WO2022010434A1

WO2022010434A1 - An electroplating system

Info

Publication number: WO2022010434A1
Application number: PCT/TR2021/050349
Authority: WO
Inventors: Nursev ERDOGAN; Aziz Taner ASTARLIOGLU; Busra RAKOP
Original assignee: Tusas- Turk Havacilik Ve Uzay Sanayii Anonim Sirketi
Priority date: 2020-07-10
Filing date: 2021-04-14
Publication date: 2022-01-13
Also published as: TR202011008A1

Abstract

This invention relates to a body (2), at least one substrate (3) on which various physical and/or chemical processes are applied, a coating (4) enabling to improve the mechanical and/or chemical properties of the substrate (3) by successively depositing at least one coating layer (L) on the substrate (3), at least one coating unit (5) enabling the application of coating (4) with electric current (E) applied to the solution (S) contained therein, at least one surface resistance measurement unit (6) in which the surface resistance of the substrate (3) and/or coating (4) is measured, at least one surface topography measurement unit (7) in which the surface topography (RMS) of the substrate (3) and/or coating (4) is measured.

Description

AN ELECTROPLATING SYSTEM

The present invention relates to an electroplating system wherein a homogeneous, dense and visible range of electroplating can be obtained to provide desired microstructure, electrical conductivity and optical permeability properties to a substrate by means of electrocoating.

In order for the parts to have the desired mechanical and/or physical properties, coatings can be made on the parts by different methods in the state of the art. Although each method has advantages and disadvantages, the appropriate coating method is selected according to the optical permeability and electrical conductivity characteristics expected from the part and the coating process is carried out by using the selected method. The coating process is carried out under very small thickness controls. Although thin film coating is a very sensitive process, precise detection and application of parameters are vital in terms of meeting the quality, optical permeability and electrical conductivity characteristics of the coat. The electroplating method, which is one of the thin-film coating methods, is frequently used in the industry because it can be applied to large sized parts on the industrial scales.

In the United States patent application document no. US20140116884A1, which is included in the known state of the art, is mentioned a method for controlling the electroplating. In the method, it is mentioned to measure the current that applied to the object to be coated at the time of electroplating using a current sensor and to obtain the current information in order to perform the necessary operations, to send the processed current information to HMI (Human Machine Interface) by the measurement system, to send the processed data to PLC (Programmable Logic Controller) by HMI, to receive the data from HMI and to save it in the memory, to check the output values of the rectifier by PLC and to compare and calculate the current measurement values stored in memory and set current values in order to check the current provided to the electroplating bath by the rectifier according to the control of PLC. In the United States patent application document no. US20070227633A1, which is included in the known state of the art, is mentioned the continuous coating of continuously moving roll-to-roll sheets by an electroplating method, determining the film thickness of a portion of the roll-to-roll sheet and thereby forming a thickness signal. In continuous electroplating, it is mentioned that the thickness of the film is adjusted using the thickness signal of a certain region of the film, and the thickness measurement is performed using an XRF (X-Ray fluorescence) head or probe (head or control bar) measuring instrument. The measuring instrument can move to the x, y or z axes.

According to the requirements that expected from a coating in the electroplating method in the prior art, the user determines the electroplating parameters such as current density magnitude, current application time and time of current off, pulsed current waveform, and the electrocoating process is performed according to the specified parameters.

Thanks to an electroplating system developed by the present invention, desired microstructure, optical permeability and electrical conductivity properties are achieved from a coating by updating the coating parameters thanks to making real-time measurements on the coating during the electroplating process.

A further object of this invention is to ensure that the electroplating process is performed rapidly and effectively by providing in real time the electroplating process and the necessary measurements to be performed during the electroplating process with a conveyor like system.

A further object of this invention is to prevent the production of coated parts that have to be discarded by receiving feedback from the coating process as to whether the coating has taken place properly during the coating process, and applying coatings that can meet the expected microstructure, electrical conductivity and optical permeability properties of the coated parts.

The electroplating system realized to achieve the object of the invention and defined in the first claim and in the claims dependent thereon, comprises a body, at least one substrate which various physical and/or chemical processes are performed on, a coating for improving the mechanical and/or chemical properties of the substrate by successively depositing at least one coating layer on the substrate, at least one coating unit for performing coating using electric current applied to the solution contained therein, at least one surface resistance measurement unit in which the surface resistance of the substrate and/or coating is measured, at least one surface topography measurement unit in which the surface topography of the substrate and/or coating is measured.

