WO2022102212A1

WO2022102212A1 - Sensor unit and pressure sensor unit and pressure detection device

Info

Publication number: WO2022102212A1
Application number: PCT/JP2021/031736
Authority: WO
Inventors: 和哉滝本
Original assignee: 株式会社鷺宮製作所
Priority date: 2020-11-13
Filing date: 2021-08-30
Publication date: 2022-05-19
Also published as: CN116569014A; JP7360375B2; JP2022078498A; KR20230086753A

Abstract

The purpose of the present invention is to, without significantly increasing cost, provide a sensor unit that has a function for protecting against superposed static electricity. A pressure sensor unit 10 is mounted in a pressure detection device 100 so as to be accommodated inside a waterproof case 20 and comprises a pressure sensor chip 11 that is connected to a connection line 38 and outputs a pressure detection signal while having power supplied thereto and a Zener diode 51 that protects the sensor chip from static electricity on the connection line. The sensor chip is disposed inside the case. The connection line is laid on the side of the inner surface of the case. The pressure sensor unit 10 comprises a relay connection terminal 36 that is electrically connected to the connection line and sensor chip, and a protection substrate 50 that is formed with a size that makes it possible for the protection substrate to be placed in the space within the case adjacent to the relay connection terminal, has the Zener diode mounted thereon, and has a wiring pattern formed thereon that is electrically connected to the connection line.

Description

Sensor unit and pressure sensor unit and pressure detector

The present invention relates to a sensor unit and a pressure sensor unit having an electrostatic protection function, and a pressure detection device.

Various sensor chips that detect physical quantities such as pressure and temperature are widely used, and in recent years, high accuracy and miniaturization have been achieved.

This high-precision and small-sized sensor chip may cause damage such as deterioration of detection accuracy due to the intrusion of high-voltage static electricity from the external environment. Therefore, for example, the insulation characteristics on the exterior side of the sensor unit are improved. As a result, it may be possible to block the intrusion of static electricity from the outside (Patent Document 1).

However, since the sensor chip is electrically connected and functions, if static electricity is superimposed on the connection line and invades, damage may occur as well. When it is necessary to provide a protection function against static electricity superimposed on the connection line in this way, a conductive pattern for connecting the static electricity protection element in the middle of the connection line is provided on the substrate for connection with the external device of the sensor chip. It is formed separately and a protection circuit is added.

International Publication 2015/194105

However, in such a sensor chip, if a substrate having a conductive pattern for connecting an electrostatic protection element is added, the cost will increase significantly due to design changes and changes in the manufacturing process.

In addition, in the form of incorporating the sensor unit inside the case so that the sensor chip is not exposed to the outside, the outer shape of the sensor unit itself must be compact, and it can be placed in a small space together with the board for connection. It will be laid out.

Therefore, the present invention provides a sensor unit that can compactly add an electrostatic protection element without modifying the connection structure of the connection line and has a protection function against superimposed static electricity without a large cost increase. With the goal.

One aspect of the invention of the sensor unit that solves the above problems is a sensor chip that outputs a detection signal according to the external environment while being supplied with power by connecting connection lines for power supply and signal, and a stage before the sensor chip. A sensor unit including a protective element that protects the sensor chip from static electricity on the connection line, and is housed in the case. The sensor chip is arranged inwardly separated from the inner surface of the case. In addition, while the connection line is wired to the inner surface side of the case, the connection line and the relay connection terminal electrically connected to each other so as to relay the sensor chip, and the relay connection terminal in the case. A protective element installation member that vertically connects the protective element to the relay connection terminal while positioning and holding the protective element at a location adjacent to the relay connection terminal so that the protective element can function between the sensor chip and the connection line. It is characterized by having and.

As described above, according to one aspect of the present invention, a protective element is installed at an adjacent location in the case at a relay connection terminal that connects the sensor chip inside the case and the connection line on the inner surface side of the case to relay power and signals. An electrostatic protection element that is positioned and held by using a member can be conductively connected together with a connection line.

That is, by performing one connection work to the relay connection terminal that connects the sensor chip to the connection line, adjacent electrostatic protection elements can be added to the compact space without modifying the connection structure between the sensor chip and the connection line. Can be installed.

Therefore, it is possible to provide a sensor unit having a protection function against superimposed static electricity without a large cost increase.

