WO2022095448A1 - 晶圆脚本设定方法、装置、设备及存储介质 - Google Patents

晶圆脚本设定方法、装置、设备及存储介质 Download PDF

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Publication number
WO2022095448A1
WO2022095448A1 PCT/CN2021/099502 CN2021099502W WO2022095448A1 WO 2022095448 A1 WO2022095448 A1 WO 2022095448A1 CN 2021099502 W CN2021099502 W CN 2021099502W WO 2022095448 A1 WO2022095448 A1 WO 2022095448A1
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Prior art keywords
wafer
script
execution
unit
executed
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Ceased
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PCT/CN2021/099502
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English (en)
French (fr)
Inventor
苏笙华
谢明宏
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Changxin Memory Technologies Inc
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Changxin Memory Technologies Inc
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Priority to US17/477,842 priority Critical patent/US12086519B2/en
Publication of WO2022095448A1 publication Critical patent/WO2022095448A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present application relates to the technical field of integrated circuits and semiconductors, and in particular, to a wafer script setting method, apparatus, device, and storage medium.
  • the present application provides a wafer script setting method, device, device and storage medium, which are used to solve the problem that the existing wafer execution script setting solution takes a long time to change the wafer script and has the risk of wafer scrapping. As well as technical issues that affect the overall efficiency of the production system.
  • the present application provides a wafer script setting method, which is applied to a manufacturing execution system.
  • the system includes a demand unit, a setting unit, a platform unit, and a material execution unit; the method includes:
  • the platform unit obtains the batch identifier of the script to be executed and the corresponding production information, and the necessary conditions for execution are the The setting unit sets the corresponding conditions for the script to be executed according to the business requirements;
  • the platform unit verifies whether the first production information corresponding to the first wafer satisfies the execution necessary condition, and the first The wafer is selected by the demand unit and imported into the platform unit for the first time the script to be executed is executed;
  • the platform unit sets the parameter information and assignment information for the first wafer, and synchronizes the first wafer after setting the information to the material execution unit, so as to Make the material execution unit perform the corresponding operation.
  • the method further includes:
  • the platform unit determines an execution state according to the batch identifier corresponding to the second wafer and the second production information, and the execution state includes an execution site that has passed or an execution site that has not been passed.
  • the platform unit sets first label information for the second wafer to prohibit the execution of the second wafer. disqualification action; or
  • the platform unit sets second label information for the second wafer to allow a disqualification operation for the second wafer.
  • the allowing disqualification of the second wafer includes:
  • the platform unit deletes the parameter information to cancel the corresponding qualification of the second wafer to execute the corresponding script.
  • the platform unit changes the parameter information so that the changed parameter information does not satisfy the execution necessary condition.
  • the method further includes:
  • the requirement unit determines error information of the necessary conditions for execution, and displays the error information to the user unit.
  • the method further includes:
  • the platform unit determines the number of batches of wafers corresponding to the script to be executed, and determines the number of batches that can be added according to the maximum number of batches;
  • the demand unit modifies the batch quantity of the third wafer so that the corresponding batch quantity The number of times is less than or equal to the number of batches that can be added, and the third wafer is the wafer selected by the demand unit to execute the script to be executed for the first time;
  • the demand unit maps the third wafer to the third wafer through the to-be-imported list
  • the batch identification and production information are imported into the platform unit.
  • the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer to the platform unit through the to-be-imported list
  • the The method described above also includes:
  • the setting unit sets column item content, and generates at least one data import template according to the column item content, where the column item content is used to characterize the batch identification and feature information of the production information corresponding to the third wafer;
  • the requirement unit determines a corresponding template matching the first wafer from the at least one data import template, and determines the corresponding template as the to-be-imported list.
  • the demand unit modifies the first wafer, so that the platform unit re-inspects.
  • the method before the requirement unit determines according to the parameter information that the necessary conditions for execution of the script to be executed satisfy the business requirement, the method further includes:
  • the setting unit sets the parameter information and the necessary conditions for execution according to the business requirements
  • the necessary conditions for execution include at least one of the batch type corresponding to the script to be executed, the batch product number, the corresponding execution site, the execution status of the sub-batch script, the maximum batch quantity, and the batch level;
  • the parameter information has an associated relationship with the execution necessary condition.
  • the present application provides a wafer script setting device, including:
  • the acquisition module is used to obtain the batch identifier of the script to be executed and the corresponding production information if the requirement unit determines that the necessary conditions for the execution of the script to be executed meet the business requirements according to the parameter information, and the necessary conditions for execution are set as follows. Corresponding conditions set by the predetermined unit for the script to be executed according to the business requirements;
  • an inspection module configured to check whether the first production information corresponding to the first wafer satisfies the necessary conditions for execution if the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time , the first wafer is a wafer selected by the demand unit and imported into the platform unit for the first time executing the script to be executed;
  • a setting module for if the inspection result is yes, the platform unit sets the parameter information and assignment information for the first wafer, and synchronizes the first wafer after setting information to the material An execution unit, so that the material execution unit executes the corresponding operation.
  • the apparatus further includes:
  • the first processing module is used for the platform unit to determine the execution state according to the batch identification corresponding to the second wafer and the second production information, and the execution state includes the execution site that has passed or the execution site has not been passed, and the second wafer is executed. Circles are wafers that are not executing the script to be executed for the first time.
  • the first processing module includes:
  • the first processing sub-unit is configured to, if it is determined that the execution state is the past execution site, the platform unit sets first labeling information for the second wafer, so as to prohibit the execution of the second wafer. disqualification action; or
  • the second processing sub-unit is configured to, if it is determined that the execution state is the unexecuted site, the platform unit sets second labeling information for the second wafer to allow the second wafer to be processed Disqualification action.
  • the device further includes: a second processing module
  • the second processing module is used for:
  • the platform unit deletes the parameter information to cancel the corresponding qualification of the second wafer to execute the corresponding script.
  • the platform unit changes the parameter information so that the changed parameter information does not satisfy the execution necessary condition.
  • the device further includes:
  • the display module is used for the requirement unit to determine the error information of the necessary conditions for execution, and to display the error information to the user unit.
  • the device further includes: a third processing module
  • the third processing module is used for:
  • the platform unit determines the number of batches of wafers corresponding to the script to be executed, and determines the number of batches that can be added according to the maximum number of batches;
  • the demand unit modifies the batch quantity of the third wafer so that the corresponding The number of batches is less than or equal to the number of batches that can be added, and the third wafer is the wafer selected by the demand unit to execute the script to be executed for the first time;
  • the demand unit maps the third wafer to the third wafer through the to-be-imported list
  • the batch identification and production information are entered into the platform unit.
  • the device further includes: a fourth processing module;
  • the fourth processing module is used for:
  • the setting unit sets column item content, and generates at least one data import template according to the column item content, where the column item content is used to characterize the batch identification and feature information of the production information corresponding to the third wafer;
  • the requirement unit determines a corresponding template matching the first wafer from the at least one data import template, and determines the corresponding template as the to-be-imported list.
  • the device further includes:
  • a fifth processing module configured to modify the first wafer by the demand unit if the inspection result is negative, so that the platform unit re-inspects.
  • the device further includes:
  • a sixth processing module used for the setting unit to set the parameter information and the necessary conditions for execution according to the business requirements
  • the necessary conditions for execution include at least one of the batch type corresponding to the script to be executed, the batch product number, the corresponding execution site, the execution status of the sub-batch script, the maximum batch quantity, and the batch level;
  • the parameter information has an associated relationship with the execution necessary condition.
  • the application provides an electronic device, comprising:
  • a memory communicatively coupled to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to execute the first
  • the present application provides a non-transitory computer-readable storage medium storing computer instructions, the computer instructions being used to cause the computer to execute any one of the first aspect and the optional solutions of the first aspect.
  • the present application provides a wafer script setting method, device, device, and storage medium, which are applied to a manufacturing execution system, and the system includes a demand unit, a setting unit, a platform unit, and a material execution unit.
  • the wafer script setting method provided by the present application, if the demand unit determines that the necessary conditions for the execution of the script to be executed meet the business requirements according to the parameter information, the platform unit obtains the batch identifier of the script to be executed and the corresponding production information, wherein the execution The necessary conditions are the corresponding conditions set by the setting unit to execute the script according to the business requirements.
  • the platform unit checks whether the first production information corresponding to the first wafer meets the necessary conditions for execution, and the first wafer is selected and imported by the demand unit The wafer to which the script to be executed is executed for the first time to the platform unit. After the inspection of the platform unit, if the inspection result is yes, the platform unit sets the parameter information and assignment information for the first wafer, and synchronizes the first wafer after setting information to the material execution unit, so that the material execution unit Take the appropriate action.
  • the real-time setting of the script to be executed for the wafer can be realized, and whether the production information of the wafer submitted by the demand unit meets the necessary conditions for execution can be checked, avoiding the source from the source.
  • the wafer script setting method provided in this application can take effect once it is set, and the implementation process is short, and the setting process is independent of the number of batches, and will not affect the overall production efficiency.
  • FIG. 1 is a schematic diagram of an application scenario provided by an embodiment of the present application.
  • FIG. 2 is a schematic flowchart of a wafer script setting method according to an embodiment of the present application
  • FIG. 3 is a schematic flowchart of another wafer script setting method provided by an embodiment of the present application.
  • FIG. 4 is a schematic flowchart of still another wafer script setting method according to an embodiment of the present application.
  • FIG. 5 is a schematic flowchart of another wafer script setting method provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a wafer script setting device according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of another wafer script setting device provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a first processing module according to an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • the production process of wafers is often realized based on the Manufacturing Execution System (MES).
  • MES Manufacturing Execution System
  • request applicants often adjust wafer execution scripts according to actual working conditions.
  • the process of the existing solution is roughly as follows: the demand applicant submits the corresponding bill of lading information to the setter for each demand, and the setter modifies the execution script according to the lot ID (Lot ID) in the bill of lading information. Real-time changes cannot be achieved, and the change execution script cannot be verified, and batch wafers are easily scrapped due to errors in the modification script.
  • the applicant of the existing scheme proposes a modification request, the corresponding execution process needs to be modified, which takes a long time, especially when the number of batches is large, which affects the performance of the entire production system.
  • the present application provides a wafer script setting method, apparatus, device and storage medium.
  • the demand unit determines the corresponding conditions set by the setting unit to execute the script according to the parameter information, that is, whether the execution necessary conditions meet the business requirements, and if so, the platform unit obtains the pending script.
  • the batch identification of the execution script and the corresponding production information and then when the demand unit determines that the wafer corresponding to the to-be-executed script executes the to-be-executed script for the first time, the platform unit selects the demand unit and imports the first wafer of the platform unit.
  • the first production information is verified whether it meets the necessary conditions for execution.
