WO2022061724A1 - Structure d'alimentation, antenne et dispositif de communication - Google Patents

Structure d'alimentation, antenne et dispositif de communication Download PDF

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Publication number
WO2022061724A1
WO2022061724A1 PCT/CN2020/117784 CN2020117784W WO2022061724A1 WO 2022061724 A1 WO2022061724 A1 WO 2022061724A1 CN 2020117784 W CN2020117784 W CN 2020117784W WO 2022061724 A1 WO2022061724 A1 WO 2022061724A1
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WO
WIPO (PCT)
Prior art keywords
conductive film
feeding
protective layer
film
sheet
Prior art date
Application number
PCT/CN2020/117784
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English (en)
Chinese (zh)
Inventor
陈亮
曹菊鹏
谢国庆
邸允会
余彦民
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN202080103372.0A priority Critical patent/CN115943527A/zh
Priority to PCT/CN2020/117784 priority patent/WO2022061724A1/fr
Publication of WO2022061724A1 publication Critical patent/WO2022061724A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means

Definitions

  • the embodiments of the present application relate to the field of communication technologies, and in particular, to a feeding structure, an antenna, and a communication device.
  • the feeding structure of the thin film antenna includes: a dielectric plate, a conductive film (conductive film, CF) disposed on the dielectric plate, and a feeding unit, and the feeding unit is used for feeding the conductive film.
  • a conductive film conductive film, CF
  • the feeding unit of the thin-film antenna is usually connected to other parts by welding.
  • the conductive film of the thin-film antenna is easily deformed and melted by heat during high-temperature welding, which adversely affects the performance of the antenna.
  • the embodiments of the present application provide a feeding structure, an antenna and a communication device, which solve the problem that the thin-film antenna is susceptible to thermal deformation during assembly.
  • a feeding structure including: a dielectric plate, the dielectric plate includes a first surface and a second surface opposite to each other; a first conductive film, the first conductive film is disposed on the dielectric plate a first surface; a feeding unit, the feeding unit is arranged on the first surface of the dielectric plate, the feeding unit is used to feed the first conductive film; a first protective layer, the first protective layer is arranged on the first surface Between the feeding unit and the first conductive film, the first protective layer is used to separate the feeding unit and the first conductive film, so that the feeding unit is coupled and connected to the first conductive film.
  • the feeding unit can be separated from the first conductive film by the first protective layer, so that the feeding unit can transmit the radio frequency signal to the first conductive film circuit by means of coupling feeding, avoiding the need for welding
  • the first conductive film is deformed and melted by heat, which improves the stability of the feeding structure.
  • the surface is smoother, and the oxidation of the first conductive film can also be avoided.
  • the feeding structure further includes: a grounding unit and a second conductive film, the second conductive film is coupled and connected to the grounding unit, and the second conductive film is coupled and connected to the first conductive film. Therefore, the connection instability caused by the direct connection between the second conductive film and the first ground unit is avoided, and the stability of the electrical connection is improved.
  • the second conductive film is disposed on the second surface of the dielectric plate, and a surface of the second conductive film away from the dielectric plate is covered with a second protective layer.
  • the second protective layer can protect the second conductive film and prevent the first conductive film from being oxidized or scratched.
  • the second conductive film is disposed between the first surface of the dielectric plate and the first conductive film, and a second protection film is provided between the second conductive film and the first conductive film Floor.
  • the second protective layer can separate the second conductive film and the first conductive film, so that the second conductive film and the first conductive film are coupled and connected.
  • the second protective layer is also used to protect the second conductive film to prevent the first conductive film from being oxidized or scratched.
  • a gap is provided on the second conductive film and the second protective layer, and the first conductive film and the first protective layer are provided in the gap. Therefore, the first conductive film and the first protective layer are disposed in the gap between the second conductive film and the second protective layer, which saves space and facilitates miniaturization of the product. At the same time, the surface of the feeding structure is made flatter.
  • the first protective layer or the second protective layer adopts: polyethylene terephthalate film PET, polyimide film PI, cycloolefin polymer film COP/COC, At least one of polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, and polyethylene naphthalate film PEN.
  • the feeding unit further includes a cable and a mounting member
  • the cable includes a ground conductor
  • the mounting member includes: a clamping portion disposed close to the second surface of the dielectric board; the clamping portion The second conductive film is coupled and connected to the clamping portion. Thereby, the first conductive film can be coupled to ground through the second conductive film, the clamping portion and the ground conductor in sequence.
  • the feeding unit includes a feeding sheet
  • the cable further includes a feeding wire
  • the feeding wire is electrically connected to the feeding sheet
  • the feeding sheet is disposed on the first protective layer away from the power feeding sheet.
  • the surface of the first conductive film; the feeding unit for coupling and feeding the first conductive film includes: the feeding line is used for feeding the feeding sheet, and the feeding sheet is used for coupling to the first conductive film feed. Thereby, the feeding line can couple the feeding to the first conductive film through the feeding sheet.
