WO2022022393A1 - 导航模块的封装结构和电子设备 - Google Patents

导航模块的封装结构和电子设备 Download PDF

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Publication number
WO2022022393A1
WO2022022393A1 PCT/CN2021/107972 CN2021107972W WO2022022393A1 WO 2022022393 A1 WO2022022393 A1 WO 2022022393A1 CN 2021107972 W CN2021107972 W CN 2021107972W WO 2022022393 A1 WO2022022393 A1 WO 2022022393A1
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WO
WIPO (PCT)
Prior art keywords
substrate
chip
navigation module
air pressure
acceleration
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Application number
PCT/CN2021/107972
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English (en)
French (fr)
Inventor
王德信
许婧
Original Assignee
青岛歌尔智能传感器有限公司
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Publication of WO2022022393A1 publication Critical patent/WO2022022393A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
    • G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
    • G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
    • G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L11/00—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S19/00—Satellite radio beacon positioning systems; Determining position, velocity or attitude using signals transmitted by such systems
    • G01S19/38—Determining a navigation solution using signals transmitted by a satellite radio beacon positioning system
    • G01S19/39—Determining a navigation solution using signals transmitted by a satellite radio beacon positioning system the satellite radio beacon positioning system transmitting time-stamped messages, e.g. GPS [Global Positioning System], GLONASS [Global Orbiting Navigation Satellite System] or GALILEO
    • G01S19/42—Determining position
    • G01S19/45—Determining position by combining measurements of signals from the satellite radio beacon positioning system with a supplementary measurement
    • G01S19/47—Determining position by combining measurements of signals from the satellite radio beacon positioning system with a supplementary measurement the supplementary measurement being an inertial measurement, e.g. tightly coupled inertial
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S19/00—Satellite radio beacon positioning systems; Determining position, velocity or attitude using signals transmitted by such systems
    • G01S19/38—Determining a navigation solution using signals transmitted by a satellite radio beacon positioning system
    • G01S19/39—Determining a navigation solution using signals transmitted by a satellite radio beacon positioning system the satellite radio beacon positioning system transmitting time-stamped messages, e.g. GPS [Global Positioning System], GLONASS [Global Orbiting Navigation Satellite System] or GALILEO
    • G01S19/42—Determining position
    • G01S19/48—Determining position by combining or switching between position solutions derived from the satellite radio beacon positioning system and position solutions derived from a further system
    • G01S19/49—Determining position by combining or switching between position solutions derived from the satellite radio beacon positioning system and position solutions derived from a further system whereby the further system is an inertial position system, e.g. loosely-coupled

Definitions

  • the present application relates to the technical field of semiconductor packaging, and in particular, to a packaging structure of a navigation module and an electronic device.
  • the navigation module includes GPS (Global Positioning System (Global Positioning System) chip, inertial device, acceleration sensor (Accelerometer sensor) and gyroscope (Gyroscope sensor) and other related sensor chips, in the packaging process, the above chips are directly mounted on the substrate, through the plastic package.
  • GPS Global Positioning System
  • Inertial device Inertial device
  • acceleration sensor Accelelerometer sensor
  • gyroscope Gyroscope sensor
  • the main purpose of this application is to propose a package structure for a navigation module, which aims to reduce the overall size of the package structure and improve the waterproofness to ensure the navigation accuracy.
  • the package structure of the navigation module proposed in the present application includes a substrate, a GPS chip, an auxiliary sensor assembly and a waterproof package; the GPS chip is arranged in the substrate; the auxiliary sensor assembly is arranged in the substrate, and It is electrically connected to the GPS chip through the wiring in the substrate; the waterproof package is connected to the substrate and encapsulates the substrate and the auxiliary sensor assembly.
  • the packaging structure of the navigation module further includes a casing disposed on the substrate, and the casing is disposed around the outer periphery of the waterproof package.
  • the housing includes a plurality of side plates fixedly connected with the base plate, the plurality of side plates and the base plate are enclosed to form an inner cavity with an opening, the waterproof package and The auxiliary sensor components are all disposed in the inner cavity, and the waterproof packaging member is disposed in close contact with the side plate.
  • the waterproof package is a waterproof glue; the outer periphery of the waterproof package is provided with a casing, and the casing is a metal shell.
  • the auxiliary sensor assembly includes an air pressure sensor, and the air pressure sensor is electrically connected to the GPS chip through wiring in the substrate.
