WO2022008210A1 - Electronics unit for an electrical device - Google Patents

Electronics unit for an electrical device Download PDF

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Publication number
WO2022008210A1
WO2022008210A1 PCT/EP2021/066731 EP2021066731W WO2022008210A1 WO 2022008210 A1 WO2022008210 A1 WO 2022008210A1 EP 2021066731 W EP2021066731 W EP 2021066731W WO 2022008210 A1 WO2022008210 A1 WO 2022008210A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
interference suppression
connection
plug
Prior art date
Application number
PCT/EP2021/066731
Other languages
German (de)
French (fr)
Inventor
Steffen Krueger
Soenke SCHUCH
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2022008210A1 publication Critical patent/WO2022008210A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
    • H01R13/7193—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with ferrite filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
    • H01R13/7197—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with filters integral with or fitted onto contacts, e.g. tubular filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Definitions

  • the invention relates to an electronic unit for an electrical device according to the generic type of independent claim 1.
  • the invention also relates to an electrical device with an electronic unit according to the invention.
  • radio interference standards e.g. CISPR 14
  • the corresponding cable is wound around the ferrite one or more times. It is also known to provide such ferrites in connectors of cable connections.
  • DE 102009 001 079 A1 relates to a connector body for an electrical connector, particularly for the motor vehicle sector, with a plug-in body in which an electrical contact device can be accommodated and which is used to connect to a mating connector body.
  • a connector body is provided with at least one arm, on which an EMC protection can be accommodated and at least partially held in the connection area.
  • DE 102016212029 A1 discloses an EMC adapter for a vehicle electrical system, in particular for a high-voltage vehicle electrical system, which includes a plug connection between a cable-side interface unit to a cable of the vehicle electrical system and a component-side interface unit to a component of the vehicle electrical system .
  • the EMC adapter includes a first contacting area to form an electrically conductive plug-in connection with the component-side interface unit and a second contacting area to form an electrically conductive plug-in connection with the cable-side interface unit.
  • the EMC adapter includes an EMC filter arranged between the first and the second contacting area.
  • the object of the invention based on the known prior art, is to provide an electronic unit for an electrical device with at least two printed circuit boards, which has a particularly compact interference suppression device that is resistant to mechanical stresses for reducing or suppressing electromechanical interference and which can also be installed very easily and quickly is animalable.
  • the invention relates to an electronics unit for an electrical device, in particular for a motor-driven electrical device, with a first printed circuit board and with at least one second printed circuit board arranged at a distance from the first printed circuit board, in particular designed as a piggyback printed circuit board, with the first and the at least one second printed circuit board each have at least one electronic construction element and can be electrically connected by means of a plurality of rigid contact pins.
  • the contact pins are surrounded by an interference suppression means to reduce electromagnetic interference in a positive, material and/or non-positive manner. This results in a particularly advantageous way in which the interference is effectively suppressed directly at the point at which it arises, in conjunction with increased compactness and simplified assembly of the electronic components.
  • Electrical devices in the context of the invention should be understood to mean all electrically operated devices in which at least two printed circuit boards arranged electrically at a distance from one another can be used as the electronic unit according to the invention and whose rigid electrical connection between the printed circuit boards requires at least one interference suppression measure against electromagnetic interference.
  • the invention can be applied to power tools for machining workpieces using an electrically driven insert tool, such as hand or stand drills, screwdrivers, impact drills, hammer drills, planes, angle grinders, orbital sanders, polishing machines, circular, table, crosscut and jigsaws or the like, are applied.
  • an application of the invention is also conceivable in measuring devices, household appliances, gardening equipment, vehicles and airplanes, etc.
  • printed circuit board can include both a solid and a flexible circuit board with printed or etched conductor tracks, the circuit board being designed in such a way that it has one or more passive or active electronic components in the form of resistors, capacitors, coils, diodes, Transistors ren, integrated circuits, etc. carries.
  • passive or active electronic components in the form of resistors, capacitors, coils, diodes, Transistors ren, integrated circuits, etc. carries.
  • the possible configurations of the printed circuit boards of this type will not be discussed in detail here, since they are well known to those skilled in the art.
  • a piggyback printed circuit board is to be understood in particular as a printed circuit board or circuit board which, without further fastening measures on any housing parts, can be separated from a base circuit board or circuit board arranged underneath, for example by means of connectors or other form-fitting and/or non-positive fastening means such as Rastha ken, screw connections, etc. is held.
  • a material connection is to be understood, for example, as an adhesive, soldered or welded connection, while a positive connection blocks the relative movement of two components by means of appropriate design details, for example snap connections, tongue and groove connections, bayonet locks, rivets, etc., and a frictional connection is created by high static friction between two components.
  • the contact pins are part of a soldered or plug-in connection and that the interference suppression device encloses the soldered or plug-in connection at least radially. This allows a particularly compact design in connection with a very simple assembly of the circuit boards, in particular the piggyback circuit board on the base circuit board, he aims.
  • Such an embodiment of the interference suppression means is particularly suitable for damping what is known as “common mode” interference.
  • the interference suppression means can also completely enclose the soldered or plug-in connection to suppress or reduce so-called “differential mode” interference.
  • the compactness and the interference suppression effect can be increased if the interference suppression means is integrated into the soldered or plug-in connection. In particular, this results in the manufacturing advantage that no additional components have to be fitted.
  • at least one of the contact pins has at least one winding which is embedded in a lateral surface of the interference suppression means. The at least one winding of the contact pin around at least a part of the interference suppression means makes it possible to achieve a quadratically increased damping effect, which increases exponentially in the case of several windings.
  • the wire-to-board plug-in connection has proven to be particularly advantageous for a cost-effective and robust plug-in connection. In this way, the propagation of interference to peripherally connected circuit boards or circuit boards and components can also be avoided or reduced.
  • the interference suppression means preferably consists of a ferrite material and extends in its length, width and height over a range of 5 to 20 mm, preferably with a length of 10 to 20 mm, a width of 5 to 10 mm and a height of 5 up to 20 mm.
  • the first printed circuit board has power electronics and the second printed circuit board has control or regulating electronics, such as is typical for driving electric motors, in particular brushless DC motors.
  • FIG. 1 a circuit diagram of a first printed circuit board designed as a power board with an interference suppression device according to the invention in a first embodiment
  • FIG. 2 shows a schematic representation of the electronic unit according to the invention with a first circuit board designed as a power circuit board and a second circuit board designed as a control circuit board in a second embodiment
  • FIG. 4 shows a schematic representation of the first printed circuit board designed as a power board according to FIG. 3 with an interference suppression device according to the invention
  • FIGS. 1 to 4 a schematic representation of the encapsulated electronic unit according to the invention for the exemplary embodiments according to FIGS. 1 to 4
  • Fig. 7 a schematic representation of the interference suppression means according to the invention according to the first embodiment
  • Fig. 8 a schematic representation of the interference suppression means according to the invention in two further exemplary embodiments according to FIGS. 8a and 8b.
  • FIG. 1 shows a circuit diagram of an electronics unit 10 for an electrical device that is not shown in any more detail.
  • the electrical device can be used, for example, as an electric tool for processing workpieces using an electrically driven tool, such as hand or standing drills, screwdrivers, impact drills, hammer drills, planes, angle grinders, orbital sanders, polishing machines, circular, table, crosscut and jigsaws or the like, be trained.
  • an electrically driven tool such as hand or standing drills, screwdrivers, impact drills, hammer drills, planes, angle grinders, orbital sanders, polishing machines, circular, table, crosscut and jigsaws or the like.
  • measuring devices, household appliances, gardening tools, vehicles and airplanes, etc. are conceivable for an application of the electronic unit 10 according to the invention.
  • Electronics unit 10 has a first printed circuit board 12 and at least one second printed circuit board 14 (cf. Figure 2) arranged at a distance from first printed circuit board 12, at least one electronic component 16 being arranged on each of the first and the at least one second printed circuit board 12, 14.
