase corresponding to the transmission phase is determined according to the transmission state corresponding to each second phase to be measured.
进一步地,在第二芯片判断测试包正确的情况下,在第二芯片根据判断结果向第一芯片返回测试包的接收状态之后,上述方法还包括:第二芯片判断测试包是否为完成包,其中第一芯片确定发送端口的第二目标相位之后,向第二芯片发送完成包;如果测试包为完成包,第二芯片与第一芯片进入通信模式;如果测试包不为完成包,进入第二芯片的接收端口采集第一芯片发送的测试包的步骤。Further, when the second chip judges that the test package is correct, after the second chip returns the receiving state of the test package to the first chip according to the judgment result, the method further includes: the second chip judges whether the test package is a completed package, Wherein, after the first chip determines the second target phase of the sending port, it sends a completion packet to the second chip; if the test packet is a completion packet, the second chip and the first chip enter the communication mode; if the test packet is not a completion packet, enter the first chip The receiving port of the second chip collects the test packet sent by the first chip.
根据本发明实施例的另一方面,还提供了一种数据处理装置,第一芯片和第二芯片之间通过低电压差分信号通信,上述数据处理装置包括:相位锁定模块,用于在所第一芯片上电之后,将接收相位锁定至第一组待测相位中的每个第一待测相位;相位测试模块,用于在接收相位每 次锁定至一个第一待测相位之后,使第一芯片接收第二芯片发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态;相位选择模块,用于第一芯片根据每个第一待测相位对应的接收状态确定接收相位对应的第一目标相位;相位调整模块,用于使第一芯片将接收相位锁定至第一目标相位,以用于第一芯片的接收端口在第一目标相位下与第二芯片进行通信。According to another aspect of the embodiments of the present invention, a data processing apparatus is also provided, in which the first chip and the second chip communicate through low-voltage differential signals, and the data processing apparatus includes: a phase locking module for After a chip is powered on, the receiving phase is locked to each first phase to be measured in the first group of phases to be measured; the phase test module is used to make the first phase to be measured after the receiving phase is locked to a first phase to be measured each time. A chip receives the test packet sent by the second chip, determines the receiving state, and obtains the receiving state corresponding to each first phase to be measured; the phase selection module is used for the first chip to obtain the receiving state corresponding to each first phase to be measured. Determine the first target phase corresponding to the receiving phase; the phase adjustment module is used to make the first chip lock the receiving phase to the first target phase, so that the receiving port of the first chip can perform the first target phase with the second chip under the first target phase. communication.
根据本发明实施例的另一方面,还提供了一种数据处理装置,其特征在于,包括:发送模块,用于第二板卡上的第二芯片检测到第一板卡上的第一芯片发送的空闲码时,持续向所述第一芯片发送测试包;停止发送模块,用于直至所述第二芯片检测到所述第一芯片发送的完成包,所述第二芯片停止发送所述测试包。According to another aspect of the embodiments of the present invention, a data processing apparatus is further provided, which is characterized by comprising: a sending module for detecting the first chip on the first board by the second chip on the second board When the idle code is sent, continue to send the test packet to the first chip; stop the sending module, which is used to stop sending the second chip until the second chip detects the completion packet sent by the first chip. test package.
根据本发明实施例的另一方面,还提供了一种板卡的数据处理系统,包括多个第一板卡和一个第二板卡,第一板卡和第二板卡均设置在背板之上,每个第一板卡与第二板卡之间通过低电压差分信号通信,第二板卡用于向第一板卡发送测试包;第一板卡用于在上电之后,将接收相位分别锁定至第一组待测相位中的每个第一待测相位,接收第二板卡发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态;第一板卡还用于根据每个第一待测相位对应的接收状态确定接收相位对应的第一目标相位,以用于第一板卡的接收端口在第一目标相位下与第二板卡进行通信;第一板卡还用于将发送相位锁定至第二组待测相位中的每个第二待测相位,并在发送相位每次锁定至一个第二待测相位之后,向第二板卡发送测试包;第二板卡还用于判断测试包是否正确,并根据判断结果向第一板卡返回测试包的接收状态;第一板卡还用于接收测试包的接收状态,根据测试包的接收状态确定每个第二待测相位对应的发送状态,并根据每个第二待测相位对应的发送状态确定发送相位对应的第二目标相位。According to another aspect of the embodiments of the present invention, a data processing system for board cards is further provided, including a plurality of first board cards and a second board card, wherein the first board cards and the second board cards are both disposed on the backplane Above, each first board communicates with the second board through low-voltage differential signals, and the second board is used to send a test packet to the first board; the first board is used to The receiving phase is respectively locked to each first phase to be measured in the first group of phases to be measured, receives the test packet sent by the second board, and determines the receiving state, and obtains the receiving state corresponding to each first phase to be measured; A board is further configured to determine the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured, so that the receiving port of the first board can perform the communication with the second board under the first target phase. communication; the first board is also used to lock the transmission phase to each second phase to be measured in the second group of The card sends the test package; the second board is also used to judge whether the test package is correct, and returns the receiving state of the test package to the first board according to the judgment result; the first board is also used to receive the receiving state of the test package, according to the test The reception state of the packet determines the transmission state corresponding to each second phase to be measured, and determines the second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured.
根据本发明实施例的另一方面,还提供了一种板卡的数据处理系统,包括一个第一板卡和一个第二板卡,第一板卡和第二板卡均设置在背板之上,第一板卡与第二板卡之间通过低电压差分信号通信,第二板卡用于向第一板卡发送测试包;第一板卡用于在上电之后,将接收相位分别锁定至第一组待测相位中的每个第一待测相位,接收第二板卡发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态;第一板卡还用于根据每个第一待测相位对应的接收状态确定接收相位对应的第一目标相位,以用于第一板卡的接收端口在第一目标相位下与第二板卡进行通信;第一板卡还用于向第二板卡发送测试包;第二板卡还用于在上电之后,将接收相位分别锁定至第三组待测相位中的每个第三待测相位,接收第一板卡发送的测试包,并确定接收状态,得到每个第三待测相位对应的接收状态;第二板卡还用于根据每个第三待测相位对应的接收状态确定接收相位对应的第三目标相位,以用于第二板卡的接收端口在第三目标相位下与第一板卡进行通信。According to another aspect of the embodiments of the present invention, a data processing system for a board is also provided, including a first board and a second board, both of which are arranged between the backplane On, the first board and the second board communicate through low-voltage differential signals, and the second board is used to send test packets to the first board; the first board is used to separate the receiving phases after power-on Lock to each first phase to be tested in the first group of phases to be tested, receive the test packet sent by the second board, and determine the receiving state to obtain the receiving state corresponding to each first phase to be tested; the first board It is also used to determine the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured, so that the receiving port of the first board card communicates with the second board card under the first target phase; The first board is also used to send the test package to the second board; the second board is also used to lock the receiving phase to each third phase to be measured in the third group of phases to be measured after power-on, respectively, to receive The test package sent by the first board card, and the receiving state is determined, and the receiving state corresponding to each third phase to be tested is obtained; the second board card is also used to determine the corresponding receiving phase according to the receiving state corresponding to each third phase to be tested. The third target phase is used for the receiving port of the second board to communicate with the first board in the third target phase.
根据本发明实施例的另一方面,还提供了一种存储介质,包括存储的程序,其中,在程序运行时控制存储介质所在设备执行上述数据处理方法。According to another aspect of the embodiments of the present invention, a storage medium is further provided, including a stored program, wherein when the program is run, a device where the storage medium is located is controlled to execute the above data processing method.
根据本发明实施例的另一方面,还提供了一种处理器,用于运行程序,其中,上述程序运行时执行上述数据处理方法。According to another aspect of the embodiments of the present invention, a processor is further provided for running a program, wherein the data processing method is executed when the program is running.
在本发明实施例中,通过确定对应的相位下第二芯片数据发送以及第一芯片数据的接收状态,筛选出最佳相位,对第一芯片时钟的接收相位进行相应的调整,实现了第一芯片相位和第二芯片相位的一致,避免了在LVDS通信链路中芯片之间的相位偏移,提高了LVDS通信链路数据传输的稳定性以及数据传输的效率,进而解决了现有技术中芯片间采用LVDS通信链路通信时数据传输不稳定的技术问题。In the embodiment of the present invention, by determining the data transmission state of the second chip and the receiving state of the data of the first chip under the corresponding phase, the optimal phase is selected, and the receiving phase of the clock of the first chip is adjusted accordingly, so as to realize the first chip. The phase of the chip is consistent with the phase of the second chip, which avoids the phase shift between chips in the LVDS communication link, improves the data transmission stability and data transmission efficiency of the LVDS communication link, and solves the problem in the prior art. The technical problem of unstable data transmission when the LVDS communication link is used for communication between chips.
此处所说明的附图用来提供对本发明的进一步理解,构成本申请的一部分,本发明的示意性实施例及其说明用于解释本发明,并不构成对本发明的不当限定。在附图中:The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the attached image:
图1是根据本发明实施例的一种数据处理方法的流程图;1 is a flowchart of a data processing method according to an embodiment of the present invention;
图2a是根据本发明实施例的一种数据处理方法的流程图;2a is a flowchart of a data processing method according to an embodiment of the present invention;
图2a是根据本发明实施例的一种可选的数据处理方法的流程图;2a is a flowchart of an optional data processing method according to an embodiment of the present invention;
图3是根据本发明实施例的可选的数据处理方法的流程图;3 is a flowchart of an optional data processing method according to an embodiment of the present invention;
图4是根据本发明实施例的可选的数据处理方法的流程图;4 is a flowchart of an optional data processing method according to an embodiment of the present invention;
图5是一种可选的LVDS通信模块的示意图;5 is a schematic diagram of an optional LVDS communication module;
图6是根据本发明实施例的可选的数据处理方法示意图;6 is a schematic diagram of an optional data processing method according to an embodiment of the present invention;
图7是根据本发明实施例的数据处理装置的示意图;7 is a schematic diagram of a data processing apparatus according to an embodiment of the present invention;
图8为根据本发明实施例的另一种数据处理装置的示意图;8 is a schematic diagram of another data processing apparatus according to an embodiment of the present invention;
图9是根据本发明实施例的板卡的数据处理系统的示意图;9 is a schematic diagram of a data processing system for a board card according to an embodiment of the present invention;
图10是根据本发明实施例的板卡的数据处理系统的示意图。FIG. 10 is a schematic diagram of a data processing system of a board card according to an embodiment of the present invention.
为了使本技术领域的人员更好地理解本发明方案,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分的实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本发明保护的范围。In order to make those skilled in the art better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only Embodiments are part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
需要说明的是,本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便这里描述的本发明的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。It should be noted that the terms "first", "second" and the like in the description and claims of the present invention and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used may be interchanged under appropriate circumstances such that the embodiments of the invention described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those expressly listed Rather, those steps or units may include other steps or units not expressly listed or inherent to these processes, methods, products or devices.
以下实施中出现的第一板卡和第二板卡之间的数据发送或者接收,实际为第一板卡上的芯片与第二板卡上的芯片之间的通信方式(即不同板卡的芯片间通信),第一芯片和第二芯片之间的通信,包含同一板卡上的不同芯片的通信以及不同板卡之间的芯片通信。The data transmission or reception between the first board and the second board in the following implementation is actually the communication method between the chip on the first board and the chip on the second board (that is, the Inter-chip communication), the communication between the first chip and the second chip, including the communication between different chips on the same board and the chip communication between different boards.
实施例1Example 1
根据本发明实施例,提供了一种板卡的数据处理方法的实施例,需要说明的是,在附图的流程图示出的步骤可以在诸如一组计算机可执行指令的计算机系统中执行,并且,虽然在流程图中示出了逻辑顺序,但是在某些情况下,可以以不同于此处的顺序执行所示出或描述的步骤。According to an embodiment of the present invention, an embodiment of a data processing method for a board card is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, Also, although a logical order is shown in the flowcharts, in some cases the steps shown or described may be performed in an order different from that herein.
图1是根据本发明实施例的数据处理方法,包括:第一芯片和第二芯片之间通过低电压差分信号通信,如图1所示,该方法包括如下步骤:FIG. 1 is a data processing method according to an embodiment of the present invention, which includes: a low-voltage differential signal communicates between a first chip and a second chip. As shown in FIG. 1 , the method includes the following steps:
步骤S101,第一芯片上电之后,将接收相位锁定至第一组待测相位中的每个第一待测相位。Step S101 , after the first chip is powered on, the receiving phase is locked to each first phase to be measured in the first group of phases to be measured.
上述第一芯片的接收相位锁定可由MMCM(Mixed Mode Clock Manager,模式时钟管理器)完成。上述第一组待测相位包含多个第一待测相位,需要将每个第一待测相位均进行锁定,以实现在每个第一待测相位下的数据传输测试。可选的,第一组待测相位至少包含32个第一待测相位。The receiving phase locking of the above-mentioned first chip can be completed by MMCM (Mixed Mode Clock Manager, mode clock manager). The above-mentioned first group of phases to be measured includes a plurality of first phases to be measured, and it is necessary to lock each of the first phases to be measured, so as to realize the data transmission test under each of the first phases to be measured. Optionally, the first group of phases to be measured includes at least 32 first phases to be measured.
需要说明的是,第一芯片上电后,可以自动触发MMCM对其接收相位进行锁定,也可以通过手动发送指令控制MMCM实现相位锁定。上述第一芯片和第二芯片可以为同一板卡上的芯片,也可以为不同板卡上的芯片。It should be noted that, after the first chip is powered on, the MMCM can be automatically triggered to lock the receiving phase, or the MMCM can be controlled to achieve phase locking by manually sending an instruction. The above-mentioned first chip and second chip may be chips on the same board or chips on different boards.
步骤S102,在接收相位每次锁定至一个第一待测相位之后,第一芯片接收第二芯片发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态。Step S102 , after the receiving phase is locked to a first phase to be measured each time, the first chip receives the test packet sent by the second chip, and determines the receiving state to obtain the receiving state corresponding to each first phase to be measured.
上述测试包包括数据序列。接收状态包括接收正确(可用1表示)和接收错误(可用0表示),其中,接收正确状态包括第一芯片接收到的测试包数据正确,接收错误状态包括第一芯片接收到测试包的数据错误或者第一芯片超时未接收到测试包。在接收状态为正确的情况下, 说明第一芯片的接收时钟在当前相位下,接收端口能够准确的接收到数据。The above test packets include data sequences. The reception status includes correct reception (represented by 1) and reception error (represented by 0), wherein the reception correct status includes that the test packet data received by the first chip is correct, and the reception error status includes that the first chip receives the test packet data error Or the first chip times out and does not receive the test packet. If the receiving state is correct, it means that the receiving clock of the first chip is in the current phase, and the receiving port can receive data accurately.
第一组待测相位中的每个第一待测相位,均会有一个确定的接收状态,例如,第一组待测相位中共包含N个第一待测相位,则根据步骤S102,会得到N个与第一待测相位一一对应的接收状态,N为整数。Each first phase to be measured in the first group of phases to be measured will have a definite receiving state. For example, if the first group of phases to be measured contains N first phases to be measured in total, then according to step S102, it will be obtained N receiving states corresponding to the first phase to be measured one-to-one, where N is an integer.