  • the platform unit automatically sets the parameter information and assignment information for the first wafer, and the first wafer after the information is set. Sent to the material execution unit for the material execution unit to perform the corresponding action. Based on the platform unit and the necessary conditions for execution, without modifying the script process, the real-time setting of the script to be executed on the wafer can be realized, and whether the production information meets the necessary conditions for execution can be checked, and the non-compliance with the necessary conditions for execution can be avoided from the source.
  • the script to be executed can avoid the risk of batch scrapping of wafers due to wrong script settings.
  • the wafer script setting method provided in this application can take effect once it is set, and the implementation process is short, and the setting process is independent of the number of batches, and will not affect the overall production efficiency.
  • the wafer script setting method provided by the embodiment of the present application may be executed by the wafer script setting device provided by the embodiment of the present application.
  • the wafer script setting method provided in this embodiment of the present application can be applied to a Manufacturing Execution System (MES for short).
  • Material Manager referred to as MM).
  • FIG. 1 is a schematic diagram of an application scenario provided by an embodiment of the present application. As shown in FIG. 1 , the wafer script setting method provided by the embodiment of the present application applies MES, which includes a demand unit 11 , a setting unit 12 , and a platform unit 13 and the material execution unit 14, wherein the setting unit 12 may be configured in the SM, and the material execution unit 14 may be configured in the MM.
  • MES Manufacturing Execution System
  • the demand applicant provides business requirements and/or modification requirements through the demand unit 11, the setting unit 12 performs corresponding script settings according to the requirements provided by the demand unit 11, and the platform unit 13 executes the wafer script setting method provided by the embodiment of the present application.
  • the corresponding steps of realize the corresponding setting of the wafer script, and synchronize the wafer after setting information to the material execution unit 14, so that the material execution unit 14 performs the corresponding operation.
  • the data interaction between the demand unit 11, the setting unit 12, the platform unit 13 and the material execution unit 14 can be realized through the network as the medium of the communication link, and the network can include various connection types, For example, wired, wireless communication links, or fiber optic cables, among others.
  • the platform unit 13 can write corresponding programs through programming languages such as C#, VB, C++, etc., to execute the corresponding methods configured for it.
  • the module device corresponding to the platform unit 13 may be an electronic device such as a computer and a server, and the type of the electronic device is not limited in this embodiment of the present application.
  • the demand unit 11 , the setting unit 12 , and the material execution unit 14 may configure electronic devices correspondingly according to the actual situation of the MES in the actual working condition, which is not limited in the implementation of this application.
  • FIG. 2 is a schematic flowchart of a wafer script setting method provided by an embodiment of the present application. As shown in FIG. 2 , the wafer script setting method provided by this embodiment includes:
  • the requirement unit determines whether the necessary conditions for executing the script to be executed meet the business requirement according to the parameter information.
  • step S101 If satisfied, go to step S101, if not, go to step S102.
  • the platform unit acquires the batch identifier of the script to be executed and the corresponding production information.
  • the necessary conditions for execution are corresponding conditions set by the setting unit to execute the script according to business requirements.
  • the demand unit proposes corresponding script requirements according to business requirements for the wafers to be executed scripts, and the setting unit sets corresponding conditions for wafers to be executed scripts according to business requirements, that is, necessary conditions for execution. For example, take at least one of the batch type (Lot Type), the batch product number (Lot Product), the corresponding execution site, the execution status of the sub-batch script, the maximum batch quantity and the batch level as the script to be executed The corresponding implementation requirements.
  • the corresponding execution site is a site that executes the script to be executed
  • the execution status of the sub-parent batch of the script may be whether the sub-parent batch of wafers corresponding to the to-be-executed script executes the to-be-executed script.
  • one of the necessary conditions for execution may be "ABC+OPER: 005: Parameter name: XXX, value: Yes", that is, the 005th site under the ABC process needs to execute the condition that the value of XXX is equal to Yes. Execute the script.
  • the setting unit sets unique parameter information for the demand unit, and associates the parameter information with the necessary execution conditions, so that the demand unit can query the associated execution necessary conditions according to the parameter information.
  • the parameter information may be represented by at least one expression form among letters, numbers, symbols, characters, and sentences, such as "Y", ",", "@!, etc.
  • the demand unit determines whether the necessary conditions for the execution of the script to be executed meet the business requirements according to the parameter information provided by the setter, that is, the demand unit determines according to the parameter information. Whether the necessary conditions for execution set by the setting unit meet the business requirements.
  • the platform unit acquires the batch identifier corresponding to the script to be executed and the corresponding production information, so as to realize the setting step of the subsequent setting information.
  • the demand unit judges whether the execution necessary conditions meet the business requirements according to the parameter variable information, in order to ensure that the script settings for this batch of wafers by the subsequent platform unit meet the business requirements of the demand unit.
  • step S102 is executed.
  • the demand unit determines the error information of the execution necessary condition, and displays the error information to the user unit.
  • the requirement unit determines error information in the necessary conditions for execution, and displays the error information to the user unit. For example, display to the user unit through at least one display mode among the pop-up window method, the alarm method, the labeling method, and the pop-up frame method, so that the user unit can timely know that there is error information in the necessary conditions for execution, and prevent the error information from being stuck in the control.
  • the current stage affects the production process. An error message is displayed.
  • the user unit in this step can be understood as a unit of operation and maintenance personnel or an external monitoring unit in the MES, so as to be able to monitor and know the current operating status of the MES in time. Not limited.
  • the first wafer is the wafer selected by the demand unit and imported into the platform unit to execute the script to be executed for the first time.
  • the platform unit obtains the batch ID corresponding to the script to be executed and the corresponding production information. At this time, the demand unit also obtains the wafer corresponding to the script to be executed. It is judged whether the script to be executed is executed for the first time. When it is judged that the script to be executed is executed for the first time, the demand unit selects the wafer for which the script to be executed for the first time is executed, for example, by checking and confirming, and then selects the wafer for which the script to be executed is selected. That is, the wafer whose script to be executed is checked and confirmed is imported to the platform unit.
  • the wafer selected by the demand unit and imported to the platform unit for the first execution of the script to be executed is the first wafer, and the corresponding production information is Information for the first production.
  • the platform unit only needs to determine the production information of the script to be executed selected and imported by the demand unit from the production information corresponding to the script to be executed obtained in step S101, that is, to determine the first production information.
  • the first production information may be at least one of the current batch type corresponding to the first wafer, the current batch product number, the corresponding execution site, the maximum batch quantity, and the batch level. It can be understood that the first production The information is used to feed back the actual production status information of the first wafer when the material execution unit executes the script.
  • step S104 checks whether the first production information satisfies the necessary conditions for execution. If the check result is yes, step S104 is performed, and if the check result is negative, step S105 is performed.
  • the platform unit verifies whether the first production information meets the necessary conditions for execution, so as to determine whether there is a script to be executed for a wafer that does not meet the necessary conditions for execution according to the production information, so as to avoid the first wafer that does not meet the necessary conditions for execution from the source. round.
  • the platform unit sets parameter information and assignment information for the first wafer, and synchronizes the first wafer after setting information to the material execution unit, so that the material execution unit performs corresponding operations.
  • the platform unit After the platform unit verifies whether the first production information satisfies the necessary conditions for execution, if the verification result is yes, that is, the first production information satisfies the necessary conditions for execution, at this time, the platform unit sets the parameters for the first wafer information and assignment information.
  • the assignment information is an assignment agreed upon by the script to be executed corresponding to the platform unit and the first wafer.
  • the first wafer after the setting information is synchronized to the material execution unit, so that the material execution unit performs corresponding operations according to the first wafer after the setting information.
  • the platform unit realizes the setting of parameter information and assignment information for the first wafer, and can ensure that the first wafer after the information is set meets the corresponding requirements proposed by the demand unit, and there is no risk of wafer scrapping.
  • the demand unit puts forward the setting requirements, there is no need to modify the script process for each setting requirement, but based on the necessary conditions for execution, the real-time setting and immediate effect of at least one batch of wafer scripts are realized, which takes less time and implements
  • the method is simple and easy to implement, independent of the number of wafer batches, and the script setting process will not affect the overall performance of the production system.
  • the demand unit modifies the first wafer accordingly, and after the modification, the platform unit re-determines the corresponding first production information, and re-verifies whether the re-determined first production information satisfies the necessary conditions for execution, and re-verifies according to the verification result.
  • the setting unit sets the parameter information and the necessary conditions for execution according to the business requirements provided by the demand unit.
  • the demand unit determines whether the necessary conditions for the execution of the script to be executed meet the business requirements according to the parameter information. If the determination result is yes, the platform unit obtains the batch identifier of the script to be executed and the corresponding production information. If the determination result is no, the demand The unit determines the corresponding error information, and feeds back the error information to the user unit through a corresponding display mode.
  • the platform unit After determining that the necessary conditions for execution meet the business requirements, if the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time, the platform unit checks whether the first production information corresponding to the first wafer meets the necessary conditions for execution, wherein the first The wafer is the wafer selected by the demand unit and imported to the platform unit for the first execution of the to-be-executed script. The platform unit performs inspection and judgment. If the inspection result is yes, the platform unit sets parameter information and assignment information for the first wafer, and synchronizes the first wafer after setting the information to the material execution unit, so that the material execution unit Take the appropriate action.
  • the real-time setting of the script to be executed on the wafer can be realized without modifying the script process.
  • the wafer script setting method provided in this application can take effect once it is set, and the implementation process is short, and the setting process is independent of the number of batches, and will not affect the overall production efficiency.
  • step S103 describes that if the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time, the platform unit checks whether the first production information satisfies the necessary conditions for execution. On the other hand, if the demand unit determines that the script to be executed is executed for the first time If the script to be executed is not executed for the first time on the wafer corresponding to the execution script, the steps shown in the embodiment of FIG. 3 are executed.
  • FIG. 3 is a schematic flowchart of another wafer script setting method provided by the embodiment of the present application, as shown in FIG. As shown in 3, if the demand unit determines that the wafer corresponding to the to-be-executed script is not executing the to-be-executed script for the first time, the wafer script setting method provided by this embodiment includes:
  • the platform unit determines the execution state according to the batch identifier corresponding to the second wafer and the second production information.
  • the execution state includes either the execution site has passed or the execution site has not been passed, and the second wafer is a wafer for which the script to be executed is not executed for the first time.
  • the platform unit determines the current execution state of the corresponding script to be executed according to the batch identifier and production information corresponding to the second wafer, so as to clarify whether the disqualification operation can be performed on it, wherein the second wafer is not the first time
  • the second production information is the second wafer, that is, the production information corresponding to the wafer for which the script to be executed is not executed for the first time.
  • the platform unit may determine, according to the batch identifier of the script to be executed corresponding to the second wafer and the second production information, whether the execution status of the second wafer is either the execution site has passed or the execution site has not been passed.
