WO2022056940A1 - Appareil de reconnaissance d'empreintes digitales et dispositif électronique - Google Patents

Appareil de reconnaissance d'empreintes digitales et dispositif électronique Download PDF

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Publication number
WO2022056940A1
WO2022056940A1 PCT/CN2020/116631 CN2020116631W WO2022056940A1 WO 2022056940 A1 WO2022056940 A1 WO 2022056940A1 CN 2020116631 W CN2020116631 W CN 2020116631W WO 2022056940 A1 WO2022056940 A1 WO 2022056940A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
fingerprint
identification device
fingerprint identification
processing unit
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Application number
PCT/CN2020/116631
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English (en)
Chinese (zh)
Inventor
王仁峰
黄新利
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深圳市汇顶科技股份有限公司
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Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2020/116631 priority Critical patent/WO2022056940A1/fr
Publication of WO2022056940A1 publication Critical patent/WO2022056940A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition

Definitions

  • the present application relates to the field of optical fingerprint technology, and more particularly, to a fingerprint identification device and an electronic device.
  • fingerprint identification technology is widely used in mobile terminal design, automotive electronics, smart home and other fields. Consumers have increased functional requirements for various electronic terminal products, and at the same time require the product to be as thin and light as possible. Therefore, the internal structure of electronic products is becoming more and more compact, and the design of fingerprint identification devices is more difficult. Therefore, it is more urgent to miniaturize and reduce the thickness of fingerprint identification devices. , requires the fingerprint identification device to achieve more accurate functions under the condition of occupying a smaller volume of electronic products.
  • Embodiments of the present application provide a fingerprint identification device and an electronic device.
  • the fingerprint identification device has an ultra-thin thickness and good fingerprint identification performance, and can be applied to an electronic device in a space under an ultra-thin screen.
  • a fingerprint identification device used for a middle frame below a display screen of an electronic device, the fingerprint identification device includes: a fingerprint sensor; and an optical component disposed above the fingerprint sensor for guiding through the fingerprint sensor. After the finger above the display screen is reflected or scattered, the fingerprint light signal passing through the display screen enters the fingerprint sensor; the processing unit is arranged on one side of the fingerprint sensor and is used for processing the fingerprint image signal obtained by the fingerprint sensor.
  • the processed fingerprint image signal is used for fingerprint recognition;
  • a circuit board is provided with at least one circuit board window, and at least one of the fingerprint sensor and the processing unit is arranged in the at least one circuit board window, the circuit The board is used to transmit the signals of the fingerprint sensor and the processing unit;
  • the reinforcement board is arranged under the circuit board to support the circuit board, the middle frame of the electronic device is provided with a through hole, and the upper surface of the reinforcement board is The edge region of the middle frame is fixedly connected to the lower surface of the middle frame at the edge region of the through hole, so that the fingerprint sensor and the processing unit are mounted on the through hole of the middle frame through the reinforcing plate and the circuit board.
  • the processing unit and the fingerprint sensor are arranged in the circuit board window of the circuit board, and signal transmission is performed through the circuit board, thereby reducing the thickness of the fingerprint identification device.
  • the signal transmission distance between the processing unit and the fingerprint sensor can be reduced, the signal quality between the two can be improved, and the fingerprint identification effect can be improved.
  • the processing unit is arranged on the middle frame through the circuit board and the reinforcing plate, and is located below the display screen, and it is not necessary to set the reinforcing plate separately for the processing unit, nor does it need to encapsulate the processing unit, Therefore, the thickness space occupied by the processing unit is small, so that the thickness of the entire fingerprint identification device can be reduced.
  • the upper surface of the edge region of the reinforcing plate under the circuit board is fixedly connected to the through holes of the middle frame, which can further compress the entire fingerprint identification device in the The thickness space occupied under the screen makes the fingerprint identification device more convenient and flexible to be installed in the electronic device.
  • a stepped structure is formed at the edge of the through hole on the lower surface of the middle frame, and an edge region of the upper surface of the reinforcing plate is fixedly connected to the stepped surface of the stepped structure.
  • the edge region of the upper surface of the reinforcing plate and the stepped surface of the stepped structure are fixedly connected by double-sided adhesive.
  • the height of the stepped structure is greater than the thickness of the reinforcing plate.
  • the size of the through hole of the middle frame is smaller than the size of the reinforcing plate and larger than the size of the circuit board.
  • the at least one circuit board window is a first circuit board window and a second circuit board window
  • the fingerprint sensor is arranged in the first circuit board window
  • the processing unit is arranged in the window of the second circuit board.
  • each side of the window of the first circuit board is parallel or perpendicular to each side of the fingerprint sensor; and/or, each side of the window of the second circuit board is parallel or perpendicular to the processing each side of the unit.
  • the circuit board is provided with a first pad connected to the fingerprint sensor on the first side of the opening of the first circuit board; the circuit board is provided on the first side of the opening of the second circuit board The side is provided with a second pad connected to the processing unit; the thickness of the circuit board in the area where the first side of the first circuit board is opened, and/or the circuit board is located on the first side of the second circuit board. The thickness of the area where one side is located is smaller than the thickness of the other area of the circuit board.
  • the first edge of the opening of the first circuit board is adjacent to the first edge of the opening of the second circuit board.
  • the at least one circuit board window is a window for the first circuit board
  • the fingerprint sensor is arranged in the window of the first circuit board
  • the processing unit is arranged above the circuit board.
  • each side of the opening of the first circuit board is parallel or perpendicular to each side of the fingerprint sensor.
  • the circuit board is provided with a first pad connected to the fingerprint sensor on the first side of the first circuit board with the window; the circuit board is on the first side of the first circuit board with the window.
  • the thickness of the area where the edge is located is smaller than the thickness of the circuit board in other areas.
  • the circuit board is adjacent to the processing unit on the first side of the window of the first circuit board, and the circuit board is further provided with a connection on the first side of the window of the first circuit board the second pad of the processing unit.
  • the at least one circuit board window is a window for the second circuit board
  • the processing unit is arranged in the window of the second circuit board
  • the fingerprint sensor is arranged above the circuit board.
  • each side of the opening of the second circuit board is parallel or perpendicular to each side of the processing unit.
  • the circuit board is provided with a second pad connected to the processing unit on the first side of the window of the second circuit board, and the circuit board is located on the first side of the window of the second circuit board.
  • the thickness of the area where the edge is located is smaller than the thickness of the circuit board in other areas.
  • the circuit board is adjacent to the fingerprint sensor on the first side of the window of the second circuit board, and the circuit board is further provided with a connection on the first side of the window of the second circuit board the first pad of the fingerprint sensor.
  • the fingerprint identification device further includes: a light-shielding layer in which a first opening window is formed, the first opening window is arranged above the fingerprint sensor, and the first opening window is used for passing the fingerprint light signal to be received by the fingerprint sensor.
  • the optical assembly is located in the first fenestration.
  • a second window is further formed in the light shielding layer, the fingerprint sensor is connected to the top area of the first lead of the circuit board and the processing unit is connected to the top area of the second lead of the circuit board are located in the second opening.
  • the first lead is provided on the first side of the fingerprint sensor
  • the second lead is provided on the first side of the processing unit
  • the first side of the fingerprint sensor is connected with the first lead of the processing unit. Adjacent to one side.
  • the first side of the fingerprint sensor and the first side of the processing unit are parallel to each other.
  • the first lead and/or the second lead are coated with lead protection glue, and the height of the lead protection glue is not greater than 150 ⁇ m.
  • the upper surface of the light shielding layer is not higher than the highest point of the upper surface of the lead protection adhesive, and/or the upper surface of the light shielding layer is not higher than the highest point of the upper surface of the optical component point.
