WO2022083041A1 - Optical module - Google Patents

Optical module Download PDF

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Publication number
WO2022083041A1
WO2022083041A1 PCT/CN2021/077503 CN2021077503W WO2022083041A1 WO 2022083041 A1 WO2022083041 A1 WO 2022083041A1 CN 2021077503 W CN2021077503 W CN 2021077503W WO 2022083041 A1 WO2022083041 A1 WO 2022083041A1
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WO
WIPO (PCT)
Prior art keywords
light
optical
optical fiber
array
signal light
Prior art date
Application number
PCT/CN2021/077503
Other languages
French (fr)
Chinese (zh)
Inventor
刘旭霞
杨思更
何鹏
马晓磊
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202011117865.8A external-priority patent/CN114384642A/en
Priority claimed from CN202011119907.1A external-priority patent/CN114384644A/en
Priority claimed from CN202011121035.2A external-priority patent/CN114371536A/en
Priority claimed from CN202011119875.5A external-priority patent/CN114384643B/en
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2022083041A1 publication Critical patent/WO2022083041A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60Receivers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04JMULTIPLEX COMMUNICATION
    • H04J14/00Optical multiplex systems
    • H04J14/02Wavelength-division multiplex systems

Definitions

  • the present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
  • the optical module is a tool for realizing the mutual conversion of photoelectric signals, and it is one of the key components in the optical communication equipment.
  • the transmission rate of the optical module is continuously improved. Simultaneous transmission of optical signals of multiple wavelengths in an optical fiber can increase the transmission rate, so an optical module is required to realize the simultaneous transmission of signal lights of multiple wavelengths in a single optical fiber, thereby increasing the transmission rate.
  • the present disclosure provides an optical module, comprising: a circuit board; a first lens assembly covered on a light emitting chip array, the surface having a first reflective surface and a second reflective surface; the light emitting chip array , which is arranged on the surface of the circuit board and includes a plurality of light emitting chips for emitting multiple beams of signal light with different wavelengths; the first collimating lens array is arranged between the light emitting chip array and the light multiplexing component, It includes a plurality of collimating lenses for receiving the signal light from the light emitting chip and condensing it into parallel light; the light multiplexing component is arranged on the inner wall of the first lens component and is used for receiving the signal light from the first collimating lens For the signal light of the array, the signal light from each collimating lens is incident on different positions of the optical multiplexing component, and together with the first reflecting surface, multiple beams of signal light with different wavelengths are combined into one signal light, and the combined beam is combined. The latter signal light is transmitted to
  • the present disclosure provides an optical module, comprising: a circuit board; a second lens assembly, covered on the light emitting chip array, and having a third reflection surface and a fourth reflection surface on the surface, wherein the third reflection surface
  • the surface is used to receive the signal light from the external optical fiber;
  • the optical demultiplexing component is arranged on the inner wall of the second lens component, and is used to receive the signal light from the third reflecting surface, and reflect the light with the fourth reflecting surface.
  • a beam of signal light is divided into multiple beams of signal light with different wavelengths together;
  • the second collimating lens array located between the light receiving chip array and the optical demultiplexing component, includes a plurality of collimating lenses for receiving The signal light emitted from different positions of the optical demultiplexing component is collected into parallel light;
  • the light-receiving chip array is arranged on the surface of the circuit board, and includes a plurality of light-receiving chips, which are used for receiving light from the first light-receiving chip. Signal light from two collimating lens arrays.
  • the present disclosure provides an optical module, comprising: a circuit board; a first lens assembly covered on the light emitting chip array, the surface has a first reflection surface and a second reflection surface, and the bottom ends are respectively provided with an inward first bearing surface and a second bearing surface;
  • the light emitting chip array disposed on the surface of the circuit board, includes a plurality of light emitting chips for emitting multiple beams of signal light with different wavelengths;
  • the straight lens array is set as a flat structure, one end is placed on the first bearing surface, the other end is placed on the second bearing surface, and is arranged between the light emitting chip array and the light multiplexing component, including a plurality of
  • the collimating lens is used for receiving the signal light from the light emitting chip and condensing it into parallel light;
  • the light multiplexing component is arranged on the inner wall of the first lens component and is used for receiving the signal from the first collimating lens array
  • the signal light from each collimating lens is incident on different positions of the optical multiplex
  • the present disclosure provides an optical module, comprising: a circuit board; a second lens assembly covered on the light emitting chip array, the surface has a third reflection surface and a fourth reflection surface, and the bottom ends are respectively provided with The inward third bearing surface and the fourth bearing surface, wherein the third reflection surface is used to receive the signal light from the external optical fiber; the optical demultiplexing component is arranged on the inner wall of the second lens component, and is used to receive the signal light from the external optical fiber; The signal light of the third reflection surface, together with the fourth reflection surface, divides a beam of signal light into multiple signal beams of different wavelengths; the second collimating lens array is set as a flat structure, and one end is placed in the The first bearing surface, the other end of which is placed on the second bearing surface, is arranged between the light receiving chip array and the light demultiplexing component, and includes a plurality of collimating lenses for receiving the light from the light demultiplexer.
  • the signal light emitted from different positions of the multiplexing component is collected into parallel light;
  • the light-receiving chip array disposed on the surface of the circuit board, includes a plurality of light-receiving chips for receiving the light from the second collimating lens array signal light.
  • the present disclosure provides an optical module, comprising: a circuit board; a first lens assembly, covered on the light emitting chip array, the surface has a first reflection surface and a second reflection surface, and one end side is provided with a limit components; a first optical fiber support, one end side is provided with a docking component, and the docking component is inserted into the limiting component;
  • the light emitting chip array is arranged on the surface of the circuit board, and includes a plurality of light emitting chips, which are used for for emitting multiple beams of signal light with different wavelengths;
  • the first collimating lens array located between the light emitting chip array and the light multiplexing component, includes a plurality of collimating lenses for receiving the signal light from the light emitting chip and Condensed into parallel light;
  • the light multiplexing component is arranged on the inner wall of the first lens component, and is used for receiving the signal light from the first collimating lens array, and the signal light from each collimating lens is incident on the light complex Using different positions of the
  • the present disclosure provides an optical module, comprising: a limiting member; a second optical fiber support, one end side is provided with a docking member, the abutting member is inserted into the limiting member; a second converging lens array, including a plurality of converging lenses for receiving the signal light from the second optical fiber support and converging the signal light to the third reflection surface;
  • the light demultiplexing component is arranged on the inner wall of the second lens component, It is used to receive the signal light from the third reflection surface, and together with the fourth reflection surface, divide a beam of signal light into multiple beams of signal light with different wavelengths;
  • the second collimating lens array is arranged on the light
  • a plurality of collimating lenses are included between the receiving chip array and the optical demultiplexing component, which are used for receiving the signal light emitted from different positions of the optical demultiplexing component and condensing them into parallel light;
  • the light receiving chip array is arranged on the The surface of the circuit board includes a plurality of
  • the present disclosure provides an optical module, including a circuit board; an array of light emitting chips, arranged on the surface of the circuit board, divided into groups by rows or columns, and a plurality of light emitting chips in the group can emit multiple beams of different wavelengths
  • the collimating lens array is arranged in the light-emitting direction of the light emitting chip array, and a single lens converges a single beam of light
  • the lens assembly is arranged on the circuit board, and is covered by the light emitting chip array and the collimating lens array above
  • the optical multiplexing component which is arranged in the light-emitting direction of the collimating lens array, and is fixedly connected to the inner wall of the lens component for combining multiple beams of light into one beam
  • the optical fiber array which is connected to the lens component, can receive a beam of light Light.
  • Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals
  • FIG. 2 is a schematic structural diagram of an optical network terminal
  • FIG. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module provided in an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of the first optical module provided by the embodiment of the present disclosure after removing the upper casing, the lower casing and the unlocking part;
  • FIG. 6 is a perspective view of a first first lens assembly according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic cross-sectional structural diagram of a first first lens assembly according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of an exploded structure of a first first lens assembly according to an embodiment of the present disclosure.
  • FIG. 9 is a use state diagram of a first lens assembly provided by an embodiment of the present disclosure.
  • FIG. 10 is a working principle diagram of an optical multiplexing component provided by an embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of an exploded structure of a second optical module provided in an embodiment of the present disclosure.
  • FIG. 12 is a schematic structural diagram of the second optical module provided by the embodiment of the present disclosure after removing the upper casing, the lower casing and the unlocking part;
  • FIG. 13 is a perspective view of a second type of first lens assembly provided in an embodiment of the present disclosure.
  • FIG. 14 is a schematic cross-sectional structure diagram 1 of a second type of first lens assembly according to an embodiment of the present disclosure
  • FIG. 15 is a schematic diagram of an exploded structure of a second type of first lens assembly provided in an embodiment of the present disclosure
  • FIG. 16 is a schematic diagram of an exploded structure of a third optical module provided in an embodiment of the present disclosure.
  • FIG. 17 is a schematic cross-sectional structural diagram of a third first lens assembly according to an embodiment of the present disclosure.
  • FIG. 18 is a perspective view of a third first lens assembly according to an embodiment of the present disclosure.
  • FIG. 19 is an exploded view 1 of a third first lens assembly according to an embodiment of the present disclosure.
  • FIG. 20 is an exploded view 2 of a third first lens assembly according to an embodiment of the present disclosure.
  • FIG. 21 is an exploded structural diagram of a second lens assembly according to an embodiment of the present disclosure.
  • FIG. 22 is an exploded structural diagram of still another second lens assembly provided by an embodiment of the present disclosure.
  • FIG. 23 is a schematic diagram of an exploded structure of a second lens assembly according to an embodiment of the present disclosure.
  • FIG. 24 is a working principle diagram of an optical demultiplexing component provided by an embodiment of the present disclosure.
  • One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals.
  • Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides.
  • the passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used.
  • the optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module.
  • the optical module realizes the electrical connection with the external host computer through the gold finger on its internal circuit board.
  • the main electrical connections include power supply, I2C signal, data signal and grounding, etc.
  • the electrical connection method realized by the gold finger has become the optical module.
  • the mainstream connection method of the industry based on this, the definition of pins on the gold finger has formed a variety of industry protocols/norms.
  • FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal.
  • the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100 , the optical module 200 , the optical fiber 101 and the network cable 103 .
  • One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device.
  • the connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.
  • the optical port of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101;
  • the electrical port of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100;
  • the optical module realizes mutual conversion between optical signals and electrical signals, so as to establish an information connection between the optical fiber and the optical network terminal; in an embodiment of the present application, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input.
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.
  • the optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200; Signal connection; a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100.
  • the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module.
  • the optical network terminal is used as the host computer of the optical module to monitor the work of the optical module.
  • the remote server has established a bidirectional signal transmission channel with the local information processing device through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
  • Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal 100 is the host computer of the optical module 200, provides data signals to the optical module 200, and receives data signals from the optical module 200. There are also optical line terminals and so on.
  • FIG. 2 is a schematic structural diagram of an optical network terminal.
  • the optical network terminal 100 has a circuit board 105, and a cage 106 is arranged on the surface of the circuit board 105; an electrical connector is arranged in the cage 106 for connecting to the electrical port of an optical module such as a golden finger;
  • the cage 106 is provided with a radiator 107, and the radiator 107 has a raised structure such as fins to increase the heat dissipation area.
  • the optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector in the cage 106 , and the optical port of the optical module 200 is connected to the optical fiber 101 .
  • the cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage; the optical module 200 is inserted into the cage, the optical module 200 is fixed by the cage, and the heat generated by the optical module 200 is conducted to the cage through the optical module housing, and finally Diffusion takes place through heat sinks 107 on the cage.
  • FIG. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural diagram of an exploded optical module 200 according to an embodiment of the present disclosure.
  • the optical module 200 provided by the embodiment of the present disclosure includes an upper casing 201 , a lower casing 202 , an unlocking part 203 , and a circuit board 300 .
  • the upper casing 201 is covered with the lower casing 202 to form a wrapping cavity with two openings, and the outer contour of the wrapping cavity generally presents a square shape.
  • the lower case 202 includes a main board and two side plates located on both sides of the main board and perpendicular to the main board;
  • the upper case 201 includes a cover plate, and the cover plate covers the two sides of the upper case 201 two side plates to form a wrapping cavity;
  • the upper casing 201 may also include two side walls located on both sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize the upper
  • the casing 201 is covered with the lower casing 202 .
  • the two openings may be openings (204, 205) at both ends in the same direction, or may be two openings in different directions; one of the openings is the electrical port 204, and the gold finger of the circuit board 300 extends from the electrical port 204.
  • the other opening is the optical port 205, which is used for external optical fiber access to connect the optical transceiver device inside the optical module 200.
  • the circuit board 300, the optical transceiver device and other optoelectronic devices are located in the package cavity. middle.
  • the combination of the upper casing 201 and the lower casing 202 is adopted to facilitate the installation of components such as the circuit board 300 into the casing, and the upper casing 201 and the lower casing 202 form the outermost packaging protection casing of the optical module.
  • the upper casing 201 and the lower casing 202 are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation; generally, the casing of the optical module 200 is not made into an integrated structure, so that when assembling circuit boards and other devices, positioning components, heat dissipation and The electromagnetic shielding structure cannot be installed and is not conducive to production automation.
  • the unlocking part 203 is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.
  • the unlocking part 203 has an engaging structure matched with the cage of the upper computer; the end of the unlocking part 203 can be pulled to relatively move the unlocking part 203 on the surface of the outer wall; Fix the optical module in the cage of the host computer; by pulling the unlocking part 203, the engaging structure of the unlocking part 203 moves with it, thereby changing the connection relationship between the engaging structure and the host computer to release the optical module and the host computer. relationship, so that the optical module can be pulled out from the cage of the host computer.
  • the circuit board 300 is provided with a light-emitting chip, a driving chip for the light-emitting chip, a light-receiving chip, a transimpedance amplifying chip, a limiting amplifying chip, a microprocessor chip, etc., wherein the light-emitting chip and the light-receiving chip are directly mounted on the light-emitting chip.
  • this form is called COB package in the industry.
  • the circuit board 300 connects the electrical components in the optical module according to the circuit design through circuit wiring, so as to realize the electrical functions such as power supply, electrical signal transmission and grounding; at the same time, the circuit board 300 also has the functions of various components carried, such as circuit
  • the board carries the lens assembly.
  • the circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. In an embodiment of the present application, metal pins/gold fingers are formed on one end surface of the rigid circuit board for connecting with the electrical connector.
  • the optical module further includes a lens assembly, and the lens assembly is disposed on the circuit board 300 .
  • the lens assembly and the circuit board 300 form a cavity enclosing the light emitting chip array or the light receiving chip array, and the light emitting chip array or the light receiving chip array is located in the cavity.
  • the lens assembly is used to transmit the light beam and change the direction of the beam transmission during the transmission process.
  • the light emitted by the optical chip in the light emitting chip array is transmitted and reflected by the lens assembly and then enters the optical fiber; or, the light from the optical fiber enters the light receiving chip after being reflected by the lens assembly, and the lens assembly not only functions to seal the optical chip It also establishes the optical connection between the optical chip and the optical fiber.
  • the lens assembly is also covered above the light-emitting chip array or the light-receiving chip array, which facilitates changing the propagation direction of the signal light emitted by the light-emitting chip or the signal light from outside the optical module by using fewer components.
  • the light-emitting chip array is covered by the lens assembly, or the light-receiving chip array is covered by the lens assembly, or the light-emitting chip array and the light-receiving chip array can be covered by the lens assembly respectively.
  • the number of lens components may be one, or two, or the like.
  • the lens assembly may not only be disposed at one end of the circuit board 300 close to the optical port, but also may be disposed in the middle of the circuit board 300, which may be selected according to the actual needs of the optical module.
  • the lens assembly is disposed above the light-emitting chip array or the light-receiving chip array in a cover-up manner; wherein: the light-emitting chip array includes several light-emitting chips, and usually each light-emitting chip is used for The signal light of one wavelength is emitted, and then the light-emitting chip array is used to emit multiple beams of signal light of different wavelengths; the light-receiving chip array includes several light-receiving chips, and usually each light-receiving chip is used to receive one wavelength of signal light.
  • the light-receiving chip array is used for receiving different multiple beams of signal light with different wavelengths.
  • the light-emitting chip array includes 2, 3, and 4 light-emitting chips
  • the light-receiving chip array includes 2, 3, and 4 light-receiving chips.
  • Light emitting chips or light receiving chips are divided into groups by rows or columns, multiple light emitting chips in the group can emit multiple beams of optical signals of different wavelengths, and multiple light receiving chips in the group receive light of one wavelength respectively; the present disclosure
  • the light-emitting chips or light-receiving chips are arranged in an array structure, in which one row of light-emitting chips or light-receiving chips arranged along the length direction of the circuit board is set as a group, and multiple rows of light-emitting chips or light-receiving chips are arranged along the width direction of the circuit board. Chips, multi-row light-emitting chips or light-receiving chips are set to multiple groups.
  • Figure 4 for the definition of the length direction and width direction of the circuit board. In Figure 4, the direction from left to right is defined as the length direction of the circuit board, and it is defined from top to bottom. is the width direction of the circuit board.
  • two lens assemblies are included.
  • one lens assembly is referred to as a first lens assembly
  • the other lens assembly is referred to as a second lens assembly.
  • the lens assembly on the chip array is called the first lens assembly
  • the lens assembly covered on the light-receiving chip array is called the second lens assembly.
  • high-speed data transmission requires close proximity between optical chips and their driving/matching chips in a light-emitting chip array or light-receiving assembly, so as to shorten the connection between chips and reduce the number of connections.
  • the lens assembly When the lens assembly is installed above the optical chip, the lens assembly generally covers the optical chip and its driving/matching chip at the same time. Therefore, in the light-emitting chip array, the light-emitting chip and the driving chip of the light-emitting chip are arranged in close proximity, and the lens assembly covers the light-emitting chip and the driving chip of the light-emitting chip; The lens assembly covers the light receiving chip and the transimpedance amplifying chip.
  • the embodiments of the present disclosure include other optical devices and lens assemblies. The following is a detailed description in conjunction with the specific use of the lens assembly.
  • the light emitting structure will be described below.
  • FIG. 5 is a schematic structural diagram of the optical module in the embodiment of the disclosure after removing the upper casing, the lower casing and the unlocking components.
  • the first lens assembly 400 is connected to one end of the optical fiber array 900 , and the other end of the optical fiber array 900 is connected to the optical fiber adapter 600 , through which the optical fiber adapter 600 realizes optical connection with external optical fibers.
  • the first lens assembly 400 is disposed on the circuit board 300 .
  • the first lens assembly 400 and the circuit board 300 form a wrapping cavity. For the convenience of description, the wrapping cavity is described as a first accommodating cavity.
  • One end of the optical fiber adapter 600 is connected to the internal optical fiber, and the other end is connected to the external optical fiber, and the internal optical fiber and the external optical fiber are connected through the optical fiber adapter 600 .
  • FIG. 6 is a perspective view of a first first lens assembly provided by an embodiment of the present disclosure
  • FIG. 7 is a schematic cross-sectional structural diagram of a first first lens assembly provided by an embodiment of the present disclosure
  • the first lens assembly 400 and the circuit board 300 form a first accommodating cavity 430, and the first accommodating cavity 430 is used for arranging optical devices.
  • the top surface of the first lens assembly 400 is provided with a first reflection surface 410 and a second reflection surface 420 .
  • the first reflection surface 410 is used for reflecting the signal light incident thereon
  • the second reflection surface 420 is used for reflecting and condensing the signal light reflected thereon into the optical fiber ribbon.
  • the light emitting chip array 440 includes a plurality of light emitting chips for emitting multiple beams of signal light with different wavelengths
  • the collimating lens array 450 includes several collimating lenses for collimating the signal light of the light emitting chip array.
  • the light-emitting chip array is divided into groups by rows or columns, and multiple light-emitting chips in the group can emit multiple beams of light signals of different wavelengths; the collimating lens array is arranged in the light-emitting direction of the light-emitting chip array. The beams of light are converged.
  • the collimating lens array 450 is covered above the light emitting chip array 440.
  • the number of lenses in the collimating lens array 450 depends on the number of light emitting chips in the light emitting chip array 440.
  • the number of light emitting chips in the emitting chip array 440 .
  • the light multiplexing component is arranged in the light-emitting direction of the collimating lens array, and is fixedly connected to the inner wall of the lens component, and is used to combine multiple beams of light into one beam; It is used to combine multiple signal lights of different wavelengths into one signal light.