  • the platform unit determines that the execution status is past the execution site according to the batch ID corresponding to the script to be executed of the second wafer and the second production information, it indicates that the wafer identified by the batch has executed the corresponding script to be executed, and it is not possible to The execution qualification of the second wafer is cancelled. Therefore, the platform unit will set the first label information for the corresponding second wafer, for example, label the corresponding batch identification and the second production information with the first label information such as shading, so as to The identification prohibits the disqualification operation of the wafer corresponding to the current batch identification. Specifically, the platform unit displays the batch identification and production information corresponding to the second wafer, and prohibits the demand unit from performing corresponding checking and identification of the second wafer. , which prohibits the disqualification operation on the second wafer.
  • the platform unit sets second labeling information for the second wafer to allow the disqualification operation to be performed on the second wafer.
  • the platform unit determines that the execution status is an unexecuted site according to the batch ID corresponding to the script to be executed and the second production information of the second wafer, it indicates that the wafer identified by the batch has not yet executed the corresponding script to be executed. Disqualification from execution. Therefore, the platform unit will set the second label information for the script to be executed corresponding to the corresponding second wafer to identify that the wafer corresponding to the current batch ID is allowed to perform a disqualification operation. Specifically, the platform unit will The batch identification and production information corresponding to the circle are displayed, and the demand unit is allowed to check the second wafer accordingly, that is, the disqualification operation of the second wafer is allowed.
  • step S201 the steps in step S201 can be used, that is, the platform unit will perform the execution state of the second wafer in the executing station.
  • Set the first labeling information such as labeling the corresponding batch ID and the second production information with the first labeling information such as shading, to indicate that the disqualification operation for the wafer corresponding to the current batch ID is prohibited.
  • the platform unit Display the batch identification and production information of the corresponding wafer, and prohibit the demand unit from checking and confirming the corresponding wafer, that is, prohibit the disqualification operation of the corresponding wafer.
  • the platform unit can determine that the execution status is the past execution site according to the batch ID corresponding to the script to be executed and the second production information or non-execution sites, and based on the different execution states determined, to determine which wafers that are not the first to execute the script to be executed can be disqualified. Therefore, the functional operation of batch disqualification for batch wafers is realized through the platform unit, which saves manpower and time, and avoids the risk of scrapping batches of wafers caused by manual disqualification.
  • a possible implementation manner to allow the disqualification operation on the second wafer is that the platform unit deletes the parameter information to cancel the execution of the corresponding operation on the second wafer.
  • the corresponding qualifications of the script Specifically, the platform unit deletes the parameter information, so that the to-be-executed script of the second wafer does not have the parameter information attribute, thereby achieving the purpose of canceling the corresponding qualification of the second wafer to execute the corresponding script.
  • the platform unit changes the parameter information, so that the changed parameter information does not meet the necessary conditions for execution. Specifically, the platform unit changes the parameter information, so that the changed parameter information does not match the necessary conditions for execution, that is, the necessary conditions for execution are not met. Instead of executing the current script to be executed, the purpose of canceling the execution qualification is achieved.
  • the wafer script setting method provided by the embodiment of the present application further includes the steps shown in FIG. 4 .
  • FIG. 4 is a schematic flowchart of still another wafer script setting method provided by an embodiment of the present application.
  • the platform unit obtains batches of scripts to be executed After the identification and the corresponding production information, it also includes:
  • the platform unit determines the number of batches of wafers corresponding to the script to be executed, and determines the number of batches that can be added according to the maximum number of batches.
  • the platform unit After the platform unit obtains the batch identifier of the script to be executed and the corresponding production information, the platform unit further obtains the batch quantity of wafers corresponding to the script to be executed, wherein the batch quantity can be understood as the MES system allows The number of batches of wafers to execute the script to execute. After determining the number of batches of wafers for which the script is currently to be executed, by comparing with the maximum number of batches, the number of batches that can be added can be determined, that is, the number of batches can be added.
  • the demand unit modifies the batch quantity of the third wafer so that the batch quantity corresponding to the third wafer is less than or equal to The number of batches that can be added.
  • the third wafer is the wafer selected by the demand unit to execute the script to be executed for the first time.
  • the platform unit determines that the number of batches of the third wafer is greater than the number of batches that can be added, the third wafer is selected by the demand unit to be imported to the platform unit for the first execution pending
  • the demand unit modifies the batch quantity of the selected wafer, that is, the batch quantity of the third wafer, so that the batch quantity is less than or equal to the batch quantity that can be added.
  • the modified third wafer and its corresponding batch identification and production information are imported into the platform unit.
  • the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer to the platform through the to-be-imported list unit.
  • the demand unit will assign the third wafer and the batch corresponding to the third wafer.
  • the secondary identifier and its production information are imported to the platform unit through the to-be-imported list, so that the platform unit can acquire the first wafer.
  • the platform unit judges whether the number of batches of the third wafer exceeds the number of batches that can be added by selecting the wafer for which the script to be executed for the first time is executed, that is, the third wafer. When it exceeds, the demand unit will make corresponding modifications. If the number of batches that can be added is not exceeded, the demand unit will import the third wafer and the batch identification and production information corresponding to the third wafer into the platform unit. The third wafer is the first wafer.
  • FIG. 5 is a schematic flowchart of another wafer script setting method provided by an embodiment of the present application, as shown in FIG. 5 .
  • the wafer script setting method provided by this embodiment before the demand unit imports the third wafer and its corresponding batch identification and production information to the platform unit through the to-be-imported list, further includes:
  • the setting unit sets column item content, and generates at least one data import template according to the column item content.
  • the column item content is used to represent the characteristic information of the batch identification and production information corresponding to the third wafer.
  • the setting unit sets the column item content according to the batch identifier corresponding to the third wafer and the feature information of the production information, and then generates at least one data import template according to the set column item content.
  • the column item content may include various characteristic information that can characterize the third wafer and its batch identification and production information.
  • the content of the column items can also be understood as various information that may be included in the batch identification and production information of the corresponding wafer, which is not limited in the embodiment of the present application.
  • the demand unit determines a corresponding template matching the first wafer from at least one data import template, and determines the corresponding template as a to-be-imported list.
  • the demand unit After generating at least one data import template, the demand unit determines a corresponding template matching the first wafer from the at least one data import template, and then determines the determined corresponding template as a to-be-imported list, to Import the corresponding wafer and its information to the platform unit through the to-be-imported list.
  • the demand unit imports the selected wafer for which the script to be executed for the first time is executed, that is, the third wafer and its corresponding information, to the platform unit through the to-be-imported list, it needs to be Confirm the import list.
  • the unit is set to set the column item content, and at least one data import template is generated according to the column item content, wherein the column item content is used to represent the batch ID corresponding to the third wafer and the characteristic information of the production information, and then the demand unit starts from at least one data import template.
  • a corresponding template matching the first wafer is determined in a data import template, and determined as a to-be-imported list, so as to import the corresponding wafer and its corresponding information into the platform unit. Therefore, the list to be imported is determined from at least one data import template set by the setting unit, which improves the integrity and stability of wafer script setting in MES, and ensures the verification and information setting process of subsequent platform units.
  • the smooth progress of the wafer script improves the efficiency of wafer script setting, thereby improving the overall performance of the production system.
  • FIG. 6 is a schematic structural diagram of a wafer script setting apparatus provided by an embodiment of the present application.
  • the wafer script setting apparatus 500 provided by this embodiment includes:
  • the obtaining module 501 is used for obtaining the batch identification of the script to be executed and the corresponding production information by the platform unit if the requirement unit determines that the execution necessary conditions of the script to be executed meet the business requirements according to the parameter variable information.
  • the necessary conditions for execution are corresponding conditions set by the setting unit to execute the script according to business requirements.
  • the inspection module 502 is configured to check whether the first production information corresponding to the first wafer satisfies the necessary conditions for execution if the demand unit determines that the wafer corresponding to the script to be executed executes the script to be executed for the first time.
  • the first wafer is the wafer selected by the demand unit and imported into the platform unit to execute the script to be executed for the first time.
  • the setting module 503 is used for, if the inspection result is yes, the platform unit sets parameter information and assignment information for the first wafer, and synchronizes the first wafer after setting information to the material execution unit, so that the material is executed The unit performs the corresponding action.
  • FIG. 7 is a schematic structural diagram of another wafer script setting apparatus provided by an embodiment of the present application.
  • the wafer script setting apparatus provided by this embodiment 500 further comprising: a first processing module 504 .
  • the first processing module 504 is used for the platform unit to determine the execution status according to the batch identifier corresponding to the second wafer and the second production information, and the execution status includes Executed or not executed site.
  • FIG. 8 is a schematic structural diagram of a first processing module provided by the embodiment of the present application.
  • the first processing module of the wafer script setting apparatus 500 provided by the present embodiment A processing module 504 includes: a first processing sub-unit 5041 or a second processing sub-unit 5042 .
  • the first processing sub-unit 5041 is configured to set the first labeling information for the second wafer to prohibit the disqualification operation on the second wafer if the execution status is determined to be past execution site.
  • the second processing sub-unit 5042 is configured to set the second labeling information for the second wafer by the platform unit if it is determined that the execution status is that the site has not been executed, so as to allow the disqualification operation to be performed on the second wafer.
  • the wafer script setting apparatus 500 further includes: a second processing module.
  • the second processing module is used for:
  • the platform unit deletes the parameter information to disqualify the second wafer from executing the corresponding script.
  • the platform unit changes the parameter information so that the changed parameter information does not satisfy the necessary conditions for execution.
  • the wafer script setting apparatus 500 further includes: a display module.
  • the display module is used for the demand unit to determine the error information of the necessary conditions for execution, and to display the error information to the user unit.
  • the wafer script setting apparatus 500 further includes: a third processing module.
  • the third processing module is used for:
  • the platform unit determines the number of batches of wafers corresponding to the script to be executed, and determines the number of batches that can be added according to the maximum number of batches;
  • the demand unit modifies the batch quantity of the third wafer so that the corresponding batch quantity is less than or equal to the batch quantity that can be added ;
  • the third wafer is the wafer selected by the demand unit to execute the script to be executed for the first time.
  • the demand unit imports the third wafer and the batch identification and production information corresponding to the third wafer to the platform unit through the to-be-imported list.
  • the wafer script setting apparatus 500 further includes: a fourth processing module.
  • the fourth processing module is used for:
  • the setting unit sets the column item content, and generates at least one data import template according to the column item content, and the column item content is used to represent the characteristic information of the batch identification and production information corresponding to the third wafer;
  • the requirement unit determines a corresponding template matching the first script to be executed from the at least one data import template, and determines the corresponding template as a to-be-imported list.
  • the wafer script setting device 500 further includes:
  • the fifth processing module is used for modifying the first wafer by the requesting unit if the inspection result is negative, so that the platform unit re-inspects the wafer.
  • the wafer script setting device 500 further includes:
  • the sixth processing module is used for the setting unit to set parameter variable information and execution necessary conditions according to business requirements;
  • the necessary conditions for execution include at least one of the batch type corresponding to the script to be executed, the batch product number, the corresponding execution site, the execution status of the sub-batch script, the maximum batch quantity, and the batch level;
  • the parameter information is associated with the necessary conditions for execution.
