WO2022089013A1 - 射频前端模组及射频组件、电子设备 - Google Patents

射频前端模组及射频组件、电子设备 Download PDF

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Publication number
WO2022089013A1
WO2022089013A1 PCT/CN2021/117012 CN2021117012W WO2022089013A1 WO 2022089013 A1 WO2022089013 A1 WO 2022089013A1 CN 2021117012 W CN2021117012 W CN 2021117012W WO 2022089013 A1 WO2022089013 A1 WO 2022089013A1
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WIPO (PCT)
Prior art keywords
frequency band
unit
end module
downlink signal
radio frequency
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PCT/CN2021/117012
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English (en)
French (fr)
Inventor
张亭
仝林
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Oppo广东移动通信有限公司
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Publication of WO2022089013A1 publication Critical patent/WO2022089013A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Definitions

  • the present disclosure relates to the technical field of electronic equipment, and in particular, to a radio frequency front-end module, a radio frequency component, and electronic equipment.
  • a currently commonly used Sub-3G ENDC combined frequency band is B1, B3 and N7, where B1 and B3 are the frequency bands supported by 4G LTE, and N7 is the frequency band supported by 5G NR.
  • B1, B3 and N7 frequency bands multiple antennas and multiple RF front-end modules are usually provided in electronic equipment. Each antenna may correspond to a radio frequency front-end module, and an antenna connected to one of the multiple radio frequency front-end modules is used to transmit B1 frequency band signals and receive B3 and N7 frequency band signals.
  • the purpose of the present disclosure is to provide a radio frequency front-end module, a radio frequency component, and an electronic device, so as to solve one or more problems caused by the defects of the related art at least to a certain extent.
  • a radio frequency front-end module includes:
  • the antenna port is used to connect an antenna
  • phase shifting unit electrically connected to the antenna port, for adjusting the phases of a plurality of signals flowing through the antenna port
  • a multiplexer unit connected to the phase shifting unit, for receiving an uplink signal of the first frequency band and a downlink signal of the second frequency band;
  • a receiving unit connected to the phase shifting unit, for receiving downlink signals of the third frequency band
  • the output unit is electrically connected to the multiplexer unit and the receiving unit respectively, and the output unit is used for amplifying and outputting the downlink signal of the second frequency band and the downlink signal of the third frequency band.
  • a radio frequency assembly comprising:
  • the first antenna is connected to the antenna port in the RF front-end module.
  • an electronic device comprising the above-mentioned radio frequency component.
  • FIG. 1 is a schematic diagram of a carrier aggregation provided by the related art
  • FIG. 2 is a schematic diagram of a 5G non-standalone networking provided by the related art
  • 3a is a schematic diagram of a LTE dual link provided by the related art
  • 3b is a schematic diagram of a LTE-NR dual link provided by the related art
  • FIG. 4 is a block diagram of a first radio frequency front-end module provided by an exemplary embodiment of the present disclosure
  • FIG. 5 is a block diagram of a second radio frequency front-end module provided by an exemplary embodiment of the present disclosure
  • FIG. 6 is a block diagram of a third radio frequency front-end module provided by an exemplary embodiment of the present disclosure.
  • FIG. 7 is a block diagram of a fourth radio frequency front-end module provided by an exemplary embodiment of the present disclosure.
  • FIG. 8 is a block diagram of a fifth radio frequency front-end module provided by an exemplary embodiment of the present disclosure.
  • FIG. 9 is a block diagram of a radio frequency component provided by an exemplary embodiment of the present disclosure.
  • FIG. 10 is a block diagram of another radio frequency component provided by an exemplary embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of an electronic device provided by an exemplary embodiment of the present disclosure.
  • Example embodiments will now be described more fully with reference to the accompanying drawings.
  • Example embodiments can be embodied in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
  • the same reference numerals in the drawings denote the same or similar parts, and thus their repeated descriptions will be omitted.
  • the block diagrams shown in the figures may be functional entities and do not necessarily necessarily correspond to physically separate entities. That is, these functional entities may be implemented in software, or in one or more software-hardened modules or parts of functional entities, or in different network and/or processor devices and/or microcontroller devices implement these functional entities.
  • the carrier aggregation technology is to aggregate multiple carriers of different LTE frequencies (or the same) into a wider spectrum, and at the same time, some discontinuous spectrum fragments can be aggregated together, so as to achieve the effect of increasing the bandwidth.
  • Five-carrier aggregation is to aggregate five carriers (which may be the same or different).
  • Carrier aggregation can improve data rates and network performance in the uplink, downlink, or both uplink and downlink.
  • Carrier aggregation also enables frequency division duplex (FDD) and time division duplex (TDD) and aggregation of licensed and unlicensed carrier spectrum.
  • FDD frequency division duplex
  • TDD time division duplex
  • the uplink and downlink are separated by allocating different time slots in the same frequency band.
  • each user can be allocated up to five subcarriers with a bandwidth of 100MHz, which means that each subcarrier can have a bandwidth of up to 20MHz.
  • the 5 subcarriers are transmitted through the base station 01 , are simultaneously received by the antenna, synthesized through the CA data pipeline 02 , and then transmitted to the terminal 03 .
  • Common downlink CA combination frequency bands are: B1+B3, B1+B7, B2+B7, B1+B3+B5, B1+B3+B7, B1+B3+B40, B1+B3+B41 and so on.
  • 4G is used as the anchor point of the control plane
  • the 4G base station 04 (eNB) is the master station
  • the 5G base station 06 (gNB) is the slave station
  • the 4G core network 05 is used.
  • the C-plane is responsible for processing control signals, that is, managing call connections
  • the U-plane is responsible for processing voice signals, that is, managing call content.
  • the 5G network can only be connected to the 5G network only after connecting to the 4G network through the C-plane, that is, the 5G network cannot be connected separately before the 4G network is connected.
  • an RRC protocol is established between the master station and the terminal, that is, RRC messages are only transmitted between the master station and the terminal.
  • the master station and the slave station each perform Radio Resource Management (RRM), and the RRM function interacts and cooperates between the master station and the slave station through the X2 interface.
  • RRM Radio Resource Management
  • the slave station allocates resources, it interacts with the master station through the X2 interface, and then the master station will The RRC message containing the resource configuration of the slave station is sent to the terminal. That is, as shown in FIG. 3( a ), the terminal 03 can only see the only RRC message from the master station 01 , and only reply to the master station 01 .
  • the master station and the slave station each perform RRM, but also the RRC protocol is independently established between the master station and the slave station and the terminal. That is, as shown in FIG. 3( b ), the slave station 07 no longer performs RRM interaction and coordination with the master station 01 through the X2 interface, but directly transmits the RRC message from the slave station to the terminal 03 .
  • the independent RRC connection also means that the master station 01 and the slave station 07 can independently set up RRC measurements.
  • some commonly used ENDC combined frequency bands usually include three different frequency bands.
  • the radio frequency front-end module 100 includes: an antenna port 120 , a multiplexer unit 130 , a receiving unit 140 , a phase shifting unit 150 and an output unit 160 , the antenna port 120 is used to connect the antenna; the multiplexer unit 130 is connected to the phase shift unit 150, and the multiplexer unit 130 is used to receive the uplink signal of the first frequency band and the downlink signal of the second frequency band; the receiving unit 140 and the phase shifting unit 150 are electrically
  • the receiving unit 140 is used to receive the downlink signal of the third frequency band;
  • the output unit 160 is electrically connected to the multiplexer unit 130 and the receiving unit 140 respectively, and the output unit 160 is used to perform the downlink signal of the second frequency band and the downlink signal of the third frequency band. Amplify and output.
  • the first frequency band, the second frequency band and the third frequency band are all different.
  • the RF front-end module 100 provided by the embodiment of the present disclosure can be used for 5G communication, and the multiplexer unit 130 receives the uplink signal of the first frequency band and the downlink signal of the second frequency band, and the receiving unit 140 receives the third frequency band.
  • the phase shifting unit 150 adjusts the phase of the signal flowing through the antenna port 120, so as to avoid mutual interference of the signals, so as to transmit the uplink signal of the first frequency band and receive the downlink signal of the second frequency band and the third frequency band through one antenna. Downlink signal, and avoid the external multiplexer in the RF front-end module, which can save the space on the motherboard to a certain extent.
  • the radio frequency front-end module 100 further includes: a package housing 110, the package housing 110 has a bearing portion, an antenna port 120, a phase shifting unit 150, a multiplexer unit 130, a receiving unit 140 and an output
  • the unit 160 is provided on the carrying portion.
  • the RF front-end module 100 may further include an output switch unit 170 , the output switch unit 170 is disposed between the receiving unit 140 and the output unit 160 , and the output switch unit 170 is used to control the receiving unit 140 transmits a signal to the output unit 160 .
  • the RF front-end module may further include a power amplifying unit 180 and a first switch unit 190.
  • the power amplifying unit 180 is provided on the bearing portion, and the power amplifying unit 180 is used to amplify the uplink of the first frequency band. signal and the uplink signal of the second frequency band;
  • the first switch unit 190 is arranged on the bearing part, the input end of the first switch unit 190 is connected to the power amplifying unit 180, and the output end of the first switch unit 190 is respectively connected to the multiplexer unit 130 for
  • the uplink signal of the first frequency band and the uplink signal of the second frequency band are transmitted to the multiplexer unit 130 .
  • the RF front-end module may further include a second switch unit 1010 , the second switch unit 1010 is disposed on the bearing portion, and the second switch unit 1010 is connected to the phase shift unit 150 and the multiplexer unit 130 and the antenna port 120 , and the second switch unit 1010 can be turned on in multiple ways, so as to realize the multi-path signal interaction between the phase shifting unit 150 and the antenna port 120 .