  • the feeding structure further includes: a connecting piece; wherein, the feeding piece, the dielectric plate, and the mounting piece are provided with connecting holes adapted to the connecting piece, and the connecting piece is in turn
  • the connecting member is detachably connected to the feeding sheet, the dielectric plate and the mounting member through the connecting hole of the feeding sheet, the medium plate and the mounting member.
  • the feed plate includes a third surface close to the first protective layer, and a fourth surface opposite to the third surface; conductors are provided on both the third surface and the fourth surface , the feed line is electrically connected to the conductor on the fourth surface, and the conductor on the third surface is electrically connected to the conductor on the fourth surface through metallized through holes;
  • a conductive film coupling and feeding includes: the feeding sheet is used for coupling and feeding the first conductive film through a conductor arranged on the third surface.
  • the feed line can feed the conductors on the fourth surface of the feed strip, the feed strip can transmit signals through the metallized through holes to the conductors on the third surface, and through the conductors on the third surface to the first surface
  • the conductive film is coupled to the feeding, so the feeding line only needs to be connected to the conductor on the fourth surface of the feeding sheet, which reduces the installation difficulty of the feeding line.
  • the feed line and the ground conductor are arranged coaxially, and an insulating material is provided between the ground conductor and the feed line. Accordingly, the feed line and the ground conductor are coaxially arranged, and space can be saved.
  • the first conductive film or the second conductive film includes at least one of metal grids, metal nanowires, carbon nanotubes, graphene, and metal oxides.
  • an antenna in a second aspect of the embodiments of the present application, the antenna includes: a radiating element and the above-mentioned feeding structure, where the feeding structure is electrically connected to the radiating element. Therefore, the antenna adopts the above-mentioned feeding structure, and has the same technical effect as the feeding structure provided in the foregoing embodiment, which will not be repeated here.
  • a communication device including a radio frequency module and the above-mentioned antenna unit, wherein the radio frequency module and the antenna unit are electrically connected. Therefore, the communication device adopts the above-mentioned antenna unit, and has the same technical effect as the feeding structure provided in the foregoing embodiment, which will not be repeated here.
  • FIG. 1 is a schematic structural diagram of a communication device provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of an antenna provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a disassembled structure of a feed structure provided by an embodiment of the present application.
  • Fig. 3a is the structural schematic diagram of the feeding structure in Fig. 3;
  • Figure 3b is a schematic structural diagram of the mounting member in Figure 3;
  • Fig. 4 is the top view of the feeding structure in Fig. 3;
  • FIG. 5 is a schematic diagram of a disassembled structure of another feeding structure provided by an embodiment of the present application.
  • Fig. 5a is the structural schematic diagram of the feeding structure in Fig. 5;
  • Figure 5b is a schematic structural diagram of the mounting member in Figure 5;
  • FIG. 6 is a top view of the feeding structure in FIG. 5 .
  • orientation terms such as “upper” and “lower” are defined relative to the orientation in which the components in the drawings are schematically placed. It should be understood that these directional terms are relative concepts, and they are used for relative In the description and clarification of the drawings, it may change correspondingly according to the change of the orientation in which the components are placed in the drawings.
  • connection should be understood in a broad sense.
  • connection may be a fixed connection, a detachable connection, or an integrated body; it may be directly connected, or Can be indirectly connected through an intermediary.
  • coupled connection may be a connection that enables signal transmission.
  • PCB printed circuit board
  • Coupling refers to the phenomenon that there is no physical contact between the input and output of two or more circuit elements or electrical networks, but influence each other, and transmit energy from one side to the other through interaction.
  • the communication device 0001 includes, for example, an antenna 02 .
  • the communication device 0001 provided in this embodiment of the present application can be applied to electronic devices with wireless communication functions, such as cellular base station devices, wireless local area network (WLAN) devices, automotive electronic devices, and Internet of Things (IOT) devices.
  • wireless communication functions such as cellular base station devices, wireless local area network (WLAN) devices, automotive electronic devices, and Internet of Things (IOT) devices.
  • WLAN wireless local area network
  • IOT Internet of Things
  • the communication device also includes a radio frequency module (Radio Frequency module, AF module) 03.
  • the radio frequency module 03 is electrically connected to the antenna 02 , and the radio frequency module 03 is used for sending and receiving electromagnetic signals to the antenna 02 through the feeding point 01 .
  • the antenna 02 radiates electromagnetic waves according to the received electromagnetic signals or sends electromagnetic signals to the radio frequency module 03 according to the received electromagnetic waves, so as to realize the sending and receiving of wireless signals.
  • the radio frequency module (03 is a transceiver (transmitter and/or receiver, T/R) and other circuits that can transmit and/or receive radio frequency signals.
  • FIG. 2 is a schematic structural diagram of an antenna provided by an embodiment of the present application.
  • the antenna 02 includes: a feeding structure 001 and a radiating element 002.
  • the feeding structure 001 and the radiation unit 002 are electrically connected, and the feeding structure 001 is used to feed the radiation unit 002, so that the radiation unit 002 radiates or receives electromagnetic waves.
