WO2022111445A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022111445A1
WO2022111445A1 PCT/CN2021/132319 CN2021132319W WO2022111445A1 WO 2022111445 A1 WO2022111445 A1 WO 2022111445A1 CN 2021132319 W CN2021132319 W CN 2021132319W WO 2022111445 A1 WO2022111445 A1 WO 2022111445A1
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WO
WIPO (PCT)
Prior art keywords
radiator
frame
electronic device
antenna
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/132319
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English (en)
French (fr)
Inventor
刘晋宏
李克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2022111445A1 publication Critical patent/WO2022111445A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Definitions

  • the present application belongs to the field of communication technologies, and specifically relates to an electronic device.
  • the antenna of the electronic device is usually integrated on the middle frame.
  • the specific process is as follows: die-casting the antenna structure on the metal frame; then injection molding the metal frame and the plastic part, wrapping the metal frame in the plastic part to obtain a middle frame; finally, setting a plurality of fractures on the middle frame to make the antenna structure Split into multiple antennas, and disconnect the two adjacent antennas with a break to avoid short-circuiting of the antennas.
  • the inventor found that there are at least the following problems in the related art: because the antenna structure needs to be die-cast on the metal frame, the thickness of the antenna itself is usually thick, so the distance between the antenna and the electronic device inside the electronic device is relatively long. Recently, the clearance area of the antenna is small, which affects the radiation performance of the antenna. Moreover, since multiple fractures need to be arranged on the middle frame, not only the processing cost of the middle frame is increased, but also the structural strength of the middle frame is lower.
  • the present application aims to provide an electronic device, which at least solves one of the problems of small clearance area of the antenna and low structural strength of the middle frame.
  • An embodiment of the present application proposes an electronic device, the electronic device includes: a middle frame and a plurality of antennas; wherein,
  • the middle frame includes a metal frame and a first plastic frame, and the first plastic frame is wrapped outside the metal frame;
  • the plurality of antennas are arranged on the first plastic frame and are arranged at intervals around the first plastic frame;
  • the antenna includes a radiator, a feeder and a grounding body respectively electrically connected to the radiator, and the radiator is arranged on a side of the first plastic frame away from the metal frame.
  • the thickness of the antenna can be made thinner, and the radiation of the antenna can be reduced.
  • the distance between the radiator of the antenna and the metal frame and the electronic devices inside the electronic device is farther, and further, the distance between the radiator of the antenna and the electronic device inside the electronic device can be made far.
  • the clearance area of the antenna is large, which improves the radiation performance of the antenna.
  • the separation can be achieved by maintaining a certain distance between the two adjacent antennas. In this way, it can be avoided to set a fracture on the first plastic frame to separate the two adjacent antennas, thereby reducing the processing cost of the middle frame and improving the middle frame. structural strength of the box.
  • FIG. 1 is a schematic structural diagram of an electronic device of the related art
  • Fig. 2 is the sectional structure schematic diagram of the position A-A of the electronic equipment shown in Fig. 1;
  • FIG. 3 is a schematic structural diagram of another angle of the electronic device shown in FIG. 1;
  • FIG. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • Fig. 5 is the sectional structure schematic diagram of the position B-B of the electronic device shown in Fig. 4;
  • FIG. 6 is a schematic structural diagram of a first plastic frame according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of another first plastic frame according to an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of still another first plastic frame according to an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of another first plastic frame according to an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of another first plastic frame according to an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a radiator according to an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of a structural unit according to an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of an array unit according to an embodiment of the present application.
  • Reference numerals 100-plastic part, 200-metal frame, 300-antenna, 400-fracture, 10-metal frame, 11-first plastic frame, 111-frame part, 1111-first surface, 1112-second surface , 1113-third surface, 112-embedded part, 113-slot structure, 12-radiator, 121-first radiator, 122-second radiator, 123-third radiator, 124-second coupling part , 120-structural unit, 1201-microstrip feeder, 1202-array unit, 1203-dielectric substrate, 1204-floor, 13-feeder, 131-first coupling part, 14-grounding body, 15-microstrip power Splitter, 16-Second plastic frame.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • FIG. 1 a schematic structural diagram of an electronic device of the related art is shown.
  • FIG. 2 a schematic cross-sectional structure diagram of the position A-A of the electronic device shown in FIG. 1 is shown.
  • the antenna structure usually needs to be die-cast on the metal frame 200. Then, the metal frame 200 and the injection molding part 100 are injection-molded, and the metal frame 200 and the antenna structure are wrapped in the plastic part 100 to obtain a middle frame. Finally, a plurality of fractures 400 are arranged on the middle frame, the antenna structure is divided into a plurality of antennas 300, and the connection between two adjacent antennas 300 is disconnected by the fractures 400 to avoid short circuit of the antennas.
  • the thickness a of the antenna 300 itself is usually thick, and the thickness a is about 1.0-1.5 mm. Therefore, the distance between the antenna 300 and the electronic devices inside the electronic device is relatively short. , the clearance area b of the antenna is small, and the thickness b1 is about 1.0-2.0 mm, which affects the radiation performance of the antenna 300 . Moreover, during the molding process of the metal frame 200 and the injection molded part 100 , the antenna 300 is more likely to be broken under the action of injection pressure, which further reduces the performance of the antenna 300 . In addition, since a plurality of fractures 400 need to be arranged on the middle frame, not only the processing cost of the middle frame will be increased, but also the structural strength of the middle frame will be lower.
  • FIG. 4 a schematic structural diagram of an electronic device according to an embodiment of the present application is shown.
  • FIG. 5 a cross-sectional structural schematic diagram of the position B-B of the electronic device shown in FIG. 4 is shown.
