WO2022124566A1 - Mobile device housing material comprising polyetherketoneketone, and mobile device housing formed therefrom - Google Patents

Abstract

The present invention relates to a mobile device housing material comprising polyetherketoneketone (PEKK), and a mobile device housing formed therefrom. More specifically, PEKK has excellent intrinsic physical properties such as excellent insulation properties and adhesion with metal, and thus, when PEKK is applied to a mobile device housing, a more excellent housing may be provided.

Description

Housing material for mobile devices containing polyether ketone ketone and housing for mobile devices comprising the same

The present invention relates to a housing material for mobile devices comprising polyether ketone ketone (PEKK) and a housing for mobile devices comprising the same. It has physical properties and can provide a better housing when applied to a housing for a mobile device.

In recent years, the use of mobile devices is rapidly increasing due to the development of broadcasting communication networks and the electronic industry.

In particular, in the case of mobile devices such as mobile phones, PMPs, and notebook computers that must always be exposed to the outside when in use, and that the user is holding or the user must continuously manipulate, the outer case forming the exterior of the mobile device should be reduced in weight. , high strength and high reliability are required.

Accordingly, there have been many examples of using high-strength metal to improve the strength of the outer case of the mobile device. An external case of a mobile device using a conventional metal is manufactured by die-casting aluminum or magnesium.

In the case of using die casting, there is an advantage that a boss capable of accommodating other parts or a coupling rib, a hook, etc. for coupling with another surface of the case can be formed at once. However, in the case of die-casting aluminum or magnesium, material defects often occur due to pores or flow marks during the die-casting process, and cumbersome post-processing is required after die-casting. If the cost required for the production of defective products is also calculated, high cost is required for mass production. In addition, since the product during post-treatment is metal, surface treatment must be performed to prevent corrosion.

In addition, as another method of manufacturing an exterior product of a mobile device using a conventional metal, there is a method of press-working a metal plate, and then welding a bonding boss, rib, hook, etc. with metal to the inner surface of the outer case. However, when welding the boss, rib, hook, etc. for assembling separately for assembly, it is quite difficult and cumbersome to weld each position exactly.

On the other hand, recently, in order to improve the data transmission/reception speed of the mobile device, a technology for dividing the rear plate of the mobile device into a plurality of sectors is proposed for the purpose of utilizing various frequency bands for mobile communication. is becoming In this case, the material for connecting the plurality of metal plates after bonding/assembly requires insulation and strong adhesion to the metal, and at the same time, high mechanical strength and excellent heat resistance/chemical resistance/weather resistance are required.

Accordingly, the present inventors were studying a material for connecting the plurality of metal plates after bonding / assembling. It has been found that a housing can be manufactured and the present invention has been completed.

In this regard, Korean Patent Registration No. 10-2127322 discloses a housing and antenna architecture for a mobile device.

The present invention has been devised to solve the problems of the prior art, and an object of the present invention is to provide a housing material for a mobile device including polyether ketone ketone (PEKK).

Another object of the present invention is to provide a housing for a mobile device made of the housing material for the mobile device.

Another object of the present invention is to provide a method of manufacturing the housing for the mobile device.

As a technical means for achieving the above-described technical problem, one aspect of the present invention is,

It provides a housing material for mobile devices containing polyether ketone ketone (PEKK).

The tensile strength of the polyether ketone ketone may be 100 Mpa or more.

The housing material for the mobile device may further include at least one of glass fiber and carbon material.

The carbon material may include a material selected from the group consisting of carbon fibers, carbon nanotubes, graphene, activated carbon, and combinations thereof.

The content of the material may be 20 parts by weight to 200 parts by weight based on 100 parts by weight of polyether ketone ketone.

The housing material for the mobile device may have a stress-strain curve having a slope of 20 or more in a strain range of 0 to 5%.

The housing material for the mobile device may have a stress-strain curve having a slope of 20 to 25 in a strain range of 0 to 5%.

The housing material for the mobile device may have a dielectric loss (tan δ) of 0.002 or less.

In addition, another aspect of the present invention,

Provided is a housing for a mobile device made of the housing material for the mobile device.

In addition, another aspect of the present invention,

preparing the mobile device; and applying the housing material for the mobile device to the rear plate segment opening or the side bezel segment opening of the mobile device.

The manufacturing method of the housing for the mobile device includes the steps of applying the housing material; Thereafter, the step of grinding the protruding housing material; may be to further include.