  • FIG. 3 is a schematic diagram of a disassembled structure of a feeding structure provided by an embodiment of the present application
  • FIG. 3 a is a schematic structural diagram of the feeding structure in FIG. 3
  • FIG. 3b is a schematic structural diagram of the mounting member in FIG. 3
  • FIG. 4 is a top view of the feeding structure in FIG. 3 .
  • the power feeding structure 001 includes: a dielectric plate 10 , a first conductive film 20 and a power feeding unit 40 .
  • the dielectric plate 10 includes, for example, an opposite first surface a1 and a second surface a2.
  • first surface a1 is, for example, the upper surface of the dielectric board 10
  • second surface a2 is, for example, the lower surface of the dielectric board 10
  • first and the second are relative concepts, which can be Variations occur according to changes in the orientation of the components in the drawings.
  • the first conductive film 20 is disposed on, for example, the first surface a1 of the dielectric plate 10 .
  • the first conductive film 20 may be a feeding strip line disposed on the first surface a1. Combining the structure of the antenna shown in FIG. 2 and the feeding structure shown in FIG. On the first surface a1 and connected to the first conductive film 20 , the first conductive film 20 can be used to feed the radiation element 002 .
  • the dielectric plate 10 may be polymer, glass, or filled with gas.
  • the power feeding unit 40 is used for feeding power to the first conductive film 20 .
  • the embodiment of the present application does not limit the material structure of the first conductive film 20.
  • the material structure of the first conductive film 20 includes: at least one of metal grids, metal nanowires, carbon nanotubes, graphene, and metal oxides A sort of.
  • the material structure of the first conductive film 20 when it is a metal mesh, it may be a copper mesh, a silver mesh, or a nickel alloy mesh, etc., which have better electrical conductivity than other material structures.
  • a conductive adhesive or a conductive double-sided tape is used at the contact point between the feeding unit 40 and the first conductive film 20 to connect and conduct the feeding unit 40 and the first conductive film 20, but the contact point is The connection at the point is unstable, and the degradation of passive intermodulation (PIM) characteristics is prone to occur.
  • PIM passive intermodulation
  • PIM refers to the characteristics of passive components such as connectors, feeders, filters, etc., which work under the condition of high-power signals with multiple carrier frequencies due to the nonlinearity of the components themselves. Passive intermodulation is caused by many factors, including: poor mechanical contact.
  • the first conductive film 20 is crimped on the feeding unit 40 , and the conductive surface of the first conductive film 20 is electrically connected to the feeding unit 40 .
  • the contact feeding method in which the conductive surfaces are directly crimped is adopted, which avoids the melting of the first conductive film 20 caused by the welding connection method, and reduces the assembly difficulty of the thin film antenna.
  • the surface flatness of the directly crimped feeding structure 001 is difficult to control, and the anti-oxidation effect is not good, so it is not suitable for mass production and long-term use.
  • the embodiment of the present application further improves the feeding structure 001 .
  • the feeding structure 001 further includes: a first protective layer 201, the first protective layer 201 is located between the feeding unit 40 and the first conductive film 20, the first protective layer 201 is made of insulating material, for example.
  • the first protective layer 201 is used to separate the feeding unit 40 from the first conductive film 20 , so that the feeding unit 40 and the first conductive film 20 are coupled and connected.
  • the vertical projection of the feeding unit 40 on the dielectric plate 10 intersects the first conductive film 20 , and the feeding unit 40 can couple and feed the first conductive film 20 during operation.
  • the embodiment of the present application does not limit the material of the first protective layer 201 , and the first protective layer 201 is, for example, an insulating material.
  • the material of the first protective layer 201 can be polyethylene terephthalate film PET, polyimide film PI, cyclic olefin polymer film COP/COC, polycarbonate film PC, polyethylene film PE, polychlorinated At least one of vinyl film PVC and polyethylene naphthalate film PEN.
  • the first conductive film 20 can be connected to the dielectric board 10 by, for example, crimping, and the first protective layer 201 can be connected to the first conductive film, for example, by crimping.
  • the first protective layer 201 can also be used to protect the first conductive film 20 to prevent the first conductive film 20 from being oxidized or scratched.
  • the crimping refers to a connection produced by mechanically pressing the first conductive film 20 or the first protective layer 201 with a manual or automatic special crimping tool.
  • the feeding unit 40 can be separated from the first conductive film 20 by the first protective layer 201 , so that the feeding unit 40 can transmit the radio frequency signal to the first conductive film 20 by coupling feeding.
  • the performance is more stable, the first conductive film 20 is prevented from being deformed and melted by heat due to the welding connection method, the assembly difficulty of the feeding structure 001 is reduced, and the stability of the feeding structure 001 is improved.
  • the first protective layer 201 by providing the first protective layer 201, the surface is more flat, and the oxidation of the first conductive film 20 can also be avoided.
  • the feeding structure 001 further includes: a ground unit and a second conductive film 30 , the second conductive film 30 is coupled and connected to the ground unit, and the second conductive film 30 is connected to the first conductive film 20 Coupling connection.
  • the embodiments of the present application do not limit the structure of the grounding unit.
  • the grounding unit includes: a mounting member 50 and a grounding conductor 4022 .