  • the power amplifying unit 180 may include a power amplifier 181, and a transmission signal pin is provided on the package housing 110, the power amplifier 181 may be connected to the transmission signal pin, and the transmission signal pin may be connected to the radio frequency circuit, Then, the uplink signal of the first frequency band or the uplink signal of the second frequency band is transmitted to the power amplifier 181 , and the uplink signal of the first frequency band or the uplink signal of the second frequency band transmitted to the power amplifier 181 is amplified by the power amplifier 181 .
  • the number of the power amplifiers 181 on the RF front-end module can be reduced, thereby saving a bare chip on the wafer, which is beneficial to reduce the frequency of the RF front-end module. costs, thereby reducing the cost of electronic equipment.
  • the first switch unit 190 may include a single-pole, four-throw switch 191 , and the common terminal of the single-pole, four-throw switch 191 is connected to the output terminal of the power amplifier 181 .
  • the first throw terminal and the second throw terminal of the single-pole four-throw switch 191 may be connected to the multiplexer unit 130 .
  • the third throw terminal of the single-pole four-throw switch 191 can be connected to a test pin provided on the package housing 110 , and the signal output by the power amplifier is transmitted to an external test circuit through the test pin, so as to measure the signal of the power amplifier 181 . when testing.
  • the fourth throw terminal of the single-pole four-throw switch 191 can be connected to the transmit pin on the package housing 110, and is used to transmit the uplink signal of the fourth frequency band to the transmit antenna of the fourth frequency band through the transmit pin. At this time, the power The amplifier 181 can receive the uplink signal of the fourth frequency band.
  • the common terminal and the third throw terminal of the single-pole four-throw switch 191 are turned on, so as to transmit the signal output by the power amplifier 181 to the test pin.
  • the common terminal and the first throw terminal of the single-pole four-throw switch 191 are turned on, so as to transmit the uplink signal of the first frequency band to the multiplexer unit 130 .
  • the power amplifier 181 inputs the uplink signal of the second frequency band the common terminal and the second throw terminal of the single-pole four-throw switch 191 are turned on, so as to transmit the uplink signal of the second frequency band to the multiplexer unit 130 .
  • the power amplifier 181 inputs the up signal of the fourth frequency band the common terminal and the fourth throw terminal of the SP4-throw switch 191 are turned on, so as to transmit the up signal of the fourth frequency band to the transmit pin.
  • the first switch unit 190 may also include other switches.
  • the first switch unit 190 may include a SPDT switch.
  • the common terminal of the SPDT switch is connected to the power amplifier 181
  • the first switch of the SPDT switch is connected to the power amplifier 181.
  • a throw terminal and a second throw terminal are connected to the multiplexer unit 130 to transmit the first frequency band signal and the second frequency band signal to the multiplexer unit 130 respectively.
  • the first switch unit 190 may include a plurality of switches, and the plurality of switches are provided between the power amplifier 181 and the multiplexer unit 130. When a corresponding signal is received, the corresponding switch is turned on.
  • the power amplifier 181 when the first switch is used to transmit the signal of the first frequency band, the power amplifier 181 outputs the signal of the first frequency band.
  • the first switch is turned on, and when the second switch is used to transmit the signal of the second frequency band, the power amplifier 181 outputs the signal of the second frequency band.
  • the second switch is turned on.
  • the multiplexer unit 130 may include a quadplexer 131, the quadplexer 131 includes a first end and a second end, the first end of the quadplexer 131 is connected to the phase shifting unit 150, and the second end of the quadplexer 131 includes a first end A sub-terminal, a second sub-terminal, a third sub-terminal and a fourth sub-terminal, the first sub-terminal is connected to the output module, the first sub-terminal is used to transmit the downlink signal of the first frequency band to the output unit 160, and the second sub-terminal receives The first frequency band uplink signal and the first frequency band uplink signal are transmitted to the first end, the third sub-terminal receives the second frequency band uplink signal and transmits the second frequency band uplink signal to the first end, the fourth sub-terminal is connected to the output module, The fourth sub-terminal is used to transmit the downlink signal of the second frequency band to the output unit 160 .
  • the first sub-terminal and the second sub-terminal of the quadplexer 131 are connected to the output unit 160, and the second sub-terminal of the quadplexer 131 is connected to the first throwing terminal of the single-pole four-throw switch 191 to receive the uplink signal of the first frequency band , the third sub-terminal of the quadplexer 131 is connected to the second throwing terminal of the single-pole four-throw switch 191 to receive the uplink signal of the second frequency band.
  • the first frequency band may be the B1 frequency band
  • the second frequency band may be the B3 frequency band, that is, the quadplexer 131 is used to send and receive signals of the B1 frequency band and signals of the B3 frequency band.
  • the first frequency band and the second frequency band may also be other frequency bands, and the embodiment of the present disclosure is not limited thereto.
  • the quadplexer 131 is used to realize the transmission and reception of radio frequency signals in the first frequency band and the second frequency band, which can solve the problem of large insertion loss of the hexaplexer in the related art, thereby reducing the insertion loss of the radio frequency front-end module, and by Using the quadplexer 131 can reduce the cost of the RF front-end module.
  • the receiving unit 140 may be configured to receive downlink signals of the third frequency band, and the receiving unit 140 may include a first filter 141 , which is electrically connected to the phase shifting unit 150 and the output unit 160 , the first filter 141 is configured to receive the downlink signal of the third frequency band transmitted by the antenna port 120 , and the first filter 141 performs filtering processing on the downlink signal of the third frequency band.
  • the third frequency band may be any one of N7, N40, and N41, that is, the first filter 141 may be configured to receive one of N7, N40, and N41.
  • the antenna connected to the corresponding antenna port 120 can also receive the downlink signal of one of N7, N40 and N41.
  • the third frequency band may also be other frequency bands, and the embodiment of the present disclosure is not limited to this.
  • the receiving unit 140 may be configured to receive downlink signals in the third frequency band, downlink signals in the fourth frequency band, downlink signals in the fifth frequency band, and downlink signals in the sixth frequency band.
  • the receiving unit 140 may include a first filter 141 , a second filter 142 , a third filter 143 and a fourth filter 144 .
  • the first filter 141 is electrically connected to the phase shifting unit 150 and the output unit 160 , and the first filter 141 is used for receiving the downlink signal of the third frequency band transmitted by the phase shifting unit 150 , and filtering the downlink signal of the third frequency band and transmitting it to the output unit 160 .
  • the second filter 142 is electrically connected to the phase shifting unit 150 and the output unit 160 , and the second filter 142 is configured to receive the downlink signal of the fourth frequency band transmitted by the phase shifting unit 150 , and filter the downlink signal of the fourth frequency band and transmit it to the output unit 160
  • the third filter 143 is electrically connected to the phase-shifting unit 150 and the output unit 160, and the third filter 143 is used to receive the downlink signal of the fifth frequency band transmitted by the phase-shifting unit 150, and filter the downlink signal of the fifth frequency band and transmit it to the output unit 160;
  • the fourth filter 144 is electrically connected to the phase shifting unit 150 and the output unit 160, and the fourth filter 144 is used to receive the downlink signal of the sixth frequency band transmitted by the phase shifting unit 150, and filter the downlink signal of the sixth frequency band and transmit it to the output unit 160.
  • the combination of the first filter 141, the second filter 142, the third filter 143 and the fourth filter 144 can also be replaced by a quadplexer, in which case the input end of the quadplexer can be combined with the shifter.
  • the phase unit 150 is connected, and the output terminal of the quadplexer can be electrically connected to the output unit 160 .
  • the combination of the first filter 141, the second filter 142, the third filter 143 and the fourth filter 144 may be replaced by a combination of two duplexers.
  • the combination of the first filter 141, the second filter 142, the third filter 143, and the fourth filter 144 may be replaced by a combination of a duplexer and two filters, etc., which is not the case in the embodiment of the present disclosure. Make specific restrictions.
  • the first frequency band is B1, the second frequency band is B3, the third frequency band is B7, the fourth frequency band is B25, the fifth frequency band is B40, and the sixth frequency band is B66.
  • the first frequency band is B1, the second frequency band is B3, the third frequency band is B7, the fourth frequency band is B25, the fifth frequency band is B41, and the sixth frequency band is B66.
  • the first frequency band, the second frequency band, the third frequency band, the fourth frequency band, the fifth frequency band, and the sixth frequency band may also be other frequency bands, and the embodiment of the present disclosure is not limited thereto.
  • the phase shifter 150 may include a plurality of phase shifters 151 , and a phase shifter 151 may be provided between the quadplexer 131 and the second switch unit 1010 , and the phase shifter 151 is connected to the second switch unit 1010 and the quadplexer 131 .
  • the signal received by the antenna port 120 is tuned by the phase shifter 151 , and the downlink signal of the first frequency band and the downlink signal of the second frequency band are transmitted to the quadplexer 131 .
  • a phase shifter 151 is disposed between the first filter 141 and the second switch unit 1010 , the signal received by the antenna port 120 is tuned by the phase shifter 151 , and the downlink signal of the third frequency band is transmitted to the first filter 141 .
  • a phase shifter 151 is disposed between the second filter 142 and the second switch unit 1010 , the signal received by the antenna port 120 is tuned by the phase shifter 151 , and the downlink signal of the fourth frequency band is transmitted to the second filter 142 .
  • a phase shifter 151 is arranged between the third filter 143 and the second switch unit 1010 , the signal received by the antenna port 120 is tuned by the phase shifter 151 , and the downlink signal of the fifth frequency band is transmitted to the third filter 143 .
  • a phase shifter 151 is disposed between the fourth filter 144 and the second switch unit 1010 , the signal received by the antenna port 120 is tuned by the phase shifter 151 , and the downlink signal of the sixth frequency band is transmitted to the fourth filter 144 .