  • the electronic device may include: a middle frame and a plurality of antennas; wherein, the middle frame may include a metal frame 10 and a first plastic frame 11 , and the first plastic frame 11 is wrapped outside the metal frame 10 ;
  • the plurality of antennas are arranged on the first plastic frame 11, and are arranged at intervals around the first plastic frame 11; the antennas may specifically include: a radiator 12, a feeder 13 electrically connected to the radiator 12, and a ground
  • the body 14 and the radiator 12 are disposed on the side of the first plastic frame 11 away from the metal frame 10 .
  • the first plastic frame 11 can be wrapped around the metal frame 10 by means of injection molding, and then a plurality of antennas are formed on the first plastic frame 11 . Since the process of injection molding the antenna and the first plastic frame 11 is avoided, the antenna does not need to be subjected to injection pressure, so the thickness of the antenna can be relatively thin, and the antenna is less likely to be broken.
  • the radiator 12 of the antenna may be provided with a sheet-like structure, and the thickness of the radiator 12 may be about 0.02 mm.
  • arranging the radiator 12 on the side of the first plastic frame 11 away from the metal frame 10 can make the distance between the radiator 12 and the metal frame 10 and the electronic devices inside the electronic device relatively far, and further, the said The clearance area c of the antenna is large, and the thickness of c can reach about 2.98-3.45mm, which greatly improves the radiation performance of the antenna.
  • the separation can be achieved by maintaining a certain distance between the two adjacent antennas. In this way, it is possible to avoid setting a fracture on the first plastic frame 11 to separate the two adjacent antennas, reducing the intermediate The processing cost of the frame is improved, and the structural strength of the middle frame is improved. Furthermore, the processing cost of the electronic device can be reduced, and the structural strength of the electronic device can be improved.
  • the radiator 12 of the antenna can be used to radiate or receive radio frequency signals.
  • the feeder 13 can be used to feed the electrical signal of the radio frequency module inside the electronic device into the radiator 12, and to feed the radio frequency signal received by the radiator 12 into the radio frequency module inside the electronic device.
  • the grounding body 14 may be an electrical connection structure such as a contact, a pin, an electrical connecting piece, etc., and the grounding body 14 may be used to realize the connection between the radiator 12 and the reference ground.
  • the first plastic frame 11 may be made by using LDS (Laser Direct Structuring, laser direct structuring technology), and the antenna is an LDS antenna.
  • LDS Laser Direct Structuring, laser direct structuring technology
  • the first plastic frame 11 may be made of LDS plastic.
  • LDS plastic is a production technology for professional laser processing, injection and electroplating processes. By adding some raw materials containing special components to the plastic, ordinary plastic components can be given electrical interconnection function, and laser technology can be used directly in LDS. Direct 3D printing of circuit boards on plastic eliminates the need for traditional circuit boards, and the circuit design is more flexible, and most importantly, the volume of the product can be significantly reduced.
  • a plurality of LDS antennas can be directly fabricated on the first plastic frame 11 by using the LDS technology, so that not only the thickness of the LDS antennas can be designed to be thinner, but also the clearance area of the LDS antennas can be increased .
  • the LDS antenna can be flexibly arranged at any position of the first plastic frame 11, which is beneficial to the flexible arrangement of the LDS antenna.
  • grooves are provided on the surface of the first plastic frame 11 , and the antenna can be embedded in the grooves.
  • a groove can be formed on the first plastic frame 11 in a region where the antenna needs to be arranged by processing methods such as mold forming or removal processing, and then the thin-film antenna can be embedded in the groove.
  • the antenna and the first plastic frame 11 can be interference fit, or, between the antenna and the groove Set up the adhesive layer. This embodiment of the present application does not limit this.
  • the antenna when the antenna is embedded in the groove of the first plastic frame 11, in order to increase the clearance area of the antenna, the antenna may be a sheet antenna.
  • the material of the first plastic frame 11 can be selected from at least one of polycarbonate plastic, glass fiber polycarbonate plastic, and glass fiber polyamide plastic.
  • the first plastic frame 11 may include: a frame portion 111 and an embedded portion 112 ; wherein, the frame portion 111 includes Covering the periphery of the metal frame 10, the embedded part 112 can be embedded in the metal frame 10, and the embedded part 112 is connected with the frame part 111; the radiator 12 is arranged on the side of the frame part 111 away from the metal frame 10.
  • the grounding body 14 may be provided in the embedded portion 112 .
  • the electronic devices inside the electronic device are usually arranged in the metal frame 10 . Since the frame portion 111 is wrapped outside the metal frame 10, and the radiator 12 is disposed on the side of the frame portion 111 away from the metal frame 10, it is convenient to place the radiator 12 away from the metal frame 10 and the electronic devices inside the electronic device. , to increase the clearance area of the antenna and improve the radiation performance of the antenna. Since the embedded part 111 is embedded in the metal frame 10, the distance between the embedded part 111 and the electronic device inside the electronic device is relatively short. 13. The distance between the grounding body 14 and the electronic device inside the electronic device is short.
  • the feeder 13 it is beneficial for the feeder 13 to feed the electrical signal of the radio frequency module inside the electronic device into the radiator 12, or to feed the radio frequency signal received by the radiator 12 into the radio frequency module inside the electronic device, and, This facilitates the connection between the grounding body 14 and the reference ground inside the electronic device.
  • FIG. 7 a schematic structural diagram of another first plastic frame according to an embodiment of the present application is shown.
