WO2022003848A1 - Inspection method, inspection system, and stress luminescence measurement device - Google Patents

Abstract

An inspection method according to a first embodiment of the present invention comprises a step for acquiring a stress luminescence image of a deformed sample including a stress luminescent material, a step for acquiring information about an area of interest in the stress luminescence image, a step for specifying an inspection location on the surface of the sample on the basis of the position of the area of interest in the stress luminescence image, and a step for generating inspection location information for identifying the specified inspection location.

Description

Inspection method, inspection system and stress luminescence measuring device

The present invention relates to an inspection method, an inspection system, and a stress luminescence measuring device.

A flexible device is a device in which a semiconductor element, a light emitting element, or the like is formed on a flexible substrate such as a resin substrate, and typical examples thereof include a lighting device, a display, and a sensor. In recent years, various products equipped with a foldable or foldable flexible display have been developed.

An example of a product equipped with a flexible display is a foldable mobile terminal (smartphone, tablet, etc.). In such a mobile terminal, the flexible display is a touch panel display, and has a display and an input unit that accepts a user's operation.

In the development site of a foldable mobile terminal, generally, a fold test of a sample is performed by tens of thousands to hundreds of thousands using a deformation tester as shown in, for example, Japanese Patent Application Laid-Open No. 2019-39743 (Patent Document 1). The durability and performance of the sample have been verified by repeating the process several times.

Japanese Unexamined Patent Publication No. 2019-39743

In the above-mentioned folding test, if a defect such as a minute crack occurs in the sample, strain is generated around this defect, and the sample may eventually break. However, in the above-mentioned folding test, it is difficult to evaluate the defective part and durability of the sample in a non-destructive state only after the sample is broken. Further, since it is not possible to visually confirm the part where the strain is generated inside the sample, there is a problem that it is difficult to identify at what timing the defect has occurred in the sample.

In addition, in order to confirm the state of the sample until it breaks, it is possible to adopt a method of observing the state of the sample using a microscope during the folding test. This method requires the user to visually identify an appropriate observation point. However, since it is not always easy to visually detect minute cracks and the like, there is a concern that the user's work will be complicated.

The present invention has been made to solve such a problem, and an object of the present invention is to provide an inspection method, an inspection system, and a stress luminescence measuring device capable of easily and appropriately identifying an inspection site of a sample. That is.

The inspection method according to the first aspect of the present invention includes a step of acquiring a stress-stimulated luminescent image when a sample containing a stress-stimulated luminescent material is deformed, a step of acquiring information on a region of interest of the stress-stimulated luminescent image, and a stress-stimulated luminescent image. It comprises a step of identifying an inspection site on the surface of the sample based on the position of the region of interest within, and a step of generating inspection site information for identifying the identified inspection site.

According to the present invention, it is possible to provide an inspection method, an inspection system, and a mechanoluminescence measuring device that can easily and appropriately identify the inspection location of a sample.

It is a block diagram which shows the whole structure of the inspection system which concerns on embodiment. It is a block diagram which shows the structural example of the stress luminescence measuring apparatus and inspection apparatus shown in FIG. It is a perspective view of a holder. It is a side view of a holder. It is a figure for demonstrating the bending angle and bending radius of a sample. It is a block diagram for demonstrating the functional configuration of a controller. It is a figure which shows a part of a sample and a holder schematically. It is a figure for demonstrating the positional relationship of a sample and a camera. It is a flowchart explaining the procedure of an inspection process. It is a flowchart explaining the procedure of stress luminescence measurement processing. It is a figure which shows an example of a stress-stimulated luminescence image schematically. It is a flowchart explaining the procedure of inspection part identification processing. It is a flowchart explaining the procedure as an example of the process of setting ROI. It is a figure which shows the surface of a sample schematically. It is a block diagram which shows the structure of the stress luminescence measuring apparatus which concerns on the modification of this Embodiment. It is a figure for demonstrating another example of inspection part information.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following, the same or corresponding parts in the figure are designated by the same reference numerals, and the description thereof will not be repeated in principle.

[Inspection system configuration]
FIG. 1 is a block diagram showing an overall configuration of an inspection system according to an embodiment. The inspection system according to the present embodiment includes a stress luminescence measuring device 100 and an inspection device 200.

The stress-stimulated luminescence measuring device 100 is a device that measures the stress (strain) generated in an inspection target (hereinafter, also simply referred to as “sample S”) by utilizing the luminescence phenomenon of the stress-stimulated luminescent material. The stress luminescence measuring device 100 can be used to test the durability against the stress generated in the sample S.

Sample S contains at least a stress-stimulated luminescent material on its surface. The stress-stimulated luminescent material refers to a substance obtained by molding a stress-stimulated luminescent material alone or after combining another material (for example, resin). The stress-stimulated luminescent material is a material that emits light by an external mechanical stimulus. The stress-stimulated luminescent material is a solid solution of an element that is the center of luminescence in the skeleton of an inorganic crystal (base material), and a typical example is strontium aluminate doped with europium. In addition, there are zinc sulfide doped with transition metals or rare earths, barium / calcium titanate, calcium aluminates / yttrium, and the like. In the present embodiment, a known stress-stimulated luminescent material can be used.

The stress-stimulated luminescent material can be composed of, for example, a luminescent film arranged on the surface of the sample S. Alternatively, the stress-stimulated luminescent material can be mixed with the sample S. The stress-stimulated luminescent material has a property of emitting light by strain energy applied from the outside, and its emission intensity changes according to the magnitude of strain energy.

The stress-stimulated luminescence measuring device 100 is configured to acquire a stress-stimulated luminescence image by capturing the luminescence of the stress-stimulated luminescent material when the sample S is deformed by a camera. The deformation of the sample S means that the shape and state of the sample S change as the load applied to the sample S changes. The change in load includes applying a load to the sample S and removing the load applied to the sample S. Further, when a region of interest (ROI: Region Of Interest) is set in the acquired stress-stimulated luminescence image, the stress-stimulated luminescence measuring device 100 will inspect the surface of the sample S based on the position of the ROI in the stress-stimulated luminescence image. Is configured to identify.

Specifically, the stress-stimulated luminescence measuring device 100 has a correspondence relationship between each position on the surface of the sample S and each position in the stress-stimulated luminescence image in advance. The stress-stimulated luminescence measuring device 100 calculates the position of the inspection point on the surface of the sample S based on the position of the ROI in the stress-stimulated luminescence image by referring to the correspondence. The stress luminescence measuring device 100 generates inspection location information for identifying the specified inspection location, and outputs the generated inspection location information.

The inspection device 200 acquires the inspection location information output from the stress luminescence measuring device 100. For example, the inspection device 200 is communication-connected to the mechanoluminescence measuring device 100, and receives data indicating inspection location information transmitted from the mechanoluminescence measuring device 100.

The inspection device 200 is configured to inspect the sample S by observing the inspection location specified by the inspection location information when the inspection location information is acquired. Observation of the inspection site can be performed, for example, using a microscope (optical microscope, electron microscope, etc.) or a camera.