  • resistors 18, MOSFETs 20 or other passive and active electronic components such as diodes, coils, capacitors, bipolar transistors, IGBTs, etc. can be considered as electronic components 16.
  • the electronic components 16 can also be realized by integrated circuits, such as microprocessors, ASICs, DSPs, memory modules, etc.
  • the printed circuit boards 12 and 14 can be electrically connected to one another by means of a plurality of rigid contact pins 22 of a soldered or plug-in connection 24 (cf. also FIG. 3).
  • the first circuit board 12 is designed as a power circuit board for controlling an electric motor (not shown), in particular a brushless DC motor, by means of a power bridge or power electronics 25 consisting of power transistors 20, which are connected to a high-side potential V + and a low -Side potential V- is supplied.
  • the two power transistors 20 configured as MOSFETs can be connected via electrical contacts 26, in particular a high-site gate connection 28 and a low-site gate connection 30, to generate a pulse-width-modulated control signal at the output connected to a winding, not shown, of the brushless direct-current motor 32 can be controlled.
  • a second printed circuit board 14 is used for this purpose, which sits piggyback on the first printed circuit board 12 and which is designed as a control board for controlling the power bridge 24 . Since the person skilled in the art is sufficiently familiar with corresponding regulation or control methods, they will not be discussed in any more detail. Rather, it is essential for the invention that the high clock rates of the control and power circuits can lead to high-frequency interference, which must be suppressed as effectively as possible.
  • the contact pins 22 of the soldering or plug-in connection 24 are therefore, according to the invention, surrounded by an interlocking, material and/or non-positive fit by an interference suppression device 34, in particular a ferrite, to reduce or dampen such electromagnetic interference.
  • FIG. 1 also indicates that at least one turn W of the contact pins 22 is embedded in at least part of the interference suppression means 34, with an outer part of the interference suppression means 34 enclosing the soldered or plug-in connection 24 at least radially. This will be discussed in more detail in FIG.
  • FIG. 2 shows a schematic representation of the electronic unit 10 according to the invention with a first circuit board 12 designed as a power circuit board and with a second circuit board 14 designed as a control circuit board in a second embodiment.
  • the second printed circuit board 14 is piggybacked on the first printed circuit board 12, ie the second printed circuit board 14 is without further fastening measures to any housing parts of the electrical appliance only on the first printed circuit board 12 arranged underneath by means of the contact pins 22 of the soldering or plug-in connection 24 or by means of other form-fitting and/or non-positive fastening means such as locking hooks, screw connections, etc. are fixed.
  • second circuit board 14 On the designed as a control board second circuit board 14 is a variety of electronic SMD components (SMD: Surface Mounted Device) 16 in the form of microprocessors 36 or other integrated circuits 38, Kon capacitors, resistors, fuses, etc., to just a few components as an example to name, for controlling or regulating the power electronics 25 on the positioned underneath, designed as a power board first Lei terplatte 12. Furthermore, on the second circuit board 14 plug connections 44 for data and control lines from or to sensors, buttons or other electronic assemblies of the electrical device intended.
  • SMD Surface Mounted Device
  • the first printed circuit board 12 also has corresponding components 16, for example in the form of capacitors 40 and power transistors 20.
  • the first printed circuit board 12 contains various soldered connections 24 consisting of contact pins 22 for making electrical contact with the second printed circuit board 14 (cf., inter alia, the electrical contacts 26 according to FIG. 1).
  • the second printed circuit board 14 is also held piggyback on the first printed circuit board 12 by means of the soldered connections 24 .
  • FIG. 4 shows a schematic representation of the first printed circuit board 12 according to FIG. 3, designed as a power board, with the interference suppression means 34 according to the invention.
  • the interference suppression means 34 can be pushed over the contact pins 22 in a non-positive manner, for example.
  • a form-fitting connection is also conceivable, in which the interference suppression means 34 is held on the first printed circuit board 12 via latching elements.
  • the latching elements of the interference suppression means 34 can be designed, for example, as latching hooks which engage in corresponding openings in the first printed circuit boards 12 . It is also conceivable that the first printed circuit board 12 has latching lugs that form the interference suppression means 34 grasp conclusively.
  • the interference suppression means 34 consists of a ferrite material.
  • other means and materials suitable for damping electromagnetic interference are also conceivable, such as ferromagnetic or soft-magnetic particles cast in plastic, feedthrough capacitors or the like.
  • the interference suppression means 34 and/or the soldered or plug-in connection 24 with their contact pins 22 particularly preferably extend over a range of approximately 5 to 20 mm in terms of their length, width and height.
  • the length L of the interference suppression means is approximately 15 mm, for example, while its width B is approximately 8 and its height H is approximately 10 mm.
  • the interference suppression means has an oval, hollow-cylindrical cross-section with a thickness of its lateral surface 44 of approximately 3 mm.
  • the dimensions and the shape of the interference suppression means 34 are largely dependent on the dimensions and the structure of the soldered or plug-in connection 24 .
  • the cross-section of the interference suppression means 34 is essentially cuboid or circular-cylindrical. Any other polygonal shapes are also conceivable.
  • the interference suppression means 34 has a length L of 10 to 20 mm, a width B of 5 to 10 mm and a height H of 5 to 20 mm.
  • the thickness of the lateral surface 44 can also vary between 2 and 5 mm.
  • FIG. 5 shows a schematic representation of the second circuit board 14 designed as a control circuit board in a third exemplary embodiment, with the interference suppression means 34 now being a soldered or plug-in connection 24 designed as a wire-to-board plug-in connection 46 radially in terms of shape, material and/or or positively closes.
  • the propagation of interference to peripherally connected circuit boards and components can also be reduced or avoided if the interference suppression medium 34 is integrated into the wire-to-board connector 46 . Integration into the plug-in connection 46 results in the advantage in terms of manufacturing technology that no additional components have to be fitted.
  • FIG. 6 shows a schematic representation of the electronic unit 10 according to the invention cast in a casting compound for the exemplary embodiments according to FIGS. 1 to 4.
  • FIG. 7 shows the interference suppression device 34 according to the invention according to FIG. 1 in a detailed, schematic view.
  • the contact pins 22 of the solder or plug-in connection 24 each have a winding W, which is embedded in the surface 44 of the interference suppression device 34, while an outer part of the Ent interfering means 34 encloses the solder or plug-in connection 24 at least radially.
  • the interference suppression means 34 is advantageously injected around the contact pins 22. Due to the winding W of the contact pins 22 embedded in the interference suppression means 34, a quadratically increased interference attenuation can be achieved. It is also conceivable to increase the number of turns W for the expo-potential damping of the disturbance.
  • Figure 8 shows the interference suppression means 34 according to the invention in two further exemplary embodiments, with the interference suppression means 34 in Figure 8a being designed as a ferrite block 46 of length L, width B and height H, which radially encloses each individual contact pin 22 of the soldered or plug-in connection 24, while FIG. 8b shows the combination of a ferrite block 46 according to FIG. 8a and an interference suppression means 34 according to FIG.
  • the ferrite block 46 can be designed in such a way that it can be pushed over the contact pins 22 in a non-positive manner.
  • a non-releasable form-fitting encapsulation of the contact pins 22 with the interference suppression means 34 is conceivable.
  • the anti-interference means 34 which is designed as an oval, hollow-cylindrical body, can also be attached to the ferrite block 46 with corresponding latching means.
  • the exemplary embodiment according to FIG. 8a particularly advantageously allows the damping or suppression of so-called “differential mode” interference
  • both “common mode” and “differential mode” interference can be damped or suppressed.
  • the exemplary embodiments according to FIGS. 1 to 5 are therefore more suitable for suppressing or damping pure “common mode” interference.
  • the terms “common mode” and “differential mode” are well known to those skilled in the art, so that they will not be discussed in detail. It should only be pointed out that the term “common mode” means rectified interference in the individual contact pins 22, while in “differential mode” they run in the opposite direction.