  • modules division is only a logical function division, and there may be other division manners in actual implementation.
  • multiple modules can be combined or can be integrated into another system.
  • the coupling between the various modules may be implemented through some interfaces, which are usually electrical communication interfaces, but may be mechanical interfaces or other forms of interfaces.
  • modules described as separate components may or may not be physically separate, and may be located in one place or distributed in different locations on the same or different devices.
  • the wafer script setting device provided by the above-mentioned embodiment is applied to MES, and includes a demand unit, a setting unit, a platform unit and a material execution unit, so as to execute the wafer script setting provided by the above-mentioned embodiment.
  • Fig. 9 is a schematic structural diagram of an electronic device provided by this embodiment of the application. As shown in Fig. 9, the electronic device 600 provided by this embodiment includes:
  • At least one processor 601 At least one processor 601; and
  • a memory 602 in communication with the at least one processor 601;
  • the memory 602 stores instructions that can be executed by the at least one processor 601, and the instructions are executed by the at least one processor 601, so that the at least one processor 601 can execute the various steps of the wafer script setting method in the above method embodiments, specifically Reference may be made to the relevant descriptions in the foregoing method embodiments.
  • the memory 602 may be independent or integrated with the processor 601 .
  • the electronic device 600 may further include:
  • the bus 603 is used to connect the processor 601 and the memory 602 .
  • the embodiments of the present application further provide a non-transitory computer-readable storage medium storing computer instructions, where the computer instructions are used to cause the computer to execute each step of the wafer script setting method in the above-mentioned embodiments.
  • the readable storage medium may be ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, optical data storage device, and the like.

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Abstract

一种晶圆脚本设定方法、装置、设备及存储介质，该方法包括：若需求单元根据参变量信息确定待执行脚本的执行必要条件满足业务需求，平台单元获取待执行脚本的批次标识以及对应的生产信息，在需求单元确定待执行脚本对应的晶圆首次执行待执行脚本，平台单元检验第一晶圆对应的第一生产信息是否满足执行必要条件，若是，平台单元为第一晶圆设定参变量信息以及赋值信息，并将设定信息后的第一晶圆同步至物料执行单元，以使物料执行单元执行相应操作。该方法无需修改脚本进程即可实现对待执行脚本的即时设定，从源头避开了不符合执行必要条件的待执行脚本，避免了晶圆批量报废风险的发生，并且设定过程与批次数量无关，不会对整体生产效能产生影响。

Description

晶圆脚本设定方法、装置、设备及存储介质
本申请要求于2020年11月03日提交中国专利局、申请号为202011209440.X、申请名称为“晶圆脚本设定方法、装置、设备及存储介质”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及集成电路及半导体技术领域，尤其涉及一种晶圆脚本设定方法、装置、设备及存储介质。
背景技术
随着计算机技术以及互联网技术的快速发展，集成电路产业正迎来发展的重要机遇期及挑战期。在晶圆的实际生产工况中，由于业务需求，需求申请者往往会根据实际情况需要调整晶圆执行脚本，以向执行脚本的设定者提出修改需求。
现有技术中，当需求申请者提出修改需求时，设定者都需要针对需求变更对应的执行脚本。并在变更执行脚本时，只依据需求申请者提供的批次标识进行相应修改，不但做不到实时变更，还无法核实当前批次晶圆的生产信息，极易由于修改脚本发生错误导致批量晶圆报废。此外，现有的方案中，需求申请者针对修改需求，每次都需要向设定者提交相应信息，耗时较长，尤其当同批次的晶圆数量较多时，会导致执行脚本的进程变长，影响生产系统的整体效能。
可见，针对现有方案中存在的上述问题，亟需一种解决方案。
发明内容
本申请提供一种晶圆脚本设定方法、装置、设备及存储介质，用于解决现有的晶圆执行脚本设定方案在进行晶圆的脚本变更时耗时较长、存在晶圆报废风险以及影响生产系统整体效能等技术问题。
第一方面，本申请提供一种晶圆脚本设定方法，应用于制造执行系统，所述系统包括需求单元、设定单元、平台单元及物料执行单元；所述方法包括：
若所述需求单元根据参变量信息确定待执行脚本的执行必要条件满足业务需求，则所述平台单元获取所述待执行脚本的批次标识以及对应的生产信息，所述执行必要条件为所述设定单元根据所述业务需求对所述待执行脚本设置的相应条件；
若所述需求单元确定所述待执行脚本对应的晶圆首次执行所述待执行脚本，所述 平台单元检验第一晶圆对应的第一生产信息是否满足所述执行必要条件，所述第一晶圆为所述需求单元选定并导入至所述平台单元的首次执行所述待执行脚本的晶圆；
若检验结果为是，所述平台单元为所述第一晶圆设定所述参变量信息以及赋值信息，并将设定信息后的所述第一晶圆同步至所述物料执行单元，以使所述物料执行单元执行相应操作。
在一种可能的设计中，若所述需求单元确定所述晶圆非首次执行所述待执行脚本，所述方法，还包括：
所述平台单元根据第二晶圆对应的批次标识以及第二生产信息确定执行状态，所述执行状态包括已过执行站点或未过执行站点。
在一种可能的设计中，若确定所述执行状态为所述已过执行站点，所述平台单元为所述第二晶圆设定第一标注信息，以禁止对所述第二晶圆进行取消资格操作；或者
若确定所述执行状态为所述未过执行站点，所述平台单元为所述第二晶圆设定第二标注信息，以允许对所述第二晶圆进行取消资格操作。
在一种可能的设计中，所述允许对所述第二晶圆进行取消资格操作，包括：
所述平台单元删除所述参变量信息，以取消所述第二晶圆执行对应脚本的相应资格；或者
所述平台单元变更所述参变量信息，以使变更后的参变量信息不满足所述执行必要条件。
在一种可能的设计中，若所述需求单元根据所述参变量信息确定所述待执行脚本的所述执行必要条件未满足所述业务需求，所述方法，还包括：
所述需求单元确定所述执行必要条件的错误信息，并向用户单元显示所述错误信息。
在一种可能的设计中，在所述平台单元获取所述待执行脚本的批次标识以及对应的生产信息之后，所述方法，还包括：
所述平台单元确定所述待执行脚本对应的晶圆的批次数量，并根据最大批次数量确定可添加的批次数量；
若所述平台单元确定第三晶圆批次数量大于所述可添加的批次数量，所述需求单元对所述第三晶圆的所述批次数量进行修改，以使对应的所述批次数量小于或等于所述可添加的批次数量，所述第三晶圆为所述需求单元选定的所述首次执行所述待执行脚本的晶圆；
若所述平台单元确定所述第三晶圆的批次数量不大于所述可添加的批次数量，所 述需求单元通过待导入列表将所述第三晶圆以及所述第三晶圆对应的批次标识与生产信息导入至所述平台单元。
在一种可能的设计中，在所述需求单元通过所述待导入列表将所述第三晶圆以及所述第三晶圆对应的批次标识与生产信息导入至所述平台单元之前，所述方法，还包括：
所述设定单元设置列项目内容，并根据所述列项目内容生成至少一个数据导入模板，所述列项目内容用于表征所述第三晶圆对应的批次标识和生产信息的特征信息；
所述需求单元从所述至少一个数据导入模板中确定出与所述第一晶圆相匹配的相应模板，并将所述相应模板确定为所述待导入列表。
在一种可能的设计中，若所述检验结果为否，所述需求单元对所述第一晶圆进行修改，以使所述平台单元重新进行检验。
在一种可能的设计中，在所述需求单元根据所述参变量信息确定所述待执行脚本的所述执行必要条件满足所述业务需求之前，还包括：
所述设定单元根据所述业务需求设置所述参变量信息以及所述执行必要条件；
所述执行必要条件包括所述待执行脚本对应的批次类型、批次产品号、对应执行站点、子母批次脚本执行状态、所述最大批次数量以及批次等级中的至少一项；
所述参变量信息与所述执行必要条件具有关联关系。
第二方面，本申请提供一种晶圆脚本设定装置，包括：