According to the inspection system according to the present embodiment, when a defect such as a minute crack occurs in the sample S due to the application of a load, stress (strain) is locally concentrated around the defect, so that the stress-strain luminescence measuring device is used. At 100, a luminescence intensity distribution having a luminescence intensity corresponding to this stress distribution is observed. For example, in a stress-stimulated luminescence image, when a portion of the emission intensity distribution having a large emission intensity (stress concentration portion) is set to ROI, the stress-stimulated luminescence measuring device 100 derives the position of the surface of the sample S corresponding to the portion. , Specify the position as an inspection point.

In the inspection device 200, by observing the inspection points of the sample S specified by the stress luminescence measuring device 100, it is possible to inspect in detail the state of occurrence of defects inside the sample S.

As described above, in the inspection system according to the present embodiment, the inspection portion on the surface of the sample S is specified based on the stress-stimulated luminescent image when the sample S is deformed, and the inspection for identifying the specified inspection portion is performed. Location information is generated.

With such a configuration, it is possible to easily identify the inspection location without the need for the work of visually identifying the inspection location by the user (for example, the inspector). In addition, since the inspection site is specified based on the distribution of the emission intensity, the stress concentration portion of the sample can be appropriately observed. As a result, the user can inspect the sample S efficiently and appropriately.

Further, according to the inspection system according to the present embodiment, the user can observe the two-dimensional stress distribution when a load is applied to the sample S in a non-destructive state by using the stress-stimulated luminescent image. At the same time, by observing the inspection points of the specified sample S in the stress distribution, the state of the sample S (local defects, etc.) can be inspected in detail. According to this, the user can verify the mechanism by which the sample S is destroyed by applying the load in chronological order.

Although the stress luminescence measuring device 100 and the inspection device 200 are shown as separate bodies in the example of FIG. 1, the stress luminescence measuring device 100 and the inspection device 200 may be integrally configured. Further, the stress luminescence measuring device 100 and the inspection device 200 may be connected by wire or wirelessly. The stress luminescence measuring device 100 and the inspection device 200 may be communicated and connected via an external communication network such as the Internet.

Hereinafter, a configuration example of the inspection system according to the present embodiment will be described. In the following description, it is assumed that the sample S is a flexible device. A flexible device is a device in which a semiconductor element, a light emitting element, or the like is formed on a flexible substrate such as a resin substrate.

FIG. 2 is a block diagram showing a configuration example of the stress luminescence measuring device 100 and the inspection device 200 shown in FIG. In the example of FIG. 2, sample S is a foldable or foldable flexible sheet. The flexible sheet can form a part of a flexible display or wearable device of a communication terminal such as a smartphone or tablet.

The sample S has a rectangular shape and has a first surface Sa and a second surface Sb opposite to the first surface Sa. A predetermined region of the first surface Sa of the sample S is covered with a stress-stimulated luminescent material. The predetermined region can be set to include the central portion of bending of the sample S when a bending load is applied. The stress-stimulated luminescent material can be formed by attaching the stress-stimulated luminescent material to the predetermined region on the stress-stimulated luminescent sheet. Alternatively, the stress-stimulated luminescent material can be formed by applying a resin material containing the stress-stimulated luminescent material to the predetermined region and drying it.

[Structure example of stress-stimulated luminescent device]
With reference to FIG. 2, the stress luminescence measuring device 100 has a “load application mechanism” for applying a load (bending load) to the sample S. When the bending load is applied by the load application mechanism, the bending load is also applied to the stress-stimulated luminescent material covering the first surface Sa of the sample S, so that the stress-stimulated luminescent material emits light. The stress-stimulated luminescence measuring device 100 is configured to measure the light-emitting state of the stress-stimulated luminescent material at least when a bending load is applied.

Specifically, the stress luminescence measuring device 100 includes a holder 10 for holding the sample S, a light source 30, a camera 40, a first driver 20, a second driver 42, a third driver 32, and a controller 50. Has.

The holder 10 is configured to support the sample S by contacting at least two points of the sample S. In the example of FIG. 2, the holder 10 is configured to support the first end S1 and the second end S2 of the sample S facing each other.

The first driver 20 is connected to the holder 10 and by moving the holder 10 between the "first holder position" and the "second holder position", the first end S1 and the second end. The distance between the portions S2 can be expanded and contracted. The first driver 20 is connected to the holder 10 and has an actuator 21 that reciprocates the second end S2 of the sample S. The actuator 21 is, for example, a cylinder.

The sample S can be bent by reducing the distance between the first end S1 and the second end S2 by the first driver 20 and the holder 10. Further, the sample S can be extended by extending the distance between the first end portion S1 and the second end portion S2 by the first driver 20 and the holder 10. The holder 10 and the first driver 20 form a "load application mechanism".

Next, a configuration example of the holder 10 shown in FIG. 1 will be described.
FIG. 3 is a perspective view of the holder 10. FIG. 4 is a side view of the holder 10.

With reference to FIG. 3, the holder 10 includes a frame 1, a fixed wall 2, a moving wall 3, mounting portions 5, 6, holding plates 7, 8, hinges 9, leaf springs 12, and connecting portions. It has 13, a rail 14, sliders 15A and 15B, bars 16 and 17, a bracket 18, and top plates 22 and 23.

The frame 1 has a box shape with each surface open. In FIGS. 3 and 4, in the state where the frame 1 is placed, the width direction is the X-axis direction, the depth direction is the Y-axis direction, and the height direction is the Z-axis direction.

The fixed wall 2 and the moving wall 3 are installed inside the frame 1 so as to face each other in the X-axis direction. In a plan view of the frame 1 viewed from above (Z-axis direction), the fixed wall 2 is arranged close to the first side 1A extending in the Y-axis direction of the frame 1, and the moving wall 3 is arranged with the first side 1A. , Is arranged in the intermediate portion between the first side 1A and the second side 1B facing in the X-axis direction. The fixed wall 2 is fixed to the frame 1. On the other hand, the moving wall 3 is configured to be able to move toward or away from the fixed wall 2 by receiving an external force from the first driver 20 (see FIG. 1).

Specifically, in a plan view of the frame 1 from above, rails 14 are installed on each of the third side 1C and the fourth side 1D extending in the X-axis direction. Two sliders 15A and 15B are movably attached to each rail 14. Of the two sliders 15A and 15B, the first slider 15A is installed between the fixed wall 2 and the first side 1A of the frame 1. The second slider 15B is installed between the moving wall 3 and the second side 1B of the frame 1.

A bar 16 is connected between the first slider 15A on the third side 1C of the frame 1 and the first slider 15A on the fourth side 1D. The bar 16 is connected to the fixed wall 2. The bracket 18 is arranged so as to extend from both ends of the bar 16 in the Y-axis direction toward the frame 1. The first end of the bracket 18 in the Y-axis direction is fixed to the bar 16, and the second end is fixed to the frame 1. As a result, the first slider 15 is fixed to the rail 14, so that the fixing wall 2 can be fixed to the frame 1.

A bar 17 is connected between the second slider 15B on the third side 1C of the frame 1 and the second slider 15B on the fourth side 1D. The bar 17 is connected to the moving wall 3. Since the bar 17 is not fixed to the frame 1, the second slider 15B can move on the rail 14. As a result, the moving wall 3 can be moved relative to the fixed wall 2 in the X-axis direction.