  • the air pressure sensor includes an air pressure MEMS chip and an air pressure ASIC chip, the air pressure MEMS chip is disposed on the surface of the substrate, the air pressure ASIC chip is disposed inside the substrate, and the air pressure The MEMS chip and the pneumatic ASIC chip are electrically connected through wirings in the substrate.
  • the auxiliary sensor assembly further includes an acceleration sensor, a gyroscope, and an inertial device, and the acceleration sensor, the gyroscope, the inertial device, and the GPS chip pass through wiring in the substrate electrical connection.
  • the acceleration sensor includes an acceleration MEMS chip and an acceleration ASIC chip
  • the gyroscope includes a gyroscope MEMS chip and a gyroscope ASIC chip
  • the acceleration MEMS chip and the gyroscope MEMS chip are provided in the surface of the substrate
  • the acceleration ASIC chip and the gyroscope ASIC chip are arranged inside the substrate.
  • the acceleration MEMS chip and the gyro MEMS chip integrate a MEMS module.
  • the acceleration ASIC chip and the gyroscope ASIC chip integrate an ASIC module.
  • the present application also provides an electronic device, including the packaging structure of the above-mentioned navigation module;
  • the packaging structure of the navigation module includes a substrate, a GPS chip, an auxiliary sensor assembly and a waterproof package;
  • the GPS chip is provided in the the auxiliary sensor assembly is arranged on the base plate and is electrically connected to the GPS chip through the wiring in the base plate;
  • the waterproof package is connected to the base plate and encapsulates the base plate and the auxiliary sensor components.
  • the GPS chip is arranged inside the substrate, the auxiliary sensor component is arranged in the substrate, and is electrically connected with the GPS chip through the substrate, so as to reduce the overall size of the packaging structure of the navigation module,
  • a waterproof package is arranged in the package structure to encapsulate the substrate and the auxiliary sensor components, so as to improve the waterproofness of the package structure of the navigation module, thereby reducing the overall size of the package structure.
  • the function of improving waterproofness further ensures the navigation accuracy.
  • FIG. 1 is a schematic structural diagram of an embodiment of a packaging structure of a navigation module of the present application
  • FIG. 2 is a schematic structural diagram of an acceleration ASIC chip disposed in a substrate in an embodiment of the package structure of the navigation module of the present application;
  • FIG. 3 is a schematic structural diagram of an acceleration ASIC chip and a gyroscope ASIC chip arranged in a substrate in an embodiment of the package structure of the navigation module of the present application;
  • FIG. 4 is a schematic structural diagram of an acceleration ASIC chip and a gyroscope ASIC chip integrated module disposed inside a substrate in an embodiment of the package structure of the navigation module of the present application;
  • FIG. 5 is a schematic structural diagram of an acceleration ASIC chip, a gyroscope ASIC chip and an air pressure ASIC chip arranged in a substrate in an embodiment of the package structure of the navigation module of the application;
  • FIG. 6 is a schematic structural diagram of an acceleration ASIC chip, a gyroscope ASIC chip and an air pressure ASIC chip integrated module disposed inside a substrate in an embodiment of the package structure of the navigation module of the present application.
  • the present application proposes a package structure of a navigation module.
  • the package structure of the navigation module includes a substrate 1 , a GPS chip 2 , an auxiliary sensor assembly and a waterproof package 3 ;
  • the GPS chip 2 is provided in the
  • the auxiliary sensor assembly is arranged on the substrate 1, and is electrically connected to the GPS chip 2 through the wiring 11 in the substrate 1;
  • the waterproof package 3 is connected to the substrate 1, and encapsulates the substrate 1 and the GPS chip 2.
  • the navigation module mainly provides precise positioning and guidance.
  • the GPS chip 2 and some other auxiliary sensors are used in the navigation module for precise positioning.
  • the GPS chip 2 is arranged in the substrate 1, which reduces the The overall size of the package structure of the navigation module.
  • the auxiliary sensor assembly is arranged on the substrate 1, and is electrically connected to the GPS chip 2 through the wiring in the substrate 1, so as to realize the communication connection between the various sensor chips, so as to ensure the realization of the navigation function. 1 and the auxiliary sensor assembly are encapsulated to improve the waterproofness of the encapsulation structure of the navigation module, thereby realizing the function of reducing the overall size and improving the waterproofness at the same time.