  • the surface of the optical multiplexing component facing the collimating lens array is a filtering surface, and the surface facing the lens component includes a main body reflective surface and a light-transmitting surface; multiple different positions of the filtering surface respectively transmit a plurality of single beams of light from the collimating lens array; the main body reflects The filter surface can reflect the light from the filter surface to the filter surface; the filter surface can reflect the light from the main body reflection surface; the light transmission surface can transmit the light from the filter surface; the filter surface and the main body reflection surface can combine multiple beams into one beam Light;
  • the optical multiplexing component 460 usually includes a plurality of filters, and the filter surfaces are formed by the plurality of filters; the filters use different film layers on both sides and different positions to allow the transmission of signal light of a specific wavelength and signal light of other wavelengths.
  • the filter surface in the optical multiplexing component 460 allows the reflection of the signal light of a certain wavelength, and the optical multiplexing component 460 coordinately selects the number of reflections of each beam according to the number of beams to be combined, and finally realizes the combination of different wavelengths of signal light. bundle.
  • the surface of the optical multiplexing component facing the collimating lens array is a filtering surface, and the surface facing the lens component is a light-transmitting surface;
  • the upper surface of the lens component includes a first reflecting surface; multiple different positions of the filtering surface respectively transmit the light from the collimating lens array.
  • the lens assembly further includes an inclined second reflecting surface, and the second reflecting surface is provided with a converging lens array, which can condense and reflect the light from the light multiplexing assembly to the optical fiber array.
  • the first reflective surface 410 is an inclined surface for reflecting the signal light incident thereon, and the second reflective surface is disposed close to the light-emitting direction for reflecting and converging the signal light incident thereon into the optical fiber of the optical module;
  • the inclination angle of the first reflecting surface 410 and the optical multiplexing component 460 is selected between 4° and 17°.
  • the projection of the light multiplexing component 460 in the direction of the circuit board covers the light emitting chips in the light emitting chip array 440
  • the projection of the first reflective surface 410 in the direction of the circuit board covers the light multiplexing component 460
  • the light For the signal light emitted by the light emitting chips in the emitting chip array 440, the light signals emitted by the light emitting chips are in a diverging state, and are diverging light beams. In order to facilitate the subsequent optical path design and optical coupling into the optical fiber, the divergent beam needs to be converged.
  • the diverging light beams are converged into parallel light beams by a collimating lens, and after being converged by the collimating lenses in the collimating lens array 450, they are sequentially transmitted to the optical multiplexing component 460 and the first reflecting surface 410.
  • the light is incident on different positions of the optical multiplexing component 460.
  • the first reflecting surface 410 receives the signal light from the optical multiplexing component 460 and then changes the propagation direction of the light to reflect it to the surface of the optical multiplexing component 460.
  • the signal light of this wavelength is combined with the optical multiplexing component.
  • the signal light at other positions of 460 is combined and incident on the first reflecting surface 410, and finally the signal light of different wavelengths is combined into a beam of light, which is transmitted to the second reflecting surface 420.
  • the second reflecting surface 420 changes the propagation direction of the light and finally converts the beam.
  • the light is emitted to the outside of the optical module, and the signal light of different wavelengths can share one optical fiber to transmit out of the optical module, so that the signal light of multiple wavelengths in a single optical fiber can be transmitted at the same time.
  • the first reflection surface 410 is a total reflection surface, and the signal light emitted by the light emitting chip is transmitted to the first reflection surface 410 for total reflection.
  • the second reflection surface 420 is set as an inclined surface. After the combined signal light is transmitted to the second reflection surface 420, the second reflection surface 420 needs to realize reflection and convergence at the same time.
  • a plurality of convex structures can be arranged on the surface of the second reflecting surface 420, the inclined surface of the second reflecting surface 420 has the function of reflecting the signal light, and the convex structure can realize the function of concentrating the signal light;
  • One end of the reflective surface is connected to the first reflective surface, and the other end is connected to a converging lens, that is, the first lens component includes a converging lens at this time, and the converging effect is achieved by arranging the converging lens.
  • the surface of the circuit board 300 has a bearing surface, which can carry a plurality of light emitting chips.
  • the light emitting chips are arranged in an array.
  • One row of light-emitting chips in the upper direction is set as one group, so that multiple groups of light-emitting chips can be set.
  • the direction in Figure 4 is defined as the length direction of the circuit board from left to right. From top to bottom is defined as the board width direction. As shown in FIG.
  • the collimating lens array 450 in the embodiment of the present disclosure is a support type structure, including a main board and a side board supporting the main body, the side board is arranged on the circuit board, and the main board is provided with a convex array capable of condensing light ;
  • the structure can carry a plurality of collimating lenses, and the support structure has strong stability and good collimation effect; wherein the support structure can specifically include a main board and two side plates arranged on both sides of the main board, the main board and the two sides After the board is assembled, a support structure is formed, the two side boards are in contact with the circuit board, and a plurality of collimating lenses are arranged on the surface of the main board.
  • collimating lenses are arranged in the length direction and width direction of the circuit board, and a row of collimating lenses in the length direction is set as one group, so that multiple groups of collimating lenses can be set, and the length and width of the circuit board are related.
  • width direction refer to FIG. 4 .
  • the direction from left to right is defined as the length direction of the circuit board
  • the direction from top to bottom is defined as the width direction of the circuit board.
  • Multiple sets of collimating lenses receive the signal light from the light emitting chip, and perform condensing processing on each signal light, so as to condense the signal light in the divergent state into parallel beams.
  • the optical fiber socket includes: a first connection part 401a, which is used for plugging with the optical fiber cladding;
  • the second connecting portion 401b is used for plugging with the optical fiber protective layer;
  • the third connecting portion 401c has a accommodating cavity, which can accommodate and wrap each optical fiber ribbon through the hub member, and then insert the hub member into the accommodating cavity of the third connecting portion 401c , wherein the hub component may be a sleeve wrapping the optical fiber ribbons, each optical fiber ribbon is inserted into the sleeve, and then the sleeve is inserted into the accommodating cavity of the third connection portion 401c.
  • the inner diameters of the first connecting portion 401a, the second connecting portion 401b and the third connecting portion 401c are all different in size, and there is a transition connecting portion at the interface between the first connecting portion 401a and the second connecting portion 401b, There is also a filter connection part at the interface between the second connection part 401b and the third connection part 401c.
  • the shape of the optical fiber socket 401 is consistent with the structure of the optical fiber. The layer is placed at the first connection part 401a, and the protective layer of the optical fiber is placed at the second connection part 401b, and the number of fibers is large and the fibers are relatively soft, so a third connection part 401c is required for gathering and fixing the fibers.
  • the optical fiber socket 401 and the first lens assembly 400 are integrally formed, so that the relative position of the external optical fiber and the first lens assembly 400 can be fixed, and there will be no positional deviation between the external optical fiber and the first lens assembly 400. This helps to improve the coupling precision of the signal light to the optical fiber after the bundle is combined, so that the coupling efficiency of the signal light from the first lens assembly 400 to the external optical fiber is increased. Finally, signal lights of different wavelengths can share a single fiber to transmit out of the optical module, so as to realize simultaneous transmission of signal lights of multiple wavelengths in a single fiber.
  • the optical multiplexing component 460 includes light entrance ports for incident light beams of different wavelengths into the optical multiplexing component 460 , but only has one light exit port for exiting the combined light beam. It is assumed that there are 4 signal lights with wavelengths ⁇ 1, ⁇ 2, ⁇ 3 and ⁇ 4 that need to be combined into one signal light, and the four optical signals that need to be combined are incident on the optical multiplexing component 460 through different light entrances of the optical multiplexing component 460,
  • the ⁇ 1 signal light passes through the optical multiplexing component 206 and the first reflecting surface 410 for six different reflections to reach the light exit port, and the ⁇ 2 signal light passes through the optical multiplexing component 206 and the first reflecting surface 410 for four different reflections to reach the light exit port,
  • the ⁇ 3 signal light passes through the optical multiplexing component 206 and the first reflective surface 410 for two different reflections to reach the light outlet, and the ⁇ 4 signal light enters the optical multiplexing component 206 and then directly transmits to the
  • the optical input port of the optical fiber enters the optical multiplexing component 460, and is output from the optical multiplexing component 460 through the same optical exit port. In this way, 4 beams of signal light with different wavelengths are combined into one beam at the optical outlet, and then the combined signal beam is transmitted to the optical fiber through the optical outlet. Signal light of multiple wavelengths is transmitted simultaneously.
  • the present disclosure also provides another structure of the optical module and its corresponding first lens assembly and other structures.
  • 11 is a schematic diagram of the exploded structure of the second optical module provided in the embodiment of the present disclosure
  • FIG. 12 is a schematic structural diagram of the second optical module provided by the embodiment of the present disclosure after removing the upper casing, the lower casing and the unlocking part
  • 13 is a perspective view of a second type of first lens assembly provided by an embodiment of the present disclosure
  • FIG. 14 is a second schematic cross-sectional structure diagram of a second type of first lens assembly provided by an embodiment of the present disclosure
  • FIG. 15 is provided by an embodiment of the present disclosure
  • the structure of the first lens assembly 400 in this embodiment is the same as that of the first lens assembly in the first embodiment. 12 clearly shows the structure of the first lens assembly 400 in this embodiment.
  • the difference between the structure of the first lens assembly 400 in this embodiment and the previous embodiments is that the first lens assembly 400 in this embodiment
  • Both ends of a lens assembly 400 have two inward bearing surfaces, which are defined as a first bearing surface 470a and a second bearing surface 470b for the convenience of description.
  • the lens array and the lens assembly are fixed;
  • Fig. 16 clearly shows that the collimating lens array 450 is a flat structure, on which a plurality of collimating lenses are arranged to collimate the signal light emitted by the light emitting chip.
  • the collimating lens array 450 is placed on the first bearing surface 470a, and the other end is placed on the second bearing surface 470b.
  • the collimating lens array 450 of this structure is preferably connected to the first lens assembly 400 during packaging, and then cooperates with the cover to set.
  • the collimating lens array 450, the first bearing surface 470a and the second bearing surface 470b cooperate with each other to ensure that the relative positions of the collimating lens array 450 and the first lens assembly 400 are fixed.
  • the signal light emitted by the light emitting chips in the light emitting chip array 440 is fixed to the emission direction of the collimating lens array 450, thereby ensuring the collimation of the signal light emitted by the light emitting chips in the light emitting chip array 440 by the collimating lens array 450 Effect.
  • the flat-plate structure of the collimating lens array 450 can be set as a horizontal I-shape, the two ends are horizontally placed on the corresponding bearing surfaces, and the surface of the main body plate in the middle of the I-shape flat plate is provided with a plurality of collimators. Lenses, a plurality of collimating lenses are arranged on the surface of the main body plate in the form of an array.
  • the first reflecting surface 410 the second reflecting surface 420, the first receiving cavity 430, the light emitting chip array 440, the light multiplexing component 460 and the optical fiber
  • the structure and function of the socket 401 are the same as those in the first embodiment, and are not repeated here.
  • the total length of the collimating lens array 450 needs to be smaller than the length of the inner diameter of the first bearing surface 470a to the second bearing surface 470b, that is, the inner wall of the collimating lens array 450 to the first bearing surface 470a has a certain surplus length, The inner wall of the collimating lens array 450 to the second bearing surface 470b has a certain surplus length.
  • this embodiment provides an optical module of another structure and each optical device thereof.
  • 16 is a schematic diagram of an exploded structure of a third optical module provided in an embodiment of the present disclosure
  • FIG. 17 is a schematic diagram of a cross-sectional structure of a third type of first lens assembly provided in an embodiment of the present disclosure
  • FIG. 19 is an exploded view 1 of a third first lens assembly according to an embodiment of the present disclosure
  • FIG. 20 is an exploded view of a third first lens assembly according to an embodiment of the present disclosure 2.
  • the optical fiber socket and the first lens assembly are integrated to realize the transmission of the synthesized signal light to the external optical fiber.
  • other methods can also be used to realize the synthesized signal light.
  • the signal light is transmitted to the external optical fiber.
  • the synthesized signal light is transmitted to the external optical fiber by arranging the optical fiber support.
  • the specific implementation is as follows:
  • the optical module includes a first lens assembly 400 , an optical fiber array 900 , an optical fiber adapter 600 , and an optical fiber support 800 .
  • it also includes a converging lens array 700 , wherein the first lens
  • the component includes a first reflecting surface 410, a second reflecting surface 420, a light emitting chip array 440, a collimating lens array 450, and an optical multiplexing component 460, wherein the surfaces of the first reflecting surface 410 and the second reflecting surface 420 are straight surfaces, and
  • the functions of each device are the same as those in the foregoing embodiments, and are not repeated here.
  • the upper surface of the lens assembly includes an inclined second reflective surface, which can collect and reflect the light from the optical multiplexing component to the optical fiber array; a converging lens array is arranged between the second reflective surface and the optical fiber array, and the lens array will The light from the second reflecting surface is collected and directed towards the fiber array.
  • the optical fiber array includes an optical fiber bracket, the end of the optical fiber bracket is provided with a through hole, and the optical fiber is arranged in the through hole;
  • the converging lens array 700 is arranged at one end of the second reflecting surface 420 close to the light outlet, and the signal light synthesized by the optical multiplexing component 460 is transmitted to the second reflecting surface 420, and then is reflected by the second reflecting surface 420 and then coupled to the converging lens array 700,
  • the optical fiber support 800 is converged by the converging lens array 700, wherein the fiber support 800 is provided with a plurality of optical fiber ribbons, and the optical fiber ribbons are connected with the optical fiber adapter 600, thereby realizing the transmission of optical signals.
  • the converging lens array 700 in the embodiment of the present disclosure can also be arranged at the front end of the optical fiber support 800 , and the converging lens array 700 and the optical fiber support 800 can be set as an integrated structure, and the converging lens array 700 can be converged after the converging lens array 700 is converged.
  • the light spot is then coupled into the fiber support 800, the fiber array includes a fiber support, the fiber is arranged in the fiber support, and the end surface of the fiber support is provided with a converging lens array; the converging lens array converges the light from the lens assembly into the fiber.
  • the structure of the optical fiber holder 800 includes the converging lens array 700, and the converging lens array 700 in the foregoing embodiment is disposed between the second reflecting surface 420 and the optical fiber holder 800, and the first lens assembly 400 includes the converging lens array at this time. 700.
  • one end of the first lens assembly 400 has a bearing table, and the optical fiber holder 800 is placed on the surface of the bearing table.
  • the front end of the first lens assembly 400 is provided with two limiting parts 900a.
  • Two docking parts 900b are provided, and the docking parts 900b are inserted into the corresponding limiting parts 900a, so as to realize the connection between the first lens assembly 400 and the optical fiber support 800;
  • the docking part 900b is formed as a limiting hole, and the limiting column is inserted into the corresponding limiting hole to realize the docking of the first lens assembly 400 and the optical fiber holder 800.
  • the first lens assembly One end of 400 near the limiting member 900a is provided with a boss, the bottom end of the optical fiber support 800 is recessed inward to form a concave platform, the lower surface of the concave platform is seated on the boss, and both ends of the optical fiber support 800 are set on two sides of the boss.
  • the upper surface of the concave platform is provided with an installation groove for installing the optical fiber ribbon.
  • the installation groove can fix and limit the optical fiber ribbon.
  • the converging lens array 700 is provided with a first light-passing port, and the optical fiber support 800 is provided with a second light-passing port.
  • the optical fiber ribbon passes through the optical fiber support along the first optical port and the second optical port and is placed in the installation groove.
  • FIG. 9 is a use state diagram of a first lens assembly provided by an embodiment of the present disclosure
  • FIG. 10 is a working principle diagram of an optical multiplexing assembly provided by an embodiment of the present disclosure
  • the light-emitting chips in the light-emitting chip array 440 are located along the circuit board 300 in the width direction (the width direction of the first lens assembly 400 ) is arranged in rows.
  • the collimating lens array 450 provided in the first accommodating cavity 430 of the first lens assembly 400 includes four lenses, and the four lenses are arranged in a row along the width direction of the first lens assembly 400 .
  • the collimating lens array The lens in 450 can be used for the collimation of four beams of signal light, and the four beams of signal light collimated by the lens in the collimating lens array 450 are folded back between the optical multiplexing component 460 and the first reflecting surface 410, and finally one beam is output.
  • Signal light the beam of signal light includes signal light of different wavelengths.
  • the optical multiplexing component 460 utilizes different film layers arranged on both sides and different positions to transmit and reflect the signal light of different wavelengths, and combine multiple beams of signal light of different wavelengths into one beam of light.
  • the optical multiplexing component 206 coordinately selects the number of reflections of each beam according to the number of beams to be combined.
  • the signal light emitted by the light emitting chip in the light emitting chip array 440 is transmitted upward and transmitted to the lens in the collimating lens array 450, and the signal light emitted by the light emitting chip is divergent light passing through the lens Collimation is parallel light; the signal light collimated by the collimating lens array 450 is transmitted to the optical multiplexing component 460, and the light beam of one wavelength is transmitted to the first reflecting surface 410 through the optical multiplexing component 460, and is transmitted through the first reflecting surface 410.
  • the light beam with another wavelength is transmitted to the first reflecting surface 410 after being combined by the optical multiplexing component 460, and is totally reflected to the optical multiplexing component 460 by the first reflecting surface 410.
  • the optical multiplexing component 460 is combined by the optical multiplexing component 460 and then transmitted to the first reflection surface 410, thus completing the multiplexing of multiple beams of signal light with different wavelengths, and finally generating a beam of signal light, which passes through the second beam.
  • the reflection surface 420 is reflected into the optical fiber ribbon to realize simultaneous transmission of signal light of multiple wavelengths in a single optical fiber.
  • the beam combining of multiple signal lights with different wavelengths is completed, which improves the coupling when coupling multiple channels in the optical module. precision.
  • the light receiving structure will be described below.
  • the structure of the second lens assembly 500 is similar to or the same as that of the first lens assembly 400 .
  • the lens assembly in light emission is defined as the first lens assembly
  • the lens assembly in light reception is defined as the second lens assembly.
  • FIG. 21 is an exploded structure of a second lens assembly provided by an embodiment of the present disclosure.
  • Fig. 22 is an exploded structural view of still another second lens assembly provided by an embodiment of the present disclosure. As shown in FIG. 22 or 23, the second lens assembly 500 and the circuit board 300 form a second accommodating cavity 530, and the second accommodating cavity 530 is used for arranging optical devices.
  • the light receiving chip array 540 includes a plurality of light-receiving chips for receiving multiple beams of signal light with different wavelengths, wherein the light-receiving chips are arranged in the form of an array, and the light-receiving chips are arranged in the length direction and the width direction of the circuit board.
  • the second collimating lens array 550 includes several collimating lenses for collimating the signal light output by the light demultiplexing component 560 .
  • the second collimating lens array 550 is covered above the light-receiving chip array 540.
  • the number of lenses in the second collimating lens array 550 depends on the number of light-receiving chips in the light-receiving chip array 540. Usually, the second collimating lens array The number of lenses of 550 is equal to the number of light-receiving chips in the light-receiving chip array 540 .
  • the optical demultiplexing component 560 is disposed on the inner wall of the second accommodating cavity 530, and is used for decomposing a signal light into multiple signal lights with different wavelengths.
  • the optical demultiplexing component 560 includes a plurality of filters.
  • the optical demultiplexing component 560 uses different film layers arranged on both sides and different positions to transmit and reflect the signal light of different wavelengths, and split a signal light including different wavelengths into multiple beams of light .
  • the optical demultiplexing component 560 coordinately selects the number of reflections of the signal light of each wavelength according to the wavelength type of the split light and the number of split beams.
  • a beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly 500 , and the beam of signal light is reflected by the third reflecting surface 520 to the light demultiplexing assembly 560 , wherein The light beam of one wavelength passes through the optical demultiplexing component 560, the light beam of the remaining wavelength is reflected to the fourth reflecting surface 510, and is reflected to the optical demultiplexing component 560 through the fourth reflecting surface 510, and the light beam of another wavelength transmits the optical demultiplexing component 560.
  • the light beams with the remaining wavelengths are reflected to the fourth reflecting surface 510, so that a beam of signal light with different wavelengths is demultiplexed into multiple signal lights with different wavelengths, which are collimated by the second collimating lens array 550 in sequence. It is transmitted to the light receiving chips in the light receiving chip array to realize the function of the optical module receiving signal light of multiple wavelengths in a single fiber.
  • the optical module provided by the present disclosure, only through the second lens component and the optical demultiplexing component disposed in the second accommodating cavity, a beam of signal light with different wavelengths is completed, which improves the coupling of multi-channels in the optical module. coupling accuracy at time.
  • FIG. 23 is a schematic diagram of an exploded structure of a second lens assembly according to an embodiment of the present disclosure
  • FIG. 24 is a schematic diagram of a working principle of an optical demultiplexing assembly according to an embodiment of the present disclosure.
  • the optical demultiplexing component 560 includes a light input port for incident signal light of multiple wavelengths, and includes a plurality of light output ports for output light, and each light output port is used for outputting one wavelength. signal light.