步骤S103,第一芯片根据每个第一待测相位对应的接收状态确定接收相位对应的第一目标相位;Step S103, the first chip determines the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured;
上述第一目标相位可以理解为在第一组待测相位中根据第一芯片的接收状态筛选出的最佳相位,第一目标相位应为具有接收状态为正确的第一待测相位,以使第一芯片在第一目标相位下接收的数据序列与第二芯片发送的数据序列一致。例如,第一组待测相位中的N个第一待测相位,分别获得了N个对应的接收状态,可以从具有接收状态为正确的第一待测相位中,筛选确定出第一目标相位。The above-mentioned first target phase can be understood as the best phase selected according to the receiving state of the first chip in the first group of phases to be measured, and the first target phase should be the first phase to be measured with the correct receiving state, so that the The data sequence received by the first chip in the first target phase is consistent with the data sequence sent by the second chip. For example, for the N first phases to be measured in the first group of phases to be measured, N corresponding receiving states are obtained respectively, and the first target phase can be screened and determined from the first phases to be measured whose receiving states are correct. .
步骤S104,第一芯片将接收相位锁定至第一目标相位,以用于第一芯片的接收端口在第一目标相位下与第二芯片进行通信。Step S104, the first chip locks the receiving phase to the first target phase, so that the receiving port of the first chip can communicate with the second chip under the first target phase.
根据步骤S103中筛选出的第一目标相位,将第一芯片的接收端口的时钟调整至第一目标相位,完成对第一芯片接收端口时钟相位的调整,使得第一芯片的接收端口处最佳相位。According to the first target phase screened in step S103, adjust the clock of the receiving port of the first chip to the first target phase, and complete the adjustment of the clock phase of the receiving port of the first chip, so that the receiving port of the first chip is optimal phase.
上述步骤中,第二芯片作为数据发送端,第一芯片作为数据接收端,将第一芯片的接收端口的相位调整至第一目标相位,可认为上述步骤S101-S104实现了第一芯片的下行链路的驯服过程,驯服后的下行链路是稳定的。In the above steps, the second chip is used as the data sending end, the first chip is used as the data receiving end, and the phase of the receiving port of the first chip is adjusted to the first target phase. It can be considered that the above steps S101-S104 realize the downlink of the first chip. The taming process of the link, the downlink after taming is stable.
需要说明的是,当两个通过LVDS通信的芯片A和B一一对应时,上述第一芯片可以为芯片A和芯片B中的任意一个。在一种可选的实施例中,先将芯片A作为上述第一芯片,将芯片B作为上述第二芯片,完成芯片A的下行链路的驯服;然后将芯片B作为上述第一芯片,将芯片A作为上述第二芯片,来完成芯片B的下行链路的驯服。通过上述两次驯服,即可使得芯片A和芯片B之间的收发都处于稳定的状态。It should be noted that, when two chips A and B that communicate through LVDS are in one-to-one correspondence, the above-mentioned first chip may be any one of chip A and chip B. In an optional embodiment, chip A is used as the first chip and chip B is used as the second chip to complete the downlink taming of chip A; then chip B is used as the first chip, and chip B is used as the first chip. Chip A is used as the second chip to complete the downlink taming of chip B. Through the above two times of taming, the transceiver between chip A and chip B can be in a stable state.
通过上述步骤,通过确定对应的相位下第二芯片数据发送以及第一芯片数据的接收状态,筛选出最佳相位,基于该最佳相位对第一芯片时钟的接收相位进行相应的调整,避免了在LVDS通信链路中芯片之间的相位偏移,提高了LVDS通信链路数据传输的稳定性以及数据传输的效率,进而解决了现有技术中芯片间采用LVDS通信链路通信时数据传输不稳定的技术问题。Through the above steps, by determining the data transmission state of the second chip and the receiving state of the first chip data under the corresponding phase, the optimal phase is screened out, and the receiving phase of the first chip clock is adjusted accordingly based on the optimal phase, thereby avoiding The phase offset between chips in the LVDS communication link improves the stability of data transmission and the efficiency of data transmission in the LVDS communication link, thereby solving the problem of inconsistency in data transmission when the LVDS communication link is used for communication between chips in the prior art. Stable technical issues.
作为一种可选的实施例,第一组待测相位基于第一芯片接收信号的时钟周期以及预设相位数量得到;或者,第一组待测相位中相邻两个第一待测相位之间的差值为时钟周期除以预设相位数量。As an optional embodiment, the first group of phases to be measured is obtained based on the clock period of the signal received by the first chip and the preset number of phases; or, the difference between two adjacent first phases to be measured in the first group of phases to be measured The difference is the clock period divided by the preset number of phases.
上述预设相位数量可以理解为第一组待测相位中的相位数量,例如,第一芯片接收信号的时钟周期为50ns,预设相位数量可选为32个,则第一组待测相位中相邻两个第一待测相位之间的差值为50ns/32,设定第一待测相位的初始值,将该初始值以50ns/32为步长单位增加或者减少,依次可以获得第一组待测相位中多个第一待测相位。The above-mentioned preset number of phases can be understood as the number of phases in the first group of phases to be measured. For example, if the clock cycle of the first chip receiving the signal is 50ns, and the preset number of phases can be selected as 32, then the number of phases to be measured in the first group of phases is 50ns. The difference between two adjacent first phases to be measured is 50ns/32. Set the initial value of the first phase to be measured, and increase or decrease the initial value in steps of 50ns/32. A plurality of first to-be-measured phases in a group of to-be-measured phases.
作为一种可选的实施例,在接收相位每次锁定至第一待测相位之后,第一芯片接收第二芯片发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态,包括:第一芯片接收第二芯片发送的连续多个测试包;如果第一芯片对连续多个测试包全部接收正确,确定第一芯片在当前的第一待测相位下接收状态为接收正确状态;如果第一芯片对任意一个或多个测试包接收错误或超时未接收到,确定第一芯片在当前的第一待测相位下接收状态为接收错误状态。As an optional embodiment, after the receiving phase is locked to the first phase to be measured each time, the first chip receives the test packet sent by the second chip, determines the receiving state, and obtains the corresponding value of each first phase to be measured. The receiving state includes: the first chip receives multiple consecutive test packets sent by the second chip; if the first chip receives all the continuous multiple test packets correctly, it is determined that the receiving state of the first chip under the current first phase to be tested is: The receiving state is correct; if the first chip receives any one or more test packets incorrectly or fails to receive it over time, it is determined that the receiving state of the first chip in the current first phase to be tested is a receiving error state.
需要说明的是,第二芯片发送连续多个测试包时,接收正确状态仅为多个测试包的数据全部正确。如果多个测试包中发生某一个测试包的数据或者某一个测试包中数据的部分字段错误或者丢失,均属于接收错误状态。It should be noted that when the second chip sends multiple test packets in succession, the receiving correct state is only that the data of the multiple test packets are all correct. If the data of a certain test packet or some fields of the data in a certain test packet are wrong or lost in multiple test packets, it belongs to the receiving error state.
根据上述步骤,通过增加测试包的数量,增加了数据序列比对的采样数量,实现了更为准确的接收状态的判断。According to the above steps, by increasing the number of test packets, the number of samples for data sequence comparison is increased, thereby realizing a more accurate judgment of the receiving state.
作为一种可选的实施例,根据每个第一待测相位对应的接收状态确定接收相位对应的第一目标相位,包括:确定接收状态为接收正确状态的第一待测相位为接收相位对应的第一目标相 位。As an optional embodiment, determining the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured includes: determining that the first phase to be measured whose receiving state is the correct receiving state is corresponding to the receiving phase the first target phase.
对应于第一目标相位,第一芯片接收的测试包的数据与第二芯片发送的测试包的数据一致,即第一芯片接收端口具有最佳相位,可作为正常数据传输时的接收端的时钟相位,使得第一芯片在接收数据时处于稳定的状态。Corresponding to the first target phase, the data of the test packet received by the first chip is consistent with the data of the test packet sent by the second chip, that is, the receiving port of the first chip has an optimal phase, which can be used as the clock phase of the receiving end during normal data transmission. , so that the first chip is in a stable state when receiving data.
通过上述步骤,明确了第一目标相位的确定方法,解决了如何确定第一芯片的第一目标相位的问题。Through the above steps, the method for determining the first target phase is clarified, and the problem of how to determine the first target phase of the first chip is solved.
作为一种可选的实施例,在接收状态为接收正确状态的第一待测相位为多个连续相位的情况下,确定接收状态为接收正确状态的第一待测相位为上述接收相位对应的第一目标相位,包括:确定多个连续相位中居中的相位为接收相位对应的第一目标相位。As an optional embodiment, when the first phase to be measured whose receiving state is the correct receiving state is a plurality of consecutive phases, it is determined that the first phase to be measured whose receiving state is the correct receiving state is the one corresponding to the foregoing receiving phase. The first target phase includes: determining the middle phase among the multiple continuous phases as the first target phase corresponding to the receiving phase.
由于第一组待测相位中包含多个第一待测相位,多个第一待测相位所对应的接收状态中包含接收正确状态1,和接收错误状态0。通常情况下,具有接收正确状态1的第一待测相位为连续的相位。如果具有接收正确状态1的相位为偶数个连续的相位,则选择处于居中位置的两个相位中的任意一个为第一目标相位,例如,第一组待测相位包含7个第一待测相位,对应的接收状态依次为0011110,由此可以得到接收顺序为第3位、第4位、第5位和第6位的相位具有接收正确状态,则确定第一目标相位可以是位置为第4位的相位,也可以是位置为第5位的相位。如果具有接收正确状态1的第一待测相位为奇数个连续的相位,则选择位中居中的相位为接收相位对应的第一目标相位,例如,第一组待测相位包含6个第一待测相位,对应的接收状态依次为001110,由此可以得到接收顺序为第3位、第4位、第5位的相位具有接收正确状态,其中,位置为第4位的相位处于居中位置,则确定位置为第4位的相位为第一目标相位。Since the first group of phases to be measured includes a plurality of first phases to be measured, the receiving states corresponding to the plurality of first phases to be measured include a receiving correct state 1 and a receiving error state 0. Typically, the first phase to be measured with the received correct state 1 is a continuous phase. If the phase with the receiving correct state 1 is an even number of consecutive phases, select any one of the two phases in the center position as the first target phase, for example, the first group of phases to be measured includes 7 first phases to be measured , the corresponding receiving state is 0011110 in sequence, from which it can be obtained that the phases with the receiving order of the third, fourth, fifth and sixth have the correct receiving state, then it is determined that the first target phase can be the fourth position. The phase of the bit may be the phase of the fifth bit. If the first phase to be measured with the receiving correct state 1 is an odd number of consecutive phases, the phase in the middle of the bits is selected as the first target phase corresponding to the receiving phase. For example, the first group of phases to be measured includes 6 first phase to be measured. The corresponding receiving states are 001110 in turn. From this, it can be obtained that the phases whose receiving order is the 3rd, 4th, and 5th digit have the correct receiving state. Among them, the phase whose position is the 4th digit is in the middle position, then The phase whose position is determined to be the 4th bit is the first target phase.
通过上述步骤,实现了从多个连续具有接收正确状态的第一待测相位中确定出唯一的第一目标相位,进一步明确了第一目标相位的确定方法。Through the above steps, it is achieved that a unique first target phase is determined from a plurality of first phases to be measured that have a receiving correct state, and the method for determining the first target phase is further clarified.
上述实施例提出了芯片对于下行链路的驯服过程。在两个芯片之间是一对一进行数据传输的情况下,两个芯片分别进行各自下行链路的驯服后再进行通信,即可使二者的通信较为稳定。但存在一种情况是,第二芯片与多个第一芯片通信,在这种情况下,如果由第二芯片来进行自己的下行链路的驯服,则第二芯片的操作会非常复杂,因此在这种情况下,由第一芯片进行上行链路的驯服。下面对第一芯片进行上行链路的驯服的方式进行说明。The above-mentioned embodiment proposes the taming process of the chip for the downlink. In the case of one-to-one data transmission between the two chips, the two chips can tame their respective downlinks and then communicate with each other, so that the communication between the two chips is relatively stable. But there is a situation that the second chip communicates with multiple first chips, in this case, if the second chip does its own downlink tame, the operation of the second chip will be very complicated, so In this case, the taming of the uplink is performed by the first chip. The manner in which the first chip performs uplink taming will be described below.
作为一种可选的实施例,上述数据处理方法还包括如下步骤:As an optional embodiment, the above data processing method further includes the following steps:
步骤S105,第一芯片将发送相位锁定至第二组待测相位中的每个第二待测相位;Step S105, the first chip locks the transmission phase to each second phase to be measured in the second group of phases to be measured;
上述第一芯片的发送相位锁定可由MMCM完成,实现在每个第二待测相位下的数据传输测试。第二组待测相位包含多个第二待测相位。可选的,第二组待测相位包含32个第二待测相位。The above-mentioned transmission phase locking of the first chip can be completed by the MMCM, so as to realize the data transmission test under each second phase to be tested. The second group of phases to be measured includes a plurality of second phases to be measured. Optionally, the second group of phases to be measured includes 32 second phases to be measured.
步骤S106,在发送相位每次锁定至一个第二待测相位之后,向第二芯片发送测试包,其中,在第一芯片向第二芯片发送测试包之后,第二芯片向第一芯片返回测试包的接收状态。Step S106, after the transmission phase is locked to a second phase to be tested each time, a test packet is sent to the second chip, wherein after the first chip sends the test packet to the second chip, the second chip returns the test to the first chip The reception status of the packet.
接收状态包括接收正确(可用1表示)和接收错误(可用0表示)。接收正确状态包括第二芯片接收到的测试包的数据正确(即第二芯片收到的测试包内的数据与第一芯片发送的测试包内的数据相同),接收错误状态包括第二芯片接收到测试包的数据错误或者没有接收到测试包。The reception status includes correct reception (represented by 1) and reception error (represented by 0). The receiving correct state includes that the data of the test packet received by the second chip is correct (that is, the data in the test packet received by the second chip is the same as the data in the test packet sent by the first chip), and the receiving error state includes the second chip receiving The data to the test packet was wrong or the test packet was not received.
对于每个第二待测相位,第二芯片均会产生一个确定测试包的接收状态,并将该接收状态返回给第一芯片。可选的,对于具有接收正确的测试包,第二芯片将会向第一芯片还回该测试包。For each second phase to be tested, the second chip will generate a receiving status for determining the test packet, and return the receiving status to the first chip. Optionally, for receiving the correct test packet, the second chip will return the test packet to the first chip.
步骤S107,第一芯片接收测试包的接收状态,根据测试包的接收状态确定每个第二待测相位对应的发送状态。Step S107 , the first chip receives the reception status of the test packet, and determines the transmission status corresponding to each second phase to be tested according to the reception status of the test packet.