The downward hanging 3a of the moving wall 3 is provided with a connecting portion 13 for connecting the first driver 20 (see FIG. 2). The first driver 20 has an actuator 21. The actuator 21 is, for example, a cylinder. By reciprocating the piston in the cylinder along the X-axis direction, the moving wall 3 can be brought closer to the fixed wall 2 or the moving wall 3 can be moved away from the fixed wall 2.

The top plate 22 is attached to the upper end of the fixed wall 2 in the Z-axis direction. The top plate 22 extends perpendicular to the fixed wall 2. As shown in FIG. 3, the mounting portion 5 is rotatably connected to the top plate 22 by a hinge 9. Specifically, the mounting portion 5 is configured to be rotatable between a position horizontal to the top plate 22 and a position perpendicular to the top plate 22 in conjunction with the movement of the moving wall 3. ..

The presser plate 7 is detachably configured with respect to the mounting portion 5. By mounting the presser plate 7 to the mounting portion 6 with the first end portion S1 of the sample S sandwiched between the mounting portion 5 and the holding plate 7, the mounting portion 5 becomes the first end portion of the sample S. S1 can be gripped. In addition, instead of the pressing plate 7, the first end portion S1 may be fixed to the mounting portion 5 by using an adhesive tape or the like.

The top plate 23 is attached to the upper end of the moving wall 3 in the Z-axis direction. The top plate 23 extends perpendicular to the moving wall 3. As shown in FIG. 4, the mounting portion 6 is rotatably connected to the top plate 23 by a hinge 9. Specifically, the mounting portion 6 is configured to be rotatable between a position horizontal to the top plate 23 and a position perpendicular to the top plate 23 in conjunction with the movement of the moving wall 3. ..

The presser plate 8 is detachably configured with respect to the mounting portion 6. By mounting the presser plate 8 to the mounting portion 6 with the second end portion S2 of the sample S sandwiched between the mounting portion 6 and the holding plate 8, the mounting portion 6 becomes the second end portion of the sample S. S2 can be gripped. In addition, instead of the pressing plate 8, the second end portion S2 may be fixed to the mounting portion 6 by using an adhesive tape or the like.

FIG. 4 shows the states of the gripper and the sample S when the moving wall 3 is moved so as to approach the fixed wall 2 in three stages. In FIG. 4, the position X1 indicates the position of the moving wall 3 in the X-axis direction in the extended state of the sample S, and the positions X2 and X3 indicate the positions of the moving wall 3 in the X-axis direction in the bent state of the sample S. show. The position X0 indicates the position of the fixed wall 2 in the X-axis direction.

When the moving wall 3 is located at the position X1, the mounting portions 5 and 6 are all located horizontally to the top plates 22 and 23. Therefore, no stress is applied to the sample S. The distance between the position X1 of the moving wall 3 and the position X0 of the fixed wall 2 is determined according to the length of the sample S in the X-axis direction. The position X1 corresponds to one embodiment of the "first holder position".

When the moving wall 3 is moved from the position X1 to the position X2 along the X-axis direction, the distance between the moving wall 3 and the fixed wall 2 is shortened, and a bending load is applied to the sample S. At this time, the mounting portion 5 rotates toward the fixed wall 2, and the mounting portion 6 rotates toward the moving wall 3.

In the example of FIG. 4, the range of rotation angles of the mounting portions 5 and 6 is 0 rad or more and π / 2 rad or less. When the moving wall 3 is further moved to the position X3, the mounting portion 5 is in a position perpendicular to the top plate 22, and the mounting portion 6 is in a position perpendicular to the top plate 23. The position X3 corresponds to one embodiment of the "second holder position".

By rotating the mounting portions 5 and 6 in conjunction with the movement of the moving wall 3 in this way, the load applied to the sample S is only the bending load, and other loads (for example, frictional force or tensile force) are the sample S. It is possible to suppress the action on. Therefore, it is possible to accurately measure the bending load applied to the sample S.

The first driver 20 can periodically move the holder 10 by periodically operating the actuator 21. Specifically, the first driver 20 moves the moving wall 3 from the first holder position X1 to the second holder position X3 in the first half of one operation cycle of the holder 10. As a result, the sample S is bent at a bending angle and a bending radius according to the second holder position X3. Further, the first driver 20 can move the moving wall 3 from the second holder position X3 to the first holder position X1 in the latter half of one operation cycle of the holder 10.

FIG. 5 is a diagram for explaining the bending angle and bending radius of the sample S.
With reference to FIG. 5, the bending angle of the sample S corresponds to the magnitude of the angle formed by the linear portions of the first end S1 and the second end S2 of the sample S changed from 180 ° (πrad). .. The bending radius of the sample S corresponds to the radius of a circle C that draws a curve having the same size as the central portion of the bending of the sample S.

As the bending angle of the sample S increases, the bending load applied to the sample S increases. Further, as the bending radius of the sample S becomes smaller, the bending load applied to the sample S becomes larger. In the configuration example of FIG. 4, at least one of the bending angle and the bending radius of the sample S can be changed by changing the second holder position X3 of the holder 10. That is, the magnitude of the bending load applied to the sample S can be changed by changing the second holder position X3.

Returning to FIG. 3, a leaf spring 12 having the same length in the X-axis direction as the sample S is connected between both ends of the mounting portion 5 in the Y-axis direction and both ends of the mounting portion 6 in the Y-axis direction. ing. The leaf spring 12 has a property of tending to have a uniform radius of curvature when bent. As a result, when the sample S is bent, the sample S can be uniformly bent following the bending of the leaf spring 12.

Returning to FIG. 2, the sample S is supported by the holder 10 so that the first surface Sa is on the upper side. As described above, a predetermined region of the first surface Sa is covered with a stress-stimulated luminescent material. The light source 30 is arranged above the Z-axis direction of the sample S, and is configured to irradiate the stress-stimulated luminescent material on the first surface Sa of the sample S with excitation light. Upon receiving the excitation light, the stress-stimulated luminescent material transitions to the luminescent state. The excitation light is, for example, ultraviolet light or visible light. In the example of FIG. 2, the first surface Sa of the sample S is irradiated with the excitation light from two directions, but the light source 30 emits the excitation light to the sample S from one direction or three or more directions. It may be configured to irradiate.

The third driver 32 supplies electric power for driving the light source 30. The third driver 32 can control the amount of excitation light emitted from the light source 30, the irradiation time of the excitation light, and the like by controlling the electric power supplied to the light source 30 in response to a command received from the controller 50.

The camera 40 is arranged above the sample S in the Z-axis direction so as to include at least a predetermined region of the first surface Sa in the imaging field of view. Specifically, the camera 40 is arranged so that the focus position is located at at least one point in a predetermined region of the first surface Sa. It is preferable that at least one point in the predetermined region is located at the central portion of the bending of the sample S.

The camera 40 includes an optical system such as a lens and an image sensor. The image pickup device is realized by, for example, a CCD (Charge Coupled Device) sensor, a CMOS (Complementary Metal Oxide Semiconductor) sensor, or the like. The image pickup device generates an image pickup image by converting the light incident from the first surface Sa via the optical system into an electric signal.

