WO2022021797A1 - Distance measurement system and distance measurement method - Google Patents
Distance measurement system and distance measurement method Download PDFInfo
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- WO2022021797A1 WO2022021797A1 PCT/CN2020/141722 CN2020141722W WO2022021797A1 WO 2022021797 A1 WO2022021797 A1 WO 2022021797A1 CN 2020141722 W CN2020141722 W CN 2020141722W WO 2022021797 A1 WO2022021797 A1 WO 2022021797A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/483—Details of pulse systems
- G01S7/484—Transmitters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4817—Constructional features, e.g. arrangements of optical elements relating to scanning
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/483—Details of pulse systems
- G01S7/486—Receivers
- G01S7/4861—Circuits for detection, sampling, integration or read-out
- G01S7/4863—Detector arrays, e.g. charge-transfer gates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/483—Details of pulse systems
- G01S7/486—Receivers
- G01S7/4865—Time delay measurement, e.g. time-of-flight measurement, time of arrival measurement or determining the exact position of a peak
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/491—Details of non-pulse systems
- G01S7/4911—Transmitters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/491—Details of non-pulse systems
- G01S7/4912—Receivers
- G01S7/4913—Circuits for detection, sampling, integration or read-out
- G01S7/4914—Circuits for detection, sampling, integration or read-out of detector arrays, e.g. charge-transfer gates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/491—Details of non-pulse systems
- G01S7/4912—Receivers
- G01S7/4915—Time delay measurement, e.g. operational details for pixel components; Phase measurement
Definitions
- the present application relates to the technical field of optical ranging, and in particular, to a distance measurement system and a measurement method.
- the time of flight principle can be used to measure the distance of the target to obtain a depth image containing the depth value of the target, and the distance measurement system based on the time of flight principle has been widely used in consumer electronics, unmanned aerial vehicles, AR/VR and other fields.
- the distance measurement system based on the time-of-flight principle usually includes an emitter and a collector. The emitter is used to emit a pulsed beam to illuminate the target field of view, and the collector is used to collect the reflected beam, and the time required for the beam to be reflected and received is calculated to calculate the object. distance.
- collectors in distance measurement systems based on the time-of-flight principle include pixel arrays, in particular, pixel arrays based on single-photon avalanche photodiodes (SPADs).
- SPADs also known as Geiger Mode Avalanche Photodiodes (GM-APDs)
- GM-APDs Geiger Mode Avalanche Photodiodes
- the SPAD array is connected to a time-to-digital converter (TDC) and outputs photonic signals to the TDC.
- TDC time-to-digital converter
- the purpose of the present application is to provide a distance measurement system and a measurement method to solve at least one of the above background technical problems.
- An embodiment of the present application provides a distance measurement system, including an emitter and a collector arranged along a baseline, and a processing circuit connected to the emitter and the collector; wherein the emitter includes a light source array composed of multiple light sources, The light source array includes a plurality of sub-light source arrays, and the sub-light source arrays are configured to be turned on one by one along the baseline direction for emitting spot light beams; the collector includes a pixel array composed of a plurality of pixels, and the pixel array includes a plurality of sub-light sources.
- the processing circuit includes a plurality of sub-processing circuits, the sub-processing circuits One-to-one connection with the sub-pixel array to control the pixels in the sub-pixel array to start collecting photons in the reflected beam, and calculate the spot beam according to the photon signal output by the sub-pixel array The time-of-flight from emission to reflection back being acquired.
- the sub-light source array includes a row or a column of light sources; the sub-light source array is activated in sub-periods one by one under the control of the driving circuit to project the spot beam to the target field of view; wherein, in a measurement stage only A sub-light source array is activated until all sub-light source arrays are activated to complete the scanning of the entire target field of view.
- the scanning direction of the light source array is the same as the baseline direction.
- the pixel array is disposed in the same plane as the processing circuit.
- a diffractive optical element is also included, and the spot light beam emitted by the sub-light source array is replicated by the diffractive optical element and projected into the target field of view to form two sets of spot projection patterns, so as to scan the target field of view synchronously of the two regions.
- the pixel array is divided into a first pixel array and a second pixel array, each pixel array includes a plurality of the sub-pixel arrays; the processing circuit is correspondingly divided into a first processing circuit and a second processing circuit Each processing circuit includes a plurality of the sub-processing circuits; the first processing circuit and the second processing circuit are respectively arranged on both sides of the pixel array and are respectively connected with the first pixel array and the second pixel array.
- the pixel arrays are connected in a one-to-one correspondence, and are used for receiving the photon signals output by the pixels in the corresponding sub-pixel array and calculating the flight time of the light beam.
- the embodiment of the present application also provides a distance measurement method, comprising the following steps:
- the transmitter includes a light source array composed of a plurality of light sources, and the light source array includes a plurality of the sub-light source arrays;
- the processing circuit is configured to include a plurality of the sub-processing circuits; wherein the sub-pixel array is connected to the sub-processing circuits in a one-to-one correspondence.
- step S10 the sub-light source arrays are turned on one by one along the baseline direction to emit spot beams, until all sub-light source arrays are activated, and the scanning of the target field of view is completed; Or the spot light beams emitted by the light sources in the same row are all incident on some pixels in the same sub-pixel array, and the flight time of the light beams is calculated by the same sub-processing circuit.
- Embodiments of the present application further provide a computer device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor; wherein, when the processor executes the computer program, at least A distance measurement method is realized, and the distance measurement method includes the following steps: S10, controlling the sub-light source arrays in the transmitter to be turned on one by one, and emitting a spot beam toward the target field of view; wherein, the transmitter includes a plurality of light sources.
- a light source array the light source array includes a plurality of the sub-light source arrays; S20, controlling the pixels in the sub-pixel array of the collector to start to collect the photons in the reflected speckle beam, and form a photon signal; wherein, the The collector includes a pixel array composed of a plurality of pixels, and the pixel array includes a plurality of the sub-pixel arrays; S30. Use the sub-processing circuit in the processing circuit to receive the photon signal output by the corresponding sub-pixel array, and The time-of-flight of the speckle beam from being emitted to being collected is calculated from the photon signal.
- An embodiment of the present application provides a distance measurement system, including an emitter and a collector arranged along a baseline, and a processing circuit; wherein the emitter includes a light source array composed of multiple light sources, the light source array includes multiple sub-light source arrays, and the sub-light sources The array is configured to be turned on one by one along the baseline direction to emit the spot beams; the collector includes a pixel array composed of a plurality of pixels, the pixel array includes a plurality of sub-pixel arrays, and the plurality of sub-pixel arrays are configured to collect the spot beams reflected by the target object to be tested.
- the photons in the beam of the beam are reflected and a photon signal is formed;
- the processing circuit includes a plurality of sub-processing circuits, and the sub-processing circuits are connected with the sub-pixel array in one-to-one correspondence to control the activation of the pixels in the sub-pixel array, collect photons in the reflected beam, and calculate the flight time.
- the measurement system of the embodiment of the present application improves the spatial resolution, solves the problem of superpixel overlap, and improves the distance measurement accuracy; at the same time, the readout circuit and the pixel array are designed on the same plane, which reduces the TDC circuit and the histogram circuit. , effectively reducing the cost and complexity of the process.
- FIG. 1 is a schematic diagram of a distance measurement system according to an embodiment of the present application.
- FIG. 2 is a schematic diagram of a light source array of a distance measurement system according to an embodiment of the present application.
- FIG. 3 is a schematic diagram of a pixel unit of a distance measurement system according to an embodiment of the present application.
- FIG. 4 is a schematic diagram of a projected speckle pattern of a distance measurement system according to an embodiment of the present application.
- FIG. 5 is a schematic diagram of a pixel unit of a distance measurement system according to another embodiment of the present application.
- FIG. 6 is a flowchart of a distance measurement method according to still another embodiment of the present application.
- connection can be used for either a fixing function or a circuit connecting function.
- first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first”, “second” may expressly or implicitly include one or more of that feature. In the description of the embodiments of the present application, “plurality” means two or more, unless otherwise expressly and specifically defined.
- the distance measurement system 10 includes a transmitter 11 , a collector 12 , and a processing circuit 13 connected to the transmitter 11 and the collector 12 respectively.
- the transmitter 11 is used to emit a light beam 30 to the target area 20, and the light beam is emitted into the space of the target area to illuminate the target object in the space; at least part of the emitted light beam 30 is reflected by the target area 20 to form a reflected beam 40, and the reflected beam 40 At least a part of the light beams are received by the collector 12;
- the processing circuit 13 is connected to the transmitter 11 and the collector 12 respectively, and synchronizes the trigger signals of the transmitter 11 and the collector 12 to calculate the time required for the beam to be received from emission to reflection , namely the flight time t between the emitted light beam 30 and the reflected light beam 40, and further, the distance D of the corresponding point on the target object can be calculated by the following formula:
- the transmitter 11 includes a light source 111, an emission optical element 112, a driver 113, and the like.
- the light source 111 may be a light emitting diode (LED), a laser diode (LD), an edge emitting laser (EEL), a vertical cavity surface emitting laser (VCSEL), etc., or a one-dimensional or two-dimensional light source composed of multiple light sources array.
- the light source array is a VCSEL array light source chip formed by generating multiple VCSEL light sources on a single semiconductor substrate, and the arrangement of the light sources in the light source array may be regular or irregular.
- the light beam emitted by the light source 111 may be visible light, infrared light, ultraviolet light, or the like.
- the light source 111 emits light beams outward under the control of the driver 113 .
- the light source 111 emits a pulsed beam at a certain frequency (pulse period) under the control of the driver 113, which can be used in direct time-of-flight (Direct TOF) measurement, and the frequency is set according to the measurement distance.
- a part of the processing circuit 13 or a sub-circuit existing independently of the processing circuit 13 can also be used to control the light source 111 to emit light beams.
- the emission optical element 112 receives the light beam emitted from the light source 111 and shapes it to project it onto the target area.
- the transmitting optical element 112 receives the pulsed light beam from the light source 111, performs optical modulation on the pulsed light beam, such as modulation of diffraction, refraction, reflection, etc., and then emits the modulated light beam into space, such as a focused beam, Flood beams, structured light beams, etc.
- the emission optical element 112 may be one or a combination of one or more of a lens, a liquid crystal element, a diffractive optical element, a microlens array, a metasurface optical element, a mask, a mirror, a MEMS galvanometer, and the like.
- the collector 12 includes a pixel unit 121, a filter unit 122 and a receiving optical element 123; wherein, the receiving optical element 123 is used to receive at least part of the light beam reflected back by the target and guide it to the pixel unit 121, and the filter unit 122 is used to filter out the background light or stray light.
- the pixel unit 121 includes a two-dimensional pixel array composed of a plurality of pixels; in some embodiments, the pixel unit 121 is a pixel array composed of a single-photon avalanche photodiode (SPAD), and the SPAD can respond to an incident single photon and output A signal indicating the time of arrival of the received photon response at each SPAD enables the acquisition of weak optical signals and the calculation of time of flight using methods such as time-correlated single photon counting (TCSPC).
- TCSPC time-correlated single photon counting
- a readout circuit (not shown in the figure) composed of one or more of a signal amplifier, a time-to-digital converter (TDC), a digital-to-analog converter (ADC) and other devices connected to the pixel unit 121 .
- TDC time-to-digital converter
- ADC digital-to-analog converter
- These circuits can be integrated with the pixel, as a part of the pixel unit, or as a part of the processing circuit 13 , and will be regarded as a part of the processing circuit 13 for ease of description later.
- the processing circuit 13 synchronizes the trigger signals of the transmitter 11 and the collector 12, processes the photon signal of the pixel collected beam, and calculates the distance information of the target to be measured based on the flight time of the reflected beam.
- the SPAD outputs a photon signal in response to an incident single photon
- the processing circuit 13 receives the photon signal and performs signal processing to obtain the time-of-flight of the light beam.