第二芯片对测试包的接收状态与第一芯片对测试包的发送状态应一致,如果第二芯片的接收状态为接收正确,则可以确定该第二待测相位对应的第一芯片的发送状态为发送正确;如果第二芯片接收状态为接收错误,则可以确定该第二待测相位对应的第一芯片的发送状态为发送错误。例如,对于锁定的5个第二待测相位,第二芯片返回的接收状态依次为00110,则第一芯片对应于该组第二待测相位的发送状态为00110。The receiving state of the test package by the second chip should be consistent with the sending state of the test package by the first chip. If the receiving state of the second chip is correct, the sending state of the first chip corresponding to the second phase to be tested can be determined. If the receiving state of the second chip is a receiving error, it can be determined that the sending state of the first chip corresponding to the second phase to be measured is a sending error. For example, for the five locked second phases to be measured, the receiving status returned by the second chip is 00110 in sequence, and the sending status of the first chip corresponding to the group of second phases to be measured is 00110.
由于在该实施例下,第二芯片与多个第一芯片通信,如果第二芯片对每个第一芯片发送的测试包均进行接收状态的判断,计算过程较为复杂,需要较长的工作时间。可选的,在当前锁定的第二待测相位下,如果第一芯片接收到与其发送内容相同的测试包内的数据,则确定第一芯片在该第二待测相位下的发送状态为发送正确状态。在这种方法下,对于具有接收正确状态的测试包,第二芯片给第一芯片返回的并不是直接的接收状态,而是该测试包的数据,第一芯片通过判断其接收的到测试包与其发送的数据包是否相同,以确定该相位对应的发送状态。通过这种方法,可以减少第二芯片在接收状态判断过程的计算量。Since in this embodiment, the second chip communicates with multiple first chips, if the second chip judges the receiving state of the test packets sent by each first chip, the calculation process is complicated and requires a long working time . Optionally, in the currently locked second phase to be tested, if the first chip receives data in a test packet with the same content sent by the first chip, it is determined that the sending state of the first chip in the second phase to be tested is sending. correct state. In this method, for a test packet with the correct status of receiving, the second chip does not return the direct receiving status to the first chip, but the data of the test packet, and the first chip judges that it has received the test packet by Whether the data packets sent by it are the same to determine the sending state corresponding to the phase. Through this method, the calculation amount of the second chip in the process of judging the receiving state can be reduced.
步骤S108,根据每个第二待测相位对应的发送状态确定发送相位对应的第二目标相位。Step S108: Determine a second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured.
上述第二目标相位可以理解为在第二组待测相位中根据第一芯片的发送状态筛选出的最佳相位,第二目标相位应为具有发送正确状态的相位,以使第一芯片在第二目标相位下发送的数据与第二芯片接收的数据一致。The above-mentioned second target phase can be understood as the best phase selected according to the transmission state of the first chip in the second group of phases to be measured, and the second target phase should be the phase with the correct transmission state, so that the first chip is in the first phase. The data sent in the two target phases is consistent with the data received by the second chip.
步骤S109,第一芯片将发送相位锁定至第二目标相位,其中,第一芯片的发送端口在第二目标相位下与第二芯片进行通信Step S109, the first chip locks the transmit phase to the second target phase, wherein the transmit port of the first chip communicates with the second chip under the second target phase
将第一芯片的发送端口的时钟调整至第二目标相位,完成对第一芯片发送端口时钟相位的调整,也即完成对上行链路的驯服。The clock of the transmission port of the first chip is adjusted to the second target phase, and the adjustment of the clock phase of the transmission port of the first chip is completed, that is, the taming of the uplink is completed.
通过上述步骤S105-S109,第二芯片作为测试包数据接收端,第一芯片作为测试包数据发送端,通过对不同第二待测相位下的数据发送状态的确定,实现了对第一芯片的发送端口的相位调整,可认为上述步骤S105-S109实现了芯片之间数据上行链路的驯服。Through the above steps S105-S109, the second chip is used as the test packet data receiving terminal, and the first chip is used as the test packet data transmission terminal. For the phase adjustment of the sending port, it can be considered that the above steps S105-S109 realize the taming of the data uplink between chips.
根据上述步骤S101-S109,通过对MMCM收发双向(包括了数据上行链路和数据下行链路)时钟的相位做调整,完成了对第一芯片的发送端口和接收端口的时钟的双向调整,解决了基于LVDS通信链路的芯片间通讯存在相位偏差的问题,进而解决了芯片间采用LVDS通信链路通信时数据传输不稳定的问题,保证LVDS线上数据能够进行正常的采样,并且在芯片间建立了稳定可靠的LVDS通信链路,提高了数据传输效率。According to the above steps S101-S109, by adjusting the phase of the MMCM transceiver bidirectional (including data uplink and data downlink) clocks, the bidirectional adjustment of the clocks of the transmitting port and the receiving port of the first chip is completed, solving the problem of It solves the problem of phase deviation in the communication between chips based on LVDS communication link, and solves the problem of unstable data transmission when the communication between chips adopts LVDS communication link. A stable and reliable LVDS communication link is established, which improves the data transmission efficiency.
作为一种可选的实施例,第一芯片接收测试包的接收状态,根据测试包的接收状态确定每个第二待测相位对应的发送状态,包括:如果测试包的接收状态为全部接收正确,确定第二待测相位对应的发送状态为发送正确状态;如果任意一个或多个测试包的接收状态为接收错误或超时未接收到,确定第二待测相位对应的发送状态为发送错误状态。As an optional embodiment, the first chip receives the reception status of the test packet, and determines the transmission status corresponding to each second phase to be tested according to the reception status of the test packet, including: if the reception status of the test packet is all received correctly , determine that the sending state corresponding to the second phase to be tested is the correct sending state; if the receiving state of any one or more test packets is a receiving error or the timeout is not received, determine that the sending state corresponding to the second phase to be tested is a sending error state .
在每个第二待测相位对应多个测试包的情况下,第二芯片的接收状态为接收正确,理解为多个测试包的数据全部正确,即多个测试包中每个测试包的数据接收应与第一芯片发送的每个测试包的数据一致;任意一个或多个测试包的接收状态为接收错误或超时未接收到,理解为不同测试包的时序错误或者每个时序包中的数据错误均属于接收状态为错误的情况。由于第二芯片对测试包的接收状态与第一芯片对测试包的发送状态一致,因此第二芯片的接收状态为正确或者错误,可确定第二待测相位对应的发送状态为正确状态或者错误状态。In the case where each second phase to be tested corresponds to multiple test packets, the receiving state of the second chip is correct, which means that the data of the multiple test packets are all correct, that is, the data of each test packet in the multiple test packets is correct. The reception should be consistent with the data of each test packet sent by the first chip; the reception status of any one or more test packets is reception error or timeout not received, which is understood as the timing error of different test packets or the error in each timing packet. Data errors are all cases where the reception status is an error. Since the receiving state of the second chip to the test packet is consistent with the sending state of the first chip to the test packet, the receiving state of the second chip is correct or incorrect, and it can be determined that the transmitting state corresponding to the second phase to be tested is correct or incorrect state.
根据上述步骤,实现了根据第二芯片的接收状态确定出第一芯片的发送状态。According to the above steps, the sending state of the first chip is determined according to the receiving state of the second chip.
作为一种可选的实施例,根据每个第二待测相位对应的发送状态确定发送相位对应的第二目标相位,包括:确定发送状态为发送正确状态的第二待测相位为发送相位对应的第二目标相位。As an optional embodiment, determining the second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured includes: determining that the second phase to be measured whose transmission state is the correct transmission state is corresponding to the transmission phase the second target phase.
对应于第二目标相位,第一芯片发送的测试包的数据与第二芯片接收的测试包的数据一致,即第一芯片的发送端口具有最佳的相位,可作为正常数据传输时发送端的时钟相位。Corresponding to the second target phase, the data of the test packet sent by the first chip is consistent with the data of the test packet received by the second chip, that is, the sending port of the first chip has the best phase, which can be used as the clock of the sending end during normal data transmission. phase.
上述第一目标相位与第二目标相位可以相同,也可以不同。The first target phase and the second target phase may be the same or different.
作为一种可选的实施例,在发送状态为发送正确状态的第二待测相位为多个连续相位的情况下,确定发送状态为发送正确状态的第二待测相位为发送相位对应的第二目标相位,包括:确定多个连续相位中居中的相位为发送相位对应的第一目标相位。As an optional embodiment, when the second phase to be measured whose transmission state is the correct transmission state is a plurality of consecutive phases, it is determined that the second phase to be measured whose transmission state is the correct transmission state is the first phase corresponding to the transmission phase. Two target phases, including: determining a middle phase among the multiple continuous phases as the first target phase corresponding to the transmission phase.
由于第二组待测相位中包含多个第二待测相位,多个第二待测相位所对应的发送状态中包含发送正确状态1,和发送错误状态0。通常情况下,具有发送正确状态1的第二待测相位为连续的相位。如果具有发送正确状态1的相位为偶数个连续的相位,则选择处于居中位置的两个相位中的任意一个为第二目标相位,例如,第二组待测相位包含7个第二待测相位,对应的发 送状态依次为0011110,由此可以得到发送顺序为第3位、第4位、第5位和第6位的相位具有发送正确状态,则确定第二目标相位可以是位置为第4位的相位,也可以是位置为第5位的相位。如果具有发送正确状态1的第二待测相位为奇数个连续的相位,则选择位中居中的相位为发送相位对应的第二目标相位,例如,第二组待测相位包含6个第二待测相位,对应的发送状态依次为001110,由此可以得到发送顺序为第3位、第4位、第5位的相位具有发送正确状态,其中,位置为第4位的相位处于居中位置,则确定位置为第4位的相位为第二目标相位。Since the second group of phases to be measured includes a plurality of phases to be measured, the transmission states corresponding to the plurality of phases to be measured include a transmission correct state 1 and a transmission error state 0. In general, the second phase to be measured with the transmission correct state 1 is a continuous phase. If the phase with the correct state 1 is an even number of consecutive phases, select any one of the two phases in the center position as the second target phase, for example, the second group of phases to be measured contains 7 phases to be measured. , the corresponding sending status is 0011110 in turn, from this, it can be obtained that the phases whose sending order is the 3rd, 4th, 5th and 6th have the correct sending status, then it is determined that the second target phase can be the 4th position. The phase of the bit may be the phase of the fifth bit. If the second phase to be measured with the correct transmission state 1 is an odd number of consecutive phases, the phase in the middle of the bits is selected as the second target phase corresponding to the transmitted phase. For example, the second group of phases to be measured contains 6 If the phase is measured, the corresponding transmission state is 001110 in turn. From this, it can be obtained that the phases whose transmission order is the 3rd, the 4th, and the 5th have the correct transmission state. Among them, the phase whose position is the 4th is in the middle position, then The phase whose position is determined to be the 4th bit is the second target phase.
作为一种可选的实施例,在第一芯片将发送相位锁定至第二目标相位之后,上述方法还包括:第一芯片向第二芯片发送完成包;其中,第二芯片在接收到测试包后,判断测试包是否为完成包,如果测试包为完成包,第二芯片与第一芯片进入通信模式;如果测试包不为完成包,进入第二芯片向第一芯片返回测试包的接收状态的步骤。As an optional embodiment, after the first chip locks the transmission phase to the second target phase, the above method further includes: the first chip sends a completion packet to the second chip; wherein the second chip receives the test packet after receiving the test packet. After that, it is judged whether the test packet is a complete packet, if the test packet is a complete packet, the second chip and the first chip enter the communication mode; if the test packet is not a complete packet, enter the receiving state where the second chip returns the test packet to the first chip A step of.
需要说明的是,当第一芯片将发送相位锁定在第二目标相位,理解为第一芯片已经完成了上行和下行的双向驯服,上述完成包则标志着第一芯片已经完成双向驯服,可以进入正常通信模式。例如,第一芯片为AUX(Auxiliary,辅助输出或辅助输出接口)卡上的芯片,第二芯片为子卡上芯片,当子卡上的芯片完成了上下行链路驯服后,向AUX卡的芯片发送完成包,AUX卡的芯片接收到完成包后将完成包反馈给子卡,AUX卡的芯片和子卡的芯片进入通信模式。It should be noted that when the first chip locks the transmission phase to the second target phase, it is understood that the first chip has completed the two-way taming of the uplink and the downlink, and the above completion package indicates that the first chip has completed the two-way taming and can enter the Normal communication mode. For example, the first chip is the chip on the AUX (Auxiliary, auxiliary output or auxiliary output interface) card, and the second chip is the chip on the daughter card. The chip sends the completion packet, and the chip of the AUX card feeds back the completion packet to the sub-card after receiving the completion packet, and the chip of the AUX card and the chip of the sub-card enter the communication mode.
作为一种可选的实施例,第二组待测相位基于第一芯片发送信号的时钟周期以及预设相位数量得到,或第一组待测相位中相邻两个第一待测相位之间的差值为第一芯片发送信号的时钟周期除以预设相位数量。As an optional embodiment, the second group of phases to be measured is obtained based on the clock cycle of the signal sent by the first chip and the preset number of phases, or between two adjacent first phases to be measured in the first group of phases to be measured The difference is the clock period of the signal sent by the first chip divided by the preset number of phases.
上述预设相位数量可以理解为第一组待测相位中的相位数量,例如,第一芯片接收信号的时钟周期为50ns,预设相位数量可选为32个,则第一组待测相位中相邻两个第一待测相位之间的差值为50ns/32,设定第一待测相位的初始值,将该初始值以50ns/32为步长单位增加或者减少,依次可以获得第一组待测相位中多个第一待测相位。The above-mentioned preset number of phases can be understood as the number of phases in the first group of phases to be measured. For example, if the clock cycle of the first chip receiving the signal is 50ns, and the preset number of phases can be selected as 32, then the number of phases to be measured in the first group of phases is 50ns. The difference between two adjacent first phases to be measured is 50ns/32. Set the initial value of the first phase to be measured, and increase or decrease the initial value in steps of 50ns/32. A plurality of first to-be-measured phases in a group of to-be-measured phases.
作为一种可选的实施例,第一芯片的数量为多个,多个第一芯片部署在多个不同的第一板卡上,第二芯片部署在第二板卡上,第二板卡与多个第一板卡中的每个板卡进行通信。As an optional embodiment, the number of the first chips is multiple, the multiple first chips are deployed on multiple different first boards, the second chips are deployed on the second boards, and the second boards Communicate with each of the plurality of first boards.
在LVDS通信链路中,通常存在一个AUX卡和多个子卡。在一种可选的实施例中,上述多个第一板卡均为子卡,第二板卡为AUX卡,由子卡主导整个通信链路的驯服过程,先对下行链路(AUX至子卡)做驯服,基于下行链路驯服结果,再对上行链路(子卡至AUX)做驯服,驯服完成后进入正常通信流程。In the LVDS communication link, there is usually one AUX card and multiple daughter cards. In an optional embodiment, the above-mentioned multiple first boards are all daughter cards, and the second board is an AUX card. The daughter card dominates the taming process of the entire communication link. Card) to tame, based on the downlink tame result, and then tame the uplink (daughter card to AUX), and enter the normal communication process after the tame is completed.
作为一种可选的实施例,第一芯片和第二芯片均为FPGA芯片,通过第一芯片中的时钟管理器将接收相位分别锁定至第一组待测相位中的每个第一待测相位。As an optional embodiment, the first chip and the second chip are both FPGA chips, and the receiving phase is respectively locked to each of the first to-be-measured phases in the first group of phases to be measured by the clock manager in the first chip. phase.