The electroplating system of the invention comprises at least one processor unit that compares the surface resistance and surface topography measurement data of the substrate and/or coating layer with coating parameter values that predetermined by the user, updates the coating process parameters almost entirely in each coating layer and enables the coating process to be carried out in real time and with feedback.

In an embodiment of the invention, the electroplating system comprises a coating obtained with the elecrocoating process steps of selecting the substrate to be coated (I), measuring the surface resistance of the substrate before the electrocoating process (II), measuring the surface topography of the substrate before the electrocoating process (III), comparing the measured surface resistance and surface topography values of the substrate with the user-predetermined surface resistance and surface topography values of the substrate by means of the processor unit and setting the pulsed current density, current application time and current off time parameters and realizing the first coating layer to the substrate (IV), measuring the surface resistance and/or surface topography of the coating layer (V), if the coating layer thickness is larger than the thickness that predetermined by the user, applying inverse current density, current application time and current off time parameters calculated by the processor unit to the coating layer, comparing the measured surface resistance and surface topography values of the coating layer with the user-predetermined surface resistance and surface topography values of the coating layer by means of the processor unit, updating the pulsed current density, current application time and current off time parameter values to be applied to the next coating layer (L) and applying the new parameter values to the next coating layer (VI), applying the pulsed current density, application time and off time parameters determined in real time by the processor unit as many times as required to reach the final surface resistance and surface topography values that predetermined by the user (VII). In an embodiment of the invention, the electroplating system comprises a body for enabling the coating unit, the surface resistance measurement unit, and the surface topography measurement units to be located on it, and for applying effective coating using the function of fully automatic transportation of the substrate and/or coating between the units.

In an embodiment of the invention, the electroplating system comprises a thin film coating on the substrate applied as Au metal of 1-100 nm thickness and having targeted electrical conductivity and optical permeability values.

In an embodiment of the invention, the electroplating system comprises a processor unit for obtaining coatings of thickness in nm level almost entirely approximating to the theoretically calculated electrical conductivity and optical permeability values of the substrate and/or coating as a result of the ability of calculating the current densities at nm level.

In an embodiment of the invention, the electroplating system comprises a coating that reaches the user-predetermined coating layer thickness value by applying reverse current density, current application time and current off time parameters calculated in the processor unit if the coating layer thickness is larger than the user predetermined coating layer thickness.

In an embodiment of the invention, the electroplating system comprises a processor unit enabling a thickness control between 0.1-20 nm to be carried out and coatings between 0.1-100 nm thickness to be almost homogeneously coated in the coating unit by the ability of calculating the current densities at nm level.

In an embodiment of the invention, the electroplating system comprises a coating that can be applied for purposes such as electromagnetic shielding, ice protection, optical filter, low visibility by having the targeted microstructure, surface resistance and/or surface topography properties. In an embodiment of the invention, the electroplating system comprises a coating that can be applied in infrared detectors and sensors as it can be obtained using plasma resonance at a user predetermined wavelength.

In an embodiment of the invention, the electroplating system comprises a coating that can be applied in advanced optical applications such as metamaterial for electromagnetic applications and Fabry Perot cavity systems thanks to its ability to be applied to patterned structures at nm precision.

In an embodiment of the invention, the electroplating system comprises a coating unit almost completely preventing the formation of dendritic growth in the coating microstructure by applying high current density magnitudes of between 10-1000 A/m2 and time magnitudes of between 0.1 ms - 1 s, and enabling the application of coatings with desired physical and/or chemical properties thanks to its ability to forming a homogeneous nucleation.

In an embodiment of the invention, the electroplating system comprises a coating of targeted microstructure, electrical conductivity and optical permeability values thanks to its 0.1 nm thickness control and its ability to be applied in the form of Au thin film at 1-100 nm thickness values by applying high current density values between 10-1000 A/m2.

In an embodiment of the invention, the electroplating system comprises a surface resistance measurement unit in which the measurement of surface resistance is performed by means of a two-point probe, four-point probe methods or hall measurement device.