Abstract

The invention relates to an electronics unit (10) for an electrical device, in particular for a motor-operated electrical device, comprising a first printed circuit board (12) and comprising at least one second printed circuit board (14) arranged at a distance from the first printed circuit board (12) and formed, in particular, as a piggyback printed circuit board, wherein the first and the at least one second printed circuit board (12, 14) each have at least one electronic component (16) and can be electrically connected by means of a plurality of rigid contact pins (22). It is proposed that the contact pins (22) are surrounded in an interlocking, materially bonded and/or force-fitting manner by an interference suppression means (34) for reducing electromagnetic interference. The invention further relates to an electrical device comprising an electronics unit (10) according to the invention.

Description

Beschreibung description
Titel title
Elektronikeinheit für ein Elektrogerät Electronic unit for an electrical device
Beschreibung description
Die Erfindung betrifft eine Elektronikeinheit für ein Elektrogerät nach der Gattung des unabhängigen Anspruchs 1. Darüber hinaus betrifft die Erfindung ein Elekt rogerät mit einer erfindungsgemäßen Elektronikeinheit. The invention relates to an electronic unit for an electrical device according to the generic type of independent claim 1. The invention also relates to an electrical device with an electronic unit according to the invention.
Stand der Technik State of the art
Zur Einhaltung der Grenzwerte für die elektromagnetische Verträglichkeit (EMV) müssen Elektrogeräte weltweit gültige Funkstörnormen (z.B. CISPR 14) einhal- ten. Dies bedingt eine Reduzierung elektromagnetischer Felder durch geeignete Entstörsysteme. So ist es beispielsweise bekannt, Energieversorgungs- und/oder Datenleitungen, die Störfrequenzen ausstrahlen oder empfangen können, mit Einloch- oder Mehrloch- Ferriten auszustatten. Zur Erhöhung der Wirksamkeit wird dabei die entsprechende Leitung ein- oder mehrfach um den Ferrit gewi ckelt. Auch ist es bekannt, derartige Ferrite in Steckverbindern von Kabelverbin dungen vorzusehen. In order to comply with the limit values for electromagnetic compatibility (EMC), electrical devices must comply with radio interference standards (e.g. CISPR 14) that apply worldwide. This requires a reduction in electromagnetic fields through suitable interference suppression systems. For example, it is known to equip power supply and/or data lines that can emit or receive interference frequencies with single-hole or multi-hole ferrites. To increase the effectiveness, the corresponding cable is wound around the ferrite one or more times. It is also known to provide such ferrites in connectors of cable connections.
Die DE 102009 001 079 A1 betrifft einen Steckverbinderkörper für einen elektri schen Steckverbinder, insbesondere für den Kraftfahrzeugbereich, mit einem Steckkörper, in welchem eine elektrische Kontakteinrichtung aufnehmbar ist und welcher einem Verbinden mit einem Gegensteckkörper dient. Es ist ein Verbin derkörper mit wenigstens einem Arm vorgesehen, an welchem ein EMV-Schutz aufnehmbar und wenigstens teilweise im Verbindungsbereich halterbar ist. In der DE 102016212029 A1 ist ein EMV-Adapter für ein Bordnetz, insbesondere für ein Hochvolt-Bordnetz, eines Fahrzeugs offenbart, das eine Steckverbindung zwischen einer kabelseitigen Schnittsteilen-Einheit zu einem Kabel des Bordnet zes und einer komponentenseitigen Schnittstelleneinheit zu einer Komponente des Bordnetzes umfasst. Der EMV-Adapter umfasst einen ersten Kontaktierungs- Bereich zur Bildung einer elektrisch leitenden Steckverbindung mit der kompo nentenseitigen Schnittstelleneinheit und einen zweiten Kontaktierungsbereich zur Bildung einer elektrisch leitenden Steckverbindung mit der kabelseitigen Schnitt stelleneinheit. Außerdem umfasst der EMV-Adapter einen zwischen dem ersten und dem zweiten Kontaktierungsbereich angeordneten EMV-Filter. DE 102009 001 079 A1 relates to a connector body for an electrical connector, particularly for the motor vehicle sector, with a plug-in body in which an electrical contact device can be accommodated and which is used to connect to a mating connector body. A connector body is provided with at least one arm, on which an EMC protection can be accommodated and at least partially held in the connection area. DE 102016212029 A1 discloses an EMC adapter for a vehicle electrical system, in particular for a high-voltage vehicle electrical system, which includes a plug connection between a cable-side interface unit to a cable of the vehicle electrical system and a component-side interface unit to a component of the vehicle electrical system . The EMC adapter includes a first contacting area to form an electrically conductive plug-in connection with the component-side interface unit and a second contacting area to form an electrically conductive plug-in connection with the cable-side interface unit. In addition, the EMC adapter includes an EMC filter arranged between the first and the second contacting area.
Es ist Aufgabe der Erfindung, ausgehend vom bekannten Stand der Technik eine Elektronikeinheit für ein Elektrogerät mit zumindest zwei Leiterplatten bereitzu stellen, die ein besonders kompaktes und gegen mechanische Beanspruchungen widerstandsfähiges Entstörmittel zur Reduzierung oder Unterdrückung elektro mechanischer Störungen aufweist und die zudem sehr einfach und schnell mon tierbar ist. The object of the invention, based on the known prior art, is to provide an electronic unit for an electrical device with at least two printed circuit boards, which has a particularly compact interference suppression device that is resistant to mechanical stresses for reducing or suppressing electromechanical interference and which can also be installed very easily and quickly is animalable.
Vorteile der Erfindung Advantages of the Invention
Die Erfindung betrifft eine Elektronikeinheit für ein Elektrogerät, insbesondere für ein motorbetriebenes Elektrogerät, mit einer ersten Leiterplatte und mit zumin dest einer zur ersten Leiterplatte beabstandet angeordneten, insbesondere als Huckepack-Leiterplatte ausgebildeten, zweiten Leiterplatte, wobei die erste und die zumindest eine zweite Leiterplatte jeweils zumindest ein elektronisches Bau element aufweisen und mittels einer Mehrzahl starrer Kontaktstifte elektrisch ver bindbar sind. Erfindungsgemäß ist vorgesehen, dass die Kontaktstifte form-, stoff- und/oder kraftschlüssig von einem Entstörmittel zur Reduzierung elektro magnetischer Störungen umgeben sind. Hierdurch ergibt sich in besonders vor teilhafter Weise eine wirksame Unterdrückung der Störungen direkt an deren Entstehungspunkt in Verbindung mit einer erhöhten Kompaktheit und einer ver einfachten Montage der Elektronikkomponenten. Darüber hinaus wird weniger Material zur Entstörung benötigt, was sich positiv auf Ressourcen und Umwelt auswirkt. Als Elektrogeräte im Kontext der Erfindung sollen alle elektrisch betriebenen Ge räte verstanden werden, bei denen zumindest zwei elektrisch beabstandet zuei nander angeordnete Leiterplatten als erfindungsgemäße Elektronikeinheit zum Einsatz kommen können und deren starre, elektrische Verbindung zwischen den Leiterplatten zumindest einer Entstörmaßnahme gegen elektromagnetische Stö rungen bedarf. So kann die Erfindung beispielweise auf Elektrowerkzeuge zur Bearbeitung von Werkstücken mittels eines elektrisch angetriebenen Einsatz werkzeugs, wie Hand- oder Standbohrmaschinen, Schrauber, Schlagbohrma schinen, Bohrhämmer, Hobel, Winkelschleifer, Schwingschleifer, Poliermaschi nen, Kreis-, Tisch-, Kapp- und Stichsägen oder dergleichen, angewendet werden. Aber auch in Messgeräten, Haushaltgeräten, Gartengeräten, Fahr- und Flugzeu gen, etc. ist eine Anwendung der Erfindung denkbar. The invention relates to an electronics unit for an electrical device, in particular for a motor-driven electrical device, with a first printed circuit board and with at least one second printed circuit board arranged at a distance from the first printed circuit board, in particular designed as a piggyback printed circuit board, with the first and the at least one second printed circuit board each have at least one electronic construction element and can be electrically connected by means of a plurality of rigid contact pins. According to the invention it is provided that the contact pins are surrounded by an interference suppression means to reduce electromagnetic interference in a positive, material and/or non-positive manner. This results in a particularly advantageous way in which the interference is effectively suppressed directly at the point at which it arises, in conjunction with increased compactness and simplified assembly of the electronic components. In addition, less material is required for interference suppression, which has a positive effect on resources and the environment. Electrical devices in the context of the invention should be understood to mean all electrically operated devices in which at least two printed circuit boards arranged electrically at a distance from one another can be used as the electronic unit according to the invention and whose rigid electrical connection between the printed circuit boards requires at least one interference suppression measure against electromagnetic interference. For example, the invention can be applied to power tools for machining workpieces using an electrically driven insert tool, such as hand or stand drills, screwdrivers, impact drills, hammer drills, planes, angle grinders, orbital sanders, polishing machines, circular, table, crosscut and jigsaws or the like, are applied. However, an application of the invention is also conceivable in measuring devices, household appliances, gardening equipment, vehicles and airplanes, etc.