  • the fingerprint identification device further includes: a support layer disposed between the circuit board and the light shielding layer for supporting the light shielding layer; a third window is provided in the support layer, the The fingerprint sensor and the processing unit are arranged in the third opening.
  • the upper surface of the support layer is not higher than the highest point of the upper surface of the optical component, and the upper surface of the support layer is not higher than the upper surface of the processing unit.
  • the fingerprint identification device further includes: a foam layer in which a fourth opening is formed, the fourth opening is arranged above the fingerprint sensor, and the fourth opening is used to pass the fingerprint
  • the light signal is received by the fingerprint sensor, and the area of the fourth window is not smaller than the area of the first window in the light shielding layer.
  • the fourth window is located directly above the optical assembly.
  • the optical component includes: a microlens array; at least one diaphragm layer disposed below the microlens array, and each diaphragm layer of the at least one diaphragm layer is formed with a plurality of through-hole layers.
  • Optical apertures; the microlens array is used for converging the fingerprint optical signal into a plurality of light-passing apertures of the at least one aperture layer, and the fingerprint optical signal is transmitted to the fingerprint sensor through the plurality of light-passing apertures to Perform optical fingerprint imaging.
  • each microlens in the microlens array corresponds to at least one light-passing aperture in each diaphragm layer, and at least one pixel unit in the fingerprint sensor; the fingerprint sensor uses for receiving a fingerprint light signal in at least one direction to acquire a fingerprint image signal of at least one fingerprint image.
  • the fingerprint identification device includes: a plurality of the fingerprint sensors, and the plurality of the fingerprint sensors are arranged side by side above the circuit board to form a fingerprint sensor assembly by splicing; and/or, a plurality of the processing A plurality of the processing units are arranged side by side above the circuit board to form a processing unit assembly by splicing.
  • the distance between the fingerprint identification device and the light-emitting layer of the display screen is less than 600 ⁇ m.
  • an electronic device including: a display screen; a fingerprint identification device as in the first aspect or any possible implementation manner of the first aspect; a middle frame, the middle frame is provided with a through hole, the through hole is The hole is located under the display screen, and the fingerprint identification device is installed in the through hole, so that the fingerprint identification device is arranged under the display screen.
  • the through hole of the middle frame is arranged in the middle area or the lower middle area of the middle frame, so that the fingerprint detection area of the fingerprint identification device is located in the middle position of the display area of the display screen or Lower middle position.
  • FIG. 1 is a schematic cross-sectional view of a fingerprint identification device provided by an embodiment of the present application.
  • FIG. 2 is a schematic top view of the fingerprint identification device in FIG. 1 .
  • FIG. 3 is a schematic cross-sectional view of another fingerprint identification device provided by an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of another fingerprint identification device provided by an embodiment of the present application.
  • FIG. 5 is a schematic top view of the fingerprint identification device in FIGS. 3 and 4 .
  • FIG. 6 is a schematic cross-sectional view of another fingerprint identification device provided by an embodiment of the present application.
  • FIG. 7 is a schematic cross-sectional view of another fingerprint identification device provided by an embodiment of the present application.
  • FIG. 8 is a schematic cross-sectional view of another fingerprint identification device provided by an embodiment of the present application.
  • FIG. 9 is a schematic cross-sectional view of another fingerprint identification device provided by an embodiment of the present application.
  • FIG. 10 is a schematic cross-sectional view of another fingerprint identification device provided by an embodiment of the present application.
  • FIG. 11 is a schematic top view of the fingerprint identification device in FIG. 8 .
  • FIG. 12 is another schematic top view of the fingerprint identification device in FIG. 8 .
  • FIG. 13 is another schematic top view of the fingerprint identification device in FIG. 8 .
  • embodiments of the present application can be applied to optical fingerprint systems, including but not limited to optical fingerprint recognition systems and products based on optical fingerprint imaging.
  • the embodiments of the present application only take the optical fingerprint system as an example for description, but should not be implemented in this application.
  • the examples constitute any limitation, and the embodiments of the present application are also applicable to other systems using optical imaging technology, and the like.
  • the optical fingerprint system provided in the embodiments of the present application can be applied to smart phones, tablet computers, and other mobile terminals with display screens or other electronic devices; more specifically, in the above electronic devices, fingerprint identification
  • the device may specifically be an optical fingerprint device, which may be arranged in a partial area or all areas below the display screen, thereby forming an under-display optical fingerprint system.
  • FIG. 1 shows a schematic cross-sectional view of a fingerprint identification device 100 .
  • the fingerprint identification device 100 is disposed on the middle frame 101 of the electronic device where it is located, and the middle frame 101 is provided with a blind hole 102 , and the fingerprint identification device 100 is disposed in the blind hole 102 and is located in the electronic device. Below the display screen 103 of the device.
  • the middle frame 101 is a frame of the electronic device that is arranged between the display screen 103 and the battery and is used to carry various internal components, including but not limited to the main board, the camera, the cable, various sensors devices, microphones, earpieces, etc.
  • the middle frame 103 may be made of metal or alloy material, or may also be made of plastic material, which is not limited in this embodiment of the present application.
  • the fingerprint identification device 100 may include: an optical component 110 , a fingerprint sensor 120 and a circuit board 130 .
  • the optical component 110 is used to guide the fingerprint light signal passing through the display screen to enter the fingerprint sensor 120 after being reflected or scattered by the finger above the display screen, so as to form a fingerprint image of the finger.
  • the light source signal emitted to the finger above the display screen 103 can be derived from the self light source of the display screen 103, for example, an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screen or a Micro-LED (Micro-LED) ) light source of the display unit in the display.
  • OLED Organic Light-Emitting Diode
  • Micro-LED Micro-LED
  • the light source signal emitted to the finger above the display screen may also be other built-in light sources or external light sources, such as infrared light sources or light sources with specific wavelengths of invisible light, etc.
  • the display screen may be a liquid crystal Displays or other passively illuminated displays.
  • the optical assembly 110 may include: the microlens array 111 shown in FIG. 1 and a diaphragm layer 112 disposed under the microlens array 111 .
  • the microlens array 111 includes a plurality of microlenses, and each microlens is used for condensing the light signal above it and transmitting it to the diaphragm layer below it.
  • the diaphragm layer 112 is made of a light absorbing material, and is provided with a plurality of light-passing holes, which are used to select the direction of the light signal after the microlens converges, so that the light signal in the target direction passes through the light-passing hole.
  • the light hole enters the fingerprint sensor 120, and the stray light signal in the non-target direction is absorbed by the light absorbing material not passing through the area where the small hole is located, thereby preventing the stray light signal from interfering with fingerprint imaging.
  • the fingerprint sensor 120 includes a pixel array formed by a plurality of pixel units, and is used to convert the light signal passing through the diaphragm layer 112 into a corresponding image signal.
  • the fingerprint sensor 120 may be a fingerprint sensor chip fabricated by a semiconductor process, and the optical component 110 may be integrally packaged in the fingerprint sensor chip, or may be independently disposed above the fingerprint sensor chip.
  • the fingerprint sensor 120 is connected to the circuit board 130 through an electrical connector 131, so as to realize the electrical connection between the fingerprint sensor 120 and the circuit board 130.
  • the electrical connector 131 includes but is not limited to wire bonding. , WB) method, which can also be any other type of electrical connector in the related art, such as through silicon via (through silicon via, TSV), etc., which is not specifically limited in this application.
  • circuit board 130 includes, but is not limited to, a printed circuit board (printed circuit board, PCB), a flexible printed circuit (FPC), or a rigid-flex board, etc., which is not specifically limited in this embodiment of the present application.
  • PCB printed circuit board
  • FPC flexible printed circuit
  • rigid-flex board etc.