The camera 40 is configured to capture the light emission of the stress-stimulated luminescent material on the first surface Sa at least when a load is applied to the sample S. The stress-stimulated luminescence image data generated by the image pickup of the camera 40 is transmitted to the controller 50.

The second driver 42 is configured to be able to change the focus position of the camera 40 in response to a command received from the controller 50. Specifically, the second driver 42 can adjust the focus position of the camera 40 by moving the camera 40 along the Z-axis direction and the X-axis direction. For example, the second driver 42 has a motor that rotates a feed screw that moves the camera 40 in the Z-axis direction and the X-axis direction, and a motor driver that drives the motor. The feed screw is rotationally driven by a motor to position the camera 40 at a designated position within a predetermined range in each of the Z-axis and X-axis directions. Further, the second driver 42 transmits the position information indicating the position of the camera 40 to the controller 50.

The controller 50 controls the entire stress luminescence measuring device 100. The controller 50 has a processor 501, a memory 502, an input / output interface (I / F) 503, and a communication I / F 504 as main components. Each of these parts is communicably connected to each other via a bus (not shown).

The processor 501 is typically an arithmetic processing unit such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The processor 501 controls the operation of each part of the mechanoluminescence measuring device 100 by reading and executing the program stored in the memory 502. Specifically, the processor 501 realizes each of the processes of the stress luminescence measuring device 100 described later by executing the program. Although the example of FIG. 2 illustrates a configuration in which the number of processors is singular, the controller 50 may be configured to have a plurality of processors.

The memory 502 is realized by a non-volatile memory such as a RAM (Random Access Memory), a ROM (Read Only Memory), and a flash memory. The memory 502 stores a program executed by the processor 501, data used by the processor 501, and the like.

The input / output I / F 503 is an interface for exchanging various data between the processor 501 and the first driver 20, the third driver 32, the camera 40, and the second driver 42.

The communication I / F 504 is a communication interface for exchanging various data between the stress luminescence measuring device 100 and other devices including the inspection device 200, and is realized by an adapter or a connector. The communication method may be a wireless communication method using a wireless LAN (Local Area Network) or the like, or a wired communication method using USB (Universal Serial Bus) or the like. The data transmitted from the stress luminescence measuring device 100 to the inspection device 200 includes data indicating inspection location information.

A display 60 and an operation unit 70 are connected to the controller 50. The display 60 is composed of a liquid crystal panel or the like capable of displaying an image. The operation unit 70 receives a user's operation input to the stress luminescence measuring device 100. The operation unit 70 is typically composed of a touch panel, a keyboard, a mouse, and the like.

The controller 50 is communicatively connected to the first driver 20, the third driver 32, the camera 40, and the second driver 42. The communication between the controller 50 and the first driver 20, the third driver 32, the camera 40 and the second driver 42 may be realized by wireless communication or wired communication.

FIG. 6 is a block diagram for explaining the functional configuration of the controller 50.
With reference to FIG. 6, the controller 50 includes a stress control unit 51, a light source control unit 52, an image pickup control unit 53, a measurement control unit 54, a data acquisition unit 55, a data processing unit 56, a storage unit 57, and an output unit 58. .. These are functional blocks realized based on the processor 501 executing a program stored in memory 502.

The stress control unit 51 controls the operation of the first driver 20. Specifically, the stress control unit 51 controls the operating speed, operating time, and the like of the first driver 20 according to preset measurement conditions. By controlling the operating speed and operating time of the first driver 20, the moving speed, moving time, moving distance, and the like of the moving wall 3 (see FIGS. 3 and 4) in the holder 10 can be adjusted.

The light source control unit 52 controls the drive of the light source 30 by the third driver 32. Specifically, the light source control unit 52 generates a command for instructing the magnitude of the electric power supplied to the light source 30 and the supply time of the electric power to the light source 30 based on the preset measurement conditions. , The generated command is output to the third driver 32. By controlling the electric power supplied to the light source 30 by the third driver 32 in accordance with the command, it is possible to adjust the amount of excitation light emitted from the light source 30, the irradiation time of the excitation light, and the like.

The image pickup control unit 53 controls the movement of the camera 40 by the second driver 42. Specifically, the image pickup control unit 53 follows the movement of the predetermined region of the sample S to move the camera 40 based on the preset measurement conditions and the position information of the camera 40 input from the second driver 42. Generate a command to move. The image pickup control unit 53 outputs the generated command to the second driver 42. By moving the camera 40 according to the command, the second driver 42 can maintain the focus position of the camera 40 at at least one point in the predetermined region of the sample S.

The image pickup control unit 53 further controls the image pickup by the camera 40. Specifically, the image pickup control unit 53 controls the camera 40 so as to capture the light emitted from the stress-stimulated luminescent material at least when stress is applied, according to preset measurement conditions. The measurement conditions for imaging include the frame rate of the camera 40.

The data acquisition unit 55 acquires the mechanoluminescent image data generated by the imaging of the camera 40, and transfers the acquired mechanoluminescent image data to the data processing unit 56.

The data processing unit 56 performs known image processing on the stress-stimulated luminescence image data obtained by imaging the camera 40 to generate an image showing the distribution of the luminescence intensity on the first surface Sa of the sample S. The data processing unit 56 can store the measurement result including the image captured by the camera 40 and the image showing the distribution of the emission intensity on the first surface Sa in the storage unit 57 and display it on the display 60.

Further, when the ROI is set in the stress-stimulated luminescent image, the data processing unit 56 derives the position of the surface of the sample S corresponding to the ROI and specifies the position as an inspection point. The ROI can be set based on the user input received by the operation unit 70. Alternatively, the data processing unit 56 can automatically set the ROI based on the distribution of the luminescence intensity appearing in the stress luminescence image.

The data processing unit 56 generates inspection location information for identifying the specified inspection location. The output unit 58 outputs the generated inspection location information.

The measurement control unit 54 comprehensively controls the stress control unit 51, the light source control unit 52, the image pickup control unit 53, the data acquisition unit 55, and the data processing unit 56. Specifically, the measurement control unit 54 gives a control command to each unit based on the measurement conditions input to the operation unit 70 and the information of the device to be the sample S.

[Configuration example of inspection device]
With reference to FIG. 2, the inspection device 200 includes an observation device 210, a controller 220, a display 230, and an operation unit 240. The observation device 210 is a device for observing the inspection point of the sample S, and has, for example, a microscope (optical microscope, electron microscope, etc.) and / or a camera, and is configured to be able to acquire an observation image of the inspection point. Will be done.

The controller 220 controls the entire inspection device 200. The controller 220 has a processor 222, a memory 224, an input / output I / F 226, and a communication I / F 228 as main components. Each of these parts is communicably connected to each other via a bus (not shown).

The processor 222 is typically an arithmetic processing unit such as a CPU or MPU. The processor 222 controls the operation of each part of the inspection device 200 by reading and executing the program stored in the memory 224. Specifically, the processor 222 realizes each of the processes of the inspection device 200 described later by executing the program. Although the example of FIG. 2 illustrates a configuration in which the number of processors is singular, the controller 220 may be configured to have a plurality of processors.

Memory 224 is realized by non-volatile memory such as RAM, ROM and flash memory. The memory 224 stores a program executed by the processor 222, data used by the processor 222, and the like.