  • the second switch unit 1010 may be a multi-channel conduction switch.
  • the multi-channel conduction switch may include an input terminal and a plurality of output terminals.
  • the input terminal of the multi-channel conduction switch is connected to the antenna port 120, and the output terminal of the multi-channel conduction switch A phase shifter 151 is correspondingly connected.
  • Multiple paths in the second switch unit 1010 may be turned on at the same time or multiple paths in the second switch unit 1010 may be partially turned on.
  • the plurality of output ends of the second switch unit 1010 has a test output end, and the test output end can be connected with the antenna test pin provided on the package housing 110, and the downlink signal of the antenna is transmitted to the antenna test pin through the antenna test pin. External test device.
  • the second switch unit 1010 may include multiple MOS transistors, first ends of the multiple MOS transistors may be connected to the antenna port 120, and second ends of the multiple MOS transistors may be connected to the multiple phase shifters 151 and the antenna test leads respectively. feet, and the control terminals of the multiple MOS tubes are respectively connected to the conduction control signal. Each MOS transistor is turned on according to the signal received by the control terminal, so as to transmit the signal received by the antenna to the corresponding phase shifter 151 or the antenna test pin.
  • a coupler 1020 may be disposed between the second switch unit 1010 and the antenna port 120, or the coupler 1020 may be disposed between the antenna port 120 and the antenna, that is, the antenna coupler 1020 may be disposed outside the RF front-end module , which is not specifically limited in the embodiments of the present disclosure.
  • the output unit 160 includes: a first low noise amplifier 161 , a second low noise amplifier 162 , a third low noise amplifier 163 and a fourth low noise amplifier 164 .
  • the first low noise amplifier 161 is connected to the multiplexer unit 130 and the fourth filter 144, and the first low noise amplifier 161 is used for amplifying and outputting the downlink signal of the first frequency band and the downlink signal of the fourth frequency band.
  • the second low noise amplifier 162 is electrically connected to the multiplexer unit 130 and the second filter 142, and the second low noise amplifier 162 is used for amplifying and outputting the downlink signal of the second frequency band and the downlink signal of the third frequency band.
  • the third low noise amplifier 163 is connected to the first filter 141 and the third low noise amplifier 163 is used for amplifying and outputting the downlink signal of the third frequency band.
  • the fourth low-noise amplifier 164 is electrically connected to the third filter 143, and the fourth low-noise amplifier 164 is used for amplifying and outputting the downlink signal of the fifth frequency band.
  • the first low-noise amplifier 161 is connected to the first sub-terminal of the quadplexer 131 and the fourth filter 144, and the first low-noise amplifier 161 is used to receive the downlink signal of the first frequency band and the downlink signal of the sixth frequency band, and to the first low-noise amplifier 161.
  • a frequency band downlink signal is amplified and output.
  • the second low-noise amplifier 162 is connected to the fourth sub-terminal of the quadplexer 131 and the second filter 142.
  • the second low-noise amplifier 162 is used for receiving the downlink signal of the second frequency band and the downlink signal of the third frequency band, and for the second frequency band
  • the downlink signal and the downlink signal of the third frequency band are amplified and output.
  • the output unit 160 provided by this embodiment of the present disclosure may further include a plurality of short-circuit switches, and each of the plurality of short-circuit switches is connected in parallel with a low-noise amplifier.
  • the output unit 160 may further include a first short-circuit switch 165 , a second short-circuit switch 166 , a third short-circuit switch 167 and a fourth short-circuit switch 168 .
  • the first short-circuit switch 165 is connected in parallel with the first low-noise amplifier
  • the second short-circuit switch 166 is connected in parallel with the second low-noise amplifier
  • the third short-circuit switch 167 is connected in parallel with the third low-noise amplifier
  • the fourth short-circuit switch 168 is connected with the fourth low-noise amplifier 164 in parallel.
  • the short-circuit switch may include a MOS tube, the first section and the second end of the MOS tube are respectively connected to two ends of the corresponding low-noise amplifier, and the control end of the MOS tube may be connected to the short-circuit control signal.
  • a short-circuit control pin may be provided on the package casing 110, and the control end of the MOS transistor is connected to the short-circuit control pin.
  • the MOS transistors in the embodiments of the present disclosure all have a first end, a second end and a control end.
  • the first end may be the source of the MOS tube
  • the second end may be the drain of the MOS tube
  • the control end may be the gate of the MOS tube
  • the first end may be the drain of the MOS tube
  • the second end may be the MOS tube
  • the source of the tube, and the control terminal can be the gate of the MOS tube.
  • the MOS transistors provided in the embodiments of the present disclosure may be N-type or P-type, enhancement-type or depletion-type, etc., which are not specifically limited in the embodiments of the present disclosure.
  • the output unit 160 may further include a multiplexer 169, the multiple input terminals of the multiplexer 169 are respectively electrically connected to the first low noise amplifier 161, the second low noise amplifier 162, the third low noise amplifier 163 and the fourth low noise amplifier
  • the outputs of the amplifier 164 and the multiplexer 169 can be respectively connected to a plurality of output pins for selectively outputting signals
  • the output switch unit 170 may include a first SPTT switch 171 , a second SPTT switch 172 , a third SPTT switch 173 and a fourth SPTT switch 174 .
  • the common terminal of the first single-pole three-throw switch 171 is connected to the first low-noise amplifier 161 , the first throwing terminal of the first single-pole three-throw switch 171 can be connected to the sixth frequency band auxiliary interface arranged on the package housing 110 , and the second throwing terminal
  • the first sub-terminal of the quadplexer 131 may be connected, and the third throw terminal may be connected to the fourth filter 144 .
  • the signal of the auxiliary interface of the sixth frequency band is transmitted to the first low-noise amplifier.
  • the terminal is turned on, the downlink signal of the first frequency band is transmitted to the first low-noise amplifier, and when the common terminal of the first single-pole three-throw switch 171 and the third throw terminal are turned on, the downlink signal of the sixth frequency band is transmitted to the first low-noise amplifier.
  • the common terminal of the second single-pole, three-throw switch 172 is connected to the second low-noise amplifier 162 , the first throw terminal of the second single-pole three-throw switch 172 can be connected to the third frequency band auxiliary interface disposed on the package housing 110 , and the second throw terminal The fourth sub terminal of the quadplexer 131 may be connected, and the third throw terminal may be connected to the second filter 142 .
  • the common terminal of the second single-pole three-throw switch 172 and the first throwing terminal are conducting, the signal of the auxiliary interface of the third frequency band is transmitted to the second low noise amplifier.
  • the terminal is turned on, the downlink signal of the second frequency band is transmitted to the second low-noise amplifier.
  • the common terminal of the second single-pole three-throw switch 172 and the third throw terminal are turned on, the downlink signal of the fourth frequency band is transmitted to the second low-noise amplifier.
  • the common terminal of the third single-pole three-throw switch 173 is connected to the third low noise amplifier 163 , the first throw terminal of the third single-pole three-throw switch 173 can be connected to the third frequency band auxiliary interface disposed on the package housing 110 , and the second throw terminal
  • the first filter 141 can be connected, and the third throwing terminal can be connected to the downlink signals of other frequency bands (such as B41) for backup.
  • the common terminal of the third single-pole three-throw switch 173 and the first throw terminal are conducting, the signal of the auxiliary interface of the third frequency band is transmitted to the third low-noise amplifier.
  • the downlink signal of the third frequency band is transmitted to the third low noise amplifier, and the standby signal is transmitted to the third low noise amplifier when the common terminal of the first single-pole three-throw switch 171 and the third throw terminal are turned on.
  • the common terminal of the fourth SPTT switch 174 is connected to the fourth low-noise amplifier 164, and the first throw terminal of the fourth SPTT switch 174 can be connected to the auxiliary interface of the spare frequency band (such as B30) provided in the package housing 110, and the second The throwing terminal can be connected to the third filter 143, and the third throwing terminal can be left unused for standby.
  • the signal of the auxiliary interface of the standby frequency band is transmitted to the fourth low-noise amplifier.
  • the downlink signal of the fifth frequency band is transmitted to the fourth low-noise amplifier, and the fourth low-noise amplifier is idle when the common terminal of the first single-pole three-throw switch 171 and the third throw terminal are turned on.
  • the package housing 110 may include a carrier board and a package layer, the carrier board is provided with a wafer, the multiplexer unit 130 , the receiver unit 140 , the phase shift unit 150 , the output unit 160 , the first switch unit 190 , and the second switch unit 1010 , the output switch unit 170 and the power amplifier 181 and other devices can be provided on the wafer.
  • Various types of pins in the embodiments of the present disclosure may be connection pads or connection interfaces, etc., various types of pins may be provided on the carrier board, and various types of pins may be connected to corresponding devices on the wafer through vias and wires.
  • the RF front-end module receives the uplink signal of the first frequency band and the downlink signal of the second frequency band through the multiplexer disposed in the package housing 110 , receives the downlink signal of the third frequency band through the receiving unit 140 , and shifts the phase.
  • the unit 150 adjusts the phase of the signal flowing through the antenna port 120, so as to avoid mutual interference of each signal, so as to transmit the uplink signal of the first frequency band and receive the downlink signal of the second frequency band and the downlink signal of the third frequency band through one antenna, and avoid the Adding a multiplexer to the RF front-end module can save space on the motherboard to a certain extent.
  • the power amplifier 181 is shared by the uplink signal of the first frequency band and the uplink signal of the second frequency band, which can reduce the number of power amplifiers 181 on the RF front-end module, thereby saving one bare chip on the wafer, which is beneficial to Reduce the cost of RF front-end modules, thereby reducing the cost of electronic equipment.