作为一种可选的实施例,在第一芯片将发送相位锁定至第二目标相位之后,上述方法还包括:第一芯片与第二芯片进行通信,第一芯片与第二芯片进行通信的步骤包括:As an optional embodiment, after the first chip locks the transmission phase to the second target phase, the above method further includes: the first chip communicates with the second chip, and the first chip communicates with the second chip include:
步骤S109,第一芯片将待传输数据按照预设规则进行封装,得到封装数据包。Step S109, the first chip encapsulates the data to be transmitted according to a preset rule to obtain an encapsulated data packet.
下表1为一种可选的封装数据包的格式,第一芯片接收到1包完整的待传输数据后,按照表1的规则对待传输数据进行封装,依次包含前导码,Length,TYPE,Reserve,HEAD_CHK,Payload以及CRC8。The following table 1 is an optional format of encapsulating data packets. After the first chip receives a complete packet of data to be transmitted, it encapsulates the data to be transmitted according to the rules of Table 1, including preamble, Length, TYPE, Reserve in turn. , HEAD_CHK, Payload and CRC8.
表1Table 1
前导码为8个字节(即55555555555555D5),Length为2个字节,Payload为待传输数据的字段长度,TYPE为1个字节,Reserve为2个字节,HEAD_CHK为1个字节,且HEAD_CHK为Length、TYPE、Reserve字段的校验位,CRC为包头和结尾的校验位。The preamble is 8 bytes (ie 55555555555555D5), Length is 2 bytes, Payload is the field length of the data to be transmitted, TYPE is 1 byte, Reserve is 2 bytes, HEAD_CHK is 1 byte, and HEAD_CHK is the check digit of the Length, TYPE, Reserve fields, and CRC is the check digit of the packet header and end.
步骤S110,第一芯片对封装数据包进行编码,得到编码结果。Step S110, the first chip encodes the encapsulated data packet to obtain an encoding result.
待传输数据完成重新封装后,由编码模块进行编码。可选的,编码模块为8B10B编码模块,选用K28.1作为闲时编码,K28.5作为封装数据包起始,K28.7作为封装数据包结束,获得编码 结果。After the data to be transmitted is repackaged, it is encoded by the encoding module. Optionally, the encoding module is an 8B10B encoding module, and K28.1 is selected as the idle time encoding, K28.5 is used as the start of the encapsulated data packet, and K28.7 is used as the end of the encapsulated data packet to obtain the encoding result.
步骤S111,第一芯片对编码结果进行加扰,得到加扰结果;Step S111, the first chip scrambles the encoding result to obtain a scrambled result;
可选的,编码结果可由10bit并行加扰模块进行加扰,待传输数据编码和加扰后接近白噪声,保证了数据通信过程的直流平衡。Optionally, the coding result can be scrambled by a 10-bit parallel scrambling module, and the data to be transmitted is coded and scrambled close to white noise, which ensures the DC balance in the data communication process.
步骤S112,第一芯片对加扰结果进行并串转换,并将并串转换后得到的数据包发送至第二芯片;Step S112, the first chip performs parallel-serial conversion on the scrambling result, and sends the data packet obtained after the parallel-serial conversion to the second chip;
可选的,经加扰完成的加扰结果进入双时钟fifo,跨到250M时钟域,进入PISO模块完成并串转换后发送至第二芯片。Optionally, the scrambled result that has been scrambled enters the dual-clock fifo, crosses the 250M clock domain, enters the PISO module and completes the parallel-serial conversion and sends it to the second chip.
其中,第二芯片通过接收第一芯片发送的数据包,对接收到的数据包进行串并转换,对串并转换结果进行解扰,对解扰结果进行解码,得到待传输数据的封装结果,并根据封装结果进行校验,在校验正确的情况下将待传输数据发送至对应的处理单元。The second chip receives the data packet sent by the first chip, performs serial-to-parallel conversion on the received data packet, descrambles the serial-to-parallel conversion result, decodes the descramble result, and obtains the encapsulation result of the data to be transmitted, The verification is performed according to the encapsulation result, and if the verification is correct, the data to be transmitted is sent to the corresponding processing unit.
作为一种可选的实施例,串并转换可选由SIPO模块完成,将串并转换后得到的数据包写入双时钟FIFO完成250M到25M时钟域的转换,转换完成后,由Descrambler模块进行解扰操作,解扰完成数据进入8B10B解码模块完成8B10B解码,并完成字节对齐操作。As an optional embodiment, the serial-to-parallel conversion can be completed by the SIPO module, and the data packets obtained after the serial-to-parallel conversion are written into the dual-clock FIFO to complete the conversion of the 250M to 25M clock domain. After the conversion is completed, the Descrambler module performs the conversion. In the descrambling operation, the descrambling completed data enters the 8B10B decoding module to complete the 8B10B decoding, and completes the byte alignment operation.
解码完成后的数据,根据K码,包头格式,正确解析前导码,length、type信息后,进行check_sum位校验,如果校验错误,丢弃该数据包,并重新检测前导码;如果校验正确,则根据length信息,采集该长度数据包,并对数据进行CRC8位校验,如果CRC8位校验正确,则输出传输数据给对应的处理单元进行后续处理;如果CRC8位校验错误,则丢弃该数据包,返回上述检测前导码的步骤。After decoding the data, according to the K code, packet header format, correctly parse the preamble, after length and type information, perform check_sum bit verification, if the verification is wrong, discard the data packet, and re-detect the preamble; if the verification is correct , then according to the length information, collect the data packet of this length, and perform CRC 8-bit check on the data. If the CRC 8-bit check is correct, output the transmission data to the corresponding processing unit for subsequent processing; if the CRC 8-bit check is incorrect, discard it. The data packet returns to the above step of detecting the preamble.
通过上述步骤,实现了LVDS通信链路下的数据正常的通信,通过对待传输数据的加扰和编码过程,使待传输数据信号接近白噪声,保证了LVDS通信链路的直流平衡,能够更有效的提高数据传输的可靠性和稳定性。Through the above steps, the normal communication of data under the LVDS communication link is realized. Through the scrambling and encoding process of the data to be transmitted, the data signal to be transmitted is made close to white noise, which ensures the DC balance of the LVDS communication link and can be more effective. to improve the reliability and stability of data transmission.
作为一种可选的实施例,上述步骤S109-S112的数据传输步骤由LVDS发送模块(即lvds_send模块)和LVDS接收模块(即lvds_rec模块)实现,分别实现对待传输数据的发送和接收。图5为可选的LVDS通信模块的示意,不同板卡的芯片间的LVDS发送模块和LVDS接收模块可采用8bit串行接口与外部逻辑互联,待传输数据经加解扰、8B10B和Serialization(Deserialization)与LVDS接口完成数据交换。As an optional embodiment, the data transmission steps of the above steps S109-S112 are implemented by the LVDS sending module (ie the lvds_send module) and the LVDS receiving module (ie the lvds_rec module), which respectively implement the sending and receiving of the data to be transmitted. Figure 5 is a schematic diagram of an optional LVDS communication module. The LVDS sending module and LVDS receiving module between chips of different boards can be interconnected with external logic by using an 8-bit serial interface. ) completes data exchange with the LVDS interface.
图6为一种可选的数据处理示意图,包含了LVDS通信链路中数据传输的路径,表2为LVDS发送模块外部接口的说明,表3为LVDS接收模块外部接口的说明:Figure 6 is a schematic diagram of an optional data processing, including the data transmission path in the LVDS communication link, Table 2 is the description of the external interface of the LVDS sending module, and Table 3 is the description of the external interface of the LVDS receiving module:
表2Table 2
PORT NAME端口名称PORT NAME port name | WIDTH宽度WIDTH width | Direction指向Direction points to | Description描述DescriptionDescription |
sys_rstsys_rst | 11 | inputinput | 本地复位信号local reset signal |
sys_clksys_clk | 11 | inputinput | 系统工作时钟System working clock |
send_datasend_data | 88 | inputinput | 发送数据send data |
send_data_ensend_data_en | 11 | inputinput | 发送数据有效信号Send data valid signal |
send_data_lengthsend_data_length | 1616 | inputinput | 当前发送数据包长度Current sent packet length |
send_data_pkg_validsend_data_pkg_valid | 11 | inputinput | 发送数据包完成信号Send packet completion signal |
send_data_typesend_data_type | 88 | inputinput | 数据包类型packet type |
fifo_readyfifo_ready | 11 | outputoutput | 表示是否能接收新的数据包Indicates whether new packets can be received |
lvds_out_clklvds_out_clk | 11 | inputinput |
发送侧MMCM输出时钟250MSending side |
lvds_data_outlvds_data_out | 11 | outputoutput | lvds接口发送数据lvds interface to send data |
lvds_25M_clklvds_25M_clk | 11 | inputinput |
发送侧MMCM同步时钟25MSending side MMCM |
表3table 3
PORT NAME端口名称PORT NAME port name | WIDTH宽度WIDTH width | Direction指向Direction points to | Description描述DescriptionDescription |
sys_rstsys_rst | 11 | inputinput | 本地复位信号local reset signal |
sys_clksys_clk | 11 | inputinput | 系统工作时钟System working clock |
rec_datarec_data | 88 | outputoutput | 接收数据Receive data |
rec_data_enrec_data_en | 11 | outputoutput | 接收数据有效信号Receive data valid signal |
rec_data_lengthrec_data_length | 1616 | outputoutput | 接收数据包长度Received packet length |
rec_data_pkg_validrec_data_pkg_valid | 11 | inputinput | 接收数据包完成信号Receive packet completion signal |
rec_data_typerec_data_type | 88 | inputinput | 数据包类型packet type |
lvds_in_clklvds_in_clk | 11 | inputinput |
接收侧MMCM输出时钟250MReceive side |
lvds_data_inlvds_data_in | 11 | inputinput | lvds接口接收数据lvds interface to receive data |
lvds_25M_clklvds_25M_clk | 11 | inputinput |
接收侧MMCM同步时钟25MReceive side |
如图6所示的数据传输路径,lvds_send模块接收待传输数据后存入fifo模块,并通过fifo_ready端将信号反馈给前段逻辑表示当前是否可以接收新的数据。接收到1包完整的数据包后,启动状态机,将数据由fifo读出,根据步骤S109对数据进行封装,得到封装数据包。封装后的数据包,发送给8B10B编码模块进行编码,以及10bit并行加扰模块(scrambler_10)进行加扰,加扰完成数据进入双时钟fifo,跨到250M时钟域,进入PISO模块完成并串转换,发送到lvds_rec模块的外部接口。In the data transmission path shown in Figure 6, the lvds_send module receives the data to be transmitted and stores it in the fifo module, and feeds back the signal to the preceding logic through the fifo_ready terminal to indicate whether new data can be received at present. After receiving one complete data packet, the state machine is started, the data is read out from the fifo, and the data is encapsulated according to step S109 to obtain an encapsulated data packet. The encapsulated data packet is sent to the 8B10B encoding module for encoding, and the 10bit parallel scrambling module (scrambler_10) for scramble. After scrambled, the data enters the dual-clock fifo, crosses the 250M clock domain, and enters the PISO module to complete the parallel-to-serial conversion. Sent to the external interface of the lvds_rec module.
lvds_rec模块接收数据后,进入SIPO模块完成串并转换,并写入双时钟FIFO完成250M到25M时钟域的转换,转换完成后,进入Descrambler模块进行解扰操作,解扰完成数据进入8B10B解码模块完成8B10B解码,并完成字节对齐操作。解码完成后的数据,按照步骤S112的内部对待传输数据进行CRC8位校验,根据校验正确的结果输出rec_data_pkg_valid信号反馈给外部逻辑,进行后续处理。After the lvds_rec module receives the data, it enters the SIPO module to complete the serial-to-parallel conversion, and writes the dual clock FIFO to complete the conversion of the 250M to 25M clock domain. After the conversion is completed, it enters the Descrambler module for descrambling operation, and the descrambling completed data enters the 8B10B decoding module to complete 8B10B decoding, and complete the byte alignment operation. After decoding the data, CRC 8-bit verification is performed on the data to be transmitted according to the internal process of step S112, and the rec_data_pkg_valid signal is output according to the correct verification result and fed back to the external logic for subsequent processing.
作为一种可选的实施例,第一板卡为子卡,第二板卡为AUX卡,上述第一芯片为子卡上的芯片,第二芯片为AUX卡芯片。子卡上电后,MMCM对子卡的接收相位进行锁定,在当前相位下,AUX卡向子卡发送测试包,子卡接收测试包并确定接收状态,然后进入下一个时钟序列,重复上述AUX卡向子卡发送测试包,子卡接收并确定接收状态的步骤。连续记录N个接收相位的接收状态后,在具有接收正确状态的接收相位中,筛选出一个最佳相位,将子卡的接收相位调整为该最佳相位,实现AUX卡和子卡的接收相位一致性调整,完成AUX卡和子卡之间的下行链路驯服(即数据下行链路的相位调整)。As an optional embodiment, the first board is a daughter card, the second board is an AUX card, the first chip is a chip on the daughter card, and the second chip is an AUX card chip. After the daughter card is powered on, the MMCM locks the receiving phase of the daughter card. In the current phase, the AUX card sends a test packet to the daughter card. The daughter card receives the test packet and determines the receiving state, and then enters the next clock sequence, repeating the above AUX The card sends the test package to the daughter card, and the daughter card receives and determines the steps of receiving status. After continuously recording the receiving states of N receiving phases, select an optimal phase among the receiving phases with the correct receiving state, and adjust the receiving phase of the daughter card to the optimal phase, so that the receiving phases of the AUX card and the daughter card are consistent. performance adjustment to complete the downlink tame between the AUX card and the daughter card (ie, the phase adjustment of the data downlink).
