WO2022122536A1 - Printed circuit board for electronic circuits - Google Patents

Printed circuit board for electronic circuits Download PDF

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Publication number
WO2022122536A1
WO2022122536A1 PCT/EP2021/083935 EP2021083935W WO2022122536A1 WO 2022122536 A1 WO2022122536 A1 WO 2022122536A1 EP 2021083935 W EP2021083935 W EP 2021083935W WO 2022122536 A1 WO2022122536 A1 WO 2022122536A1
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WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
electronic components
conductor tracks
circuit boards
Prior art date
Application number
PCT/EP2021/083935
Other languages
German (de)
French (fr)
Inventor
Matthias Grimm
Original Assignee
Zf Cv Systems Global Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zf Cv Systems Global Gmbh filed Critical Zf Cv Systems Global Gmbh
Publication of WO2022122536A1 publication Critical patent/WO2022122536A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0275—Security details, e.g. tampering prevention or detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Definitions

  • the invention relates to a printed circuit board, which consists of several printed circuit boards provided with conductor tracks and arranged in layers one above the other and glued or fused to one another, and which is equipped with active and/or passive electronic components, with certain conductor tracks and electronic components at least one being protected against manipulation and/or or form a copy-sensitive circuit for controlling a function.
  • Electronic control units of vehicles such as on-highway vehicles, off-road vehicles and rail vehicles, are exposed to harsh operating conditions such as vibration, shock and shock, temperature fluctuations and exposure to spray water, oil and dirt.
  • a single electronic control unit can be used, which performs several control functions and is arranged at a central point of the vehicle.
  • such a control device advantageously has a multilayer printed circuit board, which has a plurality of printed circuit boards arranged in layers one above the other and provided with conductor tracks.
  • the printed circuit boards usually consist of a hardened, fiber-reinforced phenolic resin or epoxy resin, to which the conductor tracks made of copper are applied galvanically or glued on as a foil and etched free in a photochemical process.
  • prepregs the printed circuit boards, which are not fully cured at first, have been bonded or fused to one another by pressing after they have been stacked.
  • Such a printed circuit board has a plurality of circuits each assigned to a control function, which circuits can each extend over a plurality of conductor tracks on adjacent printed circuit boards.
  • the circuits have passive electronic components such as resistors, capacitors and inductors as well as active electronic components such as transistors, microphones roprocessors and memory modules (EPROMs).
  • the electronic components are arranged at least on an outside of the printed circuit board and are electrically connected to the associated conductor tracks via through-contacts.
  • a typical structure of a multi-layer printed circuit board is known, for example, from DE 103 15 768 A
  • Control functions are implemented with certain circuits made up of conductor tracks and electronic components, which, for example control functions of combustion engines relevant to exhaust emissions, should not be manipulable or should not be copyable due to manufacturer-specific know-how.
  • Control functions can be manipulated, for example, by exchanging control parameters that are stored in electronic memory modules, or by exchanging entire electronic memory modules with control parameters stored therein. Copying control functions can be done by examining and analyzing the circuits involved.
  • printed circuit boards can be provided with a protective layer as access protection, by means of which the external conductor tracks and electronic components can be protected against mechanical damage and contact with electrically conductive liquids as well as against unauthorized access.
  • electronic control devices with various protective devices against unauthorized access to printed circuit boards have already been proposed.
  • DE 691 09 464 T2 describes a method for protective coating of a multi-layer printed circuit board fitted with electronic components, in which a thicker first layer of an organic material, such as an epoxy resin, is applied to the printed circuit board and the electronic components , and after it has cured, a thinner, hermetically sealed second layer of a mineral material, such as a metal compound, is applied.
  • a thicker first layer of an organic material such as an epoxy resin
  • a thinner, hermetically sealed second layer of a mineral material such as a metal compound
  • DE 10 2008 057 887 A1 discloses a cryptographic electronic module with access protection to a multi-layer printed circuit board, in which the access protection is formed from a plurality of meandering conductor tracks.
  • the conductor tracks are arranged on one or both sides and partially offset and overlapping on adjacent printed circuit boards and are electrically connected to one another at certain points using a conductive adhesive.
  • some conductor tracks are interrupted or come into contact with other conductor tracks or with electrical ground, which can be determined by inspection.
  • DE 10 2010 048 036 A1 describes a printed circuit board with copy protection, which consists of a layered protective element, which is located between two electrical wiring lines on at least one wiring level of the printed circuit board.
  • the protective element is designed as an electrical resistor and is not visually recognizable.
  • the invention is based on the object of presenting a multi-layer printed circuit board in which the conductor tracks there and the electronic components arranged thereon of at least one circuit requiring protection are protected more easily and more cost-effectively against manipulation and /or copying are protected. This problem is solved by a circuit board with the features of claim 1.
  • the invention accordingly relates to a multi-layer printed circuit board, which consists of a plurality of printed circuit boards provided with conductor tracks and arranged in layers one above the other and glued or fused to one another, and which is equipped with active and/or passive electronic components. Certain conductor tracks and electronic components form at least one circuit that needs to be protected against manipulation and/or copying to control a function.
  • the conductor tracks of the at least one circuit requiring protection are arranged on printed circuit boards located within the printed circuit board, and that the electronic components assigned to this at least one circuit are embedded within the printed circuit board between the internal printed circuit boards.
  • Such a multi-layer printed circuit board can be a component of an electronic control unit for a vehicle, which is provided for controlling at least one function of the vehicle.
  • the arrangement of the conductor tracks on the internal printed circuit boards of the multi-layer printed circuit board and the embedding of the electronic components within the printed circuit board between the internal printed circuit boards protects the at least one circuit requiring protection against manipulation and copying in a comparatively simple and cost-effective manner, since the printed circuit board can only be opened by force and would be destroyed in the process.