  • the number of radiators 12 is multiple, and the antenna may further include a microstrip power divider 15 ;
  • One end of the strip power divider 15 is electrically connected to the feeder 13 , and the other end of the microstrip power divider 15 is connected to a plurality of radiators 12 . transmitted to the radiator 12 .
  • the microstrip power divider 15 can divide the feeding power input by the feeder 13 into equal parts, and The signals are respectively transmitted to the plurality of radiators 12 to radiate radio frequency signals through the plurality of radiators 12 .
  • the microstrip power divider 15 by arranging multiple radiators 12 in the antenna, it is beneficial to increase the coverage area of the antenna, and further, it is beneficial for the electronic device to obtain better communication quality.
  • the frame portion 111 may include: a first surface 1111 , a second surface 1112 and a third surface 1113 that are orthogonal, and the first surface 1111 is provided on the frame portion 111 away from the metal frame 10 .
  • the radiator 12 includes a first radiator 121, a second radiator 122 and a third radiator 123, the first radiator 121 is arranged on the first surface 1111, the second radiator 122 is arranged on the second surface 1112, The three radiators 123 are disposed on the third surface 1113 .
  • the first radiator 121 , the second radiator 122 and the third radiator 123 may be orthogonal to each other, so that it can improve the The radiation superposition effect of the first radiator 121, the second radiator 122 and the third radiator 123 avoids the mutual interaction of the radio frequency signals radiated by the first radiator 121, the second radiator 122 and the third radiator 123 in certain directions. cancel, further increase the coverage area of the antenna, and improve the radiation performance of the antenna.
  • first radiator 121 , the second radiator 122 and the third radiator 123 can also set on any non-orthogonal surface according to actual needs.
  • the relative positions of the first radiator 121 , the second radiator 122 and the third radiator 123 may not be limited.
  • the microstrip power divider 15 is an electrical conductor disposed on the surface of the frame portion 111 by using the LDS process.
  • the microstrip power divider 15 can be fabricated on the frame portion 111 of the first plastic frame 11 by using the LDS process. In this way, it is not only beneficial to the light and thin design of the microstrip power divider 15 , but also can greatly improve the layout flexibility of the microstrip power divider 15 .
  • the power feeder 13 and the radiator 12 may be directly connected to achieve electrical connection between the power feeder 13 and the radiator 12 .
  • the electrical connection between the feeder 13 and the radiator 12 is realized by means of direct conduction, which can make the electrical connection between the feeder 13 and the radiator 12 simple and easy to implement, so that, The processing cost of the antenna can be reduced, and further, the processing cost of the electronic device can be reduced.
  • FIG. 8 a schematic structural diagram of a first plastic frame according to an embodiment of the present application is shown.
  • the feeder 13 is provided with a first coupling portion 131 at one end close to the radiator 12 .
  • 12 is provided with a second coupling part 124 at a position opposite to the first coupling part 131 , and the second coupling part 124 and the first coupling part 131 are arranged at intervals relative to each other, so as to realize the coupling between the radiator 12 and the feeder 13 .
  • the radiator 12 and the feeder 13 are electrically connected by means of coupling
  • the radiator 12 and the feeder 13 are not directly connected, but are connected through a first relatively spaced-apart distance.
  • the coupling of the coupling part 131 and the second coupling part 124 realizes the transmission of high-frequency radio frequency signals.
  • the bandwidth of the antenna can be adjusted by adjusting the coupling amount between the two, which is beneficial for the antenna to obtain a better bandwidth.
  • the distance between the first coupling part 131 and the second coupling part 124 can be represented by c1
  • the lengths of the first coupling part 131 and the second coupling part 124 can be represented by c2
  • c1 is usually 0.1 -1.5mm or so
  • c2 is usually around 1.0-15mm.
  • the coupling amount between the radiator 12 and the feeder 13 can be adjusted to adjust the bandwidth of the antenna, so that the antenna can obtain a better bandwidth.
  • the frame portion 111 may include: an orthogonal first surface 1111 , a second surface 1112 and a third Surface 1113, the first surface 1111 is provided on the side of the frame portion 111 away from the metal frame 10; the frame portion 111 is also provided with a concave slot structure 113, the antenna is arranged in the slot structure 113, and the slot structure 113 includes a relative The provided first groove wall and the second groove wall, the first coupling portion 131 is provided on the first groove wall, and the second coupling portion 124 is provided on the second groove wall.
  • the surface of the slot structure 113 can be used to lay out the antenna.
  • the overall length and area of the radiator 12 of the antenna can be changed, and the current path of the radiator 12 can be changed.
  • the length of the antenna can be adjusted to achieve the purpose of adjusting the working frequency band of the antenna, which is beneficial to achieve wider bandwidth and better antenna performance.
  • the slot structure 113 can be disposed on the second surface 1112 ; the radiator 12 can be disposed on the first surface 1111 , and is electrically connected to the feeder 12 through the slit structure 113 .
  • the slot structure 113 when the slot structure 113 is arranged on the second surface 1112 and the radiator 12 is arranged on the first surface 1111 , it is only necessary to set the length d2 of the slot structure 113 to be the same as the length d2 of the first coupling portion 131 , the first The length required when the two coupling parts 124 are coupled, and the distance d1 between the first groove wall and the second groove wall is set to the gap required when the first coupling part 131 and the second coupling part 124 are coupled, namely However, the overall volume of the slot structure 113 is small, so that the influence of the slot structure 113 on the strength of the first plastic frame 11 can be reduced, so that the first plastic frame 11 can maintain a high strength.
  • FIG. 10 a schematic structural diagram of another first plastic frame according to an embodiment of the present application is shown.