  • the signal light enters the optical demultiplexing assembly 560 through the incident light port of the optical demultiplexing assembly 560, wherein the ⁇ 1 signal light After passing through the optical demultiplexing component 560 and the fourth reflecting surface 510, it undergoes six different reflections to reach the light outlet, and the ⁇ 2 signal light passes through the optical demultiplexing component 560 and the fourth reflecting surface 510 and undergoes four different reflections to reach its light outlet.
  • the ⁇ 3 signal light passes through the optical demultiplexing component 560 and the fourth reflection surface 510 for two different reflections to reach the light outlet, and the ⁇ 4 signal light enters the optical demultiplexing component 560 and is directly transmitted to its light outlet. , so that signal lights of different wavelengths enter the optical demultiplexing component 560 through the same light entrance port, and are outputted through different light exit ports.
  • the present disclosure provides two structures of lens assemblies, two structures of collimating lens arrays, optical fiber sockets and optical fiber supports, which can be combined arbitrarily between the two ways of connecting optical signals and external optical fibers, and It is not limited to the three embodiments provided in the present disclosure, and other combined structures are all within the protection scope of the present disclosure.
  • the first lens assembly and the circuit board form a accommodating cavity, and the accommodating cavity is sequentially provided with a light emitting chip array, a collimating lens array and an optical multiplexing assembly from bottom to top, and the surface of the first lens assembly has The first reflective surface and the second reflective surface, the first reflective surface and the second reflective surface can be connected to each other, wherein the light emitting chip array includes a plurality of light emitting chips, and the light emitting chip array can emit multiple beams of signal light with different wavelengths , at this time, the signal light is in a scattered state. After being collimated and focused by the collimating lens array, parallel light is formed.
  • Multiple parallel lights with different wavelengths are transmitted to the optical multiplexing component, and the light beam of one wavelength is transmitted through the optical multiplexing component to the first The reflective surface is totally reflected by the first reflective surface to the optical multiplexing component. At this time, the light beam with another wavelength is transmitted to the first reflective surface after being combined by the optical multiplexing component, and then completely reflected by the first reflective surface to the optical multiplexing component.
  • the light beam with another wavelength is transmitted to the first reflecting surface after being combined by the optical multiplexing component, thus completing the combining of multiple signal lights with different wavelengths, and finally generating a beam of signal light, which passes through After being reflected by the second reflective surface, it is sent to the optical fiber ribbon to realize simultaneous transmission of signal light of multiple wavelengths in a single optical fiber.
  • the optical module provided by the present disclosure, only through the first lens component and the optical multiplexing component disposed in the first accommodating cavity, the beam combining of multiple signal lights with different wavelengths is completed, which improves the coupling when coupling multiple channels in the optical module. precision.
  • the second lens assembly and the circuit board form a second accommodating cavity, and the light receiving chip array, the collimating lens array and the light demultiplexing assembly are sequentially arranged in the cavity from bottom to top, and the second lens assembly
  • the top surface of the optical module has a third reflection surface and a fourth reflection surface, and the third reflection surface and the fourth reflection surface can be connected to each other; a beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly, the beam The signal light is reflected by the third reflective surface and then sent to the optical demultiplexing component.
  • the light beam of one wavelength passes through the optical demultiplexing component, and the light beam of the remaining wavelength is reflected to the fourth reflective surface, and then reflected to the optical demultiplexing component through the fourth reflective surface.
  • the light beam of another wavelength passes through the optical demultiplexing component, and the light beam of the remaining wavelength is reflected to the fourth reflection surface, so that a beam of signal light with different wavelengths is divided into multiple beams of signal light with different wavelengths.
  • the optical module provided by the present disclosure, only through the second lens component and the optical demultiplexing component disposed in the second accommodating cavity, a beam of signal light with different wavelengths is completed, which improves the coupling of multi-channels in the optical module. coupling accuracy at time.

Abstract

An optical module, comprising: a circuit board (300); a first lens assembly (400) covering a light-emitting chip array (440), the surface of the first lens assembly having a first reflecting face (410) and a second reflecting face (420); the light-emitting chip array (440), which is arranged on the surface of the circuit board (300) and comprises a plurality of light-emitting chips for emitting multiple beams of signal light of different wavelengths; a first collimating lens array (450), which is arranged between the light-emitting chip array (440) and an optical multiplexing assembly (460) and comprises a plurality of collimating lenses for receiving the signal light from the light-emitting chips and converging same into parallel light; and the optical multiplexing assembly (460), which is arranged on the inner wall of the first lens assembly (400) and used to receive the signal light from the first collimating lens array (450), the signal light from the collimating lenses being incident on different positions of the optical multiplexing assembly (460), and combine the multiple beams of signal light of different wavelengths into one beam of signal light together with the first reflecting face (410), the combined signal light being transmitted to the second reflecting face (420), reflected by the second reflecting surface (420) and then emitted to an external optical fiber. Another optical module correspondingly comprises an optical demultiplexing assembly (560) and a light-receiving chip array (540). The above optical modules achieve the simultaneous transmission of signal light of multiple wavelengths in a single optical fiber, thereby increasing the transmission rate.

Description

一种光模块an optical module
本公开要求在2020年10月19日提交中国专利局、申请号为202011119875.5、专利名称为“一种光模块”的优先权,要求在2020年10月19日提交中国专利局、申请号为202011117865.8、专利名称为“一种光模块”的优先权,要求在2020年10月19日提交中国专利局、申请号为202011121035.2、专利名称为“一种光模块”的优先权,要求在2020年10月19日提交中国专利局、申请号为202011119907.1、专利名称为“一种光模块”的优先权,其全部内容通过引用结合在本公开中。This disclosure requires the priority to be submitted to the China Patent Office on October 19, 2020, with the application number of 202011119875.5 and the patent name of "an optical module", and is required to be submitted to the China Patent Office on October 19, 2020, with the application number of 202011117865.8 , the priority of the patent name is "an optical module", it is required to be submitted to the Chinese Patent Office on October 19, 2020, the application number is 202011121035.2, and the priority of the patent name is "an optical module", which is required to be submitted in October 2020. The priority of the application number 202011119907.1 and the patent name "An Optical Module" was submitted to the Chinese Patent Office on May 19, the entire contents of which are incorporated in this disclosure by reference.
技术领域technical field
本公开涉及光通信技术领域,尤其涉及一种光模块。The present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
背景技术Background technique
随着云计算、移动互联网、视频等新型业务和应用模式发展,光通信技术的发展进步变的愈加重要。而在光通信技术中,光模块是实现光电信号相互转换的工具,是光通信设备中的关键器件之一,并且随着光通信技术发展的需求光模块的传输速率不断提高,通过在单模光纤中同时传输多个波长的光信号可以提高传输速率,因此需要一种光模块以实现单光纤中多个波长的信号光同时传输,进而提高传输速率。With the development of new business and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of photoelectric signals, and it is one of the key components in the optical communication equipment. With the development of optical communication technology, the transmission rate of the optical module is continuously improved. Simultaneous transmission of optical signals of multiple wavelengths in an optical fiber can increase the transmission rate, so an optical module is required to realize the simultaneous transmission of signal lights of multiple wavelengths in a single optical fiber, thereby increasing the transmission rate.
发明内容SUMMARY OF THE INVENTION
第一方面,本公开提供的一种光模块,包括:电路板;第一透镜组件,罩设在光发射芯片阵列上,表面具有第一反射面和第二反射面;所述光发射芯片阵列,设置于所述电路板的表面,包括多个光发射芯片,用于发射多束不同波长的信号光;第一准直透镜阵列,设于所述光发射芯片阵列和光复用组件之间,包括多个准直透镜,用于接收来自光发射芯片的信号光并汇聚为平行光;光复用组件,设置于所述第一透镜组件的内壁上,用于接收来自所述第一准直透镜阵列的信号光,来自各准直透镜的信号光入射至所述光复用组件的不同位置,并与所述第一反射面一起将多束不同波长的信号光合束为一束信号光,合束后的信号光传输至所述第二反射面,经过所述第二反射面反射后发射至外部光纤。In a first aspect, the present disclosure provides an optical module, comprising: a circuit board; a first lens assembly covered on a light emitting chip array, the surface having a first reflective surface and a second reflective surface; the light emitting chip array , which is arranged on the surface of the circuit board and includes a plurality of light emitting chips for emitting multiple beams of signal light with different wavelengths; the first collimating lens array is arranged between the light emitting chip array and the light multiplexing component, It includes a plurality of collimating lenses for receiving the signal light from the light emitting chip and condensing it into parallel light; the light multiplexing component is arranged on the inner wall of the first lens component and is used for receiving the signal light from the first collimating lens For the signal light of the array, the signal light from each collimating lens is incident on different positions of the optical multiplexing component, and together with the first reflecting surface, multiple beams of signal light with different wavelengths are combined into one signal light, and the combined beam is combined. The latter signal light is transmitted to the second reflection surface, reflected by the second reflection surface, and then emitted to an external optical fiber.
第二方面,本公开提供了一种光模块,包括:电路板;第二透镜组件,罩设在光发射芯片阵列上,表面具有第三反射面和第四反射面,其中所述第三反射面用于接收来自外部光纤的信号光;光解复用组件,设置于所述第二透镜组件的内壁上,用于接收来自所述第三反射面的信号光,并与所述第四反射面一起将一束信号光分为多束不同波长的信号光;第二准直透镜阵列,设于所述光接收芯片阵列和光解复用组件之间,包括多个准直透镜,用于接收来自所述光解复用组件不同位置发出的信号光并汇聚为平行光;所述光接收芯片阵列,设置于所述电路板的表面,包括多个光接收芯片,用于接收来自所述第二准直透镜阵列的信号光。In a second aspect, the present disclosure provides an optical module, comprising: a circuit board; a second lens assembly, covered on the light emitting chip array, and having a third reflection surface and a fourth reflection surface on the surface, wherein the third reflection surface The surface is used to receive the signal light from the external optical fiber; the optical demultiplexing component is arranged on the inner wall of the second lens component, and is used to receive the signal light from the third reflecting surface, and reflect the light with the fourth reflecting surface. A beam of signal light is divided into multiple beams of signal light with different wavelengths together; the second collimating lens array, located between the light receiving chip array and the optical demultiplexing component, includes a plurality of collimating lenses for receiving The signal light emitted from different positions of the optical demultiplexing component is collected into parallel light; the light-receiving chip array is arranged on the surface of the circuit board, and includes a plurality of light-receiving chips, which are used for receiving light from the first light-receiving chip. Signal light from two collimating lens arrays.
第三方面,本公开提供的一种光模块,包括:电路板;第一透镜组件,罩设在光发射 芯片阵列上,表面具有第一反射面和第二反射面,且底端分别设有向内的第一承载面和第二承载面;所述光发射芯片阵列,设置于所述电路板的表面,包括多个光发射芯片,用于发射多束不同波长的信号光;第一准直透镜阵列,设为平板式结构,一端置于所述第一承载面,另一端置于所述第二承载面,且设于所述光发射芯片阵列和光复用组件之间,包括多个准直透镜,用于接收来自光发射芯片的信号光并汇聚为平行光;光复用组件,设置于所述第一透镜组件的内壁上,用于接收来自所述第一准直透镜阵列的信号光,来自各准直透镜的信号光入射至所述光复用组件的不同位置,并与所述第一反射面一起将多束不同波长的信号光合束为一束信号光,合束后的信号光传输至所述第二反射面,经过所述第二反射面反射后发射至外部光纤。In a third aspect, the present disclosure provides an optical module, comprising: a circuit board; a first lens assembly covered on the light emitting chip array, the surface has a first reflection surface and a second reflection surface, and the bottom ends are respectively provided with an inward first bearing surface and a second bearing surface; the light emitting chip array, disposed on the surface of the circuit board, includes a plurality of light emitting chips for emitting multiple beams of signal light with different wavelengths; The straight lens array is set as a flat structure, one end is placed on the first bearing surface, the other end is placed on the second bearing surface, and is arranged between the light emitting chip array and the light multiplexing component, including a plurality of The collimating lens is used for receiving the signal light from the light emitting chip and condensing it into parallel light; the light multiplexing component is arranged on the inner wall of the first lens component and is used for receiving the signal from the first collimating lens array The signal light from each collimating lens is incident on different positions of the optical multiplexing component, and together with the first reflecting surface, multiple beams of signal light with different wavelengths are combined into one signal light, and the combined signal The light is transmitted to the second reflective surface, reflected by the second reflective surface, and then emitted to an external optical fiber.
第四方面,本公开提供了一种光模块,包括:电路板;第二透镜组件,罩设在光发射芯片阵列上,表面具有第三反射面和第四反射面,且底端分别设有向内的第三承载面和第四承载面,其中第三反射面用于接收来自外部光纤的信号光;光解复用组件,设置于所述第二透镜组件的内壁上,用于接收来自所述第三反射面的信号光,并与所述第四反射面一起将一束信号光分为多束不同波长的信号光;第二准直透镜阵列,设为平板式结构,一端置于所述第一承载面,另一端置于所述第二承载面,且设于所述光接收芯片阵列和光解复用组件之间,包括多个准直透镜,用于接收来自所述光解复用组件不同位置发出的信号光并汇聚为平行光;所述光接收芯片阵列,设置于所述电路板的表面,包括多个光接收芯片,用于接收来自所述第二准直透镜阵列的信号光。In a fourth aspect, the present disclosure provides an optical module, comprising: a circuit board; a second lens assembly covered on the light emitting chip array, the surface has a third reflection surface and a fourth reflection surface, and the bottom ends are respectively provided with The inward third bearing surface and the fourth bearing surface, wherein the third reflection surface is used to receive the signal light from the external optical fiber; the optical demultiplexing component is arranged on the inner wall of the second lens component, and is used to receive the signal light from the external optical fiber; The signal light of the third reflection surface, together with the fourth reflection surface, divides a beam of signal light into multiple signal beams of different wavelengths; the second collimating lens array is set as a flat structure, and one end is placed in the The first bearing surface, the other end of which is placed on the second bearing surface, is arranged between the light receiving chip array and the light demultiplexing component, and includes a plurality of collimating lenses for receiving the light from the light demultiplexer. The signal light emitted from different positions of the multiplexing component is collected into parallel light; the light-receiving chip array, disposed on the surface of the circuit board, includes a plurality of light-receiving chips for receiving the light from the second collimating lens array signal light.
第五方面,本公开提供的一种光模块,包括:电路板;第一透镜组件,罩设在光发射芯片阵列上,表面具有第一反射面和第二反射面,且一端侧面设有限位部件;第一光纤支架,一端侧面设有对接部件,所述对接部件插入所述限位部件中;所述光发射芯片阵列,设置于所述电路板的表面,包括多个光发射芯片,用于发射多束不同波长的信号光;第一准直透镜阵列,设于所述光发射芯片阵列和光复用组件之间,包括多个准直透镜,用于接收来自光发射芯片的信号光并汇聚为平行光;光复用组件,设置于所述第一透镜组件的内壁上,用于接收来自所述第一准直透镜阵列的信号光,来自各准直透镜的信号光入射至所述光复用组件的不同位置,并与所述第一反射面一起将多束不同波长的信号光合束为一束信号光;第一汇聚透镜阵列,包括多个汇聚透镜,用于接收所述光复用组件合束后的信号光并汇聚为汇聚光斑,且耦合至所述第一光纤支架内。In a fifth aspect, the present disclosure provides an optical module, comprising: a circuit board; a first lens assembly, covered on the light emitting chip array, the surface has a first reflection surface and a second reflection surface, and one end side is provided with a limit components; a first optical fiber support, one end side is provided with a docking component, and the docking component is inserted into the limiting component; the light emitting chip array is arranged on the surface of the circuit board, and includes a plurality of light emitting chips, which are used for for emitting multiple beams of signal light with different wavelengths; the first collimating lens array, located between the light emitting chip array and the light multiplexing component, includes a plurality of collimating lenses for receiving the signal light from the light emitting chip and Condensed into parallel light; the light multiplexing component is arranged on the inner wall of the first lens component, and is used for receiving the signal light from the first collimating lens array, and the signal light from each collimating lens is incident on the light complex Using different positions of the component and together with the first reflecting surface, multiple beams of signal light with different wavelengths are combined into one signal light; the first converging lens array includes a plurality of converging lenses for receiving the light multiplexing component. The combined signal light is converged into a convergent light spot and coupled into the first optical fiber holder.
第六方面,本公开提供了一种光模块,包括:设有限位部件;第二光纤支架,一端侧面设有对接部件,所述对接部件插入所述限位部件中;第二汇聚透镜阵列,包括多个汇聚透镜,用于接收来自所述第二光纤支架的信号光并将所述信号光汇聚至第三反射面;光解复用组件,设置于所述第二透镜组件的内壁上,用于接收来自所述第三反射面的信号光,并与所述第四反射面一起将一束信号光分为多束不同波长的信号光;第二准直透镜阵列,设于所述光接收芯片阵列和光解复用组件之间,包括多个准直透镜,用于接收来自所述光解复用组件不同位置发出的信号光并汇聚为平行光;所述光接收芯片阵列,设置于所述电路板的表面,包括多个光接收芯片,用于接收来自所述第二准直透镜阵列的信号光。In a sixth aspect, the present disclosure provides an optical module, comprising: a limiting member; a second optical fiber support, one end side is provided with a docking member, the abutting member is inserted into the limiting member; a second converging lens array, including a plurality of converging lenses for receiving the signal light from the second optical fiber support and converging the signal light to the third reflection surface; the light demultiplexing component is arranged on the inner wall of the second lens component, It is used to receive the signal light from the third reflection surface, and together with the fourth reflection surface, divide a beam of signal light into multiple beams of signal light with different wavelengths; the second collimating lens array is arranged on the light A plurality of collimating lenses are included between the receiving chip array and the optical demultiplexing component, which are used for receiving the signal light emitted from different positions of the optical demultiplexing component and condensing them into parallel light; the light receiving chip array is arranged on the The surface of the circuit board includes a plurality of light receiving chips for receiving the signal light from the second collimating lens array.
第七方面,本公开提供了一种光模块,包括电路板;光发射芯片阵列,设置在电路板 表面,以行或列划分为组,组中的多个光发射芯片能够发出多束不同波长的光信号;准直透镜阵列,设置在光发射芯片阵列的出光方向上,单个透镜对单束光进行汇聚;透镜组件,设置在电路板上,罩设在光发射芯片阵列和准直透镜阵列之上;光复用组件,设置在准直透镜阵列的出光方向上,与透镜组件的内壁固定连接,用于将多束光合并为一束光;光纤阵列,与透镜组件连接,能够接收一束光。In a seventh aspect, the present disclosure provides an optical module, including a circuit board; an array of light emitting chips, arranged on the surface of the circuit board, divided into groups by rows or columns, and a plurality of light emitting chips in the group can emit multiple beams of different wavelengths The collimating lens array is arranged in the light-emitting direction of the light emitting chip array, and a single lens converges a single beam of light; the lens assembly is arranged on the circuit board, and is covered by the light emitting chip array and the collimating lens array above; the optical multiplexing component, which is arranged in the light-emitting direction of the collimating lens array, and is fixedly connected to the inner wall of the lens component for combining multiple beams of light into one beam; the optical fiber array, which is connected to the lens component, can receive a beam of light Light.
附图说明Description of drawings
为了更清楚地说明本公开的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,对于本领域普通技术人员而言,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions of the present disclosure more clearly, the accompanying drawings that need to be used in the embodiments will be briefly introduced below. Other drawings can also be obtained from these drawings.