  • SMD surface mounted device
  • the recesses just mentioned in the immediately adjacent additional printed circuit board can be filled with enclosed ambient air.
  • the recesses in the immediately adjacent additional printed circuit board can also be filled with a cast resin or with another electrically insulating material.
  • the conductor tracks of the at least one circuit requiring protection are arranged on adjacent printed circuit boards, and that at least two conductor tracks arranged on the adjacent printed circuit boards are electrically connected to one another via a buried via and thus cannot be reached from the outside to protect against external influences.
  • FIG. 1 shows a first embodiment of a circuit board having the features of the invention in a schematic sectional view
  • FIG. 2 shows a second embodiment of a circuit board according to the invention, also in a schematic sectional view.
  • the printed circuit board 2 has a multi-layer structure and has a total of five printed circuit boards 4, 8, 12, 16, 20, each of which consist of a hardened fiber-reinforced phenolic resin or epoxy resin and are arranged in layers on top of one another and fused to one another.
  • the first, upper circuit board 4 is provided on its outside with four conductor tracks 6a, 6b, 6c, 6d.
  • the bottom, third printed circuit board 12 has three conductor tracks 14a, 14b, 14c on its outside.
  • the fourth printed circuit board 16, which is immediately adjacent to this and lies above it, has four conductor tracks 18a, 18b, 18c, 18d on its inside.
  • the middle or fifth printed circuit board 20 arranged between the two inner printed circuit boards 8, 16 has no conductor track, at least in the section shown in FIG.
  • the two conductor tracks 10a, 18a of the two internal printed circuit boards 8, 16 are electrically connected to one another via a buried via 22 and are therefore inaccessible from the outside.
  • the conductor tracks 6d, 10d, 14c, 18d of the two outer printed circuit boards 4, 8 and inner printed circuit boards 4, 8, 12, 16 are electrically connected to one another via an open via 24 and are therefore accessible from the outside.
  • Two electronic components 26, 28 designed as SMD components are arranged on the inside of the fourth printed circuit board 16, which is provided with the conductor tracks 18a, 18b, 18c, 18d.
  • the first electronic component 26 is electrically connected via soldered connections to the two conductor tracks 18a, 18b of the fourth printed circuit board 16 lying below and on the inside.
  • the second electronic component 28 is electrically connected via soldered connections to the other two conductor tracks 18c, 18d of this fourth printed circuit board 16 lying below and on the inside.
  • the middle, fifth printed circuit board 20 has two recesses 30, 32 which are designed and arranged in such a way that the two electronic components 26, 28 mentioned protrude into them without making contact.
  • the two recesses 30, 32 of the middle, fifth Circuit board 20 filled with trapped ambient air.
  • the two recesses 30, 32 may have been filled with the synthetic resin used during the layered construction of the printed circuit board 2.
  • At least the conductor tracks 10a, 18a-18d of the inner second and fourth circuit boards 8, 16 and the electronic components 26, 28 form a circuit for controlling a function of a vehicle that needs to be protected against manipulation and/or copying.
  • the arrangement of the conductor tracks 10a, 18a - 18d on the inner second and fourth printed circuit boards 8, 16 and the embedding of the electronic components 26, 28 within the printed circuit board 2 between these two printed circuit boards 8, 16 protects the circuit in a simple and cost-effective manner protected against manipulation and against copying, since the circuit board 2 can only be opened by force and would be destroyed.
  • the second embodiment of the circuit board 2' according to the invention shown in Fig. 2 in a detail of a schematic sectional view differs from the circuit board 2 according to Fig. 1 only in that the recesses 30, 32 in the middle, fifth circuit board 20 after completion of the layered structure the circuit board 2 'and the curing of the same with a casting resin 42 have been expired.
  • a filling bore 34, 38 and a vent bore 36, 40 are arranged in the two upper two printed circuit boards, i.e. the first printed circuit board 4 and the second printed circuit board 8, which lead into the recesses 30, 32 and via which the casting resin 42 can be filled in each case and the air previously present there can escape.
  • Multilayer Printed Circuit Board (First Embodiment)' Multilayer Printed Circuit Board (Second Embodiment)
  • Second circuit board 0a - 10d Traces on circuit board 8 2
  • Third circuit board 4a - 14c Traces on circuit board 12
  • Fourth circuit board 8a - 18d Traces on circuit board 16 0
  • First electronic component 8 Second electronic component 0 first recess 2 second recess 4 first filling hole 6
  • first ventilation hole 8 second filling hole 0 second ventilation hole 2 casting resin

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  • Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a printed circuit board (2) that consists of a plurality of circuit boards (4, 8, 12, 16, 20), which are provided with conductor paths (6a – 6d, 10a – 10d, 14a – 14c, 18a – 18d) and which are arranged one over the other in layers and are adhered or melted together, and the printed circuit board is populated with active and/or passive electronic components (26, 28). Certain conductor paths (10a, 18a, 18b, 18c, 18d) and electronic components (26, 28) form at least one circuit, which requires protection against manipulation and/or copying, for controlling a function. According to the invention, in the printed circuit board (2), the conductor paths (10a, 18a, 18b, 18c, 18d) of the at least one circuit which requires protection are arranged on circuit boards (8, 16) within the printed circuit board (2, 2'), and the electronic components (26, 28) paired with the at least one circuit are integrated within the printed circuit board (2, 2') between the inner circuit boards (8, 16). In this manner, the circuit which requires protection is protected against manipulation and copying in an inexpensive manner because the printed circuit board (2) can only be opened forcibly and would be destroyed in the process.