图3提供了一种子卡和AUX卡的板卡间(即子卡的芯片和AUX卡的芯片间)可选的数据处理方法的流程图。如图3所示,该方法包括如下步骤:FIG. 3 provides a flowchart of an optional data processing method between the daughter card and the AUX card (ie, between the chip of the daughter card and the chip of the AUX card). As shown in Figure 3, the method includes the following steps:
步骤S301,主控卡下发子卡是否上线;系统上电后,主控卡循环检测子卡是否上电,一旦检测到子卡上电,主控卡给AUX卡发送驯服指令(驯服可理解为通过对MMCM收发双向时钟的相位做调整),使AUX卡进入驯服状态,并进入步骤S302;Step S301, the main control card sends whether the sub-card is online; after the system is powered on, the main control card cyclically detects whether the sub-card is powered on, once it is detected that the sub-card is powered on, the main control card sends a taming instruction to the AUX card (taming is understandable In order to adjust the phase of the MMCM transceiver bidirectional clock), make the AUX card enter the tamed state, and enter step S302;
步骤S302,AUX卡发送下行链路驯服序列,使子卡进入驯服状态,进入步骤S303;Step S302, the AUX card sends the downlink taming sequence, so that the daughter card enters the taming state, and then goes to step S303;
步骤S303,AUX卡检测是否接收到子卡发出的上行链路驯服序列(即测试包)或者完成序列;如果AUX卡接收到子卡发出的上行链路驯服序列,则说明已经进入对子卡发送端口相位调整的步骤,AUX卡接收子卡发出的上行链路驯服序列,并对当前测试包的接收状态进行判断,如果接收状态为正确,则进入步骤S304;如果接收状态为错误或超时,则返回步骤S302,则定时对子卡发送下行链路驯服序列,直到子卡进入驯服状态;上述完成序列理解为上述第二目标相位;Step S303, the AUX card detects whether it receives the uplink taming sequence (that is, the test packet) or the completion sequence sent by the subcard; In the step of port phase adjustment, the AUX card receives the uplink taming sequence sent by the daughter card, and judges the receiving state of the current test packet. If the receiving state is correct, then enter step S304; if the receiving state is error or timeout, then Returning to step S302, the downlink taming sequence is periodically sent to the daughter card until the daughter card enters the taming state; the above-mentioned completion sequence is understood as the above-mentioned second target phase;
步骤S304,环回当前测试包数据给子卡,判断具有正确接收状态的测试包是否为完成包(即具有完成序列的测试包),如果当前测试包为完成包,则进入步骤S305;如果当前测试包不是完成包,则返回步骤S303,AUX卡继续接收子卡发出的上行链路驯服序列,直到选择出完成序列;Step S304, loop back the current test packet data to the daughter card, and determine whether the test packet with the correct receiving state is a complete packet (that is, a test packet with a completed sequence), if the current test packet is a complete packet, then enter step S305; If the test package is not a complete package, then return to step S303, and the AUX card continues to receive the uplink taming sequence sent by the sub-card until the completion sequence is selected;
步骤S305,驯服完成,AUX卡退出驯服状态,并进入正常数据接收状态,同时将驯服完 成状态反馈给主控卡。Step S305, the taming is completed, the AUX card exits the taming state, and enters the normal data receiving state, and feeds back the taming completion state to the main control card at the same time.
通过上述步骤S301-S305,将子卡的发送相位调整为该最佳相位,实现AUX卡和子卡的接收相位一致性调整,完成AUX卡和子卡之间的上行链路驯服(即数据上行链路的相位调整)。Through the above steps S301-S305, the transmission phase of the sub-card is adjusted to the optimum phase, so as to realize the consistency adjustment of the reception phase between the AUX card and the sub-card, and complete the uplink taming between the AUX card and the sub-card (that is, the data uplink). phase adjustment).
作为可选地一例,在两个芯片中接收数据的链路和发送数据的链路可以是独立的链路,因此,对于第一芯片而言,其可以同时进行下行链路的驯服和上行链路的驯服。As an optional example, the link for receiving data and the link for sending data in two chips may be independent links, so for the first chip, it can perform downlink taming and uplink at the same time The tameness of the road.
实施例2Example 2
根据本发明实施例,提供了一种数据处理方法的实施例,图2a为根据本发明实施例的数据处理方法的流程图,如图2a所示,上述数据处理方法包括:According to an embodiment of the present invention, an embodiment of a data processing method is provided. FIG. 2a is a flowchart of a data processing method according to an embodiment of the present invention. As shown in FIG. 2a, the above data processing method includes:
步骤S209,第二板卡上的第二芯片检测到第一板卡上的第一芯片发送的空闲码时,持续向第一芯片发送测试包。Step S209, when the second chip on the second board detects the idle code sent by the first chip on the first board, it continues to send a test packet to the first chip.
步骤S210,直至第二芯片检测到第一芯片发送的完成包,第二芯片停止发送测试包。Step S210, until the second chip detects the completion packet sent by the first chip, the second chip stops sending the test packet.
需要说明的是,上述空闲码为第二板卡上的第二芯片向第一板卡上的第一芯片发送测试包的触发机制,上述完成包为第二板卡上的第二芯片停止发送测试包的触发机制。第一板卡在上电后,第一芯片开始发送空闲码,第二板卡的第二芯片作为发送端进行检测,当检测到空闲码时开始发送测试包,其中,任意一个板卡上的芯片在检测到所述板卡插入背板的情况下主动发送空闲码。当第二芯片检测到第一芯片发送的完成包,将完成包反馈至第一芯片,此时第一芯片已经完成了其上行和下行的驯服,第二芯片与第一芯片进入通信模式。It should be noted that the above-mentioned idle code is a trigger mechanism for the second chip on the second board to send the test packet to the first chip on the first board, and the above-mentioned completion packet is the stop of sending the second chip on the second board. Triggering mechanism for the test package. After the first board is powered on, the first chip starts to send the idle code, and the second chip of the second board is used as the sender for detection. When the idle code is detected, the test packet starts to be sent. The chip actively sends an idle code when detecting that the board is inserted into the backplane. When the second chip detects the completion packet sent by the first chip, it feeds back the completion packet to the first chip. At this time, the first chip has completed its uplink and downlink tame, and the second chip and the first chip enter the communication mode.
作为一种可选的实施例,第二芯片与多个第一芯片之间通过低电压差分信号通信,如图2b所示,上述方法还包括如下步骤:As an optional embodiment, the second chip communicates with a plurality of first chips through low-voltage differential signals. As shown in FIG. 2b, the above method further includes the following steps:
步骤S201,第二芯片的接收端口采集第一芯片发送的测试包,其中,第一芯片将发送相位锁定至第二组待测相位中的每个第二待测相位,并在发送相位每次锁定至一个第二待测相位之后,向第二芯片发送测试包;Step S201 , the receiving port of the second chip collects the test packet sent by the first chip, wherein the first chip locks the transmission phase to each second phase to be measured in the second group of phases to be measured, and the transmission phase is After locking to a second phase to be tested, send a test packet to the second chip;
步骤S202,第二芯片判断测试包是否正确;Step S202, the second chip determines whether the test package is correct;
第二芯片接收到的测试包内的数据与第一芯片发送的测试包内的数据相同,则第二芯片判断测试包为正确,如果第二芯片接收到的测试包内的数据与第一芯片发送的测试包内的数据不同或者第二芯片未收到测试包,则第二芯片判断测试包为错误。可选的,判断结果为正确,用1表示;判断结果为错误,用0表示。The data in the test packet received by the second chip is the same as the data in the test packet sent by the first chip, then the second chip judges that the test packet is correct, if the data in the test packet received by the second chip is the same as the data in the test packet sent by the first chip If the data in the sent test packet is different or the second chip does not receive the test packet, the second chip determines that the test packet is an error. Optionally, if the judgment result is correct, it is represented by 1; if the judgment result is wrong, it is represented by 0.
步骤S203,第二芯片根据判断结果向第一芯片返回测试包的接收状态;Step S203, the second chip returns the receiving state of the test packet to the first chip according to the judgment result;
判断结果为正确时,第二芯片向第一芯片发送接收正确状态,判断结果为错误时,第二芯片向第一芯片发送接收错误状态。可选的,判断结果为正确时,第二芯片向第一芯片发送1,判断结果为错误时,第二芯片向第一芯片发送0。When the judgment result is correct, the second chip sends a receiving correct status to the first chip, and when the judgment result is incorrect, the second chip sends a receiving error status to the first chip. Optionally, when the judgment result is correct, the second chip sends 1 to the first chip, and when the judgment result is wrong, the second chip sends 0 to the first chip.
步骤S204,第一芯片接收测试包的接收状态,根据测试包的接收状态确定每个第二待测相位对应的发送状态,并根据每个第二待测相位对应的发送状态确定发送相位对应的第二目标相位。Step S204, the first chip receives the receiving state of the test packet, determines the transmission state corresponding to each second phase to be measured according to the receiving state of the test packet, and determines the corresponding transmission state according to the transmission state corresponding to each second phase to be measured. Second target phase.
第二芯片对测试包的接收状态与第一芯片对测试包的发送状态应一致,如果第二芯片的接收状态为接收正确,则可以确定该第二待测相位对应的第一芯片的发送状态为发送正确;如果第二芯片接收状态为接收错误,则可以确定该第二待测相位对应的第一芯片的发送状态为发送错误。例如,对于锁定的5个第二待测相位,第二芯片返回的接收状态依次为00110,则第一芯片对应于该组第二待测相位的发送状态为00110。The receiving state of the test package by the second chip should be consistent with the sending state of the test package by the first chip. If the receiving state of the second chip is correct, the sending state of the first chip corresponding to the second phase to be tested can be determined. If the receiving state of the second chip is a receiving error, it can be determined that the sending state of the first chip corresponding to the second phase to be measured is a sending error. For example, for the five locked second phases to be measured, the receiving status returned by the second chip is 00110 in sequence, and the sending status of the first chip corresponding to the group of second phases to be measured is 00110.
由于在该实施例下,第二芯片与多个第一芯片通信,如果第二芯片对每个第一芯片发送的测试包均进行接收状态的判断,计算过程较为复杂,需要较长的工作时间。可选的,在当前锁定的第二待测相位下,如果第一芯片接收到与其发送内容相同的测试包内的数据,则确定第一芯片在该第二待测相位下的发送状态为发送正确状态。在这种方法下,对于具有接收正确状态的测试包,第二芯片给第一芯片返回的并不是直接的接收状态,而是该测试包的数据,第一芯片通过判断其接收的到测试包与其发送的数据包是否相同,以确定该相位对应的发送状态。通过这种方法,可以减少第二芯片在接收状态判断过程的计算量。Since in this embodiment, the second chip communicates with multiple first chips, if the second chip judges the receiving state of the test packets sent by each first chip, the calculation process is complicated and requires a long working time . Optionally, in the currently locked second phase to be tested, if the first chip receives data in a test packet with the same content sent by the first chip, it is determined that the sending state of the first chip in the second phase to be tested is sending. correct state. In this method, for a test packet with the correct status of receiving, the second chip does not return the direct receiving status to the first chip, but the data of the test packet, and the first chip judges that it has received the test packet by Whether the data packets sent by it are the same to determine the sending state corresponding to the phase. Through this method, the calculation amount of the second chip in the process of judging the receiving state can be reduced.
通过上述步骤,通过第二芯片直接向第一芯片反馈接收状态,使第一芯片根据接收状态确 定出每个第二待测相位对应的发送状态,找到第二目标相位。因此提供了一种LVDS通信链路中,第二芯片与多个第一芯片通信时确定第一芯片的发送端口的最佳相位的方法。Through the above steps, the second chip directly feeds back the receiving state to the first chip, so that the first chip determines the corresponding sending state of each second phase to be measured according to the receiving state, and finds the second target phase. Therefore, a method for determining the optimal phase of the transmitting port of the first chip when the second chip communicates with the plurality of first chips in the LVDS communication link is provided.
作为一种可选的实施例,在第二芯片判断测试包正确的情况下,在第二芯片根据判断结果向第一芯片返回测试包的接收状态之后,上述方法还包括:第二芯片判断测试包是否为完成包,其中第一芯片确定发送端口的第二目标相位之后,向第二芯片发送完成包;如果测试包为完成包,第二芯片与第一芯片进入通信模式;如果测试包不为完成包,进入第二芯片的接收端口采集第一芯片发送的测试包的步骤。As an optional embodiment, when the second chip judges that the test packet is correct, after the second chip returns the receiving state of the test packet to the first chip according to the judgment result, the above method further includes: the second chip judges the test Whether the package is a completion package, wherein after the first chip determines the second target phase of the sending port, it sends the completion package to the second chip; if the test package is a completion package, the second chip and the first chip enter the communication mode; if the test package does not In order to complete the packet, the step of entering the receiving port of the second chip to collect the test packet sent by the first chip.
上述完成包为包含完成数据序列的测试包,完成数据序列为第二目标相位对应的测试包。第二芯片在接收到完成包时,说明第一芯片的发送端口已经根据第二目标相位进行了时钟相位的调整,使得第一芯片的发送端口的时钟相位为最佳相位,第二芯片与第一芯片可进入正常的通信模式。The above-mentioned completion packet is a test packet including a completed data sequence, and the completed data sequence is a test packet corresponding to the second target phase. When the second chip receives the completion packet, it indicates that the sending port of the first chip has adjusted the clock phase according to the second target phase, so that the clock phase of the sending port of the first chip is the optimal phase, and the second chip and the A chip can enter normal communication mode.
作为一种可选的实施例,第一芯片与第二芯片为不同子卡的芯片,图4提供了一种子卡和子卡的芯片间可选的数据处理方法的流程图。如图4所示,该方法包括如下步骤:As an optional embodiment, the first chip and the second chip are chips of different sub-cards. FIG. 4 provides a flowchart of an optional data processing method between the sub-card and the chips of the sub-card. As shown in Figure 4, the method includes the following steps:
步骤S401,子卡上电复位或软复位;Step S401, the sub-card is powered on reset or soft reset;
步骤S402,调整MMCM接收侧时钟相位,MMCM完成相位锁定;Step S402, adjust the phase of the clock on the receiving side of the MMCM, and the MMCM completes the phase locking;
步骤S403,子卡接收下行链路驯服序列,并记录当前相位接收状态;如果接收驯服码正确或者超时没有接收到驯服码,记录当前相位的接收状态(接收正确或者接收错误);Step S403, the daughter card receives the downlink taming sequence, and records the current phase receiving state; if the taming code is received correctly or the taming code is not received over time, the receiving state of the current phase (correctly received or incorrectly received) is recorded;
步骤S404,循环计数器加1,判断循环计数器是否大于等于32;当前下行链路驯服过程中,包含32个待测相位,需要对32个待测相位逐一进行测试包接收状态的记录;如果计数器未到32,则返回步骤S402,锁定待测相位,并执行步骤S403的相位接收状态的判断和记录步骤;如果计数器达到32,则进入步骤S405;Step S404, the loop counter is incremented by 1, and it is judged whether the loop counter is greater than or equal to 32; in the current downlink taming process, there are 32 phases to be tested, and the 32 phases to be tested need to be recorded one by one for the receiving state of the test packet; If it reaches 32, then go back to step S402, lock the phase to be measured, and execute the steps of judging and recording the phase receiving state in step S403; if the counter reaches 32, then enter step S405;
如果超时没有接收到驯服码,则调整MMCM输出的lvds_in_clk相位,时钟锁定后复位超时计数器,进入步骤S403重新开始接收驯服码。If the taming code is not received over time, adjust the phase of the lvds_in_clk output by the MMCM, reset the timeout counter after the clock is locked, and go to step S403 to restart receiving the taming code.