Der Begriff Leiterplatte kann sowohl eine feste als auch eine flexible Platine mit bedruckten bzw. geätzten Leiterbahnen umfassen, wobei die Platine derart aus gestaltet ist, dass sie ein oder mehrere passive oder aktive elektronische Bau elemente in Form von Widerständen, Kondensatoren, Spulen, Dioden, Transisto ren, integrierten Schaltkreise etc. trägt. Auf die Ausgestaltungsmöglichkeiten der artigen Leiterplatten soll hier nicht näher eingegangen werden, da sie dem Fachmann hinlänglich bekannt sind. Unter einer Huckepack-Leiterplatte soll ins besondere eine Leiterplatte bzw. Platine verstanden werden, die ohne weitere Befestigungsmaßnahmen an etwaigen Gehäuseteilen von einer darunter ange ordneten Basis-Leiterplatte bzw. -Platine beispielsweise durch Steckverbinder oder andere form- und/oder kraftschlüssige Befestigungsmittel wie z.B. Rastha ken, Schraubverbindungen etc. gehalten wird. The term printed circuit board can include both a solid and a flexible circuit board with printed or etched conductor tracks, the circuit board being designed in such a way that it has one or more passive or active electronic components in the form of resistors, capacitors, coils, diodes, Transistors ren, integrated circuits, etc. carries. The possible configurations of the printed circuit boards of this type will not be discussed in detail here, since they are well known to those skilled in the art. A piggyback printed circuit board is to be understood in particular as a printed circuit board or circuit board which, without further fastening measures on any housing parts, can be separated from a base circuit board or circuit board arranged underneath, for example by means of connectors or other form-fitting and/or non-positive fastening means such as Rastha ken, screw connections, etc. is held.
Unter einer stoffschlüssigen Verbindung soll beispielsweise eine Klebe-, Löt- o- der Schweißverbindung verstanden werden, während ein Formschluss das Ver sperren der relativen Bewegung zweier Bauteile durch entsprechende konstrukti ve Details, beispielsweise Schnappverbindungen, Nut-Feder-Verbindungen, Ba jonettverschlüsse, Niete, etc., beschreibt und ein Kraftschluss durch eine hohe Haftreibung zweier Bauteile zueinander entsteht. ln einer Weiterbildung der Erfindung ist vorgesehen, dass die Kontaktstifte Teil einer Löt- oder Steckverbindung sind und dass das Entstörmittel die Löt- oder Steckverbindung zumindest radial umschließt. Hierdurch kann eine besonders kompakte Bauform in Verbindung mit einer sehr einfachen Montage der Leiter platten, insbesondere der Huckepack-Leiterplatte auf die Basis-Leiterplatte, er zielt werden. Eine derartige Ausgestaltung des Entstörmittels eignet sich beson ders zur Dämpfung so genannter „Common Mode“- Störungen. A material connection is to be understood, for example, as an adhesive, soldered or welded connection, while a positive connection blocks the relative movement of two components by means of appropriate design details, for example snap connections, tongue and groove connections, bayonet locks, rivets, etc., and a frictional connection is created by high static friction between two components. In a further development of the invention, it is provided that the contact pins are part of a soldered or plug-in connection and that the interference suppression device encloses the soldered or plug-in connection at least radially. This allows a particularly compact design in connection with a very simple assembly of the circuit boards, in particular the piggyback circuit board on the base circuit board, he aims. Such an embodiment of the interference suppression means is particularly suitable for damping what is known as “common mode” interference.
Alternativ oder ergänzend kann das Entstörmittel die Löt- oder Steckverbindung zur Unterdrückung bzw. Reduzierung so genannter „Differential Mode“- Störungen auch vollständig umschließen. Alternatively or additionally, the interference suppression means can also completely enclose the soldered or plug-in connection to suppress or reduce so-called “differential mode” interference.
Weiterhin lässt sich die Kompaktheit und die Entstörwirkung erhöhen, wenn das Entstörmittel in die Löt- oder Steckverbindung integriert ist. Insbesondere ergibt sich hierdurch der fertigungstechnische Vorteil, dass keine zusätzlichen Bauteile bestückt werden müssen. Ergänzend kann vorgesehen sein, dass zumindest ei ner der Kontaktstifte mindestens eine Windung aufweist, die in einer Mantelfläche des Entstörmittels eingebettet ist. Durch die mindestens eine Windung des Kon taktstifts um zumindest einen Teil des Entstörmittels ist eine quadratisch, bei mehreren Windungen exponentiell, gesteigerte Dämpfungswirkung erzielbar. Furthermore, the compactness and the interference suppression effect can be increased if the interference suppression means is integrated into the soldered or plug-in connection. In particular, this results in the manufacturing advantage that no additional components have to be fitted. In addition, it can be provided that at least one of the contact pins has at least one winding which is embedded in a lateral surface of the interference suppression means. The at least one winding of the contact pin around at least a part of the interference suppression means makes it possible to achieve a quadratically increased damping effect, which increases exponentially in the case of several windings.
Als besonders vorteilhaft für eine kostengünstige und robuste Steckverbindung hat sich die Wire-to-Board-Steckverbindung erwiesen. Damit kann zudem eine Ausbreitung von Störungen auf peripher angeschlossene Leiterplatten bzw. Pla tinen und Bauteile vermieden bzw. reduziert werden. The wire-to-board plug-in connection has proven to be particularly advantageous for a cost-effective and robust plug-in connection. In this way, the propagation of interference to peripherally connected circuit boards or circuit boards and components can also be avoided or reduced.
Bevorzugt besteht das Entstörmittel aus einem Ferritmaterial und erstreckt sich in seinen Längen-, Breiten- und Höhenmaßen über einen Bereich von 5 bis 20 mm, vorzugsweise mit einer Länge von 10 bis 20 mm, einer Breite von 5 bis 10 mm und einer Höhe von 5 bis 20 mm. Dabei weist die erste Leiterplatte eine Leis tungselektronik und die zweite Leiterplatte eine Steuer- oder Regelelektronik auf, wie sie z.B. typisch ist zur Ansteuerung von Elektromotoren, insbesondere von bürstenlosen Gleichstrommotoren. Ausführungsbeispiele The interference suppression means preferably consists of a ferrite material and extends in its length, width and height over a range of 5 to 20 mm, preferably with a length of 10 to 20 mm, a width of 5 to 10 mm and a height of 5 up to 20 mm. In this case, the first printed circuit board has power electronics and the second printed circuit board has control or regulating electronics, such as is typical for driving electric motors, in particular brushless DC motors. exemplary embodiments
Zeichnung drawing
Die Erfindung wird im Folgenden anhand der Figuren 1 bis 6 beispielhaft erläu tert, wobei gleiche Bezugszeichen in den Figuren auf gleiche Bestandteile mit ei ner gleichen Funktionsweise hindeuten. The invention is explained below by way of example with reference to FIGS. 1 to 6, with the same reference numbers in the figures indicating the same components with the same function.
