WO2021253468A1

WO2021253468A1 - Ultra-thin miniature loudspeaker

Info

Publication number: WO2021253468A1
Application number: PCT/CN2020/097621
Authority: WO
Inventors: 袁智杰; 郑雷; 李园园
Original assignee: 声电电子科技(惠州)有限公司
Priority date: 2020-06-18
Filing date: 2020-06-23
Publication date: 2021-12-23
Also published as: CN212137924U

Abstract

Disclosed in the present utility model is an ultra-thin miniature loudspeaker. The outside of a voice coil is provided with two voice coil leads, the voice coil leads are arc-shaped and attached to a diaphragm, the voice coil leads each pass through a slot on a side surface of a support, and the other ends are welded to two first pads of a circuit assembly. A second pad is used for welding an earphone lead. The circuit assembly is attached to the outer edge of the support, and the height thereof is lower than the bottom part of the support. A circle of steps for the bonding of the diaphragm is located above a circular washer on the inner wall of the support. A cavity structure is formed between the diaphragm and the support. A protective cover is pasted above the diaphragm, and the center of the protective cover is provided with an opening hole. A T iron is located at the bottom part of a magnet, a through hole is opened in the middle of the T iron, and a screen is pasted at the center of the bottom part of the T iron. By means of compact structural design, an ultra-thin miniature speaker having a small volume is achieved, and the need to reduce the volume of a speaker due to too many components being placed in the internal space of TWS earphones is met, and at the same time, good acoustic performance is attained, thus meeting the needs of customers.

Description

An ultra-thin miniature speaker

Technical field

The utility model relates to the technical field of loudspeakers, in particular to an ultra-thin miniature loudspeaker.

Background technique

At present, TWS headsets on the market require miniaturization and intelligence. The headset contains electronic components such as ultra-thin micro speakers, independent back cavity, chips, batteries, microphones, and sensors. Only when the volume of these parts is small enough can the miniaturization of the headset be ensured.

The current ultra-thin micro speakers of the existing earphones are generally high in height, which makes the earphone design need to be larger in size. This kind of earphone is not conducive to wearing and also affects the aesthetics.

technical problem

The technical problem to be solved by the utility model is to overcome the existing defects and provide an ultra-thin miniature loudspeaker. A copper ring is pasted under the edge of the circular diaphragm, a voice coil is glued in the middle of the diaphragm, and two outside of the voice coil are provided. Voice coil lead. The voice coil lead is attached to the diaphragm in an arc shape. The voice coil lead passes through the notch on the side of the bracket. The other end is welded to the two first pads of the circuit assembly. The second pad is used for the earphone lead. Welding, the circuit components are attached to the outer edge of the bracket, and the height is lower than the bottom of the bracket. The inner wall of the bracket is above the circular washer. There is a step for the diaphragm to be attached, and a cavity is formed between the diaphragm and the bracket. Structure, the protective cover is attached to the top of the diaphragm, the center of the protective cover is provided with an opening, the T iron is located at the bottom of the magnet, and there is a through hole in the middle of the T iron. A small size, ultra-thin micro speaker, to meet the need to reduce the size of the speaker due to too many components in the internal space of the TWS headset, and also achieve good acoustic performance, meet customer needs, and can effectively solve the problem in the background technology. problem.

Technical solutions

In order to solve the above technical problems, the present utility model provides the following technical solutions:

The utility model provides an ultra-thin miniature speaker, which includes:

A stent, the stent has a blocking part;

Was, set up under the barrier;

The circuit component is arranged on the outer edge of the bracket;

A vibrating component, where the vibrating component is placed on the washer, so as to form a cavity structure between the vibrating component and the bracket;

A protective cover, the protective cover is pasted above the vibrating component, the center of the protective cover is provided with an opening, the connection part is located at the bottom of the magnet, a through hole is opened in the middle of the connection part, and the mesh cloth is pasted on the center of the bottom of the connection part;

A metal ring is pasted under the edge of the vibrating part (the metal ring can also be pasted above the edge of the vibrating part), a voice coil is pasted in the middle of the vibrating part, and two voice coil leads are arranged on the outside of the voice coil, and the voice coil leads are attached to the vibrating part. On the component, the voice coil lead passes through the notch on the side of the bracket, and the other end is welded to the two first pads of the circuit assembly, and the second pad is used for welding the earphone leads.

