WO2022065861A1

WO2022065861A1 - Electronic device including heat dissipation structure

Info

Publication number: WO2022065861A1
Application number: PCT/KR2021/012924
Authority: WO
Inventors: 박윤선; 정혜인; 강승훈; 구경하; 문홍기; 송용재; 윤하중
Original assignee: 삼성전자 주식회사
Priority date: 2020-09-25
Filing date: 2021-09-23
Publication date: 2022-03-31
Also published as: KR20220041353A

Abstract

According to various embodiments, an electronic device may comprise: a first housing including a first space; a second housing which is slidably coupled to the first housing and which includes a second space connected to the first space; a heat dissipation structure having one end fixed to the first space, the other end fixed to the second space, and a heat dissipation area that varies according to the sliding operation of the second housing; and at least one heating element arranged in the first space and/or the second space and thermally connected to at least a part of the heat dissipation structure.

Description

Electronic device including heat dissipation structure

Various embodiments of the present disclosure relate to an electronic device including a heat dissipation structure.

Electronic devices are gradually becoming slimmer, rigidity is increased, design aspects are strengthened, and at the same time, improvements are made to differentiate functional elements thereof. BACKGROUND ART Electronic devices are gradually being transformed into various shapes, away from a uniform rectangular shape. The electronic device may have a deformable structure capable of using a large-screen display while being convenient to carry. For example, as part of a deformable structure, the electronic device may have a structure (eg, a rollable structure) in which a display area is expanded through a housing coupling structure operating in a sliding manner and a flexible display supported thereon. Such an electronic device may require efficient arrangement of electronic components disposed in an internal space.

The electronic device may include a deformable slideable electronic device (eg, a rollable electronic device) whose display area can be expanded when used. The slideable electronic device may include a first housing (eg, a base housing) and a second housing (eg, a slide housing) that can be movably coupled to each other in an at least partially fitted together manner. there is. For example, as the second housing slides in or slides out from at least a part of the first housing, the display area of the flexible display or expandable display may be changed. For example, the second housing is manually drawn in or pulled out by a user, or automatically transitions to a slide-in state or a slide-out state through an internal driving mechanism, thereby inducing a change in the display area. can do.

The slideable electronic device may include a plurality of electronic components and/or electrical elements. These electronic components and/or electrical elements may be disposed in the inner space of the first housing and/or the second housing, and the components that generate a lot of heat may diffuse heat or radiate heat to the outside through a heat dissipation structure disposed around them. It can be arranged to

In the case of a slideable electronic device, the internal space may vary according to the sliding operation, and the heat dissipation structure (water) cannot actively cope with the varying volume of the internal space of the electronic device according to the sliding operation, so that the heat dissipation efficiency is lowered. can be

Various embodiments of the present disclosure may provide an electronic device including a heat dissipation structure.

According to various embodiments, it is possible to provide an electronic device including a heat dissipation structure having an optimum heat dissipation efficiency by being changed according to a sliding operation.

According to various embodiments of the present disclosure, an electronic device includes a first housing including a first space, a second housing slidably coupled to the first housing and including a second space connected to the first space; is fixed to the first space, the other end is fixed to the second space, and a heat dissipation structure in which a heat dissipation area is variable according to a sliding operation of the second housing, and the first space and/or the first space It may include at least one heating element disposed in two spaces and thermally connected to at least a portion of the heat dissipation structure.

According to various embodiments, the electronic device includes a housing, a slide structure movably disposed in an internal space of the housing by a specified reciprocating distance, and an internal space of the housing and interlocking with a sliding operation of the slide structure, It may include a heat dissipation structure including a heat dissipation structure having a variable heat dissipation area, and at least one heating element disposed in the internal space and thermally connected to at least a portion of the heat dissipation structure. .

According to various embodiments, the heat dissipation structure may include, in the inner space, a plurality of heat dissipation extending at predetermined intervals along a guide rail disposed to have a length in a direction parallel to a sliding direction of the slide structure and the first guide slit. Plates may be included.

According to various embodiments, the heat dissipation structure disposed in the internal space of the electronic device includes a guide rail disposed in the internal space and a plurality of heat dissipation plates expandably disposed at a predetermined interval along the guide rail, the plurality of At least some of the heat dissipation plates may be thermally connected to at least one heat generating element disposed in the inner space.

In the heat dissipation structure according to exemplary embodiments of the present disclosure, the heat dissipation area is changed according to the volume of the internal space that is changed according to the sliding operation of the electronic device, so that an efficient heat dissipation operation according to the sliding operation is performed, thereby improving the reliability of the electronic device can help

In addition, various effects directly or indirectly identified through this document may be provided.

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;

2A and 2B are diagrams illustrating a slide-in state and a slide-out state of an electronic device according to various embodiments of the present disclosure;

3A and 3B are diagrams illustrating an incoming state and a withdrawing state of an electronic device according to various embodiments of the present disclosure;

4A is a cross-sectional view of an electronic device taken along line 4a-4a of FIG. 2A according to various embodiments of the present disclosure;

4B is a cross-sectional view of an electronic device taken along line 4b-4b of FIG. 2B according to various embodiments of the present disclosure;

5A is an exploded perspective view of a heat dissipation structure according to various embodiments of the present disclosure;

5B is a combined perspective view of a heat dissipation structure according to various embodiments of the present disclosure;

6 is a partial perspective view illustrating a state in which a heat dissipation structure is disposed in an internal space of an electronic device according to various embodiments of the present disclosure;

7 is an operational diagram illustrating an operating relationship of a heat dissipation structure according to various embodiments of the present disclosure.

8A is a partial configuration diagram illustrating an arrangement relationship of a heat dissipation structure according to various embodiments of the present disclosure.

8B is an enlarged view of area 8B of FIG. 8A according to various embodiments of the present disclosure;

9A is a partial perspective view illustrating a state in which a heat dissipation structure is disposed in an internal space of an electronic device according to various embodiments of the present disclosure;

9B is a side view of the heat dissipation structure of FIG. 9A according to various embodiments of the present disclosure;

10A and 10B are perspective views illustrating a state before and after expansion of a heat dissipation structure according to various embodiments of the present disclosure;

10C is a side view illustrating an expanded state of a heat dissipation structure according to various embodiments of the present disclosure;

11A and 11B are perspective views illustrating a state before and after expansion of a heat dissipation structure according to various embodiments of the present disclosure;

11C is a side view illustrating an expanded state of a heat dissipation structure according to various embodiments of the present disclosure;

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments.

