WO2022025641A1 - Electronic device case and manufacturing method therefor - Google Patents

Abstract

An electronic device according to various embodiments of the present disclosure may comprise: a case forming at least a part of the exterior of the electronic device; a battery disposed in the inner space of the case; and a display, positioned in the inner space, for displaying information to the outside. The case may include: a first surface which forms at least a part of the front surface or the rear surface of the electronic device, and which is matte; a second surface which extends from the first surface while forming a designated first angle therewith, and which includes a non-directional (random) hairline structure; and a third surface, which extends from the second surface, is disposed to face a direction substantially perpendicular to the first surface, and includes a directional hairline structure.

Description

Case of electronic device and manufacturing method thereof

Various embodiments of the present disclosure relate to a case of an electronic device and a method of manufacturing the case.

BACKGROUND ART With the remarkable development of information and communication technology and semiconductor technology, the dissemination and use of various electronic devices are rapidly increasing. In particular, recent electronic devices are being developed to be portable and to be able to communicate.

An electronic device is a device that performs a specific function according to a loaded program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an image/audio device, a desktop/laptop computer, and a vehicle navigation device from a home appliance can mean For example, these electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases and high-speed and large-capacity wireless communication becomes common, various functions may be mounted in one electronic device such as a mobile communication terminal in recent years. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into one electronic device. will be. Such electronic devices are being miniaturized so that users can conveniently carry them.

The electronic device includes an exterior material (eg, a case) made of various materials, and the exterior material may be manufactured to protect internal components of the electronic device from external impact, to be easily carried by a user, and to provide a feeling of beauty.

In a recent smart home environment, functions and designs of various electronic devices are being manufactured to meet the user's preferred needs for user convenience or work efficiency.

In general, in an electronic device, all surfaces of an exterior material surface are subjected to the same anodizing treatment, so that color and/or gloss differentiation cannot be displayed on each surface, thereby limiting design implementation.

The electronic device according to the present disclosure may vary patterns before and after the anodizing treatment on the surface of the exterior material to indicate different patterns or differences in gloss for each area of the exterior material.

In the electronic device according to the present disclosure, at least a portion of the surface of the exterior material may be formed semi-gloss and/or matte, so that appearance defects such as scratches, tool marks, dents, and presses may not be exposed.

However, the problems to be solved in the present disclosure are not limited to the above-mentioned problems, and may be variously expanded without departing from the spirit and scope of the present invention.

An electronic device according to various embodiments of the present disclosure includes a case that forms at least a part of an exterior of the electronic device, a battery disposed in an inner space of the case, and a battery disposed in the inner space and transmits information to the outside It may include a display for displaying. The case forms at least a portion of the front surface or the rear surface of the electronic device, and has a first surface formed of a matte surface, a first angle extending from the first surface, and a random hairline structure. a second surface comprising a second surface, and a third surface extending from the second surface, disposed to face a direction substantially perpendicular to the first surface, and including a directional hairline structure.

An electronic device according to various embodiments of the present disclosure may include a housing, a battery disposed in an inner space of the housing, and a display for displaying information to the outside. The outer surface of the housing is disposed to face the opposite direction of the inner space, a first surface formed with a matte surface, a first angle extending from the first surface, is formed with a first gloss, and a first hairline a second surface comprising a structure, a third surface extending from the second surface and disposed to face substantially perpendicular to the first surface, the third surface being formed in a second luster and comprising a second hairline structure, the third surface comprising a second hairline structure; a fourth surface extending from and forming a designated second angle, a fourth surface formed of the first glazing and including the first hairline structure; and a fourth surface extending from the fourth surface and substantially parallel to the first surface; , may include a fifth surface formed of the matte.

In a method of manufacturing an electronic device case according to various embodiments of the present disclosure, a first surface of a case base material facing a first direction and a fifth surface facing a second direction opposite to the first direction are flatly processed, and sand A process of performing a blaster (sand blast), a second surface forming a designated first angle with respect to the first surface of the case base material, and forming a second angle corresponding to the first angle with respect to the fifth surface 4 A process of primary PCD (polycrystalline diamond) treatment of the surface, secondary PCD treatment of a third surface formed between the second surface and the fourth surface of the case base material and disposed to be substantially perpendicular to the first surface and anodizing the second surface, the third surface, and the fourth surface.

The electronic device case according to various embodiments of the present disclosure may provide an exterior material having a beautiful design by forming a double hairline structure.

The electronic device case according to various embodiments of the present disclosure may provide an exterior material having a beautiful design by providing different shapes and luster to a plurality of surfaces.

In the electronic device case according to various embodiments of the present disclosure, defects caused by anodizing surface film removal may be resolved by performing an anodizing process a plurality of times.