- the processing circuit 13 calculates the number of collected photons to form continuous time bins, and these time bins are connected together to form a statistical histogram to reproduce the time series of reflected light beams, and use peak matching and filter detection to identify the reflected light beam from emission to reflection Returns the received flight time.
- the processing circuit 13 may be an independent dedicated circuit, such as a dedicated SOC chip, an FPGA chip, an ASIC chip, etc., or may include a general-purpose processing circuit.
- the distance measurement system 10 further includes a memory for storing a pulse encoding program, and the encoding program is used to control the excitation time, emission frequency, etc. of the light beam emitted by the light source 111 .
- the distance measurement system 10 may further include devices such as a color camera, an infrared camera, and an IMU, and the combination with these devices can realize more abundant functions, such as 3D texture modeling, infrared face recognition, SLAM and other functions.
- devices such as a color camera, an infrared camera, and an IMU, and the combination with these devices can realize more abundant functions, such as 3D texture modeling, infrared face recognition, SLAM and other functions.
- the transmitter 11 and the collector 12 may also be arranged in a coaxial form, that is, the two are realized by optical devices with reflection and transmission functions, such as a half mirror and the like.
- FIG. 2 is a schematic diagram of a light source array in an embodiment of the present application.
- the light source array 21 is configured to be composed of a plurality of light sources 213 arranged on a single substrate (or on multiple substrates); wherein, the light source array 21 may be one-dimensional or two-dimensional, and may be regularly arranged It can also be arranged irregularly.
- the light source array 21 is an array VCSEL chip composed of a plurality of VCSEL light sources arranged on a semiconductor substrate.
- the light source array 21 can emit light beams of any wavelength, such as visible light, infrared light, ultraviolet light, and the like.
- the light source array 21 emits light under the modulation driving of the driving circuit (which may be a part of the processing circuit 13 ), such as continuous wave modulation, pulse modulation, etc.
- the light source array 21 can also emit light in groups under the control of the driving circuit.
- the light source array 21 is configured to include a plurality of sub-light source arrays 211, 212; each sub-light source array includes a row or a column of light sources, which needs to be set according to the direction of the baseline.
- the sub-light source arrays are activated one by one under the control of the driving circuit to project the spot beams to the target field of view, and only one sub-light source array is activated in a measurement stage until all sub-light source arrays are activated, and the entire target field of view is completed. Scanning; wherein, the scanning direction of the light source array (the activation sequence of the sub-light source array) is the same as the baseline direction (the connection line between the emitter and the collector).
- the sub-light source array is configured to include a row of light sources, and the sub-light source array is sequentially activated in the y direction to complete a frame of scanning.
- the light source array 21 includes 4 ⁇ 5 light sources, and each sub-light source array includes 5 light sources.
- each sub-light source array may also be disposed on a separate substrate, and controlled by different driving circuits to emit light in groups.
- the present application will be described in detail by taking the base line direction as the y direction as an example, and the vertical base line direction is set as the x direction.
- FIG. 3 is a schematic diagram of a pixel unit in an embodiment of the present application.
- the pixel unit includes a pixel array 31 and a processing circuit 32 , wherein the pixel array 31 includes a two-dimensional array composed of a plurality of pixels 312 , and the processing circuit 32 includes an array processing circuit composed of a plurality of TDC circuits 321 and a plurality of histogram circuits 322 .
- the pixel array 31 is used to collect at least part of the light beams reflected back by the target object and generate corresponding photon signals, and the processing circuit 32 is used to process the photon signals to draw a histogram reflecting the pulse waveform emitted by the light source in the transmitter; further , you can also calculate the flight time according to the histogram, and finally output the result.
- the pixel array 31 and the processing circuit 32 are disposed in the same plane, the pixel array 31 is configured to include a plurality of sub-pixel arrays 311 ; the processing circuit 32 is configured to include a plurality of sub-processing circuits 323 , each sub-pixel array 311 Connected to each sub-processing circuit 323 in a one-to-one correspondence, when any pixel in the sub-pixel array 311 receives a photon and generates a photon signal, the sub-processing circuit 323 can calculate the flight time corresponding to the photon signal.
- the number of sub-pixel arrays 311 is determined by the number of spot beams emitted by the transmitter in one measurement stage.
- the spot beam when the transmitter 11 emits a spot beam to the object to be measured, the spot beam is reflected by the object to be measured, and the pixel unit in the collector 12 will guide the spot beam to the corresponding pixel, wherein the configuration of a single spot beam
- the imaging light spot is incident on the "combined pixel" composed of the corresponding multiple pixels.
- a single spot corresponds to a composite pixel consisting of 4 pixels.
- the size of the combined pixel can be specifically set according to the actual situation, and includes at least one pixel.
- the light spot will shift along the baseline direction. This requires setting a pixel area (called a super pixel) composed of a plurality of pixels exceeding the number of combined pixels for receiving the reflected speckle beam.
- a super pixel a pixel area
- the ranging range and baseline length of the system need to be considered, so that the combined pixels corresponding to the spots reflected by objects at different distances within the measurement range all fall into the superpixel area.
- the reflected light spot is imaged to one side of the superpixel (left or right, depending on the relative position of the emitter and collector) when the target is at the minimum range, and when the target is at the maximum range When the reflected light spot is imaged to the other side of the superpixel.
- an off-axis scanning distance measurement method is also provided.
- the control method includes the following steps:
- the transmitter includes a light source array composed of a plurality of light sources, and the light source array includes a plurality of the sub-light source arrays.
- the collector includes a pixel array composed of a plurality of pixels, and the pixel array includes a plurality of the sub-pixel arrays.
- the processing circuit is configured to include a plurality of sub-processing circuits, and each sub-pixel array is connected to each sub-processing circuit in a one-to-one correspondence.
- the sub-processing circuit can calculate the Get the time of flight corresponding to the photon signal.
- the first sub-light source array 211 emits 5 spot beams.
- the first sub-processing circuit 323 is used to calculate the flight time of the speckle light beam 213; in the second measurement stage, the second sub-light source The array 212 emits 5 spot light beams.
- the corresponding first sub-pixel array 311 opens the super pixel 314 for collecting the reflected light beam. Assuming that the reflected light beam is imaged on the combined pixel 316, the first The sub-processing circuit 323 is used to calculate the time of flight of the speckle beam 214 . Until all sub-light source arrays are activated, the scanning distance measurement of the target field of view is completed. During the scanning measurement process, the sub-light source arrays are turned on one by one along the y direction to emit light beams.
- the light beams emitted by the light sources in the same column in the light source array are all incident on some pixels in the same sub-pixel array, and the same sub-processing circuit calculates the flight of the beam. time.
- the working modes of other sub-pixel arrays are the same, and are not repeated here. It can be understood that the position of the superpixel corresponding to each light spot can be pre-calibrated and stored in the memory for recall when the system performs distance measurement.
- FIG. 4 is a schematic diagram of a projected speckle pattern in an embodiment of the present application.
- the transmitter 11 includes a light source array 21 and a diffractive optical element (not shown).
- the diffractive optical element is used for duplicating the spot beam emitted by the light source array 21 and projecting it into the target field of view to form multiple projection spots, and the spot beam reflected by the target is received by the collector 12 .
- a dual-line scanning distance measurement system is further proposed.
- the spot beam projected by the light source array 21 is replicated by the diffractive optical element, and the quantity of the spot beam projected to the target field of view is regulated by designing the diffractive optical element design process.
- the spot beam projected by the light source array 21 is replicated in the y-direction through diffractive optical elements into -1 order, 0 order, and 1 order, and there is a 50% overlap between the two adjacent orders, resulting in the middle 0 order being Therefore, in the y direction, the number of spot beams emitted by the light source array 21 is twice as large, and in the x direction, any series can be reproduced without overlapping between adjacent ones, for example, in the x direction, it can also be reproduced as - Level 1, Level 0, Level 1, the number of duplicated spots is 3 times the original.
- the speckle projection pattern projected to the target field of view based on this design is shown in Fig. 4, including 8 ⁇ 15 speckles.
- the driving circuit controls the first sub-light source column 211 to emit five spot light beams, they are copied by the diffractive optical element and then projected into the target field of view to form two sets of spot projection patterns 41 and 42 to scan the two areas in the target field of view synchronously
- the target field of view is divided into upper and lower field of view areas, which are respectively denoted as the first field of view and the second field of view.
- the number of spot beams enables simultaneous scanning of both fields of view.
- FIG. 5 is a schematic diagram of a pixel unit according to another embodiment of the present application.
- the pixel unit includes a pixel array and a processing circuit, wherein the pixel array is divided into upper and lower regions, denoted as a first pixel array 51 and a second pixel array 52 respectively, and the first and second pixel arrays 51 and 52 respectively include a plurality of sub-regions.
- the processing circuits are correspondingly divided into a first processing circuit 53 and a second processing circuit 54, and each processing circuit includes a plurality of sub-processing circuits 533 and 544;
- the first pixel array and the second pixel array are connected in a one-to-one correspondence, and are used for receiving the photon signals output by the pixels in the corresponding sub-pixel array and calculating the flight time of the light beam.
- the number of sub-pixel arrays is determined by the number of spot beams projected onto the field of view in a single measurement.
- the configurations of the first and second sub-pixel circuits and the first and second processing circuits are the same.
- the specific working mode is the same as the working mode of the embodiment shown in FIG. 3.
- the sub-light source array is controlled to be turned on one by one along the baseline direction to emit spot beams toward the target field of view;
- the photon in the speckle beam is generated and the photon signal is output;
- the sub-processing circuit is used to receive the photon signal output by the corresponding sub-pixel array, and the flight time of the speckle beam from being emitted to being collected is calculated according to the photon signal.
- the difference is that, in the embodiment shown in FIG.
- the spot beams emitted by the sub-light source arrays are replicated by diffractive optical elements to generate two groups of spot beams.
- the first sub-light source array 211 emits 5 spot light beams
- two sets of spot light beams 41 and 42 are projected toward the target field of view to the first field of view and the second field of view, respectively.
- Field, each group of 15 spots, the spot beam reflected by the target is imaged into the corresponding first and second pixel arrays, and the superpixel corresponding to the spot is turned on in the sub-pixel array to collect photons in the reflected beam.
- the light source array 21 includes 4 ⁇ 5 light sources, and 8 ⁇ 15 spot beams are projected toward the target area after being replicated by the diffractive element, and the corresponding pixel array needs to be set to include 16 ⁇ 30 pixels,
- the pixel array is configured to include 30 sub-pixel arrays, and 30 TDC circuits are correspondingly connected for calculating the flight time.
- the light source array includes n sub-light source arrays that are turned on one by one to scan the field of view, so that the number of TDC circuits and histogram circuits can be reduced to 1/n.
- FIG. 5 What is shown in FIG. 5 is for illustrative reference only, and the number thereof is not limiting.
- light sources when designing the system, can be arranged at small intervals in the y direction (baseline direction) to fully improve the angular resolution, and all the light sources in the y direction share the same sub-pixel array, and the sub-pixel array
- the length can completely cover the parallax, so the requirements for the baseline can be relaxed, the number of ranging points can be increased, and the spatial resolution can be improved. Due to the dense arrangement of light sources in the y direction, the superpixels corresponding to the projected spot beams overlap, but the successive scanning method is adopted to solve the problem of superpixel overlap and improve the distance measurement accuracy.
- the distance between the light sources can be increased to ensure that the beams emitted by each light source can be imaged on the corresponding sub-pixel array after reflection without errors caused by out-of-bounds situations, so the tolerances can be relaxed. Require.
- the readout circuit and the pixel array are designed on the same plane, which reduces the number of TDC circuits and histogram circuits, and effectively reduces the process cost and complexity.