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included. In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 may use less power than the main processor 121 or may be set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the co-processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . A sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external

electronic devices

102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2A and 2B are front perspective views of an electronic device showing a slide-in state and a slide-out state according to various embodiments of the present disclosure; 3A and 3B are rear perspective views of an electronic device showing a retracted state and a drawn-out state according to various embodiments of the present disclosure;

2A to 3B , the electronic device 200 moves in a specified direction (eg, X-axis direction) and a specified reciprocation distance from the first housing 210 (eg, a base housing) and the first housing 210 . A second housing 220 (eg, a slide structure) that is operably coupled and a flexible diaplay 230 supported by at least a portion of the first housing 210 and the second housing 220 (eg, expandable) display) may be included. According to an embodiment, the electronic device 200 forms substantially the same plane as at least a portion of the first housing 210 in the slide-out state, and forms the first housing 210 in the slide-in state. 2 The internal space of the housing 220 (eg, a bendable member or bendable support member) accommodated into the second space 2201 of FIG. 4A (eg, the bendable member 240 of FIG. 4A ) (eg: hinge rail or multi-joint hinge module.) According to one embodiment, at least a portion of the flexible display 230 is in the retracted state of the bendable member (eg, the bendable member 240 of FIG. 4A ). While being supported, it may be disposed invisibly from the outside by being accommodated into the inner space of the second housing 220. According to one embodiment, the flexible display 230 is substantially the same as that of the first housing 210 in the drawn-out state. While being supported by a bendable member (eg, the bendable member 240 of FIG. 4A ) forming a plane, it may be disposed to be visible from the outside.

According to various embodiments, the electronic device 200 includes a front surface 200a (eg, a first surface), a rear surface 200b (eg, a second surface) facing in a direction opposite to the front surface 200a, and a front surface 200a; A side surface (not shown) surrounding the space between the rear surfaces 200b may be included. According to an embodiment, the electronic device 200 may include a first housing 210 including a first side member 211 and a second housing 220 including a second side member 221 . . According to an embodiment, the first side member 211 is a first side 2111 having a first length in a first direction (direction ①), and a first side member 211 in a direction substantially perpendicular from the first side 2111. A second side 2112 extending to have a second length greater than one length and a third side 2113 extending substantially parallel to the first side 2111 from the second side 2112 and having a first length may include According to one embodiment, the second side member 221 faces the first side 2111 and extends substantially parallel to a fourth side 2211 having a third length, a fourth side member 221 from the fourth side 2211 a fifth side 2212 extending in a direction substantially parallel to the second side 2112 and having a fourth length greater than the third length and facing the third side 2113 from the fifth side 2212, and substantially It may include a sixth side surface 2213 extending parallel to and having a third length. According to an embodiment, the first side 2111 and the fourth side 2211 and the third side 2113 and the sixth side 2213 may be slidably coupled to each other. According to an embodiment, the areas of the front surface 200a and the rear surface 200b may vary according to the retracted state and the drawn out state of the electronic device 200 . According to one embodiment, the side surface may be formed through a coupling structure of the first side member 211 of the first housing 210 and the second side member 221 of the second housing 220 .

According to various embodiments, the electronic device 200 includes a first rear cover 212 disposed on at least a portion of the first housing 210 of the rear surface 200b and a first rear cover 212 disposed on at least a portion of the second housing 220 . 2 It may include a back cover 222 . According to an embodiment, the first rear cover 212 may be integrally formed with the first side member 211 . According to an embodiment, the second rear cover 222 may be integrally formed with the second side member 221 . According to one embodiment, the first back cover 212 and/or the second back cover 222 may be made of a polymer, coated or tinted glass, ceramic, metal (eg, aluminum, stainless steel (STS), or magnesium); Or it may be formed by a combination of at least two of the above materials. In some embodiments, the first back cover 212 and/or the second back cover 222 may extend to at least a portion of each of the

side members

212 and 222 .

According to various embodiments, the electronic device 200 may include the flexible display 230 disposed to receive support of at least a portion of the first housing 210 and the second housing 220 . According to one embodiment, the flexible display 230 extends from the first area 230a (eg, a flat part) supported by the first housing 210 and the first area 230a, and the second housing 220 ) may include a second region 230b (eg, a bendable part) supported by a bendable member (eg, the bendable member 240 of FIG. 4A ) disposed on the . According to an embodiment, the second region 230b of the flexible display 230 may be in the inner space of the second housing 220 (eg, the second region 230b of FIG. 4A or 4B ) in the retracted state of the electronic device 200 . At least partially introduced into the space 2201), it may be disposed so as not to be exposed to the outside, and in a state in which the electronic device 200 is drawn out, a bendable member (eg, the bendable member 240 of FIGS. 4A or 4B )) It may extend from the first region 230a while being supported by , and may be exposed to the outside to form a substantially same plane. For example, the electronic device 200 may change the display area of the flexible display 230 according to the movement of the second housing 220 from the first housing 210 .