Effects obtainable in the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned may be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. will be.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure;

3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure;

4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;

5A is a view illustrating an outer surface of an electronic device case according to various embodiments of the present disclosure;

FIG. 5B is a cross-sectional view illustrating a case of an electronic device taken along line AA′ in FIG. 3 , according to various embodiments of the present disclosure;

6 is a flowchart illustrating an operation of forming a case of an electric device according to various embodiments of the present disclosure;

7 is a schematic diagram illustrating an operation of forming a case of an electronic device according to various embodiments of the present disclosure;

8A and 8B are views of an external surface applied to an electronic device case with the naked eye, according to one of various embodiments of the present disclosure;

9A, 9B, and 9C are views with a digital microscope (dino) of an external surface applied to an electronic device case, according to one of various embodiments of the present disclosure;

10A and 10B are views of a cross-section of an electronic device case viewed through a microscope, according to one of various embodiments of the present disclosure;

11 is a view illustrating a 3D optical (dimensional) measuring device for a surface of an electronic device case according to one of various embodiments of the present disclosure;

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included. In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, the program 140 ) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) capable of operating independently or together with the main processor 121 . (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can be The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the co-processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations performed by the electronic device 101 may be executed by one or more external devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, a processor (eg, processor 120 ) of a device (eg, electronic device 101 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed online (eg download or upload), directly between smartphones (eg smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

2 is a perspective view of a front side of an electronic device, according to various embodiments of the present disclosure; 3 is a perspective view of a rear surface of an electronic device, according to various embodiments of the present disclosure;

2 and 3 , the electronic device 200 according to an exemplary embodiment has a first side (or front side) 210A, a second side (or back side) 210B, and a first side 210A. and a housing 210 including a side surface 210C surrounding the space between the second surfaces 210B. In another embodiment (not shown), the housing may refer to a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C of FIG. 2 . According to an embodiment, the first surface 210A may be formed by a first plate 202 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent. The second surface 210B may be formed by the substantially opaque second plate 211 . The second plate 211 may be formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. can be formed. The side surface 210C is coupled to the first plate 202 and the second plate 211 and may be formed by a side member 218 including a metal and/or a polymer. In some embodiments, the second plate 211 and the side member 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).

According to an embodiment, the electronic device 200 includes a display 201 , an audio module 203 , a sensor module 204 , a camera module 205 , a key input device 206 , a light emitting element 207 , and a connector. at least one or more of the holes 208 . In some embodiments, the electronic device 200 may omit at least one of the components (eg, the light emitting device 207 ) or additionally include other components.

The display 201 may be exposed through a substantial portion of the first plate 202 , for example. In some embodiments, the edge of the display 201 may be formed to be substantially the same as an adjacent outer shape of the first plate 202 . In another embodiment (not shown), in order to expand the area to which the display 201 is exposed, the distance between the outer edge of the display 201 and the outer edge of the first plate 202 may be substantially the same.

In another embodiment (not shown), a recess or opening is formed in a part of the screen display area of the display 201 , and the audio module 203 is aligned with the recess or the opening, the sensor It may include at least one of a module 204 , a camera module 205 , and a light emitting device 206 . In another embodiment (not shown), the display 200 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type pen input device. can be placed.

The audio module 203 may include a microphone hole and a speaker hole. In the microphone hole, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. The speaker hole may include an external speaker hole and/or a receiver hole for a call. In some embodiments, the microphone hole and the speaker hole may be implemented as a single hole, or a speaker may be included without a speaker hole (eg, a piezo speaker).

The sensor module 204 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. The sensor module 204 may, for example, be disposed on the first side 210A or the second side 210B of the housing 210 , and additionally or alternatively, may also be disposed on the side 210C. have. The sensor module includes at least one of a proximity sensor, an ambient light sensor, a biometric sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a temperature sensor, or a humidity sensor. may include more.

The camera module 205 includes a first camera device 205 - 1 disposed on the first surface 210A of the electronic device 200 , and a second camera device 205 - 2 disposed on the second surface 210B of the electronic device 200 . ), and/or flash 205 - 3 . The camera devices 205 - 1 and 250 - 2 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 205 - 3 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .

The key input device 206 may be disposed on the side surface 210C of the housing 210 . In other embodiments, the electronic device 200 may not include some or all of the key input devices 206 mentioned above and the not included key input devices 206 may be displayed on the display 201 as soft keys, etc. It can be implemented in the form

The light emitting device 207 may be disposed, for example, on the first surface 210A of the housing 210 . The light emitting device 207 may provide, for example, state information of the electronic device 200 in the form of light. In another embodiment, the light emitting device 207 may provide, for example, a light source that is linked to the operation of the camera module 205 . The light emitting element 207 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector hole 208 is a connector hole that can accommodate a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or for transmitting and receiving an audio signal with an external electronic device It may include a connector hole capable of receiving a connector (eg, an earphone jack).

4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;

Referring to FIG. 4 , the electronic device 300 includes a side bezel structure 310 (eg, the side member 218 of FIG. 2 ), a first support member 311 (eg, a bracket), and a first plate 320 . ), a display 330 , an electromagnetic induction panel 370 , a printed circuit board 340 , a battery 350 , and a second plate 350 . In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 311 ) or additionally include other components. At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 200 of FIG. 1 or 2 , and overlapping descriptions will be omitted below.