- the descriptions of the above embodiments are described by taking the baseline direction as the y direction as an example for description.
- the baseline direction can also be set as the x direction
- the sub-light source array includes a row of sub-light sources.
- the sub-pixel array includes at least one row of pixels.
- An embodiment of the present application further provides a storage medium for storing a computer program, when the computer program is executed, at least the distance measurement method described in the foregoing embodiments is executed.
- the storage medium may be implemented by any type of volatile or non-volatile storage device, or a combination thereof.
- the non-volatile memory can be a read-only memory (ROM, Read Only Memory), a programmable read-only memory (PROM, Programmable Read-Only Memory), an erasable programmable read-only memory (EPROM, Erasable Programmable Read-Only Memory) Memory), Electrically Erasable Programmable Read-Only Memory (EEPROM, Electrically Erasable Programmable Read-Only Memory), Magnetic Random Access Memory (FRAM, Ferromagnetic Random Access Memory), Flash Memory (Flash Memory), Magnetic Surface Memory, Optical Disc, Or compact disc read-only memory (CD-ROM, Compact Disc Read-Only Memory); magnetic surface memory can be magnetic disk memory or tape memory.
- RAM Random Access Memory
- SRAM Static Random Access Memory
- SSRAM SynchronousStatic Random Access Memory
- DRAM Dynamic Random Access Memory
- SDRAM Synchronous Dynamic Random Access Memory
- DDRSDRAM Double Data Rate Synchronous Dynamic Random Access Memory
- ESDRAM Enhanced Synchronous Dynamic Random Access Memory
- SLDRAM synchronous connection dynamic random access memory
- SLDRAM SyncLink Dynamic Random Access Memory
- DRAM Direct Rambus Random Access Memory
- DRRAM Direct Rambus Random Access Memory
- Embodiments of the present application further provide a computer device, the computer device includes a memory, a processor, and a computer program stored in the memory and executable on the processor; wherein the processor executes the computer During the program, at least the distance measurement method described in the foregoing embodiments is implemented.
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Abstract
A distance measurement system, a distance measurement method and a computer device. The system (10) comprises a transmitter (11) and a collector (12), which are arranged along a baseline, and a processing circuit (13, 32), wherein the transmitter (11) comprises a light source array (21) composed of a plurality of light sources (213, 214), the light source array (21) comprises a plurality of sub-light source arrays (211, 212), and the sub-light source arrays (211, 212) are configured to be opened one by one along a baseline direction so as to emit spot light beams (30); the collector (12) comprises a pixel array (31) composed of a plurality of pixels (312), the pixel array (31) comprises a plurality of sub-pixel arrays (311), and the plurality of sub-pixel arrays (311) are configured to collect photons, in light beams (40), which are reflected by the spot light beams (30) by means of a target object (20) to be measured, and to form a photonic signal; and the processing circuit (13, 32) comprises a plurality of sub-processing circuits (323), and the sub-processing circuits (323) are connected to the sub-pixel arrays (311) in one-to-one correspondence, so as to control the pixels (312) in the sub-pixel arrays (311) to start, collect the photons in the reflected light beams (40) and calculate a time of flight. By means of the system (10), the spatial resolution is improved, the problem of superpixel overlap is solved, the distance measurement accuracy is improved, and the process cost and complexity are also effectively reduced.
Description
本申请要求于2020年7月25日提交中国专利局,申请号为202010726629.X,发明名称为“一种距离测量系统及测量方法”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application filed on July 25, 2020 with the application number 202010726629.X and the title of the invention is "a distance measurement system and measurement method", the entire contents of which are incorporated by reference in in this application.
本申请涉及光学测距技术领域,尤其涉及一种距离测量系统及测量方法。The present application relates to the technical field of optical ranging, and in particular, to a distance measurement system and a measurement method.
利用飞行时间原理(TOF,Time of Flight)可以对目标进行距离测量以获取包含目标的深度值的深度图像,而基于飞行时间原理的距离测量系统已被广泛应用于消费电子、无人架驶、AR/VR等领域。基于飞行时间原理的距离测量系统通常包括发射器和采集器,利用发射器发射脉冲光束照射目标视场并利用采集器采集反射光束,计算光束由发射到反射回来被接收所需要的时间来计算物体的距离。The time of flight principle (TOF, Time of Flight) can be used to measure the distance of the target to obtain a depth image containing the depth value of the target, and the distance measurement system based on the time of flight principle has been widely used in consumer electronics, unmanned aerial vehicles, AR/VR and other fields. The distance measurement system based on the time-of-flight principle usually includes an emitter and a collector. The emitter is used to emit a pulsed beam to illuminate the target field of view, and the collector is used to collect the reflected beam, and the time required for the beam to be reflected and received is calculated to calculate the object. distance.
目前,基于飞行时间原理的距离测量系统中的采集器包括像素阵列,特别是包括基于单光子雪崩光电二极管(SPAD)的像素阵列。SPAD也称为盖革模式雪崩光电二极管(GM-APD),是能够以数十皮秒量级的到达时间分辨率捕获各个光子的检测器,可在专用半导体工艺中或者在标准CMOS技术中制造出来。在进行测距时,SPAD阵列与时间数字转换器(TDC)连接,并将光子信号输出至TDC。如中国专利CN201910888927.6中所述,为尽可能多的接收反射光束的光信号,通常将多个像素组合在一起使用,对应的像素区域称为“合像素”。而为了保证各测距点的空间分辨率,通常需要将合像素输出的光子信号输入到同一个TDC中。Currently, collectors in distance measurement systems based on the time-of-flight principle include pixel arrays, in particular, pixel arrays based on single-photon avalanche photodiodes (SPADs). SPADs, also known as Geiger Mode Avalanche Photodiodes (GM-APDs), are detectors capable of capturing individual photons with time-of-arrival resolution on the order of tens of picoseconds and can be fabricated in dedicated semiconductor processes or in standard CMOS technology come out. For ranging, the SPAD array is connected to a time-to-digital converter (TDC) and outputs photonic signals to the TDC. As described in Chinese patent CN201910888927.6, in order to receive as many optical signals of reflected light beams as possible, multiple pixels are usually used in combination, and the corresponding pixel area is called "combined pixel". In order to ensure the spatial resolution of each ranging point, it is usually necessary to input the photon signal output by the combined pixel into the same TDC.
现有的技术中,由于合像素的尺寸有限,受到系统公差和视差的影响,导致反射光束成像到像素阵列上的光斑容易出现出界的情况而丢失测距信息,因此需要严格的控制公差、压缩基线,从而增加了设计难度。另一方面,TDC数量较大且需要与每个像素或合像素连接,由于像素阵列是二维平面结构,因此只能采用三维堆叠的工艺走线,增加了设计成本以及复杂度。以上诸多问题导致了测距系统的空间分辨率难以提高。In the prior art, due to the limited size of the combined pixels and the influence of system tolerance and parallax, the light spot imaged by the reflected beam onto the pixel array is prone to be out of bounds and the ranging information is lost. Therefore, strict control of tolerance and compression is required. baseline, which increases the design difficulty. On the other hand, the number of TDCs is large and needs to be connected to each pixel or combined pixel. Since the pixel array is a two-dimensional planar structure, only three-dimensional stacked process lines can be used, which increases the design cost and complexity. The above problems make it difficult to improve the spatial resolution of the ranging system.
发明内容SUMMARY OF THE INVENTION
本申请的目的在于提供一种距离测量系统及测量方法,以解决上述背景技术问题中的至少一种问题。The purpose of the present application is to provide a distance measurement system and a measurement method to solve at least one of the above background technical problems.
本申请实施例提供一种距离测量系统,包括沿基线设置的发射器与采集器、以及与发射器和采集器连接的处理电路;其中,所述发射器包括由多个光源组成的光源阵列,所述光源阵列包括多个子光源阵列,所述子光源阵列被配置为沿基线方向逐个开启用于发射斑点光束;所述采集器包括由多个像素组成的像素阵列,所述像素阵列包括多个子像素阵列,所述多个子像素阵列经配置以采集所述斑点光束经待测目标物体反射回的反射光束中的光子并形成光子信号;所述处理电路包括多个子处理电路,所述子处理电路与所述子像素阵列一一对应连接,以控制所述子像素阵列中的像素启动采集所述反射光束中的光子,并根据所述子像素阵列输出的所述光子信号计算出所述斑点光束从发射到反射回被采集的飞行时间。An embodiment of the present application provides a distance measurement system, including an emitter and a collector arranged along a baseline, and a processing circuit connected to the emitter and the collector; wherein the emitter includes a light source array composed of multiple light sources, The light source array includes a plurality of sub-light source arrays, and the sub-light source arrays are configured to be turned on one by one along the baseline direction for emitting spot light beams; the collector includes a pixel array composed of a plurality of pixels, and the pixel array includes a plurality of sub-light sources. a pixel array, the plurality of sub-pixel arrays are configured to collect photons in the reflected beam of the spot beam reflected by the target object to be measured and form a photon signal; the processing circuit includes a plurality of sub-processing circuits, the sub-processing circuits One-to-one connection with the sub-pixel array to control the pixels in the sub-pixel array to start collecting photons in the reflected beam, and calculate the spot beam according to the photon signal output by the sub-pixel array The time-of-flight from emission to reflection back being acquired.
在一些实施例中,所述子光源阵列包括一行或一列光源;所述子光源阵列在驱动电路的控制下逐个分时段启动以投射所述斑点光束到目标视场;其中,在一个测量阶段仅激活一个子光源阵列,直到所有子光源阵列均被启动后,完成对整个目标视场的扫描。In some embodiments, the sub-light source array includes a row or a column of light sources; the sub-light source array is activated in sub-periods one by one under the control of the driving circuit to project the spot beam to the target field of view; wherein, in a measurement stage only A sub-light source array is activated until all sub-light source arrays are activated to complete the scanning of the entire target field of view.
在一些实施例中,所述光源阵列的扫描方向与基线方向相同。In some embodiments, the scanning direction of the light source array is the same as the baseline direction.
在一些实施例中,所述像素阵列与所述处理电路设置在同一平面内。In some embodiments, the pixel array is disposed in the same plane as the processing circuit.
在一些实施例中,还包括有衍射光学元件,所述子光源阵列发射的斑点光束经过所述衍射光学元件复制后投射到目标视场中形成两组斑点投影图案,以同步扫描目标视场中的两个区域。In some embodiments, a diffractive optical element is also included, and the spot light beam emitted by the sub-light source array is replicated by the diffractive optical element and projected into the target field of view to form two sets of spot projection patterns, so as to scan the target field of view synchronously of the two regions.
在一些实施例中,所述像素阵列分为第一像素阵列和第二像素阵列,每个像素阵列包括多个所述子像素阵列;所述处理电路对应分为第一处理电路和第二处理电路,每个处理电路包括多个所述子处理电路;所述第一处理电路和所述第二处理电路分别设置在像素阵列的两侧并分别与所述第一像素阵列以及所述第二像素阵列一一对应连接,用于接收对应的子像素阵列内的像素输出的光子信号并计算光束的飞行时间。In some embodiments, the pixel array is divided into a first pixel array and a second pixel array, each pixel array includes a plurality of the sub-pixel arrays; the processing circuit is correspondingly divided into a first processing circuit and a second processing circuit Each processing circuit includes a plurality of the sub-processing circuits; the first processing circuit and the second processing circuit are respectively arranged on both sides of the pixel array and are respectively connected with the first pixel array and the second pixel array. The pixel arrays are connected in a one-to-one correspondence, and are used for receiving the photon signals output by the pixels in the corresponding sub-pixel array and calculating the flight time of the light beam.