  • FIG. 2 shows a schematic top view of the fingerprint identification device 100 in FIG. 1 .
  • the circuit board 130 is provided with a microcontroller unit (MCU) 131 for receiving and processing the fingerprint image signal of the fingerprint sensor 120 to detect and identify the fingerprint image.
  • MCU microcontroller unit
  • circuit board 130 is also provided with a connector 132 for connecting the circuit board 130 to other electrical components of the electronic device, for example, to a central processing unit (CPU) of the electronic device to control the Operation of the fingerprint recognition device 100 .
  • CPU central processing unit
  • circuit board 130 is further provided with related electrical components such as capacitors and resistors, which are not described in detail in this embodiment of the present application.
  • the circuit board 130 in order to facilitate the installation of the fingerprint identification device 100 in the middle frame, the circuit board 130 is an FPC, and the MCU 131 on the FPC needs to be arranged on the reinforcing steel plate to support the MCU 131.
  • the MCU 131 is a packaged chip, which is independently set in different positions of the FPC according to different design requirements. Therefore, in this embodiment, the MCU needs to additionally design a reinforcing steel plate for it, and its own thickness is relatively large, which is not conducive to the thin and light design of the fingerprint identification device 100, and is also not conducive to the development of thin and light electronic equipment.
  • the distance between the MCU and the fingerprint sensor is long, and the fingerprint image signal is easily interfered during the transmission process, which affects the quality of the fingerprint image signal, thereby affecting the performance of fingerprint recognition.
  • the present application proposes a fingerprint identification device, which can realize the design of the fingerprint identification device to be light and thin, and improve the overall performance of the fingerprint identification device, so as to meet the installation requirements of the fingerprint identification device in different electronic devices and realize the Ultra thin.
  • FIG. 3 is a schematic structural diagram of a fingerprint identification device 200 provided by an embodiment of the present application.
  • the fingerprint identification device 200 is configured to be disposed below the display screen 103 of the electronic device.
  • the fingerprint identification device 200 includes: an optical assembly 210 , a fingerprint sensor 220 , a circuit board 230 , a processing unit 240 and a reinforcing plate 250 ;
  • the optical component 210 is disposed above the fingerprint sensor 220, and is used to guide the fingerprint light signal passing through the display screen to enter the fingerprint sensor 220 after being reflected or scattered by the finger above the display screen 103;
  • the fingerprint sensor 220 is arranged below the optical component 210, and is used for receiving the fingerprint light signal guided by the optical component 210 to obtain the fingerprint image signal;
  • the processing unit 240 is arranged on one side of the above-mentioned fingerprint sensor 220, and is used for processing the fingerprint image signal obtained by the fingerprint sensor 220, and the processed fingerprint image signal is used for fingerprint identification;
  • the circuit board 230 is provided with at least one circuit board window, the fingerprint sensor 220 and at least one of the processing units 240 are correspondingly disposed in the at least one circuit board window, and the circuit board 230 is used for transmitting the fingerprint sensor 220 and processing the signal of unit 240;
  • the reinforcing plate 250 is disposed under the circuit board 230 to support the circuit board 230 .
  • the middle frame 101 of the electronic device is provided with a through hole 104 , and the edge region of the upper surface of the reinforcing plate 250 is fixedly connected to the middle frame 101 .
  • the lower surface is at the edge area of the through hole 104 , so that the fingerprint sensor 220 and the processing unit 240 are mounted on the through hole 104 of the middle frame 101 through the reinforcing plate 250 and the circuit board 230 .
  • the fingerprint identification device can be fixedly connected with the middle frame of the electronic device through the reinforcing plate, without being directly fixed to the display screen or integrating the fingerprint identification device and the display screen.
  • the strong plate and the middle frame are rigid structures, and the two can be fixedly connected in various ways, such as double-sided tape fixing, glue fixing, welding fixing, screw fixing or coupling fixing, etc., which is easy to realize, and The requirements for processing technology are lower.
  • the circuit board, the fingerprint sensor and the processing unit above the reinforcing plate are located in the through hole of the middle frame In the middle frame, the part of the fingerprint identification device is built into the middle frame, thereby reducing the installation space of the fingerprint identification device under the display screen.
  • the embodiments of the present application design the fingerprint identification device and the display screen separately, which can reduce the difficulty of disassembling the fingerprint identification device when it is directly fixed on the display screen, thereby improving the maintainability of the electronic device.
  • the fingerprint identification device is installed on the lower surface of the middle frame through the reinforcing plate, that is, when the fingerprint identification device is repaired, it is not necessary to disassemble the display screen, but the fingerprint identification device can be disassembled directly from the back of the mobile phone, which is more convenient for the fingerprint identification device. repair or replacement.
  • FIG. 4 shows a schematic structural diagram of another fingerprint identification device 200 .
  • a through hole 104 is formed on the middle frame 101
  • a stepped structure 1041 is formed on the edge of the through hole 104 on the lower surface of the middle frame 101
  • the edge area of the upper surface of the reinforcing plate 250 is formed.
  • the fingerprint identification device 200 is fixed to the middle frame 101 of the electronic device by being fixedly connected with the stepped surface of the stepped structure 1041 .
  • the reinforcing plate 250 can be fixedly connected upward from the bottom of the middle frame 101 to the stepped structure 1041 opened at the bottom of the middle frame, for example, the upper surface of the reinforcing plate 310 can be fixed to the top surface of the stepped structure 1041 .
  • a reinforcing plate 250 affixed with double-sided adhesive can be mounted upward at the position of the through hole 104 of the middle frame 101 , so that the reinforcing plate 250 is connected to the top surface of the stepped structure 1041 at the bottom of the middle frame.
  • the size of the through hole 104 can be set smaller than the size of the reinforcing plate 250 and larger than the size of the circuit board 230 in the fingerprint identification device, so that the fingerprints on the circuit board 230 can be
  • the sensor 220 and the processing unit 240 are exposed from the upper surface of the middle frame 101 through the through hole 104 to receive the fingerprint light signal.
  • the edge region of the upper surface of the reinforcing plate 250 and the stepped surface of the stepped structure 1041 are fixedly connected by the double-sided adhesive 251, or can also be fixedly connected by the aforementioned other connection methods, This embodiment of the present application does not limit this.
  • the height of the stepped structure 1041 is greater than the thickness of the reinforcing plate 250 , so that the rigid reinforcing plate can be accommodated in the accommodating space formed by the stepped structure 1041 .
  • the thickness of the middle frame is at least 0.35mm, usually between 0.35mm and 0.68mm.
  • the thickness of the reinforcing plate can be set between 0.15mm and 0.30mm. so that the reinforcing plate can be arranged in the accommodating space formed by the stepped structure 1041 of the middle frame 101, and the middle frame 101 at the stepped structure 1041 can also retain a certain thickness. That is to say, at the edge position of the through hole, only a part of the thickness of the middle frame is cut to form a stepped structure to accommodate the reinforcing plate, and a middle frame of sufficient thickness is reserved to support the fingerprint identification device 200 .
  • the surface roughness of the reinforcing plate 250 is greater than a certain preset threshold, for example, greater than 0.25 ⁇ m.
  • a certain preset threshold for example, greater than 0.25 ⁇ m.
  • the above-mentioned reinforcing plate 250 is black, or other colors that do not reflect light, such as gun color, by setting the reinforcing plate to a color that does not reflect light, the light signal reflected from the surface of the reinforcing plate can be prevented from entering the fingerprint sensor. , which affects the fingerprint detection performance.
  • the through hole 104 is opened in the middle area or the lower middle area of the middle frame 101, so that the fingerprint detection area of the fingerprint sensor 220 is located in the middle position or the lower middle position of the display area of the display screen, which is convenient for The user holds it for fingerprint recognition, thereby improving the user experience.