According to various embodiments, the electromagnetic induction panel 370 (eg, a digitizer) may be a panel for detecting an input of the pen input device. For example, the electromagnetic induction panel 370 may include a printed circuit board (PCB) (eg, flexible printed circuit board (FPCB)) and a shielding sheet. The shielding sheet may prevent interference between the components by an electromagnetic field generated from components (eg, a display module, a printed circuit board, an electromagnetic induction panel, etc.) included in the electronic device 300 . The shielding sheet blocks electromagnetic fields generated from the components, so that an input from the pen input device can be accurately transmitted to a coil included in the electromagnetic induction panel 370 .

According to various embodiments, the first support member 311 may be disposed inside the electronic device 300 and connected to the side bezel structure 310 , or may be integrally formed with the side bezel structure 310 . The first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 311 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface. The printed circuit board 340 may be equipped with a processor, memory, and/or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

According to various embodiments, the memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

According to various embodiments, the battery 350 is a device for supplying power to at least one component of the electronic device 300 , for example, a non-rechargeable primary battery, or a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 . The battery 350 may be integrally disposed inside the electronic device 300 , or may be disposed detachably from the electronic device 300 .

According to various embodiments, the electronic device 300 may further include an antenna (not shown). According to an embodiment, an antenna (not shown) may be disposed between the second plate 360 and the battery 350 . An antenna (not shown) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. An antenna (not shown) may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.

5A is a view illustrating an outer surface of an electronic device case according to various embodiments of the present disclosure; FIG. 5B is a cross-sectional view illustrating a case of an electronic device taken along line AA′ in FIG. 3 , according to various embodiments of the present disclosure;

According to various embodiments, the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a case (eg, the housing 310 of FIG. 2 ) that forms at least a part of the exterior of the electronic device 101 ); It may include a display (eg, the display 330 of FIG. 4 ). According to an embodiment, the configuration of the case 400 and the display 330 of FIGS. 5A and 5B includes the side bezel structure 310 (or the first support member 331 ) and the display 330 of FIG. 4 . ) may be the same in some or all of the configuration.

According to various embodiments, the case 400 forms a first surface 410 disposed to face the rear surface (eg, P1 direction) of the electronic device 101, a first angle designated from the first surface 410, A second surface 420 that extends, a third surface 430 extending from the second surface 420 and disposed to face a direction substantially perpendicular to the first surface 410 , designated from the third surface 430 . a fourth surface 440 extending at a second angle, and a fifth surface 450 extending from the fourth surface 440 and disposed substantially parallel to the first surface 410 . .

According to another embodiment, the case 400 includes a first surface 410 , a second surface 420 , a third surface 430 , a fourth surface 440 , and a fifth surface 450 , each The surfaces may be arranged to face different directions. For example, the case 400 extends from the first surface 410 and the first surface 410 disposed to face the first direction P1 that is opposite to the internal space S of the electronic device 101 . and a second surface 420 disposed to face the second direction P2 , a third surface 430 extending from the second surface 420 and disposed to face the third direction P3 , a third A fourth surface 440 extending from the surface 430 and disposed to face the fourth direction P4 and a fifth surface extending from the fourth surface 440 and disposed to face the fifth direction P5 (450). According to an embodiment, the first surface 410 may be the back surface of the electronic device 101 , and the fifth surface 450 may be the front surface of the electronic device 101 disposed in parallel with the display 330 . . The second surface 420 , the third surface 430 , and the fourth surface 440 may be side surfaces of the electronic device 101 .

According to various embodiments, the first surface 410 , the second surface 420 , the third surface 430 , the fourth surface 440 , and the fifth surface 450 of the case 400 are flat surfaces. can be formed. According to an exemplary embodiment, at least a portion (eg, an edge region) of the first surface 410 and/or the fifth surface 450 may be formed as a curved surface that faces in different directions depending on a location.

According to various embodiments, the second surface 420 and the fourth surface 440 may be formed as flat surfaces, and may include surfaces having different inclinations with respect to the third surface 430 . For example, the second surface 420 may be formed to have a first angle θ1 designated with respect to the first surface 430 , and the fourth surface 440 may be formed with a designated first angle θ1 with respect to the third surface 430 . It may be formed to have a second angle θ2. In some embodiments, the second surface 420 and the fourth surface 440 may extend from both ends of the third surface 430 and may be disposed to face different directions. As another example, the designated first angle θ1 may be approximately 30 to 70 degrees from the extension line of one end of the first surface 410 , and the designated second angle θ1 is the extension of the other end of the third surface 430 . It may be approximately 30 to 70 degrees from the line. According to one embodiment, the point where the second surface 420 and the third surface 430 meet and/or the point where the fourth surface 440 and the third surface 430 meet may be formed as a smooth continuous curved surface. .

According to various embodiments, the material of the base material of the case 400 may include at least one of a metal material, a synthetic resin material, a wood material, or an artificial marble material. In an embodiment, the base material of the case 400 of the electronic device may be made of a metal material, and the metal material may include at least one of aluminum, magnesium, titanium, and stainless steel. In the illustrated embodiment, the base material of the case 400 of the electronic device may be made of aluminum.