In an embodiment of the invention, the electroplating system comprises a surface topography measurement unit in which the measurement of surface topography is performed by atomic force microscope (AFM) or surface profilometer methods.

In an embodiment of the invention, the coating unit comprises a coating unit visually detecting the microstructure of the coating layers by TEM or SEM methods and a processor unit that compares the obtained microstructure images with user-predefined microstructure images and allows almost a complete approximation to the user- predetermined process parameters to be made after each coating process by means of machine learning.

The electroplating system realized to achieve the object of the present invention is shown in the attached figures, wherein from these figures;

Figure 1 - is a schematic view of an electroplating system.

Figure 2 - is a flow chart of the electroplating method used in an electroplating system. Figure 3 - is a section TEM image of the gold thin film coating applied using an electroplating system.

Figure 4 - is a SEM surface morphology image of the gold thin film coating applied using an electroplating system.

Figure 5 - is a surface topography graph measured while coating is applied using an electroplating system.

Figure 6 - is an optical permeability-wavelength graph of the gold thin film coating applied using an electroplating system.

Figure 7 - is an optical permeability-wavelength graph of the gold thin film coating applied using an electroplating system and obtained by plasmonic resonance.

All the parts illustrated in figures are individually assigned a reference numeral and the corresponding terms of these numbers are listed below.

1. Electroplating system

2. Body

3. Substrate

4. Coating

5. Coating unit

6. Surface resistance measurement unit

7. Surface topography measurement unit

8. Processor unit (Rs) Surface resistance (RMS) Surface topography (A) Current density

(Ta) Current application time (Tk) Current off time (S) Solution (E) Electric current (L) Coating layer

The electroplating system (1) comprises a body (2), at least one substrate (3) on which various physical and/or chemical processes are applied, a coating (4) enabling to improve the mechanical and/or chemical properties of the substrate (3) by successively depositing at least one coating layer (L) on the substrate (3), at least one coating unit (5) enabling the application of coating (4) with electric current (E) applied to the solution (S) contained therein, at least one surface resistance measurement unit (6) in which the surface resistance of the substrate (3) and/or coating (4) is measured, at least one surface topography measurement unit (7) in which the surface topography (RMS) of the substrate (3) and/or coating (4) is measured (Figure -1).

The electroplating system (1) of the invention comprises at least one processor unit (8) that compares the surface resistance (Rs) and surface topography (RMS) measurement data of the substrate (3) and/or coating layer (L) with the coating (4) parameter values predetermined by the user, updates the coating (4) process parameters almost entirely in each coating layer (L) and enables the coating (4) process to be carried out in real time and with feedback (Figure -1, Figure -2).

Thanks to the coating (4) process applied on the substrate (3), the coating (4) produces nucleation with desired microstructure, ensuring that the part has mechanical and/or chemical properties such as high hardness strength, high tensile strength, high corrosion resistance, desired electrical conductivity, high optical permeability. The coating (4) can be applied in the form of a thin film and can be applied up to the desired number of layers according to the optical permeability and electrical conductivity characteristics expected from the substrate (3). Various solutions (S) determined according to the physical and/or chemical properties the solutions (S) in the coating unit (5) are expected to have and by the electric current (E) applied to the solution (S) the solutions (S) are dissociated into their ions, thanks to this, the ions leaving the anode reach the surface, which is to be coated, of the substrate (3) in the cathode (4) and the coating (4) process is carried out accordingly. To the substrat (3) on which a coating process (4) is desired, the coating (4) process is carried out in one step by applying the coating layers (L) consecutively to the substrate (3) in the coating unit (5) by the electroplating method. Upon completion of the coating (4) process, the coating (4) and the substrate (3) are removed from the coating unit (5) by the user and the surface resistance (Rs) of the coating (4) is measured in the surface resistance measurement unit (6) or the surface topography (RMS) of the coating

(4) is measured in the surface topography measurement unit (7) in order to determine whether the coating (4) meets the requirements expected from the part. The coating (4) and the substrate (3) are put into use if they meet the requirements expected from the part, and the substrate (3) and the coating (4) which do not meet the requirements expected from the part are discarded.