Es zeigen: Fig. 1: ein Schaltplan einer als Leistungsplatine ausgebildeten ersten Leiterplatte mit einem erfindungsgemäßen Entstörmittel in einer ersten Ausführungsform, They show: FIG. 1: a circuit diagram of a first printed circuit board designed as a power board with an interference suppression device according to the invention in a first embodiment,
Fig. 2: eine schematische Darstellung der erfindungsgemäßen Elektro nikeinheit mit einer ersten als Leistungsplatine und einer zweiten als Steuerplatine ausgebildeten Leiterplatte in einer zweiten Aus führungsform, 2 shows a schematic representation of the electronic unit according to the invention with a first circuit board designed as a power circuit board and a second circuit board designed as a control circuit board in a second embodiment,
Fig. 3: eine schematische Darstellung der ersten als Leistungsplatine ausgebildeten Leiterplatte gemäß Figur 2 ohne erfindungsgemä ßes Entstörmittel, 3: a schematic representation of the first printed circuit board designed as a power board according to FIG. 2 without interference suppression means according to the invention,
Fig. 4: eine schematische Darstellung der ersten als Leistungsplatine ausgebildeten Leiterplatte gemäß Figur 3 mit einem erfindungs gemäßem Entstörmittel, 4 shows a schematic representation of the first printed circuit board designed as a power board according to FIG. 3 with an interference suppression device according to the invention,
Fig. 5: eine schematische Darstellung der zweiten als Steuerplatine ausgebildeten Leiterplatte mit erfindungsgemäßem Entstörmittel in einem dritten Ausführungsbeispiel, 5: a schematic representation of the second printed circuit board designed as a control board with interference suppression means according to the invention in a third exemplary embodiment,
Fig. 6: eine schematische Darstellung der vergossenen, erfindungsge mäßen Elektronikeinheit für die Ausführungsbeispiele gemäß der Figuren 1 bis 4, Fig. 7: eine schematische Darstellung des erfindungsgemäßen Entstör mittels gemäß dem ersten Ausführungsbeispiel und 6: a schematic representation of the encapsulated electronic unit according to the invention for the exemplary embodiments according to FIGS. 1 to 4, Fig. 7: a schematic representation of the interference suppression means according to the invention according to the first embodiment and
Fig. 8: eine schematische Darstellung des erfindungsgemäßen Entstör mittels in zwei weiteren Ausführungsbeispielen gemäß der Figu ren 8a und 8b. Fig. 8: a schematic representation of the interference suppression means according to the invention in two further exemplary embodiments according to FIGS. 8a and 8b.
Beschreibung der Ausführungsbeispiele Description of the exemplary embodiments
In Figur 1 ist ein Schaltplan einer Elektronikeinheit 10 für ein nicht näher gezeig tes Elektrogerät dargestellt. Das Elektrogerät kann beispielsweise als ein Elekt rowerkzeug zur Bearbeitung von Werkstücken mittels eines elektrisch angetrie benen Einsatzwerkzeugs, wie Hand- oder Standbohrmaschinen, Schrauber, Schlagbohrmaschinen, Bohrhämmer, Hobel, Winkelschleifer, Schwingschleifer, Poliermaschinen, Kreis-, Tisch-, Kapp- und Stichsägen oder dergleichen, ausge bildet sein. Aber auch Messgeräte, Haushaltgeräte, Gartengeräte, Fahr- und Flugzeuge, etc. sind für eine Anwendung der erfindungsgemäßen Elektronikein heit 10 denkbar. FIG. 1 shows a circuit diagram of an electronics unit 10 for an electrical device that is not shown in any more detail. The electrical device can be used, for example, as an electric tool for processing workpieces using an electrically driven tool, such as hand or standing drills, screwdrivers, impact drills, hammer drills, planes, angle grinders, orbital sanders, polishing machines, circular, table, crosscut and jigsaws or the like, be trained. But also measuring devices, household appliances, gardening tools, vehicles and airplanes, etc. are conceivable for an application of the electronic unit 10 according to the invention.
Die Elektronikeinheit 10 weist eine erste Leiterplatte 12 und zumindest eine zur ersten Leiterplatte 12 beabstandet angeordnete zweite Leiterplatte 14 (vgl. Figur 2) auf, wobei auf der ersten und der zumindest einen zweiten Leiterplatte 12, 14 jeweils zumindest ein elektronisches Bauelement 16 angeordnet ist. Als elektro nische Bauelemente 16 kommen, wie in Figur 1 gezeigt, beispielsweise Wider stände 18, MOSFETs 20 oder andere passive und aktive elektronische Bauele mente, wie Dioden, Spulen, Kondensatoren, Bipolartransistoren, IGBT, etc. in Frage. Ebenso können die elektronischen Bauelemente 16 auch durch integrierte Schaltkreise, wie Mikroprozessoren, ASICs, DSPs, Speicherbausteine etc. reali siert sein. Mittels einer Mehrzahl starrer Kontaktstifte 22 einer Löt- oder Steck verbindung 24 sind die Leiterplatten 12 und 14 elektrisch miteinander verbindbar (vgl. auch Figur 3). Im vorliegenden Ausführungsbeispiel ist die erste Leiterplatte 12 als eine Leis tungsplatine zur Ansteuerung eines nicht gezeigten Elektromotors, insbesondere eines bürstenlosen Gleichstrommotors, mittels einer aus Leistungstransistoren 20 bestehenden Leistungsbrücke bzw. Leistungselektronik 25 ausgestaltet, die mit einem High-Side-Potential V+ und einem Low-Side- Potential V- versorgt wird. Die beiden als MOSFETs ausgebildeten Leistungstransistoren 20 können über elekt rische Kontakte 26, insbesondere einem High-Site Gate-Anschluss 28 und einem Low-Site Gate-Anschluss 30 zur Erzeugung eines pulsweitenmodulierten An steuersignals am mit einer nicht gezeigten Wicklung des bürstenlosen Gleich strommotors verbunden Ausgang 32 angesteuert werden. Dazu dient eine zweite Leiterplatte 14, die huckepack auf der ersten Leiterplatte 12 sitzt und die als eine Steuerplatine zur Ansteuerung der Leistungsbrücke 24 ausgestaltet ist. Da dem Fachmann entsprechende Regel- oder Steuerverfahren hinlänglich bekannt sind, soll auf diese nicht näher eingegangen werden. Wesentlich für die Erfindung ist vielmehr, dass es aufgrund der hohen Taktraten der Steuer- und Leistungskreise zu hochfrequenten Störungen kommen kann, die es möglichst wirksam zu unter drücken gilt. Die Kontaktstifte 22 der Löt- oder Steckverbindung 24 sind daher gemäß der Erfindung form-, Stoff- und/oder kraftschlüssig von einem Entstörmit tel 34, insbesondere einem Ferrit, zur Reduzierung bzw. Dämpfung derartiger elektromagnetischer Störungen umgeben. Electronics unit 10 has a first printed circuit board 12 and at least one second printed circuit board 14 (cf. Figure 2) arranged at a distance from first printed circuit board 12, at least one electronic component 16 being arranged on each of the first and the at least one second printed circuit board 12, 14. As shown in FIG. 1, for example resistors 18, MOSFETs 20 or other passive and active electronic components such as diodes, coils, capacitors, bipolar transistors, IGBTs, etc. can be considered as electronic components 16. Likewise, the electronic components 16 can also be realized by integrated circuits, such as microprocessors, ASICs, DSPs, memory modules, etc. The printed circuit boards 12 and 14 can be electrically connected to one another by means of a plurality of rigid contact pins 22 of a soldered or plug-in connection 24 (cf. also FIG. 3). In the present exemplary embodiment, the first circuit board 12 is designed as a power circuit board for controlling an electric motor (not shown), in particular a brushless DC motor, by means of a power bridge or power electronics 25 consisting of power transistors 20, which are connected to a high-side potential V + and a low -Side potential V- is supplied. The two power transistors 20 configured as MOSFETs can be connected via electrical contacts 26, in particular a high-site gate connection 28 and a low-site gate connection 30, to generate a pulse-width-modulated control signal at the output connected to a winding, not shown, of the brushless direct-current motor 32 can be controlled. A second printed circuit board 14 is used for this purpose, which sits piggyback on the first printed circuit board 12 and which is designed as a control board for controlling the power bridge 24 . Since the person skilled in the art is sufficiently familiar with corresponding regulation or control methods, they will not be discussed in any more detail. Rather, it is essential for the invention that the high clock rates of the control and power circuits can lead to high-frequency interference, which must be suppressed as effectively as possible. The contact pins 22 of the soldering or plug-in connection 24 are therefore, according to the invention, surrounded by an interlocking, material and/or non-positive fit by an interference suppression device 34, in particular a ferrite, to reduce or dampen such electromagnetic interference.