  • the optical assembly 210 may be similar to the optical assembly 110 in FIG. 1 , including a microlens array 211 and a For the diaphragm layer 212, the related technical solutions can be referred to the specific description above.
  • the optical component 210 may also include a multi-layer diaphragm layer 212 .
  • the fingerprint sensor 220 includes a pixel array composed of a plurality of pixel units, each microlens in the microlens array 211 corresponds to at least one light-passing aperture in each diaphragm layer 212, and at least one pixel unit in the pixel array , each microlens transmits the concentrated optical signal to the inside of the corresponding light-passing hole and transmits it to the corresponding pixel unit via the light-passing hole to perform optical fingerprint imaging.
  • multiple pixel units in the fingerprint sensor 220 can be used to receive fingerprint light signals in the same direction, for example, multiple pixel units all receive fingerprint light signals perpendicular to the display screen, or multiple pixel units all receive oblique fingerprint signals.
  • the fingerprint light signal in the specific direction of the display screen.
  • the plurality of pixel units in the fingerprint sensor 220 can also be used to receive fingerprint light signals in different directions to form fingerprint image signals of a plurality of fingerprint images, for example, the first part of the pixel units in the plurality of pixel units receives the first The fingerprint light signal in the direction forms the fingerprint image signal of the first fingerprint image; the second part of the pixel unit receives the fingerprint light signal in the second direction to form the fingerprint image signal of the second fingerprint image.
  • the aperture layer 212 may be grown on the fingerprint sensor 220 by semiconductor process growth or other processes, for example, by atomic layer deposition, sputter coating, electron beam evaporation coating, ion beam coating, etc. on the fingerprint sensor A layer of non-light-transmitting material film is prepared on the top of 220, and then photolithography and etching of the pinhole pattern are performed to form a plurality of light-transmitting pinholes. It can be understood that, in the case where the optical assembly 210 includes a plurality of diaphragm layers 212, the transparent medium layer may be passed between the bottom diaphragm layer 212 and the fingerprint sensor 220, and between the adjacent diaphragm layers 212. isolate.
  • the optical component 210 can also be other light guiding structures, such as a collimator layer, with a plurality of collimation units or a micro-hole array; or , an optical lens (Lens) layer, which has one or more lens units, such as a lens group composed of one or more aspherical lenses, the specific structure of the optical component 210 is not limited in this embodiment of the present application.
  • a collimator layer with a plurality of collimation units or a micro-hole array
  • an optical lens (Lens) layer which has one or more lens units, such as a lens group composed of one or more aspherical lenses
  • the optical assembly 210 adopts the above structure. Compared with the fingerprint identification device based on the imaging of the optical lens layer, it is not limited by the imaging optical path of the lens, and the thickness of the optical assembly is reduced, which is beneficial to realize the lightness and thinness of the fingerprint identification device. change. In addition, compared with the fingerprint identification device based on the imaging of the collimator layer, it uses a microlens array to condense the optical signal, and uses one or more diaphragm layers to guide the direction of the optical signal, which can further improve the fingerprint optical signal. quality, thereby improving the fingerprint recognition performance of the fingerprint recognition device.
  • FIG. 5 shows a schematic top view of the fingerprint identification device 200 in FIGS. 3 and 4 .
  • the circuit board 230 is disposed above the reinforcing plate 250 , and as shown in FIGS. 3 , 4 and 5 , the circuit board 230 is formed with two penetrating circuits.
  • the circuit board window of the board 230 wherein the fingerprint sensor 220 is arranged in the first circuit board window 2301, the processing unit 240 is arranged in the second circuit board window 2302, and the fingerprint sensor 220 and the processing unit 240 are arranged side by side in the complementary circuit board.
  • the electrical connector may be a lead, such as a gold wire, which is bonded by wire.
  • the first lead 2311 connects the pad of the fingerprint sensor 220 and the pad of the circuit board 230
  • the second lead 2312 connects the pads of the processing unit 240 and the pads of the circuit board 230 .
  • the shape of the first circuit board opening 2301 may be substantially the same as that of the fingerprint sensor 220 to accommodate the fingerprint sensor 220 .
  • Each side of the first circuit board opening 2301 is parallel or perpendicular to each side of the fingerprint sensor 220 .
  • the shape of the second circuit board window 2302 may be substantially the same as that of the processing unit 240 to accommodate the processing unit 240 , and each side of the second circuit board window 2302 is parallel or perpendicular to each side of the processing unit 240 .
  • the shapes of the first circuit board opening 2301 and the second circuit board opening 2302 include, but are not limited to, the shapes shown in FIG. It is enough to accommodate the fingerprint sensor 220 and the processing unit 240 .
  • using the window shape shown in FIG. 5 can accommodate the fingerprint sensor 220 and the processing unit 240 without wasting the area of the circuit board.
  • the shape of the opening window has more mature processing conditions, thereby improving the production capacity and yield.
  • the first circuit board window 2301 if the circuit board 230 is provided with a first pad connected to the fingerprint sensor 220 on one side of the first circuit board window 2301 , the first The thickness of the area where the pads are located, or the area where the circuit board 230 is located at one side of the first circuit board opening 2301 may be smaller than the thickness of the circuit board 230 at other areas.
  • the circuit board 230 is provided with a second pad connected to the processing unit 240 on the side of the window 2302 of the second circuit board, and the area where the second pad is located, that is, the circuit board 230 is located on the side of the window 2302 of the second circuit board
  • the thickness of the circuit board in the region may also be smaller than the thickness of the circuit board 230 in other regions.
  • the thickness of at least part of the edge area of the first circuit board opening 2301 and/or the second circuit board opening 2302 of the circuit board 230 is reduced, and only one layer of metal pads and metal pads may be provided in the edge area. traces, while other areas of the circuit board 230 may be provided with multi-layer metal traces.
  • This design method can increase the step difference between the pad on the circuit board and the pad on the fingerprint sensor, as well as the pad on the circuit board and the pad on the processing unit, so as to facilitate the lead connection between the pads.
  • the arc height of the lead wire is reduced, which is beneficial to reduce the thickness of the entire fingerprint identification device.
  • the first side (left side) of the first circuit board window 2301 is adjacent to the first side (right side) of the second circuit board window 2302 , and the circuit board 230 is on the
  • the first side of the first circuit board window 2301 and the area of the first side of the second circuit board window 2302 are both formed with pads, and the thickness of this area may be smaller than that of other areas of the circuit board.
  • the area between the first circuit board window 2301 and the second circuit board window 2302 is relatively small, so the first circuit board window 2301 and the second circuit board window 2302 are small.
  • the thickness of the entire area between 2302 is smaller than that of other areas of the circuit board.
  • the circuit board window in the circuit board 230 by arranging the circuit board window in the circuit board 230, and arranging the processing unit 240 and the fingerprint sensor 220 in the circuit board window, compared to directly arranging the fingerprint sensor 220 and the processing unit 240 in the circuit board
  • the solution on the surface of the circuit board 230 can reduce the overall thickness of the fingerprint identification device 200 .
  • the circuit board 230 is an FPC, which facilitates the installation of the fingerprint identification device under the display screen.
  • the reinforcement board 250 is a reinforcement board of the FPC, and its material can be a stainless steel reinforcement board, an aluminum foil reinforcement board, a glass fiber reinforcement board or other organic material reinforcement board, This embodiment of the present application does not limit this.
  • the reinforcing plate 250 is a reinforcing steel plate.
  • the surface roughness of the reinforcing plate 250 is greater than a certain preset threshold, for example, greater than 0.25 ⁇ m.
  • a certain preset threshold for example, greater than 0.25 ⁇ m.