本申请实施例还提供一种距离测量方法,包括如下步骤:The embodiment of the present application also provides a distance measurement method, comprising the following steps:
S10、控制发射器中的子光源阵列逐个开启,朝向目标视场发射斑点光束;其中,所述发射器包括由多个光源组成的光源阵列,所述光源阵列包括多个所述子光源阵列;S10. Control the sub-light source arrays in the transmitter to be turned on one by one, and emit spot light beams toward the target field of view; wherein, the transmitter includes a light source array composed of a plurality of light sources, and the light source array includes a plurality of the sub-light source arrays;
S20、控制采集器的子像素阵列中的像素启动以采集反射回的所述斑点光束中的光子,并形成光子信号;其中,所述采集器包括由多个像素组成的像素阵列,所述像素阵列包括多个所述子像素阵列;S20. Control the activation of the pixels in the sub-pixel array of the collector to collect photons in the reflected speckle beam, and form a photon signal; wherein the collector includes a pixel array composed of a plurality of pixels, and the pixels an array including a plurality of the sub-pixel arrays;
S30、利用处理电路中的子处理电路接收对应的所述子像素阵列输出的光子信号,并根据所述光子信号计算斑点光束从发射到被采集之间的飞行时间。S30. Use the sub-processing circuit in the processing circuit to receive the photon signal output by the corresponding sub-pixel array, and calculate the time-of-flight of the speckle beam from being emitted to being collected according to the photon signal.
在一些实施例中,所述处理电路被配置为包括多个所述子处理电路;其中,所述子像素阵列与所述子处理电路一一对应连接。In some embodiments, the processing circuit is configured to include a plurality of the sub-processing circuits; wherein the sub-pixel array is connected to the sub-processing circuits in a one-to-one correspondence.
在一些实施例中,步骤S10中,沿基线方向逐个开启所述子光源阵列发射斑点光束,直至所有子光源阵列均被启动,完成对目标视场的扫描;其中,处于光源阵列中同一列/或同一行的光源发射的斑点光束均入射到同一个所述子像素阵列中的部分像素上,被同一个子处理电路计算出光束的飞行时间。In some embodiments, in step S10, the sub-light source arrays are turned on one by one along the baseline direction to emit spot beams, until all sub-light source arrays are activated, and the scanning of the target field of view is completed; Or the spot light beams emitted by the light sources in the same row are all incident on some pixels in the same sub-pixel array, and the flight time of the light beams is calculated by the same sub-processing circuit.
本申请实施例还提供一种计算机设备,包括:存储器、处理器以及存储在所述存储器中并可在所述处理器上运行的计算机程序;其中,所述处理器执行所述计算机程序时至少实现一种距离测量方法,所述距离测量方法包括如下步骤:S10、控制发射器中的子光源阵列逐个开启,朝向目标视场发射斑点光束;其中,所述发射器包括由多个光源组成的光源阵列,所述光源阵列包括多个所述子光源阵列;S20、控制采集器的子像素阵列中的像素启动以采集反射回的所述斑点光束中的光子,并形成光子信号;其中,所述采集器包括由多个像素组成的像素阵列,所述像素阵列包括多个所述子像素阵列;S30、利用处理电路中的子处理电路接收对应的所述子像素阵列输出的光子信号,并根据所述光子信号计算斑点光束从发射到被采集之间的飞行时间。Embodiments of the present application further provide a computer device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor; wherein, when the processor executes the computer program, at least A distance measurement method is realized, and the distance measurement method includes the following steps: S10, controlling the sub-light source arrays in the transmitter to be turned on one by one, and emitting a spot beam toward the target field of view; wherein, the transmitter includes a plurality of light sources. A light source array, the light source array includes a plurality of the sub-light source arrays; S20, controlling the pixels in the sub-pixel array of the collector to start to collect the photons in the reflected speckle beam, and form a photon signal; wherein, the The collector includes a pixel array composed of a plurality of pixels, and the pixel array includes a plurality of the sub-pixel arrays; S30. Use the sub-processing circuit in the processing circuit to receive the photon signal output by the corresponding sub-pixel array, and The time-of-flight of the speckle beam from being emitted to being collected is calculated from the photon signal.
本申请实施例提供一种距离测量系统,包括沿基线设置的发射器与采集器、以及处理电路;其中,发射器包括由多个光源组成的光源阵列,光源阵列包括多个子光源阵列,子光源阵列被配置为沿基线方向逐个开启发射斑点光束;采集器包括由多个像素组成的像素阵列,像素阵列包括多个子像素阵列,多个子像素阵列经配置以采集斑点光束经待测目标物体反射回的光束中的光子并形成光子信号;处理电路包括有多个子处理电路,子处理电路与子像素阵列一一对应连接,以控制子像素阵列中的像素启动,采集反射光束中的光子,计算飞行时间。本申请实施例测量系统提升了空间分辨率,且解决了超像素重叠的问题,提升了距离测量精度;同时,将读出电路与像素阵列设计在同一平面上,降低了TDC电路和直方图电路的数量,有效降低了工艺成本及复杂度。An embodiment of the present application provides a distance measurement system, including an emitter and a collector arranged along a baseline, and a processing circuit; wherein the emitter includes a light source array composed of multiple light sources, the light source array includes multiple sub-light source arrays, and the sub-light sources The array is configured to be turned on one by one along the baseline direction to emit the spot beams; the collector includes a pixel array composed of a plurality of pixels, the pixel array includes a plurality of sub-pixel arrays, and the plurality of sub-pixel arrays are configured to collect the spot beams reflected by the target object to be tested. The photons in the beam of the beam are reflected and a photon signal is formed; the processing circuit includes a plurality of sub-processing circuits, and the sub-processing circuits are connected with the sub-pixel array in one-to-one correspondence to control the activation of the pixels in the sub-pixel array, collect photons in the reflected beam, and calculate the flight time. The measurement system of the embodiment of the present application improves the spatial resolution, solves the problem of superpixel overlap, and improves the distance measurement accuracy; at the same time, the readout circuit and the pixel array are designed on the same plane, which reduces the TDC circuit and the histogram circuit. , effectively reducing the cost and complexity of the process.
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付 出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.
图1是根据本申请一个实施例距离测量系统的示意图。FIG. 1 is a schematic diagram of a distance measurement system according to an embodiment of the present application.
图2是根据本申请一个实施例距离测量系统的光源阵列的示意图。FIG. 2 is a schematic diagram of a light source array of a distance measurement system according to an embodiment of the present application.
图3是根据本申请一个实施例距离测量系统的像素单元的示意图。FIG. 3 is a schematic diagram of a pixel unit of a distance measurement system according to an embodiment of the present application.
图4是根据本申请一个实施例距离测量系统的投影斑点图案的示意图。4 is a schematic diagram of a projected speckle pattern of a distance measurement system according to an embodiment of the present application.
图5是根据本申请另一个实施例距离测量系统的像素单元的示意图。FIG. 5 is a schematic diagram of a pixel unit of a distance measurement system according to another embodiment of the present application.
图6是根据本申请又一个实施例距离测量方法的流程图示。FIG. 6 is a flowchart of a distance measurement method according to still another embodiment of the present application.
为了使本申请实施例所要解决的技术问题、技术方案及有益效果更加清楚明白,以下结合附图及实施例,对本申请进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本申请,并不用于限定本申请。In order to make the technical problems, technical solutions and beneficial effects to be solved by the embodiments of the present application more clearly understood, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.
需要说明的是,当元件被称为“固定于”或“设置于”另一个元件,它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件,它可以是直接连接到另一个元件或间接连接至该另一个元件上。另外,连接即可以是用于固定作用也可以是用于电路连通作用。It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, the connection can be used for either a fixing function or a circuit connecting function.
需要理解的是,术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请实施例和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that The device or element must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present application.
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多该特征。在本申请实施例的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first", "second" may expressly or implicitly include one or more of that feature. In the description of the embodiments of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.
图1所示为本申请一个实施例的距离测量系统示意图,该距离测量系统10 包括10包括发射器11、采集器12以及分别与发射器11、采集器12连接的处理电路13。其中,发射器11用于向目标区域20发射光束30,该光束发射至目标区域空间中以照明空间中的目标物体;至少部分发射光束30经目标区域20反射后形成反射光束40,反射光束40中的至少部分光束被采集器12接收;处理电路13分别与发射器11以及采集器12连接,同步发射器11与采集器12的触发信号以计算光束从发射到反射回被接收所需要的时间,即发射光束30与反射光束40之间的飞行时间t,进一步,目标物体上对应点的距离D可由下式计算出:1 is a schematic diagram of a distance measurement system according to an embodiment of the present application. The distance measurement system 10 includes a transmitter 11 , a collector 12 , and a processing circuit 13 connected to the transmitter 11 and the collector 12 respectively. Wherein, the transmitter 11 is used to emit a light beam 30 to the target area 20, and the light beam is emitted into the space of the target area to illuminate the target object in the space; at least part of the emitted light beam 30 is reflected by the target area 20 to form a reflected beam 40, and the reflected beam 40 At least a part of the light beams are received by the collector 12; the processing circuit 13 is connected to the transmitter 11 and the collector 12 respectively, and synchronizes the trigger signals of the transmitter 11 and the collector 12 to calculate the time required for the beam to be received from emission to reflection , namely the flight time t between the emitted light beam 30 and the reflected light beam 40, and further, the distance D of the corresponding point on the target object can be calculated by the following formula:
D=c·t/2 (1)D=c t/2 (1)
其中,c为光速。where c is the speed of light.
发射器11包括光源111、发射光学元件112以及驱动器113等。其中,光源111可以是发光二极管(LED)、激光二极管(LD)、边发射激光器(EEL)、垂直腔面发射激光器(VCSEL)等,也可以是由多个光源组成的一维或二维光源阵列。优选地,光源阵列是在单块半导体基底上生成多个VCSEL光源以形成的VCSEL阵列光源芯片,光源阵列中光源的排列方式可以是规则的也可以是不规则的。光源111所发射的光束可以是可见光、红外光、紫外光等。光源111在驱动器113的控制下向外发射光束。The transmitter 11 includes a light source 111, an emission optical element 112, a driver 113, and the like. The light source 111 may be a light emitting diode (LED), a laser diode (LD), an edge emitting laser (EEL), a vertical cavity surface emitting laser (VCSEL), etc., or a one-dimensional or two-dimensional light source composed of multiple light sources array. Preferably, the light source array is a VCSEL array light source chip formed by generating multiple VCSEL light sources on a single semiconductor substrate, and the arrangement of the light sources in the light source array may be regular or irregular. The light beam emitted by the light source 111 may be visible light, infrared light, ultraviolet light, or the like. The light source 111 emits light beams outward under the control of the driver 113 .
在一些实施例中,光源111在驱动器113的控制下以一定频率(脉冲周期)向外发射脉冲光束,可以用于直接飞行时间(Direct TOF)测量中,频率根据测量距离进行设定。可以理解的是,还可以利用处理电路13中的一部分或者独立于处理电路13存在的子电路来控制光源111发射光束。In some embodiments, the light source 111 emits a pulsed beam at a certain frequency (pulse period) under the control of the driver 113, which can be used in direct time-of-flight (Direct TOF) measurement, and the frequency is set according to the measurement distance. It can be understood that, a part of the processing circuit 13 or a sub-circuit existing independently of the processing circuit 13 can also be used to control the light source 111 to emit light beams.
发射光学元件112接收来自光源111发射的光束并整形后投射到目标区域。在一些实施例中,发射光学元件112接收来自光源111的脉冲光束,并将脉冲光束进行光学调制,比如衍射、折射、反射等调制,随后向空间中发射被调制后的光束,比如聚焦光束、泛光光束、结构光光束等。发射光学元件112可以是透镜、液晶元件、衍射光学元件、微透镜阵列、超表面(Metasurface)光学元 件、掩膜板、反射镜、MEMS振镜等形式中的一种或多种的组合。The emission optical element 112 receives the light beam emitted from the light source 111 and shapes it to project it onto the target area. In some embodiments, the transmitting optical element 112 receives the pulsed light beam from the light source 111, performs optical modulation on the pulsed light beam, such as modulation of diffraction, refraction, reflection, etc., and then emits the modulated light beam into space, such as a focused beam, Flood beams, structured light beams, etc. The emission optical element 112 may be one or a combination of one or more of a lens, a liquid crystal element, a diffractive optical element, a microlens array, a metasurface optical element, a mask, a mirror, a MEMS galvanometer, and the like.
