WO2022104931A1 - Mems 麦克风芯片 - Google Patents

Mems 麦克风芯片 Download PDF

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Publication number
WO2022104931A1
WO2022104931A1 PCT/CN2020/133740 CN2020133740W WO2022104931A1 WO 2022104931 A1 WO2022104931 A1 WO 2022104931A1 CN 2020133740 W CN2020133740 W CN 2020133740W WO 2022104931 A1 WO2022104931 A1 WO 2022104931A1
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Prior art keywords
diaphragm
mems microphone
substrate
microphone chip
sensing area
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PCT/CN2020/133740
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English (en)
French (fr)
Inventor
柏杨
赵转转
张睿
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瑞声声学科技(深圳)有限公司
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Publication of WO2022104931A1 publication Critical patent/WO2022104931A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present application relates to the technical field of acoustics and electricity, and in particular, to a MEMS microphone chip.
  • the chip includes a substrate with a back cavity, and a diaphragm and a back plate structure on the upper part of the substrate, wherein the diaphragm and the back plate structure form a capacitive system.
  • the external sound pressure causes the diaphragm to move through the through holes of the backplate structure, and this motion will change the distance between the diaphragm and the backplate structure, thereby changing the capacitance and finally converting it into an electrical signal.
  • the purpose of the present application is to provide a MEMS microphone chip that prevents failure due to difficult rebound of the diaphragm or micro-cracks.
  • the present application provides a MEMS microphone chip
  • the MEMS microphone chip includes a substrate with a back cavity, a vibrating membrane arranged at intervals from the substrate, and a side disposed away from the substrate relative to the vibrating membrane
  • the back plate of the MEMS microphone chip a cavity communicating with the back cavity is formed at a distance between the diaphragm and its opposite substrate
  • the MEMS microphone chip further includes a cavity extending from the substrate toward the direction close to the diaphragm and formed with the back cavity.
  • the diaphragm includes a sensing area facing the back cavity and a non-sensing area surrounding the sensing area and spaced from the sensing area to form a first gap.
  • the orthographic projection of the anti-sticking structure along the vibration direction of the diaphragm is located on one side of the non-sensing area.
  • the orthographic projection of the anti-sticking structure along the vibration direction of the diaphragm is located in the sensing area.
  • the anti-sticking structure is a plurality of protrusions protruding on the base, and the plurality of protrusions are spaced apart from each other.
  • the plurality of protrusions are arranged in an array.
  • the orthographic projection of a single protrusion on the diaphragm is a combination of one or more of a circle, a sector or a polygon.
  • the height of a single protrusion relative to the base is 0.8-5 ⁇ m.
  • the beneficial effect of the present application is: to provide a MEMS microphone chip, by extending on the substrate to form an anti-stick structure, the anti-stick structure is spaced from the vibrating membrane, so as to avoid the vibrating membrane on the back plate When vibrating with the base, it adheres to the base; and because the anti-sticking structure is formed on the base, the problem of setting the anti-sticking structure on the diaphragm to form a stress concentration point is avoided, and the critical value a of the diaphragm breaking is increased, that is, The working time for a to expand from the initial micro-crack a 0 to the critical value a c is prolonged, the risk of the diaphragm breaking is reduced, and the service life of the MEMS microphone chip is improved.
  • FIG. 1 is a schematic structural diagram of a MEMS microphone chip provided in the prior art
  • FIG. 2 is a schematic structural diagram of a MEMS microphone chip provided by the application.
  • FIG. 3 is a schematic structural diagram of the MEMS microphone chip provided by the present application.
  • the present application provides a MEMS microphone chip 100 .
  • the chip 100 includes a substrate 10 and a capacitor system disposed on the substrate 10 .
  • the base 10 includes a back cavity 12 formed in the middle of the base 10 and a fixing portion 11 surrounding the back cavity 12 .