  • the quadplexer 131 to realize the transmission and reception of radio frequency signals in the first frequency band and the second frequency band, the problem of large insertion loss of the hexaplexer in the related art can be solved, thereby reducing the insertion loss of the RF front-end module, and by using the quadplexer 131 The cost of the RF front-end module can be reduced.
  • the uplink signal of the first frequency band is Tx(Bx)
  • the downlink signal of the first frequency band is Rx(Bx)
  • the uplink signal of the second frequency band is Tx(By)
  • the The downlink signal of the second frequency band is Rx(By)
  • the downlink signal of the third frequency band is Rx(Bz)
  • the downlink signal of the fourth frequency band is Rx(Bm)
  • the downlink signal of the fifth frequency band is Rx(Bn)
  • the downlink signal of the sixth frequency band is Rx (Bj)
  • the frequency band identifiers B and N are not distinguished in the drawings. Since the frequencies of the corresponding frequency bands are the same, B (LTE) and N (NR) can be interchanged. Of course, the above symbols are only used for marking, and the embodiments of the present disclosure are not limited thereto.
  • the radio frequency assembly includes: the above-mentioned radio frequency front-end module 100 and the first antenna 200 .
  • the RF front-end module includes: an antenna port 120, a multiplexer unit 130, a receiving unit 140, a phase shifting unit 150 and an output unit 160; the antenna port 120 is used to connect the second antenna 400200; the multiplexer unit 130 is arranged on the bearing part, The multiplexer unit 130 is used for receiving the uplink signal of the first frequency band and the downlink signal of the second frequency band; the receiving unit 140 is used to receive the downlink signal of the third frequency band; the phase shifting unit 150 is respectively connected to the multiplexer unit 130, the receiving unit 140 and the antenna port 120, the phase shifting unit 150 is used to adjust the phases of the multiple signals flowing through the antenna port 120; the output unit 160 is respectively connected to the multiplexer unit 130 and the receiving unit 140, and the output unit 160 is used for the downlink signals of the second frequency band and
  • the radio frequency assembly 1000 may further include: a second antenna 400 , a second radio frequency front-end module 300 , a third antenna 600 , a third radio frequency front-end module 500 , a fourth radio frequency front-end module 500 , and a fourth The antenna 800 and the fourth RF front-end module 700 .
  • the second antenna 400 is used for receiving the downlink signal of the first frequency band and the downlink signal of the second frequency band and transmitting the uplink signal of the third frequency band;
  • the second RF front-end module 300 is connected to the second antenna 400;
  • the third antenna 600 is used to receive the first frequency band Downlink signals, downlink signals of the second frequency band and downlink signals of the third frequency band;
  • the third radio frequency front-end module 500 is connected to the third antenna 600;
  • the fourth antenna 800 is used to receive the downlink signals of the first frequency band, the downlink signals of the second frequency band and the third frequency band downlink signal.
  • the fourth RF front-end module 700 is connected to the fourth antenna 800 .
  • the second RF front-end module 300 may be a power amplifier 181 module (LPAMiD, LNA-PA module with integrated duplexer) integrated with a low noise amplifier and a duplexer
  • the third RF front-end module 500 may be a diversity receiving RF module Front-end module (DRx)
  • the fourth RF front-end module 700 may be a multiple-input multiple-output main set receiving module (PRx MIMO).
  • the radio frequency assembly 1000 includes a radio frequency front-end module 100 , receives the uplink signal of the first frequency band and the downlink signal of the second frequency band through the multiplexer disposed in the package housing 110 , and receives the signal of the third frequency band through the receiving unit 140 .
  • the phase shift unit 150 adjusts the phase of the signal flowing through the antenna port 120, so as to avoid mutual interference of the signals, so as to transmit the uplink signal of the first frequency band and receive the downlink signal of the second frequency band and the downlink signal of the third frequency band through one antenna.
  • Signal and avoid the external hexaplexer in the RF front-end module, which can save space on the motherboard to a certain extent.
  • An exemplary embodiment of the present disclosure further provides an electronic device, as shown in FIG. 11 , the above-mentioned radio frequency component 1000 of the electronic device.
  • the electronic devices in the embodiments of the present disclosure may be mobile phones, tablet computers, electronic readers, navigators, in-vehicle computers, notebook computers, wearable devices, smart home appliances, and other electronic devices with wireless communication functions.
  • the electronic device is described in detail below by taking the electronic device as a mobile phone as an example:
  • the electronic device provided by the embodiment of the present disclosure further includes a display screen 10 , a main board 30 , a battery 40 , and a back cover 50 .
  • the display screen 10 is installed on the frame 20 to form the display surface of the terminal device, and the display screen 10 serves as the front shell of the electronic device.
  • the back cover 50 is pasted on the frame by double-sided tape, and the display screen 10 , the frame 20 and the back cover 50 form an accommodation space for accommodating other electronic components or functional modules of the electronic device.
  • the display screen 10 forms a display surface of the electronic device, and is used to display information such as images and texts.
  • the display screen 10 may be a liquid crystal display (Liquid Crystal Display, LCD) or an organic light-emitting diode (Organic Light-Emitting Diode, OLED) type display screen.
  • a glass cover plate may be provided on the display screen 10 .
  • the glass cover can cover the display screen 10 to protect the display screen 10 and prevent the display screen 10 from being scratched or damaged by water.
  • the display screen 10 may include a display area 11 and a non-display area 12 .
  • the display area 11 performs the display function of the display screen 10 for displaying information such as images and texts.
  • the non-display area 12 does not display information.
  • the non-display area 12 can be used to set functional modules such as cameras, receivers, and proximity sensors.
  • the non-display area 12 may include at least one area located at the upper and lower parts of the display area 11 .
  • the display screen 10 may be a full screen. At this time, the display screen 10 can display information in a full screen, so that the electronic device has a larger screen ratio.
  • the display screen 10 includes only the display area 11 and does not include the non-display area. At this time, functional modules such as cameras and proximity sensors in the electronic device can be hidden under the display screen 10, and the fingerprint recognition module of the electronic device can be arranged on the back of the electronic device.
  • the frame 20 may be a hollow frame structure.
  • the material of the frame 20 may include metal or plastic.
  • the main board 30 is installed inside the above-mentioned accommodation space.
  • the main board 30 can be installed on the frame 20 and accommodated in the above-mentioned accommodation space together with the frame 20 .
  • the main board 30 is provided with a ground point to realize the grounding of the main board 30 .
  • the main board 30 may be integrated with one or more functional modules such as a motor, a microphone, a speaker, a receiver, a headphone interface, a universal serial bus interface (USB interface), a camera, a proximity sensor, an ambient light sensor, a gyroscope, and a processor.
  • the display screen 10 may be electrically connected to the main board 30 .
  • the main board 30 is provided with a display control circuit.
  • the display control circuit outputs electrical signals to the display screen 10 to control the display screen 10 to display information.
  • the battery 40 is installed inside the above-mentioned accommodation space.
  • the battery 40 can be mounted on the frame 20 and housed in the above-mentioned storage space together with the frame 20 .
  • the battery 40 may be electrically connected to the main board 30 to enable the battery 40 to supply power to the electronic device.
  • the mainboard 30 may be provided with a power management circuit.
  • the power management circuit is used to distribute the voltage provided by the battery 40 to the various electronic components in the electronic device.
  • the back cover 50 is used to form the outer contour of the electronic device.
  • the rear cover 50 may be integrally formed.
  • structures such as a rear camera hole, a fingerprint identification module mounting hole and the like may be formed on the back cover 50 .
  • the first antenna 200 , the second antenna 400 , the third antenna 600 and the fourth antenna 800 may be provided on the main board 30 , the frame 20 , the back cover 20 and other parts of the electronic device.
  • the first antenna 200 , the second antenna 400 , the third antenna 600 and the fourth antenna 800 may be metal branches disposed on the metal frame 20 .
  • the first antenna 200 , the second antenna 400 , the third antenna 600 and the fourth antenna 800 may be metal branches disposed on the metal back cover 50 .
  • the first antenna 200, the second antenna 400, the third antenna 600 and the fourth antenna 800 can be provided on the terminal device Internally, for example, the first antenna 200 , the second antenna 400 , the third antenna 600 and the fourth antenna 800 may be provided on the main board 30 of the terminal device.
  • the RF front-end module 100 , the second RF front-end module 300 , the third RF front-end module 500 and the fourth RF front-end module 700 may be disposed on the main board 30 .