  • a slot structure 113 may be disposed on the first surface 1111 , and the slot bottom of the slot structure 113 is close to the metal Frame 10.
  • the first slot wall and the second slot wall of the slot structure 113 may be parallel to the second surface 1112 , and the first slot wall
  • the distance from the second slot wall can be represented by e2
  • the depth of the slot structure 113 can be represented by e1
  • the length of the slot structure 113 can be set according to the radiation area required by the antenna to increase the The radiation area of the antenna is further improved to further improve the performance of the antenna.
  • the radiator 12 may be disposed on the slot wall of the slot structure 113 away from the second surface 1112 , so that not only the radiation area of the radiator 12 can be increased Moreover, the clearance area of the radiator 12 can also be increased to further improve the performance of the antenna.
  • the dimensions d1 , d2 , d3 , e1 and e2 of the slot structure 113 in FIGS. 9 and 10 can be determined according to the antenna operating frequency band under the condition that they do not exceed the external dimensions of the frame portion 111 . Adjustment is made, which is not limited in this embodiment of the present application.
  • the material of the metal frame 10 may include at least one of magnesium alloy, aluminum alloy, zinc alloy, and titanium alloy, and the specific material of the metal frame 10 may not be made in this embodiment of the present application. limited.
  • the middle frame may further include: a second plastic frame 16 , the second plastic frame 16 is wrapped around the first plastic frame 11 , and is formed on the first plastic frame 11 . Protect.
  • the material of the second plastic frame 16 may include, but is not limited to, at least one of polycarbonate plastic, glass fiber polycarbonate plastic, and glass fiber polyamide plastic.
  • the specific material is not limited.
  • the surface of the second plastic frame 16 away from the first plastic frame 11 may be subjected to surface processing to increase the aesthetic appearance.
  • the surface treatment process may be at least one of spraying and electroplating, which is not limited in this embodiment of the present application.
  • FIG. 11 a schematic structural diagram of a radiator according to an embodiment of the present application is shown.
  • the radiator 12 can be provided with structural units 120 distributed in an array.
  • the structural units 120 can be regularly arranged to form an array. According to the design requirements of the antenna, the number and spacing of the structural units 120 can be set.
  • FIG. 12 a schematic structural diagram of a structural unit according to an embodiment of the present application is shown.