采集器12包括像素单元121、过滤单元122和接收光学元件123;其中,接收光学元件123用于接收由目标反射回的至少部分光束并引导到像素单元121上,过滤单元122用于滤除背景光或杂散光。像素单元121包括由多个像素组成的二维像素阵列;在一些实施例中,像素单元121是由单光子雪崩光电二极管(SPAD)组成像素阵列,SPAD可以对入射的单个光子进行响应,并输出指示所接收光子在每个SPAD处响应到达时间的信号,利用诸如时间相关单光子计数法(TCSPC)实现对微弱光信号的采集以及飞行时间的计算。The collector 12 includes a pixel unit 121, a filter unit 122 and a receiving optical element 123; wherein, the receiving optical element 123 is used to receive at least part of the light beam reflected back by the target and guide it to the pixel unit 121, and the filter unit 122 is used to filter out the background light or stray light. The pixel unit 121 includes a two-dimensional pixel array composed of a plurality of pixels; in some embodiments, the pixel unit 121 is a pixel array composed of a single-photon avalanche photodiode (SPAD), and the SPAD can respond to an incident single photon and output A signal indicating the time of arrival of the received photon response at each SPAD enables the acquisition of weak optical signals and the calculation of time of flight using methods such as time-correlated single photon counting (TCSPC).
一般地,还包括有与像素单元121连接的信号放大器、时数转换器(TDC)、数模转换器(ADC)等器件中的一种或多种组成的读出电路(图中未示出)。这些电路即可以与像素整合在一起,作为像素单元的一部分,也可以作为处理电路13的一部分,后面为便于描述,将统一视作处理电路13的一部分。Generally, it also includes a readout circuit (not shown in the figure) composed of one or more of a signal amplifier, a time-to-digital converter (TDC), a digital-to-analog converter (ADC) and other devices connected to the pixel unit 121 . ). These circuits can be integrated with the pixel, as a part of the pixel unit, or as a part of the processing circuit 13 , and will be regarded as a part of the processing circuit 13 for ease of description later.
处理电路13同步发射器11与采集器12的触发信号,对像素采集光束的光子信号进行处理,并基于反射光束的飞行时间计算出待测目标的距离信息。在一些实施例中,SPAD对入射的单个光子进行响应而输出光子信号,处理电路13接收光子信号并进行信号处理获取光束的飞行时间。具体的,处理电路13计算采集光子的数量形成连续的时间bin,这些时间bin连在一起形成统计直方图以重现反射光束的时间序列,利用峰值匹配和滤波检测识别出反射光束从发射到反射回被接收的飞行时间。可以理解的是,处理电路13可以是独立的专用电路,比如专用SOC芯片、FPGA芯片、ASIC芯片等等,也可以包含通用处理电路。The processing circuit 13 synchronizes the trigger signals of the transmitter 11 and the collector 12, processes the photon signal of the pixel collected beam, and calculates the distance information of the target to be measured based on the flight time of the reflected beam. In some embodiments, the SPAD outputs a photon signal in response to an incident single photon, and the processing circuit 13 receives the photon signal and performs signal processing to obtain the time-of-flight of the light beam. Specifically, the processing circuit 13 calculates the number of collected photons to form continuous time bins, and these time bins are connected together to form a statistical histogram to reproduce the time series of reflected light beams, and use peak matching and filter detection to identify the reflected light beam from emission to reflection Returns the received flight time. It can be understood that the processing circuit 13 may be an independent dedicated circuit, such as a dedicated SOC chip, an FPGA chip, an ASIC chip, etc., or may include a general-purpose processing circuit.
在一些实施例中,距离测量系统10还包括存储器,用于存储脉冲编码程序,利用编码程序控制光源111发射光束的激发时间、发射频率等。In some embodiments, the distance measurement system 10 further includes a memory for storing a pulse encoding program, and the encoding program is used to control the excitation time, emission frequency, etc. of the light beam emitted by the light source 111 .
在一些实施例中,距离测量系统10还可以包括彩色相机、红外相机、IMU等器件,与这些器件的组合可以实现更加丰富的功能,比如3D纹理建模、红外人脸识别、SLAM等功能。In some embodiments, the distance measurement system 10 may further include devices such as a color camera, an infrared camera, and an IMU, and the combination with these devices can realize more abundant functions, such as 3D texture modeling, infrared face recognition, SLAM and other functions.
在一些实施例中,发射器11与采集器12也可以被设置成共轴形式,即二者之间通过具备反射及透射功能的光学器件来实现,比如半透半反镜等。In some embodiments, the transmitter 11 and the collector 12 may also be arranged in a coaxial form, that is, the two are realized by optical devices with reflection and transmission functions, such as a half mirror and the like.
参照图2所示,图2为本申请一个实施例中光源阵列的示意图。光源阵列21被配置为由设置在单片基底(或多片基底上的)上的多个光源213组成;其中,光源阵列21可以是一维的也可以是二维的,可以是规则排列的也可以是不规则排列的。优选地,光源阵列21是由设置在半导体基底上的多个VCSEL光源组成的阵列VCSEL芯片。光源阵列21可以发射任意波长的光束,比如可见光、红外光、紫外光等。光源阵列21在驱动电路(可以是处理电路13的一部分)的调制驱动下进行发光,比如连续波调制、脉冲调制等,光源阵列21也可以在驱动电路的控制下进行分组发光。Referring to FIG. 2 , FIG. 2 is a schematic diagram of a light source array in an embodiment of the present application. The light source array 21 is configured to be composed of a plurality of light sources 213 arranged on a single substrate (or on multiple substrates); wherein, the light source array 21 may be one-dimensional or two-dimensional, and may be regularly arranged It can also be arranged irregularly. Preferably, the light source array 21 is an array VCSEL chip composed of a plurality of VCSEL light sources arranged on a semiconductor substrate. The light source array 21 can emit light beams of any wavelength, such as visible light, infrared light, ultraviolet light, and the like. The light source array 21 emits light under the modulation driving of the driving circuit (which may be a part of the processing circuit 13 ), such as continuous wave modulation, pulse modulation, etc. The light source array 21 can also emit light in groups under the control of the driving circuit.
在一些实施例中,光源阵列21被配置为包括多个子光源阵列211,212;每个子光源阵列包括一行或一列光源,具体需根据基线方向设定。子光源阵列在驱动电路的控制下逐个分时段启动以投射斑点光束到目标视场,在一个测量阶段仅激活一个子光源阵列,直到所有子光源阵列均被启动后,完成对整个目标视场的扫描;其中,光源阵列的扫描方向(子光源阵列的启动顺序)与基线方向(发射器和采集器之间的连线)相同。在本申请一个实施例中,假设基线方向为垂直方向(y方向),则子光源阵列被配置为包括一行光源,在y方向上逐次启动子光源阵列完成一帧扫描。如图2所示,光源阵列21包括4×5个光源,每个子光源阵列包括5个光源。在一些实施例中,每个子光源阵列也可以设置在单独的基底上,分别由不同的驱动电路控制进行分组发光。下文中将以基线方向为y方向为例对本申请做详细描述,则设定垂直基线方向为x方向。In some embodiments, the light source array 21 is configured to include a plurality of sub-light source arrays 211, 212; each sub-light source array includes a row or a column of light sources, which needs to be set according to the direction of the baseline. The sub-light source arrays are activated one by one under the control of the driving circuit to project the spot beams to the target field of view, and only one sub-light source array is activated in a measurement stage until all sub-light source arrays are activated, and the entire target field of view is completed. Scanning; wherein, the scanning direction of the light source array (the activation sequence of the sub-light source array) is the same as the baseline direction (the connection line between the emitter and the collector). In an embodiment of the present application, assuming that the baseline direction is the vertical direction (y direction), the sub-light source array is configured to include a row of light sources, and the sub-light source array is sequentially activated in the y direction to complete a frame of scanning. As shown in FIG. 2 , the light source array 21 includes 4×5 light sources, and each sub-light source array includes 5 light sources. In some embodiments, each sub-light source array may also be disposed on a separate substrate, and controlled by different driving circuits to emit light in groups. Hereinafter, the present application will be described in detail by taking the base line direction as the y direction as an example, and the vertical base line direction is set as the x direction.
参照图3所示,图3为本申请一个实施例中像素单元的示意图。像素单元包括像素阵列31以及处理电路32,其中像素阵列31包括由多个像素312组成的二维阵列,处理电路32包括由多个TDC电路321和多个直方图电路322组成的阵列处理电路。像素阵列31用于采集由目标物体反射回的至少部分光束并生成相应的光子信号,处理电路32用于对光子信号进行处理以绘制出反映发射器 中光源所发射脉冲波形的直方图;进一步地,也可以根据直方图计算飞行时间,最后将结果输出。Referring to FIG. 3 , FIG. 3 is a schematic diagram of a pixel unit in an embodiment of the present application. The pixel unit includes a pixel array 31 and a processing circuit 32 , wherein the pixel array 31 includes a two-dimensional array composed of a plurality of pixels 312 , and the processing circuit 32 includes an array processing circuit composed of a plurality of TDC circuits 321 and a plurality of histogram circuits 322 . The pixel array 31 is used to collect at least part of the light beams reflected back by the target object and generate corresponding photon signals, and the processing circuit 32 is used to process the photon signals to draw a histogram reflecting the pulse waveform emitted by the light source in the transmitter; further , you can also calculate the flight time according to the histogram, and finally output the result.
在一些实施例中,像素阵列31与处理电路32设置在同一平面内,像素阵列31被配置为包括多个子像素阵列311;处理电路32被配置为包括多个子处理电路323,每个子像素阵列311与每个子处理电路323一一对应连接,子像素阵列311中的任意一个像素接收到光子并产生光子信号时,子处理电路323均可以计算出该光子信号对应的飞行时间。其中,子像素阵列311的数量由发射器在一次测量阶段发射出的斑点光束的数量决定。In some embodiments, the pixel array 31 and the processing circuit 32 are disposed in the same plane, the pixel array 31 is configured to include a plurality of sub-pixel arrays 311 ; the processing circuit 32 is configured to include a plurality of sub-processing circuits 323 , each sub-pixel array 311 Connected to each sub-processing circuit 323 in a one-to-one correspondence, when any pixel in the sub-pixel array 311 receives a photon and generates a photon signal, the sub-processing circuit 323 can calculate the flight time corresponding to the photon signal. The number of sub-pixel arrays 311 is determined by the number of spot beams emitted by the transmitter in one measurement stage.