The input / output I / F 226 is an interface for exchanging various data between the processor 222 and the observation device 210.

The communication I / F 228 is a communication interface for exchanging various data between the inspection device 200 and other devices including the stress luminescence measuring device 100, and is realized by an adapter or a connector. The communication method may be a wireless communication method using a wireless LAN or the like, or a wired communication method using USB or the like.

A display 230 and an operation unit 240 are connected to the controller 220. The display 230 is composed of a liquid crystal panel or the like capable of displaying an image. The operation unit 240 receives a user's operation input to the inspection device 200. The operation unit 240 is typically composed of a touch panel, a keyboard, a mouse, and the like.

[Operation of inspection system]
Next, the operation of the inspection system according to the present embodiment will be described.

(Mechanoluminescence measurement)
First, the principle of measuring stress luminescence by the stress luminescence measuring device 100 will be described with reference to FIGS. 7 and 8. FIG. 7 is a diagram schematically showing a part of the sample S and the holder 10. FIG. 7A shows the sample S before the load is applied, and FIG. 7B shows the sample S when the load is applied.

As shown in FIG. 7A, the first and second end portions S1 and S2 of the sample S in the X-axis direction are gripped by the mounting portions 5 and 6 of the holder 10 and the pressing plates 7 and 8. A stress-stimulated luminescent body ML is arranged on a predetermined region of the first surface Sa of the sample S. The light source 30 excites the stress-stimulated luminescent material ML by irradiating the stress-stimulated luminescent material ML with excitation light.

Next, as shown in FIG. 7B, a bending load is applied to the sample S by moving the moving wall 3 toward the fixed wall 2 in the X-axis direction by a first driver 20 (not shown). FIG. 7B shows how the mounting portion 6 and the holding plate 8 move in the direction of the arrow A in conjunction with the movement of the moving wall 3.

The camera 40 takes an image of a predetermined region (including the central portion of bending) of the sample S in accordance with the timing of applying the load to the sample S. That is, the camera 40 captures the light emission of the stress-stimulated luminescent material ML.

By repeatedly executing the bending of the sample S (FIG. 7 (B)) and the stretching of the sample S (FIG. 7 (A)) described above in a fixed cycle (operation cycle of the first driver 20), the sample S is subjected to the bending. The bending load can be repeatedly applied. Then, by capturing the light emitted from the stress-stimulated luminescent material ML during the repeated bending and stretching operation with the camera 40, the durability against the repeated load applied to the sample S can be evaluated.

Here, as shown in FIG. 4, when the sample S supported by the holder 10 is bent, the central portion of the bending of the sample S moves in the Z-axis direction and the X-axis direction. Specifically, when the sample S is bent, the central portion of the bend moves in the direction toward the fixed wall 2 along the X-axis direction and moves away from the camera 40 along the Z-axis direction. On the other hand, when the sample S is stretched, the central portion of the bending moves in the direction away from the fixed wall 2 along the X-axis direction and in the direction approaching the camera 40 along the Z-axis direction.

The controller 50 controls the second driver 42 so that the focus position of the camera 40 is maintained at at least one point in the predetermined region of the sample S at least during imaging by the camera 40. Specifically, the second driver 42 moves the camera 40 according to the movement of the predetermined area of the sample S according to the command received from the controller 50, so that the focus position of the camera 40 is at least one in the predetermined area. It is configured to be maintained at a point.

FIG. 8 is a diagram for explaining the positional relationship between the sample S and the camera 40. In FIG. 8, X0 indicates the X coordinate of the first end portion S1 of the sample S, and X1 to X6 indicate the X coordinate of the second end portion S2 of the sample S. Z0 indicates the Z coordinates of the first and second ends S1 and S2 of the sample S. The first end S1 of the sample S is a fixed end and the second end S2 is a free end.

In FIG. 8, assuming that the angle at which the first end S1 rotates around X0 and Z0 is θ, the rotation angle θ can be changed within the range of 0 rad or more and π / 2 rad or less. When the rotation angle θ changes from 0 rad to π / 2 rad, the second end S2 moves toward the first end S1, so that the bending angle of the sample S becomes large and the bending radius becomes small. .. When the second end portion S2 further moves toward the first end portion S1 in the state of the rotation angle θ = π / 2rad, the bending radius of the sample S becomes further smaller. As a result, as the X coordinate of the second end S2 transitions in the order of X1 → X2 → ... → X6, the bending load applied to the sample S gradually increases.

As shown in FIG. 8, one point (in the figure) in a predetermined region (including the central portion of bending) of the sample S as the second end S2 (free end) of the sample S moves in the X-axis direction. The point R1) also moves in the X-axis direction and the Z-axis direction. The X coordinate of the point R1 approaches X0, and the Z coordinate of the point R1 moves away from Z0.

The second driver 42 moves the camera 40 according to the movement of the point R1 in the predetermined area of the sample S. Specifically, the second driver 42 moves the camera 40 in the X-axis direction so that the X coordinate of the position of the camera 40 (point C in the figure) matches the X coordinate of the point R1. In the example of FIG. 8, when the X coordinate of the second end S2 of the sample S transitions in the order of X1 → X2 → ... → X6, the X coordinate of the position (point C) of the camera 40 is X1 / 2 → X2. The transition is made in the order of / 2 → ... → X6 / 2.

The second driver 42 also aligns the camera 40 with the Z axis so that the distance D between the Z coordinate of the position (point C) of the camera 40 and the Z coordinate of the point R1 in the predetermined region of the sample S maintains a predetermined distance. Move in the direction. In the example of FIG. 8, when the X coordinate of the second end S2 of the sample S transitions in the order of X1 → X2 → ... → X6, the Z coordinate of the position (point C) of the camera 40 is Z1 → Z2 →.・ ・ Transitions in the order of → Z6. The predetermined distance is determined according to the focus position of the camera 40.

By moving the camera 40 in conjunction with the movement of the holder 10 when the bending load is applied to the sample S in this way, the focus position of the camera 40 is always focused on the point R1 in the predetermined region of the sample S. Can be done. Therefore, when the sample S is bent at a predetermined bending angle, the focus position of the camera 40 can be focused on at least one point in the predetermined region of the sample S. As a result, the camera 40 can accurately image the light emission in the predetermined region at the predetermined bending angle, so that the bending load applied to the predetermined region can be accurately measured.

In the example of FIG. 8, the configuration in which the focus position of the camera 40 is always focused on the point R1 of the predetermined region of the sample S has been described, but the focus position of the camera 40 is set to the predetermined region of the sample S at least at a predetermined bending angle. By setting the focus on the point R1, it is possible to accurately image the light emission in a predetermined region at a predetermined bending angle.

(Inspection processing)
Next, an inspection process using the above-mentioned stress-stimulated luminescence measurement will be described. FIG. 9 is a flowchart illustrating the procedure of the inspection process.

With reference to FIG. 9, first, a flexible sheet to be a sample S is prepared by step S10. Further, in step S10, a process for acquiring the correspondence between each position on the surface of the sample S and each position in the stress-stimulated luminescent image is executed.