  • the microstrip feed line 1201 , the array unit 1202 and the floor 1204 can all be thin conductors processed by LDS or other processes, and the dielectric substrate 1203 can be the plastic material of the frame portion 111 or embedded in other dielectric substrates.
  • FIG. 13 a schematic structural diagram of an array unit according to an embodiment of the present application is shown.
  • the shape of the array unit 1202 may include circular, rectangular, and various special-shaped shapes.
  • the shape of the pump unit 1202 is not particularly limited.
  • the electronic device described in this application can at least include the following advantages:
  • the thickness of the antenna can be made thinner, and the radiator of the antenna can be kept away from the
  • the first plastic frame is disposed on one side away from the metal frame, so that the distance between the radiator of the antenna and the metal frame and the electronic devices inside the electronic device is farther, and further, the The clearance area is large, which improves the radiation performance of the antenna.
  • the separation can be achieved by maintaining a certain distance between the two adjacent antennas. In this way, it can be avoided to set a fracture on the first plastic frame to separate the two adjacent antennas, thereby reducing the processing cost of the middle frame and improving the middle frame. structural strength of the box.

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Abstract

本申请公开了一种电子设备，涉及通信技术领域，所述电子设备包括：中框以及多个天线；其中，所述中框包括金属框架以及第一塑胶框架，所述第一塑胶框架包覆在所述金属框架外；所述多个天线设置于第一塑胶框架上，且环绕所述第一塑胶框架间隔设置；所述天线包括：辐射体以及分别与所述辐射体电连接的馈电体和接地体，所述辐射体设置在所述第一塑胶框架的远离所述金属框架的一侧。

Description

电子设备
相关申请的交叉引用
本申请主张2020年11月30日提交的中国专利申请202011381438.0的优先权，该申请的全部内容通过引用包含于此。
技术领域
本申请属于通信技术领域，具体涉及一种电子设备。
背景技术
随着手机、平板电脑等电子设备的功能的日益丰富，电子设备的通讯频段也越来越多，相应的，电子设备中天线的数量和性能也在不断的提升。
相关的技术中，电子设备的天线通常会集成在中框上。具体过程为：将天线结构压铸在金属框架上；再将金属框架与塑胶件注塑成型，将金属框架包裹在塑胶件里面，得到中框；最后，在中框上设置多个断口，将天线结构拆分成多个天线，相邻的两个天线之间用断口断开连接，以避免天线短路。
在实现本申请过程中，发明人发现相关技术中至少存在如下问题：由于需要将天线结构压铸在金属框架上，天线本身的厚度通常较厚，因此，天线距离电子设备内部的电子器件的距离较近，天线的净空区域较小，影响了天线的辐射性能。而且，由于需要在中框上设置多个断口，不仅会提高中框的加工成本，而且，会使得中框的结构强度较低。
发明内容
本申请旨在提供一种电子设备，至少解决天线的净空区域较小、中框的结构强度较低的问题之一。
本申请实施例提出了一种电子设备，所述电子设备包括：中框以及多个天线；其中，
所述中框包括金属框架以及第一塑胶框架，所述第一塑胶框架包覆在所述金属框架外；
所述多个天线设置于第一塑胶框架上，且环绕所述第一塑胶框架间隔设置；
所述天线包括：辐射体以及分别与所述辐射体电连接的馈电体和接地体，所述辐射体设置在所述第一塑胶框架的远离所述金属框架的一侧。
在本申请的实施例中，通过在金属框架外包覆第一塑胶框架，并在所述第一塑胶框架的表面上设置天线，可以使得天线厚度较薄，再加上将所述天线的辐射体远离所述第一塑胶框架远离所述金属框架的一侧设置，可以使得所述天线的辐射体距离与所述金属 框架以及电子设备内部的电子器件的距离较远，进而，可以使得所述天线的净空区域较大，提升天线的辐射性能。而且，相邻的两个天线之间保持一定距离即可实现隔断，这样，就可以避免在第一塑胶框架上设置断口来隔开相邻的两个天线，降低中框的加工成本，提高中框的结构强度。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是相关技术的一种电子设备的结构示意图；
图2是图1所示的电子设备A-A位置的剖面结构示意图；
图3图1所示的电子设备另一角度的结构示意图；
图4是本申请实施例所述的电子设备的结构示意图；
图5是图4所示的电子设备B-B位置的剖面结构示意图；
图6是本申请实施例的一种第一塑胶框架的结构示意图；
图7是本申请实施例的另一种第一塑胶框架的结构示意图；
图8是本申请实施例的再一种第一塑胶框架的结构示意图；
图9是本申请实施例的又一种第一塑胶框架的结构示意图；
图10是本申请实施例的又一种第一塑胶框架的结构示意图；
图11是本申请实施例的一种辐射体的结构示意图；