在一些实施例中,发射器11向被测物体发射斑点光束时,斑点光束经被测物体反射,采集器12中的像素单元会引导该斑点光束至相应的像素上,其中配置单个斑点光束的成像光斑入射到对应的多个像素组成的“合像素”上。如图3所示单个斑点对应由4个像素组成的一个合像素。合像素的大小可以根据实际情况具体设定,至少包括一个像素。当发射器11和采集器12的设置方式为离轴时,由于视差的存在,需要考虑光斑受到被测物体远近不同时存在位移的情况,一般地,光斑会沿着基线方向发生偏移,由此需要设置超过合像素数量的多个像素组成的像素区域(称为:超像素)用于接收反射回的斑点光束。超像素的大小在设置时需要考虑系统的测距范围以及基线长度,使得在测量范围内不同距离上物体反射回的斑点所对应的合像素均落入超像素区域内。在一些实施例中,当目标位于最小测距处时的反射光斑成像到超像素的一侧(左侧或右侧,取决于发射器和采集器的相对位置),当目标位于最大测距处时反射光斑成像到超像素的另一侧。In some embodiments, when the transmitter 11 emits a spot beam to the object to be measured, the spot beam is reflected by the object to be measured, and the pixel unit in the collector 12 will guide the spot beam to the corresponding pixel, wherein the configuration of a single spot beam The imaging light spot is incident on the "combined pixel" composed of the corresponding multiple pixels. As shown in Figure 3, a single spot corresponds to a composite pixel consisting of 4 pixels. The size of the combined pixel can be specifically set according to the actual situation, and includes at least one pixel. When the transmitter 11 and the collector 12 are set off-axis, due to the existence of parallax, it is necessary to consider the situation that the light spot is displaced when the object to be measured is far and near. Generally, the light spot will shift along the baseline direction. This requires setting a pixel area (called a super pixel) composed of a plurality of pixels exceeding the number of combined pixels for receiving the reflected speckle beam. When setting the size of superpixels, the ranging range and baseline length of the system need to be considered, so that the combined pixels corresponding to the spots reflected by objects at different distances within the measurement range all fall into the superpixel area. In some embodiments, the reflected light spot is imaged to one side of the superpixel (left or right, depending on the relative position of the emitter and collector) when the target is at the minimum range, and when the target is at the maximum range When the reflected light spot is imaged to the other side of the superpixel.
作为本申请一实施例,还提供一种离轴扫描距离测量方法,参照图6所示,控制方法包括如下步骤:As an embodiment of the present application, an off-axis scanning distance measurement method is also provided. Referring to FIG. 6 , the control method includes the following steps:
S10、控制发射器中的子光源阵列沿基线方向逐个开启,朝向目标视场发射斑点光束;S10. Control the sub-light source arrays in the transmitter to be turned on one by one along the baseline direction, and emit spot light beams toward the target field of view;
其中,所述发射器包括由多个光源组成的光源阵列,所述光源阵列包括多 个所述子光源阵列。Wherein, the transmitter includes a light source array composed of a plurality of light sources, and the light source array includes a plurality of the sub-light source arrays.
S20、控制采集器的子像素阵列中的像素启动以采集反射回的所述斑点光束中的光子,并形成光子信号;S20, controlling the activation of pixels in the sub-pixel array of the collector to collect photons in the reflected speckle beam, and form a photon signal;
其中,所述采集器包括由多个像素组成的像素阵列,所述像素阵列包括多个所述子像素阵列。Wherein, the collector includes a pixel array composed of a plurality of pixels, and the pixel array includes a plurality of the sub-pixel arrays.
S30、利用处理电路中的子处理电路接收对应的子像素阵列输出的光子信号,并根据光子信号计算斑点光束从发射到被采集之间的飞行时间。S30. Use the sub-processing circuit in the processing circuit to receive the photon signal output by the corresponding sub-pixel array, and calculate the time-of-flight of the speckle beam from being emitted to being collected according to the photon signal.
其中,处理电路被配置为包括多个子处理电路,每个子像素阵列与每个子处理电路一一对应连接,子像素阵列中的任意一个像素接收到光子并产生光子信号时,子处理电路均可以计算出该光子信号对应的飞行时间。The processing circuit is configured to include a plurality of sub-processing circuits, and each sub-pixel array is connected to each sub-processing circuit in a one-to-one correspondence. When any pixel in the sub-pixel array receives a photon and generates a photon signal, the sub-processing circuit can calculate the Get the time of flight corresponding to the photon signal.
具体的,参照图2、图3所示,在第一测量阶段,第一子光源阵列211发射出5个斑点光束,对于斑点光束213考虑到视差的影响,与斑点光束213对应的第一子像素阵列311中开启超像素313用于采集反射光束,假设反射光束成像到合像素315上,第一子处理电路323用于计算斑点光束213的飞行时间;在第二测量阶段,第二子光源阵列212发射出5个斑点光束,对于斑点光束214考虑到视差的影响,对应的第一子像素阵列311中开启超像素314用于采集反射光束,假设反射光束成像到合像素316上,第一子处理电路323用于计算斑点光束214的飞行时间。直至所有子光源阵列均被启动,完成对目标视场的扫描距离测量。在扫描测量过程中沿y方向逐个开启子光源阵列发射光束,处于光源阵列中同一列的光源发射的光束均入射到同一个子像素阵列中的部分像素上,被同一个子处理电路计算出光束的飞行时间。其他子像素阵列的工作模式均相同,在此不再重复赘述。可以理解的是,每个光斑对应的超像素的位置可预先标定并存储于存储器中以供系统执行距离测量时调用。Specifically, as shown in FIG. 2 and FIG. 3 , in the first measurement stage, the first sub-light source array 211 emits 5 spot beams. For the spot beam 213 considering the influence of parallax, the first sub-beam corresponding to the spot beam 213 In the pixel array 311, the super pixel 313 is turned on to collect the reflected light beam. Assuming that the reflected light beam is imaged on the combined pixel 315, the first sub-processing circuit 323 is used to calculate the flight time of the speckle light beam 213; in the second measurement stage, the second sub-light source The array 212 emits 5 spot light beams. Considering the influence of parallax for the spot light beam 214, the corresponding first sub-pixel array 311 opens the super pixel 314 for collecting the reflected light beam. Assuming that the reflected light beam is imaged on the combined pixel 316, the first The sub-processing circuit 323 is used to calculate the time of flight of the speckle beam 214 . Until all sub-light source arrays are activated, the scanning distance measurement of the target field of view is completed. During the scanning measurement process, the sub-light source arrays are turned on one by one along the y direction to emit light beams. The light beams emitted by the light sources in the same column in the light source array are all incident on some pixels in the same sub-pixel array, and the same sub-processing circuit calculates the flight of the beam. time. The working modes of other sub-pixel arrays are the same, and are not repeated here. It can be understood that the position of the superpixel corresponding to each light spot can be pre-calibrated and stored in the memory for recall when the system performs distance measurement.
图4是本申请一个实施例中投影斑点图案的示意图。在本实施例中,发射器11包括光源阵列21和衍射光学元件(未图示)。衍射光学元件用于对光源阵列21发出的斑点光束进行复制投射到目标视场中形成多个投射光斑,经目标反 射的斑点光束被采集器12接收。FIG. 4 is a schematic diagram of a projected speckle pattern in an embodiment of the present application. In this embodiment, the transmitter 11 includes a light source array 21 and a diffractive optical element (not shown). The diffractive optical element is used for duplicating the spot beam emitted by the light source array 21 and projecting it into the target field of view to form multiple projection spots, and the spot beam reflected by the target is received by the collector 12 .
在一些实施例中,结合图2和图4所示,进一步提出了一种双线扫描的距离测量系统。光源阵列21投射出的斑点光束经衍射光学元件进行复制,通过对衍射光学元件设计工艺进行设计,调控投射到目标视场的斑点光束的数量。In some embodiments, with reference to FIG. 2 and FIG. 4 , a dual-line scanning distance measurement system is further proposed. The spot beam projected by the light source array 21 is replicated by the diffractive optical element, and the quantity of the spot beam projected to the target field of view is regulated by designing the diffractive optical element design process.
在一些实施例中,光源阵列21投射出的斑点光束经过衍射光学元件在y方向上复制成-1级、0级、1级,相邻两级之间有50%的重叠导致中间0级被消除,由此在y方向上复制为光源阵列21发出的斑点光束数量的2倍,而在x方向上则可以复制任意级数且相邻之间不重叠,例如在x方向上也复制成-1级、0级、1级,则复制后的斑点数量为原来的3倍。基于此设计投射到目标视场的斑点投影图案如图4所示,包括8×15个斑点。当驱动电路控制第一子光源列211发射5个斑点光束时,经过衍射光学元件复制后投射到目标视场中形成两组斑点投影图案41、42,以同步扫描目标视场中的两个区域;由此将目标视场分为上下两个视场区域,分别记为第一视场和第二视场,沿y方向逐次开启光源阵列时分别在第一视场和第二视场投射相同数量的斑点光束实现对两个视场的同步扫描。In some embodiments, the spot beam projected by the light source array 21 is replicated in the y-direction through diffractive optical elements into -1 order, 0 order, and 1 order, and there is a 50% overlap between the two adjacent orders, resulting in the middle 0 order being Therefore, in the y direction, the number of spot beams emitted by the light source array 21 is twice as large, and in the x direction, any series can be reproduced without overlapping between adjacent ones, for example, in the x direction, it can also be reproduced as - Level 1, Level 0, Level 1, the number of duplicated spots is 3 times the original. The speckle projection pattern projected to the target field of view based on this design is shown in Fig. 4, including 8 × 15 speckles. When the driving circuit controls the first sub-light source column 211 to emit five spot light beams, they are copied by the diffractive optical element and then projected into the target field of view to form two sets of spot projection patterns 41 and 42 to scan the two areas in the target field of view synchronously Thus, the target field of view is divided into upper and lower field of view areas, which are respectively denoted as the first field of view and the second field of view. The number of spot beams enables simultaneous scanning of both fields of view.
如图5所示是本申请另一个实施例的像素单元的示意图。像素单元包括像素阵列和处理电路,其中,像素阵列被分为上下两个区域,分别记为第一像素阵列51和第二像素阵列52,第一、第二像素阵列51,52分别包括多个子像素阵列511、521;其中,第一、第二像素阵列分别采集第一、第二视场反射回的斑点光束中的光子并形成光子信号。处理电路对应的被分为第一处理电路53和第二处理电路54,每个处理电路包括多个子处理电路533、544;第一、第二处理电路分别设置在像素阵列的两侧并分别与第一像素阵列以及第二像素阵列一一对应连接,用于接收对应的子像素阵列内的像素输出的光子信号并计算光束的飞行时间。其中,子像素阵列的数量由单次测量投射到视场的斑点光束数量决定。FIG. 5 is a schematic diagram of a pixel unit according to another embodiment of the present application. The pixel unit includes a pixel array and a processing circuit, wherein the pixel array is divided into upper and lower regions, denoted as a first pixel array 51 and a second pixel array 52 respectively, and the first and second pixel arrays 51 and 52 respectively include a plurality of sub-regions. Pixel arrays 511 and 521; wherein, the first and second pixel arrays respectively collect photons in the spot light beams reflected back from the first and second fields of view and form photon signals. The processing circuits are correspondingly divided into a first processing circuit 53 and a second processing circuit 54, and each processing circuit includes a plurality of sub-processing circuits 533 and 544; The first pixel array and the second pixel array are connected in a one-to-one correspondence, and are used for receiving the photon signals output by the pixels in the corresponding sub-pixel array and calculating the flight time of the light beam. The number of sub-pixel arrays is determined by the number of spot beams projected onto the field of view in a single measurement.