  • the GPS chip 2 is disposed in the substrate 1, and can be electrically connected to the auxiliary sensor assembly through the wiring 11 in the substrate 1, so that the package structure is more compact.
  • the wiring 11 in the substrate 1 can be set The upper and lower sides of the GPS chip 2 play a shielding role, which further improves the anti-interference ability of the navigation module.
  • the auxiliary sensor component provides a more accurate positioning function for the GPS chip 2 .
  • the auxiliary sensor component may include an inertial device 8 , an acceleration sensor 6 , and a gyroscope 7 .
  • the waterproof package 3 is a waterproof glue.
  • the GPS chip 2 is arranged inside the substrate 1, and the auxiliary sensor assembly is arranged in the substrate 1, and is electrically connected to the GPS chip 2 through the substrate 1, so as to reduce the overall packaging structure of the navigation module.
  • a waterproof package 3 is arranged in the package structure to encapsulate the substrate 1 and the auxiliary sensor components, so as to improve the waterproofness of the package structure of the navigation module, thereby reducing the cost of the navigation module.
  • the overall size of the small package structure improves the waterproof function, which further ensures the navigation accuracy.
  • the packaging structure of the navigation module further includes a casing 4 disposed on the substrate 1 , and the casing 4 is surrounded by the waterproof packaging. perimeter of piece 3.
  • the casing 4 is arranged around the outer periphery of the waterproof package 3, then during the packaging process of the navigation module, the casing 4 can be installed on the substrate 1 first, and then injected into the cavity formed by the casing 4 and the substrate 1.
  • the waterproof encapsulation member 3 is used to realize the waterproof encapsulation function, and at the same time, the casing 4 enhances the stability of the overall strength of the encapsulation structure.
  • the housing 4 includes a plurality of side plates 41 fixedly connected with the base plate 1 , and the plurality of side plates 41 are enclosed with the base plate 1 to form an open cavity , the waterproof packaging member 3 and the auxiliary sensor assembly are both arranged in the inner cavity, and the waterproof packaging member 3 and the side plate 41 are arranged to fit together.
  • the housing 4 includes a plurality of side plates 41, and the plurality of side plates 41 are all connected to the substrate 1 and enclose with the substrate 1 to form an open cavity, the auxiliary sensor assembly is arranged in the inner cavity, and the waterproof package 3 encapsulates in the inner cavity to realize the functions of the packaging substrate 1 and the auxiliary sensor assembly, and at the same time, the waterproof packaging member 3 is attached to the side plate 41 to prevent a gap between the waterproof packaging member 3 and the side plate 41, and further ensures the waterproofness.
  • the sealing of the package improves the waterproof performance.
  • the casing 4 is a metal casing, which improves the waterproof effect and ensures the reliability of the packaging structure.
  • the auxiliary sensor component includes an air pressure sensor 5 , and the air pressure sensor 5 is connected to the air pressure sensor 5 through the wiring 11 in the substrate 1 .
  • the GPS chip 2 is electrically connected.
  • the air pressure sensor 5 plays the role of sensing the external pressure, and the air pressure sensor 5 is set in the package structure, so that the navigation module can perceive the weather changes, air pressure changes of the external environment, air pressure changes at different altitudes, and changes in water at different depths.
  • the pressure change is used to determine the corresponding altitude measurement, so as to realize the function of further improving the navigation accuracy.
  • the air pressure sensor 5 can sense the external air pressure or pressure through the deformation effect of the external pressure on the waterproof glue.
  • the air pressure sensor 5 includes an air pressure MEMS chip 51 and an air pressure ASIC chip 52 , the air pressure MEMS chip 51 is provided on the surface of the substrate 1 , and the air pressure ASIC chip 51
  • the chip 52 is disposed inside the substrate 1 , and the pneumatic MEMS chip 51 and the pneumatic ASIC chip 52 are electrically connected through the wiring 11 in the substrate 1 .
  • the air pressure ASIC chip is arranged inside the substrate 1 , and the air pressure MEMS chip 51 is arranged on the surface of the substrate 1 , thereby reducing the overall size of the package structure.
  • the air pressure MEMS chip 51 and the air pressure ASIC chip 52 are electrically connected through the wiring 11 in the substrate 1 to ensure the normal operation of the air pressure sensor 5 .