According to various embodiments, the second housing 220 may be coupled in a sliding manner such that the second housing 220 is at least partially drawn in or drawn out from the first housing 210 . For example, the electronic device 200 may be configured to have a first width W1 from the second side 2112 to the fifth side 2212 in the retracted state. According to an embodiment, in the electronic device 200 , in the drawn-out state, the bendable member (eg, the bendable member 240 of FIG. 4A ) introduced into the inner space of the second housing 220 has a second width By moving in the first direction (direction ①) (eg, the X-axis direction) designated to have a width W2 , it may be operated to have a third width W3 greater than the first width W1 . For example, the flexible display 230 may have a display area of substantially the first width W1 in the drawn-in state, and may have an extended display area of substantially the third width W3 in the drawn-out state. can

According to various embodiments, the second housing 220 may be operated through a user's manipulation. For example, the electronic device 200 may transition to the retracted state or the drawn out state through a user's manipulation of pressing the outer surface of the flexible display 230 in a specified direction. In some embodiments, the electronic device 200 operates a button (not shown) of a locker (not shown) exposed to the outside in the direction in which the second housing 220 is designated (eg, direction ①). may be automatically withdrawn. In some embodiments, the second housing 220 is automatically operated via a drive mechanism (not shown) (eg, a drive motor, a reduction module, and/or a gear assembly) disposed in the interior space of the first housing 210 . it might be According to an embodiment, if the electronic device 200 detects an event for transition of the input/exit state of the electronic device 200 through a processor (eg, the processor 120 of FIG. 1 ), through a driving mechanism It may be set to control the operation of the second housing 220 . In some embodiments, the processor of the electronic device 200 (eg, the processor 120 of FIG. 1 ) responds to the changed display area of the flexible display 230 according to an incoming state, an outgoing state, or an intermediate state, in various ways. It is also possible to control the flexible display 230 to display an object and execute an application program.

According to various embodiments, the electronic device 200 includes an input device (not shown), a sound output device 206 (for example, the sound output module 155 of FIG. 1 ), and sensor modules 204 and 217 (for example). : the sensor module 176 of FIG. 1), the camera modules 205 and 216 (eg, the camera module 180 of FIG. 1), a connector port (not shown), a key input device (not shown), or an indicator (not shown) may include at least one of. In another embodiment, the electronic device 200 may be configured such that at least one of the above-described components is omitted or other components are additionally included.

According to various embodiments, the input device may include a microphone. In some embodiments, the input device may include a plurality of microphones arranged to sense the direction of the sound. The sound output device 206 may include a speaker. The sound output device 206 may include a receiver 206 for a call. In some embodiments, the sound output device 206 may include an external speaker. In some embodiments, the sound output device 206 may include a speaker (eg, a piezo speaker) that is operated while a separate speaker hole is excluded.

According to various embodiments, the

sensor modules

204 and 217 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. The

sensor modules

204 and 217 are, for example, on the first sensor module 204 (eg, proximity sensor or illuminance sensor) disposed on the front surface 200a of the electronic device 200 and/or on the rear surface 200b. It may include an disposed second sensor module 217 (eg, a heart rate monitoring (HRM) sensor). According to an embodiment, the first sensor module 204 may be disposed below the flexible display 230 on the front surface 200a of the electronic device 200 . According to an embodiment, the first sensor module 204 and/or the second sensor module 217 may include a proximity sensor, an illuminance sensor, a time of flight (TOF) sensor, an ultrasonic sensor, a fingerprint recognition sensor, a gesture sensor, and a gyro sensor. , an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, and at least one of a humidity sensor.

According to various embodiments, the

camera modules

205 and 216 include a first camera module 205 disposed on the front surface 200a of the electronic device 200 and a second camera module 216 disposed on the rear surface 200b of the electronic device 200 . may include According to an embodiment, the electronic device 200 may include a flash 218 positioned near the second camera module 216 . According to one embodiment, the

camera modules

205 , 216 may include one or more lenses, an image sensor, and/or an image signal processor. According to an embodiment, the first camera module 205 may be disposed under the flexible display 230 and may be configured to photograph a subject through a portion of an active area of the flexible display 230 . According to one embodiment, the flash 218 may include, for example, a light emitting diode or a xenon lamp.

According to various embodiments, some of the

camera modules

205 and 216 , some of the camera modules 205 , and some of the

sensor modules

204 and 217 , 204 are configured to detect an external environment through the flexible display 230 . can be placed. For example, some of the camera modules 205 or some of the sensor modules 204 may be disposed in the internal space of the electronic device 200 so as to be in contact with the external environment through an opening or a transparent area perforated in the flexible display 230 . . According to an embodiment, the area facing the camera module 205 of the flexible display 230 may be formed as a transmissive area having a transmittance designated as a part of the area displaying content. According to one embodiment, the transmissive region may be formed to have a transmittance in a range of about 5% to about 20%. Such a transmission area may include an area overlapping an effective area (eg, an angle of view area) of some camera modules 205 through which light for generating an image by being imaged by an image sensor passes. For example, the transparent area of the flexible display 230 may include an area having a lower pixel density and/or wiring density than the surrounding area. For example, the transmissive region may replace the aforementioned opening. For example, some camera modules 205 may include an under display camera (UDC). In another embodiment, some sensor modules 204 may be arranged to perform their functions without being visually exposed through the flexible display 230 in the internal space of the electronic device 200 .

The electronic device 200 according to exemplary embodiments of the present disclosure has an internal space formed by the first housing 210 and the second housing 220 (eg, the first space 2101 and the second space in FIG. 4A ). It may include a heat dissipation structure (eg, the heat dissipation structure 300 of FIG. 4A or 4B ) disposed in the space 2201). According to an embodiment, the heat dissipation structure (eg, the heat dissipation structure 300 of FIG. 4A or 4B ) has a variable structure in which the heat dissipation area is expanded to correspond to the expanded internal space when the electronic device 200 is in the drawn out state. This can help efficient heat dissipation operation.

4A is a cross-sectional view of an electronic device taken along line 4a-4a of FIG. 2A according to various embodiments of the present disclosure; 4B is a cross-sectional view of an electronic device taken along line 4b-4b of FIG. 2B according to various embodiments of the present disclosure;