According to various embodiments, the first surface 410 may be formed to be substantially matte. The first surface 410 may be implemented by flatly processing the outer surface of the base material of the case 400 , performing a sand blasting process, and performing a primary anodizing process. According to one embodiment, the primary anodizing treatment may be performed simultaneously on the entire surface together with the first surface 410 .

According to various embodiments, the fifth surface 450 may be formed to be substantially matte. The fifth surface 450 may be a surface facing substantially in a direction opposite to the first surface 410 . The fifth surface 450 may be implemented by flatly processing the outer surface of the base material of the case 400, performing a sand blasting process, and then performing a primary anodizing process. According to one embodiment, the primary anodizing treatment may be performed simultaneously on the entire surface together with the fifth surface 450 . According to an embodiment, the structures of the first surface 410 and the fifth surface 450 may be formed at the same time.

According to various embodiments, the second surface 420 may be substantially formed of a first gloss, and may include a first shape. For example, the first shape may be a first hairline structure including unpatterned hairlines. As another example, the first shape may be a first hairline structure including random hairlines. According to one embodiment, the second surface 420 may be the first anodized surface is removed by a first PCD (polycrystalline diamond) processing tool, and reprocessed to form a non-patterned hairline structure. have. A PCD (polycrystalline diamond) processing tool is a strong composite obtained by sintering diamond particles under ultra-high temperature and high pressure. Compared with a monocrystalline diamond (MCD) machining tool, which is generally used for dia cutting, a PCD machining tool can form hairline structures without additional processing when machining a metal material. have. The second surface 420 may be implemented by performing a polycrystalline diamond (PCD) processing process and then performing a secondary anodizing process. According to an embodiment, the secondary anodizing process may be performed simultaneously with the third surface 430 and the fourth surface 440 .

According to various embodiments, the fourth surface 440 may be formed substantially of the first glaze and may include a first shape. For example, the first shape may be a first hairline structure including unpatterned hairlines. As another example, the first shape may be a first hairline structure including random hairlines. According to one embodiment, the fourth surface 440 is the first anodized surface is removed by the first PCD (polycrystalline diamond) processing tool (tool), and reprocessed to form a first hairline structure without a pattern can be formed The fourth surface 440 may be implemented by performing a polycrystalline diamond (PCD) processing process and then performing a secondary anodizing process. According to an embodiment, the secondary anodizing treatment may be performed simultaneously with the second surface 420 and the fourth surface 440 .

According to an embodiment, the structures of the second surface 420 and the fourth surface 440 may be simultaneously formed. After the first anodizing treatment of the first surface 410 and the fifth surface 450, the part to be processed (eg, the second surface 420, and/or the fourth surface 440) is subjected to PCD processing, anodizing It can prevent fading. According to one embodiment, the use of a PCD processing tool is disclosed to process the second surface 420 and/or the fourth surface 440 , but is not limited thereto, and product specifications and/or beautiful hairline A variety of tools can be used for presentation, such as MCD machining tools or tools made of carbide.

According to the present disclosure, the hairlines of the second surface 420 and the fourth surface 440 express the appearance of the case 400 in a sophisticated and detailed pattern, so that the electronic device 101 has a beautiful overall appearance. can do.

According to various embodiments, the third surface 430 may be formed substantially of the second glaze and may include a second shape. According to an embodiment, the second gloss may mean light having a lower degree of gloss than the first gloss of the second surface 420 (or the fourth surface 440 ). The third surface 430 forming the second gloss may form a less scattered light by forming a more even density of the surface layer than the second surface 420 (or the fourth surface 440) forming the first gloss. have. The second gloss may be understood as semi-gloss. According to another embodiment, the third surface 430 may be formed to be matte and may include a second shape.

According to an embodiment, the second shape may be a second hairline structure including hairlines forming one pattern. For example, the second shape may be a second hairline structure including directional hairlines. As another example, the second shape may include hairlines arranged with a predetermined interval, and the specified interval may be about 0.01 to 0.015 mm. According to one embodiment, the third surface 430 may be the first anodized surface is removed by a second PCD (polycrystalline diamond) processing tool, and then reprocessed to form hairlines having a pattern. . The second PCD processing tool for processing the third surface 430 may be a processing tool including a designated pattern, and the head in contact with the third surface 430 is provided at a predetermined interval with a protrusion line parallel to the longitudinal direction of the side surface of the case can be formed with The third surface 430 may be implemented by performing a second polycrystalline diamond (PCD) processing process and then performing a secondary anodizing process. According to an embodiment, the secondary anodizing treatment may be performed simultaneously with the second surface 420 and the fourth surface 440 . The second surface 420 , the third surface 430 , and the fourth surface 440 may be subjected to secondary anodizing at once to prevent anodizing film removal due to pattern processing of the third surface 430 .

According to one embodiment, although the use of a PCD processing tool has been disclosed to process the third surface 430, it is not limited thereto, and an MCD processing tool, or carbide for product specifications and/or beautiful hairline expression. A variety of tools are available, such as the material tool.