FIG. 1 is a diagram showing a pressure detection device equipped with a pressure sensor unit which is an example of the sensor unit according to the first embodiment of the present invention, and is a vertical sectional view showing a schematic overall configuration thereof. FIG. 2 is a front view showing the connection structure of the connection line. FIG. 3 is a perspective view showing the connection structure of the connection line. FIG. 4 is a perspective view showing the shape of the relay connection terminal. FIG. 5 is a perspective view showing the connection line of the relay connection terminal and the connection status with the protection board. 6A and 6B are views showing the protective substrate, where FIG. 6A is a perspective view showing one side and FIG. 6B is a perspective view showing the other side. 7A and 7B are views showing the protective substrate, where FIG. 7A shows a solder pattern on one side, FIG. 7B shows an element pattern on the other side, and FIG. 7C shows a relay pattern for conducting these patterns. It is a plan view. FIG. 8 is a vertical sectional side view of VIII-VIII in FIG. 2, showing the connection line of the relay connection terminal and the soldering operation with the protective substrate. 9A and 9B are views showing the conventional pressure detecting device, FIG. 9A is a vertical sectional view showing a schematic overall configuration, and FIG. 9B is a front view showing a connection structure of the connection line. FIG. 10 is a vertical sectional side view of XX in FIG. 9B showing a soldering operation of a relay connection terminal with a connection line in the conventional structure. FIG. 11 is a diagram showing a pressure detection device equipped with a pressure sensor unit which is an example of the sensor unit according to the second embodiment of the present invention, and is a vertical sectional view showing a schematic overall configuration thereof. FIG. 12 is a front view showing the connection structure of the connection line. FIG. 13 is a vertical sectional side view of XIII-XIII in FIG. 12, which shows a soldering operation between the connection line of the relay connection terminal and the protection element.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<First Embodiment>
1 to 8 are views showing a pressure detection device equipped with a pressure sensor unit, which is an example of the sensor unit according to the first embodiment of the present invention.

In FIG. 1, the pressure detection device 100 attaches a pressure sensor unit 10 to a position where pressure is measured as a physical quantity of an external environment, and outputs pressure information detected by the pressure sensor chip 11 to a connected external device M. It is made in. In the pressure detection device 100 of the present embodiment, the pressure sensor unit 10 housed in the resin waterproof case 20 is connected to a metal joint member, for example, in a pipe to which a fluid such as a gas or a liquid for detecting the pressure is guided. It is constructed so that it can be connected by connecting at 30.

Here, the waterproof case 20 is formed in a cylindrical shape capable of accommodating the pressure sensor unit 10, and the base plate 28 in which the joint member 30 is fixed to the step opening 20b formed by bending one end side inward. The peripheral parts are connected. In this joint member 30, a female screw 30s is formed so as to be screwable to a pipe or the like to be pressure-measured, and a fluid supplied from the pipe in the direction of arrow P is supplied from the pipe through a port 30a communicating with the female screw 30s. It is realized that it is introduced into the pressure chamber 28A on the downstream side of the base plate 28.

The pressure sensor unit 10 is formed in a short cylindrical shape and has a stainless steel housing 12 in which one end surface 12a in the axial direction is joined and fixed to the base plate 28, and a pressure sensor chip 11 is installed in the inner cylinder of the housing 12. A metal chip mount member 13 arranged so as to be located in the inner center away from the inner surface of the waterproof case 20, and the chip mount member 13 in the inner cylinder of the housing 12 are filled and closed while being closed. It is constructed with a hermetic glass 14 for fixing a member penetrating the inside of the inner cylinder.

Further, in the pressure sensor unit 10, a metal diaphragm 32 is joined and fixed to one end surface 12a of the housing 12. The diaphragm 32 forms an airtight pressure chamber 28A on the base plate 28 side, and isolates the installation space of the pressure sensor chip 11 on the chip mount member 13 side in the housing 12 from the pressure chamber 28A.

In the pressure sensor unit 10, for example, a predetermined amount of silicone oil PM (fluorine) is used as a pressure transmission medium in the installation space of the pressure sensor chip 11 formed by the hermetic glass 14 and the diaphragm 32 in the inner cylinder of the housing 12. It may function as a liquid chamber LR by being filled with a system inert liquid or the like).

As a result, the pressure sensor chip 11 is prevented from being damaged by the diaphragm 32 avoiding direct contact with the fluid to be detected that enters the pressure chamber 28A from the pipe to which the joint member 30 is connected. A pressure corresponding to the fluid pressure entering the pressure chamber 28A is generated in the liquid chamber LR via the diaphragm 32, and a detection signal corresponding to the fluid pressure can be output.