As a preferred solution, the voice coil lead wire is attached to the vibrating component in an arc shape.

As a preferred solution, the vibrating component is a diaphragm, the diaphragm is a dome composite material, the base material is PU, and the composite dome material is polyester film, LCP, paper, fiber materials, etc., through the combination of materials and shapes The design can achieve good acoustic performance.

As a preferred solution, the metal ring is a copper ring or a steel ring.

As a preferred solution, the connecting portion is T iron.

As a preferred solution, the barrier portion is a step.

As a preferred solution, the step and the bracket are integrally formed.

As a preferred solution, the bracket and the notch are integrally formed.

Beneficial effect

One or more technical solutions provided in the present utility model have at least the following technical effects or advantages:

There is a copper ring attached to the edge of the circular diaphragm, the middle of the diaphragm is glued with a voice coil, and two voice coil leads are arranged on the outside of the voice coil. The voice coil leads are attached to the diaphragm in an arc shape, and the voice coil leads pass through the side of the bracket. The other end of the notch is soldered to the two first pads of the circuit assembly. The second pad is used for welding the earphone leads. The circuit assembly is attached to the outer edge of the bracket, the height is lower than the bottom of the bracket, and the inner wall of the bracket is in a circle There is a circle of steps above the ring washer for the diaphragm to be attached to. A cavity structure is formed between the diaphragm and the support. The cover is attached to the top of the diaphragm. The center of the cover is provided with an opening. The T iron is located at the bottom of the magnet. , There is a through hole in the middle of the T iron, and the mesh is attached to the center of the bottom of the T iron. Through a compact structure design, a small ultra-thin micro speaker can be achieved. The volume of the corresponding earphone can also be reduced, and it can also achieve good The acoustic performance meets the needs of customers.

Description of the drawings

The accompanying drawings are used to provide a further understanding of the utility model and constitute a part of the specification. Together with the embodiments of the utility model, they are used to explain the utility model and do not constitute a limitation to the utility model.

In the attached picture:

Fig. 1 is an exploded view of the ultra-thin micro speaker in the embodiment of the present invention.

Figure 2 is a cross-sectional view of an ultra-thin micro speaker in an embodiment of the present invention.

Fig. 3 is a side view of the ultra-thin micro speaker in the embodiment of the present invention.

Fig. 4 is a top view of an ultra-thin micro speaker in an embodiment of the present invention.

Fig. 5 is a schematic diagram of a conventional PCB board in an ultra-thin micro speaker in an embodiment of the present invention.

Fig. 6 is a schematic diagram of an open-hole PCB board in an ultra-thin micro speaker in an embodiment of the present invention.

Fig. 7 is a schematic diagram of another open-hole PCB board in the ultra-thin micro speaker in the embodiment of the present invention.

Fig. 8 is a schematic diagram of another conventional PCB board in the ultra-thin miniature speaker in the embodiment of the present invention.

Fig. 9 is a schematic diagram of the shrapnel in the ultra-thin micro speaker in the embodiment of the present invention.

Fig. 10 is a schematic diagram of a PIN pin in an ultra-thin micro speaker in an embodiment of the present invention.

Fig. 11 is a schematic diagram of a double-sided PCB board in an ultra-thin micro speaker in an embodiment of the present invention.

Fig. 12 is a schematic diagram of another PIN pin of the ultra-thin micro speaker in the embodiment of the present invention.

Fig. 13 is a schematic diagram of the conventional PCB board in the ultra-thin micro speaker in the embodiment of the present invention attached to the surface of the bracket.

Fig. 14 is a schematic diagram of the perforated PCB board of the ultra-thin micro speaker in the embodiment of the present invention being attached to the surface of the bracket, and the fiberboard through holes are assembled and fixed with the pillars on the bracket.