获取模块，用于若需求单元根据参变量信息确定待执行脚本的执行必要条件满足业务需求，则平台单元获取所述待执行脚本的批次标识以及对应的生产信息，所述执行必要条件为设定单元根据所述业务需求对所述待执行脚本设置的相应条件；
检验模块，用于若所述需求单元确定所述待执行脚本对应的晶圆首次执行所述待执行脚本，所述平台单元检验第一晶圆对应的第一生产信息是否满足所述执行必要条件，所述第一晶圆为所述需求单元选定并导入至所述平台单元的首次执行所述待执行脚本的晶圆；
设定模块，用于若检验结果为是，所述平台单元为所述第一晶圆设定所述参变量信息以及赋值信息，并将设定信息后的所述第一晶圆同步至物料执行单元，以使所述物料执行单元执行相应操作。
在一种可能的设计中，若所述需求单元确定所述晶圆非首次执行所述待执行脚本，所述装置，还包括：
第一处理模块，用于所述平台单元根据第二晶圆对应的批次标识以及第二生产信 息确定执行状态，所述执行状态包括已过执行站点或未过执行站点，所述第二晶圆为非首次执行所述待执行脚本的晶圆。
在一种可能的设计中，所述第一处理模块，包括：
第一处理子单元，用于若确定所述执行状态为所述已过执行站点，所述平台单元为所述第二晶圆设定第一标注信息，以禁止对所述第二晶圆进行取消资格操作；或者
第二处理子单元，用于若确定所述执行状态为所述未过执行站点，所述平台单元为所述第二晶圆设定第二标注信息，以允许对所述第二晶圆进行取消资格操作。
在一种可能的设计中，所述装置，还包括：第二处理模块；
所述第二处理模块，用于：
所述平台单元删除所述参变量信息，以取消所述第二晶圆执行对应脚本的相应资格；或者
所述平台单元变更所述参变量信息，以使变更后的参变量信息不满足所述执行必要条件。
在一种可能的设计中，所述装置，还包括：
显示模块，用于所述需求单元确定所述执行必要条件的错误信息，并向用户单元显示所述错误信息。
在一种可能的设计中，所述装置，还包括：第三处理模块；
所述第三处理模块，用于：
所述平台单元确定所述待执行脚本对应的晶圆的批次数量，并根据最大批次数量确定可添加的批次数量；
若所述平台单元确定第三晶圆的批次数量大于所述可添加的批次数量，所述需求单元对所述第三晶圆的所述批次数量进行修改，以使对应的所述批次数量小于或等于所述可添加的批次数量，所述第三晶圆为所述需求单元选定的所述首次执行所述待执行脚本的晶圆；
若所述平台单元确定所述第三晶圆的批次数量不大于所述可添加的批次数量，所述需求单元通过待导入列表将所述第三晶圆以及所述第三晶圆对应的批次标识与生产信息入至所述平台单元。
在一种可能的设计中，所述装置，还包括：第四处理模块；
所述第四处理模块，用于：
所述设定单元设置列项目内容，并根据所述列项目内容生成至少一个数据导入模板，所述列项目内容用于表征所述第三晶圆对应的批次标识和生产信息的特征信息；
所述需求单元从所述至少一个数据导入模板中确定出与所述第一晶圆相匹配的相应模板，并将所述相应模板确定为所述待导入列表。
在一种可能的设计中，所述装置，还包括：
第五处理模块，用于若所述检验结果为否，所述需求单元对所述第一晶圆进行修改，以使所述平台单元重新进行检验。
在一种可能的设计中，所述装置，还包括：
第六处理模块，用于所述设定单元根据所述业务需求设置所述参变量信息以及所述执行必要条件；
所述执行必要条件包括所述待执行脚本对应的批次类型、批次产品号、对应执行站点、子母批次脚本执行状态、所述最大批次数量以及批次等级中的至少一项；
所述参变量信息与所述执行必要条件具有关联关系。
第三方面，本申请提供一种电子设备，包括：
至少一个处理器；以及
与所述至少一个处理器通信连接的存储器；其中，存储器存储有可被所述至少一个处理器执行的指令，指令被所述至少一个处理器执行，以使所述至少一个处理器能够执行第一方面及第一方面的可选方案中的任意一种所述的晶圆脚本设定方法。
第四方面，本申请提供一种存储有计算机指令的非瞬时计算机可读存储介质，所述计算机指令用于使所述计算机执行第一方面及第一方面的可选方案中的任意一种所述的晶圆脚本设定方法。
本申请提供一种晶圆脚本设定方法、装置、设备及存储介质，应用于制造执行系统，该系统包括需求单元、设定单元、平台单元及物料执行单元。本申请提供的晶圆脚本设定方法，若需求单元根据参变量信息确定待执行脚本的执行必要条件满足业务需求，则平台单元获取待执行脚本的批次标识以及对应的生产信息，其中，执行必要条件为设定单元根据业务需求对待执行脚本设置的相应条件。然后，若需求单元确定待执行脚本对应的晶圆首次执行该待执行脚本，平台单元检验第一晶圆对应的第一生产信息是否满足执行必要条件，第一晶圆为需求单元选定并导入至平台单元的首次执行待执行脚本的晶圆。经过平台单元的检验，若检验结果为是，平台单元为第一晶圆设定参变量信息以及赋值信息，并将设定信息后的第一晶圆同步至物料执行单元，以使物料执行单元执行相应操作。基于平台单元以及执行必要条件，无需修改脚本进程，即可实现对晶圆的待执行脚本的即时设定，并对需求单元提交的晶圆的生产信息是否满足执行必要条件进行检验，从源头避开了不符合执行必要条件的待执行脚本，避免 了由于脚本设定错误导致晶圆批量报废风险的发生。本申请提供的晶圆脚本设定方法一旦设定即可生效，实现过程较短，并且设定过程与批次数量无关，不会对整体生产效能产生影响。
附图说明
图1为本申请实施例提供的一种应用场景示意图；
图2为本申请实施例提供的一种晶圆脚本设定方法的流程示意图；
图3为本申请实施例提供的另一种晶圆脚本设定方法的流程示意图；
图4为本申请实施例提供的再一种晶圆脚本设定方法的流程示意图；
图5为本申请实施例提供的又一种晶圆脚本设定方法的流程示意图；
图6为本申请实施例提供的一种晶圆脚本设定装置的结构示意图；
图7为本申请实施例提供的另一种晶圆脚本设定装置的结构示意图；
图8为本申请实施例提供的一种第一处理模块的结构示意图；
图9为本申请实施例提供的一种电子设备的结构示意图。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本申请相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本申请的一些方面相一致的方法和装置的例子。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请的实施例例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
目前，晶圆的生产过程往往基于制造执行系统(Manufacturing Execution System，简称MES)得以实现。在实际工况中，需求申请者往往会根据实际工况需要调整晶圆执行脚本。例如，现有方案的流程大致为，需求申请者向设定者针对每次需求提交相应的提单信息，设定者根据提单信息中的批次标识(Lot ID)对执行脚本进行相应修 改，不但无法实现实时变更，并且无法核实变更执行脚本，极易由于修改脚本发生错误导致批量晶圆报废。另外，现有方案申请者每提出一次修改需求，均需修改相应的执行进程，耗时较长，尤其当批次数量较多时，影响整个生产系统效能。
针对现有技术中的上述问题，本申请提供一种晶圆脚本设定方法、装置、设备及存储介质。本申请提供的晶圆脚本设定方法，首先，需求单元根据参变量信息确定设定单元对待执行脚本设置的相应条件，即执行必要条件是否满足业务需求，在满足的情况下，平台单元获取待执行脚本的批次标识以及对应的生产信息，进而在需求单元确定该待执行脚本对应的晶圆首次执行待执行脚本时，平台单元对需求单元选定并导入至平台单元的第一晶圆的第一生产信息，是否满足执行必要条件进行校验，在校验结果为是时，平台单元自动为第一晶圆设定参变量信息以及赋值信息，并将设定信息后的第一晶圆发送至物料执行单元，以供物料执行单元执行相应操作。基于平台单元以及执行必要条件，无需修改脚本进程，即可实现对晶圆的待执行脚本的即时设定，并对生产信息是否满足执行必要条件进行检验，从源头避开了不符合执行必要条件的待执行脚本，避免了由于脚本设定错误导致晶圆批量报废风险的发生。本申请提供的晶圆脚本设定方法一旦设定即可生效，实现过程较短，并且设定过程与批次数量无关，不会对整体生产效能产生影响。
以下，对本申请实施例的示例性应用场景进行介绍。
本申请实施例提供的晶圆脚本设定方法可以通过本申请实施例提供的晶圆脚本设定装置执行。本申请实施例提供的晶圆脚本设定方法可以应用于制造执行系统(Manufacturing Execution System，简称MES)，在MES中主要涉及到生产数据设定系统(Specification Manager，简称SM)和物料执行系统(Material Manager，简称MM)。图1为本申请实施例提供的一种应用场景示意图，如图1所示，本申请实施例提供的晶圆脚本设定方法应用MES，其包括有需求单元11、设定单元12、平台单元13以及物料执行单元14，其中，设定单元12可以被配置于SM中，物料执行单元14可以被配置于MM中。需求申请者通过需求单元11提供业务需求和/或修改需求，设定单元12根据需求单元11提供的需求进行相应脚本设置，平台单元13通过执行本申请实施例提供的晶圆脚本设定方法中的相应步骤，实现对晶圆脚本的相应设定，并将设定信息后的晶圆同步至物料执行单元14，以使物料执行单元14执行相应操作。需要说明的是，MES中，需求单元11、设定单元12、平台单元13以及物料执行单元14之间的数据交互可以通过网络作为通信链路的介质得以实现，网络可以包括各种连接类型，例如有线、无线通信链路或者光纤电缆等等。另外，平台单元13可以通过例 如C#、VB、C++等编程语言进行相应程序的编写，以执行为其配置的相应方法。平台单元13对应的模块装置可以是计算机、服务器等电子设备，对于电子设备的类型本申请实施例不作限定。需求单元11、设定单元12以及物料执行单元14可以根据MES在实际工况中的实际情况相应配置电子设备，对此，本申请实施不作限定。
值得说明的是，上述应用场景仅仅是示意性的，本申请实施例提供的晶圆脚本设定方法包括但不仅限于上述应用场景。
下面以具体地实施例对本申请的技术方案以及本申请的技术方案如何解决上述技术问题进行详细说明。下面这几个具体的实施例可以相互结合，对于相同或相似的概念或过程可能在某些实施例中不再赘述。下面将结合附图，对本申请的实施例进行描述。
图2为本申请实施例提供的一种晶圆脚本设定方法的流程示意图，如图2所示，本实施例提供的晶圆脚本设定方法，包括：
S100：需求单元根据参变量信息确定待执行脚本的执行必要条件是否满足业务需求。
若满足，执行步骤S101，若未满足，执行步骤S102。
S101：若需求单元根据参变量信息确定待执行脚本的执行必要条件满足业务需求，则平台单元获取待执行脚本的批次标识以及对应的生产信息。
其中，执行必要条件为设定单元根据业务需求对待执行脚本设置的相应条件。
需求单元根据业务需求对待执行脚本的晶圆提出相应脚本需求，设定单元根据业务需求对待执行脚本的晶圆设置相应条件，即执行必要条件。例如，将批次类型(Lot Type)、批次产品号(Lot Product)、对应执行站点、子母批次脚本执行状态、最大批次数量以及批次等级中的至少一项作为该待执行脚本对应的执行必要条件。其中，对应执行站点为执行该待执行脚本的站点，子母批次脚本执行状态可以为该待执行脚本对应的子母批次晶圆是否执行该待执行脚本。例如，所设置的一种执行必要条件可以是“ABC+OPER：005：Parameter name：XXX，value：Yes”，即在ABC流程下的第005的站点要执行XXX的value等于Yes的条件的待执行脚本。