Here, the pressure sensor chip 11 is electrically connected to the input / output terminal group 40 connected to the connection line 38 from the external device M via the conduction wire 11w, so that power is supplied and the detection signal is transmitted. It is installed to output as pressure information. Further, the liquid chamber LR between the hermetic glass 14 and the diaphragm 32 in the inner cylinder of the housing 12 is filled with silicone oil PM via an oil filling pipe 44. The input / output terminal group 40 and the oil filling pipe 44 are fixed in a penetrating state by filling the hermetic glass 14 in a state where the inner cylinder of the housing 12 is positioned and held together with the chip mount member 13. The oil filling pipe 44 is closed by crushing one end of the pipe 44 after filling with oil as shown by a two-dot chain line in the figure.

The diaphragm 32 is damaged by an external force or a sudden pressure into the pressure chamber 28A by joining and fixing the diaphragm protection cover 34 having a plurality of communication holes 34a to one end surface 12a of the housing 12. Is designed to be prevented in advance. Further, a metal potential adjusting member 17 is fixed to one end surface 14a of the hermetic glass 14 between the pressure sensor chip 11 and the diaphragm 32, and the potential adjusting member 17 is described in, for example, Japanese Patent Application Laid-Open No. 3987386. Also shown, it is connected to a terminal connected to the zero potential of the circuit of the pressure sensor chip 11.

The input / output terminal group 40 is composed of a total of eight terminals 40a for two power supplies, one terminal 40a for output signals, and five terminals 40a for adjustment, and is made of resin. It is aligned and held by the disk portion 24d of 24. The terminal block 24 is provided with a tubular portion 24t that is short in the axial direction around the disk portion 24d, and is positioned and supported by being installed and fixed so that one end side of the tubular portion 24t overlaps the other end surface 12b of the housing 12. There is. In the input / output terminal group 40, both ends of each terminal 40a penetrate both sides of the hermetic glass 14 in the inner cylinder of the housing 12, and the pressure sensor chip 11 is conductively connected to one end side via the conduction wire 11w. On the other hand, the relay connection terminal 36 held in the tubular portion 24t of the terminal block 24 is electrically connected to the other end of the power supply terminal 40a and the output signal terminal 40a and connected to the external device M. It is relay-connected to the core wire 38a of the connection line 38.

Here, the adjustment terminal 40a of the input / output terminal group 40 is assembled to the pressure detection device 100 to optimize the sensitivity and accuracy of the pressure sensor chip 11 before the production of the pressure sensor unit 10 is completed. It is prepared for connecting an adjustment device (not shown) at the time of operation, and the connection with the adjustment device or the like is canceled after the optimization process.

Note that only four input / output terminal groups 40 are shown in the figure. Further, the terminal block 24 is attached with an end cap 24E that closes the opposite end portion of the housing 12 in the tubular portion 24t. The waterproof case 20 is waterproofed by filling the space between the housing 12 and the terminal block 24 with a sealing material 26 such as urethane resin.

The relay connection terminal 36 is extended in the parallel direction facing the disk portion 24d of the terminal block 24 that holds the input / output terminal group 40 in a parallel state and penetrates the cylinder portion 24t, and the input / output terminal group 40 thereof. Separated from the housing 12 on the outside of the chip-side connecting portion 36t conductively connected to the other end of the power supply terminal 40a and the output signal terminal 40a and the tubular portion 24t of the terminal block 24 of the chip-side connecting portion 36t. It is provided with a line-side connecting portion 36m which is bent and extended in the direction and is conductively connected to the core wire 38a of the connecting line 38 from the external device M by soldering the molten solder MS. The relay connection terminal 36 is fixed by the adhesive AB together with the protective substrate 50 described later in a state of penetrating the tubular portion 24t of the terminal block 24.

By the way, as shown in FIGS. 2 and 3, in the connection line 38, the power line 38P, the ground line 38G, and the output signal line 38S are extended from the external device M in the direction along the tubular portion 24t of the terminal block 24. It is connected to the pressure sensor unit 10 by utilizing the narrow space on the inner surface side of the waterproof case 20.