Referring to FIGS. 4A and 4B , the electronic device 200 includes a first housing 210 including a first space 2101 and a second space 2201 , and includes a first housing 210 designated by the first housing 210 . The second housing 220 , which is slidably arranged in one direction (direction ①), and the flexible display 230 arranged to receive support of at least a portion of the first housing 210 and the second housing 220 may be included. there is. According to one embodiment, the second housing 220 is a support roller 241 rotatably disposed in the second space 2201 and a bendable member 240 that operates while being supported by the support roller 241 (eg : multi-bar assembly) may be included. According to one embodiment, the bendable member 240 includes a plurality of bars extending in substantially the same direction (eg, +Y/−Y axis direction) as a rotation axis (not shown) of the support roller 241 . It may include a dog-arranged form. For example, the bendable member 240 may be bent at portions having a relatively thin thickness between the plurality of bars. According to one embodiment, the bendable member 240 is disposed to be connected to at least a portion of the first housing 210 and/or the second housing 220 , and a support roller according to the sliding operation of the second housing 220 . It may be introduced into the second space 2201 while being supported by the 241 . For example, when the bendable member 240 is in a pulled out state, it is drawn out to form a plane substantially the same as at least a portion of the first housing 210 , thereby extending the area of the flexible display 230 (eg, FIG. The second region 230b of 2b) may be supported. According to an embodiment, at least a portion of the bendable member 240 is supported so that, when in the retracted state, the flexible display 230 is received into the second space 2201 of the second housing 220 so as not to be seen from the outside. can In some embodiments, the bendable member 240 may be disposed in the first housing 210 , and in this case, at least a portion of the flexible display 230 may, in the retracted state, be disposed on the first housing 210 of the first housing 210 . It may be accommodated in the space 2101 . According to an embodiment, the first space 2101 of the first housing 210 may be connected to the second space 2201 of the second housing 220 . Accordingly, the electronic device 200 may have an internal space of a first volume including the first space 2101 and the second space 2201 in the drawn-in state, and the first space 2101 in the withdrawing state. ) and the second space 2201 , and may have an internal space of a second volume larger than the first volume.

According to various embodiments, the electronic device 200 may include a substrate 250 disposed in the first space 2101 and at least one heating element 251 disposed in the substrate 250 . According to an embodiment, the electronic device 200 is thermally connected to the heat generating element 251 and includes a heat dissipation structure (water) 300 arranged to have a heat dissipation area variable according to an in/out operation. can do. For example, the heat dissipation structure 300 is at least partially extended along the second housing 220 through at least a portion of the expanded first space 2101 and the second space 2201 in the drawn-out state, so that the heating element ( 251) can be configured to efficiently diffuse the heat generated from. For example, one end of the heat dissipation structure 300 may be fixed to a designated position of the first housing 210 , and the other end may be fixed to a designated position of the second housing 220 . The designated location may be appropriately determined in the first space 2101 of the first housing 210 and the second space 2201 of the second housing 220 according to the design of the electronic device 200 . According to one embodiment, the heating element 251 disposed in the first space 2101 of the first housing 210 may include a contact plate 260 in contact with the upper portion thereof, and One end may be fixed to the contact plate 260 . According to an embodiment, the contact plate 260 may be formed of a heat transfer material (eg, metal) for rapidly transferring heat generated from the heat generating element 251 to the heat dissipation structure 300 . In some embodiments, the electronic device 200 includes a heat dissipation fan 400 disposed near the heat dissipation structure 300 , such that heat is transferred from the heat generating element 251 to the heat dissipation structure 300 through the contact plate 260 . It can help cool you down quickly. For example, the heat dissipation fan 400 may have a convection phenomenon in at least a portion of the first space 2101 of the first housing 210 and/or at least a portion of the second space 2201 of the second housing 220 . generated to help cool the heat transferred to the heat dissipation structure 300 . For example, the heat dissipation fan 400 may include a micro pump or a piezo pump.

5A is an exploded perspective view of a heat dissipation structure according to various embodiments of the present disclosure; 5B is a combined perspective view of a heat dissipation structure according to various embodiments of the present disclosure;

Referring to FIG. 5A , the heat dissipation structure 300 includes a plurality of heat dissipation plates 310 having a designated area, and a hinge shaft 317 for rotatably coupling each of the plurality of heat dissipation plates 310 with respect to each other, and It is rotatably fixed to both ends of the hinge shaft 317, and the second housing from the first space (eg, the first space 2101 of FIG. 4B ) of the first housing (eg, the first housing 210 of FIG. 4B ). A first guide rail (eg, the first guide rail 320 of FIG. 6 ) extending into the second space (eg, the second space 2201 of FIG. 4B ) of (eg, the second housing 220 of FIG. 4B ) ) may include a plurality of first guide rollers 318 that are moved along. According to one embodiment, each of the plurality of heat dissipation plates 310 may be formed of a metal material advantageous for heat transfer. According to the embodiment, each of the plurality of heat dissipation plates 310 includes

plate parts

3111 and 3121, first hinge

arms

3112 and 3122 disposed at one end of the

plate parts

3111 and 3121, and plate parts 3111, It may include

second hinge arms

3113 and 3123 disposed at the other end of 3121. According to one embodiment, the

first hinge arms

3112 and 3122 and the

second hinge arms

3113 and 3123 are provided in plurality. It may be formed, and may be integrally formed with the

plate parts

3111 and 3121. According to one embodiment, among the plurality of heat dissipation plates 310 , the first hinge arm 3112 of the first heat dissipation plate 311 . ) and the first hinge arm 3122 of the second heat dissipation plate 312 adjacent to the first heat dissipation plate 311 may be disposed in a manner to be fitted with respect to each other, and the first heat dissipation plate 311 and The second heat dissipation plate 312 may be rotatably coupled to each other through a hinge shaft 317 penetrating the

first hinge arms

3112 and 3122 .