Description

Leiterplatte für elektronische Schaltungen Circuit board for electronic circuits
Beschreibung description
Die Erfindung betrifft eine Leiterplatte, welche aus mehreren mit Leiterbahnen versehenen und schichtförmig übereinander angeordneten sowie miteinander verklebten oder verschmolzenen Leiterplatinen besteht, und welche mit aktiven und/oder passiven elektronischen Bauteilen bestückt ist, wobei bestimmte Leiterbahnen und elektronische Bauteile zumindest einen gegen eine Manipulation und/oder ein Kopieren schutzbedürftigen Schaltkreis zur Steuerung einer Funktion bilden. The invention relates to a printed circuit board, which consists of several printed circuit boards provided with conductor tracks and arranged in layers one above the other and glued or fused to one another, and which is equipped with active and/or passive electronic components, with certain conductor tracks and electronic components at least one being protected against manipulation and/or or form a copy-sensitive circuit for controlling a function.
Elektronische Steuergeräte von Fahrzeugen, wie Straßenfahrzeuge, Geländefahrzeuge und Schienenfahrzeuge, sind harten Betriebsbedingungen, wie Schwingungen, Stößen und Erschütterungen, Temperaturschwankungen sowie der Beaufschlagung mit Spritzwasser, Öl und Schmutz ausgesetzt. Zur Vermeidung der Anordnung mehrerer, jeweils für die Steuerung unterschiedlicher Funktionen vorgesehener und an verschiedenen Stellen des Fahrzeugs angeordneter Steuergeräte kann ein einziges elektronisches Steuergerät genutzt werden, welches mehrere Steuerungsfunktionen ausführen und an einer zentralen Stelle des Fahrzeugs angeordnet ist. Zur Erzielung kompakter Abmessungen weist ein derartiges Steuergerät vorteilhaft eine mehrlagige Leiterplatte auf, welche mehrere schichtförmig übereinander angeordnete, mit Leiterbahnen versehene Leiterplatinen aufweist. Die Leiterplatinen bestehen üblicherweise aus einem ausgehärteten faserverstärkten Phenolharz oder Epoxidharz, auf welche die aus Kupfer bestehenden Leiterbahnen galvanisch aufgetragen oder als Folie aufgeklebt und in einem photochemischen Prozess freigeätzt sind. Die als sogenannte Prepregs zunächst nicht vollständig ausgehärteten Leiterplatinen sind nach dem Aufschichten durch Verpressen miteinander verklebt oder verschmolzen worden. Eine derartige Leiterplatte weist mehrere, jeweils einer Steuerungsfunktion zugeordnete Schaltkreise auf, welche sich jeweils über mehrere Leiterbahnen auf benachbarten Leiterplatinen erstrecken können. Die Schaltkreise weisen passive elektronische Bauteile, wie Widerstände, Kondensatoren und Spulen sowie aktive elektronische Bauteile, wie Transistoren, Mik- roprozessoren und Speicherbausteine (EPROMs) auf. Die elektronischen Bauteile sind zumindest an einer Außenseite der Leiterplatte angeordnet und über Durchkontaktierungen mit den zugeordneten Leiterbahnen elektrisch verbunden. Ein typischer Aufbau einer mehrlagigen Leiterplatte ist beispielsweise aus der DE 103 15 768 A1 bekannt. Electronic control units of vehicles, such as on-highway vehicles, off-road vehicles and rail vehicles, are exposed to harsh operating conditions such as vibration, shock and shock, temperature fluctuations and exposure to spray water, oil and dirt. In order to avoid the arrangement of several control units, each provided for controlling different functions and arranged at different points of the vehicle, a single electronic control unit can be used, which performs several control functions and is arranged at a central point of the vehicle. In order to achieve compact dimensions, such a control device advantageously has a multilayer printed circuit board, which has a plurality of printed circuit boards arranged in layers one above the other and provided with conductor tracks. The printed circuit boards usually consist of a hardened, fiber-reinforced phenolic resin or epoxy resin, to which the conductor tracks made of copper are applied galvanically or glued on as a foil and etched free in a photochemical process. As so-called prepregs, the printed circuit boards, which are not fully cured at first, have been bonded or fused to one another by pressing after they have been stacked. Such a printed circuit board has a plurality of circuits each assigned to a control function, which circuits can each extend over a plurality of conductor tracks on adjacent printed circuit boards. The circuits have passive electronic components such as resistors, capacitors and inductors as well as active electronic components such as transistors, microphones roprocessors and memory modules (EPROMs). The electronic components are arranged at least on an outside of the printed circuit board and are electrically connected to the associated conductor tracks via through-contacts. A typical structure of a multi-layer printed circuit board is known, for example, from DE 103 15 768 A1.
Mit bestimmten, aus Leiterbahnen und elektronischen Bauteilen gebildeten Schaltkreisen sind Steuerungsfunktionen realisiert, die, wie zum Beispiel abgasrelevante Steuerungsfunktionen von Verbrennungsmotoren, nicht manipulierbar oder aufgrund von herstellerspezifischem Know-How nicht kopierbar sein sollten. Eine Manipulation von Steuerungsfunktionen kann beispielsweise durch den Austausch von Steuerungsparametern, die in elektronischen Speicherbausteinen abgespeichert sind, oder durch den Austausch ganzer elektronischer Speicherbausteine mit darin abgespeicherten Steuerungsparametern erfolgen. Das Kopieren von Steuerungsfunktionen kann durch eine Untersuchung und Analyse der betreffenden Schaltkreise erfolgen. Control functions are implemented with certain circuits made up of conductor tracks and electronic components, which, for example control functions of combustion engines relevant to exhaust emissions, should not be manipulable or should not be copyable due to manufacturer-specific know-how. Control functions can be manipulated, for example, by exchanging control parameters that are stored in electronic memory modules, or by exchanging entire electronic memory modules with control parameters stored therein. Copying control functions can be done by examining and analyzing the circuits involved.