On the other hand, the relay connection terminal 36 corresponds to each of the connection lines 38 (38P, 38G, 38S) and maintains a mutually insulated state of the power supply terminal 36P, the ground terminal 36G, and the output signal terminal 36S. And have. The chip-side connecting portions 36t of these

terminals

36P, 36G, and 36S are positioned and supported through the tubular portion 24t of the terminal block 24, and as shown in FIGS. 4 and 5, the chip-side connecting portions 36t are extended. The line-side connecting portions 36m of these

terminals

36P, 36G, and 36S that bend in the orthogonal direction from the direction are formed so as to have a shape parallel to the bending angle portion so that the base end portion side of the chip-side connecting portion 36t is wide. The abutting end portion 36e is abutted against the bottom surface 25b of the groove 25 to which the adhesive AB of the terminal block 24 is applied, and is joined and fixed by the adhesive AB.

As a result, the connection line 38 can be easily soldered by simply holding each core wire 38a along the line-side connection portion 36m of the relay connection terminal 36, and the chip is connected to the pressure sensor chip 11. It can be electrically connected to the side connection portion 36t.

When the pressure sensor unit 10 of the present embodiment invades (superimposes) the static electricity generated in the external device M or in the middle of wiring between the external device M and the connection line 38, the characteristics of the pressure sensor chip 11 deteriorate. A protective substrate (protection element installation) on which an electrostatic protection element, for example, a constant voltage diode (so-called Zener diode) 51, is mounted in front of the pressure sensor chip 11 connected to the connection line 38. Member) 50 is installed.

As a result, in the pressure sensor unit 10, the abnormal voltage caused by the intrusion of static electricity from the connection line 38 is suppressed to a constant voltage or less, and the pressure sensor chip 11 is prevented from being damaged due to characteristic deterioration or the like. Can be prevented.

As shown in FIG. 6, the protective substrate 50 is located on the opposite side of the line-side connection portion 36m of the relay connection terminal 36 and is extended so as to be continuous with the chip-side connection portion 36t, and the relay connection terminal 36 thereof. It is manufactured in a size that can be installed in a narrow space between the tubular portion 24t of the terminal block 24 and the inner surface of the waterproof case 20 while being adjacent to the terminal block 24. On the protective substrate 50, a pattern for connecting to the relay connection terminal 36 is formed on one side, and a pattern for mounting the constant voltage diode 51 is formed on the other side.

As shown in FIG. 7, the protection board 50 is formed with a wiring pattern 55 in which each of the power terminal 36P and the output signal terminal 36S of the relay connection terminal 36 are conductively connected to the ground terminal 36G with the constant voltage diode 51 interposed therebetween. Specifically, the wiring pattern 55 is formed so that the anode of the constant voltage diode 51 is conductively connected to the ground terminal 36G. The wiring pattern 55 is formed with a soldering surface (solder pattern) 56 formed on one side (one of the front and back sides) and two constant voltage diodes 51 formed on the other side (the other side of the front and back sides). It includes a pattern 57 for elements to be electrically connected, and a relay pattern 58 for conducting these soldering surfaces 56 and the pattern 57 for elements.

Specifically, the soldering surface 56 on one side of the protective substrate 50 is the outer surface of the chip-side connecting portion 36t located on the outside of the tubular portion 24t of the terminal block 24 and on the opposite side of the line-side connecting portion 36m of the relay connection terminal 36. It is formed on a soldering surface having a desired area at a position in contact with one side of the peripheral edge of the protective substrate 50 so that it can be easily and reliably soldered while facing the surface. The element pattern 57 on the other surface side of the protective substrate 50 is extended from the peripheral edge on the back surface side of the soldering surface 56, and both

electrodes

51a and 51b are soldered to the power line 38P and the output signal line 38S of the connection line 38, respectively. By being attached, a constant voltage diode 51 is interposed, and the circuit pattern is formed so as to be conductive and commonly connected to the ground wire 38G of the connection line 38.
The relay pattern 58 of the protective substrate 50 has a concave concave portion 50r having a concave outer shape formed on the peripheral side surface of the protective substrate 50 on which the soldering surface 56 is formed, and the soldering surface 56 and the element are used. It is formed so as to be in a conductive connection state with the pattern 57.

As a result, the pressure sensor unit 10 bypasses (escapes) the abnormal voltage of static electricity that enters the power line 38P and the output signal line 38S of the connection line 38 to the ground line 38G side by the function of the respective constant voltage diodes 51. ) It can be suppressed to a constant voltage or less, and it is possible to prevent the static electricity from directly entering the pressure sensor chip 11 and causing deterioration of characteristics and damage.