Referring to FIG. 5B , each of the plurality of heat dissipation plates 310 includes a first hinge arm 3112 disposed on the plate portion 3111 of the first heat dissipation plate 311 , adjacent to the first heat dissipation plate 311 . The first hinge arm 3122 disposed on the plate portion 3121 of the second heat dissipation plate 312 and the hinge shaft (eg, the hinge shaft 317 of FIG. 5A ) may be rotatably coupled to each other. According to one embodiment, the first guide roller 318 may be rotatably coupled to both ends of the hinge shaft (eg, the hinge shaft 317 of FIG. 5A ). According to an exemplary embodiment, the second hinge arm 3123 of the second heat dissipation plate 312 is a second heat dissipation plate 312 disposed on the plate portion 3131 of the third heat dissipation plate 313 adjacent to the second heat dissipation plate 312 . It may be rotatably coupled to the hinge arm 3133 . According to one embodiment, the first hinge arm 3132 of the third heat dissipation plate 313 is a first disposed on the plate portion 3141 of the fourth heat dissipation plate 314 adjacent to the third heat dissipation plate 313 . The hinge arm 3142 and the hinge shaft (eg, the hinge shaft 317 of FIG. 5A ) may be rotatably coupled to each other. According to one embodiment, the second guide roller 319 may be rotatably coupled to both ends of the hinge shaft (eg, the hinge shaft 317 of FIG. 5A ). According to one embodiment, the second hinge arm 3143 of the fourth heat dissipation plate 314 may be rotatably coupled to the second hinge arm of the adjacent fifth heat dissipation plate (not shown). For example, in the plurality of heat dissipation plates 310, coupling with the first hinge arms (a coupling of 3112 and 3122 and a coupling of 3132 and 3142) and coupling with the second hinge arms (a coupling of 3123 and 3133) are alternated. It may have a bonding structure made by According to one embodiment, when one end of the heat dissipation plate 314 of the plurality of heat dissipation plates 310 is pulled in the first direction, each of the plurality of

heat dissipation plates

311 , 312 , 313 , 314 is , may be operated in an unfolded manner with a specified angle with the neighboring heat dissipation plate 313 . For example, the heat dissipation plate 311 disposed at one end of the plurality of heat dissipation plates 310 is disposed in a first space (eg, the first space of FIG. 4b ) of the first housing (eg, the first housing 210 of 4b). The heat dissipation plate 314 fixed to the contact plate (eg, the contact plate 260 of FIG. 4B ) disposed in the space 2101 ) and disposed at the other end of the plurality of heat dissipation plates 310 is provided in the second housing (eg, the heat dissipation plate 314 ). : It may be fixed to the second space (eg, the second space 2201 of FIG. 4B ) of the second housing 220 of FIG. 4B . In this case, in the heat dissipation structure 300 , when the second housing (eg, the second housing 220 of FIG. 4B ) is withdrawn from the first housing (eg, the first housing 210 of FIG. 4B ), a plurality of heat dissipation plates The heat dissipation area may be expanded in such a way that each of the

elements

311 , 312 , 313 , and 314 is spread out at a predetermined angle with respect to each other.

6 is a partial perspective view illustrating a state in which a heat dissipation structure is disposed in an internal space of an electronic device according to various embodiments of the present disclosure; 7 is an operational diagram illustrating an operating relationship of a heat dissipation structure according to various embodiments of the present disclosure.

Referring to FIGS. 6 and 7 , the plurality of heat dissipation plates 310 are formed in a first space (eg, a first space 2101 of FIG. 4B ) of a first housing (eg, the first housing 210 of FIG. 4B ). ) to the second space (eg, the second space 2201 of FIG. 4B ) of the second housing (eg, the second housing 220 of FIG. 4B ) moves along the first guide rail 320 arranged to extend can be arranged as much as possible. According to one embodiment, the heat dissipation structure 300 is a portion in which the first hinge arms (eg, the

first hinge arms

3112 , 3122 , 3132 , 3142 of FIG. 5B ) are coupled to each other among the plurality of heat dissipation plates 310 . It may include a plurality of

first guide rollers

318 and 319 rotatably disposed on the , and may be moved on the first guide slit 321 formed in the longitudinal direction of the first guide rail 320 . According to one embodiment, the plurality of

first guide rollers

318 and 319 are guide rollers having relatively small diameters along the first direction (direction ①) (eg, the direction in which the second housing 220 is drawn out). may include

According to various embodiments, when the plurality of heat dissipation plates 310 are expanded in the first direction (direction ①), they may be sequentially expanded. According to one embodiment, the first guide slit 321 of the guide rail 320 is for guiding the plurality of

first guide rollers

318 and 319 through the

step portions

3211 and 3212 formed at a specified interval. It may be formed to have different widths g1, g2, and g3. For example, the widths g1 , g2 , and g3 of the first guide slit 321 may be formed to gradually decrease through the

step portions

3211 and 3212 as they progress in the first direction (the direction ①). Therefore, when the plurality of

first guide rollers

318 and 319 are moved along the first guide slit 321, they have gradually smaller widths g1, g2, and g3 through the

step portions

3211 and 3212. While the plurality of

first guide rollers

318 and 319 are sequentially caught on the formed first guide slit 321 , the plurality of heat dissipation plates 310 may be sequentially spread. For example, when the plurality of heat dissipation plates 310 are moved in the first direction (① direction), the plurality of first guide rollers 318, which are formed to have a gradually smaller diameter as they go toward the first direction (① direction) 319 ) may receive a guide of the first guide slit 321 whose widths g1 , g2 , and g3 gradually decrease as it goes toward the first direction (direction ①). For example, when the plurality of heat dissipation plates 310 are moved in the first direction (direction ①), the second heat dissipation plate 312 , the third heat dissipation plate 313 from the first heat dissipation plate 311 , The fourth heat dissipation plate 314 , the fifth heat dissipation plate 315 , and the sixth heat dissipation plate 316 may be guided to sequentially unfold at a designated angle in order.

8A is a partial configuration diagram illustrating an arrangement relationship of a heat dissipation structure according to various embodiments of the present disclosure. 8B is an enlarged view of area 8B of FIG. 8A according to various embodiments of the present disclosure;

Referring to FIGS. 8A and 8B , the heat dissipation structure 300 - 1 includes second hinge arms (eg, the

second hinge arms

3113 , 3123 , 3133 and 3143 of FIG. 5B ) among the plurality of heat dissipation plates 310 . )) in order to guide the plurality of second guide rollers 335 and the plurality of second guide rollers 335 rotatably arranged in the coupled portion, side by side with the first guide rail 320 at a specified interval It may include second guide rails 330 spaced apart from each other. According to one embodiment, the plurality of second guide rollers 335 may be moved along the second guide slit 331 formed in the second guide rail 330 . For example, the coupling structure of the plurality of second guide rollers 335 and the second guide rail 330 for guiding them is as described above with the plurality of

first guide rollers

318 and 319 and the first guide for guiding them. The coupling structure of the rail 320 may be substantially the same as that of the rail 320 .