可以理解的是,第一、第二子像素电路以及第一、第二处理电路配置相同。 具体工作模式与前述图3所示的实施例方案的工作模式相同,控制子光源阵列沿基线方向逐个开启朝向目标视场发射斑点光束;并控制子像素阵列中大于对应数量的像素启动采集反射回的斑点光束中的光子并输出光子信号;利用子处理电路接收与其对应的子像素阵列输出的光子信号,并根据光子信号计算斑点光束从发射到被采集之间的飞行时间。不同之处在于,图4所示实施例方案中,在每个测量阶段开启一个子光源阵列时,子光源阵列发出的斑点光束经过衍射光学元件复制后产生两组斑点光束。例如,在第一测量阶段,第一子光源阵列211发射出5个斑点光束,经过衍射光学元件复制后朝向目标视场投射出两组斑点光束41、42分别到第一视场和第二视场,每组15个斑点,经目标反射的斑点光束成像到对应的第一、第二像素阵列中,在子像素阵列内开启该光斑对应的超像素用于采集反射光束中的光子,具体方式如前所述,在此不再赘述。It can be understood that the configurations of the first and second sub-pixel circuits and the first and second processing circuits are the same. The specific working mode is the same as the working mode of the embodiment shown in FIG. 3. The sub-light source array is controlled to be turned on one by one along the baseline direction to emit spot beams toward the target field of view; The photon in the speckle beam is generated and the photon signal is output; the sub-processing circuit is used to receive the photon signal output by the corresponding sub-pixel array, and the flight time of the speckle beam from being emitted to being collected is calculated according to the photon signal. The difference is that, in the embodiment shown in FIG. 4 , when a sub-light source array is turned on in each measurement stage, the spot beams emitted by the sub-light source arrays are replicated by diffractive optical elements to generate two groups of spot beams. For example, in the first measurement stage, the first sub-light source array 211 emits 5 spot light beams, and after being replicated by the diffractive optical element, two sets of spot light beams 41 and 42 are projected toward the target field of view to the first field of view and the second field of view, respectively. Field, each group of 15 spots, the spot beam reflected by the target is imaged into the corresponding first and second pixel arrays, and the superpixel corresponding to the spot is turned on in the sub-pixel array to collect photons in the reflected beam. The specific method As mentioned above, details are not repeated here.
可以理解的是,在一些实施例中,光源阵列21包括4×5个光源,经过衍射元件复制后朝向目标区域投射8×15个斑点光束,对应的需设置像素阵列包括16×30个像素,其中像素阵列被配置为包括30个子像素阵列,对应连接30个TDC电路用于计算飞行时间。而现有的方案中,通常需要设置一个合像素共享一个TDC电路,则需设置120个TDC电路。因此,通过本实施例的设计可以大大降低TDC电路的数量。即光源阵列包括n个子光源阵列逐个开启对视场进行扫描,则可以将TDC电路和直方图电路的数量降低到1/n。图5中所示仅做示意性参考,其数量不具有限制性。It can be understood that, in some embodiments, the light source array 21 includes 4×5 light sources, and 8×15 spot beams are projected toward the target area after being replicated by the diffractive element, and the corresponding pixel array needs to be set to include 16×30 pixels, The pixel array is configured to include 30 sub-pixel arrays, and 30 TDC circuits are correspondingly connected for calculating the flight time. In the existing solution, it is usually necessary to set one combined pixel to share one TDC circuit, and 120 TDC circuits need to be set. Therefore, the number of TDC circuits can be greatly reduced through the design of this embodiment. That is, the light source array includes n sub-light source arrays that are turned on one by one to scan the field of view, so that the number of TDC circuits and histogram circuits can be reduced to 1/n. What is shown in FIG. 5 is for illustrative reference only, and the number thereof is not limiting.
根据上述实施例的说明,在进行系统设计时,在y方向(基线方向)上可以以小间隔布置光源,充分提高角分辨率,且y方向上的所有光源共享同一个子像素阵列,子像素阵列的长度完全可以覆盖视差,因此可以放宽对基线的要求,增加测距点数,提升了空间分辨率。由于y方向上光源排列密集,投射出的斑点光束对应的超像素存在重叠的情况,但采用了逐次扫描的方式,解决了超像素重叠的问题,提升了距离测量精度。而在x方向上,可以增大光源之间的间距,保证每个光源发出的光束经过反射后可以成像到对应的子像素阵列上 而不会出现出界的情况引起误差,因此可以放宽对公差的要求。并且将读出电路与像素阵列设计在同一平面上,降低了TDC电路和直方图电路的数量,有效的降低了工艺成本及复杂度。According to the description of the above embodiments, when designing the system, light sources can be arranged at small intervals in the y direction (baseline direction) to fully improve the angular resolution, and all the light sources in the y direction share the same sub-pixel array, and the sub-pixel array The length can completely cover the parallax, so the requirements for the baseline can be relaxed, the number of ranging points can be increased, and the spatial resolution can be improved. Due to the dense arrangement of light sources in the y direction, the superpixels corresponding to the projected spot beams overlap, but the successive scanning method is adopted to solve the problem of superpixel overlap and improve the distance measurement accuracy. In the x-direction, the distance between the light sources can be increased to ensure that the beams emitted by each light source can be imaged on the corresponding sub-pixel array after reflection without errors caused by out-of-bounds situations, so the tolerances can be relaxed. Require. In addition, the readout circuit and the pixel array are designed on the same plane, which reduces the number of TDC circuits and histogram circuits, and effectively reduces the process cost and complexity.
可以理解的是,以上实施例的说明均以基线方向设定为y方向为例进行说明,在一些其他实施例中,也可以将基线方向设定为x方向,则子光源阵列包括一列子光源,而子像素阵列包括至少一行像素。It can be understood that, the descriptions of the above embodiments are described by taking the baseline direction as the y direction as an example for description. In some other embodiments, the baseline direction can also be set as the x direction, and the sub-light source array includes a row of sub-light sources. , and the sub-pixel array includes at least one row of pixels.
本申请实施还提供一种存储介质,用于存储计算机程序,该计算机程序被执行时至少执行前述实施例方案所述的距离测量方法。An embodiment of the present application further provides a storage medium for storing a computer program, when the computer program is executed, at least the distance measurement method described in the foregoing embodiments is executed.
所述存储介质可以由任何类型的易失性或非易失性存储设备、或者它们的组合来实现。其中,非易失性存储器可以是只读存储器(ROM,Read Only Memory)、可编程只读存储器(PROM,Programmable Read-Only Memory)、可擦除可编程只读存储器(EPROM,ErasableProgrammable Read-Only Memory)、电可擦除可编程只读存储器(EEPROM,ElectricallyErasable Programmable Read-Only Memory)、磁性随机存取存储器(FRAM,FerromagneticRandom Access Memory)、快闪存储器(Flash Memory)、磁表面存储器、光盘、或只读光盘(CD-ROM,Compact Disc Read-Only Memory);磁表面存储器可以是磁盘存储器或磁带存储器。易失性存储器可以是随机存取存储器(RAM,Random Access Memory),其用作外部高速缓存。通过示例性但不是限制性说明,许多形式的RAM可用,例如静态随机存取存储器(SRAM,Static Random Access Memory)、同步静态随机存取存储器(SSRAM,SynchronousStatic Random Access Memory)、动态随机存取存储器(DRAM,Dynamic Random AccessMemory)、同步动态随机存取存储器(SDRAM,Synchronous Dynamic Random AccessMemory)、双倍数据速率同步动态随机存取存储器(DDRSDRAM,Double Data RateSynchronous Dynamic Random Access Memory)、增强型同步动态随机存取存储器(ESDRAM,Enhanced Synchronous Dynamic Random Access Memory)、同步连接动态随机存取存储器(SLDRAM,SyncLink Dynamic Random Access Memory)、直接内存总线随机存 取存储器(DRRAM,Direct Rambus Random Access Memory)。本申请实施例描述的存储介质旨在包括但不限于这些和任意其它适合类型的存储器。The storage medium may be implemented by any type of volatile or non-volatile storage device, or a combination thereof. Among them, the non-volatile memory can be a read-only memory (ROM, Read Only Memory), a programmable read-only memory (PROM, Programmable Read-Only Memory), an erasable programmable read-only memory (EPROM, Erasable Programmable Read-Only Memory) Memory), Electrically Erasable Programmable Read-Only Memory (EEPROM, Electrically Erasable Programmable Read-Only Memory), Magnetic Random Access Memory (FRAM, Ferromagnetic Random Access Memory), Flash Memory (Flash Memory), Magnetic Surface Memory, Optical Disc, Or compact disc read-only memory (CD-ROM, Compact Disc Read-Only Memory); magnetic surface memory can be magnetic disk memory or tape memory. Volatile memory may be Random Access Memory (RAM), which acts as an external cache. By way of example and not limitation, many forms of RAM are available, such as Static Random Access Memory (SRAM), SynchronousStatic Random Access Memory (SSRAM), Dynamic Random Access Memory (DRAM, Dynamic Random Access Memory), Synchronous Dynamic Random Access Memory (SDRAM, Synchronous Dynamic Random Access Memory), Double Data Rate Synchronous Dynamic Random Access Memory (DDRSDRAM, Double Data Rate Synchronous Dynamic Random Access Memory), Enhanced Synchronous Dynamic Random Access Memory Access memory (ESDRAM, Enhanced Synchronous Dynamic Random Access Memory), synchronous connection dynamic random access memory (SLDRAM, SyncLink Dynamic Random Access Memory), direct memory bus random access memory (DRRAM, Direct Rambus Random Access Memory). The storage medium described in the embodiments of the present application is intended to include but not limited to these and any other suitable types of memory.
本申请实施例还提供一种计算机设备,所述计算机设备包括存储器、处理器以及存储在所述存储器中并可在所述处理器上运行的计算机程序;其中,所述处理器执行所述计算机程序时至少实现前述实施例方案中所述的距离测量方法。Embodiments of the present application further provide a computer device, the computer device includes a memory, a processor, and a computer program stored in the memory and executable on the processor; wherein the processor executes the computer During the program, at least the distance measurement method described in the foregoing embodiments is implemented.
可以理解的是,以上内容是结合具体/优选的实施方式对本申请所作的进一步详细说明,不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说,在不脱离本申请构思的前提下,其还可以对这些已描述的实施方式做出若干替代或变型,而这些替代或变型方式都应当视为属于本申请的保护范围。在本说明书的描述中,参考术语“一种实施例”、“一些实施例”、“优选实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。It can be understood that the above content is a further detailed description of the present application in conjunction with specific/preferred embodiments, and it cannot be considered that the specific implementation of the present application is limited to these descriptions. For those of ordinary skill in the technical field of the present application, without departing from the concept of the present application, they can also make several substitutions or modifications to the described embodiments, and these substitutions or modifications should be regarded as It belongs to the protection scope of this application. In the description of this specification, reference to the terms "one embodiment," "some embodiments," "preferred embodiment," "example," "specific example," or "some examples" or the like is meant to be used in conjunction with the description. A particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present application.
在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。尽管已经详细描述了本申请的实施例及其优点,但应当理解,在不脱离由所附权利要求限定的范围的情况下,可以在本文中进行各种改变、替换和变更。In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other. Although the embodiments of the present application and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the scope as defined by the appended claims.
此外,本申请的范围不旨在限于说明书中所述的过程、机器、制造、物质组成、手段、方法和步骤的特定实施例。本领域普通技术人员将容易理解,可以利用执行与本文所述相应实施例基本相同功能或获得与本文所述实施例基本相同结果的目前存在的或稍后要开发的上述披露、过程、机器、制造、物质组成、手段、方法或步骤。因此,所附权利要求旨在将这些过程、机器、制造、 物质组成、手段、方法或步骤包含在其范围内。Furthermore, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. Those of ordinary skill in the art will readily appreciate that the above disclosures, processes, machines, now existing or later developed, that perform substantially the same functions or achieve substantially the same results as the corresponding embodiments described herein can be utilized. Manufacture, composition of matter, means, method or step. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.