图12是本申请实施例的一种结构单元的结构示意图；
图13是本申请实施例的一种阵列单元的结构示意图；
附图标记：100-塑胶件，200-金属框架，300-天线，400-断口，10-金属框架，11-第一塑胶框架，111-边框部，1111-第一表面，1112-第二表面，1113-第三表面，112-嵌入部，113-槽缝结构，12-辐射体，121-第一辐射体，122-第二辐射体，123-第三辐射体，124-第二耦合部，120-结构单元，1201-微带馈电线，1202-阵列单元，1203-介质基板，1204-地板，13-馈电体，131-第一耦合部，14-接地体，15-微带功分器，16-第二塑胶框架。
具体实施方式
下面将详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考 附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
结合图1至图3，描述相关技术的电子设备的结构示意图。参照图1，示出了相关技术的一种电子设备的结构示意图，参照图2，示出了图1所示的电子设备A-A位置的剖面结构示意图，参照图3，示出了图1所示的电子设备另一角度的结构示意图。
相关的电子设备中，通常需要将天线结构压铸在金属框架200上，然后，在将金属框架200与注塑件100注塑成型，将金属框架200以及天线结构包裹在塑胶件100里面，得到中框。最后，在中框上设置多个断口400，将天线结构拆分成多个天线300，相邻的两个天线300之间用断口400断开连接，以避免天线短路。
如图2所示，由于需要将天线压铸在金属框架200上，天线300本身的厚度a通常较厚，厚度a大约1.0-1.5mm，因此，天线300距离电子设备内部的电子器件的距离较近，天线的净空区域b较小，厚度b1大约1.0-2.0mm，影响了天线300的辐射性能。而且，在金属框架200与注塑件100成型的过程中，天线300在注塑压力的作用下较易出现断裂，进一步降低天线300的性能。此外，由于需要在中框上设置多个断口400，不仅会提高中框的加工成本，而且，会使得中框的结构强度较低。
下面结合图4-图12，描述本申请实施例的电子设备。参照图4，示出了本申请实施例所述的电子设备的结构示意图，参照图5，示出了图4所示的电子设备B-B位置的剖面结构示意图。
本申请实施例中，所述电子设备可以包括：中框以及多个天线；其中，中框可以包括金属框架10以及第一塑胶框架11，第一塑胶框架11包覆在所述金属框架10外；所述多个天线设置于第一塑胶框架11上，且环绕第一塑胶框架11间隔设置；所述天线具体可以包括：辐射体12以及分别与辐射体12电连接的馈电体13和接地体14，辐射体12设置在第一塑胶框架11的远离金属框架10的一侧。
在实际应用中，可以采用注塑成型等工艺先将第一塑胶框架11包覆在金属框架10外，再在第一塑胶框架11上形成多个天线。由于避免了将天线与第一塑胶框架11注塑成型的工艺，所述天线无需承受注塑压力，因此，所述天线的厚度可以较薄，而且，所述天线不易发生断裂。
如图5所示，所述天线的辐射体12可以设置薄片状结构，辐射体12的厚度可以为0.02mm左右。再加上将辐射体12设置在第一塑胶框架11的远离金属框架10的一侧，可以使得辐射体12与金属框架10以及电子设备内部的电子器件的距离较远，进而，可以使得所述天线的净空区域c较大，c的厚度可以达到2.98-3.45mm左右，极大提升天线的辐射性能。
而且，本申请实施例中，相邻的两个天线之间保持一定距离即可实现隔断，这样，就可以避免在第一塑胶框架11上设置断口来隔开相邻的两个天线，降低中框的加工成本，提高中框的结构强度。进而，可以降低所述电子设备的加工成本，并提高所述电子设备的结构强度。
在实际应用中，所述天线的辐射体12可以用于辐射或者接收射频信号。馈电体13可以用于将所述电子设备内部的射频模块的电信号馈入辐射体12，以及，将辐射体12接收到的射频信号馈入所述电子设备内部的射频模块。接地体14可以是触点、管脚、电连接片等电连接结构，接地体14可以用于实现辐射体12与参考地之间的连接。
在本申请的一些可选实施例中，第一塑胶框架11可以采用LDS(Laser Direct Structuring，激光直接成型技术)制成，所述天线为LDS天线。
具体地，第一塑胶框架11可以由LDS塑料制成。LDS塑料是一种专业激光加工、射出与电镀制程的生产技术，通过在塑料中添加某些含有特殊成分的原料，可以将普通的塑料元件赋予电气互连功能，利用激光镭射技术可以直接在LDS塑料上直接三维打印电路板，不再需要传统的电路板，线路设计也更灵活，最重要的是可以使产品的体积 显著缩小。
本申请实施例中，可以通过LDS的技术在第一塑胶框架11直接制成多个LDS天线，这样，不仅可以将所述LDS天线的厚度设计得较薄，增大所述LDS天线的净空区域。而且，可以将所述LDS天线灵活的布局在第一塑胶框架11的任意位置，有利于所述LDS天线的灵活布局。此外，还可以避免在第一塑胶框架11上设置断口来隔开相邻的两个LDS天线，降低所述中框的加工成本，提高所述中框的结构强度。
在本申请的另一些可选地实施例中，第一塑胶框架11的表面设置有凹槽，所述天线可以嵌设于所述凹槽内。
具体地，可以通过模具成型或者去除加工等加工方式在第一塑胶框架11上需要设置天线的区域形成凹槽，然后，再将薄片状的天线嵌入所述凹槽内即可。在实际应用中，为了增加所述天线与第一塑胶框架11之间的连接强度，可以将所述天线与第一塑胶框架11过盈配合，或者，在所述天线与所述凹槽之间设置粘接层。本申请实施例对此不做限定。
需要说明的是，在所述天线采用嵌设的形式嵌设于第一塑胶框架11的凹槽内时，为了增大所述天线的净空区域，所述天线可以为薄片状天线，为了降低所述电子设备的加工成本，第一塑胶框架11的材料可以选用聚碳酸酯塑料、玻璃纤维聚碳酸酯塑料、玻璃纤维聚酰胺塑料中的至少一种。
参照图6，示出了本申请实施例的一种第一塑胶框架的结构示意图，如图6所示，第一塑胶框架11可以包括：边框部111和嵌入部112；其中，边框部111包覆在金属框架10的四周外，嵌入部112可以嵌于金属框架10，嵌入部112与边框部111连接；辐射体12设置于边框部111的远离金属框架10的一侧，馈电体13、接地体14可以设置于嵌入部112。
在实际应用中，所述电子设备内部的电子器件通常设置在金属框架10内。由于边框部111包覆在金属框架10外，并且，辐射体12设置于边框部111远离金属框架10的一侧，可以便于将辐射体12远离金属框架10以及所述电子设备内部的电子器件设置，增大所述天线的净空区域，提高所述天线的辐射性能。由于嵌入部111嵌于金属框架10，嵌入部111与所述电子设备内部的电子器件之间的距离较短，通过将馈电体13、接地体14设置于嵌入部112，可以使得馈电体13、接地体14与所述电子设备内部的电子器件之间的距离较短。从而，有利于馈电体13将所述电子设备内部的射频模块的电信号馈入辐射体12，或者，将辐射体12接收到的射频信号馈入所述电子设备内部的射频模块，以及，有利于接地体14与所述电子设备内部的参考地之间的连接。