  • the capacitor system includes a vibrating membrane 20 and a back plate 30 opposite to the vibrating membrane 20 and spaced apart from each other, and a cavity communicating with the back cavity 12 is formed between the vibrating membrane 20 and the back plate 30 .
  • a plurality of through holes 31 penetrating through the back plate 30 are formed in the middle of the back plate 30, and the plurality of through holes 31 are arranged at intervals; the plurality of through holes 31 communicate with the cavity and the external environment, so that the sound wave airflow can enter or flow out of the cavity .
  • the base 10 extends in a direction close to the vibrating membrane 20 to form an anti-sticking structure 40 , and the anti-sticking structure 40 is spaced apart from the vibrating membrane 20 , thereby preventing the vibrating membrane 20 from being stuck on the back plate. 30 adheres to the substrate 10 when vibrated between the substrate 10 .
  • the anti-sticking structure 40 is formed on the substrate 10, the problem that the anti-sticking structure is provided on the diaphragm 20 to form a stress concentration point is avoided, and the critical value a of the diaphragm 20 breaking is increased, that is, it is extended from the initial microcrack a. Extending the working time to the critical value a c reduces the risk of rupture of the diaphragm 20 , thereby increasing the service life of the MEMS microphone chip.
  • the anti-adhesion structure 40 formed on the base 10 can effectively accommodate foreign objects, so that the sharp surfaces of the foreign objects are not easily contacted with the diaphragm 20 , thereby reducing the initial microscopic appearance of the diaphragm 20 .
  • the probability of cracks reduces the risk of rupture of the diaphragm 20, thereby increasing the service life of the MEMS microphone chip.
  • the periphery of the back plate 30 is stepped and connected to the base 10 ; the diaphragm 20 is disposed on the base 10 and is spaced from the base 10 .
  • the diaphragm 20 includes a sensing area 21 facing the back cavity 12 and a non-sensing area 22 spaced around the sensing area 21 , and the sensing area 21 includes an anchor portion (not shown in the figure). out), the anchor portion extends to the fixing portion 11 of the base 10 , and the anchor portion of the sensing area 21 is fixed to the fixing portion 11 of the base 10 .
  • the non-sensing area 22 surrounds the sensing area 21 , and a first gap 23 is formed between the sensing area 21 and the non-sensing area 22 , and the non-sensing area 22 is fixed to the fixing portion 11 of the substrate 10 . .
  • the orthographic projection of the anti-sticking structure 40 along the vibration direction of the diaphragm 20 is located on the side of the non-sensing area 22 .
  • the anti-sticking structure 40 is a plurality of protrusions 40 protruding from the base 10 , and the plurality of protrusions 40 are spaced apart from each other.
  • the plurality of protrusions 40 are arranged in an array on the side of the base 10 facing the diaphragm 20 .
  • the height of a single protrusion 40 relative to the substrate 10 is 0.8-5 ⁇ m.
  • the orthographic projection of the anti-sticking structure 40 along the vibration direction of the diaphragm 20 is located in the sensing area 21 .
  • the anti-sticking structure 40 is a plurality of protrusions 40 protruding from the base 10 , and the plurality of protrusions 40 are spaced apart from each other.
  • the plurality of protrusions 40 are arranged in an array on the side of the base 10 facing the diaphragm 20 .
  • the orthographic projection of a single protrusion 40 on the diaphragm 20 is a combination of one or more of a circle, a sector or a polygon.
  • the cross section of the protrusion 40 along the direction parallel to the top surface of the fixing portion 11 of the base 10 is circular, so that the narrow gap between the cylinders is used to block foreign objects with a large volume from entering the back cavity 12 , thereby reducing vibration.
  • the risk of rupture of the membrane 20 increases the service life of the MEMS microphone chip.
  • the MEMS microphone chips provided in the embodiments of the present application are also applicable to MEMS microphone chips having a diaphragm, a substrate and a back cavity structure, such as piezoelectric and optical MEMS microphone chips.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本申请提供了MEMS麦克风芯片，包括具有背腔的基底，与所述基底间隔设置的振膜，以及相对所述振膜远离所述基底一侧设置的背板；所述振膜与其正对的基底之间间隔形成与所述背腔连通的空腔，所述MEMS麦克风芯片还包括自所述基底向靠近所述振膜的方向延伸形成与所述振膜间隔的防粘结构。本申请通过在所述基底上延伸形成与所述振膜相间隔的防粘结构，从而避免了所述振膜在背板与基底之间振动时粘附在基底上；并且由于防粘结构形成在基底上，避免了在振膜上设置防粘结构形成应力集中点的问题，提高了振膜断裂的临界值a，即延长了a从初始微裂纹a 0扩展到临界值a c的工作时间，降低了振膜发生断裂的风险，从而提高了MEMS麦克风芯片的使用寿命

