WO2022015307A1 - Ensembles puces fluidiques dotés de charnières mobiles - Google Patents

Ensembles puces fluidiques dotés de charnières mobiles Download PDF

Info

Publication number
WO2022015307A1
WO2022015307A1 PCT/US2020/042245 US2020042245W WO2022015307A1 WO 2022015307 A1 WO2022015307 A1 WO 2022015307A1 US 2020042245 W US2020042245 W US 2020042245W WO 2022015307 A1 WO2022015307 A1 WO 2022015307A1
Authority
WO
WIPO (PCT)
Prior art keywords
living hinge
die assembly
fluidic
fluidic die
electrical connection
Prior art date
Application number
PCT/US2020/042245
Other languages
English (en)
Inventor
Mida LORENZ
Si-Lam J. Choy
Jeffrey S. Obert
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/US2020/042245 priority Critical patent/WO2022015307A1/fr
Priority to TW110120660A priority patent/TW202206296A/zh
Publication of WO2022015307A1 publication Critical patent/WO2022015307A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/12—Guards, shields or dust excluders
    • B41J29/13—Cases or covers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/1752—Mounting within the printer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17553—Outer structure

Definitions

  • FIG. 3 is a block diagram of top view of the fluidic die assembly with the living hinge of the present disclosure before being bent;
  • FIG. 5 is a block diagram different examples of the living hinge of the present disclosure.
  • Examples described herein provide a fluidic die assembly and method for producing the same that includes a living hinge.
  • some printers may use inkjet printer cartridges.
  • the fluidic die assembly on some fluid ejection devices may include multiple components that are connected by a flexible circuit. The multiple components are fit together for a particular sized fluidic storage tank.
  • fluidic storage tanks include some of the electrical connections and/or mechanical datums used for alignment on the storage tank itself. This adds complexity to the design of the fluidic storage tank.
  • FIG. 1 illustrates an example printing device 100 that includes a fluid ejection device 106 (e.g., a printing fluid cartridge) that includes a fluidic die assembly 108 with living hinges of the present disclosure.
  • the printing device 100 may be an inkjet printer that ejects printing fluid to print an image on a print media (e.g., paper).
  • the ejection of print fluid may be controlled by a processor (not shown) of the printing device 100 in accordance with a print file transmitted from a computing device (not shown) to the printing device 100.
  • FIG. 1 Although a single fluid ejection device 106 is illustrated in FIG. 1 , it should be noted that a plurality of fluid ejection devices 106 may be deployed in the printing device 100.
  • the carriage 104 may be sized to accommodate multiple fluid ejection devices 106.
  • the carriage 104 may include electrical connections 110 for the corresponding connections on each fluidic die assembly 108.
  • the fluidic die assembly 108 may be fabricated as a single piece that can be bent. The fluidic die assembly 108 may then be coupled to a fluidic storage tank to form the fluid ejection device 106.
  • the fluidic die assembly 108 may be coupled to a variety of differently sized fluidic storage tanks. In some instances, the fluidic die assembly 108 may be slightly modified in size to accommodate different fluidic storage tanks. Said another way, each differently sized fluidic storage tank may not use a differently sized fluidic die assembly 108. As a result, a single fluidic die assembly 108, or a couple of different fluidic die assemblies 108, may be used for many differently sized fluidic storage tanks, thereby reducing production costs and inventory costs.
  • the fluidic die assembly 108 may contain the electrical connections that may have been previously fabricated on the fluidic storage tank.
  • the fabrication of the fluidic storage tanks can be simplified, and the cost to produce the fluidic storage tanks may also be reduced.
  • the fluidic die assembly 108 may contain the alignment connections (e.g., mechanical datums). As a result, alignment connections from the fluidic storage tank can be removed.
  • the material may be a plastic or polymer that is used to create the fluidic die assembly 108.
  • the fluidic die assembly 108 may be formed via an over-molded wire frame as part of an over-molded wire frame process.
  • a wire frame may be constructed that includes various wires and electrical connections (as described below).
  • the plastic or polymer may be poured over the wire frame within a mold to form the fluidic die assembly 108 and allowed to cool.
  • the material may be a thermoplastic that can be bent or manipulated to allow the living hinge 304 to be bent, as discussed in further details below. Examples of the thermoplastic may include polysulfones, polyphenylene sulfides, and the like.
  • the first portion 302 may be a fluidic die assembly slot portion that includes a plurality of slots 308i to 308 n (hereinafter also referred to individually as a slot 308 or collectively as slots 308).