  • the second conductive film 30 is a grounding plate disposed on the surface of the dielectric plate 10 for realizing a grounding function. During operation, the second conductive film 30 is coupled and connected to the mounting member 50 of the grounding unit, and grounding can be achieved through the grounding unit.
  • the second conductive film 30 and the first conductive film 20 use the same structure.
  • This embodiment of the present application does not limit the position of the second conductive film 30 .
  • the second conductive film 30 is disposed on the second surface a2 of the dielectric board 10 , and the surface of the second conductive film 30 away from the dielectric board 10 is covered with The second protective layer 301 .
  • the second protective layer 301 can be made of insulating material, and the second protective layer 301 is used to protect the second conductive film 30 to prevent the second conductive film 30 from being oxidized or scratched.
  • the second protective layer 301 can be made of the same material as the first protective layer 201
  • the material of the second protective layer 301 can be made of the following materials At least one: polyethylene terephthalate film PET, polyimide film PI, cycloolefin polymer film COP/COC, polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, poly ethylene naphthalate film PEN.
  • the second protective layer 301 can be connected to the second conductive film 30 by, for example, crimping.
  • the second conductive film 30 is disposed between the first surface a1 of the dielectric plate 10 and the first conductive film 20 , and the second conductive film 30 and the A second protective layer 301 is provided between the first conductive films 20 .
  • the second protective layer 301 is used to separate the second conductive film 30 from the first conductive film 20 , so that the second conductive film 30 and the first conductive film 20 are coupled and connected.
  • the second protective layer 301 is also used to protect the second conductive film 30 to prevent the second conductive film 30 from being oxidized or scratched.
  • the second conductive film 30 is disposed between the first surface a1 of the dielectric plate 10 and the first conductive film 20 , the second conductive film 30 and the first conductive film 30 A second protective layer 301 is disposed between a conductive film 20, a gap 3011 is formed on the second conductive film 30 and the second protective layer 301, and the first conductive film 20 and the first protective layer 201 are disposed in the gap 3011.
  • the first conductive film 20 and the first protective layer 201 are arranged in the gap 3011 , which saves space and improves the flatness of the surface of the feeding structure 001 .
  • both the first conductive film 20 and the second conductive film 30 are disposed on the first surface a1 of the dielectric plate 10 , the second conductive film 30 is provided with a gap 3011 , and the first conductive film 20 is disposed in the gap 3011 , and the first conductive film 20 may not completely fill the gap 3011 , and the first conductive film 20 is coupled to the second conductive film 30 .
  • the grounding unit is coupled and connected to the second conductive film 30 to avoid thermal deformation and melting of the second conductive film 30 caused by the welding connection method, thereby reducing the assembly difficulty of the feeding structure 001 and improving the The stability of the feeding structure 001 is improved.
  • the second protective layer 301 by providing the second protective layer 301, the surface is more flat, and the oxidation of the second conductive film 30 can also be avoided.
  • the mounting member 50 includes: a clamping part disposed close to the second surface a2 of the dielectric board 10, for example, the first clamping part 51 and The second clamping portion 52 .
  • the mounting member 50 includes a base 504, and the first clamping portion 51 and The second clamping portion 52 .
  • the first clamping portion 51 and the second clamping portion 52 are arranged in sequence along the Y axis, and a groove 505 is provided between the first clamping portion 51 and the second clamping portion 52.
  • the second conductive film 30, The second protective layer 301 , the feeding sheet 401 , and the dielectric plate 10 are provided with protrusions adapted to the groove 505 , when the second conductive film 30 , the second protective layer 301 , the feeding Sheet 401, and after the dielectric board 10 is assembled with the mounting member 50, the second conductive film 30, the second protective layer 301, the feeding sheet 401, and the protrusions of the dielectric board 10 are located in the clamping portion.
  • the second conductive film 30 , the second protective layer 301 , the feeding sheet 401 , and the dielectric plate 10 are prevented from moving relative to the mounting member 50 along the Y-axis direction.
  • the longitudinal section (XZ plane) of the first clamping part 51 and the second clamping part 52 is an L-shaped structure, and the "_" part 502 of the L-shaped structure is parallel to the X-axis for supporting the medium board 10.
  • the "1" part 503 of the L-shaped structure is parallel to the Z axis, and the "_" part 502 of the L-shaped structure and the "1" part 503 of the L-shaped structure are both protrusions arranged on the base 504.
  • the height of the "1" part 503 of the L-shaped structure in the Z-axis direction is greater than the height of the "_" part 502 of the L-shaped structure in the Z-axis direction.
  • the second conductive film 30 , the second protective layer 301 , the feeding sheet 401 , and the dielectric board 10 are provided with concave parts adapted to the “1” portion 503 .
  • the "1" portion 503 of the L-shaped structure is located in the second conductive film 30, the second protective layer 301, the feeding sheet 401, and the concave portion of the dielectric board 10, to further prevent the dielectric board 10 from facing the dielectric board 10.
  • the mount 50 moves in the Y-axis direction.