  • the above-mentioned reinforcing plate 250 is black, or other colors that do not reflect light, such as gun color, by setting the reinforcing plate to a color that does not reflect light, the light signal reflected from the surface of the reinforcing plate can be prevented from entering the fingerprint sensor. , which affects the fingerprint detection performance.
  • the circuit board 230 may be a flexible board in a flexible-rigid combination board, or other types of circuit boards in the electrical field, in addition to an FPC.
  • the circuit board 230 There are electrical connection units such as interconnection layers and pads in it, which are used to conduct electrical signal conduction.
  • the reinforcing plate 250 is a material layer used to reinforce and support the above-mentioned circuit board 230, which is generally not used for transmitting electrical signals. It can be not only the reinforcing steel plate of FPC, but also the core ( core) material.
  • the combination of the circuit board 230 and the reinforcing plate 250 can support the fingerprint sensor 220 and the processing unit 240 while realizing the electrical connection therebetween, and reduce the installation thickness of the two.
  • the processing unit 240 and the fingerprint sensor 220 share a reinforcing plate.
  • the reinforcing plate of the processing unit 240 is not additionally added. An additional increase in the thickness of the entire fingerprint identification device can also reduce the cost of the fingerprint identification device.
  • the processing unit 240 is electrically connected to the fingerprint sensor 220 through the electrical connector and the circuit board 230, it is used to process the fingerprint image signal obtained by the fingerprint sensor 220, and the processed fingerprint image signal is used for fingerprint recognition.
  • the processing unit 240 may perform digital synthesis (binning), filtering (filtering) and other signal processing on the fingerprint image signal obtained by the fingerprint sensor 220, and then pass the processed fingerprint image signal through the circuit board 230 and the circuit board.
  • the connector on 230 is transmitted to the processor of the electronic device, and the processor is used for fingerprint detection and identification of the processed fingerprint image signal.
  • the processing unit 240 can also be used to form a control signal of the fingerprint sensor, so as to control the operation of the circuit in the fingerprint sensor to perform fingerprint image acquisition.
  • the processing unit 240 may be configured to process and identify the fingerprint image signal acquired by the fingerprint sensor 220 to determine whether the fingerprint image signal belongs to the fingerprint of the target user. Further, the processing unit 240 may also use In vivo detection is performed on the fingerprint image signal to determine whether the fingerprint image signal belongs to a living finger.
  • the processing unit 240 includes, but is not limited to, an MCU, which can also be a digital signal processor (DSP), an image signal processor (ISP), an application specific integrated circuit (ASIC) , Off-the-shelf programmable gate array (field programmable gate array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.
  • DSP digital signal processor
  • ISP image signal processor
  • ASIC application specific integrated circuit
  • FPGA field programmable gate array
  • FPGA field programmable gate array
  • the processing units 240 are arranged side by side on one side of the fingerprint sensor 220, rather than at other positions on the circuit board 230, so that the wiring distance between the processing unit 240 and the fingerprint sensor 220 can be reduced, thereby reducing the wiring distance between the processing unit 240 and the fingerprint sensor 220. Prevent the signal quality from deteriorating during the transmission process and affect the fingerprint recognition effect.
  • the processing unit 240 and the fingerprint sensor 220 side by side in the blind hole area of the middle frame, there is no need to separately set a reinforcing plate under the processing unit 240, nor does it need to encapsulate the processing unit 240, that is, in the processing unit
  • the outer side of 240 is additionally prepared with an encapsulation material layer. Therefore, in the embodiment of the present application, compared with the arrangement of the MCU 131 in FIG. 2 , the arrangement of the processing unit 240 can reduce the overall thickness space occupied by the processing unit 240 , thereby further reducing the thickness of the entire fingerprint identification device 200 .
  • the processing unit 240 and the fingerprint sensor 220 are arranged below the display screen 103, and are arranged in the blind hole area of the middle frame through the reinforcing plate 250, so there is no need to separately dispose a reinforcing plate below the processing unit 240, nor does it need to be
  • the processing unit 240 is encapsulated, that is, an encapsulation material layer is additionally prepared outside the processing unit 240 . Therefore, in the embodiment of the present application, compared with the arrangement of the MCU 131 in FIG. 2 , the arrangement of the processing unit 240 can reduce the overall thickness space occupied by the processing unit 240 , thereby further reducing the thickness of the entire fingerprint identification device 200 .
  • the processing unit 240 and the fingerprint sensor 220 are arranged in the circuit board windowing of the circuit board 230 , and signal transmission is performed through the circuit board 230 .
  • the signal transmission distance between the processing unit 240 and the fingerprint sensor 220 can be reduced, the signal quality between the two can be improved, and the fingerprint identification effect can be improved.
  • the processing unit 240 together with the fingerprint sensor 220, is disposed on the middle frame through the circuit board 230 and the reinforcing plate 250, and is located below the display screen, so there is no need to separately set a reinforcing plate for the processing unit 240, nor does it need to The processing unit 240 is packaged. Therefore, the processing unit 240 occupies a small thickness space, so that the thickness of the entire fingerprint identification device 200 can be reduced.
  • the upper surface of the edge region of the reinforcing plate 250 under the circuit board 230 is fixedly connected to the through hole 104 of the middle frame, which can further compress the entire fingerprint
  • the thickness space occupied by the identification device under the screen enables the fingerprint identification device to be installed in the electronic device more conveniently and flexibly, and can be applied to more electronic devices.
  • one side of the processing unit 240 is parallel or perpendicular to one side of the fingerprint sensor 220 .
  • the fingerprint sensor 200 and the processing unit 240 may be a quadrilateral chip, and one side thereof may be any side of the quadrilateral chip.
  • the first side of the processing unit 240 is the right side and the first side of the fingerprint sensor 220 is the left side, then the first side of the processing unit 240 is parallel to the first side of the fingerprint sensor 220 .
  • the processing unit 240 can be said to be disposed in parallel with the fingerprint sensor 220 .
  • the processing unit 240 may not be disposed in parallel with the fingerprint sensor 220 , that is, the first side of the processing unit 240 and the first side of the fingerprint sensor 220 form a certain angle, and the certain angle is The angle is not 0° or 90°.
  • This embodiment of the present application does not specifically limit the angular relationship between the processing unit 240 and the fingerprint sensor 220 .
  • the distance between the right side of the processing unit 240 and the left side of the fingerprint sensor 220 is the shortest, and the pads of the circuit board 230 are located at the Between the left side of the fingerprint sensor 220 and the right side of the processing unit 240, it is convenient for the fingerprint sensor 220 and the processing unit 240 to be connected to the pads of the circuit board.
  • FIG. 5 only shows the case where the processing unit 240 is arranged in parallel on the left side of the fingerprint sensor 220, and the processing unit 240 can also be arranged in parallel or non-parallel on any side of the other three sides of the second sensor 230. This is not specifically limited in the application examples.
  • the circuit board 230 is provided with two openings, which accommodate the fingerprint sensor 220 and the processing unit 240 respectively.
  • only one window may be provided in the circuit board 230 for accommodating the fingerprint sensor 220 or the processing unit 240 .
  • FIG. 6 shows a schematic structural diagram of another fingerprint identification device 200 .
  • the circuit board 230 is formed with a first circuit board window 2301 penetrating the circuit board 230 .
  • the fingerprint sensor 220 is disposed in the opening 2301 of the first circuit board, and is located above the reinforcing plate 250 .
  • the processing unit 240 is disposed above the circuit board 230, and the processing unit 240 and the fingerprint sensor 220 are connected to the circuit board 230 through electrical connectors.
  • FIG. 7 shows a schematic structural diagram of another fingerprint identification device 200 .