参照图7，示出了本申请实施例的另一种第一塑胶框架的结构示意图，如图7所示，辐射体12的数量为多个，天线还可以包括微带功分器15；微带功分器15的一端与馈电体13电连接，微带功分器15的另一端与多个辐射体12连接，微带功分器15可以用于将馈电体13输入的馈电功率传输给辐射体12。
在实际应用中，在馈电体13馈入所述电子设备内的射频模块的射频信号时，微带功分器15可以将馈电体13输入的馈电功率均分为相等的多份，并分别传输给多个辐射体12，以通过多个辐射体12进行射频信号的辐射。本申请实施例中，通过在所述天线中设置多个辐射体12，有利于增大所述天线的覆盖面积，进而，有利于所述电子设备获得更好的通信质量。
在本申请的一些可选实施例中，边框部111可以包括：正交的第一表面1111、第二表面1112以及第三表面1113，第一表面1111设于边框部111的远离金属框架10的一侧；辐射体12包括第一辐射体121、第二辐射体122以及第三辐射体123，第一辐射体121设置于第一表面1111，第二辐射体122设置于第二表面1112，第三辐射体123设置于第三表面1113。
本申请实施例中，由于第一表面1111、第二表面1112以及第三表面1113正交，第一辐射体121、第二辐射体122以及第三辐射体123可以相应正交，这样，可以提高第一辐射体121、第二辐射体122以及第三辐射体123的辐射叠加效果，避免第一辐射体121、第二辐射体122以及第三辐射体123辐射的射频信号在某些方向的相互抵消，进一步增大所述天线的覆盖面积，提升所述天线的辐射性能。
需要说明的是，在实际应用中，本领域技术人员也可以根据实际需要将第一辐射体121、第二辐射体122以及第三辐射体123设置在任意不正交的表面，本申请实施例对于第一辐射体121、第二辐射体122以及第三辐射体123的相对位置可以不做限定。
可选地，微带功分器15为采用LDS工艺设置于边框部111表面的导电体。在实际应用中，在第一塑胶框架11采用LDS材料制成的情况下，微带功分器15可以采用LDS工艺在第一塑胶框架11的边框部111上加工而成。这样，不仅可以有利于微带功分器15的轻薄化设计，而且，可以极大的提高微带功分器15的布局灵活性。
如图6、图7所示，馈电体13与辐射体12之间可以直接导通，以实现馈电体13与辐射体12之间的电连接。在实际应用中，采用直接导通的方式实现馈电体13与辐射体12之间的电连接，可以使得馈电体13与辐射体12之间的电连接方式较为简单，易于实现，从而，可以降低所述天线的加工成本，进而，可以降低所述电子设备的加工成本。
参照图8，示出了本申请实施例的再一种第一塑胶框架的结构示意图，如图8所示， 馈电体13在靠近辐射体12的一端设置有第一耦合部131，辐射体12在与第一耦合部131相对的位置设置有第二耦合部124，第二耦合部124与第一耦合部131相对间隔设置，以实现辐射体12与馈电体13之间的耦合。
具体地，在辐射体12与馈电体13之间通过耦合的方式实现电连接的情况下，辐射体12与馈电体13之间不直接导通，而是通过相对间隔一定距离的第一耦合部131与第二耦合部124的耦合来实现高频的射频信号的传输。在实际应用中，在辐射体12与馈电体13之间耦合连接时，可以通过调节二者之间的耦合量来调节所述天线的带宽，有利于所述天线获得更好的带宽。
示例的，所述第一耦合部131与所述第二耦合部124之间的距离可以用c1表示，第一耦合部131、第二耦合部124的长度可以用c2来表示，c1通常是0.1-1.5mm左右，c2通常是1.0-15mm左右。在实际应用中，通过调节c1和c2的值，可以调节辐射体12与馈电体13之间的耦合量，以调节所述天线的带宽，使得所述天线获得更好的带宽。
参照图9，示出了本申请实施例的又一种第一塑胶框架的结构示意图，如图9所示，边框部111可以包括：正交的第一表面1111、第二表面1112以及第三表面1113，第一表面1111设于边框部111远离金属框架10的一侧；边框部111还设置有内凹的槽缝结构113，所述天线设置于槽缝结构113，槽缝结构113包括相对设置的第一槽壁与第二槽壁，第一耦合部131设置于第一槽壁，第二耦合部124设置于所述第二槽壁。
在实际应用中，槽缝结构113的表面可以用于布局天线，通过将所述天线设置于槽缝结构，可以改变所述天线的辐射体12的整体长度和面积，改变辐射体12的电流路径长度，达到调整所述天线的工作频段的目的，有利于实现更宽的带宽和更好的天线性能。
如图9所示，槽缝结构113可以设置于第二表面1112；辐射体12可设置于第一表面1111，并通过狭缝结构113与馈电部12电连接。
在实际应用中，在将槽缝结构113设置于第二表面1112、辐射体12设置于第一表面1111的情况下，仅需将槽缝结构113的长度d2设置成第一耦合部131、第二耦合部124耦合时需要的长度，以及，将所述第一槽壁与所述第二槽壁之间的距离d1设置成第一耦合部131、第二耦合部124耦合时需要的间隙即可，槽缝结构113的整体体积较小，这样，就可以减小槽缝结构113对于第一塑胶框架11的强度影响，使得第一塑胶框架11可以保持较高的强度。
参照图10，示出了本申请实施例的又一种第一塑胶框架的结构示意图，如图10所示，槽缝结构113可以设置于第一表面1111，槽缝结构113的槽底靠近金属框架10。在实际应用中，在槽缝结构113设置于第一表面1111的情况下，槽缝结构113的第一 槽壁、第二槽壁可以与所述第二表面1112平行，所述第一槽壁与所述第二槽壁之间距离可以用e2表示，槽缝结构113的深度可以用e1表示，槽缝结构113的长度可以根据所述天线需要的辐射面积进行设置，以尽可能的增加所述天线的辐射面积，进一步提高所述天线的性能。
可选地，在槽缝结构113设置于第一表面1111的情况下，辐射体12可以设置于槽缝结构113的远离第二表面1112的槽壁，这样，不仅可以增加辐射体12的辐射面积，而且，还可以增大辐射体12的净空区域，进一步提升所述天线的性能。
需要说明的是，在实际应用中，图9、图10中的槽缝结构113的尺寸d1、d2、d3、e1和e2在不超过边框部111的外形尺寸的情况下，可以根据天线工作频段进行调整，本申请实施例对此不做限定。
在本申请的一些可选实施例中，金属框架10的材质可以包括：镁合金、铝合金、锌合金以及钛合金中的至少一种，本申请实施例对于金属框架10的具体材质可以不做限定。
在本申请的又一些可选地实施例中，所述中框还可以包括：第二塑胶框架16，第二塑胶框架16包覆在第一塑胶框架11四周外，对第一塑胶框架11形成保护。