  • the "_" part 502 of the first clamping part 51 and the second clamping part 52 is provided with a connecting hole 501 matching with the connecting piece 60 in FIG. 3a.
  • the “1” portion 503 of the first clamping portion 51 is provided with a groove 506 , and the groove 506 is used for fixing the cable 40 .
  • the projection of the mounting member 50 on the YZ plane is an "I"-shaped structure.
  • the mounting member 50 includes a base 504, and The first clamping portion 51 and the second clamping portion 52 provided on the base 504 .
  • the mounting member 50 in FIG. 5 b has a first top plate 507 and a second top plate 508 added.
  • first top plate 507 is provided on the top of the first clamping portion 51
  • second top plate 508 is provided on the top of the second clamping portion 52 .
  • the first clamping portion 51 and the second clamping portion 52 are arranged in sequence along the Y axis, and a groove 505 is provided between the first clamping portion 51 and the second clamping portion 52.
  • the second conductive film 30, The second protective layer 301 , the feeding sheet 401 , and the dielectric plate 10 are provided with protrusions adapted to the groove 505 , when the second conductive film 30 , the second protective layer 301 , the feeding The second conductive film 30 , the second protective layer 301 , the feeding sheet 401 , and the protrusions of the dielectric board 10 are located in the clamping portion In the formed groove 505 , the second conductive film 30 , the second protective layer 301 , the feeding sheet 401 , and the dielectric plate 10 are prevented from moving relative to the mounting member 50 along the Y-axis direction.
  • the longitudinal section (XZ plane) of the first clamping part 51 and the second clamping part 52 is an L-shaped structure, and the "_" part of the L-shaped structure is parallel to the X axis for supporting the medium board 10.
  • the L-shaped structure is The "1" part of the structure is parallel to the Z axis, and the "_" part of the L-shaped structure and the "1” part of the L-shaped structure are both protrusions disposed on the base 504.
  • the height of the "1" part of the L-shaped structure in the Z-axis direction is greater than the height of the "_" part of the L-shaped structure in the Z-axis direction.
  • the first top plate 507 is disposed on the top of the “1” part of the first clamping part 51 and is parallel to the “_” part of the first clamping part 51 .
  • the second top plate 508 is disposed at the top of the “1” part of the second clamping part 52 and is parallel to the “_” part of the second clamping part 52 .
  • the first top plate 507 and the second top plate 508 are provided with connection holes 5011
  • the first clamping portion 51 and the second clamping portion 52 are provided with connection holes 501 .
  • the first top plate 507 is further provided with a groove 506 , and the groove 506 is used for fixing the cable 40 .
  • the ground conductor 4022 is electrically connected to the clamping portion, the clamping portion is coupled and connected to the second conductive film 30 , and the second conductive film 30 is coupled and connected to the first conductive film 20 and the radiation unit 002 .
  • the radiation unit 002 may be coupled to ground through the second conductive film 30 , the mount 50 and the ground conductor 4022 .
  • the power feeding unit 40 includes: a power feeding sheet 401 and a power feeding line 4021 .
  • the feeding line 4021 is electrically connected to the feeding sheet 401, the feeding sheet 401 is disposed on the side of the first protective layer 201 away from the first conductive film 20, and the feeding wire 4021 is used for feeding the feeding sheet 401.
  • 401 is used for feeding, and the feeding sheet 401 is used to couple and feed the first conductive film 20 .
  • the present application does not limit the structure of the feed line 4021 and the ground conductor 4022, and the feed line 4021 and the ground conductor 4022 may be in the form of coaxial wire, metal sheet, strip wire, flat wire, and the like.
  • the feed line 4021 and the ground conductor 4022 are coaxially arranged, wherein the ground conductor 4022 is arranged outside the feed line 4021, and insulation is provided between the ground conductor 4022 and the feed line 4021 Material.
  • the feeding sheet 401 adopts a printed circuit board (PCB), and the feeding sheet 401 includes a third surface a3 close to the first protective layer 201 , and a fourth surface a4 opposite to the third surface a3 of the feeding sheet 401 .
  • PCB printed circuit board
  • conductors 4012 are provided on the third surface a3 and the fourth surface a4 of the feeding sheet 401.
  • the feeding wire 4021 is electrically connected to the conductor 4012 on the fourth surface a4 of the feeding sheet 401, and the feeding sheet 401
  • the conductors 4012 on the third surface a3 are electrically connected to the conductors 4012 on the fourth surface a4 of the feed plate 401 through metallized vias.
  • the feeding line 4021 is used for feeding the feeding sheet 401
  • the feeding sheet 401 is used for coupling and feeding the first conductive film 20 through the conductor 4012 arranged on the third surface a3 of the feeding sheet 401 .
  • the embodiment of the present application does not limit the shape of the conductor 4012, and the shape of the surface of the conductor may be various shapes such as circle, square, and ring.
  • the feed line 4021 is connected to the feed plate 401 by welding, and the ground conductor 4022 is connected to the mounting member 50 by welding.
  • the feeding structure 001 further includes: a connecting member 60 .