In addition, another aspect of the present invention,

forming the housing material for the mobile device to correspond to the rear plate segment opening or the side bezel segment opening of the mobile device; and inserting the molded housing material into the rear plate segment opening or the side bezel segment opening of the mobile device.

The molding of the housing material for the mobile device may be performed using injection molding, extrusion molding, or 3D printing.

As described above, the housing material for a mobile device according to the present invention includes polyether ketone ketone, and thus the polyether ketone ketone has unique properties such as tensile strength, heat resistance, chemical resistance, weather resistance, etc. It may be to improve the durability of the housing.

In addition, the low dielectric loss characteristic of polyether ketone ketone may improve the data transmission/reception performance for various frequency bands of the mobile device.

In addition, the polyether ketone ketone may be more easily processed because it has a high melt index (MI).

1 is a flowchart schematically illustrating a method of manufacturing a housing for a mobile device according to an embodiment of the present invention.

2 is a flowchart schematically illustrating a method of manufacturing a housing for a mobile device according to another embodiment of the present invention.

3 is a graph showing a stress-strain curve of a housing material for a mobile device according to an embodiment and a comparative example of the present invention.

Hereinafter, embodiments of the present invention will be described in detail so that those of ordinary skill in the art can easily carry out the present invention. However, the present invention may be embodied in several different forms and is not limited to the embodiments described herein.

Example 1. For mobile devices using the coating process of the housing Produce

A housing for a mobile device including polyether ketone ketone (PEKK) was manufactured using the process shown in FIG. 1 .

To this end, first, polyether ketone ketone pure resin or glass fiber and/or carbon fiber were added to the pure resin to prepare a housing material for a mobile device in the form of a composite.

Thereafter, the housing material for the mobile device was melted in the opening of the rear plate segment or the opening of the side bezel segment of the mobile device, and the housing for the mobile device was manufactured by dispensing (applying) and sealing the mobile device, and then grinding the protruding portion. .

Example 2. For mobile devices using molding process of the housing Produce

A housing for a mobile device including polyether ketone ketone (PEKK) was manufactured using the process shown in FIG. 2 .

To this end, after preparing a housing material for a mobile device as in Example 1, it was molded into a shape and size suitable for a rear plate segment opening or a side bezel segment opening of a mobile device using injection molding, extrusion molding, or 3D printing.

Thereafter, the mobile device housing material, which has been molded, was adhered to the segment opening to manufacture a mobile device housing.

comparative example . polyether ether ketone (PEEK) for mobile devices used of the housing Produce

A housing for a mobile device was manufactured in the same manner as in Example 1, except that polyether ether ketone (PEEK) was used as a housing material for a mobile device.

Experimental example 1. For mobile devices housing Stress-strain measurement of materials

In order to evaluate the flexibility of each of polyether ketone ketone (PEKK) and polyether ether ketone (PEEK) used as a housing material for mobile devices in the Examples and Comparative Examples, the stress-strain was measured, and the curve was shown as a graph. 3 is shown. Referring to FIG. 3 , in the case of PEEK used in Comparative Example, it can be seen that the slope of the stress-strain curve in the 0 to 5% strain section was about 18, whereas in the case of PEKK used in the Example, the slope was about 22. could Accordingly, it was confirmed that the housing material including polyether ketone ketone (PEKK) according to an embodiment of the present invention had high toughness and excellent strength.

Experimental example 2. For mobile devices housing Measurement of dielectric loss of materials

The dielectric loss of each of polyether ketone ketone (PEKK) and polyether ether ketone (PEEK) used as a housing material for mobile devices in Examples and Comparative Examples was measured, and the results are shown in Table 1 below.

[Table 1]

As shown in Table 1, it was confirmed that both PEKK and PEEK had a low dielectric loss of 0.0015 or less. Accordingly, it could be inferred that when PEKK having a low dielectric loss characteristic as described above is used as a housing material for a mobile device, data transmission/reception performance for various frequency bands can be improved.

Hereinafter, the present invention will be described in more detail. However, the present invention may be embodied in various different forms, and the present invention is not limited by the embodiments described herein, and the present invention is only defined by the claims to be described later.

In addition, the terms used in the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the entire specification of the present invention, 'including' any component means that other components may be further included, rather than excluding other components, unless otherwise stated.

The first aspect of the present application is

It provides a housing material for mobile devices containing polyether ketone ketone (PEKK).

The second aspect of the present application is

There is provided a housing for a mobile device made of the housing material for a mobile device according to the first aspect of the present application.