Claims (10)
- 一种距离测量系统,其特征在于:包括沿基线设置的发射器与采集器、以及与发射器和采集器连接的处理电路;其中,A distance measurement system is characterized in that: it comprises a transmitter and a collector arranged along a baseline, and a processing circuit connected with the transmitter and the collector; wherein,所述发射器包括由多个光源组成的光源阵列,所述光源阵列包括多个子光源阵列,所述子光源阵列被配置为沿基线方向逐个开启用于发射斑点光束;The transmitter includes a light source array composed of a plurality of light sources, the light source array includes a plurality of sub-light source arrays, and the sub-light source arrays are configured to be turned on one by one along the baseline direction for emitting spot light beams;所述采集器包括由多个像素组成的像素阵列,所述像素阵列包括多个子像素阵列,所述多个子像素阵列经配置以采集所述斑点光束经待测目标物体反射回的反射光束中的光子并形成光子信号;The collector includes a pixel array composed of a plurality of pixels, the pixel array includes a plurality of sub-pixel arrays, and the plurality of sub-pixel arrays are configured to collect the speckle beam reflected back by the target object to be measured. photons and form photon signals;所述处理电路包括多个子处理电路,所述子处理电路与所述子像素阵列一一对应连接,以控制所述子像素阵列中的像素启动用于采集所述反射光束中的光子,并根据所述子像素阵列输出的所述光子信号计算出所述斑点光束从发射到反射回被采集的飞行时间。The processing circuit includes a plurality of sub-processing circuits, and the sub-processing circuits are connected to the sub-pixel array in one-to-one correspondence, so as to control the pixels in the sub-pixel array to activate for collecting photons in the reflected light beam, and according to the The photon signal output by the sub-pixel array calculates the time-of-flight of the speckle beam from emission to reflection back to being collected.
- 如权利要求1所述的距离测量系统,其特征在于:所述子光源阵列包括一行或一列光源;所述子光源阵列在驱动电路的控制下逐个分时段启动以投射所述斑点光束到目标视场;其中,在一个测量阶段仅激活一个子光源阵列,直到所有子光源阵列均被启动后,完成对整个目标视场的扫描。The distance measurement system according to claim 1, wherein: the sub-light source array comprises a row or a column of light sources; the sub-light source array is activated one by one under the control of a driving circuit to project the spot beam to the target viewing area Field; in which, only one sub-light source array is activated in one measurement stage, until all sub-light source arrays are activated, the scanning of the entire target field of view is completed.
- 如权利要求2所述的距离测量系统,其特征在于:所述光源阵列的扫描方向与基线方向相同。The distance measurement system according to claim 2, wherein the scanning direction of the light source array is the same as the baseline direction.
- 如权利要求1所述的距离测量系统,其特征在于:所述像素阵列与所述处理电路设置在同一平面内。The distance measurement system according to claim 1, wherein the pixel array and the processing circuit are arranged in the same plane.
- 如权利要求1所述的距离测量系统,其特征在于:还包括有衍射光学元件,所述子光源阵列发射的斑点光束经过所述衍射光学元件复制后投射到目标视场中形成两组斑点投影图案,以同步扫描目标视场中的两个区域。The distance measurement system according to claim 1, further comprising a diffractive optical element, and the spot beam emitted by the sub-light source array is copied by the diffractive optical element and projected into the target field of view to form two sets of spot projections pattern to simultaneously scan two areas in the target's field of view.
- 如权利要求5所述的距离测量系统,其特征在于:所述像素阵列分为第一像素阵列和第二像素阵列,每个像素阵列包括多个所述子像素阵列;所述处理电路对应分为第一处理电路和第二处理电路,每个处理电路包括多个所述子 处理电路;所述第一处理电路和所述第二处理电路分别设置在所述像素阵列的两侧并分别与所述第一像素阵列以及所述第二像素阵列一一对应连接,用于接收对应的子像素阵列内的像素输出的光子信号并计算光束的飞行时间。The distance measurement system according to claim 5, wherein: the pixel array is divided into a first pixel array and a second pixel array, each pixel array includes a plurality of the sub-pixel arrays; the processing circuit corresponds to the pixel array It is a first processing circuit and a second processing circuit, and each processing circuit includes a plurality of the sub-processing circuits; the first processing circuit and the second processing circuit are respectively arranged on both sides of the pixel array and are respectively connected with each other. The first pixel array and the second pixel array are connected in one-to-one correspondence, and are used for receiving photon signals output by pixels in the corresponding sub-pixel array and calculating the flight time of the light beam.
- 一种距离测量方法,其特征在于,包括如下步骤:A method for measuring distance, comprising the steps of:S10、控制发射器中的子光源阵列逐个开启,朝向目标视场发射斑点光束;其中,所述发射器包括由多个光源组成的光源阵列,所述光源阵列包括多个所述子光源阵列;S10. Control the sub-light source arrays in the transmitter to be turned on one by one, and emit spot light beams toward the target field of view; wherein, the transmitter includes a light source array composed of a plurality of light sources, and the light source array includes a plurality of the sub-light source arrays;S20、控制采集器的子像素阵列中的像素启动以采集反射回的所述斑点光束中的光子,并形成光子信号;其中,所述采集器包括由多个像素组成的像素阵列,所述像素阵列包括多个所述子像素阵列;S20. Control the activation of the pixels in the sub-pixel array of the collector to collect photons in the reflected speckle beam, and form a photon signal; wherein the collector includes a pixel array composed of a plurality of pixels, and the pixels an array including a plurality of the sub-pixel arrays;S30、利用处理电路中的子处理电路接收对应的所述子像素阵列输出的光子信号,并根据所述光子信号计算斑点光束从发射到被采集之间的飞行时间。S30. Use the sub-processing circuit in the processing circuit to receive the photon signal output by the corresponding sub-pixel array, and calculate the time-of-flight of the speckle beam from being emitted to being collected according to the photon signal.
- 如权利要求7所述的距离测量方法,其特征在于:所述处理电路被配置为包括多个所述子处理电路;其中,所述子像素阵列与所述子处理电路一一对应连接。The distance measurement method according to claim 7, wherein: the processing circuit is configured to include a plurality of the sub-processing circuits; wherein, the sub-pixel array is connected to the sub-processing circuits in a one-to-one correspondence.
- 如权利要求8所述的距离测量方法,其特征在于:步骤S10中,沿基线方向逐个开启所述子光源阵列发射斑点光束,直至所有子光源阵列均被启动,完成对目标视场的扫描;其中,处于光源阵列中同一列/或同一行的光源发射的斑点光束均入射到同一个所述子像素阵列中的部分像素上,被同一个子处理电路计算出光束的飞行时间。The distance measurement method according to claim 8, characterized in that: in step S10, the sub-light source arrays are turned on one by one along the baseline direction to emit spot beams, until all the sub-light source arrays are activated, and the scanning of the target field of view is completed; Wherein, the spot light beams emitted by the light sources in the same column/or the same row in the light source array are all incident on some pixels in the same sub-pixel array, and the flight time of the light beams is calculated by the same sub-processing circuit.
- 一种计算机设备,其特征在于,包括:存储器、处理器以及存储在所述存储器中并可在所述处理器上运行的计算机程序;其中,所述处理器执行所述计算机程序时至少实现一种距离测量方法;所述距离测量方法包括步骤:S10、控制发射器中的子光源阵列逐个开启,朝向目标视场发射斑点光束;其中,所述发射器包括由多个光源组成的光源阵列,所述光源阵列包括多个所述子光源阵列;S20、控制采集器的子像素阵列中的像素启动以采集反射回的所述斑点光 束中的光子,并形成光子信号;其中,所述采集器包括由多个像素组成的像素阵列,所述像素阵列包括多个所述子像素阵列;S30、利用处理电路中的子处理电路接收对应的所述子像素阵列输出的光子信号,并根据所述光子信号计算斑点光束从发射到被采集之间的飞行时间。A computer device, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor; wherein, when the processor executes the computer program, at least one A distance measurement method; the distance measurement method includes the steps: S10, controlling the sub-light source arrays in the transmitter to be turned on one by one, and emitting spot light beams toward the target field of view; wherein, the transmitter includes a light source array composed of a plurality of light sources, The light source array includes a plurality of the sub-light source arrays; S20, control the pixels in the sub-pixel array of the collector to start to collect photons in the reflected spot beams, and form a photon signal; wherein, the collector Including a pixel array composed of a plurality of pixels, and the pixel array includes a plurality of the sub-pixel arrays; S30. Use the sub-processing circuit in the processing circuit to receive the photon signal output by the corresponding sub-pixel array, and according to the The photon signal calculates the time-of-flight of the speckle beam from launch to acquisition.
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WO2022166583A1 (en) * | 2021-02-08 | 2022-08-11 | 深圳市灵明光子科技有限公司 | Projection device, three-dimensional imaging system, three-dimensional imaging method, and electronic product |
CN113538592B (en) * | 2021-06-18 | 2023-10-27 | 深圳奥锐达科技有限公司 | Calibration method and device for distance measuring device and camera fusion system |
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CN113960569A (en) * | 2021-10-19 | 2022-01-21 | 深圳奥锐达科技有限公司 | Distance measuring system and distance measuring method |
CN216622678U (en) * | 2021-11-23 | 2022-05-27 | 奥诚信息科技(上海)有限公司 | Optical measurement system |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101866056A (en) * | 2010-05-28 | 2010-10-20 | 中国科学院合肥物质科学研究院 | 3D imaging method and system based on LED array common lens TOF depth measurement |
US20110304841A1 (en) * | 2008-06-30 | 2011-12-15 | Microsoft Corporation | System architecture design for time-of- flight system having reduced differential pixel size, and time-of- flight systems so designed |
US20170102461A1 (en) * | 2015-10-09 | 2017-04-13 | Fujitsu Limited | Distance measuring apparatus, distance measuring method, and table creating method |
CN110596724A (en) * | 2019-09-19 | 2019-12-20 | 深圳奥锐达科技有限公司 | Method and system for measuring flight time distance during dynamic histogram drawing |
CN110596721A (en) * | 2019-09-19 | 2019-12-20 | 深圳奥锐达科技有限公司 | Flight time distance measuring system and method of double-shared TDC circuit |
CN110596722A (en) * | 2019-09-19 | 2019-12-20 | 深圳奥锐达科技有限公司 | System and method for measuring flight time distance with adjustable histogram |
CN110596725A (en) * | 2019-09-19 | 2019-12-20 | 深圳奥锐达科技有限公司 | Time-of-flight measurement method and system based on interpolation |
CN110596723A (en) * | 2019-09-19 | 2019-12-20 | 深圳奥锐达科技有限公司 | Method and system for measuring flight time distance during dynamic histogram drawing |
CN111856433A (en) * | 2020-07-25 | 2020-10-30 | 深圳奥锐达科技有限公司 | Distance measuring system and measuring method |
-
2020
- 2020-07-25 CN CN202010726629.XA patent/CN111856433B/en active Active
- 2020-12-30 WO PCT/CN2020/141722 patent/WO2022021797A1/en active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110304841A1 (en) * | 2008-06-30 | 2011-12-15 | Microsoft Corporation | System architecture design for time-of- flight system having reduced differential pixel size, and time-of- flight systems so designed |
CN101866056A (en) * | 2010-05-28 | 2010-10-20 | 中国科学院合肥物质科学研究院 | 3D imaging method and system based on LED array common lens TOF depth measurement |
US20170102461A1 (en) * | 2015-10-09 | 2017-04-13 | Fujitsu Limited | Distance measuring apparatus, distance measuring method, and table creating method |
CN110596724A (en) * | 2019-09-19 | 2019-12-20 | 深圳奥锐达科技有限公司 | Method and system for measuring flight time distance during dynamic histogram drawing |
CN110596721A (en) * | 2019-09-19 | 2019-12-20 | 深圳奥锐达科技有限公司 | Flight time distance measuring system and method of double-shared TDC circuit |
CN110596722A (en) * | 2019-09-19 | 2019-12-20 | 深圳奥锐达科技有限公司 | System and method for measuring flight time distance with adjustable histogram |
CN110596725A (en) * | 2019-09-19 | 2019-12-20 | 深圳奥锐达科技有限公司 | Time-of-flight measurement method and system based on interpolation |
CN110596723A (en) * | 2019-09-19 | 2019-12-20 | 深圳奥锐达科技有限公司 | Method and system for measuring flight time distance during dynamic histogram drawing |
CN111856433A (en) * | 2020-07-25 | 2020-10-30 | 深圳奥锐达科技有限公司 | Distance measuring system and measuring method |
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