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Abstract

本公开涉及电子设备技术领域，具体是关于一种射频前端模组及射频组件、电子设备，射频前端模组包括：天线端口、多工器单元、接收单元、移相单元和输出单元，移相单元与所述天线端口电连接，用于调节流经所述天线端口的多个信号的相位；多工器单元与所述移相单元连接，用于接收第一频段上行信号和第二频段下行信号；接收单元与所述移相单元连接，用于接收第三频段下行信号；输出单元分别连接所述多工器单元和所述接收单元，所述输出单元用于对所述第二频段下行信号和所述第三频段下行信号进行放大并输出。避免在射频前端模组中外挂多工器，能够节约电子设备主板上的空间。

Description

射频前端模组及射频组件、电子设备
交叉引用
本公开要求于2020年10月26日提交的申请号为202011153720.3名称为“射频前端模组及射频组件、电子设备”的中国专利申请的优先权，该中国专利申请的全部内容通过引用全部并入本文。
技术领域
本公开涉及电子设备技术领域，具体而言，涉及一种射频前端模组及射频组件、电子设备。
背景技术
随着技术的发展和进步，5G通信技术的应用逐渐广泛。当前一种常用的Sub-3G的ENDC组合频段是B1、B3和N7，其中B1和B3是4G LTE支持的频段，N7是5G NR支持的频段。为了支持B1、B3和N7频段的通信，电子设备中通常设置有多个天线和多个射频前端模组。每个天线可以对应一射频前端模组，多个射频前端模组中的一射频模组连接的天线用于发射B1频段信号并接收B3和N7频段的信号。为了实现该功能，通常需要在该射频前端模组外挂一六工器，外挂六工器会占用主板上布件空间。
在所述背景技术部分公开的上述信息仅用于加强对本公开的背景的理解，因此它可以包括不构成对本领域普通技术人员已知的现有技术的信息。
公开内容
本公开的目的在于提供一种射频前端模组及射频组件、电子设备，进而至少一定程度上解决由于相关技术的缺陷而导致的一个或多个问题。
根据本公开的第一方面，提供一种射频前端模组，所述射频前端模组包括：
天线端口，所述天线端口用于连接天线；
移相单元，与所述天线端口电连接，用于调节流经所述天线端口的多个信号的相位；
多工器单元，与所述移相单元连接，用于接收第一频段上行信号和第二频段下行信号；
接收单元，与所述移相单元连接，用于接收第三频段下行信号；
输出单元，分别电连接所述多工器单元和所述接收单元，所述输出单元用于对所述第二频段下行信号和所述第三频段下行信号进行放大并输出。
根据本公开的第二方面，提供一种射频组件，所述射频组件包括：
上述的射频前端模组；
第一天线，和所述射频前端模组中的天线端口连接。
根据本公开的第三方面，提供一种电子设备，所述电子设备包括上述的射频组件。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本申请。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为相关技术提供的一种载波聚合的示意图；
图2为相关技术提供的一种5G非独立组网的示意图；
图3a为相关技术提供的一种LTE双链接的示意图；
图3b为相关技术提供的一种LTE-NR双链接的示意图；
图4为本公开示例性实施例提供的第一种射频前端模组的框图；
图5为本公开示例性实施例提供的第二种射频前端模组的框图；
图6为本公开示例性实施例提供的第三种射频前端模组的框图；
图7为本公开示例性实施例提供的第四种射频前端模组的框图；
图8为本公开示例性实施例提供的第五种射频前端模组的框图；
图9为本公开示例性实施例提供的一种射频组件的框图；
图10为本公开示例性实施例提供的另一种射频组件的框图；
图11为本公开示例性实施例提供的一种电子设备的示意图。
具体实施方式
现在将参考附图更全面地描述示例实施例。然而，示例实施例能够以多种形式实施，且不应被理解为限于在此阐述的实施例；相反，提供这些实施例使得本公开将全面和完整，并将示例实施例的构思全面地传达给本领域的技术人员。在图中相同的附图标记表示相同或类似的部分，因而将省略对它们的重复描述。
附图中所示的方框图可以是功能实体，不一定必须与物理上独立的实体相对应。即，可以采用软件形式来实现这些功能实体，或在一个或多个软件硬化的模块中实现这些功能实体或功能实体的一部分，或在不同网络和/或处理器装置和/或微控制器装置中实现这些功能实体。
载波聚合技术是将多个不同LTE频率(或者相同)的载波聚合成一个更宽的频谱，同时也可以把一些不连续的频谱碎片聚合到一起，从而达到提高带宽的效果。五载波聚合就是把五个载波(可以是相同也可以为不同)聚合在一起。载波聚合可以提高上行链路、下行链路或者上行和下行链路中的数据速率和网络性能。载波聚合还能实现频分双工(FDD)和时分双工(TDD)以及许可和未许可载波频谱的聚合。在FDD通信链路中，发射和接收使用独立的频段。在TDD通信链路中，通过在同一频段分配不同时隙的方式实现上行链路与下行链路的分离。
目前，每个用户100MHz带宽最多可以分配五个子载波，也就是说每个子载波带宽最高可达20MHz。如图1所示，5个子载波通过基站01发射，被天线同时接收到，通过CA数据管道02合成，进而传输至终端03。常见的下行CA组合频段有：B1+B3,B1+B7,B2+B7,B1+B3+B5,B1+B3+B7,B1+B3+B40,B1+B3+B41等等。
3GPP最新发布的5G NSA(非独立组网)标准采用LTE与5G NR新空口双连接(ENDC)的方式。如图2所示，以4G作为控制面的锚点，4G基站04(eNB)为主站，5G基站06(gNB)为从站，并沿用4G核心网05。其中C-plane负责处理控制信号，也就是管理呼叫连接，U-plane负责处理语音信号，也就是管理通话内容。在NSA模式下，只有先通过C-plane连上4G网络，才可以再连上5G网络，也就是在4G网络连上之前，5G网络是无法单独连接的。
在LTE双连接中，主站和终端之间建立RRC协议，即RRC消息仅在主站和终端间传送。但主站和从站各自执行无线资源管理(RRM)，RRM功能在主站和从站之间通过X2接口交互协同，比如从站分配资源后通过X2接口与主站交互，再由主站将包含从站资源配置的RRC消息发送给终 端。也即是，如图3(a)所示，终端03只能看到唯一来自主站01的RRC消息，并且只会回复给主站01。
在LTE-NR双连接中，不仅主站和从站各自执行RRM，而且RRC协议也独立建立于主站和从站与终端之间。也即是，如图3(b)所示，从站07不再通过X2接口与主站01进行RRM交互协同，而是通过RRC消息直接从从站传送到终端03。另外，独立的RRC连接也意味着主站01和从站07可独立设置RRC测量。目前，一些常用的ENDC组合频段通常包括三个不同的频段。
本公开示例性实施例首先提供一种射频前端模组，如图4所示，射频前端模组100包括：天线端口120、多工器单元130、接收单元140、移相单元150和输出单元160，天线端口120用于连接天线；多工器单元130和移相单元150连接，多工器单元130用于接收第一频段上行信号和第二频段下行信号；接收单元140和移相单元150电连接，接收单元140用于接收第三频段下行信号；输出单元160分别电连接多工器单元130和接收单元140，输出单元160用于对所示第二频段下行信号和第三频段下行信号进行放大并输出。其中，第一频段、第二频段和第三频段均不相同。
本公开实施例提供的射频前端模组100，射频前端模组100可以用于5G通信，通过多工器单元130接收第一频段上行信号和第二频段下行信号，通过接收单元140接收第三频段的下行信号，移相单元150对流经天线端口120的信号的相位进行调节，从而避免各信号相互干扰，从而通过一个天线实现了发射第一频段上行信号和接收第二频段下行信号及第三频段下行信号，并且避免了在射频前端模组外挂多工器，能够一定程度上节约主板上的空间。
进一步的，本公开实施例提供的射频前端模组100还包括：封装壳体110，封装壳体110具有承载部，天线端口120、移相单元150、多工器单元130、接收单元140和输出单元160设于所述承载部。
如图5所示，本公开实施例提供的射频前端模组100还可以包括输出开关单元170，输出开关单元170设置于接收单元140和输出单元160之间，输出开关单元170用于控制接收单元140向输出单元160传输信号。
如图6所示，本公开实施例提供的射频前端模组还可以包括功率放大单元180和第一开关单元190，功率放大单元180设于承载部，功率放大单元180用于放大第一频段上行信号和第二频段上行信号；第一开关单元190设于承载部，第一开关单元190的输入端连接功率放大单元180，第一开关单元190的输出端分别连接多工器单元130，用于向多工器单元130 传输第一频段上行信号和第二频段上行信号。
如图7所示，本公开实施例提供的射频前端模组还可以包括第二开关单元1010，第二开关单元1010设于承载部，第二开关单元1010连接移相单元150、多工器单元130和天线端口120，第二开关单元1010能多路导通，以实现移相单元150和天线端口120的多路信号交互。
下面将对本公开实施例提供的射频前端模组的各部分进行详细说明：
如图8所示，功率放大单元180可以包括功率放大器181，在封装壳体110上设置有发射信号引脚，功率放大器181可以连接于发射信号引脚，发射信号引脚可以和射频电路连接，进而将第一频段上行信号或者第二频段上行信号传输至功率放大器181，通过功率放大器181对传输至功率放大器181的第一频段上行信号或第二频段上行信号进行放大。
通过第一频段上行信号和第二频段上行信号共用功率放大器181，能够减少射频前端模组上的功率放大器181的数量，从而在晶圆上节省了一个裸片，有利于降低射频前端模组的成本，从而降低电子设备的成本。
第一开关单元190可以包括单刀四掷开关191，单刀四掷开关191的公共端连接功率放大器181的输出端。单刀四掷开关191的第一掷位端和第二掷位端可以连接多工器单元130。单刀四掷开关191的第三掷位端可以连接于设于封装壳体110上的测试引脚，通过该测试引脚将功率放大输出的信号传输至外部测试电路，以对功率放大器181的信号进行测试时。单刀四掷开关191的第四掷位端可以和设于封装壳体110上的发射引脚连接，用于将第四频段上行信号通过该发射引脚传输至第四频段发射天线，此时功率放大器181可以接收第四频段的上行信号。