Hereinafter, a housing material for a mobile device according to the first aspect of the present application and a housing for a mobile device according to the second aspect of the present application will be described in detail.

In one embodiment of the present application, the polyether ketone ketone (PEKK) is a kind of polyether ketone, and the polyether ketone is a generic term for already known industrial resins. In this case, the polyether ketone includes polyether ketone, polyether ether ketone, and a copolymer in which a part of polyether ketone and polyether ketone ketone are mixed in addition to the polyether ketone ketone.

On the other hand, the polyether ketone ketone (PEKK) may be represented by the following chemical formula, and is generally used as an engineering plastic due to its high heat resistance and excellent strength.

[Formula]

In one embodiment of the present application, the polyether ketone ketone (PEKK) may be provided as a pure resin, diphenyl oxide (Diphenyl oxide, DPO) and 1,4-bis (4-phenoxybenzoyl) benzene ( PEKK pure resin ( neat resin).

In one embodiment of the present application, the polyether ketone ketone (PEKK) is diphenyl oxide (DPO) and 1,4-bis (4-phenoxybenzoyl) benzene (1,4-bis (4-phenoxybenzoyl) ) benzene, EKKE), phosphite in PEKK neat resin containing at least one selected from among, terephthaloyl chloride (TPC) and isophthaloyl chloride (IPC) It may further include a system compound. In this case, the phosphite-based compound may be characterized in that thermal decomposition does not occur at a temperature of 70 °C to 110 °C. In the case of most commercially available phosphites, thermal decomposition occurs at a temperature of about 70° C. or higher, or thermal loss occurs. That is, the phosphite-based compound cannot absorb the radicals generated from the PEKK polymer chain when the phosphite-based compound undergoes thermal decomposition below the processing temperature at which PEKK is processed. It may be a compound without it, and the specific temperature may be preferably 70 to 110°C. In addition, the phosphite-based compound according to the present invention may refer to an oligomer derivative having a phosphite functional group, but is not limited thereto.

In addition, according to an embodiment of the present invention, PEKK is a polymer produced by chain polymerization of terephthaloyl represented by the following chemical structure 1 and isophthaloyl represented by the following chemical structure 2, and the properties may be determined according to the ratio. . The terephthaloyl moiety is linear and rigid, and the isophthaloyl moiety gives structural diversity due to its curved structure. The isophthaloyl moiety may affect the flexibility, fluidity and crystallization properties of the polymer chain.

[Chemical structure 1]

[Chemical structure 2]

In one embodiment of the present application, the tensile strength of the polyether ketone ketone (PEKK) may be 100 Mpa or more, and the melt index (MI) may be 10 g/10min or more. That is, since the polyether ketone ketone (PEKK) has excellent tensile strength, when it is used in a housing for mobile devices, the durability of the housing can be improved, and since it has a high melt index, processing into a housing may be easier. . In addition, since the polyether ketone ketone (PEKK) has excellent adhesion to metal, it may be strongly adhered to a segment opening or a side bezel segment opening of a metal plate used as a housing material for an existing mobile device.

In one embodiment of the present application, the housing material for the mobile device may further include at least one of glass fiber and carbon material in addition to the polyether ketone ketone (PEKK). In this case, the housing material for the mobile device may be provided in the form of a composite in which a plurality of materials as described above are integrally formed. That is, the glass fiber and/or carbon material may be additionally added as described above so that the housing material including the same may have higher mechanical strength and elasticity.

In one embodiment of the present application, the carbon material may include a material selected from the group consisting of carbon fibers, carbon nanotubes, graphene, activated carbon, and combinations thereof, preferably carbon fibers may be used.

In one embodiment of the present application, the content of the glass fiber and/or carbon fiber may be 20 parts by weight to 200 parts by weight based on 100 parts by weight of polyether ketone ketone (PEKK), preferably the glass fiber and/or carbon The content of each fiber may be 10 parts by weight to 60 parts by weight based on 100 parts by weight of the entire housing material. When the content of the glass fiber and/or carbon fiber is less than 20 parts by weight compared to 100 parts by weight of polyether ketone ketone (PEKK), the content is relatively small, and high mechanical strength and elastic effect due to additional input may not be achieved, When it exceeds 200 parts by weight, the content of polyether ketone ketone (PEKK) is relatively low, so that the above-described effect unique to polyether ketone ketone may not be realized.