According to the present disclosure, the first hairline structure of the second surface 420 and/or the fourth surface 440 and the second hairline structure of the third surface 430 may reflect the needs of consumers in the electronic device exterior material. By implementing the double hairline structure and expressing it in a refined and detailed pattern, the overall appearance of the electronic device 101 can be made beautiful.

6 is a flowchart illustrating an operation of forming a case of an electric device according to various embodiments of the present disclosure; 7 is a schematic diagram illustrating an operation of forming a case of an electronic device according to various embodiments of the present disclosure;

The structures of the first surface 410 , the second surface 420 , the third surface 430 , the fourth surface 440 , and the fifth surface 450 disclosed in the electronic device case manufacturing process of FIGS. 6 and 7 are , the structure and some or all of the first surface 410 , the second surface 420 , the third surface 430 , the fourth surface 440 , and the fifth surface 450 of the case of FIGS. 5A and 5B are can be the same.

Hereinafter, since the exterior material of the electronic device is not processed (eg, primary PCD or secondary PCD processing), the configuration before the case is formed is defined as a case base material 400a, and each surface of the case base material is a first base material It may be defined as a surface 410a, a second base material surface 420a, a third base material surface 430a, a fourth base material surface 440a, and a fifth base material surface 450a.

According to various embodiments, the electronic device case may be machined using a CNC device. For example, after the electronic device case base material 400a is placed on the table of the CNC (computer numerical control) device and fixed, each side surface of the case base material 400a may be machined through various cutting tools.

In step 1000, the first base material surface 410a and the fifth base material surface 450a of the case base material 410a may be machined. According to an embodiment, the first surface 410 of the processed case 400 may form the rear surface of the electronic device, and the fifth surface 450 is the front surface of the electronic device 101 , for example, a display. It may be a bezel area formed at an edge. The first surface 410 and the fifth surface 450 may be machined into a flat surface. According to one embodiment, at least a portion of the first surface 410 and the fifth surface 450 may be formed as curved surfaces facing different directions according to positions.

Thereafter, in step 2000 , a sand blasting process may be performed on the processed first surface 410 and the fifth surface 450 . The first surface 410 and the fifth surface 450 provided through a sand blast process may form a matte finish. However, the first surface 410 and the fifth surface 450 are not limited to the sand blasting process, and other processes capable of forming matte may be used.

Then, in step 3000, the entire surface of the case may be subjected to a primary anodizing (anodizing) treatment. According to one embodiment, along with a first surface 410 and a fifth surface 450 that are machined, a second surface 420a, a third surface 430a and a fourth surface 440a, which are not machined, are used. can be subjected to primary anodizing (anodizing) treatment.

Thereafter, in step 4000, the second base material surface 420a and/or the fourth base material surface 440a of the case base material 400a may be subjected to primary PCD (polycrystalline diamond) processing. The second base material surface 420a and the fourth base material surface 440a of the case base material 400a may be processed simultaneously or sequentially. According to one embodiment, the first anodized surface is removed from the second base material surface 420a and the fourth base material surface 440a by a first PCD (polycrystalline diamond) processing tool 510, It is possible to form a hairline structure of the pattern. The first PCD processing tool 510 is for forming a side edge line of the outer surface of the electronic device, and the processing head may be flat or form a partially curved surface. The second surface 420 and/or the fourth surface 440 formed by primary PCD (polycrystalline diamond) processing may prevent film removal of the anodized film generated by primary anodizing.

Thereafter, in step 5000, the third base material surface 430a of the case base material 400a may be subjected to secondary PCD (polycrystalline diamond) processing. According to one embodiment, the third base material surface 430a of the case base material 400a has a first anodized surface removed by a second PCD (polycrystalline diamond) processing tool 520, and has a pattern A hairline structure may be formed. The second PCD processing tool 520 is for forming a side line of the outer surface of the electronic device, and the processing head may be flat or form a partially curved surface. According to an embodiment, the machining head may include protrusion lines formed side by side at a predetermined interval. The third surface 430 processed by the processing head may form hairlines parallel to the longitudinal direction of the side surface and having a predetermined interval. The specified spacing may be approximately 0.01 to 0.015 mm.

According to an embodiment, steps 4000 and 5000 may be performed in a reverse order. For example, after first machining the third base material surface 430a using the second PCD machining tool 520 , the second base material surface 420a and/or the second base material surface 420a using the first PCD machining tool 510 . 4 It is possible to process the base material surface (440a).

Thereafter, in step 6000 , the second surface 420 , the third surface 430 , and the fourth surface 440 may be subjected to secondary anodizing treatment. According to an embodiment, as the second surface 420, the third surface 430, and the fourth surface 440 are anodized at the same time, it is possible to prevent film removal of the anodized film generated by the primary anodizing. According to one embodiment, the second surface 420 and the fourth surface 440 that have been subjected to the primary PCD processing and anodizing may form a gloss. According to another embodiment, the third surface 430 subjected to secondary PCD processing and anodizing may form a semi-gloss or matte finish.