According to various embodiments, when the plurality of

heat dissipation plates

311 , 312 , 313 , 314 , 315 , and 316 are moved in the first direction (direction ①), the plurality of second guide rollers 335 are first It may be moved in a second direction (direction ②) perpendicular to the direction (direction ①). According to one embodiment, the plurality of second guide rollers 335 should be moved in the second direction (direction ②) because they are interrupted by the second guide rail 330 , but they are not. Accordingly, the heat dissipation structure 300 - 1 may further include a length compensation structure 340 for compensating a distance for the plurality of second guide rollers 335 to move in the second direction (direction ②). According to an embodiment, each of the plurality of

heat dissipation plates

311 , 312 , 313 , 314 , 315 , and 316 may include a first sub-plate and a second sub-plate. For example, referring to FIG. 8B , the first heat dissipation plate 311 may include a first sub-plate 311a, a first sub-plate 311a, and a divided second sub-plate 311b. According to one embodiment, the length compensation structure 340 may include a plate housing 341 for movably accommodating one end of the first sub-plate 311a and the second sub-plate 311b. According to one embodiment, when the plurality of

heat dissipation plates

311, 312, 313, 314, 315, and 316 are moved in the first direction (direction ①), the first sub-plate 311a and the second sub-plate ( 311b) is moved in the third direction (③ direction) in the plate housing 341, so that the plurality of second guide rollers 335 are moved in the second direction (② direction) perpendicular to the first direction (① direction). The distance to not be moved can be compensated. According to one embodiment, the length compensation structure 340 includes an elastic member 342 disposed to press the first sub-plate 311a and the second sub-plate 311b in the inner space of the plate housing 341 . can do. According to one embodiment, the elastic member 342 by including a compression coil spring, the plurality of heat dissipation plates (311, 312, 313, 314, 315, 316) in the first direction (circle direction) is a force to be spread can assist According to another embodiment, the elastic member 342 may include a leaf spring or a foldable sheet. According to an embodiment, the elastic member 342 may include an elastic material that facilitates heat transfer, thereby helping heat transfer between the first sub-plate 311a and the second sub-plate 311b. According to an embodiment, the elastic material for easy heat transfer may include thermal grease.

In some embodiments, the electronic device (eg, the electronic device 200 of FIGS. 4A and 4B ) includes a plurality of heat dissipation plates 310 extending through the first guide rail 320 as shown in FIG. 7 . As shown in the first heat dissipation structure 300 and FIG. 8A , the plurality of heat dissipation plates 310 have a length compensation structure 340 , and a first guide rail 320 and a second guide rail 330 . It may include a second heat dissipation structure 300 - 1 extending through the. According to an embodiment, the first heat dissipation structure 300 and the second heat dissipation structure 300 - 1 are formed in an internal space (eg, FIGS. 4A and 4B ) of an electronic device (eg, the electronic device 200 of FIGS. 4A and 4B ). The first space 4101 and/or the second space 2201 of FIG. 4B may be separately disposed. For example, the first heat dissipation structure 300 may have a second width (eg, the second region 230b of FIG. 2B ) from the contact plate (eg, the contact plate 260 of FIGS. 4A and 4B ). : It may be arranged to have an extended area as much as 1/2 the movement distance of the second width W2 of FIG. 2B , and the second heat dissipation structure 300-1 is formed in the second area (eg, the second area of FIG. 2B ). It may be arranged to have an extended area equal to the remaining 1/2 movement distance of the second width (eg, the second width W2 of FIG. 2B ) of the 230b).

9A is a partial perspective view illustrating a state in which a heat dissipation structure is disposed in an internal space of an electronic device according to various embodiments of the present disclosure; 9B is a side view of the heat dissipation structure of FIG. 9A according to various embodiments of the present disclosure;

Referring to FIGS. 9A and 9B , the electronic device 200 includes a substrate 250 and a substrate 250 disposed in a first space 2101 of a first housing (eg, the first housing 210 of FIG. 4B ). One end is fixed to the heating element 251 disposed in the heating element 251, the contact plate 260 in contact with the heating element 251, and the contact plate 260, and the other end is fixed to the second housing (eg, the second housing 220 in FIG. 4B ) )) of the second space 2201 may include a heat dissipation structure 510 fixed to a designated position. According to an embodiment, a heat transfer material 261 (eg, a thermal interface material (TIM)) may be further interposed between the heating element 251 and the contact plate 260 . For example, the heat transfer material 261 may absorb heat generated from the heat generating element 251 on the substrate 250 and transfer it to the contact plate 260 and/or the heat dissipation structure 510 . According to an embodiment, a plurality of heat transfer materials 261 may be formed in the Z-axis direction (eg, the Z-axis direction of FIG. 4 ). For example, the heat transfer material 261 may include a first heat transfer material in contact with the contact plate 260 , and a second heat transfer material disposed between the first heat transfer material and the heating element 251 . there is. For example, the first heat transfer material and the second heat transfer material may be disposed/applied in the Z-axis direction. In one embodiment, the second heat transfer material may absorb heat generated from the heating element 251 and transfer it to the first heat transfer material, and the first heat transfer material may absorb the heat transferred from the second heat transfer material It may be transferred to the contact plate 260 and/or the heat dissipation structure 510 .

According to one embodiment, the heat transfer material 261 may include a material having better thermal conductivity than air, and may be formed of an adhesive having low elasticity or high elasticity. For example, the heat transfer material 261 may have fluidity such as a gel and/or a solid TIM such as a carbon fiber TIM, a silicone TIM, or an acryl TIM. It may include a liquid (liquid) TIM having high viscosity. According to an embodiment, the heat transfer material 261 includes at least one of a copper plate, a thermal grease, an elastomer including a thermally conductive filler, and an adhesive film. can do.

According to one embodiment, the heat dissipation structure 510 may include a plate spring arranged in a folding manner with elasticity in a zigzag manner. According to one embodiment, in the heat dissipation structure 510 including a plate-shaped spring, the second housing (eg, the second housing 220 of FIG. 4B ) is the first housing (eg, the first housing 210 of FIG. 4A )) When withdrawn from the first direction (① direction), it may be arranged to expand while retaining elasticity.