Als Zugriffschutz können Leiterplatten bekanntlich mit einer Schutzschicht versehen sein, durch welche die außenliegenden Leiterbahnen und elektronischen Bauteile vor einer mechanischen Beschädigung und dem Kontakt mit elektrisch leitenden Flüssigkeiten sowie vor einem unbefugten Zugriff geschützt werden können. Zudem sind bereits elektronische Steuergeräte mit verschiedenen Schutzvorrichtungen gegen einen unbefugten Zugriff auf Leiterplatten vorgeschlagen worden. As is known, printed circuit boards can be provided with a protective layer as access protection, by means of which the external conductor tracks and electronic components can be protected against mechanical damage and contact with electrically conductive liquids as well as against unauthorized access. In addition, electronic control devices with various protective devices against unauthorized access to printed circuit boards have already been proposed.
So ist in der DE 691 09 464 T2 ein Verfahren zur Schutzbeschichtung einer mehrlagigen, mit elektronischen Bauteilen bestückten Leiterplatte beschrieben, bei dem zunächst eine dickere erste Schicht aus einem organischen Material, wie zum Beispiel einem Epoxidharz, auf die Leiterplatte und die elektronischen Bauteile aufgetragen wird, und nach deren Aushärtung eine dünnere, hermetisch abgeschlossene zweite Schicht aus einem mineralischen Material, wie beispielsweise einer Metallverbindung, aufgebracht wird. Mit der ersten Schicht werden Ecken und Kanten der elektronischen Bauteile geglättet und die auf den äußeren Leiterplatinen befindlichen Leiterbahnen sowie elektronischen Bauteile vor einer mechanischen Beschädigung geschützt. Mit der zweiten Schicht werden die Leiterbahnen und die elektronischen Bauteile hermetisch gegen Kontakte mit äußeren, elektrisch leitfähigen Stoffen abgeschirmt. For example, DE 691 09 464 T2 describes a method for protective coating of a multi-layer printed circuit board fitted with electronic components, in which a thicker first layer of an organic material, such as an epoxy resin, is applied to the printed circuit board and the electronic components , and after it has cured, a thinner, hermetically sealed second layer of a mineral material, such as a metal compound, is applied. The corners and edges of the electronic components are smoothed with the first layer and the conductor tracks on the outer printed circuit boards and electronic components are protected from mechanical damage. With In the second layer, the conductor tracks and the electronic components are hermetically shielded against contact with external, electrically conductive materials.
Aus der DE 10 2008 057 887 A1 ein kryptografisches elektronisches Modul mit einem Zugriffschutz auf eine mehrlagige Leiterplatte bekannt, bei dem der Zugriffschutz aus mehreren mäanderförmig geführten Leiterbahnen gebildet ist. Die Leiterbahnen sind einseitig oder beidseitig sowie teilweise versetzt und überlappend auf benachbarten Leiterplatinen angeordnet sowie an bestimmten Stellen über einen leitfähigen Kleber elektrisch miteinander verbunden. Bei einem unbefugten Zugriff auf die Leiterplatte werden einige Leiterbahnen unterbrochen oder geraten in Kontakt mit anderen Leiterbahnen oder mit elektrischer Masse, welches jeweils bei einer Überprüfung feststellbar ist. DE 10 2008 057 887 A1 discloses a cryptographic electronic module with access protection to a multi-layer printed circuit board, in which the access protection is formed from a plurality of meandering conductor tracks. The conductor tracks are arranged on one or both sides and partially offset and overlapping on adjacent printed circuit boards and are electrically connected to one another at certain points using a conductive adhesive. In the event of unauthorized access to the printed circuit board, some conductor tracks are interrupted or come into contact with other conductor tracks or with electrical ground, which can be determined by inspection.
In der DE 10 2010 048 036 A1 ist eine Leiterplatte mit einem Kopierschutz beschrieben, der aus einem schichtartigen Schutzelement besteht, welches zwischen zwei elektrischen Verdrahtungsleitungen auf zumindest einer Verdrahtungsebene der Leiterplatte besteht. Das Schutzelement ist als ein elektrischer Widerstand ausgebildet und optisch nicht erkennbar. DE 10 2010 048 036 A1 describes a printed circuit board with copy protection, which consists of a layered protective element, which is located between two electrical wiring lines on at least one wiring level of the printed circuit board. The protective element is designed as an electrical resistor and is not visually recognizable.
Außerdem ist aus der Druckschrift „Design Guide Embedding Technologie“, Version 2.0, Feb. 2017 der Firma Würth Elektronik GmbH & Co. KG eine mehrlagige und mit elektronischen Bauteilen bestückte Leiterplatte bekannt geworden, wobei die Bauteile und Leiterbahnen innerhalb der Leiterplatte angeordnet sind. In addition, a multi-layer printed circuit board equipped with electronic components has become known from the publication "Design Guide Embedding Technologie", version 2.0, Feb. 2017, from the company Würth Elektronik GmbH & Co. KG, with the components and conductor tracks being arranged within the printed circuit board.
Angesichts des relativ hohen Aufwands zur Erzeugung der bekannten Zugriffschutzkonstruktionen an einer Leiterplatte für elektronische Schaltungen liegt der Erfindung die Aufgabe zugrunde, eine mehrlagige Leiterplatte vorzustellen, bei welcher die dortigen Leiterbahnen und die daran angeordneten elektronischen Bauteile zumindest eines schutzbedürftigen Schaltkreises einfacher sowie kostengünstiger gegen eine Manipulation und/oder ein Kopieren geschützt sind. Diese Aufgabe ist durch eine Leiterplatte mit den Merkmalen des Anspruchs 1 gelöst.In view of the relatively high cost of producing the known access protection constructions on a printed circuit board for electronic circuits, the invention is based on the object of presenting a multi-layer printed circuit board in which the conductor tracks there and the electronic components arranged thereon of at least one circuit requiring protection are protected more easily and more cost-effectively against manipulation and /or copying are protected. This problem is solved by a circuit board with the features of claim 1.