  • the wirings 11 in the substrate 1 can be arranged on the upper and lower sides of the air pressure ASIC chip 52 to play a shielding role and block electromagnetic interference of the air pressure ASIC chip 52 to the air pressure MEMS chip 51 .
  • the auxiliary sensor assembly further includes an acceleration sensor 6 , a gyroscope 7 and an inertial device 8 .
  • the inertial device 8 and the GPS chip 2 are electrically connected through the wiring 11 in the substrate 1 .
  • the inertial device 8 mainly measures the motion of the carrier in the inertial reference system, integrates it with time, and transforms it into the navigation coordinate system, so as to obtain information such as speed, yaw angle and position in the navigation coordinate system.
  • the acceleration sensor 6 functions to measure acceleration.
  • the gyroscope 7 plays the role of angular motion detection. The above components are electrically connected to each other to ensure the normal navigation function of the entire navigation module.
  • the acceleration sensor 6 includes an acceleration MEMS chip 61 and an acceleration ASIC chip 62 , and the acceleration MEMS chip 61 is provided on the substrate 1 .
  • the acceleration ASIC chip 62 is arranged inside the substrate 1 .
  • the acceleration ASIC chip 62 is arranged inside the substrate 1, which further reduces the overall size of the package structure.
  • the wiring 11 inside the substrate 1 can be arranged on the upper and lower sides of the acceleration ASIC chip 62 to achieve shielding and anti-interference. effect.
  • the air pressure ASIC chip 52 and the acceleration ASIC chip 62 are both disposed in the substrate 1, then the two chips can be disposed in the substrate 1 respectively, or can be integrated into a module and disposed together in the substrate 1. inside the substrate 1.
  • the air pressure MEMS chip 51 and the acceleration MEMS chip 61 are both disposed on the surface of the substrate 1, then the two chips can be disposed on the surface of the substrate 1 respectively, or can be integrated into a module together Set on the surface of the substrate 1 .
  • the gyroscope 7 includes a gyroscope MEMS chip 71 and a gyroscope ASIC chip 72 , and the gyroscope MEMS chip 71 is provided in the On the surface of the substrate 1 , the gyroscope ASIC chip 72 is provided inside the substrate 1 .
  • the gyroscope ASIC chip 72 is arranged inside the substrate 1, which further reduces the overall size of the package structure. Anti-interference effect.
  • the air pressure ASIC chip 52, the acceleration ASIC chip 62 and the gyroscope ASIC chip 72 are all arranged in the substrate 1, then the three chips can be arranged in the substrate 1 respectively, or can be integrated. It is arranged in the substrate 1 together as a module. Of course, it is also possible to integrate only two of the chips as one module arranged in the substrate 1.
  • the air pressure ASIC chip 52 and the acceleration ASIC chip 62 can be integrated into one module
  • the acceleration ASIC chip 62 and the gyro ASIC chip 72 are integrated into one module
  • the air pressure ASIC chip 52 and the gyro ASIC chip 72 are integrated into one module.
  • the air pressure MEMS chip 51, the acceleration MEMS chip 61 and the gyroscope MEMS chip 71 are all disposed on the surface of the substrate 1, then the three chips can be disposed on the surface of the substrate 1 respectively, or can be integrated into a module and disposed together on the surface of the substrate 1.
  • the surface of the substrate 1, of course, can also be any two chips integrated into a module set on the surface of the substrate 1, for example, the air pressure MEMS chip 51 and the acceleration MEMS chip 61 can be integrated into one module, the acceleration MEMS chip 61 and the gyroscope MEMS chip 71 One module is integrated or the air pressure MEMS chip 51 and the gyroscope MEMS chip 71 are integrated into one module.
  • the present application also proposes an electronic device, which includes a packaging structure of a navigation module.
  • the specific structure of the packaging structure of the navigation module refers to the above-mentioned embodiments. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, at least All the beneficial effects brought by the technical solutions of the above embodiments are not repeated here.
  • the electronic device may be a wearable device such as a watch or a bracelet, or a mobile terminal device such as a mobile phone and a tablet computer.