10A and 10B are perspective views illustrating a state before and after expansion of a heat dissipation structure according to various embodiments of the present disclosure; 10C is a side view illustrating an expanded state of a heat dissipation structure according to various embodiments of the present disclosure;

10A to 10C , the heat dissipation structure 520 may include a heat dissipation plate 521 in which at least one slit 5201 having a specified shape is formed. According to one embodiment, the heat dissipation plate 521 has a first plate 522 that has elasticity and protrudes outward through at least one slit 5201 , and at least one slit 5201 from the first plate 522 . It may include a second plate 523 that has elasticity to the outside and protrudes through the. According to an exemplary embodiment, the first plate 522 and the second plate 523 of the heat dissipation plate 521 may be formed to maintain a connected state without being disconnected from each other through at least one slit 5201 . According to one embodiment, the heat dissipation plate 521 is fixed to the contact plate 260 thermally connected to the heat generating element 251 of the substrate 250, and the second plate 523 is a second housing (eg, FIG. 4B ). of the second housing 220) may be fixed to at least a portion of the second space (eg, the second space 2201 of FIG. 4B).

According to various embodiments, the second housing (eg, the second housing 220 of FIG. 4B ) may be drawn out from the first housing (eg, the first housing 210 of FIG. 4A ) in the first direction (direction ①). When the first plate 522 and the second plate 523 protrude from the heat dissipation plate 521 , the heat dissipation area of the heat dissipation structure 520 may be expanded to have an extended distance d1 .

In some embodiments, the heat dissipation structure 520 may include three or more plates that are connected to each other through at least one slit 5201, retain elasticity to the outside, and are disposed to protrude.

11A and 11B are perspective views illustrating a state before and after expansion of a heat dissipation structure according to various embodiments of the present disclosure; 11C is a side view illustrating an expanded state of a heat dissipation structure according to various embodiments of the present disclosure;

11A to 11C , the heat dissipation structure 530 may be disposed in a form in which two

heat dissipation plates

531 and 532 are connected to each other. According to one embodiment, the first heat dissipation plate 531 has elasticity and sequentially protrudes from the first plate 5311 and the first plate 5311 to the outside through at least one first slit 5301 . It may include a plate 5312 and a third plate 5313 . According to one embodiment, the second heat dissipation plate 532 has elasticity outward from the fourth plate 5321 and at least one second slit 5302 from the fourth plate 5321 in the first direction (①). direction) and a fifth plate 5322 protruding in the opposite direction. According to one embodiment, the fifth plate 5322 and the third plate 5313 are integrally formed, whereby the first plate 5311, the second plate 5312, the third plate 5313, the fourth plate ( 5321 and the fifth plate 5322 may be formed to be connected to each other. For example, in the heat dissipation structure 530 , the first plate 5311 of the first heat dissipation plate 531 is fixed to the contact plate 260 thermally connected to the heating element 251 of the substrate 250 , and the fourth The plate 5321 may be fixed to at least a portion of the second space (eg, the second space 2201 of FIG. 4B ) of the second housing (eg, the second housing 220 of FIG. 4B ).

According to various embodiments, the second housing (eg, the second housing 220 of FIG. 4B ) may be drawn out from the first housing (eg, the first housing 210 of FIG. 4A ) in the first direction (direction ①). At this time, the second plate 5312 and the third plate 5313 protrude sequentially from the first plate 5311 of the first heat dissipation plate 531 , and the fifth plate 5322 of the second heat dissipation plate 532 . ) protrudes from the fourth plate 5321 , so that the heat dissipation structure 530 may have an extended heat dissipation area to have an extended distance d2 .

In some embodiments, five or more heat dissipation plates may be connected to the heat dissipation structure in substantially the same manner.

According to various embodiments, the electronic device (eg, the electronic device 200 of FIG. 4A ) includes a first housing (eg, the first space 2101 of FIG. 4A ) including the first space (eg, the first space 2101 of FIG. 4A ). The first housing 210) and a second housing (eg, a second space 2201 in FIG. 4A ) that is slidably coupled to the first housing and includes a second space connected to the first space (eg, the second space 2201 in FIG. 4A ). The second housing 220 of FIG. 4A), one end is fixed to the first space, the other end is fixed to the second space, and a heat dissipation structure in which a heat dissipation area is variable according to a sliding operation of the second housing (heat) Dissipation structure (eg, the heat dissipation structure 300 of FIG. 4A ) and at least one heat generating element disposed in the first space and/or the second space and thermally connected to at least a portion of the heat dissipation structure It may include an element (eg, the heating element 251 of FIG. 4A ).

According to various embodiments of the present disclosure, a flexible display disposed to receive support from the first housing and the second housing may be included.

According to various embodiments, disposed in the second space of the second housing, accommodated in the second space of the second housing in a slide-in state, and in a slide-out state and a bendable member drawn out to have the same plane as the first housing, wherein the flexible display is at least partially accommodated into the second space through the support of the bendable member in the retracted state, In the drawn-out state, through the support of the bendable member, it may be at least partially exposed so as to be visible from the outside.

According to various embodiments, the first housing may include a substrate disposed in the first space, the heating element disposed on the substrate, and a contact plate thermally connecting the heating element and the heat dissipation structure.

According to various embodiments, the second space may further include a heat dissipation fan disposed near the heat dissipation structure.

According to various embodiments, each of the plurality of heat dissipation plates may be rotatably coupled to a second hinge arm of one heat dissipation plate with respect to a second hinge arm of a neighboring heat dissipation plate.

According to various embodiments, in each of the plurality of heat dissipation plates, a first hinge arm of a first heat dissipation plate and a first hinge arm of a second heat dissipation plate adjacent to the first heat dissipation plate are rotatably coupled, A second hinge arm of the second heat dissipation plate is rotatably coupled to a second hinge arm of a third heat dissipation plate adjacent to the second heat dissipation plate, and the first hinge arm of the third heat dissipation plate includes the The third heat dissipation plate may be rotatably coupled to the first hinge arm of the neighboring fourth heat dissipation plate.