Description

MEMS麦克风芯片 技术领域
本申请涉及声电技术领域，尤其涉及一种MEMS麦克风芯片。
 背景技术
MEMS麦克风芯片的应用越来越广泛，对芯片的可靠性要求也越来越高。以电容式MEMS麦克风芯片为例，该芯片包括具有背腔的基底，以及位于基底上部的振膜和背板结构，其中，振膜和背板结构形成了电容系统。外部声压通过背板结构的通孔引起振膜运动，该种运动将改变振膜与背板结构之间的距离，从而改变电容并最终转化为电信号。
如图1所示，现有技术中的一种MEMS麦克风芯片100’，其振膜20’的底部与基底10’的上部均未设置防黏连柱（dimple）结构。MEMS麦克风芯片在工作过程中，当振膜20’在背板结构30’和基底10’之间来回运动时，将较为容易的粘附在基底上，若振膜的回弹力不足以抵抗基底对振膜的吸附力，则振膜将难以回弹，从而造成MEMS麦克风芯片的失效。
 技术问题
本申请的目的在于提供了一种防止因振膜难以回弹或微裂纹造成失效的MEMS麦克风芯片。
 技术解决方案
为达到上述目的，本申请提供了一种MEMS麦克风芯片，所述MEMS麦克风芯片包括具有背腔的基底，与所述基底间隔设置的振膜，以及相对所述振膜远离所述基底一侧设置的背板；所述振膜与其正对的基底之间间隔形成与所述背腔连通的空腔，所述MEMS麦克风芯片还包括自所述基底向靠近所述振膜的方向延伸形成与所述振膜间隔的防粘结构。
优选的，所述振膜包括与所述背腔正对的感应区域及环绕所述感应区域并与所述感应区域相间隙设置形成第一缝隙的非感应区域。
优选的，所述防粘结构沿所述振膜的振动方向的正投影位于所述非感应区域一侧。
优选的，所述防粘结构沿所述振膜的振动方向的正投影位于所述感应区域内。
优选的，所述防粘结构为凸设在所述基底的多个凸起，所述多个凸起相互间隔设置。
优选的，所述多个凸起呈阵列排布。
优选的，单个所述凸起在所述振膜上的正投影为圆形、扇形或多边形中的一种或多种的组合。
优选的，单个所述凸起相对所述基底的高度为0.8-5μm。
 有益效果
本申请的有益效果在于：提供了一种MEMS麦克风芯片，通过在所述基底上延伸形成防粘结构，所述防粘结构与所述振膜相间隔，从而避免了所述振膜在背板与基底之间振动时粘附在基底上；并且由于防粘结构形成在基底上，避免了在振膜上设置防粘结构形成应力集中点的问题，提高了振膜断裂的临界值a，即延长了a从初始微裂纹a 0扩展到临界值a c的工作时间，降低了振膜发生断裂的风险，从而提高了MEMS麦克风芯片的使用寿命。
附图说明
图1为现有技术中提供的一种MEMS麦克风芯片的结构示意图；
图2为本申请提供的MEMS麦克风芯片的结构示意图；
图3为本申请提供的MEMS麦克风芯片的结构示意图。
 本发明的实施方式
下面结合附图和实施方式对本申请作进一步说明。
需要说明的是，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后、内、外、顶部、底部……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
参见图2和图3，本申请提供一种MEMS麦克风芯片100，该芯片100包括基底10以及设于基底10上的电容系统。
所述基底10包括形成于基底10中部的背腔12及环绕所述背腔12的固定部11。所述电容系统包括振膜20和与所述振膜20相对且间隔设置的背板30，所述振膜20与所述背板30之间形成与所述背腔12连通的空腔。
所述背板30中部形成有贯通所述背板30的多个通孔31，多个通孔31间隔设置；多个通孔31连通空腔与外界环境，使得声波气流可以进入或流出空腔。
当压力(声波)通过多个通孔31作用在所述振膜20上时。所述振膜20向靠近和远离所述背板30方向振动以使得所述振膜20与所述背板30之间电容的电容量产生变化。因此，可以生成与压力(声波)的变化相对应的电信号，该电信号通过与所述电容系统连接的外部电路输出，最终实现麦克风的功能。
参见图2，所述基底10向靠近所述振膜20的方向延伸形成防粘结构40，所述防粘结构40与所述振膜20相间隔，从而避免了所述振膜20在背板30与基底10之间振动时粘附在基底10上。
由于防粘结构40形成在基底10上，避免了在振膜20上设置防粘结构形成应力集中点的问题，提高了振膜20断裂的临界值a，即延长了a从初始微裂纹a 0扩展到临界值a c的工作时间，降低了振膜20发生断裂的风险，从而提高了MEMS麦克风芯片的使用寿命。
进一步的，参见图3，基底10上形成的防粘结构40能够有效的对外来异物起到容纳的功能，使得外来异物的尖锐表面不易与振膜20发生接触，降低了振膜20出现初始微裂纹的几率，降低了振膜20发生断裂的风险，从而提高了MEMS麦克风芯片的使用寿命。
优选地，所述背板30的周缘呈台阶状，并与所述基底10连接；所述振膜20设于所述基底10之上，并与基底10间隔设置。
参见图2，所述振膜20包括与所述背腔12正对的感应区域21和环绕所述感应区域21间隔设置的非感应区域22，所述感应区域21包括锚部（图中未示出），所述锚部延伸至所述基底10的固定部11，且所述感应区域21的锚部与基底10的固定部11相固定。所述非感应区域22环绕所述感应区域21，且所述感应区域21与所述非感应区域22相间隙设置形成第一缝隙23，所述非感应区域22与基底10的固定部11相固定。
所述防粘结构40沿所述振膜20的振动方向的正投影位于所述非感应区域22一侧。优选地，所述防粘结构40为凸设在所述基底10的多个凸起40，所述多个凸起40相互间隔设置。本实施例中的多个凸起40呈阵列排布在所述基底10朝向振膜20的一侧。单个所述凸起40相对所述基底10的高度为0.8-5μm。
所述防粘结构40沿所述振膜20的振动方向的正投影位于所述感应区域21内。优选地，所述防粘结构40为凸设在所述基底10的多个凸起40，所述多个凸起40相互间隔设置。本实施例中的多个凸起40呈阵列排布在所述基底10朝向振膜20的一侧。
单个所述凸起40在所述振膜20上的正投影为圆形、扇形或多边形中的一种或多种的组合。本实施例中的凸起40沿平行于基底10的固定部11顶面方向的横截面为圆形，从而利用圆柱之间狭小的间隙阻挡体积较大的外来异物进入背腔12，降低了振膜20发生断裂的风险，从而提高了MEMS麦克风芯片的使用寿命。
本申请实施例提供的MEMS麦克风芯片同样适用于具有振膜、基底和背腔结构的MEMS麦克风芯片，如压电式和光学式MEMS麦克风芯片。
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。