In the application of the coating (4) process, in addition to the coating (4) process being carried out faster thanks to the real-time application of surface resistance (Rs) and surface topography (RMS) measurements, coatings (4) that do not need discarding are obtained by obtaining coatings (4) that satisfy the requirements since feedback can be obtained from the coating (4) process during the coating (4) and the necessary parameter changes are made according to this feedback. The processor unit (8) compares the results of measurements made in the surface resistance measurement unit (6) and surface topography measurement units (7) with the user-predefined ideal reference parameter values of the coating (4) process, updates the coating (4) process parameters after each coating layer (L) deposited on the substrate (3) is applied and enables the coating (4) process to be applied in real time and with feedback. After the coating layer (L) is applied in the coating unit (5) and before the surface resistance (Rs) and surface topography (RMS) measurements are made, the substrate (3) and the coating (4) are washed with pure water and measured after drying using a nitrogen gun. After determining the surface area at atomic resolution, the theoretical thickness is calculated depending on the solution

(5) yield (concentration). Depending on the morphological characteristics desired by the previous experimental parameter optimization study, the ideal user-predefined reference parameter magnitudes are applied for current time graphs, process parameters and time- dependent changes. In addition, the thickness is proportional to the surface resistance (Rs). As the thickness increases, the charge carrier concentration and conductivity increase. However, the increased carrier concentration leads to the reflection of the electromagnetic wave. The incident electromagnetic waves are reflected with the plasma frequency value that depends on the carrier concentration. In metals, the plasma frequency in the UV region ensures that the surfaces are reflective. Thanks to this invention, the carrier concentration is reduced by bringing the thickness to the nm range and optical permeability is increased. Thickness measurement is also performed indirectly during the measurement of surface resistance (Rs). With this method, measurement is performed using reference data. For samples with an ideal structure, the thickness of the material can also be calculated following the surface resistance (Rs) measurement. As another alternative, the thickness data of the coating (4) can also be obtained by applying the necessary equations the relations between the surface resistance (Rs) and the thickness for the materials studied (Figure -1, Figure- 2, Figure-3, Figure- 4, Figure- 5).

In an embodiment of the invention, in the electroplating system (1), the coating (4) process comprises a coating (4) applied by coating (4) steps applied by the steps of determining the substrate (3) to which a coating (4) is to be applied (I), measuring the surface resistance (Rs) of the substrate (3) before the coating (4) process (II), measuring the surface topography (RMS) of the substrate (3) before the coating (4) process (III), comparing the measured surface resistance (Rs) and surface topography (RMS) values of the substrate (3) with user-predetermined surface resistance (Rs) and surface topography (RMS) values of the substrate in the processor unit (8) and setting the pulsed current density (A), current application time (Ta) and current off time (Tk) parameters and applying the first coating layer (L) to the substrate (IV), measuring the surface resistance (Rs) and/or surface topography (RMS) of the coating layer (L) (V), if the coating layer (L) thickness is larger than the thickness predetermined by the user, applying the inverse current density (A), current application time (Ta) and current off time (Tk) parameters calculated by the processor unit (8) to the coating layer (L), comparing the measured surface resistance (Rs) and surface topography (RMS) values of the coating layer (L) with the user-predetermined surface resistance (Rs) and surface topography (RMS) values of the coating layer (L) by means of the processor unit (8), updating the pulsed current density (Ta), current application time (Ta) and current off time (Tk) parameter values to be applied to the next coating layer (L) and applying the new parameter values to the next coating layer (L) (VI), applying the pulsed current density (A), application time (Ta) and off time (Tk) parameters determined in real time by the processor unit (8) as many times as required to reach the final surface resistance (Rs) and surface topography (RMS) values predetermined by the user (VII). The substrate (3) surface is activated. The surface resistance (Rs) and surface topography (RMS) of the substrate (3) are measured before the first coating layer (L) is applied. The type of current used in the invention may vary depending on the application of the coating (4) and constant current or pulsed current can be applied depending on the thickness and morphology of the coating (4). The reason why pulsed current is mostly preferred in the electroplating method is that smooth, homogeneous and very fine-grained coating (4) can be obtained. Preferably, pulsed current is applied in the invention. In a recipe where surface activation is carried out with a metal, desired optical permeability and electrical properties are provided by applying a constant current with a certain current density. Inverse current (A) is usually applied if the thicknesses on the surface are higher than the desired amount. In some embodiments and depending on the desired features, an inverse current application is also included in the recipe section for plasmonic applications with certain D and d values, for example, before the surface resistance (Rs) and surface topography (RMS) properties are measured. In step IV of the the electroplating method, a phase is implemented during which high current densities are applied as the so-called flash or strike application. In step IV, depending on the flashing phase low current values are applied for longer periods of time (Figure- 1, Figure -2, Figure- 6, Figure- 7).