Fig. 15 is another schematic diagram of the perforated PCB board of the ultra-thin micro speaker in the embodiment of the present invention being attached to the surface of the support, and the through holes of the fiberboard are assembled and fixed with the pillars on the support.

Fig. 16 is a schematic diagram of the conventional PCB board in the ultra-thin micro speaker in the embodiment of the present utility model attached to the surface of the bracket, and the oblique corners on both sides are used to match the position of the bracket.

Fig. 17 is a schematic diagram of the shrapnel molded in the bracket in the ultra-thin micro speaker in the embodiment of the present invention.

Fig. 18 is a schematic diagram of the PIN needle molded in the bracket in the ultra-thin micro speaker in the embodiment of the present invention.

Fig. 19 is a schematic diagram of the double-sided PCB board molded in the bracket in the ultra-thin micro speaker in the embodiment of the present invention.

FIG. 20 is a schematic diagram of another PIN needle molded in the bracket in the ultra-thin micro speaker in the embodiment of the present invention.

Figure 21, Figure 22 and Figure 23 are schematic diagrams showing how the voice coil lead of the ultra-thin miniature speaker in the embodiment of the present invention is attached to the diaphragm in an arc shape.

Figure 24, Figure 25 and Figure 26 are schematic diagrams of the ultra-thin micro-speaker in the embodiment of the utility model, the voice coil leads are drawn out in an arc-shaped symmetrical suspension.

Reference numbers in the figure: 1. Protective cover; 2. Vibration component; 3. Metal ring; 4. Voice coil; 5. Voice coil lead; 6. Bracket; 7. Circuit assembly; 8. First pad; 9. Second Pad; 10, washer; 11, magnet; 12, connection part; 13, mesh; 14, notch; 15, barrier part; 16, pad; 17, shrapnel; 18, PIN needle; 19, pass Hole; 20, oblique contact edge.

The best mode of the present invention

In order to make the purpose, technical solutions and advantages of the present utility model clearer, the following further describes the present utility model in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present utility model, and are not used to limit the present utility model.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

In the description of the present utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical" , "Horizontal", "Top", "Bottom", "Inner", "Outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description. It does not indicate or imply that the pointed device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more than two, unless specifically defined otherwise.

In order to better understand the above technical solutions, the above technical solutions will be described in detail below in conjunction with the drawings and specific implementations of the specification.

Examples:

Please refer to Figure 1-26. This embodiment provides an ultra-thin micro speaker, including:

A support 6 having a blocking portion 15 inside the support 6;

The washer 10 is placed under the barrier 15 which is a step, and the step and the bracket 6 are integrally formed;

The circuit component 7 is arranged on the outer edge of the bracket 6;

The vibrating component 2 is placed on the washer 10 to form a cavity structure between the vibrating component 2 and the support 6. The vibrating component 2 is a diaphragm, and the diaphragm is a dome composite material , The base material is PU, and the composite dome material is polyester film, LCP, paper, fiber materials, etc., through the combination of materials and the design of the shape, good acoustic performance can be achieved;

The protective cover 1, the protective cover 1 is pasted above the vibrating component 2, the protective cover 1 is provided with an opening 16 in the center, the connecting portion 12 is located at the bottom of the magnet 11, and the connecting portion 12 is provided with a through hole 17 in the middle. 13 is attached to the center of the bottom of the connecting portion 12, and the connecting portion 12 is a T iron;

A metal ring 3 is attached below the edge of the vibrating component 2. The metal ring 3 is a copper ring or a steel ring. A voice coil 4 is glued in the middle of the vibrating component 2. The voice coil lead 5 is attached to the vibrating component 2 in an arc shape, and the voice coil lead 5 is attached to the vibrating component 2. The voice coil lead 5 passes through the notch 14 on the side of the bracket 6, and the other end is welded to the circuit assembly 7 On the two first pads 8, the second pad 9 is used for welding earphone leads, and the bracket 6 and the notch 14 are integrally formed.