步骤S405,根据记录的32个相位的接收状态,判断是否存在输入侧最佳相位,如果存在,进入步骤S406;不过不存在最佳相位,进入步骤S417反馈子卡MCU(控制器),输出错误;Step S405, according to the recorded receiving states of the 32 phases, determine whether there is an optimal phase on the input side, if so, go to step S406; but if there is no optimal phase, go to step S417 to feed back the daughter card MCU (controller), and the output is wrong ;
步骤S406,将最佳相位反馈给子卡MCU,输入侧时钟(即lvds_in_clk)调整到该最佳相位;Step S406, the optimal phase is fed back to the daughter card MCU, and the input side clock (ie lvds_in_clk) is adjusted to the optimal phase;
步骤S407,子卡的下行链路驯服完成,将当前状态反馈给子卡MCU;Step S407, the downlink taming of the sub-card is completed, and the current state is fed back to the sub-card MCU;
步骤S408,开始子卡的上行链路驯服过程,调整MMCM发送侧时钟相位;Step S408, start the uplink taming process of the daughter card, and adjust the clock phase on the sending side of the MMCM;
步骤S409,子卡发送上行链路驯服序列;Step S409, the daughter card sends the uplink taming sequence;
步骤S410,子卡接收上行链路驯服序列,并记录当前相位接收状态;Step S410, the daughter card receives the uplink taming sequence, and records the current phase receiving state;
步骤S411,循环计数器加1,判断循环计数器是否大于等于32;当前上行链路驯服过程中,包含32个待测相位,需要对32个待测相位逐一进行测试包发送状态的记录;在相位个数计数满32的情况下,进入步骤S412;Step S411, the loop counter is incremented by 1, and it is judged whether the loop counter is greater than or equal to 32; in the current uplink taming process, there are 32 phases to be tested, and the 32 phases to be tested need to be recorded one by one test packet transmission state; When the count reaches 32, go to step S412;
步骤S412,根据记录的32个相位的发送状态,综合判断是否存在输出侧最佳相位;Step S412, according to the recorded transmission states of the 32 phases, comprehensively judge whether there is an optimal phase on the output side;
步骤S413,将步骤S412中的最佳相位反馈给子卡MCU,输出侧时钟调整到最佳相位;In step S413, the optimal phase in step S412 is fed back to the sub-card MCU, and the clock on the output side is adjusted to the optimal phase;
步骤S414,子卡的上行链路驯服完成,将当前状态反馈给子卡MCU;Step S414, the uplink taming of the sub-card is completed, and the current state is fed back to the sub-card MCU;
步骤S415,子卡发送驯服完成序列给AUX卡,等待是否接收到确认;Step S415, the sub-card sends the taming completion sequence to the AUX card, and waits for a confirmation;
步骤S416,驯服完成,进入正常通信模式。Step S416, the taming is completed, and the normal communication mode is entered.
通过上述步骤,实现了多个子卡之间的芯片间的数据接收和数据发送双向的时钟相位的调整。Through the above steps, the two-way clock phase adjustment of data reception and data transmission between chips between multiple sub-cards is realized.
需要说明的是,在LVDS通信链路中,通常存在一个AUX卡和多个子卡,由子卡主导整个通信链路的驯服过程,先对下行链路(AUX至子卡)做驯服,基于下行链路驯服结果,再对上行链路(子卡至AUX)做驯服,驯服完成后进入正常通信流程。It should be noted that in the LVDS communication link, there is usually an AUX card and multiple sub-cards. The sub-card dominates the taming process of the entire communication link. First, the downlink (AUX to the sub-card) is tamed. Based on the downlink After taming the result, the uplink (daughter card to AUX) is tamed, and the normal communication process is entered after the taming is completed.
实施例3Example 3
根据本发明实施例,提供了一种数据处理装置的实施例,图7为根据本发明实施例的一种 数据处理装置的示意图,如图7所示,第一芯片和第二芯片之间通过低电压差分信号通信,上述数据处理装置包括:相位锁定模块71,用于在所第一芯片上电之后,将接收相位锁定至第一组待测相位中的每个第一待测相位;相位测试模块72,用于在接收相位每次锁定至一个第一待测相位之后,使第一芯片接收第二芯片发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态;相位选择模块73,用于第一芯片根据每个第一待测相位对应的接收状态确定接收相位对应的第一目标相位;相位调整模块74,用于使第一芯片将接收相位锁定至第一目标相位,以用于第一芯片的接收端口在第一目标相位下与第二芯片进行通信。According to an embodiment of the present invention, an embodiment of a data processing apparatus is provided. FIG. 7 is a schematic diagram of a data processing apparatus according to an embodiment of the present invention. As shown in FIG. For low-voltage differential signal communication, the above-mentioned data processing device includes: a phase locking module 71 for locking the receiving phase to each first phase to be measured in the first group of phases to be measured after the first chip is powered on; the phase The test module 72 is configured to enable the first chip to receive the test packet sent by the second chip after the receiving phase is locked to a first phase to be measured each time, and to determine the receiving state, and to obtain the reception corresponding to each first phase to be measured. The phase selection module 73 is used for the first chip to determine the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured; the phase adjustment module 74 is used to make the first chip lock the receiving phase to A first target phase for the receive port of the first chip to communicate with the second chip at the first target phase.
上述装置还包括执行实施例1中其他方法步骤的模块,此处不再赘述。The above-mentioned apparatus further includes modules for executing other method steps in Embodiment 1, which will not be repeated here.
本实施例中,通过确定对应的相位下第二芯片数据发送以及第一芯片数据的接收状态,筛选出最佳相位,基于该最佳相位对第一芯片时钟的接收相位进行相应的调整,避免了在LVDS通信链路中芯片之间的相位偏移,提高了LVDS通信链路数据传输的稳定性以及数据传输的效率,进而解决了现有技术中芯片间采用LVDS通信链路通信时数据传输不稳定的技术问题。In this embodiment, by determining the data transmission state of the second chip and the receiving state of the data of the first chip under the corresponding phase, the optimal phase is selected, and the receiving phase of the clock of the first chip is adjusted accordingly based on the optimal phase, so as to avoid The phase offset between the chips in the LVDS communication link is improved, the stability of the data transmission of the LVDS communication link and the efficiency of the data transmission are improved, and the data transmission when the LVDS communication link is used for communication between the chips in the prior art is solved. Unstable technical issues.
实施例4Example 4
根据本发明实施例,提供了一种数据处理装置的实施例,图8为根据本发明实施例的另一种数据处理装置的示意图,如图8所示,该装置包括:According to an embodiment of the present invention, an embodiment of a data processing apparatus is provided. FIG. 8 is a schematic diagram of another data processing apparatus according to an embodiment of the present invention. As shown in FIG. 8 , the apparatus includes:
发送模块80,用于第二板卡上的第二芯片检测到第一板卡上的第一芯片发送的空闲码时,持续向所述第一芯片发送测试包;The sending module 80 is used for continuously sending a test packet to the first chip when the second chip on the second board detects the idle code sent by the first chip on the first board;
停止发送模块82,用于直至所述第二芯片检测到所述第一芯片发送的完成包,所述第二芯片停止发送所述测试包。The stop sending module 82 is configured to stop sending the test packet by the second chip until the second chip detects the completion packet sent by the first chip.
上述装置还包括执行实施例2中其他方法步骤的模块,此处不再赘述。The above-mentioned apparatus further includes modules for executing other method steps in Embodiment 2, and details are not described herein again.
实施例5Example 5
根据本发明实施例,提供了一种板卡的数据处理系统实施例,图9是根据本发明实施例的板卡的数据处理系统的示意图,如图9所示,该数据处理系统包括多个第一板卡和一个第二板卡,第一板卡和第二板卡均设置在背板之上,每个第一板卡与第二板卡之间通过低电压差分信号通信,第二板卡用于向第一板卡发送测试包;第一板卡用于在上电之后,将接收相位分别锁定至第一组待测相位中的每个第一待测相位,接收第二板卡发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态;第一板卡还用于根据每个第一待测相位对应的接收状态确定接收相位对应的第一目标相位,以用于第一板卡的接收端口在第一目标相位下与第二板卡进行通信;第一板卡还用于将发送相位锁定至第二组待测相位中的每个第二待测相位,并在发送相位每次锁定至一个第二待测相位之后,向第二板卡发送测试包;第二板卡还用于判断测试包是否正确,并根据判断结果向第一板卡返回测试包的接收状态;第一板卡还用于接收测试包的接收状态,根据测试包的接收状态确定每个第二待测相位对应的发送状态,并根据每个第二待测相位对应的发送状态确定发送相位对应的第二目标相位。According to an embodiment of the present invention, an embodiment of a data processing system for a board card is provided. FIG. 9 is a schematic diagram of a data processing system for a board card according to an embodiment of the present invention. As shown in FIG. 9 , the data processing system includes a plurality of A first board and a second board, the first board and the second board are both arranged on the backplane, and each first board and the second board communicate through low-voltage differential signals, and the second board The board is used to send the test package to the first board; the first board is used to lock the receiving phase to each first phase to be tested in the first group of phases to be tested after power-on, and receive the second board The first board card is also used to determine the first corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured. The target phase is used for the receiving port of the first board to communicate with the second board under the first target phase; the first board is also used to lock the transmit phase to each of the second sets of phases to be tested. Two phases to be tested, and after the sending phase is locked to a second phase to be tested each time, a test package is sent to the second board; the second board is also used to judge whether the test package is correct, and send the test package to the first board according to the judgment result. The board returns the receiving state of the test package; the first board is also used to receive the receiving state of the test package, determine the sending state corresponding to each second phase to be tested according to the receiving state of the test package, and according to the receiving state of each second test package The transmission state corresponding to the phase determines the second target phase corresponding to the transmission phase.
在LVDS通信链路中,通常存在一个AUX卡和多个子卡。在一种可选的实施例中,上述多个第一板卡均为子卡,第二板卡为AUX卡,由子卡主导整个通信链路的驯服过程,先对下行链路(AUX至子卡)做驯服,基于下行链路驯服结果,再对上行链路(子卡至AUX)做驯服,驯服完成后进入正常通信流程。In the LVDS communication link, there is usually one AUX card and multiple daughter cards. In an optional embodiment, the above-mentioned multiple first boards are all daughter cards, and the second board is an AUX card. The daughter card dominates the taming process of the entire communication link. Card) to tame, based on the downlink tame result, and then tame the uplink (daughter card to AUX), and enter the normal communication process after the tame is completed.
具体的,子卡上电后,MMCM对子卡的接收相位进行锁定,在当前相位下,AUX卡向子卡发送测试包,子卡接收测试包并确定接收状态,然后进入下一个时钟序列,重复上述AUX卡向子卡发送测试包,子卡接收并确定接收状态的步骤。连续记录N个接收相位的接收状态后,在具有接收正确状态的接收相位中,筛选出一个最佳相位,将子卡的接收相位调整为该最佳相位,实现AUX卡和子卡的接收相位一致性调整,完成AUX卡和子卡之间的下行链路驯服(即数据下行链路的相位调整)。Specifically, after the sub-card is powered on, the MMCM locks the receiving phase of the sub-card. Under the current phase, the AUX card sends a test packet to the sub-card, and the sub-card receives the test packet and determines the receiving state, and then enters the next clock sequence. Repeat the above steps that the AUX card sends the test package to the daughter card, and the daughter card receives and determines the receiving status. After continuously recording the receiving states of N receiving phases, select an optimal phase among the receiving phases with the correct receiving state, and adjust the receiving phase of the daughter card to the optimal phase, so that the receiving phases of the AUX card and the daughter card are consistent. performance adjustment to complete the downlink tame between the AUX card and the daughter card (ie, the phase adjustment of the data downlink).
在完成了下行链路驯服后,主控卡循环检测子卡是否上电,一旦检测到子卡上电,主控卡给AUX卡发送驯服指令(驯服可理解为通过对MMCM收发双向时钟的相位做调整),使AUX卡进入驯服状态,AUX卡发送下行链路驯服序列,使子卡进入驯服状态,AUX卡检测是否接 收到子卡发出的上行链路驯服序列(即测试包)或者完成序列;如果AUX卡接收到子卡发出的上行链路驯服序列,则说明已经进入对子卡发送端口相位调整的步骤,AUX卡接收子卡发出的上行链路驯服序列,并对当前测试包的接收状态进行判断,如果接收状态为正确,环回当前测试包数据给子卡,如果当前测试包为完成包,驯服完成,AUX卡退出驯服状态,并进入正常数据接收状态,同时将驯服完成状态反馈给主控卡。根据上述步骤,将子卡的发送相位调整为该最佳相位,实现AUX卡和子卡的接收相位一致性调整,完成AUX卡和子卡之间的上行链路驯服(即数据上行链路的相位调整)。After completing the downlink taming, the main control card cyclically detects whether the daughter card is powered on. Once it detects that the daughter card is powered on, the main control card sends a taming command to the AUX card (taming can be understood as sending and receiving the phase of the two-way clock through the MMCM make adjustments), make the AUX card enter the taming state, the AUX card sends the downlink taming sequence to make the daughter card enter the taming state, and the AUX card detects whether it receives the uplink taming sequence (ie test packet) sent by the daughter card or completes the sequence ; If the AUX card receives the uplink taming sequence sent by the daughter card, it means that it has entered the step of adjusting the phase of the sending port of the daughter card. The status is judged. If the receiving status is correct, loop back the current test package data to the daughter card. If the current test package is a complete package and the taming is completed, the AUX card exits the taming status and enters the normal data receiving status. At the same time, the taming completion status is fed back. to the main control card. According to the above steps, the transmission phase of the sub-card is adjusted to the optimal phase, so as to realize the consistency adjustment of the receiving phase between the AUX card and the sub-card, and complete the uplink taming between the AUX card and the sub-card (that is, the phase adjustment of the data uplink). ).
需要说明的是,在第二板卡与多个第一板卡通信的情况下,如果由第二板卡来进行自己的下行链路的驯服,则第二板卡的操作会非常复杂,因此在这种情况下,由第一板卡进行上行链路的驯服。It should be noted that when the second board communicates with multiple first boards, if the second board tames its own downlink, the operation of the second board will be very complicated. Therefore, the operation of the second board will be very complicated. In this case, the taming of the uplink is performed by the first board.
本实施例,通过第二板卡同时作为发送端和接收端,向多个第一板卡发送测试包并接收多个第一板卡发送的测试包,使得多个第一板卡中每个板卡均确定出其接收相位和发送相位的最佳相位。通过对MMCM收发双向(包括了数据上行链路和数据下行链路)时钟的相位做调整,完成了对第一板卡的发送端口和接收端口的时钟的双向调整,解决了基于LVDS通信链路的板卡间通讯存在相位偏差的问题,进而解决了板卡间采用LVDS通信链路通信时数据传输不稳定的问题,保证LVDS线上数据能够进行正常的采样,并且在板卡间建立了稳定可靠的LVDS通信链路,提高了数据传输效率。In this embodiment, the second board serves as both the sending end and the receiving end, sending test packets to multiple first boards and receiving test packets sent by multiple first boards, so that each of the multiple first boards Each board determines the optimal phase of its receive phase and transmit phase. By adjusting the phase of the MMCM sending and receiving two-way (including data uplink and data downlink) clocks, the two-way adjustment of the clocks of the sending port and the receiving port of the first board is completed, which solves the problem of LVDS-based communication links. There is the problem of phase deviation in the communication between the boards, which solves the problem of unstable data transmission when the LVDS communication link is used for communication between the boards, ensures that the data on the LVDS line can be sampled normally, and establishes a stable relationship between the boards. Reliable LVDS communication link improves data transmission efficiency.