In an embodiment of the invention, the electroplating system (1) comprises a body (2) enabling the coating unit (5), the surface resistance measurement unit (6), and the surface topography measurement units (7) to be located thereon, and enabling an efficient coating (4) to be performed with a function of carrying the substrate (3) and/or coating (4) fully automatic between the units. The body (2) enables the coating unit (5), the surface resistance measurement unit (6), and the surface topography measurement units (7) to be located thereon, enabling the substrate (3) and/or coating (4) to be transferred quickly and effectively between the units. Thus, the system can operate fully automatically without the need for any technician or user (Figure -1).

In an embodiment of the invention, the electroplating system (1) comprises a thin film coating (4) applied to the substrate (3) from Au material of 1-100 nm thickness and having the desired electrical conductivity and optical permeability values. Thanks to the invention, a pure gold thin film coating (4) of 1-100 nm thickness can be performed to obtain coatings (4) with desired electrical conductivity and optical permeability values (Figure -3, Figure- 4). In an embodiment of the invention, the electroplating system (1) comprises a processor unit (8) enabling a coating (4) of nm thickness to be obtained, almost entirely approximating the theoretically calculated electrical conductivity and optical permeability values of the substrate (3) and/or coating (4) thanks to calculating the current densities (A) at nm level. In this way, the microstructure, electrical conductivity and optical permeability values obtained in theoretical studies both enable much more targeted values to be obtained in industrial application and minimize the number of substrates (3) and coatings (4) that have to be discarded after the coating (4) process. The current density (A) can be adjusted so that the surface grain size (D (lateral grain size) in the x direction) and the thickness (d (thickness) in the y direction) of the coating (4) can be determined at a precision below nm and their morphological properties can be controlled (Figure- 1, Figure- 2, Figure- 3, Figure- 4, Figure- 5, Figure- 6, Figure- 7).

In an embodiment of the invention, if the coating layer (L) thickness is greater than the user-predetermined coating layer (L), the electroplating system (1) comprises a coating (4) that reaches the user-predetermined coating layer (L) thickness value by applying the parameters inverse current density (A), current application time (Ta) and current off time (Tk) calculated in the processor unit (8) to the coating layer (L). In this way, if more current density (A) is applied than necessary, the target coating layer (L) thickness is obtained by applying an inverse current to the coating layer (L) (Figure- 2).

In an embodiment of the invention, the electroplating system (1) comprises a processor unit (8) enabling a thickness control between 0.1-20 nm to be carried out and coatings (4) between 0.1-100 nm thickness to be almost homogeneously coated in the coating unit (5) thanks to calculating the current densities (A) at nm level. Thus, desired electrical conductivity and optical permeability values can be obtained (Figure -3, Figure- 4).

In an embodiment of the invention, the electroplating system (1) comprises a coating (4) that can be used for purposes such as electromagnetic shielding, ice protection, optical filter, low visibility thanks to having the desired microstructure, surface resistance (Rs) and/or surface topography (RMS) properties (Figure -3, Figure -4, Figure -6, Figure- 7).

In an embodiment of the invention, the electroplating system (1) comprises a coating (4) that can be used in infrared detectors and sensors thanks to obtaining plasma resonance at a user-predetermined wavelength. The use of sinus wave during concurrent application of pulsed and inverse current is included in the recipes of coatings (4) that offer plasmonic properties (Figure-7).

In an embodiment of the invention, the electroplating system (1) comprises a coating (4) that can be used in advanced optical applications such as metamaterial for electromagnetic applications and Fabry Perot cavity systems by allowing it to be applied to patterned structures at nm precision. The invention can be applied on patterns comparable to Atomic Layer Deposition (ALD) suitable for masking technology (1 photon/2photon) at the lowest thicknesses obtained according to the prior art. Metamaterial operating at optical frequencies can be produced using the method (Figure- 3, Figure- 4, Figure- 6, Figure -7).