同时，设定单元针对需求单元设置唯一的参变量信息，并将参变量信息与执行必要条件进行关联，以使需求单元根据参变量信息可以查询到与其关联的执行必要条件。其中，参变量信息可以通过字母、数字、符号、字符以及语句中的至少一种表现形式进行体现，例如“Y”，“、”，“@！”等体现。
设定者设置了待执行脚本的必要条件和参变量信息之后，需求单元根据设定者提 供的参变量信息对待执行脚本的执行必要条件是否满足业务需求进行确定，即需求单元根据参变量信息确定设定单元所设置的执行必要条件是否满足业务需求。在经过确定之后，若确定满足，则平台单元获取待执行脚本对应的批次标识以及对应的生产信息，以实现后续设定信息的设定步骤。其中，本步骤中需求单元根据参变量信息对执行必要条件是否满足业务需求进行判断，是为了保证后续平台单元对本批次晶圆的脚本设定符合需求单元的业务需求。
相应地，若需求单元根据参变量信息确定执行必要条件未满足业务需求，则表明所设置的执行必要条件中存在错误信息，执行步骤S102。
S102：需求单元确定执行必要条件的错误信息，并向用户单元显示错误信息。
当需求单元确定执行必要条件未满足业务需求，则进一步地，需求单元确定出执行必要条件中的错误信息，并向用户单元显示错误信息。例如，通过弹窗方式、警报方式、标注方式以及弹框方式中的至少一种显示方式向用户单元进行显示，以使用户单元及时获知执行必要条件中存在错误信息，避免错误信息被卡控在当前阶段，影响生产进程。显示错误信息。需要说明的是，本步骤中的用户单元可以理解为MES中的运维人员单元或外部监控单元等等，以能够及时监控并获知MES的当前运行状况的一单元，对此，本申请实施例不作限定。
S103：若需求单元确定待执行脚本对应的晶圆首次执行待执行脚本，平台单元检验第一晶圆对应的第一生产信息是否满足执行必要条件。
其中，第一晶圆为需求单元选定并导入至平台单元的首次执行待执行脚本的晶圆。
在需求单元确定了待执行脚本的执行必要条件满足业务需求时，平台单元获取该待执行脚本对应的批次标识以及对应的生产信息，此时，需求单元还对该待执行脚本对应的晶圆是否首次执行待执行脚本进行判断，当判断为首次执行，需求单元对该首次执行待执行脚本的晶圆进行选定，例如进行勾选确认，并将选定后的待执行脚本的晶圆，即勾选确认的待执行脚本的晶圆导入至平台单元，因而，被需求单元选定并导入至平台单元的首次执行待执行脚本的晶圆即为第一晶圆，其对应的生产信息即为第一生产信息。具体地，平台单元仅需从步骤S101中获取到的待执行脚本对应的生产信息中确定出被需求单元选定并导入的待执行脚本的生产信息，即确定出第一生产信息。其中，第一生产信息可以为第一晶圆对应当前批次类型、当前批次产品号、对应执行站点、最大批次数量以及批次等级中的至少一种，可以理解的是，第一生产信息用于反馈第一晶圆在物料执行单元执行脚本时的实际生产状态信息。
进一步地，平台单元检验第一生产信息是否满足执行必要条件，若检验结果为是， 执行步骤S104，若检验结果为否，则执行步骤S105。
平台单元对第一生产信息是否满足执行必要条件进行校验，以根据生产信息确定是否存在不满足执行必要条件的晶圆的待执行脚本，以从源头避开不符合执行必要条件的第一晶圆。
S104：若检验结果为是，平台单元为第一晶圆设定参变量信息以及赋值信息，并将设定信息后的第一晶圆同步至物料执行单元，以使物料执行单元执行相应操作。
在平台单元对第一生产信息进行是否满足执行必要条件进行校验之后，若校验结果为是，即第一生产信息满足执行必要条件，此时，平台单元为第一晶圆设定参变量信息以及赋值信息。其中，赋值信息为平台单元与第一晶圆对应的待执行脚本约定的赋值。并将设定信息之后的第一晶圆同步至物料执行单元，以使物料执行单元根据设定信息后的第一晶圆执行相应操作。
至此，平台单元实现对第一晶圆设定参变量信息以及赋值信息，并且能够保证设定信息后的第一晶圆满足需求单元提出的相应需求，不存在晶圆报废风险。当需求单元提出设定需求时，无需针对每次设定需求对脚本进程进行修改，而是基于执行必要条件实现至少一批次晶圆脚本的即时设定和即时生效，耗时较少，实施方式简单易行，并与晶圆的批次数量无关，脚本设定过程不会对生产系统的整体效能产生影响。
S105：若检验结果为否，需求单元对第一晶圆进行修改，以使平台单元重新进行检验。
若平台单元检验第一生产信息不满足执行必要条件，例如，可能由于系统的作业时间差，导致第一生产信息已经过站，不满足之前设置的执行必要条件。因而，需求单元对第一晶圆进行相应修改，修改之后平台单元重新确定对应的第一生产信息，并重新确定后的第一生产信息是否满足执行必要条件重新进行校验，以及根据校验结果执行后续相应步骤。
本申请提供的晶圆脚本设定方法，设定单元根据需求单元提供的业务需求设定参变量信息以及执行必要条件。首先，需求单元根据参变量信息确定待执行脚本的执行必要条件是否满足业务需求，若确定结果为是，平台单元获取待执行脚本的批次标识以及对应的生产信息，若确定结果为否，需求单元确定出相应的错误信息，并通过相应的显示方式向用户单元反馈错误信息。在确定执行必要条件满足业务需求之后，若需求单元确定待执行脚本对应的晶圆首次执行待执行脚本，平台单元检验第一晶圆对应的第一生产信息是否满足执行必要条件，其中，第一晶圆为需求单元选定并导入至平台单元的首次执行待执行脚本的晶圆。平台单元进行检验判断，若检验结果为是， 平台单元为第一晶圆设定参变量信息以及赋值信息，并将设定信息后的第一晶圆同步至物料执行单元，以使物料执行单元执行相应操作。基于平台单元及执行必要条件，无需修改脚本进程，即可实现对晶圆的待执行脚本的即时设定，并通过检验步骤，从源头避开了不符合执行必要条件的待执行脚本，避免了由于脚本设定错误导致晶圆批量报废风险的发生。本申请提供的晶圆脚本设定方法一旦设定即可生效，实现过程较短，并且设定过程与批次数量无关，不会对整体生产效能产生影响。
在上述实施例中，步骤S103描述了若需求单元确定待执行脚本对应的晶圆首次执行待执行脚本，平台单元检验第一生产信息是否满足执行必要条件，而另一方面，若需求单元确定待执行脚本对应的晶圆非首次执行该待执行脚本，则执行如图3实施例所示的步骤，图3为本申请实施例提供的另一种晶圆脚本设定方法的流程示意图，如图3所示，若需求单元确定待执行脚本对应的晶圆非首次执行待执行脚本，本实施例提供的晶圆脚本设定方法，包括：
S200：平台单元根据第二晶圆对应的批次标识以及第二生产信息确定执行状态。
其中，执行状态包括已过执行站点或未过执行站点，第二晶圆为非首次执行待执行脚本的晶圆。
需求单元确定待执行脚本对应的晶圆非首次执行待执行脚本，则表明有可能可以对当前的待执行脚本对应的晶圆可以进行取消执行资格操作。因而，平台单元根据第二晶圆对应的批次标识以及生产信息确定该对应的待执行脚本的当前执行状态，以明确是否可以对其进行取消执行资格操作，其中，第二晶圆为非首次执行待执行脚本的晶圆，第二生产信息为第二晶圆，即非首次执行待执行脚本的晶圆对应的生产信息。具体地，平台单元可以根据第二晶圆对应的待执行脚本的批次标识和第二生产信息确定第二晶圆的执行状态为已过执行站点还是未过执行站点。
S201：若确定执行状态为已过执行站点，平台单元为第二晶圆设定第一标注信息，以禁止对第二晶圆进行取消资格操作。
在平台单元根据第二晶圆的待执行脚本对应的批次标识和第二生产信息确定执行状态为已过执行站点，则表明该批次标识的晶圆已执行对应的待执行脚本，不可以取消第二晶圆的执行资格，因而，平台单元会对对应的第二晶圆设定第一标注信息，例如对相应的批次标识和第二生产信息标注底纹等第一标注信息，以标识禁止对当前批次标识对应的晶圆执行取消资格操作，具体地，平台单元将第二晶圆对应的批次标识和生产信息进行显示，禁止需求单元对第二晶圆进行相应勾选认定，即禁止对第二晶圆进行取消资格操作。
S202：若确定执行状态为未过执行站点，平台单元为第二晶圆设定第二标注信息，以允许对第二晶圆进行取消资格操作。
在平台单元根据第二晶圆的待执行脚本对应的批次标识和第二生产信息确定执行状态为未过执行站点，则表明该批次标识的晶圆还未执行对应的待执行脚本，可以取消执行资格。因而，平台单元会对对应的第二晶圆对应的待执行脚本设定第二标注信息，以标识允许对当前批次标识对应的晶圆执行取消资格操作，具体地，平台单元将第二晶圆对应的批次标识和生产信息进行显示，允许需求单元对第二晶圆进行相应勾选认定，即允许对第二晶圆进行取消资格操作。
值得说明的是，执行状态可能还存在正在执行站点，而在实际工况中，
由于MES生产系统的卡控，无法编辑正在进行生产的晶圆的参变量信息及生产信息，因此可以采用步骤S201中的步骤进行，即平台单元会对执行状态处于正在执行站点的第二晶圆设定第一标注信息，例如对相应的批次标识和第二生产信息标注底纹等第一标注信息，以标识禁止对当前批次标识对应的晶圆执行取消资格操作，具体地，平台单元将对应晶圆的批次标识和生产信息进行显示，禁止需求单元对对应的晶圆进行相应勾选认定，即禁止对对应的晶圆进行取消资格操作。
上述实施例提供的晶圆脚本设定方法，若需求单元确定待执行脚本非首次执行的脚本，平台单元可以根据待执行脚本对应的批次标识以及第二生产信息确定执行状态为已过执行站点或未过执行站点，并根据所确定的不同的执行状态，以确定可以对哪些非首次执行待执行脚本的晶圆进行取消资格操作。从而，通过平台单元对批量晶圆实现批量取消执行资格的功能操作，节省人力及时间，避免了人为取消执行资格导致批量晶圆报废风险发生。
在一种可能的设计中，上述图3所示实施例中，允许对第二晶圆进行取消资格操作的一种可能实现方式是，平台单元删除参变量信息，以取消第二晶圆执行对应脚本的相应资格。具体地，平台单元将参变量信息进行删除，使得第二晶圆的待执行脚本中不具备参变量信息属性，从而达到取消第二晶圆执行对应脚本的相应资格的目的。
另一种可能实现方式是，平台单元变更参变量信息，以使变更后的参变量信息不满足执行必要条件。具体地，平台单元变更参变量信息，使得变更后的参变量信息与执行必要条件不匹配，即不满足执行必要条件，此时，物料执行单元由于变更后的参变量信息不符合执行必要条件，而不执行当前待执行脚本，进而达到取消执行资格的目的。
在一种可能的设计中，在步骤S101之后，本申请实施例提供的晶圆脚本设定方法， 还包括如图4所示步骤。图4为本申请实施例提供的再一种晶圆脚本设定方法的流程示意图，如图4所示，本实施例提供的晶圆脚本设定方法，在平台单元获取待执行脚本的批次标识以及对应的生产信息之后，还包括：
S301：平台单元确定待执行脚本对应的晶圆的批次数量，并根据最大批次数量确定可添加的批次数量。
在平台单元获取了待执行脚本的批次标识和对应的生产信息之后，进一步地，平台单元还获取该待执行脚本对应的晶圆的批次数量，其中，批次数量可以理解为MES系统允许执行待执行脚本的批次晶圆的数量。在确定了当前待执行脚本的晶圆的批次数量之后，通过与最大批次数量进行比较，则可以确定出还可以添加的批次数量，即可添加批次数量。
S302：若平台单元确定第三晶圆的批次数量大于可添加的批次数量，需求单元对第三晶圆的批次数量进行修改，以使第三晶圆对应的批次数量小于或等于可添加的批次数量。
其中，第三晶圆为需求单元选定的首次执行待执行脚本的晶圆。
在确定出可添加的批次数量之后，若平台单元确定第三晶圆的批次数量大于可添加批次数量，其中，第三晶圆为需求单元选定将导入至平台单元的首次执行待执行脚本的晶圆，则需求单元对已选定的晶圆的批次数量，即第三晶圆的批次数量进行修改，使其批次数量小于或等于可添加的批次数量。之后，再将修改后的第三晶圆及其对应的批次标识和生产信息导入至平台单元。