图1为光通信终端连接关系示意图;Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals;
图2为光网络终端结构示意图;FIG. 2 is a schematic structural diagram of an optical network terminal;
图3为本公开实施例中提供的一种光模块的结构示意图;FIG. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present disclosure;
图4为本公开实施例中提供的一种光模块的分解结构示意图;4 is a schematic diagram of an exploded structure of an optical module provided in an embodiment of the present disclosure;
图5为本公开实施例提供的第一种光模块去除上壳体、下壳体及解锁部件后的结构示意图;5 is a schematic structural diagram of the first optical module provided by the embodiment of the present disclosure after removing the upper casing, the lower casing and the unlocking part;
图6为本公开实施例提供的第一种第一透镜组件的立体图;6 is a perspective view of a first first lens assembly according to an embodiment of the present disclosure;
图7为本公开实施例提供的第一种第一透镜组件的剖面结构示意图;FIG. 7 is a schematic cross-sectional structural diagram of a first first lens assembly according to an embodiment of the present disclosure;
图8为本公开实施例提供的第一种第一透镜组件的分解结构示意图;FIG. 8 is a schematic diagram of an exploded structure of a first first lens assembly according to an embodiment of the present disclosure;
图9本公开实施例提供的一种第一透镜组件的使用状态图;FIG. 9 is a use state diagram of a first lens assembly provided by an embodiment of the present disclosure;
图10为本公开实施例提供的一种光复用组件的工作原理图;FIG. 10 is a working principle diagram of an optical multiplexing component provided by an embodiment of the present disclosure;
图11为本公开实施例中提供的第二种光模块的分解结构示意图;11 is a schematic diagram of an exploded structure of a second optical module provided in an embodiment of the present disclosure;
图12为本公开实施例提供的第二种光模块去除上壳体、下壳体及解锁部件后的结构示意图;12 is a schematic structural diagram of the second optical module provided by the embodiment of the present disclosure after removing the upper casing, the lower casing and the unlocking part;
图13为本公开实施例提供的第二种第一透镜组件的立体图;13 is a perspective view of a second type of first lens assembly provided in an embodiment of the present disclosure;
图14为本公开实施例提供的第二种第一透镜组件的剖面结构示意图一;FIG. 14 is a schematic cross-sectional structure diagram 1 of a second type of first lens assembly according to an embodiment of the present disclosure;
图15为本公开实施例提供的第二种第一透镜组件的分解结构示意图;15 is a schematic diagram of an exploded structure of a second type of first lens assembly provided in an embodiment of the present disclosure;
图16为本公开实施例中提供的第三种光模块的分解结构示意图;16 is a schematic diagram of an exploded structure of a third optical module provided in an embodiment of the present disclosure;
图17为本公开实施例提供的第三种第一透镜组件的剖面结构示意图;FIG. 17 is a schematic cross-sectional structural diagram of a third first lens assembly according to an embodiment of the present disclosure;
图18为本公开实施例提供的第三种第一透镜组件的立体图;FIG. 18 is a perspective view of a third first lens assembly according to an embodiment of the present disclosure;
图19为本公开实施例提供的第三种第一透镜组件的分解图一;FIG. 19 is an exploded view 1 of a third first lens assembly according to an embodiment of the present disclosure;
图20为本公开实施例提供的第三种第一透镜组件的分解图二;FIG. 20 is an exploded view 2 of a third first lens assembly according to an embodiment of the present disclosure;
图21为本公开实施例提供的一种第二透镜组件的分解结构图;FIG. 21 is an exploded structural diagram of a second lens assembly according to an embodiment of the present disclosure;
图22为本公开实施例提供的又一种第二透镜组件的分解结构图;FIG. 22 is an exploded structural diagram of still another second lens assembly provided by an embodiment of the present disclosure;
图23为本公开实施例提供的一种第二透镜组件的分解结构示意图;FIG. 23 is a schematic diagram of an exploded structure of a second lens assembly according to an embodiment of the present disclosure;
图24为本公开实施例提供的一种光解复用组件的工作原理图。FIG. 24 is a working principle diagram of an optical demultiplexing component provided by an embodiment of the present disclosure.
具体实施方式Detailed ways
下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本公开一部分实施例,而不是全部的实施例。基于本公开中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护的范围。The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, but not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present disclosure.
光纤通信的核心环节之一是光、电信号的相互转换。光纤通信使用携带信息的光信号在光纤/光波导等信息传输设备中传输,利用光在光纤/光波导中的无源传输特性可以实现低成本、低损耗的信息传输;而计算机等信息处理设备使用的是电信号,为了在光纤/光波导等信息传输设备与计算机等信息处理设备之间建立信息连接,就需要实现电信号与光信号的相互转换。One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides. The passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used. In order to establish an information connection between information transmission equipment such as optical fibers/optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion of electrical signals and optical signals.
光模块在光纤通信技术领域中实现上述光、电信号的相互转换功能,光信号与电信号的相互转换是光模块的核心功能。光模块通过其内部电路板上的金手指实现与外部上位机之间的电连接,主要的电连接包括供电、I2C信号、数据信号以及接地等;采用金手指实现的电连接方式已经成为光模块行业的主流连接方式,以此为基础,金手指上引脚的定义形成了多种行业协议/规范。The optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module. The optical module realizes the electrical connection with the external host computer through the gold finger on its internal circuit board. The main electrical connections include power supply, I2C signal, data signal and grounding, etc. The electrical connection method realized by the gold finger has become the optical module. The mainstream connection method of the industry, based on this, the definition of pins on the gold finger has formed a variety of industry protocols/norms.
图1为光通信终端连接关系示意图。如图1所示,光通信终端的连接主要包括光网络终端100、光模块200、光纤101及网线103之间的相互连接。FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in FIG. 1 , the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100 , the optical module 200 , the optical fiber 101 and the network cable 103 .
光纤的101一端连接远端服务器,网线103的一端连接本地信息处理设备,本地信息处理设备与远端服务器的连接由光纤101与网线103的连接完成;而光纤101与网线103之间的连接由具有光模块200的光网络终端100完成。One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.
光模块200的光口对外接入光纤101,与光纤101建立双向的光信号连接;光模块200的电口对外接入光网络终端100中,与光网络终端100建立双向的电信号连接;在光模块内部实现光信号与电信号的相互转换,从而实现在光纤与光网络终端之间建立信息连接;在本申请某一实施例中,来自光纤的光信号由光模块转换为电信号后输入至光网络终端100中,来自光网络终端100的电信号由光模块转换为光信号输入至光纤中。The optical port of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101; the electrical port of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100; The optical module realizes mutual conversion between optical signals and electrical signals, so as to establish an information connection between the optical fiber and the optical network terminal; in an embodiment of the present application, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input. To the optical network terminal 100, the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.
光网络终端具有光模块接口102,用于接入光模块200,与光模块200建立双向的电信号连接;光网络终端具有网线接口104,用于接入网线103,与网线103建立双向的电信号连接;光模块200与网线103之间通过光网络终端100建立连接,在本申请某一实施例中,光网络终端将来自光模块的信号传递给网线,将来自网线的信号传递给光模块,光网络终端作为光模块的上位机监控光模块的工作。The optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200; Signal connection; a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. In an embodiment of the present application, the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module. , the optical network terminal is used as the host computer of the optical module to monitor the work of the optical module.
至此,远端服务器通过光纤101、光模块200、光网络终端100及网线103,与本地信息处理设备之间建立双向的信号传递通道。So far, the remote server has established a bidirectional signal transmission channel with the local information processing device through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
常见的信息处理设备包括路由器、交换机、电子计算机等;光网络终端100是光模块200的上位机,向光模块200提供数据信号,并接收来自光模块200的数据信号,常见的光模块200上位机还有光线路终端等。Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal 100 is the host computer of the optical module 200, provides data signals to the optical module 200, and receives data signals from the optical module 200. There are also optical line terminals and so on.
图2为光网络终端结构示意图。如图2所示,在光网络终端100中具有电路板105,在电路板105的表面设置笼子106;在笼子106中设置有电连接器,用于接入金手指等光 模块电口;在笼子106上设置有散热器107,散热器107具有增大散热面积的翅片等凸起结构。FIG. 2 is a schematic structural diagram of an optical network terminal. As shown in FIG. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is arranged on the surface of the circuit board 105; an electrical connector is arranged in the cage 106 for connecting to the electrical port of an optical module such as a golden finger; The cage 106 is provided with a radiator 107, and the radiator 107 has a raised structure such as fins to increase the heat dissipation area.
光模块200插入光网络终端中,具体为光模块的电口插入笼子106中的电连接器,光模块200的光口与光纤101连接。The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector in the cage 106 , and the optical port of the optical module 200 is connected to the optical fiber 101 .
笼子106位于电路板上,将电路板上的电连接器包裹在笼子中;光模块200插入笼子中,由笼子固定光模块200,光模块200产生的热量通过光模块壳体传导给笼子,最终通过笼子上的散热器107进行扩散。The cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage; the optical module 200 is inserted into the cage, the optical module 200 is fixed by the cage, and the heat generated by the optical module 200 is conducted to the cage through the optical module housing, and finally Diffusion takes place through heat sinks 107 on the cage.
图3为本公开实施例提供的一种光模块200的结构示意图,图4为本公开实施例提供光模块200的分解结构示意图。如图3和图4所示,本公开实施例提供的光模块200包括上壳体201、下壳体202、解锁部件203及电路板300。FIG. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure, and FIG. 4 is a schematic structural diagram of an exploded optical module 200 according to an embodiment of the present disclosure. As shown in FIG. 3 and FIG. 4 , the optical module 200 provided by the embodiment of the present disclosure includes an upper casing 201 , a lower casing 202 , an unlocking part 203 , and a circuit board 300 .
上壳体201盖合在下壳体202上,以形成具有两个开口的包裹腔体,包裹腔体的外轮廓一般呈现为方形体形状。在本公开某一实施例中,下壳体202包括主板以及位于主板两侧、与主板垂直设置的两个侧板;上壳体201包括盖板,盖板盖合在上壳体201的两个侧板上,以形成包裹腔体;上壳体201还可以包括位于盖板两侧、与盖板垂直设置的两个侧壁,由两个侧壁与两个侧板结合,以实现上壳体201盖合在下壳体202上。The upper casing 201 is covered with the lower casing 202 to form a wrapping cavity with two openings, and the outer contour of the wrapping cavity generally presents a square shape. In an embodiment of the present disclosure, the lower case 202 includes a main board and two side plates located on both sides of the main board and perpendicular to the main board; the upper case 201 includes a cover plate, and the cover plate covers the two sides of the upper case 201 two side plates to form a wrapping cavity; the upper casing 201 may also include two side walls located on both sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize the upper The casing 201 is covered with the lower casing 202 .
两个开口具体可以是在同一方向的两端开口(204、205),也可以是在不同方向上的两处开口;其中一个开口为电口204,电路板300的金手指从电口204伸出,插入光网络终端等上位机中,另一个开口为光口205,用于外部光纤接入以连接光模块200内部的光收发器件,电路板300、光收发器件等光电器件位于包裹腔体中。Specifically, the two openings may be openings (204, 205) at both ends in the same direction, or may be two openings in different directions; one of the openings is the electrical port 204, and the gold finger of the circuit board 300 extends from the electrical port 204. The other opening is the optical port 205, which is used for external optical fiber access to connect the optical transceiver device inside the optical module 200. The circuit board 300, the optical transceiver device and other optoelectronic devices are located in the package cavity. middle.
采用上壳体201、下壳体202结合的装配方式,便于将电路板300等器件安装到壳体中,由上壳体201、下壳体202形成光模块最外层的封装保护壳体。上壳体201及下壳体202一般采用金属材料,利于实现电磁屏蔽以及散热;一般不会将光模块200的壳体做成一体结构,这样在装配电路板等器件时,定位部件、散热以及电磁屏蔽结构无法安装,也不利于生产自动化。The combination of the upper casing 201 and the lower casing 202 is adopted to facilitate the installation of components such as the circuit board 300 into the casing, and the upper casing 201 and the lower casing 202 form the outermost packaging protection casing of the optical module. The upper casing 201 and the lower casing 202 are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation; generally, the casing of the optical module 200 is not made into an integrated structure, so that when assembling circuit boards and other devices, positioning components, heat dissipation and The electromagnetic shielding structure cannot be installed and is not conducive to production automation.
解锁部件203位于包裹腔体/下壳体202的外壁,用于实现光模块与上位机之间的固定连接,或解除光模块与上位机之间的固定连接。The unlocking part 203 is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.
解锁部件203具有与上位机笼子匹配的卡合结构;拉动解锁部件203的末端可以在使解锁部件203在外壁的表面相对移动;光模块插入上位机的笼子里,由解锁部件203的卡合结构将光模块固定在上位机的笼子里;通过拉动解锁部件203,解锁部件203的卡合结构随之移动,进而改变卡合结构与上位机的连接关系,以解除光模块与上位机的卡合关系,从而可以将光模块从上位机的笼子里抽出。The unlocking part 203 has an engaging structure matched with the cage of the upper computer; the end of the unlocking part 203 can be pulled to relatively move the unlocking part 203 on the surface of the outer wall; Fix the optical module in the cage of the host computer; by pulling the unlocking part 203, the engaging structure of the unlocking part 203 moves with it, thereby changing the connection relationship between the engaging structure and the host computer to release the optical module and the host computer. relationship, so that the optical module can be pulled out from the cage of the host computer.
电路板300上设置有光发射芯片、光发射芯片的驱动芯片、光接收芯片、跨阻放大芯片、限幅放大芯片及微处理器芯片等,其中光发射芯片与光接收芯片直接贴装在光模块的电路板上,此种形态业内称为COB封装。The circuit board 300 is provided with a light-emitting chip, a driving chip for the light-emitting chip, a light-receiving chip, a transimpedance amplifying chip, a limiting amplifying chip, a microprocessor chip, etc., wherein the light-emitting chip and the light-receiving chip are directly mounted on the light-emitting chip. On the circuit board of the module, this form is called COB package in the industry.
电路板300通过电路走线将光模块中的用电器件按照电路设计连接在一起,以实现供电、电信号传输及接地等电功能;同时电路板300还有承载的各器件的功能,如电路板承载透镜组件。The circuit board 300 connects the electrical components in the optical module according to the circuit design through circuit wiring, so as to realize the electrical functions such as power supply, electrical signal transmission and grounding; at the same time, the circuit board 300 also has the functions of various components carried, such as circuit The board carries the lens assembly.
电路板一般为硬性电路板,硬性电路板由于其相对坚硬的材质,还可以实现承载作用,如硬性电路板可以平稳的承载芯片;硬性电路板还可以插入上位机笼子中的电连接器中,在本申请某一实施例中,在硬性电路板的一侧末端表面形成金属引脚/金手指,用于与电连接器连接。The circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. In an embodiment of the present application, metal pins/gold fingers are formed on one end surface of the rigid circuit board for connecting with the electrical connector.
在本公开实施例中,光模块还包括透镜组件,透镜组件设置电路板300上。在本公开某一实施例中,透镜组件与电路板300形成包裹光发射芯片阵列或光接收芯片阵列的腔体,光发射芯片阵列或光接收芯片阵列位于该腔体中。透镜组件用于传输光束并在传输过程中改变光束传输方向。在使用中:光发射芯片阵列中光芯片发出的光经透镜组件传输并反射后进入光纤中;或者,来自光纤的光经透镜组件反射后进入光接收芯片中,透镜组件不仅起到密封光芯片的作用,同时也建立了光芯片与光纤之间的光连接。透镜组件同时罩设在光发射芯片阵列或光接收芯片阵列上方,便于利用较少器件实现改变光发射芯片发射的信号光或来自光模块外部的信号光的传播方向。在本公开实施例中,光发射芯片阵列通过透镜组件罩设,或光接收芯片阵列通过透镜组件罩设,还可以光发射芯片阵列和光接收芯片阵列分别通过透镜组件罩设。进而在本公开实施例中,透镜组件的数量可以为1个,还可以为2个等。In the embodiment of the present disclosure, the optical module further includes a lens assembly, and the lens assembly is disposed on the circuit board 300 . In an embodiment of the present disclosure, the lens assembly and the circuit board 300 form a cavity enclosing the light emitting chip array or the light receiving chip array, and the light emitting chip array or the light receiving chip array is located in the cavity. The lens assembly is used to transmit the light beam and change the direction of the beam transmission during the transmission process. In use: the light emitted by the optical chip in the light emitting chip array is transmitted and reflected by the lens assembly and then enters the optical fiber; or, the light from the optical fiber enters the light receiving chip after being reflected by the lens assembly, and the lens assembly not only functions to seal the optical chip It also establishes the optical connection between the optical chip and the optical fiber. The lens assembly is also covered above the light-emitting chip array or the light-receiving chip array, which facilitates changing the propagation direction of the signal light emitted by the light-emitting chip or the signal light from outside the optical module by using fewer components. In the embodiment of the present disclosure, the light-emitting chip array is covered by the lens assembly, or the light-receiving chip array is covered by the lens assembly, or the light-emitting chip array and the light-receiving chip array can be covered by the lens assembly respectively. Furthermore, in the embodiment of the present disclosure, the number of lens components may be one, or two, or the like.
在本公开实施例中,透镜组件不仅可以设置在电路板300靠近光口的一端,还可以设置在电路板300的中部,具体可根据光模块的实际需要进行选择。在本公开实施例中,透镜组件采用罩设式的方式设置在光发射芯片阵列或光接收芯片阵列的上方;其中:光发射芯片阵列中包括若干光发射芯片,通常每一光发射芯片用于发射一种波长的信号光,进而光发射芯片阵列用于发射多束不同波长的信号光;光接收芯片阵列中包括若干光接收芯片,通常每一光接收芯片用于接收一种波长的信号光,进而光接收芯片阵列用于接收不同多束不同波长的信号光。光发射芯片阵列中包括2个、3个、4个等光发射芯片,光接收芯片阵列中包括2个、3个、4个等光接收芯片。光发射芯片或光接收芯片以行或列划分为组,组中的多个光发射芯片能够发出多束不同波长的光信号,组内的多个光接收芯片分别接收一个波长的光;本公开中光发射芯片或光接收芯片以阵列结构排列,其中沿着电路板长度方向设置的一行光发射芯片或光接收芯片设为一组,沿着电路板宽度方向设置多行光发射芯片或光接收芯片,多行光发射芯片或光接收芯片设为多组,关于电路板长度方向和宽度方向的限定参考图4,图4中方向从左至右定义为电路板长度方向,从上至下定义为电路板宽度方向。In the embodiment of the present disclosure, the lens assembly may not only be disposed at one end of the circuit board 300 close to the optical port, but also may be disposed in the middle of the circuit board 300, which may be selected according to the actual needs of the optical module. In the embodiment of the present disclosure, the lens assembly is disposed above the light-emitting chip array or the light-receiving chip array in a cover-up manner; wherein: the light-emitting chip array includes several light-emitting chips, and usually each light-emitting chip is used for The signal light of one wavelength is emitted, and then the light-emitting chip array is used to emit multiple beams of signal light of different wavelengths; the light-receiving chip array includes several light-receiving chips, and usually each light-receiving chip is used to receive one wavelength of signal light. , and the light-receiving chip array is used for receiving different multiple beams of signal light with different wavelengths. The light-emitting chip array includes 2, 3, and 4 light-emitting chips, and the light-receiving chip array includes 2, 3, and 4 light-receiving chips. Light emitting chips or light receiving chips are divided into groups by rows or columns, multiple light emitting chips in the group can emit multiple beams of optical signals of different wavelengths, and multiple light receiving chips in the group receive light of one wavelength respectively; the present disclosure The light-emitting chips or light-receiving chips are arranged in an array structure, in which one row of light-emitting chips or light-receiving chips arranged along the length direction of the circuit board is set as a group, and multiple rows of light-emitting chips or light-receiving chips are arranged along the width direction of the circuit board. Chips, multi-row light-emitting chips or light-receiving chips are set to multiple groups. Refer to Figure 4 for the definition of the length direction and width direction of the circuit board. In Figure 4, the direction from left to right is defined as the length direction of the circuit board, and it is defined from top to bottom. is the width direction of the circuit board.
在本实施例中包括两个透镜组件,为便于描述将一个透镜组件称为第一透镜组件,另一个透镜组件称为第二透镜组件,在本公开某一实施例中将罩设在光发射芯片阵列上的透镜组件称为第一透镜组件,将罩设在光接收芯片阵列上的透镜组件称为第二透镜组件。In this embodiment, two lens assemblies are included. For the convenience of description, one lens assembly is referred to as a first lens assembly, and the other lens assembly is referred to as a second lens assembly. The lens assembly on the chip array is called the first lens assembly, and the lens assembly covered on the light-receiving chip array is called the second lens assembly.
在本公开某一实施例中,高速率数据传输要求光发射芯片阵列或光接收组件中光芯片及其驱动/匹配芯片之间近距离设置,以缩短芯片之间的连线、减小连线造成的信号损失,而透镜组罩设在光芯片的上方时,透镜组件一般将光芯片及其驱动/匹配芯片同时罩设住。所以光发射芯片阵列中光发射芯片与光发射芯片的驱动芯片近距离设置,透镜组件罩设光发射芯片与光发射芯片的驱动芯片;光接收芯片阵列中光接收芯片与跨阻放大芯片近距离 设置,透镜组件罩设光接收芯片与跨阻放大芯片。In an embodiment of the present disclosure, high-speed data transmission requires close proximity between optical chips and their driving/matching chips in a light-emitting chip array or light-receiving assembly, so as to shorten the connection between chips and reduce the number of connections. When the lens assembly is installed above the optical chip, the lens assembly generally covers the optical chip and its driving/matching chip at the same time. Therefore, in the light-emitting chip array, the light-emitting chip and the driving chip of the light-emitting chip are arranged in close proximity, and the lens assembly covers the light-emitting chip and the driving chip of the light-emitting chip; The lens assembly covers the light receiving chip and the transimpedance amplifying chip.