当处于测试模式时，单刀四掷开关191公共端和第三掷位端导通，以将功率放大器181输出的信号传输至测试引脚。当处于工作模式时，当功率放大器181输入第一频段上行信号时，单刀四掷开关191公共端和第一掷位端导通，以将第一频段上行信号传输至多工器单元130。当功率放大器181输入第二频段上行信号时，单刀四掷开关191公共端和第二掷位端导通，以将第二频段上行信号传输至多工器单元130。当功率放大器181输入第四频段上行信号时，单刀四掷开关191公共端和第四掷位端导通，以将第四频段上行信号传输至发射引脚。
当然在实际应用中第一开关单元190也可以包括其他开关，比如，第一开关单元190可以包括单刀双掷开关，此时单刀双掷开关的公共端连接功率放大器181，单刀双掷开关的第一掷位端和第二掷位端连接多工器单元130，分别向多工器单元130传输第一频段信号和第二频段信号。或者 第一开关单元190可以包括多个开关，多个开关设于功率放大器181和多工器单元130之间，当接收到对应的信号时，对应的开关导通。比如，当第一开关用于传输第一频段信号时，功率放大器181输出第一频段信号第一开关导通，当第二开关用于传输第二频段信号时，功率放大器181输出第二频段信号第二开关导通。
多工器单元130可以包括四工器131，四工器131包括第一端和第二端，四工器131的第一端连接移相单元150，四工器131的第二端包括第一子端、第二子端、第三子端和第四子端，第一子端和输出模块连接，第一子端用于将第一频段下行信号传输至输出单元160，第二子端接收第一频段上行信号并将第一频段上行信号传输至第一端，第三子端接收第二频段上行信号并将第二频段上行信号传输至第一端，第四子端和输出模块连接，第四子端用于将第二频段下行信号传输至输出单元160。
其中，四工器131的第一子端和第二子端连接输出单元160，四工器131的第二子端连接单刀四掷开关191的第一掷位端，以接收第一频段上行信号，四工器131的第三子端连接单刀四掷开关191的第二掷位端，以接收第二频段上行信号。
示例的，第一频段可以是B1频段，第二频段可以是B3频段，也即是四工器131用于收发B1频段信号和B3频段的信号。当然，在实际应用中第一频段和第二频段也可以是其他频段，本公开实施例并不以此为限。
本公开实施例中通过采用四工器131实现第一频段和第二频段射频信号的收发，能够解决相关技术中六工器插损大的问题，从而降低射频前端模组的插损，并且通过采用四工器131能够降低射频前端模组的成本。
在本公开一可行的实施方式中，接收单元140可以用于接收第三频段下行信号，接收单元140可以包括第一滤波器141，第一滤波器141和移相单元150以及输出单元160电连接，第一滤波器141用于接收天线端口120传输的第三频段下行信号，并且第一滤波器141对第三频段下行信号进行滤波处理。
其中，第三频段可以是N7、N40和N41中的任意一个，也即是，第一滤波器141可以被配置为能够接收N7、N40和N41中的一个。相应的天线端口120连接的天线也能够接收N7、N40和N41中一个的下行信号。当然在实际应用中，第三频段也可以是其他频段，本公开实施例并不以此为限。
在本公开另一可行的实施方式中，接收单元140可以用于接收第三频段下行信号、第四频段下行信号、第五频段下行信号和第六频段下行信号。 接收单元140可以包括第一滤波器141、第二滤波器142、第三滤波器143和第四滤波器144。
第一滤波器141电连接移相单元150和输出单元160，第一滤波器141用于接收移相单元150传输的第三频段下行信号，并将第三频段下行信号滤波后传输至输出单元160。第二滤波器142电连接移相单元150和输出单元160，第二滤波器142用于接收移相单元150传输的第四频段下行信号，并将第四频段下行信号滤波后传输至输出单元160；第三滤波器143电连接移相单元150和输出单元160，第三滤波器143用于接收移相单元150传输的第五频段下行信号，并将第五频段下行信号滤波后传输至输出单元160；第四滤波器144电连接移相单元150和输出单元160，第四滤波器144用于接收移相单元150传输的第六频段下行信号，并将第六频段下行信号滤波后传输至输出单元160。
当然在实际应用中，第一滤波器141、第二滤波器142、第三滤波器143和第四滤波器144的组合也可以替换为四工器，此时四工器的输入端可以和移相单元150连接，四工器输出端可以电连接输出单元160。或者第一滤波器141、第二滤波器142、第三滤波器143和第四滤波器144的组合可以被替换为两个双工器的组合。或者第一滤波器141、第二滤波器142、第三滤波器143和第四滤波器144的组合可以被替换为一个双工器和两个滤波器的组合等，本公开实施例对此不做具体限定。
示例的，第一频段为B1，第二频段为B3，第三频段为B7，第四频段为B25，第五频段为B40，第六频段为B66。或者第一频段为B1，第二频段为B3，第三频段为B7，第四频段为B25，第五频段为B41，第六频段为B66。当然在实际应用中第一频段、第二频段、第三频段、第四频段、第五频段和第六频段也可以是其他频段，本公开实施例并不以此为限。
移相单元150可以包括多个移相器151，四工器131和第二开关单元1010之间可以设有移相器151，该移相器151连接第二开关单元1010和四工器131的第一端，天线端口120接收的信号通过该移相器151的调谐，第一频段下行信号和第二频段下行信号被传输至四工器131。第一滤波器141和第二开关单元1010之间设置有一移相器151，天线端口120接收的信号通过该移相器151的调谐，第三频段下行信号被传输至第一滤波器141。第二滤波器142和第二开关单元1010之间设置有一移相器151，天线端口120接收的信号通过该移相器151的调谐，第四频段下行信号被传输至第二滤波器142。第三滤波器143和第二开关单元1010之间设置有一移相器151，天线端口120接收的信号通过该移相器151的调谐，第五频 段下行信号被传输至第三滤波器143。第四滤波器144和第二开关单元1010之间设置有一移相器151，天线端口120接收的信号通过该移相器151的调谐，第六频段下行信号被传输至第四滤波器144。
第二开关单元1010可以是多路导通开关，多路导通开关可以包括一个输入端和多个输出端，多路导通开关的输入端连接天线端口120，多路导通开关的输出端分别对应连接一移相器151。第二开关单元1010中的多条通路可以同时导通或者第二开关单元1010中的多条通路可以部分导通。
进一步的，第二开关单元1010的多个输出端中具有测试输出端，测试输出端可以和设于封装壳体110上的天线测试引脚连接，通过天线测试引脚将天线的下行信号传输至外部测试装置。
示例的，第二开关单元1010可以包括多个MOS管，多个MOS管的第一端可以连接于天线端口120，多个MOS管的第二端分别连接多个移相器151和天线测试引脚，多个MOS管的控制端分别连接导通控制信号。每个MOS管根据控制端接收的信号而导通，以将天线接收的信号传输至对应的移相器151或者天线测试引脚。
第二开关单元1010和天线端口120之间可以设置有耦合器1020，或者耦合器1020也可以设于天线端口120和天线之间，也即是天线耦合器1020可以设于射频前端模组之外，本公开实施例对此不做具体限定。
输出单元160包括：第一低噪声放大器161、第二低噪声放大器162、第三低噪声放大器163和第四低噪声放大器164。第一低噪声放大器161连接多工器单元130和第四滤波器144，第一低噪声放大器161用于对第一频段下行信号和第四频段下行信号进行放大并输出。第二低噪声放大器162电连接多工器单元130和第二滤波器142，第二低噪声放大器162用于对第二频段下行信号和第三频段下行信号进行放大并输出。第三低噪声放大器163连接第一滤波器141和，第三低噪声放大器163用于对第三频段下行信号进行放大并输出。第四低噪声放大器164电连接第三滤波器143，第四低噪声放大器164用于对第五频段下行信号进行放大并输出。
其中，第一低噪声放大器161和四工器131的第一子端以及第四滤波器144连接，第一低噪声放大器161用于接收第一频段下行信号以及第六频段下行信号，并对第一频段下行信号进行放大并输出。第二低噪声放大器162和四工器131的第四子端以及第二滤波器142连接，第二低噪声放大器162用于接收第二频段下行信号和第三频段下行信号，并对第二频段下行信号和第三频段下行信号进行放大并输出。
本公开实施例提供的输出单元160还可以包括多个短路开关，多个短 路开关分别并联一低噪声放大器。比如，输出单元160还可以第一短路开关165、第二短路开关166、第三短路开关167和第四短路开关168。第一短路开关165和第一低噪声放大器并联，第二短路开关166和第二低噪声放大器并联，第三短路开关167和第三低噪声放大器并联，第四短路开关168和第四低噪声放大器164并联。
其中，短路开关可以包括MOS管，MOS管的第一段和第二端分别连接于对应的低噪声放大器的两端，MOS管的控制端可以连接短路控制信号。可以在封装壳体110上设置短路控制引脚，MOS管的控制端和该短路控制引脚连接。
需要说明的是，本公开实施例中的MOS管均具有第一端、第二端和控制端。第一端可以是MOS管的源极，第二端可以是MOS管的漏极，控制端可以是MOS管的栅极；或者第一端可以是MOS管的漏极，第二端可以是MOS管的源极，控制端可以是MOS管的栅极。本公开实施例提供的MOS管可以是N型或者P型，可以是增强型或者耗尽型等，本公开实施例对此不做具体限定。
输出单元160还可以包括多路选择器169，多路选择器169的多个输入端分别电连接第一低噪声放大器161、第二低噪声放大器162、第三低噪声放大器163和第四低噪声放大器164，多路选择器169的输出端可以分别连接多个输出引脚，用于选择性输出信号，
输出开关单元170可以包括第一单刀三掷开关171、第二单刀三掷开关172、第三单刀三掷开关173和第四单刀三掷开关174。第一单刀三掷开关171的公共端连接第一低噪声放大器161，第一单刀三掷开关171的第一掷位端可以连接设置于封装壳体110第六频段辅助接口，第二掷位端可以连接四工器131的第一子端，第三掷位端可以连接第四滤波器144。当第一单刀三掷开关171公共端和第一掷位端导通时第六频段辅助接口的信号被传输至第一低噪声放大器，当第一单刀三掷开关171公共端和第二掷位端导通时第一频段下行信号被传输至第一低噪声放大器，当第一单刀三掷开关171公共端和第三掷位端导通时第六频段下行信号被传输至第一低噪声放大器。