8A and 8B are views of an external surface applied to an electronic device case with the naked eye, according to one of various embodiments of the present disclosure;

According to various embodiments, the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a case (eg, a housing (eg, the electronic device 101 of FIGS. housing 310)). According to an embodiment, the case 400 may include a first surface 410 , a second surface 420 , a third surface 430 , a fourth surface 440 , and a fifth surface 450 . have.

8A shows the outer surface of the actual case, and FIG. 8B is a sequential representation of parts of the case constituting the different outer surfaces for each process for comparison.

The configuration of the first surface 410 of FIG. 8A and the configuration of the first portion 610 of FIG. 8B may apply mutatis mutandis to the configuration of the first surface 410 (and/or the fifth surface) of FIGS. 5A to 7 . The first surface 410 of FIG. 8A and the first portion 610 of FIG. 8B are anodized surfaces after a sand blast process. It can be seen with the naked eye that the first surface 410 (and the first portion 610) has a matte structure.

The configuration of the second surface 420 , the fourth surface 440 of FIG. 8A , and the second portion 620 of FIG. 8B is the configuration of the second surface 420 , the fourth surface 440 of FIGS. 5A-7 . can be applied mutatis mutandis. The second surface 420 , the fourth surface 440 of FIG. 8A , and the second portion 620 of FIG. 8B are first anodized on the surface with a first polycrystalline diamond (PCD) processing tool (eg, FIG. 8B ). 7, a non-patterned hairline structure is formed by the first PCD processing tool 510), and the surface is subjected to secondary anodizing. With the naked eye, it can be seen that the second and fourth surfaces 420 and 440 (and the second portion 620 ) are formed of a glossy, and non-directional hairlines are formed.

The configuration of the third surface 430 of FIG. 8A and the configuration of the third part 630 of FIG. 8B may apply mutatis mutandis to the configuration of the third surface 430 of FIGS. 5A to 7 . The third surface 430 of FIG. 8A and the third portion 630 of FIG. 8B are formed on the surface that has been first anodized with a second polycrystalline diamond (PCD) processing tool (eg, the second PCD processing tool of FIG. 7 ). (520)) to form a hairline structure of a certain pattern, and is a surface subjected to secondary anodizing. With the naked eye, it can be seen that the third surface 430 (and the third portion 630 ) is formed in semi-gloss or matte, and hairline structures having constant directionality are formed.

9A, 9B, and 9C are views with a digital microscope (dino) of an external surface applied to an electronic device case, according to one of various embodiments of the present disclosure; 9A, 9B, and 9C are enlarged views of a portion of the P region of FIG. 8A, respectively.

FIG. 9A is a first surface 410 and/or a fifth surface 450 of FIGS. 5A to 7 , and the surface can be clearly identified by a digital microscope. Referring to FIG. 9A , it can be seen that the first surface 410 and/or the fifth surface 450 are surfaces made by sanding particles, do not have a hairline structure, and are matte surfaces.

FIG. 9B is the second surface 420 and/or the fourth surface 440 of FIGS. 5A to 7 , and the surface can be clearly identified by a digital microscope. Referring to FIG. 9B , it can be confirmed that the second surface 420 and/or the fourth surface 440 is a surface formed of gloss with non-uniform pitch between hairlines and scattering of light.

FIG. 9C is a third surface 430 of FIGS. 5A to 7 , and the surface can be clearly identified by a digital microscope. Referring to FIG. 9C , it can be confirmed that the third surface 430 is a surface formed of semi-gloss or matte hairlines having uniform pitch and low light scattering.

10A and 10B are views of a cross-section of an electronic device case viewed through a microscope, according to one of various embodiments of the present disclosure;

FIG. 10A is the second surface 420 and/or fourth surface 440 of FIGS. 5A-7 , showing a microscopic view of the second surface 420 and/or fourth surface 440 forming a thickness. The cross section can be clearly seen. Referring to FIG. 10A , it can be seen that the second surface 420 and/or the fourth surface 440 is a non-patterned hairline surface, and a structure such as a separate screw thread does not appear.

FIG. 10B is a third surface 430 of FIGS. 5A to 7 , and a surface forming a predetermined thickness can be clearly identified under a microscope. Referring to FIG. 10B , it can be seen that the third surface 430 is a patterned hairline surface, and it can be seen that the pitch is uniform and the structures in the form of threads forming a depth greater than or equal to a certain level are repeatedly arranged. For example, the distance may be approximately 0.03 to 0.07 mm, and the depth may be approximately 0.01 to 0.02 mm. As another example, the distance may be about 0.05 mm, and the depth may be about 0.015 mm.

11 is a view illustrating a 3D optical (dimensional) measuring device for a surface of an electronic device case according to one of various embodiments of the present disclosure;

According to various embodiments, the first portion 710 of FIG. 11 is the second surface 420 and/or the fourth surface 440 of FIGS. 5A-7 , and the first portion 710 forms a patternless pattern. It can be confirmed that the surface is formed with irregular hairline structures.