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  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Automation & Control Theory (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)

Abstract

一种导航模块的封装结构和包括封装结构的电子设备。导航模块的封装结构包括基板（1）、GPS芯片（2）、辅助传感器组件以及防水封装件（3）；GPS芯片（2）设于基板（1）内；辅助传感器组件设于基板（1），并通过基板内的布线与GPS芯片（2）电连接；防水封装件（3）连接于基板（1），并封装基板(1)和辅助传感器组件，实现了减小封装结构的整体尺寸的同时提高防水性的功能。

Description

导航模块的封装结构和电子设备
本申请要求于2020年7月29日申请的、申请号为202021543337.4的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及半导体封装技术领域，特别涉及一种导航模块的封装结构和电子设备。
 背景技术
随着科技的发展，电子产品越来越智能化和小型化，如穿戴式智能手环或手表等设备越来越受到人们的青睐，电子产品中的导航模块已经成为人们不可或缺的功能。
相关技术中，导航模块包括GPS（Global Positioning System，全球定位系统）芯片、惯性器件、加速度传感器（Accelerometer sensor）和陀螺仪（Gyroscope sensor）等相关传感芯片，在封装过程中，直接将上述各个芯片贴装到基板上，通过塑封件封装起来，但是上述方式封装的导航模块的整体尺寸较大且防水性能较差，在遇水的环境中使用时，会影响导航精度。
 技术问题
本申请的主要目的是提出一种导航模块的封装结构，旨在减小封装结构的整体尺寸的同时提高防水性，以保证导航精度。
 技术解决方案
为实现上述目的，本申请提出的导航模块的封装结构，包括基板、GPS芯片、辅助传感器组件以及防水封装件；所述GPS芯片设于所述基板内；所述辅助传感器组件设于基板，并通过所述基板内的布线与所述GPS芯片电连接；所述防水封装件连接于所述基板，并封装所述基板和所述辅助传感器组件。
在本申请一实施例中，所述导航模块的封装结构还包括设于所述基板的外壳，所述外壳围设在所述防水封装件的外周。
在本申请一实施例中，所述外壳包括与所述基板固定连接的多个侧板，多个所述侧板与所述基板围合形成具有敞口的内腔，所述防水封装件和所述辅助传感器组件均设于所述内腔，且所述防水封装件与所述侧板贴合设置。
在本申请一实施例中，所述防水封装件为防水胶；所述防水封装件的外周围设有外壳，所述外壳为金属壳体。
在本申请一实施例中，所述辅助传感器组件包括气压传感器，所述气压传感器通过所述基板内的布线与所述GPS芯片电连接。
在本申请一实施例中，所述气压传感器包括气压MEMS芯片和气压ASIC芯片，所述气压MEMS芯片设于所述基板的表面，所述气压ASIC芯片设于所述基板的内部，所述气压MEMS芯片与所述气压ASIC芯片通过所述基板内的布线电连接。
在本申请一实施例中，所述辅助传感器组件还包括加速度传感器、陀螺仪以及惯性器件，所述加速度传感器、所述陀螺仪、所述惯性器件以及所述GPS芯片通过所述基板内的布线电连接。
在本申请一实施例中，所述加速度传感器包括加速度MEMS芯片和加速度ASIC芯片，所述陀螺仪包括陀螺仪MEMS芯片和陀螺仪ASIC芯片；所述加速度MEMS芯片和所述陀螺仪MEMS芯片设于所述基板的表面；所述加速度ASIC芯片和所述陀螺仪ASIC芯片设于所述基板的内部。
在本申请一实施例中，所述加速度MEMS芯片和所述陀螺仪MEMS芯片集成MEMS模块。
在本申请一实施例中，所述加速度ASIC芯片和所述陀螺仪ASIC芯片集成ASIC模块。
为实现上述目的，本申请还提供一种电子设备，包括上述的导航模块的封装结构；该导航模块的封装结构包括基板、GPS芯片、辅助传感器组件以及防水封装件；所述GPS芯片设于所述基板内；所述辅助传感器组件设于基板，并通过所述基板内的布线与所述GPS芯片电连接；所述防水封装件连接于所述基板，并封装所述基板和所述辅助传感器组件。
 有益效果