  • the feeding piece 401 is provided with a first connection hole 4011 adapted to the connection piece 60
  • the dielectric plate 10 is provided with a second connection hole 101 adapted to the connection piece 60
  • the mounting piece 50 is provided with a second connection hole 101
  • the connecting piece 60 is passed through the first connecting hole 4011, the second connecting hole 101 and the third connecting hole 501 in sequence.
  • the electrical sheet 401 , the dielectric board 10 and the mounting member 50 are detachably connected.
  • the connecting member 60 can be a screw, which is used to fasten the feeding piece 401 , the dielectric board 10 and the mounting member 50 .
  • the screws can be metal, plastic, or other forms of press fit.
  • the mounting member 50 and the feeding sheet 401 are fixed on the dielectric board 10 through the connecting member 60 , the first conductive film 20 and the first protective layer 201 are clamped by the feeding sheet 401 and the dielectric board 10 , the second The conductive film 30 and the second protective layer 301 are sandwiched by the mounting member 50 and the dielectric board 10 .
  • the feed structure 001 provided by the present application will be specifically described below with reference to Example 1 and Example 2.
  • the feeding structure 001 includes: a feeding sheet 401 , a first protective layer 201 , a first conductive film 20 , a dielectric plate 10 , a first protective layer 201 , a first conductive film 20 , a Two conductive films 30 and a second protective layer 301 .
  • the first conductive film 20 is crimped on the first surface a1 of the dielectric board 10
  • the first protective layer 201 is crimped on the first conductive film 20 .
  • the first conductive film 20 is disposed at the middle position of the first surface a1, the length of the first conductive film 20 in the X direction is the same as the length of the dielectric plate 10, and the width of the first conductive film 20 in the Y direction is smaller than the width of the dielectric plate.
  • the second conductive film 30 is disposed on the second surface a2 of the dielectric plate 10 , and the second protective layer 301 is crimped on the second conductive film 30 .
  • the second conductive film 30 completely covers the second surface a2, the length of the second conductive film 30 in the X direction is equal to the length of the dielectric plate 10, and the width of the second conductive film 30 in the Y direction is equal to the width of the dielectric plate.
  • the first protective layer 201 is located between the feeding unit 40 and the first conductive film 20 , and the first protective layer 201 is made of insulating material, for example.
  • the first protective layer 201 is used to separate the feeding unit 40 from the first conductive film 20 , so that the feeding unit 40 and the first conductive film 20 are coupled and connected.
  • the second protective layer 301 can be made of insulating material, and the second protective layer 301 is used to protect the second conductive film 30 to prevent the first conductive film 20 from being oxidized or scratched.
  • the feeding structure 001 further includes: a connecting member 60 and a mounting member 50 disposed close to the second surface a2 of the dielectric board 10 . As shown in FIG. 3 , there are two connecting members 60 .
  • the feeding piece 401 is provided with a first connection hole 4011 adapted to the connector 60
  • the dielectric board 10 is provided with a second connection hole 101 adapted to the connector 60
  • the mounting member 50 is provided with a connector 60 .
  • the third connecting hole 501 is adapted to 60 .
  • the connector 60 passes through the first connecting hole 4011 , the second connecting hole 101 and the third connecting hole 501 in sequence, so that the first conductive film 20 and the first protective layer 201 between the mounting component 50 and the dielectric board 10 are formed.
  • the feeding piece 401 and the dielectric board 10 are tightly fixed, so that the second conductive film 30 and the second protective layer 301 between the mounting member 50 and the dielectric board 10 are tightly fixed by the mounting member 50 and the dielectric board 10 .
  • the connecting member 60 is a bolt
  • the first connecting hole 4011 , the second connecting hole 101 and the third connecting hole 501 are bolt holes adapted to the bolt
  • the connecting member 60 is connected to the first connecting hole 4011
  • the second connection hole 101 and the third connection hole 501 are detachably connected through threads.
  • the feeding structure 001 further includes: a cable 40
  • the cable 40 includes: a coaxially arranged feeding line 4021 and a ground conductor 4022 , wherein the feeding line 4021 is electrically connected to the feeding sheet 401 , the feeding line 4021 is used for feeding the feeding sheet 401 , and the feeding sheet 401 is used for coupling and feeding the first conductive film 20 .
  • the ground conductor 4022 is electrically connected to the mounting member 50 , and the second conductive film 30 is coupled and connected to the clamping portion of the mounting member 50 .
  • the feeding sheet 401 includes a third surface a3 close to the first protective layer 201 , and a fourth surface a4 opposite to the third surface a3 of the feeding sheet 401 .
  • conductors 4012 are provided on the third surface a3 and the fourth surface a4 of the feeding sheet 401.
  • the feeding wire 4021 is electrically connected to the conductor 4012 on the fourth surface a4 of the feeding sheet 401, and the feeding sheet 401
  • the conductors 4012 on the third surface a3 are electrically connected to the conductors 4012 on the fourth surface a4 of the feed plate 401 through metallized vias.
  • the feeding line 4021 is used for feeding the feeding sheet 401
  • the feeding sheet 401 is used for coupling and feeding the first conductive film 20 through the conductor 4012 arranged on the third surface a3 of the feeding sheet 401 .