  • the number slots 308 may correspond to a number of different printing fluids that can be ejected from a fluidic storage tank.
  • the slots 308 may correspond to nozzles located on a fluidic die that includes nozzles.
  • the fluidic die can be electrically controlled to eject droplets of print fluid in accordance with an image that is to be printed by the printing device 100.
  • the print fluid ejected from the nozzles may flow through the corresponding slot or slots 308.
  • the openings of the fluidic storage tanks 202, 204, and 206 may be formed to correspond to the dimensions of the slots 308.
  • a single design of the first portion 302 may be used to accommodate the different sized fluidic storage tanks 202, 204, and 206.
  • the second portion 306 may be an electrical connection portion that includes electrical connections 310i to 310 m (hereinafter also referred to individually as an electrical connection 310 or collectively as electrical connections 310) and a datum 312.
  • the electrical connections 310 may be electrically connected via wires (not shown) that run through the living hinge 304 and to connection points of the slots 308.
  • the electrical connections 310 may allow electrical signals to be sent from the processor of the printing device 100 to the slots 308.
  • the datum 312 may provide alignment information to the printing device 100.
  • the datum 312 may connect to a corresponding datum on the carriage 104.
  • the datum 312 may provide registration information to the printing device 100.
  • the datum 312 may also provide a distance of the electrical connections 310 on the second portion 306 to electrical connections 110 in the carriage 104 illustrated in FIG. 1. Previous print fluid cartridge designs were fabricated into the fluidic storage tank.
  • moving the datum 312 to the fluidic die assembly 108 may simplify the design and production of the fluidic storage tank, as noted above, to reduce production costs.
  • the second portion 306 may include tabs 316 and 320.
  • the tab 316 may fit into the slot 314 of the hinge locking feature 318.
  • the tab 320 may fit into the slot 314 of the hinge locking feature 322.
  • FIG. 4 illustrates a block diagram of an example of the fluidic die assembly 108 after the living hinge 304 is bent.
  • the tab 316 may be mated with the hinge locking feature 318.
  • the tab 320 may be mated with the hinge locking feature 322.
  • the hinge locking features 318 and 322 may have a respective raised portion 325 and 326 to provide additional support and to prevent the second portion 306 from moving towards a flat position (e.g., the position illustrated in FIG. 3).
  • the fluidic die assembly 108 may be coupled to a fluidic storage tank.
  • the combined fluidic die assembly 108 and fluidic storage tank may form the fluid ejection device 106 illustrated in FIG. 1.
  • the living hinge 304 may include wiring or electrical connections that connect the electrical connections 310 to the slots 308.
  • the living hinge 304 may have various features that may protect the wiring during bending of the living hinge 304 and during operation of the fluid ejection device 106 within the printing device 100.
  • the living hinge 304 may include the plurality of structures 330.
  • wires 326i to 326 p (hereinafter also referred to individually as a wire 326 or collectively as wires 326) may be passed through the living hinge 304 and located between the structures 330.
  • the plurality of structures 330 may be located between the wires 326.
  • An encapsulant 332 may be poured over the living hinge 304 to encapsulate the wires 326 between the structures 330.
  • the encapsulant may be a liquid polymer that can be cured to form a flexible solid material.
  • the liquid polymer may be poured on both sides of the living hinge 304 to encapsulate the wires 326, and the liquid polymer may then be cured.
  • the liquid polymer may be poured over a single side of the living hinge 304. The liquid polymer may flow between the structures 330 to the opposite side of the living hinge and then cured.
  • the geometry of the structures 330 may be modified to allow the liquid polymer to flow between the structures 330 and fully encapsulate the wires 326.
  • the structures 330 may be rectangular columns with a curved side (e.g., an arch shape when viewed from a side of the structures 330).
  • the curvature may also provide strain relief and hinge bending so that the hinge does not bend during bending and bends in the right location.
  • the curvature may also remove some surface area on the sides of the structures 330 to reduce surface tension and allow the liquid polymer to flow easily between the structures 330 from one side to the other.
  • the structures 330 may be spaced apart a particular distance. Increasing the distance between the structures 330 may minimize the surface tension between the structures 330 and help the liquid polymer to flow between the structures 330.
  • the living hinge 304 may include the plurality of structures 330.