In Figur 1 ist weiterhin angedeutet, dass mindestens eine Windung W der Kon taktstifte 22 in zumindest einen Teil des Entstörmittels 34 eingebettet ist, wobei ein äußerer Teil des Entstörmittels 34 die Löt- oder Steckverbindung 24 zumin dest radial umschließt. Hierauf soll in Figur 7 noch näher eingegangen werden. FIG. 1 also indicates that at least one turn W of the contact pins 22 is embedded in at least part of the interference suppression means 34, with an outer part of the interference suppression means 34 enclosing the soldered or plug-in connection 24 at least radially. This will be discussed in more detail in FIG.
Figur 2 zeigt eine schematische Darstellung der erfindungsgemäßen Elektroni keinheit 10 mit einer ersten als Leistungsplatine ausgebildeten Leiterplatte 12 und mit einer zweiten als Steuerplatine ausgebildeten Leiterplatte 14 in einer zweiten Ausführungsform. Die zweite Leiterplatte 14 wird von der ersten Leiter platte 12 huckepack getragen, d.h., die zweite Leiterplatte 14 ist ohne weitere Be festigungsmaßnahmen an etwaigen Gehäuseteilen des Elektrogeräts nur an der darunter angeordneten ersten Leiterplatte 12 mittels der Kontaktstifte 22 der Löt- oder Steckverbindung 24 oder mittels anderer form- und/oder kraftschlüssiger Befestigungsmittel wie z.B. Rasthaken, Schraubverbindungen, etc. fixiert. FIG. 2 shows a schematic representation of the electronic unit 10 according to the invention with a first circuit board 12 designed as a power circuit board and with a second circuit board 14 designed as a control circuit board in a second embodiment. The second printed circuit board 14 is piggybacked on the first printed circuit board 12, ie the second printed circuit board 14 is without further fastening measures to any housing parts of the electrical appliance only on the first printed circuit board 12 arranged underneath by means of the contact pins 22 of the soldering or plug-in connection 24 or by means of other form-fitting and/or non-positive fastening means such as locking hooks, screw connections, etc. are fixed.
Auf der als Steuerplatine ausgebildeten zweiten Leiterplatte 14 befindet sich eine Vielzahl elektronischer SMD-Bauelemente (SMD: Surface Mounted Device) 16 in Form von Mikroprozessoren 36 oder anderen integrierten Schaltkreisen 38, Kon densatoren, Widerständen, Sicherungen, etc., um nur einige Bauelemente exemplarisch zu nennen, zur Steuerung oder Regelung der Leistungselektronik 25 auf der darunter positionierten, als Leistungsplatine ausgebildeten ersten Lei terplatte 12. Weiterhin sind auf der zweiten Leiterplatte 14 Steckverbindungen 44 für Daten- und Steuerleitungen von bzw. zu Sensoren, Tastern oder anderen elektronischen Baugruppen des Elektrogeräts vorgesehen. On the designed as a control board second circuit board 14 is a variety of electronic SMD components (SMD: Surface Mounted Device) 16 in the form of microprocessors 36 or other integrated circuits 38, Kon capacitors, resistors, fuses, etc., to just a few components as an example to name, for controlling or regulating the power electronics 25 on the positioned underneath, designed as a power board first Lei terplatte 12. Furthermore, on the second circuit board 14 plug connections 44 for data and control lines from or to sensors, buttons or other electronic assemblies of the electrical device intended.
Die erste Leiterplatte 12 weist gemäß Figur 3 ebenfalls entsprechende Bauele mente 16, beispielsweise in Form von Kondensatoren 40 und Leistungstransisto ren 20 auf. Zudem befinden sich auf ihr massive Schraubkontakte 42 zur Ener gieversorgung und zur Versorgung des nicht dargestellten bürstenlosen Gleich strommotors des Elektrogeräts (vgl. beispielsweise die Anschlusspunkte V+, V- und 32 gemäß Figur 1). Weiterhin enthält die erste Leiterplatte 12 diverse aus Kontaktstiften 22 bestehende Lötverbindungen 24 zur elektrischen Kontaktierung der zweiten Leiterplatte 14 (vgl. u.a. die elektrischen Kontakte 26 gemäß Figur 1). Mittels der Lötverbindungen 24 wird die zweite Leiterplatte 14 zudem auf der ers ten Leiterplatte 12 huckepack gehalten. According to FIG. 3, the first printed circuit board 12 also has corresponding components 16, for example in the form of capacitors 40 and power transistors 20. In addition, there are solid screw contacts 42 on it for energy supply and for supplying the brushless direct current motor, not shown, of the electrical appliance (cf., for example, the connection points V + , V− and 32 according to FIG. 1). Furthermore, the first printed circuit board 12 contains various soldered connections 24 consisting of contact pins 22 for making electrical contact with the second printed circuit board 14 (cf., inter alia, the electrical contacts 26 according to FIG. 1). The second printed circuit board 14 is also held piggyback on the first printed circuit board 12 by means of the soldered connections 24 .
Figur 4 zeigt eine schematische Darstellung der ersten als Leistungsplatine aus gebildeten Leiterplatte 12 gemäß Figur 3 mit dem erfindungsgemäßen Entstör mittel 34. Die Kontaktstifte 22 der Lötverbindung 24 sind durch das Entstörmittel 34 radial umschlossen. Dazu kann das Entstörmittel 34 beispielsweise kraft schlüssig über die Kontaktstifte 22 geschoben werden. Ebenso ist eine form schlüssige Verbindung denkbar, bei der das Entstörmittel 34 über Rastelemente an der ersten Leiterplatte 12 gehalten wird. Dabei können die Rastelemente des Entstörmittels 34 beispielsweise als Rasthaken ausgebildet sein, die in entspre chende Öffnungen der ersten Leiterplatten 12 eingreifen. Ebenso ist denkbar, dass die erste Leiterplatte 12 Rastnasen aufweist, die das Entstörmittel 34 form- schlüssig umgreifen. Dies ermöglicht eine besonders kompakte Bauform in Ver bindung mit einer sehr einfachen Montage der zweiten Leiterplatten 14 auf der ersten Leiterplatte 12 und einer effizienten Dämpfung gegenüber elektromagneti schen Störungen. In besonders bevorzugter Weise besteht das Entstörmittel 34 aus einem Ferritmaterial. Es sind aber auch andere zur Dämpfung elektromagne tischer Störungen geeignete Mittel und Materialen, wie z.B. in Kunststoff vergos sene ferromagnetische oder weichmagnetische Partikel, Durchführungskonden satoren oder dergleichen denkbar. FIG. 4 shows a schematic representation of the first printed circuit board 12 according to FIG. 3, designed as a power board, with the interference suppression means 34 according to the invention. For this purpose, the interference suppression means 34 can be pushed over the contact pins 22 in a non-positive manner, for example. A form-fitting connection is also conceivable, in which the interference suppression means 34 is held on the first printed circuit board 12 via latching elements. The latching elements of the interference suppression means 34 can be designed, for example, as latching hooks which engage in corresponding openings in the first printed circuit boards 12 . It is also conceivable that the first printed circuit board 12 has latching lugs that form the interference suppression means 34 grasp conclusively. This enables a particularly compact design in conjunction with a very simple assembly of the second printed circuit board 14 on the first printed circuit board 12 and efficient damping against electromagnetic interference. In a particularly preferred manner, the interference suppression means 34 consists of a ferrite material. However, other means and materials suitable for damping electromagnetic interference are also conceivable, such as ferromagnetic or soft-magnetic particles cast in plastic, feedthrough capacitors or the like.