  • the feeding line 4021 can transmit radio frequency signals to the feeding sheet 401. Since the first protective layer 201 is provided between the feeding sheet 401 and the first conductive film 20, and the first protective layer 201 is insulated, the feeding sheet 401 is insulated. 401 transmits the radio frequency signal to the circuit of the first conductive film 20 by means of coupling and feeding.
  • the mounting member 50 is grounded through the ground conductor 4022, the second conductive film 30 is coupled to the mounting member 50, and the first conductive film 20 is coupled to the second conductive film 30, so that the first conductive film 20 can be coupled to ground.
  • the feeding structure 001 can be detachably connected to each part of the structure through the connector, so as to realize the coupled feeding method and the coupled grounding method.
  • the connection performance is more stable, and the use of welding is avoided at the same time.
  • the connection method caused the first conductive film 20 to be deformed and melted by heat.
  • the assembly difficulty of the feeding structure 001 is reduced, the stability of the feeding structure 001 is improved, and in addition.
  • the surface of the first protective layer 201 By setting the surface of the first protective layer 201 to be more flat, the oxidation of the first conductive film 20 can also be avoided.
  • the feeding structure 001 includes: a feeding sheet 401 , a second protective layer 301 , a second conductive film 30 and a dielectric plate 10 that are stacked along the Z-axis direction.
  • a gap 3011 is provided between the second protective layer 301 and the second conductive film 30, the first conductive film 20 and the first protective layer 201 are located in the gap 3011, and the first conductive film 20 does not completely fill the gap 3011, The first conductive film 20 is coupled to the second conductive film 30 .
  • the second conductive film 30 is disposed on the first surface a1 of the dielectric board 10 , and the second protective layer 301 is crimped on the second conductive film 30 .
  • the length of the second conductive film 30 in the X direction is equal to the length of the dielectric plate 10
  • the width of the second conductive film 30 in the Y direction is equal to the width of the dielectric plate.
  • a gap 3011 is provided in the middle position of the second protective layer 301 and the second conductive film 30 in the Y direction.
  • the first protective layer 201 is crimped on the first conductive film 20 .
  • the width of the first conductive film 20 and the first protective layer 201 in the Y direction is smaller than the width of the gap 3011 .
  • the first protective layer 201 is located between the feeding unit 40 and the first conductive film 20, and the first protective layer 201 is made of insulating material, for example.
  • the first protective layer 201 is used to separate the feeding unit 40 from the first conductive film 20 , so that the feeding unit 40 and the first conductive film 20 are coupled and connected.
  • the second protective layer 301 is used to separate the second conductive film 30 from the first conductive film 20 , so that the second conductive film 30 and the first conductive film 20 are coupled and connected.
  • the second protective layer 301 is also used to protect the second conductive film 30 to prevent the first conductive film 20 from being oxidized or scratched.
  • the feeding structure 001 further includes: a connecting member 60 and a mounting member 50 disposed close to the second surface a2 of the dielectric board 10 . As shown in FIG. 5 , there are two connecting members 60 .
  • the feeding piece 401 is provided with a first connection hole 4011 adapted to the connector 60
  • the dielectric plate 10 is provided with a second connection hole 101 adapted to the connector 60
  • the mounting member 50 is provided with a connector 60 .
  • 60 is the third connecting hole 501 that fits.
  • the connector 60 passes through the first connection hole 4011 , the second connection hole 101 and the third connection hole 501 in sequence, so that the first conductive film 20 and the first protective layer between the feeding sheet 401 and the dielectric board 10 are 201 is tightly fixed by the feeding piece 401 and the dielectric board 10 , so that the second conductive film 30 and the second protective layer 301 between the mounting member 50 and the dielectric board 10 are tightly fixed by the mounting member 50 and the dielectric board 10 .
  • the connecting member 60 is a bolt
  • the first connecting hole 4011 , the second connecting hole 101 and the third connecting hole 501 are bolt holes adapted to the bolt
  • the connecting member 60 is connected to the first connecting hole 4011 , the second connection hole 101 and the third connection hole 501 are detachably connected through threads.
  • the feeding structure 001 further includes: a cable 40
  • the cable 40 includes: a coaxially arranged feeding line 4021 and a ground conductor 4022 , wherein the feeding line 4021 is electrically connected to the feeding sheet 401 , the feeding line 4021 is used for feeding the feeding sheet 401 , and the feeding sheet 401 is used for coupling and feeding the first conductive film 20 .
  • the ground conductor 4022 is electrically connected to the mounting member 50 , and the second conductive film 30 is coupled to the clamping portion of the mounting member 50 .
  • the feeding sheet 401 includes a third surface a3 close to the first protective layer 201 , and a fourth surface a4 opposite to the third surface a3 of the feeding sheet 401 .
  • conductors 4012 are provided on the third surface a3 and the fourth surface a4 of the feeding sheet 401.
  • the feeding wire 4021 is electrically connected to the conductor 4012 on the fourth surface a4 of the feeding sheet 401, and the feeding sheet 401
  • the conductors 4012 on the third surface a3 are electrically connected to the conductors 4012 on the fourth surface a4 of the feed plate 401 through metallized vias.