According to various embodiments, the second portion 720 of FIG. 11 is the third surface 430 of FIGS. 5A-7 , and the second portion 720 includes hairline structures having regular spacing to form a pattern. It can be confirmed that the surface is

An electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) according to various embodiments of the present disclosure includes a case (eg, the case 400 of FIGS. 5A and 5B ) that forms at least a part of an exterior of the electronic device )), a battery (eg, the battery 350 of FIG. 4 ) disposed in the inner space of the case, and a display (eg, the display of FIG. 4 ) positioned in the internal space to display information to the outside (330)). The case forms at least a portion of a front or rear surface of the electronic device, and includes a first surface (eg, a first surface 410 in FIGS. 5A and 5B ) formed to be matte, a first angle designated from the first surface. A second surface (eg, second surface 420 in FIGS. 5A and 5B ) that extends and includes a random hairline structure that forms (eg, first angle θ1 in FIG. 5B ). , and a third surface extending from the second surface and disposed to face substantially perpendicular to the first surface and comprising a directional hairline structure (eg, the third surface of FIGS. 5A and 5B ) 430)) may be included.

According to various embodiments, the case includes a random hairline structure that extends from the third surface to form a designated second angle (eg, the second angle θ2 in FIG. 5B ). a fourth surface (eg, fourth surface 440 of FIGS. 5A and 5B ), and a fifth surface extending from the fourth surface, disposed substantially parallel to the first surface, and formed to be matte (eg: fifth surface 450 of FIGS. 5A and 5B ).

According to various embodiments, the designated first angle and the designated second angle may be the same.

According to various embodiments, the second surface may be formed in a first glossy, and the third surface may be formed in the second glossy or matte by providing less scattered light than the second surface.

According to various embodiments, the fourth surface may be formed of a first gloss.

According to various embodiments, the hairline structure of the third surface may form a pattern in which a plurality of hairlines are arranged to be spaced apart from each other at predetermined intervals.

According to various embodiments, the specified gap may be 0.01 to 0.015 mm.

According to various embodiments, the second surface may be formed by first polycrystalline diamond (PCD) processing and anodizing, and the third surface may be formed by secondary PCD processing and the anodizing.

According to various embodiments, the second surface is configured such that a base material of the second surface is in surface contact with the flat-faced head of the first PCD machining tool, so that random hairlines are formed, and the third surface Silver, the base material of the third surface may be in surface contact with the head on which the protruding lines of the second PCD processing tool are formed, so that directional hairlines may be formed.

According to various embodiments, the fourth surface may be formed by anodizing after the first polycrystalline diamond (PCD) processing, and the primary PCD processing of the second surface and the fourth surface may be simultaneously processed.

According to various embodiments, the anodizing treatment of the second surface may include a primary anodizing treatment performed before the first PCD processing and a secondary anodizing treatment performed after the primary PCD processing. The anodizing treatment of the third surface may include a primary anodizing treatment performed before the secondary PCD processing and a secondary anodizing treatment performed after the secondary PCD processing.

According to various embodiments, the fourth surface is formed by anodizing after primary PCD processing, and the anodizing treatment of the fourth surface is a primary anodizing treatment and primary PCD processing performed before primary PCD processing It may include a secondary anodizing treatment performed after.

According to various embodiments, the secondary anodizing treatment may be simultaneously performed on the second surface, the third surface, and the fourth surface.

According to various embodiments, the first surface may be formed by a sand blast process and anodizing process.

According to various embodiments, the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a housing (eg, the housing 210 of FIG. 2 ) and a battery disposed in an inner space of the housing (eg, the battery 350 of FIG. 4 ) and a display for externally displaying information (eg, the display 330 of FIG. 4 ). The outer surface of the housing is disposed to face the opposite direction of the inner space, and a first surface (eg, the first surface 410 of FIGS. 5A and 5B ) formed to be matte, a first angle designated from the first surface a second surface (eg, the second surface 420 in FIGS. 5A and 5B ) extending from the second surface, the second surface being formed of a first glaze and including a first hairline structure, the second surface extending from the second surface and including the first a third surface (eg, third surface 430 in FIGS. 5A and 5B ) disposed to face substantially perpendicular to the surface, the third surface being formed of a second glaze and comprising a second hairline structure, from the third surface; a fourth surface (eg, fourth surface 440 in FIGS. 5A and 5B ) that extends forming a second designated angle, is formed of the first glaze and includes the first hairline structure, and the fourth surface and a fifth surface extending from the surface, substantially parallel to the first surface, and formed of the matte surface (eg, fifth surface 450 in FIGS. 5A and 5B ).

According to various embodiments, the designated first angle and the designated second angle may be the same.