In one embodiment of the present application, the housing material for the mobile device may have a stress-strain curve slope of 20 or more in a strain range of 0 to 5%, preferably 20 to 25. In this case, the stress-strain curve may be measured by filming the housing material, and may be measured and derived using an Instron universal testing machine (UTM), etc. based on ASTM D 882. The stress-strain curve thus derived may be presented in the form of, for example, FIG. 3 , and referring to FIG. 3 , the housing material including polyether ketone ketone (PEKK) according to the present invention is about 20 to 25 It may have a stress-strain curve slope of . That is, through this, the housing material for the mobile device may have high toughness and excellent strength.

In one embodiment of the present application, the housing material for the mobile device may have a dielectric loss (tan δ) of 0.002 or less, preferably 0.0015 or less. In this case, the dielectric loss may be measured using an impedance analyzer (Agilent E4991B) under a measurement frequency of 1 MHz and a measurement temperature of about 23°C. That is, since the housing material for the mobile device has a low dielectric loss value as described above, data transmission/reception performance for various frequency bands of the mobile device may be improved.

In one embodiment of the present application, the housing material for the mobile device includes polyether ketone ketone or a composite of polyether ketone ketone and glass fiber and/or carbon material, so that the polyether ketone ketone has tensile strength, heat resistance, It may be to improve the durability of the housing for mobile devices through unique properties such as chemical resistance and weather resistance and excellent metal adhesion. In addition, through the low dielectric loss characteristic of polyether ketone ketone, data transmission/reception performance for various frequency bands of mobile devices may be improved, and the polyether ketone ketone has a high melt index (MI). ), so it may be easier to process.

The third aspect of the present application is

preparing the mobile device; and applying the housing material for a mobile device according to the first aspect of the present application to the rear plate segment opening or the side bezel segment opening of the mobile device.

The fourth aspect of the present application is

forming the housing material for a mobile device according to claim 1 to correspond to the rear plate segment opening or the side bezel segment opening of the mobile device; and inserting the molded housing material into the rear plate segment opening or the side bezel segment opening of the mobile device.

Although detailed descriptions of parts overlapping with the first and second aspects of the present application are omitted, the descriptions of the first and second aspects of the present application are the same even if the descriptions are omitted in the third and fourth aspects can be applied

Hereinafter, a method of manufacturing the housing for a mobile device according to the third and fourth aspects of the present application will be described in detail step by step with reference to FIGS. 1 and 2 . At this time, FIG. 1 is a flowchart schematically illustrating a method of manufacturing a housing for a mobile device according to a third aspect of the present invention, and FIG. 2 is a flowchart schematically illustrating a method of manufacturing a housing for a mobile device according to a fourth aspect of the present invention It is a flowchart.

First, a method of manufacturing the housing for a mobile device according to a third aspect of the present invention will be described in detail with reference to FIG. 1 .

In one embodiment of the present application, the method of manufacturing the housing for the mobile device may include a step of preparing the mobile device.

In one embodiment of the present application, the mobile device may mean all common mobile devices, for example, a mobile phone, a notebook computer, and the like. In this case, the rear plate or the side bezel of the mobile device may have segment openings, respectively, and the housing material for the mobile device according to the first aspect of the present application may be applied/inserted into the segment openings. Meanwhile, the rear plate or the side bezel may be made of metal.

Next, in one embodiment of the present application, the method for manufacturing the housing for a mobile device includes applying the housing material for a mobile device according to the first aspect of the present application to the rear plate segment opening or the side bezel segment opening of the mobile device. It may include ;.

In one embodiment of the present application, the housing material for the mobile device may include polyether ketone ketone or a composite of polyether ketone ketone and glass fiber and/or carbon material. Since the housing material for the mobile device has been described in detail in the first and second aspects of the present application, a detailed description thereof will be omitted. Meanwhile, in order to apply the housing material, the housing material may be melted and applied to the rear plate segment opening or the side bezel segment opening of the mobile device using a dispenser or the like. Thereafter, when a gap occurs in the applied housing material, sealing may be performed to fill the gap.

Next, in one embodiment of the present application, the method of manufacturing the housing for the mobile device may include grinding the protruding housing material.

In one embodiment of the present application, when the housing material is applied to the rear plate segment opening or the side bezel segment opening of the mobile device, a portion protruding may occur, which forms a step with the rear plate or side bezel It may adversely affect the performance and aesthetics of the mobile device. Accordingly, the step of grinding the protruding housing material to remove the generated step may be performed.

Hereinafter, a method of manufacturing the housing for a mobile device according to a fourth aspect of the present invention will be described in detail with reference to FIG. 2 .