  • the feeding line 4021 is used for feeding the feeding sheet 401
  • the feeding sheet 401 is used for coupling and feeding the first conductive film 20 through the conductor 4012 arranged on the third surface a3 of the feeding sheet 401 .
  • the feeding line 4021 can transmit radio frequency signals to the feeding sheet 401. Since the first protective layer 201 is provided between the feeding sheet 401 and the first conductive film 20, and the first protective layer 201 is insulated, the feeding sheet 401 is insulated. 401 transmits the radio frequency signal to the circuit of the first conductive film 20 by means of coupling and feeding.
  • the mounting member 50 is grounded through the ground conductor 4022
  • the second conductive film 30 is coupled to the mounting member 50
  • the first conductive film 20 is coupled to the second conductive film 30 , so that the first conductive film 20 can pass through the second conductive film 30 , the mount 50 and the ground conductor 4022 are coupled to ground.
  • the first conductive film 20 and the first protective layer 201 are disposed in the gap 3011 between the second conductive film 30 and the second protective layer 301 , which saves space and is beneficial to product quality. miniaturization. At the same time, the surface of the feeding structure 001 is made more flat.

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  • Details Of Aerials (AREA)

Abstract

La présente invention concerne une structure d'alimentation, une antenne et un dispositif de communication. La structure d'alimentation comprend : une plaque diélectrique, la plaque diélectrique comprenant une première surface et une seconde surface opposées l'une à l'autre ; un premier film électroconducteur, le premier film électroconducteur étant disposé sur la première surface de la plaque diélectrique ; une unité d'alimentation, l'unité d'alimentation étant disposée sur la première surface de la plaque diélectrique, et l'unité d'alimentation étant utilisée pour alimenter en électricité le premier film électroconducteur ; et une première couche de protection, la première couche de protection étant disposée entre l'unité d'alimentation et le premier film électroconducteur, la première couche de protection faisant appel à un matériau isolant, et la première couche de protection étant utilisée pour séparer l'unité d'alimentation du film électroconducteur, ce qui permet à l'unité d'alimentation d'être couplée et connectée au premier film électroconducteur. Ainsi, l'unité d'alimentation et le premier film électroconducteur peuvent être séparés par le premier film de protection, ce qui permet à l'unité d'alimentation d'être couplée et de fournir de l'électricité au premier film électroconducteur, et stabilise davantage les performances.
PCT/CN2020/117784 2020-09-25 2020-09-25 Structure d'alimentation, antenne et dispositif de communication WO2022061724A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202080103372.0A CN115943527A (zh) 2020-09-25 2020-09-25 馈电结构、天线和通讯设备
PCT/CN2020/117784 WO2022061724A1 (fr) 2020-09-25 2020-09-25 Structure d'alimentation, antenne et dispositif de communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/117784 WO2022061724A1 (fr) 2020-09-25 2020-09-25 Structure d'alimentation, antenne et dispositif de communication

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WO2022061724A1 true WO2022061724A1 (fr) 2022-03-31

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Publication number Priority date Publication date Assignee Title
CN115360497A (zh) * 2022-07-22 2022-11-18 青岛大学 一种柔性可穿戴的超宽带cpw天线及制备方法

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US7358924B2 (en) * 2005-10-07 2008-04-15 Kathrein-Werke Kg Feed network, and/or antenna having at least one antenna element and a feed network
CN101595595A (zh) * 2006-11-15 2009-12-02 皮尔金顿汽车德国有限公司 天线连接器
CN101707290A (zh) * 2009-07-11 2010-05-12 广东通宇通讯设备有限公司 一种耦合式空气传输天线结构
CN102407753A (zh) * 2011-08-25 2012-04-11 福耀玻璃工业集团股份有限公司 一种具有天线功能的夹层玻璃
CN103329344A (zh) * 2010-12-09 2013-09-25 Agc汽车美洲研发公司 具有重叠透明层和邻近外区的天线元件的窗户组件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7358924B2 (en) * 2005-10-07 2008-04-15 Kathrein-Werke Kg Feed network, and/or antenna having at least one antenna element and a feed network
CN101595595A (zh) * 2006-11-15 2009-12-02 皮尔金顿汽车德国有限公司 天线连接器
CN101707290A (zh) * 2009-07-11 2010-05-12 广东通宇通讯设备有限公司 一种耦合式空气传输天线结构
CN103329344A (zh) * 2010-12-09 2013-09-25 Agc汽车美洲研发公司 具有重叠透明层和邻近外区的天线元件的窗户组件
CN102407753A (zh) * 2011-08-25 2012-04-11 福耀玻璃工业集团股份有限公司 一种具有天线功能的夹层玻璃

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115360497A (zh) * 2022-07-22 2022-11-18 青岛大学 一种柔性可穿戴的超宽带cpw天线及制备方法
CN115360497B (zh) * 2022-07-22 2024-04-05 青岛大学 一种柔性可穿戴的超宽带cpw天线及制备方法

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