Here, in the present embodiment, a case where the protective board 50 is soldered to the chip side connection portion 36t of the relay connection terminal 36 in an extended posture will be described as an example, but the present invention is not limited to this, and the protective board 50 is relayed. It may be soldered to the line-side connection portion 36m of the connection terminal 36 in an extended posture and installed along the inner surface of the waterproof case 20 together with the connection line 38. Further, the case where the recess 50r is provided on the peripheral edge of the protective substrate 50 and the soldering surface 56 and the element pattern 57 are conductively connected will be described as an example, but the present invention is not limited to this, and for example, the peripheral surface thereof is simply formed. A pattern may be formed and conductively connected, or through holes penetrating the front and back thereof may be formed and conductively connected.

Further, the pressure sensor unit 10 holds the protective substrate 50 so as to be attached to the position adjacent to the relay connection terminal 36 as shown in FIG. 8 when the core wire 38a of the connection line 38 is connected to the relay connection terminal 36. By simply doing so, the soldering work of the soldering surface 56 of the protective substrate 50 can be completed together with the core wire 38a of the connection line 38 to the line side connection portion 36m and the chip side connection portion 36t of the relay connection terminal 36.

As a result, the constant voltage diode 51 is mounted on the pressure sensor unit 10 as in the case of the pressure sensor unit 210 mounted on the conventional pressure detection device 200 shown in FIG. 9 which does not have the protection substrate 50 (constant voltage diode 51). In other words, the core wire 38a of the connection line 38 is soldered to the line-side connection portion 36m of the relay connection terminal 36 without adding the soldering work, and the number of steps is not increased from the conventional process shown in FIG. The pressure sensor unit 10 can be manufactured by installing the protective substrate 50 so that the voltage diode 51 functions effectively.

As described above, in the pressure sensor unit 10 of the present embodiment, the protective substrate 50 is positioned in a small space adjacent to the relay connection terminal 36 exposed on the outer surface 24o of the tubular portion 24t of the terminal block 24, and the relay connection terminal 36 thereof. The constant voltage diode 51 can be installed in front of the pressure sensor chip 11 just by soldering the connection line 38 and the soldering line 38, without increasing the soldering work (without significantly increasing the cost). It is possible to provide a protection function against static electricity superimposed on the connection line 38.

<Second Embodiment>
11 to 13 are views showing a pressure detection device equipped with a pressure sensor unit which is an example of the sensor unit according to the second embodiment of the present invention. Since the present embodiment has substantially the same configuration as the above-described embodiment, the same reference numerals will be given to the same configurations, and the description thereof will be omitted and the feature portions will be described.

In FIG. 11, in the pressure detection device 100 of the present embodiment, the pressure sensor unit 60 on which the constant voltage diode 51 is mounted is attached without using the protection substrate 50 of the above-described embodiment, and the pressure detected by the pressure sensor chip 11 is attached. It is manufactured to output information to the connected external device M.

Specifically, as shown in FIGS. 12 and 13, the terminal block 24 has an outer surface of the tubular portion 24t in a state where the chip-side connection portion 36t of the relay connection terminal 36 is attached to the input / output terminal group 40 so as to be conductively connectable. By applying (filling) the adhesive AB in the groove 25 recessed in 24o, the relay connection terminal 36 is positioned and fixed at a desired position. In the groove 25 of the tubular portion 24t of the terminal block 24, a slit (not shown) into which the chip side connection portion 36t of each of the

terminals

36P, 36G, 36S of the relay connection terminal 36 can be inserted is formed on the bottom surface 25b, and the bottom surface 25b thereof is formed. By abutting the abutting end portion 36e of the relay connection terminal 36 to the position, the chip side connecting portion 36t can be positioned so as to be electrically connected to the input / output terminal group 40.

In short, the terminal block 24 is formed wider than the tip side of the chip side connection portion 36t of the relay connection terminal 36 to be electrically connected to the input / output terminal group 40 from the line side connection portion 36m side to the abutting end portion 36e. A concave groove 25 is formed so as to secure a space (capacity) capable of accommodating the cylinder portion 24t between the outer surface 24o and the bottom surface 25b.

As a result, the terminal block 24 maintains a state in which the chip-side connection portion 36t of the relay connection terminal 36 is electrically connected to the input / output terminal group 40 by filling the groove 25 with the adhesive AB. Positioning and fixing to the cylinder portion 24t.