In this process, the correspondence between each position on the surface of the sample S and each position in the image captured by the camera 40 is acquired. Specifically, the stress luminescence measuring device 100 applies a load to the sample S using the load applying mechanism, and the surface of the sample S at the time of applying the load is imaged by the camera 40. The data processing unit 56 acquires the correspondence between each position in the acquired captured image and each position on the surface of the sample S.

In the present embodiment, as shown in FIG. 8, during the period of moving the holder 10 from the first holder position to the second holder position, the sample S is gradually bent from the stretched state, and the bending thereof is performed. At least one of the angle and bending radius changes gradually. At this time, since each position on the surface of the sample S moves with the change in the bending angle and the bending radius, the correspondence between each position on the surface of the sample S and each position in the captured image gradually changes.

The controller 50 obtains a correspondence between each position on the surface of the sample S and each position in the captured image when a bending load is applied, and stores the obtained correspondence in the memory 502. For example, the controller 50 can derive a relational expression or a map representing the corresponding relationship for each combination of the bending angle and the bending radius of the sample S, and can store the derived relational expression or the map in the memory 502.

It is sufficient to perform the process of acquiring the above correspondence relationship once for a plurality of samples S of the same type. By storing the derived relational expression or map in the memory 502 in association with the type of sample S, the relational expression or map can be shared among a plurality of samples of the same type.

In step S10, the stress-stimulated luminescent material ML is further arranged in a predetermined region on the surface of the sample S. In the example of FIG. 7, the stress-stimulated luminescent material ML has, for example, a rectangular shape having a size similar to that of a flexible sheet. The stress-stimulated luminescent material ML can be formed by applying a resin material containing the stress-stimulated luminescent material to a predetermined region on the surface of the sample S and drying it.

In step S20, the stress luminescence measurement process is executed. FIG. 10 is a flowchart illustrating a procedure of stress luminescence measurement processing. With reference to FIG. 10, first, the sample S is set in the holder 10 by step S21. The holder 10 is configured to support at least two points of the sample S. In the example of FIG. 2, the holder 10 grips the first end S1 and the second end S2 of the sample S facing each other.

In step S22, the first surface Sa of the sample S is irradiated with excitation light from the light source 30. By irradiating the stress-stimulated luminescent material ML arranged in a predetermined region of the first surface Sa of the sample S with excitation light, the stress-stimulated luminescent material ML is brought into an excited state (see FIG. 7A).

In step S23, the sample S is bent at a predetermined bending angle by driving the first driver 20 to move the holder 10 from the first holder position to the second holder position. At this time, a bending load is applied to the sample S and the stress-stimulated luminescent material ML. In the example of FIG. 2, the moving wall 3 of the holder 10 is moved relative to the fixed wall 2 by driving the actuator 21 included in the first driver 20. The sample S can be bent at a predetermined bending angle by reducing the distance between the first end portion S1 and the second end portion S2 of the sample S by moving the holder 10.

In step S24, the controller 50 acquires a mechanoluminescent image by capturing the light emitted from the stress-stimulated luminescent material ML on the first surface Sa of the sample S by the camera 40 at least at a predetermined bending angle (FIG. 7 (FIG. 7). B) See). FIG. 11 is a diagram schematically showing an example of a stress-stimulated luminescent image. In the stress-stimulated luminescence image 300, the intensity of luminescence intensity is expressed by brightness on a two-dimensional plane. In the stress-stimulated luminescence image 300, the intensity of luminescence may be represented by at least one of chromaticity, saturation, and lightness. In FIG. 11, the intensity of light emission is drawn by different hatching for convenience. Therefore, on the right side of the stress-stimulated luminescence image 300, a bar indicating the range of hatching assigned according to the luminescence intensity is shown.

As shown in FIG. 11, in the stress-stimulated luminescence image 300, the stress-stimulated luminescence pattern extends in the vertical direction (Y-axis direction) in the central portion (that is, the central portion of bending) in the lateral direction (X-axis direction) of the sample S. Appears in a band shape. This stress-stimulated luminescence pattern corresponds to the strain generated in the sample S. Therefore, by analyzing the stress-stimulated luminescence pattern, it is possible to visualize and quantify the two-dimensional stress distribution in a predetermined region of the sample S. Specifically, in the stress-stimulated luminescence pattern, a portion having a high emission intensity indicates a portion having a large strain, and a portion having a small emission intensity indicates a portion having a small strain.

In step S25, the controller 50 stores the mechanoluminescent image captured by the camera 40 in the memory 502 and displays it on the display 60 (see FIG. 2).

Returning to FIG. 9, in step S30, a process of specifying the inspection location of the sample S is executed. FIG. 12 is a flowchart illustrating the procedure of the inspection location specifying process. With reference to FIG. 12, first, in step S31, the captured image of the sample S is acquired by reading out the image data stored in the memory 502. The captured image includes a stress-stimulated luminescent image that captures the emission of the stress-stimulated luminescent material ML at at least a predetermined bending angle.

In step S32, a stress-stimulated luminescent image at a predetermined bending angle is extracted from the captured image of the sample S.

In step S33, ROI information for the extracted stress-stimulated luminescent image is acquired. The ROI can be set manually by a user (for example, an inspector) using the operation unit 240. In this case, ROI information is input to the controller 50 from the operation unit 24. Alternatively, the controller 50 can acquire ROI information by automatically setting the ROI based on the distribution of the emission intensity appearing in the stress-stimulated luminescent image.

For example, the part with the highest emission intensity (the part with the largest strain) in the stress-stimulated luminescence image can be set to ROI.

Alternatively, a stress-stimulated luminescent image when a bending load is applied to a normal flexible sheet is set in advance as a reference luminescence image, and a portion of the stress luminescence image of sample S whose emission intensity is different from that of the reference luminescence image is defined. It can be set to ROI. FIG. 13 is a flowchart illustrating a procedure as an example of a process for acquiring ROI information (S33 in FIG. 12).

With reference to FIG. 13, first, in step S330, a threshold range is set for the emission intensity distribution of the stress emission image based on the emission intensity distribution appearing in the reference emission image.

Next, in step S331, the emission intensity distribution is compared between the reference emission image and the stress emission image of the sample S. For each position in the stress-stimulated luminescence image, a deviation in luminescence intensity from the luminescence intensity at the corresponding position in the reference luminescence image is detected.

In step S332, it is determined whether or not the deviation of the luminescence intensity detected in step S331 is within the threshold range for each position in the stress luminescence image. If the deviation of the emission intensity exceeds the threshold range at any position in the stress-stimulated luminescence image (NO in S332), that position is set to ROI.

According to this, the portion where the emission intensity is increased or the portion where the emission intensity is decreased can be set as the ROI as compared with the emission intensity distribution in the reference emission image. When a local defect is generated by applying a bending load, the emission intensity is increased by concentrating the stress on the peripheral portion of the defect. Therefore, in the stress-stimulated luminescence image, the emission intensity distribution changes as compared with the reference luminescence image. In the example of FIG. 13, since the portion where the emission intensity changes beyond the threshold range with respect to the reference emission image is set in the ROI, the portion can be specified as the portion to be inspected. As a result, it becomes possible to pay attention to the defective portion and inspect it efficiently.