Please refer to Figure 5-20. The horn is an ultra-thin speaker. The contact connection of the horn can be a conventional circuit component as described above, but is not limited to a conventional circuit component. It can also be an open-hole circuit component (suitable for external Welded horn), where the through hole 19 on the fiberboard of the circuit component is used to assemble and fix the post on the bracket, and the through hole 17 on the pad of the circuit component (the inside of the hole is connected to the pad) is used to communicate with the headset through a PIN pin or FPC It can also be a double-sided circuit assembly, shrapnel, PIN pin (suitable for internal welding speakers), etc.

Embodiments of the present invention

In this embodiment, a copper ring is attached under the edge of the circular diaphragm, the voice coil 4 is attached to the middle of the diaphragm, and two voice coil leads 5 are arranged on the outside of the voice coil 4, and the voice coil leads 5 are attached in an arc shape. On the diaphragm 2, the voice coil lead 5 passes through the side notch 14 of the bracket 6, and the other end is welded to the two first pads 8 of the circuit assembly 7. The second pad 9 is used for welding the earphone leads, and the circuit assembly 7 is attached. Fitted to the outer edge of the support 6, the height is lower than the bottom of the support 6, the inner wall of the support 6 is above the circular washer 10, and there is a step for the diaphragm to be attached to, and a cavity is formed between the diaphragm and the support 6. The protective cover 1 is attached to the top of the diaphragm, the center of the protective cover 1 is provided with an opening 16, the T iron is located at the bottom of the magnet 11, the T iron is opened with a through hole 17 in the middle of the T iron, and the mesh 13 is attached to the center of the bottom of the T iron. The utility model achieves a small size and ultra-thin miniature speaker through a compact structure design, which meets the needs of the TWS headset to reduce the size of the speaker due to too many components in the internal space, and can also achieve good acoustic performance to satisfy customers Demand.

Please refer to Figure 13 to Figure 16, Figure 21 to Figure 23. The speaker is an ultra-thin speaker, and the voice coil lead wire can be drawn out on the diaphragm in an arc shape as described above, which is suitable for internal welding horns. As shown in Figure 17 to Figure 20, Figure 24 to Figure 26, the voice coil lead wire can also be drawn out in an arc-shaped symmetrical suspension, which is suitable for external welding horns.

Industrial applicability

Claims

An ultra-thin miniature speaker, which is characterized in that it includes:

A bracket (6), the bracket (6) has a blocking portion (15);

The washer (10) is set up under the barrier (15);

The circuit component (7) is arranged on the outer edge of the bracket (6);

A vibrating component (2), the vibrating component (2) is set up on the washer (10) to realize a cavity structure formed between the vibrating component (2) and the bracket (6);

A protective cover (1), the protective cover (1) is pasted above the vibrating component (2), an opening (16) is provided in the center of the protective cover (1), and the connecting portion (12) is located on the magnet (11) At the bottom, a through hole (17) is opened in the middle of the connecting part (12), and the mesh cloth (13) is attached to the center of the bottom of the connecting part (12);

A metal ring (3) is pasted under the edge of the vibrating part (2), a voice coil (4) is stuck in the middle of the vibrating part (2), and two voice coil leads (5) are provided on the outside of the voice coil (4). The coil lead (5) is attached to the vibrating component (2). The voice coil lead (5) passes through the notch (14) on the side of the bracket (6), and the other end is welded to the two first parts of the circuit assembly (7). On the bonding pad (8), the second bonding pad (9) is used for welding the earphone leads.
The ultra-thin micro speaker according to claim 1, wherein the voice coil lead (5) is attached to the vibrating component (2) in an arc shape.
The ultra-thin micro speaker according to claim 2, characterized in that: the vibrating component (2) is a diaphragm.
The ultra-thin micro speaker according to claim 1, wherein the metal ring (3) is a copper ring or a steel ring.
The ultra-thin micro speaker according to claim 1, wherein the connecting portion (12) is a T iron.
The ultra-thin micro speaker according to claim 5, characterized in that: the blocking portion (15) is a step.
The ultra-thin micro speaker according to claim 6, characterized in that: the step and the bracket (6) are integrally formed.
The ultra-thin micro speaker according to claim 1, wherein the bracket (6) and the notch (14) are integrally formed.