Vorteilhafte Weiterbildungen sind in den abhängigen Ansprüchen definiert. Advantageous developments are defined in the dependent claims.
Die Erfindung betrifft demnach eine mehrlagige Leiterplatte, welche aus mehreren mit Leiterbahnen versehenen und schichtförmig übereinander angeordneten sowie miteinander verklebten oder verschmolzenen Leiterplatinen besteht, und welche mit aktiven und/oder passiven elektronischen Bauteilen bestückt ist. Bestimmte Leiterbahnen und elektronische Bauteile bilden zumindest einen gegen eine Manipulation und/oder ein Kopieren schutzbedürftigen Schaltkreis zur Steuerung einer Funktion. The invention accordingly relates to a multi-layer printed circuit board, which consists of a plurality of printed circuit boards provided with conductor tracks and arranged in layers one above the other and glued or fused to one another, and which is equipped with active and/or passive electronic components. Certain conductor tracks and electronic components form at least one circuit that needs to be protected against manipulation and/or copying to control a function.
Zur Lösung der gestellten Aufgabe ist vorgesehen, dass die Leiterbahnen des mindestens einen schutzbedürftigen Schaltkreises auf innerhalb der Leiterplatte liegenden Leiterplatinen angeordnet sind, und dass die diesem mindestens einem Schaltkreis zugeordneten elektronischen Bauteile innerhalb der Leiterplatte zwischen den innen liegenden Leiterplatinen eingebettet sind. In order to solve the task at hand, it is provided that the conductor tracks of the at least one circuit requiring protection are arranged on printed circuit boards located within the printed circuit board, and that the electronic components assigned to this at least one circuit are embedded within the printed circuit board between the internal printed circuit boards.
Eine solche mehrlagige Leiterplatte kann ein Bestandteil eines elektronischen Steuergeräts für ein Fahrzeug sein, welches zur Steuerung zumindest einer Funktion des Fahrzeugs vorgesehen ist. Such a multi-layer printed circuit board can be a component of an electronic control unit for a vehicle, which is provided for controlling at least one function of the vehicle.
Durch die Anordnung der Leiterbahnen auf den innen liegenden Leiterplatinen der mehrlagigen Leiterplatte und die Einbettung der elektronischen Bauteile innerhalb der Leiterplatte zwischen den innen liegenden Leiterplatinen ist der mindestens eine schutzbedürftige Schaltkreis auf vergleichsweise einfache und kostengünstige Weise gegen eine Manipulation sowie ein Kopieren geschützt, da die Leiterplatte nur gewaltsam geöffnet werden kann und dabei zerstört würde. The arrangement of the conductor tracks on the internal printed circuit boards of the multi-layer printed circuit board and the embedding of the electronic components within the printed circuit board between the internal printed circuit boards protects the at least one circuit requiring protection against manipulation and copying in a comparatively simple and cost-effective manner, since the printed circuit board can only be opened by force and would be destroyed in the process.
Zur platzsparenden und optimal geschützten Anordnung sind die elektronischen Bauteile als SMD-Bauteile (SMD = surface mounted device) ausgebildet sowie auf mindestens einer der innen liegenden Leiterplatinen auf ihrer mit Leiterbahnen versehenen Innenseite angeordnet. Hierbei kann vorgesehen sein, dass eine bestückungsseitig unmittelbar benachbart zu der mit den elektronischen Bauteilen bestückten Leiterplatine angeordnete weitere Leiterplatine Ausnehmungen aufweist, wobei diese Ausnehmungen derart ausgebildet und angeordnet sind, dass die elektronischen Bauteile berührungslos in diese hineinragen. For a space-saving and optimally protected arrangement, the electronic components are in the form of SMD components (SMD=surface mounted device) and are arranged on at least one of the printed circuit boards located on the inside, which is provided with conductor tracks. Provision can be made here for a further printed circuit board which is arranged immediately adjacent to the printed circuit board fitted with the electronic components on the assembly side to have recesses, these recesses being designed and arranged in such a way that the electronic components project into them without making contact.
Die gerade genannten Ausnehmungen in der unmittelbar benachbarten weiteren Leiterplatine können mit eingeschlossener Umgebungsluft gefüllt sein. The recesses just mentioned in the immediately adjacent additional printed circuit board can be filled with enclosed ambient air.
Zur Vermeidung von temperaturabhängigen und außendruckabhängigen Druckschwankungen sowie zur Vermeidung einer dortigen Kondensation von Luftfeuchtigkeit können die Ausnehmungen in der unmittelbar benachbarten weiteren Leiterplatine jedoch auch mit einem Gießharz oder mit einem anderen elektrisch isolierenden Material verfällt sein. However, to avoid temperature-dependent and external pressure-dependent pressure fluctuations and to avoid condensation of atmospheric moisture there, the recesses in the immediately adjacent additional printed circuit board can also be filled with a cast resin or with another electrically insulating material.
Schließlich kann vorgesehen sein, dass die Leiterbahnen des mindestens einen schutzbedürftigen Schaltkreises auf benachbarten Leiterplatinen angeordnet sind, und dass zumindest zwei auf den benachbarten Leiterplatinen angeordnete Leiterbahnen zum Schutz vor äußeren Einflüssen über eine vergrabene Durchkontaktierung und somit von außen nicht erreichbar elektrisch miteinander verbunden sind. Finally, it can be provided that the conductor tracks of the at least one circuit requiring protection are arranged on adjacent printed circuit boards, and that at least two conductor tracks arranged on the adjacent printed circuit boards are electrically connected to one another via a buried via and thus cannot be reached from the outside to protect against external influences.