  • the circuit board 230 is formed with a second circuit board window 2302 penetrating the circuit board 230 .
  • the processing unit 240 is disposed in the opening 2302 of the second circuit board, and is located above the reinforcing plate 250 .
  • the fingerprint sensor 220 is disposed above the circuit board 230 , and the processing unit 240 and the fingerprint sensor 220 are connected to the circuit board 230 through electrical connectors.
  • FIG. 6 a related technical solution of the fingerprint identification device 200 is described when a window is formed in the circuit board 230 .
  • FIG. 7 For the specific solution of the fingerprint identification device in FIG. 7, reference may be made to the related description below, and details are not repeated here.
  • the fingerprint sensor 220 is disposed in the first circuit board window 2301 of the circuit board 230 .
  • the circuit board 230 is on the first circuit board window 2301
  • the area where one side (left side) is located is formed with the first pad connected to the fingerprint sensor 220, then the thickness of the circuit board 230 in the area where the first side of the first circuit board window 2301 is located can be smaller than that in other areas of the circuit board 230 thickness of.
  • the circuit board 230 may be provided with only one layer of metal pads and metal traces in the area where the first side of the first circuit board opening 2301 is located, while other areas of the circuit board 230 may be provided with multiple layers of metal traces.
  • the step difference between the pads on the circuit board and the pads on the fingerprint sensor can be increased, which facilitates the connection of the leads between the pads, and reduces the arc height of the leads, which is beneficial to reduce the overall fingerprint identification device. thickness.
  • the circuit board 230 is adjacent to the processing unit 240 on the first side (left side) of the first circuit board window 2301 , and the circuit board 230 is on the first side of the first circuit board window 2301 .
  • a second pad connected to the processing unit 240 may also be formed in the area where one side is located.
  • the pads of the fingerprint sensor 220 are only arranged on one side of the fingerprint sensor 220.
  • the first pad of the circuit board 230 connected to the fingerprint sensor 220 is only located on the first side of the opening 2301 of the first circuit board.
  • the circuit board 230 is provided with a second pad connected to the processing unit 240 on the first side (right side) of the opening 2302 of the second circuit board, and the circuit board 230
  • the thickness of the region where the first side of the opening 2302 of the second circuit board is located is smaller than the thickness of the circuit board 230 in other regions.
  • the circuit board 230 is adjacent to the fingerprint sensor 220 at the first side of the opening 2302 of the second circuit board, and the circuit board 230 is further provided with a connection to the fingerprint sensor 220 at the first side of the opening 2302 of the second circuit board. of the first pad.
  • the pads of the processing unit 240 are arranged on three sides of the processing unit 240.
  • the second pad of the circuit board 230 connected to the processing unit 240 is located on the third Besides the first side of the second circuit board window 2302, it is also located on the other two sides of the second circuit board window 2302.
  • the technical solutions of the above-mentioned application embodiments can be adopted, and only one opening window is provided in the circuit board 230, so that the thickness of the fingerprint identification device can be reduced, and the lateral installation area of the entire fingerprint identification device can be taken into account, as well as the size of the circuit board 230. The actual use area, thereby improving the reliability of the fingerprint identification device.
  • FIG. 8 to 10 are schematic structural diagrams of other fingerprint identification devices 200 .
  • the several fingerprint identification devices 200 correspond to the fingerprint identification devices in FIG. 4 , FIG. 6 and FIG. 7 above, respectively.
  • FIG. 8 taking the fingerprint identification device in FIG. 8 as an example, the specific structure of the fingerprint identification device will be described with reference to FIGS. 11 to 13 .
  • FIG. 9 and FIG. 10 For the structure of the fingerprint identification device in FIG. 9 and FIG. 10, reference may be made to the related descriptions below, and details are not repeated here.
  • the circuit board 230 is adhered to the reinforcing plate 250 through the first adhesive layer 231 . Further, further, the reinforcing plate 250 is adhered to the upper surface of the stepped structure 1041 of the middle frame 101 through the second adhesive layer 251 .
  • the first adhesive layer 231 includes, but is not limited to, conductive adhesive, which is used to connect the FPC and the reinforcing steel plate.
  • the second adhesive layer 251 includes, but is not limited to, module-laminated double-sided adhesive, water adhesive, solid adhesive foam layer with adhesive layer, or other types of adhesive layers. The specific types of the first adhesive layer 231 and the second adhesive layer 251 are not limited in this embodiment of the present application.
  • the fingerprint sensor 220 may be adhered to the reinforcing plate 250 through the third adhesive layer 221
  • the processing unit 240 may be adhered to the reinforcing plate 250 through the fourth adhesive layer 241 .
  • the third adhesive layer 221 and the fourth adhesive layer 241 include, but are not limited to, die attach films (Die Attach Film, DAF), which can realize ultra-thin connections between chips and circuit boards.
  • the first lead 2311 for connecting the fingerprint sensor 220 and the circuit board 230 and the second lead 2312 for connecting the processing unit 240 and the circuit board 230 are covered with lead protection glue 232 to prevent the The leads are supported and protected.
  • the lead protection glue 232 can ensure the stability of the electrical connection between the circuit board 230 and the fingerprint sensor 220 , as well as the first circuit board 230 and the processing unit 240 , and further, can ensure the performance of the fingerprint identification device 200 .
  • the height of the lead protection glue 232 is not greater than 150 ⁇ m, and the height of the lead protection glue 232 refers to the height between the highest point of its upper surface and the upper surface of the circuit board 230 height between.
  • the fingerprint identification device 200 may further include the following components.
  • the fingerprint identification device 200 may further include:
  • the light shielding layer 270 has a first window 2701 formed therein.
  • the first window 2701 is located above the fingerprint sensor 220 for passing the fingerprint light signal to be received by the fingerprint sensor 220 .
  • FIG. 11 shows a schematic top view of the fingerprint identification device in FIG. 8 .
  • a light shielding layer is provided in the surrounding area of the first opening window 2701 , which can be used to block stray light or fingerprint light signals in non-target directions. , to prevent it from entering the fingerprint sensor 220, thereby reducing the interference of environmental factors on the fingerprint identification process.
  • setting the light shielding layer 270 can also improve the appearance of the fingerprint identification device 200 under the display screen. Due to the light shielding layer 270, it can absorb the light signal emitted from the top of the display screen and reduce the reflection of the light signal back to the display screen. Intensity, to prevent users from being able to observe the fingerprint recognition device under the display screen, thereby improving the user experience.
  • the light shielding layer 270 is a shielding glue layer.
  • the thickness of the light shielding layer 270 is 10-30 ⁇ m, for example, 20 ⁇ m.
  • the thickness of the light shielding layer 270 may also be other specific values or within a range of other preset values, which is not specifically limited in this application.
  • the light shielding layer 270 may also be replaced by a filter.
  • the filter is used to reduce undesired ambient light in fingerprint sensing to improve the optical sensing of the received light by the fingerprint sensor 220 .
  • the filter can specifically be used to filter out light of a specific wavelength, for example, near-infrared light and part of red light.
  • human fingers absorb most of the energy of light with wavelengths below 580 nm, based on this, filters can be designed to filter light with wavelengths from 580 nm to the infrared to reduce the effect of ambient light on optical detection in fingerprint sensing.
  • At least a part of the above-mentioned optical component 210 is located in the first window 2701 .
  • the microlens array 211 in the optical assembly 210 is located in the above-mentioned first opening 2701 , and at least one aperture layer in the optical assembly 210 is integrated with the fingerprint sensor 220 into the fingerprint sensor chip , the surrounding area of the first window 2701 in the light shielding layer 270 is disposed on the surface of the edge area of the fingerprint sensor chip.