第二单刀三掷开关172的公共端连接第二低噪声放大器162，第二单刀三掷开关172的第一掷位端可以连接设置于封装壳体110第三频段辅助接口，第二掷位端可以连接四工器131的第四子端，第三掷位端可以连接第二滤波器142。当第二单刀三掷开关172公共端和第一掷位端导通时第三频段辅助接口的信号被传输至第二低噪声放大器，当第二单刀三掷开关 172公共端和第二掷位端导通时第二频段下行信号被传输至第二低噪声放大器，当第二单刀三掷开关172公共端和第三掷位端导通时第四频段下行信号被传输至第二低噪声放大器。
第三单刀三掷开关173的公共端连接第三低噪声放大器163，第三单刀三掷开关173的第一掷位端可以连接设置于封装壳体110第三频段辅助接口，第二掷位端可以连接第一滤波器141，第三掷位端可以备用连接其他频段(比如B41)的下行信号。当第三单刀三掷开关173公共端和第一掷位端导通时第三频段辅助接口的信号被传输至第三低噪声放大器，当第三单刀三掷开关173公共端和第二掷位端导通时第三频段下行信号被传输至第三低噪声放大器，当第一单刀三掷开关171公共端和第三掷位端导通时备用信号被传输至第三低噪声放大器。
第四单刀三掷开关174的公共端连接第四低噪声放大器164，第四单刀三掷开关174的第一掷位端可以连接设置于封装壳体110备用频段(比如B30)辅助接口，第二掷位端可以连接第三滤波器143，第三掷位端可以空置备用。当第时单刀三掷开关公共端和第一掷位端导通时备用频段辅助接口的信号被传输至第四低噪声放大器，当第三单刀三掷开关173公共端和第二掷位端导通时第五频段下行信号被传输至第四低噪声放大器，当第一单刀三掷开关171公共端和第三掷位端导通时第四低噪声放大器空置。
封装壳体110可以包括载板和封装层，载板上设置有晶圆，多工器单元130、接收单元140、移相单元150、输出单元160、第一开关单元190、第二开关单元1010、输出开关单元170和功率放大器181等器件可以设于晶圆。在本公开实施例中的各类引脚可以是连接焊盘或者连接接口等，各类引脚可以设于载板，各类引脚可以通过过孔和导线连接晶圆上相应的器件。
本公开实施例提供的射频前端模组，通过设置于封装壳体110内的多工器接收第一频段上行信号和第二频段下行信号，通过接收单元140接收第三频段的下行信号，移相单元150对流经天线端口120的信号的相位进行调节，从而避免各信号相互干扰，从而通过一个天线实现了发射第一频段上行信号和接收第二频段下行信号及第三频段下行信号，并且避免了在射频前端模组外挂多工器，能够一定程度上节约主板上的空间。
并且本公开实施例中通过第一频段上行信号和第二频段上行信号共用功率放大器181，能够减少射频前端模组上的功率放大器181的数量，从而在晶圆上节省了一个裸片，有利于降低射频前端模组的成本，从而降低电子设备的成本。通过采用四工器131实现第一频段和第二频段射频信 号的收发，能够解决相关技术中六工器插损大的问题，从而降低射频前端模组的插损，并且通过采用四工器131能够降低射频前端模组的成本。
需要说明的是，在本公开示例性实施例的附图中第一频段上行信号为Tx(Bx)，第一频段下行信号为Rx(Bx)，第二频段上行信号为Tx(By)，第二频段下行信号为Rx(By)，第三频段下行信号为Rx(Bz)，第四频段下行信号为Rx(Bm)，第五频段下行信号为Rx(Bn)，第六频段下行信号为Rx(Bj)，第三频段辅助引脚AUX(Bz)，第四频段辅助引脚AUX(Bm)，第五频段辅助引脚AUX(Bn)，第六频段辅助引脚AUX(Bj)。在附图中未对频段标识B和N进行区分，由于其对应的频段的频率一致，因此B(LTE)和N(NR)可以互换。当然上述符号仅做标记使用，本公开实施例并不以此为限。
本公开示例性实施例还提供一种射频组件1000，如图9所示，射频组件包括：上述的射频前端模组100和第一天线200。射频前端模组包括：天线端口120、多工器单元130、接收单元140、移相单元150和输出单元160；天线端口120用于连接第二天线400200；多工器单元130设于承载部，多工器单元130用于接收第一频段上行信号和第二频段下行信号；接收单元140用于接收第三频段下行信号；移相单元150分别连接多工器单元130、接收单元140和天线端口120，移相单元150用于调节流经天线端口120的多个信号的相位；输出单元160分别连接多工器单元130和接收单元140，输出单元160用于对所示第二频段下行信号和第三频段下行信号进行放大并输出。其中，第一频段、第二频段和第三频段均不相同。第一天线200和射频前端模组中的天线端口120连接。
进一步的，如图10所示，本公开实施例提供的射频组件1000还可以包括：第二天线400、第二射频前端模组300、第三天线600、第三射频前端模组500、第四天线800和第四射频前端模组700。第二天线400用于接收第一频段下行信号和第二频段下行信号并发射第三频段上行信号；第二射频前端模组300和第二天线400连接；第三天线600用于接收第一频段下行信号、第二频段下行信号和第三频段下行信号；第三射频前端模组500和第三天线600连接；第四天线800用于接收第一频段下行信号、第二频段下行信号和第三频段下行信号。第四射频前端模组700和第四天线800连接。
其中，第二射频前端模组300可以是集成有低噪声放大器和双工器的功率放大器181模组(LPAMiD，LNA-PA module with integrated duplexer)，第三射频前端模组500可以是分集接收射频前端模组(DRx)，第四射频 前端模组700可以是多输入多输出主集接收模组(PRx MIMO)。
本公开实施例提供的射频组件1000包括射频前端模组100，通过设置于封装壳体110内的多工器接收第一频段上行信号和第二频段下行信号，通过接收单元140接收第三频段的下行信号，移相单元150对流经天线端口120的信号的相位进行调节，从而避免各信号相互干扰，从而通过一个天线实现了发射第一频段上行信号和接收第二频段下行信号及第三频段下行信号，并且避免了在射频前端模组外挂六工器，能够一定程度上节约主板上的空间。
本公开示例性实施例还一种电子设备，如图11所示，所述电子设备上述的射频组件1000。
本公开实施例中的电子设备可以是手机、平板电脑、电子阅读器、导航仪、车载电脑、笔记本电脑、可穿戴设备和智能家电等具有无线通信功能的电子设备。下面以电子设备为手机为例对电子设备进行详细说明：
本公开实施例提供的电子设备还包括显示屏10、主板30、电池40以及后盖50。其中，显示屏10安装在边框20上，以形成终端设备的显示面，显示屏10作为电子设备的前壳。后盖50通过双面胶粘贴在边框上，显示屏10、边框20与后盖50形成一收容空间，用于容纳电子设备的其他电子元件或功能模块。同时，显示屏10形成电子设备的显示面，用于显示图像、文本等信息。显示屏10可以为液晶显示屏(Liquid Crystal Display，LCD)或有机发光二极管显示屏(OrganicLight-Emitting Diode，OLED)等类型的显示屏。
显示屏10上可以设置有玻璃盖板。其中，玻璃盖板可以覆盖显示屏10，以对显示屏10进行保护，防止显示屏10被刮伤或者被水损坏。
显示屏10可以包括显示区域11以及非显示区域12。其中，显示区域11执行显示屏10的显示功能，用于显示图像、文本等信息。非显示区域12不显示信息。非显示区域12可以用于设置摄像头、受话器、接近传感器等功能模块。在一些实施例中，非显示区域12可以包括位于显示区域11上部和下部的至少一个区域。
显示屏10可以为全面屏。此时，显示屏10可以全屏显示信息，从而电子设备具有较大的屏占比。显示屏10只包括显示区域11，而不包括非显示区域。此时，电子设备中的摄像头、接近传感器等功能模块可以隐藏在显示屏10下方，而电子设备的指纹识别模组可以设置在电子设备的背面。
边框20可以为中空的框体结构。其中，边框20的材质可以包括金属 或塑胶。主板30安装在上述收容空间内部。例如，主板30可以安装在边框20上，并随边框20一同收容在上述收容空间中。主板30上设置有接地点，以实现主板30的接地。主板30上可以集成有马达、麦克风、扬声器、受话器、耳机接口、通用串行总线接口(USB接口)、摄像头、接近传感器、环境光传感器、陀螺仪以及处理器等功能模块中的一个或多个。同时，显示屏10可以电连接至主板30。
主板30上设置有显示控制电路。显示控制电路向显示屏10输出电信号，以控制显示屏10显示信息。
电池40安装在上述收容空间内部。例如，电池40可以安装在边框20上，并随边框20一同收容在上述收容空间中。电池40可以电连接至主板30，以实现电池40为电子设备供电。其中，主板30上可以设置有电源管理电路。电源管理电路用于将电池40提供的电压分配到电子设备中的各个电子元件。
后盖50用于形成电子设备的外部轮廓。后盖50可以一体成型。在后盖50的成型过程中，可以在后盖50上形成后置摄像头孔、指纹识别模组安装孔等结构。
第一天线200、第二天线400、第三天线600和第四天线800可以设于电子设备的主板30、边框20或者后盖20等部位。当终端设备采用金属边框时，第一天线200、第二天线400、第三天线600和第四天线800可以是设置于金属边框20上的金属枝节。当终端设备采用金属后盖50时，第一天线200、第二天线400、第三天线600和第四天线800可以是设置于金属后盖50上的金属枝节。当终端设备采用非金属壳体(比如塑料壳体、玻璃壳体或者陶瓷壳体等)时，第一天线200、第二天线400、第三天线600和第四天线800可以设于终端设备的内部，比如，第一天线200、第二天线400、第三天线600和第四天线800可以设于终端设备的主板30。射频前端模组100、第二射频前端模组300、第三射频前端模组500和第四射频前端模组700可以设于主板30。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本公开的其他实施例。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅 由所附的权利要求来限。

Claims (20)

  1. 一种射频前端模组，所述射频前端模组包括：
    天线端口，所述天线端口用于连接天线；
    移相单元，与所述天线端口电连接，用于调节流经所述天线端口的多个信号的相位；