为便于实现光发射芯片阵列发射出多束不同波长信号光的传输以及实现光接收芯片阵列接收不同波长信号光,本公开实施例中包括其他光器件配合透镜组件。下面结合透镜组件的具体使用进行详细描述。In order to facilitate the transmission of multiple beams of signal light of different wavelengths emitted by the light-emitting chip array and the reception of signal light of different wavelengths by the light-receiving chip array, the embodiments of the present disclosure include other optical devices and lens assemblies. The following is a detailed description in conjunction with the specific use of the lens assembly.
下面对光发射结构进行说明。The light emitting structure will be described below.
在第一实施例中,本公开提供了一种光模块及其对应的光学器件的结构;图5为本公开实施例中光模块去除上壳体、下壳体及解锁部件后的结构示意图。如图5所示,第一透镜组件400连接光纤阵列900的一端,光纤阵列900的另一端连接光纤适配器600,通过光纤适配器600实现与外部光纤的光连接。第一透镜组件400设置电路板300上。第一透镜组件400与电路板300形成包裹腔体,为了方便描述,将该包裹腔体描述为第一容纳腔。光纤适配器600的一端与内部光纤连接,另一端与外部光纤连接,通过光纤适配器600实现内部光纤和外部光纤的对接。In the first embodiment, the present disclosure provides the structure of an optical module and its corresponding optical device; FIG. 5 is a schematic structural diagram of the optical module in the embodiment of the disclosure after removing the upper casing, the lower casing and the unlocking components. As shown in FIG. 5 , the first lens assembly 400 is connected to one end of the optical fiber array 900 , and the other end of the optical fiber array 900 is connected to the optical fiber adapter 600 , through which the optical fiber adapter 600 realizes optical connection with external optical fibers. The first lens assembly 400 is disposed on the circuit board 300 . The first lens assembly 400 and the circuit board 300 form a wrapping cavity. For the convenience of description, the wrapping cavity is described as a first accommodating cavity. One end of the optical fiber adapter 600 is connected to the internal optical fiber, and the other end is connected to the external optical fiber, and the internal optical fiber and the external optical fiber are connected through the optical fiber adapter 600 .
图6为本公开实施例提供的第一种第一透镜组件的立体图;图7为本公开实施例提供的第一种第一透镜组件的剖面结构示意图;图8为本公开实施例提供的第一种第一透镜组件的分解结构示意图;如图6-8所示,第一透镜组件400通常为透明塑料件,一般采用一体注塑成型。第一透镜组件400和电路板300形成第一容纳腔430,第一容纳腔430用于设置光学器件,在本申请某一实施例中,从电路板300处至上第一容纳腔430内依次设有光发射芯片阵列440、准直透镜阵列450及光复用组件460。且,第一透镜组件400的顶部表面设有第一反射面410和第二反射面420。第一反射面410用于反射入射至其上的信号光,第二反射面420用于反射并汇聚反射至其上的信号光至光纤带中。6 is a perspective view of a first first lens assembly provided by an embodiment of the present disclosure; FIG. 7 is a schematic cross-sectional structural diagram of a first first lens assembly provided by an embodiment of the present disclosure; A schematic diagram of an exploded structure of a first lens assembly; as shown in FIGS. 6-8 , the first lens assembly 400 is usually a transparent plastic part, which is generally injection-molded in one piece. The first lens assembly 400 and the circuit board 300 form a first accommodating cavity 430, and the first accommodating cavity 430 is used for arranging optical devices. There are a light emitting chip array 440 , a collimating lens array 450 and a light multiplexing component 460 . Also, the top surface of the first lens assembly 400 is provided with a first reflection surface 410 and a second reflection surface 420 . The first reflection surface 410 is used for reflecting the signal light incident thereon, and the second reflection surface 420 is used for reflecting and condensing the signal light reflected thereon into the optical fiber ribbon.
光发射芯片阵列440中包括多个光发射芯片,用于发射出多束不同波长的信号光,准直透镜阵列450包括若干个准直透镜,用于准直光发射芯片阵列的信号光。光发射芯片阵列以行或列划分为组,组中的多个光发射芯片能够发出多束不同波长的光信号;准直透镜阵列,设置在光发射芯片阵列的出光方向上,单个透镜对单束光进行汇聚。准直透镜阵列450罩设在光发射芯片阵列440的上方,准直透镜阵列450的透镜数量取决于光发射芯片阵列440中的光发射芯片的数量,通常准直透镜阵列450的透镜数量等于光发射芯片阵列440中的光发射芯片的数量。The light emitting chip array 440 includes a plurality of light emitting chips for emitting multiple beams of signal light with different wavelengths, and the collimating lens array 450 includes several collimating lenses for collimating the signal light of the light emitting chip array. The light-emitting chip array is divided into groups by rows or columns, and multiple light-emitting chips in the group can emit multiple beams of light signals of different wavelengths; the collimating lens array is arranged in the light-emitting direction of the light-emitting chip array. The beams of light are converged. The collimating lens array 450 is covered above the light emitting chip array 440. The number of lenses in the collimating lens array 450 depends on the number of light emitting chips in the light emitting chip array 440. The number of light emitting chips in the emitting chip array 440 .
为了实现光合束,可以单独由光复用组件实现。光复用组件设置在准直透镜阵列的出光方向上,与透镜组件的内壁固定连接,用于将多束光合并为一束光;光复用组件460设置于第一容纳腔430的内壁上,用于将多束不同波长的信号光合成一束信号光。In order to realize the photocombination, it can be realized by the optical multiplexing component alone. The light multiplexing component is arranged in the light-emitting direction of the collimating lens array, and is fixedly connected to the inner wall of the lens component, and is used to combine multiple beams of light into one beam; It is used to combine multiple signal lights of different wavelengths into one signal light.
光复用组件朝向准直透镜阵列的表面为滤波面,朝向透镜组件的表面包括主体反射面及透光面;滤波面多个不同位置分别透射来自准直透镜阵列的多个单束光;主体反射面能够将来自滤波面的光反射向滤波面;滤波面能够反射来自主体反射面的光;透光面能够透射来自滤波面的光;由滤波面及主体反射面配合实现多束光合为一束光;The surface of the optical multiplexing component facing the collimating lens array is a filtering surface, and the surface facing the lens component includes a main body reflective surface and a light-transmitting surface; multiple different positions of the filtering surface respectively transmit a plurality of single beams of light from the collimating lens array; the main body reflects The filter surface can reflect the light from the filter surface to the filter surface; the filter surface can reflect the light from the main body reflection surface; the light transmission surface can transmit the light from the filter surface; the filter surface and the main body reflection surface can combine multiple beams into one beam Light;
光复用组件460通常包括多个滤光片,由多个滤光片形成滤波面;滤光片利用其两侧以及不同位置设置不同的膜层允许特定波长信号光的透射和其他波长的信号光的反射,光复用组件460中的滤波面允许某一波长的信号光的反射,光复用组件460根据被合束光的 束数协调选择每束光的反射次数,最终实现不同波长信号光的合束。The optical multiplexing component 460 usually includes a plurality of filters, and the filter surfaces are formed by the plurality of filters; the filters use different film layers on both sides and different positions to allow the transmission of signal light of a specific wavelength and signal light of other wavelengths. The filter surface in the optical multiplexing component 460 allows the reflection of the signal light of a certain wavelength, and the optical multiplexing component 460 coordinately selects the number of reflections of each beam according to the number of beams to be combined, and finally realizes the combination of different wavelengths of signal light. bundle.
为了实现合束,还可以由透镜组件与光复用组件配合实现。光复用组件朝向准直透镜阵列的表面为滤波面,朝向透镜组件的表面为透光面;透镜组件的上表面包括第一反射面;滤波面多个不同位置分别透射来自准直透镜阵列的多个单束光;透光面能够透射来自滤波面及第一反射面的光;第一反射面能够将来自滤波面的光反射向滤波面;滤波面能够反射来自第一反射面的光;由滤波面及第一反射面配合实现多束光合为一束光。In order to realize beam combination, it can also be realized by the cooperation of the lens component and the optical multiplexing component. The surface of the optical multiplexing component facing the collimating lens array is a filtering surface, and the surface facing the lens component is a light-transmitting surface; the upper surface of the lens component includes a first reflecting surface; multiple different positions of the filtering surface respectively transmit the light from the collimating lens array. a single beam of light; the light-transmitting surface can transmit the light from the filtering surface and the first reflecting surface; the first reflecting surface can reflect the light from the filtering surface to the filtering surface; the filtering surface can reflect the light from the first reflecting surface; The filtering surface and the first reflecting surface cooperate to realize that the multiple beams of light are combined into one beam of light.
透镜组件上还包括倾斜的第二反射面,第二反射面设置有汇聚透镜阵列,汇聚透镜阵列能够将来自光复用组件的光汇聚并反射向光纤阵列。第一反射面410为倾斜面,用于反射入射至其上的信号光,第二反射面设置于靠近出光的方向,用于反射并汇聚入射至其上的信号光至光模块的光纤中;当第一透镜组件400装配固定至电路板300上时,第一反射面410与电路板成一定地角度即倾斜设置,第一反射面410和光复用组件460的倾斜角度大小与不同波长的光发射芯片、光复用组件460的厚度有关,在本公开某一实施例中,第一反射面410和光复用组件460的倾斜角度选择在4-17°之间。在本申请某一实施例中,光复用组件460在电路板方向的投影覆盖光发射芯片阵列440中的光发射芯片,第一反射面410在电路板方向的投影覆盖光复用组件460,进而光发射芯片阵列440中的光发射芯片发出的信号光,光发射芯片发出的光信号呈发散状态,为发散光束。为了便于后续的光路设计及光耦合进入光纤,需要对发散光束进行汇聚处理。本公开中通过准直透镜将发散光束汇聚为平行光束,在经过准直透镜阵列450中的准直透镜的汇聚后依次传输至光复用组件460和第一反射面410,各个准直透镜发出的光射入至光复用组件460的不同位置,第一反射面410接收来自光复用组件460的信号光后改变光的传播方向反射至光复用组件460的表面,该波长的信号光与光复用组件460其他位置处的信号光合并入射至第一反射面410,最终将不同波长的信号光合束为一束光,传输至第二反射面420,第二反射面420改变光的传播方向最终将光束光发射至光模块外部,不同的波长的信号光可共用一根光纤传输出光模块,实现单光纤中多个波长的信号光同时传输。The lens assembly further includes an inclined second reflecting surface, and the second reflecting surface is provided with a converging lens array, which can condense and reflect the light from the light multiplexing assembly to the optical fiber array. The first reflective surface 410 is an inclined surface for reflecting the signal light incident thereon, and the second reflective surface is disposed close to the light-emitting direction for reflecting and converging the signal light incident thereon into the optical fiber of the optical module; When the first lens assembly 400 is assembled and fixed on the circuit board 300, the first reflective surface 410 and the circuit board form a certain angle, that is, they are inclined. The thicknesses of the emission chip and the optical multiplexing component 460 are related. In an embodiment of the present disclosure, the inclination angle of the first reflecting surface 410 and the optical multiplexing component 460 is selected between 4° and 17°. In an embodiment of the present application, the projection of the light multiplexing component 460 in the direction of the circuit board covers the light emitting chips in the light emitting chip array 440, the projection of the first reflective surface 410 in the direction of the circuit board covers the light multiplexing component 460, and the light For the signal light emitted by the light emitting chips in the emitting chip array 440, the light signals emitted by the light emitting chips are in a diverging state, and are diverging light beams. In order to facilitate the subsequent optical path design and optical coupling into the optical fiber, the divergent beam needs to be converged. In the present disclosure, the diverging light beams are converged into parallel light beams by a collimating lens, and after being converged by the collimating lenses in the collimating lens array 450, they are sequentially transmitted to the optical multiplexing component 460 and the first reflecting surface 410. The light is incident on different positions of the optical multiplexing component 460. The first reflecting surface 410 receives the signal light from the optical multiplexing component 460 and then changes the propagation direction of the light to reflect it to the surface of the optical multiplexing component 460. The signal light of this wavelength is combined with the optical multiplexing component. The signal light at other positions of 460 is combined and incident on the first reflecting surface 410, and finally the signal light of different wavelengths is combined into a beam of light, which is transmitted to the second reflecting surface 420. The second reflecting surface 420 changes the propagation direction of the light and finally converts the beam. The light is emitted to the outside of the optical module, and the signal light of different wavelengths can share one optical fiber to transmit out of the optical module, so that the signal light of multiple wavelengths in a single optical fiber can be transmitted at the same time.
第一反射面410为全反射面,光发射芯片发射的信号光传输至第一反射面410发生全反射。The first reflection surface 410 is a total reflection surface, and the signal light emitted by the light emitting chip is transmitted to the first reflection surface 410 for total reflection.
第二反射面420设为倾斜面,合束后的信号光传输至第二反射面420后,第二反射面420需同时实现反射和汇聚,为了同时实现反射和汇聚作用,本公开实施例中,可以在第二反射面420的表面设置多个凸起结构,第二反射面420的倾斜面具有反射信号光的作用,凸起结构可以实现汇聚信号光的作用;此外,还可以将第二反射面的一端与第一反射面连接,另一端连接有汇聚透镜,也就是此时第一透镜组件包括汇聚透镜,通过设置汇聚透镜实现汇聚作用。The second reflection surface 420 is set as an inclined surface. After the combined signal light is transmitted to the second reflection surface 420, the second reflection surface 420 needs to realize reflection and convergence at the same time. , a plurality of convex structures can be arranged on the surface of the second reflecting surface 420, the inclined surface of the second reflecting surface 420 has the function of reflecting the signal light, and the convex structure can realize the function of concentrating the signal light; One end of the reflective surface is connected to the first reflective surface, and the other end is connected to a converging lens, that is, the first lens component includes a converging lens at this time, and the converging effect is achieved by arranging the converging lens.
本公开实施例中,电路板300的表面具有承载面,可以承载多个光发射芯片,光发射芯片以阵列的形式进行排列,电路板长度方向和宽度方向上均设有光发射芯片,其中长度方向上一行光发射芯片设为一组,这样可以实现设置多组光发射芯片,关于电路板长度方向和宽度方向的限定参考图4,图4中方向从左至右定义为电路板长度方向,从上至下定义为电路板宽度方向。如图9所示,本公开实施例中的准直透镜阵列450为支座式结构,包 括主板及支撑本体的侧板,侧板设置在电路板上,主板设置有能够汇聚光的凸起阵列;该结构可以承载多个准直透镜,且支座式结构稳定性强,准直效果好;其中支座式结构具体可以包括主板及设于主板两侧的两个侧板,主板和两侧板组装后构成支座式结构,两个侧板与电路板接触,主板的表面设置多个准直透镜,多个准直透镜的排列和光发射芯片的排列方式一致,也就是各准直透镜以阵列的形式进行排列,电路板长度方向和宽度方向上均设有准直透镜,其中长度方向上一行准直透镜设为一组,这样可以实现设置多组准直透镜,关于电路板长度方向和宽度方向的限定参考图4,图4中方向从左至右定义为电路板长度方向,从上至下定义为电路板宽度方向。多组准直透镜接收来自光发射芯片的信号光,并对各信号光进行汇聚处理,将发散状态的信号光汇聚为平行光束。In the embodiment of the present disclosure, the surface of the circuit board 300 has a bearing surface, which can carry a plurality of light emitting chips. The light emitting chips are arranged in an array. One row of light-emitting chips in the upper direction is set as one group, so that multiple groups of light-emitting chips can be set. For the definition of the length direction and width direction of the circuit board, refer to Figure 4. The direction in Figure 4 is defined as the length direction of the circuit board from left to right. From top to bottom is defined as the board width direction. As shown in FIG. 9 , the collimating lens array 450 in the embodiment of the present disclosure is a support type structure, including a main board and a side board supporting the main body, the side board is arranged on the circuit board, and the main board is provided with a convex array capable of condensing light ; The structure can carry a plurality of collimating lenses, and the support structure has strong stability and good collimation effect; wherein the support structure can specifically include a main board and two side plates arranged on both sides of the main board, the main board and the two sides After the board is assembled, a support structure is formed, the two side boards are in contact with the circuit board, and a plurality of collimating lenses are arranged on the surface of the main board. Arranged in the form of an array, collimating lenses are arranged in the length direction and width direction of the circuit board, and a row of collimating lenses in the length direction is set as one group, so that multiple groups of collimating lenses can be set, and the length and width of the circuit board are related. For the definition of the width direction, refer to FIG. 4 . In FIG. 4 , the direction from left to right is defined as the length direction of the circuit board, and the direction from top to bottom is defined as the width direction of the circuit board. Multiple sets of collimating lenses receive the signal light from the light emitting chip, and perform condensing processing on each signal light, so as to condense the signal light in the divergent state into parallel beams.
如图8所示,第一透镜组件400靠近出光口的一端设有包裹腔体,包裹腔体内具有光纤插口401,光纤插口包括:第一连接部401a,用于与光纤包层插接;第二连接部401b,用于与光纤保护层插接;第三连接部401c具有容纳腔体,可以通过集线部件容纳包裹各光纤带,然后将集线部件插入第三连接部401c的容纳腔体中,其中集线部件可以为包裹光纤带的套筒,各光纤带插入套筒中,然后将套筒插入第三连接部401c的容纳腔体中。图中可以看出,第一连接部401a、第二连接部401b与第三连接部401c的内径大小均不同,且第一连接部401a、第二连接部401b的交界面处有过渡连接部,第二连接部401b与第三连接部401c的交界面处同样有过滤连接部,光纤插口401的形状与光纤的结构一致,光纤从内向外依次包括芯层、包层、保护层,光纤的包层置于第一连接部401a处,光纤的保护层置于第二连接部401b处,且光纤数量较多且光纤较软,因此需要第三连接部401c用于聚集和固定光纤。As shown in FIG. 8 , one end of the first lens assembly 400 close to the light outlet is provided with a wrapping cavity, and the wrapping cavity has an optical fiber socket 401. The optical fiber socket includes: a first connection part 401a, which is used for plugging with the optical fiber cladding; The second connecting portion 401b is used for plugging with the optical fiber protective layer; the third connecting portion 401c has a accommodating cavity, which can accommodate and wrap each optical fiber ribbon through the hub member, and then insert the hub member into the accommodating cavity of the third connecting portion 401c , wherein the hub component may be a sleeve wrapping the optical fiber ribbons, each optical fiber ribbon is inserted into the sleeve, and then the sleeve is inserted into the accommodating cavity of the third connection portion 401c. As can be seen from the figure, the inner diameters of the first connecting portion 401a, the second connecting portion 401b and the third connecting portion 401c are all different in size, and there is a transition connecting portion at the interface between the first connecting portion 401a and the second connecting portion 401b, There is also a filter connection part at the interface between the second connection part 401b and the third connection part 401c. The shape of the optical fiber socket 401 is consistent with the structure of the optical fiber. The layer is placed at the first connection part 401a, and the protective layer of the optical fiber is placed at the second connection part 401b, and the number of fibers is large and the fibers are relatively soft, so a third connection part 401c is required for gathering and fixing the fibers.
本公开实施例中的光纤插口401与第一透镜组件400一体成型,这样可以保证外部光纤与第一透镜组件400相对位置固定,外部光纤与第一透镜组件400之间不会出现位置偏差,有助于提高合束后信号光到光纤的耦合精度,进而信号光从第一透镜组件400耦合至外部光纤时光耦合效率增大。最终实现不同的波长的信号光可共用一根光纤传输出光模块,实现单光纤中多个波长的信号光同时传输。In the embodiment of the present disclosure, the optical fiber socket 401 and the first lens assembly 400 are integrally formed, so that the relative position of the external optical fiber and the first lens assembly 400 can be fixed, and there will be no positional deviation between the external optical fiber and the first lens assembly 400. This helps to improve the coupling precision of the signal light to the optical fiber after the bundle is combined, so that the coupling efficiency of the signal light from the first lens assembly 400 to the external optical fiber is increased. Finally, signal lights of different wavelengths can share a single fiber to transmit out of the optical module, so as to realize simultaneous transmission of signal lights of multiple wavelengths in a single fiber.