Zur weiteren Verdeutlichung der Erfindung ist der Beschreibung eine Zeichnung mit zwei Ausführungsbeispielen beigefügt. In dieser zeigt To further clarify the invention, the description is accompanied by a drawing with two exemplary embodiments. In this shows
Fig. 1 eine erste Ausführungsform einer die Merkmale der Erfindung aufweisende Leiterplatte in einer schematischen Schnittansicht, und 1 shows a first embodiment of a circuit board having the features of the invention in a schematic sectional view, and
Fig. 2 eine zweite Ausführungsform einer erfindungsgemäßen Leiterplatte, ebenfalls in einer schematischen Schnittansicht. 2 shows a second embodiment of a circuit board according to the invention, also in a schematic sectional view.
In Fig. 1 ist demnach eine erste Ausführungsform einer erfindungsgemäßen Leiterplatte 2 in einer schematischen Schnittansicht abgebildet. Die Leiterplatte 2 ist mehrlagig aufgebaut und weist insgesamt fünf Leiterplatinen 4, 8, 12, 16, 20 auf, welche jeweils aus einem ausgehärteten faserverstärkten Phenolharz oder Epoxidharz bestehen und schichtförmig übereinander angeordnet sowie miteinander verschmolzen sind. 1 accordingly shows a first embodiment of a printed circuit board 2 according to the invention in a schematic sectional view. The printed circuit board 2 has a multi-layer structure and has a total of five printed circuit boards 4, 8, 12, 16, 20, each of which consist of a hardened fiber-reinforced phenolic resin or epoxy resin and are arranged in layers on top of one another and fused to one another.
Die erste, obere Leiterplatine 4 ist auf ihrer Außenseite mit vier Leiterbahnen 6a, 6b, 6c, 6d versehen. Die hierzu unmittelbar benachbarte, darunter angeordnete zweite Leiterplatine 8 weist auf ihrer Außenseite ebenfalls vier Leiterbahnen 10a, 10b, 10c, 10d auf. Die unterste, dritte Leiterplatine 12 weist auf ihrer Außenseite drei Leiterbahnen 14a, 14b, 14c auf. Die hierzu unmittelbar benachbarte, darüber liegende vierte Leiterplatine 16 trägt auf ihrer Innenseite vier Leiterbahnen 18a, 18b, 18c, 18d. Die zwischen den beiden innen liegenden Leiterplatinen 8, 16 angeordnete mittlere beziehungsweise fünfte Leiterplatine 20 weist zumindest in dem in Fig. 1 abgebildeten Abschnitt keine Leiterbahn auf. The first, upper circuit board 4 is provided on its outside with four conductor tracks 6a, 6b, 6c, 6d. The second circuit board 8, which is immediately adjacent to this and is arranged underneath, also has four conductor tracks 10a, 10b, 10c, 10d on its outside. The bottom, third printed circuit board 12 has three conductor tracks 14a, 14b, 14c on its outside. The fourth printed circuit board 16, which is immediately adjacent to this and lies above it, has four conductor tracks 18a, 18b, 18c, 18d on its inside. The middle or fifth printed circuit board 20 arranged between the two inner printed circuit boards 8, 16 has no conductor track, at least in the section shown in FIG.
Die beiden Leiterbahnen 10a, 18a der beiden innen liegenden Leiterplatinen 8, 16 sind über eine vergrabene Durchkontaktierung 22 und somit von außen unerreichbar elektrisch miteinander verbunden. Dagegen sind die Leiterbahnen 6d, 10d, 14c, 18d der beiden äußeren Leiterplatinen 4, 8 sowie innen liegenden Leiterplatinen 4, 8, 12, 16 über eine offene Durchkontaktierung 24 und damit von außen erreichbar elektrisch miteinander verbunden. The two conductor tracks 10a, 18a of the two internal printed circuit boards 8, 16 are electrically connected to one another via a buried via 22 and are therefore inaccessible from the outside. In contrast, the conductor tracks 6d, 10d, 14c, 18d of the two outer printed circuit boards 4, 8 and inner printed circuit boards 4, 8, 12, 16 are electrically connected to one another via an open via 24 and are therefore accessible from the outside.
Auf der mit den Leiterbahnen 18a, 18b, 18c, 18d versehenen Innenseite der unten sowie innen liegenden vierten Leiterplatine 16 sind zwei als SMD-Bauteile ausgebildete elektronische Bauteile 26, 28 angeordnet. Das erste elektronische Bauteil 26 ist über Lötverbindungen mit den beiden Leiterbahnen 18a, 18b der unten und innen liegenden vierten Leiterplatine 16 elektrisch verbunden. Das zweite elektronische Bauteil 28 ist über Lötverbindungen mit den beiden anderen Leiterbahnen 18c, 18d dieser unten und innen liegenden vierten Leiterplatine 16 elektrisch verbunden. Two electronic components 26, 28 designed as SMD components are arranged on the inside of the fourth printed circuit board 16, which is provided with the conductor tracks 18a, 18b, 18c, 18d. The first electronic component 26 is electrically connected via soldered connections to the two conductor tracks 18a, 18b of the fourth printed circuit board 16 lying below and on the inside. The second electronic component 28 is electrically connected via soldered connections to the other two conductor tracks 18c, 18d of this fourth printed circuit board 16 lying below and on the inside.