    多工器单元，与所述移相单元连接，用于接收第一频段上行信号和第二频段下行信号；
    接收单元，与所述移相单元连接，用于接收第三频段下行信号；及
    输出单元，分别电连接所述多工器单元和所述接收单元，所述输出单元用于对所述第二频段下行信号和所述第三频段下行信号进行放大并输出。
  2. 如权利要求1所述的射频前端模组，所述接收单元包括：
    第一滤波器，电连接所述移相单元和所述输出单元，用于接收所述移相单元传输的第三频段下行信号，并将所述第三频段下行信号滤波后传输至所述输出单元。
  3. 如权利要求2所述的射频前端模组，所述第一频段为B1，第二频段为B3，第三频段为N7、N40和N41中的任意一个。
  4. 如权利要求2所述的射频前端模组，所述输出单元包括：
    第一低噪声放大器，电连接所述多工器单元，用于对第一频段下行信号进行放大并输出；
    第二低噪声放大器，电连接所述多工器单元，用于对第二频段下行信号进行放大并输出；
    第三低噪声放大器，电连接所述第一滤波器，用于对第三频段下行信号进行放大并输出。
  5. 如权利要求2所述的射频前端模组，所述接收单元还用于接收第四频段下行信号、第五频段下行信号和第六频段下行信号，所述接收单元还包括：
    第二滤波器，电连接所述移相单元和所述输出单元，用于接收所述移相单元传输的第四频段下行信号，并将所述第四频段下行信号滤波后传输至所述输出单元；
    第三滤波器，电连接所述移相单元和所述输出单元，用于接收所述移相单元传输的第五频段下行信号，并将所述第五频段下行信号滤波后传输至所述输出单元；
    第四滤波器，电连接所述移相单元和所述输出单元，用于接收所述移相单元传输的第六频段下行信号，并将所述第六频段下行信号滤波后传输至所述输出单元。
  6. 如权利要求5所述的射频前端模组，所述第一频段为B1，第二频段为B3，第三频段为B7，所述第四频段为B25，所述第五频段为B40，所述第六频段为B66。
  7. 如权利要求5所述的射频前端模组，所述第一频段为B1，第二频段为B3，第三频段为B7，所述第四频段为B25，所述第五频段为B41，所述第四频段为B66。
  8. 如权利要求1所述的射频前端模组，所述射频前端模组还包括：
    输出开关单元，连接于所述接收单元和所述输出单元之间，用于控制所述接收单元向所述输出单元传输信号。
  9. 如权利要求1所述的射频前端模组，所述多工器单元包括：
    四工器，所述四工器包括第一端和第二端，所述四工器的第一端连接所述移相单元，所述四工器的第二端包括第一子端、第二子端、第三子端和第四子端，所述第一子端和所述输出模块电连接，所述第一子端用于将所述第一频段下行信号传输至所述输出单元，所述第二子端接收所述第一频段上行信号并将所述第一频段上行信号传输至所述第一端，所述第三子端接收所述第二频段上行信号并将所述第二频段上行信号传输至所述第一端，所述第四子端和所述输出模块电连接，所述第四子端用于将第二频段下行信号传输至所述输出单元。
  10. 如权利要求9所述的射频前端模组，所述射频前端模组还包括：
    功率放大单元，用于放大所述第一频段上行信号和所述第二频段上行信号；
    第一开关单元，输入端连接所述功率放大单元，输出端分别连接所述四工器的第二子端和第三子端，当所述功率放大器接收到所述第一频段上行信号时，所述第一开关单元将所述第一频段上行信号传输至所述四工器的第二子端，当所述功率放大器接收到所述第二频段上行信号时，所述第一开关单元将所述第二频段上行信号传输至所述四工器的第三子端。
  11. 如权利要求1所述的射频前端模组，所述射频前端模组还包括：
    第二开关单元，连接所述移相单元、所述多工器单元和所述天线端口，所述第二开关单元能多路导通，以实现所述移相单元和所述天线端口的多路信号交互。
  12. 如权利要求1所述的射频前端模组，所述移相单元包括：
    多个移相器，多个所述移相器分别对应经过所述天线端口的一个频段的信号，以使每个频段的信号的相位不同。
  13. 如权利要求1所述的射频前端模组，所述射频前端模组还包括：
    封装壳体，所述封装壳体具有承载部，所述天线端口、移相单元、多工器单元、接收单元和输出单元设于所述承载部。
  14. 一种射频组件，所述射频组件包括：
    射频前端模组，所述射频前端模组包括天线端口、移相单元、多工器单元、接收单元和输出单元，所述天线端口用于连接天线；移相单元与所述天线端口电连接，用于调节流经所述天线端口的多个信号的相位；多工器单元与所述移相单元连接，用于接收第一频段上行信号和第二频段下行信号；接收单元与所述移相单元连接，用于接收第三频段下行信号；输出单元分别电连接所述多工器单元和所述接收单元，所述输出单元用于对所述第二频段下行信号和所述第三频段下行信号进行放大并输出；
    第一天线，和所述射频前端模组中的天线端口连接。
  15. 如权利要求14所述的射频组件，所述接收单元包括：
    第一滤波器，电连接所述移相单元和所述输出单元，用于接收所述移相单元传输的第三频段下行信号，并将所述第三频段下行信号滤波后传输至所述输出单元。
  16. 如权利要求15所述的射频组件，所述输出单元包括：
    第一低噪声放大器，电连接所述多工器单元，用于对第一频段下行信号进行放大并输出；
    第二低噪声放大器，电连接所述多工器单元，用于对第二频段下行信号进行放大并输出；
    第三低噪声放大器，电连接所述第一滤波器，用于对第三频段下行信号进行放大并输出。
  17. 如权利要求14所述的射频组件，所述射频前端模组还包括：
    输出开关单元，连接于所述接收单元和所述输出单元之间，用于控制所述接收单元向所述输出单元传输信号。
  18. 如权利要求14所述的射频组件，所述射频前端模组还包括：
    封装壳体，所述封装壳体具有承载部，所述天线端口、移相单元、多工器单元、接收单元和输出单元设于所述承载部。
  19. 如权利要求14所述的射频组件，所述射频组件还包括：
    第二天线，用于接收第一频段下行信号和第二频段下行信号并发射第三频段上行信号；
    第二射频前端模组，和所述第二天线连接；
    第三天线，用于接收第一频段下行信号、第二频段下行信号和第三频段下行信号；
    第三射频前端模组，和所述第三天线连接；
    第四天线，用于接收第一频段下行信号、第二频段下行信号和第三频段下行信号；
    第四射频前端模组，和所述第四天线连接。
  20. 一种电子设备，所述电子设备包括权利要求14-19任一所述的射频组件。
PCT/CN2021/117012 2020-10-26 2021-09-07 射频前端模组及射频组件、电子设备 WO2022089013A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101753165A (zh) * 2009-11-03 2010-06-23 华为终端有限公司 双频通信系统
US20100195765A1 (en) * 2009-02-05 2010-08-05 National Taiwan University Radio frequency modulating circuit, and transmitter having the same
WO2017188783A1 (ko) * 2016-04-29 2017-11-02 주식회사 케이엠더블유 Mimo 서비스를 지원하는 안테나 분산 시스템
CN107809803A (zh) * 2017-10-26 2018-03-16 电信科学技术第四研究所有限公司 多频段宽带无线接入系统及方法
CN111342813A (zh) * 2018-12-18 2020-06-26 天津大学 基于移相网络提高隔离度的射频压电多工器和电子设备
CN112272030A (zh) * 2020-10-26 2021-01-26 Oppo广东移动通信有限公司 射频前端模组及射频组件、电子设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6694147B1 (en) * 2000-09-15 2004-02-17 Flarion Technologies, Inc. Methods and apparatus for transmitting information between a basestation and multiple mobile stations
CN103929232B (zh) * 2014-04-23 2018-02-06 西安电子科技大学 基于多波束geo卫星的宽带移动通信方法及系统
CN111034042B (zh) * 2017-08-28 2023-06-02 株式会社村田制作所 滤波器装置、多工器、高频前端电路以及通信装置
CN111313863B (zh) * 2020-02-27 2020-11-13 诺思(天津)微系统有限责任公司 一种可重构的多工器及通信设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100195765A1 (en) * 2009-02-05 2010-08-05 National Taiwan University Radio frequency modulating circuit, and transmitter having the same
CN101753165A (zh) * 2009-11-03 2010-06-23 华为终端有限公司 双频通信系统
WO2017188783A1 (ko) * 2016-04-29 2017-11-02 주식회사 케이엠더블유 Mimo 서비스를 지원하는 안테나 분산 시스템
CN107809803A (zh) * 2017-10-26 2018-03-16 电信科学技术第四研究所有限公司 多频段宽带无线接入系统及方法
CN111342813A (zh) * 2018-12-18 2020-06-26 天津大学 基于移相网络提高隔离度的射频压电多工器和电子设备
CN112272030A (zh) * 2020-10-26 2021-01-26 Oppo广东移动通信有限公司 射频前端模组及射频组件、电子设备

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