The pressure sensor unit 60 of the present embodiment has a groove 25 formed by shifting the two constant voltage diodes 51 in the circumferential direction of the tubular portion 24t of the terminal block 24 so that the constant voltage diode 51 can be accommodated. The lead wire 51w extended from both ends is formed so that the

terminals

36P, 36G, and 36S of the line side connection portion 36m of the relay connection terminal 36 can be soldered together with the core wire 38a of the connection line 38 at the same time.

Therefore, the constant voltage diode 51 is held in the groove 25 of the terminal block 24 adjacent to the line side connection portion 36m of the relay connection terminal 36, and is positioned and fixed by the adhesive AB. That is, the groove 25 formed in a concave shape on the outer surface 24o of the tubular portion 24t of the terminal block 24 functions as a holding portion of the setting jig for holding the constant voltage diode 51 on the terminal block 24 of the pressure sensor unit 60. The terminal block 24 can be used as a protective element installation member.

As a result, the pressure sensor unit 60 positions and fixes the two constant voltage diodes 51 in the space in the groove 25 adjacent to the relay connection terminal 36 attached to the terminal block 24, and relays the lead wire 51w. The

terminals

36P, 36G, and 36S of the line-side connection portion 36m of the connection terminal 36 can be soldered together with the core wire 38a of the connection line 38 at the same time to be electrically connected so as to function in the front stage of the sensor chip 11.

Therefore, similarly to the above-described embodiment, the pressure sensor unit 60 causes the abnormal voltage of static electricity that invades the power line 38P and the output signal line 38S of the connection line 38 to the ground line 38G side by the function of each constant voltage diode 51. It can be bypassed (released) and suppressed to a constant voltage or less, and it is possible to prevent the static electricity from directly entering the pressure sensor chip 11 and causing deterioration of characteristics and damage.

Further, in the pressure sensor unit 60, when the core wire 38a of the connection line 38 is connected to the relay connection terminal 36, the lead wire 51w of the constant voltage diode 51 is in the vicinity of each of the

terminals

36P, 36G, 36S of the line side connection portion 36m. In other words, the soldering work can be completed at the same time in a situation where the positions are adjacent to each other, and the soldering work for installing the constant voltage diode 51 is not added without using the protection substrate 50 of the above-described embodiment. The constant voltage diode 51 can be manufactured so as to function effectively without increasing the number of steps from the conventional process of soldering the core wire 38a of the connection line 38 to the line side connection portion 36m of the relay connection terminal 36.

As described above, also in the pressure sensor unit 60 of the present embodiment, the constant voltage diode 51 is positioned and fixed at a position adjacent to the relay connection terminal 36 exposed on the outer surface 24o of the tubular portion 24t of the terminal block 24, as in the above embodiment. The constant voltage diode 51 can be installed in front of the pressure sensor chip 11 simply by soldering the relay connection terminal 36 and the connection line 38, without increasing the soldering work (a large cost increase). It is possible to provide a protection function against the electrostatic charge superimposed on the connection line 38 (without becoming).

Here, in the above-described embodiment, the case where the constant voltage diode 51 is housed in the groove 25 and positioned and fixed will be described as an example, but the present invention is not limited to this, and for example, the outer surface of the tubular portion 24t of the terminal block 24 is described. A pair of facing ribs protruding from 24o and sandwiching the constant voltage diode 51 may be formed and held for positioning. In this case, the separation distance from the outer surface 24o of the terminal block 24 is set to be about the same for the lead wire 51w of the constant voltage diode 51 and the core wire 38a of the connection line 38, so that the connection portion 36m on the line side of the relay connection terminal 36 can be easily used. It may be possible to solder to.

The scope of the present invention is not limited to the exemplary embodiments illustrated and described, but also includes all embodiments that provide an equivalent effect to that of the present invention. Further, the scope of the present invention is not limited to the combination of the features of the invention defined by each claim, but may be defined by any desired combination of the specific features of all the disclosed features. ..