Besonders bevorzugt erstreckt sich das Entstörmittel 34 und/oder die Löt- oder Steckverbindung 24 mit ihren Kontaktstiften 22 in ihren Längen-, Breiten- und Höhenmaßen über einen Bereich von ca. 5 bis 20 mm. Im gezeigten Ausfüh rungsbeispiel beträgt die Länge L des Entstörmittels beispielsweise ca. 15 mm, während seine Breite B bei ca. 8 und seine Höhe H bei ca. 10 mm liegt. Zudem weist das Entstörmittel einen ovalen, hohlzylindrischen Querschnitt mit einer Di cke seiner Mantelfläche 44 von ca. 3 mm auf. Dabei sind die Abmessungen und die Form des Entstörmittels 34 maßgeblich von den Ausmaßen und dem Aufbau der Löt- oder Steckverbindung 24 abhängig. So ergibt sich z.B. bei einer quadra tischen Anordnung der Kontaktstifte 22 der Löt- oder Steckverbindung 24 ein im Wesentlichen quader- oder kreiszylinderförmiger Querschnitt des Entstörmittels 34. Ebenso sind auch jegliche andere Polygonformen denkbar. Besonders be vorzugt weist das Entstörmittel 34 eine Länge L von 10 bis 20 mm, eine Breite B von 5 bis 10 mm und eine Höhe H von 5 bis 20 mm auf. Entsprechend kann auch die Dicke der Mantelfläche 44 zwischen 2 und 5 mm variieren. The interference suppression means 34 and/or the soldered or plug-in connection 24 with their contact pins 22 particularly preferably extend over a range of approximately 5 to 20 mm in terms of their length, width and height. In the exemplary embodiment shown, the length L of the interference suppression means is approximately 15 mm, for example, while its width B is approximately 8 and its height H is approximately 10 mm. In addition, the interference suppression means has an oval, hollow-cylindrical cross-section with a thickness of its lateral surface 44 of approximately 3 mm. The dimensions and the shape of the interference suppression means 34 are largely dependent on the dimensions and the structure of the soldered or plug-in connection 24 . For example, with a square arrangement of the contact pins 22 of the soldered or plug-in connection 24, the cross-section of the interference suppression means 34 is essentially cuboid or circular-cylindrical. Any other polygonal shapes are also conceivable. Particularly preferably, the interference suppression means 34 has a length L of 10 to 20 mm, a width B of 5 to 10 mm and a height H of 5 to 20 mm. Correspondingly, the thickness of the lateral surface 44 can also vary between 2 and 5 mm.
In Figur 5 ist eine schematische Darstellung der zweiten als Steuerplatine ausge bildeten Leiterplatte 14 in einem dritten Ausführungsbeispiel gezeigt, wobei das Entstörmittel 34 nun eine als Wire-to-Board-Steckverbindung 46 ausgebildete Löt- oder Steckverbindung 24 radial form-, Stoff- und/oder kraftschlüssig um schließt. Die Ausbreitung von Störungen auf peripher angeschlossene Platinen und Bauteile kann zudem reduziert bzw. vermieden werden, wenn das Entstör mittel 34 in die Wire-to-Board-Steckverbindung 46 integriert wird. Eine Integration in die Steckverbindung 46 ergibt fertigungstechnisch den Vorteil, dass keine zu sätzlichen Bauteile bestückt werden müssen. Figur 6 zeigt eine schematische Darstellung der in eine Vergussmasse eingegos senen erfindungsgemäßen Elektronikeinheit 10 für die Ausführungsbeispiele ge mäß der Figuren 1 bis 4. FIG. 5 shows a schematic representation of the second circuit board 14 designed as a control circuit board in a third exemplary embodiment, with the interference suppression means 34 now being a soldered or plug-in connection 24 designed as a wire-to-board plug-in connection 46 radially in terms of shape, material and/or or positively closes. The propagation of interference to peripherally connected circuit boards and components can also be reduced or avoided if the interference suppression medium 34 is integrated into the wire-to-board connector 46 . Integration into the plug-in connection 46 results in the advantage in terms of manufacturing technology that no additional components have to be fitted. FIG. 6 shows a schematic representation of the electronic unit 10 according to the invention cast in a casting compound for the exemplary embodiments according to FIGS. 1 to 4.
In Figur 7 ist das erfindungsgemäße Entstörmittel 34 nach Figur 1 in einer detail lierten, schematischen Ansicht dargestellt. Dabei weisen die Kontaktstifte 22 der Löt- oder Steckverbindung 24 jeweils eine Windung W auf, die in die Mantelflä che 44 des Entstörmittels 34 eingebettet ist, während ein äußerer Teil des Ent störmittels 34 die Löt- oder Steckverbindung 24 zumindest radial umschließt. Zur Herstellung der nicht lösbaren, formschlüssigen Verbindung zwischen den Kon taktstiften 22 und dem Entstörmittel 34 wird das Entstörmittel 34 vorteilhaft um die Kontaktstifte 22 gespritzt. Durch die in das Entstörmittel 34 eingebettete Win dung W der Kontaktstifte 22 kann eine quadratisch gesteigerte Störungsdämp fung erzielt werden. Ebenso ist denkbar, die Anzahl der Windungen W zur expo nentiellen Dämpfung der Störung zu erhöhen. FIG. 7 shows the interference suppression device 34 according to the invention according to FIG. 1 in a detailed, schematic view. The contact pins 22 of the solder or plug-in connection 24 each have a winding W, which is embedded in the surface 44 of the interference suppression device 34, while an outer part of the Ent interfering means 34 encloses the solder or plug-in connection 24 at least radially. To produce the non-detachable, form-fitting connection between the contact pins 22 and the interference suppression means 34, the interference suppression means 34 is advantageously injected around the contact pins 22. Due to the winding W of the contact pins 22 embedded in the interference suppression means 34, a quadratically increased interference attenuation can be achieved. It is also conceivable to increase the number of turns W for the expo-potential damping of the disturbance.
Figur 8 zeigt das erfindungsgemäße Entstörmittel 34 in zwei weiteren Ausfüh rungsbeispielen, wobei das Entstörmittel 34 in Figur 8a als ein Ferritblock 46 der Länge L, Breite B und Höhe H ausgebildet ist, der jeden einzelnen Kontaktstift 22 der Löt- oder Steckverbindung 24 radial umschließt, während Figur 8b die Kom bination aus einem Ferritblock 46 gemäß Figur 8a und einem die Löt- und Steck verbindung 24 als oval hohlzylindrischer Körper radial umschließendes Entstör mittel 34 gemäß Figur 4 darstellt. In Figur 8a kann der Ferritblock 46 derart aus gestaltet sein, dass er kraftschlüssig über die Kontaktstifte 22 schiebbar ist. Ebenso ist eine nicht lösbare formschlüssige Umspritzung der Kontaktstifte 22 mit dem Entstörmittel 34 denkbar. Dies ist insbesondere dann notwendig, wenn einzelne oder alle Kontaktstifte 22 mindestens eine Windung W aufweisen (vgl. Figur 7). In Figur 8b kann das als oval hohlzylindrischer Körper ausgebildete Ent störmittel 34 ergänzend auch mit entsprechenden Rastmitteln am Ferritblock 46 befestigt werden. Figure 8 shows the interference suppression means 34 according to the invention in two further exemplary embodiments, with the interference suppression means 34 in Figure 8a being designed as a ferrite block 46 of length L, width B and height H, which radially encloses each individual contact pin 22 of the soldered or plug-in connection 24, while FIG. 8b shows the combination of a ferrite block 46 according to FIG. 8a and an interference suppression means 34 according to FIG. In FIG. 8a, the ferrite block 46 can be designed in such a way that it can be pushed over the contact pins 22 in a non-positive manner. Likewise, a non-releasable form-fitting encapsulation of the contact pins 22 with the interference suppression means 34 is conceivable. This is particularly necessary when individual or all contact pins 22 have at least one winding W (cf. FIG. 7). In FIG. 8b, the anti-interference means 34, which is designed as an oval, hollow-cylindrical body, can also be attached to the ferrite block 46 with corresponding latching means.