In one embodiment of the present application, the method of manufacturing the housing for the mobile device may include a step of molding the housing material for the mobile device to correspond to the opening of the rear plate segment or the opening of the side bezel segment of the mobile device.

In one embodiment of the present application, the molding of the housing material for the mobile device is to shape the shape to match the shape of the segment opening, in other words, it may be made into parts. To this end, the molding of the housing material for the mobile device may be performed using injection molding, extrusion molding, or 3D printing, and a molding method suitable for the shape and size of the segment opening may be adopted. In this case, the extrusion molding may include a process of cutting after extrusion.

Next, in one embodiment of the present application, the method of manufacturing the housing for the mobile device may include inserting the molded housing material into the rear plate segment opening or the side bezel segment opening of the mobile device.

In one embodiment of the present application, the insertion is to insert a housing material molded to fit the size and shape of the segment opening into the opening, and a separate adhesive may be used for stronger adhesion.

On the other hand, in addition to the manufacturing method of the housing for a mobile device according to the third and fourth aspects of the present application, both the rear or side plates of the mobile device are used as the housing material for the mobile device according to the first aspect of the present application to manufacture the housing. can That is, in this case, the housing does not contain metal and may be made of only the mobile device housing material according to the first aspect of the present application. In this case, the manufacturing of the housing may be performed by molding the housing material using injection molding, extrusion molding or 3D printing, and the extrusion molding may include a process of cutting after extrusion.

Above, the present invention has been described in detail with preferred embodiments with reference to the drawings, but the scope of the technical idea of the present invention is not limited to these drawings and examples. Accordingly, various modifications or equivalent ranges of embodiments may exist within the scope of the technical spirit of the present invention. Therefore, the scope of the technical idea according to the present invention should be interpreted by the claims, and the technical idea within the equivalent or equivalent scope should be interpreted as belonging to the scope of the present invention.

As described above, the housing material for a mobile device according to the present invention contains polyether ketone ketone, and thus the polyether ketone ketone has unique properties such as tensile strength, heat resistance, chemical resistance, weather resistance, etc. and excellent metal adhesion to mobile devices. It may be to improve the durability of the housing.

In addition, the low dielectric loss characteristic of polyether ketone ketone may improve the data transmission/reception performance for various frequency bands of the mobile device.

In addition, the polyether ketone ketone may be more easily processed because it has a high melt index (MI).

Claims (13)

1. Housing material for mobile devices containing polyether ketone ketone (PEKK).
2. According to claim 1,

   The tensile strength of the polyether ketone ketone is 100 Mpa or more of a housing material for a mobile device.
3. According to claim 1,

   The housing material for the mobile device further comprises at least one of glass fiber and carbon material.
4. 4. The method of claim 3,

   The carbon material is a housing material for a mobile device comprising a material selected from the group consisting of carbon fiber, carbon nanotubes, graphene, activated carbon, and combinations thereof.
5. 4. The method of claim 3,

   The content of the material is 20 parts by weight to 200 parts by weight based on 100 parts by weight of polyether ketone ketone housing material for a mobile device.
6. According to claim 1,

   The housing material for the mobile device is a stress-strain curve in the range of 0 to 5% strain in the range of 20 or more.
7. According to claim 1,

   The housing material for the mobile device is a stress-strain curve in the range of 0 to 5% strain in a range of 20 to 25. The housing material for a mobile device.
8. The method of claim 1,

   The mobile device housing material has a dielectric loss (tan δ) of 0.002 or less.
9. [Claim 1] A housing for a mobile device made of a housing material for the mobile device.
10. preparing the mobile device; and

    applying the housing material for a mobile device according to claim 1 to the rear plate segment opening or the side bezel segment opening of the mobile device;

    A method of manufacturing a housing for a mobile device comprising a.
11. 11. The method of claim 10,

    The manufacturing method of the housing for the mobile device,

    applying the housing material; Since the,

    Polishing the protruding housing material; manufacturing method of a housing for a mobile device further comprising a.
12. forming the housing material for a mobile device according to claim 1 to correspond to the rear plate segment opening or the side bezel segment opening of the mobile device; and

    inserting the molded housing material into a rear plate segment opening or a side bezel segment opening of a mobile device;

    A method of manufacturing a housing for a mobile device comprising a.
13. 13. The method of claim 12,

    The method of manufacturing a housing for a mobile device, wherein the molding of the housing material for the mobile device is performed using injection molding, extrusion molding, or 3D printing.

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