本申请技术方案导航模块的封装结构中，通过将GPS芯片设置于基板的内部，辅助传感器组件设于基板，并通过基板与GPS芯片电连接，以实现降低导航模块封装结构整体的尺寸的同时，保证导航模块能够精准定位导航的功能，同时在该封装结构中设置防水封装件将基板和辅助传感器组件封装起来，以提高导航模块封装结构的防水性，从而实现了减小封装结构的整体尺寸的同时提高防水性的功能，进一步保证了导航精度。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请导航模块的封装结构一实施例的结构示意图；
图2为本申请导航模块的封装结构实施例中加速度ASIC芯片设于基板内的结构示意图；
图3为本申请导航模块的封装结构实施例中加速度ASIC芯片与陀螺仪ASIC芯片设于基板内的结构示意图；
图4为本申请导航模块的封装结构实施例中加速度ASIC芯片与陀螺仪ASIC芯片集成模块设于基板内部的结构示意图；
图5为本申请导航模块的封装结构实施例中加速度ASIC芯片、陀螺仪ASIC芯片以及气压ASIC芯片设于基板内的结构示意图；
图6为本申请导航模块的封装结构实施例中加速度ASIC芯片、陀螺仪ASIC芯片以及气压ASIC芯片集成模块设于基板内部的结构示意图。
附图标号说明：
标号 名称 标号 名称
1 基板 11 布线
2 GPS芯片 3 防水封装件
4 外壳 41 侧板
5 气压传感器 51 气压MEMS芯片
52 气压ASIC芯片 6 加速度传感器
61 加速度MEMS芯片 62 加速度ASIC芯片
7 陀螺仪 71 陀螺仪MEMS芯片
72 陀螺仪ASIC芯片 8 惯性器件
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，若本申请实施例中有涉及方向性指示（诸如上、下、左、右、前、后……），则该方向性指示仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种导航模块的封装结构。
在本申请实施例中，如图1、图2和图3所示，该导航模块的封装结构包括基板1、GPS芯片2、辅助传感器组件以及防水封装件3；所述GPS芯片2设于所述基板1内；辅助传感器组件设于基板1，并通过所述基板1内的布线11与所述GPS芯片2电连接；防水封装件3连接于所述基板1，并封装所述基板1和所述辅助传感器组件。
导航模块主要提供精准定位并且导向的作用，导航模块中会采用GPS芯片2和一些其它的辅助传感器进行精准定位，在该导航模块的封装结构中，GPS芯片2设置在基板1内，减小了导航模块的封装结构的整体尺寸。辅助传感器组件设于基板1，并通过基板1内的布线与GPS芯片2电连接，以实现各个传感芯片之间的通信连接，从而保证导航功能的实现，同时，通过防水封装件3将基板1和辅助传感器组件封装起来，以提高导航模块的封装结构的防水性，从而实现了减小整体尺寸的同时提高防水性的功能。
可以理解的，GPS芯片2设置在基板1内，并能够通过基板1内的布线11与辅助传感器组件进行电连接，使得封装结构更加地紧凑，可选地，该基板1内的布线11可设置在GPS芯片2的上下两侧，以起到屏蔽的作用，进一步提高了导航模块的抗干扰能力。
在实际应用过程中，导航模块在应用时，辅助传感器组件为GPS芯片2提供更加精准的定位功能，可选地，该辅助传感器组件可包括惯性器件8、加速度传感器6以及陀螺仪7等。
为了使得导航模块的封装结构的防水效果更好，该防水封装件3为防水胶。
本申请技术方案导航模块的封装结构中，通过将GPS芯片2设置于基板1的内部，辅助传感器组件设于基板1，并通过基板1与GPS芯片2电连接，以实现降低导航模块封装结构整体的尺寸的同时，保证导航模块能够精准定位导航的功能，同时在该封装结构中设置防水封装件3将基板1和辅助传感器组件封装起来，以提高导航模块封装结构的防水性，从而实现了减小封装结构的整体尺寸的同时提高防水性的功能，进一步保证了导航精度。
为了使得导航模块的封装结构的防水效果更好，参照图1和图2，所述导航模块的封装结构还包括设于所述基板1的外壳4，所述外壳4围设在所述防水封装件3的外周。可以理解的，外壳4围设在防水封装件3的外周，则在该导航模块封装过程中，可先将外壳4安装在基板1上，然后向外壳4与基板1围合形成的腔体内注入防水封装件3，以实现防水封装功能，同时，外壳4增强了封装结构整体强度的稳定性。