When the ROI is set in the stress-stimulated luminescent image, the inspection location of the sample S is specified by step S34. Specifically, the controller 50 has each position on the surface of the sample S and each position in the image captured by the camera 40, which is acquired in the process of preparing the sample S (S10 in FIG. 9) and stored in the memory 502. Use the correspondence with the position.

As shown in FIG. 11, each position R in the captured image is represented by coordinates (X, Y) on a two-dimensional plane consisting of an X axis and a Y axis. On the other hand, as shown in FIG. 13, each position P on the surface of the sample S can be represented by coordinates (X, Y) on a two-dimensional plane having one of the four corners of the sample S as the origin O.

In a state where the sample S is bent at a predetermined bending angle, the correspondence relationship can be obtained by specifying the position R in the captured image corresponding to each position P on the surface of the sample S. The obtained correspondence is stored in the memory 502 as a relational expression or a map. The controller 50 inspects the surface of the sample S based on the position R (X, Y) of the ROI in the stress-stimulated luminescent image by referring to the relational expression or map representing the correspondence stored in the memory 502. The position P (X, Y) of the place is calculated.

Returning to FIG. 12, in step S35, inspection location information for identifying the specified inspection location is generated, and the generated inspection location information is output. The inspection location information includes information indicating coordinates (X, Y) indicating the calculated position P of the inspection location. The controller 50 transmits data indicating inspection location information to the inspection device 200. Further, the controller 50 can display the inspection location information on the display 60.

Returning to FIG. 3, in step S40, the inspection location specified by the inspection location information is observed in the inspection device 200. Observation of the inspection site is performed using an observation device 210 (for example, a microscope or a camera). By observing the inspection site in detail, defects such as minute cracks generated inside the sample S can be detected.

[Other configuration examples]
(1) Inspection System In the above-described embodiment, a configuration example in which the inspection device 200 and the mechanoluminescence measuring device 100 are separated has been described, but the mechanoluminescence measuring device 100 and the inspection device 200 may be integrally configured. good.

FIG. 15 is a block diagram showing the configuration of the stress luminescence measuring device 100 according to the modified example of the present embodiment. With reference to FIG. 15, the mechanoluminescent measuring device 100 according to the modified example is the mechanoluminescent measuring device 100 shown in FIG. 2 with the camera 80 and the fourth driver 82 added. In the following, only the parts different from FIG. 2 will be described, and the common parts will not be repeated.

The camera 80 is configured to take an image of the inspection portion of the sample S in the inspection step (S40 in FIG. 9). The camera 80 includes an optical system such as a lens and an image pickup device. The optical system has a high-magnification lens capable of observing the inspection portion of the sample S in detail. The image pickup device generates an image pickup image by converting the light incident from the first surface Sa of the sample S via the optical system into an electric signal. The image data generated by the image pickup of the camera 80 is transmitted to the controller 50.

The fourth driver 82 is configured so that the focus position of the camera 80 can be changed. The fourth driver 82 moves the camera 80 so that its focus position is located at the inspection point of the sample S in response to a command received from the controller 50. Specifically, the controller 50 generates a control command for matching the focus position of the camera 80 with the position P (X, Y) of the inspection point on the surface of the sample S, and the generated control command is used as the fourth driver 82. Output to. The fourth driver 82 adjusts the focus position by moving the camera 80 according to the control command.

When the imaging of the inspection portion by the camera 80 is completed, the fourth driver 82 retracts the camera 80 from the surface of the sample S.

(2) Inspection point information In the above-described embodiment, a configuration example for generating data including coordinate information indicating the position of the inspection point of the sample S has been described as the inspection point information, but the form of the inspection point information is the data. Not limited.

For example, as shown in FIG. 16, a marking M such as a figure may be formed on the inspection portion on the surface of the sample S. The marking M may be configured to be manually performed by the user, or may be configured such that the marking M is automatically formed at the inspection location by controlling a marker device (not shown) by the controller 50.

According to this modified example, the inspection location can be easily specified by the marking M. Further, it is also possible to adopt a configuration in which the inspection device 200 automatically reads the marking M to adjust the observation field of view of the observation device 210. This makes it possible to carry out an efficient and appropriate inspection.

[Aspect]
It will be understood by those skilled in the art that the plurality of exemplary embodiments described above are specific examples of the following embodiments.

(Clause 1) The inspection method according to one embodiment includes a step of acquiring a stress-stimulated luminescent image when a sample containing a stress-stimulated luminescent material is deformed, a step of acquiring information on a region of interest of the stress-stimulated luminescent image, and a stress-stimulated luminescent image. It comprises a step of identifying an inspection site on the surface of the sample based on the position of the region of interest within, and a step of generating inspection site information for identifying the identified inspection site.

According to the inspection method described in paragraph 1, the inspection location on the sample surface is specified based on the stress-stimulated luminescent image when the sample is deformed, and inspection location information for identifying the identified inspection location is generated. Therefore, the inspection point can be easily specified without the need for the work of visually specifying the inspection point by the user. Further, since the inspection portion is specified based on the region of interest in the stress-stimulated luminescent image, the portion of the sample corresponding to the region of interest can be appropriately observed. As a result, the user can perform the inspection efficiently and appropriately.

Further, according to the above inspection method, the user can observe the two-dimensional stress distribution when the sample is deformed in a non-destructive state by using the stress luminescence image, and among the stress distributions. By observing the identified inspection site, the condition of the sample (local defects, etc.) can be inspected in detail. This allows the user to verify in chronological order the mechanism by which the sample is destroyed by the application of the load.

(Clause 2) In the inspection method described in paragraph 1, the step to specify is attention in the stress-stimulated luminescent image by referring to the correspondence between each position on the surface of the sample and each position in the stress-stimulated luminescent image. Includes the step of calculating the location of the inspection site on the surface of the sample based on the location of the region.

According to this, since the inspection point is specified at the position corresponding to the region of interest in the stress-stimulated luminescent image, the user can efficiently and appropriately observe the state of the sample in the region of interest.

(Clause 3) In the inspection method described in paragraph 1 or 2, the generated step includes, as inspection location information, a step of generating coordinate information indicating the position of the inspection location on the surface of the sample. The inspection method further comprises a step of outputting data indicating the generated coordinate information.

According to this, the inspection location can be easily identified by using the data indicating the inspection location information. In addition, the data can be used to efficiently observe the inspection site.

(Clause 4) In the inspection method according to paragraph 1 or 2, the generated step includes a step of forming a marking at the position of the inspection location on the surface of the sample as inspection location information.

According to this, the inspection location can be easily identified using the marking. In addition, the marking can be used to efficiently observe the inspection site.

(Clause 5) In the inspection method according to the first to fourth paragraphs, the setting step includes a step of setting a region of interest based on the distribution of the emission intensity in the stress-stimulated luminescent image.

According to this, since the inspection location is specified based on the distribution of emission intensity, it is possible to appropriately observe the portion where the stress is abnormal. As a result, the user can perform the inspection efficiently and appropriately.

(Clause 6) In the inspection method described in Section 5, the step to be set is a step of setting a region of interest based on the deviation of the emission intensity distribution in the stress-stimulated luminescent image with respect to the reference emission intensity distribution. include.