如图9所示,光复用组件460包括用于不同波长光束入射进入光复用组件460的入光口,但仅有一个用于出射合成光束的出光口。假设其中有4束波长为λ1、λ2、λ3以及λ4信号光需要合束成一束信号光,4束需要被合束的光信号通过光复用组件460不同的入光口入射至光复用组件460,λ1信号光经过光复用组件206和第一反射面410进行了六次不同的反射到达出光口,λ2信号光经过光复用组件206和第一反射面410进行了四次不同的反射到达出光口,λ3信号光经过光复用组件206和第一反射面410进行了二次不同的反射到达出光口,λ4信号光入射至光复用组件206后直接传输到达至出光口,进而不同波长的信号光经不同的入光口进入光复用组件460、通过同一出光口从光复用组件460输出。如此4束不同的波长的信号光在出光口合成一束,然后合成一束的信号光通过出光口传输至光纤,4束不同的波长的信号光可共用一根光纤传输出光模块,实现单光纤中多个波长的信号光同时传输。As shown in FIG. 9 , the optical multiplexing component 460 includes light entrance ports for incident light beams of different wavelengths into the optical multiplexing component 460 , but only has one light exit port for exiting the combined light beam. It is assumed that there are 4 signal lights with wavelengths λ1, λ2, λ3 and λ4 that need to be combined into one signal light, and the four optical signals that need to be combined are incident on the optical multiplexing component 460 through different light entrances of the optical multiplexing component 460, The λ1 signal light passes through the optical multiplexing component 206 and the first reflecting surface 410 for six different reflections to reach the light exit port, and the λ2 signal light passes through the optical multiplexing component 206 and the first reflecting surface 410 for four different reflections to reach the light exit port, The λ3 signal light passes through the optical multiplexing component 206 and the first reflective surface 410 for two different reflections to reach the light outlet, and the λ4 signal light enters the optical multiplexing component 206 and then directly transmits to the light outlet, and then the signal light of different wavelengths passes through different wavelengths. The optical input port of the optical fiber enters the optical multiplexing component 460, and is output from the optical multiplexing component 460 through the same optical exit port. In this way, 4 beams of signal light with different wavelengths are combined into one beam at the optical outlet, and then the combined signal beam is transmitted to the optical fiber through the optical outlet. Signal light of multiple wavelengths is transmitted simultaneously.
在第二实施中,本公开还提供了另一种结构的光模块其相应的第一透镜组件等结构。 图11为本公开实施例中提供的第二种光模块的分解结构示意图;图12为本公开实施例提供的第二种光模块去除上壳体、下壳体及解锁部件后的结构示意图;图13为本公开实施例提供的第二种第一透镜组件的立体图;图14为本公开实施例提供的第二种第一透镜组件的剖面结构示意图二;图15为本公开实施例提供的第二种第一透镜组件的分解结构示意图;在本申请某一实施例中,如图10所示,本实施例中的第一透镜组件400的结构与第一实施例中的第一透镜组件结构不同,图12很明显地展示出本实施例中的第一透镜组件400的结构,本实施例中的第一透镜组件400的结构与前述实施例中的区别在于:本实施例中的第一透镜组件400的两端具有两个向内的承载面,为了便于描述定义为第一承载面470a和第二承载面470b,本实施例中的准直透镜阵列450为平板式结构,准直透镜阵列与透镜组件固定;图16中很明显地展示出准直透镜阵列450为平板式结构,其上设置多个准直透镜,用于准直光发射芯片发出的信号光,平板式结构的准直透镜阵列450的一端置于第一承载面470a,另一端置于第二承载面470b,该结构的准直透镜阵列450在封装时首选与第一透镜组件400连接,然后再协同罩设在光发射芯片阵列440的上端,本实施例中准直透镜阵列450、第一承载面470a和第二承载面470b相互配合可以保证准直透镜阵列450与第一透镜组件400的相对位置固定,光发射芯片阵列440中的光发射芯片发出的信号光向准直透镜阵列450的发射方向固定,进而确保准直透镜阵列450对光发射芯片阵列440中的光发射芯片发出的信号光的准直效果。在本公开实施例中,准直透镜阵列450的平板式结构可以设为横置的工字形,两端横置于相应的承载面上,工字形平板中间的主体板表面设有多个准直透镜,多个准直透镜以阵列的形式设于主体板的表面。In the second implementation, the present disclosure also provides another structure of the optical module and its corresponding first lens assembly and other structures. 11 is a schematic diagram of the exploded structure of the second optical module provided in the embodiment of the present disclosure; FIG. 12 is a schematic structural diagram of the second optical module provided by the embodiment of the present disclosure after removing the upper casing, the lower casing and the unlocking part; 13 is a perspective view of a second type of first lens assembly provided by an embodiment of the present disclosure; FIG. 14 is a second schematic cross-sectional structure diagram of a second type of first lens assembly provided by an embodiment of the present disclosure; FIG. 15 is provided by an embodiment of the present disclosure A schematic diagram of the exploded structure of the second first lens assembly; in an embodiment of the present application, as shown in FIG. 10 , the structure of the first lens assembly 400 in this embodiment is the same as that of the first lens assembly in the first embodiment. 12 clearly shows the structure of the first lens assembly 400 in this embodiment. The difference between the structure of the first lens assembly 400 in this embodiment and the previous embodiments is that the first lens assembly 400 in this embodiment Both ends of a lens assembly 400 have two inward bearing surfaces, which are defined as a first bearing surface 470a and a second bearing surface 470b for the convenience of description. The lens array and the lens assembly are fixed; Fig. 16 clearly shows that the collimating lens array 450 is a flat structure, on which a plurality of collimating lenses are arranged to collimate the signal light emitted by the light emitting chip. One end of the collimating lens array 450 is placed on the first bearing surface 470a, and the other end is placed on the second bearing surface 470b. The collimating lens array 450 of this structure is preferably connected to the first lens assembly 400 during packaging, and then cooperates with the cover to set. At the upper end of the light emitting chip array 440, in this embodiment, the collimating lens array 450, the first bearing surface 470a and the second bearing surface 470b cooperate with each other to ensure that the relative positions of the collimating lens array 450 and the first lens assembly 400 are fixed. The signal light emitted by the light emitting chips in the light emitting chip array 440 is fixed to the emission direction of the collimating lens array 450, thereby ensuring the collimation of the signal light emitted by the light emitting chips in the light emitting chip array 440 by the collimating lens array 450 Effect. In the embodiment of the present disclosure, the flat-plate structure of the collimating lens array 450 can be set as a horizontal I-shape, the two ends are horizontally placed on the corresponding bearing surfaces, and the surface of the main body plate in the middle of the I-shape flat plate is provided with a plurality of collimators. Lenses, a plurality of collimating lenses are arranged on the surface of the main body plate in the form of an array.
需要说明的是,第二实施例中与第一实施例中的其他器件如第一反射面410、第二反射面420、第一容纳腔430、光发射芯片阵列440、光复用组件460及光纤插口401的结构及功能与第一实施例中的相同,在此不再赘述。It should be noted that other devices in the second embodiment and the first embodiment, such as the first reflecting surface 410, the second reflecting surface 420, the first receiving cavity 430, the light emitting chip array 440, the light multiplexing component 460 and the optical fiber The structure and function of the socket 401 are the same as those in the first embodiment, and are not repeated here.
为了便于装配,准直透镜阵列450的总长度需小于第一承载面470a至第二承载面470b的内径长度,也就是准直透镜阵列450至第一承载面470a的内壁有一定地富余长度,准直透镜阵列450至第二承载面470b的内壁有一定地富余长度。In order to facilitate assembly, the total length of the collimating lens array 450 needs to be smaller than the length of the inner diameter of the first bearing surface 470a to the second bearing surface 470b, that is, the inner wall of the collimating lens array 450 to the first bearing surface 470a has a certain surplus length, The inner wall of the collimating lens array 450 to the second bearing surface 470b has a certain surplus length.
在第三实施例中,本实施例提供了另一种结构的光模块及其各光学器件。图16为本公开实施例中提供的第三种光模块的分解结构示意图;图17为本公开实施例提供的第三种第一透镜组件的剖面结构示意图;图18为本公开实施例提供的第三种第一透镜组件的立体图;图19为本公开实施例提供的第三种第一透镜组件的分解图一;图20为本公开实施例提供的第三种第一透镜组件的分解图二;在第一实施例和第二实施例中采用光纤插口与第一透镜组件设置为一体式的方式来实现将合成的信号光传输至外部光纤中,当然也可以采用其他方式来实现将合成的信号光传输至外部光纤中。在本实施例中,通过设置光纤支架实现将合成的信号光传输至外部光纤中。具体实施方式如下:In the third embodiment, this embodiment provides an optical module of another structure and each optical device thereof. 16 is a schematic diagram of an exploded structure of a third optical module provided in an embodiment of the present disclosure; FIG. 17 is a schematic diagram of a cross-sectional structure of a third type of first lens assembly provided in an embodiment of the present disclosure; A perspective view of a third first lens assembly; FIG. 19 is an exploded view 1 of a third first lens assembly according to an embodiment of the present disclosure; FIG. 20 is an exploded view of a third first lens assembly according to an embodiment of the present disclosure 2. In the first embodiment and the second embodiment, the optical fiber socket and the first lens assembly are integrated to realize the transmission of the synthesized signal light to the external optical fiber. Of course, other methods can also be used to realize the synthesized signal light. The signal light is transmitted to the external optical fiber. In this embodiment, the synthesized signal light is transmitted to the external optical fiber by arranging the optical fiber support. The specific implementation is as follows:
如图16所示,在该实施例中,光模块包括第一透镜组件400、光纤阵列900、光纤适配器600、光纤支架800,如图18所示,还包括汇聚透镜阵列700,其中第一透镜组件包括第一反射面410、第二反射面420、光发射芯片阵列440、准直透镜阵列450、光复用组件460,其中第一反射面410、第二反射面420的表面均为直面,且各器件的功能与前述 实施例中相同,在此不再赘述。As shown in FIG. 16 , in this embodiment, the optical module includes a first lens assembly 400 , an optical fiber array 900 , an optical fiber adapter 600 , and an optical fiber support 800 . As shown in FIG. 18 , it also includes a converging lens array 700 , wherein the first lens The component includes a first reflecting surface 410, a second reflecting surface 420, a light emitting chip array 440, a collimating lens array 450, and an optical multiplexing component 460, wherein the surfaces of the first reflecting surface 410 and the second reflecting surface 420 are straight surfaces, and The functions of each device are the same as those in the foregoing embodiments, and are not repeated here.
透镜组件的上表面包括倾斜的第二反射面,第二反射面能够将来自光复用组件的光汇聚并反射向光纤阵列;第二反射面与光纤阵列之间设置有汇聚透镜阵列,透镜阵列将来自第二反射面的光汇聚后射向光纤阵列。光纤阵列包括光纤支架,光纤支架的末端设置有通孔,光纤设置在通孔中;汇聚透镜阵列设置在透镜组件上,汇聚透镜汇聚的光通过通孔进入光纤中。The upper surface of the lens assembly includes an inclined second reflective surface, which can collect and reflect the light from the optical multiplexing component to the optical fiber array; a converging lens array is arranged between the second reflective surface and the optical fiber array, and the lens array will The light from the second reflecting surface is collected and directed towards the fiber array. The optical fiber array includes an optical fiber bracket, the end of the optical fiber bracket is provided with a through hole, and the optical fiber is arranged in the through hole;
其中,第二反射面420靠近出光口的一端设置汇聚透镜阵列700,光复用组件460合成的信号光传输至第二反射面420后,经第二反射面420反射后耦合至汇聚透镜阵列700,经汇聚透镜阵列700会汇聚至光纤支架800中,其中光纤支架800中穿设有多个光纤带,光纤带与光纤适配器600连接,进而实现光信号的发射。Wherein, the converging lens array 700 is arranged at one end of the second reflecting surface 420 close to the light outlet, and the signal light synthesized by the optical multiplexing component 460 is transmitted to the second reflecting surface 420, and then is reflected by the second reflecting surface 420 and then coupled to the converging lens array 700, The optical fiber support 800 is converged by the converging lens array 700, wherein the fiber support 800 is provided with a plurality of optical fiber ribbons, and the optical fiber ribbons are connected with the optical fiber adapter 600, thereby realizing the transmission of optical signals.
需要说明的是,本公开实施例中的汇聚透镜阵列700也可以设置在光纤支架800的前端,汇聚透镜阵列700与光纤支架800可设为一体式结构,经过汇聚透镜阵列700的汇聚后得到汇聚光斑,然后耦合至光纤支架800内,光纤阵列包括光纤支架,光纤设置在光纤支架中,光纤支架的末端表面设置汇聚透镜阵列;汇聚透镜阵列将来自透镜组件的光汇聚至光纤中。It should be noted that the converging lens array 700 in the embodiment of the present disclosure can also be arranged at the front end of the optical fiber support 800 , and the converging lens array 700 and the optical fiber support 800 can be set as an integrated structure, and the converging lens array 700 can be converged after the converging lens array 700 is converged. The light spot is then coupled into the fiber support 800, the fiber array includes a fiber support, the fiber is arranged in the fiber support, and the end surface of the fiber support is provided with a converging lens array; the converging lens array converges the light from the lens assembly into the fiber.
此时光纤支架800的结构中包括汇聚透镜阵列700,而前述实施例中的汇聚透镜阵列700设于第二反射面420和光纤支架800之间,此时第一透镜组件400中包括汇聚透镜阵列700。At this time, the structure of the optical fiber holder 800 includes the converging lens array 700, and the converging lens array 700 in the foregoing embodiment is disposed between the second reflecting surface 420 and the optical fiber holder 800, and the first lens assembly 400 includes the converging lens array at this time. 700.
如图18-20所示,第一透镜组件400的一端具有承载台面,光纤支架800置于承载台面的表面,第一透镜组件400的前端设置有两个限位部件900a,光纤支架800的侧面设置有两个对接部件900b,将对接部件900b插入相应地限位部件900a内,进而实现第一透镜组件400与光纤支架800的连接;在本申请某一实施例中可以将限位部件900a设为限位柱形式,将对接部件900b设为限位孔形成,将限位柱插入相应地限位孔内实现第一透镜组件400与光纤支架800的对接如图20所示,第一透镜组件400靠近限位部件900a的一端设有凸台,光纤支架800的底端向内凹陷形成凹台,凹台的下表面坐设于凸台上,光纤支架800的两端设于凸台的两侧表面,凹台的上台面是设有装设光纤带的安装槽,安装槽可以固定和限位光纤带,汇聚透镜阵列700设有第一通光口,光纤支架800设有第二通光口,光纤带沿着第一通光口、第二通光口穿过光纤支架并且置于安装槽内。As shown in FIGS. 18-20 , one end of the first lens assembly 400 has a bearing table, and the optical fiber holder 800 is placed on the surface of the bearing table. The front end of the first lens assembly 400 is provided with two limiting parts 900a. Two docking parts 900b are provided, and the docking parts 900b are inserted into the corresponding limiting parts 900a, so as to realize the connection between the first lens assembly 400 and the optical fiber support 800; In the form of a limiting column, the docking part 900b is formed as a limiting hole, and the limiting column is inserted into the corresponding limiting hole to realize the docking of the first lens assembly 400 and the optical fiber holder 800. As shown in FIG. 20, the first lens assembly One end of 400 near the limiting member 900a is provided with a boss, the bottom end of the optical fiber support 800 is recessed inward to form a concave platform, the lower surface of the concave platform is seated on the boss, and both ends of the optical fiber support 800 are set on two sides of the boss. On the side surface, the upper surface of the concave platform is provided with an installation groove for installing the optical fiber ribbon. The installation groove can fix and limit the optical fiber ribbon. The converging lens array 700 is provided with a first light-passing port, and the optical fiber support 800 is provided with a second light-passing port. The optical fiber ribbon passes through the optical fiber support along the first optical port and the second optical port and is placed in the installation groove.
图9本公开实施例提供的一种第一透镜组件的使用状态图;图10为本公开实施例提供的一种光复用组件的工作原理图;光发射芯片阵列440中光发射芯片沿电路板300宽度方向(第一透镜组件400宽度方向)成排的排列。如图10所示,第一透镜组件400的第一容纳腔430中设置的准直透镜阵列450包括四个透镜,四个透镜沿第一透镜组件400宽度方向成排的排列,准直透镜阵列450中的透镜可用于四束信号光的准直,经准直透镜阵列450中的透镜准直后的四束信号光在光复用组件460和第一反射面410之间折返,最终输出一束信号光,该一束信号光包括不同波长的信号光。FIG. 9 is a use state diagram of a first lens assembly provided by an embodiment of the present disclosure; FIG. 10 is a working principle diagram of an optical multiplexing assembly provided by an embodiment of the present disclosure; the light-emitting chips in the light-emitting chip array 440 are located along the circuit board 300 in the width direction (the width direction of the first lens assembly 400 ) is arranged in rows. As shown in FIG. 10 , the collimating lens array 450 provided in the first accommodating cavity 430 of the first lens assembly 400 includes four lenses, and the four lenses are arranged in a row along the width direction of the first lens assembly 400 . The collimating lens array The lens in 450 can be used for the collimation of four beams of signal light, and the four beams of signal light collimated by the lens in the collimating lens array 450 are folded back between the optical multiplexing component 460 and the first reflecting surface 410, and finally one beam is output. Signal light, the beam of signal light includes signal light of different wavelengths.
在本公开实施例中,光复用组件460利用其两侧以及不同位置设置不同的膜层对不同波长信号光进行透过和反射将多束不同波长的信号光合束成一束光。光复用组件206根据 被合束光的束数协调选择每束光的反射次数。In the embodiment of the present disclosure, the optical multiplexing component 460 utilizes different film layers arranged on both sides and different positions to transmit and reflect the signal light of different wavelengths, and combine multiple beams of signal light of different wavelengths into one beam of light. The optical multiplexing component 206 coordinately selects the number of reflections of each beam according to the number of beams to be combined.
在本申请某一实施例中,光发射芯片阵列440中光发射芯片发射的信号光向上传输,传输至准直透镜阵列450中的透镜上,光发射芯片发射的信号光为发散光经该透镜准直为平行光;经准直透镜阵列450准直后的信号光传输至光复用组件460,一波长的光束透过光复用组件460传输至第一反射面410,经第一反射面410的全反射至光复用组件460,此时和另一波长的光束通过光复用组件460的合波后传输至第一反射面410,经第一反射面410的全反射至光复用组件460,此时和又一波长的光束通过光复用组件460的合波后传输至第一反射面410,如此完成多束不同波长的信号光的合波,最终生成一束信号光,该束信号光经过第二反射面420反射后至光纤带中,实现单光纤中多个波长的信号光同时传输。本公开提供的光模块中,仅是通过第一透镜组件以及设置在其第一容纳腔的光复用组件,完成多束不同波长信号光的合束,提高了光模块中耦合多通道时的耦合精度。In an embodiment of the present application, the signal light emitted by the light emitting chip in the light emitting chip array 440 is transmitted upward and transmitted to the lens in the collimating lens array 450, and the signal light emitted by the light emitting chip is divergent light passing through the lens Collimation is parallel light; the signal light collimated by the collimating lens array 450 is transmitted to the optical multiplexing component 460, and the light beam of one wavelength is transmitted to the first reflecting surface 410 through the optical multiplexing component 460, and is transmitted through the first reflecting surface 410. Totally reflected to the optical multiplexing component 460, at this time, the light beam with another wavelength is transmitted to the first reflecting surface 410 after being combined by the optical multiplexing component 460, and is totally reflected to the optical multiplexing component 460 by the first reflecting surface 410. At this time and another wavelength of light beams are combined by the optical multiplexing component 460 and then transmitted to the first reflection surface 410, thus completing the multiplexing of multiple beams of signal light with different wavelengths, and finally generating a beam of signal light, which passes through the second beam. The reflection surface 420 is reflected into the optical fiber ribbon to realize simultaneous transmission of signal light of multiple wavelengths in a single optical fiber. In the optical module provided by the present disclosure, only through the first lens component and the optical multiplexing component disposed in the first accommodating cavity, the beam combining of multiple signal lights with different wavelengths is completed, which improves the coupling when coupling multiple channels in the optical module. precision.
下面对光接收结构进行说明。The light receiving structure will be described below.