进一步地，参照图1和图2，所述外壳4包括与所述基板1固定连接的多个侧板41，多个所述侧板41与所述基板1围合形成具有敞口的内腔，所述防水封装件3和所述辅助传感器组件均设于所述内腔，且所述防水封装件3与所述侧板41贴合设置。外壳4包括多个侧板41，该多个侧板41均与基板1连接，并与基板1围合形成具有敞口的内腔，辅助传感器组件设于该内腔内，防水封装件3封装于该内腔内，以实现封装基板1和辅助传感器组件的功能，同时该防水封装件3与侧板41贴合，以防止防水封装件3与侧板41之间具有间隙，进一步保证了防水封装的密封性，提高了防水性能。
可选地，所述外壳4为金属壳体，提高防水效果的同时保证了封装结构的可靠性。
为了进一步提高导航模块的导航精度，参照图1和图2，在本申请一实施例中，所述辅助传感器组件包括气压传感器5，所述气压传感器5通过所述基板1内的布线11与所述GPS芯片2电连接。气压传感器5起到感知外界压力的作用，该封装结构中设置了气压传感器5，使得该导航模块能够通过感知外界环境的天气变化、气压变化、不同海拔时的气压变化以及水下不同深度时的压力变化，来确定对应的海拔高度的测量，从而实现进一步提高导航精准度的功能。
可以理解的是，由于该气压传感器5需要感知外界的压力变化，则在上述实施例的基础上，气压传感器5可通过外界压力对防水胶的形变作用实现对外界气压或压力的感知。
在本申请一实施例中，参照图1和图5，所述气压传感器5包括气压MEMS芯片51和气压ASIC芯片52，所述气压MEMS芯片51设于所述基板1的表面，所述气压ASIC芯片52设于所述基板1的内部，所述气压MEMS芯片51与所述气压ASIC芯片52通过所述基板1内的布线11电连接。气压ASIC芯片设于基板1的内部，气压MEMS芯片51设置在基板1的表面，减小了封装结构的整体尺寸。气压MEMS芯片51与所述气压ASIC芯片52通过所述基板1内的布线11电连接，以保证气压传感器5的正常运行。
可选地，基板1内的布线11可设置在气压ASIC芯片52的上下两侧，以起到屏蔽作用，阻挡了气压ASIC芯片52对气压MEMS芯片51的电磁干扰。
在本申请一实施例中，参照图3、图4、图5和图6，所述辅助传感器组件还包括加速度传感器6、陀螺仪7以及惯性器件8，所述加速度传感器6、所述陀螺仪7、所述惯性器件8以及所述GPS芯片2通过所述基板1内的布线11电连接。
惯性器件8主要通过测量载体在惯性参考系的运动，将它对时间进行积分，且把它变换到导航坐标系中，就能够得到在导航坐标系中的速度、偏航角和位置等信息。加速度传感器6起到测量加速度的作用。陀螺仪7起到角运动检测的作用。上述各个器件互相电连接，以保证整个导航模块的正常导航功能。
在本申请一实施例中，参照图2、图3、图5和图6，所述加速度传感器6包括加速度MEMS芯片61和加速度ASIC芯片62，所述加速度MEMS芯片61设于所述基板1的表面，所述加速度ASIC芯片62设于所述基板1的内部。加速度ASIC芯片62设于基板1的内部，进一步减小了封装结构的整体尺寸，可选地，可通过将基板1内部的布线11分设在加速度ASIC芯片62的上下两侧，以达到屏蔽抗干扰的作用。
可选地，在前述实施例的基础上，气压ASIC芯片52和加速度ASIC芯片62均设置在基板1内，则该两个芯片可分别设置在基板1内，也可集成为一个模块一起设置在基板1内。
可选地，在前述实施例的基础上，气压MEMS芯片51和加速度MEMS芯片61均设置在基板1的表面，则该两个芯片可分别设置在基板1的表面，也可集成为一个模块一起设置在基板1表面。
在本申请一实施例中，参照图3、图4、图5和图6，所述陀螺仪7包括陀螺仪MEMS芯片71和陀螺仪ASIC芯片72，所述陀螺仪MEMS芯片71设于所述基板1的表面，所述陀螺仪ASIC芯片72设于所述基板1的内部。陀螺仪ASIC芯片72设于基板1的内部，进一步减小了封装结构的整体尺寸，可选地，可通过将基板1内部的布线11分设在陀螺仪ASIC芯片72的上下两侧，以达到屏蔽抗干扰的作用。
可选地，在前述实施例的基础上，气压ASIC芯片52、加速度ASIC芯片62以及陀螺仪ASIC芯片72均设置在基板1内，则该三个芯片可分别设置在基板1内，也可集成为一个模块一起设置在基板1内，当然，也可以只集成其中两个芯片为一个模块设置在基板1内部的情况，如可将气压ASIC芯片52与加速度ASIC芯片62集成一个模块、加速度ASIC芯片62和陀螺仪ASIC芯片72集成一个模块、或者气压ASIC芯片52与陀螺仪ASIC芯片72集成一个模块。