具体地，第二塑胶框架16的材质可以包括但不局限于聚碳酸酯塑料、玻璃纤维聚碳酸酯塑料、玻璃纤维聚酰胺塑料中的至少一种，本申请实施例对于第二塑胶框架16的具体材质可以不做限定。
可选地，第二塑胶框架16的远离第一塑胶框架11的表面上可以进行表面工艺处理，以增加外观美观性。示例地，所述表面处理工艺可以是喷涂、电镀中的至少一种，本申请实施例对此不做限定。
参照图11，示出了本申请实施例的一种辐射体的结构示意图，如图11所示，辐射体12上可以设置阵列分布的结构单元120.结构单元120可以规律排列形成阵列，根据所述天线的设计需求，可以设置结构单元120的数量和间距。
参照图12，示出了本申请实施例的一种结构单元的结构示意图，如图12所示，结构单元120可以包括微带馈电线1201、阵列单元1202、介质基板1203和地板1204组成。在实际应用中，微带馈电线1201、阵列单元1202和地板1204都可以是采用LDS等工艺加工生成的薄导电体，介质基板1203可以是边框部111的塑胶材质或嵌入其他的介质基材。
参照图13，示出了本申请实施例的一种阵列单元的结构示意图，如图13所示，阵列单元1202的形状可以包括圆形、矩形以及各种异形的形状，本申请实施例对于真累 单元1202的形状不做具体限定。
综上，本申请所述的电子设备至少可以包括以下优点：
本申请实施例中，通过在金属框架外包覆第一塑胶框架，并在所述第一塑胶框架的表面上设置天线，可以使得天线厚度较薄，再加上将所述天线的辐射体远离所述第一塑胶框架远离所述金属框架的一侧设置，可以使得所述天线的辐射体距离与所述金属框架以及电子设备内部的电子器件的距离较远，进而，可以使得所述天线的净空区域较大，提升天线的辐射性能。而且，相邻的两个天线之间保持一定距离即可实现隔断，这样，就可以避免在第一塑胶框架上设置断口来隔开相邻的两个天线，降低中框的加工成本，提高中框的结构强度。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (15)

  1. 一种电子设备，包括：
    中框，所述中框包括金属框架(10)以及第一塑胶框架(11)，所述第一塑胶框架(11)包覆在所述金属框架(10)外；
    多个天线，所述多个天线设置于第一塑胶框架(11)上，且环绕所述第一塑胶框架(11)间隔设置，其中，所述天线包括：辐射体(12)以及分别与所述辐射体(12)电连接的馈电体(13)和接地体(14)，所述辐射体(12)设置在所述第一塑胶框架(11)的远离所述金属框架(10)的一侧。
  2. 根据权利要求1所述的电子设备，其中，所述第一塑胶框架(11)采用LDS制成，所述天线为LDS天线。
  3. 根据权利要求1所述的电子设备，其中，所述第一塑胶框架(11)的表面设置有凹槽，所述天线嵌设于所述凹槽内。
  4. 根据权利要求1所述的电子设备，其中，所述第一塑胶框架(11)包括边框部(111)和嵌入部(112)，其中，
    所述边框部(111)包覆在所述金属框架(10)的四周外，所述嵌入部(112)嵌于所述金属框架(10)，所述嵌入部(112)与所述边框部(111)连接；
    所述辐射体(12)设置于所述边框部(111)的远离所述金属框架(10)的一侧，所述馈电体(13)、所述接地体(14)设置于所述嵌入部(112)。
  5. 根据权利4所述的电子设备，其中，所述辐射体(12)的数量为多个，所述天线还包括微带功分器(15)；
    所述微带功分器(15)的一端与所述馈电体(13)电连接，所述微带功分器(15)的另一端与所述多个辐射体(12)连接，所述微带功分器(15)用于将所述馈电体(13)输入的馈电功率传输给所述辐射体(12)。
  6. 根据权利要求5所述的电子设备，其中，所述边框部(111)包括：正交的第一表面(1111)、第二表面(1112)以及第三表面(1113)，所述第一表面(1111)设于所述边框部(111)的远离所述金属框架(10)的一侧；
    所述辐射体(12)包括第一辐射体(121)、第二辐射体(122)以及第三辐射体(123)，所述第一辐射体(121)设置于所述第一表面(1111)，所述第二辐射体(122)设置于所述第二表面(1112)，所述第三辐射体(123)设置于所述第三表面(1113)。
  7. 根据权利要求5所述的电子设备，其中，所述微带功分器(15)为采用LDS工艺设置于所述边框部(111)表面的导电体。
  8. 根据权利要求4所述的电子设备，其中，所述馈电体(13)与所述辐射体(12)之间导通。
  9. 根据权利要求4所述的电子设备，其中，所述馈电体(13)在靠近所述辐射体(12)的一端设置有第一耦合部(131)，所述辐射体(12)在与所述第一耦合部(131)相对的位置设置有第二耦合部(124)，所述第二耦合部(124)与所述第一耦合部(131)相对间隔设置，以实现所述辐射体(12)与所述馈电体(13)之间的耦合。
  10. 根据权利要求9所述的电子设备，其中，所述边框部(111)包括：正交的第一表面(1111)、第二表面(1112)以及第三表面(1113)，所述第一表面(1111)设于所述边框部(111)远离所述金属框架(10)的一侧；
    所述边框部(111)还设置有内凹的槽缝结构(113)，所述天线设置于所述槽缝结构(113)，槽缝结构(113)包括相对设置的第一槽壁与第二槽壁，所述第一耦合部(131)设置于所述第一槽壁，所述第二耦合部(124)设置于所述第二槽壁。
  11. 根据权利要求10所述的电子设备，其中，所述槽缝结构(113)设置于所述第一表面(1111)，所述槽缝结构(113)的槽底靠近所述金属框架(10)。
  12. 根据权利要求11所述电子设备，其中，所述辐射体(12)设置于所述槽缝结构(113)的远离所述第二表面(1112)的槽壁。
  13. 根据权利要求10所述的电子设备，其中，所述槽缝结构(113)设置于所述第二表面(1112)；
    所述辐射体(12)设置于所述第一表面(1111)，并通过所述狭缝结构(113)与所述馈电部(12)电连接。
  14. 根据权利要求1所述的电子设备，其中，所述金属框架(10)的材质包括：镁合金、铝合金、锌合金以及钛合金中的至少一种。
  15. 根据权利要求1至14任一项所述的电子设备，其中，所述中框还包括：第二塑胶框架(16)，所述第二塑胶框架(16)包覆在所述第一塑胶框架(11)四周外。
PCT/CN2021/132319 2020-11-30 2021-11-23 电子设备 Ceased WO2022111445A1 (zh)

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