S303：若平台单元确定第三晶圆的批次数量不大于可添加的批次数量，需求单元通过待导入列表将第三晶圆以及第三晶圆对应的批次标识与生产信息导入至平台单元。
另一方面，若平台单元确定需求单元选定的待导入平台单元的第三晶圆的批次数量未超过可添加批次数量，则需求单元将第三晶圆以及第三晶圆对应的批次标识及其生产信息通过待导入列表导入至平台单元，以使平台单元获取到第一晶圆。
本申请实施例提供的晶圆脚本设定方法，平台单元通过对需求单元选定的首次执行待执行脚本的晶圆，即第三晶圆的批次数量是否超过可添加批次数量的判断，当超过时，由需求单元进行相应修改，在未超过可添加批次数量的情况下，需求单元将第三晶圆以及第三晶圆对应的批次标识和生产信息导入平台单元，导入后的第三晶圆即为第一晶圆。从而保证了后续平台单元进行校验以及信息设定流程的流畅进行，以提高晶圆脚本设定的效率，进而提高生产系统的整体效能。
图4所示实施例中，需求单元通过待导入列表，将第三晶圆及其对应的批次标识 和生产信息导入至平台单元。因而，在一种可能的设计中，确定待导入列表的一种可能的实现方式如图5所示，图5为本申请实施例提供的又一种晶圆脚本设定方法的流程示意图，如图5所示，本实施例提供的晶圆脚本设定方法，在需求单元通过待导入列表将第三晶圆及其对应的批次标识和生产信息导入至平台单元之前，还包括：
S401：设定单元设置列项目内容，并根据列项目内容生成至少一个数据导入模板。
其中，列项目内容用于表征第三晶圆对应的批次标识和生产信息的特征信息。
设定单元根据第三晶圆对应的批次标识和生产信息的特征信息设置列项目内容，进而根据所设置的列项目内容生成至少一个数据导入模板。其中，列项目内容可以包括能够表征第三晶圆及其批次标识和生产信息的各种特征信息。列项目内容也可以理解为对应晶圆的批次标识及生产信息可能包括的各种信息，对此本申请实施例不作限定。在设置了列项目内容之后，基于此，生成至少一个数据导入模板，其中数据导入模板中包括有一个或多个列项目内容。
S402：需求单元从至少一个数据导入模板中确定出与第一晶圆相匹配的相应模板，并将相应模板确定为待导入列表。
在生成了至少一个数据导入模板之后，需求单元从该至少一个数据导入模板中确定出与第一晶圆相匹配的相应模板，进而，将所确定出的该相应模板确定为待导入列表，以通过待导入列表对相应晶圆及其信息导入至平台单元。
本申请实施例提供的晶圆脚本设定方法，在需求单元通过待导入列表将所选定的首次执行待执行脚本的晶圆，即第三晶圆及其相应信息导入至平台单元之前，需确定导入列表。首先设定单元设置列项目内容，并根据列项目内容生成至少一个数据导入模板，其中，列项目内容用于表征第三晶圆对应的批次标识及生产信息的特征信息，然后需求单元从至少一个数据导入模板中确定出与第一晶圆相匹配的相应模板，并将其确定为待导入列表，以将对应晶圆及其相应信息导入至平台单元。从而通过设定单元设置的至少一个数据导入模板中确定出待导入列表，提高了在MES中实现晶圆脚本设定的整体性和稳定性，保证了后续平台单元进行校验以及信息设定流程的流畅进行，提高了晶圆脚本设定效率，进而提高生产系统的整体效能。
下述为本申请装置实施例，可以用于执行本申请方法实施例。对于本申请装置实施例中未披露的细节，请参照本申请方法实施例。
图6为本申请实施例提供的一种晶圆脚本设定装置的结构示意图，如图6所示，本实施例提供的晶圆脚本设定装置500，包括：
获取模块501，用于若需求单元根据参变量信息确定待执行脚本的执行必要条件 满足业务需求，则平台单元获取待执行脚本的批次标识以及对应的生产信息。
其中，执行必要条件为设定单元根据业务需求对待执行脚本设置的相应条件。
检验模块502，用于若需求单元确定待执行脚本对应的晶圆首次执行待执行脚本，平台单元检验第一晶圆对应的第一生产信息是否满足执行必要条件。
其中，第一晶圆为需求单元选定并导入至平台单元的首次执行待执行脚本的晶圆。
设定模块503，用于若检验结果为是，平台单元为第一晶圆设定参变量信息以及赋值信息，并将设定信息后的第一晶圆同步至物料执行单元，以使物料执行单元执行相应操作。
在图6所示实施例的基础上，图7为本申请实施例提供的另一种晶圆脚本设定装置的结构示意图，如图7所示，本实施例提供的晶圆脚本设定装置500，还包括：第一处理模块504。
若需求端单元确定晶圆非首次执行待执行的脚本，则第一处理模块504，用于平台单元根据第二晶圆对应的批次标识以及第二生产信息确定执行状态，执行状态包括已过执行站点或未过执行站点。
在图7所示实施例的基础上，图8为本申请实施例提供的一种第一处理模块的结构示意图，如图8所示，本实施例提供的晶圆脚本设定装置500的第一处理模块504，包括：第一处理子单元5041或第二处理子单元5042。
第一处理子单元5041，用于若确定执行状态为已过执行站点，平台单元为第二晶圆设定第一标注信息，以禁止对第二晶圆进行取消资格操作。
第二处理子单元5042，用于若确定执行状态为未过执行站点，平台单元为第二晶圆设定第二标注信息，以允许对第二晶圆进行取消资格操作。
在一种可能的设计中，晶圆脚本设定装置500，还包括：第二处理模块。
其中，第二处理模块，用于：
平台单元删除参变量信息，以取消第二晶圆执行对应脚本的相应资格；或者
平台单元变更参变量信息，以使变更后的参变量信息不满足执行必要条件。
在一种可能的设计中，晶圆脚本设定装置500，还包括：显示模块。
其中，显示模块，用于需求单元确定执行必要条件的错误信息，并向用户单元显示错误信息。
在一种可能的设计中，晶圆脚本设定装置500，还包括：第三处理模块。
其中，第三处理模块，用于：
平台单元确定待执行脚本对应的晶圆的批次数量，并根据最大批次数量确定可添 加的批次数量；
若平台单元确定第三晶圆的批次数量大于可添加的批次数量，需求单元对第三晶圆的批次数量进行修改，以使对应的批次数量小于或等于可添加的批次数量；
其中，第三晶圆为需求单元选定的首次执行待执行脚本的晶圆。
若平台单元确定第三晶圆的批次数量不大于可添加的批次数量，需求单元通过待导入列表将第三晶圆以及第三晶圆对应的批次标识与生产信息导入至平台单元。
在一种可能的设计中，晶圆脚本设定装置500，还包括：第四处理模块。
其中，第四处理模块，用于：
设定单元设置列项目内容，并根据列项目内容生成至少一个数据导入模板，列项目内容用于表征第三晶圆对应的批次标识和生产信息的特征信息；
需求单元从至少一个数据导入模板中确定出与第一待执行脚本相匹配的相应模板，并将相应模板确定为待导入列表。
在一种可能的设计中，晶圆脚本设定装置500，还包括：
第五处理模块，用于若检验结果为否，需求单元对第一晶圆进行修改，以使平台单元重新进行检验。
在一种可能的设计中，晶圆脚本设定装置500，还包括：
第六处理模块，用于设定单元根据业务需求设置参变量信息以及执行必要条件；
执行必要条件包括待执行脚本对应的批次类型、批次产品号、对应执行站点、子母批次脚本执行状态、最大批次数量以及批次等级中的至少一项；
参变量信息与执行必要条件具有关联关系。
本申请所提供的上述装置实施例仅仅是示意性的，其中的模块划分仅仅是一种逻辑功能划分，实际实现时可以有另外的划分方式。例如多个模块可以结合或者可以集成到另一个系统。各个模块相互之间的耦合可以是通过一些接口实现，这些接口通常是电性通信接口，但是也不排除可能是机械接口或其它的形式接口。因此，作为分离部件说明的模块可以是或者也可以不是物理上分开的，既可以位于一个地方，也可以分布到同一个或不同设备的不同位置上。
值得说明的，上述所示实施例提供的晶圆脚本设定装置，应用于MES，包括需求单元、设定单元、平台单元及物料执行单元，以执行上述实施例提供的晶圆脚本设定的对应步骤，具体实现方式、原理以及技术效果与前述方法实施例类似，在此不再赘述。
图9为本申请实施例提供的一种电子设备的结构示意图，如图9所示，本实施例 提供的电子设备600，包括：
至少一个处理器601；以及
与至少一个处理器601通信连接的存储器602；其中，
存储器602存储有可被至少一个处理器601执行的指令，指令被至少一个处理器601执行，以使至少一个处理器601能够执行上述方法实施例中的晶圆脚本设定方法的各个步骤，具体可以参考前述方法实施例中的相关描述。
可选地，存储器602既可以是独立的，也可以跟处理器601集成在一起。
当存储器602是独立于处理器601之外的器件时，电子设备600，还可以包括：
总线603，用于连接处理器601以及存储器602。
此外，本申请实施例还提供一种存储有计算机指令的非瞬时计算机可读存储介质，计算机指令用于使计算机执行上述各实施例中的晶圆脚本设定方法的各个步骤。例如，可读存储介质可以是ROM、随机存取存储器(RAM)、CD-ROM、磁带、软盘和光数据存储设备等。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本申请的其它实施方案。本申请旨在涵盖本申请的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本申请的真正范围和精神由权利要求书指出。
应当理解的是，本申请并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本申请的范围仅由所附的权利要求书来限制。

Claims (20)

  1. 一种晶圆脚本设定方法，其特征在于，应用于制造执行系统，所述系统包括需求单元、设定单元、平台单元及物料执行单元；所述方法包括：
    若所述需求单元根据参变量信息确定待执行脚本的执行必要条件满足业务需求，则所述平台单元获取所述待执行脚本的批次标识以及对应的生产信息，所述执行必要条件为所述设定单元根据所述业务需求对所述待执行脚本设置的相应条件；
    若所述需求单元确定所述待执行脚本对应的晶圆首次执行所述待执行脚本，所述平台单元检验第一晶圆对应的第一生产信息是否满足所述执行必要条件，所述第一晶圆为所述需求单元选定并导入至所述平台单元的首次执行所述待执行脚本的晶圆；
    若检验结果为是，所述平台单元为所述第一晶圆设定所述参变量信息以及赋值信息，并将设定信息后的所述第一晶圆同步至所述物料执行单元，以使所述物料执行单元执行相应操作。
  2. 根据权利要求1所述的晶圆脚本设定方法，其特征在于，若所述需求单元确定所述晶圆非首次执行所述待执行脚本，所述方法，还包括：
    所述平台单元根据第二晶圆对应的批次标识以及第二生产信息确定执行状态，所述执行状态包括已过执行站点或未过执行站点，所述第二晶圆为非首次执行所述待执行脚本的晶圆。
  3. 根据权利要求2所述的晶圆脚本设定方法，其特征在于，若确定所述执行状态为所述已过执行站点，所述平台单元为所述第二晶圆设定第一标注信息，以禁止对所述第二晶圆进行取消资格操作；或者
    若确定所述执行状态为所述未过执行站点，所述平台单元为所述第二晶圆设定第二标注信息，以允许对所述第二晶圆进行取消资格操作。
  4. 根据权利要求3所述的晶圆脚本设定方法，其特征在于，所述允许对所述第二晶圆进行取消资格操作，包括：
    所述平台单元删除所述参变量信息，以取消所述第二晶圆执行对应脚本的相应资格；或者
    所述平台单元变更所述参变量信息，以使变更后的参变量信息不满足所述执行必要条件。