  • a light-shielding layer 270 is also disposed between the first lead 2311 of the fingerprint sensor 220 and the microlens array 211 .
  • the light-shielding layer 270 can not only block stray light, but also block the lead protective glue 232 spread to the microlens array 211 , thereby affecting the light guiding effect of the microlens array 211 .
  • a second opening 2701 is arranged in the area corresponding to the lead connection.
  • the top area of the first lead 2311 where the fingerprint sensor 220 is connected to the circuit board 240 and the top area of the second lead 2312 where the processing unit 240 is connected to the circuit board 240 are located in the second opening 2702 . Further, the top regions of the lead protection glue 232 of the first lead 2311 and the second lead 2312 are also located in the second opening 2702 .
  • the first side of the fingerprint sensor 220 (the left side of the fingerprint sensor 220 in the figure) is the same as the first side of the processing unit 240 (the right side of the processing unit 240 in the figure) Neighbor settings.
  • the first side of the fingerprint sensor 220 (the left side of the fingerprint sensor 220 in the figure) is provided with a plurality of first leads 2311
  • the first side of the processing unit 240 (the right side of the processing unit 240 in the figure) is provided with a plurality of first leads 2311 .
  • the two leads 2312, the top regions of the plurality of first leads 2311 on the first side of the fingerprint sensor 220 and the top regions of the plurality of second leads 2312 on the first side of the processing unit 240 are all located in the second opening 2702, and further Yes, the top area of the lead protection adhesive 232 on the first side of the fingerprint sensor 220 and the top area of the lead protection adhesive 232 on the first side of the processing unit 240 are also located in the second opening 2702 .
  • a plurality of first leads 2311 and a plurality of second leads 2312 are arranged between the fingerprint sensor 220 and the processing unit 240 , and the second window 2702 covers the gap between the fingerprint sensor 220 and the processing unit 240 . area.
  • all the first leads 2311 of the fingerprint sensor 220 can be disposed on the first side of the fingerprint sensor 220 .
  • a part of the second leads 2312 of the processing unit 240 are arranged on the first side of the processing unit 240 , and the other second leads 2312 are arranged on other sides of the processing unit 240 .
  • the second lead 2312 located on the first side of the processing unit 240 and the top area of its lead protection adhesive located in the second opening 2702 can also be located in the second opening 2702.
  • connection leads may be arranged on multiple sides of the processing unit 240 .
  • the lead pads of the processing unit 240 are arranged on three sides (upper side, lower side and right side), and the second opening 2702 is located on the processing unit 240
  • the shading layer 270 does not cover the processing unit 240 at all, and the projection of the second window 2702 on the plane where the processing unit 240 is located completely covers the area where the processing unit 240 is located.
  • the light shielding layer 270 may also cover the side of the processing unit 240 where the second lead is not provided.
  • the light shielding layer 270 may also cover the left side in FIG. 11 .
  • the second open The projection of the window 2702 on the plane where the processing unit 240 is located may only partially cover the area where the processing unit 240 is located.
  • first opening 2701 and the second opening 2702 can also have other regular or irregular shapes, which are not specifically limited in the embodiment of the present application.
  • the second opening 2702 in the light shielding layer 270 by arranging the second opening 2702 in the light shielding layer 270, and disposing the top area of the lead and its lead protection adhesive in the second opening 2702, compared with the direct opening of the light shielding layer 270 It is arranged on the top of the lead wire and the lead wire protective glue, which can further reduce the overall thickness of the fingerprint identification device.
  • the upper surface of the light shielding layer 270 is not higher than the highest point of the upper surface of the lead protection adhesive 232 , and/or the upper surface of the light shielding layer 270 is not higher than the highest point of the upper surface of the optical component 210 .
  • the arrangement of the light shielding layer 270 does not increase the thickness of the fingerprint identification device 200 , but only improves the performance of the fingerprint identification device 200 .
  • the first window 2701 is formed in cooperation with the microlens array 211, and the second window 2702 is formed in conjunction with the lead wire and its lead protective adhesive, which can block stray light or non-targets.
  • the fingerprint light signal in the direction of the fingerprint identification can reduce the interference of the outside world on the fingerprint identification process, and reduce the thickness of the fingerprint identification device. Furthermore, the appearance problem of the fingerprint identification device under the display screen can be improved.
  • the fingerprint identification device 200 may further include: a support layer 260 disposed between the circuit board 230 and the light shielding layer 270 for supporting the light shielding layer 270 .
  • FIG. 12 shows another schematic top view of the fingerprint identification device in FIG. 8 .
  • a third opening 2601 is provided in the support layer 260 , and the fingerprint sensor 220 and the processing unit 240 are arranged in the third opening 2601 .
  • the light shielding layer 270 is disposed on the surface of the support layer 260 and extends toward the fingerprint sensor 220 , and a first window 2701 is formed around the microlens array 211 of the fingerprint sensor 220 .
  • the support layer 260 supports a part of the light shielding layer 270 , and another part of the light shielding layer 270 is suspended below or supported by the fingerprint sensor 220 .
  • the upper surface of the support layer 260 is not higher than the highest point of the upper surface of the microlens array 211 in the optical assembly 210 .
  • at least one diaphragm layer in the optical assembly 210 and the fingerprint The sensor is integrated in the fingerprint sensor chip, and the upper surface of the support layer 260 is not higher than the upper surface of the fingerprint sensor chip.
  • the upper surface of the support layer 260 is also not higher than the upper surface of the processing unit 240 .
  • the support layer 260 is fixed on the upper surface of the circuit board 230 by fixing glue.
  • the material of the support layer 260 includes, but is not limited to, metal, resin, glass fiber composite board, adhesive layer, and the like.
  • the support layer 260 is a polyethylene terephthalate (polyethylene terephthalate, PET) material layer or a polyimide (polyimide, PI) material layer.
  • the support layer 260 may also be a bracket formed of a foam material.
  • the fixing adhesive can be a double-sided adhesive.
  • the disposition of the support layer 260 does not increase the thickness of the fingerprint identification device 200 , but only supports the light shielding layer 270 to improve the stability of the light shielding layer 270 .
  • the fingerprint identification device 200 may further include: a foam layer 280 , and the foam layer 280 may be connected to the surface of the light shielding layer 270 by a tape 281 , so that the foam layer 280 It is fixed above the fingerprint sensor 220 and the processing unit 240 .
  • Fig. 13 shows another schematic top view of the fingerprint identification device in Fig. 8 .
  • the foam layer 280 may be provided with a fourth window 2801 penetrating the foam layer 280 .
  • the fourth window 2801 is disposed just above the optical assembly, specifically, is disposed directly above the microlens array 211, so that the fingerprint light signal can be passed through the fourth window 2801 by the optical assembly 210 and the fingerprint sensor. 220 received.
  • the area of the fourth opening 2801 is not smaller than the area of the first opening 2701 in the light shielding layer 270 .
  • the upper surface of the fingerprint identification device 200 is pressed against the lower surface of the display screen through the foam layer 280 or maintains a certain gap with the lower surface of the display screen.
  • the foam layer 280 can not only be used for The detection performance of the fingerprint identification device 200 is prevented from being affected by the fingerprint identification device 200 touching the display screen, and the fingerprint identification device 200 can be sealed against dust to ensure the identification performance of the fingerprint identification device 200 and improve the service life of the fingerprint identification device 200 .
  • the foam layer 280 can further play the role of shading, thereby reducing the visibility of the fingerprint identification device 200 when the user views the fingerprint identification device 200 from the front of the display screen, thereby beautifying the appearance of the electronic device.
  • the fingerprint identification device 200 further includes: a filter, and the filter is disposed between the fingerprint sensor 220 and the display screen. It is used to filter out the optical signal in the non-target band and pass the optical signal in the target band.