Die mittlere, fünfte Leiterplatine 20 weist zwei Ausnehmungen 30, 32 auf, die derart ausgebildet und angeordnet sind, dass die beiden erwähnten elektronischen Bauteile 26, 28 berührungslos in diese hineinragen. In dem in Fig. 1 dargestellten Ausführungsbeispiel der Leiterplatte 2 sind die beiden Ausnehmungen 30, 32 der mittleren, fünften Leiterplatine 20 mit eingeschlossener Umgebungsluft gefüllt. Die beiden Ausnehmungen 30, 32 können alternativ dazu während des schichtweisen Aufbaues der Leiterplatte 2 mit dem verwendeten Kunstharz verfällt worden sein. The middle, fifth printed circuit board 20 has two recesses 30, 32 which are designed and arranged in such a way that the two electronic components 26, 28 mentioned protrude into them without making contact. In the embodiment of the circuit board 2 shown in FIG. 1, the two recesses 30, 32 of the middle, fifth Circuit board 20 filled with trapped ambient air. Alternatively, the two recesses 30, 32 may have been filled with the synthetic resin used during the layered construction of the printed circuit board 2.
Zumindest die Leiterbahnen 10a, 18a - 18d der innen liegenden zweiten und vierten Leiterplatine 8, 16 sowie die elektronischen Bauteile 26, 28 bilden einen gegen eine Manipulation und/oder ein Kopieren schutzbedürftigen Schaltkreis zur Steuerung einer Funktion eines Fahrzeugs. Durch die Anordnung der Leiterbahnen 10a, 18a - 18d auf den innen liegenden zweiten und vierten Leiterplatine 8, 16 sowie die Einbettung der elektronischen Bauteile 26, 28 innerhalb der Leiterplatte 2 zwischen diesen beiden Leiterplatinen 8, 16 ist der schutzbedürftige Schaltkreis auf einfache und kostengünstige Weise gegen eine Manipulation sowie gegen ein Kopieren geschützt, da die Leiterplatte 2 nur gewaltsam geöffnet werden kann und dabei zerstört würde. At least the conductor tracks 10a, 18a-18d of the inner second and fourth circuit boards 8, 16 and the electronic components 26, 28 form a circuit for controlling a function of a vehicle that needs to be protected against manipulation and/or copying. The arrangement of the conductor tracks 10a, 18a - 18d on the inner second and fourth printed circuit boards 8, 16 and the embedding of the electronic components 26, 28 within the printed circuit board 2 between these two printed circuit boards 8, 16 protects the circuit in a simple and cost-effective manner protected against manipulation and against copying, since the circuit board 2 can only be opened by force and would be destroyed.
Die in Fig. 2 in einem Ausschnitt einer schematischen Schnittansicht abgebildete zweite Ausführungsform der erfindungsgemäßen Leiterplatte 2’ unterscheidet sich von der Leiterplatte 2 gemäß Fig. 1 nur dadurch, dass die Ausnehmungen 30, 32 in der mittleren, fünften Leiterplatine 20 nach Abschluss des schichtweisen Aufbaus der Leiterplatte 2‘ sowie dem Aushärten derselben mit einem Gießharz 42 verfällt worden sind. Um dies zu ermöglichen ist in den beiden oberen beiden Leiterplatinen, also der ersten Leiterplatine 4 und der zweiten Leiterplatine 8, jeweils eine Einfüllbohrung 34, 38 und jeweils eine Entlüftungsbohrung 36, 40 angeordnet, welche in die Ausnehmungen 30, 32 führen, und über welche das Gießharz 42 jeweils eingefüllt werden kann sowie die dort zuvor vorhandene Luft entweichen kann. Durch die Verfüllung mit dem Gießharz 42 werden temperaturabhängige und außendruckabhängige Druckschwankungen sowie die Kondensation von Luftfeuchtigkeit in den Ausnehmungen 30, 32 vermieden. Bezugszeichenliste (Teil der Beschreibung) The second embodiment of the circuit board 2' according to the invention shown in Fig. 2 in a detail of a schematic sectional view differs from the circuit board 2 according to Fig. 1 only in that the recesses 30, 32 in the middle, fifth circuit board 20 after completion of the layered structure the circuit board 2 'and the curing of the same with a casting resin 42 have been expired. In order to make this possible, a filling bore 34, 38 and a vent bore 36, 40 are arranged in the two upper two printed circuit boards, i.e. the first printed circuit board 4 and the second printed circuit board 8, which lead into the recesses 30, 32 and via which the casting resin 42 can be filled in each case and the air previously present there can escape. By filling with the casting resin 42, temperature-dependent and external pressure-dependent pressure fluctuations and the condensation of humidity in the recesses 30, 32 are avoided. List of reference symbols (part of the description)
Mehrlagige Leiterplatte (erste Ausführungsform)‘ Mehrlagige Leiterplatte (zweite Ausführungsform)Multilayer Printed Circuit Board (First Embodiment)' Multilayer Printed Circuit Board (Second Embodiment)
Erste Leiterplatine a - 6d Leiterbahnen an der Leiterplatine 4 First circuit board a - 6d traces on circuit board 4
Zweite Leiterplatine 0a - 10d Leiterbahnen an der Leiterplatine 8 2 Dritte Leiterplatine 4a - 14c Leiterbahnen an der Leiterplatine 12 6 Vierte Leiterplatine 8a - 18d Leiterbahnen an der Leiterplatine 16 0 Fünfte (mittlere) Leiterplatine 2 Vergrabene Durchkontaktierung 4 Offene Durchkontaktierung 6 Erstes elektronisches Bauteil 8 Zweites elektronisches Bauteil 0 Erste Ausnehmung 2 Zweite Ausnehmung 4 Erste Einfüllbohrung 6 Erste Entlüftungsbohrung 8 Zweite Einfüllbohrung 0 Zweite Entlüftungsbohrung 2 Gießharz Second circuit board 0a - 10d Traces on circuit board 8 2 Third circuit board 4a - 14c Traces on circuit board 12 6 Fourth circuit board 8a - 18d Traces on circuit board 16 0 Fifth (middle) circuit board 2 Buried via 4 Exposed via 6 First electronic component 8 Second electronic component 0 first recess 2 second recess 4 first filling hole 6 first ventilation hole 8 second filling hole 0 second ventilation hole 2 casting resin