实施例6Example 6
根据本发明实施例,提供了一种板卡的数据处理系统实施例,图10是根据本发明实施例的板卡的数据处理系统的示意图,如图10所示,该数据处理系统包括一个第一板卡和一个第二板卡,第一板卡和第二板卡均设置在背板之上,第一板卡与第二板卡之间通过低电压差分信号通信,第二板卡用于向第一板卡发送测试包;第一板卡用于在上电之后,将接收相位分别锁定至第一组待测相位中的每个第一待测相位,接收第二板卡发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态;第一板卡还用于根据每个第一待测相位对应的接收状态确定接收相位对应的第一目标相位,以用于第一板卡的接收端口在第一目标相位下与第二板卡进行通信;第一板卡还用于向第二板卡发送测试包;第二板卡还用于在上电之后,将接收相位分别锁定至第三组待测相位中的每个第三待测相位,接收第一板卡发送的测试包,并确定接收状态,得到每个第三待测相位对应的接收状态;第二板卡还用于根据每个第三待测相位对应的接收状态确定接收相位对应的第三目标相位,以用于第二板卡的接收端口在第三目标相位下与第一板卡进行通信。According to an embodiment of the present invention, an embodiment of a data processing system for a board card is provided. FIG. 10 is a schematic diagram of a data processing system for a board card according to an embodiment of the present invention. As shown in FIG. 10 , the data processing system includes a first A board and a second board, the first board and the second board are both arranged on the backplane, the first board and the second board communicate through low-voltage differential signals, and the second board uses It is used to send the test package to the first board; the first board is used to lock the receiving phase to each first phase to be measured in the first group of phases to be measured after power-on, and receive the test packets, and determine the receiving state, and obtain the receiving state corresponding to each first phase to be tested; the first board is also used to determine the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured, The receiving port for the first board is used to communicate with the second board in the first target phase; the first board is also used to send a test package to the second board; the second board is also used to power on After that, lock the receiving phase to each third phase to be measured in the third group of phases to be measured, receive the test packet sent by the first board, determine the receiving state, and obtain the corresponding receiving phase of each third phase to be measured. state; the second board is also used to determine the third target phase corresponding to the receiving phase according to the receiving state corresponding to each third phase to be measured, so that the receiving port of the second board is in the third target phase and the first board to communicate.
需要说明的是,当两个通过LVDS通信的板卡A和B一一对应时,上述第一板卡可以为板卡A和板卡B中的任意一个。在一种可选的实施例中,先将板卡A作为上述第一板卡,将板卡B作为上述第二板卡,完成板卡A的下行链路的驯服;然后将板卡B作为上述第一板卡,将板卡A作为上述第二板卡,来完成板卡B的下行链路的驯服。通过上述两次驯服,即可使得板卡A和板卡B之间的收发都处于稳定的状态。It should be noted that, when two boards A and B that communicate through LVDS are in one-to-one correspondence, the above-mentioned first board may be any one of board A and board B. In an optional embodiment, first board A is used as the above-mentioned first board, and board B is used as the above-mentioned second board to complete the taming of the downlink of board A; then board B is used as the above-mentioned second board. In the above-mentioned first board, the board A is used as the above-mentioned second board, so as to complete the taming of the downlink of the board B. Through the above two times of taming, the transceiver between the board A and the board B can be in a stable state.
具体的,在一种可选的实施中,第一板卡为子卡A,第二板卡为子卡B,子卡A与子卡B卡一一对应。子卡A上电后,MMCM对子卡A的接收相位进行锁定,在当前相位下,子卡B向子卡A发送测试包,子卡A接收测试包并确定接收状态,然后进入下一个时钟序列,重复上述子卡B向子卡A发送测试包,子卡A接收并确定接收状态的步骤。连续记录N个接收相位的接收状态后,在具有接收正确状态的接收相位中,筛选出一个最佳相位,将子卡A的接收相位调整为该最佳相位,实现子卡B和子卡A的接收相位一致性调整,完成子卡A的下行链路驯服(即数据下行链路的相位调整)。Specifically, in an optional implementation, the first board is a sub-card A, the second board is a sub-card B, and the sub-card A and the sub-card B are in one-to-one correspondence. After the subcard A is powered on, the MMCM locks the receiving phase of the subcard A. Under the current phase, the subcard B sends a test packet to the subcard A, and the subcard A receives the test packet and determines the receiving state, and then enters the next clock sequence, repeating the above steps of subcard B sending a test packet to subcard A, and subcard A receiving and determining the receiving state. After continuously recording the receiving states of N receiving phases, among the receiving phases with the correct receiving state, an optimal phase is selected, and the receiving phase of sub-card A is adjusted to the optimal phase, so as to realize the communication between sub-card B and sub-card A. Receive phase consistency adjustment to complete downlink taming of daughter card A (ie, data downlink phase adjustment).
在完成了子卡A的下行链路驯服后,MMCM对子卡B的接收相位进行锁定,在当前相位下,子卡A向子卡B发送测试包,子卡B接收测试包并确定接收状态,然后进入下一个时钟序列,重复上述子卡A向子卡B发送测试包,子卡B接收并确定接收状态的步骤。连续记录N个接收相位的接收状态后,在具有接收正确状态的接收相位中,筛选出一个最佳相位,将子卡 B的接收相位调整为该最佳相位,实现子卡B和子卡A的接收相位一致性调整,完成子卡B的下行链路驯服(即数据下行链路的相位调整)。通过上述两次驯服,即可使得板卡A.板卡B之间的收发都处于稳定的状态。After the downlink taming of the subcard A is completed, the MMCM locks the receiving phase of the subcard B. Under the current phase, the subcard A sends a test packet to the subcard B, and the subcard B receives the test packet and determines the receiving state. , and then enter the next clock sequence, and repeat the above steps of subcard A sending a test packet to subcard B, and subcard B receiving and determining the receiving state. After continuously recording the receiving states of N receiving phases, among the receiving phases with the correct receiving state, an optimal phase is selected, and the receiving phase of sub-card B is adjusted to the optimal phase, so as to realize the communication between sub-card B and sub-card A. Receive phase consistency adjustment to complete downlink taming of daughter card B (that is, phase adjustment of data downlink). Through the above two times of taming, the sending and receiving between board A and board B can be in a stable state.
本实施例中,通过确定对应的相位下第二板卡数据发送以及第一板卡数据的接收状态,筛选出最佳相位,基于该最佳相位对第一板卡时钟的接收相位进行相应的调整,相应的,确定出第二板卡时钟的接收相位的最佳相位并进行相应的调整,避免了在LVDS通信链路中不同板卡之间的相位偏移,提高了LVDS通信链路数据传输的稳定性以及数据传输的效率,进而解决了现有技术中一一对应的不同板卡间采用LVDS通信链路通信时数据传输不稳定的技术问题。In this embodiment, by determining the data transmission state of the second board and the receiving state of the first board data under the corresponding phase, the optimal phase is screened out, and based on the optimal phase, the receiving phase of the clock of the first board is calculated accordingly. Adjust, correspondingly, determine the optimal phase of the receiving phase of the clock of the second board and adjust accordingly, avoid the phase offset between different boards in the LVDS communication link, and improve the data of the LVDS communication link The stability of transmission and the efficiency of data transmission further solve the technical problem of unstable data transmission in the prior art when LVDS communication links are used to communicate between different boards in one-to-one correspondence.
实施例7Example 7
根据本发明实施例,提供了一种存储介质的实施例,上述存储介质包括存储的程序,其中,在程序运行时控制存储介质所在设备执行上述数据处理方法。According to an embodiment of the present invention, an embodiment of a storage medium is provided, wherein the storage medium includes a stored program, wherein when the program runs, a device where the storage medium is located is controlled to execute the data processing method.
根据本发明实施例,提供了一种处理器的实施例,上述处理器用于运行程序,其中,上述程序运行时执行上述数据处理方法。According to an embodiment of the present invention, an embodiment of a processor is provided, and the processor is used for running a program, wherein the data processing method is executed when the program is running.
上述本发明实施例序号仅仅为了描述,不代表实施例的优劣。The above-mentioned serial numbers of the embodiments of the present invention are only for description, and do not represent the advantages or disadvantages of the embodiments.
在本发明的上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见其他实施例的相关描述。In the above-mentioned embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
在本申请所提供的几个实施例中,应该理解到,所揭露的技术内容,可通过其它的方式实现。其中,以上所描述的装置实施例仅仅是示意性的,例如所述单元的划分,可以为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,单元或模块的间接耦合或通信连接,可以是电性或其它的形式。In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. The device embodiments described above are only illustrative. For example, the division of the units may be a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined or may be Integration into another system, or some features can be ignored, or not implemented. On the other hand, the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of units or modules, and may be in electrical or other forms.
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。The units described as separate components may or may not be physically separated, and components shown as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
另外,在本发明各个实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现,也可以采用软件功能单元的形式实现。In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit. The above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时,可以存储在一个计算机可读取存储介质中。基于这样的理解,本发明的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质中,包括若干指令用以使得一台计算机设备(可为个人计算机、服务器或者网络设备等)执行本发明各个实施例所述方法的全部或部分步骤。而前述的存储介质包括:U盘、只读存储器(ROM,Read-Only Memory)、随机存取存储器(RAM,Random Access Memory)、移动硬盘、磁碟或者光盘等各种可以存储程序代码的介质。The integrated unit, if implemented in the form of a software functional unit and sold or used as an independent product, may be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program codes .
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。The above are only the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the principles of the present invention, several improvements and modifications can be made. It should be regarded as the protection scope of the present invention.
Claims (23)
- 一种数据处理方法,其特征在于,第一芯片和第二芯片之间通过低电压差分信号通信,所述数据处理方法包括:A data processing method, characterized in that a first chip and a second chip communicate through a low-voltage differential signal, and the data processing method includes:所述第一芯片上电之后,将接收相位锁定至第一组待测相位中的每个第一待测相位;After the first chip is powered on, the receiving phase is locked to each first phase to be measured in the first group of phases to be measured;在所述接收相位每次锁定至一个所述第一待测相位之后,所述第一芯片接收所述第二芯片发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态;After the receiving phase is locked to one of the first phases to be measured each time, the first chip receives the test packet sent by the second chip, determines the receiving state, and obtains the corresponding value of each first phase to be measured. receiving state;所述第一芯片根据每个第一待测相位对应的接收状态确定所述接收相位对应的第一目标相位;The first chip determines the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured;所述第一芯片将所述接收相位锁定至所述第一目标相位,以用于所述第一芯片的接收端口在所述第一目标相位下与所述第二芯片进行通信。The first chip locks the receive phase to the first target phase for a receive port of the first chip to communicate with the second chip at the first target phase.
- 根据权利要求1所述的数据处理方法,其特征在于,所述第一组待测相位基于所述第一芯片接收信号的时钟周期以及预设相位数量得到;或者,所述第一组待测相位中相邻两个第一待测相位之间的差值为所述时钟周期除以预设相位数量。The data processing method according to claim 1, wherein the first group of phases to be measured is obtained based on a clock cycle of the signal received by the first chip and a preset number of phases; or, the first group of phases to be measured The difference between two adjacent first phases to be measured in the phase is the clock period divided by the preset number of phases.
- 根据权利要求1所述的数据处理方法,其特征在于,在所述接收相位每次锁定至所述第一待测相位之后,所述第一芯片接收所述第二芯片发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态,包括:The data processing method according to claim 1, wherein after the receiving phase is locked to the first phase to be tested each time, the first chip receives the test packet sent by the second chip, and Determine the receiving state, and obtain the receiving state corresponding to each first phase to be measured, including:所述第一芯片接收第二芯片发送的连续多个测试包;The first chip receives a plurality of consecutive test packets sent by the second chip;如果所述第一芯片对所述连续多个测试包全部接收正确,确定所述第一芯片在当前的第一待测相位下接收状态为接收正确状态;If the first chip receives all the consecutive multiple test packets correctly, it is determined that the receiving state of the first chip in the current first phase to be tested is a correct receiving state;如果所述第一芯片对任意一个或多个测试包接收错误或超时未接收到,确定所述第一芯片在当前的第一待测相位下接收状态为接收错误状态。If the first chip receives any one or more test packets incorrectly or fails to receive it over time, it is determined that the receiving state of the first chip in the current first phase to be tested is a receiving error state.
- 根据权利要求3所述的数据处理方法,其特征在于,根据每个第一待测相位对应的接收状态确定所述接收相位对应的第一目标相位,包括:The data processing method according to claim 3, wherein determining the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured comprises:确定接收状态为所述接收正确状态的第一待测相位为所述接收相位对应的第一目标相位。It is determined that the first phase to be measured whose receiving state is the correct receiving state is the first target phase corresponding to the receiving phase.
- 根据权利要求4所述的数据处理方法,其特征在于,在接收状态为接收正确状态的第一待测相位为多个连续相位的情况下,确定接收状态为所述接收正确状态的第一待测相位为所述接收相位对应的第一目标相位,包括:The data processing method according to claim 4, wherein when the first phase to be measured whose receiving state is the correct receiving state is a plurality of consecutive phases, it is determined that the first waiting state whose receiving state is the correct receiving state is the first phase to be measured. The measured phase is the first target phase corresponding to the received phase, including:确定所述多个连续相位中居中的相位为所述接收相位对应的第一目标相位。The middle phase among the plurality of continuous phases is determined as the first target phase corresponding to the receiving phase.
- 根据权利要求1所述的数据处理方法,其特征在于,所述方法还包括:The data processing method according to claim 1, wherein the method further comprises:所述第一芯片将发送相位锁定至第二组待测相位中的每个第二待测相位;the first chip locks the transmission phase to each second phase to be measured in the second group of phases to be measured;在所述发送相位每次锁定至一个所述第二待测相位之后,向所述第二芯片发送测试包,其中,在所述第一芯片向所述第二芯片发送所述测试包之后,所述第二芯片向所述第一芯片返回所述测试包的接收状态;After the sending phase is locked to one of the second phases to be tested each time, a test packet is sent to the second chip, wherein after the first chip sends the test packet to the second chip, the second chip returns the receiving state of the test packet to the first chip;所述第一芯片接收所述测试包的接收状态,根据所述测试包的接收状态确定每个所述第二待测相位对应的发送状态;The first chip receives the reception status of the test packet, and determines the transmission status corresponding to each of the second phases to be tested according to the reception status of the test packet;根据每个第二待测相位对应的发送状态确定所述发送相位对应的第二目标相位;Determine the second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured;所述第一芯片将所述发送相位锁定至所述第二目标相位,其中,所述第一芯片的发送端口在所述第二目标相位下与所述第二芯片进行通信。The first chip locks the transmit phase to the second target phase, wherein the transmit port of the first chip communicates with the second chip at the second target phase.
- 根据权利要求6所述的数据处理方法,其特征在于,所述第一芯片接收所述测试包的接收状态,根据所述测试包的接收状态确定每个所述第二待测相位对应的发送状态,包括:The data processing method according to claim 6, wherein the first chip receives the reception status of the test packet, and determines the transmission corresponding to each second phase to be tested according to the reception status of the test packet status, including:如果所述测试包的接收状态为全部接收正确,确定所述第二待测相位对应的发送状态为发送正确状态;If the reception status of the test packet is that all receptions are correct, determine that the transmission status corresponding to the second phase to be tested is the correct transmission status;如果任意一个或多个测试包的接收状态为接收错误或超时未接收到,确定所述第二待测相位对应的发送状态为发送错误状态。If the reception status of any one or more test packets is a reception error or a timeout is not received, it is determined that the transmission status corresponding to the second phase to be tested is a transmission error status.
- 根据权利要求6所述的数据处理方法,其特征在于,根据每个第二待测相位对应的发送状态确定所述发送相位对应的第二目标相位,包括:The data processing method according to claim 6, wherein determining the second target phase corresponding to the transmission phase according to the transmission state corresponding to each second phase to be measured, comprising:确定发送状态为发送正确状态的第二待测相位为所述发送相位对应的第二目标相位。It is determined that the second phase to be measured whose transmission state is the correct transmission state is the second target phase corresponding to the transmission phase.