According to this, the part where the emission intensity is different from the reference emission intensity distribution is specified as the inspection point, so that the part where the stress is abnormal can be appropriately observed. As a result, the user can perform the inspection efficiently and appropriately.

(Section 7) The inspection method according to paragraphs 1 to 6 further includes a step of inspecting a sample by observing the inspection location specified by the inspection location information.

According to this, the user can observe the two-dimensional stress distribution when a load is applied to the sample in a non-destructive state by using the stress luminescence image, and the stress distribution is specified. By observing the inspection site, the condition of the sample (local defects, etc.) can be inspected in detail. As a result, the user can verify the mechanism by which the sample is destroyed by applying the load in chronological order.

(Section 8) In the inspection method described in paragraph 7, the step of inspection includes a step of observing the inspection site with a microscope.

According to this, the condition of the specified inspection site (local defects, etc.) can be inspected in detail.

(Section 9) In the inspection method described in paragraph 7, the inspection step includes a step of imaging the inspection site with a camera.

According to this, the condition of the specified inspection site (local defects, etc.) can be inspected in detail.

(Item 10) The inspection system according to one aspect includes a plurality of processors, a memory, and at least one program stored in the memory and executed by at least one processor among the plurality of processors. At least one program includes a step of acquiring a stress-stimulated luminescent image when a sample containing a stress-stimulated luminescent material is deformed, a step of acquiring information on a region of interest in the stress-stimulated luminescent image, and a step of acquiring information on the region of interest in the stress-stimulated luminescent image at the position of the region of interest in the stress-stimulated luminescent image. Based on this, at least one processor is made to perform a step of identifying the inspection location of the sample and a step of generating inspection location information for identifying the identified inspection location.

According to the inspection system described in Section 10, the inspection location on the sample surface is specified based on the stress-stimulated luminescent image when a load is applied to the sample, and inspection location information for identifying the identified inspection location is generated. Therefore, it is not necessary to visually identify the inspection location by the user, and the inspection location can be easily identified. Further, since the inspection portion is specified based on the region of interest in the stress-stimulated luminescent image, the portion of the sample corresponding to the region of interest can be appropriately observed. As a result, the user can perform the inspection efficiently and appropriately.

(Section 11) In the inspection system according to paragraph 10, at least one program causes at least one processor to perform a step of inspecting a sample by observing the inspection site specified by the inspection site information. ..

According to this, the user can observe the two-dimensional stress distribution when a load is applied to the sample in a non-destructive state by using the stress luminescence image, and the stress distribution is specified. By observing the inspection site, the condition of the sample (local defects, etc.) can be inspected in detail. As a result, the user can verify the mechanism by which the sample is destroyed by applying the load in chronological order.

(Section 12) The stress luminescence measuring device according to one aspect executes the inspection method according to paragraphs 1 to 9.

According to the stress luminescence measuring device according to Item 12, the inspection location on the sample surface is specified based on the stress luminescence image when a load is applied to the sample, and the inspection location information for identifying the identified inspection location is specified. Is generated, so that it is not necessary to visually identify the inspection location by the user, and the inspection location can be easily specified. Further, since the inspection portion is specified based on the region of interest in the stress-stimulated luminescent image, the portion of the sample corresponding to the region of interest can be appropriately observed. As a result, the user can perform the inspection efficiently and appropriately.

At the time of filing, it is not necessary to appropriately combine the configurations described in the embodiments with respect to the above-described embodiments and modifications, including combinations not mentioned in the specification, within a range that does not cause any inconvenience or contradiction. Scheduled from.

The embodiments disclosed this time should be considered to be exemplary in all respects and not restrictive. The scope of the present invention is shown by the scope of claims rather than the above description, and is intended to include all modifications within the meaning and scope of the claims.

1 frame, 2 fixed wall, 3 moving wall, 5, 6 mounting part, 7, 8 holding plate, 9 hinge, 10 holder, 12 leaf spring, 13 connection part, 14 rail, 15A, 15B slider, 16, 17 bar, 18 bracket, 20 1st driver, 21 actuator, 22, 23 top plate, 30 light source, 32 3rd driver, 40, 80 camera, 42 2nd driver, 50, 220 controller, 51 stress control unit, 52 light source control unit, 53 Imaging control unit, 54 Measurement control unit, 55 Data acquisition unit, 56 Data processing unit, 57 Storage unit, 58 Output unit, 60, 230 display, 70, 240 Operation unit, 82 4th driver, 100 Mechanoluminescence measuring device, 200 inspection device, 210 observation device, 222,501 processor, 224,502 memory, 226,503 input / output I / F, 228,504 communication I / F, 300 mechanoluminescent image, S sample, ML mechanoluminescent body.

Claims (12)

1. Steps to acquire a stress-stimulated luminescent image when a sample containing a stress-stimulated luminescent material is deformed,
   The step of acquiring information on the region of interest of the stress-stimulated luminescent image,
   A step of identifying an inspection site on the surface of the sample based on the position of the region of interest in the stress-stimulated image.
   An inspection method comprising a step of generating inspection location information for identifying the identified inspection location.
2. The identifying step is based on the position of the region of interest in the stress-stimulated image by referring to the correspondence between each position on the surface of the sample and each position in the stress-stimulated image. The inspection method according to claim 1, further comprising the step of calculating the position of the inspection site on the surface of the above.
3. The generation step includes, as the inspection location information, a step of generating coordinate information indicating the position of the inspection location on the surface of the sample.
   The inspection method according to claim 1 or 2, further comprising a step of outputting data indicating the generated coordinate information.
4. The inspection method according to claim 1 or 2, wherein the generated step includes, as the inspection location information, a step of forming a marking at the position of the inspection location on the surface of the sample.
5. The inspection method according to any one of claims 1 to 4, wherein the step to be set includes a step to set the region of interest based on the distribution of the emission intensity in the stress-stimulated luminescent image.
6. The inspection method according to claim 5, wherein the step to be set includes a step of setting the region of interest based on the deviation of the distribution of the emission intensity in the stress-stimulated luminescent image with respect to the distribution of the emission intensity as a reference.
7. The inspection method according to any one of claims 1 to 6, further comprising a step of inspecting the sample by observing the inspection location specified by the inspection location information.
8. The inspection method according to claim 7, wherein the inspection step includes a step of observing the inspection site with a microscope.
9. The inspection method according to claim 7, wherein the inspection step includes a step of photographing the inspection portion with a camera.
10. It ’s an inspection system,
    With multiple processors
    With memory
    It comprises at least one program stored in the memory and executed by at least one of the plurality of processors.
    The at least one program
    Steps to acquire a stress-stimulated luminescent image when a sample containing a stress-stimulated luminescent material is deformed,
    The step of acquiring information on the region of interest of the stress-stimulated luminescent image,
    A step of identifying the inspection site of the sample based on the position of the region of interest in the stress-stimulated luminescent image.
    An inspection system that causes at least one processor to perform a step of generating inspection location information for identifying the identified inspection location.
11. The at least one program
    10. The inspection system of claim 10, wherein by observing the inspection location identified by the inspection location information, the step of inspecting the sample is further performed by the at least one processor.
12. A stress luminescence measuring device that executes the inspection method according to any one of claims 1 to 9.

Images