在本公开实施例中,第二透镜组件500的结构与第一透镜组件400的结构相似或相同。为了方便描述,将光发射中的透镜组件定义为第一透镜组件,将光接收中的透镜组件定义为第二透镜组件,图21为本公开实施例提供的一种第二透镜组件的分解结构图;图22为本公开实施例提供的又一种第二透镜组件的分解结构图。如图22或23所示,第二透镜组件500和电路板300形成第二容纳腔530,第二容纳腔530用于设置光学器件,在本申请某一实施例中,从电路板300处至上第二容纳腔530内依次设有光接收芯片阵列540、第二准直透镜阵列550及光解复用组件560。且,第二透镜组件500的顶部表面设有第三反射面520和第四反射面510。光接收芯片阵列540中包括多个光接收芯片,用于接收出多束不同波长的信号光,其中光接收芯片以阵列的形式进行排列,电路板长度方向和宽度方向上均设有光接收芯片,其中长度方向上一行光接收芯片设为一组,这样可以实现设置多组光接收芯片,关于电路板长度方向和宽度方向的限定参考图4,图4中方向从左至右定义为电路板长度方向,从上至下定义为电路板宽度方向。第二准直透镜阵列550包括若干个准直透镜,用于准直光解复用组件560输出的信号光。第二准直透镜阵列550罩设在光接收芯片阵列540的上方,第二准直透镜阵列550的透镜数量取决于光接收芯片阵列540中的光接收芯片的数量,通常第二准直透镜阵列550的透镜数量等于光接收芯片阵列540中的光接收芯片的数量。光解复用组件560设置于第二容纳腔530的内壁上,用于将一束信号光分解成多束不同波长的信号光,光解复用组件560包括多个滤光片。在本公开实施例中,光解复用组件560利用其两侧以及不同位置设置不同的膜层对不同波长信号光进行透过和反射将一束包括不同波长的信号光分束成多束光。光解复用组件560根据被分束光的波长种类以及分束数量协调选择每一波长信号光的反射次数。In the embodiment of the present disclosure, the structure of the second lens assembly 500 is similar to or the same as that of the first lens assembly 400 . For the convenience of description, the lens assembly in light emission is defined as the first lens assembly, and the lens assembly in light reception is defined as the second lens assembly. FIG. 21 is an exploded structure of a second lens assembly provided by an embodiment of the present disclosure. Fig. 22 is an exploded structural view of still another second lens assembly provided by an embodiment of the present disclosure. As shown in FIG. 22 or 23, the second lens assembly 500 and the circuit board 300 form a second accommodating cavity 530, and the second accommodating cavity 530 is used for arranging optical devices. In an embodiment of the present application, from the circuit board 300 to the top The light receiving chip array 540 , the second collimating lens array 550 and the light demultiplexing component 560 are arranged in the second accommodating cavity 530 in sequence. And, the top surface of the second lens assembly 500 is provided with a third reflection surface 520 and a fourth reflection surface 510 . The light-receiving chip array 540 includes a plurality of light-receiving chips for receiving multiple beams of signal light with different wavelengths, wherein the light-receiving chips are arranged in the form of an array, and the light-receiving chips are arranged in the length direction and the width direction of the circuit board. , in which a row of light-receiving chips in the length direction is set to one group, so that multiple groups of light-receiving chips can be set. Refer to Figure 4 for the definition of the length direction and width direction of the circuit board. The direction in Figure 4 is defined as the circuit board from left to right. The length direction, from top to bottom, is defined as the width direction of the circuit board. The second collimating lens array 550 includes several collimating lenses for collimating the signal light output by the light demultiplexing component 560 . The second collimating lens array 550 is covered above the light-receiving chip array 540. The number of lenses in the second collimating lens array 550 depends on the number of light-receiving chips in the light-receiving chip array 540. Usually, the second collimating lens array The number of lenses of 550 is equal to the number of light-receiving chips in the light-receiving chip array 540 . The optical demultiplexing component 560 is disposed on the inner wall of the second accommodating cavity 530, and is used for decomposing a signal light into multiple signal lights with different wavelengths. The optical demultiplexing component 560 includes a plurality of filters. In the embodiment of the present disclosure, the optical demultiplexing component 560 uses different film layers arranged on both sides and different positions to transmit and reflect the signal light of different wavelengths, and split a signal light including different wavelengths into multiple beams of light . The optical demultiplexing component 560 coordinately selects the number of reflections of the signal light of each wavelength according to the wavelength type of the split light and the number of split beams.
在本申请某一实施例中,光模块外部的一束具有不同波长的信号光传输至第二透镜组件500,该束信号光经过第三反射面520反射后至光解复用组件560,其中一波长的光束透过光解复用组件560,剩余波长的光束反射至第四反射面510,经过第四反射面510反射至光解复用组件560,另一波长的光束透过光解复用组件560,剩余波长的光束反射至第四反射面510,如此完成将一束具有不同波长的信号光分波成多束不同波长的信号光, 经过第二准直透镜阵列550准直后依次传输至光接收芯片阵列中的光接收芯片,实现光模块接收单光纤中多个波长的信号光的功能。本公开提供的光模块中,仅是通过第二透镜组件以及设置在其第二容纳腔的光解复用组件,完成一束包括不同波长信号光的分束,提高了光模块中耦合多通道时的耦合精度。In an embodiment of the present application, a beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly 500 , and the beam of signal light is reflected by the third reflecting surface 520 to the light demultiplexing assembly 560 , wherein The light beam of one wavelength passes through the optical demultiplexing component 560, the light beam of the remaining wavelength is reflected to the fourth reflecting surface 510, and is reflected to the optical demultiplexing component 560 through the fourth reflecting surface 510, and the light beam of another wavelength transmits the optical demultiplexing component 560. Using the component 560, the light beams with the remaining wavelengths are reflected to the fourth reflecting surface 510, so that a beam of signal light with different wavelengths is demultiplexed into multiple signal lights with different wavelengths, which are collimated by the second collimating lens array 550 in sequence. It is transmitted to the light receiving chips in the light receiving chip array to realize the function of the optical module receiving signal light of multiple wavelengths in a single fiber. In the optical module provided by the present disclosure, only through the second lens component and the optical demultiplexing component disposed in the second accommodating cavity, a beam of signal light with different wavelengths is completed, which improves the coupling of multi-channels in the optical module. coupling accuracy at time.
图23为本公开实施例提供的一种第二透镜组件的分解结构示意图;图24为本公开实施例提供的一种光解复用组件的工作原理图。如图23-24所示,光解复用组件560包括一个用于入射多种波长信号光的入光口,包括多个用于出射光的出光口,每一出光口用于出射一种波长的信号光。假设第二透镜组件500入射一束包括λ1、λ2、λ3以及λ4四种波长的信号光,信号光通过光解复用组件560的入射光口进入光解复用组件560,其中,λ1信号光经过光解复用组件560和第四反射面510进行了六次不同的反射到达其出光口,λ2信号光经过光解复用组件560和第四反射面510进行了四次不同的反射到达其出光口,λ3信号光经过光解复用组件560和第四反射面510进行了二次不同的反射到达其出光口,λ4信号光入射至光解复用组件560后直接传输到达至其出光口,进而实现不同波长的信号光经同一入光口进入光解复用组件560、经不同的出光口输出。FIG. 23 is a schematic diagram of an exploded structure of a second lens assembly according to an embodiment of the present disclosure; and FIG. 24 is a schematic diagram of a working principle of an optical demultiplexing assembly according to an embodiment of the present disclosure. As shown in FIGS. 23-24 , the optical demultiplexing component 560 includes a light input port for incident signal light of multiple wavelengths, and includes a plurality of light output ports for output light, and each light output port is used for outputting one wavelength. signal light. Assuming that the second lens assembly 500 enters a beam of signal light with four wavelengths of λ1, λ2, λ3 and λ4, the signal light enters the optical demultiplexing assembly 560 through the incident light port of the optical demultiplexing assembly 560, wherein the λ1 signal light After passing through the optical demultiplexing component 560 and the fourth reflecting surface 510, it undergoes six different reflections to reach the light outlet, and the λ2 signal light passes through the optical demultiplexing component 560 and the fourth reflecting surface 510 and undergoes four different reflections to reach its light outlet. At the light outlet, the λ3 signal light passes through the optical demultiplexing component 560 and the fourth reflection surface 510 for two different reflections to reach the light outlet, and the λ4 signal light enters the optical demultiplexing component 560 and is directly transmitted to its light outlet. , so that signal lights of different wavelengths enter the optical demultiplexing component 560 through the same light entrance port, and are outputted through different light exit ports.
在本公开实施例中关于第二透镜组件500未尽之处可参见第一透镜组件400。For the details of the second lens assembly 500 in the embodiments of the present disclosure, reference may be made to the first lens assembly 400 .
需要说明的是,本公开提供了两种透镜组件的结构、两种准直透镜阵列的结构、光纤插口和光纤支架这两种将光信号与外部光纤实现连接的方式之间可以任意组合,并不限定于本公开中提供的三种实施例,其他组合的结构均在本公开的保护范围内。It should be noted that the present disclosure provides two structures of lens assemblies, two structures of collimating lens arrays, optical fiber sockets and optical fiber supports, which can be combined arbitrarily between the two ways of connecting optical signals and external optical fibers, and It is not limited to the three embodiments provided in the present disclosure, and other combined structures are all within the protection scope of the present disclosure.
本公开提供的光模块中,第一透镜组件和电路板形成容纳腔,容纳腔从下至上依次设有光发射芯片阵列、准直透镜阵列及光复用组件,且,第一透镜组件的表面具有第一反射面和第二反射面,第一反射面和第二反射面可以是相互连接的,其中光发射芯片阵列包括多个光发射芯片,光发射芯片阵列可以发射多束不同波长的信号光,此时该信号光为散射状态,经过准直透镜阵列的准直聚焦后形成平行光,多束不同波长的平行光传输至光复用组件,一波长的光束透过光复用组件传输至第一反射面,经第一反射面的全反射至光复用组件,此时和另一波长的光束通过光复用组件的合波后传输至第一反射面,经第一反射面的全反射至光复用组件,此时和又一波长的光束通过光复用组件的合波后传输至第一反射面,如此完成多束不同波长的信号光的合波,最终生成一束信号光,该束信号光经过第二反射面反射后至光纤带中,实现单光纤中多个波长的信号光同时传输。本公开提供的光模块中,仅是通过第一透镜组件以及设置在其第一容纳腔的光复用组件,完成多束不同波长信号光的合束,提高了光模块中耦合多通道时的耦合精度。In the optical module provided by the present disclosure, the first lens assembly and the circuit board form a accommodating cavity, and the accommodating cavity is sequentially provided with a light emitting chip array, a collimating lens array and an optical multiplexing assembly from bottom to top, and the surface of the first lens assembly has The first reflective surface and the second reflective surface, the first reflective surface and the second reflective surface can be connected to each other, wherein the light emitting chip array includes a plurality of light emitting chips, and the light emitting chip array can emit multiple beams of signal light with different wavelengths , at this time, the signal light is in a scattered state. After being collimated and focused by the collimating lens array, parallel light is formed. Multiple parallel lights with different wavelengths are transmitted to the optical multiplexing component, and the light beam of one wavelength is transmitted through the optical multiplexing component to the first The reflective surface is totally reflected by the first reflective surface to the optical multiplexing component. At this time, the light beam with another wavelength is transmitted to the first reflective surface after being combined by the optical multiplexing component, and then completely reflected by the first reflective surface to the optical multiplexing component. At this time, the light beam with another wavelength is transmitted to the first reflecting surface after being combined by the optical multiplexing component, thus completing the combining of multiple signal lights with different wavelengths, and finally generating a beam of signal light, which passes through After being reflected by the second reflective surface, it is sent to the optical fiber ribbon to realize simultaneous transmission of signal light of multiple wavelengths in a single optical fiber. In the optical module provided by the present disclosure, only through the first lens component and the optical multiplexing component disposed in the first accommodating cavity, the beam combining of multiple signal lights with different wavelengths is completed, which improves the coupling when coupling multiple channels in the optical module. precision.
本公开提供的光模块中,第二透镜组件与电路板形成第二容纳腔,腔内从下至上依次设置光接收芯片阵列、准直透镜阵列及光解复用组件,且,第二透镜组件的顶部表面具有第三反射面和第四反射面,第三反射面和第四反射面可以是相互连接的;光模块外部的一束具有不同波长的信号光传输至第二透镜组件,该束信号光经过第三反射面反射后至光解复用组件,其中一波长的光束透过光解复用组件,剩余波长的光束反射至第四反射面,经过第四反射面反射至光解复用组件,另一波长的光束透过光解复用组件,剩余波长的光束反射至第四反射面,如此完成将一束具有不同波长的信号光分波成多束不同波长的信号光, 经过准直透镜阵列后依次传输至光接收芯片阵列中的光接收芯片,实现光模块接收单光纤中多个波长的信号光的功能。本公开提供的光模块中,仅是通过第二透镜组件以及设置在其第二容纳腔的光解复用组件,完成一束包括不同波长信号光的分束,提高了光模块中耦合多通道时的耦合精度。In the optical module provided by the present disclosure, the second lens assembly and the circuit board form a second accommodating cavity, and the light receiving chip array, the collimating lens array and the light demultiplexing assembly are sequentially arranged in the cavity from bottom to top, and the second lens assembly The top surface of the optical module has a third reflection surface and a fourth reflection surface, and the third reflection surface and the fourth reflection surface can be connected to each other; a beam of signal light with different wavelengths outside the optical module is transmitted to the second lens assembly, the beam The signal light is reflected by the third reflective surface and then sent to the optical demultiplexing component. The light beam of one wavelength passes through the optical demultiplexing component, and the light beam of the remaining wavelength is reflected to the fourth reflective surface, and then reflected to the optical demultiplexing component through the fourth reflective surface. Using the component, the light beam of another wavelength passes through the optical demultiplexing component, and the light beam of the remaining wavelength is reflected to the fourth reflection surface, so that a beam of signal light with different wavelengths is divided into multiple beams of signal light with different wavelengths. After the collimating lens array is transmitted to the light receiving chips in the light receiving chip array in turn, the function of the optical module receiving signal light of multiple wavelengths in a single optical fiber is realized. In the optical module provided by the present disclosure, only through the second lens component and the optical demultiplexing component disposed in the second accommodating cavity, a beam of signal light with different wavelengths is completed, which improves the coupling of multi-channels in the optical module. coupling accuracy at time.
最后应说明的是:以上实施例仅用以说明本公开的技术方案,而非对其限制;尽管参照前述实施例对本公开进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, but not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims (40)

  1. 一种光模块,其特征在于,包括:An optical module, characterized in that it includes:
    电路板;circuit board;
    第一透镜组件,罩设在光发射芯片阵列上,表面具有第一反射面和第二反射面;The first lens assembly is covered on the light emitting chip array, and the surface has a first reflection surface and a second reflection surface;
    所述光发射芯片阵列,设置于所述电路板的表面,包括多个光发射芯片,用于发射多束不同波长的信号光;The light emitting chip array is disposed on the surface of the circuit board, and includes a plurality of light emitting chips for emitting multiple beams of signal light with different wavelengths;
    第一准直透镜阵列,设于所述光发射芯片阵列和光复用组件之间,包括多个准直透镜,用于接收来自光发射芯片的信号光并汇聚为平行光;The first collimating lens array is arranged between the light emitting chip array and the light multiplexing component, and includes a plurality of collimating lenses for receiving the signal light from the light emitting chip and condensing it into parallel light;
    光复用组件,设置于所述第一透镜组件的内壁上,用于接收来自所述第一准直透镜阵列的信号光,来自各准直透镜的信号光入射至所述光复用组件的不同位置,并与所述第一反射面一起将多束不同波长的信号光合束为一束信号光,合束后的信号光传输至所述第二反射面,经过所述第二反射面反射后发射至外部光纤。an optical multiplexing component, disposed on the inner wall of the first lens component, for receiving the signal light from the first collimating lens array, and the signal light from each collimating lens is incident on different positions of the optical multiplexing component , and together with the first reflective surface, multiple beams of signal light with different wavelengths are combined into one signal light, and the combined signal light is transmitted to the second reflective surface, and then emitted after being reflected by the second reflective surface. to the external fiber.
  2. 根据权利要求1所述的光模块,其特征在于,所述第一准直透镜阵列包括平板及设于所述平板两端的侧板,所述平板与两所述侧板一体式成形。The optical module according to claim 1, wherein the first collimating lens array comprises a flat plate and side plates disposed at both ends of the flat plate, and the flat plate and the two side plates are integrally formed.
  3. 根据权利要求1所述的光模块,其特征在于,所述第二反射面的表面设有凸起结构。The optical module according to claim 1, wherein a convex structure is provided on the surface of the second reflecting surface.
  4. 根据权利要求1所述的光模块,其特征在于,所述第一反射面表面为倾斜面,所述第二反射面表面为倾斜面。The optical module according to claim 1, wherein the surface of the first reflection surface is an inclined surface, and the surface of the second reflection surface is an inclined surface.
  5. 根据权利要求1所述的光模块,其特征在于,所述第一透镜组件靠近出光口的一端设有第一光纤插口,所述第一光纤插口包括:The optical module according to claim 1, wherein the end of the first lens assembly close to the light outlet is provided with a first optical fiber socket, and the first optical fiber socket comprises:
    第一连接部,用于与光纤包层插接;a first connection part, used for plugging with the optical fiber cladding;
    第二连接部,用于与光纤保护层插接;The second connecting part is used for plugging with the optical fiber protective layer;
    第三连接部,用于容纳包裹光纤带的集线部件。The third connecting part is used for accommodating the hub part wrapping the optical fiber ribbon.
  6. 一种光模块,其特征在于,包括:An optical module, characterized in that it includes:
    电路板;circuit board;
    第二透镜组件,罩设在光发射芯片阵列上,表面具有第三反射面和第四反射面,其中所述第三反射面用于接收来自外部光纤的信号光;The second lens assembly is covered on the light emitting chip array, and has a third reflection surface and a fourth reflection surface on the surface, wherein the third reflection surface is used to receive signal light from an external optical fiber;
    光解复用组件,设置于所述第二透镜组件的内壁上,用于接收来自所述第三反射面的信号光,并与所述第四反射面一起将一束信号光分为多束不同波长的信号光;an optical demultiplexing component, arranged on the inner wall of the second lens component, for receiving the signal light from the third reflecting surface, and dividing a signal light into multiple beams together with the fourth reflecting surface Signal light of different wavelengths;
    第二准直透镜阵列,设于光接收芯片阵列和光解复用组件之间,包括多个准直透镜,用于接收来自所述光解复用组件不同位置发出的信号光并汇聚为平行光;The second collimating lens array is arranged between the light-receiving chip array and the optical demultiplexing component, and includes a plurality of collimating lenses for receiving the signal light emitted from different positions of the optical demultiplexing component and condensing them into parallel light ;
    所述光接收芯片阵列,设置于所述电路板的表面,包括多个光接收芯片,用于接收来自所述第二准直透镜阵列的信号光。The light-receiving chip array is disposed on the surface of the circuit board, and includes a plurality of light-receiving chips for receiving the signal light from the second collimating lens array.
  7. 根据权利要求6所述的光模块,其特征在于,所述第二准直透镜阵列包括平板及设于所述平板两端的侧板,所述平板与两所述侧板一体式成形。The optical module according to claim 6, wherein the second collimating lens array comprises a flat plate and side plates disposed at both ends of the flat plate, and the flat plate and the two side plates are integrally formed.
  8. 根据权利要求6所述的光模块,其特征在于,所述第三反射面的表面设有凸起结 构。The optical module according to claim 6, wherein the surface of the third reflection surface is provided with a convex structure.
  9. 根据权利要求6所述的光模块,其特征在于,所述第三反射面表面为倾斜面,所述第四反射面表面为倾斜面。The optical module according to claim 6, wherein the surface of the third reflection surface is an inclined surface, and the surface of the fourth reflection surface is an inclined surface.
  10. 根据权利要求6所述的光模块,其特征在于,所述第二透镜组件靠近出光口的一端设有第二光纤插口,所述第二光纤插口包括:The optical module according to claim 6, wherein the end of the second lens assembly close to the light outlet is provided with a second optical fiber socket, and the second optical fiber socket comprises:
    第四连接部,用于与光纤包层插接;the fourth connection part is used for plugging with the fiber cladding;
    第五连接部,用于与光纤保护层插接;The fifth connecting part is used for plugging with the optical fiber protective layer;
    第六连接部,用于容纳包裹光纤带的集线部件。The sixth connecting part is used for accommodating the hub part wrapping the optical fiber ribbon.
  11. 一种光模块,其特征在于,包括:An optical module, characterized in that it includes:
    电路板;circuit board;
    第一透镜组件,罩设在光发射芯片阵列上,表面具有第一反射面和第二反射面,且底端分别设有向内的第一承载面和第二承载面;The first lens assembly is covered on the light emitting chip array, the surface has a first reflection surface and a second reflection surface, and the bottom end is respectively provided with an inward first bearing surface and a second bearing surface;
    所述光发射芯片阵列,设置于所述电路板的表面,包括多个光发射芯片,用于发射多束不同波长的信号光;The light emitting chip array is disposed on the surface of the circuit board, and includes a plurality of light emitting chips for emitting multiple beams of signal light with different wavelengths;
    第一准直透镜阵列,设为平板式结构,一端置于所述第一承载面,另一端置于所述第二承载面,且设于所述光发射芯片阵列和光复用组件之间,包括多个准直透镜,用于接收来自光发射芯片的信号光并汇聚为平行光;The first collimating lens array is set as a flat plate structure, one end is placed on the first bearing surface, the other end is placed on the second bearing surface, and is arranged between the light emitting chip array and the light multiplexing component, Including a plurality of collimating lenses for receiving the signal light from the light emitting chip and condensing it into parallel light;
    光复用组件,设置于所述第一透镜组件的内壁上,用于接收来自所述第一准直透镜阵列的信号光,来自各准直透镜的信号光入射至所述光复用组件的不同位置,并与所述第一反射面一起将多束不同波长的信号光合束为一束信号光,合束后的信号光传输至所述第二反射面,经过所述第二反射面反射后发射至外部光纤。an optical multiplexing component, disposed on the inner wall of the first lens component, for receiving the signal light from the first collimating lens array, and the signal light from each collimating lens is incident on different positions of the optical multiplexing component , and together with the first reflective surface, multiple beams of signal light with different wavelengths are combined into one signal light, and the combined signal light is transmitted to the second reflective surface, and then emitted after being reflected by the second reflective surface. to the external fiber.