  • wires 328i to 328 r (hereinafter referred to individually as a wire 328 or collectively as wires 328) may be passed through the living hinge 304 and located between the structures 330.
  • the wires 328 may be exposed between the structures 330.
  • the wires 328 may be located in the open spaces between the structures 330 without any encapsulant.
  • the wires 328 are shown as a solid line between the structures 330 and then dashed lines as the wires 328 pass into the first portion 302 and the second portion 306.
  • the living hinge 304 may be fabricated from a thermoplastic, as discussed above.
  • the living hinge 304 may be heated to a melting temperature or near melting temperature of the thermoplastic.
  • a hot pin may be placed against the living hinge 304 to locally heat the thermoplastic where the bend may occur.
  • the living hinge 304 may be bent to allow the tabs 316 and 320 to mate with the hinge lock features 318 and 322, respectively.
  • the living hinge 304 may be allowed to cool until the thermoplastic is solidified and set into the bent position (e.g., as illustrated in FIG. 4).
  • the living hinge 304 may be bent as described above for examples 502 and 506 that do not use an encapsulant 332.
  • the living hinge 304 may be bent after the encapsulant 332 is poured over the structures 330.
  • the encapsulant 332 may be cured after the living hinge is bent.
  • the living hinge 304 may be bent first. Then, the encapsulant 332 may be poured over the living hinge 304 that is bent (e.g., over a single side or over both sides). The encapsulant 332 may then be cured to encapsulate the wires 326.
  • FIG. 6 illustrates a flow diagram of an example method 600 for fabricating the fluidic die assembly with the living hinge of the present disclosure.
  • the method 600 may be an example of an over-molded wire frame process.
  • the method 600 may be performed by various different equipment in a manufacturing facility.
  • the method 600 begins.
  • the method 600 forms slots on a first portion of a wire frame to correspond with nozzles on a die to eject printing fluid.
  • the wire frame may be formed to include openings where the thermoplastic may form the slots around the openings.
  • the slots may correspond to nozzles that are formed on sliver dies (e.g., using silver).
  • the die may be a component of the fluid ejection device where the nozzles may be formed.
  • the nozzles on the die may be electrically controlled to control ejection of printing fluid from the fluidic storage tank.
  • the die may be coupled between the fluidic storage tank and the first portion of the fluidic die assembly of the present disclosure.
  • the first portion may be coupled to the die such that the nozzles on the die and the slots are aligned.
  • the printing fluid may then be ejected out of the nozzles and through the slots.
  • the method 600 may form electrical connections on a second portion of the wire frame.
  • the electrical connections may be formed or stamped on a frame.
  • the electrical connections may be connected to corresponding electrical connections on a printer carriage to control the nozzles to eject printing fluid.
  • the method 600 may provide a mold for a living hinge between the first portion and the second portion.
  • a mold with the desired shape and features of the structures to be formed in the living hinge may be provided between the first portion and the second portion.
  • the method 600 pours a thermoplastic over the wire frame and mold to form a fluidic die assembly.
  • the thermoplastic may be a material such as polysulfones, polyphenylene sulfides, and the like.
  • the thermoplastic may be poured to encapsulate the wire frame and the mold to form the living hinge.
  • the method 600 bends the living hinge such that the first portion is approximately perpendicular to the second portion to be coupled to a fluidic storage tank.
  • heat may be applied to the living hinge such that the thermoplastic at the living hinge is heated to a melting temperature or near a melting temperature.
  • the heat may be applied via a heat pin.
  • the living hinge may be bent and allowed to cool to set the shape of living hinge.
  • the living hinge may have corresponding hinge locking features on the first portion and the second portion.
  • the living hinge may be bent until the corresponding hinge locking features mate and are locked into position.
  • the hinge locking features may help maintain the bend.
  • the fluidic die assembly may be coupled to the fluidic storage tank to form a fluidic die assembly.
  • the fluidic die assembly may be coupled to the fluidic storage tank such that the first portion rests against a bottom side of the fluidic storage tank where print fluid is ejected.
  • the second portion of the fluidic die assembly may rest against a front side of the fluidic storage tank.
  • the fluidic die assembly may be coupled to the fluidic storage tank with an adhesive.
  • the fluidic die assembly may be inserted into a printing device to eject print fluid, as described above.
  • the method 600 ends.