In an embodiment of the invention, the electroplating system (1) comprises a coating unit (5) that almost completely prevents the formation of dendritic growth in the microstructure of the coating (4) and allows the application of a coating (4) with desired physical and/or chemical properties by providing a homogeneous nucleation as a result of using high current density (A) values between 10-1000 A/m2 and time values between 0.1 ms - 1 s. Thus, the obtained electrical conductivity and optical permeability properties are obtained homogeneously on the entire surface of coatings (4) applied to industrial parts with complex geometry. Similarly, undesired crystal growth modes such as the Wolmer-Weber growth mode are prevented (Figure -3, Figure -4, Figure -5, Figure -6, Figure -7).

In an embodiment of the invention, the electroplating system (1) comprises a coating (4) having desired microstructure, electrical conductivity and optical permeability values as it can be applied under 0.1 nm thickness control and in the form of 1-100 nm thick Au thin film by using high current density (A) values between 10-1000 A/m2. Thus, coatings (4) with optical permeability and electrical conductivity properties of various magnitudes can be obtained according to the optical permeability and electrical conductivity characteristics expected from the part in various applications (Figure -3, Figure -4, Figure -5, Figure -6, Figure -7).

In an embodiment of the invention, the electroplating system (1) comprises a surface resistance measurement unit (6) in which the measurement of surface resistance (Rs) is performed by means of a two-point probe, four-point probe methods or hall measurement device. Van Der Pauw measurement methodology is mostly used by taking full square samples (Figure- 1). In an embodiment of the invention, the electroplating system (1) comprises a surface topography measurement unit (7) in which the measurement of surface topography (RMS) is conducted by Atomic Force Microscope (AFM) or surface profilometer methods. Usually, the surface topography (RMS) is determined using atomic force microscope (AFM). Surface profilometer can also be used for topography measurement (Figure- 1, Figure- 5).

In an embodiment of the invention, the coating system (1) comprises a coating unit (5) visually monitoring the microstructure of the coating layers (L) by TEM or SEM methods and a processor unit (8) that compares the obtained microstructure visuals with the user- predefined microstructure visuals and allows almost complete approximation to the user- predetermined process parameters after each coating (4) process by means of machine learning. In this way, the processor unit (8) compares the coating (4) microstructures visually with the reference values and enables an even more perfect coating (4) to be obtained with each coating (4) performed under the help of machine learning (Figure- 3, Figure- 4).

Claims

1. An electroplating system (1) comprising a body (2), at least one substrate (3) to which various physical and/or chemical processes are applied, a coating (4) enabling to improve the mechanical and/or chemical properties of the substrate (3) by successively depositing at least one coating layer (L) on the substrate (3), at least one coating unit (5) enabling the application of coating (4) using electrical current (E) applied to a solution (S) contained therein, at least one surface resistance measurement unit (6) in which the surface resistance (Rs) of the substrate (3) and/or coating (4) is measured, at least one surface topography measurement unit (7) in which the surface topography (RMS) of the substrate (3) and/or coating layer (L) is measured, characterized by a processor unit (5) which compares the surface resistance (Rs) and surface topography (RMS) measurement data of the substrate (3) and/or coating layer (L) with the coating (4) parameter values predetermined by the user, updates the coating (4) process parameters almost entirely in each coating layer (L) and enables the coating (4) process to be carried out in real time and with feedback.

2. An electroplating system (1) according to Claim 1, characterized by a coating (4) applied using the steps of:

- determining the substrate (3) to which a coating (4) is to be applied (I),

- measuring the surface resistance (Rs) of the substrate (3) before the coating (4) process (II),

- measuring the surface topography (RMS) of the substrate (3) before the coating (4) process (III),

- comparing the measured surface resistance (Rs) and surface topography (RMS) values of the substrate (3) with the user-predetermined surface resistance (Rs) and surface topography (RMS) values of the substrate in the processor unit (8) and setting the pulsed current density (A), current application time (Ta) and current off time (Tk) parameters and applying the first coating layer (L) to the substrate (3) (IV),

- measuring the surface resistance (Rs) and/or surface topography (RMS) of the coating layer (L) (V),