Claims (8)

1、一种MEMS麦克风芯片，所述MEMS麦克风芯片包括具有背腔的基底，与所述基底间隔设置的振膜，以及相对所述振膜远离所述基底一侧设置的背板；所述振膜与其正对的基底之间间隔形成与所述背腔连通的空腔，其特征在于，所述MEMS麦克风芯片还包括自所述基底向靠近所述振膜的方向延伸形成与所述振膜间隔的防粘结构。
2、根据权利要求1所述的MEMS麦克风芯片，其特征在于：所述振膜包括位于与所述背腔正对的感应区域及环绕所述感应区域并与所述感应区域相间隙设置形成第一缝隙的非感应区域。
3、根据权利要求2所述的MEMS麦克风芯片，其特征在于：所述防粘结构沿所述振膜的振动方向的正投影位于所述非感应区域一侧。
4、根据权利要求2所述的MEMS麦克风芯片，其特征在于：所述防粘结构沿所述振膜的振动方向的正投影位于所述感应区域内。
5、根据权利要求4所述的MEMS麦克风芯片，其特征在于：所述防粘结构为凸设在所述基底的多个凸起，所述多个凸起相互间隔设置。
6、根据权利要求5所述的MEMS麦克风芯片，其特征在于：所述多个凸起呈阵列排布。
7、根据权利要求5所述的MEMS麦克风芯片，其特征在于：单个所述凸起在所述振膜上的正投影为圆形、扇形或多边形中的一种或多种的组合。
8、根据权利要求5所述的MEMS麦克风芯片，其特征在于：单个所述凸起相对所述基底的高度为0.8-5μm。
PCT/CN2020/133740 2020-11-17 2020-12-04 Mems 麦克风芯片 WO2022104931A1 (zh)

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CN107770707A (zh) * 2016-08-22 2018-03-06 上海微联传感科技有限公司 一种mems麦克风
CN107986225A (zh) * 2016-10-26 2018-05-04 鑫创科技股份有限公司 微机电系统装置以及制作微机电系统的方法

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