  5. 根据权利要求1-4任一项所述的晶圆脚本设定方法，其特征在于，若所述需求单元根据所述参变量信息确定所述待执行脚本的所述执行必要条件未满足所述业务需 求，所述方法，还包括：
    所述需求单元确定所述执行必要条件的错误信息，并向用户单元显示所述错误信息。
  6. 根据权利要求5所述的所述的晶圆脚本设定方法，其特征在于，在所述平台单元获取所述待执行脚本的批次标识以及对应的生产信息之后，所述方法，还包括：
    所述平台单元确定所述待执行脚本对应的晶圆的批次数量，并根据最大批次数量确定可添加的批次数量；
    若所述平台单元确定第三晶圆的批次数量大于所述可添加的批次数量，所述需求单元对所述第三晶圆的所述批次数量进行修改，以使对应的所述批次数量小于或等于所述可添加的批次数量，所述第三晶圆为所述需求单元选定的所述首次执行所述待执行脚本的晶圆；
    若所述平台单元确定所述第三晶圆的批次数量不大于所述可添加的批次数量，所述需求单元通过待导入列表将所述第三晶圆以及所述第三晶圆对应的批次标识与生产信息导入至所述平台单元。
  7. 根据权利要求6所述的晶圆脚本设定方法，其特征在于，在所述需求单元通过所述待导入列表将所述第三晶圆以及所述第三晶圆对应的批次标识与生产信息导入至所述平台单元之前，所述方法，还包括：
    所述设定单元设置列项目内容，并根据所述列项目内容生成至少一个数据导入模板，所述列项目内容用于表征所述第三晶圆对应的批次标识和生产信息的特征信息；
    所述需求单元从所述至少一个数据导入模板中确定出与所述第一晶圆相匹配的相应模板，并将所述相应模板确定为所述待导入列表。
  8. 根据权利要求7所述的晶圆脚本设定方法，其特征在于，若所述检验结果为否，所述需求单元对所述第一晶圆进行修改，以使所述平台单元重新进行检验。
  9. 根据权利要求8所述的晶圆脚本设定方法，其特征在于，在所述需求单元根据所述参变量信息确定所述待执行脚本的所述执行必要条件满足所述业务需求之前，还包括：
    所述设定单元根据所述业务需求设置所述参变量信息以及所述执行必要条件；
    所述执行必要条件包括所述待执行脚本对应的批次类型、批次产品号、对应执行站点、子母批次脚本执行状态、所述最大批次数量以及批次等级中的至少一项；
    所述参变量信息与所述执行必要条件具有关联关系。
  10. 一种晶圆脚本设定装置，其特征在于，包括：
    获取模块，用于若需求单元根据参变量信息确定待执行脚本的执行必要条件满足业务需求，则平台单元获取所述待执行脚本的批次标识以及对应的生产信息，所述执行必要条件为设定单元根据所述业务需求对所述待执行脚本设置的相应条件；
    检验模块，用于若所述需求单元确定所述待执行脚本对应的晶圆首次执行所述待执行脚本，所述平台单元检验第一晶圆对应的第一生产信息是否满足所述执行必要条件，所述第一晶圆为所述需求单元选定并导入至所述平台单元的首次执行所述待执行脚本的晶圆；
    设定模块，用于若检验结果为是，所述平台单元为所述第一晶圆设定所述参变量信息以及赋值信息，并将设定信息后的所述第一晶圆同步至物料执行单元，以使所述物料执行单元执行相应操作。
  11. 根据权利要求10所述的晶圆脚本设定装置，其特征在于，若所述需求单元确定所述晶圆非首次执行所述待执行脚本，所述装置，还包括：
    第一处理模块，用于所述平台单元根据第二晶圆对应的批次标识以及第二生产信息确定执行状态，所述执行状态包括已过执行站点或未过执行站点，所述第二晶圆为非首次执行所述待执行脚本的晶圆。
  12. 根据权利要求11所述的晶圆脚本设定装置，其特征在于，所述第一处理模块，包括：
    第一处理子单元，用于若确定所述执行状态为所述已过执行站点，所述平台单元为所述第二晶圆设定第一标注信息，以禁止对所述第二晶圆进行取消资格操作；或者
    第二处理子单元，用于若确定所述执行状态为所述未过执行站点，所述平台单元为所述第二晶圆设定第二标注信息，以允许对所述第二晶圆进行取消资格操作。
  13. 根据权利要求12所述的晶圆脚本设定装置，其特征在于，所述装置，还包括：第二处理模块；所述第二处理模块，用于：
    所述平台单元删除所述参变量信息，以取消所述第二晶圆执行对应脚本的相应资格；或者
    所述平台单元变更所述参变量信息，以使变更后的参变量信息不满足所述执行必要条件。
  14. 根据权利要求10-13任一项所述的晶圆脚本设定装置，其特征在于，所述装置，还包括：
    显示模块，用于所述需求单元确定所述执行必要条件的错误信息，并向用户单元显示所述错误信息。
  15. 根据权利要求14所述的晶圆脚本设定装置，其特征在于，所述装置，还包括：第三处理模块；所述第三处理模块，用于：
    所述平台单元确定所述待执行脚本对应的晶圆的批次数量，并根据最大批次数量确定可添加的批次数量；
    若所述平台单元确定第三晶圆的批次数量大于所述可添加的批次数量，所述需求单元对所述第三晶圆的所述批次数量进行修改，以使对应的所述批次数量小于或等于所述可添加的批次数量，所述第三晶圆为所述需求单元选定的所述首次执行所述待执行脚本的晶圆；
    若所述平台单元确定所述第三晶圆的批次数量不大于所述可添加的批次数量，所述需求单元通过待导入列表将所述第三晶圆以及所述第三晶圆对应的批次标识与生产信息入至所述平台单元。
  16. 根据权利要求15所述的晶圆脚本设定装置，其特征在于，所述装置，还包括：第四处理模块；所述第四处理模块，用于：
    所述设定单元设置列项目内容，并根据所述列项目内容生成至少一个数据导入模板，所述列项目内容用于表征所述第三晶圆对应的批次标识和生产信息的特征信息；
    所述需求单元从所述至少一个数据导入模板中确定出与所述第一晶圆相匹配的相应模板，并将所述相应模板确定为所述待导入列表。
  17. 根据权利要求16所述的晶圆脚本设定装置，其特征在于，所述装置，还包括：
    第五处理模块，用于若所述检验结果为否，所述需求单元对所述第一晶圆进行修改，以使所述平台单元重新进行检验。
  18. 根据权利要求17所述的晶圆脚本设定装置，其特征在于，所述装置，还包括：
    第六处理模块，用于所述设定单元根据所述业务需求设置所述参变量信息以及所述执行必要条件；
    所述执行必要条件包括所述待执行脚本对应的批次类型、批次产品号、对应执行站点、子母批次脚本执行状态、所述最大批次数量以及批次等级中的至少一项；
    所述参变量信息与所述执行必要条件具有关联关系。
  19. 一种电子设备，其特征在于，包括：
    至少一个处理器；以及
    与所述至少一个处理器通信连接的存储器；其中，存储器存储有可被所述至少一个处理器执行的指令，指令被所述至少一个处理器执行，以使所述至少一个处理器能够执行权利要求1-9中任一项所述的晶圆脚本设定方法。
  20. 一种存储有计算机指令的非瞬时计算机可读存储介质，其特征在于，所述计算机指令用于使所述计算机执行权利要求1-9中任一项所述的晶圆脚本设定方法。
PCT/CN2021/099502 2020-11-03 2021-06-10 晶圆脚本设定方法、装置、设备及存储介质 Ceased WO2022095448A1 (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115879665A (zh) * 2023-02-17 2023-03-31 希维科技(广州)有限公司 确定产品配置的检验要求、标识产品配置的方法及设备
CN116774990A (zh) * 2023-08-25 2023-09-19 合肥晶合集成电路股份有限公司 一种半导体机台的产品程式管理系统及管理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115061437B (zh) * 2022-06-14 2026-03-13 长鑫存储技术有限公司 工艺监控方法、装置、存储介质和电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6889178B1 (en) * 1997-10-01 2005-05-03 Sony Corporation Integrated wafer fabrication production characterization and scheduling system
CN105223914A (zh) * 2014-06-30 2016-01-06 中芯国际集成电路制造(上海)有限公司 管控机台生产数据的系统及其方法
CN109003919A (zh) * 2018-07-11 2018-12-14 上海华力微电子有限公司 一种晶圆制程工艺参数的反馈方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7543274B2 (en) * 2003-12-22 2009-06-02 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration System and method for deriving a process-based specification
US10706522B2 (en) * 2016-11-08 2020-07-07 Kla-Tencor Corporation System and method for generation of wafer inspection critical areas
CN107491605A (zh) * 2017-08-16 2017-12-19 济南浪潮高新科技投资发展有限公司 一种用于芯片设计的功能验证方法及平台
CN108491475B (zh) * 2018-03-08 2020-03-31 平安科技（深圳）有限公司 数据快速批量导入方法、电子装置及计算机可读存储介质

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6889178B1 (en) * 1997-10-01 2005-05-03 Sony Corporation Integrated wafer fabrication production characterization and scheduling system
CN105223914A (zh) * 2014-06-30 2016-01-06 中芯国际集成电路制造(上海)有限公司 管控机台生产数据的系统及其方法
CN109003919A (zh) * 2018-07-11 2018-12-14 上海华力微电子有限公司 一种晶圆制程工艺参数的反馈方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115879665A (zh) * 2023-02-17 2023-03-31 希维科技(广州)有限公司 确定产品配置的检验要求、标识产品配置的方法及设备
CN116774990A (zh) * 2023-08-25 2023-09-19 合肥晶合集成电路股份有限公司 一种半导体机台的产品程式管理系统及管理方法
CN116774990B (zh) * 2023-08-25 2023-11-28 合肥晶合集成电路股份有限公司 一种半导体机台的产品程式管理系统及管理方法

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