10, 60 …… Pressure sensor unit 11 …… Pressure sensor chip 12 …… Housing 20 …… Waterproof case 24 …… Terminal block 24t …… Cylinder 24o …… Outer surface 25 …… Groove 28A …… Pressure chamber 30 …… Joint Member 32 ... Diaphragm 36 ... Relay connection terminal 36G ... Ground terminal 36P ... Power terminal 36S ... Output signal terminal 36e ... Butt end 36m ... Line side connection 36t ... Chip side connection 38 ... ... Connection line 38G ... Ground wire 38P ... Power line 38S ... Output signal line 38a ... Core wire 50 ... Protective board 50r ... Recess 51 ... Constant voltage diode 55 ... Wiring pattern 56 ... Soldering surface (solder) Pattern)
57 …… Element pattern 58 …… Relay pattern 100 …… Pressure detection device LR …… Liquid chamber M …… External device

Claims

A sensor chip that outputs a detection signal according to the external environment while being supplied with power by connecting connection lines for power supply and signal, and protects the sensor chip from static electricity that rides on the connection line in front of the sensor chip. A sensor unit that is equipped with a protective element and is housed in a case.
The sensor chip is arranged inwardly separated from the inner surface of the case, and the connection line is wired to the inner surface side of the case.
A relay connection terminal electrically connected to each of the connection line and the sensor chip so as to relay the connection line and the sensor chip.
While positioning and holding the protective element at a position adjacent to the relay connection terminal in the case, the protective element is electrically connected to the relay connection terminal so that the protective element can function between the sensor chip and the connection line. Protective element installation member and
A sensor unit characterized by being equipped with.
As the protective element installation member, a protective substrate is formed in a size that can be adjacent to the relay connection terminal in the case, and a wiring pattern that conducts the protective element to the connection line while mounting the protective element is formed. The sensor unit according to claim 1, wherein the sensor unit comprises.
The connection line includes a power line and a ground line for the power supply and a signal line for the signal.
The relay connection terminal has a chip-side connection portion extending inward so as to be connectable to the sensor chip side, and a line-side connection portion extending so as to be connectable from the chip-side connection portion to the connection line side. Equipped with
The sensor according to claim 2, wherein the wiring pattern of the protective substrate is formed with a soldering surface for conducting a conductive connection to the chip-side connection portion or the line-side connection portion of the relay connection terminal. unit.
In the relay connection terminal, the soldered surface of the protective board is soldered to the line-side connection portion or the chip-side connection portion at the same time as the core wire of the connection line, and the protection element can function in the front stage of the sensor chip. The sensor unit according to claim 3, wherein the sensor unit is conductively connected to the solder.
The protective substrate has an element pattern formed on one of the front and back surfaces for conducting a conductive connection of the protective element, a soldering pattern formed on the other side of the front and back surfaces and functioning as the soldering surface, and a pattern for the element on the front and back surfaces. The sensor unit according to claim 3 or 4, further comprising a relay pattern for extending and connecting the soldering pattern to a conductive state.
The relay pattern is formed in a concave shape in which the outer shape of the peripheral edge between the front and back surfaces of the protective substrate is recessed, or in a through hole penetrating the front and back surfaces of the protective substrate, and the pattern for the element on the front and back surfaces and the said. The sensor unit according to claim 5, wherein the solder patterns are conductively connected.
As the protection element installation member, a terminal block for positioning and fixing the relay connection terminal for relay connection between the sensor chip and the connection line is formed so that the protection element can be positioned and held at a position adjacent to the relay connection terminal. The sensor unit according to claim 1, further comprising a holding portion that functions as a setting jig for the protective element.
The holding portion is formed in a protrusion shape that protrudes from the outer surface of the terminal block to sandwich and hold the protective element, or a concave shape that recesses the outer surface of the terminal block to store and hold the protective element. The sensor unit according to claim 7, wherein the sensor unit functions as the setting jig.
The connection line includes a power line and a ground line for the power supply and a signal line for the signal.
The relay connection terminal has a chip-side connection portion extending inward so as to be connectable to the sensor chip side, and a line-side connection portion extending so as to be connectable from the chip-side connection portion to the connection line side. Equipped with
The protection element is provided with lead wires at both ends, and the lead wire is simultaneously soldered to the line-side connection portion of the relay connection terminal together with the power line, the ground wire, and the core wire of the signal line of the connection line. The sensor unit according to claim 7 or 8, wherein the sensor unit is functionally and conductively connected in front of the sensor chip.
A pressure sensor unit comprising a pressure sensor chip for detecting pressure as the sensor chip in the sensor unit according to any one of claims 1 to 9 above.
The case in which the sensor chip in the pressure sensor unit according to claim 10 is housed together with the relay connection terminal and the protection element, and the connection line is housed in the case and connected. A featured pressure detector.