  12. 根据权利要求11所述的光模块,其特征在于,所述第一准直透镜阵列的长度小于所述第一承载面和第二承载面之间的内长。The optical module according to claim 11, wherein the length of the first collimating lens array is smaller than the inner length between the first bearing surface and the second bearing surface.
  13. 根据权利要求11所述的光模块,其特征在于,所述第二反射面的表面设有凸起结构。The optical module according to claim 11, wherein the surface of the second reflection surface is provided with a convex structure.
  14. 根据权利要求11所述的光模块,其特征在于,所述第一反射面表面为倾斜面,所述第二反射面表面为倾斜面。The optical module according to claim 11, wherein the first reflection surface is an inclined surface, and the second reflection surface is an inclined surface.
  15. 根据权利要求11所述的光模块,其特征在于,所述第一透镜组件靠近出光口的一端设有第一光纤插口,所述第一光纤插口包括:The optical module according to claim 11, wherein the end of the first lens assembly close to the light outlet is provided with a first optical fiber socket, and the first optical fiber socket comprises:
    第一连接部,用于与光纤包层插接;a first connection part, used for plugging with the optical fiber cladding;
    第二连接部,用于与光纤保护层插接;The second connecting part is used for plugging with the optical fiber protective layer;
    第三连接部,用于容纳包裹光纤带的集线部件。The third connecting part is used for accommodating the hub part wrapping the optical fiber ribbon.
  16. 一种光模块,其特征在于,包括:An optical module, characterized in that it includes:
    电路板;circuit board;
    第二透镜组件,罩设在光发射芯片阵列上,表面具有第三反射面和第四反射面,且底端分别设有向内的第三承载面和第四承载面,其中第三反射面用于接收来自外部光纤的信号光;The second lens assembly is covered on the light emitting chip array, the surface has a third reflection surface and a fourth reflection surface, and the bottom end is respectively provided with an inward third bearing surface and a fourth bearing surface, wherein the third reflection surface Used to receive signal light from external optical fibers;
    光解复用组件,设置于所述第二透镜组件的内壁上,用于接收来自所述第三反射面的信号光,并与所述第四反射面一起将一束信号光分为多束不同波长的信号光;an optical demultiplexing component, arranged on the inner wall of the second lens component, for receiving the signal light from the third reflecting surface, and dividing a signal light into multiple beams together with the fourth reflecting surface Signal light of different wavelengths;
    第二准直透镜阵列,设为平板式结构,一端置于所述第三承载面,另一端置于所述第四承载面,且设于光接收芯片阵列和光解复用组件之间,包括多个准直透镜,用于接收来自所述光解复用组件不同位置发出的信号光并汇聚为平行光;The second collimating lens array is set as a flat plate structure, one end is placed on the third bearing surface, the other end is placed on the fourth bearing surface, and is arranged between the light receiving chip array and the light demultiplexing component, including a plurality of collimating lenses for receiving the signal light emitted from different positions of the optical demultiplexing component and condensing them into parallel light;
    所述光接收芯片阵列,设置于所述电路板的表面,包括多个光接收芯片,用于接收来自所述第二准直透镜阵列的信号光。The light-receiving chip array is disposed on the surface of the circuit board, and includes a plurality of light-receiving chips for receiving the signal light from the second collimating lens array.
  17. 根据权利要求16所述的光模块,其特征在于,所述第二准直透镜阵列的长度小于所述第三承载面和第四承载面之间的内长。The optical module according to claim 16, wherein the length of the second collimating lens array is smaller than the inner length between the third bearing surface and the fourth bearing surface.
  18. 根据权利要求16所述的光模块,其特征在于,所述第三反射面的表面设有凸起结构。The optical module according to claim 16, wherein the surface of the third reflection surface is provided with a convex structure.
  19. 根据权利要求16所述的光模块,其特征在于,所述第三反射面表面为倾斜面,所述第四反射面表面为倾斜面。The optical module according to claim 16, wherein the surface of the third reflection surface is an inclined surface, and the surface of the fourth reflection surface is an inclined surface.
  20. 根据权利要求16所述的光模块,其特征在于,所述第二透镜组件靠近出光口的一端设有第二光纤插口,所述第二光纤插口包括:The optical module according to claim 16, wherein the end of the second lens assembly close to the light outlet is provided with a second optical fiber socket, and the second optical fiber socket comprises:
    第四连接部,用于与光纤包层插接;the fourth connection part is used for plugging with the fiber cladding;
    第五连接部,用于与光纤保护层插接;The fifth connecting part is used for plugging with the optical fiber protective layer;
    第六连接部,用于容纳包裹光纤带的集线部件。The sixth connecting part is used for accommodating the hub part wrapping the optical fiber ribbon.
  21. 一种光模块,其特征在于,包括:An optical module, characterized in that it includes:
    电路板;circuit board;
    第一透镜组件,罩设在光发射芯片阵列上,表面具有第一反射面和第二反射面,且一端侧面设有限位部件;The first lens assembly is covered on the light emitting chip array, the surface has a first reflection surface and a second reflection surface, and one end side is provided with a limiting component;
    第一光纤支架,一端侧面设有对接部件,所述对接部件插入所述限位部件中;a first optical fiber support, one end side is provided with a butt part, and the butt part is inserted into the limit part;
    所述光发射芯片阵列,设置于所述电路板的表面,包括多个光发射芯片,用于发射多束不同波长的信号光;The light emitting chip array is disposed on the surface of the circuit board, and includes a plurality of light emitting chips for emitting multiple beams of signal light with different wavelengths;
    第一准直透镜阵列,设于所述光发射芯片阵列和光复用组件之间,包括多个准直透镜,用于接收来自光发射芯片的信号光并汇聚为平行光;The first collimating lens array is arranged between the light emitting chip array and the light multiplexing component, and includes a plurality of collimating lenses for receiving the signal light from the light emitting chip and condensing it into parallel light;
    光复用组件,设置于所述第一透镜组件的内壁上,用于接收来自所述第一准直透镜阵列的信号光,来自各准直透镜的信号光入射至所述光复用组件的不同位置,并与所述第一反射面一起将多束不同波长的信号光合束为一束信号光;an optical multiplexing component, disposed on the inner wall of the first lens component, for receiving the signal light from the first collimating lens array, and the signal light from each collimating lens is incident on different positions of the optical multiplexing component , and combine multiple beams of signal light with different wavelengths into one signal light together with the first reflecting surface;
    第一汇聚透镜阵列,包括多个汇聚透镜,用于接收所述光复用组件合束后的信号光并汇聚为汇聚光斑,且耦合至所述第一光纤支架内。The first converging lens array includes a plurality of converging lenses, which are used for receiving the combined signal light of the optical multiplexing component, condensing it into a converging light spot, and being coupled into the first optical fiber support.
  22. 根据权利要求21所述的光模块,其特征在于,所述第一汇聚透镜阵列设于所述第二反射面和所述光纤支架之间。The optical module according to claim 21, wherein the first converging lens array is disposed between the second reflecting surface and the optical fiber support.
  23. 根据权利要求21所述的光模块,其特征在于,所述第一光纤支架具有所述第一汇聚透镜阵列。The optical module according to claim 21, wherein the first optical fiber holder has the first converging lens array.
  24. 根据权利要求21所述的光模块,其特征在于,所述第一透镜组件靠近出光口的 一端设有第一光纤插口,所述第一光纤插口包括:The optical module according to claim 21, wherein one end of the first lens assembly close to the light outlet is provided with a first optical fiber socket, and the first optical fiber socket comprises:
    第一连接部,用于与光纤包层插接;a first connection part, used for plugging with the optical fiber cladding;
    第二连接部,用于与光纤保护层插接;The second connecting part is used for plugging with the optical fiber protective layer;
    第三连接部,用于容纳包裹光纤带的集线部件。The third connecting part is used for accommodating the hub part wrapping the optical fiber ribbon.
  25. 根据权利要求21所述的光模块,其特征在于,所述第一反射面表面为倾斜面,所述第二反射面表面为倾斜面。The optical module according to claim 21, wherein the first reflection surface is an inclined surface, and the second reflection surface is an inclined surface.
  26. 一种光模块,其特征在于,包括:An optical module, characterized in that it includes:
    电路板;circuit board;
    第二透镜组件,罩设在光发射芯片阵列上,表面具有第三反射面和第四反射面,且一端侧面设有限位部件;The second lens assembly is covered on the light emitting chip array, the surface has a third reflection surface and a fourth reflection surface, and one end side is provided with a limiting component;
    第二光纤支架,一端侧面设有对接部件,所述对接部件插入所述限位部件中;a second optical fiber support, one end side is provided with a butt part, and the butt part is inserted into the limit part;
    第二汇聚透镜阵列,包括多个汇聚透镜,用于接收来自所述第二光纤支架的信号光并将所述信号光汇聚至第三反射面;a second converging lens array, comprising a plurality of converging lenses for receiving the signal light from the second optical fiber support and converging the signal light to the third reflecting surface;
    光解复用组件,设置于所述第二透镜组件的内壁上,用于接收来自所述第三反射面的信号光,并与所述第四反射面一起将一束信号光分为多束不同波长的信号光;an optical demultiplexing component, arranged on the inner wall of the second lens component, for receiving the signal light from the third reflecting surface, and dividing a signal light into multiple beams together with the fourth reflecting surface Signal light of different wavelengths;
    第二准直透镜阵列,设于光接收芯片阵列和光解复用组件之间,包括多个准直透镜,用于接收来自所述光解复用组件不同位置发出的信号光并汇聚为平行光;The second collimating lens array is arranged between the light-receiving chip array and the optical demultiplexing component, and includes a plurality of collimating lenses for receiving the signal light emitted from different positions of the optical demultiplexing component and condensing them into parallel light ;
    所述光接收芯片阵列,设置于所述电路板的表面,包括多个光接收芯片,用于接收来自所述第二准直透镜阵列的信号光。The light-receiving chip array is disposed on the surface of the circuit board, and includes a plurality of light-receiving chips for receiving the signal light from the second collimating lens array.
  27. 根据权利要求26所述的光模块,其特征在于,所述第二汇聚透镜阵列设于所述第三反射面和所述光纤支架之间。The optical module according to claim 26, wherein the second converging lens array is arranged between the third reflecting surface and the optical fiber support.
  28. 根据权利要求26所述的光模块,其特征在于,所述第二光纤支架具有所述第二汇聚透镜阵列。The optical module according to claim 26, wherein the second optical fiber holder has the second converging lens array.
  29. 根据权利要求26所述的光模块,其特征在于,所述第二透镜组件靠近出光口的一端设有第二光纤插口,所述第二光纤插口包括:The optical module according to claim 26, wherein the end of the second lens assembly close to the light outlet is provided with a second optical fiber socket, and the second optical fiber socket comprises:
    第四连接部,用于与光纤包层插接;the fourth connection part is used for plugging with the fiber cladding;
    第五连接部,用于与光纤保护层插接;The fifth connecting part is used for plugging with the optical fiber protective layer;
    第六连接部,用于容纳包裹光纤带的集线部件。The sixth connecting part is used for accommodating the hub part wrapping the optical fiber ribbon.
  30. 根据权利要求26所述的光模块,其特征在于,所述第三反射面表面为倾斜面,所述第四反射面表面为倾斜面。The optical module according to claim 26, wherein the surface of the third reflection surface is an inclined surface, and the surface of the fourth reflection surface is an inclined surface.
  31. 一种光模块,其特征在于,包括An optical module, characterized in that it includes
    电路板;circuit board;
    光发射芯片阵列,设置在所述电路板表面,以行或列划分为组,组中的多个光发射芯片能够发出多束不同波长的光信号;an array of light emitting chips, arranged on the surface of the circuit board, divided into groups by rows or columns, and a plurality of light emitting chips in a group can emit multiple beams of light signals of different wavelengths;
    准直透镜阵列,设置在所述光发射芯片阵列的出光方向上,单个透镜对单束光进行汇聚;a collimating lens array, arranged in the light-emitting direction of the light-emitting chip array, and a single lens converges a single beam of light;
    透镜组件,设置在所述电路板上,罩设在所述光发射芯片阵列和所述准直透镜阵列之 上;a lens assembly, arranged on the circuit board, and covered on the light emitting chip array and the collimating lens array;
    光复用组件,设置在所述准直透镜阵列的出光方向上,与所述透镜组件的内壁固定连接,用于将所述多束光合并为一束光;an optical multiplexing component, which is arranged in the light-emitting direction of the collimating lens array and is fixedly connected to the inner wall of the lens component, and is used for combining the multiple beams of light into one beam of light;
    光纤阵列,与所述透镜组件连接,能够接收所述一束光。An optical fiber array, connected to the lens assembly, is capable of receiving the beam of light.
  32. 根据权利要求31所述的光模块,其特征在于,The optical module according to claim 31, wherein,
    所述光复用组件朝向所述准直透镜阵列的表面为滤波面,朝向所述透镜组件的表面包括主体反射面及透光面;The surface of the optical multiplexing component facing the collimating lens array is a filter surface, and the surface facing the lens component includes a main body reflective surface and a light-transmitting surface;
    所述滤波面多个不同位置分别透射来自所述准直透镜阵列的多个单束光;A plurality of different positions of the filtering surface respectively transmit a plurality of single beams of light from the collimating lens array;
    所述主体反射面能够将来自所述滤波面的光反射向所述滤波面;The main body reflecting surface is capable of reflecting light from the filter surface toward the filter surface;
    所述滤波面能够反射来自所述主体反射面的光;the filter surface is capable of reflecting light from the main body reflection surface;
    所述透光面能够透射来自所述滤波面的光;the light-transmitting surface is capable of transmitting light from the filtering surface;
    由所述滤波面及所述主体反射面配合实现多束光合为一束光。The combination of the filter surface and the main body reflection surface realizes that multiple beams of light are combined into one beam of light.
  33. 根据权利要求31所述的光模块,其特征在于,The optical module according to claim 31, wherein,
    所述光复用组件朝向所述准直透镜阵列的表面为滤波面,朝向所述透镜组件的表面为透光面;The surface of the optical multiplexing component facing the collimating lens array is a filter surface, and the surface facing the lens component is a light-transmitting surface;
    所述透镜组件的上表面包括第一反射面;The upper surface of the lens assembly includes a first reflective surface;
    所述滤波面多个不同位置分别透射来自所述准直透镜阵列的多个单束光;A plurality of different positions of the filtering surface respectively transmit a plurality of single beams of light from the collimating lens array;
    所述透光面能够透射来自所述滤波面及所述第一反射面的光;the light-transmitting surface can transmit light from the filtering surface and the first reflecting surface;
    所述第一反射面能够将来自所述滤波面的光反射向所述滤波面;the first reflecting surface is capable of reflecting light from the filtering surface toward the filtering surface;
    所述滤波面能够反射来自所述第一反射面的光;the filter surface is capable of reflecting light from the first reflecting surface;
    由所述滤波面及所述第一反射面配合实现多束光合为一束光。The filtering surface and the first reflecting surface cooperate to realize that multiple beams of light are combined into one beam of light.
  34. 根据权利要求32或33任一所述的光模块,其特征在于,The optical module according to any one of claims 32 or 33, wherein,
    所述透镜组件的上表面包括倾斜的第二反射面,所述第二反射面设置有汇聚透镜阵列,所述汇聚透镜阵列能够将来自所述光复用组件的光汇聚并反射向所述光纤阵列。The upper surface of the lens assembly includes an inclined second reflecting surface, and the second reflecting surface is provided with a converging lens array capable of condensing and reflecting the light from the optical multiplexing assembly toward the optical fiber array .
  35. 根据权利要求32或33任一所述的光模块,其特征在于,The optical module according to any one of claims 32 or 33, wherein,
    所述透镜组件的上表面包括倾斜的第二反射面,所述第二反射面能够将来自所述光复用组件的光汇聚并反射向所述光纤阵列;The upper surface of the lens assembly includes an inclined second reflective surface, the second reflective surface can collect and reflect the light from the optical multiplexing assembly toward the optical fiber array;
    所述第二反射面与所述光纤阵列之间设置有汇聚透镜阵列,所述透镜阵列将来自所述第二反射面的光汇聚后射向所述光纤阵列。A converging lens array is disposed between the second reflecting surface and the optical fiber array, and the lens array condenses the light from the second reflecting surface and emits the light toward the optical fiber array.
  36. 根据权利要求32或33所述的光模块,其特征在于,The optical module according to claim 32 or 33, wherein,
    所述准直透镜阵列包括主板及支撑所述本体的侧板,所述侧板设置在所述电路板上,所述主板设置有能够汇聚光的凸起阵列。The collimating lens array includes a main board and a side board supporting the body, the side board is arranged on the circuit board, and the main board is provided with a convex array capable of condensing light.
  37. 根据权利要求32或33任一所述的光模块,其特征在于,The optical module according to any one of claims 32 or 33, wherein,
    所述准直透镜阵列与所述透镜组件固定。The collimating lens array is fixed with the lens assembly.
  38. 根据权利要求32或33任一所述的光模块,其特征在于,The optical module according to any one of claims 32 or 33, wherein,
    所述透镜组件还包括光纤插口,所述光纤阵列包括光纤集线部件,所述光纤集线部件插入所述光纤阵列插口中。The lens assembly further includes a fiber optic socket, and the fiber optic array includes a fiber optic hub that is inserted into the fiber array socket.
  39. 根据权利要求35所述的光模块,其特征在于,The optical module according to claim 35, wherein,
    所述光纤阵列包括光纤支架,所述光纤支架的末端设置有通孔,所述光纤设置在所述通孔中;The optical fiber array includes an optical fiber support, the end of the optical fiber support is provided with a through hole, and the optical fiber is arranged in the through hole;
    所述汇聚透镜阵列设置在所述透镜组件上,所述汇聚透镜汇聚的光通过所述通孔进入所述光纤中。The converging lens array is arranged on the lens assembly, and the light condensed by the converging lens enters the optical fiber through the through hole.
  40. 根据权利要求35所述的光模块,其特征在于,The optical module according to claim 35, wherein,
    所述光纤阵列包括光纤支架,光纤设置在所述光纤支架中,所述光纤支架的末端表面设置所述汇聚透镜阵列;The optical fiber array includes an optical fiber support, the optical fiber is arranged in the optical fiber support, and the converging lens array is arranged on the end surface of the optical fiber support;
    所述汇聚透镜阵列将来自所述透镜组件的光汇聚至所述光纤中。The converging lens array concentrates light from the lens assembly into the optical fiber.
PCT/CN2021/077503 2020-10-19 2021-02-23 Optical module WO2022083041A1 (en)

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CN202011117865.8A CN114384642A (en) 2020-10-19 2020-10-19 Optical module
CN202011119907.1A CN114384644A (en) 2020-10-19 2020-10-19 Optical module
CN202011119907.1 2020-10-19
CN202011121035.2 2020-10-19
CN202011117865.8 2020-10-19
CN202011119875.5 2020-10-19
CN202011121035.2A CN114371536A (en) 2020-10-19 2020-10-19 Optical module
CN202011119875.5A CN114384643B (en) 2020-10-19 2020-10-19 Optical module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023245966A1 (en) * 2022-06-24 2023-12-28 青岛海信宽带多媒体技术有限公司 Optical module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6198864B1 (en) * 1998-11-24 2001-03-06 Agilent Technologies, Inc. Optical wavelength demultiplexer
CN1359475A (en) * 1999-07-02 2002-07-17 布雷兹网络产品公司 Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics
CN202872792U (en) * 2012-09-12 2013-04-10 胡朝阳 A multi-wavelength single-port transmitting and receiving optical device using silicon photon integration technology
CN105556358A (en) * 2013-08-21 2016-05-04 慧与发展有限责任合伙企业 Device including mirrors and filters to operate as a multiplexer or de-multiplexer
CN106154444A (en) * 2015-04-28 2016-11-23 华为技术有限公司 Optical transceiver and optic communication product

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6198864B1 (en) * 1998-11-24 2001-03-06 Agilent Technologies, Inc. Optical wavelength demultiplexer
CN1359475A (en) * 1999-07-02 2002-07-17 布雷兹网络产品公司 Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics
CN202872792U (en) * 2012-09-12 2013-04-10 胡朝阳 A multi-wavelength single-port transmitting and receiving optical device using silicon photon integration technology
CN105556358A (en) * 2013-08-21 2016-05-04 慧与发展有限责任合伙企业 Device including mirrors and filters to operate as a multiplexer or de-multiplexer
CN106154444A (en) * 2015-04-28 2016-11-23 华为技术有限公司 Optical transceiver and optic communication product

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023245966A1 (en) * 2022-06-24 2023-12-28 青岛海信宽带多媒体技术有限公司 Optical module

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