Abstract

Selon des modes de réalisation donnés à titre d'exemple, la présente invention concerne un appareil. L'appareil comprend une partie fente d'ensemble puce fluidique pour éjecter un fluide d'impression, une partie connexion électrique pour fournir des connexions électriques à des connexions électriques correspondantes dans un chariot d'une imprimante, et une charnière mobile. La charnière mobile est destinée à relier la partie fente d'ensemble puce fluidique à la partie connexion électrique. La partie fente d'ensemble puce fluidique, la partie charnière mobile et la partie connexion électrique sont formées en une seule pièce.
PCT/US2020/042245 2020-07-16 2020-07-16 Ensembles puces fluidiques dotés de charnières mobiles WO2022015307A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/US2020/042245 WO2022015307A1 (fr) 2020-07-16 2020-07-16 Ensembles puces fluidiques dotés de charnières mobiles
TW110120660A TW202206296A (zh) 2020-07-16 2021-06-07 具有活動鉸鏈之流體晶粒總成

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2020/042245 WO2022015307A1 (fr) 2020-07-16 2020-07-16 Ensembles puces fluidiques dotés de charnières mobiles

Publications (1)

Publication Number Publication Date
WO2022015307A1 true WO2022015307A1 (fr) 2022-01-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2020/042245 WO2022015307A1 (fr) 2020-07-16 2020-07-16 Ensembles puces fluidiques dotés de charnières mobiles

Country Status (2)

Country Link
TW (1) TW202206296A (fr)
WO (1) WO2022015307A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012166552A1 (fr) * 2011-06-02 2012-12-06 A. Raymond Et Cie Dispositifs de fixation fabriqués par impression en trois dimensions
US8573741B2 (en) * 2009-10-30 2013-11-05 Hewlett-Packard Development Company, L.P. Fluid-ejection assembly substrate having rounded ribs
US20180001628A1 (en) * 2013-11-26 2018-01-04 Hewlett-Packard Development Company, L.P. Fluid ejection apparatus with single-side thermal sensor
EP2670598B1 (fr) * 2011-01-31 2019-07-03 Hewlett-Packard Development Company, L.P. Ensemble d'éjection de fluide et procédés associés

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8573741B2 (en) * 2009-10-30 2013-11-05 Hewlett-Packard Development Company, L.P. Fluid-ejection assembly substrate having rounded ribs
EP2670598B1 (fr) * 2011-01-31 2019-07-03 Hewlett-Packard Development Company, L.P. Ensemble d'éjection de fluide et procédés associés
WO2012166552A1 (fr) * 2011-06-02 2012-12-06 A. Raymond Et Cie Dispositifs de fixation fabriqués par impression en trois dimensions
US20180001628A1 (en) * 2013-11-26 2018-01-04 Hewlett-Packard Development Company, L.P. Fluid ejection apparatus with single-side thermal sensor

Also Published As

Publication number Publication date
TW202206296A (zh) 2022-02-16

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