According to various embodiments, each of the plurality of heat dissipation plates may be rotatably coupled to each other through a hinge shaft coupled to pass through the first hinge arm and the second hinge arm.

According to various embodiments, a portion of the heat dissipation plate to which the first hinge arms are coupled includes a first plurality of guide rollers rotatably disposed at both ends of the hinge shaft, respectively, and the first plurality of guide rollers are It may be movably disposed along the first guide slit.

According to various embodiments, each of the plurality of first guide rollers may have a diameter gradually decreasing in a direction in which the plurality of heat dissipation plates are expanded.

According to various embodiments, in the first guide slit, a step portion is formed such that a guide width becomes smaller in a direction in which the plurality of heat dissipation plates are expanded, and the first plurality of guide rollers are sequentially interrupted through the step portion. As a result, the heat dissipation plate may be sequentially expanded.

According to various embodiments, in a portion in which a second guide rail spaced parallel to the first guide rail at a predetermined distance and including a second guide slit and the second hinge arms of the heat dissipation plate are coupled, both ends of the hinge shaft and a second plurality of guide rollers respectively rotatably disposed on the . The second plurality of guide rollers may be disposed to be movable along the second guide slit of the second guide rail.

According to various embodiments, each of the plurality of heat dissipation plates may include a length compensation structure for compensating for length changes due to expansion and contraction.

According to various embodiments, each of the plurality of heat dissipation plates includes a first sub-plate and a second sub-plate, and the length compensating structure is a plate that operably interrupts the first sub-plate and the second sub-plate. It may include a housing.

According to various embodiments, the plate housing may further include an elastic member for pressing the first sub-plate and the second sub-plate to the outside.

According to various embodiments, the heat dissipation structure may include a leaf spring formed in a zigzag shape and elastically folded.

According to various embodiments, the heat dissipation structure may include at least one heat dissipation plate including at least one plate that elastically protrudes outward through at least one slit.

And the embodiments of the present disclosure disclosed in the present specification and drawings are merely provided for specific examples to easily explain the technical contents according to the embodiments of the present disclosure and to help the understanding of the embodiments of the present disclosure, and to extend the scope of the embodiments of the present disclosure It is not meant to be limiting. Therefore, in the scope of various embodiments of the present disclosure, in addition to the embodiments disclosed herein, all changes or modifications derived from the technical ideas of various embodiments of the present disclosure should be interpreted as being included in the scope of various embodiments of the present disclosure. .

Claims

In an electronic device,

a first housing including a first space;

a second housing slidably coupled to the first housing and including a second space connected to the first space;

a heat dissipation structure in which one end is fixed to the first space, the other end is fixed to the second space, and the heat dissipation area is variable according to a sliding operation of the second housing; and

and at least one heating element disposed in the first space and/or the second space and thermally connected to at least a portion of the heat dissipation structure.
According to claim 1,

and a flexible display disposed to be supported by the first housing and the second housing.
3. The method of claim 2,

disposed in the second space of the second housing, accommodated in the second space of the second housing in a slide-in state, and identical to the first housing in a slide-out state It includes a bendable member that is drawn out to have a flat surface,

In the retracted state, the flexible display is at least partially accommodated into the second space through the support of the bendable member, and in the pulled out state, through the support of the bendable member, at least partially to be visible from the outside Electronic devices exposed to
According to claim 1,

a substrate disposed in the first space of the first housing;

the heating element disposed on the substrate; and

and a contact plate thermally connecting the heat generating element and the heat dissipation structure.
According to claim 1,

The electronic device further comprising a heat dissipation fan disposed near the heat dissipation structure in the second space.
According to claim 1,

The heat dissipation structure is

a first guide rail extending from the first space to at least a portion of the second space and including a first guide slit; and

and a plurality of heat dissipation plates moving along the first guide slit,

The plurality of heat dissipation plates are expanded according to a drawing operation of the second housing.
7. The method of claim 6,

Each of the plurality of heat dissipation plates,

The first hinge arm of the first heat dissipation plate and the first hinge arm of the second heat dissipation plate adjacent to the first heat dissipation plate are rotatably coupled;

a second hinge arm of the second heat dissipation plate is rotatably coupled to a second hinge arm of a third heat dissipation plate adjacent to the second heat dissipation plate;

An electronic device in which a first hinge arm of the third heat dissipation plate is rotatably coupled to a first hinge arm of a fourth heat dissipation plate adjacent to the third heat dissipation plate.
8. The method of claim 7,

Each of the plurality of heat dissipation plates is rotatably coupled to each other through a hinge shaft coupled to pass through the first hinge arm and the second hinge arm.
9. The method of claim 8,

a first plurality of guide rollers rotatably disposed at both ends of the hinge shaft in a portion to which the first hinge arms of the heat dissipation plate are coupled;

The plurality of first guide rollers are disposed to be movable along the first guide slit.
10. The method of claim 9,

The diameter of each of the first plurality of guide rollers is gradually reduced in a direction in which the plurality of heat dissipation plates are expanded.
11. The method of claim 10,

In the first guide slit, a step portion is formed such that a guide width becomes smaller in a direction in which the plurality of heat dissipation plates are expanded,

The first plurality of guide rollers are sequentially interrupted through the step portion, so that the heat dissipation plate is sequentially expanded.
10. The method of claim 9,

a second guide rail spaced parallel to the first guide rail at a predetermined interval and including a second guide slit; and

a second plurality of guide rollers rotatably disposed at both ends of the hinge shaft in a portion to which the second hinge arms of the heat dissipation plate are coupled;

The plurality of second guide rollers are disposed to be movable along the second guide slit of the second guide rail.
13. The method of claim 12,

Each of the plurality of heat dissipation plates includes a length compensation structure for compensating for length changes due to expansion and contraction.
14. The method of claim 13,

Each of the plurality of heat dissipation plates includes a first sub-plate and a second sub-plate,

and the length compensating structure includes a plate housing configured to flow freely between the first sub-plate and the second sub-plate.
15. The method of claim 14,

and an elastic member disposed in the plate housing and configured to press the first sub-plate and the second sub-plate to the outside.