  • the area of the filter is larger than the area of the fingerprint detection area of the fingerprint sensor 220 .
  • the filter may include one or more optical filters, which may be configured, for example, as band-pass filters to allow transmission of light emitted by OLED displays or assist in fingerprint recognition in LCD displays The transmission of light emitted by the light source, while blocking other light components such as infrared light in sunlight.
  • optical filters may be configured, for example, as band-pass filters to allow transmission of light emitted by OLED displays or assist in fingerprint recognition in LCD displays The transmission of light emitted by the light source, while blocking other light components such as infrared light in sunlight.
  • the filter is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the received light by the fingerprint sensor 220 .
  • the filter can specifically be used to filter out light of a specific wavelength, for example, near-infrared light and part of red light.
  • the reflectivity of the filter to light is less than 1%, so as to ensure that the fingerprint sensor 220 can receive enough light signals, thereby improving the fingerprint recognition effect.
  • the optical filter is disposed above the optical assembly 210 , for example, it can be connected and fixed to the circuit board 230 through a bracket or an adhesive layer, so as to be disposed above the optical assembly.
  • the filter and the optical component 210 may be an air gap not filled with any auxiliary material, or may be filled with a glue material whose refractive index is lower than the preset refractive index.
  • the preset refractive index includes but not Limited to 1.3.
  • the optical filter can also be grown on the surface of the fingerprint sensor by a semiconductor process, specifically, a filter layer for passing the optical signal of the target wavelength band and filtering the optical signal of the non-target wavelength band is grown on the surface of the fingerprint sensor.
  • the filter layer is integrated into the chip together with the fingerprint sensor.
  • the above-mentioned filter layer can be formed by coating on the light detection array of the fingerprint sensor 220 by an evaporation process, for example, by atomic layer deposition, sputtering coating, electron beam evaporation coating, ion beam coating and other methods above the sensor chip Preparation of multilayer filter material films.
  • the circuit board 230 may have an irregular shape, and the head area thereof is approximately a quadrilateral.
  • the fingerprint sensor 220 , the processing unit 240 , and the support layer 260 , the light shielding layer 270 and the foam layer 280 are all provided with the head area of the circuit board 230 .
  • the circuit board 230 is specifically the head area of the circuit board 230 unless otherwise specified.
  • the peripheral shapes of the light shielding layer 270 , the supporting layer 260 , the foam layer 280 and the reinforcing plate 250 are similar to the head area of the circuit board 230 , so that the circuit The head area of the board 230 and the fingerprint sensor 220 and the processing unit 240 disposed above it are well protected, and can be easily installed in the blind hole of the middle frame without causing appearance problems due to the reflection of the circuit board 230 .
  • the related technical solutions are described by taking the fingerprint identification device including a single fingerprint sensor 220 and a single processing unit 240 as an example.
  • the fingerprint identification device may further include multiple fingerprint sensors 220 and/or multiple processing units 240 .
  • a plurality of fingerprint sensors 220 are arranged side by side above the circuit board 230 to form a fingerprint sensor assembly, wherein the sensing areas of the plurality of fingerprint sensors 220 together constitute the fingerprint detection area of the fingerprint identification device 200 in the display screen, thereby expanding the Fingerprint detection area for full-screen fingerprint recognition.
  • a plurality of processing units 240 are arranged side by side above the circuit board 230 to form a processing unit assembly.
  • the processing unit assembly is disposed adjacent to the fingerprint sensor assembly, and is used for processing the fingerprint image signal obtained by the fingerprint sensor assembly.
  • the through hole 104 of the middle frame is opened in the middle area or the lower middle area of the middle frame 101 , so that the fingerprint detection area of the at least one fingerprint sensor 220 is located in the middle position of the display area of the display screen 103 or The lower middle position is convenient for the user to hold the fingerprint identification, thereby improving the user experience.
  • the embodiment of the present application also provides an electronic device, and the electronic device may include:
  • the middle frame, the upper surface of the middle frame is provided with a through hole, and the through hole is located under the display screen, and the fingerprint identification device is installed in the through hole of the middle frame, so that the fingerprint identification device is arranged under the display screen, so that the screen can be used under the screen. Fingerprint recognition.
  • the electronic device can be any electronic device with a display screen.
  • the display screen can be an OLED display screen, an LCD display screen or other types of display screens in the related art. Specifically, it may correspond to the display screen 103 in the foregoing embodiment, and the related description can refer to the foregoing description about the display screen 103 , which is not repeated here for brevity.
  • the middle frame may correspond to the middle frame 101 in the foregoing embodiment, and the relevant description may refer to the foregoing description of the middle frame 101, and the through hole therein may refer to the foregoing description of the through hole 104. For brevity, the description is omitted here. Repeat.
  • the through hole of the middle frame is arranged in the middle area or the lower middle area of the middle frame, so that the fingerprint detection area of the fingerprint recognition device is located in the middle position of the display area of the display screen or Lower middle position.
  • the distance between the fingerprint identification device and the light-emitting layer of the display screen is less than a preset threshold, for example, the preset threshold is 600 ⁇ m.
  • the disclosed systems and apparatuses may be implemented in other manners.
  • the apparatus embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • the shown or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may also be electrical, mechanical or other forms of connection.
  • the units described as separate components may or may not be physically separated, and components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solutions of the embodiments of the present application.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.
  • the integrated unit if implemented in the form of a software functional unit and sold or used as an independent product, may be stored in a computer-readable storage medium.
  • the technical solutions of the present application are essentially or part of contributions to the prior art, or all or part of the technical solutions can be embodied in the form of software products, and the computer software products are stored in a storage medium , including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk and other media that can store program codes .

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Abstract

L'invention concerne un appareil de reconnaissance d'empreintes digitales (200) et un dispositif électronique. L'appareil de reconnaissance d'empreintes digitales (200) a une épaisseur ultra-mince et de bonnes performances de reconnaissance d'empreintes digitales, et peut être appliqué à un dispositif électronique dans un espace sous-écran ultra-mince. L'appareil de reconnaissance d'empreintes digitales (200) comprend : un capteur d'empreintes digitales (220) ; un composant optique (210) disposé au-dessus du capteur d'empreintes digitales (220) et utilisé pour guider un signal optique d'empreintes digitales pour entrer dans le capteur d'empreintes digitales (220) ; une unité de traitement (240) disposée sur un côté du capteur d'empreintes digitales (220) ; une carte de circuit imprimé (230) pourvue d'au moins une fenêtre de carte de circuit imprimé (2301, 2302), au moins l'un du capteur d'empreintes digitales (220) et l'unité de traitement (240) étant disposé(e) dans la ou les fenêtres de carte de circuit imprimé (2301, 2302) ; la carte de circuit imprimé (230) étant utilisée pour transmettre des signaux du capteur d'empreintes digitales (220) et de l'unité de traitement (240) ; et une plaque de renforcement (250) disposée au-dessous de la carte de circuit imprimé (230) et utilisée pour supporter la carte de circuit imprimé (230). Un cadre intermédiaire (101) du dispositif électronique est pourvu d'un trou traversant (104). Une zone de bord d'une surface supérieure de la plaque de renforcement (250) est reliée de manière fixe à une zone de bord d'une surface inférieure du cadre intermédiaire (101) dans le trou traversant (104), de telle sorte que le capteur d'empreintes digitales (220) et l'unité de traitement (240) sont montés dans le trou traversant (104) du cadre intermédiaire (101) au moyen de la plaque de renfort (250) et de la carte de circuit imprimé (230).
PCT/CN2020/116631 2020-09-21 2020-09-21 Appareil de reconnaissance d'empreintes digitales et dispositif électronique WO2022056940A1 (fr)

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