可选地，气压MEMS芯片51、加速度MEMS芯片61以及陀螺仪MEMS芯片71均设置在基板1的表面，则该三个芯片可分别设置在基板1的表面，也可集成为一个模块一起设置在基板1表面，当然，也可以是其中任意两个芯片集成一个模块设置在基板1的表面，如可将气压MEMS芯片51与加速度MEMS芯片61集成一个模块、加速度MEMS芯片61与陀螺仪MEMS芯片71集成一个模块或者气压MEMS芯片51与陀螺仪MEMS芯片71集成一个模块。
本申请还提出一种电子设备，该电子设备包括导航模块的封装结构，该导航模块的封装结构的具体结构参照上述实施例，由于本电子设备采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。可选地，该电子设备可为手表或手环等穿戴设备，也可为手机、平板电脑等移动终端设备。
以上所述仅为本申请的优选实施例，并非因此限制本申请的专利范围，凡是在本申请的发明构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (10)

  1. 一种导航模块的封装结构，其中，包括：
    基板；
    GPS芯片，所述GPS芯片设于所述基板内；
    辅助传感器组件，所述辅助传感器组件设于基板，并通过所述基板内的布线与所述GPS芯片电连接；以及
    防水封装件，所述防水封装件连接于所述基板，并封装所述基板和所述辅助传感器组件。
  2. 如权利要求1所述的导航模块的封装结构，其中，所述导航模块的封装结构还包括设于所述基板的外壳，所述外壳围设在所述防水封装件的外周。
  3. 如权利要求2所述的导航模块的封装结构，其中，所述外壳包括与所述基板固定连接的多个侧板，多个所述侧板与所述基板围合形成具有敞口的内腔，所述防水封装件和所述辅助传感器组件均设于所述内腔，且所述防水封装件与所述侧板贴合设置。
  4. 如权利要求1所述的导航模块的封装结构，其中，所述防水封装件为防水胶；所述防水封装件的外周围设有外壳，所述外壳为金属壳体。
  5. 如权利要求1至4任意一项所述的导航模块的封装结构，其中，所述辅助传感器组件包括气压传感器，所述气压传感器通过所述基板内的布线与所述GPS芯片电连接。
  6. 如权利要求5所述的导航模块的封装结构，其中，所述气压传感器包括气压MEMS芯片和气压ASIC芯片，所述气压MEMS芯片设于所述基板的表面，所述气压ASIC芯片设于所述基板的内部，所述气压MEMS芯片与所述气压ASIC芯片通过所述基板内的布线电连接。
  7. 如权利要求6所述的导航模块的封装结构，其中，所述辅助传感器组件还包括加速度传感器、陀螺仪以及惯性器件，所述加速度传感器、所述陀螺仪、所述惯性器件以及所述GPS芯片通过所述基板内的布线电连接。
  8. 如权利要求7所述的导航模块的封装结构，其中，所述加速度传感器包括加速度MEMS芯片和加速度ASIC芯片，所述陀螺仪包括陀螺仪MEMS芯片和陀螺仪ASIC芯片；所述加速度MEMS芯片和所述陀螺仪MEMS芯片设于所述基板的表面；所述加速度ASIC芯片和所述陀螺仪ASIC芯片设于所述基板的内部。
  9. 如权利要求8所述的导航模块的封装结构，其中，所述加速度MEMS芯片和所述陀螺仪MEMS芯片集成MEMS模块；和/或，所述加速度ASIC芯片和所述陀螺仪ASIC芯片集成ASIC模块。
  10. 一种电子设备，其中，包括如权利要求1至9任意一项所述的导航模块的封装结构。
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CN212740733U (zh) * 2020-07-29 2021-03-19 青岛歌尔智能传感器有限公司 导航模块的封装结构和电子设备

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CN210123288U (zh) * 2019-05-27 2020-03-03 青岛歌尔智能传感器有限公司 多功能集成式传感器
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CN212740733U (zh) * 2020-07-29 2021-03-19 青岛歌尔智能传感器有限公司 导航模块的封装结构和电子设备

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