According to various embodiments, the first hairline structure may include random hairlines, and the second hairline structure may include hairlines extending in parallel along a longitudinal direction of the third surface. can

According to various embodiments of the present disclosure, in a method of manufacturing an electronic device case, a first base material surface (eg, the first base material surface 410a of FIG. 7 ) facing a first direction of a case base material and a second direction opposite to the first direction A process of flat machining the fifth base material surface (eg, the fifth base material surface 450a of FIG. 7 ) facing toward With respect to a second substrate surface (eg, second substrate surface 420a ) and a fifth machined surface (eg, fifth surface 450 in FIG. 7 ) that form a first designated angle with respect to surface 410 ). A process of primary PCD (polycrystalline diamond) treatment of a fourth base material surface (eg, the fourth base material surface 440a of FIG. 7 ) forming a second angle corresponding to the first angle, the second of the case base material A process of secondary PCD treatment of a third base material surface (eg, the third base material surface 430a in FIG. 7 ) formed between the base material surface and the fourth base material surface and disposed to be substantially perpendicular to the first surface; and anodizing the first PCD-treated second surface, the fourth surface, and the secondary PCD-treated third surface.

According to various embodiments, after performing sand blasting on the first surface and the fifth surface, the first surface, the second surface, the third surface, the fourth surface, and the fifth surface It may further include a process of anodizing the surface.

According to various embodiments, the second surface is such that the second substrate surface is in face contact with the flat-faced head of the first PCD machining tool, so that the random hairlines are formed, the third surface Silver, the surface of the third base material may be in surface contact with the head on which the protruding lines of the second PCD processing tool are formed, so that directional hairlines may be formed.

The electronic device case of the various embodiments of the present disclosure described above and the electronic device including the same are not limited by the above-described embodiments and drawings, and various substitutions, modifications, and changes are possible within the technical scope of the present disclosure. It will be apparent to those of ordinary skill in the art to which the invention pertains.

Claims (15)

1. In an electronic device,

   a case forming at least a part of an exterior of the electronic device;

   a battery disposed in an inner space of the case; and

   Located in the inner space, including a display for displaying information to the outside, the case,

   a first surface forming at least a portion of a front surface or a rear surface of the electronic device and formed of a matte surface;

   a second surface extending from the first surface forming a designated first angle and comprising a random hairline structure; and

   and a third surface extending from the second surface and disposed to face a direction substantially perpendicular to the first surface, the third surface including a directional hairline structure.
2. According to claim 1, wherein the case,

   a fourth surface extending at a designated second angle from the third surface and comprising a random hairline structure; and

   and a fifth surface extending from the fourth surface, disposed to be substantially parallel to the first surface, and formed to be matte.
3. 3. The method of claim 2,

   The specified first angle and the specified second angle are the same.
4. According to claim 1,

   The second surface is formed of a first glare, and the third surface provides less scattered light than the second surface, and thus the second surface is formed of the second glaze or matte.
5. 5. The method of claim 4,

   The fourth surface of the electronic device is formed of a first gloss.
6. According to claim 1,

   The hairline structure of the third surface forms a pattern in which a plurality of hairlines are arranged to be spaced apart from each other at predetermined intervals.
7. 7. The method of claim 6,

   The specified gap is 0.01 to 0.015 mm in an electronic device.
8. According to claim 1,

   The second surface is formed by a first PCD (polycrystalline diamond) processing, and anodizing,

   and the third surface is formed by secondary PCD processing and the anodizing treatment.
9. 9. The method of claim 8,

   wherein the second surface is in surface contact with the head of the flat surface of the first PCD machining tool, the base material of the second surface, the random hairlines are formed;

   In the third surface, the base material of the third surface is in surface contact with the head on which the protruding lines of the second PCD processing tool are formed, so that directional hairlines are formed.
10. 9. The method of claim 8,

    The fourth surface is formed by the anodizing treatment after the first PCD (polycrystalline diamond) processing,

    and wherein the first PCD processing of the second surface and the fourth surface is simultaneously processed.
11. 11. The method of claim 10,

    The anodizing treatment of the second surface includes a primary anodizing treatment performed before the first PCD processing and a secondary anodizing treatment performed after the primary PCD processing,

    The anodizing treatment of the third surface includes a primary anodizing treatment performed before the secondary PCD processing and a secondary anodizing treatment performed after the secondary PCD processing.
12. 12. The method of claim 11,

    The fourth surface is formed by anodizing after the first PCD processing,

    The anodizing treatment of the fourth surface includes a primary anodizing treatment performed before the first PCD processing and a secondary anodizing treatment performed after the primary PCD processing.
13. 13. The method of claim 12,

    The secondary anodizing treatment is simultaneously performed on the second surface, the third surface, and the fourth surface.
14. According to claim 1,

    The first surface is formed by a sand blast process and an anodizing process.
15. In an electronic device,

    housing;

    a battery disposed in an inner space of the housing; and

    Including a display for displaying information to the outside, the outer surface of the housing,

    a first surface disposed to face the opposite direction of the inner space and formed of a matte surface;

    a second surface extending from the first surface forming a designated first angle, the second surface being formed of a first luster and comprising a first hairline structure;

    a third surface extending from the second surface and disposed to face substantially perpendicular to the first surface, the third surface being formed of a second luster and comprising a second hairline structure;

    a fourth surface extending from the third surface forming a designated second angle, the fourth surface being formed in the first glaze and including the first hairline structure; and

    and a fifth surface extending from the fourth surface and substantially parallel to the first surface and formed with the matte finish.

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