- if the coating layer (L) thickness is larger than the thickness predetermined by the user, applying the inverse current density (A), current application time (Ta) and current off time (Tk) parameters calculated by the processor unit (8) to the coating layer (L), comparing the measured surface resistance (Rs) and surface topography (RMS) values of the coating layer (L) with the user-predetermined surface resistance (Rs) and surface topography (RMS) values of the coating layer (L) in the processor unit (8), thereby updating the pulsed current density (Ta), current application time (Ta) and current off time (Tk) parameter values to be applied to the next coating layer (L) and applying the new parameter values to the next coating layer (L) (VI),

- applying the pulsed current density (A), application time (Ta) and off time (Tk) parameters determined in real time by the processor unit (8) as many times as required to reach the final surface resistance (Rs) and surface topography (RMS) values predetermined by the user (VII).

3. An electroplating system (1) according to any of the above claims, characterized by body (2) providing the coating unit (5), the surface resistance measurement unit (6), and the surface topography measurement units (7) to be located on itself, and enabling an efficient coating (4) to be applied by a function of fully automatically carrying the substrate (3) and/or coating (4) between the units.

4. An electroplating system (1) according to any of the above claims, characterized by a thin film coating (4) applied to the substrate (3) from Au material in 1-100 nm thickness and having the desired electrical conductivity and optical permeability values.

5. An electroplating system (1) according to any of the above claims, characterized by a processor unit (8) enabling a coating (4) of nm thickness to be obtained that almost entirely approximates the theoretically calculated electrical conductivity and optical permeability values of the substrate (3) and/or coating (4) thanks to calculating the current densities (A) at nm level.

6. An electroplating system (1) according to claim 1, characterized by a coating (4) that reaches the user-predetermined coating layer (L) thickness value by applying the inverse current density (A), current application time (Ta) and current off time (Tk) parameters calculated in the processor unit (8) to the coating layer (L) if the coating layer (L) thickness is larger than the user-predetermined coating layer (L) thickness.

7. An electroplating system (1) according to any of the above claims, characterized by a processor unit (8) enabling a thickness control between 0.1-20 nm to be made and coatings (4) between 0.1-100 nm thickness to be almost homogeneously coated in the coating unit (5) thanks to calculating the current densities (A) at nm level.

8. An electroplating system (1) according to any of the above claims, characterized by a coating (4) that can be used for purposes such as electromagnetic shielding, ice protection, optical filter, low visibility thanks to having the desired microstructure, surface resistance (Rs) and/or surface topography (RMS) properties.

9. An electroplating system (1) according to any of the above claims, characterized by a coating (4) that can be used in infrared detectors and sensors thanks to obtaining plasma resonance at a user-predetermined wavelength.

10. An electroplating system (1) according to any of the above claims, characterized by a coating (4) that can be used in advanced optical applications such as metamaterial for electromagnetic applications and Fabry Perot cavity systems based on the fact that it can be applied to patterned structures at nm precision.

11. An electroplating system (1) according to any of the above claims, characterized by a coating unit (5) that almost completely prevents the formation of dendritic growth in the microstructure of the coating (4) and enables the application of a coating (4) with desired physical and/or chemical properties by providing a homogeneous nucleation by using high current density (A) values between 10-1000 A/m2 and time values between 0.1 ms - 1 s.

12. An electroplating system (1) according to any of the above claims, characterized by a coating (4) having desired microstructure, electrical conductivity and optical permeability values by applying it under 0.1 nm thickness control and in the form of 1- 100 nm thick Au thin film using high current density (A) values between 10-1000 A/m2.

13. An electroplating system (1) according to any of the above claims, characterized by a surface resistance measurement unit (6) in which the measurement of surface resistance (Rs) is conducted by means of two-point probe, four-point probe methods or hall measurement device.

14. An electroplating system (1) according to any of the above claims, characterized by a surface topography measurement unit (7) in which the measurement of surface topography (RMS) is conducted by atomic force microscope (AFM) or surface profilometer methods.

15. An electroplating system (1) according to any of the above claims, characterized by a coating unit (5) visually monitoring the microstructure of coating layers (L) by TEM or SEM methods, and a processor unit (8) comparing the obtained microstructure images with user-predefined microstructure images and enabling an almost complete approximation to be made to the user-predetermined process parameters after each coating (4) process by means of machine learning.