- 根据权利要求8所述的数据处理方法,其特征在于,在发送状态为发送正确状态的第二待测相位为多个连续相位的情况下,确定发送状态为发送正确状态的第二待测相位为所述发送相位对应的第二目标相位,包括:The data processing method according to claim 8, wherein when the second phase to be measured whose transmission state is the correct transmission state is a plurality of consecutive phases, it is determined that the second phase to be measured whose transmission state is the correct transmission state is the second phase to be measured. is the second target phase corresponding to the transmission phase, including:确定所述多个连续相位中居中的相位为所述发送相位对应的第一目标相位。The middle phase among the plurality of continuous phases is determined as the first target phase corresponding to the transmission phase.
- 根据权利要求7所述的数据处理方法,其特征在于,在所述第一芯片将所述发送相位锁定至所述第二目标相位之后,所述方法还包括:The data processing method according to claim 7, wherein after the first chip locks the transmission phase to the second target phase, the method further comprises:所述第一芯片向所述第二芯片发送完成包;the first chip sends a completion packet to the second chip;其中,所述第二芯片在接收到所述测试包后,判断所述测试包是否为完成包,如果所述测试包为所述完成包,所述第二芯片与所述第一芯片进入通信模式;如果所述测试包不为所述完成包,进入所述第二芯片向所述第一芯片返回所述测试包的接收状态的步骤。Wherein, after receiving the test packet, the second chip determines whether the test packet is a completion packet, and if the test packet is the completion packet, the second chip and the first chip enter into communication mode; if the test packet is not the completion packet, enter the step of returning the receiving state of the test packet to the first chip by the second chip.
- 根据权利要求7所述的数据处理方法,其特征在于,所述第二组待测相位基于所述第一芯片发送信号的时钟周期以及预设相位数量得到,或The data processing method according to claim 7, wherein the second group of phases to be measured is obtained based on a clock cycle of a signal sent by the first chip and a preset number of phases, or所述第一组待测相位中相邻两个第一待测相位之间的差值为所述第一芯片发送信号的时钟周期除以所述预设相位数量。The difference between two adjacent first phases to be measured in the first group of phases to be measured is the clock cycle of the signal sent by the first chip divided by the preset number of phases.
- 根据权利要求1所述的数据处理方法,其特征在于,所述第一芯片的数量为多个,多个所述第一芯片部署在多个不同的第一板卡上,所述第二芯片部署在第二板卡上,所述第二板卡与多个所述第一板卡中的每个板卡进行通信。The data processing method according to claim 1, wherein the number of the first chips is multiple, and a plurality of the first chips are deployed on a plurality of different first boards, and the second chips Deployed on a second board, the second board communicates with each of the plurality of first boards.
- 根据权利要求1所述的数据处理方法,其特征在于,所述第一芯片和所述第二芯片均为FPGA芯片,通过所述第一芯片中的时钟管理器将接收相位分别锁定至所述第一组待测相位中的每个第一待测相位。The data processing method according to claim 1, wherein the first chip and the second chip are both FPGA chips, and the receiving phase is respectively locked to the said first chip by a clock manager in the first chip. Each first phase to be measured in the first group of phases to be measured.
- 根据权利要求8所述的数据处理方法,其特征在于,在所述第一芯片将所述发送相位锁定至所述第二目标相位之后,所述方法还包括:所述第一芯片与所述第二芯片进行通信,所述第一芯片与所述第二芯片进行通信的步骤包括:The data processing method according to claim 8, wherein after the first chip locks the transmission phase to the second target phase, the method further comprises: the first chip and the The second chip communicates, and the step of communicating between the first chip and the second chip includes:所述第一芯片将待传输数据按照预设规则进行封装,得到封装数据包;The first chip encapsulates the data to be transmitted according to a preset rule to obtain an encapsulated data packet;所述第一芯片对所述封装数据包进行编码,得到编码结果;The first chip encodes the encapsulated data packet to obtain an encoding result;所述第一芯片对所述编码结果进行加扰,得到加扰结果;The first chip scrambles the encoding result to obtain a scrambled result;所述第一芯片对所述加扰结果进行并串转换,并将并串转换后得到的数据包发送至所述第二芯片;The first chip performs parallel-serial conversion on the scrambled result, and sends the data packet obtained after the parallel-serial conversion to the second chip;其中,所述第二芯片通过接收所述第一芯片发送的数据包,对接收到的所述数据包进行串并转换,对串并转换结果进行解扰,对解扰结果进行解码,得到待传输数据的封装结果,并根据所述封装结果进行校验,在校验正确的情况下将所述待传输数据发送至对应的处理单元。The second chip receives the data packet sent by the first chip, performs serial-to-parallel conversion on the received data packet, descrambles the serial-to-parallel conversion result, decodes the descramble result, and obtains the The encapsulation result of the transmitted data is verified according to the encapsulation result, and if the verification is correct, the data to be transmitted is sent to the corresponding processing unit.
- 一种数据处理方法,其特征在于,所述方法包括:A data processing method, characterized in that the method comprises:第二板卡上的第二芯片检测到第一板卡上的第一芯片发送的空闲码时,持续向所述第一芯片发送测试包;When the second chip on the second board detects the idle code sent by the first chip on the first board, it continues to send a test packet to the first chip;直至所述第二芯片检测到所述第一芯片发送的完成包,所述第二芯片停止发送所述测试包。Until the second chip detects the completion packet sent by the first chip, the second chip stops sending the test packet.
- 根据权利要求15所述的数据处理方法,其特征在于,所述第二芯片与多个第一芯片之间通过低电压差分信号通信,所述数据处理方法包括:The data processing method according to claim 15, wherein the second chip communicates with a plurality of first chips through a low-voltage differential signal, and the data processing method comprises:所述第二芯片的接收端口采集所述第一芯片发送的测试包,其中,所述第一芯片将发送相位锁定至第二组待测相位中的每个第二待测相位,并在所述发送相位每次锁定至一个所述第二待测相位之后,向所述第二芯片发送测试包;The receiving port of the second chip collects the test packet sent by the first chip, wherein the first chip locks the sending phase to each second phase to be measured in the second group of After the transmission phase is locked to a second phase to be tested each time, a test packet is sent to the second chip;所述第二芯片判断所述测试包是否正确;The second chip determines whether the test package is correct;所述第二芯片根据判断结果向所述第一芯片返回所述测试包的接收状态;The second chip returns the receiving state of the test packet to the first chip according to the judgment result;所述第一芯片接收所述测试包的接收状态,根据所述测试包的接收状态确定每个所述第二待测相位对应的发送状态,并根据每个第二待测相位对应的发送状态确定所述发送相位对应的第二目标相位。The first chip receives the reception state of the test packet, determines the transmission state corresponding to each of the second phases to be measured according to the reception state of the test packet, and determines the transmission state corresponding to each second phase to be measured according to the reception state of the test packet A second target phase corresponding to the transmission phase is determined.
- 根据权利要求16所述的数据处理方法,其特征在于,在所述第二芯片判断所述测试包正确的情况下,在所述第二芯片根据判断结果向所述第一芯片返回所述测试包的接收状态之后,所述方法还包括:The data processing method according to claim 16, wherein when the second chip judges that the test package is correct, the second chip returns the test to the first chip according to the judgment result After the receiving state of the packet, the method further includes:所述第二芯片判断所述测试包是否为完成包,其中,所述第一芯片确定发送端口的第二目标相位之后,向所述第二芯片发送所述完成包;The second chip determines whether the test packet is a completion packet, wherein the first chip sends the completion packet to the second chip after determining the second target phase of the sending port;如果所述测试包为所述完成包,所述第二芯片与所述第一芯片进入通信模式;If the test package is the completion package, the second chip and the first chip enter a communication mode;如果所述测试包不为所述完成包,进入所述第二芯片的接收端口采集所述第一芯片发送的测试包的步骤。If the test packet is not the completion packet, enter the receiving port of the second chip to collect the test packet sent by the first chip.
- 一种数据处理装置,其特征在于,第一芯片和第二芯片之间通过低电压差分信号通信,所述数据处理装置包括:A data processing device, characterized in that a first chip and a second chip communicate through a low-voltage differential signal, and the data processing device comprises:相位锁定模块,用于在所述第一芯片上电之后,将接收相位锁定至第一组待测相位中的每个第一待测相位;a phase locking module, configured to lock the receiving phase to each first phase to be measured in the first group of phases to be measured after the first chip is powered on;相位测试模块,用于在所述接收相位每次锁定至一个所述第一待测相位之后,使所述第一芯片接收所述第二芯片发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态;The phase test module is configured to enable the first chip to receive the test packet sent by the second chip after the receiving phase is locked to one of the first phases to be tested each time, and determine the receiving state, and obtain each the receiving state corresponding to the first phase to be measured;相位选择模块,用于所述第一芯片根据每个第一待测相位对应的接收状态确定所述接收相位对应的第一目标相位;a phase selection module, used for the first chip to determine the first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured;相位调整模块,用于使所述第一芯片将所述接收相位锁定至所述第一目标相位,以用于所述第一芯片的接收端口在所述第一目标相位下与所述第二芯片进行通信。A phase adjustment module, configured to enable the first chip to lock the receiving phase to the first target phase, so that the receiving port of the first chip can communicate with the second chip under the first target phase chip to communicate.
- 一种数据处理装置,其特征在于,包括:A data processing device, comprising:发送模块,用于第二板卡上的第二芯片检测到第一板卡上的第一芯片发送的空闲码时,持续向所述第一芯片发送测试包;a sending module, used for continuously sending a test packet to the first chip when the second chip on the second board detects the idle code sent by the first chip on the first board;停止发送模块,用于直至所述第二芯片检测到所述第一芯片发送的完成包,所述第二芯片停止发送所述测试包。A stop sending module, configured to stop sending the test packet by the second chip until the second chip detects the completion packet sent by the first chip.
- 一种板卡的数据处理系统,其特征在于,包括多个第一板卡和一个第二板卡,所述第一板卡和所述第二板卡均设置在背板之上,每个所述第一板卡与所述第二板卡之间通过低电压差分信号通信,A data processing system for boards, characterized in that it includes a plurality of first boards and a second board, the first board and the second board are both arranged on the backplane, each The first board and the second board communicate through low-voltage differential signals,所述第二板卡用于向所述第一板卡发送测试包;the second board is used for sending a test package to the first board;所述第一板卡用于在上电之后,将接收相位分别锁定至第一组待测相位中的每个第一待测相位,接收所述第二板卡发送的测试包,并确定接收状态,得到每个第一待测相位对应的接收状态;The first board is used to lock the receiving phase to each first phase to be tested in the first group of phases to be tested after power-on, receive the test package sent by the second board, and determine the receiving phase. state, to obtain the receiving state corresponding to each first phase to be measured;所述第一板卡还用于根据每个第一待测相位对应的接收状态确定所述接收相位对应的第一目标相位,以用于所述第一板卡的接收端口在所述第一目标相位下与所述第二板卡进行通信;The first board is further configured to determine a first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured, so that the receiving port of the first board is in the first phase. communicate with the second board in the target phase;所述第一板卡还用于将发送相位锁定至第二组待测相位中的每个第二待测相位,并在所述发送相位每次锁定至一个所述第二待测相位之后,向所述第二板卡发送测试包;The first board is also used to lock the transmission phase to each second phase to be measured in the second group of phases to be measured, and after the transmission phase is locked to one of the second phases to be measured each time, sending a test package to the second board;所述第二板卡还用于判断所述测试包是否正确,并根据判断结果向所述第一板卡返回所述测试包的接收状态;The second board is also used for judging whether the test package is correct, and returns the receiving state of the test package to the first board according to the judgment result;所述第一板卡还用于接收所述测试包的接收状态,根据所述测试包的接收状态确定每个所述第二待测相位对应的发送状态,并根据每个第二待测相位对应的发送状态确定所述发送相位对应的第二目标相位。The first board is also used to receive the reception status of the test packet, determine the transmission status corresponding to each second phase to be measured according to the reception status of the test packet, and determine the corresponding transmission status of each second phase to be measured according to the reception status of the test packet, and The corresponding transmission state determines the second target phase corresponding to the transmission phase.
- 一种板卡的数据处理系统,其特征在于,包括一个第一板卡和一个第二板卡,所述第一板卡和所述第二板卡均设置在背板之上,所述第一板卡与所述第二板卡之间通过低电压差分信号通信,A data processing system for board cards, characterized in that it includes a first board card and a second board card, the first board card and the second board card are both arranged on a backplane, and the first board card and the second board card are both arranged on a backplane. A low-voltage differential signal communicates between a board and the second board,所述第二板卡用于向所述第一板卡发送测试包;the second board is used for sending a test package to the first board;所述第一板卡用于在上电之后,将接收相位分别锁定至第一组待测相位中的每个第一待测相位,接收所述第二板卡发送的测试包,并确定接收状态,得到每个第一待测相位对 应的接收状态;The first board is used to lock the receiving phase to each first phase to be tested in the first group of phases to be tested after power-on, receive the test package sent by the second board, and determine the receiving phase. state, to obtain the receiving state corresponding to each first phase to be measured;所述第一板卡还用于根据每个第一待测相位对应的接收状态确定所述接收相位对应的第一目标相位,以用于所述第一板卡的接收端口在所述第一目标相位下与所述第二板卡进行通信;The first board is further configured to determine a first target phase corresponding to the receiving phase according to the receiving state corresponding to each first phase to be measured, so that the receiving port of the first board is in the first phase. communicating with the second board in the target phase;所述第一板卡还用于向所述第二板卡发送测试包;The first board is also used for sending a test package to the second board;所述第二板卡还用于在上电之后,将接收相位分别锁定至第三组待测相位中的每个第三待测相位,接收所述第一板卡发送的测试包,并确定接收状态,得到每个第三待测相位对应的接收状态;The second board is also used to lock the receiving phase to each third phase to be tested in the third group of phases to be tested after power-on, receive the test package sent by the first board, and determine receiving state, to obtain the receiving state corresponding to each third phase to be measured;所述第二板卡还用于根据每个第三待测相位对应的接收状态确定所述接收相位对应的第三目标相位,以用于所述第二板卡的接收端口在所述第三目标相位下与所述第一板卡进行通信。The second board is further configured to determine a third target phase corresponding to the receiving phase according to the receiving state corresponding to each third phase to be measured, so that the receiving port of the second board is in the third phase. communicate with the first board in the target phase.
- 一种存储介质,其特征在于,所述存储介质包括存储的程序,其中,在所述程序运行时控制所述存储介质所在设备执行权利要求1至17中任意一项所述数据处理方法。A storage medium, characterized in that the storage medium includes a stored program, wherein when the program runs, a device where the storage medium is located is controlled to execute the data processing method according to any one of claims 1 to 17.
- 一种处理器,其特征在于,所述处理器用于运行程序,其中,所述程序运行时执行权利要求1至17中任意一项所述数据处理方法。A processor, characterized in that the processor is used for running a program, wherein when the program runs, the data processing method according to any one of claims 1 to 17 is executed.
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