Claims

Patentansprüche patent claims
1 . Mehrlagige Leiterplatte (2, 2’), welche aus mehreren mit Leiterbahnen (6a, 6b, 6c, 6d; 10a, 10b, 10c, 10d; 14a, 14b, 14c; 18a, 18b, 18c, 18d) versehenen und schichtförmig übereinander angeordneten sowie miteinander verklebten oder verschmolzenen Leiterplatinen (4, 8, 12, 16, 20) besteht, und welche mit aktiven und/oder passiven elektronischen Bauteilen (26, 28) bestückt ist, wobei bestimmte Leiterbahnen (10a, 18a, 18b, 18c, 18d) und elektronische Bauteile (26, 28) zumindest einen gegen eine Manipulation und/oder ein Kopieren schutzbedürftigen Schaltkreis zur Steuerung einer Funktion bilden, dadurch gekennzeichnet, dass die Leiterbahnen (10a, 18a, 18b, 18c, 18d) des mindestens einen schutzbedürftigen Schaltkreises auf innerhalb der Leiterplatte (2, 2’) liegenden Leiterplatinen (8, 16) angeordnet sind, und dass die diesem mindestens einem Schaltkreis zugeordneten elektronischen Bauteile (26, 28) innerhalb der Leiterplatte (2, 2‘) zwischen den innen liegenden Leiterplatinen (8, 16) eingebettet sind. 1 . Multi-layer printed circuit board (2, 2'), which consists of several conductor tracks (6a, 6b, 6c, 6d; 10a, 10b, 10c, 10d; 14a, 14b, 14c; 18a, 18b, 18c, 18d) provided and arranged in layers one above the other and printed circuit boards (4, 8, 12, 16, 20) that are glued or fused together, and which is equipped with active and/or passive electronic components (26, 28), certain conductor tracks (10a, 18a, 18b, 18c, 18d ) and electronic components (26, 28) form at least one circuit requiring protection against manipulation and/or copying for controlling a function, characterized in that the conductor tracks (10a, 18a, 18b, 18c, 18d) of the at least one circuit requiring protection printed circuit boards (8, 16) inside the printed circuit board (2, 2') are arranged, and that the electronic components (26, 28) assigned to this at least one circuit are arranged inside the printed circuit board (2, 2') between the inner printed circuit boards (8 , 16) entered are flat.
2. Leiterplatte nach Anspruch 1 , dadurch gekennzeichnet, dass die elektronischen Bauteile (26, 28) als SMD-Bauteile ausgebildet sind, und dass diese Bauteile (26, 28) auf mindestens einer der innen liegenden Leiterplatinen (8, 16) auf ihrer mit Leiterbahnen (18a - 18d) versehenen Innenseite angeordnet sind. 2. Circuit board according to claim 1, characterized in that the electronic components (26, 28) are designed as SMD components, and that these components (26, 28) on at least one of the internal printed circuit boards (8, 16) on their with Conductor tracks (18a - 18d) provided inside are arranged.
3. Leiterplatte nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass eine bestückungsseitig unmittelbar benachbart zu der mit den elektronischen Bauteilen (26, 28) bestückten Leiterplatine (16) angeordnete weitere Leiterplatine (20) Ausnehmungen (30, 32) aufweist, wobei diese Ausnehmungen (30, 32) derart ausgebildet und angeordnet sind, dass die elektronischen Bauteile (26, 28) berührungslos in diese hineinragen. 3. Printed circuit board according to Claim 1 or 2, characterized in that a further printed circuit board (20) arranged immediately adjacent to the printed circuit board (16) equipped with the electronic components (26, 28) on the component side has recesses (30, 32), these recesses (30, 32) are designed and arranged in such a way that the electronic components (26, 28) project into them without making contact.
4. Leiterplatte nach Anspruch 3, dadurch gekennzeichnet, dass die Ausnehmungen (30, 32) in der unmittelbar benachbarten weiteren Leiterplatine (20) mit eingeschlossener Umgebungsluft gefüllt sind. 4. Printed circuit board according to claim 3, characterized in that the recesses (30, 32) in the immediately adjacent further printed circuit board (20) are filled with enclosed ambient air.
5. Leiterplatte nach Anspruch 3, dadurch gekennzeichnet, dass die Ausnehmungen (30, 32) in der unmittelbar benachbarten weiteren Leiterplatine (20) mit einem Gießharz (42) oder mit einem anderen elektrisch isolierenden Material verfüllt sind. 5. Printed circuit board according to claim 3, characterized in that the recesses (30, 32) in the directly adjacent further printed circuit board (20) are filled with a casting resin (42) or with another electrically insulating material.
6. Leiterplatte nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Leiterbahnen (10a, 18a - 18d) des mindestens einen schutzbedürftigen Schaltkreises auf benachbarten Leiterplatinen (8, 16) angeordnet sind, und dass zumindest zwei auf den benachbarten Leiterplatinen (8, 16) angeordnete Leiterbahnen (10a, 18a) über eine vergrabene Durchkontaktierung (22) elektrisch miteinander verbunden sind. 6. Printed circuit board according to one of Claims 1 to 5, characterized in that the conductor tracks (10a, 18a - 18d) of the at least one circuit requiring protection are arranged on adjacent printed circuit boards (8, 16), and in that at least two on the adjacent printed circuit boards (8th , 16) arranged conductor tracks (10a, 18a) are electrically connected to one another via a buried via (22).
PCT/EP2021/083935 2020-12-11 2021-12-02 Printed circuit board for electronic circuits WO2022122536A1 (en)

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