Das Ausführungsbeispiel gemäß Figur 8a erlaubt mit besonderem Vorteil die Dämpfung bzw. Unterdrückung so genannter „Differential Mode“- Störungen, wäh- rend im Ausführungsbeispiel gemäß Figur 8b sowohl „Common Mode“- als auch „Differential Mode“- Störungen gedämpft bzw. unterdrückt werden können. Die Ausführungsbeispiele nach den Figuren 1 bis 5 eignen sich folglich eher zur Un terdrückung bzw. Dämpfung reiner „Common Mode“- Störungen. Dem Fachmann sind die Begriffe „Common Mode“ und „Differential Mode“ hinlänglich bekannt, so dass hierauf nicht im Detail eingegangen werden soll. Es sei lediglich darauf hin gewiesen, dass unter dem Begriff „Common Mode“ gleichgerichtete Störungen in den einzelnen Kontaktstiften 22 zu verstehen sind, während diese bei „Differenti al Mode“ entgegen richtet verlaufen. The exemplary embodiment according to FIG. 8a particularly advantageously allows the damping or suppression of so-called “differential mode” interference In the exemplary embodiment according to FIG. 8b, both “common mode” and “differential mode” interference can be damped or suppressed. The exemplary embodiments according to FIGS. 1 to 5 are therefore more suitable for suppressing or damping pure “common mode” interference. The terms “common mode” and “differential mode” are well known to those skilled in the art, so that they will not be discussed in detail. It should only be pointed out that the term "common mode" means rectified interference in the individual contact pins 22, while in "differential mode" they run in the opposite direction.
Abschließend sei zudem darauf hingewiesen, dass die Erfindung weder auf die gezeigten Ausführungsbeispiele gemäß der Figuren 1 bis 8 noch auf die genann ten Abmessungen und Formen oder die Anzahl der Kontaktstifte 22 der Löt- und Steckverbindung 24 beschränkt ist. Finally, it should also be pointed out that the invention is neither limited to the exemplary embodiments shown according to FIGS.

Claims

Ansprüche Expectations
1. Elektronikeinheit (10) für ein Elektrogerät, insbesondere für ein motorbetrie benes Elektrogerät, mit einer ersten Leiterplatte (12) und mit zumindest einer zur ersten Leiterplatte (12) beabstandet angeordneten, insbesondere als Huckepack-Leiterplatte ausgebildeten, zweiten Leiterplatte (14), wobei die erste und die zumindest eine zweite Leiterplatte (12, 14) jeweils zumindest ein elektronisches Bauelement (16) aufweisen und mittels einer Mehrzahl starrer Kontaktstifte (22) elektrisch verbindbar sind, dadurch gekennzeichnet, dass die Kontaktstifte (22) form-, Stoff- und/oder kraftschlüssig von einem Entstörmittel (34) zur Reduzierung elektromagnetischer Störungen umgeben sind. 1. Electronics unit (10) for an electrical device, in particular for a motor-operated electrical device, with a first printed circuit board (12) and with at least one second printed circuit board (14) arranged at a distance from the first printed circuit board (12), in particular designed as a piggyback printed circuit board, wherein the first and the at least one second circuit board (12, 14) each have at least one electronic component (16) and can be electrically connected by means of a plurality of rigid contact pins (22), characterized in that the contact pins (22) are molded, material and/or are non-positively surrounded by interference suppression means (34) to reduce electromagnetic interference.
2. Elektronikeinheit (10) nach Anspruch 1, dadurch gekennzeichnet, dass die Kontaktstifte (22) Teil einer Löt- oder Steckverbindung (24) sind und dass das Entstörmittel (34) die Löt- oder Steckverbindung (24) zumindest radial umschließt. 2. Electronic unit (10) according to claim 1, characterized in that the contact pins (22) are part of a soldered or plug-in connection (24) and that the interference suppression means (34) encloses the soldered or plug-in connection (24) at least radially.
3. Elektronikeinheit (10) nach Anspruch 1, dadurch gekennzeichnet, dass die Kontaktstifte (22) Teil einer Löt- oder Steckverbindung (24) sind und dass das Entstörmittel (34) die Löt- oder Steckverbindung (24) vollständig um schließt. 3. Electronic unit (10) according to claim 1, characterized in that the contact pins (22) are part of a soldered or plug-in connection (24) and that the interference suppression means (34) completely closes the soldered or plug-in connection (24).
4. Elektronikeinheit (10) nach Anspruch 2 oder 3, dadurch gekennzeichnet, dass das Entstörmittel (34) in die Löt- oder Steckverbindung (24) integriert ist. 4. Electronics unit (10) according to claim 2 or 3, characterized in that the interference suppression means (34) is integrated into the soldered or plug-in connection (24).
5. Elektronikeinheit (10) nach einem der vorhergehenden Ansprüche 2 bis 4, dadurch gekennzeichnet, dass zumindest einer der Kontaktstifte (22) min destens eine Windung (W) aufweist, die in dem Entstörmittel (34), insbeson- dere in einer Mantelfläche (44) des Entstörmittels (34), eingebettet ist. 5. Electronics unit (10) according to any one of the preceding claims 2 to 4, characterized in that at least one of the contact pins (22) has at least one turn (W) which is in the interference suppression means (34), in particular which is embedded in a lateral surface (44) of the interference suppression means (34).
6. Elektronikeinheit (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Löt- oder Steckverbindung (24) eine Wire-to- Board-Steckverbindung (44) ist. 6. Electronics unit (10) according to any one of the preceding claims, characterized in that the soldering or plug connection (24) is a wire-to-board plug connection (44).
7. Elektronikeinheit (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Entstörmittel (34) aus einem Ferritmaterial be steht. 7. Electronic unit (10) according to any one of the preceding claims, characterized in that the interference suppression means (34) consists of a ferrite material.
8. Elektronikeinheit (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass sich das Entstörmittel (34) und/oder die Löt- oder Steckverbindung (24) in ihren Längen-, Breiten- und Höhenmaßen über ei nen Bereich von 5 bis 20 mm erstrecken, vorzugsweise eine Länge (L) von 10 bis 20 mm, eine Breite (B) von 5 bis 10 mm und eine Höhe (H) von 5 bis 20 mm aufweisen. 8. Electronic unit (10) according to one of the preceding claims, characterized in that the interference suppression means (34) and/or the soldered or plug-in connection (24) in terms of their length, width and height measures over a range from 5 to 20 mm, preferably having a length (L) of 10 to 20 mm, a width (B) of 5 to 10 mm and a height (H) of 5 to 20 mm.
9. Elektronikeinheit (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die erste Leiterplatte (12) eine Leistungselektronik (25) und die zweite Leiterplatte (14) eine Steuer- oder Regelelektronik (36) zur Steuerung oder Regelung der Leistungselektronik (25) aufweist. 9. Electronics unit (10) according to one of the preceding claims, characterized in that the first printed circuit board (12) has power electronics (25) and the second printed circuit board (14) has control or regulating electronics (36) for controlling or regulating the power electronics (25 ) having.
10. Elektrogerät, insbesondere motorgetriebenes Elektrogerät, mit einer Elektro nikeinheit (10) nach einem der vorhergehenden Ansprüche. 10. Electrical device, in particular a motor-driven electrical device, with an electronic unit (10) according to any one of the preceding claims.
PCT/EP2021/066731 2020-07-09 2021-06-21 Electronics unit for an electrical device WO2022008210A1 (en)

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